WO2020078285A1 - 镜头、主动发光模组及终端 - Google Patents

镜头、主动发光模组及终端 Download PDF

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Publication number
WO2020078285A1
WO2020078285A1 PCT/CN2019/110842 CN2019110842W WO2020078285A1 WO 2020078285 A1 WO2020078285 A1 WO 2020078285A1 CN 2019110842 W CN2019110842 W CN 2019110842W WO 2020078285 A1 WO2020078285 A1 WO 2020078285A1
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WIPO (PCT)
Prior art keywords
lens
terminal
wire
static
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/110842
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English (en)
French (fr)
Inventor
何瑛勇
唐玮
史斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to US17/285,207 priority Critical patent/US11982859B2/en
Priority to CN201980067407.7A priority patent/CN112889260B/zh
Priority to EP19873420.4A priority patent/EP3855710B1/en
Publication of WO2020078285A1 publication Critical patent/WO2020078285A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/011—Arrangements for interaction with the human body, e.g. for user immersion in virtual reality
    • G06F3/013—Eye tracking input arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/017—Gesture based interaction, e.g. based on a set of recognized hand gestures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
    • G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
    • G06F3/04883—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04104—Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04108—Touchless 2D- digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface without distance measurement in the Z direction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/02—Details of telephonic subscriber devices including a Bluetooth® interface
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/04—Details of telephonic subscriber devices including near field communication means, e.g. RFID
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/06—Details of telephonic subscriber devices including a wireless LAN interface
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/22—Details of telephonic subscriber devices including a touch pad, a touch sensor or a touch detector

Definitions

  • the invention relates to the technical field of electronic terminal equipment, in particular to a lens, an active light emitting module and a terminal.
  • 3D sensing technology is a research hotspot in the field of electronic terminal devices (such as mobile phones).
  • 3D sensing technology is a depth sensing technology, which can further improve the face recognition or iris recognition function, enhance the face and object recognition function of the terminal camera, and is suitable for augmented reality, games, automatic driving and other functions.
  • This type of active light-emitting module usually includes a laser and a lens arranged in the laser light emitting direction, where the laser can emit laser light, and the lens includes a diffractive optical component (Diffractive Optical Element, DOE for short) or a diffuser (Diffuser), etc.
  • Optical components for astigmatism or uniform light. If the optical components such as diffractive optical components or diffuser in the lens are damaged or fall off, it may cause the laser light emitted by the laser to leak out. The leaked laser light directly hits the human eye and may damage the eyesight of the human eye. Monitor the breakage or shedding of optical components such as light sheets.
  • the invention provides a lens, an active light emitting module and a terminal, which are used to protect the conductive layer on the optical element and reduce the risk of the conductive layer being damaged by static electricity.
  • the present invention adopts the following technical solutions:
  • a first aspect of the present invention provides a lens including a lens barrel and an optical element installed in the lens barrel.
  • the lens barrel has a sky surface, and a conductive layer is provided on the surface of the optical element facing the sky surface.
  • the lens also includes an anti-static structure disposed on the sky surface, and an electrostatic sparse wire disposed inside or inside or outside the barrel wall of the lens barrel. One end of the electrostatic sparse wire is electrically connected to the anti-static structure and the other end Ground.
  • the anti-static structure can pass the static electricity passing through itself to the ground terminal through the electrostatic loosening wire, and the anti-static structure can also attract static electricity near itself, and then guide the attracted static electricity to the ground terminal through the electrostatic loosening wire, thereby preventing static electricity
  • the structure disperses at least a part of the electrostatic layer close to the conductive layer to the ground terminal, reduces the amount of static electricity entering the conductive layer, and effectively reduces the risk of the conductive layer being damaged by static electricity.
  • the antistatic structure includes a frame-shaped conductive film, the orthographic projection of the frame-shaped conductive film on the plane defined by the optical element surrounds the conductive layer, and the frame-shaped conductive film Electrically connect with static electricity sparse wires.
  • the anti-static structure completely surrounds the conductive layer within the area framed by itself, so that the static electricity from various areas around the conductive layer can be evacuated to the ground terminal, which greatly improves the anti-static structure of the anti-static structure to the conductive layer effect.
  • the anti-static structure includes an anti-static electrode, and the anti-static electrode is electrically connected to the electrostatic sparse wire.
  • the anti-static structure includes a plurality of anti-static electrodes and at least one first electrode connection line, the plurality of anti-static electrodes are electrically connected to each other through at least one first electrode connection line, and one of the plurality of anti-static electrodes and the static electricity The loose wires are electrically connected. In this way, the static electricity passing through the anti-static electrode and the static electricity around the anti-static electrode are drained to the grounding terminal through the anti-static electrode to reduce the amount of static electricity entering the conductive layer.
  • the conductive layer includes a detection line.
  • the lens also includes two wires.
  • the two wires are arranged on the inner or inner surface or the outer surface of the barrel wall of the lens barrel.
  • the two ends of the detection wire are connected to the positive and negative terminals of the outside through two wires, and the negative terminal is grounded.
  • the electrostatic sparse wire and the wire connected to the negative terminal are configured as the same conductive line to simplify the structure and manufacturing process of the lens.
  • the lens further includes a second electrode connection wire, one end of the second electrode connection wire is electrically connected to the anti-static structure, and the other end is electrically connected to a lead wire connected to the negative electrode end.
  • the anti-static structure is electrically connected to the lead wire connected to the negative terminal and the ground through the second electrode connection wire, so that the anti-static structure is grounded.
  • the second electrode connection wire and the lead wire connected to the negative terminal are both provided inside the barrel wall of the lens barrel, or both are provided on the outer surface of the lens barrel, or both are provided on the inner surface of the lens barrel.
  • the second electrode connecting line and the lead connecting the negative terminal can be formed in the same step, which is beneficial to simplify the manufacturing process of the lens.
  • the portion of the anti-static structure connected to the second electrode connection line is located between the two ends of the connection detection line of the two wires. In this way, the distance between the portion of the anti-static structure connected to the second electrode connection line and the end of the connection detection line of the lead connected to the negative terminal is shorter, which is beneficial to shorten the length of the second electrode connection line.
  • the material of the lens barrel is a metal direct forming plastic
  • the antistatic structure is a conductive structure made by a metal direct forming process
  • the antistatic structure is a conductive coating made by an electroplating process .
  • the method of manufacturing the antistatic structure by the direct metal forming process is simple, and there is no need to additionally prepare conductive materials for forming the antistatic structure.
  • the resistivity of the antistatic structure is less than the resistivity of the conductive layer, so as to effectively attract and channel static electricity that is about to enter the conductive layer.
  • the material of the antistatic structure is metal.
  • the low resistivity of the metal can quickly attract and conduct static electricity, which is helpful to improve the anti-static ability of the anti-static structure.
  • At least a part of the antistatic structure is close to the edge of the optical element in an orthographic projection on the plane defined by the optical element, and in the sky surface covered by the portion of the antistatic structure
  • the edges close to the optical element coincide to minimize the distance between the orthographic projection of the antistatic structure on the plane defined by the optical element and the optical element, and to improve the electrostatic protection of the antistatic electrode on the conductive layer attached to the optical element ability.
  • the lens further includes a protective layer covering the anti-static structure to prevent the anti-static structure from being corroded and protected by moisture, oxygen and other factors in the external environment. Anti-static structure.
  • a second aspect of the present invention provides an active light emitting module.
  • the active light emitting module includes a bottom substrate and a lens mounted on the bottom substrate.
  • the lens is the lens as described in any one of the above.
  • the bottom substrate is provided with a ground terminal, and the electrostatic sparse wire of the lens is electrically connected to the ground terminal.
  • the anti-static structure of the lens can guide at least a part of the static electricity that will enter the conductive layer attached to the optical element of the lens to the grounding terminal through the electrostatic sparse wire, reducing the risk of the conductive layer being damaged by static electricity, which is beneficial to prolong the active light emitting mode The life of the group.
  • the bottom substrate is provided with a positive terminal and a negative terminal, the negative terminal is electrically connected to the ground terminal, or the negative terminal and the ground terminal are configured as the same terminal.
  • the conductive layer of the optical element of the lens includes a detection line. The two ends of the detection line are electrically connected to the positive terminal and the negative terminal through two wires respectively. In this way, the structure and manufacturing process of the lens are simplified.
  • the lens barrel of the lens and the bottom substrate form an accommodating cavity, and both the positive and negative terminals are located inside or outside the accommodating cavity.
  • a third aspect of the present invention provides a terminal including the active light emitting module as described in any one of the above. Since the risk of the conductive layer in the active light emitting module being damaged by static electricity is low and the service life is long, the reliability of the terminal including the active light emitting module is high.
  • FIG. 1 is a schematic structural diagram of a terminal provided by an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of an application scenario of an active light emitting module provided by an embodiment of the present invention
  • Figure 3 is a partial enlarged view of Figure 2;
  • 4a is a schematic diagram of a typical structure of an active light emitting module
  • 4b is a top view of the lens barrel in the active light emitting module
  • 5a is a schematic diagram 1 of an application scenario of a lens provided by an embodiment of the present invention.
  • 5b is a second schematic diagram of an application scenario of a lens provided by an embodiment of the present invention.
  • FIG. 5c is a cross-sectional view of FIG. 5b along the dotted line CC ';
  • FIG. 6a is a perspective view of a first active light-emitting module provided by an embodiment of the present invention.
  • FIG. 6b is a cross-sectional view of FIG. 6a along the dotted line DD ';
  • FIG. 6c is a cross-sectional view of FIG. 6a along the dotted line EE ';
  • 6d is a top view of a first active light-emitting module provided by an embodiment of the present invention.
  • FIG. 7a is a top view of a second active light-emitting module provided by an embodiment of the present invention.
  • FIG. 7b is a top view of a third active light-emitting module provided by an embodiment of the present invention.
  • FIG. 7c is a top view of a fourth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 8a is a perspective view of a fifth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 8b is a cross-sectional view of FIG. 8a along the dotted line DD ';
  • FIG. 8c is a cross-sectional view of FIG. 8a along the dotted line EE ';
  • FIG. 8d is a top view of a fifth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 8e is a top view of a sixth active light-emitting module provided by an embodiment of the present invention.
  • 9a is a cross-sectional view of a seventh active light-emitting module provided by an embodiment of the present invention.
  • 9b is a cross-sectional view of an eighth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 10a is a perspective view of a ninth active light emitting module provided by an embodiment of the present invention.
  • FIG. 10b is a cross-sectional view of FIG. 10a along the dotted line EE ';
  • 10c is a top view of a ninth active light-emitting module provided by an embodiment of the present invention.
  • 11a is a perspective view of a tenth active light emitting module provided by an embodiment of the present invention.
  • FIG. 11b is a cross-sectional view of FIG. 11a along the dotted line EE ';
  • 11c is a top view of a tenth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 12a is a perspective view of an eleventh active light-emitting module provided by an embodiment of the present invention.
  • FIG. 12b is a cross-sectional view of FIG. 12a along the dotted line EE ';
  • 12c is a top view of an eleventh active light-emitting module provided by an embodiment of the present invention.
  • FIG. 13a is a perspective view of a twelfth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 13b is a cross-sectional view of FIG. 13a along the dotted line EE ';
  • 13c is a top view of a twelfth active light-emitting module provided by an embodiment of the present invention.
  • 14a is a perspective view of a thirteenth active light-emitting module provided by an embodiment of the present invention.
  • FIG. 14b is a cross-sectional view of FIG. 14a along the dotted line CC ';
  • Fig. 14c is a cross-sectional view of Fig. 14a along the dotted line EE '.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more.
  • Embodiments of the present invention provide a lens and an active light-emitting module.
  • the lens and active light-emitting module can be applied to mobile phones, wearable devices, AR (augmented reality) ⁇ VR (virtual reality) devices, tablet computers, notebook computers, UMPCs (Super mobile personal computer), netbook, PDA (personal digital assistant) and other arbitrary terminals, the embodiments of the present invention do not make any limitation on this.
  • the terminal in the embodiment of the present invention may be a mobile phone 100.
  • the following uses the mobile phone 100 as an example to specifically describe the embodiment.
  • the mobile phone 100 may specifically include: a processor 101, a radio frequency (RF) circuit 102, a memory 103, a touch screen 104, a Bluetooth device 105, one or more sensors 106, a Wi-Fi device 107, a positioning device 108,
  • the audio circuit 109, the peripheral interface 110, and the power supply device 111 are components. These components can communicate through one or more communication buses or signal lines (not shown in FIG. 2).
  • RF radio frequency
  • the hardware structure shown in FIG. 2 does not constitute a limitation on the mobile phone, and the mobile phone 100 may include more or less components than those illustrated, or combine certain components, or have different component arrangements.
  • the processor 101 is the control center of the mobile phone 100, and uses various interfaces and lines to connect various parts of the mobile phone 100, by running or executing an application program (App for short) stored in the memory 103, and calling data stored in the memory 103, Perform various functions of the mobile phone 100 and process data.
  • the processor 101 may include one or more processing units.
  • the processor 101 may be a Kirin 960 chip manufactured by Huawei Technologies Co., Ltd.
  • the radio frequency circuit 102 can be used for receiving and sending wireless signals during the process of receiving and sending information or talking.
  • the radio frequency circuit 102 may receive the downlink data of the base station and process it to the processor 101.
  • uplink data is sent to the base station.
  • the radio frequency circuit includes but is not limited to an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like.
  • the radio frequency circuit 102 can also communicate with other devices through wireless communication.
  • the wireless communication may use any communication standard or protocol, including but not limited to global mobile communication system, general packet radio service, code division multiple access, broadband code division multiple access, long-term evolution, e-mail, and short message service.
  • the memory 103 is used to store application programs and data, and the processor 101 executes various functions and data processing of the mobile phone 100 by running the application programs and data stored in the memory 103.
  • the memory 103 mainly includes a storage program area and a storage data area, where the storage program area may store an operating system and application programs required by at least one function (such as a sound playback function, an image playback function, etc.).
  • the storage data area may store data created according to the use of the mobile phone 100 (such as audio data, phone book, etc.).
  • the memory 103 may include a high-speed random access memory, and may also include a non-volatile memory, such as a magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices.
  • the memory 103 may store various operating systems, such as the iOS operating system developed by Apple Inc. and the Android operating system developed by Google Inc., etc.
  • the touch screen 104 may include a touch panel 104-1 and a display screen 104-2.
  • the touchpad 104-1 can collect touch events on or near the user of the mobile phone 100 (for example, the user uses any suitable object such as a finger, a stylus, etc. on the touchpad 104-1 or on the touchpad 104 -1 near operation), and send the collected touch information to other devices such as the processor 101.
  • the user's touch event in the vicinity of the touchpad 104-1 can be called floating touch.
  • Floating touch can mean that the user does not need to directly touch the touchpad to select, move, or drag an object (such as an icon, etc.), but only needs the user to be near the terminal to perform the desired function.
  • the terms "touch”, “contact”, etc. do not imply direct contact with the touch screen, but near or close contact.
  • two capacitive sensors may be provided in the touch panel 104-1, namely, a mutual capacitance sensor and a self-capacitance sensor.
  • the two capacitive sensors may be alternately arranged in an array on the touch panel 104-1.
  • the mutual capacitance sensor is used to realize the normal traditional multi-touch, that is, detect the gesture of the user when touching the touch panel 104-1.
  • the self-capacitance sensor can generate a stronger signal than the mutual capacitance, thereby detecting the finger induction farther from the touchpad 104-1.
  • the signal generated by the self-capacitance sensor is larger than the signal generated by the mutual capacitance sensor, so that the mobile phone 100 can detect that it is above the screen, for example, above the touchpad 104-1
  • the user's gesture at 20mm the signal generated by the self-capacitance sensor is larger than the signal generated by the mutual capacitance sensor, so that the mobile phone 100 can detect that it is above the screen, for example, above the touchpad 104-1.
  • the touch panel 104-1 capable of floating touch can be implemented by capacitive, infrared light sensing, ultrasonic waves, and the like.
  • the touch panel 104-1 may be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves.
  • the display screen 104-2 may be used to display information input by the user or provided to the user and various menus of the mobile phone 100.
  • the display screen 104-2 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like.
  • the touchpad 104-1 can be overlaid on the display screen 104-2. When the touchpad 104-1 detects a touch event on or near it, it is transmitted to the processor 101 to determine the type of touch event, and then processed The device 101 may provide corresponding visual output on the display screen 104-2 according to the type of touch event.
  • the touchpad 104-1 and the display screen 104-2 are used as two independent components to realize the input and output functions of the mobile phone 100, in some embodiments, the touchpad 104- 1 Integrated with the display screen 104-2 to realize the input and output functions of the mobile phone 100.
  • the touch screen 104 is formed by stacking multiple layers of materials. Only the touch panel (layer) and the display screen (layer) are shown in the embodiment of the present invention, and other layers are not described in the embodiment of the present invention. .
  • the touchpad 104-1 may cover the display screen 104-2, and the size of the touchpad 104-1 is larger than the size of the display screen 104-2, so that the display screen 104 -2 is completely covered under the touchpad 104-1, or the above-mentioned touchpad 104-1 can be configured on the front of the mobile phone 100 in the form of a full board, that is, the user's touch on the front of the mobile phone 100 can be perceived by the mobile phone, In this way, you can achieve a full touch experience on the front of the phone.
  • the touchpad 104-1 is arranged on the front of the mobile phone 100 in the form of a full board
  • the display screen 104-2 may also be arranged on the front of the mobile phone 100 in the form of a full board, so that the front of the phone It can realize the structure without border.
  • the mobile phone 100 may also have a fingerprint recognition function.
  • the fingerprint reader 112 may be disposed on the back of the mobile phone 100 (for example, below the rear camera), or on the front of the mobile phone 100 (for example, below the touch screen 104).
  • the fingerprint collection device 112 may be configured in the touch screen 104 to implement the fingerprint recognition function, that is, the fingerprint collection device 112 may be integrated with the touch screen 104 to implement the fingerprint recognition function of the mobile phone 100.
  • the fingerprint collecting device 112 is configured in the touch screen 104, and may be a part of the touch screen 104, or may be configured in the touch screen 104 in other ways.
  • the fingerprint collection device 112 can also be implemented as a full-board fingerprint collection device. Therefore, the touch screen 104 can be regarded as a panel that can perform fingerprint recognition at any position.
  • the fingerprint collecting device 112 may send the collected fingerprint to the processor 101, so that the processor 101 processes the fingerprint (eg, fingerprint verification, etc.).
  • the main component of the fingerprint collecting device 112 in the embodiment of the present invention is a fingerprint sensor, which may use any type of sensing technology, including but not limited to optical, capacitive, piezoelectric, or ultrasonic sensing technology.
  • the mobile phone 100 may also include a Bluetooth device 105 for implementing data exchange between the mobile phone 100 and other short-range terminals (such as mobile phones, smart watches, etc.).
  • the Bluetooth device 105 in the embodiment of the present invention may be an integrated circuit or a Bluetooth chip.
  • the mobile phone 100 may also include at least one sensor 106, such as a light sensor, a motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display screen of the touch screen 104 according to the brightness of the ambient light, and the proximity sensor may close the display screen when the mobile phone 100 moves to the ear Power supply.
  • the accelerometer sensor can detect the magnitude of acceleration in various directions (generally three axes), and can detect the magnitude and direction of gravity when at rest, and can be used to identify mobile phone gesture applications (such as horizontal and vertical screen switching, related Games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tap), etc.
  • the gyro, barometer, hygrometer, thermometer, infrared sensor and other sensors that can be configured on the mobile phone 100, they will not be repeated here.
  • the Wi-Fi device 107 is used to provide the mobile phone 100 with network access following Wi-Fi related standard protocols.
  • the mobile phone 100 can be connected to the Wi-Fi access point through the Wi-Fi device 107, thereby helping the user to send and receive emails, Browsing web pages and accessing streaming media, etc., it provides users with wireless broadband Internet access.
  • the Wi-Fi device 107 may also serve as a Wi-Fi wireless access point, and may provide Wi-Fi network access for other terminals.
  • the positioning device 108 is used to provide a geographic location for the mobile phone 100. It can be understood that the positioning device 108 may specifically be a receiver of a positioning system such as a global positioning system (GPS) or a Beidou satellite navigation system, a Russian GLONASS, or the like. After receiving the geographic location sent by the positioning system, the positioning device 108 sends the information to the processor 101 for processing, or to the memory 103 for storage. In some other embodiments, the positioning device 108 may also be a receiver of an assisted global satellite positioning system (AGPS). The AGPS system assists the positioning device 108 to complete ranging and positioning services by serving as an auxiliary server.
  • AGPS assisted global satellite positioning system
  • the auxiliary positioning server communicates with a positioning device 108 (ie, GPS receiver) of the terminal, such as the mobile phone 100, through a wireless communication network to provide positioning assistance.
  • the positioning device 108 may also be a positioning technology based on Wi-Fi access points. Since each Wi-Fi access point has a globally unique MAC address, the terminal can scan and collect broadcast signals from surrounding Wi-Fi access points when Wi-Fi is turned on, so Wi-Fi access points can be obtained The MAC address broadcast by the Fi access point.
  • the terminal sends the data (such as MAC address) that can mark the Wi-Fi access point to the location server through the wireless communication network, and the location server retrieves the geographic location of each Wi-Fi access point, and combines with the Wi-Fi broadcast The strength of the signal is calculated, and the geographic location of the terminal is calculated and sent to the positioning device 108 of the terminal.
  • data such as MAC address
  • the location server retrieves the geographic location of each Wi-Fi access point, and combines with the Wi-Fi broadcast
  • the strength of the signal is calculated, and the geographic location of the terminal is calculated and sent to the positioning device 108 of the terminal.
  • the audio circuit 109, the speaker 113, and the microphone 114 may provide an audio interface between the user and the mobile phone 100.
  • the audio circuit 109 may transmit the converted electrical signal of the received audio data to the speaker 113, where the speaker 113 converts it into a sound signal and outputs it.
  • the microphone 114 converts the collected sound signal into an electrical signal, which is received by the audio circuit 109 and then converted into audio data, and then outputs the audio data to the RF circuit 102 to be sent to, for example, another mobile phone, or outputs the audio data to Memory 103 for further processing.
  • the peripheral interface 110 is used to provide various interfaces for external input / output devices (such as a keyboard, a mouse, an external display, an external memory, a user identification module card, etc.). For example, it is connected to a mouse through a universal serial bus (USB) interface, and is connected to a user identification module card (SIM) card provided by a telecom operator through metal contacts on the card slot of the user identification module.
  • the peripheral interface 110 may be used to couple the above-mentioned external input / output peripheral devices to the processor 101 and the memory 103.
  • the mobile phone 100 may further include a power supply device 111 (such as a battery and a power management chip) that supplies power to various components.
  • a power supply device 111 such as a battery and a power management chip
  • the battery may be logically connected to the processor 101 through the power management chip, so that the power supply device 111 can manage charging, discharging, and power consumption management. And other functions.
  • the mobile phone 100 may further include a camera (front camera and / or rear camera), a flash, a micro-projection device, a near field communication (NFC) device, etc., which will not be repeated here.
  • a camera front camera and / or rear camera
  • a flash a flash
  • a micro-projection device a micro-projection device
  • NFC near field communication
  • a 3D sensing module may be integrated therein to enable the terminal to realize a 3D sensing function.
  • Ordinary digital cameras can only obtain flat color images without the depth information of the images. This means that when we see a photo, we only know how wide and high this person's face is, but we don't know the three-dimensional structure of his face, for example: the height of the nose bridge relative to the cheek, the depth of the eye socket relative to the cheek, etc.
  • the technologies to realize 3D sensing mainly include the following two types:
  • TOF Time of Flight
  • high-power lasers such as VCSEL (Vertical-Cavity, Surface-Emitting Laser, single-point vertical cavity surface emitting laser)
  • VCSEL Vertical-Cavity, Surface-Emitting Laser, single-point vertical cavity surface emitting laser
  • the infrared light image sensor can be used to measure the time of the reflected laser light at different depths on the surface of the object to calculate the object The distance (depth) of different positions on the surface.
  • Structured light technology using laser to produce different light patterns (lights with certain structural characteristics, called structured light), after the light pattern is projected on the surface of the object, it is reflected and reflected by the position of the object surface at different depths After the light pattern will appear distorted.
  • the laser struck a straight stripe of light onto the finger. Because the surface of the finger is a three-dimensional circular arc, the stripe reflected by the straight stripe after the curved finger surface becomes a circular arc stripe. After the arc-shaped stripes are captured by the infrared light image sensor, the terminal can reverse the three-dimensional structure of the finger according to the reflected arc-shaped stripes.
  • a TOF or structured light 3D sensing module may be provided on the top of the mobile phone 100, such as the “bangs” position of the mobile phone 100 (that is, the area AA shown in FIG. 2).
  • the structured light 3D sensing module 115 is arranged in the mobile phone 100 as follows: the structured light 3D sensing module 115 includes an infrared light camera 115 -1, floodlight illuminator 115-2, proximity sensor 115-3, infrared image sensor 115-4, dot matrix projector 115-5 and other modules.
  • the flood illuminator 115-2 is provided with a low-power laser (such as VCSEL) and a lens including components such as a uniform light plate.
  • the dot matrix projector 115-5 is provided with a high-power laser (such as VCSEL) and a lens including components such as diffractive optical components.
  • the face recognition process of the structured light 3D sensing module 115 described above is as follows:
  • the proximity sensor 115-3 senses that an object approaches the mobile phone 100, thereby
  • the processor 101 of 100 sends out a signal that an object is approaching.
  • the processor 101 receives the signal that an object is approaching, and controls the flood illuminator 115-2 to start.
  • the low-power laser in the flood illuminator 115-2 projects infrared laser light onto the surface of the object.
  • the surface of the object reflects the infrared laser light projected by the floodlight 115-2.
  • the infrared camera 115-1 captures the infrared laser light reflected by the surface of the object, thereby acquiring image information on the surface of the object, and then capturing the obtained image
  • the information is uploaded to the processor 101.
  • the processor 101 determines whether the object close to the mobile phone 100 is a human face according to the uploaded image information.
  • the dot matrix projector 115-5 is controlled to start.
  • the high-power laser in the dot matrix projector 115-5 emits infrared laser light.
  • These infrared lasers form many (such as about 30,000) structures through the action of components such as diffractive optical components in the dot matrix projector 115-5.
  • the spot of light is projected onto the surface of the human face.
  • the array formed by these structured light spots is reflected at different positions on the face surface, and the infrared light camera 115-1 captures the structured light spots reflected by the face surface, thereby obtaining depth information at different positions on the face surface, Then, the acquired depth information is uploaded to the processor 101.
  • the processor 101 compares and calculates the uploaded depth information with the user's facial feature data pre-stored in the mobile phone 100 to identify whether the face close to the mobile phone 100 is the user's face of the mobile phone 100, and if so, then The mobile phone 100 is controlled to be unlocked; if not, the mobile phone 100 is controlled to remain locked.
  • TOF or structured light 3D sensing modules include modules capable of emitting laser light, for example: TOF 3D sensing module includes a high-power laser module, structured light 3D sensing module 115 dot matrix projector 115-5 and floodlight illuminator 115-2, hereinafter referred to as such modules as active light-emitting modules.
  • the active light-emitting module 1 mainly includes: a lens 11, a bottom substrate 17, a laser 18, and a microprocessor (MCU, Microcontroller Unit) 19, in which
  • the lens 11 includes a lens barrel 12, a lens assembly 13, and an optical element 14.
  • the lens barrel 12 is mounted on one side of the base substrate 17 and forms a receiving cavity BB with the base substrate 17.
  • the end of the lens barrel 12 away from the base substrate 17 is provided with a supporting structure 15.
  • the supporting structure 15 is a ring-shaped structure and is ring-shaped on the inner surface of the lens barrel 12 to form a clear aperture GG.
  • the laser 18, the microprocessor 19, the lens assembly 13 and the optical element 14 are all installed in the receiving cavity BB. Among them, the laser 18 and the microprocessor 19 are mounted on the bottom substrate 17.
  • the lens assembly 13 is installed between the supporting structure 15 and the base substrate 17.
  • the edge of the optical element 14 is fixed on the surface of the supporting structure 15 facing away from the laser 18 by viscose 16.
  • a surface of the optical element 14 facing the laser 18 is provided with a microstructure layer 14-1.
  • the microstructure layer 14-1 includes a microstructure such as a diffraction grating or a dot, so that the optical element 14 has a specific function.
  • the type of the laser 18 may specifically be VCSEL, DFB (Distributed Feedback, Laser, distributed feedback laser, edge emitting laser, etc.
  • the lens assembly 13 includes at least one optical lens, when the lens assembly 13 includes multiple optical In the case of a lens, the lens assembly 13 is formed by stacking the foregoing multiple optical lenses.
  • the optical lens may be, for example, a convex lens.
  • the lens assembly 13 is used to collimate and converge the laser light emitted by the laser 18.
  • the type of the optical element 14 is specific It can be a uniform light sheet, a diffractive optical component, a Fresnel lens, etc.
  • the optical element 14 may be a uniform light sheet, and the microstructure layer 14-1 of the optical element 14 includes a uniform light microstructure such as a dot. If the active light emitting module 1 is a structured light 3D sensing module In the dot matrix projector, the optical element 14 may specifically be a diffractive optical component (DOE), and the microstructure layer 14-1 of the optical element 14 includes a diffraction grating microstructure.
  • DOE diffractive optical component
  • the active light-emitting module 1 can be installed in a terminal such as a mobile phone 100.
  • the laser 18 side ie, the light-emitting side
  • the optical element 14 side ie, the light-emitting side
  • the microprocessor 19 is connected to the processor integrated on the motherboard of the terminal.
  • the processor 19 is connected to the processor 101 of the mobile phone 100.
  • the microprocessor 19 is connected to the laser 18, and controls the laser 18 to emit laser light.
  • the laser light passes through the lens assembly 13, passes through the clear aperture GG, and then exits the outside of the active light emitting module 1 through the optical element 14.
  • the active light-emitting module 1 in the terminal ages and the reliability is reduced.
  • the occurrence of such conditions as water ingress and corrosion may cause the active light-emitting module 1 to
  • the optical element 14 is damaged or falls off, the laser light emitted by the laser 18 in the active light-emitting module 1 leaks out, and the leaked laser light directly hits the human eye, which may cause damage to the eyesight of the human eye. If the laser 18 in the active light-emitting module 1 emits high-power laser light, the damage to human eyes will be more serious.
  • the conductive element 14 is provided on the surface of the optical element 14 to monitor the damage or fall-off of the optical element 14. Specifically, please refer to FIGS. 5 a to 5 c.
  • a conductive layer 20 is provided on the surface of the optical element 14 facing away from the laser 18.
  • the conductive layer 20 includes a detection line 20-1.
  • the material of the detection line 20-1 is ITO (indium tin Oxide), IZO (indium zinc oxide), IGZO (indium gallium zinc oxide) or ITZO (indium tin zinc oxide) and other transparent conductive materials. Both ends of the detection line 20-1 are connected to the microprocessor 19 through the wire 21, so that the detection line 20-1, the wire 21, and the microprocessor 19 form a loop, which is hereinafter referred to as a monitoring circuit.
  • the conductive layer 20 further includes conductive pads 20-2 respectively disposed at both ends of the detection line 20-1.
  • the conductive pad 20-2 and the lead 21 are connected to the detection line 20-1.
  • a conductive electrode 22 is provided above the end, so that the detection line 20-1 is electrically connected to the lead 21 through the conductive pad 20-2 and the conductive electrode 22.
  • the microprocessor 19 supplies a voltage to the entire monitoring circuit to monitor the resistance value of the detection line 20-1 or the voltage value across the detection line 20-1 in real time.
  • the resistance value of the detection line 20-1 or the voltage value across the detection line 20-1 changes abnormally, for example, the resistance value of the detection line 20-1 exceeds the set resistance threshold range, or the voltage value across the detection line 20-1 Exceeding the set voltage threshold range indicates that the monitoring circuit has an open circuit, which may be that the detection line 20-1 is broken, or that the connection between the detection line 20-1 and the wire 21 is open.
  • the cause of the breakage of the detection line 20-1 may be that the optical element 14 attached to the detection line 20-1 is damaged, and the cause of an open circuit at the connection between the detection line 20-1 and the wire 21 may be the detection line 20-1.
  • the attached optical element 14 comes off. Therefore, when the microprocessor 19 detects that the resistance value of the detection line 20-1 exceeds the set resistance threshold range, or the voltage value across the detection line 20-1 exceeds the set voltage threshold range, it can be determined that the optical element 14 is broken or detached .
  • the microprocessor 19 controls the power supply 2 to stop supplying power to the laser 18, and the laser 18 is turned off, thereby effectively preventing the laser light emitted by the laser 18 from leaking directly into the human eye and causing damage to the human eye.
  • the detection line 20-1 itself may be broken, or the connection between the detection line 20-1 and the lead 21 is disconnected, so the microprocessor 19 monitors The resistance value of the detection line 20-1 will become extremely large, even to infinity ( ⁇ ), or the voltage value across the detection line 20-1 is close to or equal to the voltage value provided by the microprocessor 19 to the entire monitoring circuit.
  • set resistance threshold range can be set as a range of values that fluctuate up and down around the resistance value R of the detection line 20-1 when it is not broken, for example, “set resistance threshold range” can be set as Greater than or equal to 80% R, less than or equal to 120% R. Exemplarily, if the resistance value R of the detection line 20-1 when not broken is 10K ⁇ , the “set resistance threshold range” may be set to be greater than or equal to 8K ⁇ and less than or equal to 12K ⁇ .
  • the “set voltage threshold range” mentioned above can be set to a value range that fluctuates up and down around the voltage value U shared by the entire monitoring circuit when the detection line 20-1 is not broken, for example, “set voltage The "threshold range” can be set to be greater than or equal to 80% U and less than or equal to 120% U. Exemplarily, if the voltage value U shared by the entire monitoring circuit when the detection line 20-1 is not broken is 0.8V, the "set voltage threshold range” may be set to be greater than or equal to 0.64V and less than or equal to 0.96V.
  • a conductive layer 20 needs to be provided on the surface of the optical element 14 facing away from the laser 18, that is, the conductive layer 20 is provided on the surface of the optical element 14 On the external surface of the module.
  • the assembly of the active light emitting module 1, and the use of the terminal static electricity is generated, and the conductive layer 20 is provided on the surface of the optical element 14 facing the outside of the module, so the static electricity It is very easy to enter the conductive layer 20.
  • the voltage of static electricity is extremely high, which will damage the conductive layer 20, causing the detection line 20-1 in the conductive layer 20 to break, thereby causing the detection line 20-1 to break or fall off the optical element 14.
  • the monitoring function fails.
  • static electricity entering the conductive layer 20 may be conducted into the microprocessor 19 along the wire 21 connected to the conductive layer 20, damaging the microprocessor 19.
  • the embodiments of the present invention provide a lens, as shown in FIGS. 6a to 6d and 8a to 8d.
  • the lens 11 is applied to the active light emitting module 1.
  • the lens 11 includes a lens barrel 12 and optical Element 14.
  • the lens barrel 12 has a sky surface 12a and a bottom surface (not shown) opposite to the sky surface 12a.
  • the bottom surface is connected to the bottom substrate 17 of the active light-emitting module 1.
  • the sky surface 12a is located away from the bottom substrate of the lens barrel 12 On the side of 1, the sky surface 12a is a frame-shaped surface.
  • a support structure 15 is provided on the side where the inner surface 12a of the lens barrel 12 is located. Please refer to FIG. 4b.
  • the support structure 15 is a ring structure, which is formed on the inner surface of the lens barrel 12 to form Clear aperture GG.
  • the optical element 14 is installed inside the lens barrel 12 and is located on the side where the sky surface 12a of the lens barrel 12 is located.
  • the edge of the optical element 14 is fixed to the surface of the supporting structure 15 on the side facing the sky surface 12 a of the lens barrel 12 by viscose 16.
  • the surface of the optical element 14 on the side facing the sky surface 12 a of the lens barrel 12 is provided with a conductive layer 20 for monitoring the damage or fall-off of the optical element 14.
  • the lens 11 further includes an anti-static structure 23 disposed on the sky surface 12 a of the lens barrel 12, and an electrostatic sparse wire 24 disposed on the inside or inner surface or outer surface of the barrel wall of the lens barrel 12.
  • Both the anti-static structure 23 and the electrostatic sparse wire 24 are conductive, and the two are electrically connected.
  • the end of the electrostatic sparse wire 24 away from the anti-static structure 23 is grounded, for example, as shown in FIG.
  • the anti-static structure 23 can conduct static electricity passing through itself to the grounding terminal through the electrostatic sparse wire 24, and the anti-static structure 23 can also attract static electricity near itself, and then evacuate the attracted static electricity to the grounding terminal through the electrostatic sparse wire 24.
  • the anti-static structure 23 is located in at least a part of the area around the conductive layer 20, so that the anti-static structure 23 can At least a part of the static electricity close to the conductive layer 20 is drained to the ground terminal 25, which reduces the amount of static electricity entering the conductive layer 20, effectively reduces the risk of the conductive layer 20 being damaged by static electricity, and protects the conductive layer 20. Further, since the anti-static structure 23 reduces the amount of static electricity entering the conductive layer 20, the risk of static electricity entering the microprocessor 19 along the wire 21 connected to the conductive layer 20 and damaging the microprocessor 19 is also reduced.
  • the antistatic structure 23 includes at least one antistatic electrode 23-1.
  • the anti-static structure 23 includes an anti-static electrode 23-1, the orthographic projection of the anti-static electrode 23-1 on the plane defined by the optical element 14 is located at the position where the conductive layer 20 is located In the surrounding area of the optical element 14, static electricity passing through itself and its surroundings can be conducted to the ground terminal 25.
  • the anti-static structure 23 includes a plurality of anti-static electrodes 23-1, and the plurality of anti-static electrodes 23-1 are electrically connected to each other through a first electrode connection line 23-2, so as to The plurality of anti-static electrodes 23-1 can be grounded through a single electrostatic sparse wire 24 uniformly.
  • a plurality of anti-static electrodes 23-1 are arranged at intervals on the sky surface 12a of the lens barrel 12, and further, a plurality of anti-static electrodes 23-1 are arranged at equal intervals around the optical element 14 where the conductive layer 20 is located, thereby
  • the antistatic structure 23 can improve the static electricity dispersing ability of the areas around the conductive layer 20.
  • each anti-static electrode 23-1 is independently grounded through an electrostatic sparse wire 24.
  • an anti-static electrode 23-1 may be provided on one side of each side of the optical element 14, and the shape of the anti-static electrode 23-1 may be a square Shape, for example, rectangular.
  • two anti-static electrodes 23-1 may be provided on each side of the long side of the optical element 14, and one anti-static electrode 23-1 may be provided on each side of the short side of the optical element 14.
  • the shape of the electrode 23-1 may be a square shape, for example, a rectangular shape.
  • one antistatic electrode 23-1 may be provided in each of the four corner regions of the optical element 14, and the shape of the antistatic electrode 23-1 may be L-shaped. It is conceivable that there may be other ways to arrange the plurality of anti-static electrodes 23-1, which are not listed here one by one.
  • the distance d between the orthographic projection of the antistatic electrode 23-1 on the plane defined by the optical element 14 and the optical element 14 is as small as possible, which can improve the antistatic as much as possible
  • the electrode 23-1 has an electrostatic protection capability against the conductive layer 20 attached to the optical element 14.
  • the orthographic projection of the anti-static electrode 23-1 on the plane defined by the optical element 14 is close to the edge of the optical element 14 and coincides with the corresponding inner side of the sky surface 12a to minimize the anti-static electrode 23-1 The distance d between the orthographic projection on the plane defined by the optical element 14 and the optical element 14.
  • the length L of the anti-static electrode 23-1 can be arbitrarily set, the embodiment of the present invention does not set a limit to this, for example, the length L of the anti-static electrode 23-1 is less than Or equal to the length of the side of the corresponding optical element 14.
  • the shape of the antistatic electrode 23-1 can be arbitrarily set, and the embodiment of the present invention does not set a limit to this.
  • the shape of the antistatic electrode 23-1 is rectangular (as shown in FIGS. 6d, 7a, and 7b) ), Or the shape of the antistatic electrode 23-1 is L-shaped (as shown in FIG. 7c), and so on.
  • the shapes and sizes of the plurality of anti-static electrodes 23-1 may be the same to simplify the production of a plurality of anti-static electrodes 23- 1 process steps.
  • the anti-static structure 23 is a frame-shaped conductive film, which extends along the frame-shaped sky surface 12 a of the lens barrel 12, so that the anti-static structure 23 fully covers the conductive layer 20 surrounds the area framed by itself, can dissipate static electricity from various areas around the conductive layer 20 to the ground terminal 25, and greatly improves the anti-static effect of the anti-static structure 23 on the conductive layer 20.
  • the width of the frame-shaped conductive film as the antistatic structure 23 is equal or unequal.
  • the two ends of the detection line 20-1 of the conductive layer 20 are respectively connected to the two wires 21, and the anti-static structure 23 is at the end of the wire 21 (specific guidance and detection of the wire 21
  • the end where the wire 20-1 is connected hereinafter referred to as the end of the detection wire connection
  • the distance d ′ between the remaining parts and the optical element 14 Equal to each other, the anti-static capabilities of the anti-static structure 23 except for the position where the detection wires of the corresponding wires 21 are connected are uniform. In addition, the smaller the distance d ', the better. This can improve the electrostatic protection capability of the antistatic structure 23 to the conductive layer 20 attached to the optical element 14 as much as possible.
  • the rest are close to the corresponding edges of the optical element 14 and the sky surface 12a.
  • the inside edges coincide to minimize the spacing d '.
  • a break Q may be provided on the frame-shaped conductive film of the anti-static structure 23, and the break Q may be provided at a position where the anti-static structure 23 is electrically connected to the electrostatic sparse wire 24 Any other location. In this way, from the side of the fracture Q to the position of the antistatic structure 23 electrically connected to the electrostatic sparse wire 24, and from the other side of the fracture Q to the position of the antistatic structure 23 electrically connected to the electrostatic sparse wire 24 Between the conductive films, both of the conductive films can be grounded through the electrostatic sparse wire 24.
  • the fracture Q may be provided on one side of any side of the optical element 14, as long as the position of the antistatic structure 23 electrically connected to the electrostatic sparse wire 24 is avoided.
  • the optical element 14 includes opposing first and second sides, the position of the anti-static structure 23 electrically connected to the electrostatic sparse wire 24 is on the side of the first side of the optical element, and the fracture Q is provided on the optical element The side of the second side.
  • the position of the anti-static structure 23 electrically connected to the electrostatic sparse wire 24 is on the side of the midpoint position of the first side of the optical element, and the fracture Q is provided on the side of the midpoint position of the second side of the optical element.
  • the lengths of the two parts of the conductive film are equal or approximately equal, which is beneficial to improve the electrostatic conductivity of the anti-static structure 23.
  • the material of the antistatic structure 23 may use a material with a small resistivity.
  • the material of the antistatic structure 23 may use a material with a resistivity lower than that of the conductive layer 20 to effectively attract and The static electricity that is about to enter the conductive layer 20 is drained.
  • the material of the anti-static structure 23 may be a metal material such as copper (Cu), chromium (Cr), silver (Ag), or the like.
  • the material selection of the anti-static electrode 23-1 can be based on the above principles.
  • the anti-static structure 23 further includes a design of the first electrode connecting line 23-2, and the material of the first electrode connecting line 23-2 may be the same as the material of the anti-static electrode 23-1 The same, so that the anti-static electrode 23-1 and the first electrode connecting line 23-2 can be manufactured in the same step, thereby simplifying the process steps.
  • the lens barrel 12 is made of LDS (Laser Direct Constructing) plastic.
  • LDS plastic is a modified plastic containing organic metal composites. After laser irradiation, the organic metal composites It can release metal particles, making the laser irradiation area conductive.
  • the anti-static structure 23 can be manufactured by using LDS technology. The manufacturing process is roughly as follows: the area where the anti-static structure 23 is to be formed on the sky surface 12a of the lens barrel 12 is irradiated with laser, so that the organic metal composite in the laser-irradiated area releases metal particles As a result, the LDS plastic material in the laser irradiation area is activated and becomes conductive, forming a pattern of the antistatic structure 23.
  • the process of manufacturing the anti-static structure 23 using LDS technology is simple, and there is no need to additionally prepare conductive materials for forming the anti-static structure 23.
  • the anti-static structure 23 may be manufactured by any of electroplating, screen printing, coating, magnetron sputtering, photolithography, etc. The present invention does not set a limit to this.
  • the formed anti-static structure 23 may be directly fixed on the sky surface 12a of the lens barrel 12 by pasting or welding, etc., and welding may be used at the connection between the anti-static structure 23 and the electrostatic sparse wire 24 To ensure the electrical connection between the anti-static structure 23 and the electrostatic sparse wire 24.
  • a protective layer may be covered on the anti-static structure 23 to prevent the anti-static structure 23 from being corroded by moisture, oxygen, and other factors in the external environment, and protect the anti-static structure 23.
  • the material of the protective layer can be an organic or inorganic material with water, oxygen and corrosion resistance.
  • the electrostatic sparse wire 24 extends inside the barrel wall of the lens barrel 12.
  • One end of the electrostatic sparse wire 24 extends to the anti-static structure 23, and the other end extends to the ground terminal 25 of the base substrate 17.
  • an in-mold injection process may be used to integrally form the electrostatic sparse wire 24 and the lens barrel 12.
  • a channel may be formed in the lens barrel 12, and then a solution of the material of the electrostatic sparse wire 24 is poured into the channel to form the electrostatic sparse wire 24.
  • the electrostatic sparse wire 24 extends on the outer surface of the lens barrel 12.
  • the electrostatic sparse wire 24 extends on the inner surface of the lens barrel 12.
  • the electrostatic sparse wire 24 may be formed on the outer surface or the inner surface of the lens barrel 12 by coating, printing, pasting, or the like.
  • a protective layer may be formed on the electrostatic sparse wire 24 to cover the electrostatic sparse wire 24 to prevent the electrostatic sparse wire 24 from being exposed and corroded.
  • the material of the protective layer can be an organic or inorganic material with water, oxygen and corrosion resistance.
  • the material of the electrostatic sparse wire 24 may be a metal conductive material such as silver (Ag), copper (Cu), chromium (Cr), or a semiconductor conductive material, or an oxide conductive material, etc., which have conductive properties. Further, the material of the electrostatic sparse wire 24 can be the same as the anti-static structure 23 to reduce the contact resistance between the electrostatic sparse wire 24 and the anti-static structure 23.
  • the two ends of the detection line 20-1 of the conductive layer 20 are respectively connected to the microprocessor 19 disposed on the bottom substrate 17 of the active light emitting module 1 through two wires 21, the two The wire 21 extends inside or on the inner or outer surface of the lens barrel 12.
  • the two wires 21 are connected to the microprocessor 19 as follows: the bottom substrate 17 of the active light emitting module 1 is provided with a positive terminal e and a negative terminal f, and the two wires 21 are respectively connected to the positive terminal e And the negative terminal f, the positive terminal e and the negative terminal f are respectively connected to two ports of the microprocessor 19.
  • the negative terminal f is connected to the ground terminal 25 provided on the base substrate 17, or the negative terminal and the ground terminal 25 are configured as the same terminal, which is equivalent to the wire 21 connecting the negative terminal f of the two wires 21 is grounded. Since the end of the electrostatic sparse wire 24 connected to the anti-static structure 23 away from the anti-static structure 23 needs to be grounded, and the electrostatic sparse wire 24 extends inside or on the inner or outer surface of the lens barrel 12, therefore, as shown in FIGS. 10a-10c, As shown in FIGS.
  • the electrostatic sparse wire 24 can reuse the wire 21 (hereinafter referred to as this wire) that is connected to the negative terminal f and is grounded among the two wires 21 21 is a negative ground wire), that is, the electrostatic sparse wire 24 and the negative ground wire are configured as the same conductive line, which can simplify the structure and manufacturing process of the lens 11.
  • the electrostatic sparse wire 24 and the negative ground wire are configured as the same conductive line, because the negative ground wire (ie, the electrostatic sparse wire 24) is grounded, it is transmitted to the negative ground wire (ie, the anti-static structure 23)
  • the static electricity of the electrostatic sparse wire 24) will be preferentially transmitted (flowed) to the ground terminal, and will not be transmitted to the conductive layer 20 along the negative ground wire (ie, the electrostatic sparse wire 24), which ensures the anti-static structure 23 to the conductive layer 20
  • the realization of the electrostatic protection effect is possible.
  • the lens 11 further includes a second electrode connecting line 26, which connects the anti-static structure 23 to the negative ground wire. Therefore, the negative ground wire serves as the electrostatic sparse wire 24, and the anti-static structure 23 is grounded through the second electrode connecting wire 26 and the negative ground wire (ie, the electrostatic sparse wire 24).
  • the anti-static electrode 23-1 may be disposed on the two wires 21 and the detection line Between the ends where 20-1 is connected (that is, between the two conductive electrodes 22), so that the distance between the antistatic electrode 23-1 and the negative ground wire is closer, which is helpful to shorten the second electrode connection line 26 length.
  • the anti-static structure 23 includes a plurality of anti-static electrodes 23-1
  • the plurality of anti-static electrodes 23-1 are connected to each other through a first electrode connection line 23-2.
  • the anti-static electrode 23-1 closest to the negative electrode ground wire is connected to the negative electrode ground wire through the second electrode connecting wire 26, which is beneficial to shorten the length of the second electrode connecting wire 26.
  • the anti-static electrode 23-1 closest to the negative ground wire is disposed between the ends of the two wires 21 that are connected to the detection line 20-1 (that is, the two conductive Between electrodes 22), the arrangement of the anti-static electrode 23-1 and the second electrode connecting line 26 connected to it can be seen in FIG. 9b.
  • connection position of the anti-static structure 23 and the second electrode connecting line 26 can be set at two Between the ends of the wire 21 connected to the detection line 20-1 (that is, between the two conductive electrodes 22), such that the connection position between the anti-static structure 23 and the second electrode connection line 26 and the negative ground wire The closer the distance is, the shorter the length of the second electrode connecting line 26 is.
  • the second electrode connecting wire 26 may be disposed on the inner or outer surface or inner surface of the barrel wall of the lens barrel 12, which is not limited in the embodiments of the present invention.
  • the second electrode connecting wire 26 may be arranged in the same manner as the negative ground wire (ie, the electrostatic sparse wire 24), for example, both of them are arranged inside the barrel wall of the lens barrel 12 or both The outer surface or both are provided on the inner surface.
  • FIGS. 10 a to 10 c and FIGS. 12 a to 12 c show examples in which both are provided inside the barrel wall of the lens barrel 12. In this way, the second electrode connecting wire 26 and the negative electrode ground wire (ie, the electrostatic sparse wire 24) can be formed in the same step, which is beneficial to simplify the manufacturing process of the lens 11.
  • the material of the second electrode connecting line 26 may be a metal conductive material such as silver (Ag), copper (Cu), chromium (Cr), or a semiconductor conductive material, or an oxide conductive material, etc., which have conductive properties. Further, the material of the second electrode connecting wire 26 can be selected from the same material as the negative electrode ground wire (ie, the electrostatic sparse wire 24), so that the second electrode connecting wire 26 and the negative electrode ground wire (ie, the electrostatic sparse wire 24) can be formed in Under the same steps.
  • the negative electrode ground wire ie, the electrostatic sparse wire 24
  • the electrostatic sparse wire 24 and the negative ground wire are configured as the same conductive line, for example, as shown in FIGS. 11a to 11c and 13a to 13c, the anti-static structure 23 adjacent to the negative ground wire and the detection line 20-1
  • the part of the connected end extends to the end of the negative ground wire connected to the detection line 20-1 to realize the electrical connection between the anti-static structure 23 and the negative ground wire, so that the negative ground wire acts as an electrostatic sparse wire 24, and the anti-static structure 23
  • the grounding is achieved through the negative ground wire (ie, the electrostatic sparse wire 24).
  • the anti-static electrode 23-1 can be disposed on the two wires 21 and the detection line Between the ends where 20-1 meets (that is, between the two conductive electrodes 22), the portion of the antistatic electrode 23-1 that is adjacent to the end of the negative ground wire connected to the detection line 20-1 extends to the negative ground The end of the lead connected to the detection line 20-1. In this way, the electrical connection between the anti-static electrode 23-1 and the negative ground wire can be achieved without adding an additional structure of the anti-static electrode 23-1 for the electrical connection and the negative ground wire, and the structure is simple and easy to implement.
  • the plurality of anti-static electrodes 23-1 are connected to each other through a first electrode connection line 23-2.
  • the anti-static electrode 23-1 closest to the negative ground wire extends to the end of the negative ground wire connected to the detection line 20-1, so that the multiple anti-static electrodes 23-1 are grounded to the negative electrode The wires are electrically connected.
  • the anti-static electrode 23-1 closest to the negative ground wire is disposed between the ends of the two wires 21 that are connected to the detection line 20-1 (that is, the two conductive Between the electrodes 22), for the arrangement of the anti-static electrode 23-1 and the negative electrode ground wire, see FIG. 11b and FIG. 11c.
  • the anti-static structure 23 may be connected to the detection line 20-1 adjacent to the negative ground wire The portion of the end portion extends to the end of the negative ground wire connected to the detection line 20-1, and the electrical connection between the anti-static structure 23 and the negative ground wire is achieved.
  • the lens 11 further includes a lens assembly 13, the lens assembly 13 is installed inside the lens barrel 12, and is located on the support structure 15 facing away from the optical element 14 Side.
  • the lens assembly 13 can be fixed to the inside of the lens barrel 12 by means of bonding, snapping, fitting and the like.
  • the lens assembly 13 includes at least one optical lens.
  • the lens assembly 13 is formed by stacking the foregoing multiple optical lenses.
  • the optical lens may be a convex lens, for example. Perform collimation and convergence.
  • an embodiment of the present invention also provides an active light-emitting module, as shown in FIGS. 6a to 6d and 8a to 8d, the active light-emitting module 1 At least including: the lens 11, the base substrate 17, the laser 18 and the microprocessor 19 as provided by the embodiment of the present invention.
  • the lens 11 includes a lens barrel 12, a lens assembly 13 and an optical element 14.
  • the lens barrel 12 is installed on one side of the base substrate 17 and forms an accommodating cavity BB with the base substrate 17.
  • the laser 18, the microprocessor 19, the lens assembly 13 and the optical element 14 are all installed in the accommodating cavity BB.
  • the surface of the optical element 14 facing away from the laser 18 is provided with a conductive layer 20 for monitoring the damage or detachment of the optical element 14.
  • the sky surface 12a of the lens barrel 12 is provided with an anti-static structure 23, the inner or outer surface or the inner surface of the barrel wall of the lens barrel 12 is provided with an electrostatic sparse wire 24, the bottom substrate 17 is provided with a ground terminal 25, and the electrostatic sparse wire 24 Is connected to the anti-static structure 23 at one end and to the ground terminal 25 at the other end, so that the anti-static structure 23 is grounded.
  • the anti-static structure 23 can conduct static electricity passing through itself to the ground terminal through the electrostatic sparse wire 24, and the anti-static structure 23 can also attract static electricity near itself, and then evacuate the attracted static electricity to the ground terminal through the electrostatic sparse wire 24, effectively The risk of the conductive layer 20 being damaged by static electricity is reduced, and the conductive layer 20 and the microprocessor 19 connected to the conductive layer 20 are protected.
  • the ground terminal 25 may be disposed inside the receiving cavity BB, so that the end of the electrostatic sparse wire 24 connected to the ground terminal 25 needs to extend into the receiving cavity BB and The ground terminal 25 is electrically connected.
  • the ground terminal 25 can also be disposed outside the accommodating cavity BB. In this way, the end of the electrostatic sparse wire 24 connected to the ground terminal 25 needs to extend into the accommodating cavity BB to be electrically connected to the ground terminal 25.
  • the two ends of the detection line 20-1 of the conductive layer 20 of the optical element 14 are respectively disposed at the bottom of the active light emitting module 1 through two wires 21
  • the microprocessor 19 on the substrate 17 is connected, and the two wires 21 are connected to the microprocessor 19 in the following manner: the bottom substrate 17 is provided with a positive terminal e and a negative terminal f, and the two wires 21 are respectively connected to the positive terminal e and the negative terminal
  • the extreme f, the positive extreme e, and the negative terminal f are respectively connected to the two ports of the microprocessor 19.
  • the negative terminal and the ground terminal 25 are configured as the same terminal, that is, the lead 21 (ie, the negative ground lead) connected to the negative terminal f among the two leads 21 is grounded.
  • the electrostatic sparse wire 24 connected to the anti-static structure 23 is configured as the same conductive line as the negative ground wire, and the anti-static structure 23 is electrically connected to the negative ground wire (ie, the static sparse wire 24).
  • the positive terminal e and the negative terminal f are provided outside the accommodating cavity BB, and the two wires 21 are connected to the positive terminal e and The end connected to the negative terminal f (ie, the ground terminal 25) extends outside the accommodating chamber BB to be connected to the corresponding electrode terminal (ie, the positive terminal e or the negative terminal f).
  • a protrusion 12-1 is provided on the outer surface of the lens barrel 12, and the protrusion 12-1 is located at least above the positive terminal e and the negative terminal f, so that the two wires 21 are connected to the positive terminal e
  • the ends of the negative electrode terminal f may extend to the protruding portion 12-1 so as to extend above the positive electrode terminal e and the negative electrode terminal f, and be connected to the corresponding electrode terminals.
  • the positive terminal e and the negative terminal f can also be provided inside the accommodating cavity BB, and the ends of the two wires 21 connected to the positive terminal e and the negative terminal f (that is, the ground terminal 25) extend to the housing
  • the interior of the cavity BB is connected to the corresponding electrode terminal (ie, positive terminal e or negative terminal f).
  • the active light-emitting module 1 is any module capable of emitting laser light, for example: TOF 3D sensing module includes a high-power laser module, structured light 3D sensing module 115 In the dot matrix projector 115-5 and floodlight illuminator 115-2.
  • an embodiment of the present invention also provides a terminal including the active light emitting module 1 provided by the embodiment of the present invention, which is used to provide a prescribed Laser light (for example, if the active light-emitting module 1 is a dot matrix projector 115-5, the prescribed light that the active light-emitting module 1 needs to provide is structured light) to assist the terminal to realize the 3D sensing function.
  • a prescribed Laser light for example, if the active light-emitting module 1 is a dot matrix projector 115-5, the prescribed light that the active light-emitting module 1 needs to provide is structured light
  • the active light-emitting module 1 When the active light-emitting module 1 is installed in a terminal such as a mobile phone 100, its laser 18 side (i.e., light-emitting side) is close to the inside of the terminal, and the optical element 14 side (and light-emitting side) faces the outside of the terminal to project the prescribed laser light outward Light.
  • a terminal such as a mobile phone 100
  • its laser 18 side i.e., light-emitting side
  • the optical element 14 side and light-emitting side

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Abstract

本发明提供了一种镜头、主动发光模组及终端，涉及电子终端设备技术领域，能够保护光学元件上的导电层，降低导电层被静电损伤的风险。其中，镜头包括镜筒及安装于镜筒内的光学元件，镜筒具有天面，光学元件的朝向天面所在的一侧的表面上设置有导电层。镜头还包括：设置于天面上的防静电结构，及设置于镜筒的筒壁内部或者内表面或者外表面的静电疏导线，静电疏导线的一端与防静电结构电连接，另一端接地。上述镜头安装于主动发光模组中，该主动发光模组应用于终端中，辅助终端实现诸如3D感测的功能。

Description

镜头、主动发光模组及终端 技术领域
本发明涉及电子终端设备技术领域，尤其涉及一种镜头、主动发光模组及终端。
背景技术
目前，3D感测技术是电子终端设备(例如手机)领域的研究热点。3D感测技术是一种深度感测技术，可进一步完善脸部识别或虹膜识别功能，增强终端摄像头的面部和对象识别功能，适用于增强实境、游戏、自动驾驶等功能。
通过在终端中集成结构光、TOF(Time Of Flight，飞时测距)等主动发光模组，可以实现3D感测功能。这类主动发光模组中通常包括激光器及设置于激光器出光方向上的镜头，其中激光器能够发出激光，镜头中包括衍射光学组件(Diffractive Optical Element，简称DOE)或匀光片(Diffuser)等用于散光或匀光的光学元件。如果镜头中的衍射光学组件或匀光片等光学元件出现破损或脱落，可能会导致激光器所发出的激光漏出，漏出的激光直射人眼可能会损伤人眼视力，因此需要对衍射光学组件或匀光片等光学元件的破损或脱落情况进行监控。
通过在光学元件的表面上设置导电层，实时监测导电层上的电信号变化，可实现对光学元件的破损或脱落情况的监控。然而，在光学元件的生产、主动发光模组的组装，以及终端的使用等过程中，均会有静电产生，这些静电进入上述导电层中，会损伤导电层，导致导电层的监控作用失效。
发明内容
本发明提供一种镜头、主动发光模组及终端，用于保护光学元件上的导电层，降低导电层被静电损伤的风险。
为达到上述目的，本发明采用如下技术方案：
本发明的第一方面提供一种镜头，该镜头包括镜筒及安装于镜筒内的光学元件，镜筒具有天面，光学元件的朝向天面所在的一侧的表面上设置有导电层。该镜头还包括：设置于天面上的防静电结构，和设置于镜筒的筒壁内部或者内表面或者外表面的静电疏导线，该静电疏导线的一端与防静电结构电连接，另一端接地。这样，防静电结构能够将经过自身的静电通过静电疏导线疏导至接地端，并且防静电结构还能够吸引自身附近的静电，然后将吸引过来的静电通过静电疏导线疏导至接地端，从而防静电结构将接近导电层的至少一部分静电疏导至接地端，减少了进入导电层的静电量，有效地降低了导电层被静电损伤的风险。
结合第一方面，在一种可能的设计中，防静电结构包括框形的导电薄膜，该框形的导电薄膜在光学元件所确定的平面上的正投影包围导电层，该框形的导电薄膜与静电疏导线电连接。这样，防静电结构全面将导电层围绕在自身所框出的区域内部，从而能够将从导电层周围各个区域而来的静电疏导至接地端，极大地提高了防静电结构对导电层的防静电效果。
结合第一方面，在一种可能的设计中，防静电结构包括一个防静电电极，该防静 电电极与静电疏导线电连接。或者，防静电结构包括多个防静电电极及至少一条第一电极连接线，多个防静电电极通过至少一条第一电极连接线相互电连接，多个防静电电极中的一个防静电电极与静电疏导线电连接。这样，通过防静电电极将经过防静电电极的静电和防静电电极周围的静电疏导至接地端，减少进入导电层的静电量。
结合第一方面，在一种可能的设计中，导电层包括检测线。镜头还包括两条导线，两条导线设置于镜筒的筒壁内部或者内表面或者外表面上，检测线的两端分别通过两条导线连接外部的正极端和负极端，负极端接地。静电疏导线与连接负极端的导线配置为同一条导电线路，以简化镜头的结构和制作工艺。
可选的，镜头还包括第二电极连接线，第二电极连接线的一端与防静电结构电连接，另一端与连接负极端的导线电连接。这样，防静电结构通过第二电极连接线与连接负极端并接地的导线电连接，从而防静电结构实现接地。
可选的，第二电极连接线和连接负极端的导线均设置于镜筒的筒壁内部，或者均设置于镜筒的外表面上，或者均设置于镜筒的内表面上。这样，第二电极连接线与连接负极端的导线可以形成于相同的步骤下，有利于简化镜头的制作工艺。
可选的，防静电结构的与第二电极连接线连接的部分位于两条导线的连接检测线的两个端部之间。这样，防静电结构的与第二电极连接线连接的部分与连接负极端的导线的连接检测线的端部之间的距离较近，有利于缩短第二电极连接线的长度。
结合第一方面，在一种可能的设计中，镜筒的材料为金属直接成型塑料，防静电结构为采用金属直接成型工艺制作的导电结构；或者，防静电结构为采用电镀工艺制作的导电镀层。其中，采用金属直接成型工艺制作防静电结构的方式简单，无需额外准备用于形成防静电结构的导电材料。
结合第一方面，在一种可能的设计中，防静电结构的电阻率均小于导电层的电阻率，以有效地吸引并疏导即将进入导电层的静电。
可选的，防静电结构的材料为金属。金属的电阻率小，能够快速吸引和传导静电，有利于提高防静电结构的防静电能力。
结合第一方面，在一种可能的设计中，防静电结构的至少一部分在光学元件所确定的平面上的正投影中靠近光学元件的边缘，与防静电结构的该部分所覆盖的天面中靠近光学元件的边相重合，以尽量减小防静电结构在光学元件所确定的平面上的正投影与光学元件之间的间距，提高防静电电极对光学元件上所附着的导电层的静电防护能力。
结合第一方面，在以上各种可能的设计及其可选方案中，镜头还包括覆盖在防静电结构上的保护层，以避免防静电结构受到外部环境中的水汽、氧气等因素腐蚀，保护防静电结构。
本发明的第二方面提供一种主动发光模组，该主动发光模组包括底部基板，及安装于底部基板上的镜头，该镜头为如以上任一项所述的镜头。底部基板上设置有接地端，镜头的静电疏导线与接地端电连接。这样，镜头的防静电结构能够将至少一部分即将进入镜头的光学元件上所附着的导电层的静电通过静电疏导线疏导至接地端，降低了导电层被静电损伤的风险，有利于延长主动发光模组的使用寿命。
结合第二方面，在一种可能的设计中，底部基板上设置有正极端和负极端，负极 端与接地端电连接，或者负极端与接地端配置为同一个端子。镜头的光学元件的导电层包括检测线，检测线的两端分别通过两条导线与正极端和负极端电连接，静电疏导线与连接负极端的导线配置为同一条导电线路。这样，简化了镜头的结构和制作工艺。
可选的，镜头的镜筒与底部基板形成容纳腔，正极端和负极端均位于容纳腔的内部或者外部。
本发明的第三方面提供一种终端，该终端包括如以上任一项所述的主动发光模组。由于该主动发光模组中导电层被静电损伤的风险较低，使用寿命较长，因此包括该主动发光模组的终端的可靠性较高。
附图说明
图1为本发明实施例所提供的终端的结构示意图；
图2为本发明实施例所提供的主动发光模组的应用场景的示意图；
图3为图2的局部放大图；
图4a为主动发光模组的一种典型结构示意图；
图4b为主动发光模组中镜筒的俯视图；
图5a为本发明实施例所提供的镜头的应用场景的示意图一；
图5b为本发明实施例所提供的镜头的应用场景的示意图二；
图5c为图5b沿虚线CC'的截面图；
图6a为本发明实施例所提供的第一种主动发光模组的立体图；
图6b为图6a沿虚线DD'的截面图；
图6c为图6a沿虚线EE'的截面图；
图6d为本发明实施例所提供的第一种主动发光模组的俯视图；
图7a为本发明实施例所提供的第二种主动发光模组的俯视图；
图7b为本发明实施例所提供的第三种主动发光模组的俯视图；
图7c为本发明实施例所提供的第四种主动发光模组的俯视图；
图8a为本发明实施例所提供的第五种主动发光模组的立体图；
图8b为图8a沿虚线DD'的截面图；
图8c为图8a沿虚线EE'的截面图；
图8d为本发明实施例所提供的第五种主动发光模组的俯视图；
图8e为本发明实施例所提供的第六种主动发光模组的俯视图；
图9a为本发明实施例所提供的第七种主动发光模组的截面图；
图9b为本发明实施例所提供的第八种主动发光模组的截面图；
图10a为本发明实施例所提供的第九种主动发光模组的立体图；
图10b为图10a沿虚线EE'的截面图；
图10c为本发明实施例所提供的第九种主动发光模组的俯视图；
图11a为本发明实施例所提供的第十种主动发光模组的立体图；
图11b为图11a沿虚线EE'的截面图；
图11c为本发明实施例所提供的第十种主动发光模组的俯视图；
图12a为本发明实施例所提供的第十一种主动发光模组的立体图；
图12b为图12a沿虚线EE'的截面图；
图12c为本发明实施例所提供的第十一种主动发光模组的俯视图；
图13a为本发明实施例所提供的第十二种主动发光模组的立体图；
图13b为图13a沿虚线EE'的截面图；
图13c为本发明实施例所提供的第十二种主动发光模组的俯视图；
图14a为本发明实施例所提供的第十三种主动发光模组的立体图；
图14b为图14a沿虚线CC'的截面图；
图14c为图14a沿虚线EE'的截面图。
具体实施方式
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本发明实施例提供一种镜头及主动发光模组，该镜头及主动发光模组可应用于手机、可穿戴设备、AR(增强现实)\VR(虚拟现实)设备、平板电脑、笔记本电脑、UMPC(超级移动个人计算机)、上网本、PDA(个人数字助理)等任意终端，本发明的实施例对此不作任何限制。
如图1和图2所示，本发明实施例中的终端可以为手机100。下面以手机100为例对实施例进行具体说明。
如图1所示，手机100具体可以包括：处理器101、射频(RF)电路102、存储器103、触摸屏104、蓝牙装置105、一个或多个传感器106、Wi-Fi装置107、定位装置108、音频电路109、外设接口110以及电源装置111等部件。这些部件可通过一根或多根通信总线或信号线(图2中未示出)进行通信。本领域技术人员可以理解，图2中示出的硬件结构并不构成对手机的限定，手机100可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。
下面结合图1对手机100的各个部件进行具体的介绍：
处理器101是手机100的控制中心，利用各种接口和线路连接手机100的各个部分，通过运行或执行存储在存储器103内的应用程序(简称App)，以及调用存储在存储器103内的数据，执行手机100的各种功能和处理数据。在一些实施例中，处理器101可包括一个或多个处理单元。举例来说，处理器101可以是华为技术有限公司制造的麒麟960芯片。
射频电路102可用于在收发信息或通话过程中，无线信号的接收和发送。特别地，射频电路102可以将基站的下行数据接收后，给处理器101处理。另外，将涉及上行的数据发送给基站。通常，射频电路包括但不限于天线、至少一个放大器、收发信机、耦合器、低噪声放大器、双工器等。此外，射频电路102还可以通过无线通信和其他设备通信。所述无线通信可以使用任一通信标准或协议，包括但不限于全球移动通讯系统、通用分组无线服务、码分多址、宽带码分多址、长期演进、电子邮件、短消息服务等。
存储器103用于存储应用程序以及数据，处理器101通过运行存储在存储器103的应用程序以及数据，执行手机100的各种功能以及数据处理。存储器103主要包括 存储程序区以及存储数据区，其中，存储程序区可存储操作系统、至少一个功能所需的应用程序(比如声音播放功能、图像播放功能等)。存储数据区可以存储根据使用手机100时所创建的数据(比如音频数据、电话本等)。此外，存储器103可以包括高速随机存取存储器，还可以包括非易失存储器，例如磁盘存储器件、闪存器件或其他易失性固态存储器件等。存储器103可以存储各种操作系统，例如，苹果公司所开发的iOS操作系统，谷歌公司所开发的Android操作系统等。
触摸屏104可以包括触控板104-1和显示屏104-2。其中，触控板104-1可采集手机100的用户在其上或附近的触摸事件(比如用户使用手指、触控笔等任何适合的物体在触控板104-1上或在触控板104-1附近的操作)，并将采集到的触摸信息发送给其他器件例如处理器101。
其中，用户在触控板104-1附近的触摸事件可以称之为悬浮触控。悬浮触控可以是指，用户无需为了选择、移动或拖动目标(例如图标等)而直接接触触控板，而只需用户位于终端附近以便执行所想要的功能。在悬浮触控的应用场景下，术语“触摸”、“接触”等不会暗示用于直接接触触摸屏，而是附近或接近的接触。
具体的，可以在触控板104-1内设置两种电容式传感器，即互电容传感器和自电容传感器，这两种电容传感器可以交替地阵列排布在触控板104-1上。其中，互电容传感器用于实现正常传统的多点触控，即检测用户接触触控板104-1时的手势。而自电容传感器能够产生比互电容更为强大的信号，从而检测到距离触控板104-1更远的手指感应。因此，当用户的手指在屏幕上悬停时，由于自电容传感器产生的信号要比互电容传感器产生的信号大，使得手机100可以检测到在屏幕上方，例如，距离触控板104-1上方20mm处用户的手势。
可选的，能够进行悬浮触控的触控板104-1可以采用电容式、红外光感以及超声波等实现。此外，可以采用电阻式、电容式、红外线以及表面声波等多种类型来实现触控板104-1。显示屏104-2可用于显示由用户输入的信息或提供给用户的信息以及手机100的各种菜单。可以采用液晶显示器、有机发光二极管等形式来配置显示屏104-2。触控板104-1可以覆盖在显示屏104-2之上，当触控板104-1检测到在其上或附近的触摸事件后，传送给处理器101以确定触摸事件的类型，随后处理器101可以根据触摸事件的类型在显示屏104-2上提供相应的视觉输出。
虽然在图1中，触控板104-1与显示屏104-2是作为两个独立的部件来实现手机100的输入和输出功能，但是在某些实施例中，可以将触控板104-1与显示屏104-2集成而实现手机100的输入和输出功能。
可以理解的是，触摸屏104是由多层的材料堆叠而成，本发明实施例中只展示出了触控板(层)和显示屏(层)，其他层在本发明实施例中不予记载。另外，在本发明其他一些实施例中，触控板104-1可以覆盖在显示屏104-2之上，并且触控板104-1的尺寸大于显示屏104-2的尺寸，使得显示屏104-2全部覆盖在触控板104-1下面，或者，上述触控板104-1可以以全面板的形式配置在手机100的正面，也即用户在手机100正面的触摸均能被手机感知，这样就可以实现手机正面的全触控体验。在其他一些实施例中，触控板104-1以全面板的形式配置在手机100的正面，显示屏104-2也可以以全面板的形式配置在手机100的正面，这样在手机的正面就能够实现无边框 的结构。
在本发明实施例中，手机100还可以具有指纹识别功能。例如，可以在手机100的背面(例如后置摄像头的下方)配置指纹识别器112，或者在手机100的正面(例如触摸屏104的下方)配置指纹识别器112。又例如，可以在触摸屏104中配置指纹采集器件112来实现指纹识别功能，即指纹采集器件112可以与触摸屏104集成在一起来实现手机100的指纹识别功能。在这种情况下，该指纹采集器件112配置在触摸屏104中，可以是触摸屏104的一部分，也可以以其他方式配置在触摸屏104中。另外，该指纹采集器件112还可以被实现为全面板指纹采集器件。因此，可以把触摸屏104看成是任何位置都可以进行指纹识别的一个面板。该指纹采集器件112可以将采集到的指纹发送给处理器101，以便处理器101对该指纹进行处理(例如指纹验证等)。本发明实施例中的指纹采集器件112的主要部件是指纹传感器，该指纹传感器可以采用任何类型的感测技术，包括但不限于光学式、电容式、压电式或超声波传感技术等。
手机100还可以包括蓝牙装置105，用于实现手机100与其他短距离的终端(例如手机、智能手表等)之间的数据交换。本发明实施例中的蓝牙装置105可以是集成电路或者蓝牙芯片等。
手机100还可以包括至少一种传感器106，比如光传感器、运动传感器以及其他传感器。具体地，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节触摸屏104的显示屏的亮度，接近传感器可在手机100移动到耳边时，关闭显示屏的电源。作为运动传感器的一种，加速计传感器可检测各个方向上(一般为三轴)加速度的大小，静止时可检测出重力的大小及方向，可用于识别手机姿态的应用(比如横竖屏切换、相关游戏、磁力计姿态校准)、振动识别相关功能(比如计步器、敲击)等。至于手机100还可配置的陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器，在此不再赘述。
Wi-Fi装置107，用于为手机100提供遵循Wi-Fi相关标准协议的网络接入，手机100可以通过Wi-Fi装置107接入到Wi-Fi接入点，进而帮助用户收发电子邮件、浏览网页和访问流媒体等，它为用户提供了无线的宽带互联网访问。在其他一些实施例中，该Wi-Fi装置107也可以作为Wi-Fi无线接入点，可以为其他终端提供Wi-Fi网络接入。
定位装置108，用于为手机100提供地理位置。可以理解的是，该定位装置108具体可以是全球定位系统(GPS)或北斗卫星导航系统、俄罗斯GLONASS等定位系统的接收器。定位装置108在接收到上述定位系统发送的地理位置后，将该信息发送给处理器101进行处理，或者发送给存储器103进行保存。在另外的一些实施例中，该定位装置108还可以是辅助全球卫星定位系统(AGPS)的接收器，AGPS系统通过作为辅助服务器来协助定位装置108完成测距和定位服务，在这种情况下，辅助定位服务器通过无线通信网络与终端例如手机100的定位装置108(即GPS接收器)通信而提供定位协助。在另外的一些实施例中，该定位装置108也可以是基于Wi-Fi接入点的定位技术。由于每一个Wi-Fi接入点都有一个全球唯一的MAC地址，终端在开启Wi-Fi的情况下即可扫描并收集周围的Wi-Fi接入点的广播信号，因此可以获取到Wi-Fi接入点广播出来的MAC地址。终端将这些能够标示Wi-Fi接入点的数据(例如MAC地址) 通过无线通信网络发送给位置服务器，由位置服务器检索出每一个Wi-Fi接入点的地理位置，并结合Wi-Fi广播信号的强弱程度，计算出该终端的地理位置并发送到该终端的定位装置108中。
音频电路109、扬声器113、麦克风114可提供用户与手机100之间的音频接口。音频电路109可将接收到的音频数据转换后的电信号，传输到扬声器113，由扬声器113转换为声音信号输出。另一方面，麦克风114将收集的声音信号转换为电信号，由音频电路109接收后转换为音频数据，再将音频数据输出至RF电路102以发送给比如另一手机，或者将音频数据输出至存储器103以便进一步处理。
外设接口110，用于为外部的输入/输出设备(例如键盘、鼠标、外接显示器、外部存储器、用户识别模块卡等)提供各种接口。例如通过通用串行总线(USB)接口与鼠标连接，通过用户识别模块卡卡槽上的金属触点与电信运营商提供的用户识别模块卡(SIM)卡进行连接。外设接口110可以被用来将上述外部的输入/输出外围设备耦接到处理器101和存储器103。
手机100还可以包括给各个部件供电的电源装置111(比如电池和电源管理芯片)，电池可以通过电源管理芯片与处理器101逻辑相连，从而通过电源装置111实现管理充电、放电、以及功耗管理等功能。
尽管图1未示出，手机100还可以包括摄像头(前置摄像头和/或后置摄像头)、闪光灯、微型投影装置、近场通信(NFC)装置等，在此不再赘述。
对于诸如上述手机100的终端，可在其中集成3D感测模块，以使终端实现3D感测功能。普通的数码相机只能取得平面彩色影像，而没有图像的深度资讯。这代表当我们看到一张照片，只知道这个人的脸部有多宽多高，却不知道他脸部的立体结构，例如：鼻梁相对脸颊的高度，眼窝相对脸颊的深度等。通过3D感测取得影像的深度资讯，以使终端实现脸部识别或手势控制，例如通过识别用户的脸部特征来解锁手机，或者当用户在手机前方做出挥动手势时，便可控制终端删除电子邮件等。
实现3D感测的技术主要包括以下两种：
(一)TOF(Time Of Flight，飞时测距)技术：利用高功率的激光器(如VCSEL(Vertical-Cavity Surface-Emitting Laser，单点垂直腔面发射激光器)发射出红外光激光照射到物体表面，激光经物体表面被反射，反射后的激光被红外光影像传感器捕捉。由于激光的光速已知，因此可以利用红外光影像传感器量测物体表面不同深度的位置反射回来激光的时间，计算出物体表面不同位置的距离(深度)。
(二)结构光(Structured Light)技术：利用激光器打出不同的光线图形(具有一定结构特征的光线，称为结构光)，光线图形投射到物体表面后被物体表面不同深度的位置所反射，反射后的光线图形会出现扭曲。例如：激光器打出直线条纹的光线投射到手指上，由于手指的表面是立体圆弧形，因此直线条纹经过圆弧形的手指表面所反射回来的条纹变成了圆弧形条纹。圆弧形条纹被红外光影像传感器捕捉后，终端就可以根据反射的圆弧形条纹反推出手指的立体结构。
如图2所示，以手机100为例，TOF或结构光的3D感测模块可设置于手机100的顶端，如手机100的“刘海”位置(即图2中所示出的区域AA)。
如图3所示，以手机100中集成有结构光3D感测模块115为例，结构光3D感测 模块115在手机100中的布置形式为：结构光3D感测模块115包括红外光相机115-1、泛光照明器115-2、近距离传感器115-3、红外影像传感器115-4及点阵投射器115-5等模组。其中，泛光照明器115-2中设置有低功率的激光器(如VCSEL)及包括匀光片等部件的镜头。点阵投射器115-5中设置有高功率的激光器(如VCSEL)及包括衍射光学组件等部件的镜头。
示例性的，上述结构光3D感测模块115进行人脸识别的过程为：当有物体(如人脸)靠近手机100时，近距离传感器115-3感应到有物体靠近手机100，从而向手机100的处理器101发出有物体靠近的讯号。处理器101接收该有物体靠近的讯号，控制泛光照明器115-2启动，泛光照明器115-2中的低功率的激光器向物体表面投射红外光激光。物体表面反射泛光照明器115-2所投射的红外光激光，红外光相机115-1捕捉到物体表面所反射的红外光激光，从而获取到物体表面的影像资讯，然后将所获取到的影像资讯上传给处理器101。处理器101根据所上传的影像资讯判断接近手机100的物体是否为人脸。
当处理器101判断接近手机100的物体为人脸时，控制点阵投射器115-5启动。点阵投射器115-5中的高功率的激光器发射红外光激光，这些红外光激光经由点阵投射器115-5中的衍射光学组件等部件的作用，形成许多(如大约3万个)结构光的光点投射到人脸表面。这些结构光的光点所形成的阵列被人脸表面不同位置反射，红外光相机115-1捕捉到被人脸表面反射的结构光的光点，从而获取到人脸表面不同位置的深度资讯，然后将所获取到的深度资讯上传给处理器101。处理器101将所上传的深度资讯与预先存储在手机100中的用户脸部特征数据进行比对和计算，辨识该接近手机100的人脸是否为手机100的用户的脸部，如果是，则控制手机100解锁；如果否，控制手机100继续保持锁定状态。
TOF或结构光的3D感测模块中，均包括能够发射激光的模组，例如：TOF 3D感测模块中包括高功率的激光器的模组，结构光3D感测模块115中的点阵投射器115-5及泛光照明器115-2，以下称这类模组为主动发光模组。
如图4a所示，示出了主动发光模组1的一种典型结构，主动发光模组1主要包括：镜头11、底部基板17、激光器18及微处理器(MCU，Microcontroller Unit)19，其中，镜头11包括镜筒12、透镜组件13及光学元件14。镜筒12安装于底部基板17的一侧，与底部基板17形成容纳腔BB。并且，请参见图4b，镜筒12内部远离底部基板17的一端设置有承托结构15，承托结构15为环状结构，环设于镜筒12的内表面上，形成通光孔径GG。激光器18、微处理器19、透镜组件13和光学元件14均安装于容纳腔BB中。其中，激光器18和微处理器19安装于底部基板17上。透镜组件13安装于承托结构15与底部基板17之间。光学元件14的边缘通过粘胶16固定于承托结构15背向激光器18的表面上。作为一种可能的设计，光学元件14的朝向激光器18的表面上设置有微结构层14-1，微结构层14-1包括衍射光栅或网点等微结构，以使光学元件14具有特定功能。
上述主动发光模组1中，激光器18的类型具体可为VCSEL、DFB(Distributed Feedback Laser，分布式反馈激光器、边发射激光器等。透镜组件13包括至少一个光学透镜，当透镜组件13包括多个光学透镜时，透镜组件13由前述多个光学透镜叠加 而成，光学透镜例如可为凸透镜，透镜组件13用于对激光器18所发出的激光光线进行准直、汇聚等作用。光学元件14的类型具体可为匀光片、衍射光学组件、菲涅尔透镜等。示例性的，若主动发光模组1为TOF 3D感测模块中包括高功率的激光器的模组，或者为结构光3D感测模块中的泛光照明器，则光学元件14具体可为匀光片，光学元件14的微结构层14-1包括诸如网点的匀光微结构。若主动发光模组1为结构光3D感测模块中的点阵投射器，则光学元件14具体可为衍射光学组件(DOE)，光学元件14的微结构层14-1包括衍射光栅微结构。
上述主动发光模组1可安装于诸如手机100的终端内，其激光器18侧(即发光侧)靠近终端内部，光学元件14侧(即出光侧)朝向终端外部，以向外投射出激光光线。在上述主动发光模组1中，微处理器19与终端的主板上所集成的处理器相连，示例性的，若主动发光模组1应用于手机100中，则主动发光模组1的微处理器19与手机100的处理器101相连。微处理器19与激光器18相连，控制激光器18发射激光，激光光线经过透镜组件13，通过通光孔径GG，然后经过光学元件14射出主动发光模组1外部。
在终端的实际使用过程中，随着使用时间的延长，终端中的主动发光模组1发生老化而可靠性下降，诸如进水、腐蚀等情况的发生，可能会引起主动发光模组1中的光学元件14破损或脱落，此时主动发光模组1中的激光器18所发出的激光漏出，泄漏的激光直射人眼可能会对人眼视力造成损伤。倘若主动发光模组1中的激光器18所发出的为高功率的激光，则对人眼造成的伤害会更加严重。
因此，需要对主动发光模组1中光学元件14的破损或脱落情况进行监控，以便于在光学元件14发生破损或脱落时，及时采取诸如关闭激光器18的应对措施，来避免激光器18所发出的激光漏出。在相关技术中，通过在光学元件14的表面上设置导电层来对光学元件14的破损或脱落情况进行监控。具体的，请参见图5a～图5c，在光学元件14的背向激光器18的表面上设置导电层20，导电层20包括检测线20-1，检测线20-1的材料为ITO(铟锡氧化物)、IZO(铟锌氧化物)、IGZO(铟镓锌氧化物)或ITZO(铟锡锌氧化物)等透明导电材料。检测线20-1的两端通过导线21连接至微处理器19，从而检测线20-1、导线21和微处理器19形成回路，以下称该回路为监测电路。
请继续参见图5a～图5c，导电层20还包括分别设置于检测线20-1的两端的导电垫20-2，导电垫20-2上方及导线21的与检测线20-1相接的端部上方设置有导电电极22，使得检测线20-1通过该导电垫20-2及导电电极22实现与导线21电连接。
在上述监测电路中，微处理器19向整个监测电路提供电压，实时监测检测线20-1的电阻值或检测线20-1两端的电压值。当检测线20-1的电阻值或检测线20-1两端的电压值发生异常变化时，例如检测线20-1的电阻值超出设定电阻阈值范围，或者检测线20-1两端的电压值超出设定电压阈值范围，说明监测电路发生开路，可能是检测线20-1断裂，或者检测线20-1与导线21的连接处发生开路。而引起检测线20-1断裂的原因可能是检测线20-1所附着的光学元件14发生破损，引起检测线20-1与导线21的连接处发生开路的原因可能是检测线20-1所附着的光学元件14发生脱落。因此，当微处理器19监测到检测线20-1的电阻值超出设定电阻阈值范围，或者检测线20-1 两端的电压值超出设定电压阈值范围时，可以判定光学元件14破损或脱落。当判定光学元件14发生破损或脱落时，微处理器19控制电源2停止向激光器18供电，激光器18关闭，从而有效地避免了激光器18所发射的激光漏出直射人眼而对人眼造成伤害。
需要说明的是，由于光学元件14发生破损或脱落时，会引起检测线20-1自身断裂，或者引起检测线20-1与导线21的连接处断开，因此此时微处理器19监测得到的检测线20-1的电阻值会变得极大，甚至为无穷大(∞)，或者检测线20-1两端的电压值接近或等于微处理器19提供给整个监测电路的电压值。
上面所提到的“设定电阻阈值范围”可设定为围绕检测线20-1在未断裂时的电阻值R上下波动的一个数值范围，例如，“设定电阻阈值范围”可设定为大于或等于80％R，小于或等于120％R。示例性的，若检测线20-1在未断裂时的电阻值R为10KΩ，则“设定电阻阈值范围”可设定为大于或等于8KΩ，小于或等于12KΩ。
上面所提到的“设定电压阈值范围”可设定为围绕检测线20-1在未断裂时在整个监测电路中所分担的电压值U上下波动的一个数值范围，例如，“设定电压阈值范围”可设定为大于或等于80％U，小于或等于120％U。示例性的，若检测线20-1在未断裂时在整个监测电路中所分担的电压值U为0.8V，则“设定电压阈值范围”可设定为大于或等于0.64V，小于或等于0.96V。
在上述对光学元件14的破损或脱落情况实时监控的技术方案中，需要在光学元件14的背向激光器18的表面上设置导电层20，也就是说，导电层20设置在光学元件14的面向模组外部的表面上。由于在光学元件14的生产、主动发光模组1的组装，以及终端的使用等过程中，均会有静电产生，加之导电层20设置在光学元件14的面向模组外部的表面上，因此静电非常容易进入导电层20中，静电的电压极高，会损伤导电层20，造成导电层20中的检测线20-1断裂，从而导致检测线20-1对光学元件14的破损或脱落情况的监控作用失效。并且，进入导电层20的静电可能会沿着与导电层20相连的导线21传导至微处理器19中，损伤微处理器19。
针对上述问题，本发明的实施例提供了一种镜头，如图6a～图6d、图8a～图8d所示，该镜头11应用于主动发光模组1中，镜头11包括镜筒12及光学元件14。
其中，镜筒12具有天面12a及与天面12a相对的底面(图中未示出)，底面与主动发光模组1的底部基板17相接，天面12a处于镜筒12的远离底部基板1的一侧，天面12a为框形表面。在一些实施例中，镜筒12内部天面12a所在的一侧设置有承托结构15，请参见图4b，承托结构15为环状结构，环设于镜筒12的内表面上，形成通光孔径GG。
光学元件14安装于镜筒12内部且位于镜筒12的天面12a所在的一侧。示例性的，光学元件14的边缘通过粘胶16固定于承托结构15的朝向镜筒12的天面12a所在的一侧的表面上。光学元件14的朝向镜筒12的天面12a所在的一侧的表面上设有用于对光学元件14的破损或脱落情况进行监控的导电层20。
上述镜头11还包括设置于镜筒12的天面12a上的防静电结构23，及设置于镜筒12的筒壁内部或者内表面或者外表面上的静电疏导线24。防静电结构23和静电疏导线24均导电，且二者电连接。另外，静电疏导线24的远离防静电结构23的一端接地，示例性的，如图6b所示，当上述镜筒12应用于主动发光模组1中时，主动发光模组 1的底部基板17上设置有接地端25，静电疏导线24的远离防静电结构23的一端可与该接地端25相连，以使防静电结构23及静电疏导线24接地。
防静电结构23能够将经过自身的静电通过静电疏导线24疏导至接地端，并且防静电结构23还能够吸引自身附近的静电，然后将吸引过来的静电通过静电疏导线24疏导至接地端。由于镜筒12的框形的天面12a围绕导电层20，防静电结构23设置于天面12a上，因此防静电结构23位于导电层20的周围的至少一部分区域内，从而防静电结构23能够将接近导电层20的至少一部分静电疏导至接地端25，减少了进入导电层20的静电量，有效地降低了导电层20被静电损伤的风险，保护了导电层20。进一步的，由于防静电结构23减少了进入导电层20的静电量，因此也就降低了静电沿着与导电层20相连的导线21进入微处理器19而损伤微处理器19的风险。
作为一种可能的设计，如图6a～图6d、图7a～图7c所示，防静电结构23包括至少一个防静电电极23-1。示例性的，请参见图6a和图6d，防静电结构23包括一个防静电电极23-1，该防静电电极23-1在光学元件14所确定的平面上的正投影位于导电层20所在的光学元件14的周围区域内，能够将经过其自身及自身周围的静电疏导至接地端25。
示例性的，请参见图7a～图7c，防静电结构23包括多个防静电电极23-1，多个防静电电极23-1之间通过第一电极连接线23-2相互电连接，以便于多个防静电电极23-1可以统一通过一条静电疏导线24接地。多个防静电电极23-1相互间隔地布置于镜筒12的天面12a上，进一步的，多个防静电电极23-1等间隔地布置于导电层20所在的光学元件14的周围，从而可提高防静电结构23对导电层20周围的各个区域的静电疏导能力。
作为一种可能的设计，多个防静电电极23-1之间也可以不进行电连接，每个防静电电极23-1均独立的通过一条静电疏导线24接地。
可选的，对于矩形的光学元件14，如图7a所示，可在光学元件14的每条边的一侧各设置一个防静电电极23-1，防静电电极23-1的形状可为方块形，例如为矩形。如图7b所示，可在光学元件14的长边的一侧各设置两个防静电电极23-1，在光学元件14的短边的一侧各设置一个防静电电极23-1，防静电电极23-1的形状可为方块形，例如为矩形。如图7c所示，可在光学元件14的四角区域各设置一个防静电电极23-1，防静电电极23-1的形状可为L形。可以想象，多个防静电电极23-1的设置方式还可以有其它方式，此处不进行一一列举。
基于上述设计，请再次参见图6d，防静电电极23-1在光学元件14所确定的平面上的正投影与光学元件14之间的间距d越小越好，这样能够尽可能的提高防静电电极23-1对光学元件14上所附着的导电层20的静电防护能力。示例性的，防静电电极23-1在光学元件14所确定的平面上的正投影靠近光学元件14的边缘与天面12a的相应的内侧边重合，以尽量减小防静电电极23-1在光学元件14所确定的平面上的正投影与光学元件14之间的间距d。
需要说明的是，请继续参见图6d，防静电电极23-1的长度L可任意设置，本发明的实施例对此并不设限，示例性的，防静电电极23-1的长度L小于或等于其所对应的光学元件14的边的长度。防静电电极23-1的形状可任意设置，本发明的实施例对 此并不设限，示例性的，防静电电极23-1的形状为矩形(如图6d、图7a和图7b所示)，或者防静电电极23-1的形状为L形(如图7c所示)，等等。
另外，对于镜筒12的天面12a上设置有多个防静电电极23-1的方案，多个防静电电极23-1的形状和大小可以均相同，以简化制作多个防静电电极23-1的工艺步骤。
作为另一种可能的设计，如图8a～图8d所示，防静电结构23为框形的导电薄膜，沿镜筒12的框形的天面12a延伸，从而防静电结构23全面将导电层20围绕在自身所框出的区域内部，能够将从导电层20周围各个区域而来的静电疏导至接地端25，极大地提高了防静电结构23对导电层20的防静电效果。
基于上述设计，作为防静电结构23的框形的导电薄膜的各处的宽度相等或不相等。示例性的，请参见图8a和图8d，导电层20的检测线20-1的两端分别与两条导线21连接，防静电结构23在导线21的端部(具体指导线21的与检测线20-1相接的端部，以下称该端部为检测线相接端)位置处避开导线21的检测线相接端，以避免与导线21的检测线相接端电连接，防静电结构23中除了对应导线21的检测线相接端位置处以外的部分各处的宽度相等，防静电结构23中对应导线21的检测线相接端位置处的部分的宽度小于其余部分的宽度，例如s 1＝s 2＝s 3＞s 4。这样，保证了导电层20周围的各个区域均有防静电结构23保护，并且防静电结构23中除了对应检测线相接端位置处以外的部分各处的防静电能力均匀一致，可提高镜头11整体的可靠性。
请继续参见图8d，防静电结构23在光学元件14所确定的平面上的正投影中，除了对应导线21的检测线相接端位置处，其余各处与光学元件14之间的间距d＇相等，这样防静电结构23中除了对应导线21的检测线相接端位置处以外的部分各处的防静电能力均匀一致。此外，间距d＇越小越好，这样能够尽可能的提高防静电结构23对光学元件14上所附着的导电层20的静电防护能力。示例性的，防静电结构23在光学元件14所确定的平面上的正投影中，除了对应导线21的检测线相接端位置处，其余部分靠近光学元件14的边缘与天面12a的相应的内侧边重合，以尽量减小间距d＇。
作为一种可能的设计，请参见图8e，可在防静电结构23的框形的导电薄膜上设置一个断口Q，断口Q可设置在除防静电结构23的与静电疏导线24电连接的位置以外的任意一个位置。这样，从断口Q一侧至防静电结构23的与静电疏导线24电连接的位置之间的导电薄膜，及从断口Q另一侧至防静电结构23的与静电疏导线24电连接的位置之间的导电薄膜，两部分导电薄膜均能够通过静电疏导线24实现接地。
示例性的，对于矩形的光学元件14，可将断口Q设置在光学元件14的任何一条边的一侧，只要避开防静电结构23的与静电疏导线24电连接的位置即可。可选的，光学元件14包括相对的第一边和第二边，防静电结构23的与静电疏导线24电连接的位置处于光学元件的第一边的一侧，断口Q设置在光学元件的第二边的一侧。进一步的，防静电结构23的与静电疏导线24电连接的位置处于光学元件的第一边的中点位置的一侧，断口Q设置在光学元件的第二边的中点位置的一侧。这样，从断口Q一侧至防静电结构23的与静电疏导线24电连接的位置之间的导电薄膜，及从断口Q另一侧至防静电结构23的与静电疏导线24电连接的位置之间的导电薄膜，两部分导电薄膜的长度相等或大致相等，有利于提高防静电结构23的静电疏导能力。
在一些实施例中，防静电结构23的材料可采用电阻率较小的材料，示例性的，防 静电结构23的材料可采用电阻率小于导电层20的电阻率的材料，以有效地吸引并疏导即将进入导电层20的静电。可选的，防静电结构23的材料可采用诸如铜(Cu)、铬(Cr)、银(Ag)等金属材料。
需要指出的是，如图6a～6d、图7a和图7b所示，对于防静电结构23包括防静电电极23-1的设计，防静电电极23-1的材料的选择可依照上述原则。进一步的，如图7a和图7b所示，对于防静电结构23还包括第一电极连接线23-2的设计，第一电极连接线23-2的材料可与防静电电极23-1的材料相同，这样防静电电极23-1和第一电极连接线23-2可在相同的步骤下制作，从而简化工艺步骤。
在一些实施例中，镜筒12的材料采用LDS(Laser Direct structuring，激光直接成型)塑料，LDS塑料是一种含有机金属复合物的改性塑料，经激光照射后，其中的有机金属复合物能够释放出金属粒子，使得激光照射区域变得导电。防静电结构23的制作可采用LDS技术，制作过程大致为：采用激光照射镜筒12的天面12a上待形成防静电结构23的区域，使激光照射区域的有机金属复合物释放出金属粒子，从而激光照射区域的LDS塑料材料活化，变得导电，形成防静电结构23的图案。采用LDS技术制作防静电结构23工艺简单，无需额外准备用于形成防静电结构23的导电材料。
在另一些实施例中，可以采用电镀、丝网印刷、涂覆、磁控溅射、光刻等工艺中的任意一种制作防静电结构23，本发明对此并不设限。
在再一些实施例中，可以将成型的防静电结构23通过粘贴或焊接等方式直接固定在镜筒12的天面12a上，在防静电结构23与静电疏导线24的连接处可采用焊接的方式进行连接，保证防静电结构23与静电疏导线24电连接。
作为一种可能的设计，可在防静电结构23上覆盖保护层，以避免防静电结构23受到外部环境中的水汽、氧气等因素腐蚀，保护防静电结构23。保护层的材料可选用具有隔绝水氧、抗腐蚀性能的有机或无机材料。
对于静电疏导线24的设置方式，在一些实施例中，如图6b所示，静电疏导线24在镜筒12的筒壁的内部延伸。静电疏导线24的一端延伸至防静电结构23，另一端延伸至底部基板17的接地端25。通过将静电疏导线24设置于镜筒12的筒壁的内部，可以在实现防静电结构23接地的基础上，避免静电疏导线24受到外部环境中的水汽、氧气等因素腐蚀，起到保护静电疏导线24的作用。
在如图6b所示的上述设计中，可采用模内注塑工艺(Insert Molding)将静电疏导线24与镜筒12一体成型制作。或者，可在镜筒12内形成通道，然后将静电疏导线24的材料的溶液灌注入该通道内，形成静电疏导线24。
在另外的设计中，如图9a所示，静电疏导线24在镜筒12外表面上延伸。或者，如图9b所示，静电疏导线24在镜筒12内表面上延伸。在如图9a和9b所示的设计中，可在镜筒12的外表面或内表面上通过涂覆、印刷、粘贴等方式形成静电疏导线24。另外，进一步的，可在静电疏导线24上形成保护层，以遮盖静电疏导线24，避免静电疏导线24裸露而被腐蚀。保护层的材料可选用具有隔绝水氧、抗腐蚀性能的有机或无机材料。
静电疏导线24的材料可选用银(Ag)、铜(Cu)、铬(Cr)等金属导电材料，或者半导体导电材料，或者氧化物导电材料，等等具有导电性能的材料。进一步的，静 电疏导线24的材料可选用与防静电结构23相同的材料，以减小静电疏导线24与防静电结构23之间的接触电阻。
在本发明的一些实施例中，导电层20的检测线20-1的两端分别通过两条导线21与设置于主动发光模组1的底部基板17上的微处理器19连接，这两条导线21在镜筒12内部或者内表面或者外表面上延伸。请参见图5a，两条导线21实现与微处理器19连接的方式为：主动发光模组1的底部基板17上设置有正极端e和负极端f，两条导线21分别连接该正极端e和负极端f，该正极端e和负极端f分别与微处理器19的两个端口相连。其中，负极端f与设置于底部基板17上的接地端25相连，或者负极端与接地端25配置为同一个端子，这样相当于两条导线21中连接负极端f的那条导线21接地。由于连接防静电结构23的静电疏导线24的远离防静电结构23的一端需要接地，并且静电疏导线24在镜筒12内部或者内表面或者外表面上延伸，因此，如图10a～图10c、图11a～图11c、图12a～图12c、及图13a～图13c所示，静电疏导线24可以复用两条导线21中连接负极端f且接地的那条导线21(以下称这条导线21为负极接地导线)，也即，静电疏导线24与负极接地导线配置为同一条导电线路，这样可简化镜头11的结构和制作工艺。
值的一提的是，虽然静电疏导线24与负极接地导线配置为同一条导电线路，但是由于负极接地导线(即静电疏导线24)接地，因此经由防静电结构23传输至负极接地导线(即静电疏导线24)的静电会优先向接地端传输(流动)，而并不会沿着负极接地导线(即静电疏导线24)传输至导电层20中，保证了防静电结构23对导电层20的静电防护效果的实现。
基于上述设计，示例性的，请参见图10a～图10c、图12a～图12c，镜头11还包括第二电极连接线26，该第二电极连接线26将防静电结构23与负极接地导线电连接，从而负极接地导线作为静电疏导线24，防静电结构23通过第二电极连接线26和负极接地导线(即静电疏导线24)实现接地。
作为一种可能的设计，请参见图10a～图10c，对于防静电结构23包括一个防静电电极23-1的镜头11，可将防静电电极23-1设置于两条导线21的与检测线20-1相接的端部之间(也即两个导电电极22之间)，这样防静电电极23-1与负极接地导线之间的距离较近，有利于缩短第二电极连接线26的长度。
作为另一种可能的设计，对于防静电结构23包括多个防静电电极23-1的镜头11，多个防静电电极23-1之间通过第一电极连接线23-2相互连接，将多个防静电电极23-1中距离负极接地导线最近的防静电电极23-1通过第二电极连接线26与负极接地导线相连，这样有利于缩短第二电极连接线26的长度。进一步的，多个防静电电极23-1中距离负极接地导线最近的防静电电极23-1设置于两条导线21的与检测线20-1相接的端部之间(也即两个导电电极22之间)，该防静电电极23-1及与其相连的第二电极连接线26的设置方式可参见图9b。
作为又一种可能的设计，请参见图12a～图12c，对于防静电结构23为框形的导电薄膜的镜头11，可将防静电结构23与第二电极连接线26的连接位置设置于两条导线21的与检测线20-1相接的端部之间(也即两个导电电极22之间)，这样防静电结构23与第二电极连接线26的连接位置与负极接地导线之间的距离较近，有利于缩短 第二电极连接线26的长度。
第二电极连接线26可设置于镜筒12的筒壁内部或者外表面或者内表面上，本发明的实施例对此并不设限。可选的，第二电极连接线26可与负极接地导线(即静电疏导线24)采用相同的设置方式，例如二者均设置于镜筒12的筒壁内部，或者均设置于镜筒12的外表面，或者均设置于内表面上，图10a～图10c、图12a～图12c示出了二者均设置于镜筒12的筒壁内部的例子。这样，第二电极连接线26可与负极接地导线(即静电疏导线24)可以形成于相同的步骤下，有利于简化镜头11的制作工艺。
第二电极连接线26的材料可选用银(Ag)、铜(Cu)、铬(Cr)等金属导电材料，或者半导体导电材料，或者氧化物导电材料，等等具有导电性能的材料。进一步的，第二电极连接线26的材料可选用与负极接地导线(即静电疏导线24)相同的材料，以便于第二电极连接线26与负极接地导线(即静电疏导线24)可以形成于相同的步骤下。
基于静电疏导线24与负极接地导线配置为同一条导电线路的设计，示例性的，图11a～图11c、图13a～图13c，防静电结构23中邻近负极接地导线的与检测线20-1相连的端部的部分延伸至负极接地导线的与检测线20-1相连的端部，实现防静电结构23与负极接地导线的电连接，从而负极接地导线作为静电疏导线24，防静电结构23通过负极接地导线(即静电疏导线24)实现接地。
作为一种可能的设计，请参见图11a～图11c，对于防静电结构23包括一个防静电电极23-1的镜头11，可将防静电电极23-1设置于两条导线21的与检测线20-1相接的端部之间(也即两个导电电极22之间)，防静电电极23-1中邻近负极接地导线的与检测线20-1相连的端部的部分延伸至负极接地导线的与检测线20-1相连的端部。这样，无需增加额外的用于电连接的防静电电极23-1与负极接地导线的结构，就能够实现防静电电极23-1与负极接地导线的电连接，结构简单、易实现。
作为另一种可能的设计，对于防静电结构23包括多个防静电电极23-1的镜头11，多个防静电电极23-1之间通过第一电极连接线23-2相互连接，将多个防静电电极23-1中距离负极接地导线最近的防静电电极23-1延伸至负极接地导线的与检测线20-1相连的端部，以使多个防静电电极23-1与负极接地导线电连接。进一步的，多个防静电电极23-1中距离负极接地导线最近的防静电电极23-1设置于两条导线21的与检测线20-1相接的端部之间(也即两个导电电极22之间)，该防静电电极23-1与负极接地导线电连接的设置方式可参见图11b和图11c。
作为又一种可能的设计，请参见图13a～图13c，对于防静电结构23为框形的导电薄膜的镜头11，可将防静电结构23中邻近负极接地导线的与检测线20-1相连的端部的部分延伸至负极接地导线的与检测线20-1相连的端部，实现防静电结构23与负极接地导线的电连接。
需要说明的是，在本发明的一些实施例中，请参见图6b，镜头11还包括透镜组件13，透镜组件13安装于镜筒12内部，且位于承托结构15的背向光学元件14的一侧。透镜组件13可通过粘接、卡装、嵌装等方式固定于镜筒12内部。透镜组件13包括至少一个光学透镜，当透镜组件13包括多个光学透镜时，透镜组件13由前述多个光学透镜叠加而成，光学透镜例如可为凸透镜，透镜组件13用于对经过自身的光线 进行准直、汇聚等作用。
基于上面对本发明实施例所提供的镜头11的描述，本发明的实施例还提供了一种主动发光模组，如图6a～图6d、图8a～图8d所示，该主动发光模组1至少包括：如本发明实施例所提供的镜头11、底部基板17、激光器18及微处理器19。其中，镜头11包括镜筒12、透镜组件13及光学元件14。镜筒12安装于底部基板17的一侧，与底部基板17形成容纳腔BB，激光器18、微处理器19、透镜组件13及光学元件14均安装于容纳腔BB中。光学元件14的背向激光器18的表面上设置有用于对光学元件14的破损或脱落情况进行监控的导电层20。
镜筒12的天面12a上设置有防静电结构23，镜筒12的筒壁内部或外表面或内表面上设置有静电疏导线24，底部基板17上设置有接地端25，静电疏导线24的一端连接防静电结构23，另一端连接接地端25，从而使得防静电结构23接地。防静电结构23能够将经过自身的静电通过静电疏导线24疏导至接地端，并且防静电结构23还能够吸引自身附近的静电，然后将吸引过来的静电通过静电疏导线24疏导至接地端，有效地降低了导电层20被静电损伤的风险，保护了导电层20及与导电层20相连的微处理器19。
作为一种可能的设计，如图6b和图8b所示，接地端25可设置于容纳腔BB的内部，这样，静电疏导线24的连接接地端25的端部需延伸至容纳腔BB内部与接地端25电连接。当然，接地端25还可设置于容纳腔BB的外部，这样，静电疏导线24的连接接地端25的端部需延伸至容纳腔BB内部与接地端25电连接。
在一些实施例中，请参见图5a、及图14a～图14c，光学元件14的导电层20的检测线20-1的两端分别通过两条导线21与设置于主动发光模组1的底部基板17上的微处理器19连接，这两条导线21与微处理器19连接的方式为：底部基板17上设置有正极端e和负极端f，两条导线21分别连接正极端e和负极端f，正极端e和负极端f分别与微处理器19的两个端口相连。其中，负极端与接地端25配置为同一个端子，也就是说，两条导线21中连接负极端f的那条导线21(即负极接地导线)接地。连接防静电结构23的静电疏导线24静电疏导线24与负极接地导线配置为同一条导电线路，防静电结构23与负极接地导线(即静电疏导线24)电连接。
在上述设计中，作为一种可能的设计，请参见图14a～图14c，正极端e和负极端f(即接地端25)设置于容纳腔BB外部，两条导线21的与正极端e和负极端f(即接地端25)连接的端部延伸至容纳腔BB外部以与相应的电极端(即正极端e或负极端f)连接。可选的，镜筒12的外表面上设置有凸出部12-1，该凸出部12-1至少位于正极端e和负极端f的上方，这样，两条导线21的与正极端e和负极端f端部可延伸至该凸出部12-1，以便于延伸至正极端e和负极端f的上方，与相应的电极端连接。
当然，正极端e和负极端f(即接地端25)也可设置于容纳腔BB内部，两条导线21的与正极端e和负极端f(即接地端25)连接的端部延伸至容纳腔BB的内部以与相应的电极端(即正极端e或负极端f)连接。
需要说明的是，本发明实施例所提供的主动发光模组1为任何能够发射激光的模组，例如：TOF 3D感测模块中包括高功率的激光器的模组，结构光3D感测模块115中的点阵投射器115-5及泛光照明器115-2等。
基于上面对本发明实施例所提供的主动发光模组1的描述，本发明的实施例还提供了一种终端，该终端包括本发明实施例所提供的主动发光模组1，用于提供规定的激光光线(例如，若主动发光模组1为点阵投射器115-5，则该主动发光模组1需要提供的规定的光线为结构光的光线)，以辅助终端实现3D感测功能。当该主动发光模组1安装于诸如手机100的终端内，其激光器18侧(即发光侧)靠近终端内部，光学元件14侧(及出光侧)朝向终端外部，以向外投射出规定的激光光线。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何在本发明揭露的技术范围内的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (16)

  1. 一种镜头，包括镜筒及安装于所述镜筒内的光学元件，其特征在于，所述镜筒具有天面，所述光学元件的朝向所述天面所在的一侧的表面上设置有导电层；所述镜头还包括：
    设置于所述天面上的防静电结构；
    设置于所述镜筒的筒壁内部或者内表面或者外表面的静电疏导线，所述静电疏导线的一端与所述防静电结构电连接，另一端接地。
  2. 根据权利要求1所述的镜头，其特征在于，所述防静电结构包括框形的导电薄膜，所述框形的导电薄膜在所述光学元件所确定的平面上的正投影包围所述导电层，所述框形的导电薄膜与所述静电疏导线电连接。
  3. 根据权利要求1所述的镜头，其特征在于，所述防静电结构包括一个防静电电极，所述防静电电极与所述静电疏导线电连接；或者，
    所述防静电结构包括多个防静电电极及至少一条第一电极连接线，所述多个防静电电极通过所述至少一条第一电极连接线相互电连接，所述多个防静电电极中的一个防静电电极与所述静电疏导线电连接。
  4. 根据权利要求1所述的镜头，其特征在于，所述导电层包括检测线；
    所述镜头还包括两条导线，所述两条导线设置于所述镜筒的筒壁内部或者内表面或者外表面上，所述检测线的两端分别通过所述两条导线连接外部的正极端和负极端，所述负极端接地；
    所述静电疏导线与连接负极端的导线配置为同一条导电线路。
  5. 根据权利要求4所述的镜头，其特征在于，所述镜头还包括第二电极连接线，所述第二电极连接线的一端与所述防静电结构电连接，另一端与所述连接负极端的导线电连接。
  6. 根据权利要求5所述的镜头，其特征在于，所述第二电极连接线和所述连接负极端的导线均设置于所述镜筒的筒壁内部，或者均设置于所述镜筒的外表面上，或者均设置于所述镜筒的内表面上。
  7. 根据权利要求4所述的镜头，其特征在于，所述防静电结构的与所述第二电极连接线连接的部分位于所述两条导线的连接所述检测线的两个端部之间。
  8. 根据权利要求1所述的镜头，其特征在于，所述镜筒的材料为金属直接成型塑料，所述防静电结构为采用金属直接成型工艺制作的导电结构；或者，
    所述防静电结构为采用电镀工艺制作的导电镀层。
  9. 根据权利要求1所述的镜头，其特征在于，所述防静电结构的电阻率均小于所述导电层的电阻率。
  10. 根据权利要求9所述的镜头，其特征在于，所述防静电结构的材料为金属。
  11. 根据权利要求1所述的镜头，其特征在于，所述防静电结构的至少一部分在所述光学元件所确定的平面上的正投影中靠近所述光学元件的边缘，与所述防静电结构的该部分所覆盖的天面中靠近所述光学元件的边相重合。
  12. 根据权利要求1～11中任一项所述的镜头，其特征在于，所述镜头还包括覆盖在所述防静电结构上的保护层。
  13. 一种主动发光模组，包括底部基板，其特征在于，所述主动发光模组还包括安装 于所述底部基板上的镜头，所述镜头为如权利要求1～12中任一项所述的镜头；
    所述底部基板上设置有接地端，所述镜头的静电疏导线与所述接地端电连接。
  14. 根据权利要求13所述的主动发光模组，其特征在于，所述底部基板上设置有正极端和负极端，所述负极端与所述接地端电连接，或者所述负极端与所述接地端配置为同一个端子；
    所述镜头的光学元件的导电层包括检测线，所述检测线的两端分别通过两条导线与所述正极端和所述负极端电连接，所述静电疏导线与连接负极端的导线配置为同一条导电线路。
  15. 根据权利要求14所述的主动发光模组，其特征在于，所述镜头的镜筒与所述底部基板形成容纳腔，所述正极端和所述负极端均位于所述容纳腔的内部或者外部。
  16. 一种终端，其特征在于，所述终端包括如权利要求13～15中任一项所述的主动发光模组。
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