WO2021233128A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2021233128A1
WO2021233128A1 PCT/CN2021/091930 CN2021091930W WO2021233128A1 WO 2021233128 A1 WO2021233128 A1 WO 2021233128A1 CN 2021091930 W CN2021091930 W CN 2021091930W WO 2021233128 A1 WO2021233128 A1 WO 2021233128A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
electronic device
metal
metal structure
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/091930
Other languages
English (en)
French (fr)
Inventor
储嘉慧
陈鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP21807762.6A priority Critical patent/EP4138216A4/en
Priority to US17/926,950 priority patent/US20230198125A1/en
Publication of WO2021233128A1 publication Critical patent/WO2021233128A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • This application relates to the field of communication technology, and in particular to an electronic device with an antenna.
  • the present application provides an electronic device that can change the adverse effect of the induced current on the internal metal structure of the antenna on the magnetic field of the antenna, thereby effectively improving the working performance of the antenna.
  • the electronic device described in the present application includes a housing, an antenna housed in the housing, and a metal structure.
  • the metal structure, at least part of the antenna and part of the housing are arranged in sequence; the antenna is attached to the The metal structure, or the insulating medium between the metal structure and the antenna; the insulating medium can be air, that is, the antenna can be regarded as a suspended structure relative to the metal structure, and the insulating medium can also be a non-metal structure, which is understandable
  • no other metal parts are included between the antenna and the metal structure;
  • the metal structure is provided with a non-closed slot, and in the first direction, the slot penetrates the metal structure;
  • the metal structure It includes a first surface facing the antenna in the first direction, a vertical projection of the antenna on the first surface is an antenna projection area, and the slot extends from the edge of the first surface to the The inside of the first surface extends and passes through the antenna projection area.
  • an induced current in the same direction as the current on the antenna is formed on the first surface.
  • Slotting through the metal structure in the first direction can be understood as providing a through groove on the metal structure, and the through groove is a form of penetrating the metal structure in the first direction, that is, in the first direction, part of the metal structure is cut, In order to change the current distribution on the metal structure under the working state of the antenna.
  • the slot extends from the edge of the first surface to the inside of the first surface and passes through the antenna projection area
  • the slot intersects the antenna projection area, and the The slot forms an opening at the edge of the first surface, and one end of the slot away from the opening is located on the side of the antenna projection area away from the opening, that is, there are two opposite sides of the antenna projection area. Part of the slotting. It can also be understood that the antenna crosses or crosses at least a part of the slot.
  • the first surface may be any outer surface on the metal structure.
  • the position of the first surface on the metal structure is not specifically limited here, but mainly the first surface
  • the relative positional relationship with the antenna will be described.
  • the first surface faces the housing, and the antenna is located between the first surface and the housing.
  • the antenna is located between the first surface and the housing.
  • the antenna when viewed in a direction perpendicular to the first surface, the antenna and the There is at least partial overlap between the metal structures. It is understandable that in the first direction, the metal structure, at least part of the antenna, and part of the housing are arranged in sequence. Under this structure, the first surface faces the first direction. antenna.
  • the slot penetrates the metal structure. It can be understood that if the slot is in the first direction Does not penetrate the metal structure. On the metal structure, where the slot does not penetrate, the flow direction of the induced current will not change, and it will still flow along the original direction. Describe the adverse effects of the antenna magnetic field.
  • the slot On the first surface, the slot extends from the edge of the first surface to the inside of the first surface. Under this structure, the edge of the slot is connected to the edge of the first surface Through, so that the slot is a non-closed slot. In the following, the description of the related positional relationship can all be understood in the same way.
  • the vertical projection of the antenna on the first surface is an antenna projection area
  • the slot extends from the edge of the first surface to the inside of the first surface and passes through the antenna projection area.
  • One of the induced current flow paths is: along the The part of the grooved edge outside the antenna projection area flows to the edge of the metal structure, and another induced current flow path is: flow along the part of the grooved edge located inside the antenna projection area. It is understandable that In the above two paths, the flow direction of the induced current is consistent with the flow direction of the current on the antenna. The induced current in the same direction as the current on the antenna is generated, thereby ensuring that the working performance of the antenna is not impaired and is enhanced to a certain extent.
  • the induced current when the antenna is in the working frequency band, an induced current will be generated on the metal structure.
  • the induced current has such a direction that the magnetic field of the induced current always obstructs The magnetic flux that causes the induced current changes. Therefore, the direction of the induced current generated on the metal structure close to the antenna is opposite to the direction of the current on the antenna, and the magnetic field of the induced current will cancel a part of the magnetic field of the antenna , This will inevitably weaken the working performance of the antenna to a certain extent.
  • the induced current passing through the slot will flow along the two paths described above due to the continuity of the current.
  • the direction of the induced current on the two paths It is consistent with the direction of the current on the antenna, so that the bad influence of the induced current on the antenna magnetic field can be reduced, and the working performance of the antenna can be effectively improved.
  • the antenna projection area forms an enclosed space, and part of the slot is located in the enclosed space.
  • the antenna is an enclosing structure, it can better meet the corresponding signal transmission function.
  • the vertical projection of the antenna on the first surface will inevitably form an enclosing space, which is located inside the antenna projection area Part of the slot is located in the enclosed space and does not extend beyond the enclosed space. It is understandable that when the part of the slot located inside the antenna extends beyond the enclosed space At this time, the induced current generated on other metals in the enclosed space cannot be cancelled, thereby weakening the working performance of the antenna. Therefore, in order to ensure the magnetic field generated by the induced current on the metal structure, the magnetic field of the antenna To have a better gain effect, the part of the slot located on the inner side of the antenna should be limited to the enclosed space.
  • the antenna can have various forms of enclosing structures, including but not limited to semi-enclosing structures or full enclosing structures, and its projection area on the first surface also has multiple forms of enclosing space. , Including but not limited to semi-enclosed space or full-enclosed space.
  • a part of the slot located in the enclosed space includes a connecting portion and an expansion portion, and the connecting portion extends between the inner edge of the antenna projection area and the expansion portion, and is perpendicular to the In the extending direction of the connecting portion, the size of the expansion portion is larger than the size of the connecting portion.
  • the expansion part since the expansion part has a larger size, the part of the slot in the enclosed space has a larger area, and the path of the induced current on the edge of the slot in this part is Longer, the magnetic field generated by the induced current is larger. From the above discussion, it can be seen that the direction of the induced current on the slot in the enclosed space is the same as the current on the antenna. Therefore, when this part When the magnetic field generated by the induced current is larger, it has a better gain effect on the magnetic field of the antenna, thereby further improving the working performance of the antenna.
  • the slot includes a first section, a third section, and a second section connected in sequence, and the first section is located between the antenna projection area and the edge of the first surface, so The third section is located in the antenna projection area, the second section is located in the enclosed space, the second section includes the connecting portion and the expansion portion, and the connecting portion is connected to the third section Between the expansion part and the expansion part, the first section, the third section and the connecting part are all linear and collinear.
  • the second section is part of the slot in the enclosed space in the above embodiment. Observed in the first direction, the first section is located outside the antenna projection area and connected to the edge of the first surface, and the second section is located in the antenna projection area.
  • the first section and the second section are connected through the third section, and the third section is located in the antenna projection area.
  • the induced current generated will inevitably flow along two paths, one of which is to flow along the edge of the first section.
  • another induced current flow path is to flow along the edge of the second section. It can be understood that the flow direction of the induced current is the same as the current flow direction on the antenna on the above two paths.
  • the second section is located in the enclosed space, the second section includes the connecting part and the expansion part, the connecting part is connected between the third section and the expansion part, and From the discussion of the above embodiment, it can be seen that in the extending direction perpendicular to the connecting portion, the size of the expansion portion is larger than the size of the connecting portion, and the expansion portion has a larger size, so that the Some of the slots have a larger area, thereby further improving the working performance of the antenna, and the specific principles will not be repeated.
  • the metal structure is not limited to a specific metal structure, and may also be a metal material area on any component. Due to the small internal space of the electronic device, the distance between the metal material area on any of the above-mentioned components and the antenna is small, and there is a partial overlap in the first direction.
  • the metal material area on the above-mentioned metal material area is Generate an induced current opposite to the direction of the current on the antenna, thereby affecting the working performance of the antenna, and arranging the slot on the above-mentioned metal material area can reduce the adverse effect of the induced current on the antenna , And change the direction of part of the induced current, so that the direction of the induced current on a part of the metal structure is the same as the direction of the current on the antenna, thereby enhancing the working performance of the antenna to a certain extent.
  • the electronic device further includes an electronic device, the electronic device cannot be slotted, and the metal structure is arranged between the antenna and the electronic device.
  • the slot is provided on the metal structure to form an induced current in the same direction as the current on the antenna, so as to reduce the influence of the electronic device on the antenna.
  • the electronic device may There will be some electronic devices that cannot be slotted, such as batteries. Slotting will destroy the function of the electronic device.
  • the metal material on the electronic device will also affect the performance of the antenna. In this case , The metal structure can be added between the electronic device and the antenna, and in the working frequency band of the antenna, the metal structure and the electronic device are electrically connected and isolated.
  • the Electrical connection isolation includes, but is not limited to, physical insulation isolation, and isolation of corresponding working frequency bands can also be performed by devices with filtering characteristics. If there is no electrical connection isolation here, after the metal structure and the electronic device are connected, a "ground" will be formed, and the slot on the metal structure is meaningless.
  • the metal structure is close to the antenna and at least partially overlapped in the first direction.
  • the metal structure is provided with a slave The non-closed groove body extending from the edge of the metal structure to the inside of the metal structure to form the groove.
  • the existence of the groove makes the induced current generated on the metal structure close to the antenna , When passing through the slot, it will flow through the edge of the slot and the edge of the metal structure respectively, and the direction of the induced current passing through the edge of the slot and the edge of the metal structure is the same as that of the The direction of the current on the antenna is the same, thereby effectively improving the working performance of the antenna, offsetting the adverse effect of the electronic device on the performance of the antenna, and there is no need to slot the electronic device, ensuring the electronic device The function of the device is normal.
  • the electronic device is provided with a main board, and the metal structure is a ground layer on the main board.
  • the ground layer on the main board is close to the antenna and at least partially overlapped in the first direction, and the ground layer on the main board Will generate an induced current opposite to the direction of the current on the antenna, that is, the ground layer is the metal structure in the electronic device described in this application, and the slot is provided on the ground layer. Effectively reduce the adverse effect of the induced current on the ground layer on the working performance of the antenna, wherein the direction of the induced current on the ground layer and the principle of action of the slot are the same as the directions and principles described in the above embodiment ,No longer.
  • the motherboard has a multilayer structure, and there are multiple ground layers, and multiple ground layers are arranged close to and at least partially overlapped with the antenna. All the ground layers are slotted, so that it can be ensured that the induced current on the ground layer will not have a great impact on the working performance of the antenna. At the same time, after the slotting process is performed on the motherboard, the necessary components can be placed in the non-slotted area on the motherboard, which can also meet the corresponding functional requirements without causing other functions of the electronic device to be affected. Influence.
  • the electronic device is provided with a camera module
  • the camera module includes a camera housing and a camera body located in the camera housing
  • the metal structure is the camera housing
  • the camera housing An insulating material is arranged between the camera body and the camera body.
  • the camera housing is made of metal material.
  • the camera housing is the metal structure in the electronic device described in this application.
  • the slot is provided on the top, which can effectively reduce the adverse effect of the induced current on the camera housing on the working performance of the antenna.
  • the direction of the induced current on the camera housing and the working principle of the slot are the same as those in the above implementation.
  • the directions and principles described in the method are the same, and will not be repeated here.
  • the camera body inside the camera housing may not be slotted, but in order to avoid the camera body from affecting the antenna, it should be
  • the camera housing and the camera body are insulated.
  • an insulating material is arranged between the camera body and the camera housing. This will not affect the camera's imaging function, and will not affect the antenna The work performance of the machine is adversely affected.
  • the electronic device is provided with a metal shield and a non-metal shield layer
  • the metal shield is used to shield an electronic device
  • the metal structure is the metal shield
  • the layer is connected with the metal shielding cover and covers the slot, so that the non-metal shielding layer and the metal shielding cover together form an electromagnetic interference protection structure of the electronic device.
  • the function of the metal shielding cover is to shield the influence of external electromagnetic waves on the internal circuit and/or to shield the electromagnetic waves generated inside from radiating outward.
  • the metal shielding cover is made of stainless steel and nickel silver. For the same reason as discussed in the above embodiment, the metal shielding cover is the metal structure of the electronic device described in this application.
  • the slotting provided on the metal shielding cover can effectively reduce the adverse effect of the induced current on the metal shielding cover on the working performance of the antenna, wherein the direction of the induced current on the metal shielding cover and the slotting
  • the working principle of is the same as the direction and principle described in the foregoing embodiment, and will not be repeated here. It should be noted that slotting on the metal shielding cover will inevitably have a certain impact on the shielding performance of the metal shielding cover. Therefore, it is necessary to provide non-metallic materials at the slotted position of the metal shielding cover.
  • a shielding layer, the non-metallic shielding layer is connected to the metal shielding cover and covering the slot, which can not only ensure the shielding effect of the shielding cover, but also avoid adverse effects on the working performance of the antenna.
  • the metal structure can be a metal part on any component, and in the first direction, the metal part at least partially overlaps the antenna.
  • the metal structure is not limited to the several implementations listed above.
  • the method can also be a metal part on another component, which is not specifically limited here.
  • the electronic device further includes a magnetic member, the magnetic member is provided on a side of the metal structure away from the antenna, and is used to isolate the metal structure from other metals in the electronic device. Pieces.
  • the magnetic part is arranged at the position of the metal structure away from the antenna, which is mainly used to isolate the metal structure and prevent the metal structure from being connected with other metal parts. It is understandable that if the metal structure is When other metal parts are connected together, the metal structure and other metal parts will form a whole, and the grooves on the original metal structure may be filled by other metal parts or become closed due to structural changes. Slots, or due to some other reasons, make it impossible to change the direction of the induced current, and it is unavoidable that the working performance of the antenna is adversely affected.
  • the magnetic part is made of ferrite, which is a metal oxide with ferromagnetism.
  • ferrite In terms of electrical properties, the resistivity of ferrite is much larger than that of metal and alloy magnetic materials, and it also has higher dielectric properties.
  • the magnetic member can not only play the role of isolation, but also play the role of magnetic field concentrating. It should be noted that the magnetic member is not limited to be made of ferrite, but can also be made of any other magnetic material that meets the corresponding functional requirements, and no specific limitation is made here.
  • the magnetic member may also be provided between the antenna and the metal structure at the same time.
  • the magnetic element is arranged between the antenna and the metal structure mainly to use the magnetic field concentration effect of the magnetic element.
  • the magnetic field will be mainly concentrated on the magnetic element And form a closed curve after passing through the magnetic member.
  • Arranging the magnetic member between the antenna and the metal structure can concentrate the magnetic field and reduce the influence of the metal structure on the antenna magnetic field, thereby ensuring that the antenna has good working performance.
  • the magnetic field concentration effect of the magnetic member is mainly used instead of the magnetic member for isolation. Therefore, in The magnetic element here does not need to cover and isolate the entire metal structure.
  • the shape and size of the magnetic element between the antenna and the metal structure is different from the size of the magnetic element.
  • the shape and size of the antenna are matched, that is, in the direction perpendicular to the first surface, the magnetic member located between the antenna and the metal structure has the same projection profile on the first surface as the The projection contours of the antenna on the first surface coincide, so that the magnetic member only covers the area where the antenna is located.
  • the magnetic member can concentrate the magnetic field, reducing the adverse effect of the metal structure on the antenna, and at the same time, the coverage area of the magnetic member is controlled, and the process cost is reduced.
  • the requirements for the metal structure are also different, and some requirements are
  • the metal structure is not grounded, and some require the metal structure to be grounded.
  • the metal structure In its working frequency band, the metal structure is required to be suspended without being connected to the main board, otherwise the metal structure becomes a piece of ground, so that the radiation effect cannot be achieved, and the antenna cannot be in a normal working state.
  • NFC Near Field Communication
  • the metal structure is required to be grounded, such as the second-generation mobile communication (2nd-Generation, 2G) frequency band, the third-generation Generation mobile communication (3rd-Generation, 3G) frequency band, fourth-generation mobile communication (4th-Generation, 4G) frequency band, fifth-generation mobile communication (5th-Generation, 5G) frequency band, Wi-Fi frequency band and GPS frequency band, etc.
  • the metal structure needs to be grounded, so that the metal structure can be used as a ground, avoiding its use. Affect the high-frequency antenna.
  • the antenna mainly refers to an antenna with a working frequency band less than 100M. Therefore, it is necessary to ensure that the metal structure is not grounded.
  • the electronic device further includes a main board, and the metal structure is stacked between the main board and the antenna, and between the main board and the metal structure A magnetic part is provided, and a floating non-grounded structure is formed between the metal structure and the main board. Under this structure, the metal structure is suspended and not grounded, which satisfies the requirements of the antenna on the metal structure in its corresponding working frequency band.
  • the electronic device further includes a main board, the metal structure is stacked between the main board and the antenna, a magnetic member is provided between the main board and the metal structure, and the metal The structure is electrically connected to the ground of the main board through a filter element.
  • the filter element In the working frequency band of the antenna, the filter element has a high impedance characteristic, thereby isolating signals from being transmitted from the antenna to the main board.
  • the metal structure is not grounded at the corresponding working frequency band of the antenna, and when there is also a high-frequency antenna with a working frequency band greater than 500M in the electronic device, it can be set
  • the filter has low resistance characteristics at a frequency band greater than 500M, so that the metal structure and the ground layer of the main board are in a connected state at high frequency, which also satisfies the high frequency antenna in its corresponding working frequency band.
  • the requirement for the grounding of the metal structure simultaneously ensures the working performance of the antenna and the high-frequency antenna in their respective working frequency bands.
  • the working frequency band of the antenna is defined as less than 100M
  • the working frequency band of the high-frequency antenna is defined as greater than 500M.
  • the working frequency of the antenna and the high-frequency antenna Specific working frequency bands can be divided into different divisions, so that different characteristics of different frequency bands can be used for different processing.
  • the filter can be any shape and structure that meets the corresponding functional requirements, and no specific limitation is made here.
  • the antenna in the electronic device described in the present application includes, but is not limited to, a near field communication antenna, and there are various structures, which will not be repeated here.
  • Figure 1a is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 1b is a schematic diagram of the fixing structure of the metal bracket in the electronic device shown in Fig. 1a.
  • Fig. 2a is a schematic structural diagram of a form of antenna-related components in a conventional electronic device.
  • Fig. 2b is a schematic diagram of current distribution on the antenna-related components shown in Fig. 2a.
  • Fig. 3a is a schematic structural diagram of another form of antenna-related components in a conventional electronic device.
  • Fig. 3b is a schematic diagram of current distribution on the antenna-related components shown in Fig. 3a.
  • Fig. 4a is a schematic structural diagram of antenna-related components in the electronic device shown in Fig. 1a in an embodiment.
  • Fig. 4b is a schematic structural diagram of the antenna-related components shown in Fig. 4a in another implementation manner.
  • Fig. 4c is a schematic diagram of the antenna projection area and the enclosed space in the antenna-related components shown in Fig. 4b.
  • Fig. 5a is a schematic structural diagram of antenna-related components in the electronic device shown in Fig. 1a in another embodiment.
  • Fig. 5b is a schematic structural diagram of the antenna-related components shown in Fig. 5a in another implementation manner.
  • Fig. 5c is a schematic diagram of the antenna projection area and the enclosed space in the antenna-related components shown in Fig. 5b.
  • Fig. 6a is a schematic diagram of current distribution on the antenna-related components shown in Fig. 4b.
  • Fig. 6b is a schematic diagram of current distribution on the antenna-related components shown in Fig. 5b.
  • Fig. 7a is a cross-sectional view of the antenna-related components shown in Fig. 4b in the direction A-A.
  • Fig. 7b is a cross-sectional view of the antenna-related components shown in Fig. 5b in the direction B-B.
  • Fig. 8a is a schematic structural diagram of a magnetic element applied to the antenna-related components shown in Fig. 7a.
  • Fig. 8b is a schematic structural diagram of a magnetic element applied to the antenna-related components shown in Fig. 7b.
  • Fig. 9a is a schematic structural diagram of the antenna-related components shown in Fig. 8a in an implementation manner.
  • Fig. 9b is a schematic structural diagram of the antenna-related components shown in Fig. 8b in an implementation manner.
  • Fig. 10a is a simulation diagram of transmission coefficients performed by using the antenna-related components described in Fig. 9a.
  • Fig. 10b is a comparison diagram of the transmission coefficient results of Fig. 10a.
  • Fig. 11a is a simulation diagram of transmission coefficients performed by using the antenna-related components described in Fig. 9b.
  • Fig. 11b is a comparison diagram of the transmission coefficient results of Fig. 11a.
  • FIG. 12a is a schematic structural diagram of a metal structure in an electronic device provided by an embodiment of the present application in another implementation manner.
  • FIG. 12b is a schematic structural diagram of a metal structure in an electronic device provided by an embodiment of the present application in a third embodiment.
  • FIG. 12c is a schematic structural diagram of a metal structure in an electronic device provided by an embodiment of the present application in a fourth implementation manner.
  • FIG. 1a is a schematic structural diagram of an electronic device 1000 according to an embodiment of the present application.
  • the electronic device 1000 provided by the embodiment of the present application includes, but is not limited to, a mobile phone, a POS machine, a computer, or a tablet computer, and may also be other electronic devices 1000 with corresponding functions, which are not specifically limited herein.
  • the electronic device 1000 provided by the embodiment of the present application includes an antenna 100, a metal structure 200, a housing 300, and a radio frequency module 400.
  • the housing 300 is provided with a accommodating space, and the antenna 100, the metal structure 200 and the radio frequency module 400 are all assembled in the accommodating space. .
  • the radio frequency module 400 is electrically connected to the antenna 100 for transmitting and receiving electromagnetic signals to the antenna 100.
  • the antenna 100 radiates electromagnetic waves according to the received electromagnetic signals or sends electromagnetic signals to the radio frequency module 400 according to the received electromagnetic waves, so as to realize the transmission and reception of signals. Since the electronic device 1000 needs to meet the market requirements of lightness, thinness and miniaturization, the housing space inside the housing 300 is small, the distance between the metal structure 200 and the antenna 100 is small, and there is at least partial overlap. When the antenna 100 is in working condition, An induced current will be generated on the metal structure 200, which will adversely affect the working performance of the antenna 100.
  • the metal structure 200, at least part of the antenna 100, and part of the housing 300 are arranged in sequence.
  • the first direction can be understood as a direction perpendicular to the paper.
  • the metal structure 200 and the antenna 100 may be in a bonded relationship, that is, the antenna 100 is attached to the metal structure 200; or, in the first direction, the metal structure 200 and at least part of the antenna 100 are both insulating media, In this area, no other metal parts (or structural parts including metal materials: for example, camera modules, circuit boards including metal layers, etc.) are provided, and the insulating medium can be air, that is, between the metal structure 200 and the antenna 100 There is an air separation, that is, the antenna is suspended relative to the metal structure, and the insulating medium can also be other non-metal structural parts; the metal structure 200 is provided with a non-closed slot 20, and in the first direction, the slot 20 penetrates the metal structure 200
  • the metal structure 200 includes a first surface 201 facing the antenna 100 in the first direction (as shown in FIG.
  • the vertical projection of the antenna 100 on the first surface 201 is the antenna projection area, and the slot 20 is from the first surface 201 The edge extends toward the inside of the first surface 201 and passes through the antenna projection area.
  • an induced current in the same direction as the current on the antenna 100 is formed on the first surface 201. Due to the existence of the non-enclosed slot 20, the direction of the induced current in a part of the metal structure 200 is consistent with the direction of the current on the antenna 100, that is, both clockwise or counterclockwise, thereby reducing the induced current pair.
  • the bad influence of the magnetic field of the antenna 100 effectively improves the working performance of the antenna 100.
  • the housing 300 may be a non-metal housing, and the housing 300 is located on the radiation path of the antenna 100.
  • the housing 300 may also be a metal housing, but a part of the non-metallic area needs to be provided on the metal housing, and the part of the non-metallic area is used to provide a channel for signal transmission and reception. Understandably, an antenna slit is provided on the housing 300 The antenna 100 transmits and receives signals.
  • the radio frequency module 400 (Radio Frequency module, AF module) is a circuit that can transmit and/or receive radio frequency signals, such as a transceiver (transmitter and/or receiver, T/R).
  • the antenna 100 includes, but is not limited to, a Near Field Communication (NFC) antenna 100, and may also be other types of antennas 100, which will not be repeated here.
  • NFC Near Field Communication
  • this application uses the near field communication antenna 100 as an example. Give a detailed description.
  • the first direction is the direction in which the metal structure 200, at least part of the antenna 100 and part of the housing 300 are sequentially arranged and overlapped.
  • the metal structure 200 includes a first surface 201, the first surface 201 faces the housing 300, and the antenna 100 is located on the first surface 201 and the housing. Between 300, the antenna 100 is directly facing the first surface 201 in the first direction.
  • the first surface 201 may be planar, and the first surface 201 may also be non-planar, such as having uneven portions, or may be an arc-shaped surface, etc.
  • the specific form of the first surface 201 is not limited in this application.
  • the antenna 100 and the metal structure 200 at least partially overlap, that is, at least part of the antenna 100 is located between the first surface 201 and the housing 300, and a mezzanine space is formed between the first surface 201 and the housing 300.
  • the antenna 100 may be completely contained in the mezzanine space.
  • a part of the antenna 100 extends into the interlayer space and is arranged directly opposite to the first surface 201, and a part of the antenna 100 is located outside the interlayer space and is not arranged directly opposite to the first surface 201.
  • the non-closed slot 20 means that in the direction perpendicular to the first surface 201, the slot 20 penetrates the metal structure 200.
  • the slot 20 extends from the edge of the first surface 201 to the first surface 201.
  • the interior of the surface 201 extends.
  • the vertical projection of the antenna 100 on the first surface 201 is the antenna projection area, and the slot 20 extends from the edge of the first surface 201 to the inside of the first surface 201 and passes through the antenna projection area. It can be understood that the vertical projection area of the antenna 100 on the first surface 201 intercepts the slot 20, a part of the slot 20 is located outside the projection area of the antenna 100 and is connected to the edge of the first surface 201, and the other part of the slot 20 is located Inside the projection area of the antenna 100. Due to the continuity of the current, the induced current generated on the metal structure 200 close to the antenna 100 will inevitably flow along two paths when passing through the slot 20.
  • One of the induced current flow paths is: along the outside of the projection area of the antenna 100
  • the edge of the part of the slot 20 flows to the edge of the metal structure 200
  • the other induced current flow path is to flow along the edge of the part of the slot 20 located inside the projection area of the antenna 100. It is understandable that on the two paths mentioned above, The flow direction of the induced current is consistent with the flow direction of the current on the antenna 100. That is to say, in this structure, the positions on the inner and outer sides of the antenna 100 on the metal structure 200 will produce the same induction as the current on the antenna 100. Therefore, it is ensured that the working performance of the antenna 100 is not impaired and is enhanced to a certain extent.
  • the metal structure 200 is not limited to a metal bracket or a metal plate stacked with an antenna in the electronic device, and may also be a metal material area on any component (such as a camera, a shielding cover, etc.) in the electronic device.
  • the metal bracket 210 is an integrated structure.
  • the metal bracket 210 includes a supporting leg 211 and a supporting plate 212.
  • the supporting leg 211 is fastened to the circuit board 501 by screws, and the supporting plate 212 is used for carrying
  • the antenna 100 can be fixedly attached to the surface of the support plate 212 away from the circuit board 501.
  • the area of the support plate 212 can be larger than the outer contour of the antenna 100.
  • the antenna 100 overlaps the support plate 212 in whole or in part. It is understood that,
  • the supporting legs 211 can also be welded and fixed to the circuit board 501 to make the fixing between the metal bracket 210 and the circuit board 501 more stable.
  • connection between the metal bracket 210 and the circuit board 501 is not limited to the above
  • the two types can be any connection mode that can meet the corresponding function.
  • the structure of the metal bracket 210 is not limited to a one-piece structure, but can also be a split structure or any structure that meets the corresponding function, which is not specifically limited here.
  • the circuit board 501 may be the circuit board 501 on the main board 500, or the circuit board 501 connected to the main board 500 through an FPC.
  • the metal bracket 210 is fixed on the circuit board 501, the metal bracket 210 and the circuit board 501 There is a certain space between them, and some electronic components can be arranged in this space, and the metal bracket 210 is used to press and stabilize them on the circuit board 501, which improves the stability of the structure.
  • the separation distance between the metal material area on any component and the antenna 100 is small, and there is at least partial overlap in the first direction.
  • the metal material area will inevitably generate an induced current that is opposite to the current on the antenna 100, which will affect the working performance of the antenna 100. If the non-closed slot 20 is also opened in the metal material area, it can be reduced. The induced current has a bad influence on the antenna 100 and enhances the working performance of the antenna 100 to a certain extent.
  • FIG. 2a is a schematic structural diagram of related components of an antenna 100 in a conventional electronic device.
  • FIG. 2b is a schematic diagram of current distribution on related components of the antenna 100 shown in FIG. 2a.
  • FIG. 3a is a schematic structural diagram of related components of another form of antenna 100 in a conventional electronic device.
  • FIG. 3b is a schematic diagram of current distribution on related components of the antenna 100 shown in FIG. 3a.
  • the commonly used near field communication antenna 100 usually has two forms.
  • One is a single-ended near field communication antenna 100, which is formed by combining a piece of wire with the metal frame 30 on the housing 300.
  • the electronic device has an antenna inside. 100.
  • the antenna and the metal frame 30 together form an enclosing structure.
  • the enclosing structure forms an unclosed enclosing space, which can be regarded as a semi-enclosing structure or a partial enclosing structure.
  • the antenna 100 there are many structural deformations.
  • one end of the antenna 100 is grounded, and the other end is connected to the metal frame 30.
  • the metal frame 30 is not grounded, but is electrically connected to the radio frequency module 400. connect.
  • the other is a coiled near field communication antenna 100, and the antenna 100 is surrounded to form a coil form.
  • the electronic device is provided with an antenna 100, a metal structure 200, a main board 500, and a radio frequency module 400.
  • the radio frequency module 400 is arranged on the main board 500, and the antenna 100 is surrounded to form an enclosing structure.
  • This enclosing structure can form a closed enclosing space, which can be regarded as A fully enclosed enclosure structure.
  • the antenna can also be surrounded to form a partially enclosed or semi-enclosed structure to form an unclosed enclosure space. Both ends of the antenna 100 are electrically connected to the radio frequency module 400. In this form of antenna 100, there are also various structural deformations.
  • the antenna 100 involved in the present application constitutes an enclosing structure in an electronic device.
  • the enclosing structure can be understood as a partially enclosing, semi-enclosing or full enclosing structure, forming a closed enclosing space or an unclosed enclosing space.
  • the structure of the antenna 100 involved in the present application includes but is not limited to the above two types.
  • the present application mainly uses the above two types of near field communication antenna 100 for detailed description, and the antenna 100
  • the structure can have a variety of deformed structures, as long as the corresponding functions are satisfied, and the various deformed structures will not be repeated here.
  • the direction of the induced current generated on the metal structure 200 close to the antenna 100 is the same as
  • the direction of the current on the antenna 100 is opposite, that is, one is in the counterclockwise direction and the other is in the clockwise direction.
  • the magnetic field generated by the induced current in the opposite direction will cancel a part of the magnetic field of the antenna 100, which will inevitably weaken the antenna 100 to a certain extent. Work performance.
  • FIG. 4a is a schematic structural diagram of related components of the antenna 100 in the electronic device 1000 shown in FIG. 1a in an embodiment.
  • FIG. 4b is a schematic structural diagram of related components of the antenna 100 shown in FIG. 4a in another implementation manner.
  • 4c is a schematic diagram of the antenna projection area 202 and the enclosed space 203 in the related components of the antenna 100 shown in FIG. 4b.
  • the metal structure 200 may be a metal bracket 210 made of a metal material.
  • the metal bracket 210 is opened from the first surface of the metal bracket 210 A slot 20 extending from the edge of the first surface 201 to the inside of the first surface 201, the slot 20 penetrates the metal bracket 210 in the direction perpendicular to the first surface 201.
  • the edge of the slot 20 is connected to the edge of the metal bracket 210
  • the slot 20 is a non-closed slot 20, and the slot 20 passes through the vertical projection area of the antenna 100 on the first surface 201.
  • the vertical projection area of the antenna 100 on the first surface 201 is the antenna projection area 202.
  • the structure of the antenna 100 is an enclosing structure.
  • the metal frame 30 can be regarded as an extension of the antenna 100, and the antenna 100 and the metal frame 30 together form an enclosing structure.
  • the antenna 100 and the metal frame 30 jointly form an antenna on the first surface 201
  • the projection area 202 will also form a corresponding enclosing space 203.
  • the slot 20 passes through the antenna projection area 202, and the slot 20 is divided into the first section 21, the second section 22, and the third section 23 by the antenna projection area 202.
  • the first section 21 is located in the antenna projection area 202 and the second section. Between the edges of one surface 201, the edge of the first section 21 is connected to the edge of the first surface 201, and then communicates with the edge of the metal bracket 210, and the second section 22 is located in the enclosed space 203 formed by the antenna projection area 202, And the first section 21 and the second section 22 are connected through the third section 23, which can be understood as viewing in a direction perpendicular to the first surface 201, the first section 21 is located outside the antenna projection area 202, The second section 22 is located inside the antenna projection area 202.
  • the induced current generated on the metal bracket 210 is usually called a vortex distribution, and the closer to the antenna projection area 202, the stronger the intensity of the induced current, and when the antenna 100 intercepts the slot 20, the first When a section 21 and a second section 22 are respectively located on both sides of the antenna projection area 202, the high-intensity induced current generated on the metal bracket 210 will inevitably flow through the slot 20 and flow along two paths.
  • One induced current flow path is to flow along the edge of the first section 21 to the edge of the metal bracket 210, and then flow along the edge of the metal bracket 210; the other current flow path is to flow along the edge of the second section 22, which is determined by the continuity of current It can be seen that the current line in the current field must be a closed curve connecting end to end.
  • the flow direction of the induced current is consistent with the flow direction of the current on the antenna 100, that is, in the clockwise direction or All are in the counterclockwise direction, that is, under this structure, the positions on the inner and outer sides of the antenna 100 on the metal bracket 210 will generate an induced current in the same direction as the current on the antenna 100, and the induced current in this direction
  • the intensity of the current is strong, thereby reducing the bad influence of the induced current on the magnetic field of the antenna 100, and effectively improving the working performance of the antenna 100.
  • the shape and size of the slot 20 can be various, and there is no specific limitation here.
  • the slot 20 of one shape is described below as an example.
  • the second section 22 includes a connecting portion 221 and an expansion portion 222
  • the connecting portion 221 is connected between the third section 23 and the expansion portion 222
  • the first section 21, the third section 23 and the connecting portion 221 together constitute
  • the size of the expansion portion 222 is larger than the size of the connecting portion 221.
  • the second section 22 at the inner side of the antenna 100 has a larger area, and the path of the induced current flowing on the second section 22 is longer, and the magnetic field generated by the induced current has a larger range, as can be seen from the above discussion ,
  • the induced current on the second section 22 flows in the same direction as the current on the antenna 100. Therefore, when the magnetic field generated by the induced current on the second section 22 is larger, it has a better effect on the magnetic field of the antenna 100. The gain effect, thereby further improving the working performance of the antenna 100.
  • the shape and size of the slot 20 can be set according to the requirements of the internal structure of the electronic device 1000, and can also correspond to the shape and size of the antenna 100.
  • the metal bracket 210 can be adjusted by adjusting the shape and size of the slot 20.
  • the shape and size of the slot 20 are not specifically limited here.
  • FIG. 5a is a schematic structural diagram of the antenna 100 related components in the electronic device 1000 shown in FIG. 1a in another embodiment.
  • FIG. 5b is a schematic structural diagram of related components of the antenna 100 shown in FIG. 5a in another implementation manner.
  • FIG. 5c is a schematic diagram of the antenna projection area 202 and the enclosed space 203 in the related components of the antenna 100 shown in FIG. 5b.
  • the metal structure 200 can also be a metal bracket 210 made of metal material, and the metal bracket 210 is also opened from the edge of the metal bracket 210.
  • a non-closed slot 20 extends inside the metal bracket 210.
  • the induced current generated on the metal bracket 210 close to the antenna 100 will flow along the edges of the slot 20 and the edge of the metal bracket 210 when passing through the non-closed slot 20, and flow along the two paths mentioned above.
  • the direction of the induced current is the same as the direction of the current on the antenna 100, thereby reducing the adverse effect of the induced current on the working performance of the antenna 100.
  • the metal bracket 210 may have the same shape and structure
  • the position and state of the non-closed slot 20 on the metal bracket 210 are the same, that is, the slot 20 is set from the edge of the first surface 201 on the metal bracket 210 to the inside of the first surface 201, and is perpendicular to the first surface 201. In the direction of, the slot 20 penetrates the metal bracket 210; at the same time, the slot 20 passes through the antenna projection area 202 of the antenna 100 on the first surface 201, and the slot 20 is also divided into the first connected segment by the antenna projection area 202 21.
  • the second section 22 and the third section 23; similarly, the second section 22 can be provided as a connecting portion 221 and an extension portion 222 to further improve the working performance of the antenna 100.
  • the technical effect of the slot 20 is the same, that is, the induced current generated on the metal bracket 210 close to the antenna 100, when passing through the non-closed slot 20, the induced current will be along the edge of the slot 20 and the metal bracket 210
  • the direction of the induced current flowing along the two paths is the same as the direction of the current on the antenna 100, that is, both are in the clockwise direction or both in the counterclockwise direction, thereby reducing
  • the interference of the induced current to the magnetic field of the antenna 100 effectively improves the working performance of the antenna 100;
  • the metal bracket 210 and the slot 20 have the same embodiment and the same function, so it will not be repeated.
  • the antenna 100 when it is an enclosing structure, it can better meet the corresponding signal transmission function.
  • the antenna projection area 202 of the antenna 100 on the first surface 201 will inevitably form an enclosing space 203
  • the extension 222 extends beyond the enclosed space 203, the induced current generated by other metals in the enclosed space 203 cannot be cancelled, which will weaken the working performance of the antenna 100. Therefore, in order to ensure the magnetic field generated by the induced current on the metal bracket 210 , To have a better gain effect on the magnetic field of the antenna 100, and the expansion part 222 should be located in the enclosed space 203.
  • FIG. 6a is a schematic diagram of current distribution on related components of the antenna 100 shown in FIG. 4b.
  • FIG. 6b is a schematic diagram of current distribution on related components of the antenna 100 shown in FIG. 5b.
  • the arrow direction is the flow direction of the current of the antenna 100 and the induced current on the metal bracket 210. It can be seen from the figure that the induced current generated near the antenna 100 on the metal bracket 210 is dense and strong. Strong, and the direction of the induced current here is opposite to the direction of the current on the antenna 100, which conforms to Lenz’s law.
  • the induced current passes through the slot 20, due to the continuity of the current, it will flow along two paths, one of which is The induced current flow path is to flow along the edge of the first section 21 to the edge of the metal bracket 210, and then flow along the edge of the metal bracket 210; the other current flow path is to flow along the edge of the second section 22, in the above two paths
  • the flow direction of the induced current is consistent with the flow direction of the current on the antenna 100, that is, in the counterclockwise direction, that is, in the electronic device 1000 provided in the embodiment of the present application, the metal bracket 210 is located on both sides , Will generate an induced current in the same direction as the current on the antenna 100. Comparing FIGS.
  • FIG. 7a is a cross-sectional view of related components of the antenna 100 shown in FIG. 4b along the A-A direction.
  • Fig. 7b is a cross-sectional view of the relevant components of the antenna 100 shown in Fig. 5b in the direction B-B.
  • FIG. 8a is a schematic diagram of the structure of the magnetic member 600 applied to related components of the antenna 100 shown in FIG. 7a.
  • FIG. 8b is a schematic diagram of the structure of the magnetic member 600 applied to related components of the antenna 100 shown in FIG. 7b.
  • the electronic device 1000 provided by the embodiment of the present application further includes a magnetic member 600.
  • the magnetic member 600 is disposed at a position of the metal bracket 210 away from the antenna 100, and the metal bracket 201 is located between the antenna 100 and the magnetic member 600.
  • the metal bracket 201 is isolated from other metal parts in the electronic device 1000.
  • the magnetic member 600 is provided at the position of the metal bracket 210 away from the antenna 100, which is mainly used to isolate the metal bracket 210 and prevent the metal bracket 210 from being connected with other metal parts.
  • the metal bracket 210 is connected with other metal parts , The metal bracket 210 and other metal parts will form a whole together, and the slot 20 on the original metal bracket 210 may be filled with other metal parts, or become a closed slot 20 due to structural changes, or due to other reasons As a result, it cannot change the direction of the induced current, and it is impossible to prevent the working performance of the antenna 100 from being adversely affected.
  • the magnetic member 600 is made of ferrite, which is a metal oxide with ferromagnetism.
  • ferrite is a metal oxide with ferromagnetism.
  • the resistivity of ferrite is much larger than that of metal and alloy magnetic materials, and it also has higher dielectric properties.
  • the magnetic properties of ferrite also show high permeability at high frequencies. Therefore, ferrite has become a widely used non-metallic magnetic material in the field of high frequency and weak current.
  • B ⁇ H, where B represents the magnetic induction intensity, ⁇ represents the magnetic permeability, and H represents the magnetic field intensity.
  • the magnetic member 600 can not only play a role of isolation, but also play a role of magnetic field concentrating. It should be noted that the magnetic member 600 is not limited to be made of ferrite, but can also be made of any other magnetic material that meets the corresponding functional requirements, and no specific limitation is made here.
  • the requirements for the metal bracket 210 are also different. Some require the metal bracket 210 to float without connecting to the motherboard 500, and some The metal bracket 210 is required to be grounded. Generally, for some antenna 100 with a lower working frequency band, that is, the antenna 100 whose working frequency band is less than 100M, such as the near field communication antenna 100, it needs to use metal to radiate when it works.
  • the metal bracket 210 is suspended without being connected to the main board 500, otherwise the metal bracket 210 becomes a piece of ground, and the radiation effect cannot be achieved, so that the antenna 100 cannot be in a normal working state.
  • the metal bracket 210 is required to be grounded, such as 2G frequency band, 3G frequency band, 4G frequency band, 5G frequency band, Wi-Fi frequency band And GPS frequency band, etc., when in these high frequency bands, if the metal bracket 210 is suspended and not grounded, it will have a certain impact on the working performance of the corresponding antenna 100. Therefore, the metal bracket 210 needs to be grounded, so that the metal bracket 210 can be used as a ground. , Avoiding its impact on the antenna 100 with a higher working frequency band.
  • connection relationship between the metal bracket 210 and the main board 500 is also different.
  • the metal bracket 210 is stacked between the main board 500 and the antenna 100, a magnetic member 600 is arranged between the main board 500 and the metal bracket 210, and a floating ungrounded structure is formed between the metal structure and the main board.
  • the metal bracket 210 and the main board 500 are spaced apart, and the metal bracket 210 is not connected to the main board 500, and the metal bracket 210 is suspended and not grounded, so as to meet the requirement of a part of the low-frequency antenna 100 to the metal structure 200 in its corresponding working frequency band. Require.
  • the main board 500 includes a ground layer (not shown), the metal bracket 210 is stacked between the main board 500 and the antenna 100, and a magnetic member 600 is provided between the main board 500 and the metal bracket 210.
  • the main board 500 and the metal A filter (not shown) is also arranged between the brackets 210, and the metal bracket 210 is connected to the ground layer through the filter.
  • the filter has different resistance characteristics in different frequency bands, so that the metal The bracket 210 and the ground layer of the main board 500 are connected or disconnected correspondingly.
  • the filter when the filter is in a frequency band less than 100M, the filter exhibits high impedance characteristics, so that the metal bracket 210 is not connected to the main board 500, so as to meet the requirements of some low-frequency antenna 100 on the metal bracket 210 in its corresponding working frequency band;
  • the filter when the filter is in the frequency band greater than 500M, the filter exhibits low resistance characteristics, so that the metal bracket 210 is connected to the ground layer of the main board 500, and the metal bracket 210 is grounded to meet the requirements of a part of the high-frequency antenna 100 in its corresponding working frequency band.
  • the requirements of the metal bracket 210 when the filter is in a frequency band less than 100M, the filter exhibits high impedance characteristics, so that the metal bracket 210 is not connected to the main board 500, so as to meet the requirements of some low-frequency antenna 100 on the metal bracket 210 in its corresponding working frequency band;
  • the working frequency band of the antenna 100 in the low frequency band is defined as less than 100M
  • the working frequency band of the antenna 100 in the high frequency band is defined as greater than 500M.
  • the low frequency band and the high frequency band can be used. Carry out different divisions, so as to use different characteristics of different frequency bands to do different treatments.
  • the filter can be any shape and structure that meets the corresponding functional requirements, and no specific limitation is made here.
  • FIG. 9a is a schematic structural diagram of related components of the antenna 100 shown in FIG. 8a in an embodiment.
  • Fig. 9b is a schematic structural diagram of related components of the antenna 100 shown in Fig. 8b in an implementation manner.
  • the magnetic member 600 is also arranged between the antenna 100 and the metal bracket 210.
  • the magnetic material is arranged between the antenna 100 and the metal bracket 210, mainly using the magnetic field concentration of the magnetic member 600.
  • the magnetic member 600 is added to this position, the magnetic field will be mainly concentrated on the magnetic member 600 and pass through The magnetic member 600 then forms a closed curve. Arranging the magnetic member 600 between the antenna 100 and the metal bracket 210 can concentrate the magnetic field and reduce the influence of the metal bracket 210 on the magnetic field of the antenna 100, thereby ensuring that the antenna 100 has good working performance.
  • the magnetic member 600 is arranged between the antenna 100 and the metal bracket 210, the magnetic field concentration of the magnetic member 600 is mainly used instead of the magnetic member 600 to play the role of isolation. Therefore, the magnetic member 600 here 600 does not need to cover and isolate the entire metal bracket 210.
  • the shape and size of the magnetic member 600 between the antenna 100 and the metal bracket 210 matches the shape and size of the antenna 100, so that the magnetic The component 600 only covers the area where the antenna 100 is located. Under this structure, the magnetic member 600 can concentrate the magnetic field, reducing the adverse effects of the metal bracket 210 on the antenna 100, and at the same time, the coverage area of the magnetic member 600 is controlled, and the process cost is reduced.
  • FIG. 10a Please refer to FIG. 10a, FIG. 10b, FIG. 11a, and FIG.
  • Fig. 10b is a comparison diagram of the transmission coefficient results of Fig. 10a.
  • Fig. 11a is a simulation diagram of the transmission coefficient performed by using relevant components of the antenna 100 of Fig. 9b.
  • Fig. 11b is a comparison diagram of the transmission coefficient results of Fig. 11a.
  • the traditional electronic device is compared with the electronic device 1000 provided in the embodiment of the present application.
  • the working performance gap of the antenna 100 It can be seen from FIGS. 10b and 11b that the transmission coefficient S1,2 of the antenna 100 in the electronic device 1000 of the present application is greater than the transmission coefficient S1,2 of the antenna 100 in the traditional electronic device, that is, the antenna 100 in the electronic device 1000 of the present application
  • the working performance of the antenna 100 is better than that of the antenna 100 in the traditional electronic device.
  • the metal structure 200 includes but is not limited to a metal bracket 210 made of a metal material, and can also be a metal material on the motherboard 500 or a metal material on the camera housing 71
  • the metal material on the metal shield 800 and the metal material on any part are not specifically limited here.
  • FIG. 12a is a schematic structural diagram of the metal structure 200 in the electronic device 1000 according to another embodiment of the present application.
  • FIG. 12b is a schematic structural diagram of a metal structure 200 in an electronic device 1000 provided by an embodiment of the present application in a third embodiment.
  • FIG. 12c is a schematic structural diagram of the metal structure 200 in the electronic device 1000 provided by an embodiment of the present application in a fourth implementation manner.
  • the motherboard 500 has a multi-layer structure.
  • the multiple ground layers 510 are the metal structures 200 in the electronic device 1000 of this application.
  • each ground layer 510 needs to be slotted 20, so as to ensure that the induced current on the ground layer 510 will not have a major impact on the working performance of the antenna 100.
  • the necessary components can be placed in the non-slotting 20 area on the motherboard 500, which can also meet the corresponding functional requirements without affecting other functions of the electronic device 1000 .
  • the electronic device 1000 further includes a camera module 70.
  • the camera module 70 includes a camera housing 71 and a camera body 72.
  • the camera housing 71 includes a metal material (not shown), which is the same as discussed in the above embodiment. For this reason, the presence of metal materials on the camera housing 71 will adversely affect the working performance of the antenna 100. In this case, a non-closed groove extending from the edge of the metal material to the inside of the metal material needs to be opened on the metal material. In order to form the slot 20, the existence of the slot 20 can ensure that the working performance of the antenna 100 is not impaired, and is still enhanced to a certain extent. It is understandable that in some cases, the camera housing 71 may be entirely made of metal materials.
  • the camera housing 71 as a whole is the metal structure 200 in the electronic device 1000 of this application.
  • the induced current has a negative impact on the working performance of the antenna 100.
  • a non-closed groove extending from the edge of the camera housing 71 to the inside of the camera housing 71 needs to be opened on the camera housing 71 to form the slot 20, thereby avoiding the operation of the antenna 100 Performance is adversely affected.
  • the camera body 72 inside the camera housing 71 may not be slotted 20.
  • the camera housing 71 and the camera body Insulation treatment is performed between 72, such as providing an insulating material 73, which will not affect the camera function of the camera, and will not adversely affect the working performance of the antenna 100.
  • the electronic device 1000 further includes a metal shield 800.
  • the metal shield 800 includes a metal material (not shown).
  • the metal material is the metal structure 200.
  • the metal material is opened from the edge of the metal material to the inside of the metal material.
  • the extended non-closed tank body forms the slot 20.
  • the function of the metal shield 800 is to shield the influence of external electromagnetic waves on the internal circuit and/or to shield the electromagnetic waves generated inside from radiating outward.
  • the metal shield 800 is entirely made of stainless steel and nickel silver. Therefore, the metal shield 800 itself is usually the metal structure 200 in the electronic device 1000 of this application.
  • the metal shield 800 is provided with a metal shield The non-closed groove body extending from the edge of the cover 800 to the inside of the metal shielding cover 800 to form the slot 20, so that the induced current generated on the metal shielding cover 800 close to the antenna 100 will pass through the slot 20 due to the continuity of the current.
  • the induced current will flow along the edge of the slot 20 and the edge of the metal shield 800 respectively, and the direction of the induced current flowing along the edge of the slot 20 and the edge of the metal shield 800 is the same as the current on the antenna 100.
  • the directions are the same, thereby avoiding the induced current from causing adverse effects on the magnetic field generated by the current on the antenna 100, thereby ensuring that the nature has good working performance.
  • slotting 20 on the metal shield 800 will inevitably affect the shielding performance of the metal shield 800. Therefore, it is necessary to provide a non-metallic shield at the slot 20 on the metal shield 800.
  • the layer 80 and the non-metallic shielding layer 80 are connected to the metal shield 800 and cover the slot 20, so as to ensure the shielding effect of the metal shield 800 and avoid adverse effects on the working performance of the antenna 100.

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Abstract

本申请提供一种电子设备，包括收容于外壳内的天线和金属结构，在第一方向上，所述金属结构、至少部分所述天线及部分所述外壳依次排列；所述金属结构设有非封闭的开槽，在所述第一方向上，所述开槽贯穿所述金属结构；所述金属结构包括在所述第一方向上正对所述天线的第一表面，所述天线在所述第一表面上的垂直投影为天线投影区，所述开槽从所述第一表面的边缘向所述第一表面的内部延伸且经过所述天线投影区，以使得在所述天线工作状态下，所述第一表面上形成与所述天线上的电流同向的感应电流。使用本申请所述电子设备，由于所述金属结构上非封闭开槽的存在，减小了感应电流对所述天线磁场的不良影响，有效提高了所述天线的工作性能。

Description

电子设备
本申请要求于2020年5月20日提交中国专利局、申请号为202010431961.3、申请名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，尤其涉及一种具有天线的电子设备。
背景技术
随着通信技术的发展，电子设备的功能越来越多，电子设备内部器件和通信天线也越来越多，而为了保证电子设备的轻薄性，需对各种内部器件和通信天线的占用空间进行压缩，这样会使得电子设备内部的金属结构与天线之间的间距较小，而由楞次定律可知，在靠近天线的金属结构上会产生感应电流，且金属结构上的感应电流方向与天线上的电流方向相反，这样会在一定程度上削弱天线的工作性能。
因此，急需一种电子设备，能够改变金属结构上感应电流对天线磁场的不良影响，有效提高天线的工作性能。
发明内容
本申请提供一种电子设备，能够改变其内部金属结构上感应电流对天线磁场的不良影响，从而有效提高天线的工作性能。
本申请所述电子设备包括外壳、收容于外壳内的天线和金属结构，在第一方向上，所述金属结构、至少部分所述天线及部分所述外壳依次排列；所述天线贴合至所述金属结构，或者所述金属结构和所述天线之间均为绝缘介质；绝缘介质可以为空气，即天线相对金属结构可视为悬浮状架构，绝缘介质也可以为非金属结构件，可以理解的是，天线和金属结构之间不包括其它的金属件；所述金属结构设有非封闭的开槽，在所述第一方向上，所述开槽贯穿所述金属结构；所述金属结构包括在所述第一方向上正对所述天线的第一表面，所述天线在所述第一表面上的垂直投影为天线投影区，所述开槽从所述第一表面的边缘向所述第一表面的内部延伸且经过所述天线投影区。在所述天线工作状态下，所述第一表面上形成与所述天线上的电流同向的感应电流。开槽在第一方向上贯穿金属结构可以理解为，在金属结构上设通槽，且此通槽为沿第一方向贯通金属结构的形态，即在第一方向上，切掉部分金属结构，以改变天线工作状态下在金属结构上的电流分布。开槽“所述开槽从所述第一表面的边缘向所述第一表面的内部延伸且经过所述天线投影区”可以理解为：所述开槽与所述天线投影区相交，且所述开槽在所述第一表面的边缘处形成开口，所述开槽远离所述开口的一端位于所述天线投影区远离所述开口的一侧，即天线投影区的相对的两侧均有部分所述开槽。也可以理解为天线跨过或者跨越了开槽的至少一部分。
其中，所述第一表面可以为所述金属结构上的任一外表面，在此不对所述第一表面在所述金属结构上的位置进行具体的限定，而主要是对所述第一表面和所述天线之间的相对 位置关系进行说明。其中，所述第一表面朝向所述外壳，所述天线位于所述第一表面和所述外壳之间，同时，在沿垂直于所述第一表面的方向进行观察，所述天线和所述金属结构之间存在至少部分重叠。可以理解的是，在所述第一方向上，所述金属结构、至少部分所述天线及部分所述外壳依次排列，在此结构下，所述第一表面在第一方向上正对所述天线。
其中，在所述第一方向上，也就是垂直于所述第一表面的方向上，所述开槽贯穿所述金属结构，可以理解的是，若所述开槽在所述第一方向上未贯穿所述金属结构，在所述金属结构上，所述开槽未贯穿的位置，感应电流的流动方向不会发生改变，仍会沿着原方向进行流动，也就无法改善感应电流对所述天线磁场的不良影响。在所述第一表面上，所述开槽从所述第一表面的边缘向所述第一表面的内部延伸，在此结构下，所述开槽的边缘与所述第一表面的边缘相连通，以使所述开槽为非封闭开槽。在下文中，对于相关位置关系的描述均可以进行相同的理解。
其中，所述天线在所述第一表面上的垂直投影为天线投影区，所述开槽从所述第一表面的边缘向所述第一表面的内部延伸且经过所述天线投影区。当所述天线和所述开槽处于上述位置关系时，可以理解为所述天线投影区拦截所述开槽，所述开槽的一部分位于所述天线投影区的外侧，并与所述第一表面的边缘连接，所述开槽的另一部分位于所述天线投影区的内侧。由于电流的连续性，在靠近所述天线的所述金属结构上产生的感应电流，在经过所述开槽时必然会沿两个路径进行流动，其中一个感应电流流动路径为：沿位于所述天线投影区外侧的部分所述开槽边缘流动到所述金属结构的边缘，另一个感应电流流动路径为：沿位于所述天线投影区内侧的部分所述开槽边缘进行流动，可以理解的是，在上述两个路径上，感应电流的流动方向与天线上电流的流动方向一致，也就是说，在此结构下，所述金属结构上位于所述天线投影区内外两侧的位置，均会产生与所述天线上的电流方向相同的感应电流，从而保证了所述天线的工作性能不被削弱，并得到一定程度的增强。
使用本申请所述电子设备，当所述天线处于工作频段时，所述金属结构上会产生感应电流，根据楞次定律可以得知，感应电流具有这样的方向，即感应电流的磁场总要阻碍引起感应电流的磁通量的变化，因此，在靠近所述天线的所述金属结构上产生的感应电流的方向，与所述天线上的电流方向相反，感应电流的磁场会抵消一部分所述天线的磁场，这样必然会在一定程度上削弱所述天线的工作性能。而由于所述金属结构上所述开槽的存在，经过所述开槽的感应电流，会由于电流的连续性，分别沿着上述两个路径进行流动，上述两个路径上的感应电流的方向，与所述天线上的电流方向一致，这样能够减小感应电流对所述天线磁场的不良影响，有效提高所述天线的工作性能。
在一种实施方式中，所述天线投影区形成包围空间，部分所述开槽位于所述包围空间内。当所述天线为包围结构时，能够更好的满足相应信号传输功能，在此结构下，所述天线在所述第一表面上的垂直投影必然会形成包围空间，位于所述天线投影区内侧的部分所述开槽即位于所述包围空间内，且不延伸到所述包围空间之外，可以理解的是，当位于所述天线内侧的部分所述开槽延伸到所述包围空间之外时，所述包围空间内部其他金属上产生的感应电流无法被抵消，从而减弱了所述天线的工作性能，因此，为保证所述金属结构上的感应电流产生的磁场，对所述天线的磁场具有更好的增益效果，应使位于所述天线内侧的部分所述开槽限制在所述包围空间内。
可以理解的是，所述天线可以为多种形式的包围结构，包括但不限于半包围结构或全包围结构，其在所述第一表面上的投影区同时也就存在多种形式的包围空间，包括但不限于半包围空间或全包围空间。
在一种实施方式中，位于所述包围空间内的部分所述开槽包括连接部和扩展部，所述连接部在所述天线投影区的内边缘和所述扩展部之间延伸，在垂直于所述连接部的延伸方向上，所述扩展部的尺寸大于所述连接部的尺寸。在上述结构下，由于所述扩展部具有更大的尺寸，使得所述包围空间内的部分所述开槽具有更大的面积，则此部分所述开槽的边缘上的感应电流流动的路径更长，感应电流产生的磁场范围更大，由上述论述可知，在所述包围空间内的部分所述开槽上的感应电流的流向与所述天线上电流的流向相同，因此，当此部分的感应电流产生的磁场范围更大时，其对天线的磁场具有更好的增益效果，从而进一步提高了所述天线的工作性能。
在一种实施方式中，所述开槽包括依次连接的第一段、第三段和第二段，所述第一段位于所述天线投影区和所述第一表面的边缘之间，所述第三段位于所述天线投影区，所述第二段位于所述包围空间内，所述第二段包括所述连接部和所述扩展部，所述连接部连接在所述第三段和所述扩展部之间，所述第一段、所述第三段和所述连接部均呈直线状且共线。其中，所述第二段即为上述实施方式中所述包围空间内的部分所述开槽。在沿所述第一方向上进行观察，所述第一段位于所述天线投影区的外侧位置，并与所述第一表面边缘相连，所述第二段位于所述天线投影区的所述包围空间内，所述第一段与所述第二段通过所述第三段进行连通，所述第三段位于所述天线投影区。当所述天线处于工作频段时，在靠近所述天线的所述金属结构上，产生的感应电流必然会沿两个路径进行流动，其中一个感应电流流动路径为沿所述第一段边缘流动到所述金属结构的边缘，另一个感应电流流动路径为沿所述第二段的边缘进行流动，可以理解的是，在上述两个路径上，感应电流的流动方向与天线上电流的流动方向一致，也就是说，在此结构下，所述金属结构上位于所述天线内外两侧的位置，均会产生与所述天线上的电流方向相同的感应电流，从而进一步保证了所述天线的工作性能不被削弱，并得到一定程度的增强。其中，所述第二段位于所述包围空间内，所述第二段包括所述连接部和所述扩展部，所述连接部连接在所述第三段和所述扩展部之间，由上述实施方式的论述可知，在垂直于所述连接部的延伸方向上，所述扩展部的尺寸大于所述连接部的尺寸，所述扩展部具有更大的尺寸，使得所述包围空间内的部分所述开槽具有更大的面积，从而进一步提高了所述天线的工作性能，具体原理不再进行赘述。
本申请所述电子设备中，所述金属结构并不限定为某一具体的金属结构，还可以是任意部件上具有的金属材料区域。由于所述电子设备内部空间较小，上述任意部件上的金属材料区域与所述天线的距离均较小，且在所述第一方向上存在部分重叠，因此，在上述金属材料区域上均会产生与所述天线上电流方向相反的感应电流，从而对所述天线的工作性能造成影响，而在上述金属材料区域上设置所述开槽，则能减小感应电流对所述天线的不良影响，并改变部分感应电流的方向，使得所述金属结构的部分区域上，感应电流的方向与所述天线上的电流方向相同，从而在一定程度上增强所述天线的工作性能。
在一种实施方式中，所述电子设备还包括电子器件，所述电子器件上无法进行开槽处 理，所述金属结构设置在所述天线和所述电子器件之间。在所述金属结构上设置所述开槽，形成与所述天线上电流同向的感应电流，以减小所述电子器件对所述天线的影响，需要说明的是，所述电子设备中可能会存在一些不可开槽的电子器件，如电池等，开槽会破坏所述电子器件的功能，然而所述电子器件上存在的金属材料同样会对所述天线的性能造成影响，在此情况下，可在所述电子器件和所述天线之间添加所述金属结构，且在所述天线的工作频段，所述金属结构与所述电子器件之间电连接隔离，可以理解的是，所述电连接隔离包括但不限于物理绝缘隔离，还可以通过具有滤波特点的器件来进行对应工作频段的隔离。如果此处不形成电连接隔离，金属结构和电子器件连接之后，会形成一个“地”，那么金属结构上的开槽就不具备意义了。
由上述论述可知，由于所述电子设备内部空间较小，所述金属结构与所述天线靠近且在所述第一方向上至少部分重叠设置，按照上述结构要求，在所述金属结构上开设从所述金属结构边缘向所述金属结构内部延伸的非封闭的槽体，以形成所述开槽，所述开槽的存在，使得在所述金属结构上靠近所述天线的位置产生的感应电流，在经过所述开槽时，会分别流经所述开槽的边缘和所述金属结构的边缘，且经过所述开槽的边缘和所述金属结构的边缘的感应电流的方向与所述天线上电流的方向相同，从而有效提高了所述天线的工作性能，抵消了所述电子器件对所述天线性能的不良影响，且无需在所述电子器件上进行开槽，保证了所述电子器件的功能正常。
在一种实施方式中，所述电子设备内设主板，所述金属结构为所述主板上的接地层。由上述论述可知，由于所述电子设备内部空间较小，所述主板上所述接地层与所述天线靠近且在所述第一方向上至少部分重叠设置，所述主板的所述接地层上会产生与所述天线上电流方向相反的感应电流，也就是说，所述接地层即为本申请所述电子设备中的所述金属结构，在所述接地层上设置所述开槽，能有效减小所述接地层上感应电流对所述天线工作性能的不良影响，其中，所述接地层上感应电流的方向以及所述开槽的作用原理与上述实施方式所述的方向和原理相同，不再赘述。通常情况下，所述主板为多层结构，存在多个所述接地层，且多个所述接地层均与所述天线靠近且至少部分重叠设置，在此结构下，则需要对每一个所述接地层均进行开槽处理，这样才能够保证所述接地层上的感应电流不会对所述天线的工作性能造成较大的影响。同时，当所述主板上进行开槽处理后，可将必须的器件摆放至所述主板上的非开槽区域，则同样能够满足相应功能需求，不会导致所述电子设备的其他功能受到影响。
在一种实施方式中，所述电子设备内设摄像头模组，所述摄像头模组包括摄像头外壳和位于所述摄像头外壳内的摄像头本体，所述金属结构为所述摄像头外壳，所述摄像头外壳和所述摄像头本体之间设有绝缘材料。通常情况下，所述摄像头外壳由金属材料制成，在与上述实施方式中论述的相同原因下，所述摄像头外壳即为本申请所述电子设备中的所述金属结构，在所述摄像头外壳上设置所述开槽，能有效减小所述摄像头外壳上感应电流对所述天线工作性能的不良影响，其中，所述摄像头外壳上感应电流的方向以及所述开槽的作用原理与上述实施方式所述的方向和原理相同，不再赘述。需要说明的是，为避免所述摄像头的摄像功能受到影响，所述摄像头外壳内部的所述摄像头本体可以不进行开槽处理，但是为了避免所述摄像头本体对所述天线造成影响，应在所述摄像头外壳和所述摄像 头本体之间进行绝缘处理，如在所述摄像头本体和所述摄像头外壳之间设置绝缘材料，这样既不会影响所述摄像头的摄像功能，又不会对所述天线的工作性能造成不良影响。
在一种实施方式中，所述电子设备内设金属屏蔽罩和非金属屏蔽层，所述金属屏蔽罩用于遮罩电子器件，所述金属结构为所述金属屏蔽罩，所述非金属屏蔽层与所述金属屏蔽罩连接并覆盖所述开槽，以使所述非金属屏蔽层和所述金属屏蔽罩共同形成所述电子器件的电磁干扰防护结构。所述金属屏蔽罩的作用是屏蔽外界电磁波对内部电路的影响和/或屏蔽内部产生的电磁波向外辐射。一般情况下，金属屏蔽罩整体是由不锈钢和洋白铜制成，在与上述实施方式中论述的相同原因下，所述金属屏蔽罩即为本申请所述电子设备中的所述金属结构，在所述金属屏蔽罩上设置所述开槽，能有效减小所述金属屏蔽罩上感应电流对所述天线工作性能的不良影响，其中，所述金属屏蔽罩上感应电流的方向以及所述开槽的作用原理与上述实施方式所述的方向和原理相同，不再赘述。需要说明的是，在所述金属屏蔽罩上进行开槽，必然会对所述金属屏蔽罩的屏蔽性能在成一定的影响，因此，需在所述金属屏蔽罩上的开槽位置设置非金属屏蔽层，所述非金属屏蔽层与所述金属屏蔽罩连接并覆盖所述开槽，这样既能够保证所述屏蔽罩的屏蔽效果，又能避免对所述天线的工作性能造成不良影响。
综上可知，所述金属结构可以为任意部件上的金属部分，且在沿所述第一方向上，该金属部分与所述天线至少部分重叠，所述金属结构不仅限于上述列举的几种实施方式，还可以为其他部件上的金属部分，在此不进行具体的限定。
在一种实施方式中，所述电子设备还包括磁性件，所述磁性件设于所述金属结构背离所述天线的一侧，用于隔离所述金属结构与所述电子设备中的其他金属件。在所述金属结构背离所述天线的位置设置所述磁性件，主要用于隔离所述金属结构，避免所述金属结构与其他金属件连接在一起，可以理解的是，若所述金属结构与其他金属件连接在一起，所述金属结构与其他金属件会共同形成一个整体，而在原本所述金属结构上的所述开槽，可能会被其他金属件填充，或因结构改变而成为封闭开槽，或因其他一些原因，从而导致其无法改变感应电流的方向，也就无法避免所述天线的工作性能受到不良影响。
其中，所述磁性件由铁氧体制成，铁氧体是一种具有铁磁性的金属氧化物。就电特性来说，铁氧体的电阻率比金属、合金磁性材料大得多，而且还有较高的介电性能。铁氧体的磁性能还表现在高频时具有较高的磁导率，因而，铁氧体已成为高频弱电领域用途广泛的非金属磁性材料。根据公式B＝μ·H，其中B表示磁感应强度，μ表示磁导率，H表示磁场强度，当磁场强度H保持不变时，由于铁氧体的磁导率μ普遍较大，也就导致其磁感应强度B较大，也就可以说明，铁氧体对磁场具有聚集作用，因此，所述磁性件不仅可以起到隔离的作用，还能起到磁场聚集作用。需要说明的是，所述磁性件不仅限于由铁氧体制成，还可以由其他任意满足相应功能需求的磁性材料制成，在此不进行具体的限定。
需要说明的是，所述磁性件还可以同时设于所述天线和所述金属结构之间。将所述磁性件设置于所述天线和所述金属结构之间，主要是利用了所述磁性件的磁场聚集作用，当在该位置上增设磁性件之后，磁场会主要集中在所述磁性件上，并在通过所述磁性件之后形成闭合曲线。将所述磁性件设置在所述天线和所述金属结构之间，能够聚集磁场，减小所述金属结构对所述天线磁场的影响，从而保证所述天线具有良好的工作性能。其中，由 于在所述天线和所述金属结构之间设置所述磁性件，主要是利用了所述磁性件的磁场聚集作用，而不是利用所述磁性件来起到隔离的作用，因此，在此处的磁性件不需要覆盖隔离整个所述金属结构，为了降低成本，在一种具体的实施方式中，所述天线与所述金属结构之间的所述磁性件的形状大小，与所述天线的形状大小相匹配，即在垂直于所述第一表面的方向上，位于所述天线和所述金属结构之间的所述磁性件，在所述第一表面上的投影轮廓与所述天线在所述第一表面上的投影轮廓重合，使所述磁性件仅覆盖所述天线所在的区域。在此结构下，所述磁性件能够聚集磁场，减小所述金属结构对所述天线的不良影响，同时，还控制了所述磁性件的覆盖面积，降低了工艺成本。
可以理解的是，在实际应用中，根据所述天线的工作原理的不同，不同工作频段的所述天线在处于对应的工作频段时，对于所述金属结构的要求也是不同的，有些要求所述金属结构不接地，有些要求所述金属结构接地。一般情况下，对于一些工作频段较低的天线，即工作频段小于100M的所述天线，如近场通讯(Near Field Communication，NFC)天线，其工作时，需要利用金属进行辐射，因此，当处于其工作频段时，要求所述金属结构悬浮不接主板，否则所述金属结构就变成了一块地，从而无法达到辐射效果，使所述天线无法处于正常工作状态。而对于一些所述高频天线，即工作频段大于500M的所述天线，当处于其工作频段时，要求所述金属结构接地，如第二代移动通讯(2nd-Generation，2G)频段、第三代移动通讯(3rd-Generation，3G)频段、第四代移动通讯(4th-Generation，4G)频段、第五代移动通讯(5th-Generation，5G)频段、Wi-Fi频段和GPS频段等，当处于这些高频段时，若所述金属结构悬浮不接地，会对其对应的天线的工作性能造成一定的影响，因此需要所述金属结构接地，从而使所述金属结构作为地使用，避免了其对所述高频天线造成影响。
本申请所述电子设备中，所述天线主要指的是工作频段小于100M的天线，因此，需要保证所述金属结构不接地。
在一种实施方式中，本申请所述电子设备中，所述电子设备还包括主板，所述金属结构层叠设置在所述主板和所述天线之间，所述主板和所述金属结构之间设有磁性件，所述金属结构与所述主板之间形成悬浮不接地架构。在此结构下，所述金属结构悬浮不接地，满足了所述天线在其对应工作频段上对所述金属结构的要求。
在一种实施方式中，所述电子设备还包括主板，所述金属结构层叠设置在所述主板和所述天线之间，所述主板和所述金属结构之间设有磁性件，所述金属结构通过滤波器件电连接至所述主板的地，在所述天线的工作频段下，所述滤波器件具在高阻特征，从而隔离信号从所述天线传递至所述主板上。在此结构下，同样能够满足所述天线在其对应工作频段上对所述金属结构不接地的要求，并且，当所述电子设备中同时还存在工作频段大于500M的高频天线时，可设置所述滤波器在大于500M频段下处于低阻特性，使所述金属结构与所述主板的接地层在高频段时处于连通状态，这样还同时满足了所述高频段天线在其对应工作频段上对所述金属结构接地的要求，从而同时保证了所述天线和所述高频天线在各自工作频段时的工作性能。
可以理解的是，在本申请中，所述天线的工作频段定义为小于100M，所述高频段天线的工作频段定义为大于500M，对于不同的工作情况，所述天线和所述高频天线的具体工作 频段可以进行不同的划分，从而利用不同频段的不同特性做不同的处理。同时，所述滤波器可以为任意满足相应功能需求的形状结构，在此也不进行具体的限定。本申请所述电子设备中的所述天线包括但不限于近场通讯天线，其结构有多种，在此不进行一一赘述。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对本申请实施例中所需要使用的附图进行说明。
图1a是本申请实施例提供的电子设备的结构示意图。
图1b是图1a所示电子设备中金属支架的固定结构示意图。
图2a是传统电子设备中的一种形式的天线相关组件的结构示意图。
图2b是图2a所示天线相关组件上的电流分布示意图。
图3a是传统电子设备中的另一种形式的天线相关组件的结构示意图。
图3b是图3a所示天线相关组件上的电流分布示意图。
图4a是图1a所示电子设备中的天线相关组件在一种实施方式下的结构示意图。
图4b是图4a所示天线相关组件在另一种实施方式下的结构示意图。
图4c是图4b所示天线相关组件中天线投影区及包围空间的示意图。
图5a是图1a所示电子设备中的天线相关组件在另一种实施方式下的结构示意图。
图5b是图5a所示天线相关组件在另一种实施方式下的结构示意图。
图5c是图5b所示天线相关组件中天线投影区及包围空间的示意图。
图6a是图4b所示天线相关组件上的电流分布示意图。
图6b是图5b所示天线相关组件上的电流分布示意图。
图7a是图4b所示天线相关组件在A-A方向上的剖视图。
图7b是图5b所示天线相关组件在B-B方向上的剖视图。
图8a是磁性件应用于图7a所示天线相关组件中的结构示意图。
图8b是磁性件应用于图7b所示天线相关组件中的结构示意图。
图9a是图8a所示天线相关组件在一种实施方式下的结构示意图。
图9b是图8b所示天线相关组件在一种实施方式下的结构示意图。
图10a是使用图9a所述天线相关组件进行的传输系数仿真图。
图10b是图10a的传输系数结果对比图。
图11a是使用图9b所述天线相关组件进行的传输系数仿真图。
图11b是图11a的传输系数结果对比图。
图12a是本申请实施例提供的电子设备中金属结构在另一种实施方式下的结构示意图。
图12b是本申请实施例提供的电子设备中金属结构在第三种实施方式下的结构示意图。
图12c是本申请实施例提供的电子设备中金属结构在第四种实施方式下的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地 描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
首先请参阅图1a，图1a是本申请实施例提供的电子设备1000的结构示意图。
本申请实施例提供的电子设备1000包括且不限于手机、pos机、电脑或平板电脑，还可以为其他具有相应功能的电子设备1000，在此不进行具体的限定。本申请实施例提供的电子设备1000包括天线100、金属结构200、外壳300和射频模块400，外壳300内设有容置空间，天线100、金属结构200和射频模块400均装配于容置空间内。射频模块400与天线100电连接，用以向天线100收发电磁信号。天线100根据接收的电磁信号辐射电磁波或根据接收的电磁波向射频模块400发送电磁信号，从而实现信号的收发。由于电子设备1000需满足轻薄化、小型化的市场要求，外壳300内部的容置空间较小，金属结构200与天线100的间距较小，且存在至少部分重叠，当天线100处于工作状态时，金属结构200上会产生感应电流，对天线100的工作性能造成不良影响。
本申请实施例提供的电子设备1000中，在第一方向上，金属结构200、至少部分天线100及部分外壳300依次排列，参阅图1a，第一方向可以理解为垂直于纸面的方向。金属结构200与天线100之间可以为贴合的关系，即天线100贴合设置在金属结构200上；或者，在第一方向上，金属结构200和至少部分天线100之间均为绝缘介质，在这个区域内，不设置其它的金属件(或包括金属材质的结构件：例如摄像头模组、包括金属层的电路板等)，绝缘介质可以为空气，即金属结构200和天线100之间可以有空气相隔，即天线相对金属结构为悬浮状态，绝缘介质也可以为其它的非金属结构件；金属结构200设有非封闭的开槽20，在第一方向上，开槽20贯穿金属结构200；金属结构200包括在第一方向上正对天线100的第一表面201(如图4a)，天线100在第一表面201上的垂直投影为天线投影区，开槽20从第一表面201的边缘向第一表面201的内部延伸且经过天线投影区。天线100工作状态下，第一表面201上形成与天线100上的电流同向的感应电流。由于非封闭开槽20的存在，使得金属结构200上部分区域的感应电流的方向与天线100上电流的方向一致，即均为顺时针方向或均为逆时针方向，从而减小了感应电流对天线100磁场的不良影响，有效提高了天线100的工作性能。
其中，外壳300可以为非金属外壳，外壳300位于天线100的辐射路径上。其它实施方式中，外壳300也可以为金属外壳，但是需要在金属外壳上设置部分非金属区域，部分非金属区域用于提供信号收发的通道，可以理解地，在外壳300上开设天线缝的方式实现天线100的收发信号。
射频模块400(Radio Frequency module，AF module)为收发器(transmitter and/or receiver，T/R)等可以发射和/或接收射频信号的电路。天线100包括但不限于近场通讯(Near Field Communication，NFC)天线100，还可以为其他类型的天线100，在此不进行一一赘述，为了方便说明，本申请以近场通讯天线100为例来进行详细的描述。
其中，第一方向为金属结构200、至少部分天线100及部分外壳300依次排列重叠的方向，金属结构200包括第一表面201，第一表面201朝向外壳300，天线100位于第一表面201和外壳300之间，在第一方向上，天线100正对第一表面201。第一表面201可以 为平面状，第一表面201也可以为非平面，例如具有凹凸不平的部分，或者可以为弧形面等，本申请不对第一表面201的具体形态做限定。
其中，天线100和金属结构200至少部分重叠，即至少部分天线100位于第一表面201和外壳300之间，第一表面201和外壳300之间形成夹层空间，可以是天线100完全收容在夹层空间内，也可以是天线100的部分区域伸入夹层空间内与第一表面201正对设置，天线100还有部分区域位于夹层空间外部，没有与第一表面201正对设置。同时，非封闭开槽20指的是，在垂直于第一表面201的方向上，开槽20贯穿金属结构200，在第一表面201上，开槽20从第一表面201的边缘向第一表面201的内部延伸。
其中，天线100在第一表面201上的垂直投影为天线投影区，开槽20从第一表面201的边缘向第一表面201的内部延伸且经过天线投影区。可以理解为，天线100在第一表面201上的垂直投影区拦截开槽20，开槽20一部分位于天线100投影区的外侧，并与第一表面201的边缘连接，开槽20的另一部分位于天线100投影区的内侧。由于电流的连续性，在靠近天线100的金属结构200上产生的感应电流，在经过开槽20时必然会沿两个路径进行流动，其中一个感应电流流动路径为：沿位于天线100投影区外侧的部分开槽20边缘流动到金属结构200的边缘，另一个感应电流流动路径为：沿位于天线100投影区内侧的部分开槽20边缘进行流动，可以理解的是，在上述两个路径上，感应电流的流动方向与天线100上电流的流动方向一致，也就是说，在此结构下，金属结构200上位于天线100内外两侧的位置，均会产生与天线100上的电流方向相同的感应电流，从而保证了天线100的工作性能不被削弱，并得到一定程度的增强。
需要说明的是，金属结构200并不限定为在电子设备内与天线层叠设置的金属支架或金属板，还可以是电子设备内任意部件(例如摄像头、屏蔽盖等)上具有的金属材料区域。
参照图1b，以金属支架210为例，金属支架210为一体式结构，金属支架210包括支撑脚211和支撑板212，支撑脚211通过螺丝锁附在电路板501上，支撑板212用于承载天线100，天线100可以固定贴合在支撑板212背离电路板501的表面上，支撑板212的面积可以大于天线100的外轮廓，天线100全部或部分与支撑板212重叠，可以理解的是，还可以将支撑脚211焊接固定在电路板501上，以使金属支架210与电路板501之间的固定更加稳固，需要说明的是，金属支架210和电路板501之间的连接方式不仅限于以上两种，可以为任意能够满足相应功能的连接方式，并且，金属支架210的结构不仅限于一体式结构，还可以为分体式结构或任意满足相应功能的结构，在此不进行具体的限定。其中，电路板501可以是主板500上的电路板501，也可以是通过FPC与主板500相连的电路板501，同时，金属支架210固定在电路板501上后，金属支架210和电路板501之间存在一定的空间，可在此空间内设置一些电子元器件，通过金属支架210将其压紧稳定在电路板501上，提高了结构的稳定性。
由于外壳300内部的容置空间较小，任意部件上的金属材料区域与天线100之间的间隔距离均较小，且在第一方向上存在至少部分重叠，当天线100处于工作状态时，根据楞次定律，金属材料区域上必然会产生与天线100上电流方向相反的感应电流，从而对天线100的工作性能造成影响，而在金属材料区域上同样开设非封闭开槽20，则能减小感应电流对天线100的不良影响，并在一定程度上增强天线100的工作性能。
请一并参阅图2a、图2b、图3a、图3b，图2a是传统电子设备中的一种形式的天线100相关组件的结构示意图。图2b是图2a所示天线100相关组件上的电流分布示意图。图3a是传统电子设备中的另一种形式的天线100相关组件的结构示意图。图3b是图3a所示天线100相关组件上的电流分布示意图。
如图2a所示，常用的近场通讯天线100通常存在两种形式，一种是单端近场通讯天线100，通过一段走线与外壳300上的金属边框30结合形成，电子设备内设天线100、金属结构200、主板500、射频模块400和外壳300上的金属边框30，其中，金属边框30接地设置，射频模块400设置在主板500上，天线100的一端与金属边框30连接，另一端与射频模块400电连接，用于馈电，天线与金属边框30共同构成包围结构，此包围结构形成未封闭的包围空间，可视为半包围结构或部分包围结构。在此种天线100形式中，存在多种结构变形，如在一种实施方式中，天线100的一端接地设置，另一端与金属边框30连接，金属边框30不接地，而是与射频模块400电连接。
如图3a所示，另一种是线圈近场通讯天线100，天线100围绕形成线圈形式。电子设备内设天线100、金属结构200、主板500、和射频模块400，其中，射频模块400设置在主板500上，天线100围绕形成包围结构，此包围结构可以形成封闭的包围空间，可视为全封闭的包围结构，当然天线也可以围绕形成部分包围或半包围的结构，形成未封闭的包围空间，天线100两端与射频模块400电连接。在此种天线100形式中，同样存在多种结构变形。
综上，本申请所涉及的天线100在电子设备内构成包围结构，包围结构可以理解为部分包围或半包围或全包围结构，形成封闭的包围空间或不封闭的包围空间。可以理解地，本申请涉及的天线100的结构形式包括但不仅限于以上两种，而为了方便说明，本申请主要以上述两种形式的近场通讯天线100来进行详细的描述，并且天线100的结构可以存在多种变形结构，只需满足相应功能即可，在此不对多种变形结构进行一一赘述。
可以理解的是，在传统的电子设备中，由于电子设备需满足轻薄化、小型化的市场要求，无论是哪种形式的近场通讯天线100，其金属结构200与天线100的间距均较小，且在沿第一方向上，金属结构200、至少部分天线100及部分外壳300依次排列，当天线100处于工作状态时，金属结构200上会产生感应电流，如图2b和图3b所示，根据楞次定律可以得知，感应电流具有这样的方向，即感应电流的磁场总要阻碍引起感应电流的磁通量的变化，因此，在靠近天线100的金属结构200上产生的感应电流的方向，与天线100上的电流方向相反，即一个沿逆时针方向，另一个沿顺时针方向，相反方向的感应电流所产生的磁场会抵消一部分天线100的磁场，这样必然会在一定程度上削弱天线100的工作性能。
请一并参阅图4a、图4b和图4c，图4a是图1a所示电子设备1000中的天线100相关组件在一种实施方式下的结构示意图。图4b是图4a所示天线100相关组件在另一种实施方式下的结构示意图。图4c是图4b所示天线100相关组件中天线投影区202及包围空间203的示意图。
在本申请实施例提供的电子设备1000中，对于单端近场通讯天线100，其金属结构200可以为由金属材料制成的金属支架210，在金属支架210上开设从金属支架210第一表面 201边缘向第一表面201内部延伸的开槽20，在垂直于第一表面201的方向上，开槽20贯穿金属支架210，在此结构下，开槽20的边缘与金属支架210的边缘相连通，以使开槽20为非封闭开槽20，并且，开槽20经过天线100在第一表面201上的垂直投影区。
其中，天线100在第一表面201上的垂直投影区为天线投影区202，可以理解的是，无论是上述哪种形式的天线100，天线100的结构均为包围结构，当天线100为包围结构时，能够更好的满足相应信号传输功能。在本实施方式中，金属边框30可视为天线100的延伸，天线100和金属边框30共同形成包围结构，在第一方向上，天线100和金属边框30在第一表面201上共同形成的天线投影区202也会形成相应的包围空间203。
其中，开槽20经过天线投影区202，且开槽20被天线投影区202划分为第一段21、第二段22和第三段23，其中，第一段21位于天线投影区202和第一表面201的边缘之间，第一段21的边缘与第一表面201的边缘相连，进而与金属支架210的边缘连通，而第二段22位于天线投影区202形成的包围空间203之内，且第一段21与第二段22通过第三段23连通，即可以理解为，在沿垂直于第一表面201的方向上进行观察，第一段21位于天线投影区202的外侧位置，第二段22位于天线投影区202的内侧位置。需要说明的是，在金属支架210上，产生的感应电流通常称漩涡状分布，且越是靠近天线投影区202的位置，感应电流的强度越强，而当天线100拦截开槽20，使第一段21和第二段22分别位于天线投影区202的两侧位置时，在金属支架210上产生的强度较高的感应电流必然会流经开槽20，并沿两个路径进行流动，其中一个感应电流流动路径为沿第一段21边缘流动到金属支架210的边缘，然后沿金属支架210的边缘进行流动；另一个电流流动路径为沿第二段22的边缘进行流动，由电流的连续性可知，电流场内的电流线必定是头尾相接的闭合曲线，因此，在上述两个路径上，感应电流的流动方向与天线100上电流的流动方向一致，即均沿顺时针方向或均沿逆时针方向，也就是说，在此结构下，金属支架210上位于天线100内外两侧的位置，均会产生与天线100上的电流方向相同的感应电流，且在该方向上的感应电流的强度较强，从而减小了感应电流对天线100磁场的不良影响，有效提高了天线100的工作性能。
可以理解的是，开槽20的形状大小可以为多种，在此不进行具体的限定，以下对一种形状的开槽20进行举例说明。
如图4b所示，第二段22包括连接部221和扩展部222，连接部221连接在第三段23和扩展部222之间，第一段21、第三段23和连接部221共同构成同向延伸的条形槽，在垂直条形槽的延伸方向上，扩展部222的尺寸大于连接部221的尺寸。在上述结构下，天线100内侧位置的第二段22具有较大的面积，则在第二段22上的感应电流流动的路径更长，则感应电流产生的磁场范围更大，由上述论述可知，在第二段22上的感应电流的流向与天线100上电流的流向相同，因此，当第二段22上的感应电流产生的磁场范围更大时，其对天线100的磁场具有更好的增益效果，从而进一步提高了天线100的工作性能。
可以理解的是，开槽20的形状和大小可以根据电子设备1000内部结构的要求进行设置，也可以与天线100的形状大小相对应，可以通过调整开槽20的形状和大小来调节金属支架210对天线100工作性能的影响，在此不对开槽20的形状大小进行具体的限定。
请一并参阅图5a、图5b和图5c，图5a是图1a所示电子设备1000中的天线100相关 组件在另一种实施方式下的结构示意图。
图5b是图5a所示天线100相关组件在另一种实施方式下的结构示意图。
图5c是图5b所示天线100相关组件中天线投影区202及包围空间203的示意图。
在本申请实施例提供的电子设备1000中，对于线圈近场通讯天线100，其金属结构200同样可以为由金属材料制成的金属支架210，同样在金属支架210上开设从金属支架210边缘向金属支架210内部延伸的非封闭开槽20。在靠近天线100的金属支架210上产生的感应电流，在经过非封闭开槽20时，感应电流会沿开槽20的边缘和金属支架210的边缘进行流动，而沿上述两个路径进行流动的感应电流的方向与天线100上电流的方向相同，从而减小了感应电流对天线100工作性能的不良影响。
可以理解的是，对于两种形式的天线100结构，其相关组件中：
金属支架210可以具有相同的形状结构；
金属支架210上非封闭开槽20的位置状态是相同的，即开槽20是由金属支架210上第一表面201的边缘延伸至第一表面201的内部设置，且在垂直于第一表面201的方向上，开槽20贯穿金属支架210；同时，开槽20经过天线100在第一表面201上的天线投影区202，且开槽20被天线投影区202同样划分为相连通的第一段21、第二段22和第三段23；同样的，可以将第二段22设置为连接部221和扩展部222，以进一步改善天线100的工作性能。
开槽20所起到的技术效果是相同的，即在靠近天线100的金属支架210上产生的感应电流，在经过非封闭开槽20时，感应电流会沿开槽20的边缘和金属支架210的边缘这两个路径进行流动，而沿上述两个路径进行流动的感应电流的方向与天线100上电流的方向相同，即都是沿顺时针方向或都是沿逆时针方向，从而减小了感应电流对天线100磁场的干扰，有效提高了天线100的工作性能；
由此可知，对于两种形式的天线100结构，其金属支架210及开槽20具有相同的实施方式以及同样的功能作用，所以不再进行赘述。并且，在实际应用过程中，当天线100为包围结构时，能够更好的满足相应信号传输功能，在此结构下，天线100在第一表面201上的天线投影区202必然会形成包围空间203，当扩展部222延伸到包围空间203之外时，包围空间203内部其他金属产生的感应电流无法被抵消，会减弱天线100的工作性能，因此，为保证金属支架210上的感应电流产生的磁场，对天线100的磁场具有更好的增益效果，应使扩展部222位于包围空间203内。
请一并参阅图6a和图6b，图6a是图4b所示天线100相关组件上的电流分布示意图。
图6b是图5b所示天线100相关组件上的电流分布示意图。
如图所示，其中箭头方向即为天线100电流及金属支架210上的感应电流的流动方向，通过看图可知，金属支架210上，在靠近天线100的位置所产生的感应电流较为密集，强度较强，且此处感应电流的方向与天线100上电流的方向相反，符合楞次定律，而感应电流在经过开槽20时，由于电流的连续性，会沿两个路径进行流动，其中一个感应电流流动路径为沿第一段21边缘流动到金属支架210的边缘，然后沿金属支架210的边缘进行流动；另一个电流流动路径为沿第二段22的边缘进行流动，在上述两个路径上，感应电流的流动方向与天线100上电流的流动方向一致，即均沿逆时针方向，也就是说，在本申请实施例 提供的电子设备1000中，金属支架210上位于天线100内外两侧的位置，均会产生与天线100上的电流方向相同的感应电流。对比图2b和图3b，可以清楚的说明，金属支架210上非封闭开槽20的存在，能改变金属支架210上一部分感应电流的流动方向，从而减小了感应电流对天线100磁场的不良影响，有效提高了天线100的工作性能。
请一并参阅图7a、图7b、图8a和图8b，图7a是图4b所示天线100相关组件在A-A方向上的剖视图。
图7b是图5b所示天线100相关组件在B-B方向上的剖视图。
图8a是磁性件600应用于图7a所示天线100相关组件中的结构示意图。
图8b是磁性件600应用于图7b所示天线100相关组件中的结构示意图。
在一种实施方式中，本申请实施例提供的电子设备1000还包括磁性件600，磁性件600设于金属支架210背离天线100的位置，金属支架201位于天线100和磁性件600之间，以使金属支架201与电子设备1000中的其他金属件相隔离。在金属支架210背离天线100的位置设置磁性件600，主要用于隔离金属支架210，避免金属支架210与其他金属件连接在一起，可以理解的是，若金属支架210与其他金属件连接在一起，金属支架210与其他金属件会共同形成一个整体，而在原本金属支架210上的开槽20，可能会被其他金属件填充，或因结构改变而成为封闭开槽20，或因其他一些原因，从而导致其无法改变感应电流的方向，也就无法避免天线100的工作性能受到不良影响。
其中，磁性件600由铁氧体制成，铁氧体是一种具有铁磁性的金属氧化物。就电特性来说，铁氧体的电阻率比金属、合金磁性材料大得多，而且还有较高的介电性能。铁氧体的磁性能还表现在高频时具有较高的磁导率，因而，铁氧体已成为高频弱电领域用途广泛的非金属磁性材料。根据公式B＝μ·H，其中B表示磁感应强度，μ表示磁导率，H表示磁场强度，当磁场强度H保持不变时，由于铁氧体的磁导率μ普遍较大，也就导致其磁感应强度B较大，也就可以说明，铁氧体对磁场具有聚集作用，因此，磁性件600不仅可以起到隔离的作用，还能起到磁场聚集作用。需要说明的是，磁性件600不仅限于由铁氧体制成，还可以由其他任意满足相应功能需求的磁性材料制成，在此不进行具体的限定。
需要说明的是，根据天线100的工作原理的不同，不同工作频段的天线100在处于对应的工作频段时，对于金属支架210的要求也是不同的，有些要求金属支架210悬浮不接主板500，有些要求金属支架210接地。一般情况下，对于一些工作频段较低的天线100，即工作频段小于100M的天线100，如近场通讯天线100，其工作时，需要利用金属进行辐射，因此，当处于其工作频段时，要求金属支架210悬浮不接主板500，否则金属支架210就变成了一块地，从而无法达到辐射效果，使天线100无法处于正常工作状态。而对于一些工作频段较高的天线100，即工作频段大于500M的天线100，当处于其工作频段时，要求金属支架210接地，如2G频段、3G频段、4G频段、5G频段、Wi-Fi频段和GPS频段等，当处于这些高频段时，若金属支架210悬浮不接地，会对其对应的天线100的工作性能造成一定的影响，因此需要金属支架210接地，从而使金属支架210作为地使用，避免了其对工作频段较高的天线100造成影响。
因此，为满足上述不同的情况，金属支架210与主板500之间的连接关系也不同。
在一种实施方式中，金属支架210层叠设置在500主板和天线100之间，主板500和 金属支架210之间设有磁性件600，金属结构与主板之间形成悬浮不接地架构。在此结构下，金属支架210与主板500间隔设置，且金属支架210不与主板500相连接，金属支架210悬浮不接地，以满足一部分低频段天线100在其对应工作频段上对金属结构200的要求。
在一种实施方式中，主板500包括接地层(图未示)，金属支架210层叠设置在500主板和天线100之间，主板500和金属支架210之间设有磁性件600，主板500和金属支架210之间还设置有滤波器(图未示)，金属支架210通过滤波器与接地层连接，滤波器在不同频段下处于不同的电阻特性，以使在不同的天线100工作频段下，金属支架210与主板500的接地层对应呈连通或断开状态。其中，当滤波器在小于100M的频段下时，滤波器呈高阻特性，使得金属支架210与主板500不连接，以满足一部分低频段天线100在其对应工作频段上对金属支架210的要求；当滤波器在大于500M的频段下时，滤波器呈低阻特性，使得金属支架210与主板500的接地层连接，使金属支架210接地，以满足一部分高频段天线100在其对应工作频段上对金属支架210的要求。
可以理解的是，在本实施方式中，低频段的天线100的工作频段定义为小于100M，高频段的天线100的工作频段定义为大于500M，对于不同的工作情况，对于低频段和高频段可以进行不同的划分，从而利用不同频段的不同特性做不同的处理。同时，滤波器可以为任意满足相应功能需求的形状结构，在此也不进行具体的限定。
请一并参阅图9a和图9b，图9a是图8a所示天线100相关组件在一种实施方式下的结构示意图。
图9b是图8b所示天线100相关组件在一种实施方式下的结构示意图。
在一种实施方式中，磁性件600还设于天线100和金属支架210之间。将磁性材料设置于天线100和金属支架210之间，主要是利用了磁性件600的磁场聚集作用，当在该位置上增设磁性件600之后，磁场会主要集中在磁性件600上，并在通过磁性件600之后形成闭合曲线。将磁性件600设置在天线100和金属支架210之间，能够聚集磁场，减小金属支架210对天线100磁场的影响，从而保证天线100具有良好的工作性能。其中，由于在天线100和金属支架210之间设置磁性件600，主要是利用了磁性件600的磁场聚集作用，而不是利用磁性件600来起到隔离的作用，因此，在此处的磁性件600不需要覆盖隔离整个金属支架210，为了降低成本，在一种具体的实施方式中，天线100与金属支架210之间的磁性件600的形状大小，与天线100的形状大小相匹配，使磁性件600仅覆盖天线100所在的区域。在此结构下，磁性件600能够聚集磁场，减小金属支架210对天线100的不良影响，同时，还控制了磁性件600的覆盖面积，降低了工艺成本。
请一并参阅图10a、图10b、图11a和图11b，图10a是使用图9a天线100相关组件进行的传输系数仿真图。
图10b是图10a的传输系数结果对比图。
图11a是使用图9b天线100相关组件进行的传输系数仿真图。
图11b是图11a的传输系数结果对比图。
通过在天线100上设置线圈耦合天线110，测试从天线100上第一端口传输到线圈耦合天线110上第二端口的信号的大小，来对比传统电子设备与本申请实施例提供的电子设备 1000中，天线100的工作性能差距。由图10b和图11b可知，本申请电子设备1000中天线100的传输系数S1,2，大于传统电子设备中天线100的传输系数S1,2，也就是说，本申请电子设备1000中的天线100的工作性能优于传统电子设备中天线100的工作性能。从而进一步说明，金属支架210上非封闭的开槽20的存在，能改变金属支架210上一部分感应电流的流动方向，从而减小了感应电流对天线100磁场的不良影响，有效提高了天线100的工作性能。
可以理解的是，本申请实施例提供的电子设备1000中，金属结构200包括但不仅限于由金属材料制成的金属支架210，还可以为主板500上的金属材料、摄像头外壳71上的金属材料、金属屏蔽罩800上的金属材料，以及任意部件上的金属材料，在此不进行具体的限定。
请一并参阅图12a、图12b和图12c，图12a是本申请实施例提供的电子设备1000中金属结构200在另一种实施方式下的结构示意图。
图12b是本申请实施例提供的电子设备1000中金属结构200在第三种实施方式下的结构示意图。
图12c是本申请实施例提供的电子设备1000中金属结构200在第四种实施方式下的结构示意图。
如图12a所示，主板500为多层结构，当主板500存在多个有金属材料制成的接地层510时，上述多个接地层510即为本申请电子设备1000中的金属结构200，在此结构下，则需要对每个接地层510均进行开槽20处理，这样才能够保证接地层510上的感应电流不会对天线100的工作性能造成较大的影响。同时，当主板500上进行开槽20处理后，可将必须的器件摆放至主板500上的非开槽20区域，则同样能够满足相应功能需求，不会导致电子设备1000的其他功能受到影响。
如图12b所示，电子设备1000还包括摄像头模组70，摄像头模组70包括摄像头外壳71和摄像头本体72，摄像头外壳71包括金属材料(图未示)，在与上述实施方式中论述的相同原因下，摄像头外壳71上金属材料的存在，会对天线100的工作性能造成不良影响，在此情况下，需在金属材料上开设从金属材料边缘向金属材料内部延伸的非封闭的槽体，以形成开槽20，开槽20的存在，可以保证天线100的工作性能不被削弱，还在一定程度上得到了增强。可以理解的是，在一些情况下，摄像头外壳71可以整体是由金属材料制成，在这些情况下，摄像头外壳71整体为本申请电子设备1000中的金属结构200，为避免摄像头外壳71上产生的感应电流对天线100的工作性能造成不良影响，需在摄像头外壳71上开设从摄像头外壳71边缘向摄像头外壳71内部延伸的非封闭的槽体，以形成开槽20，从而避免天线100的工作性能受到不良影响。需要说明的是，为避免摄像头的摄像功能受到影响，摄像头外壳71内部的摄像头本体72可以不进行开槽20处理，但是为了避免摄像头本体72对天线100造成影响，应在摄像头外壳71和摄像头本体72之间进行绝缘处理，如设置绝缘材料73，这样既不会影响摄像头的摄像功能，又不会对天线100的工作性能造成不良影响。
如图12c所示，电子设备1000还包括金属屏蔽罩800，金属屏蔽罩800包括金属材料(图未示)，金属材料即为金属结构200，在金属材料上开设从金属材料边缘向金属材料内 部延伸的非封闭的槽体，以形成开槽20。金属屏蔽罩800的作用是屏蔽外界电磁波对内部电路的影响和/或屏蔽内部产生的电磁波向外辐射。一般情况下，金属屏蔽罩800整体是由不锈钢和洋白铜制成，因此，通常情况下金属屏蔽罩800本身即为本申请电子设备1000中的金属结构200，在金属屏蔽罩800上开设从金属屏蔽罩800边缘向金属屏蔽罩800内部延伸的非封闭的槽体，以形成开槽20，使得靠近天线100位置的金属屏蔽罩800上产生的感应电流，在经过开槽20时，由于电流的连续性，感应电流会分别沿开槽20的边缘和金属屏蔽罩800的边缘进行流动，而在沿开槽20的边缘和金属屏蔽罩800的边缘进行流动的感应电流方向，与天线100上的电流方向相同，从而避免了感应电流对天线100上电流产生的磁场造成不良影响，进而保证了天性具有良好的工作性能。需要说明的是，在金属屏蔽罩800上进行开槽20，必然会对金属屏蔽罩800的屏蔽性能在成一定的影响，因此，需在金属屏蔽罩800上的开槽20位置设置非金属屏蔽层80，非金属屏蔽层80与金属屏蔽罩800连接并覆盖开槽20，这样既能够保证金属屏蔽罩800的屏蔽效果，又能避免对天线100的工作性能造成不良影响。

Claims (12)

  1. 一种电子设备，其特征在于，所述电子设备包括外壳、收容于外壳内的天线和金属结构，在第一方向上，所述金属结构、至少部分所述天线及部分所述外壳依次排列；所述天线贴合至所述金属结构，或者所述金属结构和所述天线之间均为绝缘介质；所述金属结构设有非封闭的开槽，在所述第一方向上，所述开槽贯穿所述金属结构；所述金属结构包括在所述第一方向上正对所述天线的第一表面，所述天线在所述第一表面上的垂直投影为天线投影区，所述开槽从所述第一表面的边缘向所述第一表面的内部延伸且经过所述天线投影区。
  2. 如权利要求1所述的电子设备，其特征在于，在所述天线工作状态下，所述第一表面上形成与所述天线上的电流同向的感应电流。
  3. 如权利要求1或2所述的电子设备，其特征在于，所述天线投影区形成包围空间，部分所述开槽位于所述包围空间内。
  4. 如权利要求3所述的电子设备，其特征在于，位于所述包围空间内的部分所述开槽包括连接部和扩展部，所述连接部在所述天线投影区的内边缘和所述扩展部之间延伸，在垂直于所述连接部的延伸方向上，所述扩展部的尺寸大于所述连接部的尺寸。
  5. 如权利要求4所述的电子设备，其特征在于，所述开槽包括依次连接的第一段、第三段和第二段，所述第一段位于所述天线投影区和所述第一表面的边缘之间，所述第三段位于所述天线投影区，所述第二段位于所述包围空间内，所述第二段包括所述连接部和所述扩展部，所述连接部连接在所述第三段和所述扩展部之间，所述第一段、所述第三段和所述连接部均呈直线状且共线。
  6. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括电子器件，所述电子器件上无法进行开槽处理，所述金属结构设置在所述天线和所述电子器件之间。
  7. 如权利要求1所述的电子设备，其特征在于，所述电子设备内设主板，所述金属结构为所述主板上的接地层。
  8. 如权利要求1所述的电子设备，其特征在于，所述电子设备内设摄像头模组，所述摄像头模组包括摄像头外壳和位于所述摄像头外壳内的摄像头本体，所述金属结构为所述摄像头外壳，所述摄像头外壳和所述摄像头本体之间设有绝缘材料。
  9. 如权利要求1所述的电子设备，其特征在于，所述电子设备内设金属屏蔽罩和非金属屏蔽层，所述金属屏蔽罩用于遮罩电子器件，所述金属结构为所述金属屏蔽罩，所述非金属屏蔽层与所述金属屏蔽罩连接并覆盖所述开槽，以使所述非金属屏蔽层和所述金属屏蔽罩共同形成所述电子器件的电磁干扰防护结构。
  10. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括磁性件，所述磁性件设于所述金属结构背离所述天线的一侧，用于隔离所述金属结构与所述电子设备中的其他金属件。
  11. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括主板，所述金属结构层叠设置在所述主板和所述天线之间，所述主板和所述金属结构之间设有磁性件，所述金属结构与所述主板之间形成悬浮不接地架构。
  12. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括主板，所述金属结构层叠设置在所述主板和所述天线之间，所述主板和所述金属结构之间设有磁性件，所述金属结构通过滤波器件电连接至所述主板的地，在所述天线的工作频段下，所述滤波器件具高阻特性。
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CN113708054A (zh) 2021-11-26
CN113708054B (zh) 2023-04-04
US20230198125A1 (en) 2023-06-22

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