WO2020155900A1 - 相变散热装置 - Google Patents

相变散热装置 Download PDF

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Publication number
WO2020155900A1
WO2020155900A1 PCT/CN2019/125969 CN2019125969W WO2020155900A1 WO 2020155900 A1 WO2020155900 A1 WO 2020155900A1 CN 2019125969 W CN2019125969 W CN 2019125969W WO 2020155900 A1 WO2020155900 A1 WO 2020155900A1
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WO
WIPO (PCT)
Prior art keywords
phase change
heat
condensation
cavity
condensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/125969
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English (en)
French (fr)
Inventor
李纯
胡广帆
姚春红
马秋成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smarth Technology Ltd
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Smarth Technology Ltd
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Publication date
Application filed by Smarth Technology Ltd filed Critical Smarth Technology Ltd
Priority to JP2021544903A priority Critical patent/JP7603590B2/ja
Priority to EP19913546.8A priority patent/EP3907456A4/en
Priority to US17/426,278 priority patent/US20210392783A1/en
Publication of WO2020155900A1 publication Critical patent/WO2020155900A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Definitions

  • the invention belongs to the technical field of phase change heat dissipation devices, and in particular relates to a phase change heat dissipation device for electronic devices.
  • Phase change heat dissipation is an efficient heat dissipation method.
  • the principle is to use the phase change heat medium to boil and vaporize at a certain temperature to absorb heat, and then the vaporized gas is condensed and liquefied in other locations to release heat, thereby realizing heat transfer. Its heat transfer effect is good and it is widely used.
  • phase change heat sinks generally use heat pipes for phase change heat dissipation.
  • heat pipes have high heat transfer efficiency and good heat dissipation effects.
  • the common heat pipe radiator is mainly composed of three parts, namely heat pipe, heat dissipation fins, and heat conduction base.
  • the heat pipe is used as a phase change component to transfer heat through phase change.
  • the heat conduction base connects the heat source and the radiator.
  • the heat source transfers heat to the heat pipe through the heat conduction base.
  • the heat dissipation fins are the phase change between the heat pipe and the heat pipe.
  • the heat of the transformed heat medium is transferred to the outside.
  • One end (evaporation part) of the heat pipe is embedded or welded on the heat conducting base, and one end (condensation part) is connected with the heat dissipation fins.
  • phase-change heat sinks In order to realize the phase-change heat medium evaporating at a suitable temperature, most of them use vacuum extraction to reduce their boiling point.
  • Traditional heat pipes use deionized water or ethanol as the working fluid, and must maintain a certain negative pressure to vaporize at the working point.
  • the heat pipe itself is tubular, and the number of heat pipes suitable for a heat pipe radiator is very limited, the direct contact area between the heat pipe and the heat source is not large, which makes the heat transfer from the heat source to the phase change component (heat pipe) a big obstacle.
  • the thermal efficiency is not high, the heat dissipation performance is severely limited, and it can also cause local high temperature of the base.
  • the heat dissipation method of the heat pipe is one-dimensional, which conducts heat in a linear manner.
  • the heat dissipation capacity and heat dissipation effect of the heat pipe itself are not optimal, and the cost of processing heat pipe radiators is also high. For most phase change radiators, most It works in an internal vacuum environment, which limits the flow of the internal phase-change heat medium and is not conducive to heat dissipation.
  • the current heat pipe shell material is mostly red copper, and the base material is mostly aluminum alloy.
  • low-temperature tin brazing or cementing is used to fill the gap between the heat pipe and the base after forming, which will produce a certain thermal resistance, which is not conducive to transfer.
  • the shortcomings of hot and low-temperature tin-lead soldering include: the overall surface treatment of the radiator must be nickel-plated or copper-plated before soldering. Soldering and surface treatment lead to high costs and pollution to the environment; soldering is difficult to ensure the heat pipe The plane filling with the aluminum alloy base is very good, and there is no local gap. Because the heat pipe is under the power device, the heat flux density is large, and the gap will cause a local temperature rise of the heat source device and cause device loss. The processing cost of the heat pipe radiator is high and it pollutes the environment.
  • the traditional phase change heat sink has problems such as large heat transfer resistance, uneven heat transfer, high production cost, and low heat exchange efficiency.
  • the present invention provides a phase change heat dissipation device for electronic devices to improve heat transfer efficiency and promote rapid heat dissipation.
  • phase change heat dissipation device for electronic devices of the present invention are as follows:
  • a phase change heat dissipating device includes a phase change component in which a phase change heat medium is arranged, wherein the phase change heat medium provided in the phase change component is configured to be in the working state of the phase change heat dissipation device, the phase change component
  • the internal air pressure is greater than 0.15MPa.
  • phase-change heat medium set in the phase-change component is R134a, R142b, R114, R124, R1233Zd(E), R1234Ze(Z), R1234Ze(E), R600a, RC318, RE245cb2, R22, R32, R407C, R410A Any one or more of them.
  • the phase change assembly includes an evaporation part and a condensation part, the inside of the evaporation part has an evaporation cavity, the inside of the condensation part has a condensation cavity, the evaporation cavity is in communication with the condensation cavity, and the phase change heat medium in the evaporation cavity
  • the heat of the heat source can be absorbed and transferred to the condensing cavity, and the condensing cavity radiates heat outward to cool the heat source.
  • the evaporation cavity is a flat or curved cavity.
  • the condensation part includes a plurality of condensation branch plates, and the condensation cavity is a correspondingly arranged planar cavity inside the condensation branch plate; or the condensation part includes a plurality of condensation branch pipes, and the condensation cavity corresponds to the inside of the condensation branch pipe.
  • the condensing part includes a plurality of condensing conical tubes, and the condensing cavity is a conical cavity correspondingly arranged inside the condensing conical tube.
  • the condensing part is connected to the evaporating part directly or through a pipeline.
  • the inner wall of the condensing part is provided with a condensation strengthening structure
  • the outer wall of the condensing part is provided with fins or fins that increase the condensing area.
  • a plurality of fins, bumps or fins are arranged inside the evaporation part and the condensation part to improve the pressure bearing capacity.
  • the outer wall of the evaporation part is arranged in contact with the heat source.
  • the outer surface of the evaporation portion has a contact heat absorption surface
  • the heat source has a heat source surface
  • the contact heat absorption surface of the evaporation portion is in contact with the heat source surface of the heat source
  • the heat source surface and the contact heat absorption surface are both For the plane.
  • the evaporation part of the phase change component is in direct contact with the heat source, and the evaporation part can fully contact the heat source.
  • the heat transfer area is large and the heat transfer effect is good.
  • the heat flux density of the heat source is large, the phase change directly in contact with the bottom of the evaporation cavity
  • the temperature of the variable medium vaporizes, and other local pressures increase.
  • the evaporation chamber and the heating source contact the part with the highest heat flow density and other parts to form a pressure difference, which can realize the rapid diffusion of heat in the evaporation part of the phase change component, and the overall temperature difference of the evaporation part is small.
  • phase change component is a three-dimensional heat dissipation structure. After the phase change heat medium is vaporized, it can quickly diffuse to any low pressure part of the phase change component, so that the temperature of the phase change component is uniform, the heat transfer efficiency is high, and the heat transfer is uniform.
  • the working temperature range is 30-80°C, and the internal pressure is much higher than the standard atmospheric pressure, which is a positive pressure non-vacuum environment.
  • the heat flow density of the heating source is high, the absolute pressure of the evaporation part of the phase change device is high, the relative pressure difference under the same temperature difference in different parts of the phase change device is large, and the pressure difference can drive more phase change media, thereby enhancing the heat exchange capacity.
  • the fluidity of the internal phase-change heat medium is improved, the heat flux density of heat transfer is improved, and it is easier to achieve efficient heat dissipation.
  • the internal absolute pressure is high, and the evaporation part and the condensation part need to bear high pressure.
  • a number of fins, bumps or fins are arranged inside the evaporation part and the condensation part to improve the pressure bearing capacity.
  • phase change component is used to strengthen the boiling and evaporation heat exchange structure.
  • the phase change heat medium can perform boiling heat exchange more efficiently, and the heat expansion is more uniform and rapid, and the heat transfer will also be due to The increase in heat exchange area makes it more efficient.
  • phase change heat sink of the present invention does not require surface treatment processes such as copper plating and nickel plating.
  • the phase change structure of the heat sink and the condensing fins are directly brazed and welded together at high temperature, and the heat source (such as power device CPU ) Contact with the phase change heat sink and then fill the gaps by low-temperature soldering to avoid gaps, so that the heat transfer limit of the phase change heat sink of the present invention is significantly improved (far greater than 200W).
  • the invention can be applied to heat dissipation of power electronic devices such as chips, resistors, capacitors, inductors, storage media, light sources, and battery packs.
  • Figure 1a is a perspective view of Embodiment 1 of a phase change heat dissipation device of the present invention, in which a plurality of condensation support plates are not connected;
  • Figure 1b is a cross-sectional view of the phase change heat dissipation device in Figure 1a, in which a plurality of condensing support plates communicate with each other through a condensing top plate;
  • FIG. 2 is a perspective view of the second embodiment of the phase change heat sink of the present invention.
  • Fig. 3a is a perspective view of the third embodiment of the phase change heat dissipation device of the present invention.
  • Figure 3b is a cross-sectional view of the phase change heat dissipation device in Figure 3a;
  • Fig. 4a is a perspective view of a fourth embodiment of a phase change heat sink of the present invention.
  • Figure 4b is a cross-sectional view of the phase change heat dissipation device in Figure 4a;
  • Fig. 5a is a perspective view of the fifth embodiment of the phase change heat dissipation device of the present invention, in which the evaporating part and the condensing part are separately arranged and communicated by pipelines, the evaporating part has a hollow rectangular cavity, and the condensing part includes a plurality of condensing support plates;
  • Figure 5b is a cross-sectional view of the phase change heat dissipation device in Figure 5a;
  • Figure 6a is a perspective view of the sixth embodiment of the phase change heat dissipation device of the present invention, in which the evaporating part and the condensing part are arranged separately and communicated by pipelines, the evaporating part is a hollow rectangular cavity, the condensing part includes a plurality of condensation branch pipes, and the condensation branch pipe has multiple Cylindrical cavity
  • Figure 6b is a cross-sectional view of the phase change heat dissipation device in Figure 6a;
  • Figures 7-8 show schematic diagrams of the flow of the phase-change heat medium of the present invention in the phase-change component
  • Figures 9-10 show schematic diagrams of the enhanced heat exchange structure on the phase change heat sink.
  • phase change heat dissipation device of the electronic device of the present invention will be described in further detail below with reference to the accompanying drawings.
  • Boiling heat transfer refers to the heat transfer process in which heat is transferred from the wall to the liquid to make the liquid boil and vaporize.
  • the vaporization core is the carrier that initiates the boiling of the liquid.
  • Thermal conductivity is defined as taking two parallel planes with a distance of 1 meter and an area of 1 square meter perpendicular to the direction of heat conduction inside the object. If the temperature difference between the two planes is 1K, it will be conducted from one plane to the other within 1 second heat for a predetermined plane on the thermal conductivity of the material, in units of watt m -1 ⁇ opening -1 (w ⁇ m -1 ⁇ K -1).
  • Thermal resistance is defined as the ratio between the temperature difference between the two ends of the object and the power of the heat source when heat is transferred to the object.
  • the unit is Kelvin per watt (K/W) or Celsius per watt (°C/W).
  • the heat transfer coefficient refers to the temperature difference between the air on both sides of the enclosure structure is 1 degree (K or °C) under the condition of stable heat transfer, and the heat transfer per unit area per unit time, the unit is watt/(m2 ⁇ degree) ( W/ ⁇ K, where K can be replaced by °C), which reflects the strength of the heat transfer process.
  • the pressure inside the phase change component of the radiator is slightly positive pressure between 0.1MPa and 0.15MPa.
  • ethanol or the like is used as the phase change heat medium, and the air pressure inside the phase change component is slightly positive during operation.
  • Negative pressure When the temperature of the contact part of the radiator and the heat source is stable, the pressure inside the phase change component of the radiator is less than 0.1MPa, which is negative pressure.
  • 0.1MPa When water is used as the phase-change heating medium, the pressure inside the phase-change component must be negative during operation, otherwise the phase-change heating medium cannot be started and the radiator fails.
  • the phase change heat dissipation device 10 of the present invention includes an evaporation part 11, a condensation part 12, and a phase change heat medium 20 arranged in the evaporation part 11 or the condensation part 12.
  • the evaporation part 11 and the condensation part 12 Together to form a three-dimensional heat exchange structure.
  • the working pressure inside the phase change heat dissipation device 10 is greater than 0.15 MPa, which is in a positive pressure state.
  • the evaporating part 11 and the condensing part 12 can be directly connected together (as shown in Figure 1a- Figure 4b), and the evaporating part 11 and the condensing part 12 can also be a split structure connected together by pipes ( Figure 5a- Figure 6b) Shown).
  • the condensing part 12 can be placed horizontally or vertically, and the structure and placement direction can be changed according to the requirements of the system structure design where the CPU board is located.
  • the heat source 30 is directly installed in the evaporation part 11 of the phase change component, and the heat is directly transferred to the phase change heat medium 20 through the thin wall of the evaporation part 11.
  • the phase change heat medium 20 absorbs heat and undergoes phase change to make the inside of the phase change heat sink 10
  • the pressure difference between the evaporating part 11 and the condensing part 12 drives the phase-change heat medium 20 to flow to the condensing part 12. After the phase-change medium is condensed in the condensing part 12, it returns to the evaporating part 11 by gravity or capillary force to form a circulation.
  • the phase change heat dissipation device 10 of the present invention includes a phase change component, which is a closed structure with a cavity inside, and a phase change heat medium 20 is installed inside the phase change component.
  • the internal cavity is a fully connected structure, and the phase-change heat medium 20 can circulate in the entire internal cavity of the phase-change component.
  • the phase change assembly has an evaporation part 11 and a condensation part 12.
  • the evaporation part 11 has an evaporation cavity inside, and the condensation part 12 has a condensation cavity inside.
  • the evaporation cavity of the evaporation part 11 communicates with the condensation cavity of the condensation part 12, the evaporation cavity and the condensation cavity.
  • the condensing part 12 is connected with the condensing fin to form the internal cavity of the phase change component.
  • the phase-change heat medium 20 in the evaporation cavity absorbs the heat of the heat source 30 and then evaporates and evaporates to flow into the condensation cavity for cooling and liquefaction, and the condensation cavity radiates heat outward through the condensation fins. Therefore, the phase change heat dissipation device 10 can transfer the heat of the heat source 30 to the air or other gaseous cooling medium, so as to achieve the effect of heat dissipation and cooling of the heat source.
  • the evaporation part 11 of the above-mentioned phase change assembly is a flat plate-like body or a curved plate-like body with a cavity inside, the evaporation part 11 has a flat evaporation cavity or a curved evaporation cavity inside, and a flat cavity or a curved surface inside the evaporation part 11 The shaped cavity is communicated with the condensation cavity inside the condensation portion 12.
  • the condensation part 12 includes a plurality of condensation support plates with cavities inside, the inside of the condensation support plate is a flat condensation cavity, and the plurality of condensation support plates are connected to the evaporating part 11, the flat condensation cavity and the evaporation part inside the condensation support plate 11
  • the inner flat or curved evaporation chambers are connected.
  • the above-mentioned multiple condensation support plates are preferably arranged in parallel in a row, the condensation support plates are vertically connected to the evaporator 11, the outside of the condensation support plates are connected with condensation fins, and the heat in the condensation support plates is radiated to the outside through the condensation fins.
  • the evaporating part 11 is not limited to a plate-shaped structure, and may also have other cylindrical structures, as long as the lower bottom surface is flat.
  • the inner wall of the condensing portion 12 is provided with a condensation strengthening structure, which may be a capillary structure scattered on the inner wall of the condensing portion 12.
  • the capillary structure is a waist-shaped columnar or cylindrical or conical structure.
  • the capillary structure has a capillary function and can make The vaporized phase-change heat medium 20 flows more quickly and uniformly along the condensing cavity, which is also conducive to the rapid return of the condensed phase-change heat medium 20 to the evaporation cavity.
  • this capillary structure can increase the heat exchange area of the condensing cavity itself, and speed up the heat transfer.
  • the condensing part 12 further includes a condensing top plate 121.
  • the condensing top plate 121 has a flat or curved condensing cavity inside.
  • the condensation part 12 has a comb shape as a whole.
  • the phase-change heat medium 20 absorbs heat in the evaporation cavity of the evaporator 11, and dissipates heat through the condensation support plate of the condensation portion 12 and the condensation top plate 121.
  • the phase change heat medium 20 absorbs heat in the evaporation cavity and the condensation support plate of the evaporator 11
  • the condensing cavity in the condensing top plate 121 circulates to dissipate heat from the heat source 30.
  • the condensation top plate 121 may be integrally formed with the condensation support plate.
  • the evaporating part 11 and the condensing part 12 of the phase change component are also preferably integrally formed.
  • the condensation branch plate in the condensation portion 12 adopts other forms, that is, the condensation portion 12 includes a plurality of cylindrical condensation branch pipes, and the condensation cavity corresponds to the inside of the condensation branch pipe. Cylindrical cavity set.
  • the condensing portion 12 may further include a plurality of condensing conical tubes, and the condensing cavity is a conical cavity correspondingly arranged inside the condensing conical tube.
  • the condensation cavity of the condensation portion 12 is not directly connected to the evaporating portion 11, and the condensation cavity of the condensation portion 12 is connected to the evaporating portion 11 through a pipeline to facilitate the condensation portion 12 according to
  • the internal structure of the heating source 30 system is reasonably arranged.
  • the evaporation part 11 and the condensation part 12 of the phase change assembly are directly connected, the evaporation part 11 at one end of the phase change assembly is directly connected with the condensation part 12 at the other end of the phase change assembly, and the phase change heat medium 20 inside the phase change assembly is in direct communication.
  • the heat can be diffused horizontally and vertically three-dimensionally from one end of the phase change component to the other end of the phase change component, and the internal cavity of the entire phase change component, especially the temperature of the condensation cavity in the condensation part 12, is uniform. Sex.
  • the above-mentioned evaporation part 11 is in direct contact with the heat source 30, that is, the surface of the evaporation part 11 (the outer surface of the evaporation chamber) is in direct contact with the heat source 30, and the surface of the evaporation part 11 directly replaces the substrate of the existing heat sink to enhance the heat source 30 and the heat transfer efficiency of the evaporation part 11.
  • the evaporation part 11 is preferably a flat plate-shaped body with a cavity inside, one side of the evaporation part 11 has a contact heat absorption surface, the heat source 30 has a flat heat source surface, and the contact heat absorption surface of the evaporation part 11 is in contact with the heat source 30 Heat source surface contact setting.
  • the area of the heat source surface of the heat source 30 is smaller than the area of the heat-absorbing surface of the phase change component evaporation portion 11, and the internal phase-change heat medium 20 can quickly transfer heat from the heat source 30 to the phase in a two-dimensional direction through the phase change flow.
  • the evaporation part 11 of the phase change assembly can ensure the uniform temperature in the evaporation chamber of the phase change assembly.
  • the vaporized phase-change heat medium 20 enters the condensing support plate and flows in a third direction, which is perpendicular to the evaporation portion 11 of the planar plate-shaped body, that is, perpendicular to the two-dimensional heat dissipation direction inside the evaporation portion 11.
  • a plurality of fins, bumps or fins are arranged inside the evaporation part 11 and/or the condensation part 12 to improve the pressure bearing capacity.
  • phase change components and condensing fins can be made of copper, aluminum, copper alloy, aluminum alloy, magnesium alloy, and stainless steel.
  • the phase change components and condensing fins are all made of copper or aluminum.
  • the phase change components and condensing fins are preferably connected by brazing to reduce the contact thermal resistance between the phase change component and the condensation fin, thereby reducing the temperature difference between the condensation fin and the heat source 30.
  • the gap can be filled by low-temperature soldering to avoid gaps.
  • the cooling fins and the outer wall of the condensing support plate are welded together to increase the pressure bearing capacity of the condensing support plate.
  • the internal working pressure of the condensing part 12 and the evaporating part 11 will increase. If it increases to more than 1MPa, the cooling
  • the interweaving structure formed by welding the fins and the condensing support plate can ensure that the condensing part 12 can withstand the strength required for work, and the condensing part 12 will not be deformed, so that the radiator can work normally.
  • the enhanced heat exchange structures can be protrusions or channels formed on the outer surface of the condensing portion 12 or the evaporating portion 11 ( Figure 9). It may also be a porous structure formed on the surface of the condensation part 12 or the evaporation part 11 by a sintering method (FIG. 10 ).
  • the phase-change heat medium 20 can perform boiling heat exchange more efficiently, and the heat expansion is more uniform and rapid, and the heat transfer to the outside world will be more efficient due to the increase of the heat exchange area, and heat exchange can be enhanced.
  • the structure can be selected according to the power density of the heat source 30 and the manufacturing cost.
  • the figures show the circulating flow of the phase-change heat medium 20 in the phase-change assembly.
  • the phase-change heat medium 20 of the evaporator 11 absorbs the heat of the heat source 30 and then flows in the evaporator 11
  • the internal evaporation cavity diffuses along a two-dimensional plane, and then the phase-change heat medium 20 vaporizes and flows into the condensation support plate of the condensation part 12 perpendicular to the evaporation part 11, and then flows into the condensation ceiling 121, the condensation support plate and the condensation ceiling Condensing fins are connected to the outer surface of 121, and the heat carried by the phase-change heat medium 20 in the condensing support plate and the condensing top plate 121 is diffused outward through the condensing fins, thereby obtaining more favorable heat dissipation effect and performance.
  • the evaporation cavity of the evaporation part is a flat or curved thin-walled cavity
  • the evaporation part is provided with a capillary structure that enhances boiling heat exchange
  • the condensation part includes a plurality of hollow condensation branch plates or condensation branches or condensation Conical tubes, hollow support plates, hollow cylinders or hollow cones are provided with structures that enhance condensation heat exchange.
  • the outside of the condensation section is connected with fins or fins that can increase the condensation heat exchange area, which has good heat exchange performance.
  • the ambient temperature of the radiator is lower than the boiling point of the phase change medium
  • the pressure of each part of the cavity inside the phase change component is the same, and the internal pressure can be at standard atmospheric pressure or negative pressure.
  • the ambient temperature is higher than the boiling point of the phase change medium.
  • the temperature of each point inside the phase change component is different, so the pressure is different.
  • the heat exchange inside the phase change component is through the different temperature of the phase change component, and the pressure appears Otherwise, the phase-change heat medium 20 of the evaporating part 11 is transported to the condensing part 12 to realize heat exchange.
  • the transmission power of the phase-change heat medium 20 from the evaporating part 11 to the condensation part 12 is derived from the pressure difference of the phase-change heat medium 20 at different temperatures. Therefore, the greater the pressure difference, the greater the ability to transport the medium.
  • the transmission capacity of the phase change component from the evaporation part 11 to the condensation part 12 is mainly determined by the pressure difference between the phase change heat medium 20 in the evaporation part 11 and the condensation part 12, the latent heat of vaporization of the phase change heat medium 20 and the phase change heat medium.
  • the density of 20 is determined.
  • phase-change heat media 20 include water, methanol, ethanol, and acetone, and these existing phase-change heat media 20 are in a negative pressure or slightly positive pressure state under working conditions.
  • the working pressure is in a negative pressure or slightly positive pressure state, that is, the air pressure is less than 0.15 MPa.
  • the heating power of electronic devices is increasing.
  • the heating power of the usual CPU or GPU is already greater than 200W, and the power density is greater than 60000J/m 2 .s.
  • the maximum temperature transmission capacity of the condensing part 12 is only 35W. Only 4 CPUs with a common size of 45mm ⁇ 69mm can be arranged in the space.
  • the maximum heat transfer capacity of the copper water heat pipe is only about 140W, and the remaining heat needs to be conducted through the bottom of the radiator.
  • Ethanol, methanol, and acetone are used as phase change.
  • the heat exchange medium 20 will increase the pressure difference and the volume flow rate of transmission, the latent heat of vaporization of deionized water is much higher than that of ethanol, methanol and acetone at the same volume flow rate, so when the heat flux density is low, the temperature difference is the same. Under the circumstances, the heat transfer capacity of deionized water is stronger than that of ethanol, methanol and acetone.
  • the heat transfer capacity of the traditional copper water heat pipe is no longer sufficient to meet the high-power heat dissipation requirements of electronic devices.
  • the power of the heat source 30 is adjusted by frequency conversion, the condensing part 12 is liquid-cooled, and the liquid volume is provided by the liquid-cooling test device.
  • the inlet temperature is constant at 35°C to ensure that the temperature of the heat source 30 is controlled at 40°C, using different phase change heat medium 20, test the working pressure and heating power inside the phase change module, the test results are shown in Table 1:
  • the test results of the heat flux density of the different phase change heat medium 20 are as follows:
  • R134a is tetrafluoroethane (CF 3 CH 2 F)
  • R114 is dichlorotetrafluoroethane (CClF 2 CClF 2 )
  • R124 is tetrafluoromonochloroethane (CHClFCF 3 )
  • R125 It is pentafluoroethane (CHF 2 CF 3 )
  • R600a is isobutane (CH (CH 3 ) 3 )
  • RC318 is octafluorocyclobutane (cyclo-C 4 F 8 )
  • R245fa or R245ca refers to pentafluoropropane (CHF 2 CF 2 CH 2 F)
  • R32 is trifluoromethane (CH 2
  • the power of the heating source 30 is adjusted by frequency conversion, the condensing part 12 is air-cooled, and the air volume is provided by the test wind tunnel.
  • the inlet air temperature is 25°C and the outlet air temperature is 50°C.
  • the temperature of the heating source 30 is guaranteed Control at 60°C, use different phase change heat medium 20 to test the working pressure and heating power inside the phase change module. The test results are shown in Table 2:
  • the present invention uses a phase-change heat medium 20 with a boiling point of less than 30°C under standard atmospheric pressure. Due to the increase in the pressure difference in the phase-change component, the transmission capacity of the phase-change component is greatly increased.
  • transmission capacity For a size of 45mm ⁇ 69mm CPU, radiator of the same volume, using R134a, R142b, R114, R124, R1233Zd(E), R1234Ze(Z), R1234Ze(E), R600a, RC318, RE245cb2 and other phase-change heating media 20, transmission capacity Both are significantly improved (much greater than 200W).
  • phase-change heat medium in the phase-change component, namely R134a, R142b, R114, R124, R1233Zd(E), R1234Ze(Z), R1234Ze(E), R600a, RC318, RE245cb2, etc. or their
  • the air pressure inside the phase change component is greater than 0.15 MPa, and the above phase change heat medium can be purchased from the market.
  • the invention can be applied to heat dissipation of power electronic devices such as chips, resistors, capacitors, inductors, storage media, light sources, and battery packs.

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Abstract

本发明公开了一种相变散热装置，包括内部设置有相变换热介质的相变组件，相变组件中设置的相变换热介质配置为在相变散热装置工作状态时，所述相变组件内部的气压大于0.15MPa。本发明的相变散热装置工作时，工作温度范围为30-80℃，内部压力远大于标准大气压，为正压非真空环境，发热源的热流密度大，相变组件蒸发部的绝对压力高，相变组件不同部位相同温差条件下的相对压差大，压差能驱动更多的相变介质，从而增强换热能力，提高了内部相变换热介质的流动性，提高传热的热流密度，更容易实现高效散热。

Description

相变散热装置 技术领域
本发明属于相变散热装置技术领域，尤其涉及一种电子器件的相变散热装置。
背景技术
相变散热是一种高效地散热方式，其原理是利用相变换热介质在一定温度下沸腾气化吸热，然后气化的气体在其他位置冷凝液化放热，从而实现了热量的传递，其传热效果好、应用广泛。
目前，相变散热器普遍采用热管进行相变散热，相对于其他传统散热方式而言，热管散热的热量传递效率高，散热效果好。常见的热管散热器主要由三大部分组成，即热管、散热鳍片、导热基座。其中热管作为相变组件，通过相变的方式进行热量的传递，导热基座连接发热源与散热器，热源会通过导热基座将热量传递给热管，散热鳍片则是将热管和热管中相变换热介质的热量传递给外界。热管一端(蒸发部)嵌入或者焊接在导热基座上，一端(冷凝部)与散热鳍片相连接。
对于目前常见的相变散热器，其为了实现相变换热介质在合适的温度蒸发，大多数都是采用抽取真空的方式来降低其沸点。传统的热管采用去离子水或乙醇作为工质，必须维持一定的负压才能在工作点汽化。
由于热管本身为管状，且一个热管散热器适宜配置的热管数量非常有限，热管与热源直接接触面积不大，使得热量从热源处传递给相变组件(热管)时会有很大的障碍，传热效率不高，散热性能受到严重限制，还会导致基座的局部高温。另外，热管的散热方式是一维的，是以线性方式传导热量，热管本身的散热能力和散热效果不是最佳，加工热管散热器的成本也较高，对于多数的相变式散热器，多数是内部真空环境工作，这对内部相变换热介质的流动产生限制，不利于散热。
此外，目前的热管外壳材料多为紫铜，而基座材料多为铝合金，通常采用 低温锡钎焊或胶结填充热管和基座成形之后的缝隙，这样就会产生一定的热阻，不利于传热，且低温锡铅焊的缺点包括：在焊前必须对散热器进行整体的镀镍或镀铜等表面处理，焊接和表面处理导致成本高，且对环境存在污染；锡焊很难保证热管和铝合金基座平面填充很好，不出现局部空隙，而因热管在功率器件下方，热流密度大，空隙会导致热源器件出现局部温升高，而导致器件损耗。热管散热器的加工成本高，且对环境存在污染。
因此，传统的相变散热器具有传热热阻大，传热不均匀、生产成本高以及换热效率低等问题。
发明内容
为解决上述现有技术中的问题，本发明提供了一种电子器件相变散热装置，以提高热量传递效率，促进热量快速扩散。
为实现上述目的，本发明的电子器件相变散热装置的具体技术方案如下：
一种相变散热装置，包括内部设置有相变换热介质的相变组件，其中，相变组件中设置的相变换热介质配置为在相变散热装置工作状态时，所述相变组件内部的气压大于0.15MPa。
进一步，相变组件中设置的相变换热介质为R134a、R142b、R114、R124、R1233Zd(E)、R1234Ze(Z)、R1234Ze(E)、R600a、RC318、RE245cb2、R22、R32、R407C、R410A中的任意一种或多种。
进一步，相变组件包括蒸发部和冷凝部，蒸发部的内部具有蒸发腔，冷凝部的内部具有冷凝腔，所述蒸发腔与所述冷凝腔连通，所述蒸发腔中的相变换热介质可吸收发热源的热量并向所述冷凝腔传递，冷凝腔向外散发热量以对发热源进行冷却。
进一步，所述蒸发腔为平面状或曲面状腔体。
进一步，所述冷凝部包括多个冷凝支板，所述冷凝腔为冷凝支板内部对应设置的平面状空腔；或者所述冷凝部包括多个冷凝支管，所述冷凝腔为冷凝支管内部对应设置的圆柱形空腔；或者所述冷凝部包括多个冷凝锥形管，所述冷凝腔为冷凝锥形管内部对应设置的圆锥形空腔。
进一步，所述冷凝部直接或通过管路连接在蒸发部上。
进一步，冷凝部的内壁设有冷凝强化结构，冷凝部的外壁设置有增加冷凝面积的翅片或肋片。
进一步，所述蒸发部和冷凝部内部设置有多个肋片、凸点或翅片，以提高承压能力。
进一步，所述蒸发部的外壁与发热源接触设置。
进一步，所述蒸发部的外表面具有接触吸热面，发热源具有热源面，蒸发部的所述接触吸热面与发热源的所述热源面接触，所述热源面和接触吸热面均为平面。
本发明的相变散热装置具有以下优点：
1)相变组件蒸发部与发热源为直接接触，蒸发部能够充分与发热源接触，传热面积大，传热效果好，当发热源的热流密度大时，和蒸发腔底部直接接触的相变介质温度气化，局部其它压力升高，蒸发腔和发热源接触热流密度最高的部位和其它部位形成压力差，可以实现相变组件蒸发部的热量快速扩散，蒸发部整体温差小。
2)相变组件为三维散热结构，相变换热介质汽化后，可以快速扩散到相变组件的任何低压部位，使得相变组件的温度均匀，传热效率高且传热均匀。
3)相变散热装置工作时，工作温度范围为30-80℃，内部压力远大于标准大气压，为正压非真空环境。发热源的热流密度大，相变装置蒸发部的绝对压力高，相变装置不同部位相同温差条件下的相对压差大，压差能驱动更多的相变介质，从而增强换热能力提高了了内部相变换热介质的流动性，提高传热的热流密度，更容易实现高效散热。
4)相变散热装置工作时，内部绝对压力大，蒸发部和冷凝部需要承受的压力大。蒸发部和冷凝部内部设置有多个肋片、凸点或翅片以提高承压能力。
5)相变组件内部钎焊或烧结有用于强化沸腾和蒸发换热的结构，相变换热介质能够更高效地进行沸腾换热，且热量扩展更为均匀、快速，热量的传递也会由于换热面积的增加而更高效。
此外，本发明的相变散热装置的制造不需要经过镀铜和镀镍等表面处理工 艺，散热装置的相变结构和冷凝翅片直接采用高温钎焊焊接成一体，发热源(如功率器件CPU)和相变散热装置接触再通过低温锡焊填补缝隙，避免产生间隙，使得本发明的相变散热装置的传热极限显著提高(远大于200W)。
本发明可应用到芯片、电阻、电容、电感、贮存介质、光源、电池包等电力电子器件散热。
附图说明
图1a为本发明相变散热装置实施例一的透视图，其中多个冷凝支板不连通；
图1b为图1a中相变散热装置的剖面图，其中多个冷凝支板通过冷凝顶板相互连通；
图2为本发明相变散热装置实施例二的透视图；
图3a为本发明相变散热装置实施例三的透视图；
图3b为图3a中相变散热装置的剖面图；
图4a为本发明相变散热装置实施例四的透视图；
图4b为图4a中相变散热装置的剖面图；
图5a为本发明相变散热装置实施例五的透视图，其中蒸发部和冷凝部分离设置并通过管路连通，蒸发部具有空心矩形腔，冷凝部包括多个冷凝支板；
图5b为图5a中相变散热装置的剖面图；
图6a为本发明相变散热装置实施例六的透视图，其中蒸发部和冷凝部分离设置并通过管路连通，蒸发部为空心矩形腔，冷凝部包括多个冷凝支管，冷凝支管具有多个圆柱形空腔；
图6b为图6a中相变散热装置的剖面图；
图7-8示出了本发明相变换热介质在相变组件中流动的示意图；
图9-10示出了相变散热装置上的强化换热结构示意图。
具体实施方式
为了更好地了解本发明的目的、结构及功能，下面结合附图，对本发明的电子器件相变散热装置做进一步详细的描述。
本发明的相关术语定义如下：
沸腾换热，是指热量从壁面传给液体，使液体沸腾汽化的传热过程。
气化核心，汽化核心是启动液体沸腾的载体。
热导率，定义为在物体内部垂直于导热方向取两个相距1米，面积为1平方米的平行平面，若两个平面的温度相差1K，则在1秒内从一个平面传导至另一个平面的热量就规定为该物质的热导率，其单位为瓦特·米 -1·开 -1(W·m -1·K -1)。
热阻，定义为当有热量在物体上传输时，在物体两端温度差与热源的功率之间的比值，单位为开尔文每瓦特(K/W)或摄氏度每瓦特(℃/W)。
传热系数，是指在稳定传热的条件下，围护结构两侧空气温差为1度(K或℃)，单位时间通过单位面积传递的热量，单位是瓦/(平方米·度)(W/·K，此处K可用℃代替)，反映了传热过程的强弱。
热流密度，单位时间内通过单位面积传递的热量称热流密度，q＝Q/(S*t)——Q为热量，t为时间，S为截面面积，热流密度的单位为：J/(m 2·s)
过渡沸腾，当热流密度增大，由大量的汽化核心处喷出的蒸汽形成蒸汽柱，伴随蒸汽流对向传热面不给的液体产生了妨碍，短时间在传热面出现液体干涸，导致传热面的温度急剧上升。
正压，散热器和发热源接触部位的温度达到稳定时，散热器相变组件内部的压力为1.5倍标准大气压以上(大于0.15MPa)定义为正压。
微正压：散热器和发热源接触部位的温度达到稳定时，散热器相变组件内部的压力在0.1MPa至0.15MPa之间为微正压。例如采用乙醇等作为相变换热介质，工作时相变组件内部的气压为微正压。
负压：散热器和发热源接触部位的温度达到稳定时，散热器相变组件内部的压力小于0.1MPa为负压。例如：当采用水作为相变换热介质时，工作时相变组件内部的压力必须为负压，否则相变换热介质无法启动，散热器失效。
如图1a-6b所示，本发明的相变散热装置10包括蒸发部11、冷凝部12和设置在蒸发部11或冷凝部12内的相变换热介质20，蒸发部11、冷凝部12共 同形成三维换热结构。相变散热装置10处于工作状态时，相变散热装置10内部的工作压力大于0.15MPa，处于正压状态。其中蒸发部11和冷凝部12可以直接连接在一起(图1a-图4b所示)，蒸发部11和冷凝部12也可以为通过管路连接在一起的分体式结构(如图5a-图6b所示)。
在图5a-图6b所示的实施例中，冷凝部12可以水平放置，也可以垂直放置，根据CPU板所在系统结构设计的需要，变换结构和放置方向。发热源30直接安装在相变部件的蒸发部11，热量通过蒸发部11的薄壁直接传递给相变换热介质20，相变换热介质20吸热发生相变使得相变散热装置10内部蒸发部11和冷凝部12之间产生压力差，从而驱动相变换热介质20向冷凝部12流动，相变介质在冷凝部12冷凝后，通过重力或毛细力返回蒸发部11，形成循环。
如图1a-1b所示，本发明的相变散热装置10包括相变组件，相变组件为内部具有空腔的封闭结构，相变组件内部装有相变换热介质20，相变组件的内部空腔为全连通结构，相变换热介质20可在相变组件的整个内部空腔中循环流动。
相变组件具有蒸发部11和冷凝部12，蒸发部11的内部具有蒸发腔，冷凝部12的内部具有冷凝腔，蒸发部11的蒸发腔与冷凝部12的冷凝腔连通，蒸发腔和冷凝腔组成相变组件的内部空腔，冷凝部12与冷凝翅片相连。蒸发腔中的相变换热介质20吸收发热源30的热量后汽化蒸发流动到冷凝腔中冷却液化，冷凝腔通过冷凝翅片向外散发热量。由此，相变散热装置10可将发热源30的热量传递到空气或其它气态的冷却介质中，以达到对热源进行散热冷却的效果。
上述相变组件的蒸发部11为内部具有空腔的平面板状体或曲面板状体，蒸发部11内部具有平面状蒸发腔或曲面状蒸发腔，蒸发部11内部的平面状空腔或曲面状空腔与冷凝部12内部的冷凝腔相连通。
冷凝部12包括多个内部具有空腔的冷凝支板，冷凝支板的内部为平面状冷凝腔，多个冷凝支板连接在蒸发部11上，冷凝支板内部的平面状冷凝腔与蒸发部11内部的平面状蒸发腔或曲面状蒸发腔相连通。上述多个冷凝支板优选成排平行设置，冷凝支板与蒸发部11垂直连接，冷凝支板的外侧连接有冷凝翅片，冷凝支板中的热量通过冷凝翅片向外界散发。蒸发部11不限为板状体结构，也可为其它柱体结构，只要下底面为平面即可。
进一步，冷凝部12的内壁设有冷凝强化结构，冷凝强化结构可以是冷凝部12内壁散布设置的毛细结构，所述毛细结构为腰形柱状或圆柱或圆锥结构，毛细结构具有毛细作用，能使汽化后的相变换热介质20更快速均匀地沿冷凝腔流动，也有利于冷凝后的相变换热介质20快速回流至蒸发腔。此外，这种毛细结构能增加冷凝腔本身的换热面积，使热量传递速度加快。
如图2a-2b所示，冷凝部12还包括冷凝顶板121，冷凝顶板121内部具有平面状冷凝腔或曲面状冷凝腔，冷凝顶板121内部的冷凝腔与冷凝支板内部的冷凝腔相连通，冷凝部12整体呈梳子形。相变换热介质20在蒸发部11的蒸发腔中吸热，通过冷凝部12的冷凝支板和冷凝顶板121进行散热，相变换热介质20在蒸发部11的蒸发腔与冷凝支板和冷凝顶板121中的冷凝腔进行循环流动，以对发热源30进行散热。冷凝顶板121可与冷凝支板一体成型。相变组件的蒸发部11和冷凝部12也优选为一体成型结构。
如图3a-3b所示，本实施例中，冷凝部12中的冷凝支板采用其他形式，也即所述冷凝部12包括多个圆柱形的冷凝支管，所述冷凝腔为冷凝支管内部对应设置的圆柱形空腔。如图4a-4b所示，所述冷凝部12还可以包括多个冷凝锥形管，所述冷凝腔为冷凝锥形管内部对应设置的圆锥形空腔。
如图5a、5b、6a、6b所示，所述冷凝部12的冷凝腔不直接与蒸发部11相连，冷凝部12的冷凝腔通过管路连接在蒸发部11上，以方便冷凝部12根据发热源30系统内部的结构进行合理布置。
由此，相变组件的蒸发部11和冷凝部12直接连通，相变组件一端的蒸发部11与相变组件另一端的冷凝部12直接连通，相变组件内部的相变换热介质20在蒸发和冷凝过程中，可实现热量从相变组件一端向相变组件另一端的水平向、竖向三维立体扩散，提升整个相变组件内部空腔，尤其是冷凝部12中冷凝腔的温度均匀性。
上述蒸发部11与发热源30直接接触，也即蒸发部11的表面(蒸发腔的外表面)与发热源30直接接触，蒸发部11的表面直接代替现有散热装置的基板，以提升发热源30与蒸发部11的热传递效率。蒸发部11优选为内部具有空腔的平面板状体，蒸发部11的一侧具有接触吸热面，发热源30具有平面状的热源面，蒸发部11的接触吸热面与发热源30的热源面接触设置。
上述发热源30的热源面的面积小于相变组件蒸发部11的接触吸热面的面积，内部相变换热介质20通过相变流动可将热量从发热源30沿二维方向快速传递到相变组件的蒸发部11，可确保相变组件蒸发腔中的温度均匀。汽化的相变换热介质20进入冷凝支板中沿第三方向流动，该第三方向垂直于平面板状体的蒸发部11，也即与蒸发部11内部的二维散热方向垂直。
所述蒸发部11和/或所述冷凝部12内部设置有多个肋片、凸点或翅片以提高承压能力。
上述相变组件和冷凝翅片可由铜、铝、铜合金、铝合金、镁合金、不锈钢材料制成，例如相变组件和冷凝翅片均由铜或者铝材料制成，相变组件和冷凝翅片优选采用钎焊方式连接，以降低相变组件和冷凝翅片的接触热阻，从而减少冷凝翅片和发热源30之间的温差。发热源30(如功率器件CPU)和相变散热装置10(如蒸发部11)接触连接设置后可通过低温锡焊填补缝隙，避免产生间隙。
冷却翅片和冷凝支板的外壁焊接在一起，增加了冷凝支板的承压能力，在散热器工作时，冷凝部12和蒸发部11的内部工作压力会增加，如增加到1MPa以上，冷却翅片和冷凝支板焊接形成的交织结构能保证冷凝部12承受工作所需的强度，冷凝部12不出现变形，保证散热器正常工作。
如图9-10所示，也可采用其他强化换热结构来替代冷凝翅片，强化换热结构可以是形成于冷凝部12或蒸发部11外表面的凸起或槽道(图9)，也可以是通过烧结方式在冷凝部12或蒸发部11表面形成的多孔结构(图10)。通过强化换热结构，相变换热介质20能够更高效地进行沸腾换热，且热量扩展更为均匀、快速，与外界热量的传递也会由于换热面积的增加而更高效，强化换热结构可根据发热源30的功率密度和加工制造成本选定。
如图7-8所示，图示出了相变换热介质20在相变组件中的循环流动情况，蒸发部11的相变换热介质20吸收发热源30的热量后在蒸发部11的内部蒸发腔中沿二维平面扩散，接着相变换热介质20汽化流动到垂直于蒸发部11的冷凝部12的冷凝支板中，并接着流动进入冷凝顶板121中，冷凝支板和冷凝顶板121的外表连接有冷凝翅片，冷凝支板和冷凝顶板121中相变换热介质20携带的热量通过冷凝翅片向外扩散，从而获得更有利的散热效果和性能。
本发明的相变散热装置中，蒸发部的蒸发腔为平面或曲面状薄壁空腔，蒸发部内设置有强化沸腾换热的毛细结构，冷凝部包括多个空心冷凝支板或冷凝支管或冷凝锥形管，空心支板、空心圆柱或空心圆锥内部设置有强化冷凝换热的结构，冷凝段的外部连接有可增加冷凝换热面积的翅片或肋片，具有良好换热性能。
在非工作状态时，散热器的环境温度低于相变介质的沸点，相变组件内部空腔各部位压力相同，内部压力可处于标准大气压或负压状态。相变组件在工作状态时，环境温度高于相变介质的沸点，相变组件内部各点温度不同，从而压力不同，相变组件内部的换热就是通过相变组件不同的温度不同，出现压力差，将蒸发部11的相变换热介质20输送到冷凝部12从而实现换热。相变换热介质20从蒸发部11到冷凝部12的输送动力来源于相变换热介质20在不同温度下的压力差。因此压差越大，输送介质的能力也会越大。相变组件的从蒸发部11到冷凝部12的传输能力主要由相变换热介质20在蒸发部11和冷凝部12的压力差、相变换热介质20的汽化潜热和相变换热介质20的密度决定。
现有技术中，常用的相变换热介质20包括水、甲醇、乙醇和丙酮，在工作状态下，这些现有相变换热介质20在处于负压或微正压状态。
采用上述相变换热介质20，工作压力均处于负压或微正压状态，也即气压小于0.15MPa。而目前电子器件的发热功率越来越大，通常的CPU或GPU的发热功率已经大于200W，功率密度大于60000J/m 2.s。在散热器表面温度60℃时，对于一根
Figure PCTCN2019125969-appb-000001
的铜水热管，冷凝部12温度的最大传输能力只有35W。常用尺寸为45mm×69mm的CPU的空间内只能布置4根，依靠铜水热管的最大传热能力只有约140W，剩余的热量需要靠散热器底部进行传导，采用乙醇、甲醇、丙酮作为相变换热介质20虽然会增加压力差，传输的体积流量增加，但因去离子水在等体积流量时其汽化潜热远高于乙醇、甲醇和丙酮等，所以在低热流密度时，在温差相同条件下，去离子水的传热能力强于乙醇、甲醇和丙酮等。但随着热流密度的增加和相变散热装置体积的限制，传统的铜水热管的传热能力已经不足以满足电子器件高功率散热的要求。
对于尺寸42mm×69mm的发热源30，发热源30功率采用变频调节，冷凝部12采用液冷，液体量由液冷试验装置提供，进液温度恒定在35℃，保证发 热源30的温度控制在40℃，用不同相变换热介质20，测试相变组件内部的工作压力和发热功率，试验结果如表1所示：
不同相变换热介质20的热流密度测试结果如下：
表1：
Figure PCTCN2019125969-appb-000002
在各换热介质中，R134a是四氟乙烷(CF 3CH 2F)，R114是二氯四氟乙烷(CClF 2CClF 2)，R124是四氟一氯乙烷(CHClFCF 3)，R125是五氟乙烷(CHF 2CF 3)，R1233Zd(E)或R1234Ze(Z)或R1234Ze(E)均指反式一氯三氟丙烯(CF 3CH＝CHCl)，R600a是异丁烷(CH(CH 3) 3)，RC318是八氟环丁烷(cyclo-C 4F 8)，R245fa或R245ca均指五氟丙烷(CHF 2CF 2CH 2F)，R32是三氟甲烷(CH 2F 2)，R22是一氯二氟甲烷(CHClF 2)。
实施例1：
对于尺寸30mm×45mm的发热源30，发热源30功率采用变频调节，冷凝 部12采用风冷，风量由试验风洞提供，进风温度25℃，出风温度50℃，保证发热源30的温度控制在60℃，用不同相变换热介质20，测试相变组件内部的工作压力和发热功率，试验结果如表2所示：
表2
Figure PCTCN2019125969-appb-000003
从表2的数据可以看出，本发明采用标准大气压下沸点低于30℃的相变换热介质20，因相变组件中的压差增加，相变组件的传输能力大大增加，对于尺寸45mm×69mm的CPU，同体积的散热器，采用R134a、R142b、R114、R124、R1233Zd(E)、R1234Ze(Z)、R1234Ze(E)、R600a、RC318、RE245cb2等相变换热介质20，传输能力均显著提高(远大于200W)。
由此，通过在相变组件中设置上述相变换热介质，即R134a、R142b、R114、R124、R1233Zd(E)、R1234Ze(Z)、R1234Ze(E)、R600a、RC318、RE245cb2等或者它们的组合，相变散热装置处于工作状态时，使得相变组件内部的气压大于0.15MPa，以上相变换热介质可从市面上购买。
从试验数据可知，相变组件的传热能力与相变组件内部气压正相关，压力越大，换热功率越大。
本发明可应用到芯片、电阻、电容、电感、贮存介质、光源、电池包等电力电子器件散热。
可以理解，本发明是通过一些实施例进行描述的，本领域技术人员知悉的，在不脱离本发明的精神和范围的情况下，可以对这些特征和实施例进行各种改 变或等效替换。另外，在本发明的教导下，可以对这些特征和实施例进行修改以适应具体的情况及材料而不会脱离本发明的精神和范围。因此，本发明不受此处所公开的具体实施例的限制，所有落入本申请的权利要求范围内的实施例都属于本发明所保护的范围内。

Claims (10)

  1. 一种相变散热装置，包括内部设置有相变换热介质的相变组件，其特征在于，相变组件中设置的相变换热介质配置为在相变散热装置工作状态时，所述相变组件内部的气压大于0.15MPa。
  2. 根据权利要求1所述的相变散热装置，其特征在于，相变组件中设置的相变换热介质为R134a、R142b、R114、R124、R1233Zd(E)、R1234Ze(Z)、R1234Ze(E)、R600a、RC318、RE245cb2、R22、R32、R407C、R410A中的任意一种或多种。
  3. 根据权利要求1所述的相变散热装置，其特征在于，相变组件包括蒸发部和冷凝部，蒸发部的内部具有蒸发腔，冷凝部的内部具有冷凝腔，所述蒸发腔与所述冷凝腔连通，所述蒸发腔中的相变换热介质可吸收发热源的热量并向所述冷凝腔传递，冷凝腔向外散发热量以对发热源进行冷却。
  4. 根据权利要求3所述的相变散热装置，其特征在于，所述蒸发腔为平面状或曲面状腔体。
  5. 根据权利要求3所述的相变散热装置，其特征在于，所述冷凝部包括多个冷凝支板，所述冷凝腔为冷凝支板内部对应设置的平面状空腔；或者所述冷凝部包括多个冷凝支管，所述冷凝腔为冷凝支管内部对应设置的圆柱形空腔；或者所述冷凝部包括多个冷凝锥形管，所述冷凝腔为冷凝锥形管内部对应设置的圆锥形空腔。
  6. 根据权利要求3所述的相变散热装置，其特征在于，所述冷凝部直接或通过管路连接在蒸发部上。
  7. 根据权利要求3所述的相变散热装置，其特征在于，冷凝部的内壁设有冷凝强化结构，冷凝部的外壁设置有增加冷凝面积的翅片或肋片。
  8. 根据权利要求3所述的相变散热装置，其特征在于，所述蒸发部和冷凝部内部设置有多个肋片、凸点或翅片，以提高承压能力。
  9. 根据权利要求3所述的相变散热装置，其特征在于，所述蒸发部的外壁与发热源接触设置。
  10. 根据权利要求9所述的相变散热装置，其特征在于，所述蒸发部的外 表面具有接触吸热面，发热源具有热源面，蒸发部的所述接触吸热面与发热源的所述热源面接触，所述热源面和接触吸热面均为平面。
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KR102869451B1 (ko) * 2020-01-15 2025-10-17 주식회사 케이엠더블유 전장소자의 방열장치
CN115804252A (zh) * 2020-03-23 2023-03-14 株式会社Kmw 电子元件的散热装置
US11778725B2 (en) * 2021-11-11 2023-10-03 Cisco Technology, Inc. Thermal interface material (TIM) filling structure for high warpage chips
CN114302628A (zh) * 2022-01-07 2022-04-08 上海热拓电子科技有限公司 一种分离绝缘相变散热器及其散热方法
DE102022100756A1 (de) * 2022-01-13 2023-07-13 Rittal Gmbh & Co. Kg Kühlkörper mit Heatpipe für eine elektronische Komponente und eine entsprechende Anordnung
CN116483178A (zh) * 2022-01-17 2023-07-25 华为云计算技术有限公司 一种计算设备及其冷板
CN115084060B (zh) * 2022-06-10 2025-01-14 山东大学 一种高深宽比微流道热沉及其制备方法与应用
CN116056412A (zh) * 2022-10-31 2023-05-02 中国航天三江集团有限公司 一种高性能可视化蓄能可调均温板及其使用方法
CN116222282B (zh) * 2022-12-29 2025-11-07 北京卫星制造厂有限公司 一种具有高效热交换的相变储能超结构及增材工艺方法
CN116182604A (zh) * 2023-02-20 2023-05-30 上海威特力热管散热器股份有限公司 一种水冷式热管散热器及其制造方法
CN117029134A (zh) * 2023-08-24 2023-11-10 吉林大学 一种水冷与强化夜间辐射散热耦合的建筑相变材料冷却系统
CN117134539B (zh) * 2023-09-11 2024-03-19 贝德凯利电气(苏州)有限公司 一种高压直流风机水冷散热结构
CN116923710B (zh) * 2023-09-18 2023-11-17 中国航空工业集团公司金城南京机电液压工程研究中心 一种飞行器梯级喷雾冷却控制方法及系统
CN117615560A (zh) * 2023-12-29 2024-02-27 尹树彬 一种散热板耦合相变传热器件的散热结构
CN119009257B (zh) * 2024-08-09 2025-10-28 桂林电子科技大学 一种自均温电池包结构体及其适配验证方法
CN118935716B (zh) * 2024-09-26 2025-02-11 南京市特种设备安全监督检验研究院 一种基于生物基相变的电梯温度调控系统及方法
CN120906280B (zh) * 2025-10-09 2025-12-26 宝业集团股份有限公司 装配式可翻转储能幕墙系统、制备工艺及翻转控制方法

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1564322A (zh) * 2004-04-07 2005-01-12 李建民 曲面热管散热器及其应用方法
CN2720631Y (zh) * 2003-11-25 2005-08-24 陈德荣 一种翅片热管散热器
US20070025085A1 (en) * 2005-07-29 2007-02-01 Hon Hai Precision Industry Co., Ltd. Heat sink
DE202011100657U1 (de) * 2011-05-10 2011-07-18 Asia Vital Components Co., Ltd. Kondensationsvorrichtung und Kühlmodul mit dieser Kondensationsvorrichtung
US20110204279A1 (en) * 2005-03-04 2011-08-25 E. I. Du Pont De Nemours And Company Compositions comprising a fluoroolefin
CN202025741U (zh) * 2011-04-12 2011-11-02 广州智择电子科技有限公司 一种导热装置
CN102506600A (zh) * 2011-09-20 2012-06-20 华北电力大学 冷凝端扩展型一体化平板热管
CN102792119A (zh) * 2010-03-29 2012-11-21 富士通株式会社 环型热管
CN104713395A (zh) * 2015-02-11 2015-06-17 上海卫星装备研究所 高耐压性平板热管及其加工方法
CN104864755A (zh) * 2015-05-29 2015-08-26 厦门大学 一种具有翅片-内嵌槽的平板热管吸液芯及其制造方法
CN206131833U (zh) * 2016-11-01 2017-04-26 东莞市德铫实业有限公司 一种新型热管散热器
CN107782189A (zh) * 2017-09-27 2018-03-09 北京空间飞行器总体设计部 耐正压、大功率平板蒸发器及其加工方法以及基于该蒸发器的平板环路热管
CN109612315A (zh) * 2019-01-29 2019-04-12 株洲智热技术有限公司 相变散热装置
CN109612314A (zh) * 2019-01-29 2019-04-12 株洲智热技术有限公司 相变散热装置
CN209745070U (zh) * 2019-01-29 2019-12-06 株洲智热技术有限公司 相变散热装置
CN209877718U (zh) * 2019-01-29 2019-12-31 株洲智热技术有限公司 相变散热装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51127144U (zh) * 1975-04-10 1976-10-14
JPH10185468A (ja) * 1996-12-20 1998-07-14 Akutoronikusu Kk 極大面積比の面間熱拡散接続用プレートヒートパイプ
US6237223B1 (en) * 1999-05-06 2001-05-29 Chip Coolers, Inc. Method of forming a phase change heat sink
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
JP4011272B2 (ja) * 2000-08-21 2007-11-21 東芝トランスポートエンジニアリング株式会社 半導体冷却装置
JP2006011638A (ja) * 2004-06-23 2006-01-12 Shigeru Ito コンピューター等の電子機器からの放熱機器及びそのシステム
CN2874398Y (zh) * 2005-05-10 2007-02-28 苏子欣 一体化热导管散热结构
US7369410B2 (en) * 2006-05-03 2008-05-06 International Business Machines Corporation Apparatuses for dissipating heat from semiconductor devices
EP2677261B1 (en) * 2012-06-20 2018-10-10 ABB Schweiz AG Two-phase cooling system for electronic components
CN103759563B (zh) * 2014-02-21 2015-12-09 电子科技大学 一种利用工质相变循环运动传热的微通道散热装置
JP6237500B2 (ja) * 2014-07-02 2017-11-29 三菱マテリアル株式会社 多孔質アルミニウム熱交換部材
US11236948B2 (en) * 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
CN106839840B (zh) * 2017-01-25 2021-07-27 中国科学院工程热物理研究所 一种基于热压转换效应的传热方法及传热系统
CN207151055U (zh) * 2017-08-02 2018-03-27 深圳市迈安热控科技有限公司 多孔热管及热管传导散热装置

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2720631Y (zh) * 2003-11-25 2005-08-24 陈德荣 一种翅片热管散热器
CN1564322A (zh) * 2004-04-07 2005-01-12 李建民 曲面热管散热器及其应用方法
US20110204279A1 (en) * 2005-03-04 2011-08-25 E. I. Du Pont De Nemours And Company Compositions comprising a fluoroolefin
US20070025085A1 (en) * 2005-07-29 2007-02-01 Hon Hai Precision Industry Co., Ltd. Heat sink
CN102792119A (zh) * 2010-03-29 2012-11-21 富士通株式会社 环型热管
CN202025741U (zh) * 2011-04-12 2011-11-02 广州智择电子科技有限公司 一种导热装置
DE202011100657U1 (de) * 2011-05-10 2011-07-18 Asia Vital Components Co., Ltd. Kondensationsvorrichtung und Kühlmodul mit dieser Kondensationsvorrichtung
CN102506600A (zh) * 2011-09-20 2012-06-20 华北电力大学 冷凝端扩展型一体化平板热管
CN104713395A (zh) * 2015-02-11 2015-06-17 上海卫星装备研究所 高耐压性平板热管及其加工方法
CN104864755A (zh) * 2015-05-29 2015-08-26 厦门大学 一种具有翅片-内嵌槽的平板热管吸液芯及其制造方法
CN206131833U (zh) * 2016-11-01 2017-04-26 东莞市德铫实业有限公司 一种新型热管散热器
CN107782189A (zh) * 2017-09-27 2018-03-09 北京空间飞行器总体设计部 耐正压、大功率平板蒸发器及其加工方法以及基于该蒸发器的平板环路热管
CN109612315A (zh) * 2019-01-29 2019-04-12 株洲智热技术有限公司 相变散热装置
CN109612314A (zh) * 2019-01-29 2019-04-12 株洲智热技术有限公司 相变散热装置
CN209745070U (zh) * 2019-01-29 2019-12-06 株洲智热技术有限公司 相变散热装置
CN209877718U (zh) * 2019-01-29 2019-12-31 株洲智热技术有限公司 相变散热装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3907456A4 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230044300A (ko) * 2020-08-07 2023-04-03 후아웨이 테크놀러지 컴퍼니 리미티드 히트 라디에이터, 히트 라디에이터 제조 방법 및 라디오 원격 유닛
JP2023537376A (ja) * 2020-08-07 2023-08-31 華為技術有限公司 ラジエータ、ラジエータの製造方法、及び遠隔無線ユニット
JP7640674B2 (ja) 2020-08-07 2025-03-05 華為技術有限公司 ラジエータ、ラジエータの製造方法、及び遠隔無線ユニット
KR102908801B1 (ko) * 2020-08-07 2026-01-07 후아웨이 테크놀러지 컴퍼니 리미티드 히트 라디에이터, 히트 라디에이터 제조 방법 및 라디오 원격 유닛
CN114364204A (zh) * 2021-11-23 2022-04-15 西安交通大学 一种电子设备的相变散热系统
CN114364204B (zh) * 2021-11-23 2023-08-22 西安交通大学 一种电子设备的相变散热系统
CN114302038A (zh) * 2021-12-22 2022-04-08 维沃移动通信有限公司 摄像头结构及电子设备
CN114302038B (zh) * 2021-12-22 2024-05-14 维沃移动通信有限公司 摄像头结构及电子设备
CN115955820A (zh) * 2022-12-28 2023-04-11 北京遥感设备研究所 一种相变储热控温板及其制造方法

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