WO2019100820A1 - 显示基板及其制备方法、显示面板 - Google Patents

显示基板及其制备方法、显示面板 Download PDF

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Publication number
WO2019100820A1
WO2019100820A1 PCT/CN2018/105496 CN2018105496W WO2019100820A1 WO 2019100820 A1 WO2019100820 A1 WO 2019100820A1 CN 2018105496 W CN2018105496 W CN 2018105496W WO 2019100820 A1 WO2019100820 A1 WO 2019100820A1
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Prior art keywords
light
reflecting layer
display substrate
layer
light emitting
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Ceased
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PCT/CN2018/105496
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English (en)
French (fr)
Inventor
周威龙
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to EP18859945.0A priority Critical patent/EP3716334A4/en
Priority to US16/338,632 priority patent/US11587984B2/en
Publication of WO2019100820A1 publication Critical patent/WO2019100820A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80518—Reflective anodes, e.g. ITO combined with thick metallic layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • At least one embodiment of the present disclosure is directed to a display substrate, a method of fabricating the same, and a display panel.
  • the three-dimensional display technology Compared with the display image of two-dimensional display technology, the three-dimensional display technology has a three-dimensional sense and is more realistic, so it is more and more favored by users, especially the naked-eye three-dimensional display technology has got rid of the shackles of glasses and has a broader application prospect.
  • the brightness and resolution of the display image of the current three-dimensional display product are low, which affects the user experience.
  • At least one embodiment of the present disclosure provides a display substrate including at least one first sub-pixel and at least one second sub-pixel, the first sub-pixel and the second sub-pixel having different display directions
  • the first sub-pixel includes a first light-emitting element
  • the second sub-pixel includes a second light-emitting element
  • both of the first light-emitting element and the second light-emitting element have a light-emitting structure
  • the light-emitting structure includes a first light-reflecting layer a second light reflecting layer opposite to the first light reflecting layer and a light emitting layer disposed between the first light reflecting layer and the second light reflecting layer, wherein the second light reflecting layer is located on a light emitting side of the display substrate And an area of the first light reflecting layer is larger than an area of the second light reflecting layer.
  • the first light reflecting layer in each of the light emitting structures, along the display direction, includes a first portion overlapping with the second light reflecting layer and The second reflective layer does not overlap the second portion.
  • an angle between a cut surface of the surface of the second portion facing the light emitting layer and a surface of the display substrate is about 15 to 45 degrees.
  • the second portion is located at one end of the first light reflecting layer near the light emitting side of the display substrate; or the second portion is located at the first The middle of the reflective layer.
  • an area ratio of the second portion to the first light reflecting layer is 5% to 15%.
  • a distance between an end of the first portion adjacent to the second portion and the second light reflecting layer is greater than a distance of the first portion away from the second portion The distance between one end and the second light reflecting layer.
  • the first light reflecting layer is from an end of the first portion away from the second portion to an end of the first portion near the second portion.
  • the spacing between the second light reflecting layer and the second light reflecting layer is gradually increased.
  • the display substrate provided by at least one embodiment of the present disclosure further includes a pixel defining layer, wherein the pixel defining layer is provided with a plurality of grooves, the light emitting structure is located in the groove, and the groove includes at least one The second portion is located on the first side surface with respect to a first side surface of which the surface of the base substrate is a slope.
  • a portion of the first side surface overlapping the second portion is a plane or a curved surface.
  • the light emitting structure includes an organic light emitting device, the light emitting layer is an organic light emitting layer, and the organic light emitting device includes a first electrode, a second electrode, and The organic light emitting layer between the first electrode and the second electrode, the second electrode being located on a light exiting side of the display substrate.
  • the first electrode and the first light reflecting layer have an integral structure; and/or the second electrode and the second light reflecting layer have a unitary structure.
  • At least one of the first light emitting element and the second light emitting element further includes: an optical medium layer located at the first light reflecting layer and the light emitting Between the layers, or between the second light reflecting layer and the light emitting layer.
  • a thickness of a portion of the optical medium layer overlapping the second portion is greater than a thickness of a portion of the optical medium layer overlapping the first portion.
  • the optical medium layer from an end of the first portion remote from the second portion to an end of the first portion adjacent to the second portion, gradually increases.
  • a cut surface of a surface of the first light reflecting layer facing the light emitting layer is a slope with respect to a surface of the display substrate.
  • an angle between a cut surface of the surface of the first light reflecting layer facing the light emitting layer and a surface of the display substrate is 15 to 45 degrees.
  • At least one embodiment of the present disclosure provides a display panel including the display substrate in any of the above embodiments.
  • At least one embodiment of the present disclosure provides a method of fabricating a display substrate, wherein the display substrate includes at least one first sub-pixel and at least one second sub-pixel, the method comprising: forming a light emitting structure, the light emitting structure including a first light reflecting layer, a second light reflecting layer opposite to the first light reflecting layer, and a light emitting layer between the first light reflecting layer and the second light reflecting layer; forming a covered body in the first subpixel a first light-emitting element of the light-emitting structure and a second light-emitting element including the light-emitting structure in the second sub-pixel; wherein the second light-reflecting layer is located on a light-emitting side of the display substrate, and the An area of a light reflecting layer is larger than an area of the second light reflecting layer, and a light emitting direction of the first light emitting element and the second light emitting element is different, such that the first subpixel and the second subpixel have Different display directions.
  • the method for fabricating a display substrate further includes: forming a pixel defining layer, forming a plurality of grooves in the pixel defining layer, and forming at least one first side surface of the groove as The face relative to the display substrate is a slope; wherein the light emitting structure is formed in the groove, and the second portion of the first light reflecting layer is formed on the first side surface.
  • a portion of the first side surface overlapping the second portion is formed into a plane or a curved surface.
  • FIG. 1 is a plan view of a display substrate according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view showing a structure of the display substrate of FIG. 1 along M-N;
  • FIG. 3A is a partial structural schematic view of the display substrate shown in FIG. 2;
  • 3B is an optical path diagram of a light emitting structure in the display substrate shown in FIG. 3A;
  • 3C is a schematic view showing another partial structure of the display substrate shown in FIG. 1;
  • FIG. 4 is a schematic diagram showing another partial structure of a display substrate according to an embodiment of the present disclosure.
  • 5A is a cross-sectional view of another display substrate according to an embodiment of the present disclosure.
  • FIG. 6 is a cross-sectional view of another display substrate according to an embodiment of the present disclosure.
  • FIG. 7 is a partial structural schematic view of the display substrate shown in FIG. 6;
  • FIG. 8A is a plan view showing another display substrate according to an embodiment of the present disclosure.
  • Figure 8B is a cross-sectional view of the display substrate of Figure 8A taken along E-F;
  • 9A-9F are process diagrams of a method of fabricating a display substrate according to an embodiment of the present disclosure.
  • 100-light emitting structure 110-first light reflecting layer; 111-first portion; 112-second portion; 1121-exit surface; 120-second light reflecting layer; 130-light emitting layer; 140-first electrode; Electrode; 160-optical dielectric layer; 200-substrate; 300-pixel defining layer; 310-groove; 400-mask; 410-first region; 420-second region; 430-third region; Sub-pixel; 1100 - first illuminating element; 1110 - first direction; 2000 - second sub-pixel; 2100 - second illuminating element; 2110 - second direction.
  • At least one embodiment of the present disclosure provides a display substrate including at least one first sub-pixel and at least one second sub-pixel, the first sub-pixel and the second sub-pixel having different display directions, the first sub- The pixel includes a first illuminating element and the second sub-pixel includes a second illuminating element.
  • the first light-emitting element is configured such that a normal to the exit surface has a first direction
  • the first direction may be a display direction of the first sub-pixel
  • the second light-emitting element is configured such that a normal of the exit surface has a second direction.
  • the two directions can be used as the display direction of the second sub-pixel.
  • the first direction and the second direction intersect.
  • the first sub-pixel and the second sub-pixel of the display substrate can emit light in different directions, that is, the light emitted by the first sub-pixel and the second sub-pixel can respectively form different parallax images, so that the display substrate has a three-dimensional display function, The light constituting the parallax image is not degraded, so that the parallax image has a higher luminance.
  • the display substrate does not need to be provided with external auxiliary components (such as gratings) or the arrangement of sub-pixel units in the display substrate, and the light emitted by each sub-pixel unit can be received by the user, which can ensure that the display substrate is provided.
  • the 3D display image has a higher resolution.
  • the light emitted by the first illuminating element and the second illuminating element is not strictly parallel, and the light emitted by the first illuminating element and the second illuminating element has a certain divergence angle. And tending to the first direction and the second direction, respectively, that is, the propagation direction of the light of the display direction is distributed within a certain angular range based on the first direction or the second direction.
  • the angle between the display direction of the first sub-pixel and the first direction may be within 0-10 degrees, further within 0-5 degrees; the angle between the display direction of the second sub-pixel and the second direction may be Within 0 to 10 degrees, further within 0 to 5 degrees.
  • FIG. 1 is a plan view of a display substrate according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view of the display substrate of FIG. 1 along a structure of M-N.
  • At least one embodiment of the present disclosure provides a display substrate, as shown in FIGS. 1 and 2, the display substrate includes at least one first sub-pixel 1000 and at least one second sub-pixel 2000, and the first sub-pixel 1000 includes a first illumination Element 1100, second sub-pixel 2000 includes second light-emitting element 2100, the first light-emitting element 1100 is configured such that the normal of the exit surface has a first direction 1110, and the second light-emitting element 2100 is configured such that the normal of the exit surface has a second direction 2110 .
  • the normal to the exit face refers to the normal to the center position of the exit face.
  • the center position may be the centroid of the exit face.
  • the exit surface is not shown in FIGS. 1 and 2, and the exit surface 1121 in FIGS. 3A and 3B can be referred to.
  • the first direction 1110 and the second direction 2110 face the display side and cross each other.
  • the parallax image composed of the plurality of first sub-pixels 1000 emitted from the first sub-pixel 1000 propagates in the first direction 1110
  • the parallax image composed of the plurality of second sub-pixels 2000 emitted from the second sub-pixel 2000 propagates in the second direction 2110 to the left and right eyes of the user.
  • Different parallax images are respectively received, so that the display substrate has a three-dimensional display function.
  • the first sub-pixel 1000 and the second sub-pixel 2000 are in one-to-one correspondence with each other, for example, adjacently arranged in the row direction of the display device (horizontal direction when the display device is vertically placed on the pedestal) to form a sub-pixel pair.
  • the manner in which the first sub-pixel 1000 and the second sub-pixel 2000 are combined and arranged is not limited.
  • the light emitted by the first sub-pixel 1000 and the second sub-pixel 2000 can directly enter the eyes of the user, and the light constituting the parallax image is not degraded, so that the parallax image has a high brightness.
  • the light emitted by each sub-pixel unit in the display substrate can be received by the user, and the three-dimensional display image provided by the display substrate can be ensured to have a higher resolution.
  • the light emitted by the same sub-pixel in the display substrate has a certain divergence angle and does not completely propagate in one direction.
  • the exit surface of the sub-pixel the light emitted by the sub-pixel tends to be in the same direction. , reducing interference between parallax images (for example, preventing different parallax images from entering the same eye of the user), and improving the effect of three-dimensionally displaying images.
  • the first light-emitting element 1100 in the first sub-pixel 1000 is configured such that the normal of the exit surface has a first direction 1110 such that the light emitted by the first sub-pixel 1000 tends to the first direction 1110; the second sub-pixel 2000 The second light-emitting element 2100 is configured such that the normal of the exit surface has a second direction 2110 such that the light emitted by the second sub-pixel 2000 tends to be in the second direction 2110.
  • the display substrate may further include a substrate 200.
  • the first light-emitting element 1100 in the first sub-pixel 1000 and the second light-emitting element 2100 in the second sub-pixel 2000 are all located on the substrate 200.
  • the substrate 200 may be provided with a switching element, a control circuit, and the like, and the switching element and the control circuit may control the switching or the luminous intensity of the first light-emitting element 1100 and the second light-emitting element 2100.
  • a spatial rectangular coordinate system is established with reference to the substrate 200 shown in FIG. 2 to explain the position of each structure in the display substrate.
  • the X-axis and the Y-axis are parallel to the plane of the substrate 200 of the display substrate, and the Z-axis is perpendicular to the plane on which the substrate 200 is located.
  • the designation of the direction of each structure in the display substrate is referred to the substrate 200.
  • the "upper surface” of the first light-emitting element 1100 is the surface of the first light-emitting element 1100 away from the substrate 200
  • the “lower surface” of the first light-emitting element 1100 is the first light-emitting The surface of the element 1100 near the substrate 200, the "upper” and “lower” directions of the first light-emitting element 1100 are in the Z-axis direction
  • the "upper” is the side of the first light-emitting element 1100 away from the substrate 200
  • "below” The direction of the side of the first light-emitting element 1100 near the substrate 200 is correspondingly the portion of the first light-emitting element 1100 away from the substrate 200, and the "lower end” of the first light-emitting element 1100. It is a portion of the first light-emitting element 1100 that is close to the substrate 200.
  • the specific structure of the first light-emitting element 1100 and the second light-emitting element 2100 is not limited as long as the emitted light of the first light-emitting element 1100 tends to the first direction 1110, and the second light-emitting element 2100 The outgoing light tends to be in the second direction 2110.
  • the structural relationship between the first light emitting element and the second light emitting element is not limited.
  • the first light-emitting element 1100 and the second light-emitting element 2100 are similar in structure and can be symmetrically disposed such that the first light-emitting element 1100 and the second light-emitting element 2100 have different light-emitting directions.
  • the first sub-pixel 1000 is taken as an example to further analyze the specific structure of the display substrate.
  • FIG. 3A is a partial schematic structural view of the display substrate shown in FIG. 2, which is a schematic structural view of the first sub-pixel 1000 in the display substrate.
  • both the first light emitting element and the second light emitting element may have a light emitting structure including a first light reflecting layer and a second light reflecting layer opposite to the first light reflecting layer. And a light emitting layer disposed between the first light reflecting layer and the second light reflecting layer, wherein the second light reflecting layer is located on a light emitting side of the display substrate, and an area of the first light reflecting layer is larger than an area of the second light reflecting layer.
  • the first light reflecting layer includes a first portion overlapping the second light reflecting layer and a portion not overlapping the second light reflecting layer the second part.
  • both the first light-emitting element 1100 and the second light-emitting element 2100 may have a light-emitting structure 100
  • the light-emitting structure 100 may include a first light-reflecting layer 110 opposite to the first light-reflecting layer 110 .
  • a second light-reflecting layer 120 and a light-emitting layer 130 disposed between the first light-reflecting layer 110 and the second light-reflecting layer 120.
  • the second light-reflecting layer 120 is located on the light-emitting side of the display substrate (ie, the second light-reflecting layer 120 is located on the first light-reflecting layer 110).
  • the first light reflecting layer 110 includes a first portion 111 overlapping the second light reflecting layer 120 and a second portion 112 not overlapping the second light reflecting layer 120.
  • the first light-emitting element 1100 in the first sub-pixel 1000 the light emitted by the light-emitting layer 130 in the light-emitting structure 100 is totally reflected between the first light-reflecting layer 110 and the second light-reflecting layer 120, and then Concentrating on the second portion 112 of the first light reflecting layer 110 and being reflected by the second portion 112, so that the light of the light emitting structure 100 tends to be in the same direction (for example, the first direction 1110), and the light emitting structure 100 is emitted.
  • the brightness of the light Accordingly, for the second light-emitting element 2100 in the second sub-pixel 2000, the light of the light-emitting structure 100 tends to be in the second direction 2110.
  • the exit surface 1121 of the light emitting structure 100 may be a portion of the upper surface of the second portion 112 that participates in reflecting light.
  • the upper surface of the second portion 112 is the exit surface 1121 of the light emitting structure 100.
  • the light in the light emitting structure 100 is reflected by the second portion 112.
  • the direction of the outgoing light of the light emitting structure 100 can be adjusted by adjusting the shape of the upper surface of the second portion 112 and the tilt angle with respect to the surface of the substrate 200.
  • the shape of the upper surface of the second portion is not limited as long as the shape of the second portion can cause the light emitted from the light emitting structure to converge in the first direction or the second direction.
  • the upper surface of the second portion may be a flat surface or a curved surface (for example, a curved surface).
  • the upper surface of the second portion 112 may be a curved surface, so that the reflected light may be further concentrated in the first direction 1110 to improve the brightness of the emitted light of the light emitting structure 100. .
  • the angle between the cut surface of the upper surface of the second portion and the surface of the display substrate is about 15 to 45 degrees, and further, for example, about 20 degrees, about 30 degrees, and about 40 degrees. Degrees, etc.
  • the angle between the upper surface of the second portion 112 and the direction of the X-axis may be about 15 to 45 degrees, and accordingly, the direction of the first direction 1110 and the Z-axis may be made.
  • the angle of the angle Q ranges from 15 to 45 degrees. It should be noted that, in at least one embodiment of the present disclosure, the numerical range of the angle Q is not limited, and may be designed according to the actual requirements for realizing the three-dimensional display image.
  • the light exiting position in the light emitting structure (eg, the position of the second portion of the first light reflecting layer) is not limited.
  • the second portion is located at one end of the first light reflecting layer near the light emitting side of the display substrate.
  • the upper end portion of the first light reflecting layer 110 does not overlap the second light reflecting layer 120 in a direction parallel to the first direction 1110, and the portion serves as the second portion 112.
  • the second portion 112 is located at an end of the first light-reflecting layer 110 near the light-emitting side of the display panel, so that the light emitted from the light-emitting structure 100 is not blocked by the peripheral components, and the light-emitting rate is improved.
  • the second portion is located in the middle of the first light reflecting layer.
  • the intermediate portion of the first light reflecting layer 110 does not overlap the second light reflecting layer 120, and the intermediate portion serves as the second portion 112.
  • the second portion 112 is located in an intermediate portion (eg, a central region) of the first light reflecting layer 110, and an opening area (a region overlapping the second portion 112) of the first light reflecting layer 110 is substantially equal in area of the second portion 112, and thus,
  • the divergence angle of the outgoing light can be limited such that the light converges toward the first direction 1110 to a high degree, that is, the light-emitting structure 100 of the above structure is easy to control the direction of the outgoing light.
  • the second portion 112 may also be located at one end of the first light reflecting layer 110 near the substrate 200 or at other positions of the first light reflecting layer 110 as long as the light in the light emitting structure 100 can be normally emitted.
  • the first sub-pixel 1000 and the second sub-pixel 2000 may share one second light-reflecting layer 120, so that the preparation process of the display substrate can be simplified. Process to reduce costs.
  • the area ratio of the second portion to the first light-reflecting layer is not limited, and may be set according to actual needs, as long as the light-emitting amount and the light-emitting direction of the light-emitting structure are satisfied.
  • the light-emitting structure mainly reflects light by the second portion to form a parallax image. In the case where the area ratio of the second portion to the first light-reflecting layer is too small, the light reflected through the second portion is limited, and the required light-emitting amount is small.
  • the degree of divergence of the light emitted from the light-emitting structure may be large, which is disadvantageous for controlling the light-emitting direction of the light-emitting structure.
  • the area ratio of the second portion to the first light reflecting layer can be about 5% to 15%, further, for example, about 8%, 10%, 12%, and the like.
  • the ratio of the area of the surface of the second portion 112 away from the substrate 200 to the area of the surface of the first light reflecting layer 110 remote from the substrate 200 may be 5% to 15%.
  • the amount of light emitted by the light emitting structure can satisfy the display requirement, and the degree of collimation of the emitted light of the light emitting structure (which tends to be in the first direction or the second direction) is higher.
  • the distance between one end of the first portion adjacent to the second portion and the second light reflecting layer is greater than the distance between the end of the first portion remote from the second portion and the second light reflecting layer.
  • 3B is a light path diagram of the light emitting structure in the display substrate shown in FIG. 3A.
  • the distance between the end of the first portion 111 adjacent to the second portion 112 and the second light reflecting layer 120 is greater than the distance of the first portion 111 away from the second portion 112 and the second light reflecting layer 120 .
  • the spacing of the light emitted by the luminescent layer 130 is mainly propagated toward the second portion 112 during the reflection process, and the amount of light emitted from the light emitting structure 100 can be increased.
  • the distance between the first light reflecting layer and the second light reflecting layer gradually increases from an end of the first portion away from the second portion to an end of the first portion close to the second portion. increase.
  • the first light reflecting layer 110 and the second reflective The spacing between layers 120 is gradual. As such, it is possible to further ensure that the reflected light in the light emitting structure 100 propagates toward the second portion 112, further increasing the amount of light emitted from the light emitting structure 100.
  • the first light reflecting layer and the second light reflecting layer may be disposed at an end of the first portion of the first light reflecting layer away from the second portion without affecting the function of the light emitting structure.
  • the closed structure may be wedge-shaped such that light in the light-emitting structure can only be reflected from the area where the second portion is located, increasing the amount of light emitted by the light-emitting structure.
  • the surface shape of the first light reflecting layer is not limited.
  • the surface of at least the second portion of the first light reflecting layer is a plane or a curved surface.
  • the surface of the first portion of the first light reflecting layer may also be a flat surface or a curved surface, or may be other shapes as long as the reflected light inside the light emitting structure can be made to propagate to the second portion.
  • the light emitted by the light emitting structure may tend to be in a fixed direction (for example, the first direction 1110 and the second direction).
  • Direction 2110) As shown in FIG. 3A and FIG. 3B, the first portion 111 of the first light reflecting layer 110 may also be a slope with respect to the surface on which the substrate 200 is located.
  • the angle between the first portion 111 and the face of the substrate 200 is about 15 to 45 degrees, and further, for example, about 20 degrees, about 30 degrees, about 40 degrees, and the like.
  • the angle of inclination of the upper surface of the first portion of the first light reflecting layer to the surface of the substrate may be disposed such that the surface of the first portion is parallel to the surface on which the substrate is located (the surface on which the substrate is located), that is, the inclination angle of the upper surface of the first portion and the surface of the substrate is zero.
  • the upper surface of the first portion may also be disposed to be inclined with respect to the plane on which the substrate is located (the surface on which the substrate is located) (refer to the arrangement of the second portion 112 in the embodiment shown in FIGS. 2 and 3A). Exemplarily, as shown in FIG. 3A and FIG.
  • the first light reflecting layer 110 is disposed as a slope, so that the light emitting layer 130 can be added without changing the design size of the sub-pixel (for example, the first sub-pixel 1000).
  • the area thereby increasing the amount of light emitted from the light emitting structure 100, and increasing the brightness of the display image of the display substrate.
  • the light emitting structure may include an organic light emitting device, the light emitting layer is an organic light emitting layer, and the organic light emitting device includes a first electrode, a second electrode, and the first electrode and the second electrode. Between the organic light-emitting layers, the second electrode is located on the light-emitting side of the display substrate.
  • the organic light emitting device in the light emitting structure 100 may include a first electrode 140, a light emitting layer 130 (organic light emitting layer) and a second electrode 150, and the light emitting layer 130 is located at the first Between an electrode 140 and the second electrode 150.
  • the first electrode 140 and the second electrode 150 apply a voltage to the light emitting layer 130 to cause the light emitting layer 130 to emit light.
  • the specific structure of the organic light emitting device is not limited, and the organic light emitting device may further include, for example, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and the like.
  • At least a portion of the structure in the organic light emitting device may be disposed to be commonly used in the first sub-pixel and the second sub-pixel.
  • the light-emitting layer 130, the second electrode 150, the hole injection layer, the hole transport layer, and the electron transport in the first sub-pixel 1000 and the second sub-pixel 2000 At least one of the layer and the electron injection layer or the like may be disposed to be shared, and thus, the manufacturing process of the display substrate can be simplified, and the cost can be reduced.
  • a material for preparing the light-emitting layer 130 (organic light-emitting layer) in the organic light-emitting device is not limited.
  • the material of the light-emitting layer 130 can be selected depending on the color of the emitted light (e.g., red light, green light, blue light, white light, etc.).
  • the material for preparing the light-emitting layer 130 includes a fluorescent light-emitting material or a phosphorescent light-emitting material.
  • the light-emitting layer 130 may also adopt a doping system, that is, a dopant material is mixed in the host light-emitting material to obtain a usable light-emitting material.
  • the host light-emitting material may be a metal compound material, a ruthenium derivative, an aromatic diamine compound, a triphenylamine compound, an aromatic triamine compound, a biphenyldiamine derivative, or a triarylamine polymer.
  • the materials of preparation of the first electrode 140 and the second electrode 150 are not limited.
  • one of the first electrode 140 and the second electrode 150 may be provided as an anode, and the other may be provided as a cathode.
  • the anode may be formed, for example, of a transparent conductive material having a high work function, which may include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), gallium zinc oxide (GZO), oxidation.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • IGO indium gallium oxide
  • GZO gallium zinc oxide
  • the cathode may be formed of an electrode material having high conductivity and a low work function, and the electrode material may include magnesium alloy An alloy such as (MgAl) or lithium aluminum alloy (LiAl) or a single metal such as magnesium, aluminum, lithium or silver.
  • magnesium alloy An alloy such as (MgAl) or lithium aluminum alloy (LiAl) or a single metal such as magnesium, aluminum, lithium or silver.
  • the distribution of the organic light emitting device on the first light reflecting layer is not limited, and the organic light emitting device may be disposed to cover the entire area of the first light reflecting layer, or may be disposed to cover the first light reflecting layer. partial area. However, if the organic light emitting device overlaps with the second portion of the first light reflecting layer, the light emitted by the overlapping portion may be directly emitted from the light emitting structure, and the light of the portion is scattered to a greater extent, which may affect the display image of the display substrate. .
  • the effective light emitting region in the organic light emitting device may be disposed only in a region where the first light reflecting layer and the second light reflecting layer overlap.
  • FIG. 4 is a schematic diagram showing another partial structure of a display substrate according to an embodiment of the present disclosure.
  • the second electrode 150 of the organic light emitting device may be disposed only on the first portion 111 in a direction parallel to the first direction 1110.
  • the first electrode may have a unitary structure with the first light reflecting layer; and/or the second electrode may have a unitary structure with the second light reflecting layer.
  • the structure of the light-emitting structure can be simplified, the preparation process of the substrate can be simplified, and the cost can be reduced.
  • the thickness of the organic light-emitting device is small, and in the case where only the organic light-emitting device is disposed between the first light-reflecting layer 110 and the second light-reflecting layer 120, light may propagate between the first light-reflecting layer 110 and the second light-reflecting layer 120.
  • the phenomenon of interference (for example, interference cancellation or interference constructivity) affects the uniformity of the amount of light emitted from the light-emitting structure 100 and the intensity of the light emitted.
  • the first light emitting element and the second light emitting element may further include an optical medium layer, and the optical medium layer may be disposed on the first light reflecting layer and the second reflective layer.
  • the light emitting structure 100 may further include an optical medium layer 160 disposed between the first light reflecting layer 110 and the second light reflecting layer 120.
  • the optical medium layer 160 may increase the spacing between the first light reflecting layer 110 and the second light reflecting layer 120 to prevent light from interfering between the first light reflecting layer 110 and the second light reflecting layer 120.
  • the thickness of the optical medium layer 160 is large, and a patterning process thereof can be performed to adjust the pitch between the first light reflecting layer 110 and the second light reflecting layer 120 by changing the thickness of the optical medium layer 160.
  • the material of the optical medium layer is a transparent material.
  • the transparent material may be polyimide, polymethyl methacrylate, polyethylene terephthalate or other resinous materials.
  • the transparent material may also include a photoresist material (eg, a photoresist).
  • the thickness of the portion of the optical medium layer that overlaps the second portion is greater than the thickness of the portion of the optical medium layer that overlaps the first portion.
  • the thickness of the portion of the optical medium layer that overlaps the first portion gradually increases.
  • the thickness of the optical medium layer 160 increases as the distance from the substrate 200 increases, so that the spacing between the first light reflecting layer 110 and the second light reflecting layer 120 can be made to the substrate. The distance of 200 increases as the distance increases.
  • the light emitted by the light-emitting layer 130 is concentrated in the second portion 112 during the reflection between the first light-reflecting layer 110 and the second light-reflecting layer 120, and the light-emitting structure 100 has a high light-emitting amount.
  • the specific position of the optical medium layer between the first light reflecting layer and the second light reflecting layer is not limited.
  • the optical medium layer is located between the first light reflecting layer and the light emitting layer; or between the second light reflecting layer and the light emitting layer.
  • the optical dielectric layer 160 is located between the second light reflecting layer 120 and the light emitting layer 130, in which case the second electrode 150 is located in the optical medium layer 160 and the light emitting layer. Between 130, the second electrode 150 may be configured as a transparent electrode such that light emitted by the luminescent layer 130 may enter the optical medium layer 160.
  • the optical medium layer may also be located between the first light reflecting layer and the light emitting layer.
  • the first electrode is located between the optical medium layer and the light emitting layer, and the first electrode may be configured as a transparent electrode, so that the light emitting layer The emitted light can enter the optical medium layer.
  • the light emitting structures in the first light emitting element and the second light emitting element are not limited to the structures as shown in FIGS. 2, 3A, 3B, and 4 as long as the light in the first light emitting element
  • the outgoing light of the structure tends to be in the first direction and the outgoing light of the light emitting structure in the second light emitting element tends to be in the second direction.
  • FIG. 5A is a cross-sectional view of another display substrate according to an embodiment of the present disclosure
  • FIG. 5B is a partial structural diagram of the first sub-pixel shown in FIG. 5A.
  • adjacent first sub-pixel 1000 and second sub-pixel 2000 are located in the same groove 310, and the first sub-pixel 1000 and the second sub-pixel
  • the luminescent layer 130 in 2000 can be separately provided to emit light of different colors, respectively.
  • the second electrode 150 shown in FIG. 5A may also be disposed as a common electrode of the first sub-pixel 1000 and the second sub-pixel 2000, or may be separately disposed in the first sub-pixel 1000 and the second sub-pixel 2000. .
  • the optical medium layer 160 is disposed to cover the second electrode 150 of the organic light emitting device, such that the optical medium layer 160 may space the first electrode 140 from the second light reflecting layer 120 or the second electrode 150.
  • the light emitting layer 130 may be disposed to cover the first electrode 140 of the organic light emitting device, such that the light emitting layer 130 may space the first electrode 140 from the second light reflecting layer 120 or the second electrode 150, thereby ensuring performance of the organic light emitting device. .
  • the light-emitting structure 100 in the first sub-pixel 1000 and the second sub-pixel 2000 share the second light-reflecting layer 120, and other structures in the light-emitting structure 100 (for example, the first light-reflecting layer 110, the first The electrode 120, the light emitting layer 130, the second electrode 150 or the optical medium layer 160, etc. may also be separately provided, so that the first light reflecting layer 110 and the second light reflecting layer may be further reduced at one end of the light emitting structure 100 near the substrate 200.
  • the spacing distance of 120 further enhances the amount of light emitted from one end of the light emitting structure 100 away from the substrate 200 (corresponding to the second portion 112 of the first light reflecting layer 110).
  • At least a part of the structures such as the light-emitting layer 130 and the like in the light-emitting structure 100 as shown in FIG. 5A can be prepared by vacuum evaporation or the like, thereby forming different types of light-emitting layers 130 in different sub-pixels.
  • the first light emitting element and the second light emitting element each have a light emitting structure
  • the light emitting structure includes a first light reflecting layer and a light emitting layer disposed on the first light reflecting layer, and the light emitting layer Located on the light exiting side of the display substrate, and the upper surface of the first light reflecting layer is inclined with respect to the surface of the display substrate.
  • FIG. 6 is a cross-sectional view of another display substrate according to an embodiment of the present disclosure
  • FIG. 7 is a partial structural view of the display substrate shown in FIG. For example, as shown in FIG. 6 and FIG.
  • the light emitting structure 100 includes a first light reflecting layer 110 and a light emitting layer 130 disposed on a side of the first light reflecting layer 110 away from the substrate 200 .
  • the upper surface of the first light reflecting layer 110 is The faces of the display substrate intersect.
  • most of the light emitted by the light-emitting layer 130 is perpendicular to the upper surface of the first light-reflecting layer 110, that is, the direction of propagation of the light emitted from the first light-emitting element 1100 still tends to the first direction 1110, and the second The direction of propagation of the light emitted from the light-emitting element 2100 still tends to the second direction 2110, so that the display substrate can achieve three-dimensional display.
  • the first light reflecting layer 110 is disposed as a sloped surface, which can increase the area of the light emitting layer 130, that is, increase the light emitting area of the light emitting structure 100, and improve the brightness of the display image of the display substrate.
  • the angle between the upper surface of the first light reflecting layer and the surface of the display substrate is 15 to 45 degrees, and further, for example, about 20 degrees, about 30 degrees, about 40 degrees, and the like. .
  • the light-emitting structure 100 is not provided with the second light-reflecting layer 120, and the light-emitting structure is compared with the light-emitting structure in the embodiment shown in FIG. 2 and FIG. 3A .
  • Light generated by layer 130 is emitted directly or reflected by first reflective layer 110. Therefore, the specific design of the light-emitting structure in the embodiment shown in FIG. 6 and FIG. 7 can refer to the light-emitting structure in the embodiment shown in FIG. 2 and FIG. 3A, and at least one embodiment of the present disclosure will not be described herein. .
  • the specific manner in which the first light reflecting layer in the light emitting structure is designed as a slope or the second portion in the first light reflecting layer is designed as a slope is not limited.
  • the display substrate further includes a pixel defining layer disposed on the substrate, the pixel defining layer defining a location of the light emitting structure.
  • a plurality of grooves are disposed in the pixel defining layer, the light emitting structure is located in the groove, and the groove includes at least one first side surface that is inclined with respect to a surface on which the display substrate is located, and the second portion is located on the first side surface.
  • the upper surface of the second portion is also inclined with respect to the surface on which the display substrate is located.
  • all of the first light reflecting layer and/or the second light reflecting layer are located on the first side surface. Exemplarily, as shown in FIG. 2, FIG. 3A, FIG. 3B, FIG.
  • a substrate defining layer 300 may be disposed on the substrate 200, and the light emitting structure 100 is located in the recess 310 of the pixel defining layer 300.
  • a partial area or a whole area of the first side surface of the groove 310 (not shown in the drawing, please refer to the first side surface 31 of FIG. 9C) is provided as a slope, so that the first surface formed on the first side surface can be made
  • a light reflecting layer 110 has a corresponding shape.
  • the portion of the first side surface that overlaps the second portion is a plane or a curved surface.
  • the upper surface of the second portion can be formed as a flat surface or a curved surface.
  • all of the first side surfaces are planar or curved.
  • the arrangement of the first sub-pixel and the second sub-pixel on the display substrate is not limited, and the arrangement of the illumination color of the first sub-pixel and the illumination color of the second sub-pixel is not
  • the limitation is that the plurality of first sub-pixels and the plurality of second sub-pixels may constitute a parallax image, and the parallax images formed by the plurality of first sub-pixels and the parallax images formed by the plurality of second sub-pixels are different, so that the display substrate is displayed Three-dimensional display can be achieved.
  • the plurality of first sub-pixels 1000 and the plurality of second sub-pixels 2000 may be alternately arranged. Further, the adjacent first sub-pixel 1000 and second sub-pixel 2000 may be disposed in pairs, for example, in one of the grooves 310 of the pixel defining layer 300. As such, the fabrication process of the display substrate can be simplified (for example, the fabrication process of forming the recess 310 in the pixel defining layer 300).
  • FIG. 8A is a plan view of another display substrate according to an embodiment of the present disclosure
  • FIG. 8B is a cross-sectional view of the display substrate shown in FIG. 8A along EF
  • FIG. 8B is an adjacent first sub-image shown in FIG. A cross-sectional view of pixel 1000.
  • a plurality of adjacent first sub-pixels 1000 may be set as one group
  • a plurality of adjacent second sub-pixels 2000 may be set as another group
  • a plurality of first sub-pixels 1000 and The plurality of second sub-pixels 2000 are alternately arranged on the display substrate in a group.
  • each set of the first sub-pixels 1000 respectively includes sub-pixels that can emit light of three colors of red, green, and blue, and adjacent three second sub-pixels 2000.
  • each set of second sub-pixels 2000 includes sub-pixels that can emit light of three colors of red, green, and blue, respectively.
  • At least one embodiment of the present disclosure provides a display panel including the display substrate in any of the above embodiments.
  • the display substrate in the display panel may be a flexible substrate to be applied to the field of flexible display.
  • the touch substrate may be disposed on the display substrate to enable the display panel to obtain a touch display function.
  • the display panel may be any product or component having a display function such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, or the like.
  • At least one embodiment of the present disclosure provides a method of fabricating a display substrate, wherein the display substrate includes at least one first sub-pixel and at least one second sub-pixel, the method comprising: forming a first light-emitting element in the first sub-pixel and A second light emitting element is formed in the second sub-pixel; wherein the light emitting directions of the first light emitting element and the second light emitting element are different, such that the first sub-pixel and the second sub-pixel have different display directions.
  • the first light-emitting element is formed such that a normal to the exit surface has a first direction
  • the first direction is a display direction of the first sub-pixel
  • the second light-emitting element is formed such that a normal of the emission surface has a second direction
  • the second direction is The display direction of the second sub-pixel.
  • the first direction and the second direction intersect.
  • the first sub-pixel and the second sub-pixel can emit light in different directions, that is, the light emitted by the two can directly form different parallax images, so that the display substrate has a three-dimensional display function, The light constituting the parallax image is not degraded, so that the parallax image has a higher luminance.
  • the light emitted by each sub-pixel unit of the display substrate can be received by the user, and the three-dimensional display image provided by the display substrate can be ensured to have a higher resolution.
  • the first light emitting element and the second light emitting element both include a light emitting structure
  • forming the light emitting structure includes: forming a first light reflecting layer opposite to the first light reflecting layer a second light-reflecting layer and a light-emitting layer formed between the first light-reflecting layer and the second light-reflecting layer, wherein the second light-reflecting layer is located on the light-emitting side of the display substrate; wherein the second light-reflecting layer is located on the light-emitting side of the display substrate, and the first light-reflecting layer The area is larger than the area of the second light reflecting layer.
  • the first light-reflecting layer includes a first portion overlapping the second light-reflecting layer and a second portion not overlapping the second light-reflecting layer.
  • the display substrate obtained by the above preparation method light emitted from the light-emitting layer in the light-emitting structure is totally reflected between the first light-reflecting layer and the second light-reflecting layer, and then concentrated on the second portion of the first light-reflecting layer and is The second portion is reflected out, such that the light of the light-emitting structure tends to be in the same direction (for example, the first direction or the second direction), and the brightness of the emitted light of the light-emitting structure is increased.
  • the method for fabricating a display substrate further includes: forming a pixel defining layer, forming a plurality of grooves in the pixel defining layer, and forming at least one first side surface of the groove with respect to the display substrate
  • the face is a bevel
  • the light emitting structure is formed in the groove
  • the second portion of the first light reflecting layer is formed on the first side surface.
  • a portion of the first side surface overlapping the second portion is formed as a plane or a curved surface.
  • the method for preparing a display substrate further includes forming an optical medium layer between the first light reflecting layer and the light emitting layer or between the light emitting layer and the second light reflecting layer.
  • the optical medium layer can increase the spacing between the first light reflecting layer and the second light reflecting layer to prevent light from interfering between the first light reflecting layer and the second light reflecting layer.
  • the first light emitting element and the second light emitting element both include a light emitting structure
  • the forming the light emitting structure includes: forming a first light reflecting layer and forming on the first light reflecting layer
  • the light-emitting layer is formed on the light-emitting side of the display substrate.
  • the inclination angle of the upper surface of the first light-reflecting layer and the surface of the substrate is a slope with respect to the surface of the display substrate.
  • the first light reflecting layer is formed as a sloped surface, which can increase the area of the light emitting layer, that is, increase the light emitting area of the light emitting structure, and improve the brightness of the display image of the display substrate.
  • the structure of the display substrate obtained by the above-mentioned preparation method can refer to the related content in the foregoing embodiment (for the embodiment of the display substrate), and at least one embodiment of the present disclosure is not described herein.
  • FIGS. 9A-9F are process diagrams of a method for preparing a display substrate according to an embodiment of the present disclosure.
  • a method for preparing a display substrate provided by at least one embodiment of the present disclosure may include the following process.
  • a substrate 200 is provided and a thin film of insulating material is deposited on the substrate 200 to form a pixel defining layer 300.
  • the substrate 200 may be an array substrate, and a plurality of switching elements such as thin film transistors and corresponding control circuits and the like may be disposed in the substrate 200.
  • a plurality of switching elements such as thin film transistors and corresponding control circuits and the like may be disposed in the substrate 200.
  • the preparation method of the substrate 200 reference may be made to the preparation method of the conventional array substrate, and at least one embodiment of the present disclosure will not be described herein.
  • the material used to form the pixel defining layer 300 may be a positive photoresist.
  • a mask 400 is provided, then the pixel defining layer 300 is exposed, developed, and then a recess 310 is formed in the pixel defining layer 300.
  • the mask 400 may include a first region 410, a second region 420, and a third region 430, the first region 410 may be a transparent region, the second region 420 may be a light transmittance gradation region, and the third region 430 may be a light shielding region.
  • the first region 410 and the second region 420 adjacent thereto are used to form the groove 310, the first region 410 is located between the two second regions 420, and the second region 420 corresponds to the groove 310 to be formed.
  • One side surface 311 From the end of the second region 420 near the third region 430 to the direction of the second region 420 near the end of the first region 410 (the direction of the arrow " ⁇ " in FIGS. 9B and 9C), the second region 420 The light transmittance is gradually increased, and thus, the groove 310 as shown in Fig. 9C can be formed after the pixel defining layer 300 is exposed and developed.
  • the specific design of the mask 400 can be selected according to the specific shape of the groove 300.
  • the two first side surfaces 311 of the groove 310 are connected (for example, the cross-sectional shape of the groove is curved), the first region 410 may not be disposed in the mask 400.
  • a thin film of a reflective material is deposited on the substrate 200 and patterned to form a first light reflecting layer 110.
  • the material for preparing the first light reflecting layer 110 may include metals such as gold, silver, copper, aluminum, and the like, and alloys thereof. It should be noted that, in a case where the material of the first light reflecting layer 110 is a conductive material, the first light reflecting layer 110 in the first sub-pixel 1000 and the second sub-pixel 2000 are spaced apart from each other; in the first light reflecting layer 110 In the case where the material is an insulating material, the first reflective layer 110 in the first sub-pixel 1000 and the second sub-pixel 2000 may be spaced apart from each other or may be integrally disposed.
  • the patterning process may be, for example, a photolithographic patterning process, which may include, for example, coating a photoresist film (photoresist) on a structural layer that needs to be patterned,
  • the coating of the resistive film may be by spin coating, knife coating or roll coating; then exposing the photoresist layer with a mask, developing the exposed photoresist layer to obtain a photoresist pattern; then using the light
  • the resist material pattern is used as a mask to etch the structural layer; finally the remaining photoresist material is stripped to form the desired pattern structure.
  • the specific manner in which the first light reflecting layer 110 is formed in the groove 310 is not limited.
  • the first light reflecting layer 110 may be formed in the recess 310 by magnetron sputtering or vacuum evaporation.
  • an organic light emitting device is formed in the recess 310, that is, an organic light emitting device is formed in the first sub-pixel 1000 and the second sub-pixel 2000, respectively.
  • the process of forming the organic light emitting device may include sequentially forming the first electrode 140, the organic light emitting layer (the light emitting layer 130), and the second electrode 150 in the groove 310.
  • the second electrode 150 in the first sub-pixel 1000 and the second electrode 150 in the second sub-pixel 2000 may be disposed as an integrated structure, and further, the second electrode 150 can be disposed to cover the surface of the display substrate as a common electrode of all the sub-pixels, which can simplify the preparation process of the display substrate and reduce the cost.
  • the first light reflecting layer 110 can function as an electrode of the organic light emitting device, it is not necessary to form the first electrode 140.
  • the first reflective layer 110 and the associated structure of the substrate 200 may be patterned to form vias such that the first electrode 140 may be electrically connected to the switching elements in the substrate 200.
  • a structure such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer may be formed in the organic illuminator.
  • the hole injection layer, the hole transport layer, the electron transport layer, the electron injection layer, and the second electrode 150 may cover the entire groove 310 as a common structure of the first sub-pixel 1000 and the second sub-pixel 2000.
  • the light emitting layer 130 may cover the entire groove 310 as a common structure of the first sub-pixel 1000 and the second sub-pixel 2000; or may be in the first sub-pixel 1000 and the second sub-pixel 2000 by, for example, vacuum evaporation. Formed separately.
  • a thin film of transparent material is deposited on the substrate 200 and patterned to form an optical dielectric layer 160.
  • the thickness of the optical medium layer 160 increases as the distance from the substrate 200 increases.
  • the material of the optical medium layer 160 may be a photoresist.
  • the method of forming the optical medium layer 160 of the shape shown in FIG. 9F reference may be made to the related description of forming the groove 310 as shown in FIG. 9B and FIG. 9C, and at least one embodiment of the present disclosure will not be described herein.
  • a thin film of a reflective material is deposited on the substrate 200 and patterned to form a second light reflecting layer 120.
  • the second light reflecting layer 120 may be a single layer of light reflecting layer, and the material of the second light reflecting layer 120 may include metals such as gold, silver, copper, aluminum, and the like, and alloys thereof.
  • the second light reflecting layer 120 may be a composite layer, and the composite layer may be a high reflective film system composed of a plurality of film layers.
  • the highly reflective film includes a film system in which a high refractive index film layer and a low refractive index film layer are alternately stacked.
  • the material of the high refractive index film layer may be zinc sulfide or the like
  • the material of the low refractive index film layer may be magnesium fluoride or the like.
  • the optical thickness of the film layer of the high refractive index film layer and the low refractive index film layer may be set to 1/4 of the wavelength of light to be reflected.
  • At least one embodiment of the present disclosure provides a display substrate, a method of fabricating the same, a display panel, and may have at least one of the following beneficial effects:
  • At least one embodiment of the present disclosure provides a display substrate.
  • the first sub-pixel and the second sub-pixel can emit light in different directions, that is, the light emitted by the two directly can form different parallax images, so that the display substrate has three-dimensionality.
  • the display function is displayed, and the brightness and resolution of the displayed image are significantly improved.
  • At least one embodiment of the present disclosure provides a display substrate in which at least a portion of the light emitting structure is disposed obliquely with respect to a surface of the display substrate, which can increase a light emitting area of the light emitting structure, and further increase brightness of a display image of the display substrate.

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Abstract

一种显示基板及其制备方法、显示面板。该显示基板包括至少一个第一子像素(1000)和至少一个第二子像素(2000)，第一子像素(1000)和第二子像素(2000)具有不同的显示方向，第一子像素(1000)包括第一发光元件(1100)，第二子像素(2000)包括第二发光元件(2100)，第一发光元件(1100)和第二发光元件(2100)都具有发光结构(100)，发光结构(100)包括依次叠置的第一反光层(110)、发光层(130)和第二反光层(120)，第二反光层(120)位于显示基板的出光侧，并且第一反光层(110)的面积大于第二反光层(120)的面积。该显示基板具有三维显示功能，并且显示图像的亮度和分辨率显著提高。

Description

显示基板及其制备方法、显示面板
本申请要求于2017年11月22日递交的中国专利申请第201711173972.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种显示基板及其制备方法、显示面板。
背景技术
三维显示技术相比于二维显示技术的显示图像具有立体感，更加逼真，所以愈发受到用户的青睐，尤其是裸眼式三维显示技术摆脱了眼镜的束缚，具有更广阔的应用前景。
但是，相比于二维显示技术，当前的三维显示产品的显示图像的亮度和分辨率等较低，影响用户的体验。
发明内容
本公开至少一个实施例提供一种显示基板，该显示基板包括至少一个第一子像素和至少一个第二子像素，所述第一子像素和所述第二子像素具有不同的显示方向，所述第一子像素包括第一发光元件，所述第二子像素包括第二发光元件，所述第一发光元件和所述第二发光元件都具有发光结构，所述发光结构包括第一反光层、与所述第一反光层相对的第二反光层以及设置于所述第一反光层和所述第二反光层之间的发光层，所述第二反光层位于所述显示基板的出光侧，并且所述第一反光层的面积大于所述第二反光层的面积。
例如，在本公开至少一个实施例提供的显示基板中，在每个所述发光结构中，沿着所述显示方向，所述第一反光层包括与所述第二反光层重叠第一部分和与所述第二反光层不重叠的第二部分。
例如，在本公开至少一个实施例提供的显示基板中，所述第二部分的面向所述发光层的表面的切面与所述显示基板所在面的夹角约为15～45 度。
例如，在本公开至少一个实施例提供的显示基板中，所述第二部分位于所述第一反光层的靠近所述显示基板的出光侧的一端；或者所述第二部分位于所述第一反光层的中间。
例如，在本公开至少一个实施例提供的显示基板中，所述第二部分与所述第一反光层的面积比为5％～15％。
例如，在本公开至少一个实施例提供的显示基板中，所述第一部分的靠近所述第二部分的一端与所述第二反光层的间距大于所述第一部分的远离所述第二部分的一端与所述第二反光层的间距。
例如，在本公开至少一个实施例提供的显示基板中，从所述第一部分的远离所述第二部分的一端至所述第一部分的靠近所述第二部分的一端，所述第一反光层和所述第二反光层之间的间距逐渐增加。
例如，本公开至少一个实施例提供的显示基板还包括像素界定层，所述像素界定层中设置有多个凹槽，所述发光结构位于所述凹槽中，并且所述凹槽包括至少一个相对于所述衬底基板所在面为斜面的第一侧表面，所述第二部分位于所述第一侧表面上。
例如，在本公开至少一个实施例提供的显示基板中，所述第一侧表面的与所述第二部分重叠的部分为平面或者曲面。
例如，在本公开至少一个实施例提供的显示基板中，所述发光结构包括有机发光器件，所述发光层为有机发光层，所述有机发光器件包括第一电极、第二电极以及位于所述第一电极和所述第二电极之间的所述有机发光层，所述第二电极位于所述显示基板的出光侧。
例如，在本公开至少一个实施例提供的显示基板中，所述第一电极和所述第一反光层具有一体结构；和/或所述第二电极和所述第二反光层具有一体结构。
例如，在本公开至少一个实施例提供的显示基板中，所述第一发光元件和所述第二发光元件中的至少一个还包括：光学介质层，位于所述第一反光层和所述发光层之间，或者位于所述第二反光层和所述发光层之间。
例如，在本公开至少一个实施例提供的显示基板中，所述光学介质层的与所述第二部分重叠的部分的厚度大于所述光学介质层的与所述第一部分重叠的部分的厚度。
例如，在本公开至少一个实施例提供的显示基板中，从所述第一部分的远离所述第二部分的一端至所述第一部分的靠近所述第二部分的一端，所述光学介质层的与所述第一部分重叠的部分的厚度逐渐增加。
例如，在本公开至少一个实施例提供的显示基板中，所述第一反光层的面向所述发光层的表面的切面相对于所述显示基板所在面为斜面。
例如，在本公开至少一个实施例提供的显示基板中，所述第一反光层的面向所述发光层的表面的切面与所述显示基板所在面的夹角为15～45度。
本公开至少一个实施例提供一种显示面板，包括上述任一实施例中的显示基板。
本公开至少一个实施例提供一种显示基板的制备方法，其中，所述显示基板包括至少一个第一子像素和至少一个第二子像素，所述方法包括：形成发光结构，所述发光结构包括第一反光层、与所述第一反光层相对的第二反光层以及位于所述第一反光层和所述第二反光层之间的发光层；在所述第一子像素中形成包括所述发光结构的第一发光元件以及在所述第二子像素中形成包括所述发光结构的第二发光元件；其中，所述第二反光层位于所述显示基板的出光侧，并且所述第一反光层的面积大于所述第二反光层的面积，以及所述第一发光元件和所述第二发光元件的出光方向不同，以使得所述第一子像素和所述第二子像素具有不同的显示方向。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：形成像素界定层，在所述像素界定层中形成多个凹槽，并且所述凹槽的至少一个第一侧表面形成为相对于所述显示基板所在面为斜面；其中，所述发光结构形成在所述凹槽中，并且第一反光层的所述第二部分形成在所述第一侧表面上。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，所述第一侧表面的与所述第二部分重叠的部分形成为平面或者曲面。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本公开一个实施例提供的一种显示基板的平面图；
图2为图1所示显示基板沿M-N的一种结构的截面图；
图3A为图2所示显示基板的局部结构示意图；
图3B为图3A所示显示基板中的发光结构的光路图；
图3C为图1所示显示基板的另一种局部结构示意图；
图4为本公开一个实施例提供的显示基板的另一种局部结构示意图；
图5A为本公开一个实施例提供的另一种显示基板的截面图；
图5B为图5A所示的第一子像素的局部结构示意图；
图6为本公开一个实施例提供的另一种显示基板的截面图；
图7为图6所示显示基板的局部结构示意图；
图8A为本公开一个实施例提供的另一种显示基板的平面图；
图8B为图8A所示显示基板沿E-F的截面图；以及
图9A～图9F为本公开一个实施例提供的一种显示基板的制备方法的过程图。
附图标记：
100-发光结构；110-第一反光层；111-第一部分；112-第二部分；1121-出射面；120-第二反光层；130-发光层；140-第一电极；150-第二电极；160-光学介质层；200-基底；300-像素界定层；310-凹槽；400-掩模板；410-第一区域；420-第二区域；430-第三区域；1000-第一子像素；1100-第一发光元件；1110-第一方向；2000-第二子像素；2100-第二发光元件；2110-第二方向。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用 来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开至少一个实施例提供一种显示基板，该显示基板包括至少一个第一子像素和至少一个第二子像素，第一子像素和所述第二子像素具有不同的显示方向，第一子像素包括第一发光元件，第二子像素包括第二发光元件。例如，第一发光元件配置为出射面的法线具有第一方向，该第一方向可以作为第一子像素的显示方向，第二发光元件配置为出射面的法线具有第二方向，该第二方向可以作为第二子像素的显示方向。例如，第一方向和第二方向交叉。该显示基板的第一子像素和第二子像素可以出射不同方向的光线，即第一子像素和第二子像素出射的光线可以分别构成不同的视差图像，使得显示基板具有三维显示功能，如此，构成视差图像的光线没有减损，使得该视差图像具有较高的亮度。此外，显示基板不需要设置外部辅助元件(例如光栅等)或者对显示基板中的子像素单元的排布等进行调整，而且每个子像素单元发出的光线都可以被用户接收，可以保证显示基板提供的三维显示图像具有较高的分辨率。
需要说明的是，在本公开至少一个实施例中，第一发光元件和第二发光元件发出的光并不是严格平行出射的，第一发光元件和第二发光元件发出的光存在一定的发散角并且分别趋向于第一方向和第二方向，即，显示方向的光的传播方向分布在以第一方向或者第二方向为基准的一定角度范围内。例如，第一子像素的显示方向与第一方向的夹角可以在0～10度之内，进一步在0～5度之内；第二子像素的显示方向与第二方向的夹角可以在0～10度之内，进一步在0～5度之内。
下面，结合附图对根据本公开至少一个实施例中的显示基板及其制备方法、显示面板进行说明。
图1为本公开一个实施例提供的一种显示基板的平面图，图2为图1所示显示基板沿M-N的一种结构的截面图。
本公开至少一个实施例提供一种显示基板，如图1和图2所示，该显 示基板包括至少一个第一子像素1000和至少一个第二子像素2000，第一子像素1000包括第一发光元件1100，第二子像素2000包括第二发光元件2100，第一发光元件1100配置为出射面的法线具有第一方向1110，第二发光元件2100配置为出射面的法线具有第二方向2110。例如，在本公开至少一个实施例中，“出射面的法线”均指的是出射面的中心位置的法线。例如，该中心位置可以为该出射面的形心。例如，出射面在图1和图2中未示出，可以参考图3A和图3B中的出射面1121。
如图2所示，第一方向1110和第二方向2110朝向显示侧且彼此交叉。如此，由多个第一子像素1000的出射光线构成的视差图像向第一方向1110传播，由多个第二子像素2000的出射光线构成的视差图像向第二方向2110传播，用户的左右眼分别接收不同的视差图像，使得显示基板具有三维显示功能。例如，第一子像素1000和第二子像素2000彼此一一对应，例如在显示装置的行方向(当显示装置竖直放置在底座上时的水平方向)相邻设置以形成子像素对。在本公开至少一个实施例中，对第一子像素1000和第二子像素2000的组合、排布方式不做限制。
第一子像素1000和第二子像素2000出射的光线可以直接进入用户的眼睛，构成视差图像的光线没有减损，使得该视差图像具有较高的亮度。此外，显示基板中的每个子像素单元发出的光线都可以被用户接收，可以保证显示基板提供的三维显示图像具有较高的分辨率。
需要说明的是，显示基板中的同一个子像素出射的光线存在一定的发散角度，并不完全向一个方向传播，但是通过设计子像素的出射面，可以使得子像素出射的光线趋向于同一个方向，降低视差图像之间的干扰(例如防止不同的视差图像进入用户的同一只眼睛)，提高三维显示图像的效果。例如，第一子像素1000中的第一发光元件1100配置为出射面的法线具有第一方向1110，以使第一子像素1000出射的光线会趋向于第一方向1110；第二子像素2000中的第二发光元件2100配置为出射面的法线具有第二方向2110，以使第二子像素2000出射的光线会趋向于第二方向2110。
例如，在本公开至少一个实施例中，如图2所示，显示基板还可以包括基底200。第一子像素1000中的第一发光元件1100以及第二子像素2000中的第二发光元件2100都位于基底200上。例如，基底200中可以设置有开关元件及控制电路等，开关元件及控制电路可以对第一发光元件1100 和第二发光元件2100的开关或者发光强度等进行控制。
下面，以如图2所示的基底200为参考建立空间直角坐标系，以对显示基板中的各结构的位置进行说明。例如，在该空间直角坐标系中，X轴和Y轴与显示基板的基底200所在面平行，Z轴与基底200所在面垂直。此外，在下述实施例中，对显示基板中的各结构的方向的指定以该基底200为参考。示例性的，以第一发光元件1100为例，第一发光元件1100的“上表面”为第一发光元件1100的远离基底200的表面，第一发光元件1100的“下表面”为第一发光元件1100的靠近基底200的表面，第一发光元件1100的“上方”和“下方”的方向为Z轴方向，且“上方”为第一发光元件1100的远离基底200的一侧方向，“下方”为第一发光元件1100的靠近基底200的一侧方向，相应地，第一发光元件1100的“上端”为第一发光元件1100的远离基底200的部分，第一发光元件1100的“下端”为第一发光元件1100的靠近基底200的部分。
在本公开至少一个实施例中，对第一发光元件1100和第二发光元件2100的具体化结构不做限制，只要第一发光元件1100的出射光线趋向于第一方向1110，第二发光元件2100的出射光线趋向于第二方向2110即可。
在本公开至少一个实施例中，对第一发光元件和第二发光元件之间的结构关系不做限制。示例性的，如图1和图2所示，第一发光元件1100和第二发光元件2100的结构相似并且可以对称设置，如此，使得第一发光元件1100和第二发光元件2100的发光方向不同。下面，以第一子像素1000为例，进一步分析显示基板的具体化结构。
图3A为图2所示显示基板的局部结构示意图，其为显示基板中的第一子像素1000的结构示意图。
例如，在本公开至少一个实施例提供的显示基板中，第一发光元件和第二发光元件都可以具有发光结构，该发光结构包括第一反光层、与第一反光层相对的第二反光层以及设置于第一反光层和第二反光层之间的发光层，第二反光层位于显示基板的出光侧，并且第一反光层的面积大于第二反光层的面积。例如，在每个发光结构中，沿着显示方向(该发光结构的第一方向或者第二方向)，第一反光层包括与第二反光层重叠的第一部分和未与第二反光层重叠的第二部分。示例性的，如图2和图3A所示，第一发光元件1100和第二发光元件2100都可以具有发光结构100，发光结构 100可以包括第一反光层110、与第一反光层110相对的第二反光层120以及设置于第一反光层110和第二反光层120之间的发光层130，第二反光层120位于显示基板的出光侧(即第二反光层120位于第一反光层110的上方)，并且在发光结构100的出光方向上，第一反光层110包括与第二反光层120重叠的第一部分111和未与第二反光层120重叠的第二部分112。如图3A所示，对于第一子像素1000中的第一发光元件1100，发光结构100中的发光层130发出的光线会在第一反光层110和第二反光层120之间全反射，然后集中在第一反光层110的第二部分112上并被第二部分112反射出去，如此，可以使得发光结构100的光线趋向于同一个方向(例如第一方向1110)，提高发光结构100的出射光线的亮度。相应地，对于第二子像素2000中的第二发光元件2100，发光结构100的光线会趋向于第二方向2110。
在本公开至少一个实施例中，如图2和图3A所示，发光结构100的出射面1121可以为第二部分112的上表面中参与反射光线的部分。示例性的，如果第二部分112的上表面都参与反射发光结构100中的光线，则第二部分112的上表面即为发光结构100的出射面1121。发光结构100中的光线通过第二部分112反射出来，如此，可以通过调整第二部分112上表面的形状以及相对于基底200所在面的倾角以调整发光结构100的出射光的方向。
在本公开至少一个实施例中，对第二部分的上表面的形状不做限制，只要第二部分的形状可以使得发光结构出射的光线向第一方向或者第二方向汇聚即可。第二部分的上表面可以为平面也可以为曲面(例如弧形面)。示例性的，如图2和图3A所示，第二部分112的上表面可以为弧形面，如此，可以进一步将反射的光线向第一方向1110汇聚，提高发光结构100的发射光的亮度。
例如，在本公开至少一个实施例提供的显示基板中，第二部分的上表面的切面与显示基板所在面的夹角约为15～45度，进一步例如约20度、约30度、约40度等。示例性的，如图2和图3A所示，第二部分112的上表面和X轴的方向的夹角可以约为15～45度，相应地，可以使得第一方向1110和Z轴的方向的夹角Q的范围为15～45度。需要说明的是，在本公开至少一个实施例中，对夹角Q的数值范围不做限制，可以根据实现三 维显示图像的实际需求进行设计。
在本公开至少一个实施例中，对发光结构中的出光位置(例如第一反光层的第二部分的位置)不做限制。
例如，在本公开至少一个实施例提供的显示基板中，第二部分位于第一反光层的靠近显示基板的出光侧的一端。示例性的，如图2和图3A所示，在平行于第一方向1110的方向上，第一反光层110的上端部分未与第二反光层120重叠，且该部分作为第二部分112。第二部分112位于第一反光层110的靠近显示面板出光侧的一端，可以使得发光结构100的出射光线不会受到周边部件的阻挡，提高出光率。
例如，在本公开至少一个实施例提供的显示基板中，第二部分位于第一反光层的中间。如图3C所示，在平行于第一方向1110的方向上，第一反光层110的中间部分未与第二反光层120重叠，且该中间部分作为第二部分112。第二部分112位于第一反光层110的中间区域(例如中心区域)，第一反光层110的开口区域(与第二部分112重叠的区域)面积于第二部分112的面积基本相等，如此，可以限制出射光的发散角度，使得光向第一方向1110汇聚的程度高，即，上述结构的发光结构100容易对出射光的方向进行控制。
例如，第二部分112也可以位于第一反光层110的靠近基底200的一端，或者位于第一反光层110的其它位置，只要发光结构100中的光可以正常出射即可。
下面，以第二部分位于第一反光层的靠近显示基板的出光侧的一端为例，对本公开下述至少一个实施例中的技术方案进行说明。
例如，在本公开至少一个实施例提供的显示基板中，如图2所示，第一子像素1000和第二子像素2000可以共用一个第二反光层120，如此，可以简化显示基板的制备工艺流程，降低成本。
在本公开至少一个实施例中，对第二部分与第一反光层的面积比不做限制，可以根据实际需要进行设置，只要保证发光结构的出光量和出光方向满足要求即可。发光结构主要通过第二部分反射光线以形成视差图像，在第二部分与第一反光层的面积比太小的情况下，经由第二部分反射的光线有限，符合要求的出光量较少。在第二部分与第一反光层的面积比较大的情况下，发光结构的出射光线的发散程度可能较大，不利于对发光结构 的出光方向进行控制。
例如，在本公开至少一个实施中，第二部分与第一反光层的面积比可以约为5％～15％，进一步例如约8％、10％、12％等。示例性的，如图2和图3A所示，第二部分112的远离基底200的表面的面积与第一反光层110的远离基底200的表面的面积之比可以为5％～15％。如此，发光结构出射的出光量可以满足显示需求，而且发光结构的发射光的准直程度(趋向于第一方向或者第二方向)较高。
例如，在本公开至少一个实施例提供的显示基板中，第一部分的靠近第二部分的一端与第二反光层的间距大于第一部分的远离第二部分的一端与第二反光层的间距。图3B为图3A所示显示基板中的发光结构的光路图。示例性的，如图3A和图3B所示，第一部分111的靠近第二部分112的一端与第二反光层120的间距大于第一部分111的远离第二部分112的一端与第二反光层120的间距，如此，发光层130发出的光线在反射过程中主要向靠近第二部分112的方向传播，可以增加发光结构100的出光量。
例如，在本公开至少一个实施例提供的显示基板中，从第一部分的远离第二部分的一端至第一部分的靠近第二部分的一端，第一反光层和第二反光层之间的间距逐渐增加。示例性的，如图3A和图3B所示，从第一部分111的远离第二部分112的一端至第一部分111的靠近第二部分112的一端的方向上，第一反光层110和第二反光层120之间的间距是渐变的。如此，可以进一步保证发光结构100中的反射光线向第二部分112传播，进一步增加发光结构100的出光量。
例如，在本公开至少一个实施例中，在不会影响发光结构的功能的情况下，在第一反光层的第一部分的远离第二部分的一端，可以将第一反光层和第二反光层设置为闭合结构。例如，该闭合结构可以为楔形，使得发光结构中的光线只能从第二部分所在的区域反射出来，增加发光结构的出光量。
在本公开至少一个实施例中，对第一反光层的表面形状不做限制。例如，在本公开至少一个实施例提供的显示基板中，第一反光层的至少第二部分的表面为平面或者曲面。第一反光层的第一部分的表面也可以为平面或者曲面，或者也可以为其它形状，只要能够使得发光结构内部的反射光线可以向第二部分传播即可。
需要说明的是，在第二部分设置的上表面为斜面以与显示基板所在面存在一定的夹角的情况下，发光结构发出的光线可以趋向于固定的方向(例如第一方向1110和第二方向2110)。如图3A和图3B所示，第一反光层110的第一部分111也可以相对于基底200所在面为斜面。例如，第一部分111与基底200所在面的夹角约为15～45度，进一步例如约20度、约30度、约40度等。
在本公开至少一个实施例中，对第一反光层的第一部分的上表面与基底所在面的倾角。例如，第一部分可以设置为所在面与基底所在面(基板所在面)平行，即第一部分的上表面与基底所在面的倾角为零。例如，第一部分的上表面也可以设置为相对于基底所在面(基板所在面)为斜面(参考如图2和图3A所示实施例中的第二部分112的设置方式)。示例性的，如图3A和图3B所示，第一反光层110设置为斜面，如此，在不改变子像素(例如第一子像素1000)的设计尺寸的情况下，可以增加发光层130的面积，从而增加发光结构100的出光量，提升显示基板的显示图像的亮度。
例如，在本公开至少一个实施例提供的显示基板中，发光结构可以包括有机发光器件，发光层为有机发光层，有机发光器件包括第一电极、第二电极以及位于第一电极和第二电极之间的有机发光层，第二电极位于显示基板的出光侧。示例性的，如图2、图3A和图3B所示，发光结构100中的有机发光器件可以包括第一电极140、发光层130(有机发光层)和第二电极150，发光层130位于第一电极140和第二电极150之间。第一电极140和第二电极150向发光层130施加电压以使得发光层130发光。在本公开至少一个实施例中，对有机发光器件的具体化结构不做限制，有机发光器件例如还可以包括空穴注入层、空穴传输层、电子传输层和电子注入层等。
例如，在本公开至少一个实施例中，有机发光器件中的至少部分结构可以设置为共用于第一子像素和第二子像素中。示例性的，如图2、图3A和图3B所示，第一子像素1000和第二子像素2000中的发光层130、第二电极150、空穴注入层、空穴传输层、电子传输层和电子注入层等中的至少一个可以设置为共用，如此，可以简化显示基板的制备工艺，降低成本。
在本公开至少一个实施例中，对有机发光器件中的发光层130(有机发光层)的制备材料不做限制。例如，发光层130的制备材料可以根据其 发射光颜色(例如红光、绿光、蓝光或者白光等)的不同进行选择。例如，发光层130的制备材料包括荧光发光材料或磷光发光材料。例如，发光层130也可以采用掺杂体系，即在主体发光材料中混入掺杂材料来得到可用的发光材料。例如，主体发光材料可以采用金属化合物材料、蒽的衍生物、芳香族二胺类化合物、三苯胺化合物、芳香族三胺类化合物、联苯二胺衍生物、或三芳胺聚合物等。
在本公开至少一个实施例中，对第一电极140和第二电极150的制备材料不做限制。例如，第一电极140和第二电极150中的一方可以设置为阳极，另一方可以设置为阴极。例如，阳极例如可由具有高功函数的透明导电材料形成，该透明导电材料可以包括氧化铟锡(ITO)、氧化铟锌(IZO)、氧化铟镓(IGO)、氧化镓锌(GZO)、氧化锌(ZnO)、氧化铟(In 2O 3)、氧化铝锌(AZO)和碳纳米管等；例如，阴极可由高导电性和低功函数的电极材料形成，该电极材料可以包括镁铝合金(MgAl)、锂铝合金(LiAl)等合金或者镁、铝、锂、银等单金属。
在本公开至少一个实施例中，对有机发光器件在第一反光层上的分布不做限制，有机发光器件可以设置为覆盖第一反光层的全部区域，也可以设置为覆盖第一反光层的部分区域。但是，如果有机发光器件与第一反光层的第二部分重叠，则该重叠部分发出的光线可以直接从发光结构中射出，该部分光线的散射程度较大，会影响显示基板的显示图像的效果。
例如，在本公开至少一个实施例提供的显示基板中，有机发光器件中的有效发光区域可以只设置于第一反光层和第二反光层重合的区域。图4为本公开一个实施例提供的显示基板的另一种局部结构示意图。示例性的，如图4所示，在平行于第一方向1110的方向上，有机发光器件的第二电极150可以只设置于第一部分111上。如此，有机发光器件发出的光线都会在第一反光层110和第二反光层120之间全反射之后，再由第二部分112反射发出，可以使得发光结构100的出射光线的传播方向趋向于第一方向1110。实现上述技术效果的方案不限于此，例如，有机发光器件中的其它结构例如第一电极110、发光层130等也可以只设置在第一部分111上。
例如，在本公开至少一个实施例提供的显示基板中，第一电极可以和第一反光层具有一体结构；和/或第二电极可以和第二反光层具有一体结构。如此，可以简化发光结构的结构，简化基板的制备工艺，降低成本。
有机发光器件的厚度较小，在第一反光层110和第二反光层120之间只设置有机发光器件的情况下，光在第一反光层110和第二反光层120之间传播可能会发生干涉(例如干涉相消或者干涉相长)等现象，影响发光结构100的出光量和出光强度的均匀性。
例如，在本公开至少一个实施例提供的显示基板中，第一发光元件和第二发光元件中的至少一个还可以包括光学介质层，该光学介质层可以设置于第一反光层和第二反光层之间。示例性的，如图3A、图3B和图4所示，发光结构100还可以包括设置于第一反光层110和第二反光层120之间的光学介质层160。光学介质层160可以增加第一反光层110和第二反光层120之间的间距，避免光在第一反光层110和第二反光层120之间发生干涉。此外，光学介质层160的厚度较大，可以对其进行构图工艺，通过改变光学介质层160的厚度以调节第一反光层110和第二反光层120之间的间距。
例如，光学介质层的材料为透明材料。例如，该透明材料可以为聚酰亚胺、聚甲基丙烯酸甲酯、聚对苯二甲酸乙二醇酯或其它树脂类材料。例如该透明材料还可以包括光阻材料(例如光刻胶)。
例如，在本公开至少一个实施例中，光学介质层的与第二部分重叠的部分的厚度大于光学介质层的与所述第一部分重叠的部分的厚度。例如，进一步地，从第一部分的远离第二部分的一端至第一部分的靠近第二部分的一端，光学介质层的与第一部分重叠的部分的厚度逐渐增加。示例性的，如图4所示，光学介质层160的厚度随至基底200的距离的增加而增大，如此，可以使得第一反光层110和第二反光层120之间的间距随至基底200的距离的增加而增大。如此，发光层130发出的光线在第一反光层110和第二反光层120之间反射过程中，会向第二部分112汇聚，发光结构100的出光量高。
在本公开至少一个实施例中，对光学介质层在第一反光层和第二反光层之间的具体位置不做限制。例如，在本公开至少一个实施例提供的显示基板中，光学介质层位于第一反光层和发光层之间；或者位于第二反光层和发光层之间。示例性的，如图3A、图3B和图4所示，光学介质层160位于第二反光层120和发光层130之间，在此情况下，第二电极150位于光学介质层160和发光层130之间，第二电极150可以配置为透明电极， 使得发光层130发出的光线可以进入光学介质层160。或者，示例性的，光学介质层也可以位于第一反光层和发光层之间，相应地，第一电极位于光学介质层和发光层之间，第一电极可以配置为透明电极，使得发光层发出的光线可以进入光学介质层。
在本公开至少一个实施例中，第一发光元件和第二发光元件中的发光结构不限于如图2、图3A、图3B和图4中所示的结构，只要第一发光元件中的发光结构的出射光趋向于第一方向以及第二发光元件中的发光结构的出射光趋向于第二方向即可。
图5A为本公开一个实施例提供的另一种显示基板的截面图，图5B为图5A所示的第一子像素的局部结构示意图。例如，在本公开至少一个实施例中，如图5A所示，相邻的第一子像素1000和第二子像素2000位于同一个凹槽310中，且第一子像素1000和第二子像素2000中的发光层130可以单独设置以分别发出不同颜色的光线。需要说明的是，图5A所示的第二电极150也可以设置为第一子像素1000和第二子像素2000的公共电极，也可以单独设置于第一子像素1000和第二子像素2000中。例如，在每一个发光结构100中，光学介质层160设置为覆盖有机发光器件的第二电极150，如此，光学介质层160可以将第一电极140与第二反光层120或者第二电极150间隔开，从而保证有机发光器件的性能。例如，发光层130可以设置为覆盖有机发光器件的第一电极140，如此，发光层130可以将第一电极140与第二反光层120或者第二电极150间隔开，从而保证有机发光器件的性能。
示例性的，如图5A所示，第一子像素1000和第二子像素2000中的发光结构100共用第二反光层120，发光结构100中的其他结构(例如第一反光层110、第一电极120、发光层130、第二电极150或者光学介质层160等)也可以单独设置，如此，在发光结构100的靠近基底200的一端，可以进一步减小第一反光层110和第二反光层120的间隔距离，进一步提升发光结构100的远离基底200的一端(对应于第一反光层110的第二部分112)的出光量。例如，可以利用真空蒸镀等方式制备如图5A所示的发光结构100中的至少部分结构例如发光层130等，从而在不同子像素中形成不同类型的发光层130。
例如，在本公开至少一个实施例提供的显示基板中，第一发光元件和 第二发光元件都具有发光结构，发光结构包括第一反光层以及设置于第一反光层上的发光层，发光层位于显示基板的出光侧，并且第一反光层的上表面相对于显示基板所在面为斜面。图6为本公开一个实施例提供的另一种显示基板的截面图，图7为图6所示显示基板的局部结构示意图。示例性的，如图6和图7所示，发光结构100包括第一反光层110以及设置于第一反光层110的远离基底200一侧的发光层130，第一反光层110的上表面与显示基板所在面相交。如此，发光层130发出的光线中的大部分的传播方向会与第一反光层110的上表面垂直，即第一发光元件1100中出射的光线的传播方向仍趋向于第一方向1110，第二发光元件2100中出射的光线的传播方向仍趋向于第二方向2110，使得显示基板可以实现三维显示。此外，第一反光层110设置为斜面，可以增加发光层130的面积，即增加了发光结构100的发光面积，提升显示基板的显示图像的亮度。
例如，在本公开至少一个实施例提供的显示基板中，第一反光层的上表面与显示基板所在面的夹角为15～45度，进一步例如约20度、约30度、约40度等。
需要说明的是，与如图2和图3A所示的实施例中的发光结构相比，在如图6和图7所示的实施例中，发光结构100未设置第二反光层120，发光层130产生的光线直接出射或者由第一反光层110反射。所以，如图6和图7所示的实施例中的发光结构的具体化设计可以参考如图2和图3A所示的实施例中的发光结构，本公开至少一个实施例在此不做赘述。
在本公开至少一个实施例中，对发光结构中的第一反光层设计为斜面或者第一反光层中的第二部分设计为斜面的具体方式不做限制。
例如，在本公开至少一个实施例中，显示基板还包括设置于基底上的像素界定层，像素界定层限定发光结构的位置。例如，像素界定层中设置有多个凹槽，发光结构位于凹槽中，并且凹槽包括至少一个相对于显示基板所在面为斜面的第一侧表面，第二部分位于第一侧表面上。如此，第二部分的上表面相对于显示基板所在面也为斜面。例如，第一反光层和/或第二反光层的全部位于第一侧表面上。示例性的，如图2、图3A、图3B、图4、图6和图7所示，基底200上可以设置有像素界定层300，发光结构100位于像素界定层300的凹槽310中。凹槽310的第一侧表面(图中未示出，请参考图9C的第一侧表面31)的部分区域或者全部区域设置为斜 面，如此，可以使得形成在该第一侧表面上的第一反光层110具有相应的形状。形成上述结构的凹槽310的方法可以参考下述实施例(关于显示基板的制备方法的实施例)中的相关内容，本公开至少一个实施例在此不做赘述。
例如，在本公开至少一个实施例中，第一侧表面的与第二部分重叠的部分为平面或者曲面。如此，第二部分的上表面可以形成为平面或曲面。例如，第一侧表面的全部为平面或者曲面。
在本公开至少一个实施例中，对第一子像素和第二子像素在显示基板上的排布不做限制，对第一子像素的发光颜色和第二子像素的发光颜色的排布不做限制，只要多个第一子像素和多个第二子像素都可以构成视差图像，并且多个第一子像素构成的视差图像和多个第二子像素构成的视差图像不同，使得显示基板可以实现三维显示即可。
示例性的，如图1所示，多个第一子像素1000和多个第二子像素2000可以交替排布。进一步地，相邻的第一子像素1000和第二子像素2000可以成对设置于例如像素界定层300的一个凹槽310中。如此，可以简化显示基板的制备工艺(例如简化在像素界定层300中形成凹槽310的制备工艺)。
示例性的，图8A为本公开一个实施例提供的另一种显示基板的平面图，图8B为图8A所示显示基板沿E-F的截面图，图8B为图8A所示的相邻第一子像素1000的截面图。如图8A和图8B所示，多个相邻的第一子像素1000可以设置为一组，多个相邻的第二子像素2000可以设置为另一组，多个第一子像素1000和多个第二子像素2000以组的方式交替排布在显示基板上。例如，相邻的三个第一子像素1000为一组，每组第一子像素1000分别包括可以发出红、绿、蓝三种颜色光线的子像素，相邻的三个第二子像素2000为一组，每组第二子像素2000分别包括可以发出红、绿、蓝三种颜色光线的子像素。
本公开至少一个实施例提供一种显示面板，包括上述任一实施例中的显示基板。例如，显示面板中的显示基板可以为柔性基板以应用于柔性显示领域。例如，在本公开实施例提供的显示面板中，可以在显示基板上设置触控基板以使得显示面板获得触控显示功能。
例如，该显示面板可以为电视、数码相机、手机、手表、平板电 脑、笔记本电脑、导航仪等任何具有显示功能的产品或者部件。
本公开至少一个实施例提供一种显示基板的制备方法，其中，显示基板包括至少一个第一子像素和至少一个第二子像素，方法包括：在第一子像素中形成第一发光元件以及在第二子像素中形成第二发光元件；其中，第一发光元件和第二发光元件的出光方向不同，以使得第一子像素和第二子像素具有不同的显示方向。例如，第一发光元件形成为出射面的法线具有第一方向，第一方向为第一子像素的显示方向，第二发光元件形成为发射面的法线具有第二方向，第二方向为第二子像素的显示方向。例如，第一方向和第二方向交叉。在利用上述制备方法获得的显示基板中，第一子像素和第二子像素可以出射不同方向的光线，即二者出射的光线可以直接构成不同的视差图像，使得显示基板具有三维显示功能，如此，构成视差图像的光线没有减损，使得该视差图像具有较高的亮度。此外，显示基板的每个子像素单元发出的光线都可以被用户接收，可以保证显示基板提供的三维显示图像具有较高的分辨率。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，第一发光元件和第二发光元件都包括发光结构，形成发光结构包括：形成第一反光层、与第一反光层相对的第二反光层以及在第一反光层和第二反光层之间形成发光层，第二反光层位于显示基板的出光侧；其中，第二反光层位于显示基板的出光侧，并且第一反光层的面积大于第二反光层的面积。例如，在发光结构的出光方向上，第一反光层包括与第二反光层重叠的第一部分和未与第二反光层重叠的第二部分。在由上述制备方法获得的显示基板中，发光结构中的发光层发出的光线会在第一反光层和第二反光层之间全反射，然后集中在第一反光层的第二部分上并被第二部分反射出去，如此，可以使得发光结构的光线趋向于同一个方向(例如第一方向或者第二方向)，提高发光结构的出射光线的亮度。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：形成像素界定层，在像素界定层中形成多个凹槽，并且凹槽的至少一个第一侧表面形成为相对于显示基板所在面为斜面，发光结构形成在凹槽中，并且第一反光层的第二部分形成在第一侧表面上。由该制备方法获得的显示基板的结构可以参考前述实施例中的相关说明，在此不做赘述。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，第一 侧表面的与第二部分重叠的部分形成为平面或者曲面。由该制备方法获得的显示基板的结构可以参考前述实施例中的相关说明，在此不做赘述。
例如，本公开至少一个实施例提供的显示基板的制备方法还包括：在第一反光层和发光层之间或发光层和第二反光层之间形成光学介质层。光学介质层可以增加第一反光层和第二反光层之间的间距，避免光在第一反光层和第二反光层之间发生干涉。
例如，在本公开至少一个实施例提供的显示基板的制备方法中，第一发光元件和第二发光元件都包括发光结构，形成发光结构包括：形成第一反光层以及在第一反光层上形成发光层，发光层形成在显示基板的出光侧；其中，第一反光层的上表面与基底所在面的倾角相对于显示基板所在面为斜面。第一反光层形成为斜面，可以增加发光层的面积，即增加了发光结构的发光面积，提升显示基板的显示图像的亮度。
需要说明的是，通过上述制备方法获得的显示基板的结构，可以参考前述实施例(关于显示基板的实施例)中的相关内容，本公开至少一个实施例在此不做赘述。
下面，在本公开至少一个实施例中，对显示基板的制备方法进行说明，图9A～图9F为本公开一个实施例提供的一种显示基板的制备方法的过程图。例如图9A～图9F所示，以制备如图2所示的显示基板为例，本公开至少一个实施例提供的显示基板的制备方法可以包括如下过程。
如图9A所示，提供基底200并且在所述基底200上沉积绝缘材料薄膜以形成像素界定层300。基底200可以为阵列基板，基底200中可以设置有多个开关元件例如薄膜晶体管以及相应的控制电路等。基底200的制备方式可以参考常规阵列基板的制备方法，本公开至少一个实施例在此不做赘述。
例如，用于形成像素界定层300的材料可以为正性光刻胶。
如图9B和图9C所示，提供掩模板400，然后对像素界定层300进行曝光、显影，然后在像素界定层300中形成凹槽310。
例如，掩模板400可以包括第一区域410、第二区域420和第三区域430，第一区域410可以为透明区域，第二区域420可以为透光率渐变区域，第三区域430为遮光区域。例如，第一区域410和与其相邻的第二区域420用于形成凹槽310，第一区域410位于两个第二区域420之间，第二区域 420对应于欲形成的凹槽310的第一侧表面311。从第二区域420的靠近第三区域430的一端至第二区域420的靠近第一区域410的一端的方向(图9B和图9C中的箭头“→”的方向)上，第二区域420的透光率逐渐增加，如此，在对像素界定层300曝光、显影后可以形成如图9C中所示的凹槽310。
需要说明的是，掩模板400的具体设计可以根据凹槽300的具体形状来选择。例如，如果凹槽310的两个第一侧表面311相连(例如凹槽的截面形状为弧形)，掩模板400中也可以不设置第一区域410。
如图9D所示，在基底200上沉积反光材料薄膜并对其进行构图工艺以形成第一反光层110。
本公开至少一个实施例对第一反光层110的制备材料不做限制。例如，第一反光层110的制备材料可以包括金属例如金、银、铜、铝等及其合金。需要说明的是，在第一反光层110的材料为导电材料的情况下，第一子像素1000和第二子像素2000中的第一反光层110为彼此间隔设置；在第一反光层110的材料为绝缘材料的情况下，第一子像素1000和第二子像素2000中的第一反光层110可以为彼此间隔设置，也可以为一体化设置。
例如，在本公开至少一个实施例中，构图工艺例如可以为光刻构图工艺，其例如可以包括：在需要被构图的结构层上涂覆光阻材料(photoresist)膜(光刻胶)，光阻材料膜的涂覆可以采用旋涂、刮涂或者辊涂的方式；接着使用掩模板对光阻材料层进行曝光，对曝光的光阻材料层进行显影以得到光阻材料图案；然后使用光阻材料图案作为掩膜对结构层进行蚀刻；最后剥离剩余的光阻材料以形成需要的图案结构。
在本公开至少一个实施例中，对凹槽310中形成第一反光层110的具体方式不做限制。例如，在本公开至少一个实施例中，可以通过磁控溅射或者真空蒸镀等方式在凹槽310中形成第一反光层110。
如图9E所示，在凹槽310中形成有机发光器件，即分别在第一子像素1000和第二子像素2000中形成有机发光器件。
例如，形成有机发光器件的过程可以包括：在凹槽310中依次形成第一电极140、有机发光层(发光层130)和第二电极150。例如，在不影响显示基板的显示功能的情况下，第一子像素1000中的第二电极150和第二子像素2000中的第二电极150可以设置为一体化结构，进一步的，第二电 极150可以设置为覆盖显示基板的表面以作为所有子像素的公共电极，可以简化显示基板的制备工艺，降低成本。例如，如果第一反光层110可以作为有机发光器件的电极，也可以不需要再形成第一电极140。
例如，在形成第一电极140之前，可以对第一反光层110以及基底200的相关结构进行构图工艺以形成过孔，使得第一电极140可以与基底200中的开关元件电连接。例如，有机发光器中还可以形成空穴注入层、空穴传输层、电子传输层和电子注入层等结构。形成有机发光器件的具体方法可以参考常规有机发光器件的制备方法，本公开至少一个实施例在此不做赘述。例如，空穴注入层、空穴传输层、电子传输层、电子注入层和第二电极150可以覆盖整个凹槽310以作为第一子像素1000和第二子像素2000的共用结构。例如，发光层130可以覆盖整个凹槽310以作为第一子像素1000和第二子像素2000的共用结构；或者可以通过例如真空蒸镀的方式在第一子像素1000和第二子像素2000中分别形成。
如图9F所示，在基底200上沉积透明材料薄膜并对其进行构图工艺以形成光学介质层160。例如，光学介质层160的厚度随至基底200的距离的增加而增大。
例如，光学介质层160的制备材料可以为光刻胶。形成如图9F所示形状的光学介质层160的方法，可以参考如图9B和图9C所示的形成凹槽310的相关说明，本公开至少一个实施例在此不做赘述。
如图2所示，在基底200上沉积反光材料薄膜并对其进行构图工艺以形成第二反光层120。本公开至少一个实施例对第二反光层120的制备材料不做限制。例如，在本公开一些实施例中，第二反光层120可以为单层反光层，第二反光层120的制备材料可以包括金属例如金、银、铜、铝等及其合金。例如，在本公开另一些实施例中，第二反光层120的可以为复合层，该复合层可以为多个膜层构成的高反射膜系。例如，该高反射膜系包括由高折射率膜层和低折射率膜层交替叠成的膜系。例如，该高折射率膜层的材料可以为硫化锌等，该低折射率膜层的材料可以为氟化镁等。例如，高折射率膜层和低折射率膜层的膜层的光学厚度可以设定为欲反射的光的波长的1/4。
需要说明是，在如图9A～图9F和图2所示的显示基板的制备方法的过程中，可以不需要制备光学介质层160和第二反光层120，以形成如图6 所示的显示基板。
本公开至少一个实施例提供一种显示基板及其制备方法、显示面板，并且可以具有以下至少一项有益效果：
(1)本公开至少一个实施例提供一种显示基板，第一子像素和第二子像素可以出射不同方向的光线，即二者出射的光线可以直接构成不同的视差图像，使得显示基板具有三维显示功能，并且显示图像亮度和分辨率显著提高。
(2)在本公开至少一个实施例提供一种显示基板中，发光结构至少部分区域相对于显示基板所在面倾斜设置，可以增加发光结构的发光面积，进一步增加显示基板的显示图像的亮度。
对于本公开，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种显示基板，包括：
    至少一个第一子像素和至少一个第二子像素，所述第一子像素和所述第二子像素具有不同的显示方向；
    其中，所述第一子像素包括第一发光元件，所述第二子像素包括第二发光元件，所述第一发光元件和所述第二发光元件都具有发光结构，所述发光结构包括第一反光层、与所述第一反光层相对的第二反光层以及设置于所述第一反光层和所述第二反光层之间的发光层，所述第二反光层位于所述显示基板的出光侧，并且
    所述第一反光层的面积大于所述第二反光层的面积。
  2. 根据权利要求1所述的显示基板，其中，
    在每个所述发光结构中，沿着所述显示方向，所述第一反光层包括与所述第二反光层重叠第一部分和与所述第二反光层不重叠的第二部分。
  3. 根据权利要求2所述的显示基板，其中，
    所述第二部分的面向所述发光层的表面的切面与所述显示基板所在面的夹角为15～45度。
  4. 根据权利要求2或3所述的显示基板，其中，
    所述第二部分位于所述第一反光层的靠近所述显示基板的出光侧的一端；或者
    所述第二部分位于所述第一反光层的中间。
  5. 根据权利要求2-4中任一项所述的显示基板，其中，
    所述第二部分与所述第一反光层的面积比为5％～15％。
  6. 根据权利要求2-5中任一项所述的显示基板，其中，
    所述第一部分的靠近所述第二部分的一端与所述第二反光层的间距大于所述第一部分的远离所述第二部分的一端与所述第二反光层的间距。
  7. 根据权利要求2-6中任一项所述的显示基板，其中，
    从所述第一部分的远离所述第二部分的一端至所述第一部分的靠近所述第二部分的一端，所述第一反光层和所述第二反光层之间的间距逐渐增加。
  8. 根据权利要求2-7中任一项所述的显示基板，还包括像素界定层， 其中，
    所述像素界定层中设置有多个凹槽，所述发光结构位于所述凹槽中，并且
    所述凹槽包括至少一个相对于所述显示基板所在面为斜面的第一侧表面，所述第二部分位于所述第一侧表面上。
  9. 根据权利要求8所述的显示基板，其中，
    所述第一侧表面的与所述第二部分重叠的部分为平面或者曲面。
  10. 根据权利要求2-9中任一项所述的显示基板，其中，
    所述发光结构包括有机发光器件，所述发光层为有机发光层，所述有机发光器件包括第一电极、第二电极以及位于所述第一电极和所述第二电极之间的所述有机发光层，所述第二电极位于所述显示基板的出光侧。
  11. 根据权利要求10所述的显示基板，其中，
    所述第一电极和所述第一反光层具有一体结构；和/或
    所述第二电极和所述第二反光层具有一体结构。
  12. 根据权利要求10所述的显示基板，其中，所述第一发光元件和所述第二发光元件中的至少一个还包括：
    光学介质层，位于所述第一反光层和所述发光层之间；或者位于所述第二反光层和所述发光层之间。
  13. 根据权利要求12所述的显示基板，其中，
    所述光学介质层的与所述第二部分重叠的部分的厚度大于所述光学介质层的与所述第一部分重叠的部分的厚度。
  14. 根据权利要求13所述的显示基板，其中，
    从所述第一部分的远离所述第二部分的一端至所述第一部分的靠近所述第二部分的一端，所述光学介质层的与所述第一部分重叠的部分的厚度逐渐增加。
  15. 根据权利要求1-14中任一项所述的显示基板，其中，
    所述第一反光层的面向所述发光层的表面的切面相对于所述显示基板所在面为斜面。
  16. 根据权利要求15所述的显示基板，其中，
    所述第一反光层的面向所述发光层的表面的切面与所述显示基板所在面的夹角为15～45度。
  17. 一种显示面板，包括权利要求1-16中任一项所述的显示基板。
  18. 一种显示基板的制备方法，其中，所述显示基板包括至少一个第一子像素和至少一个第二子像素，所述方法包括：
    形成发光结构，所述发光结构包括第一反光层、与所述第一反光层相对的第二反光层以及位于所述第一反光层和所述第二反光层之间的发光层；
    在所述第一子像素中形成包括所述发光结构的第一发光元件，在所述第二子像素中形成包括所述发光结构的第二发光元件；
    其中，所述第二反光层位于所述显示基板的出光侧，并且所述第一反光层的面积大于所述第二反光层的面积，以及
    所述第一发光元件和所述第二发光元件的出光方向不同，以使得所述第一子像素和所述第二子像素具有不同的显示方向。
  19. 根据权利要求18所述的制备方法，还包括：
    形成像素界定层，在所述像素界定层中形成多个凹槽，并且所述凹槽的至少一个第一侧表面形成为相对于所述显示基板所在面为斜面；
    其中，所述发光结构形成在所述凹槽中，并且第一反光层的所述第二部分形成在所述第一侧表面上。
  20. 根据权利要求19所述的制备方法，其中，
    所述第一侧表面的与所述第二部分重叠的部分形成为平面或者曲面。
PCT/CN2018/105496 2017-11-22 2018-09-13 显示基板及其制备方法、显示面板 Ceased WO2019100820A1 (zh)

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