WO2019085813A1 - 冷却机柜及冷却系统 - Google Patents

冷却机柜及冷却系统 Download PDF

Info

Publication number
WO2019085813A1
WO2019085813A1 PCT/CN2018/111821 CN2018111821W WO2019085813A1 WO 2019085813 A1 WO2019085813 A1 WO 2019085813A1 CN 2018111821 W CN2018111821 W CN 2018111821W WO 2019085813 A1 WO2019085813 A1 WO 2019085813A1
Authority
WO
WIPO (PCT)
Prior art keywords
flow guiding
cabinet
cooling
disposed
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/111821
Other languages
English (en)
French (fr)
Inventor
钟杨帆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alibaba Group Holding Ltd
Original Assignee
Alibaba Group Holding Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alibaba Group Holding Ltd filed Critical Alibaba Group Holding Ltd
Priority to US16/760,007 priority Critical patent/US11871545B2/en
Priority to EP18873684.7A priority patent/EP3706523B1/en
Priority to JP2020524824A priority patent/JP2021501951A/ja
Publication of WO2019085813A1 publication Critical patent/WO2019085813A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Definitions

  • the present specification relates to the field of heat dissipation equipment, and in particular, to a cooling cabinet and a cooling system.
  • data center servers are usually air-conditioned and air-cooled, which consumes a lot of energy, space and cost, and consumes more and more.
  • the cooling capacity provided by many data centers is now approaching the limit, and this trend of rapid power density growth has an adverse effect. Therefore, the conventional air-conditioning air-cooling method can no longer meet the demand for server cooling in the data center.
  • This specification proposes a cooling cabinet and cooling system to improve the cooling efficiency of the server cooling in the data center.
  • a cooling cabinet for cooling a device to be cooled, the cooling cabinet comprising a cabinet and a first flow guiding assembly and a second flow guiding assembly;
  • the cabinet body can hold a cooling medium for at least partially immersing the device to be cooled
  • the cabinet body is provided with a first diversion inlet for introducing a cooling medium and a first diversion flow for discharging the cooling medium
  • the first flow guiding assembly is disposed in communication with the first flow guiding inlet, the first flow guiding assembly is provided with a second flow guiding outlet for discharging a cooling medium into the cabinet;
  • the second A flow guiding assembly is disposed in communication with the first flow guiding outlet, and the second flow guiding assembly is provided with a second flow guiding inlet for introducing a cooling medium flowing through the device to be cooled.
  • first diversion inlet is located above the first diversion outlet; the first diversion assembly is located at the top of the device to be cooled, and the second diversion assembly is located at the device to be cooled bottom of.
  • first diversion inlet is located below the first diversion outlet; the first diversion assembly is located at a bottom of the device to be cooled, and the second diversion assembly is located at the device to be cooled top of.
  • the first flow guiding component includes a ring pipe portion and a first flow guiding portion disposed in communication with the annular pipe portion, and the first guiding portion is disposed in communication with the first guiding inlet, At least one of the collar portion and the first flow guiding portion is provided with the second flow guiding outlet.
  • the loop tube portion is a rectangular loop tube structure, and the loop tube portion includes two first tube bodies and two second tube bodies that are connected to each other and enclosed, and the first flow guiding portion
  • the first tube body is in communication with each other, and at least one of the first tube body, the second tube body and the first flow guiding portion is provided with the second flow guiding outlet.
  • first flow guiding inlet is two, respectively disposed on two sides of the cabinet; the first guiding portion is two, and the two first tubular bodies are connected in one-to-one correspondence Settings.
  • the two first tubes are integrally formed with the adjacent at least one of the second tubes.
  • the second air guiding outlet is a plurality of, and is evenly disposed on sidewalls of at least one of the first tube body, the second tube body, and the first flow guiding portion.
  • the second flow guiding assembly includes a drain portion and a second flow guiding portion that is disposed in communication with the drain portion, and the second flow guiding portion is disposed in communication with the first flow guiding outlet, The drain portion is provided with the second flow guiding inlet.
  • the pipe portion is a rectangular pipe structure, and the pipe portion includes two third pipes and a plurality of fourth pipes connected between the two third pipes, a fourth pipe body and the two third pipe bodies are connected to each other; the second flow guiding portion is disposed in communication with any of the third pipe bodies, and the fourth pipe body is provided with the second guiding body Inflow.
  • first air guiding outlets are two, respectively disposed on two sides of the cabinet body; the second air guiding portion is two, and the two third tube bodies are connected in one-to-one correspondence Settings.
  • the plurality of fourth tubes comprise two groups arranged in a staggered manner; wherein one of the fourth tubes is integrally formed with one of the third tubes, and the other group is fourth
  • the tubular body is integrally formed with the other of the third tubular bodies.
  • the second flow guiding inlet is plural, and is evenly arranged on the top of the fourth tubular body.
  • a cooling system including a cooling cabinet and a heat exchange device for cooling a device to be cooled, including a cabinet and a first diversion provided in the cabinet a component and a second flow guiding component, the first flow guiding component and the second flow guiding component are respectively located on two sides of the device to be cooled;
  • the cabinet body can hold a cooling medium for at least partially immersing the device to be cooled
  • the cabinet body is provided with a first diversion inlet for introducing a cooling medium and a first diversion flow for discharging the cooling medium
  • the first flow guiding assembly is disposed in communication with the first flow guiding inlet, the first flow guiding assembly is provided with a second flow guiding outlet for discharging a cooling medium into the cabinet;
  • the second a flow guiding assembly is disposed in communication with the first flow guiding outlet, and the second flow guiding assembly is provided with a second guiding inlet for introducing a cooling medium flowing through the device to be cooled;
  • One end of the heat exchange device is disposed in communication with the cabinet, and the other end of the heat exchange device is disposed in communication with an external liquid supply device, and the heat exchange device is configured to drive a cooling medium to circulate in the cabinet and cool The medium is heat exchanged.
  • a cooling cabinet for cooling a device to be cooled, the cooling cabinet comprising a cabinet and a flow guiding assembly disposed in the cabinet, the flow guiding assembly being provided a plurality of diversion ports that are discretely distributed; the cabinet body can hold a cooling medium for at least partially immersing the device to be cooled, the cabinet body is provided with a diversion inlet for introducing a cooling medium and for discharging a cooling medium Diversion outlet;
  • the flow guiding assembly is disposed in communication with the flow guiding inlet, the plurality of air guiding ports are configured to discharge the cooling medium into the cabinet; or the flow guiding component is disposed in communication with the steam guiding outlet, A plurality of air guiding ports are used to introduce a cooling medium flowing through the device to be cooled.
  • the flow guiding assembly includes a loop portion and a first flow guiding portion disposed in communication with the annular tube portion, the first guiding portion is disposed in communication with the guiding inlet, and the annular tube portion and At least one of the first flow guiding portions is provided with the plurality of air guiding ports.
  • the loop tube portion is a rectangular loop tube structure, and the loop tube portion includes two first tube bodies and two second tube bodies that are connected to each other and enclosed, and the first flow guiding portion
  • the first tube body is in communication with each other, and at least two of the first tube body, the second tube body and the first flow guiding portion are provided with the plurality of air guiding ports.
  • the flow guiding assembly includes a drain portion and a second flow guiding portion that is disposed in communication with the drain portion, and the second flow guiding portion is disposed in communication with the flow guiding outlet, and the draining portion is configured There are a plurality of the flow guiding ports.
  • the pipe portion is a rectangular pipe structure, and the pipe portion includes two third pipes and a plurality of fourth pipes connected between the two third pipes, a fourth tube body and the two third tube bodies are connected to each other; the second flow guiding portion is disposed in communication with any of the third tube bodies, and the fourth tube body is provided with the plurality of guiding tubes Stream.
  • a cooling system including a cooling cabinet and a heat exchange device for cooling a device to be cooled, including a cabinet and a flow guiding assembly disposed in the cabinet.
  • the flow guiding assembly is provided with a plurality of flow guiding ports distributed in a discrete manner;
  • the cabinet body can hold a cooling medium for at least partially immersing the device to be cooled, the cabinet body is provided with a first diversion inlet for introducing a cooling medium and a first diversion flow for discharging the cooling medium Export;
  • the flow guiding assembly is disposed in communication with the flow guiding inlet, the plurality of air guiding ports are configured to discharge the cooling medium into the cabinet; or the flow guiding component is disposed in communication with the steam guiding outlet, a plurality of air guiding ports for introducing a cooling medium flowing through the device to be cooled;
  • One end of the heat exchange device is disposed in communication with the cabinet, and the other end of the heat exchange device is disposed in communication with an external liquid supply device, and the heat exchange device is configured to drive a cooling medium to circulate in the cabinet and cool The medium is heat exchanged.
  • the cooling cabinet of the present specification has the first flow guiding component and the second flow guiding component disposed on opposite sides of the device to be cooled, so that the flow field of the cooling medium flowing through the device to be cooled is a straight path.
  • the path through which the entire liquid of the cooling medium flows is the shortest, the resistance is minimized, and the energy consumption required to drive the liquid is correspondingly greatly reduced, thereby achieving the lowest energy consumption effect.
  • a plurality of flow guiding ports are disposed on the flow guiding assembly, and the flow guiding assembly can be connected to the flow guiding inlet of the cabinet to play the role of introducing the cooling medium.
  • the plurality of diversion ports distributed in a plurality of ways can make the cooling medium flow into or out of the cabinet from a plurality of different directions, thereby reducing the temperature difference between the cooling medium, thereby making the flow rate and temperature of the cooling medium more uniform, and the cooling efficiency is further improved. high.
  • the cooling system drives the cooling medium through the heat exchange device to circulate in the cooling cabinet to take away the heat of the device to be cooled, and exchange heat with the external liquid supply device through the heat exchange device, so that the cooling medium reaches the low temperature state again, and circulates into the cooling cabinet. After that, the cooling device can be cooled again and cooled to achieve the purpose of continuously discharging the heat of the device to be cooled.
  • FIG. 1 is a perspective view showing a cooling cabinet of an exemplary embodiment of the present specification
  • FIG. 2 is a perspective view of a cooling cabinet after removing a cover body according to an exemplary embodiment of the present specification
  • FIG. 3 is a perspective view showing a cooling cabinet removing a cover body and a cabinet body according to an exemplary embodiment of the present specification
  • FIG. 4 is a perspective view showing a first flow guiding assembly and a second flow guiding assembly of a cooling cabinet according to an exemplary embodiment of the present specification
  • FIG. 5 is a schematic view showing a flow field of a cooling cabinet according to an exemplary embodiment of the present specification
  • FIG. 6 is a flow chart showing another cooling cabinet of an exemplary embodiment of the present specification.
  • FIG. 7 shows a schematic structural view of a cooling system of an exemplary embodiment of the present specification.
  • first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other.
  • first information may also be referred to as the second information without departing from the scope of the present description.
  • second information may also be referred to as the first information.
  • word "if” as used herein may be interpreted as "when” or “when” or “in response to a determination.”
  • an embodiment of the present specification provides a cooling cabinet 1 using a single-phase immersion liquid cooling technology for cooling a device to be cooled 900.
  • the device to be cooled 900 may be a server of a data center, or may be Other heating equipment that needs to be cooled down.
  • the cooling cabinet 1 includes a cabinet 10 and a first flow guiding assembly 20 and a second flow guiding assembly 30.
  • the cabinet 10 can hold a non-conductive cooling medium for at least partially immersing the device to be cooled 900, the cabinet 10 is provided with a first diversion inlet 101 for introducing a cooling medium and for discharging cooling The first flow outlet 102 of the medium.
  • the first flow guiding assembly 20 is disposed in communication with the first guiding inlet 101, and the first guiding component 20 is provided with a second guiding outlet 200 for discharging the cooling medium into the cabinet 10. After the cooling medium flows through the device to be cooled 900, the cooling device 900 can be cooled and cooled.
  • the second flow guiding assembly 30 is disposed in communication with the first air guiding outlet 102, and the second air guiding assembly 30 is provided with a second air guiding inlet 300 for introducing a cooling medium flowing through the device to be cooled 900.
  • the first flow guiding component 20 and the second flow guiding component 30 are both disposed in the cabinet 10, and the first guiding component 20 and the second guiding component 30 are respectively located in the cooling to be cooled.
  • the first flow guiding assembly 20 and the second flow guiding assembly 30 are respectively located on two sides of the device to be cooled in the vertical direction, so that the flow field of the cooling medium is vertical Straight-line straight path avoids additional energy consumption due to gravity when moving in the lateral direction.
  • the cooling medium may completely immerse the device to be cooled 900, or may be partially immersed in the device to be cooled 900, and may be set according to actual needs.
  • the cooling medium can be a gaseous medium, a liquid medium or a solid-liquid mixed medium, and can also be set according to actual needs.
  • the cooling medium is completely immersed in the device to be cooled 900, and the cooling medium uses a liquid 3M electron fluorinating liquid.
  • the cooling medium is discharged into the cabinet 10 through the first flow guiding assembly 20, and the cooling medium flowing through the device to be cooled 900 is discharged out of the cabinet 10 through the second flow guiding assembly 30.
  • the first flow guiding component 20 may be connected to the first air guiding outlet 102
  • the second air guiding component 30 may be connected to the first air guiding inlet 101.
  • the arrangement corresponds to discharging the cooling medium into the cabinet 10 through the second flow guiding assembly 30, and the cooling medium flowing through the device to be cooled 900 is discharged out of the cabinet 10 through the first flow guiding assembly 20.
  • the cooling cabinet 1 of the present specification after the cooling medium enters the cabinet 10 from the first diversion inlet 101 of the cabinet 10, is discharged to the to-be-cooled through the second diversion outlet 200 of the first flow guiding assembly 20.
  • the device 900 the cooling medium flowing through the device to be cooled 900 takes the heat of the device to be cooled 900 and then enters the second flow guiding assembly 30 through the second guiding inlet 300 of the second guiding assembly 30, and then from the cabinet 10
  • the first air outlet outlet 102 exits the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 900.
  • the flow path of the cooling medium flowing through the device to be cooled 900 is a straight path, so that the entire liquid of the cooling medium flows through the path.
  • the shortest, the least resistance, the energy consumption required to drive the liquid is correspondingly reduced, thus achieving the lowest energy consumption.
  • the cooling medium adopts a straight flow path, and the cold and hot fluids are completely isolated, which can avoid mixing of cold and hot fluids, thereby achieving an optimal cooling effect.
  • the top of the cabinet 10 is removably provided with a cover 100 by fasteners.
  • the fastener is opened to open the cover 100, and the device to be cooled 900 can be placed in the cabinet 10.
  • the cover 100 can be closed to function as a sealed cabinet 10.
  • the first diversion inlet 101 is located above the first diversion outlet 102.
  • the first flow guiding component 20 is located at the top of the device to be cooled 900, and the second flow guiding component 30 is located at the bottom of the device to be cooled 900.
  • the first diversion inlet 101 may be located below the first diversion outlet 102.
  • the first flow guiding assembly 20 is located at the bottom of the device to be cooled 900, and the second flow guiding assembly 30 is located at the top of the device to be cooled 900.
  • the flow field of the cooling medium flowing through the device to be cooled 900 can be a straight path directly from top to bottom or from bottom to top, so that the entire liquid flow path of the cooling medium is the shortest and the resistance is minimized.
  • the first flow guiding component 20 includes a loop portion 210 and a first flow guiding portion 220 disposed in communication with the loop portion 210, the first The flow guiding portion 220 is provided in communication with the first flow guiding inlet 101, and at least one of the annular pipe portion 210 and the first flow guiding portion 220 is provided with the second flow guiding outlet 200.
  • the annular tube portion 210 and the first flow guiding portion 220 are both provided with the second flow guiding outlet 200.
  • the cooling medium After the cooling medium enters the first flow guiding assembly 20 from the first air guiding inlet 101 of the cabinet 10, the cooling medium is discharged into the cabinet 10 through the second air guiding outlet 200 provided in the annular tube portion 210 and the first guiding portion 220. It flows through the device to be cooled 900 to cool it down.
  • the loop structure of the loop portion 210 may correspond to the cross-sectional structure of the device to be cooled 900, so that the cooling medium flowing out of the first flow guiding assembly 20 can better fit around the device to be cooled 900. Flow is carried out to achieve higher cooling efficiency.
  • the cross-sectional structure of the device to be cooled 900 is rectangular, and the annular tube portion 210 is a rectangular loop structure corresponding thereto.
  • the cross-sectional structure of the device to be cooled 900 may be other shapes, and the loop structure of the ring portion 210 may correspond thereto.
  • the cross-sectional structure of the device to be cooled 900 is rectangular, and the annular tube portion 210 is a rectangular loop structure corresponding thereto.
  • the ring pipe portion 210 includes two first pipe bodies 211 and two second pipe bodies 212 that are connected to each other and are connected to each other.
  • the first flow guiding portion 220 is connected to any of the first pipe bodies 211.
  • the second air guiding outlet 200 is disposed on a side wall of at least one of the first pipe body 211, the second pipe body 212, and the first flow guiding portion 220.
  • the second inner wall 211, the second tube 212, and the inner side wall of the first flow guiding portion 220 are all provided with the second air guiding outlet 200.
  • the second air guiding outlet 200 is disposed through the first tube body 211, the second tube body 212, and the first guiding portion 220. It is discharged into the cabinet 10 and flows through the device to be cooled 900 to cool it down.
  • the first guiding inlets 101 are two, which are respectively disposed on two sides of the cabinet 10.
  • the first flow guiding portions 220 are two, and are disposed in communication with the two first tubular bodies 211 in one-to-one correspondence. In this way, the circulation speed of the cooling medium can be increased, thereby improving the cooling efficiency of the device to be cooled 900.
  • the length of the first pipe body 211 is smaller than the length of the second pipe body 212, and the first pipe body 211 is sleeved with a reinforcing ring 213, and the second pipe body
  • the spacer sleeve 212 is provided with a plurality of reinforcing rings 213, which can enhance the structural strength of the first flow guiding assembly 20.
  • the two first tubes 211 are integrally formed with the adjacent at least one of the second tubes 212. That is, the two first tubes 211 can be integrally formed with the two second tubes 212 in one-to-one correspondence, or the two first tubes 211 and the two second tubes 212 are integrally formed, which can be further enhanced.
  • the structural strength of the first flow guiding assembly 20 It should be noted that the plurality described herein refers to two or more.
  • the second flow guiding component 30 includes a tube portion 310 and a second guiding portion 320 disposed in communication with the tube portion 310.
  • the second guiding portion 320 is The first air guiding outlets 102 are connected to each other, and the tube discharging portion 310 is provided with the second air guiding inlets 300.
  • the cooling medium flowing through the device to be cooled 900 takes the heat of the device to be cooled 900 and then enters the second flow guiding assembly 30 through the second guiding inlet 300 provided in the tube portion 310, and then passes through the first guide of the cabinet 10.
  • the outflow port 102 discharges the cabinet 10 to achieve the purpose of discharging the heat of the device to be cooled 900.
  • the pipe structure of the pipe portion 310 may correspond to the cross-sectional structure of the device to be cooled 900, so that the cooling medium flowing through the device to be cooled 900 can flow into the second flow guiding component as much as possible. After 30, it is discharged from the first air outlet outlet 102 of the cabinet 10, thereby increasing the circulation speed of the cooling medium.
  • the cross-sectional structure of the device to be cooled 900 is rectangular, and the pipe structure of the pipe portion 310 is a rectangular pipe structure corresponding thereto.
  • the cross-sectional structure of the device to be cooled 900 may be other shapes, and the pipe structure of the pipe portion 310 may correspond thereto.
  • the cross-sectional structure of the device to be cooled 900 is rectangular, and the tube portion 310 is a rectangular tube structure corresponding thereto.
  • the tube portion 310 includes two third tubes 311 and a plurality of fourth tubes 312 connected between the two third tubes 311, and a plurality of fourth tubes 312 and the two tubes
  • the three tubes 311 are connected to each other.
  • the second flow guiding portion 320 is disposed in communication with any of the third tubular bodies 311 , and the second guiding inlet 300 is disposed at a top of the fourth tubular body 312 .
  • the cooling medium flowing through the device to be cooled 900 removes the heat of the device to be cooled 900 and then enters the second flow guiding assembly 30 through the second flow guiding inlet 300 provided in the fourth pipe body 312, and then passes through the first of the cabinet 10
  • the flow guiding outlet 102 discharges the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 900.
  • the first air outlets 102 are two, which are respectively disposed on two sides of the cabinet 10.
  • the second flow guiding portions 320 are two, and are disposed in communication with the two third tubular bodies 311 in one-to-one correspondence. In this way, the circulation speed of the cooling medium can be increased, thereby improving the cooling efficiency of the device to be cooled 900.
  • the length of the third pipe body 311 is smaller than the length of the fourth pipe body 312, and the third pipe body 311 is sleeved with a reinforcing ring 313, which can enhance the second guiding flow.
  • the plurality of fourth tubes 312 comprise two groups arranged in a staggered relationship with each other.
  • One set of the fourth tube body 312 is integrally formed with one of the third tube bodies 311, and the other group of the fourth tube body 312 is integrally formed with the other third tube body 311, that is, equivalent to a plurality of fourth tubes.
  • the body 312 and the two third tubes 311 form an integral structure of two staples, which can further enhance the structural strength of the second flow guiding assembly 30.
  • the second air outlets 200 are plural, and the plurality of second air outlets 200 are evenly disposed on the first body 211 and the second body 212 of the first flow guiding assembly 200. And an inner sidewall of at least one of the first flow guiding portions 220.
  • the inner walls of the first tube body 211, the second tube body 212 and the first flow guiding portion 220 of the first flow guiding assembly 200 are each provided with a plurality of second guiding tubes uniformly arranged. Exit 200.
  • the plurality of second flow guiding inlets 300 are plural, and the plurality of second flow guiding inlets 300 are evenly disposed on the top of the fourth tubular body 312 of the second flow guiding assembly 300. In this way, the flow distribution of the cooling medium flowing through the device to be cooled 900 can be made more uniform, which is advantageous for improving the cooling efficiency.
  • the first air guiding inlet 101 is located above the first air guiding outlet 102, the first air guiding component 20 is located at the top of the device to be cooled 900, and the second air guiding component 30 is located at the device to be cooled.
  • the bottom of the 900 is taken as an example to explain the working principle of the cooling cabinet 1 of the present specification.
  • a plurality of plug-in assemblies 190 for installing the device to be cooled 900 are disposed in the cooling cabinet 1 of the present specification.
  • the devices to be cooled 900 may be in a sheet-like structure and sequentially inserted into the plug-in assemblies 190.
  • the cooling medium 80 After entering the first flow guiding assembly 20 from the first guiding inlet 101 of the cabinet 10, the cooling medium 80 is discharged into the cabinet 10 through the second guiding outlet 200 of the first guiding assembly 20, and then flows downward through the device to be cooled. 900, the cooling medium 80 flowing through the device to be cooled 900 takes the heat of the device to be cooled 900 and then enters the second flow guiding assembly 30 through the second guiding inlet 300 of the second guiding assembly 30, and then from the cabinet 10 The first air outlet outlet 102 exits the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 900.
  • the dotted arrows in the figure indicate the flow direction of the cooling medium in the state of the hot liquid fluid
  • the solid arrows indicate the flow direction of the cooling medium in the state of the cold liquid fluid.
  • the first flow guiding inlet 101 is located below the first air guiding outlet 102
  • the first flow guiding assembly 20 is located at the bottom of the device to be cooled 900
  • the second flow guiding assembly 30 is located at the top of the device 900 to be cooled.
  • a plurality of plug-in assemblies 190 for installing the device to be cooled 900 are disposed in the cooling cabinet 1 of the present specification.
  • the devices to be cooled 900 may be in a sheet-like structure and sequentially inserted into the plug-in assemblies 190.
  • the cooling medium 80 After entering the first flow guiding assembly 20 from the first guiding inlet 101 of the cabinet 10, the cooling medium 80 is discharged into the cabinet 10 through the second guiding outlet 200 of the first guiding assembly 20, and then flows upward through the device to be cooled. 900, the cooling medium 80 flowing through the device to be cooled 900 takes the heat of the device to be cooled 900 and then enters the second flow guiding assembly 30 through the second guiding inlet 300 of the second guiding assembly 30, and then from the cabinet 10 The first air outlet outlet 102 exits the cabinet 10 to achieve the purpose of discharging heat from the device to be cooled 900.
  • the dotted arrows in the figure indicate the flow direction of the cooling medium in the state of the hot liquid fluid
  • the solid arrows indicate the flow direction of the cooling medium in the state of the cold liquid fluid.
  • the embodiment of the present specification further provides a cooling cabinet for cooling a device to be cooled, the cooling cabinet comprising a cabinet and a flow guiding component disposed in the cabinet, the flow guiding component being provided with a plurality of discrete distributions Diversion port.
  • the cabinet may contain a cooling medium for at least partially immersing the device to be cooled, the cabinet being provided with a first diversion inlet for introducing a cooling medium and a first diversion outlet for discharging the cooling medium.
  • the flow guiding assembly is disposed in communication with the flow guiding inlet, the plurality of air guiding ports are configured to discharge the cooling medium into the cabinet body, or the flow guiding component is disposed in communication with the steam guiding outlet, A plurality of air guiding ports are used to introduce a cooling medium flowing through the device to be cooled.
  • the cooling cabinet of the present invention has a plurality of diversion ports arranged in a discrete manner on the diversion assembly, and the diversion assembly can be connected with the diversion inlet of the cabinet to function as a cooling medium. .
  • the flow guiding assembly can also be arranged in communication with the flow guiding outlet of the cabinet to discharge the cooling medium.
  • a plurality of diversion ports that are discretely distributed can cause the cooling medium to flow into or out of the cabinet from a plurality of different directions, thereby reducing the temperature difference between the cooling medium and thereby causing the flow rate of the cooling medium. More uniform temperature and higher cooling efficiency.
  • the function is equivalent to the first flow guiding component described in the first embodiment, and the function of the air guiding port is equivalent to the above implementation.
  • the second flow guiding outlet described in Example 1 in this case, the structure of the flow guiding assembly can be referred to the description of the first flow guiding assembly described above in Embodiment 1.
  • the function is equivalent to the second air guiding component described in the first embodiment, and the function of the air guiding port is equivalent to that described in the first embodiment.
  • the second flow guiding inlet in this case, the structure of the flow guiding assembly can be referred to the description of the second flow guiding assembly described above in the first embodiment.
  • the embodiment of the present specification further provides a cooling system comprising the cooling cabinet as described in Embodiment 1 or Embodiment 2 and a heat exchange device connected to the cooling cabinet. It should be noted that the descriptions regarding the cooling cabinet in the above-described Embodiments 1 and 2 are also applicable to the cooling system of the present specification.
  • the cooling system of the present specification will be described below by taking the cooling cabinet described in Embodiment 1 as an example.
  • the cooling system 2 of the present specification includes a cooling cabinet 1 as described in Embodiment 1 and a heat exchange device 3 connected to the cooling cabinet 1, and one end of the heat exchange device 3 and the cooling
  • the cabinets 10 of the cabinet 1 are connected to each other, and the other end of the heat exchange device 3 is disposed in communication with an external liquid supply device for driving the cooling medium to circulate and cool in the cabinet 10 of the cooling cabinet 1.
  • the medium is heat exchanged.
  • the cooling system 2 of the present specification drives the cooling medium to circulate in the cooling cabinet 1 through the heat exchange device 3 to take away the heat of the device to be cooled 900, and exchanges with the external liquid supply device through the heat exchange device 3.
  • the heat causes the cooling medium to reach a low temperature state again, and after cooling into the cooling cabinet 1, the cooling device 900 can be cooled and cooled again, thereby achieving the purpose of continuously discharging the heat of the device to be cooled 900.
  • the heat exchange device 3 comprises a heat exchanger 40 and a pump 50 connected to the cooling cabinet 1 via a first circulation loop and to an external liquid supply device via a second circulation loop.
  • the first circulation loop includes a first conduit 510 and a second conduit 520
  • the second circulation loop includes a third conduit 530 and a fourth conduit 540.
  • the first pipeline 510 is disposed in communication with the first airflow inlet 101 of the cooling cabinet 1
  • the second pipeline 520 is disposed in communication with the first air outlet outlet 102 of the cooling cabinet 1
  • the 540 is connected to the external liquid supply device.
  • the pump 50 drives the cooling medium through the first circulation circuit to circulate in the cooling cabinet 1.
  • the cooling medium circulates and flows in the cooling cabinet 1 to remove the heat of the device to be cooled 900 and enters and exchanges.
  • the external liquid supply device can circulate and supply cooling water in the second circulation circuit, and the cooling medium with heat of the device to be cooled 900 can exchange heat with the cooling water provided by the external liquid supply device in the heat exchanger 40, and the cooling medium is The heat is discharged to bring the cooling medium to a low temperature state.
  • the cooling device 900 can be cooled and cooled again, thereby achieving the purpose of continuously discharging the heat of the device to be cooled 900.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本说明书提供一种冷却机柜及冷却系统，冷却机柜用于冷却待冷却装置，包括柜体以及第一导流组件和第二导流组件；其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；所述第一导流组件与所述第一导流入口连通设置，所述第一导流组件设有用于将冷却介质排至所述柜体内的第二导流出口；所述第二导流组件与所述第一导流出口连通设置，所述第二导流组件设有用于导入流经所述待冷却装置的冷却介质的第二导流入口。

Description

冷却机柜及冷却系统
本申请要求2017年11月03日递交的申请号为201711073039.6、发明名称为“冷却机柜及冷却系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本说明书涉及散热设备技术领域，尤其涉及一种冷却机柜及冷却系统。
背景技术
云计算技术(也即大规模分布式系统技术)的高速发展，对服务器计算性能的要求越来越高。服务器性能提升的同时，功耗呈现急速上升之势，机柜功耗成倍数上升，数据显示，近十年来数据中心机柜的功率密度提高了近15倍。过去一个机柜的功耗一般为1.5kW～2kW，现在个别机柜却出现局部高达20kW～30kW的情况。
目前，数据中心的服务器通常采用空调风冷的方式，正在消耗大量的能源、空间和成本，而且消耗量日益膨胀。然而，随着功率密度的稳定攀升，目前许多数据中心提供的冷却能力正趋向极限，功率密度快速增长的这种趋势会产生不利影响。因此，常规的空调风冷的方式已经不能满足对数据中心的服务器降温的需求。
发明内容
本说明书提出一种冷却机柜及冷却系统，以提高对数据中心的服务器降温的冷却效率。
根据本说明书实施例的第一方面，提供一种冷却机柜，用于冷却待冷却装置，所述冷却机柜包括柜体以及第一导流组件和第二导流组件；
其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；所述第一导流组件与所述第一导流入口连通设置，所述第一导流组件设有用于将冷却介质排至所述柜体内的第二导流出口；所述第二导流组件与所述第一导流出口连通设置，所述第二导流组件设有用于导入流经所述待冷却装置的冷却介质的第二导流入口。
进一步地，所述第一导流入口位于所述第一导流出口的上方；所述第一导流组件位于所述待冷却装置的顶部，所述第二导流组件位于所述待冷却装置的底部。
进一步地，所述第一导流入口位于所述第一导流出口的下方；所述第一导流组件位 于所述待冷却装置的底部，所述第二导流组件位于所述待冷却装置的顶部。
进一步地，所述第一导流组件包括环管部和与所述环管部连通设置的第一导流部，所述第一导流部与所述第一导流入口连通设置，所述环管部和所述第一导流部中的至少一者设有所述第二导流出口。
进一步地，所述环管部为矩形环管结构，所述环管部包括相互连通并围合连接的两个第一管体和两个第二管体，所述第一导流部与任一所述第一管体连通设置，所述第一管体、所述第二管体以及所述第一导流部中的至少一者设有所述第二导流出口。
进一步地，所述第一导流入口为两个，分别设于所述柜体的两侧；所述第一导流部为两个，与所述两个第一管体一一对应地连通设置。
进一步地，所述两个第一管体均与邻接的至少一个所述第二管体为一体成型设置。
进一步地，所述第二导流出口为多个，均匀布设于所述第一管体、所述第二管体以及所述第一导流部中的至少一者的侧壁。
进一步地，所述第二导流组件包括排管部和与所述排管部连通设置的第二导流部，所述第二导流部与所述第一导流出口连通设置，所述排管部设有所述第二导流入口。
进一步地，所述排管部为矩形排管结构，所述排管部包括两个第三管体和连接于所述两个第三管体之间的多个第四管体，所述多个第四管体与所述两个第三管体均连通设置；所述第二导流部与任一所述第三管体连通设置，所述第四管体设有所述第二导流入口。
进一步地，所述第一导流出口为两个，分别设于所述柜体的两侧；所述第二导流部为两个，与所述两个第三管体一一对应地连通设置。
进一步地，所述多个第四管体包括两组，相互呈交错排列；其中一组所述第四管体与其中一个所述第三管体为一体成型设置，另一组所述第四管体与另一个所述第三管体为一体成型设置。
进一步地，所述第二导流入口为多个，均匀布设于所述第四管体的顶部。
根据本说明书实施例的第二方面，提供一种冷却系统，包括冷却机柜和换热装置，所述冷却机柜用于冷却待冷却装置，包括柜体和设置于所述柜体内的第一导流组件以及第二导流组件，所述第一导流组件和所述第二导流组件分别位于所述待冷却装置的两侧；
其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；所述第一导流组件与所述第一导流入口连通设置，所述第一导流组件设有用于将冷却介质排至所 述柜体内的第二导流出口；所述第二导流组件与所述第一导流出口连通设置，所述第二导流组件设有用于导入流经所述待冷却装置的冷却介质的第二导流入口；
所述换热装置的一端与所述柜体连通设置，所述换热装置的另一端与外部供液设备连通设置，所述换热装置用于驱动冷却介质在所述柜体内循环并对冷却介质进行热交换。
根据本说明书实施例的第三方面，提供一种冷却机柜，用于冷却待冷却装置，所述冷却机柜包括柜体和设置于所述柜体内的导流组件，所述导流组件设有呈离散分布的多个导流口；所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的导流入口和用于排出冷却介质的导流出口；
所述导流组件与所述导流入口连通设置，所述多个导流口用于将冷却介质排至所述柜体内；或所述导流组件与所述导流出口连通设置，所述多个导流口用于导入流经所述待冷却装置的冷却介质。
进一步地，所述导流组件包括环管部和与所述环管部连通设置的第一导流部，所述第一导流部与所述导流入口连通设置，所述环管部和所述第一导流部中的至少一者设有所述多个导流口。
进一步地，所述环管部为矩形环管结构，所述环管部包括相互连通并围合连接的两个第一管体和两个第二管体，所述第一导流部与任一所述第一管体连通设置，所述第一管体、所述第二管体以及所述第一导流部中的至少两者设有所述多个导流口。
进一步地，所述导流组件包括排管部和与所述排管部连通设置的第二导流部，所述第二导流部与所述导流出口连通设置，所述排管部设有所述多个导流口。
进一步地，所述排管部为矩形排管结构，所述排管部包括两个第三管体和连接于所述两个第三管体之间的多个第四管体，所述多个第四管体与所述两个第三管体均连通设置；所述第二导流部与任一所述第三管体连通设置，所述第四管体设有所述多个导流口。
根据本说明书实施例的第四方面，提供一种冷却系统，包括冷却机柜和换热装置，所述冷却机柜用于冷却待冷却装置，包括柜体和设置于所述柜体内的导流组件，所述导流组件设有呈离散分布的多个导流口；
其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；
所述导流组件与所述导流入口连通设置，所述多个导流口用于将冷却介质排至所述柜体内；或所述导流组件与所述导流出口连通设置，所述多个导流口用于导入流经所述待冷却装置的冷却介质；
所述换热装置的一端与所述柜体连通设置，所述换热装置的另一端与外部供液设备连通设置，所述换热装置用于驱动冷却介质在所述柜体内循环并对冷却介质进行热交换。
由以上技术方案可见，本说明书的冷却机柜，通过将第一导流组件和第二导流组件设在待冷却装置的相对两侧，使冷却介质流经待冷却装置的流场为直线路径，使得冷却介质的整个液体流过的路径最短，受到的阻力最小，驱动液体所需要的能耗也相应地大幅降低，进而达到能耗最低的效果。在导流组件上设置呈离散分布的多个导流口，导流组件既可以与柜体的导流入口连通设置，起到导入冷却介质的作用。呈离散分布的多个导流口均可以使冷却介质从多个不同的方向流入或流出柜体，减小冷却介质之间的温度差，进而使冷却介质的流量和温度更加均匀，冷却效率更高。冷却系统通过换热装置驱动冷却介质在冷却机柜内循环流动以带走待冷却装置的热量，并通过换热装置与外部供液设备交换热量，使冷却介质重新达到低温的状态，循环进入冷却机柜后能够再次对待冷却装置进行冷却降温，从而达到循环持续地将待冷却装置的热量排出的目的。
附图说明
图1示出了本说明书一示例性实施例的一种冷却机柜的立体示意图；
图2示出了本说明书一示例性实施例的一种冷却机柜去除盖体后的立体示意图；
图3示出了本说明书一示例性实施例的一种冷却机柜去除盖体和柜体后的立体示意图；
图4示出了本说明书一示例性实施例的一种冷却机柜的第一导流组件和第二导流组件的立体示意图；
图5示出了本说明书一示例性实施例的一种冷却机柜的流场示意图；
图6示出了本说明书一示例性实施例的另一种冷却机柜的流场示意图；
图7示出了本说明书一示例性实施例的一种冷却系统的结构示意图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本说明书相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本说明书的一些方面相一致的装置和方法的例子。
在本说明书使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本说明书。 在本说明书和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。还应当理解，本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。
应当理解，尽管在本说明书可能采用术语第一、第二、第三等来描述各种信息，但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如，在不脱离本说明书范围的情况下，第一信息也可以被称为第二信息，类似地，第二信息也可以被称为第一信息。取决于语境，如在此所使用的词语“如果”可以被解释成为“在……时”或“当……时”或“响应于确定”。
本说明书提出一种冷却机柜及冷却系统，以提高对数据中心的服务器降温的冷却效率。下面结合附图，对本说明书的冷却机柜及冷却系统进行详细说明。在不冲突的情况下，下述的实施例及实施方式中的特征可以相互组合。
实施例1：
参见图1至图4所示，本说明书实施例提供一种采用单相浸没液冷技术的冷却机柜1，用于冷却待冷却装置900，待冷却装置900可以是数据中心的服务器，或者可以是其他需冷却降温的发热设备。所述冷却机柜1包括柜体10以及第一导流组件20和第二导流组件30。所述柜体10内可盛放用于至少部分浸没所述待冷却装置900的不导电的冷却介质，所述柜体10设有用于导入冷却介质的第一导流入口101和用于排出冷却介质的第一导流出口102。所述第一导流组件20与所述第一导流入口101连通设置，所述第一导流组件20设有用于将冷却介质排至所述柜体10内的第二导流出口200，冷却介质流经待冷却装置900后可以对待冷却装置900进行冷却降温。所述第二导流组件30与所述第一导流出口102连通设置，所述第二导流组件30设有用于导入流经所述待冷却装置900的冷却介质的第二导流入口300。可选地，第一导流组件20和第二导流组件30均设置于所述柜体10内，所述第一导流组件20和所述第二导流组件30分别位于所述待冷却装置的两侧。在图中所示的例子中，所述第一导流组件20和所述第二导流组件30分别位于所述待冷却装置沿竖直方向的两侧，使冷却介质的流场为沿竖直方向的直线路径，可以避免沿横向移动时由于重力而造成额外的能量消耗。需要说明的是，冷却介质可以完全浸没待冷却装置900，也可以部分浸没待冷却装置900，可以根据实际需要设置。冷却介质可以是气态介质、液态介质或是固液混合态的介质，同样可以根据实际需要设置。在本实施例中，冷却介质完全浸没待冷却装置900，冷却介质采用液态的3M的电子氟化液。通过第一导流组件20将冷却介质排至柜体10内，通过第二导流组件30将流经待冷 却装置900的冷却介质排出柜体10。当然，在其他实施例中，也可以将所述第一导流组件20与所述第一导流出口102连通设置，将所述第二导流组件30与所述第一导流入口101连通设置，即相当于通过第二导流组件30将冷却介质排至柜体10内，通过第一导流组件20将流经待冷却装置900的冷却介质排出柜体10。
由以上技术方案可见，本说明书的冷却机柜1，冷却介质从柜体10的第一导流入口101进入柜体10后，经第一导流组件20的第二导流出口200排出至待冷却装置900，流经待冷却装置900的冷却介质将待冷却装置900的热量带走后经第二导流组件30的第二导流入口300进入第二导流组件30，再从柜体10的第一导流出口102排出柜体10，从而达到将待冷却装置900的热量排出的目的。通过将第一导流组件20和第二导流组件30设在待冷却装置900的相对两侧，冷却介质流经待冷却装置900的流场为直线路径，使得冷却介质的整个液体流过路径最短，受到的阻力最小，驱动液体所需要的能耗也相应地大幅降低，进而达到能耗最低的效果。另外，冷却介质采用直线形式的流经路径，冷、热流体完全隔离，可以避免冷、热流体相互混合，进而达到最优的制冷效果。
参见图1所示，在一可选的实施方式中，柜体10的顶部通过紧固件可拆卸地设有盖体100。当需要将待冷却装置900放入柜体10时，拆除紧固件打开盖体100，即可将待冷却装置900放入柜体10。待冷却装置900放置完成后，将盖体100合上可以起到密封柜体10的作用。
参见图2和图3所示，在一可选的实施方式中，第一导流入口101位于第一导流出口102的上方。相应地，所述第一导流组件20位于所述待冷却装置900的顶部，所述第二导流组件30位于所述待冷却装置900的底部。当然，在另一可选的实施方式中，第一导流入口101可以位于第一导流出口102的下方。相应地，第一导流组件20位于所述待冷却装置900的底部，第二导流组件30位于所述待冷却装置900的顶部。可以使冷却介质流经待冷却装置900的流场为直接从上往下或是从下往上的直线路径，使得冷却介质的整个液体流过路径最短，受到的阻力最小。
参见图4所示，在一可选的实施方式中，所述第一导流组件20包括环管部210和与所述环管部210连通设置的第一导流部220，所述第一导流部220与所述第一导流入口101连通设置，所述环管部210和所述第一导流部220中的至少一者设有所述第二导流出口200。在本实施例中，所述环管部210和所述第一导流部220均设有所述第二导流出口200。冷却介质从柜体10的第一导流入口101进入第一导流组件20后，经设于环管部210和第一导流部220的第二导流出口200排出至柜体10内，流经待冷却装置900 为其冷却降温。
进一步地，所述环管部210的环路结构可以与所述待冷却装置900的截面结构相对应，可以使第一导流组件20流出的冷却介质更好的贴合待冷却装置900的周围进行流动，进而达到更高的冷却效率。例如，所述待冷却装置900的截面结构为矩形，所述环管部210为与之对应的矩形环管结构。当然，所述待冷却装置900的截面结构也可以是其他形状，所述环管部210的环路结构与之对应即可。
在一可选的实施方式中，所述待冷却装置900的截面结构为矩形，所述环管部210为与之对应的矩形环管结构。所述环管部210包括相互连通并围合连接的两个第一管体211和两个第二管体212，所述第一导流部220与任一所述第一管体211连通设置，所述第一管体211、所述第二管体212以及所述第一导流部220中的至少一者的侧壁设有所述第二导流出口200。在本实施例中，所述第一管体211、所述第二管体212以及所述第一导流部220的内侧壁均设有所述第二导流出口200。冷却介质从柜体10的第一导流入口101进入第一导流组件20后，经设于第一管体211、第二管体212以及第一导流部220的第二导流出口200排出至柜体10内，流经待冷却装置900为其冷却降温。
在一可选的实施方式中，所述第一导流入口101为两个，分别设于所述柜体10的两侧。相应地，所述第一导流部220为两个，与所述两个第一管体211一一对应地连通设置。这样，可以提高冷却介质的循环速度，进而提高对待冷却装置900的冷却效率。
在一可选的实施方式中，所述第一管体211的长度小于所述第二管体212的长度，所述第一管体211上套设有加强环213，所述第二管体212上间隔套设有多个加强环213，可以增强第一导流组件20的结构强度。进一步地，所述两个第一管体211均与邻接的至少一个所述第二管体212为一体成型设置。即两个第一管体211可以一一对应地与两个第二管体212一体成型设置，或者两个第一管体211与两个第二管体212均为一体成型设置，可以进一步增强第一导流组件20的结构强度。需要说明的是，本文中所描述的多个均指两个及两个以上。
在一可选的实施方式中，所述第二导流组件30包括排管部310和与所述排管部310连通设置的第二导流部320，所述第二导流部320与所述第一导流出口102连通设置，所述排管部310设有所述第二导流入口300。流经待冷却装置900的冷却介质将待冷却装置900的热量带走后经设于排管部310的第二导流入口300进入第二导流组件30，再从柜体10的第一导流出口102排出柜体10，从而达到将待冷却装置900的热量排出的目的。
进一步地，所述排管部310的排管结构可以与所述待冷却装置900的截面结构相对应，可以使流经待冷却装置900的冷却介质能够尽可能多的流进第二导流组件30内后从柜体10的第一导流出口102排出，进而提高冷却介质的循环速度。例如，所述待冷却装置900的截面结构为矩形，所述排管部310的排管结构为与之对应的矩形排管结构。当然，所述待冷却装置900的截面结构也可以是其他形状，所述排管部310的排管结构与之对应即可。
在一可选的实施方式中，所述待冷却装置900的截面结构为矩形，所述排管部310为与之对应的矩形排管结构。所述排管部310包括两个第三管体311和连接于所述两个第三管体311之间的多个第四管体312，多个第四管体312与所述两个第三管体311均连通设置。所述第二导流部320与任一所述第三管体311连通设置，所述第四管体312的顶部设有所述第二导流入口300。流经待冷却装置900的冷却介质将待冷却装置900的热量带走后经设于第四管体312的第二导流入口300进入第二导流组件30，再从柜体10的第一导流出口102排出柜体10，从而达到将待冷却装置900的热量排出的目的。
在一可选的实施方式中，所述第一导流出口102为两个，分别设于所述柜体10的两侧。相应地，所述第二导流部320为两个，与所述两个第三管体311一一对应地连通设置。这样，可以提高冷却介质的循环速度，进而提高对待冷却装置900的冷却效率。
在一可选的实施方式中，所述第三管体311的长度小于所述第四管体312的长度，所述第三管体311上套设有加强环313，可以增强第二导流组件30的结构强度。可选地，所述多个第四管体312包括两组，相互呈交错排列。其中一组第四管体312与其中一个第三管体311为一体成型设置，另一组第四管体312与另一个第三管体311为一体成型设置，即相当于多个第四管体312与两个第三管体311形成两个钉耙的一体结构，可以进一步增强第二导流组件30的结构强度。
在一可选的实施方式中，所述第二导流出口200为多个，多个第二导流出口200均匀布设于第一导流组件200的第一管体211、第二管体212以及第一导流部220中的至少一者的内侧壁。在图中所示的实施例中，第一导流组件200的第一管体211、第二管体212以及第一导流部220的内侧壁均设有均匀布置的多个第二导流出口200。所述第二导流入口300为多个，多个第二导流入口300均匀布设于第二导流组件300的第四管体312的顶部。这样，可以使冷却介质流经待冷却装置900的流量分布更加均匀，有利于提高冷却效率。
结合图3至图5所示，以第一导流入口101位于第一导流出口102的上方，第一导 流组件20位于待冷却装置900的顶部，第二导流组件30位于待冷却装置900的底部为例，对本说明书的冷却机柜1的工作原理进行说明。本说明书的冷却机柜1内设有用于装设待冷却装置900的多个插接组件190，待冷却装置900可以采用片体式结构，依次插接在这些插接组件190上。冷却介质80从柜体10的第一导流入口101进入第一导流组件20后，经第一导流组件20的第二导流出口200排到柜体10内后向下流经待冷却装置900，流经待冷却装置900的冷却介质80将待冷却装置900的热量带走后经第二导流组件30的第二导流入口300进入第二导流组件30，再从柜体10的第一导流出口102排出柜体10，从而达到将待冷却装置900的热量排出的目的。图中的虚线箭头表示冷却介质处于热液流体状态下的流向，实线箭头表示冷却介质处于冷液流体状态下的流向。通过将第一导流组件20设在待冷却装置900的顶部，将第二导流组件30设在待冷却装置900的底部，使冷却介质80流经待冷却装置900的流场为自上而下的直线路径，使得冷却介质的整个液体流过路径最短，受到的阻力最小，驱动液体所需要的能耗也相应地大幅降低，进而达到能耗最低的效果。另外，冷却介质采用直线形式的流经路径，冷、热流体完全隔离，可以避免冷、热流体相互混合，进而达到最优的制冷效果。
参见图6所示，以第一导流入口101位于第一导流出口102的下方，第一导流组件20位于待冷却装置900的底部，第二导流组件30位于待冷却装置900的顶部为例，对本说明书的冷却机柜1的工作原理进行说明。本说明书的冷却机柜1内设有用于装设待冷却装置900的多个插接组件190，待冷却装置900可以采用片体式结构，依次插接在这些插接组件190上。冷却介质80从柜体10的第一导流入口101进入第一导流组件20后，经第一导流组件20的第二导流出口200排到柜体10内后向上流经待冷却装置900，流经待冷却装置900的冷却介质80将待冷却装置900的热量带走后经第二导流组件30的第二导流入口300进入第二导流组件30，再从柜体10的第一导流出口102排出柜体10，从而达到将待冷却装置900的热量排出的目的。图中的虚线箭头表示冷却介质处于热液流体状态下的流向，实线箭头表示冷却介质处于冷液流体状态下的流向。通过将第一导流组件20设在待冷却装置900的底部，将第二导流组件30设在待冷却装置900的顶部，使冷却介质80流经待冷却装置900的流场为自下而上的直线路径，使得冷却介质的整个液体流过路径最短，受到的阻力最小，驱动液体所需要的能耗也相应地大幅降低，进而达到能耗最低的效果。另外，冷却介质采用直线形式的流经路径，冷、热流体完全隔离，可以避免冷、热流体相互混合，进而达到最优的制冷效果。
实施例2
本说明书实施例还提供一种冷却机柜，用于冷却待冷却装置，所述冷却机柜包括柜体和设置于所述柜体内的导流组件，所述导流组件设有呈离散分布的多个导流口。所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口。所述导流组件与所述导流入口连通设置，所述多个导流口用于将冷却介质排至所述柜体内，或所述导流组件与所述导流出口连通设置，所述多个导流口用于导入流经所述待冷却装置的冷却介质。
由以上技术方案可见，本说明的冷却机柜，在导流组件上设置呈离散分布的多个导流口，导流组件既可以与柜体的导流入口连通设置，起到导入冷却介质的作用。导流组件也可以与柜体的导流出口连通设置，起到排出冷却介质的作用。但不论是哪种设置方式，呈离散分布的多个导流口均可以使冷却介质从多个不同的方向流入或流出柜体，减小冷却介质之间的温度差，进而使冷却介质的流量和温度更加均匀，冷却效率更高。
需要说明的是，当所述导流组件与所述导流入口连通设置时，其功能相当于是上述实施例1中所述的第一导流组件，所述导流口的功能相当于是上述实施例1中所述的第二导流出口，在这种情况下，所述导流组件的结构可以参见上述实施例1中关于所述的第一导流组件的描述。当所述导流组件与所述导流出口连通设置时，其功能相当于是上述实施例1中所述的第二导流组件，所述导流口的功能相当于是上述实施例1中所述的第二导流入口，在这种情况下，所述导流组件的结构可以参见上述实施例1中关于所述的第二导流组件的描述。
实施例3
本说明书实施例还提供一种冷却系统，包括如上实施例1或实施例2中所述的冷却机柜和连接于所述冷却机柜的换热装置。需要说明的是，在上述实施例1和实施例2中关于所述冷却机柜的描述，同样适用于本说明书的冷却系统。下面以实施例1中所述的冷却机柜为例，对本说明书的冷却系统进行说明。
参见图7所示，本说明书的冷却系统2包括如上实施例1中所述的冷却机柜1和连接于所述冷却机柜1的换热装置3，所述换热装置3的一端与所述冷却机柜1的柜体10连通设置，所述换热装置3的另一端与外部供液设备连通设置，所述换热装置3用于驱动冷却介质在冷却机柜1的柜体10内循环并对冷却介质进行热交换。
由以上技术方案可见，本说明书的冷却系统2，通过换热装置3驱动冷却介质在冷 却机柜1内循环流动以带走待冷却装置900的热量，并通过换热装置3与外部供液设备交换热量，使冷却介质重新达到低温的状态，循环进入冷却机柜1后能够再次对待冷却装置900进行冷却降温，从而达到循环持续地将待冷却装置900的热量排出的目的。
在一可选的实施例中，换热装置3包括热交换器40和泵50，热交换器40通过第一循环回路与冷却机柜1连接，通过第二循环回路与外部供液设备连接。所述第一循环回路包括第一管路510和第二管路520，所述第二循环回路包括第三管路530和第四管路540。其中，第一管路510与冷却机柜1的第一导流入口101连通设置，第二管路520与冷却机柜1的第一导流出口102连通设置，第三管路530及第四管路540均与外部供液设备连通设置。本说明书的冷却系统2工作时，所述泵50通过第一循环回路驱动冷却介质在冷却机柜1中循环，冷却介质通过在冷却机柜1内循环流动带走待冷却装置900的热量并进入到换热装置3的热交换器40中。所述外部供液设备可以在第二循环回路内循环提供冷却水，带有待冷却装置900热量的冷却介质在热交换器40内可以与外部供液设备提供的冷却水进行热交换，将冷却介质带有的热量排出，使冷却介质重新达到低温的状态，循环进入冷却机柜1后能够再次对待冷却装置900进行冷却降温，从而达到循环持续地将待冷却装置900的热量排出的目的。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本说明书的其它实施方案。本说明书旨在涵盖本说明书的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本说明书的一般性原理并包括本说明书未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本说明书的真正范围和精神由下面的权利要求指出。
还需要说明的是，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上所述仅为本说明书的较佳实施例而已，并不用以限制本说明书，凡在本说明书的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本说明书保护的范围之内。

Claims (20)

  1. 一种冷却机柜，用于冷却待冷却装置，其特征在于，所述冷却机柜包括柜体以及第一导流组件和第二导流组件；
    其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；所述第一导流组件与所述第一导流入口连通设置，所述第一导流组件设有用于将冷却介质排至所述柜体内的第二导流出口；所述第二导流组件与所述第一导流出口连通设置，所述第二导流组件设有用于导入流经所述待冷却装置的冷却介质的第二导流入口。
  2. 根据权利要求1所述的冷却机柜，其特征在于，所述第一导流入口位于所述第一导流出口的上方；所述第一导流组件位于所述待冷却装置的顶部，所述第二导流组件位于所述待冷却装置的底部。
  3. 根据权利要求1所述的冷却机柜，其特征在于，所述第一导流入口位于所述第一导流出口的下方；所述第一导流组件位于所述待冷却装置的底部，所述第二导流组件位于所述待冷却装置的顶部。
  4. 根据权利要求2所述的冷却机柜，其特征在于，所述第一导流组件包括环管部和与所述环管部连通设置的第一导流部，所述第一导流部与所述第一导流入口连通设置，所述环管部和所述第一导流部中的至少一者设有所述第二导流出口。
  5. 根据权利要求4所述的冷却机柜，其特征在于，所述环管部为矩形环管结构，所述环管部包括相互连通并围合连接的两个第一管体和两个第二管体，所述第一导流部与任一所述第一管体连通设置，所述第一管体、所述第二管体以及所述第一导流部中的至少一者设有所述第二导流出口。
  6. 根据权利要求5所述的冷却机柜，其特征在于，所述第一导流入口为两个，分别设于所述柜体的两侧；所述第一导流部为两个，与所述两个第一管体一一对应地连通设置。
  7. 根据权利要求5所述的冷却机柜，其特征在于，所述两个第一管体均与邻接的至少一个所述第二管体为一体成型设置。
  8. 根据权利要求5所述的冷却机柜，其特征在于，所述第二导流出口为多个，均匀布设于所述第一管体、所述第二管体以及所述第一导流部中的至少一者的侧壁。
  9. 根据权利要求2所述的冷却机柜，其特征在于，所述第二导流组件包括排管部和与所述排管部连通设置的第二导流部，所述第二导流部与所述第一导流出口连通设置， 所述排管部设有所述第二导流入口。
  10. 根据权利要求9所述的冷却机柜，其特征在于，所述排管部为矩形排管结构，所述排管部包括两个第三管体和连接于所述两个第三管体之间的多个第四管体，所述多个第四管体与所述两个第三管体均连通设置；所述第二导流部与任一所述第三管体连通设置，所述第四管体设有所述第二导流入口。
  11. 根据权利要求10所述的冷却机柜，其特征在于，所述第一导流出口为两个，分别设于所述柜体的两侧；所述第二导流部为两个，与所述两个第三管体一一对应地连通设置。
  12. 根据权利要求10所述的冷却机柜，其特征在于，所述多个第四管体包括两组，相互呈交错排列；其中一组所述第四管体与其中一个所述第三管体为一体成型设置，另一组所述第四管体与另一个所述第三管体为一体成型设置。
  13. 根据权利要求10所述的冷却机柜，其特征在于，所述第二导流入口为多个，均匀布设于所述第四管体的顶部。
  14. 一种冷却系统，其特征在于，包括冷却机柜和换热装置，所述冷却机柜用于冷却待冷却装置，包括柜体和设置于所述柜体内的第一导流组件以及第二导流组件，所述第一导流组件和所述第二导流组件分别位于所述待冷却装置的两侧；
    其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；所述第一导流组件与所述第一导流入口连通设置，所述第一导流组件设有用于将冷却介质排至所述柜体内的第二导流出口；所述第二导流组件与所述第一导流出口连通设置，所述第二导流组件设有用于导入流经所述待冷却装置的冷却介质的第二导流入口；
    所述换热装置的一端与所述柜体连通设置，所述换热装置的另一端与外部供液设备连通设置，所述换热装置用于驱动冷却介质在所述柜体内循环并对冷却介质进行热交换。
  15. 一种冷却机柜，用于冷却待冷却装置，其特征在于，所述冷却机柜包括柜体和设置于所述柜体内的导流组件，所述导流组件设有呈离散分布的多个导流口；所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的导流入口和用于排出冷却介质的导流出口；
    所述导流组件与所述导流入口连通设置，所述多个导流口用于将冷却介质排至所述柜体内；或所述导流组件与所述导流出口连通设置，所述多个导流口用于导入流经所述 待冷却装置的冷却介质。
  16. 根据权利要求15所述的冷却机柜，其特征在于，所述导流组件包括环管部和与所述环管部连通设置的第一导流部，所述第一导流部与所述导流入口连通设置，所述环管部和所述第一导流部中的至少一者设有所述多个导流口。
  17. 根据权利要求16所述的冷却机柜，其特征在于，所述环管部为矩形环管结构，所述环管部包括相互连通并围合连接的两个第一管体和两个第二管体，所述第一导流部与任一所述第一管体连通设置，所述第一管体、所述第二管体以及所述第一导流部中的至少两者设有所述多个导流口。
  18. 根据权利要求15所述的冷却机柜，其特征在于，所述导流组件包括排管部和与所述排管部连通设置的第二导流部，所述第二导流部与所述导流出口连通设置，所述排管部设有所述多个导流口。
  19. 根据权利要求18所述的冷却机柜，其特征在于，所述排管部为矩形排管结构，所述排管部包括两个第三管体和连接于所述两个第三管体之间的多个第四管体，所述多个第四管体与所述两个第三管体均连通设置；所述第二导流部与任一所述第三管体连通设置，所述第四管体设有所述多个导流口。
  20. 一种冷却系统，其特征在于，包括冷却机柜和换热装置，所述冷却机柜用于冷却待冷却装置，包括柜体和设置于所述柜体内的导流组件，所述导流组件设有呈离散分布的多个导流口；
    其中，所述柜体内可盛放用于至少部分浸没所述待冷却装置的冷却介质，所述柜体设有用于导入冷却介质的第一导流入口和用于排出冷却介质的第一导流出口；
    所述导流组件与所述导流入口连通设置，所述多个导流口用于将冷却介质排至所述柜体内；或所述导流组件与所述导流出口连通设置，所述多个导流口用于导入流经所述待冷却装置的冷却介质；
    所述换热装置的一端与所述柜体连通设置，所述换热装置的另一端与外部供液设备连通设置，所述换热装置用于驱动冷却介质在所述柜体内循环并对冷却介质进行热交换。
PCT/CN2018/111821 2017-11-03 2018-10-25 冷却机柜及冷却系统 Ceased WO2019085813A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/760,007 US11871545B2 (en) 2017-11-03 2018-10-25 Cooling cabinet and cooling system
EP18873684.7A EP3706523B1 (en) 2017-11-03 2018-10-25 Cooling cabinet and cooling system
JP2020524824A JP2021501951A (ja) 2017-11-03 2018-10-25 冷却キャビネットおよび冷却システム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711073039.6A CN109757061B (zh) 2017-11-03 2017-11-03 冷却机柜及冷却系统
CN201711073039.6 2017-11-03

Publications (1)

Publication Number Publication Date
WO2019085813A1 true WO2019085813A1 (zh) 2019-05-09

Family

ID=66332801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/111821 Ceased WO2019085813A1 (zh) 2017-11-03 2018-10-25 冷却机柜及冷却系统

Country Status (6)

Country Link
US (1) US11871545B2 (zh)
EP (1) EP3706523B1 (zh)
JP (1) JP2021501951A (zh)
CN (1) CN109757061B (zh)
TW (1) TW201924510A (zh)
WO (1) WO2019085813A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4010780A4 (en) * 2020-07-20 2023-05-10 Ivan Kirillov FAST FLOW COOLING BATH FOR MULTIPROCESSOR PRINTED CIRCUIT BOARDS

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6939034B2 (ja) * 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
CN111065245B (zh) * 2019-12-29 2022-02-22 苏州浪潮智能科技有限公司 一种服务器液体冷却装置
US12363856B2 (en) * 2020-07-14 2025-07-15 Canaan Creative Co., Ltd. Immersed liquid cooling heat dissipation system
CN113543595B (zh) * 2021-07-12 2023-10-27 广东合一新材料研究院有限公司 流动浸没式服务器、工作站和工作系统
CN113727582A (zh) * 2021-08-20 2021-11-30 苏州浪潮智能科技有限公司 一种服务器机房及其无源浸没散热系统
US11889658B2 (en) * 2021-09-14 2024-01-30 Baidu Usa Llc Immersion cooling system having dual fluid delivery loops
NL2029728B1 (en) * 2021-11-12 2023-06-08 Theodorus De Klein Christianus System and methods for the individual immersion cooling of hardware components
CN114885567A (zh) * 2022-06-14 2022-08-09 喜动技术有限公司 具有液冷系统的集装箱式计算装置
CN219108016U (zh) * 2022-08-18 2023-05-30 喜动技术有限公司 计算设备用冷却槽、冷却设备以及集装箱式计算装置
CA225377S (en) * 2023-05-17 2025-02-12 Canaan Creative Co Ltd Cooling box for data processing device
WO2026035542A1 (en) * 2024-08-07 2026-02-12 Avtron Power Solutions, Llc Liquid-cooled load bank and methods of using the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030123225A1 (en) * 2001-12-27 2003-07-03 Miller Charles A. Electronic package with direct cooling of active electronic components
CN104284536A (zh) * 2014-10-28 2015-01-14 储敏健 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统
CN204231772U (zh) * 2014-10-28 2015-03-25 储敏健 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统
CN204810797U (zh) * 2014-10-10 2015-11-25 汤金菊 高密度服务器液体浸没冷却机柜
CN105487624A (zh) * 2014-10-10 2016-04-13 汤金菊 高密度服务器液体浸没冷却机柜
CN106255387A (zh) * 2016-08-31 2016-12-21 深圳绿色云图科技有限公司 散热系统及数据中心
CN207519035U (zh) * 2017-11-03 2018-06-19 阿里巴巴集团控股有限公司 冷却设备
CN207519034U (zh) * 2017-11-03 2018-06-19 阿里巴巴集团控股有限公司 冷却机柜及冷却系统

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7971632B2 (en) 2003-11-07 2011-07-05 Asetek A/S Cooling system for a computer system
US8553416B1 (en) 2007-12-21 2013-10-08 Exaflop Llc Electronic device cooling system with storage
US8035972B2 (en) 2009-07-31 2011-10-11 Oracle America, Inc. Method and apparatus for liquid cooling computer equipment
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
ES2769605T3 (es) 2010-08-26 2020-06-26 Asetek Danmark As Sistema de refrigeración por líquido para un servidor
US9326430B2 (en) * 2011-10-26 2016-04-26 Hewlett Packard Enterprise Development Lp Device for cooling an electronic component in a data center
US8830672B2 (en) 2012-07-27 2014-09-09 International Business Machines Corporation Computer system cooling using an externally-applied fluid conduit
US9204576B2 (en) 2012-09-14 2015-12-01 Cisco Technolgy, Inc. Apparatus, system, and method for configuring a system of electronic chassis
US9229497B2 (en) * 2012-11-08 2016-01-05 Silicon Graphics International Corp. On-blade cold sink for high-density clustered computer system
WO2014109869A1 (en) 2012-12-14 2014-07-17 Midas Green Technology, Llc Appliance immersion cooling system
US9351429B2 (en) * 2013-02-01 2016-05-24 Dell Products, L.P. Scalable, multi-vessel distribution system for liquid level control within immersion cooling tanks
US9699939B2 (en) * 2014-06-24 2017-07-04 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9408332B2 (en) * 2014-06-24 2016-08-02 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9258926B2 (en) * 2014-06-24 2016-02-09 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US9596787B1 (en) 2014-11-06 2017-03-14 Google Inc. Cooling electronic devices in a data center
CN204335279U (zh) 2015-01-28 2015-05-13 讯凯国际股份有限公司 液体冷却式散热结构
EP3254540B1 (en) 2015-03-09 2020-12-02 Vapor Io Inc. Rack for computing equipment
US9872415B2 (en) 2015-12-01 2018-01-16 Dell Products, L.P. Dry power supply assembly for immersion-cooled information handling systems
US9839164B2 (en) 2015-12-21 2017-12-05 Dell Products, L.P. Rack information handling system having modular liquid distribution (MLD) conduits
JP2017163065A (ja) * 2016-03-11 2017-09-14 富士通株式会社 電子機器
JP6980969B2 (ja) * 2016-04-13 2021-12-15 富士通株式会社 データセンタ及びデータセンタの制御方法
US9763364B1 (en) 2016-06-29 2017-09-12 Intel Corporation Heat transfer liquid flow method and apparatus
WO2018051501A1 (ja) 2016-09-16 2018-03-22 富士通株式会社 液浸槽および液浸槽を有する装置
FR3057344B1 (fr) 2016-10-10 2019-05-24 Bull Sas Armoire informatique avec modules de refroidissement liquide
US10123461B2 (en) 2017-04-05 2018-11-06 Google Llc Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
US10806056B2 (en) 2017-07-19 2020-10-13 Hewlett Packard Enterprise Development Lp Cooling system for high-performance computer
CN107743354B (zh) 2017-10-25 2020-03-03 北京百度网讯科技有限公司 数据中心机房的制冷系统和数据中心

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030123225A1 (en) * 2001-12-27 2003-07-03 Miller Charles A. Electronic package with direct cooling of active electronic components
CN204810797U (zh) * 2014-10-10 2015-11-25 汤金菊 高密度服务器液体浸没冷却机柜
CN105487624A (zh) * 2014-10-10 2016-04-13 汤金菊 高密度服务器液体浸没冷却机柜
CN104284536A (zh) * 2014-10-28 2015-01-14 储敏健 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统
CN204231772U (zh) * 2014-10-28 2015-03-25 储敏健 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统
CN106255387A (zh) * 2016-08-31 2016-12-21 深圳绿色云图科技有限公司 散热系统及数据中心
CN207519035U (zh) * 2017-11-03 2018-06-19 阿里巴巴集团控股有限公司 冷却设备
CN207519034U (zh) * 2017-11-03 2018-06-19 阿里巴巴集团控股有限公司 冷却机柜及冷却系统

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3706523A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4010780A4 (en) * 2020-07-20 2023-05-10 Ivan Kirillov FAST FLOW COOLING BATH FOR MULTIPROCESSOR PRINTED CIRCUIT BOARDS

Also Published As

Publication number Publication date
EP3706523A4 (en) 2021-08-11
CN109757061B (zh) 2021-06-11
CN109757061A (zh) 2019-05-14
EP3706523A1 (en) 2020-09-09
JP2021501951A (ja) 2021-01-21
EP3706523B1 (en) 2025-08-13
US20200352058A1 (en) 2020-11-05
TW201924510A (zh) 2019-06-16
US11871545B2 (en) 2024-01-09

Similar Documents

Publication Publication Date Title
WO2019085813A1 (zh) 冷却机柜及冷却系统
CN207519035U (zh) 冷却设备
WO2013139144A1 (zh) 电子设备及其散热系统和散热方法
CN110581114A (zh) 一种热管、相变材料与浸没式液冷相结合的散热系统
CN113703550A (zh) 一种混合式液冷装置
CN109757062B (zh) 冷却设备
US11197396B2 (en) Cooling system with curvilinear air to liquid heat exchanger
CN211880860U (zh) 设备组件、冷却系统、及设备机架
CN219536687U (zh) 电气设备
CN208862072U (zh) 一种电池箱、电池散热系统以及电动车
CN207519034U (zh) 冷却机柜及冷却系统
CN222355789U (zh) 电气柜
CN203340505U (zh) 一种机柜温控系统
CN109587998A (zh) 微通道换热器底置型多联热管冷却系统
CN209462838U (zh) 一种液体浸没冷却式交换机及交换机组
CN221791971U (zh) 一种风冷降温装置
CN208187188U (zh) 一种曲管多隔板式冷却塔
CN222733424U (zh) 一种热交换效率高的空气冷却器
CN206895116U (zh) 一种通讯机柜内的水冷散热器
CN219658090U (zh) 一种服务器的液冷散热系统
CN219211559U (zh) 一种无氧铜材生产用的上引连铸机自循环水冷却装置
CN217210477U (zh) 一种煤化工冷却装置
CN105588452B (zh) 一种多回路翅片式表冷器
CN108167974A (zh) 微通道换热器底置型多联热管冷却系统
CN218352993U (zh) 一种散热鳍片组

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18873684

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2020524824

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2018873684

Country of ref document: EP

Effective date: 20200603

WWG Wipo information: grant in national office

Ref document number: 2018873684

Country of ref document: EP