WO2021004117A1 - 超声波雾化片的制造工艺 - Google Patents

超声波雾化片的制造工艺 Download PDF

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Publication number
WO2021004117A1
WO2021004117A1 PCT/CN2020/085845 CN2020085845W WO2021004117A1 WO 2021004117 A1 WO2021004117 A1 WO 2021004117A1 CN 2020085845 W CN2020085845 W CN 2020085845W WO 2021004117 A1 WO2021004117 A1 WO 2021004117A1
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Prior art keywords
manufacturing process
piezoelectric ceramic
substrate
ceramic sheet
sheet according
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PCT/CN2020/085845
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English (en)
French (fr)
Inventor
郑瑶
苏秋红
粟松万
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Shenzhen Shang Jin Electronic Science And Technology Co Ltd
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Shenzhen Shang Jin Electronic Science And Technology Co Ltd
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Priority to JP2021560238A priority Critical patent/JP2022539645A/ja
Priority to EP20837374.6A priority patent/EP3962245A4/en
Publication of WO2021004117A1 publication Critical patent/WO2021004117A1/zh
Priority to US17/485,426 priority patent/US20220008956A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0651—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of circular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
    • B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0653—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/77—Atomizers

Definitions

  • This application relates to the technical field of atomized sheets, and in particular to a manufacturing process of ultrasonic atomized sheets.
  • Ultrasonic atomizer is through the high frequency resonance of ceramic atomizer to break up the molecular structure of liquid water to produce natural and elegant water mist, without heating or adding any chemical reagents; compared with heating atomization method, energy saving is 90% %;
  • energy saving is 90% %;
  • a large amount of negative ions will be released during the atomization process, which will react electrostatically with smoke, dust, etc. floating in the air to make it precipitate.
  • it can effectively remove formaldehyde, carbon monoxide, bacteria and other harmful substances to make the air get Purify and reduce the occurrence of diseases.
  • the main structure of the traditional mesh ultrasonic atomization sheet consists of a piezoelectric ceramic sheet, a stainless steel sheet with a large number of atomization holes at the center of the circle, a wire welded to one electrode of the piezoelectric ceramic sheet, and another welded on the stainless steel sheet Wire composition, and the mesh type atomizing film based on FPC flexible circuit board is made by bonding the FPC flexible circuit board and solder paste or glue to the piezoelectric ceramic sheet.
  • the production cost of mesh type atomizing sheet based on FPC flexible circuit board is lower.
  • the technical problem solved by this application is how to provide a manufacturing process for an ultrasonic atomizing sheet with high product qualification rate, good consistency and high energy conversion efficiency.
  • an embodiment of the present application provides a manufacturing process of an ultrasonic atomizing sheet, including:
  • the laser machine After pressing the S4 product, the laser machine is used to process the atomizing hole on the base material of the composite board.
  • the composite board is an FPC flexible circuit board
  • the substrate is a PI film
  • the conductive layer is a copper foil.
  • the base material of the FPC flexible circuit board includes a circular part capable of covering the central cavity of the piezoelectric ceramic sheet and a tail connected to the circular part;
  • the conductive layer includes a ring portion and a tail connected to the ring portion.
  • a laser machine is used to process atomizing holes on the circular part of the substrate.
  • the circular part of the base material is provided with an arc-shaped boss protruding toward the piezoelectric ceramic sheet, and the arc-shaped boss is provided with an atomizing hole.
  • the press is heated to 80-150° C. to press the product at a pressure of 6-15 MPa at the same time for 100-300 seconds.
  • step S4 after placing the silica gel pads on the upper and lower sides of the combination of the piezoelectric ceramic sheet and the composite board obtained in S3, they are pressed together.
  • the embodiment of the application provides a manufacturing process of an ultrasonic atomization sheet.
  • a pressure thermosetting conductive adhesive film is used to connect the piezoelectric ceramic sheet and the composite board. After the piezoelectric ceramic sheet and the composite board are pressed by a press, it is beneficial to the composite board.
  • the substrate is tight, producing a drum surface effect, and the energy conversion efficiency of the atomizing sheet is higher.
  • the pressure thermosetting conductive adhesive can be cured in a short time under high pressure and heating and has excellent adhesion. At the same time, because this is a thin film material, it has excellent plasticity. It can be easily cut into various shapes. The flatness of the material itself is very good, so it has excellent mass production consistency and avoids the poor adhesion of the product caused by the uneven coating of traditional solder paste and liquid glue. problem.
  • FIG. 1 is a schematic flow chart of a manufacturing process of an ultrasonic atomizing sheet according to an embodiment of the present application
  • FIG. 2 is a schematic diagram of the pressing of an ultrasonic atomizing sheet prepared in an embodiment of the application
  • Fig. 3 is a schematic diagram of the structure of an ultrasonic atomizing sheet according to an embodiment of the present application
  • Figure 4 is a schematic diagram of the transmission of the oscillating waveform of the PI film in a tight state
  • Fig. 5 is a schematic diagram of wave-like scattering transmission caused when the copper foil is in a wrinkled state.
  • 1-FPC flexible circuit board 11-PI film; 12-copper foil; 2-pressure thermosetting conductive adhesive film; 3-piezoelectric ceramic sheet; 4-atomizing hole; 5-silicone rubber gasket.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • the manufacturing process of the ultrasonic atomizing sheet in the embodiment of the present application includes:
  • the piezoelectric ceramic sheet is ring-shaped, and the pressure thermosetting conductive adhesive film is cut into a ring with the same size as the piezoelectric ceramic sheet.
  • the pressure thermosetting conductive adhesive film may be slightly smaller or slightly larger than the size of the piezoelectric ceramic sheet.
  • the base material includes a circular part capable of covering the central cavity of the piezoelectric ceramic sheet
  • the conductive layer includes a ring part
  • the circular part of the base material is connected to the ring part of the conductive layer.
  • the composite board is an FPC flexible circuit board
  • the substrate is a PI film
  • the conductive layer is a copper foil.
  • the substrate of the composite board is a PI film
  • the conductive layer is a stainless steel sheet.
  • the press presses the product at a pressure of 6-15 MPa while heating to 80-150°C for 100-300 seconds.
  • the pressure of the press is 10MPa
  • the heating temperature is 125°C
  • the duration is 200 seconds.
  • the optimal pressure is 10MPa, which will not cause damage due to excessive pressure, and will not cause insufficient compression due to too low pressure; the heating temperature of 125°C is the best, and it will not cause pressure heat due to excessively high temperature The solid conductive adhesive film is too melted, and the temperature will not be too low, which will not achieve the purpose of bonding; the best continuous pressure time is 200 seconds to avoid damage to the ultrasonic atomizer due to too long time.
  • the pressing time is short and the pressing is not tight.
  • red silicone gaskets are placed on the upper and lower sides of the combination of the piezoelectric ceramic sheet and the composite board, and then pressed together.
  • the red silicone rubber gasket 5 As shown in Figure 2, on the front and back of the stacked ultrasonic atomizing sheet, pad the red silicone rubber gasket 5 with a specific thickness, and then enter the hot press for pressing.
  • the red silicone rubber gasket will soften during the pressing process.
  • Qualitative materials are deformed, such as the copper foil and PI film of the FPC flexible circuit board.
  • the piezoelectric ceramic sheet will not deform under the uniform force.
  • the FPC flexible circuit board will produce plastic deformation in the weak part, and the FPC will be flexible.
  • the center position of the circuit board will produce natural bumps due to symmetrical pressure, and the height of the bumps is just near the center of the thickness of the piezoelectric ceramic sheet, and the PI film at the center is tightened during the stretching and deformation process Drumhead effect, and there is no obvious stress pull point.
  • an arc-shaped boss protruding toward the piezoelectric ceramic sheet is formed on the circular part of the substrate, and the arc-shaped boss is provided with atomizing holes.
  • the inner diameter of the atomization hole on the side close to the piezoelectric ceramic sheet is smaller than the inner diameter of the side far from the piezoelectric ceramic sheet.
  • the atomization hole has a conical structure.
  • the FPC flexible circuit board Because the PI film of the FPC flexible circuit board will be tightened during the hot pressing process, the FPC flexible circuit board itself is also subjected to the stress caused by the deformation, so in order to avoid the atomization of the finished product during the pressing process The process of pulling the hole causes the atomization hole to tear, and the punching process should be performed after pressing.
  • the diameter of the upper part of the atomization hole is 2 ⁇ m to 8 ⁇ m, and the diameter of the lower part is 20 ⁇ m to 60 ⁇ m.
  • the diameter of the atomization hole can directly affect the droplet particles of the water mist. This size design can make the atomization effect Better.
  • the main structure of the ultrasonic atomization sheet consists of a piezoelectric ceramic sheet, a stainless steel sheet with a large number of micron-sized holes in the center of the circle, a wire welded on one electrode of the piezoelectric ceramic sheet, and a stainless steel sheet welded on the stainless steel sheet.
  • the other wire is composed of piezoelectric ceramic sheet and stainless steel metal sheet connected by adhesive.
  • the stainless steel sheet metal and adhesive have many shortcomings. The present application is determined to solve the above-mentioned problems and began to try to use the FPC flexible circuit board material instead of the stainless steel sheet metal.
  • the energy conversion efficiency of the atomization sheet is the highest, and the corresponding amount of fog is at the maximum state, but the physical characteristics of the FPC flexible circuit board determine its flatness The degree cannot be well controlled.
  • the PI film will produce a repetition similar to the drumhead. Oscillation, and the waveform is gradually transferred from the surrounding to the center position and produces the maximum amplitude at the center of the circle.
  • the specific waveform transfer diagram is shown in Figure 4; when the film is oscillating, the small holes of the ultrasonic atomizer will extend from the outermost Gradually to the center position, the movement perpendicular to the direction of the atomizing sheet is generated regularly, thereby squeezing and spraying the liquid to produce mist.
  • the production process was changed from the original thermosetting process after bonding to the hot pressing process.
  • the bonding material was also replaced, from the original solder paste or thermosetting adhesive.
  • the process is updated to pressure thermosetting conductive adhesive film.
  • the adhesive material can be cured in a short time under high pressure and heating and has excellent adhesion. At the same time, because this is a thin film material, It has excellent plasticity and can be easily cut into various shapes. The flatness of the material itself is very good, so it has excellent mass production consistency and avoids the uneven coating of traditional solder paste and liquid glue.
  • the problem of poor adhesion consistency of the product; the change of the adhesive material has also caused the corresponding equipment to be updated.
  • the original hot-air welding equipment is updated to a hot press, and the hot press applies the laminated ultrasonic atomizing sheet at the same time Extreme pressure and heating are used to cure the adhesive material in a short time to form a good adhesive strength.
  • Extreme pressure and heating are used to cure the adhesive material in a short time to form a good adhesive strength.
  • Silicone gasket it is necessary to add auxiliary red during the pressing process Silicone gasket; finally solve the above problems.
  • the process of the present invention can achieve large-scale mass production, and the technical data of various equipment and materials have high consistency and high controllability. Therefore, better product consistency can be obtained during the production process, which solves the problem of the past The problem of defective products caused by various discrete errors of liquid glue bonding;
  • the present invention simplifies the process flow and can be applied to large-scale manufacturing
  • thermosetting conductive adhesive film and the piezoelectric ceramic sheet in the present invention can easily use an automated process, and the process is integrated into the FPC production process, and the existing Production line with mature technology;
  • the process of the present invention can be applied to FPC full-page operation when integrated into the FPC production line, which improves the work efficiency
  • the ultrasonic atomizing sheet produced by the present invention can greatly shorten the supply chain, and FPC manufacturers can provide all manufacturing processes except for punching, which reduces the capital investment of the project.
  • the ultrasonic atomizing sheet manufacturing process provided in the second embodiment, before S1, also includes: S0, cutting the FPC flexible circuit board, so that the base material of the FPC flexible circuit board includes piezoelectric ceramics The round part of the cavity in the center of the sheet and a tail part connected with the round part; the conductive layer includes a ring part and a tail part connected with the ring part.
  • a laser machine can be used to process the atomization holes on the circular part of the substrate; or after the pressed product, the laser machine can be used to process the atomization holes on the substrate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Special Spraying Apparatus (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种超声波雾化片的制造工艺，包括：S1，将压力热固导电胶膜（2）切割成与压电陶瓷片（3）适配的形状；S2，将压力热固导电胶膜（2）放置在复合板（1）上；其中，复合板（1）包括基材（11）以及导电层（12），压力热固导电胶膜（2）置于导电层（12）上，基材（11）为高分子膜；S3，将压电陶瓷片（3）放置在压力热固导电胶膜（2）上；S4，利用压力机将S3中的压电陶瓷片（3）和复合板（1）压合。

Description

超声波雾化片的制造工艺 技术领域
本申请涉及雾化片技术领域，具体地涉及一种超声波雾化片的制造工艺。
背景技术
超声波雾化片是通过陶瓷雾化片的高频谐振，将液态水分子结构打散而产生自然飘逸的水雾，不需加热或添加任何化学试剂；与加热雾化方式比较，能源节省了90％；另外在雾化过程中将释放大量的负离子,其与空气中漂浮的烟雾、粉尘等产生静电式反应，使其沉淀，同时还能有效去除甲醛、一氧化碳、细菌等有害物质，使空气得到净化，减少疾病的发生。传统网孔式超声波雾化片的主要结构由压电陶瓷片、圆心部位有大量雾化孔的不锈钢金属薄片、焊接在压电陶瓷片一个电极上的导线和焊接在不锈钢金属薄片上的另外一条导线组成，而基于FPC柔性电路板的网孔式雾化片是通过FPC柔性电路板与锡膏或粘胶等在和压电陶瓷片粘合制成，相对于传统网孔式超声波雾化片来说基于FPC柔性电路板的网孔式雾化片生产的成本更低。
但是在通过FPC柔性电路板与锡膏或粘胶等在和压电陶瓷片粘合制成的超声波雾化片的产品测试中发现，产品的一致性极差，合格率不足50％；且雾化时，PI膜的能量转换效率较低。
因此，现有技术中缺少一种能克服上述缺点的雾化片生产技术。
发明内容
本申请解决的技术问题是如何提供一种产品合格率高，一致性好，能量转换效率较高的超声波雾化片的制造工艺。
为解决上述技术问题，本申请实施例提供一种超声波雾化片的制造工艺， 包括：
S1，将压力热固导电胶膜切割成与压电陶瓷片适配的形状；
S2，将压力热固导电胶膜放置在复合板上；其中，所述复合板包括基材以及导电层，压力热固导电胶置于导电层上，所述基材为高分子膜；
S3，将压电陶瓷片放置在压力热固导电胶膜上；
S4，利用压力机将S3中的压电陶瓷片和复合板压合。
在上述技术方案中，进一步的，在S4之后，还包括：
S5，将S4压合好的产品，使用激光机在复合板的基材上加工出雾化孔。
在上述技术方案中，进一步的，所述复合板为FPC柔性电路板，所述基材为PI膜，所述导电层为铜箔。
在上述技术方案中，进一步的，还包括S0，切割FPC柔性电路板，使FPC柔性电路板的基材包括能够覆盖压电陶瓷片中心空腔的圆形部以及与圆形部连接的尾部；所述导电层包括环形部以及与环形部连接的尾部。
在上述技术方案中，进一步的，在S0中，使用激光机在基材的圆形部上加工出雾化孔。
在上述技术方案中，进一步的，在S4之后，还包括：
S5，将S4压合好的产品，使用激光机在基材的圆形部上加工出雾化孔。
在上述技术方案中，进一步的，基材的圆形部上设有向压电陶瓷片方向凸出的弧形凸台，弧形凸台上设置雾化孔。
在上述技术方案中，进一步的，还包括：
S6，将S5得到的产品进行通电检测，得到合格产品。
在上述技术方案中，进一步的，在所述步骤S4中，压力机以6～15MPa的压力，同时加热至80～150℃将产品压合，并持续100～300秒。
在上述技术方案中，进一步的，在所述步骤S4中，在S3得到的压电陶 瓷片和复合板的结合体的上下两侧放置硅胶垫片后，再压合。
与现有技术相比，本申请实施例的技术方案具有以下有益效果：
本申请实施例提供一种超声波雾化片的制造工艺，采用压力热固导电胶膜来连接压电陶瓷片和复合板，在使用压力机压合压电陶瓷片和复合板后，利于复合板的基材绷紧，产生鼓面效应，雾化片的能量转换效率更高。而且，压力热固导电胶在高压力并且加热的情况下能够在很短的时间内固化并拥有极佳的粘合力，同时由于这种是一种薄膜类材料，拥有极佳的塑性能力，可以十分方便的裁切成各种形状，材料本身的平整度很好，因此具备极佳的批量生产一致性，避免了采用传统锡膏和液态胶涂覆不均匀导致的产品粘合一致性差的问题。
附图说明
图1是本申请实施例的一种超声波雾化片的制造工艺的流程示意图；
图2为本申请实施例制备超声波雾化片的压合示意图；
图3本申请实施例的超声波雾化片的结构示意图；
图4为PI膜绷紧状态震荡波形传递示意图；
图5为铜箔为褶皱状态下导致的波形散射状传递示意图。
附图标记：
1-FPC柔性电路板；11-PI膜；12-铜箔；2-压力热固导电胶膜；3-压电陶瓷片；4-雾化孔；5-硅胶胶垫片。
具体实施方式
为使本申请的上述目的、特征和有益效果能够更为明显易懂，下面结合附图对本申请的具体实施例做详细的说明。显然，所描述的实施例是本申请 一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
第一实施例
如图1所示，本申请实施例的超声波雾化片的制造工艺，包括：
S1，将压力热固导电胶膜切割成与压电陶瓷片适配的形状。
压电陶瓷片为环形，压力热固导电胶膜切割成与压电陶瓷片大小相同的环形。
在一些实施例中，压力热固导电胶膜可以略小于或者略大于压电陶瓷片的大小。
S2，将压力热固导电胶膜放置在复合板上；其中，所述复合板包括基材以及导电层，压力热固导电胶置于导电层上，所述基材为高分子膜。
具体来说，基材包括能够覆盖压电陶瓷片中心空腔的圆形部，所述导电层包括环形部，基材的圆形部与导电层的环形部连接。
在一些实施例中，所述复合板为FPC柔性电路板，所述基材为PI膜，所述导电层为铜箔。在一些实施例中，所述复合板的基材为PI膜，所述导电层为不锈钢片。
S3，将压电陶瓷片放置在压力热固导电胶膜上。
要注意压电陶瓷片、压力热固导电胶膜要对齐，即圆心要重叠。
S4，利用压力机将S3中的压电陶瓷片和复合板压合。
压力机以6～15MPa的压力，同时加热至80～150℃将产品压合，并持续100～300秒。最优选的，压力机的压力为10MPa，加热温度为125℃，持续时间为200秒。
压力为10MPa为最佳压力，不会因为压力过大造成压坏的情况，也不会因为压力过小产生压不紧的情况；加热温度125℃最佳，不会因为温度过高造成压力热固导电胶膜熔化过量，也不会出现温度过低，达不到粘接的目的；持续压力时间的最佳为200秒，避免出现时间过长导致超声波雾化片损坏，同时也不会出现压制时间短，压不紧的情况。
在一些实施例中，在压电陶瓷片和复合板的结合体的上下两侧放置红色硅胶垫片后，再压合。
如图2所示，在堆叠好的超声波雾化片正面和反面垫上特定厚度的红色硅胶胶垫片5，然后进入热压力机进行压合，在压合过程中红色硅胶胶垫片会使软质的材料部分产生形变，例如FPC柔性电路板的铜箔和PI膜，压电陶瓷片在均匀受力的情况下不会产生形变，FPC柔性电路板会在薄弱部位产生塑性形变，最终FPC柔性电路板的中心位置会因为受到对称压力产生自然的凸起，且凸起的高度刚好位于压电陶瓷片厚度的中心位置附近，并且在拉伸变形的过程中将中心位置的PI膜绷紧产生鼓面效应，并且没有明显的应力拉扯点。
在一些实施例中，压合过程中，在基材的圆形部上形成向压电陶瓷片方向凸出的弧形凸台，弧形凸台上设置雾化孔。
S5，将S4压合好的产品，使用激光机在基材上加工出雾化孔。
雾化孔靠近压电陶瓷片一侧的内径小于远离压电陶瓷片一侧的内径。雾化孔为圆锥形结构，这样的设计，可以使得液体越往复合板的上表面运动所受到的挤压力越大，液体也越容易通过雾化孔，从而容易形成水雾。
注意：由于热压的过程中FPC柔性电路板的PI膜会被绷紧产生张力，FPC柔性电路板本身也承受形变带来的应力，因此为避免压合的过程中对已打好的雾化孔进行拉扯的过程中导致雾化孔出现撕裂问题，打孔的工艺应该在压合之后进行。
具体来说，雾化孔上部的直径尺寸为2μm～8μm、下部的直径尺寸为20μm～60μm，雾化孔的孔径可以直接影响水雾的雾滴颗粒，这样的尺寸设计，可以使得雾化效果较佳。
S6，将S5得到的产品进行通电检测，得到合格产品。产品的结构如图2和图3所示。
在现有技术中，超声波雾化片的主要结构由压电陶瓷片、圆心部位有大量微米级小孔的不锈钢金属薄片、焊接在压电陶瓷片一个电极上的导线和焊接在不锈钢金属薄片上的另外一条导线组成，压电陶瓷片与不锈钢金属薄片通过粘合剂连接。但是，不锈钢金属薄片和粘合剂存在诸多缺陷，本申请立志于解决上述问题，开始尝试采用FPC柔性电路板材质，代替不锈钢金属薄片。
当材料FPC柔性电路板的中心位置PI膜处于尽可能平整的状态时雾化片的能量转换效率最高，对应的出雾的雾量处于最大状态，但由于FPC柔性电路板的物理特性决定其平整度无法受到良好的控制。
在进一步的测试中发现当FPC柔性电路板的中心位置PI膜处于紧绷状态时PI膜的平整度最好且雾化片的能量转换效率更进一步的提高了，这种情况下导致的良性收益我们称之为鼓面效应；鼓能够发出声响主要是由于鼓面处于紧绷状态，在外力锤击鼓面的时候鼓面的膜会产生反复的震荡，由此产生了声波；同理当FPC柔性电路板中心位置的PI膜处于紧绷状态的时候此时由压电陶瓷片传递过来的高频震荡会通过铜箔作用于中心位置的PI膜，此时PI 膜会产生类似于鼓面的反复震荡，且其波形是由四周逐渐向中心位置传递并在圆心处产生最大振幅，具体的波形传递示意图如图4所示；当薄膜在震荡的过程中超声波雾化片的小孔会从最外延逐渐到中心位置规律性的产生垂直于雾化片方向的运动，由此将液体挤压喷射而出产生雾。
在进一步测试发现当FPC柔性电路板的中心位置PI膜处于非紧绷状态的时候由压电陶瓷片产生的高频振动会被PI膜吸收，其产生的振幅不足以让PI膜产生规律性的震荡；测试还发现即使PI膜处于绷紧状态，但是由于四周的铜箔形成的褶皱也会导致效率的下降，导致效率下降的原因是由于四周铜箔的褶皱在传递超声波形成的高频震荡的过程中在褶皱处形成了散射状的波形传递，从而使薄膜的震荡幅度下降，具体的波形传递示意图如图5所示；
综上所述，申请人发现：通过FPC柔性电路板与锡膏或粘胶等在和压电陶瓷片粘合制成的超声波雾化片得到的产品铜箔容易形成褶皱，并且PI膜不容易处于紧绷状态；且产品生产的稳定性较差。
针对于此，将生产工艺由原来的粘合后热固的工艺改为了热压合工艺，为了适应工艺的改变对粘合材料也进行了更换，由原来的锡膏或热固胶的粘合工艺更新为压力热固导电胶膜，该粘合材料在高压力并且加热的情况下能够在很短的时间内固化并拥有极佳的粘合力，同时由于这种是一种薄膜类材料，拥有极佳的塑性能力，可以十分方便的裁切成各种形状，材料本身的平整度很好，因此具备极佳的批量生产一致性，避免了采用传统锡膏和液态胶涂覆不均匀导致的产品粘合一致性差的问题；粘合材料的变更使得对应的设备也产生了更新，将原来的热风焊接设备更新为热压力机，热压力机将叠合好的超声波雾化片两面同时施加极大的压力并进行加热，在短时间对粘合材料进行固化形成良好的粘合强度，同时为了使超声波雾化片中心的PI薄膜产生紧绷的状态需要在压合的过程中添加辅助红色硅胶垫片；最终解决上述问题。
此外，在对产品的测试中还发现，采用了热压合工艺后，雾化片的谐振频率一致性不好的问题得到了解决，传统工艺由于使用液态粘合剂涂覆不均 匀和材料表面张力参数不一致等各种离散性误差导致最终成品工作过程中谐振频率不一致，因此需要对每个产品进行对应性的工作频率补偿，造成了驱动电路成本很高，同时故障率也相对较高，而采用了新工艺后由于粘合剂的一致性好，且压合后的材料张力一致性好，解决了成品谐振频率一致性的问题，使得产品的谐振频率等于压电陶瓷的谐振频率，从而使驱动电路得到了大幅度的简化，显著降低了电路的故障率，由于不再需要对每个产品进行工作频率补偿，驱动电路的成本也得到了有效的降低。
本发明提供的超声波雾化片的制造工艺具有以下有益效果：
1、本发明的工艺均可以实现大规模化量产，且各项设备及材料的技术数据一致性高可控性高，因此在生产的过程中可以得到更好的产品一致性，解决了过去基于液态胶水粘合的各种离散性误差导致的不良品的问题；
2、解决了过去基于FPC柔性电路板出雾量一致性的问题，并且进一步的提高了于FPC柔性电路板的工作效率；
3、本发明简化了工艺流程并且能够适用大规模制造；
4、本发明中的FPC柔性电路板、热固导电胶膜和压电陶瓷片的热压工艺可以很方便的使用自动化工艺，且该工艺融合到FPC的生产流程中，可以合理的利用现有的成熟技术生产线进行生产；
5、本发明的工艺在融入FPC生产线中可以适用FPC整版的方式进行作业，提高了作业效率；
6、本发明生产的超声波雾化片可以使得供应链得到了大幅度缩短，FPC厂家即可提供到除打孔外的所有制造工艺，降低了项目的资金投入。
第二实施例
与第一实施例相比，第二实施例提供的超声波雾化片制造工艺，在S1之前，还包括：S0，切割FPC柔性电路板，使FPC柔性电路板的基材包括能够覆盖压电陶瓷片中心空腔的圆形部以及与圆形部连接的尾部；所述导电层包括环形部以及与环形部连接的尾部。
直接采购FPC柔性电路板，然后分别加工FPC柔性电路板的基材和导电层，使其成为图2和图3所示的形状。
可以在S0步骤中，使用激光机在基材的圆形部上加工出雾化孔；也可在压合好的产品后，使用激光机在基材上加工出雾化孔。
虽然本申请披露如上，但本申请并非限定于此。任何本领域技术人员，在不脱离本申请的精神和范围内，均可作各种更动与修改，因此本申请的保护范围应当以权利要求所限定的范围为准。

Claims (10)

  1. 一种超声波雾化片的制造工艺，其特征在于，包括：
    S1，将压力热固导电胶膜切割成与压电陶瓷片适配的形状；
    S2，将压力热固导电胶膜放置在复合板上；其中，所述复合板包括基材以及导电层，压力热固导电胶置于导电层上，所述基材为高分子膜；
    S3，将压电陶瓷片放置在压力热固导电胶膜上；
    S4，利用压力机将S3中的压电陶瓷片和复合板压合。
  2. 根据权利要求1所述的超声波雾化片的制造工艺，其特征在于，在S4之后，还包括：
    S5，将S4压合好的产品，使用激光机在复合板的基材上加工出雾化孔。
  3. 根据权利要求1所述的超声波雾化片的制造工艺，其特征在于，所述复合板为FPC柔性电路板，所述基材为PI膜，所述导电层为铜箔。
  4. 根据权利要求3所述的超声波雾化片的制造工艺，其特征在于，还包括S0，切割FPC柔性电路板，使FPC柔性电路板的基材包括能够覆盖压电陶瓷片中心空腔的圆形部以及与圆形部连接的尾部；所述导电层包括环形部以及与环形部连接的尾部。
  5. 根据权利要求4所述的超声波雾化片的制造工艺，其特征在于，在S0中，使用激光机在基材的圆形部上加工出雾化孔。
  6. 根据权利要求4所述的超声波雾化片的制造工艺，其特征在于，在S4之后，还包括：
    S5，将S4压合好的产品，使用激光机在基材的圆形部上加工出雾化孔。
  7. 根据权利要求4所述的超声波雾化片的制造工艺，其特征在于，基材的圆形部上设有向压电陶瓷片方向凸出的弧形凸台，弧形凸台上设置雾化孔。
  8. 根据权利要求2所述的超声波雾化片的制造工艺，其特征在于，还包括：
    S6，将S5得到的产品进行通电检测，得到合格产品。
  9. 根据权利要求1所述的超声波雾化片的制造工艺，其特征在于，在所述步骤S4中，压力机以6～15MPa的压力，同时加热至80～150℃将产品压合，并持续100～300秒。
  10. 根据权利要求1所述的超声波雾化片的制造工艺，其特征在于，在所述步骤S4中，在S3得到的压电陶瓷片和复合板的结合体的上下两侧放置硅胶垫片后，再压合。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114749321A (zh) * 2022-04-19 2022-07-15 深圳摩尔雾化健康医疗科技有限公司 超声雾化组件及超声雾化装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110193442B (zh) * 2019-04-24 2025-03-18 深圳市尚进电子科技有限公司 一种网孔式超声波雾化片及制造工艺
CN110324985B (zh) * 2019-07-10 2020-05-22 深圳市尚进电子科技有限公司 超声波雾化片生产工艺
CN111315143A (zh) * 2020-04-01 2020-06-19 艾因蒂克检测科技（上海）股份有限公司 一种取缔焊接导通的粘接分切工艺
GB2588860B (en) * 2020-11-23 2022-01-12 Specialist Health Solutions Ltd Injection head for excitation of fluid
CN119138127A (zh) * 2022-05-11 2024-12-13 株式会社吴羽 层叠压电膜、器件以及层叠压电膜的制造方法
CN116118298A (zh) * 2022-10-20 2023-05-16 深圳市尚进电子科技有限公司 基于简化复合板的网式超声波雾化片生产工艺
CN115534493B (zh) * 2022-10-20 2024-06-21 深圳市尚进电子科技有限公司 基于fpc柔性线路板的微网雾化片及其制造工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101422777A (zh) * 2007-11-02 2009-05-06 微邦科技股份有限公司 具厚板结构的高频振动机构
TW200940114A (en) * 2008-03-25 2009-10-01 Quatek Co Ltd Medical liquid droplet apparatus
CN106493032A (zh) * 2016-12-30 2017-03-15 杭州艾新医疗科技有限公司 一种复合雾化片及其制作方法
CN107412926A (zh) * 2017-05-18 2017-12-01 南京鱼跃软件技术有限公司 一种微孔雾化装置的微孔片电气连接及固定结构
CN109261428A (zh) * 2018-11-05 2019-01-25 东莞市谦合电子有限公司 一种压电陶瓷雾化片
CN110324985A (zh) * 2019-07-10 2019-10-11 深圳市尚进电子科技有限公司 超声波雾化片生产工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216753A (ja) * 1982-06-09 1983-12-16 Matsushita Electric Ind Co Ltd 霧化装置
US5920972A (en) * 1997-06-27 1999-07-13 Siemens Medical Systems, Inc. Interconnection method for a multilayer transducer array
US8834377B2 (en) * 2007-10-15 2014-09-16 Konica Minolta, Inc. Ultrasonic probe
JP5984359B2 (ja) * 2010-11-09 2016-09-06 住友化学株式会社 超音波霧化ユニット
JP6329130B2 (ja) * 2012-04-10 2018-05-30 アイノビア，インコーポレイティド 噴霧エジェクタ機構、電荷分離及び制御可能な液滴電荷を提供する装置、並びに低投与量の点眼
TWM439524U (en) * 2012-04-16 2012-10-21 Microbase Technology Corp Atomization structure with improved vent sheet and atomization device thereof
TWI548461B (zh) * 2014-02-21 2016-09-11 Double chamber full cover sealed piezoelectric atomization module
CN108926759A (zh) * 2017-05-22 2018-12-04 邻得膜科技（北京）有限公司 一种雾化片用核微孔膜及其制备方法
JP7003559B2 (ja) * 2017-10-13 2022-01-20 サンスター株式会社 超音波噴霧装置
CN208912405U (zh) * 2018-09-17 2019-05-31 深圳来福士雾化医学有限公司 一种耐用且易于组装的超声雾化片
CN110193442B (zh) * 2019-04-24 2025-03-18 深圳市尚进电子科技有限公司 一种网孔式超声波雾化片及制造工艺

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101422777A (zh) * 2007-11-02 2009-05-06 微邦科技股份有限公司 具厚板结构的高频振动机构
TW200940114A (en) * 2008-03-25 2009-10-01 Quatek Co Ltd Medical liquid droplet apparatus
CN106493032A (zh) * 2016-12-30 2017-03-15 杭州艾新医疗科技有限公司 一种复合雾化片及其制作方法
CN107412926A (zh) * 2017-05-18 2017-12-01 南京鱼跃软件技术有限公司 一种微孔雾化装置的微孔片电气连接及固定结构
CN109261428A (zh) * 2018-11-05 2019-01-25 东莞市谦合电子有限公司 一种压电陶瓷雾化片
CN110324985A (zh) * 2019-07-10 2019-10-11 深圳市尚进电子科技有限公司 超声波雾化片生产工艺

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3962245A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114749321A (zh) * 2022-04-19 2022-07-15 深圳摩尔雾化健康医疗科技有限公司 超声雾化组件及超声雾化装置

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