WO2020224352A1 - 多层镀层光学防伪元件及其制作方法 - Google Patents

多层镀层光学防伪元件及其制作方法 Download PDF

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Publication number
WO2020224352A1
WO2020224352A1 PCT/CN2020/081589 CN2020081589W WO2020224352A1 WO 2020224352 A1 WO2020224352 A1 WO 2020224352A1 CN 2020081589 W CN2020081589 W CN 2020081589W WO 2020224352 A1 WO2020224352 A1 WO 2020224352A1
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Prior art keywords
microstructure
layer
plating layer
optical
area
Prior art date
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Ceased
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PCT/CN2020/081589
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English (en)
French (fr)
Inventor
胡春华
张巍巍
张宝利
朱军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Banknote Printing and Minting Corp
Zhongchao Special Security Technology Co Ltd
Original Assignee
China Banknote Printing and Minting Corp
Zhongchao Special Security Technology Co Ltd
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Publication date
Application filed by China Banknote Printing and Minting Corp, Zhongchao Special Security Technology Co Ltd filed Critical China Banknote Printing and Minting Corp
Priority to EP20802017.2A priority Critical patent/EP3967511A4/en
Priority to JP2021566158A priority patent/JP7376615B2/ja
Priority to US17/598,181 priority patent/US12233658B2/en
Publication of WO2020224352A1 publication Critical patent/WO2020224352A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/324—Reliefs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/29—Securities; Bank notes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/21—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for multiple purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/24—Passports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/328—Diffraction gratings; Holograms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/351—Translucent or partly translucent parts, e.g. windows
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/355—Security threads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
    • B42D25/373—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/415—Marking using chemicals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/405—Marking
    • B42D25/425—Marking by deformation, e.g. embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams

Definitions

  • the invention relates to the technical field of optical anti-counterfeiting, in particular to an optical anti-counterfeiting element and a manufacturing method of the optical anti-counterfeiting element.
  • optical anti-counterfeiting technology has been widely used in various high-security or high-value-added printed materials such as banknotes, credit cards, passports, securities, and product packaging, and has achieved very good results.
  • the optical effects formed by microstructures have been widely used due to their high brightness and obvious dynamic effects.
  • the microstructure optical anti-counterfeiting technology generally uses a metal reflective layer, such as aluminum.
  • holographic technology the most widely used optical anti-counterfeiting technology currently applied to optical films, is an optical technology developed by using the diffraction effect formed by microstructures.
  • the fifth set of 1999 version of 5 yuan, 10 yuan, 20 yuan, 50 yuan, 100 yuan of anti-counterfeiting lines uses holographic technology.
  • Multi-layer interference optical variable technology has attracted more and more attention because of its strong optical color change effect under different viewing angles.
  • Multi-layer interference optical variable technology generally adopts vapor deposition method to realize the evaporation of multilayer interference coating.
  • the classic multilayer interference coating generally includes a reflective layer, a dielectric layer and an absorbing layer.
  • the reflective layer is generally made of high-brightness metal materials
  • the dielectric layer is generally made of transparent inorganic or organic materials
  • the absorption layer is also called a semi-transparent layer, which is generally made of thinner metal materials with good absorption.
  • the fifth set of the 2015 version of the 100 yuan security thread uses multi-layer interference light change technology, which is magenta when viewed from the front and green when viewed obliquely.
  • Patent application CN 200980104829.3 proposes to realize the preparation of optical anti-counterfeiting products integrating multilayer interference optical variable coating and high-brightness metal reflective layer through partial printing hollowing process, that is, some areas have multilayer interference optical variable characteristics, and some areas have high-brightness metal
  • the reflective layer has optical characteristics, and other areas have a perspective hollowing effect.
  • the mutual alignment accuracy of the three areas in the patent application depends on the accuracy of printing, and the accuracy of printing is generally above 100um, which limits the application of high-end anti-counterfeiting optical products to a certain extent.
  • optical anti-counterfeiting element that simultaneously has the characteristics of a high-brightness metal reflective layer, a multilayer interference light variable, and the positioning of the two characteristic regions with zero error. Further, if the optical anti-counterfeiting element further integrates hollow features, and the hollow area and the image area are also positioned with zero error, the anti-counterfeiting performance of the product will be further improved.
  • the purpose of the embodiments of the present invention is to provide an optical anti-counterfeiting element and a manufacturing method thereof.
  • the optical anti-counterfeiting element When viewed from one side of the optical anti-counterfeiting element, it has the optical characteristics of two different coatings, and the areas with the two different optical characteristics have Strict zero-error positioning; in particular, the two coatings are metal coatings and multilayer interference optically variable coatings, the product can present a wealth of high-brightness metal reflective layer characteristics (such as holography) and interference optical variable characteristics, with excellent integration Integrated anti-counterfeiting performance; further, if the optical anti-counterfeiting element further integrates hollow features, and the hollow area and the image area are also positioned with zero error, the anti-counterfeiting performance of the product will be further improved.
  • an optical anti-counterfeiting element including:
  • An undulating structure layer includes: a first region with a first microstructure and a second region with a second microstructure; the structural parameter of the second microstructure is greater than the structural parameter of the first microstructure ;
  • the first area is provided with a first plating layer; the second area is provided with a second plating layer; the first area has an optical feature combining the first microstructure and the first plating layer; the first area The second region has the optical characteristic of the combination of the second microstructure and the second plating layer;
  • the two image regions (the first region and the second region) presented by reflection observation are determined by microstructures, they have the feature of zero positioning error.
  • the first microstructure or the second microstructure is one of a periodic structure and an aperiodic structure, or a combination of a periodic structure and aperiodic structure;
  • the cross-sectional structure of the first microstructure or the second microstructure along the extension direction is one of a flat structure, a sinusoidal structure, a rectangular grating structure, a trapezoidal grating structure, a blazed grating structure, and a curved grating structure, Or a flat structure, a sinusoidal structure, a rectangular grating structure, a trapezoidal grating structure, a blazed grating structure, and a curved grating structure in which at least any two structures are combined.
  • the size and lateral arrangement of the first and second microstructures are determined by the required optical effects.
  • the method further includes: a structural secondary parameter of the second microstructure is greater than a structural secondary parameter of the first microstructure; the structural parameter is a parameter selected from an aspect ratio and a specific volume; The structural secondary parameter relative to the structural parameter is a parameter remaining in the aspect ratio and the specific volume;
  • the aspect ratio of the microstructure of the undulating structure mentioned here refers to the ratio of the depth of the undulating structure to the width along the periodic (or quasi-periodic) direction; the specific volume of the undulating structure refers to placing the undulating structure layer in a horizontal state.
  • the flat structure is regarded as an undulating structure with zero aspect ratio and zero specific volume; aspect ratio and specific volume are two physical quantities that are not directly related in quantity; for example, A structure has a depth of 1um, along the periodic direction A one-dimensional zigzag grating with a width of 1um, the aspect ratio is 1, and the specific volume is 0.5um 3 /um 2 ; the B structure is a one-dimensional zigzag grating with a depth of 2um and a width of 4um along the periodic direction, then its depth The aspect ratio is 0.5, and the specific volume is 1um 3 /um 2 ; that is, the aspect ratio of the A structure is greater than that of the B structure, and the specific volume of the B structure is greater than
  • the structural parameters include: aspect ratio or specific volume.
  • the structural parameter is an aspect ratio; the range of the aspect ratio of the first microstructure is greater than or equal to 0 and less than 0.3; the aspect ratio of the second microstructure is greater than that of the second microstructure The range of the ratio is greater than 0.2 and less than 0.5.
  • the structural parameter is specific volume
  • the range of the specific volume of the first microstructure is greater than or equal to 0um 3 /um 2 and less than 0.5um 3 /um 2 ;
  • the range of the specific volume of the second microstructure is greater than 0.4um 3 /um 2 and less than 2um 3 /um 2 .
  • the first plating layer and the second plating layer are both metal reflective plating layers and may be different metal reflective layers (for example, the first plating layer is aluminum and the second plating layer is copper), or the first plating layer and the The second coating layers are all multilayer interference optical variable coatings and can be different multilayer interference optical variable coatings (for example, the first coating is a magenta to green interference optical variable coating, and the second coating is a green to blue interference optical variable coating) , Or the first plating layer is a metal reflective plating layer, the second plating layer is a multilayer interference optical variable plating layer, or the first plating layer is a multilayer interference optical variable plating layer, and the second plating layer is a metal reflective plating layer.
  • one of the first plating layer and the second plating layer is a metal reflective plating layer and the other is a multilayer interference optically variable plating layer.
  • a sub-coating layer of the first coating layer and the second coating layer can be realized by covering different parts of the same coating layer in different areas, that is, a part of the metal reflective coating layer can be a sub-coating layer belonging to a multilayer interference optically variable coating layer.
  • the material of the metal reflective coating includes: one of aluminum, silver, copper, tin, chromium, nickel, and titanium, or at least any two of aluminum, silver, copper, tin, chromium, nickel, and titanium An alloy composed of a combination of metals.
  • the material of the metal reflective coating is aluminum.
  • the multilayer interference optically variable coating layer includes: a reflective layer, a dielectric layer and an absorption layer;
  • the material of the reflective layer includes: one metal of aluminum, silver, copper, tin, chromium, nickel, and titanium, or a combination of at least any two metals of aluminum, silver, copper, tin, chromium, nickel, and titanium alloy;
  • the material of the dielectric layer includes: magnesium fluoride (MgF 2 ), silicon dioxide (SiO 2 ), zinc sulfide (ZnS), titanium nitride (TiN), titanium dioxide (TiO 2 ), titanium monoxide (TiO) , Titanium pentoxide (Ti 2 O 3 ), titanium pentoxide (Ti 3 O 5 ), tantalum pentoxide (Ta 2 O 5 ), niobium pentoxide (Nb 2 O 5 ), cerium oxide (CeO 2 ), bismuth trioxide (Bi 2 O 3 ), chromium trioxide (Cr 2 O 3 ), iron oxide (Fe 2 O 3 ), hafnium dioxide (HfO 2 ) or zinc oxide (ZnO);
  • the material of the absorption layer includes: a metal of nickel, chromium, aluminum, silver, copper, tin, and titanium, or a combination of at least any two metals of nickel, chromium, aluminum, silver, copper, tin, and titanium alloy.
  • the material of the reflective layer is aluminum; the material of the absorption layer is nickel or chromium, or a nickel-chromium alloy.
  • the undulating structure layer further includes: a third region having a third microstructure; the structural parameter of the third microstructure is greater than that of the second microstructure; the third region does not have all The first plating layer or the second plating layer;
  • the third area has a hollow feature relative to the first area and the second area.
  • the third area of the optical anti-counterfeiting element has a hollow feature; that is, the hollow area and the image area formed by the two kinds of coatings are also positioned with zero error, thus having more excellent anti-counterfeiting features.
  • the third microstructure is: one of a periodic structure and an aperiodic structure, or a combination of a periodic structure and an aperiodic structure;
  • the cross section of the third microstructure along the extension direction is: one of a sinusoidal structure, a rectangular grating structure, a trapezoidal grating structure, and a blazed grating structure, or a sinusoidal structure, a rectangular grating structure, a trapezoidal grating structure, or a blazed grating structure A structure in which at least any two structures are combined in one structure.
  • the function of the third microstructure is generally only used for hollowing out and does not provide additional optical effects, so it can be simplified, such as a blazed grating with a one-dimensional arrangement and an isosceles triangle with a larger aspect ratio or specific volume. .
  • the structural parameter is an aspect ratio; the range of the aspect ratio of the third microstructure is greater than 0.3 and less than 1.
  • the structural parameter is a specific volume; the range of the specific volume of the third microstructure is greater than 1um 3 /um 2 and less than 3um 3 /um 2 .
  • one of the first plating layer and the second plating layer is a multilayer interference optically variable plating layer; the multilayer interference optically variable plating layer includes: a reflective layer, a dielectric layer, and an absorption layer.
  • the third region does not have any one of a reflective layer, a dielectric layer, or an absorbing layer. At this time, the third area is completely transparent or almost completely transparent.
  • the third region has an absorption layer and a dielectric layer, but does not have a reflective layer. At this time, the third area is semi-transparent.
  • the embodiment of the present invention provides a manufacturing method of an optical anti-counterfeiting element, and the manufacturing method includes:
  • step S4) The semi-finished product of step S3) is placed in an atmosphere capable of reacting with the plating layer formed in step S2) until part or all of the plating layer formed in step S2) in the second region is removed, so that the reaction After stopping, the first plating layer is obtained, and the first plating layer and the first microstructure present a combined optical characteristic at the first region;
  • step S1) further includes: wherein the undulating structure layer further has a third region, the third region has a third microstructure, and the third microstructure has a structural parameter greater than that of the third microstructure. The characteristics of the structural parameters of the second microstructure.
  • step S1) further includes: wherein the second microstructure has a feature that the structural secondary parameter of the second microstructure is greater than the structural secondary parameter of the first microstructure;
  • the structural parameter is a parameter selected from the aspect ratio and the specific volume
  • the structural secondary parameter relative to the structural parameter is a parameter remaining in the aspect ratio and the specific volume.
  • step S1) further includes:
  • the structural parameters include: aspect ratio or specific volume.
  • a vapor deposition process must be used to form a protective layer on the coating; for example, the aspect ratio of the first microstructure is smaller than that of the second microstructure , After the vapor deposition of the protective layer, the protective layer on the second microstructure is looser or has more cracks than the protective layer on the first microstructure, so the protection is worse; in this way, in a corrosive atmosphere for a certain period of time After that, the plating layer on the second microstructure is removed, and the plating layer on the first microstructure is not or substantially not corroded, so that a plating layer accurately located on the first microstructure is obtained; in short, a vapor deposition protective layer is used Through the process, a plating layer precisely located on the microstructure with a small aspect ratio can be obtained.
  • a coating process must be used to form a protective layer on the coating; for example, if the specific volume of the first microstructure is smaller than the specific volume of the second microstructure, then the coating After applying a certain amount of liquid protective glue and leveling and drying, the minimum thickness of the protective layer on the second microstructure is less than the minimum thickness on the first microstructure (usually on the top of the microstructure), so the protective glue is on the second microstructure.
  • the protection on the microstructure is poor, while the protection on the first microstructure is better; in this way, after a certain period of time in the corrosive atmosphere, the coating on the second microstructure is removed, while the protection on the first microstructure
  • the plating layer is not or substantially not corroded, so that a plating layer that is accurately located on the first microstructure is obtained; in short, by using the coating protective layer process, a plating layer that is accurately located on the microstructure with a smaller specific volume can be obtained.
  • the vapor deposition protective layer process and coating protective layer are adopted All the processes can obtain a plating layer precisely located on the first microstructure.
  • the production method further includes:
  • step S6 The product of step S6) is placed in an atmosphere capable of reacting with the plating layer formed in step S5) until part or all of the plating layer formed in step S5) in the third region is removed, so that the reaction After stopping, the second plating layer is obtained, and the second plating layer and the second microstructure present a combined optical characteristic at the second area, and also make the third area relative to the first The area and the second area have hollow features.
  • the plating layer used to obtain the first plating layer in step S2) and/or the plating layer used to obtain the second plating layer in step S5) has an aluminum layer; wherein, an atmosphere capable of reacting with the plating layer in step S2) is selected And/or the atmosphere capable of reacting with the plating layer in step S5) is an acid solution, or an atmosphere capable of reacting with the plating layer in step S2) and/or an atmosphere capable of reacting with the plating layer in step S5) is selected as an alkaline solution.
  • the manufacturing method further includes: applying an inorganic or organic coating, or applying an inorganic or organic coating process, so as to realize an additional optical anti-counterfeiting function or auxiliary function.
  • Fig. 1 is a schematic top view of a first exemplary optical anti-counterfeiting element according to an embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional structure diagram of a first exemplary optical anti-counterfeiting element according to an embodiment of the present invention
  • FIG. 3 is a detailed schematic cross-sectional structure diagram of a first exemplary optical anti-counterfeiting element according to an embodiment of the present invention
  • FIG. 4 is a schematic top view of a second exemplary optical anti-counterfeiting element according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element according to an embodiment of the present invention.
  • FIG. 6 is a detailed schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element according to an embodiment of the present invention.
  • FIG. 7 is a detailed schematic cross-sectional structure diagram of the second exemplary optical anti-counterfeiting element according to an embodiment of the present invention when the third region has a dielectric layer and an absorption layer;
  • FIG. 8 is a schematic cross-sectional structure diagram of the first exemplary optical anti-counterfeiting element after forming an undulating structure layer according to an embodiment of the present invention
  • FIG. 9 is a schematic cross-sectional structure diagram of the first exemplary optical anti-counterfeiting element after forming the first plating layer according to the embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional structure diagram of the first exemplary optical anti-counterfeiting element after forming a first protective layer in an embodiment of the present invention
  • FIG. 11 is a schematic cross-sectional structure diagram of the first exemplary optical anti-counterfeiting element of the embodiment of the present invention after undergoing a corrosion atmosphere reaction;
  • FIG. 12 is a schematic cross-sectional structure diagram of the first exemplary optical anti-counterfeiting element after forming a second plating layer according to an embodiment of the present invention
  • FIG. 13 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element after forming an undulating structure layer according to an embodiment of the present invention
  • FIG. 14 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element after forming a first plating layer according to an embodiment of the present invention
  • FIG. 15 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element after forming a first protective layer according to an embodiment of the present invention
  • 16 is a schematic cross-sectional structure diagram of the second exemplary optical anti-counterfeiting element after the first corrosive atmosphere reaction according to the embodiment of the present invention
  • 17 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element after forming a second plating layer according to an embodiment of the present invention
  • FIG. 18 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element after forming a second protective layer according to an embodiment of the present invention
  • 19 is a schematic diagram of a cross-sectional structure of a second exemplary optical anti-counterfeiting element of an embodiment of the present invention after undergoing a second first corrosion atmosphere reaction;
  • FIG. 20 is a schematic cross-sectional structure diagram of a second exemplary optical anti-counterfeiting element of an embodiment of the present invention after undergoing a second second corrosion atmosphere reaction.
  • the optical anti-counterfeiting element contains a first area A and a second area B.
  • the first area A has the optical characteristics of the first optical microstructure and the first coating layer
  • the second area B has the second optical microstructure and the second area.
  • the two areas are strictly positioned to each other.
  • the lines of the image are often very fine, for example, less than 50um.
  • Both the first plating layer and the second plating layer may be selected from metal reflective plating and multilayer interference optically variable plating.
  • Figure 2 is a possible cross-sectional view along XX of the exemplary optical security element shown in Figure 1.
  • the optical security element includes a substrate 1, an undulating structure layer 2, a first plating layer 3, a first protective layer 4, and a first Two plating layer 5, other functional coating 7.
  • the substrate 1 and the relief structure layer 2 are usually made of transparent materials.
  • the undulating structure layer 2 includes a first area A composed of a first microstructure and a second area B composed of a second microstructure. The aspect ratio of the second microstructure is greater than that of the first microstructure.
  • the specific volume of the second microstructure is greater than the specific volume of the first microstructure, or the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure and the second
  • the specific volume of the microstructure is greater than the specific volume of the first microstructure.
  • the first area A is provided with a first plating layer 3 and the second area B is provided with a second plating layer 5. From the observation side of the anti-counterfeiting element (the substrate side, let’s be the bottom), the first area A presents the optical characteristics of the first microstructure and the first plating layer 3, and the second area B presents the second microstructure and the second Coating 5 combines optical characteristics.
  • the first plating layer 3 is adjacent to the first protective layer 4.
  • the first protective layer is a natural product during the manufacturing process and generally does not provide additional optical effects.
  • the first plating layer 3, the first protective layer 4, and the second plating layer 5 may constitute a functional plating layer group (typically, it may be a multi-layer interference optical variable plating layer), and the first area A presents the functional plating layer group and the second plating layer.
  • the part of the functional coating group belonging to the first area A is the "first coating" that exhibits an optical effect to the outside.
  • Other functional coatings 7 can be set according to requirements, for example, a bonding layer for bonding with the main product to be protected.
  • FIG. 3 is another possible cross-sectional view of the exemplary optical security element shown in FIG. 1 along XX, which is a more specific case of FIG. 2, that is, the first plating layer 3 is a single metal plating layer (such as an aluminum layer) ,
  • the second plating layer 5 is a multilayer interference optically variable plating layer.
  • the optically variable plating layer is composed of a reflective layer 53, a dielectric layer 52, and an absorbing layer 51.
  • the first area A presents the characteristics of a single metal coating (such as the silver characteristic of the aluminum layer)
  • the second area B presents the color change characteristics dependent on the tilt angle.
  • the optical anti-counterfeiting element contains a first area A, a second area B and a third area C.
  • the first area A has the optical characteristics of the first optical microstructure and the first plating layer
  • the second area B has the second area.
  • the third area C has a hollow feature when viewed through perspective.
  • the three areas are strictly positioned with each other.
  • the hollow area C shown in FIG. 4 is strictly located at the boundary of the second area B. Images or cutout lines are often very fine, for example, less than 50um.
  • Both the first plating layer and the second plating layer may be selected from metal reflective plating and multilayer interference optically variable plating.
  • the third area C may have no coating residue, which is completely or substantially completely transparent (for example, the light transmittance is greater than 90%), or there may be part of the coating remaining, which is translucent (for example, the light transmittance is less than 50%) .
  • Fig. 5 is a possible cross-sectional view along XX of the exemplary optical security element shown in Fig. 4.
  • the optical security element includes a substrate 1, an undulating structure layer 2, a first plating layer 3, a first protective layer 4, and a first The second plating layer 5, the second protective layer 6, and other functional coatings 7.
  • the substrate 1 and the relief structure layer 2 are usually made of transparent materials.
  • the undulating structure layer 2 includes a first area A composed of a first microstructure, a second area B composed of a second microstructure, and a third area C composed of a third microstructure.
  • the second microstructure The aspect ratio is greater than the aspect ratio of the first microstructure, the specific volume of the second microstructure is greater than the specific volume of the first microstructure, or the aspect ratio of the second microstructure is greater than the The aspect ratio of the first microstructure and the specific volume of the second microstructure is greater than the specific volume of the first microstructure, and the aspect ratio of the third microstructure is greater than the aspect ratio of the second microstructure , The specific volume of the third microstructure is greater than the specific volume of the second microstructure, or the aspect ratio of the third microstructure is greater than the aspect ratio of the second microstructure, and the third microstructure The specific volume of is greater than the specific volume of the second microstructure.
  • the first area A is provided with a first plating layer 3, the second area B is provided with a second plating layer 5, and the third area C is not provided with the first plating layer or the second plating layer.
  • the first area A externally presents the optical characteristics of the first microstructure and the first coating 3
  • the second area B externally presents the optical characteristics of the second microstructure and the second coating 5 feature.
  • the first plating layer 3 is adjacent to the first protective layer 4, and the second plating layer 5 is adjacent to the second protective layer 6. Both protective layers are natural products during the manufacturing process and generally do not provide additional optical effects.
  • the third region C appears completely or substantially completely transparent, and there may also be partial plating or sub-plating remaining, which appears translucent.
  • the first plating layer 3, the first protective layer 4, and the second plating layer 5 may constitute a functional plating layer group (typically, it may be a multilayer interference optical variable plating layer), and the first area A presents the functional plating layer group and the An optical feature combined with a microstructure.
  • the part of the functional coating group belonging to the first area A is the "first coating" that exhibits an optical effect to the outside.
  • Other functional coatings 7 can be set according to requirements, for example, a bonding layer for bonding with the main product to be protected.
  • the first plating layer 3 is a single metal plating layer (such as Aluminum layer)
  • the second plating layer 5 is a multilayer interference optically variable plating layer.
  • the optically variable plating layer is composed of a reflective layer 53, a dielectric layer 52, and an absorbing layer 51.
  • the first area A presents the characteristics of a single metal coating (such as the silver characteristic of the aluminum layer)
  • the second area B presents the color change characteristics dependent on the tilt angle.
  • the third area C does not have any plating layer or sub-plating layer among the aluminum layer or the optical variable plating layer, the third area C appears completely transparent or substantially completely transparent, as shown in FIG. 6. If the third area C retains the sub-plating layer (usually the absorbing layer 51 and the dielectric layer 52) in the optical variable plating layer, the third area C appears semi-transparent when viewed through perspective, as shown in FIG.
  • the method for preparing the optical anti-counterfeiting element shown in FIG. 1 according to the present invention will be described below in conjunction with FIG. 8 to FIG. 12.
  • the method includes steps S1 to S5.
  • the first plating layer is selected as a single metal plating layer
  • the second plating layer is selected as a multilayer interference optical variable plating layer. That is, the cross-sectional structure diagram is the optical anti-counterfeiting element shown in FIG. 3.
  • An undulating structure layer 2 is formed on the surface of the substrate 1.
  • the undulating structure layer 2 includes at least a first area A with a first microstructure and a second area B with a second microstructure.
  • the aspect ratio or specific volume of the second microstructure is greater than the aspect ratio or specific volume of the first microstructure, or the aspect ratio and specific volume of the second microstructure are both correspondingly greater than the first microstructure.
  • the aspect ratio and specific volume of a microstructure that is, the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure, and the specific volume of the second microstructure is greater than that of the first microstructure
  • the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure and the specific volume of the second microstructure is greater than the specific volume of the first microstructure.
  • the substrate 1 may be at least partially transparent, or may be a colored dielectric layer, may be a transparent dielectric film with a functional coating on the surface, or may be a multilayer film formed by compounding.
  • the substrate 1 is generally formed of a film material with good physical and chemical resistance and high mechanical strength.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PP polyethylene
  • the substrate 1 may contain an adhesion enhancement layer to enhance the adhesion of the substrate 1 and the relief structure layer 2.
  • the base material 1 may also contain a release layer to realize the separation of the final product base material 1 and the relief structure layer 2.
  • the undulating structure layer 2 can be formed by batch replication through processing methods such as ultraviolet casting, molding, and nanoimprinting.
  • the undulating structure layer 2 can be formed by a thermoplastic resin through a molding process, that is, the thermoplastic resin pre-coated on the substrate 1 is heated and softened and deformed when passing through a high-temperature metal template, thereby forming a specific undulating structure, and then cooling and molding .
  • the undulating structure layer 2 can also be formed by a radiation curing casting process, that is, by coating a radiation curing resin on the substrate 1 and pressing the original plate on it, while irradiating radiation such as ultraviolet rays or electron beams to cure the above materials, Then, the original plate is removed to form the relief structure layer 2.
  • the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure, the specific volume of the second microstructure is greater than the specific volume of the first microstructure, or The aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure and the specific volume of the second microstructure is greater than the specific volume of the first microstructure. If a vapor deposition process is subsequently used to form the protective layer, preferably, the aspect ratio of the first microstructure is greater than or equal to 0 and less than 0.3, and the aspect ratio of the second microstructure is greater than 0.2 and less than 0.5.
  • the specific volume of the first microstructure is greater than or equal to 0um 3 /um 2 and less than 0.5um 3 /um 2
  • the specific volume of the second microstructure is greater than 0.4um 3 / um 2 and less than 2um 3 /um 2 .
  • Both the first microstructure and the second microstructure can be one or a combination of a periodic structure or a non-periodic structure, and the structure is a sinusoidal structure, a rectangular grating structure, a trapezoidal grating structure, a blazed grating structure, and a curved grating.
  • the size and lateral arrangement of the first and second microstructures are determined by the required optical effects.
  • the first microstructure can be selected as a flat structure.
  • the first plating layer 3 is selected as a single metal reflective plating layer.
  • the function of the metal reflective coating is to improve the brightness of the optical effect formed by the microstructure.
  • the material of the metal reflective coating can be Al, Cu, Ni, Cr, Ag, Fe, Sn, Au, Pt and other metals or their mixtures or alloys. Due to the low cost of aluminum, high brightness and easy reaction with acid and alkali Removed, so aluminum is preferred.
  • the thickness of the metal reflective coating is generally selected to be greater than 10 nm and less than 80 nm, preferably greater than 20 nm and less than 50 nm. If the metal reflective coating is too thin, the brightness will be insufficient; if the metal reflective coating is too thick, the fastness to the undulating structure layer will be poor, and the cost will increase.
  • the first plating layer 3 can generally be formed on the undulating structure layer 2 by physical and/or chemical vapor deposition methods, such as but not limited to thermal evaporation, magnetron sputtering, MOCVD, and the like.
  • the first plating layer 3 is formed on the undulating structure layer 2 with a uniform surface density and in a conformal covering manner.
  • the first protective layer 4 can be formed by a vapor deposition process. If the specific volume of the first microstructure is smaller than the specific volume of the second microstructure, the first protective layer 4 can be formed by a coating process. If the aspect ratio of the first microstructure is less than the aspect ratio of the second microstructure, and the specific volume of the first microstructure is less than the specific volume of the second microstructure, both the vapor deposition process and the coating process can be used The first protective layer 4 is formed.
  • the material of the first protective layer can be selected from inorganic or organic substances that can be adapted to the vapor deposition process, such as MgF 2 , Sn, Cr, ZnS, ZnO, Ni, Cu, Au, Ag, TiO 2 , MgO, SiO 2 and Al 2 O 3 , and polymerizable organic compounds such as acrylate, urethane acrylate, and epoxy acrylate.
  • an organic compound can be mixed with an initiator, vapor-deposited and then subjected to radiation curing to polymerize it into an organic compound.
  • the surface morphology of the protective layer and the morphology of the first plating layer are of the same type or substantially the same type.
  • the amount of the protective layer formed by vapor deposition should be sufficient to protect the first plating layer in the first area.
  • the thickness of the vapor-deposited protective layer (relative to the flat area) is greater than 20 nm.
  • the amount of the coated protective layer must satisfy that the minimum thickness of the first protective layer 4 on the first microstructure is significantly greater than the minimum thickness on the second microstructure.
  • the minimum thickness of the protective layer in the microstructure is generally located at the top of the microstructure. In this way, the protective effect of the first protective layer on the first plating layer in the first area is significantly higher than the protective effect on the first plating layer in the second area. It is generally required that the coating amount of the protective layer per unit area is greater than 0.1 g/m 2 and less than 0.6 g/m 2 . The lower the viscosity of the protective layer before coating, the better the leveling.
  • the viscosity of the protective glue is generally less than 100 cP, preferably less than 50 cP.
  • the composition of the protective layer it may be a varnish or ink with polyester, polyurethane, acrylic resin or a combination thereof as the main resin.
  • step S4 Place the multilayer structure obtained in step S3 in an atmosphere capable of reacting with the first plating layer 3 until part or all of the first plating layer 3 in the second region B is removed, as shown in FIG. 11.
  • the protective effect of the first protective layer 4 on the first plating layer in the first area is significantly higher than the protective effect on the first plating layer in the second area. Therefore, within a certain period of time, the corrosive atmosphere will reach and corrode the first plating layer through the weak points of the protective layer in the second area; and within this time, the first protective layer will form an effective protection for the first plating layer in the first area . In this way, the first plating layer precisely located in the first area is obtained.
  • the first plating layer is aluminum or a plating layer containing aluminum
  • the corrosive atmosphere may be acid or alkali.
  • the first protective layer on the plating layer also floats. Sometimes, after the first plating layer on the second area is corroded, part or all of the first protective layer on the plating layer may remain on the undulating structure layer, which does not affect the implementation of subsequent processes.
  • the second plating layer 5 is a multilayer interference optically variable plating layer.
  • the multilayer interference optical variable plating layer 5 is generally composed of an absorbing layer 51, a dielectric layer 52, and a reflective layer 53. Viewed from the side of the absorbing layer, the multi-layer interference optical variable coating exhibits different color characteristics when viewed from different angles. Therefore, the order of formation of the multi-layer interference optical variable coating is generally the absorption layer 51, the dielectric layer 52, and the reflective layer 53.
  • the reflective layer is generally a thick metal material with good reflectivity, showing opaque or basically opaque characteristics in perspective observation; the dielectric layer is generally a completely transparent or substantially completely transparent compound material; the absorption layer is generally a thinner metal material, which is transparent Shows translucent features.
  • the reflective layer 53 may be made of aluminum, silver, copper, tin, chromium, nickel, titanium or their alloys. Since aluminum is relatively low in cost and easy to be removed by acid or lye, it is preferably aluminum; the dielectric The layer 52 may be composed of MgF 2 , SiO 2 , ZnS, TiN, TiO 2 , TiO, Ti 2 O 3 , Ti 3 O 5 , Ta 2 O 5 , Nb 2 O 5 , CeO 2 , Bi 2 O 3 , Cr 2 O 3. Fe 2 O 3 , HfO 2 or ZnO; the absorption layer 53 can be made of nickel, chromium, aluminum, silver, copper, tin, titanium or their alloys, preferably nickel, chromium.
  • the thickness of the reflective layer 53 is generally selected from 10 nm to 80 nm, preferably 20 nm to 50 nm.
  • the thickness of the absorption layer 51 is generally 3-10 nm.
  • the thickness of the dielectric layer 52 is determined by the required photochromic characteristics, and is generally 200-600 nm.
  • the method of manufacturing the optical anti-counterfeiting element shown in Fig. 3 generally also includes, after step S5, coating other functional coatings 7, such as anti-aging glue, to protect the optical coating, and/or hot melt glue, To play the role of bonding with other substrates.
  • the method for preparing the optical anti-counterfeiting element shown in FIG. 4 according to the present invention will be described below with reference to FIG. 13 to FIG. 20.
  • the method includes steps S1' to S7'.
  • the first plating layer is selected as a single metal plating layer
  • the second plating layer is selected as a multi-layer interference optical variable plating layer. That is, the cross-sectional structure diagrams are the optical anti-counterfeiting elements shown in FIGS. 6 and 7.
  • the undulating structure layer 2 includes at least a first area A composed of a first microstructure, a second area B composed of a second microstructure, and In the third region C formed by the third microstructure, the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure, and the specific volume of the second microstructure is greater than that of the first microstructure The specific volume, or the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure and the specific volume of the second microstructure is greater than the specific volume of the first microstructure, the third The aspect ratio of the microstructure is greater than the aspect ratio of the second microstructure, the specific volume of the third microstructure is greater than the specific volume of the second microstructure, or the aspect ratio of the third microstructure is greater than The aspect ratio of the second microstructure and the specific volume of the third microstructure are greater than the specific volume of the second microstructure, as shown in FIG. 13.
  • the substrate 1 may be at least partially transparent, or may be a colored dielectric layer, may be a transparent dielectric film with a functional coating on the surface, or may be a multilayer film formed by compounding.
  • the substrate 1 is generally formed of a film material with good physical and chemical resistance and high mechanical strength.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PP polyethylene
  • the substrate 1 may contain an adhesion enhancement layer to strengthen the adhesion of the substrate 1 and the relief structure layer 2.
  • the base material 1 may also contain a release layer to realize the separation of the final product base material 1 and the relief structure layer 2.
  • the undulating structure layer 2 can be formed by batch replication through processing methods such as ultraviolet casting, molding, and nanoimprinting.
  • the undulating structure layer 2 can be formed by a thermoplastic resin through a molding process, that is, the thermoplastic resin pre-coated on the substrate 1 is heated and softened and deformed when passing through a high-temperature metal template, thereby forming a specific undulating structure, and then cooling and molding .
  • the undulating structure layer 2 can also be formed by a radiation curing casting process, that is, by coating a radiation curing resin on the substrate 1 and pressing the original plate on it, while irradiating radiation such as ultraviolet rays or electron beams to cure the above materials, Then, the original plate is removed to form the relief structure layer 2.
  • the aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure, the specific volume of the second microstructure is greater than the specific volume of the first microstructure, or The aspect ratio of the second microstructure is greater than the aspect ratio of the first microstructure and the specific volume of the second microstructure is greater than the specific volume of the first microstructure.
  • the depth of the third microstructure is The aspect ratio is greater than the aspect ratio of the second microstructure, the specific volume of the third microstructure is greater than the specific volume of the second microstructure, or the aspect ratio of the third microstructure is greater than the second microstructure.
  • the aspect ratio of the microstructure and the specific volume of the third microstructure are greater than the specific volume of the second microstructure.
  • the aspect ratio of the first microstructure is greater than or equal to 0 and less than 0.3
  • the aspect ratio of the second microstructure is greater than 0.2 and less than 0.5
  • the third microstructure The specific volume of is greater than 0.3 and less than 1.
  • the specific volume of the first microstructure is greater than or equal to 0um 3 /um 2 and less than 0.5um 3 /um 2
  • the specific volume of the second microstructure is greater than 0.4um 3 / um 2 and less than 2um 3 /um 2
  • the specific volume of the third microstructure is greater than 1 um 3 /um 2 and less than 3 um 3 /um 2 .
  • the first microstructure, the second microstructure, and the third microstructure can all be one or a combination of a periodic structure or a non-periodic structure, and the structure is a sinusoidal structure, a rectangular grating structure, a trapezoidal grating structure, or a blazed grating One or a combination of structure and curved grating structure.
  • the size and lateral arrangement of the first and second microstructures are determined by the required optical effects.
  • the first microstructure can be selected as a flat structure.
  • the function of the third microstructure is only to hollow out, and generally does not provide additional optical effects, so it can be simplified, such as a one-dimensional isosceles triangle with a cross-section of 10um in width and 5um in height (that is, the aspect ratio is 0.5, A blazed grating with a specific volume of 2.5um 3 /um 2 ).
  • a plating layer for obtaining the first plating layer 3 is formed, as shown in FIG.
  • the first plating layer 3 is selected as a single metal reflective plating layer.
  • the function of the metal reflective coating is to improve the brightness of the optical effect formed by the microstructure.
  • the material of the metal reflective coating can be Al, Cu, Ni, Cr, Ag, Fe, Sn, Au, Pt and other metals or their mixtures or alloys. Due to the low cost of aluminum, high brightness and easy reaction with acid and alkali Removed, so aluminum is preferred.
  • the thickness of the metal reflective coating is generally selected to be greater than 10 nm and less than 80 nm, preferably greater than 20 nm and less than 50 nm.
  • the first plating layer 3 or its sub-plating layers may be formed on the relief structure layer 2 by physical and/or chemical vapor deposition methods, such as but not limited to thermal evaporation, magnetron sputtering, MOCVD, and the like.
  • the first plating layer 3 is formed on the undulating structure layer 2 with a uniform surface density and in a conformal covering manner.
  • the first protective layer 4 can be formed by a vapor deposition process. If the specific volume of the first microstructure is smaller than the specific volume of the second microstructure and the third microstructure, the first protective layer 4 can be formed by a coating process. If the aspect ratio of the first microstructure is smaller than the aspect ratio of the second microstructure and the third microstructure, and the specific volume of the first microstructure is smaller than the specific volume of the second microstructure and the third microstructure, either In the vapor deposition process, the first protective layer 4 may be formed by a coating process.
  • the material of the first protective layer can be selected from inorganic or organic substances that can be adapted to the vapor deposition process, such as MgF 2 , Sn, Cr, ZnS, ZnO, Ni, Cu, Au, Ag, TiO 2 , MgO, SiO 2 and Al 2 O 3 , and polymerizable organic compounds such as acrylate, urethane acrylate, and epoxy acrylate.
  • an organic compound can be mixed with an initiator, vapor-deposited and then subjected to radiation curing to polymerize it into an organic compound.
  • the surface morphology of the protective layer and the morphology of the first plating layer are of the same type or substantially the same type.
  • the amount of the protective layer formed by vapor deposition should be sufficient to protect the first plating layer in the first area.
  • the thickness of the vapor-deposited protective layer (relative to the flat area) is greater than 20 nm.
  • the amount of the coated protective layer must satisfy the minimum thickness of the first protective layer 4 on the first microstructure, which is significantly greater than the minimum thickness of the second and third microstructures. .
  • the minimum thickness of the protective layer in the microstructure is generally located at the top of the microstructure. In this way, the protective effect of the first protective layer on the first plating layer in the first area is significantly higher than the protective effect on the first plating layer in the second area and the third area.
  • the coating amount of the protective layer per unit area is greater than 0.1 g/m 2 and less than 0.6 g/m 2 . The lower the viscosity of the protective layer before coating, the better the leveling.
  • the viscosity of the protective glue is generally less than 100 cP, preferably less than 50 cP.
  • the composition of the protective layer it may be a varnish or ink with polyester, polyurethane, acrylic resin or a combination thereof as the main resin.
  • step S4' placing the multilayer structure obtained in step S3' in an atmosphere capable of reacting with the first plating layer 3 until part or all of the first plating layer 3 located in the second region B and the third region C is removed, As shown in Figure 16.
  • the protective effect of the first protective layer 4 on the first plating layer in the first area is significantly higher than the protective effect on the first plating layer in the second area and the third area. Therefore, within a certain period of time, the corrosive atmosphere will reach and corrode the first plating layer through the weak points of the protective layer in the second area and the third area; and during this time, the first protective layer will affect the first plating layer in the first area. Form effective protection. In this way, the first plating layer precisely located in the first area is obtained.
  • the corrosive atmosphere may be acid or alkali.
  • the first protective layer on the plating layer also floats.
  • part or all of the first protective layer on the plating layer may remain on the undulating structure layer, which does not affect the implementation of subsequent processes.
  • the second plating layer 5 is a multilayer interference optically variable plating layer.
  • the multilayer interference optical variable plating layer 5 is generally composed of an absorbing layer 51, a dielectric layer 52, and a reflective layer 53. Viewed from the side of the absorbing layer, the multi-layer interference optical variable coating exhibits different color characteristics when viewed from different angles. Therefore, the order of formation of the multi-layer interference optical variable coating is generally the absorption layer 51, the dielectric layer 52, and the reflective layer 53.
  • the reflective layer is generally a thick metal material with good reflectivity, and the light transmission presents opaque or basically opaque characteristics; the dielectric layer is generally a completely transparent or substantially completely transparent compound material; the absorption layer is generally a thinner metal material, which transmits light Shows translucent features.
  • the reflective layer 53 may be made of aluminum, silver, copper, tin, chromium, nickel, titanium or their alloys. Since aluminum is relatively low in cost and easy to be removed by acid or lye, it is preferably aluminum; the dielectric The layer 52 may be composed of MgF 2 , SiO 2 , ZnS, TiN, TiO 2 , TiO, Ti 2 O 3 , Ti 3 O 5 , Ta 2 O 5 , Nb 2 O 5 , CeO 2 , Bi 2 O 3 , Cr 2 O 3. Fe 2 O 3 , HfO 2 or ZnO; the absorption layer 53 can be made of nickel, chromium, aluminum, silver, copper, tin, titanium or their alloys, preferably nickel, chromium.
  • the thickness of the reflective layer 53 is generally selected from 10 nm to 80 nm, preferably 20 nm to 50 nm.
  • the thickness of the absorption layer 51 is generally 3-10 nm.
  • the thickness of the dielectric layer 52 is determined by the desired color characteristics, and is generally 200-600 nm.
  • the second protective layer 6 can be formed by a vapor deposition process. If the specific volume of the second microstructure is smaller than the specific volume of the third microstructure, the second protective layer 6 can be formed by a coating process. If the aspect ratio of the second microstructure is less than the aspect ratio of the third microstructure, and the specific volume of the second microstructure is less than the specific volume of the third microstructure, both the vapor deposition process and the coating process can be used The second protective layer 6 is formed. The amount of the first protective layer 6 should be such that the protective layer can effectively protect the second plating layer 5 in the second region B, but will not effectively protect the second plating layer 5 in the third region C. The material and process requirements for forming the second protective layer 6 are consistent with the material and process requirements for forming the first protective layer 4. I won't go into details here.
  • step S7' Place the multilayer structure obtained in step S6' in an atmosphere capable of reacting with the second plating layer 5 until part or all of the second plating layer 5 located in the third region C is removed, as shown in FIGS. 19 and 20 Shown.
  • the protective effect of the second protective layer 6 on the second plating layer in the second area B is significantly higher than that of the second plating layer in the third area C. Therefore, within a certain period of time, the corrosive atmosphere will reach and corrode the second plating layer through the weak points of the protective layer in the third area; and within this time, the second protective layer 6 is effective in forming the second plating layer in the second area. protection. In this way, a second plating layer precisely located in the second area is obtained. Usually, the second plating layer in the first area is also retained, but the final product does not provide an optical effect due to the shielding of the first plating layer.
  • the corrosive atmosphere may be acid or alkali.
  • the second protective layer on the plating layer also floats.
  • part or all of the second protective layer on the plating layer may remain on the undulating structure layer, which does not affect the implementation of subsequent processes.
  • the second plating layer 5 is a multilayer interference optically variable plating layer.
  • the multilayer interference optical variable plating layer 5 is composed of an absorption layer 51, a dielectric layer 52, and a reflective layer 53.
  • the absorbing layer 51 can react with the corrosive atmosphere, such as the reflective layer and the absorbing layer are both aluminum, and the corrosive atmosphere is acid, the corrosive atmosphere can react with the absorbing layer 51 through the fragile position of the dielectric layer 52, then the third region C does not leave any coating components, so it presents a completely or almost completely transparent feature, as shown in Figure 19. If the absorbing layer 51 does not react with the corrosive atmosphere, such as the reflective layer 53 is aluminum, the absorbing layer 51 is nickel, and the corrosive atmosphere is acid, the corrosive atmosphere will only react with the reflective layer 53, and the third region C will leave the absorbing layer And the dielectric layer, thus showing semi-transparent features, as shown in Figure 20.
  • the method of manufacturing the optical anti-counterfeiting element shown in Figures 6 and 7 generally also includes, after the S7' step, coating other functional coatings 7, such as anti-aging glue, to protect the optical coating, and/or heat Melt glue to play the role of bonding with other substrates.
  • the method for preparing an optical anti-counterfeiting element according to the present invention is suitable for manufacturing window security threads, labels, logos, wide strips, transparent windows, films, etc.
  • the anti-counterfeiting paper with the security thread for opening the window is used for anti-counterfeiting of various high-security products such as banknotes, passports, and securities.
  • the program is stored in a storage medium and includes several instructions to enable the single-chip microcomputer, chip or processor (processor) Execute all or part of the steps of the method described in each embodiment of this application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

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Abstract

一种光学防伪元件，包括：起伏结构层（2）；起伏结构层包括：具有第一微结构的第一区域（A）和具有第二微结构的第二区域（B）；第二微结构的结构参数大于第一微结构的结构参数；起伏结构层还包括具有第三微结构的第三区域（C）；第三微结构的结构参数大于第二微结构的结构参数；第一区域上设置有第一镀层（3）；第二区域上设置有第二镀层（5）；第三区域不设置第一镀层或第二镀层；从光学防伪元件的一侧观察，第一区域具有第一微结构和第一镀层结合的光学特征、第二区域具有第二微结构和第二镀层结合的光学特征，第三区域具有镂空特征。该光学防伪元件具有优异的防伪性能。

Description

多层镀层光学防伪元件及其制作方法 技术领域
本发明涉及光学防伪技术领域，具体地涉及一种光学防伪元件和一种光学防伪元件的制作方法。
背景技术
为了防止利用扫描和复印等手段产生的伪造，钞票、信用卡、护照、有价证券和产品包装等各类高安全或高附加值印刷品中广泛采用了光学防伪技术，并且取得了非常好的效果。
在各种光学防伪技术中，微结构形成的光学效果包括衍射、非衍射等效果因亮度高、动感效果明显而得到了广泛应用。微结构光学防伪技术为了增加图像的亮度，一般采用金属反射层，比如铝。其中，目前应用于光学薄膜的最为广泛的光学防伪技术——全息技术即是利用微结构形成的衍射效果而发展的光学技术。第五套1999版的5元、10元、20元、50元、100元人民币的防伪线就采用了全息技术。另外，多层干涉光变技术因在不同的观察视角下具有出强烈的光学变色效果而越来越受到人们的重视。多层干涉光变技术一般采用气相沉积的方法实现多层干涉镀层的蒸镀。经典的多层干涉镀层一般包括反射层、介电层和吸收层。反射层一般采用高亮度的金属材料制备，介电层一般采用透明的无机或者有机材料制备，吸收层也称半透明层，一般采用较薄的吸收性好的金属材料制备。第五套2015版100元人民币安全线就是采用了多层干涉光变技术，正视观察为品红色，倾斜观察为绿色。
如果将光学微结构和高亮度的金属反射层特征以及多层干涉光变特征集成到同一光学防伪元件中，则可以大大增强光学防伪效果。专利申请CN 200980104829.3提出通过局部印刷镂空工艺实现了多层干涉光变镀层和高亮度金属反射层相集成的光学防伪产品的制备，即部分区域具有多层干涉光变特征，部分区域具有高亮度金属反射层光学特征，其他区域则具有透视镂空效果。然而，该专利申请中三个区域的相互对位精度取决于印刷的精度，而印刷的精度一般在100um以上，在一定程度上限制了高端防伪光学产品中的应用。
因此，制作同时具有高亮度金属反射层特征、多层干涉光变特征，并且两个特征区域彼此定位零误差的光学防伪元件，具有重要的意义。进一步地，如果光学防伪元件进一步集成镂空特征，且镂空区域和图像区域也零误差定位，则会进一步提高产品的抗伪造性能。
发明内容
本发明实施例的目的是提供一种光学防伪元件及其制作方法，从光学防伪元件的一侧反射观察时，具有两种不同的镀层呈现的光学特征，并且这两种不同光学特征的区域具有严格的零误差定位； 尤其，两种镀层分别是金属镀层和多层干涉光变镀层，产品则可以呈现出丰富的高亮度金属反射层特征(如全息)和干涉光变特征，具有优异的综合集成防伪性能；进一步地，如果光学防伪元件进一步集成镂空特征，且镂空区域和图像区域也零误差定位，则会进一步提高产品的抗伪造性能。
为了实现上述目的，本发明实施例提供一种光学防伪元件，包括：
起伏结构层；所述起伏结构层包括：具有第一微结构的第一区域和具有第二微结构的第二区域；所述第二微结构的结构参数大于所述第一微结构的结构参数；
所述第一区域上设置有第一镀层；所述第二区域上设置有第二镀层；所述第一区域具有所述第一微结构和所述第一镀层结合的光学特征；所述第二区域具有所述第二微结构和所述第二镀层结合的光学特征；
由于反射观察呈现的两个图像区域(所述第一区域和所述第二区域)是由微结构确定的，因而具有定位零误差特征。
可选的，所述第一微结构或所述第二微结构为：周期性结构和非周期性结构中的一种结构，或周期性结构和非周期性结构组合的结构；
所述第一微结构或所述第二微结构沿延展方向的截面结构为：平坦结构、正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构、弧形光栅结构中的一种结构，或平坦结构、正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构、弧形光栅结构中至少任意两种结构组合的结构。第一微结构和第二微结构的尺寸以及横向排布由所需的光学效果决定。
可选的，还包括：所述第二微结构的结构次级参数大于所述第一微结构的结构次级参数；所述结构参数为深宽比和比体积中选定的一种参数；所述结构次级参数相对所述结构参数为所述深宽比和所述比体积中剩余的一种参数；
这里提到的起伏结构的微结构的深宽比是指起伏结构的深度与沿周期(或准周期)方向的宽度的比值；起伏结构的比体积是指将起伏结构层置于水平状态，设想恰好完全覆盖起伏结构表面的液体体积与起伏结构在水平面上的投影面积的比值；按照此定义，深宽比是一无量纲的物理量，比体积的量纲为um 3/um 2；按照此定义，平坦结构看做是深宽比为零，且比体积为零的起伏结构；深宽比和比体积是两个在数量上没有直接关系的物理量；比如，A结构为深度1um、沿周期方向的宽度1um的一维锯齿形光栅，则其深宽比为1，比体积为0.5um 3/um 2；B结构为深度2um、沿周期方向的宽度4um的一维锯齿形光栅，则其深宽比为0.5，比体积为1um 3/um 2；也就是说，A结构的深宽比大于B结构的深宽比，而B结构的比体积大于A结构的比体积；第一微结构和第二微结构的深宽比和比体积的差别，直接决定了镂空工序采用的方法。
可选的，所述结构参数包括：深宽比或比体积。
可选的，所述结构参数为深宽比；所述第一微结构的深宽比的范围为大于等于0且小于0.3；第 二微结构的深宽比所述第二微结构的深宽比的范围为大于0.2且小于0.5。
可选的，所述结构参数为比体积；
所述第一微结构的比体积的范围为大于等于0um 3/um 2且小于0.5um 3/um 2；
所述第二微结构的比体积的范围为大于0.4um 3/um 2且小于2um 3/um 2。
可选的，所述第一镀层和所述第二镀层均为金属反射镀层且可以是不同的金属反射层(如第一镀层为铝、第二镀层为铜)，或者所述第一镀层和所述第二镀层均为多层干涉光变镀层且可以是不同的多层干涉光变镀层(如第一镀层为洋红变绿干涉光变镀层、第二镀层为绿变蓝干涉光变镀层)，或者所述第一镀层为金属反射镀层、所述第二镀层为多层干涉光变镀层，或者所述第一镀层为多层干涉光变镀层、所述第二镀层为金属反射镀层。
优选的，所述第一镀层和所述第二镀层中一者为金属反射镀层且另一者为多层干涉光变镀层。特别地，第一镀层和第二镀层的一子镀层是可以通过覆盖不同区域的同一镀层的不同部分实现，即金属反射镀层的部分区域可以是属于多层干涉光变镀层的子镀层。
可选的，所述金属反射镀层的材料包括：铝、银、铜、锡、铬、镍、钛中的一种金属，或铝、银、铜、锡、铬、镍、钛中至少任意两种金属组合构成的合金。
优选的，所述金属反射镀层的材料为铝。
可选的，所述多层干涉光变镀层包括：反射层、介电层和吸收层；
所述反射层的材料包括：铝、银、铜、锡、铬、镍、钛中的一种金属，或铝、银、铜、锡、铬、镍、钛中至少任意两种金属组合构成的合金；
所述介电层的材料包括：氟化镁(MgF 2)、二氧化硅(SiO 2)、硫化锌(ZnS)、氮化钛(TiN)、二氧化钛(TiO 2)、一氧化钛(TiO)、三氧化二钛(Ti 2O 3)、五氧化三鈦(Ti 3O 5)、五氧化二钽(Ta 2O 5)、五氧化二铌(Nb 2O 5)、二氧化铈(CeO 2)、三氧化二铋(Bi 2O 3)、三氧化二铬(Cr 2O 3)、氧化铁(Fe 2O 3)、二氧化铪(HfO 2)或氧化锌(ZnO)；
所述吸收层的材料包括：镍、铬、铝、银、铜、锡、钛中的一种金属，或镍、铬、铝、银、铜、锡、钛中至少任意两种金属组合构成的合金。
优选的，所述反射层的材料为铝；所述吸收层的材料为镍或铬，或者为镍铬合金。
可选的，所述起伏结构层还包括：具有第三微结构的第三区域；所述第三微结构的结构参数大于所述第二微结构的结构参数；所述第三区域不具有所述第一镀层或所述第二镀层；
透射观察时，所述第三区域相对所述第一区域和所述第二区域具有镂空特征。这样，透射观察时，光学防伪元件的第三区域具有镂空特征；也就是说，镂空区域和两种镀层形成的图像区域也是零误差定位的，因而具有更为优异的防伪特征。
可选的，所述第三微结构为：周期性结构和非周期性结构中的一种结构，或周期性结构和非周 期性结构组合的结构；
所述第三微结构沿延展方向的截面为：正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构中的一种结构，或正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构中的一种结构中至少任意两种结构组合的结构。第三微结构的作用一般只是用来镂空，不提供额外的光学效果，因此可以简化，比如是一维排布的、横截面为等腰三角形的有着较大深宽比或者比体积的闪耀光栅。
可选的，所述结构参数为深宽比；所述第三微结构的深宽比的范围为大于0.3且小于1。
可选的，所述结构参数为比体积；所述第三微结构的比体积的范围为大于1um 3/um 2且小于3um 3/um 2。
可选的，所述第一镀层和所述第二镀层中的一者为多层干涉光变镀层；所述多层干涉光变镀层包括：反射层、介电层和吸收层。
可选的，所述第三区域不具有反射层、介电层或吸收层中的任意一层。这时，第三区域为完全透明或者基本完全透明。
可选的，所述第三区域具有吸收层和介电层且不具有反射层。这时，第三区域为半透明。
本发明实施例提供一种光学防伪元件的制作方法，该制作方法包括：
S1)形成起伏结构层，其中，所述起伏结构层具有第一区域和第二区域，所述第一区域具有第一微结构且所述第二区域具有第二微结构，所述第二微结构具有所述第二微结构的结构参数大于所述第一微结构的结构参数的特点；
S2)形成用于获得第一镀层的镀层；
S3)形成第一保护层；
S4)将步骤S3)的半成品置于能够与步骤S2)中形成的镀层反应的氛围中，直到位于所述第二区域的步骤S2)中形成的镀层的部分或者全部被去除为止，以使反应停止后获得所述第一镀层且所述第一镀层和所述第一微结构在所述第一区域处呈结合的光学特征；
S5)形成用于获得第二镀层的镀层。
具体的，步骤S1)还包括：其中，所述起伏结构层还具有第三区域，所述第三区域具有第三微结构，所述第三微结构具有所述第三微结构的结构参数大于所述第二微结构的结构参数的特点。
具体的，步骤S1)还包括：其中，所述第二微结构具有所述第二微结构的结构次级参数大于所述第一微结构的结构次级参数的特点；
其中，所述结构参数为深宽比和比体积中选定的一种参数；
其中，所述结构次级参数相对所述结构参数为所述深宽比和所述比体积中剩余的一种参数。
具体的，步骤S1)还包括：
其中，所述结构参数包括：深宽比或比体积。
如果基于深宽比的差别实现特定微结构上的镀层的精准去除，则须在镀层上采用气相沉积工艺形成保护层；例如，第一微结构的深宽比小于第二微结构的深宽比，则气相沉积保护层之后，在第二微结构上的保护层较在第一微结构上的保护层更疏松或者有更多的裂缝，因而保护性更差；这样，在腐蚀氛围中一定时间之后，第二微结构上的镀层便被去除，而第一微结构上的镀层没有或者基本没有被腐蚀，从而获得了精确位于第一微结构上的镀层；简言之，采用气相沉积保护层工艺，可以获得精确位于深宽比小的微结构上的镀层。
如果基于比体积的差别实现特定微结构上的镀层的精准去除，则须在镀层上采用涂布工艺形成保护层；例如，第一微结构的比体积小于第二微结构的比体积，则涂布特定量的液体保护胶并经流平干燥后，保护层在第二微结构上的最小厚度小于在第一微结构上的最小厚度(一般在微结构的顶部)，因而保护胶在第二微结构上的保护性较差，而在第一微结构上的保护性较好；这样，在腐蚀氛围中一定时间之后，第二微结构上的镀层便被去除，而第一微结构上的镀层没有或者基本没有被腐蚀，从而获得了精确位于第一微结构上的镀层；简言之，采用涂布保护层工艺，可以获得精确位于比体积小的微结构上的镀层。
显然，如果第一微结构的深宽比小于第二微结构的深宽比，并且第一微结构的比体积小于第二微结构的比体积，则采用气相沉积保护层工艺和涂布保护层工艺均可以获得精确位于第一微结构上的镀层。
具体的，该制作方法还包括：
S6)形成第二保护层；
S7)将步骤S6)的产品置于能够与步骤S5)中形成的镀层反应的氛围中，直到位于所述第三区域的步骤S5)中形成的镀层的部分或者全部被去除为止，以使反应停止后获得所述第二镀层且所述第二镀层和所述第二微结构在所述第二区域处呈结合的光学特征，并且还使得透射观察时所述第三区域相对所述第一区域和所述第二区域具有镂空特征。
具体的，其中，步骤S2)中用于获得第一镀层的镀层和/或步骤S5)中用于获得第二镀层的镀层具有铝层；其中，选择能够与步骤S2)中的镀层反应的氛围和/或能够与步骤S5)中的镀层反应的氛围为酸液、或者选择能够与步骤S2)中的镀层反应的氛围和/或能够与步骤S5)中的镀层反应的氛围为碱液。
具体的，该制作方法还包括：施加无机或者有机的镀层、或者施加无机或者有机的涂层工序，以实现附加光学防伪功能或者辅助功能。
本发明实施例的其它特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
附图是用来提供对本发明实施例的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明实施例，但并不构成对本发明实施例的限制。在附图中：
图1为本发明实施例的第一种示例性光学防伪元件的俯视结构示意图；
图2为本发明实施例的第一种示例性光学防伪元件的剖面结构示意图；
图3为本发明实施例的第一种示例性光学防伪元件的详细的剖面结构示意图；
图4为本发明实施例的第二种示例性光学防伪元件的俯视结构示意图；
图5为本发明实施例的第二种示例性光学防伪元件的剖面结构示意图；
图6为本发明实施例的第二种示例性光学防伪元件的详细的剖面结构示意图；
图7为本发明实施例的第二种示例性光学防伪元件在第三区域具有介电层和吸收层时的详细的剖面结构示意图；
图8为本发明实施例的第一种示例性光学防伪元件形成起伏结构层后的剖面结构示意图；
图9为本发明实施例的第一种示例性光学防伪元件形成第一镀层后的剖面结构示意图；
图10为本发明实施例的第一种示例性光学防伪元件形成第一保护层后的剖面结构示意图；
图11为本发明实施例的第一种示例性光学防伪元件经过腐蚀氛围反应后的剖面结构示意图；
图12为本发明实施例的第一种示例性光学防伪元件形成第二镀层后的剖面结构示意图；
图13为本发明实施例的第二种示例性光学防伪元件形成起伏结构层后的剖面结构示意图；
图14为本发明实施例的第二种示例性光学防伪元件形成第一镀层后的剖面结构示意图；
图15为本发明实施例的第二种示例性光学防伪元件形成第一保护层后的剖面结构示意图；
图16为本发明实施例的第二种示例性光学防伪元件经过第一次腐蚀氛围反应后的剖面结构示意图；
图17为本发明实施例的第二种示例性光学防伪元件形成第二镀层后的剖面结构示意图；
图18为本发明实施例的第二种示例性光学防伪元件形成第二保护层后的剖面结构示意图；
图19为本发明实施例的第二种示例性光学防伪元件经过第二次第一种腐蚀氛围反应后的剖面结构示意图；
图20为本发明实施例的第二种示例性光学防伪元件经过第二次第二种腐蚀氛围反应后的剖面结构示意图。
附图标记说明
1基材        2起伏结构层
3第一镀层    4第一保护层
5第二镀层    51吸收层
52介电层 53反射层
6第二保护层                      7其他功能涂层
A第一区域                        B第二区域
C第三区域
具体实施方式
以下结合附图对本发明实施例的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明实施例，并不用于限制本发明实施例。
实施例1
如图1，该光学防伪元件含有第一区域A和第二区域B，第一区域A具有第一光学微结构和第一镀层结合的光学特征，第二区域B具有第二光学微结构和第二镀层结合的光学特征。两个区域彼此严格定位。图像的线条往往非常精细，例如，小于50um。所述第一镀层、第二镀层均可以选自金属反射镀层、多层干涉光变镀层。
图2是根据图1所示的示例性光学防伪元件沿着X-X的一种可能的剖面图，光学防伪元件含有基材1，起伏结构层2，第一镀层3，第一保护层4，第二镀层5，其他功能涂层7。基材1和起伏结构层2通常由透明材料构成。所述起伏结构层2包括由第一微结构组成的第一区域A、由第二微结构组成的第二区域B，所述第二微结构的深宽比大于所述第一微结构的深宽比、所述第二微结构的比体积大于所述第一微结构的比体积、或者所述第二微结构的深宽比大于所述第一微结构的深宽比且所述第二微结构的比体积大于所述第一微结构的比体积。第一区域A上设置有第一镀层3，第二区域B上设置有第二镀层5。从防伪元件的观察侧(基材侧，令为下方)观察，第一区域A对外呈现第一微结构和第一镀层3结合的光学特征，第二区域B对外呈现第二微结构和第二镀层5结合的光学特征。第一镀层3邻接有第一保护层4。第一保护层为制作过程中的自然产物，一般不提供额外的光学效果。特别地，第一镀层3、第一保护层4、第二镀层5可以构成一个功能镀层组(典型地，可以是多层干涉光变镀层)，则第一区域A对外呈现功能镀层组和第一微结构结合的光学特征。此时，功能镀层组属于第一区域A的部分是对外呈现光学效果的“第一镀层”。其他功能涂层7可以根据需要来设置，比如，起与被保护的主产品粘合的粘结层。
图3是根据图1所示的示例性光学防伪元件沿着X-X的另外一种可能的剖面图，是图2的更为具体的情况，即第一镀层3为单一金属镀层(如铝层)，第二镀层5为多层干涉光变镀层。典型地，光变镀层由反射层53、介电层52、吸收层51构成。从光变镀层的吸收层一侧观察，第一区域A呈现单一金属镀层的本身特征(如铝层的银色特征)，第二区域B呈现随倾斜角度依赖的颜色变化特征。
如图4，该光学防伪元件含有第一区域A、第二区域B和第三区域C，第一区域A具有第一光学微结构和第一镀层结合的光学特征，第二区域B具有第二光学微结构和第二镀层结合的光学特征，第三区域C透视观察具有镂空特征。三个区域彼此严格定位，例如图4所示的镂空区域C严格位于第二区域B的边界。图像或者镂空的线条往往非常精细，例如，小于50um。所述第一镀层、第二镀层均可以选自金属反射镀层、多层干涉光变镀层。第三区域C可以无镀层残留，表现为完全或者基本完全透明(例如，光透过率大于90％)，也可以有部分镀层残留，表现为半透明(例如，光透过率小于50％)。
图5是根据图4所示的示例性光学防伪元件沿着X-X的一种可能的剖面图，光学防伪元件含有基材1，起伏结构层2，第一镀层3，第一保护层4，第二镀层5，第二保护层6，其他功能涂层7。基材1和起伏结构层2通常由透明材料构成。所述起伏结构层2包括由第一微结构组成的第一区域A、由第二微结构组成的第二区域B、以及由第三微结构组成的第三区域C，所述第二微结构的深宽比大于所述第一微结构的深宽比、所述第二微结构的比体积大于所述第一微结构的比体积、或者所述第二微结构的深宽比大于所述第一微结构的深宽比且所述第二微结构的比体积大于所述第一微结构的比体积，所述第三微结构的深宽比大于所述第二微结构的深宽比、所述第三微结构的比体积大于所述第二微结构的比体积、或者所述第三微结构的深宽比大于所述第二微结构的深宽比且所述第三微结构的比体积大于所述第二微结构的比体积。第一区域A上设置有第一镀层3，第二区域B上设置有第二镀层5，第三区域C没有设置第一镀层或第二镀层。从防伪元件的观察侧(即下方)观察，第一区域A对外呈现第一微结构和第一镀层3结合的光学特征，第二区域B对外呈现第二微结构和第二镀层5结合的光学特征。第一镀层3邻接有第一保护层4，第二镀层5邻接有第二保护层6。两种保护层均为制作过程中的自然产物，一般不提供额外的光学效果。透射观察时，第三区域C表现为完全或者基本完全透明，也可以有部分镀层或者子镀层残留，表现为半透明。特别地，第一镀层3、第一保护层4、第二镀层5可以构成一个功能镀层组(典型地，可以是多层干涉光变镀层)，则第一区域A对外呈现功能镀层组和第一微结构结合的光学特征。此时，功能镀层组属于第一区域A的部分是对外呈现光学效果的“第一镀层”。其他功能涂层7可以根据需要来设置，比如，起与被保护的主产品粘合的粘结层。
图6和图7是根据图1所示的示例性光学防伪元件沿着X-X的另外两种可能的剖面图，是图5的更为具体的情况，即第一镀层3为单一金属镀层(如铝层)，第二镀层5为多层干涉光变镀层。典型地，光变镀层由反射层53、介电层52、吸收层51构成。从光变镀层的吸收层一侧观察，第一区域A呈现单一金属镀层的本身特征(如铝层的银色特征)，第二区域B呈现随倾斜角度依赖的颜色变化特征。若第三区域C没有铝层或光变镀层中的任一镀层或子镀层，则透视观察，第三区域C呈现完全透明或者基本完全透明的特征，如图6所示。若第三区域C保留有光变镀层中的子镀层(通常 为吸收层51和介电层52)，则透视观察，第三区域C呈现半透明的特征，如图7所示。
下面结合图8至图12对根据本发明的制备如图1所示的光学防伪元件的方法进行描述，该方法包括步骤S1至S5。为叙述简洁起见，第一镀层选择为单一金属镀层，第二镀层选择为多层干涉光变镀层，即剖面结构图为图3所示的光学防伪元件。
S1、在基材1的表面上形成起伏结构层2，所述起伏结构层2至少包括具有第一微结构的第一区域A、具有第二微结构的第二区域B，同量纲比较的前提下，所述第二微结构的深宽比或比体积大于第一微结构的深宽比或比体积、或者所述第二微结构的深宽比和比体积同时对应地大于所述第一微结构的深宽比和比体积，即所述第二微结构的深宽比大于所述第一微结构的深宽比、所述第二微结构的比体积大于所述第一微结构的比体积、或者所述第二微结构的深宽比大于所述第一微结构的深宽比且所述第二微结构的比体积大于所述第一微结构的比体积。如图8所示。
基材1可以是至少局部透明的，也可以是有色的介电层，可以是表面带有功能涂层的透明介质薄膜，还可以是经过复合而成的多层膜。基材1一般由耐物化性能良好且机械强度高的薄膜材料形成，例如，可以使用聚对苯二甲酸乙二醇酯(PET)薄膜、聚萘二甲酸乙二醇酯(PEN)薄膜及聚丙烯(PP)薄膜等塑料薄膜形成基材1，而且基材1优选由PET材料形成。基材1上可以含有粘结增强层，以增强基材1与起伏结构层2的粘结。基材1上也可以含有剥离层，以实现最终产品基材1与起伏结构层2的分离。
起伏结构层2可以通过紫外浇铸、模压、纳米压印等加工方式进行批量复制形成。例如，起伏结构层2可以由热塑性树脂通过模压工艺形成，即预先涂布在基材1上的热塑性树脂在经过高温的金属模版时，受热而软化变形，从而形成特定的起伏结构，之后冷却成型。起伏结构层2也可以采用辐射固化浇铸工艺形成，即通过将辐射固化树脂涂布在基材1上，一边将原版推压于其上，一边照射紫外线或电子束等放射线，使上述材料固化，然后取下原版从而形成起伏结构层2。
为实现后续镂空的需要，所述第二微结构的深宽比大于所述第一微结构的深宽比、所述第二微结构的比体积大于所述第一微结构的比体积、或者所述第二微结构的深宽比大于所述第一微结构的深宽比且所述第二微结构的比体积大于所述第一微结构的比体积。若后续采用气相沉积工艺形成保护层，优选地，所述第一微结构的深宽比大于等于0，小于0.3，第二微结构的深宽比大于0.2，小于0.5。若后续采用涂布工艺形成保护层，优选地，所述第一微结构的比体积大于等于0um 3/um 2且小于0.5um 3/um 2，第二微结构的比体积大于0.4um 3/um 2且小于2um 3/um 2。
所述第一微结构、第二微结构均可以为周期性结构或非周期性结构中的一种或组合，结构为正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构、弧形光栅结构中的一种或者组合。第一微结构和第二微结构的尺寸以及横向排布由所需的光学效果决定。第一微结构可以选择为平坦结构。
S2、在起伏结构层2上形成用于获得第一镀层3的镀层，如图9所示。
本实施例中，第一镀层3选择为单一金属反射镀层。金属反射镀层的作用是提高微结构形成光学效果的亮度。金属反射镀层的材料可以是Al、Cu、Ni、Cr、Ag、Fe、Sn、Au、Pt等金属或其混合物或合金，由于铝的成本低廉、亮度高且易于与酸液和碱液反应而去除，因此优选为铝。金属反射镀层的厚度一般选择大于10nm且小于80nm，优选大于20nm且小于50nm。金属反射镀层太薄，则亮度不够；金属反射镀层太厚，则与起伏结构层的牢度不好，且成本上升。
第一镀层3一般可以通过物理和/或化学气相沉积的方法形成在起伏结构层2上，例如包括但不限于热蒸发、磁控溅射、MOCVD等。优选地，第一镀层3以均匀的表面密度、以同形覆盖的方式形成在起伏结构层2上。
S3、形成第一保护层4，如图10所示。
如果第一微结构的深宽比小于第二微结构的深宽比，则可以采用气相沉积工艺形成第一保护层4。如果第一微结构的比体积小于第二微结构的比体积，则可以采用涂布工艺形成第一保护层4。如果第一微结构的深宽比小于第二微结构的深宽比，且第一微结构的比体积小于第二微结构的比体积，则既可以采用气相沉积工艺，又可以采用涂布工艺形成第一保护层4。
若采用气相沉积的工艺形成第一保护层4，则第一保护层材料可以选自能够适应于气相沉积工艺的无机物或有机物，如MgF 2、Sn、Cr、ZnS、ZnO、Ni、Cu、Au、Ag、TiO 2、MgO、SiO 2及Al 2O 3，以及丙烯酸酯、氨基甲酸酯丙烯酸酯、环氧丙烯酸酯等聚合性有机化合物。尤其，可以将有机化合物同引发剂混合使用，进行气相沉积后进行辐射固化使其聚合而成有机化合物。气相沉积之后，保护层的表面形貌和第一镀层的形貌同型或者基本同型。气相沉积形成保护层的量应使得对第一区域的第一镀层有足够的保护性。一般地，气相沉积保护层的厚度(相对于平坦区域)要大于20nm。
若采用涂布工艺形成第一保护层4，则涂布保护层的量需满足第一保护层4在第一微结构上的最小厚度明显大于在第二微结构的最小厚度。保护层在微结构的最小厚度一般位于微结构的最顶部。这样，第一保护层对第一区域的第一镀层的保护作用，要明显高于对第二区域的第一镀层的保护作用。一般要求保护层在单位面积上的涂布量大于0.1g/m 2且小于0.6g/m 2。保护层的涂布之前的粘度越小越有利于流平，因此，保护胶液的粘度一般要小于100cP，优选小于50cP。就保护层的成分而言，可以是以聚酯、聚氨酯、丙烯酸树脂或者其组合为主树脂的清漆或者油墨。
S4、将步骤S3获得的多层结构体置于能够与第一镀层3反应的氛围中，直到位于第二区域B的第一镀层3的部分或者全部被去除为止，如图11所示。
如前所述，第一保护层4对第一区域的第一镀层的保护作用，要明显高于对第二区域的第一镀层的保护作用。因此，在一定的时间内，腐蚀氛围会通过第二区域的保护层的脆弱点到达并腐蚀第一镀层；而在此时间内，第一保护层对第一区域的第一镀层形成有效的保护。这样便获得了精确位于第一区域的第一镀层。如果第一镀层为铝或者含有铝的镀层，则腐蚀氛围可以是酸液或者碱液。通常， 第二区域上的第一镀层被腐蚀后，镀层上的第一保护层也随之浮脱。有时，第二区域上的第一镀层被腐蚀后，镀层上的第一保护层可能部分甚至全部残留在起伏结构层上，这并不影响后续工序的实施。
S5、形成用于获得第二镀层5的镀层，如图12所示。
在本实施例中，第二镀层5选择多层干涉光变镀层。多层干涉光变镀层5由一般由吸收层51、介电层52、反射层53构成。从吸收层一侧观察，多层干涉光变镀层在不同的角度观察呈现不同的颜色特征，因此，多层干涉光变镀层的形成顺序一般是吸收层51、介电层52、反射层53。反射层一般为较厚的金属材料，反射性好，透视观察呈现不透明或者基本不透明特征；介电层一般为完全透明或者基本完全透明的化合物材料；吸收层一般为较薄的金属材料，透光呈现半透明特征。所述反射层53可以由铝、银、铜、锡、铬、镍、钛或它们的合金构成，由于铝成本较低且易于被酸液或者碱液去除，因此优选为铝；所述介电层52可以由MgF 2、SiO 2、ZnS、TiN、TiO 2、TiO、Ti 2O 3、Ti 3O 5、Ta 2O 5、Nb 2O 5、CeO 2、Bi 2O 3、Cr 2O 3、Fe 2O 3、HfO 2或ZnO构成；所述吸收层53可以由镍、铬、铝、银、铜、锡、钛或它们的合金构成，优选为镍、铬。反射层53的厚度一般选择10nm-80nm，优选20nm-50nm。吸收层51的厚度一般为3-10nm。介电层52的厚度由所需的光变颜色特征决定，一般为200-600nm。
至此，便获得了第一区域呈现第一镀层光学特征和第二区域呈现第二镀层光学特征的光学防伪元件半成品。制作图3所示光学防伪元件的方法，一般还包括，在S5步骤后，涂布其他功能涂层7，比如抗老化胶，以起到对光学镀层保护的作用，和/或者热熔胶，以起到与其他基材粘接的作用。
下面结合图13至图20对根据本发明的制备如图4所示的光学防伪元件的方法进行描述，该方法包括步骤S1’至S7’。为叙述简洁起见，第一镀层选择为单一金属镀层，第二镀层选择为多层干涉光变镀层，即剖面结构图为图6和图7所示的光学防伪元件。
S1’、在基材1的表面上形成起伏结构层2，所述起伏结构层2至少包括由第一微结构组成的第一区域A、由第二微结构组成的第二区域B、以及由第三微结构构成的第三区域C，所述第二微结构的深宽比大于所述第一微结构的深宽比、所述第二微结构的比体积大于所述第一微结构的比体积、或者所述第二微结构的深宽比大于所述第一微结构的深宽比且所述第二微结构的比体积大于所述第一微结构的比体积，所述第三微结构的深宽比大于所述第二微结构的深宽比、所述第三微结构的比体积大于所述第二微结构的比体积、或者所述第三微结构的深宽比大于所述第二微结构的深宽比且所述第三微结构的比体积大于所述第二微结构的比体积，如图13所示。
基材1可以是至少局部透明的，也可以是有色的介电层，可以是表面带有功能涂层的透明介质薄膜，还可以是经过复合而成的多层膜。基材1一般由耐物化性能良好且机械强度高的薄膜材料形成，例如，可以使用聚对苯二甲酸乙二醇酯(PET)薄膜、聚萘二甲酸乙二醇酯(PEN)薄膜及聚丙烯(PP)薄膜等塑料薄膜形成基材1，而且基材1优选由PET材料形成。基材1上可以含有粘结增强层，以增 强基材1与起伏结构层2的粘结。基材1上也可以含有剥离层，以实现最终产品基材1与起伏结构层2的分离。
起伏结构层2可以通过紫外浇铸、模压、纳米压印等加工方式进行批量复制形成。例如，起伏结构层2可以由热塑性树脂通过模压工艺形成，即预先涂布在基材1上的热塑性树脂在经过高温的金属模版时，受热而软化变形，从而形成特定的起伏结构，之后冷却成型。起伏结构层2也可以采用辐射固化浇铸工艺形成，即通过将辐射固化树脂涂布在基材1上，一边将原版推压于其上，一边照射紫外线或电子束等放射线，使上述材料固化，然后取下原版从而形成起伏结构层2。
为实现后续镂空的需要，所述第二微结构的深宽比大于所述第一微结构的深宽比、所述第二微结构的比体积大于所述第一微结构的比体积、或者所述第二微结构的深宽比大于所述第一微结构的深宽比且所述第二微结构的比体积大于所述第一微结构的比体积，所述第三微结构的深宽比大于所述第二微结构的深宽比、所述第三微结构的比体积大于所述第二微结构的比体积、或者所述第三微结构的深宽比大于所述第二微结构的深宽比且所述第三微结构的比体积大于所述第二微结构的比体积。若后续采用气相沉积工艺形成保护层，优选地，所述第一微结构的深宽比大于等于0且小于0.3，第二微结构的深宽比大于0.2且小于0.5，所述第三微结构的比体积大于0.3且小于1。若后续采用涂布工艺形成保护层，优选地，所述第一微结构的比体积大于等于0um 3/um 2且小于0.5um 3/um 2，第二微结构的比体积大于0.4um 3/um 2且小于2um 3/um 2，所述第三微结构的比体积大于1um 3/um 2且小于3um 3/um 2。
所述第一微结构、第二微结构、第三微结构均可以为周期性结构或非周期性结构中的一种或组合，结构为正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构、弧形光栅结构中的一种或者组合。其中，第一微结构和第二微结构的尺寸以及横向排布由所需的光学效果决定。第一微结构可以选择为平坦结构。第三微结构的作用只是用来镂空，一般不提供额外的光学效果，因此可以简化，比如是一维排布的、截面为宽10um、高5um的等腰三角形(即深宽比为0.5、比体积为2.5um 3/um 2)的闪耀光栅。
S2’、在起伏结构层2上，形成用于获得第一镀层3的镀层，如图14所示。
在本实施例中，第一镀层3选择为单一金属反射镀层。金属反射镀层的作用是提高微结构形成光学效果的亮度。金属反射镀层的材料可以是Al、Cu、Ni、Cr、Ag、Fe、Sn、Au、Pt等金属或其混合物或合金，由于铝的成本低廉、亮度高且易于与酸液和碱液反应而去除，因此优选为铝。金属反射镀层的厚度一般选择大于10nm且小于80nm，优选大于20nm且小于50nm。金属反射镀层太薄，则亮度不够；金属反射镀层太厚，则与起伏结构层的牢度不好，且成本上升。第一镀层3或其子镀层可以通过物理和/或化学气相沉积的方法形成在起伏结构层2上，例如包括但不限于热蒸发、磁控溅射、MOCVD等。优选地，第一镀层3以均匀的表面密度、以同形覆盖的方式形成在起伏结构层2上。
S3’、形成第一保护层4，如图15所示。
如果第一微结构的深宽比小于第二微结构和第三微结构的深宽比，则可以采用气相沉积工艺形成第一保护层4。如果第一微结构的比体积小于第二微结构和第三微结构的比体积，则可以采用涂布工艺形成第一保护层4。如果第一微结构的深宽比小于第二微结构和第三微结构的深宽比，且第一微结构的比体积小于第二微结构和第三微结构的比体积，则既可以采用气相沉积工艺，又可以采用涂布工艺形成第一保护层4。
若采用气相沉积的工艺形成第一保护层4，则第一保护层材料可以选自能够适应于气相沉积工艺的无机物或有机物，如MgF 2、Sn、Cr、ZnS、ZnO、Ni、Cu、Au、Ag、TiO 2、MgO、SiO 2及Al 2O 3，以及丙烯酸酯、氨基甲酸酯丙烯酸酯、环氧丙烯酸酯等聚合性有机化合物。尤其，可以将有机化合物同引发剂混合使用，进行气相沉积后进行辐射固化使其聚合而成有机化合物。气相沉积之后，保护层的表面形貌和第一镀层的形貌同型或者基本同型。气相沉积形成保护层的量应使得对第一区域的第一镀层有足够的保护性。一般地，气相沉积保护层的厚度(相对于平坦区域)要大于20nm。
若采用涂布工艺形成第一保护层4，则涂布保护层的量需满足第一保护层4在第一微结构上的最小厚度明显大于在第二微结构和第三微结构的最小厚度。保护层在微结构的最小厚度一般位于微结构的最顶部。这样，第一保护层对第一区域的第一镀层的保护作用，要明显高于对第二区域和第三区域的第一镀层的保护作用。一般要求保护层在单位面积上的涂布量大于0.1g/m 2，小于0.6g/m 2。保护层的涂布之前的粘度越小越有利于流平，因此，保护胶液的粘度一般要小于100cP，优选小于50cP。就保护层的成分而言，可以是以聚酯、聚氨酯、丙烯酸树脂或者其组合为主树脂的清漆或者油墨。
S4’、将步骤S3’获得的多层结构体置于能够与第一镀层3反应的氛围中，直到位于第二区域B和第三区域C的第一镀层3的部分或者全部被去除为止，如图16所示。如前所述，第一保护层4对第一区域的第一镀层的保护作用，要明显高于对第二区域和第三区域的第一镀层的保护作用。因此，在一定的时间内，腐蚀氛围会通过第二区域和第三区域的保护层的脆弱点到达并腐蚀第一镀层；而在此时间内，第一保护层对第一区域的第一镀层形成有效的保护。这样便获得了，精确位于第一区域的第一镀层。如果第一镀层为铝或者含有铝的镀层，则腐蚀氛围可以是酸液或者碱液。通常，第二区域和第三区域上的第一镀层被腐蚀后，镀层上的第一保护层也随之浮脱。有时，第二区域和第三区域上的第一镀层被腐蚀后，镀层上的第一保护层可能部分甚至全部残留在起伏结构层上，这并不影响后续工序的实施。
S5’、形成用于获得第二镀层5的镀层，如图17所示。
本实施例，第二镀层5选择多层干涉光变镀层。多层干涉光变镀层5由一般由吸收层51、介电层52、反射层53构成。从吸收层一侧观察，多层干涉光变镀层在不同的角度观察呈现不同的颜色特征，因此，多层干涉光变镀层的形成顺序一般是吸收层51、介电层52、反射层53。反射层一般为较厚的金属材料，反射性好，透光呈现不透明或者基本不透明特征；介电层一般为完全透明或者基本完 全透明的化合物材料；吸收层一般为较薄的金属材料，透光呈现半透明特征。所述反射层53可以由铝、银、铜、锡、铬、镍、钛或它们的合金构成，由于铝成本较低且易于被酸液或者碱液去除，因此优选为铝；所述介电层52可以由MgF 2、SiO 2、ZnS、TiN、TiO 2、TiO、Ti 2O 3、Ti 3O 5、Ta 2O 5、Nb 2O 5、CeO 2、Bi 2O 3、Cr 2O 3、Fe 2O 3、HfO 2或ZnO构成；所述吸收层53可以由镍、铬、铝、银、铜、锡、钛或它们的合金构成，优选为镍、铬。反射层53的厚度一般选择10nm-80nm，优选20nm-50nm。吸收层51的厚度一般为3-10nm。介电层52的厚度由所需的颜色特征决定，一般为200-600nm。
S6’、形成第二保护层6，如图18所示。
如果第二微结构的深宽比小于第三微结构的深宽比，则可以采用气相沉积工艺形成第二保护层6。如果第二微结构的比体积小于第三微结构的比体积，则可以采用涂布工艺形成第二保护层6。如果第二微结构的深宽比小于第三微结构的深宽比，且第二微结构的比体积小于第三微结构的比体积，则既可以采用气相沉积工艺，又可以采用涂布工艺形成第二保护层6。形成第一保护层6的量应使得保护层对第二区域B的第二镀层5形成有效的保护，而对第三区域C的第二镀层5不会形成有效的保护。形成第二保护层6的材料和工艺要求和形成第一保护层4的材料和工艺要求是一致的。这里不再展开赘述。
S7’、将步骤S6’获得的多层结构体置于能够与第二镀层5反应的氛围中，直到位于第三区域C的第二镀层5的部分或者全部被去除为止，如图19和20所示。
如前所述，第二保护层6对第二区域B的第二镀层的保护作用，要明显高于对第三区域C的第二镀层的保护作用。因此，在一定的时间内，腐蚀氛围会通过第三区域的保护层的脆弱点到达并腐蚀第二镀层；而在此时间内，第二保护层6对第二区域的第二镀层形成有效的保护。这样便获得了，精确位于第二区域的第二镀层。通常，第一区域的第二镀层也会得到保留，但最终产品中由于第一镀层的遮挡并不提供光学效果。如果第二镀层为含有铝的镀层，则腐蚀氛围可以是酸液或者碱液。通常，第三区域上的第二镀层被腐蚀后，镀层上的第二保护层也随之浮脱。有时，第三区域上的第二镀层被腐蚀后，镀层上的第二保护层可能部分甚至全部残留在起伏结构层上，这并不影响后续工序的实施。
在本实施例中，第二镀层5选择多层干涉光变镀层。多层干涉光变镀层5由吸收层51、介电层52、反射层53构成。
如果吸收层51可以与腐蚀氛围发生反应，如反射层和吸收层均为铝，腐蚀氛围为酸液，则腐蚀氛围可以透过介电层52的脆弱位置与吸收层51反应，则第三区域C不残留任何镀层成分，因而呈现完全或者基本完全透明特征，如图19所示。如果吸收层51不与腐蚀氛围发生反应，如反射层53为铝，吸收层51为镍，腐蚀氛围为酸液，则腐蚀氛围只与反射层53反应，则第三区域C会留有吸收层和介电层，因而呈现半透明特征，如图20所示。
制作图6和7所示光学防伪元件的方法，一般还包括，在S7’步骤后，涂布其他功能涂层7，比 如抗老化胶，以起到对光学镀层保护的作用，和/或者热熔胶，以起到与其他基材粘接的作用。根据本发明的制备光学防伪元件的方法适合于制作开窗安全线、标签、标识、宽条、透明窗口、覆膜等。带有所述开窗安全线的防伪纸用于钞票、护照、有价证券等各类高安全产品的防伪。
以上结合附图详细描述了本发明实施例的可选实施方式，但是，本发明实施例并不限于上述实施方式中的具体细节，在本发明实施例的技术构思范围内，可以对本发明实施例的技术方案进行多种简单变型，这些简单变型均属于本发明实施例的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合。为了避免不必要的重复，本发明实施例对各种可能的组合方式不再另行说明。
本领域技术人员可以理解实现上述实施例方法中的全部或部分步骤是可以通过程序来指令相关的硬件来完成，该程序存储在一个存储介质中，包括若干指令用以使得单片机、芯片或处理器(processor)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
此外，本发明实施例的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明实施例的思想，其同样应当视为本发明实施例所公开的内容。

Claims (24)

  1. 一种光学防伪元件，其特征在于，包括：
    起伏结构层(2)；所述起伏结构层(2)包括：具有第一微结构的第一区域(A)和具有第二微结构的第二区域(B)；所述第二微结构的结构参数大于所述第一微结构的结构参数；
    所述第一区域(A)上设置有第一镀层(3)；所述第二区域(B)上设置有第二镀层(5)；所述第一区域(A)具有所述第一微结构和所述第一镀层(3)结合的光学特征；所述第二区域(B)具有所述第二微结构和所述第二镀层(5)结合的光学特征。
  2. 根据权利要求1所述的光学防伪元件，其特征在于，
    所述第一微结构或所述第二微结构为：周期性结构和非周期性结构中的一种结构，或周期性结构和非周期性结构组合的结构；
    所述第一微结构或所述第二微结构沿延展方向的截面结构为：平坦结构、正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构、弧形光栅结构中的一种结构，或平坦结构、正弦型结构、矩形光栅结构、梯形光栅结构、闪耀光栅结构、弧形光栅结构中至少任意两种结构组合的结构。
  3. 根据权利要求1所述的光学防伪元件，其特征在于，还包括：
    所述第二微结构的结构次级参数大于所述第一微结构的结构次级参数；
    所述结构参数为深宽比和比体积中选定的一种参数；
    所述结构次级参数相对所述结构参数为所述深宽比和所述比体积中剩余的一种参数。
  4. 根据权利要求1所述的光学防伪元件，其特征在于，
    所述结构参数包括：深宽比或比体积。
  5. 根据权利要求3或4所述的光学防伪元件，其特征在于，
    所述结构参数为深宽比；
    所述第一微结构的深宽比的范围为大于等于0且小于0.3；
    所述第二微结构的深宽比的范围为大于0.2且小于0.5。
  6. 根据权利要求3或4所述的光学防伪元件，其特征在于，
    所述结构参数为比体积；
    所述第一微结构的比体积的范围为大于等于0um 3/um 2且小于0.5um 3/um 2；
    所述第二微结构的比体积的范围为大于0.4um 3/um 2且小于2um 3/um 2。
  7. 根据权利要求1所述的光学防伪元件，其特征在于，
    所述第一镀层(3)和所述第二镀层(5)均为金属反射镀层，或者所述第一镀层(3)和所述第二镀层(5)均为多层干涉光变镀层，或者所述第一镀层(3)为金属反射镀层、所述第二镀层(5)为多层干涉光变镀层，或者所述第一镀层(3)为多层干涉光变镀层、所述第二镀层为金属反射镀层(5)。
  8. 根据权利要求7所述的光学防伪元件，其特征在于，
    所述金属反射镀层的材料包括：铝、银、铜、锡、铬、镍、钛中的一种金属，或铝、银、铜、锡、铬、镍、钛中至少任意两种金属组合构成的合金。
  9. 根据权利要求8所述的光学防伪元件，其特征在于，
    所述金属反射镀层的材料为铝。
  10. 根据权利要求7所述的光学防伪元件，其特征在于，
    所述多层干涉光变镀层包括：反射层、介电层和吸收层；
    所述反射层的材料包括：铝、银、铜、锡、铬、镍、钛中的一种金属，或铝、银、铜、锡、铬、镍、钛中至少任意两种金属组合构成的合金；
    所述介电层的材料包括：氟化镁、二氧化硅、硫化锌、氮化钛、二氧化钛、一氧化钛、三氧化二钛、五氧化三鈦、五氧化二钽、五氧化二铌、二氧化铈、三氧化二铋、三氧化二铬、氧化铁、二氧化铪或氧化锌；
    所述吸收层的材料包括：镍、铬、铝、银、铜、锡、钛中的一种金属，或镍、铬、铝、银、铜、锡、钛中至少任意两种金属组合构成的合金。
  11. 根据权利要求10所述的光学防伪元件，其特征在于，
    所述反射层的材料为铝；
    所述吸收层的材料为镍或铬，或者为镍铬合金。
  12. 根据权利要求1所述的光学防伪元件，其特征在于，
    所述起伏结构层(2)还包括：具有第三微结构的第三区域(C)；
    所述第三微结构的结构参数大于所述第二微结构的结构参数；
    所述第三区域(C)不具有所述第一镀层(3)或所述第二镀层(5)；
    透射观察时，所述第三区域(C)相对所述第一区域(A)和所述第二区域(B)具有镂空特征。
  13. 根据权利要求12所述的光学防伪元件，其特征在于，
    所述结构参数为深宽比；
    所述第三微结构的深宽比的范围为大于0.3且小于1。
  14. 根据权利要求12所述的光学防伪元件，其特征在于，
    所述结构参数为比体积；
    所述第三微结构的比体积的范围为大于1um 3/um 2且小于3um 3/um 2。
  15. 根据权利要求12所述的光学防伪元件，其特征在于，
    所述第一镀层(3)和所述第二镀层(5)中的一者为多层干涉光变镀层；
    所述多层干涉光变镀层包括：反射层、介电层和吸收层。
  16. 根据权利要求15所述的光学防伪元件，其特征在于，
    所述第三区域(C)不具有反射层、介电层或吸收层中的任意一层。
  17. 根据权利要求15所述的光学防伪元件，其特征在于，
    所述第三区域(C)具有吸收层和介电层且不具有反射层。
  18. 一种光学防伪元件的制作方法，其特征在于，该制作方法包括：
    S1)形成起伏结构层(2)，其中，所述起伏结构层(2)具有第一区域(A)和第二区域(B)，所述第一区域(A)具有第一微结构且所述第二区域(B)具有第二微结构，所述第二微结构具有所述第二微结构的结构参数大于所述第一微结构的结构参数的特点；
    S2)形成用于获得第一镀层(3)的镀层；
    S3)形成第一保护层；
    S4)将步骤S3)的半成品置于能够与步骤S2)中形成的镀层反应的氛围中，直到位于所述第二区域(B)的步骤S2)中形成的镀层的部分或者全部被去除为止，以使反应停止后获得所述第一镀层 (3)且所述第一镀层(3)和所述第一微结构在所述第一区域(A)处呈结合的光学特征；
    S5)形成用于获得第二镀层(5)的镀层。
  19. 根据权利要求18所述光学防伪元件的制作方法，其特征在于，步骤S1)还包括：
    其中，所述起伏结构层还具有第三区域(C)，所述第三区域(C)具有第三微结构，所述第三微结构具有所述第三微结构的结构参数大于所述第二微结构的结构参数的特点。
  20. 根据权利要求18或19所述光学防伪元件的制作方法，其特征在于，步骤S1)还包括：
    其中，所述第二微结构具有所述第二微结构的结构次级参数大于所述第一微结构的结构次级参数的特点；
    其中，所述结构参数为深宽比和比体积中选定的一种参数；
    其中，所述结构次级参数相对所述结构参数为所述深宽比和所述比体积中剩余的一种参数。
  21. 根据权利要求18或19所述光学防伪元件的制作方法，其特征在于，步骤S1)还包括：
    其中，所述结构参数包括：深宽比或比体积。
  22. 根据权利要求19所述光学防伪元件的制作方法，其特征在于，该制作方法还包括：
    S6)形成第二保护层；
    S7)将步骤S6)的产品置于能够与步骤S5)中形成的镀层反应的氛围中，直到位于所述第三区域(C)的步骤S5)中形成的镀层的部分或者全部被去除为止，以使反应停止后获得所述第二镀层(5)且所述第二镀层(5)和所述第二微结构在所述第二区域(B)处呈结合的光学特征，并且还使得透射观察时所述第三区域(C)相对所述第一区域(A)和所述第二区域(B)具有镂空特征。
  23. 根据权利要求22所述的光学防伪元件的制作方法，其特征在于，
    其中，步骤S2)中用于获得第一镀层(3)的镀层和/或步骤S5)中用于获得第二镀层(5)的镀层具有铝层；
    其中，选择能够与步骤S2)中的镀层反应的氛围和/或能够与步骤S5)中的镀层反应的氛围为酸液、或者选择能够与步骤S2)中的镀层反应的氛围和/或能够与步骤S5)中的镀层反应的氛围为碱液。
  24. 根据权利要求18或22所述的光学防伪元件的制备方法，其特征在于，该制作方法还包括：
    施加无机或者有机的镀层、或者施加无机或者有机的涂层工序，以实现附加光学防伪功能或者辅助功能。
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