WO2019114572A1 - 阵列基板、其制备方法、指纹识别方法及显示装置 - Google Patents
阵列基板、其制备方法、指纹识别方法及显示装置 Download PDFInfo
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- WO2019114572A1 WO2019114572A1 PCT/CN2018/118681 CN2018118681W WO2019114572A1 WO 2019114572 A1 WO2019114572 A1 WO 2019114572A1 CN 2018118681 W CN2018118681 W CN 2018118681W WO 2019114572 A1 WO2019114572 A1 WO 2019114572A1
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- array substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- An embodiment of the present disclosure further provides a display device including the array substrate provided by the embodiment of the present disclosure.
- the array substrate provided by the embodiment of the present disclosure can reduce the area of the non-display area of the array substrate by setting the fingerprint recognition unit in the display area of the array substrate, thereby facilitating the narrow frame design of the array substrate. Moreover, by making the orthographic projection of the through hole in the fingerprint recognition unit and the orthographic projection of the pixel unit on the substrate substrate do not overlap, the aperture ratio of the array substrate can be avoided without avoiding each of the pixel units.
- the film layer occludes the fingerprint recognition unit to facilitate the fingerprint recognition function of the array substrate.
- the light shielding layer may be disposed between the pixel unit and the substrate.
- the preparation method provided by the embodiment of the present disclosure may specifically include the following steps:
- the embodiment of the present disclosure further provides a fingerprint identification method by using the above array substrate. As shown in FIG. 7, the following steps may be included:
- the principle of the fingerprint identification method is similar to that of the foregoing array substrate. Therefore, the implementation of the fingerprint identification method can be referred to the implementation of the foregoing array substrate, and the repeated description is omitted.
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- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Image Input (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (16)
- 一种阵列基板,其中,包括:衬底基板;位于所述衬底基板的显示区域内的多个像素单元、以及多个指纹识别单元;所述指纹识别单元包括:位于所述衬底基板上的遮光层和感光图像传感器;所述遮光层设置有用于实现小孔成像的通孔;所述通孔在所述衬底基板的正投影与所述像素单元在所述衬底基板的正投影均不交叠;所述感光图像传感器用于接收指纹通过所述通孔所成的像。
- 如权利要求1所述的阵列基板,其中,所述通孔的直径的取值范围为5微米~20微米。
- 如权利要求1所述的阵列基板,其中,所述通孔在所述衬底基板上呈阵列排列。
- 如权利要求1所述的阵列基板,其中,所述遮光层在所述衬底基板的正投影覆盖所述像素单元在所述衬底基板的正投影。
- 如权利要求1-5任一项所述的阵列基板,其中,所述遮光层位于所述衬底基板设置有所述像素单元的一侧。
- 如权利要求6所述的阵列基板,其中,所述遮光层位于所述衬底基板 与所述像素单元之间。
- 如权利要求7所述的阵列基板,其中,所述阵列基板还包括:位于所述遮光层与所述像素单元之间的低温介质层。
- 如权利要求1-5任一项所述的阵列基板,其中,所述阵列基板还包括:与所述像素单元连接的导线;所述通孔在所述衬底基板的正投影与所述导线在所述衬底基板的正投影均不交叠。
- 如权利要求1-5任一项所述的阵列基板,其中,所述衬底基板包括至少两层柔性层,所述遮光层设置在相邻的两层所述柔性层之间。
- 如权利要求1-5任一项所述的阵列基板,其中,所述感光图像传感器位于所述衬底基板背向所述遮光层的一侧且与所述通孔对应位置。
- 如权利要求11所述的阵列基板,其中,所述感光图像传感器包括CCD感光图像传感器或CMOS感光图像传感器。
- 一种如权利要求1-12任一项所述的阵列基板的制备方法,其中,包括:在衬底基板的显示区域内形成多个像素单元以及多个指纹识别单元;其中,所述指纹识别单元包括:位于所述衬底基板上的遮光层和感光图像传感器;所述遮光层设置有用于实现小孔成像的通孔;所述通孔在所述衬底基板的正投影与所述像素单元在所述衬底基板的正投影不交叠;所述感光图像传感器用于接收指纹通过所述通孔所成的像。
- 如权利要求13所述的制备方法,其中,所述制备方法具体包括:在所述衬底基板上形成所述遮光层;对所述遮光层进行构图,在所述指纹识别单元所在区域内形成所述通孔;在形成有所述通孔的遮光层上形成所述像素单元;在所述衬底基板背向所述遮光层的一侧与所述通孔对应的位置设置所述感光图像传感器。
- 一种如权利要求1-12任一项所述的阵列基板的指纹识别方法,其中, 包括:获取所述感光图像传感器的成像图像;其中,所述成像图像为指纹反射所述像素单元发出的光经所述通孔在所述通孔对应的感光图像传感器上成像的图像;根据获取到的所述感光图像传感器成像的图像,确定指纹完整的指纹图像。
- 一种显示装置,其中,包括权利要求1-12任一项所述的阵列基板。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019561147A JP2021507324A (ja) | 2017-12-14 | 2018-11-30 | アレイ基板、その製造方法、指紋認識方法及び表示装置 |
| EP18889260.8A EP3726418B1 (en) | 2017-12-14 | 2018-11-30 | Array substrate and preparation method therefor, fingerprint recognition method, and display device |
| US16/620,983 US11100308B2 (en) | 2017-12-14 | 2018-11-30 | Array substrate and preparation method therefor, fingerprint recognition method, and display device |
| JP2024072616A JP7699265B2 (ja) | 2017-12-14 | 2024-04-26 | アレイ基板、その製造方法、指紋認識方法及び表示装置 |
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| CN201711338861.0 | 2017-12-14 | ||
| CN201711338861.0A CN107832749B (zh) | 2017-12-14 | 2017-12-14 | 一种阵列基板、其制备方法、指纹识别方法及显示装置 |
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| WO2019114572A1 true WO2019114572A1 (zh) | 2019-06-20 |
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| US (1) | US11100308B2 (zh) |
| EP (1) | EP3726418B1 (zh) |
| JP (2) | JP2021507324A (zh) |
| CN (1) | CN107832749B (zh) |
| WO (1) | WO2019114572A1 (zh) |
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| US20190245011A1 (en) * | 2018-02-06 | 2019-08-08 | Innolux Corporation | Display device |
| CN108598111B (zh) * | 2018-04-24 | 2021-01-29 | 京东方科技集团股份有限公司 | 具有指纹识别功能的显示基板、方法及显示装置 |
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| CN108073900B (zh) * | 2017-12-14 | 2021-01-08 | 京东方科技集团股份有限公司 | 用于指纹识别的柔性显示面板、显示装置及指纹识别方法 |
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2017
- 2017-12-14 CN CN201711338861.0A patent/CN107832749B/zh active Active
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2018
- 2018-11-30 JP JP2019561147A patent/JP2021507324A/ja active Pending
- 2018-11-30 US US16/620,983 patent/US11100308B2/en active Active
- 2018-11-30 EP EP18889260.8A patent/EP3726418B1/en active Active
- 2018-11-30 WO PCT/CN2018/118681 patent/WO2019114572A1/zh not_active Ceased
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2024
- 2024-04-26 JP JP2024072616A patent/JP7699265B2/ja active Active
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| US20130113695A1 (en) * | 2011-11-08 | 2013-05-09 | Au Optronics Corporation | Display device |
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| CN206193837U (zh) * | 2016-09-26 | 2017-05-24 | 惠州Tcl移动通信有限公司 | 移动终端及其指纹识别模组 |
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| CN107832749A (zh) * | 2017-12-14 | 2018-03-23 | 京东方科技集团股份有限公司 | 一种阵列基板、其制备方法、指纹识别方法及显示装置 |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3726418A4 (en) | 2021-08-25 |
| JP2021507324A (ja) | 2021-02-22 |
| US11100308B2 (en) | 2021-08-24 |
| EP3726418B1 (en) | 2025-10-29 |
| CN107832749B (zh) | 2021-01-22 |
| EP3726418A1 (en) | 2020-10-21 |
| JP2024100781A (ja) | 2024-07-26 |
| US20200202099A1 (en) | 2020-06-25 |
| CN107832749A (zh) | 2018-03-23 |
| JP7699265B2 (ja) | 2025-06-26 |
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