WO2021218392A1 - 天线模组及电子设备 - Google Patents

天线模组及电子设备 Download PDF

Info

Publication number
WO2021218392A1
WO2021218392A1 PCT/CN2021/079664 CN2021079664W WO2021218392A1 WO 2021218392 A1 WO2021218392 A1 WO 2021218392A1 CN 2021079664 W CN2021079664 W CN 2021079664W WO 2021218392 A1 WO2021218392 A1 WO 2021218392A1
Authority
WO
WIPO (PCT)
Prior art keywords
main
layer
feeder
antenna
antenna module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/079664
Other languages
English (en)
French (fr)
Inventor
林栢暐
李偲
于晨武
钱占一
李琴芳
谭冠南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Huizhou Speed Wireless Technology Co Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Huizhou Speed Wireless Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd, Huizhou Speed Wireless Technology Co Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to EP21797924.4A priority Critical patent/EP4113744A4/en
Publication of WO2021218392A1 publication Critical patent/WO2021218392A1/zh
Priority to US17/933,627 priority patent/US12255401B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H01Q19/108—Combination of a dipole with a plane reflecting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
    • H01Q5/364—Creating multiple current paths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

Definitions

  • This application relates to the field of electronic technology, in particular to an antenna module and electronic equipment.
  • An antenna module for communication is provided in the electronic device. How to increase the working bandwidth of the antenna module, reduce the scanning loss, and improve the transmission efficiency of the antenna module has become a problem that needs to be solved.
  • the present application provides an antenna module and electronic equipment that can increase working bandwidth, reduce scanning loss, and improve transmission efficiency.
  • An antenna module provided by this application includes:
  • the first antenna layer includes at least one main radiating unit and at least one feeder portion
  • the main radiating unit includes at least two symmetrical and spaced apart main radiation patches
  • the feeder portion is located or corresponds to In the gap between two adjacent main radiating patches
  • the feeder portion is electrically connected or coupled to the main radiating patch;
  • the second antenna layer is stacked with the first antenna layer.
  • the second antenna layer includes a reference ground and at least one microstrip line.
  • the reference ground is located opposite to the main radiation patch.
  • the radio frequency transceiver chip is located at The reference ground is away from the main radiation patch; the microstrip line is provided on the layer where the reference ground is located, between the reference ground and the main radiation patch, or the reference ground is away from the main radiation patch
  • One side of the radiating patch is insulated from the reference ground, and one end of the microstrip line is electrically connected to the radio frequency transceiver chip;
  • At least one first conductive member the first conductive member electrically connecting the main radiation patch and the reference ground;
  • At least one second conductive element one end of the second conductive element is electrically connected to the feeder portion, and the other end is electrically connected to the other end of the microstrip line.
  • the application also provides an electronic device including the above-mentioned antenna module.
  • the antenna module by designing the structure of the antenna module, the main radiating patch and the feeder part form an electric dipole, and the main radiating patch, the first conductive member, the feeder part and the reference ground form a magnetic dipole ,
  • the antenna module is a combination of electric dipole and magnetic dipole, which can realize a wider frequency band, and can obtain stable gain and pattern in the whole working frequency band, taking into account its bandwidth, isolation, cross-polarization, and gain And other characteristics; by setting the microstrip line between the feeder part and the RF transceiver chip, adjusting the impedance of the main radiating unit by setting the length of the microstrip line and the distance between the microstrip line and the reference ground, and then adjusting the antenna unit’s operating frequency
  • the impedance matching at the point realizes a broadband and miniaturized antenna module.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in Embodiment 1 of the present application.
  • FIG. 2 is a schematic diagram showing the structure of the electronic device in FIG. 1;
  • FIG. 3 is a schematic diagram of another antenna module in FIG. 2 installed on a motherboard;
  • FIG. 4 is a schematic diagram of another antenna module in FIG. 2 installed on the motherboard;
  • Fig. 5 is a side view of the antenna module in Fig. 2;
  • FIG. 6 is a schematic structural view of the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the sixth conductive layer in FIG. 5 being laid on the same plane;
  • FIG. 7 is a schematic structural view of the second conductive layer and the third conductive layer in FIG. 6 being laid flat on the same plane;
  • FIG. 8 is a split structure diagram of the first antenna layer, the fifth conductive layer, and the sixth conductive layer in FIG. 6;
  • FIG. 9 is a schematic diagram of the structure of the first type of microstrip line in FIG. 6;
  • FIG. 10 is a schematic diagram of the structure of the second type of microstrip line in FIG. 6;
  • FIG. 11 is a schematic diagram of the structure of the third type of microstrip line in FIG. 6;
  • FIG. 12 is a partially enlarged schematic diagram of a fifth conductive layer provided by an embodiment of the present application.
  • FIG. 13 is a structure in which the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the sixth conductive layer in the antenna module provided in the second embodiment of the present application are laid on the same plane
  • FIG. 14 is a schematic diagram of the first structure of the main radiation patch provided in Embodiment 1 of the present application.
  • FIG. 15 is a schematic diagram of the second structure of the main radiation patch provided in Embodiment 1 of the present application.
  • FIG. 16 is a schematic diagram of a third structure of the main radiation patch provided in Embodiment 1 of the present application.
  • FIG. 17 is a schematic diagram of the fourth structure of the main radiation patch provided in Embodiment 1 of the present application.
  • FIG. 18 is a schematic diagram of the fifth structure of the main radiation patch provided in Embodiment 1 of the present application.
  • FIG. 19 is a schematic diagram of the sixth structure of the main radiation patch provided in Embodiment 1 of the present application.
  • FIG. 20 is a schematic structural diagram of a main radiation layer provided by Embodiment 1 of the present application.
  • 21 is a schematic diagram of the first structure of the parasitic radiation patch provided in the second embodiment of the present application.
  • 22 is a schematic diagram of the second structure of the parasitic radiation patch provided in the second embodiment of the present application.
  • FIG. 23 is a schematic diagram of a third structure of the parasitic radiation patch provided in the second embodiment of the present application.
  • 24 is a schematic diagram of the fourth structure of the parasitic radiation patch provided in the second embodiment of the present application.
  • FIG. 25 is a structure in which the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the sixth conductive layer in the antenna module provided in the third embodiment of the present application are laid on the same plane Schematic diagram
  • FIG. 26 is a schematic diagram of the first structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 27 is a schematic diagram of the second structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 28 is a schematic diagram of a third structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 29 is a schematic diagram of a fourth structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 30 is a schematic diagram of the fifth structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 31 is a schematic diagram of the sixth structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 32 is a schematic diagram of the seventh structure of the feeder portion provided in Embodiment 1 of the present application.
  • FIG. 33 is a structure in which the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the fifth conductive layer, and the sixth conductive layer in the antenna module provided by the fourth embodiment of the present application are laid on the same plane Schematic diagram
  • FIG. 34 is a schematic diagram of the structure of the second conductive layer and the third conductive layer in FIG. 33.
  • FIG. 35 is a first schematic diagram of a metal retaining wall provided in Embodiment 1 of the present application.
  • FIG. 36 is a schematic diagram of the second structure of the metal retaining wall provided in Embodiment 1 of the present application.
  • FIG. 37 is a schematic diagram of a third structure of a metal retaining wall provided in Embodiment 1 of the present application.
  • FIG. 38 is a schematic diagram of a fourth structure of a metal retaining wall provided in Embodiment 1 of the present application.
  • FIG. 39 is a schematic diagram of a fifth structure of a metal retaining wall provided in Embodiment 1 of the present application.
  • Figure 40 is a side view of the metal retaining wall provided in Figure 39;
  • FIG. 41 is a graph of the input return loss (S11) and frequency of the antenna module provided in the first embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the application.
  • the electronic equipment 100 can be a phone, a TV, a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, a car device, a headset, a watch, a wearable device, a base station, a car radar, a customer premise equipment (Customer Premise Equipment, CPE), etc.
  • the electronic device 100 is a mobile phone as an example for description.
  • FIG. 2 is a schematic diagram of a structural decomposition of an electronic device 100 provided by an embodiment of the application.
  • the electronic device 100 further includes a display screen 101, a middle frame 102, and a battery cover 103 that are fixedly connected in sequence.
  • the electronic device 100 also includes an antenna module 10, a battery 104, a main board 105, a camera 106, a small board 107, a microphone, a receiver, and a speaker arranged in an internal space surrounded by the display screen 101, the middle frame 102 and the battery cover 103.
  • Face recognition module, fingerprint recognition module and other devices that can realize the basic functions of the mobile phone, and will not be repeated in this embodiment.
  • This application does not specifically limit the position of the antenna module 10 in the electronic device 100.
  • the antenna module 10 is provided on the main board 105 or is electrically connected to the main board 105.
  • the antenna module 10 is directly electrically connected to another BTB connector on the main board 105 through a BTB (Board-to-Board) connector.
  • BTB Board-to-Board
  • the antenna module 10 may also be electrically connected to the main board 105 through the flexible circuit board 108.
  • one end of the flexible circuit board 108 is provided with a BTB connector 181, and the BTB connector 181 is electrically connected to the antenna module 10.
  • the other end of the flexible circuit board 108 is provided with another BTB connector 182, and the BTB connector 182 is electrically connected to the main board 105.
  • the antenna module 10 may be arranged parallel to the battery cover 103 (that is, the antenna module 10 is arranged opposite to the main board 105); or, referring to FIG. 4, the antenna module 10 may be perpendicular to the battery cover 103 Further, the antenna module 10 can be located on the side of the battery 104 or the main board 105. In other embodiments, the antenna module 10 may also have a certain inclination angle with the main board 105.
  • the antenna module 10 is used for transmitting and receiving electromagnetic wave signals of a predetermined frequency band.
  • the preset frequency band includes at least one of a frequency band below 1G, a sub-6GHz frequency band from 1G to 5G, a millimeter wave frequency band, a submillimeter wave frequency band, and a terahertz wave frequency band.
  • the preset frequency band is the millimeter wave frequency band as an example for description, which will not be repeated hereafter.
  • the frequency range of the millimeter wave frequency band is 24.25GHz ⁇ 52.6GHz.
  • 3GPPRelease version 15 specifies the current 5G millimeter wave frequency bands as follows: n257 (26.5-29.5GHz), n258 (24.25-27.5GHz), n261 (27.5-28.35GHz) and n260 (37-40GHz).
  • the antenna module 10 provided in the first embodiment of the present application includes at least one antenna unit 1 and a radio frequency transceiver chip 2.
  • description is made by taking four antenna units 1 as an example.
  • the 4 antenna elements 1 are arranged along 1 column * 4 rows.
  • the number of antenna units 1 can be 8 and arranged along 2 columns * 4 rows; or, the number of antenna units 1 can be 16 and arranged along 4 columns * 4 rows.
  • the four antenna units 1 are interconnected as a whole.
  • the four antenna units 1 can be arranged on the same carrier substrate to form a rigid circuit board or a flexible circuit board.
  • the antenna module 10 is defined with reference to the first viewing angle, the width direction of the antenna module 10 is defined as the X axis direction, the length direction of the antenna module 10 is defined as the Y axis direction, and the thickness of the antenna module 10 The direction is defined as the Z-axis direction.
  • the width dimension of the antenna module 10 is smaller than the length dimension of the antenna module 10.
  • the direction indicated by the arrow is positive.
  • the four antenna units 1 are arranged along the Y-axis direction.
  • the antenna unit 1 includes a first protective layer F1, a first conductive layer L1, a first sheet layer S1, a second conductive layer L2, a second sheet layer S2, a third conductive layer L3, The third sheet layer S3, the fourth conductive layer L4, the fourth sheet layer S4, the fifth conductive layer L5, the fifth sheet layer S5, the sixth conductive layer L6, and the second protective layer F2.
  • the number of conductive layers can be 5 layers, 7 layers, and so on.
  • the first protective layer F1, the first conductive layer L1, the first sheet layer S1, the second conductive layer L2, the second sheet layer S2, the third conductive layer L3, and the third sheet layer S3 is defined as the first antenna layer A
  • the fourth conductive layer L4, the fourth sheet layer S4, the fifth conductive layer L5, the fifth sheet layer S5, the sixth conductive layer L6 and the second protective layer F2 are defined as the second antenna layer B.
  • the first antenna layer A and the second antenna layer B are stacked.
  • the first conductive layer L1, the second conductive layer L2, the third conductive layer L3, the fourth conductive layer L4, the fifth conductive layer L5, and the sixth conductive layer L6 may be composed of metals with better conductive properties.
  • the materials of the six conductive layers can all be copper or aluminum.
  • the material of the six conductive layers is copper for illustration. In other words, these six conductive layers are all copper foil layers.
  • the shape of each copper foil layer can be the same or different.
  • the materials of the first sheet layer S1, the second sheet layer S2, the third sheet layer S3, the fourth sheet layer S4, and the fifth sheet layer S5 are all insulating materials. Two adjacent conductive layers are insulated from each other. This embodiment mainly specifically describes the first conductive layer L1 to the sixth conductive layer L6.
  • the first antenna layer A includes at least one main radiating unit 11 and at least one feeder portion 12.
  • the first antenna layer A includes a main radiating layer A1, the main radiating unit 11 is disposed on the main radiating layer A1, and the feeder portion 12 may be partially disposed on the main radiating layer A1 or entirely disposed on the main radiating layer A1. Outside the radiation layer A1.
  • the main radiation unit 11 is disposed on the second conductive layer L2 (the first conductive layer L1 will be described later).
  • the main radiation unit 11 includes at least two main radiation patches 110 that are symmetrical and spaced apart.
  • the main radiation patch 110 is the receiving end (or transmitting end) of the antenna module 10 to receive (or transmit) electromagnetic wave signals.
  • the material of the main radiation patch 110 is a conductive material.
  • the material of the main radiation patch 110 includes but is not limited to metal, conductive plastic, conductive polymer, conductive oxide, and the like. It is printed on the board in the form of a plane patch, which is simple to process and low in cost.
  • the shape of the main radiation patch 110 may be rectangular, fan-shaped, triangular, circular, ring-shaped, cross-shaped, and so on.
  • the main radiation patch 110 has a substantially rectangular shape as an example for description.
  • This application does not specify the number of main radiation patches 110 in one main radiation unit 11, for example, the number of main radiation patches 110 in one main radiation unit 11 may be two, three, four, Six, eight, etc. In this application, the number of the main radiation patches 110 is four for illustration.
  • the four main radiation patches 110 are centrally symmetrically arranged. In other words, each main radiating patch 110 occupies a space of one quadrant, and the four main radiating patches 110 occupy four quadrants on the plane.
  • the shapes of the four main radiation patches 110 may be the same or different. This application does not make specific restrictions. In this embodiment, the four main radiation patches 110 have the same shape as an example for description.
  • the four main radiation patches 110 form a first gap 111 and a second gap 112 that intersect in a substantially cross shape.
  • the four main radiating patches 110 are defined as the first main radiating patch 110a, the second main radiating patch 110b, the third main radiating patch 110c, and the fourth main radiating patch 110d.
  • the first gap 111 extends in the X-axis direction
  • the second gap 112 extends in the Y-axis direction.
  • the feeder portion 12 is located or corresponds to a gap (including a first gap 111 and a second gap 112) between two adjacent main radiation patches 110.
  • the feeder portion 12 is electrically connected or coupled to the main radiating patch 110 to transmit the excitation signal to the main radiating patch 110.
  • the coupling of the feeder portion 12 and the main radiating patch 110 is taken as an example for description.
  • the feeder 12 is spaced apart from the main radiation patch 110.
  • the plurality of main radiation patches 110 and the feeder 12 form an electric dipole.
  • the feeder portion 12 includes a first feeder portion 121 and a second feeder portion 122.
  • the first feeder part 121 and the second feeder part 122 are insulated from each other.
  • the first feeder portion 121 is located or arranged corresponding to the first gap 111.
  • the first feeder portion 121 can feed the first main radiating patch 110a and the second main radiating patch 110b on one side, and the third main radiating patch 110c and the fourth main radiating patch 110d on the other side thereof. Electricity.
  • the second feeder portion 122 is located at or corresponding to the second gap 112.
  • the second feeder portion 122 can feed the first main radiating patch 110a and the third main radiating patch 110c on one side, and the fourth main radiating patch 110d and the second main radiating patch 110b on the other side. Electricity. It is understandable that both the first feeder portion 121 and the second feeder portion 122 are made of conductive materials, including but not limited to metals, conductive plastics, conductive polymers, conductive oxides, and the like.
  • the first feeder part 121 feeds the two pairs of main radiating patches 110 on both sides
  • the second feeder part 122 feeds the two pairs of main radiation patches 110 on both sides.
  • the main radiation patch 110 is fed to realize two polarization modes, which can effectively increase the communication capacity, transmit and receive the same work, and resist multipath fading.
  • the first feeder portion 121 is located in the first gap 111
  • a part of the second feeder portion 122 is located in the first gap 111
  • the part where the orthographic projection of the part 121 overlaps is located in the second gap 112.
  • the second antenna layer B includes a reference ground 13 and at least one microstrip line 14.
  • the reference ground 13 may be located at any one or more of the fourth conductive layer L4, the fifth conductive layer L5, or the sixth conductive layer L6.
  • the reference ground 13 is located on the fifth conductive layer L5 and the sixth conductive layer L6.
  • the fifth conductive layer L5 and the sixth conductive layer L6 both have a large area copper foil.
  • the fifth conductive layer L5 and the sixth conductive layer L6 are electrically connected through a plurality of conductive vias, so that the potentials of the fifth conductive layer L5 and the sixth conductive layer L6 are the same.
  • the conductive via includes a through hole penetrating through the fifth conductive layer L5 and the fifth sheet layer S5, and a conductive coating is provided on the inner wall of the through hole.
  • the material of the conductive coating may be the same as the material of the fifth conductive layer L5.
  • the conductive coating electrically connects the fifth conductive layer L5 and the sixth conductive layer L6.
  • the reference ground 13 is arranged opposite to the main radiation patch 110. Among them, the reference ground 13 can cover multiple main radiation units 11. In other words, multiple main radiation units 11 share a reference ground 13.
  • the antenna unit 1 further includes at least one first conductive member 15.
  • the first conductive member 15 is electrically connected to the main radiation patch 110 and the reference ground 13.
  • the first conductive member 15 is a conductive via.
  • the extension direction of the first conductive member 15 is along the Z-axis direction.
  • the number of the first conductive members 15 is the same as the number of the main radiation patches 110. In this embodiment, the number of the first conductive members 15 is four.
  • Each first conductive member 15 is electrically connected to a main radiation patch 110.
  • the connection between the first conductive member 15 and the main radiating patch 110 is a position where the main radiating patch 110 is close to the geometric center of the main radiating unit 11.
  • the plurality of main radiation patches 110, the plurality of first conductive members 15, the feeder portion 12 and the reference ground 13 constitute a magnetic dipole to radiate electromagnetic wave signals.
  • the microstrip line 14 may be located on the layer where the reference ground 13 is located, between the reference ground 13 and the main radiation patch 110, or the reference ground 13 The side facing away from the main radiation patch 110.
  • the microstrip line 14 may be located in any one of the fourth conductive layer L4, the fifth conductive layer L5, and the sixth conductive layer L6.
  • the microstrip line 14 is located on the fifth conductive layer L5.
  • the material of the microstrip line 14 is a conductive material, such as copper.
  • the microstrip line 14 is insulated from the reference ground 13. Specifically, a large-area copper foil is provided on the fifth conductive layer L5 as the reference ground 13.
  • the fifth conductive layer L5 is also provided with a hollow portion 130 surrounded by the reference ground 13.
  • the hollow part 130 is a vacant area.
  • the microstrip line 14 is provided in the hollow part 130.
  • the microstrip line 14 includes two opposite end heads 141 and a middle section 142 connected between the two end heads 141.
  • the line widths of the middle section 142 in the extending direction thereof are equal.
  • the line width of the middle section 142 is uniform.
  • the width dimension of this part of the middle section 142 in the X-axis direction is the line width of the middle section 142 of this part.
  • the width dimension of this part of the middle section 142 in the Y-axis direction is the line width of the middle section 142 of this part.
  • the line width of the middle section 142 is smaller than the width of the two end heads 141. In this embodiment, since the line width of the middle section 142 is uniform, it is convenient to control the impedance of the microstrip line 14 by controlling the length of the middle section 142.
  • the line width of the middle section 142 in its extension direction may not be equal.
  • the middle section 142 includes at least one body portion 146 interconnected in the extension direction as a whole and at least A widening 144.
  • the line width of the widened portion 144 is greater than the line width of the body portion 146.
  • the impedance of the entire microstrip line 14 can be adjusted by adjusting the length of the widened portion 144 and the length of the body portion 146 respectively.
  • the length of the microstrip line 14 can be reduced when the impedance of the microstrip line 14 is constant.
  • the microstrip line 14 further includes at least one branch 145.
  • One end of each branch 145 is electrically connected to the middle section 142.
  • the other end of each branch 145 is open.
  • the branch 145 extends in an oblique or vertical direction relative to the middle section 142.
  • microstrip lines 14 that can be used in this application.
  • the impedance formed between the line 14 and the reference ground 13 adjusts the impedance matching of the antenna unit 1 at the operating frequency point.
  • the distance between the end head portion 141 and the reference ground 13 is greater than the distance between the middle section 142 and the reference ground 13.
  • the peripheral line of the clearance area 143 around the end head 141 may be an enlarged circle or a square. In this way, the clearance size around the end head 141 is adjusted to adjust the distance formed by the microstrip line 14 and the reference ground 13 so as to adjust the impedance matching of the antenna unit 1 at the operating frequency point.
  • the radio frequency transceiver chip 2 is arranged on a side of the reference ground 13 away from the main radiation patch 110. One end of the microstrip line 14 is electrically connected to the radio frequency transceiver chip 2.
  • the antenna unit 1 further includes at least one second conductive member 16.
  • the second conductive member 16 may be a conductive via. One end of the second conductive member 16 is electrically connected to the feeder portion 12, and the other end is electrically connected to the other end of the microstrip line 14. Wherein, the second conductive member 16 is connected to an end of the feeder portion 12 away from the geometric center of the main radiating unit 11.
  • the second conductive member 16 extends along the Z-axis direction to reduce the loss of the excitation signal during the transmission process and improve the antenna efficiency of the antenna module 10.
  • the second conductive member 16 is a conductive via.
  • one antenna unit 1 includes two second conductive members 16 and two microstrip lines 14, wherein one second conductive member 16 is electrically connected to one end of the first feeder portion 121 and one microstrip line 14. At one end, the other end of the microstrip line 14 is electrically connected to a pin of the radio frequency transceiver chip 2; the other second conductive member 16 is electrically connected to one end of the second feeder portion 122 and one end of the other microstrip line 14. The other end of the line 14 is electrically connected to another pin of the radio frequency transceiver chip 2.
  • the radio frequency transceiver chip 2 is located at or close to the geometric center of the antenna module 10 on the X-Y plane.
  • the fifth conductive layer L5 is provided with 4 sets of pins 21 of the radio frequency transceiver chip 2 near the center.
  • Each group of pins 21 includes two pins 21.
  • Each set of pins 21 is electrically connected to two microstrip lines 14 of a main radiating unit 11 respectively.
  • the microstrip line 14 corresponding to each main radiation unit 11 extends in the direction of the radio frequency transceiver chip 2.
  • the microstrip line 14 may extend in a curved line.
  • the radio frequency transceiver chip 2 is arranged corresponding to the geometric center of the fifth conductive layer L5.
  • the plurality of microstrip lines 14 on the fifth conductive layer L5 may be symmetrically arranged with respect to a center line passing through the geometric center of the fifth conductive layer L5 and extending in the X direction.
  • the radio frequency transceiver chip 2 may also be located in other positions.
  • This application does not specifically limit the length of the microstrip line 14.
  • the impedance of the antenna unit 1 can be adjusted, thereby adjusting the impedance matching of the antenna unit 1 at the operating frequency point.
  • the antenna module 10 by designing the structure of the antenna module 10, the main radiating patch 110 and the feeder portion 12 form an electric dipole, the main radiating patch 110, the first conductive member 15, the feeder portion 12, and the The reference ground 13 constitutes a magnetic dipole, and the antenna module 10 is a combination of an electric dipole and a magnetic dipole, which can achieve a wider frequency band, and can obtain stable gain and pattern in the entire working frequency band, taking into account its bandwidth , Isolation, cross polarization, gain and other characteristics; by setting the microstrip line 14 between the feeder part 12 and the radio frequency transceiver chip 2, by setting the length of the microstrip line 14 and the distance between the microstrip line 14 and the reference ground 13 The spacing adjusts the impedance, and further adjusts the impedance matching of the antenna unit 1 at the operating frequency point, so as to realize a broadband and miniaturized antenna module 10.
  • an antenna module 10 provided in the second embodiment of the present application has substantially the same structure as the antenna module 10 provided in the first embodiment, and the main difference lies in
  • a plurality of the main radiating units 11 are arranged along the third direction (see the following detailed description for the first direction and the second direction).
  • the third direction is the Y-axis direction.
  • the angle between the extending direction of the first gap 111 and the third direction is 0 to 45°, and the angle between the extending direction of the second gap 112 and the third direction is 0 to 45° °.
  • each main radiating unit 11 provided in this embodiment is rotated by 0-45° around the geometric center.
  • a rotation angle of 45° is taken as an example for description.
  • the distance between the differently polarized feeders of the first feeder portion 121 and the edge of the reference ground 13 is relatively balanced, so that the difference in scanning loss in the results of different polarizations is reduced.
  • each main radiation patch 110 is also adaptively changed, and the shape of each main radiation patch 110 is similar to a fan shape.
  • each main radiating patch 110 may be a triangle, so that the outer contour of the entire main radiating patch 110 is close to a square.
  • the edge of at least one main radiation patch 110 of the main radiation unit 11 has at least one first notch 113.
  • the first notch portion 113 may be a rectangular groove, a circular groove, a triangular groove, or a T-shaped groove.
  • each main radiation patch 110 is provided with at least one first notch 113.
  • FIGS. 14 to 17 illustrate the main radiation unit 11 in the first embodiment as an example.
  • the first notch 113 provided in this application is also applicable to the main radiation unit 11 provided in the second embodiment.
  • the impedance matching of the antenna unit 1 can be effectively improved.
  • the impedance of the antenna unit 1 is changed, so that the impedance of the antenna unit 1 is matched at the desired frequency point.
  • the first notch 113 communicates with the gap between two adjacent main radiation patches 110.
  • two adjacent sides of each main radiation patch 110 are provided with first notches 113.
  • each main radiation patch 110 may also be provided with one, three or other number of multiple notches.
  • two adjacent sides are provided with first notches 113 to communicate with the first gap 111 and the second gap 112 respectively.
  • the shape of the first notch 113 is a rectangle.
  • the first notch 113 may be a rectangular groove, a circular groove, a triangular groove, a T-shaped groove, or the like.
  • the main radiation patch 110 includes a first end portion 1101 and a second end portion 1102 disposed oppositely.
  • the first end 1101 is close to the geometric center of the main radiation unit 11.
  • the first notch portion 113 is located at the second end portion 1102 and extends toward the first end portion 1101.
  • the shape of the first notch 113 is a rectangle.
  • the first notch 113 may be a rectangular groove, a circular groove, a triangular groove, or the like.
  • each of the main radiation patches 110 is provided with two first notches 113.
  • the two first notches 113 are respectively provided on two adjacent sides of the second end 1102 on the main radiation patch 110, and extend along the X-axis direction and the Y-axis direction, respectively.
  • the opening directions of the two first notches 113 all face out of the main radiating unit 11.
  • each main radiation patch 110 may also be provided with one, three or other number of multiple notches 11.
  • the direction of the notch 113 is also not specifically limited.
  • the shape of the first notch 113 is a rectangle.
  • the first notch 113 may be a rectangular groove, a circular groove, a triangular groove, a T-shaped groove, or the like.
  • this embodiment is similar to the embodiment shown in FIG. 15, except that the shape of the notch 113 provided in this embodiment is a T-shaped groove.
  • the first notch portion 113 communicates with the first gap 111 or the second gap 112 between the two adjacent main radiation patches 110.
  • a portion of the feeder 12 extends into the first notch 113.
  • both the first main radiation patch 110a and the second main radiation patch 110b are provided with a first notch 113.
  • the second feeder portion 122 includes a main body section 311 and a first extension section 312 and a second extension section 313 provided on opposite sides of the main body section 311.
  • the main body section 311 is located in the gap between the first main radiation patch 110a and the second main radiation patch 110b.
  • the first extension section 312 and the second extension section 313 are respectively located in the first notch portion 113 of the first main radiation patch 110a and in the second notch portion 113 of the second main radiation patch 110b .
  • the impedance of the feeder portion 12 can be adjusted to improve the impedance matching of the antenna unit 1; on the other hand, On the other hand, the compactness between the feeder portion 12 and the main radiation patch 110 can also be improved, and the miniaturization of the antenna unit 1 can be promoted.
  • the main radiating unit 11 further includes a first main radiating patch 110a and a second main radiating patch 110b arranged adjacently. At least one first protrusion 314 is provided on a side of the first main radiation patch 110a close to the second main radiation patch 110b. The first protrusion 314 extends toward the second main radiation sticker 110b.
  • the main radiation unit 11 provided in the second embodiment is taken as an example for description.
  • the first main radiating patch 110a and the second main radiating patch 110b are both fan-shaped.
  • the opposite sides of each main radiation patch 110 may be provided with first protrusions 314 respectively.
  • the first protrusion 314 extends toward the empty area 315.
  • the antenna module 10 further includes one or more parasitic radiation layers A2.
  • the parasitic radiation layer A2 is located between the main radiation layer A1 and the second antenna layer B.
  • the parasitic radiating layer A2 may be the third conductive layer L3.
  • the parasitic radiation layer A2 is located on a side of the main radiation layer A1 away from the second antenna layer B.
  • the parasitic radiation layer A2 may be the first conductive layer L1.
  • the parasitic radiation layer A2 has at least two layers. At least two of the parasitic radiation layers A2 are respectively located on opposite sides of the main radiation layer A1. That is, at least two layers of the parasitic radiation layer A2 are respectively located between the main radiation layer A1 and the second antenna layer B and on the side of the main radiation layer A1 away from the second antenna layer B.
  • the parasitic radiating layer A2 may be the first conductive layer L1 and the third conductive layer L3.
  • the parasitic radiation layer A2 includes at least one parasitic radiation unit 17.
  • the parasitic radiation unit 17 includes at least two parasitic radiation patches 170 symmetrically and spaced apart. Each of the parasitic radiation patches 170 is arranged opposite to one of the main radiation patches 110.
  • the number of parasitic radiation units 17 may be the same as the number of main radiation units 11.
  • Each parasitic radiation unit 17 faces a main radiation unit 11.
  • the parasitic radiation patch 170 is not electrically connected to the first conductive member 15.
  • the number of parasitic radiation patches 170 in one parasitic radiation unit 17 is the same as the number of main radiation patches 110 in one main radiation unit 11.
  • each parasitic radiation unit 17 has 4 parasitic radiation patches 170.
  • the shape of the parasitic radiation patch 170 may be triangle, rectangle, square, diamond, circle, ring, and similar figures of the above-mentioned several shapes.
  • the shapes of the multiple parasitic radiation patches 170 in one parasitic radiation unit 17 may be the same or different.
  • the shape of the parasitic radiation patch 170 is the same as or different from the shape of the corresponding main radiation patch 110.
  • the parasitic radiation patch 170 and the main radiation patch 110 have the same shape as an example for description.
  • the parasitic radiation patch 170 is coupled with the main radiation patch 110, thereby changing the current intensity on the surface of the main radiation patch 110, thereby improving the impedance matching of the antenna unit 1, thereby increasing the gain, and also It is beneficial to broaden the impedance bandwidth of the antenna unit 1; by reasonably adjusting the size of the parasitic radiation patch 170, the impedance bandwidth of the antenna unit 1 can be adjusted.
  • the feeder portion 12 may not only be provided in the gap between the main radiation patches 110, but also may be at least partially located in the gap between two adjacent parasitic radiation patches 170.
  • the gap formed between the parasitic radiation patches 170 is substantially the same as the gap formed between the main radiation patches 110.
  • the parasitic radiation layer A2 and the main radiation layer A1 may be on the same layer, and a plurality of parasitic radiation patches 170 of a parasitic radiation unit 17 are surrounded by a main radiation unit 11 side.
  • one main radiation unit 11 has four main radiation patches 110
  • one parasitic radiation unit 17 includes four parasitic radiation patches 170.
  • Four parasitic radiation patches 170 sequentially surround the peripheral side of one main radiation unit 11, and each parasitic radiation patch 170 is opposite to one main radiation patch 110.
  • the edge of at least one parasitic radiation patch 170 of the parasitic radiation unit 17 has at least one second notch 171 or at least one second protrusion 172.
  • the opening of the second notch 171 faces the outside of the parasitic radiation unit 17.
  • This embodiment is similar to the embodiment in which the edge of the main radiating patch 110 in the main radiating unit 11 is provided with the first notch portion 113.
  • FIGS. 15-17 please refer to the embodiments in FIGS. 15-17.
  • the edge of the parasitic radiation patch 170 is provided with a second protrusion 172.
  • This embodiment is similar to the implementation of the first protrusion 314 on the edge of the main radiation patch 110 in the main radiation unit 11
  • the manner is similar, and for details, reference may be made to the implementation manner in FIG. 19.
  • the second notch 171 communicates with the gap between the two adjacent parasitic radiation patches 170, and a part of the feeder 12 extends into the second notch 171.
  • This embodiment is similar to the embodiment in which the edge of the main radiating patch 110 in the main radiating unit 11 is provided with the first notch 113.
  • FIG. 18 please refer to the embodiment in FIG. 18.
  • a through hole is provided on the layer where the parasitic radiation unit 17 is located, and the through hole is directly opposite to the first conductive member 15. Wherein, these through holes are formed when the first conductive member 15 is processed on the whole plate, and it does not mean that the parasitic radiation unit 17 is electrically connected to the first conductive member 15.
  • the first antenna layer A further includes a bearing layer.
  • the supporting layer is arranged between the main radiating layer A1 and the second antenna layer B or on the side of the main radiating layer A1 away from the second antenna layer B.
  • the carrier layer may be the third conductive layer L3 or the first conductive layer L1.
  • the parasitic radiation layer A2 may be a carrier layer, or may be another layer independent of the carrier layer.
  • the parasitic radiating layers A2 can be provided on the same side of the main radiating layer A1 as the carrier layer, or on opposite sides of the main radiating layer A1, which is not limited in this application.
  • Both the first feeder portion 121 and the second feeder portion 122 are elongated.
  • the placement positions of the first feeder portion 121 and the second feeder portion 122 include but are not limited to the following embodiments:
  • all of the first feeder portions 121 are provided in the first gap 111 of the main radiating layer A1, and a part of the second feeder portions 122 are provided in the first gap 111 In the two gaps 112, another part of the second feeder portion 122 is provided on the carrier layer and is electrically connected to the second feeder portion 122 provided in the second gap 112.
  • the supporting layer is the third conductive layer L3.
  • the first feeder portion 121 is at least partially located in the first gap 111 of the second conductive layer L2.
  • the second feeder portion 122 includes two opposite end portions 122a and 122b and a middle portion 122c connected between the two end portions 122a and 122b.
  • the two end portions 122a and 122b are located on the second conductive layer L2 and are located on opposite sides of the first feeding line portion 121, respectively.
  • the middle portion 122c of the second feeder portion 122 is disposed on the carrier layer (that is, the third conductive layer L3), and the two end portions 122a, 122b are electrically connected to each other through a first conductive via (shielded).
  • the opposite ends of the middle portion 122c of the second feeder portion 122 are described.
  • the first conductive via is arranged along the Z-axis direction.
  • the bridging form adopted by the first feeder portion 121 and the second feeder portion 122 effectively improves the isolation of the antenna unit 1 and reduces the use of the traditional antenna unit 1.
  • the complexity of the laminated structure simplifies the structure of the antenna module 10.
  • all the first feeder portions 121 are provided in the first gap 111, and all the second feeder portions 122 are provided on the carrier layer.
  • the supporting layer is the third conductive layer L3.
  • all of the second feeders 122 are provided in the second gap 112, and a part of the first feeders 121 are provided in the first gap 111, and another part of the first feeders
  • the portion 121 is disposed on the carrier layer and is electrically connected to the first feeder portion 121 disposed in the first gap 111.
  • all the second feeder portions 122 are provided in the second gap 112, and all the first feeder portions 121 are provided on the carrier layer.
  • the carrier layer is a parasitic radiation layer A2.
  • the two end portions 122a, 122b of the second feeder portion 122 are located on the second conductive layer L2 and are respectively located on the first feeder line. Opposite sides of section 121.
  • the middle portion 122c of the second feeder portion 122 is disposed on the first conductive layer L1.
  • the first feeder portion 121 includes a main body portion 125 and at least one extension portion 126 connected to the main body portion 125.
  • the main body 125 is disposed in the first gap 111.
  • the extension 126 is located on the carrying layer (third conductive layer L3).
  • the orthographic projection of the main body portion 125 on the carrier layer at least partially covers the extension portion 126.
  • the extension portion 126 is electrically connected to the main body portion 125 through the second conductive via 127.
  • the number of the extension portions 126 is multiple, the multiple extension portions 126 are stacked along the Z-axis direction, and two adjacent extension portions 126 are electrically connected through the second conductive via 127.
  • the second feeder 122 can also be improved as described above, which will not be repeated here.
  • the extension portion 126 and the second conductive via 127 are equivalent to the introduction of reactance, not only can adjust the first feeder portion 121
  • the impedance, thereby improving the impedance matching of the antenna unit 1, can also adjust the frequency corresponding to the modal generated by the antenna unit 1 by changing the height and the number of the second conductive vias 127.
  • the middle portion 122c of the second feeder portion 122 includes a first edge block 211, a middle block 212, and a second edge block 213 that are connected in sequence.
  • the extending direction of the intermediate block 212 is the same as the extending direction of the second gap 112.
  • the extending direction of the first edge block 211 and the second edge block 213 is the same as the extending direction of the first gap 111.
  • the orthographic projection of the first feeder portion 121 on the carrier layer is located between the first edge block 211 and the second edge block 213.
  • the middle portion 122c of the second feeder portion 122 is H-shaped.
  • the structure of the second feeder portion 122 is improved to introduce reactance, which can not only adjust the impedance of the second feeder portion 122, thereby improving the impedance matching of the antenna unit 1, but also
  • the frequency corresponding to the modal generated by the antenna unit 1 can be adjusted by changing the sizes of the first edge block 211, the middle block 212, and the second edge block 213.
  • the second conductive member 16 is electrically connected to the first end 121 a of the first feeder portion 121 and one end of the microstrip line 14.
  • the second end 121 b of the first feeder portion 121 is opposite to the first end 121 a of the first feeder portion 121.
  • the second end 121b of the first feeder portion 121 and the first end 121a of the first feeder portion 121 may be about the center of symmetry of the main radiating patch 110 (the geometric center of the main radiating unit 11) symmetry.
  • the distance between the first end 121a of the first feeder portion 121 and the center of symmetry of the main radiation patch 110 is equal to the distance between the second end 121b of the first feeder portion 121 and the main radiation patch 110 The distance between the centers of symmetry.
  • the distance between the first end 121a of the first feeder portion 121 and the center of symmetry of the main radiating patch 110 is greater than the second end of the first feeder portion 121 The distance between 121b and the center of symmetry of the main radiation patch 110.
  • the connection between the first feeder portion 121 and the second conductive member 16 is defined as the first coupling point 131, and the distance between the first coupling point 131 and the geometric center of the main radiating unit 11 is greater than that of the first feeder portion 121 The distance between the second end 121b and the center of symmetry of the main radiation patch 110.
  • connection between the second feeder portion 122 and the second conductive member 16 is defined as the second coupling point 132, and the distance between the second coupling point 132 and the geometric center of the main radiating unit 11 is greater than the first coupling point 132.
  • the distance between the first coupling point 131 and the second coupling point 132 in this embodiment is larger, so that the influence of the operation of the first feeder portion 121 and the second feeder portion 122 is smaller. Further increase the isolation between the first feeder portion 121 and the second feeder portion 122 during operation.
  • both the first feeder portion 121 and the second feeder portion 122 are elongated.
  • the orthographic projections of the middle portion 121c of the first feeder portion 121 and the middle portion 122c of the second feeder portion 122 on the main radiating layer A1 overlap.
  • the width of the middle portion 121c of the first feeder portion 121 in the first direction is smaller than the width of the two end portions 121a, 121b of the first feeder portion 121 in the first direction, and/or,
  • the width of the middle portion 122c of the second feeder portion 122 in the second direction is smaller than the width of the two end portions 122a, 122b of the second feeder portion 122 in the second direction.
  • the first direction is the extension direction of the second gap 112
  • the second direction is the extension direction of the first gap 111.
  • the part where the projections of the first feeder portion 121 and the second feeder portion 122 overlap are set to be relatively thin, so as to adjust the impedance of the first feeder portion 121 and the second feeder portion 122, so as to adjust the antenna unit 1 as needed.
  • the impedance matching of the frequency point is set to be relatively thin, so as to adjust the impedance of the first feeder portion 121 and the second feeder portion 122, so as to adjust the antenna unit 1 as needed.
  • FIG. 33 is the antenna module 10 provided in the fourth embodiment of the present application.
  • the structure of the antenna module 10 provided in this embodiment is substantially the same as that of the third embodiment.
  • the main difference is that the arrangement of the power feeding parts of each main radiating unit 11 is different.
  • the at least one main radiating unit 11 includes a third main radiating unit 11c, a first main radiating unit 11a, and a second main radiating unit 11c, which are sequentially arranged along the Y-axis direction.
  • the radiation unit 11b and the fourth main radiation unit 11d are sequentially arranged along the Y-axis direction.
  • the connection point between the first feeder portion 121 coupled to the first main radiating unit 11 a and the second conductive member 16 is a first feed point 128.
  • the connection point between the first feeder portion 121 coupled to the second main radiating unit 11 b and the second conductive member 16 is a second feed point 129.
  • the distance between the first feeding point 128 and the second feeding point 129 is greater than the distance between the geometric center of the first main radiating unit 11a and the geometric center of the second main radiating unit 11b.
  • the first feeding point 128 is located at the upper left corner of the feeder section 12, and the second feeding point 129 is located at the lower left corner of the feeder section 12.
  • the first feeding point 128 and the second feeding point The spacing between 129 is as large as possible, so that the coupling between the first feeding point 128 and the second feeding point 129 is reduced and the isolation is improved.
  • connection between the first feeder portion 121 coupled to the third main radiating unit 11c and the second conductive member 16 is located at the upper left, and the first feeder portion 121 coupled to the fourth main radiating unit 11d The connection with the second conductive member 16 is located at the lower left. In this way, the distance between the feeding points of each main radiating unit 11 is increased as much as possible to increase the isolation.
  • the connection point between the second feeder portion 122 coupled to the first parasitic radiating unit 17a (opposite to the first main radiating unit 11a) and the second conductive member 16 As the third feeding point 214, the connection point between the second feeding line portion 122 coupled to the second parasitic radiating unit 17 b (opposite to the second main radiating unit 11 b) and the second conductive member 16 is defined as the fourth feeding point 215.
  • the distance between the third feeding point 214 and the fourth feeding point 215 is greater than the distance between the geometric center of the first parasitic radiation patch 170 and the geometric center of the second parasitic radiation patch 170.
  • the third feeding point 214 is located at the upper right corner of the feeder section 12, and the fourth feeding point 215 is located at the lower right corner of the feeder section 12.
  • the third feeding point 214 and the fourth feeding point The spacing between 215 is as large as possible, so that the coupling between the third feeding point 214 and the fourth feeding point 215 is reduced, and the isolation is improved.
  • connection point between the second feeder portion 122 coupled to the third parasitic radiating unit 17 and the second conductive member 16 is located at the upper right, and the second feeder portion 122 coupled to the fourth parasitic radiating unit 17 The connection point with the second conductive member 16 is located at the lower right. In this way, the distance between the feeding points of each parasitic radiating unit 17 is increased as much as possible to increase the isolation.
  • the second antenna layer B further includes a first metal retaining wall 31 and a second metal retaining wall 32 disposed oppositely.
  • the first metal retaining wall 31 and the second metal retaining wall 32 are both located between the main radiation unit 11 and the reference ground 13.
  • the first metal retaining wall 31 and the second metal retaining wall 32 both extend along the direction in which the main radiation units 11 are arranged.
  • the first metal retaining wall 31 and the second metal retaining wall 32 are respectively close to two opposite edges of the antenna module 10.
  • the orthographic projection of the main radiating unit 11 (or the parasitic radiating unit 17) on the second antenna layer B partially covers between the first metal retaining wall 31 and the second metal retaining wall 32.
  • first metal retaining wall 31 and the second metal retaining wall 32 are both located on the fourth conductive layer L4.
  • the first metal retaining wall 31 and the second metal retaining wall 32 are respectively provided on the edge of the fourth conductive layer L4.
  • the first metal retaining wall 31 may be a row of metal vias, which pass through the reference ground 13 of the fifth conductive layer L5, so that the first metal retaining wall 31 is electrically connected to the reference ground 13.
  • the first metal retaining wall 31 may also be a thin metal sheet.
  • the structure of the second metal retaining wall 32 can refer to the structure of the first metal retaining wall 31, which will not be repeated here.
  • the first metal retaining wall 31 and the second metal retaining wall 32 both form electromagnetic wave reflection walls, which are used to change the current distribution on the main radiating unit 11 to make the electric field shape more concentrated, thereby increasing the gain.
  • the second antenna layer B further includes at least one third metal retaining wall 33.
  • the third metal retaining wall 33 is located between the orthographic projections of the two adjacent main radiating units 11 (or parasitic radiating units 17) on the second antenna layer B.
  • the third metal retaining wall 33 may be located on the fourth conductive layer L4, and the third metal retaining wall 33 may be located on the positive side of the two adjacent main radiation units 11 (or parasitic radiation units 17) on the fourth conductive layer L4. Between projections, the third metal retaining wall 33 is used as an isolation retaining wall between two adjacent main radiating units 11, so as to improve the isolation between two adjacent main radiating units 11.
  • the third metal retaining wall 33 may be elongated on the XY plane and extending along the X axis direction, and both ends of the third metal retaining wall 33 are electrically connected to the first metal retaining wall 31 and the second metal retaining wall, respectively. Wall 32.
  • the third metal retaining wall 33 may include a first retaining wall 331 and a second retaining wall 332, and the first retaining wall 331 and the second retaining wall 332 may be elongated in the XY plane. And extend along the X-axis direction.
  • the first retaining wall 331 is electrically connected to the first metal retaining wall 31 and is spaced apart from the second metal retaining wall 32.
  • the second retaining wall 332 is electrically connected to the second metal retaining wall 32 and is spaced apart from the first metal retaining wall 31.
  • the first retaining wall 331 and the second retaining wall 332 overlap in the Y-axis direction but are arranged at intervals.
  • the third metal retaining wall 33 is in the shape of an "H” turned 90° on the X-Y plane. Among them, a plurality of "H" shapes are arranged along the Y-axis direction.
  • the third metal retaining wall 33 of the "H" shape that is turned 90° By arranging the third metal retaining wall 33 of the "H" shape that is turned 90°, not only the isolation between the adjacent main radiating units 11 can be increased, but also the third metal retaining wall 33 can make full use of the space between the main radiating units 11 Space.
  • the third metal retaining wall 33 includes at least two metal blocks 333 spaced apart. Take the number of metal blocks 333 as four for illustration. Among them, two metal blocks 333 are electrically connected to the first metal retaining wall 31 and the second metal retaining wall 32, and are both close to opposite sides of a main radiating patch 110 in one main radiating unit 11; the other two metal blocks The blocks 333 are electrically connected to the first metal barrier wall 31 and the second metal barrier wall 32 respectively, and both are close to opposite sides of a main radiation patch 110 of the other main radiation unit 11.
  • the metal block 333 may include a first metal sheet 333a and a first metal sheet 333b arranged in layers, wherein the first metal sheet 333a and the first metal sheet 333b are arranged in layers along the Z-axis direction And, the two are electrically connected through the metal via 333c.
  • the material of the first metal retaining wall 31, the second metal retaining wall 32 and the third metal retaining wall 33 may be the same, and the same as the material of the reference ground 13.
  • FIG. 41 is a graph of the input return loss (S11) and frequency of the antenna module according to the first embodiment of the application.
  • point C corresponding to frequency f1 is the resonance point generated by the electric dipole
  • point D corresponding to frequency f2 is the resonance point generated by the matching network
  • point E corresponding to frequency f3 is the resonance point generated by the magnetic dipole
  • frequency f4 The corresponding point F is the resonance point generated by the matching network. It can be seen that the matching network provided by the embodiment of the present application can widen the bandwidth of the electric dipole and the magnetic dipole.
  • point C can also correspond to f2
  • point D at this time corresponds to f1
  • E point can correspond to f4
  • F point corresponds to f3 at this time.
  • the frequency f0-f5 is the bandwidth widened after the matching network acts on the electric dipole.
  • the combination of the electric dipole and the magnetic dipole can increase the bandwidth of the antenna module 10.
  • the antenna module 10 provided by the embodiment of the present application combines an electric dipole and a magnetic dipole to obtain a magnetoelectric dipole, which improves the antenna bandwidth and reduces the thickness of the antenna module 10, and can be flexibly used in various communications Products; by setting the microstrip line 14 between the feeder part 12 and the radio frequency transceiver chip 2, by designing the length of the microstrip line 14, the impedance can be adjusted, and then the impedance matching of the antenna unit 1 at the operating frequency point can be adjusted, by changing the microstrip line
  • the headroom size around the tip 141 of the strip line 14 is optimized to optimize the impedance mismatch caused by the discontinuity of the vertical interconnect via impedance, thereby improving the transmission loss; the rotating magnetoelectric dipole antenna unit 1 is used to improve Scanning loss; the antenna gain is improved by the double-layer parasitic radiating element 17, so that the antenna size is reduced without sacrificing the gain of the antenna; by increasing the distance between the feeding points of two adjacent antenna elements 1 , In order to improve the isolation of

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

本申请提供了一种能够提高工作带宽及降低扫描损耗的天线模组及电子设备。天线模组包括第一天线层、第二天线层、至少一个第一导电件及至少一个第二导电件。第一天线层包括至少一个主辐射单元及至少一个馈线部，主辐射单元包括至少两个对称且相间隔设置的主辐射贴片，馈线部位于或对应于相邻的两个主辐射贴片之间的间隙。第二天线层与第一天线层层叠设置，第二天线层包括参考地及至少一个微带线，参考地与主辐射贴片相对设置，微带线与参考地绝缘设置。第一导电件电连接主辐射贴片和参考地；微带线的一端用于电连接射频收发芯片；第二导电件的一端电连接馈线部，另一端电连接微带线的另一端。

Description

天线模组及电子设备 技术领域
本申请涉及电子技术领域，具体涉及一种天线模组及电子设备。
背景技术
电子设备内设有用于通讯的天线模组。如何提高天线模组的工作带宽及降低扫描损耗，提高天线模组的传输效率，成为需要解决的问题。
发明内容
本申请提供了一种能够提高工作带宽、降低扫描损耗及提高传输效率的天线模组及电子设备。
本申请提供的一种天线模组，包括：
第一天线层，所述第一天线层包括至少一个主辐射单元及至少一个馈线部，所述主辐射单元包括至少两个对称且相间隔设置的主辐射贴片，所述馈线部位于或对应于相邻的两个所述主辐射贴片之间的间隙，所述馈线部与所述主辐射贴片电连接或耦合连接；
第二天线层，与所述第一天线层层叠设置，第二天线层包括参考地及至少一个微带线，所述参考地与所述主辐射贴片相对设置，所述射频收发芯片设于所述参考地背离所述主辐射贴片的一侧；所述微带线设于所述参考地所在层、所述参考地与所述主辐射贴片之间或所述参考地背离所述主辐射贴片的一侧，且与所述参考地绝缘设置，所述微带线的一端电连接所述射频收发芯片；
至少一个第一导电件，所述第一导电件电连接所述主辐射贴片和所述参考地；及
至少一个第二导电件，所述第二导电件的一端电连接所述馈线部，另一端电连接所述微带线的另一端。
本申请还提供了一种电子设备，包括上述的天线模组。
本实施例提供的天线模组，通过设计天线模组的结构，主辐射贴片与馈线部形成电偶极子，主辐射贴片、第一导电件、馈线部及参考地构成磁偶极子，使天线模组为电偶极子与磁偶极子相结合，能够实现较宽的频带，在整个工作频段能获得稳定的增益和方向图，兼顾其带宽、隔离度、交叉极化、增益等特性；通过在馈线部与射频收发芯片之间设置微带线，通过设置微带线的长度和微带线与参考地之间的间距调节主辐射单元的阻抗，进而调整天线单元在工作频点处的阻抗匹配，实现宽频带、小型化的天线模组。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例一提供的一种电子设备的结构示意图；
图2是图1的电子设备的结构拆分示意图；
图3是图2中的另一种天线模组安装于主板的示意图；
图4是图2中的再一种天线模组安装于主板的示意图；
图5是图2中的天线模组的侧视图；
图6是图5中的第一导电层、第二导电层、第三导电层、第四导电层、第五导电层及第六导电层平铺在同一平面的结构示意图；
图7是图6中的第二导电层及第三导电层平铺在同一平面的结构示意图；
图8是图6中的第一天线层、第五导电层及第六导电层的拆分结构图；
图9是图6中的第一种微带线的结构示意图；
图10是图6中的第二种微带线的结构示意图；
图11是图6中的第三种微带线的结构示意图；
图12是本申请实施例提供的第五导电层的局部放大示意图。
图13是本申请实施例二提供的天线模组中第一导电层、第二导电层、第三导电层、第四导电层、第五导电层及第六导电层平铺在同一平面的结构示意图；
图14是本申请实施例一提供的主辐射贴片的第一种结构示意图；
图15是本申请实施例一提供的主辐射贴片的第二种结构示意图；
图16是本申请实施例一提供的主辐射贴片的第三种结构示意图；
图17是本申请实施例一提供的主辐射贴片的第四种结构示意图；
图18是本申请实施例一提供的主辐射贴片的第五种结构示意图；
图19是本申请实施例一提供的主辐射贴片的第六种结构示意图；
图20是本申请实施例一提供的一种主辐射层的结构示意图；
图21是本申请实施例二提供的寄生辐射贴片的第一种结构示意图；
图22是本申请实施例二提供的寄生辐射贴片的第二种结构示意图；
图23是本申请实施例二提供的寄生辐射贴片的第三种结构示意图；
图24是本申请实施例二提供的寄生辐射贴片的第四种结构示意图；
图25是本申请实施例三提供的天线模组中第一导电层、第二导电层、第三导电层、第四导电层、第五导电层及第六导电层平铺在同一平面的结构示意图；
图26是本申请实施例一提供的馈线部的第一种结构示意图；
图27是本申请实施例一提供的馈线部的第二种结构示意图；
图28是本申请实施例一提供的馈线部的第三种结构示意图；
图29是本申请实施例一提供的馈线部的第四种结构示意图；
图30是本申请实施例一提供的馈线部的第五种结构示意图；
图31是本申请实施例一提供的馈线部的第六种结构示意图；
图32是本申请实施例一提供的馈线部的第七种结构示意图；
图33是本申请实施例四提供的天线模组中第一导电层、第二导电层、第三导电层、第四导电层、第五导电层及第六导电层平铺在同一平面的结构示意图；
图34是图33中第二导电层、第三导电层的结构示意图。
图35是本申请实施例一提供的金属挡墙的第一种示意图；
图36是本申请实施例一提供的金属挡墙的第二种结构示意图；
图37是本申请实施例一提供的金属挡墙的第三种结构示意图；
图38是本申请实施例一提供的金属挡墙的第四种结构示意图；
图39是本申请实施例一提供的金属挡墙的第五种结构示意图；
图40是图39提供的金属挡墙的侧视图；
图41是本申请实施例一提供的天线模组的输入回波损耗(S11)与频率的曲线图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。本申请所列举的实施例之间可以适当的相互结合。
请参照图1，图1为本申请实施例提供的一种电子设备的结构示意图。电子设备100可以为电话、电视、平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、耳机、手表、可穿戴设备、基站、车载雷达、客户前置设备(Customer Premise Equipment，CPE)等能够收发电磁波信号的设备。本申请以电子设备100是手机为例进行说明。
需要说明的是，在本申请的实施例中，相同的附图标记表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。可理解的，附图示出的本申请实施例中的各种部件的厚度、长宽等尺寸仅为示例性说明，而不应对本申请构成任何限定。
请参照图2，图2为本申请实施例提供的一种电子设备100的结构拆分示意图。电子设备100还包括依次固定配合连接的显示屏101、中框102及电池盖103。电子设备100还包括设于显示屏101、中框102及电池盖103三者包围形成的内部空间中的天线模组10、电池104、主板105、摄像头106、小板107、麦克风、受话器、扬声器、人脸识别模组、指纹识别模组等等能够实现手机的基本功能的器件，在本实施例中不再赘述。本申请对于天线模组10在电子设备100中的位置不做具体的限定。
请参照图2，天线模组10的至少部分设于主板105上或电连接主板105。可选的，天线模组10通过一个BTB(Board-to-Board)连接器直接与主板105上的另一个BTB连接器电连接。在图2中，天线模组10上的BTB连接器和主板105上的BTB连接器被遮挡，故未显示。
可选的，请参阅图3，天线模组10还可以通过柔性电路板108与主板105电连接。具体的，该柔性电路板108的一端设有一个BTB连接器181，该BTB连接器181电连接天线模组10。该柔性电路板108的另一端设有另一个BTB连接器182，该BTB连接器182电连接主板105。
可选的，请参阅图3，天线模组10可以平行于电池盖103设置(即天线模组10与主板105相对设置)；或者，请参阅图4，天线模组10可以垂直于电池盖103设置，进一步地，天线模组10可以位于电池104或主板105的侧面。在其他实施方式中，天线模组10还可以与主板105具有一定的倾斜角。
天线模组10用于收发预设频段的电磁波信号。预设频段至少包括从1G以下的频段、1G到5G的sub-6GHz频段、毫米波频段、亚毫米波频段、太赫兹波频段中的至少一者。本实施例以预设频段是毫米波频段为例进行说明，后续不再赘述。其中，毫米波频段的频率范围是24.25GHz～52.6GHz。3GPPRelease 15版本规范了目前5G毫米波频段如下：n257(26.5～29.5GHz)，n258(24.25～27.5GHz)，n261(27.5～28.35GHz)和n260(37～40GHz)。
请参照图5，本申请实施例一提供的天线模组10包括至少一个天线单元1及射频收发芯片2。本实施例中，以天线单元1为4个为例进行说明。4个天线单元1沿1列*4行排列。当然，在其他实施方式中，天线单元1的数量可以为8个，并沿2列*4行排列；或者，天线单元1的数量可以为16个，并沿4列*4行排列。可以理解的，4个天线单元1互连为一体。换言之，4个天线单元1可以设于同一个承载基板上，形成一个硬质电路板或柔性电路板。
为了便于描述，以天线模组10处于第一视角为参照进行定义，天线模组10的宽度方向定义为X轴 方向，天线模组10的长度方向定义为Y轴方向，天线模组10的厚度方向定义为Z轴方向。天线模组10的宽度尺寸小于天线模组10的长度尺寸。箭头所指示的方向为正向。本实施例中，4个天线单元1沿Y轴方向排列。
以下结合附图对于天线单元1的结构进行举例说明。
请参照图5，所述天线单元1包括层叠设置的第一保护层F1、第一导电层L1、第一板材层S1、第二导电层L2、第二板材层S2、第三导电层L3、第三板材层S3、第四导电层L4、第四板材层S4、第五导电层L5、第五板材层S5、第六导电层L6及第二保护层F2。当然，在其他实施方式中，导电层的数量可以为5层、7层等等。
本实施例中，请参照图5，第一保护层F1、第一导电层L1、第一板材层S1、第二导电层L2、第二板材层S2、第三导电层L3、第三板材层S3定义为第一天线层A，第四导电层L4、第四板材层S4、第五导电层L5、第五板材层S5、第六导电层L6及第二保护层F2定义为第二天线层B。第一天线层A与第二天线层B层叠设置。
其中，第一导电层L1、第二导电层L2、第三导电层L3、第四导电层L4、第五导电层L5、第六导电层L6的组成材质可以为导电性能较好的金属。其中，这六个导电层的材质可以皆为铜或铝。本实施例中以这六个导电层的材质为铜进行举例说明。换言之，这六个导电层皆为铜箔层。其中，每一层铜箔层的形状可以相同或不同。第一板材层S1、第二板材层S2、第三板材层S3、第四板材层S4、第五板材层S5的材质皆为绝缘材质，这些板材层作为导电层的承载板，还用于使得相邻的两个导电层之间相互绝缘。本实施例主要对第一导电层L1至第六导电层L6进行具体的描述。
请参照图6，所述第一天线层A包括至少一个主辐射单元11及至少一个馈线部12。所述第一天线层A包括主辐射层A1，所述主辐射单元11设于所述主辐射层A1，所述馈线部12可以部分设于所述主辐射层A1或全部设于所述主辐射层A1外。
请参照图6，所述主辐射单元11设于第二导电层L2(第一导电层L1将在后续描述)。所述主辐射单元11包括至少两个对称且相间隔设置的主辐射贴片110。主辐射贴片110为天线模组10接收(或发射)电磁波信号的接收端(或发射端)。其中，主辐射贴片110的材质为导电材质，具体的，主辐射贴片110的材质包括但不限于金属、导电塑料、导电聚合物、导电氧化物等。采用平面贴片的形式印刷在板材上，加工简单、成本较低。
本实施例对于主辐射贴片110的形状不做具体的限定，例如，主辐射贴片110的形状可以为矩形、扇形、三角形、圆形、环形、十字形等等。本实施例以主辐射贴片110的形状大致呈矩形为例进行说明。
本申请对于一个主辐射单元11中的主辐射贴片110的数量不做具体的说明，例如，一个主辐射单元11中的主辐射贴片110的数量可以为两个、三个、四个、六个、八个等等。本申请以主辐射贴片110的数量为四个进行举例说明。四个主辐射贴片110呈中心对称设置。换言之，每个主辐射贴片110占据一个象限的空间，四个主辐射贴片110占据平面上的四个象限。
可以理解的，四个主辐射贴片110的形状可以相同或不同。本申请不做具体的限定。本实施例以四个主辐射贴片110的形状皆相同为例进行说明。
请参照图7，四个主辐射贴片110之间形成大致呈十字形相交的第一间隙111和第二间隙112。具体的，定义四个主辐射贴片110为第一主辐射贴片110a、第二主辐射贴片110b、第三主辐射贴片110c、第四主辐射贴片110d。第一间隙111沿X轴方向延伸，第二间隙112沿Y轴方向延伸。
请参照图7，所述馈线部12位于或对应于相邻的两个所述主辐射贴片110之间的间隙(包括第一间隙111和第二间隙112)。所述馈线部12与所述主辐射贴片110电连接或耦合连接，以将激励信号传递至主辐射贴片110。本申请以馈线部12与主辐射贴片110相耦合为例进行说明。馈线部12与主辐射贴片110间隔设置。
多个主辐射贴片110、馈线部12形成电偶极子。
本实施例中，请参照图7，馈线部12包括第一馈线部121和第二馈线部122。第一馈线部121和第二馈线部122在第二导电层L2上的正投影相交。第一馈线部121和第二馈线部122相互绝缘。第一馈线部121位于或对应于第一间隙111设置。第一馈线部121可以对其一侧的第一主辐射贴片110a、第二主辐射贴片110b和对其另一侧的第三主辐射贴片110c、第四主辐射贴片110d进行馈电。第二馈线部122位于或对应于第二间隙112设置。第二馈线部122可以对其一侧的第一主辐射贴片110a、第三主辐射贴片110c和对其另一侧的第四主辐射贴片110d、第二主辐射贴片110b进行馈电。可以理解的，第一馈线部121和第二馈线部122皆为导电材质，包括但不限于金属、导电塑料、导电聚合物、导电氧化物等。
通过设置第一馈线部121和第二馈线部122相互正交放置，第一馈线部121对其两侧的两对主辐射贴片110进行馈电，第二馈线部122对其两侧的两对主辐射贴片110进行馈电，以实现两种极化方式，可有效地提高通信容量、收发同工、抵抗多径衰弱。本实施例中，第一馈线部121位于第一间隙111中，第二馈线部122的一部分位于第一间隙111中，第二馈线部122在第二导电层L2上的正投影与第一馈线部121的正投影相重合的部分位于第二间隙112中。
请参照图6，第二天线层B包括参考地13及至少一个微带线14。
请参照图6，参考地13可位于第四导电层L4、第五导电层L5或第六导电层L6中的任意一层或多层。本实施例中，参考地13位于第五导电层L5和第六导电层L6。具体的，第五导电层L5和第六导电 层L6皆具有大面积的铜箔。第五导电层L5与第六导电层L6通过若干导电过孔电连接，以使第五导电层L5和第六导电层L6的电势相同。导电过孔包括贯穿第五导电层L5、第五板材层S5的通孔及在通孔的内壁上设有导电涂层。该导电涂层的材质可以与第五导电层L5的材质相同。该导电涂层电连接第五导电层L5和第六导电层L6。
所述参考地13与所述主辐射贴片110相对设置。其中，参考地13可覆盖多个主辐射单元11。换言之，多个主辐射单元11共用一个参考地13。
请参照图6及图8，天线单元1还包括至少一个第一导电件15。所述第一导电件15电连接所述主辐射贴片110和所述参考地13。具体的，本实施例中，第一导电件15为导电过孔。第一导电件15的延伸方向沿Z轴方向。第一导电件15的数量为主辐射贴片110的数量相同。本实施例中，第一导电件15的数量为4个。每个第一导电件15电连接一个主辐射贴片110。第一导电件15与主辐射贴片110的连接处为主辐射贴片110靠近主辐射单元11的几何中心的位置。
如此，多个主辐射贴片110、多个第一导电件15、馈线部12及参考地13构成磁偶极子，以辐射电磁波信号。
本申请对于微带线14的位置不做具体的限定，例如，微带线14可以位于所述参考地13所在层、所述参考地13与所述主辐射贴片110之间或所述参考地13背离所述主辐射贴片110的一侧。换言之，微带线14可以位于第四导电层L4、第五导电层L5及第六导电层L6中的任意一层。本实施例中，微带线14位于第五导电层L5。
可以理解的，请参照图6及图9，微带线14的材质为导电材质，例如铜。所述微带线14与所述参考地13绝缘设置。具体的，第五导电层L5上设有大面积的铜箔作为参考地13。第五导电层L5上还设有被参考地13包围的镂空部130。镂空部130为空置区。微带线14设于镂空部130，通过调节微带线14与参考地13之间的间距及微带线14的长度，可以调节微带线14与参考地13之间形成的阻抗，调整天线单元1在工作频点处的阻抗匹配。换言之，微带线14形成天线单元10的匹配网络。
本申请对于微带线14的结构不做具体的限定。
举例而言，请参阅图9，所述微带线14包括两个相对设置的端头部141及连接在两个所述端头部141之间的中间段142。
可选的，请参阅图9，中间段142在其延伸方向上的线宽相等。换言之，中间段142的线宽均匀。当中间段142的一部分沿Y轴方向延伸时，则这部分的中间段142沿X轴方向的宽度尺寸为这部分的中间段142的线宽。当中间段142的一部分沿X轴方向延伸时，则这部分的中间段142沿Y轴方向的宽度尺寸为这部分的中间段142的线宽。中间段142的线宽小于两个端头部141的宽度。本实施方式中，由于中间段142的线宽均匀，便于通过控制中间段142的长度来控制微带线14的阻抗。
在另一实施方式中，请参阅图10，中间段142在其延伸方向上的线宽可以不相等，具体的，中间段142包括在延伸方向上互连为一体的至少一个本体部146及至少一个加宽部144。所述加宽部144的线宽大于所述本体部146的线宽。本实施方式中，通过分别调节加宽部144的长度和本体部146的长度，可以调节整个微带线14的阻抗。此外，相较于均匀线宽的微带线14，通过设置加宽部144，可以在微带线14的阻抗一定的情况下，减小微带线14的长度。
在再一实施方式中，请参阅图11，所述微带线14还包括至少一个分支145。每个所述分支145的一端电连接中间段142。每个分支145的另一端为开路。所述分支145朝向相对于所述中间段142倾斜或垂直的方向延伸。通过设置分支145可以在不增加微带线14的整体长度下，调节微带线14的阻抗，从而调节天线单元1在工作频点的阻抗匹配。
以上为本申请可采用的几种不同形式的微带线14，通过调节微带线14的结构、微带线14与参考地13之间的间距及微带线14的长度，可以调节微带线14与参考地13之间形成的阻抗，调整天线单元1在工作频点处的阻抗匹配。
请参阅图12，所述端头部141与所述参考地13之间的间距大于所述中间段142与所述参考地13之间的间距。其中，端头部141周围净空区域143的外围线可以为增大的圆形或方形。如此，以使端头部141周围净空尺寸，从而调节微带线14与参考地13形成的间距，从而调整天线单元1在工作频点处的阻抗匹配。
所述射频收发芯片2设于所述参考地13背离所述主辐射贴片110的一侧。所述微带线14的一端电连接所述射频收发芯片2。
请参照图6及图8，天线单元1还包括至少一个第二导电件16。第二导电件16可以为导电过孔。所述第二导电件16的一端电连接所述馈线部12，另一端电连接所述微带线14的另一端。其中，第二导电件16连接于馈线部12远离所述主辐射单元11的几何中心的一端。第二导电件16沿Z轴方向延伸，以减少激励信号在传输过程中的损耗，提高天线模组10的天线效率。本实施例中，第二导电件16为导电过孔。
本实施例中，一个天线单元1中包括两个第二导电件16及两个微带线14，其中，一个第二导电件16电连接第一馈线部121的一端和一个微带线14的一端，这个微带线14的另一端电连接射频收发芯片2的一个引脚；另一个第二导电件16电连接第二馈线部122的一端和另一个微带线14的一端，这个微带线14的另一端电连接射频收发芯片2的另一个引脚。
本实施例中，射频收发芯片2位于或靠近于天线模组10在X-Y平面上的几何中心。
请参照图6，当主辐射单元11的数量为4个时，第五导电层L5靠近中心的位置设有射频收发芯片2的4组引脚21。每组引脚21包括两个引脚21。每组引脚21分别电连接一个主辐射单元11的两个微带线14。换言之，每个主辐射单元11对应的微带线14皆朝向射频收发芯片2的方向延伸。微带线14可以呈曲线延伸。
本实施例中，射频收发芯片2对应于第五导电层L5的几何中心设置。第五导电层L5上的多个微带线14可以关于过第五导电层L5的几何中心且沿X方向延伸的中线对称设置。当然，射频收发芯片2还可以位于其他位置。
本申请对于微带线14的长度不做具体的限定，通过调节微带线14的长度可以调节天线单元1的阻抗，进而调整天线单元1在工作频点处的阻抗匹配。
本实施例提供的天线模组10，通过设计天线模组10的结构，主辐射贴片110与馈线部12形成电偶极子，主辐射贴片110、第一导电件15、馈线部12及参考地13构成磁偶极子，使天线模组10为电偶极子与磁偶极子相结合，能够实现较宽的频带，在整个工作频段能获得稳定的增益和方向图，兼顾其带宽、隔离度、交叉极化、增益等特性；通过在馈线部12与射频收发芯片2之间设置微带线14，通过设置微带线14的长度和微带线14与参考地13之间的间距调节阻抗，进而调整天线单元1在工作频点处的阻抗匹配，实现宽频带、小型化的天线模组10。
请参阅图13，本申请实施例二提供的一种天线模组10，实施例二提供的天线模组10与实施例一提供的天线模组10的结构大致相同，其主要的不同之处在于，本实施例中，多个所述主辐射单元11沿第三方向(第一方向和第二方向见后续详细描述)排列。第三方向为Y轴方向。所述第一间隙111的延伸方向与所述第三方向之间的夹角为0～45°，所述第二间隙112的延伸方向与所述第三方向之间的夹角为0～45°。
换言之，相对于实施例一而言，本实施例提供的每个主辐射单元11皆绕几何中心旋转了0～45°。本实施例中以旋转角度为45°为例进行说明。
通过旋转主辐射单元11，以使第一馈线部121之不同极化的馈线与参考地13边缘的距离相对平衡，从而使得扫描损耗在不同极化的结果中之差异减小。
在旋转主辐射单元11之后，每个主辐射贴片110的形状也进行了适应性地改变，每个主辐射贴片110的形状类似于扇形。
在其他实施方式中，每个主辐射贴片110的形状可以为三角形，以使整个主辐射贴片110的外轮廓接近正方形。
结合本申请的任意一种实施例，可选的，请参阅图14至图17，所述主辐射单元11的至少一个所述主辐射贴片110的边缘具有至少一个第一缺口部113。第一缺口部113可以为矩形槽、圆形槽、三角形槽、T形槽。本实施例中，每个主辐射贴片110上皆设有至少一个第一缺口部113。需要说明的是，图14至图17是实施例一中的所述主辐射单元11为例进行说明。当然，本申请设置的第一缺口部113也适用于实施例二提供的主辐射单元11。
通过在主辐射贴片110上设置第一缺口部113，以改变主辐射贴片110表面上位电流路径，可以有效改善天线单元1的阻抗匹配，通过合理调节第一缺口部113的参数，可以使天线单元1的阻抗改变，使天线单元1在所需频点处阻抗匹配。
请参阅图14，所述第一缺口部113连通相邻的两个所述主辐射贴片110之间的间隙。具体的，每个所述主辐射贴片110的相邻的两个边皆设有第一缺口部113。当然，每个主辐射贴片110还可以设有1个、3个或其他数量的多个缺口部。其中，相邻的两个边皆设有第一缺口部113分别连通第一间隙111和第二间隙112。具体的，第一缺口部113的形状为矩形，在其他实施方式中，第一缺口部113可以为矩形槽、圆形槽、三角形槽、T形槽等。
请参阅图15，所述主辐射贴片110包括相对设置的第一端部1101和第二端部1102。所述第一端部1101靠近所述主辐射单元11的几何中心。所述第一缺口部113位于所述第二端部1102且朝向所述第一端部1101延伸。其中，所述第一缺口部113的形状为矩形，在其他实施方式中，第一缺口部113可以为矩形槽、圆形槽、三角形槽等。
请参阅图16，每个所述主辐射贴片110上设有两个所述第一缺口部113。这两个第一缺口部113分别设于主辐射贴片110上所述第二端部1102两侧相邻的两个边上，且分别沿X轴方向延伸和Y轴方向延伸。这两个第一缺口部113的开口方向皆朝向主辐射单元11外。当然，在其他实施方式中，每个主辐射贴片110还可以设有1个、3个或其他数量的多个缺口部11。缺口部113的方向也不做具体的限定。具体的，第一缺口部113的形状为矩形，在其他实施方式中，第一缺口部113可以为矩形槽、圆形槽、三角形槽、T形槽等。
请参阅图17，本实施方式与图15所示的实施方式相近，不同之外在于，本实施方式提供的缺口部113的形状为T形槽。
可选的，请参阅图18，所述第一缺口部113连通所述相邻的两个所述主辐射贴片110之间的第一间隙111或第二间隙112。所述馈线部12的部分伸入所述第一缺口部113中。例如，第一主辐射贴片110a和第二主辐射贴片110b上皆设有第一缺口部113。第二馈线部122包括主体段311及设于所述主体段311相对两侧的第一延伸段312和第二延伸段313。所述主体段311位于所述第一主辐射贴片110a与所述第二主辐射贴片110b之间的间隙。所述第一延伸段312和所述第二延伸段313分别位于所述第一主 辐射贴片110a的第一缺口部113中和所述第二主辐射贴片110b的第二缺口部113中。
通过将第二馈线部122的第一延伸段312和第二延伸段313伸入第一缺口部113中，一方面，可以调节馈线部12的阻抗，以改善天线单元1的阻抗匹配；另一方面还可以提高馈线部12与主辐射贴片110之间的紧凑性，促进天线单元1的小型化。
可选的，请参阅图19，所述主辐射单元11还包括相邻设置的第一主辐射贴片110a和第二主辐射贴片110b。所述第一主辐射贴片110a靠近所述第二主辐射贴片110b的一侧设有至少一个第一凸出部314。所述第一凸出部314朝向所述第二主辐射贴110b片延伸。本实施方式以实施例二提供的主辐射单元11为例进行说明。其中，第一主辐射贴片110a和第二主辐射贴片110b皆为扇形。第一主辐射贴片110a和第二主辐射贴片110b之间具有空置区域315。每个主辐射贴片110的相对两侧可以分别设有第一凸出部314。第一凸出部314朝向空置区域315延伸。
请参阅图6，所述天线模组10还包括一层或多层寄生辐射层A2。
可选的，所述寄生辐射层A2位于所述主辐射层A1与所述第二天线层B之间。具体的，请参阅图5，当所述主辐射层A1为第二导电层L2时，所述寄生辐射层A2可以为第三导电层L3。
可选的，所述寄生辐射层A2位于所述主辐射层A1背离所述第二天线层B的一侧。具体的，请参阅图5及图6，当所述主辐射层A1为第二导电层L2时，所述寄生辐射层A2可以为第一导电层L1。
可选的，所述寄生辐射层A2为至少两层。至少两层所述寄生辐射层A2分别位于所述主辐射层A1的相对两侧。即至少两层所述寄生辐射层A2分别位于所述主辐射层A1与所述第二天线层B之间和所述主辐射层A1背离所述第二天线层B的一侧。具体的，请参阅图5，当所述主辐射层A1为第二导电层L2时，所述寄生辐射层A2可以为第一导电层L1和第三导电层L3。
请参阅图6，所述寄生辐射层A2包括至少一个寄生辐射单元17。所述寄生辐射单元17包括至少两个对称且相间隔设置的寄生辐射贴片170。每个所述寄生辐射贴片170与一个所述主辐射贴片110相对设置。
可选的，寄生辐射单元17的数量可以与主辐射单元11的数量相同。每个寄生辐射单元17正对一个主辐射单元11。寄生辐射贴片170不与第一导电件15电连接。一个寄生辐射单元17中的寄生辐射贴片170的数量与一个主辐射单元11中的主辐射贴片110的数量相同。
本实施例中，有4个寄生辐射单元17，每个寄生辐射单元17具有4个寄生辐射贴片170。其中，寄生辐射贴片170的形状可以为三角形、矩形、正方形、菱形、圆形、环形及上述的几种形状的近似图形。一个寄生辐射单元17中的多个寄生辐射贴片170的形状可以相同或不同。寄生辐射贴片170的形状与其对应的主辐射贴片110的形状相同或不同。本实施例以寄生辐射贴片170与主辐射贴片110的形状相同为例进行说明。
通过设置寄生辐射贴片170，寄生辐射贴片170通过与主辐射贴片110之间耦合，从而改变主辐射贴片110表面的电流强度，进而改善天线单元1的阻抗匹配，从而增加增益，还有利于扩宽天线单元1的阻抗带宽；通过合理调节寄生辐射贴片170的尺寸，可以调整天线单元1的阻抗带宽。
可选的，馈线部12不仅仅可以设于主辐射贴片110之间的间隙，还可以至少部分位于相邻的两个所述寄生辐射贴片170之间的间隙。本实施例中，所述寄生辐射贴片170之间形成的间隙与主辐射贴片110之间形成的间隙大致相同。
可选的，请参阅图20，所述寄生辐射层A2和所述主辐射层A1可以在同一层，一个寄生辐射单元17的多个寄生辐射贴片170围设于一个主辐射单元11的周侧。例如，一个主辐射单元11具有四个主辐射贴片110，一个寄生辐射单元17包括四个寄生辐射贴片170。四个寄生辐射贴片170依次围接于一个主辐射单元11的周侧，且每个寄生辐射贴片170与一个主辐射贴片110相对。
以下结合附图对于所述寄生辐射单元17的进一步改进进行的说明，以图13中的所述寄生辐射单元17的为例进行说明。
进一步地，请参阅图21至图24，所述寄生辐射单元17的至少一个所述寄生辐射贴片170的边缘具有至少一个第二缺口部171或至少一个第二凸出部172。
请参阅图21至图22，所述第二缺口部171的开口朝向寄生辐射单元17外。这个实施方式与主辐射单元11中的主辐射贴片110的边缘设有第一缺口部113的实施方式类似，具体可以参考图15-图17的实施方式。
请参阅图23，所述寄生辐射贴片170的边缘设有第二凸出部172，这个实施方式与主辐射单元11中的主辐射贴片110的边缘设有第一凸出部314的实施方式类似，具体可以参考图19的实施方式。
请参阅图24，所述第二缺口部171连通所述相邻的两个所述寄生辐射贴片170之间的间隙，所述馈线部12的部分伸入所述第二缺口部171中。这个实施方式与主辐射单元11中的主辐射贴片110的边缘设有第一缺口部113的实施方式类似，具体可以参考图18的实施方式。
请参阅图25，本申请实施例三提供的一种天线模组10，其第二天线层B与实施例一中的天线模组10的第二天线层B的结构相同。本实施例提供的第一天线层A中，第一导电层L1和第二导电层L2分别设置两层寄生辐射单元17，第三导电层L3设置主辐射单元11。其中，第一馈线部121设于主辐射贴片110之间的间隙中，第二馈线部122设于第二导电层L2上的寄生辐射贴片170之间的间隙中。
需要说明的是，寄生辐射单元17所在层上设有通孔，该通孔与第一导电件15正对。其中，这些通孔是在整体板材上加工第一导电件15时形成的，并不是表示寄生辐射单元17电连接第一导电件15。
所述第一天线层A还包括承载层。所述承载层设于所述主辐射层A1与所述第二天线层B之间或设于主辐射层A1背离所述第二天线层B的一侧。可选的，请参阅图6，当主辐射层A1为第二导电层L2时，承载层可以为第三导电层L3，也可以为第一导电层L1。其中，寄生辐射层A2可以为承载层，也可以与承载层相互独立的其他层。当寄生辐射层A2不是承载层时，寄生辐射层A2们可以与承载层设于主辐射层A1的同一侧，或设置于主辐射层A1的相对两侧，本申请对此不做限定。
第一馈线部121和第二馈线部122皆呈长条形。
第一馈线部121和第二馈线部122的设置位置包括但不限于以下的实施方式：
请参阅图6及图7，可选的，全部的所述第一馈线部121设于主辐射层A1所述第一间隙111中，及一部分的所述第二馈线部122设于所述第二间隙112中，另一部分所述第二馈线部122设于所述承载层上并与设于所述第二间隙112中的所述第二馈线部122电连接。承载层为第三导电层L3。
请参阅图6、图7及图26，所述第一馈线部121至少部分位于所述第二导电层L2的第一间隙111。所述第二馈线部122包括相对设置的两个端部122a、122b及连接在所述两个端部122a、122b之间的中间部122c。所述两个端部122a、122b位于第二导电层L2且分别位于所述第一馈线部121的相对两侧。所述第二馈线部122的中间部122c设于所述承载层(即第三导电层L3)，且所述两个端部122a、122b皆通过第一导电过孔(被遮挡)电连接所述第二馈线部122的中间部122c的相对两端。第一导电过孔沿Z轴方向设置。
为了避免第一馈线部121和第二馈线部122重合，第一馈线部121和第二馈线部122采用的搭桥形式，有效提高了天线单元1的隔离度，同时降低了传统天线单元1采用多层叠结构的复杂性，简化了天线模组10的结构。
请参阅图13，可选的，全部的所述第一馈线部121设于所述第一间隙111中，及全部的所述第二馈线部122设于所述承载层上。承载层为第三导电层L3。
可选的，全部的所述第二馈线122部设于所述第二间隙112中，及一部分的所述第一馈线部121设于所述第一间隙111中，另一部分所述第一馈线部121设于所述承载层上并与设于所述第一间隙111中的所述第一馈线部121电连接。
请参阅图25，可选的，全部的所述第二馈线部122设于所述第二间隙112中，及全部的所述第一馈线部121设于所述承载层上。所述承载层为寄生辐射层A2。
请参阅图27，当所述第一馈线部121位于所述第二导电层L2时，第二馈线部122的两个端部122a、122b位于第二导电层L2且分别位于所述第一馈线部121的相对两侧。所述第二馈线部122的中间部122c设于所述第一导电层L1上。
以下结合实施例一对于馈线部12的结构改进进行说明。
可选的，请参阅图28，所述第一馈线部121包括主体部125及连接所述主体部125的至少一个延伸部126。所述主体部125设于所述第一间隙111。所述延伸部126位于所述承载层(第三导电层L3)。所述主体部125在所述承载层上的正投影至少部分覆盖所述延伸部126。所述延伸部126通过第二导电过孔127电连接所述主体部125。
进一步地，延伸部126的数量为多个，多个延伸部126沿Z轴方向层叠设置，相邻的两个延伸部126通过第二导电过孔127电连接。当然，第二馈线部122也可以进行上述的改进，在此不再赘述。
通过设置第一馈线部121为层叠设置，且各层之间通过第二导电过孔127连接，延伸部126及第二导电过孔127相当于电抗的引入，不仅能够调节第一馈线部121的阻抗，进而改善天线单元1的阻抗匹配，还可以通过改变第二导电过孔127的高度和数量来调节天线单元1所产生模态对应的频率。
可选的，请参阅图29，所述第二馈线部122的中间部122c包括依次连接的第一边缘块211、中间块212和第二边缘块213。所述中间块212的延伸方向与所述第二间隙112的延伸方向相同。所述第一边缘块211和所述第二边缘块213的延伸方向皆与所述第一间隙111的延伸方向相同。所述第一馈线部121在所述承载层上的正投影位于所述第一边缘块211和所述第二边缘块213之间。
如此，使得第二馈线部122的中间部122c呈H形，对于第二馈线部122的结构改进为引进电抗，不仅能够调节第二馈线部122的阻抗，进而改善天线单元1的阻抗匹配，还可以通过改变第一边缘块211、中间块212和第二边缘块213的尺寸来调节天线单元1所产生模态对应的频率。
当然，上述的改进也适用于第一馈线部121。
可选的，请参阅图30，所述第二导电件16电连接所述第一馈线部121的第一端121a与所述微带线14的一端。所述第一馈线部121的第二端121b与所述第一馈线部121的第一端121a相对。可选的，所述第一馈线部121的第二端121b与所述第一馈线部121的第一端121a可以关于所述主辐射贴片110的对称中心(主辐射单元11的几何中心)对称。即所述第一馈线部121的第一端121a与所述主辐射贴片110的对称中心之间的间距等于所述第一馈线部121的第二端121b与所述主辐射贴片110的对称中心之间的间距。
请参阅图31，在其他实施方式中，所述第一馈线部121的第一端121a与所述主辐射贴片110的对称中心之间的间距大于所述第一馈线部121的第二端121b与所述主辐射贴片110的对称中心之间的间距。具体的，将第一馈线部121与第二导电件16的连接处定义为第一耦合点131，第一耦合点131与主辐射单元11的几何中心之间的间距大于第一馈线部121的第二端121b与所述主辐射贴片110的对称中心之间的间距。
进一步地，请参阅图31，将第二馈线部122与第二导电件16的连接处定义为第二耦合点132，第二耦合点132与主辐射单元11的几何中心之间的间距大于第二馈线部122的第二端与所述主辐射贴片110的对称中心之间的间距。如此，相对于实施例一，本实施方式中第一耦合点131与第二耦合点132之间的间距更大，以使第一馈线部121与第二馈线部122工作时的影响较小，进一步增加第一馈线部121与第二馈线部122工作时的隔离度。
在实施例一中，第一馈线部121和第二馈线部122皆呈长条形。
请参阅图32，在其他实施方式中，所述第一馈线部121的中间部121c与所述第二馈线部122的中间部122c在所述主辐射层A1上的正投影相重叠。所述第一馈线部121的中间部121c在第一方向上的宽度小于所述第一馈线部121的两个端部121a、121b在所述第一方向上的宽度，和/或，所述第二馈线部122的中间部122c在第二方向上的宽度小于所述第二馈线部122的两个端部122a、122b在所述第二方向上的宽度。所述第一方向为所述第二间隙112的延伸方向，所述第二方向为所述第一间隙111的延伸方向。
本实施方式将第一馈线部121与第二馈线部122的投影相重合的部分设置相对较细，以调节第一馈线部121和第二馈线部122的阻抗，从而调节天线单元1在所需频点的阻抗匹配。
请参阅图33，是本申请实施例四提供的天线模组10，本实施例提供的天线模组10的结构与实施例三的结构大致相同。主要不同在于，各个主辐射单元11的馈电部的排布方式不同。
可选的，请参阅图34，在第三导电层L3上，所述至少一个主辐射单元11包括依次沿Y轴方向排列的第三主辐射单元11c、第一主辐射单元11a、第二主辐射单元11b及第四主辐射单元11d。所述第一主辐射单元11a耦合的所述第一馈线部121与所述第二导电件16的连接处为第一馈电点128。所述第二主辐射单元11b耦合的所述第一馈线部121与所述第二导电件16的连接处为第二馈电点129。所述第一馈电点128与所述第二馈电点129之间的距离大于所述第一主辐射单元11a的几何中心与所述第二主辐射单元11b的几何中心之间的距离。
具体的，在图34中，第一馈电点128位于馈线部12的左上角，第二馈电点129位于馈线部12的左下角，如此，第一馈电点128与第二馈电点129之间的间距尽可以能的大，以使第一馈电点128与第二馈电点129之间的耦合度减小，改善隔离度。
在图34中，第三主辐射单元11c耦合的所述第一馈线部121与所述第二导电件16的连接处位于左上方，第四主辐射单元11d耦合的所述第一馈线部121与所述第二导电件16的连接处位于左下方。如此，尽可能增加各个主辐射单元11的馈电点之间的间距，增加隔离度。
可以理解的，请参阅图34，在第二导电层L2上，第一寄生辐射单元17a(与第一主辐射单元11a相对设置)耦合的第二馈线部122与第二导电件16的连接点定为第三馈电点214，第二寄生辐射单元17b(与第二主辐射单元11b相对)耦合的第二馈线部122与第二导电件16的连接点定义为第四馈电点215。第三馈电点214与第四馈电点215之间的距离大于所述第一寄生辐射贴片170的几何中心与所述第二寄生辐射贴片170的几何中心之间的距离。
具体的，在图34中，第三馈电点214位于馈线部12的右上角，第四馈电点215位于馈线部12的右下角，如此，第三馈电点214与第四馈电点215之间的间距尽可以能的大，以使第三馈电点214与第四馈电点215之间的耦合度减小，改善隔离度。
在图34中，第三寄生辐射单元17耦合的所述第二馈线部122与所述第二导电件16的连接处位于右上方，第四寄生辐射单元17耦合的所述第二馈线部122与所述第二导电件16的连接处位于右下方。如此，尽可能增加各个寄生辐射单元17的馈电点之间的间距，增加隔离度。
可选的，请参阅图13及图35，所述第二天线层B还包括相对设置的第一金属挡墙31和第二金属挡墙32。所述第一金属挡墙31和所述第二金属挡墙32皆位于所述主辐射单元11与所述参考地13之间。所述第一金属挡墙31和所述第二金属挡墙32皆沿主辐射单元11排列的方向延伸。所述第一金属挡墙31和所述第二金属挡墙32分别靠近天线模组10的两个相对的边缘。所述主辐射单元11(或寄生辐射单元17)在所述第二天线层B上的正投影部分覆盖所述第一金属挡墙31与所述第二金属挡墙32之间。
本实施例中，所述第一金属挡墙31和所述第二金属挡墙32皆位于第四导电层L4。第一金属挡墙31和第二金属挡墙32分别设于第四导电层L4的边缘。
第一金属挡墙31可以为一排金属过孔，该金属过孔贯通第五导电层L5的参考地13，以使第一金属挡墙31与参考地13电连接。第一金属挡墙31还可以为金属薄片。第二金属挡墙32的结构可以参考第一金属挡墙31的结构，在此不再赘述。
第一金属挡墙31和第二金属挡墙32皆形成电磁波的反射墙，用于改变主辐射单元11上的电流分布，使电场形状更加集中，从而增加增益。
进一步地，请参阅图36，所述第二天线层B还包括至少一个第三金属挡墙33。所述第三金属挡墙33位于相邻的两个所述主辐射单元11(或寄生辐射单元17)在所述第二天线层B上的正投影之间。
第三金属挡墙33可以位于第四导电层L4，第三金属挡墙33位于相邻的两个所述主辐射单元11(或寄生辐射单元17)在所述第四导电层L4上的正投影之间，以使第三金属挡墙33为相邻的两个主辐射单元11之间的隔离挡墙，从而提高相邻的两个主辐射单元11之间的隔离度。
可选的，第三金属挡墙33在X-Y平面上可以为长条形，且沿X轴方向延伸，第三金属挡墙33的两端分别电连接第一金属挡墙31和第二金属挡墙32。
可选的，请参阅图37，第三金属挡墙33可以包括第一挡墙331和第二挡墙332，第一挡墙331和第二挡墙332在X-Y平面上可以为长条形，且沿X轴方向延伸。第一挡墙331电连接第一金属挡墙31且与第二金属挡墙32相间隔。第二挡墙332电连接第二金属挡墙32且与第一金属挡墙31相间隔。第一挡墙331与第二挡墙332在Y轴方向上有重叠但间隔设置。
可选的，请参阅图38，第三金属挡墙33在X-Y平面上呈翻转90°的“H”形。其中，多个“H”形沿Y轴方向排列。
通过设置翻转90°的“H”形的第三金属挡墙33，不仅可以增加相邻的主辐射单元11之间的隔离度，还使得第三金属挡墙33充分利用主辐射单元11之间的空间。
可选的，请参阅图39，第三金属挡墙33包括至少两个相间隔设置的金属块333。以金属块333数量为4个进行举例说明。其中，两个金属块333分别电连接第一金属挡墙31和第二金属挡墙32，且皆靠近于一个主辐射单元11中的一个主辐射贴片110的相对两侧；另两个金属块333分别电连接第一金属挡墙31和第二金属挡墙32，且皆靠近于另一个主辐射单元11的一个主辐射贴片110的相对两侧。
可选的，请参阅图40，金属块333可以包括分层设置的第一金属片333a和第一金属片333b，其中，第一金属片333a和第一金属片333b沿Z轴方向分层设置，且，两者之间通过金属过孔333c电连接。
第一金属挡墙31、第二金属挡墙32和第三金属挡墙33的材质可相同，且与参考地13的材质相同。
请参阅图41，图41为本申请实施例一提供的天线模组的输入回波损耗(S11)与频率的曲线图。其中，频率f1对应的C点为电偶极子产生的谐振点，频率f2对应的D点为匹配网络产生的谐振点，频率f3对应的E点为磁偶极子产生的谐振点，频率f4对应的F点为匹配网络产生的谐振点。可以看出，本申请实施例提供的匹配网络能够加宽电偶极子和磁偶极子的频宽，同时可选的，C点也可以对应到f2，而此时D点则对应到f1，同样举例可选的，E点可以对应到f4，而此时F点则对应到f3。例如，频率f0-f5为匹配网络作用于电偶极子后所加宽的频宽。同时，电偶极子和磁偶极子相结合，可以增加天线模组10的带宽。
本申请实施例提供的天线模组10，将电偶极子和磁偶极子相组合获得磁电偶极子，提高天线带宽及减小天线模组10的厚度，可灵活用于各种通信产品；通过在馈线部12与射频收发芯片2之间设置微带线14，通过设计微带线14的长度，可以调节阻抗，进而调整天线单元1在工作频点处的阻抗匹配，通过改变微带线14的端头部141周围的净空尺寸，优化由垂直互连过孔阻抗不连续引起的阻抗失配情况，从而来改善传输损耗；采用旋转的磁电偶极子天线单元1，改善了扫描损耗；通过双层的寄生辐射单元17来改善天线增益，使得在不牺牲天线的增益的情况下减小了天线尺寸；通过增加相邻的两个天线单元1的馈电点之间的间距，以改善天线隔离度，同时也改善了扫描损耗；通过设置金属挡墙，提高了天线增益。
以上所述是本申请的部分实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (27)

  1. 一种天线模组，其特征在于，包括：
    第一天线层，所述第一天线层包括至少一个主辐射单元及至少一个馈线部，所述主辐射单元包括至少两个对称且相间隔设置的主辐射贴片，所述馈线部位于或对应于相邻的两个所述主辐射贴片之间的间隙，所述馈线部与所述主辐射贴片电连接或耦合连接；
    第二天线层，与所述第一天线层层叠设置，所述第二天线层包括参考地及至少一个微带线，所述参考地与所述主辐射贴片相对设置；所述微带线设于所述参考地所在层、所述参考地与所述辐射贴片之间或所述参考地背离所述主辐射贴片的一侧，且与所述参考地绝缘设置，所述微带线的一端用于电连接射频收发芯片；
    至少一个第一导电件，所述第一导电件电连接所述主辐射贴片和所述参考地；及
    至少一个第二导电件，所述第二导电件的一端电连接所述馈线部，另一端电连接所述微带线的另一端。
  2. 如权利要求1所述的天线模组，其特征在于，所述第二天线层设有被所述参考地包围的至少一个镂空部，所述微带线位于所述镂空部，且与所述参考地间隔设置。
  3. 如权利要求2所述的天线模组，其特征在于，所述微带线包括两个相对设置的端头部及连接在两个所述端头部之间的中间段，所述端头部与所述参考地之间的间距大于所述中间段与所述参考地之间的间距。
  4. 如权利要求3所述的天线模组，其特征在于，所述中间段在延伸方向上的线宽相等。
  5. 如权利要求3所述的天线模组，其特征在于，所述中间段包括在延伸方向上互连为一体的至少一个本体部及至少一个加宽部，所述加宽部的线宽大于所述本体部的线宽。
  6. 如权利要求3所述的天线模组，其特征在于，所述微带线还包括电连接所述中间段的至少一个分支，所述分支朝向相对于所述中间段倾斜或垂直的方向延伸，所述分支远离所述中间段的一端为开路。
  7. 如权利要求1所述的天线模组，其特征在于，所述第一天线层还包括主辐射层，所述主辐射单元设于所述主辐射层，一个所述主辐射单元中的所述主辐射贴片的数量为多个，多个所述主辐射贴片呈中心对称，多个所述主辐射贴片之间形成相交的第一间隙和第二间隙，所述至少一个馈线部包括相绝缘设置的第一馈线部和第二馈线部，所述第一馈线部位于或对应于所述第一间隙设置，所述第二馈线部位于或对应于所述第二间隙设置，且所述第一馈线部与所述第二馈线部在所述主辐射层上的正投影相交。
  8. 如权利要求7所述的天线模组，其特征在于，所述第一天线层还包括承载层，所述承载层设于所述主辐射层与所述第二天线层之间或设于主辐射层背离所述第二天线层的一侧；全部的所述第一馈线部设于所述第一间隙中，及一部分的所述第二馈线部设于所述第二间隙中，另一部分所述第二馈线部设于所述承载层上并与设于所述第二间隙中的所述第二馈线部电连接；
    或者，全部的所述第一馈线部设于所述第一间隙中，及全部的所述第二馈线部设于所述承载层上；
    或者，全部的所述第二馈线部设于所述第二间隙中，及一部分的所述第一馈线部设于所述第一间隙中，另一部分所述第一馈线部设于所述承载层上并与设于所述第一间隙中的所述第一馈线部电连接；
    或者，全部的所述第二馈线部设于所述第二间隙中，及全部的所述第一馈线部设于所述承载层上。
  9. 如权利要求8所述的天线模组，其特征在于，所述第一馈线部至少部分位于所述第一间隙，所述第二馈线部包括相对设置的两个端部及连接在所述两个端部之间的中间部，所述两个端部位于所述第二间隙且分别位于所述第一馈线部的相对两侧，所述第二馈线部的中间部设于所述承载层，且所述两个端部皆通过第一导电过孔电连接所述第二馈线部的中间部的相对两端。
  10. 如权利要求9所述的天线模组，其特征在于，所述第一馈线部包括主体部及连接所述主体部的至少一个延伸部，所述主体部设于所述第一间隙，所述延伸部位于所述承载层，且所述主体部在所述承载层上的正投影至少部分覆盖所述延伸部，所述延伸部通过第二导电过孔电连接所述主体部。
  11. 如权利要求9所述的天线模组，其特征在于，所述第二馈线部的中间部包括依次连接的第一边缘块、中间块和第二边缘块，所述中间块的延伸方向与所述第二间隙的延伸方向相同，所述第一边缘块和所述第二边缘块的延伸方向皆与所述第一间隙的延伸方向相同，所述第一馈线部在所述承载层上的正 投影位于所述第一边缘块和所述第二边缘块之间。
  12. 如权利要求7所述的天线模组，其特征在于，所述第一馈线部的第一端通过所述第二导电件电连接所述微带线的一端，所述第一馈线部的第二端与所述第一馈线部的第一端相对，所述第一馈线部的第一端与所述主辐射单元的几何中心之间的间距大于所述第一馈线部的第二端与所述主辐射单元的几何中心之间的间距。
  13. 如权利要求7所述的天线模组，其特征在于，所述第一馈线部的中间部与所述第二馈线部的中间部在所述主辐射层上的正投影相重叠，所述第一馈线部的中间部在第一方向上的宽度小于所述第一馈线部的两个端部在所述第一方向上的宽度，和/或，所述第二馈线部的中间部在第二方向上的宽度小于所述第二馈线部的两个端部在所述第二方向上的宽度，所述第一方向为所述第二间隙的延伸方向，所述第二方向为所述第一间隙的延伸方向。
  14. 如权利要求1～13任意一项所述的天线模组，其特征在于，所述至少一个主辐射单元包括第一主辐射单元及第二主辐射单元，与所述第一主辐射单元相耦合的所述馈线部与所述第二导电件的连接处为第一馈电点，与所述第二主辐射单元相耦合的所述馈线部与所述第二导电件的连接处为第二馈电点，所述第一馈电点与所述第二馈电点之间的距离大于所述第一主辐射单元的几何中心与所述第二主辐射单元的几何中心之间的距离。
  15. 如权利要求7～13任意一项所述的天线模组，其特征在于，所述主辐射单元的数量为多个，多个所述主辐射单元沿第三方向排列，所述第一间隙的延伸方向与所述第三方向之间的夹角为0～45°，所述第二间隙的延伸方向与所述第三方向之间的夹角为0～45°。
  16. 如权利要求1～13任意一项所述的天线模组，其特征在于，所述主辐射单元的至少一个所述主辐射贴片的边缘具有至少一个第一缺口部。
  17. 如权利要求16所述的天线模组，其特征在于，所述主辐射贴片包括相对设置的第一端部和第二端部，所述第一端部靠近所述主辐射单元的几何中心，所述第一缺口部位于所述第二端部且朝向所述第一端部延伸。
  18. 如权利要求16所述的天线模组，其特征在于，所述第一缺口部连通相邻的两个所述主辐射贴片之间的间隙。
  19. 如权利要求18所述的天线模组，其特征在于，所述主辐射单元包括相邻设置的第一主辐射贴片和第二主辐射贴片，所述第一主辐射贴片和所述第二主辐射贴片皆设有所述第一缺口部，所述馈线部还包括主体段及设于所述主体段相对两侧的第一延伸段和第二延伸段，所述主体段位于所述第一主辐射贴片与所述第二主辐射贴片之间的间隙，所述第一延伸段和所述第二延伸段分别位于所述第一主辐射贴片的第一缺口部中和所述第二主辐射贴片的第一缺口部中。
  20. 如权利要求1～13任意一项所述的天线模组，其特征在于，所述主辐射单元还包括相邻设置的第一主辐射贴片和第二主辐射贴片，所述第一主辐射贴片靠近所述第二主辐射贴片的一侧设有至少一个第一凸出部，所述第一凸出部朝向所述第二主辐射贴片延伸。
  21. 如权利要求1～13任意一项所述的天线模组，其特征在于，所述第一天线层还包括一层或多层寄生辐射层，所述寄生辐射层位于所述主辐射层与所述第二天线层之间；或者，所述寄生辐射层位于所述主辐射层背离所述第二天线层的一侧；或者，所述寄生辐射层的数量为至少两层，至少两层所述寄生辐射层分别位于所述主辐射层的相对两侧；所述寄生辐射层包括至少一个寄生辐射单元，所述寄生辐射单元包括至少两个对称且相间隔设置的寄生辐射贴片，所述寄生辐射贴片与所述主辐射贴片相对设置。
  22. 如权利要求21所述的天线模组，其特征在于，所述寄生辐射层为所述承载层。
  23. 如权利要求21所述的天线模组，其特征在于，至少一个所述寄生辐射贴片的边缘具有至少一个第二缺口部或至少一个第二凸出部。
  24. 如权利要求7～13任意一项所述的天线模组，其特征在于，所述主辐射层还包括多个寄生辐射贴片，多个所述寄生辐射贴片至少围设于一个所述主辐射单元的周侧，每个所述寄生辐射贴片与一个所述主辐射贴片相对设置。
  25. 如权利要求1～13任意一项所述的天线模组，其特征在于，所述第二天线层还包括相对设置的第一金属挡墙和第二金属挡墙，所述第一金属挡墙和所述第二金属挡墙皆位于所述主辐射单元与所述参 考地之间，所述第一金属挡墙和所述第二金属挡墙皆沿所述主辐射单元的排列方向延伸，所述第一金属挡墙和所述第二金属挡墙分别靠近于所述天线模组的两个相对的边缘，所述主辐射单元在所述第二天线层上的正投影部分覆盖所述第一金属挡墙与所述第二金属挡墙。
  26. 如权利要求25所述的天线模组，其特征在于，所述第二天线层还包括至少一个第三金属挡墙，所述第三金属挡墙位于相邻的两个所述主辐射单元在所述第二天线层上的正投影之间。
  27. 一种电子设备，其特征在于，包括权利要求1～26任意一项所述的天线模组。
PCT/CN2021/079664 2020-04-30 2021-03-09 天线模组及电子设备 Ceased WO2021218392A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21797924.4A EP4113744A4 (en) 2020-04-30 2021-03-09 Antenna module and electronic device
US17/933,627 US12255401B2 (en) 2020-04-30 2022-09-20 Antenna module and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010370756.0 2020-04-30
CN202010370756.0A CN113594687B (zh) 2020-04-30 2020-04-30 天线模组及电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/933,627 Continuation US12255401B2 (en) 2020-04-30 2022-09-20 Antenna module and electronic device

Publications (1)

Publication Number Publication Date
WO2021218392A1 true WO2021218392A1 (zh) 2021-11-04

Family

ID=78237796

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/079664 Ceased WO2021218392A1 (zh) 2020-04-30 2021-03-09 天线模组及电子设备

Country Status (5)

Country Link
US (1) US12255401B2 (zh)
EP (1) EP4113744A4 (zh)
CN (1) CN113594687B (zh)
TW (1) TWI779577B (zh)
WO (1) WO2021218392A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112889183B (zh) * 2018-11-30 2022-04-22 华为技术有限公司 波束控制天线结构和包括所述结构的电子设备
CN116264348B (zh) * 2021-12-14 2026-04-21 西安电子科技大学 天线模组及电子设备
CN119133840A (zh) * 2023-06-12 2024-12-13 中兴通讯股份有限公司 天线单元、天线阵列

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105140628A (zh) * 2015-07-20 2015-12-09 华为技术有限公司 一种微带全向天线及通信器件
CN106299664A (zh) * 2016-09-21 2017-01-04 深圳大学 一种极化可重构磁电偶极子天线
CN206313137U (zh) * 2016-11-22 2017-07-07 北京和佳铁信科技有限公司 微带天线装置
CN107681262A (zh) * 2017-09-12 2018-02-09 北京邮电大学 一种基于弯折磁壁的低剖面磁电偶极子天线
US20180309198A1 (en) * 2017-04-20 2018-10-25 Speed Wireless Technology Inc. 5g terminal antenna with reconfigurable radiation pattern
CN110350315A (zh) * 2019-06-29 2019-10-18 瑞声科技（南京）有限公司 天线和电子设备
CN110447146A (zh) * 2016-12-21 2019-11-12 英特尔公司 无线通信技术、装置和方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7388550B2 (en) * 2005-10-11 2008-06-17 Tdk Corporation PxM antenna with improved radiation characteristics over a broad frequency range
US7843389B2 (en) * 2006-03-10 2010-11-30 City University Of Hong Kong Complementary wideband antenna
CN103682678A (zh) * 2013-12-03 2014-03-26 华南理工大学 具有y形馈电单元的双极化基站天线
EP3262711B1 (en) * 2015-02-26 2020-11-18 The Government of the United States of America as represented by the Secretary of the Navy Planar ultrawideband modular antenna array having improved bandwidth
JP6392715B2 (ja) * 2015-08-17 2018-09-19 日本電信電話株式会社 ループアンテナアレイ群
CN105762508B (zh) 2016-03-23 2018-08-31 重庆邮电大学 一种加载金属柱的宽频带双极化移动基站天线单元
US10594028B2 (en) * 2018-02-13 2020-03-17 Apple Inc. Antenna arrays having multi-layer substrates
CN108933327A (zh) * 2018-06-08 2018-12-04 西安电子科技大学 一种改进的宽带微带天线单元
US10763589B2 (en) * 2018-07-10 2020-09-01 Apple Inc. Millimeter wave patch antennas with parasitic elements
CN109687135A (zh) 2019-01-16 2019-04-26 重庆邮电大学 一种适用于4g/5g移动通信的宽带双极化基站天线单元
CN110380218B (zh) * 2019-05-17 2020-12-25 东南大学 一种圆极化平面基片集成磁电偶极子天线及其阵列
CN110190392A (zh) * 2019-06-20 2019-08-30 重庆邮电大学 一种适用于4g/5g微基站的双频双极化电磁偶极子天线单元
CN110649382A (zh) * 2019-10-18 2020-01-03 北京交通大学 一种毫米波双极化天线
CN111063988A (zh) * 2019-10-31 2020-04-24 Oppo广东移动通信有限公司 天线模组及电子设备
CN110867662B (zh) * 2019-11-21 2021-06-08 Oppo广东移动通信有限公司 天线封装模组和电子设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105140628A (zh) * 2015-07-20 2015-12-09 华为技术有限公司 一种微带全向天线及通信器件
CN106299664A (zh) * 2016-09-21 2017-01-04 深圳大学 一种极化可重构磁电偶极子天线
CN206313137U (zh) * 2016-11-22 2017-07-07 北京和佳铁信科技有限公司 微带天线装置
CN110447146A (zh) * 2016-12-21 2019-11-12 英特尔公司 无线通信技术、装置和方法
US20180309198A1 (en) * 2017-04-20 2018-10-25 Speed Wireless Technology Inc. 5g terminal antenna with reconfigurable radiation pattern
CN107681262A (zh) * 2017-09-12 2018-02-09 北京邮电大学 一种基于弯折磁壁的低剖面磁电偶极子天线
CN110350315A (zh) * 2019-06-29 2019-10-18 瑞声科技（南京）有限公司 天线和电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4113744A4 *

Also Published As

Publication number Publication date
TW202143548A (zh) 2021-11-16
CN113594687B (zh) 2022-10-28
EP4113744A4 (en) 2023-08-23
TWI779577B (zh) 2022-10-01
CN113594687A (zh) 2021-11-02
US20230011271A1 (en) 2023-01-12
EP4113744A1 (en) 2023-01-04
US12255401B2 (en) 2025-03-18

Similar Documents

Publication Publication Date Title
US20220255238A1 (en) Antenna module and electronic device
EP4254670B1 (en) Antenna-integrated display screen, display apparatus, and electronic device
US20260031540A1 (en) Antenna, antenna array, and electronic device
US12255401B2 (en) Antenna module and electronic device
US7724192B2 (en) Portable communication device with slot-coupled antenna module
US12334656B2 (en) Antenna assembly and electronic device
CN112397898B (zh) 天线阵列组件及电子设备
CN117293530A (zh) 天线模块和搭载该天线模块的通信装置以及电路基板
US20240113433A1 (en) Antenna module and communication device including the same
WO2023109868A1 (zh) 天线模组及电子设备
WO2021083219A1 (zh) 天线单元及电子设备
WO2024001072A1 (zh) 天线模组、天线阵列及电子设备
WO2021083217A1 (zh) 天线单元及电子设备
WO2024037129A1 (zh) 天线模组、天线阵列及电子设备
WO2021196136A1 (zh) 圆极化天线装置及可移动平台
WO2024037128A1 (zh) 天线模组、天线阵列及电子设备
CN117477222A (zh) 天线及通讯设备
JP7577187B2 (ja) 円偏波アレイアンテナ及び電子機器
CN110808453A (zh) 一种天线单元及电子设备
CN212676470U (zh) 全向圆极化天线及电子设备
TW202345451A (zh) 微型化天線饋入模組及電子裝置
CN121055017A (zh) 天线和通信设备
CN117638468A (zh) 天线模组、天线阵列及电子设备
CN114006156A (zh) 天线单元及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21797924

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021797924

Country of ref document: EP

Effective date: 20220928

NENP Non-entry into the national phase

Ref country code: DE