WO2017041221A1 - Methods for making an x-ray detector - Google Patents

Methods for making an x-ray detector Download PDF

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Publication number
WO2017041221A1
WO2017041221A1 PCT/CN2015/089103 CN2015089103W WO2017041221A1 WO 2017041221 A1 WO2017041221 A1 WO 2017041221A1 CN 2015089103 W CN2015089103 W CN 2015089103W WO 2017041221 A1 WO2017041221 A1 WO 2017041221A1
Authority
WO
WIPO (PCT)
Prior art keywords
ray
visible light
semiconductor
electrons
scintillators
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/089103
Other languages
French (fr)
Inventor
Peiyan CAO
Yurun LIU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xpectvision Technology Co Ltd
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Shenzhen Xpectvision Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xpectvision Technology Co Ltd filed Critical Shenzhen Xpectvision Technology Co Ltd
Priority to EP15903328.1A priority Critical patent/EP3347741B1/en
Priority to CN201580081798.XA priority patent/CN107923987B/en
Priority to PCT/CN2015/089103 priority patent/WO2017041221A1/en
Priority to US15/309,085 priority patent/US10007007B2/en
Priority to TW105126637A priority patent/TWI652499B/en
Publication of WO2017041221A1 publication Critical patent/WO2017041221A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/24Measuring radiation intensity with semiconductor detectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1895X-ray, gamma-ray or corpuscular radiation imagers of the hybrid type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/191Photoconductor image sensors
    • H10F39/195X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors

Definitions

  • the disclosure herein relates to X-ray detectors, particularly relates to methods for making semiconductor X-ray detectors.
  • X-ray detectors may be devices used to measure the flux, spatial distribution, spectrum or other properties of X-rays.
  • X-ray detectors may be used for many applications.
  • One important application is imaging.
  • X-ray imaging is a radiography technique and can be used to reveal the internal structure of a non-uniformly composed and opaque object such as the human body.
  • a photographic plate may be a glass plate with a coating of light-sensitive emulsion. Although photographic plates were replaced by photographic films, they may still be used in special situations due to the superior quality they offer and their extreme stability.
  • a photographic film may be a plastic film (e.g., a strip or sheet) with a coating of light-sensitive emulsion.
  • PSP plates photostimulable phosphor plates
  • a PSP plate may contain a phosphor material with color centers in its lattice.
  • electrons excited by X-ray are trapped in the color centers until they are stimulated by a laser beam scanning over the plate surface.
  • trapped excited electrons give off light, which is collected by a photomultiplier tube. The collected light is converted into a digital image.
  • PSP plates can be reused.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

An apparatus suitable for detecting X-ray, the apparatus comprising: a first substrate (122) comprising a plurality of first electric contacts (125); a first chip layer (110) comprising a plurality of first chips (189), wherein each of the first chips (189) comprises a first electrode and is bonded to the first substrate(122) such that the first electrode is electrically connected to at least one of the first electrical contacts (125); a second substrate(122) comprising a plurality of second electric contacts (125); and a second chip layer(110) comprising a plurality of second chips (189), wherein each of the second chips (189) comprises a second electrode and is bonded to the second substrate (122) such that the second electrode is electrically connected to at least one of the second electrical contacts (125), wherein the first chip layer (110) and the second chip layer (110) are bonded to each other such that at least two second chips (189) are bonded to a same first chip (189).

Description

Methods for Making an X-Ray Detector Technical Field
The disclosure herein relates to X-ray detectors, particularly relates to methods for making semiconductor X-ray detectors.
Background
X-ray detectors may be devices used to measure the flux, spatial distribution, spectrum or other properties of X-rays.
X-ray detectors may be used for many applications. One important application is imaging. X-ray imaging is a radiography technique and can be used to reveal the internal structure of a non-uniformly composed and opaque object such as the human body.
Early X-ray detectors for imaginginclude photographic plates and photographic films. A photographic plate may be a glass plate with a coating of light-sensitive emulsion. Although photographic plates were replaced by photographic films, they may still be used in special situations due to the superior quality they offer and their extreme stability. A photographic film may be a plastic film (e.g., a strip or sheet) with a coating of light-sensitive emulsion.
In the 1980s, photostimulable phosphor plates (PSP plates) became available. A PSP plate may contain a phosphor material with color centers in its lattice. When the PSP plate is exposed to X-ray, electrons excited by X-ray are trapped in the color centers until they are stimulated by a laser beam scanning over the plate surface. As the plate is scanned by laser, trapped excited electrons give off light, which is collected by a photomultiplier tube. The collected light is converted into a digital image. In contrast to photographic plates and photographic films, PSP plates can be reused.

Claims (1)

  1. Another kind of X-ray detectors are X-ray image intensifiers. Components of anX-ray image intensifier are usually sealed in a vacuum. In contrast to photographic plates, photographic films, and PSP plates, X-ray image intensifiers may produce real-time images, i.e., not requiring post-exposure processing to produce images. X-ray first hits an input phosphor (e.g., cesium iodide) and is converted to visible light. The visible light then hits a photocathode (e.g., a thin metal layer containing cesium and antimony compounds) and causes emission of electrons. The number of emitted electrons is proportional to the intensity of the incident X-ray. The emitted electrons are projected, through electron optics, onto an output phosphor and cause the output phosphor to produce a visible-light image.
    Scintillators operate somewhat similarly to X-ray image intensifiers in that scintillators (e.g., sodium iodide) absorb X-ray and emit visible light, which can then be detected by a suitable image sensor for visible light. In scintillators, the visible light spreads and scatters in all directions and thus reduces spatial resolution. Reducing the scintillator thickness helps to improve the spatial resolution but also reduces absorption of X-ray. A scintillator thus has to strike a compromise between absorption efficiency and resolution.
    Semiconductor X-ray detectors largely overcome this problem by a direct conversion of X-ray into electric signals. A semiconductor X-ray detector may include a semiconductor layer that absorbs X-ray in wavelengths of interest. When an X-ray photon is absorbed in the semiconductor layer, multiple charge carriers (e.g., electrons and holes) are generated and swept under an electric field towards electrical contacts on the semiconductor layer.
    Cumbersome heat management required in currently available semiconductor X-ray detectors
PCT/CN2015/089103 2015-09-08 2015-09-08 Methods for making an x-ray detector Ceased WO2017041221A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP15903328.1A EP3347741B1 (en) 2015-09-08 2015-09-08 Methods for making an x-ray detector
CN201580081798.XA CN107923987B (en) 2015-09-08 2015-09-08 Method for making an X-ray detector
PCT/CN2015/089103 WO2017041221A1 (en) 2015-09-08 2015-09-08 Methods for making an x-ray detector
US15/309,085 US10007007B2 (en) 2015-09-08 2015-09-08 Methods for making an X-ray detector
TW105126637A TWI652499B (en) 2015-09-08 2016-08-19 Method for making an X-ray detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/089103 WO2017041221A1 (en) 2015-09-08 2015-09-08 Methods for making an x-ray detector

Publications (1)

Publication Number Publication Date
WO2017041221A1 true WO2017041221A1 (en) 2017-03-16

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Country Status (5)

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US (1) US10007007B2 (en)
EP (1) EP3347741B1 (en)
CN (1) CN107923987B (en)
TW (1) TWI652499B (en)
WO (1) WO2017041221A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018191943A1 (en) * 2017-04-21 2018-10-25 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor radiation detector
CN110418981A (en) * 2017-04-01 2019-11-05 深圳帧观德芯科技有限公司 Portable radiation detector system

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6609314B2 (en) * 2014-11-06 2019-11-20 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー X-ray detector for medical diagnosis
EP3281041B1 (en) * 2015-04-07 2020-06-10 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor x-ray detector
CN108449982B (en) * 2015-08-27 2020-12-15 深圳帧观德芯科技有限公司 X-ray imaging with detectors capable of resolving photon energies
US10641911B2 (en) * 2015-12-02 2020-05-05 Shenzhen Xpectvision Technology Co., Ltd. Packaging methods of semiconductor X-ray detectors
US10840281B2 (en) 2015-12-08 2020-11-17 Taiwan Semiconductor Manufacturing Company Ltd. Imaging device
US10641912B1 (en) * 2016-06-15 2020-05-05 Triad National Security, Llc “4H” X-ray camera
WO2018006258A1 (en) * 2016-07-05 2018-01-11 Shenzhen Xpectvision Technology Co., Ltd. Bonding materials of dissimilar coefficients of thermal expansion
CN110537111B (en) * 2017-05-03 2024-02-02 深圳帧观德芯科技有限公司 How to make a radiation detector
WO2019080041A1 (en) * 2017-10-26 2019-05-02 Shenzhen Xpectvision Technology Co., Ltd. X-ray detector with cooling system
CN111279222B (en) * 2017-10-30 2023-07-28 深圳源光科技有限公司 LIDAR detector with high temporal resolution
IL278076B2 (en) * 2018-04-20 2025-08-01 Asml Netherlands Bv Selection of segment shape and pixel shape for high-speed detector with large active area
EP3821279B1 (en) * 2018-07-12 2025-08-20 Shenzhen Xpectvision Technology Co., Ltd. Method of making a radiation detector
CN112601985A (en) * 2018-09-07 2021-04-02 深圳帧观德芯科技有限公司 Radiation detector with sub-pixels operating in different modes
WO2021168732A1 (en) * 2020-02-27 2021-09-02 Shenzhen Genorivision Technology Co., Ltd. Radiation detectors with high pixel concentrations
DE102020001839B3 (en) * 2020-03-20 2021-09-23 Azur Space Solar Power Gmbh III-V semiconductor pixel x-ray detector
CN118339481A (en) * 2021-11-15 2024-07-12 深圳帧观德芯科技有限公司 Apparatus and method for X-ray fluorescence imaging
CN118215861A (en) * 2021-11-16 2024-06-18 深圳帧观德芯科技有限公司 Image sensor with layer shielding electronics
WO2023122921A1 (en) * 2021-12-28 2023-07-06 Shenzhen Xpectvision Technology Co., Ltd. Image sensors with small and thin integrated circuit chips

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002103391A1 (en) * 2001-06-19 2002-12-27 Direct Radiography Corp. Wide dynamic range digital imaging system and method
CN1675780A (en) * 2002-08-15 2005-09-28 地太科特技术有限公司 Packaging structure for imaging detectors
CN1947660A (en) * 2005-10-14 2007-04-18 通用电气公司 Module assembly for multi-tube core backlight lighting diode
CN101903802A (en) * 2007-12-20 2010-12-01 皇家飞利浦电子股份有限公司 Direct conversion detector
WO2013012809A1 (en) * 2011-07-15 2013-01-24 Brookhaven Science Associates, Llc Radiation detector modules based on multi-layer cross strip semiconductor detectors
CN103430533A (en) * 2011-02-16 2013-12-04 保罗·谢勒学院 Single photon counting detector system having improved counter architecture

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763002A (en) * 1979-03-22 1988-08-09 University Of Texas System Photon detector
US5245191A (en) 1992-04-14 1993-09-14 The Board Of Regents Of The University Of Arizona Semiconductor sensor for gamma-ray tomographic imaging system
US5389792A (en) 1993-01-04 1995-02-14 Grumman Aerospace Corporation Electron microprobe utilizing thermal detector arrays
US5886353A (en) * 1995-04-21 1999-03-23 Thermotrex Corporation Imaging device
US5994713A (en) * 1997-06-25 1999-11-30 Quantum Imaging Corp. Filmless photon imaging apparatus
US6107619A (en) * 1997-07-14 2000-08-22 California Institute Of Technology Delta-doped hybrid advanced detector for low energy particle detection
US6845184B1 (en) 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
CN1095596C (en) * 1999-10-29 2002-12-04 北京师范大学 Linear X-ray detector array with new structure and its detection method
US6653219B2 (en) * 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
US6800836B2 (en) * 2000-07-10 2004-10-05 Canon Kabushiki Kaisha Image pickup device, radiation image pickup device and image processing system
JP2002217444A (en) 2001-01-22 2002-08-02 Canon Inc Radiation detector
GB0103133D0 (en) * 2001-02-08 2001-03-28 Univ Glasgow Improvements on or relating to medical imaging
US6510195B1 (en) * 2001-07-18 2003-01-21 Koninklijke Philips Electronics, N.V. Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same
US7189971B2 (en) * 2002-02-15 2007-03-13 Oy Ajat Ltd Radiation imaging device and system
US7361881B2 (en) * 2002-03-13 2008-04-22 Oy Ajat Ltd Ganged detector pixel, photon/pulse counting radiation imaging device
JP3780996B2 (en) * 2002-10-11 2006-05-31 セイコーエプソン株式会社 Circuit board, mounting structure of semiconductor device with bump, mounting method of semiconductor device with bump, electro-optical device, and electronic device
JP4414646B2 (en) 2002-11-18 2010-02-10 浜松ホトニクス株式会社 Photodetector
JP2004362905A (en) 2003-06-04 2004-12-24 Nippon Telegr & Teleph Corp <Ntt> Method for producing electrolyte membrane for direct methanol fuel cell
US7634061B1 (en) * 2004-03-26 2009-12-15 Nova R & D, Inc. High resolution imaging system
KR100688501B1 (en) * 2004-09-10 2007-03-02 삼성전자주식회사 Stacked BOC Package with Mirroring Structure and Double-sided Mounted Memory Module
US20060289777A1 (en) 2005-06-29 2006-12-28 Wen Li Detector with electrically isolated pixels
US7456409B2 (en) 2005-07-28 2008-11-25 Carestream Health, Inc. Low noise image data capture for digital radiography
US7480362B2 (en) 2005-10-28 2009-01-20 Koninklijke Philips Electronics N.V. Method and apparatus for spectral computed tomography
GB0611620D0 (en) * 2006-06-12 2006-07-19 Radiation Watch Ltd Semi-conductor-based personal radiation location system
EP2041606B1 (en) 2006-07-10 2015-09-09 Koninklijke Philips N.V. Energy spectrum reconstruction
US8093101B2 (en) * 2006-11-14 2012-01-10 Taiyo Yuden Co., Ltd. Electronic device and method of fabricating the same
US8237128B2 (en) 2006-12-13 2012-08-07 Koninklijke Philips Electronics N.V. Apparatus, imaging device and method for counting X-ray photons
JP4734224B2 (en) 2006-12-18 2011-07-27 本田技研工業株式会社 Buffer layer thickness measurement method
WO2008093275A2 (en) 2007-02-01 2008-08-07 Koninklijke Philips Electronics N.V. Event sharing restoration for photon counting detectors
KR101537359B1 (en) * 2007-02-02 2015-07-16 넥스트림 써멀 솔루션즈, 인크. Methods of depositing epitaxial thermoelectric films having reduced crack and/or surface defect densities and related devices
JP5428131B2 (en) * 2007-02-09 2014-02-26 富士通株式会社 Observation device and void observation method
US7696483B2 (en) 2007-08-10 2010-04-13 General Electric Company High DQE photon counting detector using statistical recovery of pile-up events
EP2198324B1 (en) 2007-09-27 2016-01-06 Koninklijke Philips N.V. Processing electronics and method for determining a count result, and detector for an x-ray imaging device
JP2011521212A (en) 2008-04-30 2011-07-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Counting detector
CN101644780A (en) 2008-08-04 2010-02-10 北京大学 Scintillation crystal array detecting device
CA2650066A1 (en) 2009-01-16 2010-07-16 Karim S. Karim Photon counting and integrating pixel readout architecture with dynamic switching operation
JP2010237643A (en) 2009-03-09 2010-10-21 Fuji Xerox Co Ltd Display medium, writing device and display device
KR101234597B1 (en) * 2009-10-15 2013-02-22 한국전자통신연구원 method for bonding flip chip and structure at the same
JP5358509B2 (en) * 2010-04-15 2013-12-04 浜松ホトニクス株式会社 Radiation detector module
CN101862200B (en) 2010-05-12 2012-07-04 中国科学院上海应用物理研究所 Rapid X-ray fluorescence CT method
JP5208186B2 (en) 2010-11-26 2013-06-12 富士フイルム株式会社 Radiation image detection apparatus and drive control method thereof
KR101634252B1 (en) 2010-12-10 2016-07-08 삼성전자주식회사 Wafer-scale x-ray detector and method of manufacturing the same
KR101761817B1 (en) 2011-03-04 2017-07-26 삼성전자주식회사 Large-scale x-ray detector
JP5508340B2 (en) 2011-05-30 2014-05-28 富士フイルム株式会社 Radiation image detection apparatus and method for controlling radiation image detection apparatus
JP5875790B2 (en) 2011-07-07 2016-03-02 株式会社東芝 Photon counting type image detector, X-ray diagnostic apparatus, and X-ray computed tomography apparatus
WO2013015350A1 (en) 2011-07-26 2013-01-31 富士フイルム株式会社 Radiation imaging device and control method thereof, and radiation image detection device
US8796811B2 (en) * 2011-08-09 2014-08-05 Oracle International Corporation Hybrid substrateless device with enhanced tuning efficiency
FI124818B (en) * 2011-10-06 2015-02-13 Advacam Oy Hybrid pixel detector construction and a method for its manufacture
CN103975580B (en) 2011-12-09 2018-10-23 索尼半导体解决方案公司 Imaging device, electronic device, optical stimulated luminescence detection scanner and imaging method
JP5895504B2 (en) * 2011-12-15 2016-03-30 ソニー株式会社 Imaging panel and imaging processing system
JP2013142578A (en) 2012-01-10 2013-07-22 Shimadzu Corp Radiation detector
CN103296035B (en) 2012-02-29 2016-06-08 中国科学院微电子研究所 X-ray flat panel detector and manufacturing method thereof
BR112014031875A2 (en) * 2012-06-21 2017-06-27 Trophy manufacturing process of a semiconductor chip for a direct x-ray conversion detector, direct x-ray conversion detector, and radiological apparatus
DE102012213404B3 (en) 2012-07-31 2014-01-23 Siemens Aktiengesellschaft Method for temperature stabilization, X-ray detector and CT system
DE102012215041A1 (en) 2012-08-23 2014-02-27 Siemens Aktiengesellschaft Method for producing a semiconductor element of a direct-converting X-ray detector
DE102012215818A1 (en) 2012-09-06 2014-03-06 Siemens Aktiengesellschaft Radiation detector and method of making a radiation detector
KR101410736B1 (en) 2012-11-26 2014-06-24 한국전기연구원 Digital X-ray image detector using multi-layered structure with surface light source
KR20140132098A (en) 2013-05-07 2014-11-17 삼성전자주식회사 X-ray detector, x-ray imaging apparatus having the same and control method for the x-ray imaging apparatus
US9520439B2 (en) 2013-09-23 2016-12-13 Omnivision Technologies, Inc. X-ray and optical image sensor
US9299732B2 (en) * 2013-10-28 2016-03-29 Omnivision Technologies, Inc. Stacked chip SPAD image sensor
CN103715214A (en) 2013-12-02 2014-04-09 江苏龙信电子科技有限公司 Manufacture method of high-definition digital X-ray flat panel detector
US9767986B2 (en) * 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
KR102300121B1 (en) * 2014-10-06 2021-09-09 에스케이하이닉스 주식회사 Semiconductor device having through silicon via, semiconductor package including the same and the method for manufacturing semiconductor device
WO2016064374A1 (en) * 2014-10-20 2016-04-28 Analogic Corporation Detector unit for detector array of radiation imaging modality
EP3281041B1 (en) * 2015-04-07 2020-06-10 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor x-ray detector
WO2016208081A1 (en) * 2015-06-26 2016-12-29 ルネサスエレクトロニクス株式会社 Electronic device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002103391A1 (en) * 2001-06-19 2002-12-27 Direct Radiography Corp. Wide dynamic range digital imaging system and method
CN1675780A (en) * 2002-08-15 2005-09-28 地太科特技术有限公司 Packaging structure for imaging detectors
CN1947660A (en) * 2005-10-14 2007-04-18 通用电气公司 Module assembly for multi-tube core backlight lighting diode
CN101903802A (en) * 2007-12-20 2010-12-01 皇家飞利浦电子股份有限公司 Direct conversion detector
CN103430533A (en) * 2011-02-16 2013-12-04 保罗·谢勒学院 Single photon counting detector system having improved counter architecture
WO2013012809A1 (en) * 2011-07-15 2013-01-24 Brookhaven Science Associates, Llc Radiation detector modules based on multi-layer cross strip semiconductor detectors

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110418981A (en) * 2017-04-01 2019-11-05 深圳帧观德芯科技有限公司 Portable radiation detector system
CN110418981B (en) * 2017-04-01 2023-09-22 深圳帧观德芯科技有限公司 Portable Radiation Detector System
WO2018191943A1 (en) * 2017-04-21 2018-10-25 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor radiation detector
CN110494989A (en) * 2017-04-21 2019-11-22 深圳帧观德芯科技有限公司 Method of making a semiconductor radiation detector
US10833217B2 (en) 2017-04-21 2020-11-10 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor radiation detector
US11380812B2 (en) 2017-04-21 2022-07-05 Shenzhen Xpectvision Technology Co., Ltd. Methods of making semiconductor radiation detector

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