WO2019179353A1 - 摄像头模组及移动终端 - Google Patents

摄像头模组及移动终端 Download PDF

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Publication number
WO2019179353A1
WO2019179353A1 PCT/CN2019/078123 CN2019078123W WO2019179353A1 WO 2019179353 A1 WO2019179353 A1 WO 2019179353A1 CN 2019078123 W CN2019078123 W CN 2019078123W WO 2019179353 A1 WO2019179353 A1 WO 2019179353A1
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WO
WIPO (PCT)
Prior art keywords
camera
height
circuit board
top surface
ois
Prior art date
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Ceased
Application number
PCT/CN2019/078123
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English (en)
French (fr)
Inventor
丁建
高军科
朱丽君
尚空空
陈碧军
姚鸿志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to US16/981,575 priority Critical patent/US11272088B2/en
Priority to EP19770813.4A priority patent/EP3771194B1/en
Publication of WO2019179353A1 publication Critical patent/WO2019179353A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly

Definitions

  • the present disclosure relates to the field of communications technologies, and in particular, to a camera module and a mobile terminal.
  • Optical Image Stabilization (OIS) technology has been widely used in mobile terminals. Its main function is to reduce image blur caused by jitter during photo shooting and to reduce shutter speed to obtain higher quality images.
  • the printed circuit board (PCB) of the main camera is extended out of the camera body to arrange the OIS chip. This makes the size of the camera module larger, and also increases the avoidance space of the PCB board of the mobile terminal.
  • the embodiment of the present disclosure provides a camera module and a mobile terminal to solve the problem of a large size of the camera module in the related art.
  • an embodiment of the present disclosure provides a camera module, including a first camera, a second camera, an optical anti-shake OIS chip, and a bracket, wherein the first camera and the second camera are embedded in the bracket.
  • the height of the lens top surface of the first camera to the bottom surface of the first camera is greater than the height of the lens top surface of the second camera to the bottom surface of the second camera, and the end of the first camera away from the lens a first printed circuit board is disposed, the first printed circuit board extends outside the first camera and faces the second camera, and the OIS chip is disposed on the first printed circuit board and faces the The bottom surface of the second camera is electrically connected to the first printed circuit board.
  • an embodiment of the present disclosure further provides a mobile terminal, where the mobile terminal includes the camera module as described in the first aspect.
  • the bottom of the first camera that is, the end away from the lens thereof, is provided with a PCB board, and the PCB board extends to the outside of the first camera and is located below the second camera, and the OIS chip is disposed on the PCB board.
  • This also causes the OIS chip to be located below the second camera.
  • the space under the second camera is rationally utilized, so that the arrangement of the OIS components does not need to additionally space the other orientations of the camera module, thereby reducing the volume of the camera module and making the space of the camera module in the mobile terminal. Reduced, more convenient layout of the camera module and other components in the mobile terminal.
  • FIG. 1 is an exploded view of a camera module according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of the camera module of FIG. 1;
  • Figure 3 is a bottom plan view of the camera module of Figure 2.
  • an embodiment of the present disclosure provides a camera module, including a first camera 10 , a second camera 20 , an OIS chip 11 , and a bracket 30 .
  • the first camera 10 and the second camera 20 are connected to a camera module, including a first camera 10 , a second camera 20 , an OIS chip 11 , and a bracket 30 .
  • the height of the top surface of the lens 14 of the first camera to the bottom surface of the first camera 10 is greater than the height of the top surface of the lens 22 of the second camera to the bottom surface of the second camera 20,
  • An end of the first camera 10 remote from the lens is provided with a first printed circuit board 12 extending to the outside of the first camera 10 and facing the second camera 20,
  • the OIS chip 11 is disposed on the first printed circuit board 12 and faces the bottom surface of the second camera 20, and the OIS chip 11 is electrically connected to the first printed circuit board 12.
  • the bracket 30 is used to fix the first camera 10 and the second camera 20, for example, the first camera 10 and the second camera 20 and the bracket 30 may be bonded, or may be a snap connection or the like.
  • the first camera 10 and the second camera 20 are arranged side by side, so as to achieve the purpose of simultaneously capturing images by the two cameras.
  • the bottom of the first camera 10, that is, the end away from the lens thereof, is provided with a first printed circuit board 12, and the first PCB board 12 extends outside the first camera 10 and below the second camera 20, and is disposed on the first printed circuit board 12.
  • the space under the second camera 20 is rationally utilized, so that the arrangement of the OIS chip 11 does not need to additionally space the other orientations of the camera module, thereby reducing the volume of the camera module, so that the camera module is in the mobile terminal.
  • the avoidance space is reduced, and the layout of the camera module and other components in the mobile terminal is more convenient.
  • the lens 14 of the first camera is arranged side by side with the lens 22 of the second camera, and the height of the top surface of the lens 14 of the first camera to the bottom surface of the first camera 10 is greater than the lens 22 of the second camera.
  • the height of the surface to the bottom surface of the second camera 20, that is, the height of the first camera 10 is greater than the height of the second camera 20.
  • the layout of the first camera 10 and the second camera 20 may be that the top surface of the lens 14 of the first camera is in the same plane as the top surface of the lens 22 of the second camera; or, the top surface of the lens 14 of the first camera may be slightly higher.
  • the top surface of the lens 22 of the second camera or the top surface of the lens 22 of the second camera is slightly higher than the top surface of the lens 14 of the first camera. It should be noted that the bottom surface of the first camera 10 and the bottom surface of the second camera 20 are not in the same plane, and the bottom surface of the first camera 10 is connected to the whole PCB board of the mobile terminal, and the bottom surface of the second camera 20 is Located above the PCB board.
  • the bottom surface of the first camera 10 is the first printed circuit board 12, that is, the height of the first camera 10 is between the top surface of the lens 14 of the first camera and the bottom surface of the first printed circuit board 12. distance.
  • the first printed circuit board 12 is electrically connected to the whole PCB board.
  • the sum of the height H3 from the top surface of the OIS chip 11 to the bottom surface of the first printed circuit board 12 and the height H2 of the top surface of the lens 22 of the second camera to the bottom surface of the second camera 20 is less than Or equal to the height H1 of the top surface of the lens 14 of the first camera to the bottom surface of the first camera 10, that is, H2+H3 ⁇ H1.
  • the occupied height of the camera module in the mobile terminal is also the height H1 of the first camera 10.
  • the height H2 of the second camera 20 and the height H3 of the top surface of the OIS chip 11 to the bottom surface of the first printed circuit board 12 are smaller than the height H1 of the first camera 10, so that the top of the OIS chip 11 is A gap is left between the surface and the bottom surface of the second camera 20 to prevent the second camera 20 from contacting the OIS chip 11 to cause wear on the OIS chip 11, and also to facilitate heat dissipation of the OIS chip 11.
  • the top surface of the lens 14 of the first camera is in the same plane as the top surface of the lens 22 of the second camera. Since the sum of the height of the second camera 20 and the height of the OIS chip 11 does not exceed the height of the first camera 10, such an arrangement makes the OIS chip 11 located under the second camera 20 have a larger installation space, and Convenient for the installation layout of the OIS chip 11.
  • the bracket 30 is provided with a first through hole 301 and a second through hole 302 .
  • the first through hole 301 and the second through hole 302 have the same opening direction, that is, the first A through hole 301 is disposed alongside the second through hole 302; the first camera 10 is embedded in the first through hole 301, and the second camera 20 is embedded in the second through hole 302. It can be understood that the first through hole 301 is disposed adjacent to the second through hole 302 so that the first camera 10 and the second camera 20 can be arranged side by side.
  • first camera 10 may be inserted through the first through hole 301, or a part of the first camera 10 may be embedded in the first through hole 301; the second camera 20 may also be inserted through the second through hole 302, or may be A portion of the second camera 20 is embedded in the second through hole 302.
  • the bracket 30 includes a first frame body 31 forming the first through hole 301 and a second frame body 32 forming the second through hole 302.
  • the top surface of the first frame body 31 is The top surface of the second frame body 32 is located in the same plane, and the height of the top surface of the first frame body 31 to the bottom surface of the first frame body 31 is greater than the top surface of the second frame body 32 to the The height of the bottom surface of the second frame 32.
  • the height of the first camera 10 is greater than the height of the second camera 20, and the height of the first frame 31 is greater than the height of the second frame 32, so that the contact area of the first frame 31 with the first camera 10 can be made. Larger, more secure connection of the first camera 10 to the first frame 31 is ensured.
  • the top surface of the first frame body 31 and the top surface of the second frame body 32 are in the same plane, so that the bottom surface of the second frame body 32 is at a certain distance from the bottom surface of the first frame body 31, thereby facilitating the OIS chip. 11 layout.
  • the sum of the height of the second frame 32 and the height of the OIS chip 11 is less than or equal to the height of the first frame body 31.
  • the top surface of the first camera 10 protrudes above the top surface of the first frame body 31, and the top surface of the second camera 20 protrudes above the top surface of the second frame body 32, and the height of the second frame body 32 is
  • the sum of the heights of the OIS chips 11 is less than or equal to the height of the first frame body 31, thereby ensuring that the sum of the height of the second camera 20 and the height of the OIS chip 11 is less than or equal to the height of the first camera 10.
  • the lens 14 of the first camera protrudes from the first frame 31, and the lens 22 of the second camera protrudes from the second frame 32.
  • the bottom surface of the first camera 10 is in the same plane as the bottom surface of the first frame body 31, and the lens 14 of the first camera protrudes above the first frame body 31; the bottom surface of the second camera 20 and the second frame body 32
  • the bottom surface of the second camera protrudes from the second frame 32, and the top surface of the lens 14 of the first camera is in the same plane as the top surface of the lens 22 of the second camera.
  • the lens 14 of the first camera and the lens 22 of the second camera can protrude from the mobile terminal housing, thereby saving the space occupied by the camera module in the mobile terminal. Conducive to the development of thinning mobile terminals.
  • a first colloid 41 is disposed between the first camera 10 and the first frame 31, and a second colloid 42 is disposed between the second camera 20 and the second frame 32. That is, the first camera 10 and the first frame 31 are bonded by the first colloid 41, and the second camera 20 and the second frame 32 are bonded by the second colloid 42.
  • the manner of bonding makes the connection of the bracket 30 with the first camera 10 and the second camera 20 simpler and more convenient.
  • the height of the first camera 10 includes the height of the first flexible circuit board 13, which is disposed on the side of the first PCB 12 opposite to the first through hole 301 as compared with the first flexible circuit board 13. The internal space of the first camera 10 is utilized, the volume of the camera module is reduced, and the installation space of the camera module is saved.
  • the first flexible circuit board 13 is electrically connected to the first printed circuit board 12
  • the second flexible circuit board 21 is electrically connected to the OIS chip 11
  • the OIS chip 11 is electrically connected to the first printed circuit board 12.
  • the second flexible circuit board 21 realizes electrical connection with the first printed circuit board 12 through the OIS chip 11, which saves consumables of the camera module and saves installation space of the camera module.
  • first flexible circuit board 13 extends to the outside of one end of the bracket 30 facing away from the OIS chip 11 . That is, one end of the first flexible circuit board 13 protruding from the bracket 30 and the OIS chip 11 are respectively located on opposite sides of the bracket 30 to achieve electrical connection with the whole terminal PCB board of the mobile terminal.
  • the embodiment of the present disclosure further provides a mobile terminal, where the mobile terminal includes the camera module as described above.
  • the technical solutions of the present embodiment include all the technical solutions of the foregoing embodiments, so that at least all the technical effects of the foregoing embodiments can be implemented, and details are not described herein again.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)

Abstract

本公开提供一种摄像头模组和移动终端，其中，所述摄像头模组包括第一摄像头、第二摄像头、光学防抖OIS芯片及支架，所述第一摄像头及所述第二摄像头嵌于所述支架，所述第一摄像头的镜头顶面至所述第一摄像头底面的高度大于所述第二摄像头的镜头顶面至所述第二摄像头底面的高度，所述第一摄像头的远离所述镜头的一端设有第一印刷电路板，所述第一印刷电路板延伸至所述第一摄像头外侧且面对所述第二摄像头，所述OIS芯片设于所述第一印刷电路板上且面对所述第二摄像头的底面，所述OIS芯片与所述第一印刷电路板电连接。

Description

摄像头模组及移动终端
相关申请的交叉引用
本申请主张在2018年3月20日在中国提交的中国专利申请No.201810230491.7的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种摄像头模组及移动终端。
背景技术
光学防抖(Optical Image Stabilization，OIS)技术已普遍应用于移动终端，其主要作用是减少照片拍摄过程中由于抖动造成的影像模糊以及降低快门速度获得更高画质的图像。目前，移动终端中的双摄像头模组在布局OIS芯片时，通常是将主摄像头的印刷电路板(Printed Circuit Board，PCB)延伸出摄像头本体外以用来布置OIS芯片。这使得摄像头模组体积变大，也增大了移动终端整机PCB板的避让空间。
发明内容
本公开实施例提供一种摄像头模组及移动终端，以解决相关技术中的摄像头模组体积较大的问题。
第一方面，本公开实施例提供了一种摄像头模组，包括第一摄像头、第二摄像头、光学防抖OIS芯片及支架，所述第一摄像头及所述第二摄像头嵌于所述支架，所述第一摄像头的镜头顶面至所述第一摄像头底面的高度大于所述第二摄像头的镜头顶面至所述第二摄像头底面的高度，所述第一摄像头的远离所述镜头的一端设有第一印刷电路板，所述第一印刷电路板延伸至所述第一摄像头外侧且面对所述第二摄像头，所述OIS芯片设于所述第一印刷电路板上且面对所述第二摄像头的底面，所述OIS芯片与所述第一印刷电路板电连接。
第二方面，本公开实施例还提供了一种移动终端，所述移动终端包括如 第一方面中所述的摄像头模组。
本公开实施例提供的技术方案中，第一摄像头的底部也即远离其镜头的一端设有PCB板，PCB板延伸至第一摄像头外侧且位于第二摄像头下方，PCB板上设有OIS芯片，也就使得OIS芯片位于第二摄像头下方。这样，也就合理利用了第二摄像头下方的空间，使得OIS元件的布置无需另外布局摄像头模组其他方位的空间，减小了摄像头模组的体积，使得摄像头模组在移动终端中的避让空间减小，更加方便摄像头模组及其他部件在移动终端中的布局。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获取其他的附图。
图1是本公开实施例提供的摄像头模组的爆炸图；
图2是图1中摄像头模组的结构示意图；
图3是图2中摄像头模组的仰视图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获取的所有其他实施例，都属于本公开保护的范围。
请参照图1至图3，本公开实施例提供一种摄像头模组，包括第一摄像头10、第二摄像头20、OIS芯片11及支架30，所述第一摄像头10及所述第二摄像头20嵌于所述支架30，所述第一摄像头的镜头14顶面至所述第一摄像头10底面的高度大于所述第二摄像头的镜头22顶面至所述第二摄像头20底面的高度，所述第一摄像头10的远离所述镜头的一端设有第一印刷电路板12，所述第一印刷电路板12延伸至所述第一摄像头10外侧且面对所述第二摄像头20，所述OIS芯片11设于所述第一印刷电路板12上且面对所述第二 摄像头20的底面，所述OIS芯片11与所述第一印刷电路板12电连接。
可以理解地，支架30用以对第一摄像头10及第二摄像头20起到固定作用，例如，第一摄像头10及第二摄像头20与支架30可以是粘接，或者也可以是卡合连接等。第一摄像头10及第二摄像头20并排设置，这样以实现两个摄像头同时采集影像的目的。第一摄像头10的底部也即远离其镜头的一端设有第一印刷电路板12，第一PCB板12延伸至第一摄像头10外侧且位于第二摄像头20下方，第一印刷电路板12上设有OIS芯片11，也就使得OIS芯片11位于第二摄像头20下方。这样，也就合理利用了第二摄像头20下方的空间，使得OIS芯片11的布置无需另外布局摄像头模组其他方位的空间，减小了摄像头模组的体积，使得摄像头模组在移动终端中的避让空间减小，更加方便摄像头模组及其他部件在移动终端中的布局。
本公开实施例中，所述第一摄像头的镜头14与所述第二摄像头的镜头22并排设置，第一摄像头的镜头14顶面至第一摄像头10底面的高度大于第二摄像头的镜头22顶面至第二摄像头20底面的高度，也就是说第一摄像头10的高度大于第二摄像头20的高度。第一摄像头10与第二摄像头20的布局，可以是第一摄像头的镜头14顶面与第二摄像头的镜头22顶面位于同一平面；或者，也可以是第一摄像头的镜头14顶面略高于第二摄像头的镜头22顶面，或第二摄像头的镜头22顶面略高于第一摄像头的镜头14顶面。需要说明的是，所述第一摄像头10的底面与第二摄像头20的底面不位于同一平面，所述第一摄像头10的底面连接于移动终端的整机PCB板上，第二摄像头20的底面位于整机PCB板上方。本公开实施例中，第一摄像头10的底面为第一印刷电路板12，也就是说，第一摄像头10的高度为第一摄像头的镜头14顶面至第一印刷电路板12底面之间的距离。第一印刷电路板12与所述整机PCB板电连接。
请参照图2，所述OIS芯片11顶面至所述第一印刷电路板12底面的高度H3与所述第二摄像头的镜头22顶面至所述第二摄像头20底面的高度H2之和小于或等于所述第一摄像头的镜头14顶面至所述第一摄像头10底面的高度H1，也就是说，H2+H3≤H1。这样，也就使得摄像头模组在移动终端中的占用高度也就是第一摄像头10的高度H1。优选的，第二摄像头20的高度 H2与OIS芯片11顶面至所述第一印刷电路板12底面的高度H3之和小于第一摄像头10的高度H1，这样，也就使得OIS芯片11的顶面与第二摄像头20的底面之间还留有空隙，避免第二摄像头20接触OIS芯片11而造成对OIS芯片11的磨损，也利于OIS芯片11的散热。
本公开实施例中，所述第一摄像头的镜头14顶面与所述第二摄像头的镜头22顶面位于同一平面。由于第二摄像头20的高度与OIS芯片11的高度之和不会超过第一摄像头10的高度，这样的设置，也就使得位于第二摄像头20下方的OIS芯片11具有更大的安装空间，更加方便对OIS芯片11的安装布局。
请具体参照图1，所述支架30设有第一通孔301及第二通孔302，所述第一通孔301及所述第二通孔302的开口方向一致，也就是说所述第一通孔301与所述第二通孔302并排设置；所述第一摄像头10嵌于所述第一通孔301，所述第二摄像头20嵌于所述第二通孔302。可以理解地，第一通孔301与第二通孔302相邻设置，以使得第一摄像头10与第二摄像头20能够并排设置。可以理解地，第一摄像头10可以是贯穿第一通孔301，也可以是第一摄像头10的一部分嵌入第一通孔301；第二摄像头20也可以是贯穿第二通孔302，也可以是第二摄像头20的一部分嵌入第二通孔302。
可选地，所述支架30包括形成所述第一通孔301的第一架体31及形成所述第二通孔302的第二架体32，所述第一架体31的顶面与所述第二架体32的顶面位于同一平面，并且所述第一架体31的顶面至所述第一架体31底面的高度大于所述第二架体32的顶面至所述第二架体32底面的高度。可以理解地，第一摄像头10的高度大于第二摄像头20的高度，则第一架体31的高度大于第二架体32的高度，能够使得第一架体31与第一摄像头10的接触面积更大，更加确保第一摄像头10与第一架体31连接的稳固性。并且，第一架体31的顶面与第二架体32的顶面位于同一平面，也就使得第二架体32的底面距离第一架体31的底面还存在一定距离，进而方便OIS芯片11的布局。
本公开实施例中，所述第二架体32的高度与所述OIS芯片11的高度之和小于或等于所述第一架体31的高度。第一摄像头10的顶面凸出于第一架 体31的顶面之上，第二摄像头20的顶面凸出于第二架体32的顶面之上，第二架体32的高度与所述OIS芯片11的高度之和小于或等于所述第一架体31的高度，进而也就能确保第二摄像头20的高度与OIS芯片11的高度之和小于或等于第一摄像头10的高度，确保OIS芯片11的安装布局空间。
本公开实施例中，所述第一摄像头的镜头14凸出于所述第一架体31，所述第二摄像头的镜头22凸出于所述第二架体32。具体的，第一摄像头10的底面与第一架体31的底面位于同一平面，第一摄像头的镜头14凸出于第一架体31之上；第二摄像头20的底面与第二架体32的底面位于同一平面，第二摄像头的镜头22凸出于第二架体32之上，且第一摄像头的镜头14顶面与第二摄像头的镜头22顶面位于同一平面。这样，当摄像头模组安装于移动终端时，第一摄像头的镜头14与第二摄像头的镜头22可以凸出于移动终端壳体，也就节省了摄像头模组在移动终端内的占用空间，更有利于移动终端薄型化的发展。
可选地，所述第一摄像头10与所述第一架体31之间设有第一胶体41，所述第二摄像头20与所述第二架体32之间设有第二胶体42。也就是说，第一摄像头10与第一架体31通过第一胶体41粘接，第二摄像头20与第二架体32通过第二胶体42粘接。粘接的方式使得支架30与第一摄像头10及第二摄像头20的连接更为简单方便。
本公开实施例中，所述第一印刷电路板12的面对所述第一通孔301的一端设有第一柔性电路板13；所述第二摄像头20的面对所述第一印刷电路板OIS芯片11的一端设有第二柔性电路板21，所述第二柔性电路板21与所述OIS芯片11电连接。这样，第一摄像头10的高度包括了第一柔性电路板13的高度，相比于第一柔性电路板13设于第一PCB12的背对第一通孔301的一侧，这样的设置，合理利用了第一摄像头10的内部空间，减小了摄像头模组的体积，节省了摄像头模组的安装空间。第一柔性电路板13与的第一印刷电路板12电连接，所述第二柔性电路板21与所述OIS芯片11电连接，OIS芯片11与第一印刷电路板12电连接。这样，第二柔性电路板21通过OIS芯片11实现与第一印刷电路板12的电连接，节约了摄像头模组的耗材，也节省了摄像头模组的安装空间。
需要说明的是，所述第一柔性电路板13延伸至所述支架30的背对所述OIS芯片11的一端外侧。也就是说，第一柔性电路板13的凸出于支架30的一端与OIS芯片11分别位于支架30的相对的两侧，以实现与移动终端整机PCB板的电连接。
本公开实施例还提供一种移动终端，所述移动终端包括如上所述的摄像头模组。由于本实施例的技术方案包含了上述实施例的全部技术方案，因此至少能实现上述实施例的全部技术效果，此处不再一一赘述。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种摄像头模组，包括第一摄像头、第二摄像头、光学防抖OIS芯片及支架，所述第一摄像头及所述第二摄像头嵌于所述支架，所述第一摄像头的镜头顶面至所述第一摄像头底面的高度大于所述第二摄像头的镜头顶面至所述第二摄像头底面的高度，所述第一摄像头的远离所述镜头的一端设有第一印刷电路板，所述第一印刷电路板延伸至所述第一摄像头外侧且面对所述第二摄像头，所述OIS芯片设于所述第一印刷电路板上且面对所述第二摄像头的底面，所述OIS芯片与所述第一印刷电路板电连接。
  2. 根据权利要求1所述的摄像头模组，其中，所述OIS芯片顶面至所述第一印刷电路板底面的高度与所述第二摄像头的镜头顶面至所述第二摄像头底面的高度的和小于或等于所述第一摄像头的镜头顶面至所述第一摄像头底面的高度。
  3. 根据权利要求1所述的摄像头模组，其中，所述第一摄像头的镜头顶面与所述第二摄像头的镜头顶面位于同一平面。
  4. 根据权利要求1至3中任一项所述的摄像头模组，其中，所述支架设有第一通孔及第二通孔，所述第一通孔及所述第二通孔的开口方向一致，所述第一摄像头嵌于所述第一通孔，所述第二摄像头嵌于所述第二通孔。
  5. 根据权利要求4所述的摄像头模组，其中，所述支架包括形成所述第一通孔的第一架体及形成所述第二通孔的第二架体，所述第一架体的顶面与所述第二架体的顶面位于同一平面，所述第一架体的顶面至所述第一架体底面的高度大于所述第二架体的顶面至所述第二架体底面的高度。
  6. 根据权利要求5所述的摄像头模组，其中，所述第二架体的高度与所述OIS芯片的高度之和小于或等于所述第一架体的高度。
  7. 根据权利要求6所述的摄像头模组，其中，所述第一摄像头的镜头凸出于所述第一架体，所述第二摄像头的镜头凸出于所述第二架体。
  8. 根据权利要求5所述的摄像头模组，其中，所述第一摄像头与所述第一架体之间设有第一胶体，所述第二摄像头与所述第二架体之间设有第二胶体。
  9. 根据权利要求4所述的摄像头模组，其中，所述第一印刷电路板的面对所述第一通孔的一端设有柔性电路板，所述柔性电路板延伸至所述支架的背对所述OIS芯片的一端外侧。
  10. 一种移动终端，包括如权利要求1至9中任一项所述的摄像头模组。
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