WO2018176655A1 - 一种集成式rgb-led显示屏 - Google Patents

一种集成式rgb-led显示屏 Download PDF

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Publication number
WO2018176655A1
WO2018176655A1 PCT/CN2017/089334 CN2017089334W WO2018176655A1 WO 2018176655 A1 WO2018176655 A1 WO 2018176655A1 CN 2017089334 W CN2017089334 W CN 2017089334W WO 2018176655 A1 WO2018176655 A1 WO 2018176655A1
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WO
WIPO (PCT)
Prior art keywords
led display
rgb
integrated
light
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/089334
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English (en)
French (fr)
Inventor
李邵立
孔一平
袁信成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Prosperous Star Optoelectronics Co Ltd
Original Assignee
Shandong Prosperous Star Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Prosperous Star Optoelectronics Co Ltd filed Critical Shandong Prosperous Star Optoelectronics Co Ltd
Priority to EP17902666.1A priority Critical patent/EP3557615A4/en
Priority to JP2019522223A priority patent/JP2020504437A/ja
Priority to US16/346,109 priority patent/US20190259734A1/en
Publication of WO2018176655A1 publication Critical patent/WO2018176655A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad

Definitions

  • the present invention relates to SMD LED (Surface Mounted Devices) packaging technology
  • LEDs for display screens are made of the original DIP (dual inline-pin package
  • SMD structure LED has the advantages of light weight, smaller individual, automatic installation, large illumination angle, uniform color, reduced attenuation, etc., although more and more accepted, although Generally, SMD LEDs have the above advantages, but there are still large attenuation, long heat conduction path, low carrying current, complicated production, low reliability, low moisture resistance and poor weather resistance; if the overall structure of the product is not changed, To improve the reliability of products, there is still no good solution in the industry.
  • the pixel pitch of the LED display is reduced, the number of packaged devices per unit area is increasing, which makes the proportion of the packaged device in the whole screen increase.
  • the cost of packaged devices has reached more than 70%.
  • the increase in lamp bead demand is about 50%, which means that the production capacity of all lamp bead manufacturers needs to increase by more than 50%.
  • the full-color lamp beads used for small pitches are mainly in a single shape (as shown in Fig. 1 and Fig. 2). Due to the large number and low production efficiency, the quality is easy to produce.
  • the production efficiency of the COB (chip on board) integrated module has been improved, but the COB integrated module also has many problems, such as the difference in the center value of different batches of chips in the module or the difference in substrate ink. The color difference is caused, and the consistency of the whole screen is poor.
  • the chip is directly mounted on the circuit board, lacks protection, cannot guarantee reliability, and the illumination unit fails to maintain high cost.
  • An object of the present invention is to provide an integrated RGB LED display screen, which aims to solve the problems of low production efficiency, poor mechanical strength, and poor heat dissipation performance of the existing RGB LED display.
  • An integrated RGB LED display comprising a PCB board and a plurality of RGB soldered on the PCB
  • the LED package module is characterized in that: the package module comprises a package holder and a light-emitting unit disposed on the package holder, the number of the light-emitting units is at least two, and each group of the light-emitting units comprises a set of RG B LEDs chip.
  • the integrated RGB LED display screen wherein the package holder comprises a metal bottom plate and an insulating frame, and the metal bottom plate is provided with a bracket electrode for fixing and bonding wires in a region where each of the light emitting units is located.
  • the light emitting unit includes an RGB LED chip fixed on the metal base plate and a key and a wire connecting the RGB LED chip and the holder electrode, and the holder electrode is electrically connected to the PCB board through a pad provided on the back surface of the metal base plate.
  • the integrated RGB LED display screen wherein the metal base plate is provided with a step on the front side and/or the back side.
  • the integrated RGB LED display screen wherein the metal base plate is further provided with a support area that is flush with the height of the pad.
  • the integrated RGB LED display screen wherein the support area is a circular, square or irregular shape support structure.
  • the integrated RGB LED display screen is provided with a protective layer on the light emitting unit.
  • the beneficial effects of the present invention include:
  • the integrated RGB LED display provided by the invention integrates a plurality of light emitting units on one package module, thereby further improving production efficiency and reducing production cost.
  • the plurality of light-emitting units are integrated on one package module, which can effectively improve the overall mechanical strength of the display screen; compared with the existing integrated module, the package module of the invention comprises fewer light-emitting units, which can effectively avoid different
  • the batch chip center value difference or the substrate ink difference causes color difference, the whole screen consistency is poor, and now the integrated module has high maintenance cost if the light unit fails to be repaired, and the invention has low maintenance cost.
  • the invention enhances the electrical conductivity by using a metal base plate instead of the existing electroplated thin metal, and directly contacts the PCB board through the metal base plate, the heat dissipation path is short, and the heat of the chip can be quickly exported;
  • the structure, the concentrated light, makes the luminous surface unique, and thus makes the LED display resolution, brightness and dark contrast better.
  • FIG. 1 is a schematic structural view of a conventional PPA stent.
  • FIG. 2 is a schematic structural view of a conventional CHIP type package bracket.
  • FIG. 3 is a schematic diagram of a front structure of an integrated RGB LED display provided by the present invention.
  • FIG. 4 is a partially enlarged front view of an integrated RGB LED display screen provided by the present invention.
  • FIG. 5 is a schematic diagram of a front structure of a package module of an integrated RGB LED display provided by the present invention.
  • FIG. 6 is a cross-sectional view of a package module of an integrated RGB LED display screen provided by the present invention.
  • FIG. 7 is a schematic diagram of a reverse structure of a package module of an integrated RGB LED display provided by the present invention.
  • FIG. 8 is a schematic diagram of a front structure of a package module of a 1 ⁇ 2 integrated RGB LED display provided by the present invention.
  • FIG. 9 is a schematic diagram showing the front structure of a package module of a 1 ⁇ 3 integrated RGB LED display provided by the present invention.
  • FIG. 10 is a schematic diagram of a front structure of a package module of a 1 ⁇ 3 integrated RGB LED display provided by the present invention.
  • FIG. 11 is a schematic diagram showing the front structure of a package module of a 1 ⁇ 9 integrated RGB LED display provided by the present invention.
  • FIG. 12 is a schematic diagram of a front structure of a metal backplane of a package module of a 1 ⁇ 4 integrated RGB LED display screen according to the present invention.
  • FIG. 13 is a schematic diagram showing the reverse structure of a metal backplane of a package module of a 1 ⁇ 4 integrated RGB LED display screen according to the present invention.
  • FIG. 14 is a schematic diagram showing the front structure of an uncut metal base plate of a package module of a 1 ⁇ 4 integrated RGB LED display provided by the present invention.
  • FIG. 1 is a schematic structural view of a conventional PPA+ copper lead package bracket. Since the package bracket is attached to the metal by an injection molding machine, the semiconductor material is not adhered together, and the thermal expansion and contraction are performed. There is a gap between them. When the final customer uses water and water vapor from the outside, it is easy to enter the package through the gap, causing product failure.
  • 2 is a schematic structural view of a conventional CHIP type package bracket, which is obtained by encapsulating the glass fiber with a resin 801, and then etching the line by copper and platinum, and the gap and moisture absorption rate of the material are high, and the materials are various.
  • an integrated RGB LED display screen 1 provided by the present invention includes a PCB board and a plurality of RGB LED package modules 2 soldered on the PCB board, as shown in FIG. 5 to FIG. 7 , the package module 2 includes a package holder and a light-emitting unit disposed on the package holder.
  • the number of the light-emitting units is at least two, and each group of the light-emitting units includes a set of RGB LED cores 301 .
  • the number of the light emitting units may be 2-16.
  • the number of the light emitting units is 4.
  • the package holder includes a metal base plate 100 and an insulating frame 200. In practical applications, the material of the metal base plate 100 may be copper or iron.
  • the surface is plated with gold or silver to enhance electrical conductivity and facilitate welding.
  • Insulation frame material It is considered that the epoxy resin, PPA, PCT and the like are epoxy resins in this embodiment.
  • the metal base plate 100 is provided with a bracket electrode 101 for die bonding and wire bonding in a region where each of the light emitting units is located. In practical applications, the number of the bracket electrodes 101 is four, and the metal base plate 100 is etched or stamped.
  • the illuminating unit includes an RGB LED chip 301 fixed on the metal base plate, and a key and a line 302 connecting the RGB LED chip and the bracket electrode.
  • the light emitting unit is provided with a protective layer 400, and the bracket electrode is disposed through The pad 102 on the back surface of the metal base 100 is connected to an external circuit.
  • the invention directly contacts the PCB board by using the metal base plate 100, and the heat dissipation path is short, and the heat of the chip can be quickly exported.
  • the number of packaged devices per unit area of the LED display panel increases, as long as the density is increased by one level, the amount of heat generated is extremely large, and the structure of the present invention can discharge heat very efficiently.
  • the package module of the present invention has a plurality of light-emitting units, and the mounting efficiency thereof is increased by N times compared with a single-shaped lamp bead (N is the number of light-emitting units on the package module).
  • the insulating frame 200 forms a bowl 201 around the light emitting unit.
  • the light of the RGB LED can be more concentrated, and the light emitting surface is unique, which avoids the influence of other surrounding light-emitting units, thereby making the display resolution, brightness and dark contrast better.
  • the setting of the cup 201 further enhances the mechanical protection of the light-emitting unit, and avoids the problem of the surface protective layer being detached due to an external force.
  • the height of the bowl 201 is 0.2-0.8 mm.
  • the metal base plate 100 is provided with a step 103 for reinforcing the tightness and stability of the combination of the metal base plate 100 and the insulating frame 200, preventing water and moisture from entering, and further The mechanical strength of the module is enhanced.
  • the step 103 may be disposed on the front surface of the metal base plate 100, or may be disposed on the reverse side of the metal base plate 100, or may be disposed on the front and back sides of the metal base plate 100, and the number of the steps 103 is at least one.
  • the step 103 is located on the front and back sides of the metal base plate 100.
  • the metal substrate 100 is further provided with a support region 104 which is highly flush with the pad 102.
  • the arrangement of the support region 104 can ensure the flatness of the metal base plate 100 during the manufacturing process, and prevent the metal base plate 100 from being deformed or tilted in the molded insulating frame.
  • the support zone 102 can be a circular, square or other irregularly shaped support zone or support post.
  • the number of the support regions 102 may be one or plural, and the present invention does not further limit this.
  • the surface of the protective layer 400 is rough and non-reflective, and further the protective layer 400 is a translucent epoxy resin layer with a diffusing agent.
  • the protective layer 400 is seamlessly combined with the bowl 201 to further prevent water and water The entry of steam, the waterproof effect is much better than the existing metal and plastic bonding.
  • the surface of the protective layer 400 is rough and non-reflective, and the influence of external light is reduced.
  • the translucent epoxy resin tape has a diffusing agent, and combines with the structure of the cup 201 to form an optical lens to make the LED light more concentrated. .
  • the protective layer 400 can be prepared by injecting the glue liquid into the cavity of the cup 201 by means of spot or irrigation.
  • a translucent epoxy resin liquid with a diffusing agent is selected, and then It is cured by heating, and the temperature for heating is preferably 100-300 degrees Celsius.
  • the protective layer of the whole cup is flush with the height of the bowl 201, and the height of the cup 201 can be 0.5-0.7 mm.
  • the protective layer 400 made by this method has higher stability.
  • the glue injection method may further press the glue into the cavity of the bowl 201 through the designed MGP mold, and the glue is a liquid glue or a solid cake.
  • This method is a half cup cup protective layer, the height of the cup 201 is slightly lower than the height of the protective layer 400, and the height of the cup 201 can be 0.3-0.5 mm, and the protective layer supported by this method is lower in cost.
  • FIG. 8 to FIG. 11 an embodiment of a package module having different numbers of light emitting units according to the present invention is provided.
  • the number of the light emitting units is two, the number of the light emitting units in FIG. 9 is three, and the number of the light emitting units in FIG. 11 is nine.
  • the number of the light emitting units is at least two, and preferably, the number of the light emitting units is 2-16.
  • the arrangement of the light emitting units may also be inverted "L" shaped.
  • the arrangement of the light-emitting units is not limited in the present invention, and may be a "one"-shaped arrangement, or a combination of rows and columns of MxN (M and N are integers), and may also be other irregular arrangement shapes.
  • the invention is not limited thereto. It should be noted that those skilled in the art can make modifications or changes in accordance with the above description, all of which are within the scope of the appended claims.
  • FIG. 12 to FIG. 14 is a schematic structural diagram of a metal backplane 100 of a package module of 1 ⁇ 4 (ie, one light-emitting unit having four light-emitting units) provided by the present invention.
  • a metal backplane 100 of a package module of 1 ⁇ 4 ie, one light-emitting unit having four light-emitting units
  • the metal base plate 100 is first made into a conductive circuit, and then all the support electrodes 101 are connected together. After the electroplating is performed, the metal base plate 100 is cut by a cutter to break the joints of all the support electrodes 101. Thereby solving the above problem. Referring to FIG.
  • connection of all the bracket electrodes 101 can be set at In the position where the cutter is cut, it is ensured that the joints of all the holder electrodes 101 are cut off in the cutting process.
  • the present invention does not limit the connection direction of the bracket electrode 101 and the specific shape and circuit formed by etching or stamping the metal base plate 100. For those skilled in the art, it can be improved or changed according to the above description. These modifications and variations are intended to fall within the scope of the appended claims.
  • the manufacturing process of the integrated RGB LED display screen of the present invention comprises the following steps:
  • Step 1 forming the metal substrate 100 into a conductive line by etching or stamping;
  • Step 2 The glue is wrapped on the metal base plate 100 by a molding machine to leave the support electrode of the solid crystal and the bonding wire.
  • Step 3 plating the metal on the holder electrode 101;
  • Step 4 RGB LED chip 301 is fixed on the holder electrode 101, and the bonding wire is formed to form a physical electrical connection;
  • Step 5 injecting a protective layer 400 on the light emitting unit
  • Step 6 cutting into a single package module by a cutting machine
  • Step 7 Mount the package module on the PCB to further form an RGB LED display.

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Abstract

一种集成式RGB-LED显示屏（1），包括PCB板以及焊接在所述PCB板上的多个RGB LED封装模组（2），所述封装模组（2）包括封装支架以及设置在所述封装支架上的发光单元，所述发光单元的数量至少为两个，每组发光单元包括一组RGB LED芯片（301）。该集成式RGB LED显示屏（1），将多个发光单元集成在一个封装模组（2）上，进一步提高了生产效率，降低了生产成本。另外，多个发光单元集成在一个封装模组（2）上，能有效提高显示屏整体抗外界机械强度能力。

Description

一种集成式 RGB-LED显示屏
技术领域
[0001] 本发明涉及到 SMD LED (Surface Mounted Devices , 表面贴装器件） 封装技术
， 特别是涉及一种集成式 RGB LED显示屏。
背景技术
[0002] 随着显示屏产业不断发展， 显示屏用 LED由原来的 DIP (dual inline-pin package
， 双列直插式封装技术） 结构高速向 SMD结构转变， SMD结构的 LED具有重量 轻、 个体更小、 自动化安装、 发光角度大、 颜色均匀、 衰减少等优点越来越被 人接受， 虽然一般 SMD LED具有以上优点， 但还是存在有衰减较大、 导热路径 长、 承载电流低、 生产复杂,可靠性低,防潮性能低,耐气候性差； 如果在不改变产 品的整体结构的情况下， 要提高产品的可靠性， 至今在业界仍没有较好的解决 办法。
[0003] 现有的小间距 LED显示屏主要采用 2121、 1515、 1010、 0808等型号封装器件。
随着 LED显示屏像素间距的缩小， 单位面积上的封装器件数量越来越多， 使得封 装器件在整屏的成本中， 占比呈上升趋势。 根据测算， 在小间距 LED显示屏 P1.9 及更小间距型号的产品， 封装器件成本占比已经达到 70%以上。 只要密度提升一 个级别， 灯珠需求的增涨是提高 50%左右， 也就是所有灯珠的生产厂家生产能力 需增加 50%以上。 目前小间距采用的全彩灯珠主要为单颗形态 （如图 1和图 2所示 ) ， 应用吋由于数量巨大， 生产效率低， 同吋容易出品质问题。 针对单颗贴装 的问题， 采用 COB (chip On board) 集成模组的生产效率有所提高， 但是 COB集 成模组同样存在诸多问题， 如模组中不同批次芯片中心值差异或基板油墨差异 导致显色差异， 整屏一致性差， 另一方面， 芯片直接安装在电路板上， 缺乏保 护， 无法保证可靠性， 且发光单元失效维修成本高。
[0004] 因此， 现有技术还有待于改进和发展。
技术问题
问题的解决方案 技术解决方案
[0005] 本发明的目的在于提供一种集成式 RGB LED显示屏， 旨在解决现有的 RGB LED显示屏生产效率低、 产品机械强度差以及散热性能差等问题。
[0006] 为解决上述问题， 本发明的技术方案如下：
[0007] 一种集成式 RGB LED显示屏， 包括 PCB板以及焊接在所述 PCB板上的多个 RGB
LED封装模组， 其特征在于， 所述封装模组包括封装支架以及设置在所述封装支 架上的发光单元， 所述发光单元的数量至少为两个， 每组发光单元包括一组 RG B LED芯片。
[0008] 所述的集成式 RGB LED显示屏， 其中， 所述封装支架包括金属底板和绝缘框架 ， 所述金属底板在每个发光单元所在区域设置有用于固晶和焊线的支架电极， 所述发光单元包括固定在所述金属底板上的 RGB LED芯片以及连接所述 RGB LED芯片与支架电极的键和线， 所述支架电极通过设置在金属底板背面的焊盘与 PCB板电连接。
[0009] 所述的集成式 RGB LED显示屏， 其中， 所述绝缘框架在所述发光单元周围形成 碗杯。
[0010] 所述的集成式 RGB LED显示屏 其中， 所述金属底板正面和 /或反面设置有台 阶。
[0011] 所述的集成式 RGB LED显示屏 其中， 所述金属底板上还设有与所述焊盘高度 平齐的支撑区。
[0012] 所述的集成式 RGB LED显示屏 其中， 所述支撑区为圆形、 方形或不规则形状 的支撑结构。
[0013] 所述的集成式 RGB LED显示屏 其中， 所述发光单元上设有保护层。
[0014] 所述的集成式 RGB LED显示屏 其中， 所述第一保护层或第二保护层表面粗糙 不反光。
[0015] 所述的集成式 RGB LED显示屏 其中， 所述碗杯的高度为 0.2-0.8mm。
[0016] 所述的集成式 RGB LED显示屏 其中， 所述台阶的数量至少为一个。
[0017] 本发明的有益效果包括： 本发明提供的集成式 RGB LED显示屏， 将多个发光单 元集成在一个封装模组上， 进一步提高了生产效率， 降低了生产成本。 另外， 多个发光单元集成在一个封装模组上， 能有效提高显示屏整体抗外界机械强度 能力； 与现有集成式模组对比， 本发明一个封装模组包含发光单元较少， 可有 效避免因不同批次芯片中心值差异或基板油墨差异导致显色差异， 整屏一致性 差问题， 并且现在集成式模组若出现发光单元失效维修成本高， 本发明维修成 本低。 另一方面， 本发明通过使用金属底板代替现有的电镀薄金属的方式， 增 强了导电性能， 通过金属底板直接与 PCB板接触， 散热路径较短， 芯片热量能够 快速导出； 通过正面形成碗杯的结构， 集中光线， 使发光面唯一， 进而使 LED显 示屏分辨率、 亮暗对比度等更优。
发明的有益效果
对附图的简要说明
附图说明
[0018] 图 1现有 PPA支架的结构示意图。
[0019] 图 2现有 CHIP类型封装支架的结构示意图。
[0020] 图 3为本发明提供的一种集成式 RGB LED显示屏的正面结构简图。
[0021] 图 4为本发明提供的一种集成式 RGB LED显示屏的正面局部放大图。
[0022] 图 5为本发明提供的一种集成式 RGB LED显示屏的封装模组的正面结构简图。
[0023] 图 6为本发明提供的一种集成式 RGB LED显示屏的封装模组的剖视图。
[0024] 图 7为本发明提供的一种集成式 RGB LED显示屏的封装模组的反面结构简图。
[0025] 图 8为本发明提供的一种 1x2集成式 RGB LED显示屏的封装模组的正面结构简 图。
[0026] 图 9为本发明提供的一种 1x3集成式 RGB LED显示屏的封装模组的正面结构简 图。
[0027] 图 10为本发明提供的一种 1x3集成式 RGB LED显示屏的封装模组的正面结构简 图。
[0028] 图 11为本发明提供的一种 1x9集成式 RGB LED显示屏的封装模组的正面结构简 图。
[0029] 图 12为本发明提供的一种 1x4集成式 RGB LED显示屏的封装模组的金属底板正 面结构简图。 [0030] 图 13为本发明提供的一种 1x4集成式 RGB LED显示屏的封装模组的金属底板反 面结构简图。
[0031] 图 14为本发明提供的一种 1x4集成式 RGB LED显示屏的封装模组的未切割金属 底板正面结构简图。
[0032] 附图标记说明： 1、 RGB LED显示屏； 2、 封装模组； 100、 金属底板； 101、 支 架电极； 102、 焊盘； 103、 台阶； 104、 支撑区； 200、 绝缘框架； 201、 碗杯； 301、 RGB LED芯片； 302、 键和线； 400、 保护层； 701、 热塑性材料； 702、 金 属； 801、 树脂； 802、 平胶。
本发明的实施方式
[0033] 为使本发明的目的、 技术方案及优点更加清楚、 明确， 以下参照附图并举实施 例对本发明进一步详细说明。
[0034] 图 1为现有的 PPA+铜引脚的封装支架的结构示意图， 由于该类型的封装支架通 过注塑机将热塑性材料与金属进行贴紧， 没有沾接在一起， 当热胀冷缩吋， 它 们之间容易产生间隙， 当最终客户在使用吋外界的水和水汽容易通过间隙进入 封装体内， 从而引起产品失效。 图 2为现有 CHIP类型封装支架的结构示意图， 通 过用树脂 801将玻纤包围压实， 然后通过沾上铜铂蚀刻线路而成， 材料的间隙和 吸湿率都很高， 而且这多种材料的膨胀率不一样， 而后期在平面上再模压一层 平胶 802作为保护层， 这种方式没有办法形成一个杯形的保护， 将存在诸多问题 。 另一方面， 图 1和图 2所示的产品均为单颗形态的产品， 在进行后续帖装吋， 生产效率极低。
[0035] 参见图 3和图 4， 为本发明提供的一种集成式 RGB LED显示屏 1， 包括 PCB板以 及焊接在所述 PCB板上的多个 RGB LED封装模组 2， 参见图 5至图 7， 封装模组 2 包括封装支架以及设置在所述封装支架上的发光单元， 所述发光单元的数量至 少为两个， 每组发光单元包括一组 RGB LED芯 301。 优选地， 所述发光单元的数 量可以为 2-16个， 在本实施例中， 所述发光单元的数量为 4个。 所述封装支架包 括金属底板 100和绝缘框架 200， 在实际应用中， 金属底板 100的材料可以为铜或 铁， 优选地， 表面镀金或镀银， 以增强导电性， 方便焊接。 绝缘框架的材料可 以为环氧树脂、 PPA、 PCT等材料， 在本实施例中为环氧树脂。 金属底板 100在 每个发光单元所在区域设置有用于固晶和焊线的支架电极 101， 在实际应用中， 支架电极 101的数量为四个， 由金属底板 100经蚀刻或冲压而成。 所述发光单元 包括固定在所述金属底板上的 RGB LED芯片 301以及连接所述 RGB LED芯片与 支架电极的键和线 302， 所述发光单元上设置有保护层 400， 所述支架电极通过 设置在金属底板 100背面的焊盘 102与外部电路连接。 本发明通过使用金属底板 1 00直接与 PCB板接触， 散热路径短， 芯片热量能够快速导出。 特别是随着 LED显 示屏单位面积上的封装器件数量越来越多， 只要密度提升一个级别， 其产生的 热量都是非常巨大的， 采用本发明的结构可以非常有效地将热量排出。 另一方 面， 本发明的封装模组具有多个发光单元， 其贴装效率相比单颗形态的灯珠将 提升 N倍 （N为封装模组上的发光单元数量） 。
[0036] 参见图 6， 绝缘框架 200在所述发光单元周围形成碗杯 201。 通过碗杯 201的设置 ， 可以使 RGB LED的光线更加集中， 发光面唯一， 避免了周围其他发光单元的 影响， 进而使做成的显示屏分辨率、 亮暗对比度等更优。 同吋， 碗杯 201的设置 进一步增强了对发光单元的机械保护， 避免了因外力作用导致的表面保护层脱 落的问题。 优选地， 碗杯 201的高度为 0.2-0.8mm。
[0037] 在实际生产中， 参见图 6， 金属底板 100上设置有台阶 103， 用于加强金属底板 1 00与绝缘框架 200结合的紧密性和稳定性， 防止水及水汽的进入， 同吋进一步加 强了模组的机械强度。 优选地， 台阶 103可以设置在金属底板 100正面， 也可以 设置在金属底板 100反面， 还可以在金属底板 100正反面同吋设置， 台阶 103的数 量至少为一个。 优选地， 台阶 103位于金属底板 100的正反面。
[0038] 参见图 7， 在实际生产中， 金属底板 100上还设有与焊盘 102高度平齐的支撑区 1 04。 支撑区 104的设置可以保证所述封装模组在制作过程中金属底板 100的平整 性， 防止金属底板 100在模压绝缘框架吋变形或倾斜。 优选地， 支撑区 102可以 为圆形、 方形或其他不规则形状的支撑区或支撑柱。 支撑区 102的数量可以为一 个， 也可以为多个， 本发明对此也不做进一步的限定。
[0039] 参见图 6， 优选地， 保护层 400表面粗糙不反光， 进一步地保护层 400为带有扩 散剂的半透明环氧树脂层。 保护层 400与碗杯 201无缝结合， 进一步防止水及水 汽的进入， 防水效果比现有的金属和塑料粘合要好得多。 另一方面， 保护层 400 表面粗糙不反光， 减少了外界光线的影响， 进一步地， 所述半透明环氧树脂胶 带有扩散剂， 结合碗杯 201的结构， 形成光透镜， 使 LED光线更加集中。
[0040] 在实际生产中， 保护层 400的制作方式可以为将胶液体通过点或灌的方式注入 碗杯 201腔内， 优选地， 选用带有扩散剂的半透明环氧树脂胶液体， 再使用加温 的方式将其固化， 加温的温度优选为 100-300摄氏度。 此种方式为全碗杯保护层 ， 保护层 400与碗杯 201的高度平齐， 碗杯 201的高度可以为 0.5-0.7mm， 该种方式 制成的保护层 400稳定性更高。
[0041] 所述注胶方式还可以为通过设计好的 MGP模具将胶压入碗杯 201腔内， 所述胶 为液体胶或固体胶饼。 此种方式为半碗杯保护层， 碗杯 201的高度略低于保护层 400的高度， 碗杯 201的高度可以为 0.3-0.5mm， 该种方式支撑的保护层成本较低
[0042] 参见图 8至图 11， 为本发明提供的具有不同数量发光单元的封装模组实施例。
如图 8所示， 该实施例中， 所述发光单元的数量为 2个， 图 9中发光单元的数量为 3个， 图 11中发光单元的数量为 9个。 在本发明中， 所述发光单元的数量至少为 2 个， 优选地， 所述发光单元的数量为 2-16个。 参见图 10， 所述发光单元的排列形 态还可以是倒 "L"形的。 对于所述发光单元的排列方式本发明并不做限制， 既可 以是"一"字形排列， 也可以是 MxN (M和 N均为整数） 的行列组合排列， 还可以 是其他不规则的排列形状， 本发明对此并不做限制。 应当注意的是， 对本领域 普通技术人员来说， 可以根据上述说明加以改进或变换， 所有这些改进和变换 都应属于本发明所附权利要求的保护范围。
[0043] 参见图 12-图 14， 为本发明提供的 1x4 (即一个发光单元拥有 4个发光单元） 的 封装模组的金属底板 100的结构简图。 在实际生产中， 由于支架电极 101需相互 独立， 否则将导致短路， 而如需对支架电极 101进行电镀， 则必须将所有支架电 极 101连在一起。 本发明通过先将金属底板 100做成导电线路， 此吋所有支架电 极 101还连在一起， 在进行电镀后， 再将金属底板 100通过切割机进行切割， 使 所有支架电极 101连接处断幵， 从而解决了上述问题。 参见图 14， 针对所述封装 模组上具有不同数量发光单元的情形， 可以将所有支架电极 101的连接处设置在 切割机切割的位置上， 如此可以保证在切割工序吋将所有支架电极 101的连接处 均切断。 需要注意的是， 本发明对支架电极 101的连接方向及金属底板 100蚀刻 或冲压形成的具体形状及线路并不做限定， 对本领域普通技术人员来说， 可以 根据上述说明加以改进或变换， 所有这些改进和变换都应属于本发明所附权利 要求的保护范围。
[0044] 本发明所述的集成式 RGB LED显示屏的制造流程， 包括以下步骤：
[0045] 步骤 1 : 将金属底板 100通过蚀刻或冲压的方式做成导电线路；
[0046] 步骤 2: 通过模压机将胶包裹在金属底板 100上， 留出固晶和焊线的支架电极 10
1， 形成封装支架；
[0047] 步骤 3: 在支架电极 101上镀上金属；
[0048] 步骤 4: 将 RGB LED芯片 301固晶在支架电极 101上， 并进行焊线， 形成物理电 性连接；
[0049] 步骤 5: 在所述发光单元上注压保护层 400;
[0050] 步骤 6: 通过切割机切成单个封装模组；
[0051] 步骤 7: 将封装模组贴装到 PCB板上， 进一步制成 RGB LED显示屏。
[0052] 应当理解的是， 本发明的应用不限于上述的举例， 对本领域普通技术人员来说 ， 可以根据上述说明加以改进或变换， 所有这些改进和变换都应属于本发明所 附权利要求的保护范围。

Claims

权利要求书
[权利要求 1] 一种集成式 RGB-LED显示屏， 包括 PCB板以及焊接在所述 PCB板上 的多个 RGB LED封装模组， 其特征在于， 所述封装模组包括封装支 架以及设置在所述封装支架上的发光单元， 所述发光单元的数量至少 为两个， 每组发光单元包括一组 RGB LED芯片。
[权利要求 2] 根据权利要求 1所述的集成式 RGB-LED显示屏， 其特征在于， 所述封 装支架包括金属底板和绝缘框架， 所述金属底板在每个发光单元所在 区域设置有用于固晶和焊线的支架电极， 所述发光单元包括固定在所 述金属底板上的 RGB LED芯片以及连接所述 RGB LED芯片与支架电 极的键和线， 所述支架电极通过设置在金属底板背面的焊盘与 PCB板 电连接。
[权利要求 3] 根据权利要求 2所述的集成式 RGB-LED显示屏， 其特征在于， 所述绝 缘框架在所述发光单元周围形成碗杯。
[权利要求 4] 根据权利要求 2所述的集成式 RGB-LED显示屏， 其特征在于， 所述金 属底板正面和 /或反面设置有台阶。
[权利要求 5] 根据权利要求 2所述的集成式 RGB-LED显示屏， 其特征在于， 所述金 属底板上还设有与所述焊盘高度平齐的支撑区。
[权利要求 6] 根据权利要求 5所述的集成式 RGB-LED显示屏， 其特征在于， 所述支 撑区为圆形、 方形或不规则形状的支撑结构。
[权利要求 7] 根据权利要求 2所述的集成式 RGB-LED显示屏， 其特征在于， 所述发 光单元上设有保护层。
[权利要求 8] 根据权利要求 7所述的集成式 RGB-LED显示屏， 其特征在于， 所述第 一保护层或第二保护层表面粗糙不反光。
[权利要求 9] 根据权利要求 3所述的集成式 RGB-LED显示屏， 其特征在于， 所述碗 杯的高度为 0.2-0.8mm。
[权利要求 10] 根据权利要求 4所述的集成式 RGB-LED显示屏， 其特征在于， 所述台 阶的数量至少为一个。
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