WO2021090189A1 - Rfid label - Google Patents

Rfid label Download PDF

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Publication number
WO2021090189A1
WO2021090189A1 PCT/IB2020/060346 IB2020060346W WO2021090189A1 WO 2021090189 A1 WO2021090189 A1 WO 2021090189A1 IB 2020060346 W IB2020060346 W IB 2020060346W WO 2021090189 A1 WO2021090189 A1 WO 2021090189A1
Authority
WO
WIPO (PCT)
Prior art keywords
rfid
antenna
substrate
rfid label
label according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2020/060346
Other languages
French (fr)
Inventor
Lauri Huhtasalo
Juha Ikonen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stora Enso Oyj
Original Assignee
Stora Enso Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stora Enso Oyj filed Critical Stora Enso Oyj
Priority to US17/755,766 priority Critical patent/US11928536B2/en
Priority to CN202080077912.2A priority patent/CN115023858A/en
Priority to EP20884198.1A priority patent/EP4055660A4/en
Priority to BR112022008802A priority patent/BR112022008802A2/en
Publication of WO2021090189A1 publication Critical patent/WO2021090189A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material

Definitions

  • An RFID tag comprising an RFID antenna and an RFID IC (integrated circuit or microchip), which IC is electrically connected onto the antenna.
  • the conductive material is then cured to form a solidified, more compact antenna pattern.
  • This can e.g. be made by application of heat with a suitable heater.
  • the conductive material is preferably heated to a temperature exceeding a characteristic melting temperature of the conductive material.
  • the forming of the RFID antenna can be made by additive printing with a conductive ink.
  • a conductive ink is an ink comprising conductive particles.
  • the conductive ink can for example be silver ink, copper ink or graphene ink.
  • the conductive inks inks are then made conductive by drying them or treating them with hot-air, radiation (UV, EB), photonic curing, laser or some other treatment method.
  • RFID label further comprising a sticky adhesive layer 8 which is applied onto the second surface 4 of the substrate and over the RFID tag 7.
  • the adhesive layer covers the antenna 5, the IC 6 and the second surface 4.
  • the elongated substrate 2 carrying several RFID tags 7 which tags are arranged on the second surface of the substrate.
  • the RFID tags are arranged at a predetermined distance between two adjacent RFID tags.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)

Abstract

The present invention relates to an RFID label (1) comprising an RFID tag (V7) which tag comprises an RFID antenna (5) and an IC (6), which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate (2) with a first surface (3) and a second surface (4), wherein the first surface is siliconized, and the second surface is carrying the RFID tag (7), and a sticky adhesive layer (8) which is arranged onto the second surface of the substrate and over the RFID tag.

Description

RFID label
Technical field
The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag.
In the following the expression RFID (Radio Frequency Identification) tag will be frequently used. An RFID tag is a tag that is intended to be attached onto objects to be identified in a radio-frequency identification system.
An RFID tag comprising an RFID antenna and an RFID IC (integrated circuit or microchip), which IC is electrically connected onto the antenna.
An RFID label is in this context a label which carrying an RFID tag. The label is intended to be attached onto different kind of objects via an adhesive layer of the label.
Prior art - Problem
Figure A discloses a conventional three-layer structure of an RFID label. The RFID label structure comprising a substrate (Al) with an antenna (A2) and an IC (A3). The structure further comprising a face paper layer (A4) with adhesive that covers the antenna and the IC, an adhesive (A5) and a siliconized release layer (A6), which is removed when attaching the RFID label onto an object.
Figure B discloses a conventional two-layer structure of an RFID label. The structure comprising a substrate (Al) with an antenna (A2) and an IC (A3). The structure further comprising an adhesive (A5) a siliconized release layer (A6), which release layer is removed when attaching the RFID label onto an object.
Above prior art drawbacks in that they all are needed several layers and/or a release layer in order to attach the label, which in turns are costly and not environmentally friendly.
Object of invention
An object with the invention is to provide a more environmentally friendly RFID label, which is more cost efficient in comparison to prior art and in turn solves the above-mentioned problems.
Summary of the invention
In accordance of the invention, the RFID label is characterized in that RFID label further comprising:
- an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and
- a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.
Figures and detailed description of the invention
Figure A and B disclose prior art of conventional RFID labels having two and three label structures, see above "Prior art Problem" .
Figure 1 discloses a schematic view of an RFID label in accordance with the invention. In the following, the invention will be described more in detail with reference to Figure 1. The invention discloses an RFID label 1 which comprising a substrate 2 with a first surface 3 and an opposite second surface 4 which faces away from the first surface 3. The substrate is preferably made of a paper or a paper board material. However, the skilled person realizes that other non- conductive substrate materials are possible.
The first surface 3 is siliconized, i.e. the surface has been coated or treated with silicon, such that the surface has non-sticky properties. The second surface 4 is untreated, i.e. it has not been siliconized.
The RFID label further comprising an RFID tag 7 which tag comprises an RFID antenna 5 and an integrated chip (IC)
6. The IC is electrically connected to the antenna such that the antenna and the IC forms the RFID tag. The RFID tag is attached to the substrate on the untreated, second surface 4.
The skilled person realizes that many ways are possible to form the RFID tag onto the second surface. In a first embodiment, of forming the antenna, electrically conductive solid particles are formed, in a predefined pattern, onto the second surface of the web.
The conductive material is then cured to form a solidified, more compact antenna pattern. This can e.g. be made by application of heat with a suitable heater. Hereby, the conductive material is preferably heated to a temperature exceeding a characteristic melting temperature of the conductive material.
The transfer of the conductive particles and the curing and solidification may be made in the way disclosed in one or several of the WO2013/113995, WO2009/135985, W02008/006941 and WO2016/189446. All said documents hereby being incorporated in their entirety by reference.
Further, other ways of forming the conductive material in a pattern can also be used. In a second embodiment the forming of the RFID antenna can be made by additive printing with a conductive ink. A conductive ink is an ink comprising conductive particles. The conductive ink can for example be silver ink, copper ink or graphene ink. The conductive inks inks are then made conductive by drying them or treating them with hot-air, radiation (UV, EB), photonic curing, laser or some other treatment method.
In a third embodiment the forming of the RFID antenna is made by first providing the second surface with a conductive layer, preferably an aluminum foil. Parts of the conductive layer is then subtracted, such that the remaining conductive layer, on the collar material web, forms the RFID antenna. The subtraction of the conductive layer into the desired conductive pattern could for example be through cutting, grinding, brushing or the like.
Thereafter, the method comprising the step of attaching the RFID IC onto the antenna, such that, an electrical connection between the IC and the antenna is established, wherein the RFID tag 3 is formed.
RFID label further comprising a sticky adhesive layer 8 which is applied onto the second surface 4 of the substrate and over the RFID tag 7. Hence, the adhesive layer covers the antenna 5, the IC 6 and the second surface 4.
The elongated substrate 2 carrying several RFID tags 7 which tags are arranged on the second surface of the substrate. The RFID tags are arranged at a predetermined distance between two adjacent RFID tags.
In a preferred embodiment the substrate is perforated between two adjacent tags, such that the tags can be separated manually or automatically in an RFID tag application process. However, the skilled person realizes that other separation methods are possible such as cutting via scissor or knife or similar equipment, where a perforation is not necessary.
The RFID label is rolled up to form a roll wherein the siliconized first surface 3 faces against and covers the sticky adhesive layer 8. Since the siliconized surface 4 covers the adhesive layer 8, in the roll, no additional silicone liner or similar is needed to protect the adhesive layer 8.
Finished sticky RFID label can be implemented by cutting the label during application and then fasten the RFID label directly on a desired object. There are several benefits with the present invention in comparison to conventional RFID labels. The inventive label only consists of one single substrate layer, i.e. no release layer or additional layer are necessary. The main benefit of this invention is minimized amount of raw material that enables cost optimization and environmentally friendly very thin product structure.
This means that each roll will have about two times more labels, which in turns means that shipment costs, and related pollution, will be greatly reduced. The production processes become more efficient as rolls need to be exchanged less often. The carbon footprint of the product is obviously reduced in comparison to conventional RFID labels.
In the foregoing, the invention has been described based on some specific embodiments. However, a person skilled in the art realises that other embodiments and variants are possible within the scope of the following claims.

Claims

C LA IM S
1. RFID label (1) comprising an RFID tag (7) which tag comprises an RFID antenna (5) and an IC (6), which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag, characterized in that the label further comprising:
- an elongated substrate (2) with a first surface (3) and a second surface (4), wherein the first surface is siliconized, and the second surface is carrying the RFID tag (7), and
- a sticky adhesive layer (8) which is arranged onto the second surface of the substrate and over the RFID tag.
2. RFID label according to claim 1, characterized in that the RFID label is rolled up to form a roll, such that the siliconized first surface (3) of the substrate facing against and covering the adhesive layer (8).
3. RFID label according to any of claims 1-2, characterized in that the substrate (2) is made of a paper or paper board.
4. RFID label according to any of claims 1-3, characterized in that the elongated substrate carrying several RFID tags which are arranged on the substrate at a predetermined distance between two adjacent RFID tags.
5. RFID label according to claim 4, characterized in that the substrate is perforated between two adjacent tags, such that they can be separated manually or automatically in tag application process.
6. RFID label according to any of claims 1-5, characterized in that the RFID antenna has been formed directly onto the second surface of the substrate and the IC has been attached onto the antenna, such that, an electrical connection between the IC and the antenna has been established.
7. RFID label according to claim 6, characterized in that the RFID antenna is formed by an antenna pattern of electrically conductive solid particles and that the conductive material has been heated to a temperature exceeding a characteristic melting point of the material, such that the RFID antenna is formed.
8. RFID label according to claim 6, characterized in that the RFID antenna has been produced by additive printing, wherein the antenna has been printed with a conductive ink.
9. RFID label according to claim 6, characterized in that the substrate is laminated with a conductive layer and wherein the RFID is formed by using subtractive manufacturing, wherein parts of the conductive layer is subtracted, such that the remaining conductive layer on the substrate web forms the RFID antenna.
PCT/IB2020/060346 2019-11-08 2020-11-04 Rfid label Ceased WO2021090189A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US17/755,766 US11928536B2 (en) 2019-11-08 2020-11-04 RFID label
CN202080077912.2A CN115023858A (en) 2019-11-08 2020-11-04 RFID tag
EP20884198.1A EP4055660A4 (en) 2019-11-08 2020-11-04 RFID TAG
BR112022008802A BR112022008802A2 (en) 2019-11-08 2020-11-04 RFID LABEL

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE1951287A SE543748C2 (en) 2019-11-08 2019-11-08 Rfid label
SE1951287-0 2019-11-08

Publications (1)

Publication Number Publication Date
WO2021090189A1 true WO2021090189A1 (en) 2021-05-14

Family

ID=75849606

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2020/060346 Ceased WO2021090189A1 (en) 2019-11-08 2020-11-04 Rfid label

Country Status (6)

Country Link
US (1) US11928536B2 (en)
EP (1) EP4055660A4 (en)
CN (1) CN115023858A (en)
BR (1) BR112022008802A2 (en)
SE (1) SE543748C2 (en)
WO (1) WO2021090189A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4296894A4 (en) * 2021-02-17 2024-04-03 Fujitsu Frontech Limited Rfid tag
US12462490B2 (en) * 2022-10-31 2025-11-04 Bank Of America Corporation Private data-less card device enabled for augmented reality display of data

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120012658A1 (en) * 2010-01-29 2012-01-19 Kiichi Komiyama Rfid label and rfid label manufacturing method
JP5167828B2 (en) * 2008-01-21 2013-03-21 凸版印刷株式会社 IC tag for forgery prevention
CN103824109A (en) * 2014-03-12 2014-05-28 厦门英诺尔信息科技有限公司 Transfer-prevention and adhesive-residue-free electronic tag of RFID (radio frequency identification device) as well as preparation method of electronic tag
WO2016189446A1 (en) * 2015-05-26 2016-12-01 Stora Enso Oyj Method and an arrangement for producing electrically conductive patterns on substrates
EP3435359A1 (en) * 2017-07-26 2019-01-30 Mediaform Informationssysteme GmbH Marking tape and method for its production

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6618024B1 (en) * 2002-03-21 2003-09-09 Brady Worldwide, Inc. Holographic label with a radio frequency transponder
CN1751546A (en) * 2003-03-05 2006-03-22 英滕电路公司 Method for manufacturing an electrically conductive pattern
JP2005019571A (en) * 2003-06-24 2005-01-20 Canon Inc Chip mounting method and mounting board manufacturing apparatus
WO2005022443A2 (en) * 2003-08-29 2005-03-10 Mikoh Corporation A radio frequency identification tag with tamper detection capability
US7259678B2 (en) * 2003-12-08 2007-08-21 3M Innovative Properties Company Durable radio frequency identification label and methods of manufacturing the same
ITMO20050017A1 (en) * 2005-01-28 2006-07-29 Windinglab S R L APPARATUS AND METHOD TO REALIZE AN ANTENNA FOR A RADIOFREQUENCY IDENTIFICATION DEVICE.
JP2007206800A (en) * 2006-01-31 2007-08-16 Fujitsu Ltd RFID tag series winding method and RFID tag roll
DE102006052517A1 (en) * 2006-11-06 2008-05-08 Bielomatik Leuze Gmbh + Co.Kg Chip module for an RFID system
DE102008013703A1 (en) * 2008-03-11 2009-09-17 Spezialdruckerei Mathias Lück, Inhaber Michael Lück e.K. Label arrangement comprises a carrier layer made of paper, an anti-stick layer made of silicone material, a first adhesive layer, a material strengthening layer made of plastic foil, a second adhesive layer and a printable cover
US8857724B2 (en) * 2009-03-10 2014-10-14 Wal-Mart Stores, Inc. Universal RFID tags and methods
US9076092B2 (en) 2009-05-08 2015-07-07 Confidex Ltd. RFID transponder and a method for fabricating the same
WO2012110702A2 (en) * 2011-02-17 2012-08-23 Upm Rfid Oy Label with radio frequency transponder
US20140079894A1 (en) * 2012-09-17 2014-03-20 Sihl Gmbh Multilayer article having cold seal coatings
WO2016105942A1 (en) * 2014-12-23 2016-06-30 3M Innovative Properties Company Flexible radio frequency identification tags
SE1751265A1 (en) * 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5167828B2 (en) * 2008-01-21 2013-03-21 凸版印刷株式会社 IC tag for forgery prevention
US20120012658A1 (en) * 2010-01-29 2012-01-19 Kiichi Komiyama Rfid label and rfid label manufacturing method
CN103824109A (en) * 2014-03-12 2014-05-28 厦门英诺尔信息科技有限公司 Transfer-prevention and adhesive-residue-free electronic tag of RFID (radio frequency identification device) as well as preparation method of electronic tag
WO2016189446A1 (en) * 2015-05-26 2016-12-01 Stora Enso Oyj Method and an arrangement for producing electrically conductive patterns on substrates
EP3435359A1 (en) * 2017-07-26 2019-01-30 Mediaform Informationssysteme GmbH Marking tape and method for its production

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4055660A4 *

Also Published As

Publication number Publication date
BR112022008802A2 (en) 2022-07-26
SE543748C2 (en) 2021-07-13
SE1951287A1 (en) 2021-05-09
CN115023858A (en) 2022-09-06
EP4055660A1 (en) 2022-09-14
US11928536B2 (en) 2024-03-12
EP4055660A4 (en) 2023-11-29
US20220414412A1 (en) 2022-12-29

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