WO2021218709A1 - 声学装置及其磁路组件 - Google Patents

声学装置及其磁路组件 Download PDF

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Publication number
WO2021218709A1
WO2021218709A1 PCT/CN2021/088446 CN2021088446W WO2021218709A1 WO 2021218709 A1 WO2021218709 A1 WO 2021218709A1 CN 2021088446 W CN2021088446 W CN 2021088446W WO 2021218709 A1 WO2021218709 A1 WO 2021218709A1
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WIPO (PCT)
Prior art keywords
magnetic
magnetic element
circuit assembly
acoustic device
magnetic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/088446
Other languages
English (en)
French (fr)
Inventor
王力维
张磊
廖风云
齐心
付峻江
谢帅林
李朝武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Voxtech Co Ltd
Original Assignee
Shenzhen Voxtech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202021689802.5U external-priority patent/CN212851008U/zh
Priority to AU2021262946A priority Critical patent/AU2021262946B2/en
Priority to BR112022015551-4A priority patent/BR112022015551B1/pt
Priority to KR1020227032921A priority patent/KR102629489B1/ko
Priority to CA3178738A priority patent/CA3178738A1/en
Priority to MX2022013216A priority patent/MX2022013216A/es
Priority to CN202180010663.XA priority patent/CN114982253B/zh
Priority to JP2022557173A priority patent/JP2023518496A/ja
Priority to EP21795695.2A priority patent/EP4084495A4/en
Application filed by Shenzhen Voxtech Co Ltd filed Critical Shenzhen Voxtech Co Ltd
Priority to PE2022002462A priority patent/PE20221848A1/es
Publication of WO2021218709A1 publication Critical patent/WO2021218709A1/zh
Priority to US17/814,228 priority patent/US12192732B2/en
Priority to CONC2022/0015149A priority patent/CO2022015149A2/es
Anticipated expiration legal-status Critical
Priority to US18/986,758 priority patent/US20250119693A1/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R11/00—Transducers of moving-armature or moving-core type
    • H04R11/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
    • H04R25/606—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers acting directly on the eardrum, the ossicles or the skull, e.g. mastoid, tooth, maxillary or mandibular bone, or mechanically stimulating the cochlea, e.g. at the oval window
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083—Reduction of ambient noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/07—Suspension between moving magnetic core and housing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers

Definitions

  • This application relates to the field of acoustic technology, and in particular to a bone conduction acoustic device.
  • Bone conduction is a way of sound conduction, which converts sound into mechanical vibrations of different frequencies, and transmits sound through human bones and tissues (such as skull, bony labyrinth, inner ear lymph, spiral organs, auditory nerve, auditory center).
  • Bone conduction acoustic devices such as bone conduction earphones
  • sound waves can be directly transmitted to the auditory nerve through the bones, so that both ears can be opened without damaging the tympanic membrane. It can be widely used in bone conduction technology in different scenarios. For example, hearing aids. Since the sound quality of the bone conduction acoustic device directly affects the user's hearing experience, improving the sound quality is particularly important for the bone conduction acoustic device.
  • the acoustic device includes: a housing, the housing has an accommodating cavity; a speaker, arranged in the accommodating cavity, the speaker includes: a magnetic circuit assembly, a voice coil, a vibration assembly and a vibration plate; the magnetic The circuit component forms a magnetic gap; one end of the voice coil is arranged in the magnetic gap, the other end of the voice coil is connected to the vibration component, the vibration component is connected to the vibration plate, and the vibration plate Connect the shell.
  • the vibration assembly includes an inner support, an outer support, and a vibrating plate; the other end of the voice coil is connected to the inner support; one end of the outer support is physically connected to both sides of the magnetic circuit assembly
  • the vibrating plate physically connects the inner support and the outer support, and is used to limit the relative movement of the inner support and the outer support in a first direction; the first direction is the direction of the accommodating cavity Radial; at least one of the inner support, the outer support and the vibrating plate is connected to the vibration transmission plate so that vibration is transmitted to the vibration transmission plate.
  • the outer support and the inner support are movably connected to the vibrating plate to restrict the relative movement of the outer support and the inner support in the first direction, and allow the The inner support and the vibrating plate move relative to the outer support in a second direction; the second direction is the extension direction of the inner support and the outer support.
  • the other end of the outer bracket is provided with a first protrusion
  • the vibrating plate is provided with a first through hole
  • the first protrusion is movably connected to the Vibration plate.
  • one end of the inner bracket is provided with a second protrusion
  • the vibrating plate is provided with a second through hole
  • the second protrusion is movably connected to the vibration through the second through hole. piece.
  • the loudspeaker further includes an elastic shock-absorbing sheet disposed between the vibrating sheet and one end of the inner bracket to slow the inner bracket from moving in the second direction. On the vibration.
  • the second protruding column includes a first column section and a second column section that are physically connected, and the second column section is disposed above the first column section; the first column section passes through Is provided in the second through hole, and the second column section is inserted into the vibration transmission plate; the elastic damping sheet is provided with a third through hole, and the elastic damping sheet passes through the third through hole The hole is sleeved on the second column section and supported on the first column section.
  • the protective element includes a fitting part, an accommodating part, and a supporting part, and the fitting part and the accommodating part form a second accommodating cavity;
  • the vibration transmission plate Is disposed in the second accommodating cavity, the affixing part is disposed in a close contact with the outer end surface of the vibration transmission plate, and the supporting part is connected to the second accommodating cavity and is disposed in the housing Above.
  • the inner wall of the housing is provided with a ring-shaped bearing platform for supporting the ring-shaped support portion and the elastic shock-absorbing sheet.
  • the magnetic circuit assembly includes a magnetic element group and a magnetic conductive cover;
  • the magnetic conductive cover includes a cover bottom, a cover side, and a barrel groove, the cover bottom and the cover side
  • the cylindrical groove is formed;
  • the magnetic element group is arranged in the cylindrical groove, and the magnetic gap is formed between the magnetic element group and the magnetic conductive cover.
  • it further includes a fixing member for fixing the magnetic element group to the bottom of the cover;
  • the fixing member includes a bolt and a nut, and the bolt passes through the magnetic element in sequence After the assembly, pass through the bottom of the cover body to fix the magnetic element group and the bottom of the cover body through a threaded connection.
  • the inner bracket forms a cover groove
  • the magnetic element group partially extends into the cover groove
  • the outer bracket is arranged in a cylindrical shape.
  • the magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap;
  • the magnetic circuit assembly includes a first magnetic element and a second magnetic element.
  • the total magnetic field generated by the magnetic circuit assembly in the magnetic gap has a greater magnetic field strength than the first magnetic element or the second magnetic element in the magnetic gap The magnetic field strength.
  • the angle between the magnetization directions of the first magnetic element and the second magnetic element is 150-180 degrees.
  • the magnetization directions of the first magnetic element and the second magnetic element are opposite.
  • the magnetization directions of the first magnetic element and the second magnetic element are both perpendicular or parallel to the vibration direction of the voice coil in the magnetic gap.
  • the second magnetic circuit assembly includes a third magnetic element
  • the first magnetic circuit assembly includes a first magnetically permeable element
  • the first magnetically permeable element is arranged between the first magnetic element and the Between the second magnetic elements, the third magnetic element is at least partially arranged around the first magnetic element and the second magnetic element.
  • the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface connecting the first magnetic element and the first magnetically conductive element, and the first magnetic element The magnetization direction of a magnetic element is opposite to the magnetization direction of the second magnetic element.
  • the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element is 60-120 degrees.
  • the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element is 0-30 degrees.
  • the second magnetic component includes a first magnetic element and the first magnetic component includes a second magnetic element; the second magnetic element is disposed on the first magnetic element and the Between the second magnetic elements; the first magnetic element at least partially surrounds the first magnetic element and the second magnetic element.
  • the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface connecting the first magnetic element and the second magnetically permeable element, and the first magnetic element The magnetization direction of a magnetic element is opposite to the magnetization direction of the second magnetic element.
  • the second magnetically conductive element is arranged to surround the first magnetic element, and the first magnetic element surrounds between the second magnetic elements.
  • the upper surface of the second magnetically conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetically conductive element is connected to the upper surface of the second magnetic element.
  • the magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap;
  • the magnetic circuit assembly includes a first magnetic element and the second magnetic circuit assembly includes a first magnetically permeable element; the first magnetically permeable element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element
  • the central area of the first magnetic element points to the outer area of the first magnetic element or the outer area of the first magnetic element points to the first magnetic element.
  • the magnetic circuit assembly includes a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap;
  • the magnetic circuit assembly includes a first magnetic element and the second magnetic circuit assembly includes a second magnetic element; the second magnetic element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element is determined by the The central area of the first magnetic element points to the outer area of the first magnetic element or the outer area of the first magnetic element points to the first magnetic element.
  • the magnetization direction of the second magnetic element is directed from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the first magnetic element.
  • Fig. 1 is a structural block diagram of an exemplary acoustic device according to some embodiments of the present application
  • Fig. 2 is a schematic structural diagram of an exemplary acoustic device according to some embodiments of the present application.
  • Fig. 3A is a schematic diagram showing the disassembled structure of the acoustic device in Fig. 2 according to some embodiments of the present application;
  • Fig. 3B is a schematic cross-sectional structure diagram of the acoustic device in Fig. 3A according to some embodiments of the present application;
  • FIG. 3C is a schematic structural diagram of the vibrating plate of the acoustic device in FIG. 3A according to some embodiments of the present application;
  • Fig. 4 is a schematic longitudinal cross-sectional view of a bone conduction acoustic device according to some embodiments of the present application.
  • Fig. 5 is a schematic longitudinal cross-sectional view of an air conduction acoustic device according to some embodiments of the present application.
  • Fig. 6 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 7 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 6 according to the present application.
  • Fig. 8 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 9 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 8 according to the present application.
  • Fig. 10 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 11 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 10 according to the present application.
  • Fig. 12 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 13 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 12 according to the present application.
  • Fig. 14 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 15 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 14 according to the present application;
  • Fig. 16 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 17 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 16 according to the present application.
  • Fig. 18 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 19 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 18 according to the present application.
  • FIG. 20 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 21 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 20 according to the present application.
  • Fig. 22 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 23 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 22 according to the present application.
  • Figure 24 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 25 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 24 according to the present application.
  • Fig. 26 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 27 is a schematic diagram of magnetic field intensity changes of the magnetic circuit assembly shown in FIG. 26 according to the present application.
  • Figure 28 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 29 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 28 according to the present application.
  • Fig. 30 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 31 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 38 according to the present application.
  • Fig. 32 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 33 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 32 according to the present application.
  • Fig. 34 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 35 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 34 according to the present application.
  • Fig. 36 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • Fig. 37 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 36 according to the present application;
  • Fig. 38 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 39 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 38 according to the present application.
  • Fig. 40 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 41 is a schematic diagram of magnetic field intensity changes of the magnetic circuit assembly shown in FIG. 40 according to the present application.
  • Fig. 42 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 43 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 42 according to the present application.
  • Fig. 44 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 45 is a schematic diagram of magnetic field intensity changes of the magnetic circuit assembly shown in FIG. 44 according to the present application.
  • Figure 46 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 47 is a schematic diagram of magnetic field intensity changes of the magnetic circuit assembly shown in FIG. 46 according to the present application.
  • Fig. 48 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 49 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 48 according to the present application.
  • Figure 50 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 51 is a schematic diagram of magnetic field intensity changes of the magnetic circuit assembly shown in FIG. 50 according to the present application.
  • Figure 52 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 53 is a schematic diagram of magnetic field intensity changes of the magnetic circuit assembly shown in FIG. 52 according to the present application.
  • Fig. 54 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 55 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 54 according to the present application.
  • Figure 56 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • FIG. 57 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 56 according to the present application.
  • Fig. 58 is a schematic cross-sectional view of a magnetic element structure according to some embodiments of the present application.
  • Fig. 59 is a schematic cross-sectional view of a magnetic element structure according to some embodiments of the present application.
  • FIG. 60 is a schematic diagram of a structure of a magnetic element according to some embodiments of the present application.
  • Fig. 61 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application
  • Fig. 62 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • Fig. 63 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • Fig. 64 is a comparison diagram of frequency response curves of speakers using the magnetic circuit components shown in Fig. 63 and Fig. 56 respectively according to the present application.
  • bone conduction speaker or “bone conduction earphone” will be used when describing the bone conduction related technology in the present invention.
  • This description is only a form of bone conduction application.
  • “speaker” or “headphone” can also be replaced by other similar words, such as “player”, “hearing aid” and so on.
  • the various implementations in the present invention can be easily applied to other non-speaker hearing devices.
  • professionals in the field after understanding the basic principles of bone conduction speakers, they may perform various forms and details on the specific methods and steps of implementing bone conduction speakers without departing from this principle.
  • a microphone such as a microphone can pick up the sound of the user/wearer's surrounding environment, and under a certain algorithm, transmit the processed sound (or the generated electrical signal) to the bone conduction speaker part. That is, the bone conduction speaker can be modified to add the function of picking up ambient sound, and after certain signal processing, the sound is transmitted to the user/wearer through the bone conduction speaker part, thereby realizing the function of the bone conduction hearing aid.
  • the algorithms mentioned here can include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling One or more combinations of suppression, volume control, etc.
  • the acoustic device may be a device with acoustic output capability.
  • hearing aids For example, hearing aids, listening bracelets, earphones, speakers and smart glasses.
  • a hearing aid is a small loudspeaker that amplifies the original inaudible sound, and then uses the residual hearing of the hearing impaired to send the sound to the brain's auditory center.
  • the hearing aid uses the ear canal to transmit sound.
  • the way of ear canal sound transmission has limited improvement in the hearing effect of the hearing impaired.
  • the acoustic device may include bone conduction headphones.
  • Bone conduction headphones can convert audio into mechanical vibrations of different frequencies, using human bones as a medium for transmitting mechanical vibrations, and then transmitting mechanical vibrations to the auditory nerve. In this way, the user can receive sound without passing through the external auditory canal and tympanic membrane of the ear.
  • Fig. 1 is a structural block diagram of an exemplary acoustic device according to some embodiments of the present application.
  • the acoustic device 100 may include a magnetic circuit assembly 102, a vibration assembly 104, a support assembly 106, and a storage assembly 108.
  • the magnetic circuit assembly 102 can provide a magnetic field.
  • the magnetic field can be used to convert a signal containing sound information into a vibration signal.
  • the sound information may include a video or audio file with a specific data format, or data or files that can be converted into sound through a specific way.
  • the signal containing sound information may come from the storage component 108 of the acoustic device 100 itself, or may come from an information generation, storage or transmission system other than the acoustic device 100.
  • the signal containing sound information may include one or a combination of electrical signals, optical signals, magnetic signals, and mechanical signals.
  • the signal containing sound information can come from one source or multiple sources. Multiple signal sources can be related or unrelated.
  • the acoustic device 100 acquires the signal containing sound information in a variety of different ways, and the acquisition of the signal may be wired or wireless, and may be real-time or delayed.
  • the acoustic device 100 may receive electrical signals containing sound information in a wired or wireless manner, or may directly obtain data from a storage medium (for example, the storage component 108) to generate sound signals.
  • a bone conduction hearing aid may include a component with a sound collection function, by picking up the sound in the environment, converting the mechanical vibration of the sound into an electrical signal, and processing it through an amplifier to obtain an electrical signal that meets specific requirements.
  • the wired connection may include a metal cable, an optical cable, or a hybrid cable of metal and optical, for example, a coaxial cable, a communication cable, a flexible cable, a spiral cable, a non-metal sheathed cable, and a metal sheathed cable.
  • the examples described above are only used for convenience of description, and the wired connection medium may also be other types, for example, other transmission carriers of electrical signals or optical signals.
  • Wireless connections can include radio communication, free-space optical communication, acoustic communication, and electrical induction, etc.
  • radio communication can include IEEE802.11 series standards, IEEE802.15 series standards (such as Bluetooth technology and Zigbee technology, etc.), first-generation mobile communication technology, second-generation mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, And SSMA, etc.), general packet radio service technology, third-generation mobile communication technology (such as CDMA2000, WCDMA, TD-SCDMA, and WIMAX, etc.), fourth-generation mobile communication technology (such as TD-LTE and FDD-LTE, etc.), Satellite communication (such as GPS technology, etc.), near field communication (NFC) and other technologies operating in the ISM frequency band (such as 2.4GHz, etc.); free space optical communication can include visible light, infrared signals, etc.; acoustic communication can include sound waves, ultrasonic signals Etc.; electromagnetic induction can include near field communication technology and so on.
  • the wireless connection medium can also be of other types, such as Z-wave technology, other fee-based civil radio frequency bands, and military radio frequency bands.
  • the acoustic device 100 may obtain signals containing sound information from other devices through Bluetooth technology.
  • the vibration component 104 can generate mechanical vibration.
  • the generation of vibration is accompanied by the conversion of energy.
  • the speaker 100 can use a specific magnetic circuit component 102 and a vibration component 104 to convert a signal containing sound information to mechanical vibration.
  • the conversion process may include the coexistence and conversion of multiple different types of energy.
  • the electrical signal can be directly converted into mechanical vibration through the transducer device to produce sound.
  • sound information can be contained in an optical signal, and a specific transducer device can realize the process of converting the optical signal into a vibration signal.
  • Other types of energy that can coexist and convert during the working process of the transducer include thermal energy, field energy, and so on.
  • the energy conversion mode of the energy conversion device may include a moving coil type, an electrostatic type, a piezoelectric type, a moving iron type, a pneumatic type, an electromagnetic type, and the like.
  • the frequency response range and sound quality of the acoustic device 100 will be affected by the vibration component 104.
  • the vibrating component 104 includes a wound cylindrical voice coil and a vibrating body (for example, a vibrating plate or a vibrating membrane), and the cylindrical voice coil driven by a signal current drives the vibrating body in a magnetic field.
  • the vibrating body in the vibrating assembly 104 can be a mirror-symmetrical structure, a center-symmetrical structure, or an asymmetrical structure.
  • the vibrating body can be provided with an intermittent hole-like structure to make the vibrating body produce greater displacement, thereby allowing the speaker to achieve higher Sensitivity, to improve the output power of vibration and sound;
  • the vibrating body can be a torus structure, and a plurality of struts converging toward the center are arranged in the torus, and the number of struts can be two or more.
  • the supporting component 106 can support the magnetic circuit component 102, the vibration component 104 and/or the storage component 108.
  • the support assembly 106 may include one or more housings and one or more connectors.
  • the one or more housings may form a receiving space for accommodating the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108.
  • the one or more connectors can connect the housing with the magnetic circuit assembly 102, the vibration assembly 104 and/or the storage assembly 108.
  • the storage component 108 can store a signal containing sound information.
  • the storage component 108 may include one or more storage devices.
  • the storage device may include storage devices on storage systems such as Direct Attached Storage (Direct Attached Storage), Network Attached Storage (Network Attached Storage), and Storage Area Network (Storage Area Network).
  • Storage devices can include various storage devices such as solid-state storage devices (solid-state hard drives, solid-state hybrid hard drives, etc.), mechanical hard drives, USB flash memory, memory sticks, memory cards (such as CF, SD, etc.), and other drives (such as CD, DVD, HD, etc.) DVD, Blu-ray, etc.), random access memory (RAM) and read only memory (ROM).
  • RAM can include decimal counter, selection tube, delay line memory, Williams tube, dynamic random access memory (DRAM), static random access memory (SRAM), thyristor random access memory (T-RAM), and zero capacitance random access Memory (Z-RAM), etc.
  • ROM can include magnetic bubble memory, magnetic button line memory, thin film memory, magnetic plating line memory, magnetic core internal capture, magnetic drum memory, optical disk drive, hard disk, magnetic tape, early NVRAM nonvolatile memory ), phase change memory, magnetoresistive random storage memory, ferroelectric random storage memory, non-volatile SRAM, flash memory, electronic erasable rewritable read-only memory, erasable programmable read-only memory, programmable column only Read memory, screen knock-type heap read memory, floating connection door random access memory, nano random access memory, racetrack memory, variable resistance memory, and programmable metallization unit, etc.
  • the storage device/storage unit mentioned above is a list of some examples, and the storage devices that can be used by the storage device/stor
  • the acoustic device 100 may include one or more processors, which may execute one or more sound signal processing algorithms.
  • the sound signal processing algorithm can modify or enhance the sound signal.
  • the acoustic device 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, and so on. The sensor can collect user information or environmental information.
  • the storage component 108 may not be necessary, and may be removed from the acoustic device 100.
  • Fig. 2 is a schematic structural diagram of an exemplary acoustic device according to some embodiments of the present application.
  • the acoustic device 1 may include a housing 11, a speaker assembly 12 and a protective element 13.
  • the speaker assembly 12 may be arranged in the housing 11.
  • the protective element 13 may be supported on the housing 11 to protect the speaker assembly 12.
  • the housing 11 has an accommodating cavity 110 (may also be referred to as a first accommodating cavity), and the accommodating cavity 110 is used to place the speaker assembly 12, that is, the speaker assembly 12 is disposed in the accommodating cavity 110.
  • the side of the housing 11 facing the open end 111 of the accommodating cavity 110 is close to the user's head, and the mechanical vibration generated by the speaker assembly 12 can be directed toward the open end through the housing.
  • One side of 111 passes to the user's head.
  • the inner wall of the housing 11 is provided with an annular bearing platform 112, and the inner wall of the housing 11 refers to the inner wall of the accommodating cavity 110 of the housing 11.
  • the annular bearing platform 112 may be provided at a position close to the open end 111 in the inner wall.
  • the ring-shaped platform 112 may be disposed on the inner wall of the housing above the speaker assembly 12.
  • the annular bearing platform 112 may be used to support the protective element 13. By arranging the protective element 13 on the annular platform 112, the protective element 13 can shield or substantially shield the open end 111, thereby protecting the speaker assembly 12 in the accommodating cavity 110.
  • the speaker assembly 12 may include a magnetic circuit assembly (not shown in the figure), a voice coil (not shown in the figure), a vibration assembly (not shown in the figure), and a vibration transmission plate 121.
  • the magnetic circuit component forms a magnetic gap, at least part of the voice coil is arranged in the magnetic gap, the other end of the voice coil is physically connected to the vibration component, the vibration component is physically connected to the vibration plate 121, and the vibration plate 121 is physically connected to the housing 11.
  • the magnetic circuit component can form a magnetic field, and the voice coil is located in the magnetic gap, that is, in the magnetic field formed by the magnetic circuit component, and will be subjected to Ampere force.
  • Ampere force drives the voice coil to vibrate, which in turn drives the vibration component to produce mechanical vibration.
  • the vibration component transmits the vibration to the vibration transmission plate 121, and the vibration transmission plate 121 transmits the vibration to the housing 11, and finally makes the housing 11 pass the vibration through the tissues of the human body and The bones are transmitted to the auditory nerve, allowing the user to hear the sound.
  • the vibration transmission plate 121 and at least part of the housing 11 may also be referred to as components in the vibration assembly.
  • the magnetic circuit component, the voice coil, and the vibration component may be disposed in the accommodating cavity 110.
  • the vibration transmission plate 121 is connected with the vibration component, and is exposed outside the accommodating cavity 110 through the open end. By exposing the vibration transmission plate 121 to the outside of the accommodating cavity 110, the vibration transmission plate 121 can be made closer to the user's head, and the vibration of the exposed vibration transmission plate 121 can be transmitted to the user's bones more quickly and more effectively. In turn, the mechanical vibration transmitted to the human ear is more complete, and the frequency band is not easily lost, which effectively improves the hearing effect of the hearing impaired.
  • the protection element 13 may be arranged above the opening end 111 and attached to the outer end surface of the vibration transmission plate 121.
  • the protective element 13 may include a fitting portion 131 (ie, a bottom portion), a receiving portion 132 (ie, a side wall), and a supporting portion 133 (for example, a ring-shaped supporting portion, that is, an extension portion).
  • the fitting portion 131 and the accommodating portion 132 form an accommodating cavity (may also be referred to as a second accommodating cavity, for example, a cylindrical accommodating cavity), the vibration transmission plate 121 can be disposed in the second accommodating cavity, and the fitting portion 131 is attached to the outer end surface of the vibration transmission plate 121, and the supporting portion 133 is connected to the accommodating portion 132 and is arranged above the housing 11.
  • the outer end surface of the vibration transmission plate 121 refers to the end surface away from the accommodating cavity 110 or away from the vibration component.
  • the protective element 13 can be covered above the opening end 111, and the vibration transmission plate 121 exposed outside the accommodating cavity 110 can be extended into the second accommodating cavity, thereby transmitting the vibration
  • the outer end surface of the plate 121 is bonded to the bonding portion 131.
  • the supporting portion 133 may be disposed above the annular platform 112.
  • the protective element 13 may include a protective gauze. Through the mesh structure of the protective gauze, during the process of mechanical vibration of the speaker assembly 12, the air inside and outside the accommodating cavity 110 is circulated to balance the air pressure difference between the inside and the outside of the accommodating cavity 110, thereby reducing the inside of the accommodating cavity 110. The sound generated by the vibration of the air attenuates the sound generated by the air vibration near the vibration transmission plate 121, reduces the sound leakage phenomenon, and improves the sound quality and sound effect of the overall acoustic device 1.
  • the acoustic device 1 may include an upper cover 14 (for example, an annular upper cover), and an upper cover 14 It is used to press the supporting portion 133 on the annular platform 112. In this way, the protective element 13 can be stably installed (or supported) on the ring-shaped platform 112, and the falling of the supporting portion 133 can be reduced.
  • an upper cover 14 for example, an annular upper cover
  • Fig. 3A is a schematic diagram showing the disassembled structure of the acoustic device in Fig. 2 according to some embodiments of the present application
  • Fig. 3B is a schematic cross-sectional structure diagram of the acoustic device in Fig. 3A according to some embodiments of the present application
  • the acoustic device 300 may include a housing 11 and a speaker assembly 12.
  • the speaker assembly 12 may be arranged in the housing 11.
  • the speaker assembly 12 may include a vibration transmission plate 121, a vibration assembly, a magnetic circuit assembly, and a voice coil 124.
  • the magnetic circuit assembly may include a first magnetic circuit assembly 1231 and a second magnetic circuit assembly 1232 (for example, a magnetic conductive cover).
  • the first magnetic circuit assembly 1231 may include one or more magnetic elements and/or one or more magnetically conductive elements.
  • the second magnetic circuit assembly 1232 may include one or more magnetic elements and/or one or more magnetically conductive elements.
  • the magnetic element of the magnetic circuit assembly may have a corresponding magnetization direction, so as to form a relatively stable magnetic field.
  • a magnetic element refers to an element that can generate a magnetic field.
  • the magnetic element may include a single magnet or a combination of multiple magnets.
  • the second magnetic circuit component 1232 is used to adjust the magnetic field generated by the first magnetic circuit component 1231 to increase the utilization rate of the magnetic field.
  • the vibration component may be physically connected to the second magnetic circuit component 1232.
  • FIG. 3A uses the second magnetic circuit assembly 1231 as a magnetic conductive cover for description.
  • the magnetic conductive cover may include a cover bottom 12321, a cover side 12322, and a cylinder groove 12323, and the cover bottom 12321 and the cover side 12322 form a cylinder groove 12323.
  • the side portion 12322 of the cover body may be provided in a cylindrical shape.
  • the first magnetic circuit component 1231 is disposed in the cylindrical groove 12323 and forms a magnetic gap with the magnetic conductive cover 1232.
  • at least part of the voice coil 124 is in the magnetic gap, that is, the voice coil 124 is in the magnetic field formed between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232, so that the voice coil 124 can be in the electric signal (for example, The ampere force is generated under the excitation of the audio signal), which in turn drives the vibration transmission plate 121 to generate mechanical vibration.
  • the first magnetic circuit assembly 1231 includes one or more magnetic elements and/or one or more magnetically conductive elements, which are disposed on or inside the first magnetic circuit assembly 1231. For more description of the first magnetic circuit assembly 1231, please refer to the detailed description in FIG. 6-64.
  • the first magnetic circuit assembly 1231 is physically connected to the magnetic conductive cover 1232.
  • the magnetic conductive cover 1232 may be connected to the cover of the magnetic conductive cover 1232 through one or a combination of magnetic attraction, adhesive bonding, snap connection, and threaded connection.
  • the acoustic device 300 includes a fixing member 126 for fixing the first magnetic circuit assembly 1231 to the bottom 12321 of the cover.
  • the fixing member 126 may include a bolt 1261 and a nut 1262.
  • the bolt 1261 passes through the first magnetic circuit assembly 1231 and then passes through the bottom 12321 of the cover body to connect the first magnetic circuit assembly 1231 and the cover body through a threaded connection.
  • the bottom 12321 is fixedly connected.
  • the nut 1262 can also be arranged on the side of the cover bottom 12321 away from the barrel groove 12323, and the relative fixation between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 can also be achieved.
  • the fixing member 126 can connect the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 together.
  • a colloid 3A and 3B are not shown, so that the gap between the two can be filled, and the relative fixation of the two is more stable, so as to prevent the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 from occurring under mechanical vibration The relative movement causes the acoustic device 300 to generate noise.
  • the first magnetic circuit component 1231 and the magnetic conductive cover 1232 are relatively fixed, there is a gap (not marked in FIG. 3A) between the first magnetic circuit component 1231 and the magnetic conductive cover 1232 for accommodating the voice coil 124.
  • the magnetic field generated by the first magnetic circuit assembly 1231 may be distributed in the gap (also referred to as a magnetic gap).
  • the size of the magnetic gap is as the same as possible to increase the uniformity of the magnetic field distribution, thereby increasing the smoothness of vibration of the voice coil 124 under the action of the magnetic field.
  • the distance between the voice coil 124 and the first magnetic circuit assembly 1231 or the magnetic conductive cover 1232 is equal everywhere.
  • the coaxiality of the first magnetic circuit assembly 1231, the magnetic cover 1232, and the voice coil 124 can be guaranteed.
  • the vibration assembly may include an inner bracket 1221, an outer bracket 1222, and a vibrating plate 1223.
  • One end of the outer bracket 1222 is physically connected to both sides of the magnetic circuit assembly (for example, the cover side part 12322 of the magnetic conductive cover 1232).
  • the physical connection may include one or more combinations of magnetic attraction, snap connection, and threaded connection.
  • one end of the outer bracket 1222 may be integrally formed with both sides of the magnetic circuit assembly (for example, the cover side portion 12322 of the magnetic conductive cover 1232).
  • one end of the outer bracket 1222 is integrally formed with both sides of the magnetic circuit assembly (for example, the cover side portion 12322 of the magnetic conductive cover 1232) by injection molding.
  • the outer bracket 1222 and the components in the magnetic circuit assembly for example, the side part 12322 of the magnetic conductive cover 1232) as an integral part, the assembly error of the outer bracket 12222 and the magnetic circuit assembly can be effectively reduced to ensure both ⁇ coaxiality.
  • One end of the inner bracket 1221 is physically connected to the voice coil 124.
  • the voice coil 124 is subjected to ampere force in the magnetic field formed by the magnetic circuit assembly, and the ampere force drives the voice coil 124 to vibrate, and the inner bracket 1221 connected to the voice coil 124 will vibrate.
  • the inner bracket 1221 and the outer bracket 1222 are connected by a vibrating plate 1223, so the outer bracket 1222 and the vibrating plate 1223 will also vibrate.
  • at least one of the inner bracket 1221, the outer bracket 1222, and the vibration plate 1223 is connected to the vibration transmission plate 121 so that vibration is transmitted to the vibration transmission plate 121.
  • the vibrating plate 1223 physically connects the inner bracket 1221 and the outer bracket 1222, and can be used to restrict the relative movement of the inner bracket 1221 and the outer bracket 1222 in the first direction; the first direction is the radial direction of the accommodating cavity 110 . Since the vibrating plate 1223 is connected to the inner bracket 1221 and the outer bracket 1222, the assembly error of the outer bracket 1222 will also cause the assembly error between the inner bracket 1221 and the magnetic circuit assembly, which in turn leads to the smoothness of the voice coil 124 vibration under the action of the magnetic field. Decrease, that is, the smoothness of the mechanical vibration generated by the vibration component driven by the voice coil 124 becomes worse, which in turn affects the sound quality of the acoustic device 300.
  • the outer bracket 1222 and/or the inner bracket 1221 are movably connected to the vibrating plate 1223 to limit the relative movement of the outer bracket 1222 and the inner bracket 1221 in the first direction, while allowing the inner bracket 1221 and the vibrating plate 1223 It moves relative to the outer bracket 1222 in the second direction; the second direction is the extension direction of the inner bracket 1221 and the outer bracket 1222.
  • the outer bracket 1222 can be movably connected to the vibrating plate 1223.
  • that the first element for example, the outer bracket 1222
  • the second element means that the first element and the second element can move relative to each other through the connecting portion.
  • the end of the outer bracket 1222 away from the magnetic circuit assembly is provided with a first protrusion 12221
  • the vibrating plate 1223 is provided with a first through hole 12231
  • the first protrusion 12221 passes through the first protrusion 12221.
  • a through hole 12231 is movably connected to the vibrating plate 1223, that is, the vibrating plate 1223 can move up and down along the first protrusion 12221.
  • the first protrusion 12221 fits with the first through hole 12231.
  • the first protrusion 12221 can movably pass through the first through hole 12231.
  • the number of the first protrusion 12221 and the first through hole 12231 may be multiple.
  • the inner bracket 1221 is movably connected to the vibrating plate 1223.
  • one end of the inner bracket 1221 may be provided with a second protrusion 12211
  • the vibrating plate 1223 is provided with a second through hole 12232
  • the second protrusion 12211 is movably connected to the vibrating plate 1223 through the second through hole 12232.
  • the first protrusion 12221 is matched with the first through hole 12231 and the second protrusion 12211 is matched with the second through hole 12232, which can restrict the relative movement of the outer bracket 1222 and the inner bracket 1221 in the first direction. , And allow the inner bracket 1221 and the vibrating plate to move relative to the outer bracket 1222 in the second direction 1223, so as to transmit the mechanical vibration generated by the vibrating assembly away.
  • Other parts of the inner bracket 1221 can be fixedly connected to the vibrating plate at 1223, so that the inner bracket 1221 can transmit the vibration to the vibrating plate 1223 through the inner bracket 1221 under the vibration of the voice coil.
  • the first element for example, the inner bracket 1221
  • the second element means that the first element and the second element cannot move relative to each other through the connecting part, that is, the first element and the second element are connected through The part remains relatively static.
  • the vibrating plate 1223 may include a ring-shaped edge portion 12233 and one or more ribs 12234 connected to the ring-shaped edge portion 12233.
  • the ring-shaped edge portion 12233 is provided with a first through hole 12231.
  • the side of the inner bracket 1221 facing the vibration transmission plate 121 may be provided with a through groove (not shown) corresponding to the rib 12234.
  • the rib 12234 may be received in the through groove, thereby restricting the outer bracket 1222 and the inner bracket 1221 along the first
  • the relative movement in the direction allows the inner bracket 1221 and the vibrating plate 1223 to move relative to the outer bracket 1222 in the second direction; the second direction is the extension direction of the inner bracket 1221 and the outer bracket 1222.
  • Fig. 3C is a schematic structural diagram of a vibrating plate according to some embodiments of the present application.
  • the vibrating plate 1223 may further include an annular middle portion 12235, one or more ribs 12234 connected between the annular edge portion 12233 and the annular middle portion 12235.
  • the annular middle portion 12235 is provided with a second through hole 12232, and the position of the second protrusion 12211 corresponds to the position of the second through hole 12232 (not limited to the situation shown in FIG. 3A).
  • the annular edge portion 12233 is provided with a first through hole 12231, and the position of the first protrusion 12221 corresponds to the position of the first through hole 12231.
  • the speaker assembly 12 may include an elastic damping sheet 125 disposed between the vibration transmission plate 121 and one end of the inner bracket 1221 to reduce the vibration of the inner bracket 1221 in the second direction.
  • the second protruding column 12211 may include a first column section 12212 and a second column section 12213 that are physically connected. As shown in FIG. 3A, the second column section 12213 is arranged above the first column section 12212; the first column section 12212 penetrates through the second through hole 12232, and the second column section 12213 is inserted into the vibration transmission plate 121; The shock-absorbing sheet 125 is provided with a third through hole 1251, and the elastic shock-absorbing sheet 125 is sleeved on the second column section 12213 through the third through hole 1251, and is supported on the first column section 12212.
  • first column section 12212 and the second column section 12213 are integrally formed, and the cross-sectional area of the second column section 12213 is smaller than the cross-sectional area of the first column section 12212.
  • the outer edge of the elastic damping sheet 125 may be connected to the housing 11. In some embodiments, the outer edge of the elastic damping sheet 125 may be disposed between the housing 11 and the protective element (not shown in the figure, refer to the protective element 13 in FIG. 2). Specifically, the outer edge of the elastic damping sheet 125 may be fixedly connected to the housing 11, and the protective element may be fixedly connected to the elastic damping sheet 125.
  • the elastic damping sheet 125 may be clamped between the annular bearing platform provided on the inner wall of the housing 11 and the support portion of the protective element (not shown in the figure, refer to the support portion 133 in FIG. 2) ,
  • the ring-shaped bearing platform can support the elastic shock-absorbing sheet 125.
  • the inner surface of the support portion may be adhesively connected to the elastic shock-absorbing sheet 125, and the elastic shock-absorbing sheet 125 may be glued to the annular bearing platform.
  • the elastic shock-absorbing sheet 125 can be clamped between the ring-shaped bearing platform and the supporting part, and the ring-shaped bearing platform can support the elastic shock-absorbing sheet 125.
  • the outer surface of the support portion may be adhesively connected to the elastic shock-absorbing sheet 125, and the elastic shock-absorbing sheet 125 may be glued to the annular bearing platform.
  • the elastic damping sheet 125 may be clamped between the second cover body (not shown in the figure, refer to the second cover body 142 in FIG. 2) of the upper cover and the annular bearing platform,
  • the ring-shaped platform can support the elastic damping sheet 125.
  • the elastic shock-absorbing sheet 125 may be fixed to the second cover and the ring-shaped bearing platform respectively through adhesive connection.
  • the smoothness of the vibration of the vibration transmission plate 121 can be increased.
  • the inner bracket 1221 forms a cover groove 12214. In some embodiments, the end of the inner bracket 1221 facing the first magnetic circuit assembly 1231 forms a cover groove 12214. The first magnetic circuit assembly 1231 partially extends into the cover groove 12214. In some embodiments, one end of the inner bracket 1221 (the end facing the first magnetic circuit assembly 1231) is covered on the first magnetic circuit assembly 1231, so that the first magnetic circuit assembly 1231 can partially extend into the cover slot 12214. With this arrangement, while meeting the sound production requirements of the speaker assembly 12, the size of the speaker assembly 12 in the extension direction of the inner and outer brackets can be compressed, which is beneficial to control the overall size of the speaker assembly 12.
  • Fig. 4 is a schematic longitudinal cross-sectional view of a bone conduction acoustic device according to some embodiments of the present application.
  • the bone-borne acoustic device 400 may include a magnetic circuit component (not shown in the figure), a vibration component 403, and a voice coil 404.
  • the magnetic circuit assembly may include a first magnetic circuit assembly 401 and a second magnetic circuit assembly 402.
  • the second magnetic circuit assembly 402 is arranged around the first magnetic circuit assembly 401 to form a magnetic gap, and the voice coil 404 may be arranged at In the magnetic gap, the voice coil 404 is connected to the vibration component 403.
  • At least one of the first magnetic circuit assembly 401 and the second magnetic circuit assembly 402 may include a magnetic element and/or a magnetically conductive element.
  • the intensity and distribution of the magnetic field in the magnetic gap can be changed by the combination and position change of the magnetic element and the magnetic conductive element, and by setting the magnetization direction of each magnetic element.
  • the first magnetic circuit assembly may include a first magnetic element and a second magnetic element.
  • the total magnetic field generated by the magnetic circuit assembly in the magnetic gap has a greater magnetic field strength than the first magnetic element or the second magnetic element in the magnetic gap.
  • the magnetization directions of the first magnetic element and the second magnetic element are opposite.
  • the angle between the magnetization directions of the first magnetic element and the second magnetic element is 150-180 degrees.
  • the angle between the magnetization directions of the first magnetic element and the second magnetic element may be equal to, for example, 150°, 170°, or 180°.
  • the magnetization directions of the first magnetic element and the second magnetic element are both perpendicular or parallel to the vibration direction of the voice coil in the magnetic gap, and the magnetization directions are opposite.
  • the vibration direction of the voice coil in the magnetic gap refers to the vibration direction of the voice coil at a certain moment.
  • the first magnetic element and the second magnetic element may be along the direction of the voice coil in the magnetic gap.
  • the vibration directions are stacked; if the magnetization directions of the first magnetic element and the second magnetic element are perpendicular to the vibration direction of the voice coil in the magnetic gap, the first magnetic element and the second magnetic element can vibrate along the voice coil in the magnetic gap
  • the direction is perpendicular to the stack.
  • the first magnetic circuit assembly includes a first magnetic element, a second magnetic element, and a first magnetic permeable element
  • the second magnetic circuit assembly may include a third magnetic element.
  • the first magnetic element is arranged between the first magnetic element and the second magnetic element
  • the third magnetic element is arranged at least partially around the first magnetic element and the second magnetic element.
  • the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface connecting the first magnetic element and the first magnetic element, and the magnetization direction of the first magnetic element is the same as that of the second magnetic element.
  • the magnetization direction of the element is opposite to the magnetization direction.
  • the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element may be in the range of 60-120 degrees, and/or 0-30 degrees .
  • first magnetic element of the first magnetic circuit assembly and the third magnetic element of the second magnetic circuit assembly please refer to Figures 6, 8, 34, 36, 38, 40, 42, 54 and / Or 56.
  • the first magnetic component may include a first magnetic element, a second magnetic element, and a second magnetic element
  • the second magnetic component includes the first magnetic element
  • the second magnetic element is disposed on the first magnetic element And the second magnetic element
  • the first magnetic element at least partially surrounds the first magnetic element and the second magnetic element.
  • the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface connecting the first magnetic element and the first magnetic element, and the magnetization direction of the first magnetic element is the same as that of the second magnetic element.
  • the magnetization direction of the element is opposite to the magnetization direction.
  • the second magnetic element is arranged to surround the first magnetic element, and the first magnetic element surrounds the second magnetic element.
  • the upper surface of the second magnetic element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic element is connected to the upper surface of the second magnetic element.
  • the first magnetic element and the second magnetic element can be stacked along the vibration direction of the voice coil in the magnetic gap, the upper surface of the second magnetic element is connected to the lower surface of the first magnetic element, and the second magnetic element The lower surface of the magnetic element is connected to the upper surface of the second magnetic element.
  • the outer wall of the second magnetic element connects the first magnetic element and the second magnetic element. The inner surface of the magnetic element.
  • the inner surface (or inner wall or inner ring or inner region) of the magnetic element refers to the surface that is substantially parallel to the vibration direction of the voice coil in the magnetic gap and away from the voice coil.
  • the outer surface (or outer wall or outer ring or outer area) of the magnetic element refers to the surface approximately parallel to the vibration direction of the voice coil in the magnetic gap and close to the voice coil;
  • the inner surface of the magnetic element refers to the surface approximately parallel to the voice coil The direction of vibration in the magnetic gap and away from the surface of the voice coil;
  • the upper surface (ie, the top surface) of the magnetic element refers to the surface that is substantially perpendicular to the direction of vibration of the voice coil in the magnetic gap and close to the vibrating plate;
  • the lower surface of the magnetic element The surface (ie, the bottom surface) refers to the surface that is substantially perpendicular to the vibration direction of the voice coil in the magnetic gap and away from the sound vibration plate.
  • the first magnetic circuit assembly may include a first magnetic element
  • the second magnetic circuit assembly may include a first magnetically permeable element; the first magnetically permeable element at least partially surrounds the first magnetic element; The magnetization direction is directed from the central area (or inner area) of the first magnetic element to the outer area of the first magnetic element or from the outer area of the first magnetic element to the central area (or inner area) of the first magnetic element.
  • the first magnetic element is ring-shaped.
  • the first magnetic element is cylindrical.
  • the first magnetic circuit assembly may include a first magnetic element
  • the second magnetic circuit assembly may include a second magnetic element
  • the second magnetic element at least partially surrounds the first magnetic element
  • the magnetization direction of the first magnetic element The central area (or inner area) of the first magnetic element points to the outer area of the first magnetic element or the outer area of the first magnetic element points to the central area (or inner area) of the first magnetic element.
  • the magnetization direction of the second magnetic element is directed from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the inner ring of the second magnetic element.
  • the magnetic element described in this application refers to an element that can generate a magnetic field, such as a magnet.
  • the magnetic element may have a magnetization direction, and the magnetization direction refers to the direction of the magnetic field inside the magnetic element, that is, the direction of the magnetic line of force inside the magnetic element or the S pole of the magnetic element points to the N pole direction.
  • the above-mentioned magnetic element may include one or more magnets. For example, two magnets.
  • the magnets may include metal alloy magnets, ferrites, and the like.
  • the metal alloy magnet may include neodymium iron boron, samarium cobalt, aluminum nickel cobalt, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or a combination of multiple thereof.
  • the ferrite may include barium ferrite, steel ferrite, magnesium manganese ferrite, lithium manganese ferrite, or the like, or a combination thereof.
  • the permeable magnet mentioned here can also be called a magnetic field concentrator or an iron core.
  • the permeable magnet can adjust the distribution of the magnetic field generated by the magnetic element.
  • the magnetic conductor may include an element processed from a soft magnetic material.
  • the soft magnetic material may include metal materials, metal alloys, metal oxide materials, amorphous metal materials, etc., such as iron, iron-silicon-based alloys, iron-aluminum-based alloys, nickel-iron-based alloys, iron-cobalt Series alloys, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc.
  • the magnetizer can be processed by one or a combination of methods such as casting, plastic processing, cutting processing, and powder metallurgy. Casting can include sand casting, investment casting, pressure casting, centrifugal casting, etc.; plastic processing can include one or more combinations of rolling, casting, forging, stamping, extrusion, drawing, etc.; cutting processing can include turning, milling, etc.
  • the processing method of the magnetizer may include 3D printing, CNC machine tools, and the like.
  • the connection between the magnetic element and the magnetic element may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the magnetic element and the magnetically permeable element may be arranged in an axisymmetric structure.
  • the axisymmetric structure may be a ring structure, a columnar structure, or other axisymmetric structure.
  • the voice coil 404 when current is applied to the voice coil 404, the voice coil 404 is located in the magnetic field formed by the first magnetic circuit component 401 and the second magnetic circuit component 402, and will be subjected to ampere force.
  • the ampere force drives the voice coil 404 to vibrate, thereby driving the vibration component 403 to vibrate.
  • the vibration component 403 transmits the vibration to the auditory nerve through the tissues and bones, so that people can hear the sound.
  • the vibration component 403 can be in direct contact with human skin, or can be in contact with the skin through a vibration transmission layer composed of a specific material.
  • FIGS. 2-3C For more description of the vibration component 403, please refer to the detailed description of FIGS. 2-3C.
  • Fig. 5 is a schematic longitudinal cross-sectional view of an air conduction acoustic device according to some embodiments of the present application.
  • the air conduction acoustic device may include a first magnetic circuit component 501, a diaphragm 503, and a voice coil 504.
  • the diaphragm 503 at least partially surrounds the first magnetic circuit component 501, a magnetic gap is formed between the first magnetic circuit component 501 and the diaphragm 503, the voice coil 504 may be arranged in the magnetic gap, and the diaphragm 503 is connected to the voice coil 504 .
  • the diaphragm 503 may be connected to the housing (or bracket) of the air conduction speaker through one or more folding rings.
  • the first magnetic circuit assembly 501 and the vibrating film 503 may include magnetic elements and/or magnetically conductive elements.
  • the intensity of the magnetic field in the magnetic gap and the distribution of the intensity can be changed through the combination and position change of the magnetic element and the permeable element, as well as the setting of the magnetization direction of each magnetic element.
  • the voice coil 504 will vibrate in the magnetic gap after being subjected to ampere force, and the vibration of the voice coil 504 will drive the diaphragm 503 to vibrate, thereby pushing the air to vibrate, so that people can hear the sound.
  • the bone conduction acoustic device may include a housing and a connector.
  • the connecting piece connects the vibrating plate and the shell.
  • the air conduction speaker may include a non-metallic shell, and the voice coil is connected to the non-metallic shell through a folding ring.
  • Fig. 6 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application
  • Fig. 7 is a schematic diagram of a magnetic field intensity change of the magnetic circuit assembly shown in Fig. 6 according to this specification.
  • the magnetic circuit assembly 600 may include a first magnetic element 601, a second magnetic element 602, a third magnetic element 603 and a first magnetically permeable element 604.
  • the first magnetic element 604 is arranged between the first magnetic element 601 and the second magnetic element 602, and the third magnetic element 603 is arranged at least partially around the first magnetic element 601 and the second magnetic element 602.
  • a magnetic gap is formed between the first magnetic element 601 and the second magnetic element 602 and the third magnetic element 603.
  • the magnetization directions of the first magnetic element 601 and the second magnetic element 602 are both perpendicular to the surface of the first magnetic element 604 connected to the first magnetic element 601 and/or the second magnetic element 602 (ie, in the figure) In the vertical direction, the arrow direction on each magnetic element in the figure indicates the magnetization direction of the magnetic element), and the magnetization directions of the first magnetic element 601 and the second magnetic element 602 are opposite.
  • the placement of the first magnetic element 601 and the second magnetic element 602 may include that the same magnetic pole of the first magnetic element 601 and the second magnetic element 602 is close to the first magnetic permeable element 604; and different magnetic poles are far away from the first magnetic element. Permeable element 604.
  • the N pole of the first magnetic element 601 is closer to the first magnetic permeable element 604 than the S pole of the first magnetic element 601 and the N pole of the second magnetic element 602 is closer to the first magnetic element 604 than the S pole of the second magnetic element 602.
  • the magnetic line of induction or the direction of the magnetic field (that is, the S pole points to the N pole direction) are all directed to the first magnetic permeable element 604.
  • the S pole of the first magnetic element 601 is closer to the first magnetic permeable element 604 than the N pole of the first magnetic element 601 and the S pole of the second magnetic element 602 is closer to the first magnetic element 604 than the N pole of the second magnetic element 602. That is, inside the first magnetic element 601 and the second magnetic element 602, the magnetic field lines or the direction of the magnetic field (that is, the S pole points to the N pole direction) are all away from the first magnetic conductive element 604.
  • the first magnetic element 601 and the second magnetic element 602 By setting the magnetization directions of the first magnetic element 601 and the second magnetic element 602 to vertical and opposite directions, so that the first magnetic element 601 and the second magnetic element 602 are oppositely magnetized, the first magnetic element
  • the magnetic lines of induction generated by the 601 and the second magnetic element 602 have approximately the same direction in the magnetic gap, for example, they are both from the first magnetic element 604 to the third magnetic element 603;
  • a magnetic element 604 increases the intensity of the magnetic field in the magnetic gap.
  • the magnetic field generated by the first magnetic element 601 and the second magnetic element 602 in the magnetic gap can be suppressed to make the magnetic field
  • the corresponding magnetic lines of force extend horizontally in the magnetic gap.
  • the magnetic line of force or the direction of the magnetic field inside the first magnetic element 601 and the second magnetic element 602 that is, the S pole points to the N pole direction
  • the magnetic line of force can start from the first magnetically permeable element.
  • the end of the element 604 extends into the magnetic gap along the horizontal or close to the horizontal direction; when the magnetic line of force or the direction of the magnetic field inside the first magnetic element 601 and the second magnetic element 602 (that is, the S pole points to the N pole direction) are both Away from the first magnetically permeable element 604, the magnetic lines of induction extend from the magnetic gap to the end of the first magnetically permeable element 604 in a horizontal or close to horizontal direction.
  • the magnetization direction of the third magnetic element 603 is perpendicular to the magnetization direction of the first magnetic element 601 or the second magnetic element 602.
  • the magnetic lines of induction in the magnetic gap can be further guided to extend along the horizontal or close to the horizontal direction. For example, when the magnetic line of force or the direction of the magnetic field inside the first magnetic element 601 and the second magnetic element 602 (that is, the N pole points to the S pole direction) are all directed to the first magnetically permeable element 604, the magnetic line of force can start from the first magnetically permeable element.
  • the end of the element 604 extends along the horizontal or close to the horizontal direction into the magnetic gap and passes through the third magnetic element 603; when the first magnetic element 601 and the second magnetic element 602 inside the magnetic line of force or the direction of the magnetic field (ie S The poles point to the N-pole direction) are away from the first magnetic element 604, and the magnetic lines of induction pass through the third magnetic element 603 and extend from the magnetic gap to the end of the first magnetic element 604 in a horizontal or nearly horizontal direction.
  • the direction of the magnetic field at the position of the voice coil in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, which improves the uniformity and strength of the magnetic field, and can effectively improve the sound effect generated by the voice coil vibration.
  • the magnetization direction of each magnetic element can also be other directions, and the combination of magnetic elements with different magnetization directions can also increase the intensity of the magnetic field and/or make the intensity distribution of the magnetic field. More uniform effect.
  • the vertical direction can be understood as the direction in which the voice coil vibrates, that is, the direction perpendicular to the plane where the top surface of the first magnetic element 601 is located.
  • the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 may be set not to be perpendicular to each other, and there may be a preset angle between the magnetization directions of the two. . Among them, the preset included angle can be set within a certain angle range. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 60 degrees and 120 degrees.
  • the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 50 degrees and 130 degrees. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 0 degrees and 30 degrees. For example, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 may be equal to 0°, 60°, 80°, 90°, 100°, 180° and so on.
  • the magnetization direction of the first magnetic element 601 and the magnetization direction of the second magnetic element 602 may also have a preset angle. In some embodiments, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 is between 150 degrees and 180 degrees. For example, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 may be equal to, for example, 170°, 180°, and so on.
  • connection between the magnetic element and the magnetic element may include one or a combination of bonding, clamping, welding, riveting, and bolting.
  • the angle between the two magnetization directions can refer to the angle of rotation required to rotate to the direction of the other magnetization direction based on one of the magnetization directions, where the angle of clockwise rotation is a positive number, and the angle of rotation is counterclockwise. The angle of rotation is negative.
  • the magnetic circuit assembly further includes a second magnetically permeable element 605, a third magnetically permeable element 606, and a fourth magnetically permeable element 607.
  • the bottom surface of the second magnetic element 605 is connected to the top surface of the first magnetic element 601
  • the bottom surface of the third magnetic element 606 is connected to the top surface of the third magnetic element 603.
  • the second magnetically permeable element 605 and the third magnetically permeable element 606 are spaced apart at the magnetic gap.
  • the top surface of the fourth magnetic element 607 may be connected to both the bottom surface of the second magnetic element 602 and the bottom surface of the third magnetic element 603.
  • the first magnetic element 601, the second magnetic element 602, the first magnetic element 604, the second magnetic element 605, and the fourth magnetic element 607 may all be cylinders, cuboids, or three pillars, etc. .
  • the third magnetic element 603 and the third magnetic conductive element 606 may be ring-shaped (continuous ring-shaped, discontinuous ring-shaped, rectangular ring-shaped, triangular ring-shaped, etc.).
  • the first magnetic element 601, the second magnetic element 602, the first magnetic element 604, and the second magnetic element 605 may be the same in the shape and size of the cross section perpendicular to the vertical direction
  • the third The magnetic element 603 and the third magnetically permeable element 606 may be the same in the shape and size of the cross section perpendicular to the vertical direction.
  • the total thickness of the first magnetic element 601, the second magnetic element 602, the first magnetic element 604, and the second magnetic element 605 may be equal to the thickness of the third magnetic element 603 and the third magnetic element 606. The sum of thickness.
  • the fourth magnetically permeable element 607 and the third magnetically permeable element 606 may be the same in thickness.
  • the first magnetic element 601, the second magnetic element 602, the third magnetic element 603, the first magnetic element 604, the second magnetic element 605, the third magnetic element 606, and the fourth magnetic element 607 to form a magnetic circuit.
  • the magnetic circuit assembly 6000 can generate a total magnetic field or a full magnetic field, and the first magnetic element 601 can generate a first magnetic field.
  • the full magnetic field is composed of all the components in the magnetic circuit assembly 600 (for example, the first magnetic element 601, the second magnetic element 602, the third magnetic element 603, the first magnetic element 604, the second magnetic element 605, the The three magnetic element 606 and the fourth magnetic element 607) generate a magnetic field under the joint action.
  • the magnetic field intensity of the full magnetic field in the magnetic gap (also referred to as magnetic induction intensity or magnetic flux density) is greater than the magnetic field intensity of the first magnetic field in the magnetic gap.
  • the second magnetic element 602 can generate a second magnetic field
  • the third magnetic element 603 can generate a third magnetic field.
  • the second magnetic field and/or the third magnetic field can increase the magnetic field strength of the full magnetic field at the magnetic gap.
  • the second magnetic field and/or third magnetic field mentioned here to increase the magnetic field strength of the full magnetic field refers to the presence of the second magnetic field and/or the third magnetic field (that is, the presence of the second magnetic element 602 and/or the third magnetic element 603) when the magnetic field strength of the magnetic gap is greater than that of the full magnetic field when there is no second magnetic field and/or third magnetic field (that is, there is no second magnetic element 602 and/or third magnetic element 603).
  • the full magnetic field generated when the second magnetic element 602 and the third magnetic element 603 are present is greater than when the magnetic field strength of the magnetic gap is greater than that without the second magnetic element 602 and the third magnetic element 603 (that is, when there is only the first magnetic element 601) )
  • the magnetic field intensity of the generated full magnetic field in the magnetic gap is greater than the magnetic field strength of the magnetic gap when the third magnetic element 603 is not present (that is, when there is only the first magnetic element 601 and the second magnetic element 602).
  • the strength of the magnetic field in the magnetic gap is greater than the magnetic field strength of the magnetic gap.
  • the magnetic circuit assembly refers to a structure that includes all magnetic elements and magnetic conductive elements
  • the full magnetic field refers to the magnetic field generated by the magnetic circuit assembly as a whole
  • the second magnetic field, the second magnetic field, and the third The magnetic field,..., the Nth magnetic field respectively represent the magnetic field generated by the corresponding magnetic element.
  • the magnetic elements that generate the first magnetic field may be the same or different.
  • Fig. 7 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 6 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 6.
  • the Z axis in this specification is an axis arranged in the magnetic gap and extending along the vertical direction to characterize the distribution of the intensity of the magnetic field in the vertical direction.
  • Those skilled in the art can set the zero position of the Z-axis according to actual measurement requirements.
  • the zero position of the Z-axis can be set in the vertical position of the first magnetic element 601, the first magnetic element 604, and the second magnetic element 602.
  • the center of the straight direction for another example, the midpoint of the thickness direction of the third magnetic element 603; for another example, the center of the first magnetic element 604 in the vertical direction.
  • the magnetic field intensity is highest near the Z-axis zero point (for example, -0.110mm), the highest value of the magnetic field intensity is about 0.61T, and the magnetic field intensity In the vicinity of the zero point (for example, in the range of -0.110mm to 0.171mm), the distribution of the changes uniformly.
  • Fig. 8 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 800 may include a first magnetic element 801, a second magnetic element 802, a third magnetic element 803, a first magnetic element 804, a second magnetic element 805, The third magnetically permeable element 806, the fourth magnetically permeable element 807 and the fifth magnetically permeable element 808.
  • the fourth magnetic element 807 and the fifth magnetic element 807 in this embodiment are arranged at intervals at the magnetic gap, the top surface of the fourth magnetic conductive element 807 is connected to the bottom surface of the second magnetic element 802, and the top surface of the fifth magnetic conductive element 808 is connected to the bottom surface of the third magnetic element 803.
  • the fourth magnetic element 807 may be a cylinder, a rectangular parallelepiped or a triangular prism, etc.
  • the fifth magnetic element 808 may be a ring (continuous ring, discontinuous ring, rectangular ring, triangular ring). State, etc.).
  • the fourth magnetic element 807 and the first magnetic element 801, the second magnetic element 802, the first magnetic element 804, and the second magnetic element 805 are in the shape and size of the cross section perpendicular to the Z axis. It can be the same.
  • the fourth magnetically permeable element 807 and the fifth magnetically permeable element 808 may be the same in thickness.
  • the fifth magnetically permeable element 808 and the third magnetically permeable element 806 may be the same in thickness and the shape and size of the cross section perpendicular to the Z axis.
  • Fig. 9 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 8 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 8.
  • the distribution of the magnetic field intensity generated by the magnetic circuit assembly in the magnetic gap is at two zero points.
  • the sides for example, both sides of 0.031 mm
  • the changes are more uniform at positions near the zero point (for example, -0.344 mm to 0.075 mm).
  • the highest value of the magnetic field strength is lower than that of the magnetic circuit assembly 600 with the continuous fourth magnetic element 607, which is about 0.4T.
  • Fig. 10 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 1000 may include a first magnetic element 1001, a second magnetic element 1002, a first magnetically permeable element 1003, and a second magnetically permeable element 1004.
  • the second magnetic element 1004 is arranged between the first magnetic element 1001 and the second magnetic element 1002; the first magnetic element 1003 is arranged at least partially around the first magnetic element 1001 and the second magnetic element 1002 , The first magnetic element 1001 and the second magnetic element 1002 form a magnetic gap with the first magnetic element 1003; the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 are both perpendicular to the second magnetic element 1004 and The surface where the first magnetic element 1001 and/or the second magnetic element 1002 are connected (ie the vertical direction in the figure, the direction of the arrow on each magnetic element in the figure indicates the magnetization direction of the magnetic element), and the magnetization direction of the two on the contrary.
  • the placement of the first magnetic element 1001 and the second magnetic element 1002 may include that the same magnetic pole of the first magnetic element 1001 and the second magnetic element 1002 is close to the second magnetically permeable element 1004; the different magnetic poles are far away from the second magnetic element. Permeable element 1004.
  • the N pole of the first magnetic element 1001 is closer to the second magnetic conductive element 1004 than the S pole of the first magnetic element 1001 and the N pole of the second magnetic element 1002 is closer to the second magnetic element 1004 than the S pole of the second magnetic element 1002.
  • the magnetic line of induction or the direction of the magnetic field (that is, the S pole points to the N pole direction) are all directed to the second magnetic permeable element 1004.
  • the S pole of the first magnetic element 1001 is closer to the second magnetic element 1004 than the N pole of the first magnetic element 1001 and the S pole of the second magnetic element 1002 is closer to the second magnetic element 1004 than the N pole of the second magnetic element 1002.
  • the magnetic field lines or the direction of the magnetic field that is, the S pole points to the N pole direction
  • the first magnetic element 1001 and the second magnetic element 1002 By setting the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 to vertical and opposite directions, so that the first magnetic element 1001 and the second magnetic element 1002 are oppositely magnetized, the first magnetic element
  • the magnetic lines of induction generated by the second magnetic element 1001 and the second magnetic element 1002 have approximately the same direction in the magnetic gap, for example, both are from the second magnetic element 1004 to the first magnetic element 1003; or both are from the first magnetic element 1003 Point to the second magnetic element 1004, thereby increasing the intensity of the magnetic field in the magnetic gap.
  • the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 can be vertical and opposite directions, so that the magnetic field generated by the first magnetic element 1001 and the second magnetic element 1002 can be suppressed, so that the magnetic field corresponds to the magnetic induction.
  • the wires extend horizontally in the magnetic gap.
  • the magnetic line of force or the direction of the magnetic field inside the first magnetic element 1001 and the second magnetic element 1002 that is, the S pole points to the N pole direction
  • the magnetic line of force can be guided from the second magnetic element 1004.
  • the end of the magnetic element 1004 extends into the magnetic gap in a horizontal or close to horizontal direction, and passes through the first magnetic conductive element 1003.
  • the direction of the magnetic field at the position of the voice coil in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, which improves the uniformity and strength of the magnetic field, and can effectively improve the sound effect generated by the vibration of the voice coil.
  • the magnetization direction of each magnetic element can also be other directions.
  • the combination of magnetic elements with different magnetization directions can also achieve the effect of increasing the intensity of the magnetic field and/or making the intensity distribution of the magnetic field more uniform.
  • the preset included angle can be set within a certain angle range, for example, 60°, 80, 90°, 100°, and so on.
  • the connection between the magnetic element and the magnetic element may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the magnetization direction of the first magnetic element 601 and the magnetization direction of the second magnetic element 602 may also have a preset angle. For example, 170°, 190°, etc.
  • a preset angle For related descriptions of the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002, reference may be made to the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in FIG. 6.
  • the magnetic circuit assembly further includes a third magnetically permeable element 1005 and a fourth magnetically permeable element 1006.
  • the bottom surface of the third magnetically permeable element 1005 can be connected to the top surface of the first magnetic element 1001.
  • the top surface of the fourth magnetic element 1006 may be connected to the bottom surface of the second magnetic element 1002 and the bottom surface of the second magnetic element 1004.
  • the first magnetic element 1001, the second magnetic element 1002, the second magnetic element 1004, and the third magnetic element 1005 may all be cylinders, cuboids, or triangular prisms.
  • the first magnetic element 1003 has a ring shape (continuous ring shape, discontinuous ring shape, rectangular ring shape, triangular ring shape, etc.).
  • the first magnetic element 1001, the second magnetic element 1002, the second magnetically permeable element 1004, and the third magnetically permeable element 1005 may have the same shape and size in a cross section perpendicular to the Z axis.
  • the total thickness of the first magnetic element 1001, the second magnetic element 1002, the second magnetically permeable element 1004, and the third magnetically permeable element 1005 may be equal to the thickness of the first magnetically permeable element 1003.
  • FIG. 11 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 10 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 10.
  • the intensity of the magnetic field is weakened near the zero point (for example, within the range of -0.500-0.188 mm), and the maximum value that can only be reached is about 0.38T, but the distribution of the magnetic field intensity near the zero point is still relatively uniform.
  • Fig. 12 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 1200 may include a first magnetic element 1201, a second magnetic element 1202, a first magnetic element 1203, a second magnetic element 1204, a third magnetic element 1205, and a fourth magnetic element. 1206.
  • this embodiment is different in that the fourth magnetic element 1206 in the embodiment shown in FIG. 12 is no longer connected to the first magnetic element 1203, and the fourth magnetic element 1206
  • the top surface is connected to the bottom surface of the second magnetic element 1202.
  • the fourth magnetic element 1206 and the second magnetically conductive element 1204 are spaced apart at the magnetic gap.
  • the first magnetic element 1201, the second magnetic element 1202, the second magnetic element 1204, the third magnetic element 1205, and the fourth magnetic element 1206 may all be cylinders, cuboids, or triangular prisms, etc.
  • the first magnetizer 1203 may be ring-shaped (circular ring-shaped, rectangular ring-shaped, triangular ring-shaped, etc.).
  • the total thickness of the first magnetic element 1201, the second magnetic element 1202, the second magnetic element 1204, the third magnetic element 1205, and the fourth magnetic element 1206 may be equal to the first magnetic element 1203. thickness of.
  • the second magnetic element and the second magnetic permeable element on the basis of the first magnetic element, the second magnetic element and the second magnetic permeable element, those skilled in the art can further change the conductive element as required.
  • the number, location and form of the magnetic elements are not further limited in this application.
  • the second magnetically conductive element 1004 and the third magnetically conductive element 1005 of the magnetic circuit assembly of the embodiment shown in FIG. 10 may also be connected together.
  • FIG. 13 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 12 according to the present application.
  • the magnetic gap measure the intensity of the magnetic field at each point in the Z-axis direction along the Z-axis direction shown in FIG. 12.
  • the highest value of the magnetic field strength is higher than that of the magnetic assembly 1000 with the continuous fourth magnetic element 1006 in FIG.
  • the intensity distribution is relatively uniform.
  • Fig. 14 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 1400 may include a first magnetic element 1401 and a second magnetic element 1402.
  • the second magnetic element 1402 at least partially surrounds the first magnetic element 1401 (that is, the inner surface or inner wall of the second magnetic element 1402). It surrounds the outer surface or outer wall of the first magnetic element 1401), and a magnetic gap is formed between the first magnetic element 1401 and the second magnetic element 1402.
  • the voice coil can be placed in the magnetic gap.
  • the magnetization directions of the first magnetic element 1401 and the second magnetic element 1402 are both parallel to the top surface of the first magnetic element 1401 (ie, the horizontal direction in the figure) or perpendicular to the inner and outer surfaces.
  • the magnetization direction of the first magnetic element 1401 may be an outward direction along its center (that is, the central area points to the outer area), and the magnetization direction of the second magnetic element 1402 is along its inner side (close to the first magnetic element 1401). Side) to the outside (the side away from the first magnetic element 1401).
  • the magnetization direction of the first magnetic element 1401 may be the direction from the outside to the center, and the magnetization direction of the second magnetic element 1402 is along the outside (the side away from the first magnetic element 1401) to the inside (close to the first magnetic element). 1401 side) direction.
  • the placement of the first magnetic element 1401 and the second magnetic element 1402 may include different magnetic poles of the first magnetic element 1401 and the second magnetic element 1402 being close to or far away from each other.
  • the N pole of the first magnetic element 1401 is located in the central area of the first magnetic element 1401
  • the S pole is located in the outer area of the first magnetic element 1401, that is, inside the first magnetic element 1401 and on the upper side parallel to the first magnetic element 1401.
  • the magnetic line of force or the direction of the magnetic field (that is, the S pole points to the N pole direction) are centered toward the outside; the N pole of the second magnetic element 1402 is located in the outer region of the second magnetic element 1402, and the S pole Located in the inner area of the second magnetic element 1402, that is, inside the second magnetic element 1402, on the same plane parallel to the upper or lower surface of the second magnetic element 1402, the magnetic line of induction or the direction of the magnetic field (that is, the S pole points to the N pole Direction) are all from the inside to the outside.
  • the S pole of the first magnetic element 1401 is located in the central area of the first magnetic element 1401, and the N pole is located in the outer area of the first magnetic element 1401, that is, inside the first magnetic element 1401, and in parallel to the first magnetic element 1401.
  • the lines of magnetic induction or the direction of the magnetic field are all outward pointing to the inside;
  • the S pole of the second magnetic element 1402 is located in the outer area of the second magnetic element 1402, N
  • the pole is located in the inner area of the second magnetic element 1402, that is, inside the second magnetic element 1402, on the same plane parallel to the upper or lower surface of the second magnetic element 1402, the magnetic field line or the direction of the magnetic field (that is, the S pole points to the N (Polar directions) are all from the outside to the inside.
  • the first magnetic element 1401 may include two magnets, and the placement of the two magnets may include adjacent arrangement, and the same magnetic poles of the two are close, and the opposite magnetic poles are far away.
  • the N poles of the two magnets are close to each other (as shown in the figure, the magnetization directions of the left and right magnets of the first magnetic element 1401 are opposite).
  • the S poles of the two magnets are close to each other.
  • the second magnetic element 1402 may also include two magnets, the two magnets are respectively close to the first magnetic element 1401, and the magnetic lines of force or magnetic field directions inside the two magnets are opposite.
  • the magnetic lines of induction or the direction of the magnetic field inside the two magnets of the second magnetic element 1402 are both deviated from the first magnetic element 1401.
  • the magnetization direction of the first magnetic element 1401 By setting the magnetization direction of the first magnetic element 1401 to a horizontal direction, the magnetic field generated by the first magnetic element 1401 can be better extended in the horizontal direction or close to the horizontal direction in the magnetic gap.
  • the magnetization direction of the second magnetic element 1402 is the same as that of the first magnetic element 1401, which can further guide the magnetic lines of induction in the magnetic gap to be distributed in the magnetic gap along the horizontal or close to the horizontal direction.
  • the magnetic line of force or the direction of the magnetic field inside the first magnetic element 1401 and the second magnetic element 1402 are all directed from the first magnetic element 1401 to the second magnetic element 1402 (that is, the S pole points to the N pole direction)
  • the magnetic line of force can be Extend from the outside of the first magnetic element 1401 into the magnetic gap along the horizontal or close to the horizontal direction and pass through the second magnetic element 1402.
  • the second magnetic element 1402 can emit from the outside of the second magnetic element 1402 along the horizontal or close to the level.
  • the horizontal direction extends in the magnetic gap and penetrates the inner side of the second magnetic element 1402.
  • the magnetic line of force It can emit from the inner side of the first magnetic element 1401 and extend from the magnetic gap in a horizontal or nearly horizontal direction and penetrate into the outer side of the first magnetic element 1401.
  • the second magnetic element 1402 can emit from the inner side of the second magnetic element 1402.
  • the horizontal or nearly horizontal direction extends in the magnetic gap and penetrates the outer side of the first magnetic element 1402.
  • the direction of the magnetic field at the position of the voice coil in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, which improves the uniformity and strength of the magnetic field, and can effectively improve the sound effect generated by the voice coil vibration.
  • the magnetization direction of each magnetic element can also be other directions, and the combination of magnetic elements with different magnetization directions can also achieve the effect of increasing the intensity of the magnetic field and/or making the intensity distribution of the magnetic field more uniform.
  • the horizontal direction can be understood as a direction perpendicular to the vibration direction of the voice coil, that is, a direction parallel to the plane where the top surface of the first magnetic element is located.
  • the magnetization directions of the first magnetic element 1401 and the second magnetic element 1402 may be parallel, and a certain angular deviation may be allowed.
  • the angle between the magnetization directions of the two may be between 170° and 190°.
  • the magnetic circuit assembly further includes a first magnetic permeable element 1403 and a second magnetic permeable element 1404.
  • the bottom surface of the first magnetic permeable element 1403 is connected to the top surface of the second magnetic element 1402.
  • the top surface is connected to the bottom surface of the second magnetic element 1402.
  • the connection between the magnetic element and the magnetic element may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the first magnetic element 1401 may be a cylinder, a rectangular parallelepiped, or a triangular prism, etc.
  • the second magnetic element 1402, the first magnetic element 1403, and the second magnetic element 1404 may be ring-shaped (continuous circular ring). , Discontinuous circular ring, rectangular ring, triangular ring, etc.).
  • the first magnetic element 1401 may be formed by splicing two semi-cylindrical bodies, two rectangular parallelepipeds or two magnets of other shapes, and the magnetization directions of the two magnets constituting the first magnetic element 1401 may be opposite.
  • the second magnetic element 1402, the first magnetically permeable element 1403, and the second magnetically permeable element 1404 may be the same in the shape and size of the cross section perpendicular to the Z axis. In some embodiments, the total thickness of the second magnetic element 1402, the first magnetic element 1403, and the second magnetic element 1404 may be equal to the thickness of the first magnetic element 1401.
  • Fig. 15 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 14 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 14.
  • the intensity of the magnetic field is basically symmetrical about the zero position of the Z-axis, and the intensity of the magnetic field is relatively evenly distributed along the Z-axis. Near (for example, -0.002mm or 0.002mm), about 0.48T.
  • Fig. 16 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 1600 may include a first magnetic element 1601, a second magnetic element 1602, a first magnetic element 1603, and a second magnetic element 1604.
  • this embodiment differs in that the top surface of the second magnetic element 1604 of this embodiment is connected to the bottom surfaces of the first magnetic element 1601 and the second magnetic element 1602.
  • the second magnetically permeable element 1604 may be a cylinder.
  • the sum of the thickness of the second magnetic element 1602 and the thickness of the first magnetic element 1603 may be equal to the thickness of the first magnetic element 1601.
  • Fig. 17 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 16 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 16.
  • a relatively uniform magnetic field is generated near the zero point of the Z axis, and since the second magnetic element 1604 is connected to the first magnetic element 1601 and the second magnetic element 1602, compared to the magnetic circuit assembly of Figure 14
  • the magnetic field intensity near the zero point (for example, 0.292mm) is approximately 0.53T.
  • Fig. 18 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 1800 may include a first magnetic element 1801, a second magnetic element 1802, a first magnetically permeable element 1803, a second magnetically permeable element 1804, and a third magnetically permeable element 1805.
  • this embodiment further includes a third magnetic element 1805, and the top surface of the third magnetic element 1805 is connected to the bottom surface of the first magnetic element 1801.
  • the third magnetically conductive element 1802 and the second magnetically conductive element 1804 are spaced apart on both sides of the magnetic gap.
  • the first magnetic element 1801 and the third magnetic element 1805 may be a cylinder, a rectangular parallelepiped, or a triangular prism.
  • the sum of the thickness of the second magnetic element 1802, the first magnetic element 1803 and the second magnetic element 1804 may be equal to the sum of the thickness of the first magnetic element 1801 and the third magnetic element 1805.
  • the second magnetically permeable element 1804 and the third magnetically permeable element 1805 may be equal in thickness.
  • Fig. 19 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 18 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 18.
  • the maximum value of the magnetic field intensity is near the zero point of the Z axis (for example, 0.0209 mm), which is about 0.5T, and the intensity of the magnetic field is distributed evenly on both sides of the zero point of the Z axis, especially the upper part.
  • the maximum magnetic field intensity in the magnetic gap is increased.
  • Fig. 20 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 2000 may include a first magnetic element 2001, a second magnetic element 2002, a first magnetically permeable element 2003, a second magnetically permeable element 2004, and a third magnetically permeable element 2005.
  • this embodiment further includes a third magnetic element 2005, and the bottom surface of the third magnetic element 2005 is connected to the top surface of the first magnetic element 2001.
  • the third magnetic element 2005 and the first magnetic element 2001 may be a cylinder, a rectangular parallelepiped, or a triangular prism.
  • the third magnetic element 2005 and the first magnetic element 2001 may be the same in the shape and size of the cross section perpendicular to the Z axis.
  • the sum of the thicknesses of the first magnetic element 2001 and the third magnetically permeable element 2005 and the sum of the thicknesses of the second magnetic element 2002 and the second magnetically permeable element 2003 may be the same.
  • FIG. 21 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 20 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 20.
  • the highest value of the magnetic field strength (for example, -0.016mm) reaches 0.6T.
  • Fig. 22 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 2200 may include a first magnetic element 2201, a second magnetic element 2202, a first magnetic element 2203, a second magnetic element 2204, a third magnetic element 2205, and a fourth magnetic element. 2206.
  • this embodiment is different in that this embodiment further includes a fourth magnetic element 2206, and the bottom surface of the fourth magnetic element 2206 is connected to the surface of the first magnetic element 2201.
  • the fourth magnetically conductive element 2206 and the first magnetically conductive element 2203 are spaced apart on both sides of the magnetic gap.
  • the first magnetic element 2201, the third magnetic element 2205, and the fourth magnetic element 2206 may be a cylinder, a rectangular parallelepiped, or a triangular prism.
  • the sum of the thicknesses of the second magnetic element 2202, the first magnetically permeable element 2203, and the second magnetically permeable element 2204 may be equal to the first magnetic element 2201, the third magnetically permeable element 2205, and the fourth magnetically permeable element 2206.
  • the first magnetically permeable element 2203 and the fourth magnetically permeable element 2206 may be equal in thickness.
  • FIG. 23 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 22 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 22.
  • the highest value of the intensity of the magnetic field (for example, the highest value at -0.039mm) is about 0.53T, and since the magnetic circuit assembly of FIG. 23 is relative to the magnetic circuit assembly of FIG. 18 in the direction of the Z axis The distribution is more uniform, and the intensity of the magnetic field is more evenly distributed near the zero point of the Z axis.
  • the magnetic circuit assembly of the embodiment shown in FIG. 14 may further include a third magnetically permeable element (not shown in the figure) and a fourth magnetically permeable element (not shown in the figure).
  • the bottom surface of the third magnetically permeable element and the first The top surface of a magnetic element 1401 is connected, and the top surface of the fourth magnetic element is connected to the bottom surface of the first magnetic element 1401.
  • Fig. 24 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 2400 may include a first magnetic element 2401 and a first magnetically permeable element 2402.
  • the first magnetically permeable element 2402 at least partially surrounds the first magnetic element 2401, and the inner ring of the first magnetically permeable element 2402
  • a magnetic gap is formed with the first magnetic element 2401.
  • the voice coil 124 of the speaker assembly 12 may be disposed in the magnetic gap.
  • the magnetization direction of the first magnetic element 2401 is parallel to the top surface of the first magnetic element 2401 (ie, the horizontal direction in the figure).
  • the magnetization direction of the first magnetic element 2401 may be an outward direction along its center.
  • the first magnetic element 2401 may include two magnets, and the placement of the two magnets may include adjacent arrangement, with the same magnetic poles close to each other and the opposite magnetic poles far away.
  • the N poles of the two magnets are close to each other (as shown in the figure, the magnetization directions of the left and right magnets of the first magnetic element 2401 are opposite, and the magnetization directions of the two magnets may both point to the first magnetic permeable element 2402).
  • the first magnetic element 2401 and its magnetization direction please refer to the detailed description of the first magnetic element 1401 in FIG. 14.
  • the horizontal direction can be understood as a direction perpendicular to the vibration direction of the voice coil, that is, a direction parallel to the plane where the top surface of the first magnetic element 2401 is located.
  • the magnetic field generated by the first magnetic element 2401 can be better extended in the horizontal direction or close to the horizontal direction in the magnetic gap.
  • the direction of the magnetic field at the position of the voice coil in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, which improves the uniformity of the magnetic field and can effectively improve the sound effect generated by the vibration of the voice coil.
  • the connection between the magnetic element and the magnetic element may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the first magnetic element 2401 may be a cylinder, a rectangular parallelepiped, or a triangular prism, etc.
  • the first magnetic conductive element 2402 may be a ring (continuous ring, discontinuous ring, rectangular ring, triangular ring). State, etc.).
  • the first magnetic element 2401 may be formed by splicing two semi-cylinders, two rectangular parallelepipeds or two magnets of other shapes, and the magnetization directions of the two magnets constituting the first magnetic element 2401 may be opposite.
  • the first magnetic element 2401 and the first magnetically permeable element 2402 may be the same in thickness.
  • FIG. 25 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 24 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 24.
  • the intensity of the magnetic field is smaller than that of the magnetic element 1400 in FIG. 14 because no more magnetic elements are provided.
  • the highest value of the magnetic field intensity (for example, the highest value at -0.338mm) is 0.26T
  • the distribution of the intensity of the magnetic field is relatively uniform, and the difference between the highest value and the lowest value of the intensity of the magnetic field is relatively small.
  • Fig. 26 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 2600 may include a first magnetic element 2601, a first magnetic permeable element 2602, and a second magnetic permeable element 2603.
  • this embodiment also includes a second magnetically conductive element 2603. The top surface of the second magnetically conductive element 2603 and the bottom surface of the first magnetic element 2601 and the first conductive element The bottom surfaces of the magnetic elements 2602 are connected.
  • Fig. 27 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 26 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 26.
  • the intensity of the magnetic field is more evenly distributed near the zero point of the Z axis (for example, 0.312mm), and since the second magnetic element 2603 is connected to the first magnetic element 2601 and the first magnetic element 2602, compared to The magnetic circuit assembly of FIG. 24 increases the magnetic field intensity near the zero point of the Z axis (for example, 0.312 mm), which is approximately 0.35T.
  • Fig. 28 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 2800 may include a first magnetic element 2801, a first magnetically permeable element 2802 and a second magnetically permeable element 2803.
  • this embodiment further includes a second magnetic element 2803, and the top surface of the second magnetic element 2803 is connected to the bottom surface of the first magnetic element 2801.
  • the difference between this embodiment and the embodiment shown in FIG. 26 is that the top surface of the second magnetically permeable element 2803 is only connected to the bottom surface of the first magnetic element 2801, and is not connected to the bottom surface of the first magnetically permeable element 2802.
  • the first magnetic element 2801 and the second magnetically permeable element 2802 can be cylinders, cuboids, or triangular prisms, etc., and the first magnetic element 2801 and the second magnetically permeable element 2802 have a cross-sectional shape perpendicular to the Z axis. And the size can be the same. In some embodiments, the sum of the thicknesses of the first magnetic element 2801 and the second magnetically permeable element 2803 may be equal to the thickness of the first magnetically permeable element 2802.
  • Fig. 29 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 28 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 28.
  • the intensity of the magnetic field is very uniformly distributed near the zero point position (for example, in the range of -0.03mm-0.5mm).
  • the magnetic field intensity near the zero point of the Z axis (for example, 0.49 mm) is increased compared to the magnetic circuit assembly of FIG. 24, which is about 0.32T.
  • the magnetic field intensity near the zero point of the Z axis (for example, 0.49mm) is somewhat different. reduce.
  • Fig. 30 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 3000 may include a first magnetic element 3001, a first magnetically permeable element 3002, a second magnetically permeable element 3003, and a third magnetically permeable element 3004.
  • this embodiment further includes a third magnetic element 3004, and the bottom surface of the third magnetic element 3004 is connected to the top surface of the first magnetic element 3001.
  • the first magnetic element 3001 and the third magnetic element 3004 may be a cylinder or a rectangular parallelepiped, etc., and the first magnetic element 3001 and the third magnetic element 3004 may have a cross-sectional shape and size perpendicular to the Z axis. same. In some embodiments, the sum of the thicknesses of the first magnetic element 3001 and the third magnetically permeable element 3004 may be equal to the thickness of the first magnetically permeable element 3002.
  • Fig. 31 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 38 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 30.
  • the intensity of the magnetic field in the magnetic gap is relatively evenly distributed near the zero point of the Z axis (for example, in the range of -0.095-0.106mm), and because the bottom surface of the third magnetic element 3004 and the first magnetic element 3001 The top surface is connected.
  • the magnetic field intensity near the zero point of the Z axis for example, 0.081mm
  • is reduced which is about 0.28T.
  • Fig. 32 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 3200 may include a first magnetic element 3201, a first magnetically permeable element 3202, a second magnetically permeable element 3203, and a third magnetically permeable element 3204.
  • this embodiment further includes a third magnetic element 3204, and the bottom surface of the third magnetic element 3204 is connected to the top surface of the first magnetic element 401.
  • the first magnetic element 3201, the second magnetically permeable element 3203, and the third magnetically permeable element 3204 may be cylinders, cuboids, or triangular prisms, etc.
  • the first magnetic element, the second magnetically permeable element, and the third magnetically permeable element The elements may be the same in the shape and size of the cross section perpendicular to the Z axis.
  • the total thickness of the first magnetic element 3201, the second magnetically permeable element 3203, and the third magnetically permeable element 3204 may be equal to the thickness of the first magnetically permeable element 3201.
  • FIG. 33 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 32 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 32.
  • the intensity of the magnetic field in the magnetic gap is distributed more uniformly at the zero point of the Z-axis, and since the bottom surface of the third magnetic element 3204 is connected to the top surface of the first magnetic element 401, compared to the magnetic field in Figure 28
  • the circuit assembly reduces the magnetic field intensity near the zero point of the Z axis (for example, 0.000mm), which is about 0.26T.
  • the third magnetically permeable element 3204 of the magnetic circuit assembly of the embodiment shown in FIG. 32 may be connected to the first magnetically permeable element 3202.
  • Fig. 34 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 3400 may include a first magnetic element 3401, a second magnetic element 3402 and a first magnetically permeable element 3403.
  • the first magnetic element 3401 at least partially surrounds the first magnetic element 3403 (that is, the inner surface or inner wall of the first magnetic element 3401 surrounds the outer surface or outer wall of the first magnetic element 3403)
  • the second magnetic element 3402 at least partially Surrounding the first magnetic element 3401 (that is, the inner surface or inner wall of the second magnetic element 3402 surrounds the outer surface or outer wall of the first magnetic element 3401)
  • a magnetic field is formed between the inner ring of the first magnetic element 3401 and the second magnetic element 3402 gap.
  • the voice coil can be placed in the magnetic gap.
  • the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 are both parallel to the top surface of the first magnetic element 3401 and/or the second magnetic element 3402 (ie the horizontal direction in the figure) or perpendicular to the inner and outer surfaces, the first magnetic element
  • the magnetization directions of the 3401 and the second magnetic element 3402 are parallel.
  • the magnetization direction of the first magnetic element 3401 may be an outward direction along its center (that is, the center points to the outside), and the magnetization direction of the second magnetic element 3402 is along its inner side (close to the first magnetic element 3401). The direction toward the outside (the side away from the first magnetic element 3401).
  • the magnetization direction of the first magnetic element 3401 may be a direction from the outside to the center, and the magnetization direction of the second magnetic element 3402 is along the outside (the side away from the first magnetic element 3401) to the inside (close to the first magnetic element). 3401 side) direction.
  • the placement of the first magnetic element 3401 and the second magnetic element 3402 may include different magnetic poles of the first magnetic element 3401 and the second magnetic element 3402 being close to or far away from each other.
  • the N pole of the first magnetic element 3401 is located in the central area of the first magnetic element 3401
  • the S pole is located in the outer area of the first magnetic element 3401, that is, inside the first magnetic element 3401 and on the upper side parallel to the first magnetic element 3401.
  • the magnetic line of force or the direction of the magnetic field (that is, the S pole points to the N pole direction) are centered toward the outside; the N pole of the second magnetic element 3402 is located in the outer region of the second magnetic element 3402, and the S pole Located in the inner area of the second magnetic element 3402, that is, inside the second magnetic element 3402, on the same plane parallel to the upper or lower surface of the second magnetic element 3402, the magnetic field line or the direction of the magnetic field (ie, the S pole points to the N pole Direction) are all from the inside to the outside.
  • the S pole of the first magnetic element 3401 is located in the central area of the first magnetic element 3401, and the N pole is located in the outer area of the first magnetic element 3401, that is, inside the first magnetic element 3401, in parallel to the first magnetic element 3401.
  • the lines of magnetic field or the direction of the magnetic field are all outward pointing to the inside;
  • the S pole of the second magnetic element 3402 is located in the outer area of the second magnetic element 3402, N
  • the pole is located in the inner region of the second magnetic element 3402, that is, inside the second magnetic element 3402, on the same plane parallel to the upper or lower surface of the second magnetic element 3402, the magnetic line of induction or the direction of the magnetic field (that is, the S pole points to the N (Polar directions) are all from the outside to the inside.
  • the first magnetic element 3401 may include two or more magnets, and the magnetization directions of the two or more magnets may all point to the second magnetic element 3402 (the first magnetic element as shown in the figure).
  • the magnetization directions of the magnets on the left and right sides of the element 3401 are opposite, respectively pointing to the second magnetic element 3402).
  • the second magnetic element 3402 may also include two or more magnets, and the magnetization directions of the two or more magnets are all directed from the inner side of the second magnetic element 3402 to the outer side.
  • the magnetization direction of each magnetic element can also be other directions, and the combination of magnetic elements with different magnetization directions can also achieve the effect of increasing the intensity of the magnetic field and/or making the intensity distribution of the magnetic field more uniform.
  • the horizontal direction can be understood as a direction perpendicular to the vibration direction of the voice coil, that is, a direction parallel to the plane where the top surface of the first magnetic element 3401 is located.
  • the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 may be parallel, or there may be a preset angle. Among them, the preset included angle can be set within a certain angle range, for example, 60°, 80, 90°, 100°, and so on.
  • the connection between the magnetic element and the magnetic element may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • reference may be made to the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in FIG. 6.
  • the magnetic circuit assembly may further include a second magnetically permeable element 3404 and a third magnetically permeable element 3405.
  • the bottom surface of the second magnetic element 3404 is connected to the top surface of the second magnetic element 3402, and the top surface of the third magnetic element 3405 is connected to the bottom surface of the second magnetic element 3402.
  • the first magnetic conductive element 3403 may be a cylinder, a rectangular parallelepiped, a triangular prism, or the like.
  • the first magnetic element 3401, the second magnetic element 3402, the second magnetic element 3404, and the third magnetic element 3405 can be ring-shaped (continuous ring, discontinuous ring, rectangular ring, triangular ring, etc.) .
  • the second magnetic element 3402, the second magnetically permeable element 3404, and the third magnetically permeable element 3405 may have the same shape and size in the cross section perpendicular to the Z axis.
  • the first magnetic element 3401 and the first magnetically permeable element 3403 may be the same in thickness.
  • the sum of the thickness of the second magnetic element 3402, the second magnetic permeable element 3404 and the third magnetic permeable element 3405 may be equal to the thickness of the first magnetic element 3401, and may be equal to the thickness of the first magnetic permeable element 3403.
  • FIG. 35 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 34 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 34.
  • the magnetic field intensity is distributed more uniformly along the Z axis.
  • Fig. 36 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 3600 may include a first magnetic element 3601, a second magnetic element 3602, a first magnetic permeable element 3603, a second magnetic permeable element 3604, and a third magnetic permeable element 3605.
  • the difference between this embodiment and the third magnetic element 3605 is that the top of the third magnetic element 3605 and the bottom surface of the first magnetic element 3601, the second magnetic element 3602 and the first magnetic element 3603 of this embodiment All connected.
  • the sum of the thickness of the second magnetic element 3602 and the second magnetically permeable element 3604 may be equal to the thickness of the first magnetic element 3601 and may be equal to the thickness of the first magnetically permeable element 3603.
  • Fig. 37 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 36 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 36.
  • the intensity of the magnetic field is relatively evenly distributed near the zero point of the Z axis (within the range of -0.091-0.232mm), and because the top of the third magnetic element 3605 is in contact with the first magnetic element 3601 and the second magnetic element 3602 and the bottom surfaces of the first magnetic element 3603 are connected.
  • the magnetic field intensity near the zero point of the Z axis (for example, 0.232mm) is increased, which is approximately 0.68T.
  • Fig. 38 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 3800 may include a first magnetic element 3801, a second magnetic element 3802, a first magnetic element 3803, a second magnetic element 3804, a third magnetic element 3805, and a fourth magnetic element. 3806.
  • this embodiment also includes a fourth magnetic element 3806, the top surface of the fourth magnetic element 3806 and the first magnetic element 3803 and the first magnetic element 3806.
  • the bottom surfaces of the 3801 are all connected.
  • the third magnetically conductive element 3805 and the fourth magnetically conductive element 3806 are arranged at intervals at the magnetic gap.
  • the outer contour shape and size of the outer ring of the fourth magnetic element 3806 and the first magnetic element 3801 may be the same in the cross section perpendicular to the Z axis.
  • the third magnetic element 3805 and the fourth magnetic element 3806 may be the same in thickness, and the first magnetic element 3803, the first magnetic element 3801 and the second magnetic element 3802 may be the same in thickness.
  • FIG. 39 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 38 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 38.
  • the intensity of the magnetic field is more uniformly distributed near the zero position of the Z axis (for example, within the range of 0.227-0.5mm), and due to the addition of the fourth magnetic element 3806, compared to the magnetic circuit of Figure 34
  • the component increases the magnetic field intensity near the zero point of the Z axis (for example, 0.109mm), which is about 0.54T.
  • Fig. 40 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 4000 may include a first magnetic element 4001, a second magnetic element 4002, a first magnetic element 4003, a second magnetic element 4004, a third magnetic element 4005, and a fourth magnetic element. 4006.
  • this embodiment further includes a fourth magnetic element 4006.
  • the top surfaces are all connected.
  • the first magnetically conductive element 4003, the third magnetically conductive element 4005, and the fourth magnetically conductive element 4006 may be cylinders, cuboids, or triangular prisms.
  • the second magnetically permeable element 4004 may have a ring shape (continuous ring shape, discontinuous ring shape, rectangular ring shape, triangular ring shape, etc.).
  • the first magnetic element 4001, the second magnetic element 4002, and the first magnetically permeable element 4003 may be the same in thickness
  • the second magnetically permeable element 4004 and the fourth magnetically permeable element 4006 may be the same in thickness.
  • FIG. 41 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 40 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 40.
  • the intensity of the magnetic field is relatively symmetrical with respect to the zero position of the Z axis, and due to the addition of the fourth magnetic element 4006, compared to the magnetic circuit assembly of Fig. 36, the magnetic circuit assembly is reduced near the zero point of the Z axis (for example, 0.312 mm) the magnetic field strength is about 0.52T.
  • Fig. 42 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 4200 may include a first magnetic element 4201, a second magnetic element 4202, a first magnetic element 4203, a second magnetic element 4204, a third magnetic element 4205, and a fourth magnetic element. 4206 and the fifth magnetic element 4207.
  • this embodiment also includes a fifth magnetically permeable element 4207.
  • the top surfaces are all connected.
  • the fifth magnetic element 4207 and the second magnetic element 4204 are spaced apart at the magnetic gap.
  • the fourth magnetically permeable element 4206 and the fifth magnetically permeable element 4207 may be the same in thickness and the shape and size of the cross section perpendicular to the Z axis.
  • the fifth magnetically permeable element 4207 and the second magnetically permeable element 4204 may be the same in thickness.
  • FIG. 43 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 42 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 42.
  • the intensity distribution of the magnetic field is highly symmetrical with respect to the position of the zero point of the Z-axis, and due to the addition of the fifth magnetic element 4207, compared to the magnetic circuit assembly of Fig. 38, it is near the zero point of the Z-axis (for example, 0.151mm) magnetic field strength is similar.
  • Fig. 44 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly may include a first magnetic element 4401, a first magnetic permeable element 4402, and a second magnetic permeable element 4403.
  • the first magnetic element 4401 at least partially surrounds the second magnetic element 4403, the first magnetic element 4402 surrounds the first magnetic element 4401, and a magnetic gap is formed between the first magnetic element 4401 and the first magnetic element 4402.
  • the voice coil of the speaker can be arranged in the magnetic gap.
  • the magnetization direction of the first magnetic element 4401 is parallel to the top surface of the first magnetic element 4401 (ie, the horizontal direction in the figure). In some embodiments, the magnetization direction of the first magnetic element 4401 is from the first magnetic element 4401 to the first magnetically permeable element 4402. In some embodiments, the magnetization direction of the first magnetic element 4401 is from the first magnetic element 4401 to the second magnetic permeable element 4403.
  • the first magnetic element 4401 and its magnetization direction please refer to the detailed description of the first magnetic element 1401 in FIG. 14.
  • the horizontal direction can be understood as a direction perpendicular to the vibration direction of the voice coil, that is, a direction parallel to the plane where the top surface of the first magnetic element 4401 is located.
  • the connection between the magnetic element and the magnetic element may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the shape of the second magnetically permeable element 4403 may be a cylinder or a rectangular parallelepiped.
  • the first magnetic element 4401, the first magnetically permeable element 4402, and the second magnetically permeable element 4403 may be the same in thickness.
  • FIG. 45 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 44 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 44.
  • the highest value of the magnetic field strength (for example, the highest value at the zero point position) is about 0.3T
  • the magnetic field strength is distributed very uniformly along the Z axis
  • the magnetic field strength is highly symmetrical at the zero point position of the Z axis .
  • Fig. 46 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 4600 may include a first magnetic element 4601, a first magnetic permeable element 4602, a second magnetic permeable element 4603, and a third magnetic permeable element 4604.
  • this embodiment also includes a third magnetic permeable element 4604.
  • the bottom surfaces of the element 4603 and the first magnetic element 4601 are connected.
  • FIG. 47 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 46 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 46.
  • the intensity of the magnetic field is distributed along the Z axis (for example, in the range of -0.041-0.500mm) relatively uniform, and due to the addition of the third magnetic element 4604, compared to the magnetic circuit assembly of Figure 44, the The magnetic field intensity near the zero point of the Z axis (for example, 0.348 mm) is approximately 0.43T.
  • Fig. 48 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly may include a first magnetic element 4801, a first magnetic permeable element 4802, a second magnetic permeable element 4803, and a third magnetic permeable element 4804.
  • this embodiment also includes a third magnetic element 4804, the top surface of the third magnetic element 4804, the bottom surface of the first magnetic element 4801, and the second magnetic element 4804.
  • the bottom surfaces of the magnetic elements 4803 are all connected.
  • this embodiment differs in that the top surface of the third magnetic element 4804 in this embodiment is only connected to the bottom surface of the second magnetic element 4803 and the bottom surface of the first magnetic element 4801. It is no longer connected to the bottom surface of the first magnetic permeable element 4802.
  • the third magnetically conductive element 4804 may be a cylinder, a rectangular parallelepiped, a triangular prism, or the like.
  • the third magnetic element 4804 and the outer ring of the first magnetic element 4801 may have the same outer contour shape and size in a cross section perpendicular to the Z axis.
  • the sum of the thickness of the first magnetic element 4801 and the third magnetic element 4804 may be equal to the thickness of the first magnetic element 4802.
  • FIG. 49 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 48 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 48.
  • the overall distribution of the magnetic field strength along the Z axis is relatively uniform, and due to the addition of the third magnetic element 4804, compared to the magnetic circuit assembly of Figure 44, the magnetic circuit assembly is improved near the zero point of the Z axis (for example,- The magnetic field strength of 0.088mm) is about 0.34T.
  • Fig. 50 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 5000 may include a first magnetic element 5001, a first magnetically permeable element 5002, a second magnetically permeable element 5003, a third magnetically permeable element 5004, and a fourth magnetically permeable element 5005.
  • this embodiment also includes a fourth magnetically permeable element 5005, the bottom surface of the fourth magnetically permeable element 5004 and the top surface of the second magnetically permeable element 5003, the first The top surfaces of the magnetic elements 5001 are all connected.
  • the fourth magnetic element 5005 may be a cylinder or a rectangular parallelepiped, etc.
  • the outer ring of the fourth magnetic element 5005 and the first magnetic element 5001 may be in the shape and size of the cross section perpendicular to the Z axis. same.
  • the total thickness of the fourth magnetic element 5005 and the first magnetic element 5001 may be equal to the thickness of the first magnetic element 5002 and the thickness of the second magnetic element 5003.
  • FIG. 51 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 50 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 50.
  • the intensity of the magnetic field is very uniform along the Z axis, and due to the addition of the fourth magnetic element 5005, compared to the magnetic circuit assembly of Figure 48, it is reduced near the zero point of the Z axis (for example,- The magnetic field strength of 0194mm) is about 0.3T.
  • Fig. 52 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 5200 may include a first magnetic element 5201, a first magnetically permeable element 5202, a second magnetically permeable element 5203, a third magnetically permeable element 5204, and a fourth magnetically permeable element 5205.
  • this embodiment also includes a fourth magnetically permeable element 5205, the bottom surface of the fourth magnetically permeable element 5205 and the top surface of the second magnetically permeable element 5203, and the first The top surface of the magnetic element 5201 is connected.
  • the fourth magnetic element 5205 may be a cylinder, a rectangular parallelepiped, a triangular prism, etc., and the fourth magnetic element 5205 and the third magnetic element 5204 may be the same in the shape and size of the cross section perpendicular to the Z axis. . In some embodiments, the sum of the thicknesses of the first magnetic element 5201, the third magnetically permeable element 5204, and the fourth magnetically permeable element 5205 may be equal to the thickness of the first magnetically permeable element 5202.
  • FIG. 53 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 52 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 52.
  • the highest value of the magnetic field strength (for example, the highest value at -0.011mm) is close to about 0.3T, but the magnetic field strength is distributed along the entire Z axis Very even.
  • the fourth magnetic element 5005 of the magnetic circuit assembly of the embodiment shown in FIG. 50 may be connected to the second magnetic element 5003.
  • Fig. 54 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 5400 may include a first magnetic element 5401, a second magnetic element 5402, a third magnetic element 5403, a fourth magnetic element 5404, a fifth magnetic element 5405, a sixth magnetic element 5406, and a first magnetic element 5401. Permeable element 5407.
  • the first magnetic element 5401 at least partially surrounds the first magnetic element 5407
  • the second magnetic element 5402 surrounds the first magnetic element 5401
  • the outer ring of the first magnetic element 5401 and the second magnetic element 5402 form a magnetic gap.
  • the voice coil of the speaker can be arranged in the magnetic gap.
  • the bottom surface of the third magnetic element 5403 is connected to the top surface of the second magnetic element 5402, and the top surface of the fourth magnetic element 5404 is connected to the bottom surface of the second magnetic element 5402.
  • the bottom surface of the fifth magnetic element 5405 is connected to the top surface of the first magnetic element 5401 and the top surface of the first magnetic element 5407.
  • the top surface of the sixth magnetic element 5406 is connected to the bottom surface of the first magnetic element 5401 and the first magnetic element 5401.
  • the bottom surfaces of the components 5407 are all connected.
  • the third magnetic element 5403 and the fifth magnetic element 5405 are spaced apart at the magnetic gap, and the fourth magnetic element 5404 and the sixth magnetic element 5406 are spaced apart at the magnetic gap.
  • the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 are both parallel to the top surface of the first magnetic element 5401 and/or the second magnetic element 5402 (ie the horizontal direction in the figure) or perpendicular to the inside and outside.
  • the magnetization direction of the first magnetic element 5401 and the magnetization direction of the second magnetic element 5402 are parallel.
  • the magnetization direction of the first magnetic element 5401 is along its center outward direction (that is, the center points to the outside), and the magnetization direction of the second magnetic element 5402 points to the outside along the inner side (the side close to the first magnetic element 5401) ( Away from the side of the first magnetic element 5401).
  • the magnetization direction of the first magnetic element 5401 may be the direction from the outside to the center, and the magnetization direction of the second magnetic element 5402 is along the outside (the side away from the first magnetic element 5401) to the inside (close to the first magnetic element). 5401 side) direction.
  • the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404 are both perpendicular to the surface where the second magnetic element 5402 is connected to the third magnetic element 5403 and/or the fourth magnetic element 5404 (that is, the vertical direction in the figure).
  • the arrow direction on each magnetic element in the figure indicates the magnetization direction of the magnetic element), and the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404 are opposite.
  • the magnetization directions of the fifth magnetic element 5405 and the sixth magnetic element 5406 are both perpendicular to the surface where the first magnetic element 5401 and the fifth magnetic element 5405 or the sixth magnetic element 5406 are connected (ie, the vertical direction in the figure).
  • the direction of the arrow on each magnetic element in the figure indicates the magnetization direction of the magnetic element), and the magnetization directions of the fifth magnetic element 5405 and the sixth magnetic element 5406 are opposite.
  • the placement of the third magnetic element 5403 and the fourth magnetic element 5404 may include that the same magnetic pole of the third magnetic element 5403 and the fourth magnetic element 5404 is close to the second magnetic element 5402; different magnetic poles are far away from the second magnetic element.
  • Element 5402. For example, the N pole of the third magnetic element 5403 is closer to the second magnetic element 5402 than the S pole of the third magnetic element 5403 and the N pole of the fourth magnetic element 5404 is closer to the second magnetic element 5402 than the S pole of the fourth magnetic element 5404.
  • the magnetic line of induction or the direction of the magnetic field that is, the S pole points to the N pole direction
  • the S pole of the third magnetic element 5403 is closer to the first magnetic element 5407 than the N pole of the third magnetic element 5403 and the S pole of the fourth magnetic element 5404 is closer to the first magnetic element 5407 than the N pole of the fourth magnetic element 5404.
  • the magnetic lines of induction or the direction of the magnetic field that is, the S pole points to the N pole direction
  • the placement of the fifth magnetic element 5405 and the sixth magnetic element 5406 may include that the same magnetic poles of the fifth magnetic element 5405 and the sixth magnetic element 5406 are close to the first magnetic permeable element 5407; and different magnetic poles are far away from the first magnetic pole. Permeable element 5407.
  • the N pole of the fifth magnetic element 5405 is closer to the first magnetic element 5407 than the S pole of the fifth magnetic element 5405 and the N pole of the sixth magnetic element 5406 is closer to the first magnetic element 5407 than the S pole of the sixth magnetic element 5406.
  • the magnetic line of force or the direction of the magnetic field (that is, the S pole points to the N pole direction) are all directed to the first magnetic permeable element 5407.
  • the S pole of the fifth magnetic element 5405 is closer to the first magnetic element 5407 than the N pole of the fifth magnetic element 5405 and the S pole of the sixth magnetic element 5406 is closer to the first magnetic element 5407 than the N pole of the sixth magnetic element 5406. That is, inside the fifth magnetic element 5405 and the sixth magnetic element 5406, the magnetic field lines or the direction of the magnetic field (that is, the S pole points to the N pole direction) are all away from the first magnetic conductive element 5407.
  • the magnetic lines of force generated by the fifth magnetic element 5405 and the sixth magnetic element 5406 can have approximately the same direction in the magnetic gap, for example , Either from the first magnetic element 5407 to the second magnetic element 5402; or from the second magnetic element 5402 to the first magnetic element 5407, thereby increasing the magnetic field strength in the magnetic gap.
  • the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404, the fifth magnetic element 5405 and the sixth magnetic element 5406, the third magnetic element 5403 and the fifth magnetic element 5405 can be suppressed, so that the magnetic lines of induction corresponding to the magnetic field extend horizontally in the magnetic gap.
  • the magnetic gap extends from the end of the first magnetic element 5401 in a horizontal or nearly horizontal direction.
  • the direction of the magnetic field at the position of the voice coil in the magnetic gap can be mainly distributed along the horizontal direction or close to the horizontal direction, which improves the uniformity of the magnetic field and can effectively improve the sound effect generated by the vibration of the voice coil.
  • the magnetization direction of each magnetic element can also be other directions, and the combination of magnetic elements with different magnetization directions can also achieve the effect of increasing the intensity of the magnetic field and/or making the intensity distribution of the magnetic field more uniform.
  • the horizontal direction can be understood as the direction perpendicular to the direction of voice coil vibration, that is, the direction parallel to the plane where the top surface of the first magnetic element 5401 is located
  • the vertical direction can be understood as The direction in which the voice coil vibrates is a direction perpendicular to the plane where the top surface of the first magnetic element 5401 is located.
  • the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 may be parallel, and the magnetization directions of the third magnetic element 5403, the fourth magnetic element 5404, the fifth magnetic element 5405, and the sixth magnetic element 5406 They may be parallel or have a preset angle.
  • the angle between the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 may be between 170° and 190°.
  • reference may be made to the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in FIG. 6.
  • the third magnetic element 5403, the fourth magnetic element 5404, the fifth magnetic element 5405, and the sixth magnetic element 5406 may form a magnetic shielding field, thereby increasing the intensity of the magnetic field in the magnetic gap.
  • the connection mode of the mutual connection between the magnetic elements may include one or more combinations such as bonding, clamping, welding, riveting, and bolting.
  • the first magnetic element 5407, the fifth magnetic element 5405, and the sixth magnetic element 5406 may be cylinders, cuboids, or triangular prisms.
  • the first magnetic element 5401, the second magnetic element 5402, the third magnetic element 5403, and the fourth magnetic element 5404 may have a ring shape (continuous ring shape, discontinuous ring shape, rectangular ring shape, triangular ring shape, etc.).
  • the second magnetic element 5402, the third magnetic element 5403, and the fourth magnetic element 5404 may be the same in the shape and size of the cross section perpendicular to the Z axis.
  • the outer ring of the first magnetic element 5401, the fifth magnetic element 5405, and the sixth magnetic element 5406 may be the same in the shape and size of the outer contour of the cross section perpendicular to the Z axis.
  • the first magnetic element 5407, the first magnetic element 5401, and the second magnetic element 5402 may be the same in thickness
  • the third magnetic element 5403 and the fifth magnetic element 5405 may be the same in thickness
  • the fourth The magnetic element 5404 and the sixth magnetic element 5406 may be the same in thickness.
  • FIG. 55 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in FIG. 54 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 55.
  • the intensity of the magnetic field is highly symmetrical about the zero point of the Z axis, and the intensity of the magnetic field is relatively high.
  • Figure 56 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly includes a first magnetic element 5601, a second magnetic element 5602, a third magnetic element 5603, a fourth magnetic element 5604, a fifth magnetic element 5605, a sixth magnetic element 5606, and a first magnetic element. Element 5607. Compared with the embodiment shown in FIG.
  • this embodiment differs in that the size of the inner ring of the third magnetic element 5603 is smaller than the size of the inner ring of the second magnetic element 5602, and the size of the inner ring of the fourth magnetic element 5604 is smaller than The size of the inner ring of the second magnetic element 5602, the size of the outer contour of the fifth magnetic element 5605 is larger than the size of the outer ring of the first magnetic element 5601, and the size of the outer contour of the sixth magnetic element 5606 is larger than that of the first magnetic element 5601 The size of the outer ring.
  • the fifth magnetic element 5605 and the sixth magnetic element 5606 protrude toward the magnetic gap relative to the first magnetic element 5601, and the third magnetic element 5603 and the fourth magnetic element 5604 protrude toward the magnetic gap relative to the second magnetic element 5602. .
  • Fig. 57 is a schematic diagram of the magnetic field intensity change of the magnetic circuit assembly shown in Fig. 56 according to the present application.
  • the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in FIG. 56.
  • the intensity of the magnetic field is highly symmetrical about the zero point of the Z axis, and the overall intensity of the magnetic field is higher than that of the embodiment shown in FIG. 54.
  • FIG. 58 and FIG. 59 are cross-sectional schematic diagrams of a magnetic element structure according to some embodiments of the present application.
  • the magnetic element can be applied to any magnetic circuit component composed of a magnetic circuit element and a magnetic conductive element in the present application.
  • the cross section of the magnetic element located inside may be circular (for example, the magnetic element 661 of FIG. 58), oval, rectangular (for example, the magnetic element 681 of FIG. 59), triangle, arbitrary polygon, and the like.
  • the surrounding magnetic element can be ring-shaped, such as a circular ring (for example, the magnetic element 662 in FIG. 58), an elliptical ring, a rectangular ring (for example, the magnetic element 682 in FIG. 59), a triangular ring, and an arbitrary polygon. Ring and so on.
  • the magnetic element may include an inner ring and an outer ring.
  • the shape of the inner ring and/or the outer ring may be a circle, an ellipse, a triangle, a quadrilateral, or other arbitrary polygons.
  • the magnetic circuit components in the embodiments shown in FIGS. 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32 can be set to a structure similar to that shown in FIG. 58 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54 shown in the embodiment of the magnetic circuit components can be set similar to the structure shown in FIG. 59.
  • the magnetization direction of the magnetic element 661 may radiate outward from the center, and the magnetization direction of the magnetic element 662 may be from the inner side to the outer side.
  • the magnetic element 681 is composed of different magnets, and the magnetization direction of each magnet points to the opposite side of the magnetic element 682.
  • FIG. 60 is a schematic diagram of a structure of a magnetic element according to some embodiments of the present application.
  • the magnetic element can be applied to any magnetic circuit component composed of a magnetic circuit element and a magnetic conductive element in the present application.
  • the magnetic element may be composed of a plurality of magnets arranged in an arrangement. The two ends of any one of the magnets can be connected with the two ends of adjacent magnets or there is a certain distance. The spacing between the multiple magnets can be the same or different.
  • the magnetic element may be composed of 2 or 3 sheet magnets (for example, magnets 671, 672, and 673) arranged equidistantly.
  • the shape of the sheet-shaped magnet may be a fan shape, a quadrilateral shape, or the like.
  • the magnetic circuit assembly may also include other structural forms (as shown in Figure 61 and Figure 62) to make the magnetic gap
  • the intensity of the magnetic field is greater.
  • FIG. 61 and FIG. 62 can combine the embodiments shown in FIG. 61 and FIG. 62 with the previous embodiments according to the actual use requirements of the loudspeaker, so that the intensity of the magnetic field in the magnetic gap is relatively large and the distribution is relatively uniform.
  • Fig. 61 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly 6100 may include a first magnetic element 6101, a first magnetically permeable element 6102, a second magnetically permeable element 6103, and a second magnetic element 6104.
  • the first magnetic element 6101 and/or the second magnetic element 6104 may include any one or several types of magnets described in this application.
  • the first magnetic element 6101 may include a first magnet
  • the second magnetic element 6104 may include a second magnet
  • the first magnet and the second magnet may be the same or different.
  • the first magnetically permeable element 6102 and/or the second magnetically permeable element 6103 may comprise any one or more of the magnetically permeable materials described in this application.
  • the processing method of the first magnetically permeable element 6102 and/or the second magnetically permeable element 6103 may include any one or several processing methods described in this application.
  • the first magnetic element 6101 and/or the first magnetically permeable element 6102 may be arranged in an axisymmetric structure.
  • the first magnetic element 6101 and/or the first magnetically permeable element 6102 may be a cylinder, a rectangular parallelepiped, or a hollow ring shape (for example, the cross section is in the shape of a racetrack).
  • the first magnetic element 6101 and the first magnetically permeable element 6102 may be coaxial cylinders with the same or different diameters.
  • the second magnetically permeable element 6103 may be a groove-type structure.
  • the groove-shaped structure may include a U-shaped cross-section (as shown in FIG. 61).
  • the groove-shaped second magnetically conductive element 6103 may include a bottom plate and side walls.
  • the bottom plate and the side wall may be integrally formed.
  • the side wall may be formed by extending the bottom plate in a direction perpendicular to the bottom plate.
  • the bottom plate may be connected to the side walls by any one or several connection methods described in this application.
  • the second magnetic element 6104 can be set in a ring shape or a sheet shape.
  • the second magnetic element 694 may be coaxial with the first magnetic element 6101 and/or the first magnetically permeable element 6102.
  • the upper surface of the first magnetic element 6101 can be connected to the lower surface of the first magnetically permeable element 6102.
  • the lower surface of the first magnetic element 6101 can be connected to the bottom plate of the second magnetically permeable element 6103.
  • the lower surface of the second magnetic element 6104 is connected to the side wall of the second magnetically permeable element 6103.
  • the connection between the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and/or the second magnetic element 6104 may include one of bonding, clamping, welding, riveting, bolting, etc. Multiple combinations.
  • a magnetic gap is formed between the inner ring of the first magnetic element 6101 and/or the first magnetic element 6102 and the second magnetic element 6104.
  • the voice coil 6105 may be arranged in the magnetic gap.
  • the heights of the second magnetic element 6104 and the voice coil 6105 relative to the bottom plate of the second magnetically permeable element 6103 are equal.
  • the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and the second magnetic element 6104 may form a magnetic circuit.
  • the magnetic circuit assembly can generate a full magnetic field (also referred to as the "total magnetic field of the magnetic circuit assembly"), and the first magnetic element 6101 can generate a first magnetic field.
  • the full magnetic field is formed by the magnetic fields generated by all the components in the magnetic circuit assembly (for example, the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and the second magnetic element 6104.
  • the magnetic field strength of the full magnetic field in the magnetic gap (also referred to as magnetic induction or magnetic flux density) is greater than the magnetic field strength of the first magnetic field in the magnetic gap.
  • the second magnetic element 6104 can generate a second magnetic field, which can increase the magnetic field strength of the full magnetic field at the magnetic gap.
  • the second magnetic field mentioned here to increase the magnetic field strength of the full magnetic field means that when there is a second magnetic field
  • the magnetic field strength of the full magnetic field in the magnetic gap when there is is greater than the magnetic field strength of the full magnetic field in the magnetic gap when there is no second magnetic field (ie, there is no second magnetic element).
  • the magnetic circuit assembly refers to a structure that includes all magnetic elements and magnetic conductive elements
  • the full magnetic field refers to the magnetic field generated by the magnetic circuit assembly as a whole, the first magnetic field, the second magnetic field, and the second magnetic field
  • the three magnetic fields,..., and the Nth magnetic field respectively represent the magnetic fields generated by the corresponding magnetic elements.
  • the magnetic elements that generate the second magnetic field may be the same or different.
  • the angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is between 45 degrees and 145 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is equal to or greater than 90 degrees.
  • the magnetization direction of the first magnetic element 6101 is perpendicular to the lower surface or the upper surface of the first magnetic element 6101 vertically upwards (the direction shown by a in the figure), and the magnetization direction of the second magnetic element 6104 is from the first The inner ring (inner surface) of the second magnetic element 6104 points to the outer ring (outer surface) (as shown in the direction b in the figure, on the right side of the first magnetic element, the magnetization direction of the first magnetic element is deflected 90 degrees clockwise) Spend).
  • the angle between the direction of the full magnetic field and the magnetization direction of the second magnetic element 6104 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 6104, the angle between the direction of the magnetic field generated by the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 may be 0 degrees, 10 degrees, or 20 degrees. Equal to an angle less than or equal to 90 degrees.
  • the second magnetic element 6104 can increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly in FIG. 60, thereby increasing the magnetic induction intensity in the magnetic gap.
  • the originally diverging magnetic lines of force will converge to the position where the magnetic gap is located, further increasing the magnetic induction intensity in the magnetic gap.
  • the second magnetically permeable element 6103 may be a ring structure or a sheet structure.
  • the magnetic circuit assembly of FIG. 61 may further include a magnetic permeable cover that may surround the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and the second magnetic element 6104.
  • Fig. 62 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application.
  • the magnetic circuit assembly may further include a third magnetic element.
  • the upper surface of the third magnetic element 6205 is connected to the second magnetic element 6204, and the lower surface is connected to the side wall of the second magnetic element 6203.
  • a magnetic gap may be formed between the first magnetic element 6201, the first magnetically permeable element 6202, the second magnetic element 6204, and/or the third magnetic element 6205.
  • the voice coil 6209 may be arranged in the magnetic gap.
  • the first magnetic element 6201, the first magnetic element 6202, the second magnetic element 6203, the second magnetic element 6204, and the third magnetic element 6205 may form a magnetic circuit.
  • the magnetization direction of the second magnetic element 6204 may refer to the detailed description of FIG. 52 of the present application.
  • the magnetic circuit assembly can generate a first full magnetic field, and the first magnetic element 701 can generate a second magnetic field.
  • the third magnetic element 6205 may generate a third magnetic field, and the third magnetic field may increase the magnetic field strength of the second magnetic field at the magnetic gap.
  • the angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is between 45 degrees and 145 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is equal to or greater than 90 degrees.
  • the magnetization direction of the first magnetic element 6201 is perpendicular to the lower or upper surface of the first magnetic element 6201 (as shown in the direction of Figure a), and the magnetization direction of the third magnetic element 6205 is changed from the third The upper surface of the magnetic element 6205 points to the lower surface (as shown in the direction c in the figure, on the right side of the first magnetic element, the magnetization direction of the first magnetic element is deflected by 180 degrees in the clockwise direction).
  • the angle between the direction of the full magnetic field and the magnetization direction of the third magnetic element 6205 is not higher than 90 degrees. In some embodiments, at the position of the third magnetic element 6205, the angle between the direction of the magnetic field generated by the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 may be 0 degrees, 10 degrees, or 20 degrees. Equal to an angle less than or equal to 90 degrees.
  • the magnetic circuit assembly of FIG. 62 further adds a third magnetic element 6205.
  • the third magnetic element 6205 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly, thereby increasing the magnetic induction intensity in the magnetic gap.
  • the magnetic lines of induction will further converge to the position where the magnetic gap is located, further increasing the magnetic induction intensity in the magnetic gap.
  • the second magnetically conductive element may be a ring structure or a sheet structure.
  • the magnetic circuit assembly may not include the second magnetically conductive element.
  • at least one magnetic element may be further added to the magnetic circuit assembly. In some embodiments, the lower surface of the further added magnetic element may be connected to the upper surface of the second magnetic element.
  • the magnetization direction of the further added magnetic element is opposite to the magnetization direction of the third magnetic element.
  • the further added magnetic element may be connected to the sidewalls of the first magnetic element and the second magnetic element.
  • the magnetization direction of the further added magnetic element is opposite to the magnetization direction of the second magnetic element.
  • Fig. 63 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present specification.
  • the magnetic circuit assembly 6300 may include a first magnetic element 6301, a second magnetic element 6302, a first magnetic element 6303, a second magnetic element 6304, and a third magnetic element 6305.
  • the second magnetic element 6302 surrounds the first magnetic element 6301, and a magnetic gap is formed between the first magnetic element 6301 and the second magnetic element 6302.
  • the voice coil of the speaker can be arranged in the magnetic gap.
  • the bottom surface of the first magnetic element 6303 is connected to the top surface of the second magnetic element 6302, the bottom surface of the second magnetic element 6304 is connected to the top surface of the first magnetic element 6301, and the top surface of the third magnetic element 6305 is connected to the top surface of the first magnetic element 6301.
  • the top surface of the magnetic element 6301 and the top surface of the second magnetic element 6302 are connected.
  • the magnetization directions of the first magnetic element 6301 and the second magnetic element 6302 both extend in the vertical direction, and the magnetization direction of the first magnetic element 6301 is opposite to the magnetization direction of the second magnetic element 6302.
  • the N pole of the first magnetic element 6301 points to the second magnetic permeable element 6304 (that is, the upward direction in FIG. 71), and the N pole of the second magnetic element 6302 points to the third magnetically permeable element 6305 (that is, in FIG. 71). Downward direction).
  • Fig. 64 is a comparison diagram of frequency response curves of speakers using the magnetic circuit components shown in Fig. 63 and Fig. 56 respectively according to the present application.
  • the speaker using the magnetic circuit assembly shown in Fig. 56 also called “super-linear magnetic circuit”
  • the volume of each frequency band of the sound is higher, and the changes in the low and high frequency ranges are more gentle, the overall frequency response is more linear, and the sound quality is better.
  • this application uses specific words to describe the embodiments of the application.
  • “one embodiment”, “an embodiment” and/or “some embodiments” mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that “an embodiment” or “an embodiment” or “an alternative embodiment” mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. .
  • some features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.
  • numbers describing the number of ingredients and attributes are used. It should be understood that such numbers used in the description of the embodiments use the modifiers "about”, “approximately” or “substantially” in some examples. To modify. Unless otherwise stated, “approximately”, “approximately” or “substantially” indicates that the number is allowed to vary by ⁇ 20%.
  • the numerical data used in the specification and claims are approximate values, and the approximate values can be changed according to the required characteristics of individual embodiments. In some embodiments, the numerical data should consider the prescribed effective digits and adopt the method of general digit retention. Although the numerical range and data used to confirm the breadth of the range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values is as accurate as possible within the feasible range.

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Abstract

本说明书实施例公开了一种声学装置，包括：壳体，所述壳体具有容置腔；扬声器，设置于所述容置腔内，所述扬声器包括：磁路组件、音圈、振动组件和传振板；所述磁路组件形成磁间隙；所述音圈的一端设置于所述磁间隙内，所述音圈的另一端连接所述振动组件，所述振动组件与所述传振板连接，所述传振板连接所述壳体。

Description

声学装置及其磁路组件
交叉引用
本申请要求于2020年04月29日提交的中国申请202010358223.0和2020年08月12日提交的中国申请202021689802.5的优先权，全部内容通过引用并入本文。
技术领域
本申请涉及声学技术领域，特别涉及一种骨导声学装置。
背景技术
骨传导是一种声音传导方式，即将声音转化为不同频率的机械振动，通过人体骨骼和组织(例如颅骨、骨迷路、内耳淋巴液、螺旋器、听神经、听觉中枢)来传递声音。骨导声学装置(例如骨传导耳机)紧贴骨头，利用骨传导技术受话，声波可以直接通过骨头传至听神经，从而可以开放双耳，不伤害鼓膜，可以广泛应用于不同场景骨传导技术，例如，助听器。由于骨导声学装置的发声品质直接影响使用者的听觉体验，因此，提高发声品质对于骨导声学装置来说显得尤为重要。
发明内容
本申请涉及一种声学装置。该声学装置包括：壳体，所述壳体具有容置腔；扬声器，设置于所述容置腔内，所述扬声器包括：磁路组件、音圈、振动组件和传振板；所述磁路组件形成磁间隙；所述音圈的一端设置于所述磁间隙内，所述音圈的另一端连接所述振动组件，所述振动组件与所述传振板连接，所述传振板连接所述壳体。
在一些实施例中，所述振动组件包括内支架、外支架和振动片；所述音圈的另一端连接所述内支架；所述外支架的一端与所述磁路组件的两侧物理连接；所述振动片物理连接所述内支架和所述外支架，用于限制所述内支架和所述外支架在第一方向上的相对移动；所述第一方向为所述容置腔的径向；所述内支架、所述外支架和所述振动片中的至少一个，与所述传振板连接，以使得振动传递给所述传振板。
在一些实施例中，所述外支架和所述内支架可活动地连接所述振动片，以限制所述外支架和所述内支架沿所述第一方向上的相对移动，而允许所述内支架和所述振动片在第二方向上相对于所述外支架移动；所述第二方向为所述内支架和所述外支架的延伸方向。
在一些实施例中，所述外支架的另一端设置有第一凸柱，所述振动片开设有第一贯穿孔，所述第一凸柱通过所述第一贯穿孔可活动地连接所述振动片。
在一些实施例中，所述内支架的一端设置有第二凸柱，所述振动片开设有第二贯穿孔，所述第二凸柱通过所述第二贯穿孔可活动地连接所述振动片。
在一些实施例中，所述扬声器还包括弹性减震片，所述弹性减震片设置于所述振动片和所述内支架的一端之间，以减缓所述内支架在所述第二方向上的振动。
在一些实施例中，所述第二凸柱包括物理连接的笫一柱段和笫二柱段，所述笫二柱段设置于所述第一柱段的上方；所述笫一柱段穿设于所述第二贯穿孔，所述第二柱段插置于所述传振板内；所述弹性减震片开设有第三贯穿孔，所述弹性减震片通过所述第三贯穿孔套设于所述第二柱段，且支撑于所述笫一柱段上。
在一些实施例中，还包括防护元件；所述防护元件包括贴合部、容置部以及支撑部，所述贴合部和所述容置部形成第二容置腔；所述传振板设置于所述第二容置腔内，所述贴合部与所述传振板的外端面贴合设置，所述支撑部连接于所述第二容置腔，并设置于所述壳体上方。
在一些实施例中，所述壳体的内壁设置有环状承台，用于支撑所述环状支撑部和所述弹性减震片。
在一些实施例中，所述磁路组件包括磁性元件组和导磁罩；所述导磁罩包括罩体底部、罩体侧部以及筒槽，所述罩体底部和所述罩体侧部形成所述筒槽；所述磁性元件组设置于所述筒槽内，且与所述导磁罩之间形成所述磁间隙。
在一些实施例中，还包括固定件，所述固定件用于将所述磁性元件组固定于所述罩体底部；所述固定件包括螺栓和螺母，所述螺栓依次穿过所述磁性元件组后穿岀所述罩体底部，以通过螺纹连接将所述磁性元件组和所述罩体底部固定连接。
在一些实施例中，所述内支架形成盖槽，所述磁性元件组部分伸入所述盖槽内，所述外支架呈筒状设置。
在一些实施例中，所述磁路组件包括第一磁路组件以及第二磁路组件，所述第二磁路组件环绕所述第一磁路组件以形成所述磁间隙；所述第一磁路组件包括第一磁性元件以及第二磁性元件，所述磁路组件产生的总磁场在所述磁间隙内的磁场强度大于所述第一磁性元件或第二磁性元件在所述磁间隙内的磁场强度。
在一些实施例中，所述第一磁性元件以及第二磁性元件的磁化方向之间的夹角在150-180度。
在一些实施例中，所述第一磁性元件以及第二磁性元件的磁化方向相反。
在一些实施例中，所述第一磁性元件以及第二磁性元件的磁化方向均垂直于或 平行于所述音圈在所述磁间隙中的振动方向。
在一些实施例中，所述第二磁路组件包括第三磁性元件，所述第一磁路组件包括第一导磁元件；所述第一导磁元件设置在所述第一磁性元件和所述第二磁性元件之间，所述第三磁性元件至少部分地环绕所述第一磁性元件和所述第二磁性元件设置。
在一些实施例中，所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向均垂直于所述第一磁性元件与所述第一导磁元件连接的表面，且所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向的磁化方向相反。
在一些实施例中，所述第三磁性元件的磁化方向与所述第一磁性元件的磁化方向或所述第二磁性元件的磁化方向之间的夹角为60-120度。
在一些实施例中，所述第三磁性元件的磁化方向与所述第一磁性元件的磁化方向或所述第二磁性元件的磁化方向之间的夹角为0-30度。
在一些实施例中，所述第二磁性组件包括第一导磁元件和所述第一磁性组件包括第二导磁元件；所述第二导磁元件设置在所述第一磁性元件和所述第二磁性元件之间；所述第一导磁元件至少部分地环绕所述第一磁性元件和所述第二磁性元件设置。
在一些实施例中，所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向均垂直于所述第一磁性元件与所述第二导磁元件连接的表面，且所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向的磁化方向相反。
在一些实施例中，所述第二导磁元件设置环绕所述第一磁性元件，所述第一磁性元件环绕所述第二磁性元件之间。
在一些实施例中，所述第二导磁元件的上表面连接所述第一磁性元件的下表面，所述第二导磁元件的下表面连接所述第二磁性元件的上表面。
在一些实施例中，所述磁路组件包括第一磁路组件以及第二磁路组件，所述第二磁路组件环绕所述第一磁路组件以形成所述磁间隙；所述第一磁路组件包括第一磁性元件和所述第二磁路组件包括第一导磁元件；所述第一导磁元件至少部分地环绕所述第一磁性元件；所述第一磁性元件的磁化方向由所述第一磁性元件的中心区域指向所述第一磁性元件的外侧区域或由所述第一磁性元件的外侧区域指向所述第一磁性元件。
在一些实施例中，所述磁路组件包括第一磁路组件以及第二磁路组件，所述第二磁路组件环绕所述第一磁路组件以形成所述磁间隙；所述第一磁路组件包括第一磁性元件和所述第二磁路组件包括第二磁性元件；所述第二磁性元件至少部分地环绕所述第一磁性元件；所述第一磁性元件的磁化方向由所述第一磁性元件的中心区域指向所述第 一磁性元件的外侧区域或由所述第一磁性元件的外侧区域指向所述第一磁性元件。
在一些实施例中，所述第二磁性元件的磁化方向由所述第二磁性元件的外环指向所述第二磁性元件的内环或由所述第二磁性元件的内环指向所述第二磁性元件的内环。
本申请的一部分附加特性可以在下面的描述中进行说明。通过对以下描述中和相应附图的检查或者对实施例的生产或操作的了解，本申请的一部分附加特性对于本领域技术人员是明显的。本申请披露的特性可以通过对以下描述的具体实施例的各种方法、手段和组合的实践或使用得以实现和达到。
附图说明
在此所述的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的限定。在各图中，相同标号表示相同部件。
图1是根据本申请的一些实施例所示的示例性声学装置的结构模块图；
图2是根据本申请的一些实施例所示的示例性声学装置的结构示意图；
图3A根据本申请的一些实施例所示的图2中声学装置的拆解结构示意图；
图3B根据本申请的一些实施例所示的图3A中声学装置的截面结构示意图；
图3C是根据本申请的一些实施例所示的图3A中声学装置的振动片的结构示意图；
图4是根据本申请的一些实施例所示的骨导声学装置的纵截面示意图；
图5是根据本申请的一些实施例所示的气传导声学装置的纵截面示意图；
图6是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图7是根据本申请的图6所示的磁路组件的磁场强度变化示意图；
图8是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图9是根据本申请的图8所示的磁路组件的磁场强度变化示意图；
图10是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图11是根据本申请的图10所示的磁路组件的磁场强度变化示意图；
图12是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图13是根据本申请的图12所示的磁路组件的磁场强度变化示意图；
图14是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图15是根据本申请的图14所示的磁路组件的磁场强度变化示意图；
图16是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图17是根据本申请的图16所示的磁路组件的磁场强度变化示意图；
图18是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图19是根据本申请的图18所示的一种磁路组件的磁场强度变化示意图；
图20是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图21是根据本申请的图20所示的磁路组件的磁场强度变化示意图；
图22是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图23是根据本申请的图22所示的磁路组件的磁场强度变化示意图；
图24是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图25是根据本申请的图24所示的磁路组件的磁场强度变化示意图；
图26是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图27是根据本申请的图26所示的磁路组件的磁场强度变化示意图；
图28是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图29是根据本申请的图28所示的磁路组件的磁场强度变化示意图；
图30是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图31是根据本申请的图38所示的一种磁路组件的磁场强度变化示意图；
图32是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图33是根据本申请的图32所示的磁路组件的磁场强度变化示意图；
图34是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图35是根据本申请的图34所示的磁路组件的磁场强度变化示意图；
图36是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图37是根据本申请的图36所示的磁路组件的磁场强度变化示意图；
图38是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图39是根据本申请的图38所示的磁路组件的磁场强度变化示意图；
图40是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图41是根据本申请的图40所示的磁路组件的磁场强度变化示意图；
图42是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图43是根据本申请的图42所示的磁路组件的磁场强度变化示意图；
图44是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图45是根据本申请的图44所示的磁路组件的磁场强度变化示意图；
图46是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图47是根据本申请的图46所示的磁路组件的磁场强度变化示意图；
图48是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图49是根据本申请的图48所示的磁路组件的磁场强度变化示意图；
图50是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图51是根据本申请的图50所示的磁路组件的磁场强度变化示意图；
图52是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图53是根据本申请的图52所示的磁路组件的磁场强度变化示意图；
图54是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图55是根据本申请的图54所示的磁路组件的磁场强度变化示意图；
图56是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图57是根据本申请的图56所示的磁路组件的磁场强度变化示意图；
图58是根据本申请的一些实施例所示的一种磁性元件结构的横截面示意图；
图59是根据本申请的一些实施例所示的一种磁性元件结构的横截面示意图；
图60是根据本申请的一些实施例所示的一种磁性元件结构的示意图；
图61是根据本申请的一些实施例所示的一种磁路组件的纵截面示意图
图62是根据本申请的一些实施例所示的一种磁路组件的纵截面示意图；
图63是根据本申请的一些实施例所示的磁路组件的纵截面示意图；
图64是根据本申请的分别采用图63和图56所示的磁路组件的扬声器的频响曲线对比示意图。
具体实施方式
为了更清楚地说明本申请的实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其他类似情景。应当理解，给出这些示例性实施例仅仅是为了使相关领域的技术人员能够更好地理解进而实现本发明，而并非以任何方式限制本发明的范围。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一 个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其他的步骤或元素。术语“基于”是“至少部分地基于”。术语“一个实施例”表示“至少一个实施例”；术语“另一实施例”表示“至少一个另外的实施例”。其他术语的相关定义将在下文描述中给出。
以下，不失一般性，在描述本发明中骨传导相关技术时，将采用“骨传导扬声器”或“骨传导耳机”的描述。该描述仅仅为骨传导应用的一种形式，对于该领域的普通技术人员来说，“扬声器”或“耳机”也可用其他同类词语代替，比如“播放器”、“助听器”等。事实上，本发明中的各种实现方式可以很方便地应用到其它非扬声器类的听力设备上。例如，对于本领域的专业人员来说，在了解骨传导扬声器的基本原理后，可能在不背离这一原理的情况下，对实施骨传导扬声器的具体方式与步骤进行形式和细节上的各种修正和改变，特别地，在骨传导扬声器中加入环境声音拾取和处理功能，使该扬声器实现助听器的功能。例如，麦克风等传声器可以拾取使用者/佩戴者周围环境的声音，在一定的算法下，将声音处理后(或者产生的电信号)传送至骨传导扬声器部分。即骨传导扬声器可以经过一定的修改，加入拾取环境声音的功能，并经过一定的信号处理后通过骨传导扬声器部分将声音传递给使用者/佩戴者，从而实现骨传导助听器的功能。作为举例，这里所说的算法可以包括噪声消除、自动增益控制、声反馈抑制、宽动态范围压缩、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制等一种或多种的组合。
在一些实施例中，声学装置可以是具有声学输出能力的设备。例如，助听器、听音手环、耳机、音箱和智能眼镜等。其中，助听器是一种小型的扩音器，把原本听不到的声音加以扩大，再利用听障者的残余听力，使声音能送到大脑听觉中枢。在一些实施例中，助听器采用耳道传音，然而，当听障者的低频较差或整体听损较重时，耳道传音的方式对听障者的听觉效果改善比较有限。
在一些实施例中，声学装置可以包括骨传导耳机。骨传导耳机能够将音频转化成不同频率的机械振动，以人的骨头作为传递机械振动的介质，进而将机械振动传递到听觉神经。如此，可以使得使用者不通过耳朵的外耳道和鼓膜也能够接收到声音。
图1是根据本申请的一些实施例所示的示例性声学装置的结构模块图。如图1所示，声学装置100(例如，骨导扬声器、骨导耳机等)可以包括磁路组件102，振动组件104、支撑组件106以及存储组件108。
磁路组件102可以提供磁场。磁场可以用于将含有声音信息的信号转化为振动信号。在一些实施例中，声音信息可以包括具有特定数据格式的视频、音频文件或可以通过特定途径转化为声音的数据或文件。含有声音信息的信号可以来自于声学装置100本身的存储组件108，也可以来自于声学装置100以外的信息产生、存储或者传递系统。含有声音信息的信号可以包括电信号、光信号、磁信号、机械信号等一种或多种的组合。含有声音信息的信号可以来自一个信号源或多个信号源。多个信号源可以相关也可以不相关。在一些实施例中，声学装置100以通过多种不同的方式获取所述含有声音信息的信号，信号的获取可以是有线的或无线的，可以是实时或延时的。例如，声学装置100可以通过有线或者无线的方式接收含有声音信息的电信号，也可以直接从存储介质上(例如，存储组件108)获取数据，产生声音信号。又例如，骨传导助听器中可以包括具有声音采集功能的组件，通过拾取环境中的声音，将声音的杋械振动转换成电信号，通过放大器处理后获得满足特定要求的电信号。在一些实施例中，所述有线连接可以包括金属电缆、光学电缆或者金属和光学的混合电缆，例如，同轴电缆、通信电缆、软性电缆、螺旋电缆、非金属护皮电缆、金属护皮电缆、多芯电缆、双绞线电缆、带状电缆、屏蔽电缆、电信电缆、双股电缆、平行双芯导线、双绞线等种或多种的组合。以上描述的例子仅作为方便说明之用，有线连接的媒介还可以是其它类型，例如，其它电信号或光信号等的传输载体。
无线连接可以包括无线电通信、自由空间光通信、声通讯、和电礒感应等。其中无线电通讯可以包括IEEE802.11系列标准、IEEE802.15系列标准(例如蓝牙技术和紫蜂技术等)、第一代移动通信技术、第二代移动通信技术(例如FDMA、TDMA、SDMA、CDMA、和SSMA等)、通用分组无线服务技术、第三代移动通信技术(例如CDMA2000、WCDMA、TD-SCDMA、和WIMAX等)、第四代移动通信技术(例如TD-LTE和FDD-LTE等)、卫星通信(例如GPS技术等)、近场通信(NFC)和其它运行在ISM频段(例如2.4GHz等)的技术；自由空间光通信可以包括可见光、红外线讯号等；声通讯可以包括声波、超声波讯号等；电磁感应可以包括近场通讯技术等。以上描述的例子仅作为方便说明之用，无线连接的媒介还可以是其它类型，例如，Z-wave技术、其它收费的民用无线电频段和军用无线电频段等。例如，作为本技术的一些应用场景，声学装置100可以通过蓝牙技术从其他设备获取含有声音信息的信号。
振动组件104可以产生机械振动。振动的产生伴随着能量的转换，扬声器100可以使用特定的磁路组件102与振动组件104实现含有声音信息的信号向机械振动转 换。转换的过程中可能包含多种不冋类型能量的共存和转換。例如电信号通过换能装置可以直接转换成机械振动，产生声音。再例如，声音信息可以包含在光信号中，一种特定的换能装置可以实现由光信号转换为振动信号的过程。其它可以在换能装置工作过程中共存和转换的能量类型包括热能、礒场能等。换能装置的能量转换方式可以包括动圈式、静电式、压电式、动铁式、气动式、电磁式等。声学装置100的频率响应范围以及音质会受到振动组件104的影响。例如，在动圈式换能装置中，振动组件104包括缠绕的柱状音圈和一个振动体(例如，一个振动片或一个振动膜)，受信号电流驱动的柱状音圈在磁场中带动振动体振动发声，振动体材质的伸展和收缩、褶皱的变形、大小、形状以及固定方式，磁场的磁密度等，都会对声学装置100的音效质量带来很大的影响。振动组件104中振动体可以是镜面对称的结构、中心对称的结构或者非对称的结构振动体上可以设置有间断的孔状结构，使振动体产生更大的位移，从而让扬声器实现更高的灵敏度，提高振动与声音的输岀功率；振动体可以是圆环体结构，在圆环体内设置向中心辐辏的多个支杆，支杆的个数可以是两个或者更多。
支撑组件106可以对磁路组件102、振动组件104和/或存储组件108起到支撑作用。支撑组件106可以包括一个或多个壳体、一个或多个连接件。所述一个或多个壳体可以形成用于容纳磁路组件102、振动组件104和/或存储组件108的容纳空间。所述一个或多个连接件可以连接壳体与磁路组件102、振动组件104和/或存储组件108。
存储组件108可以存储含有声音信息的信号。在一些实施例中，存储组件108可以包括一个或多个存储设备。所述存储设备可以包括直接连接存储(Direct Attached Storage)，网络附加存储(Network Attached Storage)和存储区域网络(Storage Area Network)等存储系统上的存储设备。存储设备可以包括各类存储设备如固态存储设备(固态硬盘、固态混合硬盘等)、机械硬盘、USB闪存、记忆棒、存储卡(如CF、SD等)、其他驱动(如CD、DVD、HD DVD、Blu-ray等)、随机存储器(RAM)和只读存储器(ROM)。其中RAM可以包括十进计数管、选数管、延迟线存储器、威廉姆斯管、动态随机存储器(DRAM)、静态随机存储器(SRAM)、晶闸管随杋存储器(T-RAM)、和零电容随机存储器(Z-RAM)等；ROM可以包括磁泡存储器、磁钮线存储器、薄膜存储器、磁镀线存储器、磁芯内夺、磁鼓存储器、光盘驱动器、硬盘、磁带、早期NVRAM非易失存储器)、相变化内存、磁阻式随机存储式内存、铁电随机存储内存、非易失SRAM、闪存、电子抹除式可复写只读存储器、可擦除可编程只读存储器、可编栏只读存储器、屏敲式堆读内存、浮动连接门随杋存取存储器、纳米随机存储器、 赛道内存、可变电阻式内存、和可编程金属化单元等。以上提及的存储设备/存储单元是列举了一些例子，该存储设备/存储单元可以使用的存储设备并不局限于此。
以上对声学装置结构的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解声学装置的基本原理后，可能在不背离这一原理的情况下，对实施声学装置的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，声学装置100可以包括一个或多个处理器，所述处理器可以执行一个或多个声音信号处理算法。所述声音信号处理算法可以对所述声音信号进行修正或强化。例如对声音信号进行降噪、声反馈抑制、宽动态范围压缩、自动增益控制、主动环境识别、主动抗噪、定向处理、耳鸣处理、多通道宽动态范围压缩、主动啸叫抑制、音量控制，或其它类似的，或以上任意组合的处理，这些修正和改变仍在本发明的权利要求保护范围之内。又例如，声学装置100可以包括一个或多个传感器，例如温度传感器、湿度传感器、速度传感器、位移传感器等。所述传感器可以采集用户信息或环境信息。再例如，存储组件108可以不是必须的，可以从声学装置100中移除。
图2是根据本申请的一些实施例所示的示例性声学装置的结构示意图。如图2所示，声学装置1可以包括壳体11、扬声器组件12以及防护元件13。扬声器组件12可以设置于壳体11内。防护元件13可以支撑于壳体11上，用于保护扬声器组件12。
如图2所示，壳体11具有容置腔110(也可以称为第一容置腔)，容置腔110用于放置扬声器组件12，也即扬声器组件12设置于容置腔110内。在一些实施例中，声学装置1在使用时，壳体11朝向容置腔110的开口端111的一侧贴近使用者的头部，扬声器组件12所产生的机械振动可以经壳体朝向开口端111的一侧向使用者的头部传递。
在一些实施例中，壳体11的内壁设置有环状承台112，壳体11的内壁是指壳体11的容置腔110的内壁。在一些实施例中，环状承台112可以设置于内壁中靠近的开口端111的位置处。在一些实施例中，环状承台112可以设置于扬声器组件12上方的壳体内壁。环状承台112可以用于支撑防护元件13。通过将防护元件13设置于环状承台112上，可以使得防护元件13遮蔽或者大致遮蔽开口端111，进而保护容置腔110内的扬声器组件12。
在一些实施例中，扬声器组件12可以包括磁路组件(图中未示出)、音圈(图中未示出)、振动组件(图中未示出)和传振板121。磁路组件形成磁间隙，至少部分 地音圈设置于磁间隙内，音圈的另一端物理连接振动组件，振动组件与传振板121物理连接，传振板121物理连接壳体11。具体的，磁路组件可以形成磁场，音圈位于磁间隙内，即位于磁路组件形成的磁场中，会受到安培力的作用。安培力驱动音圈振动，进而带动振动组件产生机械振动，振动组件将振动传递给传振板121，传振板121将振动传递给壳体11，最终使得壳体11将振动通过人体的组织与骨骼传递到听觉神经，使使用者听到声音。在一些实施例中，传振板121以及至少部分地壳体11也可以称为振动组件中的元件。
在一些实施例中，磁路组件、音圈和振动组件可以设置于容置腔110内。传振板121与振动组件连接，并经开口端裸露于容置腔110外。通过将传振板121裸露至容置腔110外，可以使得传振板121更贴近使用者的头部，裸露的传振板121的振动能够更快速、更有力地传递到使用者的骨头。进而使得传递至人耳的机械振动更加完整、且不容易丢失频段，有效地改善听障者的听觉效果。
如图2所示，防护元件13可以设置于开口端111的上方，并贴合于传振板121的外端面。在一些实施例中，防护元件13可以包括贴合部131(即底部)、容置部132(即侧壁)以及支撑部133(例如，环状支撑部，即延伸部)。贴合部131和容置部132形成容置腔(也可以称为第二容置腔，例如，筒状容置腔)，传振板121可以设置于第二容置腔内，贴合部131与传振板121的外端面贴合设置，支撑部133连接于容置部132，并设置于壳体11上方。具体的，传振板121的外端面是指远离容置腔110或者远离振动组件的端面。
在防护元件13的装配过程中，可以将防护元件13盖合于开口端111的上方，将裸露于容置腔110外的传振板121伸入到第二容置腔内，进而将传振板121的外端面与贴合部131贴合。在一些实施例中，支撑部133可以设置于环状承台112上方。
在一些实施例中，防护元件13可以包括防护纱网。通过防护纱网的网状结构，在扬声器组件12产生机械振动的过程中，使容置腔110内外的空气相互流通，以平衡容置腔110内外的空气压差，进而减少容置腔110内的空气由于振动而产生的声音，衰减传振板121附近的空气振动产生的声音，减少漏音现象，提高整体的声学装置1的音质和声音效果。
在一些实施例中，为了提高支撑部133与环状承台112之间的连接稳定性，如图2所示，声学装置1可以包括上盖14(如，环状上盖)，上盖14用于将支撑部133压持于环状承台112上。如此，可以使防护元件13稳定地设置(或支撑)于环状承台 112上，减少支撑部133掉落的情况。
对于上盖14、支撑部133以及环状承台112之间的位置关系和支撑结构，有多种实施方式。
图3A根据本申请的一些实施例所示的图2中声学装置的拆解结构示意图；图3B根据本申请的一些实施例所示的图3A中声学装置的截面结构示意图；图3C是根据本申请的一些实施例所示的图3A中声学装置的振动片的结构示意图。如图3A所示，声学装置300可以包括壳体11以及扬声器组件12。扬声器组件12可以设置于壳体11内。扬声器组件12可以包括传振板121、振动组件、磁路组件以及音圈124。
如图3A以及3B所示，磁路组件可以包括第一磁路组件1231和第二磁路组件1232(例如，导磁罩)。在一些实施例中，第一磁路组件1231可以包括一个或多个磁性元件和/或一个或多个导磁元件。在一些实施例中，第二磁路组件1232可以包括一个或多个磁性元件和/或一个或多个导磁元件。在一些实施例中，磁路组件的磁性元件可以具有对应的磁化方向，以便于形成一个相对稳定的磁场。如本文中所述，磁性元件指的是可以产生磁场的元件。在一些实施例中，磁性元件可以包括为单个磁体，也可以为多个磁体的组合。在一些实施例中，第二磁路组件1232用于调整第一磁路组件1231产生的磁场，以增加磁场的利用率。在一些实施例中，振动组件可以与第二磁路组件1232物理连接。关于磁路组件、第一磁路组件1231和第二磁路组件1232的更多描述可以参考图4-61中的详细描述。
为便于说明，图3A以第二磁路组件1231为导磁罩为进行说明，需要指出的是，本说明书中关于第二磁路组件1231为导磁罩仅仅是为了说明，并不是为了限制本说明书的范围。导磁罩可以包括罩体底部12321、罩体侧部12322以及筒槽12323，罩体底部12321和罩体侧部12322形成筒槽12323。在一些实施例中，罩体侧部12322可以设置为筒状。
在一些实施例中，第一磁路组件1231设置于筒槽12323内，且与导磁罩1232之间形成磁间隙。对应的，至少部分的音圈124处于磁间隙中，即音圈124处于第一磁路组件1231和导磁罩1232之间形成的磁场中，从而，音圈124可以在在电信号(例如，音频信号)的激励作用下产生安培力，进而带动传振板121产生机械振动。在一些实施例中，第一磁路组件1231包括一个或多个磁性元件和/或一个或多个导磁元件，设置于第一磁路组件1231的上或内部。关于第一磁路组件1231的更多描述可以参考图6-64中的详细描述。
在一些实施例中，第一磁路组件1231物理连接导磁罩1232，例如，可以通过磁力吸附、胶接、卡接、螺纹连接等方式中的一种或其组合连接导磁罩1232的罩体底部12321。
在一些实施例中，如图3B所示，声学装置300包括固定件126，用于将第一磁路组件1231固定于罩体底部12321。
在一些实施例中，固定件126可以包括螺栓1261和螺母1262，螺栓1261依次穿过第一磁路组件1231后穿出罩体底部12321，以通过螺纹连接将第一磁路组件1231和罩体底部12321固定连接。如此设置，由于螺母1262嵌设在罩体底部12321内，使得扬声器组件12在在内外支架的延伸方向上的尺寸得以压缩，有利于控制扬声器组件12的整体尺寸。当然，在上述整体尺寸允许的情况下，螺母1262也可以设置在罩体底部12321背离筒槽12323的一侧，同样可以实现第一磁路组件1231和导磁罩1232之间的相对固定。
在一些实施例中，固定件126可以一同将第一磁路组件1231与导磁罩1232连接，在此种情况下，还可以在第一磁路组件1231与导磁罩1232之间设置胶体(图3A及图3B中未示出)，以使得两者之间的缝隙能够被填充，且两者的相对固定更稳固，进而避免第一磁路组件1231与导磁罩1232在机械振动下发生相对运动导致声学装置300产生杂音。
在第一磁路组件1231和导磁罩1232相对固定时，第一磁路组件1231与导磁罩1232之间具有间隙(图3A中未标注)，用于容纳音圈124。第一磁路组件1231产生的磁场可以分布在间隙中(也可以称为磁间隙)。在一些实施例中，磁间隙的尺寸尽可能相同，以增加磁场分布的均匀性，进而增加音圈124在磁场作用下振动的平稳度。
需要说明的是：为了増加音圈124在磁场作用下振动的平稳度，音圈124与第一磁路组件1231或导磁罩1232之间的间距处处相等。在一些实施例中，在前期加工、后期组装扬声器组件的过程中，可以保证第一磁路组件1231、导磁罩1232、音圈124等结构件的同轴度。
在一些实施例中，如图3A和图3B所示，振动组件可以包括内支架1221、外支架1222和振动片1223。外支架1222的一端与磁路组件的两侧(例如，导磁罩1232的罩体侧部12322)物理连接。在一些实施例中，物理连接可以包括磁力吸附、卡接和螺纹连接等中的一种或多种组合。在一些实施例中，外支架1222的一端可以与磁路组件的两侧(例如，导磁罩1232的罩体侧部12322)一体成型。例如，外支架1222的一端 通过注塑的方式与磁路组件的两侧(例如，导磁罩1232的罩体侧部12322)一体成型。通过将外支架1222和磁路组件中的元件(例如，导磁罩1232的罩体侧部12322)设置为一体成型件，可以有效减小外支架12222与磁路组件的装配误差，保证两者的同轴度。
内支架1221的一端与音圈124物理连接。如前所述，音圈124在磁路组件形成的磁场中，会受到安培力的作用，安培力驱动音圈124振动，进而与音圈124连接的内支架1221会产生振动。内支架1221和外支架1222通过振动片1223连接，因此，外支架1222和振动片1223也会产生振动。在一些实施例中，内支架1221、外支架1222和振动片1223中的至少一个与传振板121连接，以使得振动传递给传振板121。
在一些实施例中，振动片1223物理连接内支架1221和外支架1222，可以用于限制内支架1221和外支架1222在第一方向上的相对移动；第一方向为容置腔110的径向。由于振动片1223连接内支架1221和外支架1222，因此，外支架1222的装配误差同样会导致内支架1221与磁路组件之间的装配误差，进而导致音圈124在磁场作用下振动的平稳度降低，也即音圈124带动振动组件产生机械振动的平稳度变差，进而影响声学装置300的发声品质。
在一些实施例中，外支架1222和/或内支架1221可活动地连接振动片1223，以限制外支架1222和内支架1221沿第一方向上的相对移动，而允许内支架1221和振动片1223在第二方向上相对于外支架1222移动；第二方向为内支架1221和外支架1222的延伸方向。
在一些实施例中，外支架1222可活动地连接振动片1223。如本文中所述，第一元件(例如，外支架1222)可活动连接于第二元件指的是第一元件和第二元件可以通过连接部分进行相对运动。在一些实施例中，外支架1222的远离磁路组件(即靠近传振板1121)的一端设置有第一凸柱12221，振动片1223开设有第一贯穿孔12231，第一凸柱12221通过第一贯穿孔12231可活动地连接振动片1223，即振动片1223可以沿着第一凸柱12221上下运动。在一些实施例中，第一凸柱12221与第一贯穿孔12231相适配。第一凸柱12221可活动地穿设于第一贯穿孔12231。
在一些实施例中，第一凸柱12221和笫一贯穿孔12231的数量可以为多个。
在一些实施例中，内支架1221可活动地连接振动片1223。在一些实施例中，内支架1221的一端可以设置有第二凸柱12211，振动片1223开设有第二贯穿孔12232，第二凸柱12211通过第二贯穿孔12232可活动地连接振动片1223。
在本说明书的一些实施例中，通过第一凸柱12221配合笫一贯穿孔12231以及笫二凸柱12211配合第二贯穿孔12232，可以限制外支架1222和内支架1221沿第一方向上的相对移动，而允许内支架1221和振动片在1223在第二方向上相对于外支架1222移动，以便于将振动组件产生的机械振动传递岀去。内支架1221的其他部分可以与振动片在1223固定连接，以便在音圈振动下内支架1221可以并将振动通过内支架1221传递给振动片1223。如本文中所述，第一元件(例如，内支架1221)固定连接于第二元件指的是第一元件和第二元件无法通过连接部分进行相对运动，即第一元件和第二元件通过连接部分保持相对静止。
如图3C所示，在一些实施例中，振动片1223可以包括环状边缘部12233以及连接于环状边缘部12233内的一个或者多个肋条12234，环状边缘部12233开设有笫一贯穿孔12231。内支架1221朝向传振板121的一面可以开设有与肋条12234相对应的通槽(图未示)，肋条12234可以容置于通槽内，进而可以限制外支架1222和内支架1221沿第一方向上的相对移动，而允许内支架1221和振动片1223在第二方向上相对于外支架1222移动；第二方向为内支架1221和外支架1222的延伸方向。
图3C是根据本申请的一些实施例所示的振动片的结构示意图。如图11C所示，在一些实施例中，振动片1223还可以包括环状中间部12235、环状边缘部12233和环状中间部12235之间连接一个或多个肋条12234。环状中间部12235开设有第二贯穿孔12232，第二凸柱12211的位置则与笫二贯穿孔12232的位置相对应(不限于图3A所示情况)。环状边缘部12233开设有第一贯穿孔12231，第一凸柱12221的位置则与笫一贯穿孔12231的位置相对应。
在一些实施例中，扬声器组件12可以包括弹性减震片125，弹性减震片125设置于传振板121和内支架1221的一端之间，以减缓内支架1221在第二方向上的振动。
在一些实施例中，所述第二凸柱12211可以包括物理连接的笫一柱段12212和笫二柱段12213。如图3A所示，笫二柱段12213设置于第一柱段12212的上方；笫一柱段12212穿设于第二贯穿孔12232，第二柱段12213插置于传振板121内；弹性减震片125开设有第三贯穿孔1251，弹性减震片125通过第三贯穿孔1251套设于第二柱段12213，且支撑于笫一柱段12212上。
在一些实施例中，第一柱段12212和第二柱段12213为一体成型件，第二柱段12213的横截面积小于第一柱段12212的横截面积。
在一些实施例中，弹性减震片125的外边缘可以连接壳体11。在一些实施例中， 弹性减震片125的外边缘可以设置于壳体11与防护元件(图中未示出，参考图2中的防护元件13)之间。具体的，弹性减震片125的外边缘可以固定连接于壳体11，防护元件再固定连接于弹性减震片125。
在一些实施例中，弹性减震片125可以夹持于壳体11的内壁设置的环状承台和防护元件的支撑部(图中未示出，参考图2中的支撑部133)之间，环状承台可以支撑弹性减震片125。在一些实施例中，支撑部的内表面可以和弹性减震片125胶粘连接，弹性减震片125可以和环状承台胶粘连接。
对于弹性减震片125可以夹持于环状承台和支撑部之间，环状承台可以支撑弹性减震片125。在一些实施例中，支撑部的外表面可以和弹性减震片125胶粘连接，弹性减震片125可以和环状承台胶粘连接。
对于在一些实施例中，弹性减震片125可以夹持于上盖的第二盖体(图中未示出，可以参考图2中的第二盖体142)和环状承台之间，环状承台可以支撑弹性减震片125。在一些实施例中，弹性减震片125可以通过胶粘连接分别与笫二盖体和环状承台相固定。
在本说明书的一些实施例中，通过设置弹性减震片125以减缓内支架11401在第二方向上的振动，可以增加传振板121振动的平稳度。
在一些实施例中，内支架1221形成盖槽12214。在一些实施例中，内支架1221朝向第一磁路组件1231的一端形成盖槽12214。第一磁路组件1231部分伸入盖槽12214内。在一些实施例中，内支架1221的一端(朝向第一磁路组件1231的一端)罩设于第一磁路组件1231上，以使得第一磁路组件1231能够部分伸入盖槽12214内。如此设置，在满足扬声器组件12的发声需求下，可以使得扬声器组件12在内外支架的延伸方向上的尺寸得以压缩，有利于控制扬声器组件12的整体尺寸。
图4是根据本申请的一些实施例所示的骨导声学装置的纵截面示意图。如图所示，骨传声学装置400可以包括磁路组件(图中未示出)、振动组件403、音圈404。在一些实施例中，磁路组件可以包括第一磁路组件401和第二磁路组件402，第二磁路组件402环绕第一磁路组件401设置以形成磁间隙，音圈404可以设置在磁间隙内，音圈404与振动组件403相连。
第一磁路组件401和第二磁路组件402中的至少一个可以包括磁性元件和/或导磁元件。在本申请中，通过磁性元件、导磁元件组合和位置变化，以及通过设置各个磁性元件的磁化方向，可以改变磁间隙中的磁场的强度及其分布情况。
在一些实施例中，第一磁路组件可以包括第一磁性元件以及第二磁性元件，磁路组件产生的总磁场在磁间隙内的磁场强度大于第一磁性元件或第二磁性元件在磁间隙内的磁场强度。在一些实施例中，第一磁性元件以及第二磁性元件的磁化方向相反。在一些实施例中，第一磁性元件以及第二磁性元件的磁化方向之间的夹角在150-180度。例如，第一磁性元件和第二磁性元件的磁化方向之间的夹角可以等于，例如，150°、170°或180°等。在一些实施例中，第一磁性元件以及第二磁性元件的磁化方向均垂直或平行于音圈在磁间隙中的振动方向且磁化方向相反。如本文中所述，音圈在磁间隙中的振动方向指的是音圈在某个时刻的振动方向。在一些实施例中，若第一磁性元件以及第二磁性元件的磁化方向平行于音圈在磁间隙中的振动方向，第一磁性元件以及第二磁性元件可以沿着音圈在磁间隙中的振动方向堆叠；若第一磁性元件以及第二磁性元件的磁化方向垂直于音圈在磁间隙中的振动方向，第一磁性元件以及第二磁性元件可以沿着与音圈在磁间隙中的振动方向垂直的方向堆叠。关于所述第一磁路组件的更多细节可以参见图6-图63。
在一些实施例中，第一磁路组件包括第一磁性元件、第二磁性元件以及第一导磁元件，第二磁路组件可以包括第三磁性元件。第一导磁元件设置在第一磁性元件和第二磁性元件之间，第三磁性元件至少部分地环绕第一磁性元件和第二磁性元件设置。在一些实施例中，第一磁性元件的磁化方向与第二磁性元件的磁化方向均垂直于第一磁性元件与第一导磁元件连接的表面，且第一磁性元件的磁化方向与第二磁性元件的磁化方向的磁化方向相反。在一些实施例中，第三磁性元件的磁化方向与第一磁性元件的磁化方向或第二磁性元件的磁化方向之间的夹角可以在60-120度，和/或0-30度范围内。关于所述第一磁路组件的第一导磁元件和所述第二磁路组件的第三磁性元件的更多描述可以参见图6、8、34、36、38、40、42、54和/或56。
在一些实施例中，第一磁性组件可以包括第一磁性元件、第二磁性元件以及第二导磁元件，第二磁性组件包括第一导磁元件；第二导磁元件设置在第一磁性元件和第二磁性元件之间；第一导磁元件至少部分地环绕第一磁性元件和第二磁性元件设置。在一些实施例中，第一磁性元件的磁化方向与第二磁性元件的磁化方向均垂直于第一磁性元件与第一导磁元件连接的表面，且第一磁性元件的磁化方向与第二磁性元件的磁化方向的磁化方向相反。在一些实施例中，第二导磁元件设置环绕第一磁性元件，第一磁性元件环绕第二磁性元件之间。在一些实施例中，第二导磁元件的上表面连接第一磁性元件的下表面，第二导磁元件的下表面连接第二磁性元件的上表面。在一些实施例中，若 第一磁性元件以及第二磁性元件可以沿着音圈在磁间隙中的振动方向堆叠，第二导磁元件的上表面连接第一磁性元件的下表面，第二导磁元件的下表面连接第二磁性元件的上表面。在一些实施例中，若第一磁性元件以及第二磁性元件可以沿着与音圈在磁间隙中的振动方向的垂直的方向堆叠，第二导磁元件的外壁连接第一磁性元件以及第二磁性元件的内表面。如本文中所述，磁性元件的内表面(或内壁或内环或内侧区域)指的是大致平行于音圈在磁间隙中的振动方向且远离音圈的面。磁性元件的外表面(或外壁或外环或外侧区域)指的是大致平行于音圈在磁间隙中的振动方向且靠近音圈的面；磁性元件的内表面指的是大致平行于音圈在磁间隙中的振动方向且远离音圈的面；磁性元件的上表面(即顶面)指的是大致垂直于音圈在磁间隙中的振动方向且靠近振动片的面；磁性元件的下表面(即底面)指的是大致垂直于音圈在磁间隙中的振动方向且远离音振动片的面。关于所述第一磁路组件和所述第二磁路组件的更多描述可以参见图10、12、44、46、48、50和/或52。
在一些实施例中，第一磁路组件可以包括第一磁性元件，第二磁路组件可以包括第一导磁元件；第一导磁元件至少部分地环绕第一磁性元件；第一磁性元件的磁化方向由第一磁性元件的中心区域(或内侧区域)指向第一磁性元件的外侧区域或由第一磁性元件的外侧区域指向第一磁性元件的中心区域(或内侧区域)。在一些实施例中，第一磁性元件为环形。在一些实施例中，第一磁性元件为圆柱形。关于所述第一磁路组件和所述第二磁路组件的更多描述可以参见图24、26、28、30、32、61和/或62。
在一些实施例中，第一磁路组件可以包括第一磁性元件，第二磁路组件可以包括第二磁性元件；第二磁性元件至少部分地环绕第一磁性元件；第一磁性元件的磁化方向由第一磁性元件的中心区域(或内侧区域)指向第一磁性元件的外侧区域或由第一磁性元件的外侧区域指向第一磁性元件的中心区域(或内侧区域)。在一些实施例中，第二磁性元件的磁化方向由第二磁性元件的外环指向第二磁性元件的内环或由第二磁性元件的内环指向第二磁性元件的内环。关于所述第一磁路组件和所述第二磁路组件的更多描述可以参见图14、16、18、20、22和/或63。
在本申请中描述的磁性元件是指可以产生磁场的元件，例如磁铁等。所述磁性元件可以具有磁化方向，所述磁化方向是指在所述磁性元件内部的磁场方向，即所述磁性元件内部的磁感线方向或所述磁性元件S极指向N极方向。上述磁性元件可以包括一个或多个磁铁。例如，两个磁铁。在一些实施例中，所述磁铁可以包括金属合金磁铁，铁氧体等。其中，金属合金磁铁可以包括钕铁硼、钐钴、铝镍钴、铁铬钴、铝铁硼、铁 碳铝，或类似的，或其中多种的组合。铁氧体可以包括钡铁氧体、钢铁氧体、镁锰铁氧体、锂锰铁氧体、或类似的，或其中多种组合。需要注意的是，这里所说的导磁体也可以称为磁场集中器或铁芯。导磁体可以调整磁性元件产生的磁场的分布。所述导磁体可以包括由软磁材料加工而成的元件。在一些实施例中，所述软磁材料可以包括金属材料、金属合金、金属氧化物材料、非晶金属材料等，例如铁、铁硅系合金、铁铝系合金、镍铁系合金、铁钴系合金、低碳钢、硅钢片、矽钢片、铁氧体等。在一些实施例中，可以通过铸造、塑性加工、切削加工、粉末冶金等一种或多种组合的方法加工所述导磁体。铸造可以包括砂型铸造、熔模铸造、压力铸造、离心铸造等；塑性加工可以包括轧制、铸造、锻造、冲压、挤压、拔制等一种或多种组合；切削加工可以包括车削、铣削、刨削、磨削等。在一些实施例中，所述导磁体的加工方法可以包括3D打印、数控机床等。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。在一些实施例中，磁性元件和导磁元件可以设置为轴对称结构。所述轴对称结构可以是环状结构、柱状结构或是其它具有轴对称结构。
在一些实施例中，当音圈404内通入电流后，音圈404位于在第一磁路组件401和第二磁路组件402形成的磁场中，会受到安培力作用。所述安培力驱动音圈404振动，进而带动振动组件403振动。振动组件403将所述振动通过组织与骨骼传递到听觉神经，从而使人听到声音。振动组件403与可以与人体皮肤直接接触，或可以通过由特定材料组成的振动传递层与皮肤接触。关于振动组件403的更多描述可以参考图2-3C的详细描述。
图5是根据本申请的一些实施例所示的气传导声学装置的纵截面示意图。如图5所示，气传导声学装置可以包括第一磁路组件501、振膜503、音圈504。其中，振膜503至少部分地环绕第一磁路组件501，第一磁路组件501与振膜503之间形成磁间隙，音圈504可以设置在磁间隙内，振膜503与音圈504相连。所述振膜503可以通过一个或多个折环连接在气传导扬声器的壳体(或者支架)上。第一磁路组件501和振动膜503可以包括磁性元件和/或导磁元件。在本申请中，通过磁性元件、导磁元件组合和位置变化，以及设置各个磁性元件的磁化方向，可以改变磁间隙中的磁场的强度及其强度的分布情况。与骨传导扬声器产生声音的原理类似，音圈504受到安培力后会在磁间隙中振动，音圈504的振动带动振膜503振动，进而推动空气振动，从而使人听到声音。
以上对骨传导声学装置和气传导声学装置结构的描述仅仅是具体的示例。不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解骨传导扬声 器的基本原理后，可能在不背离这一原理的情况下，对实施骨传导扬声器的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，骨传导声学装置可以包括外壳、连接件。连接件连接振动板与外壳。又例如，气传导扬声器可以包括非金属壳体，音圈通过折环连接到非金属壳体上。
图6是根据本申请的一些实施例所示的磁路组件的纵截面示意图；图7是根据本说明书的图6所示的磁路组件的磁场强度变化示意图。
如图6所示，磁路组件600可以包括第一磁性元件601、第二磁性元件602、第三磁性元件603和第一导磁元件604。
在一些实施例中，第一导磁元件604设置在第一磁性元件601和第二磁性元件602之间，第三磁性元件603至少部分地环绕第一磁性元件601和第二磁性元件602设置。第一磁性元件601和第二磁性元件602与第三磁性元件603之间形成磁间隙。在一些实施例中，第一磁性元件601和第二磁性元件602的磁化方向均垂直于第一导磁元件604与第一磁性元件601和/或第二磁性元件602连接的表面(即图中竖直方向，图中每个磁性元件上的箭头方向表示该磁性元件的磁化方向)，且第一磁性元件601和第二磁性元件602的磁化方向相反。
在一些实施例中，第一磁性元件601和第二磁性元件602的放置可以包括第一磁性元件601和第二磁性元件602的相同的磁极靠近第一导磁元件604；不同的磁极远离第一导磁元件604。例如，第一磁性元件601的N极相较于第一磁性元件601的S极和第二磁性元件602的N极相较于第二磁性元件602的S极均靠近第一导磁元件604，即在第一磁性元件601以及第二磁性元件602的内部，磁感线或磁场方向(即S极指向N极方向)都是指向第一导磁元件604。又例如，第一磁性元件601的S极相较于第一磁性元件601的N极和第二磁性元件602的S极相较于第二磁性元件602的N极均靠近第一导磁元件604，即在第一磁性元件601以及第二磁性元件602的内部，磁感线或磁场方向(即S极指向N极方向)都是背离第一导磁元件604。
通过将第一磁性元件601和第二磁性元件602的磁化方向设置为竖直方向且方向相反，使得第一磁性元件601和第二磁性元件602为对置充磁设置，可以使第一磁性元件601和第二磁性元件602产生的磁感线在磁间隙内的方向大致相同，例如，都是从第一导磁元件604指向第三磁性元件603；或者都是从第三磁性元件603指向第一导磁元件604，从而增加磁间隙内的磁场强度。另外，通过将第一磁性元件601和第二磁性元件602的磁化方向设置为竖直方向且方向相反，可以压制第一磁性元件601和第二磁 性元件602在磁间隙内产生的磁场，使磁场对应的磁感线在磁间隙中延伸水平方向分布。例如，当第一磁性元件601以及第二磁性元件602内部的磁感线或磁场方向(即S极指向N极方向)都是指向第一导磁元件604，磁感线可以从第一导磁元件604的端部沿着水平或者接近水平的方向向磁间隙中延伸；当第一磁性元件601以及第二磁性元件602内部的磁感线或磁场方向(即S极指向N极方向)都是背离第一导磁元件604，磁感线从磁间隙中沿着水平或者接近水平的方向向第一导磁元件604的端部延伸。
在一些实施例中，第三磁性元件603的磁化方向与第一磁性元件601或第二磁性元件602的磁化方向相垂直。通过将磁化方向设置为相互垂直，可以进一步引导磁间隙内的磁感线沿着水平或接近水平方向延伸。例如，当第一磁性元件601以及第二磁性元件602内部的磁感线或磁场方向(即N极指向S极方向)都是指向第一导磁元件604，磁感线可以从第一导磁元件604的端部沿着水平或者接近水平的方向向磁间隙中延伸并穿过第三磁性元件603；当第一磁性元件601以及第二磁性元件602内部的磁感线或磁场方向(即S极指向N极方向)都是背离第一导磁元件604，磁感线穿过第三磁性元件603从磁间隙中沿着水平或者接近水平的方向向第一导磁元件604的端部延伸。这样，可以使得磁间隙内音圈位置处的磁场方向主要沿着水平方向或接近水平方向分布，提高了磁场的均匀性和强度，能够有效提高音圈振动产生的音效。
需要说明的是，在其他一些实施例中，各个磁性元件的磁化方向也可以是其他方向，将具有不同磁化方向的磁性元件的组合，也可以达到提高磁场的强度和/或使得磁场的强度分布更为均匀的效果。
需要说明的是，竖直方向可以理解为音圈振动的方向，也就是与第一磁性元件601的顶面所在的平面相垂直的方向。在一些实施例中，第三磁性元件603的磁化方向与第一磁性元件601的磁化方向或第二磁性元件602的磁化方向可以设置为不是相互垂直，两者的磁化方向可以存在预设夹角。其中，预设夹角可以设置在一定的角度范围内。在一些实施例中，第三磁性元件603的磁化方向与第一磁性元件601的磁化方向或第二磁性元件602的磁化方向之间的夹角在60度与120度之间。在一些实施例中，第三磁性元件603的磁化方向与第一磁性元件601的磁化方向或第二磁性元件602的磁化方向之间的夹角在50度与130度之间。在一些实施例中，第三磁性元件603的磁化方向与第一磁性元件601的磁化方向或第二磁性元件602的磁化方向之间的夹角在0度与30度之间。例如，第三磁性元件603的磁化方向与第一磁性元件601的磁化方向或第二磁性元件602的磁化方向之间的夹角可以等于0°、60°、80°、90°、100°、 180°等。
在一些实施例中，第一磁性元件601的磁化方向与第二磁性元件602的磁化方向也可以存在预设夹角。在一些实施例中，第二磁性元件602的磁化方向与第一磁性元件601的磁化方向之间的夹角在90度与180度之间。在一些实施例中，第二磁性元件602的磁化方向与第一磁性元件601的磁化方向之间的夹角在150度与180度之间。例如，第二磁性元件602的磁化方向与第一磁性元件601的磁化方向之间的夹角可以等于，例如，170°、180°等。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接和螺栓连接等一种或多种的组合。如本文中所述，两个磁化方向的夹角可以指的是以其中一个磁化方向为基准，旋转至另一个磁化方向所在方向需要旋转的角度，其中顺时针旋转的角度为正数，逆时针旋转的角度为负数。
在一些实施例中，如图6所示，磁路组件还包括第二导磁元件605、第三导磁元件606和第四导磁元件607。第二导磁元件605的底面与第一磁性元件601的顶面连接，第三导磁元件606的底面与第三磁性元件603的顶面连接。第二导磁元件605与第三导磁元件606在磁间隙处间隔设置。第四导磁元件607的顶面可以与第二磁性元件602的底面以及第三磁性元件603的底面均连接。
在一些实施例中，第一磁性元件601、第二磁性元件602、第一导磁元件604、第二导磁元件605和第四导磁元件607均可以为圆柱体、长方体或三祾柱等。第三磁性元件603和第三导磁元件606可以为环状(连续圓环状、不连续圆环状、长方形环状、三角形环状等)。在一些实施例中，第一磁性元件601、第二磁性元件602、第一导磁元件604和第二导磁元件605在垂直于竖直方向的横截面的形状和尺寸上可以相同，第三磁性元件603和第三导磁元件606在垂直于竖直方向的横截面的形状和尺寸上可以相同。在一些实施例中，第一磁性元件601、第二磁性元件602、第一导磁元件604和第二导磁元件605的厚度的总和可以等于第三磁性元件603与第三导磁元件606的厚度的总和。在一些实施例中，第四导磁元件607和第三导磁元件606在厚度上可以相同。
在一些实施例中，第一磁性元件601、第二磁性元件602、第三磁性元件603、第一导磁元件604、第二导磁元件605、第三导磁元件606和第四导磁元件607以形成磁回路。在一些实施例中，磁路组件6000可以产生总磁场或全磁场，第一磁性元件601可以产生第一磁场。全磁场由所述磁路组件600中的所有组分(例如，第一磁性元件601、第二磁性元件602、第三磁性元件603、第一导磁元件604、第二导磁元件605、 第三导磁元件606和第四导磁元件607)共同作用下产生的磁场。全磁场在所述磁间隙内的磁场强度(也可以被称为磁感应强度或者磁通量密度)大于所述第一磁场在所述磁间隙内的磁场强度。在一些实施例中，第二磁性元件602可以产生第二磁场，第三磁性元件603可以产生第三磁场。第二磁场和/或第三磁场可以提高全磁场在所述磁间隙处的磁场强度。这里所说的第二磁场和/或第三磁场提高全磁场的磁场强度指的是在有第二磁场和/或第三磁场存在(即，存在第二磁性元件602和/或第三磁性元件603)时全磁场在所述磁间隙的磁场强度大于没有第二磁场和/或第三磁场存在(即，不存在第二磁性元件602和/或第三磁性元件603)时全磁场的。例如，存在第二磁性元件602和第三磁性元件603时产生的全磁场在所述磁间隙的磁场强度大于没有第二磁性元件602和第三磁性元件603时(即只有第一磁性元件601时)产生的全磁场在所述磁间隙的磁场强度。又例如，存在第三磁性元件603时产生的全磁场在所述磁间隙的磁场强度大于没有第三磁性元件603时(即只有第一磁性元件601和第二磁性元件602时)产生的全磁场的在所述磁间隙的磁场强度。本说明书中的其他实施例中，除非特别说明，磁路组件表示包含所有磁性元件和导磁元件的结构，全磁场表示由磁路组件整体产生的磁场，第二磁场、第二磁场、第三磁场、……、第N磁场分别表示由相应的磁性元件所产生的磁场。在不同的实施例中，产生所述第一磁场(或者第二磁场、第三磁场、……、第N磁场)的磁性元件可以是相同的，也可以不同。
图7是根据本申请的图6所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图6所示的Z轴方向测量磁场在Z轴方向上各点的强度。仅为了方便描述，本说明书中的Z轴为设置在磁间隙中，且沿着竖直方向延伸的轴，以用于表征磁场的强庋在竖直方向的分布情况。本领域技术人员可以根据实际的测量需求来设定Z轴的零点位置，例如，可以将Z轴的零点位置设置在第一磁性元件601、第一导磁元件604和第二磁性元件602在竖直方向的中心；又例如，第三磁性元件603的厚度方向的中点处；再例如，第一导磁元件604在竖直方向的中心。如图7所示，由于第一磁性元件601和第二磁性元件602的对置，磁场强度在Z轴零点附近(例如，-0.110mm)最高，磁场强度的最高值约0.61T，且磁场强度的分布在零点附近(例如，-0.110mm至0.171mm范围内)变化比较均匀。
图8是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图8所示，在一些实施例中，磁路组件800可以包括第一磁性元件801、第二磁性元件802、第三磁性元件803、第一导磁元件804、第二导磁元件805、第三导磁元件806、第四导磁元 件807和第五导磁元件808。本实施例与图6所示的实施例相比，区别在于，相较于图6所示的实施例中的第四导磁元件607，本实施例中的笫四导磁元件807和笫五导磁元件808在磁间隙处间隔设置，第四导磁元件807的顶面与第二磁性元件802的底面连接，第五导磁元件808的顶面与第三磁性元件803的底面连接。
在一些实施例，第四导磁元件807可以为圆柱体、长方体或三棱柱等，第五导磁元件808可以为环状(连续圆环状、不连续圆环状、长方形环状、三角形环状等)。在一些实施例中，第四导磁元件807与第一磁性元件801、第二磁性元件802、第一导磁元件804、第二导磁元件805在垂直Z轴的横截面的形状和尺寸上可以相同。第四导磁元件807和第五导磁无件808在厚度上可以相同。在一些实施例中，第五导磁元件808与第三导磁元件806在厚度以及垂直Z轴的横截面的形状和尺寸上可以相同。
图9是根据本申请的图8所示的磁路组件的磁场强度变化示意图。在碱间隙中，沿图8所示的Z軸方向測量磁场在Z轴方向上各点的强度。如图9所示，由于第一磁性元件801和第二磁性元件802两侧的导磁元件分布相比于图6更加对称，故磁路组件在磁间隙中产生的磁场强度的分布在零点两侧(例如，0.031mm两侧)更加对称，且在零点附近位置(例如，-0.344mm至0.075mm)变化较为均匀。但由于第四导磁元件807和第五导磁元件808不连续，导致磁场强度的最高值相比于具有连续的第四导磁元件607的磁路组件600有所下降，约为0.4T。
需要说明的是，在图6和图8所示的实施例中，在设置了各个磁性元件的基础上，本领域技术人员可以根据需要进一步确定导磁元件的数量、设置位置和设置形式，本申请对此不作进一步限定。例如，图6所示实施例的第二导磁元件605和第三导磁元件603也可以连接在一起。
图10是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图10所示，磁路组件1000可以包括第一磁性元件1001、第二磁性元件1002、第一导磁元件1003和第二导磁元件1004。
在一些实施例中，第二导磁元件1004设置在第一磁性元件1001和第二磁性元件1002之间；第一导磁元件1003至少部分地环绕第一磁性元件1001和第二磁性元件1002设置，第一磁性元件1001和第二磁性元件1002，与第一导磁元件1003之间形成磁间隙；第一磁性元件1001和第二磁性元件1002的磁化方向均垂直于第二导磁元件1004与第一磁性元件1001和/或第二磁性元件1002连接的表面(即图中的竖直方向，图中每个磁性元件上的箭头方向表示该磁性元件的磁化方向)，且二者的磁化方向相反。
在一些实施例中，第一磁性元件1001和第二磁性元件1002的放置可以包括第一磁性元件1001和第二磁性元件1002的相同的磁极靠近第二导磁元件1004；不同的磁极远离第二导磁元件1004。例如，第一磁性元件1001的N极相较于第一磁性元件1001的S极和第二磁性元件1002的N极相较于第二磁性元件1002的S极均靠近第二导磁元件1004，即在第一磁性元件1001和第二磁性元件1002的内部，磁感线或磁场方向(即S极指向N极方向)都是指向第二导磁元件1004。又例如，第一磁性元件1001的S极相较于第一磁性元件1001的N极和第二磁性元件1002的S极相较于第二磁性元件1002的N极均靠近第二导磁元件1004，即在第一磁性元件1001以及第二磁性元件1002的内部，磁感线或磁场方向(即S极指向N极方向)都是背离第二导磁元件1004。
通过将第一磁性元件1001和第二磁性元件1002的磁化方向设置为竖直方向且方向相反，使得第一磁性元件1001和第二磁性元件1002为对置充磁设置，可以使第一磁性元件1001和第二磁性元件1002产生的磁感线在磁间隙内的方向大致相同，例如，都是从第二导磁元件1004指向第一导磁元件1003；或者都是从第一导磁元件1003指向第二导磁元件1004，从而增加磁间隙内的磁场强度。另外，通过将第一磁性元件1001和第二磁性元件1002的磁化方向设置为竖直方向且方向相反，可以压制第一磁性元件1001和第二磁性元件1002产生的磁场，使磁场对应的磁感线在磁间隙中延伸水平方向分布。例如，当第一磁性元件1001以及第二磁性元件1002的内部的磁感线或磁场方向(即S极指向N极方向)都是指向第二导磁元件1004，磁感线可以从第二导磁元件1004的端部沿着水平或者接近水平的方向向磁间隙中延伸，并穿过第一导磁元件1003。这样可以使得磁间隙内音圈位置处的磁场方向主要沿着水平方向或接近水平方向分布，提高了磁场的均匀性和强度，能够有效提高音圈振动产生的音效。
在其他一些实施例中，各个磁性元件的磁化方向也可以是其他方向，通过具有不同磁化方向的磁性元件的组合，也可以达到提高磁场的强度和/或使得磁场的强度分布更为均匀的效果。另外，第一磁性元件1001的磁化方向与第二磁性元件1002的磁化方向之间可以存在预设夹角。其中，预设夹角可以设置在一定的角度范围内，例如，60°、80、90°、100°等。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。在一些实施例中，第一磁性元件601的磁化方向与第二磁性元件602的磁化方向也可以存在预设夹角。例如，170°、190°等。关于第一磁性元件1001和第二磁性元件1002的磁化方向的相关描述可以参考图6中的关于第一 磁性元件601和第二磁性元件602的磁化方向。
在一些实施例中，如图10所示，磁路组件还包括第三导磁元件1005和第四导磁元件1006，第三导磁元件1005的底面可以与第一磁性元件1001的顶面连接，第四导磁元件1006的顶面可以与第二磁性元件1002的底面以及第二导磁元件1004的底面均连接。
在一些实施例，第一磁性元件1001、第二磁性元件1002、第二导磁元1004和第三导磁元件1005均可以为圓柱体、长方体或三棱柱等。第一导磁元件1003以为环状(连续圓环状、不连续圓环状、长方形环状、三角形环状等)。在一些实施例中，第一磁性元件1001、第二磁性元件1002、第二导磁元件1004和第三导磁元件1005在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例中，第一磁性元件1001、第二磁性元件1002、第二导磁元件1004和第三导磁元件1005的厚度的总和可以等于第一导磁元件1003的厚度。
图11是根据本申请的图10所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图10所示的Z轴方向测量磁场在Z轴方向上各点的强度，如图11所示，由于相比于图6的磁路组件缺少了进一步增强磁场的第三磁性元件603，磁场的强度在零点附近(例如，-0.500-0.188mm范围内)有所减弱，只能够达到的最高值约为0.38T，但零点附近的磁场强度分布仍然较为均匀。
图12是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图12所示，磁路组件1200可以包括第一磁性元件1201、第二磁性元件1202、第一导磁元件1203、第二导磁元件1204、第三导磁元件1205和第四导磁元件1206。本实施例与图10所示的实施例相比，区别在于，图12所示的实施例中的第四导磁元件1206不再与第一导磁元件1203连接，第四导磁元件1206的顶面与第二磁性元件1202的底面连接。第四磁性元件1206与第二导磁元件1204在磁间隙处间隔设置。关于第一磁性元件1201和第二磁性元件1202的磁化方向的相关描述可以参考图6中的关于第一磁性元件601和第二磁性元件602的磁化方向。
在一些实施例中，第一磁性元件1201、第二磁性元件1202、第二导磁元件1204、第三导磁元件1205和第四导磁元件1206可以均为圆柱体、长方体或三棱柱等，第一导磁体1203可以为环状(圆环状、长方形环状、三角形环状等)。
在一些实施例中，第一磁性元件1201、第二磁性元件1202、第二导磁元件1204、第三导磁元件1205和第四导磁元件1206的厚度的总和可以等于第一导磁元件1203的 厚度。
需要说明的是，在图10和图12所示的实施例中，在设置了第一磁性元件、第二磁性元件和第二导磁元件的基础上，本领域技术人员可以根据需要进一步改变导磁元件的数量、设置位置和设置形式，本申请对此不作进一步限定。例如，图10所示实施例的磁路组件的第二导磁元件1004和第三导磁元件1005也可以连接在一起。
图13是根据本申请的图12所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图12所示的Z轴方向测量磁场在Z轴方向上各点的强度，如图13所示，由于第四导磁元件1206与第一导磁元件1203不再连接，磁场强度的最高值相对于图10中具有连续的第四导磁元件1006的磁性组件1000有所提高，磁场强度在零点附近(例如，0.176mm)的最高值约为0.58T，零点附近的磁场强度分布较为均匀。
图14是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图14所示，磁路组件1400可以包括第一磁性元件1401和第二磁性元件1402，第二磁性元件1402至少部分地环绕第一磁性元件1401(即第二磁性元件1402的内表面或内壁环绕着第一磁性元件1401的外表面或外壁)，且第一磁性元件1401和第二磁性元件1402的之间形成磁间隙。音圈可以设置在磁间隙中。
在一些实施例中，第一磁性元件1401和第二磁性元件1402的磁化方向均平行于第一磁性元件1401的顶面(即图中水平方向)或垂直于内外表面。例如，第一磁性元件1401的磁化方向可以是沿着其中心向外的方向(即中心区域指向外侧区域)，第二磁性元件1402的磁化方向沿着其内侧(靠近第一磁性元件1401的一侧)向外侧(远离第一磁性元件1401的一侧)的方向。又例如，第一磁性元件1401的磁化方向可以是外侧指向中心的方向，第二磁性元件1402的磁化方向沿着其外侧(远离第一磁性元件1401的一侧)向内侧(靠近第一磁性元件1401的一侧)的方向。
在一些实施例中，第一磁性元件1401和第二磁性元件1402的放置可以包括第一磁性元件1401和第二磁性元件1402不同的磁极相互靠近或远离。例如，第一磁性元件1401的N极位于第一磁性元件1401的中心区域，S极位于第一磁性元件1401外侧区域，即在第一磁性元件1401内部，在平行于第一磁性元件1401的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是中心指向外侧；第二磁性元件1402的N极位于第二磁性元件1402的外侧区域，S极位于第二磁性元件1402内侧区域，即在第二磁性元件1402内部，在平行于第二磁性元件1402的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是内侧指向外侧。又 例如，第一磁性元件1401的S极位于第一磁性元件1401的中心区域，N极位于第一磁性元件1401外侧区域，即在第一磁性元件1401内部，在平行于第一磁性元件1401的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是外侧指向内侧；第二磁性元件1402的S极位于第二磁性元件1402的外侧区域，N极位于第二磁性元件1402内侧区域，即在第二磁性元件1402内部，在平行于第二磁性元件1402的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是外侧指向内侧。
在一些可替代的实施例中，第一磁性元件1401可以包括两个磁铁，两个磁铁的放置可以包括相邻设置，且两者相同的磁极靠近，相反的磁极远离。例如，两个磁铁的N极相互靠近(如图中所示的第一磁性元件1401的左右侧磁铁的磁化方向相反)。又例如，两个磁铁的S极相互靠近。在一些实施例中，第二磁性元件1402也可以包括两个磁铁，两个磁铁分别靠近第一磁性元件1401，且两者内部的磁感线或磁场方向相反。例如，第二磁性元件1402的两个的磁铁内部的磁感线或磁场方向均背离第一磁性元件1401。
通过将第一磁性元件1401的磁化方向设置为水平方向，可以更好地使得第一磁性元件1401产生的磁场在磁间隙中沿着水平方向或者接近水平方向延伸。且第二磁性元件1402的磁化方向与第一磁性元件1401相同，可以进一步引导磁间隙内的磁感线沿着水平或接近水平方向分布在磁间隙中。例如，当第一磁性元件1401和第二磁性元件1402内部的磁感线或磁场方向都是从第一磁性元件1401指向第二磁性元件1402(即S极指向N极方向)，磁感线可以从第一磁性元件1401的外侧沿着水平或者接近水平的方向向磁间隙中延伸并穿过第二磁性元件1402，第二磁性元件1402可以从第二磁性元件1402的外侧发出沿着水平或者接近水平的方向在磁间隙中延伸并穿入第二磁性元件1402的内侧。又例如，当第一磁性元件1401和第二磁性元件1402内部的磁感线或磁场方向都是从第二磁性元件1402指向第一磁性元件1401(即S极指向N极方向)，磁感线可以从第一磁性元件1401的内侧发出沿着水平或者接近水平的方向从磁间隙中延伸并穿入第一磁性元件1401的外侧，第二磁性元件1402可以从第二磁性元件1402的内侧发出沿着水平或者接近水平的方向在磁间隙中延伸并穿入第一磁性元件1402的外侧。这样，可以使得磁间隙内音圈位置处的磁场方向主要沿着水平方向或接近水平方向分布，提高了磁场的均匀性和强度，能够有效提高音圈振动产生的音效。
在其他一些实施例中，各个磁性元件的磁化方向也可以是其他方向，不同的磁 化方向的磁性元件的组合，也可以达到提高磁场的强度和/或使得磁场的强度分布更为均匀的效果。需要说明的是，在本实施例中，水平方向可以理解为与音圈振动的方向垂直的方向，即与第一磁性元件的顶面所在的平面相平行的方向。另外，第一磁性元件1401和第二磁性元件1402的磁化方向可以相平行，可以允许有一定的角度偏差，例如，二者的磁化方向的夹角可以在170°至190°之间。
在一些实施例中，磁路组件还包括第一导磁元件1403和第二导磁元件1404，第一导磁元件1403的底面与第二磁性元件1402的顶面相连接，第二导磁元件的顶面与第二磁性元件1402的底面相连接。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在一些实施例中，第一磁性元件1401可以为圆柱体、长方体或三棱柱等，第二磁性元件1402、第一导磁元件1403和第二导磁元件1404可以为环状(连续圆环状、不连续圆环状、长方形环状、三角形环状等)。在一些实施例中，第一磁性元件1401可以是由两个半圆柱体、两个长方体或两个其他形状的磁铁拼接而成，构成第一磁性元件1401的两个磁铁的磁化方向可以相反。在一些实施例中，第二磁性元件1402、第一导磁元件1403和第二导磁元件1404在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例中，第二磁性元件1402、第一导磁元件1403和第二导磁元件1404的厚度总和可以等于第一磁性元件1401的厚度。
图15是根据本申请的图14所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图14所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图15所示，磁场的强度关于Z轴零点位置基本对称，且磁场的强度沿着Z轴分布比较均匀，磁场强度的最高值和最低值之间落差较小，磁场强度的最高值在零点附近(例如，-0.002mm或0.002mm)，约为0.48T。
图16是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图16所示，磁路组件1600可以包括第一磁性元件1601、第二磁性元件1602、第一导磁元件1603和第二导磁元件1604。本实施例与图14所示的实施例相比，区别在于，本实施例的第二导磁元件1604的顶面与第一磁性元件1601和第二磁性元件1602的底面均相连。在一些实施例，第二导磁元件1604可以是圆柱体。在一些实施例，第二磁性元件1602与第一导磁元件1603的厚度的总和可以等于第一磁性元件1601的厚度。
图17是根据本申请的图16所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图16所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图17所示，在Z 轴零点附近产生了比较均匀的磁场，且由于第二导磁元件1604连接第一磁性元件1601和第二磁性元件1602，相比于图14的磁路组件提高了零点附近(例如，0.292mm)的磁场强度，大概为0.53T。
图18是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图18所示，磁路组件1800可以包括第一磁性元件1801、第二磁性元件1802、第一导磁元件1803、第二导磁元件1804和第三导磁元件1805。本实施例与图14所示的实施例相比，区别在于，本实施例还包括第三导磁元件1805，第三导磁元件1805的顶面与第一磁性元件1801底面相连接。第三导磁元件1802与第二导磁元件1804在磁间隙两侧间隔设置。
在一些实施例中，第一磁性元件1801和第三导磁元件1805可以为圆柱体、长方体或三棱柱等。在一些实施例中，第二磁性元件1802、第一导磁元件1803和第二导磁元件1804的厚度的总和可以等于第一磁性元件1801和第三导磁元件1805的厚度的总和。第二导磁元件1804和第三导磁元件1805在厚度上可以相等。
图19是根据本申请的图18所示的一种磁路组件的磁场强度变化示意图。在磁间隙中，沿图18所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图19所示，磁场强度最大值在Z轴零点附近(例如，0.0209mm)，约为0.5T，磁场的强度在Z轴零点位置的两侧，尤其是上方分布比较均匀。相较于图14中未设置第三导磁元件的磁路组件1400，磁间隙中的最大磁场强度提高。
图20是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图20所示，磁路组件2000可以包括第一磁性元件2001、第二磁性元件2002、第一导磁元件2003、第二导磁元件2004和第三导磁元件2005。本实施例与图16所示的实施例相比，区别在于，本实施例还包括第三导磁元件2005，第三导磁元件2005的底面与第一磁性元件2001顶面相连接。
在一些实施例中，第三导磁元件2005、第一磁性元件2001可以为圆柱体、长方体或三棱柱等。第三导磁元件2005和第一磁性元件2001在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例中，第一磁性元件2001和第三导磁元件2005的厚度的总和与第二磁性元件2002和第二导磁元件2003的厚度的总和可以相同。
图21是根据本申请的图20所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图20所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图21所示，由于相比于图16的磁路组件增加了导磁元件，磁场的强度的最高值(例如，-0.016mm)达 到了0.6T。
图22是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图22所示，磁路组件2200可以包括第一磁性元件2201、第二磁性元件2202、第一导磁元件2203、第二导磁元件2204、第三导磁元件2205和第四导磁元件2206。本实施例与图18所示的实施例相比，区别在于，本实施例还包括第四导磁元件2206，第四导磁元件2206的底面与第一磁性元件2201的表面相连接。第四导磁元件2206与第一导磁元件2203在磁间隙两侧间隔设置。在一些实施例中，第一磁性元件2201、第三导磁元件2205、第四导磁元件2206可以为圆柱体、长方体或三棱柱等。在一些实施例中，第二磁性元件2202、第一导磁元件2203和第二导磁元件2204的厚度的总和可以等于第一磁性元件2201、第三导磁元件2205和第四导磁元件2206的厚度的总和。第一导磁元件2203和第四导磁元件2206在厚度上可以相等。
图23是根据本申请的图22所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图22所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图23所示，磁场的强度的最高值(例如，-0.039mm处的最高值)约为0.53T，且由于图23的磁路组件在Z轴的方向上相对于图18的磁路组件分布更为均匀，磁场的强度在Z轴零点附近分布比较均匀。
需要说明的是，在图14、图16、图18、图20、图22所示的实施例中，在设置了第一磁性元件、第二磁性元件的基础上，本领域技术人员可以根据需要进一步确定导磁元件的数量、设置位置和设置形式，本申请对此不作进一步限定。例如，图14所示实施例的磁路组件还可以包括第三导磁元件(图中未示出)和第四导磁元件(图中未示出)，第三导磁元件的底面与第一磁性元件1401的顶面相连，第四导磁元件的顶面与第一磁性元件1401的底面相连。
图24是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图24所示，磁路组件2400可以包括第一磁性元件2401和第一导磁元件2402，第一导磁元件2402至少部分地环绕第一磁性元件2401，第一导磁元件2402的内环与第一磁性元件2401之间形成磁间隙。扬声器组件12的音圈124可以设置在磁间隙中。
在一些实施例中，第一磁性元件2401的磁化方向平行于第一磁性元件2401的顶面(即图中的水平方向)。例如，第一磁性元件2401的磁化方向可以是沿着其中心向外的方向。
在一些可替代的实施例中，第一磁性元件2401可以包括两个磁铁，两个磁铁的 放置可以包括相邻设置，且两者相同的磁极靠近，相反的磁极远离。例如，两个磁铁的N极相互靠近(如图中所示的第一磁性元件2401的左右侧磁铁的磁化方向相反，两个磁铁的磁化方向可以均指向第一导磁元件2402)。关于第一磁性元件2401以及其磁化方向的更多描述可以参考图14中关于第一磁性元件1401的详细描述。
需要说明的是，在本实施例中，水平方向可以理解为与音圈振动的方向垂直的方向，即与第一磁性元件2401的顶面所在的平面相平行的方向。
通过将第一磁性元件2401的磁化方向设置为水平方向，可以更好地使得第一磁性元件2401产生的磁场在磁间隙中沿着水平方向或者接近水平方向延伸。这样，可以使得磁间隙内音圈位置处的磁场方向主要沿着水平方向或接近水平方向分布，提高了磁场的均匀性，能够有效提高音圈振动产生的音效。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在一些实施例中，第一磁性元件2401可以是圆柱体、长方体或三棱柱等，第一导磁元件2402可以是环状(连续圆环状、不连续圆环状、长方形环状、三角形环状等)。在一些实施例中，第一磁性元件2401可以是由两个半圆柱体、两个长方体或两个其他形状的磁铁拼接而成，构成第一磁性元件2401的两个磁铁的磁化方向可以相反。在一些实施例中，第一磁性元件2401和第一导磁元件2402在厚度上可以相同。
图25是根据本申请的图24所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图24所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图25所示，磁场的强度相比于图14中的磁性元件1400由于未设置更多的磁性元件而较小，磁场强度的最高值(例如，-0.338mm处的最高值)在0.26T左右，但是磁场的强度的分布较为均匀，磁场的强度的最高值和最低值的差比较小。
图26是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图26所示，磁路组件2600可以包括第一磁性元件2601、第一导磁元件2602、第二导磁元件2603。本实施例与图24所示的实施例相比，区别在于，本实施例还包括第二导磁元件2603，第二导磁元件2603的顶面与第一磁性元件2601的底面和第一导磁元件2602的底面均相连。
图27是根据本申请的图26所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图26所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图27所示，磁场的强度在Z轴的零点附近(例如，0.312mm)分布比较均匀，且由于第二导磁元件2603连接第一磁性元件2601和第一导磁元件2602，相比于图24的磁路组件提高了在Z轴 的零点附近(例如，0.312mm)的磁场强度，大概为0.35T。
图28是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图28所示，磁路组件2800可以包括第一磁性元件2801、第一导磁元件2802和第二导磁元件2803。本实施例与图24所示的实施例相比，区别在于，本实施例还包括第二导磁元件2803，第二导磁元件2803顶面与第一磁性元件2801底面相连接。本实施例与图26所示的实施例的区别在于，第二导磁元件2803的顶面仅与第一磁性元件2801的底面相连，不与第一导磁元件2802的底面相连。
在一些实施例中，第一磁性元件2801和第二导磁元件2802可以为圆柱体、长方体或三棱柱等，第一磁性元件2801和第二导磁元件2802在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例，第一磁性元件2801和第二导磁元件2803的厚度的总和可以等于第一导磁元件2802的厚度。
图29是根据本申请的图28所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图28所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图29所示，磁场的强度在零点位置(例如，-0.03mm-0.5mm范围内)附近分布非常均匀。且由于增加了第二导磁元件2803，相比于图24的磁路组件提高了在Z轴的零点附近(例如，0.49mm)的磁场强度，大概为0.32T。且由于第二导磁元件2803的顶面不与第一导磁元件2802的底面相连，相比于图26的磁路组件，在Z轴的零点附近(例如，0.49mm)的磁场强度有所降低。
图30是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图30所示，磁路组件3000可以包括第一磁性元件3001、第一导磁元件3002、第二导磁元件3003和第三导磁元件3004。本实施例与图26所示的实施例相比，区别在于，本实施例还包括第三导磁元件3004，第三导磁元件3004的底面与第一磁性元件3001的顶面相连。
在一些实施例，第一磁性元件3001和第三导磁元件3004可以是圆柱体或长方体等，第一磁性元件3001和第三导磁元件3004在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例中，第一磁性元件3001和第三导磁元件3004的厚度的总和可以等于第一导磁元件3002的厚度。
图31是根据本申请的图38所示的一种磁路组件的磁场强度变化示意图。在磁间隙中，沿图30所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图31所示，磁间隙内磁场的强度在Z轴的零点附近(例如，-0.095-0.106mm范围内)分布比较均 匀，且由于第三导磁元件3004的底面与第一磁性元件3001的顶面相连，相比于图26的磁路组件，降低了在Z轴的零点附近(例如，0.081mm)的磁场强度，大概为0.28T。
图32是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图32所示，磁路组件3200可以包括第一磁性元件3201、第一导磁元件3202、第二导磁元件3203和第三导磁元件3204。本实施例与图28所示的实施例相比，区别在于，本实施例还包括第三导磁元件3204，第三导磁元件3204的底面与第一磁性元件401的顶面相连。
在一些实施例，第一磁性元件3201、第二导磁元件3203和第三导磁元件3204可以为圆柱体、长方体或三棱柱等，第一磁性元件、第二导磁元件和第三导磁元件在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例，第一磁性元件3201、第二导磁元件3203和第三导磁元件3204在的厚度的总和可以等于第一导磁元件3201的厚度。
图33是根据本申请的图32所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图32所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图33所示，磁间隙内磁场的强度在Z轴的零点附件分布比较均匀，且由于第三导磁元件3204的底面与第一磁性元件401的顶面相连，相比于图28的磁路组件，降低了在在Z轴的零点附近(例如，0.000mm)的磁场强度，大概为0.26T。
需要说明的是，在图24、图26、图28、图30、图32所示的实施例中，在设置了第一磁性元件、第一导磁元件的基础上，本领域技术人员可以根据需要进一步确定导磁元件的数量、设置位置和设置形式，本申请对此不作进一步限定。例如，图32所示实施例的磁路组件的第三导磁元件3204可以与第一导磁元件3202相连接。
图34是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图34所示，磁路组件3400可以包括第一磁性元件3401、第二磁性元件3402和第一导磁元件3403。第一磁性元件3401至少部分地环绕第一导磁元件3403(即第一磁性元件3401的内表面或内壁环绕着第一导磁元件3403的外表面或外壁)，第二磁性元件3402至少部分地环绕第一磁性元件3401(即第二磁性元件3402的内表面或内壁环绕着第一磁性元件3401的外表面或外壁)，第一磁性元件3401和第二磁性元件3402的内环之间形成磁间隙。音圈可以设置在磁间隙中。
第一磁性元件3401和第二磁性元件3402的磁化方向均平行于第一磁性元件3401和/或第二磁性元件3402的顶面(即图中水平方向)或垂直于内外表面，第一磁性 元件3401和第二磁性元件3402的磁化方向平行。
在一些实施例中，第一磁性元件3401的磁化方向可以是沿着其中心向外的方向(即中心指向外侧)，第二磁性元件3402的磁化方向沿着其内侧(靠近第一磁性元件3401的一侧)向外侧(远离第一磁性元件3401的一侧)的方向。又例如，第一磁性元件3401的磁化方向可以是外侧指向中心的方向，第二磁性元件3402的磁化方向沿着其外侧(远离第一磁性元件3401的一侧)向内侧(靠近第一磁性元件3401的一侧)的方向。
在一些实施例中，第一磁性元件3401和第二磁性元件3402的放置可以包括第一磁性元件3401和第二磁性元件3402不同的磁极相互靠近或远离。例如，第一磁性元件3401的N极位于第一磁性元件3401的中心区域，S极位于第一磁性元件3401外侧区域，即在第一磁性元件3401内部，在平行于第一磁性元件3401的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是中心指向外侧；第二磁性元件3402的N极位于第二磁性元件3402的外侧区域，S极位于第二磁性元件3402内侧区域，即在第二磁性元件3402内部，在平行于第二磁性元件3402的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是内侧指向外侧。又例如，第一磁性元件3401的S极位于第一磁性元件3401的中心区域，N极位于第一磁性元件3401外侧区域，即在第一磁性元件3401内部，在平行于第一磁性元件3401的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是外侧指向内侧；第二磁性元件3402的S极位于第二磁性元件3402的外侧区域，N极位于第二磁性元件3402内侧区域，即在第二磁性元件3402内部，在平行于第二磁性元件3402的上表面或下表面的同一平面上，磁感线或磁场方向(即S极指向N极方向)都是外侧指向内侧。
在一些可替代的实施例中，第一磁性元件3401可以包括两个或多个磁铁，两个或多个磁铁的磁化方向可以均指向第二磁性元件3402(如图中所示的第一磁性元件3401的左右两侧磁铁的磁化方向相反，分别指向第二磁性元件3402)。
在一些实施例中，第二磁性元件3402也可以包括两个或多个磁铁，两个或多个磁铁的磁化方向均从第二磁性元件3402的内侧指向外侧。在其他一些实施例中，各个磁性元件的磁化方向也可以是其他方向，不同的磁化方向的磁性元件的组合，也可以达到提高磁场的强度和/或使得磁场的强度分布更为均匀的效果。
需要说明的是，在本实施例中，水平方向可以理解为与音圈振动的方向垂直的 方向，即与第一磁性元件3401的顶面所在的平面相平行的方向。另外，第一磁性元件3401和第二磁性元件3402的磁化方向可以相平行，也可以存在预设夹角。其中，预设夹角可以设置在一定的角度范围内，例如，60°、80、90°、100°等。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。关于第一磁性元件3401和第二磁性元件3402的磁化方向的相关描述可以参考图6中的关于第一磁性元件601和第二磁性元件602的磁化方向。
在一些实施例中，磁路组件还可以包括第二导磁元件3404和第三导磁元件3405。第二导磁元件3404的底面与第二磁性元件3402的顶面相连，第三导磁元件3405的顶面与第二磁性元件3402的底面相连。在一些实施例，第一导磁元件3403可以为圆柱体、长方体或三棱柱等。第一磁性元件3401、第二磁性元件3402、第二导磁元件3404和第三导磁元件可以3405为环状(连续圆环状、不连续圆环状、长方形环状、三角形环状等)。第二磁性元件3402、第二导磁元件3404和第三导磁元件3405在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例中，第一磁性元件3401和第一导磁元件3403在厚度上可以相同。第二磁性元件3402、第二导磁元件3404和第三导磁元件3405的厚度的总和可以等于第一磁性元件3401的厚度，以及可以等于第一导磁元3403的厚度。
图35是根据本申请的图34所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图34所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图35所示，由于第一导磁元件3405减少了磁路组件的漏磁，相比于图14的磁路组件，磁场强度沿着Z轴分布比较均匀。
图36是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图36所示，磁路组件3600可以包括第一磁性元件3601、第二磁性元件3602、第一导磁元件3603、第二导磁元件3604和第三导磁元件3605。本实施例与图34所示的实施例相比，区别在于，本实施例的第三导磁元件3605的顶部与第一磁性元件3601、第二磁性元件3602、第一导磁元件3603的底面均相连。
在一些实施例中，第二磁性元件3602和第二导磁元件3604的厚度的总和可以等于第一磁性元件3601的厚度，以及可以等于第一导磁元件3603的厚度。
图37是根据本申请的图36所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图36所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图37所示，磁场的强度在Z轴的零点附近(-0.091-0.232mm范围内)分布比较均匀，且且由于第三导磁 元件3605的顶部与第一磁性元件3601、第二磁性元件3602、第一导磁元件3603的底面均相连，相比于图34的磁路组件提高了在Z轴的零点附近(例如，0.232mm)的磁场强度，大概为0.68T。
图38是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图38所示，磁路组件3800可以包括第一磁性元件3801、第二磁性元件3802、第一导磁元件3803、第二导磁元件3804、第三导磁元件3805和第四导磁元件3806。本实施例与图34所示的实施例相比，区别在于，本实施例还包括第四导磁元件3806，第四导磁元件3806的顶面与第一导磁元件3803和第一磁性元件3801的底面均相连。第三导磁元件3805和第四导磁元件3806在磁间隙处间隔设置。
在一些实施例中，第四导磁元件3806与第一磁性元件3801的外环在垂直Z轴的横截面的外轮廓形状和尺寸上可以相同。在一些实施例中，第三导磁元件3805和第四导磁元件3806在厚度上可以相同，第一导磁元件3803、第一磁性元件3801和第二磁性元件3802在厚度上可以相同。
图39是根据本申请的图38所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图38所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图39所示，磁场的强度在Z轴的零点位置附近(例如，0.227-0.5mm范围内)分布均比较均匀，且由于增加了第四导磁元件3806，相比于图34的磁路组件，提高了在Z轴的零点附近(例如，0.109mm)的磁场强度，大概为0.54T。
图40是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图40所示，磁路组件4000可以包括第一磁性元件4001、第二磁性元件4002、第一导磁元件4003、第二导磁元件4004、第三导磁元件4005和第四导磁元件4006。本实施例与图36所示的实施例相比，区别在于，本实施例还包括第四导磁元件4006，第四导磁元件4006的底面与第一导磁元件4003和第一磁性元件4001的顶面均相连。
在一些实施例中，第一导磁元件4003、第三导磁元件4005和第四导磁元件4006可以为圆柱体、长方体或三棱柱等。第二导磁元件4004可以为环状(连续圆环状、不连续圆环状、长方形环状、三角形环状等)。第一磁性元件4001、第二磁性元件4002、第一导磁元件4003在厚度上可以相同，第二导磁元件4004和第四导磁元件4006在厚度上可以相同。
图41是根据本申请的图40所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图40所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图40所示，磁场 在强度相对Z轴的零点位置较为对称，且由于增加了第四导磁元件4006，相比于图36的磁路组件降低了在Z轴的零点附近(例如，0.312mm)的磁场强度，大概为0.52T。
图42是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图42所示，磁路组件4200可以包括第一磁性元件4201、第二磁性元件4202、第一导磁元件4203、第二导磁元件4204、第三导磁元件4205、第四导磁元件4206和第五导磁元件4207。本实施例与图38所示的实施例相比，区别在于，本实施例还包括第五导磁元件4207，第五导磁元件4207的底面与第一导磁元件4203和第一磁性元件4201的顶面均相连。第五导磁元件4207与第二导磁元件4204在磁间隙处间隔设置。
在一些实施例中，第四导磁元件4206和第五导磁元件4207在厚度以及垂直Z轴的横截面的形状和尺寸上可以相同。第五导磁元件4207和第二导磁元件4204可以在厚度上相同。
图43是根据本申请的图42所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图42所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图43所示，磁场的强度分布关于Z轴的零点的位置高度对称，且由于增加了第五导磁元件4207，相比于图38的磁路组件，在Z轴的零点附近(例如，0.151mm)的磁场强度相近。
需要说明的是，在图34、图36、图38、图40、图42所示的实施例中，在设置了第一磁性元件、第二磁性元件、第一导磁元件的基础上，本领域技术人员可以根据需要进一步确定导磁元件的数量、设置位置和设置形式，本申请对此不作进一步限定。例如，图40所示实施例的磁路组件的第四导磁元件4006可以与第二导磁元件4004相连接。
图44是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图44所示，磁路组件可以包括第一磁性元件4401、第一导磁元件4402和第二导磁元件4403。第一磁性元件4401至少部分地环绕第二导磁元件4403，第一导磁元件4402环绕第一磁性元件4401，第一磁性元件4401和第一导磁元件4402之间形成磁间隙。扬声器的音圈可以设置在磁间隙中。
在一些实施例中，第一磁性元件4401的磁化方向平行于第一磁性元件4401的顶面(即图中水平方向)。在一些实施例中，第一磁性元件4401的磁化方向从第一磁性元件4401指向第一导磁元件4402。在一些实施例中，第一磁性元件4401的磁化方向从第一磁性元件4401指向第二导磁元件4403。关于第一磁性元件4401以及其磁化方向的更多描述可以参考图14中的第一磁性元件1401的详细描述。
需要说明的是，在本实施例中，水平方向可以理解为与音圈振动的方向垂直的方向，即与第一磁性元件4401的顶面所在的平面相平行的方向。导磁元件与磁性元件之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在一些实施例中，第二导磁元件4403的形状可以为圆柱体或长方体等。在一些实施例中，第一磁性元件4401、第一导磁元件4402和第二导磁元件4403在厚度上可以相同。
图45是根据本申请的图44所示的磁路组件的磁场强度变化示意图。在图44所示的磁间隙中，沿图44所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图45所示，磁场的强度的最高值(例如，零点位置处的最高值)约为0.3T，磁场的强度沿着Z轴分布非常均匀，且磁场的强度在Z轴的零点位置高度对称。
图46是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图46所示，磁路组件4600可以包括第一磁性元件4601、第一导磁元件4602、第二导磁元件4603和第三导磁元件4604。本实施例与图44所示的实施例相比，区别在于，本实施例还包括第三导磁元件4604，第三导磁元件4604的顶面与第一导磁元件4602、第二导磁元件4603、第一磁性元件4601的底面均相连。
图47是根据本申请的图46所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图46所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图47所示，磁场的强度沿Z轴分布(例如，-0.041-0.500mm范围内)比较均匀，且由于增加了第三导磁元件4604，相比于图44的磁路组件提高了在Z轴的零点附近(例如，0.348mm)的磁场强度，大概为0.43T。
图48是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图48所示，磁路组件可以包括第一磁性元件4801、第一导磁元件4802、第二导磁元件4803和第三导磁元件4804。本实施例与图44所示的实施例相比，区别在于，本实施例还包括第三导磁元件4804，第三导磁元件4804的顶面与第一磁性元件4801的底面、第二导磁元件4803的底面均相连。本实施例与图46所示的实施例相比，区别在于，本实施例的第三导磁元件4804的顶面仅与第二导磁元件4803的底面、第一磁性元件4801的底面相连，不再与第一导磁元件4802的底面相连。
在一些实施例中，第三导磁元件4804可以为圆柱体、长方体或三棱柱等。第三导磁元件4804与第一磁性元件4801的外环在垂直Z轴的横截面的外轮廓形状和尺寸上可以相同。在一些实施例中，第一磁性元件4801与第三导磁元件4804的厚度的总 和可以等于第一导磁元件4802的厚度。
图49是根据本申请的图48所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图48所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图48所示，磁场的强度沿着Z轴整体分布比较均匀，且由于增加了第三导磁元件4804，相比于图44的磁路组件提高了在Z轴的零点附近(例如，-0.088mm)的磁场强度，大概为0.34T。
图50是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图50所示，磁路组件5000可以包括第一磁性元件5001、第一导磁元件5002、第二导磁元件5003、第三导磁元件5004和第四导磁元件5005。本实施例与图48所示的实施例相比，区别在于，本实施例还包括第四导磁元件5005，第四导磁元件5004的底面与第二导磁元件5003的顶面、第一磁性元件5001的顶面均相连。
在一些实施例中，第四导磁元件5005可以是圆柱体或长方体等，第四导磁元件5005与第一磁性元件5001的外环在垂直Z轴的横截面的外轮廓形状和尺寸上可以相同。在一些实施例中，第四导磁元件5005与第一磁性元件5001的厚度总和可以等于第一导磁元件5002的厚度以及等于第二导磁元件5003的厚度。
图51是根据本申请的图50所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图50所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图50所示，磁场的强度沿着Z轴分布非常均匀，且由于增加了第四导磁元件5005，相比于图48的磁路组件，降低了在Z轴的零点附近(例如，-0194mm)的磁场强度，大概为0.3T。
图52是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图52所示，磁路组件5200可以包括第一磁性元件5201、第一导磁元件5202、第二导磁元件5203、第三导磁元件5204和第四导磁元件5205。本实施例与图48所示的实施例相比，区别在于，本实施例还包括第四导磁元件5205，第四导磁元件5205的底面与第二导磁元件5203的顶面、第一磁性元件5201的顶面相连。
在一些实施例中，第四导磁元件5205可以为圆柱体、长方体或三棱柱等，第四导磁元件5205和第三导磁元件5204在垂直Z轴的横截面的形状和尺寸上可以相同。在一些实施例中，第一磁性元件5201、第三导磁元件5204和第四导磁元件5205的厚度的总和可以等于第一导磁元件5202的厚度。
图53是根据本申请的图52所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图52所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图53所示，与图48的磁路组件相比，磁场的强度的最高值(例如，-0.011mm位置处的最高值)相近， 约0.3T，但是磁场的强度沿着整个Z轴分布非常均匀。
需要说明的是，在图44、图46、图48、图50、图52所示的实施例中，在设置了第一磁性元件、第一导磁元件和第二导磁元件的基础上，本领域技术人员可以根据需要进一步确定导磁元件的数量、设置位置和设置形式，本申请对此不作进一步限定。例如，图50所示实施例的磁路组件的第四导磁元件5005可以与第二导磁元件5003相连接。
图54是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图54所示，磁路组件5400可以包括第一磁性元件5401、第二磁性元件5402、第三磁性元件5403、第四磁性元件5404、第五磁性元件5405、第六磁性元件5406和第一导磁元件5407。第一磁性元件5401至少部分地环绕第一导磁元件5407，第二磁性元件5402环绕第一磁性元件5401，第一磁性元件5401的外环和第二磁性元件5402之间(例如，内环之间)形成磁间隙。扬声器的音圈可以设置在磁间隙中。
在一些实施例中，第三磁性元件5403的底面与第二磁性元件5402的顶面相连，第四磁性元件5404的顶面与第二磁性元件5402的底面相连。第五磁性元件5405的底面与第一磁性元件5401的顶面、第一导磁元件5407的顶面均相连，第六磁性元件5406的顶面与第一磁性元件5401的底面、第一导磁元件5407的底面均相连。第三磁性元件5403与第五磁性元件5405在磁间隙处间隔设置，第四磁性元件5404与第六磁性元件5406在磁间隙处间隔设置。
在一些实施例中，第一磁性元件5401和第二磁性元件5402的磁化方向均平行于第一磁性元件5401和/或第二磁性元件5402的顶面(即图中水平方向)或垂直于内外表面，第一磁性元件5401的磁化方向和第二磁性元件5402的磁化方向相平行。例如，第一磁性元件5401的磁化方向沿着其中心向外的方向(即中心指向外侧)，第二磁性元件5402的磁化方向沿着内侧(靠近第一磁性元件5401的一侧)指向外侧(远离第一磁性元件5401的一侧)的方向。又例如，第一磁性元件5401的磁化方向可以是外侧指向中心的方向，第二磁性元件5402的磁化方向沿着其外侧(远离第一磁性元件5401的一侧)向内侧(靠近第一磁性元件5401的一侧)的方向。
在一些实施例中，第三磁性元件5403和第四磁性元件5404的磁化方向均垂直于第二磁性元件5402与第三磁性元件5403和/或第四磁性元件5404连接的表面(即图中竖直方向，图中每个磁性元件上的箭头方向表示该磁性元件的磁化方向)，且第三磁性元件5403和第四磁性元件5404的磁化方向相反。
在一些实施例中，第五磁性元件5405和第六磁性元件5406的磁化方向均垂直于第一磁性元件5401与第五磁性元件5405或第六磁性元件5406连接的表面(即图中竖直方向，图中每个磁性元件上的箭头方向表示该磁性元件的磁化方向)，且第五磁性元件5405和第六磁性元件5406的磁化方向相反。
在一些实施例中，第三磁性元件5403和第四磁性元件5404的放置可以包括第三磁性元件5403和第四磁性元件5404的相同的磁极靠近第二磁性元件5402；不同的磁极远离第二磁性元件5402。例如，第三磁性元件5403的N极相较于第三磁性元件5403的S极和第四磁性元件5404的N极相较于第四磁性元件5404的S极均靠近第二磁性元件5402，即在第三磁性元件5403以及第三磁性元件5403的内部，磁感线或磁场方向(即S极指向N极方向)都是指向第二磁性元件5402。又例如，第三磁性元件5403的S极相较于第三磁性元件5403的N极和第四磁性元件5404的S极相较于第四磁性元件5404的N极均靠近第一导磁元件5407，即在第三磁性元件5403以及第四磁性元件5404的内部，磁感线或磁场方向(即S极指向N极方向)都是背离第二磁性元件5402。
在一些实施例中，第五磁性元件5405和第六磁性元件5406的放置可以包括第五磁性元件5405和第六磁性元件5406的相同的磁极靠近第一导磁元件5407；不同的磁极远离第一导磁元件5407。例如，第五磁性元件5405的N极相较于第五磁性元件5405的S极和第六磁性元件5406的N极相较于第六磁性元件5406的S极均靠近第一导磁元件5407，即在第五磁性元件5405以及第六磁性元件5406的内部，磁感线或磁场方向(即S极指向N极方向)都是指向第一导磁元件5407。又例如，第五磁性元件5405的S极相较于第五磁性元件5405的N极和第六磁性元件5406的S极相较于第六磁性元件5406的N极均靠近第一导磁元件5407，即在第五磁性元件5405以及第六磁性元件5406的内部，磁感线或磁场方向(即S极指向N极方向)都是背离第一导磁元件5407。
通过这种将第五磁性元件5405和第六磁性元件5406对置充磁的方式，可以使第五磁性元件5405和第六磁性元件5406产生的磁感线在磁间隙内的方向大致相同，例如，都是从第一导磁元件5407指向第二磁性元件5402；或者都是从第二磁性元件5402指向第一导磁元件5407，从而增加磁间隙内的磁场强度。另外，通过将第三磁性元件5403和第四磁性元件5404、第五磁性元件5405和第六磁性元件5406、第三磁性元件5403和第五磁性元件5405的磁化方向设置为竖直方向且方向相反，可以压制第一磁性 元件5401在磁间隙内产生的磁场，使磁场对应的磁感线在磁间隙中延伸水平方向分布。例如，从第一磁性元件5401的端部沿着水平或者接近水平的方向磁间隙中延伸。这样，可以使得磁间隙内音圈位置处的磁场方向主要沿着水平方向或接近水平方向分布，提高了磁场的均匀性，能够有效提高音圈振动产生的音效。在其他一些实施例中，各个磁性元件的磁化方向也可以是其他方向，不同的磁化方向的磁性元件的组合，也可以达到提高磁场的强度和/或使得磁场的强度分布更为均匀的效果。
需要说明的是，在本实施例中，水平方向可以理解为与音圈振动的方向垂直的方向，即与第一磁性元件5401的顶面所在的平面相平行的方向，竖直方向可以理解为音圈振动的方向，即与第一磁性元件5401的顶面所在的平面相垂直的方向。
在一些实施例中，第一磁性元件5401和第二磁性元件5402的磁化方向可以相平行，第三磁性元件5403、第四磁性元件5404、第五磁性元件5405和第六磁性元件5406的磁化方向可以相平行，或者存在预设夹角，例如，第一磁性元件5401和第二磁性元件5402的磁化方向的夹角可以在170°至190°之间。关于第一磁性元件5401和第二磁性元件5402的磁化方向的相关描述可以参考图6中的关于第一磁性元件601和第二磁性元件602的磁化方向。
第三磁性元件5403、第四磁性元件5404、第五磁性元件5405和第六磁性元件5406可以形成磁屏蔽场，从而使得磁间隙中的磁场的强度增大。磁性元件之间相互连接的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
在一些实施例中，第一导磁元件5407、第五磁性元件5405和第六磁性元件5406可以为圆柱体、长方体或三棱柱等。第一磁性元件5401、第二磁性元件5402、第三磁性元件5403和第四磁性元件5404可以为环状(连续圆环状、不连续圆环状、长方形环状、三角形环状等)。
在一些实施例中，第二磁性元件5402、第三磁性元件5403和第四磁性元件5404在垂直Z轴的横截面的形状和尺寸上可以相同。第一磁性元件5401的外环、第五磁性元件5405和第六磁性元件5406在垂直Z轴的横截面的外轮廓形状和尺寸上可以相同。在一些实施例中，第一导磁元件5407、第一磁性元件5401和第二磁性元件5402在厚度上可以相同，在第三磁性元件5403和第五磁性元件5405在厚度上可以相同，第四磁性元件5404和第六磁性元件5406在厚度上可以相同。
图55是根据本申请的图54所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图55所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图55所示，由 于增加的磁性元件形成磁屏蔽场，磁场的强度关于Z轴的零点高度对称，且磁场的强度较高。
图56是根据本申请的一些实施例所示的磁路组件的纵截面示意图。如图56所示，磁路组件包括第一磁性元件5601、第二磁性元件5602、第三磁性元件5603、第四磁性元件5604、第五磁性元件5605、第六磁性元件5606和第一导磁元件5607。本实施例与图54所示的实施例相比，区别在于，第三磁性元件5603的内环的尺寸小于第二磁性元件5602的内环的尺寸，第四磁性元件5604的内环的尺寸小于第二磁性元件5602的内环的尺寸，第五磁性元件5605的外轮廓的尺寸大于第一磁性元件5601的外环的尺寸，第六磁性元件5606的外轮廓的尺寸大于第一磁性元件5601的外环的尺寸。通过这样的设置，第五磁性元5605和第六磁性元件5606相对第一磁性元件5601朝向磁间隙凸出，第三磁性元件5603和第四磁性元件5604相对第二磁性元件5602朝向磁间隙凸出。
图57是根据本申请的图56所示的磁路组件的磁场强度变化示意图。在磁间隙中，沿图56所示的Z轴方向测量磁场在Z轴方向上各点的强度。如图57所示，由于增加的磁性元件形成磁屏蔽场，磁场的强度关于Z轴的零点高度对称，且磁场的整体强度较图54所示的实施例更高。
图58和图59均是根据本申请的一些实施例所示的一种磁性元件结构的横截面示意图。所述磁性元件可以适用于本申请中由磁路元件和导磁元件组成的任一磁路组件中。
如图所示，位于内部的磁性元件的横截面可以是圆形(例如，图58的磁性元件661)、椭圆形、长方形(例如，图59的磁性元件681)、三角形、任意多边形等。环绕在外的磁性元件可以是环状的，如圆环状(例如，图58的磁性元件662)、椭圆环状、长方形环状(例如，图59的磁性元件682)、三角形环状、任意多边形环状等。
磁性元件661和磁性元件662之间形成磁间隙。磁性元件可以包括内环以及外环。在一些实施例中，所述内环和/或外环的形状都可以是圆形、椭圆、三角形、四边形或其它任意多边形。另外，图6、8、10、12、14、16、18、20、22、24、26、28、30、32所示的实施例中的磁路组件可以设置为类似图58所示的结构；图32、34、36、38、40、42、44、46、48、50、52、54所示的实施例中的磁路组件均可以设置为类似图59所示的结构。
在一些实施例中，磁性元件661的磁化方向可以是从中心向外辐射，磁性元件 662的磁化方向可以是从其内侧指向外侧。在一些实施例中，磁性元件681由不同的磁体构成，每块磁体的磁化方向都相应指向与其相对的磁性元件682的一侧。
图60是根据本申请的一些实施例所示的一种磁性元件结构的示意图。所述磁性元件可以适用于本申请中由磁路元件和导磁元件组成的任一磁路组件中。如图所示，所述磁性元件可以由多个磁体排列组成。所述磁体的任意一个磁体的两端可以与相邻的磁体的两端连接或存在一定的间距。多个磁体之间的间距可以相同或不同。在一些实施例中，所述磁性元件可以由2个或3个片状的磁体(例如，磁体671，672以及673)等距排列构成。所述片状的磁体的形状可以是扇形、四边形等。
在前文所述的各个实施例的基础上，为了进一步增大磁间隙中的磁场的强度，磁路组件还可以包括其他的结构形式(如图61和图62所示)，以使得磁间隙内的磁场的强度更大。本领域技术人员可以根据扬声器实际的使用需求，将图61和图62所示的实施例与前文所示的实施例进行结合，以使得磁间隙中的磁场的强度较大且分布较均匀。
图61是根据本申请的一些实施例所示的一种磁路组件的纵截面示意图。如图61所示，磁路组件6100可以包括第一磁性元件6101、第一导磁元件6102、第二导磁元件6103以及第二磁性元件6104。在一些实施例中，第一磁性元件6101和/或第二磁性元件6104可以包括本申请中描述的任意一种或几种磁铁。在一些实施例中，第一磁性元件6101可以包括第一磁铁，第二磁性元件6104可以包括第二磁铁，所述第一磁铁与所述第二磁铁可以相同或不同。第一导磁元件6102和/或第二导磁元件6103可以包括本申请中描述的任意一种或几种导磁材料。第一导磁元件6102和/或第二导磁元件6103的加工方法可以包括本申请中描述的任意一种或几种加工方式。在一些实施例中，第一磁性元件6101和/或第一导磁元件6102可以设置为轴对称结构。例如，第一磁性元件6101和/或第一导磁元件6102可以是圆柱体，长方体，或者中空的环状(例如，横截面为跑道的形状)。
在一些实施例中，第一磁性元件6101和第一导磁元件6102可以是共轴的圆柱体，含有相同或者不同的直径。在一些实施例中，第二导磁元件6103可以是凹槽型结构。所述凹槽型结构可以包含U型的剖面(如图61所示)。所述凹槽型的第二导磁元件6103可以包括底板和侧壁。在一些实施例中，所述底板和所述侧壁可以是一体成型的，例如，所述侧壁可以由底板在垂直于底板的方向进行延伸形成。
在一些实施例中，所述底板可以通过本申请中描述的任意一种或几种连接方式连接所述侧壁。第二磁性元件6104可以设定为环状或片状。关于第二磁性元件6104 的形状可参考说明书中其他地方的描述。在一些实施例中，第二磁性元件694可以与第一磁性元件6101和/或第一导磁元件6102共轴。
第一磁性元件6101的上表面可以连接第一导磁元件6102的下表面。第一磁性元件6101的下表面可以连接第二导磁元件6103的底板。第二磁性元件6104的下表面连接第二导磁元件6103的侧壁。第一磁性元件6101、第一导磁元件6102、第二导磁元件6103和/或第二磁性元件6104之间的连接方式可以包括粘接、卡接、焊接、铆接、螺栓连接等一种或多种组合。
第一磁性元件6101和/或第一导磁元件6102与第二磁性元件6104的内环之间形成磁间隙。音圈6105可以设置于所述磁间隙中。在一些实施例中，所述第二磁性元件6104与所述音圈6105相对于第二导磁元件6103的底板的高度相等。在一些实施例中，第一磁性元件6101、第一导磁元件6102、第二导磁元件6103以及第二磁性元件6104可以形成磁回路。
在一些实施例中，磁路组件可以产生全磁场(也可被称为“磁路组件的总磁场”)，第一磁性元件6101可以产生第一磁场。所述全磁场由所述磁路组件中的所有组分(例如，第一磁性元件6101，第一导磁元件6102、第二导磁元件6103以及第二磁性元件6104产生的磁场共同形成。所述全磁场在所述磁间隙内的磁场强度(也可以被称为磁感应强度或者磁通量密度)大于所述第一磁场在所述磁间隙内的磁场强度。在一些实施例中，第二磁性元件6104可以产生第二磁场，所述第二磁场可以提高所述全磁场在所述磁间隙处的磁场强度。这里所说的第二磁场提高全磁场的磁场强度指的是，在有第二磁场存在(即，存在第二磁性元件)时全磁场在所述磁间隙的磁场强度大于没有第二磁场存在(即，不存在第二磁性元件)时全磁场在所述磁间隙的磁场强度。
在本说明书中的其他实施例中，除非特别说明，磁路组件表示包含所有磁性元件和导磁元件的结构，全磁场表示由磁路组件整体产生的磁场，第一磁场、第二磁场、第三磁场、……、第N磁场分别表示由相应的磁性元件所产生的磁场。在不同的实施例中，产生所述第二磁场(或者第三磁场、……、第N磁场)的磁性元件可以是相同的，也可以不同。
在一些实施例中，第一磁性元件6101的磁化方向与第二磁性元件6104的磁化方向之间的夹角在0度与180度之间。在一些实施例中，第一磁性元件6101的磁化方向与第二磁性元件6104的磁化方向与之间的夹角在45度与145度之间。在一些实施例中，第一磁性元件6101的磁化方向与第二磁性元件6104的磁化方向之间的夹角等于 或大于90度。在一些实施例中，第一磁性元件6101的磁化方向垂直于第一磁性元件6101的下表面或上表面竖直向上(如图中a所示方向)，第二磁性元件6104的磁化方向由第二磁性元件6104的内环(内表面)指向外环(外表面)(如图中b所方向示，在第一磁性元件的右侧，第一磁性元件的磁化方向沿着顺时针方向偏转90度)。
在一些实施例中，在第二磁性元件6104的位置，所述全磁场的方向与第二磁性元件6104的磁化方向之间的夹角不高于90度。在一些实施例中，在第二磁性元件6104的位置处，第一磁性元件6101产生的磁场的方向与第二磁性元件6104的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。与单一磁性元件的磁路组件相比，第二磁性元件6104可以提高图60中的磁路组件中磁间隙内总磁通量，进而增加磁间隙中的磁感应强度。并且，在第二磁性元件6104的作用下，原本发散的磁感线会向磁间隙所在位置收敛，进一步增加磁间隙中的磁感应强度。
以上对磁路组件的结构的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解磁路组件的基本原理后，可能在不背离这一原理的情况下，对实施磁路组件的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，第二导磁元件6103可以是环形结构或片状结构。又例如，图61的磁路组件可以进一步包括导磁罩，所述导磁罩可以围绕第一磁性元件6101、第一导磁元件6102、第二导磁元件6103以及第二磁性元件6104。
图62是根据本申请的一些实施例所示的一种磁路组件的纵截面示意图。如图所示，与图61的磁路组件不同的是，磁路组件可以进一步包括第三磁性元件。第三磁性元件6205的上表面连接第二磁性元件6204，下表面连接第二导磁元件6203的侧壁。第一磁性元件6201、第一导磁元件6202、第二磁性元件6204和/或第三磁性元件6205之间可以形成磁间隙。音圈6209可以设置于所述磁间隙中。在一些实施例中，第一磁性元件6201、第一导磁元件6202、第二导磁元件6203、第二磁性元件6204以及第三磁性元件6205可以形成磁回路。在一些实施例中，第二磁性元件6204的磁化方向可以参考本申请图52的详细描述。
在一些实施例中，磁路组件可以产生第一全磁场，第一磁性元件701可以产生第二磁场，所述第一全磁场在所述磁间隙内的磁场强度大于所述第二磁场在所述磁间隙内的磁场强度。在一些实施例中，第三磁性元件6205可以产生第三磁场，所述第三磁场可以提高所述第二磁场在所述磁间隙处的磁场强度。
在一些实施例中，第一磁性元件6201的磁化方向与第三磁性元件6205的磁化方向之间的夹角在0度与180度之间。在一些实施例中，第一磁性元件6201的磁化方向与第三磁性元件6205的磁化方向与之间的夹角在45度与145度之间。在一些实施例中，第一磁性元件6201的磁化方向与第三磁性元件6205的磁化方向之间的夹角等于或大于90度。在一些实施例中，第一磁性元件6201的磁化方向垂直于第一磁性元件6201的下表面或上表面竖直向上(如图a方向所示)，第三磁性元件6205的磁化方向由第三磁性元件6205的上表面指向下表面(如图中c方向所示，在第一磁性元件的右侧，第一磁性元件的磁化方向沿着顺时针方向偏转180度)。
在一些实施例中，在第三磁性元件6205的位置处，所述全磁场的方向与所述第三磁性元件6205的磁化方向之间的夹角不高于90度。在一些实施例中，在第三磁性元件6205的位置处，第一磁性元件6201产生的磁场的方向与第三磁性元件6205的磁化方向之间的夹角可以是0度、10度、20度等小于或等于90度的夹角。
与图61的磁路组件相比，图62的磁路组件进一步增加了第三磁性元件6205。第三磁性元件6205可以进一步增加磁路组件中磁间隙内的总磁通量，进而增加磁间隙中的磁感应强度。并且，在第三磁性元件6205的作用下，磁感线会进一步向磁间隙所在位置收敛，进一步增加磁间隙中的磁感应强度。
以上对磁路组件的结构的描述仅仅是具体的示例，不应被视为是唯一可行的实施方案。显然，对于本领域的专业人员来说，在了解磁路组件的基本原理后，可能在不背离这一原理的情况下，对实施磁路组件的具体方式与步骤进行形式和细节上的各种修正和改变，但是这些修正和改变仍在以上描述的范围之内。例如，第二导磁元件可以是环形结构或片状结构。又例如，磁路组件可以不包括第二导磁元件。又例如，磁路组件可以进一步添加至少一个磁性元件。在一些实施例中，所述进一步添加的磁性元件的下表面可以连接第二磁性元件的上表面。所述进一步添加的磁性元件的磁化方向与第三磁性元件的磁化方向相反。在一些实施例中，所述进一步添加的磁性元件可以连接第一磁性元件以及第二导磁元件的侧壁。所述进一步添加的磁性元件的磁化方向与第二磁性元件的磁化方向相反。关于能够提高磁间隙中的磁场的强度的其他磁路结构，可参见2018年1月8日递交的申请号为PCT/CN2018/071851的PCT申请，其全部内容通过引用的方式加入本申请中，在此不再赘述。
图63是根据本说明书的一些实施例所示的磁路组件的纵截面示意图。在一些实施例中，如图63所示，磁路组件6300可以包括第一磁性元件6301第二磁性元件6302、 第一导磁元件6303、第二导磁元件6304和第三导磁元件6305。第二磁性元件6302环绕第一磁性元件6301，第一磁性元件6301和第二磁性元件6302之间形成磁间隙。扬声器的音圈可以设置在磁间隙中。第一导磁元件6303的底面与第二磁性元件6302的顶面相连，第二导磁元件6304的底面与第一磁性元件6301的顶面相连，第三导磁元件6305的顶面与第一磁性元件6301的顶面、第二磁性元件6302的顶面相连。第一磁性元件6301和第二磁性元件6302的磁化方向均延着竖直方向，且第一磁性元件6301的磁化方向与第二磁性元件6302的磁化方向相反。在一些实施例，第一磁性元件6301的N极指向第二导磁元件6304(即图71中向上的方向)，第二磁性元件6302的N极指向第三导磁元件6305(即图71中向下的方向)。
图64是根据本申请的分别采用图63和图56所示的磁路组件的扬声器的频响曲线对比示意图。如图64所示，使用图56所示的磁路组件(也可以叫做超线性磁路“)的扬声器与使用图63所示的磁路组件(也可以叫做”传统磁路“)的扬声器相比，使用图63所示的路组件的扬声器在声音各频段的音量都更高，且在低频和高频范围内的变化更加缓和，整体频响更加线性，音质更好。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述发明披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。
同时，本申请使用了特定词语来描述本申请的实施例。如“一个实施例”、“一实施例”和/或“一些实施例”意指与本申请至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一替代性实施例”并不一定是指同一实施例。此外，本申请的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
此外，本领域技术人员可以理解，本申请的各方面可以通过若干具有可专利性的种类或情况进行说明和描述，包括任何新的和有用的工序、机器、产品或物质的组合或对他们的任何新的和有用的改进。相应地，本申请的各个方面可以完全由硬件执行、可以完全由软件(包括固件、常驻软件、微码等)执行、也可以由硬件和软件组合执行。以上硬件或软件均可被称为“数据块”、“模块”、“引擎”、“单元”、“组件”或“系统”。此外，本申请的各方面可能表现为位于一个或多个计算机可读介质中的计算机产品，该产品包括计算机可读程序编码。
此外，除非权利要求中明确说明，本申请所述处理元素和序列的顺序、数字字母的使用或其他名称的使用，并非用于限定本申请流程和方法的顺序。尽管上述披露中通过各种示例讨论了一些目前认为有用的发明实施例，但应当理解的是，该类细节仅起到说明的目的，附加的权利要求并不仅限于披露的实施例，相反，权利要求旨在覆盖所有符合本申请实施例实质和范围的修正和等价组合。例如，虽然以上所描述的系统组件可以通过硬件设备实现，但是也可以只通过软件的解决方案得以实现，如在现有的服务器或移动设备上安装所描述的系统。
同理，应当注意的是，为了简化本申请披露的表述，从而帮助对一个或多个发明实施例的理解，前文对本申请实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本申请对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。
一些实施例中使用了描述成分、属性数量的数字，应当理解的是，此类用于实施例描述的数字，在一些示例中使用了修饰词“大约”、“近似”或“大体上”等来修饰。除非另外说明，“大约”、“近似”或“大体上”表明所述数字允许有±20％的变化。相应地，在一些实施例中，说明书和权利要求中使用的数值数据均为近似值，该近似值根据个别实施例所需特点可以发生改变。在一些实施例中，数值数据应考虑规定的有效数位并采用一般位数保留的方法。尽管本申请一些实施例中用于确认其范围广度的数值域和数据为近似值，在具体实施例中，此类数值的设定在可行范围内尽可能精确。
最后，应当理解的是，本申请中所述实施例仅用以说明本申请实施例的原则。其他的变形也可能属于本申请的范围。因此，作为示例而非限制，本申请实施例的替代配置可视为与本申请的教导一致。相应地，本申请的实施例不仅限于本申请明确介绍和描述的实施例。

Claims (27)

  1. 一种声学装置，其特征在于：包括：
    壳体，所述壳体具有第一容置腔；
    扬声器，设置于所述第一容置腔内，所述扬声器包括：磁路组件、音圈、振动组件和传振板；所述磁路组件形成磁间隙；所述音圈的一端设置于所述磁间隙内，所述音圈的另一端连接所述振动组件，所述振动组件与所述传振板连接，所述传振板连接所述壳体。
  2. 根据权利要求1所述的声学装置，其特征在于：所述振动组件包括内支架、外支架和振动片；
    所述音圈的另一端连接所述内支架；
    所述外支架的一端与所述磁路组件的两侧物理连接；
    所述振动片物理连接所述内支架和所述外支架，用于限制所述内支架和所述外支架在第一方向上的相对移动；所述第一方向为所述容置腔的径向；
    所述内支架、所述外支架和所述振动片中的至少一个，与所述传振板连接，以使得振动传递给所述传振板。
  3. 根据权利要求2所述的声学装置，其特征在于：
    所述外支架和所述内支架可活动地连接所述振动片，以限制所述外支架和所述内支架沿所述第一方向上的相对移动，而允许所述内支架和所述振动片在第二方向上相对于所述外支架移动；所述第二方向为所述内支架和所述外支架的延伸方向。
  4. 根据权利要求3所述的声学装置，其特征在于：
    所述外支架的另一端设置有第一凸柱，所述振动片开设有第一贯穿孔，所述第一凸柱通过所述第一贯穿孔可活动地连接所述振动片。
  5. 根据权利要求3所述的声学装置，其特征在于：
    所述内支架的一端设置有第二凸柱，所述振动片开设有第二贯穿孔，所述第二凸柱通过所述第二贯穿孔可活动地连接所述振动片。
  6. 根据权利要求5所述的声学装置，其特征在于：
    所述扬声器还包括弹性减震片，所述弹性减震片设置于所述传振板和所述内支架的一端之间，以减缓所述内支架在所述第二方向上的振动。
  7. 根据权利要求6所述的声学装置，其特征在于：
    所述第二凸柱包括物理连接的笫一柱段和笫二柱段，所述笫二柱段设置于所述第一柱段的上方；所述笫一柱段穿设于所述第二贯穿孔，所述第二柱段插置于所述传振板内；
    所述弹性减震片开设有第三贯穿孔，所述弹性减震片通过所述第三贯穿孔套设于所述第二柱段，且支撑于所述笫一柱段上。
  8. 根据权利要求1所述的声学装置，其特征在于：还包括防护元件；
    所述防护元件包括贴合部、容置部以及支撑部，所述贴合部和所述容置部形成第二容置腔；
    所述传振板设置于所述第二容置腔内，所述贴合部与所述传振板的外端面贴合设置，所述支撑部连接于所述第二容置腔，并设置于所述壳体上方。
  9. 根据权利要求8所述的声学装置，其特征在于：
    所述壳体的内壁设置有环状承台，用于支撑所述环状支撑部和所述弹性减震片。
  10. 根据权利要求1所述的声学装置，其特征在于：
    所述磁路组件包括磁性元件组和导磁罩；
    所述导磁罩包括罩体底部、罩体侧部以及筒槽，所述罩体底部和所述罩体侧部形成所述筒槽；
    所述磁性元件组设置于所述筒槽内，且与所述导磁罩之间形成所述磁间隙。
  11. 根据权利要求10所述的声学装置，其特征在于：还包括固定件，所述固定件用于将所述磁性元件组固定于所述罩体底部；
    所述固定件包括螺栓和螺母，所述螺栓依次穿过所述磁性元件组后穿岀所述罩体底部，以通过螺纹连接将所述磁性元件组和所述罩体底部固定连接。
  12. 根据权利要求11所述的声学装置，其特征在于：
    所述内支架形成盖槽，所述磁性元件组部分伸入所述盖槽内，所述外支架呈筒状设置。
  13. 根据权利要求1所述的声学装置，其特征在于：
    所述磁路组件包括第一磁路组件以及第二磁路组件，所述第二磁路组件环绕所述第一磁路组件以形成所述磁间隙；
    所述第一磁路组件包括第一磁性元件以及第二磁性元件，所述磁路组件产生的总磁场在所述磁间隙内的磁场强度大于所述第一磁性元件或第二磁性元件在所述磁间隙内的磁场强度。
  14. 根据权利要求13所述的声学装置，其特征在于：所述第一磁性元件以及第二磁性元件的磁化方向之间的夹角在150-180度。
  15. 根据权利要求13所述的声学装置，所述第一磁性元件以及第二磁性元件的磁化方向相反。
  16. 根据权利要求15所述的声学装置，其特征在于：所述第一磁性元件以及第二磁性元件的磁化方向均垂直于或平行于所述音圈在所述磁间隙中的振动方向。
  17. 根据权利要求13所述的声学装置，其特征在于：
    所述第二磁路组件包括第三磁性元件，所述第一磁路组件包括第一导磁元件；
    所述第一导磁元件设置在所述第一磁性元件和所述第二磁性元件之间，所述第三磁性元件至少部分地环绕所述第一磁性元件和所述第二磁性元件设置。
  18. 根据权利要求17所述的声学装置，其特征在于：所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向均垂直于所述第一磁性元件与所述第一导磁元件连接的表面，且所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向的磁化方向相反。
  19. 根据权利要求17所述的声学装置，其特征在于：所述第三磁性元件的磁化方 向与所述第一磁性元件的磁化方向或所述第二磁性元件的磁化方向之间的夹角为60-120度。
  20. 根据权利要求17所述的声学装置，其特征在于：所述第三磁性元件的磁化方向与所述第一磁性元件的磁化方向或所述第二磁性元件的磁化方向之间的夹角为0-30度。
  21. 根据权利要求13所述的声学装置，其特征在于：
    所述第二磁性组件包括第一导磁元件和所述第一磁性组件包括第二导磁元件；
    所述第二导磁元件设置在所述第一磁性元件和所述第二磁性元件之间；所述第一导磁元件至少部分地环绕所述第一磁性元件和所述第二磁性元件设置。
  22. 根据权利要求21所述的声学装置，其特征在于：所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向均垂直于所述第一磁性元件与所述第二导磁元件连接的表面，且所述第一磁性元件的磁化方向与所述第二磁性元件的磁化方向的磁化方向相反。
  23. 根据权利要求21所述的声学装置，其特征在于：所述第二导磁元件设置环绕所述第一磁性元件，所述第一磁性元件环绕所述第二磁性元件之间。
  24. 根据权利要求21所述的声学装置，其特征在于：所述第二导磁元件的上表面连接所述第一磁性元件的下表面，所述第二导磁元件的下表面连接所述第二磁性元件的上表面。
  25. 根据权利要求1所述的声学装置，其特征在于：
    所述磁路组件包括第一磁路组件以及第二磁路组件，所述第二磁路组件环绕所述第一磁路组件以形成所述磁间隙；
    所述第一磁路组件包括第一磁性元件和所述第二磁路组件包括第一导磁元件；
    所述第一导磁元件至少部分地环绕所述第一磁性元件；
    所述第一磁性元件的磁化方向由所述第一磁性元件的中心区域指向所述第一磁性 元件的外侧区域或由所述第一磁性元件的外侧区域指向所述第一磁性元件。
  26. 根据权利要求1所述的声学装置，其特征在于：
    所述磁路组件包括第一磁路组件以及第二磁路组件，所述第二磁路组件环绕所述第一磁路组件以形成所述磁间隙；
    所述第一磁路组件包括第一磁性元件和所述第二磁路组件包括第二磁性元件；
    所述第二磁性元件至少部分地环绕所述第一磁性元件；
    所述第一磁性元件的磁化方向由所述第一磁性元件的中心区域指向所述第一磁性元件的外侧区域或由所述第一磁性元件的外侧区域指向所述第一磁性元件。
  27. 根据权利要求26所述的声学装置，其特征在于：所述第二磁性元件的磁化方向由所述第二磁性元件的外环指向所述第二磁性元件的内环或由所述第二磁性元件的内环指向所述第二磁性元件的内环。
PCT/CN2021/088446 2020-04-29 2021-04-20 声学装置及其磁路组件 Ceased WO2021218709A1 (zh)

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