WO2021233100A1 - 发光模组、显示模组、显示屏及显示器 - Google Patents

发光模组、显示模组、显示屏及显示器 Download PDF

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Publication number
WO2021233100A1
WO2021233100A1 PCT/CN2021/090613 CN2021090613W WO2021233100A1 WO 2021233100 A1 WO2021233100 A1 WO 2021233100A1 CN 2021090613 W CN2021090613 W CN 2021090613W WO 2021233100 A1 WO2021233100 A1 WO 2021233100A1
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WIPO (PCT)
Prior art keywords
light
pixel
emitting module
emitting
isolation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/090613
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English (en)
French (fr)
Inventor
刁鸿浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Ivisual 3D Technology Co Ltd
Visiotech Ventures Pte Ltd
Original Assignee
Beijing Ivisual 3D Technology Co Ltd
Visiotech Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Beijing Ivisual 3D Technology Co Ltd, Visiotech Ventures Pte Ltd filed Critical Beijing Ivisual 3D Technology Co Ltd
Priority to US17/927,006 priority Critical patent/US20230197914A1/en
Priority to EP21809494.4A priority patent/EP4156157A4/en
Publication of WO2021233100A1 publication Critical patent/WO2021233100A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials

Definitions

  • This application relates to the field of optical technology, such as a light-emitting module, a display module, a display screen, and a display.
  • the light conversion layer is usually used to support the display.
  • Part of the light emitted by the light conversion layer will be transmitted in undesired directions, and the light transmitted in undesired directions will affect the display effect.
  • the embodiments of the present disclosure provide a light emitting module, a display module, a display screen, and a display, so as to solve the technical problem that a part of the light emitted by the light conversion layer may be transmitted in an undesired direction, which may affect the display effect.
  • the light conversion layer includes a plurality of pixel units
  • a pixel light isolation structure is provided between two adjacent pixel units.
  • the pixel light isolation structure may be disposed in part or all of the area between two adjacent pixel units.
  • a pixel optical isolation structure may be provided in part or all of the pixel interval area.
  • two adjacent pixel units may include a first pixel unit and a second pixel unit
  • the first pixel unit may include a first surface close to the second pixel unit
  • the second pixel unit may include a first pixel unit close to the first pixel unit.
  • the pixel light isolation structure may be disposed on at least one of the first surface and the second surface, or not in contact with the first surface and the second surface.
  • the pixel light isolation structure may be disposed in a light-transmitting area of at least one of the first surface and the second surface.
  • the pixel light isolation structure may be a single integral closed structure.
  • the pixel light isolation structure may include a pixel light isolation body.
  • the pixel light isolation body may include a light isolation material.
  • the pixel optical isolation structure may further include: a spacer structure, which is disposed between the pixel optical isolation body and the pixel unit that needs to be optically isolated.
  • the spacer structure may be disposed between the light isolation body of the pixel and at least one of two adjacent pixel units.
  • the spacer structure may cover part or all of the light isolation body of the pixel.
  • At least one of the pixel light isolation body and the spacer structure may include a light isolation material.
  • the light isolation material may include at least one of a light absorbing material and a light reflecting material.
  • part or all of the cross-sectional shape of the pixel light isolation structure along the light incident direction of the light conversion layer may include at least one of a right-angled quadrilateral, a triangle, and a trapezoid.
  • the cross-sectional shape of the pixel light isolation structure along the light incident direction of the light conversion layer may include a trapezoid, and the bottom side of the trapezoid may face the light incident side of the light conversion layer.
  • the multiple pixel units may include:
  • At least one of pixels and sub-pixels At least one of pixels and sub-pixels.
  • At least two pixel units in the plurality of pixel units may include the same or different light conversion materials.
  • the light-emitting module may further include: a light-emitting unit layer.
  • the light conversion layer may be provided on the light-emitting unit layer.
  • the pixel light isolation structure may directly contact the light-emitting unit layer.
  • the light conversion layer may be disposed on the light-emitting surface of the light-emitting unit layer.
  • the light-emitting unit layer may include a plurality of light-emitting units.
  • some or all of the plurality of light-emitting units may be unpackaged structures.
  • the multiple light emitting units may include:
  • the display module provided by the embodiment of the present disclosure includes the above-mentioned light-emitting module.
  • the display screen provided by the embodiment of the present disclosure includes the above-mentioned display module.
  • the display provided by the embodiment of the present disclosure includes the above-mentioned display screen.
  • the light emitting module, display module, display screen, and display provided by the embodiments of the present disclosure can achieve the following technical effects:
  • the light emitted by the light conversion layer is prevented as far as possible from being conducted in undesired directions, which is beneficial to improve the display Effect.
  • FIG. 1 is a schematic structural diagram of a light-emitting module provided by an embodiment of the present disclosure
  • FIGS. 2A, 2B, and 2C are structural schematic diagrams of a pixel optical isolation structure provided by an embodiment of the present disclosure
  • FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, and FIG. 3E are another schematic structural diagrams of a pixel optical isolation structure provided by an embodiment of the present disclosure.
  • 4A, 4B, 4C, and 4D are schematic diagrams of another structure of a pixel optical isolation structure provided by an embodiment of the present disclosure.
  • Figure 5A, Figure 5B, Figure 5C, Figure 5D, Figure 5E, Figure 5F, Figure 5G, Figure 5H, Figure 5I, Figure 5J, Figure 5K, Figure 5L, Figure 5M, Figure 5N are pixel light provided by embodiments of the present disclosure Another schematic diagram of the isolation structure;
  • FIG. 6 is a schematic structural diagram of a pixel optical isolation body provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of another structure of a pixel optical isolation body provided by an embodiment of the present disclosure.
  • FIG. 8 is another schematic structural diagram of a pixel optical isolation structure provided by an embodiment of the present disclosure.
  • 9A, 9B, and 9C are schematic diagrams of another structure of a pixel optical isolation structure provided by an embodiment of the present disclosure.
  • FIG. 10A, FIG. 10B, FIG. 10C, FIG. 10D, and FIG. 10E are another schematic structural diagrams of a pixel optical isolation structure provided by an embodiment of the present disclosure.
  • FIG. 11A, FIG. 11B, FIG. 11C, FIG. 11D, and FIG. 11E are schematic diagrams of another structure of a pixel optical isolation structure provided by an embodiment of the present disclosure.
  • FIG. 12A, FIG. 12B, FIG. 12C, and FIG. 12D are structural schematic diagrams of optical isolation materials provided by embodiments of the present disclosure.
  • FIG. 13A, FIG. 13B, FIG. 13C, FIG. 13D, FIG. 13E, FIG. 13F, FIG. 13G, and FIG. 13H are schematic diagrams of another structure of a light emitting module provided by an embodiment of the present disclosure.
  • FIG. 14 is another schematic diagram of the structure of the light emitting module provided by the embodiment of the present disclosure.
  • FIG. 15 is another schematic diagram of the structure of the light-emitting module provided by the embodiment of the present disclosure.
  • FIG. 16 is a schematic diagram of the structure of a light-emitting unit layer provided by an embodiment of the present disclosure.
  • FIG. 17 is a schematic structural diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 18 is a schematic structural diagram of a display screen provided by an embodiment of the present disclosure.
  • FIG. 19 is a schematic structural diagram of a display provided by an embodiment of the present disclosure.
  • 100 light-emitting module; 110: light-emitting unit layer; 111: light-emitting unit; 410: light conversion layer; 411: pixel unit; 500: pixel optical isolation structure; 501: pixel optical isolation main body; 502: optical isolation material; 5021: Light absorbing material; 5022: light reflecting material; 503: spacer structure; 510: pixel interval area; 520: first pixel unit; 521: first side; 530: second pixel unit; 531: second side; 533: transparent Light area; 534: light-transmitting area; D: bottom edge; E: light incident side; P: plane direction; S: light exit surface; Y: light incident direction; 700: display module; 800: display screen; 900: monitor.
  • an embodiment of the present disclosure provides a light emitting module 100, including:
  • the light conversion layer 410 includes a plurality of pixel units 411;
  • a pixel optical isolation structure 500 is provided between two adjacent pixel units 411.
  • the pixel light isolation structure 500 can try to prevent the light emitted by two adjacent pixel units 411 from being transmitted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is transmitted to each other), which is beneficial to improve the display. Effect.
  • the light conversion layer 410 can realize the color conversion of light by means of wavelength selection, for example: at least one of the plurality of pixel units 411 included in the light conversion layer 410 color the light from the light-emitting unit layer. Conversion.
  • the pixel light isolation structure 500 may be disposed in part or all of the area between two adjacent pixel units 411.
  • the pixel light isolation structure 500 is disposed in a partial area between two adjacent pixel units 411, and the partial area is located between and close to two adjacent pixel units 411.
  • One of the pixel units 411 (the pixel unit 411 on the left in the figure).
  • the pixel light isolation structure 500 is disposed in a partial area between two adjacent pixel units 411, and the partial area is located between two adjacent pixel units 411, and It is opposite to the position of the pixel light isolation structure 500 in FIG. 2A (close to the pixel unit 411 on the right side of the figure).
  • the pixel light isolation structure 500 is disposed in the entire area between two adjacent pixel units 411.
  • the area where the pixel optical isolation structure 500 is provided between two adjacent pixel units 411 can be determined according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can avoid two adjacent pixel units 411
  • the emitted light may be transmitted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 may be transmitted to each other).
  • a pixel interval area 510 between two adjacent pixel units 411, and a part or all of the pixel interval area 510 may be provided There is a pixel light isolation structure 500.
  • a pixel interval area 510 having a rectangular shape may be used as a pixel interval area between two adjacent pixel units 411; the pixel interval area 510 may be smoothly connected to each other. Two adjacent pixel units 411, so that the projections formed by the adjacent two pixel units 411 and the pixel interval area 510 can form a regular shape such as a right-angled quadrilateral as shown in FIG. 3A.
  • the pixel interval area 510 between two adjacent pixel units 411 may not have the shape of the pixel interval area 510 as shown in FIG. 3A, but has a circular, elliptical, triangular, or trapezoidal shape. And other shapes.
  • the pixel interval area 510 between two adjacent pixel units 411 has other shapes such as a circle, an ellipse, a triangle, a trapezoid, etc.
  • the pixel interval area 510 may also smoothly connect the adjacent pixels.
  • Two pixel units 411, so that the projections formed by two adjacent pixel units 411 and the pixel interval area 510 can form a regular shape such as a right-angled quadrilateral as shown in FIG. 3A.
  • the position, shape, size, etc. of the pixel interval area 510 between two adjacent pixel units 411 can be determined according to actual conditions such as process requirements.
  • the pixel interval area 510 having an approximately elliptical shape shown by the dotted line in FIG. 3B may also be used as the adjacent pixel interval area 510.
  • the pixel optical isolation structure 500 is disposed in a partial area of the pixel interval area 510 between two adjacent pixel units 411, and the partial area is located in two adjacent pixels.
  • One of the pixel units 411 between and near the units 411 (the pixel unit 411 on the left in the figure).
  • the pixel optical isolation structure 500 is disposed in a partial area of the pixel interval area 510 between two adjacent pixel units 411, and the partial area is located in two adjacent pixels. Between the cells 411 and opposite to the position of the pixel optical isolation structure 500 in FIG. 3C (close to the pixel cell 411 on the right side of the figure).
  • the pixel light isolation structure 500 is disposed in all areas of the pixel interval area 510 between two adjacent pixel units 411.
  • the location of the pixel optical isolation structure 500 in the pixel interval area 510 between two adjacent pixel units 411 can be determined according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can avoid adjacent pixels.
  • the light emitted by the two pixel units 411 may be transmitted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 may be transmitted to each other).
  • two adjacent pixel units 411 may include a first pixel unit 520 and a second pixel unit 530
  • the first pixel unit 520 may include a first pixel unit 520 and a second pixel unit 530.
  • the first surface 521 of the two pixel unit 530 and the second pixel unit 530 may include a second surface 531 close to the first pixel unit 520.
  • the pixel light isolation structure 500 may be disposed on at least one of the first surface 521 and the second surface 531, or not in contact with the first surface 521 and the second surface 531.
  • the pixel optical isolation structure 500 is disposed on the first surface 521 of the first pixel unit 520, is in contact with the first surface 521 of the first pixel unit 520, and is not in contact with the second pixel unit 520.
  • the second surface 531 of 530 is in contact.
  • the pixel optical isolation structure 500 is disposed on the second surface 531 of the second pixel unit 530, is in contact with the second surface 531 of the second pixel unit 530, and is not connected to the first pixel unit 530.
  • the first surface 521 of 520 is in contact.
  • the pixel optical isolation structure 500 is disposed on the first surface 521 of the first pixel unit 520 and the second surface 531 of the second pixel unit 530, and the first pixel unit 520 The first surface 521 is in contact with the second surface 531 of the second pixel unit 530.
  • the pixel optical isolation structure 500 is disposed between the first surface 521 of the first pixel unit 520 and the second surface 531 of the second pixel unit 530, and is not connected to the first pixel unit 530.
  • the first surface 521 of the 520 is in contact with the second surface 531 of the second pixel unit 530.
  • the arrangement relationship between the pixel optical isolation structure 500 and the first pixel unit 520 and the second pixel unit 530 can be determined according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can avoid the first pixel unit 520. It is sufficient that the light emitted by the second pixel unit 530 is conducted in an undesired direction (for example, the light emitted by the first pixel unit 520 and the second pixel unit 530 is conducted to each other).
  • the pixel The light isolation structure 500 may be disposed in the light-transmitting area 534 of at least one of the first surface 521 and the second surface 531.
  • the arrow figure exemplarily represents the direction of light transmission of a part of the pixel unit 411 to the outside.
  • the light-transmitting areas 533 and 534 are surrounded by dotted lines.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes the entire area of the first surface 521.
  • the pixel light isolation structure 500 can be disposed on the entire area of the first surface 521 and contact the entire area of the first surface 521, so that the pixel light isolation structure 500 can be disposed on the light-transmitting area of the first surface 521. Area 533.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes a partial area of the first surface 521.
  • the pixel light isolation structure 500 may be disposed on the corresponding partial area of the first surface 521 and contact the corresponding partial area of the first surface 521, so that the pixel light isolation structure 500 may be disposed on the corresponding partial area of the first surface 521.
  • Translucent area 533 may be disposed on the corresponding partial area of the first surface 521 and contact the corresponding partial area of the first surface 521, so that the pixel light isolation structure 500 may be disposed on the corresponding partial area of the first surface 521.
  • the light-transmitting area 534 of the second surface 531 of the second pixel unit 530 includes the entire area of the second surface 531.
  • the pixel light isolation structure 500 can be disposed on the entire area of the second surface 531 and contact the entire area of the second surface 531, so that the pixel light isolation structure 500 can be disposed on the light-transmitting area of the second surface 531. Area 534.
  • the light-transmitting area 534 of the second surface 531 of the second pixel unit 530 includes a partial area of the second surface 531.
  • the pixel light isolation structure 500 may be disposed on the corresponding partial area of the second surface 531 and contact the corresponding partial area of the second surface 531, so that the pixel light isolation structure 500 may be disposed on the second surface 531.
  • Light-transmitting area 534 may be disposed on the corresponding partial area of the second surface 531 and contact the corresponding partial area of the second surface 531, so that the pixel light isolation structure 500 may be disposed on the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes the entire area of the first surface 521, and the light-transmitting area 531 of the second surface 531 of the second pixel unit 530
  • the area 534 includes the entire area of the second surface 531.
  • the pixel light isolation structure 500 may be disposed on the entire area of the first surface 521 and the entire area of the second surface 531, and be in contact with the entire area of the first surface 521 and the entire area of the second surface 531. , So that the pixel light isolation structure 500 can be disposed in the light-transmitting area 533 of the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes a partial area of the first surface 521, and the second surface 531 of the second pixel unit 530
  • the light-transmitting area 534 includes a partial area of the second surface 531, and the light-transmitting area 533 of the first surface 521 is consistent with the light-transmitting area 534 of the second surface 531 (for example, at least one of the position, shape, area, etc. is the same) ).
  • the pixel light isolation structure 500 may be disposed on the corresponding partial areas of the first surface 521 and the second surface 531, and be in contact with the corresponding partial areas of the first surface 521 and the corresponding partial areas of the second surface 531. In this way, the pixel light isolation structure 500 can be disposed on the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes a partial area of the first surface 521, and the light-transmitting area 531 of the second surface 531 of the second pixel unit 530
  • the area 534 includes a partial area of the second surface 531, and the light-transmitting area 533 of the first surface 521 is not consistent with the light-transmitting area 534 of the second surface 531 (for example, at least one of the position, shape, area, etc. is different).
  • the pixel light isolation structure 500 may be disposed on the corresponding partial areas of the first surface 521 and the second surface 531, and be in contact with the corresponding partial areas of the first surface 521 and the corresponding partial areas of the second surface 531. In this way, the pixel light isolation structure 500 can be disposed on the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 may include the entire area of the first surface 521
  • the light-transmitting area 534 of the second surface 531 of the second pixel unit 530 may include the second Part of the area of the face 531.
  • the pixel light isolation structure 500 may be disposed on the entire area of the first surface 521 and a partial area of the second surface 531, and is connected to the entire area of the first surface 521 and the partial area of the second surface 531. Contact, so that the pixel light isolation structure 500 can be disposed on the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 may include a partial area of the first surface 521
  • the light-transmitting area 534 of the second surface 531 of the second pixel unit 530 may include the second surface 531 The entire area.
  • the pixel optical isolation structure 500 may be disposed on the partial area of the first surface 521 and the entire area of the second surface 531, and is connected to the partial area of the first surface 521 and the entire area of the second surface 531. Area contact, so that the pixel light isolation structure 500 can be disposed on the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes the entire area of the first surface 521 and the entire area of the second surface 531.
  • the pixel light isolation structure 500 may be disposed between the entire area of the first surface 521 and the entire area of the second surface 531, and does not contact the first surface 521 and the second surface 531, so that The pixel light isolation structure 500 may be disposed between the light-transmitting area 533 of the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes a partial area of the first surface 521, and the second surface 531 of the second pixel unit 530
  • the light-transmitting area 534 includes a partial area of the second surface 531, and the light-transmitting area 533 of the first surface 521 is consistent with the light-transmitting area 534 of the second surface 531 (for example, at least one of the position, shape, area, etc. is the same) ).
  • the pixel optical isolation structure 500 may be disposed between the corresponding partial regions of the first surface 521 and the second surface 531, and does not contact the first surface 521 and the second surface 531, so that the pixels are optically isolated.
  • the structure 500 may be disposed between the light-transmitting area 533 of the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 includes a partial area of the first surface 521, and the light-transmitting area 533 of the second surface 531 of the second pixel unit 530
  • the area 534 includes a partial area of the second surface 531, and the light-transmitting area 533 of the first surface 521 is not consistent with the light-transmitting area 534 of the second surface 531 (for example, at least one of the position, shape, area, etc. is different).
  • the pixel light isolation structure 500 may be disposed between the corresponding partial area of the first surface 521 and the corresponding partial area of the second surface 531, and does not contact the first surface 521 and the second surface 531. In this way, the pixel light isolation structure 500 can be disposed between the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 may include the entire area of the first surface 521
  • the light-transmitting area 534 of the second surface 531 of the second pixel unit 530 may include the second Part of the area of the face 531.
  • the pixel optical isolation structure 500 may be disposed between the entire area of the first surface 521 and a partial area of the second surface 531, and does not contact the first surface 521 and the second surface 531, so that The pixel light isolation structure 500 may be disposed between the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting area 533 of the first surface 521 of the first pixel unit 520 may include a partial area of the first surface 521
  • the light-transmitting area 534 of the second surface 531 of the second pixel unit 530 may include the second surface 531 The entire area.
  • the pixel light isolation structure 500 may be disposed between the partial area of the first surface 521 and the entire area of the second surface 531, without contacting the first surface 521 and the second surface 531. Therefore, the pixel light isolation structure 500 can be disposed between the first surface 521 and the light-transmitting area 534 of the second surface 531.
  • the light-transmitting areas 533 and 534 of the pixel unit 411 may be continuous areas.
  • the pixel light isolation structure 500 may be disposed in the continuous area, and may be in contact with or not in contact with the continuous area, so that the pixel light isolation structure 500 may be disposed in the light-transmitting areas 533 and 534 of the pixel unit 411.
  • the light-transmitting areas 533 and 534 of the pixel unit 411 may be discontinuous areas.
  • the pixel optical isolation structure 500 may be disposed in the discontinuous area, and may be in contact with or not in contact with the discontinuous area, so that the pixel optical isolation structure 500 may be disposed in the light-transmitting areas 533, 534 of the pixel unit 411 .
  • the position and number of discontinuous areas for disposing the pixel light isolation structure 500 may be determined according to actual light transmission conditions such as process requirements, so that the pixel light isolation structure 500 may be disposed in a pixel unit presented in a discontinuous area.
  • the light-transmitting areas 533, 534 of the pixel unit 411 can be determined according to the actual light transmission conditions such as process requirements, and accordingly, it is considered that the pixel light isolation structure 500 is disposed in the light-transmitting areas 533, 534 of the pixel unit 411, or Between the corresponding light-transmitting regions 533 and 534 of two adjacent pixel units 411.
  • the light-transmitting areas 533, 534 may include part or all of the pixel unit 411, and may be presented in the form of a continuous area or a discontinuous area, and the corresponding position and quantity may be determined according to the actual light transmission conditions such as process requirements.
  • the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being transmitted in an undesired direction (for example, the light emitted by the first pixel unit 520 and the second pixel unit 530 is transmitted to each other). .
  • part or all of the pixel light isolation structure 500 may be a single integral closed structure.
  • part or all of the pixel light isolation structure 500 may be a complete single whole, excluding a split structure formed by splicing or the like.
  • part or all of the surface (or can be referred to as an outer contour) of the pixel light isolation structure 500 may be closed without openings, so that the corresponding pixel light isolation structure 500 is formed as a closed structure.
  • part or all of the pixel light isolation structure 500 as a single integral closed structure may be a solid structure or a hollow structure.
  • part or all of the pixel light isolation structure 500 may be different from the above-mentioned complete unitary unit, but include a split structure formed by splicing or the like.
  • part or all of the surface (or can be referred to as an outer contour) of the pixel light isolation structure 500 may be non-closed, with openings, so that the pixel light isolation structure 500 is formed as a non-closed structure (or may be referred to as an open structure). ).
  • part or all of the pixel optical isolation structure 500 may be set as a single integral closed structure or non-closed structure according to actual conditions such as process requirements, or the pixel optical isolation structure 500 may be configured according to actual conditions such as process requirements. Part or all of it is set to a solid structure or a hollow structure, as long as the pixel light isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example: the first pixel unit 520, the second pixel unit The light emitted by 530 is transmitted to each other).
  • the pixel light isolation structure 500 may include a pixel light isolation body 501.
  • the pixel light isolation body 501 may include a light isolation material 502.
  • the pixel optical isolation structure 500 may further include: a spacer structure 503 disposed between the pixel optical isolation body 501 and the pixel unit 411 that needs to be optically isolated.
  • the spacer structure 503 may be disposed between the pixel light isolation body 501 and at least one of the two adjacent pixel units 411.
  • the spacer structure 503 is disposed on the pixel light isolation body 501 and the second pixel unit 530. Between a pixel unit 520.
  • the spacer structure 503 is disposed on the pixel light isolation body 501 and the second pixel unit 530. Between two pixel units 530.
  • one of the pixel optical isolation body 501 and the first pixel unit 520 A spacer structure 503 is provided between, and a spacer structure 503 is also provided between the pixel light isolation body 501 and the second pixel unit 530.
  • the location of the spacer structure 503 can be considered according to actual conditions such as process requirements, as long as the pixel optical isolation body 501 can be spaced from the adjacent pixel unit 411.
  • the spacer structure 503 may cover part or all of the pixel light isolation body 501.
  • FIG. 10A As shown in FIG. 10A, FIG. 10B, FIG. 10C, and FIG. Side or more sides.
  • the spacer structure 503 may cover all of the pixel light isolation body 501.
  • the arrangement of the spacer structure 503 (for example, covering part or all of the pixel optical isolation body 501) can be considered according to actual conditions such as process requirements, as long as the pixel optical isolation body 501 can be separated from the adjacent pixel unit 411. Just be spaced apart.
  • the spacer structure 503 may be in contact with at least one of two adjacent pixel units 411.
  • the spacer structure 503 may not be in contact with two adjacent pixel units 411.
  • the spacer structure 503 is in contact with the first pixel unit 520. It is in contact with the second pixel unit 530.
  • the spacer structure 503 is in contact with the second pixel unit 530. It is in contact with the first pixel unit 520.
  • the spacer structure 503 and the first pixel unit as a single whole 520 and the second pixel unit 530 are in contact.
  • two adjacent pixel units 411 include a first pixel unit 520 and a second pixel unit 530
  • one spacer The structure 503 is in contact with the first pixel unit 520 but not with the second pixel unit 530
  • the other spacer structure 503 is in contact with the second pixel unit 530 but not with the first pixel unit 520.
  • the spacing structure 503 is connected to the first pixel unit 520, the second pixel unit 520 and the second pixel unit 530.
  • the pixel units 530 are not in contact.
  • the arrangement of the spacer structure 503 (for example, contacting at least one of the two adjacent pixel units 411) can be considered according to actual conditions such as process requirements, as long as the pixel optically isolates the main body 501 from the adjacent The pixel units 411 may be spaced apart.
  • At least one of the pixel light isolation body 501 and the spacer structure 503 may include a light isolation material 502.
  • the light isolation material 502 may include at least one of a light absorbing material 5021 and a light reflecting material 5022.
  • the light isolation material 502 may include a light absorbing material 5021.
  • the light isolation material 502 may include a light reflective material 5022.
  • the light isolation material 502 may include a light absorbing material 5021 and a light reflecting material 5022.
  • the arrangement of the optical isolation material 502 may be considered according to actual conditions such as process requirements, as long as the optical isolation material 502 can effectively achieve optical isolation.
  • the light isolation material 502 contains the light absorbing material 5021 and the light reflecting material 5022
  • the positions and proportions of the light absorbing material 5021 and the light reflecting material 5022 can be considered according to actual conditions such as process requirements.
  • the pixel light isolation structure 500 has a cross-sectional shape along the light incident direction Y of the light conversion layer 410 Part or all of the shape of may include at least one of a right-angled quadrilateral, a triangle, and a trapezoid.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 is a right-angled quadrilateral.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 includes two right-angled quadrilaterals, and the two right-angled quadrilaterals are in the plane direction of the light conversion layer 410.
  • the width on P is not the same.
  • a right-angled quadrilateral with a relatively large width in the planar direction P of the light conversion layer 410 may be close to the light incident side E of the light conversion layer 410, and a rectangular shape with a relatively small width in the planar direction P of the light conversion layer 410
  • the right-angled quadrilateral may be far away from the light incident side E of the light conversion layer 410.
  • the relative positional relationship of the two right-angled quadrilaterals can also be opposite to that shown in the figure.
  • a right-angled quadrilateral with a relatively small width in the plane direction P of the light conversion layer 410 can be close to the entrance of the light conversion layer 410.
  • the light side E, a right-angled quadrilateral with a relatively large width in the plane direction P of the light conversion layer 410 may be far away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 is a triangle.
  • one side of the triangle may be close to the light incident side E of the light conversion layer 410.
  • one side of the triangle may be far away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 includes a right-angled quadrilateral and a triangle.
  • the right-angled quadrilateral may be close to the light incident side E of the light conversion layer 410, and the triangle may be far away from the light incident side E of the light conversion layer 410.
  • the relative positional relationship between the right-angled quadrilateral and the triangle can also be opposite to that shown in the figure.
  • the triangle can be close to the light incident side E of the light conversion layer 410, and the right-angled quadrilateral can be far away from the light incident side E of the light conversion layer 410.
  • one side of the triangle may face the light incident side E of the light conversion layer 410 or face away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 is a trapezoid.
  • the lower bottom edge D of the trapezoid may face the light incident side E of the light conversion layer 410.
  • the lower bottom edge D of the trapezoid may face away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 includes a trapezoid and a right-angled quadrilateral.
  • the right-angled quadrilateral may be far away from the light incident side E of the light conversion layer 410, and the trapezoid may be close to the light incident side E of the light conversion layer 410.
  • the lower bottom edge D of the trapezoid may face the light incident side E of the light conversion layer 410 or face away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 includes a trapezoid and a right-angled quadrilateral.
  • the right-angled quadrilateral may be close to the light incident side E of the light conversion layer 410, and the trapezoid may be far away from the light incident side E of the light conversion layer 410.
  • the lower bottom edge D of the trapezoid may face the light incident side E of the light conversion layer 410 or face away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel light isolation structure 500 along the light incident direction Y of the light conversion layer 410 includes a trapezoid and a triangle.
  • the trapezoid may be close to the light incident side E of the light conversion layer 410, and the triangle may be far away from the light incident side E of the light conversion layer 410.
  • the relative positional relationship between the trapezoid and the triangle may be opposite to that shown in the figure.
  • the trapezoid may be far away from the light incident side E of the light conversion layer 410, and the triangle may be close to the light incident side E of the light conversion layer 410.
  • the lower bottom edge D of the trapezoid may face the light incident side E of the light conversion layer 410 or face away from the light incident side E of the light conversion layer 410.
  • one side of the triangle may face the light incident side E of the light conversion layer 410 or face away from the light incident side E of the light conversion layer 410.
  • the cross-sectional shape of the pixel optical isolation structure 500 along the light incident direction Y of the light conversion layer 410 can be considered according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can avoid the emission of two adjacent pixel units 411. It is sufficient that the light of ⁇ is transmitted in an undesired direction (for example, the light emitted by two adjacent pixel units 411 is transmitted to each other).
  • the pixel light isolation structure 500 may include a structure and material capable of light isolation, such as at least one of metals such as silver and aluminum.
  • the structure and material of the pixel optical isolation structure 500 can be determined according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being transmitted in undesired directions (for example: The light emitted by two adjacent pixel units 411 is transmitted to each other).
  • the pixel light isolation structure 500 may also include other structures and materials capable of light absorption, light reflection, etc., such as resin composition, titanium oxide (for example: TiO2), and the like.
  • the material for realizing light absorption may also include a black matrix (BM).
  • the structure and material of the pixel optical isolation structure 500 can be determined according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being transmitted in undesired directions (for example: The light emitted by two adjacent pixel units 411 is transmitted to each other).
  • the plurality of pixel units 411 may include at least one of pixels and sub-pixels.
  • the plurality of pixel units 411 may include at least one pixel.
  • the plurality of pixel units 411 may include at least one sub-pixel.
  • the plurality of pixel units 411 may include at least one pixel and at least one sub-pixel.
  • the pixel unit 411 may be set according to actual conditions such as process requirements, so that the plurality of pixel units 411 include at least one of pixels and sub-pixels.
  • the pixel unit 411 may include other display (for example, light conversion) structures other than pixels and sub-pixels.
  • At least two pixel units 411 in the plurality of pixel units 411 may include the same or different light conversion materials.
  • the main or all components in the light conversion material may include at least one of phosphors, quantum dots and other materials.
  • the light-emitting module 100 may further include: a light-emitting unit layer 110.
  • the light conversion layer 410 may be disposed on the light-emitting unit layer 110.
  • part or all of the pixel light isolation structure 500 may directly contact the light emitting unit layer 110, or there may be gaps; for example, all of the pixel light isolation structure 500 may directly contact the light emitting unit layer 110, or the pixel A part of the light isolation structure 500 is in direct contact with the light emitting unit layer 110, and there is a gap between another part and the light emitting unit layer 110, or there is a gap between all of the pixel light isolation structure 500 and the light emitting unit layer 110.
  • the gap between the pixel light isolation structure 500 and the light-emitting unit layer 110 may be partially or completely provided with a light isolation material.
  • whether the pixel optical isolation structure 500 is in direct contact with the light-emitting unit layer 100 can be considered according to actual conditions such as process requirements, as long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being undesired. (For example, the light emitted by the first pixel unit 520 and the second pixel unit 530 are transmitted to each other).
  • the light conversion layer 410 may be disposed on the light emitting surface S of the light emitting unit layer 110.
  • the light from the light emitting unit layer 110 may enter the light conversion layer 410 through the light incident side E of the light conversion layer 410.
  • the light-emitting unit layer 110 may include a plurality of light-emitting units 111.
  • part or all of the plurality of light emitting units 111 may be an unpackaged structure.
  • part of the plurality of light emitting units 111 may be an unpackaged structure.
  • one, two, three, or more of the plurality of light-emitting units 111 may only be light-emitting units that have been set up and capable of emitting light, and have not undergone encapsulation processing, and have not formed packages such as an encapsulation layer for encapsulating the light-emitting units.
  • At least one of the plurality of light-emitting units 111 may be a light-emitting unit including a first semiconductor layer, an active layer, and a second semiconductor layer (or, an electrode) formed based on epitaxial growth, but not After the encapsulation process, no encapsulation structure such as an encapsulation layer that encapsulates the light-emitting unit including the first semiconductor layer, the active layer, and the second semiconductor layer (or, may also include an electrode) is not formed.
  • all of the plurality of light emitting units 111 may be an unpackaged structure.
  • all of the multiple light-emitting units 111 may only be light-emitting units that have been set up and capable of emitting light, and have not undergone encapsulation processing, and no packaging structure such as an encapsulation layer for encapsulating the light-emitting units has been formed, for example: multiple light-emitting units 111 All of them may be light emitting units including the first semiconductor layer, the active layer, and the second semiconductor layer (or, may also include electrodes) formed based on epitaxial growth.
  • Packaging structures such as a semiconductor layer, an active layer, a second semiconductor layer (or, an encapsulation layer, which may also include an electrode) encapsulated by the light-emitting unit.
  • part or all of the plurality of light emitting units 111 may be a package structure.
  • one, two, three or more of the plurality of light-emitting units 111 may not only complete the set-up of light-emitting units that can emit light, but also may undergo packaging processing to form an encapsulation layer that encapsulates the light-emitting units.
  • at least one of the plurality of light-emitting units 111 may be a light-emitting unit including a first semiconductor layer, an active layer, and a second semiconductor layer (or an electrode) formed based on epitaxial growth.
  • a packaging structure such as an packaging layer that encapsulates the light emitting unit including the first semiconductor layer, the active layer, and the second semiconductor layer (or, may also include electrodes) is formed.
  • the package structure encapsulating one or more light-emitting units 111 can be regarded as one light-emitting unit 111 as a whole.
  • one package structure includes one light-emitting unit 111.
  • Unit 111, the package structure including the one light-emitting unit 111 can be regarded as a light-emitting unit 111; for another example: a package structure includes three light-emitting units 111, and the package structure including the three light-emitting units 111 can be viewed as Make a light-emitting unit 111.
  • part or all of the multiple light-emitting units 111 may be configured as unpackaged structures according to actual conditions such as process requirements, or part or all of the multiple light-emitting units 111 may be configured as unpackaged structures according to actual conditions such as process requirements.
  • the packaging structure as long as the pixel optical isolation structure 500 can prevent the light emitted by two adjacent pixel units 411 from being conducted in an undesired direction (for example, the light emitted by the first pixel unit 520 and the second pixel unit 530 is conducted to each other). Can.
  • the plurality of light emitting units 111 may include at least one of LED, Mini LED, and Micro LED.
  • the plurality of light emitting units 111 may include at least one LED.
  • the plurality of light emitting units 111 may include at least one Mini LED.
  • the plurality of light emitting units 111 may include at least one Micro LED.
  • the plurality of light emitting units 111 may include at least one LED and at least one Mini LED.
  • the plurality of light emitting units 111 may include at least one LED and at least one Micro LED.
  • the plurality of light emitting units 111 may include at least one Mini LED and at least one Micro LED.
  • the plurality of light emitting units 111 may include at least one LED, at least one Mini LED, and at least one Micro LED.
  • the plurality of light emitting units 111 may include other light emitting devices in addition to LEDs, Mini LEDs, and Micro LEDs.
  • the device type of the light-emitting unit 111 may be determined according to actual conditions such as process requirements, for example: LED, Mini LED, Micro LED, or other light-emitting devices.
  • the display module 700 provided by an embodiment of the present disclosure includes the above-mentioned light-emitting module 100.
  • the display module 700 may support 3D display.
  • the display screen 800 provided by the embodiment of the present disclosure includes the above-mentioned display module 700.
  • the display screen 800 may perform 3D display.
  • a display 900 provided by an embodiment of the present disclosure includes the above-mentioned display screen 800.
  • the display 900 may perform 3D display.
  • the display 900 may further include other components for supporting the normal operation of the display 900, such as at least one of a communication interface, a frame, a control circuit, and other components.
  • a pixel light isolation structure is provided between two adjacent pixel units in part or all of the plurality of pixel units in the light conversion layer, Try to avoid the light emitted by the light conversion layer from being conducted in undesired directions, which is beneficial to improve the display effect and also has the possibility of improving the light utilization rate.
  • the first element can be called the second element, and similarly, the second element can be called the first element, as long as all occurrences of the "first element” are renamed consistently and all occurrences "Second component” can be renamed consistently.
  • the first element and the second element are both elements, but they may not be the same element.
  • the terms used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates, the singular forms "a” (a), “an” (an) and “the” (the) are intended to also include plural forms .
  • the term “and/or” as used in this application refers to any and all possible combinations that include one or more of the associated lists.
  • the term “comprise” and its variants “comprises” and/or including (comprising) and the like refer to the stated features, wholes, steps, operations, elements, and/or The existence of components does not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components, and/or groups of these. If there are no more restrictions, the element defined by the sentence “including a" does not exclude the existence of other identical elements in the process, method, or device that includes the element.
  • each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.
  • the relevant parts can be referred to the description of the method parts.
  • the disclosed methods and products can be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of units may only be a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to implement this embodiment.
  • the functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

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Abstract

一种发光模组（100）、显示模组（700）、显示屏（800）及显示器（900），涉及光学技术领域，发光模组（100）包括：光转换层（410），包括多个像素单元（411）；其中，在多个像素单元（411）的部分或全部中，相邻的两个像素单元（411）之间设置有像素光隔离结构（500）。该发光模组（100），通过在光转换层（410）中的多个像素单元（411）的部分或全部中相邻的两个像素单元（411）之间设置像素光隔离结构（500），尽量避免光转换层（410）发出的光向不希望的方向传导，有利于改善显示效果。

Description

发光模组、显示模组、显示屏及显示器
本申请要求在2020年05月22日提交中国知识产权局、申请号为202010439790.9、发明名称为“发光模组、显示模组、显示屏及显示器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光学技术领域，例如涉及一种发光模组、显示模组、显示屏及显示器。
背景技术
目前通常使用到光转换层，以对显示进行支持。
在实现本公开实施例的过程中，发现相关技术中至少存在如下问题：
光转换层发出的光中的一部分会向不希望的方向传导，向不希望的方向传导的光将影响显示效果。
发明内容
为了对披露的实施例的一些方面有基本的理解，下面给出了简单的概括。该概括不是泛泛评述，也不是要确定关键/重要组成元素或描绘这些实施例的保护范围，而是作为后面的详细说明的序言。
本公开实施例提供了一种发光模组、显示模组、显示屏及显示器，以解决光转换层发出的光中的一部分会向不希望的方向传导，导致影响显示效果的技术问题。
本公开实施例提供的发光模组，包括：
光转换层，包括多个像素单元；
其中，在多个像素单元的部分或全部中，相邻的两个像素单元之间设置有像素光隔离结构。
在一些实施例中，像素光隔离结构可以设置于相邻的两个像素单元之间的部分或全部区域。
在一些实施例中，相邻的两个像素单元之间可以存在像素间隔区域，像素间隔区域的部分或全部中可以设置有像素光隔离结构。
在一些实施例中，相邻的两个像素单元可以包括第一像素单元、第二像素单元，第一像素单元可以包括靠近第二像素单元的第一面，第二像素单元可以包括靠近第一像素单元 的第二面。可选地，像素光隔离结构可以设置于第一面、第二面中至少之一，或不与第一面、第二面接触。
在一些实施例中，像素光隔离结构可以设置于第一面、第二面中至少之一的透光区域。
在一些实施例中，像素光隔离结构可以为单一整体封闭结构。
在一些实施例中，像素光隔离结构可以包括像素光隔离主体。
在一些实施例中，像素光隔离主体可以包含光隔离材料。
在一些实施例中，像素光隔离结构还可以包括：间隔结构，设置于像素光隔离主体和需要进行光隔离的像素单元之间。
在一些实施例中，间隔结构可以设置于像素光隔离主体，和相邻的两个像素单元中至少之一之间。
在一些实施例中，间隔结构可以覆盖像素光隔离主体的部分或全部。
在一些实施例中，像素光隔离主体和间隔结构中至少之一可以包含光隔离材料。
在一些实施例中，光隔离材料可以包括光吸收材料、光反射材料中至少之一。
在一些实施例中，像素光隔离结构沿光转换层的入光方向的截面形状中的部分或全部形状可以包括直角四边形、三角形、梯形中至少之一。
在一些实施例中，像素光隔离结构沿光转换层的入光方向的截面形状可以包括梯形，梯形的下底边可以朝向光转换层的入光侧。
在一些实施例中，多个像素单元，可以包括：
像素、子像素中至少之一。
在一些实施例中，多个像素单元中的至少两个像素单元，可以包含相同或不同的光转换材料。
在一些实施例中，发光模组还可以包括：发光单元层。可选地，光转换层可以设置于发光单元层。
在一些实施例中，像素光隔离结构可以和发光单元层直接接触。
在一些实施例中，光转换层可以设置于发光单元层的出光面。
在一些实施例中，发光单元层可以包括多个发光单元。
在一些实施例中，多个发光单元中的部分或全部可以是未封装结构。
在一些实施例中，多个发光单元，可以包括：
发光二极管(LED)、迷你(Mini)LED、微(Micro)LED中至少之一。
本公开实施例提供的显示模组，包括上述的发光模组。
本公开实施例提供的显示屏，包括上述的显示模组。
本公开实施例提供的显示器，包括上述的显示屏。
本公开实施例提供的发光模组、显示模组、显示屏及显示器，可以实现以下技术效果：
通过在光转换层中的多个像素单元的部分或全部中相邻的两个像素单元之间设置像素光隔离结构，尽量避免光转换层发出的光向不希望的方向传导，有利于改善显示效果。
以上的总体描述和下文中的描述仅是示例性和解释性的，不用于限制本申请。
附图说明
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件示为类似的元件，附图不构成比例限制，并且其中：
图1是本公开实施例提供的发光模组的结构示意图；
图2A、图2B、图2C是本公开实施例提供的像素光隔离结构的结构示意图；
图3A、图3B、图3C、图3D、图3E是本公开实施例提供的像素光隔离结构的另一结构示意图；
图4A、图4B、图4C、图4D是本公开实施例提供的像素光隔离结构的另一结构示意图；
图5A、图5B、图5C、图5D、图5E、图5F、图5G、图5H、图5I、图5J、图5K、图5L、图5M、图5N是本公开实施例提供的像素光隔离结构的另一结构示意图；
图6是本公开实施例提供的像素光隔离主体的结构示意图；
图7是本公开实施例提供的像素光隔离主体的另一结构示意图；
图8是本公开实施例提供的像素光隔离结构的另一结构示意图；
图9A、图9B、图9C是本公开实施例提供的像素光隔离结构的另一结构示意图；
图10A、图10B、图10C、图10D、图10E是本公开实施例提供的像素光隔离结构的另一结构示意图；
图11A、图11B、图11C、图11D、图11E是本公开实施例提供的像素光隔离结构的另一结构示意图；
图12A、图12B、图12C、图12D是本公开实施例提供的光隔离材料的结构示意图；
图13A、图13B、图13C、图13D、图13E、图13F、图13G、图13H是本公开实施例提供的发光模组的另一结构示意图；
图14是本公开实施例提供的发光模组的另一结构示意图；
图15是本公开实施例提供的发光模组的另一结构示意图；
图16是本公开实施例提供的发光单元层的结构示意图；
图17是本公开实施例提供的显示模组的结构示意图；
图18是本公开实施例提供的显示屏的结构示意图；
图19是本公开实施例提供的显示器的结构示意图。
附图标记：
100：发光模组；110：发光单元层；111：发光单元；410：光转换层；411：像素单元；500：像素光隔离结构；501：像素光隔离主体；502：光隔离材料；5021：光吸收材料；5022：光反射材料；503：间隔结构；510：像素间隔区域；520：第一像素单元；521：第一面；530：第二像素单元；531：第二面；533：透光区域；534：透光区域；D：下底边；E：入光侧；P：平面方向；S：出光面；Y：入光方向；700：显示模组；800：显示屏；900：显示器。
具体实施方式
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非用来限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。
参见图1，本公开实施例提供了一种发光模组100，包括：
光转换层410，包括多个像素单元411；
其中，在多个像素单元411的部分或全部中，相邻的两个像素单元411之间设置有像素光隔离结构500。
这样，像素光隔离结构500能够尽量避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：相邻的两个像素单元411发出的光向彼此传导)，有利于改善显示效果。
在一些实施例中，光转换层410可以通过波长选择等方式实现光的颜色转换，例如：光转换层410中所包括的多个像素单元411中至少之一对来自发光单元层的光进行颜色转换。
参见图2A、图2B、图2C，在一些实施例中，像素光隔离结构500可以设置于相邻的两个像素单元411之间的部分或全部区域。
在一些实施例中，如图2A中所示，像素光隔离结构500设置于相邻的两个像素单元 411之间的部分区域，该部分区域位于相邻的两个像素单元411之间且靠近其中的一个像素单元411(位于图中左侧的像素单元411)。
在一些实施例中，如图2B中所示，像素光隔离结构500设置于相邻的两个像素单元411之间的部分区域，该部分区域位于相邻的两个像素单元411之间，且与像素光隔离结构500在图2A中所处的位置相对(靠近位于图中右侧的像素单元411)。
在一些实施例中，如图2C中所示，像素光隔离结构500设置于相邻的两个像素单元411之间的全部区域。
在一些实施例中，可以根据工艺需求等实际情况确定在相邻的两个像素单元411之间设置像素光隔离结构500的区域，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：相邻的两个像素单元411发出的光向彼此传导)即可。
参见图3A、图3B、图3C、图3D、图3E，在一些实施例中，相邻的两个像素单元411之间可以存在像素间隔区域510，像素间隔区域510的部分或全部中可以设置有像素光隔离结构500。
在一些实施例中，如图3A中所示，可以将具有直角四边形形状的像素间隔区域510作为相邻的两个像素单元411之间的像素间隔区域；该像素间隔区域510可以平顺地连接相邻的两个像素单元411，以使相邻的两个像素单元411与像素间隔区域510所共同形成的投影可以构成如图3A中所示的直角四边形等规则形状。
在一些实施例中，相邻的两个像素单元411之间的像素间隔区域510可能不具有如图3A中所示的像素间隔区域510的形状，而是具有圆形、椭圆形、三角形、梯形等其他形状。可选地，在相邻的两个像素单元411之间的像素间隔区域510具有圆形、椭圆形、三角形、梯形等其他形状的情况下，该像素间隔区域510也有可能平顺地连接相邻的两个像素单元411，以使相邻的两个像素单元411与像素间隔区域510所共同形成的投影可以构成如图3A中所示的直角四边形等规则形状。
在一些实施例中，可以根据工艺需求等实际情况确定相邻的两个像素单元411之间的像素间隔区域510的位置、形状、尺寸等。可选地，无论相邻的两个像素单元411之间的像素间隔区域510的形状如何，为了方便描述，也可以以图3B中虚线所示的具有近似椭圆形的像素间隔区域510作为相邻的两个像素单元411之间的像素间隔区域。
在一些实施例中，如图3C中所示，像素光隔离结构500设置于相邻的两个像素单元411之间的像素间隔区域510中的部分区域，该部分区域位于相邻的两个像素单元411之间且靠近其中的一个像素单元411(位于图中左侧的像素单元411)。
在一些实施例中，如图3D中所示，像素光隔离结构500设置于相邻的两个像素单元411之间的像素间隔区域510中的部分区域，该部分区域位于相邻的两个像素单元411之间，且与像素光隔离结构500在图3C中所处的位置相对(靠近位于图中右侧的像素单元411)。
在一些实施例中，如图3E中所示，像素光隔离结构500设置于相邻的两个像素单元411之间的像素间隔区域510中的全部区域。
在一些实施例中，可以根据工艺需求等实际情况确定在相邻的两个像素单元411之间的像素间隔区域510中设置像素光隔离结构500的位置，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：相邻的两个像素单元411发出的光向彼此传导)即可。
参见图4A、图4B、图4C、图4D，在一些实施例中，相邻的两个像素单元411可以包括第一像素单元520、第二像素单元530，第一像素单元520可以包括靠近第二像素单元530的第一面521，第二像素单元530可以包括靠近第一像素单元520的第二面531。可选地，像素光隔离结构500可以设置于第一面521、第二面531中至少之一，或不与第一面521、第二面531接触。
在一些实施例中，如图4A中所示，像素光隔离结构500设置于第一像素单元520的第一面521，与第一像素单元520的第一面521接触，不与第二像素单元530的第二面531接触。
在一些实施例中，如图4B中所示，像素光隔离结构500设置于第二像素单元530的第二面531，与第二像素单元530的第二面531接触，不与第一像素单元520的第一面521接触。
在一些实施例中，如图4C中所示，像素光隔离结构500设置于第一像素单元520的第一面521、以及第二像素单元530的第二面531，与第一像素单元520的第一面521接触，与第二像素单元530的第二面531接触。
在一些实施例中，如图4D中所示，像素光隔离结构500设置于第一像素单元520的第一面521与第二像素单元530的第二面531之间，不与第一像素单元520的第一面521接触，不与第二像素单元530的第二面531接触。
在一些实施例中，可以根据工艺需求等实际情况确定像素光隔离结构500与第一像素单元520、第二像素单元530之间的设置关系，只要像素光隔离结构500能够避免第一像素单元520、第二像素单元530发出的光向不希望的方向传导(例如：第一像素单元520、第二像素单元530发出的光向彼此传导)即可。
参见图5A、图5B、图5C、图5D、图5E、图5F、图5G、图5H、图5I、图5J、图5K、图5L、图5M、图5N，在一些实施例中，像素光隔离结构500可以设置于第一面521、第二面531中至少之一的透光区域534。
在一些实施例中，如图5A、图5B、图5C、图5D、图5E、图5F、图5G、图5H、图5I、图5J、图5K、图5L、图5M、图5N中所示，箭头图形示例性地表示像素单元411的一部分光向外传导的走向。可选地，为方便识别，将透光区域533、534用虚线包围。
在一些实施例中，如图5A中所示，第一像素单元520的第一面521的透光区域533包括第一面521的全部区域。在这种情况下，像素光隔离结构500可以设置于第一面521的全部区域，并与第一面521的全部区域接触，以使得像素光隔离结构500可以设置于第一面521的透光区域533。
在一些实施例中，如图5B、图5C中所示，第一像素单元520的第一面521的透光区域533包括第一面521的部分区域。在这种情况下，像素光隔离结构500可以设置于第一面521的相应部分区域，并与第一面521的相应部分区域接触，以使得像素光隔离结构500可以设置于第一面521的透光区域533。
在一些实施例中，如图5D中所示，第二像素单元530的第二面531的透光区域534包括第二面531的全部区域。在这种情况下，像素光隔离结构500可以设置于第二面531的全部区域，并与第二面531的全部区域接触，以使得像素光隔离结构500可以设置于第二面531的透光区域534。
在一些实施例中，如图5E、图5F中所示，第二像素单元530的第二面531的透光区域534包括第二面531的部分区域。在这种情况下，像素光隔离结构500可以设置于第二面531的相应部分区域，并与第二面531的相应部分区域接触，以使得像素光隔离结构500可以设置于第二面531的透光区域534。
在一些实施例中，如图5G中所示，第一像素单元520的第一面521的透光区域533包括第一面521的全部区域，第二像素单元530的第二面531的透光区域534包括第二面531的全部区域。在这种情况下，像素光隔离结构500可以设置于第一面521的全部区域、以及第二面531的全部区域，并与第一面521的全部区域、以及第二面531的全部区域接触，以使得像素光隔离结构500可以设置于第一面521的透光区域533、以及第二面531的透光区域534。
在一些实施例中，如图5H、图5I中所示，第一像素单元520的第一面521的透光区域533包括第一面521的部分区域，第二像素单元530的第二面531的透光区域534包括第二面531的部分区域，第一面521的透光区域533与第二面531的透光区域534相一致 (例如：位置、形状、面积等中的至少之一相同)。在这种情况下，像素光隔离结构500可以设置于第一面521与第二面531的相应部分区域，并与第一面521的相应部分区域、以及第二面531的相应部分区域接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534。
在一些实施例中，如图5J中所示，第一像素单元520的第一面521的透光区域533包括第一面521的部分区域，第二像素单元530的第二面531的透光区域534包括第二面531的部分区域，第一面521的透光区域533与第二面531的透光区域534不一致(例如：位置、形状、面积等中的至少之一不相同)。在这种情况下，像素光隔离结构500可以设置于第一面521与第二面531的相应部分区域，并与第一面521的相应部分区域、以及第二面531的相应部分区域接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534。
在一些实施例中，第一像素单元520的第一面521的透光区域533可以包括第一面521的全部区域，第二像素单元530的第二面531的透光区域534可以包括第二面531的部分区域。在这种情况下，像素光隔离结构500可以设置于第一面521的全部区域、以及第二面531的部分区域，并与第一面521的全部区域、以及第二面531的该部分区域接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534。可选地，第一像素单元520的第一面521的透光区域533可以包括第一面521的部分区域，第二像素单元530的第二面531的透光区域534可以包括第二面531的全部区域。在这种情况下，像素光隔离结构500可以设置于第一面521的该部分区域、以及第二面531的全部区域，并与第一面521的该部分区域、以及第二面531的全部区域接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534。
在一些实施例中，如图5K中所示，第一像素单元520的第一面521的透光区域533包括第一面521的全部区域、以及第二面531的全部区域。在这种情况下，像素光隔离结构500可以设置于第一面521的全部区域、以及第二面531的全部区域之间，并不与第一面521、以及第二面531接触，以使得像素光隔离结构500可以设置于第一面521的透光区域533与第二面531的透光区域534之间。
在一些实施例中，如图5L、图5M中所示，第一像素单元520的第一面521的透光区域533包括第一面521的部分区域，第二像素单元530的第二面531的透光区域534包括第二面531的部分区域，第一面521的透光区域533与第二面531的透光区域534相一致(例如：位置、形状、面积等中的至少之一相同)。在这种情况下，像素光隔离结构500可以设置于第一面521与第二面531的相应部分区域之间，并不与第一面521、以及第二面 531接触，以使得像素光隔离结构500可以设置于第一面521的透光区域533与第二面531的透光区域534之间。
在一些实施例中，如图5N中所示，第一像素单元520的第一面521的透光区域533包括第一面521的部分区域，第二像素单元530的第二面531的透光区域534包括第二面531的部分区域，第一面521的透光区域533与第二面531的透光区域534不一致(例如：位置、形状、面积等中的至少之一不相同)。在这种情况下，像素光隔离结构500可以设置于第一面521的相应部分区域、以及第二面531的相应部分区域之间，并不与第一面521、以及第二面531接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534之间。
在一些实施例中，第一像素单元520的第一面521的透光区域533可以包括第一面521的全部区域，第二像素单元530的第二面531的透光区域534可以包括第二面531的部分区域。在这种情况下，像素光隔离结构500可以设置于第一面521的全部区域、以及第二面531的部分区域之间，并不与第一面521、以及第二面531接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534之间。可选地，第一像素单元520的第一面521的透光区域533可以包括第一面521的部分区域，第二像素单元530的第二面531的透光区域534可以包括第二面531的全部区域。在这种情况下，像素光隔离结构500可以设置于第一面521的该部分区域、以及第二面531的全部区域之间，并不与第一面521、以及第二面531接触，以使得像素光隔离结构500可以设置于第一面521、以及第二面531的透光区域534之间。
在一些实施例中，像素单元411的透光区域533、534可以为连续区域。在这种情况下，像素光隔离结构500可以设置于该连续区域，并与该连续区域接触或不接触，以使得像素光隔离结构500可以设置于像素单元411的透光区域533、534。可选地，像素单元411的透光区域533、534可以为非连续区域。在这种情况下，像素光隔离结构500可以设置于该非连续区域，并与该非连续区域接触或不接触，以使得像素光隔离结构500可以设置于像素单元411的透光区域533、534。可选地，可以根据工艺需求等实际透光情况确定用于设置像素光隔离结构500的非连续区域的位置、数量等，以使得像素光隔离结构500可以设置于以非连续区域呈现的像素单元411的透光区域533、534。
在一些实施例中，可以根据工艺需求等实际透光情况确定像素单元411的透光区域533、534，据此考虑将像素光隔离结构500设置于像素单元411的透光区域533、534，或相邻的两个像素单元411的相应透光区域533、534之间。可选地，该透光区域533、534可以包括像素单元411的部分或全部区域，可以以连续区域或非连续区域的形式呈现，并且可 以根据工艺需求等实际透光情况确定相应的位置、数量等，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：第一像素单元520、第二像素单元530发出的光向彼此传导)即可。
在一些实施例中，参见图1、图2A、图2B、图2C、图3C、图3D、图3E、图4A、图4B、图4C、图4D、图5A、图5B、图5C、图5D、图5E、图5F、图5G、图5H、图5I、图5J、图5K、图5L、图5M、图5N中的相应示例性结构，像素光隔离结构500中的部分或全部可以为单一整体封闭结构，例如：在发光模组100的纵向截面上，像素光隔离结构500中的部分或全部可以为单一整体封闭结构。可选地，像素光隔离结构500中的部分或全部可以是完整的单一整体，不包括以拼接等方式形成的分体式结构。可选地，像素光隔离结构500中的部分或全部的表面(或可称为外轮廓)可以是封闭的，不具有开口，使得相应的像素光隔离结构500形成为封闭结构。
在一些实施例中，作为单一整体封闭结构的像素光隔离结构500中的部分或全部可以为实心结构，或空心结构。
在一些实施例中，像素光隔离结构500中的部分或全部可以不同于上述的完整的单一整体，而是包括以拼接等方式形成的分体式结构。可选地，像素光隔离结构500中的部分或全部的表面(或可称为外轮廓)可以是非封闭的，具有开口，使得像素光隔离结构500形成为非封闭结构(或可称为开放结构)。
在一些实施例中，可以根据工艺需求等实际情况将像素光隔离结构500中的部分或全部设置为单一整体封闭结构或非封闭结构，或根据工艺需求等实际情况将像素光隔离结构500中的部分或全部设置为实心结构，或空心结构，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：第一像素单元520、第二像素单元530发出的光向彼此传导)即可。
参见图6，在一些实施例中，像素光隔离结构500可以包括像素光隔离主体501。
参见图7，在一些实施例中，像素光隔离主体501可以包含光隔离材料502。
参见图8，在一些实施例中，像素光隔离结构500还可以包括：间隔结构503，设置于像素光隔离主体501和需要进行光隔离的像素单元411之间。
参见图9A、图9B、图9C，在一些实施例中，间隔结构503可以设置于像素光隔离主体501，和相邻的两个像素单元411中至少之一之间。
在一些实施例中，如图9A中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，间隔结构503设置于像素光隔离主体501和第一像素单元520之间。
在一些实施例中，如图9B中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，间隔结构503设置于像素光隔离主体501和第二像素单元530之间。
在一些实施例中，如图9C中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，像素光隔离主体501和第一像素单元520之间设置有间隔结构503，像素光隔离主体501和第二像素单元530之间也设置有间隔结构503。
在一些实施例中，可以根据工艺需求等实际情况考虑间隔结构503的设置位置，只要能够将像素光隔离主体501与相邻的像素单元411相间隔即可。
参见图10A、图10B、图10C、图10D、图10E，在一些实施例中，间隔结构503可以覆盖像素光隔离主体501的部分或全部。
在一些实施例中，如图10A、图10B、图10C、图10D中所示，间隔结构503可以覆盖像素光隔离主体501的部分，例如：像素光隔离主体501的一侧、两侧、三侧或更多侧。
在一些实施例中，如图10E中所示，间隔结构503可以覆盖像素光隔离主体501的全部。
在一些实施例中，可以根据工艺需求等实际情况考虑间隔结构503的设置方式(例如：覆盖像素光隔离主体501的部分或全部)，只要能够将像素光隔离主体501与相邻的像素单元411相间隔即可。
参见图11A、图11B、图11C、图11D、图11E，在一些实施例中，间隔结构503可以与相邻的两个像素单元411中至少之一接触。可选地，间隔结构503可以不与相邻的两个像素单元411接触。
在一些实施例中，如图11A中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，间隔结构503与第一像素单元520接触，不与第二像素单元530接触。
在一些实施例中，如图11B中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，间隔结构503与第二像素单元530接触，不与第一像素单元520接触。
在一些实施例中，如图11C中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，作为单一整体的间隔结构503与第一像素单元520、第二像素单元530均接触。
在一些实施例中，如图11D中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，相对独立的两个间隔结构503中，一个间隔结构503与 第一像素单元520接触、不与第二像素单元530接触，另一个间隔结构503与第二像素单元530接触、不与第一像素单元520接触。
在一些实施例中，如图11E中所示，在相邻的两个像素单元411包括第一像素单元520、第二像素单元530的情况下，间隔结构503与第一像素单元520、第二像素单元530均不接触。
在一些实施例中，可以根据工艺需求等实际情况考虑间隔结构503的设置方式(例如：与相邻的两个像素单元411中至少之一接触)，只要能够将像素光隔离主体501与相邻的像素单元411相间隔即可。
在一些实施例中，像素光隔离主体501和间隔结构503中至少之一可以包含光隔离材料502。
参见图12A、图12B、图12C、图12D，在一些实施例中，光隔离材料502可以包括光吸收材料5021、光反射材料5022中至少之一。
在一些实施例中，如图12A中所示，光隔离材料502可以包括光吸收材料5021。
在一些实施例中，如图12B中所示，光隔离材料502可以包括光反射材料5022。
在一些实施例中，如图12C、图12D中所示，光隔离材料502可以包括光吸收材料5021和光反射材料5022。
在一些实施例中，可以根据工艺需求等实际情况考虑光隔离材料502的设置，只要光隔离材料502能够有效实现光隔离即可。可选地，在光隔离材料502中包含光吸收材料5021和光反射材料5022的情况下，可以根据工艺需求等实际情况考虑所设置的光吸收材料5021和光反射材料5022的位置、比例等。
参见图13A、图13B、图13C、图13D、图13E、图13F、图13G、图13H，在一些实施例中，像素光隔离结构500沿光转换层410的入光方向Y的截面形状中的部分或全部形状可以包括直角四边形、三角形、梯形中至少之一。
在一些实施例中，如图13A中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状为直角四边形。
在一些实施例中，如图13B中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状包括两个直角四边形，且两个直角四边形在光转换层410的平面方向P上的宽度不相同。可选地，在光转换层410的平面方向P上的宽度相对较大的直角四边形可以靠近光转换层410的入光侧E，在光转换层410的平面方向P上的宽度相对较小的直角四边形可以远离光转换层410的入光侧E。可选地，两个直角四边形的相对位置关系也可以与图中所示的相反，例如：在光转换层410的平面方向P上的宽度相对较小的直角四边形 可以靠近光转换层410的入光侧E，在光转换层410的平面方向P上的宽度相对较大的直角四边形可以远离光转换层410的入光侧E。
在一些实施例中，如图13C中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状为三角形。可选地，三角形的一条边可以靠近光转换层410的入光侧E。可选地，三角形的一条边可以远离光转换层410的入光侧E。
在一些实施例中，如图13D中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状包括直角四边形和三角形。可选地，直角四边形可以靠近光转换层410的入光侧E，三角形可以远离光转换层410的入光侧E。可选地，直角四边形和三角形的相对位置关系也可以与图中所示的相反，例如：三角形可以靠近光转换层410的入光侧E，直角四边形可以远离光转换层410的入光侧E。可选地，三角形的一条边可以朝向光转换层410的入光侧E，或背向光转换层410的入光侧E。
在一些实施例中，如图13E中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状为梯形。可选地，梯形的下底边D可以朝向光转换层410的入光侧E。可选地，梯形的下底边D可以背向光转换层410的入光侧E。
在一些实施例中，如图13F中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状包括梯形和直角四边形。可选地，直角四边形可以远离光转换层410的入光侧E，梯形可以靠近光转换层410的入光侧E。可选地，梯形的下底边D可以朝向光转换层410的入光侧E，或背向光转换层410的入光侧E。
在一些实施例中，如图13G中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状包括梯形和直角四边形。可选地，直角四边形可以靠近光转换层410的入光侧E，梯形可以远离光转换层410的入光侧E。可选地，梯形的下底边D可以朝向光转换层410的入光侧E，或背向光转换层410的入光侧E。
在一些实施例中，如图13H中所示，像素光隔离结构500沿光转换层410的入光方向Y的截面形状包括梯形和三角形。可选地，梯形可以靠近光转换层410的入光侧E，三角形可以远离光转换层410的入光侧E。可选地，梯形和三角形的相对位置关系也可以与图中所示的相反，例如：梯形可以远离光转换层410的入光侧E，三角形可以靠近光转换层410的入光侧E。可选地，梯形的下底边D可以朝向光转换层410的入光侧E，或背向光转换层410的入光侧E。可选地，三角形的一条边可以朝向光转换层410的入光侧E，或背向光转换层410的入光侧E。
在一些实施例中，可以根据工艺需求等实际情况考虑像素光隔离结构500沿光转换层410的入光方向Y的截面形状，只要像素光隔离结构500能够避免相邻的两个像素单元411 发出的光向不希望的方向传导(例如：相邻的两个像素单元411发出的光向彼此传导)即可。
在一些实施例中，像素光隔离结构500可以包括能够实现光隔离的结构及材质，例如：银、铝等金属中的至少一种。可选地，可以根据工艺需求等实际情况确定像素光隔离结构500的结构及材质，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：相邻的两个像素单元411发出的光向彼此传导)即可。
在一些实施例中，像素光隔离结构500也可以包括其他的能够起到光吸收、光反射等作用的结构及材质，例如：树脂组合物、钛的氧化物(例如：TiO2)等。可选地，实现光吸收的材质也可以包括黑矩阵(BM)。可选地，可以根据工艺需求等实际情况确定像素光隔离结构500的结构及材质，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：相邻的两个像素单元411发出的光向彼此传导)即可。
在一些实施例中，多个像素单元411，可以包括：像素、子像素中至少之一。
在一些实施例中，多个像素单元411可以包括至少一个像素。可选地，多个像素单元411可以包括至少一个子像素。可选地，多个像素单元411可以包括至少一个像素、以及至少一个子像素。
在一些实施例中，可以根据工艺需求等实际情况对像素单元411进行设置，使多个像素单元411包括像素、子像素中至少之一。可选地，无论是否包括像素、子像素，像素单元411中可以包括像素、子像素以外的其它显示(例如：光转换)结构。
在一些实施例中，多个像素单元411中的至少两个像素单元411，可以包含相同或不同的光转换材料。可选地，光转换材料中的主要或全部成分可以包括荧光粉、量子点等材料中至少之一。
参见图14，在一些实施例中，发光模组100还可以包括：发光单元层110。可选地，光转换层410可以设置于发光单元层110。
在一些实施例中，像素光隔离结构500中的部分或全部可以和发光单元层110直接接触，或存在间隙；例如：像素光隔离结构500中的全部和发光单元层110直接接触，或，像素光隔离结构500中的部分和发光单元层110直接接触，另一部分和发光单元层110之间存在间隙，或，像素光隔离结构500中的全部和发光单元层110之间存在间隙。可选地，像素光隔离结构500和发光单元层110之间的间隙处，可以部分或全部设置有光隔离材料。
在一些实施例中，可以根据工艺需求等实际情况考虑像素光隔离结构500是否和发光单元层100直接接触，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的 光向不希望的方向传导(例如：第一像素单元520、第二像素单元530发出的光向彼此传导)即可。
参见图15，在一些实施例中，光转换层410可以设置于发光单元层110的出光面S。可选地，来自发光单元层110的光可以经由光转换层410的入光侧E射入光转换层410。
参见图16，在一些实施例中，发光单元层110可以包括多个发光单元111。
在一些实施例中，多个发光单元111中的部分或全部可以是未封装结构。
在一些实施例中，多个发光单元111中的部分可以是未封装结构。可选地，多个发光单元111中的一个、两个、三个或更多可以仅仅是完成设置的能够发光的发光单元，未经过封装处理，未形成将发光单元封装起来的封装层等封装结构，例如：多个发光单元111中的至少一个可以是基于外延生长等方式形成的包括第一半导体层、有源层、第二半导体层(或者，还可以包括电极)的发光单元，但未经过封装处理，未形成将包括第一半导体层、有源层、第二半导体层(或者，还可以包括电极)的发光单元封装起来的封装层等封装结构。
在一些实施例中，多个发光单元111中的全部可以是未封装结构。可选地，多个发光单元111中的全部可以仅仅是完成设置的能够发光的发光单元，未经过封装处理，未形成将发光单元封装起来的封装层等封装结构，例如：多个发光单元111中的全部可以是基于外延生长等方式形成的包括第一半导体层、有源层、第二半导体层(或者，还可以包括电极)的发光单元，但未经过封装处理，未形成将包括第一半导体层、有源层、第二半导体层(或者，还可以包括电极)的发光单元封装起来的封装层等封装结构。
在一些实施例中，多个发光单元111中的部分或全部可以是封装结构。可选地，多个发光单元111中的一个、两个、三个或更多可以不仅仅是完成设置的能够发光的发光单元，而且还可以经过封装处理形成了将发光单元封装起来的封装层等封装结构，例如：多个发光单元111中的至少一个可以是基于外延生长等方式形成的包括第一半导体层、有源层、第二半导体层(或者，还可以包括电极)的发光单元，而且经过封装处理，形成了将包括第一半导体层、有源层、第二半导体层(或者，还可以包括电极)的发光单元封装起来的封装层等封装结构。
在多个发光单元111中的部分或全部是封装结构的情况下，可以将封装有一个或一个以上的发光单元111的封装结构整体看做一个发光单元111，例如：一个封装结构中包括一个发光单元111，可以将包括该一个发光单元111的该封装结构看做一个发光单元111；再例如：一个封装结构中包括三个发光单元111，可以将包括该三个发光单元111的该封装结构看做一个发光单元111。
在一些实施例中，可以根据工艺需求等实际情况将多个发光单元111中的部分或全部设置为未封装结构，或根据工艺需求等实际情况将多个发光单元111中的部分或全部设置为封装结构，只要像素光隔离结构500能够避免相邻的两个像素单元411发出的光向不希望的方向传导(例如：第一像素单元520、第二像素单元530发出的光向彼此传导)即可。
在一些实施例中，多个发光单元111可以包括：LED、Mini LED、Micro LED中至少之一。可选地，多个发光单元111可以包括至少一个LED。可选地，多个发光单元111可以包括至少一个Mini LED。可选地，多个发光单元111可以包括至少一个Micro LED。可选地，多个发光单元111可以包括至少一个LED、以及至少一个Mini LED。可选地，多个发光单元111可以包括至少一个LED、以及至少一个Micro LED。可选地，多个发光单元111可以包括至少一个Mini LED、以及至少一个Micro LED。可选地，多个发光单元111可以包括至少一个LED、至少一个Mini LED、以及至少一个Micro LED。可选地，多个发光单元111可以包括除了LED、Mini LED、Micro LED以外的其他发光器件。
在一些实施例中，可以根据工艺需求等实际情况确定发光单元111的器件类型，例如：LED、Mini LED、Micro LED或其他发光器件。
参见图17，本公开实施例提供的显示模组700，包括上述的发光模组100。在一些实施例中，显示模组700可以支持3D显示。
参见图18，本公开实施例提供的显示屏800，包括上述的显示模组700。在一些实施例中，显示屏800可以进行3D显示。
参见图19，本公开实施例提供的显示器900，包括上述的显示屏800。在一些实施例中，显示器900可以进行3D显示。在一些实施例中，显示器900还可以包括用于支持显示器900正常运转的其他构件，例如：通信接口、框架、控制电路等构件中的至少之一。
本公开实施例提供的发光模组、显示模组、显示屏及显示器，通过在光转换层中的多个像素单元的部分或全部中相邻的两个像素单元之间设置像素光隔离结构，尽量避免光转换层发出的光向不希望的方向传导，有利于改善显示效果，还具有提高光利用率的可能。
以上描述和附图充分地示出了本公开的实施例，以使本领域技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。当用于本申请中时，虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件，但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如，在不改变 描述的含义的情况下，第一元件可以叫做第二元件，并且同样地，第二元件可以叫做第一元件，只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件，但可以不是相同的元件。而且，本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的，除非上下文清楚地表明，否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地，如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外，当用于本申请中时，术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素，和/或组件的存在，但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下，由语句“包括一个…”限定的要素，并不排除在包括该要素的过程、方法或者设备中还存在另外的相同要素。本文中，每个实施例重点说明的可以是与其他实施例的不同之处，各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言，如果其与实施例公开的方法部分相对应，那么相关之处可以参见方法部分的描述。
本领域技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，可以取决于技术方案的特定应用和设计约束条件。本领域技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能，但是这种实现不应认为超出本公开实施例的范围。本领域技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
本文所披露的实施例中，所揭露的方法、产品(包括但不限于装置、设备等)，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，单元的划分，可以仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外，在本公开实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。

Claims (26)

  1. 一种发光模组，包括：
    光转换层，包括多个像素单元；
    其中，在所述多个像素单元的部分或全部中，相邻的两个像素单元之间设置有像素光隔离结构。
  2. 根据权利要求1所述的发光模组，其中，所述像素光隔离结构设置于相邻的所述两个像素单元之间的部分或全部区域。
  3. 根据权利要求2所述的发光模组，其中，相邻的所述两个像素单元之间存在像素间隔区域，所述像素间隔区域的部分或全部中设置有所述像素光隔离结构。
  4. 根据权利要求3所述的发光模组，其中，相邻的所述两个像素单元包括第一像素单元、第二像素单元，所述第一像素单元包括靠近所述第二像素单元的第一面，所述第二像素单元包括靠近所述第一像素单元的第二面；
    其中，所述像素光隔离结构设置于所述第一面、第二面中至少之一，或不与所述第一面、第二面接触。
  5. 根据权利要求4所述的发光模组，其中，所述像素光隔离结构设置于所述第一面、第二面中至少之一的透光区域。
  6. 根据权利要求1所述的发光模组，其中，所述像素光隔离结构为单一整体封闭结构。
  7. 根据权利要求1至6任一项所述的发光模组，其中，所述像素光隔离结构包括像素光隔离主体。
  8. 根据权利要求7所述的发光模组，其中，所述像素光隔离主体包含光隔离材料。
  9. 根据权利要求7所述的发光模组，其中，所述像素光隔离结构还包括：间隔结构，设置于所述像素光隔离主体和需要进行光隔离的像素单元之间。
  10. 根据权利要求9所述的发光模组，其中，所述间隔结构设置于所述像素光隔离主体，和相邻的所述两个像素单元中至少之一之间。
  11. 根据权利要求10所述的发光模组，其中，所述间隔结构覆盖所述像素光隔离主体的部分或全部。
  12. 根据权利要求9所述的发光模组，其中，所述像素光隔离主体和所述间隔结构中至少之一包含光隔离材料。
  13. 根据权利要求8或12所述的发光模组，其中，所述光隔离材料包括光吸收材料、光反射材料中至少之一。
  14. 根据权利要求1所述的发光模组，其中，所述像素光隔离结构沿所述光转换层的入光方向的截面形状中的部分或全部形状包括直角四边形、三角形、梯形中至少之一。
  15. 根据权利要求14所述的发光模组，其中，所述像素光隔离结构沿所述光转换层的入光方向的截面形状包括梯形，所述梯形的下底边朝向所述光转换层的入光侧。
  16. 根据权利要求1所述的发光模组，其中，所述多个像素单元，包括：
    像素、子像素中至少之一。
  17. 根据权利要求16所述的发光模组，其中，所述多个像素单元中的至少两个像素单元，包含相同或不同的光转换材料。
  18. 根据权利要求1至17任一项所述的发光模组，还包括：发光单元层；
    其中，所述光转换层设置于所述发光单元层。
  19. 根据权利要求18所述的发光模组，其中，所述像素光隔离结构和所述发光单元层直接接触。
  20. 根据权利要求18所述的发光模组，其中，所述光转换层设置于所述发光单元层的出光面。
  21. 根据权利要求18所述的发光模组，其中，所述发光单元层包括多个发光单元。
  22. 根据权利要求21所述的发光模组，其中，所述多个发光单元中的部分或全部是未封装结构。
  23. 根据权利要求21所述的发光模组，其中，所述多个发光单元，包括：
    发光二极管LED、迷你Mini LED、微Micro LED中至少之一。
  24. 一种显示模组，包括如权利要求1至23任一项所述的发光模组。
  25. 一种显示屏，包括如权利要求24所述的显示模组。
  26. 一种显示器，包括如权利要求25所述的显示屏。
PCT/CN2021/090613 2020-05-22 2021-04-28 发光模组、显示模组、显示屏及显示器 Ceased WO2021233100A1 (zh)

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