WO2021017746A1 - 感光组件、摄像模组及其制造方法 - Google Patents

感光组件、摄像模组及其制造方法 Download PDF

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Publication number
WO2021017746A1
WO2021017746A1 PCT/CN2020/099937 CN2020099937W WO2021017746A1 WO 2021017746 A1 WO2021017746 A1 WO 2021017746A1 CN 2020099937 W CN2020099937 W CN 2020099937W WO 2021017746 A1 WO2021017746 A1 WO 2021017746A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive
circuit board
mold
molded
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/099937
Other languages
English (en)
French (fr)
Inventor
栾仲禹
黄桢
刘丽
孙鑫翔
卢彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910709051.4A external-priority patent/CN112311972B/zh
Priority claimed from CN201921236646.4U external-priority patent/CN210157258U/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to EP20846572.4A priority Critical patent/EP3989531A4/en
Priority to US17/631,560 priority patent/US12364039B2/en
Publication of WO2021017746A1 publication Critical patent/WO2021017746A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements

Definitions

  • This application relates to the field of camera modules, and in particular to photosensitive components, camera modules and manufacturing methods thereof.
  • the size of the camera module is gradually reduced.
  • the packaging process of the camera module has gradually evolved from the traditional COB (Chip on Board) process to the molding process.
  • FIG. 1 illustrates a schematic structural diagram of an existing camera module prepared based on a molding process.
  • the camera module is prepared by MOC (Molding on Chip) molding process, and includes a photosensitive component and an optical lens 1P held in a photosensitive path of the photosensitive component.
  • the photosensitive component includes a circuit board 2P, a photosensitive chip 3P and a molded body 4P, wherein the molded body 4P is integrally formed on the circuit board 2P to integrally cover at least a part of the circuit board 2P and the photosensitive chip 3P At least part of the non-photosensitive area.
  • the molding and packaging process has also caused some new technical problems, such as the deformation of the photosensitive chip due to excessive stress, resulting in poor image quality.
  • the main purpose of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, which can effectively reduce the bending amount of the photosensitive chip due to stress, so as to improve the imaging quality of the camera molding.
  • Another object of the present application is to provide a camera module, a photosensitive component and a method of manufacturing the same, wherein a groove is provided on the molded body to reduce the amount of stress that the molded body acts on the photosensitive chip, In order to effectively reduce the deformation of the photosensitive chip due to stress.
  • Another object of the present application is to provide a camera module, a photosensitive component and a method of manufacturing the same, wherein the groove is recessedly formed in the molded body, and the groove is formed at a position of the photosensitive chip On the outside, in this way, the stress transmission chain formed by the molded body and the photosensitive chip is cut, or the stress transmitted on the stress transmission chain formed by the molded body and the photosensitive chip is reduced .
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the groove divides the molded body into a first molded part and a second molded part, which is compared with
  • the volume of the molded part covering the photosensitive chip is reduced, so that the shrinkage of the molded part covering the photosensitive chip is reduced under the same shrinkage rate. Therefore, the stress generated by the molded part is correspondingly reduced to reduce the bending amount of the photosensitive chip.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the arrangement of the slots increases the overall exposed surface area of the molded body, so that the molded body produces The stress can be distributed to the outer surface of the molded body relatively more, so as to relatively reduce the magnitude of the stress that the molded body acts on the photosensitive chip.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the arrangement of the groove increases the overall exposed surface area of the molded body, which is beneficial to improve the photosensitive component The heat dissipation performance.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the slot provides a heat dissipation channel, and the heat generated by the photosensitive component during operation can be dissipated through the heat dissipation channel.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein the slot can be mounted on the photosensitive component on the optical lens and/or the filter element is mounted on the molded
  • an overflow space is provided to contain the overflowing glue.
  • Another object of the present application is to provide a camera module, a photosensitive component and a manufacturing method thereof, wherein, in an embodiment of the present application, the filter element holder is preset on the circuit board and integrated after molding.
  • the filter element holder can not only be used to install the filter element, but also can prevent the stress generated by the second molded part from being transmitted to The photosensitive chip, and the shape of the first molded part is maintained to ensure that the internal stress generated by the first molded part is not sufficient to excessively change the shape of the photosensitive chip.
  • a photosensitive component which includes:
  • a photosensitive chip electrically connected to the circuit board
  • At least one electronic component arranged on the circuit board
  • the molded body includes a first molded part and a second molded part divided by the slot, and the first molded part covers at least a part of the circuit board and the At least a part of the non-photosensitive area of the photosensitive chip.
  • the depth of the groove is greater than or equal to 30% of the height of the molded body.
  • the slot is formed through the molded body to expose a corresponding area of the circuit board.
  • the first molded part and the second molded part are connected by a molding channel.
  • the at least one slot includes a first slot and a second slot, and the first slot and the second slot are symmetrically arranged with respect to the center line of the photosensitive chip , Wherein the molding channel is formed between the first slot and the second slot during the molding process.
  • the groove is a closed ring groove surrounding the first molded part to divide the molded body into the first molded part and the second molded part independent of each other. Molded part.
  • the first molded part and the second molded part are formed by a two-shot molding process.
  • the photosensitive assembly further includes a filter element holder disposed in the slot, wherein the filter element holder is configured to mount the filter element thereon.
  • the photosensitive assembly further includes a filter element holder provided in the slot, wherein the filter element holder is configured to mount the filter element thereon.
  • the filter element holder has a channel penetrating therethrough, wherein the filter element holder is preset on the circuit board and integrated with the molded body after being integrally formed.
  • the first molded part and the second molded part of the molded body are integrally formed.
  • the photosensitive assembly further includes a side encapsulant that wraps the side of the photosensitive chip.
  • the side encapsulation covers at least a part of the lead wires used to electrically connect the photosensitive chip and the circuit board.
  • the present application also provides a camera module, which includes:
  • the present application also provides a method for manufacturing a photosensitive component, which includes the steps:
  • circuit board wherein at least one electronic component and at least one photosensitive chip are electrically connected to the circuit board;
  • the upper mold and the lower mold of the forming mold are separated to form a slot recessed in the molded body at a position corresponding to the protrusion.
  • the process of forming the molded body includes:
  • the upper mold and the lower mold of the forming mold are closed together, wherein the upper mold includes a mold main body and first and second protrusions spaced apart and extending downward from the mold main body, wherein, when When the upper mold and the lower mold are closed, the first protrusion of the upper mold is attached to the circuit board, and the second protrusion of the upper mold is attached to the non-contact surface of the photosensitive chip.
  • Photosensitive area to form a second molding space between the first protrusion and the mold body, and to form a first molding space between the second protrusion and the first protrusion, wherein,
  • the first protrusion also has a molding channel communicating the first molding space and the second molding space;
  • the upper mold and the lower mold are separated to form the slot at a position corresponding to the first protrusion.
  • the process of forming the molded body includes:
  • the upper mold and the lower mold of the forming mold are clamped, wherein the upper mold includes a mold main body and a first protrusion extending downwardly and spaced from the mold main body, wherein when the upper mold and When the lower mold is closed, the first protrusion of the upper mold is attached to the circuit board to form a first molding space between the first protrusion and the mold main body, wherein the The compression molding material is located in the first molding space;
  • the second upper mold includes a second mold main body and a second protrusion extending downwardly and spaced from the second mold main body;
  • the upper mold and the lower mold are separated to form the slot recessed in the molded body at a corresponding position of the second protrusion.
  • the method before forming the molded body, the method further includes:
  • At least one filter element holder is preset on the circuit board, and the filter element holder has a channel penetrating therethrough, so that after the molded body is integrally formed, the filter element holder is integrated with the mold.
  • the first molded part and the second molded part of the plastic body are preset on the circuit board, and the filter element holder has a channel penetrating therethrough, so that after the molded body is integrally formed, the filter element holder is integrated with the mold.
  • the circuit board is implemented as a circuit board imposition.
  • the present application also provides a method for manufacturing a camera module, including:
  • a molded body is formed, wherein the molded body has a groove formed recessed therein, and wherein the groove divides the molded body into a first mold The molded part and the second molded part;
  • the optical lens is mounted on the second molded part of the molded body.
  • FIG. 1 illustrates a schematic structural diagram of an existing camera module prepared based on a molding process.
  • FIG. 2 illustrates a schematic diagram of the photosensitive chip deformed due to stress in a photosensitive component prepared based on a molding process.
  • Fig. 3 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • Fig. 4 illustrates a schematic diagram of a photosensitive component of the camera module according to an embodiment of the present application.
  • Fig. 5 illustrates another schematic diagram of the photosensitive assembly according to an embodiment of the present application.
  • 6A and 6B illustrate schematic diagrams of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 7A and 7B illustrate schematic diagrams of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIGS. 8A and 8B illustrate schematic diagrams of a modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIGS. 9A and 9B illustrate schematic diagrams of a photosensitive assembly according to another embodiment of the present application.
  • Fig. 10 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 11 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • Fig. 12 illustrates a schematic diagram of another modified implementation of the photosensitive assembly according to an embodiment of the present application.
  • FIG. 13 illustrates a schematic diagram of a photosensitive assembly according to another embodiment of the present application.
  • FIG. 14 illustrates a schematic diagram of another modified implementation according to the embodiment of the present application.
  • FIG. 15 illustrates a schematic diagram of a manufacturing process of a photosensitive component according to an embodiment of the present application.
  • 16A and 16B illustrate a schematic diagram of a manufacturing process of a photosensitive component according to another embodiment of the present application.
  • FIG. 17 illustrates a schematic diagram of a manufacturing process of a photosensitive component according to another embodiment of the present application.
  • the size of the camera module can be made smaller through a molding process such as MOC (Molding on Chip).
  • MOC Manufacturing on Chip
  • the molding and packaging process has also caused some new technical problems.
  • the combination of the circuit board 2P and the molded body 4P and the combination of the molded body 4P and the photosensitive chip 3P belong to a rigid combination.
  • the combination of the two has a high strength and requires destructive methods. To be removed.
  • the photosensitive chip 3P and the circuit board 2P are combined by glue, which is a flexible combination.
  • the thermal expansion coefficients of the wiring board 2P, the molded body 4P, and the photosensitive chip 3P are different.
  • the environmental temperature in the molding process changes greatly (the temperature of the molding material needs to be increased to 150 degrees or more) and the frequency of conversion is high, resulting in the photosensitive chip 3P, the circuit board 2P and the molded body 4P Different degrees of expansion and contraction occurred.
  • the expansion and contraction speeds of the circuit board 2P, the molded body 4P, and the photosensitive chip 3P are also inconsistent, and these phenomena result in the smallest shrinkage of the photosensitive chip 3P.
  • the combination of the circuit board 2P and the molded body 4P, the combination of the molded body 4P and the photosensitive chip 3P is a rigid combination, there will be between the circuit board 2P and the molded body 4P, and the photosensitive chip 3P and the molded body Stress occurs between 4P.
  • the photosensitive chip 3P has the smallest shrinkage, the stress will be concentrated on the photosensitive chip 3P, resulting in a relatively large deformation of the photosensitive chip 3P, and the deformation effect is shown in FIG. 2.
  • the deformation effect shown in Fig. 2 is exaggerated, which only shows the direction and characteristics of the deformation and does not represent the specific deformation size.
  • the bent photosensitive chip 3P will have a greater impact on the image quality, which is reflected in the performance of the camera module: the camera module has too much field curvature, and the center effect of the captured image is normal but the edge effect is poor.
  • the imaging components formed by the molding process also have defects such as poor heat dissipation performance.
  • the basic idea of the present application is to reduce the amount of stress that the molded body acts on the photosensitive chip by arranging grooves on the molded body, so as to effectively reduce the stress on the photosensitive chip. And the deformation that occurs.
  • a photosensitive component which includes: a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and integrally formed on the circuit
  • the camera module based on the embodiments of the present application is illustrated, wherein the camera module includes an optical lens 10 and a photosensitive component 20, and the optical lens 10 is held on the photosensitive component 20 The photosensitive path, so that the light collected by the optical lens 10 can be imaged in the photosensitive component 20 along the photosensitive path.
  • the camera module shown in FIG. 3 is a fixed-focus camera module.
  • the camera module involved in this application can also be implemented as a dynamic-focus camera module.
  • the camera module further includes a driving element (for example, a motor) arranged between the optical lens 10 and the photosensitive assembly 20, so that the driving element carries the optical lens 10 along The photosensitive path moves to change the distance between the optical lens 10 and the photosensitive assembly 20.
  • a driving element for example, a motor
  • the photosensitive component 20 includes a circuit board 21, a photosensitive chip 22, at least one electronic component 23 and a molded body 24.
  • the photosensitive chip 22 is electrically connected to the circuit board 21.
  • the at least one electronic component 23 is disposed around the photosensitive chip 22 and is electrically connected to the circuit board 21.
  • the molded body 24 is integrally formed on the circuit board 21 through a molding process to cover at least a part of the circuit board 21.
  • the molded body 24 is provided with a slot 240 recessedly formed therein, so as to reduce the impact of the molded body 24 on the photosensitive chip 22 through the slot 240.
  • the magnitude of the stress effectively reduces the amount of deformation of the photosensitive chip 22 due to stress.
  • the at least one electronic component 23 may be mounted on the upper surface of the circuit board 21 through a surface mounting technology (Surface Mounting Technology). Generally, the at least one electronic component 23 is mounted on the surrounding area of the photosensitive chip 22. Alternatively, the at least one electronic component 23 can also be embedded in the circuit board 21 to reduce the height of the at least one electronic component 23 protruding from the circuit board 21. It should be understood that the installation process of the at least one electronic component 23 is not limited by this application.
  • the type of the at least one electronic component 23 is not limited to this application, and includes but not limited to capacitors, inductors, triodes, thyristors, resistors, etc.
  • the electrical connection between the photosensitive chip 22 and the circuit board 21 is realized by a lead 25.
  • each of the lead wires 25 is bent and extends between the photosensitive chip 22 and the circuit board 21, so as to electrically connect the photosensitive chip 22 to The circuit board 21, therefore, the circuit board 21 can supply power to the photosensitive chip 22 based on the lead 25, and the photosensitive chip 22 can transmit the collected signal based on the lead 25.
  • the type of the lead wire 25 is not limited by this application.
  • the lead wire 25 may be a gold wire, a silver wire, or a copper wire.
  • the lead 25 can be installed between the circuit board 21 and the photosensitive chip 22 through a process of "golding wire" to achieve electrical connection between the two.
  • the "golden thread” process is generally divided into two types: the “positive gold line” process and the “reverse gold line” process.
  • the “positive gold wire” process means that in the process of laying out the leads 25, one end of the lead 25 is first formed on the conductive end of the circuit board 21, and then the lead 25 is bent and extended, and finally The other end of the lead 25 is formed on the conductive end of the photosensitive chip 22. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21.
  • the "reverse gold wire” process means that in the process of laying the lead 25, one end of the lead 25 is formed on the conductive end of the photosensitive chip 22, and then the lead 25 is bent and extended, and finally The other end of the lead 25 is formed on the conductive end of the circuit board 21. In this way, the lead 25 is formed between the photosensitive chip 22 and the circuit board 21. It is worth mentioning that the height of the upward protrusion of the lead 25 formed by the "reverse gold wire” process is relative to the height of the upward protrusion of the lead 25 formed by the "positive gold wire” process. Therefore, preferably, In this specific implementation, the wire 25 is formed using the "reversed gold wire” process.
  • the photosensitive chip 22 and the circuit board 21 can be connected in other ways, for example, a back-connected way. In this regard, this application is not limited.
  • the molded body 24 is integrally formed on the circuit board 21 to integrally cover at least a part of the circuit board 21 and the non-photosensitive area of the photosensitive chip 22 At least part of and at least part of the at least one electronic component 23.
  • the molded body 24 has at least one slot 240 recessedly formed therein. From the perspective of the placement position, the slot 240 is located outside the photosensitive chip 22. By setting such a position, the slot 240 can effectively reduce the effect of the molded body 24 on the photosensitive chip 22. In order to effectively reduce the deformation of the photosensitive chip 22 due to the stress.
  • the combination of the circuit board 21 and the molded body 24, and the combination of the molded body 24 and the photosensitive chip 22 is a rigid combination, and the photosensitive chip 22 and the circuit
  • the bonding between the boards 21 is a flexible bonding, and the thermal expansion coefficients of the circuit board 21, the molded body 24, and the photosensitive chip 22 are different, which causes the wiring board 21 and the molded body 24 to have different thermal expansion coefficients. Stress occurs therebetween and between the photosensitive chip 22 and the molded body 24.
  • the photosensitive chip 22 since the photosensitive chip 22 has the smallest shrinkage, stress will be concentrated on the photosensitive chip 22.
  • the molded body 24 and the molded body 24 can be reduced.
  • FIG. 4 by providing a longitudinal slot 240 on the molded body 24, the thickness of the molded part for transferring stress in the molded body 24 can be reduced to reduce the The magnitude of the stress that the molded body 24 acts on the photosensitive chip 22.
  • the slot 240 provided between the photosensitive chip 22 and the molded body 24 is equivalent to the stress transmission chain between the molded body 24 and the photosensitive chip 22
  • the upper "cut a knife" to break the stress transmission chain More specifically, the formation position of the slot 240 may be set between the electronic component 23 and the lead 25, or between the electronic component 23 and the electronic component 23, or The outer side of the electronic component 23 is not limited by this application. Preferably, in the embodiment of the present application, the formation position of the slot 240 is set between the electronic component 23 and the lead 25.
  • the ability of the groove 240 to reduce the stress of the molded body 24 on the photosensitive chip 22 is related to the depth of the groove 240. Specifically, as the depth of the groove 240 increases, the ability of the groove 240 to reduce the stress of the molded body 24 on the photosensitive chip 22 is stronger. In particular, in some examples of the present application, the depth of the groove 240 is greater than or equal to 30% of the height of the molded body 24, as shown in FIGS. 6A and 6B. Here, the height of the molded body 24 indicates the height of the molded body 24 at the position where the slot 240 is set. It should be understood that the shape of the molded body 24 configures the molded body 24 in The height at different locations may vary. Preferably, the depth of the groove 240 is greater than or equal to half of the height of the molded body 24.
  • the depth of the groove 240 is equal to the height of the molded body 24.
  • the slot 240 is a through slot formed through the molded body 24 to expose a corresponding area of the circuit board 21. It should be understood that when the slot 240 is a through slot that penetrates the molded body 24, the stress transmission chain between the molded body 24 and the photosensitive chip 22 is completely covered by the slot 240. It is cut so that the stress of the molded body 24 on the photosensitive chip 22 is minimized.
  • the width of the slot 240 can also be increased as much as possible without damaging the overall structural strength of the molded body 24 to enhance the The slot 240 reduces the ability of the molded body 24 to exert stress on the photosensitive chip 22.
  • the molded body 24 is divided into a first molded part 241 and a second molded part 241.
  • the molded body 24 is divided into a first molded part 241 and a second molded part 242 due to the groove 240, which is compared with the existing molded Process, the volume of the molded part covered on the photosensitive chip 22 will be reduced, so that under the same shrinkage rate, the shrinkage of the molded part covered on the photosensitive chip 22 will be reduced, so that the molded part produces The stress is also reduced accordingly to reduce the amount of bending of the photosensitive chip 22.
  • the volume of the first molded part 241 may be smaller than the second molded part 242 to reduce the stress of the molded body 24 on the photosensitive chip 22.
  • the first molded part 241 and the second molded part 242 of the molded body 24 are connected by a molding channel 243.
  • the at least one slot 240 includes a first slot 2401 and a second slot 2402, wherein the first slot 2401 and the second slot 240 Two slots 2402 are respectively formed through the molded body 24.
  • the first slot 2401 and the second slot 2402 surround the first molded part 241 and are joined at the molded channel 243.
  • the molding channel 243 is formed between the first slot 2401 and the second slot 2402, so that after the molded body 24 is molded,
  • the molded body 24 is divided into the first molded portion 241 and the second molded portion 242 by the first slot 2401 and the second slot 2402, and the first mold
  • the molding part 241 and the second molding part 242 are connected by the molding passage 243.
  • the first slot 2401 and the second slot 2402 are arranged symmetrically with respect to the center line of the photosensitive chip 22, and the first slot 2401 and the The second slot 2402 has Font.
  • first slot 2401 and the second slot 2402 can also be arranged in an asymmetric manner, or when the first slot 2401 and the When the second slot 2402 is arranged in a symmetrical manner, the first slot 2401 and the second slot 2402 can be implemented in other shapes, such as an "I" shape, which is not limited by this application.
  • the at least one slot 240 may also include a greater number of slots 240 (for example, further include a third slot 2403) or only include the first slot 240.
  • the first slot 2401 of the molded part 241 is not limited by this application.
  • FIGS. 7A and 7B illustrate schematic diagrams of a modified implementation of the photosensitive assembly 20 according to an embodiment of the present application.
  • the first molded part 241 and the second molded part 242 of the molded body 24 are connected by a molding channel 243.
  • the height of the molding channel 243 is lower than that of the first molding portion 241 and the second molding portion 242, so that the molding channel 243, the A third slot 2403 is formed between the first molded part 241 and the second molded part 242.
  • the slot 240 not only includes the first slot 2401 and the second slot 2402 penetrating the molded body 24, but also includes the channel and the second slot 2402 of the molded body 24.
  • the first molded part 241 and the second molded part 242 form a third slot 2403. It should be understood that the first molded part 241 and the second molded part 242 of the molded body 24 shown in FIGS. 7A and 7B can be formed by a single molding process, wherein the molded channel 243 The setting is precisely to achieve this technological purpose.
  • FIGS. 8A and 8B illustrate schematic diagrams of a modified implementation of the photosensitive assembly 20 according to an embodiment of the present application.
  • the first molded portion 241 and the second molded portion 242 of the molded body 24 are molded by molding
  • the channels 243 are connected.
  • the molded body 24 includes only one molded channel 243, and the height of the molded channel 243 may be lower than or equal to the first molded portion 241 and the The second molded part 242.
  • the slot 240 has Font.
  • first molded part 241 and the second molded part 242 of the molded body 24 shown in FIGS. 8A and 8B can be formed by a single molding process, wherein the molded channel 243 The setting is precisely to achieve this technological purpose.
  • FIGS. 9A and 9B illustrate schematic diagrams of a photosensitive assembly 20 according to another embodiment of the present application.
  • the groove 240A is a closed ring groove that completely surrounds the first molded portion 241A . That is, in the embodiment of the present application, the first molded part 241A and the second molded part 242A of the molded body 24A are divided into two independent molded parts by the slot 240A. section.
  • the slot 240A can completely isolate the connection between the first molded part 241A and the second molded part 242A, so that the second molded part 242A generates The stress will not be transferred to the first molded part 241A, and therefore will not be transferred to the photosensitive chip 22A.
  • the first molded part 241A and the second molded part 242 are formed by a two-time molding process. That is to say, in the embodiment of the present application, the first molded part 241A and the second molded part 242A are separately molded in batches, and the molded body 24 shown in FIG. 4 can pass through a single mold. Plastic molding process. This part of the content will be described in more detail in the subsequent preparation process of the photosensitive component 20A, and will be skipped here.
  • the photosensitive component 20 further includes a package
  • the side part of the photosensitive chip 22 and the side encapsulation 28 of at least a part of the lead 25 are used to prevent the position of the photosensitive chip 22 from shifting during the molding process, and the effect is shown in FIG. 10. It should be understood that the side encapsulation 28 can not only prevent the position of the photosensitive chip 22 from shifting, but also effectively reduce the stress generated by the molded body 24 from being transmitted to the photosensitive chip 22. At the same time, It is also possible to prevent the lead 25 from collapsing due to impact by the molding material.
  • the photosensitive assembly 20 further includes a filter element 26 held in the photosensitive path of the photosensitive chip 22, wherein the filter element 26 corresponds to the At least the photosensitive area of the photosensitive chip 22 is used to filter light entering the photosensitive chip 22 to improve imaging quality.
  • the filter element 26 is attached to the first molded part 241 of the molded body 24 to maintain the photosensitive path of the photosensitive chip 22.
  • the slot 240 when the slot 240 is provided between the electronic component 23 and the lead 25, the slot 240 is adjacent to the first molded part 241, so that the When the element 26 is in the first molded part 241, the overflowing glue can be contained in the slot 240 to prevent the excess glue from contaminating other components (especially the photosensitive chip 22).
  • the slot 240 also functions as an overflow groove.
  • a recessed upper surface of the first molded part 241 may be further formed to communicate with the slot 240. The guide groove is used to guide excess glue to flow to the slot 240.
  • the first molded part 241 further includes a mounting platform 260 recessed on the upper surface of the first molded part 241, and the mounting platform 260 is configured to mount the filter element 26 thereon.
  • mounting the filter element 26 on the mounting platform 260 is beneficial to reduce the filter element.
  • the size of the light element 26 can reduce the cost of the filter element 26.
  • this mounting method can also shorten the distance between the filter element 26 and the photosensitive chip 22, so that the overall thickness of the photosensitive component 20 can be reduced.
  • the inner side surface of the first molded part 241 may be perpendicular to the photosensitive chip 22 or inclined to the photosensitive chip 22, wherein the inner sides arranged in different ways face
  • the parameter configuration corresponding to the different protrusions of the molding die 90 is not limited to this application.
  • the filter element 26 can be implemented in different types, including but not limited to the filter element 26 can be implemented as an infrared cut filter, a full Transmission spectrum filter and other filters or a combination of multiple filters.
  • the filter element 26 when the filter element 26 is implemented as a combination of an infrared cut filter and a full transmission spectrum filter, that is, the infrared cut filter and the full transmission spectrum filter can be Switching to be selectively located on the photosensitive path of the photosensitive chip 22, so that the infrared cut filter can be switched to the photosensitive path of the photosensitive chip 22 when used in an environment with sufficient light such as daytime.
  • the full transmission spectrum filter can be used.
  • the light-sensing path of the light-sensing chip 22 is switched to allow part of the infrared rays of the light reflected by the object entering the light-sensing chip 22 to pass through.
  • FIG. 12 illustrates a schematic diagram of another modified implementation of the photosensitive assembly 20 according to an embodiment of the present application.
  • the photosensitive assembly 20 further includes a filter element holder 27, wherein the filter element holder 27 is disposed in the slot 240 and is configured to install the The filter element 26 is thereon.
  • the filter element holder 27 includes a holder body and a support arm extending inward from the holder body, wherein the support arm forms at least a portion corresponding to the photosensitive chip 22 Through holes in the photosensitive area.
  • the filter element 26 when the filter element 26 is mounted on the support arm, the filter element 26 covers the through hole so that the light is absorbed by the filter element before the light reaches the photosensitive chip 22 through the through hole. 26 are filtered to improve image quality. It should be understood that the size of the filter element 26 can be further reduced through the support arm of the filter element holder 27, so that the cost of the filter element 26 can be further reduced. It is worth mentioning that in other examples of the embodiments of the present application, the filter element 26 can also be held in the light-sensing path of the photo-sensing chip 22 in other ways. For example, the filter element 26 can be directly stacked.
  • the filter element 26 may also be supported in the optical lens 10, or may be formed on the surface of the lens in the optical lens 10 in the form of a coating. In this regard, this application is not limited.
  • FIG. 13 illustrates a schematic diagram of a photosensitive component 20 according to another embodiment of the present application.
  • the filter element holder 27B is integrated between the first molded part 241B and the second molded part 242B of the molded body 24B.
  • the filter element holder 27B before the molding process is performed, the filter element holder 27B is disposed on the circuit board 21B, and the filter element holder 27B has a channel ( (Not shown in the figure), wherein the channel is configured to allow the molding material to flow through.
  • the channel may be provided at the bottom of the filter element holder 27B, or formed through the side wall of the filter element holder 27B.
  • the filter element holder 27B is integrally combined with the first molded portion 241B and the second molded portion 241B of the molded body 24B. Between section 242B. Regarding how the filter element 26B is combined between the first molded part 241B and the second molded part 242B, and how the molded body 24B is molded, we will discuss later on the photosensitive element. The manufacturing process of 20B will be further introduced and will not be expanded here in detail.
  • the filter element holder 27B is made of a material with strong rigidity (for example, metal, PMMA, ceramic, ABS resin, etc.), so that the filter element holder 27B Has high structural strength. It should be observed that after the molded body 24B is integrally formed, the inner surface of the filter element holder 27B is wrapped and joined to the first molded part 241B, and the outer surface of the filter element 26B is integrally joined In the second molded part 242B, in this way, the filter element holder 27B can maintain the shape of the first molded part 241B, thereby ensuring that the internal stress generated by the first molded part 241B is insufficient. The shape of the photosensitive chip 22B is changed excessively.
  • a material with strong rigidity for example, metal, PMMA, ceramic, ABS resin, etc.
  • the filter element holder 27B is disposed between the first molded part 241B and the second molded part 242B, the stress generated by the second molded part 242B can be filtered by the The light element holder 27B is cut off, so that the stress generated by the second molded part 242B cannot affect the photosensitive chip 22B located inside the filter element holder 27B.
  • the filter element holder 27B integrally combined with the first molded part 241B and the second molded part 242B of the molded body 24B can not only be used for mounting filter
  • the element 26B on it can also prevent the stress generated by the second molded portion 242B from affecting the photosensitive chip 22B, and maintain the shape of the first molded portion 241B to ensure that the internal stress generated by the first molded portion 241B is insufficient
  • the shape of the photosensitive chip 22B is changed excessively.
  • the arrangement of the slot 240 can not only reduce the stress of the molded body 24 on the photosensitive chip 22, but also increase the The overall exposed surface area of the molded body 24, so that the stress generated by the molded body 24 can be relatively more distributed to the outer surface of the molded body 24, so as to relatively reduce the effect of the molded body 24 on The stress level of the photosensitive chip 22. It should be understood that the arrangement of the slot 240 increases the overall exposed surface area of the molded body 24, and the slot 240 provides a heat dissipation channel to make the photosensitive component 20 work The heat can be dissipated through the heat dissipation channel, which is beneficial to improve the heat dissipation performance of the photosensitive component 20.
  • a certain depth of the groove 240 is provided on the molded body, and as As the depth of the slot 240 deepens, the heat dissipation area of the heat dissipation channel is also increasing, so that the heat dissipation performance of the photosensitive component 20 can be enhanced.
  • the depth of the groove 240 is greater than or equal to 30% of the height of the molded body 24.
  • the molded body 24 of the embodiment of the present application can also be molded by a compression molding process, wherein the compression molding material includes but not limited to powdered, gelatinous epoxy resin, etc., this is not This application is limited.
  • FIG. 14 illustrates another modified embodiment of the photosensitive assembly 20 according to the embodiment of the present application.
  • the photosensitive component 20 further includes a reinforcing plate disposed on the lower surface of the circuit board 21, so that the structural strength of the circuit board 21 can be improved by the reinforcing plate. strengthen.
  • the reinforcing plate is made of a material with higher rigidity, for example, metal, ceramic, ABS resin, and the like.
  • the camera module and its photosensitive component based on the embodiments of the present application are clarified, which reduces the stress of the molded body on the photosensitive chip by opening a groove on the molded body to prevent The photosensitive chip undergoes excessive deformation due to greater stress, so as to improve the imaging quality of the camera module.
  • FIG. 15 illustrates a schematic diagram of the manufacturing process of the photosensitive component 20 according to an embodiment of the present application, wherein the manufacturing process of the photosensitive component 20 illustrated in FIG. 15 takes the manufacture of the photosensitive component 20 illustrated in FIG. 4 as an example.
  • the manufacturing process first includes: providing a circuit board assembly 210 and electrically connecting at least one electronic component 23 and at least one photosensitive chip 22 to a predetermined position of the circuit board 21 assembly.
  • the circuit board imposition 210 is placed in a forming mold 90, wherein the forming mold 90 includes an upper mold 91 and a lower mold 92 matching it. Specifically, in this example of the present application, the circuit board imposition 210 is placed on the lower mold 92 of the forming mold 90, and the upper mold 91 and the lower mold 92 are combined to make the circuit board The board jigsaw 210 is accommodated in a molding space defined by the upper mold 91 and the lower mold 92.
  • the upper mold 91 includes a mold main body 911, and first and second protrusions 912 and 913 extending downwardly and spaced apart from the mold main body 911, wherein the The cross section of the first protrusion 912 and the second protrusion 913 has a closed ring shape, for example, a "mouth" shape.
  • the first protrusion 912 of the upper mold 91 is attached to the circuit board assembly 210 and the second protrusion 913 of the upper mold 91 is attached to the Mentioned photosensitive chip 22.
  • the position where the first protrusion 912 is attached to the circuit board imposition 210 is provided between the lead 25 and the electronic component 23, and the second protrusion 913 is attached to the The position of the photosensitive chip 22 is set in the non-sensitive area of the photosensitive chip 22, so that a second molding space 915 is formed between the first protrusion 912 and the mold main body 911, and the second protrusion A first molding space 914 is formed between the protrusion 913 and the first protrusion 912. Further, in this example of the present application, a molding channel (shown in the figure) is also provided on the first protrusion 912 for connecting the first molding space 914 and the second molding space 915.
  • the molding material along the preset runner gradually fills the second molding space 915 and then fills the second molding space 915 along the molding channel (not shown in the figure). Mentioned first molding space 914. Furthermore, after curing and molding, the first molding part 241 is formed in the first molding space 914, and the second molding part 242 is formed in the second molding space 915, wherein The first molded part 241 covers at least a part of the circuit board 21 and at least a part of the non-photosensitive area of the photosensitive chip 22, and the second molded part 242 covers at least a part of the at least one electronic component 23 and at least a part of the circuit board 21.
  • the second molded part 242 and the second molded part 242 are connected by the molding channel (not shown in the figure). Furthermore, the slot 240 is formed at a position corresponding to the first protrusion 912, that is, the first molded part 241 and the second molded part 242 are formed to penetrate the molded body 24. The said slot 240.
  • the photosensitive component imposition is obtained, the photosensitive component imposition is cut to obtain a plurality of single photosensitive components 20. Further, assembling the filter element 26 on the photosensitive assembly 20 will obtain the photosensitive assembly 20 as shown in FIG. 4.
  • the manufacturing process is similar to the manufacturing process shown in Figure 4, and those skilled in the art should base on what is shown in Figures 6A and 6B, Figure 7A and Figure 7B, Figure 8A and Figure 8B, Figure 10, Figure 11, Figure 12 and Figure 14.
  • the schematic structural diagram of the photosensitive component 20 can easily infer its manufacturing process, so it will not be repeated here.
  • 16A and 16B illustrate a schematic diagram of the manufacturing process of the photosensitive element 20 according to an embodiment of the present application, wherein the manufacturing process of the photosensitive element 20 shown in FIGS. 16A and 16B is used to manufacture the image shown in FIGS. 9A and 9B
  • the photosensitive component 20A is an example.
  • the molded body 24A in the embodiment of the present application is formed by a compression molding process, wherein the compression molding material 900A includes, but is not limited to, epoxy resin in powder, gel, or granular form. It is not limited by this application.
  • the manufacturing process first includes: providing a circuit board imposition 210A, and electrically connecting at least one electronic component 23A and at least one photosensitive chip 22A to the preset circuit board imposition 210A position. Further, the molding material 900A is applied to the preset position of the circuit board imposition 210A.
  • the circuit board imposition 210A is placed in a forming mold 90A, wherein the forming mold 90A includes an upper mold 91A and a matching lower mold 92A.
  • the circuit board imposition 210A is placed on the lower mold 92A of the forming mold 90A, and the upper mold 91A and the lower mold 92A are clamped to make the circuit
  • the board assembly 210A is accommodated in the molding space defined by the upper mold 91A and the lower mold 92A.
  • the upper mold 91A includes a mold main body 911A and first protrusions 912A spaced apart and extending downward from the mold main body 911A.
  • the cross section of the first protrusions 912A is Closed ring, for example, " ⁇ " type.
  • the first protrusion 912A of the upper mold 91A is attached to the non-photosensitive area of the photosensitive chip 22A to seal the first protrusion 912A
  • At least the photosensitive area of the photosensitive chip 22A forms a first molding space 914A between the first protrusion 912A and the mold main body 911A, wherein the molding material 900A is contained in the first molding space 914A.
  • the first molded portion 241A is formed in the first molding space 914A, wherein the first molded portion 241A covers at least a part of the circuit board 21A And at least a part of the non-photosensitive area of the photosensitive chip 22A.
  • the upper mold 91A is replaced with a second upper mold 91'A, wherein the second upper mold 91'A includes a second mold main body 911'A and extends downward from the second mold main body 911'A The second protrusion 913'A. Furthermore, the molding material 900A is applied to the preset position of the circuit board imposition 210A.
  • the second protrusion 913'A of the second upper mold 91'A is attached to the circuit board assembly 210A, which is more clear .
  • the position attached to the circuit board imposition 210 is set between the lead 25A and the electronic component 23A, so that the second protrusion 913'A and the second mold main body 911'A A second molding space 915'A is formed therebetween, wherein the molding material 900A is contained in the second molding space 915'A.
  • the second molding portion 242A is formed in the second molding space 915'A, wherein the second molding portion 242A covers at least part of the at least An electronic component 23A and at least a part of the circuit board 21A. Furthermore, the slot 240A is formed at a position corresponding to the second protrusion 913A, that is, the first molded portion 241A and the second molded portion 242A are formed to penetrate the molded body 24A. The slot 240A.
  • the photosensitive component imposition is cut to obtain a plurality of single photosensitive components 20A. Further, assembling the filter element 26A on the photosensitive assembly 20A will obtain the photosensitive assembly 20A as shown in FIGS. 9A and 9B.
  • FIG. 17 illustrates a schematic diagram of a manufacturing process of the photosensitive component 20 according to an embodiment of the present application, wherein the manufacturing process of the photosensitive component 20 illustrated in FIG. 17 uses the manufacturing of the photosensitive component 20 in FIG. 13 as an example.
  • the manufacturing process first includes: providing a circuit board imposition 210B, and electrically connecting at least one electronic component 23B and at least one photosensitive chip 22B to a predetermined position of the circuit board imposition 210B.
  • the filter element holder 27B with a channel (not shown in the figure) is arranged on the circuit board assembly 210B. Specifically, the filter element holder 27B is arranged at a position where the filter element 26B is placed on the outside of the photosensitive chip 22B, or in other words, between the lead 25B and the electronic component 23B.
  • the circuit board imposition 210B is placed in a forming mold 90B, wherein the forming mold 90B includes an upper mold 91B and a lower mold 92B matching it.
  • the circuit board assembly 210B is placed on the lower mold 92B of the forming mold 90B, and the upper mold 91B and the lower mold 92B are clamped to make the circuit
  • the board jigsaw 210B is accommodated in a molding space defined by the upper mold 91B and the lower mold 92B.
  • the upper mold 91B includes a mold main body 911B, and first protrusions 912B and second protrusions 913B extending downwardly and spaced apart from the mold main body 911B, wherein the The cross sections of the first protrusion 912B and the second protrusion 913B have a closed ring shape, for example, a "mouth" shape.
  • the first protrusion 912B of the upper mold 91B is attached to the filter element holder 27B and the second protrusion 913B of the upper mold 91B is attached
  • a second molding space 915B is formed between the first protrusion 912B and the mold main body 911B, and between the second protrusion 913B and the first
  • a first molding space 914B is formed between the protrusions 912B, wherein the first molding space 914 and the second molding space 915B are communicated through the channel (not shown in the figure) provided in the filter element holder 27B.
  • the molding material gradually fills the second molding space 915B along the preset runner and then fills the first molding space 914B along the channel. Furthermore, after curing and molding, the first molded portion 241B is formed in the first molding space 914B, the second molded portion 242B is formed in the second molding space 915B, and, in the The second molded part 242B and the second molded part 242B are integrally combined between the filter elements 26B, wherein the first molded part 241B covers at least the circuit board 21B A part and at least a part of the non-photosensitive area of the photosensitive chip 22B, and the second molded part 242B covers at least a part of the at least one electronic component 23B and at least a part of the circuit board 21B.
  • the photosensitive component imposition is obtained, the photosensitive component imposition is cut to obtain a plurality of single photosensitive components 20B. Further, the filter element 26B is assembled on the photosensitive assembly 20B to obtain the photosensitive assembly 20B as shown in FIG. 13.

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Abstract

本申请涉及一种感光组件、摄像模组及其制造方法。该感光组件包括线路板、电连接于所述线路板的感光芯片、设置于所述线路板的至少一电子元器件和一体成型于所述线路板的模塑体。所述模塑体具有凹陷地形成于其中的至少一开槽，所述开槽位于所述感光芯片的外侧。这样，通过在模塑体上设置开槽的方式减少所述模塑体作用于所述感光芯片的应力大小，以有效地减小所述感光芯片因受应力而发生的形变量。

Description

感光组件、摄像模组及其制造方法 技术领域
本申请涉及摄像模组领域，尤其涉及感光组件、摄像模组及其制造方法。
背景技术
为了适配于电子设备小型化和薄型化的发展趋势，摄像模组的尺寸逐渐减小。与之相适应，摄像模组的封装工艺也从传统的COB(Chip on Board)工艺逐渐演变至模塑工艺。
图1图示了现有的基于模塑工艺制备的摄像模组的结构示意图。如图1所示，该摄像模组通过MOC(Molding on Chip)模塑工艺制备而成，其包括感光组件和保持于该感光组件的感光路径的光学镜头1P。该感光组件包括线路板2P、感光芯片3P和模塑体4P，其中，该模塑体4P一体成型于该线路板2P，以一体包覆所述线路板2P的至少一部分和该感光芯片3P的非感光区域的至少一部分。然而，模塑封装工艺也引发了一些新的技术问题，例如感光芯片因受应力过大而发生变形导致成像质量变差等。
因此，需要一种改进的模塑封装工艺和摄像模组的结构方案。
发明内容
本申请的主要目的在于提供一种感光组件、摄像模组及其制造方法，其能够有效地减小所述感光芯片因受应力而产生的弯曲量，以改善摄像模塑的成像质量。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，通过在模塑体上设置开槽的方式减少所述模塑体作用于所述感光芯片的应力大小，以有效地减小所述感光芯片因受应力而发生的形变量。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述开槽凹陷地形成于所述模塑体并且所述开槽的形成位置位于所述感 光芯片的外侧，通过这样的方式，切断所述模塑体与所述感光芯片所形成的应力传递链，或者，降低所述模塑体与所述感光芯片所形成的应力传递链上所传递的应力大小。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述开槽将所述模塑体分成第一模塑部分和第二模塑部分，这样相较于现有的模塑工艺，包覆于感光芯片的模塑部分的体积会减小，以使得在相同收缩率下，包覆于感光芯片模塑部分的收缩量会减小。因此，该模塑部分所产生的应力也相应减小，以减小所述感光芯片的弯曲量。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述开槽的设置增大了所述模塑体的整体暴露面面积，以使得模塑体所产生的应力能够相对更多地分布到所述模塑体的外表面，以相对地减小所述模塑体作用于所述感光芯片的应力大小。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述开槽的设置增大了所述模塑体的整体暴露面面积，有利于提高所述感光组件的散热性能。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述开槽提供了一散热通道，所述感光组件工作时产生的热量能够通过所述散热通道散发。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，所述开槽可为在光学镜头贴装于所述感光组件和/或滤光元件贴装于模塑体或滤光元件支架时提供溢胶空间，以收容溢出的胶水。
本申请的另一目的在于提供一种摄像模组和感光组件及其制造方法，其中，在本申请一实施例中，滤光元件支架预设于所述线路板并在模塑成型后一体结合于所述模塑体的第一模塑部分和第二模塑部分，其中，所述滤光元件支架不仅能够用于安装滤光元件，还能够防止第二模塑部分所产生的应力传递到感光芯片，以及，保持第一模塑部分的形状，以确保第一模塑部分所产生的内部应力不足以过量地改变所述感光芯片的形状。
通过下面的描述，本申请的其它优势和特征将会变得显而易见，并可以 通过权利要求书中特别指出的手段和组合得到实现。
为实现上述至少一目的或优势，本申请提供一种感光组件，其包括：
线路板；
电连接于所述线路板的感光芯片；
设置于所述线路板的至少一电子元器件；以及
一体成型于所述线路板的模塑体，其中，所述模塑体具有凹陷地形成于其中的至少一开槽，所述开槽位于所述感光芯片的外侧.
在根据本申请的感光组件中，所述模塑体包括由所述开槽分成的第一模塑部分和第二模塑部分，所述第一模塑部分包覆线路板的至少一部分和所述感光芯片的非感光区域的至少一部分。
在根据本申请的感光组件中，所述开槽的深度大于或等于所述模塑体高度的30％。
在根据本申请的感光组件中，所述开槽贯穿地形成于所述模塑体，以暴露所述线路板的对应区域。
在根据本申请的感光组件中，所述第一模塑部分和所述第二模塑部分通过模塑通道相连。
在根据本申请的感光组件中，所述至少一开槽包括第一开槽和第二开槽，所述第一开槽和所述第二开槽相对于所述感光芯片的中心线对称布置，其中，所述模塑通道在模塑过程中形成于所述第一开槽和所述第二开槽之间。
在根据本申请的感光组件中，所述开槽为环绕所述第一模塑部分的封闭环槽，以将所述模塑体分成相互独立的所述第一模塑部分和所述第二模塑部分。
在根据本申请的感光组件中，所述第一模塑部分和所述第二模塑部分通过两次模塑工艺形成。
在根据本申请的感光组件中，所述感光组件进一步包括设置于所述开槽内的滤光元件支架，其中，所述滤光元件支架被配置为安装滤光元件于其上。
在根据本申请的感光组件中，所述感光组件进一步包括设置于所述开槽的滤光元件支架，其中，所述滤光元件支架被配置为安装滤光元件于其上。
在根据本申请的感光组件中，所述滤光元件支架具有贯穿于其中的通道，其中，所述滤光元件支架预设于所述线路板并在所述模塑体一体成型后一体结合于所述模塑体的所述第一模塑部分和所述第二模塑部分。
在根据本申请的感光组件中，所述感光组件进一步包括包裹感光芯片侧部的侧包胶。
在根据本申请的感光组件中，所述侧包胶包覆用于电连接感光芯片和线路板的引线的至少一部分。
根据本申请的另一方面，本申请还提供一种摄像模组，其包括：
光学镜头；以及
如上所述的感光组件，其中，所述光学镜头被保持于所述感光组件的感光路径。
根据本申请的又一方面，本申请还提供一种感光组件的制造方法，其包括步骤：
提供一线路板，其中，至少一电子元器件和至少一感光芯片电连接于所述线路板；
将所述线路板收容于由成型模具的上模具和下模具合模时形成的成型空间中，其中，所述成型模具包括凸起；
在所述成型空间内形成模塑体；以及
分离所述成型模具的上模具和下模具，以在所述凸起对应的位置形成凹陷于所述模塑体的开槽。
在根据本申请的感光组件的制造方法中，形成所述模塑体的过程，包括：
将所述线路板放置于所述成型模具的下模具中；
将所述成型模具的上模具和下模具合模，其中，所述上模具包括模具主体和自所述模具主体相间隔地且向下延伸的第一凸起和第二凸起，其中，当所述上模具和所述下模具合模时，所述上模具的第一凸起贴合于所述线路板，以及，所述上模具的第二凸起贴合于所述感光芯片的非感光区域，以在所述第一凸起和所述模具主体之间形成第二成型空间，以及，在所述第二凸起和所述第一凸起之间形成第一成型空间，其中，所述第一凸起还具有连通所述 第一成型空间和所述第二成型空间的模塑通道；
填充模塑成型材料至所述第一成型空间、所述第二成型空间，以在所述模塑成型材料固化成型后，在所述第一成型空间内形成第一模塑部分，以及，在所述第二成型空间内形成第二模塑部分，并且，所述第二模塑部分和所述第二模塑部分通过所述模塑通道相连；以及
分离所述上模具和所述下模具，以在所述第一凸起对应的位置形成所述开槽。
在根据本申请的感光组件的制造方法中，形成所述模塑体的过程，包括:
在所述线路板上施加模压成型材料；
将所述线路板放置于所述成型模具的下模具中；
将所述成型模具的上模具和下模具合模，其中，所述上模具包括模具主体和自所述模具主体相间隔地且向下延伸的第一凸起，其中，当所述上模具和所述下模具合模时，所述上模具的第一凸起贴合于所述线路板，以在所述第一凸起和所述模具主体之间形成第一成型空间，其中，所述模压成型材料位于所述第一成型空间内；
通过模压工艺在所述第一成型空间内形成第一模塑部分；
分离所述上模具和所述下模具；
在所述线路板上施加模压成型材料；
将所述成型模具的下模具和第二上模具合模，其中，所述第二上模具包括第二模具主体和自所述第二模具主体相间隔地且向下延伸的第二凸起，其中，当所述第二上模具和所述下模具合模时，所述第二上模具的第二凸起贴合于所述线路板，以在所述第二凸起和所述第二模具主体之间形成第二成型空间，其中，所述模压成型材料位于所述第二成型空间内；
通过模压工艺在所述第二成型空间内形成第二模塑部分；
分离所述上模具和所述下模具，以在所述第二凸起的对应位置形成凹陷于所述模塑体的所述开槽。
在根据本申请的感光组件的制造方法中，在形成所述模塑体之前，所述方法进一步包括：
在所述线路板上预设至少一滤光元件支架，所述滤光元件支架具有贯穿于其中的通道，以在所述模塑体一体成型后一体结合所述滤光元件支架于所述模塑体的所述第一模塑部分和所述第二模塑部分。
在根据本申请的感光组件的制造方法中，所述线路板被实施为线路板拼版.
根据本申请另一方面，本申请还提供一种摄像模组的制造方法，包括：
根据如上所述的感光组件的制造方法，形成一模塑体，其中，所述模塑体具有凹陷地形成于其中的开槽，其中，所述开槽将所述模塑体分成第一模塑部分和第二模塑部分；以及
将光学镜头安装于所述模塑体的第二模塑部分。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了现有的基于模塑工艺制备的摄像模组的结构示意图。
图2图示了现有的基于模塑工艺制备的感光组件中感光芯片因受应力而发生形变的示意图。
图3图示了根据本申请实施例的摄像模组的示意图。
图4图示了根据本申请实施例的所述摄像模组的感光组件的示意图。
图5图示了根据本申请实施例的所述感光组件的另一示意图。
图6A和图6B图示了根据本申请实施例的所述感光组件的一变形实施的示意图。
图7A和图7B图示了根据本申请实施例的所述感光组件的一变形实施的示意图。
图8A和图8B图示了根据本申请实施例的所述感光组件的一变形实施的示意图。
图9A和图9B图示了根据本申请另一实施例的感光组件的示意图。
图10图示根据本申请实施例的所述感光组件的又一变形实施的示意图。
图11图示根据本申请实施例的所述感光组件的又一变形实施的示意图。
图12图示了根据本申请实施例的所述感光组件的又一变形实施的示意图。
图13图示了根据本申请又一实施例的感光组件的示意图。
图14图示了根据本申请实施例的又一变形实施的示意图。
图15图示了根据本申请实施例的感光组件制造过程的示意图。
图16A和图16B图示了根据本申请另一实施例的感光组件制造过程的示意图。
图17图示了根据本申请又一实施例的感光组件制造过程的示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如上所述，虽然通过诸如MOC(Molding on Chip)之类的模塑工艺能够将摄像模组做得尺寸更小。然而，模塑封装工艺也引发了一些新的技术问题。
具体来说，在模塑摄像模组中，线路板2P和模塑体4P的结合与模塑体4P和感光芯片3P的结合属于刚性结合，两者的结合强度较高，需要通过破坏性方法才能拆除。相对地，感光芯片3P与线路板2P之间通过胶水结合，属于柔性结合。并且，线路板2P、模塑体4P和感光芯片3P的热膨胀系数不同。本领域技术人员应知晓，模塑工艺中环境温度变化较大(模塑 材料成型需要将温度提高到150度以上)且变换频次较多，造成了感光芯片3P、线路板2P和模塑体4P发生不同程度的涨缩。并且，线路板2P、模塑体4P和感光芯片3P的涨缩速度也是不一致的，这些现象导致最终感光芯片3P的收缩量最小。
由于线路板2P与模塑体4P的结合、模塑体4P和感光芯片3P的结合属于刚性结合，那么就会在线路板2P和模塑体4P之间，以及，感光芯片3P和模塑体4P之间产生应力。并且，由于感光芯片3P的收缩程度最小，应力就会集中地作用于感光芯片3P上，导致感光芯片3P发生较大的形变，其形变效果如图2所示。值得一提的是，如图2所示意的变形效果较为夸张，仅为了显示形变的方向和特征，并不代表具体的形变尺寸。弯曲后的感光芯片3P对成像质量会造成较大影响，体现在摄像模组的性能上为：摄像模组场曲过大，所拍摄图像的中心效果正常但边缘效果较差。
同时，通过模塑工艺所形成的成像组件还具有散热性能差等缺陷。
针对上述技术问题，本申请的基本构思是通过在模塑体上设置开槽的方式减少所述模塑体作用于所述感光芯片的应力大小，以有效地减小所述感光芯片因受应力而发生的形变量。
基于此，本申请提出了一种感光组件，其包括：线路板、电连接于所述线路板的感光芯片、设置于所述线路板的至少一电子元器件，以及，一体成型于所述线路板的模塑体，其中，所述模塑体具有凹陷地形成于其中的至少一开槽，所述开槽位于所述感光芯片的外侧。这样，通过在模塑体上设置开槽的方式减少所述模塑体作用于所述感光芯片的应力大小，以有效地减小所述感光芯片因受应力而发生的形变量。
在介绍本申请的基本原理之后，下面将参考附图来具体介绍本申请的各种非限制性实施例。
示例性摄像模组
如图3-图5所示，说明了基于本申请实施例的摄像模组，其中，所述摄像模组包括光学镜头10和感光组件20，所述光学镜头10保持于所述感光组件20的感光路径，以使得藉由所述光学镜头10所采集的光线能够沿着 该感光路径在所述感光组件20中成像。应注意到，如图3所示的所述摄像模组为定焦摄像模组，当然，本领域技术人员应知晓，本申请所涉及的所述摄像模组还可被实施为动焦摄像模组，即，所述摄像模组还包括设于所述光学镜头10和所述感光组件20之间的驱动元件(例如，马达)，以通过所述驱动元件承载着所述光学镜头10沿着所述感光路径移动，以改变所述光学镜头10和所述感光组件20之间的距离。
如图4所示，在本申请实施例中，所述感光组件20包括线路板21、感光芯片22、至少一电子元器件23和模塑体24。所述感光芯片22电连接于所述线路板21。所述至少一电子元器件23设于所述感光芯片22的周围且电连接于所述线路板21。所述模塑体24通过模塑工艺一体成型于所述线路板21，以包覆所述线路板21的至少一部分。特别地，在本申请实施例中，所述模塑体24设有凹陷地形成于其中的开槽240，以通过所述开槽240减少所述模塑体24作用于所述感光芯片22的应力大小，从而有效地减小所述感光芯片22因受应力而发生的形变量。
具体来说，在本申请实施例中，所述至少一电子元器件23可通过表面贴装工艺(Surface Mounting Technology)贴装于所述线路板21的上表面。通常，所述至少一电子元器件23贴装于所述感光芯片22的周围区域。或者，所述至少一电子元器件23还可以预埋于所述线路板21，以降低所述至少一电子元器件23突出于所述线路板21的高度。应可以理解，对于所述至少一电子元器件23的安装工艺，并不为本申请所局限。同时，在本申请实施例中，所述至少一电子元器件23的类型并不为本申请所局限，其包括但不限于电容、电感、三极管、晶闸管、电阻等。
如图4所示，在本申请实施例中，所述感光芯片22和所述线路板21之间的电气连接通过引线25实现。具体来说，在本申请实施例中，每一所述引线25弯曲地延伸于所述感光芯片22和所述线路板21之间，以通过所述引线25将所述感光芯片22电连接于所述线路板21，从而，所述线路板21可基于所述引线25对所述感光芯片22进行供电，以及，所述感光芯片22可基于所述引线25将所采集到的信号传输出去。值得一提的是，所述引 线25的类型并不为本申请所局限，例如，所述引线25可以是金线、银线、铜线。并且，所述引线25可通过“打金线”的工艺安装于所述线路板21和所述感光芯片22之间，以用于实现两者之间的电连接。
具体来说，“打金线”工艺一般分为两种类型：“正打金线”工艺和“反打金线”工艺。“正打金线”工艺指的是在布设所述引线25的过程中，首先在所述线路板21的导电端上形成所述引线25的一端，进而弯曲地延伸所述引线25，并最终在所述感光芯片22的导电端上形成所述引线25的另一端，通过这样的方式，在所述感光芯片22和所述线路板21之间形成所述引线25。“反打金线”工艺指的是在布设所述引线25的过程中，首先在所述感光芯片22的导电端上形成所述引线25的一端，进而弯曲地延伸所述引线25，并最终在所述线路板21的导电端上形成所述引线25的另一端，通过这样的方式，在所述感光芯片22和所述线路板21之间形成所述引线25。值得一提的是，通过“反打金线”工艺所形成的所述引线25向上突起的高度相对“正打金线”工艺所形成的所述引线25向上突起的高度，因此，优选地，在该具体实施中，采用“反打金线”工艺形成所述引线25。
当然，本领域的技术人员应知晓，在本申请的其他示例中，所述感光芯片22和所述线路板21可通过其他方式进行导通，例如采用背部导通的方式。对此，并不为本申请所局限。
如图4所示，在本申请实施例中，所述模塑体24一体成型于所述线路板21，以一体包覆所述线路板21的至少一部分、所述感光芯片22的非感光区域的至少一部分和至少部分所述至少一电子元器件23。特别地，在本申请实施例中，所述模塑体24具有凹陷地形成于其中的至少一开槽240。从布设的位置来看，所述开槽240位于所述感光芯片22的外侧，通过这样的位置设定，所述开槽240能够有效地减少所述模塑体24作用于所述感光芯片22的应力，以有效地减小所述感光芯片22因受应力而发生的形变量。
具体来说，由于所述线路板21和所述模塑体24的结合，以及，所述模塑体24和所述感光芯片22的结合属于刚性结合，而所述感光芯片22与所述线路板21之间的结合属于柔性结合，并且，所述线路板21、所述模 塑体24和所述感光芯片22的热膨胀系数不同，导致会在所述线路板21和所述模塑体24之间以及所述感光芯片22和所述模塑体24之间产生应力。并且，由于所述感光芯片22的收缩程度最小，应力就会集中地作用于感光芯片22上。相应地，通过在所述感光芯片22的外侧(或者说，在所述感光芯片22和所述模塑体24之间)设置纵向的所述开槽240，能够减少所述模塑体24和所述感光芯片22之间的应力传递量。直观地讲，如图4所示，通过在所述模塑体24上设置纵向的开槽240，所述模塑体24中用于传递应力的模塑部分的厚度尺寸得以缩减，以降低所述模塑体24作用于所述感光芯片22的应力大小。
从应力传递路径的角度来看，设置于所述感光芯片22和所述模塑体24之间的所述开槽240相当于在所述模塑体24和所述感光芯片22的应力传递链上“切了一刀”，以破坏所述应力传递链。更具体地，所述开槽240的形成位置可设于所述电子元器件23和所述引线25之间，或者，所述电子元器件23和所述电子元器件23之间，或者，所述电子元器件23的外侧，对此，并不为本申请所局限。优选地，在本申请实施例中，所述开槽240的形成位置设置于所述电子元器件23和所述引线25之间。
应可以理解，所述开槽240降低所述模塑体24作用于所述感光芯片22的应力的能力与所述开槽240的深度相关。具体来说，随着所述开槽240深度的加深，所述开槽240降低所述模塑体24作用于所述感光芯片22的应力的能力越强。特别地，在本申请的一些示例中，所述开槽240的深度大于或等于所述模塑体24高度的30％，如图6A和图6B所示。这里，所述模塑体24的高度表示在所述开槽240设置位置所述模塑体24的高度，其中，应可以理解由于所述模塑体24的形状配置所述模塑体24在不同位置处的高度可能会产生差异。优选地，所述开槽240的深度大于或等于所述模塑体24高度的一半。
更优选地，在本申请实施例中，所述开槽240的深度等于所述模塑体24的高度。也就是说，优选地，所述开槽240为贯穿地形成于所述模塑体24的通槽，以暴露所述线路板21的相应区域。应可以理解，当所述开槽240 为贯穿于所述模塑体24的通槽时，所述模塑体24与所述感光芯片22之间的应力传递链被所述开槽240完全地切断，以使得模塑体24作用于所述感光芯片22的应力最大程度地减小。值得一提的是，在本申请实施例中，所述开槽240的宽度在不过多地破坏所述模塑体24整体结构强度的前提下，也可以尽可能地增大，以增强所述开槽240减低所述模塑体24作用于所述感光芯片22的应力的能力。
如图3-5所示，当所述开槽240形成于所述模塑体24时，以所述开槽240为分界，所述模塑体24被分为第一模塑部分241和第二模塑部分242，其中，所述第一模塑部分241包覆线路板21的至少一部分和所述感光芯片22的非感光区域的至少一部分，以及，所述第二模塑部分242包覆至少部分所述至少一电子元器件23和所述线路板21的至少一部分。
值得一提的是，在本申请实施例中，由于所述开槽240将所述模塑体24分成第一模塑部分241和第二模塑部分242，这样相较于现有的模塑工艺，包覆于感光芯片22的模塑部分的体积会减小，以使得在相同收缩率下，包覆于感光芯片22模塑部分的收缩量会减小，从而该模塑部分所产生的应力也相应减小，以减小所述感光芯片22的弯曲量。特别地，在本申请实施例中，所述第一模塑部分241的体积可以小于所述第二模塑部分242，以降低所述模塑体24作用于所述感光芯片22的应力。
特别地，如图5所示，在本申请实施例中，所述模塑体24的所述第一模塑部分241和所述第二模塑部分242通过模塑通道243相连。具体来说，如图5所示，在本申请实施例中，所述至少一开槽240包括第一开槽2401和第二开槽2402，其中，所述第一开槽2401和所述第二开槽2402分别贯穿地形成于所述模塑体24。特别地，所述第一开槽2401和所述第二开槽2402环绕所述第一模塑部分241且在所述模塑通道243处接合。也就是说，在本申请实施例中，所述模塑通道243形成于所述第一开槽2401和所述第二开槽2402之间，以在所述模塑体24模塑成型后，通过所述第一开槽2401和所述第二开槽2402将所述模塑体24划分为所述第一模塑部分241和所述第二模塑部分242，并且，所述第一模塑部分241和所述第二模塑部分 242通过所述模塑通道243相连。优选地，在本申请实施例中，所述第一开槽2401和所述第二开槽2402相对于所述感光芯片22的中心线对称布置，并且，所述第一开槽2401和所述第二开槽2402具有
Figure PCTCN2020099937-appb-000001
字型。当然，在本申请实施例的其他示例中，所述第一开槽2401和所述第二开槽2402也可以采用非对称的方式进行布置，或者，当所述第一开槽2401和所述第二开槽2402以对称的方式进行布置时，所述第一开槽2401和所述第二开槽2402可实施为其他形状，例如“I”字形，对此并不为本申请所局限。
值得一提的是，在本申请的其他示例中，所述至少一开槽240还可以包括更多数量的开槽240(例如，还包括第三开槽2403)或者仅包括环绕所述第一模塑部分241的第一开槽2401，对此，并不为本申请所局限。
图7A和图7B图示了根据本申请实施例的所述感光组件20的一变形实施的示意图。如图7A和图7B所示，在该变形实施例中，所述模塑体24的所述第一模塑部分241和所述第二模塑部分242通过模塑通道243相连。特别地，在本该变形实施例中，所述模塑通道243的高度低于所述第一模塑部分241和所述第二模塑部分242，以在所述模塑通道243、所述第一模塑部分241和第二模塑部分242之间形成第三开槽2403。也就是说，在该变形实施例中，所述开槽240不仅包括贯穿于所述模塑体24的第一开槽2401和第二开槽2402，还包括由所述模塑体24通道与所述第一模塑部分241和第二模塑部分242形成第三开槽2403。应可以理解，图7A和图7B所示意的所述模塑体24的所述第一模塑部分241和第二模塑部分242能够通过一次模塑工艺形成，其中，所述模塑通道243的设置正是为了实现这一工艺目的。
图8A和图8B图示了根据本申请实施例的所述感光组件20的一变形实施的示意图。如图8A和图8B所示，在该变形实施例中，在该变形实施例中，所述模塑体24的所述第一模塑部分241和所述第二模塑部分242通过模塑通道243相连。特别地，在该变形实施例中，所述模塑体24仅包括一个模塑通道243，并且，所述模塑通道243的高度可低于或者等于所述第一模塑部分241和所述第二模塑部分242。如图8B所示，在本申请实施例中， 所述开槽240具有
Figure PCTCN2020099937-appb-000002
字型。应可以理解，图8A和图8B所示意的所述模塑体24的所述第一模塑部分241和第二模塑部分242能够通过一次模塑工艺形成，其中，所述模塑通道243的设置正是为了实现这一工艺目的。
图9A和图9B图示了根据本申请另一实施例的感光组件20的示意图。如图9A和9B所示，相较于图4所示意图的所述感光组件20，在本申请实施例中，所述开槽240A为完全地环绕所述第一模塑部分241A的封闭环槽。也就是说，在本申请实施例中，所述模塑体24A的所述第一模塑部分241A和所述第二模塑部分242A被所述开槽240A划分为相互独立的两个模塑部分。也就是说，在本申请实施例中，所述开槽240A能够完全隔断所述第一模塑部分241A和所述第二模塑部分242A的连接，使得所述第二模塑部分242A产生的应力不会传递到所述第一模塑部分241A上，进而也不会传递到所述感光芯片22A上。特别地，在本申请实施例中，所述第一模塑部分241A和所述第二模塑部分242通过两次模塑工艺形成。也就是说，在本申请实施例中，所述第一模塑部分241A和所述第二模塑部分242A单独分批次成型，而图4所示意的所述模塑体24可通过一次模塑工艺成型。关于这部分内容，会在后续感光组件20A的制备工艺中进行更为具体地介绍，在此先略过。
为了防止在执行模塑工艺的过程中所述感光芯片22被注入的模塑成型材料所冲击而造成位置上的偏移，在本申请实施例的一些示例中，所述感光组件20还包括包裹所述感光芯片22侧部和所述引线25的至少一部分的侧包胶28，用于防止在执行模塑工艺过程中所述感光芯片22的位置发生偏移，其效果如图10所示。应可以理解，所述侧包胶28不仅能够防止所述感光芯片22的位置发生偏移，还能够有效地较少所述模塑体24所产生的应力传递至所述感光芯片22，同时，还能够防止引线25被模塑成型材料冲击而倒塌。
进一步地，如图4所示，在本申请实施例中，所述感光组件20还包括保持于所述感光芯片22的感光路径的滤光元件26，其中，所述滤光元件26对应于所述感光芯片22的至少感光区域，用于对进入所述感光芯片22的光线进行过滤，以改善成像品质。特别地，在本申请实施例中，所述滤光元 件26贴装于所述模塑体24的所述第一模塑部分241，以保持于所述感光芯片22的感光路径。值得一提的是，当所述开槽240设于电子元器件23和引线25之间时，所述开槽240邻近于所述第一模塑部分241，以使得在贴装所述滤光元件26于所述第一模塑部分241时，溢出的胶水可被收容于所述开槽240，以防止多余的胶水污染其他部件(尤其是所述感光芯片22)。也就是说，在本申请实施例中，所述开槽240还起着溢胶槽的功能。应可以理解，为了更好地引导胶水的流动，在本申请实施例的一些示例中，还可以进一步在所述第一模塑部分241的上表面上凹陷地形成一连通于所述开槽240的导流槽，用于引导多余的胶水流向所述开槽240。
在本申请实施例的一些示例中，如图11所示，所述第一模塑部分241还包括凹陷地形成于所述第一模塑部分241的上表面的安装平台260，所述安装平台260被配置为安装所述滤光元件26于其上。应可以理解，相较于将所述滤光元件26直接贴装于所述第一模塑部分241的上表面，将所述滤光元件26安装于所述安装平台260有利于缩减所述滤光元件26的尺寸，以降低所述滤光元件26的成本。并且，这样的安装方式，还可以缩短所述滤光元件26与所述感光芯片22的距离，以使得所述感光组件20的整体厚度尺寸得以减小。值得一提的是，在本申请实施例中，所述第一模塑部分241的内侧面可垂直于所述感光芯片22或者倾斜于所述感光芯片22，其中，不同方式设置的内侧面对应于成型模具90的不同凸起的参数配置，对此，并不为本申请所局限。
本领域的技术人员应知晓，在本申请实施例中，所述滤光元件26能够被实施为不同的类型，包括但不限于所述滤光元件26能够被实施为红外截止滤光片、全透光谱滤光片以及其他的滤光片或者多个滤光片的组合。具体来说，例如，当所述滤光元件26被实施为红外截止滤光片和全透光谱滤光片的组合，即，所述红外截止滤光片和所述全透光谱滤片能够被切换以选择性地位于所述感光芯片22的感光路径上，这样，在白天等光线较为充足的环境下使用时，可以将所述红外截止滤光片切换至所述感光芯片22的感光路径，以通过所述红外截止滤光片过滤进入所述感光芯片22的被物体反射 的光线中的红外线，并且，当夜晚等光线较暗的环境中使用时，可以将所述全透光谱滤光片切换至所述感光芯片22的感光路径，以允许进入所述感光芯片22的被物体反射的光线中的红外线部分透光。
图12图示了根据本申请实施例的所述感光组件20的又一变形实施的示意图。如图12所示，在该变形实施例中，所述感光组件20还包括一滤光元件支架27，其中，所述滤光元件支架27设置于所述开槽240并被配置为安装所述滤光元件26于其上。具体来说，在该变形实施例中，所述滤光元件支架27包括支架主体和自所述支架主体向内延伸的支撑臂，其中，所述支撑臂形成对应于所述感光芯片22的至少感光区域的通孔。相应地，当所述滤光元件26安装于所述支撑臂时，所述滤光元件26遮盖住所述通孔以使得在光线藉由所述通孔抵达感光芯片22之前被所述滤光元件26所过滤，以提高成像质量。应可以理解，通过所述滤光元件支架27的所述支撑臂，所述滤光元件26的尺寸可进一步地得以降低，以使得所述滤光元件26的成本进一步得以降低。值得一提的是，在本申请实施例的其他示例中，所述滤光元件26还能够以其他方式被保持于所述感光芯片22的感光路径，例如，所述滤光元件26可直接叠置于所述感光芯片22并参与到模塑工艺中，以使得模塑成型后的所述模塑体24的第一模塑部分241包覆所述滤光元件26的一部分和线路板21的至少一部分。再如，所述滤光元件26还可以被支持于所述光学镜头10内，或者，以镀膜的形式形成于所述光学镜头10中透镜的表面。对此，并不为本申请所局限。
图13图示了根据本申请又一实施例的感光组件20的示意图。如图13所示，在本申请实施例中，所述滤光元件支架27B在一体结合于所述模塑体24B的第一模塑部分241B和第二模塑部分242B之间。具体来说，在本申请实施例中，在执行模塑工艺之前，所述滤光元件支架27B被设置于所述线路板21B，并且，所述滤光元件支架27B具有贯穿于其中的通道(图中未示意)，其中，所述通道被配置为允许模塑成型材料流过。具体来说，所述通道可以设置于所述滤光元件支架27B的底部，或者贯穿地形成于所述滤光元件支架27B的侧壁。相应地，在模塑成型材料注入成型模具90B并形成所述模塑体 24B后，所述滤光元件支架27B一体结合于所述模塑体24B的第一模塑部分241B和第二模塑部分242B之间。关于所述滤光元件26B如何结合于所述第一模塑部分241B和所述第二模塑部分242B之间，以及，所述模塑体24B如何模塑成型会在后续关于所述感光组件20B的制造过程中进一步介绍，在此不详细展开。
优选地，在本申请该实施例中，所述滤光元件支架27B由刚性较强的材料制成(例如，金属、PMMA、陶瓷、ABS树脂等等)，以使得所述滤光元件支架27B具有较高的结构强度。应可以观察到，在所述模塑体24B一体成型后，所述滤光元件支架27B的内侧面包裹地结合于所述第一模塑部分241B，所述滤光元件26B的外侧面一体结合于所述第二模塑部分242B，这样，所述滤光元件支架27B能够起到保持所述第一模塑部分241B的形状的作用，从而确保第一模塑部分241B所产生的内部应力不足以过量地改变所述感光芯片22B的形状。并且，由于所述滤光元件支架27B设置于所述第一模塑部分241B和所述第二模塑部分242B之间，因此所述第二模塑部分242B所产生的应力能够被所述滤光元件支架27B所隔断，以使得所述第二模塑部分242B所产生的应力无法影响到位于所述滤光元件支架27B内侧的所述感光芯片22B。
也就是说，在本申请实施例中，一体结合于所述模塑体24B的第一模塑部分241B和第二模塑部分242B的所述滤光元件支架27B，不仅能够用于安装滤光元件26B于其上，还能够防止第二模塑部分242B所产生的应力影响到感光芯片22B，以及，保持第一模塑部分241B的形状以确保第一模塑部分241B所产生的内部应力不足以过量地改变所述感光芯片22B的形状。
值得一提的是，如图3-图13所示，所述开槽240的设置不仅能够减少所述模塑体24作用于所述感光芯片22的应力，而且，其还增大了所述模塑体24的整体暴露面面积，以使得模塑体24所产生的应力能够相对更多地分布到所述模塑体24的外表面，以相对地减小所述模塑体24作用于所述感光芯片22的应力大小。应可以理解，所述开槽240的设置增大了所述模塑体24的整体暴露面面积，并且，所述开槽240提供了一散热通道，以 使得所述感光组件20工作时产生的热量能够通过所述散热通道散发，有利于提高所述感光组件20的散热性能。还值得一提的是，在本申请实施例中，出于考虑到所述模塑体24的应力影响，在所述模塑体上开设具有一定深度的所述开槽240，而随着所述开槽240深度的加深所述散热通道的散热面积也在不断增大，从而可加强所述感光组件20的散热性能。特别地，如前所述，在本申请实施例中，所述开槽240的深度大于或等于所述模塑体24高度的30％。
还值得一提的是，本申请实施例的所述模塑体24还可以通过模压工艺进行成型，其中模压成型材料包括但不限于粉末状、胶状的环氧树脂等，对此，并不为本申请所局限。
图14图示了根据本申请实施例的所述感光组件20的另一变形实施例。如图14所示，在该变形实施例中，所述感光组件20进一步包括设置于所述线路板21的下表面的加强板，以通过所述加强板对所述线路板21的结构强度进行加强。其原因在于，当在所述模塑体24上开设所述开槽240时，所述线路板21的部分区域(暴露区域)的结构强度被削弱，通过所述加强板能防止所述线路板21发生变形或者甚至被折断。优选地，所述加强板由刚度较高的材料制成，例如，金属、陶瓷、ABS树脂等等。
综上，基于本申请实施例的摄像模组及其感光组件被阐明，其通过在模塑体上开设开槽的方式减小所述模塑体作用于所述感光芯片的应力大小，以防止所述感光芯片因受较大应力而发生过量形变，以提高所述摄像模组的成像质量。
示意性感光组件制造过程
图15图示了根据本申请实施例的感光组件20制造过程的示意图，其中，图15中所示意的所述感光组件20制造过程以制造如图4中所示意所述感光组件20为示例。
如图15所示，所述制造过程，首先包括：提供一线路板拼版210，并将至少一电子元器件23和至少一感光芯片22电连接于所述线路板21拼 板的预设位置。
进一步地，将所述线路板拼版210放置于成型模具90中，其中，所述成型模具90包括上模具91和与之匹配的下模具92。具体来说，在本申请该示例中，所述线路板拼版210被放置于所述成型模具90的下模具92，进而所述上模具91与所述下模具92合模，以使得所述线路板拼版210被收容于由所述上模具91和下模具92所界定的成型空间中。
特别地，在本申请实施例中，所述上模具91包括模具主体911和自所述模具主体911相间隔地且向下延伸的第一凸起912和第二凸起913，其中，所述第一凸起912和第二凸起913的横截面具有封闭环形，例如，“口”字型。当所述上模具91和下模具92合模时，所述上模具91的第一凸起912贴合于所述线路板拼版210且所述上模具91的第二凸起913贴合于所述感光芯片22。具体来说，所述第一凸起912贴合于所述线路板拼版210的位置设于所述引线25和所述电子元器件23之间，所述第二凸起913贴合于所述感光芯片22的位置设于所述感光芯片22的非感光区域，这样，在所述第一凸起912和所述模具主体911之间形成第二成型空间915，以及，在所述第二凸起913和所述第一凸起912之间形成第一成型空间914。进一步地，在本申请该示例中，所述第一凸起912上还设有模塑通道(图中为示意)，用于连通所述第一成型空间914和第二成型空间915。
这样，当模塑成型材料注入所述成型空间后，沿着预设流道所述模塑成型材料逐渐充满第二成型空间915并沿着所述模塑通道(图中未示意)继而充满所述第一成型空间914。进而，在固化成型后，在所述第一成型空间914内形成所述第一模塑部分241，以及，在所述第二成型空间915内形成所述第二模塑部分242，其中，所述第一模塑部分241包覆线路板21的至少一部分和所述感光芯片22的非感光区域的至少一部分，以及，所述第二模塑部分242包覆至少部分所述至少一电子元器件23和所述线路板21的至少一部分。并且，所述第二模塑部分242和所述第二模塑部分242通过所述模塑通道(图中未示意)相连。进而，在所述第一凸起912对应的位置形成所述开槽240，即，在所述第一模塑部分241和所述第二模塑部分 242形成贯设于所述模塑体24的所述开槽240。
在得到感光组件拼版后，对所述感光组件拼版进行切割，以得到多个单体的所述感光组件20。进一步地，在所述感光组件20上组装滤光元件26便得到如图4所示意的所述感光组件20。
值得一提的是，在本申请实施例中，图6A和图6B、图7A和图7B、图8A和图8B、图10、图11、图12和图14所示意的所述感光组件20的制造过程与图4所示意的制造过程相类似，本领域技术人员应基于图6A和图6B、图7A和图7B、图8A和图8B、图10、图11、图12和图14所示意的所述感光组件20的结构示意图轻易地推知其制造过程，故在此不再赘述。
图16A和图16B图示了根据本申请实施例的感光组件20制造过程的示意图，其中，图16A和图16B中所示意的所述感光组件20制造过程以制造图9A和图9B中所示意的所述感光组件20A为示例。值得一提的是，本申请实施例的所述模塑体24A通过模压工艺进行成型，其中模压成型材料900A包括但不限于粉末状、胶状或颗粒状的的环氧树脂等，对此，并不为本申请所局限。
如图16A和图16B所示，所述制造过程，首先包括：提供一线路板拼版210A，并将至少一电子元器件23A和至少一感光芯片22A电连接于所述线路板拼版210A的预设位置。进一步地，在所述线路板拼版210A的预设位置上施加所述模压材料900A。
进一步地，将所述线路板拼版210A放置于成型模具90A中，其中，所述成型模具90A包括上模具91A和与之匹配的下模具92A。具体来说，在本申请该示例中，所述线路板拼版210A被放置于所述成型模具90A的下模具92A，进而所述上模具91A与所述下模具92A合模，以使得所述线路板拼版210A被收容于由所述上模具91A和下模具92A所界定的成型空间中。
特别地，在本申请实施例中，所述上模具91A包括模具主体911A和自所述模具主体911A相间隔地且向下延伸的第一凸起912A所述第一凸起912A的横截面为封闭环形，例如，“口”字型。当所述上模具91A和下模具92A 合模时，所述上模具91A的第一凸起912A贴合于所述感光芯片22A的非感光区域，以通过所述第一凸起912A密封所述感光芯片22A的至少感光区域并在所述第一凸起912A和所述模具主体911A之间形成第一成型空间914A，其中，所述模压材料900A被收容于所述第一成型空间914A内。
这样，在所述模压成型材料900A固化成型后，在所述第一成型空间914A内形成所述第一模塑部分241A，其中，所述第一模塑部分241A包覆线路板21A的至少一部分和所述感光芯片22A的非感光区域的至少一部分。
进而，更换所述上模具91A为第二上模具91’A，其中，所述第二上模具91’A包括第二模具主体911’A和自所述第二模具主体911’A向下延伸的第二凸起913’A。进而，在所述线路板拼版210A的预设位置施加所述模压材料900A。进而，当所述第二上模具91’A和下模具92A合模时，所述第二上模具91’A的第二凸起913’A贴合于所述线路板拼版210A，更明确地，贴合于所述线路板拼版210的位置设于所述引线25A和所述电子元器件23A之间，这样，在所述第二凸起913’A和所述第二模具主体911’A之间形成第二成型空间915’A，其中，所述模压材料900A被收容于所述第二成型空间915’A内。
这样，在所述模压成型材料固化成型后，在所述第二成型空间915’A内形成所述第二模塑部分242A，其中，所述第二模塑部分242A包覆至少部分所述至少一电子元器件23A和所述线路板21A的至少一部分。进而，在所述第二凸起913A对应的位置形成所述开槽240A，即，在所述第一模塑部分241A和所述第二模塑部分242A形成贯设于所述模塑体24A的所述开槽240A。
应可以理解，在本申请示例中，为了制备如图7所示意的所述感光组件20A，需执行两次模塑工艺并且在两次不同的模塑工艺中需更换不同的上模具91A。
在得到感光组件拼版后，对所述感光组件拼版进行切割，以得到多个单体的所述感光组件20A。进一步地，在所述感光组件20A上组装滤光元件26A便得到如图9A和图9B所示意的所述感光组件20A。
图17图示了根据本申请实施例的感光组件20制造过程的示意图，其中，图17中所示意的所述感光组件20制造过程以制造图13中的所述感光组件20为示例。
如图17所示，所述制造过程，首先包括：提供一线路板拼版210B，并将至少一电子元器件23B和至少一感光芯片22B电连接于所述线路板拼版210B的预设位置。
进一步地，将具有通道(图中未示意)的所述滤光元件支架27B设于所述线路板拼版210B。具体来说，所述滤光元件支架27B设于所述滤光元件26B拼版的位置位于所述感光芯片22B的外侧，或者说，在所述引线25B和所述电子元器件23B之间。
进一步地，将所述线路板拼版210B放置于成型模具90B中，其中，所述成型模具90B包括上模具91B和与之匹配的下模具92B。具体来说，在本申请该示例中，所述线路板拼版210B被放置于所述成型模具90B的下模具92B，进而所述上模具91B与所述下模具92B合模，以使得所述线路板拼版210B被收容于由所述上模具91B和下模具92B所界定的成型空间中。
特别地，在本申请实施例中，所述上模具91B包括模具主体911B和自所述模具主体911B相间隔地且向下延伸的第一凸起912B和第二凸起913B，其中，所述第一凸起912B和第二凸起913B的横截面具有封闭环形，例如，“口”字型。.当所述上模具91B和下模具92B合模时，所述上模具91B的第一凸起912B贴合于所述滤光元件支架27B且所述上模具91B的第二凸起913B贴合于所述感光芯片22B的非感光区域，以在所述第一凸起912B和所述模具主体911B之间形成第二成型空间915B，以及，在所述第二凸起913B和所述第一凸起912B之间形成第一成型空间914B，其中，所述第一成型空间914和第二成型空间915B通过设置于所述滤光元件支架27B的所述通道(图中未示意)连通。
这样，当模塑成型材料注入所述成型空间后，沿着预设流道所述模塑成型材料逐渐充满第二成型空间915B并沿着所述通道继而充满所述第一成型空间914B。进而，在固化成型后，在所述第一成型空间914B内形成所述第 一模塑部分241B、在所述第二成型空间915B内形成所述第二模塑部分242B、以及，在所述第二模塑部分242B和所述第二模塑部分242B之间形成一体结合于两者的所述滤光元件26B之间，其中，所述第一模塑部分241B包覆线路板21B的至少一部分和所述感光芯片22B的非感光区域的至少一部分，以及，所述第二模塑部分242B包覆至少部分所述至少一电子元器件23B和所述线路板21B的至少一部分。
在得到感光组件拼版后，对所述感光组件拼版进行切割，以得到多个单体的所述感光组件20B。进一步地，在所述感光组件20B上组装滤光元件26B便得到如图13所示意的所述感光组件20B。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (20)

  1. 一种感光组件，其特征在于，包括：
    线路板；
    电连接于所述线路板的感光芯片；以及
    一体成型于所述线路板的模塑体，其中，所述模塑体具有凹陷地形成于其中的至少一开槽，所述开槽位于所述感光芯片的外侧。
  2. 根据权利要求1所述的感光组件，其中，所述模塑体包括由所述开槽分成的第一模塑部分和第二模塑部分，所述第一模塑部分包覆线路板的至少一部分和所述感光芯片的非感光区域的至少一部分。
  3. 根据权利要求2所述的感光组件，还包括设置于所述线路板的至少一电子元器件，其中，所述第二模塑部分包覆至少部分所述至少一电子元器件和所述线路板的至少一部分。
  4. 根据权利要求1所述的感光组件，其中，所述开槽的深度大于等于所述模塑体高度的30％。
  5. 根据权利要求1所述的感光组件，其中，所述开槽贯穿地形成于所述模塑体，以暴露所述线路板的对应区域。
  6. 根据权利要求5所述的感光组件，其中，所述第一模塑部分和所述第二模塑部分通过模塑通道相连。
  7. 根据权利要求6所述的感光组件，其中，所述至少一开槽包括第一开槽和第二开槽，所述第一开槽和所述第二开槽相对于所述感光芯片对称布置，其中，所述模塑通道在模塑过程中形成于所述第一开槽和所述第二开槽之间。
  8. 根据权利要求5所述的感光组件，其中，所述开槽为环绕所述第一模塑部分的封闭环槽，以将所述模塑体分成相互独立的所述第一模塑部分和所述第二模塑部分。
  9. 根据权利要求8所述的感光组件，其中，所述第一模塑部分和所述第二模塑部分通过两次模塑工艺形成。
  10. 根据权利要求1所述的感光组件，进一步包括设置于所述开槽内的滤光元件支架，其中，所述滤光元件支架被配置为安装滤光元件于其上。
  11. 根据权利要求5所述的感光组件，进一步包括设置于所述开槽的滤 光元件支架，其中，所述滤光元件支架被配置为安装滤光元件于其上。
  12. 根据权利要求11所述的感光组件，其中，所述滤光元件支架具有贯穿于其中的通道，其中，所述滤光元件支架预设于所述线路板并在所述模塑体一体成型后一体结合于所述模塑体的所述第一模塑部分和所述第二模塑部分。
  13. 根据权利要求1所述的感光组件，进一步包括包裹感光芯片侧部和至少部分用于电连接感光芯片和线路板的引线的侧包胶。
  14. 一种摄像模组，其特征在于，包括：
    光学镜头；
    如权利要求1-13中任意一项所述的感光组件，其中，所述光学镜头保持于所述感光组件的感光路径。
  15. 一种感光组件的制造方法，其特征在于，包括：
    提供一线路板，其中，至少一电子元器件和至少一感光芯片电连接于所述线路板；
    将所述线路板收容于由成型模具的上模具和下模具合模时形成的成型空间中，其中，所述成型模具包括凸起；
    在所述成型空间内形成模塑体；以及
    分离所述成型模具的上模具和下模具，以在所述凸起对应的位置形成凹陷于所述模塑体的开槽。
  16. 根据权利要求15所述的感光组件的制造方法，其中，形成所述模塑体的过程，包括：
    将所述线路板放置于所述成型模具的下模具中；
    将所述成型模具的上模具和下模具合模，其中，所述上模具包括模具主体和自所述模具主体相间隔地且向下延伸的第一凸起和第二凸起，其中，当所述上模具和所述下模具合模时，所述上模具的第一凸起贴合于所述线路板，以及，所述上模具的第二凸起贴合于所述感光芯片的非感光区域，以在所述第一凸起和所述模具主体之间形成第二成型空间，以及，在所述第二凸起和所述第一凸起之间形成第一成型空间，其中，所述第一凸起还具有连通所述第一成型空间和所述第二成型空间的模塑通道；
    填充模塑成型材料至所述第一成型空间、所述第二成型空间，以在所述模塑成型材料固化成型后，在所述第一成型空间内形成第一模塑部分，以及， 在所述第二成型空间内形成第二模塑部分，并且，所述第二模塑部分和所述第二模塑部分通过所述模塑通道相连；以及
    分离所述上模具和所述下模具，以在所述第一凸起对应的位置形成所述开槽。
  17. 根据权利要求15所述的感光组件的制造方法，其中，形成所述模塑体的过程，包括:
    在所述线路板上施加模压成型材料；
    将所述线路板放置于所述成型模具的下模具中；
    将所述成型模具的上模具和下模具合模，其中，所述上模具包括模具主体和自所述模具主体相间隔地且向下延伸的第一凸起，其中，当所述上模具和所述下模具合模时，所述上模具的第一凸起贴合于所述线路板，以在所述第一凸起和所述模具主体之间形成第一成型空间，其中，所述模压成型材料位于所述第一成型空间内；
    通过模压工艺在所述第一成型空间内形成第一模塑部分；
    分离所述上模具和所述下模具；
    在所述线路板上施加模压成型材料；
    将所述成型模具的下模具和第二上模具合模，其中，所述第二上模具包括第二模具主体和自所述第二模具主体相间隔地且向下延伸的第二凸起，其中，当所述第二上模具和所述下模具合模时，所述第二上模具的第二凸起贴合于所述线路板，以在所述第二凸起和所述第二模具主体之间形成第二成型空间，其中，所述模压成型材料位于所述第二成型空间内；
    通过模压工艺在所述第二成型空间内形成第二模塑部分；
    分离所述上模具和所述下模具，以在所述第二凸起的对应位置形成凹陷于所述模塑体的所述开槽。
  18. 根据权利要求15所述的感光组件的制造方法，在形成所述模塑体之前，所述方法进一步包括：
    在所述线路板上预设至少一滤光元件支架，所述滤光元件支架具有贯穿于其中的通道，以在所述模塑体一体成型后一体结合所述滤光元件支架于所述模塑体的所述第一模塑部分和所述第二模塑部分。
  19. 根据权利要求15-18任意一项所述的感光组件的制造方法，其中，所述线路板被实施为线路板拼版。
  20. 一种摄像模组的制造方法，其特征在于，包括
    根据权利要求15-19任意一项所述的感光组件制造方法，形成一模塑体，其中，所述模塑体具有凹陷地形成于其中的开槽，其中，所述开槽将所述模塑体分成第一模塑部分和第二模塑部分；以及
    将光学镜头安装于所述模塑体的第二模塑部分。
PCT/CN2020/099937 2019-08-01 2020-07-02 感光组件、摄像模组及其制造方法 Ceased WO2021017746A1 (zh)

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