WO2020135174A1 - 天线结构及高频多频段无线通信终端 - Google Patents

天线结构及高频多频段无线通信终端 Download PDF

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Publication number
WO2020135174A1
WO2020135174A1 PCT/CN2019/126194 CN2019126194W WO2020135174A1 WO 2020135174 A1 WO2020135174 A1 WO 2020135174A1 CN 2019126194 W CN2019126194 W CN 2019126194W WO 2020135174 A1 WO2020135174 A1 WO 2020135174A1
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WO
WIPO (PCT)
Prior art keywords
sheet
coupling
radio frequency
accommodating groove
antenna structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/126194
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English (en)
French (fr)
Inventor
黄奂衢
王义金
简宪静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to JP2021538023A priority Critical patent/JP7246490B2/ja
Priority to KR1020217022955A priority patent/KR102554581B1/ko
Priority to EP19905339.8A priority patent/EP3905441A4/en
Publication of WO2020135174A1 publication Critical patent/WO2020135174A1/zh
Priority to US17/357,197 priority patent/US11962099B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/10—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
    • H01Q5/28—Arrangements for establishing polarisation or beam width over two or more different wavebands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/378—Combination of fed elements with parasitic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration

Definitions

  • the present disclosure relates to the field of communication technology, and in particular, to an antenna structure and a high-frequency multi-band wireless communication terminal.
  • millimeter-wave technology and applications will play a key role, Therefore, millimeter-wave antennas and designs are gradually introduced into mobile terminals, such as mobile phones, tablets, and even laptop computers.
  • the design and performance of millimeter wave antennas has become a hot topic for related antenna engineers and electromagnetic researchers.
  • the mainstream millimeter wave antenna solutions are often in the form of independent package antennas (AntP), which are often associated with existing antennas, such as cellular antennas and non-cellular antennas.
  • existing antennas such as cellular antennas and non-cellular antennas.
  • the available space of the existing antenna will be squeezed in disguise, which will cause the deterioration of the antenna performance, and will easily increase the overall size of the system and reduce the overall competitiveness of the product.
  • the embodiments of the present disclosure provide an antenna structure and a high-frequency multi-band wireless communication terminal, to solve the problem that the antenna in the related art occupies too much space on the terminal, and is difficult to be compatible with the appearance design of a product with a high proportion of metal coverage .
  • an embodiment of the present disclosure provides an antenna structure, including:
  • a metal plate, the metal plate is provided with a first accommodating groove
  • An antenna unit the antenna unit includes a radiation sheet and a first coupling sheet
  • a radio frequency module the radio frequency module is provided on the first side of the metal plate, and the radio frequency module is electrically connected to the radiation sheet;
  • the radiation sheet and the first coupling sheet is placed in the first accommodating groove, the radiation sheet is insulated from the metal plate, and the first coupling sheet and the metal Board insulation, the radiation sheet is opposite to the first coupling sheet, the radiation sheet is insulated from the first coupling sheet, the first coupling sheet is located between the radiation sheet and the radio frequency module
  • the radiation plate is used to generate resonance in a first preset frequency band, and the first coupling plate is used to generate resonance in a second preset frequency band.
  • an embodiment of the present disclosure provides a high-frequency multi-band wireless communication terminal, including the antenna structure described above.
  • an accommodating groove is opened in the metal plate, and at least one of the radiating sheet and the coupling piece of the antenna unit is placed in the accommodating groove, and the radio frequency module electrically connected to the radiating sheet is provided on the metal plate Side, so as to achieve the purpose of integration on the metal plate, thereby reducing the space occupied by the antenna on the terminal.
  • FIG. 1 shows one of the schematic diagrams when the radiation sheet is disposed in the first accommodating groove in the embodiment of the present disclosure
  • FIG. 2 shows a second schematic diagram of the radiation sheet in the first accommodating groove in the embodiment of the present disclosure
  • FIG. 3 shows the third schematic diagram when the radiation sheet is disposed in the first accommodating groove in the embodiment of the present disclosure
  • FIG. 4 shows a schematic cross-sectional view along C-C in FIG. 3;
  • FIG. 5 shows one of the schematic diagrams when the first coupling piece is disposed on the radio frequency module in the embodiment of the present disclosure
  • FIG. 6 shows a partially enlarged view of the position circled by the dotted frame A in FIG. 5;
  • FIG. 7 shows a second schematic diagram of the first coupling plate when it is disposed on the radio frequency module in the embodiment of the present disclosure
  • FIG. 8 shows a partial square diagram of the position circled by the broken line frame in FIG. 7;
  • FIG. 10 is a schematic diagram showing that both the radiation sheet and the first coupling sheet are disposed in the first accommodating groove in the embodiment of the present disclosure
  • FIG. 11 shows the second schematic diagram of the connection between the feeding thimble and the radiating plate in the embodiment of the present disclosure
  • FIG. 12 is a schematic structural diagram of a radio frequency module in an embodiment of the present disclosure.
  • FIG. 13 shows a schematic diagram of the setting of the feed thimble on the radio frequency module in real time in the present disclosure
  • FIG. 14 is a schematic diagram showing the effect of assembling the radio frequency module on the surface of the metal plate in the embodiment of the present disclosure
  • FIG. 16 shows a second schematic diagram of the installation position of the antenna structure on the terminal housing according to the embodiment of the present disclosure.
  • FIG. 17 is a schematic diagram showing the distribution positions of the first position and the second position on the radiation sheet in the embodiment of the present disclosure.
  • An embodiment of the present disclosure provides an antenna structure, including:
  • the metal plate 1 is provided with a first accommodating groove 101; optionally, the depth of the first accommodating groove 101 is equal to the thickness of the metal plate 1, that is, the first accommodating groove 101 penetrates the metal plate 1 groove;
  • An antenna unit which includes a radiation sheet 201 and a first coupling sheet 202;
  • Radio frequency module the radio frequency module is provided on the first side of the metal plate 1, the radio frequency module is electrically connected to the radiating sheet 201; wherein, the first side is the opening side of the accommodating groove, when the first side of the metal plate 1 faces the inside of the terminal, The radio frequency module is set inside the terminal;
  • At least one of the radiation sheet 201 and the first coupling sheet 202 is placed in the first accommodating groove 101, the radiation sheet 201 is insulated from the metal plate 1, the first coupling sheet 202 is insulated from the metal plate 1, the radiation sheet 201 Located opposite to the first coupling sheet 202, the radiation sheet 201 is insulated from the first coupling sheet 202, the first coupling sheet 202 is located between the radiation sheet 201 and the radio frequency module, and the radiation sheet 201 is used to generate resonance in the first preset frequency band, The first coupling piece 202 is used to generate resonance in the second preset frequency band. Among them, the first coupling plate is used to generate a different operating frequency band than the radiation plate.
  • the accommodating groove is formed in the metal plate 1, and at least one of the radiating sheet 201 and the coupling sheet of the antenna unit is placed in the accommodating groove to electrically connect with the radiating sheet 201
  • the radio frequency module is installed on one side of the metal plate 1, so as to achieve the purpose of integrating the antenna structure on the metal plate 1, thereby reducing the space occupied by the antenna on the terminal.
  • the area of the radiation sheet 201 is less than or equal to the area of the first coupling sheet 202, then the first coupling sheet 202 is used to generate a low-frequency resonance signal, and the radiation sheet 201 is used to generate a high-frequency resonance signal, so that the antenna unit can work In multiple frequency bands.
  • first accommodating slots 101 there are a plurality of first accommodating slots 101, the plurality of first accommodating slots 101 are arranged at intervals, the antenna units are a plurality corresponding to the plurality of first accommodating slots 101, and the radiating sheet 201 of each antenna unit At least one of the first coupling piece 202 is placed in a receiving slot corresponding to the antenna unit.
  • an array antenna is composed of multiple antenna units, so that the antenna structure of the embodiment of the present disclosure can work in multiple frequency bands, thereby having better global roaming capabilities.
  • the manner in which the radiation sheet 201 and the first coupling sheet 202 of multiple antenna elements are integrated on the metal plate 1 is as follows:
  • a first insulating dielectric layer is provided in the first accommodating groove 101, and the radiation sheet 201 is disposed in the first insulating dielectric layer. That is, as shown in FIG. 1, a plurality of first accommodating grooves 101 are provided in the metal plate 1, each groove is provided with a radiating sheet 201, and a metal spacer structure is formed between the groove and the portion of the metal plate 1, Therefore, there is a certain interval between the grooves. Moreover, the radiation sheet 201 is disposed in the first accommodating groove 101, so the area of the radiation sheet 201 is smaller than the area of the groove. Therefore, the radiation sheet 201 and the metal plate 1 are insulated.
  • the first preset height (less than the first accommodating groove 101) may be filled in the first accommodating groove 101 first Depth), then place the radiation sheet 201 on the surface of the filled insulation medium, as shown in FIG. 2, and then fill the insulation medium again on the basis of FIG. 2, so that the insulation medium covers the radiation sheet 201, as shown in FIG. Show.
  • the first insulating dielectric layer filled in the first accommodating groove 101 may be flush with the outer surface of the metal plate 1 (that is, the surface on which the radio frequency module is not placed).
  • the radio frequency module has a first ground layer 304, the surface of the first ground layer 304 is covered with a second insulating dielectric layer 308, the first coupling sheet 202 is disposed on the second insulating dielectric layer 308, and the first coupling sheets 202 are spaced apart . That is, as shown in FIGS. 5 and 6, the first coupling plates 202 are distributed on the second insulating medium at intervals.
  • the radio frequency module shown in FIG. 5 is arranged on one side of the metal plate 1 shown in FIG. 3 (the specific assembly effect is shown in FIG. 14), so that the first coupling sheet 202 is arranged opposite to the radiation sheet 201, And the two are insulated.
  • the first coupling plate 202 is located between the radiation plate 201 and the first ground layer 304 of the radio frequency module, and the area of the first coupling plate 202 is greater than or equal to the area of the radiation plate 201, then the first coupling plate 202 is used to generate low frequency resonance Signal, the radiation sheet 201 is used to generate a high-frequency resonance signal, so that the antenna unit can work in multiple frequency bands.
  • the antenna structure of the embodiment of the present disclosure further includes: a metal member 303, the metal member 303 is disposed on the second insulating dielectric layer 308, and the metal member 303 is located between two adjacent first coupling plates 202, the metal The piece 303 is grounded, and the metal piece 303 is connected to the metal plate 1 to ground.
  • the metal member 303 may be electrically connected to the first ground layer 304 through a via hole or a through hole to realize the grounding of the metal member 303.
  • the metal piece 303 separates the plurality of first coupling pieces 202 from each other, and the metal pieces 303 spaced apart on the second insulating dielectric layer 308 are connected to the metal plate 1 to ground, so that between the adjacent first accommodating grooves 101
  • the metal plates 1 can form a space, which can reduce the coupling between adjacent antenna elements and improve the isolation between the antenna elements.
  • a third accommodating groove 302 is provided on the second insulating dielectric layer 308, the third accommodating groove 302 is located between two adjacent first coupling plates 202, and the depth of the third accommodating groove 302 is equal to the first The thickness of the two insulating dielectric layers 308, the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, and the metal plate 1 between the first accommodating grooves 101 is connected to the first ground layer 304 to ground .
  • the second accommodating groove 301 is used to accommodate the metal plate 1 between the first accommodating grooves 101, so that the radio frequency module can be more accurately positioned and embedded in the metal plate 1.
  • the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, it is connected to the first ground layer 304 of the radio frequency module to ground, so that the metal between the adjacent first accommodating grooves 101
  • the board 1 can be formed at intervals, thereby reducing the coupling between adjacent antenna units and improving the isolation between the antenna units.
  • the first accommodating groove 101 is provided with a first insulating dielectric layer, the radiation sheet 201 is provided on the first insulating dielectric layer, and the radiation sheet 201 protrudes from the surface of the first insulating dielectric layer by a first predetermined height; At this time, the fixing effect of the radiation in the first accommodating groove 101 is shown in FIG.
  • the first insulating dielectric layer filled in the first accommodating groove 101 may be connected to the outer surface of the metal plate 1 (that is, no radio frequency is placed The surface of the module is flush; the radio frequency module has a first ground layer 304, the surface of the first ground layer 304 is covered with a second insulating dielectric layer 308, and a plurality of antenna elements corresponding to multiple antenna elements are spaced apart on the second insulating dielectric layer 308
  • a second accommodating groove 301, each first coupling piece 202 is placed in the corresponding second accommodating groove 301, the difference between the depth of the second accommodating groove 301 and the thickness of the first coupling piece 202 is greater than or equal to the first The preset height; wherein, the radiation sheet 201 is located in the second accommodating groove 301.
  • the first coupling piece 202 is located in the insulating groove (ie, the second accommodating groove 301 ).
  • the difference between the depth of the second accommodating groove 301 and the thickness of the first coupling piece 202 is greater than or equal to the first preset height, that is, the difference between the depth of the second accommodating groove 301 and the thickness of the first coupling piece 202 Is greater than or equal to the height of the radiation sheet 201 protruding from the first insulating dielectric layer, so that when the RF module shown in FIG. 7 is placed on the side of the metal plate 1 shown in FIG. 2 (the specific assembly effect is shown in FIG.
  • the side wall of the second accommodating groove 301 is in contact with the surface of the first insulating dielectric layer in the first accommodating groove 101, but the radiation plate 201 and the first coupling plate 202 can maintain a certain separation distance without Electrical connection.
  • the first coupling plate 202 is located between the radiation plate 201 and the first ground layer 304 of the radio frequency module, the area of the first coupling plate 202 is greater than or equal to the area of the radiation plate 201, and the first coupling plate 202 is used to generate a low-frequency resonance signal
  • the radiator 201 is used to generate high-frequency resonance signals, so that the antenna unit can work in multiple frequency bands.
  • the antenna structure of the embodiment of the present disclosure further includes: a metal member 303, the metal member 303 is disposed on the second insulating dielectric layer 308, and the metal member 303 is located between two adjacent first coupling plates 202, the metal The piece 303 is grounded, and the metal piece 303 is in contact with the metal plate 1.
  • the metal piece 303 separates the plurality of first coupling sheets 202 from each other, and the metal pieces 303 spaced apart on the second insulating dielectric layer 308 are in contact with the metal plate 1 so that the metal piece 303 and the metal plate 1 are electrically connected, and When the metal piece 303 is grounded, the metal plate 1 is also grounded, so that the metal plate 1 between the adjacent first accommodating grooves 101 can form a space, which can further reduce the coupling between adjacent antenna units and improve the antenna The isolation between the units.
  • a third accommodating groove 302 is provided on the second insulating dielectric layer 308, the third accommodating groove 302 is located between two adjacent first coupling plates 202, and the depth of the third accommodating groove 302 is equal to the first The thickness of the two insulating dielectric layers 308, the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, and the metal plate 1 between the first accommodating grooves 101 is connected to the first ground layer 304 to ground .
  • the second accommodating groove 301 is used to accommodate the metal plate 1 between the first accommodating grooves 101, so that the radio frequency module can be more accurately positioned and embedded in the metal plate 1.
  • the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, it is connected to the first ground layer 304 of the radio frequency module to ground, so that the metal between the adjacent first accommodating grooves 101
  • the board 1 can be formed at intervals, thereby reducing the coupling between adjacent antenna units and improving the isolation between the antenna units.
  • a first insulating dielectric layer is provided in the first accommodating groove 101, and the radiation sheet 201 is disposed in the first insulating dielectric layer.
  • the first insulating dielectric layer filled in the first accommodating groove 101 may be flush with the outer surface of the metal plate 1 (that is, the surface on which the radio frequency module is not placed).
  • a first coupling sheet 202 is disposed in a first insulating medium in a first accommodating groove 101, and the first coupling sheet 202 and the radiation sheet 201 belonging to the same antenna unit are located in the same first accommodating chamber In the slot 101.
  • the radiating sheet 201 and the first coupling sheet 202 belonging to the same antenna unit are disposed in a first insulating dielectric layer in a first accommodating groove 101. It should be noted that, in order to clearly show that the first coupling sheet 202 and the radiation sheet 201 are both fixed in the first accommodating groove 101, the insulation of the first coupling sheet 202 and the radiation sheet 201 is not shown in FIG. Medium.
  • the radio frequency module has a first ground layer 304, and a surface of the first ground layer 304 is covered with a second insulating dielectric layer 308, and a third accommodating groove 302 and a third accommodating groove 302 are spaced on the second insulating dielectric layer 308
  • the depth is equal to the thickness of the second insulating dielectric layer 308, the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, and the metal plate 1 between the first accommodating groove 101 and the first
  • the ground layer 304 is connected to ground.
  • the second accommodating groove 301 is used to accommodate the metal plate 1 between the first accommodating grooves 101, so that the radio frequency module can be more accurately positioned and embedded in the metal plate 1.
  • the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, it is connected to the first ground layer 304 of the radio frequency module to ground, so that the metal between the adjacent first accommodating grooves 101
  • the board 1 can be formed at intervals, thereby reducing the coupling between adjacent antenna units and improving the isolation between the antenna units.
  • the radiating sheet 201 and the first coupling sheet 202 are integrated on the metal plate 1 in this way, the radiating sheet 201 and the first coupling sheet 202 can be provided as a part of the metal plate 1, that is, a certain Lay-out design in the area so that the metal plate 1 in the area can form multiple antenna units, so that part of the metal plate 1 serves as the antenna radiating sheet 201, which can increase the bandwidth of the antenna and cover multiple frequency bands.
  • the metal plate 1 may specifically be a part on the metal casing of the terminal, so that the arrangement of the antenna unit does not affect the metal texture of the terminal.
  • a second insulating dielectric layer 308 is provided on the radio frequency module, the first coupling sheet 202 is disposed within the second insulating dielectric layer 308, the first coupling sheets 202 are spaced apart, and the radiation sheet 201 is disposed In the second insulating dielectric layer 308, the radiation sheets 201 are arranged at intervals, and the radio frequency module is installed in the first accommodating groove.
  • both the radiation sheet 201 and the first coupling sheet 202 are provided on the radio frequency module.
  • the antenna structure of the embodiment of the present disclosure further includes: a metal member 303, the metal member 303 is disposed on the second insulating dielectric layer 308, and the metal member 303 is located between two adjacent first coupling plates 202, the metal The piece 303 is grounded, and the metal piece 303 is in contact with the metal plate 1.
  • the metal piece 303 separates the plurality of first coupling sheets 202 from each other, and the metal pieces 303 spaced apart on the second insulating dielectric layer 308 are in contact with the metal plate 1 so that the metal piece 303 and the metal plate 1 are electrically connected, and When the metal piece 303 is grounded, the metal plate 1 is also grounded, so that the metal plate 1 between the adjacent first accommodating grooves 101 can form a space, which can further reduce the coupling between adjacent antenna units and improve the antenna The isolation between the units.
  • the radio frequency module has a first ground layer 303, a second insulating dielectric layer 308 covers the first ground layer 304, a third receiving groove 302 is provided on the second insulating dielectric layer 308, and the third receiving groove 302 is located in the phase Between two adjacent first coupling plates 202, the depth of the third accommodating groove 302 is equal to the thickness of the second insulating dielectric layer 308, and the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302 Inside, and the metal plate 1 between the first accommodating grooves 101 is electrically connected to the first ground layer 304.
  • the second accommodating groove 301 is used to accommodate the metal plate 1 between the first accommodating grooves 101, so that the radio frequency module can be more accurately positioned and embedded in the metal plate 1.
  • the metal plate 1 between the first accommodating grooves 101 extends into the third accommodating groove 302, it is connected to the first ground layer 304 of the radio frequency module to ground, so that the metal between the adjacent first accommodating grooves 101
  • the board 1 can be formed at intervals, thereby reducing the coupling between adjacent antenna units and improving the isolation between the antenna units.
  • the surface of the metal piece 303 is provided with a thimble, and the thimble is connected to the metal plate 1 to ground; or the surface of the metal plate 1 between the adjacent first receiving grooves 101 is provided with a convex hull, the convex hull and the metal The piece 303 is connected to ground, so that the metal piece 303 and the metal plate 1 can be better electrically connected.
  • the antenna unit further includes a second coupling sheet 203, the second coupling sheet 203 is disposed opposite to the radiation sheet 201, the second coupling sheet 203 is insulated from the radiation sheet 201, and the second coupling sheet 203 is insulated from the metal plate 1,
  • the radiation sheet 201 is located between the second coupling sheet 203 and the first coupling sheet 202 (as shown in FIG. 11), wherein the second coupling sheet 203 is used to expand the bandwidth of the first preset frequency band, that is, the second coupling sheet 203 is used To expand the working bandwidth of the radiator.
  • the area of the second coupling sheet 203 is less than or equal to the area of the radiation sheet 201.
  • a second coupling sheet 203 can be added, and the added second coupling sheet 203 is located on the radiating sheet 201 away from the radio frequency The side of the module.
  • the added second coupling piece may be fixed in the first accommodating groove 101 on the metal plate 1.
  • the metal plate 1 is provided with a positioning slot 102, a plurality of first accommodating slots 101 communicate with the positioning slot 102, and the radio frequency module is installed in the positioning slot 102, thereby making the radio frequency module more accurate Ground to the metal plate 1.
  • the radio frequency module includes a radio frequency integrated circuit 310 and a power management integrated circuit 311, and the radio frequency integrated circuit 310 is electrically connected to the radiation sheet 201 and the power management integrated circuit 311, respectively.
  • a BTB connector Board-to-board Connectors 309 can also be provided on the radio frequency module for the intermediate frequency signal connection between the radio frequency module and the terminal main board.
  • the radio frequency integrated circuit 310 is electrically connected to the radiation sheet 201 of each antenna unit, so that the signal received by the radiation sheet 201 passes through the transmission line connected to each radiation sheet 201, Finally converged into the radio frequency integrated circuit 310.
  • the radio frequency module further includes a first ground layer 304, a second ground layer 305, and a third insulating dielectric layer 306, and the third insulating dielectric layer 306 is located between the first ground layer 304 and the second ground layer 305;
  • the integrated circuit 310 and the power management integrated circuit 311 are located on the second ground 305.
  • the radio frequency integrated circuit 310 is electrically connected to the power management integrated circuit 311 through the first trace, and the radio frequency integrated circuit 310 is electrically connected to the radiation sheet 201 through the second trace.
  • the first trace and the second trace are located in the third insulating dielectric layer 306. Wherein, placing the radio frequency integrated circuit 310 on the ground layer of the radio frequency module can minimize the loss of the antenna signal on the path.
  • the first ground layer 304 and the second ground layer 305 may be electrically connected through vias or through holes.
  • the first ground layer 304 of the RF module is connected to the inner side of the metal plate 1 (the side where the RF module is placed), so that an antenna unit can be formed
  • the antenna unit can be formed to increase the gain of the antenna unit, and can make the antenna unit less sensitive to the environment inside the system behind the metal plate 1, so that the terminal can integrate more devices and achieve more functions, thereby improving the product’s Competitiveness.
  • a feeding thimble 307 is provided on the radio frequency module, and the feeding thimble 307 is electrically connected to the radiation sheet 201.
  • the feeding thimble 307 can be integrated with the metal plate 1 or integrated with the radio frequency module, and can also be used as an independent discrete device for feeding in the feed signal.
  • the first coupling piece 202 is provided with a feeding hole, and the feeding thimble 307 is electrically connected to the radiation piece 201 through the feeding hole, and the diameter of the feeding hole is larger than the diameter of the feeding thimble 307 . That is, when the radiation sheet 201 is located between the first coupling sheet 202 and the radio frequency module, a feeding hole for passing through the feeding thimble 307 needs to be opened on the first coupling sheet 202.
  • the insulating dielectric layer for fixing the radiating sheet 201 and the first coupling sheet 202 is not shown in FIG. .
  • a feed hole needs to be opened in the first coupling sheet 202 so that the feed thimble 307 can pass through the feed hole It is electrically connected to the radiation sheet 201, wherein the diameter of the feeding hole is larger than the diameter of the feeding thimble 307.
  • the first coupling The insulating medium between the sheet 202 and the radiation sheet 201 is provided with a via 103 (as shown in FIG. 3 ), so that the feed thimble 307 can pass through the feed hole on the first radiation sheet 201 and the first coupling sheet 202 and the radiation
  • the via hole 103 on the insulating medium between the sheets 201 is electrically connected to the radiating sheet 201, wherein the diameter of the feeding hole is larger than the diameter of the feeding thimble 307.
  • the antenna unit of the embodiment of the present disclosure includes two coupling plates and one radiating plate 201
  • the insulating dielectric layer used to fix the radiation sheet 201 and the first coupling sheet 202 is not shown in FIG. .
  • the feeding thimble 307 is disposed on the first ground layer 304.
  • the feeding thimble 307 is located in the third insulating dielectric layer 306, and is electrically connected to the radio frequency integrated circuit 309 on the second ground layer 305 through the traces in the third insulating dielectric layer 306, and on the first ground layer 304
  • a first via hole is provided, and the diameter of the first via hole is larger than the diameter of the feed thimble 307, that is, the feed thimble 307 is located in the first via hole, but is not connected to the first ground layer 304 to ground.
  • the radiation sheet 201 and the first coupling sheet 202 are square, and the first accommodating groove 101 is adapted to the radiation sheet 201 and the first coupling sheet 202.
  • the radiation sheet 201 and the coupling sheet 202 are not limited to being square, but can also be provided in other shapes, such as a circle, a regular triangle, a regular pentagon, and a regular hexagon.
  • the radiation sheet 201 and the first coupling sheet 202 are arranged in parallel, and the line where the center of symmetry of the radiation sheet 201 and the symmetry center of the coupling sheet is perpendicular to the radiation sheet 201, so that the radiation sheet 201 and the first coupling sheet
  • the antenna unit formed by 202 has a symmetrical structure, so that the array antenna composed of the antenna unit can work in multiple frequency bands to have better roaming ability in the global millimeter wave band, and in the space symmetry or mapping direction when the beam is scanned Performance can be kept the same or close.
  • the positions where the radiation sheet 201 is electrically connected to the radio frequency module include a first position 801 and a second position 802.
  • the first position 801 is located on the first symmetry axis 701 of the square and is adjacent to the edge of the square ( That is, the shortest distance from the first position to the four sides of the square is less than the preset value)
  • the second position 802 is located on the second symmetry axis 702 of the square and is adjacent to the edge of the square (that is, the shortest distance from the second position to the four sides of the square is less than default value).
  • the first symmetry axis 701 and the second symmetry axis 702 are symmetry axes formed by folding opposite sides of a square.
  • the antenna unit in the embodiment of the present disclosure adopts the orthogonal feeding method, on the one hand, it can increase the wireless diversity connection capability of the antenna, reduce the probability of communication disconnection, and improve the communication effect and user experience; on the other hand, it can help multi-input Multiple output (multiple input, multiple output, MIMO function) to improve the data transmission rate.
  • multi-input Multiple output multiple input, multiple output, MIMO function
  • the radio frequency module is a millimeter wave radio frequency module.
  • the metal plate 1 in the embodiment of the present disclosure may be a part of the metal casing of the terminal, or a part of the radiator of the related art antenna on the terminal, for example, a radiator of the related art 2G/3G/4G/sub6G communication antenna Part of the antenna structure of the embodiment of the present disclosure can integrate the millimeter wave antenna into the 2G/3G/4G/sub 6G communication antenna in the related art, that is, the millimeter antenna is compatible with non-millimeter antennas in a metal frame or metal shell as the antenna Wave antenna, without affecting the communication quality of 2G/3G/4G/sub 6G communication antenna.
  • the embodiments of the present disclosure also provide a high-frequency multi-band wireless communication terminal, including the above-mentioned antenna structure.
  • the high-frequency multi-band wireless communication terminal has a housing, at least part of the housing is a metal back cover, and the metal plate 1 is a part of the metal back cover or metal frame. That is, the metal plate 1 may specifically be a part on the metal casing of the terminal, so that the antenna unit setting does not affect the metal texture of the terminal, that is, it is better compatible with products with a high metal coverage ratio.
  • the housing of the high-frequency multi-band wireless communication terminal includes a first frame 601, a second frame 602, a third frame 603, a fourth frame 604, and a metal back cover 605.
  • the first to fourth frames surround a System ground 9, which may be composed of a printed circuit board (PCB), and/or a metal back cover, and/or an iron frame on the screen, etc.
  • the antenna structure 4 can be integrated on the metal frame surrounded by the dotted line in FIG. 16; or, as shown in FIG. 15, the above antenna structure 4 can be provided on the metal back cover 605 of the terminal, thereby improving the antenna signal Spatial coverage, and reduce the risk of performance degradation caused by the antenna being blocked to enhance the communication effect.

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Abstract

本公开提供了一种天线结构及高频多频段无线通信终端，该天线结构包括：金属板，金属板上开设有第一容置槽；天线单元，天线单元包括辐射片和第一耦合片；射频模块，射频模块设在金属板的第一侧，射频模块与辐射片电连接；其中，辐射片和第一耦合片中的至少一个置于第一容置槽内，辐射片与金属板绝缘设置，第一耦合片与金属板绝缘设置，辐射片与第一耦合片相对设置，辐射片与第一耦合片绝缘设置，第一耦合片位于辐射片与射频模块之间，辐射片用于产生第一预设频段的谐振，第一耦合片用于产生第二预设频段的谐振。

Description

天线结构及高频多频段无线通信终端
相关申请的交叉引用
本申请主张在2018年12月28日在中国提交的中国专利申请号No.201811629736.X的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种天线结构及高频多频段无线通信终端。
背景技术
随着第五代移动通信(5 th generation mobile networks，5G)世代的来临与即将发展，对于资料传输速率越来越快的无线通信需求，毫米波的技术与应用将扮演着关键性的角色，故毫米波的天线与设计逐渐地被引入移动终端上，如手机、平板，甚至是笔记本电脑。毫米波天线设计与性能因而成为相关天线工程师与电磁研究者的热点课题。
而相关技术中，主流的毫米波天线方案往往是独立封装天线(Antenna in Package，AiP)的形态，其与既存的天线，如蜂窝(cellular)天线，与非蜂窝(non-cellular)天线，常为分立设置，故会变相挤压既有天线的可得空间，而造成天线性能劣化，且易造成系统整体的体积尺寸的增加，而使产品整体竞争力下降。
发明内容
本公开的实施例提供了一种天线结构及高频多频段无线通信终端，以解决相关技术中的天线占据终端上过多空间的问题，与较难于兼容高比例金属覆盖的产品外观设计的问题。
第一方面，本公开的实施例提供了一种天线结构，包括：
金属板，所述金属板上开设有第一容置槽；
天线单元，所述天线单元包括辐射片和第一耦合片；
射频模块，所述射频模块设在所述金属板的第一侧，所述射频模块与所述辐射片电连接；
其中，所述辐射片和所述第一耦合片中的至少一个置于所述第一容置槽内，所述辐射片与所述金属板绝缘设置，所述第一耦合片与所述金属板绝缘设置，所述辐射片与所述第一耦合片相对设置，所述辐射片与所述第一耦合片绝缘设置，所述第一耦合片位于所述辐射片与所述射频模块之间，所述辐射片用于产生第一预设频段的谐振，所述第一耦合片用于产生第二预设频段的谐振。
第二方面，本公开的实施例提供了一种高频多频段无线通信终端，包括上述所述的天线结构。
本公开实施例的有益效果是：
本公开的实施例，在金属板上开设容置槽，并将天线单元的辐射片以及耦合片中的至少一个置于该容置槽内，将与辐射片电连接的射频模块设于金属板的一侧，从而达到将集成到金属板上的目的，进而减小了天线在终端上所占据的空间。
附图说明
图1表示本公开实施例中辐射片设置于第一容置槽中时的示意图之一；
图2表示本公开实施例中辐射片设置于第一容置槽中时的示意图之二；
图3表示本公开实施例中辐射片设置于第一容置槽中时的示意图之三；
图4表示图3中沿C-C的剖面示意图；
图5表示本公开实施例中第一耦合片设置于射频模块上时的示意图之一；
图6表示图5中A虚线框所圈位置的局部放大图；
图7表示本公开实施例中第一耦合片设置于射频模块上时的示意图之二；
图8表示图7中B虚线框所圈位置的局部方大图；
图9表示本公开实施例中馈电顶针与辐射片的连接示意图之一；
图10表示本公开实施例中辐射片和第一耦合片均设置在第一容置槽中的示意图；
图11表示本公开实施例中馈电顶针与辐射片的连接示意图之二；
图12表示本公开实施例中射频模块的结构示意图；
图13表示本公开实时中馈电顶针在射频模块上的设置示意图；
图14表示本公开实施例中射频模块装配到金属板表面的效果示意图；
图15表示本公开实施例的天线结构在终端壳体上的设置位置示意图之一；
图16表示本公开实施例的天线结构在终端壳体上的设置位置示意图之二。
图17表示本公开实施例中第一位置和第二位置在辐射片上的分布位置示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开的实施例提供了一种天线结构，包括：
金属板1，金属板1上开设有第一容置槽101；可选地，该第一容置槽101的深度等于金属板1的厚度，即第一容置槽101为穿通金属板1的槽；
天线单元，天线单元包括辐射片201和第一耦合片202；
射频模块，射频模块设在金属板1的第一侧，射频模块与辐射片201电连接；其中，第一侧为容置槽的开口侧，当金属板1的第一侧朝向终端内侧时，射频模块则设置在终端的内部；
其中，辐射片201和第一耦合片202中的至少一个置于第一容置槽101内，辐射片201与金属板1绝缘设置，第一耦合片202与金属板1绝缘设置，辐射片201与第一耦合片202相对设置，辐射片201与第一耦合片202绝缘设置，第一耦合片202位于辐射片201与射频模块之间，辐射片201用于产生第一预设频段的谐振，第一耦合片202用于产生第二预设频段的谐振。其中，第一耦合片用于产生与辐射片不同的工作频带。
根据本公开实施例的天线结构，通过在金属板1上开设容置槽，并将天 线单元的辐射片201以及耦合片中的至少一个置于该容置槽内，将与辐射片201电连接的射频模块设于金属板1的一侧，从而达到将天线结构集成到金属板1上的目的，进而减小了天线在终端上所占据的空间。
可选地，辐射片201的面积小于或等于第一耦合片202的面积，则第一耦合片202用于产生低频谐振信号，辐射片201用于产生高频谐振信号，从而使得天线单元可以工作在多频段。
可选地，第一容置槽101为多个，多个第一容置槽101间隔设置，天线单元为与多个第一容置槽101对应的多个，每一个天线单元的辐射片201和第一耦合片202中的至少一个置于对应于天线单元的容置槽内。
其中，由多个天线单元组成阵列天线，从而使得本公开实施例的天线结构可工作在多频段，从而具有更好的全球漫游能力。
另外，对于多个天线单元的辐射片201和第一耦合片202集成在金属板1上的方式，具体如下：
方式一：
可选地，第一容置槽101内设有第一绝缘介质层，辐射片201设置于第一绝缘介质层内。即如图1所示，在金属板1开设有多个第一容置槽101，每个槽内部设置一个辐射片201，而槽与槽之间的金属板1的部分则形成金属间隔结构，故槽与槽间具有一定间隔。并且辐射片201设置于第一容置槽101内，因而辐射片201的面积小于槽的面积，因此，辐射片201与金属板1之间绝缘设置。
其中，在将辐射片201设置在第一容置槽101中的第一绝缘介质层内部时，可首先在第一容置槽101内填充第一预设高度(小于第一容置槽101的深度)的绝缘介质，然后将辐射片201放置在填充的绝缘介质表面，如图2所示，进而在图2的基础上再次填充绝缘介质，使得绝缘介质将辐射片201覆盖，如图3所示。其中，在第一容置槽101中填充的第一绝缘介质层可与金属板1的外侧表面(即未放置射频模块的表面)齐平。
可选地，射频模块具有第一地层304，第一地层304的表面覆盖有第二绝缘介质层308，第一耦合片202设置在第二绝缘介质层308上，且第一耦合片202间隔设置。即如图5和6所示，第一耦合片202间隔分布在第二绝 缘介质上。
由上述可知，将图5所示的射频模块设置于图3所示的金属板1的一侧(具体装配效果如图14所示)，则使得第一耦合片202与辐射片201相对设置，且二者绝缘。此时，第一耦合片202位于辐射片201与射频模块的第一地层304之间，第一耦合片202的面积大于或等于辐射片201的面积，则第一耦合片202用于产生低频谐振信号，辐射片201用于产生高频谐振信号，从而使得天线单元可以工作在多频段。
可选地，本公开实施例的天线结构还包括：金属件303，金属件303设在第二绝缘介质层308上，且金属件303位于相邻的两个第一耦合片202之间，金属件303接地，金属件303与金属板1连接接地。其中，金属件303可以通过过孔或通孔与第一地层304电连接，来实现金属件303的接地。
其中，金属件303将多个第一耦合片202彼此隔开，在第二绝缘介质层308上间隔设置的金属件303与金属板1连接接地，从而使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
可选地，第二绝缘介质层308上设置有第三容置槽302，第三容置槽302位于相邻的两个第一耦合片202之间，第三容置槽302的深度等于第二绝缘介质层308的厚度，第一容置槽101之间的金属板1伸入第三容置槽302内，且第一容置槽101之间的金属板1与第一地层304连接接地。
其中，第二容置槽301用于容纳第一容置槽101之间的金属板1，从而使得射频模块可以更加精准地定位嵌入金属板1中。另外，第一容置槽101之间的金属板1伸入到第三容置槽302中后，与射频模块的第一地层304连接接地，使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
方式二：
可选地，第一容置槽101内设有第一绝缘介质层，辐射片201设于第一绝缘介质层，且辐射片201从第一绝缘介质层的表面伸出第一预设高度；此时，辐射在第一容置槽101的固定效果如图2所示；其中，在第一容置槽101中填充的第一绝缘介质层可与金属板1的外侧表面(即未放置射频模块的表 面)齐平；所述射频模块具有第一地层304，第一地层304的表面覆盖有第二绝缘介质层308，第二绝缘介质层308上间隔设置有与多个天线单元对应的多个第二容置槽301，每个第一耦合片202置于对应的第二容置槽301内，第二容置槽301的深度与第一耦合片202的厚度之差大于或等于第一预设高度；其中，辐射片201位于第二容置槽301内。
即如图7和图8所示，第一耦合片202位于绝缘槽(即第二容置槽301)内。其中，设置第二容置槽301的深度与第一耦合片202的厚度之差大于或等于第一预设高度，即使得第二容置槽301的深度与第一耦合片202的厚度之差大于或等于辐射片201伸出第一绝缘介质层的高度，从而在将图7所示的射频模块放置于图2所示的金属板1的一侧(具体装配效果如图14所示)时，第二容置槽301的侧壁与第一容置槽101内的第一绝缘介质层的表面抵接，而辐射片201与第一耦合片202却可保持一定的间隔距离，而不会电连接。此时，第一耦合片202位于辐射片201与射频模块的第一地层304之间，第一耦合片202的面积大于或等于辐射片201的面积，第一耦合片202用于产生低频谐振信号，辐射片201用于产生高频谐振信号，从而使得天线单元可以工作在多频段。
可选地，本公开实施例的天线结构还包括：金属件303，金属件303设在第二绝缘介质层308上，且金属件303位于相邻的两个第一耦合片202之间，金属件303接地，金属件303与金属板1接触。
其中，金属件303将多个第一耦合片202彼此隔开，在第二绝缘介质层308上间隔设置的金属件303与金属板1接触，从而使得金属件303与金属板1电连接，进而在金属件303接地时，使得金属板1也接地，从而使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
可选地，第二绝缘介质层308上设置有第三容置槽302，第三容置槽302位于相邻的两个第一耦合片202之间，第三容置槽302的深度等于第二绝缘介质层308的厚度，第一容置槽101之间的金属板1伸入第三容置槽302内，且第一容置槽101之间的金属板1与第一地层304连接接地。
其中，第二容置槽301用于容纳第一容置槽101之间的金属板1，从而 使得射频模块可以更加精准地定位嵌入金属板1中。另外，第一容置槽101之间的金属板1伸入到第三容置槽302中后，与射频模块的第一地层304连接接地，使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
方式三
可选地，第一容置槽101内设有第一绝缘介质层，辐射片201设置于第一绝缘介质层内。其中，在第一容置槽101中填充的第一绝缘介质层可与金属板1的外侧表面(即未放置射频模块的表面)齐平。
可选地，一个第一耦合片202设置于一个第一容置槽101内的第一绝缘介质中，且属于同一个天线单元的第一耦合片202与辐射片201位于同一个第一容置槽101内。
即如图10所示，属于同一个天线单元的辐射片201与第一耦合片202设置在一个第一容置槽101中的第一绝缘介质层内。其中，需要注意的是，为了清楚地表示第一耦合片202和辐射片201均固定在第一容置槽101中，在图10中并未画出将第一耦合片202和辐射片201绝缘的介质。
可选地，射频模块具有第一地层304，第一地层304的表面上覆盖第二绝缘介质层308，第二绝缘介质层308上间隔设置有第三容置槽302，第三容置槽302的深度等于第二绝缘介质层308的厚度，第一容置槽101之间的金属板1伸入第三容置槽302内，且第一容置槽101之间的金属板1与第一地层304连接接地。
其中，第二容置槽301用于容纳第一容置槽101之间的金属板1，从而使得射频模块可以更加精准地定位嵌入金属板1中。另外，第一容置槽101之间的金属板1伸入到第三容置槽302中后，与射频模块的第一地层304连接接地，使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
另外，当辐射片201和第一耦合片202采用此种方式集成在金属板1上时，可设置辐射片201和第一耦合片202为金属板1的一部分，即在金属板1上的一定区域内进行铺层设计，使得该区域内的金属板1可以形成多个天线单元，从而使得部分金属板1作为天线的辐射片201，从而可以提升天线 的带宽，覆盖多个频段。其中，该金属板1具体可为终端的金属外壳上的一部分，从而可以使得天线单元的设置不影响终端的金属质感。
方式四
可选地，天线单元为多个，射频模块上设置有第二绝缘介质层308，第一耦合片202设置在第二绝缘介质层308内，且第一耦合片202间隔设置，辐射片201设置在第二绝缘介质层308内，且辐射片201间隔设置，射频模块安装在所述第一容置槽内。
即辐射片201与第一耦合片202均设置在射频模块上。
可选地，本公开实施例的天线结构还包括：金属件303，金属件303设在第二绝缘介质层308上，且金属件303位于相邻的两个第一耦合片202之间，金属件303接地，金属件303与金属板1接触。
其中，金属件303将多个第一耦合片202彼此隔开，在第二绝缘介质层308上间隔设置的金属件303与金属板1接触，从而使得金属件303与金属板1电连接，进而在金属件303接地时，使得金属板1也接地，从而使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
可选地，射频模块具有第一地层303，第二绝缘介质层308覆盖在第一地层304上，第二绝缘介质层308上设置有第三容置槽302，第三容置槽302位于相邻的两个第一耦合片202之间，第三容置槽302的深度等于第二绝缘介质层308的厚度，第一容置槽101之间的金属板1伸入第三容置槽302内，且第一容置槽101之间的金属板1与第一地层304电连接。
其中，第二容置槽301用于容纳第一容置槽101之间的金属板1，从而使得射频模块可以更加精准地定位嵌入金属板1中。另外，第一容置槽101之间的金属板1伸入到第三容置槽302中后，与射频模块的第一地层304连接接地，使得相邻第一容置槽101之间的金属板1可以形成间隔地，进而可以减小相邻天线单元之间的耦合，提升天线单元之间的隔离度。
此外，可选地，上述金属件303的表面设置有顶针，顶针与金属板1连接接地；或者相邻第一容置槽101之间的金属板1的表面设置有凸包，凸包与金属件303连接接地，从而使得金属件303与金属板1之间可以更好地电 连接。
可选地，天线单元还包括第二耦合片203，第二耦合片203与辐射片201相对设置，第二耦合片203与辐射片201绝缘设置，第二耦合片203与金属板1绝缘设置，辐射片201位于第二耦合片203与第一耦合片202之间(如图11所示)，其中，第二耦合片203用于拓展第一预设频段的带宽，即第二耦合片203用于拓展辐射片的工作带宽。可选地，第二耦合片203的面积小于或等于辐射片201的面积。
其中，无论第一耦合片202与辐射片201采用上述哪一种方式集成到金属板1上，都可以增加第二耦合片203，并设置增加的第二耦合片203位于辐射片201背离于射频模块的一侧。具体地，当第一耦合片202与辐射片201采用上述方式四集成在金属板1上时，增加的第二耦合片可以固定在金属板1上的第一容置槽101中。
可选地，如图4所示，金属板1上开设有定位槽102，多个第一容置槽101与定位槽102连通，射频模块安装在定位槽102内，从而使得射频模块可以更加精准地安装到金属板1上。
可选地，如图12所示，射频模块包括射频集成电路310和电源管理集成电路路311，射频集成电路310分别与辐射片201和电源管理集成电路311电连接。其中，射频模块上还可设置BTB连接器(Board-to-board Connectors，板对板连接器)309，用于射频模块与终端主板间的中频信号连接。其中，本公开的实施例包括多个天线单元时，射频集成电路310与每一个天线单元的辐射片201电连接，从而使得辐射片201接收到的信号经由与每一个辐射片201相连的传输线，最后汇聚到射频集成电路310内。
进一步地，如图12所示，射频模块还包括第一地层304、第二地层305、第三绝缘介质层306，第三绝缘介质层306位于第一地层304和第二地层305之间；射频集成电路310和电源管理集成电路路311位于第二地层305上，射频集成电路310通过第一走线与电源管理集成电路路311电连接，射频集成电路310通过第二走线与辐射片201电连接，第一走线和第二走线位于第三绝缘介质层306内。其中，将射频集成电路310置于射频模块的地层上，可最大降低天线信号在通路上的损耗。另外，第一地层304和第二地层305 可以通过过孔或通孔电连接。
其中，需要注意的是，将上述射频模块设置于金属板1的一侧后，射频模块的第一地层304与金属板1的内侧面(放置射频模块的这一面)连接，这样可以形成天线单元的反射器，以提升天线单元的增益，并且可以使得天线单元对金属板1后的系统内的环境较不敏感，从而使得终端可以集成更多的器件，实现更多的功能，从而提升产品的竞争力。
可选地，射频模块上设置有馈电顶针307，馈电顶针307与辐射片201电连接。其中，需要注意的是，馈电顶针307可以与金属板1一体化集成设计，也可以与射频模块一体化集成设计，也可作为独立的分立器件用于馈源信号的馈入。
更进一步地，如图9所示，第一耦合片202上设置有馈电孔，馈电顶针307穿过馈电孔与辐射片201电连接，馈电孔的直径大于馈电顶针307的直径。即当辐射片201位于第一耦合片202与射频模块之间时，则需要在第一耦合片202上开设用于穿过馈电顶针307的馈电孔。其中，需要注意的是，为了更清楚地示意馈电顶针307与辐射片201之间的连接方式，在图9中并未画出用于固定辐射片201和第一耦合片202的绝缘介质层。
具体地，当辐射片201和第一耦合片202采用上述方式二集成在金属板1上时，还需要在第一耦合片202上开设馈电孔，使得馈电顶针307可以穿过馈电孔与辐射片201电连接，其中，馈电孔的直径大于馈电顶针307的直径。
具体地，当辐射片201和第一耦合片202采用上述方式一或者方式三集成在金属板1上时，除了需要在第一耦合片202上开设馈电孔之外，还需要在第一耦合片202与辐射片201之间的绝缘介质上开设过孔103(如图3所示)，使得馈电顶针307可以穿过第一辐射片201上的馈电孔以及第一耦合片202与辐射片201之间的绝缘介质上的过孔103后，与辐射片201电连接，其中，馈电孔的直径大于馈电顶针307的直径。
如图11所示，当本公开实施例的天线单元包括两个耦合片和一个辐射片201时，也需要在位于辐射片201与射频模块之间的耦合片上开设馈电孔，使得馈电顶针307可以穿过馈电孔与辐射片201电连接，而馈电顶针307与 耦合片不连接接地。其中，需要注意的是，为了更清楚地示意馈电顶针307与辐射片201之间的连接方式，在图11中并未画出用于固定辐射片201和第一耦合片202的绝缘介质层。
此外，对于馈电顶针307在射频模块上的具体设置方式，可如图13所示，馈电顶针307设置于第一地层304上。具体地，馈电顶针307位于第三绝缘介质层306内，并通过第三绝缘介质层306内的走线，与位于第二地层305上的射频集成电路309电连接，且第一地层304上设置有第一过孔，第一过孔的直径大于馈电顶针307的直径，即馈电顶针307位于第一过孔内，但不与第一地层304相连接接地。
可选地，辐射片201和第一耦合片202呈正方形，第一容置槽101与辐射片201和第一耦合片202适配。由此，可以利于将辐射片201和第一耦合片202安装在第一容置槽101内。其中，可以理解的是，辐射片201与耦合片并不局限于为正方形，还可设置为其他形状，如圆形，正三角形，正五边形，正六边形等。
可选地，辐射片201和第一耦合片202平行设置，且辐射片201的对称中心和耦合片的对称中心所在的直线垂直于辐射片201，从而使得由该辐射片201和第一耦合片202构成的天线单元为对称结构，从而使得由该天线单元组成的阵列天线可工作在多频段，以有更好的全球毫米波段的漫游能力，且在波束扫描时在空间的对称或映射方向上性能可保持相同或接近。
更进一步地，如图17所示，辐射片201与射频模块电连接的位置包括第一位置801和第二位置802，第一位置801位于正方形的第一对称轴701上且邻近正方形的边沿(即第一位置到正方形的四边中的最短距离小于预设值)，第二位置802位于正方形的第二对称轴702上且邻近正方形的边沿(即第二位置到正方形的四边中的最短距离小于预设值)。其中，第一对称轴701和第二对称轴702为正方形相对的两边相对折叠形成的对称轴。即本公开实施例中的天线单元采用正交馈电的方式，一方面可增加天线的无线分集连接能力，减少通信断线的机率，提升通信效果和用户体验；另一方面可有助多输入多输出(multiple input multiple output，MIMO功能)，以提升数据的传输速率。
可选地，射频模块为毫米波射频模块。
此外，本公开实施例中的金属板1可为终端的金属外壳的一部分，或者为终端上相关技术天线的辐射体的一部分，例如为相关技术的2G/3G/4G/sub6G通信天线的辐射体的一部分，则本公开实施例的天线结构可将毫米波天线融入到相关技术中的2G/3G/4G/sub 6G通信天线中，即让毫米天线兼容在金属框或金属壳作为天线的非毫米波天线内，而不影响2G/3G/4G/sub 6G通信天线的通信质量。
本公开的实施例还提供了一种高频多频段无线通信终端，包括上述的天线结构。
其中可选地，高频多频段无线通信终端具有壳体，至少部分壳体为金属背盖，金属板1为金属背盖或金属边框的一部分。即金属板1具体可为终端的金属外壳上的一部分，从而可以使得天线单元的设置不影响终端的金属质感，即较好地兼容在高金属覆盖比例的产品内。
例如图16所示，高频多频段无线通信终端的壳体包括第一边框601、第二边框602、第三边框603、第四边框604和金属背盖605，第一至第四边框包围一系统地9，该系统地9可以由印刷电路板(printed circuit board，PCB)，和/或金属背盖，和/或屏上的铁框等组成。其中，天线结构4可以集成在图16中虚线所圈定的金属框上；或者，如图15所示，上述的天线结构4，可以设置在终端的金属背盖605上，从而可以提升天线信号的空间覆盖，并且减小天线被遮挡造成性能劣化的风险，以增强通信效果。
以上是本公开的可选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (26)

  1. 一种天线结构，包括：
    金属板，所述金属板上开设有第一容置槽；
    天线单元，所述天线单元包括辐射片和第一耦合片；
    射频模块，所述射频模块设在所述金属板的第一侧，所述射频模块与所述辐射片电连接；
    其中，所述辐射片和所述第一耦合片中的至少一个置于所述第一容置槽内，所述辐射片与所述金属板绝缘设置，所述第一耦合片与所述金属板绝缘设置，所述辐射片与所述第一耦合片相对设置，所述辐射片与所述第一耦合片绝缘设置，所述第一耦合片位于所述辐射片与所述射频模块之间，所述辐射片用于产生第一预设频段的谐振，所述第一耦合片用于产生第二预设频段的谐振。
  2. 根据权利要求1所述的天线结构，其中，所述第一容置槽为多个，多个所述第一容置槽间隔设置，所述天线单元为与多个所述第一容置槽对应的多个，每一个所述天线单元的所述辐射片和所述第一耦合片中的至少一个置于对应于所述天线单元的所述容置槽内。
  3. 根据权利要求2所述的天线结构，其中，所述第一容置槽内设有第一绝缘介质层，所述辐射片设置于所述第一绝缘介质层内。
  4. 根据权利要求3所述的天线结构，其中，所述射频模块具有第一地层，所述第一地层的表面覆盖有第二绝缘介质层，所述第一耦合片设置在所述第二绝缘介质层上，且所述第一耦合片间隔设置。
  5. 根据权利要求2所述的天线结构，其中，所述第一容置槽内设有第一绝缘介质层，所述辐射片设于所述第一绝缘介质层，且所述辐射片从所述第一绝缘介质层的表面伸出第一预设高度；
    所述射频模块具有第一地层，所述第一地层的表面覆盖有第二绝缘介质层，所述第二绝缘介质层上间隔设置有与多个所述天线单元对应的多个第二容置槽，每个所述第一耦合片置于对应的所述第二容置槽内，所述第二容置槽的深度与所述第一耦合片的厚度之差大于或等于所述第一预设高度；
    其中，所述辐射片位于所述第二容置槽内。
  6. 根据权利要求4或5所述的天线结构，还包括：金属件，所述金属件设在所述第二绝缘介质层上，且所述金属件位于相邻的两个所述第一耦合片之间，所述金属件接地，所述金属件与所述金属板连接接地。
  7. 根据权利要求6所述的天线结构，其中，
    所述金属件的表面设置有顶针，所述顶针与所述金属板连接接地；或者
    相邻所述第一容置槽之间的金属板的表面设置有凸包，所述凸包与所述金属件连接接地。
  8. 根据权利要求4或5所述的天线结构，其中，所述第二绝缘介质层上设置有第三容置槽，所述第三容置槽位于相邻的两个所述第一耦合片之间，所述第三容置槽的深度等于所述第二绝缘介质层的厚度，所述第一容置槽之间的金属板伸入所述第三容置槽内，且所述第一容置槽之间的金属板与所述第一地层连接接地。
  9. 根据权利要求3所述的天线结构，其中，一个所述第一耦合片设置于一个所述第一容置槽内的所述第一绝缘介质中，且属于同一个所述天线单元的所述第一耦合片与所述辐射片位于同一个所述第一容置槽内。
  10. 根据权利要求9所述的天线结构，其中，所述射频模块具有第一地层，所述第一地层的表面上覆盖第二绝缘介质层，所述第二绝缘介质层上间隔设置有第三容置槽，所述第三容置槽的深度等于所述第二绝缘介质层的厚度，所述第一容置槽之间的金属板伸入所述第三容置槽内，且所述第一容置槽之间的金属板与所述第一地层连接接地。
  11. 根据权利要求1所述的天线结构，其中，所述天线单元为多个，所述射频模块上设置有第二绝缘介质层，所述第一耦合片设置在所述第二绝缘介质层内，且所述第一耦合片间隔设置，所述辐射片设置在所述第二绝缘介质层内，且所述辐射片间隔设置，所述射频模块安装在所述第一容置槽内。
  12. 根据权利要求11所述的天线结构，还包括金属件，所述金属件设在所述第二绝缘介质层上，且所述金属件位于相邻的两个所述第一耦合片之间，所述金属件接地，所述金属件与所述金属板接触。
  13. 根据权利要求11所述的天线结构，其中，所述射频模块具有第一地 层，所述第二绝缘介质层覆盖在所述第一地层上，所述第二绝缘介质层上设置有第三容置槽，所述第三容置槽位于相邻的两个第一耦合片之间，所述第三容置槽的深度等于所述第二绝缘介质层的厚度，所述第一容置槽之间的金属板伸入所述第三容置槽内，且所述第一容置槽之间的金属板与所述第一地层电连接。
  14. 根据权利要求1至13中任一项所述的天线结构，其中，所述天线单元还包括第二耦合片，所述第二耦合片与所述辐射片相对设置，所述第二耦合片与所述辐射片绝缘设置，所述第二耦合片与所述金属板绝缘设置，所述辐射片位于所述第二耦合片与所述第一耦合片之间，所述第二耦合片用于拓展所述第一预设频段的带宽。
  15. 根据权利要求2所述的天线结构，其中，所述金属板上开设有定位槽，多个所述第一容置槽与所述定位槽连通，所述射频模块安装在所述定位槽内。
  16. 根据权利要求1所述的天线结构，其中，所述射频模块包括射频集成电路和电源管理集成电路，所述射频集成电路分别与所述辐射片和所述电源管理集成电路电连接。
  17. 根据权利要求16所述的天线结构，其中，所述射频模块还包括第一地层、第二地层、第三绝缘介质层，所述第三绝缘介质层位于所述第一地层和所述第二地层之间；
    所述射频集成电路和所述电源管理集成电路位于所述第二地层上，
    所述射频集成电路通过第一走线与所述电源管理集成电路电连接，所述射频集成电路通过第二走线与所述辐射片电连接，所述第一走线和所述第二走线位于所述第三绝缘介质层内。
  18. 根据权利要求3至10中任一项所述的天线结构，其中，所述射频模块上设置有馈电顶针，所述馈电顶针与所述辐射片电连接。
  19. 根据权利要求18所述的天线结构，其中，所述第一耦合片上设置有馈电孔，所述馈电顶针穿过所述馈电孔与所述辐射片电连接，所述馈电孔的直径大于所述馈电顶针的直径。
  20. 根据权利要求1所述的天线结构，其中，所述辐射片和所述第一耦合片呈正方形，所述第一容置槽与所述辐射片和所述第一耦合片适配。
  21. 根据权利要求20所述的天线结构，其中，所述辐射片和所述第一耦合片平行设置，且所述辐射片的对称中心和所述第一耦合片的对称中心所在的直线垂直于所述辐射片。
  22. 根据权利要求20所述的天线结构，其中，所述辐射片与所述射频模块电连接的位置包括第一位置和第二位置，所述第一位置位于所述正方形的第一对称轴上且邻近所述正方形的边沿，所述第二位置位于所述正方形的第二对称轴上且邻近所述正方形的边沿，所述第一对称轴和所述第二对称轴为所述正方形相对的两边相对折叠形成的对称轴。
  23. 根据权利要求1所述的天线结构，其中，所述辐射片的面积小于或等于所述第一耦合片的面积。
  24. 根据权利要求1所述的天线结构，其中，所述射频模块为毫米波射频模块。
  25. 一种高频多频段无线通信终端，包括如权利要求1至24中任一项所述的天线结构。
  26. 根据权利要求25所述的高频多频段无线通信终端，具有壳体，至少部分所述壳体为金属背盖或金属边框，所述金属板为所述金属背盖或所述金属边框的一部分。
PCT/CN2019/126194 2018-12-28 2019-12-18 天线结构及高频多频段无线通信终端 Ceased WO2020135174A1 (zh)

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