WO2020160696A1 - 一种led软灯条 - Google Patents

一种led软灯条 Download PDF

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Publication number
WO2020160696A1
WO2020160696A1 PCT/CN2019/107120 CN2019107120W WO2020160696A1 WO 2020160696 A1 WO2020160696 A1 WO 2020160696A1 CN 2019107120 W CN2019107120 W CN 2019107120W WO 2020160696 A1 WO2020160696 A1 WO 2020160696A1
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WO
WIPO (PCT)
Prior art keywords
led
flip chip
series
led flip
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/107120
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English (en)
French (fr)
Inventor
李雄伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Lande Electronics Co Ltd
Original Assignee
Zhongshan Lande Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhongshan Lande Electronics Co Ltd filed Critical Zhongshan Lande Electronics Co Ltd
Priority to JP2020530967A priority Critical patent/JP7108326B2/ja
Priority to EP19880936.0A priority patent/EP3719387B1/en
Priority to CN201980005293.3A priority patent/CN111670319A/zh
Priority to AU2019382303A priority patent/AU2019382303B2/en
Priority to US16/882,532 priority patent/US11092318B2/en
Publication of WO2020160696A1 publication Critical patent/WO2020160696A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Definitions

  • the invention relates to the technical field of LED lighting, in particular to an LED flexible light bar.
  • LED lights have significant energy-saving and life-span advantages. With the development of society, the problem of lighting energy consumption in daily life has become increasingly prominent. Therefore, LED lamps with significant energy-saving advantages are becoming more and more popular.
  • the core component of the LED lamp is the LED chip. Its main function is to convert electrical energy into light energy.
  • the packaging method and assembly process method directly affect the energy consumption and lighting effect of the lamp.
  • the LED flexible light bar is a special process for welding the LED light on a copper wire or a ribbon-shaped flexible circuit board, and then connected to a power source to emit light. It is named because it is shaped like a light strip when it emits light, and is widely used in buildings. Used for decoration or lighting in areas such as objects, bridges, roads, gardens, courtyards, floors, ceilings, furniture, cars, ponds, underwater, advertisements, signs, signs, etc.
  • the LED flexible strips on the market are usually composed of flexible circuit boards and LED light-emitting chips.
  • SMT technology is used to paste the chips on the flexible circuit board.
  • the process is complex, and the quality of important links such as chip bracket welding, fixing, and dispensing is difficult to control, and quality problems such as glue explosion, false welding, and vulcanization are prone to occur, and the defective rate in the production process is high.
  • the purpose of the present invention is to provide a flexible LED light bar using LED flip-chips to solve the problem of complex processing technology and high defect rate of the LED light bar proposed in the background art.
  • the present invention provides the following technical solutions:
  • a flexible LED light bar includes a circuit board on which at least one LED flip chip is arranged on the upper end of the circuit board, and the LED flip chip and the circuit board are connected together by a plurality of solder paste bumps. Further, the LED flip chip is also covered with toning glue.
  • the flexible LED light bar further includes a flexible housing, and the circuit board is arranged in the flexible housing.
  • circuit board is a flexible circuit board or a rigid circuit board.
  • the wiring on the circuit board has the same separation distance.
  • the minimum distance between two adjacent solder paste bumps of the same LED flip chip is 0.12 mm.
  • the minimum distance between the LED flip chips is 0.08 mm.
  • the flexible circuit board includes a top insulating film, a conductive circuit layer in the middle layer, and a bottom insulating film;
  • the conductive circuit layer includes two power lines, a plurality of series lines and/or parallel lines, and the LED is flipped The chip is soldered on the series line and/or the parallel line;
  • the top insulating film is provided with a first through hole at a position corresponding to each LED flip chip, and the LED flip chip is accommodated in the first through hole.
  • the series line includes a series line body
  • the parallel line includes a parallel line body
  • an end of the series line body and/or the parallel line body close to the LED flip chip integrally extends a section of welding branch, the welding The width of the branch is smaller than the width of the series line body or the parallel line body, and the LED flip chip is soldered to the end of the welding branch;
  • the top insulating film is pasted to cover at least a part of the welding branch close to the series wire body or the parallel wire body;
  • the width of the welding branch is less than half of the width of the series wire body or the parallel wire body;
  • An end of the soldering branch close to the LED flip chip integrally extends with a bonding pad, the width of the bonding pad is greater than the width of the bonding branch body, and the width or length of the bonding pad is greater than or equal to the width of the LED flip chip.
  • the electrode is soldered directly on the pad.
  • each LED flip chip is provided with a color matching glue, and the color matching glue covers at least the LED flip chip and the first through hole;
  • the power line and the series line are on the same level, and the power line is on both sides of the series line; the LED flip chip is connected in series through the series line and then connected in parallel to the two power lines.
  • the welding branches from two adjacent series lines are not the same In a straight line, the two soldering branches are arranged in parallel up and down, and the LED flip chip is placed horizontally, and the length of the LED flip chip is consistent with the width of the flexible circuit board; or, the soldering branch extending from two adjacent series lines Located on the same line, the LED flip chip is placed vertically, and the length of the LED flip chip is consistent with the length of the flexible circuit board;
  • the LED flip chips are connected in parallel to two power lines through parallel lines respectively;
  • the power line and the series line are located on two different levels.
  • the two power lines are located below the series line.
  • the LED flip chip is connected in series through the series line and then connected to the two power lines in parallel. There is a connection between the power line and the series line. Interlayer insulating film.
  • the product structure and process are streamlined, the yield rate is higher, and the manufacturing cost is lower: the product structure is simplified, the conventional bracket structure is removed, and the LED flip chip is directly soldered on the circuit board through solder paste, eliminating the need for brackets Fixing, die bonding, wire bonding and other processes reduce the occurrence of defective products such as glue explosion, virtual welding, vulcanization, and reduce the input of production equipment and labor to achieve the purpose of reducing production costs;
  • Figure 1 is a three-dimensional schematic diagram of Embodiment 1 of the LED flexible light bar of the present invention.
  • Embodiment 1 is a schematic diagram of the internal planar structure of Embodiment 1 of the LED flexible light bar of the present invention
  • Embodiment 2 is a schematic diagram of the three-dimensional structure of Embodiment 2 of the LED flexible light bar of the present invention.
  • Embodiment 3 of the LED flexible light bar of the present invention is a perspective view of Embodiment 3 of the LED flexible light bar of the present invention.
  • Embodiment 3 is an exploded view of Embodiment 3 of the flexible LED flip-chip flexible light bar of the present invention.
  • FIG. 6 is an enlarged view of part A in FIG. 5;
  • FIG. 7 is a top view of Embodiment 3 of the flexible LED flip-chip flexible light bar of the present invention.
  • Figure 8 is a sectional view of A-A in Figure 7;
  • FIG. 9 is a top view of the embodiment 3 of the flexible LED flip-chip flexible light bar of the present invention with the top insulating film removed;
  • Figure 10 is an enlarged view of part B in Figure 9;
  • Embodiment 4 is a perspective view of Embodiment 4 of the flexible LED flip-chip flexible light bar of the present invention.
  • Fig. 12 is an enlarged view of part C in Fig. 11.
  • Embodiment 1 is used under high voltage conditions (80-130V, 200-240V), please refer to Figure 1 to Figure 2.
  • the present invention provides a flexible LED light bar, which includes a flexible housing 1, and a circuit board 2 is arranged in the flexible housing 1 At least one LED flip chip 3 is arranged on the upper end of the circuit board 2, and the LED flip chip 3 and the circuit board 2 are connected together by a plurality of solder paste bumps 16.
  • the circuit board 2 is a rigid circuit board (PCB). If a rigid circuit board is used, a small piece of rigid circuit board can be fixed on a soft carrier tape to realize the bending of the light bar.
  • PCB rigid circuit board
  • the wiring on the circuit board 2 has the same spacing distance, which is convenient for simplifying the assembly line production process and improving the production efficiency.
  • the minimum distance between two adjacent solder paste bumps 16 of the same LED flip chip 3 is 0.12 mm.
  • the size can be changed according to the different needs of the product and the size of the LED flip chip.
  • the upper surface of the LED flip chip 3 is also covered with a color-adjusting glue 14 for adjusting the color temperature and color of the light, playing a role of insulation, and protecting the LED flip chip 3.
  • Toning glue 14 is a soft glue.
  • the LED flip chip 3 is a blue LED flip chip 3
  • the toning glue 14 is formed by mixing phosphor powder in transparent silica gel.
  • the color temperature and color of light can be adjusted by adding phosphor powder to silica gel.
  • Table 1 and Table 2 are two kinds of powder mixing records.
  • the minimum distance between the LED flip chips (3) is 0.08 mm.
  • the LED flip chip 3 According to the parameter specifications of the LED flip chip 3 used, select and design the appropriate flexible or rigid circuit board 2, set the appropriate pad specifications of the soldering furnace, and set the dispensing parameters. After all the preparation processes are completed, start the soldering equipment and point Glue equipment and silicone shell molding equipment, solder the LED flip chip 3 and the circuit board 2 together by solder paste, and dispense the LED flip chip 3 substrate to protect, and finally the entire product is externally molded with a flexible shell 1 to complete the product production . When the product is energized, the LED flip chip 3 converts electrical energy into light energy to achieve light; according to the material of the internal circuit board 2, the flexible housing 1 can be bent and deformed appropriately, but direct 90° right-angle bending should be avoided .
  • Embodiment 2 is used under low voltage conditions (12V, 24V, 36V). Please refer to Figure 3. Its structure is roughly the same as that of Embodiment 1. The main difference is that the flexible housing 1 is removed; and there are 350 LED flip chips 3,350 Each flip chip 3 adopts a series-parallel connection of 7 series and 50 parallel.
  • the structure of the third embodiment is basically the same as that of the first embodiment, and the main difference is that the circuit board 2 is a flexible circuit board (FPC).
  • FPC flexible circuit board
  • the flexible circuit board 2 includes a top insulating film 4, an intermediate conductive circuit layer 5, and a bottom insulating film 6;
  • the conductive circuit layer 5 includes two power lines 7, a plurality of A series line 8, the LED flip chip 3 is soldered on the series line 8;
  • the top insulating film 4 is provided with a first through hole 9 corresponding to each LED flip chip 3, and the LED flip chip 3 is accommodated In the first through hole 9.
  • the series line 8 includes a series line body 10, one end of the series line body 10 close to the LED flip chip 3 integrally extends a section of welding branch 11, the width of the welding branch 11 is smaller than that of the series line body 10.
  • the LED flip chip 3 is soldered to the end of the soldering branch 11.
  • the series wire body 10 extends with a thinner welding branch 11 that can act as a force buffer. Because the welding branch 11 is thinner and has high flexibility, when the LED strip light 1 is bent, basically only the series wire body 10 is Bending force, while the thin and soft soldering branch 11 bears very little force.
  • the soldering branch 11 is used for soldering flip-chip LED flip-chip 3 with less force, so that the LED flip-chip 3 will not look like a SMD LED In that way, the LED strip light 1 is forced to break and break when it is bent, and the quality is more reliable.
  • the top insulating film 4 is pasted to cover a part of the soldering branch 11 close to the series line body 10. Since the widths of the welding branch 11 and the serial cable body 10 are different, the welding branch 11 is relatively susceptible to breakage by external force when the connection point connected to the serial cable body 10 is bent multiple times, just like the connection between a plug and a wire The reason for easy disconnection is the same.
  • the top insulating film 4 is used to paste and cover at least a part of the welding branch 11a close to the series line body 10, and the other part of the welding branch 11b is exposed in the first through hole 9, and the connection L between the welding branch 11 and the series line body 10 is covered by the top insulating film 4 Paste protection, so that the joint L will not be broken by force, and the quality is more reliable.
  • an end of the soldering branch 11 close to the LED flip chip 3 integrally extends with a pad 12, the width of the pad 12 is greater than the width of the soldering branch body 13, and the length of the pad 12 is greater than the width of the LED flip chip 3.
  • the electrode of the LED flip chip 3 is directly soldered on the bonding pad 12. Under the premise of ensuring that the LED flip chip 3 has enough soldering area, the soldering branch 11 can be made thinner and softer to achieve a better force buffer effect, so that the LED flip chip 3 solder joints are less susceptible to bending Cracked by external force.
  • a color matching glue 14 is provided at a position corresponding to each LED flip chip 3, and the color matching glue 14 covers at least the LED flip chip 3 and the first through hole 9.
  • the chip resistor 15 is also included, and the chip resistor 15 is electrically connected laterally between the series line 8 on the outermost side and the power line 7.
  • Example 3 is a series connection scheme.
  • the LED flip chip 3 is placed horizontally: the power line 7 and the series line 8 are on the same level, and the power line 7 is located on both sides of the series line 8; the LED flip chip 3 is connected in series through the series line 8 Then connect to the two power lines 7 in parallel.
  • the welding branches 11 extending from the two adjacent series wires 8 are not on the same straight line.
  • the two welding branches 11 are arranged in parallel up and down, and the pads 12 on the two welding branches 11 Located on the same straight line in the up and down direction, the LED flip chip 3 is soldered on the upper and lower pads 12 laterally, and the length direction of the LED flip chip 3 is consistent with the width direction of the flexible circuit board 2.
  • Embodiment 4 is another series scheme, the LED flip chip 3 is placed vertically: the power line 7 is located on both sides of the series line 8, and the LED The flip chip 3 is connected in series through the series line 8 and then connected in parallel to the two power lines 7.
  • the welding branches 11 extending from the two adjacent series lines 8 are located on the same straight line, and the width of the pad 12 is larger than that of the LED flip chip 3.
  • the LED flip chip 3 is placed longitudinally, and the length of the LED flip chip 3 is consistent with the length of the flexible circuit board 2.
  • the structure of the embodiment 5 is substantially the same as that of the embodiment 3, and the main difference is that: the embodiment 5 is a parallel solution: the LED flip chips 3 are connected in parallel to the two power lines 7 through parallel wires respectively.
  • Example 6 The structure of Example 6 is basically the same as that of Example 3. The main difference is: Example 5 is another series solution, the series line 8 and the power line 7 are separated into two layers: the power line 7 and the series line 8 are located in two different layers. At the level, the two power lines 7 are located below the series line 8. The LED flip chip 3 is connected in series through the series line 8 and then connected to the two power lines 7 in parallel. An intermediate layer of insulation is provided between the power line 7 and the series line 8. membrane.
  • the product structure and process are streamlined, the yield rate is higher, and the manufacturing cost is lower: the product structure is simplified, the conventional bracket structure is removed, and the LED flip chip is directly soldered on the circuit board through solder paste, eliminating the need for brackets Fixing, die bonding, wire bonding and other processes reduce the appearance of defective products such as glue explosion, virtual welding, vulcanization, and reduce the input of production equipment and labor to achieve the purpose of reducing production costs.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED软灯条，包括线路板（2），线路板（2）上端排列设置有LED倒装芯片（3），LED倒装芯片（3）与线路板（2）通过若干锡膏凸点（16）连接在一起。与现有技术相比，具有产品结构简单，生产设备的投入较少，人力的需求减少，易于实现流水线生产，生产效率较高，生产制造成本较低等有益效果，同时适用于柔性和硬性两种线路板，适用范围广泛。

Description

一种LED软灯条 技术领域
本发明涉及LED照明技术领域，具体涉及一种LED软灯条。
背景技术
LED灯作为第四代照明光源，具有显著的节能和寿命优势。随着社会的发展，日常生活中的照明能耗问题日益突出，因此，具有显著节能优势的LED灯具越来越受人们的青睐。LED灯的核心组件为LED芯片，其主要功能是将电能转化为光能，其封装方式和装配工艺方法都直接影响到灯具的能耗和照明效果。
LED软灯条，是把LED灯用特殊的加工工艺焊接在铜线或者带状柔性线路板上面，再连接上电源发光，因其发光时形状如一条光带而得名，被广泛应用在建筑物、桥梁、道路、花园、庭院、地板、天花板、家具、汽车、池塘、水底、广告、招牌、标志等领域，用作装饰或照明。目前市面上的LED软灯条通常由软线路板、LED发光芯片组成，经过支架、固晶、焊线、点胶、分光等多道工序，再运用SMT技术将芯片贴在软性线路板上，工艺复杂，芯片的支架焊接、固定、点胶等重要环节的品质较难控制，容易出现爆胶、虚焊、硫化等质量问题，生产过程中不良率较高。
因此，需要提出一种新的LED软灯条，对目前的灯条的常见缺陷进行改进。
发明内容
本发明的目的在于提供一种采用LED倒装芯片的LED软灯条，以解决背景技术提出的LED灯条加工工艺复杂、不良率较高的问题。
为实现上述目的，本发明提供如下技术方案：
一种LED软灯条，包括线路板，所述线路板上端排列设置有至少一个LED倒装芯片，所述LED倒装芯片与所述线路板通过若干锡膏凸点连接在一起。进一步地，所述LED倒装芯片上还覆盖有调色胶。
进一步地，所述LED软灯条还包括柔性外壳，所述线路板设置于柔性外壳 内。
进一步地，所述线路板为柔性线路板或硬性线路板。
进一步地，所述线路板上的布线具有一样的间隔距离。
进一步地，所述同一个LED倒装芯片的相邻两锡膏凸点的最小间距为0.12mm。
进一步地，所述LED倒装芯片之间的最小间距为0.08mm。
进一步地，所述柔性线路板包括顶层绝缘膜、中间层的导电线路层、底层绝缘膜；所述导电线路层包括两条电源线、复数条串联线和/或并联线，所述LED倒装芯片焊接在串联线和/或并联线上；顶层绝缘膜对应于每颗LED倒装芯片的位置均设有第一通孔，LED倒装芯片容置于第一通孔内。
进一步地，所述串联线包括串联线本体，所述并联线包括并联线本体，所述串联线本体和/或并联线本体的靠近LED倒装芯片的一端一体延伸出一段焊接分支，所述焊接分支的宽度小于串联线本体或并联线本体的宽度，LED倒装芯片焊接于焊接分支的端部；
所述顶层绝缘膜至少粘贴覆盖焊接分支的靠近串联线本体或并联线本体的一部分；
所述焊接分支的宽度小于串联线本体或并联线本体的宽度的一半；
所述焊接分支的靠近LED倒装芯片的一端一体延伸有焊盘，焊盘的宽度大于焊接分支本体的宽度，焊盘的宽度或长度大于或等于LED倒装芯片的宽度，LED倒装芯片的电极直接焊接在焊盘上。
进一步地，对应于每颗LED倒装芯片的位置分别设有调色胶，调色胶至少覆盖LED倒装芯片和第一通孔；
电源线和串联线位于同一层面上，电源线位于串联线的两侧；LED倒装芯片通过串联线串联后再并联到两条电源线上，相邻两条串联线延伸出来的焊接分支不在同一直线上，两条焊接分支呈上下平行状分布，LED倒装芯片横向放置，LED倒装芯片的长度方向与柔性线路板的宽度方向相一致；或者，相邻两条串联线延伸出来的焊接分支位于同一直线上，LED倒装芯片纵向放置，LED 倒装芯片的长度方向与柔性线路板的长度方向相一致；
所述LED倒装芯片分别通过并联线并联到两条电源线上；
电源线和串联线位于不同的两个层面上，两条电源线位于串联线的下方，LED倒装芯片通过串联线串联后再并联到两条电源线上，电源线与串联线之间设有中间层绝缘膜。
与现有技术相比，本发明的有益效果如下：
1、产品结构、工艺精简，生产良品率较高，制造成本较低：精简产品结构，将常规的支架结构去除，改为采用LED倒装芯片直接通过锡膏焊接在线路板上，省去支架固定、固晶、焊线等工艺，减少了爆胶、虚焊、硫化等不良品的出现，并减少了生产设备和人工的投入，达到降低生产成本的目的；
2、实现流水线生产：生产工艺较简单，可集中在同一条产线内连续生产，生产效率较高；
3、应用更为广泛：本结构产品适用于柔性和硬性线路板，可根据需要设计线路板以及芯片尺寸，应用更为广泛。
附图说明
图1为本发明LED软灯条实施例1的立体结构示意图；
图2为本发明LED软灯条实施例1的内部平面结构示意图；
图3为本发明LED软灯条实施例2的立体结构示意图；
图4为本发明LED软灯条实施例3的立体图；
图5为本发明柔性LED倒装软灯条实施例3的分解图；
图6为图5中A部的放大图；图7为本发明柔性LED倒装软灯条实施例3的俯视图；
图8为图7中A-A剖面图；
图9为本发明柔性LED倒装软灯条实施例3的去掉顶层绝缘膜的俯视图；
图10为图9中B部的放大图；
图11为本发明柔性LED倒装软灯条实施例4的立体图；
图12为图11中C部的放大图。
图中：
1、柔性外壳；2、线路板；3、LED倒装芯片；4、顶层绝缘膜；5、导电线路层；6、底层绝缘膜；7、电源线；8、串联线；9、第一通孔；10、串联线本体；11、焊接分支；11a、一部分焊接分支；11b、另一部分焊接分支；L、连接处；12、焊盘；13、焊接分支本体；14、调色胶；15、贴片电阻；16、锡膏凸点。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
实施例1用于高压情况下(80-130V、200-240V)，请参阅图1-图2，本发明提供一种LED软灯条，包括柔性外壳1，柔性外壳1内设置有线路板2，线路板2上端排列设置有至少一个LED倒装芯片3，LED倒装芯片3与线路板2通过若干锡膏凸点16连接在一起。
具体而言，线路板2为硬性线路板(PCB)，如果采用硬性线路板，可将小块的硬性线路板固定在一条软的承载带上实现灯条的弯曲。
具体而言，线路板2上的布线具有一样的间隔距离，便于简化流水线生产流程，提高生产效率。
具体而言，同一个LED倒装芯片3的相邻两锡膏凸点16的最小间距为0.12mm。该尺寸可根据产品的不同需要和LED倒装芯片的尺寸的不同有所改动。
具体而言，LED倒装芯片3上表面还覆盖有调色胶14，用于调节光的色温和颜色，起到绝缘作用，以及保护LED倒装芯片3。
调色胶14的厚度为2-5mm，厚度越厚，发光越均匀。调色胶14为软性胶。
具体而言，所述LED倒装芯片3为蓝光LED倒装芯片3，调色胶14是在透明 硅胶中混合荧光粉而成。通过在硅胶中加入荧光粉可以实现调节光的色温和颜色。表1和表2为两种配粉记录表。
表1
Figure PCTCN2019107120-appb-000001
表2
Figure PCTCN2019107120-appb-000002
具体而言，所述LED倒装芯片(3)之间的最小间距为0.08mm。
工作原理：
根据所用的LED倒装芯片3的参数规格，选择并设计合适的柔性或硬性线 路板2，设定焊锡炉适当的焊盘规格，设置点胶参数，所有准备工序完成后，启动焊锡设备、点胶设备和硅胶外壳成型设备，将LED倒装芯片3与线路板2通过锡膏焊接在一起，并对LED倒装芯片3基底进行点胶保护，最后整个产品外部成型柔性外壳1即完成产品生产。当产品通电后，LED倒装芯片3将电能转化为光能，实现发光；根据内部选用线路板2材质的不同，柔性外壳1可进行适当的弯曲变形，但要避免直接的90°直角弯折。
实施例2
实施例2用于低压情况下(12V、24V、36V)，请参阅图3，其结构与实施例1大体相同，主要区别在于：去掉柔性外壳1；并且具有350颗LED倒装芯片3，350颗倒装芯片3采用7串50并的串并联方式。
实施例3
实施例3结构与实施例1大体相同，主要区别在于：线路板2为柔性线路板(FPC)。
参照图4到图9，具体而言，所述柔性线路板2包括顶层绝缘膜4、中间层的导电线路层5、底层绝缘膜6；所述导电线路层5包括两条电源线7、复数条串联线8，所述LED倒装芯片3焊接在串联线8上；顶层绝缘膜4对应于每颗LED倒装芯片3的位置均设有第一通孔9，LED倒装芯片3容置于第一通孔9内。
具体而言，所述串联线8包括串联线本体10，所述串联线本体10的靠近LED倒装芯片3的一端一体延伸出一段焊接分支11，所述焊接分支11的宽度小于串联线本体10的宽度，LED倒装芯片3焊接于焊接分支11的端部。串联线本体10延伸出较细的焊接分支11可以充当受力缓冲部，由于焊接分支11较细，具有较高的柔韧性，LED条形灯1在弯曲时，基本上只有串联线本体10在弯曲受力，而细软的焊接分支11受力极小，焊接分支11用于焊接倒装LED倒装芯片3的端部受力更小，从而使LED倒装芯片3不会像贴片式LED那样在LED条形灯1弯曲时受力而崩裂断路，品质更加可靠。
具体而言，所述顶层绝缘膜4粘贴覆盖焊接分支11的靠近串联线本体10的一部分。由于焊接分支11与串联线本体10的宽度不一样，焊接分支11在与串联 线本体10相连的连接处在多次弯曲时，相对来说易受外力而断裂，就像插头与电线的连接处容易断线的道理一样。采用顶层绝缘膜4至少粘贴覆盖靠近串联线本体10的一部分焊接分支11a，另一部分焊接分支11b暴露在第一通孔9内，焊接分支11与串联线本体10的连接处L被顶层绝缘膜4粘贴保护住，使此连接处L不会受力而断裂，品质更加可靠。
具体而言，所述焊接分支11的靠近LED倒装芯片3的一端一体延伸有焊盘12，焊盘12的宽度大于焊接分支本体13的宽度，焊盘12长度大于LED倒装芯片3的宽度，LED倒装芯片3的电极直接焊接在焊盘12上。在保证LED倒装芯片3有足够多的焊接面积前提下，使焊接分支11可以做得更加细软，达到更好的受力缓冲效果，从而使LED倒装芯片3焊点在弯曲时更不易受外力而崩裂。
具体而言，对应于每颗LED倒装芯片3的位置分别设有调色胶14，调色胶14至少覆盖LED倒装芯片3和第一通孔9。
具体而言，还包括贴片电阻15，贴片电阻15横向电连接于最边上的串联线8与电源线7之间。
实施例3为一种串联方案，LED倒装芯片3横向放置：电源线7和串联线8位于同一层面上，电源线7位于串联线8的两侧；LED倒装芯片3通过串联线8串联后再并联到两条电源线7上，相邻两条串联线8延伸出来的焊接分支11不在同一直线上，两条焊接分支11呈上下平行状分布，两条焊接分支11上的焊盘12位于上下方向的同一直线上，LED倒装芯片3横向焊接于上下两个焊盘12上，LED倒装芯片3的长度方向与柔性线路板2的宽度方向相一致。
实施例4
参照图10和图11，其结构与实施例3大体相同，主要区别在于：实施例4为另一种串联方案，LED倒装芯片3纵向放置：电源线7位于串联线8的两侧，LED倒装芯片3通过串联线8串联后再并联到两条电源线7上，相邻两条串联线8延伸出来的焊接分支11位于同一条直线上，焊盘12宽度度大于LED倒装芯片3的宽度，LED倒装芯片3纵向放置，LED倒装芯片3的长度方向与柔性线路板2的长度方向相一致。
实施例5
实施例5的结构与实施例3大体相同，主要区别在于：本实施例5为一种并联方案：所述LED倒装芯片3分别通过并联线并联到两条电源线7上。
实施例6
实施例6的结构与实施例3大体相同，主要区别在于：实施例5为另一种串联方案，串联线8与电源线7分隔为两层：电源线7和串联线8位于不同的两个层面上，两条电源线7位于串联线8的下方，LED倒装芯片3通过串联线8串联后再并联到两条电源线7上，电源线7与串联线8之间设有中间层绝缘膜。
与现有技术相比，本发明的有益效果如下：
1、产品结构、工艺精简，生产良品率较高，制造成本较低：精简产品结构，将常规的支架结构去除，改为采用LED倒装芯片直接通过锡膏焊接在线路板上，省去支架固定、固晶、焊线等工艺，减少了爆胶、虚焊、硫化等不良品的出现，并减少了生产设备和人工的投入，达到降低生产成本的目的，
2、实现流水线生产：生产工艺较简单，可集中在同一条产线内连续生产，生产效率较高；
3、应用更为广泛：本结构产品适用于柔性和硬性线路板，可根据需要设计线路板以及芯片尺寸，应用更为广泛。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。

Claims (10)

  1. 一种LED软灯条，其特征在于：包括线路板(2)，所述线路板(2)上端排列设置有LED倒装芯片(3)，所述LED倒装芯片(3)与所述线路板(2)通过若干锡膏凸点(16)连接在一起。
  2. 根据权利要求1所述的LED软灯条，其特征在于：所述LED倒装芯片(3)上还覆盖有调色胶(14)。
  3. 根据权利要求2所述的LED软灯条，其特征在于：所述LED软灯条由柔性外壳(1)包覆。
  4. 根据权利要求1所述的LED软灯条，其特征在于：所述线路板(2)为柔性线路板或硬性线路板。
  5. 根据权利要求1所述的LED软灯条，其特征在于：所述线路板(2)上的布线具有相同的间隔距离。
  6. 根据权利要求1所述的LED软灯条，其特征在于：所述同一个LED倒装芯片(3)的相邻两锡膏凸点(16)的最小间距为0.12mm。
  7. 根据权利要求1所述的LED软灯条，其特征在于：所述LED倒装芯片(3)之间的最小间距为0.08mm。
  8. 根据权利要求1所述的LED软灯条，其特征在于：所述柔性线路板包括顶层绝缘膜(4)、中间层的导电线路层(5)、底层绝缘膜(6)；所述导电线路层(5)包括两条电源线(7)、复数条串联线(8)和/或并联线，所述LED倒装芯片(3)焊接在串联线(8)和/或并联线上；顶层绝缘膜(4)对应于每颗LED倒装芯片(3)的位置均设有第一通孔(9)，LED倒装芯片(3)容置于第一通孔(9)内。
  9. 根据权利要求8所述的LED软灯条，其特征在于：所述串联线(8)包括串联线本体(10)，所述并联线包括并联线本体，所述串联线本体(10)和/或并联线本体的靠近LED倒装芯片(3)的一端一体延伸出一段焊接分支(11)，所述焊接分支(11)的宽度小于串联线本体(10)或并联线本体的宽度，LED倒装芯片(3)焊接于焊接分支(11)的端部；
    所述顶层绝缘膜(4)至少粘贴覆盖焊接分支(11)的靠近串联线本体(10)或并联线本体的一部分；
    所述焊接分支(11)的宽度小于串联线本体(10)或并联线本体的宽度的一半；
    所述焊接分支(11)的靠近LED倒装芯片(3)的一端一体延伸有焊盘(12)，焊盘(12)的宽度大于焊接分支本体(13)的宽度，焊盘(12)的宽度或长度大于或等于LED倒装芯片(3)的宽度，LED倒装芯片(3)的电极直接焊接在焊盘(12)上。
  10. 根据权利要求9所述的LED软灯条，其特征在于：对应于每颗LED倒装芯片(3)的位置分别设有调色胶(14)，调色胶(14)至少覆盖LED倒装芯片(3)和第一通孔(9)；
    电源线(7)和串联线(8)位于同一层面上，电源线(7)位于串联线(8)的两侧；LED倒装芯片(3)通过串联线(8)串联后再并联到两条电源线(7)上，相邻两条串联线(8)延伸出来的焊接分支(11)不在同一直线上，两条焊接分支(11)呈上下平行状分布，LED倒装芯片(3)横向放置，LED倒装芯片(3)的长度方向与柔性线路板的宽度方向相一致；或者，相邻两条串联线(8)延伸出来的焊接分支(11)位于同一直线上，LED倒装芯片(3)纵向放置，LED倒装芯片(3)的长度方向与柔性线路板的长度方向相一致；
    所述LED倒装芯片(3)分别通过并联线并联到两条电源线(7)上；
    电源线(7)和串联线(8)位于不同的两个层面上，两条电源线(7)位于串联线(8)的下方，LED倒装芯片(3)通过串联线(8)串联后再并联到两条电源线(7)上，电源线(7)与串联线(8)之间设有中间层绝缘膜。
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