WO2021081987A1 - 显示面板及其制作方法、显示装置 - Google Patents

显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2021081987A1
WO2021081987A1 PCT/CN2019/115060 CN2019115060W WO2021081987A1 WO 2021081987 A1 WO2021081987 A1 WO 2021081987A1 CN 2019115060 W CN2019115060 W CN 2019115060W WO 2021081987 A1 WO2021081987 A1 WO 2021081987A1
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WO
WIPO (PCT)
Prior art keywords
blocking portion
sub
layer
barrier layer
barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/115060
Other languages
English (en)
French (fr)
Inventor
程博
董向丹
颜俊
都蒙蒙
杨双宾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US16/981,853 priority Critical patent/US12089431B2/en
Priority to EP19945441.4A priority patent/EP4053902B1/en
Priority to PCT/CN2019/115060 priority patent/WO2021081987A1/zh
Priority to CN201980002256.7A priority patent/CN113068416B/zh
Priority to EP25217926.2A priority patent/EP4679994A3/en
Publication of WO2021081987A1 publication Critical patent/WO2021081987A1/zh
Anticipated expiration legal-status Critical
Priority to US18/782,531 priority patent/US20240381688A1/en
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Definitions

  • At least one embodiment of the present disclosure relates to a display panel, a manufacturing method thereof, and a display device.
  • the organic light emitting display device includes a substrate and a plurality of pixels including light emitting devices formed on the substrate, and an encapsulation layer covering the pixels is provided on the pixels.
  • the encapsulation layer includes an inorganic insulating layer and an organic insulating layer.
  • the organic light emitting display device includes a display area and a peripheral area surrounding the display area. The peripheral area is provided with a blocking member to prevent the fluid material forming the organic insulating layer from overflowing the substrate during the process of forming the organic insulating layer in the encapsulation layer.
  • At least one embodiment of the present disclosure provides a display panel, a manufacturing method thereof, and a display device.
  • At least one embodiment of the present disclosure provides a display panel including: a base substrate, a first blocking portion on the base substrate, an encapsulation layer, and a plurality of touch signal lines.
  • the base substrate includes a display area and a peripheral area located at the periphery of the display area; a first blocking portion is located in the peripheral area, and a first portion of the first blocking portion located on one side of the display area is parallel to the
  • the base substrate extends in a first direction
  • the first barrier portion includes a first barrier layer, a second barrier layer located on the side of the first barrier layer away from the base substrate, and the second barrier layer
  • the third barrier layer on the side away from the first barrier layer; the second barrier layer covers the surface of the first barrier layer away from the base substrate and the side surface of the first barrier layer, the The third barrier layer covers the surface of the second barrier layer away from the base substrate and the side surface of the second barrier layer; the encapsulation layer is located in the display area and the peripheral area, and covers the first barrier layer A pluralit
  • the first barrier layer includes a first sub-blocking portion and a second sub-blocking portion of the same material, and the second sub-blocking portion is located between the first sub-blocking portion and the second barrier layer; In the first part of the first blocking portion, along the second direction, the maximum size of the second sub-blocking portion is not greater than the minimum size of the first sub-blocking portion so that the encapsulation layer is far away from the first
  • the inclination angle of the first slope formed by the surface at the junction of the sub-blocking portion and the second sub-blocking portion is about 20°-35°.
  • the inclination angle of the first slope is about 27°-33°.
  • the cross section of the first barrier layer in the first portion of the first barrier portion cut by a plane perpendicular to the first direction is substantially a trapezoid, and the first oblique side of the trapezoid and The first included angle between the base substrates is about 20°-35°.
  • the second barrier layer covers the surface of the first barrier layer away from the base substrate and the side surface of the first barrier layer.
  • the third barrier layer covers the surface of the second barrier layer away from the first barrier layer and the side surface of the second barrier layer.
  • the plurality of touch signal lines cover part of the first slope so that the surface away from the first slope forms a second slope.
  • the first blocking portion is a ring-shaped structure surrounding the display area, and in a second portion of the first blocking portion excluding the first portion, the second sub-blocking portion is adjacent to the edge of the second sub-blocking portion.
  • the maximum dimension of the fourth direction intersecting the extension direction of the second part is not greater than the minimum dimension of the first sub-blocking portion along the fourth direction so that the encapsulation layer is far away from the first sub-blocking portion and the
  • the surface at the junction of the second sub-blocking portion forms a third slope, and the inclination angle of the third slope is about 20°-35°.
  • the first sub-blocking portion and the second sub-blocking portion are integrally formed.
  • the center line of the orthographic projection of the second sub-blocking portion on the base substrate and the first sub-blocking portion along the first direction are The center lines along the first direction of the orthographic projection of the blocking portion on the base substrate substantially coincide.
  • the center line of the orthographic projection of the second barrier layer on the base substrate along the first direction substantially coincides with the center line of the second sub-blocking portion.
  • the display panel further includes: a second blocking portion located in the peripheral area and between the first blocking portion and the display area, the second blocking portion and the first blocking portion
  • the extension direction of the two is the same, and along the third direction perpendicular to the base substrate, the size of the first blocking portion is larger than the size of the second blocking portion.
  • the second barrier portion includes a fourth barrier layer and a fifth barrier layer located on a side of the fourth barrier layer away from the base substrate, and the fourth barrier layer and the second barrier layer
  • the layers are arranged in the same layer, and the materials and thicknesses are the same, and the fifth barrier layer and the third barrier layer are arranged in the same layer, and the materials and thicknesses are the same.
  • the display panel further includes: a pixel circuit structure layer located in the display area; a flat layer located on a side of the pixel circuit structure layer away from the base substrate; and a flat layer located away from the pixel The light-emitting element on the side of the circuit structure layer.
  • the first barrier layer and the flat layer are arranged in the same layer, and the thickness and the material are the same.
  • the display panel further includes: a pixel defining layer located on a side of the flat layer away from the pixel circuit structure layer.
  • the second barrier layer and the pixel defining layer are arranged in the same layer, and the thickness and the material are the same.
  • the size of the first barrier layer is about 1.6 to 2.5 microns.
  • the size of the first blocking portion is about 3 to 5 microns.
  • the size of the first sub-blocking portion along the second direction is about 25-45 microns.
  • At least one embodiment of the present disclosure provides a method for manufacturing a display panel, including: providing a base substrate, the base substrate including a display area and a peripheral area located at the periphery of the display area; in the peripheral area of the base substrate Forming a first blocking part, wherein the first part of the first blocking part extends in a first direction parallel to the base substrate, and forming the first part of the first blocking part includes: on the base substrate A first barrier layer material is formed; a one-step patterning process is used for the first barrier layer material to form a stacked first sub-barrier portion and a second sub-barrier portion, and the second sub-barrier portion is located in the first sub-barrier Portion away from the base substrate, along a second direction intersecting the first direction, the maximum dimension of the second sub-blocking portion is not greater than the minimum size of the first sub-blocking portion; A second barrier layer is formed on the side of the second barrier part away from the base substrate; a third barrier layer is formed on the side of the second barrier layer away from
  • using a one-step patterning process to form the first sub-blocking portion and the second sub-blocking portion that are arranged in a stack includes: forming the first sub-blocking portion and the second sub-blocking portion using a half-tone mask.
  • At least one embodiment of the present disclosure provides a display device including the above-mentioned display panel.
  • FIG. 1A is a schematic diagram of a partial planar structure of a display panel
  • Fig. 1B is a schematic cross-sectional view taken along the line AA' in Fig. 1A;
  • FIG. 2A is a schematic diagram of a partial plane structure of a display panel according to an example of an embodiment of the present disclosure
  • Fig. 2B is a schematic cross-sectional structure diagram taken along the line BB' in Fig. 2A;
  • 2C is a schematic diagram of a partial planar structure of a display panel provided by another example of an embodiment of the present disclosure.
  • Fig. 2D is a schematic cross-sectional structure diagram taken along line CC' in Fig. 2C;
  • 2E is a schematic diagram of a partial planar structure of a display panel provided by another example of an embodiment of the present disclosure.
  • 2F is a schematic diagram of a partial cross-sectional structure of a display panel provided by another example of an embodiment of the present disclosure.
  • FIG. 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided according to another example of an embodiment of the present disclosure.
  • FIG. 4A is a schematic flowchart of a manufacturing method of a display panel according to an embodiment of the present disclosure
  • 4B and 4C are schematic process flow diagrams for forming the first barrier layer.
  • FIG. 1A is a schematic partial plan view of a display panel
  • FIG. 1B is a schematic cross-sectional view taken along the line AA' in FIG. 1A
  • the display panel includes a display area 11 and a peripheral area 12 located at the periphery of the display area 11.
  • the peripheral area 12 may surround the display area 11 or may be located at a part of the periphery of the display area 11.
  • 1A and 1B schematically show a plan view and a cross-sectional view of a part of the film layer of the peripheral region 12 of the display panel.
  • the peripheral region 12 of the display panel may include a base substrate 10, a buffer layer 13, a first gate insulating layer 14, a second gate insulating layer 15, and a buffer layer 13 sequentially located on the base substrate 10.
  • the aforementioned source and drain metal layer 17 corresponds to the source and drain of the thin film transistor (not shown) of the pixel circuit structure in the display area 11 and the data line.
  • the flat layer 18 located in the display area 11 is provided on the thin film transistor, and the flat layer 18 located in the display area 11 is further provided with a light emitting element (not shown) on the side away from the base substrate 10.
  • the light-emitting element may include a light-emitting functional layer, and first and second electrodes located on both sides of the light-emitting functional layer.
  • the first electrode located on the side of the light-emitting function layer close to the base substrate 10 may be electrically connected to the drain of the thin film transistor through the via hole provided in the flat layer 18.
  • a pixel defining layer 19 is provided on the side of the first electrode away from the base substrate 10 to facilitate the formation of a light-emitting function layer.
  • the light-emitting functional layer may include a light-emitting layer, and may also include other functional layers, for example, may also include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, but is not limited thereto.
  • An encapsulation layer 30 is provided on the side of the light-emitting element away from the base substrate 10, and the encapsulation layer 30 covers the light-emitting element to prevent the light-emitting element from being corroded by water and oxygen from the outside, and protect the light-emitting element.
  • the encapsulation layer 30 includes an inorganic layer 31 and an organic layer 32 stacked in sequence.
  • FIG. 1B schematically shows that the encapsulation layer 30 includes two inorganic layers 31 and an organic layer 32 located between the two inorganic layers 31.
  • the peripheral area 12 is provided with a first barrier portion 20 and a second barrier portion 50 located on the side of the first barrier portion 20 close to the display area 11.
  • the two barrier portions may be located in the source and drain metal.
  • the layer 17 is used to prevent the organic layer 32 in the encapsulation layer 30 from overflowing the base substrate 10 during the manufacturing process.
  • the two inorganic layers 31 in the encapsulation layer 30 can cover the first barrier portion 20 and the second barrier portion 50 to increase the path for water and oxygen to erode the inside of the display panel, and improve the encapsulation effect of the display panel.
  • 1A and 1B only show a part of the blocking portion in the peripheral area 12 on one side of the display area 11. When the peripheral area 12 is arranged around the display area 11, both of the blocking portions may be arranged as a ring surrounding the display area 11. Shaped structure to prevent the material of the organic layer from overflowing around.
  • the first barrier portion 20 includes a first barrier layer 21, a second barrier layer 22, and a third barrier layer 23 that are stacked in sequence, and the second barrier portion 50 includes stacked in sequence.
  • the first barrier layer 21 can be formed in the same layer as the planarization layer 18 located in the display area 11.
  • the first barrier layer 21 can be a part of the planarization layer, that is, the planarization layer material is patterned to form the planarization layer 18 and the first barrier layer 18 is formed at the same time. Blocking layer 21.
  • the second barrier layer 22 and the fourth barrier layer 51 may be formed in the same layer as the pixel defining layer 19.
  • the second barrier layer 22 and the fourth barrier layer 51 may be part of the pixel defining layer 19, that is, the material pattern of the pixel defining layer
  • the second barrier layer 22 of the first barrier portion 20 and the fourth barrier layer 51 of the second barrier portion 50 are formed at the same time as the pixel defining layer 19 is formed.
  • the third barrier layer 23 and the fifth barrier layer 52 may be formed by patterning the same material layer.
  • the height of the first barrier portion 20 is greater than the height of the second barrier portion 50 to be able to be blocked by the first barrier portion after the material of the organic layer overflows from the second barrier portion.
  • the display panel further includes a touch layer located on the surface of the packaging layer 30 away from the base substrate 10.
  • the touch layer formed in the display area 11 is a touch electrode formed in the peripheral area 12.
  • the touch layer in is a touch signal line 40, and the touch signal line 40 is electrically connected to the touch electrode to transmit signals.
  • the touch signal line 40 extends in the X direction, a part of the blocking portion extends in the Y direction, and the extending direction of the touch signal line 40 intersects the extending direction of a part of the blocking portion.
  • the display panel shown in Figure 1B eliminates the use of the base material of the touch layer, which not only reduces the cost, but also improves the integration to make the display panel lighter and thinner and easier to fold. .
  • the inventor of the present application found that: as shown in FIG. 1A and FIG. 1B, the height of the first blocking portion 20 is relatively large (for example, 3-6 microns) due to the Y direction perpendicular to the base substrate 10, As a result, the packaging layer 30 located on the first blocking portion 20 has a large step difference, which results in that the touch signal line 40 is patterned and formed on the surface of the packaging layer 30 because there is a large step difference at the edge of the first blocking portion 20. H1, resulting in metal material remaining in the corner area 24 of the encapsulation layer 30 (that is, the edge area 24 of the first barrier portion 20 along the X direction).
  • the metal material remaining in the corner area 24 of the first blocking portion 20 may cause the adjacent touch signal lines 40 to be electrically connected to form a defect.
  • the shape of some of the film layers (for example, the film layer included in the first barrier portion 20 and the film layer included in the second barrier portion 50, etc.) in the cross-sectional view shown in FIG. 1B is a rectangular shape only for illustration. In the actual process, during the high-temperature curing of the second barrier layer and the third barrier layer, the two barrier layers will flow to a certain extent, resulting in the cross-sectional shape of each barrier layer may be approximately trapezoidal, and the second barrier layer covers the first barrier layer.
  • a barrier layer is away from the side surface of the base substrate and the side surface of the first barrier layer, and the third barrier layer covers the side surface of the second barrier layer away from the base substrate and the side surface of the second barrier layer. That is, the cross-sectional shape of the above-mentioned film layer may be a trapezoid, and the encapsulation layer 30 has an inclined surface in the corner area 24, and the angle between the inclined surface and the base substrate is in the range of 40° to 45°.
  • the control signal line 40 is likely to leave metal material in the corner area 24.
  • the embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device.
  • the display panel includes: a base substrate, a first blocking portion, an encapsulation layer, and a plurality of touch signal lines.
  • the base substrate includes a display area and a peripheral area located at the periphery of the display area; the first blocking portion is located in the peripheral area, and a first portion of the first blocking portion located on one side of the display area extends in a first direction parallel to the base substrate.
  • a barrier portion includes a first barrier layer, a second barrier layer located on the side of the first barrier layer away from the base substrate, and a third barrier layer located on the side of the second barrier layer away from the first barrier layer; the second barrier layer Cover the surface of the first barrier layer away from the base substrate and the side surface of the first barrier layer, and the third barrier layer covers the surface of the second barrier layer away from the base substrate and the side surface of the second barrier layer.
  • the encapsulation layer is located in the display area and the peripheral area, and covers the first blocking portion; the multiple touch signal lines are located on the side of the encapsulation layer away from the base substrate and extend along a second direction intersecting the first direction.
  • the orthographic projection of the signal line on the base substrate overlaps the orthographic projection of the first part of the first blocking portion on the base substrate.
  • the first barrier layer includes a first sub-blocking portion and a second sub-blocking portion with the same material.
  • the second sub-blocking portion is located between the first sub-blocking portion and the second barrier layer; In the second direction, the maximum size of the second sub-blocking portion is not greater than the minimum size of the first sub-blocking portion so that the encapsulation layer is far from the first slope formed by the surface at the junction of the first sub-blocking portion and the second sub-blocking portion.
  • the inclination angle is about 20° ⁇ 35°.
  • a first sub-barrier portion and a second sub-barrier portion of different sizes are formed in the first barrier layer, thereby forming a first slope with an inclination angle of about 20° to 35° in the corner area of the encapsulation layer.
  • the slope angle of the touch signal line located at the edge of the first blocking portion is reduced, thereby reducing the probability of short circuit between adjacent touch signal lines to improve the yield of the display panel.
  • FIG. 2A is a schematic partial plan structure diagram of a display panel according to an embodiment of the present disclosure
  • FIG. 2B is a schematic cross-sectional structure diagram taken along line BB' in FIG. 2A
  • the display panel includes a base substrate 100, a first blocking portion 200 located on the base substrate 100, an encapsulation layer 300 located on the side of the first blocking portion 200 away from the base substrate 100, and The multiple touch signal lines 400 on the side of the layer 300 away from the base substrate 100.
  • the base substrate 100 includes a display area 101 and a peripheral area 102 located at the periphery of the display area 101.
  • FIG. 2B schematically shows that the touch signal line 400 is in contact with the surface of the packaging layer 300 away from the base substrate 100, but it is not limited to this.
  • a buffer layer (not shown) may also be provided between the touch signal line and the packaging layer. ).
  • the display area 101 is the image display area of the display panel, that is, the light-emitting area;
  • the peripheral area 102 is the area where the display panel does not display the image, that is, the non-light-emitting area.
  • the peripheral area 102 may surround the display area 101 or may be located at a part of the periphery of the display area 101.
  • FIG. 2 schematically shows a cross-sectional view of a part of the film layer of the peripheral area 102 located on the side of the display area 101.
  • the base substrate 100 may be a flexible base substrate 100, such as polyimide (PI), to form a flexible display device.
  • PI polyimide
  • the material of the flexible base substrate 100 is not limited to polyimide.
  • the first barrier 200 is located in the peripheral area 102, and the first barrier 200 includes a first barrier layer 210 and a second barrier layer 220 that are stacked, and the second barrier layer 220 is located in the first barrier.
  • the layer 210 is away from the side of the base substrate 100.
  • 2B schematically shows that the second barrier layer 220 covers the surface of the first barrier layer 210 away from the base substrate 100 and the side surface of the first barrier layer 210, and the third barrier layer 230 covers the second barrier layer 220 away from the first barrier layer.
  • the surface of 210 and the side of the second barrier layer 220 are examples of the first barrier layer.
  • the embodiment of the present disclosure is described by taking the first barrier layer 210 as the film layer closest to the base substrate 100 in the first barrier portion 200 as an example.
  • the embodiments of the present disclosure are not limited thereto.
  • the first barrier layer, the second barrier layer, and the third barrier layer may be stacked in a direction perpendicular to the base substrate, and in the first portion of the first barrier portion, the second barrier layer
  • the maximum dimension of the second direction is not greater than the minimum dimension of the second sub-barrier portion in the second direction
  • the maximum dimension of the third barrier layer in the second direction is not greater than the minimum dimension of the second barrier layer in the second direction.
  • FIGS. 2A and 2B schematically show the first blocking portion 200 in the peripheral area 102 on the side of the display area 101, that is, the first portion 201 of the first blocking portion 200 is shown.
  • the first part 201 extends in a first direction parallel to the base substrate 100 (ie, the Z direction).
  • the peripheral area 102 includes a binding area 1021, and the first portion 201 of the first blocking portion 200 is located on the side of the display area 101 close to the binding area 1021, that is, the second portion of the first blocking portion 200.
  • a part 201 is located between the display area 101 and the binding area 1021.
  • the touch signal line 400 is located on the side of the display area 101 close to the binding area 1021, so the first blocking portion 200 in the area where the touch signal line 400 is located overlaps the touch signal line 400.
  • the binding area 1021 may include a circuit structure (not shown) to be connected with signal lines such as the touch signal line 400.
  • the first barrier layer 210 includes a first sub-blocking portion 211 and a second sub-blocking portion 212 that are of the same material and stacked.
  • the second sub-blocking portion 212 is located between the first and second sub-blocking portions 211 and 212.
  • Between two barrier layers 220. In the first portion 201 of the first blocking portion 210, along the second direction intersecting the first direction (that is, the extension direction of the touch signal line 400 mentioned later, such as the X direction), the largest of the second sub-blocking portion 212 The size is not greater than the minimum size of the first sub-blocking part 211.
  • the maximum size of the second sub-blocking portion 212 is smaller than the minimum size of the first sub-blocking portion 211 to form a stepped structure.
  • FIG. 2B schematically shows that the shape of the cross section of the first sub-blocking portion 211 and the second sub-blocking portion 212 cut by the XY plane is a standard trapezoid, for example, along the X direction, the second sub-blocking portion The long side of 212 is smaller than the short side of the first sub-blocking portion 211 to form a stepped structure.
  • the orthographic projection of the second sub-blocking portion 212 on the base substrate 100 completely falls within the orthographic projection of the first sub-blocking portion 211 on the base substrate 100, and in the second direction, the first sub-blocking
  • the two side edges of the orthographic projection of the part 211 on the base substrate 100 are located outside the two side edges of the second sub-blocking part 212 on the base substrate 100.
  • the two sub-barriers will flow to a certain extent, resulting in that the cross-sectional shape of the two sub-barriers may be approximately trapezoidal (for example, the included corners are rounded).
  • the encapsulation layer 300 is located in the display area 101 and the peripheral area 102 and covers the first blocking part 200.
  • the encapsulation layer 300 covers the surface of the first barrier portion 200 on the side away from the base substrate 100 and the side surface of the first barrier portion 200. Since the maximum size of the second sub-blocking portion 212 is smaller than the minimum size of the first sub-blocking portion 211 along the second direction, a stepped structure is formed. Therefore, the encapsulation layer 300 is formed between the first sub-blocking portion 211 and the second sub-blocking portion 212 A first slope 311 is formed at the boundary position and away from the surface of the base substrate 100, and the inclination angle of the first slope 311 is 20°-35°.
  • the inclination angle of the first slope 311 formed on the surface of the encapsulation layer 300 far away from the interface of the first sub-blocking portion 211 and the second sub-blocking portion 212 is about 20°-35°.
  • the encapsulation layer 300 has a first slope 311 with an inclination angle of 20°-35° in the corner area 240 corresponding to the junction of the first sub-blocking portion 211 and the second sub-blocking portion 212.
  • the inclination angle of the first slope 311 may be about 25°-35°.
  • the inclination angle of the first slope 311 formed by the surface of the encapsulation layer 300 at a location away from the boundary of the first sub-blocking portion 211 and the second sub-blocking portion 212 is about 27°-33°.
  • the inclination angle of the first slope 311 may be about 30°.
  • FIG. 2B schematically shows that the cross section of the packaging layer cut by the XY plane includes a hypotenuse, and the inclination angle of the first slope is the included angle between the hypotenuse of the packaging layer and the base substrate.
  • the first barrier layer includes two sub-blocking parts with different sizes in a stack as an example, but it is not limited to this.
  • the first barrier layer may also include more sub-barriers with different sizes in a stack. More steps are formed, so that the angle between the slope formed at the position of the encapsulation layer corresponding to the first barrier layer and the base substrate is smaller.
  • the peripheral region 102 of the display panel may include a base substrate 100, a buffer layer 103, a first gate insulating layer 104, a second gate insulating layer 105, and a layer
  • the inter-insulating layer 106, the source-drain metal layer 107, the flat layer 108, and the pixel defining layer 109 may be formed using an organic material.
  • the aforementioned source and drain metal layer 107 corresponds to the source and drain of the thin film transistor (not shown) included in the pixel circuit structure layer in the display area 101 and the data line.
  • the flat layer 108 in the display area 101 is arranged on the thin film transistor, and the flat layer 108 in the display area 101 is further provided with a light-emitting element (not shown) on the side away from the base substrate 100.
  • the light-emitting element includes, for example, an organic light-emitting diode. But it is not limited to this.
  • the light-emitting element may include a light-emitting layer, and first and second electrodes located on both sides of the light-emitting layer.
  • the first electrode located on the side of the light-emitting layer close to the base substrate 100 may be electrically connected to the drain of the thin film transistor through the via hole provided in the flat layer 108.
  • a pixel defining layer 109 is provided on the side of the first electrode away from the base substrate 100 to facilitate the formation of the light-emitting layer.
  • An encapsulation layer 300 is provided on the side of the light emitting element away from the base substrate 100.
  • the encapsulation layer 300 may be a planar film.
  • the encapsulation layer is used to cover the light-emitting element to prevent the light-emitting element from being corroded by external water and oxygen, and to protect the light-emitting element.
  • FIG. 2B schematically shows that the encapsulation layer 300 includes a first inorganic layer 310, an organic layer 320, and a second inorganic layer 330 stacked in sequence, but it is not limited to this, and can be set as required.
  • the material of the inorganic layer in the encapsulation layer includes, for example, silicon nitride, silicon oxide, or silicon oxynitride. Inorganic materials are highly dense and can prevent water, oxygen, etc. from entering the light-emitting element and affecting the performance of the light-emitting element.
  • the material of the organic layer includes, for example, a polymer resin (for example, polyimide, polyacrylate, etc.), and the organic layer has the functions of flattening and stress relaxation.
  • the first barrier portion 200 and the second barrier portion 500 provided in the peripheral region 102 may be located on the source and drain metal layer 107 to prevent the organic layer 320 in the encapsulation layer 300 from being fabricated.
  • the base substrate 100 overflows during the process.
  • the two inorganic layers in the encapsulation layer 300 may cover the first barrier portion 200 and the second barrier portion 500 to increase the path for water and oxygen to erode the inside of the display panel and improve the encapsulation effect of the display panel.
  • 2A and 2B only show a part of the blocking portion in the peripheral area 102 on the side of the display area 101. When the peripheral area 102 is arranged around the display area 101, both of the blocking portions may be arranged as a ring surrounding the display area 101. Shaped structure to prevent the material of the organic layer from overflowing around.
  • a plurality of touch signal lines 400 are further provided on the surface of the packaging layer 300 located in the peripheral area 102 away from the base substrate 100.
  • the touch signal lines 400 may be connected to the surface of the packaging layer 300. Contact and extend along the second direction.
  • An insulating layer may also be provided between the touch signal line 400 and the packaging layer 300, which is not limited in the embodiment of the present disclosure.
  • the touch signal line 400 is arranged to cross a portion of the first blocking portion 200 extending in the first direction.
  • the portion of the first blocking portion that extends along the first direction refers to a portion that overlaps the touch signal line, and the first direction is a direction that intersects the extending direction of the touch signal line.
  • touch electrodes are further provided on the surface of the packaging layer 300 located in the display area 101 away from the base substrate 100, and the touch signal lines 400 are electrically connected to the touch electrodes to transmit signals.
  • the touch electrode may include a metal grid, and the metal grid includes a plurality of first touch electrodes and a plurality of second touch electrodes.
  • the multiple first touch electrodes and multiple second touch electrodes can form capacitors at the overlapping positions.
  • the touch layer may include a mutual-capacitive touch structure or a self-capacitive touch structure.
  • the touch control layer can also be made of materials such as nano silver wires.
  • one of the first touch electrode and the second touch electrode may be patterned and formed on the surface of the packaging layer.
  • the touch electrodes and touch signal lines 400 in the embodiments shown in FIGS. 2A and 2B are in direct contact with the surface of the packaging layer 300, for example (that is, on-cell type), that is, the touch signal lines 400 are directly patterned and formed on the packaging layer. 300 on the surface.
  • the display panel provided by the embodiments of the present disclosure eliminates the use of the base material of the touch layer, which can not only reduce the cost, but also improve the integration to make the display panel lighter, thinner and easier fold.
  • the cost can also be reduced, and the integration level can be improved to make the display panel lighter, thinner and more compact. Easy to fold.
  • the orthographic projection of the multiple touch signal lines 400 on the base substrate 100 and the orthographic projection of the first portion 201 extending along the first direction of the first blocking portion 200 on the base substrate 100 are overlap.
  • the touch signal line 400 covers the step formed by the first sub-blocking portion 211 and the second sub-blocking portion 212, that is, the touch signal line 400 covers the encapsulation layer 300 in the first sub-blocking portion 211 and the second sub-blocking portion 212.
  • a part of the first slope 311 formed at the junction position forms a second slope 401 on the surface of the touch signal line 400 away from the first slope 311.
  • the inclination angle of the second slope 401 may be substantially equal to the inclination angle of the first slope 311.
  • the first slope and the second slope (and the third slope mentioned later) here are not necessarily an oblique plane, but may be concave or convex with a certain curvature, as long as the first sub-blocking part and the second sub-block
  • the film layer at the corners of the boundary position of the barrier portion only needs to be able to form a smooth surface.
  • the encapsulation layer can form an inclination angle of about 20°-35° at a position corresponding to the first barrier layer.
  • the first slope the touch signal line patterned on the packaging layer covers the edge area of the first barrier (where the packaging layer slopes) It is smoother, thereby reducing the probability of residual metal formation in the process of manufacturing the touch signal line to improve the yield.
  • first sub-blocking portion 211 and the second sub-blocking portion 212 are integrally formed, that is, the first sub-blocking portion 211 and the second sub-blocking portion 212 are integrally formed by patterning the first barrier layer material in one step. Structure to save craftsmanship.
  • the embodiments of the present disclosure are not limited to this, and may also be two independent structures formed by patterning the first barrier layer material respectively.
  • the size of the first barrier layer 210 may be about 1.6 to 2.5 microns.
  • the ratio of the size of the first sub-blocking portion 211 to the second sub-blocking portion 212 may be about 0.8 to 1.2.
  • the size of the first sub-blocking portion 211 is the same as the size of the second sub-blocking portion 212.
  • the size of the first sub-blocking portion 211 along the second direction is about 25-45 microns.
  • the difference between the size of the first sub-blocking portion 211 and the size of the second sub-blocking portion 212 may be 20%-30% of the size of the first sub-blocking portion 211. Since the size of the first barrier layer along the X direction cannot be too large, the difference between the size of the first sub-blocking portion and the size of the second sub-blocking portion is designed to be 20%-30% of the size of the first sub-blocking portion 211 to prevent The first barrier layer affects its surrounding structure.
  • the size of the first sub-blocking portion 211 may be 40 microns, and the difference between the size of the first sub-blocking portion 211 and the size of the second sub-blocking portion 212 is 5-10 microns.
  • the size of the first barrier layer 210 in FIG. 2B along the direction perpendicular to the base substrate 100 is designed to be the same as that of the first barrier layer 21 in the display panel shown in FIG. 1B along the direction perpendicular to the base substrate 10.
  • the size is the same, and when the size of the second sub-blocking portion 212 shown in FIG. 2B along the second direction is designed to be the same as the size of the first barrier layer 21 in the display panel shown in FIG.
  • the size relationship of the first sub-blocking portion 211 and the second sub-blocking portion 212 in the first barrier layer 210 along the second direction and the third direction is adjusted to adjust the encapsulation layer 300 corresponding to the first slope 311 of the first barrier layer 210. Angle, so as to prevent the touch signal line 400 located on the first slope 311 from being short-circuited due to the remaining metal material.
  • the first barrier layer 21 in FIG. 1B in the second direction compared to directly designing the size of the first barrier layer 21 shown in FIG. 1B in the second direction to the size of the first sub-blocking portion 211 shown in FIG. 2B in the second direction, the first barrier layer 21 in FIG.
  • the barrier layer 21 and the second barrier layer 22 form a stepped structure.
  • the first barrier layer is designed to include a first sub-barrier portion and a second sub-barrier portion with different sizes so that the first barrier layer itself is formed
  • the stepped structure can make the inclination angle of the slope on the packaging layer smaller, which is more conducive to improving the yield of the touch signal line.
  • the packaging layer 30 corresponding to the first barrier layer 21 may also form a slope, but the angle between the slope and the base substrate 10 is relatively large. For example, if it is greater than 40°, the touch signal line formed on the slope will have residual metal and cause defects.
  • the angle of the slope of the packaging layer can be made smaller, and the slope of the packaging layer can be smoother, thereby reducing the patterned touch formed on the slope. Remaining metal materials of signal lines.
  • the second barrier layer 220 covers the surface of the first barrier layer 210 away from the base substrate 100 and the first barrier The side of layer 210.
  • the maximum size of the second barrier layer 220 in the second direction may not be greater than the minimum size of the second sub-blocking portion 212 in the second direction.
  • the cross-sectional shape of the second barrier layer 220 and the second sub-barrier portion 212 may be a trapezoid, and the long side of the second barrier layer is not larger than the short side of the second sub-barrier portion.
  • the maximum size of the second barrier layer is equal to the minimum size of the second sub-barrier portion, the surface of the second barrier layer facing the second sub-barrier portion completely overlaps with the surface of the second sub-barrier portion facing the second barrier layer.
  • the maximum size of the second barrier layer 220 may be smaller than the minimum size of the second sub-barrier 212 to form a stepped structure.
  • the embodiments of the present disclosure can increase the number of steps in the first barrier portion, so that the slope of the packaging layer formed at the edge of the first barrier portion is more gentle, so as to further prevent the touch signal line from being short-circuited.
  • the center line in the first direction of the orthographic projection of the second sub-blocking portion 212 on the base substrate 100 and the orthographic projection of the first sub-blocking portion 211 on the base substrate 100 are The center lines along the first direction roughly coincide. That is, along the second direction, the orthographic projection of the second sub-blocking portion 212 on the first sub-blocking portion 211 is located in the middle of the first sub-blocking portion 211.
  • the cross-sectional shape of the first barrier layer 210 is approximately "convex".
  • the centerline of the orthographic projection of the second barrier layer 220 on the base substrate 100 and the centerline of the orthographic projection of the second sub-blocking portion 212 on the base substrate 100 are different from each other.
  • the center lines along the first direction roughly coincide.
  • the orthographic projection of the second barrier layer 220 on the second sub barrier portion 212 It is located in the middle of the second sub-blocking portion 212 so that both sides of the second blocking layer 220 and the second sub-blocking portion 212 in the second direction can form steps, which further prevents the touch signal line covering the first blocking portion from being defective.
  • the first barrier part 200 further includes a third barrier layer 230 located on a side of the second barrier layer 220 away from the first barrier layer 210.
  • the third barrier layer 230 covers the surface of the second barrier layer 220 away from the base substrate 100 and the side surface of the second barrier layer 220.
  • the embodiments of the present disclosure are not limited thereto, for example, the maximum dimension of the third barrier layer 230 in the second direction may not be greater than the minimum dimension of the second barrier layer 220 in the second direction.
  • the cross-sectional shapes of the second barrier layer 220 and the third barrier layer 230 may be trapezoidal, and the long side of the third barrier layer is not larger than the short side of the second barrier layer.
  • the maximum size of the third barrier layer is equal to the minimum size of the second barrier layer, the surface of the third barrier layer facing the second barrier layer completely overlaps with the surface of the second barrier layer facing the third barrier layer.
  • the maximum size of the third barrier layer 230 may be smaller than the minimum size of the second barrier layer 220 to form a stepped structure.
  • the embodiments of the present disclosure can increase the number of steps in the first barrier portion to make the packaging layer formed at the edge of the first barrier portion smoother, so as to further prevent the patterned touch signal lines from having metal residues and causing short circuits.
  • the size of the first blocking portion 200 is about 3-6 microns.
  • the size of the first blocking portion 200 is about 4.5-5 microns.
  • the size of the first blocking portion 200 is about 4 microns.
  • the size of the first blocking portion in the direction perpendicular to the base substrate remains unchanged (that is, the display panel provided by the embodiment of the present disclosure).
  • the level difference H2 of the touch signal line 400 located at the edge of the first blocking portion 200 is equal to the level difference H1 of the touch signal line 40 located at the edge of the first blocking portion 20 shown in FIG.
  • At least two sub-blocking portions with different sizes are formed in the blocking layer to form a step structure, thereby reducing the inclination angle of the slope of the packaging layer at the edge of the first blocking portion, thereby improving the yield of the touch signal line.
  • the display panel further includes a second blocking part 500.
  • the second blocking portion 500 is located in the peripheral area 102 and between the first blocking portion 200 and the display area 101.
  • the second blocking portion 500 and the first blocking portion 200 extend in the same direction.
  • the second blocking portion 500 extends in the first direction.
  • the side surface of the second blocking portion 500 facing the base substrate 100 and the side surface of the first blocking portion 200 facing the base substrate 100 are on the same plane parallel to the base substrate 100. on. That is, the surface of the second blocking part 500 facing the base substrate 100 is flush with the surface of the first blocking part 200 facing the base substrate 100.
  • the size of the first barrier portion 200 is larger than the size of the second barrier portion 500 so that the material of the organic layer in the encapsulation layer can be overflowed from the second barrier portion.
  • the first blocking part blocks.
  • the size of the first blocking portion 200 is larger than the size of the second blocking portion 500 by about 2 micrometers.
  • the height of the second blocking portion is not high, which basically does not cause the touch signal line on the second blocking portion to have a large step difference, and the touch signal line on the second blocking portion is not prone to defects.
  • a step structure may also be formed in the second blocking portion.
  • the cross section of the second blocking portion 500 cut by a plane perpendicular to the extending direction of the second blocking portion 500 includes a second oblique side 501.
  • the absolute value of the difference in the inclination angle of a slope 311 is greater than 0° and less than 20°.
  • the angles between the hypotenuses of the two and the base substrate are the same.
  • the thickness of the second barrier portion is relatively low, it will not have a large impact on the touch signal lines formed thereon, so the second barrier portion is not adjusted in the forming process.
  • the inclined angle of the formed hypotenuse is the same as the angle of the second blocking portion shown in FIG. 1B, and both are greater than 40°.
  • the package formed on the first barrier part in this example is The inclination angle of the first slope of the layer is significantly smaller than the inclination angle of the slope of the encapsulation layer formed on the second barrier. Therefore, in the process of patterning the touch signal line located on the first blocking portion, metal residue is not easy to appear.
  • the second blocking part 500 may be disposed in a ring structure surrounding the display area 101.
  • the distance in the second direction between the first barrier portion 200 and the second barrier portion 500 may be about 1.5 to 2.5 microns, and the size of the first sub-barrier portion 211 of the first barrier layer 210 in the X direction cannot be too large , To prevent contact with the second blocking part 500.
  • the second barrier portion 500 includes a fourth barrier layer 510 and a fifth barrier layer 520 located on a side of the fourth barrier layer 510 away from the base substrate 100.
  • the cross-sections of the fourth barrier layer 510 and the fifth barrier layer 520 are both trapezoidal, and the fifth barrier layer 520 may cover the fourth barrier layer 510 away from the substrate.
  • the surface of the substrate 100 and the side surface of the fourth barrier layer 510 are not limited in the embodiment of the present disclosure.
  • the maximum size of the fifth barrier layer 520 may not be greater than the minimum size of the fourth barrier layer 510.
  • a step structure may also be formed in the fourth barrier layer 510.
  • the size of the fifth barrier layer 520 may be smaller than the size of the fourth barrier layer 510 to form a stepped structure.
  • the embodiment of the present disclosure is not limited to this, and may also be the same size as the size of the fifth barrier layer along the second direction.
  • the size of the fourth barrier layer along the second direction is the same to facilitate manufacturing.
  • the fourth barrier layer 510 and the second barrier layer 220 are arranged in the same layer, and the materials and thicknesses of both are the same, that is, the material of the fourth barrier layer 510 is the same as the material of the second barrier layer 220, and the material of the fourth barrier layer 510 is the same as that of the second barrier layer 220.
  • the thickness of the fourth barrier layer 510 is the same as the thickness of the second barrier layer 220.
  • the fifth barrier layer 520 and the third barrier layer 230 are arranged in the same layer, and their materials and thicknesses are the same, that is, the material of the fifth barrier layer 520 and the material of the third barrier layer 230 are the same, and the thickness of the fifth barrier layer 520 The thickness is the same as that of the third barrier layer 230. That is, the fourth barrier layer 510 and the second barrier layer 220 may be two film layers formed of the same material in the same patterning process, and the fifth barrier layer 520 and the third barrier layer 230 are also made of the same material in the same step. The two film layers formed in the patterning process save process.
  • the “same layer” here and later refers to the relationship between multiple film layers formed by the same material after the same step (for example, one-step patterning process).
  • the “same layer” here does not always mean that multiple film layers have the same thickness or that multiple film layers have the same height in the cross-sectional view.
  • the first barrier layer 210 and the flat layer 108 are provided in the same layer, and the thickness and material of both are the same.
  • the thickness of the first barrier layer 210 is the same as the thickness of the flat layer 108
  • the material of the first barrier layer 210 is the same as the material of the flat layer 108.
  • the first barrier layer 210 may be formed in the same layer as the planarization layer 108, for example, it may be a part of the planarization layer 108, that is, the planarization layer material is patterned to form the planarization layer 108 and the first barrier layer 210 is formed at the same time.
  • the thickness of the flat layer is relatively thick, for example, 1.6-2.5 microns.
  • the thickness of the first barrier layer is relatively thick.
  • the second barrier layer 220 and the fourth barrier layer 510 can be formed in the same layer as the pixel defining layer 109, and the materials and thickness of the three are the same.
  • it may be a part of the pixel defining layer 109, that is, when the pixel defining layer material is patterned to form the pixel defining layer 109, the second barrier layer 220 of the first barrier portion 200 and the fourth barrier layer of the second barrier portion 500 are formed at the same time. 510.
  • FIG. 2C is a schematic diagram of a partial plan structure of a display panel provided by another example of an embodiment of the present disclosure
  • FIG. 2D is a schematic diagram of a cross-sectional structure taken along the line CC' in FIG. 2C.
  • the peripheral area 102 is arranged around the display area 101, and the first blocking part 200 may be arranged in a ring structure surrounding the display area 101.
  • the first blocking part 200 includes a first part 201 and a second part 202.
  • the second part 202 is a part other than the first part 201 in the first blocking part 200, that is, the first part 201 and the second part 202 form a ring-shaped second part.
  • a blocking part 200 is a part other than the first part 201 in the first blocking part 200, that is, the first part 201 and the second part 202 form a ring-shaped second part.
  • the first part 201 of the first blocking part 200 is a blocking part located on one side of the display area 101, and the second part 202 of the first blocking part 200 is surrounding the display area 101.
  • Three-sided blocking part is a blocking part located on one side of the display area 101, and the second part 202 of the first blocking part 200 is surrounding the display area 101.
  • the second sub-blocking portion 212 is along a fourth direction that intersects the extending direction of the second portion 202 (FIG. 2C takes the sub-portion of the second portion 202 extending in the X direction as an example, then The direction intersecting the extension direction of the sub-part may be the Z direction).
  • the maximum dimension is smaller than the minimum dimension of the first sub-blocking portion 211 along the fourth direction so that the packaging layer is far away from the first sub-blocking portion 211 and the second sub-blocking portion.
  • the surface at the junction of 212 forms a third slope 312.
  • the inclination angle of the third slope 312 is approximately the same as that of the first slope 311 shown in FIG.
  • the size relationship between the first sub-blocking portion 211 and the second sub-blocking portion 212 in the first portion 201 of the first blocking portion 200 is The size relationship between the first sub-blocking portion 211 and the second sub-blocking portion 212 in the second portion 202 is the same.
  • the inclination angle of the third slope 312 is about 20°-35°.
  • the inclination angle of the third slope is about 27° to 33°.
  • the inclination angle of the third slope 312 is about 30°.
  • the fourth direction is perpendicular to the extension direction of the second part 202.
  • the film layer 4000 used to form the touch signal line covers a part of the third slope 312 formed by the encapsulation layer 300 at the junction of the first sub-blocking portion 211 and the second sub-blocking portion 212 so that the film layer 4000 is far away from the third slope.
  • the surface of the slope 312 forms a fourth slope 402.
  • the sizes of the first sub-blocking portion and the second sub-blocking portion in the second part of the first blocking portion are different, so that the surface of the encapsulation layer at a location far from the boundary of the first sub-blocking portion and the second sub-blocking portion forms a third After the slope, the film layer deposited on the encapsulation layer for forming the touch signal line is not easy to be residual metal at the third slope position during the patterning process of forming the touch signal line.
  • the film layer 4000 on the encapsulation layer shown in FIG. 2D is a film layer for forming touch signal lines. After the touch signal lines are patterned, the film layer will be removed.
  • the embodiments of the present disclosure are not limited to this, and the size relationship between the first sub-blocking portion and the second sub-blocking portion in the second portion of the first blocking portion may also be different from the size of the two in the first portion of the first blocking portion. relationship.
  • the surface of the first sub-blocking portion facing the second sub-blocking portion completely overlaps with the surface of the second sub-blocking portion facing the first sub-blocking portion to facilitate manufacturing.
  • a touch electrode 420 is further provided on the side of the encapsulation layer 300 located in the display area 101 away from the base substrate 100, and the touch signal line 400 is electrically connected to the touch electrode 420 to transmit signals.
  • the touch electrode 420 includes a plurality of first touch electrodes 421 and a plurality of second touch electrodes 422, and the first touch electrodes 421 and the second touch electrodes 422 are cross-insulated and arranged.
  • the plurality of first touch electrodes 421 extend in the X direction and are arranged in the Z direction; the plurality of second touch electrodes 422 extend in the Z direction and are arranged in the X direction.
  • the plurality of first touch electrodes 421 and the plurality of second touch electrodes 422 are connected to the lead terminal area through the plurality of touch signal lines 400, and the touch operation can be realized by applying detection electrical signals to the plurality of touch signal lines 400 The detection and detection of the location where the touch operation occurs.
  • the first touch electrode 421 is connected to the touch signal line 400 on both sides of the X direction to realize bilateral driving.
  • the embodiment of the present disclosure is not limited to this.
  • the first touch electrode may also be connected to the touch signal on only one side. Line to achieve unilateral drive.
  • the plurality of first touch electrodes 421 and the plurality of second touch electrodes 422 can form capacitances at overlapping positions.
  • the touch layer may include a mutual-capacitive touch structure or a self-capacitive touch structure.
  • the touch control layer can also be made of materials such as nano silver wires.
  • one of the first touch electrode and the second touch electrode may be patterned and formed on the surface of the packaging layer.
  • the touch electrodes and the touch signal lines may directly contact the surface of the packaging layer (that is, on-cell type), that is, the touch signal lines are directly patterned and formed on the packaging layer; or the touch electrodes And an insulating layer may be provided between the touch signal line and the packaging layer.
  • the display panel provided by the embodiments of the present disclosure eliminates the use of the base material of the touch layer, which can not only reduce the cost, but also improve the integration to make the display panel lighter, thinner and easier fold.
  • FIG. 2E is a schematic diagram of a cross-sectional structure of a display panel provided by another example in an embodiment of the present disclosure.
  • the difference between the display panel in the example shown in FIG. 2E and the display panel shown in FIG. 2B lies in the cross-section of the first barrier layer 210 in the first portion of the first barrier portion 200 by a plane perpendicular to the first direction. Roughly trapezoidal.
  • the first included angle between the first oblique side 203 included in the trapezoid and the base substrate 100 is about 20°-35°. That is, in the first part of the first barrier, along the second direction, the maximum size of the second sub barrier is equal to the minimum size of the first sub barrier, and therefore, the cross section of the first barrier is trapezoidal.
  • the maximum size of the second sub-blocking part is smaller than the minimum size of the first sub-blocking part, but the materials of the two sub-blocking parts are cured at a high temperature. A certain flow will occur in the middle, so that the cross-sectional shape of the two sub-blocking parts is trapezoidal, and the maximum size of the second sub-blocking part is equal to the minimum size of the first sub-blocking part.
  • the angle between the oblique side of the trapezoid and the base substrate 10 is relatively large, for example, greater than 40°, which may result in the formation of the first barrier layer There is residual metal in the touch signal line, which causes defects.
  • the first barrier portion shown in FIG. 1B is a trapezoid
  • the first angle between the first oblique side of the first barrier layer including the first sub barrier portion and the second sub barrier portion and the base substrate in this example is about 20°-35°, the angle of the slope of the encapsulation layer can be made smaller, and the slope of the encapsulation layer can be smoother, thereby reducing the residual metal material of the touch signal line patterned on the slope.
  • the first included angle between the first oblique side 203 and the base substrate 100 is about 25°-35°.
  • the first included angle between the first oblique side 203 and the base substrate 100 is about 30°.
  • FIG. 2E schematically shows that in the first portion 201 of the first barrier portion 200, the second barrier layer 220 covers the surface of the first barrier layer 210 away from the base substrate 100 and the side surface of the first barrier layer 210.
  • the three barrier layer 230 covers the surface of the second barrier layer 220 away from the base substrate 100 and the side surface of the second barrier layer 220.
  • the maximum dimension of the second barrier layer 220 in the second direction may not be greater than the minimum dimension of the second sub-blocking part 212 in the second direction
  • the maximum dimension of the third barrier layer 230 in the second direction may be It is not greater than the minimum size of the second barrier layer 220 in the second direction.
  • the maximum dimension of the second barrier layer 220 along the second direction is equal to the minimum dimension of the second sub-barrier portion 212 along the second direction
  • the maximum dimension of the third barrier layer 230 along the second direction is equal to that of the second barrier layer 220 along the second direction.
  • the minimum size of the direction is not limited thereto.
  • FIG. 2E schematically shows that the fifth barrier layer 520 covers the surface of the fourth barrier layer 510 on the side away from the base substrate 100 and the side surface of the fourth barrier layer 510.
  • the embodiments of the present disclosure are not limited thereto, for example, along the second direction, the maximum size of the fifth barrier layer 520 is not greater than the minimum size of the fourth barrier layer 510.
  • the maximum size of the fifth barrier layer 520 may be equal to the minimum size of the fourth barrier layer 510.
  • the cross section of the second blocking portion 500 cut by a plane perpendicular to the extending direction of the second blocking portion 500 includes a second oblique side 501.
  • the absolute value of the difference in the inclination angle of a slope 311 is greater than 0° and less than 20°. That is, the absolute value of the difference between the second included angle between the second oblique side 501 and the base substrate 100 and the first included angle between the first oblique side 203 and the base substrate 100 is greater than 0° and less than 20°.
  • the angles between the hypotenuses of the two and the base substrate are the same.
  • the thickness of the second blocking portion is relatively low, it will not have a large impact on the touch signal lines formed thereon, so the second blocking portion is not adjusted in the forming process.
  • the inclined angle of the formed hypotenuse is the same as the angle of the second blocking portion shown in FIG. 1B, and both are greater than 40°.
  • the first blocking part adjusts the size relationship between the first and second sub-blocking parts in the process of forming the first sub-blocking part and the second sub-blocking part (the size of the second sub-blocking part is smaller than the size of the first sub-blocking part), so
  • the inclination angle of the first oblique side of the cross-section of the first blocking portion in this example is significantly smaller than the inclination angle of the second oblique side of the cross-section of the second blocking portion. Therefore, in the process of patterning the touch signal line located on the first blocking portion, metal residue is not easy to appear.
  • FIG. 2F is a schematic diagram of a cross-sectional structure of a display panel provided by another example in an embodiment of the present disclosure.
  • the display panel in the example shown in FIG. 2E is different from the display panel shown in FIG. 2B in that in the first part of the first barrier 200, the cross-sectional shapes of the second barrier layer 220 and the third barrier layer 230 are not standard. Trapezoid, the cross-sectional shape of the two barrier layers is approximately trapezoidal. That is, when the second barrier layer and the third barrier layer are formed, the two layers of materials will flow to a certain extent during the high-temperature curing process, so that the cross-sectional shape of the two barrier layers is rounded.
  • the maximum size of the second sub-blocking portion is smaller than the minimum size of the first sub-blocking portion, but the materials of the two sub-blocking portions are cured at a high temperature. A certain flow will occur, so that the cross-sectional shapes of the two sub-blocking parts are rounded trapezoids; or the maximum size of the second sub-blocking part is equal to the minimum size of the first sub-blocking part, and there is no obvious boundary between the two.
  • the second barrier layer covers the surface of the first barrier layer away from the base substrate and the side surface of the first barrier layer
  • the third barrier layer covers the surface of the second barrier layer away from the first barrier layer and the first barrier layer.
  • the slope angle of the third barrier layer is smaller, so that the encapsulation layer formed on the third barrier layer forms the first slope angle of the first slope at a location away from the junction of the first sub-barrier portion and the second sub-barrier portion It is about 20°-35°, thereby reducing the slope angle of the touch signal line at the edge of the first blocking portion, thereby reducing the probability of short circuit between adjacent touch signal lines to improve the yield of the display panel.
  • the encapsulation layer 300 covering the first barrier 200 includes a flat portion E1 and a slope portion E2, and the slope portion E2 includes a first slope 311.
  • the thickness of the encapsulation layer 300 covering the first barrier portion 200 is h (this thickness does not include the thickness of the flat portion located outside the first barrier portion).
  • the embodiment of the present disclosure uses the line 313 between the point O and the slope part E2 of the encapsulation layer 300 away from the end point P of the flat part E1 at a position of half the height of the encapsulation layer 300
  • the slope is taken as an example of the slope of the first slope 311, and the angle between the connection line 313 and the plane where the base substrate 100 is located is the inclination angle of the first slope 311.
  • FIG. 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided according to another example of an embodiment of the present disclosure.
  • the part of the display area 101 of the display panel shown in FIG. Part of the structure is omitted between the dotted lines in the display area 101 in 3.
  • the peripheral area of the display panel in FIG. 3 uses the structure shown in FIG. 2E as an example, but it is not limited to this, and may also be the structure shown in FIG. 2B or the structure shown in FIG. 2F.
  • Part of the display area 101 of FIG. 3 schematically shows the pixel circuit structure layer 130, the flat layer 108, and the light-emitting element 120. As shown in FIG. 3, the difference from the display panel shown in FIG.
  • the display panel in this example includes a first source-drain metal layer 107 and a second source-drain metal layer 110 (dual SD structure).
  • the first barrier part 200 and the second barrier part 500 may be formed on the second source-drain metal layer 110.
  • the materials of the above two source and drain metal layers are the same, and both may have a titanium-aluminum-titanium structure.
  • the design of two source and drain metal layers can help improve the brightness uniformity of the display panel and reduce the power consumption of the driver IC.
  • the display panel includes a first flat layer 1081 located on the side of the second source-drain metal layer 110 away from the first source-drain metal layer 107, and a second flat layer located between the two source-drain metal layers. 1082, the two source and drain metal layers are electrically connected in the display area 101.
  • the two layers of source and drain metal layers are used as data signal traces, and the design of electrical connection between the two data signal traces on different layers can reduce the spacing between the traces.
  • the side of the pixel defining layer 109 in the display area 101 facing the base substrate 100 is further provided with a first electrode 121 of a light-emitting element, and the first electrode 121 is electrically connected to the second source-drain metal layer 110 .
  • FIG. 4A is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the disclosure
  • FIG. 4B and FIG. 4C are schematic process flowcharts of forming a first barrier layer.
  • the manufacturing method of the display panel includes the following steps.
  • S201 Provide a base substrate.
  • the display panel shown in FIG. 3 can be formed by the manufacturing method provided by the embodiment of the present disclosure.
  • the base substrate 100 includes a display area 101 and a peripheral area 102 located at the periphery of the display area 101.
  • the base substrate 100 may be a flexible base substrate, such as polyimide (PI), to form a flexible display device.
  • PI polyimide
  • the material of the flexible base substrate 100 is not limited to polyimide.
  • a buffer layer 103, a first gate insulating layer 104, a second gate insulating layer 105, and an interlayer insulating layer may be sequentially formed on the base substrate 100.
  • the portion of the first barrier 200 formed in the peripheral region 102 extends in a first direction parallel to the base substrate 100 (a direction perpendicular to the X direction shown in FIG. 3).
  • forming the first barrier 200 includes: forming a first barrier material 3100 on the base substrate 100.
  • FIG. 4B only shows the base substrate 100 and the first barrier layer material 3100, and does not show the film layer between the two.
  • the first barrier layer material 3100 may include organic materials, such as materials including one or a combination of polyimide, polyamide, polycarbonate, epoxy, etc., or photoresist materials. Wait.
  • a one-step patterning process is used for the first barrier layer material to form a stacked first sub-blocking portion 211 and a second sub-blocking portion 212 to form the side of the first blocking portion 200 closest to the base substrate 100 ⁇ (First barrier layer 210).
  • using a one-step patterning process to form the stacked first sub-blocking portion 211 and the second sub-blocking portion 212 includes: using a half-tone mask 600 to form the first sub-blocking portion 211 and the second sub-blocking portion 211 Two sub-blockers 212.
  • the second sub-blocking portion 212 is formed on the side of the first sub-blocking portion 211 away from the base substrate 100, and along the second direction (X direction) intersecting the first direction, the maximum size of the second sub-blocking portion 212 is It is smaller than the minimum size of the first sub-blocking portion 211 to form a stepped structure.
  • FIG. 4C schematically shows that the cross-sectional shapes of the first sub-blocking portion and the second sub-blocking portion are rectangles. In the actual process, the cross-sectional shapes of the two sub-blocking portions may both be trapezoids.
  • the half-tone mask 600 includes a completely light-transmitting area 610, a partially light-transmitting area 620, and a non-light-transmitting area 630.
  • Forming the first sub-blocking portion 211 and the second sub-blocking portion 212 includes: aligning the non-transmissive area 630 of the half-tone mask 600 with the area of the first barrier layer material where the second sub-blocking portion 212 is to be formed, and aligning the half-tone mask 600 with the area where the second sub-barrier 212 is to be formed.
  • the partial light-transmitting area 620 of the tone mask 600 is directly opposite to the area where the first sub-blocking portion 211 is to be formed except for the overlapped portion with the second sub-blocking portion 212, and the completely light-transmitting area 610 of the half-tone mask 600 is opposite to the area except for the overlapping portion with the second sub-blocking portion 212.
  • the area where the first sub-blocking portion 211 is to be formed is directly opposite, and then the laser 700 is used to expose the first blocking layer material.
  • a fully exposed area is formed at a position where the first barrier layer 210 is not required, and a position where a thinner first barrier layer 210 is formed (that is, the portion of the first sub-barrier portion 211 except for the overlapping portion of the second sub-barrier portion 212 A part of the exposure area is formed at a location other than that, and exposure is not performed at the location where the thicker first barrier layer 210 is formed (ie, the second sub-barrier portion 212).
  • the first barrier layer material 3100 is then developed and cured to form the first sub-blocking part 211 and the second sub-blocking part 212.
  • This example uses a material including a positive photoresist as the material of the first barrier layer for description. This example is not limited to this.
  • a material including a negative photoresist can also be used.
  • a negative photoresist material is used for the layer material, the positions of the completely light-transmitting area and the non-light-transmitting area of the halftone mask are interchanged.
  • the above-mentioned half-tone mask is used to form the first sub-blocking portion.
  • the method of the first blocking part and the second sub-blocking part are applicable to each position of the first blocking part.
  • the size relationship between the first sub-blocking portion and the second sub-blocking portion in the second portion of the first blocking portion is different from the size relationship between the first sub-blocking portion and the second sub-blocking portion in the first portion
  • the half-tone mask is used to form the first sub-blocking portion and the second sub-blocking portion.
  • the method of the sub-blocking part is only applicable to the first part of the first blocking part.
  • the first sub-blocking portion 211 and the second sub-blocking portion 212 are an integrated structure formed by patterning the first barrier layer material 3100 in one step, thereby saving process.
  • the area where the first sub-barrier portion 211 and the second sub-barrier portion 212 overlap is the area where the thickness of the first barrier layer 210 is large, and the area where only the first sub-barrier portion 211 is provided is the area where the thickness of the first barrier layer 210 is small. Therefore, the first barrier layer is a film layer with two different thicknesses.
  • the embodiments of the present disclosure schematically show that the first barrier layer only includes two different thicknesses, but is not limited to this, and may also include more different thicknesses to form more stepped structures.
  • the first barrier layer 210 may be formed in the same layer as the first flat layer 1081, for example, may be a part of the first flat layer 1081, that is, the first flat layer 1081 is formed by patterning the first flat layer material while forming the first flat layer 1081.
  • the position where the first flat layer is to be formed may be directly opposite to the non-transmissive area of the half-tone mask so that the thickness of the flat layer formed is greater than the thickness of the first barrier layer (the first The sum of the thickness of the sub-blocking portion and the second sub-blocking portion) is the same.
  • the embodiment of the present disclosure is not limited to this. It may also be that the position where the first flat layer is to be formed may be directly opposite to the partial light-transmitting area of the halftone mask so that The thickness of the formed flat layer is the same as the thickness of the first sub-barrier.
  • forming the first barrier portion 200 further includes: forming a second barrier layer 220 on the side of the second sub-barrier portion 212 away from the base substrate 100.
  • the maximum size of the second barrier layer may not be greater than the minimum size of the second sub-barrier portion.
  • the material of the second barrier layer formed will flow to a certain extent during the high-temperature curing process, so that the cross-sectional shape of the second barrier layer may be trapezoidal, and the second barrier layer covers the first barrier layer away from the base substrate. The surface of the side and the side of the first barrier layer.
  • the embodiments of the present disclosure are not limited to this.
  • the maximum size of the second barrier layer may not be greater than the minimum size of the second sub-barrier portion.
  • the maximum size of the second barrier layer is equal to the minimum size of the second sub-barrier portion, the surface of the second barrier layer facing the second sub-barrier portion and the surface of the second sub-barrier portion facing the second barrier layer completely overlap.
  • the maximum size of the second barrier layer may be smaller than the minimum size of the second sub-barrier portion to form a stepped structure.
  • the second barrier layer 220 may be formed in the same layer as the pixel defining layer 109, for example, may be a part of the pixel defining layer 109, that is, the pixel defining layer material is patterned to form the pixel defining layer 109 at the same time.
  • the second barrier layer 220 of the first barrier portion 200 is formed.
  • forming the first barrier portion 200 further includes: forming a third barrier layer 230 on a side of the second barrier layer 220 away from the first barrier layer 210.
  • the material of the third barrier layer 230 may be an organic layer, which plays a role of supporting subsequent film layers.
  • the maximum size of the third barrier layer may not be greater than the minimum size of the second barrier layer.
  • the material of the formed third barrier layer will flow to a certain extent during the high-temperature curing process, so that the cross-sectional shape of the third barrier layer may be trapezoidal, and the third barrier layer covers the second barrier layer away from the base substrate. The surface of the side and the side of the second barrier layer.
  • the embodiments of the present disclosure are not limited to this.
  • the maximum size of the third barrier layer may not be greater than the minimum size of the second barrier layer.
  • the formation of the first blocking portion 200 may also include forming the second blocking portion 500.
  • the second blocking portion 500 is formed in the peripheral area 102 and is located near the display area 101 of the first blocking portion 200. One side.
  • the extension direction of the second blocking portion 500 and the first blocking portion 200 are the same.
  • forming the second barrier 500 includes sequentially forming a fourth barrier layer 510 and a fifth barrier layer 520 on the base substrate 100.
  • the fourth barrier layer 510 may be formed in the same layer as the second barrier layer 220 and the pixel defining layer 109, for example, may be a part of the pixel defining layer 109, that is, the pixel defining layer material is patterned to form the pixel defining layer 109 at the same time.
  • the second barrier layer 220 of the first barrier portion 200 and the fourth barrier layer 510 of the second barrier portion 500 are removed.
  • the fifth barrier layer 520 and the third barrier layer 230 may be formed by patterning the same material and using the same mask to save process.
  • S203 forming an encapsulation layer located in the display area and the peripheral area on the side of the first blocking portion away from the base substrate.
  • the encapsulation layer 300 covers the first barrier portion 200 to form a first slope 311 at the interface of the first sub barrier portion 211 and the second sub barrier portion 212 and away from the surface of the base substrate.
  • the encapsulation layer can form a slope at a position corresponding to the first barrier layer.
  • forming the encapsulation layer 300 may include sequentially forming a stacked first inorganic layer 310, an organic layer 320, and a second inorganic layer 330.
  • the embodiment of the present disclosure is not limited to this, as long as the organic layer and the inorganic layer are alternately formed That's it.
  • the material of the inorganic layer in the encapsulation layer 300 includes, for example, silicon nitride, silicon oxide, or silicon oxynitride.
  • Inorganic materials are highly dense and can prevent the intrusion of water, oxygen, etc. from affecting the performance of the light-emitting element.
  • the material of the organic layer includes, for example, polymer resins, such as polyimide, polyacrylate, etc., and the organic layer has the functions of planarization and stress relaxation.
  • S204 forming a plurality of touch signal lines on a surface of the packaging layer that is away from the base substrate.
  • the touch layer material can be directly formed on the surface of the packaging layer, and then the touch layer material can be patterned to form touch electrodes located in the display area and touch signal lines located in the peripheral area. That is, the touch signal line is directly patterned and formed on the surface of the packaging layer.
  • the plurality of touch signal lines 400 extend in a direction intersecting the X direction, and thus, the plurality of touch signal lines 400 cover the portion of the first blocking portion 200 extending in the first direction.
  • the touch signal line 400 covers the first sub-blocking portion 211 and the second sub-blocking portion 212, that is, the touch signal line 400 covers the encapsulation layer 300 at the junction of the first sub-blocking portion 211 and the second sub-blocking portion 212
  • the formed first slope 311 has an inclination angle of about 20°-35°.
  • the encapsulation layer can form an inclination angle of about 20°-35° at a position corresponding to the first barrier layer. Slope. Therefore, compared to the first barrier layer without the step structure shown in FIGS. 1A and 1B, the touch signal line directly patterned on the packaging layer covers the edge area of the first barrier portion (where the packaging layer slope is located) The part is smoother, thereby reducing the probability of residual metal formation in the process of making the touch signal line to improve the yield.
  • Another embodiment of the present disclosure provides a display device including the display panel provided in any of the foregoing examples.
  • the packaging layer can form a slope at a position corresponding to the first barrier layer, thereby reducing The probability of residual metal formation in the process of making the touch signal line is improved to improve the yield rate.

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Abstract

一种显示面板及其制作方法、显示装置。显示面板包括衬底基板(100)、第一阻挡部(200)、封装层(300)和触控信号线(400)。第一阻挡部(200)位于周边区(102)，第一阻挡部(200)包括第一阻挡层(210)和第二阻挡层(220)；封装层(300)覆盖第一阻挡部(200)；触控信号线(400)位于封装层(300)上，且覆盖第一阻挡部(200)的部分。第一阻挡层(210)包括第一子阻挡部(211)和第二子阻挡部(212)，第二子阻挡部(212)位于第一子阻挡部(211)与第二阻挡层(220)之间，第二子阻挡部(212)的最大尺寸不大于第一子阻挡部(211)的最小尺寸。在第一阻挡层中形成尺寸不同的第一子阻挡部和第二子阻挡部，可以降低触控信号线之间发生短路的几率。

Description

显示面板及其制作方法、显示装置 技术领域
本公开至少一个实施例涉及一种显示面板及其制作方法、显示装置。
背景技术
有机发光显示装置包括衬底以及形成在衬底上的包括发光器件的多个像素，像素上设置有覆盖像素的封装层。封装层包括无机绝缘层和有机绝缘层。有机发光显示装置包括显示区和围绕显示区的周边区，周边区设置有阻挡部件以在形成封装层中的有机绝缘层的过程中，防止形成有机绝缘层的流体材料溢出衬底。
发明内容
本公开的至少一实施例提供一种显示面板及其制作方法、显示装置。
本公开的至少一实施例提供一种显示面板，包括：衬底基板、位于所述衬底基板上的第一阻挡部、封装层以及多条触控信号线。衬底基板包括显示区以及位于所述显示区周边的周边区；第一阻挡部位于所述周边区，且所述第一阻挡部的位于所述显示区一侧的第一部分沿平行于所述衬底基板的第一方向延伸，所述第一阻挡部包括第一阻挡层、位于所述第一阻挡层远离所述衬底基板的一侧的第二阻挡层以及位于所述第二阻挡层远离所述第一阻挡层的一侧的第三阻挡层；所述第二阻挡层覆盖所述第一阻挡层的远离所述衬底基板的表面以及所述第一阻挡层的侧面，所述第三阻挡层覆盖所述第二阻挡层的远离所述衬底基板的表面以及所述第二阻挡层的侧面；封装层位于所述显示区和所述周边区，且覆盖所述第一阻挡部；多条触控信号线位于所述封装层远离所述衬底基板的一侧，且沿与所述第一方向相交的第二方向延伸，所述多条触控信号线在所述衬底基板上的正投影与所述第一阻挡部的第一部分在所述衬底基板上的正投影交叠。所述第一阻挡层包括材料相同的第一子阻挡部和第二子阻挡部，所述第二子阻挡部位于所述第一子阻挡部与所述第二阻挡层之间；在所述第一阻挡部的第一部分中，沿所述第二方向，所述第二子阻挡部的最大尺寸不大于所述第一子阻挡部的最小尺寸以使所述封装层在远离所述第一子阻挡部 和所述第二子阻挡部交界位置处的表面形成的第一斜坡的倾斜角度为约20°～35°。
在一些示例中，所述第一斜坡的倾斜角度为约27°～33°。
在一些示例中，所述第一阻挡部的第一部分中的所述第一阻挡层被垂直于所述第一方向的平面所截的截面大致为梯形，所述梯形包括的第一斜边与所述衬底基板之间的第一夹角为约20°～35°。
在一些示例中，在所述第一阻挡部的第一部分中，所述第二阻挡层覆盖所述第一阻挡层远离所述衬底基板的表面以及所述第一阻挡层的侧面，所述第三阻挡层覆盖所述第二阻挡层远离所述第一阻挡层的表面以及所述第二阻挡层的侧面。
在一些示例中，所述周边区包括绑定区，所述第一阻挡部的第一部分位于所述显示区的靠近所述绑定区的一侧。
在一些示例中，所述多条触控信号线覆盖部分所述第一斜坡以使其远离所述第一斜坡的表面形成第二斜坡。
在一些示例中，所述第一阻挡部为围绕所述显示区的环状结构，所述第一阻挡部除所述第一部分以外的第二部分中，所述第二子阻挡部沿与所述第二部分延伸方向相交的第四方向的最大尺寸不大于所述第一子阻挡部沿所述第四方向的最小尺寸以使所述封装层在远离所述第一子阻挡部和所述第二子阻挡部交界位置处的表面形成第三斜坡，且所述第三斜坡的倾斜角度为约20°～35°。
在一些示例中，所述第一子阻挡部和所述第二子阻挡部一体成型。
在一些示例中，在所述第一阻挡部的第一部分中，所述第二子阻挡部在所述衬底基板上的正投影的沿所述第一方向的中心线与所述第一子阻挡部在所述衬底基板上的正投影的沿所述第一方向的中心线大致重合。
在一些示例中，所述第二阻挡层在所述衬底基板上的正投影的沿所述第一方向的中心线与所述第二子阻挡部的所述中心线大致重合。
在一些示例中，显示面板还包括：第二阻挡部，位于所述周边区，且位于所述第一阻挡部与所述显示区之间，所述第二阻挡部与所述第一阻挡部的延伸方向相同，且沿垂直于所述衬底基板的第三方向，所述第一阻挡部的尺寸大于所述第二阻挡部的尺寸。
在一些示例中，所述第二阻挡部被垂直于所述第二阻挡部的延伸方向的平面所截的截面包括第二斜边，所述第二斜边与所述衬底基板之间的第二夹角与 所述第一斜坡的倾斜角度之差的绝对值大于0°，且小于20°。
在一些示例中，所述第二阻挡部包括第四阻挡层以及位于所述第四阻挡层远离所述衬底基板一侧的第五阻挡层，所述第四阻挡层与所述第二阻挡层同层设置，且材料以及厚度均相同，所述第五阻挡层和所述第三阻挡层同层设置，且材料以及厚度均相同。
在一些示例中，显示面板还包括：位于所述显示区的像素电路结构层；位于所述像素电路结构层远离所述衬底基板一侧的平坦层；以及位于所述平坦层远离所述像素电路结构层一侧的发光元件。所述第一阻挡层与所述平坦层同层设置，且厚度以及材料均相同。
在一些示例中，显示面板还包括：位于所述平坦层远离所述像素电路结构层一侧的像素限定层。所述第二阻挡层与所述像素限定层同层设置，且厚度以及材料均相同。
在一些示例中，沿垂直于所述衬底基板的第三方向，所述第一子阻挡部与所述第二子阻挡部的尺寸的比值为约0.8～1.2。
在一些示例中，沿所述第三方向，所述第一阻挡层的尺寸为约1.6～2.5微米。
在一些示例中，沿所述第三方向，所述第一阻挡部的尺寸为约3～5微米。
在一些示例中，所述第一子阻挡部沿所述第二方向的尺寸为约25～45微米。
在一些示例中，沿所述第二方向，所述第一子阻挡部的尺寸与所述第二子阻挡部的尺寸之差为所述第一子阻挡部的尺寸的20％～30％。
本公开至少一实施例提供一种显示面板的制作方法，包括：提供衬底基板，所述衬底基板包括显示区以及位于所述显示区周边的周边区；在所述衬底基板的周边区形成第一阻挡部，其中，所述第一阻挡部的第一部分沿平行于所述衬底基板的第一方向延伸，形成所述第一阻挡部的第一部分包括：在所述衬底基板上形成第一阻挡层材料；对所述第一阻挡层材料采用一步图案化工艺形成层叠设置的第一子阻挡部和第二子阻挡部，所述第二子阻挡部位于所述第一子阻挡部远离所述衬底基板的一侧，沿与所述第一方向相交的第二方向，所述第二子阻挡部的最大尺寸不大于所述第一子阻挡部的最小尺寸；在所述第二子阻挡部远离所述衬底基板的一侧形成第二阻挡层；在所述第二阻挡层远离所述第一阻挡层的一侧形成第三阻挡层；在所述第一阻挡部远离所述衬底基板的一侧形成位于所述显示区和所述周边区的封装层，所述封装层覆盖所述第一阻挡部的 第一部分以在所述第一子阻挡部和所述第二子阻挡部交界位置处且远离所述衬底基板的表面形成第一斜坡，所述第一斜坡的倾斜角度为约20°～35°；以及在所述封装层远离所述衬底基板的一侧表面形成沿所述第二方向延伸的多条触控信号线，所述多条触控信号线覆盖所述封装层的部分所述第一斜坡。
在一些示例中，采用一步图案化工艺形成层叠设置的第一子阻挡部和第二子阻挡部包括：采用半色调掩模形成所述第一子阻挡部和所述第二子阻挡部。
在一些示例中，所述半色调掩模包括完全透光区、部分透光区以及非透光区。形成所述第一子阻挡部和所述第二子阻挡部包括：将所述半色调掩模的所述非透光区与所述第一阻挡层材料中待形成所述第二子阻挡部的区域正对，将所述半色调掩模的所述部分透光区与待形成所述第一子阻挡部的除与所述第二子阻挡部重叠部分以外的区域正对，将所述半色调掩模的完全透光区与除了待形成所述第一子阻挡部的区域正对，然后对所述第一阻挡层材料进行曝光；对所述第一阻挡层材料进行显影和固化以形成所述第一子阻挡部和所述第二子阻挡部。
本公开至少一实施例提供一种显示装置，包括上述的显示面板。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1A为一种显示面板的局部平面结构示意图；
图1B为沿图1A中的AA’线所截的截面示意图；
图2A为根据本公开一实施例的一示例提供的一种显示面板的局部平面结构示意图；
图2B为沿图2A中的BB’线所截的截面结构示意图；
图2C为本公开一实施例的另一示例提供的显示面板的局部平面结构示意图；
图2D为沿图2C中的CC’线所截的截面结构示意图；
图2E为本公开一实施例的另一示例提供的显示面板的局部平面结构示意图；
图2F为本公开一实施例的另一示例提供的显示面板的局部截面结构示意 图；
图3为根据本公开一实施例的另一示例提供的显示面板的局部截面结构示意图；
图4A为根据本公开一实施例提供的显示面板的制作方法的示意性流程图；
图4B和图4C为形成第一阻挡层的示意性工艺流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。
图1A为一种显示面板的局部平面结构示意图，图1B为沿图1A中的AA’线所截的截面示意图。如图1A和图1B所示，显示面板包括显示区11和位于显示区11周边的周边区12，周边区12可围绕显示区11，也可以位于显示区11周边的一部分。图1A和图1B示意性的示出了显示面板的周边区12的部分膜层的平面以及截面图。
如图1A和图1B所示，显示面板的周边区12可以包括衬底基板10和依次位于衬底基板10上的缓冲层13、第一栅极绝缘层14、第二栅极绝缘层15、层间绝缘层16、源漏金属层17、平坦层18以及像素限定层19。上述源漏金属层17对应于显示区11中的像素电路结构的薄膜晶体管(未示出)的源极和漏极以及数据线。位于显示区11的平坦层18设置在薄膜晶体管上，且位于显示区11的平坦层18远离衬底基板10的一侧还设置有发光元件(未示出)。发光元件可以包括发光功能层以及位于发光功能层两侧的第一电极和第二电极。位 于发光功能层靠近衬底基板10一侧的第一电极可以通过平坦层18中设置的过孔与薄膜晶体管的漏极电连接。在第一电极远离衬底基板10的一侧设置有像素限定层19以利于形成发光功能层。发光功能层可以包括发光层，还可包括其他功能层，例如还可包括空穴注入层、空穴传输层、电子传输层和电子注入层等至少之一，但不限于此。在发光元件远离衬底基板10的一侧设置有封装层30，封装层30覆盖发光元件以防止发光元件被外界的水氧侵蚀，起到保护发光元件的作用。封装层30包括依次层叠设置的无机层31和有机层32，图1B示意性的示出封装层30包括两层无机层31以及位于两层无机层31之间的一层有机层32。
如图1A和图1B所示，在周边区12设置有第一阻挡部20和位于第一阻挡部20靠近显示区11的一侧的第二阻挡部50，两个阻挡部可以位于源漏金属层17上，用于防止封装层30中的有机层32在制作过程中溢出衬底基板10。封装层30中的两层无机层31可以覆盖第一阻挡部20和第二阻挡部50以增加水氧侵蚀显示面板内部的路径，提高显示面板的封装效果。图1A和图1B仅示出了位于显示区11一侧的周边区12中的部分阻挡部，在周边区12围绕显示区11设置时，两个阻挡部可以均设置为围绕显示区11的环状结构以阻挡有机层的材料向四周溢出。
如图1A和图1B所示，沿Y方向，第一阻挡部20包括依次层叠设置的第一阻挡层21、第二阻挡层22以及第三阻挡层23，第二阻挡部50包括依次层叠设置的第四阻挡层51和第五阻挡层52。第一阻挡层21可与位于显示区11的平坦层18同层形成，例如，第一阻挡层21可以是平坦层的一部分，即对平坦层材料图案化形成平坦层18的同时形成了第一阻挡层21。第二阻挡层22和第四阻挡层51可与像素限定层19同层形成，例如，第二阻挡层22和第四阻挡层51可以是像素限定层19的一部分，即对像素限定层材料图案化形成像素限定层19的同时形成了第一阻挡部20的第二阻挡层22和第二阻挡部50的第四阻挡层51。第三阻挡层23和第五阻挡层52可为同一材料层图案化形成。由此，沿Y方向，第一阻挡部20的高度大于第二阻挡部50的高度以在有机层的材料从第二阻挡部溢出后能够被第一阻挡部阻挡。
如图1A和图1B所示，显示面板还包括位于封装层30远离衬底基板10一侧表面的触控层，形成在显示区11中的触控层为触控电极，形成在周边区12中的触控层为触控信号线40，触控信号线40与触控电极电连接以传输信号。 触控信号线40沿X方向延伸，一部分阻挡部沿Y方向延伸，触控信号线40的延伸方向与阻挡部的一部分的延伸方向相交。图1A和图1B所示的触控层可以是与封装层30直接接触的(即为on cell型)，即触控层直接图案化形成在封装层30的表面上。但不限于此，触控层与封装层之间还可以设置一层缓冲层。相比于外挂触控层的显示面板，图1B所示的显示面板省去了触控层的基材的使用，既可以降低成本，还可以提高集成度以使显示面板更轻薄且更容易折叠。
在研究中，本申请的发明人发现：如图1A和图1B所示，由于沿垂直于衬底基板10的Y方向，第一阻挡部20的高度较大(例如为3～6微米)，导致位于第一阻挡部20上的封装层30具有较大的段差，从而导致触控信号线40图案化形成在封装层30表面的过程中，因在第一阻挡部20的边缘具有较大段差H1，导致在封装层30的拐角区域24(即第一阻挡部20沿X方向的边缘区域24)残留金属材料。残留在第一阻挡部20的拐角区域24的金属材料可能导致相邻的触控信号线40电连接而形成不良。需要说明的是，图1B所示的截面图中部分膜层(例如第一阻挡部20包括的膜层以及第二阻挡部50包括的膜层等)的形状为矩形形状仅是示意性的。在实际工艺中，在第二阻挡层和第三阻挡层高温固化过程中，这两个阻挡层会发生一定流动，导致各阻挡层的截面形状可能为近似梯形，且第二阻挡层覆盖了第一阻挡层远离衬底基板的一侧表面以及第一阻挡层的侧面，第三阻挡层覆盖了第二阻挡层远离衬底基板的一侧表面以及第二阻挡层的侧面。即，上述膜层的截面形状可以为梯形，则封装层30在拐角区域24内具有倾斜的表面，该倾斜表面与衬底基板的夹角在40°～45°的范围内，由此，触控信号线40容易在该拐角区域24内残留金属材料。
本公开的实施例提供一种显示面板及其制作方法、显示装置。该显示面板包括：衬底基板、第一阻挡部、封装层以及多条触控信号线。衬底基板包括显示区以及位于显示区周边的周边区；第一阻挡部位于周边区，且第一阻挡部的位于显示区一侧的第一部分沿平行于衬底基板的第一方向延伸，第一阻挡部包括第一阻挡层、位于第一阻挡层远离衬底基板的一侧的第二阻挡层以及位于第二阻挡层远离第一阻挡层的一侧的第三阻挡层；第二阻挡层覆盖第一阻挡层的远离衬底基板的表面以及第一阻挡层的侧面，第三阻挡层覆盖第二阻挡层的远离衬底基板的表面以及第二阻挡层的侧面。封装层位于显示区和周边区，且覆盖第一阻挡部；多条触控信号线位于封装层远离衬底基板的一侧，且沿与第一 方向相交的第二方向延伸，多条触控信号线在衬底基板上的正投影与第一阻挡部的第一部分在衬底基板上的正投影交叠。第一阻挡层包括材料相同的第一子阻挡部和第二子阻挡部，第二子阻挡部位于第一子阻挡部与第二阻挡层之间；在第一阻挡部的第一部分中，沿第二方向，第二子阻挡部的最大尺寸不大于第一子阻挡部的最小尺寸以使封装层在远离第一子阻挡部和第二子阻挡部交界位置处的表面形成的第一斜坡的倾斜角度为约20°～35°。本公开实施例通过在第一阻挡层中形成尺寸不同的第一子阻挡部和第二子阻挡部，从而在封装层的拐角区域形成倾斜角度为约20°～35°的第一斜坡，以减小位于第一阻挡部边缘的触控信号线的坡度角，进而降低相邻触控信号线之间发生短路的几率以提高显示面板的良率。
下面结合附图对本公开实施例提供的显示面板及其制作方法、显示装置进行描述。
图2A为根据本公开一实施例提供的一种显示面板的局部平面结构示意图，图2B为沿图2A中的BB’线所截的截面结构示意图。如图2A和图2B所示，显示面板包括衬底基板100、位于衬底基板100上的第一阻挡部200、位于第一阻挡部200远离衬底基板100一侧的封装层300以及位于封装层300远离衬底基板100的一侧的多条触控信号线400。衬底基板100包括显示区101以及位于显示区101周边的周边区102。
图2B示意性的示出触控信号线400与封装层300远离衬底基板100的一侧表面接触，但不限于此，触控信号线与封装层之间还可以设置缓冲层(未示出)。
例如，显示区101为显示面板的画面显示区域，即出光区；周边区102为显示面板不显示画面的区域，即非出光区。周边区102可围绕显示区101，也可以位于显示区101的周边的一部分，图2示意性的示出了位于显示区101一侧的周边区102的部分膜层的截面图。
例如，衬底基板100可为柔性衬底基板100，例如可为聚酰亚胺(polyimide，PI)，以形成柔性显示装置。柔性衬底基板100的材质不限于聚酰亚胺。
如图2A和图2B所示，第一阻挡部200位于周边区102，且第一阻挡部200包括层叠设置的第一阻挡层210和第二阻挡层220，第二阻挡层220位于第一阻挡层210远离衬底基板100的一侧。图2B示意性的示出第二阻挡层220覆盖第一阻挡层210远离衬底基板100的表面以及第一阻挡层210的侧面，第 三阻挡层230覆盖第二阻挡层220远离第一阻挡层210的表面以及第二阻挡层220的侧面。本公开实施例以第一阻挡层210为第一阻挡部200中最靠近衬底基板100的膜层为例进行描述。本公开实施例不限于此，第一阻挡层、第二阻挡层和第三阻挡层可以沿垂直于衬底基板的方向层叠设置，且在第一阻挡部的第一部分中，第二阻挡层沿第二方向的最大尺寸不大于第二子阻挡部沿第二方向的最小尺寸，且第三阻挡层沿第二方向的最大尺寸不大于第二阻挡层沿第二方向的最小尺寸。
图2A和图2B示意性的示出了位于显示区101一侧的周边区102中的第一阻挡部200，即示出了第一阻挡部200的第一部分201，该第一阻挡部200的第一部分201沿平行于衬底基板100的第一方向(即Z方向)延伸。
在一些示例中，如图2A所示，周边区102包括绑定区1021，第一阻挡部200的第一部分201位于显示区101靠近绑定区1021的一侧，即第一阻挡部200的第一部分201位于显示区101与绑定区1021之间。触控信号线400位于显示区101靠近绑定区1021的一侧，由此位于触控信号线400所在区域的第一阻挡部200与触控信号线400有交叠。
例如，绑定区1021可以包括电路结构(未示出)以与触控信号线400等信号线连接。
如图2A和图2B所示，第一阻挡层210包括材料相同且层叠设置的第一子阻挡部211和第二子阻挡部212，第二子阻挡部212位于第一子阻挡部211与第二阻挡层220之间。在第一阻挡部210的第一部分201中，沿与第一方向相交的第二方向(即后续提到的触控信号线400的延伸方向，如X方向)，第二子阻挡部212的最大尺寸不大于第一子阻挡部211的最小尺寸。
图2B所示的示例中，沿第二方向，第二子阻挡部212的最大尺寸小于第一子阻挡部211的最小尺寸以形成台阶结构。
需要说明的是，图2B示意性的示出第一子阻挡部211和第二子阻挡部212被XY面所截的截面的形状为标准梯形为例，则沿X方向，第二子阻挡部212的长边小于第一子阻挡部211的短边以形成台阶结构。例如，第二子阻挡部212在衬底基板100上的正投影完全落入第一子阻挡部211在衬底基板100上的正投影内，并且在所述第二方向上，第一子阻挡部211在衬底基板100上的正投影的两侧边缘位于第二子阻挡部212在衬底基板100上的两侧边缘的外侧。实际工艺中，两个子阻挡部在高温固化的过程中，两个子阻挡部会发生一定流动， 导致其截面形状可能为近似梯形(例如夹角为圆角)。
如图2A和图2B所示，封装层300位于显示区101和周边区102，且覆盖第一阻挡部200。封装层300覆盖第一阻挡部200远离衬底基板100一侧的表面以及第一阻挡部200的侧面。由于沿第二方向，第二子阻挡部212的最大尺寸小于第一子阻挡部211的最小尺寸而形成了台阶结构，因此，封装层300在第一子阻挡部211和第二子阻挡部212交界位置处且远离衬底基板100的表面形成了第一斜坡311，且第一斜坡311的倾斜角度为20°～35°。也就是，封装层300在远离第一子阻挡部211和第二子阻挡部212交界位置处的表面形成的第一斜坡311的倾斜角度为约20°～35°。封装层300在对应第一子阻挡部211和第二子阻挡部212交界位置处的拐角区域240内具有倾斜角度为20°～35°的第一斜坡311。
例如，第一斜坡311的倾斜角度可以为约25°～35°。例如，封装层300在远离第一子阻挡部211和第二子阻挡部212交界位置处的表面形成的第一斜坡311的倾斜角度为约27°～33°。例如，第一斜坡311的倾斜角度可以为约30°。
图2B所示的示例示意性的示出封装层被XY面所截的截面包括斜边，则第一斜坡的倾斜角度为封装层的斜边与衬底基板之间的夹角。
例如，本公开实施例以第一阻挡层包括层叠设置且尺寸不同的两个子阻挡部为例，但不限于此，第一阻挡层还可以包括层叠设置且尺寸均不同的更多个子阻挡部以形成更多台阶，从而使封装层对应第一阻挡层的位置形成的斜坡与衬底基板之间的夹角更小。
例如，如图2B所示，显示面板的周边区102可以包括衬底基板100和依次位于衬底基板100上的缓冲层103、第一栅极绝缘层104、第二栅极绝缘层105、层间绝缘层106、源漏金属层107、平坦层108以及像素限定层109。例如，平坦层108和像素限定层109的至少之一可采用有机材料形成。
上述源漏金属层107对应于显示区101中的像素电路结构层包括的薄膜晶体管(未示出)的源极和漏极以及数据线。位于显示区101的平坦层108设置在薄膜晶体管上，且位于显示区101的平坦层108远离衬底基板100的一侧还设置有发光元件(未示出)，发光元件例如包括有机发光二极管，但不限于此。
例如，发光元件可以包括发光层以及位于发光层两侧的第一电极和第二电极。位于发光层靠近衬底基板100一侧的第一电极可以通过平坦层108中设置的过孔与薄膜晶体管的漏极电连接。在第一电极远离衬底基板100的一侧设置 有像素限定层109以利于形成发光层。在发光元件远离衬底基板100的一侧设置有封装层300，例如，封装层300可为面状薄膜。封装层用于覆盖发光元件以防止发光元件被外界的水氧侵蚀，起到保护发光元件的作用。图2B示意性的示出封装层300包括依次层叠设置的第一无机层310、有机层320以及第二无机层330，但不限于此，可根据需要进行设置。封装层中的无机层的材料例如包括氮化硅、氧化硅或氮氧化硅等。无机材料的致密性高，从而可以防止水、氧等侵入发光元件而影响发光元件的性能。有机层的材料例如包括高分子树脂(例如聚酰亚胺、聚丙烯酸酯等)，有机层具有平坦化、缓和应力等作用。
例如，如图2A和图2B所示，在周边区102设置的第一阻挡部200和第二阻挡部500可以位于源漏金属层107上，用于防止封装层300中的有机层320在制作过程中溢出衬底基板100。封装层300中的两层无机层可以覆盖第一阻挡部200和第二阻挡部500以增加水氧侵蚀显示面板内部的路径，提高显示面板的封装效果。图2A和图2B仅示出了位于显示区101一侧的周边区102中的部分阻挡部，在周边区102围绕显示区101设置时，两个阻挡部可以均设置为围绕显示区101的环状结构以防止有机层的材料向四周溢出。
如图2A和图2B所示，在位于周边区102的封装层300远离衬底基板100的一侧表面还设置有多条触控信号线400，触控信号线400可以与封装层300的表面接触，且沿第二方向延伸。触控信号线400与封装层300之间也可以设置绝缘层，本公开实施例对此不作限制。触控信号线400与第一阻挡部200的沿第一方向延伸的部分交叉设置。上述第一阻挡部的沿第一方向延伸的部分指与触控信号线交叠的部分，则第一方向为与触控信号线的延伸方向相交的方向。
例如，在位于显示区101的封装层300远离衬底基板100的一侧表面还设置有触控电极(未示出)，触控信号线400与触控电极电连接以传输信号。
例如，触控电极可以包括金属网格，金属网格中包括多个第一触控电极和多个第二触控电极。多个第一触控电极和多个第二触控电极在交叠的位置可形成电容，当有手指触摸时，影响了触摸点附近电容的耦合，从而改变了触摸点附近电容的电容量，由此，利用这种电容量的变化可判断出触控位置。本公开实施例不限于此，例如，触控层可包括互电容式的触控结构，也可包括自电容式的触控结构。另外，触控层还可采用纳米银线等材料制作。
例如，第一触控电极和第二触控电极之一可以图案化形成在封装层的表 面。
图2A和图2B所示实施例中的触控电极以及触控信号线400例如与封装层300的表面直接接触(即为on cell型)，即触控信号线400直接图案化形成在封装层300的表面上。相比于外挂触控层的显示面板，本公开实施例提供的显示面板省去了触控层的基材的使用，既可以降低成本，还可以提高集成度以使显示面板更轻薄且更容易折叠。当然，相比于外挂触控层的显示面板，在触控电极以及触控信号线与封装层之间设置有绝缘层时，也可以降低成本，且提高集成度以使显示面板更轻薄且更容易折叠。
如图2A和图2B所示，多条触控信号线400在衬底基板100上的正投影与第一阻挡部200沿第一方向延伸的第一部分201在衬底基板100上的正投影有交叠。触控信号线400覆盖了第一子阻挡部211与第二子阻挡部212形成的台阶，即，触控信号线400覆盖了封装层300在第一子阻挡部211和第二子阻挡部212交界位置处形成的部分第一斜坡311以在触控信号线400远离第一斜坡311的表面形成第二斜坡401。例如，该第二斜坡401的倾斜角度可以与第一斜坡311的倾斜角度大致相等。这里的第一斜坡和第二斜坡(以及后面提到的第三斜坡)不一定是一个斜的平面，有可能是有一定弧度的凹面或凸面等，只要在第一子阻挡部和第二子阻挡部的交界位置的边角处的膜层能够形成平滑的面即可。
本公开实施例通过在第一阻挡部中最靠近衬底基板的第一阻挡层中形成至少一个台阶结构，可以使封装层在对应第一阻挡层的位置形成倾斜角度为约20°～35°的第一斜坡。由此，相对于图1A和1B所示的没有台阶结构的第一阻挡层，图案化形成在封装层上的触控信号线覆盖第一阻挡部的边缘区域(封装层斜坡所在位置)的部分更平缓，从而降低了制作触控信号线的过程中形成残留金属的几率以提升良率。这里的“约20°～35°”指该数值范围可以为最小值(20°)的95％到最大值(35°)的105％，后续数值范围前的“约”均指该数值范围可以为最小值的95％到最大值的105％。
在一些示例中，第一子阻挡部211和第二子阻挡部212一体成型，也就是第一子阻挡部211和第二子阻挡部212是对第一阻挡层材料采用一步图案化形成的一体结构以节省工艺。当然本公开实施例不限于此，还可以是对第一阻挡层材料分别图案化形成的两个独立的结构。
在一些示例中，沿垂直于衬底基板100的第三方向(Y方向)，第一阻挡 层210的尺寸可以为约1.6～2.5微米。
在一些示例中，沿第三方向，第一子阻挡部211与第二子阻挡部212的尺寸的比值可以为约0.8～1.2。
例如，沿第三方向，第一子阻挡部211的尺寸与第二子阻挡部212的尺寸相同。
在一些示例中，沿第二方向，第一子阻挡部211沿第二方向的尺寸为约25～45微米。第一子阻挡部211的尺寸与第二子阻挡部212的尺寸之差可以为第一子阻挡部211的尺寸的20％～30％。由于第一阻挡层沿X方向的尺寸不能太大，所以第一子阻挡部的尺寸与第二子阻挡部的尺寸之差设计为第一子阻挡部211的尺寸的20％～30％可以防止第一阻挡层影响其周围结构。
例如，沿第二方向，第一子阻挡部211的尺寸可以为40微米，第一子阻挡部211的尺寸与第二子阻挡部212的尺寸之差为5～10微米。
例如，在图2B中的第一阻挡层210沿垂直于衬底基板100的方向的尺寸设计为与图1B所示的显示面板中的第一阻挡层21沿垂直于衬底基板10的方向的尺寸相同，且在图2B所示的第二子阻挡部212沿第二方向的尺寸设计为与图1B所示的显示面板中的第一阻挡层21沿第二方向的尺寸相同时，可以通过调整第一阻挡层210中的第一子阻挡部211和第二子阻挡部212沿第二方向和第三方向的尺寸关系来调整封装层300对应于第一阻挡层210的第一斜坡311的角度，从而防止位于第一斜坡311上的触控信号线400因残留的金属材料而发生短路。
此外，相比于直接将图1B所示的第一阻挡层21沿第二方向的尺寸设计为图2B所示的第一子阻挡部211沿第二方向的尺寸以使图1B中的第一阻挡层21与第二阻挡层22形成台阶结构的方案，本公开实施例中，第一阻挡层设计为包括尺寸不同的第一子阻挡部和第二子阻挡部以使第一阻挡层本身形成台阶结构，能够使封装层上的斜坡的倾斜角度更小，更有利于提高触控信号线的良率。
例如，在图1B中的第一阻挡层21的截面形状为梯形时，与第一阻挡层21对应的封装层30也可能会形成斜坡，但是该斜坡与衬底基板10的夹角较大，例如大于40°，从而会导致形成在该斜坡上的触控信号线存在残留金属而导致不良。本公开实施例通过在第一阻挡层中形成尺寸不同的两个子阻挡部，可以使封装层的斜坡的角度更小，封装层的斜坡更平缓，从而可以减少图案化形成 在斜坡上的触控信号线残留的金属材料。
如图2B所示，在本公开实施例的一示例中，第一阻挡部200的第一部分201中，第二阻挡层220覆盖第一阻挡层210的远离衬底基板100的表面以及第一阻挡层210的侧面。但不限于此，例如，第二阻挡层220沿第二方向的最大尺寸可以不大于第二子阻挡部212沿第二方向的最小尺寸。第二阻挡层220和第二子阻挡部212的截面形状可能为梯形，则第二阻挡层的长边不大于第二子阻挡部的短边。例如，在第二阻挡层的最大尺寸等于第二子阻挡部的最小尺寸时，第二阻挡层面向第二子阻挡部的表面与第二子阻挡部面向第二阻挡层的表面完全重合。
例如，沿第二方向，第二阻挡层220的最大尺寸可以小于第二子阻挡部212的最小尺寸以形成台阶结构。本公开实施例可以通过增加第一阻挡部中台阶的数量，使得形成在第一阻挡部边缘的封装层的斜坡更加平缓，以进一步防止触控信号线短路。
在一些示例中，如图2B所示，第二子阻挡部212在衬底基板100上的正投影的沿第一方向的中心线与第一子阻挡部211在衬底基板100上的正投影的沿第一方向的中心线大致重合。也就是，沿第二方向，第二子阻挡部212在第一子阻挡部211上的正投影位于第一子阻挡部211的中部。例如，第一阻挡层210的截面形状大致为“凸”形。由此，可以使得第一阻挡层沿第二方向的两侧均可以形成台阶结构，有效防止位于第一阻挡层两侧的触控信号线发生不良。
在一些示例中，如图2B所示，第二阻挡层220在衬底基板100上的正投影的沿第一方向的中心线与第二子阻挡部212在衬底基板100上的正投影的沿第一方向的中心线大致重合。
例如，在第二阻挡层220沿第二方向的尺寸小于第二子阻挡部212沿第二方向的尺寸时，沿第二方向，第二阻挡层220在第二子阻挡部212上的正投影位于第二子阻挡部212的中部以使第二阻挡层220和第二子阻挡部212沿第二方向的两侧均可以形成台阶，进一步防止覆盖第一阻挡部的触控信号线发生不良。
在一些示例中，如图2B所示，第一阻挡部200还包括位于第二阻挡层220远离第一阻挡层210的一侧的第三阻挡层230。在本公开实施例的一示例中，在第一阻挡部200的第一部分201中，第三阻挡层230覆盖第二阻挡层220的远离衬底基板100的表面以及第二阻挡层220的侧面。本公开实施例不限于此， 例如，第三阻挡层230沿第二方向的最大尺寸可以不大于第二阻挡层220沿第二方向的最小尺寸。
例如，第二阻挡层220和第三阻挡层230的截面形状可能为梯形，则第三阻挡层的长边不大于第二阻挡层的短边。例如，在第三阻挡层的最大尺寸等于第二阻挡层的最小尺寸时，第三阻挡层面向第二阻挡层的表面与第二阻挡层面向第三阻挡层的表面完全重合。
例如，沿第二方向，第三阻挡层230的最大尺寸可以小于第二阻挡层220的最小尺寸以形成台阶结构。本公开实施例可以通过增加第一阻挡部中台阶的数量，使得形成在第一阻挡部边缘的封装层更加平缓，以进一步防止图案化形成的多条触控信号线存在金属残留而导致短路。
在一些示例中，如图2B所示，沿第三方向，第一阻挡部200的尺寸为约3～6微米。例如，如图2B所示，沿第三方向，第一阻挡部200的尺寸为约4.5～5微米。如图2B所示，沿第三方向，第一阻挡部200的尺寸为约4微米。
相对于图1B所示的显示面板，本公开实施例提供的显示面板中的第一阻挡部沿垂直于衬底基板的方向的尺寸保持不变的情况下(即本公开实施例提供的显示面板中的位于第一阻挡部200的边缘的触控信号线400的段差H2与图1B所示的位于第一阻挡部20的边缘的触控信号线40的段差H1相等)，可以通过在第一阻挡层中形成尺寸不同的至少两个子阻挡部以形成台阶结构，从而减小封装层位于第一阻挡部边缘的斜坡的倾斜角，进而提升触控信号线的良率。
在一些示例中，如图2A和图2B所示，显示面板还包括第二阻挡部500。第二阻挡部500位于周边区102，且位于第一阻挡部200与显示区101之间。第二阻挡部500与第一阻挡部200的延伸方向相同，例如，在图2A所示的周边区102，第二阻挡部500沿第一方向延伸。
在一些示例中，如图2B所示，第二阻挡部500面向衬底基板100的一侧表面与第一阻挡部200面向衬底基板100的一侧表面在平行于衬底基板100的同一平面上。也就是，第二阻挡部500面向衬底基板100一侧的表面与第一阻挡部200面向衬底基板100一侧的表面平齐。
在一些示例中，如图2B所示，沿第三方向，第一阻挡部200的尺寸大于第二阻挡部500的尺寸以在封装层中的有机层的材料从第二阻挡部溢出后能够被第一阻挡部阻挡。
例如，沿第三方向，第一阻挡部200的尺寸比第二阻挡部500的尺寸大2微米左右。第二阻挡部的高度并不高，基本不会导致位于第二阻挡部上的触控信号线具有较大段差，则位于第二阻挡部上的触控信号线不容易发生不良。当然，为了避免第二阻挡部上的触控信号线发生不良，也可以在第二阻挡部中形成台阶结构。
例如，第二阻挡部500被垂直于第二阻挡部500的延伸方向的平面所截的截面包括第二斜边501，第二斜边501与衬底基板100之间的第二夹角与第一斜坡311的倾斜角度之差的绝对值大于0°，且小于20°。
在图1B所示的显示面板中，第一阻挡部和第二阻挡部的截面形状均为梯形时，两者的斜边与衬底基板之间的夹角均相等。图2B所示的示例中，由于第二阻挡部的厚度较低，不会对形成在其上的触控信号线产生较大的影响，所以第二阻挡部在形成过程中没有做任何调整，其成型后的斜边倾斜的角度与图1B所示的第二阻挡部的角度相同，均为大于40°。但是，由于第一阻挡部在形成第一子阻挡部和第二子阻挡部的过程中，调整了两者的尺寸关系以形成了台阶结构，所以本示例中的第一阻挡部上形成的封装层的第一斜坡的倾斜角度显著小于第二阻挡部上形成的封装层的斜坡的倾斜角度。由此，图案化形成位于第一阻挡部上的触控信号线的过程中，不容易出现金属残留。
例如，在周边区102围绕显示区101设置时，第二阻挡部500可以设置为围绕显示区101的环状结构。
例如，第一阻挡部200与第二阻挡部500之间的沿第二方向的距离可以为约1.5～2.5微米，第一阻挡层210的第一子阻挡部211沿X方向的尺寸不能太大，以防止与第二阻挡部500接触。
在一些示例中，如图2B所示，第二阻挡部500包括第四阻挡层510以及位于第四阻挡层510远离衬底基板100一侧的第五阻挡层520。
例如，如图2B所示，在本公开实施例的一示例中，第四阻挡层510和第五阻挡层520的截面均为梯形，第五阻挡层520可以覆盖第四阻挡层510远离衬底基板100的表面以及第四阻挡层510的侧面，本公开实施例对此不作限制。例如，沿第二方向，第五阻挡层520的最大尺寸可以不大于第四阻挡层510的最小尺寸。
例如，本公开实施例以第四阻挡层510为第二阻挡部500中最靠近衬底基板100的膜层为例，第四阻挡层510中也可以形成台阶结构。
例如，沿第二方向，第五阻挡层520的尺寸可以小于第四阻挡层510的尺寸以形成台阶结构，本公开实施例不限于此，还可以为第五阻挡层沿第二方向的尺寸与第四阻挡层沿第二方向的尺寸相同，以方便制作。
在一些示例中，第四阻挡层510与第二阻挡层220同层设置，且两者的材料以及厚度均相同，即第四阻挡层510的材料与第二阻挡层220的材料相同，且第四阻挡层510的厚度与第二阻挡层220的厚度相同。第五阻挡层520和第三阻挡层230同层设置，且两者的材料以及厚度相同，即第五阻挡层520的材料和第三阻挡层230的材料相同，且第五阻挡层520的厚度和第三阻挡层230的厚度相同。也就是，第四阻挡层510和第二阻挡层220可以为同一材料在同一步图案化工艺中形成的两个膜层，第五阻挡层520和第三阻挡层230也为同一材料在同一步图案化工艺中形成的两个膜层以节省工艺。这里以及后续出现的“同层”指同一材料在经过同一步骤(例如一步图案化工艺)后形成的多个膜层之间的关系。这里的“同层”并不总是指多个膜层的厚度相同或者多个膜层在截面图中的高度相同。
例如，第一阻挡层210与平坦层108同层设置，且两者的厚度与材料均相同。第一阻挡层210的厚度与平坦层108的厚度相同，第一阻挡层210的材料与平坦层108的材料相同。第一阻挡层210可与平坦层108同层形成，例如，可以是平坦层108的一部分，即对平坦层材料图案化形成平坦层108的同时形成了第一阻挡层210。由于形成的平坦层用于平坦化像素电路结构层(例如薄膜晶体管等膜层)，以在平坦层上形成发光元件，因此平坦层的厚度较厚，例如为1.6～2.5微米。由此，第一阻挡层的厚度较厚。
例如，第二阻挡层220和第四阻挡层510可与像素限定层109同层形成，且三者的材料与厚度均相同。例如，可以是像素限定层109的一部分，即对像素限定层材料图案化形成像素限定层109的同时形成了第一阻挡部200的第二阻挡层220和第二阻挡部500的第四阻挡层510。
图2C为本公开实施例的另一示例提供的显示面板的局部平面结构示意图，图2D为沿图2C中的CC’线所截的截面结构示意图。如图2C所示，周边区102围绕显示区101设置，第一阻挡部200可以设置为围绕显示区101的环状结构。该第一阻挡部200包括第一部分201和第二部分202，第二部分202为第一阻挡部200中的第一部分201以外的部分，即第一部分201和第二部分202组成了环状的第一阻挡部200。本公开实施例中以显示区101为四边形为 例，第一阻挡部200的第一部分201为位于显示区101的一边的阻挡部，第一阻挡部200的第二部分202为围绕显示区101其他三边的阻挡部。
例如，如图2C和图2D所示，第二子阻挡部212沿与第二部分202延伸方向相交的第四方向(图2C以第二部分202的沿X方向延伸的子部分为例，则与该子部分的延伸方向相交的方向可以为Z方向)的最大尺寸小于第一子阻挡部211沿第四方向的最小尺寸以使封装层在远离第一子阻挡部211和第二子阻挡部212交界位置处的表面形成第三斜坡312。第三斜坡312的倾斜角度与图2B所示的第一斜坡311大致相同，即，第一阻挡部200的第一部分201中的第一子阻挡部211和第二子阻挡部212的尺寸关系与第二部分202中的第一子阻挡部211和第二子阻挡部212的尺寸关系相同。
例如，第三斜坡312的倾斜角度为约20°～35°。例如，第三斜坡的倾斜角度为约27°～33°。例如，第三斜坡312的倾斜角度为约30°。
例如，第四方向与第二部分202的延伸方向垂直。
例如，用于形成触控信号线的膜层4000覆盖了封装层300在第一子阻挡部211和第二子阻挡部212交界位置处形成的部分第三斜坡312以在膜层4000远离第三斜坡312的表面形成第四斜坡402。
在第一阻挡部的第二部分中的第一子阻挡部与第二子阻挡部的尺寸不同而使封装层在远离第一子阻挡部和第二子阻挡部交界位置处的表面形成第三斜坡后，在封装层上沉积的用于形成触控信号线的膜层在图案化形成触控信号线的过程中，不容易在第三斜坡位置处出现残留金属。图2D所示的位于封装层上的膜层4000为形成触控信号线的膜层，在图案化形成触控信号线后，该膜层会被去除。
当然，本公开实施例不限于此，第一阻挡部的第二部分中的第一子阻挡部与第二子阻挡部的尺寸关系也可以不同于第一阻挡部的第一部分中两者的尺寸关系。例如，在第一阻挡部的第二部分中，第一子阻挡部面向第二子阻挡部的表面与第二子阻挡部面向第一子阻挡部的表面完全重合以方便制作。
例如，在位于显示区101的封装层300远离衬底基板100的一侧还设置有触控电极420，触控信号线400与触控电极420电连接以传输信号。
例如，触控电极420包括多个第一触控电极421和多个第二触控电极422，且第一触控电极421和第二触控电极422交叉绝缘设置。多个第一触控电极421沿X方向延伸，且沿Z方向排列；多个第二触控电极422沿Z方向延伸，且 沿X方向排列。多个第一触控电极421和多个第二触控电极422通过多条触控信号线400连接至引线端区，通过对多条触控信号线400施加检测电信号可实现对触控操作的检测以及对触控操作发生的位置的检测。例如，第一触控电极421在X方向的两侧均与触控信号线400连接以实现双边驱动，当然本公开实施例不限于此，第一触控电极也可以仅一侧连接触控信号线以实现单边驱动。
多个第一触控电极421和多个第二触控电极422在交叠的位置可形成电容，当有手指触摸时，影响了触摸点附近电容的耦合，从而改变了触摸点附近电容的电容量，由此，利用这种电容量的变化可判断出触控位置。本公开实施例不限于此，例如，触控层可包括互电容式的触控结构，也可包括自电容式的触控结构。另外，触控层还可采用纳米银线等材料制作。
例如，第一触控电极和第二触控电极之一可以图案化形成在封装层的表面。
图2C所示实施例中，触控电极以及触控信号线可以与封装层的表面直接接触(即为on cell型)，即触控信号线直接图案化形成在封装层上；或者触控电极以及触控信号线可以与封装层之间设置有绝缘层。相比于外挂触控层的显示面板，本公开实施例提供的显示面板省去了触控层的基材的使用，既可以降低成本，还可以提高集成度以使显示面板更轻薄且更容易折叠。
例如，图2E为本公开实施例中的另一示例提供的显示面板的截面结构示意图。图2E所示的示例中的显示面板与图2B所示的显示面板的不同之处在于第一阻挡部200的第一部分中的第一阻挡层210被垂直于第一方向的平面所截的截面大致为梯形。该梯形包括的第一斜边203与衬底基板100之间的第一夹角为约20°～35°。也就是，第一阻挡部的第一部分中，沿第二方向，第二子阻挡部的最大尺寸等于第一子阻挡部的最小尺寸，由此，第一阻挡层的截面为梯形。
在本示例中，在制作形成第一子阻挡部和第二子阻挡部时，第二子阻挡部的最大尺寸小于第一子阻挡部的最小尺寸，但是两个子阻挡部的材料在高温固化过程中会发生一定的流动，从而使得两个子阻挡部截面形状为梯形，且第二子阻挡部的最大尺寸等于第一子阻挡部的最小尺寸。
在图1B中的第一阻挡层21的截面形状为梯形时，该梯形的斜边与衬底基板10的夹角较大，例如大于40°，从而会导致形成在该第一阻挡层上的触控信号线存在残留金属而导致不良。相比于图1B所示的第一阻挡部，本示例中包 括第一子阻挡部和第二子阻挡部的第一阻挡层的第一斜边与衬底基板之间的第一夹角为约20°～35°，可以使封装层的斜坡的角度更小，封装层的斜坡更平缓，从而可以减少图案化形成在斜坡上的触控信号线残留的金属材料。
例如，第一斜边203与衬底基板100之间的第一夹角为约25°～35°。例如，第一斜边203与衬底基板100之间的第一夹角为约30°。
例如，图2E示意性的示出在第一阻挡部200的第一部分201中，第二阻挡层220覆盖第一阻挡层210的远离衬底基板100的表面以及第一阻挡层210的侧面，第三阻挡层230覆盖第二阻挡层220的远离衬底基板100的表面以及第二阻挡层220的侧面。但不限于此，例如，第二阻挡层220沿第二方向的最大尺寸可以不大于第二子阻挡部212沿第二方向的最小尺寸，且第三阻挡层230沿第二方向的最大尺寸可以不大于第二阻挡层220沿第二方向的最小尺寸。例如，第二阻挡层220沿第二方向的最大尺寸等于第二子阻挡部212沿第二方向的最小尺寸，第三阻挡层230沿第二方向的最大尺寸等于第二阻挡层220沿第二方向的最小尺寸。本公开实施例不限于此。
例如，图2E示意性的示出，第五阻挡层520覆盖第四阻挡层510远离衬底基板100一侧的表面以及第四阻挡层510的侧面。本公开实施例不限于此，例如，沿第二方向，第五阻挡层520的最大尺寸不大于第四阻挡层510的最小尺寸。例如，第五阻挡层520的最大尺寸可以等于第四阻挡层510的最小尺寸。
例如，第二阻挡部500被垂直于第二阻挡部500的延伸方向的平面所截的截面包括第二斜边501，第二斜边501与衬底基板100之间的第二夹角与第一斜坡311的倾斜角度之差的绝对值大于0°，且小于20°。也就是，第二斜边501与衬底基板100之间的第二夹角与第一斜边203的与衬底基板100之间的第一夹角之差的绝对值大于0°，且小于20°。
在图1B所示的显示面板中，第一阻挡部和第二阻挡部的截面形状均为梯形时，两者的斜边与衬底基板之间的夹角均相等。图2E所示的示例中，由于第二阻挡部的厚度较低，不会对形成在其上的触控信号线产生较大的影响，所以第二阻挡部在形成过程中没有做任何调整，其成型后的斜边倾斜的角度与图1B所示的第二阻挡部的角度相同，均为大于40°。但是，由于第一阻挡部在形成第一子阻挡部和第二子阻挡部的过程中，调整了两者的尺寸关系(第二子阻挡部的尺寸小于第一子阻挡部的尺寸)，所以本示例中的第一阻挡部截面的第一斜边的倾斜角度显著小于第二阻挡部截面的第二斜边的倾斜角度。由此，图 案化形成位于第一阻挡部上的触控信号线的过程中，不容易出现金属残留。
图2F为本公开实施例中的另一示例提供的显示面板的截面结构示意图。图2E所示的示例中的显示面板与图2B所示的显示面板的不同之处在于第一阻挡部200的第一部分中，第二阻挡层220和第三阻挡层230的截面形状不是标准的梯形，两个阻挡层截面形状为近似梯形形状。即，在制作形成第二阻挡层和第三阻挡层时，由于两层材料在高温固化过程中会发生一定的流动，从而使得两个阻挡层截面形状为圆角形状。
本示例中，在制作形成第一子阻挡部和第二子阻挡部时，第二子阻挡部的最大尺寸小于第一子阻挡部的最小尺寸，但是两个子阻挡部的材料在高温固化过程中会发生一定的流动，从而使得两个子阻挡部截面形状为圆角梯形；或者第二子阻挡部的最大尺寸等于第一子阻挡部的最小尺寸，两者之间没有明显的界限。
在图1B所示的结构中的第二阻挡层覆盖第一阻挡层远离衬底基板的表面以及第一阻挡层的侧面，第三阻挡层覆盖第二阻挡层远离第一阻挡层的表面以及第二阻挡层的侧面时，相比与该结构，本公开实施例中，通过在第一阻挡层中形成了尺寸不同的两个子阻挡部，可以使得形成在第一阻挡层上的第二阻挡层以及第三阻挡层的斜坡角度更小，以使形成在第三阻挡层上的封装层在远离第一子阻挡部和第二子阻挡部交界位置处的表面形成的第一斜坡的倾斜角度为约20°～35°，从而减小位于第一阻挡部边缘的触控信号线的坡度角，进而降低相邻触控信号线之间发生短路的几率以提高显示面板的良率。
如图2F所示，覆盖第一阻挡部200的封装层300包括平坦部分E1以及斜坡部分E2，斜坡部分E2包括第一斜坡311。覆盖第一阻挡部200的封装层300的厚度为h(该厚度不包括位于第一阻挡部以外的平坦部分的厚度)。在封装层300的第一斜坡呈弧面时，本公开实施例以封装层300的高度的一半的位置处O点与封装层300的斜坡部分E2远离平坦部分E1的端点P的连线313的斜率作为第一斜坡311的斜率为例，则连线313与衬底基板100所在平面的夹角为第一斜坡311的倾斜角度。
图3为根据本公开一实施例的另一示例提供的显示面板的局部截面结构示意图，图3所示的显示面板的部分显示区101中没有示出封装层以及触控电极等结构，且图3中的显示区101中的虚线之间省略了部分结构。并且，图3中的显示面板的周边区以图2E所示的结构为例，但不限于此，也可以是图2B 所示的结构或图2F所示的结构。图3的部分显示区101示意性的示出了像素电路结构层130、平坦层108以及发光元件120。如图3所示，与图2B所示的显示面板不同之处在于，本示例中的显示面板包括第一源漏金属层107和第二源漏金属层110(双SD结构)。第一阻挡部200和第二阻挡部500可以形成在第二源漏金属层110上。
例如，上述两层源漏金属层的材料相同，可以均为钛-铝-钛结构。设计两层源漏金属层(双SD结构)可以有利于提高显示面板的亮度均一性，降低驱动IC功耗。
例如，如图3所示，显示面板包括位于第二源漏金属层110远离第一源漏金属层107一侧的第一平坦层1081和位于两层源漏金属层之间的第二平坦层1082，两层源漏金属层在显示区101电连接。这里的两层源漏金属层用作数据信号走线，且位于不同层的两条数据信号走线电连接的设计可以减小走线之间的间距。
例如，如图3所示，位于显示区101的像素限定层109面向衬底基板100的一侧还设置有发光元件的第一电极121，第一电极121与第二源漏金属层110电连接。
本公开另一实施例提供一种显示面板的制作方法。图4A为本公开实施例提供的显示面板的制作方法的示意性流程图，图4B和图4C为形成第一阻挡层的示意性工艺流程图。如图4A所示，显示面板的制作方法包括如下步骤。
S201：提供衬底基板。
例如，通过本公开实施例提供的制作方法可以形成图3所示的显示面板。如图3所示，衬底基板100包括显示区101以及位于显示区101周边的周边区102。
例如，衬底基板100可为柔性衬底基板，例如可为聚酰亚胺(polyimide，PI)，以形成柔性显示装置。柔性衬底基板100的材质不限于聚酰亚胺。
S202：在衬底基板的周边区形成第一阻挡部。
例如，如图3所示，在形成第一阻挡部200之前还可以依次在衬底基板100上形成缓冲层103、第一栅极绝缘层104、第二栅极绝缘层105、层间绝缘层106、第一源漏金属层107、第二平坦层1082、第二源漏金属层110、第一平坦层1081以及像素限定层109等膜层。
例如，形成在周边区102的第一阻挡部200的部分沿平行于衬底基板100 的第一方向(垂直于图3所示的X方向的方向)延伸。
如图4B所示，形成第一阻挡部200包括：在衬底基板100上形成第一阻挡层材料3100。图4B仅示出了衬底基板100以及第一阻挡层材料3100，并没有示出两者之间的膜层。
例如，第一阻挡层材料3100可以包括有机材料，例如包括聚酰亚胺、聚酰胺、聚碳酸酯、环氧树脂等中的一种或几种的组合等材料，或者光致刻蚀剂材料等。
如图4C所示，对第一阻挡层材料采用一步图案化工艺形成层叠设置的第一子阻挡部211和第二子阻挡部212以形成第一阻挡部200最靠近衬底基板100的一侧的膜层(第一阻挡层210)。
如图4C所示，在一些示例中，采用一步图案化工艺形成层叠设置的第一子阻挡部211和第二子阻挡部212包括：采用半色调掩模600形成第一子阻挡部211和第二子阻挡部212。并且，形成的第二子阻挡部212位于第一子阻挡部211远离衬底基板100的一侧，沿与第一方向相交的第二方向(X方向)，第二子阻挡部212的最大尺寸小于第一子阻挡部211的最小尺寸而形成了台阶结构。图4C示意性的示出第一子阻挡部和第二子阻挡部的截面形状为矩形，实际工艺中，两个的截面形状可以均为梯形。
如图4C所示，在一些示例中，半色调掩模600包括完全透光区610、部分透光区620以及非透光区630。形成第一子阻挡部211和第二子阻挡部212包括：将半色调掩模600的非透光区630与第一阻挡层材料中待形成第二子阻挡部212的区域正对，将半色调掩模600的部分透光区620与待形成第一子阻挡部211的除与第二子阻挡部212重叠部分以外的区域正对，将半色调掩模600的完全透光区610与除了待形成第一子阻挡部211的区域正对，然后采用激光700对第一阻挡层材料进行曝光。也就是，在不需要第一阻挡层210的位置形成完全曝光区，在形成厚度较薄的第一阻挡层210的位置(即第一子阻挡部211的除与第二子阻挡部212重叠部分以外的位置)形成部分曝光区，在形成厚度较厚的第一阻挡层210的位置(即第二子阻挡部212)不进行曝光。然后对第一阻挡层材料3100进行显影以及固化以形成第一子阻挡部211和第二子阻挡部212。本示例以第一阻挡层材料采用包括正性光致刻蚀剂的材料为例进行描述，本示例不限于此，例如还可以是用包括负性光致刻蚀剂的材料，在第一阻挡层材料采用负性光致刻蚀剂的材料时，半色调掩模的完全透光区与非透光区 的位置互换。
例如，在本公开实施例中的第一阻挡部的第一部分和第二部分中的第一子阻挡部与第二子阻挡部的尺寸关系相同时，上述采用半色调掩模形成第一子阻挡部和第二子阻挡部的方法适用于第一阻挡部的各个位置。在本公开实施例中第一阻挡部的第二部分中的第一子阻挡部与第二子阻挡部的尺寸关系不同于第一部分中的第一子阻挡部与第二子阻挡部的尺寸关系时，例如，第一子阻挡部面向第二子阻挡部的表面与第二子阻挡部面向第一子阻挡部的表面完全重合时，上述采用半色调掩模形成第一子阻挡部和第二子阻挡部的方法仅适用于第一阻挡部的第一部分。
例如，如图4C所示，第一子阻挡部211和第二子阻挡部212是对第一阻挡层材料3100采用一步图案化形成的一体结构，从而节省工艺。第一子阻挡部211与第二子阻挡部212重叠的区域为第一阻挡层210厚度较大的区域，仅设置有第一子阻挡部211的区域为第一阻挡层210厚度较小的区域，由此第一阻挡层为具有两种不同厚度的膜层。本公开实施例示意性的示出第一阻挡层仅包括两种不同厚度，但不限于此，还可以包括更多不同厚度以形成更多台阶结构。
例如，第一阻挡层210可与第一平坦层1081同层形成，例如，可以是第一平坦层1081的一部分，即对第一平坦层材料图案化形成第一平坦层1081的同时形成了第一阻挡层210。在形成第一平坦层时，待形成第一平坦层的位置可以与半色调掩模的非透光区正对以使形成的平坦层的厚度与第一阻挡层的较大的厚度(第一子阻挡部和第二子阻挡部的厚度之和)相同，本公开实施例不限于此，还可以是待形成第一平坦层的位置可以与半色调掩模的部分透光区正对以使形成的平坦层的厚度与第一子阻挡部的厚度相同。
如图3所示，在形成第一阻挡层210以后，形成第一阻挡部200还包括：在第二子阻挡部212远离衬底基板100的一侧形成第二阻挡层220。例如，在图案化形成第二阻挡层时，且沿第二方向，第二阻挡层的最大尺寸可以不大于第二子阻挡部的最小尺寸。实际工艺中，形成的第二阻挡层的材料在高温固化过程中会发生一定的流动，使得第二阻挡层的截面形状可能为梯形，且第二阻挡层覆盖第一阻挡层远离衬底基板一侧的表面以及第一阻挡层的侧面。当然，本公开实施例不限于此，在第二阻挡层的平行于衬底基板的方向的尺寸较小时，第二阻挡层的最大尺寸可能不大于第二子阻挡部的最小尺寸。例如，在第 二阻挡层的最大尺寸等于第二子阻挡部的最小尺寸时，第二阻挡层面向第二子阻挡部的表面与第二子阻挡部面向第二阻挡层的表面完全重合。例如，沿第二方向，第二阻挡层的最大尺寸可以小于第二子阻挡部的最小尺寸以形成台阶结构。
例如，如图3所示，第二阻挡层220可与像素限定层109同层形成，例如，可以是像素限定层109的一部分，即对像素限定层材料图案化形成像素限定层109的同时形成了第一阻挡部200的第二阻挡层220。
例如，如图3所示，形成第一阻挡部200还包括：在第二阻挡层220远离第一阻挡层210的一侧形成第三阻挡层230。例如，第三阻挡层230的材料可以为有机层，起到支撑后续膜层的作用。
例如，在图案化形成第三阻挡层时，且沿第二方向，第三阻挡层的最大尺寸可以不大于第二阻挡层的最小尺寸。实际工艺中，形成的第三阻挡层的材料在高温固化过程中会发生一定的流动，使得第三阻挡层的截面形状可能为梯形，且第三阻挡层覆盖第二阻挡层远离衬底基板一侧的表面以及第二阻挡层的侧面。当然，本公开实施例不限于此，在第三阻挡层的平行于衬底基板的方向的尺寸较小时，第三阻挡层的最大尺寸可能不大于第二阻挡层的最小尺寸。
例如，如图3所示，在形成第一阻挡部200的同时还可以包括形成第二阻挡部500，第二阻挡部500形成于周边区102，且位于第一阻挡部200靠近显示区101的一侧。第二阻挡部500与第一阻挡部200的延伸方向相同。
例如，如图3所示，形成第二阻挡部500包括在衬底基板100上依次形成第四阻挡层510和第五阻挡层520。
例如，第四阻挡层510可与第二阻挡层220以及像素限定层109同层形成，例如，可以是像素限定层109的一部分，即对像素限定层材料图案化形成像素限定层109的同时形成了第一阻挡部200的第二阻挡层220和第二阻挡部500的第四阻挡层510。
例如，第五阻挡层520与第三阻挡层230可由同一材料采用同一掩模板图案化形成以节省工艺。
S203：在第一阻挡部远离衬底基板的一侧形成位于显示区和周边区的封装层。
例如，如图3所示，封装层300覆盖第一阻挡部200以在第一子阻挡部211和第二子阻挡部212交界位置处且远离衬底基板的表面形成第一斜坡311。本 公开实施例通过在第一阻挡部中最靠近衬底基板的第一阻挡层中形成至少一个台阶结构，可以使封装层在对应第一阻挡层的位置形成斜坡。
例如，如图3所示，形成封装层300可以包括依次形成层叠的第一无机层310、有机层320以及第二无机层330，本公开实施例不限于此，只要有机层与无机层交替形成即可。
例如，封装层300中的无机层的材料例如包括氮化硅、氧化硅或氮氧化硅等。无机材料的致密性高，从而可以防止水、氧等侵入而影响发光元件的性能。有机层的材料例如包括高分子树脂，例如聚酰亚胺、聚丙烯酸酯等，有机层具有平坦化、缓和应力等作用。
S204：在封装层远离衬底基板的一侧表面形成多条触控信号线。
例如，在形成封装层以后，可以在封装层的表面直接形成触控层材料，然后对触控层材料图案化形成位于显示区的触控电极以及位于周边区的触控信号线。也就是，触控信号线是直接图案化形成在封装层的表面上的。
例如，如图3所示，多条触控信号线400沿与X方向相交的方向延伸，由此，多条触控信号线400覆盖第一阻挡部200沿第一方向延伸的部分。触控信号线400覆盖了第一子阻挡部211与第二子阻挡部212，即，触控信号线400覆盖了封装层300在第一子阻挡部211和第二子阻挡部212交界位置处形成的倾斜角度为约20°～35°的第一斜坡311。
本公开实施例通过在第一阻挡部中最靠近衬底基板的第一阻挡层中形成至少一个台阶结构，可以使封装层在对应第一阻挡层的位置形成倾斜角度为约20°～35°的斜坡。由此，相对于图1A和1B所示的没有台阶结构的第一阻挡层，直接图案化形成在封装层上的触控信号线覆盖第一阻挡部的边缘区域(封装层斜坡所在位置)的部分更平缓，从而降低了制作触控信号线的过程中形成残留金属的几率以提升良率。
本公开另一实施例提供一种显示装置，包括上述任一示例提供的显示面板。本公开实施例提供的显示装置中通过在第一阻挡部中最靠近衬底基板的第一阻挡层中形成至少一个台阶结构，可以使封装层在对应第一阻挡层的位置形成斜坡，从而降低了制作触控信号线的过程中形成残留金属的几率以提升良率。
有以下几点需要说明：
(1)本公开的实施例附图中，只涉及到与本公开实施例涉及到的结构， 其他结构可参考通常设计。
(2)在不冲突的情况下，本公开的同一实施例及不同实施例中的特征可以相互组合。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。

Claims (23)

  1. 一种显示面板，包括：
    衬底基板，包括显示区以及位于所述显示区周边的周边区；
    第一阻挡部，位于所述周边区，且所述第一阻挡部的位于所述显示区一侧的第一部分沿平行于所述衬底基板的第一方向延伸，所述第一阻挡部包括第一阻挡层、位于所述第一阻挡层远离所述衬底基板的一侧的第二阻挡层以及位于所述第二阻挡层远离所述第一阻挡层的一侧的第三阻挡层；所述第二阻挡层覆盖所述第一阻挡层的远离所述衬底基板的表面以及所述第一阻挡层的侧面，所述第三阻挡层覆盖所述第二阻挡层的远离所述衬底基板的表面以及所述第二阻挡层的侧面；
    封装层，位于所述显示区和所述周边区，且覆盖所述第一阻挡部；
    多条触控信号线，位于所述封装层远离所述衬底基板的一侧，且沿与所述第一方向相交的第二方向延伸，所述多条触控信号线在所述衬底基板上的正投影与所述第一阻挡部的第一部分在所述衬底基板上的正投影交叠；
    其中，所述第一阻挡层包括材料相同的第一子阻挡部和第二子阻挡部，所述第二子阻挡部位于所述第一子阻挡部与所述第二阻挡层之间；
    在所述第一阻挡部的第一部分中，沿所述第二方向，所述第二子阻挡部的最大尺寸不大于所述第一子阻挡部的最小尺寸以使所述封装层在远离所述第一子阻挡部和所述第二子阻挡部交界位置处的表面形成的第一斜坡的倾斜角度为约20°～35°。
  2. 根据权利要求1所述的显示面板，其中，所述第一斜坡的倾斜角度为约27°～33°。
  3. 根据权利要求1或2所述的显示面板，其中，所述第一阻挡部的第一部分中的所述第一阻挡层被垂直于所述第一方向的平面所截的截面大致为梯形，所述梯形包括的第一斜边与所述衬底基板之间的第一夹角为约20°～35°。
  4. 根据权利要求1-3任一项所述的显示面板，其中，所述周边区包括绑定区，所述第一阻挡部的第一部分位于所述显示区的靠近所述绑定区的一侧。
  5. 根据权利要求1-4任一项所述的显示面板，其中，所述多条触控信号线覆盖部分所述第一斜坡以使其远离所述第一斜坡的表面形成第二斜坡。
  6. 根据权利要求5所述的显示面板，其中，所述第一阻挡部为围绕所述 显示区的环状结构，所述第一阻挡部除所述第一部分以外的第二部分中，所述第二子阻挡部沿与所述第二部分延伸方向相交的第四方向的最大尺寸不大于所述第一子阻挡部沿所述第四方向的最小尺寸以使所述封装层在远离所述第一子阻挡部和所述第二子阻挡部交界位置处的表面形成第三斜坡，且所述第三斜坡的倾斜角度为约20°～35°。
  7. 根据权利要求1-6任一项所述的显示面板，其中，所述第一子阻挡部和所述第二子阻挡部一体成型。
  8. 根据权利要求1-7任一项所述的显示面板，其中，在所述第一阻挡部的第一部分中，所述第二子阻挡部在所述衬底基板上的正投影的沿所述第一方向的中心线与所述第一子阻挡部在所述衬底基板上的正投影的沿所述第一方向的中心线大致重合。
  9. 根据权利要求8所述的显示面板，其中，所述第二阻挡层在所述衬底基板上的正投影的沿所述第一方向的中心线与所述第二子阻挡部的所述中心线大致重合。
  10. 根据权利要求1-9任一项所述的显示面板，还包括：
    第二阻挡部，位于所述周边区，且位于所述第一阻挡部与所述显示区之间，所述第二阻挡部与所述第一阻挡部的延伸方向相同，且沿垂直于所述衬底基板的第三方向，所述第一阻挡部的尺寸大于所述第二阻挡部的尺寸。
  11. 根据权利要求10所述的显示面板，其中，所述第二阻挡部被垂直于所述第二阻挡部的延伸方向的平面所截的截面包括第二斜边，所述第二斜边与所述衬底基板之间的第二夹角与所述第一斜坡的倾斜角度之差的绝对值大于0°，且小于20°。
  12. 根据权利要求10或11所述的显示面板，其中，所述第二阻挡部包括第四阻挡层以及位于所述第四阻挡层远离所述衬底基板一侧的第五阻挡层，所述第四阻挡层与所述第二阻挡层同层设置，且材料以及厚度均相同，所述第五阻挡层和所述第三阻挡层同层设置，且材料以及厚度均相同。
  13. 根据权利要求12所述的显示面板，还包括：
    位于所述显示区的像素电路结构层；
    位于所述像素电路结构层远离所述衬底基板一侧的平坦层；以及
    位于所述平坦层远离所述像素电路结构层一侧的发光元件，
    其中，所述第一阻挡层与所述平坦层同层设置，且厚度以及材料均相同。
  14. 根据权利要求13所述的显示面板，还包括：
    位于所述平坦层远离所述像素电路结构层一侧的像素限定层，
    其中，所述第二阻挡层与所述像素限定层同层设置，且厚度以及材料均相同。
  15. 根据权利要求1-14任一项所述的显示面板，其中，沿垂直于所述衬底基板的第三方向，所述第一子阻挡部与所述第二子阻挡部的尺寸的比值为约0.8～1.2。
  16. 根据权利要求15所述的显示面板，其中，沿所述第三方向，所述第一阻挡层的尺寸为约1.6～2.5微米。
  17. 根据权利要求15或16所述的显示面板，其中，沿所述第三方向，所述第一阻挡部的尺寸为约3～5微米。
  18. 根据权利要求1-17任一项所述的显示面板，其中，所述第一子阻挡部沿所述第二方向的尺寸为约25～45微米。
  19. 根据权利要求18所述的显示面板，其中，沿所述第二方向，所述第一子阻挡部的尺寸与所述第二子阻挡部的尺寸之差为所述第一子阻挡部的尺寸的20％～30％。
  20. 一种显示面板的制作方法，包括：
    提供衬底基板，所述衬底基板包括显示区以及位于所述显示区周边的周边区；
    在所述衬底基板的周边区形成第一阻挡部，其中，所述第一阻挡部的第一部分沿平行于所述衬底基板的第一方向延伸，形成所述第一阻挡部的第一部分包括：在所述衬底基板上形成第一阻挡层材料；对所述第一阻挡层材料采用一步图案化工艺形成层叠设置的第一子阻挡部和第二子阻挡部，所述第二子阻挡部位于所述第一子阻挡部远离所述衬底基板的一侧，沿与所述第一方向相交的第二方向，所述第二子阻挡部的最大尺寸不大于所述第一子阻挡部的最小尺寸；在所述第二子阻挡部远离所述衬底基板的一侧形成第二阻挡层；在所述第二阻挡层远离所述第一阻挡层的一侧形成第三阻挡层；
    在所述第一阻挡部远离所述衬底基板的一侧形成位于所述显示区和所述周边区的封装层，所述封装层覆盖所述第一阻挡部的第一部分以在所述第一子阻挡部和所述第二子阻挡部交界位置处且远离所述衬底基板的表面形成第一斜坡，所述第一斜坡的倾斜角度为约20°～35°；以及
    在所述封装层远离所述衬底基板的一侧表面形成沿所述第二方向延伸的多条触控信号线，所述多条触控信号线覆盖所述封装层的部分所述第一斜坡。
  21. 根据权利要求20所述的制作方法，其中，采用一步图案化工艺形成层叠设置的第一子阻挡部和第二子阻挡部包括：采用半色调掩模形成所述第一子阻挡部和所述第二子阻挡部。
  22. 根据权利要求21所述的制作方法，其中，所述半色调掩模包括完全透光区、部分透光区以及非透光区，形成所述第一子阻挡部和所述第二子阻挡部包括：
    将所述半色调掩模的所述非透光区与所述第一阻挡层材料中待形成所述第二子阻挡部的区域正对，将所述半色调掩模的所述部分透光区与待形成所述第一子阻挡部的除与所述第二子阻挡部重叠部分以外的区域正对，将所述半色调掩模的完全透光区与除了待形成所述第一子阻挡部的区域正对，然后对所述第一阻挡层材料进行曝光；
    对所述第一阻挡层材料进行显影和固化以形成所述第一子阻挡部和所述第二子阻挡部。
  23. 一种显示装置，包括权利要求1-19任一项所述的显示面板。
PCT/CN2019/115060 2019-11-01 2019-11-01 显示面板及其制作方法、显示装置 Ceased WO2021081987A1 (zh)

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