WO2021147691A1 - 摄像组件及电子设备 - Google Patents

摄像组件及电子设备 Download PDF

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Publication number
WO2021147691A1
WO2021147691A1 PCT/CN2021/070785 CN2021070785W WO2021147691A1 WO 2021147691 A1 WO2021147691 A1 WO 2021147691A1 CN 2021070785 W CN2021070785 W CN 2021070785W WO 2021147691 A1 WO2021147691 A1 WO 2021147691A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
circuit board
flexible heat
camera module
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/070785
Other languages
English (en)
French (fr)
Inventor
王森
施健
袁志
唐卫东
周阿龙
刘晨晗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP21744457.9A priority Critical patent/EP4084462B1/en
Publication of WO2021147691A1 publication Critical patent/WO2021147691A1/zh
Priority to US17/871,533 priority patent/US12085840B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0007—Movement of one or more optical elements for control of motion blur

Definitions

  • This application relates to the field of camera technology, and in particular to a camera assembly and electronic equipment.
  • An electronic device is equipped with a rotatable camera module to have a large-angle anti-shake function.
  • the camera module rotates, the bottom end of the camera module is suspended, causing the bottom to be wrapped in air, which hinders the heat dissipation of the camera module.
  • the temperature of components in the camera module (such as image sensor or lens) is too high, the photographing performance of the electronic device will be significantly affected, for example, focusing speed, image clarity, image noise, etc.
  • the technical problem to be solved by this application is to provide a camera assembly and electronic equipment that can improve heat dissipation performance.
  • a camera assembly which includes an auxiliary bracket, a rotating camera module, and a flexible heat-conducting member.
  • the rotating camera module is arranged on the auxiliary bracket, and the rotating camera module includes a rotating bracket and a device.
  • the camera function group on the rotating bracket, the rotating bracket is rotatably connected with the auxiliary bracket, the flexible heat-conducting member is fixedly connected with one end of the camera function group, and the flexible heat-conducting member is also used to connect with the non-rotating
  • the camera module components are connected to transfer the heat generated by the camera function group to the non-rotating camera module components.
  • the so-called non-rotating camera module components are components other than the rotating camera module, for example, auxiliary brackets, main circuit boards of electronic equipment, main brackets of electronic equipment, etc., flexible heat-conducting parts and
  • the camera function group is fixedly connected, and the flexible heat-conducting member is also used to connect with the non-rotating camera module component, so as to conduct the heat generated by the rotating camera module to the non-rotating camera module component, that is, the heat generated by the rotating camera module
  • the heat is transferred from the area where the rotating camera module is located to other areas to achieve cross-regional heat transfer, which is conducive to reducing the surrounding temperature of the rotating camera module, thereby improving the quality of the image taken by the rotating camera module and extending the cost of the rotating camera module. filming time. Due to the flexibility of the flexible heat-conducting element, it will not interfere with the rotation of the camera function group relative to the auxiliary support.
  • the camera function group includes a lens module, a driving component, a driving circuit board, a reinforcement board, and an image sensor
  • the lens module is arranged at On the rotating bracket
  • the driving component is used to drive the rotating bracket to rotate relative to the auxiliary bracket
  • the driving circuit board is fixed to one end of the lens module
  • the image sensor is arranged on the driving circuit board
  • the reinforcing plate is arranged on the side of the driving circuit board away from the lens module, and the flexible heat conducting member is fixedly connected to the reinforcing plate.
  • the reinforcing plate can effectively strengthen the strength of the driving circuit board.
  • the driving circuit board, the reinforcing plate, the flexible heat-conducting member, and the non-rotating camera module components connected to the flexible heat-conducting member form a heat-conducting channel, thereby transferring the heat generated by the image sensor to the non-rotating camera
  • the temperature of the image sensor and the temperature of the lens module are effectively reduced, thereby improving the photographing performance and photographing efficiency of the rotating camera module.
  • the auxiliary support includes a body and a partition protruding from one side of the body,
  • the main body forms an accommodation space
  • the partition divides the accommodation space into a first accommodation part and a second accommodation part
  • the rotating camera module is accommodated in the first accommodation part
  • the camera assembly further includes a fixed
  • the fixed module is a fixed camera module or an auxiliary camera module.
  • the rotating camera module is accommodated in the first accommodating part divided by the partition, which can effectively isolate the influence of heat generated by other modules on the rotating camera module.
  • the fixed module and the rotating camera module cooperate with each other, which can effectively improve the image quality of the camera assembly.
  • the flexible heat-conducting member partially extends to the fixed module and is connected to the fixed module.
  • the fixed modules are attached to each other to realize the transfer of the heat of the rotating camera module to the fixed module, and effectively reduce the temperature of the rotating camera module.
  • the flexible heat-conducting member partially extends toward the partition and interacts with the The partitions are attached to each other so that the heat generated by the rotating camera module is transferred from the area where the rotating camera module is located to the auxiliary bracket, that is, the flexible heat-conducting member and the auxiliary bracket form a heat conduction channel, which improves the heat dissipation efficiency of the rotating camera module.
  • the partition in the fifth possible implementation manner of the first aspect, includes a first installation section and a second installation section One end of the first installation section is fixedly connected to the main body, and the second installation section is formed by bending and extending the other end of the first installation section and is fixedly connected to the main body.
  • a receiving portion is surrounded by the main body and the first installation section, and the second receiving portion is surrounded by the main body, the first installation section, and the second installation section.
  • the flexible heat-conducting element is attached to the second installation section, which is beneficial to increase the contact area between the partition and the flexible heat-conducting element, thereby improving the heat-conducting efficiency of the flexible heat-conducting element.
  • the camera assembly further includes a connector and a flexible circuit board, and the flexible The heat-conducting element is attached to the flexible circuit board, one end of the flexible circuit board is electrically connected to the rotating camera module, and the end of the flexible circuit board away from the rotating camera module is fixed to the connector and Electrical connection, and the connector is used to fix and electrically connect with the circuit board of the electronic device.
  • the flexible heat-conducting part conducts the heat of the rotating camera module to the flexible circuit board, and improves the efficiency of the camera component to transfer heat across regions of the rotating camera module.
  • the flexible heat conducting member is partially exposed from the flexible circuit board for It is fixedly connected with the shielding cover provided on the main circuit board of the electronic device, that is, the flexible heat-conducting element and the shielding cover also form a heat conduction path, which further improves the efficiency of the camera component to transfer heat across regions of the rotating camera module.
  • the flexible heat-conducting member includes a connection area and a suspended area that are connected and arranged, so The connecting area is connected to the camera function group, and the flexible heat-conducting element is located in the suspended area and has a bent structure, which can effectively reduce the micro-movement caused by the stretching/shrinking of the flexible heat-conducting element during the rotation of the rotating camera module. Resistance to avoid jamming, noise, etc.
  • these shapes can also effectively reduce the rupture and delamination of the flexible thermal conductive member caused by the stretching/shrinking of the flexible thermal conductive member in the suspended area , Degumming and other reliability issues and heat transfer performance degradation issues.
  • the shape of the suspended area is at least one of Z shape, sawtooth shape, arc shape, square wave shape, and pulse shape,
  • the flexible heat conducting member on the suspended area is provided with a stress groove , It is used to buffer the stress generated by the turning and pulling of the flexible thermal conductive member due to the camera function group, which can effectively reduce the shear force generated in the flexible thermal conductive member when the rotating camera module is twisted, and avoid local tearing and degumming.
  • the decrease in heat transfer performance can also weaken the reaction torque of the flexible thermal conductive member to the rotating camera module, and reduce the risk of jamming, noise, and increased power consumption of the rotating camera module.
  • the camera component further includes a camera fixed to the camera function group and the In the semiconductor refrigerator between the flexible heat-conducting parts, the cold surface of the semiconductor refrigerator is set toward the camera function group, and the hot surface of the semiconductor refrigerator is set toward the flexible heat-conducting part, which further improves the rotation of the camera module.
  • the heat dissipation efficiency of the group is not limited to the camera function group and the In the semiconductor refrigerator between the flexible heat-conducting parts, the cold surface of the semiconductor refrigerator is set toward the camera function group, and the hot surface of the semiconductor refrigerator is set toward the flexible heat-conducting part, which further improves the rotation of the camera module.
  • the camera function group and the flexible heat conducting member are connected to one end opposite to each other.
  • the auxiliary bracket When the auxiliary bracket is rotated, it is suspended, so that the connecting end of the camera function group and the flexible heat-conducting member is easily wrapped by air.
  • the flexible heat-conducting element is connected between the camera function group and the non-rotating camera module component, the flexible heat-conducting element can quickly transfer the heat generated by the camera function module to the non-rotating camera module component, effectively reducing the camera function group and the non-rotating camera module component.
  • the temperature of the surroundings when one end of the flexible heat-conducting member is suspended due to rotation relative to the auxiliary support thereby improving the photographing performance of the camera assembly.
  • the present application also provides an electronic device, including the above-mentioned camera assembly, a main bracket, and a main circuit board, the main circuit board is fixed on the main bracket, and the auxiliary bracket is fixed on the main bracket.
  • the main support exposes a side of the main circuit board away from the main support, and the rotating camera module is electrically connected to the main circuit board.
  • the heat generated by the rotating camera module is transferred across regions through the flexible heat-conducting member, which is beneficial to reduce the temperature around the rotating camera module, thereby improving the imaging quality of the rotating camera module and shortening the rotating camera module. Response time of the group.
  • the flexible heat-conducting part extends toward the main support and is attached to the main support, that is, the flexible heat-conducting part and the The main support forms a heat conduction channel, and the flexible heat conduction member transfers heat from the rotating camera module to the main support, which is beneficial to improve the heat dissipation efficiency of the camera assembly.
  • the main support is provided with a recessed portion on the side facing the auxiliary support, and
  • the concave portion is aligned with the rotating camera module, and the concave portion is used to facilitate the installation of the flexible heat-conducting member and can effectively increase the heat dissipation space of the rotating camera module, thereby improving the heat dissipation efficiency of the camera component .
  • the flexible heat-conducting member partially penetrates the recessed portion, and It is fixedly connected to the side of the main support away from the auxiliary support, effectively increasing the heat conduction channel formed by the flexible heat conducting member and the main support, thereby improving the heat dissipation effect on the area of the rotating camera module.
  • the recessed portion is a through hole, and the flexible heat conducting member penetrates At the recessed portion and fixedly connected to the side of the main support away from the auxiliary support.
  • the camera assembly further includes a connector and a flexible circuit board, and the connection The device is arranged on the main circuit board, one end of the flexible circuit board is electrically connected to the rotating camera module, and the flexible heat conducting member is at least partially attached to the flexible circuit board away from the rotating camera module On one side of the flexible circuit board, one end of the flexible circuit board away from the rotating camera module is fixed and electrically connected to the connector.
  • the main circuit board further includes a shielding cover, and the shielding cover is spaced apart from each other.
  • the connector is arranged on the main circuit board, the flexible heat-conducting element is fixedly connected to the shielding cover, and the shielding cover is used for electromagnetic shielding.
  • the flexible heat-conducting element is fixedly connected with the shielding cover, so that the heat of the rotating camera module is conducted to the shielding cover, the heat dissipation surface of the rotating camera module is enlarged, and the flexibility of heat dissipation of the camera assembly is improved.
  • the seventh possible implementation manner of the second aspect there is a gap between the main circuit board and the auxiliary support, so The shielding cover and the connector are both provided on the side of the main circuit board away from the main support, the flexible heat-conducting member and the flexible circuit board are both penetrated through the gap, and the shielding cover is located at the side of the main circuit board away from the main support.
  • the flexible heat-conducting element and the flexible circuit board pass through the gap, and the end of the flexible circuit board away from the rotating camera module is removed from the flexible heat-conducting element
  • the extension is fixedly connected with the connector.
  • the flexible heat-conducting element conducts heat to the side of the circuit board away from the main support, effectively increasing the heat-conducting channel of the rotating camera module.
  • the eighth possible implementation manner of the second aspect there is a gap between the main circuit board and the auxiliary support, so
  • the connector is provided on the side of the main circuit board facing away from the main support
  • the shielding cover is provided on the side of the main circuit board facing the main support
  • the flexible circuit board is away from the rotating camera module
  • One end of the group is separated from the flexible heat-conducting member and penetrates the gap, and the connector and the shielding cover are separately opened on both sides of the circuit board.
  • the flexible circuit board conducts heat to the side of the circuit board away from the main support
  • the flexible heat-conducting member conducts heat to the side of the circuit board facing the main support to effectively increase the heat conduction channel of the rotating camera module.
  • the connector is provided on the main circuit board away from the main support On one side, there is a gap between the main circuit board and the auxiliary bracket, the main bracket is provided with a concave portion penetrating the main bracket, and the rotating camera module is provided corresponding to the concave portion, so
  • the first end of the flexible heat-conducting element is fixedly connected to the side of the main support away from the auxiliary support through the recessed portion, the flexible circuit board and the flexible heat-conducting element pass through the gap, the The second end of the flexible heat-conducting member is fixedly connected with the connector, and the main bracket, the flexible heat-conducting member, and the flexible circuit board jointly form a heat-conducting channel, which further improves the heat dissipation efficiency of the rotating camera module area.
  • the flexible heat conducting member extends from the bottom of the rotating camera module to Between the fixed module and the main bracket, the flexible heat-conducting member is in contact with the fixed module and the main bracket, so that the heat generated by the rotating camera module is transferred from the area where the rotating camera module is located to The fixed module and the main bracket increase the heat dissipation channel of the rotating camera module.
  • FIG. 1 is a structural block diagram of an electronic device provided by the first embodiment of this application.
  • FIG. 2 is a schematic diagram of an application scenario of the electronic device shown in FIG. 1;
  • FIG. 3 is a schematic diagram of a part of the structure of an electronic device provided by the first embodiment of the application;
  • Figure 4 is a schematic diagram of an arrangement of camera components
  • Figure 5 is a schematic diagram of another arrangement of camera components
  • Figure 6 is a schematic diagram of another arrangement of camera components
  • Figure 7 is a schematic diagram of another arrangement of camera components
  • FIG. 8 is a top view of the rotating camera module provided by the first embodiment of this application.
  • FIG. 9 is a cross-sectional view of the rotating camera module provided by the first embodiment of the application.
  • Figure 10 is a perspective schematic view of a part of a flexible heat conducting element
  • Fig. 11 is a schematic diagram of a zigzag-shaped flexible heat conducting member in the suspended area
  • Fig. 12 is a schematic diagram of a zigzag shape of the flexible heat-conducting element in the suspended area
  • FIG. 13 is a schematic diagram of the flexible heat-conducting element in the suspended area being arc-shaped
  • Fig. 14 is a schematic diagram of a square wave form of a flexible thermal conductive element in a suspended area
  • Fig. 15 is a schematic diagram of a flexible thermal conductive element in a suspended area in a pulse shape
  • Fig. 16 is a schematic diagram of a flexible heat conducting member provided with an arc-shaped first stress groove at the near fixed end of the suspended area;
  • FIG. 17 is a schematic diagram of a flexible thermal conductive member having arc-shaped first stress grooves at both the near fixed end and the near heat source end of the suspended area;
  • FIG. 18 is a schematic diagram of a first stress groove with a double-arc structure provided at the proximal fixed end of the flexible heat-conducting element in the suspended area;
  • Figure 19 is a schematic diagram of a flexible thermal conductive member having a second stress groove in a suspended area
  • Figure 20 is a schematic diagram of an arrangement of a camera assembly with a rotating camera module and three fixed modules;
  • 21 is a schematic diagram of another arrangement of a camera assembly with a rotating camera module and three fixed modules;
  • Figure 22 is a schematic diagram of an L-shaped flexible heat conducting member
  • Figure 23 is a schematic diagram of the flexible heat conducting element in a mouth shape
  • Figure 24 is a schematic diagram of a flexible heat conducting element in a strip shape
  • FIG. 25 is a schematic diagram of an arrangement of a camera assembly with a rotating camera module and a fixed module
  • Figure 26 is a schematic diagram of another arrangement of a camera assembly with a rotating camera module and a fixed module
  • Figure 27 is a schematic diagram of an arrangement of a camera assembly with a rotating camera module
  • FIG. 28 is a schematic diagram of another arrangement of the camera assembly with a rotating camera module
  • Figure 29 is a schematic diagram of another arrangement of a camera assembly with a rotating camera module
  • Figure 30 is a schematic diagram of the arrangement of a camera assembly with a rotating camera module and a fixed module
  • Figure 31 is a schematic diagram of the arrangement of a camera assembly with a rotating camera module and two fixed modules;
  • FIG. 32 is a schematic diagram of a part of the structure of an electronic device provided by the second embodiment of this application.
  • FIG. 33 is a schematic diagram of a part of the structure of an electronic device provided by the third embodiment of this application.
  • FIG. 34 is a schematic diagram of a part of the structure of an electronic device provided by the fourth embodiment of this application.
  • FIG. 35 is a schematic diagram of a part of the structure of an electronic device provided by the fifth embodiment of this application.
  • FIG. 36 is a schematic diagram of a part of the structure of an electronic device provided by the sixth embodiment of this application.
  • FIG. 37 is a schematic diagram of a part of the structure of an electronic device provided by the seventh embodiment of this application.
  • FIG. 38 is a schematic diagram of a part of the structure of an electronic device provided by the eighth embodiment of this application.
  • FIG. 39 is a schematic diagram of a part of the structure of an electronic device provided by a ninth embodiment of this application.
  • FIG. 40 is a schematic diagram of a part of the structure of an electronic device provided by a tenth embodiment of this application.
  • FIG. 41 is a schematic diagram of a part of the structure of an electronic device provided by the eleventh embodiment of this application.
  • FIG. 1 is a structural block diagram of an electronic device provided by the first embodiment of this application.
  • the electronic device 10 includes a camera component 11, a processor 13, a communication bus 14, at least one communication interface 15 and a memory 16.
  • the processor 13 is communicatively connected with the camera assembly 11, the at least one communication interface 15, and the memory 16 through a communication bus 14.
  • the electronic device 10 is an electronic device equipped with a camera component 11, such as a smart phone, a smart watch, a tablet computer, a personal digital assistant (PDA), a notebook computer, a drone, a monitoring device, and so on.
  • PDA personal digital assistant
  • the processor 13 may be a central processing unit (Central Processing Unit, CPU), other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (ASIC), and on-site Field-Programmable Gate Array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc.
  • the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.
  • the processor 13 is the control center of the electronic device 10 and connects various parts of the entire electronic device 10 through various interfaces and lines.
  • the communication bus 14 may include a path for transferring information between the aforementioned components.
  • the communication interface 15 is a device that uses any transceiver to communicate with other devices or communication networks, such as Ethernet, radio access network (RAN), wireless local area networks (WLAN) Wait.
  • RAN radio access network
  • WLAN wireless local area networks
  • the memory 16 may be used to store computer programs and/or modules.
  • the processor 13 implements various functions of the electronic device 10 by running or executing the computer programs and/or modules stored in the memory 16 and calling data stored in the memory 16 .
  • the memory 16 may mainly include a program storage area and a data storage area.
  • the program storage area may store an operating system, application programs required by multiple functions (such as sound playback function, image playback function, etc.), etc.; the data storage area may store data according to The data (such as audio data, phone book, etc.) created by the use of the terminal 10, etc.
  • the memory 16 may include a high-speed random access memory, and may also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), and a Secure Digital (SD) Card, Flash Card, multiple disk storage devices, flash memory devices, or other volatile solid-state storage devices.
  • a non-volatile memory such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), and a Secure Digital (SD) Card, Flash Card, multiple disk storage devices, flash memory devices, or other volatile solid-state storage devices.
  • SD Secure Digital
  • Flash Card multiple disk storage devices
  • flash memory devices or other volatile solid-state storage devices.
  • the memory 16 may exist independently, and is connected to the processor 13 through the communication bus 14.
  • the memory 16 may also be integrated with the processor 13.
  • the electronic device 10 may include multiple processors 13, such as CPU0 and CPU1 in FIG. 1.
  • processors 13 may be a single-CPU (single-CPU) processor or a multi-core (multi-CPU) processor.
  • the processor here may refer to one or more devices, circuits, and/or processing cores for processing data (for example, computer program instructions).
  • the electronic device 10 further includes a speaker 17 and a display screen 18 that are electrically connected to the processor 13.
  • the display screen 18 is a touch display screen.
  • the side of the electronic device 10 provided with the display screen 18 is the front side, and the side of the electronic device 10 facing away from the display screen 18 is the back side.
  • FIG. 1 is only an example of the electronic device 10, and does not constitute a limitation on the electronic device 10.
  • the electronic device 10 may include more or less components than those shown in FIG. 1, or some components may be combined. , Or different components, for example, the electronic device 10 may also include input and output devices, network access devices, etc., which are not limited herein.
  • FIG. 2 is a schematic diagram of an application scenario of the electronic device shown in FIG. 1.
  • the electronic device 10 is a consumer electronic device such as a smart phone.
  • the camera assembly 11 is a rear camera assembly for photographing a scene facing the back of the electronic device 10.
  • the processor 13 detects the triggering event of the virtual button 101 corresponding to the camera application, it controls to start the camera component 11 and enters the camera interface accordingly to facilitate the user to capture images.
  • the application scenario of the electronic device 10 shown in FIG. 2 is only an example, which is not limited in this application.
  • FIG. 3 is a partial structural diagram of the electronic device provided by the first embodiment of this application.
  • the electronic device 10 further includes a main bracket 19 and a main circuit board 20.
  • the main circuit board 20 is fixed on the main bracket 19.
  • the processor 13 may be disposed on the main circuit board 20 or other structures, and it is not limited herein.
  • the main circuit board 20 is provided with a through hole 21, and the camera assembly 11 passes through the through hole 21 and exposes the side of the main circuit board 20 away from the main support 19.
  • the camera assembly 11 includes an auxiliary bracket 113, a rotating camera module 114, a first fixed module 115, a second fixed module 116 and a flexible heat-conducting member 117.
  • the rotating camera module 114, the first fixing module 115, and the second fixing module 116 are all electrically connected to the processor 13.
  • the auxiliary bracket 113 is protruded from the main bracket 19 for supporting the rotating camera module 114, the first fixed module 115 and the second fixed module 116.
  • the auxiliary bracket 113 is fixedly connected to the main bracket 19, and the auxiliary bracket 113 forms a receiving space 1101 for accommodating the rotating camera module 114, the first fixed module 115 and the second fixed module 116.
  • the auxiliary bracket 113 includes a main body 1121 and a partition 1130 fixed on the main body 1121.
  • the main body 1121 is fixed on the main bracket 19 and penetrates through the through hole 21.
  • the partition 1130 is received in the accommodating space 1101, and the partition 1130 divides the accommodating space 1101 into a first accommodating portion 1131 and a second accommodating portion 1132.
  • the second receiving portion 1132 includes a first receiving portion 1133 and a second receiving portion 1135.
  • the first receiving portion 1131 is located between the first receiving portion 1133 and the second receiving portion 1135.
  • a recessed portion 191 is formed on the main bracket 19.
  • the concave portion 191 is aligned with the first receiving portion 1131 and the rotating camera module 114 is contained in the concave portion 191.
  • the concave portion 191 is also aligned with the rotating camera module 114 housed in the first receiving portion 1131. As shown in FIG. 3, the rotating camera module 114 is located directly above the concave portion 191.
  • the arrangement of the concave portion 191 aligned with the rotating camera module 114 means that the rotating camera module 114 and the concave portion 191 are arranged in a stack parallel to the main bracket 19 and the auxiliary bracket 113. On the axis of the direction, the stacking direction is a direction perpendicular to the first direction Y shown in FIG. 3.
  • the recessed portion 191 is used to provide a larger space for the rotating camera module 114 to prevent the rotation of the rotating camera module 114 from being disturbed, and to facilitate the installation of the flexible heat-conducting member 117 at one end of the rotating camera module 114 facing the main bracket 19.
  • the recessed portion 191 extends from the area corresponding to the first receiving portion 1131 to the corresponding area of the first receiving portion 1133 adjacent to the first receiving portion 1131, and the second The end of the secondary receiving portion 1135 and the first receiving portion 1131 corresponds to an area.
  • the length of the recessed portion 191 is greater than the length of the first receiving portion 1131 and smaller than the length of the auxiliary bracket 113.
  • the main bracket 19 is the middle frame of the electronic device 10.
  • the recessed portion 191 is a groove provided on the side of the main bracket 19 facing the auxiliary bracket 113. It can be understood that the main support 19 can also be a support structure such as a motherboard support.
  • the rotating camera module 114 is accommodated in the first accommodating portion 1131. There is a gap between the rotating camera module 114 and the bottom of the concave portion 191. In other words, the rotating camera module 114 is suspended relative to the main bracket 19.
  • the first fixing module 115 is fixed to the first accommodating part 1133, and the second fixing module 116 is fixed to the second accommodating part 1135.
  • the flexible heat-conducting member 117 has flexibility.
  • the approximate middle of the flexible heat-conducting element 117 is fixedly connected to the end of the rotating camera module 114 facing the main support 19, and the first end of the flexible heat-conducting element 117 is connected to the end of the first fixed module 115 facing the main support 19 and Between the main brackets 19 and the second end of the flexible heat conducting member 117 is connected between the end of the second fixing module 116 facing the main bracket 19 and the main bracket 19, thereby removing the heat generated by the rotating camera module 114 from the rotating camera module.
  • the area where the group 114 is located is transferred to the area where the first fixed module 115 and the second fixed module 116 are located to achieve cross-regional heat transfer.
  • the flexible heat-conducting member 117 is fixedly connected to the bottom of the rotating camera module 114, and the flexible heat-conducting member 117 extends from the bottom of the rotating camera module 114 to the bottoms of the first fixed module 115 and the second fixed module 116.
  • the side of the flexible heat-conducting member 117 away from the first fixing module 115 and the second fixing module 116 is in contact with the main support 19 so that the heat generated by each camera module can be transferred to the main support 19 through the flexible heat-conducting member 117.
  • the flexible heat-conducting member 117 transfers heat from the rotating camera module 114 to other areas where the non-rotating camera module 114 is located, it is beneficial to reduce the surrounding temperature of the rotating camera module 114, thereby improving the image pickup rate of the rotating camera module 114. quality.
  • the flexible heat conducting member 117 is a graphite sheet. It is understandable that the flexible thermal conductive member 117 may be a combination of single/multilayer graphite, graphene film, copper foil, graphite copper foil composite material, thermally conductive plastic, phase change material (PCM for short), graphite and phase change material. Composite materials, liquid metal, heat pipes, vapor chamber (VC for short), etc.
  • the rotating camera module 114, the first fixing module 115, and the second fixing module 116 are all electrically connected to the main circuit board 20.
  • FIG. 4 is a schematic diagram of an arrangement of camera components.
  • the width direction of the main circuit board 20 is the first direction Y
  • the length direction of the main circuit board 20 is the second direction X
  • the length direction of the main circuit board 20 is the second direction X.
  • Y is perpendicular to the second direction X
  • the first fixed module 115, the rotating camera module 114, and the second fixed module 116 are arranged side by side in the first direction Y
  • the second fixing module 116 is arranged adjacent to a narrower side edge of the main circuit board 20.
  • the main circuit board 20 is sleeved outside the auxiliary support 113.
  • the main circuit board 20 may include two sub-circuit boards (not shown) arranged at intervals, and the auxiliary support 113 is arranged between the two sub-circuit boards.
  • the auxiliary bracket 113 is arranged adjacent to the main circuit board 20 and so on, and the auxiliary bracket 113 is fixed to the main bracket 19 and exposes the side of the main circuit board 20 away from the main bracket 19.
  • the arrangement of the rotating camera module 114, the first fixing module 115, and the second fixing module 116 on the main circuit board 20 is not limited by the examples in this application, in order to avoid other parts or components in the electronic device 10
  • adjust the arrangement of the first fixed module 115, the rotating camera module 114, and the second fixed module 116 in the camera assembly 11 please refer to FIG. 5, the first fixed module 115 , The rotating camera module 114 and the second fixed module 116 are arranged side by side in the first direction Y, and the rotating camera module 114, the first fixed module 115, and the second fixed module 116 correspond to approximately the middle of the main circuit board 20 Regional settings; for another example, please refer to FIG.
  • the first fixed module 115, the rotating camera module 114 and the second fixed module 116 are arranged side by side along the second direction X, the rotating camera module 114, the first fixed module 115 ,
  • the second fixed module 116 is arranged adjacent to a longer side edge of the main circuit board 20; for another example, please refer to FIG. 7, the first fixed module 115, the rotating camera module 114, and the second fixed module 116
  • the second direction X is arranged side by side, and the rotating camera module 114, the first fixed module 115, and the second fixed module 116 are arranged corresponding to the central area of the main circuit board 20.
  • FIG. 8 is a top view of the rotating camera module in the first embodiment of this application.
  • the rotating camera module 114 includes a housing 1140, a rotating bracket 1141, and a camera function group 1041.
  • the housing 1140 is connected to the auxiliary bracket 113 through a bearing and is accommodated in the first receiving portion 1131.
  • the rotating bracket 1141 is rotatably connected with the inner wall of the housing 1140 through the first rotating shaft 1143, so that the rotating bracket 1141 and the auxiliary bracket 113 are rotatably connected.
  • the camera function group 1041 includes a lens module 1142 and a driving component 1145.
  • the lens module 1142 is accommodated in the rotating bracket 1141, the lens module 1142 is rotatably connected to the rotating bracket 1141 through the second rotating shaft 1144, and the light incident surface of the lens module 1142 is set in a direction away from the main bracket 19.
  • the driving component 1145 is used for driving the lens module 1142 to rotate around the first rotating shaft 1143 and the second rotating shaft 1144 to perform large-angle optical image stabilization. It can be understood that the lens module 1142 may not be rotatably connected to the rotating bracket 1141, and the lens module 1142 is fixed on the rotating bracket 1141.
  • the driving component 1145 is a magnetic circuit system to obtain high anti-shake accuracy.
  • the driving component 1145 includes a first magnet group 1151, a first coil group 1153, a second magnet group 1155 and a second coil group 1157.
  • the first magnet group 1151 is fixed on the rotating bracket 1141, and the first coil group 1153 is fixed on the inner wall of the housing 1140 facing the rotating bracket 1141.
  • the first coil group 1153 is sleeved outside the first rotating shaft 1143.
  • the interaction force between the magnetic field generated when the first coil assembly 1153 is energized and the magnetic field of the first magnet assembly 1151 can drive the rotating bracket 1141 to drive the lens module 1142 to rotate around the first rotating shaft 1143.
  • the second magnet group 1155 is fixed on the lens module 1142, and the second coil group 1157 is fixed on the side of the rotating bracket 1141 away from the housing 1140.
  • the second coil group 1157 is sleeved outside the second rotating shaft 1144.
  • the interaction force between the magnetic field generated when the second coil group 1157 is energized and the magnetic field of the second magnet group 1155 can drive the lens module 1142 to rotate around the second rotating shaft 1144.
  • the extending direction of the first rotating shaft 1143 is different from the extending direction of the second rotating shaft 1144.
  • the first rotating shaft 1143 and the second rotating shaft 1144 are perpendicular to each other.
  • the lens module 1142 can be synchronized to rotate around the first shaft 1143 and the second shaft 1144 at multiple angles.
  • FIG. 9 is a cross-sectional view of the rotating camera module provided by the first embodiment of the application.
  • the camera function group 1041 further includes a driving circuit board 1146, a reinforcement board 1147 and an image sensor 1148.
  • the driving circuit board 1146 is fixed to the end of the lens module 1142 facing the main bracket 19.
  • the driving circuit board 1146 is a rigid circuit board.
  • the reinforcing plate 1147 is attached to the side of the driving circuit board 1146 away from the lens module 1142, and the reinforcing plate 1147 is used to increase the strength of the driving circuit board 1146.
  • the image sensor 1148 is fixed on the side of the driving circuit board 1146 facing the lens module 1142, and is used to receive the light information entering from the light incident surface of the lens module 1142 and convert it into image information.
  • the image sensor 1148 is electrically connected to the driving circuit board 1146.
  • the image sensor 1148 is located between the driving circuit board 1146 and the lens module 1142. That is, the lens module 1142, the image sensor 1148, the driving circuit board 1146, and the reinforcement board 1147 are stacked in sequence.
  • One end of the rotating camera module 114 provided with the image sensor 1148 is the bottom of the rotating camera module 114, that is, the end of the rotating camera module 114 away from the light incident surface of the rotating camera module 114 is the bottom of the rotating camera module 114.
  • the rotating camera module 114 can omit the housing 1440 and be directly disposed on the auxiliary bracket 113, and the first coil group 1153 can be fixed on the inner wall of the auxiliary bracket 113.
  • the flexible heat-conducting member 117 is fixedly connected to the side of the reinforcing plate 1147 away from the lens module 1142, that is, the flexible heat-conducting member 117 is fixedly connected to the bottom of the rotating camera module 114, and the first end of the flexible heat-conducting member 117 is located at the first fixed module Between 115 and the main bracket 19, the second end of the flexible heat-conducting member 117 is located between the second fixing module 116 and the main bracket 19.
  • the heat generated by the image sensor 1148 can pass through the drive circuit board 1146 and the reinforcement board 1147.
  • the flexible heat-conducting element 117 are transferred to the first fixing module 115, the second fixing module 116 and the main support 19, namely the driving circuit board 1146, the reinforcing plate 1147, the flexible heat-conducting element 117, the first fixing module 115, and the second
  • the fixed module 116 and the main bracket 19 form multiple heat conduction paths to realize cross-regional heat dissipation.
  • the heat generated by the camera function group 1041 can be quickly transferred to the first fixing module 115, the second fixing module 116 and the main bracket 19 via the flexible heat-conducting member 117, the surrounding temperature of the image sensor 1148 and the lens module 1142 is effectively reduced Therefore, the quality of the captured image of the rotating camera module 1041 is improved and the shooting time of the rotating camera module 114 is prolonged.
  • first end of the flexible heat-conducting element 117 can be attached between the first fixing module 115 and the main support 19 through glue, or can be directly arranged between the first fixing module 115 and the main support 19;
  • the second end of the member 117 may be attached between the second fixing module 116 and the main bracket 19 by glue, or may be directly disposed between the second fixing module 116 and the main bracket 19.
  • the driving component 1145 is not limited to a magnetic circuit system, and it may also be other driving structures.
  • the extension direction of the flexible heat-conducting element 117 is not limited.
  • the flexible heat-conducting element 117 is partially fixed to the reinforcing plate 1147, and the flexible heat-conducting element 117 is fixedly connected to the reinforcing plate 1147 and partially extends toward the outside of the rotating camera module 114 to be non-rotating. The other area where the camera module 114 is located is sufficient.
  • the camera function group 1041 can omit the reinforcing plate 1147 and directly connect the flexible heat conducting member 117 and the driving circuit board 1146 in a fixed manner.
  • the flexible heat-conducting member 117 includes three connecting regions 1171 and two suspended regions 1173 connected to each other.
  • the first connecting area 1171 is located at the first end of the flexible heat-conducting element 117
  • the flexible heat-conducting element 117 of the first connecting area 1171 is located between the first fixing module 115 and the main support 19, and is connected to the first fixing module.
  • the second connection area 1171 is provided at the second end of the flexible heat-conducting element 117, and the flexible heat-conducting element 117 of the second connection area 1171 is located between the second fixing module 116 and the main support 19, And connects with the second fixed module 116 and the main bracket 19;
  • the third connecting area 1171 is roughly located in the middle area of the flexible heat-conducting member 117, and the flexible heat-conducting member 117 of the third connecting area 1171 is at the bottom of the rotating camera module 114 Fixed connection.
  • the flexible heat-conducting element 117 of the suspended area 1173 is a part of the flexible heat-conducting element 117 that is not in contact with other structural elements, and each suspended area 1173 is located between the two connecting areas 1171.
  • the part of the flexible heat-conducting element 117 located in the suspended area 1173 is a bent structure, so as to reduce the stress generated by the flexible heat-conducting element 117 due to the rotation and pulling of the rotating camera module 114.
  • the bending structure of the flexible heat conducting member 117 in the suspended area 1173 includes a first connecting section 2171, a second connecting section 2172, a third connecting section 2173, and a fourth connecting section 2174, wherein, One end of the first connecting section 2171 is connected with a third connecting area 1171 for fixing with the rotating camera module 114 (the connecting area 1171 on the left side shown in FIG.
  • the second connecting section 2172 is connected by the first
  • the third connecting segment 2173 is formed by bending and extending the end of the second connecting segment 2172 away from the first connecting segment 2171
  • the fourth connecting segment 2174 is formed by the third connecting segment 2173 away from the second connecting segment.
  • One end of the 2172 is bent and extended, and the end of the fourth connecting section 2174 away from the third connecting section 2173 is connected to a first connecting area 1171 for fixing with the main bracket 19.
  • the first connecting section 2171 and the third connecting section 2173 are substantially parallel
  • the second connecting section 2172 and the fourth connecting section 2174 are substantially parallel.
  • the structure and shape of the flexible heat-conducting element 117 located in the suspended area 1173 are not limited.
  • the structure shown in FIGS. 11-15 is a partial structure of the flexible heat-conducting element 117.
  • the suspended area 1173 is located between the two connecting areas 1171.
  • the connecting area 1171 is used to connect with the reinforcing plate 1147 at the bottom of the rotating camera module 114, and a connecting area 1171 is used to connect with the main support 19 or other areas.
  • the shape of the flexible heat conducting member 117 in the suspended area 1173 can be zigzag ( As shown in Fig. 11), sawtooth shape (as shown in Fig. 12), arc shape (as shown in Fig. 13), square waveform (as shown in Fig.
  • the shape of the flexible thermal conductive member 117 of the suspended area 1173 includes at least one of a zigzag shape, a sawtooth shape, an arc shape, a square wave shape, and a pulse shape. Since the suspended area 1173 is a bending structure, it can effectively reduce the micro-motion resistance caused by the stretching/shrinking of the flexible heat-conducting member 117 during the rotation of the rotating camera module 114, and avoid the rotation of the camera module 114 caused by excessive resistance.
  • the bending structure of the suspended area 1173 can also effectively reduce the reliability problems and transmission of the flexible heat conductive member 117 caused by the stretching/shrinkage of the flexible heat conductive member 117 in the suspended area 1173. Thermal degradation problem.
  • the suspended area 1173 includes a proximal end 1271 and a proximal end 1273.
  • the near heat source end 1273 is the end of the suspended area 1173 and the rotating camera module 114 that is relatively adjacent.
  • the flexible heat-conducting element 117 is provided with a first stress groove 1177 at the edge near the fixed end 1271 to buffer the stress generated when the flexible heat-conducting element 117 is bent.
  • the first stress groove 1177 can be processed by hollowing out the flexible heat conducting member 117, and the cross section is arc-shaped.
  • the arc of the cross section of the first stress groove 1177 ranges from 0 to 360 degrees, such as 90 degrees, 180 degrees, and so on.
  • the arrangement of the first stress groove 1177 can weaken the stress concentration, effectively reduce the shearing force generated in the flexible thermal conductive member 117 when the rotating camera module 114 rotates, avoid local tearing and degumming, and reduce the heat transfer performance, and can also weaken the flexible thermal conductivity
  • the reaction torque of the component 117 to the rotating camera module 114 reduces the risk of jamming, noise, and increased power consumption of the rotating camera module 114.
  • the flexible heat conducting member 117 is provided with first stress grooves 1177 at the edges near the fixed end 1271 and near the heat source end 1273.
  • the cross section of the first stress groove 1177 is arc-shaped, and the first stress groove 1177 is arc-shaped in cross section.
  • the arc of the stress groove 1177 is approximately 180 degrees.
  • a first stress groove 1177 is provided near the edge of the fixed end 1271.
  • the first stress groove 1177 includes a connecting section 1178, a first arc section 1179, and a second arc section 1180.
  • the connecting section 1178 is connected Between the first arc segment 1178 and the second arc segment 1179. That is, the first stress groove 1177 has a double arc structure. By performing a "double round" hollowing process on the edge of the proximal fixed end 1271, the stress buffer performance of the first stress groove 1177 is improved.
  • the flexible thermal conductive member 117 of the suspended area 1173 is provided with a plurality of second stress grooves 1277 spaced along the width direction of the flexible thermal conductive member 117 to buffer the stress generated when the flexible thermal conductive member 117 is bent.
  • the second stress groove 1277 extends from the proximal fixed end 1271 toward the proximal end 1273 of the heat source.
  • a first stress groove may also be provided near the fixed end 1271 and/or near the heat source end 1273. It can be understood that the extension direction of the second stress groove 1277 is not limited.
  • the shape and arrangement of the stress grooves provided in the suspended area 1173 of the flexible heat-conducting member 117 are not limited.
  • the camera assembly 11 may include more than two fixed modules.
  • the auxiliary bracket 113 further includes a third receiving portion 1136, and the camera assembly 11 further includes a third receiving part 1136.
  • the third fixed module 121 in the accommodating portion 1136, the rotating camera module 114, the first fixed module 115, the second fixed module 116 and the third fixed module 121 are arranged in an array, the rotating camera module 114, the second A fixed module 115 is arranged along the second direction X and located in the same row, the second fixed module 116 and the third fixed module 121 are arranged along the second direction X and located in the same row, the rotating camera module 114 and the second fixed module
  • the groups 116 are arranged along the first direction Y and located in the same row, and the first fixing modules 115 and the third fixing modules 121 are arranged along the first direction Y and located in the same row.
  • the rotating camera module 114, the first fixing module 115, the second fixing module 116 and the third fixing module 121 are arranged corresponding to the central area of the main circuit board 20.
  • the rotating camera module 114, the first fixed module 115, the second fixed module 116, and the third fixed module 121 are adjacent to a narrow side edge of the main circuit board 20 set up.
  • the third fixed module 121 is a fixed camera module, or an auxiliary camera module such as a flashlight.
  • the shape of the flexible heat conducting element 117 can be based on the rotating camera module 114 and other fixed modules (for example, the first fixed module 115, and/or the second fixed module 116, and/or the third fixed module 121)
  • the arrangement of the flexible heat-conducting member 117 is generally L-shaped (as shown in FIG. 22), or mouth-shaped (as shown in FIG. 23), or strip-shaped (as shown in FIG. 24), which is not limited here.
  • the camera assembly 11 may omit the second fixed module 116.
  • the rotating camera module 114 and the first fixed module 115 are arranged in the Y direction along the first direction and are connected to the main circuit. A narrower side edge of the board 20 is arranged adjacent to each other; in one embodiment, referring to FIG. 26, the first fixed module 115 and the rotating camera module 114 are arranged along the first direction Y and are aligned with one of the main circuit board 20 The longer side edges are arranged adjacently.
  • the camera assembly 11 can omit the first fixing module 115 and the second fixing module 116.
  • the rotating camera module 114 is roughly aligned with a narrow side of the main circuit board 20. Adjacently arranged; in one embodiment, please refer to FIG. 28, the rotating camera module 114 is arranged roughly corresponding to the central area of the main circuit board 20.
  • the camera assembly 11 may be a front camera assembly.
  • the camera assembly 11 omits the first fixed module 115 and the second fixed module 116, and the input of the rotating camera module 114 is The light surface is aligned with the light incident surface of the display screen 18, that is, the rotating camera module 114 is used to capture objects facing the front of the electronic device 10, and the rotating camera module 114 is arranged adjacent to the top edge of the electronic device 100 to avoid the electronic device. 10; for another example, in one embodiment, please refer to FIG.
  • the second fixed module 116 is omitted from the camera assembly 11, and the first fixed module 115 and the rotating camera module 114 are sequentially along the second direction X Arranged and arranged adjacent to the top edge of the electronic device 100; for another example, in one embodiment, referring to FIG. 31, the camera module 114, the first fixing module 115, and the second fixing module 116 are rotated along the second The direction X is arranged at intervals in sequence, and the rotating camera module 114, the first fixed module 115, and the second fixed module 116 can be supported by different auxiliary brackets 113.
  • the electronic device provided in the second embodiment has roughly the same structure as the electronic device provided in the first embodiment. Please refer to FIG. 32.
  • FIG. 32 is a partial structural diagram of the electronic device provided in the second embodiment of this application. The difference is that the flexible heat-conducting member 117 and auxiliary bracket 113 form a heat conduction channel.
  • the recessed portion 191 extends from the area corresponding to the first receiving portion 1131 to the corresponding area at the end of the first receiving portion 1133 away from the first receiving portion 1131, and the second receiving portion 1135 is far away
  • One end of the first receiving portion 1131 corresponds to the area.
  • the concave portion 191 is aligned with the first accommodating portion 1131, the first accommodating portion 1133, and the second accommodating portion 1135.
  • the length of the concave portion 191 is approximately the same as that of the first accommodating portion 1131 and the first accommodating portion 1135.
  • the lengths of the part 1133 and the second receiving part 1135 are equal to each other.
  • the partition 1130 includes a first installation section 1136 and a second installation section 1137.
  • first installation section 1136 is fixedly connected to the main body 1121 and extends toward the main bracket 19, and the second installation section 1137 is bent and extends from the end of the first installation section 1136 away from the main body 1121 toward the first receiving portion 1131.
  • the second installation section 1137 is fixedly connected with the main body 1121.
  • the first receiving portion 1131 is surrounded by the main body 1121 and the first installation section 1136.
  • the first receiving portion 1133 and the second receiving portion 1135 are both surrounded by the main body 1121, the first installation section 1136 and the second installation section 1137. become.
  • the bottom of the first fixed module 115 is fixedly connected to the second installation section 1137 of the first accommodating portion 1133, and the bottom of the second fixed module 116 is fixedly connected to the second installation section 1137 of the second accommodating portion 1135.
  • the first end of the flexible heat-conducting member 117 is fixedly connected with the second installation section 1137 of the first receiving portion 1133, and the second end of the flexible heat-conducting member 117 and the second installation section 1137 of the second receiving portion 1135 face the main support One side of 19 is fixedly connected.
  • the side of the flexible heat-conducting member 117 facing away from the main support 19 passes through a reinforcing plate (not shown) that is coated with glue and rotates the camera module 114, the second installation section 1137 of the first receiving portion 1133, and The second installation section 1137 of the second receiving portion 1135 is fixedly connected, and the flexible heat-conducting member 117 is not in contact with the main bracket 19. Since the recessed portion 191 is a through hole, the heat dissipation space of the rotating camera module 114 is effectively increased.
  • the flexible heat-conducting element 117 is fixedly connected to the receiving bottom wall 1137 of the second receiving portion 1135 facing the side of the main support 19, the flexible heat-conducting element 117 and the auxiliary support 113 form a heat conduction channel.
  • the recessed portion 191 is a through hole, it is convenient to flexibly install the flexible heat conducting member 117.
  • the electronic device provided by the third embodiment has roughly the same structure as the electronic device provided by the first embodiment. Please refer to FIG. 33.
  • FIG. 33 is a partial structural diagram of the electronic device provided by the third embodiment of this application. The difference is that the flexible heat-conducting member 117.
  • the auxiliary bracket 113 and the main bracket 19 form a heat conduction channel.
  • the main bracket 19 omits the recessed portion, the bottom of the first fixing module 115 and the bottom of the second fixing module 116 are in contact with the main bracket 19, and the first and second ends of the flexible heat-conducting member 117 are in contact with each other.
  • the auxiliary bracket 113 is connected and partially connected with the main bracket 19, that is, the flexible heat-conducting member 117 conducts heat generated by the image sensor (not shown) of the rotating camera module 114 to the auxiliary bracket 113 and the main bracket 19.
  • the auxiliary bracket 113 includes a main body 1236, a first partition member 1237, and a second partition member 1238.
  • the first partition member 1237 and the second partition member 1238 are fixed to the side of the main body 1236 facing the main bracket 19 so as to divide the receiving space of the auxiliary bracket 113.
  • a first receiving portion 1131, a first receiving portion 1133, and a second receiving portion 1135 are formed.
  • the first partition 1237 is located between the first accommodating portion 1131 and the first accommodating portion 1133
  • the second partition 1238 is located between the first accommodating portion 1131 and the second accommodating portion 1135.
  • Both the first partition 1237 and the second partition 1238 include a first installation section 1239 and a second installation section 1240.
  • the first installation section 1239 is fixedly connected to the main body 1236, and the second installation section 1240 is formed by bending an end of the first installation section 1239 away from the main body 1236.
  • the second installation section 1240 of the first partition 1237 faces the first installation section 1236.
  • One side of the fixing module 115 is projected and bent, and the second installation section 1240 of the second partition 1238 is projected and bent toward the side of the second fixing module 116. In this way, the first receiving portion 1131 is enlarged. Space.
  • the first end of the flexible heat-conducting member 117 is fixedly connected with the second installation section 1240 of the first partition member 1237 toward the inner wall of the first receiving portion 1131 and is connected to the main bracket 19, and the second end of the flexible heat-conducting member 117 is connected to the second
  • the second installation section 1240 of the partition 1237 is fixedly connected to the inner wall of the first receiving portion 1131 and connected to the main bracket 19 so that the flexible heat conducting member 117 is received in the first receiving portion 1131. Since the flexible heat-conducting member 117 is housed in the first accommodating portion 1131, it can not only conduct the heat of the rotating camera module 114 to the auxiliary bracket 113, but also reduce interference with other components of the electronic device 10, which is convenient for other components. The layout of the components.
  • first fixing module 115 may not be fixedly connected to the auxiliary bracket 113 but supported by the main bracket 19
  • second fixing module 116 may not be fixedly connected to the auxiliary bracket 113 but supported by the main bracket 19.
  • FIG. 34 is a partial structural diagram of the electronic device provided by the fourth embodiment of this application.
  • the bracket 113 forms a heat conduction channel.
  • the difference is that the main bracket 19 has a concave portion 191, and the concave portion 191 is a through hole.
  • the first fixing module 115 is fixedly connected to the auxiliary bracket 113, and the first fixing module 115 is opposite to the main bracket 19
  • the second fixed module 116 is fixedly connected to the auxiliary bracket 113, and the second fixed module 116 is suspended relative to the main bracket 19. Since the recessed portion 191 is a through hole, the heat dissipation space of the first fixing module 115 and the second fixing module 116 is increased, and it is convenient to rotate the flexible heat conducting member 117 at the bottom of the camera module 114.
  • the electronic device provided in the fifth embodiment has roughly the same structure as the electronic device provided in the first embodiment. Please refer to FIG. 35.
  • FIG. 35 is a partial structural diagram of the electronic device provided in the fifth embodiment of this application. The difference is that the electronic device also Including a shielding cover 319, the camera assembly 31 also includes a connector 320 and a flexible circuit board 321. The shielding cover 319 and the connector 320 are arranged on the main circuit board 318 toward the main support 311 side. The connector 320 is located between the shield cover 319 and the auxiliary bracket 313. The shielding cover 319 is used for electromagnetic shielding.
  • the flexible thermal conductive member 317 is attached to the flexible circuit board 321.
  • the first end of the flexible heat-conducting element 317 extends from the flexible circuit board 321 and is fixed to the reinforcing plate (not shown) at the bottom of the rotating camera module 314, and the second end of the flexible heat-conducting element 317 and the shielding cover 319 are away from the main circuit board One side of 318 is fixedly connected.
  • the connector 320 is a board-to-board connector (BTB for short). It can be understood that the connector 320 is not limited to be a board-to-board connector, and it may also be other structures that can realize the fixing of the flexible circuit board 321 to the main circuit board 318 to realize signal transmission.
  • the first end of the flexible circuit board 321 is electrically connected to the driving circuit board (not shown) of the rotating camera module 314, and the second end of the flexible circuit board 321 is fixedly connected to the side of the connector 320 away from the main circuit board 318 to achieve
  • the rotating camera module 314 is electrically connected to the main circuit board 318.
  • the one-sided adhesive end of the flexible heat-conducting member 317 is attached to the bottom of the reinforcing plate, and the first end of the flexible heat-conducting member 317 is overlapped with the shielding cover 319.
  • the image sensor of the camera module 314 is rotated.
  • the heat of the heat is conducted to the flexible circuit board 321 and the shielding cover 319 through the flexible heat conducting member 317, that is, the flexible heat conducting member 317, the flexible circuit board 321 and the shielding cover 319 form a heat conduction channel.
  • FIG. 36 is a partial structural diagram of the electronic device provided by the sixth embodiment of this application. The difference is that the shield 319 The and connector 320 is arranged on the side of the main circuit board 318 away from the main support 311, and the shielding cover 319 is located between the connector 320 and the auxiliary support 313. There is a gap 301 between the auxiliary bracket 313 and the main circuit board 318.
  • the first end of the flexible circuit board 321 is fixed to the rotating camera module 314, the flexible heat-conducting member 317 is attached to the side of the flexible circuit board 321 away from the rotating camera module 314, and the first end of the flexible circuit board 321 is located at the rotating camera module.
  • the flexible circuit board 321 and the flexible heat-conducting member 317 pass through the gap 301, and the second end of the flexible circuit board 321 protrudes from the flexible heat-conducting member 317 and is electrically connected to the connector 320.
  • the second end of the flexible heat-conducting member 317 is fixedly connected to the shielding cover 319.
  • the flexible circuit board 321 is double-sided adhesive, the first end of the flexible circuit board 321 is attached to the bottom of the reinforcing plate, the second end of the flexible circuit board 321 is attached to the connector 320, the shielding cover 319 and The flexible circuit board 321 between the reinforcing plates can be partially glued; at this time, the heat generated by the image sensor of the rotating camera module 314 is conducted to the flexible heat-conducting member 317 and the shielding cover 319 through the flexible circuit board 321, that is, the flexible circuit board 321 , The flexible heat conducting member 317 and the shielding cover 319 form a heat conducting channel.
  • the electronic device provided in the seventh embodiment has roughly the same structure as the electronic device provided in the fifth embodiment. Please refer to FIG. 37.
  • FIG. 37 is a partial structural diagram of the electronic device provided in the seventh embodiment of this application. The difference is that the shielding cover 319
  • the connectors 320 are respectively disposed on both sides of the main circuit board 318, wherein the shielding cover 319 is located on the side of the main circuit board 318 facing the main support 311, and the connector 320 is facing the side of the main circuit board 318 away from the main support 311.
  • the flexible heat conducting member 317 is partially attached to the flexible circuit board 321. One end of the flexible circuit board 321 is fixed between the bottom of the rotating camera module 314 and the flexible heat-conducting member 317.
  • the end of the flexible circuit board 321 away from the rotating camera module 314 is separated from the flexible heat-conducting member 317 and passes through the gap 301.
  • the flexible circuit One end of the board 321 away from the rotating camera module 314 is fixedly connected to the connector 320.
  • the first end of the flexible heat-conducting element 317 is fixedly connected to the side of the flexible circuit board 321 facing away from the rotating camera module 314.
  • the flexible heat-conducting element 317 extends from the bottom area of the rotating camera module 314 toward the direction of the shielding cover 319.
  • the flexible heat-conducting element 317 The second end of the shielding cover 319 is fixedly connected to the side of the shielding cover 319 away from the main circuit board 318.
  • the single-sided adhesive of the flexible heat-conducting element 317 one end is attached to the side of the flexible circuit board 321 away from the rotating camera module 314, and one end is attached to the shielding cover 319, the flexible heat-conducting part between the reinforcing plate and the shielding cover 319 317 can be partially glued, and part of the heat generated by the image sensor of the rotating camera module 314 is conducted to the flexible circuit board 321 and the shielding cover 319 through the flexible heat-conducting member 317, which is formed by the flexible heat-conducting member 317, the flexible circuit board 321 and the shielding cover 319 Heat conduction channel.
  • FIG. 38 is a partial structural diagram of the electronic device provided by the eighth embodiment of this application.
  • the difference is that the main bracket The concave portion 4111 of the 411 is a through hole, the flexible heat-conducting member 417 penetrates the concave portion 4111, the first end of the flexible heat-conducting member 417 is fixedly connected to the side of the main support 411 away from the auxiliary support 413, and the first end of the flexible heat-conducting member 417 The two ends are fixedly connected to the side of the main bracket 411 away from the auxiliary bracket 413, that is, the heat generated by the image sensor of the rotating camera module 414 is transferred to the main bracket 411 through the flexible heat-conducting member 417.
  • the single-sided adhesive of the flexible heat-conducting member 417 is attached to the bottom of the reinforcing plate of the rotating camera module 414 at the first end of the flexible heat-conducting member 417, and the main bracket 411 is attached to the other end.
  • FIG. 39 is a partial structural diagram of the electronic device provided by the ninth embodiment of this application.
  • the difference is that the flexible heat conduction
  • the member 417 is also connected to the bottom of the first fixed module 415, and the flexible heat-conducting member 417 is also connected to the bottom of the second fixed module 416, so that the heat generated by the image sensor of the rotating camera module 414 is conducted to the bottom through the flexible heat-conductive member 417
  • the flexible heat-conducting element 417 is glued on one side.
  • the flexible heat-conducting element 417 is partially attached to the bottom of the reinforcing plate of the rotating camera module 414.
  • the flexible heat-conducting element 417 extends in the opposite direction and is attached to the bottom of the first fixed module 415 and the second fixed mold.
  • FIG. 40 is a partial schematic diagram of the electronic device provided by the tenth embodiment of this application. The difference is that the camera assembly The first fixing module and the second fixing module are omitted. There is a gap 401 between the auxiliary bracket 413 and the main circuit board 418.
  • the electronic device also includes a connector 420 and a flexible circuit board 421. The connector 420 is fixed to the main circuit board 418 The side away from the main bracket 411. The flexible heat-conducting element 417 is attached to the flexible circuit board 421.
  • the first end of the flexible heat-conducting element 417 extends from the flexible circuit board 421 and is attached to the side of the main support 411 away from the rotating camera module 414.
  • the flexible heat-conducting element 417 is penetrated In the recessed portion 4111 and the gap 401, the flexible heat-conducting element 417 is partially fixedly connected to the bottom of the camera module 414, and the second end of the flexible heat-conducting element 417 extends to the connector 420.
  • the first end of the flexible circuit board 421 is fixed and electrically connected to the bottom of the rotating camera module 414, the flexible circuit board 421 and the flexible heat-conducting member 417 pass through the gap 401, and the second end of the flexible circuit board 421 is fixed to the connector 420 And electrical connection.
  • the flexible heat conducting member 417 forms a heat conducting channel with the main support 411 and the flexible circuit board 421.
  • the heat generated by the image sensor of the rotating camera module 414 is partly transferred to the flexible circuit board 421 through the flexible heat-conducting member 417, and partly transferred to the main support 411.
  • the second end of the flexible heat conducting member 417 extends to the connector 420 and the connector 420 in a fixed connection, and the second end of the flexible circuit board 421 and the connector 420 can realize signal transmission.
  • FIG. 41 is a schematic diagram of part of the structure of the electronic device provided by the eleventh embodiment of this application. The difference lies in:
  • the camera component 51 omits the first fixed module and the second fixed module.
  • the camera component 51 also includes a semiconductor cooler (Thermoelectric Cooler, TEC for short) 519.
  • the semiconductor cooler 519 is fixed to the rotating camera module 514 and the flexible heat conduction Between the components 517, the cold surface of the semiconductor refrigerator 519 is disposed adjacent to the rotating camera module 514, and the hot surface of the semiconductor refrigerator 519 is disposed adjacent to the flexible heat conducting member 517.
  • the heat generated by the rotating camera module 514 is absorbed by the cold surface of the semiconductor refrigerator 519, and is conducted to the flexible heat-conducting member 517 through the hot surface of the semiconductor refrigerator 519, thereby improving the heat dissipation efficiency of the camera assembly 51.
  • the semiconductor refrigerator 519 is in communication connection with the processor (not shown) of the electronic device.
  • Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of it absorbs heat and the other end releases heat.
  • the heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials for TEC.
  • the bismuth telluride components are electrically connected in series and generate heat in parallel.
  • TEC includes some P-type and N-type pairs (groups), which are connected together by electrodes and sandwiched between two ceramic electrodes; when a current flows through the TEC, the heat generated by the current will be transferred from one side of the TEC to On the other side, a "hot” side and a “cold” side are generated on the TEC, which is the heating and cooling principle of the TEC.
  • the flexible heat-conducting member is fixed to one end of the camera function group, and the flexible heat-conducting member is also used to connect with the non-rotating camera module component, so that when one end of the camera function group is suspended due to rotation, the The heat generated by the camera function group is transferred to the non-rotating camera module component.
  • the non-rotating camera module components are components other than the rotating camera module, such as auxiliary brackets, main brackets, shielding covers, rear shells, and other components.
  • the connection can be bonding, contact, etc., and the flexible heat-conducting member can transfer the heat generated by the rotating camera module to the non-rotating camera module component.

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Abstract

本申请提供一种摄像组件及电子设备。摄像组件包括辅支架、转动摄像模组及柔性导热件，转动摄像模组包括转动支架及设于所述转动支架上的摄像功能组，所述转动支架与所述辅支架转动连接，所述柔性导热件与所述摄像功能组的一端固定连接，所述柔性导热件还用于与非转动摄像模组部件连接，以将所述摄像功能组产生的热量转移至所述非转动摄像模组部件。通过柔性导热件对转动摄像模组产生的热量进行跨区域转移，有利于降低转动摄像模组周遭温度，从而提高转动摄像模组的摄像质量和延长转动摄像模组的拍摄时间。

Description

摄像组件及电子设备
本申请要求在2020年01月22日提交中国国家知识产权局、申请号为202010075892.7、发明名称为“摄像组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及摄像技术领域，特别涉及一种摄像组件及电子设备。
背景技术
现今，摄像性能是消费者选用消费性电子设备的重要的指标之一。一种电子设备配备有可转动的摄像模组以具备大角度防抖功能。然而，摄像模组在转动时，摄像模组的底部一端会悬空，造成底部被空气包裹，使得摄像模组散热受阻。摄像模组内元件(如图像传感器或镜头)温度过高时，电子设备的拍照性能会受到显著影响，例如，对焦速度、图像清晰度、图像噪声等。
发明内容
本申请所要解决的技术问题在于提供一种能够提高散热性能的摄像组件及电子设备。
为了实现上述目的，本申请实施方式采用如下技术方案：
本申请第一方面，提供一种摄像组件，包括辅支架、转动摄像模组及柔性导热件，所述转动摄像模组设于所述辅支架上，所述转动摄像模组包括转动支架及设于所述转动支架上的摄像功能组，所述转动支架与所述辅支架转动连接，所述柔性导热件与所述摄像功能组的一端固定连接，所述柔性导热件还用于与非转动摄像模组部件连接，以将所述摄像功能组产生的热量转移至所述非转动摄像模组部件。
本申请的第一方面中，所谓非转动摄像模组部件为除转动摄像模组之外的部件，例如，辅支架、电子设备的主电路板、电子设备的主支架等等，柔性导热件与摄像功能组固定连接，柔性导热件还用于与非转动摄像模组部件连接，以将所述转动摄像模组产生的热量传导至非转动摄像模组部件，即将所述转动摄像模组产生的热量从所述转动摄像模组所在区域传递至其他区域，实现跨区域热转移，有利于降低转动摄像模组的周遭温度，从而提高了转动摄像模组摄取图像的质量和延长转动摄像模组的拍摄时间。由于柔性导热件的可挠性，亦不会对摄像功能组相对辅支架转动时造成干扰。
根据第一方面，在第一方面的第一种可能的实现方式中，所述摄像功能组包括镜头模组、驱动部件、驱动电路板、补强板及图像传感器，所述镜头模组设于所述转动支架上，所述驱动部件用于驱动所述转动支架相对所述辅支架转动，所述驱动电路板固定于所述镜头模组的一端，所述图像传感器设于所述驱动电路板朝向所述镜头模组的一侧，所述补强板设于所述驱动电路板背离所述镜头模组一侧，所述柔性导热件与所述补强板固定连接。所述补强板能够有效加强驱动电路板的强度。所述驱动电路板、所述补强板、所述柔性导热件及与所述柔性导热件连接的非转动摄像模组部件构成导热通道，从而将所述图像传感 器生成的热量转移至非转动摄像模组部件上，有效降低图像传感器的温度及镜头模组的温度，从而提高转动摄像模组的拍照性能及拍照效率。
根据第一方面或第一方面的第一种可能的实现方式，在第一方面的第二种可能的实现方式中，所述辅支架包括本体及凸设于所述本体一侧的分隔件，所述本体形成收容空间，所述分隔件将所述收容空间分隔成第一收容部及第二收容部，所述转动摄像模组收容于所述第一收容部内，所述摄像组件还包括固定收容于所述第二收容部的固定模组，所述固定模组为固定摄像模组或辅助摄像模组。转动摄像模组收容于通过分隔件分隔成的第一收容部，能够有效隔绝其他模组产生的热量对转动摄像模组的影响。另外，固定模组与转动摄像模组相互配合，能够有效提高摄像组件的摄像质量。
根据第一方面或第一方面的第一至第二种可能的实现方式，在第一方面的第三种可能的实现方式中，所述柔性导热件部分延伸至所述固定模组并与所述固定模组相贴合，实现将转动摄像模组的热量转移至固定模组，有效降低转动摄像模组的温度。
根据第一方面或第一方面的第一至第三种可能的实现方式，在第一方面的第四种可能的实现方式中，所述柔性导热件部分朝向所述分隔件延伸并与所述分隔件相贴合，使得转动摄像模组产生的热量从转动摄像模组所在区域转移至所述辅支架，即柔性导热件与辅支架形成导热通道，提高了转动摄像模组的散热效率。
根据第一方面或第一方面的第一至第四种可能的实现方式，在第一方面的第五种可能的实现方式中，所述分隔件包括第一装设段及第二装设段，所述第一装设段的一端与所述本体固定连接，所述第二装设段由所述第一装设段的另一端弯折延伸形成并与所述本体固定连接，所述第一收容部由所述本体及所述第一装设段围成，所述第二收容部由所述本体、所述第一装设段及所述第二装设段共同围成，所述柔性导热件与所述第二装设段相贴合，有利于增加分隔件与柔性导热件的接触面积，从而提高柔性导热件的导热效率。
根据第一方面或第一方面的第一至第五种可能的实现方式，在第一方面的第六种可能的实现方式中，所述摄像组件还包括连接器及柔性电路板，所述柔性导热件贴附于所述柔性电路板，所述柔性电路板的一端与所述转动摄像模组电性连接，所述柔性电路板远离所述转动摄像模组的一端与所述连接器固定并电性连接，所述连接器用于与电子设备的电路板固定并电性连接。柔性导热件将所述转动摄像模组的热量部分传导至柔性电路板，提高摄像组件对转动摄像模组的跨区域转移热量的效率。
根据第一方面或第一方面的第一至第六种可能的实现方式，在第一方面的第七种可能的实现方式中，所述柔性导热件部分从所述柔性电路板露出，用于与设于所述电子设备的主电路板的屏蔽罩固定连接，即柔性导热件、屏蔽罩亦形成一导热通路，进一步提高摄像组件对转动摄像模组的跨区域转移热量的效率。
根据第一方面或第一方面的第一至第七种可能的实现方式，在第一方面的第八种可能的实现方式中，所述柔性导热件包括连接设置的连接区域及悬空区域，所述连接区域与所述摄像功能组连接，所述柔性导热件位于所述悬空区域部分为弯折结构，能够有效降低转动摄像模组转动过程中，因柔性导热件拉伸/收缩引起的微动阻力，避免转动摄像模组因阻力过大而导致的卡死、噪音等；此外，该等形状还能够有效减少因悬空区域的柔性导热件的拉伸/收缩引起柔性导热件的破裂、分层、脱胶等可靠性问题和传热性能衰减问题。
可以理解，所述悬空区域的形状为Z形、锯齿形、弧形、方波形、脉冲形中的至少一种，
根据第一方面或第一方面的第一至第八种可能的实现方式，在第一方面的第九种可能的实现方式中，于所述悬空区域上的所述柔性导热件设有应力槽，用于缓冲所述柔性导热件因所述摄像功能组转动拉扯而产生的应力，能够有效降低转动摄像模组扭动时在柔性导热件内产生的剪切力，避免局部撕裂、脱胶导致传热性能下降，还能削弱柔性导热件对转动摄像模组的反力矩，降低转动摄像模组的卡死、噪音、功耗增加等风险。
根据第一方面或第一方面的第一至第九种可能的实现方式，在第一方面的第十种可能的实现方式中，所述摄像组件还包括固定于所述摄像功能组与所述柔性导热件之间的半导体致冷器，所述半导体致冷器的冷面朝向所述摄像功能组设置，所述半导体致冷器的热面朝向所述柔性导热件设置，进一步提高转动摄像模组的散热效率。
根据第一方面或第一方面的第一至第十种可能的实现方式，在第一方面的第十一种可能的实现方式中，所述摄像功能组与所述柔性导热件连接一端相对所述辅支架转动时悬空，如此，所述摄像功能组与所述柔性导热件连接一端容易被空气包裹。然而，由于柔性导热件连接于摄像功能组与非转动摄像模组部件之间，柔性导热件能够快速将摄像功能模组产生的热量转移至非转动摄像模组部件，有效降低了摄像功能组与所述柔性导热件连接一端因相对所述辅支架转动而悬空时的周遭温度，从而提高摄像组件的拍照性能。
本申请第二方面，本申请还提供一种电子设备，包括如上所述的摄像组件、主支架及主电路板，所述主电路板固定于所述主支架上，所述辅支架固定于所述主支架并露出所述主电路板背离所述主支架一侧，所述转动摄像模组与所述主电路板电连接。
本申请的第二方面中，通过柔性导热件对转动摄像模组的产生的热量进行跨区域转移，有利于降低转动摄像模组周遭温度，从而提高转动摄像模组的摄像质量及缩短转动摄像模组的响应时间。
根据第二方面，在第二方面的第一种可能的实现方式中，所述柔性导热件部分朝向所述主支架延伸并与所述主支架相贴合，即所述柔性导热件与所述主支架形成导热通道，柔性导热件将热量从所述转动摄像模组转移至主支架，有利于提高摄像组件的散热效率。
根据第二方面或第二方面的第一种可能的实现方式，在第二方面的第二种可能的实现方式中，所述主支架朝向所述辅支架一侧设有凹设部，所述凹设部对准所述转动摄像模组设置，所述凹设部用于方便所述柔性导热件的设置并能够有效增大转动摄像模组的散热空间，从而提高所述摄像组件的散热效率。
根据第二方面或第二方面的第一至第二种可能的实现方式，在第二方面的第三种可能的实现方式中，所述柔性导热件部分穿设于所述凹设部，并与所述主支架背离所述辅支架的一侧固定连接，有效增长所述柔性导热件与所述主支架形成导热通道，从而提高对所述转动摄像模组区域的散热效果。
根据第二方面或第二方面的第一至第三种可能的实现方式，在第二方面的第四种可能的实现方式中，所述凹设部为通孔，所述柔性导热件穿设于所述凹设部，并与所述主支架背离所述辅支架的一侧固定连接。
根据第二方面或第二方面的第一至第四种可能的实现方式，在第二方面的第五种可能 的实现方式中，所述摄像组件还包括连接器及柔性电路板，所述连接器设于所述主电路板上，所述柔性电路板的一端与所述转动摄像模组电性连接，所述柔性导热件至少部分贴附于所述柔性电路板背离所述转动摄像模组的一侧，所述柔性电路板远离所述转动摄像模组的一端与所述连接器固定并电性连接。
根据第二方面或第二方面的第一至第五种可能的实现方式，在第二方面的第六种可能的实现方式中，所述主电路板还包括屏蔽罩，所述屏蔽罩间隔所述连接器设于所述主电路板上，所述柔性导热件与所述屏蔽罩固定连接，所述屏蔽罩用于电磁屏蔽。所述柔性导热件与所述屏蔽罩固定连接，从而将所述转动摄像模组的热量传导至屏蔽罩，增大所述转动摄像模组的散热面，并提高了摄像组件散热的灵活性。
根据第二方面或第二方面的第一至第六种可能的实现方式，在第二方面的第七种可能的实现方式中，所述主电路板与所述辅支架之间具间隙，所述屏蔽罩与所述连接器均设于所述主电路板背离所述主支架的一侧，所述柔性导热件与所述柔性电路板均穿设于所述间隙，所述屏蔽罩位于所述辅支架与所述连接器之间，所述柔性导热件与所述柔性电路板均穿设于所述间隙，所述柔性电路板远离所述转动摄像模组的一端从所述柔性导热件伸出与所述连接器固定连接。柔性导热件将热量传导至电路板背离所述主支架的一侧，有效增加所述转动摄像模组的导热通道。
根据第二方面或第二方面的第一至第七种可能的实现方式，在第二方面的第八种可能的实现方式中，所述主电路板与所述辅支架之间具间隙，所述连接器设于所述主电路板背离所述主支架的一侧，所述屏蔽罩设于所述主电路板朝向所述主支架的一侧，所述柔性电路板远离所述转动摄像模组的一端与所述柔性导热件分离并穿设于所述间隙，连接器与屏蔽罩分开设于电路板的两侧。柔性电路板将热量传导至电路板背离所述主支架的一侧，柔性导热件将热量传导至电路板朝向所述主支架的一侧有效增长所述转动摄像模组的导热通道。
根据第二方面或第二方面的第一至第八种可能的实现方式，在第二方面的第九种可能的实现方式中，所述连接器设于所述主电路板背离所述主支架的一侧，所述主电路板与所述辅支架之间具间隙，所述主支架设有贯通所述主支架的凹设部，所述转动摄像模组对应所述凹设部设置，所述柔性导热件的第一端通过所述凹设部与所述主支架背离所述辅支架的一侧固定连接，所述柔性电路板与所述柔性导热件穿设于所述间隙，所述柔性导热件的第二端与所述连接器固定连接，所述主支架、所述柔性导热件、所述柔性电路板共同形成导热通道，进一步提高所述转动摄像模组区域的散热效率。
根据第二方面或第二方面的第一至第九种可能的实现方式，在第二方面的第十种可能的实现方式中，所述柔性导热件从所述转动摄像模组的底部延伸至所述固定模组与所述主支架之间，所述柔性导热件与所述固定模组与所述主支架均连接触，使得转动摄像模组产生的热量从转动摄像模组所在区域转移至所述固定模组与所述主支架，增大了转动摄像模组的散热通道。
本申请的这些方面或其他方面在以下的描述中会更加简明易懂。
附图说明
图1为本申请第一实施方式提供的电子设备的结构框图；
图2为图1所示的电子设备的一应用场景示意图；
图3为本申请第一实施方式提供的电子设备的部分结构的示意图；
图4为摄像组件的一排布示意图；
图5为摄像组件的另一排布示意图；
图6为摄像组件的又一排布示意图；
图7为摄像组件的再一排布示意图；
图8为本申请第一实施方式提供的转动摄像模组的俯视图；
图9为本申请第一实施方式提供的转动摄像模组的剖视图；
图10为部分柔性导热件的立体示意图；
图11为悬空区域的柔性导热件呈Z字形的示意图；
图12为悬空区域的柔性导热件呈锯齿形的示意图；
图13为悬空区域的柔性导热件呈弧形的示意图；
图14为悬空区域的柔性导热件呈方波形的示意图；
图15为悬空区域的柔性导热件呈脉冲形的示意图；
图16为柔性导热件于悬空区域的近固定端设有弧形第一应力槽的示意图；
图17为柔性导热件于悬空区域的近固定端与近热源端均设有弧形第一应力槽的示意图；
图18为柔性导热件于悬空区域的近固定端设有双弧形结构的第一应力槽的示意图；
图19为柔性导热件于悬空区域设有第二应力槽的示意图；
图20为摄像组件具转动摄像模组及三个固定模组的一排布示意图；
图21为摄像组件具转动摄像模组及三个固定模组的另一排布示意图；
图22为柔性导热件呈L形的示意图；
图23为柔性导热件呈口字形的示意图；
图24为柔性导热件呈条形的示意图；
图25为摄像组件具转动摄像模组及一个固定模组的一排布示意图；
图26为摄像组件具转动摄像模组及一个固定模组的另一排布示意图；
图27为摄像组件具一个转动摄像模组的一排布示意图；
图28为摄像组件具一个转动摄像模组的另一排布示意图；
图29为摄像组件具一个转动摄像模组的又一排布示意图；
图30为摄像组件具转动摄像模组及一个固定模组的排布示意图；
图31为摄像组件具转动摄像模组及两个固定模组的排布示意图；
图32为本申请第二实施方式提供的电子设备的部分结构示意图；
图33为本申请第三实施方式提供的电子设备的部分结构示意图；
图34为本申请第四实施方式提供的电子设备的部分结构示意图；
图35为本申请第五实施方式提供的电子设备的部分结构示意图；
图36为本申请第六实施方式提供的电子设备的部分结构示意图；
图37为本申请第七实施方式提供的电子设备的部分结构示意图；
图38为本申请第八实施方式提供的电子设备的部分结构示意图；
图39为本申请第九实施方式提供的电子设备的部分结构示意图；
图40为本申请第十实施方式提供的电子设备的部分结构示意图；
图41为本申请第十一实施方式提供的电子设备的部分结构示意图。
具体实施方式
第一实施方式
请参阅图1，图1为本申请第一实施方式提供的电子设备的结构框图。电子设备10包括摄像组件11、处理器13、通信总线14、至少一个通信接口15以及存储器16。处理器13与摄像组件11、所述至少一个通信接口15、存储器16通过通信总线14通信连接。电子设备10为配备有摄像组件11的电子设备，诸如智能手机、智能手表、平板电脑、个人数字助理(personal digital assistant，PDA)、笔记本电脑、无人机、监控设备等等。
处理器13可以是中央处理单元(Central Processing Unit，CPU)，还可以是其他通用处理器、数字信号处理器(Digital Signal Processor，DSP)、专用集成电路(Application Specific Integrated Circuit，ASIC)、现场可编程门阵列(Field-Programmable Gate Array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件等。通用处理器可以是微处理器或者该处理器也可以是任何常规的处理器等，处理器13是电子设备10的控制中心，利用各种接口和线路连接整个电子设备10的各个部分。通信总线14可包括一通路，在上述组件之间传送信息。
通信接口15，为使用任何收发器一类的装置，用于与其他设备或通信网络通信，如以太网，无线接入网(radio access network，RAN)，无线局域网(wireless local area networks，WLAN)等。
存储器16可用于存储计算机程序和/或模块，处理器13通过运行或执行存储在存储器16内的计算机程序和/或模块，以及调用存储在存储器16内的数据，实现电子设备10的各种功能。存储器16可主要包括程序存储区和数据存储区，其中，程序存储区可存储操作系统、多个功能所需的应用程序(比如声音播放功能、图像播放功能等)等；数据存储区可存储根据终端10的使用所创建的数据(比如音频数据、电话本等)等。此外，存储器16可以包括高速随机存取存储器，还可以包括非易失性存储器，例如硬盘、内存、插接式硬盘，智能存储卡(Smart Media Card,SMC)，安全数字(Secure Digital,SD)卡，闪存卡(Flash Card)、多个磁盘存储器件、闪存器件、或其他易失性固态存储器件。存储器16可以是独立存在，通过通信总线14与处理器13相连接。存储器16也可以和处理器13集成在一起。
在具体实现中，作为一种实施例，电子设备10可以包括多个处理器13，例如图1中的CPU0和CPU1。这些处理器13中的每一个可以是一个单核(single-CPU)处理器，也可以是一个多核(multi-CPU)处理器。这里的处理器可以指一个或多个设备、电路、和/或用于处理数据(例如计算机程序指令)的处理核。
本实施方式中，电子设备10还包括与处理器13电性连接的扬声器17及显示屏18。显示屏18为触控显示屏。电子设备10设有显示屏18的一面为正面，电子设备10背离显 示屏18的一面为背面。可以理解的是，所述图1仅是电子设备10的示例，并不构成对电子设备10的限定，电子设备10可以包括比图1所示更多或更少的部件，或者组合某些部件，或者不同的部件，例如电子设备10还可以包括输入输出设备、网络接入设备等，在此不作限定。
请参阅图2所示，图2为图1所示的电子设备的一应用场景示意图。在一种应用场景中，电子设备10为智能手机之类的消费性电子设备。本实施方式中，摄像组件11为后置摄像组件，用于拍摄电子设备10背面朝向的景物。当处理器13检测到对应摄像应用的虚拟按键101的触发事件时，控制启动摄像组件11并相应进入拍摄界面以方便用户摄取图像。图2所示的电子设备10的应用场景仅是示例性地，本申请对此并不作限定。
请参阅图3所示，图3为本申请第一实施方式提供的电子设备的部分结构示意图。电子设备10还包括主支架19及主电路板20。主电路板20固定于主支架19上。处理器13可设置于主电路板20或其他结构上，在此不作限定。主电路板20上设有通孔21，摄像组件11穿设于通孔21并露出主电路板20背离主支架19一侧。
摄像组件11包括辅支架113、转动摄像模组114、第一固定模组115、第二固定模组116及柔性导热件117。转动摄像模组114、第一固定模组115、第二固定模组116均与处理器13电性连接。
辅支架113凸设于主支架19，用于支撑转动摄像模组114、第一固定模组115和第二固定模组116。辅支架113与主支架19固定连接，辅支架113形成收容转动摄像模组114、第一固定模组115和第二固定模组116的收容空间1101。
辅支架113包括本体1121及固定于本体1121上的分隔件1130。本体1121固定于主支架19上并穿设于通孔21。分隔件1130收容于收容空间1101，分隔件1130将收容空间1101分隔成第一收容部1131及第二收容部1132。本实施方式中，第二收容部1132包括第一次收容部1133及第二次收容部1135。其中，第一收容部1131位于第一次收容部1133与第二次收容部1135之间。主支架19上形成凹设部191。凹设部191对准第一收容部1131设置，转动摄像模组114收容于凹设部191内。凹设部191亦对准收容于第一收容部1131内的转动摄像模组114设置，如图3中所示，转动摄像模组114位于凹设部191的正上方。在一种可能的实现方式中，凹设部191对准转动摄像模组114设置指的是，转动摄像模组114与凹设部191均排列在一平行于主支架19与辅支架113的层叠方向的轴线上，所述层叠方向与图3中所示的第一方向Y相垂直的方向。凹设部191用于向转动摄像模组114提供较大的活动空间，防止转动摄像模组114的转动受到干扰，以及方便于转动摄像模组114朝向主支架19的一端设置柔性导热件117。
沿第一方向Y(如图3所示)上，凹设部191从第一收容部1131对应区域延伸至第一次收容部1133与第一收容部1131相邻的一端对应区域，及第二次收容部1135与第一收容部1131相邻的一端对应区域。换而言之，沿第一方向Y，凹设部191的长度，要大于第一收容部1131的长度小于辅支架113的长度，本实施方式中，主支架19为电子设备10的中框，凹设部191为设于主支架19朝向辅支架113一侧的凹槽。可以理解，主支架19还可以为主板支架等支撑结构。
转动摄像模组114收容于第一收容部1131内。转动摄像模组114与凹设部191的底 部之间具有间隙，换而言之，转动摄像模组114相对主支架19为悬空设置。
第一固定模组115固定于第一次收容部1133，第二固定模组116固定于第二次收容部1135。
柔性导热件117具有可挠性。本实施方式中，柔性导热件117的大致中部与转动摄像模组114朝向主支架19的一端固定连接，柔性导热件117的第一端连接于第一固定模组115朝向主支架19的一端与主支架19之间，以及柔性导热件117的第二端连接于第二固定模组116朝向主支架19的一端与主支架19之间，从而将转动摄像模组114产生的热量从转动摄像模组114所在区域转移至第一固定模组115与第二固定模组116所在区域，实现跨区域热转移。换而言之，柔性导热件117与转动摄像模组114的底部固定连接，柔性导热件117从转动摄像模组114的底部延伸至第一固定模组115与第二固定模组116的底部。柔性导热件117背离第一固定模组115与第二固定模组116一侧与主支架19接触，使得各摄像模组生成的热量可以通过柔性导热件117传递至主支架19上。由于柔性导热件117将热量从转动摄像模组114转移至非转动摄像模组114所在的其他区域，有利于降低转动摄像模组114的周遭温度，从而提高了转动摄像模组114的摄取图像的质量。本实施方式中，柔性导热件117为石墨片。可以理解，柔性导热件117可以是单层/多层石墨、石墨烯膜、铜箔、石墨铜箔复合材料、导热塑料、相变材料(Phase Change Material，简称PCM)、石墨与相变材料的复合材料、液态金属、热管、均热板(Vapor Chamber，简称VC)等。
转动摄像模组114、第一固定模组115、第二固定模组116均与主电路板20电性连接。本实施方式中，请参阅图4，图4为摄像组件的一排布示意图，主电路板20的宽度方向为第一方向Y，主电路板20的长度方向为第二方向X，第一方向Y与第二方向X相垂直，第一固定模组115、转动摄像模组114及第二固定模组116沿第一方向Y依次并列设置，且转动摄像模组114、第一固定模组115、第二固定模组116与主电路板20的一较窄侧边缘相邻设置。可以理解，不限定主电路板20套设于辅支架113外，例如，主电路板20可以包括两间隔设置的子电路板(图未示)，辅支架113设置于两子电路板之间，或者，辅支架113与主电路板20相邻设置等等，辅支架113固定于主支架19并露出主电路板20背离所主支架19一侧即可。
可以理解，转动摄像模组114、第一固定模组115及第二固定模组116在主电路板20上的排列布局不受本申请所示例限制，为了避让电子设备10内的其他零部件或者实现特定的摄像头组合，对摄像组件11内的第一固定模组115、转动摄像模组114及第二固定模组116的排布进行调整，例如，请参阅图5，第一固定模组115、转动摄像模组114及第二固定模组116沿第一方向Y依次并列设置，且转动摄像模组114、第一固定模组115、第二固定模组116对应主电路板20的大致中部区域设置；又如，请参阅图6，第一固定模组115、转动摄像模组114及第二固定模组116沿第二方向X并排设置，转动摄像模组114、第一固定模组115、第二固定模组116与主电路板20的一较长侧边缘相邻设置；再如，请参阅图7，第一固定模组115、转动摄像模组114及第二固定模组116沿第二方向X并排设置，转动摄像模组114、第一固定模组115、第二固定模组116对应主电路板20的中部区域设置。
更为具体的，请参阅图8，图8为本申请第一实施方式中的转动摄像模组的俯视图。转动摄像模组114包括壳体1140、转动支架1141及摄像功能组1041。壳体1140通过轴承与辅支架113连接并收容于第一收容部1131内。转动支架1141通过第一转轴1143与壳体1140的内壁转动连接，从而实现转动支架1141与辅支架113转动连接。
摄像功能组1041包括镜头模组1142及驱动部件1145。镜头模组1142收容于转动支架1141内，镜头模组1142通过第二转轴1144与转动支架1141转动连接，镜头模组1142的入光面朝向背离主支架19所在方向设置。驱动部件1145用于驱动镜头模组1142绕第一转轴1143及第二转轴1144转动，以进行大角度的光学防抖。可以理解，镜头模组1142可以不与转动支架1141转动连接，镜头模组1142固定于转动支架1141上。
本实施方式中，驱动部件1145为磁路系统，以获得较高的防抖精度。驱动部件1145包括第一磁体组1151、第一线圈组1153、第二磁体组1155及第二线圈组1157。第一磁体组1151固定于转动支架1141上，第一线圈组1153固定于壳体1140朝向转动支架1141的内壁上。第一线圈组1153套设于第一转轴1143外。第一线圈组1153通电时产生的磁场与第一磁体组1151的磁场之间的交互作用力，能够驱动转动支架1141带动镜头模组1142绕第一转轴1143转动。第二磁体组1155固定于镜头模组1142上，第二线圈组1157固定于转动支架1141背离壳体1140的一侧。第二线圈组1157套设于第二转轴1144外。第二线圈组1157通电时产生的磁场与第二磁体组1155的磁场之间的交互作用力，能够驱动镜头模组1142绕第二转轴1144转动。第一转轴1143的延伸方向不同于第二转轴1144的延伸方向。本实施方式中，第一转轴1143与第二转轴1144相互垂直。
基于法拉第电磁感应定律，通过调整第一线圈组1153与第二线圈组1157通电时的电流大小、方向，可实现镜头模组1142绕第一转轴1143与第二转轴1144多角度同步转动。
请参阅图9，图9为本申请第一实施方式提供的转动摄像模组的剖视图，摄像功能组1041还包括驱动电路板1146、补强板1147及图像传感器1148。驱动电路板1146固定于镜头模组1142朝向主支架19的一端。本实施方式中，驱动电路板1146为硬质电路板。补强板1147与驱动电路板1146背离镜头模组1142的一侧贴接于一起，补强板1147用于增强驱动电路板1146的强度。图像传感器1148固定于驱动电路板1146朝向镜头模组1142的一侧，用于接收从镜头模组1142的入光面进入的光信息并转换成图像信息。图像传感器1148与驱动电路板1146电性连接。图像传感器1148位于驱动电路板1146与镜头模组1142之间。即镜头模组1142、图像传感器1148、驱动电路板1146与补强板1147依次层叠设置。转动摄像模组114设有图像传感器1148的一端为转动摄像模组114的底部，即转动摄像模组114远离转动摄像模组114的入光面的一端为转动摄像模组114的底部。
可以理解，转动摄像模组114可以省略壳体1440而直接设置于辅支架113上，可以将第一线圈组1153固定于辅支架113的内壁上。
柔性导热件117与补强板1147背离镜头模组1142的一侧固定连接，即柔性导热件117与转动摄像模组114的底部固定连接，柔性导热件117的第一端位于第一固定模组115与主支架19之间，柔性导热件117的第二端位于第二固定模组116与主支架19之间。即使摄像功能组1041相对辅支架113转动而使摄像功能组1041朝向主支架19的一端(驱动电路板1146所在一端)悬空时，图像传感器1148产生的热量能够经驱动电路板1146、 补强板1147及柔性导热件117传递至第一固定模组115、第二固定模组116与主支架19，即驱动电路板1146、补强板1147、柔性导热件117、第一固定模组115、第二固定模组116、主支架19形成多条导热通路，实现跨区域散热。由于摄像功能组1041产生的热量能够很快经柔性导热件117传递至第一固定模组115、第二固定模组116与主支架19，有效降低了图像传感器1148、镜头模组1142的周遭温度，从而提高了转动摄像模组1041的摄取图像的质量以及延长转动摄像模组114的拍摄时间。
可以理解，柔性导热件117的第一端可以通过胶体贴附于第一固定模组115与主支架19之间，也可以直接设置于第一固定模组115与主支架19之间；柔性导热件117的第二端可以通过胶体贴附于第二固定模组116与主支架19之间，也可以直接设置于第二固定模组116与主支架19之间。可以理解，不限定驱动部件1145为磁路系统，其也可以为其他驱动结构。
可以理解，不限定柔性导热件117的延伸方向，柔性导热件117部分固定于补强板1147，柔性导热件117与补强板1147固定连接并部分朝向转动摄像模组114的外部延伸至非转动摄像模组114所在的其他区域即可。
可以理解，摄像功能组1041可以省略补强板1147，而直接将柔性导热件117与驱动电路板1146固定连接。
本实施方式中，请再次参阅图3，柔性导热件117包括连接设置的三个连接区域1171及两个悬空区域1173。其中，第一个连接区域1171位于柔性导热件117的第一端，第一个连接区域1171的柔性导热件117位于第一固定模组115与主支架19之间，并与第一固定模组115与主支架19连接触；第二个连接区域1171设于柔性导热件117的第二端，第二个连接区域1171的柔性导热件117位于第二固定模组116与主支架19之间，并与第二固定模组116与主支架19连接触；第三个连接区域1171大致位于柔性导热件117的中部区域，第三个连接区域1171的柔性导热件117与转动摄像模组114的底部固定连接。悬空区域1173的柔性导热件117为柔性导热件117未与其他结构元件接触的部分，每个悬空区域1173位于两个连接区域1171之间。
柔性导热件117位于悬空区域1173的部分为弯折结构，以减小柔性导热件117因转动摄像模组114转动拉扯所产生的应力。在一实施方式中，请参阅图10，柔性导热件117于悬空区域1173的弯折结构包括第一连接段2171、第二连接段2172、第三连接段2173及第四连接段2174，其中，第一连接段2171的一端与一用于与转动摄像模组114固定的第三个连接区域1171连接(图10所示的较左侧的连接区域1171)，第二连接段2172由第一连接段2171的另一端弯折延伸形成，第三连接段2173由第二连接段2172远离第一连接段2171的一端弯折延伸形成，第四连接段2174由第三连接段2173远离第二连接段2172的一端弯折延伸形成，第四连接段2174远离第三连接段2173的一端与一用于与主支架19固定的第一个连接区域1171连接。其中，第一连接段2171与第三连接段2173大致平行，第二连接段2172与第四连接段2174大致平行。
可以理解，不限定位于悬空区域1173的柔性导热件117的结构与形状，图11-图15所示意的结构为柔性导热件117的部分结构，悬空区域1173位于两个连接区域1171之间，一个连接区域1171用于与转动摄像模组114的底部的补强板1147连接，一个连接区域 1171用于与主支架19或其他区域连接，悬空区域1173的柔性导热件117的形状可以为Z字形(如图11所示)、锯齿形(如图12所示)、弧形(如图13所示)、方波形(如图14所示)、脉冲形(如图15所示)等等。一实施方式中，悬空区域1173的柔性导热件117的形状包括Z字形、锯齿形、弧形、方波形及脉冲形中的至少一种。由于悬空区域1173为弯折结构，能够有效降低转动摄像模组114的转动过程中，因柔性导热件117拉伸/收缩引起的微动阻力，避免转动摄像模组114因阻力过大而导致的卡死，噪音等；此外，悬空区域1173的弯折结构还能够有效减少因悬空区域1173的柔性导热件117拉伸/收缩引起柔性导热件117的破裂、分层、脱胶等可靠性问题和传热性能衰减问题。
在一实施方式中，请参阅图16，悬空区域1173包括近固定端1271及近热源端1273。相较于近固定端1271，近热源端1273为悬空区域1173与转动摄像模组114较为相邻的一端。柔性导热件117在近固定端1271的边缘设第一应力槽1177，用于缓冲柔性导热件117弯折时产生的应力。第一应力槽1177可通过对柔性导热件117进行挖空处理，横截面为弧形，第一应力槽1177横截面的弧度范围为0-360度，例如90度、180度等。第一应力槽1177的设置能够削弱应力集中，有效降低转动摄像模组114转动时在柔性导热件117内产生的剪切力，避免局部撕裂、脱胶导致传热性能下降，还能削弱柔性导热件117对转动摄像模组114的反力矩，降低转动摄像模组114的卡死、噪音、功耗增加等风险。
在一实施方式中，请参阅图17，柔性导热件117在近固定端1271与近热源端1273的边缘均设第一应力槽1177，第一应力槽1177的横截面为弧形，且第一应力槽1177的弧度大致为180度。
在一实施方式中，请参阅图18，近固定端1271的边缘设第一应力槽1177，第一应力槽1177包括连接段1178、第一弧段1179及第二弧段1180，连接段1178连接于第一弧段1178与第二弧段1179之间。即第一应力槽1177具有双弧形结构。通过对近固定端1271的边缘进行“双圆”挖空处理，提高第一应力槽1177的缓冲应力的性能。
在一实施方式中，请参阅图19，悬空区域1173的柔性导热件117沿柔性导热件117的宽度方向间隔设有多个第二应力槽1277，以缓冲柔性导热件117弯折时产生的应力，第二应力槽1277从近固定端1271朝向近热源端1273延伸。近固定端1271及/或近热源端1273亦可以设置第一应力槽。可以理解，不限定第二应力槽1277的延伸方向。
可以理解，对柔性导热件117在悬空区域1173设置的应力槽的形状及排布不作限定。
可以理解，摄像组件11可以包括两个以上的固定模组，在一实施方式中，请参阅图20，辅支架113还包括第三次收容部1136，摄像组件11还包括固定收容于第三次收容部1136内的第三固定模组121，转动摄像模组114、第一固定模组115、第二固定模组116及第三固定模组121呈阵列排布，转动摄像模组114、第一固定模组115沿第二方向X排列并位于同一行，第二固定模组116及第三固定模组121沿第二方向X排列并位于同一行，转动摄像模组114与第二固定模组116沿第一方向Y排列并位于同一列，第一固定模组115与第三固定模组121沿第一方向Y排布并位于同一列。转动摄像模组114、第一固定模组115、第二固定模组116及第三固定模组121对应主电路板20的中部区域设置。在一实施方式中，请参阅图21，转动摄像模组114、第一固定模组115、第二固定模组116及第三固定模组121与主电路板20的一较窄侧边缘相邻设置。第三固定模组121为固定 摄像模组，或者闪光灯等辅助摄像模组。
可以理解，柔性导热件117的形状可以根据转动摄像模组114与其他固定模组(例如第一固定模组115、及/或第二固定模组116、及/或第三固定模组121)的排布设置，柔性导热件117大致呈L形(如图22所示)、或口字形(如图23所示)、或条形(如图24所示)，在此不作限定。
可以理解，摄像组件11可以省略第二固定模组116，在一实施方式中，请参阅图25，转动摄像模组114与第一固定模组115沿第一方向Y方向排列设置并与主电路板20的一较窄侧边缘相邻设置；在一实施方式中，请参阅图26，第一固定模组115与转动摄像模组114沿第一方向Y方向排列并与主电路板20的一较长侧边缘相邻设置。
可以理解，摄像组件11可以省略第一固定模组115及第二固定模组116，在一实施方式中，请参阅图27，转动摄像模组114大致与主电路板20的一较窄侧边相邻设置；在一实施方式中，请参阅图28，转动摄像模组114大致对应主电路板20的中部区域设置。
可以理解，摄像组件11可以为前置摄像组件，在一实施方式中，请参阅图29，摄像组件11省略了第一固定模组115与第二固定模组116，转动摄像模组114的入光面与显示屏18的入光面朝向一致，即转动摄像模组114用于摄取电子设备10的正面朝向的物体，转动摄像模组114与电子设备100的顶边缘相邻设置以避让电子设备10的其他零部件；又例如，在一实施方式中，请参阅图30，摄像组件11省略了第二固定模组116，第一固定模组115与转动摄像模组114沿第二方向X依次排列设置并与电子设备100的顶边缘相邻设置；再例如，在一实施方式中，请参阅图31，转动摄像模组114、第一固定模组115及第二固定模组116沿第二方向X依次间隔排列设置，转动摄像模组114、第一固定模组115及第二固定模组116可以由不同的辅支架113支撑。
第二实施方式
第二实施方式提供的电子设备与第一实施方式提供的电子设备结构大致相同，请参阅图32，图32为本申请第二实施方式提供的电子设备的部分结构示意图，不同在于，柔性导热件117与辅支架113形成导热通道。
较为具体的，沿第一方向Y上，凹设部191从第一收容部1131对应区域延伸至第一次收容部1133远离第一收容部1131的一端对应区域，及第二次收容部1135远离第一收容部1131的一端对应区域。换而言之，凹设部191对准第一收容部1131、第一次收容部1133及第二次收容部1135设置，凹设部191的长度大致与第一收容部1131、第一次收容部1133及第二次收容部1135的长度和相等。分隔件1130包括第一装设段1136及第二装设段1137。第一装设段1136的一端与本体1121固定连接并朝向主支架19延伸，第二装设段1137由第一装设段1136远离本体1121的一端朝向背离第一收容部1131弯折延伸，第二装设段1137与本体1121固定连接。第一收容部1131由本体1121及第一装设段1136围成，第一次收容部1133与第二次收容部1135均由本体1121、第一装设段1136及第二装设段1137围成。
第一固定模组115的底部与第一次收容部1133的第二装设段1137固定连接，第二固定模组116的底部与第二次收容部1135的第二装设段1137固定连接。柔性导热件117的 第一端与第一次收容部1133的第二装设段1137固定连接，柔性导热件117的第二端与第二次收容部1135的第二装设段1137朝向主支架19的一侧固定连接。本实施方式中，柔性导热件117背离主支架19的一侧面通过涂覆胶体与转动摄像模组114的补强板(图未示)、第一次收容部1133的第二装设段1137及第二次收容部1135的第二装设段1137固定连接，柔性导热件117未与主支架19接触。由于凹设部191为通孔，有效增大了转动摄像模组114的散热空间。另外，由于柔性导热件117与第二次收容部1135的收容底壁1137朝向主支架19的一侧固定连接，使得柔性导热件117、辅支架113形成导热通道。另外，由于凹设部191为通孔，方便柔性导热件117的灵活设置。
第三实施方式
第三实施方式提供的电子设备与第一实施方式提供的电子设备结构大致相同，请参阅图33，图33为本申请第三实施方式提供的电子设备的部分结构示意图，不同在于，柔性导热件117、辅支架113与主支架19形成导热通道。
较为具体的，主支架19省略了凹设部，第一固定模组115的底部、第二固定模组116的底部与主支架19接触，柔性导热件117的第一端与第二端均与辅支架113连接且部分与主支架19连接，即柔性导热件117将转动摄像模组114的图像传感器(图未示)产生的热量传导至辅支架113与主支架19。
辅支架113包括本体1236、第一分隔件1237及第二分隔件1238，第一分隔件1237与第二分隔件1238固定于本体1236朝向主支架19的一侧从而将辅支架113的收容空间分隔成第一收容部1131、第一次收容部1133及第二次收容部1135。第一分隔件1237位于第一收容部1131与第一次收容部1133之间，第二分隔件1238位于第一收容部1131与第二次收容部1135之间。第一分隔件1237及第二分隔件1238均包括第一装设段1239及第二装设段1240。第一装设段1239与本体1236固定连接，第二装设段1240由第一装设段1239远离本体1236的一端弯折形成，其中，第一分隔件1237的第二装设段1240朝向第一固定模组115所在一侧凸伸弯折，第二分隔件1238的第二装设段1240朝向第二固定模组116所在一侧凸伸弯折，如此，增大了第一收容部1131的空间。柔性导热件117的第一端与第一分隔件1237的第二装设段1240朝向第一收容部1131的内壁固定连接并与主支架19连接触，柔性导热件117的第二端与第二分隔件1237的第二装设段1240朝向第一收容部1131的内壁固定连接并与主支架19连接触，使得柔性导热件117收容于第一收容部1131内。由于柔性导热件117收容于第一收容部1131内，其不但能够将转动摄像模组114的热量传导至辅支架113的同时，亦能够减小对电子设备10的其他零部件减少干扰，方便其他零部件的布局。
可以理解，第一固定模组115可以不与辅支架113固定连接而由主支架19支撑，第二固定模组116可以不与辅支架113固定连接而由主支架19支撑。
第四实施方式
第四实施方式提供的电子设备与第三实施方式提供的电子设备结构大致相同，请参阅图34，图34为本申请第四实施方式提供的电子设备的部分结构示意图，柔性导热件117、 辅支架113形成导热通道，不同在于，主支架19具凹设部191，且凹设部191为通孔，第一固定模组115与辅支架113固定连接，第一固定模组115相对主支架19悬空设置，第二固定模组116与辅支架113固定连接，第二固定模组116相对主支架19悬空设置。由于凹设部191为通孔，增大了第一固定模组115、第二固定模组116的散热空间，并方便转动摄像模组114底部的柔性导热件117的设置。
第五实施方式
第五实施方式提供的电子设备与第一实施方式提供的电子设备结构大致相同，请参阅图35，图35为本申请第五实施方式提供的电子设备的部分结构示意图，不同在于，电子设备还包括屏蔽罩319，摄像组件31还包括连接器320及柔性电路板321。屏蔽罩319与连接器320设于主电路板318朝向主支架311一侧。连接器320位于屏蔽罩319与辅支架313之间。屏蔽罩319用于屏蔽电磁。柔性导热件317贴附于柔性电路板321。柔性导热件317的第一端从柔性电路板321伸出并固定于转动摄像模组314底部的补强板(图未示)，柔性导热件317的第二端与屏蔽罩319背离主电路板318的一侧固定连接。本实施方式中，连接器320为板对板连接器(Board-to-board Connectors，简称BTB)。可以理解，不限定连接器320为板对板连接器，其也可以为其他能够实现将柔性电路板321固定于主电路板318上实现信号传输的结构。
柔性电路板321的第一端与转动摄像模组314的驱动电路板(图未示)电连接，柔性电路板321的第二端与连接器320背离主电路板318的一侧固定连接，实现转动摄像模组314与主电路板318电性连接。
本实施方式中，柔性导热件317的单面背胶一端贴附补强板的底部，柔性导热件317的第一端搭接到屏蔽罩319上，此时转动摄像模组314的图像传感器产生的热量通过柔性导热件317传导至柔性电路板321和屏蔽罩319上，即柔性导热件317、柔性电路板321与屏蔽罩319形成导热通道。
第六实施方式
第六实施方式提供的电子设备与第五实施方式提供的电子设备结构大致相同，请参阅图36，图36为本申请第六实施方式提供的电子设备的部分结构示意图，不同在于，屏蔽罩319与连接器320设于主电路板318背离主支架311一侧，屏蔽罩319位于连接器320与辅支架313之间。辅支架313与主电路板318之间具有间隙301。柔性电路板321的第一端固定于转动摄像模组314，柔性导热件317贴附于柔性电路板321背离转动摄像模组314的一侧上，柔性电路板321的第一端位于转动摄像模组314与柔性导热件317的第一端之间，柔性电路板321与柔性导热件317穿设于间隙301，柔性电路板321的第二端凸伸出柔性导热件317并与连接器320电性连接，柔性导热件317的第二端与屏蔽罩319固定连接。
本实施方式中，柔性电路板321双面背胶，柔性电路板321的第一端贴附于补强板的底部，柔性电路板321的第二端贴附于连接器320，屏蔽罩319与补强板之间的柔性电路板321可局部背胶；此时转动摄像模组314的图像传感器产生的热量通过柔性电路板321 传导至柔性导热件317及屏蔽罩319上，即柔性电路板321、柔性导热件317与屏蔽罩319形成导热通道。
第七实施方式
第七实施方式提供的电子设备与第五实施方式提供的电子设备结构大致相同，请参阅图37，图37为本申请第七实施方式提供的电子设备的部分结构示意图，不同在于，屏蔽罩319与连接器320分别设于主电路板318的两侧，其中，屏蔽罩319位于主电路板318朝向主支架311的一侧，连接器320朝向主电路板318背离主支架311的一侧。柔性导热件317局部贴附于柔性电路板321上。柔性电路板321的一端固定于转动摄像模组314的底部与柔性导热件317之间，柔性电路板321远离转动摄像模组314的一端与柔性导热件317分离并穿设于间隙301，柔性电路板321远离转动摄像模组314的一端与连接器320固定连接。柔性导热件317的第一端与柔性电路板321背离转动摄像模组314的一侧固定连接，柔性导热件317从转动摄像模组314的底部区域朝向屏蔽罩319所在方向延伸，柔性导热件317的第二端与屏蔽罩319背离主电路板318的一侧固定连接。
柔性导热件317的单面背胶，一端贴附于柔性电路板321背离转动摄像模组314的一侧上，一端贴附于屏蔽罩319，补强板和屏蔽罩319之间的柔性导热件317可局部背胶，转动摄像模组314的图像传感器产生的热量部分通过柔性导热件317传导至柔性电路板321及屏蔽罩319，即通过柔性导热件317、柔性电路板321与屏蔽罩319形成导热通道。
第八实施方式
第八实施方式提供的电子设备与第一实施方式提供的电子设备的结构大致相同，请参阅图38，图38为本申请第八实施方式提供的电子设备的部分结构示意图，不同在于，主支架411的凹设部4111为通孔，柔性导热件417穿设于凹设部4111，柔性导热件417的第一端与主支架411背离辅支架413的一侧固定连接，柔性导热件417的第二端与主支架411背离辅支架413的一侧固定连接，即将转动摄像模组414的图像传感器产生的热量通过柔性导热件417传导至主支架411。本实施方式中，柔性导热件417的单面背胶，柔性导热件417的第一端贴附转动摄像模组414的补强板底部，另一端贴附主支架411。
第九实施方式
第九实施方式提供的电子设备与第八实施方式提供的电子设备的结构大致相同，请参阅图39，图39为本申请第九实施方式提供的电子设备的部分结构示意图，不同在于，柔性导热件417还与第一固定模组415的底部连接，柔性导热件417还与第二固定模组416的底部连接，从而将转动摄像模组414的图像传感器产生的热量通过柔性导热件417传导至第一固定模组415、第二固定模组416及主支架411。柔性导热件417单面背胶，柔性导热件417部分贴附转动摄像模组414的补强板底部，柔性导热件417反向延伸并贴附第一固定模组415的底部、第二固定模组416的底部，以及主支架411背离辅支架413的一侧。
第十实施方式
第十实施方式提供的电子设备与第八实施方式提供的电子设备的结构大致相同，请参阅图40，图40为本申请第十实施方式提供的电子设备的部分结构示意图，不同在于，摄像组件省略了第一固定模组及第二固定模组，辅支架413与主电路板418之间具有间隙401，电子设备还包括连接器420及柔性电路板421，连接器420固定于主电路板418背离主支架411的一侧。柔性导热件417贴合于柔性电路板421上，柔性导热件417的第一端从柔性电路板421伸出贴附于主支架411背离转动摄像模组414的一侧，柔性导热件417穿设于凹设部4111及间隙401，柔性导热件417部分固定连接于摄像模组414的底部，柔性导热件417的第二端延伸至连接器420。
柔性电路板421的第一端与转动摄像模组414的底部固定并电连接，柔性电路板421随同柔性导热件417穿设于间隙401，且柔性电路板421的第二端与连接器420固定且电性连接。柔性导热件417与主支架411及柔性电路板421形成导热通道。转动摄像模组414的图像传感器产生的热量，通过柔性导热件417一部分传导至柔性电路板421，一部分传导至主支架411。
可以理解，柔性导热件417的第二端延伸至连接器420与连接器420固定连接，柔性电路板421的第二端与连接器420能够实现信号传输即可。
第十一实施方式
第十一实施方式提供的电子设备与第一实施方式提供的电子设备的结构大致相同，请参阅图41，图41为本申请第十一实施方式提供的电子设备的部分结构示意图，不同在于，摄像组件51省略了第一固定模组、第二固定模组，摄像组件51还包括半导体致冷器(Thermoelectric Cooler，简称TEC)519，半导体致冷器519固定于转动摄像模组514与柔性导热件517之间，其中半导体致冷器519的冷面与转动摄像模组514相邻设置，半导体致冷器519的热面与柔性导热件517相邻设置。如此，转动摄像模组514产生的热量被半导体致冷器519的冷面吸收，通过半导体致冷器519的热面传导至柔性导热件517，从而提高摄像组件51的散热效率。半导体致冷器519与电子设备的处理器(图未示)通信连接。
半导体致冷器是利用半导体材料的珀尔帖效应制成的。所谓珀尔帖效应，是指当直流电流通过两种半导体材料组成的电偶时，其一端吸热，另一端放热的现象。重掺杂的N型和P型碲化铋主要用作TEC的半导体材料，碲化铋元件采用电串联，并且是并行发热。TEC包括一些P型和N型对(组)，它们通过电极连在一起，并且夹在两个陶瓷电极之间；当有电流从TEC流过时，电流产生的热量会从TEC的一侧传到另一侧，在TEC上产生″热″侧和″冷″侧，这就是TEC的加热与致冷原理。
综上所述，柔性导热件固定于摄像功能组的一端，并柔性导热件还用于与非转动摄像模组部件连接，以在所述摄像功能组的一端因转动而悬空时，将所述摄像功能组产生的热量转移至所述非转动摄像模组部件。所述非转动摄像模组部件，为转动摄像模组之外的部件，例如，辅支架、主支架、屏蔽罩、后壳等等其他部件，所述“与非转动摄像模组部件连接”中的连接可以为贴合、接触等等连接方式，柔性导热件能够实现将转动摄像模组产 生的热量转移至非转动摄像模组部件即可。
以上所述，仅是本发明的较佳实施例而已，并非对本发明作任何形式上的限制。虽然本发明已以较佳实施例揭露如上，然而并非用以限定本发明。任何熟悉本领域的技术人员，在不脱离本发明技术方案范围情况下，都可利用上述揭示的方法和技术内容对本发明技术方案做出许多可能的变动和修饰，或修改为等同变化的等效实施例。因此，凡是未脱离本发明技术方案的内容，依据本发明的技术实质对以上实施例所做的任何简单修改、等同变化及修饰，均仍属于本发明技术方案保护的范围内。

Claims (16)

  1. 一种摄像组件，其特征在于，包括：辅支架、转动摄像模组及柔性导热件，所述转动摄像模组设于所述辅支架上，所述转动摄像模组包括转动支架及设于所述转动支架上的摄像功能组，所述转动支架与所述辅支架转动连接，所述柔性导热件与所述摄像功能组的一端固定连接，所述柔性导热件还用于与非转动摄像模组部件连接，以将所述摄像功能组产生的热量转移至所述非转动摄像模组部件。
  2. 根据权利要求1所述的摄像组件，其特征在于，所述摄像功能组包括镜头模组、驱动部件、驱动电路板、补强板及图像传感器，所述镜头模组设于所述转动支架上，所述驱动部件用于驱动所述转动支架相对所述辅支架转动，所述驱动电路板固定于所述镜头模组的一端，所述图像传感器设于所述驱动电路板朝向所述镜头模组的一侧，所述补强板设于所述驱动电路板背离所述镜头模组一侧，所述柔性导热件与所述补强板固定连接。
  3. 根据权利要求1所述的摄像组件，其特征在于，所述辅支架包括本体及凸设于所述本体一侧的分隔件，所述本体形成收容空间，所述分隔件将所述收容空间分隔成第一收容部及第二收容部，所述转动摄像模组收容于所述第一收容部内，所述摄像组件还包括固定收容于所述第二收容部的固定模组，所述固定模组为固定摄像模组或辅助摄像模组。
  4. 根据权利要求1至3任意一项所述的摄像组件，其特征在于，所述柔性导热件部分延伸至所述固定模组并与所述固定模组相贴合。
  5. 根据权利要求1至3任意一项所述的摄像组件，其特征在于，所述柔性导热件部分朝向所述分隔件延伸并与所述分隔件相贴合。
  6. 根据权利要求1至3任意一项所述的摄像组件，其特征在于，所述分隔件包括第一装设段及第二装设段，所述第一装设段的一端与所述本体固定连接，所述第二装设段由所述第一装设段的另一端弯折延伸形成并与所述本体固定连接，所述第一收容部由所述本体及所述第一装设段围成，所述第二收容部由所述本体、所述第一装设段及所述第二装设段共同围成，所述柔性导热件与所述第二装设段相贴合。
  7. 根据权利要求1所述的摄像组件，其特征在于，所述摄像组件还包括连接器及柔性电路板，所述柔性导热件贴附于所述柔性电路板，所述柔性电路板的一端与所述转动摄像模组电性连接，所述柔性电路板远离所述转动摄像模组的一端与所述连接器固定并电性连接，所述连接器用于与电子设备的主电路板固定并电性连接。
  8. 根据权利要求1至7任意一项所述的摄像组件，其特征在于，所述柔性导热件部分从所述柔性电路板露出，用于与设于所述主电路板的屏蔽罩固定连接。
  9. 根据权利要求1所述的摄像组件，其特征在于，所述柔性导热件包括连接设置的连接区域及悬空区域，所述连接区域与所述摄像功能组固定连接，所述柔性导热件位于所述悬空区域部分为弯折结构。
  10. 根据权利要求1至9任意一项所述的摄像组件，其特征在于，位于所述悬空区域的所述柔性导热件设有应力槽，用于缓冲所述柔性导热件因所述摄像功能组转动拉扯而产生的应力。
  11. 根据权利要求1至10任意一项所述的摄像组件，其特征在于，所述摄像组件还包括固定于所述摄像功能组与所述柔性导热件之间的半导体致冷器，所述半导体致冷器的冷面朝向所述摄像功能组设置，所述半导体致冷器的热面朝向所述柔性导热件设置。
  12. 根据权利要求1所述的摄像组件，其特征在于，所述摄像功能组与所述柔性导热件连接一端相对所述辅支架转动时悬空。
  13. 一种电子设备，其特征在于，包括根据权利要求1-12项任意一项所述的摄像组件、主支架及主电路板，所述主电路板固定于所述主支架上，所述辅支架固定于所述主支架并露出所述主电路板背离所述主支架一侧，所述摄像功能组与所述主电路板电连接。
  14. 根据权利要求13所述的电子设备，其特征在于，所述柔性导热件部分朝向所述主支架延伸并与所述主支架相贴合。
  15. 根据权利要求13-14任意一项所述的电子设备，其特征在于，所述主支架朝向所述辅支架一侧设有凹设部，所述凹设部对准所述转动摄像模组设置。
  16. 根据权利要求15所述的电子设备，其特征在于，所述凹设部为通孔，所述柔性导热件穿设于所述凹设部，并与所述主支架背离所述辅支架的一侧固定连接。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113676631A (zh) * 2021-08-09 2021-11-19 维沃移动通信有限公司 摄像头模组及电子设备

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113645332B (zh) * 2021-08-13 2024-11-15 维沃移动通信有限公司 电子设备
CN113852736B (zh) * 2021-09-01 2023-05-30 杭州海康威视数字技术股份有限公司 摄像模组及电子设备
CN117529011B (zh) * 2022-07-30 2025-12-16 超聚变数字技术有限公司 散热装置和电子设备
KR20250023631A (ko) * 2023-08-10 2025-02-18 삼성전기주식회사 흔들림 보정용 액추에이터 및 이를 포함하는 카메라 모듈
CN118651930A (zh) * 2024-07-09 2024-09-17 安徽科讯环境工程技术有限公司 一种超声波净化水质智能机器人

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080198556A1 (en) * 2007-02-20 2008-08-21 Yukihiro Iwata Heatsink structure for solid-state image sensor
CN102201756A (zh) * 2010-03-23 2011-09-28 佳能株式会社 振动波马达
CN102243416A (zh) * 2010-03-30 2011-11-16 佳能株式会社 包括作为发热源的电子部件的电子设备
CN104580855A (zh) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 摄像头模组
CN105052121A (zh) * 2012-12-12 2015-11-11 罗伯特·博世有限公司 摄像机装置及其制造方法
CN107135346A (zh) * 2017-06-30 2017-09-05 广东欧珀移动通信有限公司 成像装置组件及电子装置
CN207782931U (zh) * 2017-03-10 2018-08-28 谷歌有限责任公司 热量传递装置和相机系统
CN108924393A (zh) * 2018-07-13 2018-11-30 北京大恒图像视觉有限公司 一种大靶面图像传感器的散热结构
US20190140112A1 (en) * 2013-03-15 2019-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Image Sensor Device and Method
CN109975973A (zh) * 2019-02-28 2019-07-05 华为技术有限公司 驱动液体镜头的音圈马达及具有音圈马达的镜头组件
CN209417503U (zh) * 2019-01-16 2019-09-20 南京华捷艾米软件科技有限公司 光学器件和掌上电脑

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102859986A (zh) * 2011-02-14 2013-01-02 松下电器产业株式会社 拍摄装置
JP2013200366A (ja) 2012-03-23 2013-10-03 Sony Corp カメラモジュールおよびカメラ装置
JP2014045304A (ja) 2012-08-27 2014-03-13 Sony Corp カメラモジュールおよび電子機器
US9664562B1 (en) * 2013-02-12 2017-05-30 Lockheed Martin Corporation Method and system for scanning staring focal plane array imaging
US10250783B2 (en) * 2016-07-07 2019-04-02 Google Llc Magnetic mount assembly of a camera
JP6959777B2 (ja) * 2017-07-12 2021-11-05 日本電産サンキョー株式会社 振れ補正機能付き光学ユニット
JP7046512B2 (ja) * 2017-07-12 2022-04-04 日本電産サンキョー株式会社 ローリング補正機能付き光学ユニットおよび３軸振れ補正機能付き光学ユニット
US10602035B2 (en) * 2017-09-19 2020-03-24 Google Llc Temperature-controlled camera assembly
US10855890B2 (en) * 2017-10-23 2020-12-01 Magna Electronics Inc. Camera for vehicle vision system with enhanced heat removal
CN110007543A (zh) 2019-03-22 2019-07-12 高瞻创新科技有限公司 一种高性能及可靠的微型防抖云台

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080198556A1 (en) * 2007-02-20 2008-08-21 Yukihiro Iwata Heatsink structure for solid-state image sensor
CN102201756A (zh) * 2010-03-23 2011-09-28 佳能株式会社 振动波马达
CN102243416A (zh) * 2010-03-30 2011-11-16 佳能株式会社 包括作为发热源的电子部件的电子设备
CN105052121A (zh) * 2012-12-12 2015-11-11 罗伯特·博世有限公司 摄像机装置及其制造方法
US20190140112A1 (en) * 2013-03-15 2019-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Image Sensor Device and Method
CN104580855A (zh) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 摄像头模组
CN207782931U (zh) * 2017-03-10 2018-08-28 谷歌有限责任公司 热量传递装置和相机系统
CN107135346A (zh) * 2017-06-30 2017-09-05 广东欧珀移动通信有限公司 成像装置组件及电子装置
CN108924393A (zh) * 2018-07-13 2018-11-30 北京大恒图像视觉有限公司 一种大靶面图像传感器的散热结构
CN209417503U (zh) * 2019-01-16 2019-09-20 南京华捷艾米软件科技有限公司 光学器件和掌上电脑
CN109975973A (zh) * 2019-02-28 2019-07-05 华为技术有限公司 驱动液体镜头的音圈马达及具有音圈马达的镜头组件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4084462A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113676631A (zh) * 2021-08-09 2021-11-19 维沃移动通信有限公司 摄像头模组及电子设备
CN113676631B (zh) * 2021-08-09 2023-05-26 维沃移动通信有限公司 摄像头模组及电子设备

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