WO2018059464A1 - 电子设备散热结构及电子设备 - Google Patents

电子设备散热结构及电子设备 Download PDF

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Publication number
WO2018059464A1
WO2018059464A1 PCT/CN2017/103830 CN2017103830W WO2018059464A1 WO 2018059464 A1 WO2018059464 A1 WO 2018059464A1 CN 2017103830 W CN2017103830 W CN 2017103830W WO 2018059464 A1 WO2018059464 A1 WO 2018059464A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
layer
contact
dissipation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/103830
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English (en)
French (fr)
Inventor
靳林芳
杨果
蔺帅南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to ES17854914T priority Critical patent/ES2913260T3/es
Priority to EP17854914.3A priority patent/EP3512318B1/en
Priority to US16/337,052 priority patent/US10729036B2/en
Priority to EP22159744.6A priority patent/EP4099809A1/en
Publication of WO2018059464A1 publication Critical patent/WO2018059464A1/zh
Anticipated expiration legal-status Critical
Priority to US16/925,433 priority patent/US11122710B2/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Definitions

  • the embodiments of the present invention relate to a device heat dissipation technology, and particularly to an electronic device heat dissipation structure and an electronic device.
  • the thermal conduction effect of the sound cavity in the current electronic device is not good, so that the sound cavity is not well radiated, which makes it difficult for the heat of the sound cavity to be effectively conducted to diffuse out, so that the sound cavity region in the electronic device is partially The temperature is high.
  • the embodiment of the present application provides a heat dissipation structure and an electronic device of an electronic device to avoid local high temperature of the electronic device.
  • the embodiment of the present application provides a heat dissipation structure of an electronic device, including: a back cover, a main board, a battery, an antenna board, a sound chamber, and a middle frame; wherein the back cover is provided with a heat dissipation layer; the first shielding cover and the first cover are disposed on the main board a shielding cover; the sound chamber is disposed on one side of the antenna board;
  • the first area of the heat dissipation layer is in contact with the first shielding cover of the main board, and the second shielding cover of the main board is in contact with the first area of the middle frame;
  • the second area of the heat dissipation layer is in contact with one side of the battery, and the other side of the battery away from the heat dissipation layer is in contact with the second area of the middle frame;
  • the third area of the heat dissipation layer is in contact with a side of the sound cavity that is away from the antenna board, and the other side of the antenna board that is away from the sound chamber is in contact with the third area of the middle frame.
  • the heat dissipation structure of the electronic device since the heat dissipation layer disposed on the back cover can be in contact with the main board and the battery, and can also be in contact with the sound chamber, the heat dissipation structure of the electronic device can realize the sound on the basis of realizing the heat dissipation of the main board and the battery.
  • the heat dissipation in the cavity area effectively avoids local high temperature and realizes balanced heat dissipation of the electronic device, thereby improving the user experience.
  • the third region of the heat dissipation layer is in contact with a portion or all of the surface of the sound cavity that is away from the antenna plate.
  • the third area of the heat dissipation layer is in adhesive contact with the side of the sound cavity that is away from the antenna board; the glue used in the adhesive mode is a heat conductive glue.
  • the third region of the heat dissipation layer is in contact with the side of the sound chamber remote from the antenna plate by soldering.
  • the heat dissipation layer is in contact with the sound chamber by means of adhesive bonding or welding, which can improve heat conduction between the heat dissipation layer and the sound cavity, and improve heat transfer efficiency.
  • the first region of the heat dissipation layer may also be in contact with the first shielding cover of the main board by gluing or welding.
  • the second shielding cover of the main board can also be in contact with the first area of the middle frame by gluing or welding.
  • the glue used in the adhesive method may also be a heat transfer adhesive, and the flux used in the soldering method is a heat conductive flux.
  • the heat dissipation layer is in contact with the first shielding cover by adhesive bonding or welding, thereby improving heat conduction between the heat dissipation layer and the first shielding cover, thereby improving the main board and the heat dissipation.
  • the heat conduction of the layer improves the heat transfer efficiency.
  • the second region of the heat dissipation layer may also be in contact with the battery by adhesive bonding or welding, and the other surface of the battery away from the heat dissipation layer may also be in contact with the second region of the middle frame by adhesive bonding or welding.
  • the glue used in the adhesive method may also be a heat transfer adhesive, and the flux used in the soldering method is a heat conductive flux.
  • the heat dissipation layer is in contact with the battery through a bonding method or a soldering method, thereby improving heat conduction between the heat dissipation layer and the battery, and improving heat transfer efficiency.
  • the material of the sound chamber is a heat conductive material;
  • the heat conductive material includes any one of the following: a heat conductive plastic, a ceramic, and a metal.
  • the sound cavity formed by the heat conductive material can make the heat generated by the device in the sound cavity be better transmitted to the surface of the sound cavity, thereby effectively diffusing out.
  • the dielectric constant of the thermally conductive material is less than or equal to 8
  • the loss angle of the thermally conductive material is less than or equal to 0.01
  • the thermal conductivity of the thermally conductive material is greater than or equal to 1 W/(m*K).
  • the thermal conductivity of the acoustic cavity has a dielectric constant of less than or equal to 8, and the heat generated by the device in the acoustic cavity is better conducted to the surface of the acoustic cavity, thereby effectively avoiding electrical interference of devices within the acoustic cavity.
  • the thermal conductivity of the thermal conductive material of the sound chamber is greater than or equal to 1 W/(m*K), and the heat conduction between the device in the sound chamber and the sound chamber improves the heat transfer efficiency.
  • a charging device is further disposed on the antenna board.
  • the heat generated by the charging device during the charging process can be transmitted to the sound cavity through the antenna board, and then diffused through the heat dissipation layer in contact with the sound cavity, thereby achieving heat dissipation in the sound cavity region in the charging scene, thereby avoiding local high temperature of the electronic device and improving user experience.
  • the heat dissipation layer comprises: a soaking layer; the soaking layer is in contact with the main board, the battery and the antenna board.
  • the soaking layer can evenly dissipate the heat absorbed by the main board, the battery and the sound chamber, thereby effectively avoiding local heat dissipation of the electronic device.
  • the thermal conductivity of the soaked layer is greater than or equal to 250 W/(m*K).
  • the heat dissipation layer further includes: a heat storage layer and a heat insulation layer; the heat insulation layer is in contact with the back cover; and the heat storage layer is located between the heat insulation layer and the heat storage layer.
  • the heat storage layer can absorb heat from the soaking layer by phase change and store the heat energy to alleviate the temperature rise of the back cover of the electronic device.
  • the insulation prevents heat from being transferred directly to the back cover to relieve the temperature rise of the back cover of the electronics.
  • the specific heat capacity of the heat storage layer is greater than or equal to 100 J/(g*K), and the thermal conductivity of the thermal insulation layer is less than or equal to 0.5 W/(m*K).
  • the direction of the middle frame perpendicular to the heat dissipation layer is further provided with: a first divided piece and a second divided piece; the first divided piece is used for separating the main board from the battery in a longitudinal direction; the second divided piece is used for The battery and the antenna board are spaced apart in the longitudinal direction; the longitudinal direction is perpendicular to the direction of the heat dissipation layer.
  • a thermal conductive foam is further disposed between the antenna board and the second divided piece.
  • the thermal conductive foam disposed between the antenna plate and the second divided piece can realize the heat conduction path between the second divided piece of the battery and the antenna plate to the sound cavity, thereby realizing heat diffusion on the heat conduction path, and effectively avoiding local heat generation of the electronic device.
  • the embodiment of the present application further provides an electronic device, including the heat dissipation structure of any of the above.
  • the heat dissipation structure and the electronic device of the electronic device may include a rear cover, a main board, a battery, an antenna board, a sound chamber and a middle frame; wherein the rear cover is provided with a heat dissipation layer; the main board is provided with a first shielding cover and a second shielding cover; the sound cavity is disposed on the antenna board
  • the first area of the heat dissipation layer is in contact with the first shielding cover of the main board, the second shielding cover of the main board is in contact with the first area of the middle frame; the second area of the heat dissipation layer is opposite to the battery On one side of the battery, the other side of the battery that is away from the heat dissipation layer is in contact with the second area of the middle frame; the third area of the heat dissipation layer is in contact with a side of the sound cavity that is away from the antenna board, and the antenna board is away
  • the heat dissipation structure of the electronic device since the heat dissipation layer disposed on the back cover can be in contact with the main board and the battery, and can also be in contact with the sound chamber, the heat dissipation structure of the electronic device can realize the sound on the basis of realizing the heat dissipation of the main board and the battery.
  • the heat dissipation in the cavity area effectively avoids local high temperature and realizes balanced heat dissipation of the electronic device, thereby improving the user experience.
  • FIG. 1 is a schematic diagram of a heat dissipation structure of an electronic device according to Embodiment 1 of the present application;
  • FIG. 2 is a schematic diagram of a heat dissipation structure of an electronic device according to Embodiment 2 of the present application;
  • FIG. 3 is a schematic diagram of another heat dissipation structure of an electronic device according to Embodiment 2 of the present application.
  • FIG. 4 is a schematic structural diagram of an electronic device according to Embodiment 3 of the present application.
  • Embodiment 1 of the present application provides a heat dissipation structure of an electronic device.
  • the heat dissipation structure may be located in an electronic device, such as an electronic device such as a mobile phone, a notebook computer, or a tablet computer.
  • FIG. 1 is a schematic diagram of a heat dissipation structure of an electronic device according to Embodiment 1 of the present application.
  • the electronic device heat dissipation structure may include a back cover 11 , a main board 12 , a battery 13 , an antenna board 14 , a sound chamber 15 , and a middle frame 16 .
  • the back cover 11 is provided with a heat dissipation layer 17;
  • the main board 12 is provided with a first shielding cover 18 and a second shielding cover 19;
  • the sound chamber 15 is disposed on one side of the antenna board 14.
  • the first region of the heat dissipation layer 17 is in contact with the first shield cover 18 of the main board 12, and the second shield cover 19 of the main board 12 is in contact with the first region of the middle frame 16.
  • the second region of the heat dissipation layer 17 is in contact with one surface of the battery 13, and the other surface of the battery 13 remote from the heat dissipation layer 17 is in contact with the second region of the middle frame 16.
  • the third region of the heat dissipation layer 17 is in contact with the surface of the sound chamber 15 remote from the antenna panel 14, and the other surface of the antenna panel 14 remote from the sound chamber 15 is in contact with the third region of the middle frame 16.
  • the main board 12 and the antenna board 14 may each be a Printed Circuit Board (PCB).
  • the main board 12 can be integrated with a processor and the like, and the antenna board 14 can be integrated with an antenna device such as a wiring of the antenna array.
  • the antenna device may include, for example, a mobile communication antenna, a wireless fidelity (WIreless-Fidelity (WLAN) antenna, a Global Positioning System (GPS) antenna, a Bluetooth antenna, and a near field communication (Near). At least one antenna such as a Field Communication (NFC) antenna or a wireless charge (Wireless Charge) antenna.
  • WLAN wireless fidelity
  • GPS Global Positioning System
  • Bluetooth Bluetooth
  • Near near field communication
  • At least one antenna such as a Field Communication (NFC) antenna or a wireless charge (Wireless Charge) antenna.
  • the mobile communication antenna may be a second generation (2 nd Generation, abbreviated 2G) communication antenna, a third-generation (3 rd Generation, abbreviated 3G) communication antenna, a fourth generation (4 th Generation, abbreviated 3G) communication antenna, fifth Generation (5 th Generation, abbreviated 5G) a communication antenna and an antenna in the subsequent evolution of the at least one communication technique.
  • the antenna device may be, for example, in the range of 450 MHz to 5 GHz.
  • the main board 12 may also be referred to as a large board, and the corresponding antenna board 14 may be referred to as a small board.
  • a plurality of shielding covers can be disposed on the main board 12.
  • the devices on the main board 12 can isolate the interference of adjacent devices through the shielding cover, that is, the shielding cover is used for shielding and protecting the electrical characteristics of the devices on the main board 12.
  • the first shielding cover 18 may refer to a shielding cover of the plurality of shielding covers that is in contact with the heat dissipation layer 17
  • the second shielding cover 19 may refer to a shielding cover of the plurality of shielding covers that is in contact with the middle frame 16 . That is, the first shield cover 18 and the second shield cover 19 respectively refer to a type of shield cover, which respectively may include at least one shield cover. It should be noted that, in FIG. 1 , only the case where the first shielding cover 18 and the second shielding cover 19 respectively include a shielding cover is described, and the present application is not limited thereto.
  • a sound device such as a speaker and a receiver can be included in the sound chamber 15, and the speaker and the receiver can be disposed on the antenna board 14.
  • the heat dissipation layer 17 may be a heat conductive layer composed of a heat conductive material having a thermal conductivity greater than a predetermined number of times, or may be a composite heat conductive layer composed of a heat conductive material and other materials, which is not limited thereto.
  • the first region of the heat dissipation layer 17 is in contact with the first shielding cover 18 of the main board 12, so that the heat of the main board 12 is transmitted to the heat dissipation layer 17 through the first shielding cover 18, thereby achieving heat dissipation in the area of the main board 12.
  • the second shielding cover 19 of the main board 12 is in contact with the first area of the middle frame 16, so that the main board 12 is fixed on the middle frame 16, so that the main board 12 is stable in the electronic device. The performance of the device on the motherboard 12 is effectively ensured.
  • the second region of the heat dissipation layer 17 is in contact with one surface of the battery 13, and the heat of the battery 13 can be transmitted to the heat dissipation layer 17 to dissipate heat from the battery 13 region.
  • the other side of the battery 13 remote from the heat dissipation layer 17 is also in contact with the second region of the middle frame 16, which allows the battery 13 to be fixed to the middle frame 16, so that the battery 13 is stabilized in the electronic device.
  • the third region of the heat dissipation layer 17 is in contact with the surface of the sound cavity 15 away from the antenna plate 14. Actually, the thermal relationship between the heat dissipation layer 17 and the sound cavity 15 is established to transmit the heat of the sound cavity 15 to the heat dissipation layer 17, The heat dissipation in the area of the sound chamber 15 is achieved.
  • the other side of the antenna board 14 remote from the sound chamber 15 is in contact with the third area of the middle frame 16, and the antenna board 14 can be fixed to the middle frame 16 to stabilize the antenna board 14 in the electronic device.
  • the heat of the sound chamber 15 includes the heat generated by the heat generating device in the sound chamber 15, and also includes the heat generated by the adjacent parts of the sound chamber 15, such as the antenna board 14.
  • the heat dissipation structure of the electronic device provided in the first embodiment of the present application may include a back cover, a main board, a battery, an antenna board, a sound chamber, and a middle frame; wherein the back cover is provided with a heat dissipation layer; and the first shielding cover is disposed on the main board And a second shielding cover; the sound cavity is disposed on one side of the antenna board; the first area of the heat dissipation layer is in contact with the first shielding cover of the main board, and the second shielding cover of the main board and the first part of the middle frame Zone contact; the second area of the heat dissipation layer is in contact with one side of the battery, and the other side of the battery away from the heat dissipation layer is in contact with the second area of the middle frame; the third area of the heat dissipation layer is away from the sound cavity One side of the antenna board contacts, and the other side of the antenna board remote from the sound chamber is in contact with the third area of the middle frame.
  • the heat dissipation structure of the electronic device since the heat dissipation layer disposed on the back cover can be in contact with the main board and the battery, and can also be in contact with the sound chamber, the heat dissipation structure of the electronic device can realize the sound on the basis of realizing the heat dissipation of the main board and the battery.
  • the heat dissipation in the cavity area effectively avoids local high temperature in the sound cavity area of games, videos, music, etc., and achieves balanced heat dissipation of the electronic device, thereby improving the user experience.
  • the third region of the heat dissipation layer 17 is in contact with a portion or all of the surface of the sound cavity 15 that is away from the antenna plate 14.
  • the third region of the heat dissipation layer 17 can be contacted with the surface of the sound chamber 15 away from the antenna plate 14 by adhesive bonding or welding; the glue used in the adhesive manner is a heat conductive adhesive, and the welding method is used.
  • the flux is a thermal flux.
  • the other side of the antenna panel 14 remote from the sound chamber 15 can be in contact with the third region of the middle frame 16 by screws, which can be, for example, a thermally conductive screw.
  • the heat dissipation layer 17 is in contact with the sound chamber 15 by adhesive bonding or welding, thereby improving heat conduction between the heat dissipation layer 17 and the sound chamber 15, and improving heat. Transmission efficiency.
  • the first region of the heat dissipation layer 17 can also be contacted with the first shielding cover 18 of the main board 12 by adhesive bonding or welding.
  • the second shielding cover 19 of the main board 12 can also be glued or welded.
  • the first area of the frame 16 is in contact.
  • the glue used in the adhesive method may also be a heat transfer adhesive, and the flux used in the soldering method is a heat conductive flux.
  • the heat dissipation layer 17 is in contact with the first shielding cover 18 by adhesive bonding or soldering, thereby improving the space between the heat dissipation layer 17 and the first shielding cover 18. Heat conduction, thereby improving heat conduction between the main board 12 and the heat dissipation layer, and improving heat transfer efficiency.
  • the second region of the heat dissipation layer 17 can also be in contact with the battery 13 by adhesive bonding or welding.
  • the other surface of the battery 13 away from the heat dissipation layer 17 can also be glued or welded to the middle frame 16 Two regional contacts.
  • the glue used in the adhesive method may also be a heat transfer adhesive, and the flux used in the soldering method is a heat conductive flux.
  • the heat dissipation layer 17 is adhered.
  • the method or the welding method is in contact with the battery 13, which can improve the heat conduction between the heat dissipation layer 17 and the battery 13, and improve the heat transfer efficiency.
  • the material of the sound chamber 15 is a heat conductive material;
  • the heat conductive material includes any one of the following: a heat conductive plastic, a ceramic, a metal, or the like.
  • the material of the sound chamber 15 is provided as a heat conductive material, so that the heat generated by the devices in the sound chamber 15 can be better conducted to the surface of the sound chamber 15, thereby effectively diffusing out. It should be noted that the material of the sound chamber 15 can also be other heat conductive materials.
  • the heat conductive plastic, the ceramic, and the metal are only examples, and the present application is not limited thereto.
  • the thermal conductivity of the thermally conductive material is less than or equal to 8
  • the loss angle of the thermally conductive material is less than or equal to 0.01
  • the thermal conductivity of the thermally conductive material is greater than or equal to 1 W/(m*K), wherein W is heat.
  • W heat.
  • m is the unit of meter
  • K is the thermal temperature unit Kelvin.
  • the dielectric constant of the heat conductive material of the sound chamber 15 is less than or equal to 8, and the heat generated by the device in the sound chamber 15 is better transmitted to the surface of the sound chamber 15, effectively avoiding the devices in the sound chamber 15. Electrical interference.
  • the thermal conductivity of the heat conductive material of the sound chamber 15 is greater than or equal to 1 W/(m*K), and the heat conduction between the device in the sound chamber 15 and the sound chamber 15 improves the heat transfer efficiency.
  • the antenna board 14 is further provided with a charging device, and the charging device can be located in the sound chamber 15.
  • the heat generated by the charging device during the charging process can be transmitted to the sound cavity 15 through the antenna board 14, and then diffused through the heat dissipation layer 17 in contact with the sound cavity 15, thereby achieving heat dissipation in the sound cavity region in the charging scene. Avoid local high temperature of electronic equipment and improve user experience.
  • FIG. 2 is a schematic diagram of a heat dissipation structure of an electronic device according to Embodiment 2 of the present application.
  • the heat dissipation layer 17 includes a soaking layer 171.
  • the soaking layer 171 is in contact with the main board 12, the battery 13, and the sound chamber 15.
  • the first region of the heat equalizing layer 171 of the heat dissipation layer 17 may be in contact with the first shield cover 18 of the main board 12, the second shield cover 19 of the main board 12, and the first region of the middle frame 16.
  • the second region of the soaking layer 171 is in contact with one side of the battery 13.
  • the third region of the soaking layer 171 is in contact with the side of the sound chamber 15 remote from the antenna panel 14.
  • the soaking layer 171 may be made of a heat conductive material such as copper foil or graphite, and has a high planar thermal conductivity.
  • the soaking layer 171 can be used to uniformly diffuse heat absorbed from the main board 12, the battery 13 and the sound chamber 15, effectively avoiding local heat dissipation of the electronic device.
  • the thermal conductivity of the soaking layer 171 is greater than or equal to 250 W/(m*K).
  • the heat dissipation layer 17 further includes: a heat storage layer 172 and a heat insulation layer 173.
  • the heat insulating layer 173 is in contact with the rear cover 11; the heat storage layer 172 is located between the heat insulating layer 173 and the heat equalizing layer 171.
  • the heat storage layer 172 may be formed of a phase change material, and the heat from the heat equalization layer 171 may be absorbed by the phase change, and the heat energy may be stored to alleviate the temperature rise of the back cover 11 of the electronic device.
  • the heat insulation layer 173 may be formed of a heat insulating material to prevent heat from being directly transmitted to the back cover 11 to alleviate the temperature rise of the electronic device back cover 11.
  • the thickness of the heat equalizing layer 171, the heat accumulating layer 172, and the heat insulating layer 173 may be different, and the thickness ratio of the soaking layer 171, the heat accumulating layer 172, and the heat insulating layer 173 may be, for example, 2:2.5:3.
  • the soaking layer 171 may be in contact with a portion of the surface of the sound chamber 15 that is remote from the side of the antenna panel 14.
  • the heat storage layer 172 and the heat insulation layer 173 may have a larger coverage area than the heat storage layer.
  • the specific heat capacity of the heat storage layer 172 is greater than or equal to 100 J/(g*K), and the thermal conductivity of the heat insulation layer 173 is less than or equal to 0.5 W/(m*K).
  • J is the unit of joules of heat
  • g is the mass unit of grams
  • K is the unit of thermal temperature. Erwen.
  • the specific heat capacity of the heat storage layer 172 is greater than or equal to 100 J/(g*K), which can effectively ensure the heat storage capacity of the heat storage layer 172, effectively alleviate the temperature rise of the back cover 11 of the electronic device, and the thermal conductivity of the heat insulation layer 173 is less than or Equal to 0.5W/(m*K) can also effectively alleviate the heat transfer of the heat storage layer 172 to the back cover 11, effectively alleviating the temperature rise of the back cover of the electronic device.
  • FIG. 3 is a schematic diagram of another heat dissipation structure of an electronic device according to Embodiment 2 of the present application.
  • the first divided piece 161 and the second divided piece 162 are further disposed on the middle frame 16 in a direction perpendicular to the heat dissipation layer 17 .
  • the first dividing piece 161 is for separating the main board 12 from the battery 13 in the longitudinal direction;
  • the second dividing piece 162 is for separating the battery 13 from the antenna board 14 in the longitudinal direction;
  • the longitudinal direction is perpendicular to the heat dissipation layer 17 direction.
  • a thermal conductive foam 20 is further disposed between the antenna board 14 and the second divided piece 162.
  • the electronic device heat dissipation structure may further include: a front cover, and the front cover may be, for example, a display screen of the electronic device.
  • the front cover may be located on a side of the central control 16 remote from the rear cover 11.
  • the thermally conductive foam 20 disposed between the antenna plate 14 and the second divided piece 162 can realize the heat conduction path between the second divided piece 162 and the antenna plate 14 to the sound cavity 15 of the battery 13 to realize heat diffusion on the heat conduction path, which is effective Avoid local heating of electronic equipment.
  • Embodiment 3 of the present application further provides an electronic device.
  • FIG. 4 is a schematic structural diagram of an electronic device according to Embodiment 3 of the present application.
  • the electronic device 40 can include a heat dissipation structure 41.
  • the heat dissipation structure 41 may be the heat dissipation structure described in any of the above FIGS. 1 to 3.
  • the electronic device provided in the third embodiment of the present invention can include the heat dissipation structure of the electronic device according to any of the foregoing, so that the heat dissipation of the sound cavity region can be realized on the basis of realizing the heat dissipation of the motherboard and the battery in the electronic device, thereby effectively avoiding The local heating of the electronic device realizes balanced heat dissipation of the electronic device, thereby improving the user experience.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明提出了一种用户终端的外壳和用户终端，其特征在于，所述外壳上设置有插孔，所述外壳的内侧在所述插孔处设置有密封件，所述密封件上设置有开口，所述开口位于所述插孔的中间位置，且当插针通过所述插孔穿过所述密封件时，所述密封件上的所述开口张开，并且当所述插针拔出所述密封件时，所述密封件上的所述开口闭合。因此，通过在拆卸用户终端卡托的针孔处设置密封件，使得在占用很小空间且花费成本很低的情况下，能够在针孔处实现密封，达到防水效果。

Description

电子设备散热结构及电子设备
本申请要求于2016年9月28日提交中国专利局、申请号为201621093416.3、发明名称为“电子设备散热结构及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及设备散热技术，尤其涉及一种电子设备散热结构及电子设备。
背景技术
随着电子通信技术的发展及用户对电子设备的使用需求，电子设备的实现功能越来越多，且功能越来越完善，这使得电子设备的功耗越来越大，即发热越来越严重。
用户通常可通过提高电子设备的音量，以达到其所需的音效。但是，提高电子设备的音量，无疑提高了电子设备的音腔的功率，使得音腔发热严重。同时，电子设备内音腔相邻的其他器件的热量传导至音腔，也使得音腔的发热严重。
然而，目前的电子设备中的音腔导热效果不好，使得音腔散热不好，这使得音腔发热情况下，其热量难以得到有效传导以扩散出去，使得电子设备中的音腔区域的局部高温严重。
发明内容
本申请实施例提供一种电子设备散热结构及电子设备，以避免电子设备的局部高温。
本申请实施例提供一种电子设备散热结构，包括：后盖、主板、电池、天线板、音腔和中框；其中，后盖上设置有散热层；主板上设置有第一屏蔽盖和第二屏蔽盖；音腔设置于天线板的一面上；
散热层的第一区域与主板的第一屏蔽盖接触，主板的第二屏蔽盖与中框的第一区域接触；
散热层的第二区域与电池的一面接触，电池上远离散热层的另一面与中框的第二区域接触；
散热层的第三区域与音腔上远离天线板的一面接触，天线板上远离音腔的另一面与中框的第三区域接触。
该电子设备散热结构中，由于后盖上设置的散热层既可以与主板、电池接触，还可与音腔接触，因而该电子设备散热结构在实现主板、电池散热的基础上，还可实现音腔区域的散热，有效避免局部高温，实现电子设备的均衡散热，从而提高用户体验。
可选的，散热层的第三区域与音腔上远离天线板的一面的部分或全部区域接触。
可选的，散热层的第三区域通过胶粘方式与音腔上远离天线板的一面接触；胶粘方式所使用的胶为导热用胶。
可选的，散热层的第三区域通过焊接方式与音腔上远离天线板的一面接触。
由于该胶粘方式或焊接方式采用的材料均为导热材料，散热层通过胶粘方式或焊接方式与音腔接触，可提高散热层与音腔间的热传导，提高热传输效率。
可选的，散热层的第一区域也可通过胶粘方式或焊接方式与主板的第一屏蔽盖接触， 主板的第二屏蔽盖也可通过胶粘方式或焊接方式与中框的第一区域接触。该胶粘方式所使用的胶也可以为导热用胶，该焊接方式所使用的焊剂为导热焊剂。
由于该胶粘方式或焊接方式采用的材料均为导热材料，散热层通过胶粘方式或焊接方式与第一屏蔽盖接触，可提高散热层与第一屏蔽盖间的热传导，从而提高主板与散热层的热传导，提高热传输效率。
可选的，散热层的第二区域也可通过胶粘方式或焊接方式与电池接触，电池上远离散热层的另一面也可通过胶粘方式或焊接方式与中框的第二区域接触。该胶粘方式所使用的胶也可以为导热用胶，该焊接方式所使用的焊剂为导热焊剂。
由于该胶粘方式或焊接方式采用的材料均为导热材料，散热层通过胶粘方式或焊接方式与电池接触，可提高散热层与电池间的热传导，提高热传输效率。
可选的，音腔的材料为导热材料；导热材料包括如下任一：导热塑料、陶瓷、金属。
采用导热材料构成的音腔，可使得音腔内的器件产生的热量更好地传导至音腔表面，从而有效扩散出去。
可选的，导热材料的介电常数小于或等于8，导热材料的损耗角小于或等于0.01，导热材料的导热系数大于或等于1W/(m*K)。
音腔的导热材料的介电常数小于或等于8，可在音腔内的器件产生的热量更好地传导至音腔表面的基础上，有效避免音腔内的器件的电干扰。音腔的导热材料的导热系数大于或等于1W/(m*K)，提音腔内器件与音腔间的热传导，提高热传输效率。
可选的，天线板上还设置有充电器件。
充电器件在充电过程中产生的热量，可通过天线板传输至音腔，继而通过与音腔接触的散热层扩散出去，还可实现充电场景中音腔区域的散热，避免电子设备局部高温，提高用户体验。
可选的，散热层包括：均热层；均热层与主板、电池和天线板接触。
均热层可将从主板、电池和音腔吸收的热量均匀扩散，有效避免电子设备的局域散热。
可选的，均热层的导热系数大于或等于250W/(m*K)。
可选的，散热层还包括：蓄热层和隔热层；隔热层与后盖接触；蓄热层位于隔热层和均热层中间。
蓄热层可利用相变吸收来自均热层的热量，并将热能储存，以缓解电子设备后盖的温升。隔热层可以阻止热量直接传输至后盖，以缓解电子设备后盖的温升。
可选的，蓄热层的比热容大于或等于100J/(g*K)，隔热层的导热系数小于或等于0.5W/(m*K)。
可选的，中框上垂直于散热层的方向还设置有：第一分割片和第二分割片；第一分割片用于将主板与电池沿纵向分隔开；第二分割片用于将电池与天线板沿纵向分隔开；纵向为垂直于散热层的方向。
可选的，天线板与第二分割片之间还设置有导热泡棉。
天线板与第二分割片之间设置的导热泡棉，可实现电池依次第二分割片、天线板至音腔间的热传导通路，实现热传导通路上的热扩散，有效避免电子设备的局部发热。
本申请实施例还提供一种电子设备，包括如上任一所述的散热结构。
本申请实施例提供的电子设备散热结构及电子设备，其中，电子设备散热结构可包括 后盖、主板、电池、天线板、音腔和中框；其中，该后盖上设置有散热层；该主板上设置有第一屏蔽盖和第二屏蔽盖；该音腔设置于该天线板的一面上；该散热层的第一区域与该主板的第一屏蔽盖接触，该主板的该第二屏蔽盖与该中框的第一区域接触；该散热层的第二区域与该电池的一面接触，该电池上远离该散热层的另一面与该中框的第二区域接触；该散热层的第三区域与该音腔上远离该天线板的一面接触，该天线板上远离该音腔的另一面与该中框的第三区域接触。该电子设备散热结构中，由于后盖上设置的散热层既可以与主板、电池接触，还可与音腔接触，因而该电子设备散热结构在实现主板、电池散热的基础上，还可实现音腔区域的散热，有效避免局部高温，实现电子设备的均衡散热，从而提高用户体验。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图做一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例一提供的一种电子设备散热结构的示意图；
图2为本申请实施例二提供的一种电子设备散热结构的示意图；
图3为本申请实施例二提供的另一种电子设备散热结构的示意图；
图4为本申请实施例三提供的电子设备的结构示意图。
附图标记说明：
11：后盖；
12：主板；
13：电池；
14：天线板；
15：音腔；
16：中框；
161：第一分割片；
162：第二分割片；
17：散热层；
171：均热层；
172：蓄热层；
173：隔热层；
18：第一屏蔽盖；
19：第二屏蔽盖；
20：导热泡棉；
40：电子设备；
41：散热结构。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例一提供一种电子设备散热结构。该散热结构可以位于电子设备中，该电子设备例如可以为手机、笔记本电脑、平板电脑等电子设备。图1为本申请实施例一提供的一种电子设备散热结构的示意图。如图1所示，电子设备散热结构可包括：后盖11、主板12、电池13、天线板14、音腔15和中框16。其中，后盖11上设置有散热层17；主板12上设置有第一屏蔽盖18和第二屏蔽盖19；音腔15设置于天线板14的一面上。
散热层17的第一区域与主板12的第一屏蔽盖18接触，主板12的第二屏蔽盖19与中框16的第一区域接触。
散热层17的第二区域与电池13的一面接触，电池13上远离散热层17的另一面与中框16的第二区域接触。
散热层17的第三区域与音腔15上远离天线板14的一面接触，天线板14上远离音腔15的另一面与中框16的第三区域接触。
具体地，主板12和天线板14均可以为印制电路板(Printed Circuit Board，简称PCB)。其中，主板12上可集成有处理器等器件，该天线板14上可集成有天线阵列的布线等天线器件。其中，该天线器件例如可以包括：移动通信天线、无线保真(WIreless-Fidelity，简称Wifi)天线、全球定位系统(Global Positioning System，简称GPS)天线、蓝牙(Bluetooth)天线、近场通信(Near Field Communication，简称NFC)天线、无线充电(Wireless Charge)天线等至少一种天线。其中，该移动通信天线可以为第二代(2nd Generation，简称2G)通信天线、第三代(3rd Generation，简称3G)通信天线、第四代(4th Generation，简称3G)通信天线、第五代(5th Generation，简称5G)通信天线以及后续演进通信技术的天线中至少一种。该天线器件的例如可以是在450MHz～5GHz的范围内。通常情况下，主板12也可称为大板，对应的天线板14可称为小板。
主板12上的可设置有多个屏蔽盖，主板12上的器件可通过屏蔽盖隔离相邻器件的干扰，即该屏蔽盖用于将主板12上的器件的电特性进行屏蔽保护。其中，第一屏蔽盖18可指代该多个屏蔽盖中与散热层17接触的屏蔽盖，第二屏蔽盖19可指代该多个屏蔽盖中与中框16接触的屏蔽盖。也就是说，第一屏蔽盖18和第二屏蔽盖19分别指代一类屏蔽盖，则其分别可包括至少一个屏蔽盖。需要说明的是，图1中仅以第一屏蔽盖18和第二屏蔽盖19分别包括一个屏蔽盖的情况进行说明，本申请不以此作为限制。
音腔15内可包括声音器件如扬声器(Speaker)和受话器(Receiver)，扬声器和受话器可设置与天线板14上。散热层17可以为导热系数大于预设次数的导热材料构成的导热层，也可以为导热材料与其他材料组成的复合导热层，本申请不以此作为限制。
散热层17的第一区域与主板12的第一屏蔽盖18接触，可使得主板12的热量通过第一屏蔽盖18传输至散热层17，实现主板12区域的散热。主板12的第二屏蔽盖19与中框16的第一区域接触，可使得主板12固定在中框16上，使得主板12在电子设备中的稳 定，有效保证主板12上的器件的性能。
散热层17的第二区域与电池13的一面接触，可将电池13的热量通过传输至散热层17，实现电池13区域的散热。电池13上远离散热层17的另一面还与中框16的第二区域接触，可使得电池13固定在中框16上，使得电池13在电子设备中的稳定。
散热层17的第三区域与音腔15上远离天线板14的一面接触，实际是，建立了散热层17与音腔15的热关联，以将音腔15的热量通过传输至散热层17，实现音腔15区域的散热。天线板14上远离音腔15的另一面与中框16的第三区域接触，可将天线板14固定在中框16上，使得天线板14在电子设备中的稳定。需要说明的是，音腔15的热量包括音腔15内发热器件产生的热量，还包括与音腔15相邻部件如天线板14产生的热量。
本申请实施例一提供的电子设备散热结构，可包括后盖、主板、电池、天线板、音腔和中框；其中，该后盖上设置有散热层；该主板上设置有第一屏蔽盖和第二屏蔽盖；该音腔设置于该天线板的一面上；该散热层的第一区域与该主板的第一屏蔽盖接触，该主板的该第二屏蔽盖与该中框的第一区域接触；该散热层的第二区域与该电池的一面接触，该电池上远离该散热层的另一面与该中框的第二区域接触；该散热层的第三区域与该音腔上远离该天线板的一面接触，该天线板上远离该音腔的另一面与该中框的第三区域接触。该电子设备散热结构中，由于后盖上设置的散热层既可以与主板、电池接触，还可与音腔接触，因而该电子设备散热结构在实现主板、电池散热的基础上，还可实现音腔区域的散热，有效避免游戏、视频、音乐等场景中音腔区域的局部高温，实现电子设备的均衡散热，从而提高用户体验。
可选的，散热层17的第三区域与音腔15上远离天线板14的一面的部分或全部区域接触。
可选的，散热层17的第三区域可通过胶粘方式或焊接方式与音腔15上远离天线板14的一面接触；该胶粘方式所使用的胶为导热用胶，该焊接方式所使用的焊剂为导热焊剂。
天线板14上远离音腔15的另一面可通过螺钉与中框16的第三区域接触，该螺钉例如可以为导热螺钉。
具体地，由于该胶粘方式或焊接方式采用的材料均为导热材料，散热层17通过胶粘方式或焊接方式与音腔15接触，可提高散热层17与音腔15间的热传导，提高热传输效率。
可选的，散热层17的第一区域也可通过胶粘方式或焊接方式与主板12的第一屏蔽盖18接触，主板12的第二屏蔽盖19也可通过胶粘方式或焊接方式与中框16的第一区域接触。该胶粘方式所使用的胶也可以为导热用胶，该焊接方式所使用的焊剂为导热焊剂。
具体地，由于该胶粘方式或焊接方式采用的材料均为导热材料，散热层17通过胶粘方式或焊接方式与第一屏蔽盖18接触，可提高散热层17与第一屏蔽盖18间的热传导，从而提高主板12与散热层的热传导，提高热传输效率。
可选的，散热层17的第二区域也可通过胶粘方式或焊接方式与电池13接触，电池13上远离散热层17的另一面也可通过胶粘方式或焊接方式与中框16的第二区域接触。该胶粘方式所使用的胶也可以为导热用胶，该焊接方式所使用的焊剂为导热焊剂。
具体地，由于该胶粘方式或焊接方式采用的材料均为导热材料，散热层17通过胶粘 方式或焊接方式与电池13接触，可提高散热层17与电池13间的热传导，提高热传输效率。
可选的，音腔15的材料为导热材料；该导热材料包括如下任一：导热塑料、陶瓷、金属等。
具体地，音腔15的材料设置为导热材料，可使得音腔15内的器件产生的热量更好地传导至音腔15表面，从而有效扩散出去。需要说明的是，该音腔15的材料还可以为其他的导热材料，导热塑料、陶瓷、金属仅为示例说明，本申请不以此作为限制。
可选的，该导热材料的介电常数小于或等于8，该导热材料的损耗角小于或等于0.01，该导热材料的导热次数大于或等于1W/(m*K)，其中，W为热量的单位瓦，m为单位米，K为热力温度单位开尔文。
具体地，音腔15的导热材料的介电常数小于或等于8，可在音腔15内的器件产生的热量更好地传导至音腔15表面的基础上，有效避免音腔15内的器件的电干扰。音腔15的导热材料的导热系数大于或等于1W/(m*K)，提音腔15内器件与音腔15间的热传导，提高热传输效率。
可选的，天线板14上还设置有充电器件，充电器件可位于音腔15内。
具体地，充电器件在充电过程中产生的热量，可通过天线板14传输至音腔15，继而通过与音腔15接触的散热层17扩散出去，还可实现充电场景中音腔区域的散热，避免电子设备局部高温，提高用户体验。
图2为本申请实施例二提供的一种电子设备散热结构的示意图。如图2所示，如上所述的电子设备散热结构中，散热层17包括：均热层171。均热层171与主板12、电池13和音腔15接触。
具体地，散热层17的均热层171的第一区域可以与主板12的第一屏蔽盖18，主板12的第二屏蔽盖19与中框16的第一区域接触。均热层171的第二区域与电池13的一面接触。均热层171的第三区域与音腔15上远离天线板14的一面接触。
均热层171可以为是由铜箔、石墨等导热材料构成，具有较高的平面导热系数。均热层171可用于将从主板12、电池13和音腔15吸收的热量均匀扩散，有效避免电子设备的局域散热。
可选的，该均热层171的导热系数大于或等于250W/(m*K)。
可选的，散热层17还包括：蓄热层172和隔热层173。隔热层173与后盖11接触；蓄热层172位于隔热层173和均热层171中间。
具体地，蓄热层172可以有相变材料构成，可利用相变吸收来自均热层171的热量，并将热能储存，以缓解电子设备后盖11的温升。隔热层173可以有隔热材料构成，可阻止热量直接传输至后盖11，以缓解电子设备后盖11的温升。其中，均热层171、蓄热层172和隔热层173的厚度可以不同，均热层171、蓄热层172和隔热层173的厚度比例如可以为2：2.5：3。
为保证天线板14上天线器件的电性能，均热层171可以是与音腔15上远离天线板14的一面的部分区域接触。蓄热层172和隔热层173的覆盖面积可大于均热层。
可选的，蓄热层172的比热容大于或等于100J/(g*K)，隔热层173的导热系数小于或等于0.5W/(m*K)。其中，J为热量的单位焦耳，g为质量单位克，K为热力温度单位开 尔文。
蓄热层172的比热容大于或等于100J/(g*K)可有效保证蓄热层172的储热能力，有效缓解电子设备后盖11的温升，并且，隔热层173的导热系数小于或等于0.5W/(m*K)也可有效缓解蓄热层172的热量至后盖11的传输，有效缓解电子设备后盖的温升。
图3为本申请实施例二提供的另一种电子设备散热结构的示意图。如图3所示，如上任一所述的电子设备散热结构中，中框16上垂直于散热层17的方向还设置有：第一分割片161和第二分割片162。第一分割片161用于将主板12与电池13沿纵向分隔开；第二分割片162用于将电池13与天线板14沿所该纵向分隔开；该纵向为垂直于散热层17的方向。
可选的，天线板14与第二分割片162之间还设置有导热泡棉20。
可选的，电子设备散热结构中还可包括：前盖，前盖例如可以为电子设备的显示屏。前盖可位于中控16的远离后盖11的一侧。
天线板14与第二分割片162之间设置的导热泡棉20，可实现电池13依次第二分割片162、天线板14至音腔15间的热传导通路，实现热传导通路上的热扩散，有效避免电子设备的局部发热。
本申请实施例三还提供一种电子设备。图4为本申请实施例三提供的电子设备的结构示意图。如图4所示，电子设备40可包括散热结构41。散热结构41可以为上述图1至图3中任一所述的散热结构。
本申请实施例三提供的电子设备，由于可包括上述任一所述的电子设备散热结构，因而可在实现电子设备内主板、电池散热的基础上，还可实现音腔区域的散热，有效避免电子设备的局部发热，实现电子设备的均衡散热，从而提高用户体验。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (14)

  1. 一种电子设备散热结构，其特征在于，包括：后盖、主板、电池、天线板、音腔和中框；其中，所述后盖上设置有散热层；所述主板上设置有第一屏蔽盖和第二屏蔽盖；所述音腔设置于所述天线板的一面上；
    所述散热层的第一区域与所述主板的所述第一屏蔽盖接触，所述主板的所述第二屏蔽盖与所述中框的第一区域接触；
    所述散热层的第二区域与所述电池的一面接触，所述电池上远离所述散热层的另一面与所述中框的第二区域接触；
    所述散热层的第三区域与所述音腔上远离所述天线板的一面接触，所述天线板上远离所述音腔的另一面与所述中框的第三区域接触。
  2. 根据权利要求1所述的散热结构，其特征在于，所述散热层的第三区域与所述音腔上远离所述天线板的一面的部分或全部区域接触。
  3. 根据权利要求1或2所述的散热结构，其特征在于，所述散热层的第三区域通过胶粘方式与所述音腔上远离所述天线板的一面接触；所述胶粘方式所使用的胶为导热用胶。
  4. 根据权利要求1或2所述的散热结构，其特征在于，所述散热层的第三区域通过焊接方式与所述音腔上远离所述天线板的一面接触。
  5. 根据权利要求1-4中任一项所述的散热结构，其特征在于，所述音腔的材料为导热材料；所述导热材料包括如下任一：导热塑料、陶瓷、金属。
  6. 根据权利要求5所述的散热结构，其特征在于，所述导热材料的介电常数小于或等于8，所述导热材料的损耗角小于或等于0.01，所述导热材料的导热系数大于或等于1W/(m*K)。
  7. 根据权利要求1-6中任一项所述的散热结构，其特征在于，所述天线板上还设置有充电器件。
  8. 根据权利要求1-7中任一项所述的散热结构，其特征在于，所述散热层包括：均热层；所述均热层与所述主板、所述电池和所述天线板接触。
  9. 根据权利要求8所述的散热结构，其特征在于，所述均热层的导热系数大于或等于250W/(m*K)。
  10. 根据权利要求8所述的散热结构，其特征在于，所述散热层还包括：蓄热层和隔热层；所述隔热层与所述后盖接触；所述蓄热层位于所述隔热层和所述均热层中间。
  11. 根据权利要求10所述的散热结构，其特征在于，所述蓄热层的比热容大于或等于100J/(g*K)，所述隔热层的导热系数小于或等于0.5W/(m*K)。
  12. 根据权利要求1-11中任一项所述的散热结构，其特征在于，所述中框上垂直于所述散热层的方向还设置有：第一分割片和第二分割片；所述第一分割片用于将所述主板与所述电池沿纵向分隔开；所述第二分割片用于将所述电池与所述天线板沿所述纵向分隔开；所述纵向为垂直于散热层的方向。
  13. 根据权利要求12所述的散热结构，其特征在于，所述天线板与所述第二分割片之间还设置有导热泡棉。
  14. 一种电子设备，其特征在于，包括：如上所述的权利要求1-13中任一项所述的散热结构。
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US10729036B2 (en) 2020-07-28
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US11122710B2 (en) 2021-09-14
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US20200344915A1 (en) 2020-10-29
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