WO2020125330A1 - 光模块通信组件 - Google Patents

光模块通信组件 Download PDF

Info

Publication number
WO2020125330A1
WO2020125330A1 PCT/CN2019/120544 CN2019120544W WO2020125330A1 WO 2020125330 A1 WO2020125330 A1 WO 2020125330A1 CN 2019120544 W CN2019120544 W CN 2019120544W WO 2020125330 A1 WO2020125330 A1 WO 2020125330A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
optical module
heat dissipation
communication assembly
module communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/120544
Other languages
English (en)
French (fr)
Inventor
杨立平
骆军
裘凌红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to EP19897734.0A priority Critical patent/EP3901676A4/en
Publication of WO2020125330A1 publication Critical patent/WO2020125330A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements

Definitions

  • the invention relates to the technical field of communication, and in particular to an optical module communication component.
  • Embodiments of the present invention provide an optical module communication component to solve the problem of poor heat dissipation caused by a large number of modules in the prior art.
  • an embodiment of the present invention provides an optical module communication assembly including a circuit board. Opposite surfaces of the circuit board are respectively provided with optical modules, and each of the optical modules is provided with a first heat dissipation component.
  • each of the first heat dissipation components is fixed to the corresponding optical module through an elastic connection component.
  • opposite sides of the circuit board include a first circuit board area and a second circuit board area; wherein, the thickness of the circuit board in the first circuit board area is greater than or equal to the thickness of the circuit board in The thickness of the second circuit board area; wherein each of the optical modules is located in the first circuit board area.
  • a second heat dissipation component that is in conflict with the optical module is provided in the first circuit board area of the circuit board.
  • the second heat dissipation component includes a heat spreading plate, the heat spreading plate is disposed at a position corresponding to the first circuit board area, and is in conflict with the setting area of the optical module.
  • the soaking plate is disposed outside the end of the circuit board adjacent to the first circuit board area, and is located between the optical modules on opposite sides of the circuit board, and respectively The optical modules are in conflicting connection with the optical modules on opposite sides of the circuit board.
  • the guide rail of the optical module is connected to the circuit board and the soaking plate in a crimping manner.
  • a heat-conducting medium is provided between the two heat sinks and the two conflicting connection surfaces of the optical module.
  • the thickness of the second heat dissipation component is not greater than the thickness of the circuit board in the first circuit board area.
  • the elastic connecting member includes an elastic reed.
  • the optical module communication assembly further includes a panel, and the panel is disposed along a direction perpendicular to opposite sides of the circuit board;
  • the panel is respectively connected to the guide rail of each optical module.
  • the optical module communication component further includes a communication chip and a control chip, wherein the communication chip is disposed on one of the two opposite sides of the circuit board and is located in the second circuit board area;
  • the control chip is disposed on one of the two opposite sides of the circuit board, and is located in the second circuit board area;
  • the communication chip and the control chip are respectively provided with third heat dissipation components.
  • the second circuit board area of the circuit board is provided with a balanced wind resistance board.
  • the density of the optical module can be increased, and by arranging the first heat dissipation component on each optical module, the effective heat dissipation space can be increased, so that density improvement and heat dissipation can be solved
  • the problem of space conflicts improves the system access capacity.
  • FIG. 1 is a schematic structural diagram of an optical module communication component according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of an optical module communication component according to a second embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of an optical module communication component according to a third embodiment of the present invention.
  • the first embodiment of the present invention provides an optical module communication assembly. With reference to FIG. 1, it includes a circuit board 1, which includes two opposite surfaces, a front surface and a reverse surface, respectively. An optical module 2 and a second optical module 4, the first optical module 2 and the second optical module 4 are respectively provided with a first heat dissipation component 3 and a first heat dissipation component 5.
  • the optical module communication component provided by the embodiment of the present invention improves the installation density of the optical module by arranging the optical module on the front and back sides of the circuit board 1 at the same time, and by disposing the heat dissipation device on the optical module
  • the problem of poor heat dissipation caused by high density improves the heat dissipation effect.
  • each first heat dissipation component is fixed to the corresponding optical module through an elastic connection component.
  • the first heat dissipating member can be kept in pressure contact with the optical module, thereby not only improving the stability of the connection, but also the optical module can absorb heat and conduct heat through the heat dissipating member, and finally dissipate the heat. Therefore, the heat dissipation efficiency can be improved.
  • the elastic connecting member may be an elastic reed, for example.
  • the heat dissipation component can also be fixed on the optical module by using other elastic components.
  • the number of first optical modules 2 provided on the front surface of the circuit board 1 may be one or more, and the number of second optical modules 4 provided on the reverse surface of the circuit board 1 may also be one or more.
  • the specific number can be adjusted according to actual needs.
  • the optical modules on the same surface are arranged flat along the surface where they are located.
  • the optical modules on different surfaces may be arranged in pairs, or they may be arranged in a staggered manner.
  • the first optical module 2 and the second optical module 4 shown in FIG. 1 are respectively disposed on the front and rear surfaces of the circuit board 1 opposite to each other.
  • a second embodiment of the present invention provides an optical module communication assembly, including a circuit board 1.
  • the opposite sides of the circuit board 1 include a first circuit board area and a second circuit board area.
  • the first circuit board area is located in an edge area adjacent to one side of the front surface (or reverse surface) of the circuit board 1, the front surface of the circuit board 1 Or the remaining area on the reverse side is the second circuit board area.
  • the thickness of the circuit board 1 in the first circuit board area is greater than the thickness of the circuit board 1 in the second circuit board area, and the first optical module 2 and the second optical module 4 are located in the first Circuit board area.
  • the thickness of the first circuit board area is 4 mm, and the thickness can meet the installation requirements of the first optical module 2 and the second optical module 4 that are respectively disposed on the front and back surfaces of the circuit board 1.
  • a second heat dissipation component 6 is also provided in the first circuit board area of the circuit board 1, and the second heat dissipation component 6 is located between the first optical module 2 and the second optical module 4 and is in conflict with the two. With the aid of the second heat dissipation component 6, the heat dissipation efficiency and the heat dissipation effect can be further improved.
  • the thickness of the second heat dissipation component 6 is not greater than the thickness of the circuit board 1 in the first circuit board area. In this way, it can be ensured that the second heat dissipation member 6 does not interfere with the installation of the first optical module 2 and the second optical module 4.
  • the second heat dissipation component 6 includes a heat dissipation plate 61 that is disposed outside the end of the circuit board 1 adjacent to the first circuit board area, and is located in the first Between the protruding portions of the first optical module 2 and the second optical module 4 with respect to the above ends, and the heat spreading plate 61 are in conflicting connection with the setting areas of the first optical module 2 and the second optical module 4, respectively.
  • the heat spreading plate 61 By adopting the structure of the heat spreading plate 61, the contact area with the optical module can be increased, so that the heat dissipation efficiency can be further improved.
  • the heat spreading plate 61 is provided between the first optical module 2 and the second optical module 4, however, the present invention is not limited to this. In practical applications, the second heat dissipating component 6 It can also be set at any other position that can achieve heat dissipation.
  • the guide rail 21 of the first optical module 2 is connected to the circuit board 1 and the heat dissipation plate 61 by crimping
  • the guide rail 41 of the second optical module 4 is connected to the circuit board 1 and the heat dissipation by crimping
  • the board 61 is connected.
  • a heat-conducting medium 62 is provided between the heat dissipation plate 61 and the two conflicting connection surfaces of the first optical module 2 and between the heat dissipation plate 61 and the two conflicting connection surfaces of the second optical module 4 There is a heat conductive medium 63.
  • the optical module communication assembly improves the installation density of the optical module by arranging the optical module on the front and back sides of the circuit board 1 at the same time, and at the same time by disposing the heat dissipation device on the optical module and on the front of the circuit board 1 A soaking plate 61 is interposed between the two optical modules on the reverse surface, which improves the heat dissipation effect.
  • the heat dissipation efficiency is improved by the heat conduction medium provided between the heat equalizing plate 61 and the optical module.
  • the embodiment of the present invention solves the problem of poor heat dissipation due to the high installation density of the optical module, so that the optical module communication component has a strong heat dissipation capability.
  • a third embodiment of the present invention provides an optical module communication assembly, including a circuit board 1, the circuit board 1 includes two opposing surfaces, respectively, a front surface and a reverse surface, and a first optical module 2 is provided on the front surface and the reverse surface With the second optical module 4, the first optical module 2 and the second optical module 4 are small form-factor pluggable (SFP) optical modules, combined with FIG.
  • SFP small form-factor pluggable
  • the front and back sides of the circuit board 1 are both It includes a first circuit board area and a second circuit board area; wherein, a heat equalizing plate 61 is provided outside the end of the circuit board 1 adjacent to the first circuit board area, and a heat conducting medium 62 is provided on the front of the heat equalizing plate 61 A heat conducting medium 63 is provided on the reverse surface of the heat spreading plate 61.
  • a curved solder SFP socket 21 is mounted on the front side of the circuit board 1 and located in the first circuit board area, and a curved solder SFP socket is mounted on the reverse side of the circuit board 1 and located in the first circuit board area 41.
  • the optical rail 22 of the first optical module 2 and the optical rail 42 of the second optical module 4 are both pressure-bonded SFP optical rails, and both are pressure-bonded to the circuit board 1 and the heat equalizing plate 61 in a pressure-bonded manner.
  • the first heat dissipation component 3 and the optical guide 22 of the first optical module 2 are assembled by elastic reeds, and the first heat dissipation component 5 and the optical guide 42 of the second optical module 4 are assembled by elastic reeds.
  • a heat dissipation component maintains a compressed and charged state, so that the first heat dissipation component can maintain pressure contact with the optical module, thereby not only improving the stability of the connection, but also the optical module can absorb heat and conduct heat through the heat dissipation component, and finally dissipate the heat So that the heat dissipation efficiency can be improved.
  • auxiliary heat dissipation surfaces of the first optical module 2 and the second optical module 4 respectively pass the optical guide 21 of the first optical module 2 and the optical guide 41 of the second optical module 4, and the heat conducting medium 62 and the heat conducting medium 63 to equalize heat
  • the board 61 conducts heat to reduce heat cascade of the optical module group.
  • it further includes a panel 10, which is arranged along a direction perpendicular to the front or back of the circuit board 1, and the panel 10 is respectively connected to the optical guide 21 and the second optical module of the first optical module 2 4 is connected to the optical guide rail 41.
  • the panel 10 is respectively overlapped with the reed portion of the optical guide rail 21 of the first optical module 2 and the reed portion of the optical guide rail 41 of the second optical module 4 to ensure system shielding requirements.
  • the optical module communication component further includes a communication chip 7 and a control chip 8, wherein the communication chip 7 is disposed on one of the two opposite sides of the circuit board 1 and is located in the second circuit board area; the control chip 8 is disposed on one of the two opposite sides of the circuit board 1 and is located in the second circuit board area.
  • the communication chip 7 and the control chip 8 are provided on the front and back surfaces of the circuit board 1, respectively.
  • the communication chip 7 and the control chip 8 are provided with third heat dissipation members, respectively.
  • a heat dissipation device 71 is installed on the front of the communication chip 7, and a heat dissipation device 81 is installed on the front of the control chip 8.
  • the heat dissipation device 71 and the heat dissipation device 81 are provided to dissipate heat from the communication chip 7 and the control chip 8, respectively.
  • a balanced wind resistance board 9 may also be provided in the second circuit board area of the circuit board 1.
  • the balance wind resistance plate 9 is provided to reduce the wind resistance difference between the front and back sides of the circuit board 1.
  • the density of the optical module can be increased, and by arranging the first heat dissipation component on each optical module, the effective heat dissipation space can be increased, so that density improvement and heat dissipation can be solved
  • the problem of space conflicts improves the system access capacity.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

一种光模块通信组件，包括电路板(1)，电路板(1)的相对两面分别设置有光模块(2,4)，每一光模块(2,4)上设置有第一散热部件(3,5)。通过在电路板(1)的相对两面同时设置光模块(2,4)，提高了光模块的设置密度，通过在每一光模块(2,4)上设置第一散热部件(3,5)，可以提高有效散热空间，从而解决了由于光模块设置密度高导致的散热差的问题，改善了散热效果。

Description

光模块通信组件 技术领域
本发明涉及通信技术领域，尤其涉及一种光模块通信组件。
背景技术
在通讯领域，随着产品业务量需求的增加和硬件系统集成度的提升，需要在一块单板上布局更多数量的光模块，期望进一步提高单板端口密度并降低端口成本，从而提升产品竞争力。但是，单板槽位空间内的光模块数量增加造成了光模块功耗密度过大，从而带来光模块风冷级联散热难题。在降低光模块的器件尺寸和功耗、引入新的散热技术等措施的基础上，优化单板光模块布局，在单板尺寸一定的前提下，提高光模块密度的同时提升光模块的有效散热空间，是解决光模块布局瓶颈的重要措施。
发明内容
本发明实施例提供一种光模块通信组件，用以解决现有技术中存在由于模块数量多而造成散热差的问题。
第一方面，本发明实施例提供一种光模块通信组件，包括电路板，所述电路板的相对两面分别设置有光模块，每一所述光模块上设置有第一散热部件。
可选的，每一所述第一散热部件通过弹性连接部件固定在对应的所述光模块上。
可选的，所述电路板的相对两面均包括第一电路板区和第二电路板区；其中，所述电路板在所述第一电路板区的厚度大于或等于所述电路板在所述第二电路板区的厚度；其中，每一所述光模块均位于所述第一电路板区。
可选的，所述电路板的所述第一电路板区内设置有与所述光模块抵触连接的第二散热部件。
可选的，所述第二散热部件包括均热板，所述均热板设置在与所述第一电路板区对应的位置处，且与所述光模块的设定区域抵触连接。
可选的，所述均热板设置在所述电路板的与所述第一电路板区邻近的端部外侧，且位于所述电路板的相对两面上的所述光模块之间，且分别与所述电路板的相对两面上的所述光模块抵触连接。
可选的，所述的光模块的导轨采用压接的方式与所述电路板及均热板连接。
可选的，所述均热板与所述光模块的两个抵触连接面之间设置有导热介质。
可选的，所述第二散热部件的厚度不大于所述电路板在所述第一电路板区的厚度。
可选的，所述弹性连接部件包括弹性簧片。
可选的，所述光模块通信组件还包括面板，所述面板沿垂直于所述电路板的相对两面的方向设置；
所述面板分别与每一所述光模块的导轨连接。
可选的，所述光模块通信组件还包括通信芯片和控制芯片，其中，所述通信芯片设置在所述电路板的相对两面中的其中一面上，且位于所述第二电路板区内；所述控制芯片设置在所述电路板的相对两面中的其中一面上，且位于所述第二电路板区内；
所述通信芯片和所述控制芯片上分别设置有第三散热部件。
可选的，所述电路板的第二电路板区设置有平衡风阻板。
本发明实施例通过在电路板的相对两面分别设置有光模块，可以提高光模块密度，并且通过在每一光模块上设置第一散热部件，可以提高有效散热空间，从而可以解决密度提升与散热空间冲突的问题，提升系统接入容量。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举本发明的具体实施方式。
附图说明
通过阅读下文优选实施方式的详细描述，各种其他的优点和益处对 于本领域普通技术人员将变得清楚明了。附图仅用于示出优选实施方式的目的，而并不认为是对本发明的限制。而且在整个附图中，用相同的参考符号表示相同的部件。在附图中：
图1为本发明第一实施例的光模块通信组件的结构示意图；
图2为本发明第二实施例的光模块通信组件的结构示意图；
图3为本发明第三实施例的光模块通信组件的结构示意图。
具体实施方式
下面将参照附图更详细地描述本公开的示例性实施例。虽然附图中显示了本公开的示例性实施例，然而应当理解，可以以各种形式实现本公开而不应被这里阐述的实施例所限制。相反，提供这些实施例是为了能够更透彻地理解本公开，并且能够将本公开的范围完整的传达给本领域的技术人员。
本发明第一实施例提供一种光模块通信组件，结合图1，包括电路板1，该电路板1包括相对设置的两个表面，分别为正面和反面，且在正面和反面分别设置有第一光模块2和第二光模块4，第一光模块2和第二光模块4上分别设置有第一散热部件3和第一散热部件5。
本发明实施例提供的光模块通信组件，其通过在电路板1的正面和反面同时设置光模块，提高了光模块的设置密度，同时通过在光模块上设置散热装置，解决了由于光模块设置密度高导致的散热差的问题，改善的散热效果。
可选的，每一第一散热部件通过弹性连接部件固定在对应的光模块上。在弹性连接部件的弹性作用下，可以使第一散热部件与光模块保持压力接触，从而不仅可以提高连接的稳固性，而且光模块可以通过散热部件吸热并传导热量，最终将热量散发出去，从而可以提高散热效率。具体的，弹性连接部件例如可以为弹性簧片。当然，在实际应用中，散热部件还可以采用其他弹性部件固定在光模块上。
在实际应用中，电路板1的正面上设置的第一光模块2的数量可以为一个或多个，电路板1的反面上设置的第二光模块4的数量也可以为一个或多个，具体个数可以根据实际需要进行调整。另外，在电路板1的正 面(或反面)上的光模块为多个时，同一表面上的光模块沿所在表面平铺设置。此外，对于不同表面上的光模块之间，可以两两相对设置，或者也可以交错设置。例如，图1中示出的分别设置在电路板1的正面和反面上第一光模块2和第二光模块4相对设置。
本发明第二实施例提供一种光模块通信组件，包括电路板1，结合图1和图2，该电路板1的相对两面均包括第一电路板区和第二电路板区。可选的，以电路板1的正面(或反面)均为矩形为例，第一电路板区位于电路板1的正面(或反面)的邻近其中一个侧边的边缘区域，电路板1的正面或反面的其余区域为第二电路板区。
其中，为了满足光模块的安装要求，电路板1在第一电路板区的厚度大于电路板1在第二电路板区的厚度，第一光模块2和第二光模块4均位于该第一电路板区。可选的，该第一电路板区的厚度为4mm，该厚度可以满足分别设置在电路板1的正面和反面上第一光模块2和第二光模块4的安装需要。
而且，电路板1的第一电路板区内还设置有第二散热部件6，该第二散热部件6位于第一光模块2和第二光模块4之间，且与二者抵触连接。借助第二散热部件6，可以进一步提高散热效率，改善散热效果。
本发明实施例中，第二散热部件6的厚度不大于电路板1在第一电路板区的厚度。这样，可以保证第二散热部件6不会对第一光模块2和第二光模块4的安装产生干涉。
具体的，如图2所示，第二散热部件6包括均热板61，该均热板61均热板61设置在电路板1的与第一电路板区邻近的端部外侧，且位于第一光模块2和第二光模块4的相对于上述端部凸出的部分之间，并且均热板61分别与第一光模块2和第二光模块4的设定区域抵触连接。通过采用均热板61的结构，可以提高与光模块的接触面积，从而可以进一步提高散热效率。
需要说明的是，在本实施例中，均热板61设置在第一光模块2和第二光模块4之间，但是，本发明并不局限于此，在实际应用中，第二散热部件6也可以设置在其他任意可实现散热的位置处。
本发明实施例中，第一光模块2的导轨21采用压接的方式与电路板 1及均热板61连接，第二光模块4的导轨41采用压接的方式与电路板1及均热板61连接。
可选的，在均热板61与第一光模块2的两个抵触连接面之间设置有导热介质62，以及在均热板61与第二光模块4的两个抵触连接面之间设置有导热介质63。
本发明实施例提供的光模块通信组件，其通过在电路板1的正面和反面同时设置光模块，提高了光模块的设置密度，同时通过在光模块上设置散热装置并在电路板1的正面和反面上的两个光模块之间夹设均热板61，改善了散热效果。此外，通过设置在均热板61与光模块之间的导热介质，提高了散热效率。本发明实施例解决了由于光模块设置密度高导致的散热差的问题，使得光模块通信组件具有较强的散热能力。
本发明第三实施例提供一种光模块通信组件，包括电路板1，该电路板1包括相对设置的两个表面，分别为正面和反面，且在正面和反面分别设置有第一光模块2和第二光模块4，第一光模块2和第二光模块4均为小型可插拔(Small Form-factor Pluggables，以下简称SFP)光模块，结合图3，电路板1的正面和反面均包括第一电路板区和第二电路板区；其中，在电路板1的与第一电路板区邻近的端部外侧设置有均热板61，该均热板61的正面设置有导热介质62，均热板61的反面设置有导热介质63。
而且，在电路板1的正面，且位于第一电路板区内贴装有弯式焊接SFP插座21，在电路板1的反面，且位于第一电路板区内贴装有弯式焊接SFP插座41。并且，第一光模块2的光导轨22和第二光模块4的光导轨42均为压接式SFP光导轨，二者均采用压接形式压接在电路板1及均热板61上。
第一散热部件3与第一光模块2的光导轨22通过弹性簧片装配，第一散热部件5与第二光模块4的光导轨42通过弹性簧片装配，借助弹性簧片，可以使第一散热部件保持压缩蓄力状态，从而可以使第一散热部件与光模块保持压力接触，从而不仅可以提高连接的稳固性，而且光模块可以通过散热部件吸热并传导热量，最终将热量散发出去，从而可以提高散热效率。
另外，第一光模块2和第二光模块4的辅助散热面分别通过第一光模块2的光导轨21和第二光模块4的光导轨41，以及导热介质62和导热介质63对均热板61传导散热，减少光模块组的热级联。
本实施例在具体实施过程中，还包括面板10，该面板10沿垂直于电路板1的正面或反面的方向设置，并且面板10分别与第一光模块2的光导轨21和第二光模块4的光导轨41连接，具体的，面板10分别与第一光模块2的光导轨21的簧片部和第二光模块4的光导轨41的簧片部搭接，以保证系统屏蔽要求。
本发明实施例中，光模块通信组件还包括通信芯片7和控制芯片8，其中，通信芯片7设置在电路板1的相对两面中的其中一面上，且位于第二电路板区内；控制芯片8设置在电路板1的相对两面中的其中一面上，且位于第二电路板区内。例如，如图3所示，通信芯片7和控制芯片8分别设置在电路板1的正面和反面上。
而且，通信芯片7和控制芯片8上分别设置有第三散热部件。具体的，通信芯片7的正面安装有散热装置71，控制芯片8的正面安装有散热装置81，通过设置散热装置71和散热装置81来分别对通信芯片7和控制芯片8进行散热。
在具体实施过程中，根据电路板1的正面和反面之间的器件风阻差异，还可以在电路板1的第二电路板区设置平衡风阻板9。通过设置平衡风阻板9来减小电路板1的正面和反面之间的风阻差。
本发明实施例通过在电路板的相对两面分别设置有光模块，可以提高光模块密度，并且通过在每一光模块上设置第一散热部件，可以提高有效散热空间，从而可以解决密度提升与散热空间冲突的问题，提升系统接入容量。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上述本发明实施例序号仅仅为了描述，不代表实施例的优劣。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，这些均属于本发明的保护之内。

Claims (13)

  1. 一种光模块通信组件，其特征在于，包括电路板，所述电路板的相对两面分别设置有光模块，每一所述光模块上设置有第一散热部件。
  2. 如权利要求1所述的光模块通信组件，其特征在于，每一所述第一散热部件通过弹性连接部件固定在对应的所述光模块上。
  3. 如权利要求1或2所述的光模块通信组件，其特征在于，所述电路板的相对两面均包括第一电路板区和第二电路板区；其中，所述电路板在所述第一电路板区的厚度大于或等于所述电路板在所述第二电路板区的厚度；其中，每一所述光模块均位于所述第一电路板区。
  4. 如权利要求3所述的光模块通信组件，其特征在于，所述电路板的所述第一电路板区内设置有与所述光模块抵触连接的第二散热部件。
  5. 如权利要求4所述的光模块通信组件，其特征在于，所述第二散热部件包括均热板，所述均热板设置在与所述第一电路板区对应的位置处，且与所述光模块的设定区域抵触连接。
  6. 如权利要求5所述的光模块通信组件，其特征在于，所述均热板设置在所述电路板的与所述第一电路板区邻近的端部外侧，且位于所述电路板的相对两面上的所述光模块之间，且分别与所述电路板的相对两面上的所述光模块抵触连接。
  7. 如权利要求5所述的光模块通信组件，其特征在于，所述光模块的导轨采用压接的方式与所述电路板及均热板连接。
  8. 如权利要求5或6所述的光模块通信组件，其特征在于，在所述均热板与所述光模块的两个抵触连接面之间设置有导热介质。
  9. 如权利要求4所述的光模块通信组件，其特征在于，所述第二散热部件的厚度不大于所述电路板在所述第一电路板区的厚度。
  10. 如权利要求2所述的光模块通信组件，其特征在于，所述弹性连接部件包括弹性簧片。
  11. 如权利要求1所述的光模块通信组件，其特征在于，所述光模块通信组件还包括面板，所述面板沿垂直于所述电路板的相对两面的方向设置；
    所述面板分别与每一所述光模块的导轨连接。
  12. 如权利要求3所述的光模块通信组件，其特征在于，所述光模块通信组件还包括通信芯片和控制芯片，其中，所述通信芯片设置在所述电路板的相对两面中的其中一面上，且位于所述第二电路板区内；所述控制芯片设置在所述电路板的相对两面中的其中一面上，且位于所述第二电路板区内；
    所述通信芯片和所述控制芯片上分别设置有第三散热部件。
  13. 如权利要求12所述的光模块通信组件，其特征在于，所述电路板的第二电路板区设置有平衡风阻板。
PCT/CN2019/120544 2018-12-18 2019-11-25 光模块通信组件 Ceased WO2020125330A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP19897734.0A EP3901676A4 (en) 2018-12-18 2019-11-25 COMMUNICATION ARRANGEMENT FOR OPTICAL MODULES

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811553890.3A CN111338032A (zh) 2018-12-18 2018-12-18 光模块通信组件
CN201811553890.3 2018-12-18

Publications (1)

Publication Number Publication Date
WO2020125330A1 true WO2020125330A1 (zh) 2020-06-25

Family

ID=71100734

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/120544 Ceased WO2020125330A1 (zh) 2018-12-18 2019-11-25 光模块通信组件

Country Status (3)

Country Link
EP (1) EP3901676A4 (zh)
CN (1) CN111338032A (zh)
WO (1) WO2020125330A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7521353B2 (ja) * 2020-09-25 2024-07-24 富士通オプティカルコンポーネンツ株式会社 光通信モジュール
CN114384649A (zh) * 2020-10-22 2022-04-22 南京中兴软件有限责任公司 一种光模块散热装置
CN117668949B (zh) * 2023-11-24 2025-01-28 芯华章智能科技(上海)有限公司 用于箱体级联散热设计的方法、电子设备及存储介质
CN121634421A (zh) * 2024-09-05 2026-03-10 苏州旭创科技有限公司 一种光模块

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070223208A1 (en) * 2006-03-27 2007-09-27 Fujitsu Limited Optical module cage mounting structure
CN202759716U (zh) * 2012-07-31 2013-02-27 中兴通讯股份有限公司 光模块金属导轨
CN103811435A (zh) * 2012-11-14 2014-05-21 华为技术有限公司 一种可插拔热源的散热器
CN204090161U (zh) * 2014-09-17 2015-01-07 华为技术有限公司 一种基带处理单元
US20170192185A1 (en) * 2016-01-04 2017-07-06 Infinera Corp. Stacked Cage Optical Module Heat Relay System
CN206611693U (zh) * 2017-02-13 2017-11-03 南京南瑞继保电气有限公司 一种四层光模块的散热装置
CN107645889A (zh) * 2017-09-29 2018-01-30 武汉光迅科技股份有限公司 一种对单板上光模块进行散热的装置及方法
CN108391367A (zh) * 2018-02-09 2018-08-10 烽火通信科技股份有限公司 一种散热性能较好的光模块

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100470795C (zh) * 2005-05-19 2009-03-18 日本光进株式会社 可插拔模块
CN101872042B (zh) * 2010-05-27 2012-07-04 华为技术有限公司 光模块和光通信系统
WO2011159599A2 (en) * 2010-06-15 2011-12-22 Molex Incorporated Cage, receptacle and system for use therewith
CN102612302A (zh) * 2012-03-13 2012-07-25 华为技术有限公司 光模块散热装置及通信设备
CN204441416U (zh) * 2015-01-21 2015-07-01 广州市香港科大霍英东研究院 一种基于真空腔均热板散热技术的电池散热器
CN207133476U (zh) * 2017-09-19 2018-03-23 深圳市显洋光电有限公司 光模块及通信设备
CN207517668U (zh) * 2017-11-14 2018-06-19 华南理工大学 均温板与igbt芯片的一体封装结构

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070223208A1 (en) * 2006-03-27 2007-09-27 Fujitsu Limited Optical module cage mounting structure
CN202759716U (zh) * 2012-07-31 2013-02-27 中兴通讯股份有限公司 光模块金属导轨
CN103811435A (zh) * 2012-11-14 2014-05-21 华为技术有限公司 一种可插拔热源的散热器
CN204090161U (zh) * 2014-09-17 2015-01-07 华为技术有限公司 一种基带处理单元
US20170192185A1 (en) * 2016-01-04 2017-07-06 Infinera Corp. Stacked Cage Optical Module Heat Relay System
CN206611693U (zh) * 2017-02-13 2017-11-03 南京南瑞继保电气有限公司 一种四层光模块的散热装置
CN107645889A (zh) * 2017-09-29 2018-01-30 武汉光迅科技股份有限公司 一种对单板上光模块进行散热的装置及方法
CN108391367A (zh) * 2018-02-09 2018-08-10 烽火通信科技股份有限公司 一种散热性能较好的光模块

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3901676A4 *

Also Published As

Publication number Publication date
EP3901676A1 (en) 2021-10-27
EP3901676A4 (en) 2022-08-24
CN111338032A (zh) 2020-06-26

Similar Documents

Publication Publication Date Title
WO2020125330A1 (zh) 光模块通信组件
US4884168A (en) Cooling plate with interboard connector apertures for circuit board assemblies
US20140307389A1 (en) Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly
CA3169872A1 (en) Liquid cooling plate suitable for liquid cooling heat dissipation of electronic device, and heat dissipation unit
US9915780B2 (en) Optical module with a dual layer PCBA structure
CN103811438A (zh) 信号传输装置
CN104684245A (zh) 一种单板、电子设备及单板的散热方法
US12082332B2 (en) Thermal management systems having signal transfer routing for use with electronic devices
US9739960B2 (en) Optical module heat dissipation structure and electronic product
CN106304754B (zh) 单板散热装置及方法
US20130050928A1 (en) Solid state disk assembly
CN210868472U (zh) 框式设备
CN107645889A (zh) 一种对单板上光模块进行散热的装置及方法
JP6432623B2 (ja) 積層モジュール、積層方法、冷却給電機構、積層モジュール搭載基板
CN222965440U (zh) 光模块冷板式液冷组件及网络交换设备
US8300403B2 (en) Computer system and heat sink
CN106612602A (zh) 散热结构和单板扩展散热方法
US20240179877A1 (en) Angled and stepped faceplate for telecommunications and networking shelf and circuit packs
CN120669358A (zh) 光模块冷板式液冷组件及网络交换设备
CN107425154B (zh) 电池模块
CN102761347B (zh) 嵌入式机载数据链终端
US10849223B2 (en) Multi-socket server assembly
CN220872729U (zh) 通讯组件及其散热屏蔽模组
CN220402224U (zh) 直触式散热模块
CN215934955U (zh) 一种相机

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19897734

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2019897734

Country of ref document: EP

Effective date: 20210719