WO2019052229A1 - 显示基板、显示器件和显示基板的制造方法 - Google Patents

显示基板、显示器件和显示基板的制造方法 Download PDF

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Publication number
WO2019052229A1
WO2019052229A1 PCT/CN2018/089223 CN2018089223W WO2019052229A1 WO 2019052229 A1 WO2019052229 A1 WO 2019052229A1 CN 2018089223 W CN2018089223 W CN 2018089223W WO 2019052229 A1 WO2019052229 A1 WO 2019052229A1
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WIPO (PCT)
Prior art keywords
sub
line segment
pixel
substrate
display substrate
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Ceased
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PCT/CN2018/089223
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English (en)
French (fr)
Inventor
赵德江
杨洋
潘小杰
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to US16/334,644 priority Critical patent/US11233101B2/en
Priority to EP18845430.0A priority patent/EP3686933A4/en
Publication of WO2019052229A1 publication Critical patent/WO2019052229A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Definitions

  • the present disclosure relates to the field of display devices, and in particular, to a display substrate, a display device, and a method of fabricating the display substrate.
  • OLED Organic Light-Emitting Display
  • the display panel of the OLED generally includes a display substrate and a cover plate.
  • the display substrate is provided with an OLED pixel unit, and the cover plate is over the OLED pixel unit on the display substrate.
  • the OLED pixel unit includes an electrode, an organic thin film layer and another electrode which are sequentially disposed on the display substrate.
  • the organic thin film layer mainly includes a hole injection layer, a hole transport layer, an organic light emitting layer and an electron transport layer which are stacked on the electrode. .
  • the manufacturing method of the organic thin film layer of the OLED pixel unit mainly includes the following two methods: one is an evaporation method, and the other is an inkjet printing method. Among them, the inkjet printing method refers to uniformly depositing a liquid organic material to form an organic thin film layer.
  • organic material is injected into each sub-pixel region through a nozzle.
  • the thickness of the film formed by drying the organic material in the sub-pixel region is not uniform. Due to the coffee ring effect, the organic material usually has a thicker intermediate shape after drying, and gradually becomes thinner from the middle to the edge, and then rapidly thickens the shape. Due to the uneven thickness distribution, the film formed in each sub-pixel usually has only a relatively uniform thickness in the middle area to emit light of a normal color, and other portions may emit light different in color from the normal color, thereby affecting the display. Effect.
  • an embodiment of the present disclosure provides a display substrate including a substrate substrate and a pixel defining layer disposed on the substrate substrate, the pixel defining layer dividing the substrate substrate into multiple Sub-pixel regions, an orthographic projection of at least one of the sub-pixel regions on the base substrate is approximately a quadrangle, and the quadrilateral includes a first side, a second side, a third side, and a first The four sides are opposite to the third side, and the first side and the third side are recessed toward the inner side of the quadrilateral.
  • a vertical distance between the first side and the first line segment gradually increases and then gradually decreases in an extending direction of the first line segment, and the third side and the second line segment
  • the vertical distance between the first line segments is gradually increased and then gradually decreased in the extending direction of the second line segment, wherein the first line segment is a line segment connecting the two end points of the first side edge,
  • the second line segment is a line segment connecting the two end points of the third side.
  • a point at which the vertical distance from the first line segment is the largest on the first side is an intersection of a vertical line of the first line segment and the first side, the third side
  • the point at which the vertical distance from the second line segment is the largest is the intersection of the mid-perpendicular line of the second line segment and the third side.
  • the second side and the fourth side are recessed toward an inner side of the quadrilateral.
  • the orthographic projection of the sub-pixel region on the substrate substrate is a curved rectangle.
  • an expansion slot is disposed on the pixel defining layer, and the expansion slot is located at at least one corner of the sub-pixel region and is in communication with the sub-pixel region.
  • the orthographic projection of the inner sidewall of the expansion slot on the base substrate is a superior arc.
  • the radius of the superior arc is 1/8 to 1/12 of the length of the shorter one side of the sub-pixel region.
  • the depth of the expansion groove is smaller than the thickness of the pixel defining layer in a direction perpendicular to the base substrate.
  • the difference between the thickness of the pixel defining layer and the depth of the expansion slot is 1000 angstroms to 2000 angstroms.
  • the lengths of the first side and the third side are greater than the lengths of the second side and the fourth side.
  • the first side edge and the third side edge are arc edges
  • the circle height of the arc side is 1/ of the length of the second side or the fourth side 8 ⁇ 1/12, wherein the circle height of the arc side is the difference between the radius of the arc side and the chord distance of the string of the arc side.
  • the display substrate further includes an electrode disposed between the substrate substrate and the pixel defining layer, an orthographic projection of the sub-pixel region on the substrate substrate is located at the electrode Within the orthographic projection on the substrate.
  • embodiments of the present disclosure also provide a display device including any of the foregoing display substrates.
  • an embodiment of the present disclosure further provides a method of manufacturing a display substrate, the method of manufacturing comprising:
  • the quadrilateral includes a first side, a second side, a third side, and a fourth side that are sequentially connected end to end, the first side being opposite to the third side, the first The side and the third side are recessed toward the inside of the quadrilateral.
  • a vertical distance between the first side and the first line segment gradually increases and then gradually decreases in an extending direction of the first line segment
  • the third side and the second line segment The vertical distance between the first line segments is gradually increased and then gradually decreased in the extending direction of the second line segment, wherein the first line segment is a line segment connecting the two end points of the first side edge, the second The line segment is a line segment connecting the two end points of the third side.
  • the forming a pixel defining layer on the base substrate comprises:
  • a sub-pixel opening and an expansion groove are formed on the transparent insulating film layer, and the expansion groove is located at at least one corner of the sub-pixel opening and is in communication with the sub-pixel opening.
  • the forming a pixel defining layer on the base substrate comprises:
  • the expansion groove is formed on the second transparent insulating film layer.
  • FIG. 1 is a partial plan view of a display substrate according to an embodiment of the present disclosure
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 3 is a partial plan view of another display substrate according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of another display substrate according to an embodiment of the present disclosure.
  • FIG. 5 is a partially enlarged schematic view of a display substrate according to an embodiment of the present disclosure.
  • FIG. 6 is a top plan view of another display substrate according to an embodiment of the present disclosure.
  • Figure 7 is a cross-sectional view taken along line C-C of Figure 6;
  • FIG. 8 is a partial plan view of still another display substrate according to an embodiment of the present disclosure.
  • FIG. 9 is a flowchart of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 10 is a flowchart of another method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 11 to FIG. 15 are schematic structural diagrams showing the manufacture of a display substrate according to an embodiment of the present disclosure.
  • 16 is a flowchart of another method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 17 is a flowchart of a method for fabricating a pixel defining layer according to an embodiment of the present disclosure
  • FIG. 18 to FIG. 21 are schematic structural diagrams showing the manufacture of a display substrate according to an embodiment of the present disclosure.
  • FIG. 22 is a flowchart of another method for fabricating a pixel defining layer according to an embodiment of the present disclosure
  • 23 to 25 are schematic structural views in the manufacture of a display substrate according to an embodiment of the present disclosure.
  • FIG. 1 is a partial plan view of a display substrate according to an embodiment of the present disclosure.
  • 2 is a cross-sectional view taken along line A-A of FIG. 1.
  • the display substrate includes a base substrate 10 and a pixel defining layer 20 disposed on the base substrate 10.
  • the pixel defining layer 20 divides the base substrate 10 into a plurality of sub-pixel regions 30.
  • the base substrate 10 may be a transparent substrate such as a glass substrate, a silicon substrate, a plastic substrate, or the like.
  • the pixel defining layer 20 may be made of a transparent insulating material such as polyimide, silicon nitride, or silicon oxide.
  • the orthographic projection of at least one sub-pixel region 30 on the base substrate 10 is approximately quadrangular, and the quadrilateral includes a first side 30a, a second side 30b, a third side 30c, and the first and second ends connected in series.
  • the fourth side 30d, the first side 30a is opposite to the third side 30c, and the two ends of the second side 30b and the fourth side 30d are respectively connected between the first side 30a and the third side 30c.
  • the first side 30a and the third side 30c are recessed toward the inside of the quadrangle.
  • the vertical distance between the first side 30a and the first line segment p gradually increases and then gradually decreases in the extending direction of the first line segment p, and the third side 30c and the second line segment q
  • the vertical distance between the first line segment p is gradually increased and then gradually decreased, wherein the first line segment p is a line segment connecting the two end points of the first side edge 30a, and the second line segment q is a connection portion.
  • the line segments of the two end points of the three side edges 30c are such that the quadrilateral is gradually narrowed from the both ends of the first side edge 30a and the third side edge 30c toward the center.
  • “about a quadrilateral shape” includes at least two cases: the first case is to directly connect adjacent two corners of the four corners of the quadrilateral to form a first side of the quadrilateral, a second side, a third side, and a fourth side; in the second case, an expansion slot may be provided at at least one of the four corners of the quadrilateral (see the embodiment below), at this time
  • the quadrangular shape formed by connecting the four corners of the expansion groove on the corner is approximately a quadrangle.
  • the expansion groove is provided at four corners, but the present disclosure is not limited thereto.
  • the orthographic projection of at least one of the sub-pixel regions 30 on the substrate substrate 10 appears to be approximately quadrangular, it is possible to make a slight pattern change thereto, which is within the protection scope of the present disclosure.
  • the "first and last sequential connection" in the embodiment of the present disclosure does not necessarily require the strict front-to-bottom connection of the quadrilateral.
  • the quadrilateral if at least one corner of the quadrilateral is provided with an expansion slot, the quadrilateral
  • the four sides are not in the strict sense of the first and last sequential connections, and there are expansion slots in the middle, but the case of Fig. 13 in the present disclosure also belongs to a case where the four sides of the quadrilateral are connected in sequence.
  • the second side 30b and the fourth side 30d may also be recessed toward the inner side of the quadrilateral, and the quadrilateral is gradually narrowed from the both ends of the second side 30b and the fourth side 30d toward the middle. This makes the thickness of the formed film layer more uniform.
  • the point at which the vertical distance from the first line segment p on the first side edge 30a is the largest is the intersection of the mid-perpendicular line of the first line segment p and the first side edge 30a, and the third side edge 30c is on the second side.
  • the point at which the vertical distance of the line segment q is the largest is the intersection of the mid-perpendicular line of the second line segment q and the third side edge 30c.
  • the four vertices of the aforementioned quadrilateral are respectively located at four vertices of the rectangle 100, so that the arrangement of the sub-pixels can be facilitated, and the arrangement of the sub-pixels is more neat.
  • the orthographic projection of the sub-pixel region 30 on the substrate substrate 10 is an axisymmetric pattern, and the orthographic projections may have two axes of symmetry (such as the axis of symmetry a and the axis of symmetry b in FIG. 1).
  • the axis of symmetry may be a mid-perpendicular line connecting the two end points of the first side edge 30a and a mid-perpendicular line connecting the two end points of the second side edge 30b, respectively. This makes the arrangement of sub-pixels more tidy.
  • FIG. 3 is a partial plan view of another display substrate according to an embodiment of the present disclosure.
  • the four sides of the quadrilateral are curved sides, so that the orthographic projection of the sub-pixel region 30 on the substrate 10 is curved.
  • Edge rectangle refers to a pattern obtained by replacing at least one side of the rectangle with a curved side.
  • the curved projection of the sub-pixel region 30 shown in FIG. 3 on the base substrate 10 is a curved rectangle.
  • the four edges of the rectangle are replaced by the graphics obtained after the curved edges.
  • the sub-pixel region 30 may also have only two opposite sides as curved edges, for example, only the first side 30a and the third side 30c are curved sides.
  • the orthographic projection of the sub-pixel region on the substrate substrate is approximately quadrangular by changing the shape of the sub-pixel region.
  • the first side and the third side opposite thereto are recessed toward the inner side of the quadrilateral.
  • Such a sub-pixel area has a narrower area, which can reduce the amount of ink accumulated in a narrower area during inkjet printing, while at the beginning of the ink drying process, the narrower area of the sub-pixel area is just beginning.
  • the ink will be higher, because the ink in the narrower area is slower to dry than the edge, and under the Marathon effect, the ink in the narrower area will flow in both directions near the second side and the fourth side.
  • the ink amount in the narrower region is further reduced, the ink distribution is more uniform, thereby reducing the thickness of the film formed by the narrower region in the sub-pixel region, so that the film formed after the ink is completely dried is more uniform in thickness, and due to the first side And the third side is recessed toward the inner side of the quadrilateral.
  • the ink flows more toward both ends of the first side and the third side, increasing the sub-pixel area. Thin film-thickness region of the edge, so that a larger area can be formed relatively uniform film thickness of the sub-pixel region.
  • the vertical distance between the first side edge and the first line segment gradually increases and then decreases gradually in the extending direction of the first line segment, and between the third side line and the second line segment.
  • the vertical distance gradually increases and then decreases gradually in the extending direction of the second line segment, and the ink may flow more toward both ends of the first side and the third side during the drying process, thereby increasing the sub-pixel area.
  • the film thickness of the thinner portion of the edge is such that a film having a larger uniform thickness can be formed in the sub-pixel region.
  • the length of the first side 30a and the third side 30c is greater than the length of the second side 30b and the fourth side 30d.
  • the two longer sides of the sub-pixel region 30 may be curved edges, and the longer sides are curved edges so that the ink in the middle of the sub-pixel region flows toward the two short sides far apart during the drying process, so that The ink is more evenly distributed and the resulting film is more uniform in thickness.
  • the longer sides of the sub-pixel region 30 (for example, the first side 30a and the third side 30c shown in FIG. 3) refer to the rectangle formed by the four vertices of the sub-pixel region 30, and The long side of the rectangle has a curved edge of the endpoint.
  • the ratio of the length of the long side to the short side may be 3:1 to 1:1, and in the embodiment of the present disclosure, the ratio of the length of the long side to the short side It is 3:1. It should be noted that the ratio of the lengths of the adjacent sides of the rectangle formed by the four vertices of the sub-pixel region may also be 1:1, such that the four vertices of the sub-pixel region 30 constitute a square.
  • the first side 30a and the third side 30c may be arc edges, and the circle height h of the arc side is the length of the second side 30b or the fourth side 30d of the sub-pixel area 30. 1/8 ⁇ 1/12, where the circle height h of the arc side is the radius of the arc side (R in Figure 3) and the chord distance of the string of the arc side ( Figure 3 In the case of H), if the circle is too small, h is too small, the degree of the ink flowing to the two short sides is not obvious during the drying process, and the influence on the film thickness is too small. If the circle is too high, the h is too large.
  • the middle portion of the sub-pixel region 30 is made too narrow, and there is a large non-light-emitting region between the adjacent sub-pixel regions 30, thereby causing the brightness of the pixel to decrease.
  • the length of a certain side of the sub-pixel region 30 refers to the linear distance between the two end points of the edge.
  • the circle lack of the second side 30b and the fourth side 30d and the circle of the first side 30a and the third side 30c are not high.
  • h is proportional, and the ratio is equal to the ratio of the lengths of the short sides to the long sides of the rectangle formed by the four vertices of the sub-pixel region 30.
  • the thickness m of the pixel defining layer 20 does not exceed 3 ⁇ m, which is 1.5 to 2 ⁇ m in this embodiment. If the thickness m of the pixel defining layer 20 is excessively increased to increase the thickness of the display substrate, if the thickness of the pixel defining layer 20 is too small, the light emitted from the sub-pixel region 30 is easily entered into the adjacent sub-pixel region 30, thereby The effect of the display is affected.
  • the thickness m of the pixel defining layer 20 refers to the vertical distance of the surface of the pixel defining layer 20 away from the substrate 10 and parallel to the substrate 10 and the substrate 10 .
  • FIG. 4 is a schematic structural diagram of another display substrate according to an embodiment of the present disclosure.
  • the pixel defining layer 20 may further be provided with an expansion slot 31 , and the expansion slot 31 is located at at least one corner of the sub-pixel region 30 . And communicating with the sub-pixel region 30.
  • the expansion slot 31 By providing the expansion slot 31, ink flows into the expansion slot 31 during inkjet printing. During the drying of the ink, the ink located in the expansion slot 31 is dried first, so that the ink in the sub-pixel region 30 flows in. Into the expansion slot 31, it is possible to prevent the film thickness formed at the edge of the sub-pixel region 30 from being excessively large, and to make the film thickness in the sub-pixel region 30 more uniform.
  • FIG. 5 is a partially enlarged schematic view of a display substrate according to an embodiment of the present disclosure. As shown in FIG. 5, the orthographic projection of the inner sidewall of the expansion slot 31 on the base substrate 10 may be a superior arc 311.
  • the central angle ⁇ of the superior arc 311 may be 300°.
  • the four corners of the sub-pixel region 30 may be provided with expansion grooves 31, so that the formed film thickness is more uniform.
  • the expansion slot 31 may also be provided only at a partial corner.
  • the radius of the superior arc 311 may be 1/8 to 1/12 of the length of the shorter side of the sub-pixel region 30. In the case where the film is made more uniform, the sub-pixel pitch caused by the excessive expansion of the expansion groove 31 is prevented from increasing, and the density of the sub-pixel arrangement is lowered.
  • FIG. 6 is a top view of another display substrate according to an embodiment of the present disclosure.
  • the display substrate further includes an electrode 40 disposed between the base substrate 10 and the pixel defining layer 20 (as shown by the dotted line in FIG. 6 As shown, the electrodes 40 are disposed in one-to-one correspondence with the sub-pixel regions 30.
  • 7 is a CC cross-sectional view of FIG. 6. As shown in FIG. 7, the groove bottom of the expansion groove 31 is provided with an insulating layer 50 such that the depth of the expansion groove 31 is smaller than the pixel defining layer in a direction perpendicular to the substrate substrate 10.
  • the thickness of 20 is such that after the ink is dropped into the sub-pixel region 30, the ink located in the expansion groove 31 is shallow (the size of the ink in the depth direction of the expansion groove), and the ink in the expansion groove 31 is dried during the drying process. Fast, so that ink is continuously replenished from the sub-pixel region 30 into the expansion slot 31, thereby facilitating the flow of ink into the expansion slot 31, and at the same time, it is difficult to ensure projection and electrode of the expansion slot 31 on the base substrate 10 at the time of fabrication. There is no overlap between 40. If there is an overlapping area between the projection of the expansion slot 31 on the base substrate 10 and the electrode 40, the film formed by drying the ink in the expansion slot 31 may emit light, and the insulating layer 50 may be provided.
  • the electrode 40 is spaced apart from the film formed of the organic material in the expansion groove 31, so that the film formed in the expansion groove 31 can be prevented from emitting light by the action of the electrode.
  • the difference between the thickness of the pixel defining layer 20 and the depth of the expansion groove 31 does not exceed 2000 angstroms. That is, the thickness of the insulating layer 50 does not exceed 2000 angstroms. Illustratively, it may be from 1000 angstroms to 2000 angstroms. If the difference is too large, the expansion groove 31 is too shallow, so that it is difficult for the ink to flow into the expansion groove 31.
  • the orthographic projection of the sub-pixel region 30 on the substrate substrate 10 may be located within the orthographic projection of the electrode 40 on the substrate substrate 10, such that the organic thin film layer formed by printing in the sub-pixel region 30 can emit light. .
  • FIG. 8 is a schematic structural diagram of still another display substrate according to an embodiment of the present disclosure.
  • the display substrate includes a substrate substrate and a pixel defining layer 20 disposed on the substrate.
  • the pixel defining layer 20 divides the base substrate into a plurality of sub-pixel regions 30.
  • the orthographic projection of at least one of the sub-pixel regions 30 on the substrate substrate is approximately rectangular (ignoring the influence of the expansion slot 31), and the rectangle includes substantially the first and last sequential connections (again, ignoring the influence of the expansion slot 31).
  • the first side 30a, the second side 30b, the third side 30c, and the fourth side 30d are disposed opposite to the third side 30c.
  • the difference from the embodiment shown in FIG. 1-7 is that the first side 30a, the second side 30b, the third side 30c and the fourth side 30d are connected to the adjacent two end points of the rectangle.
  • the first side edge 30a, the second side edge 30b, the third side edge 30c, and the fourth side edge 30d of the rectangle are not recessed toward the inner side of the rectangle, that is, the rectangle is from the first side edge 30a and the third side edge Both ends of the 30c are not gradually narrowed toward the center.
  • the rectangle is not gradually narrowed from the both ends of the second side 30b and the fourth side 30d toward the center.
  • the pixel defining layer 20 may further be provided with an expansion slot 31 located at at least one corner of the sub-pixel region 30 and communicating with the sub-pixel region 30.
  • an expansion slot 31 located at at least one corner of the sub-pixel region 30 and communicating with the sub-pixel region 30.
  • ink flows into the expansion slot 31 during inkjet printing.
  • the ink located in the expansion slot 31 is dried first, so that the ink in the sub-pixel region 30 flows in.
  • the orthographic projection of the inner sidewall of the expansion slot 31 on the base substrate may be a superior arc.
  • the central angle of the superior arc may be 300°.
  • the four corners of the sub-pixel region 30 may be provided with expansion grooves 31, so that the formed film thickness is more uniform.
  • the expansion slot 31 may also be provided only at a partial corner.
  • the radius of the superior arc may be 1/8 to 1/12 of the length of the shorter side of the sub-pixel region 30.
  • the orthographic projection of the at least one sub-pixel region 30 on the substrate may be approximately a quadrangle, and any one or more of the four sides of the quadrilateral may be The inner side of the quadrangle is recessed, and the other side edges are line segments connecting the two end points of the respective side edges, and at the same time, at least one corner of the quadrilateral may be provided with the expansion groove 31.
  • the embodiment of the present disclosure further provides a display device including any one of the display substrates shown in FIGS. 1 to 8.
  • the display device can be: electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator and the like with any display product or component.
  • the orthographic projection of the sub-pixel region on the substrate substrate is approximately quadrangular by changing the shape of the sub-pixel region.
  • the first side and the third side opposite thereto are recessed toward the inner side of the quadrilateral.
  • Such a sub-pixel area has a narrower area, which can reduce the amount of ink accumulated in a narrower area during inkjet printing, while at the beginning of the ink drying process, the narrower area of the sub-pixel area is just beginning.
  • the ink will be higher, because the ink in the narrower area is slower to dry than the edge, and under the Marathon effect, the ink in the narrower area will flow in both directions near the second side and the fourth side.
  • the ink amount in the narrower region is further reduced, the ink distribution is more uniform, thereby reducing the thickness of the film formed by the narrower region in the sub-pixel region, so that the film formed after the ink is completely dried is more uniform in thickness, and due to the first side And the third side is recessed toward the inner side of the quadrilateral.
  • the ink flows more toward both ends of the first side and the third side, increasing the sub-pixel area. Thin film-thickness region of the edge, so that a larger area can be formed relatively uniform film thickness of the sub-pixel region.
  • the vertical distance between the first side edge and the first line segment gradually increases and then decreases gradually in the extending direction of the first line segment, and between the third side line and the second line segment.
  • the vertical distance gradually increases and then decreases gradually in the extending direction of the second line segment, and the ink may flow more toward both ends of the first side and the third side during the drying process, thereby increasing the sub-pixel area.
  • the film thickness of the thinner portion of the edge is such that a film having a larger uniform thickness can be formed in the sub-pixel region.
  • FIG. 9 is a flowchart of a method for manufacturing a display substrate according to an embodiment of the present disclosure, which is suitable for manufacturing any one of the display substrates shown in FIGS. 1 to 8 . As shown in FIG. 9, the manufacturing method includes:
  • the pixel defining layer divides the base substrate into a plurality of sub-pixel regions.
  • the orthographic projection of the at least one sub-pixel region on the substrate substrate is a quadrangle, and the quadrilateral includes a first side, a second side, a third side, and a fourth side, which are sequentially connected end to end, the first side and the third side.
  • the side edges are oppositely disposed, and the first side and the third side are recessed toward the inner side of the quadrilateral.
  • the vertical distance between the first side edge and the first line segment gradually increases and then gradually decreases in the extending direction of the first line segment
  • the vertical distance between the third side line and the second line segment is The extending direction of the second line segment is gradually increased and then gradually decreased, wherein the first line segment is a line segment connecting the two end points of the first side edge, and the second line segment is a line segment connecting the two end points of the third side edge
  • the point at which the vertical distance from the first line segment is the largest on the first side is the intersection of the mid-perpendicular line of the first line segment and the first side, and the vertical distance from the second line segment on the third side is the largest.
  • the point is the intersection of the mid-perpendicular line of the second line segment and the third side, such that the quadrilateral gradually narrows from the both ends of the first side and the third side toward the middle.
  • the orthographic projection of the sub-pixel region on the substrate substrate is quadrangular by changing the shape of the sub-pixel region.
  • the first side and the third side opposite thereto are recessed toward the inner side of the quadrilateral.
  • the sub-pixel area has a narrower area, which can reduce the amount of ink accumulated in a narrower area during inkjet printing, and at the same time as the ink in the narrower area of the sub-pixel area is in the process of drying the ink. It will be higher, because the ink drying speed in the narrower area is slower than the edge, under the Marathon effect, the ink in the narrower area will flow in both directions near the second side and the fourth side.
  • the ink amount in the narrower region is further reduced, the ink distribution is more uniform, thereby reducing the film thickness formed by the narrower region in the sub-pixel region, so that the film formed after the ink is completely dried is more uniform in thickness, and due to the first side and The third side is recessed toward the inner side of the quadrilateral. During the drying process, the ink flows more toward both ends of the first side and the third side, increasing the edge of the sub-pixel area. The film thickness of the thin region, so that a larger area can be formed relatively uniform film thickness of the sub-pixel region.
  • the vertical distance between the first side edge and the first line segment gradually increases and then decreases gradually in the extending direction of the first line segment, and between the third side line and the second line segment.
  • the vertical distance gradually increases and then decreases gradually in the extending direction of the second line segment, and the ink may flow more toward both ends of the first side and the third side during the drying process, thereby increasing the sub-pixel area.
  • the film thickness of the thinner portion of the edge is such that a film having a larger uniform thickness can be formed in the sub-pixel region.
  • FIG. 10 is a flowchart of another method of manufacturing a display substrate according to an embodiment of the present disclosure, which is suitable for manufacturing the display substrate shown in FIG. 6.
  • the present disclosure will be described in detail below with reference to FIGS. 11 to 14.
  • the manufacturing method includes:
  • the base substrate may be a transparent substrate such as a glass substrate, a silicon substrate, a plastic substrate, or the like.
  • the substrate substrate may be subjected to a cleaning process in step S21.
  • a plurality of electrodes 40 are formed on the base substrate 10.
  • the plurality of electrodes 40 may be arrayed on the base substrate 11.
  • step S22 may include:
  • a thin film layer of an electrode material is formed on the base substrate 10.
  • a plurality of electrodes 40 are formed by a patterning process.
  • a thin film layer of an electrode material may be formed on the base substrate 10 by magnetron sputtering or evaporation, so that the thin film layer of the electrode material covers the surface of the base substrate 10.
  • the thin film layer of the electrode material may be ITO/Ag/ITO, and when the electrode serves as a cathode, the thin film layer of the electrode material may be Mg/Ag.
  • a pixel defining layer 20 is formed on the base substrate 10.
  • step S23 may include:
  • a transparent insulating film layer is formed on the base substrate 10.
  • a plurality of sub-pixel openings 201 are formed on the transparent insulating film layer to form the pixel defining layer 20.
  • a layer of silicon nitride or silicon oxide or polyimide may be formed on the base substrate 10 to form a transparent insulating film layer.
  • a plurality of sub-pixel openings 201 arranged in an array may be formed on the transparent insulating film layer by a patterning process, thereby dividing the substrate substrate into a plurality of sub-pixel regions.
  • FIGS. 11 and 12 are each a cross-sectional view on the display substrate corresponding to the position B-B in FIG.
  • the orthographic projection of the sub-pixel region 30 on the substrate substrate is a curved rectangle, and the four sides of the sub-pixel region 30 are curved sides, and the four curved sides are all recessed toward the inner side of the curved rectangle.
  • the curved rectangle is a graphic obtained by replacing at least one edge of the rectangle with a curved edge.
  • the sub-pixel region may also have only two opposite sides as curved edges.
  • a plurality of expansion grooves 31 are formed on the pixel defining layer 20.
  • the expansion slot 31 is located at at least one corner of the sub-pixel opening 201 and is in communication with the sub-pixel opening 201.
  • the four corners of the sub-pixel opening 201 may be provided with expansion grooves 31 to make the thickness of the film formed by ink jet printing more uniform.
  • the specific shape of the expansion groove 31 can be referred to the foregoing embodiment. It will not be detailed here.
  • the expansion trench 31 may be formed on the pixel defining layer 20 by a photolithography process.
  • step S23 and step S24 can be performed simultaneously, and a plurality of sub-pixel openings 201 and expansion slots 31 are simultaneously formed on the transparent insulating film layer by a photolithography process to reduce the number of photolithography times.
  • photolithography may be performed using a semi-transmissive mask such that the bottom of the groove of the expansion groove 31 is left with an insulating layer 50, and the depth of the expansion groove 31 is perpendicular to the substrate substrate 10. Less than the thickness of the pixel defining layer 20.
  • FIG. 15 is a cross-sectional view of the display substrate corresponding to C-C in FIG. 6 during the manufacturing process.
  • FIG. 16 is a flowchart of another method of manufacturing a display substrate according to an embodiment of the present disclosure, which is suitable for manufacturing the display substrate shown in FIG. 6. As shown in FIG. 16, the manufacturing method includes:
  • This step is the same as S21 and will not be described here.
  • S32 An electrode is formed on the base substrate.
  • This step is the same as S22 and will not be described here.
  • S33 may include the following steps:
  • a first transparent insulating film layer 21 is formed on the base substrate 10.
  • a layer of silicon nitride or silicon oxide or polyimide may be formed on the base substrate to form the first transparent insulating film layer 21.
  • S312 forming a sub-pixel opening and an expansion slot opening on the first transparent insulating film layer.
  • a sub-pixel opening 201 and an expansion slot opening 31a are formed on the first transparent insulating film layer 21.
  • the depth of the expansion groove opening 31a is the same as the thickness of the first transparent insulating film layer 21 in the direction perpendicular to the base substrate 10.
  • a plurality of openings arranged in an array may be formed on the first transparent insulating film layer 21 by a patterning process, thereby forming a plurality of sub-pixel openings 201 and expansion groove openings 31a.
  • the first transparent insulating film layer 21 formed with the sub-pixel opening 201 and the expansion slot opening 31a divides the base substrate 10 into a plurality of sub-pixel regions.
  • a second transparent insulating film layer 22 is formed on the base substrate 10.
  • the material of the second transparent insulating film layer 22 may be the same as or different from the material of the first transparent insulating film layer 21.
  • the pixel defining layer 20 is formed by the first transparent insulating film layer 21 and the second transparent insulating film layer 22, and the sub-pixel opening 201 and the expansion groove 31 are formed on the pixel defining layer 20. Since only the second transparent insulating film layer 22 located in the sub-pixel opening 201 is removed, the second transparent insulating film layer 22 in the expansion groove opening 31a is not removed, thereby forming an expansion groove having a depth smaller than the thickness of the pixel defining layer 20. 31.
  • An insulating layer 50 is left at the bottom of the groove of the expansion slot 31. The insulating layer 50 can separate the electrode 40 from the film formed of the organic material in the expansion groove 31, and prevent the film formed in the expansion groove 31 from emitting light under the action of the electrode 40.
  • the second transparent insulating film layer located in the sub-pixel region may be removed by a patterning process.
  • a pixel defining layer is formed on the base substrate, and a position of the corresponding expansion groove on the base substrate is also formed with a second transparent insulating film layer, thereby forming an extension having a depth smaller than a thickness of the pixel defining layer. groove.
  • the structure of the base substrate on which the pixel defining layer and the expansion groove are formed can be referred to FIG.
  • FIGS. 18 to 21 are cross-sectional views on the display substrate corresponding to C-C in FIG. 6 during the manufacturing process.
  • S33 may also include the following steps:
  • Step S321 can be the same as S311, and will not be described in detail herein.
  • a sub-pixel opening is formed on the first transparent insulating film layer 21.
  • the plurality of sub-pixel openings 201 arranged in an array may be formed on the first transparent insulating film layer 21 by a patterning process, thereby dividing the base substrate 10 into a plurality of sub-pixel regions.
  • a second transparent insulating film layer 22 is formed on the base substrate 10.
  • the material of the second transparent insulating film layer 22 may be the same as or different from the material of the first transparent insulating film layer 21.
  • the pixel defining layer 20 is formed by the first transparent insulating film layer 21 and the second transparent insulating film layer 22, and the sub-pixel opening 201 and the expansion groove 31 are formed on the pixel defining layer 20.
  • the second transparent insulating film layer 22 located in the sub-pixel opening may be removed by a patterning process while forming an expansion groove 31 at the corner of the sub-pixel opening 201, the depth of the expansion groove 31 being the same as the thickness of the second transparent insulating film layer 22. .
  • an insulating layer 50 is formed at the bottom of the expansion trench 31.
  • the insulating layer 50 can separate the electrode 40 from the film formed by the organic material in the expansion trench 31, and the film formed in the expansion trench 31 is prevented from being under the action of the electrode 40. Glowing.
  • FIGS. 23 to 25 are cross-sectional views on the display substrate corresponding to C-C in FIG. 6 during the manufacturing process.
  • the film formed by the ink in the expansion slot is thinner, and the ink in the expansion slot dries faster, which facilitates the flow of ink into the expansion slot, and the corresponding expansion slot on the substrate substrate.
  • the second transparent insulating film layer formed at the position can separate the electrode from the film formed of the organic material in the expansion groove, so that the film formed in the expansion groove can be prevented from emitting light.

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Abstract

一种显示基板、显示器件和显示基板的制造方法，属于显示设备领域。该显示基板包括衬底基板和像素界定层，像素界定层将衬底基板划分为多个子像素区域，至少一个子像素区域在衬底基板上的正投影均大约为四边形，四边形的第一侧边与第三侧边向四边形的内侧凹陷。

Description

显示基板、显示器件和显示基板的制造方法
本公开要求申请日为2017年9月18日、申请号为CN201710842233.X、发明创造名称为《一种显示基板、显示器件和显示基板的制造方法》的发明专利申请的优先权。
技术领域
本公开涉及显示设备领域，特别涉及一种显示基板、显示器件和显示基板的制造方法。
背景技术
有机发光显示器(英文Organic Light-Emitting Display，简称OLED)是一种应用十分广泛的主流显示器，具有超轻薄、制作成本低等优点。
OLED的显示面板通常包括显示基板和盖板，显示基板上设置有OLED像素单元，盖板盖合在显示基板上的OLED像素单元上方。OLED像素单元包括依次设置于显示基板上的一电极、有机薄膜层和另一电极，有机薄膜层主要包括层叠设置在电极上的空穴注入层、空穴传输层、有机发光层以及电子传输层。OLED像素单元的有机薄膜层的制作方法主要包括如下两种：一种是蒸镀方式，另一种是喷墨打印方式。其中，喷墨打印方式是指将液态有机材料均匀沉积形成有机薄膜层。
在喷墨打印的过程中，有机材料通过喷嘴被注入到每一个子像素区域中。子像素区域中的有机材料干燥后形成的薄膜的厚度不均匀，由于咖啡环效应，有机材料在干燥后通常会呈现中间较厚，从中间向边缘缓慢变薄，再迅速变厚的形状。由于厚度分布不均匀，在每个子像素中形成的薄膜通常只有中间面积较小的厚度较均匀的区域可以发出正常颜色的光，其他部分可能会发出与正常颜色的颜色不同的光，从而影响显示的效果。
发明内容
一方面，本公开实施例提供了一种显示基板，所述显示基板包括衬底基板和设置于所述衬底基板上的像素界定层，所述像素界定层将所述衬底基板划分为多个子像素区域，至少一个所述子像素区域在所述衬底基板上的正投影大约为四边形，所述四边形包括首尾顺次连接的第一侧边、第二侧边、第三侧边和第四侧边，所述第一侧边与所述第三侧边相对设置，所述第一侧边与所述第三侧边向所述四边形的内侧凹陷。
可选地，所述第一侧边与第一线段之间的垂直距离在所述第一线段的延伸方向上先逐渐增大再逐渐减小，所述第三侧边与第二线段之间的垂直距离在所述第二线段的延伸方向上先逐渐增大再逐渐减小，其中，所述第一线段为连接所述第一侧边的两个端点的线段，所述第二线段为连接所述第三侧边的两个端点的线段。
可选地，所述第一侧边上与所述第一线段的垂直距离最大的点为所述第一线段的中垂线与所述第一侧边的交点，所述第三侧边上与所述第二线段的垂直距离最大的点为所述第二线段的中垂线与所述第三侧边的交点。
可选地，所述第二侧边和所述第四侧边向所述四边形的内侧凹陷。
可选地，所述子像素区域在所述衬底基板上的正投影为曲边矩形。
可选地，所述像素界定层上设置有扩展槽，所述扩展槽位于所述子像素区域的至少一个角处，且与所述子像素区域连通。
可选地，所述扩展槽的内侧壁在所述衬底基板上的正投影为优弧。
可选地，所述优弧的半径为所述子像素区域的较短的一条侧边的长度的1/8～1/12。
进一步地，在垂直于所述衬底基板的方向上，所述扩展槽的深度小于所述像素界定层的厚度。
可选地，所述像素界定层的厚度与所述扩展槽的深度的差为1000埃～2000埃。
进一步地，所述第一侧边和所述第三侧边的长度大于所述第二侧边和所述第四侧边的长度。
可选地，所述第一侧边和所述第三侧边为圆弧边，所述圆弧边的圆缺高为所述第二侧边或所述第四侧边的长度的1/8～1/12，其中，所述圆弧边的圆缺高为所述圆弧边的半径与所述圆弧边所对的弦的弦心距的差。
可选地，所述显示基板还包括设置在所述衬底基板和所述像素界定层之间的电极，所述子像素区域在所述衬底基板上的正投影位于所述电极在所述衬底基板上的正投影内。
另一方面，本公开实施例还提供了一种显示器件，所述显示器件包括前述的任一种显示基板。
另一方面，本公开实施例还提供了一种显示基板的制造方法，所述制造方法包括：
提供一衬底基板；
在所述衬底基板上制作像素界定层，所述像素界定层将所述衬底基板划分为多个子像素区域，至少一个所述子像素区域在所述衬底基板上的正投影大约为四边形，所述四边形包括首尾顺次连接的第一侧边、第二侧边、第三侧边和第四侧边，所述第一侧边与所述第三侧边相对设置，所述第一侧边与所述第三侧边向所述四边形的内侧凹陷。
进一步地，所述第一侧边与第一线段之间的垂直距离在所述第一线段的延伸方向上先逐渐增大再逐渐减小，所述第三侧边与第二线段之间的垂直距离在所述第二线段的延伸方向上先逐渐增大再逐渐减小，其中，所述第一线段为连接所述第一侧边的两个端点的线段，所述第二线段为连接所述第三侧边的两个端点的线段。
进一步地，所述在所述衬底基板上制作像素界定层，包括：
在所述衬底基板上形成透明绝缘膜层；
在所述透明绝缘膜层上形成子像素开口和扩展槽，所述扩展槽位于所述子像素开口的至少一个角处，且与所述子像素开口连通。
可选地，所述在所述衬底基板上制作像素界定层，包括：
在所述衬底基板上形成第一透明绝缘膜层；
在所述第一透明绝缘膜层上形成子像素开口；
在所述第一透明绝缘膜层上形成第二透明绝缘膜层；
在所述第二透明绝缘膜层上形成所述扩展槽。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的一种显示基板的局部俯视图；
图2是图1中的A-A截面图；
图3是本公开实施例提供的另一种显示基板的局部俯视图；
图4是本公开实施例提供的另一种显示基板的结构示意图；
图5是本公开实施例提供的一种显示基板的局部放大示意图；
图6是本公开实施例提供的另一种显示基板的俯视图；
图7是图6中的C-C截面图；
图8是本公开实施例提供的又一种显示基板的局部俯视图；
图9是本公开实施例提供的一种显示基板的制造方法的流程图；
图10是本公开实施例提供的另一种显示基板的制造方法的流程图；
图11～图15是本公开实施例提供的显示基板的制造中的结构示意图；
图16是本公开实施例提供的另一种显示基板的制造方法的流程图；
图17是本公开实施例提供的一种像素界定层的制造方法的流程图；
图18～图21是本公开实施例提供的显示基板的制造中的结构示意图；
图22是本公开实施例提供的另一种像素界定层的制造方法的流程图；
图23～图25是本公开实施例提供的显示基板的制造中的结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开实施方式作进一步地详细描述。
图1是本公开实施例提供的一种显示基板的局部俯视图。图2是图1中的A-A截 面图，如图1和图2所示，该显示基板包括衬底基板10和设置于衬底基板10上的像素界定层20。参照图1，像素界定层20将衬底基板10划分为多个子像素区域30。
可选地，衬底基板10可以为透明基板，例如玻璃基板、硅基板和塑料基板等。像素界定层20可以采用透明绝缘材料制成，例如聚酰亚胺、氮化硅、氧化硅。
如图1所示，至少一个子像素区域30在衬底基板10上的正投影大约为四边形，四边形包括首尾顺次连接的第一侧边30a、第二侧边30b、第三侧边30c和第四侧边30d，第一侧边30a与第三侧边30c相对设置，第二侧边30b和第四侧边30d的两端分别连接在第一侧边30a与第三侧边30c之间。第一侧边30a与第三侧边30c向四边形的内侧凹陷。
示例性地，第一侧边30a与第一线段p之间的垂直距离在第一线段p的延伸方向上先逐渐增大再逐渐减小，第三侧边30c与第二线段q之间的垂直距离在第二线段q的延伸方向上先逐渐增大再逐渐减小，其中，第一线段p为连接第一侧边30a的两个端点的线段，第二线段q为连接第三侧边30c的两个端点的线段，使得四边形从第一侧边30a和第三侧边30c的两端向中部逐渐变窄。
需要说明的是，本公开实施例中“大约为四边形”至少包括以下两种情况：第一种情况是直接连接四边形的四个角中的相邻两个角，形成四边形的第一侧边、第二侧边、第三侧边和第四侧边；第二种情况是，在四边形的四个角中的至少一个角上还可以设置扩展槽(可以参见下面的实施例)，此时通过角上的扩展槽连接四个角而形成的四边形是大约为四边形，例如如图4所示，这里是以四个角均设置有扩展槽为例，但本公开并不限定于此。只要至少一个子像素区域30在衬底基板10上的正投影整体看起来大约为四边形，可以对其加以细微的图形改变，均属于本公开的保护范围。
此外，本公开实施例中“首尾顺次连接”也并不一定要求该四边形严格的首尾顺次连接，例如，如下面图4所示，若四边形的至少一个角上设置有扩展槽时，四边形的四条侧边并不是严格意义上的首尾顺次连接，中间会间隔有扩展槽，但本公开中图13的情况也属于该四边形的四条侧边首尾顺次连接的一种情况。
进一步地，第二侧边30b和第四侧边30d也可以向四边形的内侧凹陷，且四边形从第二侧边30b和第四侧边30d的两端向中部逐渐变窄。这样可以使所形成的膜层的厚度更加均匀。
示例性地，第一侧边30a上与第一线段p的垂直距离最大的点为第一线段p的中垂线与第一侧边30a的交点，第三侧边30c上与第二线段q的垂直距离最大的点为第二线段q的中垂线与第三侧边30c的交点。这样可以使子像素区域的中部较窄，墨水在干燥时向四周都会有流动，有利于在子像素区域的中部形成面积较大的厚度较均匀的薄膜。
可选地，前述的四边形的四个顶点分别位于矩形100的四个顶点处，这样可以便于子像素的排列，使子像素的排列更加整齐。
进一步地，子像素区域30在衬底基板10上的正投影为轴对称图形，且该正投影的对称轴可以有两条(如图1中的对称轴a和对称轴b)，该两条对称轴可以分别是连接第一侧边30a的两个端点的线段的中垂线和连接第二侧边30b的两个端点的线段的中垂线。这样可以使得子像素的排列更加整齐。
图3是本公开实施例提供的另一种显示基板的局部俯视图，如图3所示，四边形的四条侧边均为曲边，使得子像素区域30在衬底基板10上的正投影呈曲边矩形。其中，曲边矩形是指将矩形的至少一条边替换为曲边后得到的图形，例如图3中所示的子像素区域30在衬底基板10上的正投影所呈的曲边矩形是将矩形的4条边均替换为曲边后得到的图形。在本公开的其他实施例中，子像素区域30也可以只有两条对边为曲边，例如只有第一侧边30a和第三侧边30c为曲边。
本公开实施例通过改变子像素区域的形状，使子像素区域在衬底基板上的正投影大约呈四边形，在四边形中，第一侧边和与之相对的第三侧边向四边形内侧凹陷，这样子像素区域会有一个较窄的区域，可以减少喷墨打印过程中积累在较窄的区域内的墨水量，同时在墨水干燥的过程中，刚开始位于子像素区域的较窄的区域的墨水会较高，由于较窄的区域内的墨水干燥速度比边缘慢，在马拉高尼效应下，较窄的区域的墨水会向靠近第二侧边和第四侧边的两个方向流动，使较窄的区域的墨水量进一步减少，墨水分布更加均匀，从而降低子像素区域中较窄的区域形成的薄膜厚度，使墨水完全干燥后形成的薄膜厚度更均匀，且由于第一侧边和第三侧边均向四边形内侧凹陷，在干燥过程中，墨水会更多的向第一侧边和第三侧边的两端流动，增加了子像素区域的边缘厚度较薄的区域的膜厚，从而使子像素区域内可以形成面积更大的厚度较均匀的薄膜。
在另一些实施例中，第一侧边与第一线段之间的垂直距离在第一线段的延伸方向上先逐渐增大再逐渐减小，第三侧边与第二线段之间的垂直距离在第二线段的延伸方向上先逐渐增大再逐渐减小，可以在干燥过程中，墨水会更多的向第一侧边和第三侧边的两端流动，增加了子像素区域的边缘厚度较薄的区域的膜厚，从而使子像素区域内可以形成面积更大的厚度较均匀的薄膜。
示例性地，第一侧边30a和第三侧边30c的长度大于第二侧边30b和第四侧边30d的长度。子像素区域30的两条较长的侧边可以为曲边，较长的侧边为曲边可以使子像素区域中部的墨水在干燥过程中向相距较远的两条短边流动，以使墨水分布的更加均匀，形成的薄膜厚度更均匀。其中，子像素区域30的较长的侧边(例如图3中所示的第一侧边30a和第三侧边30c)指的是子像素区域30的四个顶点所构成的矩形中，与该矩形的长边共端点的曲边。
在子像素区域30的四个顶点所构成的矩形中，长边与短边的长度之比可以为3∶1～1∶1，在本公开实施例中，长边与短边的长度之比为3∶1。需要说明的是，子像素区域的四个顶点所构成的矩形的邻边的长度之比也可以是1∶1，这样子像素区域30的四个顶点则构成了一个正方形。
如图3所示，第一侧边30a和第三侧边30c可以为圆弧边，圆弧边的圆缺高h为子像素区域30的第二侧边30b或第四侧边30d的长度的1/8～1/12，其中，圆弧边的圆缺高h为圆弧边的半径(如图3中的R)与圆弧边所对的弦的弦心距的(如图3中的H)差，若圆缺高h过小，则墨水在干燥的过程中，向两条短边流动的程度不明显，对薄膜厚度的影响过小，若圆缺高h过大，则会使得子像素区域30的中部过窄，相邻的子像素区域30之间会有较大的不发光区域，从而导致像素的亮度降低。需要说明的是，本公开实施例中，子像素区域30的某条边的长度指的是该条边的两个端点之间的直线距离。
当第二侧边30b和第四侧边30d也为圆弧边时，第二侧边30b和第四侧边30d的圆缺高与第一侧边30a和第三侧边30c的圆缺高h呈比例，且比值与子像素区域30的四个顶点所构成的矩形中短边与长边的长度之比相等。
在本公开的一种实现方式中，像素界定层20的厚度m不超过3μm，在本实施例中为1.5～2μm。若像素界定层20的厚度m过大会增大显示基板的厚度，若像素界定层20的厚度过小，则容易使子像素区域30出射的光线进入到相邻的子像素区域30中，从而对显示效果造成影响。
其中，像素界定层20的厚度m指的是像素界定层20的远离衬底基板10且与衬底基板10平行的表面和衬底基板10的垂直距离。
图4是本公开实施例提供的另一种显示基板的结构示意图，如图4所示，像素界定层20上还可以设置有扩展槽31，扩展槽31位于子像素区域30的至少一个角处，且与子像素区域30连通。通过设置扩展槽31，使得在喷墨打印的过程中有墨水流入到扩展槽31内，在墨水干燥的过程中，位于扩展槽31内的墨水会先干燥，使子像素区域30内的墨水流入到扩展槽31内，这样可以避免在子像素区域30的边缘处形成的薄膜厚度过大，使子像素区域30内的薄膜厚度更加均匀。
图5是本公开实施例提供的一种显示基板的局部放大示意图，如图5所示，扩展槽31的内侧壁在衬底基板10上的正投影可以为优弧311。
进一步地，优弧311所对的圆心角α可以为300°。
可选地，子像素区域30的四个角处均可以设置有扩展槽31，从而使得形成的薄膜厚度更均匀。
在本公开的其他实施例中，也可以只在部分角处设置扩展槽31。
进一步地，优弧311的半径可以为子像素区域30的较短的一条边的长度的1/8～1/12。可以在使薄膜更加均匀的情况下，避免扩展槽31过大导致的子像素间距 增大，子像素排列的密度降低。
图6是本公开实施例提供的另一种显示基板的俯视图，如图6所示，该显示基板还包括设置在衬底基板10和像素界定层20之间的电极40(如图6中虚线所示)，电极40与子像素区域30一一对应设置。图7是图6中的C-C截面图，如图7所示，扩展槽31的槽底设有绝缘层50，使得在垂直于衬底基板10的方向上，扩展槽31的深度小于像素界定层20的厚度，这样墨水滴入到子像素区域30后，位于扩展槽31中的墨水较浅(墨水在扩展槽深度方向上的尺寸)，在干燥过程中，扩展槽31中的墨水干燥的更快，使得不断有墨水从子像素区域30补充到扩展槽31内，从而有利于墨水向扩展槽31中流动，同时由于在制作时，难以确保扩展槽31在衬底基板10上的投影与电极40之间没有重叠，若扩展槽31在衬底基板10上的投影与电极40之间有重叠区域，则墨水在扩展槽31内干燥形成的薄膜有可能会发光，通过设置绝缘层50可以将电极40与在扩展槽31内的有机材料形成的薄膜隔开，从而可以避免扩展槽31内形成的薄膜在电极的作用下发光。
进一步地，像素界定层20的厚度与扩展槽31的深度(如图7中的n)的差不超过2000埃。即绝缘层50的厚度不超过2000埃。示例性地，可以为1000埃～2000埃。若差值过大，则扩展槽31会过浅，使得墨水难以流入扩展槽31内。
可选地，子像素区域30在衬底基板10上的正投影可以位于电极40在衬底基板10上的正投影内，这样可以使得在子像素区域30内打印形成的有机薄膜层都能够发光。
图8是本公开实施例提供的又一种显示基板的结构示意图，如图8所示，该显示基板包括衬底基板和设置于衬底基板上的像素界定层20。参照图8，像素界定层20将衬底基板划分为多个子像素区域30。
如图8所示，至少一个子像素区域30在衬底基板上的正投影大约为矩形(忽略扩展槽31的影响)，矩形包括大致为首尾顺次连接(同样忽略扩展槽31的影响)的第一侧边30a、第二侧边30b、第三侧边30c和第四侧边30d，第一侧边30a与第三侧边30c相对设置。与上述图1-7所示实施例的不同之处在于，第一侧边30a、第二侧边30b、第三侧边30c和第四侧边30d均为连接该矩形相邻两个端点的线段，该矩形的第一侧边30a、第二侧边30b、第三侧边30c和第四侧边30d没有向该矩形的内侧凹陷，即该矩形从第一侧边30a和第三侧边30c的两端向中部没有逐渐变窄，在图8所示实施例中，该矩形从第二侧边30b和第四侧边30d的两端向中部也没有逐渐变窄。
示例性地，像素界定层20上还可以设置有扩展槽31，扩展槽31位于子像素区域30的至少一个角处，且与子像素区域30连通。通过设置扩展槽31，使得在喷墨打印的过程中有墨水流入到扩展槽31内，在墨水干燥的过程中，位于扩展槽31内的墨水 会先干燥，使子像素区域30内的墨水流入到扩展槽31内，这样可以避免在子像素区域30的边缘处形成的薄膜厚度过大，使子像素区域30内的薄膜厚度更加均匀。
可选地，扩展槽31的内侧壁在衬底基板上的正投影可以为优弧。
进一步地，优弧所对的圆心角可以为300°。
可选地，子像素区域30的四个角处均可以设置有扩展槽31，从而使得形成的薄膜厚度更均匀。
在本公开的其他实施例中，也可以只在部分角处设置扩展槽31。
进一步地，优弧的半径可以为子像素区域30的较短的一条边的长度的1/8～1/12。可以在使薄膜更加均匀的情况下，避免扩展槽31过大导致的子像素间距增大，子像素排列的密度降低。
需要说明的是，在其他实施例中，还可以设置至少一个子像素区域30在衬底基板上的正投影大约为四边形，该四边形的四个侧边中的任意一条或者多条侧边向该四边形的内侧凹陷，而其他的侧边为连接相应侧边的两个端点的线段，同时，该四边形的至少一个角处可以设置有扩展槽31。
本公开实施例还提供了一种显示器件，该显示器件包括图1～图8所示的任一种显示基板。该显示器件可以为：电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本公开实施例通过改变子像素区域的形状，使子像素区域在衬底基板上的正投影大约呈四边形，在四边形中，第一侧边和与之相对的第三侧边向四边形内侧凹陷，这样子像素区域会有一个较窄的区域，可以减少喷墨打印过程中积累在较窄的区域内的墨水量，同时在墨水干燥的过程中，刚开始位于子像素区域的较窄的区域的墨水会较高，由于较窄的区域内的墨水干燥速度比边缘慢，在马拉高尼效应下，较窄的区域的墨水会向靠近第二侧边和第四侧边的两个方向流动，使较窄的区域的墨水量进一步减少，墨水分布更加均匀，从而降低子像素区域中较窄的区域形成的薄膜厚度，使墨水完全干燥后形成的薄膜厚度更均匀，且由于第一侧边和第三侧边均向四边形内侧凹陷，在干燥过程中，墨水会更多的向第一侧边和第三侧边的两端流动，增加了子像素区域的边缘厚度较薄的区域的膜厚，从而使子像素区域内可以形成面积更大的厚度较均匀的薄膜。
在另一些实施例中，第一侧边与第一线段之间的垂直距离在第一线段的延伸方向上先逐渐增大再逐渐减小，第三侧边与第二线段之间的垂直距离在第二线段的延伸方向上先逐渐增大再逐渐减小，可以在干燥过程中，墨水会更多的向第一侧边和第三侧边的两端流动，增加了子像素区域的边缘厚度较薄的区域的膜厚，从而使子像素区域 内可以形成面积更大的厚度较均匀的薄膜。
图9是本公开实施例提供的一种显示基板的制造方法的流程图，该方法适用于制造图1～图8所示的任一种显示基板。如图9所示，该制造方法包括：
S11：提供一衬底基板。
S12：在衬底基板上制作像素界定层。
其中，像素界定层将衬底基板划分为多个子像素区域。至少一个子像素区域在衬底基板上的正投影为四边形，四边形包括首尾顺次连接的第一侧边、第二侧边、第三侧边和第四侧边，第一侧边与第三侧边相对设置，第一侧边与第三侧边向四边形的内侧凹陷。
示例性地，第一侧边与第一线段之间的垂直距离在第一线段的延伸方向上先逐渐增大再逐渐减小，第三侧边与第二线段之间的垂直距离在第二线段的延伸方向上先逐渐增大再逐渐减小，其中，第一线段为连接第一侧边的两个端点的线段，第二线段为连接第三侧边的两个端点的线段
示例性地，第一侧边上与第一线段的垂直距离最大的点为第一线段的中垂线与第一侧边的交点，第三侧边上与第二线段的垂直距离最大的点为第二线段的中垂线与第三侧边的交点，使得四边形从第一侧边和第三侧边的两端向中部逐渐变窄。
本公开实施例通过改变子像素区域的形状，使子像素区域在衬底基板上的正投影呈四边形，在四边形中，第一侧边和与之相对的第三侧边向四边形内侧凹陷，这样子像素区域会有一个较窄的区域，可以减少喷墨打印过程中积累在较窄的区域内的墨水量，同时在墨水干燥的过程中，刚开始位于子像素区域的较窄的区域的墨水会较高，由于较窄的区域内的墨水干燥速度比边缘慢，在马拉高尼效应下，较窄的区域的墨水会向靠近第二侧边和第四侧边的两个方向流动，使较窄的区域的墨水量进一步减少，墨水分布更加均匀，从而降低子像素区域中较窄的区域形成的薄膜厚度，使墨水完全干燥后形成的薄膜厚度更均匀，且由于第一侧边和第三侧边均向四边形内侧凹陷，在干燥过程中，墨水会更多的向第一侧边和第三侧边的两端流动，增加了子像素区域的边缘厚度较薄的区域的膜厚，从而使子像素区域内可以形成面积更大的厚度较均匀的薄膜。
在另一些实施例中，第一侧边与第一线段之间的垂直距离在第一线段的延伸方向上先逐渐增大再逐渐减小，第三侧边与第二线段之间的垂直距离在第二线段的延伸方向上先逐渐增大再逐渐减小，可以在干燥过程中，墨水会更多的向第一侧边和第三侧边的两端流动，增加了子像素区域的边缘厚度较薄的区域的膜厚，从而使子像素区域内可以形成面积更大的厚度较均匀的薄膜。
图10是本公开实施例提供的另一种显示基板的制造方法的流程图，该方法适用于制造图6所示的显示基板。下面结合图11～图14对本公开进行详细说明。如图10所示，该制造方法包括：
S21：提供一衬底基板。
可选地，衬底基板可以为透明基板，例如玻璃基板、硅基板和塑料基板等。
步骤S21中可以对衬底基板进行洗净处理。
S22：在衬底基板上制作电极。
如图11所示，衬底基板10上形成有多个电极40。多个电极40可以阵列分布在衬底基板11上。
示例性地，步骤S22可以包括：
在衬底基板10上形成一层电极材料薄膜层。
通过构图工艺形成多个电极40。
示例性地，可以采用磁控溅射或蒸镀的方式在衬底基板10上形成电极材料薄膜层，使电极材料薄膜层覆盖在衬底基板10的表面。可选地，当该电极作为阳极时，电极材料薄膜层可以是ITO/Ag/ITO，当该电极作为阴极时，电极材料薄膜层可以是Mg/Ag。
S23：在衬底基板上制作像素界定层。
如图12所示，衬底基板10上形成有像素界定层20。
示例性地，步骤S23可以包括：
在衬底基板10上形成透明绝缘膜层。
在透明绝缘膜层上形成多个子像素开口201，以制成像素界定层20。
示例性地，可以在衬底基板10上形成一层氮化硅或氧化硅或聚酰亚胺，以形成透明绝缘膜层。可以通过构图工艺在透明绝缘膜层上制作出阵列布置的多个子像素开口201，从而将衬底基板划分为多个子像素区域。
需要说明的是，图11和图12均为显示基板上对应图6中B-B位置的截面图。
如图13所示，子像素区域30在衬底基板上的正投影为曲边矩形，子像素区域30的四条侧边均为曲边，且四条曲边均向曲边矩形内侧凹陷。其中，曲边矩形是指将矩形的至少一条边替换为曲边后得到的图形。在本公开的其他实施例中，子像素区域也可以只有两条对边为曲边。
S24：在像素界定层上形成扩展槽。
如图14所示，在像素界定层20上形成有多个扩展槽31。
其中，扩展槽31位于子像素开口201的至少一个角处，且与子像素开口201连通。
可选地，子像素开口201的四个角处均可以设置有扩展槽31，从而使得喷墨打印 形成的薄膜厚度更均匀。
扩展槽31的具体形状可以参见前述实施例。此处不再详述。
示例性地，扩展槽31可以通过光刻工艺在像素界定层20上形成。
可选地，步骤S23与步骤S24可以同时进行，通过光刻工艺在透明绝缘膜层上同时制作出多个子像素开口201和扩展槽31，减少光刻次数。
示例性地，如图15所示，可以采用半透掩膜进行光刻，使得扩展槽31的槽底留有一层绝缘层50，在垂直于衬底基板10的方向上，扩展槽31的深度小于像素界定层20的厚度。
需要说明的是，图15为制作过程中，显示基板上对应图6中的C-C处的截面图。
图16是本公开实施例提供的另一种显示基板的制造方法的流程图，该方法适用于制造图6所示的显示基板。如图16所示，该制造方法包括：
S31：提供一衬底基板。
该步骤与S21相同，此处不再赘述。
S32：在衬底基板上制作电极。
该步骤与S22相同，此处不再赘述。
S33：在衬底基板上制作像素界定层。
示例性地，如图17所示，S33可以包括以下步骤：
S311：在衬底基板上形成第一透明绝缘膜层。
如图18所示，衬底基板10上形成有第一透明绝缘膜层21。
示例性地，可以在衬底基板上形成一层氮化硅或氧化硅或聚酰亚胺，以形成第一透明绝缘膜层21。
S312：在第一透明绝缘膜层上形成子像素开口和扩展槽开口。
如图19所示，第一透明绝缘膜层21上形成有子像素开口201和扩展槽开口31a。
此时，在垂直于衬底基板10的方向上，扩展槽开口31a的深度与第一透明绝缘膜层21的厚度相同。
可以通过构图工艺在第一透明绝缘膜层21上制作出阵列布置的多个开口，从而形成多个子像素开口201和扩展槽开口31a。
形成有子像素开口201和扩展槽开口31a的第一透明绝缘膜层21将衬底基板10划分为多个子像素区域。
S313：在衬底基板上形成第二透明绝缘膜层。
如图20所示，衬底基板10上形成有第二透明绝缘膜层22。
第二透明绝缘膜层22的材料可以与第一透明绝缘膜层21的材料相同，也可以不同。
S314：去除位于子像素开口内的第二透明绝缘膜层。
如图21所示，由第一透明绝缘膜层21和第二透明绝缘膜层22共同构成了像素界定层20，在像素界定层20上形成了子像素开口201和扩展槽31。由于仅去除了位于子像素开口201内的第二透明绝缘膜层22，扩展槽开口31a内的第二透明绝缘膜层22并没有去除，从而形成了深度小于像素界定层20的厚度的扩展槽31，扩展槽31的槽底留有一层绝缘层50。该绝缘层50可以将电极40与在扩展槽31内的有机材料形成的薄膜隔开，避免扩展槽31内形成的薄膜在电极40的作用下发光。
可以通过构图工艺去除位于子像素区域内的第二透明绝缘膜层。通过步骤S333和步骤S334，在衬底基板上形成了像素界定层，且衬底基板上对应扩展槽的位置也形成有第二透明绝缘膜层，从而形成了深度小于像素界定层的厚度的扩展槽。形成有像素界定层和扩展槽的衬底基板的结构可以参见图7。
需要说明的是，图18～图21为制作过程中，显示基板上对应图6中的C-C处的截面图。
在本公开的另一种实施例中，如图22所示，S33也可以包括以下步骤：
S321：在衬底基板上形成第一透明绝缘膜层。
步骤S321可以与S311相同，此处不再详述。
S322：在第一透明绝缘膜层上形成子像素开口。
如图23所示，在第一透明绝缘膜层21上形成有子像素开口。
可以通过构图工艺在第一透明绝缘膜层21上制作出阵列布置的多个子像素开口201，从而将衬底基板10划分为多个子像素区域。
S323：在衬底基板上形成第二透明绝缘膜层。
如图24所示，在衬底基板10上形成有第二透明绝缘膜层22。
第二透明绝缘膜层22的材料可以与第一透明绝缘膜层21的材料相同，也可以不同。
S324：去除位于子像素开口内的第二透明绝缘膜层，并制作出扩展槽。
如图25所示，由第一透明绝缘膜层21和第二透明绝缘膜层22共同构成了像素界定层20，在像素界定层20上形成了子像素开口201和扩展槽31。
可以通过构图工艺去除位于子像素开口内的第二透明绝缘膜层22，同时在子像素开口201的角处制作出扩展槽31，扩展槽31的深度与第二透明绝缘膜层22的厚度相同。这样在扩展槽31的底部形成有一绝缘层50，该绝缘层50可以将电极40与在扩展槽31内的有机材料形成的薄膜隔开，避免扩展槽31内形成的薄膜在电极40的作用下发光。
需要说明的是，图23～图25为制作过程中，显示基板上对应图6中的C-C处的截面图。
这样使得墨水滴入到子像素区域后，位于扩展槽中的墨水形成的薄膜较薄，扩展槽中的墨水干燥的更快，有利于墨水向扩展槽中流动，同时衬底基板上对应扩展槽的位置形成的第二透明绝缘膜层可以将电极与在扩展槽内的有机材料形成的薄膜隔开，从而可以避免扩展槽内形成的薄膜发光。
以上所述仅为本公开的较佳实施例，并不用以限制本公开，凡在本公开的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (18)

  1. 一种显示基板，所述显示基板包括：
    衬底基板；和
    设置于所述衬底基板上的像素界定层；
    其中，所述像素界定层将所述衬底基板划分为多个子像素区域，至少一个所述子像素区域在所述衬底基板上的正投影大约为四边形，所述四边形包括首尾顺次连接的第一侧边、第二侧边、第三侧边和第四侧边，所述第一侧边与所述第三侧边相对设置，所述第一侧边与所述第三侧边向所述四边形的内侧凹陷。
  2. 根据权利要求1所述的显示基板，其中，所述第一侧边与第一线段之间的垂直距离在所述第一线段的延伸方向上先逐渐增大再逐渐减小，所述第三侧边与第二线段之间的垂直距离在所述第二线段的延伸方向上先逐渐增大再逐渐减小；
    其中，所述第一线段为连接所述第一侧边的两个端点的线段，所述第二线段为连接所述第三侧边的两个端点的线段。
  3. 根据权利要求2所述的显示基板，其中，所述第一侧边上与所述第一线段的垂直距离最大的点为所述第一线段的中垂线与所述第一侧边的交点，所述第三侧边上与所述第二线段的垂直距离最大的点为所述第二线段的中垂线与所述第三侧边的交点。
  4. 根据权利要求1至3任一项所述的显示基板，其中，所述第二侧边和所述第四侧边向所述四边形的内侧凹陷。
  5. 根据权利要求1至4任一项所述的显示基板，其中，所述子像素区域在所述衬底基板上的正投影为曲边矩形。
  6. 根据权利要求1至5任一项所述的显示基板，其中，所述像素界定层上设置有扩展槽，所述扩展槽位于所述子像素区域的至少一个角处，且与所述子像素区域连通。
  7. 根据权利要求6所述的显示基板，其中，所述扩展槽的内侧壁在所述衬底基板上的正投影为优弧。
  8. 根据权利要求7所述的显示基板，其中，所述优弧的半径为所述子像素区域的较短的一条侧边的长度的1/8～1/12。
  9. 根据权利要求6至8任一项所述的显示基板，其中，所述扩展槽的槽底设有绝缘层。
  10. 根据权利要求9所述的显示基板，其中，所述像素界定层的厚度与所述扩展槽的深度的差为1000埃～2000埃。
  11. 根据权利要求1至10任一项所述的显示基板，其中，所述第一侧边和所述第三侧边的长度大于所述第二侧边和所述第四侧边的长度。
  12. 根据权利要求11所述的显示基板，其中，所述第一侧边和所述第三侧边为圆弧边，所述圆弧边的圆缺高为所述第二侧边或所述第四侧边的长度的1/8～1/12，其中，所述圆弧边的圆缺高为所述圆弧边的半径与所述圆弧边所对的弦的弦心距的差。
  13. 根据权利要求1～12任一项所述的显示基板，其中，所述显示基板还包括设置在所述衬底基板和所述像素界定层之间的电极，所述子像素区域在所述衬底基板上的正投影位于所述电极在所述衬底基板上的正投影内。
  14. 一种显示器件，所述显示器件包括如权利要求1～13任一项所述的显示基板。
  15. 一种显示基板的制造方法，所述制造方法包括：
    提供一衬底基板；
    在所述衬底基板上制作像素界定层；
    其中，所述像素界定层将所述衬底基板划分为多个子像素区域，至少一个所述子像素区域在所述衬底基板上的正投影均大约为四边形，所述四边形包括首尾顺次连接的第一侧边、第二侧边、第三侧边和第四侧边，所述第一侧边与所述第三侧边相对设置，所述第一侧边与所述第三侧边向所述四边形的内侧凹陷。
  16. 根据权利要求15所述的制造方法，其中，所述第一侧边与第一线段之间的垂直距离在所述第一线段的延伸方向上先逐渐增大再逐渐减小，所述第三侧边与第二线段之间的垂直距离在所述第二线段的延伸方向上先逐渐增大再逐渐减小，其中，所述第一线段为连接所述第一侧边的两个端点的线段，所述第二线段为连接所述第三侧边的两个端点的线段。
  17. 根据权利要求15或16所述的制造方法，其中，所述在所述衬底基板上制作像素界定层，包括：
    在所述衬底基板上形成透明绝缘膜层；
    在所述透明绝缘膜层上形成子像素开口和扩展槽，所述扩展槽位于所述子像素开口的至少一个角处，且与所述子像素开口连通。
  18. 根据权利要求15或16所述的制造方法，其中，所述在所述衬底基板上制作像素界定层，包括：
    在所述衬底基板上形成第一透明绝缘膜层；
    在所述第一透明绝缘膜层上形成子像素开口；
    在所述第一透明绝缘膜层上形成第二透明绝缘膜层；
    在所述第二透明绝缘膜层上形成所述扩展槽。
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CN110620133B (zh) * 2019-09-25 2022-09-09 京东方科技集团股份有限公司 一种透明显示面板及其制备方法和显示装置

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