WO2017173874A1 - 显示基板制作方法、显示基板和显示装置 - Google Patents

显示基板制作方法、显示基板和显示装置 Download PDF

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Publication number
WO2017173874A1
WO2017173874A1 PCT/CN2017/070715 CN2017070715W WO2017173874A1 WO 2017173874 A1 WO2017173874 A1 WO 2017173874A1 CN 2017070715 W CN2017070715 W CN 2017070715W WO 2017173874 A1 WO2017173874 A1 WO 2017173874A1
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Prior art keywords
substrate
organic light
angle
spacer
emitting layer
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Ceased
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PCT/CN2017/070715
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English (en)
French (fr)
Inventor
杨凡
郭坤
承天一
张毅
杨玉清
彭利满
吴岩
杨文斌
刘祺
赖韦霖
刘亮亮
阳智勇
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to KR1020177018007A priority Critical patent/KR101920587B1/ko
Priority to JP2017535372A priority patent/JP6877346B2/ja
Priority to US15/539,986 priority patent/US10084028B2/en
Priority to EP17730641.2A priority patent/EP3444845B1/en
Publication of WO2017173874A1 publication Critical patent/WO2017173874A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display substrate manufacturing method, a display substrate, and a display device.
  • an organic light emitting layer is generally formed by an evaporation process.
  • 1 to 4 show schematic views of forming an organic light-emitting layer by vapor deposition in the prior art.
  • the mother board includes a plurality of substrates, and an evaporation source (not shown) is a line source extending in a second direction (eg, the y direction) and in a first direction crossing the second direction ( For example, moving in the x direction). After the material in the evaporation source is evaporated, a desired region of each substrate is formed through a mask.
  • an evaporation source is a line source extending in a second direction (eg, the y direction) and in a first direction crossing the second direction ( For example, moving in the x direction).
  • Fig. 2 shows a cross-sectional view of a mask used in the prior art.
  • the reticle may include a plurality of occlusion regions 11 and a permeable region 12 between the occlusion regions 11.
  • the length of the top side of the section of the occlusion area 11 is greater than the length of the base side.
  • the top of the occlusion region 11 has a thickness that the occlusion region 11 has a side 120 that is connected to its top edge and that is substantially perpendicular to the lower surface of the substrate.
  • the vapor deposition apparatus is provided with intermediate baffles 13 on both sides of the vapor deposition source, and a doping material is disposed between the intermediate baffles 13 and the side baffles 14.
  • the vapor deposition region 15 of the vapor deposition source can be formed as shown in FIG.
  • the intermediate baffle 13 and the side baffles 14 are provided in the vapor deposition apparatus, the formed vapor deposition zone 15 is determined. Further, by appropriately adjusting the height of the intermediate shutter 13 and the distance between the intermediate shutter 13 and the side fence 14, the boundary of the formed vapor deposition region 15 can be adjusted.
  • the organic light-emitting layer formed in the transmission region 12 has a thin cross-sectional shape in the thicker side regions of the intermediate portion, and thus the thickness of the organic light-emitting layer is uneven. For a single pixel that is formed, this can result in different illumination levels for different regions; for multiple pixels, this can cause color mixing (or color shift) problems.
  • the technical problem to be solved by the present invention at least includes improving the uniformity of the thickness of the organic light-emitting layer in the display substrate.
  • a method of fabricating a display substrate comprising: forming a pixel defining layer on a lower surface of the substrate to define a pixel region; forming a spacer on a lower surface of the pixel defining layer; a mask is disposed under the object; and the evaporation source is moved in a first direction parallel to the lower surface of the substrate to form an organic light-emitting layer in the pixel region.
  • the acute angle between the side surface of the pixel defining layer for defining the pixel region and the lower surface of the substrate in the first direction is a first angle.
  • An acute angle between a boundary of the vapor deposition zone of the evaporation source in the first direction and a lower surface of the substrate is a second angle, and the second angle is greater than or equal to the first angle.
  • the evaporation source may be a line source extending along a second direction parallel to the lower surface of the substrate and perpendicular to the first direction, and baffles may be disposed on both sides of the evaporation source.
  • An acute angle between a boundary of the vapor deposition zone in the first direction and a lower surface of the substrate is a second angle.
  • a side surface of the pixel defining layer and the spacer formed thereunder in the second direction may be perpendicular to a lower surface of the substrate.
  • the second angle may be equal to the first angle.
  • the method before the forming the organic light emitting layer, the method further includes: forming a first electrode on a lower surface of the substrate, and further comprising: forming a second surface on the lower surface of the organic light emitting layer after forming the organic light emitting layer electrode.
  • a display substrate comprising: a substrate; a pixel defining layer formed on a lower surface of the substrate for defining a pixel region; formed in the pixel boundary a spacer on the lower surface of the layer; and an organic light-emitting layer formed in the pixel region.
  • the pixel defining layer is in a first direction parallel to the lower surface of the substrate for defining an acute angle between the side surface of the pixel region and the lower surface of the substrate to be a first angle, and the organic light emitting layer is perpendicular to the lower surface of the substrate and parallel
  • the cross section in the first direction is trapezoidal, and its side length near the lower surface of the substrate is smaller than the side length of the lower surface thereof away from the substrate.
  • the pixel defining layer and the spacer formed thereunder may be perpendicular to a lower surface of the substrate in a second direction parallel to a lower surface of the substrate and perpendicular to the first direction.
  • the display substrate may further include: a first electrode disposed between the lower surface of the substrate and the organic light emitting layer; and a second electrode disposed on a lower surface of the organic light emitting layer.
  • a display device comprising a display substrate according to the present invention.
  • the boundary of the vapor deposition region can be ensured.
  • the occlusion region (for example, the side 120 shown in FIG. 2) is shielded to ensure that the organic light-emitting layer is formed from the boundary between the pixel defining layer and the lower surface of the substrate, so that the thickness of the formed organic light-emitting layer can be made uniform. Further, the luminances of all the regions of the respective pixels are the same, ensuring that the display substrate does not have a color mixture as a whole.
  • 1 to 4 are schematic views showing the formation of an organic light-emitting layer by evaporation in the prior art
  • FIG. 5 shows a schematic flow chart of a method of fabricating a display substrate in accordance with an embodiment of the present invention
  • 6 to 10 are schematic cross-sectional views showing respective steps of a method of fabricating a display substrate in accordance with an embodiment of the present invention
  • Figure 11 is a schematic view showing the movement of an evaporation source according to another embodiment of the present invention.
  • 12A and 12B illustrate an example of a pixel to which a method of fabricating a display substrate according to an embodiment of the present invention may be applied;
  • Figure 13 is a schematic cross-sectional view showing a display substrate prepared by a method of fabricating a display substrate in accordance with an embodiment of the present invention.
  • FIG. 5 shows a schematic flow chart of a method of making a display substrate in accordance with an embodiment of the present invention.
  • a method of manufacturing a display substrate according to an embodiment of the present invention may include:
  • FIGS. 6 to 10 are schematic cross-sectional views showing respective steps of a method of fabricating a display substrate in accordance with an embodiment of the present invention. The respective steps shown in FIG. 5 will be described in detail below with reference to FIGS. 6 to 10.
  • a pixel defining layer 2 may be formed on the lower surface of the substrate 1 to define a pixel region.
  • the pixel area is an area where the organic light emitting layer is to be formed.
  • the pixel defining layer 2 may be formed by depositing, sputtering or coating a material layer for forming the pixel defining layer 2 and etching it.
  • a spacer 3 may be formed on the lower surface of the pixel defining layer 2.
  • the pixel defining layer 2 is used between the side surface B defining the pixel region and the lower surface of the substrate 1 in the first direction (ie, the moving direction of the evaporation source for forming the organic light emitting layer).
  • the acute angle is the first angle ⁇ .
  • the side surface C of the spacer 3 in the first direction and the pixel defining layer 2 are located on the same plane, that is, the acute angle between the side surface C of the spacer 3 in the first direction and the lower surface of the substrate 1 is the first angle ⁇ .
  • the side surface C of the spacer 3 in the first direction may not be coplanar with the corresponding side surface B of the pixel defining layer 2, that is, the side surface C of the spacer 3 in the first direction and the lower surface of the substrate 1.
  • the acute angle between them may be greater or smaller than the first angle a.
  • the material layer for forming the pixel defining layer 2 and the material layer for forming the spacer 3 may be sequentially stacked (for example, deposited, sputtered or coated) on the lower surface of the substrate 1 and then passed through an etching process.
  • the spacers 3 and the spacers 3 on the lower surface thereof are formed.
  • the side surface C of the formed spacer 3 in the first direction and the corresponding side surface B of the pixel defining layer 2 may be in the same plane.
  • embodiments of the invention are not limited thereto.
  • the spacers 2 and the spacers 3 on the lower surface thereof may be formed separately. In this case, the side surface C of the spacer 3 in the first direction may not be coplanar with the corresponding side surface B of the pixel defining layer 2.
  • a mask can be placed under the spacer 3. Similar to the reticle shown in FIG. 2, the reticle shown in FIG. 8 may include a plurality of occlusion regions 4 and a permeable region 5 between the occlusion regions 4.
  • the length of the top side of the section of the occlusion area 4 is greater than the length of the base side.
  • the top of the occlusion region 4 has a thickness, i.e., the occlusion region 4 has a section that is connected to its top edge and that is substantially perpendicular to the lower surface side DF of the substrate 1.
  • the bottom edge of the section of the occlusion area 4 has an end point E close to the side DF.
  • the line connecting the end point D and the end point E may be located in the plane in which the side surface B of the pixel defining layer 2 and the side surface C of the spacer 3 are located, as shown in FIG.
  • the invention is not limited thereto.
  • the evaporation source may be moved in a first direction parallel to the lower surface of the substrate 1 (for example, the x direction shown in FIG. 1) to form an organic light-emitting layer in the pixel region.
  • the acute angle between the boundary 6' or 6" of the vapor deposition zone 6 of the evaporation source and the lower surface of the substrate 1 in the first direction is a second angle ⁇ , and the second angle ⁇ may be greater than or equal to the first angle ⁇ .
  • the spacer 3 under the pixel defining layer 2 and the mask under the spacer 3 are not steamed.
  • the first boundary 6' of the plated region 6 forms a barrier.
  • the spacer 3 under the pixel defining layer 2 and the mask under the spacer 3 are not steamed.
  • the second boundary 6" of the plated region 6 forms a barrier.
  • the vapor deposition region can be ensured when the first boundary 6' of the vapor deposition region 6 starts to form the organic light-emitting layer in the pixel region through the transmission region 5.
  • the first boundary 6' of 6 is not blocked by the side DF of the occlusion region 4 to ensure that the organic light-emitting layer is formed from the boundary between the pixel defining layer 2 and the lower surface of the substrate 1, so that the formed organic light-emitting layer can be formed
  • the thickness is uniform, and thus the light-emitting luminances of all the regions of the respective pixels are the same, which ensures that the display substrate does not have a color mixture as a whole.
  • Figure 11 is a schematic view showing the movement of an evaporation source according to another embodiment of the present invention.
  • the line connecting the end point D and the end point E is not located in the plane in which the side surface B of the pixel defining layer 2 and the side surface C of the spacer 3 are located.
  • this does not affect the application of the method of fabricating the display substrate according to the embodiment of the present invention to prepare a display substrate having an organic light-emitting layer having a uniform thickness.
  • the spacer 3 under the pixel defining layer 2 and the mask under the spacer 3 are not The first boundary 6' of the vapor-deposited region 6 forms a barrier, so that the thickness of the formed organic light-emitting layer is uniform
  • the evaporation source may be a line source extending along a second direction parallel to the lower surface of the substrate 1 and perpendicular to the first direction (eg, the y-direction shown in Figure 1).
  • a baffle may be disposed on both sides of the evaporation source for making the acute angle between the boundary 6' or 6" of the vapor deposition region 6 in the first direction and the lower surface of the substrate 1 a second angle ⁇ . The height of the baffle and the distance between the baffles to obtain the desired second angle ⁇ .
  • the side surface of the pixel defining layer 2 and the spacer 3 formed thereunder in the second direction may be perpendicular to the lower surface of the substrate 1.
  • the evaporation source is a line source extending along the second direction, that is, the baffle has a limiting effect on the evaporation region 6 only in the first direction, the pixel defining layer 2 and the spacer 3 The vapor deposition region 6 is hardly blocked in the second direction, so that it is not necessary to define the side surfaces of the pixel defining layer 2 and the spacer 3 in the second direction.
  • 12A and 12B illustrate examples of pixels to which a method of fabricating a display substrate according to an embodiment of the present invention may be applied.
  • the sides AD and BC of the rectangular pixel are parallel to the first direction (ie, the moving direction of the evaporation source), and the side surfaces of the pixel defining layer and the side surface of the spacer corresponding to the sides AD and BC may be Set to be perpendicular to the lower surface of the substrate, and can refer to the above
  • the embodiment sets the side surface of the pixel defining layer corresponding to the sides AB and CD and the side surface of the spacer to an acute angle with the lower surface of the substrate to be a first angle ⁇ . As shown in FIG.
  • the sides EF and BC of the hexagonal pixel are parallel to the first direction (ie, the moving direction of the evaporation source), and the side surfaces of the pixel defining layer and the side of the spacer corresponding to the sides EF and BC.
  • the surface may be disposed perpendicular to the lower surface of the substrate, and the side surfaces of the pixel defining layers corresponding to the sides AB, AF, CD, and DE and the side surfaces of the spacer may be disposed to be under the substrate and the substrate, with reference to the above embodiments.
  • the acute angle between the surfaces is the first angle a.
  • the second angle ⁇ may be equal to the first angle ⁇ .
  • the vapor deposition zone angle i.e., the second angle ⁇
  • the thickness uniformity of the formed organic light-emitting layer can be ensured to the utmost extent.
  • Figure 13 is a schematic cross-sectional view showing a display substrate prepared by a method of fabricating a display substrate in accordance with an embodiment of the present invention.
  • the first electrode 7 may be formed on the lower surface of the substrate 1 and may further include: under the organic light-emitting layer 8 after forming the organic light-emitting layer 8 according to an embodiment of the present invention.
  • a second electrode 9 is formed on the surface.
  • the facing regions of the first electrode 7 and the second electrode 9 correspond to electrodes having a smaller area (for example, the first electrode 7). According to the method of manufacturing the display substrate according to the embodiment of the present invention, it is possible to ensure uniform thickness of the organic light-emitting layer 8 in the facing region.
  • a display substrate may include: a substrate 1; a pixel defining layer 2 formed on a lower surface of the substrate for defining a pixel region; and a spacer 3 formed on a lower surface of the pixel defining layer 2 ( Not shown in FIG. 13; and the organic light-emitting layer 8 formed in the pixel region.
  • the pixel defining layer 2 is in a first direction parallel to the lower surface of the substrate 1 for defining an acute angle between the side surface of the pixel region and the lower surface of the substrate 1 at a first angle, and the organic light emitting layer 8 is perpendicular to the substrate 1
  • the lower surface and the section parallel to the first direction are trapezoidal, and the side length of the lower surface of the substrate 1 is smaller than the side length of the lower surface of the substrate 1, as shown in FIG.
  • the pixel defining layer 2 and the spacer 3 (not shown in FIG. 13) formed thereunder are in a second direction parallel to the lower surface of the substrate 1 and perpendicular to the first direction
  • the side surface may be perpendicular to the lower surface of the substrate 1.
  • the display substrate may further include: a first electrode 7 disposed between the lower surface of the substrate 1 and the organic light-emitting layer 8; and a second electrode 9 disposed on a lower surface of the organic light-emitting layer 8.
  • a display device may include a display substrate according to the present invention. It should be noted that the display device in this embodiment may be any product or component having a display function, such as an electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator, and the like.

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Abstract

一种显示基板制作方法、一种显示基板和一种显示装置。所述方法包括：在基底（1）的下表面上形成像素界定层（2）以限定像素区；在像素界定层（2）的下表面上形成隔垫物（3）；在隔垫物（3）之下设置掩模板；以及沿平行于基底（1）的下表面的第一方向移动蒸镀源，以形成有机发光层（8）。像素界定层（2）在第一方向上的侧表面与基底（1）的下表面之间的锐角为第一角度。蒸镀源的蒸镀区域（6）在第一方向上的边界（6'，6"）与基底（1）的下表面之间的锐角为第二角度，第二角度大于或等于第一角度。当蒸镀源开始在像素区形成有机发光层（8）时，隔垫物（3）以及掩模板不对蒸镀区域（6）的第一边界形（6'）成阻挡，并且当蒸镀源结束在像素区形成有机发光层（8）时，隔垫物（3）以及掩模板不对蒸镀区域（6）的第二边界（6"）形成阻挡。

Description

显示基板制作方法、显示基板和显示装置 技术领域
本发明涉及显示技术领域，具体而言，涉及一种显示基板制作方法、一种显示基板和一种显示装置。
背景技术
在有机发光二极管显示器(OLED)的制作工艺中，一般采用蒸镀工艺形成有机发光层。
图1至图4示出了现有技术中通过蒸镀形成有机发光层的示意图。
如图1所示，母板包含多个基板，蒸镀源(未示出)为沿着第二方向(例如，y方向)延伸的线源，并且在与第二方向交叉的第一方向(例如，x方向)上移动。蒸镀源中的材料蒸发出来后，通过掩模板形成在每个基板的期望区域。
图2示出了现有技术中使用的掩模板的截面图。如图2所示，掩模板可以包括多个遮挡区域11和遮挡区域11之间的透过区域12。遮挡区域11的截面的顶边长度大于底边长度。此外，由于制作工艺的限制，遮挡区域11的顶部具有一定厚度，即，遮挡区域11的截面具有与其顶边相连且基本上垂直于基底的下表面的侧边120。
蒸镀设备在蒸镀源两侧设置中间挡板13，并且在中间挡板13和侧挡板14之间设置掺杂材料。如此，可以形成蒸镀源的蒸镀区域15，如图3所示。当在蒸镀设备中设置了中间挡板13和侧挡板14后，所形成的蒸镀区域15是确定的。此外，通过适当调整中间挡板13的高度以及中间挡板13与侧挡板14之间的距离，可以对所形成的蒸镀区域15的边界进行调整。
在现有技术的蒸镀过程中，如图4所示，当蒸镀源沿着第一方向(例如，x方向)移动时，由于遮挡区域11的顶部具有一定厚度(即，存在侧边120)，在蒸镀区域15的第一边界(例如，图中所示的蒸镀区域15的右侧边界)进入掩模板透过区域12时，会对蒸镀区域15的边界形成遮挡。因此，蒸镀区域15无法对基底16的下表面靠近遮挡区域11的部分进行蒸镀。此外，在蒸镀区域15的第二边界(例如，图中所示的蒸镀区域15的左侧边界)离开透过区域12时也存在上述 问题。因此，根据现有技术的蒸镀方法，形成在透过区域12的有机发光层具有中间区域较厚两侧区域较薄的截面形状，因此使得有机发光层厚度不均。对于所形成的单个像素，这会导致不同区域发光亮度不同；而对于多个像素，这会导致混色(或色偏)问题。
发明内容
本发明所要解决的技术问题至少包括提高显示基板中有机发光层厚度的均匀度。
根据本发明的一个方面，提供了一种制作显示基板的方法，包括：在基底的下表面上形成像素界定层以限定像素区；在像素界定层的下表面上形成隔垫物；在隔垫物之下设置掩模板；以及沿平行于基底的下表面的第一方向移动蒸镀源，以在像素区形成有机发光层。像素界定层在所述第一方向上用于限定像素区的侧表面与基底的下表面之间的锐角为第一角度。蒸镀源的蒸镀区域在所述第一方向上的边界与基底的下表面之间的锐角为第二角度，所述第二角度大于或等于所述第一角度。当在第一方向上移动蒸镀源以开始在像素区形成有机发光层时，像素界定层之下的隔垫物以及隔垫物之下的掩模板不对蒸镀区域的第一边界形成阻挡，并且当在第一方向上移动蒸镀源以结束在像素区形成有机发光层时，像素界定层之下的隔垫物以及隔垫物之下的掩模板不对蒸镀区域的第二边界形成阻挡。
根据本发明的实施例，蒸镀源可以为沿着平行于基底的下表面并且垂直于所述第一方向的第二方向延伸的线源，可以在蒸镀源的两侧设置有挡板，用于使所述蒸镀区域在所述第一方向上的边界与基底的下表面之间的锐角为第二角度。
根据本发明的实施例，像素界定层和形成在其下的隔垫物在所述第二方向上的侧表面可以垂直于基底的下表面。
根据本发明的实施例，所述第二角度可以等于所述第一角度。
根据本发明的实施例，在形成有机发光层之前还可以包括：在基底的下表面上形成第一电极，并且在形成有机发光层之后还可以包括：在有机发光层的下表面上形成第二电极。
根据本发明的另一方面，提供了一种显示基板，包括：基底；形成在基底的下表面上的像素界定层，用于限定像素区；形成在像素界 定层的下表面上的隔垫物；以及形成在像素区中的有机发光层。像素界定层在平行于基底的下表面的第一方向上用于限定像素区的侧表面与基底的下表面之间的锐角为第一角度，并且有机发光层在垂直于基底的下表面并且平行于所述第一方向上的截面呈梯形，其靠近基底的下表面的边长小于其远离基底的下表面的边长。
根据本发明的实施例，像素界定层和形成在其下的隔垫物在平行于基底的下表面并且垂直于所述第一方向的第二方向上的侧表面可以垂直于基底的下表面。
根据本发明的实施例，所述显示基板还可以包括：设置在基底的下表面和有机发光层之间的第一电极；以及设置在有机发光层的下表面上的第二电极。
根据本发明的另一方面，提供了一种显示装置，包括根据本发明的显示基板。
根据本发明的制作显示基板的方法，由于第二角度大于或等于第一角度，所以在蒸镀区域的边界通过透过区域开始在像素区形成有机发光层时，可以保证蒸镀区域的边界不会被遮挡区域(例如，图2所示的侧边120)遮挡，以确保从像素界定层与基板的下表面的交界处开始形成有机发光层，因此可以使得所形成的有机发光层厚度均匀，进而使得各个像素的所有区域的发光亮度相同，保证了显示基板在整体上不存在混色。
附图说明
通过参考附图会更加清楚的理解本发明的特征和优点，附图是示意性的而不应理解为对本发明进行任何限制，在附图中：
图1至图4示出了现有技术中通过蒸镀形成有机发光层的示意图；
图5示出了根据本发明的实施例的制作显示基板的方法的示意流程图；
图6至图10是示出了根据本发明的实施例的制作显示基板的方法的各个步骤示意截面图；
图11示出了根据本发明的另一实施例的蒸镀源移动示意图；
图12A和图12B示出了可以应用根据本发明的实施例的制作显示基板的方法的像素示例；以及
图13示出了根据本发明的实施例的制作显示基板的方法制备的的显示基板示意截面图。
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点，下面结合附图和具体实施方式对本发明的各实施例进行进一步的详细描述。需要说明的是，在不冲突的情况下，在本发明的各个实施例中描述的特征可以应用于本发明的其他实施例。
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是，本发明还可以采用其他不同于在此描述的其他方式来实施，因此，本发明的保护范围并不受下面公开的具体实施例的限制。
图5示出了根据本发明的实施例的制作显示基板的方法的示意流程图。
如图5所示，根据本发明的实施例的制作显示基板的方法可以包括：
S1，在基底的下表面上形成像素界定层以限定像素区；
S2，在像素界定层的下表面上形成隔垫物；
S3，在隔垫物之下设置掩模板；以及
S4，沿平行于基底的下表面的第一方向移动蒸镀源，以在像素区形成有机发光层。
图6至图10是示出了根据本发明的实施例的制作显示基板的方法的各个步骤示意截面图。下面将结合图6至图10对图5所示的各个步骤进行详细说明。
参照图5和图6，可以在基底1的下表面上形成像素界定层2以限定像素区。像素区为待形成有机发光层的区域。可以通过沉积、溅射或涂覆用于形成像素界定层2的材料层，并对其进行刻蚀来形成像素界定层2。
参照图5和图7，可以在像素界定层2的下表面上形成隔垫物3。如图7所示，像素界定层2在第一方向(即，用于形成有机发光层的蒸镀源的移动方向)上用于限定像素区的侧表面B与基底1的下表面之间的锐角为第一角度α。
如图7所示，隔垫物3在第一方向上的侧表面C与像素界定层2 的相应的侧表面B位于同一平面，即，隔垫物3在第一方向上的侧表面C与基底1的下表面之间的锐角为第一角度α。然而，本发明的实施例不限于此。隔垫物3在第一方向上的侧表面C可以不与像素界定层2的相应的侧表面B共面，即，隔垫物3在第一方向上的侧表面C与基底1的下表面之间的锐角可以大于或小于第一角度α。
可以在基底1的下表面上顺序地堆叠(例如，沉积、溅射或涂覆)用于形成像素界定层2的材料层和用于形成隔垫物3的材料层，然后通过一次刻蚀工艺来形成像素界定层2及其下表面上的隔垫物3。在此情况下，所形成的隔垫物3在第一方向上的侧表面C与像素界定层2的相应的侧表面B可位于同一平面。然而，本发明的实施例不限于此。可以分别形成像素界定层2及其下表面上的隔垫物3。在此情况下，隔垫物3在第一方向上的侧表面C可以不与像素界定层2的相应的侧表面B共面。
参照图5和图8，可以在隔垫物3之下设置掩模板。类似于图2所示的掩模板，图8所示的掩模板可以包括多个遮挡区域4和遮挡区域4之间的透过区域5。遮挡区域4的截面的顶边长度大于底边长度。此外，由于制作工艺的限制，遮挡区域4的顶部具有一定厚度，即，遮挡区域4的截面具有与其顶边相连且基本上垂直于基底1的下表面侧边DF。此外，遮挡区域4的截面的底边具有靠近侧边DF的端点E。在遮挡区域4的截面中，端点D和端点E的连线可以位于像素界定层2的侧表面B和隔垫物3的侧表面C所在的平面内，如图8所示。然而本发明不限于此。
参照图5和图9，可以沿平行于基底1的下表面的第一方向(例如，图1所示的x方向)移动蒸镀源，以在像素区形成有机发光层。蒸镀源的蒸镀区域6在第一方向上的边界6′或6″与基底1的下表面之间的锐角为第二角度β，第二角度β可以大于或等于第一角度α。
如图9所示，当在第一方向上移动蒸镀源以开始在像素区形成有机发光层时，像素界定层2之下的隔垫物3以及隔垫物3之下的掩模板不对蒸镀区域6的第一边界6′形成阻挡。如图10所示，当在第一方向上移动蒸镀源以结束在像素区形成有机发光层时，像素界定层2之下的隔垫物3以及隔垫物3之下的掩模板不对蒸镀区域6的第二边界6″形成阻挡。
根据本实施例，由于第二角度β大于或等于第一角度α，所以在蒸镀区域6的第一边界6′通过透过区域5开始在像素区形成有机发光层时，可以保证蒸镀区域6的第一边界6′不会被遮挡区域4的侧边DF遮挡，以确保从像素界定层2与基板1的下表面的交界处开始形成有机发光层，因此可以使得所形成的有机发光层厚度均匀，进而使得各个像素的所有区域的发光亮度相同，保证了显示基板在整体上不存在混色。
图11示出了根据本发明的另一实施例的蒸镀源移动示意图。
如图11所示，在遮挡区域4的截面中，端点D和端点E的连线没有位于像素界定层2的侧表面B和隔垫物3的侧表面C所在的平面内。然而，这并不影响应用根据本发明的实施例的制作显示基板的方法来制备具有厚度均匀的有机发光层的显示基板。
如图11所示，当在第一方向上移动蒸镀源以开始在像素区形成有机发光层时，像素界定层2之下的隔垫物3以及隔垫物3之下的掩模板没有对蒸镀区域6的第一边界6′形成阻挡，从而使得所形成的有机发光层厚度均匀
根据本发明的实施例，蒸镀源可以为沿着平行于基底1的下表面并且垂直于所述第一方向的第二方向(例如，图1所示的y方向)延伸的线源。可以在蒸镀源的两侧设置有挡板，用于使蒸镀区域6在第一方向上的边界6′或6″与基底1的下表面之间的锐角为第二角度β。可以通过挡板的高度以及挡板之间的距离，来得到期望的第二角度β。
根据本发明的实施例，像素界定层2和形成在其下的隔垫物3在所述第二方向上的侧表面可以垂直于基底1的下表面。根据本实施例，由于蒸镀源为沿着所述第二方向延伸的线源，即，挡板仅在第一方向上对蒸镀区域6有限定作用，像素界定层2和隔垫物3几乎不会在第二方向上遮挡蒸镀区域6，因此无需在第二方向上限定像素界定层2和隔垫物3的侧表面。
图12A和图12B示出了可以应用根据本发明的实施例的制作显示基板的方法的像素示例。
如图12A所示，矩形像素的边AD和BC平行于第一方向(即，蒸镀源的移动方向)，对应于边AD和BC的像素界定层的侧表面和隔垫物的侧表面可以设置为垂直于基底的下表面，并且可以参照以上各实 施例将对应于边AB和CD的像素界定层的侧表面和隔垫物的侧表面设置为与基底的下表面之间的锐角为第一角度α。如图12所示，六边形像素的边EF和BC平行于第一方向(即，蒸镀源的移动方向)，对应于边EF和BC的像素界定层的侧表面和隔垫物的侧表面可以设置为垂直于基底的下表面，并且可以参照以上各实施例将对应于边AB、AF、CD和DE的像素界定层的侧表面和隔垫物的侧表面设置为位与基底的下表面之间的锐角为第一角度α。进而简化形成像素界定层和隔垫物的工艺。
根据本发明的实施例，第二角度β可以等于第一角度α。
由于蒸镀区域角(即，第二角度β)越小，蒸镀得到的有机发光层均匀度越高。根据本实施例，可以在保证实现上述实施例效果的同时，使得蒸镀区域角(即，第二角度β)最小，进而在最大程度上保证形成的有机发光层的厚度均匀度。
图13示出了根据本发明的实施例的制作显示基板的方法制备的的显示基板示意截面图。
根据本发明的实施例，在形成有机发光层8之前还可以包括：在基底1的下表面上形成第一电极7，并且在形成有机发光层8之后还可以包括：在有机发光层8的下表面上形成第二电极9。
第一电极7和第二电极9的正对区域对应于两者中面积较小的电极(例如，第一电极7)。根据本发明的实施例的制作显示基板的方法，可以保证在正对区域的有机发光层8厚度均匀。
根据本发明的实施例的显示基板可以包括：基底1；形成在基底的下表面上的像素界定层2，用于限定像素区；形成在像素界定层2的下表面上的隔垫物3(图13中未示出)；以及形成在像素区中的有机发光层8。像素界定层2在平行于基底1的下表面的第一方向上用于限定像素区的侧表面与基底1的下表面之间的锐角为第一角度，并且有机发光层8在垂直于基底1的下表面并且平行于所述第一方向上的截面呈梯形，其靠近基底1的下表面的边长小于其远离基底1的下表面的边长，如图13所示。
根据本发明的实施例，像素界定层2和形成在其下的隔垫物3(图13中未示出)在平行于基底1的下表面并且垂直于所述第一方向的第二方向上的侧表面可以垂直于基底1的下表面。
根据本发明的实施例，显示基板还可以包括：设置在基底1的下表面和有机发光层8之间的第一电极7；以及设置在有机发光层8的下表面上的第二电极9。
根据本发明的实施例的显示装置可以包括根据本发明的显示基板。需要说明的是，本实施例中的显示装置可以为：电子纸、手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
以上结合附图详细说明了本发明的技术方案。需要指出的是，在附图中，为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解，当一个元件或层被称为在另一元件或层“之上”或“之下”时，所述一个元件或层可以直接在另一元件或层之上或之下，或者可以存在一个或多个中间元件或层。另外，还可以理解，当一个元件或层被称为在两个元件或两层“之间”时，所述一个元件或层可以为两个元件或两层之间惟一的元件或层，或还可以存在一个或多个的中间元件或层。在上下文中，相同或相似的附图标记始终用于表示相同或相似的元件。
应当理解，虽然术语“第一”、“第二”等在本文中可用于描述不同的元件，但是这些元件不应受限与这些术语。这些术语仅用于将一个元件与另一元件区分开。例如，“第一元件”也可被称作“第二元件”而没有脱离各实施例的指教。术语“多个”指两个或两个以上，除非另有明确的限定。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (9)

  1. 一种制作显示基板的方法，包括：
    在基底的下表面上形成像素界定层以限定像素区；
    在像素界定层的下表面上形成隔垫物；
    在隔垫物之下设置掩模板；以及
    沿平行于基底的下表面的第一方向移动蒸镀源，以在像素区形成有机发光层，
    其中，像素界定层在所述第一方向上用于限定像素区的侧表面与基底的下表面之间的锐角为第一角度，
    蒸镀源的蒸镀区域在所述第一方向上的边界与基底的下表面之间的锐角为第二角度，所述第二角度大于或等于所述第一角度，
    当在第一方向上移动蒸镀源以开始在像素区形成有机发光层时，像素界定层之下的隔垫物以及隔垫物之下的掩模板不对蒸镀区域的第一边界形成阻挡，并且当在第一方向上移动蒸镀源以结束在像素区形成有机发光层时，像素界定层之下的隔垫物以及隔垫物之下的掩模板不对蒸镀区域的第二边界形成阻挡。
  2. 根据权利要求1所述的方法，其中，蒸镀源为沿着平行于基底的下表面并且垂直于所述第一方向的第二方向延伸的线源，在蒸镀源的两侧设置有挡板，用于使所述蒸镀区域在所述第一方向上的边界与基底的下表面之间的锐角为第二角度。
  3. 根据权利要求2所述的方法，其中，像素界定层和形成在其下的隔垫物在所述第二方向上的侧表面垂直于基底的下表面。
  4. 根据权利要求1所述的方法，其中，所述第二角度等于所述第一角度。
  5. 根据权利要求1至4中任一项所述的方法，在形成有机发光层之前还包括：在基底的下表面上形成第一电极，并且
    在形成有机发光层之后还包括：在有机发光层的下表面上形成第二电极。
  6. 一种显示基板，包括：
    基底；
    形成在基底的下表面上的像素界定层，用于限定像素区；
    形成在像素界定层的下表面上的隔垫物；以及
    形成在像素区中的有机发光层，
    其中，像素界定层在平行于基底的下表面的第一方向上用于限定像素区的侧表面与基底的下表面之间的锐角为第一角度，并且
    有机发光层在垂直于基底的下表面并且平行于所述第一方向上的截面呈梯形，其靠近基底的下表面的边长小于其远离基底的下表面的边长。
  7. 根据权利要求6所述的显示基板，其中，像素界定层和形成在其下的隔垫物在平行于基底的下表面并且垂直于所述第一方向的第二方向上的侧表面垂直于基底的下表面。
  8. 根据权利要求6所述的显示基板还包括：
    设置在基底的下表面和有机发光层之间的第一电极；以及
    设置在有机发光层的下表面上的第二电极。
  9. 一种显示装置，包括权利要求6至8中任一项所述的显示基板。
PCT/CN2017/070715 2016-04-08 2017-01-10 显示基板制作方法、显示基板和显示装置 Ceased WO2017173874A1 (zh)

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