WO2017041498A1 - 防水封装结构及其一体成型处理工艺 - Google Patents

防水封装结构及其一体成型处理工艺 Download PDF

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Publication number
WO2017041498A1
WO2017041498A1 PCT/CN2016/081274 CN2016081274W WO2017041498A1 WO 2017041498 A1 WO2017041498 A1 WO 2017041498A1 CN 2016081274 W CN2016081274 W CN 2016081274W WO 2017041498 A1 WO2017041498 A1 WO 2017041498A1
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WIPO (PCT)
Prior art keywords
transparent cover
cover sheet
upper module
step surface
package structure
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PCT/CN2016/081274
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English (en)
French (fr)
Inventor
李峰
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Individual
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Individual
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Priority to EP16813213.2A priority Critical patent/EP3352230A4/en
Priority to KR1020167027456A priority patent/KR101938302B1/ko
Priority to JP2016559998A priority patent/JP6233762B2/ja
Priority to US15/310,794 priority patent/US20190086069A1/en
Publication of WO2017041498A1 publication Critical patent/WO2017041498A1/zh
Anticipated expiration legal-status Critical
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/04—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for waterways
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the technical field of high-waterproof and anti-infiltration LED lighting lamp packaging, in particular to a process for processing an LED lighting lamp package and a package structure which are resistant to external high-pressure waterproof and impervious in a high-voltage environment.
  • the packaging system of the invention is mainly for the high-proof waterproofing of the LED lamp for illumination, not only can ensure the internal sealing performance under normal temperature and normal pressure, but also can be applied to the environment of deep water and high water pressure.
  • this degree of sealing is not suitable for sealing waterproof and impervious in deep water high pressure environment, because in a high water pressure environment, it is simple to open a waterproof groove on the contact surface and a waterproof rubber ring in the waterproof groove. The structure is unable to withstand the strong pressure of the outside world. In the deep water high pressure strong environment, the passive water seepage occurs, resulting in seal failure.
  • the invention seals and packages the flat-type planar light source structure.
  • the LED lamp of this type has a rectangular shape and a rectangular shallow groove therein, and the light source and the chip are encapsulated in the front and rear covers, and the surface is covered by the transparent cover member to emit light.
  • the invention designs the package casing and the package structure as a whole for the above special cases, and proposes an integrated molding technology to carry out multi-channel waterproof packaging, which brings a high sealing effect.
  • the waterproof package structure of the present invention comprises a transparent cover sheet, a mesh, and a T-shaped sealing rubber ring;
  • a sealing groove is arranged at the interface between the surface and the partitioning unit, and a rectangular T-shaped sealing ring is arranged at the sealing groove, and the cross-sectional shape of the rubber ring is T-shaped; on the T-shaped sealing rubber ring, a third step is arranged On the edge of the face, a transparent cover sheet is placed, and a profiled sealant is directly injection molded between the gap between the T-shaped sealant ring and the end face of the transparent cover sheet on the second step surface.
  • the T-shaped sealing apron includes a flat plate portion and a support portion, and the upper flat plate portion supports the transparent cover sheet; the lower support portion is inserted into the sealing groove.
  • the profiled sealant comprises an integrally formed outer seal portion, a middle seam portion and a bottom support portion formed on the T-shaped sealant ring, the lower surface of the transparent cover sheet and the third step surface; the middle seam portion is formed in a transparent The end surface of the cover sheet, the second and third step faces of the mesh are connected between the side walls; the outer seal portion is formed on the second step surface and the upper surface of the transparent cover sheet.
  • the integrated molding process of the packaging system adopts the lower base and the upper module bracket to inject the transparent cover sheet, the mesh and the T-shaped sealing apron, wherein the lower base functions as a direct fixed placement grid;
  • the grid comprises a central dividing unit and a peripheral step supporting surface, the outermost first step surface is an exposed surface, and the second step surface is a sealing surface, the third step surface is flush with the dividing unit; a sealing groove is formed at a junction of the third step surface and the partition unit;
  • the entire casting process is done under vacuum: the grid is placed on the lower base; the T-ring is applied to the sealing groove of the opposing grid; the combination of the transparent cover and the upper module support is automated. Assembling onto the grid, the transparent cover sheet is placed on the flat portion of the T-shaped sealing ring; the upper module bracket cover is pressed against the transparent cover sheet and the grid; the upper module bracket is provided with a through-hole; through the pouring The liquid silicone gel is poured into the mouth, placed in a smooth place, heated and baked, and then solidified and formed, and taken out from the upper module holder and the lower base.
  • a pair of pouring ports are arranged on the upper module bracket, and the lower end of the pouring port is designed to be ⁇ 2.0mm, the shape is a bell mouth shape, the taper is 5 degrees, and two overflow ports are opened on the opposite side of the pouring port for observing whether the filling is full Cavity.
  • the middle of the upper module bracket is hollow and the edge is a rectangular frame structure, and the rectangular frame of the upper module bracket covers the seam of the transparent cover sheet and the grid.
  • the upper module bracket comprises a body, and a heating rod hole is arranged on the upper module body, and the heating rod is inserted into the heating rod hole for heating baking.
  • the transparent cover sheet is a transparent substrate of a pre-formed film
  • the pre-formed film is a pre-formed optically permeable film on a transparent substrate
  • the transparent substrate refers to sapphire, acrylic or optical glass.
  • the invention aims at the technical problem of how to waterproof and seal the LED lighting lamp in the deep water high pressure environment, adopts the sealing and injection molding integrated molding technology, and seals the transparent cover sheet and the grid for separating the LED light emitting chip under vacuum conditions, and adopts the same.
  • the T-type sealing rubber ring and the injection molding into the special-shaped sealing rubber make the gap between the two parts form an integral sealing system as a whole. This structure completely solves the problem that the sealing method still has water seepage gap, and the sealing effect is good. High-grade seals can still be maintained in deep water and high pressure environments.
  • Figure 1 is an overall cross-sectional view of a waterproof package structure of the present invention
  • Figure 2 is a partially enlarged schematic view showing a portion A of Figure 1 of the present invention
  • FIG. 3 is a structural view of a process of the waterproof package structure of the present invention.
  • Figure 4 is a cross-sectional view showing the overall process of the waterproof package structure of the present invention.
  • Figure 5 is a partially enlarged schematic view showing a portion B of Figure 4 of the present invention.
  • waterproof packaging structure of the present invention will be described below in conjunction with the drawings and specific embodiments of the present invention, and the integrated molding process for completing the waterproof packaging structure will be further described in detail in conjunction with the mold drawing.
  • the water package structure includes a transparent cover sheet 10, a mesh 20 and a T-shaped sealing ring 30.
  • the T-shaped sealing rubber ring 30 is directly attached to the grid, and the transparent cover sheet is directly pressed on the T-shaped sealing rubber ring, which is placed over the grid, and is formed by a transparent cover sheet, a T-shaped sealing rubber ring and a mesh.
  • the sealed space that is, a waterproof sealing system that can accommodate the heat transfer oil inside the mesh body.
  • the grid 20 includes the grid including a central dividing unit 24 and peripheral stepped seating surfaces 21, 22, 23, the central dividing unit being the structure corresponding to the subsequently assembled light source chip portion, and the surrounding stepped supporting surface It is a structure that functions to fix and encapsulate the transparent cover sheet 10.
  • the step supporting surface includes a first step surface 21, a second step surface 22 and a third step surface 23, the outermost first step surface 21 is an exposed surface, and the second step surface 22 is a sealing surface.
  • the third step surface 23 is flush with the partitioning unit, and the third step surface is substantially the same plane as the partitioning unit 24.
  • the partitioning unit that divides the third step surface and the mesh is a sealing groove 25, and a sealing groove 25 is provided at the boundary between the third step surface of the mesh and the partitioning unit, and the T-shaped sealing rubber ring is correspondingly fitted.
  • the rectangular T-shaped sealing ring 30 has a T-shaped cross section.
  • the T-shaped sealing ring 30 includes a flat plate portion 31 and a support portion 32, and the upper flat plate portion 31 supports the transparent cover sheet 10; the lower support portion 32 is inserted into the sealing groove 25.
  • the third step surface edge is aligned, and the transparent cover sheet 10 is placed.
  • the gap between the T-shaped sealing ring 30 and the end surface of the transparent cover sheet 10 is Direct injection molding of the shaped sealant 40.
  • the profiled seal 40 includes an integrally formed outer seal portion 41, a middle slit portion 42 and a bottom portion 43 formed on the T-shaped seal ring 30, the lower surface of the transparent cover sheet 10, and the third step surface 23
  • the intermediate portion 42 is formed between the end surface of the transparent cover sheet 10 and the second and third stepped surface connecting sidewalls; the outer sealing portion 43 is formed on the second step surface and the upper surface of the transparent cover sheet 10.
  • the profiled sealant 40 is injection molded. After curing, it not only fills the entire gap, but also firmly adheres to the contact surface. It not only integrates itself but firmly bonds the peripheral components into a monolithic structural member.
  • the integrated molding process of the waterproof package structure is as follows: In this integral molding process, an auxiliary mold is required: the lower base and the upper module bracket. The two parts serve to fix, position, stabilize, and compact the transparent cover sheet 10 and the mesh portion 20 that need to be injection molded.
  • the grid comprises a central dividing unit and a peripheral step supporting surface, the outermost first step surface is an exposed surface, and the second step surface is a sealing surface, the third step surface is flush with the dividing unit; a sealing groove is formed at a junction of the third step surface and the partition unit;
  • the entire casting process is completed under vacuum conditions: the grid is placed on the lower base 201.
  • the lower base 201 adopts an intermediate hollow, and only retains the structure of the surrounding support edge because it is only partially Contact is the support, it is easier to control the flatness, while maintaining the flatness in the case of large-area contact will increase the difficulty of making the mold. Positioning is more convenient. Of course, if necessary, it can be completely designed that the lower part is only a grooved base structure.
  • the sealing groove 25 of the T-shaped sealing ring 30 opposed to the grid 20 is clamped; the combination of the transparent cover sheet 10 and the upper module holder 202 is assembled to the mesh 20 by an automated device, and the transparent cover sheet 10 is placed to the T-shape.
  • the flat portion of the sealing rubber ring; according to the relationship between the mesh and the transparent cover sheet, the side of the third step of the mesh 20 is the space for accommodating the transparent cover sheet, so the transparent cover sheet 10 should be
  • the size and shape are adapted to the accommodation space, and the card can be installed in a form capable of maintaining a uniform injection gap.
  • the upper module bracket 202 has a positioning protrusion corresponding to the positioning groove of the mesh 20, and the transparent cover sheet 10 is accurately placed by the docking and matching of the positioning protrusion and the positioning groove.
  • the flat portion of the T-shaped sealing ring 30 is placed with a proper gap between the transparent cover sheet 10 and the surrounding mesh.
  • the upper module bracket 202 is pressed against the transparent cover sheet 10 and the mesh 20; similar to the principle of the lower base, the upper module bracket 202 can also be designed as a hollow rectangular shape at the middle, and the edge is a rectangular frame structure, as long as the upper module bracket is allowed
  • the rectangular frame of 202 can correspond exactly to the seam covering the transparent cover sheet 10 and the mesh 20.
  • the upper module bracket 202 is provided with a through pouring opening 203.
  • the lower end of the pouring opening 203 is designed to be ⁇ 2.0mm, the shape is a bell mouth shape, the taper is 5 degrees, and two overflow ports are opened on the opposite side of the pouring port 203. 204, for observing whether the cavity is filled.
  • the upper module bracket 202 includes a body, and a heating rod hole 205 is disposed on the upper module body, and the heating rod is inserted The heater rod hole 205 is inserted into the heating rod hole 205, and the heating rod is heated to bake the package structure filled with the liquid glue.
  • the temperature is from 60 ° C to 120 ° C, and baked for 10 minutes until it is solidified and formed, and taken out from the upper module holder and the lower base.
  • the transparent cover sheet is a transparent substrate of a pre-formed film
  • the pre-formed film is a pre-formed optically permeable film on a transparent substrate
  • the transparent substrate refers to sapphire, acrylic or optical glass.
  • the invention aims at the technical problem of how to waterproof and seal the LED lighting lamp in the deep water high pressure environment, adopts the sealing and injection molding integrated molding technology, and seals the transparent cover sheet and the grid for separating the LED light emitting chip under vacuum conditions, and adopts the same.
  • the T-type sealing rubber ring and the injection molding into the special-shaped sealing rubber make the gap between the two parts form an integral sealing system as a whole. This structure completely solves the problem that the sealing method still has water seepage gap, and the sealing effect is good. High-grade seals can still be maintained in deep water and high pressure environments.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

一种防水封装结构包括透明盖片（10）、网格（20）和T型密封胶圈（30），该网格（20）包括中间的分隔单元（24）以及周边的阶梯承托面；在网格（20）的密封槽（25）处设置了矩形的T型密封胶圈（30）；在该T型密封胶圈（30）上放置了透明盖片（10），在T型密封胶圈（30）和透明盖片（10）端面之间的缝隙之间直接注塑成型异型封胶（40）。

Description

防水封装结构及其一体成型处理工艺 【技术领域】
本发明涉及高度防水防渗透的LED照明灯封装技术领域，尤其涉及需要在高压环境下抗外界高压防水防渗透的LED照明灯封装外壳以及封装结构的处理工艺。
【背景技术】
本发明的封装体系主要是针对照明的LED灯进行高度防水，不仅在常温常压下能够保证内部的密封性能，而且可以适用深水高水压的环境下。
现有技术中LED照明灯外壳多数采用螺丝进行安装紧固，采用的防水手段之一就是用冷凝胶整个胶封PCB板和线路板的部分，是一种局部密封的手段；另一种则是在外壳安装接缝处加设密封胶圈，适用于户外照明LED灯，只要防止雨水、雾气带来的水分渗透即可。
但是这种程度的密封不太适合在深水高压环境下的密封防水防渗透，因为在高水压的环境下，简单的通过在接触面开设防水凹槽，并在防水凹槽内设置防水胶圈的结构是无法抵抗外界强大的压力。在深水高压强环境下溃败，发生被动渗水，而导致密封失效。
本发明针对平板式的平面光源结构进行密封以及封装，这类结构的LED灯外形为矩形，内设矩形浅槽，将发光源以及芯片封装在前后盖内，表面通过透明盖件覆盖，发光。
【发明内容】
本发明针对以上种种特殊情况而对封装外壳以及封装结构进行整体设计，提出了一种一体成型技术对整个进行多道防水封装，带来了高度密封效果。
本发明所涉及防水封装结构包括透明盖片、网格、T型密封胶圈；该网格包 括中央的分隔单元和周边的阶梯承托面，最外围的第一阶梯面是外露表面，而第二阶梯面是封胶面，第三阶梯面与分隔单元平齐；在网格第三阶梯面与分隔单元交界处设有一道密封槽，该密封槽处设置了矩形的T型密封胶圈，该胶圈的截面形状为T形；在该T型密封胶圈上，齐着第三阶梯面边缘，放置了透明盖片，在第二阶梯面上、T型密封胶圈和透明盖片端面之间的缝隙之间直接注塑成型异型封胶。
T型密封胶圈包括平板部和支撑部，上面平板部承托透明盖片；下面的支撑部插入卡紧到密封槽内。
该异形封胶包括一体成型的外封部、中缝部以及底托部，该底托部成型于T型密封胶圈、透明盖片下表面以及第三阶梯面之间；该中缝部成型于透明盖片的端面、网格第二、第三阶梯面连接侧壁之间；该外封部成型于第二阶梯面和透明盖片上表面。
封装体系一体成型处理工艺，采用了下底座和上模块支架对透明盖片、网格和T型密封胶圈进行了注塑，其中下底座起到直接固定放置网格的作用；
该网格包括中央的分隔单元和周边的阶梯承托面，最外围的第一阶梯面是外露表面，而第二阶梯面是封胶面，第三阶梯面与分隔单元平齐；在网格第三阶梯面与分隔单元交界处设有一道密封槽；
整个浇注过程都在真空条件下完成：将网格对准放置在下底座上；将T型密封胶圈对置网格的密封槽安装卡紧；采用自动化设备将透明盖片和上模块支架的组合装配到网格上，透明盖片放置到T型密封胶圈的平板部上；而上模块支架盖压在透明盖片与网格上；在上模块支架上设有贯通的浇注口；通过浇注口往内灌注液态硅胶，平稳放置、加热烘烤，待其固化成型，从上模块支架和下底座内取出。
在上模块支架上设有一对浇注口，浇注口下端直经设计为Ф2.0mm，形状为喇叭口形，锥度为5度，在浇注口对侧开二个溢胶口，用于观察是否注满型腔。
上模块支架中间镂空为矩形，边缘为矩形框结构，上模块支架的矩形框对应覆盖住透明盖片和网格的接缝处。
上模块支架包括本体，在上模块本体上设有加热棒孔，加热棒插入到加热棒孔内进行加热烘烤。
透明盖片是预制覆膜的透明基材，预制覆膜是在透明基材上预制光学透过膜，透明基材是指蓝宝石、亚克力或光学玻璃。
本发明针对深水高压环境下如何对LED照明灯进行防水密封的技术问题，采用了封胶注塑一体成型技术，在真空条件对透明盖片以及用于分隔LED发光芯片的网格进行密封，同时采用了T型密封胶圈和注塑成异型封胶，让两个部分之间的空隙整体形成一体式的密封体系，这种结构完全解决了其他密封方式仍会存在渗水缝隙的问题，密封效果好、深水高压环境下仍可保持高等级密封。
【附图说明】
图1是本发明防水封装结构的整体剖视图；
图2是本发明附图1中的A局部放大示意图；
图3是本发明防水封装结构的处理工艺结构图；
图4是本发明防水封装结构的处理工艺整体剖视图；
图5是本发明附图4中B局部放大示意图；
其中：10、透明盖片；20、网格；21、第一阶梯面；22、第二阶梯面；23、第三阶梯面；24、分隔单元；25、密封槽；30、T型密封胶圈；31、平板部；32、支撑部；40、异形封胶；41、外封部；42、中缝部；43、底托部；。
201、下底座；202、上模块支架；203、浇注口；204、溢胶口；205、加热棒孔。
【具体实施方式】
下面将结合本发明附图和具体实施方式对本发明的防水封装结构进行说明，同时结合模具图对完成防水封装结构的一体成型处理工艺进行进一步的详细说明。
请参考附图1：其中示出了防水封装结构完成后的结构，可以从图中看到防 水封装结构包括了透明盖片10、网格20和T型密封胶圈30。实际上T型密封胶圈30直接加装在网格上而透明盖片直接压在T型密封胶圈上，盖设在网格上方，通过透明盖片、T型密封胶圈以及网格构成密封空间，即构成以网格为主体的内部可以容纳导热油的一个防水密封体系。
该网格20包括该网格包括中央的分隔单元24和周边的阶梯承托面21、22、23，中央的分隔单元是对应后续组装的光源芯片部分的结构，而周围的阶梯承托面则是起到固定、封装透明盖片10作用的结构。
请参考附图2：阶梯承托面包含第一阶梯面21、第二阶梯面22和第三阶梯面23，最外围的第一阶梯面21是外露表面，而第二阶梯面22是封胶面，第三阶梯面23与分隔单元平齐，则第三阶梯面实际上与分隔单元24是同一个平面。
而处于分割第三阶梯面和网格的分隔单元的则是密封槽25，在网格第三阶梯面与分隔单元交界处设有一道密封槽25，而T型密封胶圈则是对应卡装在该密封槽25内。该矩形的T型密封胶圈30，其截面形状为T形。T型密封胶圈30包括平板部31和支撑部32，上面平板部31承托透明盖片10；下面的支撑部32插入卡紧到密封槽25内。
在该T型密封胶圈30上，齐着第三阶梯面边缘，放置了透明盖片10，在第二阶梯面22上、T型密封胶圈30和透明盖片10端面之间的缝隙之间直接注塑成型异型封胶40。
该异形封胶40包括一体成型的外封部41、中缝部42以及底托部43，该底托部43成型于T型密封胶圈30、透明盖片10下表面以及第三阶梯面23之间；该中缝部42成型于透明盖片10的端面、网格第二、第三阶梯面连接侧壁之间；该外封部43成型于第二阶梯面和透明盖片10上表面。异形封胶40是采用注塑成型，固化后不仅填满整个空隙，并且牢牢地附着在接触表面，不仅自身是一体化并且牢固粘合周边组件，成为一个整体结构件。
请参考附图3，制成这个防水封装结构的一体成型处理工艺，基本过程如下：在这个一体成型过程中，需要采用辅助模具：下底座和上模块支架。这两个部分的起到固定、定位、稳定、压紧需要注塑的透明盖片10、网格20部分。
该网格包括中央的分隔单元和周边的阶梯承托面，最外围的第一阶梯面是外露表面，而第二阶梯面是封胶面，第三阶梯面与分隔单元平齐；在网格第三阶梯面与分隔单元交界处设有一道密封槽；
整个浇注过程都在真空条件下完成：将网格对准放置在下底座201上，在本实施例中，下底座201采用了中间掏空，仅保留四周支承围边的结构，是因为仅以局部接触为承托，比较容易控制平面度，而大面积接触的情况下要保持平面度则会提高制作模具的难度。定位更加方便。当然如果有必要也完全可以设计为下部仅仅是有凹槽的底座结构。
将T型密封胶圈30对置网格20的密封槽25安装卡紧；采用自动化设备将透明盖片10和上模块支架202的组合装配到网格20上，透明盖片10放置到T型密封胶圈的平板部上；按照网格和透明盖片的关系来说，从结构上，网格20的第三阶梯的侧面就是容纳透明盖片的空间，所以透明盖片10应该是以与大小形状与容纳空间相适应，且能够保持一个均匀注胶间隙的的形式安装卡进去。
同时，我们注意到上模块支架202上具有定位凸起，该定位凸起对应网格20的定位凹槽，通过定位凸起与定位凹槽的对接和契合，准确地将透明盖片10放置到T型密封胶圈30的平板部上，且让透明盖片10与四周的网格保持适当的间隙。
而上模块支架202盖压在透明盖片10与网格20上；跟下底座相似的原理，上模块支架202也可以设计为中间镂空矩形形状，边缘为矩形框的结构，只要让上模块支架202的矩形框能够完全对应覆盖住透明盖片10和网格20的接缝处。
而在上模块支架202上设有贯通的浇注口203，该浇注口203下端直经设计为Ф2.0mm，形状为喇叭口形，锥度为5度，在浇注口203对侧开二个溢胶口204，用于观察是否注满型腔。
一旦观察到溢胶口开始溢出液态胶，则意味着内部已经完全灌注完毕，停止灌胶，保持整体平稳静置。
上模块支架202包括本体，在上模块本体上设有加热棒孔205，将加热棒插 入到加热棒孔205内，并通电，加热棒发热对灌注了液态胶的封装结构进行加热烘烤。
温度为60℃～120℃，烘烤10min，直到待其固化成型，从上模块支架和下底座内取出。
透明盖片是预制覆膜的透明基材，预制覆膜是在透明基材上预制光学透过膜，透明基材是指蓝宝石、亚克力或光学玻璃。
本发明针对深水高压环境下如何对LED照明灯进行防水密封的技术问题，采用了封胶注塑一体成型技术，在真空条件对透明盖片以及用于分隔LED发光芯片的网格进行密封，同时采用了T型密封胶圈和注塑成异型封胶，让两个部分之间的空隙整体形成一体式的密封体系，这种结构完全解决了其他密封方式仍会存在渗水缝隙的问题，密封效果好、深水高压环境下仍可保持高等级密封。
以上所述，仅是本发明较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容做出些许变更或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明技术是指对以上实施例所作的任何简单修改、等同变化与修饰，均属于本发明技术方案的范围内。

Claims (8)

  1. 一种防水封装结构，该封装结构包括透明盖片、网格和T型密封胶圈，其特征在于，该网格包括中间的分隔单元以及周边的阶梯承托面，最外围的第一阶梯面是外露表面，而第二阶梯面是封胶面，第三阶梯面与分隔单元平齐；在网格第三阶梯面与分隔单元交界处设有一道密封槽，该密封槽处设置了矩形的T型密封胶圈，该胶圈的截面形状为T形；在该T型密封胶圈上，齐着第三阶梯面边缘，放置了透明盖片，在第二阶梯面上、T型密封胶圈和透明盖片端面之间的缝隙之间直接注塑成型异型封胶。
  2. 根据权利要求1所述防水封装结构，其特征在于，T型密封胶圈包括平板部和支撑部，上面平板部承托透明盖片；下面的支撑部插入卡紧到密封槽内。
  3. 根据权利要求1所述防水封装结构，其特征在于，该异形封胶包括一体成型的外封部、中缝部以及底托部，该底托部成型于T型密封胶圈、透明盖片下表面以及第三阶梯面之间；该中缝部成型于透明盖片的端面、网格第二、第三阶梯面连接侧壁之间；该外封部成型于第二阶梯面和透明盖片上表面。
  4. 根据权利要求2所述防水封装结构的一体成型处理工艺，采用了下底座和上模块支架对透明盖片、网格和T型密封胶圈进行了注塑，其中下底座起到直接固定放置网格的作用；整个浇注过程都在真空条件下完成：将网格对准放置在下底座上；将T型密封胶圈对置网格的密封槽安装卡紧；采用自动化设备将透明盖片和上模块支架的组合装配到网格上，透明盖片放置到T型密封胶圈的平板部上；而上模块支架盖压在透明盖片与网格上；在上模块支架上设有贯通的浇注口；通过浇注口往内灌注液态硅胶，平稳放置、加热烘烤，待其固化成型，从上模块支架和下底座内取出。
  5. 根据权利要求4所述防水封装结构的一体成型处理工艺，其特征在于，在上模块支架上设有一对浇注口，浇注口下端直经设计为Ф2.0mm，形状为喇叭口形，锥度为5度，在浇注口对侧开二个溢胶口，用于观察是否注满 型腔。
  6. 根据权利要求5所述防水封装结构的一体成型处理工艺，其特征在于，上模块支架中间镂空为矩形，边缘为矩形框结构，上模块支架的矩形框对应覆盖住透明盖片和网格的接缝处。
  7. 根据权利要求4-6任一所述防水封装结构的一体成型处理工艺，其特征在于，上模块支架包括本体，在上模块本体上设有加热棒孔，加热棒插入到加热棒孔内进行加热烘烤。
  8. 根据权利要求4所述防水封装结构的一体成型处理工艺，其特征在于，透明盖片是预制覆膜的透明基材，预制覆膜是在透明基材上预制光学透过膜，透明基材是指蓝宝石、亚克力或光学玻璃。
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EP3352230A1 (en) 2018-07-25
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