WO2018120711A1 - 显示基板及其制备方法、显示面板 - Google Patents

显示基板及其制备方法、显示面板 Download PDF

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Publication number
WO2018120711A1
WO2018120711A1 PCT/CN2017/091037 CN2017091037W WO2018120711A1 WO 2018120711 A1 WO2018120711 A1 WO 2018120711A1 CN 2017091037 W CN2017091037 W CN 2017091037W WO 2018120711 A1 WO2018120711 A1 WO 2018120711A1
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Prior art keywords
dielectric film
sub
pixel unit
display substrate
light
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Ceased
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PCT/CN2017/091037
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English (en)
French (fr)
Inventor
齐永莲
曲连杰
贵炳强
赵合彬
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Priority to US15/745,008 priority Critical patent/US10497758B2/en
Priority to EP17825358.9A priority patent/EP3565002B1/en
Publication of WO2018120711A1 publication Critical patent/WO2018120711A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133617—Illumination with ultraviolet light; Luminescent elements or materials associated to the cell
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • G02B5/283—Interference filters designed for the ultraviolet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/876—Arrangements for extracting light from the devices comprising a resonant cavity structure, e.g. Bragg reflector pair
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/30—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 grating
    • G02F2201/307—Reflective grating, i.e. Bragg grating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/05—Function characteristic wavelength dependent
    • G02F2203/055—Function characteristic wavelength dependent wavelength filtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • At least one embodiment of the present disclosure is directed to a display substrate, a method of fabricating the same, and a display panel.
  • the array structure and the color filter structure can be made on the same substrate, and the color film structure is formed on the array structure, and the structure can be used to better realize the display panel. Dimensional.
  • the color film structure may also be prepared on the opposite substrate opposite to the array substrate in the display panel.
  • At least one embodiment of the present disclosure provides a display substrate including: a first substrate; the first substrate includes a plurality of pixel units, each of the pixel units including at least a first sub-pixel unit, a second sub-pixel unit, and a third sub-pixel unit; a dielectric film stack disposed on the first substrate, the dielectric film stack covering at least the first sub-pixel unit and the second sub-pixel unit; wherein the dielectric film The laminate is configured to eliminate blue light having a first wavelength range through the dielectric film stack, the dielectric film stack including at least one first dielectric film layer and at least one second dielectric film layer alternately stacked, The refractive index of the first dielectric film layer is greater than the refractive index of the second dielectric film layer.
  • the central wavelength of the blue light ranges from 400 to 460 nm.
  • the optical thickness of each film layer in the dielectric film stack includes one quarter of the center wavelength of the blue light.
  • the dielectric film stack is configured to eliminate blue light within at least 35 nanometers of bandwidth with respect to a center wavelength.
  • the dielectric film laminate The optical thickness of each film layer satisfies the following formula:
  • nh is the optical thickness of the corresponding film layer
  • n is the refractive index of the corresponding film layer
  • h is the thickness of the corresponding film layer
  • m is the interference level
  • ⁇ is the center wavelength of the light.
  • the first dielectric film layer material includes at least one of silicon nitride, zinc sulfide, aluminum, and silver; and/or the second dielectric film layer material At least one of silicon oxide and magnesium fluoride is included.
  • each of the pixel units includes an organic light emitting diode that emits white light or blue light.
  • the organic light emitting diode includes at least a first electrode layer, a light emitting layer, and a second electrode layer which are sequentially stacked.
  • the first sub-pixel unit is a red sub-pixel unit
  • the second sub-pixel unit is a green sub-pixel unit
  • the third sub-pixel unit is blue.
  • the color sub-pixel unit is a red sub-pixel unit
  • the blue sub-pixel unit includes a blue color film disposed on a light exiting side of the organic light emitting diode.
  • the blue sub-pixel unit further includes the dielectric film stack on a side of the blue color film facing away from the organic light emitting diode.
  • the organic light emitting diode emits blue light
  • the green sub-pixel unit includes a green fluorescent film disposed between the dielectric film stack and the organic light emitting diode.
  • the organic light emitting diode emits white light
  • the green sub-pixel unit includes the green layer disposed between the dielectric film stack and the organic light emitting diode Fluorescent film and green color film.
  • the green color film is disposed between the green fluorescent film and the dielectric film laminate.
  • the organic light emitting diode emits white light
  • the red sub-pixel unit includes a red fluorescent film disposed between the dielectric film stack and the organic light emitting diode.
  • the organic light emitting diode emits white light
  • the red sub-pixel unit includes a red fluorescent film and a red color disposed between the dielectric film laminate and the organic light emitting diode. At least one of the color films.
  • the red color film is disposed between the red fluorescent film and the dielectric film laminate.
  • At least one embodiment of the present disclosure provides a display panel comprising the display substrate of any of the above.
  • At least one embodiment of the present disclosure provides a method of fabricating a display substrate, including: providing a first substrate including a plurality of sub-pixel units; forming a dielectric film stack on the first substrate of the sub-pixel unit; wherein the medium The film stack is disposed to eliminate blue light having a first wavelength range through the dielectric film stack, the dielectric film stack including at least one first dielectric film layer and at least one second dielectric film layer alternately stacked, The refractive index of the first dielectric film layer is greater than the refractive index of the second dielectric film layer.
  • interference with incident light can eliminate blue light having or near the first central wavelength range, thereby avoiding poor display effect caused by blue light in the central wavelength range;
  • the arrangement of the dielectric film laminate can prevent, for example, water vapor from entering the display substrate, and can play a certain packaging role and reduce the cost.
  • forming the dielectric film stack on the first substrate includes plasma chemical vapor deposition.
  • FIG. 1 is a schematic cross-sectional view showing a red sub-pixel region of a display substrate
  • FIG. 2 is a schematic cross-sectional view showing another red sub-pixel region of a display substrate
  • 3a is a cross-sectional structural diagram of a red sub-pixel region of a display substrate according to an embodiment of the present disclosure
  • 3b is a cross-sectional structural diagram of a blue color sub-pixel region of a display substrate according to an embodiment of the present disclosure
  • FIG. 4a is a cross-sectional structural diagram of another red sub-pixel region of a display substrate according to an embodiment of the present disclosure
  • 4b is a cross-sectional structural diagram of another green sub-pixel region of a display substrate according to an embodiment of the present disclosure
  • 4c is a cross-sectional structural diagram of another blue sub-pixel region of a display substrate according to an embodiment of the present disclosure
  • FIG. 4 is a cross-sectional structural diagram of another blue sub-pixel region of a display substrate according to an embodiment of the present disclosure.
  • the color gamut of the sub-pixel unit of the display panel is increased by the color film; the spectrum of the light-emitting unit and the transmission spectrum of the color film are limited, and the brightness of the light emitted by the light-emitting unit is greatly reduced after passing through the color film.
  • the fluorescent film can increase the luminescence peak of the light and reduce the half width of the wavelength of the light. If the fluorescent film is disposed in the sub-pixel unit, a higher color gamut than the conventional color film currently used can be achieved, but the fluorescent film is subjected to, for example, a short-wavelength blue light. It emits light upon excitation, so in order to improve the color gamut and prevent reflection and luminescence caused by excitation of the outside world such as blue light, it is still necessary to provide a color film on the fluorescent film.
  • the fluorescent film can be applied to a display substrate, and has a characteristic that the luminescence peak is adjustable and the half width is narrowed, and a better color gamut can be obtained as compared with a method of arranging a color film in the pixel region.
  • the fluorescent film is excited by the blue component of natural light, so it needs to be on the fluorescent film.
  • the color film is further disposed, and the color gamut of the light emitted by the pixel region is improved while preventing reflection and light emission caused by external blue light excitation by filtering the light.
  • the color film is placed on each pixel area to cause an additional process flow, and the color film setting also reduces the brightness of the light passing through and does not achieve high light extraction efficiency.
  • the light source of the current display substrate may include, for example, blue light or white light, and the structure of the sub-pixel units of different colors is different for a light source that supplies light of different colors.
  • the current technology will be described below by taking a red sub-pixel unit in the display substrate as an example.
  • FIG. 1 is a schematic cross-sectional view showing a red sub-pixel region of a display substrate.
  • the display substrate is a fluorescent film layer structure
  • the light source is blue light
  • a color film layer 130 and a fluorescent film layer 140 are sequentially disposed on the first substrate 110 in the sub-pixel unit.
  • the fluorescent film layer 140 may be, for example, a red fluorescent film layer, that is, red light may be emitted after excitation by blue light, but for example, blue light in an external environment may also be excited to the fluorescent film layer 140, so that the external blue light is prevented from exciting the fluorescent film layer.
  • the resulting reflection requires the red color film 130 to be disposed on the fluorescent film layer 140 to block, for example, blue light in the external environment.
  • the color filter layer 130 is provided on the first substrate 110 in the sub-pixel unit.
  • the color film layer 130 may be, for example, a red color film.
  • the white light emitted by the light source transmits red light after passing through the red color film, but because the spectrum of the white light is limited, the color gamut of the sub-pixel unit emits light is low, for example, If measured in the color gamut of up to 85-90% in the NTSC (National Television Standards Committee abbreviation, the National Television Standards Committee) standard, white light cannot achieve a high color gamut in the related art.
  • NTSC National Television Standards Committee abbreviation, the National Television Standards Committee
  • the display substrate includes a first substrate and a dielectric film stack disposed on the first substrate, the first substrate includes a plurality of pixel units, each of the pixel units including at least a first sub-pixel unit, a second sub-pixel unit, and a third sub-pixel a pixel unit, the dielectric film stack covering at least the first sub-pixel unit and the second sub-pixel unit.
  • the dielectric film stack may, for example, be disposed to eliminate only blue light having a first wavelength range laminated through the dielectric film, the dielectric film laminate including at least one first dielectric film layer and at least one first alternately stacked a dielectric film layer having a refractive index greater than a refractive index of the second dielectric film layer.
  • the dielectric film laminate including at least one first dielectric film layer and at least one first alternately stacked a dielectric film layer having a refractive index greater than a refractive index of the second dielectric film layer.
  • the dielectric film stack is disposed in a light emitting direction of the first sub-pixel unit, wherein the light emitting direction is an emitting direction of the light provided in the backlight or a direction in which the first sub-pixel unit of the display substrate provides a display to the external environment; It may be disposed on a side of the first substrate facing the external environment of the display side, and may also be disposed between the first substrate and the backlight; and for the first sub-pixel unit provided with the fluorescent film layer, the dielectric film layer is disposed in the external environment Between the layer and the fluorescent film layer.
  • interference with the incident light can eliminate blue light having or near the first central wavelength range, thereby avoiding blue light in the central wavelength range, for example, exciting the fluorescent film layer.
  • the resulting display is not good.
  • a short-wavelength blue light may excite the fluorescent film layer to emit light, for example, to generate blue light.
  • the dielectric film stack can eliminate the blue light incident in the external environment in the wavelength range that can be excited by the fluorescent film layer, so as to avoid the excitation of the blue light on the fluorescent film layer in the external environment; on the other hand, the backlight can be eliminated, for example.
  • the blue light in the excitation excites the blue light emitted by the fluorescent film; and the arrangement of the dielectric film laminate can prevent, for example, water vapor from entering the display substrate, which can serve as a certain package and reduce the cost.
  • the dielectric film stack may be disposed, for example, only to eliminate blue light having a first wavelength range through the dielectric film stack, that is, light of other wavelength bands such as blue light or other colors may be passed.
  • the first substrate can also, for example, together with the dielectric film stack together eliminate light, for example blue light, in the first wavelength range.
  • the first substrate has a high refractive index with respect to the second dielectric film layer, and the second dielectric film layer is disposed between the first substrate and the first dielectric film layer, so that the light is reflected in the second dielectric film layer, thereby making Interference occurs between the beams, thereby eliminating the light having the first center wavelength using the principle of interference cancellation.
  • the refractive index between the layers in the dielectric film stack is different, and by the arrangement of, for example, the thickness, the refractive index, and the number of layers, etc., it is possible to eliminate the lamination through the dielectric film by, for example, the principle of interference elimination of light. It has blue light in the first wavelength range.
  • a fluorescent film layer capable of improving a color gamut is disposed in the first sub-pixel unit, and the dielectric film layer is disposed to eliminate, for example, blue light that has an excitation effect on the fluorescent film layer, thereby eliminating the need to provide a color film structure. .
  • the display substrate is not limited to
  • the display substrate of the light-emitting diode as a light source can also be applied, for example, to a liquid crystal display substrate.
  • a fluorescent film layer may be disposed in the first sub-pixel unit of the display substrate to improve the color gamut displayed by the first sub-pixel unit, and the dielectric film layer may be disposed on the display substrate. Part of the blue light that is laminated through the dielectric film is eliminated, thereby eliminating emission and reflection caused by the blue light-excited fluorescent film layer.
  • a technical solution in the following embodiments of the present disclosure will be explained by taking a display substrate of an organic light emitting diode as a light source as an example.
  • the number of sub-pixel units in each pixel unit is not limited, and for the first sub-pixel unit, the second sub-pixel unit, and the third sub-pixel unit
  • the color of the light is not limited.
  • the first sub-pixel unit is a red sub-pixel unit
  • the second sub-pixel unit is a green sub-pixel unit
  • the third sub-pixel unit is a blue sub-pixel unit.
  • R is not denoted by red light
  • G is represented by green light
  • B is represented by blue light
  • W is represented by white light.
  • At least one embodiment of the present disclosure provides a display substrate, which may include, for example, three sub-pixel units of red, green, and blue, and for different colors of light sources (eg, blue light, white light, etc.), the three sub-pixel units have different settings. structure.
  • the red sub-pixel unit is selected to explain the structure and function of the display substrate in the case where the light source supplies blue light.
  • the functional interpretation of each structure in the red sub-pixel unit is equally applicable to sub-pixel units of other colors.
  • FIG. 3a is a schematic cross-sectional structural view of a red sub-pixel region of a display substrate according to an embodiment of the present disclosure.
  • the display substrate includes a first substrate 110, a sub-pixel unit disposed on the first substrate 110, and a dielectric film stack 100 disposed in a light emitting direction of the sub-pixel unit.
  • the dielectric film stack 100 can eliminate, for example, blue light having a first wavelength range laminated through the dielectric film, and the dielectric film laminate 100 includes at least one first dielectric film layer 101 and at least one second dielectric film alternately stacked.
  • the layer 102, the dielectric film stack 100 may include, for example, at least three first dielectric film layers and at least three second dielectric film layers, or the dielectric film stack 100 may include, for example, at least five first dielectric film layers and at least five a second dielectric film layer, the first dielectric film layer 101 has a refractive index greater than the second medium The refractive index of the film layer 102.
  • the dielectric film stack 100 is composed of a three-layer film, that is, a second dielectric film layer is disposed between two first dielectric film layers of high refractive index.
  • the first dielectric film layer may be a film having light transmissivity, such as a film of silver having high reflectivity
  • the second dielectric film layer is a layer of low refractive index and transparent magnesium fluoride film.
  • the light entering the second dielectric film layer will be reflected at the interface with the first dielectric film layer, whereby the light will be reflected multiple times within the second dielectric film layer, that is, between the second dielectric film layers.
  • the specific structure of the dielectric film laminate 100 is not limited, and the dielectric film laminate 100 is not limited to the above-described three-layer film structure, as long as the dielectric film laminate 100 can be eliminated. It can pass through the blue light in the first wavelength range.
  • the dielectric film stack 100 may also be a multi-layer film structure, which may be regarded as a structure in which a spacer layer is disposed between two high reflective film systems, and the above three-layer film system.
  • the basic working principle of the dielectric film stack of the structure is the same, and all are optical interference cancellation.
  • the second dielectric film layer 102 can be used as a spacer layer, and the high reflective film system can be regarded as a multilayer film system in which a plurality of high refractive index film layers and low refractive index film layers are alternately arranged.
  • the thickness of each film layer in the dielectric film stack 100 one or more central wavelengths of light can be filtered by the principle of optical interference cancellation.
  • the related content in the embodiment the embodiment regarding the thickness calculation of the second dielectric film layer 102 is not described herein.
  • the dielectric film stack 100 may further include a plurality of other film layers such as a third dielectric film layer 103 and the like.
  • a third dielectric film layer 103 the material of the third dielectric film layer 103 may be the same as that of the first dielectric film layer 101, or Other materials are used as long as the refractive index thereof is larger than the refractive index of the second dielectric film layer 102.
  • the materials between the two low refractive index film layers adjacent to the high refractive index film layer may be the same or different.
  • the high refractive index film layer is uniformly represented by the first dielectric film layer 101, and the low refractive index film layer is collectively represented by the second dielectric film layer 102. It will be understood by those skilled in the art that in the present disclosure, the high refractive index layer and the low refractive index layer refer to different refractive index differences between different film layers, and are not the first refractive index values.
  • the fluorescent film layer can be excited by a plurality of kinds of light to generate a plurality of kinds of light.
  • blue light or violet light can be excited to emit red light, and the red fluorescent light is emitted.
  • the film may be excited by blue light or ultraviolet light to generate a small amount of blue light.
  • the center wavelength of the excited blue light is different from the center wavelength of the incident blue light, but for example, the blue light generated by the excitation may be within the range of the first range wavelength, for example. .
  • the eliminated blue light refers to blue light in the first wavelength range (eg, the first center wavelength to the second center wavelength) that the dielectric film stack can eliminate or absorb, which is eliminated.
  • the blue light in this wavelength range may, for example, include blue light in a corresponding wavelength range in the environment and blue light in a corresponding wavelength range emitted by the excited fluorescent film such as a red fluorescent film.
  • the blue light in the external environment has been eliminated or attenuated by the dielectric film stack 100 during the process of entering the sub-pixel unit (the proportion of blue light at wavelengths that have not been eliminated or attenuated is very small, and can even be ignored), even if it remains Unremoved blue light or other light that can excite the fluorescent film layer, such as violet light, after the fluorescent film layer is excited, other light emitted by the fluorescent film, such as blue light, is again removed or attenuated by the dielectric film stack 100, so that the external reflection is Or the proportion of the emitted blue light in the light emitted by the sub-pixel unit is very limited, negligible, and the arrangement of the dielectric film stack 100 can be considered to a certain extent to eliminate the luminescence caused by, for example, blue light excitation of the fluorescent film layer. Reflection phenomenon.
  • a fluorescent film layer 140 may be disposed in the sub-pixel unit, and the fluorescent film layer 140 may be disposed, for example, on a side of the dielectric film laminate 100 away from the external environment.
  • the fluorescent film layer 140 may be, for example, a red fluorescent film which emits red light and blue light after being excited by blue light.
  • the red light emitted by the red fluorescent film excited by the blue light or the red light in the external environment enters the sub-pixel unit, but does not affect the display for the red sub-pixel unit; the blue light emitted by the red fluorescent film is excited by the blue light.
  • the dielectric film stack 100 is removed, and the blue light irradiated in the ambient light is also eliminated by the dielectric film stack 100, and the fluorescent film layer 140 cannot be excited.
  • the preparation material of the first dielectric film layer 101 may include, for example, at least one of silicon nitride, zinc sulfide, aluminum, and silver; or the preparation material of the second dielectric film layer 102 may be, for example, At least one of silicon oxide and magnesium fluoride is included. It should be noted that, for example, when the material of the first dielectric film layer 101 is a metal material such as aluminum or silver, it is a film in a transparent or translucent state.
  • each dielectric film layer in the dielectric film laminate 100 is not limited to the above-mentioned materials, and the same technical effects can be obtained as long as the refractive indices between the first dielectric film layer 101 and the second dielectric film layer 102 are different.
  • the fluorescent film layer can be formed by adding a fluorescent material instead of the pigment particles in the color film.
  • Fluor The optical material may include, for example, silicate, chlorosilicate, aluminate, oxynitride, nitride, tungstate, molybdate, sulfur oxide, silicate or oxynitride green powder, YAG yellow powder. Or nitride red powder, etc.
  • the arrangement of the dielectric film stack 100 may include various types, for example, a film system which may be a plurality of layers including a film system that eliminates light of a first center wavelength or a film system that eliminates light of a plurality of center wavelengths. It should be noted that the dielectric film stack 100 does not strictly eliminate the light in the first wavelength range of 100%, and the cutoff rate of the first wavelength light can be improved by the arrangement of the multilayer film system.
  • the operation of the dielectric film stack 100 is explained by taking a simple structure of the dielectric film stack 100 (which may eliminate a specific one central wavelength such as the first center wavelength), but those skilled in the art need to understand that Based on the same technical principle, it can also be extended to eliminate multiple multilayer film systems in a plurality of first central wavelength ranges.
  • the film layers of different refractive indices in the dielectric film stack 100 are alternately arranged, for example, the first dielectric film layer 101, the second dielectric film layer 102, and the like, and the three-layer dielectric film laminate 100 is taken as an example, and the second dielectric film having a low refractive index is used.
  • the layer 102 is disposed between two layers of the first dielectric film layer 101 having a high refractive index. There is a difference in refractive index between the first dielectric film layer 101 and the second dielectric film layer 102 so that light may be reflected at adjacent interfaces of the two film layers, that is, for example, light may be generated in the second dielectric film layer 102. In the secondary reflection, there may be interference between a plurality of rays existing inside, for example, light of a first central wavelength.
  • the optical path difference between the destructive rays needs to be an odd multiple of a half wavelength of the center wavelength.
  • the shortest optical path difference between the destructive rays is twice the optical thickness of the second dielectric film layer 102.
  • the optical thickness of the second dielectric film layer 102 can be calculated to obtain, for example, the second The true thickness of the dielectric film layer.
  • each film layer such as the second dielectric film stack
  • the optical thickness of each film layer, such as the second dielectric film stack, in the dielectric film stack satisfies the following formula:
  • nh is the optical thickness of the corresponding film layer
  • n is the refractive index of the corresponding film layer
  • h is the actual thickness of the corresponding film layer
  • m is the interference level
  • ⁇ is the center wavelength of the light.
  • the refractive index n of the respective film layer for example the second dielectric film layer, is known, and the true thickness h of the respective film layer is obtained.
  • the thickness of the high refractive index film layer such as the first dielectric film layer 101 is not limited.
  • the first dielectric film layer 101 may be thin with light transmissivity a film, such as a film of silver having a high reflectivity
  • the second dielectric film layer 102 is a film of low refractive index such as magnesium fluoride, and the light of the central wavelength ⁇ can be reflected multiple times in the second dielectric film layer, corresponding wavelength The probability of interference between multiple rays increases.
  • the thickness of at least one dielectric film layer having a low refractive index such as the second dielectric film layer 102 satisfies the requirements of the above formula.
  • a thin film dielectric film stack composed of a film having a high reflectance of silver and a second dielectric film layer 102 having a low refractive index of magnesium fluoride constitutes a three-layer dielectric film of silver-magnesium fluoride-silver.
  • a laminated structure in which a film layer of a film of low refractive index magnesium fluoride needs to satisfy the above formula such that a plurality of light beams of a first center wavelength are interference-depleted in a film layer thereof, and a film of silver having high reflectance
  • the thickness may not be required as long as it is translucent and satisfies the reflection of light at its interface with the film of magnesium fluoride.
  • the thickness of the high refractive index film layer such as the first dielectric film layer may also satisfy the above formula.
  • the dielectric film laminate 100 is a multilayer film system in which high and low refractive indices overlap each other.
  • the optical thickness of each layer in the film system can be, for example, a constant setting; when the light to be eliminated is a plurality of center wavelengths, the optical thickness of each layer in the film system is required.
  • the specific arrangement is based on the above formula, that is, the optical thickness of each layer of the film may be different.
  • the arrangement of the multilayer film system may satisfy G 1 HLHL...HLH...LHLHG 2 , wherein G 1 and G 2 may be a protective film layer such as glass; H is a high refractive index film layer (corresponding to the first dielectric film layer) ; L is a low refractive index film layer (corresponding to a second dielectric film layer).
  • the structure of the multilayer film system of the dielectric film stack 100 can increase the effect of filtering the first center wavelength light, and by different films thereof Parameters such as layer thickness can be set to interfere with the cancellation of multiple central wavelengths of light, ie, the dielectric film stack 100 can filter or eliminate light over a wider range of wavelengths.
  • the optical thickness of each film layer in the preferred dielectric film stack 100 can be set, for example, to a quarter of the center wavelength of the blue light to be eliminated. Under the condition that the light of the corresponding central wavelength obtains the strongest reflection at each interface, for example, after the multi-layer optical interference cancellation, the light in the central wavelength range does not pass through the dielectric film stack. .
  • the optical thickness of the film layer is the product of the refractive index and the actual thickness of the film layer.
  • the thickness can be determined, for example, by a quarter of the center wavelength, but the actual thickness of the dielectric film layer made of different materials is also different, for example, in the case where the materials have different refractive indices. It will be understood by those skilled in the art that the optical thickness of each film layer in the dielectric film stack is an optimum choice of one quarter of the center wavelength of the light to be eliminated, and the optical thickness of the film is close to this value.
  • the thickness of the high refractive index film layer is one quarter of the center wavelength of the light to be eliminated, and the dielectric film is also used.
  • the laminate is optimal for filtering the first wavelength of light, wherein the high refractive index film layer (for example, a film layer using a film having a high reflectivity of silver) can also be set to other thicknesses as long as the light is allowed to The same technical effect can be obtained by reflecting in a film layer having a low refractive index.
  • the center wavelength of the blue light to be eliminated may range from approximately 400 to 460 nanometers, preferably to eliminate blue light having a center wavelength substantially less than or equal to 450 nanometers.
  • the dielectric film stack 100 is configured to eliminate blue light within at least 35 nanometers of bandwidth relative to the center wavelength.
  • the center wavelength of the blue light to be eliminated is 440 nm and the required bandwidth is 40 nm
  • the range is required for light in the range of 420 to 460 nm.
  • each dielectric film layer in a multilayer film system can be derived by conventional simulation calculation software.
  • the film system can be pre-designed using TFCalc or Essential Macleod film system design software to determine parameters such as the number, thickness, and refractive index of the dielectric film layer in the dielectric film laminate 100.
  • the dielectric film stack 100 is not limited to be disposed between the first substrate 110 and the fluorescent film or the color film; for example, the dielectric film stack 100 may also be disposed on the first substrate facing the ambient light.
  • the dielectric film stack 100 is not limited to a monolithic layer structure, and may be disposed, for example, in an array in a corresponding sub-pixel unit.
  • the specific arrangement position of the dielectric film stack 100 is not limited, as long as the position of the dielectric film stack 100 can eliminate, for example, blue light entering the sub-pixel unit, for example, the blue light pair can be prevented. Reflection and luminescence caused by excitation of the fluorescent film layer.
  • the display substrate may also be provided with a black matrix 200.
  • the black matrix 200 can, for example, shield a region other than the sub-pixel unit and improve display contrast, prevent color mixing, and increase color purity.
  • the display substrate may further include a pixel defining layer 600, which may define, for example, a sub-pixel unit (eg, a red sub-pixel unit, a green sub-pixel unit). And the boundary of the blue sub-pixel unit).
  • a pixel defining layer 600 may define, for example, a sub-pixel unit (eg, a red sub-pixel unit, a green sub-pixel unit). And the boundary of the blue sub-pixel unit).
  • the light source is a light emitting device such as an organic light emitting diode disposed in the sub-pixel unit.
  • the display substrate may further include a light emitting device 500 disposed in the sub-pixel unit.
  • the light emitting device 500 may include a first electrode layer 501, a light emitting layer 502, and a second electrode layer 503 which are sequentially stacked, and may include, for example, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.
  • the first electrode layer 501 and the second electrode layer 502 may be an anode and a cathode.
  • the display substrate may further include a second substrate 120 disposed opposite to the first substrate 110, and the second substrate 120 is disposed on a side of the first substrate 110.
  • a thin film transistor layer which may include, for example, a gate electrode 901, a gate insulating layer 905, an active layer 902, a source 903, a drain 904, and the like.
  • the drain 904 of the thin film transistor layer may be electrically connected to, for example, the second electrode layer 503 of the light emitting device 500 to control the switching of the light emitting device 500 in the sub-pixel unit.
  • a passivation layer 700 may be disposed between the thin film transistor layer and the second electrode, for example.
  • the display substrate may further include a spacer layer 300 and an encapsulation layer 400 disposed between the first substrate 110 and the second substrate 120 to face the box structure.
  • the display substrate serves as a support and package.
  • the second electrode layer 503 may be a transparent conductive material, so the display substrate may further include a light shielding layer 800 disposed at the sub-pixel unit.
  • the light shielding layer 800 may be, for example, a metal layer that is opaque, and the light shielding layer 800 may also be configured to have reflective properties, for example.
  • the fluorescent film layer 140 may also be, for example, a green fluorescent film, in which case the fluorescent film layer 140 emits green light after being excited by blue light.
  • the blue light in the environment is eliminated by the dielectric film stack 100, so the external blue light does not excite the fluorescent film layer 140. Therefore, for example, the green sub-pixel unit may be provided with only the green fluorescent film layer without the green color film. .
  • the red, green sub-pixel unit may, for example, only provide a fluorescent film layer without setting a color film of a corresponding color, as compared with the current display substrate structure in which the fluorescent film is disposed, thereby reducing corresponding Color film preparation process.
  • the dielectric film stack 100 is disposed to eliminate the blue light entering the sub-pixel unit from the external environment, and also has a certain encapsulation effect on the display substrate, for example, can block the entry of moisture in the display substrate, thereby reducing the manufacturing cost of the display substrate.
  • the dielectric film stack 100 is disposed in the third sub-pixel unit (for example, the blue sub-pixel unit).
  • the dielectric film stack 100 is disposed to cover a third sub-pixel unit (eg, a blue sub-pixel unit), that is, the blue sub-pixel unit may include a side of the blue color film facing away from the organic light emitting diode.
  • the dielectric film stack 100 for example, in some embodiments of the present disclosure, the dielectric film stack 100 is located outside the third sub-pixel unit, that is, the dielectric film is not disposed in the third sub-pixel unit (eg, the blue sub-pixel unit) Stack 100.
  • the third sub-pixel unit is a blue sub-pixel unit, and the dielectric film stack is disposed in the blue sub-pixel unit as an example, and the technology in the following embodiments of the present disclosure The program is explained.
  • FIG. 3b is a cross-sectional structural diagram of a blue sub-pixel unit area of a display substrate according to an embodiment of the present disclosure.
  • the blue light in the light source is very bright, and even if the dielectric film stack 100 does not completely filter out the blue light, the blue sub-pixel unit may not be provided with a blue fluorescent film layer and only needs to set a corresponding color.
  • the color film layer 130 for example, a blue color film, can prevent the entry of light of other colors such as red light, green light, and the like in the outside.
  • a display substrate is also provided in at least one embodiment of the present disclosure, the light source in the display substrate providing white light.
  • the structure in the sub-pixel unit of the display substrate is different.
  • the red sub-pixel unit is selected to explain the structure and function of the display substrate in the following embodiments in the case where the light source supplies white light.
  • the functional interpretation of the structures in the red sub-pixel unit is equally applicable to sub-pixel units of other colors (eg, blue, green, etc.).
  • FIG. 4a is a cross-sectional structural diagram of another red sub-pixel region of a display substrate according to an embodiment of the present disclosure.
  • a fluorescent film layer 140 such as the fluorescent film layer
  • 140 is a red fluorescent film layer.
  • the white light backlight is a mixed light of red, green, and blue, wherein both the green light and the blue light excite the red fluorescent film layer to appear red light, so the red sub-pixel unit only needs to be provided with a red fluorescent film. It is not necessary to set, for example, a red color film.
  • the embodiment of the present disclosure does not limit the red fluorescent film and the red color film in the red sub-pixel unit.
  • the red color film may also be disposed in the red sub-pixel unit, that is, red.
  • the sub-pixel unit may include at least one of a red fluorescent film and a red color film disposed between the dielectric film laminate 100 and the organic light emitting diode.
  • a red color film in a case where a red color film and a red fluorescent film are disposed in a red sub-pixel unit, a red color film may be disposed between the red fluorescent film and the dielectric film laminate, such that red fluorescent The film layer is not affected by ambient light, and the green light and blue light in the white light will excite the red fluorescent film to emit red light, which can increase the brightness of the red sub-pixel unit, and the other colors in the white light will be filtered by the red color film. Does not affect the display of the red sub-pixel unit.
  • the excitation of the red fluorescent film by blue light may generate blue light, and the generation ratio of the blue light is negligibly small, and the dielectric film laminate may partially or even completely filter out the blue light generated by the excitation.
  • FIG. 4b is a cross-sectional structural diagram of another green sub-pixel unit area of a display substrate according to an embodiment of the present disclosure.
  • a fluorescent film layer 140 is disposed in the sub-pixel unit in the display substrate, for example, the fluorescent film layer 140 is a green fluorescent film layer.
  • the white light backlight is a mixed light of red, green, and blue, and the blue light can excite the green fluorescent film layer to generate green light, but the red light passes through the fluorescent film layer 140, so it is required in the green sub-pixel unit.
  • a green color film layer 130 is provided to filter the red light.
  • the green color film layer 130 can be disposed, for example, between the fluorescent film layer 140 and the dielectric film stack 100 to filter the transmitted red light. Therefore, in at least one embodiment of the present disclosure, as shown in FIG. 4b, the light source For example, in the case of white light, a green color film is disposed between the green fluorescent film and the dielectric film stack 100.
  • FIG. 4c is a schematic cross-sectional structural view of another blue sub-pixel unit region of the display substrate provided by the present disclosure.
  • the light source in the display substrate emits white light
  • the dielectric film stack 100 eliminates or weakens the light in a specific wavelength range, and does not filter all the blue light in all the white light, so the blue light in the white light It is still partially transparent, but it is still necessary to provide a blue color film 130 in the blue sub-pixel unit to filter out other colors of light in the white backlight. That is, in the case where the white backlight is applied to the display substrate, blue
  • the setting of the dice pixel unit can be the same as the conventional method.
  • the dielectric film stack 100 in a case where the dielectric film stack 100 may be disposed to cover the first sub-pixel unit, the second sub-pixel unit, and the third sub-pixel unit, the dielectric film stack 100 may be disposed. In order to cover the entire area of the first substrate 100, it is also possible to cover only the area where the pixel unit of the first substrate 100 is located. The specific arrangement of the dielectric film stack 100 can be determined according to actual needs, and the disclosure is not limited herein. .
  • the dielectric film stack 100 may not be disposed in the third sub-pixel unit (eg, blue sub-pixel unit), that is, the dielectric film stack 100 is disposed in addition to the third sub-pixel unit.
  • FIG. 4 is a cross-sectional structural diagram of another blue sub-pixel region of a display substrate according to an embodiment of the present disclosure. As shown in FIG. 4d, taking the third sub-pixel unit as a blue sub-pixel unit as an example, since the dielectric film stack 100 filters blue light in a part of the band, the transmittance of blue light in the blue sub-pixel unit is lowered.
  • the dielectric film laminate may not be disposed in the blue sub-pixel unit region, but in order to filter light of other colors, it is necessary to provide a blue color film on the light-emitting side of the organic light-emitting device of the blue sub-pixel unit.
  • the color of the organic light emitting device is not limited, and the organic light emitting device may emit white light as shown in FIG. 4d. Set to emit blue light.
  • At least one embodiment of the present disclosure provides a method of fabricating a display substrate including providing a first substrate including a plurality of sub-pixel units; forming a dielectric film stack in a light emitting direction of the sub-pixel unit; and disposing the dielectric film stack
  • the dielectric film stack includes at least one first dielectric film layer and at least one second dielectric film layer alternately stacked, the first dielectric film The refractive index of the layer is greater than the refractive index of the second dielectric film layer.
  • each of the dielectric film layers alternately stacked in the dielectric film stack may be deposited by a plasma chemical vapor deposition (PECVD) apparatus.
  • PECVD plasma chemical vapor deposition
  • a second substrate facing the first substrate may be further provided, and each layer structure of the thin film transistor is formed on the second substrate, for example, including sequentially stacking a gate electrode, a gate insulating layer, an active layer, and a source/drain electrode layer on the two substrates.
  • the dielectric film stack may be formed on a side of the first substrate facing the second substrate, or may be formed on a side of the first substrate facing away from the second substrate.
  • Dielectric film stack can block the first wavelength range The passage of, for example, blue light within the circumference, so that it is set to prevent, for example, blue light entering and leaving the sub-pixel unit in the first wavelength range.
  • each layer structure of the light emitting device such as the first electrode layer, the second electrode layer, and the light emitting layer, may also be formed on the display substrate on which the thin film transistor structure is formed.
  • At least one embodiment of the present disclosure provides a display panel including the display substrate in any of the above embodiments.
  • the display panel is used, for example, in any product or component having a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • Embodiments of the present disclosure provide a display substrate, a method of fabricating the same, a display panel, and have at least one of the following beneficial effects:
  • At least one embodiment of the present disclosure provides a display substrate on which a dielectric film laminate is disposed on a display substrate provided with a fluorescent film layer, which can eliminate a portion of blue light entering the pixel unit of the display substrate, and prevent external blue light from being opposite to the fluorescent film layer.
  • the dielectric film stack can eliminate a part of the blue light emitted by the fluorescent film layer, thereby eliminating light emission and reflection caused by the blue light excitation fluorescent film layer.
  • the arrangement of the dielectric film stack can prevent, for example, water vapor from entering the display substrate, and can function as a certain package to reduce cost.

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Abstract

一种显示基板及其制备方法、显示面板，显示基板包括：第一基板(110)；第一基板(110)包括多个像素单元，每个像素单元至少包括第一子像素单元、第二子像素单元和第三子像素单元；设置于第一基板(110)上的介质膜叠层(100)，介质膜叠层至少覆盖第一子像素单元和第二子像素单元；介质膜叠层(100)设置为消除通过介质膜叠层(100)的具有第一波长范围内的蓝光，介质膜叠层(100)包括交替层叠的至少一个第一介质膜层(101)和至少一个第二介质膜层(102)，第一介质膜层(101)的折射率大于第二介质膜层(102)的折射率。通过介质膜叠层(100)中不同折射率的膜层交替设置，对入射光进行干涉可以将具有或接近第一中心波长的蓝光消除或减弱，以消除或减弱通过介质膜叠层(100)的蓝光。

Description

显示基板及其制备方法、显示面板
本申请要求于2016年12月29日递交的中国专利申请第201611245730.3号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种显示基板及其制备方法、显示面板。
背景技术
在显示面板结构中，可以将阵列结构和彩膜(color filter)结构做到同一基板上，并且将彩膜结构做在阵列结构之上，这种结构可以用于较好的实现显示面板的大尺寸化。另外，也可以采用将彩膜结构制备在显示面板中与阵列基板相对的对置基板上。
发明内容
本公开至少一个实施例提供了一种显示基板，包括：第一基板；所述第一基板包括多个像素单元，每个所述像素单元至少包括第一子像素单元、第二子像素单元和第三子像素单元；设置于所述第一基板上的介质膜叠层，所述介质膜叠层至少覆盖所述第一子像素单元和所述第二子像素单元；其中，所述介质膜叠层配置为消除通过所述介质膜叠层的具有第一波长范围内的蓝光，所述介质膜叠层包括交替层叠的至少一个第一介质膜层和至少一个第二介质膜层，所述第一介质膜层的折射率大于所述第二介质膜层的折射率。例如，在本公开至少一个实施例提供的显示基板中，所述蓝光的中心波长的范围为400～460纳米。
例如，在本公开至少一个实施例提供的显示基板中，所述介质膜叠层中各膜层的光学厚度包括为所述蓝光的中心波长的四分之一。
例如，在本公开至少一个实施例提供的显示基板中，所述介质膜叠层配置为消除相对于中心波长的至少带宽35纳米以内的蓝光。
例如，在本公开至少一个实施例提供的显示基板中，所述介质膜叠层 中各膜层的光学厚度满足如下公式：
2nh＝(m-0.5)λm＝1,2,3……
其中，nh为相应膜层的光学厚度；n为相应膜层的折射率；h为相应膜层的厚度；m为干涉级；λ为光的中心波长。
例如，在本公开至少一个实施例提供的显示基板中，所述第一介质膜层材料包括氮化硅、硫化锌、铝和银中的至少一个；和/或所述第二介质膜层材料包括氧化硅和氟化镁中的至少一个。
例如，在本公开至少一个实施例提供的显示基板中，所述像素单元中的每个子像素单元包括有机发光二极管，所述有机发光二极管发射白光或蓝光。
例如，在本公开至少一个实施例提供的显示基板中，所述有机发光二极管至少包括依次叠置的第一电极层、发光层和第二电极层。
例如，在本公开至少一个实施例提供的显示基板中，所述第一子像素单元为红色子像素单元，所述第二子像素单元为绿色子像素单元，所述第三子像素单元为蓝色子像素单元。
例如，在本公开至少一个实施例提供的显示基板中，所述蓝色子像素单元包括设置于所述有机发光二极管的出光侧的蓝色彩膜。
例如，在本公开至少一个实施例提供的显示基板中，所述蓝色子像素单元还包括位于所述蓝色彩膜背离所述有机发光二极管一侧的所述介质膜叠层。
例如，在本公开至少一个实施例提供的显示基板中，所述有机发光二极管发射蓝光，所述绿色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的绿色荧光膜。
例如，在本公开至少一个实施例提供的显示基板中，所述有机发光二极管发射白光，所述绿色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的所述绿色荧光膜和绿色彩膜。
例如，在本公开至少一个实施例提供的显示基板中，所述绿色彩膜设置于所述绿色荧光膜和所述介质膜叠层之间。
例如，在本公开实施例提供的显示基板中，所述有机发光二极管发射白光，所述红色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的红色荧光膜。
例如，在本公开实施例提供的显示基板中，所述有机发光二极管发射白光，所述红色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的红色荧光膜和红色彩膜中的至少一个。
例如，在本公开实施例提供的显示基板中，所述红色彩膜设置于所述红色荧光膜和所述介质膜叠层之间。
本公开至少一实施例提供一种显示面板，包括上述中任一所述的显示基板。
本公开至少一实施例提供一种显示基板的制备方法，包括：提供包括多个子像素单元的第一基板；在所述子像素单元的第一基板上形成介质膜叠层；其中，所述介质膜叠层设置为消除通过所述介质膜叠层的具有第一波长范围内的蓝光，所述介质膜叠层包括交替层叠的至少一个第一介质膜层和至少一个第二介质膜层，所述第一介质膜层的折射率大于所述第二介质膜层的折射率。通过介质膜叠层中不同折射率的膜层交替设置，对入射光进行干涉可以将具有或接近第一中心波长范围内的蓝光消除，从而避免因此中心波长范围内的蓝光导致的显示效果不良；并且介质膜叠层的设置可以阻止例如水汽进入显示基板中，可以起到一定的封装作用，降低成本。
例如，在本公开至少一个实施例提供的制备方法中，在所述第一基板上形成所述介质膜叠层包括等离子体化学气相沉积。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为一种显示基板的红色子像素区域的横截面结构示意图；
图2为另一种显示基板的红色子像素区域的横截面结构示意图；
图3a为本公开一个实施例提供的一种显示基板的红色子像素区域的横截面结构示意图；
图3b为本公开一个实施例提供的一种显示基板的蓝色色子像素区域的横截面结构示意图；
图4a为本公开一个实施例提供的另一种显示基板的红色子像素区域的横截面结构示意图；
图4b为本公开一个实施例提供的另一种显示基板的绿色子像素区域的横截面结构示意图；
图4c为本公开一个实施例提供的另一种显示基板的蓝色子像素区域的横截面结构示意图；以及
图4d为本公开一个实施例提供的另一种显示基板的蓝色子像素区域的横截面结构示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
采用彩膜使显示面板的子像素单元的色域提高；受限于发光单元的光谱和彩膜的透过光谱，发光单元发出的光透过彩膜后亮度会降低很多。荧光膜可以提高光的发光峰并且降低光的波长半宽度，如果将荧光膜设置于子像素单元中可以实现比目前采用的普通彩膜更高的色域，但是荧光膜受到例如短波长的蓝光激发时会发光，所以为提高色域和防止外界例如蓝光的激发造成的反射和发光，仍然需要在荧光膜上再设置彩膜。
如上所述，荧光膜可应用于显示基板，具有发光峰可调以及半峰宽变窄的特点，与在像素区设置彩膜的方式相比，可以获得更好的色域。但是，荧光膜会受到自然光中的蓝光成分的激发而发光，所以还需要在荧光膜上 再设置彩膜，通过对光的过滤以实现在防止外界蓝光激发造成的反射和发光的同时提高像素区发射光线的色域。每个像素区上都设置彩膜导致额外的工艺流程，而且彩膜设置还会降低通过光线的亮度而不能获得高的出光效率。
当前的显示基板的光源例如可以包括蓝光或者白光，对于提供不同颜色光线的光源，其不同颜色的子像素单元的结构也不一样。下面以显示基板中的红色子像素单元为例对当前的技术进行说明。
图1为一种显示基板的红色子像素区域的横截面结构示意图。例如在显示基板采用荧光膜层结构的情况下，例如光源为蓝光，例如如图1所示，在子像素单元中的第一基板110上依次设置有彩膜层130和荧光膜层140。荧光膜层140例如可以为红色荧光膜层，即受到蓝光激发后可以发射红光，但是例如外界环境中的蓝光同样可以对荧光膜层140激发，所以为防止外界蓝光对荧光膜层的激发而导致的反射，需要在荧光膜层140上设置红色彩膜130以阻止外界环境中的例如蓝光。
图2为另一种显示基板的红色子像素区域的横截面结构示意图。在显示基板的光源为白光的情况下，例如如图2所示，在子像素单元中的第一基板110上设置有彩膜层130。该彩膜层130例如可以为红色彩膜，光源发出的白色光透过所述红色彩膜后发出红色光线，但是因为白色光的光谱有限，该子像素单元发出光的色域很低，例如如果以NTSC(National Television Standards Committee的缩写，即(美国)国家电视标准委员会)标准中最高可以达到85～90％的色域来衡量，相关技术中白色光还无法实现高色域。
本公开的至少一个实施例提供了一种显示基板及其制备方法、显示面板以解决上述问题。该显示基板包括第一基板以及设置于第一基板上的介质膜叠层，第一基板包括多个像素单元，每个像素单元至少包括第一子像素单元、第二子像素单元和第三子像素单元，介质膜叠层至少覆盖第一子像素单元和第二子像素单元。该介质膜叠层例如可以设置为仅可以消除通过所述介质膜叠层的具有第一波长范围内的蓝光，所述介质膜叠层包括交替层叠的至少一个第一介质膜层和至少一个第二介质膜层，所述第一介质膜层的折射率大于所述第二介质膜层的折射率。为便于解释本公开实施例中的技术方案，以像素单元中的一个子像素单元(例如第一子像素单元) 为例，对本公开下述实施例中的技术方案进行说明。
介质膜叠层设置于第一子像素单元的发光方向上，该发光方向为背光源中提供光的发射方向或显示基板的第一子像素单元向外界环境提供显示的方向；介质膜叠层例如可以设置于第一基板的面向显示侧的外界环境的一侧，还可以设置于第一基板和背光源之间；对于设置有荧光膜层的第一子像素单元，介质膜层设置于外界环境和荧光膜层之间。
通过介质膜叠层中不同折射率的膜层交替设置，对入射光进行干涉可以将具有或接近第一中心波长范围内的蓝光消除，从而避免由此中心波长范围内的蓝光例如激发荧光膜层导致的显示效果不良。例如，对于第一子像素单元中设置有荧光膜层的显示基板，例如短波长的蓝光会激发荧光膜层发光，例如激发产生蓝光。介质膜叠层一方面可以将外界环境中入射的可以对荧光膜层激发的波长范围内的蓝光消除，以避免外界环境中的蓝光对荧光膜层的激发；另一方面可以消除例如由背光源中的蓝光激发荧光膜所发射出的蓝光；并且介质膜叠层的设置可以阻止例如水汽进入显示基板中，可以起到一定的封装作用，降低成本。
需要说明的是，介质膜叠层例如可以设置为仅可以消除通过所述介质膜叠层的具有第一波长范围内的蓝光，即可以使得其它波段的例如蓝光或者其它颜色的光线通过。
为方便理解，在本公开的下述实施例中，只选择介质膜叠层的结构来进行分析，即只有介质膜叠层对光的消除产生影响，而不对第一基板进行分析。但是需要说明的是，第一基板例如也可以与介质膜叠层一起共同消除第一波长范围内的光线例如蓝光。例如第一基板相对于第二介质膜层具有高折射率，第一基板和第一介质膜叠层之间设置第二介质膜层，也可以使得光线在第二介质膜层中反射从而使得多束光线之间产生干涉，从而利用干涉相消原理消除具有第一中心波长的光线。
该介质膜叠层中的各层之间的折射率不同，通过对其例如厚度、折射率以及膜层数量等的设置，通过例如光的干涉相消原理可以消除通过所述介质膜叠层的具有第一波长范围内的蓝光。在一些实施例中，例如第一子像素单元中设置有可以提高色域的荧光膜层，而介质膜层的设置可以消除对荧光膜层有激发作用的例如蓝光，从而不需要设置彩膜结构。
需要说明的是，在本公开至少一个实施例中，显示基板不限于为以有 机发光二极管作为光源的显示基板，也可以例如应用于液晶显示基板中。以液晶显示面板为例，例如其中的显示基板的第一子像素单元中也可以设置荧光膜层以提高第一子像素单元显示的色域，在其显示基板上设置介质膜叠层后同样可以消除通过介质膜叠层的部分蓝光，从而消除因蓝光激发荧光膜层造成的发射和反射。为便于说明本公开的技术方案，以有机发光二极管作为光源的显示基板为例对本公开下述实施例中的技术方案进行解释。
下面结合附图对根据本公开实施例的显示基板及其制备方法，显示面板进行说明。
需要说明的是，在本公开至少一个实施例中，对每个像素单元中的子像素单元的数量不做限定，并且对第一子像素单元、第二子像素单元、第三子像素单元的发光颜色不做限定。为便于解释本公开实施例中的技术方案，以第一子像素单元为红色子像素单元、第二子像素单元为绿色子像素单元以及第三子像素单元为蓝色子像素单元为例，对本公开下述实施例中的技术方案进行说明，并未以R表示红光，以G表示绿光，B表示蓝光，以W表示白光。
本公开至少一个实施例提供一种显示基板，该显示基板例如可以包括红、绿、蓝三种子像素单元，而对于不同颜色的光源(例如蓝光、白光等)，三种子像素单元也有不同的设置结构。为便于理解，在本公开至少一个实施例中，选择红色子像素单元在光源供给蓝光的情况下对显示基板的结构及功能进行解释。但是本领域人员需要理解的是，对于红色子像素单元中各结构的功能性解释同样适用于其它颜色的子像素单元中。
例如，在本公开至少一个实施例中，图3a为本公开一个实施例提供的一种显示基板的红色子像素区域的横截面结构示意图。例如图3a所示，该显示基板包括第一基板110、设置于该第一基板110上的子像素单元和设置于该子像素单元发光方向的介质膜叠层100。其中，该介质膜叠层100例如可以消除通过介质膜叠层的具有第一波长范围内的蓝光，介质膜叠层100包括交替层叠的至少一个第一介质膜层101和至少一个第二介质膜层102，介质膜叠层100例如可以包括至少三个第一介质膜层和至少三个第二介质膜层，或者介质膜叠层100例如可以包括至少五个第一介质膜层和至少五个第二介质膜层，所述第一介质膜层101的折射率大于所述第二介质 膜层102的折射率。
例如，在本公开至少一个实施例中，该介质膜叠层100由三层膜组成，即高折射率的两个第一介质膜层之间设置一层第二介质膜层。例如，该第一介质膜层可以为具有透光性的薄膜，例如具有高反射率的银的薄膜，第二介质膜层为低折射率并且透明的氟化镁膜层。对于进入第二介质膜层的光会在其与第一介质膜层的界面上发生反射，由此光线在第二介质膜层之内会发生多次反射，即进入第二介质膜层之间的多束光线之间会有干涉，在至少某一第一中心波长的光线之间会产生干涉相消。
需要说明的是，在本公开的实施例中，对介质膜叠层100的具体结构不做限制，介质膜叠层100也不限于为上述的三层膜结构，只要介质膜叠层100可以消除通过第一波长范围内的蓝光即可。例如，在本公开至少一个实施例中，该介质膜叠层100还可以为多层膜系结构，其可以看作为两高反膜系之间设置一间隔层的结构，与上述三层膜系结构的介质膜叠层的基本工作原理相同，都是光干涉相消。例如第二介质膜层102可以作为间隔层，高反膜系可以看作为由多个高折射率膜层与低折射率膜层交替间隔设置的多层膜系。通过对介质膜叠层100中的各个膜层的厚度设计，可以利用光干涉相消原理过滤一个或一个以上的中心波长的光线，对于介质膜叠层100中各个膜层的厚度设计可以参考下述实施例(关于第二介质膜层102的厚度计算的实施例)中的相关内容，本公开在此不做赘述。
在本公开至少一个实施例中，如图3a所示，介质膜叠层100还可以包括多个其它膜层例如第三介质膜层103等。例如在第三介质膜层103和第一介质膜层101之间设置第二介质膜层102的情况下，第三介质膜层103的制备材料可以与第一介质膜层101材料相同，也可以采用其它材料，只要其折射率大于第二介质膜层102的折射率即可。同样的，高折射率膜层相邻的两低折射率膜层之间的材料可以相同或不同。为方便进行说明，在以下的实施例中，高折射率的膜层统一用第一介质膜层101表示，低折射率的膜层统一用第二介质膜层102表示。本领域技术人员需要理解的是，在本公开中高折射率层和低折射率层指代不同的膜层之间存在折射率差异，而并不为第一的折射率数值。
需要说明的是，荧光膜层可以受多种光的激发而产生多种光，例如以红色荧光膜为例，蓝光或紫光可以将其激发而发射红光，同时该红色荧光 膜受蓝光或紫外光激发也可能产生少量的蓝光，该受激发出的蓝光的中心波长与入射的蓝光的中心波长不同，但是例如受激发产生的蓝光例如可以处于第一范围波长的范围之内。在本公开的所有实施例及其示例中，消除的蓝光指的为介质膜叠层可以消除或吸收的在第一波长范围(例如第一中心波长至第二中心波长)内的蓝光，被消除的此波长范围内的蓝光例如可以包括环境中相应波长范围内的蓝光和被激发后的荧光膜例如红色荧光膜发出的相应波长范围内的蓝光。
外界环境中的蓝光在进入子像素单元过程中，通过介质膜叠层100已进行一次消除或减弱(未被消除或减弱的波长的蓝光所占比例非常小，甚至可以对其忽略)，即使剩余未被消除的蓝光或者其它可以激发荧光膜层的光例如紫光，在激发荧光膜层后，其发射出的其它光线例如蓝光会再次被介质膜叠层100消除或减弱，如此对于外界，其反射或发射的蓝光在子像素单元发射光中所占的比例非常有限，可以忽略不计，即可在一定程度上认为介质膜叠层100的设置达到了消除荧光膜层受例如蓝光激发造成的发光或反射现象。
例如，在本公开至少一个实施例中，如图3a所示，可以在子像素单元中设置荧光膜层140，该荧光膜层140例如可以设置于介质膜叠层100的远离外界环境的一侧，荧光膜层140例如可以为红色荧光膜，其受到蓝光激发后可以发出红光和蓝光。红色荧光膜受蓝光激发而发出的红光或外界环境中的红光会进入子像素单元内，但是对于红色子像素单元来说并不会影响显示；红色荧光膜受蓝光激发而发出的蓝光会受到介质膜叠层100的消除，并且环境光中照射的蓝光也会被介质膜叠层100消除，也不能对荧光膜层140进行激发。
例如，在本公开至少一个实施例中，第一介质膜层101的制备材料例如可以包括氮化硅、硫化锌、铝和银中的至少一个；或者第二介质膜层102的制备材料例如可以包括氧化硅和氟化镁中的至少一个。需要说明的是，例如当第一介质膜层101的制备材料为铝和银等金属材料时，为透明或半透明状态的薄膜。介质膜叠层100中的各介质膜层的材料不限于上述所提及材料，只要第一介质膜层101和第二介质膜层102之间的折射率不同也可取得相同的技术效果。
荧光膜层可以通过添加荧光类材料替代彩膜中的颜料粒子而形成。荧 光类材料例如可以包括硅酸盐、氯硅酸盐、铝酸盐、氮氧化物、氮化物、钨酸盐、钼酸盐、硫氧化物、硅酸盐或氮氧化物绿粉、YAG黄粉或氮化物红粉等。
介质膜叠层100的设置可以包括多种，例如可以为多层的膜系包括消除第一中心波长的光的膜系或消除多个中心波长的光的膜系。需要说明的是，介质膜叠层100并不能严格意义上消除百分百的第一波长范围内的光线，通过多层膜系的设置可以提高对第一波长光线的截止率。在本示例中，以简单结构的介质膜叠层100(可以消除特定的一个中心波长例如第一中心波长)为例解释介质膜叠层100的工作原理，但本领域技术人员需要理解的是，同一技术原理的基础上，其也可以延伸至消除多个第一中心波长范围内的多层膜系。
介质膜叠层100中不同折射率的膜层例如第一介质膜层101、第二介质膜层102等交替排列，以三层的介质膜叠层100为例，低折射率的第二介质膜层102设置于两层高折射率的第一介质膜层101之间。第一介质膜层101和第二介质膜层102之间存在折射率差所以光线在两个膜层的相邻界面上会发生反射，即例如在第二介质膜层102内的光线可能发生多次反射，其内部存在的多束光线例如第一中心波长的光之间会存在干涉。
例如，第二介质膜层102中的多束光线之间发生的为干涉相消，则相消光线之间的光程差需要为中心波长的半波长的奇数倍。相消光线之间最短的光程差为第二介质膜层102的光学厚度的两倍，在设定第一中心波长的情况下，计算第二介质膜层102光学厚度可以得出例如第二介质膜层的真实厚度。
例如，在本示例中，介质膜叠层中各膜层例如第二介质膜叠层的光学厚度满足如下公式：
2nh＝(m-0.5)λm＝1,2,3……
其中，nh为相应膜层的光学厚度；n为相应膜层的折射率；h为相应膜层的实际厚度；m为干涉级；λ为光的中心波长。
对于第一中心波长λ的光线，相应膜层例如第二介质膜层的折射率n为已知的，则相应膜层的真实的厚度h即可得到。
例如，在本公开至少一个实施例中，高折射率的膜层例如第一介质膜层101的厚度不做限制。例如该第一介质膜层101可以为具有透光性的薄 膜，例如具有高反射率的银的薄膜，第二介质膜层102为低折射率的例如氟化镁的薄膜，中心波长λ的光线可以在第二介质膜层内多次反射，相应波长的多光线之间的干涉几率增加。
需要说明的是，介质膜叠层100中，至少有一层低折射率的介质膜层例如第二介质膜层102的厚度满足上述公式的要求。例如以由具有高反射率的银的薄膜，第二介质膜层102为低折射率的氟化镁构成的薄膜介质膜叠层为例，其构成银-氟化镁-银的三层介质膜叠层结构，其中低折射率的氟化镁的薄膜的膜层需要满足上述公式以使得第一中心波长的多束光线在其膜层中进行干涉相消，而具有高反射率的银的薄膜的厚度可以不做要求，只要其具有透光性并且满足光线在其与氟化镁的薄膜的界面上具有反射即可。
例如，在本公开至少一个实施例中，高折射率的膜层例如第一介质膜层的厚度也可以满足上述公式。例如，该介质膜叠层100为高低折射率相互交叠的多层膜系。在欲消除的光线为第一中心波长时，其膜系中各层的光学厚度例如可以为恒定的设置；在欲消除的光线为多个中心波长时，其膜系中各层的光学厚度需要在上述公式基础上进行特定排布，即其各层膜的光学厚度可能不同。
例如，多层膜系的设置可以满足G1HLHL…HLH…LHLHG2，其中，G1和G2可以为保护膜层例如玻璃；H为高折射率膜层(相当于第一介质膜层)；L为低折射率膜层(相当于第二介质膜层)。通过多层高反射率的膜层和低反射率的膜层交替叠置，介质膜叠层100的多层膜系的结构可以增加其过滤第一中心波长光线的效果，而且通过对其不同膜层厚度等参数进行设置，可以对多个中心波长的光线产生干涉相消，即介质膜叠层100可以对更宽波段范围的光线进行过滤或消除。
例如，在本公开至少一个实施例中，优选的介质膜叠层100中各膜层的光学厚度例如可以设置为欲消除的蓝光的中心波长的四分之一大小。在满足此条件下，对应中心波长的光线例如在每个界面处都获得最强烈的反射，在经过多层的光干涉相消后，此中心波长范围内的光线不会透过介质膜叠层。
需要说明的是，膜层的光学厚度为其折射率与膜层实际的厚度的乘积。例如，消除同一中心波长的光，采用不同的材料构成的介质膜层的光 学厚度可以确定，例如为该中心波长的四分之一，但是例如在材料不同其折射率也相应不同的情况下，选用不同材料构成的介质膜层的实际厚度也不相同。本领域技术人员需要理解的是，介质膜叠层中的各膜层的光学厚度为欲消除的光线的中心波长的四分之一为最优的选择，膜层光学厚度在接近这一数值时也可以对此第一中心波长的光起到消除或减弱作用；对于多层膜系中，高折射率膜层的厚度为欲消除的光线的中心波长的四分之一同样也为使介质膜叠层达到过滤第一波长光线最好效果的最优选择，其中高折射率的膜层(例如采用具有高反射率的银的薄膜的膜层)也可以设置为其它厚度，只要能使得光线在低折射率的膜层中进行反射即可取得同样的技术效果。
例如，在本公开至少一个实施例中，欲消除的蓝光的中心波长的范围可以大致为400～460纳米，优选的可以消除中心波长大致小于或等于450纳米的蓝光。
介质膜叠层100为多层膜系下的结构时，随着膜层数的增加，其高反射率区域例如可以趋于一个极限，对应的波段例如可以称之为带宽。例如，在本公开至少一个实施例中，介质膜叠层100配置为消除相对于中心波长的至少带宽35纳米以内的蓝光。例如，以需要消除的蓝光的中心波长为440nm，需要达到的带宽为40nm为例，通过对介质膜叠层100的膜系的例如层数和各层的厚度等参数进行设计，需要达到消除波长范围为420～460nm内的光的要求。
例如，在本公开至少一个实施例中，多层膜系中各介质膜层可以通过常规的模拟计算软件得出。例如可以利用TFCalc或Essential Macleod膜系设计软件等对膜系进行预先设计，以确定介质膜叠层100中介质膜层的数量、厚度及折射率等参数。
在本公开的实施例中，介质膜叠层100不限于设置在第一基板110和荧光膜或彩膜之间；例如介质膜叠层100也可以设置在第一基板的面向外界环境光的一侧；例如介质膜叠层100也不限于为整体的层状结构，例如也可以阵列式设置在相应的子像素单元中。在本公开至少一个实施例中，对介质膜叠层100的具体设置位置不做限制，只要介质膜叠层100的设置位置可以消除进入子像素单元中的例如蓝光，即可取得防止例如蓝光对荧光膜层激发造成的反射和发光现象。
例如，在本公开至少一个实施例中，如图3a所示，该显示基板还可以设置有黑矩阵200。黑矩阵200例如可以对子像素单元之外的区域起到遮光作用并提高显示对比度，防止混色和增加颜色的纯度。
例如，在本公开至少一个实施例中，如图3a所示，该显示基板还可以包括像素界定层600，该像素界定层600例如可以限定子像素单元(例如红色子像素单元、绿色子像素单元和蓝色子像素单元)的边界。
例如，在本公开至少一个实施例中，光源为设置在子像素单元中的发光器件例如有机发光二极管。例如图3a所示，该显示基板还可以包括设置在子像素单元中的发光器件500。例如，该发光器件500可以包括依次叠置的第一电极层501、发光层502和第二电极层503，例如可以包括电子注入层、电子传输层、空穴传输层和空穴注入层等。第一电极层501和第二电极层502可以互为阳极、阴极。
例如，在本公开至少一个实施例中，如图3a所示，该显示基板还可以包括与第一基板110相对设置的第二基板120，该第二基板120面向第一基板110的一侧设置有薄膜晶体管层，该薄膜晶体管层例如可以包括栅电极901、栅绝缘层905、有源层902、源极903和漏极904等。薄膜晶体管层的例如漏极904可以与发光器件500的例如第二电极层503电连接以控制子像素单元中发光器件500的开关。薄膜晶体管层与第二电极之间例如可以设置有钝化层700。
例如，在本公开至少一个实施例中，如图3a所示，该显示基板还可以包括设置于第一基板110和第二基板120之间的间隔层300和封装层400，以对盒体结构的显示基板起到支撑和封装的作用。
例如，在本公开至少一个实施例中，如图3a所示，例如第二电极层503可以为透明导电材料，所以该显示基板还可以包括在子像素单元处设置有遮光层800。该遮光层800例如可以为不透光的金属层，并且该遮光层800例如还可以配置为具有反光性能。
在本公开至少一个实施例中，如图3a所示，荧光膜层140例如也可以为绿色荧光膜，在此情况下，荧光膜层140受蓝光激发后发出绿光。环境中的蓝光会被介质膜叠层100消除，所以外界蓝光不会对荧光膜层140进行激发，所以绿色子像素单元中例如也可以只设置有绿色荧光膜层而不需绿色彩膜的设置。
在本公开至少一个实施例中，与当前的设置荧光膜的显示基板结构相比，红色、绿色子像素单元例如可以只设置荧光膜层而不需要设置对应颜色的彩膜，从而减少了相应的彩膜制备工艺流程。介质膜叠层100的设置在消除外界环境进入子像素单元中的蓝光的同时，还对显示基板起到一定的封装作用，例如可以阻挡显示基板中水汽的进入，降低了显示基板的制备成本。
需要说明的是，在本公开的实施例中，对第三子像素单元(例如蓝色子像素单元)中是否设置介质膜叠层100不做限制。例如，在本公开一些实施例中，介质膜叠层100设置为覆盖第三子像素单元(例如蓝色子像素单元),即蓝色子像素单元可以包括位于蓝色彩膜背离有机发光二极管一侧的介质膜叠层100；例如，在本公开一些实施例中，介质膜叠层100位于第三子像素单元之外，即第三子像素单元(例如蓝色子像素单元)中不设置介质膜叠层100。为便于解释本公开实施例中的技术方案，以第三子像素单元为蓝色子像素单元，且蓝色子像素单元中设置有介质膜叠层为例，对本公开下述实施例中的技术方案进行说明。
例如，在本公开至少一个实施例中，图3b为本公开一个实施例提供的一种显示基板的蓝色子像素单元区域的横截面结构示意图。例如如图3b所示，光源中的蓝光亮度很强，即使介质膜叠层100不会将蓝光全部滤掉，所以蓝色子像素单元可以不设置蓝色荧光膜层而只需要设置相应颜色的彩膜层130例如蓝色彩膜即可防止外界中其他颜色的光线例如红光、绿光等的进入。
本公开至少一个实施例中还提供了一种显示基板，该显示基板中的光源提供白光。与上述实施例中光源为蓝光的显示基板结构相比，在光源为白光的情况下，显示基板的子像素单元中的结构有所不同。为便于理解，选择红色子像素单元在光源供给白光的情况下对下述实施例中的显示基板的结构及功能进行解释。但是本领域人员需要理解的是，对于红色子像素单元中各结构的功能性解释同样适用于其它颜色(例如蓝、绿等)的子像素单元中。
例如，在本公开至少一个实施例中，图4a为本公开一个实施例提供的另一种显示基板的红色子像素区域的横截面结构示意图。例如如图4a所示，显示基板中的子像素单元中设置有荧光膜层140，例如该荧光膜层 140为红色荧光膜层。光源例如为白光情况下，白光背光为红、绿、蓝的混光，其中的绿光和蓝光都会激发红色荧光膜层而出现红光，所以红色子像素单元只需要设置红色荧光膜即可，并不需要设置例如红色彩膜。
需要说明的是，光源例如为白光情况下，本公开的实施例对红色子像素单元中设置红色荧光膜和红色彩膜不做限制，例如红色子像素单元中也可以设置红色彩膜，即红色子像素单元可以包括设置于介质膜叠层100和所述有机发光二极管之间的红色荧光膜和红色彩膜中的至少一个。例如，在本公开至少一个实施例中，在红色子像素单元中设置有红色彩膜和红色荧光膜的情况下，红色彩膜可以设置于红色荧光膜和介质膜叠层之间，如此红色荧光膜层不会受环境光线的影响，而且白光中的绿光、蓝光会激发红色荧光膜而发出红光，可以增加红色子像素单元的亮度，白光中其它颜色的光会被红色彩膜过滤而不会影响红色子像素单元的显示效果。
蓝光对红色荧光膜激发可能会产生蓝光，该蓝光的产生比例非常小可以忽略不计，并且介质膜叠层会将此部分被激发产生的蓝光再次部分甚至全部滤除。
例如，在本公开至少一个实施例中，图4b为本公开一个实施例提供的另一种显示基板的绿色子像素单元区域的横截面结构示意图。例如如图4b所示，显示基板中的子像素单元中设置有荧光膜层140，例如该荧光膜层140为绿色荧光膜层。光源例如为白光情况下，白光背光为红、绿、蓝的混光，蓝光可以激发绿色荧光膜层而出现绿光，但是红光会透过荧光膜层140，所以在绿子像素单元内需要设置绿色的彩膜层130以对红光进行过滤。绿色的彩膜层130例如可以设置于荧光膜层140和介质膜叠层100之间以对透过的红光进行过滤，所以，在本公开至少一个实施例中，如图4b所示，光源例如为白光情况下，绿色彩膜设置于绿色荧光膜和介质膜叠层100之间。
例如，在本公开至少一个实施例中，图4c为本公开提供的另一种显示基板的蓝色子像素单元区域的横截面结构示意图。例如如图4c所示，显示基板中的光源为发射白光，介质膜叠层100消除或减弱特定波段范围内的光线，不会将白光中的所有波段的蓝光全部滤掉，所以白光中的蓝光仍然可以部分透出，但是蓝色子像素单元中仍需要设置蓝色彩膜130来滤除白色背光中的其它颜色的光。即在白色背光应用在显示基板的情况下，蓝 色子像素单元的设置方式与常规方法可以是相同。
需要说明的是，在本公开的实施例中，介质膜叠层100可以设置为覆盖第一子像素单元、第二子像素单元和第三子像素单元的情况下，介质膜叠层100可以设置为覆盖第一基板100的全部区域，也可以设置为只覆盖第一基板100的像素单元所在的区域，介质膜叠层100的具体化设置方式可以根据实际需求决定，本公开在此不做限制。
例如，在本公开至少一个实施例中，第三子像素单元(例如蓝色子像素单元)中可以不设置介质膜叠层100，即介质膜叠层100设置于除第三子像素单元之外的子像素中，图4d为本公开一个实施例提供的另一种显示基板的蓝色子像素区域的横截面结构示意图。如图4d所示，以第三子像素单元为蓝色子像素单元为例，因为介质膜叠层100会过滤部分波段的蓝光，如此会降低蓝色子像素单元中的蓝光的透过率，所以在蓝色子像素单元区域也可以不设置介质膜叠层，但是为过滤其它颜色的光线，需要在蓝色子像素单元的有机发光器件的出光侧设置蓝色彩膜。需要说明的是，在蓝色子像素单元中未设置有介质膜叠层100的情况，对有机发光器件的发光颜色不做限制，有机发光器件可以为如图4d所示的发射白光，也可以设置为发射蓝光。
本公开至少一个实施例提供了一种显示基板的制备方法，该显示基板包括提供包括多个子像素单元的第一基板；在子像素单元的发光方向上形成介质膜叠层；介质膜叠层设置为仅消除通过所述介质膜叠层的具有第一波长范围内的蓝光，所述介质膜叠层包括交替层叠的至少一个第一介质膜层和至少一个第二介质膜层，第一介质膜层的折射率大于第二介质膜层的折射率。
例如，在本公开至少一个实施例提供的制备方法中，可以通过等离子体化学气相沉积(PECVD)装置沉积形成介质膜叠层中交替层叠的各介质膜层。
例如，在本公开至少一个实施例提供的制备方法中，还可以提供与第一基板对置的第二基板，并在第二基板上形成薄膜晶体管的各层结构，例如包括依次叠置在第二基板上的栅电极、栅绝缘层、有源层和源漏电极层。
介质膜叠层可以形成在第一基板的面向第二基板的一侧，也可以形成在第一基板的背向第二基板的一侧。介质膜叠层可以阻断具有第一波长范 围内的例如蓝光的通过，所以只要其设置位置可以阻止第一波长范围内的例如蓝光进出子像素单元即可。
例如，在本公开至少一个实施例提供的制备方法中，还可以在形成有薄膜晶体管结构的显示基板上形成发光器件的各层结构，例如第一电极层、第二电极层和发光层。
需要说明是，通过本公开至少一个实施例提供的制备方法制备的显示基板的具体化结构可以参考前述实施例(关于显示基板的实施例)中的相关内容，本公开在此不做赘述。
本公开至少一个实施例提供了一种显示面板，该显示面板包括以上任一实施例中的显示基板。该显示面板例如应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件之中。
本公开的实施例提供一种显示基板及其制备方法、显示面板，并且具有以下至少一项有益效果：
(1)本公开至少一个实施例提供一种显示基板，在设置有荧光膜层的显示基板上设置介质膜叠层，可消除进入显示基板像素单元内的部分蓝光，防止外界蓝光对荧光膜层的激发。
(2)在本公开至少一个实施例提供的显示基板中，介质膜叠层可以消除荧光膜层被激发而发出的部分蓝光，从而可以从而消除因蓝光激发荧光膜层造成的发光和反射。
(3)在本公开至少一个实施例提供的显示基板中，介质膜叠层的设置可以阻止例如水汽进入显示基板中，可以起到一定的封装作用，降低成本。
对于本公开，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限 于此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种显示基板，包括：
    第一基板；
    所述第一基板包括多个像素单元，每个所述像素单元至少包括第一子像素单元、第二子像素单元和第三子像素单元；
    设置于所述第一基板上的介质膜叠层，所述介质膜叠层至少覆盖所述第一子像素单元和所述第二子像素单元；
    其中，所述介质膜叠层配置为消除通过所述介质膜叠层的具有第一波长范围内的蓝光，所述介质膜叠层包括交替层叠的至少一个第一介质膜层和至少一个第二介质膜层，所述第一介质膜层的折射率大于所述第二介质膜层的折射率。
  2. 根据权利要求1所述的显示基板，其中，所述蓝光的中心波长的范围为400～460纳米。
  3. 根据权利要求1或2所述的显示基板，其中，所述介质膜叠层中各膜层的光学厚度包括为所述蓝光的中心波长的四分之一。
  4. 根据权利要求1-3任一所述的显示基板，其中，所述介质膜叠层配置为消除相对于中心波长的至少带宽35纳米以内的蓝光。
  5. 根据权利要求1-4任一所述的显示基板，其中，所述介质膜叠层中各膜层的光学厚度满足如下公式：
    2nh＝(m-0.5)λ m＝1,2,3……
    其中，nh为相应膜层的光学厚度；n为相应膜层的折射率；h为相应膜层的厚度；m为干涉级；λ为光的中心波长。
  6. 根据权利要求1-5任一所述的显示基板，其中，
    所述第一介质膜层材料包括氮化硅、硫化锌、铝和银中的至少一个；和/或
    所述第二介质膜层材料包括氧化硅和氟化镁中的至少一个。
  7. 根据权利要求1-6任一所述的显示基板，其中，所述像素单元中的每个子像素单元包括有机发光二极管，所述有机发光二极管发射白光或蓝光。
  8. 根据权利要求7所述的显示基板，其中，所述有机发光二极管至 少包括依次叠置的第一电极层、发光层和第二电极层。
  9. 根据权利要求7或8所述的显示基板，其中，所述第一子像素单元为红色子像素单元，所述第二子像素单元为绿色子像素单元，所述第三子像素单元为蓝色子像素单元。
  10. 根据权利要求9所述的显示基板，其中，所述蓝色子像素单元包括设置于所述有机发光二极管的出光侧的蓝色彩膜。
  11. 根据权利要求10所述的显示基板，其中，所述蓝色子像素单元还包括位于所述蓝色彩膜背离所述有机发光二极管一侧的所述介质膜叠层。
  12. 根据权利要求9-11任一所述的显示基板，其中，所述有机发光二极管发射蓝光，所述绿色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的绿色荧光膜。
  13. 根据权利要求9-11任一所述的显示基板，其中，所述有机发光二极管发射白光，所述绿色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的绿色荧光膜和绿色彩膜。
  14. 根据权利要求13所述的显示基板，其中，所述绿色彩膜设置于所述绿色荧光膜和所述介质膜叠层之间。
  15. 根据权利要求9-11任一所述的显示基板，其中，所述有机发光二极管发射蓝光，所述红色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的红色荧光膜。
  16. 根据权利要求9-11任一所述的显示基板，其中，所述有机发光二极管发射白光，所述红色子像素单元包括设置于所述介质膜叠层和所述有机发光二极管之间的红色荧光膜和红色彩膜中的至少一个。
  17. 根据权利要求16所述的显示基板，其中，所述红色彩膜设置于所述红色荧光膜和所述介质膜叠层之间。
  18. 一种显示面板，包括权利要求1-17中任一项所述的显示基板。
  19. 一种显示基板的制备方法，包括：
    提供包括多个子像素单元的第一基板；
    在所述第一基板上形成介质膜叠层；
    其中，所述介质膜叠层设置为消除通过所述介质膜叠层的具有第一波长范围内的蓝光，所述介质膜叠层包括交替层叠的至少一个第一介质膜层和至少一个第二介质膜层，所述第一介质膜层的折射率大于所述第二介质 膜层的折射率。
  20. 根据权利要求19所述的制备方法，其中，在所述第一基板上形成所述介质膜叠层包括等离子体化学气相沉积。
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