WO2018157620A1 - 电致发光显示面板及其制备方法、显示装置 - Google Patents

电致发光显示面板及其制备方法、显示装置 Download PDF

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WO2018157620A1
WO2018157620A1 PCT/CN2017/110196 CN2017110196W WO2018157620A1 WO 2018157620 A1 WO2018157620 A1 WO 2018157620A1 CN 2017110196 W CN2017110196 W CN 2017110196W WO 2018157620 A1 WO2018157620 A1 WO 2018157620A1
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Prior art keywords
pixel
display panel
sub
electroluminescent display
insulating layer
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English (en)
French (fr)
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王涛
张嵩
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to EP17882279.7A priority Critical patent/EP3591704A4/en
Priority to JP2018533942A priority patent/JP2020510952A/ja
Priority to US16/066,186 priority patent/US11283044B2/en
Publication of WO2018157620A1 publication Critical patent/WO2018157620A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Embodiments of the present disclosure relate to an electroluminescence display panel, a method of fabricating the same, and a display device.
  • OLED Organic Light-Emitting Diode
  • OLED has self-luminous, no backlight, high contrast, thin thickness, wide viewing angle, fast response, flexible panel, and wide temperature range. Excellent characteristics such as simple structure and process, and have been widely used in the field of display technology.
  • OLED devices The lifetime problem of OLED devices restricts the pace of industrialization. In the process of fabricating OLED devices, it is necessary to fabricate pixel definition regions on the substrate, and then vapor-deposit the organic luminescent materials into the pixel definition region.
  • the organic luminescent material is extremely sensitive to water and oxygen. Therefore, after the vapor deposition is completed, it is required to be packaged by a thin film or encapsulated by an edge coating method, otherwise the life of the OLED device is reduced.
  • the method of encapsulation includes a film encapsulation and an edge coating, wherein the structure of the thin film encapsulation is a structure in which a plurality of layers of an organic layer and an inorganic layer are stacked, and in an organic layer and a multi-layer stacked structure of an inorganic layer, an inorganic layer
  • the edge coating method is, for example, adding a sheet-like desiccant in a non-display area or applying a ring of desiccant on the edge of the display, the edge coating
  • the method is not conducive to narrow frame design.
  • At least one embodiment of the present disclosure provides an electroluminescent display panel, the electroluminescent display panel including: a substrate substrate, a pixel structure disposed on the substrate substrate, and a package film disposed on the pixel structure Wherein the pixel structures are arranged in an array, the pixel structure A plurality of sub-pixels arranged in an array having an intersecting first direction and a second direction, the edge of the sub-pixel comprising a first portion that is gradually away from a line in which the first direction is located, the first portion The extending direction does not coincide with the second direction.
  • the first portion is substantially curved.
  • the shape of the edge of the sub-pixel includes at least one of a circle, an ellipse, and a quadrilateral that is serpentine in the first direction.
  • the shape of the opening area corresponding to the sub-pixel includes a polygon having a number of sides greater than four sides.
  • adjacent sub-pixels are symmetrically disposed with respect to a line in which the second direction is located in the first direction; In the direction, the adjacent sub-pixels are symmetrically arranged with respect to a line in which the first direction is located.
  • each of the OLED pixel structures includes a first sub-pixel, a second sub-pixel, and a third sub-pixel.
  • the package film includes at least an inorganic insulating layer and an organic insulating layer which are laminated.
  • the inorganic insulating layer includes a first inorganic insulating layer disposed between the organic insulating layer and the OLED pixel structure, and is disposed at A second inorganic insulating layer on the organic insulating layer.
  • the material of the organic insulating layer includes at least one of an acrylic resin or an acryl resin.
  • the materials of the first inorganic insulating layer and the second inorganic insulating layer each include silicon nitride, silicon oxide, silicon oxynitride, titanium oxide or At least one of aluminum oxide.
  • the OLED pixel structure includes a first electrode, an organic material functional layer, and a second electrode that are stacked.
  • the organic material functional layer includes a light emitting layer, an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.
  • the electroluminescent display panel provided by at least one embodiment of the present disclosure further includes: a pixel defining layer disposed between adjacent OLED pixel structures, wherein the sub-pixel corresponds to the pixel defining layer In the opening region, the pixel defining layer has a thickness of 1 ⁇ m to 1.5 ⁇ m.
  • the electroluminescent display panel is a flexible display panel.
  • At least one embodiment of the present disclosure also provides a display device including any of the above electroluminescent display panels.
  • At least one embodiment of the present disclosure further provides a method of fabricating an electroluminescent display panel, comprising: forming a pixel structure on a substrate; forming a package film covering the pixel structure on the pixel structure; wherein The pixel structures are arranged in an array, the pixel structure comprising a plurality of sub-pixels arranged in an array, the pixel structure array having a first direction and a second direction intersecting, the edge of the sub-pixel comprising gradually moving away from the first The direction of the first portion of the straight line, the direction in which the first portion extends does not coincide with the second direction.
  • the package film includes at least an inorganic insulating layer and an organic insulating layer which are laminated.
  • the inorganic insulating layer includes a first inorganic insulating layer disposed between the organic insulating layer and the pixel structure, and is disposed on the organic insulating layer a second inorganic insulating layer.
  • forming the package film includes at least forming the organic insulating layer by coating, inkjet printing, or printing.
  • the preparation method provided in at least one embodiment of the present disclosure further includes: forming a pixel defining layer between adjacent pixel structures, wherein the sub-pixel corresponds to an opening region of the pixel defining layer,
  • the pixel defining layer has a thickness of 1 ⁇ m to 1.5 ⁇ m.
  • 1 is a schematic plan view showing a planar shape of a pixel edge
  • FIG. 2 is a schematic plan view showing a planar structure after coating an organic insulating material
  • FIG. 3 is a schematic cross-sectional structural view after coating an organic insulating material
  • FIG. 4 is a schematic cross-sectional structural view of a process for leveling an organic insulating material
  • FIG. 5 is a schematic cross-sectional structural view of an organic insulating material after curing
  • FIG. 6 is a schematic diagram showing a planar structure of a topography of a pixel edge according to an embodiment of the present disclosure
  • FIG. 7 is a schematic cross-sectional view of an electroluminescent display panel according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram showing a planar structure of a topography of a pixel edge according to an embodiment of the present disclosure
  • FIG. 9 is a schematic diagram showing a planar structure of a topography of a pixel edge according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram showing a planar structure of a topography of a pixel edge according to an embodiment of the present disclosure
  • FIG. 11 is a schematic cross-sectional view of an OLED pixel structure according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic flow chart of fabricating an electroluminescent display panel according to an embodiment of the present disclosure.
  • the process of thin film encapsulation generally includes deposition of a first inorganic film layer, fabrication of an organic film layer, and deposition of a second inorganic film layer.
  • the manufacturing process of the organic film layer includes: coating of an organic insulating material, leveling of the organic insulating material, and curing of the organic insulating material to form an organic film.
  • leveling refers to a process in which the coated organic droplets are spread out and a part of the solvent is volatilized before the organic insulating material is dried, and the organic insulating material is not dried.
  • FIG. 1 is a schematic diagram of a planar structure of a pixel edge, and each sub-pixel is arranged in an array structure. The edges of the sub-pixels in the horizontal and vertical directions are straight lines.
  • the organic insulating material is uniformly applied to ensure the uniformity of the entire surface of the organic film layer after the subsequent leveling, and to avoid unevenness (mura).
  • FIG. 2 is a schematic view of a planar structure after coating an organic insulating material. As shown in FIG. 2, droplets formed of an organic insulating material are uniformly distributed on the OLED.
  • FIG. 3 is a schematic cross-sectional structural view after coating an organic insulating material.
  • the thickness of the pixel defining layer 24 is large, and each sub-pixel is formed in a slit region formed by dividing the pixel defining layer 24, due to organic
  • the droplets formed by the insulating material are larger in size, and the organic droplets are suspended above the pixel region.
  • FIG. 4 is a schematic cross-sectional view of a process for leveling an organic insulating material. As shown in FIG. 4, at the boundary of the pixel defining layer 24 and the sub-pixels, droplets formed by the organic insulating material are not easily spread.
  • the spreading process of the droplets formed of the organic insulating material is as follows.
  • the droplets formed of the organic insulating material are in a lateral direction and a longitudinal direction parallel to the edge of the sub-pixel (the length of the pixel edge in the longitudinal direction is greater than the length of the pixel edge in the lateral direction)
  • the speed of spreading is the same. Since there is a step difference at the boundary between the pixel defining layer and the sub-pixel in the lateral direction parallel to the edge of the sub-pixel, the droplet formed by the organic insulating material encounters an obstacle in the lateral direction of the sub-pixel edge during the spreading process, in the longitudinal direction.
  • FIG. 5 is a schematic cross-sectional structural view of the organic insulating material after curing, and it can be seen from FIG. 5 that the organic insulating layer formed by the organic insulating material is spread on the first inorganic insulating layer to play a flattening role, but There will be a phenomenon in which the subsequent electroluminescence display panel is unevenly displayed, thereby affecting the display effect.
  • At least one embodiment of the present disclosure provides an electroluminescent display panel including: a substrate substrate, a pixel structure disposed on the substrate substrate, and a package film disposed on the pixel structure, wherein the pixel The structure is arranged in an array, the pixel structure comprises a plurality of sub-pixels arranged in an array, the pixel structure array has a first direction and a second direction intersecting, and the edge of the sub-pixel comprises a first part of the line gradually away from the first direction, the first part The extending direction does not coincide with the second direction, which is, for example, the direction in which the organic film is leveled.
  • Embodiments of the present disclosure micro-process a shape of an edge of a sub-pixel by disposing an edge of the sub-pixel to include a first portion that is gradually away from a line in which the first direction is located, the extending direction of the first portion not coincident with the second direction,
  • the unevenness thus formed does not occur regularly, so that the unevenness becomes inconspicuous and does not reach the degree of unevenness that the human eye can perceive, thereby visually eliminating the unevenness.
  • FIG. 6 is a schematic plan view showing a topography of a pixel edge in an electroluminescent display panel according to an embodiment of the present disclosure.
  • FIG. An embodiment shows an example of a cross-sectional structure of an electroluminescent display panel.
  • the electroluminescent display panel 01 includes a substrate substrate 10, an organic electroluminescent diode (OLED) pixel structure 20 disposed on the substrate substrate 10, and an OLED pixel structure 20 disposed thereon.
  • OLED organic electroluminescent diode
  • the upper package film 30, the OLED pixel structure 20 is arranged in an array, and the OLED pixel structure 20 includes a plurality of sub-pixels 210 arranged in an array having an intersecting first direction (for example, a Y direction) and In a second direction (eg, the X direction), the edge of the sub-pixel 210 includes a first portion that is gradually away from a line in a first direction (eg, the Y direction), the direction in which the first portion extends and the second direction (eg, the X direction) Do not coincide.
  • first direction for example, a Y direction
  • a second direction eg, the X direction
  • each sub-pixel 210 is curved at least along an edge in a first direction (for example, a Y direction).
  • a first direction for example, a Y direction
  • the shape of the sub-pixel 210 includes at least one of a circle, an ellipse, and a quadrilateral that is serpentine in the first direction.
  • each sub-pixel 210 is a circular shape as shown in FIG. 6.
  • the planar structure of each sub-pixel 210 may also be elliptical, along the first The quadrilateral and the regular hexagon are serpentine in one direction, and the sub-pixels correspond to the light-emitting regions; in the embodiment of the present disclosure, the first direction is parallel to the first direction or approximately parallel to the first direction.
  • each sub-pixel 210 is circular, and the edge along the first direction (Y direction) is substantially curved.
  • each sub-pixel 210 is in addition to The edge of the first direction (Y direction) is outside the curve, and the edge along the second direction (X direction) is also a curve, which further enhances the irregularity of the unevenness, thereby weakening or even eliminating display unevenness. phenomenon.
  • the first direction is, for example, a direction in which the organic film is leveled in a direction parallel to the Y-axis in FIG. 6, the second direction being, for example, leveling the organic film in a direction parallel to the X-axis in FIG. The direction of operation.
  • FIG. 8 is a schematic diagram showing a planar structure of an edge profile of still another pixel according to an embodiment of the present disclosure.
  • the edge of the sub-pixel 210 has an elliptical shape
  • the edge of the sub-pixel 210 along the first direction (Y direction) is a curve
  • the edge along the second direction (X direction) is also a curve. This also further enhances the irregularity of the uneven phenomenon, thereby weakening or even eliminating the phenomenon of display unevenness.
  • FIG. 9 is a schematic diagram of a planar structure of a topography of a pixel edge according to an embodiment of the present disclosure.
  • the top surface of the sub-pixel 210 has a quadrangular shape that is serpentine in the first direction, and each sub-pixel 210 has a substantially curved shape at least along the edge in the first direction (Y direction).
  • the shape of the edge of the sub-pixel 210 may also be a polygon that is serpentine in the first direction and has a number of sides greater than 4, for example, a pentagon, a hexagon, or an octagon that is serpentine in the first direction.
  • the pixel edge topography shown in FIG. 6, FIG. 8 and FIG. 9 causes the droplets formed by the organic insulating material not to have a regularity in the spreading process due to the different flow states in the first direction and the second direction.
  • designing the edge of the sub-pixel along the first direction (Y direction) as a curve can make the irregularity of the regularity become irregular, so that the uneven state is lower than the degree of unevenness perceived by the human eye. In turn, the unevenness can be visually eliminated.
  • the shape of the edge of each sub-pixel 210 includes a polygon having a number of sides greater than four sides.
  • the shape of the edge of the sub-pixel 210 may be a regular polygon such as a regular pentagon, a regular hexagon, or a regular octagon, or the shape of the edge of the sub-pixel 210 may be an irregular pentagon, a hexagon, or an Edge and so on.
  • FIG. 10 is a schematic diagram showing a planar structure of an edge topography of another seed pixel according to an embodiment of the present disclosure. As shown in FIG. 10, the shape of the edge of the sub-pixel 210 is a regular hexagon.
  • the edge of the sub-pixel is arranged to include a first portion that is gradually away from the straight line in the first direction, and the extending direction of the first portion does not coincide with the second direction, so that the irregularity of the regularity becomes irregular, and the uneven state is made. It is lower than the degree of inhomogeneity that the human eye can perceive, and thus can visually eliminate the unevenness.
  • the sub-pixel 210 includes a first sub-pixel 211, a second sub-pixel 212, and a third sub-pixel 213.
  • the colors of the first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may be different from each other, and are respectively one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, for example, the The first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may be a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively.
  • the colors of the first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may also be the same, and each corresponds to any one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, to implement a single
  • the color display that is, the OLED pixel structure in the electroluminescent display panel shown in FIG. 6 may be a monochromatic light emitting structure or a multi-color light emitting structure.
  • each OLED pixel structure includes a first sub-pixel 211, a second sub-pixel 212, and a third sub-pixel 213.
  • adjacent sub-pixels are symmetrically arranged with respect to a linear axis in which the second direction is located; in the second direction, adjacent sub-pixels are symmetrically arranged with respect to a line in which the first direction is located, and the first direction is The line where the line and the second direction are located is perpendicular to each other.
  • the embodiments of the present disclosure may be directed to an electroluminescent display panel in which the pixel arrangement is RGB side by side, or may be an electroluminescence display that is not arranged in the horizontal or vertical direction for a diamond type structure, a rhombic structure, or the like. panel.
  • the package film includes at least an inorganic insulating layer and an organic insulating layer which are laminated.
  • the inorganic insulating layer includes a first inorganic insulating layer 32 disposed between the organic insulating layer 31 and the OLED pixel structure 20 and a second inorganic insulating layer 33 disposed on the organic insulating layer 31.
  • the material of the organic insulating layer 31 includes at least one of an acrylic resin or an acryl resin. It should be noted that the material of the organic insulating layer 31 is not limited to the above, and other organic materials satisfying the flattening requirement. The material may be the material of the organic insulating layer 31.
  • the thickness of the organic insulating layer 31 is 100 to 500 nm, and for example, the thickness of the organic insulating layer 31 is 100 nm, 200 nm, 300 nm, 400 nm or 500 nm.
  • the materials of the first inorganic insulating layer 32 and the second inorganic insulating layer 33 may each include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiNO x ), titanium oxide (TiO 2 ) or three. At least one of aluminum oxide (Al 2 O 3 ).
  • the first inorganic insulating layer 32 and the second inorganic insulating layer 33 may be a single layer structure, a two layer structure, or a three layer structure formed of any of the above materials.
  • the first inorganic insulating layer 32 and the second inorganic insulating layer 33 in the above-mentioned package film 30 can achieve the function of blocking water and oxygen, and the first inorganic insulating layer 32 and the second inorganic insulating layer 33 can be The bending ability is poor, and when the first inorganic insulating layer 32 and the second inorganic insulating layer 33 are bent, they are easily broken, and the organic insulating layer 31 interposed between the first inorganic insulating layer 32 and the second inorganic insulating layer 33 is interposed.
  • the packaging film may further include a plurality of layers of inorganic insulating layers disposed in a layer to better block water and oxygen.
  • the encapsulating film 30 formed by the first inorganic insulating layer 32, the second inorganic insulating layer 33 and the organic insulating layer 31 can satisfy the barrier requirements and planarization of water and oxygen, and also facilitate the narrow border of the OLED display panel. design.
  • the OLED pixel structure 20 includes a first electrode 22, an organic insulating material functional layer 23, and a second electrode 25 which are stacked.
  • FIG. 11 is a cross-sectional structural diagram of an OLED pixel structure according to an embodiment of the present disclosure.
  • the organic material functional layer 23 may include a light emitting layer 231, an electron injection layer 232, and an electron transport layer 233.
  • the hole injection layer 234 and the hole transport layer 235 may include a light emitting layer 231, an electron injection layer 232, and an electron transport layer 233.
  • the electroluminescent display panel further includes a pixel defining layer 24 disposed between adjacent OLED pixel structures, the sub-pixels corresponding to an open area of the pixel defining layer 24.
  • the pixel defining layer 24 has a thickness of 1 ⁇ m to 1.5 ⁇ m.
  • the pixel defining layer 24 may have a thickness of 1 ⁇ m, 1.2 ⁇ m, 1.4 ⁇ m, or 1.5 ⁇ m.
  • the pixel defining layer 24 can be used to isolate adjacent two pixel structures.
  • the pixel defining layer 24 is typically formed of an organic insulating material (eg, an acrylic resin) or an inorganic insulating material (eg, silicon nitride SiN x or silicon oxide SiO x ), and the pixel defining layer 24 has insulating properties.
  • a hole transport layer 235 may be disposed between the first electrode 22 and the light emitting layer 231 with the first electrode 22 as an anode.
  • the hole transport layer 235 is formed using a solution process.
  • the second electrode 25 is used as a cathode, and an electron transport layer 233 is disposed between the second electrode 25 and the light-emitting layer 231.
  • the electron transport layer 233 is formed by a vacuum thermal evaporation process.
  • the hole transport layer 235 has a thickness of 10 to 180 nm, and the material of the hole transport layer 235 includes polytriphenylamine.
  • the thickness of the electron transport layer 233 is 10 to 35 nm, and the material of the electron transport layer 233 is octahydroxyquinoline aluminum.
  • the organic material functional layer 23 may further include an electron injection layer 232 disposed between the second electrode 25 and the electron transport layer 233; disposed between the first electrode 22 and the hole transport layer 235.
  • the hole injection layer 234 has a thickness of 10 to 180 nm; and the electron injection layer 232 has a thickness of 1 to 5 nm.
  • the material of the hole injection layer 234 includes any one of poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid (PEDOT/PSS), polythiophene, and polyaniline.
  • the material of the hole injection layer may also be tris-[4-(5-phenyl-2-thienyl)benzene]amine, 4,4',4"-tris[2-naphthyl(phenyl)amino]tri Aniline (2-TNATA), 4,4',4"-tris-(3-methylphenylanilino)triphenylamine (m-MTDATA), beryllium copper (CuPc) or TPD.
  • the material of the electron injection layer 232 includes any one or a combination of LiF, 8-hydroxyquinoline-lithium.
  • the electron injecting layer may also be an alkali metal oxide or another alkali metal fluoride or the like.
  • the alkali metal oxide includes lithium oxide (Li 2 O), lithium boron oxide (LiBO 2 ), potassium oxychloride (K 2 SiO 3 ), cesium carbonate (Cs 2 CO 3 ), and the like; alkali metal fluoride includes sodium fluoride ( NaF) and so on.
  • first electrode 22 and the second electrode 25 are an anode, and the other is a cathode.
  • first electrode 22 serves as an anode and the second electrode 25 serves as a cathode, it may be the first
  • the electrode 22 serves as a cathode and the second electrode 25 serves as an anode.
  • the electrode material as the anode includes a transparent conductive material such as indium tin oxide or zinc oxide; and the electrode material as the cathode includes aluminum, magnesium or an alloy material formed of both.
  • the electroluminescent display panel is a flexible display panel.
  • the electroluminescent display panel provided by the embodiment of the present disclosure may be of any type.
  • the OLED panel is not limited to a flexible display panel. Since the embodiment of the present disclosure improves the topography of the pixel edge to reduce the unevenness caused by the organic insulating layer in the package film structure, the general flexible display panel adopts a thin film packaging process; the non-flexible panel is currently still The glass frit sintering process can be used for packaging, and it is not necessary to use a thin film encapsulation process, so that the non-flexible panel fabricated by the thin film encapsulation process is actually applicable.
  • the base substrate 10 may be an oxide thin film transistor substrate, a low temperature polycrystalline silicon substrate glass substrate, or a substrate formed of a resin material.
  • At least one embodiment of the present disclosure also provides a display device including any of the above Electroluminescent display panel.
  • the display device may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • Other indispensable components of the display device are understood by those skilled in the art, and are not described herein, nor should they be construed as limiting the disclosure.
  • FIG. 12 is a flow chart of fabricating an electroluminescent display panel according to an embodiment of the present disclosure. As shown in FIG. 12, the preparation process includes:
  • Step 101 forming an organic electroluminescent diode (OLED) pixel structure on the base substrate.
  • OLED organic electroluminescent diode
  • the base substrate may be an oxide thin film transistor substrate, a low temperature polycrystalline silicon substrate glass substrate, or a substrate formed of a resin material.
  • the OLED pixel structure includes a first electrode, a functional layer of an organic material, and a second electrode, which may be stacked, the organic material functional layer may include a light emitting layer, an electron injecting layer, an electron transporting layer, a hole injecting layer, and a hole transporting layer .
  • the method for fabricating the electroluminescent display panel further includes forming a pixel defining layer between adjacent OLED pixel structures, the edge of the sub-pixel corresponding to the opening region of the pixel defining layer, the pixel defining layer having a thickness of 1 ⁇ m to 1.5 Mm.
  • the material and thickness of the first electrode, the organic material functional layer, the pixel defining layer, the second electrode, and the light emitting layer, the electron injecting layer, the electron transporting layer, the hole injecting layer, and the hole transporting layer in the organic material functional layer For the design, refer to the related description in the foregoing embodiment, and details are not described herein again.
  • Step 102 forming a package film covering the OLED pixel structure on the OLED pixel structure, the OLED pixel structure being arranged in an array, the OLED pixel structure comprising a plurality of sub-pixels arranged in an array, the OLED pixel structure array having an intersecting first In the direction and the second direction, the edge of the sub-pixel includes a first portion that is gradually away from the line in which the first direction is located, and the extending direction of the first portion does not coincide with the second direction.
  • each sub-pixel is substantially curved at least along an edge in a first direction (eg, the Y direction).
  • the shape of the edge of the sub-pixel includes at least one of a circle, an ellipse, and a quadrilateral that is serpentine in the first direction.
  • the edge along the first direction (Y direction) is substantially curved.
  • Each sub-pixel is curved along the edge in the first direction (Y direction), and the edge along the second direction (X direction) is also curved, which further enhances the irregularity of the uneven phenomenon, thereby weakening or even eliminating The phenomenon of unevenness is displayed.
  • the first direction is, for example, a direction in which the organic film is leveled in a direction parallel to the Y-axis
  • the second direction is, for example, a direction in which the organic film is leveled in a direction parallel to the X-axis.
  • the shape of the edge of the sub-pixel is elliptical
  • the edge along the first direction (Y direction) is a curve
  • the edge along the second direction (X direction) is also a curve, which further enhances the unevenness.
  • the irregularity of the phenomenon reduces or even eliminates the phenomenon of uneven display.
  • the shape of the edge of the sub-pixel is a quadrilateral that is serpentine in the first direction, and each sub-pixel is curved at least along the edge of the first direction (Y direction).
  • the shape of the edge of the sub-pixel may also be a polygon that is serpentine in the first direction and has a number of sides greater than 4, for example, a pentagon, a hexagon, or an octagon that is serpentine in the first direction.
  • the shape of the edge of each sub-pixel includes a polygon whose number of sides is larger than four sides.
  • the shape of the edge of the sub-pixel may be a regular polygon such as a regular pentagon, a regular hexagon, a regular octagon, or the edge of the sub-pixel.
  • the shape may be an irregular pentagon, a hexagon, or an octagon.
  • each sub-pixel When the sub-pixels are substantially curved along at least the edge in the first direction (Y direction) or the shape of each sub-pixel includes a polygon having more sides than four sides, the droplets formed by the organic insulating material are not in the process of spreading.
  • the flow state in one direction and the second direction is different, and a regular unevenness is formed, and the edge of each sub-pixel along the first direction (Y direction) is designed as a curve or the shape of each sub-pixel includes the number of sides larger than four sides.
  • the polygon can make the irregularity of the regularity become irregular, so that the uneven state is lower than the degree of the unevenness that the human eye can perceive, and the unevenness can be visually eliminated.
  • adjacent sub-pixels are symmetrically disposed with respect to a line in which the second direction is located; in the second direction, adjacent sub-pixels are symmetrically disposed with respect to a line in which the first direction is located.
  • the encapsulating film includes at least an inorganic insulating layer and an organic insulating layer which are laminated.
  • the inorganic insulating layer includes a first inorganic insulating layer disposed between the organic insulating layer and the pixel structure, and a second inorganic insulating layer disposed on the organic insulating layer.
  • the first inorganic insulating layer and the second inorganic insulating layer in the package film can achieve resistance
  • the function of the water barrier and the oxygen, the first inorganic insulating layer and the second inorganic insulating layer have poor bendability, and the first inorganic insulating layer and the second inorganic insulating layer are easily broken when bent, and are sandwiched in the first
  • the organic insulating layer between the inorganic insulating layer and the second inorganic insulating layer can release stress to reduce the damage caused by the bending process to the first inorganic insulating layer and the second inorganic insulating layer, and can also be flat The role of the role.
  • the packaging film may further include a plurality of inorganic insulating layers disposed in a layer to better block water and oxygen.
  • the encapsulation film formed by the first inorganic insulating layer, the second inorganic insulating layer and the organic insulating layer can not only meet the barrier requirement and flattening effect on water and oxygen, but also facilitate the narrow bezel design of the OLED display panel.
  • the method of forming the package film includes at least a coating, inkjet printing, or printing.
  • the preparation method provided by the embodiment of the present disclosure further includes completing the preparation of the first inorganic insulating layer and the second inorganic insulating layer by using a vacuum device, for example, forming a first inorganic by plasma enhanced chemical vapor deposition or sputtering.
  • a vacuum device for example, forming a first inorganic by plasma enhanced chemical vapor deposition or sputtering.
  • An insulating layer and a second inorganic insulating layer is an completing the preparation of the first inorganic insulating layer and the second inorganic insulating layer.
  • the preparation method provided by the embodiment of the present disclosure further includes forming a pixel defining layer between adjacent OLED pixel structures, the sub-pixel corresponding to an opening region of the pixel defining layer, the pixel defining layer having a thickness of 1 ⁇ m to 1.5 ⁇ m.
  • the electroluminescent display panel provided by at least one embodiment of the present disclosure, the preparation method thereof, and the display device have at least one of the following beneficial effects:
  • An electroluminescent display panel wherein the extending direction of the first portion does not coincide with the second direction by arranging the edge of the sub-pixel to include a first portion that is gradually away from the straight line of the first direction.
  • the spreading effect of the organic thin film encapsulation layer can be improved;
  • the electroluminescent display panel provided by at least one embodiment of the present disclosure can improve the reliability of the package and improve the display quality of the electroluminescent display panel.

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Abstract

一种电致发光显示面板及其制备方法、显示装置，该电致发光显示面板（01）包括：衬底基板（10），设置在衬底基板（10）上的像素结构（20），以及设置在像素结构（20）上的封装层，其中，像素结构（20）呈阵列排布，像素结构（20）包括多个排列为阵列的子像素（210），该像素结构阵列具有相交的第一方向和第二方向，子像素（210）的边缘包括逐渐远离第一方向所在直线的第一部分，第一部分的延伸方向与第二方向不重合。本公开的实施例提供的电致发光显示面板可以提高有机薄膜的铺展效果，从而可以提升封装的信赖性，进而可以提高其显示质量。

Description

电致发光显示面板及其制备方法、显示装置
本申请要求于2017年3月2日递交的中国专利申请第201710121144.6号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及一种电致发光显示面板及其制备方法、显示装置。
背景技术
有机电致发光器件(Organic Light-Emitting Diode，OLED)由于同时具备自发光、不需要背光源、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板、使用温度范围广、构造及制程简单等优异的特性，在显示技术领域得到了广泛的应用。
OLED器件的寿命问题制约着其产业化的步伐，在制作OLED器件的过程中，需要在衬底基板上制作像素定义区，然后通过真空蒸镀的方式将有机发光材料蒸镀到像素定义区内，有机发光材料对水、氧气极为敏感，因此，在蒸镀完成后需要进行薄膜封装或者通过边缘涂覆的方法进行封装，否则会减少OLED器件的寿命。目前，封装的方法包括薄膜封装和边缘涂覆这两种方式，其中，薄膜封装的结构为有机层和无机层多层堆叠的结构，在有机层和无机层多层堆叠的结构中，无机层可以实现阻隔水氧的作用，有机层可以实现平坦化的作用；边缘涂覆的方法，例如为在非显示区域加入片状干燥剂或者在显示器边缘涂覆一圈干燥剂，上述边缘涂覆的方法不利于窄边框设计。
发明内容
本公开至少一实施例提供一种电致发光显示面板，该电致发光显示面板包括：衬底基板，设置在所述衬底基板上的像素结构，以及设置在所述像素结构上的封装薄膜，其中，所述像素结构呈阵列排布，所述像素结构 包括多个排列为阵列的子像素，所述像素结构阵列具有相交的第一方向和第二方向，所述子像素的边缘包括逐渐远离所述第一方向所在直线的第一部分，所述第一部分的延伸方向与所述第二方向不重合。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述第一部分大致为曲线。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述子像素的边缘的形状包括圆形、椭圆形和沿所述第一方向呈蛇形的四边形中的至少之一。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述子像素对应的开口区域的形状包括边数大于四边的多边形。
例如，在本公开至少一实施例提供的电致发光显示面板中，在所述第一方向上，相邻的所述子像素关于所述第二方向所在的直线对称设置；在所述第二方向上，相邻的所述子像素关于所述第一方向所在的直线对称设置。
例如，在本公开至少一实施例提供的电致发光显示面板中，每个所述OLED像素结构均包括第一子像素、第二子像素和第三子像素。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述封装薄膜至少包括层叠设置的无机绝缘层和有机绝缘层。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述无机绝缘层包括设置在所述有机绝缘层和所述OLED像素结构之间的第一无机绝缘层，以及设置在所述有机绝缘层上的第二无机绝缘层。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述有机绝缘层的材料包括丙烯酸树脂或亚克力树脂中的至少一种。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述第一无机绝缘层和所述第二无机绝缘层的材料均包括氮化硅、氧化硅、氮氧化硅、二氧化钛或者三氧化二铝中的至少一种。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述OLED像素结构包括层叠设置的第一电极、有机材料功能层和第二电极。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述有机材料功能层包括发光层、电子注入层、电子传输层、空穴注入层和空穴传输层。
例如，本公开至少一实施例提供的电致发光显示面板，还包括：设置在相邻的所述OLED像素结构之间的像素界定层，其中，所述子像素对应于所述像素界定层的开口区域，所述像素界定层的厚度为1μm～1.5μm。
例如，在本公开至少一实施例提供的电致发光显示面板中，所述电致发光显示面板为柔性显示面板。
本公开至少一实施例还提供一种显示装置，包括上述任一电致发光显示面板。
本公开至少一实施例还提供一种电致发光显示面板的制备方法，包括：在衬底基板上形成像素结构；在所述像素结构上形成覆盖所述像素结构的封装薄膜；其中，所述像素结构呈阵列排布，所述像素结构包括多个排列为阵列的子像素，所述像素结构阵列具有相交的第一方向和第二方向，所述子像素的边缘包括逐渐远离所述第一方向所在直线的第一部分，所述第一部分的延伸方向与所述第二方向不重合。
例如，在本公开至少一实施例提供的制备方法中，所述封装薄膜至少包括层叠设置的无机绝缘层和有机绝缘层。
例如，在本公开至少一实施例提供的制备方法中，所述无机绝缘层包括设置在所述有机绝缘层和所述像素结构之间的第一无机绝缘层，以及设置在所述有机绝缘层上的第二无机绝缘层。
例如，在本公开至少一实施例提供的制备方法中，形成所述封装薄膜至少包括通过涂覆、喷墨打印或者印刷的方式形成所述有机绝缘层。
例如，本公开至少一实施例提供的制备方法，还包括：在相邻的所述像素结构之间形成像素界定层，其中，所述子像素对应于所述像素界定层的开口区域，所述像素界定层的厚度为1μm～1.5μm。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为一种像素边缘形貌的平面结构示意图；
图2为涂覆有机绝缘材料后的平面结构示意图；
图3为涂覆有机绝缘材料后的截面结构示意图；
图4为有机绝缘材料流平过程的截面结构示意图；
图5为有机绝缘材料固化后的截面结构示意图；
图6为本公开一实施例提供的一种像素边缘的形貌的平面结构示意图；
图7为本公开一实施例提供的一种电致发光显示面板的截面结构示意图；
图8为本公开一实施例提供的再一种像素边缘的形貌的平面结构示意图；
图9为本公开一实施例提供的又一种像素边缘的形貌的平面结构示意图；
图10为本公开一实施例提供的又一种像素边缘的形貌的平面结构示意图；
图11为本公开一实施例提供的一种OLED像素结构的截面结构示意图；以及
图12为本公开一实施例提供的一种制作电致发光显示面板的流程示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝 对位置改变后，则该相对位置关系也可能相应地改变。
有机电致发光器件(OLED)中的有机发光材料蒸镀完成后，一般需要进行薄膜封装。薄膜封装的过程一般包括第一次无机膜层的沉积、有机膜层的制作和第二次无机膜层的沉积。有机膜层的制作过程包括：有机绝缘材料的涂覆、有机绝缘材料的流平和有机绝缘材料固化形成有机膜。
需要说明的是，流平(leveling)是指在涂覆有机绝缘材料后，有机绝缘材料尚未干燥成膜之前，使涂覆的有机液滴铺展开，并挥发出一部分溶剂的过程。
在常见的有机电致发光器件(OLED)中，各子像素的边缘的形貌为矩形，例如，图1为一种像素边缘的形貌的平面结构示意图，各个子像素排列成阵列结构，各个子像素在横向和纵向上的边缘均为直线。当在图1所示的结构上制作有机膜层时，会均匀地涂覆有机绝缘材料，以确保后续流平后保持有机膜层整面的均一性，尽量避免出现不均匀的现象(mura)。例如，图2为涂覆有机绝缘材料后的平面结构示意图，如图2所示，有机绝缘材料形成的液滴均匀地分布在OLED上。例如，图3为涂覆有机绝缘材料后的截面结构示意图，如图3所示，像素界定层24的厚度较大，各个子像素形成在像素界定层24分割形成的狭缝区域内，由于有机绝缘材料形成的液滴的尺寸较大，该有机液滴悬浮在像素区域之上。例如，图4为有机绝缘材料流平过程的截面结构示意图，如图4所示，在像素界定层24和子像素的交界处，有机绝缘材料形成的液滴不容易铺展开。有机绝缘材料形成的液滴的铺展过程如下所述。当有机绝缘材料处于流平过程的初始状态时，在平行于子像素边缘的横向方向和纵向方向(纵向方向上像素边缘的长度大于横向方向上像素边缘的长度)上有机绝缘材料形成的液滴铺展的速度是相同的。由于在平行于子像素边缘的横向方向上，在像素界定层和子像素的交界处存在段差，有机绝缘材料形成的液滴在铺展的过程中在子像素边缘的横向上会遇到阻碍，在纵向上会按照之前的铺展速度进行扩散，这样会在平行于图1所示的子像素的长边方向出现定向的不均匀现象(mura)，进而影响电致发光显示面板的显示效果。例如，图5为有机绝缘材料固化后的截面结构示意图，从图5中可以看出，有机绝缘材料铺展形成的有机绝缘层平铺在第一无机绝缘层上，起到了平坦化的作用，但是会出现后续电致发光显示面板显示不均匀的现象，从而影响显示效果。
本公开至少一实施例提供一种电致发光显示面板，该电致发光显示面板包括：衬底基板，设置在衬底基板上的像素结构，以及设置在像素结构上的封装薄膜，其中，像素结构呈阵列排布，像素结构包括多个排列为阵列的子像素，像素结构阵列具有相交的第一方向和第二方向，子像素的边缘包括逐渐远离第一方向所在直线的第一部分，第一部分的延伸方向与第二方向不重合，该第一方向例如为对有机薄膜进行流平操作的方向。本公开的实施例将子像素的边缘的形状进行微处理，即通过将子像素的边缘设置成包括逐渐远离第一方向所在直线的第一部分，该第一部分的延伸方向与第二方向不重合，这样形成的不均匀现象不会有规律的出现，从而不均匀现象变得不明显，达不到人眼能感知的不均匀现象的程度，进而从视觉上可以消除不均匀现象。
本公开至少一实施例提供一种电致发光显示面板，例如，图6为本公开一实施例提供的一种电致发光显示面板中像素边缘的形貌的平面结构示意图，图7为本公开一实施例提供的一种电致发光显示面板的截面结构示意图。如图6和图7所示，该电致发光显示面板01包括：衬底基板10，设置在衬底基板10上的有机电致发光二极管(OLED)像素结构20，以及设置在OLED像素结构20上的封装薄膜30，该OLED像素结构20呈阵列排布，OLED像素结构20包括多个排列为阵列的子像素210，该OLED像素结构20阵列具有相交的第一方向(例如，Y方向)和第二方向(例如，X方向)，该子像素210的边缘包括逐渐远离第一方向(例如，Y方向)所在直线的第一部分，该第一部分的延伸方向与第二方向(例如，X方向)不重合。
例如，如图6所示，各子像素210至少沿第一方向(例如，Y方向)的边缘为曲线。例如，该子像素210的形状包括圆形、椭圆形和沿第一方向呈蛇形的四边形中的至少之一。
需要说明的是，各子像素210的平面结构为图6中所示的圆形，下述图8、图9和图10中，各子像素210的平面结构还可以分别为椭圆形、沿第一方向呈蛇形的四边形和正六边形，子像素对应于发光区域；本公开的实施例中的沿第一方向为平行于第一方向或者近似平行于第一方向。
从图6中可以看出，各子像素210的边缘的平面形状为圆形，沿着第一方向(Y方向)的边缘大致为曲线。如图6所示，各子像素210除了沿 第一方向(Y方向)的边缘为曲线外，沿着第二方向(X方向)的边缘也为曲线，这样进一步地增强了不均匀现象的不规律性，从而减弱甚至消除了显示不均匀的现象。该第一方向例如为对有机薄膜沿平行于图6中的Y轴的方向进行流平操作的方向，该第二方向例如为对有机薄膜沿平行于图6中的X轴的方向进行流平操作的方向。
例如，图8为本公开一实施例提供的再一种像素的边缘形貌的平面结构示意图。如图8所示，该子像素210的边缘的形貌为椭圆形，该子像素210沿第一方向(Y方向)的边缘为曲线，沿着第二方向(X方向)的边缘也为曲线，这样也进一步地增强了不均匀现象的不规律性，从而减弱甚至消除了显示不均匀的现象。
例如，图9为本公开一实施例提供的又一种像素边缘的形貌的平面结构示意图。如图9所示，该子像素210的边缘的形貌为沿第一方向呈蛇形的四边形，各子像素210至少沿第一方向(Y方向)的边缘大致为曲线。类似的，该子像素210的边缘的形貌还可以为沿第一方向呈蛇形且边数大于4的多边形，例如，沿第一方向呈蛇形的五边形、六边形或者八边形等，或者沿第一方向和第二方向均呈蛇形的四边形或者边数大于4的多边形，例如，沿第一方向和第二方向均呈蛇形的五边形、六边形或者八边形等。
图6、图8和图9所示的像素边缘形貌使得有机绝缘材料形成的液滴在铺展的过程中不会因为在第一方向和第二方向上的流动状态不一样而产生规律性的不均匀现象，将子像素沿第一方向(Y方向)的边缘设计成曲线，可以使得规律性的不均匀变得不规律，使不均匀的状态低于人眼能感知的不均匀现象的程度，进而可以从视觉上消除不均匀现象。
例如，各子像素210的边缘的形状包括边数大于四边的多边形。例如，子像素210的边缘的形状可以为正五边形、正六边形、正八边形等正多边形，或者，子像素210的边缘的形状可以为不规则的五边形、六边形或者八边形等。例如，图10为本公开一实施例提供的又一种子像素的边缘形貌的平面结构示意图，如图10所示，子像素210的边缘的形状为正六边形。这样将子像素的边缘设置成包括逐渐远离第一方向所在直线的第一部分，该第一部分的延伸方向与第二方向不重合，可以使得规律性的不均匀变得不规律，使不均匀的状态低于人眼能感知的不均匀现象的程度，进而可以从视觉上消除不均匀现象。
例如，如图6所示，该子像素210包括第一子像素211、第二子像素212和第三子像素213。例如，该第一子像素211、第二子像素212和第三子像素213的颜色可以互不相同，且分别为红色子像素、绿色子像素和蓝色子像素中的一种，例如，该第一子像素211、第二子像素212和第三子像素213可以分别为红色子像素、绿色子像素、蓝色子像素。例如，该第一子像素211、第二子像素212和第三子像素213的颜色也可以相同，均对应于红色子像素、绿色子像素和蓝色子像素中的任一种，以实现单色显示，即图6所示的电致发光显示面板中的OLED像素结构可以为单色发光结构，也可以为多色发光结构。
例如，如图6所示，每个OLED像素结构均包括第一子像素211、第二子像素212和第三子像素213。
例如，在第一方向上，相邻的子像素关于第二方向所在的直线轴对称设置；在第二方向上，相邻的子像素关于第一方向所在的直线对称设置，此时第一方向所在直线和第二方向所在直线相互垂直。
需要说明的是，本公开的实施例可以针对像素排列是RGB并排的横竖排列的电致发光显示面板，也可以是针对钻石型结构、菱形结构等不按照横、纵方向排列的电致发光显示面板。
例如，如图7所示，该封装薄膜至少包括层叠设置的无机绝缘层和有机绝缘层。例如，该无机绝缘层包括设置在有机绝缘层31和OLED像素结构20之间的第一无机绝缘层32和设置在有机绝缘层31上的第二无机绝缘层33。
例如，该有机绝缘层31的材料包括丙烯酸树脂或亚克力树脂中的至少一种，需要说明的是，该有机绝缘层31的材料不限于上述中的几种，其他的能满足平坦化要求的有机材料均可以为该有机绝缘层31的材料。
例如，该有机绝缘层31的厚度为100～500nm，例如，该有机绝缘层31的厚度为100nm，200nm，300nm，400nm或者500nm。
例如，第一无机绝缘层32和第二无机绝缘层33的材料均可以包括氮化硅(SiNx)、氧化硅(SiOx)、氮氧化硅(SiNOx)、二氧化钛(TiO2)或者三氧化二铝(Al2O3)中的至少一种。例如，该第一无机绝缘层32和第二无机绝缘层33可以是由上述任意材料形成的单层结构、双层结构或者三层结构。
例如，在图7中，上述封装薄膜30中的第一无机绝缘层32和第二无机绝缘层33可以实现阻隔水和氧气的作用，第一无机绝缘层32和第二无机绝缘层33的可弯折能力差，对第一无机绝缘层32和第二无机绝缘层33进行弯折时其容易断裂，夹设在第一无机绝缘层32和第二无机绝缘层33之间的有机绝缘层31可以实现释放应力的作用，以减少弯折过程给第一无机绝缘层32和第二无机绝缘层33带来的损害，同时还可以起到平坦化的作用。需要说明的是，除了第一无机绝缘层32和第二无机绝缘层33外，该封装薄膜还可以包括层叠设置的更多层无机绝缘层，以对水、氧气进行更好的阻隔。该第一无机绝缘层32、第二无机绝缘层33和有机绝缘层31形成的封装薄膜30既可以满足对水和氧气的阻隔需求、平坦化的作用，同时还便于实现OLED显示面板的窄边框设计。
例如，如图7所示，该OLED像素结构20包括层叠设置的第一电极22、有机绝缘材料功能层23和第二电极25。例如，图11为本公开一实施例提供的一种OLED像素结构的截面结构示意图，在该OLED像素结构中，有机材料功能层23可以包括发光层231、电子注入层232、电子传输层233、空穴注入层234和空穴传输层235。
例如，该电致发光显示面板还包括设置在相邻的OLED像素结构之间的像素界定层24，子像素对应于像素界定层24的开口区域。
例如，该像素界定层24的厚度为1μm～1.5μm，例如，该像素界定层24的厚度可以为1μm，1.2μm，1.4μm或者1.5μm。
例如，该像素界定层24可以用于隔离相邻两个像素结构。例如，像素界定层24通常采用有机绝缘材料(例如，丙烯酸类树脂)或者无机绝缘材料(例如，氮化硅SiNx或者氧化硅SiOx)形成，像素界定层24具有绝缘的性质。
例如，如图11所示，为了有效提高像素结构中有机材料功能层23的发光效率，可以以第一电极22作为阳极，在第一电极22和发光层231之间设置空穴传输层235，空穴传输层235采用溶液制程形成。以第二电极25作为阴极，在第二电极25和发光层231之间设置有电子传输层233，电子传输层233采用真空热蒸镀制程形成。
例如，空穴传输层235的厚度为10～180nm，该空穴传输层235的材料包括聚三苯胺。
例如，电子传输层233的厚度为10～35nm，该电子传输层233材料为八羟基喹啉铝。
例如，如图11所示，该有机材料功能层23还可以包括设置于第二电极25和电子传输层233之间的电子注入层232；设置于第一电极22和空穴传输层235之间的空穴注入层234。
例如，空穴注入层234的厚度为10～180nm；电子注入层232的厚度为1～5nm。
例如，空穴注入层234的材料包括聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(PEDOT/PSS)、聚噻吩和聚苯胺中的任意一种。空穴注入层的材料也可以为三-[4-(5-苯基-2-噻吩基)苯]胺、4,4’,4”-三[2-萘基(苯基)氨基]三苯胺(2-TNATA)、4,4’,4”-三-(3-甲基苯基苯胺基)三苯胺(m-MTDATA)、酞箐铜(CuPc)或TPD。
例如，电子注入层232的材料包括LiF、8-羟基喹啉-锂中的任意一种或组合。电子注入层还可以采用碱金属氧化物、或者其他的碱金属氟化物等。碱金属氧化物包括氧化锂(Li2O)、氧化锂硼(LiBO2)、硅氧化钾(K2SiO3)、碳酸铯(Cs2CO3)等；碱金属氟化物包括氟化钠(NaF)等。
需要说明的是，第一电极22和第二电极25中的一个为阳极，另一个为阴极，除上述第一电极22作为阳极，第二电极25作为阴极的实施方式外，也可以是第一电极22作为阴极，第二电极25作为阳极。作为阳极的电极材料包括氧化铟锡、氧化锌等透明导电材料；作为阴极的电极材料包括铝、镁或者二者形成的合金材料。
例如，在本公开的实施例提供的电致发光显示面板中，该电致发光显示面板为柔性显示面板，需要说明的是，本公开的实施例提供的电致发光显示面板可以是任意类型的OLED面板不限于柔性显示面板。由于本公开的实施例是对像素边缘的形貌进行改进，以减少由于封装薄膜结构中的有机绝缘层带来的不均匀现象，一般柔性显示面板会采用薄膜封装工艺；而非柔性面板目前还可以采用玻璃粉烧结工艺进行封装，并非必须采用薄膜封装工艺，因而针对采用薄膜封装工艺制作的非柔性面板实际上也适用。
例如，该衬底基板10可以为氧化物薄膜晶体管基板、低温多晶硅基板玻璃基板或者树脂材料形成的基板。
本公开至少一实施例还提供一种显示装置，该显示装置包括上述任一 电致发光显示面板。
例如，该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。该显示装置的实施方式可以参见上述任意一种电致发光显示面板的实施方式，重复之处不再赘述。
本公开至少一实施例还提供一种电致发光显示面板的制备方法，例如，图12为本公开一实施例提供的一种制作电致发光显示面板的流程图。如图12所示，该制备过程包括：
步骤101、在衬底基板上形成有机电致发光二极管(OLED)像素结构。
例如，该衬底基板可以为氧化物薄膜晶体管基板、低温多晶硅基板玻璃基板或者树脂材料形成的基板。
例如，该OLED像素结构包括层叠设置的第一电极、有机材料功能层和第二电极，该有机材料功能层可以包括发光层、电子注入层、电子传输层、空穴注入层和空穴传输层。
例如，该电致发光显示面板的制备方法还包括在相邻的OLED像素结构之间形成像素界定层，子像素的边缘对应于像素界定层的开口区域，该像素界定层的厚度为1μm～1.5μm。
例如，该第一电极、有机材料功能层、像素界定层、第二电极以及该有机材料功能层中发光层、电子注入层、电子传输层、空穴注入层和空穴传输层的材料及厚度设计可以参见上述实施例中的相关描述，在此不再赘述。
步骤102、在OLED像素结构上形成覆盖OLED像素结构的封装薄膜，该OLED像素结构呈阵列排布，该OLED像素结构包括多个排列为阵列的子像素，该OLED像素结构阵列具有相交的第一方向和第二方向，该子像素的边缘包括逐渐远离第一方向所在直线的第一部分，该第一部分的延伸方向与第二方向不重合。
例如，各子像素至少沿第一方向(例如，Y方向)的边缘大致为曲线。例如，该子像素的边缘的形状包括圆形、椭圆形和沿第一方向呈蛇形的四边形中的至少之一。
当各子像素边缘的平面形状为圆形时，沿着第一方向(Y方向)的边缘大致为曲线。各子像素除了沿第一方向(Y方向)的边缘为曲线外，沿着第二方向(X方向)的边缘也为曲线，这样进一步地增强了不均匀现象的不规律性，从而减弱甚至消除了显示不均匀的现象。该第一方向例如为对有机薄膜沿平行于Y轴的方向进行流平操作的方向，该第二方向例如为对有机薄膜沿平行于X轴的方向进行流平操作的方向。
例如，该子像素的边缘的形貌为椭圆形，沿第一方向(Y方向)的边缘为曲线，沿着第二方向(X方向)的边缘也为曲线，这样也进一步地增强了不均匀现象的不规律性，从而减弱甚至消除了显示不均匀的现象。
例如，该子像素的边缘的形貌为沿第一方向呈蛇形的四边形，各子像素至少沿第一方向(Y方向)的边缘为曲线。类似的，该子像素的边缘的形貌还可以为沿第一方向呈蛇形且边数大于4的多边形，例如，沿第一方向呈蛇形的五边形、六边形或者八边形等，或者沿第一方向和第二方向均呈蛇形的四边形或者边数大于4的多边形，例如，沿第一方向和第二方向均呈蛇形的五边形、六边形或者八边形等。
例如，各子像素的边缘的形状包括边数大于四边的多边形，例如，子像素的边缘的形状可以为正五边形、正六边形、正八边形等正多边形，或者，子像素的边缘的形状可以为不规则的五边形、六边形或者八边形等。
各子像素至少沿第一方向(Y方向)的边缘大致为曲线或者各子像素的形状包括边数大于四边的多边形时，有机绝缘材料形成的液滴在铺展的过程中，不会因为在第一方向和第二方向上的流动状态不一样而形成规律性的不均匀现象，将各子像素沿第一方向(Y方向)的边缘设计成曲线或者各子像素的形状包括边数大于四边的多边形，可以使得规律性的不均匀变得不规律，使不均匀的状态低于人眼能感知的不均匀现象的程度，进而可以从视觉上消除不均匀现象。
例如，在第一方向上，相邻的子像素关于第二方向所在的直线对称设置；在第二方向上，相邻的子像素关于第一方向所在的直线对称设置。
例如，该封装薄膜至少包括层叠设置的无机绝缘层和有机绝缘层。
例如，该无机绝缘层包括设置在有机绝缘层和像素结构之间的第一无机绝缘层，以及设置在有机绝缘层上的第二无机绝缘层。
例如，该封装薄膜中的第一无机绝缘层和第二无机绝缘层可以实现阻 隔水和氧气的作用，第一无机绝缘层和第二无机绝缘层的可弯折能力差，对第一无机绝缘层和第二无机绝缘层进行弯折时其容易断裂，夹设在第一无机绝缘层和第二无机绝缘层之间的有机绝缘层可以实现释放应力的作用，以减少弯折过程给第一无机绝缘层和第二无机绝缘层带来的损害，同时还可以起到平坦化的作用。需要说明的是，除了第一无机绝缘层和第二无机绝缘层外，该封装薄膜还可以包括层叠设置的更多层无机绝缘层，以对水、氧气进行更好的阻隔。该第一无机绝缘层、第二无机绝缘层和有机绝缘层形成的封装薄膜既可以满足对水和氧气的阻隔需求、平坦化的作用，同时还便于实现OLED显示面板的窄边框设计。
例如，在本公开的实施例提供的制备方法中，形成封装薄膜的方法至少包括涂覆、喷墨打印或者印刷的方式。
例如，本公开的实施例提供的制备方法还包括利用真空设备完成第一无机绝缘层和第二无机绝缘层的制备，例如，采用等离子体增强化学气相沉积法或者溅射的方法形成第一无机绝缘层和第二无机绝缘层。
例如，本公开的实施例提供的制备方法还包括在相邻的OLED像素结构之间形成像素界定层，子像素对应于像素界定层的开口区域，该像素界定层的厚度为1μm～1.5μm。
本公开至少一实施例提供的电致发光显示面板及其制备方法、显示装置具有以下至少一项有益效果：
(1)本公开至少一实施例提供的电致发光显示面板，通过将子像素的边缘设置成包括逐渐远离第一方向所在直线的第一部分，该第一部分的延伸方向与第二方向不重合，在制作后续的薄膜封装层的过程中，可以提高有机薄膜封装层的铺展效果；
(2)本公开至少一实施例提供的电致发光显示面板，可以提升封装的信赖性，提高电致发光显示面板的显示质量。
有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时， 该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (14)

  1. 一种电致发光显示面板，包括：
    衬底基板，
    像素结构，所述像素结构设置在所述衬底基板上；
    封装层，所述封装层设置在所述像素结构上，其中，
    所述像素结构呈阵列排布，所述像素结构包括多个排列为阵列的子像素，所述像素结构阵列具有相交的第一方向和第二方向，所述子像素的边缘包括逐渐远离所述第一方向所在直线的第一部分，所述第一部分的延伸方向与所述第二方向不重合。
  2. 根据权利要求1所述的电致发光显示面板，其中，所述第一部分大致为曲线。
  3. 根据权利要求2所述的电致发光显示面板，其中，所述子像素的形状包括圆形、椭圆形和沿所述第一方向呈蛇形的四边形中的至少之一。
  4. 根据权利要求1所述的电致发光显示面板，其中，所述子像素的边缘的形状包括边数大于四边的多边形。
  5. 根据权利要求1～4中任一项所述的电致发光显示面板，其中，在所述第一方向上，相邻的所述子像素关于所述第二方向所在的直线对称设置；在所述第二方向上，相邻的所述子像素关于所述第一方向所在的直线对称设置。
  6. 根据权利要求1～5中任一项所述的电致发光显示面板，其中，所述封装薄膜至少包括层叠设置的无机绝缘层和有机绝缘层。
  7. 根据权利要求6所述的电致发光显示面板，其中，所述无机绝缘层包括设置在所述有机绝缘层和所述像素结构之间的第一无机绝缘层，以及设置在所述有机绝缘层上的第二无机绝缘层。
  8. 根据权利要求6所述的电致发光显示面板，其中，所述有机绝缘层的材料包括丙烯酸树脂或亚克力树脂中的至少一种。
  9. 根据权利要求1～8中任一项所述的电致发光显示面板，其中，所述像素结构包括层叠设置的第一电极、有机材料功能层和第二电极。
  10. 根据权利要求1～9中任一项所述的电致发光显示面板，还包括：设置在相邻的所述像素结构之间的像素界定层，其中，所述子像素对应于 所述像素界定层限定的开口区域，所述像素界定层的厚度为1μm～1.5μm。
  11. 根据权利要求1～10中任一项所述的电致发光显示面板，其中，所述电致发光显示面板为柔性显示面板。
  12. 一种显示装置，包括权利要求1～11中任一项所述的电致发光显示面板。
  13. 一种电致发光显示面板的制备方法，包括：
    在衬底基板上形成有机电致发光二极管像素结构；
    在所述像素结构上形成覆盖所述像素结构的封装薄膜；
    其中，所述像素结构呈阵列排布，所述像素结构包括多个排列为阵列的子像素，所述像素结构阵列具有相交的第一方向和第二方向，所述子像素包括逐渐远离所述第一方向所在直线的第一部分，所述第一部分的延伸方向与所述第二方向不重合。
  14. 根据权利要求13所述的制备方法，其中，所述封装薄膜至少包括层叠设置的无机绝缘层和有机绝缘层，形成所述封装薄膜至少包括通过涂覆、喷墨打印或者印刷的方式形成所述有机绝缘层。
PCT/CN2017/110196 2017-03-02 2017-11-09 电致发光显示面板及其制备方法、显示装置 Ceased WO2018157620A1 (zh)

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