WO2020253809A1 - 光接收组件、光收发组件、光模块以及光网络设备 - Google Patents

光接收组件、光收发组件、光模块以及光网络设备 Download PDF

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Publication number
WO2020253809A1
WO2020253809A1 PCT/CN2020/097010 CN2020097010W WO2020253809A1 WO 2020253809 A1 WO2020253809 A1 WO 2020253809A1 CN 2020097010 W CN2020097010 W CN 2020097010W WO 2020253809 A1 WO2020253809 A1 WO 2020253809A1
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WIPO (PCT)
Prior art keywords
transimpedance amplifier
optical
filter device
ground
photodiode
Prior art date
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Ceased
Application number
PCT/CN2020/097010
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English (en)
French (fr)
Inventor
操日祥
熊宇
王泽林
于哲
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to JP2021576116A priority Critical patent/JP7290756B2/ja
Priority to EP20827800.2A priority patent/EP3975451A4/en
Priority to KR1020227001329A priority patent/KR102624304B1/ko
Publication of WO2020253809A1 publication Critical patent/WO2020253809A1/zh
Priority to US17/557,450 priority patent/US11848710B2/en
Anticipated expiration legal-status Critical
Priority to US18/491,572 priority patent/US12470303B2/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/69—Electrical arrangements in the receiver
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/67—Optical arrangements in the receiver
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/69—Electrical arrangements in the receiver
    • H04B10/693—Arrangements for optimizing the preamplifier in the receiver
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
    • H03F3/08—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only controlled by light
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
    • H03F3/08—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only controlled by light
    • H03F3/087—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only controlled by light with IC amplifier blocks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/69—Electrical arrangements in the receiver
    • H04B10/691—Arrangements for optimizing the photodetector in the receiver
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/69—Electrical arrangements in the receiver
    • H04B10/697—Arrangements for reducing noise and distortion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/66—Non-coherent receivers, e.g. using direct detection
    • H04B10/69—Electrical arrangements in the receiver
    • H04B10/697—Arrangements for reducing noise and distortion
    • H04B10/6972—Arrangements for reducing noise and distortion using passive filtering

Definitions

  • This application relates to the field of optical communications, in particular to optical receiving components, optical transceiver components, optical modules, and optical network equipment.
  • Optical communication networks have become the mainstream of modern communication solutions by virtue of their advantages such as ultra-high bandwidth and low electromagnetic interference. Access networks represented by fiber to the home are being deployed on a large scale.
  • Optical communication networks mainly exist in the form of passive optical networks (PON).
  • Optical network equipment in PON includes optical line terminals (OLT), optical network units (ONU), and so on.
  • the optical receiving component is an indispensable device in the optical network equipment.
  • the optical receiving component is used to receive optical signals and convert the optical signals into electrical signals. Since the light receiving component is usually in a complex electromagnetic radiation environment, the electromagnetic crosstalk of the communication signal of the light receiving component cannot be ignored. How to reduce the electromagnetic crosstalk of the light receiving component is an urgent problem in the industry.
  • the present application provides an optical receiving component, an optical transceiver component, an optical module, and an optical network device, which can improve the anti-electromagnetic crosstalk performance of the optical receiving component.
  • a light receiving component including: a photodiode, a transimpedance amplifier, and a first filter component, wherein the photodiode is used to convert an optical signal into an electrical signal, and the photodiode
  • the anode is connected to the input end of the transimpedance amplifier, and the negative stage of the photodiode is used to connect to the power supply;
  • the transimpedance amplifier is used to amplify the electrical signal output by the photodiode, and the power end of the transimpedance amplifier is used for To connect to a power source, the first ground terminal of the transimpedance amplifier is used to connect to the external ground; the first terminal of the first filter device is connected to the second ground terminal of the transimpedance amplifier, and the The second end is used to connect to the external ground.
  • the first ground terminal of the transimpedance amplifier is connected to the external ground to achieve DC grounding.
  • a first filter device is provided between the second ground terminal of the transimpedance amplifier and the external ground to achieve AC grounding. The first filter device can filter out electromagnetic crosstalk signals from the ground, thereby improving the anti-electromagnetic interference of the light receiving component performance.
  • the light receiving assembly further includes a base, the base is used to connect to an external ground, and the first ground terminal of the transimpedance amplifier is connected to the external ground through the base, The second end of the first filter element is connected to the external ground through the base.
  • the light receiving assembly includes a base, and the base can be connected to an external ground.
  • Each device or component in the light receiving assembly such as a transimpedance amplifier or each filter component, can be connected to the outside through the base, thereby realizing the grounding function of the internal components of the light receiving assembly and optimizing the structure of the light receiving assembly.
  • the light receiving component further includes a second filter component, the first end of the second filter component is connected to the negative stage of the photodiode, and the second The second end of the filter device is connected to the first end of the first filter device.
  • the second filter device and the first filter device can filter the crosstalk signal from the power terminal of the photodiode.
  • the second filter element, photodiode, and transimpedance amplifier can also form an independent signal loop, so that the return path of the high-frequency signal does not pass through the base. It not only suppresses the electromagnetic crosstalk from the power supply, but also isolates and absorbs the electromagnetic crosstalk from the base ground (base GND) or the transimpedance amplifier, thereby realizing the full path isolation of the electromagnetic crosstalk from the entire transimpedance amplifier circuit of the optical receiving component. Improve the performance of anti-electromagnetic crosstalk.
  • the light receiving component further includes a third filter device, the first end of the third filter device is connected to the power terminal of the transimpedance amplifier, and the first The second end of the three filter element is connected to the second ground end of the transimpedance amplifier.
  • the first filter device and the third filter device can filter the crosstalk signal from the power terminal of the transimpedance amplifier.
  • the third filter element and the transimpedance amplifier can also form an independent signal loop, so that the return path of the high-frequency signal does not pass through the base. It not only suppresses the electromagnetic crosstalk from the power supply, but also isolates and absorbs the electromagnetic crosstalk from the base ground (base GND) or transimpedance amplifier, improving the performance of anti-electromagnetic crosstalk.
  • the light receiving assembly further includes a fourth filter device, and the first end of the fourth filter device is connected to the second end of the third filter device, so The second end of the fourth filter device is connected to the outside.
  • the third filter device and the fourth filter device can filter the crosstalk signal from the power terminal of the transimpedance amplifier.
  • the third filter device and the transimpedance amplifier can also form an independent signal loop. So that the return path of the high-frequency signal does not pass through the base. It not only suppresses the electromagnetic crosstalk from the power supply, but also isolates and absorbs the electromagnetic crosstalk from the base ground (base GND) or the ground terminal of the transimpedance amplifier, improving the performance of anti-electromagnetic crosstalk.
  • the light receiving component further includes a fifth filter device, the first end of the fifth filter device is connected to the power terminal of the transimpedance amplifier, and the The second end of the five filter element is connected to the external ground.
  • the fifth filter device can be used to suppress the crosstalk signal from the power terminal of the transimpedance amplifier, thereby improving the anti-electromagnetic crosstalk performance of the optical receiving component.
  • the light receiving component further includes a sixth filter element, the first end of the sixth filter element is connected to the cathode of the photodiode, and the sixth filter element The second end of the device is connected to the external ground.
  • the sixth filter device can be used to suppress the crosstalk signal from the power terminal of the photodiode, thereby improving the anti-electromagnetic crosstalk performance of the light receiving component.
  • the capacitance of the first filter element is greater than 100 pF.
  • the large capacitance effect of the first filter element can absorb and isolate the crosstalk signal from the base ground and the ground terminal of the transimpedance amplifier, so as to filter the electromagnetic crosstalk from the ground.
  • the scattering parameter of the first filter device in the crosstalk signal frequency band is greater than 20 dB.
  • the scattering parameter of the first filter device in the frequency band of the crosstalk signal can be set to be larger, so that the first filter device has a stronger filtering effect on the crosstalk signal.
  • the first filter device includes a capacitor.
  • the second ground terminal of the transimpedance amplifier includes an input stage ground terminal of the transimpedance amplifier.
  • the input stage ground terminal of the transimpedance amplifier is used as the second ground terminal, and the electromagnetic crosstalk signal from the ground can be filtered before the transimpedance amplifier input stage, that is, before the transimpedance amplification effect.
  • the crosstalk signal is amplified by the transimpedance amplifier to enhance the influence of electromagnetic crosstalk, thereby optimizing the anti-electromagnetic interference performance.
  • the power terminal of the transimpedance amplifier and the cathode of the photodiode are used to connect to the same external power source.
  • the power terminal of the transimpedance amplifier and the cathode of the photodiode are connected to the same external power source, so there is no need to provide more external power sources, which has the advantage of simplifying circuit design.
  • the power terminal of the transimpedance amplifier and the cathode of the photodiode are used to connect different external power sources.
  • the power terminal of the transimpedance amplifier and the cathode of the photodiode are respectively connected to different external power sources, thereby improving the flexibility of circuit design.
  • the power terminal of the transimpedance amplifier is used to connect to an external power source
  • the transimpedance amplifier includes a voltage regulation module
  • the voltage regulation module and the transimpedance amplifier The power terminal is connected
  • the negative electrode of the photodiode is used to connect the voltage regulation module.
  • the power terminal of the transimpedance amplifier is connected to an external power source, and the photodiode is powered by a voltage regulation module inside the transimpedance amplifier, so there is no need to provide more external power sources, which has the advantage of simplifying circuit design.
  • an optical transceiver component in a second aspect, includes the optical receiving component described in the first aspect or any one of the possible implementation manners of the first aspect.
  • an optical module in a third aspect, includes the optical transceiver assembly described in the second aspect.
  • an optical network device in a fourth aspect, includes the optical module described in the third aspect.
  • the optical network device is an OLT or an ONU.
  • Fig. 1 is a schematic diagram of an application scenario of an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a light receiving component packaged in a transistor outline package (TO CAN) form according to an embodiment of the present application.
  • TO CAN transistor outline package
  • Fig. 3 is a schematic circuit diagram of a light receiving component according to an embodiment of the present application.
  • Fig. 4 is a schematic diagram of a signal return path of a light receiving component in the prior art.
  • Fig. 5 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • Fig. 6 is a schematic diagram of a transimpedance amplifier according to an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a transimpedance amplifier according to another embodiment of the present application.
  • FIG. 8 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • Fig. 9 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • Fig. 10 shows a schematic diagram of a filter device in an embodiment of the present application.
  • Fig. 11 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • Fig. 12 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • FIG. 13 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • FIG. 14 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • FIG. 15 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • 16(a) and 16(b) are schematic diagrams of the signal return path of the light receiving component in FIG. 15.
  • Fig. 17 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • 18(a) and 18(b) are schematic diagrams of the signal return path of the light receiving module in FIG. 17.
  • FIG. 19 is a schematic circuit diagram of a light receiving component according to another embodiment of the present application.
  • Fig. 20 is a schematic structural diagram of the TO CAN package of the optical receiving component in Fig. 15.
  • Fig. 21 is a schematic structural diagram of the TO CAN package of the optical receiving component in Fig. 19.
  • next-generation PON next-generation PON
  • NG-PON next-generation PON
  • NG-PON1 next-generation PON2
  • 1000 Megabit PON gigabit-capable PON, GPON
  • 10 gigabit per second PON (10 gigabit per second PON, XG-PON), symmetric 10 gigabit-capable symmetric passive optical network, XGS -PON
  • Ethernet PON (Ethernet PON, EPON), 10 gigabit per second EPON (10 gigabit per second EPON, 10G-EPON), next-generation EPON (next-generation EPON, NG-EPON)
  • wavelength division multiplexing wavelength division multiplexing
  • WDM wavelength division multiplexing
  • TWDM time-and wavelength-division multiplexing
  • TWDM point-to-point
  • P2P point-to-point
  • P2P-WDM PON point-to-point
  • FIG. 1 is a schematic diagram of a passive optical network (PON) application scenario according to an embodiment of the present application.
  • a passive optical network includes an optical line terminal (optical line termination, OLT), an optical distribution network (optical distribution network, ODN), and an optical network unit (ONU).
  • OLT optical line termination
  • ODN optical distribution network
  • ONU optical network unit
  • the OLT is connected to multiple ONUs set on the user side through the ODN.
  • Both the OLT and the ONU contain one or more optical modules.
  • the optical modules include optical sub-assembly (OSA), which will transmit analog or digital Signals are converted into optical signals for transmission, and optical signals are received and converted into corresponding analog or digital signals, thereby realizing high-speed optical transmission between OLT and ONU.
  • OSA optical sub-assembly
  • Optical network equipment for example, OLT or ONU
  • optical components which are used to receive and transmit optical signals.
  • the above-mentioned optical assembly may include a receiving optical sub-assembly (ROSA), a transmitting optical sub-assembly (TOSA), or a bi-directional optical sub-assembly (BOSA).
  • ROSA receiving optical sub-assembly
  • TOSA transmitting optical sub-assembly
  • BOSA bi-directional optical sub-assembly
  • the light receiving component is used to receive optical signals and convert the optical signals into electrical signals.
  • the light emitting component is used to convert electrical signals into optical signals and send the optical signals.
  • the optical transceiver component includes both the function of the optical receiving component and the function of the optical transmitting component, that is, it can be understood that the optical transceiver component includes the optical receiving component and the optical emitting component.
  • the optical receiving component may also be referred to as an optical receiver. It should be noted that the embodiments of the present application do not limit the types of optical network devices to which optical modules and optical components are applied. In addition to the OLT and the ONU, the optical modules and optical components in the embodiments of the present application can also be applied to other types of optical network equipment, such as optical switches or routers.
  • FIG. 2 is a schematic structural diagram of a light receiving component 10 packaged in a transistor outline can (TO CAN) form according to an embodiment of the present application.
  • the light receiving component includes a photodiode (PD) 2, a trans-impedance amplifier (TIA) 3, and common electrical components such as capacitors, resistors, and inductors that drive them to work normally.
  • the light receiving assembly may also include a base 4 for carrying the above-mentioned components, a cap 5 for sealing and optical signal coupling, a lens and other functional components.
  • the above-mentioned base 4 may also be referred to as a header.
  • a number of pins 6 are provided on the base 4, and each pin 6 is respectively used for connecting to power, grounding or outputting electrical signals after photoelectric conversion.
  • the pin 6 on the base 4 can be connected with the signal electrode on the photodiode 2 and the transimpedance amplifier 3 by using a gold wire, so that the signal after photoelectric conversion can be output. Since the light received by the photodiode is relatively weak, it is necessary to output the electrical signal generated by the photodiode 2 to the transimpedance amplifier 3 for amplification, and then output the amplified electrical signal through the pin 6.
  • the pins 6 and the base of the base 4 are electrically isolated.
  • glass glue or other insulating materials can be used to separate the two.
  • the entire substrate can be used as a ground plane and connected to the outside through a special pin connected to the substrate.
  • the external ground can be understood as the earth, or a conductor connected to the earth.
  • the various components on the base 4 can also be connected by welding.
  • the ONU and terminal devices usually use wireless fidelity (WIFI) and other wireless communication technologies for transmission, so the optical receiving components are usually complicated In an electromagnetic radiation environment.
  • WIFI wireless fidelity
  • the interference of electromagnetic radiation on the communication signal of the light receiving component is called electromagnetic crosstalk, and the interference signal can also be called crosstalk signal.
  • the interference signal can also be called crosstalk signal.
  • the modulation frequency of the 10G PON signal and the 5G WIFI carrier are in the same frequency band (both 5GHz)
  • the electromagnetic crosstalk generated by the 5G WIFI signal is difficult to filter out by traditional filtering means.
  • the electrical signal generated in the optical receiving component is about 0.1 microampere (uA) to 10uA
  • the transmit power of 5G WIFI signal is usually up to 500 milliwatts (mW), which is five hundred greater than the signal of the optical receiving component.
  • mW milliwatts
  • the influence of electromagnetic crosstalk on the optical receiving components is usually characterized by the defined power cost of the difference between the sensitivity when there is no crosstalk and the sensitivity when there is crosstalk.
  • the degree of interference It can reach more than ten decibels (dB), which seriously affects the normal operation of the system. Therefore, how to reduce the electromagnetic crosstalk of the light receiving component is an urgent problem in the industry.
  • optical switches, routers and other equipment In a high-speed (such as a transmission rate greater than 10G) Ethernet transmission system, optical switches, routers and other equipment generally have optical receiving components, which are also exposed to a more complex electromagnetic radiation environment.
  • the high-speed drive current of the light emitting component in the optical component is usually up to 100mA or more.
  • These high-speed alternating currents will emit electromagnetic waves when the impedance is discontinuous in the circuit, thereby generating weak electrical signals (about It is 0.1 microampere (uA) ⁇ 10uA order of magnitude) to form interference.
  • This interference is usually referred to as the crosstalk between transmission and reception.
  • this application proposes an anti-electromagnetic crosstalk optical receiving component solution, which reduces the influence of electromagnetic crosstalk on the sensitivity of the optical receiving component by adopting a special anti-interference structure.
  • FIG. 3 is a schematic circuit diagram of the light receiving assembly 10 according to an embodiment of the present application.
  • the light receiving assembly 10 includes a photodiode (PD) 2, a transimpedance amplifier (TIA) 3, and a base.
  • the cathode of the photodiode 2 is connected to the power supply terminal V PD
  • the power supply terminal V PD is used to connect the power supply V PD
  • the power supply V PD is the driving power supply of the photodiode 2.
  • the anode of the photodiode 2 is connected to the input terminal of the transimpedance amplifier 3.
  • the photodiode 2 is used for photoelectric conversion and generates electrical signals. Since the current output by the photodiode 2 is relatively weak, the electrical signal output by the photodiode 2 is amplified by the transimpedance amplifier 3, and the transimpedance amplifier 3 outputs the amplified electrical signal.
  • the structure of the transimpedance amplifier 3 shown in FIG. 3 is an example of the transimpedance amplifier 3, and the transimpedance amplifier 3 may include an equivalent transimpedance 32 and an output buffer 34, for example.
  • the amplification factor of the transimpedance amplifier 3 is usually characterized by the equivalent transimpedance 32, which is equal to the ratio of the voltage swing of the output signal of the transimpedance amplifier 3 to the input weak electrical signal current, and the output buffer 34 is a transimpedance amplifier
  • the output stage 3 is used to output the signal amplified by the transimpedance amplifier 3 in a certain way, such as a differential amplifier output or a simple single-ended output.
  • the transimpedance amplifier 3 may also include an input terminal, an output terminal (TIA OUT+, TIA OUT-), a power terminal V CC and a ground terminal (GND1, GND2).
  • the input end of the transimpedance amplifier 3 is used to receive the electrical signal output by the photodiode 2, and the output end of the transimpedance amplifier 3 is used to output the amplified electrical signal.
  • the output terminal of the transimpedance amplifier 3 may include differential signal output terminals TIA OUT+ and TIA OUT-.
  • the power terminal V CC of the transimpedance amplifier 3 is used to connect to the power source V CC , and the power source V CC is the power supply of the transimpedance amplifier 3.
  • the ground terminal of the transimpedance amplifier 3 may be grounded. As shown in FIG. 3, the ground terminal of the transimpedance amplifier 3 can be connected to the external ground by connecting with the base (base GND). As mentioned above, the connection between the ground terminal and the base may refer to the connection with the base of the base, and the base is connected to the external ground through a special pin.
  • Figure 3 also shows the return path of the crosstalk signal and the normal signal.
  • the electromagnetic crosstalk may include three types of crosstalk signals according to different sources of the crosstalk signals entering the light receiving component 10.
  • the first type is the crosstalk signal entering the signal loop through the power terminal V PD of the photodiode 2
  • the second type is the crosstalk signal entering the signal loop through the power terminal V CC of the transimpedance amplifier 3
  • the third type is through the ground (GND)
  • the crosstalk entering the signal loop for example, can be understood as the crosstalk signal entering the signal loop through the base ground (base GND) or the ground terminal of the transimpedance amplifier 3.
  • the above-mentioned three kinds of crosstalk signals cause interference to normal signals, so these crosstalk signals should be filtered out as much as possible when designing the circuit.
  • Figure 4 shows a solution to electromagnetic crosstalk.
  • the light receiving component 10 includes a fifth filter element 15 and a sixth filter element 16.
  • the first end of the fifth filter element 15 is connected to the power supply terminal V CC
  • the second end of the fifth filter element 15 is connected to Base connection.
  • the fifth filter device 15 can be used to filter the crosstalk signal from the power terminal V CC .
  • the first end of the sixth filter element 16 is connected to the power supply terminal V PD
  • the second end of the sixth filter element 16 is connected to the base.
  • the sixth filtering device 16 can be used to filter the crosstalk signal from the power terminal V PD .
  • the circuit of Fig. 4 cannot handle the crosstalk signal that enters the signal loop from the base ground (base GND) or the ground terminal of the transimpedance amplifier 3.
  • the crosstalk signal may enter the return path of the signal through the lower surface of the fifth filter element 15, or may enter the return path of the signal through the lower surface of the sixth filter element 16, or may pass through the base ground (base GND)
  • the ground terminal of the transimpedance amplifier 3 enters the signal return path.
  • the crosstalk signal is amplified by the transimpedance amplifier 3 and mixed with the normal signal for output, which has a greater impact on the circuit crosstalk.
  • the frequency of the crosstalk signal of the 5G WIFI is consistent with the frequency of the normal signal of the system, and the crosstalk signal is difficult to filter out in the subsequent circuit.
  • an electromagnetic shielding cover can be added outside the light receiving assembly 10 to further reduce the power cost to ensure the normal operation of the system.
  • this increases the cost on the one hand, and on the other hand, due to the large size of the shielding cover, the size of the entire light receiving assembly 10 is increased, which is difficult to meet the requirements of compact scenes.
  • FIG. 5 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the light receiving component 10 includes a photodiode 2, a transimpedance amplifier 3, and a first filter device 11.
  • the connection relationship between the photodiode 2 and the transimpedance amplifier 3 is the same as that of FIG. 3, and for the sake of brevity, it will not be repeated here.
  • the first ground terminal (GND1) of the transimpedance amplifier 3 is used to connect to the external ground
  • the second ground terminal (GND2) of the transimpedance amplifier 3 is connected to the first terminal of the first filter element 11.
  • the second end of the filter device 11 is connected to the outside.
  • the first filter device 11 is arranged between the external ground and the second ground terminal (GND2) of the transimpedance amplifier 3. This structure can effectively filter the crosstalk signal from the ground.
  • the first ground terminal (GND1) of the transimpedance amplifier 3 is connected to the external ground to achieve DC grounding.
  • a first filter device 11 is provided between the second ground terminal (GND2) of the transimpedance amplifier 3 and the external ground to achieve AC grounding.
  • the first filter device 11 can filter out electromagnetic crosstalk signals from the ground, thereby improving light The anti-electromagnetic interference performance of the receiving component 10.
  • the transimpedance amplifier 3 includes one or more grounding terminals.
  • the transimpedance amplifier 3 that only contains one grounding terminal it can also be obtained through an extension method (for example, one grounding spot welding multiple wires to the ground) The effect of the ground terminal.
  • the multiple ground terminals of the transimpedance amplifier 3 can be divided into multiple first ground terminals (GND1) and multiple second ground terminals (GND2).
  • a transimpedance amplifier may include one or more input stage ground terminals, one or more output stage ground terminals, and may also include one or more intermediate stage ground terminals.
  • the intermediate stage ground terminal may refer to functionally located in the input stage and the output stage. Between the ground terminals.
  • the transimpedance amplifier may include one or more first ground terminals, One or more second ground terminals.
  • the transimpedance amplifier shown in FIG. 6 includes one input ground terminal 301 and 2 output stage ground terminals 302, 303.
  • the first ground terminal and the second ground terminal that can be divided are as follows:
  • 301 is the first ground terminal, and the combination of 302 and 303 is the second ground terminal.
  • 301 is the first ground terminal
  • 302 is the first ground terminal
  • 303 is the second ground terminal.
  • 301 and 302 are respectively used as independent first ground terminals, that is, 301 and 302 are both first ground terminals.
  • 301 is the first ground terminal
  • 302 is the second ground terminal
  • 303 is the second ground terminal.
  • 302 and 303 are respectively used as independent second ground terminals, that is, 302 and 303 are both the second ground terminals described in this application.
  • 301 is the second ground terminal, and the combination of 302 and 303 is the first ground terminal.
  • 301 is the second ground terminal
  • 302 is the second ground terminal
  • 303 is the first ground terminal.
  • 301 and 302 are respectively used as independent second ground terminals, that is, 301 and 302 are both second ground terminals.
  • 301 is the second ground terminal
  • 302 is the first ground terminal
  • 303 is the first ground terminal.
  • 302 and 303 are respectively used as independent first ground terminals, that is, 302 and 303 are both the first ground terminals described in this application.
  • the transimpedance amplifier 3 can have multiple first ground terminals (GND1) and multiple second ground terminals (GND2) division methods.
  • One or more first ground terminals (GND1) of the transimpedance amplifier 3 are respectively used to connect to DC ground (external ground), and one or more second ground terminals (GND2) of the transimpedance amplifier 3 are respectively used to connect to AC ground ( They are respectively grounded through the filter device (such as the first filter device 11).
  • the first filter device 11 may include multiple independent filters, and each filter is connected to the second ground terminal (GND2).
  • FIG. 7 is an example of the division scheme of the first ground terminal (GND1) and the second ground terminal (GND2) of the transimpedance amplifier 3 in this application, in which the input ground terminals 401 and 402 with the same function are combined in Together as the second ground terminal (GND2), combine the intermediate ground terminals 403 and 404 with the same function as the second ground terminal (GND2), and combine the output stage ground terminals 405 and 406 with the same function as the The first ground terminal (GND1).
  • the second ground terminal (GND2) is connected to the first filter component 111, and the second ground terminal 302 (GND2) is connected to another first filter component 112.
  • the ground terminals 401 and 402 have the same functions in the transimpedance amplifier 3, and their physical locations Being close together and connected with the first filter element 111 together can reduce the use of the first filter element and reduce the cost, and at the same time realize the filtering of the electromagnetic interference noise of the grounding terminals 401 and 402, thereby having optimized anti-electromagnetic interference performance.
  • the grounding terminals 403 and 404 have the same function in the transimpedance amplifier 3, are physically located close, and are connected to the first filter element 112 together, and also have optimized anti-electromagnetic interference performance.
  • the input stage ground terminal and the intermediate stage ground terminal of the transimpedance amplifier 3 are both used as the second ground terminal (GND2) to connect to the first filter element (111, 112), which can filter out the input stage ground terminal and the intermediate stage ground terminal. End electromagnetic interference noise, thereby enhancing the anti-electromagnetic interference performance.
  • the output stage ground terminal of the transimpedance amplifier 3 is used as the second ground terminal (GND2) to connect to the first filter component 111, the electromagnetic interference noise at the output stage ground terminal can also be filtered out, thereby enhancing the anti-electromagnetic interference performance .
  • the first ground terminal (GND1) of the transimpedance amplifier 3 is used to connect to the DC ground (external ground), and the second ground terminal (GND2) of the transimpedance amplifier 3 is used to connect to the AC ground (grounded through the filter device).
  • the first filter element (11, 111, 112) can be connected to the first filter element (11, 111, 112) to filter out the electromagnetic interference noise of the corresponding ground terminal, thereby enhancing the anti-electromagnetic Interference performance.
  • the input stage of the transimpedance amplifier 3 that is, before the transimpedance amplification effect, can be The electromagnetic crosstalk signal of the ground terminal) can be filtered out, which can prevent the crosstalk signal from being amplified by the transimpedance amplifier to enhance the influence of electromagnetic crosstalk, thereby optimizing the anti-electromagnetic interference performance.
  • the light receiving assembly 10 includes a base, and the base can be connected to an external ground.
  • Related components inside the light receiving assembly 10 can be connected to the outside through the base.
  • the first ground terminal (GND1) of the transimpedance amplifier 3 is connected to the external ground through the base of the light receiving assembly 10
  • the second end of the first filter component 11 is connected to the external ground through the base of the light receiving assembly 10.
  • related components inside the light receiving assembly 10 may also be directly connected to the outside.
  • the first filter device 11 may be a filter device with a large capacitance value.
  • the capacitance of the first filter element 11 may be 100 picofarads (pF) or greater than 100 pF.
  • the external ground connected to the base may refer to the ground of the veneer.
  • the parasitic parameters of the crosstalk signal accumulated on the base ground (base GND) or the ground terminal of the transimpedance amplifier 3 are small and the leakage is fast.
  • the crosstalk signal gathers in a short time and has the characteristic of pulse.
  • the large capacitance value of the first filter element 11 can absorb and isolate the crosstalk signal from the base ground (base GND) or the ground terminal of the transimpedance amplifier 3, so as to filter the electromagnetic crosstalk from the ground.
  • the scattering parameter of the first filter device 11 in the frequency band of the crosstalk signal can be set to be larger, so that the first filter device 11 has a stronger filtering effect on the crosstalk signal.
  • the scattering parameter of the crosstalk signal of the first filter device 11 may be set to be greater than 20 dB.
  • the light receiving assembly 10 of the embodiment of the present application further has various modifications, which all fall within the protection scope of the embodiment of the present application.
  • the light receiving component 10 can further filter the crosstalk signal from the power terminal V PD , or filter the crosstalk signal from the power terminal V CC , or can also perform other functions.
  • the light receiving assembly 10 of the embodiment of the present application will be described below in conjunction with the accompanying drawings.
  • the power source V CC of the transimpedance amplifier 3 and the power source V PD of the photodiode 2 may be the same external power source or different external power sources.
  • the power terminal V CC of the transimpedance amplifier 3 and the cathode of the photodiode 2 can be connected to the same external power source V CC .
  • the light receiving component 10 can be connected to an external power source, which simultaneously supplies power to the transimpedance amplifier 3 and the photodiode 2.
  • the power terminal V CC of the transimpedance amplifier 3 may be connected to the external power source V CC , and the transimpedance amplifier 3 may include a voltage regulation module (not shown in the figure). Out), the voltage regulation module is connected to the power terminal V CC of the transimpedance amplifier 3, and the negative electrode of the photodiode 2 is connected to the voltage regulation module.
  • the voltage regulation module can convert the input voltage and generate a converted output voltage.
  • the voltage regulation module is equivalent to the power supply V PD of the photodiode.
  • the power supply of the transimpedance amplifier 3 is an external power source, and the photodiode is powered by the built-in voltage regulation module of the transimpedance amplifier 3.
  • the voltage regulation module may also be referred to as a built-in power supply module or a voltage regulator, a voltage converter, etc.
  • the filter devices in the various embodiments of the present application may refer to devices that can implement a filtering function for a specific electromagnetic crosstalk frequency band.
  • the filter device may include an active filter device and/or a passive filter device.
  • Fig. 10 shows a schematic diagram of a filter device in an embodiment of the present application.
  • the filter device may include a capacitor.
  • the filter device may include capacitors and resistors, or may also include other integrated devices.
  • the filter device may include capacitors and inductors, or may also include other integrated devices.
  • the filter device may be formed by connecting a plurality of capacitors in series. As shown in (e) in FIG. 10, the filter device may be formed by a plurality of capacitors in parallel.
  • the capacitor or inductor in FIG. 10 may be a structure formed by wire bonding. It can be understood that the filter devices in the various embodiments of the present application are not limited to the devices in the foregoing examples, and may also be in other forms. As long as they can achieve a filtering function for a specific electromagnetic crosstalk frequency band, they can all be understood as each of the present application.
  • the filter device in the embodiment is not limited to the devices in the foregoing examples, and may also be in other forms. As long as they can achieve a filtering function for a specific electromagnetic crosstalk frequency band, they can all be understood as each of the present application.
  • the filter device in the embodiment is not limited to the devices in the foregoing examples, and may also be in other forms. As long as they can achieve a filtering function for a specific electromagnetic crosstalk frequency band, they can all
  • FIG. 11 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the light receiving assembly 10 may further include a second filter device 12.
  • the first end of the second filter element 12 is connected to the negative electrode of the photodiode 2, and the second end of the second filter element 12 is connected to the first end of the first filter element 11.
  • the second filter element 12 is arranged between the negative electrode of the photodiode 2 and the first filter element 11. Since the negative electrode of the photodiode 2 is used to connect to the power terminal V PD , it can also be considered that the second filter element 12 is disposed between the power terminal V PD and the first filter element 11.
  • the second filter element 12 and the first filter element 11 can filter the crosstalk signal from the power terminal V PD of the photodiode 2.
  • the second filter element 12, the photodiode 2 and the transimpedance amplifier 3 can also form an independent signal loop, so that the return path of the high frequency signal does not pass through the base. It not only suppresses the electromagnetic crosstalk from the power supply, but also isolates and absorbs the electromagnetic crosstalk from the base ground (base GND) or the ground terminal of the transimpedance amplifier 3, thereby realizing the effect of the entire transimpedance amplifier circuit of the optical receiving assembly 10 on the electromagnetic crosstalk. Full path isolation improves the performance of anti-electromagnetic crosstalk.
  • the scattering parameter of the second filter device 12 in the crosstalk signal frequency band can be set as large as possible, so that the second filter device 12 has a strong filtering effect on the crosstalk signal.
  • the scattering parameter of the crosstalk signal of the second filter device 12 may be greater than 20 dB.
  • FIG. 12 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the light receiving assembly 10 includes a first filter device 11 and a third filter device 13.
  • the first end of the third filter element 13 is connected to the power terminal V CC of the transimpedance amplifier 3, and the second end of the third filter element 13 is connected to the second ground end (GND2) of the transimpedance amplifier 3.
  • the third filter device 13 is disposed between the power terminal V CC of the transimpedance amplifier 3 and the second ground terminal (GND2) of the transimpedance amplifier 3.
  • the power terminal V CC of the transimpedance amplifier 3 is used to connect to the power source V CC , and the second ground terminal (GND2) of the transimpedance amplifier 3 is connected to the first terminal of the first filter device 11, it can also be regarded as the third filter device. 13 is provided between the power source V CC and the first filter component 11. The first filter element 11 and the third filter element 13 can filter the crosstalk signal from the power terminal V CC .
  • the third filter element 13 and the transimpedance amplifier 3 can also form an independent signal loop, so that the return path of the high-frequency signal does not pass through the base. It not only suppresses the electromagnetic crosstalk from the power supply, but also isolates and absorbs the electromagnetic crosstalk from the base ground (base GND) or the ground terminal of the transimpedance amplifier 3, which improves the performance of anti-electromagnetic crosstalk.
  • the third filter device 13 may be a filter device with a large capacitance value.
  • the capacitance value of the third filter element 13 may be 100 picofarads (pF) or greater than 100 pF.
  • the third filter element 13 adopts a device with a large capacitance value, so that the electromagnetic crosstalk from the ground can be filtered out faster.
  • the scattering parameter of the third filter device 13 in the crosstalk signal frequency band can be set to be larger, so that the third filter device 13 has a stronger filtering effect on the crosstalk signal.
  • the scattering parameter of the third filter device 13 in the crosstalk signal can be greater than 20 dB.
  • the optical receiving assembly 10 in FIG. 12 may also include a second filter component 12, and the connection relationship and functions of the second filter component 12 are the same as the foregoing, and will not be repeated here.
  • FIG. 14 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the light receiving assembly 10 includes a first filter device 11, a second filter device 12, a third filter device 13 and a fourth filter device 14.
  • the first end of the fourth filter element 14 is connected to the second end of the third filter element 13, and the second end of the fourth filter element 14 is connected to the outside.
  • the fourth filter element 14 is disposed between the third filter element 13 and the outside.
  • the fourth filter device 14 can be used to filter electromagnetic crosstalk from the ground.
  • the functions of the first filter component 11 to the third filter component 13 are the same or similar to those in the foregoing, and will not be repeated here.
  • the connection relationship between the two ends of the fourth filtering component 14 may be the same as that of the first filtering component 11.
  • the second ground terminal (GND2) of the transimpedance amplifier 3 may include one or more ground terminals
  • the first filter device 11 and the fourth filter device 14 may be connected to the same ground terminal in the transimpedance amplifier 3. Different ground terminals in the transimpedance amplifier 3 can also be connected.
  • the second ground terminal (GND2) connected to the first filter device 11 and the fourth filter device 14 is a different ground terminal in the transimpedance amplifier 3, the first filter device 11 and the fourth filter device 14 may be different The filter is realized.
  • the first filter device 11 and the fourth filter device 14 may be the same filter device.
  • Device e.g. Figure 13
  • the first filter component 11 and the fourth filter component 14 may be implemented using the same capacitor, or may be implemented using multiple capacitors.
  • a 200pF capacitor can be set between the second ground terminal (GND2) of the transimpedance amplifier 3 and the external ground.
  • two 100pF capacitors can be connected in parallel between the second ground terminal (GND2) of the transimpedance amplifier 3 and the external ground, or it can be implemented in other ways.
  • the first filter element 11 and the second filter element 12 can filter the crosstalk signal from the power terminal V PD of the photodiode 2.
  • the third filter element 13 and the fourth filter element 14 can filter the crosstalk signal from the power supply terminal V CC .
  • the second filter element 12, the photodiode 2 and the transimpedance amplifier 3 can form an independent signal loop.
  • the third filter component 13 and the transimpedance amplifier 3 can also form an independent signal loop.
  • FIG. 15 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the light receiving component 10 includes a first filter component 11, a second filter component 12, and a fifth filter component 15.
  • the first end of the fifth filter component 15 is connected to the power terminal V CC of the transimpedance amplifier 3,
  • the second end of the fifth filter element 15 is connected to the outside.
  • the fifth filter device 15 is disposed between the power terminal V CC of the transimpedance amplifier 3 and the external ground.
  • the fifth filter device 15 can be used to suppress the crosstalk signal from the power supply terminal V CC .
  • the light receiving assembly 10 further includes a sixth filter element 16.
  • the first end of the sixth filter element 16 is connected to the negative electrode of the photodiode 2, and the second end of the sixth filter element 16 Connect with the outside world.
  • the sixth filter element 16 is disposed between the cathode of the photodiode 2 and the external ground. Since the negative electrode of the photodiode 2 is connected to the power terminal V PD , it can also be considered that the sixth filter component 16 is disposed between the power terminal V PD of the photodiode 2 and the external ground.
  • the sixth filter element 16 can be used to filter the crosstalk signal from the power terminal V PD of the photodiode 2.
  • any of the light receiving components 10 shown in FIGS. 5 to 14 may include the fifth filter device 15 and/or the sixth filter device 16.
  • FIG. 16(a) and 16(b) show schematic diagrams of the signal return path of the light receiving assembly 10 in FIG. 15.
  • FIG. 16(a) shows the crosstalk signal from the power terminal V CC or the power terminal V PD
  • FIG. 16(b) shows the crosstalk signal from the ground (base GND).
  • the crosstalk signal originating from the power supply terminal V CC can be filtered by the fifth filter device 15.
  • the crosstalk signal from the power supply terminal V PD can be filtered out by the sixth filtering device 16.
  • the crosstalk signal from the power supply terminal V PD can also be filtered by the first filter device 11 and the second filter device 12.
  • the second filter element 12, the photodiode 2 and the transimpedance amplifier 3 form an independent signal loop. Since the first filter device 11 isolates the crosstalk signal from the ground, so that the crosstalk signal does not enter the above-mentioned signal loop, so the electromagnetic interference from the ground is well suppressed.
  • the crosstalk signals from the ground can be filtered out by the first filter element 11. However, a small part of the crosstalk signal from the ground can be filtered out by the fifth filter device 15. Since the V CC power line inside the transimpedance amplifier 3 has a good filtering effect on high frequency crosstalk, after this part of the crosstalk signal enters the transimpedance amplifier 3, it can be controlled by the V CC power line inside the transimpedance amplifier 3 Perform filtering. A small part of the crosstalk signal from the ground enters the V PD power supply circuit through the sixth filter device 16, and this part of the crosstalk signal can be filtered by the first filter device 11 and the second filter device 12.
  • the optical receiving component 10 shown in Figure 15, Figure 16 (a) and Figure 16 (b) has a good filtering capability for crosstalk signals from the power supply terminal V PD , the power supply terminal V CC and from the ground, thereby improving the optical receiving component 10 anti-electromagnetic interference ability.
  • FIG. 17 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the light receiving assembly 10 in FIG. 17 includes a first filter component 11 to a sixth filter component 16.
  • the connection mode of each filter element in FIG. 17 is the same as that in the foregoing embodiment, and for the sake of brevity, it will not be repeated here.
  • FIG. 18(a) and 18(b) are schematic diagrams of the signal return path of the light receiving module 10 in FIG. 17.
  • FIG. 18(a) shows the crosstalk signal from the power supply terminal V CC or the power supply terminal V PD
  • FIG. 18(b) shows the crosstalk signal from the ground (base GND).
  • the crosstalk signal from the power supply V CC can be filtered out by the fifth filter device 15.
  • the crosstalk signal from the power supply terminal V PD can be filtered out by the sixth filtering device 16.
  • the crosstalk signal from the power supply terminal V PD can also be filtered by the first filter device 11 and the second filter device 12.
  • the second filter element 12, the photodiode 2 and the transimpedance amplifier 3 form an independent signal loop.
  • the third filter element 13 and the transimpedance amplifier 3 also form an independent signal loop. Because the first filter element 11 and the fourth filter element 14 isolate the crosstalk signal from the ground, the crosstalk signal will not enter the two signal circuits. Therefore, the electromagnetic interference from the ground is well suppressed, thereby improving the filtering ability of electromagnetic crosstalk.
  • a small part of the crosstalk signal from the ground can also enter the power supply circuit of the power supply V CC through the fifth filter device 15, and this part of the crosstalk signal can be filtered by the third filter device 13 and the fourth filter device 14.
  • a small part of the crosstalk signal from the ground enters the V PD power supply circuit through the sixth filter device 16, and this part of the crosstalk signal can be filtered by the first filter device 11 and the second filter device 12.
  • FIG. 19 is a schematic circuit diagram of a light receiving component 10 according to another embodiment of the present application.
  • the optical receiving component 10 of FIG. 19 is similar to that of FIG. 17.
  • the difference is that the fourth filter component 14 is not included in FIG. 19, or it can also be understood that the first filter component 11 and the fourth filter component 14 are combined into the same filter component.
  • FIG. 20 is a schematic structural diagram of the TO CAN package of the optical receiving assembly 10 in FIG. 15.
  • the optical receiving component 10 includes a power supply V CC pin, a power supply V PD pin, a differential output terminal TIA OUT+ pin and a TIA OUT- pin of the transimpedance amplifier 3.
  • the entire base of the base is connected to a ground pin (not shown in the figure) as a ground wire.
  • the power supply V CC pin, the upper surface of the fifth filter element 15 and the power supply terminal of the transimpedance amplifier 3 may be connected by a binding wire.
  • the 20 represents the connection relationship (ie, the binding wire) between the components, and the dashed line is used to identify the reference signs of the components.
  • the lower surface of the fifth filter element 15 and the base ground GND are connected by conductive glue or welding.
  • the pin of the power supply V PD , the upper surface of the sixth filter element 16 and the upper surface of the second filter element 12 are connected by binding wires.
  • the upper surface of the second filter element 12 and the cathode (lower surface) of the photodiode 2 are connected by conductive glue or welding.
  • the anode of the photodiode 2 and the input terminal IN of the transimpedance amplifier 3 are connected by a binding wire.
  • the upper surface of the first filter element 11 and the lower surface of the second filter element 12 can be connected by conductive glue or welding.
  • the lower surface of the first filter element 11 and the base ground (base GND) can be connected by conductive glue or welding.
  • the first ground terminal (GND1) is connected to the base ground (base GND), and the second ground terminal (GND2) of the transimpedance amplifier 3 and the upper surface of the first filter element 11 may be connected by a binding wire.
  • FIG. 21 is a schematic structural diagram of the TO CAN package of the optical receiving assembly 10 of FIG. 18.
  • the light receiving assembly 10 in FIG. 21 further includes a third filter component 13.
  • the parts in FIG. 21 that are the same or similar in structure to those in FIG. 20 will not be repeated here.
  • the solid line in FIG. 21 represents the connection relationship (ie, the binding wire) between the components, and the dashed line is used to identify the reference signs of the components.
  • the upper surface of the transimpedance amplifier 3 may be covered with a layer of conductive material, which is connected to the ground terminal of the transimpedance amplifier 3.
  • the ground terminal may include a first ground terminal (GND1) and/or a second ground terminal (GND2) of the transimpedance amplifier. Therefore, each of the above devices can be connected to the ground terminal of the transimpedance amplifier 3 through the conductive material connected to the upper surface of the transimpedance amplifier 3.
  • the conductive substance can also be referred to as ground plating.
  • the V CC pin is connected to the upper surface of the first filter element 11, the upper surface of the third filter element 13 and the power terminal of the transimpedance amplifier 3 by a binding wire.
  • the lower surface of the third filter element 13 and the ground plating layer on the upper surface of the transimpedance amplifier 3 are connected by conductive glue or welding.
  • the disclosed system, device, and method may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
  • each unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of this application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program code .

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Abstract

本申请提供一种光接收组件、光收发组件以及光网络设备，能够提高光接收组件的抗电磁串扰性能。该光接收组件包括：光电二极管、跨阻放大器和第一滤波器件，其中，光电二极管用于将光信号转换为电信号，光电二级管的正极与跨阻放大器的输入端连接，光电二极管的负级用于连接电源；跨阻放大器用于放大光电二极管输出的电信号，跨阻放大器的电源端用于连接电源，跨阻放大器的第一接地端用于连接外界地；第一滤波器件的第一端与跨阻放大器的第二接地端连接，第一滤波器件的第二端用于连接外界地。

Description

光接收组件、光收发组件、光模块以及光网络设备
本申请要求于2019年6月21日提交中国专利局、申请号为201910544063.6、申请名称为“光接收组件、光收发组件、光模块以及光网络设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光通信领域，尤其涉及光接收组件、光收发组件、光模块以及光网络设备。
背景技术
随着大数据时代的来临，信息量爆炸增长，对网络吞吐能力的要求不断提高。光通信网络凭借超高带宽、低电磁干扰等优势，成为现代通信方案的主流。以光纤到户为代表的接入网正在大规模部署。光通信网络主要以无源光网络(passive optical network,PON)的形式存在，PON中的光网络设备包括光线路终端(optical line terminal,OLT)、光网络单元(optical network unit,ONU)等。
光接收组件是光网络设备中必不可少的器件，光接收组件用于接收光信号，并将光信号转换为电信号。由于光接收组件通常处于复杂的电磁辐射环境中，因此电磁辐射对光接收组件的通信信号的电磁串扰不可忽视。如何降低光接收组件的电磁串扰，是业界亟待解决的一个问题。
发明内容
本申请提供一种光接收组件、光收发组件、光模块以及光网络设备，能够提高光接收组件的抗电磁串扰性能。
第一方面，提供了一种光接收组件，包括：包括光电二极管、跨阻放大器和第一滤波器件，其中，所述光电二极管用于将光信号转换为电信号，所述光电二级管的正极与所述跨阻放大器的输入端连接，所述光电二极管的负级用于连接电源；所述跨阻放大器用于放大所述光电二极管输出的电信号，所述跨阻放大器的电源端用于连接电源，所述跨阻放大器的第一接地端用于连接外界地；所述第一滤波器件的第一端与所述跨阻放大器的第二接地端连接，所述第一滤波器件的第二端用于连接外界地。
在本申请实施例中，跨阻放大器的第一接地端接外界地，以实现直流接地。另外跨阻放大器的第二接地端与外界地之间设置第一滤波器件，以实现交流接地，该第一滤波器件能够滤除来自地的电磁串扰信号，从而能够提高光接收组件的抗电磁干扰性能。
结合第一方面，在一种可能的实现方式中，所述光接收组件还包括底座，所述底座用于连接外界地，所述跨阻放大器的第一接地端通过所述底座连接外界地，所述第一滤波器件的第二端通过所述底座连接外界地。
在本申请实施例中，光接收组件包括底座，底座可以连接外界地。光接收组件中的各 个器件或元件，例如跨阻放大器或各滤波器件，可以通过底座与外界地连接，从而实现了光接收组件内部元件的接地功能，优化了光接收组件的结构。
结合第一方面，在一种可能的实现方式中，所述光接收组件还包括第二滤波器件，所述第二滤波器件的第一端与所述光电二极管的负级连接，所述第二滤波器件的第二端与所述第一滤波器件的第一端连接。
在本申请实施例中，第二滤波器件和第一滤波器件可以过滤来自光电二极管的电源端的串扰信号。另外，第二滤波器件、光电二极管以及跨阻放大器还可以形成独立的信号回路，使得高频信号的回流路径不经过底座。不仅抑制了源自电源的电磁串扰，还隔离吸收了源自底座地(底座GND)或跨阻放大器的电磁串扰，从而实现了光接收组件的整个跨阻放大回路对电磁串扰的全路径隔离，提升了抗电磁串扰的性能。
结合第一方面，在一种可能的实现方式中，所述光接收组件还包括第三滤波器件，所述第三滤波器件的第一端与所述跨阻放大器的电源端连接，所述第三滤波器件的第二端与所述跨阻放大器的第二接地端连接。
在本申请实施例中，第一滤波器件和第三滤波器件可以过滤来自跨阻放大器的电源端的串扰信号。另外，第三滤波器件、跨阻放大器还可以形成独立的信号回路，使得高频信号的回流路径不经过底座。不仅抑制了源自电源的电磁串扰，还隔离吸收了源自底座地(底座GND)或跨阻放大器的电磁串扰，提升了抗电磁串扰的性能。
结合第一方面，在一种可能的实现方式中，所述光接收组件还包括第四滤波器件，所述第四滤波器件的第一端与所述第三滤波器件的第二端连接，所述第四滤波器件的第二端与外界地连接。
在本申请实施例中，第三滤波器件和第四滤波器件可以过滤来自跨阻放大器的电源端的串扰信号。另外，第三滤波器件、跨阻放大器也可以形成独立的信号回路。使得高频信号的回流路径不经过底座。不仅抑制了源自电源的电磁串扰，还隔离吸收了源自底座地(底座GND)或跨阻放大器的接地端的电磁串扰，提升了抗电磁串扰的性能。
结合第一方面，在一种可能的实现方式中，所述光接收组件还包括第五滤波器件，所述第五滤波器件的第一端与所述跨阻放大器的电源端连接，所述第五滤波器件的第二端与外界地连接。
在本申请实施例中，第五滤波器件可以用于抑制来自跨阻放大器的电源端的串扰信号，从而提升光接收组件的抗电磁串扰的性能。
结合第一方面，在一种可能的实现方式中，所述光接收组件还包括第六滤波器件，所述第六滤波器件的第一端与所述光电二极管的负极连接，所述第六滤波器件的第二端与外界地连接。
在本申请实施例中，第六滤波器件可以用于抑制来自光电二级管的电源端的串扰信号，从而提升光接收组件的抗电磁串扰的性能。
结合第一方面，在一种可能的实现方式中，所述第一滤波器件的容值大于100pF。
在本申请实施例中，通过第一滤波器件的大容值作用可以吸收隔离来自底座地以及跨阻放大器的接地端的串扰信号，从而能够滤除来自地的电磁串扰。
结合第一方面，在一种可能的实现方式中，所述第一滤波器件在串扰信号频段的散射参数大于20dB。
在本申请实施例中，可以设置第一滤波器件在串扰信号频段的散射参数较大，从而使得第一滤波器件对串扰信号有较强的滤波作用。
结合第一方面，在一种可能的实现方式中，所述第一滤波器件包括电容。
结合第一方面，在一种可能的实现方式中，所述跨阻放大器的第二接地端包括所述跨阻放大器的输入级接地端。
在本申请实施例中，使用跨阻放大器的输入级接地端作为第二接地端，可以在跨阻放大器输入级，也即跨阻放大作用之前对来自地的电磁串扰信号进行滤除，可以避免串扰信号经过跨阻放大器的放大作用而增强电磁串扰的影响，从而优化抗电磁干扰性能。
结合第一方面，在一种可能的实现方式中，所述跨阻放大器的电源端与所述光电二极管的负极用于连接同一个外部电源。
在本申请实施例中，跨阻放大器的电源端与光电二极管的负极与同一个外部电源连接，从而无需提供更多的外部电源，具有简化电路设计的优点。
结合第一方面，在一种可能的实现方式中，所述跨阻放大器的电源端与所述光电二极管的负极用于连接不同的外部电源。
在本申请实施例中，跨阻放大器的电源端与光电二极管的负极分别与不同的外部电源连接，从而提高了电路设计的灵活性。
结合第一方面，在一种可能的实现方式中，所述跨阻放大器的电源端用于连接外部电源，所述跨阻放大器包括电压调节模块，所述电压调节模块与所述跨阻放大器的电源端连接，所述光电二级管的负极用于连接所述电压调节模块。
在本申请实施例中，跨阻放大器的电源端与外部电源连接，而光电二极管利用跨阻放大器内部的电压调节模块供电，从而无需提供更多的外部电源，具有简化电路设计的优点。
可以理解的是，第一方面中的上述任意两种、或多种可能的实现方式之间可以相互结合。
第二方面，提供了一种光收发组件，所述光收发组件包括第一方面或第一方面的任意一种可能的实现方式中所述的光接收组件。
第三方面，提供了一种光模块，所述光模块包括第二方面所述的光收发组件。
第四方面，提供了一种光网络设备，所述光网络设备包括第三方面所述的光模块。
结合第四方面，在一种可能的实现方式中，所述光网络设备为OLT或ONU。
附图说明
图1是本申请实施例的应用场景的示意图。
图2是本申请实施例的采用晶体管外形封装(transistor outline can,TO CAN)形式封装的光接收组件的结构示意图。
图3是本申请一实施例的光接收组件的电路示意图。
图4是现有技术中的一种光接收组件的信号回流路径示意图。
图5是本申请又一实施例的光接收组件的电路示意图。
图6是本申请一实施例的跨阻放大器的示意图。
图7是本申请又一实施例的跨阻放大器的示意图。
图8是本申请又一实施例的光接收组件的电路示意图。
图9是本申请又一实施例的光接收组件的电路示意图。
图10示出了本申请实施例中的滤波器件的示意图。
图11是本申请又一实施例的光接收组件的电路示意图。
图12是本申请又一实施例的光接收组件的电路示意图。
图13是本申请又一实施例的光接收组件的电路示意图。
图14是本申请又一实施例的光接收组件的电路示意图。
图15是本申请又一实施例的光接收组件的电路示意图。
图16(a)和图16(b)是图15中的光接收组件的信号回流路径的示意图。
图17是本申请又一实施例的光接收组件的电路示意图。
图18(a)和图18(b)是图17中的光接收组件的信号回流路径的示意图。
图19是本申请又一实施例的光接收组件的电路示意图。
图20是图15中的光接收组件的TO CAN形式封装的结构示意图。
图21是图19中的光接收组件的TO CAN形式封装的结构示意图。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种无源光网络(passive optical network，PON)系统，例如，下一代PON(next-generation PON，NG-PON)、NG-PON1、NG-PON2、千兆比特PON(gigabit-capable PON，GPON)、10吉比特每秒PON(10 gigabit per second PON，XG-PON)、对称10吉比特无源光网络(10-gigabit-capable symmetric passive optical network，XGS-PON)、以太网PON(Ethernet PON，EPON)、10吉比特每秒EPON(10 gigabit per second EPON，10G-EPON)、下一代EPON(next-generation EPON，NG-EPON)、波分复用(wavelength-division multiplexing，WDM)PON、时分波分堆叠复用(time-and wavelength-division multiplexing，TWDM)PON、点对点(point-to-point，P2P)WDM PON(P2P-WDM PON)、异步传输模式PON(asynchronous transfer mode PON，APON)、宽带PON(broadband PON，BPON)，等等，以及25吉比特每秒PON(25gigabit per second PON，25G-PON)、50吉比特每秒PON(50 gigabit per second PON，50G-PON)、100吉比特每秒PON(100 gigabit per second PON，100G-PON)、25吉比特每秒EPON(25 gigabit per second EPON，25G-EPON)、50吉比特每秒EPON(50 gigabit per second EPON，50G-EPON)、100吉比特每秒EPON(100 gigabit per second EPON，100G-EPON)，以及其他速率的GPON、EPON等。还可以用于光传送网系统(Optical Transport Network，OTN)等光网络。
图1是本申请实施例的无源光网络(PON)应用场景示意图。如图1所示，无源光网络(PON)中包括光线路终端(optical line termination,OLT)、光分配网络(optical distribution network,ODN)以及光网络单元(optical network unit,ONU)。其中，OLT通过ODN与多个设置在用户侧的ONU连接，OLT和ONU中均包含一个或多个光模块，光模块中包括光组件(optical sub-assembly,OSA)，将待传输模拟或数字信号转换成光信号进行发送，以及将光信号进行接收转换成相应的模拟或数字信号，从而实现OLT与ONU之间的高速光传输。
在光网络设备中(例如，OLT或ONU)通常设置有光组件，光组件用于进行光信号的接收和发送。上述光组件可以包括光接收组件(receiving optical sub-assembly,ROSA)、光发射组件(transmitting optical sub-assembly,TOSA)或光收发组件(bi-directional optical sub-assembly,BOSA)。其中，光接收组件用于接收光信号，并将光信号转换为电信号。光发射组件用于将电信号转换为光信号，并发送光信号。光收发组件既包括光接收组件的功能，也包括光发送组件的功能，即可以理解为光收发组件包括光接收组件和光发射组件。在本申请实施例中，光接收组件也可以称为光接收机。需要说明的是，本申请实施例对光模块、光组件应用的光网络设备的类型不作限定。除了OLT与ONU之外，本申请实施例中的光模块、光组件还可以应用于其它类型的光网络设备，例如，光交换机或路由器等。
图2是本申请实施例的采用晶体管外形封装(transistor outline can,TO CAN)形式封装的光接收组件10的结构示意图。如图2所示，光接收组件包括光电二极管(photodiode,PD)2、跨阻放大器(trans-impedance amplifier,TIA)3以及驱动其正常工作的电容、电阻、电感等常用电学元件。光接收组件还可以包括承载上述各元件的底座4以及用于密封及光信号耦合的管帽5、透镜等功能元件。其中，上述底座4也可以称为管座(header)。底座4上设有若干引脚6，各引脚6分别用于接电源、接地或者用于输出进行光电转换之后的电信号。底座4上的管脚6可利用金线与光电二极管2、跨阻放大器3上的信号电极进行连接，这样就可以输出光电转换后的信号。由于光电二极管接收的光比较弱，因此需要将光电二极管2产生的电信号输出到跨阻放大器3进行放大，然后通过管脚6将放大后的电信号输出。
通常地，管脚6和底座4的基底之间在电气上属于隔离状态，例如两者之间可采用玻璃胶或其他绝缘材料隔开。整个基底可以作为地线平面，并通过一个与基底连接的特殊管脚与外界地连接。外界地可以理解为大地，或者与大地连接的导体。其中，底座4上的各个元件之间也可以通过焊接实现连接。
以光接收组件设置于ONU中为例，ONU与终端设备之间(例如手机、路由器等)通常使用无线保真(wireless fidelity,WIFI)等无线通信技术进行传输，因此光接收组件通常处于复杂的电磁辐射环境中。电磁辐射对光接收组件的通信信号产生的干扰被称为电磁串扰，干扰信号也可以称为串扰信号。例如，特别在10G PON高速时代，由于10G PON信号的调制频率与5G WIFI载波为同频段(均为5GHz)，因此5G WIFI信号产生的电磁串扰难以通过传统的滤波手段滤除。作为一个示例，光接收组件中产生的电信号大约为0.1微安(uA)～10uA量级，而5G WIFI信号的发射功率通常达500毫瓦(mW)，比光接收组件的信号大5百万倍，极易对其造成干扰。电磁串扰对光接收组件的影响，通常用无串扰时的灵敏度与有串扰时的灵敏度的差值的所定义的功率代价来表征，普通的光接收组件，如果没有采取抗干扰措施，其干扰程度可达十几分贝(dB)，严重影响系统的正常工作。因此，如何降低光接收组件的电磁串扰是业界亟待解决的问题。
在高速(如传输速率大于10G)的以太网传输系统中，光交换机、路由器等设备一般会设置光接收组件，该光接收组件也会处于较复杂的电磁辐射环境中。例如，光组件中光发射组件的高速驱动电流通常可达100mA以上，这些高速交变的电流在电路中遇到阻抗不连续就会对外发射电磁波，从而对光接收组件中产生微弱电信号(大约为0.1微安(uA)～10uA量级)形成干扰，通常这种干扰称为发射对接收的串扰，这种形式的串扰是在设 计光组件、光模块时需要尽力消除和避免的；另外光交换机，路由器等设备中存在很多大功耗、大容量的交换芯片，这些芯片本身工作时就会对外产生较大的电磁辐射，此外，高速电路走线的阻抗通常难以做到完全连续，从而不可避免的会对外产生电磁辐射。所有这些电磁辐射都会光接收组件中产生微弱电信号形成干扰。因此，如何降低光网络设备中的电磁辐射对光接收组件的串扰，一直都是光组件设计的一大挑战。
Figure PCTCN2020097010-appb-000001
Figure PCTCN2020097010-appb-000002
针对上述问题，本申请提出了一种抗电磁串扰的光接收组件方案，通过采用特殊的抗干扰结构，减少电磁串扰对光接收组件的灵敏度的影响。
图3是本申请实施例的光接收组件10的电路示意图。如图3所示，该光接收组件10包括光电二极管(PD)2、跨阻放大器(TIA)3和底座。光电二极管2的负极与电源端V PD连接，电源端V PD用于连接电源V PD，电源V PD为光电二极管2的驱动电源。光电二极管2的正极与跨阻放大器3的输入端连接。光电二极管2用于进行光电转换，并产生电信号。由于光电二极管2输出的电流较微弱，因此光电二级管2输出的电信号通过跨阻放大器3放大，跨阻放大器3输出放大后的电信号。
图3中所示的跨阻放大器3的结构为跨阻放大器3的一个示例，跨阻放大器3例如可以包括等效跨阻32和输出缓冲器34。其中，跨阻放大器3的放大倍数通常使用等效跨阻32来表征，数值上等于跨阻放大器3输出信号的电压摆幅与输入的微弱电信号电流之比，输出缓冲器34为跨阻放大器3的输出级，用于将经跨阻放大器3放大后的信号按一定的方式输出，例如差分放大输出或简单的单端输出。跨阻放大器3还可以包括输入端、输出端(TIA OUT+,TIA OUT-)、电源端V CC和接地端(GND1,GND2)。跨阻放大器3的输入端用于接收光电二极管2输出的电信号，跨阻放大器3的输出端用于输出放大后的电信号。作为示例，跨阻放大器3的输出端可以包括差分信号输出端TIA OUT+以及TIA OUT-。跨阻放大器3的电源端V CC用于与电源V CC连接，电源V CC为跨阻放大器3的供电电源。跨阻放大器3的接地端可以接地。如图3所示，跨阻放大器3的接地端可以通过与底座(底座GND)连接的方式与外界地相接。如前文所述，上述接地端与底座连接可以指与底座的基底连接，而基底通过某个特殊管脚与外界地连接。
图3中还示出了串扰信号和正常信号的回流路径。如图3所示，根据进入光接收组件10的串扰信号的来源不同，电磁串扰可以包括三种类型的串扰信号。第一种类型为通过光电二极管2的电源端V PD进入信号回路的串扰信号，第二种类型为通过跨阻放大器3的电源端V CC进入信号回路的串扰信号，第三种类型为通过地(GND)进入到信号回路的串扰，例如可以理解为通过底座地(底座GND)或跨阻放大器3的接地端进入到信号回路的串扰信号。上述三种串扰信号对正常信号造成了干扰，因此在设计电路时应尽量过滤掉这些串扰信号。
作为一个示例，图4示出了一种抗电磁串扰的解决方案。如图4所示，光接收组件10中包括第五滤波器件15和第六滤波器件16，第五滤波器件15的第一端与电源端V CC连接，第五滤波器件15的第二端与底座连接。第五滤波器件15可以用于过滤来自电源端V CC的串扰信号。第六滤波器件16的第一端与电源端V PD连接，第六滤波器件16的第二端与底座连接。第六滤波器件16可以用于过滤来自电源端V PD的串扰信号。
但是，图4的电路并不能处理从底座地(底座GND)或跨阻放大器3的接地端进入 到信号回路的串扰信号。例如，串扰信号可以通过第五滤波器件15的下表面进入到信号的回流路径中，或者可以通过第六滤波器件16的下表面进入到信号的回流路径中，或者可以通过底座地(底座GND)以及跨阻放大器3的接地端进入信号回流路径中。串扰信号经跨阻放大器3放大，和正常信号混在一起输出，对电路串扰影响较大。尤其对于10G PON系统，5G WIFI进行串扰的信号的频率与该系统的正常的信号的频率一致，该串扰信号难以在后面的电路中滤除。
在一种可能的方案中，可以在光接收组件10的外面增加一个电磁屏蔽罩，进一步降低功率代价，以保证系统正常工作。但这一方面增加了成本，另一方面由于屏蔽罩结构尺寸较大，从而使得整个光接收组件10的尺寸增加，难以满足紧凑型场景的需求。
为了解决上述问题，本申请还提出了一种抗电磁串扰的解决方案，能够减少来自地的串扰信号。图5是本申请又一实施例的光接收组件10的电路示意图。
如图5所示，光接收组件10包括光电二极管2、跨阻放大器3以及第一滤波器件11。其中光电二极管2和跨阻放大器3的连接关系与图3相同，为了简洁，此处不再赘述。在图5中，跨阻放大器3的第一接地端(GND1)用于与外界地连接，跨阻放大器3的第二接地端(GND2)与第一滤波器件11的第一端连接，第一滤波器件11的第二端与外界地连接。换句话说，所述第一滤波器件11设置于外界地与跨阻放大器3的第二接地端(GND2)之间，采用这种结构可以有效地滤除来自地的串扰信号。
在本申请实施例中，跨阻放大器3的第一接地端(GND1)接外界地，以实现直流接地。另外跨阻放大器3的第二接地端(GND2)与外界地之间设置第一滤波器件11，以实现交流接地，该第一滤波器件11能够滤除来自地的电磁串扰信号，从而能够提高光接收组件10的抗电磁干扰性能。
需要说明的是，跨阻放大器3包括一个或多个接地端，对于仅含一个接地端的跨阻放大器3，也可通过扩展方式(例如一个接地点焊多根线到地等方式)获得多个接地端的效果。跨阻放大器3的多个接地端可划分为多个第一接地端(GND1)，多个第二接地端(GND2)。例如跨阻放大器可以包括一个或多个输入级接地端、一个或多个输出级接地端，还可以包括一个或多个中间级接地端，中间级接地端可以指功能上位于输入级和输出级之间的接地端。这些不同的接地端出于性能以及跨阻放大器芯片内部布局的需要通常分别位于跨阻放大器3的不同物理位置，不同的接地端之间存在一定的电路参数，例如电感，电容，电阻等，因此这些接地端不能统一合并描述为一个。在本申请中，第一接地端和第二接地端表示的是跨阻放大器3上任意2个或2组物理位置上不同的接地端，跨阻放大器可以包含一个或多个第一接地端、一个或多个第二接地端。
例如，如图6所示的跨阻放大器包含1个输入接地端301,2个输出级接地端302、303，可划分的第一接地端和第二接地端方案如下：
1)301为第一接地端，302、303组合在一起为第二接地端。
2)301、302组合在一起为第一接地端，303为第二接地端。
3)301为第一接地端，302为第一接地端，303为第二接地端。该方案中301、302分别作为独立的第一接地端，即301、302都是第一接地端。
4)301为第一接地端，302为第二接地端，303为第二接地端。该方案中302、303分别作为独立的第二接地端，即302、303都是本申请所述第二接地端。
5)301为第二接地端，302、303组合在一起为第一接地端。
6)301、302组合在一起为第二接地端，303为第一接地端。
7)301为第二接地端，302为第二接地端，303为第一接地端。该方案中301、302分别作为独立的第二接地端，即301、302都是第二接地端。
8)301为第二接地端，302为第一接地端，303为第一接地端。该方案中302、303分别作为独立的第一接地端，即302、303都是本申请所述第一接地端。
可见，跨阻放大器3可以有多种第一接地端(GND1)、多种第二接地端(GND2)的划分方式。跨阻放大器3的一个或多个第一接地端(GND1)分别用于接直流地(外界地)，跨阻放大器3的一个或多个第二接地端(GND2)分别用于接交流地(分别通过滤波器件(如第一滤波器件11)接地)，需要说明的是，第一滤波器件11可以包含多个独立的滤波器，每个滤波器分别与第二接地端(GND2)连接。
进一步的，图7是本申请对于跨阻放大器3的第一接地端(GND1)，第二接地端(GND2)的划分方案的一个示例，其中将具有相同功能的输入接地端401、402组合在一起作为第二接地端(GND2)，将具有相同功能的中间级接地端403、404组合在一起作为第二接地端(GND2)，将具有相同功能的输出级接地端405、406组合在一起作为第一接地端(GND1)。第二接地端(GND2)与第一滤波器件111连接,第二接地端302(GND2)与另一个第一滤波器件112连接，接地端401、402在跨阻放大器3中的功能相同，物理位置靠近，共同与第一滤波器件111连接，可在减少第一滤波器件的使用、降低成本的同时，实现接地端401、402的电磁干扰噪声的滤除，从而具有优化抗电磁干扰性能。同理，接地端403、404在跨阻放大器3中的功能相同，物理位置靠近，共同与第一滤波器件112连接，也具有优化的抗电磁干扰性能。如图7所示，跨阻放大器3的输入级接地端和中间级接地端均作为第二接地端(GND2)与第一滤波器件(111,112)连接，可以滤除输入级接地端、中间级接地端的电磁干扰噪声，从而增强抗电磁干扰性能。需要说明的是，若使用跨阻放大器3的输出级接地端作为第二接地端(GND2)与第一滤波器件111连接，也可以滤除输出级接地端的电磁干扰噪声，从而增强抗电磁干扰性能。从而，可以理解为，跨阻放大器3的第一接地端(GND1)用于接直流地(外界地)，跨阻放大器3的第二接地端(GND2)用于接交流地(通过滤波器件接地)，只要确保跨阻放大器3的直流地足够满足性能要求，跨阻放大器3的其他所有接地端均可以与第一滤波器件(11,111,112)连接，滤除相应接地端的电磁干扰噪声，从而增强抗电磁干扰性能。进一步地，使用跨阻放大器3的输入级接地端作为第二接地端(GND2)，可以在跨阻放大器3的输入级，也即跨阻放大作用之前对来自地(底座地、跨阻放大器3的接地端)的电磁串扰信号进行滤除，可以避免串扰信号经过跨阻放大器的放大作用而增强电磁串扰的影响，从而优化抗电磁干扰性能。
可选地，光接收组件10包括底座，底座可以连接外界地。光接收组件10内部的相关元件可以通过底座与外界地连接。例如，跨阻放大器3的第一接地端(GND1)通过光接收组件10的底座连接外界地，第一滤波器件11的第二端通过光接收组件10的底座连接外界地。或者，光接收组件10内部的相关元件还可以直接与外界地连接。
可选地，第一滤波器件11可以是大容值的滤波器件。在一个示例中，第一滤波器件11的容值可以为100皮法(pF)或者大于100pF。底座连接的外界地可以指单板的大地。在底座地(底座GND)或跨阻放大器3的接地端上集聚的串扰信号的寄生参数小，泄放 快。串扰信号在短时间内聚集，具有脉冲式的特点。通过第一滤波器件11的大容值作用可以吸收隔离来自底座地(底座GND)或跨阻放大器3的接地端的串扰信号，从而能够滤除来自地的电磁串扰。
可选地，可以设置第一滤波器件11在串扰信号频段的散射参数较大，从而使得第一滤波器件11对串扰信号有较强的滤波作用。例如，可以设置第一滤波器件11在串扰信号的散射参数大于20dB。
可选地，在图5的基础上，本申请实施例的光接收组件10还具有各种变形，其均落入本申请实施例的保护范围。例如，在一些变形中，光接收组件10还能进一步的滤除来自电源端V PD的串扰信号，或者滤除来自电源端V CC的串扰信号，或者还能实现其他功能。下面将结合附图继续介绍本申请实施例的光接收组件10。
可选地，在本申请各个实施例中，跨阻放大器3的电源V CC和光电二极管2的电源V PD可以是同一个外部电源，也可以是不同的外部电源。例如，如图8所示，跨阻放大器3的电源端V CC和光电二极管2的负极可以与同一外部电源V CC连接。在这种情况下，光接收组件10可以与一个外部电源连接，该外部电源同时为跨阻放大器3和光电二级管2供电。
又或者，在本申请各个实施例中，如图9所示，跨阻放大器3的电源端V CC可以与外部电源V CC连接，跨阻放大器3的内部可以包括电压调节模块(图中未示出)，所述电压调节模块与跨阻放大器3的电源端V CC连接，所述光电二级管2的负极与所述电压调节模块连接。所述电压调节模块可以对输入电压进行转换，并产生转换后的输出电压。所述电压调节模块相当于光电二级管的电源V PD。在这种情况下，跨阻放大器3的供电电源为外部电源，光电二级管通过跨阻放大器3的内置电压调节模块供电。可选地，所述电压调节模块也可以称为内置电源模块或者电压调节器、电压转换器等。
可选地，本申请各个实施例中的滤波器件，例如第一滤波器件11以及下文中的第二滤波器件12至第六滤波器件16，可以指能够对特定电磁串扰频带实现滤波功能的器件。滤波器件可以包括有源滤波器件和/或无源滤波器件。图10示出了本申请实施例中的滤波器件的示意图。如图10中的(a)所示，滤波器件可以包括电容。如图10中的(b)所示，滤波器件可以包括电容和电阻，或者还可以包括其他集成器件。如图10中的(c)所示，滤波器件可以包括电容和电感，或者还可以包括其他集成器件。如图10中的(d)所示，滤波器件可以由多个电容串联形成。如图10中的(e)所示，滤波器件可以由多个电容并联形成。图10中的电容或电感可以是利用打线形成的结构。可以理解的是，本申请各个实施例中的滤波器件，不限于上述各示例中的器件，还可以为其他形式，只要能够对特定电磁串扰频带实现滤波功能的器件，都可以理解为本申请各个实施例中的滤波器件。
图11是本申请又一实施例的光接收组件10的电路示意图。如图11所示，除第一滤波器件11之外，光接收组件10还可以包括第二滤波器件12。第二滤波器件12的第一端与光电二极管2的负极连接，第二滤波器件12的第二端与第一滤波器件11的第一端连接。换句话说，所述第二滤波器件12设置于光电二级管2的负极与第一滤波器件11之间。由于光电二级管2的负极用于与电源端V PD连接，因此也可以认为第二滤波器件12设置于电源端V PD与第一滤波器件11之间。第二滤波器件12和第一滤波器件11可以过滤来自光电二级管2的电源端V PD的串扰信号。
另外，第二滤波器件12、光电二极管2以及跨阻放大器3还可以形成独立的信号回路，使得高频信号的回流路径不经过底座。不仅抑制了源自电源的电磁串扰，还隔离吸收了源自底座地(底座GND)或跨阻放大器3的接地端的电磁串扰，从而实现了光接收组件10的整个跨阻放大回路对电磁串扰的全路径隔离，提升了抗电磁串扰的性能。
在一个例子中，第二滤波器件12在串扰信号频段的散射参数可以尽可能设置的较大，从而使得第二滤波器件12对串扰信号有较强的滤波作用。例如，第二滤波器件12在串扰信号的散射参数可以大于20dB。
图12是本申请又一实施例的光接收组件10的电路示意图。如图12所示，光接收组件10包括第一滤波器件11和第三滤波器件13。第三滤波器件13的第一端与跨阻放大器3的电源端V CC连接，第三滤波器件13的第二端与跨阻放大器3的第二接地端(GND2)连接。换句话说，第三滤波器件13设置于跨阻放大器3的电源端V CC与跨阻放大器3的第二接地端(GND2)之间。由于跨阻放大器3的电源端V CC用于与电源V CC连接，跨阻放大器3的第二接地端(GND2)与第一滤波器件11的第一端连接，因此也可以认为第三滤波器件13设置于电源V CC与第一滤波器件11之间。第一滤波器件11和第三滤波器件13可以过滤来自电源端V CC的串扰信号。
另外，第三滤波器件13、跨阻放大器3还可以形成独立的信号回路，使得高频信号的回流路径不经过底座。不仅抑制了源自电源的电磁串扰，还隔离吸收了源自底座地(底座GND)或跨阻放大器3的接地端的电磁串扰，提升了抗电磁串扰的性能。
可选地，第三滤波器件13可以是大容值的滤波器件。在一个示例中，第三滤波器件13的容值可以为100皮法(pF)或者大于100pF。第三滤波器件13采用大容值器件，从而能够更快地滤除来自地的电磁串扰。
可选地，第三滤波器件13在串扰信号频段的散射参数可以设置的较大，从而使得第三滤波器件13对串扰信号有较强的滤波作用。例如，可以设置第三滤波器件13在串扰信号的散射参数可以大于20dB。
可选地，如图13所示，图12中的光接收组件10也可以包括第二滤波器件12，第二滤波器件12的连接关系以及功能与前文相同，此处不再赘述。
图14是本申请又一实施例的光接收组件10的电路示意图。如图14所示，光接收组件10包括第一滤波器件11、第二滤波器件12、第三滤波器件13以及第四滤波器件14。其中，所述第四滤波器件14的第一端与第三滤波器件13的第二端连接，第四滤波器件14的第二端与外界地连接。换句话说，第四滤波器件14设置于第三滤波器件13与外界地之间。第四滤波器件14可以用于过滤来自地的电磁串扰。在本申请实施例中，第一滤波器件11至第三滤波器件13的功能与前文中相同或相似，此处不再赘述。
可选地，由于第三滤波器件13的第二端与跨阻放大器3的第二接地端(GND2)连接，因此第四滤波器件14的两端的连接关系可以与第一滤波器件11相同。具体地，由于跨阻放大器3的第二接地端(GND2)可以包括一个或多个接地端，因此，第一滤波器件11和第四滤波器件14可以连接跨阻放大器3中的同一接地端，也可以连接跨阻放大器3中的不同接地端。在第一滤波器件11和第四滤波器件14连接的第二接地端(GND2)为跨阻放大器3中的不同接地端的情况下，上述第一滤波器件11和第四滤波器件14可采用不同的滤波器件实现。而在第一滤波器件11和第四滤波器件14连接的第二接地端(GND2)为跨阻 放大器3中的同一接地端的情况下，第一滤波器件11和第四滤波器件14可以为同一滤波器件(例如图13)。例如，第一滤波器件11和第四滤波器件14可以使用同一电容实现，也可以使用多个电容实现。例如，若第一滤波器件11的容值为100pF，第四滤波器件14的容值为100pF，则可以在跨阻放大器3的第二接地端(GND2)和外界地之间设置一个200pF的电容，或者也可以在跨阻放大器3的第二接地端(GND2)和外界地之间并联两个100pF的电容，或者也可以采用其他方式实现。
在本申请实施例中，第一滤波器件11和第二滤波器件12可以过滤来自光电二级管2的电源端V PD的串扰信号。第三滤波器件13和第四滤波器件14可以过滤来自电源端V CC的串扰信号。另外，第二滤波器件12、光电二极管2以及跨阻放大器3可以形成独立的信号回路。第三滤波器件13、跨阻放大器3也可以形成独立的信号回路。这两个独立信号回路使得高频信号的回流路径不经过底座。不仅抑制了源自电源的电磁串扰，还隔离吸收了源自底座地(底座GND)或跨阻放大器3的接地端的电磁串扰，提升了抗电磁串扰的性能。
图15是本申请又一实施例的光接收组件10的电路示意图。如图15所示，光接收组件10包括第一滤波器件11、第二滤波器件12以及第五滤波器件15，第五滤波器件15的第一端与跨阻放大器3的电源端V CC连接，第五滤波器件15的第二端与外界地连接。换句话说，第五滤波器件15设置于跨阻放大器3的电源端V CC以及外界地之间。第五滤波器件15可以用于抑制来自电源端V CC的串扰信号。
可选地，如图15所示，光接收组件10还包括第六滤波器件16，第六滤波器件16的第一端与光电二级管2的负极连接，第六滤波器件16的第二端与外界地连接。换句话说，第六滤波器件16设置于光电二极管2的负极与外界地之间。由于光电二级管2的负极与电源端V PD连接，因此也可以认为第六滤波器件16设置于光电二级管2的电源端V PD与外界地之间。第六滤波器件16可以用于滤除来自光电二级管2的电源端V PD的串扰信号。
可选地，图5至图14中所示的任一光接收组件10中均可以包括第五滤波器件15和/或第六滤波器件16。
图16(a)和图16(b)示出了图15中的光接收组件10的信号回流路径的示意图。其中，图16(a)示出了来自电源端V CC或电源端V PD的串扰信号，图16(b)示出了来自地(底座GND)的串扰信号。如图16(a)和图16(b)所示，源自电源端V CC的串扰信号可以通过第五滤波器件15滤除。源自电源端V PD的串扰信号可以通过第六滤波器件16滤除。源自电源端V PD的串扰信号还可以通过第一滤波器件11和第二滤波器件12滤除。第二滤波器件12、光电二极管2和跨阻放大器3形成一个独立的信号回路。由于第一滤波器件11隔离了来自地的串扰信号，使得串扰信号不会进入上述信号回路中，因此很好的抑制了来自地的电磁干扰。
对于来自地的大部分串扰信号，可以通过第一滤波器件11滤除。但还有一小部分来自地的串扰信号可以通过第五滤波器件15滤除。由于跨阻放大器3内部的V CC电源线路对高频串扰具有很好的滤波作用，因此在这部分串扰信号进入到跨阻放大器3之后，可以由跨阻放大器3内部的V CC电源线路对其进行滤除。还有一小部分来自地的串扰信号通过第六滤波器件16进入到V PD供电回路中，这部分串扰信号可以通过第一滤波器件11和第二滤波器件12滤除。
图15、图16(a)和图16(b)所示的光接收组件10对来自电源端V PD、电源端V CC以及来自地的串扰信号具有良好的滤除能力，提高了光接收组件10的抗电磁干扰能力。
图17是本申请又一实施例的光接收组件10的电路示意图。其中，图17中的光接收组件10包括第一滤波器件11至第六滤波器件16。图17中的各滤波器件的连接方式与前述实施例中的相同，为了简洁，此处不再赘述。
图18(a)和图18(b)是图17中的光接收组件10的信号回流路径的示意图。其中，图18(a)示出了来自电源端V CC或电源端V PD的串扰信号，图18(b)示出了来自地(底座GND)的串扰信号。如图18(a)和图18(b)所示，源自电源V CC的串扰信号可以通过第五滤波器件15滤除。源自电源端V PD的串扰信号可以通过第六滤波器件16滤除。源自电源端V PD的串扰信号还可以通过第一滤波器件11和第二滤波器件12滤除。第二滤波器件12、光电二极管2和跨阻放大器3形成一个独立的信号回路。另外，第三滤波器件13、跨阻放大器3也形成独立的信号回路，由于第一滤波器件11和第四滤波器件14隔离了来自地的串扰信号，使得串扰信号不会进入上述两个信号回路中，因此很好的抑制了来自地的电磁干扰，从而提高了电磁串扰的滤除能力。
来自地的一小部分串扰信号还可以通过第五滤波器件15进入到电源V CC供电回路中，这部分串扰信号可以通过第三滤波器件13和第四滤波器件14滤除。还有一小部分来自地的串扰信号通过第六滤波器件16进入到V PD供电回路中，这部分串扰信号可以通过第一滤波器件11和第二滤波器件12滤除。
图19是本申请又一实施例的光接收组件10的电路示意图。图19的光接收组件10与图17相似，其区别在于，图19中不包括第四滤波器件14，或者也可以理解为第一滤波器件11和第四滤波器件14合并为同一滤波器件。
下文结合图20和图21，继续介绍本申请对应的TO CAN封装的光接收组件10的实施例。
图20是图15中的光接收组件10的TO CAN封装的结构示意图。如图20所示，光接收组件10包括电源V CC引脚、电源V PD引脚、跨阻放大器3的差分输出端TIA OUT+引脚和TIA OUT-引脚。另外，底座的整个基底作为地线与接地引脚(图中未示出)连接。具体地，电源V CC引脚、第五滤波器件15上表面以及跨阻放大器3的电源端可以通过绑线连接。其中，图20中的实线表示各器件之间的连接关系(即绑线)，虚线用于标识各元件的附图标记。第五滤波器件15下表面与底座地GND通过导电胶或焊接连接。电源V PD引脚、第六滤波器件16的上表面、第二滤波器件12的上表面通过绑线连接。第二滤波器件12的上表面与光电二极管2的负极(下表面)通过导电胶或焊接连接。光电二极管2的正极与跨阻放大器3的输入端IN通过绑线连接。第一滤波器件11上表面与第二滤波器件12下表面可以通过导电胶或焊接连接，第一滤波器件11下表面与底座地(底座GND)可以通过导电胶或焊接连接，跨阻放大器3的第一接地端(GND1)与底座地(底座GND)连接，跨阻放大器3的第二接地端(GND2)与第一滤波器件11的上表面可以通过绑线连接。
图21是图18的光接收组件10的TO CAN封装的结构示意图。与图20相比，图21中的光接收组件10还包括第三滤波器件13，为了简洁，图21中与图20中结构相同或相似的部分，此处不再赘述。其中，图21中的实线表示各器件之间的连接关系(即绑线)， 虚线用于标识各元件的附图标记。可选地，跨阻放大器3的上表面可以覆盖一层导电物质，该导电物质与跨阻放大器3的接地端连接。该接地端可以包括跨阻放大器的第一接地端(GND1)和/或第二接地端(GND2)。因此，上述各个器件可以通过连接到跨阻放大器3的上表面的导电物质，实现与跨阻放大器3的接地端连接。该导电物质也可以称为接地镀层。V CC引脚与第一滤波器件11的上表面、第三滤波器件13的上表面以及跨阻放大器3的电源端通过绑线连接。第三滤波器件13的下表面与跨阻放大器3的上表面的接地镀层通过导电胶或焊接的方式连接。
上文中结合图20和图21描述了本申请实施例的两种光接收组件的CO CAN封装的结构，本领域技术人员能够理解，本申请实施例的其他光接收组件也可以采用类似的结构实现，为了简洁，此处不再赘述。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种光接收组件，其特征在于，包括光电二极管、跨阻放大器和第一滤波器件，其中，
    所述光电二极管用于将光信号转换为电信号，所述光电二级管的正极与所述跨阻放大器的输入端连接，所述光电二极管的负级用于连接电源；
    所述跨阻放大器用于放大所述光电二极管输出的电信号，所述跨阻放大器的电源端用于连接电源，所述跨阻放大器的第一接地端用于连接外界地；
    所述第一滤波器件的第一端与所述跨阻放大器的第二接地端连接，所述第一滤波器件的第二端用于连接外界地。
  2. 如权利要求1所述的光接收组件，其特征在于，还包括底座，所述底座用于连接外界地，所述跨阻放大器的第一接地端通过所述底座连接外界地，所述第一滤波器件的第二端通过所述底座连接外界地。
  3. 如权利要求1或2所述的光接收组件，其特征在于，还包括第二滤波器件，所述第二滤波器件的第一端与所述光电二极管的负级连接，所述第二滤波器件的第二端与所述第一滤波器件的第一端连接。
  4. 如权利要求1至3中任一项所述的光接收组件，其特征在于，还包括第三滤波器件，所述第三滤波器件的第一端与所述跨阻放大器的电源端连接，所述第三滤波器件的第二端与所述跨阻放大器的第二接地端连接。
  5. 如权利要求3所述的光接收组件，其特征在于，还包括第四滤波器件，所述第四滤波器件的第一端与所述第三滤波器件的第二端连接，所述第四滤波器件的第二端与外界地连接。
  6. 如权利要求1至5中任一项所述的光接收组件，其特征在于，还包括第五滤波器件，所述第五滤波器件的第一端与所述跨阻放大器的电源端连接，所述第五滤波器件的第二端与外界地连接。
  7. 如权利要求1至6中任一项所述的光接收组件，其特征在于，还包括第六滤波器件，所述第六滤波器件的第一端与所述光电二极管的负极连接，所述第六滤波器件的第二端与外界地连接。
  8. 如权利要求1至7中任一项所述的光接收组件，其特征在于，所述第一滤波器件的容值大于100皮法pF。
  9. 如权利要求1至8中任一项所述的光接收组件，其特征在于，所述第一滤波器件在串扰信号频段的散射参数大于20分贝dB。
  10. 如权利要求1至9中任一项所述的光接收组件，其特征在于，所述第一滤波器件包括电容。
  11. 如权利要求1至10中任一项所述的光接收组件，其特征在于，所述跨阻放大器的第二接地端包括所述跨阻放大器的输入级接地端。
  12. 如权利要求1至11中任一项所述的光接收组件，其特征在于，所述跨阻放大器的电源端与所述光电二极管的负极用于连接同一个外部电源。
  13. 如权利要求1至11中任一项所述的光接收组件，其特征在于，所述跨阻放大器的电源端与所述光电二极管的负极用于连接不同的外部电源。
  14. 如权利要求1至11中任一项所述的光接收组件，其特征在于，所述跨阻放大器的电源端用于连接外部电源，所述跨阻放大器包括电压调节模块，所述电压调节模块与所述跨阻放大器的电源端连接，所述光电二级管的负极用于连接所述电压调节模块。
  15. 一种光收发组件，其特征在于，包括如权利要求1至14中任一项所述的光接收组件。
  16. 一种光模块，其特征在于，包括如权利要求15所述的光收发组件。
  17. 一种光网络设备，其特征在于，包括如权利要求16所述的光模块。
  18. 如权利要求17所述的光网络设备，其特征在于，所述光网络设备为光线路终端OLT或光网络单元ONU。
PCT/CN2020/097010 2019-06-21 2020-06-19 光接收组件、光收发组件、光模块以及光网络设备 Ceased WO2020253809A1 (zh)

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KR1020227001329A KR102624304B1 (ko) 2019-06-21 2020-06-19 수신기 광 서브-어셈블리, 양방향 광 서브-어셈블리, 광 모듈 및 광 네트워크 디바이스
US17/557,450 US11848710B2 (en) 2019-06-21 2021-12-21 Receiver optical sub-assembly, bi-directional optical sub-assembly, optical module, and optical network device
US18/491,572 US12470303B2 (en) 2019-06-21 2023-10-20 Receiver optical sub-assembly, bi-directional optical sub-assembly, optical module, and optical network device

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US20220158740A1 (en) 2022-05-19
EP3975451A4 (en) 2022-08-10
KR102624304B1 (ko) 2024-01-11
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JP2022537427A (ja) 2022-08-25
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US12470303B2 (en) 2025-11-11
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