WO2019183968A1 - 服务器的机箱和服务器 - Google Patents

服务器的机箱和服务器 Download PDF

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Publication number
WO2019183968A1
WO2019183968A1 PCT/CN2018/081461 CN2018081461W WO2019183968A1 WO 2019183968 A1 WO2019183968 A1 WO 2019183968A1 CN 2018081461 W CN2018081461 W CN 2018081461W WO 2019183968 A1 WO2019183968 A1 WO 2019183968A1
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WO
WIPO (PCT)
Prior art keywords
board
sub
chassis
opening
air chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/081461
Other languages
English (en)
French (fr)
Inventor
孙浩
陈律
卢冬明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP18912791.3A priority Critical patent/EP3716009B1/en
Priority to EP22176833.6A priority patent/EP4120050A1/en
Priority to PCT/CN2018/081461 priority patent/WO2019183968A1/zh
Priority to CN201880004642.5A priority patent/CN110036355B/zh
Publication of WO2019183968A1 publication Critical patent/WO2019183968A1/zh
Priority to US16/986,380 priority patent/US11269386B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/188—Mounting of power supply units
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

Definitions

  • the present application relates to the field of servers, and in particular, to a chassis and a server of a server.
  • a server also called a server, is a device that provides computing services. Due to the need to provide highly reliable services, it is highly demanded in terms of processing power, stability, reliability, security, scalability, and manageability.
  • the modules for example, processors
  • the chassis of the server needs to meet the heat dissipation requirements of each module.
  • the module configuration inside the server is more and more.
  • the power supply air chamber is placed in the system air chamber, so that the power supply air chamber shares the heat dissipation space with the system air chamber of other components.
  • this design allows the power supply air cavity to be coupled to the system air cavity.
  • the airflow needs to dissipate heat from a high-power module (for example, a processor), and then dissipate heat to other modules (for example, a power supply), which may affect the power dissipation capability and power supply evolution.
  • the present application provides a server chassis and a server, and the heat dissipation structure of the chassis of the server can improve the heat dissipation performance of the server.
  • a chassis of a server including a backplane, the backplane is disposed in the server chassis, the backplane includes: a first subboard, a second subboard, and at least one windshield; the first The daughter board and the second daughter board are separated from each other, the first daughter board and the second daughter board are parallel to each other, and the first daughter board and the second daughter board are both perpendicular to a sidewall of the server chassis; the at least one a wind deflector is located between the first sub-board and the second sub-board, and each of the at least one wind deflector forms an angle with the first sub-board and the second sub-board; the at least one The wind deflector divides the space enclosed by the first sub-board, the second sub-board, the side wall, the upper wall and the lower wall of the chassis into a first wind chamber and at least one second air chamber, and encloses the first The air chamber is provided with an opening for air circulation, the first air chamber is for dissipating heat for
  • the present application Compared with the traditional server chassis heat dissipation structure, in the present application, by setting the back plate into two isolated sub-board structures, a cavity is formed between the two sub-boards, and at least one block is disposed between the two sub-boards.
  • the wind panel divides the cavity into a first air chamber for respectively dissipating heat for the first module, and a second air chamber specifically for dissipating heat for the second module. That is to say, in the present application, the first module and the second module respectively have independent heat dissipation air chambers. Therefore, the present application realizes independent heat dissipation of the first module and the second module, and improves heat dissipation of the first module and the second module. Efficiency, which in turn improves the thermal performance of the entire server.
  • the first air chamber is composed of a first portion of the first sub-board, a first portion of the second sub-board, a first portion of an upper wall of the chassis, a first portion of the lower wall, and the block a wind plate enclosing;
  • the area surrounding the first air chamber is provided with an opening for air circulation, comprising: a first opening is provided in the first portion of the first sub-board, and the first opening is in the second sub-board a portion is provided with a second opening, in which the airflow enters the first air chamber from the first opening in the first sub-board, and passes through the second opening on the second sub-board The hole flows out of the first air chamber.
  • the present application provides a first opening on the first sub-board, and a second opening on the second sub-board, so that the airflow carrying the heat of the first module can enter the first air cavity through the first opening, and pass The second opening flows out of the first air chamber, and finally the airflow flows out of the chassis through the air outlet of the chassis of the server. Therefore, the first air chamber in the present application can dissipate heat from the first module.
  • the second air chamber is configured by the second portion of the second sub-board, the side wall of the chassis of the server The second portion, the second portion of the upper wall, and the second portion of the lower wall are enclosed with the first windshield, wherein the first wind deflector is any one of the at least one wind deflector.
  • the second air chamber is formed by the second portion of the first daughterboard and the second daughterboard
  • the second portion, the second portion of the side wall of the server chassis, the second portion of the upper wall, and the second portion of the lower wall are enclosed with the first windshield.
  • the area surrounding the second air chamber is provided with an opening for air circulation, including:
  • a second opening is disposed in the second portion of the second sub-board, and a fourth opening is disposed in the second portion of the side wall of the chassis.
  • the airflow is from the side of the chassis The four openings enter the second air chamber and flow out of the second air chamber through the third opening on the second sub-board.
  • the present application provides a fourth opening on the side wall of the chassis, and a third opening is disposed on the second sub-board, so that the airflow can enter the second air cavity through the fourth opening, and flow out of the second cavity through the third opening. Finally, the airflow carries the heat of the second module through the at least one second module and flows out of the chassis. Therefore, the second air chamber in the present application can achieve heat dissipation to the second module.
  • the area surrounding the second air chamber is provided with an opening for air circulation, including:
  • a second opening is disposed in the second portion of the second sub-board
  • a fourth opening is disposed in the second portion of the side wall of the chassis
  • a fifth opening is disposed in the second portion of the upper wall of the chassis.
  • the airflow enters the second air chamber from the fourth opening and/or the fifth opening, and flows out of the second air chamber through the third opening on the second sub-board.
  • the present application provides a fourth opening on the side wall of the chassis, a fifth opening in the second portion of the upper wall of the chassis, and a third opening in the second sub-board, so that the airflow can pass through the fourth opening. And/or the fifth opening enters the second air chamber, and flows out of the second chamber through the third opening, and finally the airflow passes the heat of the second module through the at least one second module and flows out of the chassis. Therefore, the second air chamber in the present application can achieve heat dissipation to the second module.
  • the isolation distance between the first sub-board and the second sub-board belongs to a preset set, and the isolation distance between the first sub-board and the second sub-board is
  • the chassis size of the server is related to / or the internal module layout of the chassis.
  • the minimum distance between the first sub-board and the second sub-board is 20 mm or 25 mm
  • the maximum distance between the first sub-board and the second sub-board is 50 mm or 60 mm, and the application is not limited thereto.
  • the distance between the two sub-boards determines the size of the above two air chambers, wherein the size of the air chamber can affect the resistance and wind speed of the air chamber, and thus can affect the heat dissipation performance.
  • the distance between the two sub-boards is determined according to factors such as the actual chassis depth, the chassis architecture, and the size of the chassis. The application is not limited thereto.
  • first sub-board and the second sub-board are connected by a bus bar assembly, and the bus bar is used to supply power to the second sub-board.
  • a fixed support frame is disposed between the first sub-board and the second sub-board, and the fixed support frame is configured to fix the first sub-board and the second sub-board to An isolation distance is formed between the first sub-board and the second sub-board.
  • an opening ratio of the first sub-board is greater than a first opening ratio threshold
  • an opening ratio of the second sub-board is greater than a second opening ratio threshold
  • the first sub- The aperture ratio on the board is used to indicate the ratio of the sum of the areas of all the apertures on the first daughter board to the area of the first daughter board
  • the aperture ratio on the second daughter board is used to indicate the second The ratio of the sum of the areas of all the openings on the daughter board to the area of the second daughter board.
  • the opening ratio of the first sub-board may also indicate the number of openings per unit area of the first sub-board.
  • the opening ratio of the second sub-board may also indicate the number of openings per unit area of the second sub-board.
  • the first opening rate threshold or the second opening rate threshold may be the maximum opening ratio of the existing single-layer back sheet or the closely-bonded double-layer back sheet.
  • the first aperture rate threshold and the second aperture rate threshold are 20% according to business requirements.
  • the opening is limited, so that the opening ratio is small, for example, only 10%.
  • the design of the two-layer structure allows the signal and the power supply to be routed on different sub-boards respectively, and the number of traces on the single sub-board is small. Therefore, the opening limitation in the present application is small, and the opening is small. The rate is increased. Because the opening ratio of the daughterboard in the present application is large, the resistance of the air chamber to the airflow can be reduced, so that the air flows more smoothly in the chassis, and the heat dissipation performance of the server is improved.
  • the specific values of the first aperture ratio threshold and the second aperture ratio threshold may be determined according to actual conditions, and the application is not limited thereto.
  • each of the at least one first module includes any one of a central processing unit (CPU) module and a graphics processing unit (GPU) module.
  • Each of the at least one second module is configured with a separate fan.
  • the second module may further include other modules.
  • the second module may further include a switch module, and the application is not limited thereto.
  • the second module may include a power module, an input/output (IO) module, a source measure unit (SMU) module, a serial digital interface (SDI) module, and an on-site
  • IO input/output
  • SMU source measure unit
  • SDI serial digital interface
  • FPGA field programmable gate array
  • CPU module and the GPU module may be collectively referred to as a computing module in this application.
  • the application can decouple the power module from the computing module to achieve independent heat dissipation between the power module and the computing module.
  • the application can avoid the thermal cascading between the power module and the computing module and improve the heat dissipation performance of the server.
  • the chassis is divided by the backplane into a first space in contact with the first sub-board and a second space in contact with the second sub-board, where the first module is located in the chassis In the first space, the second module is located in the second space in the chassis.
  • the second module and the first module are generally deployed in an area of the chassis, so that the power module occupies the heat dissipation space of the computing module, and there is a thermal cascade phenomenon.
  • the heat dissipation of the power module itself is affected, and the position of the first module and the second module are separated from each other, and the heat dissipation space of the first module and the second module are not coupled, thereby enabling independent cooling of the two modules.
  • the first sub-board is a power backplane
  • the second sub-board is a signal backplane
  • the power backplane of the present application can be used to connect the power module, and the conversion voltage is used to supply power to each module; the signal backplane can be used for communication between modules in the system.
  • the present application sets a backplane of the server as a two-layer structure combining a power backplane and a signal backplane, and sets a distance between the signal backplane and the power backplane, and the cavity is through the windshield.
  • the first air chamber for dissipating heat for the first module and the second air chamber for dissipating heat for the second module are divided. Since the first module and the second module in the present application respectively have independent heat dissipation air chambers.
  • the present application realizes independent heat dissipation between the first module connected to the power backplane and the second module connected to the signal backplane, and the application can reduce the load of the heat dissipation structure of the system and improve the heat dissipation performance of the entire server.
  • the server is a rack server or a blade server.
  • a server in a second aspect, includes a chassis, at least one first module, and at least one second module, the chassis includes a backboard, the backplane is disposed in the chassis, and the backplane includes a first daughterboard a second sub-board and at least one wind deflector; the first sub-board and the second sub-board are separated from each other, the first sub-board and the second sub-board are parallel to each other, the first sub-board and the second Each of the sub-boards is perpendicular to a sidewall of the server chassis; the at least one wind deflector is located between the first sub-board and the second sub-board, and each of the at least one wind deflector and the first The sub-board and the second sub-board form an angle; the at least one wind deflector divides the space enclosed by the first sub-board, the second sub-board, the side wall, the upper wall and the lower wall of the chassis into the first a wind chamber and at least one second air chamber, the area surrounding the first air chamber is
  • the present application Compared with the traditional server chassis heat dissipation structure, in the present application, by setting the back plate into two isolated sub-board structures, a cavity is formed between the two sub-boards, and at least one block is disposed between the two sub-boards.
  • the wind panel divides the cavity into a first air chamber for respectively dissipating heat for the first module, and a second air chamber specifically for dissipating heat for the second module. That is to say, in the present application, the first module and the second module respectively have independent heat dissipation air chambers. Therefore, the present application realizes independent heat dissipation of the first module and the second module, and improves heat dissipation of the first module and the second module. Efficiency, which in turn improves the thermal performance of the entire server.
  • the present application may further combine to provide more implementations.
  • FIG. 1 is a schematic diagram of a conventional server structure.
  • FIG. 2 is a schematic structural diagram of a server provided by the present application.
  • FIG. 3 is a schematic diagram of a backplane structure provided by the present application.
  • FIG. 4 is an exploded view of a backing plate structure provided by the present application.
  • FIG. 5 is a top plan view of a backplane structure provided by the present application.
  • FIG. 6 is a schematic structural diagram of another server provided by the present application.
  • FIG. 7 is a schematic structural diagram of another server provided by the present application.
  • FIG. 8 is a schematic structural diagram of a blade server provided by the present application.
  • FIG. 1 is a schematic structural diagram of a conventional server.
  • a backplane is disposed in the chassis of the server 100 as shown in FIG. 1, and a plurality of modules connected to the backplane.
  • the backplane and the module can be connected by a connector, for example, the connector can be a high-density connector.
  • Interconnected interfaces can be provided on the backplane and on multiple modules.
  • the plurality of modules may be directly connected to the backplane or may be connected by cables.
  • the back plate in FIG. 1 may be a single layer back plate or a double layer closely attached back plate.
  • the plurality of modules described above may include at least one first module and at least one second module.
  • the first module may also be referred to as a computing module or a computing node.
  • the first module may include any one of a central processing unit (CPU) module and a graphics processing unit (GPU) module.
  • the second module is a module with independent fans, including a power module, an input/output (IO) module, a source measure unit (SMU) module, and a serial digital interface (SDI) module.
  • IO input/output
  • SMU source measure unit
  • SDI serial digital interface
  • the specific form of the second module of the embodiment of the present application is not limited to the above enumerated contents, and any one of the field programmable gate array (FPGA) heterogeneous computing modules.
  • FPGA field programmable gate array
  • the first module may be disposed on one side of the backboard, and the second module may be disposed on the other side of the backplane.
  • a first module for example, a CPU or a GPU
  • a second module for example, a power module
  • the plurality of modules share a heat dissipation air chamber. Since the air chamber of the first module in the chassis based on the above setting is usually coupled with the air chamber of the second module, the direction of the heat dissipation airflow in the server as shown in FIG. 1 is as follows: the heat dissipation airflow can be from one end of the server chassis (Also known as the front end of the server) enters the chassis and passes through each of the above modules. For example, passing through the first module and then through the second module, the other end of the chassis (which may also be referred to as the back end of the server) flows out of the chassis.
  • the server chassis Also known as the front end of the server
  • wind chamber in the embodiment of the present application may mean a carrier through which airflow is circulated.
  • FIG. 1 It can be seen from FIG. 1 that there is a thermal cascade phenomenon in the heat dissipation of a plurality of modules in the heat dissipation structure of the server chassis. Specifically, after the heat dissipation airflow enters the server chassis from the air inlet of the server, the heat of the module is taken away after each module passes, and the temperature of the airflow increases as the number of modules flowing through increases.
  • the power density is gradually increased, and the power consumption of high-power modules (such as CPUs, GPUs, etc.) is getting higher and higher, then, for modules close to the server back end (air outlet), for example,
  • the second module for example, a power module
  • the heat of the first module is taken away, so that the temperature of the airflow in the server chassis rises.
  • the cooling effect is worse, which is not conducive to heat dissipation of the latter module, and reduces the heat dissipation performance of the entire server.
  • the power supply and other modules have independent fans, there is only one air inlet of the server.
  • the fan can only control the flow direction of the airflow, and the order of the airflow flowing through the modules cannot be controlled in the same air chamber.
  • an embodiment of the present application provides a chassis of a server in which a wind chamber of a first module and a second module is decoupled, and the first module and the second module can use a separate air cavity to dissipate heat. Furthermore, the technical solution provided by the embodiment of the present application can avoid the thermal cascading phenomenon between the first module and the second module, improve the heat dissipation efficiency of the first module and the second module, and improve the heat dissipation performance of the entire server.
  • FIG. 2 is a schematic structural diagram of a chassis of a server provided by the present application.
  • the chassis 220 of the server 200 includes a backboard 210, which in turn includes a first daughterboard 211, a second daughterboard 212, and a windshield 213.
  • the first sub-board 211 and the second sub-board 212 are separated from each other, and the first sub-board 211 and the second sub-board 212 are parallel to each other, and the first sub-board 211 and the second sub-board 212 are perpendicular to the side wall of the server chassis.
  • the wind deflector 213 is located between the first sub-board 211 and the second sub-board 212, and the wind deflector 213 forms an angle with the first sub-board 211 and the second sub-board 212, respectively.
  • the at least one wind deflector 213 divides the space enclosed by the first sub-board 211, the second sub-board 212, the side walls, the upper wall and the lower wall of the chassis 220 into the first space.
  • the air chamber and the at least one second air chamber (only one example of a second air chamber is shown in Figure 2).
  • An area surrounding the first air chamber is provided with an opening for air circulation, the first air chamber is for dissipating heat of the at least one first module, and each of the first modules passes through the first sub-board of the air inlet region of the first air chamber
  • the interface is connected to the first daughter board.
  • An area surrounding each of the second air chambers of the second air chamber is provided with an opening for air circulation, the second air chamber is for heat dissipation of the at least one second module, and each of the second modules passes through the air outlet of the second air chamber
  • the interface of the second sub-board of the area is connected to the second sub-board.
  • the wind deflector 213 forms two angles with the first sub-board 211 and the second sub-board 212, and the windshield 213 forms a first angle with the first sub-board 211, and the wind deflector 213 and A second angle is formed between the second sub-boards 212.
  • the wind deflector 213 intersects with the first sub-board 211 and the second sub-board 212, respectively, to form an angle.
  • the windshield 213 intersecting the first sub-board and the second sub-board may comprise a variety of forms. When the windshield forms an angle with the first sub-board and the second sub-board, respectively, but the windshield and the side wall intersect, the side wall, the upper wall, the lower wall, the first sub-board, and the second sub-board of the chassis may be The various combinations form different second wind chambers.
  • the wind deflector 213 intersects the first sub-board 211, the chassis side wall, and the second sub-board 212, respectively, in a straight line.
  • the windshield forms an angle with the first sub-board and the second sub-board, respectively, but the windshield does not intersect the sidewall, the side wall, the upper wall, the lower wall, the first sub-board, and the second sub-board may Different second air chambers are formed in various combinations, and the corresponding opening methods are also different.
  • first sub-board 211 and the second sub-board 212 are connected by a busbar assembly 214, and the busbar assembly 214 is used to supply power to the second sub-board 212.
  • the bus bar assembly 214 can also be used for signal transfer between the first sub-board 211 and the second sub-board 212.
  • a fixed support frame 215 is disposed between the first sub-board 211 and the second sub-board 212.
  • the fixed support frame 215 is configured to support the first sub-board 211 and the second sub-board 212 so that the first sub-board 211 An isolation distance is formed between the second sub-board 212.
  • the isolation distance between the first sub-board 211 and the second sub-board 212 belongs to a preset set, and the isolation distance between the first sub-board and the second sub-board is equal to the size of the server chassis and/or Or related to the internal module layout of the chassis.
  • the minimum value of the preset set may be 20 mm or 25 mm, etc.
  • the maximum value of the preset set may be 50 mm or 60 mm, and the embodiment of the present application is not limited thereto.
  • the distance between the two sub-plates affects the size of the above two air chambers, wherein the size of the air chamber can affect the resistance and wind speed of the air chamber, and thus can affect the heat dissipation performance.
  • the distance between the two sub-boards may be determined according to actual chassis size parameters (for example, the depth of the chassis, that is, the distance from the front end to the rear end of the chassis) and/or the layout of the internal modules of the chassis. Not limited to this.
  • FIG. 2 shows an example in which the backboard in the chassis includes a windshield 213, but the implementation of the present application is not limited thereto.
  • the backboard may include two windshields (as shown in FIG. 6).
  • the backboard may also include three windshields (as shown in FIG. 7) or the backplane includes more windshields.
  • FIG. 3 is a schematic diagram of a backplane structure provided by the present application
  • FIG. 4 is an exploded view of a backplane structure provided by the present application
  • FIG. 5 is a top plan view of a backplane structure provided by the present application.
  • the backplane 300 shown in FIG. 3 to FIG. 5 includes a first sub-board 311 and a second sub-board 312 and two windshields 313, wherein the first sub-board 311 in FIGS. 3 to 5 can be combined with FIG.
  • the second sub-board 312 in FIGS. 3 to 5 may correspond to the second sub-board 212 in FIGS. 2, 6, and 7.
  • the wind deflector 313 in FIGS. 3 to 5 may correspond to the wind deflector 213 in FIGS. 2, 6, and 7.
  • the wind deflector 313 can be referred to as a beveled member.
  • the first sub-board 311 and the second sub-board 312 are separated from each other, that is, a certain distance is set between the first sub-board and the second sub-board.
  • the isolation distance may be
  • the embodiment of the present application is not limited to this, 25 mm, 30 mm, 35 mm, and the like.
  • first sub-board 311 and the second sub-board 312 are connected by a busbar assembly 314.
  • Busbar assembly 314 is used to power first daughter board 311.
  • Busbar assembly 214 can also be used for signal transfer between first daughter board 311 and second daughter board 312.
  • a fixed support frame 315 is disposed between the first sub-board 311 and the second sub-board 312, and the fixed support frame 315 is configured to fix the first sub-board 311 and the second sub-board 312.
  • the fixed support frame 315 has an inverted "F" shape, and the fixed support frame can also have other shapes.
  • the embodiment of the present application is not limited thereto.
  • Two windshields 313 are located between the first sub-board 311 and the second sub-board 312, and are respectively disposed near the side wall of the server chassis.
  • the first wind chamber is surrounded by a first portion of the first sub-board 211, a first portion of the second sub-board 212, a first portion of the upper wall of the chassis, a first portion of the lower wall, and a wind deflector 213.
  • the area surrounding the first air chamber also needs to include the first portion of the side wall of the chassis.
  • the area enclosing the first air chamber may not include the side wall of the chassis.
  • a first opening is disposed on the first portion of the first sub-board 211, and a second opening is disposed on the first portion of the second sub-board 212.
  • the airflow enters the first air chamber from the first opening and flows out of the first air chamber through the second opening.
  • the first portion of the first sub-board may be the entirety of the first sub-board when the windshield intersects the chassis sidewall of the server.
  • the first portion of the first sub-board may include an area enclosing the first wind chamber on the first sub-board when the wind deflector does not intersect the chassis side wall of the server.
  • the area enclosed by the second air chamber may include any of the following methods:
  • the second air chamber is composed of the second portion of the second sub-board 212, the second portion of the chassis side wall of the server, the second portion of the upper wall, and the lower portion
  • the second portion of the wall is enclosed with a wind deflector 213.
  • the cross section of the second air chamber is a "triangle" structure
  • FIG. 2 is a schematic view showing the structure of the second air chamber in the first mode.
  • the second portion of the second sub-board refers to the area of the second sub-board that encloses the second air chamber.
  • the second portion of the side wall of the server is the area enclosing the second air chamber on the side wall
  • the second portion of the upper wall is the area enclosing the second air chamber on the upper wall
  • the second portion of the lower wall is The area of the lower wall that encloses the second wind chamber.
  • the second air chamber is composed of the second portion of the first sub-board 211, the second portion of the second sub-board 212, and the second side of the server chassis side wall.
  • the portion, the second portion of the upper wall, and the second portion of the lower wall are enclosed by the wind deflector 213.
  • the cross section of the second air chamber is a "right angle trapezoid" structure.
  • the side walls of the cabinet enclosing the first air chamber and the side walls of the cabinet enclosing the second air chamber are two side walls on different sides.
  • the opening method of the area surrounding the second air chamber can be implemented in any of the following ways:
  • Manner 1 a third opening is provided in the second portion of the second sub-board (ie, the region enclosing the second air chamber on the second sub-board), and the fourth opening is disposed in the second portion of the side wall of the chassis hole. Then, in the second air chamber, the airflow enters the second air chamber from the fourth opening, and flows out of the second air chamber through the third opening.
  • Manner 2 a third opening is disposed on the second portion of the second sub-board, a fourth opening is disposed on the second portion of the side wall of the chassis, and a fifth opening is disposed in the second portion of the upper wall of the chassis . Then, in the second air chamber, the airflow enters the second air chamber from the fourth opening and/or the fifth opening, and flows out of the second air chamber through the third opening.
  • the opening ratio of the first sub-board 211 is greater than the first opening ratio threshold, and the opening ratio of the second sub-board 212 is greater than the second opening ratio threshold.
  • the opening ratio of the first sub-board is used to indicate the ratio of the sum of the areas of all the openings on the first sub-board to the area of the first sub-board, and the opening ratio on the second sub-board is used to indicate The ratio of the sum of the areas of all the openings on the second sub-board to the area of the second sub-board.
  • the opening ratio of the first sub-board may also indicate the number of openings per unit area of the first sub-board.
  • the opening ratio of the second sub-board may also indicate the number of openings per unit area of the second sub-board.
  • the first opening rate threshold or the second opening rate threshold may be the maximum opening ratio of the existing single-layer back sheet or the closely-bonded double-layer back sheet.
  • the first aperture rate threshold and the second aperture rate threshold are 20% according to business requirements.
  • the opening is limited, so that the opening ratio is small, for example, only 10%.
  • the design of the two-layer structure is such that the signal and the power supply are respectively routed on different sub-boards, and the number of traces on the single sub-board is less. Therefore, the aperture limitation in the embodiment of the present application is relatively smaller. Small, the opening ratio is increased. Since the opening ratio of the daughterboard in the embodiment of the present application is large, the resistance of the air chamber to the airflow can be reduced, so that the air flows more smoothly in the chassis, and the heat dissipation performance of the server is improved.
  • first aperture ratio threshold and the second aperture ratio threshold may be determined according to actual conditions, and the embodiment of the present application is not limited thereto.
  • a space formed by the first sub-board 211, the second sub-board 212, and the upper wall and the lower wall of the chassis 220 divides the interior of the chassis into two parts, a first space and a second space.
  • the first module and the second module are connected to the chassis in the first embodiment.
  • the first module is connected to the first sub-board through the interface of the first sub-board in the first space, specifically through the first air chamber.
  • the interface of the first sub-board of the tuyere area is connected to the first sub-board.
  • the second module is connected to the second sub-board through the interface of the second sub-board, and the second sub-board is accessed through the interface of the second sub-board in the air outlet area of the second air chamber.
  • the air inlet area of the first air chamber refers to the area where the air flow of the first air chamber enters.
  • the air outlet area of the second air chamber refers to the area where the air flow of the second air chamber flows out.
  • the air inlet of the first air chamber is a first opening on the first sub-board, and the air inlet area of the first air chamber may represent a first opening in the first space.
  • the air inlet region of the first air chamber may also be represented as a square or rectangular region having a length of one side centered on the first opening.
  • the air outlet of the second air chamber is a third opening on the second sub-board, and the air outlet area of the second air chamber may represent a circle with a predetermined length as a center in the second space. Shaped area.
  • the air outlet area of the second air chamber may also be represented as a square or rectangular area having a length of a side centered on the third opening.
  • the air inlet region of the first air chamber may be a circle or other shape centered on a region surrounded by the plurality of first openings determined according to a preset algorithm ( The area, such as a square or rectangle, ensures that the airflow from the first air chamber can flow through the first module through the area.
  • the air outlet area of the second air chamber may be circular or centered on a region surrounded by the plurality of third openings determined by a preset algorithm. Other shapes, such as square or rectangular, ensure that the airflow from the second air chamber can flow through the second module through the region.
  • the first air chamber is configured to dissipate heat from the at least one first module when the at least one first module is connected to the chassis through the first daughter board. Specifically, the airflow enters the chassis from the side of the chassis adjacent to the first sub-board, passes through at least one first module, and then enters the first air cavity through the first opening of the first sub-board, and then passes through the second sub-board. The second opening flows out of the first air chamber, thereby bringing the heat of the at least one first module out of the interior of the chassis.
  • a system cooling fan (not shown) is disposed near the tail of the chassis (on the right side of the second sub-board), and the system cooling fan mainly controls the flow of air flowing through the at least one first module, so that the airflow can be as described above. The flow flows through the first module to carry heat out of the chassis.
  • each second module is configured with a separate fan
  • the fan can be used to control the flow of air flowing through the second module.
  • the opening method of the second air chamber adopts a mode
  • the airflow enters the second air chamber from the fourth opening on the side wall of the chassis, and then flows out of the second air chamber through the third opening of the second sub-board.
  • the heat of the at least one second module is carried out of the chassis.
  • the opening method of the second air chamber adopts the second mode
  • the airflow flows into the second air chamber from the fifth opening of the upper wall of the chassis and/or the fourth opening of the side wall, and then passes through the second sub-board.
  • the three openings flow out of the second air chamber, exit the chassis through the at least one second module, and thereby carry the heat of the at least one second module out of the chassis.
  • the back plate is configured as two isolated sub-boards, so that a cavity is formed between the two sub-boards, and at least between the two sub-boards is disposed.
  • a wind deflector divides the cavity into a first air chamber for dissipating heat for the first module, and a second air chamber specifically for dissipating heat for the second module. That is, in the embodiment of the present application, the first module and the second module respectively have independent heat dissipation air chambers. Therefore, the present application implements independent heat dissipation of the first module and the second module, and improves the first module and the second module. The heat dissipation efficiency improves the heat dissipation performance of the entire server.
  • the server chassis provided by the embodiment of the present application is further introduced in conjunction with FIG. 6 .
  • the difference between FIG. 6 and FIG. 2 is that the space enclosed by the first sub-board, the second sub-board, the upper wall and the lower wall of the chassis is divided into a first air chamber and two second portions by using two windshields in FIG. 6 . Wind chamber.
  • the chassis 220 of the server 200 includes a backboard 210 , which in turn includes a first daughter board 211 , a second daughter board 212 , and two wind shields 213 .
  • the first sub-board 211 and the second sub-board 212 are separated from each other, and the first sub-board 211 and the second sub-board 212 are parallel to each other, and the first sub-board 211 and the second sub-board 212 are perpendicular to the side wall of the server chassis. .
  • FIG. 1 the chassis 220 of the server 200 includes a backboard 210 , which in turn includes a first daughter board 211 , a second daughter board 212 , and two wind shields 213 .
  • the first sub-board 211 and the second sub-board 212 are separated from each other, and the first sub-board 211 and the second sub-board 212 are parallel to each other, and the first sub-board 211 and the second sub-board 212 are perpendicular to the side wall of the server chassis.
  • the two wind deflectors 213 are located between the first sub-board 211 and the second sub-board 212 , and the two wind shields 213 are respectively formed with the first sub-board 211 and the second sub-board 212 . angle.
  • the two wind deflectors 213 may be symmetrically placed with respect to the central axis of the server chassis, or may be placed in an asymmetric structure.
  • the two windshields 213 divide the space enclosed by the first sub-board 211, the second sub-board 212, the side walls, the upper wall and the lower wall of the chassis 220 into a first wind chamber and two second air chambers.
  • An area surrounding the first air chamber is provided with an opening for air circulation, the first air chamber is for dissipating heat of the at least one first module, and each of the first modules passes through the first sub-board of the air inlet region of the first air chamber
  • the interface is connected to the first daughter board.
  • An area surrounding each of the second air chambers of the second air chamber is provided with an opening for air circulation, the second air chamber is for heat dissipation of the at least one second module, and each of the second modules passes through the air outlet of the second air chamber
  • the interface of the second sub-board of the area is connected to the second sub-board.
  • the wind deflector 213 intersects with the first sub-board and the second sub-board respectively to form two angles, and the windshield 213 forms a first angle with the first sub-board 212, and the wind deflector 213 and the second sub-bar A second angle is formed between the plates 212.
  • the chassis of FIG. 6 includes two second air chambers. Therefore, two sets of second modules can be disposed in the chassis of the server, and each set of second modules can include at least one second module, wherein each second air chamber can correspond to A set of second modules, each of the second air chambers for dissipating heat from a corresponding set of second modules.
  • the chassis in FIG. 2 includes a second air chamber. Therefore, only one second module can be disposed in the chassis of the server, and the second air chamber can be used for heat dissipation of the second module.
  • the difference between FIG. 6 and FIG. 2 further includes that the component enclosing the first air chamber in FIG. 6 may not include the side wall of the chassis, and the components enclosing the first air chamber in FIG. 2 need to include the chassis.
  • Side wall Specifically, the first air chamber in FIG. 6 is composed of the two wind deflectors 213, the first portion of the first sub-board 211, the first portion of the second sub-board 212, the first portion of the upper wall of the chassis, and the lower wall of the chassis. The first part is enclosed.
  • the first air chamber in FIG. 2 is enclosed by the wind deflector 213, the first portion of the first sub-board 212, the first portion of the second sub-board 212, and the first portion of the side wall of the chassis.
  • the two second air chambers in FIG. 6 are similar to the structure of the second air chamber in FIG. 2, and the two second air chambers may be disposed in a symmetrical structure with respect to the central axis of the server cabinet.
  • the structure of the airflow will be described with reference to FIG. 3 in the structure of a second air chamber. Since the structure of the two second air chambers is symmetrical, the structure of the second air chamber and the air flow direction can be referred to the second air chamber. Description, to avoid repetition, will not be repeated here.
  • the first sub-board 211, the second sub-board 212, and the upper wall and the lower wall of the chassis 220 form a space that divides the interior of the chassis into two parts, a first space and a second space.
  • the first module and the second module are connected to the chassis in the first embodiment.
  • the first module is connected to the first sub-board through the interface of the first sub-board in the first space, specifically through the first air chamber.
  • the interface of the first sub-board of the tuyere area is connected to the first sub-board.
  • the second module is connected to the second sub-board through the interface of the second sub-board, and the second sub-board is accessed through the interface of the second sub-board in the air outlet area of the second air chamber.
  • the second module in FIG. 3 can be divided into two groups, and the two groups of second modules are respectively disposed in the two second air chamber air outlet regions.
  • the air inlet area of the first air chamber refers to the area where the air flow of the first air chamber enters.
  • the air outlet area of the second air chamber refers to the area where the air flow of the second air chamber flows out.
  • the first air chamber is configured to dissipate heat from the at least one first module when the at least one first module is connected to the chassis through the first daughter board. Specifically, the airflow enters the chassis from the side of the chassis adjacent to the first sub-board, passes through at least one first module, and then enters the first air cavity through the first opening of the first sub-board, and then passes through the second sub-board. The second opening flows out of the first air chamber, thereby bringing the heat of the at least one first module out of the interior of the chassis.
  • a system cooling fan (not shown) is disposed near the tail of the chassis (on the right side of the second sub-board), and the system cooling fan mainly controls the flow of air flowing through the at least one first module, so that the airflow can be as described above. The flow flows through the first module to carry heat out of the chassis.
  • the fan can be used to control the flow of air flowing through the second module.
  • the opening method of the second air chamber adopts a mode
  • the airflow enters the second air chamber from the fourth opening on the side wall of the chassis, and then flows out of the second air chamber through the third opening of the second sub-board.
  • the heat of the at least one second module is carried out of the chassis.
  • the opening method of the second air chamber adopts the second mode
  • the airflow flows into the second air chamber from the fifth opening of the upper wall of the chassis and/or the fourth opening of the side wall, and then passes through the second sub-board.
  • the three openings flow out of the second air chamber, exit the chassis through the at least one second module, and thereby carry the heat of the at least one second module out of the chassis.
  • the back plate is configured as two isolated sub-boards, so that a cavity is formed between the two sub-boards, and at least one is set between the two sub-boards.
  • a wind deflector that divides the cavity into a first air chamber for dissipating heat for the first module, and a second air chamber for dissipating heat for the second module, that is, the first in the embodiment of the present application
  • the module and the second module respectively have independent heat dissipation air chambers. Therefore, the present application realizes independent heat dissipation of the first module and the second module, thereby improving the heat dissipation efficiency of the first module and the second module, thereby improving the heat dissipation of the entire server. performance.
  • FIG. 2 An example of having a windshield in the chassis is described above in connection with FIG. 2, and an example of having two windshields in the chassis is described in conjunction with FIG.
  • the implementation of the present application is not limited thereto. Similar to the example of FIG. 2 or FIG. 6, the chassis of the server of the embodiment of the present application can be expanded to have more windshields.
  • the server has three windshields or more windshields in the chassis. As shown in FIG. 7, when there are three windshields 213 in the chassis of the server, the three windshields 213 may be located between the first sub-board 211 and the second sub-board 212, and the three windshields Each of the wind deflectors in the panel forms an angle with the first sub-board and the second sub-board; the three windshields align the first sub-board 211, the second sub-board 212, and the side wall of the chassis
  • the space enclosed by the upper wall and the lower wall is divided into four air chambers, wherein the four air chambers may include a first air chamber and three second air chambers.
  • the four air chambers may include a first air chamber and three second air chambers.
  • the two second air chambers of the three second air chambers may be Similar to the structure of the two second air chambers in FIG. 6, the third second air chamber may be enclosed by two of the three wind deflectors, the upper wall and the lower wall of the chassis, the first The air inlets of the three second air chambers are openings in the upper wall of the chassis, and the air outlets are openings in the second sub-board.
  • the second module corresponding to the third second air chamber can pass The interface of the second sub-board of the air outlet area of the second air chamber is connected to the second sub-board.
  • the airflow direction in the second air chamber can be referred to the descriptions in FIG. 2 and FIG. 6 above. To avoid repetition, details are not described herein again.
  • the structure of the second air chamber is similar to that of the three windshields. To avoid repetition, this time No longer.
  • FIG. 2 to FIG. 7 are merely for facilitating the understanding of the embodiments of the present invention, and the embodiments of the present invention are not limited to the specific numerical values or specific scenarios illustrated. A person skilled in the art will be able to make various modifications and changes in the embodiments according to the examples of FIG. 2 and FIG. 7. The modifications or variations are also within the scope of the embodiments of the present invention.
  • the chassis structure of the server of the embodiment of the present application is described above with reference to FIGS. 2 through 7.
  • the heat dissipation structure provided by the embodiment of the present application is further described by taking the server as a blade server as an example.
  • the blade server includes a chassis, at least one first module, and at least one second module, the chassis includes a backboard, the backplane is disposed in the chassis, and the backplane includes a first a daughter board, a second daughter board, and at least one wind shield.
  • the power module corresponds to the second module of the server shown in FIG. 2, FIG. 6, and FIG. 7, and the power backplane corresponds to the second sub-board shown in FIG. 2, FIG. 6, and FIG. 7, and the calculation module and FIG. 2 6 corresponds to the first module of the server shown in FIG. 7, and the signal backplane corresponds to the first sub-board shown in FIG. 2, FIG. 6, and FIG.
  • the cooling airflow enters the power supply air cavity through the opening in the side wall of the chassis, and flows out of the power supply air cavity through the opening on the power supply backplane, and then the cooling The airflow flows through the power module and flows out of the power supply fan, taking away the heat of the power module.
  • the cooling airflow can enter the chassis through the inlet port of the front end of the chassis (for example, the air inlet provided on the panel), and the heat of the calculation module is carried away when flowing through the calculation module, and then the heat of the calculation module is carried.
  • the airflow enters the system air chamber through the air inlet of the system air chamber, and flows out of the system air chamber through the air outlet of the system air chamber, and finally, the heat of the calculation module is taken out of the chassis.
  • the power backplane can be used to connect the power module, and the conversion voltage supplies power to each module in the chassis; the signal backplane can be used for communication between modules in the chassis.
  • the fan of the power module can control the airflow into and out of the power supply air chamber to the power module. Cooling.
  • the power module can be connected to the power backplane, and the computing module is connected to the signal backplane, and the power module can be disposed at the air outlet of the power wind chamber; the computing module can be disposed at The position in front of the air inlet of the system air chamber in the chassis.
  • the power module corresponds to the second module of the server shown in FIG. 2, FIG. 6, and FIG. 7, and the power backplane corresponds to the second sub-board shown in FIG.
  • FIG. 2 FIG. 6, and FIG. 7, and the calculation module and FIG. 2 6 corresponds to the first module of the server shown in FIG. 7, and the signal backplane corresponds to the first sub-board shown in FIG. 2, FIG. 6, and FIG.
  • the cooling airflow enters the power supply air cavity through the opening in the side wall of the chassis, and flows out of the power supply air cavity through the opening on the power supply backplane, and then the cooling The airflow flows through the power module and flows out of the power supply fan, taking away the heat of the power module.
  • the cooling airflow can enter the chassis through the inlet port of the front end of the chassis (for example, the air inlet provided on the panel), and the heat of the calculation module is carried away when flowing through the calculation module, and then the heat of the calculation module is carried.
  • the airflow enters the system air chamber through the air inlet of the system air chamber, and flows out of the system air chamber through the air outlet of the system air chamber, and finally, the heat of the calculation module is taken out of the chassis.
  • the power supply air cavity is specifically used for heat dissipation of the power module
  • the system air cavity is specifically used for heat dissipation of the calculation module, thereby avoiding the problem that the power module and the calculation module are coupled together to use the same air cavity for heat dissipation. Therefore, the present application The embodiment can decouple the power module from the heat dissipation structure of the computing module, and achieve independent heat dissipation between the power module and the computing module, thereby avoiding thermal cascading between the power module and the computing module, and improving the heat dissipation performance of the server.
  • the embodiment of the present application may also be applied to a rack server, where the rack server includes at least one first module and at least one second module, and the chassis includes a backboard, the backboard Provided in the chassis, the backboard includes a first sub-board, a second sub-board, and at least one wind deflector.
  • the rack server includes at least one first module and at least one second module
  • the chassis includes a backboard, the backboard Provided in the chassis, the backboard includes a first sub-board, a second sub-board, and at least one wind deflector.
  • the specific heat dissipation structure and heat dissipation process are similar to those of FIG. 8. To avoid repetition, details are not described herein again.
  • first, second, third, and fourth are only for distinguishing pixel points, and should not be construed as limiting the scope of the present invention.
  • B corresponding to A means that B is associated with A, and B can be determined according to A.
  • determining B from A does not mean that B is only determined based on A, and that B can also be determined based on A and/or other information.
  • the disclosed systems, devices, and methods may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

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Abstract

本申请提供了一种服务器的机箱和服务器，该服务器的机箱包括背板，该背板设置在该服务器机箱中，该背板包括：第一子板、第二子板和至少一个挡风板；该第一子板和第二子板之间相隔离；每个挡风板与第一子板和第二子板形成夹角；该至少一个挡风板将该第一子板、该第二子板、该机箱的侧壁、上壁和下壁围成的空间分割成第一风腔和至少一个第二风腔，该第一风腔用于为至少一个第一模块散热，该第二风腔用于为至少一个第二模块散热。由此实现利用独立的风腔分别对第一模块和第二模块散热，提升服务器的散热性能。

Description

服务器的机箱和服务器 技术领域
本申请涉及服务器领域，特别涉及一种服务器的机箱和服务器。
背景技术
服务器也称伺服器，是提供计算服务的设备。由于需要提供高可靠的服务，因此在处理能力、稳定性、可靠性、安全性、可扩展性、可管理性等方面要求较高。
为了满足上述要求，服务器中的模块(例如，处理器)需要保持稳定的工作性能，为了达到模块的稳定工作性能，服务器的机箱需要满足各个模块散热的散热需求。
当前服务器内部的模块配置越来越多，服务器的机箱架构设计时，将电源风腔置于系统风腔内,使电源风腔与其他部件的系统风腔共用散热空间。然而这种设计，使得电源风腔和系统风腔耦合,气流需要先对高功率的模块(例如，处理器)散热，再对其他模块(例如，电源)散热，会影响电源散热能力及供电演进能力，降低了整个服务器的散热性能。
因此，如何提高服务器的机箱的散热性能，成为亟待解决的问题。
发明内容
本申请提供一种服务器的机箱和服务器，该服务器的机箱的散热结构能够提高服务器的散热性能。
第一方面，提供了一种服务器的机箱，包括背板，该背板设置在该服务器机箱中，该背板包括：第一子板、第二子板和至少一个挡风板；该第一子板和第二子板之间相隔离，该第一子板和该第二子板互相平行，该第一子板和该第二子板均与该服务器机箱的侧壁垂直；该至少一个挡风板位于该第一子板和该第二子板之间，且该至少一个挡风板中每个挡风板与该第一子板和该第二子板形成夹角；该至少一个挡风板将该第一子板、该第二子板、该机箱的侧壁、上壁和下壁围成的空间分割成第一风腔和至少一个第二风腔，围成该第一风腔的区域设置有用于空气流通的开孔，该第一风腔用于为至少一个第一模块散热，该至少一个第一模块中每个第一模块通过该第一风腔的入风口区域的该第一子板的接口连接该第一子板；围成每个该第二风腔的区域设置有用于空气流通的开孔，该第二风腔用于为至少一个第二模块散热，该至少一个第二模块中每个第二模块通过该第二风腔的出风口区域的该第二子板的接口连接该第二子板。
与传统的服务器机箱散热结构相比，本申请中通过将背板设置成两个相隔离的子板的结构，使得两个子板间形成空腔，并通过在该两个子板间设置至少一个挡风板，将该空腔分割为分别用于为第一模块散热的第一风腔，以及专门用于为第二模块散热的第二风腔。也就是说，本申请中第一模块和第二模块分别具有独立的散热风腔，因此，本申请实现了第一模块和第二模块的独立散热，提升了第一模块和第二模块的散热效率，进而提升了整个服务器的散热性能。
在一种可能的实现方式中，该第一风腔由该第一子板的第一部分、该第二子板的第一部分、该机箱的上壁的第一部分、下壁的第一部分与该挡风板围成；该围成该第一风腔的区域设置有用于空气流通的开孔，包括：在该第一子板的第一部分设置有第一开孔，在该第二子板的第一部分设置有第二开孔，在该第一风腔中，气流从该第一子板上的该第一开孔进入该第一风腔，并经过该第二子板上的该第二开孔流出该第一风腔。
本申请通过在第一子板上设置第一开孔，在第二子板上设置第二开孔，使得带走第一模块热量的气流能够通过第一开孔进入第一风腔，并通过第二开孔流出第一风腔，最终气流通过服务器的机箱出风口流出机箱，因此，本申请中的第一风腔能够实现对第一模块的散热。
在另一种可能的实现方式中，当该第一挡风板与该服务器的机箱侧壁相交时，该第二风腔由该第二子板的第二部分、该服务器的机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与该第一挡风板围成，其中，第一挡风板为至少一个挡风板中任意一个挡风板。
在另一种可能的实现方式中，当该第一挡风板与该服务器的机箱侧壁不相交时，该第二风腔由该第一子板的第二部分、该第二子板的第二部分、该服务器机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与该第一挡风板围成。
在另一种可能的实现方式中，该围成该第二风腔的区域设置有用于空气流通的开孔，包括：
在该第二子板的第二部分设置有第三开孔，在该机箱侧壁的第二部分设置有第四开孔，在该第二风腔中，气流从该机箱侧壁的该第四开孔进入该第二风腔，并经过该第二子板上的该第三开孔流出该第二风腔。
本申请通过在机箱侧壁上设置第四开孔，在第二子板上设置第三开孔，使得气流能够通过第四开孔进入第二风腔，并通过第三开孔流出第二腔，最后该气流经过至少一个第二模块将该第二模块的热量带走，并流出机箱。因此，本申请中的第二风腔能够实现对第二模块的散热。
在另一种可能的实现方式中，该围成该第二风腔的区域设置有用于空气流通的开孔，包括：
在该第二子板的第二部分设置有第三开孔，在该机箱侧壁的第二部分设置有第四开孔，在该机箱上壁的第二部分设置有第五开孔，在该第二风腔中，气流从该第四开孔和/或该第五开孔进入该第二风腔，并经过该第二子板上的该第三开孔流出该第二风腔。
本申请通过在机箱侧壁上设置第四开孔，在该机箱上壁的第二部分设置有第五开孔，在第二子板上设置第三开孔，使得气流能够通过第四开孔和/或第五开孔进入第二风腔，并通过第三开孔流出第二腔，最后该气流经过至少一个第二模块将该第二模块的热量带走，并流出机箱。因此，本申请中的第二风腔能够实现对第二模块的散热。
在一另种可能的实现方式中，第一子板和第二子板之间的隔离距离取值属于预设集合，该第一子板和该第二子板之间的隔离距离的大小与该服务器的机箱尺寸和/或该机箱内部模块布局相关。
例如，第一子板和第二子板的最小距离为20mm或25mm，第一子板和第二子板的最大距离为50mm或60mm，本申请并不限于此。
应理解，两个子板间的距离大小决定了上述两个风腔的大小，其中，风腔的大小能够 影响该风腔的阻力与风速，进而可以影响散热性能。在实际应用中，两个子板间的距离间隔会根据实际的机箱深度、机箱架构和机箱的尺寸大小等因素而定，本申请并不限于此。
在另一种可能的实现方式中，该第一子板与该第二子板之间通过母线组件相连，该母线用于为该第二子板供电。
在另一种可能的实现方式中，该第一子板和该第二子板上之间设置有固定支撑架，该固定支撑架用于固定该第一子板和该第二子板，以使该第一子板和第二子板之间形成隔离距离。
在另一种可能的实现方式中，该第一子板上的开孔率大于第一开孔率阈值，该第二子板上的开孔率大于第二开孔率阈值，该第一子板上的开孔率用于指示在该第一子板上所有开孔的面积之和与第一子板的面积的比例，该第二子板上的开孔率用于指示在该第二子板上所有开孔的面积之和与该第二子板的面积的比例。
在另一种可能的实现方式中，当每个开孔的面积相同的情况下，第一子板的开孔率也可以指示第一子板单位面积上开孔的数量。类似地，第二子板的开孔率也可以指示第二子板单位面积上开孔的数量。
应理解，第一开孔率阈值或第二开孔率阈值可以为现有单层背板或紧密贴合的双层背板的最大开孔率。例如，按照业务需求，第一开孔率阈值和第二开孔率阈值为20％。
传统的服务器中的单层背板的结构中，由于背板上需要信号和电源同时走线，因此，开孔受到限制，使得开孔率较小，例如仅为10％等。而本申请中，通过两层结构的设计，使得信号和电源分别在不同的子板上走线，单个子板上的走线较少，因此，本申请中的开孔限制较小，开孔率得以增加，由于本申请中的子板上的开孔率较大，能够降低风腔对气流的阻力，使得空气在机箱中的更加流畅流通，提升服务器的散热性能。
应理解，在实际应用中，该第一开孔率阈值、第二开孔率阈值的具体取值可以根据实际情况而定，本申请并不限于此。
在另一种可能的实现方式中，该至少一个第一模块中每个第一模块包括中央处理器(central processing unit，CPU)模块、图形处理器(graphics processing unit，GPU)模块中任意一种。该至少一个第二模块中每个第二模块配置有独立风扇。
应理解，第二模块还可以包括其他模块，例如，第二模块还可以包括交换模块，本申请并不限于此。
例如，第二模块可以包括电源模块、输入/输出(input/output，IO)模块、源测量单元(source measure unit，SMU)模块、串行数字接口(serial digital interface，SDI)模块和者现场可编程门阵列(field programmable gate array，FPGA)异构计算模块等，本申请并不限于此，只要该第二模块为独立散热且带有主动散热的风扇即可。
应理解，本申请中可以将CPU模块和GPU模块统称为计算模块。
本申请能够将电源模块与计算模块解耦，实现电源模块与计算模块的独立散热，进而本申请能够避免电源模块与计算模块之间的热级联现象，提升服务器的散热性能。
在另一种可能的实现方式中，该机箱被该背板分割为与该第一子板接触的第一空间以及与该第二子板接触的第二空间，该第一模块位于该机箱中的该第一空间中，该第二模块位于该机箱中的该第二空间中。
具体而言，传统的服务器中，通常将第二模块和第一模块(例如，电源模块与计算模 块)集中部署在机箱中一块区域，导致电源模块占用计算模块散热空间，存在热级联现象，影响了电源模块自身散热，而本申请将第一模块与第二模块的位置分开，相互独立，第一模块与第二模块的散热空间不耦合，进而能够实现两模块独立散热。
在另一种可能的实现方式中，该第一子板为电源背板，该第二子板为信号背板。
应理解，本申请中电源背板可以用于连接电源模块，转换电压为各模块供电；信号背板可以用于系统内各模块间的通信。
因此，本申请通过设置服务器中的背板为电源背板和信号背板结合的双层结构，且设置信号背板与电源背板间具有一定的间隔距离，并通过挡风板将该空腔分割为用于为第一模块散热的第一风腔以及用于为第二模块散热的第二风腔。由于本申请中第一模块和第二模块分别具有独立的散热风腔。因此，本申请实现了电源背板相连的第一模块，与信号背板相连的第二模块之间的独立散热，进而本申请能够减轻系统散热结构的负载，提升整个服务器的散热性能。
在另一种可能的实现方式中，该服务器为机架式服务器或刀片式服务器。
第二方面，提供了一种服务器，该服务器包括机箱、至少一个第一模块和至少一个第二模块，该机箱包括背板，该背板设置在该机箱中，该背板包括第一子板、第二子板和至少一个挡风板；该第一子板和第二子板之间相隔离，该第一子板和该第二子板互相平行，该第一子板和该第二子板均与该服务器机箱的侧壁垂直；该至少一个挡风板位于该第一子板和该第二子板之间，且该至少一个挡风板中每个挡风板与该第一子板和该第二子板形成夹角；该至少一个挡风板将该第一子板、该第二子板、该机箱的侧壁、上壁和下壁围成的空间分割成第一风腔和至少一个第二风腔，围成该第一风腔的区域设置有用于空气流通的开孔，该第一风腔用于为至少一个第一模块散热，该至少一个第一模块中每个第一模块通过该第一风腔的入风口区域的该第一子板的接口连接该第一子板；围成每个该第二风腔的区域设置有用于空气流通的开孔，该第二风腔用于为至少一个第二模块散热，该至少一个第二模块中每个第二模块通过该第二风腔的出风口区域的该第二子板的接口连接该第二子板。
与传统的服务器机箱散热结构相比，本申请中通过将背板设置成两个相隔离的子板的结构，使得两个子板间形成空腔，并通过在该两个子板间设置至少一个挡风板，将该空腔分割为分别用于为第一模块散热的第一风腔，以及专门用于为第二模块散热的第二风腔。也就是说，本申请中第一模块和第二模块分别具有独立的散热风腔，因此，本申请实现了第一模块和第二模块的独立散热，提升了第一模块和第二模块的散热效率，进而提升了整个服务器的散热性能。
第二方面的服务器机箱的结构可以参考第一方面的服务器机箱的结构，此处不再赘述。
本申请在上述各方面提供的实现方式的基础上，还可以进行进一步组合以提供更多实现方式。
附图说明
图1是一种传统的服务器结构示意图。
图2是本申请提供的一种服务器的结构示意图。
图3是本申请提供的一种背板结构的示意图。
图4是本申请提供的一种背板结构的分解图。
图5是本申请提供的一种背板结构的俯视图。
图6是本申请提供的另一种服务器的结构示意图。
图7是本申请提供的另一种服务器的结构示意图。
图8是本申请提供的一种刀片式服务器的结构示意图。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
图1是一种传统的服务器的结构示意图。如图1所示的服务器100的机箱中设置有背板，以及与背板相连的多个模块。
图1中背板与模块之间可以通过连接器相连，例如，连接器可以为高密连接器。背板上和多个模块上均可以设置有相互连接的接口。该多个模块可以直接与该背板相连，也可以通过缆线相连。另外，图1中的背板可以是单层背板，也可以是双层紧密贴合的背板。
上述该多个模块可以包括至少一个第一模块，以及至少一个第二模块。其中，第一模块也可以称为计算模块或计算节点。第一模块可以包括中央处理器(central processing unit，CPU)模块、图形处理器(graphics processing unit，GPU)模块中任意一种，。第二模块为具有独立风扇的模块，包括电源模块、输入/输出(input/output，IO)模块、源测量单元(source measure unit，SMU)模块、串行数字接口(serial digital interface，SDI)模块和现场可编程门阵列(field programmable gate array，FPGA)异构计算模块中的任意一个，本申请实施例第二模块的具体形式不限于上述列举的内容。
如图1所示，第一模块可以设置在背板的一侧，第二模块可以设置在该背板的另一侧。
如图1所示，传统的服务器机箱中第一模块(例如，CPU或GPU)会与第二模块(例如，电源模块)设置在同一散热风腔(也可以称为系统风腔)中,即上述多个模块共用一个散热风腔。由于基于上述设置的机箱中第一模块的风腔通常与第二模块的风腔耦合在一起，因此，如图1所示的服务器中的散热气流的走向如下：散热气流可以从服务器机箱的一端(也可以称为服务器的前端)进入该机箱，经过上述各个模块。例如，先经过第一模块，然后再经过第二模块，由机箱的另一端(也可以称为服务器的后端)流出该机箱。
应理解，在本申请实施例中名词“风腔”可以表示气流流通的载体。
由图1可知，上述服务器机箱的散热结构中多个模块的散热会存在热级联现象。具体而言，散热气流从服务器进风口进入服务器机箱后，每经过一个模块均会带走该模块的热量，气流的温度随着所流经模块的数量增多而升高。而且，随着服务器的计算能力增强，功耗密度逐渐增加，大功率模块(如CPU、GPU等)的功耗越来越高，那么，对于靠近服务器后端(出风口)的模块，例如，对于第二模块(例如，电源模块)而言，气流先经过第一模块(例如，CPU)后，会带走第一模块的热量，使服务器机箱内气流的温度升高，此时，气流的降温效果变差，不利于对后面的模块散热，降低了整个服务器的散热性能。
值得说明的是，虽然电源等模块带有独立的风扇，但是，服务器的进风口仅有一个，风扇只能控制气流的流向，在同一风腔内无法控制气流所流经模块的先后顺序。
鉴于上述问题，本申请实施例，提出一种服务器的机箱，该服务器的机箱中将第一模块和第二模块的风腔解耦，第一模块和第二模块可以利用独立的风腔散热，进而本申请实 施例提供的技术方案能够避免第一模块和第二模块间的热级联现象，提高第一模块和第二模块的散热效率，提升整个服务器的散热性能。
以下，为了便于理解和说明，作为示例而非限定，结合附图详细描述本申请实施例的服务器的架构。图2是本申请提供的一种服务器的机箱的架构示意图。如图2所示，服务器200的机箱220中包括背板210，背板210又包括第一子板211、第二子板212和挡风板213。第一子板211和第二子板212之间相隔离，第一子板211和第二子板212互相平行，且第一子板211和第二子板212均与服务器机箱的侧壁垂直。挡风板213位于第一子板211和第二子板212之间，且挡风板213与第一子板211和第二子板212分别形成夹角。
至少一个挡风板213(图2中以一个挡风板213为例)将第一子板211、第二子板212、机箱220的侧壁、上壁和下壁围成的空间分成第一风腔和至少一个第二风腔(图2中仅示出了一个第二风腔的例子)。围成第一风腔的区域设置有用于空气流通的开孔，第一风腔用于至少一个第一模块散热，每个第一模块通过第一风腔的入风口区域的第一子板的接口连接第一子板。围成第二风腔的每个第二风腔的区域设置有用于空气流通的开孔，第二风腔用于至少一个第二模块散热，每个第二模块通过第二风腔的出风口区域的所述第二子板的接口接入第二子板。
其中，挡风板213分别与第一子板211和第二子板212之间形成两个夹角，挡风板213与第一子板211之间形成第一夹角，挡风板213与第二子板212之间形成第二夹角。
作为一个可能的实施例，挡风板213分别与第一子板211和第二子板212相交形成夹角。挡风板213与第一子板和第二子板相交可以包括多种形式。当挡风板分别与第一子板和第二子板形成夹角，但挡风板与侧壁相交时，机箱侧壁、上壁、下壁、第一子板、第二子板可以以各种组合形成不同的第二风腔。例如，如图2所示，挡风板213分别与第一子板211、机箱侧壁和第二子板212相交于一条直线。当挡风板分别与第一子板和第二子板形成夹角，但挡风板不与侧壁相交时，机箱侧壁、上壁、下壁、第一子板、第二子板可以以各种组合形成不同的第二风腔，相应的开孔方式也有不同。
可选地，第一子板211与第二子板212之间通过母线组件(Busbar)214相连，母线组件214用于为第二子板212供电。母线组件214还可以用于第一子板211与第二子板212之间的信号传递。
可选地，第一子板211和第二子板212之间设置有固定支撑架215，固定支撑架215用于支撑第一子板211和第二子板212，以使第一子板211和第二子板212之间形成隔离距离。
可选地，第一子板211和第二子板212之间的隔离距离取值属于预设集合，第一子板和第二子板之间的隔离距离的大小与服务器的机箱尺寸和/或机箱内部模块布局相关。例如，预设集合的最小值可以为20mm或25mm等，预设集合的最大值可以为50mm或60mm，本申请实施例并不限于此。
应理解，两个子板间的距离大小影响了上述两个风腔的大小，其中，风腔的大小能够影响该风腔的阻力与风速，进而可以影响散热性能。在实际应用中，两个子板间的距离间隔会根据实际的机箱尺寸参数(例如，机箱的深度即机箱前端至后端的距离)和/或机箱内部模块的布局等因素而定，本申请实施例并不限于此。
应理解，图2示出了机箱中的背板包括一个挡风板213的例子，但本申请实施里并不 限于此，例如，背板可以包括2个挡风板(如图6所示)，背板也可以包括3个挡风板(如图7所示)或着背板包括更多个挡风板。
示例地，下面结合图3至图5描述包括两个挡风板的背板的具体结构。其中，图3为本申请提供的一种背板结构的示意图，图4为本申请提供的一种背板结构的分解图。图5为本申请提供的一种背板结构的俯视图。
如图3至图5所示的背板300包括第一子板311和第二子板312和两个挡风板313，其中，图3至图5中的第一子板311可以与图2、图6和图7中的第一子板211对应，图3至图5中的第二子板312可以与图2、图6和图7中的第二子板212对应。图3至图5中的挡风板313可以与图2、图6和图7中的挡风板213对应。如图3和图5所示，由于挡风板313与第一子板312和第二子板313具有夹角，因此，可以将该挡风板313称为斜形构件。
如图3和图5所示，该第一子板311和第二子板312之间相隔离，即第一子板和第二子板之间设置有一定的距离，例如，该隔离距离可以为25mm、30mm、35mm等，本申请实施例并不限于此。
如图3和图5所示，该第一子板311与该第二子板312之间通过母线组件(Busbar)314相连。母线组件314用于为第一子板311供电。母线组件214还可以用于第一子板311与第二子板312之间的信号传递。
可选地，该第一子板311和该第二子板312之间设置有固定支撑架315，该固定支撑架315用于固定第一子板311和第二子板312。例如，如图4所示该固定支撑架315为倒“F”形结构，该固定支撑架还可以为其他的形状，本申请实施例并不限于此。
两个挡风板313位于该第一子板311和该第二子板312之间，且分别设置在靠近该服务器机箱的侧壁位置。
接下来，结合图2进一步介绍机箱中第一风腔和第二风腔的结构。
第一风腔由第一子板211的第一部分、第二子板212的第一部分、机箱的上壁的第一部分、下壁的第一部分与挡风板213围成。应理解，在图2中，当服务器的机箱内仅设置有一个挡风板时，围成第一风腔的区域还需要包括机箱侧壁的第一部分。在下文中如图3所示，围成第一风腔的区域可以不包括机箱侧壁。
在第一子板211的第一部分上设置有第一开孔，在第二子板212的第一部分上设置有第二开孔。在第一风腔中，气流从第一开孔进入第一风腔，并经过第二开孔流出所述第一风腔。
应理解，如图2所示，当挡风板与服务器的机箱侧壁相交时该第一子板的第一部分可以为第一子板的全部。当挡风板与服务器的机箱侧壁不相交时，该第一子板的第一部分可以包括第一子板上围成第一风腔的区域。
围成第二风腔的区域可以包括以下方式中任意一种：
方式一：当挡风板213与服务器的机箱侧壁相交时，第二风腔由第二子板212的第二部分、服务器的机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与挡风板213围成。第二风腔的横截面为一个“三角形”结构，图2示出了一种方式一中第二风腔的结构示意图。
应理解，第二子板的第二部分是指第二子板上围成第二风腔的区域。与此类似，服务 器侧壁的第二部分为侧壁上围成第二风腔的区域，上壁的第二部分为上壁上围成第二风腔的区域、下壁的第二部分为下壁上围成第二风腔的区域。
方式二：当挡风板213与服务器的机箱侧壁不相交时，第二风腔由第一子板211的第二部分、第二子板212的第二部分、服务器机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与挡风板213围成。第二风腔的横截面为一个“直角梯形”结构。
应注意，在图2中，围成第一风腔的机箱的侧壁与围成第二风腔的机箱的侧壁为不同侧的两个侧壁。
围成第二风腔的区域的开孔方式可以采用以下方式中任意一种方式实现：
方式一：在第二子板的第二部分(也即第二子板上围成第二风腔的区域)上设置有第三开孔，在机箱侧壁的第二部分设置有第四开孔。那么，在第二风腔中，气流从第四开孔进入所述第二风腔，并经过第三开孔流出第二风腔。
方式二：在第二子板的第二部分上设置有第三开孔，在机箱侧壁的第二部分上设置有第四开孔，在机箱上壁的第二部分设置有第五开孔。那么，在第二风腔中，气流从第四开孔和/或所述第五开孔进入第二风腔，并经过第三开孔流出所述第二风腔。
可选地，第一子板211上的开孔率大于第一开孔率阈值，第二子板212上的开孔率大于第二开孔率阈值。第一子板上的开孔率用于指示在第一子板上所有开孔的面积之和与第一子板的面积的比例，所述第二子板上的开孔率用于指示在第二子板上所有开孔的面积之和与第二子板的面积的比例。
可选地，当每个开孔的面积相同的情况下，第一子板的开孔率也可以指示第一子板单位面积上开孔的数量。类似地，第二子板的开孔率也可以指示第二子板单位面积上开孔的数量。
应理解，第一开孔率阈值或第二开孔率阈值可以为现有单层背板或紧密贴合的双层背板的最大开孔率。例如，按照业务需求，第一开孔率阈值和第二开孔率阈值为20％。
传统的服务器中的单层背板的结构中，由于背板上需要信号和电源同时走线，因此，开孔受到限制，使得开孔率较小，例如仅为10％等。而本申请实施例中，通过两层结构的设计，使得信号和电源分别在不同的子板上走线，单个子板上的走线较少，因此，本申请实施例中的开孔限制较小，开孔率得以增加，由于本申请实施例中的子板上的开孔率较大，能够降低风腔对气流的阻力，使得空气在机箱中的更加流畅流通，提升服务器的散热性能。
应理解，在实际应用中，该第一开孔率阈值、第二开孔率阈值的具体取值可以根据实际情况而定，本申请实施例并不限于此。
如图2所示，第一子板211、第二子板212、机箱220的上壁和下壁构成的一个空间将机箱内部分割为第一空间和第二空间两部分。其中，与图1中第一模块和第二模块接入机箱的方式类似，在第一空间中第一模块通过第一子板的接口接入第一子板，具体通过第一风腔的入风口区域的第一子板的接口接入第一子板。在第二空间中第二模块通过第二子板的接口接入第二子板，具体通过第二风腔出风口区域的第二子板的接口接入第二子板。其中，第一风腔的入风口区域是指第一风腔气流进入的区域。第二风腔的出风口区域是指第二风腔气流流出的区域。
例如，如图2所示，第一风腔的入风口为第一子板上的第一开孔，第一风腔的入风口区域可以表示第一空间中以第一开孔为中心，预设长度为半径的圆形区域。或者，第一风 腔的入风口区域也可以表示为以第一开孔为中心，预设长度为边长的正方形或长方形区域。该第二风腔的出风口为第二子板上的第三开孔，该第二风腔的出风口区域可以表示第二空间中以第三开孔为中心，预设长度为半径的圆形区域。或者，第二风腔的出风口区域也可以表示为以第三开孔为中心，预设长度为边长的正方形或长方形区域。当第一空间存在多个第一开孔时，第一风腔的入风口区域可以是按照预置算法确定的一个以多个第一开孔围成的区域为中心的圆形或其他形状(如正方形或长方形)区域，保证第一风腔的气流可以通过该区域流经第一模块。类似地，当第二空间也存在多个第二开孔时，第二风腔的出风口区域可以按照预置算法确定的一个以多个第三开孔围成的区域为中心的圆形或其他形状(如正方形或长方形)区域，保证第二风腔的气流可以通过该区域流经第二模块。
当至少一个第一模块通过第一子板接入机箱时，第一风腔用于对至少一个第一模块进行散热。具体地，气流从靠近第一子板的机箱一侧进入机箱，经过至少一个第一模块后，再通过第一子板上的第一开孔进入第一风腔，再经过第二子板上的第二开孔流出第一风腔，由此，将至少一个第一模块的热量带出机箱内部。
应理解，在靠近机箱尾部(第二子板右侧)设置有系统散热风扇(图中未示出)，该系统散热风扇主要控制流经至少一个第一模块的气流流向，使气流可以按照上述流向流经第一模块后将热量带出机箱。
对于第二模块，由于每个第二模块配置有独立风扇，该风扇可以用于控制流经第二模块的气流流向。具体地，当第二风腔的开孔方式采用方式一时，气流从机箱侧壁上的第四开孔进入第二风腔，再通过第二子板上第三开孔流出第二风腔，经过至少一个第二模块后流出机箱，以此将至少一个第二模块的热量带出机箱。当第二风腔的开孔方式采用方式二时，气流从机箱的上壁的第五开孔和/或侧壁上的第四开孔流入第二风腔，再通过第二子板上第三开孔流出第二风腔，经过至少一个第二模块后流出机箱，以此将至少一个第二模块的热量带出机箱。
与传统的服务器机箱散热结构相比，本申请实施例中通过将背板设置成两个相隔离的子板的结构，使得两个子板间形成空腔，并通过在该两个子板间设置至少一个挡风板，将该空腔分割为分别用于为第一模块散热的第一风腔，以及专门用于为第二模块散热的第二风腔。也就是说，本申请实施例中第一模块和第二模块分别具有独立的散热风腔，因此，本申请实现了第一模块和第二模块的独立散热，提升了第一模块和第二模块的散热效率，进而提升了整个服务器的散热性能。
接下来，结合图6进一步介绍本申请实施例提供的服务器机箱。图6与图2的差别在于图6中利用两块挡风板将第一子板、第二子板、机箱上壁和下壁围成的空间分割为一个第一风腔和两个第二风腔。
具体地，如图6所示，服务器200的机箱220中包括背板210，背板210又包括第一子板211、第二子板212和两个挡风板213。第一子板211和第二子板212之间相隔离，第一子板211和第二子板212互相平行，且第一子板211和第二子板212均与服务器机箱的侧壁垂直。如图6所示，两个挡风板213位于第一子板211和第二子板212之间，且该两个挡风板213与第一子板211和第二子板212分别形成夹角。其中，两个挡风板213可以以该服务器机箱的中轴线为准对称放置，也可以以非对称的结构放置。
两个挡风板213将第一子板211、第二子板212、机箱220的侧壁、上壁和下壁围成 的空间分成第一风腔和两个第二风腔。围成第一风腔的区域设置有用于空气流通的开孔，第一风腔用于至少一个第一模块散热，每个第一模块通过第一风腔的入风口区域的第一子板的接口连接第一子板。围成第二风腔的每个第二风腔的区域设置有用于空气流通的开孔，第二风腔用于至少一个第二模块散热，每个第二模块通过第二风腔的出风口区域的所述第二子板的接口接入第二子板。其中，挡风板213分别与第一子板和第二子板相交形成两个夹角，挡风板213与第一子板212之间形成第一夹角，挡风板213与第二子板212之间形成第二夹角。
图6的机箱中包括两个第二风腔，因此，服务器的机箱中可以设置两组第二模块，每组第二模块可以包括至少一个第二模块，其中，每一个第二风腔可以对应一组第二模块，每一个第二风腔用于与之对应的一组第二模块散热。图2中的机箱中包括一个第二风腔，因此，服务器的机箱中仅可以设置一组第二模块，该一个第二风腔可以用于该一组第二模块散热。
如图6所示，图6与图2的区别还包括，图6中围成第一风腔的部件可以不包括机箱的侧壁，图2中围成第一风腔的部件需要包括机箱的侧壁。具体地，图6中的第一风腔是由该两个挡风板213、第一子板211的第一部分、第二子板212的第一部分、机箱上壁的第一部分和机箱下壁的第一部分共同围成。而图2中的第一风腔是由挡风板213、第一子板212的第一部分、第二子板212的第一部分以及机箱的侧壁的第一部分共同围成。
应理解，图6中两个第二风腔均与图2中的第二风腔的结构类似，两个第二风腔可以以该服务器机箱的中轴线为准成对称结构设置。下文将结合图3以一个第二风腔的结构描述气流的走向，由于两个第二风腔的结构对称，另一个第二风腔的结构与气流走向，可以参考该一个第二风腔的描述，为避免重复，此处不再赘述。
如图6所示，第一子板211、第二子板212、机箱220的上壁和下壁构成的一个空间，该空间将机箱内部分割为第一空间和第二空间两部分。其中，与图1中第一模块和第二模块接入机箱的方式类似，在第一空间中第一模块通过第一子板的接口接入第一子板，具体通过第一风腔的入风口区域的第一子板的接口接入第一子板。在第二空间中第二模块通过第二子板的接口接入第二子板，具体通过第二风腔出风口区域的第二子板的接口接入第二子板。图3中的第二模块可以分成两组，该两组第二模块分别设置在该两个第二风腔出风口区域。其中，第一风腔的入风口区域是指第一风腔气流进入的区域。第二风腔的出风口区域是指第二风腔气流流出的区域。
当至少一个第一模块通过第一子板接入机箱时，第一风腔用于对至少一个第一模块进行散热。具体地，气流从靠近第一子板的机箱一侧进入机箱，经过至少一个第一模块后，再通过第一子板上的第一开孔进入第一风腔，再经过第二子板上的第二开孔流出第一风腔，由此，将至少一个第一模块的热量带出机箱内部。
应理解，在靠近机箱尾部(第二子板右侧)设置有系统散热风扇(图中未示出)，该系统散热风扇主要控制流经至少一个第一模块的气流流向，使气流可以按照上述流向流经第一模块后将热量带出机箱。
对于第二模块，由于第二模块配置有独立风扇，该风扇可以用于控制流经第二模块的气流流向。具体地，当第二风腔的开孔方式采用方式一时，气流从机箱侧壁上的第四开孔进入第二风腔，再通过第二子板上第三开孔流出第二风腔，经过至少一个第二模块后流出 机箱，以此将至少一个第二模块的热量带出机箱。当第二风腔的开孔方式采用方式二时，气流从机箱的上壁的第五开孔和/或侧壁上的第四开孔流入第二风腔，再通过第二子板上第三开孔流出第二风腔，经过至少一个第二模块后流出机箱，以此将至少一个第二模块的热量带出机箱。
与传统的服务器散热结构相比，本申请实施例中通过将背板设置成两个相隔离的子板的结构，使得两个子板间形成空腔，并通过在该两个子板间设置至少一个挡风板，将该空腔分割为分别用于为第一模块散热的第一风腔，以及专门用于为第二模块散热的第二风腔，也就是说，本申请实施例中第一模块和第二模块分别具有独立的散热风腔，因此，本申请实现了第一模块和第二模块的独立散热，提升了第一模块和第二模块的散热效率，进而提升了整个服务器的散热性能。
上文结合图2描述了机箱中具有一个挡风板的例子，结合图6描述了机箱中具有两个挡风板的例子。但本申请实施里并不限于此，与图2或图6的例子类似，本申请实施例的服务器的机箱可以扩展到具有更多个挡风板的情况。
例如，服务器的机箱中具有三个档风板或更多个挡风板。如图7所示，在服务器的机箱中具有三个挡风板213时，该三个挡风板213可以将位于第一子板211和该第二子板212之间，且该三挡风板中每个挡风板均与该第一子板和该第二子板形成夹角；该三个挡风板将该第一子板211、该第二子板212、该机箱的侧壁、上壁和下壁围成的空间分割成4个风腔，其中，该4个风腔可以包括一个第一风腔和三个第二风腔。在一种可能的实现方式中，如图7所示，该三个第二风腔中的两个第二风腔，即第一个第二风腔和第二个第二风腔的结构可以与图6中的两个第二风腔的结构类似，第三个第二风腔可以由三个挡风板中的两个挡风板、机箱的上壁和下壁共同围成，该第三个第二风腔的入风口为机箱上壁上的开孔，出风口为第二子板上的开孔，类似的，该第三个第二风腔对应的一组第二模块可以通过该第二风腔的出风口区域的该第二子板的接口连接该第二子板。具体的，第二风腔中的气流走向可以参考上文图2和图6中的描述，为避免重复，此次不再赘述。
当服务器的机箱中设置有更多个挡风板(例如，4个、5个…挡风板)时，第二风腔的结构与三个挡风板的结构类似，为避免重复，此次不再赘述。
应理解，上述实施例中涉及的数值的举例是为了帮助本领域技术人员更好地理解本发明实施例，而非限制本发明的范围。
需要说明的是，本发明各实施例中的内容可以相互结合，本申请实施例并不限于此。
应注意，图2至图7所示的机箱的示例仅仅是为了帮助本领域技术人员理解本发明实施例，而非要将本发明实施例限于所例示的具体数值或具体场景。本领域技术人员根据所给出的图2和图7的例子，显然可以进行各种等价的修改或变化，这样的修改或变化也落入本发明实施例的范围内。
上文结合图2至图7描述了本申请实施例的服务器的机箱结构。下面结合图8，以服务器为刀片式服务器为例进一步介绍本申请实施例提供的散热结构。
如图8所示，刀片式服务器中包括机箱、至少一个第一模块和至少一个第二模块，所述机箱包括背板，所述背板设置在所述机箱中，所述背板包括第一子板、第二子板和至少一个挡风板。其中，电源模块与图2、图6和图7所示服务器的第二模块对应，电源背板与图2、图6和图7所示的第二子板对应，计算模块与图2、图6和图7所示服务器的第 一模块对应，信号背板与图2、图6和图7所示的第一子板对应。通过这种布局，在电源模块的风扇工作时，冷却气流经过该机箱侧壁上的开孔进入该电源风腔，并经过该电源背板上的开孔流出该电源风腔，之后，该冷却气流流经该电源模块，由电源风扇处流出，带走该电源模块的热量。在服务器的系统风扇工作时，冷却气流可以经过机箱前端的进入口(例如为设置在面板上的进风口)进入机箱，流经计算模块时带走该计算模块的热量，之后，携带计算模块热量的气流经过系统风腔的进风口进入系统风腔，并经过系统风腔的出风口流出该系统风腔，最终，将计算模块的热量带出机箱。
应理解，电源背板可以用于连接电源模块，转换电压为机箱中各模块供电；信号背板可以用于机箱内各模块间的通信。
在本申请实施例中，由于电源模块带有风扇，且电源模块设置有独立的风腔即电源风腔，因此，通过该电源模块的风扇可以控制气流进出该电源风腔，以对该电源模块散热。具体而言，本申请实施例中可以将电源模块与电源背板相连，将计算模块与信号背板相连，将该电源模块可以设置在电源风腔的出风口处；将该计算模块可以设置在该机箱中系统风腔的入风口之前的位置。其中，电源模块与图2、图6和图7所示服务器的第二模块对应，电源背板与图2、图6和图7所示的第二子板对应，计算模块与图2、图6和图7所示服务器的第一模块对应，信号背板与图2、图6和图7所示的第一子板对应。通过这种布局，在电源模块的风扇工作时，冷却气流经过该机箱侧壁上的开孔进入该电源风腔，并经过该电源背板上的开孔流出该电源风腔，之后，该冷却气流流经该电源模块，由电源风扇处流出，带走该电源模块的热量。在服务器的系统风扇工作时，冷却气流可以经过机箱前端的进入口(例如为设置在面板上的进风口)进入机箱，流经计算模块时带走该计算模块的热量，之后，携带计算模块热量的气流经过系统风腔的进风口进入系统风腔，并经过系统风腔的出风口流出该系统风腔，最终，将计算模块的热量带出机箱。
具体地，该机箱的具体结构以及机箱中的散热过程及能够实现的有益效果可以参见上文图2至图8中的描述，为了避免重复，此处不再赘述。
本申请实施例通过电源风腔专门用于为电源模块散热，系统风腔专门用于为计算模块散热，避免了电源模块与计算模块耦合在一起使用相同的风腔散热的问题，因此，本申请实施例能够将电源模块与计算模块的散热结构解耦，实现电源模块与计算模块的独立散热，进而避免电源模块与计算模块之间的热级联现象，提升服务器的散热性能。
作为一种可能的实施例，本申请实施例还可以应用于机架式服务器，该机架式服务器包括至少一个第一模块和至少一个第二模块，所述机箱包括背板，所述背板设置在所述机箱中，所述背板包括第一子板、第二子板和至少一个挡风板。具体的散热结构和散热过程与图8类似，为了避免重复，此处不再赘述。
说明书通篇中提到的“一个实施例”或“一实施例”意味着与实施例有关的特定特征、结构或特性包括在本发明的至少一个实施例中。因此，在整个说明书各处出现的“在一个实施例中”或“在一实施例中”未必一定指相同的实施例。此外，这些特定的特征、结构或特性可以任意适合的方式结合在一个或多个实施例中。
还应理解，在本发明实施例中，第一、第二、第三和第四只是为了区分像素点，而不应该对本发明的保护范围构成任何限定。
本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关 系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
应理解，在本发明实施例中，“与A相应的B”表示B与A相关联，根据A可以确定B。但还应理解，根据A确定B并不意味着仅仅根据A确定B，还可以根据A和/或其它信息确定B。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (27)

  1. 一种服务器的机箱，其特征在于，包括背板，所述背板设置在所述服务器机箱内，所述背板包括：
    第一子板、第二子板和至少一个挡风板；
    所述第一子板和第二子板之间相隔离，所述第一子板和所述第二子板互相平行，所述第一子板和所述第二子板均与所述服务器机箱的侧壁垂直；
    所述至少一个挡风板位于所述第一子板和所述第二子板之间，且所述至少一个挡风板中每个挡风板与所述第一子板和所述第二子板形成夹角；
    所述至少一个挡风板将所述第一子板、所述第二子板、所述机箱的侧壁、上壁和下壁围成的空间分割成第一风腔和至少一个第二风腔，围成所述第一风腔的区域设置有用于空气流通的开孔，所述第一风腔用于为至少一个第一模块散热，所述至少一个第一模块中每个第一模块通过所述第一风腔的入风口区域的所述第一子板的接口连接所述第一子板；围成每个所述第二风腔的区域设置有用于空气流通的开孔，所述第二风腔用于为至少一个第二模块散热，所述至少一个第二模块中每个第二模块通过所述第二风腔的出风口区域的所述第二子板的接口连接所述第二子板。
  2. 根据权利要求1所述的服务器的机箱，其特征在于，包括：
    当所述第一挡风板与所述服务器的机箱侧壁相交时，所述第二风腔由所述第二子板的第二部分、所述服务器的机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与所述第一挡风板围成。
  3. 根据权利要求1所述的服务器的机箱，其特征在于，包括：
    当所述第一挡风板与所述服务器的机箱侧壁不相交时，所述第二风腔由所述第一子板的第二部分、所述第二子板的第二部分、所述服务器机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与所述第一挡风板围成。
  4. 根据权利要求2或3所述的服务器的机箱，其特征在于，所述围成所述第二风腔的区域设置有用于空气流通的开孔，包括：
    在所述第二子板的第二部分设置有第三开孔，在所述机箱侧壁的第二部分设置有第四开孔，在所述第二风腔中，气流从所述机箱侧壁的所述第四开孔进入所述第二风腔，并经过所述第二子板上的所述第三开孔流出所述第二风腔。
  5. 根据权利要求2或3所述的服务器的机箱，其特征在于，所述围成所述第二风腔的区域设置有用于空气流通的开孔，包括：
    在所述第二子板的第二部分设置有第三开孔，在所述机箱侧壁的第二部分设置有第四开孔，在所述机箱上壁的第二部分设置有第五开孔，在所述第二风腔中，气流从所述第四开孔和/或所述第五开孔进入所述第二风腔，并经过所述第二子板上的所述第三开孔流出所述第二风腔。
  6. 根据权利要求2所述的服务器的机箱，其特征在于，包括：
    所述第一风腔由所述第一子板、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分、侧壁的第一部分与所述挡风板围成；或者，所述第一风腔由所述第 一子板、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分与所述挡风板围成；
    所述围成所述第一风腔的区域设置有用于空气流通的开孔，包括：
    在所述第一子板设置有第一开孔，在所述第二子板的第一部分设置有第二开孔，在所述第一风腔中，气流从所述第一子板上的所述第一开孔进入所述第一风腔，并经过所述第二子板上的所述第二开孔流出所述第一风腔。
  7. 根据权利要求3所述的服务器的机箱，其特征在于，包括：
    所述第一风腔由所述第一子板的第一部分、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分与所述挡风板围成；或者，所述第一风腔由所述第一子板的第一部分、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分与所述挡风板围成；
    所述围成所述第一风腔的区域设置有用于空气流通的开孔，包括：
    在所述第一子板的第一部分设置有第一开孔，在所述第二子板的第一部分设置有第二开孔，在所述第一风腔中，气流从所述第一子板上的所述第一开孔进入所述第一风腔，并经过所述第二子板上的所述第二开孔流出所述第一风腔。
  8. 根据权利要求1至7中任一项所述的服务器的机箱，其特征在于，包括
    所述第一子板和所述第二子板之间的隔离距离的大小与所述服务器的机箱尺寸和/或所述机箱内部模块布局相关。
  9. 根据权利要求1至8中任一项所述的服务器的机箱，其特征在于，包括：
    所述第一子板与所述第二子板之间通过母线组件相连，所述母线用于为所述第二子板供电。
  10. 根据权利要求1至9中任一项所述的服务器的机箱，其特征在于，包括：
    所述第一子板和所述第二子板上之间设置有固定支撑架，所述固定支撑架用于固定所述第一子板和所述第二子板，以使所述第一子板和第二子板之间形成隔离距离。
  11. 根据权利要求1至10中任一项所述的服务器的机箱，其特征在于，包括：
    所述第一子板上的开孔率大于第一开孔率阈值，所述第二子板上的开孔率大于第二开孔率阈值，所述第一子板上的开孔率用于指示在所述第一子板上所有开孔的面积之和与第一子板的面积的比例，所述第二子板上的开孔率用于指示在所述第二子板上所有开孔的面积之和与所述第二子板的面积的比例。
  12. 根据权利要求1至11所述的服务器的机箱，其特征在于，包括：
    所述至少一个第一模块中每个第一模块包括图形处理器GPU模块和中央处理器CPU模块中任意一种；
    所述至少一个第二模块中每个第二模块配置有独立风扇。
  13. 根据权利要求1至12中任一项所述的服务器的机箱，其特征在于，包括：
    所述第一子板为信号背板，所述第二子板为电源背板。
  14. 根据权利要求1至13中任一项所述的服务器的机箱，其特征在于，包括：
    所述服务器为机架式服务器或刀片式服务器。
  15. 一种服务器，其特征在于，所述服务器包括机箱、至少一个第一模块和至少一个第二模块，所述机箱包括背板，所述背板设置在所述机箱内，所述背板包括第一子板、第 二子板和至少一个挡风板；
    所述第一子板和第二子板之间相隔离，所述第一子板和所述第二子板互相平行，所述第一子板和所述第二子板均与所述服务器机箱的侧壁垂直；
    所述至少一个挡风板位于所述第一子板和所述第二子板之间，且所述至少一个挡风板中每个挡风板与所述第一子板和所述第二子板形成夹角；
    所述至少一个挡风板将所述第一子板、所述第二子板、所述机箱的侧壁、上壁和下壁围成的空间分割成第一风腔和至少一个第二风腔，围成所述第一风腔的区域设置有用于空气流通的开孔，所述第一风腔用于为至少一个第一模块散热，所述至少一个第一模块中每个第一模块通过所述第一风腔的入风口区域的所述第一子板的接口连接所述第一子板；围成每个所述第二风腔的区域设置有用于空气流通的开孔，所述第二风腔用于为至少一个第二模块散热，所述至少一个第二模块中每个第二模块通过所述第二风腔的出风口区域的所述第二子板的接口连接所述第二子板。
  16. 根据权利要求15所述的服务器，其特征在于，包括：
    当所述第一挡风板与所述服务器的机箱侧壁相交时，所述第二风腔由所述第二子板的第二部分、所述服务器的机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与所述第一挡风板围成。
  17. 根据权利要求15所述的服务器，其特征在于，包括：
    当所述第一挡风板与所述服务器的机箱侧壁不相交时，所述第二风腔由所述第一子板的第二部分、所述第二子板的第二部分、所述服务器机箱侧壁的第二部分、上壁的第二部分、下壁的第二部分与所述第一挡风板围成。
  18. 根据权利要求15或16所述的服务器，其特征在于，所述围成所述第二风腔的区域设置有用于空气流通的开孔，包括：
    在所述第二子板的第二部分设置有第三开孔，在所述机箱侧壁的第二部分设置有第四开孔，在所述第二风腔中，气流从所述机箱侧壁的所述第四开孔进入所述第二风腔，并经过所述第二子板上的所述第三开孔流出所述第二风腔。
  19. 根据权利要求15或16所述的服务器，其特征在于，所述围成所述第二风腔的区域设置有用于空气流通的开孔，包括：
    在所述第二子板的第二部分设置有第三开孔，在所述机箱侧壁的第二部分设置有第四开孔，在所述机箱上壁的第二部分设置有第五开孔，在所述第二风腔中，气流从所述第四开孔和/或所述第五开孔进入所述第二风腔，并经过所述第二子板上的所述第三开孔流出所述第二风腔。
  20. 根据权利要求16所述的服务器，其特征在于，包括：
    所述第一风腔由所述第一子板、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分、侧壁的第一部分与所述挡风板围成；或者，所述第一风腔由所述第一子板、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分与所述挡风板围成；
    所述围成所述第一风腔的区域设置有用于空气流通的开孔，包括：
    在所述第一子板设置有第一开孔，在所述第二子板的第一部分设置有第二开孔，在所述第一风腔中，气流从所述第一子板上的所述第一开孔进入所述第一风腔，并经过所述第 二子板上的所述第二开孔流出所述第一风腔。
  21. 根据权利要求17所述的服务器，其特征在于，包括：
    所述第一风腔由所述第一子板的第一部分、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分与所述挡风板围成；或者，所述第一风腔由所述第一子板的第一部分、所述第二子板的第一部分、所述机箱的上壁的第一部分、下壁的第一部分与所述挡风板围成；
    所述围成所述第一风腔的区域设置有用于空气流通的开孔，包括：
    在所述第一子板的第一部分设置有第一开孔，在所述第二子板的第一部分设置有第二开孔，在所述第一风腔中，气流从所述第一子板上的所述第一开孔进入所述第一风腔，并经过所述第二子板上的所述第二开孔流出所述第一风腔。
  22. 根据权利要求15至21所述的服务器，其特征在于，包括：
    所述第一子板和所述第二子板之间的隔离距离的大小与所述服务器的机箱尺寸和/或所述机箱内部模块布局相关。
  23. 根据权利要求15至22中任一项所述的服务器，其特征在于，包括：
    所述第一子板和所述第二子板上之间设置有固定支撑架，所述固定支撑架用于固定所述第一子板和所述第二子板，以使所述第一子板和第二子板之间形成隔离距离。
  24. 根据权利要求15至23中任一项所述的服务器，其特征在于，包括：
    所述第一子板上的开孔率大于第一开孔率阈值，所述第二子板上的开孔率大于第二开孔率阈值，所述第一子板上的开孔率用于指示在所述第一子板上所有开孔的面积之和与所述第一子板的面积的比例，所述第二子板上的开孔率用于指示在所述第二子板上的所有开孔的面积之和与所述第二子板的面积的比例。
  25. 根据权利要求15至24中任一项所述的服务器，其特征在于，包括：
    所述至少一个第一模块中每个第一模块包括图形处理器GPU模块和中央处理器CPU模块中任意一种；
    所述至少一个第二模块中每个第二模块配置有独立风扇。
  26. 根据权利要求15至25中任一项所述的服务器，其特征在于，包括：
    所述第一子板为信号背板，所述第二子板为电源背板。
  27. 根据权利要求15至26中任一项所述的服务器，其特征在于，包括：
    所述服务器为机架式服务器或刀片式服务器。
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