WO2020155901A1 - 强化沸腾装置 - Google Patents

强化沸腾装置 Download PDF

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Publication number
WO2020155901A1
WO2020155901A1 PCT/CN2019/125970 CN2019125970W WO2020155901A1 WO 2020155901 A1 WO2020155901 A1 WO 2020155901A1 CN 2019125970 W CN2019125970 W CN 2019125970W WO 2020155901 A1 WO2020155901 A1 WO 2020155901A1
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WIPO (PCT)
Prior art keywords
heat
fins
evaporation cavity
enhanced boiling
boiling
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Ceased
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PCT/CN2019/125970
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English (en)
French (fr)
Inventor
李纯
胡广帆
姚春红
马秋成
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Smarth Technology Ltd
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Smarth Technology Ltd
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Priority to US17/426,179 priority Critical patent/US12085344B2/en
Priority to EP19913972.6A priority patent/EP3907457B1/en
Priority to JP2021544906A priority patent/JP2022519266A/ja
Publication of WO2020155901A1 publication Critical patent/WO2020155901A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips

Definitions

  • the invention belongs to the technical field of heat exchange devices, and in particular relates to an enhanced boiling device for electronic devices.
  • Phase change heat dissipation is becoming more and more popular as a high-efficiency heat dissipation method.
  • the principle of phase change heat dissipation is to use the phase change medium to boil and vaporize at a certain temperature to absorb heat, and then the gas is condensed and liquefied in other locations to release heat, thereby realizing heat transfer , Good heat transfer effect and wide application.
  • the evaporation and gasification stage is the key stage of the phase change heat transfer process, and the level of heat transfer efficiency directly affects the effect of phase change heat transfer.
  • the principle of enhancing the boiling heat transfer effect mainly includes increasing the number of boiling bubble cores, increasing the heat exchange area and avoiding the phenomenon of transitional boiling.
  • the main methods currently used to change the structure of the heat transfer surface include: mechanical processing, laser etching, chemical etching, sintering, etc.
  • the heat transfer surface is provided with grooves, raised structures and porous surfaces to increase the heat transfer area and increase the generation of bubble cores to achieve the purpose of enhancing boiling heat transfer.
  • the mechanical processing method has relatively good effect on processing the porous surface, but the method increases the number of bubble cores and it is difficult to process pores below 0.1mm. As the heat flow density increases, transitional boiling is prone to occur, resulting in a decrease in heat transfer capacity; In addition, mechanical processing methods have high processing costs and long manufacturing cycles, which cannot meet the requirements of large-scale and efficient production.
  • the metal sintering method can increase the number of bubble cores, but the sintered pores will affect the thermal conductivity of the material and thus the effective heat exchange area; other substances remain during the sintering process, which affects the performance of the phase change medium.
  • Laser etching and chemical etching have the disadvantages of limited etching depth, insufficient heat exchange area, and prone to transient boiling phenomenon.
  • the present invention provides an enhanced boiling device.
  • An enhanced boiling device includes an evaporation cavity with a cavity inside and enhanced boiling fins.
  • the enhanced boiling fins are arranged on the inner wall of the evaporation cavity.
  • the evaporation cavity is provided with a phase change heat medium.
  • the evaporation cavity The heat absorbed by the heat source is transferred to the phase-change heat medium through the inner wall surface, and the enhanced boiling fin can increase the number of vaporization cores on the inner wall surface of the evaporation cavity and increase the boiling heat exchange area to promote the phase-change heat medium Boiling vaporization and reducing boiling thermal resistance.
  • the enhanced boiling fins are a plurality of zigzag or wavy strip fins arranged on the inner wall surface of the evaporation cavity.
  • the strip-shaped heat sink is composed of a plurality of serrated fins or wavy fins, the smallest repeating unit in the serrated strip-shaped heat sink has a serration pitch of less than 1 mm, and the thickness of the serrated fins is less than 0.2 mm.
  • the serration spacing of the smallest repeating unit in the serrated strip heat sink is 0.0001 mm-1 mm, and the thickness of the serrated fins is 0.01 mm-0.2 mm.
  • a perforation or window structure is formed on the enhanced boiling fin.
  • the enhanced boiling fins are connected to the inner wall surface of the evaporation cavity by brazing.
  • the zigzag strip heat sink is a triangular zigzag or rectangular zigzag strip heat sink.
  • a plurality of strip-shaped radiating fins are arranged in parallel on the inner wall surface of the evaporation cavity, and the enhanced boiling device further includes an air-cooled heat dissipation component, and the channel direction of the plurality of strip-shaped radiating fins arranged in parallel is perpendicular to the wind direction of the air-cooled heat dissipation component.
  • the outer wall surface of the evaporation cavity is arranged in contact with the heat source, and the thickness of the side wall of the evaporation cavity in contact with the heat source is less than 2 mm.
  • the outer surface of the wall of the evaporation cavity has a contact heat absorption surface
  • the heat source has a heat source surface
  • the contact heat absorption surface of the evaporation cavity is in contact with the heat source surface of the heat source.
  • the enhanced boiling device of the present invention has high heat exchange efficiency, low production and processing costs, and mainly has the following advantages:
  • the densely distributed perforations or windows on the enhanced boiling fin greatly increase the number of bubble cores, that is, increase the number of boiling cores, reduce the diameter of bubbles, and make bubbles easier to form, thereby reducing heat transfer resistance;
  • the densely arranged perforations or windows can effectively control the size of bubbles, prevent the formation of steam columns, and avoid the formation of unstable gas films on the wall, thereby avoiding transitional boiling phenomena, increasing the heat flux density of boiling heat exchange, and increasing the heat flux of the phase-change heat medium Capillary force
  • the enhanced boiling fin and the evaporation cavity are connected by brazing as a whole, which reduces the contact thermal resistance between the fin and the evaporation cavity body;
  • the brazing process has high processing efficiency, low cost and high process maturity, and is suitable for mass production.
  • Figure 1 is a perspective view of the enhanced boiling device of the present invention
  • Figure 2 is an enlarged view of the enhanced boiling device of the present invention
  • Figure 3 is a top view of the enhanced boiling device of the present invention.
  • Figure 4 shows the window structure in the enhanced boiling device of the present invention.
  • Boiling heat transfer refers to the heat transfer process in which heat is transferred from the wall to the liquid to make the liquid boil and vaporize.
  • Vaporization core is the carrier that initiates liquid boiling.
  • Thermal conductivity It is defined as taking two parallel planes with a distance of 1 meter and an area of 1 square meter perpendicular to the direction of heat conduction. heat for a predetermined plane on the thermal conductivity of the material, in units of watt m -1 ⁇ opening -1 (w ⁇ m -1 ⁇ K -1).
  • Thermal resistance It is defined as the ratio between the temperature difference between the two ends of the object and the power of the heat source when heat is transferred to the object. The unit is Kelvin per Watt (K/W) or Celsius per Watt (°C/W).
  • Heat transfer coefficient refers to the temperature difference between the two sides of the enclosure structure is 1 degree (K or °C) under stable heat transfer conditions, and the heat transfer per unit area per unit time, the unit is watts/(square meter ⁇ degree) (W / ⁇ K, where K can be replaced by °C), reflecting the strength of the heat transfer process.
  • Heat flux The heat transferred through a unit area in a unit time is called heat flux.
  • q Q/(S*t)——Q is heat, t is time, S is cross-sectional area, unit of heat flux density: J/(m 2 ⁇ s).
  • Transitional boiling When the density of heat flow increases, a large amount of steam ejected from the core of vaporization forms a steam column. The steam flow obstructs the liquid that does not give to the heat transfer surface. The liquid dry up on the heat transfer surface in a short time, resulting in The temperature of the heat transfer surface rises sharply.
  • the enhanced boiling device of the present invention includes an evaporation cavity 10 and an enhanced boiling fin 20.
  • the evaporation cavity 10 may be a plate-shaped cavity with a cavity in the middle, or may include a plurality of sub-cavities connected to each other.
  • the enhanced boiling fin 20 is arranged inside the evaporation cavity 10, that is, connected to the inner wall surface of the evaporation cavity 10.
  • the outer surface of the side wall with the enhanced boiling fin 20 connected to the evaporation cavity 10 is connected to the heat source to Absorb the heat from the heating source.
  • the evaporation cavity 10 is provided with a phase-change heat medium.
  • the phase-change heat medium in the evaporation cavity 10 absorbs heat from the heating source and then boils and gasifies.
  • the enhanced boiling fins 20 can significantly increase the side wall of the evaporation cavity 10
  • the number of boiling gasification cores increases the heat exchange area and promotes the boiling and vaporization of the phase change heat medium.
  • the enhanced boiling fin 20 is a plurality of zigzag strip fins or corrugated strip fins arranged on the inner wall surface of the evaporation cavity 10, such as triangular zigzag or rectangular zigzag strip fins, or S-shaped corrugations With a strip-shaped heat sink, the plate surface of the enhanced boiling fin 20 extends in a direction perpendicular to the inner surface of the evaporation cavity 10 to facilitate heat dissipation.
  • the enhanced boiling fin 20 may be made of copper, aluminum, copper alloy, aluminum alloy, stainless steel and other materials.
  • a plurality of zigzag strip-shaped heat sinks are arranged in parallel on the inner surface of the side wall of the evaporation chamber 10.
  • the channel direction of the plurality of zigzag strip-shaped heat sinks is perpendicular to the wind direction, and the plurality of zigzags
  • the strip-shaped radiating fins are evenly arranged at intervals to ensure that the fluid flows evenly in the enhanced boiling fins 20.
  • a plurality of zigzag strip heat sinks can be arranged staggered to each other.
  • the serrated strip heat sink includes a plurality of serrated fins or wavy fins.
  • the serrated fins can be in the shape of triangular or rectangular serrated fins, for example, while the wavy fins are in the shape of a smooth transition arc wave.
  • the wavy fins are densely arranged to form a boiling strengthening structure.
  • the distance between two adjacent sawtooths is less than 1mm, such as 0.0001mm-1mm, which is the smallest repeating unit's sawtooth distance Less than 1mm to increase the heat exchange area.
  • the thickness of the sawtooth or wave plate is less than 0.2mm, such as 0.01mm-0.2mm, and the porosity of the sawtooth strip heat sink is less than 60%, such as 10%-60%, which is dense. Arranged zigzag or wavy strip heat sinks, while promoting vaporization and boiling, also reduce the difficulty of subsequent boiling core formation through the zigzag or wavy setting.
  • a perforated or windowed structure 21 may be formed on the serrated blade.
  • the perforated and windowed structure 21 can destroy the thermal boundary layer to improve heat transfer performance, increase the heat transfer coefficient of the enhanced boiling fin 20, and enhance the heat transfer effect.
  • the shape of the perforation can be circular, rectangular and elliptical.
  • the shape of the window in the window can be rectangular, elliptical and circular. The denser the number of perforations or windows, the better the heat dissipation effect. It can effectively reduce the diameter of boiling bubbles, that is, control the size of bubbles to prevent the formation of steam columns, thereby avoiding transitional boiling phenomenon.
  • the perforation or window structure formed on the sawtooth sheet can increase the heat flux density of boiling heat transfer and increase the phase transformation. The capillary force of the heating medium.
  • the enhanced boiling fin 20 is connected to the inner wall surface of the evaporation cavity 10 by brazing, so as to reduce the contact thermal resistance between the enhanced boiling fin 20 and the evaporation cavity 10 and reduce the temperature difference between the two.
  • the brazing process is simpler, less investment in brazing equipment, and high processing efficiency.
  • the evaporation cavity 10 is in direct contact with the heat source, that is, the outer surface of the side wall of the evaporation cavity 10 is in direct contact with the heat source, and the outer surface of the evaporation cavity 10 directly replaces the substrate of the existing heat sink to enhance the heat source and the evaporation cavity.
  • the outer wall surface of the evaporation cavity is arranged in contact with the heat source, and the thickness of the side wall of the evaporation cavity in contact with the heat source is less than 2 mm.
  • the evaporation cavity 10 is preferably a flat plate-shaped body with a cavity inside.
  • the internal cavity of the evaporation cavity 10 is a flat cavity.
  • One side wall of the evaporation cavity 10 has a contact heat absorption surface, and the heat source has a flat surface.
  • the heat source surface, the contact heat absorption surface of the evaporation cavity 10 and the heat source surface of the heat source are arranged in contact.
  • the area of the heat source surface of the above heat source is smaller than the area of the heat absorption surface of the evaporation cavity 10, and the internal phase-change heat medium can absorb heat from the heat source through phase-change flow and quickly transfer it in a two-dimensional direction, ensuring the evaporation cavity
  • the temperature in the body 10 is uniform.
  • the evaporation cavity 10 is used for direct heat dissipation of electronic devices, the heat source is directly installed on the evaporation cavity 10, the phase-change heat medium does not contact the heat source, and the heat is conducted through the side wall of the evaporation cavity 10
  • the enhanced boiling fins 20 are in contact with the side walls of the evaporation cavity 10 and the phase-change heat medium.
  • phase-change heat medium in the cavity 10 vaporizes and boils, and the enhanced boiling fins 20 can promote the liquid-to-gas conversion heat exchange of the phase-change heat medium, so that more heat from the heat source can be transferred to the phase change more quickly and evenly. Heat exchange medium.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
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Abstract

本发明公开了一种强化沸腾装置，包括内部具有空腔的蒸发腔体和强化沸腾翅片，强化沸腾翅片设置在蒸发腔体的内壁面上，蒸发腔体内部设置有相变换热介质，蒸发腔体吸收发热源的热量通过内壁面传递给相变换热介质，所述强化沸腾翅片可增加蒸发腔体的所述内壁的汽化核心数量和增加沸腾换热的面积，以促进相变换热介质沸腾汽化和降低沸腾热阻。本发明的强化沸腾装置具有以下优点：采用密集排布的强化沸腾翅片，最大限度地提高换热的面积，降低沸腾的换热热阻；强化沸腾翅片上分布密集的穿孔或窗口极大增加了气泡核心的数量，减小了气泡的直径大小，更容易形成气泡，从而降低换热热阻。

Description

强化沸腾装置 技术领域
本发明属于换热器件技术领域，尤其涉及一种用于电子器件的强化沸腾装置。
背景技术
相变散热作为一种高效率的散热方式日益普及，相变散热原理就是利用相变介质在一定温度下沸腾气化吸热，然后气体在其他位置冷凝液化以放热，从而实现了热量的传递，传热效果好、应用广泛。蒸发气化阶段是相变传热过程关键阶段，而传热效率的高低直接影响相变传热的效果。
为提高传热效率，增强沸腾换热效果，增强沸腾换热效果的原理主要包括增加沸腾的气泡核心数量，增加换热面积以及避免出现过渡沸腾现象。其中，目前主要采用的改变传热表面结构的方法有：机械加工、激光刻蚀、化学刻蚀法、烧结等。通过在传热表面设置槽道、凸起结构以及多孔表面，来增大换热面积，增加气泡核心的生成，以达到强化沸腾换热的目的。
机械加工方法加工出多孔表面效果相对较好，但该方法增加气泡核心数量有限，很难加工出0.1mm以下的孔隙，随着热流密度增高，容易出现过渡沸腾的现象，导致传热能力下降；此外，机械加工方法加工成本很高，制造周期也长，不能满足规模、高效生产的要求。
金属烧结的方式能很好增加气泡核心数量，但烧结出的孔隙会影响材料的热导率从而影响有效的换热面积；烧结过程中存在其它物质残留，影响相变介质的性能。
激光蚀刻和化学蚀刻法存在蚀刻深度有限，换热面积不足以及极易出现过渡沸腾现象等缺点。
因此，本领域中需设计一种沸腾换热热阻低、传热热流密度高，生产成本低，生产效率高的强化沸腾装置。
发明内容
为解决上述现有技术中的问题，本发明提供了一种强化沸腾装置。
为实现上述目的，本发明的强化沸腾装置的具体技术方案如下：
一种强化沸腾装置，包括内部具有空腔的蒸发腔体和强化沸腾翅片，强化沸腾翅片设置在蒸发腔体的内壁面上，蒸发腔体内部设置有相变换热介质，蒸发腔体吸收发热源的热量通过内壁面传递给相变换热介质，所述强化沸腾翅片可增加蒸发腔体的所述内壁面的汽化核心数量和增加沸腾换热的面积以促进相变换热介质沸腾汽化和降低沸腾热阻。
进一步，所述强化沸腾翅片为设置在蒸发腔体的内壁面上的多个锯齿状或波浪状的条形散热片。
进一步，所述条形散热片由多个锯齿片或波浪片聚集组成，锯齿状条形散热片中最小重复单元的锯齿间距小于1mm，锯齿片的厚度小于0.2mm。
进一步，锯齿状条形散热片中最小重复单元的锯齿间距为0.0001mm-1mm，锯齿片的厚度为0.01mm-0.2mm。
进一步，强化沸腾翅片上形成有穿孔或开窗结构。
进一步，强化沸腾翅片通过钎焊方式连接在蒸发腔体的内壁面上。
进一步，锯齿状条形散热片为三角锯齿状或矩形锯齿状条形散热片。
进一步，多个条形散热片平行排列在蒸发腔体的内壁面上，强化沸腾装置还包括风冷散热组件，多个条形散热片平行排布的通道方向与风冷散热组件的风向垂直。
进一步，蒸发腔体的外壁面与发热源接触设置，与发热源接触的蒸发腔体的侧壁厚度小于2mm。
进一步，蒸发腔体的壁外表面具有接触吸热面，发热源具有热源面，蒸发腔体的接触吸热面与发热源的热源面接触。
本发明的强化沸腾装置换热高效，生产加工成本低，并主要具有以下优点：
1)采用密集排布的强化沸腾翅片，最大限度地提高换热的面积，降低沸腾的换热热阻；
2)强化沸腾翅片上分布密集的穿孔或窗口极大增加了气泡核心数量，即提高了沸腾核心的数量，减小了气泡的直径大小，更容易形成气泡，从而降低换热热阻；
3)密集设置的穿孔或窗口，能有效控制气泡大小，防止形成蒸汽柱，避免壁面形成不稳定气膜，从而避免出现过渡沸腾现象，提高沸腾换热的热流密度，增加相变换热介质的毛细力；
4)强化沸腾翅片和蒸发腔体采用钎焊连接为一体，减少了翅片与蒸发腔本体间的接触热阻；
5)相对于机加工、激光刻蚀和化学刻蚀等工艺方法，钎焊工艺加工效率高、成本低、工艺成熟度高，适合大批量规模化生产。
附图说明
图1为本发明强化沸腾装置的透视图；
图2为本发明强化沸腾装置的放大图；
图3为本发明强化沸腾装置的俯视图；
图4为本发明强化沸腾装置中的开窗结构。
具体实施方式
为了更好地了解本发明的目的、结构及功能，下面结合附图，对本发明的强化沸腾装置做进一步详细的描述。
本发明中的相关术语解释如下：
沸腾换热：是指热量从壁面传给液体，使液体沸腾汽化的传热过程。
气化核心：汽化核心是启动液体沸腾的载体。
热导率：定义为在物体内部垂直于导热方向取两个相距1米，面积为1平方米的平行平面，若两个平面的温度相差1K，则在1秒内从一个平面传导至另一个平面的热量就规定为该物质的热导率，其单位为瓦特·米 -1·开 -1(W·m -1·K -1)。
热阻：定义为当有热量在物体上传输时，在物体两端温度差与热源的功率 之间的比值。单位为开尔文每瓦特(K/W)或摄氏度每瓦特(℃/W)。
传热系数：是指在稳定传热条件下，围护结构两侧空气温差为1度(K或℃)，单位时间通过单位面积传递的热量，单位是瓦/(平方米·度)(W/·K，此处K可用℃代替)，反映了传热过程的强弱。
热流密度：单位时间内通过单位面积传递的热量称热流密度。q＝Q/(S*t)——Q为热量，t为时间，S为截面面积，热流密度的单位：J/(m 2·s)。
过渡沸腾：当热流密度增大，由大量的汽化核心处喷出的蒸汽形成蒸汽柱，伴随蒸汽流对向传热面不给的液体产生了妨碍，短时间在传热面出现液体干涸，导致传热面的温度急剧上升。
本发明的强化沸腾装置包括蒸发腔体10和强化沸腾翅片20，蒸发腔体10可以是中部具有空腔的板状腔体，也可以是包括多个彼此连通的子腔体。强化沸腾翅片20设置在蒸发腔体10内部，也即连接在蒸发腔体10的内壁面上，蒸发腔体10上连接有强化沸腾翅片20的侧壁的外侧面与发热源相连，以吸收发热源的热量。蒸发腔体10内部设置有相变换热介质，蒸发腔体10内的相变换热介质吸收发热源的热量后沸腾气化，其中强化沸腾翅片20可显著增加蒸发腔体10侧壁的沸腾气化核心的数量，增加换热面积，促进相变换热介质沸腾汽化。
强化沸腾翅片20为设置在蒸发腔体10的内壁面上的多个锯齿状条形散热片或波纹状条形散热片，例如三角锯齿状或矩形锯齿状条形散热片，或者S形波纹状条形散热片，强化沸腾翅片20的板面沿垂直于蒸发腔体10内表面的方向延伸，以方便向外散热。强化沸腾翅片20可以采用铜、铝、铜合金、铝合金、不锈钢等材料制成。
多个锯齿状条形散热片平行排列在蒸发腔体10侧壁的内表面上，对于包含风冷散热的情形，多个锯齿状条形散热片排布的通道方向与风向垂直，多个锯齿状条形散热片间隔均匀排布，以确保流体在强化沸腾翅片20中均匀流动。多个锯齿状条形散热片可彼此错齿排布。
锯齿状条形散热片包括多个的锯齿翅片或波浪翅片，锯齿翅片例如可以三角锯齿或矩形锯齿的形状，波浪翅片则为平滑过渡的弧形波浪状，多个锯齿翅片和波浪翅片密集排布组成沸腾强化结构，相邻的两锯齿片之间的间距(相邻两个对应波峰位置的间距)小于1mm，如0.0001mm-1mm，也即最小重复单元的 锯齿的间距小于1mm，以增大换热面积，锯齿片或波浪片的厚度小于0.2mm，如0.01mm-0.2mm，锯齿状条形散热片的孔隙率小于60％，如10％-60％，上述密集排布的锯齿状或波浪状条形散热片，在促进汽化沸腾的同时，还通过锯齿形状或波浪状的设置降低后续沸腾核心形成的难度。
锯齿片上可形成有穿孔或开窗结构21，穿孔和开窗结构21能破坏热边界层来提升传热性能，提高强化沸腾翅片20的换热系数，增强换热效果。穿孔的形状可以是圆形、矩形和椭圆形孔，开窗中窗口的形状可以是矩形、椭圆形和圆形，穿孔或窗口的数量越密，散热效果越好。能有效降低减少沸腾气泡的直径，也即控制气泡的大小，防止形成蒸汽柱，从而避免出现过渡沸腾现象，锯齿片上形成的穿孔或开窗结构可提高沸腾换热的热流密度，增加相变换热介质的毛细力。
强化沸腾翅片20通过钎焊方式连接在蒸发腔体10的内壁面，以减少强化沸腾翅片20与蒸发腔体10之间的接触热阻，降低两者间的温差。钎焊工艺相对于微机加工、激光刻蚀和化学刻蚀等工艺方法，工艺过程更简单，钎焊设备投资少，加工效率高。
蒸发腔体10与发热源直接接触，也即蒸发腔体10侧壁的外表面与发热源直接接触，蒸发腔体10的外表面直接代替现有散热装置的基板，以提升发热源与蒸发腔体10部的热传递效率，优选地，蒸发腔体的外壁面与发热源接触设置，并且与发热源接触的蒸发腔体的侧壁厚度小于2mm。蒸发腔体10优选为内部具有空腔的平面板状体，蒸发腔体10的内部空腔为平面状空腔，蒸发腔体10的一侧壁具有接触吸热面，发热源具有平面状的热源面，蒸发腔体10的接触吸热面与发热源的热源面接触设置。
上述发热源的热源面的面积小于蒸发腔体10的接触吸热面的面积，内部相变换热介质通过相变流动可将热量从发热源吸收而沿二维方向快速传递，可确保蒸发腔体10中的温度均匀。
本发明的强化沸腾装置中，蒸发腔体10用于电子器件直接散热，发热源直接安装在蒸发腔体10上，相变换热介质不与发热源接触，热量通过蒸发腔体10侧壁传导给强化沸腾翅片20，强化沸腾翅片20与蒸发腔体10侧壁以及相变换热介质接触。
由此，由于蒸发腔体10中设置了密集而均匀的多个锯齿状条形散热片或波纹状条形散热片，这种结构有助于产生大量的气泡核心，大量的气泡核心可促进蒸发腔体10中的相变换热介质汽化沸腾，强化沸腾翅片20可促进相变换热介质的液气转化换热，使发热源的热量更多、更快速、更均匀地传递给相变换热介质。
可以理解，本发明是通过一些实施例进行描述的，本领域技术人员知悉的，在不脱离本发明的精神和范围的情况下，可以对这些特征和实施例进行各种改变或等效替换。另外，在本发明的教导下，可以对这些特征和实施例进行修改以适应具体的情况及材料而不会脱离本发明的精神和范围。因此，本发明不受此处所公开的具体实施例的限制，所有落入本申请的权利要求范围内的实施例都属于本发明所保护的范围内

Claims (10)

  1. 一种强化沸腾装置，包括内部具有空腔的蒸发腔体和强化沸腾翅片，其特征在于，强化沸腾翅片设置在蒸发腔体的内壁面上，蒸发腔体内部设置有相变换热介质，蒸发腔体吸收发热源的热量通过内壁面传递给相变换热介质，所述强化沸腾翅片可增加蒸发腔体的所述内壁面的汽化核心数量和增加沸腾换热的面积，以促进相变换热介质沸腾汽化和降低沸腾热阻。
  2. 根据权利要求1所述的强化沸腾装置，其特征在于，所述强化沸腾翅片为设置在蒸发腔体的内壁面上的多个锯齿状或波浪状的条形散热片。
  3. 根据权利要求2所述的强化沸腾装置，其特征在于，所述条形散热片由多个锯齿片或波浪片聚集组成，锯齿状条形散热片中最小重复单元的锯齿间距小于1mm，锯齿片的厚度小于0.2mm。
  4. 根据权利要求3所述的强化沸腾装置，其特征在于，锯齿状条形散热片中最小重复单元的锯齿间距为0.0001mm-1mm，锯齿片的厚度为0.01mm-0.2mm。
  5. 根据权利要求2所述的强化沸腾装置，其特征在于，强化沸腾翅片上形成有穿孔或开窗结构。
  6. 根据权利要求2所述的强化沸腾装置，其特征在于，强化沸腾翅片通过钎焊方式连接在蒸发腔体的内壁面上。
  7. 根据权利要求2所述的强化沸腾装置，其特征在于，锯齿状条形散热片为三角锯齿状或矩形锯齿状条形散热片。
  8. 根据权利要求2所述的强化沸腾装置，其特征在于，多个条形散热片平行排列在蒸发腔体的内壁面上，强化沸腾装置还包括风冷散热组件，多个条形散热片平行排布的通道方向与风冷散热组件的风向垂直。
  9. 根据权利要求2所述的强化沸腾装置，其特征在于，蒸发腔体的外壁面与发热源接触设置，与发热源接触的蒸发腔体的侧壁厚度小于2mm。
  10. 根据权利要求9所述的强化沸腾装置，其特征在于，蒸发腔体的侧壁外表面具有接触吸热面，发热源具有热源面，蒸发腔体的接触吸热面与发热源的热源面接触。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113357953A (zh) * 2021-04-28 2021-09-07 西安交通大学 一种浸没式液冷烧结多孔毛细芯耦合微通道散热装置
CN113543588A (zh) * 2021-06-24 2021-10-22 西安交通大学 一种射流-横流组合浸没式散热装置与方法
CN114980667A (zh) * 2022-05-12 2022-08-30 西安交通大学 一种被动式热控系统

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109883227A (zh) 2019-01-29 2019-06-14 株洲智热技术有限公司 强化沸腾装置
CN115942717B (zh) * 2023-01-09 2025-11-07 深圳见炬科技有限公司 一种三维蒸汽腔散热装置
CN116761395A (zh) * 2023-06-15 2023-09-15 中国科学院电工研究所 一种基于3d打印的相变冷却强化结构及散热器
CN116981221A (zh) * 2023-07-21 2023-10-31 中国科学院电工研究所 一种沸腾换热强化结构及具有其的散热器

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030159806A1 (en) * 2002-02-28 2003-08-28 Sehmbey Maninder Singh Flat-plate heat-pipe with lanced-offset fin wick
US20040196633A1 (en) * 2003-02-27 2004-10-07 Shwin-Chung Wong Microchannel heat pipe with parallel grooves for recycling coolant
JP2005093467A (ja) * 2003-09-12 2005-04-07 Fuji Heavy Ind Ltd 放熱器及び放熱器の製造方法
CN100583419C (zh) * 2005-03-28 2010-01-20 英特尔公司 用于改进的无源液体冷却的系统
CN202885616U (zh) * 2012-06-28 2013-04-17 华南理工大学 一种辐射状渐宽式翅结构沟槽平板热管
CN203586895U (zh) * 2013-06-05 2014-05-07 华南理工大学 一种具有分形槽-孔结构的均热板蒸发吸液芯
CN104864755A (zh) * 2015-05-29 2015-08-26 厦门大学 一种具有翅片-内嵌槽的平板热管吸液芯及其制造方法
CN205425915U (zh) * 2015-12-15 2016-08-03 日立永济电气设备（西安）有限公司 平板热管散热器
CN109883227A (zh) * 2019-01-29 2019-06-14 株洲智热技术有限公司 强化沸腾装置
CN209877719U (zh) * 2019-01-29 2019-12-31 株洲智热技术有限公司 强化沸腾装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944344A (en) * 1988-10-31 1990-07-31 Sundstrand Corporation Hermetically sealed modular electronic cold plate utilizing reflux cooling
JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
JP3654326B2 (ja) * 1996-11-25 2005-06-02 株式会社デンソー 沸騰冷却装置
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6293333B1 (en) * 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
US6834515B2 (en) * 2002-09-13 2004-12-28 Air Products And Chemicals, Inc. Plate-fin exchangers with textured surfaces
US20050141195A1 (en) * 2003-12-31 2005-06-30 Himanshu Pokharna Folded fin microchannel heat exchanger
CN1805133A (zh) 2005-01-14 2006-07-19 杨洪武 板式热管散热器
CN100498187C (zh) * 2007-01-15 2009-06-10 高克联管件(上海)有限公司 一种蒸发冷凝兼备型传热管
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
CN101957151A (zh) * 2009-07-13 2011-01-26 富准精密工业(深圳)有限公司 平板式热管及应用该平板式热管的散热器
CN102305569A (zh) * 2011-08-16 2012-01-04 江苏萃隆精密铜管股份有限公司 一种蒸发器用的热交换管
CN103629962A (zh) * 2012-08-23 2014-03-12 富瑞精密组件（昆山）有限公司 热管及其制造方法
JP2014088978A (ja) * 2012-10-29 2014-05-15 Toshiba Corp 伝熱部材製造方法、伝熱部品製造方法、伝熱部材および伝熱部品
CN203563290U (zh) * 2013-11-11 2014-04-23 华北电力大学 翅片内置多通道热管的一体化相变散热装置
JP2016003778A (ja) * 2014-06-13 2016-01-12 富士電機株式会社 ループ型サーモサイフォン
US10201119B2 (en) * 2015-06-02 2019-02-05 Hamilton Sundstrand Corporation System and method of alternate cooling of a liquid cooled motor controller
US10677501B2 (en) * 2015-09-24 2020-06-09 University Of Florida Research Foundation, Incorporated Component and efficient plate and frame absorber
CN206772105U (zh) * 2017-01-23 2017-12-19 中车大连机车研究所有限公司 一种复合吸液芯式异形热管散热器
CN208026113U (zh) * 2018-04-04 2018-10-30 中山莱通金属科技有限公司 具有支撑柱的均温板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030159806A1 (en) * 2002-02-28 2003-08-28 Sehmbey Maninder Singh Flat-plate heat-pipe with lanced-offset fin wick
US20040196633A1 (en) * 2003-02-27 2004-10-07 Shwin-Chung Wong Microchannel heat pipe with parallel grooves for recycling coolant
JP2005093467A (ja) * 2003-09-12 2005-04-07 Fuji Heavy Ind Ltd 放熱器及び放熱器の製造方法
CN100583419C (zh) * 2005-03-28 2010-01-20 英特尔公司 用于改进的无源液体冷却的系统
CN202885616U (zh) * 2012-06-28 2013-04-17 华南理工大学 一种辐射状渐宽式翅结构沟槽平板热管
CN203586895U (zh) * 2013-06-05 2014-05-07 华南理工大学 一种具有分形槽-孔结构的均热板蒸发吸液芯
CN104864755A (zh) * 2015-05-29 2015-08-26 厦门大学 一种具有翅片-内嵌槽的平板热管吸液芯及其制造方法
CN205425915U (zh) * 2015-12-15 2016-08-03 日立永济电气设备（西安）有限公司 平板热管散热器
CN109883227A (zh) * 2019-01-29 2019-06-14 株洲智热技术有限公司 强化沸腾装置
CN209877719U (zh) * 2019-01-29 2019-12-31 株洲智热技术有限公司 强化沸腾装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3907457A4 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113357953A (zh) * 2021-04-28 2021-09-07 西安交通大学 一种浸没式液冷烧结多孔毛细芯耦合微通道散热装置
CN113543588A (zh) * 2021-06-24 2021-10-22 西安交通大学 一种射流-横流组合浸没式散热装置与方法
CN113543588B (zh) * 2021-06-24 2022-06-07 西安交通大学 一种射流-横流组合浸没式散热装置与方法
CN114980667A (zh) * 2022-05-12 2022-08-30 西安交通大学 一种被动式热控系统

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TWM596329U (zh) 2020-06-01
CN109883227A (zh) 2019-06-14
JP2022519266A (ja) 2022-03-22
US12085344B2 (en) 2024-09-10
TW202028676A (zh) 2020-08-01

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