WO2018191836A1 - 基于平板环路热管的均热板 - Google Patents

基于平板环路热管的均热板 Download PDF

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WO2018191836A1
WO2018191836A1 PCT/CN2017/000655 CN2017000655W WO2018191836A1 WO 2018191836 A1 WO2018191836 A1 WO 2018191836A1 CN 2017000655 W CN2017000655 W CN 2017000655W WO 2018191836 A1 WO2018191836 A1 WO 2018191836A1
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Prior art keywords
heat
plate
pipe
liquid
evaporator
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PCT/CN2017/000655
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English (en)
French (fr)
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张红星
满广龙
黄金印
李国广
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Beijing Institute of Spacecraft System Engineering
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Beijing Institute of Spacecraft System Engineering
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Priority to EP17906083.5A priority Critical patent/EP3614089B1/en
Publication of WO2018191836A1 publication Critical patent/WO2018191836A1/zh
Anticipated expiration legal-status Critical
Priority to US16/658,150 priority patent/US20200116437A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Definitions

  • the invention relates to a soaking plate, in particular to a soaking plate based on a flat loop heat pipe, belonging to the technical field of electronic device heat dissipation.
  • the loop heat pipe is a high-efficiency two-phase heat transfer device, which has high heat transfer performance, long-distance heat transfer, excellent temperature control characteristics, and can be bent and installed easily, and has many other heat transfer devices. Comparable advantages, loop heat pipes have broad application prospects in many fields such as aviation, aerospace and ground electronic equipment cooling.
  • the loop heat pipe mainly comprises: an evaporator 1, a condenser 2, a liquid reservoir 3, a vapor line 4, and a liquid line 5, and the whole cycle process is: a capillary core of the liquid in the evaporator 1.
  • the outer surface evaporates, absorbing heat outside the evaporator 1, and the generated steam flows from the vapor line 4 to the condenser 2, releasing heat in the condenser 2 to condense the heat sink into a liquid, and finally flowing into the accumulator through the liquid line 5.
  • the liquid working medium in the accumulator 3 maintains the supply of the capillary core in the evaporator 1.
  • the flat loop heat pipe is easy to install because of the required installation space, and the flat evaporator and the heat source plane are easy to install. It is a research hotspot and a key application direction in recent years.
  • flat-plate loop heat pipes are mainly divided into two forms.
  • the first form is a disc-shaped flat loop heat pipe, the evaporator is in the shape of a disc, and the evaporator and the accumulator are separated by a capillary core.
  • the second form is a rectangular flat loop heat pipe with the accumulator placed on one side of the evaporator.
  • the Vapor Chamber (VC, also referred to as the steam chamber) usually adopts a flat plate structure with a capillary core. After being charged into the working medium, the temperature is equalized by the gas-liquid phase change of the working medium.
  • the heat source (chip or device) is usually attached to the heat equalizing plate, and the heat conducting filler is used at the mounting interface.
  • Thermally conductive soaking plate the heat of one or more heat sources is directed to one side or both sides of the heat-generating plate (as shown in Figure 2 to the heat sink), and then the heat is passed through other heat-dissipating methods ( Water cooling, heat conduction, etc.), as shown in Figure 2;
  • Heat-expanding soaking plate uniformly spread the heat of one or more heat sources to other non-heat source areas of the whole heat-sinking plate, play the role of stretching the temperature, expand the heat-dissipating area, and then pass the air through air cooling or heat conduction. Other heat dissipation methods are taken away, as shown in Figure 3.
  • the application of the soaking plate has the following problems: the performance improvement of the product has contradictory requirements on the capillary core.
  • Heat transfer capacity increase the ultimate heat flux density, improve the anti-overload and anti-gravity working ability, increase the size of the soaking plate; on the other hand, in order to improve part of the performance, the capillary core is required to obtain a large permeability by using a larger aperture.
  • Increase the size of the soaking plate that is, increase
  • the flow length needs to reduce the flow resistance: reduce the thickness of the soaking plate, that is, reduce the flow cross-sectional area, and reduce the flow resistance.
  • the present invention provides a soaking plate based on a flat loop heat pipe, which can improve the heat transfer capacity of the heat equalizing plate, the heat dissipation capability of the limit heat flow density, the anti-overload and anti-gravity working ability, and increase the size of the heat spreader plate. Reducing the thickness and solving the contradiction between the performance of the soaking plate and the pore size of the capillary core.
  • the heat-receiving plate based on a flat-loop heat pipe, the heat-receiving plate is attached to a heat-generating source; and comprises: a heat-expanding plate and a flat plate composed of an evaporator, a liquid storage device and a gas/liquid pipeline; a loop heat pipe; the flat loop heat pipe is embedded in the heat expansion plate, wherein the evaporator is disposed at a position on the heat expansion plate that is in contact with a maximum heat source of the heat source; the liquid reservoir is used for The evaporator supplies liquid; the position of the heat-generating plate and the heat source other than the maximum heat source is used as a "bonding area with the heat source", and the heat-expanding plate is not provided with the heat source
  • the position to be bonded is referred to as "a region in contact with the heat sink”; the gas/liquid line drawn from the outlet of the evaporator is between the "welding area with the heat sink” and the "bonding area with the heat source”
  • a "cooling source” is disposed on one side or both sides of the heat-expanding plate; and the gas/liquid line drawn from the evaporator outlet is heated
  • the board is reciprocally arranged between the "adhesion area with the heat sink” and the "adhesive area with the heat source”.
  • the accumulator is suspended and is not thermally connected to the heat spreader.
  • the evaporator is exposed to directly conform to the largest heat source in the heat source.
  • the gas/liquid pipeline is first formed by sheet metal of copper, stainless steel or titanium alloy, and then embedded in the heat expansion plate by gluing or welding.
  • the flat-loop heat pipe can use a small-diameter capillary core to provide greater capillary force.
  • the outer circuit is a light pipe.
  • the capillary core is not arranged, and the flow resistance is small.
  • the heat transfer capacity and limit of the heat equalizing plate can be improved. Heat flow density heat dissipation, anti-overload and anti-gravity working ability, increase the size of the heat spreader and reduce its thickness.
  • the thickness of the evaporator plate and the pipe of the flat ring heat pipe can be made smaller, thereby reducing the thickness of the heat equalizing plate to adapt to a smaller installation space.
  • 1 is a schematic structural view of a loop heat pipe
  • FIG. 3 is a schematic diagram of heat conduction of a heat-expanding heat equalizing plate
  • FIG. 4 and FIG. 5 are schematic diagrams showing heat conduction of a heat conduction type heat equalizing plate based on a flat loop heat pipe;
  • FIGS. 6 and 7 are schematic diagrams of heat conduction of a heat spread type heat equalizing plate based on a flat loop heat pipe.
  • 1-evaporator 2-condenser, 3-reservoir, 4-vapor line, 5-liquid line, 6-capillary core, 7-gas/liquid line
  • This embodiment provides a heat equalizing plate based on a flat loop heat pipe, which can solve the contradiction requirement of the performance of the heat equalizing plate on the capillary size of the capillary core.
  • Example 1 Thermally conductive heat spreader
  • the flat-plate loop heat pipe consisting of the evaporator, the accumulator and the gas/liquid pipeline is pre-buried in the aluminum alloy heat spreader plate by means of gluing or welding to form a flat loop heat pipe.
  • the heat equalizing plate is mounted on the circuit board to be heat-dissipated, so that the evaporator of the flat-plate loop heat pipe is disposed on the heat-receiving board and the area where the maximum heat source of the circuit board (ie, the position where the heat generated by the circuit board is the largest) is attached.
  • the side with the vapor channel is attached to the largest heat source.
  • the evaporator can be embedded in the aluminum alloy heat spreader plate, or only fixed in the aluminum alloy heat spreader plate, and the evaporator is exposed to directly fit the maximum heat source.
  • the reservoir of the flat loop heat pipe is suspended and does not have a heat conduction connection with the aluminum alloy heat spreader plate to prevent heat leakage to the accumulator.
  • the soaking plate is provided with a “welding area with heat sink” and a “welding area with heat source”, wherein “the area of bonding with the heat source” is a heat source of the heat equalizing board and the circuit board (except for the maximum heat source).
  • the "adhesion area with the heat sink” is the area where the cooling method (cold source) is used on the back side of the heat equalizing plate, as shown in FIG.
  • the gas/liquid line leading to the evaporator outlet is reciprocally arranged on the soaking plate "with the heat sink bonding area” and "with the heat source bonding area”, and the gas/liquid line finally passes through the "welding area with the heat sink”. Then return to the reservoir of the flat loop heat pipe, as shown in Figure 4.
  • the gas/liquid line can be formed by sheet metal in copper, stainless steel or titanium alloy pipe, and then the pipe is pre-buried in the aluminum alloy heat spreader by gluing or welding.
  • the main difference from the heat-conducting soaking plate is that the area on the soaking plate except for the "welding area with the heat source” and the other areas not in contact with the heat source are used as the "welding area with the heat sink". Therefore, the gas/liquid line is reciprocally arranged between the "heat source bonding area” and other areas. Its working principle is the same as that of the heat conduction type heat spreader.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种基于平板环路热管的均热板，包括铝合金板及预埋在其内的蒸发器（1）、储液器（3）和气/液管路（7）组成的平板环路热管，平板环路热管的蒸发器（1）布置在均热板上与待散热芯片的最大热源贴合的区域，蒸发器（1）带蒸气槽道侧与最大热源贴合。均热板上设置有"与热沉贴合区域"和"与热源贴合区域"，蒸发器（1）出口引出气/液管路（7）在均热板上"与热沉贴合区域"和"与热源贴合区域"之间往复布置，气/液管路（7）最终经过"与热沉贴合区域"后返回到平板环路热管的储液器（3）。该均热板可提高传热能力、极限热流密度散热能力、抗过载和逆重力工作能力，增大扩热板尺寸并减小其厚度，解决均热板性能提升对毛细芯孔径大小的矛盾需求。

Description

基于平板环路热管的均热板 技术领域
发明涉及一种均热板，具体涉及一种基于平板环路热管的均热板，属于电子设备散热技术领域。
背景技术
环路热管是一种高效两相传热设备，其具有高传热性能、远距离传输热量、优良的控温特性和管路的可任意弯曲、安装方便等特点，由于具有众多其它传热设备无可比拟的优点，环路热管在航空、航天以及地面电子设备散热等众多领域中具有十分广阔应用前景。
如图1所示，环路热管主要包括：蒸发器1、冷凝器2、储液器3、蒸气管路4和液体管路5，其整个循环过程为：液体在蒸发器1中的毛细芯6外表面蒸发，吸收蒸发器1外的热量，产生的蒸气从蒸气管路4流向冷凝器2，在冷凝器2中释放热量给热沉冷凝成液体，最后经过液体管路5流入储液器3，储液器3内的液体工质维持对蒸发器1内毛细芯的供给。
平板环路热管因为所需安装空间小，平板式蒸发器与热源平面便于安装，是近年来的研究热点和重点应用方向。根据结构不同，平板环路热管主要分为两种形式。第一种形式为圆盘形平板环路热管，蒸发器为圆盘形，蒸发器和储液器用毛细芯隔离开。第二种形式为矩形平板环路热管，储液器置于蒸发器一侧。
均热板(Vapor Chamber，简称VC，又译为蒸气腔)通常采用带有毛细芯的平板结构，充入工质后，通过工质的气液相变来实现均温。均热板应用时，通常将发热源(芯片或设备)与均热板贴合安装，安装界面处使用导热填料，应用形式主要有两种：
(1)导热式均热板：将一个或多个热源的热量导向扩热板的一侧或两侧(如图2中所示的与热沉贴合区域)，然后热量通过其它散热方式(水冷、导热等)带走，如图2所示；
(2)扩热式均热板：将一个或多个热源的热量均匀扩向整个均热板其它非热源区域，起到拉匀温度的作用，扩大散热面积，然后热量通过风冷或导热等其它散热方式带走，如图3所示。
但均热板的应用以下问题：产品性能提升对毛细芯的要求存在矛盾，一方面，为提升一些性能，需要毛细芯的毛细孔径越小越好，因为减小毛细芯的毛细孔径能够提高最大传热能力、提高极限热流密度、提高抗过载和逆重力工作能力、增大均热板尺寸；另一方面，为提升部分性能又要求毛细芯通过使用较大的孔径获取较大的渗透率，增大均热板尺寸，即增大 流动长度，需要减小流动阻力：减小均热板厚度，即减小流通截面积，需要减小流动阻力。
发明内容
有鉴于此，本发明提供一种基于平板环路热管的均热板，可提高均热板的传热能力、极限热流密度散热能力、抗过载和逆重力工作能力，增大扩热板尺寸并减小其厚度，解决均热板性能提升对毛细芯孔径大小的矛盾需求。
所述的基于平板环路热管的均热板，所述均热板与发热源贴合安装；其特征在于，包括：扩热板和由蒸发器、储液器和气/液管路组成的平板环路热管；所述平板环路热管预埋在扩热板内，其中所述蒸发器布置在扩热板上与所述发热源中的最大热源贴合的位置；所述储液器用于向所述蒸发器供液；将所述扩热板上与所述发热源中除最大热源外其它热源贴合的位置作为“与热源贴合区域”，将所述扩热板上没有与发热源贴合的位置作为“与热沉贴合区域”；从所述蒸发器出口引出的气/液管路在扩热板上“与热沉贴合区域”和“与热源贴合区域”之间往复布置，使得液体工质在“与热源贴合区域”吸收热量蒸发成蒸气后进入“与热沉贴合区域”，气体工质在“与热沉贴合区域”释放热量冷凝成液体，由此循环，最终工质经过“与热沉贴合区域”冷凝成液体后流回储液器，形成环路。
作为本发明的一种优选方式，在所述扩热板的一侧或两侧“与热沉贴合区域”设置有冷源；从所述蒸发器出口引出的气/液管路在扩热板上“与热沉贴合区域”和“与热源贴合区域”之间往复布置。
作为本发明的一种优选方式，所述储液器悬空，不与扩热板有导热连接。
作为本发明的一种优选方式，所述蒸发器裸露出来直接和与所述发热源中的最大热源贴合。
作为本发明的一种优选方式，所述气/液管路先采用铜、不锈钢或钛合金管路钣金成形，然后通过胶接或焊接方式将预埋在扩热板内。
有益效果：
(1)平板环路热管可以使用小孔径的毛细芯，提供更大的毛细力，外回路均为光管，不布置毛细芯，流动阻力小，最终可以提高均热板的传热能力、极限热流密度散热能力、抗过载和逆重力工作能力，增大扩热板尺寸并减小其厚度。
(2)相比传统均热板结构，可以通过将平板环路热管的蒸发器和管路的尺寸做的更小，从而减小均热板的厚度，以适应更小安装空间的应用场合。
附图说明
图1为环路热管的结构示意图；
图2为导热式均热板的导热示意图；
图3为扩热式均热板的导热示意图；
图4和图5为基于平板环路热管的导热式均热板的导热示意图；
图6和图7为基于平板环路热管的扩热式均热板的导热示意图。
其中：1-蒸发器、2-冷凝器、3-储液器、4-蒸气管路、5-液体管路、6-毛细芯、7-气/液管路
具体实施方式
下面结合附图并举实施例，对本发明进行详细描述。
本实施例提供一种基于平板环路热管的均热板，能够解决均热板性能提升对毛细芯孔径大小的矛盾需求。
实施例1：导热式均热板
如图4-图5所示，将由蒸发器、储液器和气/液管路组成的平板环路热管采用胶接或焊接的方式预埋在铝合金扩热板内，组成基于平板环路热管的均热板。均热板与待散热的线路板贴合安装，使平板环路热管的蒸发器布置在均热板上与线路板的最大热源(即线路板发热量最大的位置)贴合的区域，蒸发器带蒸气槽道侧与最大热源贴合。蒸发器可预埋在铝合金扩热板内，或仅固定在铝合金扩热板内，蒸发器裸露出来直接与最大热源贴合。平板环路热管的储液器悬空，不与铝合金扩热板有导热连接以防止向储液器的漏热。均热板上设置有“与热沉贴合区域”和“与热源贴合区域”，其中“与热源贴合区域”即为均热板与线路板上的热源(除最大热源外)贴合的区域，“与热沉贴合区域”即为均热板背面采用了冷却方式(冷源)的区域，如图5所示。蒸发器出口引出气/液管路在均热板上“与热沉贴合区域”和“与热源贴合区域”之间往复布置，气/液管路最终经过“与热沉贴合区域”后返回到平板环路热管的储液器，如图4所示。气/液管路可以先采用铜、不锈钢或钛合金管路钣金成形，然后通过胶接或焊接方式将管路预埋在铝合金扩热板内。
工作原理：由于平板环路热管蒸发器与最大的热源贴合，液体在蒸发器内蒸发成蒸气，蒸气流向“与热沉贴合区域”释放出热量，冷凝成液体。由于气/液管路在“与热源贴合区域”和“与热沉贴合区域”之间往复布置，液体工质在“与热源贴合区域”吸收热量蒸发成蒸气，在“与热沉贴合区域”释放热量冷凝成液体，经过多个来回，最终工质经过“与热沉贴合区 域”冷凝成液体后流回储液器，如此循环运行，实现将一个或多个热源的热量导向“与热沉贴合区域”的功能。
实施例2：扩热式均热板
与导热式均热板的主要区别在于：均热板上除了“与热源贴合区域”，其它没有与热源接触的区域均作为“与热沉贴合区域”。因此，气/液管路在“与热源贴合区域”与其它区域之间往复布置。其工作原理与导热式均热板相同。
综上所述，以上仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (6)

  1. 基于平板环路热管的均热板，所述均热板与发热源贴合安装；其特征在于，包括：扩热板和由蒸发器、储液器和气/液管路组成的平板环路热管；所述平板环路热管预埋在扩热板内，其中所述蒸发器布置在扩热板上与所述发热源中的最大热源贴合的位置；所述储液器用于向所述蒸发器供液；将所述扩热板上与所述发热源中除最大热源外其它热源贴合的位置作为“与热源贴合区域”，将所述扩热板上没有与发热源贴合的位置作为“与热沉贴合区域”；从所述蒸发器出口引出的气/液管路在扩热板上“与热沉贴合区域”和“与热源贴合区域”之间往复布置，使得液体工质在“与热源贴合区域”吸收热量蒸发成蒸气后进入“与热沉贴合区域”，气体工质在“与热沉贴合区域”释放热量冷凝成液体，由此循环，最终工质经过“与热沉贴合区域”冷凝成液体后流回储液器，形成环路。
  2. 如权利要求1所述的基于平板环路热管的均热板，其特征在于，在所述扩热板的一侧或两侧“与热沉贴合区域”设置有冷源；所述蒸发器出口引出的气/液管路在扩热板上“与热沉贴合区域”和“与热源贴合区域”之间往复布置。
  3. 如权利要求1或2所述的基于平板环路热管的均热板，其特征在于，所述储液器悬空，不与扩热板有导热连接。
  4. 如权利要求1或2所述的基于平板环路热管的均热板，其特征在于，所述蒸发器裸露出来直接和与所述发热源中的最大热源贴合。
  5. 如权利要求1或2所述的基于平板环路热管的均热板，其特征在于，所述气/液管路先采用铜、不锈钢或钛合金管路钣金成形，然后通过胶接或焊接方式将预埋在扩热板内。
  6. 如权利要求1或2所述的基于平板环路热管的均热板，其特征在于，所述扩热板为铝合金板。
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