WO2018218935A1 - 掩模板及其制备方法和使用方法 - Google Patents

掩模板及其制备方法和使用方法 Download PDF

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Publication number
WO2018218935A1
WO2018218935A1 PCT/CN2017/116953 CN2017116953W WO2018218935A1 WO 2018218935 A1 WO2018218935 A1 WO 2018218935A1 CN 2017116953 W CN2017116953 W CN 2017116953W WO 2018218935 A1 WO2018218935 A1 WO 2018218935A1
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WO
WIPO (PCT)
Prior art keywords
mask
degrees
angle
substrate
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/116953
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English (en)
French (fr)
Inventor
杨成发
林治明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US16/072,359 priority Critical patent/US11746406B2/en
Priority to JP2018538726A priority patent/JP7092675B2/ja
Priority to EP17892059.1A priority patent/EP3633063B1/en
Publication of WO2018218935A1 publication Critical patent/WO2018218935A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
    • B05C17/06—Stencils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • At least one embodiment of the present disclosure is directed to a mask sheet, a method of making the same, and a method of using the same.
  • a mask is required to prepare a desired pattern.
  • the mask may cause damage to the evaporated substrate and affect the yield of the substrate evaporation.
  • At least one embodiment of the present disclosure provides a mask comprising: a support and a mask strip mounted on the support, the mask strip including at least two connections to the support And a pattern portion between the connecting portions, the pattern portion including a first outer surface, the connecting portion including a second outer surface; wherein the second outer surface and the first outer surface are absent In the same plane.
  • At least one embodiment of the present disclosure provides a method of fabricating a mask, comprising: providing a support and mounting a mask strip on the support; wherein the mask strip includes at least two connected to the support a connecting portion, and a pattern portion between the connecting portions, the mask strip includes two opposite upper and lower surfaces, the pattern portion including a first outer surface disposed on the upper surface,
  • the connecting portion includes a second outer surface disposed on the upper surface; wherein the second outer surface and the first outer surface are not in the same plane.
  • At least one embodiment of the present disclosure provides a method of using a reticle in the above embodiment, the method comprising: placing a substrate on the reticle, wherein a surface to be coated of the substrate and the reticle An outer surface is in contact, and the second surface to be coated of the substrate and the second outer surface of the mask are not in contact with each other.
  • Figure 1a is a front view of a mask
  • Figure 1b is a partial plan view of the mask shown in Figure 1a;
  • Figure 1c is a side view of the mask shown in Figure 1a;
  • FIG. 2a is a schematic structural view of a mask provided by an embodiment of the present disclosure.
  • Figure 2b is a cross-sectional view of the mask of Figure 2a taken along line M-N;
  • FIG. 2c is a spatial structural view of a mask strip in the mask shown in FIG. 2b;
  • Figure 2d is a spatial structural view of the support member in the mask shown in Figure 2b;
  • 2 e is a schematic view showing a spatial distribution of a working surface and a mounting surface of a mask strip according to an embodiment of the present disclosure
  • 2f is a front elevational view of a mask and a substrate provided by an embodiment of the present disclosure
  • 2g is a partial structural schematic view of a mask according to an embodiment of the present disclosure.
  • 2h is a partial structural schematic view of another mask provided by an embodiment of the present disclosure.
  • FIG. 3 is a schematic structural diagram of still another mask according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of still another reticle according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of still another mask according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of still another reticle according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of still another reticle provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of still another mask provided by an embodiment of the present disclosure.
  • the term "pattern portion of the reticle” refers to a portion of the reticle including a patterned structure such as an occlusion region and/or a non-occlusion region; "the connection portion of the reticle” refers to a connection or fixation to the support The portion on the piece; the “mounting area of the connecting portion” refers to an area on the connecting portion where a connecting member such as a screw, a pin, a solder joint, a pad, or the like is provided.
  • the “second outer surface” refers to the surface on which the connector is placed, and the “first outer surface” refers to the surface facing the substrate to be vapor-deposited.
  • the second outer surface and the first outer surface have a unique and defined definition, and thus, the second outer surface and the first outer surface are understood to be directional.
  • the angle between the two should be regarded as 180 degrees (for example, FIG. 4); when the second outer surface is first
  • the angle between the two should be regarded as 360 degrees (for example, FIG. 5).
  • FIG. 1a is a front view of a mask
  • FIG. 1b is a partial top view of the mask shown in FIG. 1a.
  • the reticle typically includes a support 100' and a mask strip 200', and each mask strip 200' is secured to the support 100' by solder joints 240'.
  • solder joints 240' When the substrate 300' is evaporated by the mask 100', the height of the solder joint 240' will generally exceed the surface of the mask strip 200'.
  • the solder joint 240' will directly contact the substrate 300' and cause the substrate 300 to be There is a gap between the 'and the mask strip 200', which not only affects the tightness of the bonding of the mask strip 200' and the substrate 300', but also easily deposits the vapor deposition material in the gap and is difficult to remove. Further, since the solder joint 240' and the substrate 300' are in direct contact, the substrate 300' is subjected to a large partial pressure at a position corresponding to the solder joint 240' (connecting member), and a chip is easily generated, causing cracks in the substrate 300'.
  • the corner of the mask strip 200' (the area A in FIG. 1b) is easily lifted, and the lifted portion of the mask strip 200' is easy.
  • the substrate 300' to be scratched or causes the mask strip 200' to be scratched due to damage to the substrate 300'
  • the raised portion (eg, the corners) of the mask strip 200' also increases the mask strip 200' and the substrate 300' The distance between the two.
  • the mask strip 200' is fixed by the solder joints 240' and is fixed in a dot manner, so that wrinkles 250' are easily generated in the mask strip 200', which affects the vapor deposition yield of the substrate 300'.
  • Figure 1c is a side view of the reticle of Figure 1a.
  • the mask blank needs to be repaired when the mask strip 200' is replaced, but the portion of the original mask strip 200' fixed by the solder joint 240' needs to be polished, and the polishing will cause the corresponding area to be supported.
  • the piece 100' is worn, as shown in Figure 1c, the portion of the support 100' that is located in the B region has a higher degree of wear, resulting in the mask strip 200' of the region not being in the same plane as the other mask strips 200'. If a plurality of repair operations are performed, the flatness of the region of the support member 100' for fixing the mask strip 200' is affected, thereby affecting the vapor deposition precision of the mask.
  • At least one embodiment of the present disclosure provides a mask sheet, a method of fabricating the same, and a method of using the same.
  • the mask includes a support and a mask strip mounted on the support, the mask strip includes at least two connecting portions connected to the support, and a pattern portion between the connecting portions, the pattern portion including a first outer surface,
  • the connecting portion includes a second outer surface, the first outer surface and the second outer surface being in different planes.
  • the substrate to be evaporated may be disposed on the first outer surface, and the second outer surface of the mask strip is not in the same plane as the first outer surface, so the second outer surface can Along from the substrate, the raised corners of the mask strip and the connectors on the second outer surface are not in contact with the substrate, so that the first outer surface of the mask strip can be closely adhered to the substrate, which can be improved The evaporation yield of the substrate.
  • FIG. 2a is a schematic structural view of a mask plate according to an embodiment of the present disclosure
  • FIG. 2b is a cross-sectional view of the mask plate of FIG. 2a along MN
  • a mask provided by at least one embodiment of the present disclosure includes a support member 100 and a mask strip 200 mounted on the support member 100.
  • the mask strip 200 includes at least two connected to the support member 100.
  • the connection portion 220 includes a mounting area 230 on which the mask strip 200 is mounted by a connector 240 in the mounting area 230.
  • the mask strip 200 includes two opposing upper surfaces 201 and a lower surface 202, the pattern portion 210 includes a first outer surface 2101 disposed on the upper surface 201, and a surface of the mounting region 230 facing away from the support member 100 is a second outer surface 2301, The second outer surface 2301 and the first outer surface 2101 are not disposed in the same plane. Therefore, when performing vapor deposition, the second outer surface 2301 in the mask strip 200 does not contact the substrate, and the connecting member 240 does not. Contact with the substrate.
  • the mask of the above structure eliminates the gap between the mask strip 200' and the substrate 300', and realizes the close contact of the first outer surface of the mask strip with the surface to be coated of the substrate, The evaporation yield of the substrate is improved.
  • the mask strip 200 is not limited to include two connecting portions 220, and may also include two or more connecting portions 220.
  • the number of connecting portions 220 included in the mask strip 200 may be The present disclosure does not limit this according to actual needs.
  • the mask strip 200 includes two connecting portions 220 and the pattern portion 210 is disposed between the two connecting portions 220 as an example, and the solution in the following embodiments of the present disclosure is performed. Description.
  • the support 100 includes a body (the portion of the support 100 in the region of 110 in Figure 2d) and two opposite sides disposed on the opposite sides of the body. Side (the portion of the support 100 in the region of 120 in Figure 2d).
  • the body 110 may, for example, be in the shape of a box with a rectangular or square opening therebetween, which facilitates exposing the mask strip 200 during evaporation.
  • the shape and size of the openings may be designed according to the number and distribution of the mask strips 200.
  • the openings may have a regular shape such as a circle, an ellipse, a polygon, or the like, or may have an irregular shape.
  • the body and the sides may be a unitary structure.
  • the pattern portion 210 of the mask strip 200 is supported by the body 110, and the two connection portions 220 of the mask strip 200 are respectively mounted on the two side portions 120 of the support member 100.
  • the body 110 includes opposing first major surfaces 111 and second major surfaces 112, and the side portions 120 include a third outer surface 121.
  • the first major surface 111 and the third outer surface 121 are connected, and a connector 240 may be disposed on the second outer surface 2301 of the mask strip 200 to fix the mask strip 200 on the support 100.
  • the manner in which the mask strips 200 are fixed to the support member 100 can be various, for example, a riveting manner such as a screw or a pin, or a welding method such as arc welding, which is not limited in the embodiment of the present disclosure.
  • the pattern portion 210 of the mask strip 200 has a patterned structure.
  • the pattern portion 210 includes a plurality of occlusion regions and non-occlusion regions, for example, the occlusion regions and the non-occlusion regions may be alternately disposed.
  • the evaporation material (the material for vapor deposition) can pass through the non-occlusion region but cannot pass through the shielding region, so when the evaporation material is evaporated on the substrate, the substrate is formed on the substrate.
  • the body of the support member 100 may be a frame structure having an opening, and the side portion is a portion extending from the S1, S2 side of the frame structure, the side portion may Used to fix the welding strip 200. It can be understood that the support member 100 may not be provided with a side portion on the S3, S4 side where the fixing of the welding strip is not required.
  • the structure of the support and the side portions depends on the relative positional relationship between the second outer surface on the mask strip 200 and the first outer surface, as will be described in detail in the following embodiments.
  • the second outer surface of the connecting portion is further from the substrate to be vapor-deposited relative to the first outer surface of the pattern portion.
  • the second outer surface is located on a side of the plane facing the lower surface of the first outer surface.
  • FIG. 2e is a schematic diagram showing the spatial distribution of the first outer surface and the second outer surface of the mask strip in the mask provided by one embodiment of the present disclosure (for ease of understanding, only the pattern in the mask strip 200 is shown in FIG. 2e. Portion 210 and mounting area 230 are not complete mask strips 200).
  • the first outer surface 2101 of the mask strip 200 is located, for example, in the plane P (the plane in which the first outer surface 2101 is located).
  • the plane P may be a horizontal plane, and the N1 side of the horizontal plane P may be set to be vapor-deposited.
  • the substrate, the second outer surface 2301 is located on the N2 side of the plane P (ie, the side of the plane P facing the lower surface 202), and the plane P can serve as an interface between the mask strip 200 and the substrate to be vapor-deposited. Therefore, the second outer surface 2301 and the first outer surface 2101 are not in the same plane, in which case the connector 240 on the second outer surface 2301 does not contact the substrate, and the raised edge of the mask strip 200 The corners do not affect the substrate, thereby increasing the evaporation yield of the mask to the substrate.
  • the case where the angle Q between the first outer surface 2101 and the second outer surface 2301 in the mask strip 200 is 180 degrees or more and 360 degrees or less is taken as an example.
  • the technical solution in at least one of the following embodiments will be described.
  • FIG. 2f is a front elevational view of a reticle and substrate provided by an embodiment of the present disclosure.
  • the third outer surface 121 of each side 120 of the support 100 may be disposed as an inclined plane, and the two connecting portions 220 of the mask strip 200 pass
  • the connector 240 is mounted on the inclined plane (the third outer surface 121), and the angle Q between the second outer surface 2301 and the first outer surface 2101 in the mask strip 200 is greater than 180 degrees and less than 270 degrees.
  • the second outer surface 2301 of the mask strip 200 does not contact the substrate 300 to be evaporated
  • the connecting member 240 does not contact the substrate 300 to be evaporated, thereby realizing the first of the mask strip 200.
  • the close contact of the outer surface 2101 and the substrate 300 can improve the vapor deposition yield of the substrate 300.
  • each of the mask strips 200 may include a first connecting portion and a second connecting portion, an angle between the second outer surface of the first connecting portion and the first outer surface 2101 and a second outer surface of the second connecting portion
  • the angle between the first outer surface 2101 and the first outer surface 2101 may be the same or different.
  • the present disclosure is exemplified by the same angle between the second outer surface of the first connecting portion and the first outer surface 2101 and the angle between the second outer surface of the second connecting portion and the first outer surface 2101. The technical solutions in the following embodiments are explained.
  • the mask strip 200 is secured to the support 100 by a connector 240 on the second outer surface 2301, the connector 240 typically having a certain height, so at least one embodiment of the present disclosure
  • the angle Q between the second outer surface 2301 and the first outer surface 2101 may be further set according to the height of the connecting member 240.
  • the height of the connecting member 240 is H in a direction perpendicular to the face of the second outer surface 2301, and the connecting member 240 is at the apex angle ⁇ in a direction parallel to the face of the second outer surface 2301.
  • the connecting portion 220 is fixed to the side portion 120 of the support 100 by the connecting member 240, the mask strip 200 is stretched and tightened by the connecting member 240. Therefore, the portion of the mask strip 200 at the junction of the connecting portion 220 and the pattern portion 210 may be supported by the edge 140 where the body 110 of the support member 100 and the side portion 120 intersect. That is, the edge 140 of the support member 100 can support a portion of the mask strip 200 at the junction between the connecting portion 220 and the pattern portion 210, thereby ensuring the flatness of the pattern portion 210 of the mask strip 200.
  • the edge 140 of the support member 100 can support a portion of the mask strip 200 at the junction between the connecting portion 220 and the pattern portion 210, thereby ensuring the flatness of the pattern portion 210 of the mask strip 200.
  • the fixing manner of the mask strip 200 in the embodiment of the present disclosure is changed from point fixing to line fixing (the extended form of the pattern portion 210 of the mask strip 200 is formed by the solder joint 240'
  • the definition becomes defined by the edge 140, and as such, the pleats 250' of Figure 1b can be avoided. Even if the wrinkles 250' appear in the second outer surface 2301, the above structure (the edge 140 defines the extended form of the pattern portion 210) can reduce or eliminate the extension of the wrinkles to the pattern portion 210.
  • the second outer surface 2301 can be placed further away from the edge 140 of the support member 100.
  • the angle Q between the second outer surface 2301 and the first outer surface 2101 is greater than 180 degrees and less than 270 degrees
  • the third portion of the side 120 of the support 100 may be provided in a step shape.
  • FIG. 2h is a partial structural diagram of another mask provided by an embodiment of the present disclosure.
  • the side 120 of the support 100 The three outer surface 121 is disposed in a two-step shape and includes a first sub-surface 1211, a second sub-surface 1212, a third sub-surface 1213, and a fourth sub-surface 1214 that are sequentially connected, and the first sub-surface 1211 and the first portion of the main body 110 The main surface 111 is connected.
  • the second outer surface 2301 may be disposed on the second sub-surface 1212, the third sub-surface 1213 or the fourth sub-surface 1214, such that when the mask is repaired, the second outer surface 2301 is not polished.
  • the edge 140 of the support member 100 has an effect.
  • first sub-surface 1211 and the first major surface 111 of the body 110 cross each other to form a first boundary line
  • the third sub-surface 1213 and the fourth sub-surface 1214 cross each other to form a second boundary line
  • the first boundary line and the second The angle c between the plane defined by the boundary line and the fourth sub-surface 1214 is greater than the angle b between the third sub-surface 1213 and the fourth sub-surface 1214.
  • the connection portion of the mask strip 200 (the portion where the pattern portion 210 and the connection portion 220 are joined)
  • the edge 140 of the support member 100 and the edge at the intersection of the second sub-surface 1212 and the third sub-surface 1213 are supported to further achieve the fixing and tightening effect on the mask strip 200, thereby reducing or eliminating wrinkles.
  • the number of steps when the third outer surface 121 of the side portion 120 of the support member 100 is set to be stepped is not limited, and the third portion of the side portion 120 of the support member 100 is not limited.
  • the outer surface 121 may also be provided as a step or a step or the like.
  • the edge 140 at which the first major surface 111 and the third outer surface 121 of the body 110 of the support 100 intersect may be rounded or chamfered (indicated by the dashed box 140 in Figure 3h) region).
  • the edge 140 of the support member 100 can be configured to have a curved surface having a certain degree of curvature (e.g., greater than 0 degrees and less than 45 degrees).
  • the edge 140 of the support member 100 may define an extended state of the pattern portion 210 in the mask strip 200, and a partial region of the mask strip 200 (eg, the junction between the pattern portion 210 and the connecting portion 220) is supported by the edge 140 Due to the greater force, the edge 140 is provided with a rounded structure such that it has a curved surface to avoid cutting the mask strip 200 because the edge 140 is too sharp (local force concentration).
  • the shape of the third outer surface 121 of the side portion 120 of the support member 100 is not limited.
  • the third outer surface 121 and the second outer surface of the side portion 120 of the support 100 2301 conformal, for example, all curved or other curved shapes.
  • FIG. 3 is a schematic structural diagram of another mask provided by an embodiment of the present disclosure. As shown in FIG. 3, the third outer surface 121 of the side portion 120 of the support member 100 is a curved surface such that the second outer surface 2301 disposed on the third outer surface 121 is also a curved surface.
  • the second outer surface 2301 is not in the same plane as the first outer surface 2101.
  • the second outer surface 2301 is not in contact with the substrate 300.
  • the tangent to the third outer surface 121 is substantially parallel to the first major surface 111.
  • the third outer surface 121 and the first main surface 111 are substantially smoothly connected to each other, thereby avoiding cutting the mask strip 200 because the edge 140 is too sharp (local force concentration), and the connection portion 220 can be located.
  • Both the pattern portion 210 and the portion of the second outer surface 2301 are supported by the third outer surface 121, and even if wrinkles appear in the second outer surface 2301, the extension of the wrinkles to the pattern portion 210 can be further prevented.
  • FIG. 4 is a schematic structural diagram of another mask provided according to an embodiment of the present disclosure.
  • the angle Q between the second outer surface 2301 and the first outer surface 2101 is 180 degrees.
  • the first outer surface 2101 and the second outer surface 2301 are parallel to each other and disposed in different horizontal planes.
  • the specific shape of the support member 100 may be set according to the positional relationship of the first outer surface 2101 and the second outer surface 2301.
  • the side portion 120 of the support 100 has a groove.
  • the first major surface 111 of the support member 100 may be provided with a groove D
  • the second outer surface 2301 of the mask strip 200 may be disposed in the groove D.
  • the depth of the groove D may be determined according to actual needs, as long as the depth of the groove D may be such that the connecting member 240 on the second outer surface 2301 does not It is only necessary to contact the substrate to be evaporated.
  • the depth of the groove D is greater than the height of the connector 240, and in one example, the depth of the groove D can be greater than about 10 microns, such as from about 10 microns to 20 microns.
  • the second outer surface 2301 of the mask strip 200 does not contact the substrate 300 to be evaporated, and the first outer surface 2101 of the mask strip 200 and the substrate 300 can be closely adhered to improve the vapor deposition of the substrate 300. rate.
  • FIG. 5 is a schematic structural diagram of another mask provided by an embodiment of the present disclosure.
  • the angle Q between the second outer surface 2301 and the first outer surface 2101 is 360 degrees, for example, the first outer surface 2101 and the The two outer surfaces 2301 are parallel to each other and disposed in different horizontal planes.
  • the specific shape of the support member 100 may be set according to the positional relationship of the first outer surface 2101 and the second outer surface 2301.
  • the side 120 of the support 100 can be elongated.
  • the second outer surface 2301 of the mask strip 200 may be disposed on a lower surface of the side portion 120 of the support 100 (a surface of the side portion 120 away from the side of the pattern portion 210).
  • the second outer surface 2301 of the mask strip 200 does not contact the substrate 300 to be evaporated, and the connecting member 240 on the second outer surface 2301 does not contact the substrate, which can improve the evaporation of the substrate 300.
  • Plating rate a lower surface of the side portion 120 of the support 100 (a surface of the side portion 120 away from the side of the pattern portion 210).
  • FIG. 6 is a schematic structural diagram of another mask provided by an embodiment of the present disclosure.
  • the angle Q between the second outer surface 2301 in the mask strip 200 and the first outer surface 2101 is 270 degrees.
  • the third outer surface 121 of the side portion 120 of the support member 100 can be a vertical surface, that is, the plane in which the third outer surface 121 is located is perpendicular to the first major surface 111 of the support member 100.
  • the second outer surface 2301 of the mask strip 200 does not contact the substrate 300 to be vapor-deposited, and the connecting member 240 on the second outer surface 2301 does not contact the substrate 300, and the substrate 300 can be improved. Evaporation yield.
  • FIG. 7 is a schematic structural diagram of another mask provided by an embodiment of the present disclosure.
  • the angle Q between the second outer surface 2301 and the first outer surface 2101 in the mask strip 200 is greater than 270 degrees and less than 360 degrees.
  • the third outer surface 121 of the side portion 120 of the support member 100 can be a plane that slopes inwardly (eg, inclined from the edge of the body 110 toward the interior of the body 110) that is opposite the first major surface 111 of the support member 100.
  • the included angle may be between 270 degrees and 360 degrees, and the second outer surface 2301 of the mask strip 200 may be disposed on the plane.
  • the second outer surface 2301 of the mask strip 200 does not contact the substrate 300 to be vapor-deposited, and the connecting member 240 on the second outer surface 2301 does not contact the substrate 300, and the substrate 300 can be improved. Evaporation yield.
  • the angle between the second outer surface 2301 in the mask strip 200 and the first outer surface 2101 is 180 degrees or more than 270 degrees and less than or equal to 360 degrees
  • the surface of the support member 100 for fixing the second outer surface 2301 may not be limited to a plane, but may also be a curved surface or the like.
  • the angle between the first outer surface 2101 and the second outer surface 2301 of the mask strip 200 is not limited, and the clip between the two is not limited.
  • the angle is not limited to between 180 degrees and 360, as long as the second outer surface 2301 and the first outer surface 2101 are located on different planes, and the second outer surface 2301 is located at a portion of the first outer surface 2101 away from the substrate 300 to be vapor-deposited.
  • the second outer surface is not in contact with the substrate to be vapor-deposited, and the evaporation yield of the substrate can be improved.
  • FIG. 8 is a schematic structural diagram of another mask provided by an embodiment of the present disclosure.
  • the first main surface 111 of the support member 100 is provided with a groove E, and the groove E is provided with a slope, the mask strip 200
  • the second outer surface 2301 is disposed on the inclined surface.
  • the angle Q between the second outer surface 2301 and the first outer surface 2101 may be between 0 and 180 degrees.
  • the materials for preparing the support 100 and the mask strip 200 in the mask are not limited.
  • the preparation material of the support member 100 and the mask strip 200 may include a metal material, so that the mask strip 200 may be fixed to the support member 100 by, for example, soldering, which is difficult in process. Easy to operate.
  • At least one embodiment of the present disclosure provides a method of fabricating a mask, the method of fabricating comprising: providing a support and mounting a mask strip on the support; wherein the mask strip includes at least two connections to the support And a pattern portion between the connection portions, the mask strip includes two opposite upper and lower surfaces, the pattern portion includes a first outer surface disposed on the upper surface, and the connection portion includes a second outer surface disposed on the upper surface Wherein the second outer surface and the first outer surface are not in the same plane, and the second outer surface is located on a side of the first outer surface that is adjacent to the lower surface.
  • the second outer surface of the mask strip is not in contact with the substrate, and thus, the warped edge and the second outer surface of the mask strip.
  • the upper connector (for fixing the mask strip) or the like does not affect the tightness of the bonding between the mask strip and the substrate, and the evaporation yield of the mask to the substrate can be improved.
  • At least one embodiment of the present disclosure provides a method of using a mask, the method comprising: placing a substrate to be evaporated on a reticle, wherein a surface to be coated of the substrate is in contact with a first outer surface of the reticle, and the substrate The surface to be coated and the second outer surface of the reticle are not in contact with each other.
  • the specific structure of the reticle can be referred to the related description in the foregoing embodiment (for the embodiment of the reticle), and the present disclosure does not limit the specific structure of the reticle.
  • the mask plate in the above embodiment may make the mask strip and the substrate to be vapor-deposited closely adhered.
  • the first surface of the pattern to be coated of the substrate and the pattern portion of the mask strip are in the same plane.
  • the second outer surface of the mask strip in the mask is not in the same plane as the first outer surface, and the second outer surface is located on a side of the first outer surface near the lower surface of the mask strip, so the mask strip The outer surface of the second surface does not contact the surface to be coated of the substrate to be vapor-deposited, and the yield of the evaporation of the mask to the substrate can be improved.
  • the surface to be coated of the substrate is not in the same plane as the second outer surface of the reticle, and the angle between the two is greater than or equal to 180 degrees and less than or equal to 360 degrees.
  • the angle between the surface to be coated of the substrate and the second outer surface of the reticle includes: 180 degrees, greater than 180 degrees less than 270 degrees, 270 degrees, greater than 270 degrees less than 360 degrees or 360 degrees, and the like.
  • Embodiments of the present disclosure provide a mask sheet, a method of fabricating the same, and a method of using the same, and may have at least one of the following beneficial effects:
  • At least one embodiment of the present disclosure provides a mask in which a second outer surface of a mask strip is not in the same plane as the first outer surface and is located on the same side of the plane of the first outer surface The second outer surface is not in contact with the substrate to be vapor-deposited, and the evaporation yield of the substrate can be improved.
  • the mask strip in the mask in the embodiment of the present disclosure is changed from point fixing to line fixing, and the mask can be lightened or eliminated as compared with the current structure.
  • the problem of wrinkles in the strip further improves the vapor deposition accuracy of the substrate.
  • the edge of the support member for supporting the extended state of the vapor deposition zone of the mask strip is rounded or chamfered to prevent the mask strip from being cut.
  • the third outer surface of the side portion of the support member is designed to be stepped, and during the process of repairing the mask, the grinding operation can be prevented from causing wear on the edge of the support member to ensure the precision of the mask.

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Abstract

一种掩模板及其制备方法和使用方法。该掩模板包括：支撑件（100）和安装在支撑件（100）上的掩模条（200），掩模条（200）包括与支撑件（100）连接的至少两个连接部（220），以及位于连接部（220）之间的图案部（210），图案部（210）包括第一外表面（2101），连接部（220）包括第二外表面（2301）；其中，第二外表面（2301）和第一外表面（2101）不在同一平面内。在使用该掩模板对基板（300）蒸镀时，第二外表面（2301）可以远离基板（300），从而提高基板（300）蒸镀的良率。

Description

掩模板及其制备方法和使用方法
本申请要求于2017年6月2日递交的中国专利申请第201710407553.2号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种掩模板及其制备方法和使用方法。
背景技术
在晶体管、液晶面板、OLED(有机发光二极管)面板等各类电子产品的生产过程中，需要掩模板来制备需要的图案。但是在操作过程中，掩模板会对待蒸镀的基板造成损害，影响基板蒸镀的良率。
发明内容
本公开至少一个实施例提供了一种掩模板，该掩模板包括：支撑件和安装在所述支撑件上的掩模条，所述掩模条包括与所述支撑件连接的至少两个连接部，以及位于所述连接部之间的图案部，所述图案部包括第一外表面，所述连接部包括第二外表面；其中，所述第二外表面和所述第一外表面不在同一平面内。
本公开至少一个实施例提供一种掩模板的制备方法，包括：提供支撑件并在所述支撑件上安装掩模条；其中，所述掩模条包括与所述支撑件连接的至少两个连接部，以及位于所述连接部之间的图案部，所述掩模条包括两个相对的上表面和下表面，所述图案部包括设置在所述上表面的第一外表面，所述连接部包括设置在所述上表面的第二外表面；其中，所述第二外表面和所述第一外表面不在同一平面内。
本公开至少一个实施例提供一种上述实施例中的掩模板的使用方法，该方法包括：将基板放置在所述掩模板上，其中所述基板的待涂镀表面与所述掩模板的第一外表面接触，并且所述基板的待涂镀表面与所述掩模板的第二外表面彼此不接触。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a为一种掩模板的正视图；
图1b为图1a所示掩模板的局部俯视图；
图1c为图1a所示掩模板的侧视图；
图2a为本公开一个实施例提供的一种掩模板的结构示意图；
图2b为图2a所述掩模板沿M-N的截面图；
图2c为图2b所示掩模板中掩模条的空间结构图；
图2d为图2b所示掩模板中支撑件的空间结构图；
图2e为本公开一个实施例提供的掩模条的工作面与安装面的空间分布的示意图；
图2f为本公开一个实施例提供的掩模板和基板的正视图；
图2g为本公开一个实施例提供的一种掩模板的局部结构示意图；
图2h为本公开一个实施例提供的另一种掩模板的局部结构示意图；
图3为本公开一个实施例提供的再一种掩模板的结构示意图；
图4为本公开一个实施例提供的又一种掩模板的结构示意图；
图5为本公开一个实施例提供的再一种掩模板的结构示意图；
图6为本公开一个实施例提供的又一种掩模板的结构示意图；
图7为本公开一个实施例提供的再一种掩模板的结构示意图；以及
图8为本公开一个实施例提供的又一种掩模板的结构示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所 属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开实施例中，术语“掩模板的图案部”指的是掩模板包含遮挡区和/或非遮挡区域等图案化结构的部分；“掩模板的连接部”指的是连接或固定到支撑件上的部分；“连接部的安装区”指的是连接部上设置有诸如螺钉、销钉、焊点、焊盘等连接件的区域。“第二外表面”指的是将连接件设置在其上的表面，“第一外表面”指的是面向待蒸镀基板的表面。本公开实施例中，第二外表面和第一外表面具有唯一且确定的定义，因此，第二外表面与第一外表面应理解为具有方向性。例如，当第二外表面与第一外表面为彼此平行且朝向相同的两个平面时，二者之间的夹角应视为180度(例如图4)；当第二外表面与第一外表面为彼此平行且朝向相反的两个平面时，二者之间的夹角应视为360度(例如图5)。
图1a为一种掩模板的正视图，图1b为图1a所示掩模板的局部俯视图。如图1a和图1b所示，掩模板通常包括支撑件100’和掩模条200’，并且每个掩模条200’通过焊点240’固定在支撑件100’上。当利用掩模板100’对基板300’进行蒸镀时，焊点240’的高度通常会超出掩模条200’的表面，此时，焊点240’会与基板300’直接接触并使得基板300’和掩模条200’之间存在间隙，这样不仅影响掩模条200’和基板300’贴合的紧密性，而且容易在该间隙内堆积蒸镀材料并且不易去除。此外，因为焊点240’和基板300’直接接触，在与焊点240’(连接件)对应的位置，基板300’受到的局部压力大，容易产生破片，造成基板300’出现裂痕。
如图1b所示，掩模条200’在受到例如外力等的作用时，掩模条200’的边角(图1b中的A区域)容易翘起，掩模条200’的翘起部分容易导致基板300’划伤或者因为损坏基板300’进而导致掩模条200’划伤，并且掩模条200’的翘起部分(例如边角)也会增加掩模条200’和基板300’之间的间 隔距离。另外，掩模条200’由焊点240’固定，为点固定的方式，容易使得掩模条200’中产生褶皱250’，会影响基板300’的蒸镀良率。
图1c为图1a所示掩模板的侧视图。如图1c所示，在更换掩模条200’时需要对掩模板进行修复操作，但是原有掩模条200’的由焊点240’固定的部分需要进行打磨，打磨会造成相应区域的支撑件100’磨损，如图1c所示，支撑件100’的位于B区域的部分的磨损度较高，导致该区域的掩模条200’与其它的掩模条200’未在同一平面内。如果进行多次修复操作，会对支撑件100’的用于固定掩模条200’的区域的平整度产生影响，进而影响掩模板的蒸镀精度。
本公开至少一个实施例提供一种掩模板及其制备方法和使用方法。该掩模板包括支撑件和安装在支撑件上的掩模条，掩模条包括与支撑件连接的至少两个连接部，以及位于连接部之间的图案部，图案部包括第一外表面，连接部包括第二外表面，第一外表面和第二外表面位于不同平面内。在使用该掩模板对基板蒸镀时，待蒸镀的基板可以设置在第一外表面上，掩模条的第二外表面因与第一外表面不在同一平面内，所以第二外表面能远离基板，所以掩模条的翘起的边角和第二外表面上的连接件都不会与基板接触，如此，可以使得掩模条的第一外表面可以和基板紧密贴合，可以提高基板的蒸镀良率。
下面，结合附图对根据本公开至少一个实施例的掩模板及其制备方法和使用方法进行详细的描述。
图2a为本公开一个实施例提供的一种掩模板的结构示意图；图2b为图2a所述掩模板沿M-N的截面图，图2c为图2b所示掩模板中掩模条的空间结构图，图2d为图2b所示掩模板中支撑件的空间结构图。
如图2a～图2d所示，本公开至少一个实施例提供的掩模板包括：支撑件100和安装在支撑件100上的掩模条200，掩模条200包括与支撑件100连接的至少两个连接部220，以及位于连接部220之间的图案部210。例如，连接部220包括安装区230，掩模条200通过安装区230中的连接件240安装在支撑件100上。掩模条200包括两个相对的上表面201和下表面202，图案部210包括设置在上表面201的第一外表面2101，安装区230的背离支撑件100的表面为第二外表面2301，其中第二外表面2301和第一外表面2101不设置在同一平面内，这样，在进行蒸镀时，掩模条200中的第二 外表面2301不会与基板接触，连接件240也不会与基板接触。与图1a相比，上述结构的掩模板消除了掩模条200’与基板300’之间的间隙，实现了掩模条的第一外表面与基板的待涂镀表面的紧密贴合，因此提高了基板的蒸镀良率。
需要说明的是，在本公开至少一个实施例中，掩模条200不限于包括两个连接部220，也可以包括两个以上的连接部220，掩模条200包括的连接部220的数量可以根据实际需要来决定，本公开对此不做限制。为便于解释本公开实施例中的技术方案，以掩模条200包括两个连接部220并且图案部210设置在该两个连接部220之间为例，对本公开下述实施例中的方案进行说明。
例如，在本公开至少一个实施例中，如图2a～图2d所示，支撑件100包括主体(图2d中支撑件100位于110区域中的部分)和设置在主体的相对两侧的两个侧部(图2d中支撑件100位于120区域中的部分)。主体110例如可以为方框形，其中间具有矩形或正方形开口，该开口有利于在蒸镀时使掩模条200暴露。开口的形状和大小可根据掩模条200的数量、分布来设计，例如开口可具有圆形、椭圆形、多边形等规则形状，也可以具有不规则形状。例如，在本公开至少一个实施例中，主体和侧部可以为一体结构。掩模条200的图案部210由主体110支撑，掩模条200的两个连接部220分别安装在支撑件100的两个侧部120上。主体110包括相对的第一主表面111和第二主表面112，侧部120包括第三外表面121。例如，第一主表面111和第三外表面121相连，掩模条200的第二外表面2301上可以设置连接件240以将掩模条200固定在支撑件100上。掩模条200固定在支撑件100上的方式可以有多种，例如可以采用螺钉、销钉等铆接方式，也可以采用电弧焊等焊接方式，本公开的实施例对此不做限制。掩模条200的图案部210具有图案化结构，例如，图案部210包括多个遮挡区和非遮挡区，例如遮挡区和非遮挡区可以交替设置。在利用掩模板对基板进行蒸镀过程中，蒸发材料(用于蒸镀的材料)可以透过非遮挡区但不能透过遮挡区，所以当蒸发材料蒸镀在基板上后，基板上形成与掩模条200的非遮挡区对应的图案结构。
例如，在本公开至少一个实施例中，如图2a所示，支撑件100的主体可以为具有开口的框架结构，侧部是从框架结构的S1、S2侧延伸出的部 分，该侧部可以用于固定焊接条200。可以理解的是，在不需要固定焊接条的S3、S4侧上，支撑件100可以不设置侧部。在本公开至少一个实施例中，支撑件和侧部的结构取决于掩模条200上第二外表面与第一外表面之间的相对位置关系，下面实施例中将做详细描述。
例如，在本公开至少一个实施例中，连接部的第二外表面相对于图案部的第一外表面离待蒸镀的基板更远。例如，第二外表面位于第一外表面所在平面的面向下表面的一侧。通过将掩模条200中的第二外表面2301和第一外表面2101不设置在同一平面内，并且第二外表面2301设置为远离于基板的待蒸镀表面，避免了掩模条200中的第二外表面2301和基板接触。
图2e为本公开一个实施例提供的掩模板中掩模条的第一外表面与第二外表面的空间分布的示意图(为方便理解，图2e中只示出了掩模条200中的图案部210和安装区230，并非完整的掩模条200)。例如，如图2e所示，掩模条200的第一外表面2101例如位于平面P(第一外表面2101所在平面)内，例如平面P可以为水平面，水平面P的N1侧可以设置待蒸镀的基板，第二外表面2301位于平面P的N2侧(即平面P的面向下表面202的一侧)，平面P可以作为掩模条200和待蒸镀基板的交界面。因此，第二外表面2301和第一外表面2101不在同一平面内，在此情况下，位于第二外表面2301上的连接件240不会与基板接触，而且掩模条200的翘起的边角也不会对基板产生影响，由此提高掩模板对基板的蒸镀良率。
下面，如图2e所示，以掩模条200中的第一外表面2101与第二外表面2301之间的夹角Q为大于等于180度且小于或等于360度的情况为例，对本公开下述至少一个实施例中的技术方案进行说明。
图2f为本公开一个实施例提供的掩模板和基板的正视图。例如，在本公开至少一个实施例中，如图2f所示，支撑件100的每个侧部120的第三外表面121可以设置为倾斜的平面，掩模条200的两个连接部220通过连接件240安装在该倾斜的平面(第三外表面121)上，掩模条200中的第二外表面2301和第一外表面2101之间的夹角Q为大于180度且小于270度。在此情况下，掩模条200的第二外表面2301不会与待蒸镀的基板300接触，连接件240也不会与待蒸镀的基板300接触，实现了掩模条200的第一外表面2101和基板300的紧密贴合，可以提高基板300的蒸镀良率。
例如，在本公开至少一个实施例中，两个连接部220的倾斜度可以相同或者不同，本公开的实施例对此不做限制。例如，每个掩模条200可以包括第一连接部和第二连接部，第一连接部的第二外表面和第一外表面2101之间的夹角与第二连接部的第二外表面和第一外表面2101之间的夹角可以是相同的也可以是不同的。下面，以第一连接部的第二外表面和第一外表面2101之间的夹角与第二连接部的第二外表面和第一外表面2101之间的夹角相同为例，对本公开下述实施例中的技术方案进行说明。
图2g为本公开一个实施例提供的掩模板的局部结构示意图。例如，在本公开至少一个实施例中，掩模条200通过第二外表面2301上的连接件240固定在支撑件100上，连接件240通常具有一定的高度，所以在本公开至少一个实施例中，如图2g所示中的掩模板，可以根据连接件240的高度对第二外表面2301和第一外表面2101之间的夹角Q做进一步设置。如图2g所示，在垂直于第二外表面2301所在面的方向上，连接件240的高度为H，在平行于第二外表面2301所在面的方向上，连接件240到夹角θ顶点的距离为L(每个连接件240的L数值可以不同)，满足θ>arctan(H/L)即可，由于θ＝Q-180度，因此，夹角Q>arctan(H/L)+180度。
例如，在本公开至少一个实施例中，如图2g所示，由于连接部220通过连接件240固定在支撑件100的侧部120上，掩模条200被拉伸并且由连接件240绷紧，因此，掩模条200位于连接部220和图案部210的衔接处的部分可以由支撑件100的主体110和侧部120相交的棱边140支撑。即支撑件100的棱边140可以支撑掩模条200的位于连接部220和图案部210之间的衔接处的部分，由此保证掩模条200的图案部210的平坦度。与图1b所示的掩模板的结构相比，本公开实施例中的掩模条200的固定方式由点固定变为线固定(掩模条200的图案部210的延伸形态由焊点240’限定变为由棱边140限定)，如此，能够避免出现图1b中的褶皱250’。即使第二外表面2301中出现褶皱250’，上述结构(棱边140限定图案部210的延伸形态)也可以减轻或消除褶皱向图案部210的延伸。
为避免修复操作对掩模条200的固定位置(例如棱边140)造成影响，可以将第二外表面2301的设置再进一步远离支撑件100的棱边140的位置。例如，在本公开至少一个实施例中，在第二外表面2301和第一外表面2101的夹角Q为大于180度且小于270度的情况下，支撑件100的侧部 120的第三外表面121可以设置为阶梯状。如此，在修复掩模板的过程中，修复操作例如打磨操作不会对棱边140产生影响，可以保证掩模板的精度。
图2h为本公开一个实施例提供的另一种掩模板的局部结构示意图。如图2h所示，在掩模条200的第二外表面2301与第一外表面2101之间的夹角Q为大于180度且小于270度的情况下，支撑件100的侧部120的第三外表面121设置为二级阶梯状并且包括依次连接的第一子表面1211、第二子表面1212、第三子表面1213和第四子表面1214，第一子表面1211与主体110的第一主表面111连接。例如，第二外表面2301可以设置在第二子表面1212、第三子表面1213或第四子表面1214上，如此在对掩模板进行修复操作时，对第二外表面2301的打磨不会对支撑件100的棱边140造成影响。
例如，第一子表面1211与主体110的第一主表面111彼此交叉形成第一交界线，第三子表面1213和第四子表面1214彼此交叉形成第二交界线；第一交界线和第二交界线所限定的平面与第四子表面1214之间的夹角c大于第三子表面1213和第四子表面1214之间的夹角b。在夹角c大于夹角b的情况下，当把第二外表面2301固定在第四子表面1214上时，掩模条200的连接部(图案部210和连接部220的衔接处的部分)同时被支撑件100的棱边140和位于第二子表面1212、第三子表面1213相交的棱边所支撑，进一步实现对掩模条200的固定和绷紧效果，减少或消除了褶皱。
需要说明的是，在本公开至少一个实施例中，对支撑件100的侧部120的第三外表面121设置为阶梯状时的阶梯数量不做限制，支撑件100的侧部120的第三外表面121也可以设置为一级阶梯或者多级阶梯等。
例如，在本公开至少一个实施例中，支撑件100的主体110的第一主表面111和第三外表面121相交的棱边140可以设置为圆角或者倒角(图3h中虚线框140的区域)。如图2h所示，支撑件100的棱边140可以设置为具有一定弧度(例如大于0度且小于45度)的弧面。支撑件100的棱边140可以限定掩模条200中的图案部210的延伸状态，掩模条200的部分区域(例如图案部210和连接部220之间的衔接处)由棱边140支撑会受到较大的作用力，棱边140设置圆角的结构使得其具有弧面，可以避免因为棱边140过于尖锐(局部受力集中)而割伤掩模条200。
在本公开至少一个实施例中，对支撑件100的侧部120的第三外表面 121的形状不做限制。例如，在第二外表面2301与第一外表面2101之间的夹角为大于180度且小于270度的情况下中，支撑件100的侧部120的第三外表面121与第二外表面2301共形，例如均为弧面或其它曲线形状等。图3为本公开一个实施例提供的另一种掩模板的结构示意图。如图3所示，支撑件100的侧部120的第三外表面121为弧面，使得设置在第三外表面121上的第二外表面2301也相应为弧面。只要具有弧面形状的第二外表面2301的切线与第一外表面2101的夹角Q大于180度且小于270度，如此，第二外表面2301不会与第一外表面2101在同一个平面上，且第二外表面2301不会与基板300接触。
例如，在本公开至少一个实施例中，如图3所示，在第三外表面121的靠近第一主表面111的端部，第三外表面121的切线与第一主表面111基本平行。如此，第三外表面121和第一主表面111之间基本为平滑相连，既避免因为棱边140过于尖锐(局部受力集中)而割伤掩模条200，又可以使得连接部220的位于图案部210和第二外表面2301的部分都会受到第三外表面121的支撑，即使第二外表面2301中出现褶皱，也可以进一步阻止褶皱向图案部210的延伸。
图4为本公开一个实施例提供的另一种掩模板的结构示意图。如图4所示，第二外表面2301与第一外表面2101之间的夹角Q为180度，例如第一外表面2101与第二外表面2301相互平行且设置在不同水平面内。支撑件100的具体形状可以根据第一外表面2101与第二外表面2301的位置关系设置。例如，在本公开至少一个实施例中，如4所示，支撑件100的侧部120具有凹槽。例如，支撑件100的第一主表面111上可以设置有凹槽D，掩模条200的第二外表面2301可以设置在凹槽D中。需要说明的是，在垂直于第二外表面2301所在面的方向上，凹槽D的深度可以根据实际需要确定，只要凹槽D的深度可以使得第二外表面2301上的连接件240不会与待蒸镀的基板接触即可。例如，凹槽D的深度大于连接件240的高度，在一个示例中，凹槽D的深度可以大于约10微米，例如约为10微米～20微米。如此，掩模条200的第二外表面2301不会与待蒸镀的基板300接触，并且可以使得掩模条200的第一外表面2101和基板300紧密贴合，提高基板300的蒸镀良率。
图5为本公开一个实施例提供的另一种掩模板的结构示意图。例如， 在本公开至少一个实施例提供的掩模板中，如图5所示，第二外表面2301与第一外表面2101之间的夹角Q为360度，例如第一外表面2101与第二外表面2301相互平行且设置在不同水平面内。支撑件100的具体形状可以根据第一外表面2101与第二外表面2301的位置关系设置。例如，本公开至少一个实施例中，支撑件100的侧部120可以为长条形。例如，掩模条200的第二外表面2301可以设置在支撑件100的侧部120的下表面(侧部120的远离图案部210一侧的表面)上。在此情况下，掩模条200的第二外表面2301不会与待蒸镀的基板300接触，而且第二外表面2301上的连接件240也不会与基板接触，可以提高基板300的蒸镀良率。
图6为本公开一个实施例提供的另一种掩模板的结构示意图。例如，在本公开至少一个实施例提供的掩模板中，如图6所示，掩模条200中的第二外表面2301与第一外表面2101之间的夹角Q为270度。例如，支撑件100的侧部120的第三外表面121可以为竖直面，即第三外表面121所在的平面与支撑件100的第一主表面111相互垂直。在此情况下，掩模条200的第二外表面2301不会与待蒸镀的基板300接触，而且第二外表面2301上的连接件240也不会与基板300接触，可以提高基板300的蒸镀良率。
图7为本公开一个实施例提供的另一种掩模板的结构示意图。例如，在本公开至少一个实施例提供的掩模板中，如图7所示，掩模条200中的第二外表面2301与第一外表面2101之间的夹角Q为大于270度且小于360度。例如，支撑件100的侧部120的第三外表面121可以为向里倾斜(例如由主体110的边缘向于主体110的内部倾斜)的平面，该平面与支撑件100的第一主表面111的夹角可以在270度和360度之间，掩模条200的第二外表面2301可以设置在该平面上。在此情况下，掩模条200的第二外表面2301不会与待蒸镀的基板300接触，而且第二外表面2301上的连接件240也不会与基板300接触，可以提高基板300的蒸镀良率。
需要说明的是，在前述的实施例中，掩模条200中的第二外表面2301与第一外表面2101之间的夹角为180度或者大于270度且小于等于360度的情况下，支撑件100的用于固定第二外表面2301的面可以不限于为平面，也可以为弧面等形状，其具体结构可以参考图2h所示实施例中的内容，本公开在此不做赘述。
需要说明的是，在本公开至少一个实施例提供的掩模板中，对掩模条200的第一外表面2101和第二外表面2301之间的夹角不做限制，两者之间的夹角不限于180度和360之间，只要第二外表面2301和第一外表面2101位于不同的平面，且第二外表面2301位于第一外表面2101的远离基板300的待蒸镀表面的一侧，就可以在蒸镀过程中，使得第二外表面不与待蒸镀的基板接触，可以提高基板的蒸镀良率。
图8为本公开一个实施例提供的另一种掩模板的结构示意图。例如，在本公开至少一个实施例提供的掩模板中，如图8所示，支撑件100的第一主表面111上设置有凹槽E，凹槽E中设置有斜面，掩模条200的第二外表面2301设置在该斜面上，如图8所示的掩模板的结构，第二外表面2301和第一外表面2101的夹角Q可以在0度到180度之间。
在本公开至少一个实施例中，对掩模板中的支撑件100及掩模条200的制备材料不做限制。例如，在本公开至少一个实施例中，支撑件100和掩模条200的制备材料可以包括金属材料，以便于掩模条200可以通过例如焊接的方式固定于支撑件100上，工艺难度低，操作简便。
本公开至少一个实施例提供一种掩模板的制备方法，该制备方法可以包括：提供支撑件并在支撑件上安装掩模条；其中，掩模条包括与支撑件连接的至少两个连接部，以及位于连接部之间的图案部，掩模条包括两个相对的上表面和下表面，图案部包括设置在上表面的第一外表面，连接部包括设置在上表面的第二外表面；其中，第二外表面和第一外表面不在同一平面内，并且第二外表面位于第一外表面的靠近下表面的一侧。该掩模板的具体结构可以参考前述实施例，在此不做赘述。
根据本公开至少一个实施例的制备方法制备的掩模板，在对基板进行蒸镀时，掩模条的第二外表面不会与基板接触，如此，掩模条的翘边及第二外表面上的连接件(用于固定掩模条)等不会影响掩模条和基板之间贴合的紧密度，可以提高掩模板对基板的蒸镀良率。
本公开至少一个实施例提供一种掩模板的使用方法，该方法包括：将待蒸镀的基板放置在掩模板上，其中基板的待涂镀表面与掩模板的第一外表面接触，并且基板的待涂镀表面与掩模板的第二外表面彼此不接触。掩模板的具体结构可以参考前述实施例(关于掩模板的实施例)中的相关说明，本公开对掩模板的具体结构不做限定。
上述实施例中的掩模板可以使得掩模条和待蒸镀的基板贴合紧密，如此，可以认为基板的待涂镀面和掩模条的图案部中的第一外表面在同一个平面内，因为掩模板中掩模条的第二外表面和第一外表面不在同一平面内，并且第二外表面位于第一外表面的靠近掩模条下表面的一侧，所以掩模条的第二外表面不会与待蒸镀的基板的待涂镀面接触，可以提高掩模板对基板蒸镀的良率。
例如，在本公开至少一个实施例中，基板的待涂镀表面与掩模板的第二外表面不在同一平面内，且二者夹角为大于或等于180度且小于或等于360度。例如，基板的待涂镀表面与掩模板的第二外表面之间的夹角包括：180度、大于180度小于270度、270度、大于270度小于360度或者360度等。对于上述不同角度范围内的掩模板结构可以参考前述实施例中的内容，在此不做赘述。
本公开的实施例提供一种掩模板及其制备方法和使用方法，并且可以具有以下至少一项有益效果：
(1)本公开至少一个实施例提供一种掩模板，在该掩模板中，掩模条的第二外表面与第一外表面不在同一平面内，并且位于第一外表面所在平面的同一侧，第二外表面不与待蒸镀的基板接触，可以提高基板的蒸镀良率。
(2)在本公开至少一个实施例提供的掩模板中，与当前的结构相比，本公开实施例中的掩模板中的掩模条由点固定变为线固定，可以减轻或消除掩模条中的褶皱问题，进一步提高基板的蒸镀精度。
(3)在本公开至少一个实施例提供的掩模板中，支撑件用于支撑掩模条的蒸镀区的延伸状态的棱边设计为圆角或者倒角，可以避免掩模条受到割伤；支撑件的侧部的第三外表面设计为阶梯状，在修复掩模板的过程中，可以防止打磨操作对支撑件的棱边造成磨损，以保证掩模板的精度。
对于本公开，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相 互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (18)

  1. 一种掩模板，包括：
    支撑件和安装在所述支撑件上的掩模条，所述掩模条包括与所述支撑件连接的至少两个连接部，以及位于所述连接部之间的图案部，所述图案部包括第一外表面，所述连接部包括第二外表面；
    其中，所述第一外表面和所述第二外表面位于不同平面内。
  2. 根据权利要求1所述的掩模板，其中，在所述图案部的第一外表面上设置待蒸镀的基板，所述连接部的第二外表面相对于所述图案部的第一外表面离所述待蒸镀的基板更远。
  3. 根据权利要求1或2所述的掩模板，其中，
    所述第一外表面与所述第二外表面之间的夹角为大于或等于180度且小于或等于360度。
  4. 根据权利要求3所述的掩模板，其中，
    所述第二外表面与所述第一外表面之间的夹角为180度或360度，并且所述第一外表面与所述第二外表面相互平行。
  5. 根据权利要求3所述的掩模板，其中，所述第二外表面与所述第一外表面之间的夹角为270度。
  6. 根据权利要求3所述的掩模板，其中，所述第二外表面与所述第一外表面之间的夹角为大于270度且小于360度。
  7. 根据权利要求3所述的掩模板，其中，
    所述第二外表面与所述第一外表面之间的夹角为大于180度且小于270度。
  8. 根据权利要求3至7任一项所述的掩模板，其中，
    所述支撑件设置于所述掩模条的远离所述第一外表面的一侧，所述支撑件包括主体和设置在所述主体的相对两侧的两个侧部，所述主体为方框形，所述掩模板的图案部由所述主体支撑，所述掩模条的两个连接部分别安装在所述两个侧部上，所述主体包括相对的第一主表面和第二主表面，所述侧部包括第三外表面，所述第一主表面与所述第三外表面相连。
  9. 根据权利要求8所述的掩模板，其中，所述第二外表面与所述第一外表面之间的夹角为大于180度且小于270度，并且所述第三外表面为 倾斜的平面，所述第二外表面安装在所述第三外表面上。
  10. 根据权利要求8所述的掩模板，其中，所述第二外表面与所述第一外表面之间的夹角为大于180度且小于270度，并且所述侧部的第三外表面为弧面，所述第二外表面安装在所述第三外表面上。
  11. 根据权利要求8所述的掩模板，其中，所述第二外表面与所述第一外表面之间的夹角为大于180度且小于270度，并且所述侧部的第三外表面为阶梯状。
  12. 根据权利要求11所述的掩模板，其中，所述第二外表面与所述第一外表面之间的夹角为大于180度且小于270度，所述侧部的第三外表面设置为二级阶梯状并且包括依次连接的第一子表面、第二子表面、第三子表面和第四子表面，所述第一子表面与所述主体的第一主表面连接，并且所述第一子表面与所述主体的第一主表面彼此交叉形成第一交界线，所述第三子表面和所述第四子表面彼此交叉形成第二交界线；所述第一交界线和所述第二交界线所限定的平面与所述第四子表面之间的夹角大于所述第三子表面和所述第四子表面之间的夹角，所述第二外表面固定在所述第三子表面上。
  13. 根据权利要求1至12任一项所述的掩模板，其中，所述两个连接部包括第一连接部和第二连接部，并且所述第一连接部的所述第二外表面与所述图案部的所述第一外表面之间的夹角与所述第二连接部的所述第二外表面与所述图案部的所述第一外表面之间的夹角相同。
  14. 根据权利要求8所述的掩模板，其中，所述连接部和所述图案部之间的衔接处的部分由所述主体的第一主表面与所述侧部的第三外表面相交的棱边支撑。
  15. 根据权利要求14所述的掩模板，其中，所述主体的第一主表面与所述侧部的第三外表面相交的棱边设置为圆角或倒角。
  16. 一种掩模板的制备方法，包括：
    提供支撑件并在所述支撑件上安装掩模条；
    其中，所述掩模条包括与所述支撑件连接的至少两个连接部，以及位于所述连接部之间的图案部，所述图案部包括第一外表面，所述连接部包括第二外表面；其中，所述第二外表面和所述第一外表面位于不同平面内。
  17. 一种权利要求1所述的掩模板的使用方法，包括：
    将基板放置在所述掩模板上，其中所述基板的待涂镀表面与所述掩模板的第一外表面接触，并且所述基板的待涂镀表面与所述掩模板的第二外表面彼此不接触。
  18. 根据权利要求17所述的使用方法，其中，所述掩模板的第二外表面与第一外表面不在同一平面内，且二者夹角为大于或等于180度且小于或等于360度。
PCT/CN2017/116953 2017-06-02 2017-12-18 掩模板及其制备方法和使用方法 Ceased WO2018218935A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110129723A (zh) * 2019-06-27 2019-08-16 京东方科技集团股份有限公司 金属掩膜条、掩膜板框架、金属掩膜板及其焊接方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102711116B1 (ko) * 2019-01-24 2024-09-27 삼성디스플레이 주식회사 표시장치 제조를 위한 마스크유닛
CN109778116B (zh) * 2019-03-28 2021-03-02 京东方科技集团股份有限公司 一种掩膜版及其制作方法、掩膜版组件
CN110331364B (zh) * 2019-08-02 2021-05-07 深圳市华星光电半导体显示技术有限公司 蒸镀金属掩膜板
KR20220068327A (ko) * 2020-11-18 2022-05-26 삼성디스플레이 주식회사 마스크 어셈블리 및 그 마스크 어셈블리의 제조 방법
KR20220081406A (ko) * 2020-12-08 2022-06-16 삼성디스플레이 주식회사 마스크 제조 방법 및 마스크를 포함하는 증착 설비
CN113088877A (zh) * 2021-04-08 2021-07-09 京东方科技集团股份有限公司 一种掩膜版框架重复使用的方法、掩膜版框架和掩膜版
KR20230077004A (ko) * 2021-11-24 2023-06-01 삼성디스플레이 주식회사 마스크 조립체 및 이를 포함하는 표시 장치용 증착 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953424B2 (ja) * 2006-04-21 2012-06-13 キヤノントッキ株式会社 薄膜形成方法
CN104372292A (zh) * 2013-08-15 2015-02-25 昆山允升吉光电科技有限公司 一种掩模组件
CN204509446U (zh) * 2014-12-15 2015-07-29 信利（惠州）智能显示有限公司 一种掩膜板固定装置
CN105200370A (zh) * 2015-10-27 2015-12-30 唐军 可循环使用的掩模板板框及具有它的掩模板
CN205803576U (zh) * 2016-06-28 2016-12-14 鄂尔多斯市源盛光电有限责任公司 掩膜板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192229A (ja) * 1998-12-24 2000-07-11 Sony Corp 真空蒸着法およびディスプレイ製造方法
JP2002175878A (ja) * 2000-09-28 2002-06-21 Sanyo Electric Co Ltd 層の形成方法及びカラー発光装置の製造方法
JP4953525B2 (ja) 2001-07-23 2012-06-13 パナソニック株式会社 非水電解質二次電池およびその製造法
US7041412B2 (en) 2001-07-23 2006-05-09 Matsushita Electric Industrial Co., Ltd. Non-aqueous electrolyte secondary battery
JP2004006257A (ja) 2002-04-26 2004-01-08 Tohoku Pioneer Corp 真空蒸着用マスク及びこれを用いて製造された有機ｅｌディスプレイパネル
JP4944367B2 (ja) 2004-05-25 2012-05-30 キヤノン株式会社 マスク構造体の製造方法
JP4860909B2 (ja) * 2004-05-25 2012-01-25 キヤノン株式会社 マスク構造体
JP4604593B2 (ja) * 2004-07-30 2011-01-05 ソニー株式会社 メタルマスクの製造方法
WO2007073072A1 (en) * 2005-12-19 2007-06-28 Doosan Mecatec Co., Ltd. Mask apparatus for divided deposition of substrate and patterning method using the same
DE102007032228B4 (de) 2007-07-11 2016-01-07 Gea Tuchenhagen Gmbh Selbstansaugende Pumpenaggregation
US20150299840A1 (en) * 2012-06-26 2015-10-22 Sharp Kabushiki Kaisha Mask frame
CN106884138A (zh) 2017-02-15 2017-06-23 武汉华星光电技术有限公司 荫罩组件及荫罩组件的重复使用方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953424B2 (ja) * 2006-04-21 2012-06-13 キヤノントッキ株式会社 薄膜形成方法
CN104372292A (zh) * 2013-08-15 2015-02-25 昆山允升吉光电科技有限公司 一种掩模组件
CN204509446U (zh) * 2014-12-15 2015-07-29 信利（惠州）智能显示有限公司 一种掩膜板固定装置
CN105200370A (zh) * 2015-10-27 2015-12-30 唐军 可循环使用的掩模板板框及具有它的掩模板
CN205803576U (zh) * 2016-06-28 2016-12-14 鄂尔多斯市源盛光电有限责任公司 掩膜板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110129723A (zh) * 2019-06-27 2019-08-16 京东方科技集团股份有限公司 金属掩膜条、掩膜板框架、金属掩膜板及其焊接方法
US11572616B2 (en) 2019-06-27 2023-02-07 Chengdu Boe Optoelectronics Technology Co., Ltd. Mask strip, mask plate frame, mask plate and welding method thereof

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