WO2022022314A1 - 一种封装模组及其封装方法、电子设备 - Google Patents

一种封装模组及其封装方法、电子设备 Download PDF

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Publication number
WO2022022314A1
WO2022022314A1 PCT/CN2021/107095 CN2021107095W WO2022022314A1 WO 2022022314 A1 WO2022022314 A1 WO 2022022314A1 CN 2021107095 W CN2021107095 W CN 2021107095W WO 2022022314 A1 WO2022022314 A1 WO 2022022314A1
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WO
WIPO (PCT)
Prior art keywords
conductive
pillars
conductive pillars
sidewall
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/107095
Other languages
English (en)
French (fr)
Inventor
姬忠礼
刘绪磊
胡丰田
张洪武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to KR1020237005169A priority Critical patent/KR102792080B1/ko
Priority to EP21851432.1A priority patent/EP4184574A4/en
Priority to JP2023506142A priority patent/JP7507960B2/ja
Publication of WO2022022314A1 publication Critical patent/WO2022022314A1/zh
Priority to US18/161,227 priority patent/US12532744B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/098—Manufacture or treatment of dielectric parts thereof by filling between adjacent conductive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/273—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being between laterally adjacent chips, e.g. walls between chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Definitions

  • the present application relates to the field of electronic technology, and in particular, to a packaging module, a packaging method thereof, and electronic equipment.
  • Wi-Fi mobile hotspot
  • Bluetooth transceivers in electronic devices are often placed adjacent to each other.
  • the interference signal generated by the Wi-Fi transceiver during operation can interfere with the operation of the Bluetooth transceiver.
  • the interference signal generated by the Bluetooth transceiver during operation will also interfere with the work of the Wi-Fi transceiver.
  • system-in-a-package In order to reduce electromagnetic interference between adjacent components and reduce the space occupied by modules used for electromagnetic shielding in electronic equipment, system-in-a-package (SIP) is expected to become the mainstream electromagnetic shielding solution.
  • SIP system-in-a-package
  • the Wi-Fi transceiver 3 and the Bluetooth transceiver 2 are arranged on the same surface of the substrate 1.
  • the outer surface of the package is provided with a metal layer 4 , and the metal layer 4 and the substrate 1 form a space for accommodating the Wi-Fi transceiver 3 and the Bluetooth transceiver 2 .
  • a metal partition wall 5 is further arranged between the Wi-Fi transceiver 3 and the Bluetooth transceiver 2 , and the metal partition wall 5 can divide the above space into two independent subspaces.
  • One of the subspaces can accommodate the Wi-Fi transceiver 3, and the other subspace can accommodate the Bluetooth transceiver 2.
  • Plastic compound 6 is also filled between the Wi-Fi transceiver 3 and the metal partition wall 5 and between the Bluetooth transceiver 2 and the metal partition wall 5 .
  • the metal partition walls 5 are mostly made of conductive adhesive, but the current conductive adhesive mostly contains precious metal materials such as gold and silver, which makes the cost of the conductive adhesive relatively high, which is not conducive to reducing the process cost of the system level packaging.
  • the electrical conductivity of conductive adhesives is lower, and the electromagnetic shielding effect is not ideal. The blocking requirement could not be met.
  • the present application provides an encapsulation module, an encapsulation method thereof, and an electronic device, aiming at improving the shielding effect of the encapsulation module.
  • an encapsulation module is provided.
  • the encapsulation module is used in electronic equipment to improve the shielding effect of the encapsulation module.
  • the packaging module includes a substrate for carrying devices, and at least two device groups disposed on the substrate, where the at least two device groups are different device groups that require electromagnetic isolation.
  • the package module also includes a shielding structure for shielding the at least two device groups.
  • the shielding structure includes isolation walls for electromagnetically isolating each adjacent two device groups.
  • the isolation wall provided by the present application at least includes a conductive column and a conductive adhesive, wherein the conductivity of the conductive column is greater than that of the conductive adhesive.
  • the number of conductive pillars is plural, and the plurality of conductive pillars are electrically connected to the ground layer of the substrate.
  • the plurality of conductive pillars are arranged at intervals during arrangement, and there is a gap between any adjacent conductive pillars.
  • the conductive glue is filled in the gap between any adjacent conductive columns, and any adjacent conductive columns are electrically connected through the conductive glue, so that the conductive column and the conductive glue form a structure similar to a wall, and the two device groups are assembled. Electromagnetic isolation. It can be seen from the above description that the separation wall is formed by the conductive column and the conductive glue.
  • the conductivity of the conductive column is higher than that of the conductive glue, so the conductivity of the separation wall is improved.
  • the use of conductive pillars as a part of the isolation wall can reduce the amount of conductive adhesive used, reduce the cost of the entire shielding structure, and then reduce the cost of the entire package module.
  • the shielding structure further includes a shielding cover, the shielding cover faces at least part of the surface of the substrate and is electrically connected to the ground layer of the substrate, and the at least two device groups are located in the The shielding cover and the substrate are in the space enclosed; the conductive adhesive is electrically connected with the shielding cover.
  • a space for accommodating at least two electrical groups is formed by the shielding cover and the base plate.
  • the conductive post is in contact with the inner wall of the shielding case. Realize the connection between the separation wall and the shield.
  • a gap is spaced between the conductive post and the shielding case, and the conductive glue fills the gap between the shielding case and the conductive post.
  • the electrical connection between the isolation wall and the shield can be achieved in different ways.
  • the gap when there is a gap between the conductive column and the shield, the gap is less than or equal to 300 ⁇ m.
  • the conductive column has a certain height, which can improve the isolation effect of the partition wall.
  • the spacing between the conductive pillars is greater than or equal to 50 ⁇ m and less than or equal to 100 ⁇ m.
  • the density of the conductive columns is increased, and the shielding effect of the partition wall is improved.
  • the conductive pillars can be pillars of different shapes such as rectangular pillars, elliptical pillars, and cylinders.
  • the shielding effect of the partition wall can be improved by conducting columns of different shapes.
  • the diameter of the conductive column is greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m. It is ensured that the conductive column has a certain volume and the shielding effect of the partition wall is improved.
  • the plurality of conductive pillars are arranged in multiple rows, and the direction of the rows is the length direction of the partition wall;
  • the packaging module further includes a plastic packaging body, and the at least two The device groups are all encapsulated in the plastic encapsulation body, and a part of the sidewall of each conductive column is wrapped by the plastic encapsulation body; there is a slot between two adjacent rows of conductive columns, and part of the sidewall of each conductive column is exposed In the groove; the conductive glue is filled in the groove, and wraps a part of the sidewall of each conductive column exposed in the groove. By filling the conductive glue into the groove body, the electrical connection between the conductive column and the conductive glue is realized.
  • the plurality of conductive pillars are arranged in two rows, and the conductive pillars in the two rows of conductive pillars are aligned one by one; or, the plurality of conductive pillars are arranged in two rows, and all conductive pillars are arranged in two rows.
  • the conductive pillars in the two rows of conductive pillars are dislocated.
  • the conductive pillars can be arranged in different ways.
  • the plurality of conductive pillars are arranged in multiple rows, and the direction of the rows is the length direction of the partition wall;
  • the packaging module further includes a plastic packaging body, the at least two device groups are both plastically sealed in the plastic packaging body, and a part of the sidewall of each conductive column is wrapped by the plastic packaging body; each adjacent four conductive There is a filling hole between the columns, and part of the sidewall of each conductive column is exposed in the corresponding filling hole; the conductive glue is filled in each filling hole, and the conductive glue wraps each conductive column and is exposed in the corresponding filling hole. part of the sidewall of the filled hole.
  • the electrical connection between the conductive column and the conductive glue is realized by arranging the filling hole and filling the conductive glue into the filling hole.
  • the packaging module further includes a plastic packaging body, the at least two device groups are plastically packaged in the plastic packaging body, and each conductive pillar is Part of the sidewall is wrapped by the plastic package; there is a filling hole between every two adjacent conductive pillars, and part of the sidewall of each conductive pillar is exposed in the corresponding filling hole; the conductive glue is filled in each The hole is filled, and the conductive glue wraps a part of the sidewall of each conductive column exposed in the corresponding filling hole.
  • the electrical connection between the conductive column and the conductive glue is realized by arranging the filling hole and filling the conductive glue into the filling hole.
  • the ratio of the volume of the plurality of conductive pillars to the volume of the partition wall is greater than or equal to 10% and less than or equal to 30%.
  • the proportion of conductive columns in the partition wall is guaranteed, the conductivity of the partition wall is improved, and the shielding effect of the partition wall is improved.
  • an electronic device which can be a mobile terminal such as a mobile phone, a tablet computer, a smart watch, etc.
  • the electronic device includes a circuit board, and the packaging module described in any of the above, the packaging module The group is fixed on the circuit board.
  • the separation wall is formed by the conductive column and the conductive glue.
  • the conductivity of the conductive column is greater than that of the conductive glue, the conductivity of the separation wall is improved;
  • using the conductive column as a part of the isolation wall can reduce the usage of conductive adhesive, reduce the cost of the entire shielding structure, and further reduce the cost of the entire package module.
  • the circuit board of the electronic device is the substrate of the packaging module.
  • the structure in the electronic device is simplified.
  • a method for preparing an encapsulation module comprising the following steps:
  • At least two device groups are arranged on the substrate;
  • a plurality of conductive pillars electrically connected to the ground layer of the substrate are arranged on the substrate; wherein, the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each adjacent two device groups;
  • the conductive pillars and the conductive glue electromagnetically isolate each adjacent two device groups.
  • the separation wall is formed by the conductive column and the conductive glue.
  • the conductivity of the conductive column is greater than that of the conductive glue, the conductivity of the separation wall is improved;
  • using the conductive column as a part of the isolation wall can reduce the usage of conductive adhesive, reduce the cost of the entire shielding structure, and further reduce the cost of the entire package module.
  • a plurality of conductive pillars electrically connected to the ground layer of the substrate are provided on the substrate; wherein, the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars connect each Two adjacent device groups are isolated; specifically:
  • the plurality of conductive pillars are arranged in multiple rows;
  • a plastic package is arranged to wrap the at least two device groups and the plurality of conductive pillars;
  • a conductive glue is filled in the groove, and the conductive glue wraps a part of the sidewall of each conductive column exposed in the groove.
  • a plurality of conductive pillars electrically connected to the ground layer of the substrate are provided on the substrate; wherein, the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars connect each Two adjacent device groups are isolated; specifically:
  • the plurality of conductive pillars are arranged in multiple rows;
  • a plastic package is arranged to wrap the at least two device groups and the plurality of conductive pillars;
  • a filling hole is opened between each of the four adjacent conductive pillars, a part of the sidewall of each conductive pillar is wrapped by the plastic package, and part of the sidewall is exposed in the corresponding filling hole;
  • a conductive glue is filled in the filling hole, and the conductive glue wraps a part of the sidewall of each conductive column exposed in the corresponding filling hole.
  • a plurality of conductive pillars electrically connected to the ground layer of the substrate are provided on the substrate; wherein, the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars connect each Two adjacent device groups are isolated; specifically:
  • the plurality of conductive pillars are arranged in a row
  • a plastic package is arranged to wrap the at least two device groups and the plurality of conductive pillars;
  • a filling hole is opened between each adjacent two conductive pillars, part of the sidewall of each conductive pillar is wrapped by the plastic package, and part of the sidewall is exposed in the corresponding filling hole;
  • a conductive glue is filled in the filling hole, and the conductive glue wraps a part of the sidewall of each conductive column exposed in the corresponding filling hole.
  • FIG. 1 is a schematic structural diagram of a packaging module in the prior art
  • FIG. 2a is a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • 2b is a top view of a partition wall of a package module provided by an embodiment of the present application.
  • FIG. 3 is a graph of the corresponding relationship between the electrical conductivity and the shielding effect of the material provided in the embodiment of the present application;
  • 5a is a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • 5b is a top view of a partition wall of a package module provided by an embodiment of the present application.
  • 6a is a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • 6b is a top view of a partition wall of a package module provided by an embodiment of the present application.
  • FIG. 7a is a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • FIG. 7b is a top view of a partition wall of a package module provided by an embodiment of the present application.
  • FIG. 8a is a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • FIG. 8b is a top view of a partition wall of a package module provided by an embodiment of the present application.
  • 9a is a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • 9b is a top view of a partition wall of a package module provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a smart watch provided by an embodiment of the present application.
  • the packaging module is applied to electronic devices with communication functions, such as compact and portable electronic devices (such as smart phones, smart watches, wireless routers, etc.). These electronic devices include devices that are susceptible to RF interference, such as Wifi, Bluetooth, and cellular signal-related RF transceiver circuits, as well as other devices that require clock signals, such as processors, memory, and more. These devices may cause electromagnetic interference with each other during normal operation. In order to protect the device from electromagnetic interference, some circuits (such as radio frequency transceivers) can be wrapped with a metal shield and integrated into a package module to block signals and shield electromagnetic interference.
  • RF interference such as Wifi, Bluetooth, and cellular signal-related RF transceiver circuits
  • the embodiment of the present application provides a packaging module with improved isolation effect, and the packaging module provided by the embodiment of the present application will be described below with reference to the accompanying drawings and specific embodiments.
  • FIG. 2a shows a cross-sectional view of a packaging module provided by an embodiment of the present application.
  • the package module includes a substrate 10, a device on the carrier substrate 10, and a shielding structure (not marked in the figure) for shielding the device.
  • the shielding structure is used to electromagnetically isolate the devices, so as to shield between the devices or between the devices and the external environment.
  • the above-mentioned device may be a radio frequency transceiver circuit related to Wifi, Bluetooth, or cellular signals, or a device using a clock signal, such as a processor, a memory, and the like.
  • the substrate 10 may employ various types of substrates, such as a printed circuit board or a circuit-laminated board layer.
  • the substrate 10 has a bearing surface, and the bearing surface may be two opposite surfaces on the substrate 10 , or one of the surfaces thereof.
  • the device When disposing the device, the device may be disposed on the carrier surface and electrically connected with the circuit layer of the substrate 10 .
  • the circuit layers include metal layers disposed on or within the substrate 10, and pads for electrical connection with devices and shielding structures. When the shielding structure is provided, the shielding structure can be electrically connected to the ground layer (a part of the circuit in the circuit layer) of the substrate 10 to achieve electromagnetic isolation of the device.
  • the same carrying surface of the substrate 10 can carry a plurality of devices.
  • the devices are divided into at least two device groups according to the arrangement positions of the devices and the electromagnetic interference between the devices, and each device group does not include devices that may interfere with each other.
  • Figure 2a shows the case where the package module contains two device groups.
  • the package module includes a first device group 20 and a second device group 30 .
  • Both the first device group 20 and the second device group 30 are combinations comprising at least one device.
  • the first device group 20 may include only one device, or may include two or more devices. It should be understood that when the first device group 20 includes two or more devices, the two or more devices should not generate electromagnetic interference.
  • the second device group 30 can be described with reference to the first device group 20 , and details are not repeated here.
  • the number of devices in the first device group 20 and the second device group 30 may be the same or different.
  • the first device group 20 includes N devices
  • the second device group 30 includes N devices
  • N is a natural number
  • the first device group 20 includes N devices
  • the second device group 30 includes M devices , N and M are unequal natural numbers.
  • the packaging module further includes a plastic sealing body 40, and the plastic sealing body 40 is used to wrap at least two device groups to ensure the devices in each device group.
  • the plastic sealing body 40 can be made of different materials.
  • the plastic sealing body 40 can be made of epoxy resin, acrylic resin material, dielectric material, thermosetting material, thermoplastic material, rubber or other insulating materials.
  • an injection process can be used to form a molding body 40 within a molding tool, and the molding body 40 encapsulates the devices in each device group to protect each device and isolate the devices.
  • the shielding structure is used to shield at least two device groups to avoid electromagnetic interference.
  • the shielding structure includes a shielding case 60 and a partition wall 50 .
  • the shielding case 60 faces at least a part of the surface of the substrate 10 and is electrically connected to the ground layer of the substrate 10 for grounding.
  • the shielding case 60 and the substrate 10 enclose an accommodation space, and the first device group 20 and the second device group 30 are accommodated in the space enclosed by the shielding case 60 and the substrate 10 .
  • the shielding cover 60 may adopt different structures. Exemplarily, the shielding cover 60 may be a metal layer covering the plastic package 40, or may also be a shell structure.
  • the isolation wall 50 is disposed in the shielding case 60 and is electrically connected with the shielding case 60 .
  • the partition wall 50 divides the space inside the shield case 60 into a plurality of subspaces. Each subspace correspondingly accommodates a device group, and each subspace is a shielded space formed by the shielding cover 60 and the isolation wall 50 .
  • the isolation wall 50 is used to electromagnetically isolate the first device group 20 and the second device group 30 . It should be understood that when there are at least two device groups, such as three, four, etc. different numbers, the isolation wall 50 should be capable of electromagnetically isolating each adjacent two device groups in the at least two device groups for electromagnetic isolation.
  • the isolation wall 50 can be embedded in the plastic sealing body 40 to facilitate the installation of the isolation wall 50 .
  • the structure of the isolation wall 50 between each adjacent two device groups is similar, so the isolation wall 50 between the first device group 20 and the second device group 30 is used as an example for description.
  • Figure 2b shows a partial top view of the separation wall.
  • the direction a and the direction b are defined for the convenience of description.
  • the direction a is the arrangement direction of the first device group 20 and the second device group 30 ;
  • the direction b is the direction in which the first device group 20 and the second device group 30 need signal isolation.
  • the plane in which the direction b and the direction a are located is parallel to the bearing surface of the substrate 10 .
  • the direction b can be perpendicular to the direction a or have an included angle with the direction a, and the included angle can be any acute angle greater than 0° and less than 90°, such as 5°, 10°, 30°, 50°, 60°, 89° and other different angles.
  • the isolation wall 50 is located between the first device group 20 and the second device group 30 , and the length direction of the isolation wall 50 is arranged along the direction in which the signal needs to be separated from the first device group 20 and the second device group 30 , that is, the length of the isolation wall 50 The direction is in direction b.
  • the isolation wall 50 is a structure in which the conductive pillars 51 and the conductive adhesive 52 are mixed.
  • the isolation wall 50 includes a plurality of conductive pillars 51 , and the plurality of conductive pillars 51 are arranged in two rows.
  • the conductive pillars 51 in each row of the conductive pillars are arranged in the direction b, and the conductive pillars in two rows are arranged in the direction a.
  • a gap is spaced between two adjacent conductive pillars 51 along the direction a, and a gap is also spaced between two adjacent conductive pillars 51 along the direction b.
  • the conductive columns 51 in the two rows of conductive columns are aligned one-to-one, that is, the two conductive columns 51 are arranged in a row along the direction a, and the plurality of conductive columns 51 are arranged in a matrix.
  • the conductive pillars 51 are electrically connected to the ground layer of the substrate 10 .
  • the plastic sealing body 40 wraps the above-mentioned first device group 20 , the second device group 30 and the plurality of conductive pillars 51 .
  • a groove is formed on the plastic sealing body 40 (not shown in the figure, the shape of the groove body may refer to the shape of the conductive adhesive 52 ), and the groove body is used for accommodating the conductive adhesive 52 .
  • the conductive glue 52 is filled into the groove, it is electrically connected to the conductive pillars 51 to form the isolation wall 50 .
  • the groove body When forming the groove body, a groove is formed between two adjacent rows of conductive pillars 51, and the length direction of the groove body is along the direction b.
  • the groove body is illustrated as a rectangular groove body, but the groove body provided in the embodiment of the present application may also adopt other shapes, such as oval shape, long waist shape and other different shapes. Regardless of any shape of the groove body, it should be ensured that only part of the side wall of each conductive column 51 is exposed in the groove body, and part is wrapped by the plastic sealing body 40 . Taking the rectangular slot body shown in FIG.
  • the bottom wall of the slot body is the bearing surface of the substrate 10 , and a part of the side wall of each conductive column 51 is exposed in the slot body, that is, part of the structure of each conductive column 51 . protruding into the groove body.
  • the groove body can be prepared by different processes, for example, the groove body can be formed by laser etching or other etching methods can be used to form the groove body.
  • the above-mentioned laser cutting uses a focused high-power density laser beam to irradiate the workpiece, so that the irradiated material rapidly melts, vaporizes, ablates or reaches the ignition point. The workpiece is cut.
  • the laser cutting method is used, the precision of the slotting can be ensured, so as to ensure that part of the sidewalls of the conductive pillars 51 are exposed in the slot body.
  • the conductive glue 52 When the conductive glue 52 is filled in the tank body, the entire tank body is filled.
  • the filled conductive glue 52 wraps a part of the sidewall of each conductive post 51 exposed in the tank body, and is electrically connected to the conductive post 51 . It can be seen from FIG. 2 a and FIG. 2 b that when the conductive adhesive 52 is provided, the conductive adhesive 52 is filled in the gap between any adjacent conductive pillars 51 , and any adjacent conductive pillars 51 can be electrically connected through the conductive adhesive 52 . connected, so that the conductive posts 51 and the conductive adhesive 52 form a wall-like structure.
  • the isolation wall 50 can be regarded as the conductive pillar 51 as the main structure, and the conductive adhesive 52 as the connection structure to connect the plurality of conductive pillars 51 in series to form a wall structure.
  • the conductivity of the conductive pillars 51 is greater than that of the conductive adhesive 52 , so that the conductivity of the isolation wall 50 is increased through the conductive pillars 51 .
  • the isolation wall 50 is formed by mixing the conductive posts 51 and the conductive glue 52
  • the side surfaces of the conductive posts 51 can be used as electromagnetic signal reflecting surfaces, which improves the immunity of the isolation wall 50 to electromagnetic signals.
  • the reflection of the signal improves the isolation of the isolation wall 50 .
  • the area of the part of the sidewall of the conductive pillar 51 exposed in the tank accounts for between 1/4 and 1/2 of the area of the sidewall of the conductive pillar 51 , for example, the part of the sidewall of the conductive pillar 51 exposed in the tank The area accounts for 1/2, 1/3, and 1/4 of the total area of the sidewall of the conductive pillar 51 in different proportions.
  • the ratio of the total volume V1 of the plurality of conductive pillars 51 to the volume V2 of the isolation wall 50 is greater than or equal to 10% and less than or equal to 30%.
  • the total volume V1 of the plurality of conductive pillars 51 is the sum of the volumes v of the plurality of conductive pillars 51 ;
  • the volume V2 of the isolation wall 50 is the sum of the total volume V1 of the plurality of conductive pillars 51 and the volume V3 of the conductive adhesive 52 .
  • the ratio of V1:V2 may be any value between 10% and 30%, such as 10%, 15%, 20%, 25%, and 30%.
  • the provided conductive pillars 51 can improve the conductivity of the entire isolation wall 50 .
  • the conductive posts 51 in the above proportions when the total volume V2 of the partition wall 50 remains unchanged, the volume can be reduced by 10% to 30% compared to the equal volume partition wall prepared by using conductive adhesive in the prior art The amount of conductive adhesive 52 used.
  • the spacing between the conductive pillars 51 is greater than or equal to 50 ⁇ m and less than or equal to 100 ⁇ m, so as to satisfy the slotting process in the prior art, reduce the size of the slot, and further reduce the usage of the conductive adhesive 52 .
  • the spacing between the conductive pillars 51 may be any distance between 50 ⁇ m, 80 ⁇ m, 120 ⁇ m, 200 ⁇ m, 240 ⁇ m, 280 ⁇ m, 100 ⁇ m, etc., between 50 ⁇ m and 100 ⁇ m. It should be understood that the above-mentioned spacing between the conductive pillars 51 includes not only the spacing between two adjacent conductive pillars 51 along the direction a, but also the spacing between two adjacent conductive pillars 51 along the direction b.
  • the conductive pillars 51 can be made of different materials.
  • the conductive pillars 51 can be made of common conductive materials such as copper, aluminum, iron, silver, and gold.
  • the conductive pillars 51 are copper pillars, and the copper pillars have good conductivity and low cost.
  • silver paste is used for the conductive adhesive 52 and copper posts are used for the conductive posts 51 , the cost of the isolation wall 50 can be reduced.
  • the amount of the conductive adhesive 52 can be reduced, and the cost of the isolation wall 50 can be further reduced.
  • the shape of the conductive pillars 51 can be in different shapes, for example, the conductive pillars 51 can be pillars with different shapes such as rectangular pillars, elliptical pillars, and cylinders.
  • the conductive column 51 is preferably a cylinder, which is convenient for preparation on the one hand, and convenient for connecting with the conductive glue 52 on the other hand.
  • the conductive column 51 can be a straight cylinder with a constant diameter, or a stepped column or a tapered column with a variable diameter, which can be determined according to actual needs in specific applications.
  • the diameter of the conductive column 51 is greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m, which ensures that the conductive column 51 has a certain volume.
  • the diameter of the conductive pillar 51 may be any size between 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, 35 ⁇ m, 40 ⁇ m, 45 ⁇ m, 5 ⁇ m, etc. between 20 ⁇ m and 50 ⁇ m.
  • each conductive pillar 51 is electrically connected to the ground layer through a pad on the substrate 10 .
  • the conductive pillars 51 may be implanted in two rows of the conductive pillars 51 on the substrate 10 through a wire bonding process. Wire bonding is a method of using thin metal wires to tightly bond the metal wires to the pads of the substrate 10 by using heat, pressure and ultrasonic energy.
  • the conductive posts 51 can also be electrically connected by different welding methods such as argon arc welding and laser welding.
  • the diameter of the pad on the substrate 10 is larger than the diameter of the conductive pillar 51 .
  • the diameter of the pad may be 60 ⁇ m, 70 ⁇ m, 80 ⁇ m, etc. different sizes larger than the diameter of the conductive pillar 51 .
  • the welding between the conductive post 51 and the pad is facilitated, and at the same time, the electrical connection effect between the conductive post 51 and the ground layer can be improved through the larger pad.
  • part of the solder pads of the substrate 10 are exposed in the tank body, and when the conductive adhesive 52 is filled in the tank body, the conductive adhesive 52 can be electrically connected to the solder pads exposed in the tank body.
  • the effect of the electrical connection between the isolation wall 50 and the formation is improved, thereby improving the electromagnetic isolation effect of the isolation wall 50 .
  • the isolation wall 50 is electrically connected to the shielding cover 60 , including but not limited to the top and side walls of the isolation wall 50 being electrically connected to the top and side walls of the shielding cover respectively, and the top of the isolation wall 50 being electrically connected to the top wall of the shielding cover 60 Or the side end of the isolation wall 50 is electrically connected to the side wall of the shielding case 60 .
  • a direction c is introduced in FIG. 2a, the direction c is perpendicular to the bearing surface of the substrate 10, and the direction c is perpendicular to the direction a and the direction b, respectively. As shown in FIG.
  • the height of the partition wall 50 is along the direction c, and the top of the partition wall 50 refers to the end surface of the partition wall 50 facing away from the substrate 10 .
  • the top of the isolation wall 50 is electrically connected to the top surface of the shielding case 60 (the surface of the shielding case 60 facing the substrate 10 where the first device group 20 is disposed).
  • the shielding cover 60 adopts a metal layer, the isolation wall 50 is exposed outside the plastic package 40 , and when the metal layer is formed on the plastic package 40 , it covers the top of the isolation wall 50 and is electrically connected to the isolation wall 50 .
  • the shielding case 60 is electrically connected to the isolation wall 50 only through the conductive glue 52 , and the conductive pillars 51 are not directly electrically connected to the shielding case 60 .
  • the shielding cover 60 covers the conductive glue 52 and is electrically connected with the conductive glue 52 .
  • There is a gap between the conductive column 51 and the shielding cover 60 and the conductive column 51 is electrically connected to the shielding cover 60 through the conductive glue 52 .
  • the gap between the conductive column 51 and the shielding case 60 is less than or equal to 300 ⁇ m.
  • the size of the gap between the conductive pillar 51 and the shielding cover 60 along the direction c may be any gap less than or equal to 300 ⁇ m, such as 10 ⁇ m, 20 ⁇ m, 50 ⁇ m, 100 ⁇ m, 120 ⁇ m, 150 ⁇ m, 200 ⁇ m, 250 ⁇ m, 290 ⁇ m, and 300 ⁇ m.
  • the length of the conductive column 51 satisfies the minimum distance from the inner wall of the shielding cover 60 to be less than or equal to 300 ⁇ m, so as to ensure that the conductive column 51 has a sufficient height to improve the isolation between the first device group 20 and the second device group 30 Effect.
  • the conductive pillars 51 can also be used to connect the shielding case 60 , that is, the top of the conductive pillars 51 is in contact with the inner wall of the shielding case 60 , and the two are directly connected.
  • the conductive pillars 51 are directly connected to the shielding case 60 , the plurality of conductive pillars 51 isolate the first device group 20 and the second device group 30 , which can improve the isolation effect between the first device group 20 and the second device group 30 .
  • FIG. 3 illustrates the simulation schematic diagram of different conductivity materials in the following table for different frequency signals.
  • the electromagnetic shielding effectiveness of the structure with low electrical conductivity is lower than that of the structure with high electrical conductivity.
  • the shielding effectiveness of low-frequency signals will be reduced by 15db
  • the shielding effectiveness of high-frequency signals will be reduced by 2-8db.
  • the metal glue material in the prior art has a porous structure, and its electrical conductivity is about 5e 5 S/m, which is about 2 orders of magnitude lower than that of pure copper material (5.7e 7 ), because its electromagnetic performance is also poor.
  • the isolation wall 50 provided in this embodiment adopts a structure in which copper pillars and silver glue are mixed, which can improve the conductivity of the overall structure, thereby bringing about better electromagnetic shielding effect.
  • Step 001 set at least two device groups on the substrate
  • the above steps include preparing a substrate 10, which may be a printed circuit board or other types of substrates. But no matter which type of substrate is used, the substrate 10 includes at least one metal circuit layer.
  • the metal wiring layer includes a circuit layer for electrical connection with at least two device groups and a ground layer.
  • the substrate 10 is also provided with a plurality of pads, such as pads for electrical connection with at least two device groups, and pads for electrical connection with the shielding structure.
  • FIG. 4b when at least two device groups are provided, devices are mounted on the bearing surface of the substrate 10, such as the first device group 20 and the second device group 30 shown in FIG. 4b.
  • Devices in a device group may include various active and passive devices, chips, isolated components, or component packages (packaged chips).
  • Step 002 a plurality of conductive pillars electrically connected to the ground layer of the substrate are provided on the substrate 10; wherein, the plurality of conductive pillars are arranged at intervals, and the plurality of conductive pillars isolate each adjacent two device groups;
  • a signal isolation area is designed between two device groups, and two rows of conductive pillars 51 are implanted in the signal isolation area by using a wire bonding process.
  • Wire Bonding is a method of using thin metal wires to tightly bond the metal wires to the pads on the substrate 10 by using heat, pressure and ultrasonic energy.
  • the conductive pillars 51 may be copper pillars, the diameter of the copper pillars may be 30 ⁇ m, and the diameter of the pads connected to the copper pillars may be 60 ⁇ m.
  • the distance between the centers of two adjacent copper pillars is greater than or equal to 150 and less than or equal to 300 ⁇ m.
  • the height of the copper column set in addition is not higher than the height of the plastic body of the entire system level package, and the possible height range is 0.1mm to 1.5mm.
  • Step 003 filling the gaps between the plurality of conductive posts with conductive glue and electrically connecting with adjacent conductive posts;
  • the plastic package 40 is arranged to encapsulate the first device group 20 , the second device group 30 and the plurality of conductive pillars 51 to encapsulate the first device group 20 , the second device group 30 and the plurality of conductive pillars 51 .
  • the material of the molding body 40 can be made of epoxy resin, acrylic resin material, dielectric material, thermosetting material, thermoplastic material, rubber or other insulating materials.
  • the fabrication process may employ an implantation process to form an insulating layer within the molding tool.
  • the plastic package 40 wraps the at least two device groups.
  • the groove body 41 is etched by laser in the copper pillar region (between two adjacent rows of copper pillars).
  • a laser cutting process can be used. Laser cutting is to irradiate the workpiece with a focused high-power density laser beam, so that the irradiated material quickly melts, vaporizes, ablates or reaches the ignition point, and at the same time, the molten material is blown away by the high-speed airflow coaxial with the beam, so as to realize the cutting of the workpiece. open.
  • the width of the slot is greater than or equal to 100 ⁇ m and less than or equal to 300 ⁇ m, for example, the width of the slot is 100 ⁇ m, 150 ⁇ m, 200 ⁇ m, 250 ⁇ m, 300 ⁇ m, etc. Any width between 100 ⁇ m and 300 ⁇ m.
  • the width of the above slot is the width of the slot body 41 along the arrangement direction of the first device group 20 and the second device group 30 .
  • the tops of the copper pillars may or may not be exposed during the grooving.
  • conductive glue is filled in the groove, and the conductive glue wraps a part of the sidewall of each conductive column exposed in the groove.
  • the conductive adhesive 52 filled in the groove body the electrical connection between the conductive column 51 and the conductive adhesive 52 is realized, and the isolation wall 50 is formed.
  • the material of the conductive adhesive 52 is filled in the etched groove body.
  • the partially exposed surface of the conductive pillar 51 is electrically connected with the conductive adhesive 52 material.
  • the conductive adhesive 52 in the embodiment of the present application can be made of silver adhesive material.
  • the silver adhesive has certain fluidity, and can fill the slotted structure under certain pressure and temperature conditions, and can ensure good contact with the conductive pillars 51 .
  • the silver glue material is thermally cured. Exemplarily, the curing process may be baked in an environment of 100-175 degrees Celsius for 0.5-2 hours.
  • Step 004 preparing the shielding case 60 .
  • a shielding case 60 is attached to the upper surface and sidewalls of the entire package module.
  • the conductive glue 52 and the shielding cover 60 are electrically connected.
  • the process may be physical sputter deposition.
  • the shielding cover 60 may be a combination of a stainless steel layer, a single layer of copper layers, or a combination of multiple layers.
  • the shielding case 60 can be made of other depositable metal materials, such as copper, nickel and aluminum.
  • the shielding cover 60 can also be prepared by chemical vapor deposition of metal, electroplating and other methods.
  • the prepared shielding case 60 is electrically connected to the isolation wall 50 and the ground layer of the substrate 10 .
  • the isolation wall 50 is formed by the conductive pillars 51 and the conductive adhesive 52.
  • the conductivity of the conductive pillars 51 used is higher than that of the conductive adhesive 52, thereby improving the isolation.
  • using the conductive pillars 51 as a part of the isolation wall 50 can reduce the usage of the conductive adhesive 52, can reduce the cost of the entire shielding structure, and further reduce the cost of the entire packaging module.
  • FIG. 5a shows a modified structure of the system-in-package provided by the embodiment of the present application
  • FIG. 5b shows a top view of the isolation wall 50.
  • FIG. Part numbers in Figs. 5a and 5b may refer to the same numbers in Figs. 2a and 2b.
  • a plurality of conductive pillars 51 are arranged in two rows, the conductive pillars 51 in each row of conductive pillars are arranged along the direction b, and the two rows of conductive pillars are arranged along the direction a.
  • a gap is spaced between two adjacent conductive pillars 51 along the direction a, and a gap is also spaced between two adjacent conductive pillars 51 along the direction b.
  • the conductive pillars 51 in the two rows of conductive pillars 51 are arranged in a staggered position. That is, along the direction b, the arrangement positions of the two rows of conductive pillars 51 are staggered.
  • the conductive adhesive 52 is filled, the conductive adhesive 52 wraps a part of the sidewall of each conductive column 51 exposed in the groove body.
  • the arrangement of the conductive pillars 51 as shown in FIG. 5b is adopted, more conductive pillars 51 sidewalls will be exposed in the direction b of the two rows of misaligned conductive pillars 51, so that there can be more electromagnetic signal reflection surfaces. Comes with better electromagnetic shielding effect.
  • FIG. 6 a and FIG. 6 b show a modified structure of the system-in-package provided by the embodiment of the present application
  • FIG. 6 b shows a top view of the isolation wall 50
  • Part numbers in Figs. 6a and 6b may refer to the same numbers in Figs. 2a and 2b.
  • a plurality of conductive pillars 51 are arrayed in two rows.
  • a filling hole is provided between each of the four adjacent conductive pillars 51 , and a part of the sidewall of each conductive pillar 51 is exposed to the corresponding filling hole. Take the structure shown in Figure 6b as an example.
  • a filling hole is opened between any adjacent four conductive pillars 51 , and a plurality of filling holes are arranged along the direction b. And the filled holes are alternately arranged with a row of conductive pillars 51 (conductive pillars 51 arranged in a row along the direction a).
  • Each of the conductive pillars 51 corresponds to at least one filling hole, and a part of the sidewall of each conductive pillar 51 is exposed in the corresponding filling hole.
  • the conductive glue 52 is filled in each filling hole, and the conductive glue 52 wraps a part of the sidewall of each conductive pillar 51 exposed in the corresponding filling hole.
  • the conductive glue 52 filled in each filling hole is electrically connected to a part of the sidewall of each conductive pillar 51 exposed in the filling hole.
  • the plurality of conductive pillars 51 are electrically connected together by alternately arranging the filled holes and one row of the conductive pillars 51 .
  • the diameter of the filling hole may be greater than or equal to 100 ⁇ m and less than or equal to 300 ⁇ m.
  • the diameter of the filled hole can be any size between 100 ⁇ m and 300 ⁇ m, such as 100 ⁇ m, 150 ⁇ m, 200 ⁇ m, 250 ⁇ m, 300 ⁇ m, and the like.
  • the corresponding preparation method is similar to the preparation method corresponding to FIG. 2a and FIG. 2b.
  • the step of filling the gaps between the conductive posts 51 with conductive glue 52 and electrically connecting with the conductive posts 51 is similar to the preparation method corresponding to FIG. 2a and FIG. 2b.
  • this step can be adopted: disposing the plastic package 40 to wrap the first device group 20 , the second device group 30 and the plurality of conductive pillars 51 .
  • a filling hole is opened between each of the four adjacent conductive pillars 51. Part of the sidewall of each conductive pillar 51 is wrapped by the plastic package, and part of the sidewall is exposed to the corresponding filling hole.
  • the conductive glue 52 is filled in the filling hole, and the conductive glue 52 wraps the conductive glue 52 to wrap a part of the sidewall of each conductive column 51 exposed in the corresponding filling hole.
  • the material and filling process of the conductive adhesive 52 reference may be made to the relevant description in FIG. 4e, which will not be repeated here.
  • FIG. 7a shows a modified structure of the system-in-package provided by the embodiment of the present application
  • FIG. 7b shows a top view of the isolation wall 50.
  • FIG. Part numbers in Figs. 7a and 7b may refer to the same numbers in Figs. 2a and 2b.
  • the plurality of conductive pillars 51 are arranged in three rows, each row of the conductive pillars 51 is arranged along the direction b, and the three rows of the conductive pillars 51 are arranged along the direction a.
  • a gap is spaced between two adjacent conductive pillars 51 along the direction a, and a gap is also spaced between two adjacent conductive pillars 51 along the direction b.
  • the conductive pillars 51 in the three rows of conductive pillars 51 are aligned one by one, that is, the three conductive pillars 51 are arranged in a row along the direction a, and the plurality of conductive pillars 51 are arranged in a matrix.
  • the plastic sealing body 40 is provided with two groove bodies, the two groove bodies are arranged along the direction b, and a row of conductive pillars 51 is located between the two groove bodies.
  • each conductive pillar 51 Part of the side wall of each conductive pillar 51 is exposed in the corresponding groove body.
  • the conductive adhesive 52 is filled, the conductive adhesive 52 is electrically connected to the part of the side wall of the conductive pillar 51 exposed in the groove body. It can be seen from FIG. 7a and FIG. 7b that in the isolation wall 50 provided by the embodiment of the present application, multiple rows of conductive pillars 51 can also be used, and the effect of isolating the first device group 20 and the second device group 30 can also be achieved.
  • FIG. 8 a and FIG. 8 b show a modified structure of the system-in-package provided by the embodiment of the present application
  • FIG. 8 b shows a top view of the isolation wall 50
  • Part numbers in Figs. 8a and 8b may refer to the same numbers in Figs. 2a and 2b.
  • a plurality of conductive pillars 51 are arranged in three rows, each row of conductive pillars 51 is arranged along direction b, and three rows of conductive pillars 51 are arranged along direction a.
  • a gap is spaced between two adjacent conductive pillars 51 along the direction a, and a gap is also spaced between two adjacent conductive pillars 51 along the direction b.
  • the conductive pillars 51 in the three rows of conductive pillars 51 are aligned one by one, that is, the three conductive pillars 51 are arranged in a row along the direction a, and the plurality of conductive pillars 51 are arranged in a matrix.
  • the conductive adhesive 52 wraps a portion of the sidewall of the outermost conductive column 51 exposed in the groove body. It can be seen from FIG. 8a and FIG. 8b that in the isolation wall 50 provided by the embodiment of the present application, multiple rows of conductive pillars 51 can also be used, and the effect of isolating the first device group 20 and the second device group 30 can also be achieved.
  • FIGS. 9 a and 9 b show a modified structure of the system-in-package provided by the embodiment of the present application
  • FIG. 9 b shows a top view of the isolation wall 50 .
  • Part numbers in FIGS. 9a and 9b may refer to the same numbers in FIGS. 2a and 2b.
  • a plurality of conductive pillars 51 are arranged in a single row.
  • a plurality of conductive pillars 51 are arranged along the direction b, and are arranged in a single row. Along the direction b, there are gaps between adjacent conductive pillars 51 .
  • the conductive adhesive 52 is filled in the gap, and the conductive adhesive 52 and the plurality of conductive pillars 51 are alternately arranged to electrically connect the plurality of conductive pillars 51 into a whole.
  • the plastic sealing body 40 is provided with a plurality of filling holes, and each filling hole is arranged between any two adjacent conductive pillars 51 .
  • a plurality of filling holes are arranged along the direction b, and the filling holes and the conductive pillars 51 are arranged alternately.
  • Each conductive pillar 51 corresponds to at least one filling hole, and a part of the sidewall of each conductive pillar 51 is exposed to the corresponding filling hole.
  • the isolation wall 50 with the length direction along the direction b can also be formed to separate the first device group 20 and the second device group 30. isolate.
  • the diameter of the filling hole may be greater than or equal to 100 ⁇ m and less than or equal to 300 ⁇ m.
  • the diameter of the filled hole can be any size between 100 ⁇ m and 300 ⁇ m, such as 100 ⁇ m, 150 ⁇ m, 200 ⁇ m, 250 ⁇ m, 300 ⁇ m, and the like.
  • the corresponding preparation method is similar to the preparation method corresponding to FIG. 2a and FIG. 2b.
  • the step of filling the gaps between the conductive posts 51 with conductive glue 52 and electrically connecting with the conductive posts 51 is similar to the preparation method corresponding to FIG. 2a and FIG. 2b.
  • this step can be adopted: disposing the plastic package 40 to wrap the first device group 20 , the second device group 30 and the plurality of conductive pillars 51 .
  • FIG. 4d A filling hole is opened between each adjacent two conductive pillars 51 , part of the sidewall of each conductive pillar 51 is wrapped by the plastic package, and part of the sidewall is exposed to the corresponding filling hole.
  • the conductive glue 52 is filled in the filling hole, and the conductive glue 52 wraps the conductive glue 52 to wrap a part of the sidewall of each conductive column 51 exposed in the corresponding filling hole.
  • the material and filling process of the conductive adhesive 52 reference may be made to the relevant description in FIG. 4e, which will not be repeated here.
  • the plurality of conductive pillars 51 provided in the embodiments of the present application can be arranged in multiple rows, and the direction of each row is the length direction of the partition wall.
  • the conductive adhesive 52 is filled between two adjacent rows of conductive pillars 51 , and the conductive adhesive 52 wraps part of the sidewalls of the conductive pillars 51 , so that the plurality of conductive pillars 51 can be electrically connected into one body to form the isolation wall 50 .
  • the conductive pillars 51 can also be arranged in a single row. As shown in FIG.
  • a plurality of conductive pillars 51 can also be electrically connected into one body to form the isolation wall 50 .
  • the isolation walls 50 are all arranged in a straight line.
  • the isolation wall 50 used in the embodiment of the present application is not limited to the linear type listed above, and other methods can also be used.
  • the isolation wall 50 only needs to be formed by mixing the conductive pillars 51 and the conductive adhesive 52 to be applied in the present application. in the examples.
  • the separation wall 50 can also adopt other shapes such as S-shape, arc-shape, wave-shape and so on.
  • the isolation wall 50 adopts different shapes the corresponding arrangement of the conductive pillars 51 and the filling method of the conductive adhesive 52 may be adapted to the shape of the isolation wall 50 .
  • the isolation walls 50 may also be multiple, and the arrangement of the isolation walls 50 corresponds to the arrangement of the device groups.
  • the isolation walls 50 can also be formed in a grid shape, and each grid can accommodate one device group.
  • Each grid can be surrounded by three, four, five and other different numbers of partition walls 50 .
  • there may also be multiple isolation walls 50 the multiple isolation walls 50 are arranged in parallel, and a space for accommodating the device groups is isolated between two adjacent isolation walls 50 .
  • Embodiments of the present application also provide an electronic device, which is an electronic device with a communication function, such as a compact and portable electronic device, such as a smart phone, a smart watch, a wireless router, and the like.
  • a compact and portable electronic device such as a smart phone, a smart watch, a wireless router, and the like.
  • These electronic devices include devices that are susceptible to RF interference, such as Wifi, Bluetooth, and cellular signal-related RF transceiver circuits; and other devices that require clock signals, such as processors, memory, and so on.
  • the electronic device provided in the embodiment of the present application includes a circuit board, and any one of the packaging modules described above, where the packaging module is fixed on the circuit board, and the circuit board is electrically connected to the substrate.
  • the smart watch shown in FIG. 10 the smart watch includes a casing 100 , a circuit board 200 disposed in the casing 100 , and a packaging module 300 disposed on the circuit board 200 .
  • the circuit board 200 is electrically connected to the substrate of the packaging module 300 to realize the function of the device in the substrate.
  • the circuit board 200 can also be used as a substrate of the packaging module 300, so that the structure in the electronic device can be simplified.
  • the separation wall is formed by the conductive column and the conductive glue.
  • the conductive column is used as a part of the separation wall, and the conductivity of the conductive column used is higher than that of the conductive glue, thereby improving the conductivity of the separation wall;
  • using the conductive pillars as a part of the isolation wall can reduce the amount of conductive adhesive used, and can reduce the cost of the entire shielding structure, thereby reducing the cost of the entire electronic device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract

本申请提供了一种封装模组及其封装方法、电子设备，封装模组包括至少两个器件组及用于屏蔽至少两个器件组的屏蔽结构。屏蔽结构包括用于电磁隔离每相邻的两个器件组的隔离墙。隔离墙包括多个导电柱及导电胶，导电柱的导电率大于导电胶的导电率。多个导电柱间隔排列且与基板的地层电连接，导电胶填充在任意相邻的导电柱之间的间隙内，并通过导电胶将任意相邻的导电柱电连接。由上述描述可看出，隔离墙采用导电柱与导电胶组成，导电柱的导电率大于导电胶，从而提升了隔离墙的导电率；采用导电柱作为隔离墙的一部分，减少了导电胶的使用量，降低了整个屏蔽结构的成本，进而降低整个封装模组的成本。

Description

一种封装模组及其封装方法、电子设备
相关申请的交叉引用
本申请要求在2020年07月31日提交中国专利局、申请号为202010757065.6、申请名称为“一种封装模组及其封装方法、电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到电子技术领域，尤其涉及到一种封装模组及其封装方法、电子设备。
背景技术
随着电子设备如手机，智能手表等内部模组越来越紧凑，电子设备中组件之间的距离越来越小，致使电子设备中的组件容易受到其它相邻组件的电磁干扰。例如，电子设备中的行动热点(Wi-Fi)收发器和蓝牙收发器往往相邻设置。Wi-Fi收发器在工作时产生的干扰信号会干扰蓝牙收发器的工作。同理，蓝牙收发器在工作时产生的干扰信号也会干扰Wi-Fi收发器的工作。
为了降低相邻组件之间的电磁干扰，同时降低用于电磁屏蔽的模组在电子设备中占用的空间，系统级封装(system in a package，SIP)有望成为主流的电磁屏蔽方案。以Wi-Fi收发器和蓝牙收发器为例，如图1所示，在目前的系统级封装中，Wi-Fi收发器3和蓝牙收发器2设置于基板1的同一个表面，在系统级封装的外表面设置有金属层4，该金属层4与基板1构成了容纳Wi-Fi收发器3和蓝牙收发器2的空间。同时，在Wi-Fi收发器3和蓝牙收发器2之间还设置有金属隔离壁5，金属隔离壁5可以将上述空间分为两个独立的子空间。其中一个子空间可以容纳Wi-Fi收发器3，另一个子空间可以容纳蓝牙收发器2。Wi-Fi收发器3与金属隔离壁5之间，以及蓝牙收发器2与金属隔离壁5之间还填充有塑封料6。金属隔离壁5多由导电胶凝固而成，但是目前的导电胶多包含有金、银等贵金属材料，使导电胶的成本较高，不利于降低系统级封装的工艺成本。此外，相较于金属导体，导电胶的电导率较低，电磁屏蔽效果也不够理想。无法达到屏蔽要求。
发明内容
本申请提供了一种封装模组及其封装方法、电子设备，旨在改善封装模组的屏蔽效果。
第一方面，提供了一种封装模组，封装模组应用于电子设备中，用于改善封装模组的屏蔽效果。封装模组包括用于承载器件的基板，以及设置在所述基板上的至少两个器件组，至少两个器件组为需要电磁隔离的不同器件组。封装模组还包括用于屏蔽至少两个器件组的屏蔽结构。屏蔽结构包括用于电磁隔离每相邻的两个器件组的隔离墙。为改善屏蔽效果，本申请提供的隔离墙至少包括导电柱及导电胶，其中，导电柱的导电率大于所述导电胶的导电率。导电柱的个数为多个，多个导电柱与基板的地层电连接。多个导电柱在排列时间隔排列，任意相邻的导电柱之间存在间隙。导电胶填充在任意相邻的导电柱之间的间隙内，并通过导电胶将任意相邻的导电柱电连接，从而使得导电柱与导电胶组成一个类似墙体的 结构，将两个器件组电磁隔离。由上述描述可看出，通过导电柱与导电胶组成隔离墙，一方面采用导电柱作为隔离墙的一部分时，由于导电柱的导电率大于导电胶的导电率，因此提升了隔离墙的导电率；另一方面采用导电柱作为隔离墙的一部分，可减少导电胶的使用量，降低了整个屏蔽结构的成本，进而降低整个封装模组的成本。
在一个具体的可实施方案中，所述屏蔽结构还包括屏蔽罩，所述屏蔽罩朝向所述基板的至少部分表面并与所述基板的地层电连接，所述至少两个器件组位于所述屏蔽罩与所述基板围成的空间内；所述导电胶与所述屏蔽罩电连接。通过屏蔽罩与基板组成容纳至少两个电器组的空间。
在一个具体的可实施方案中，所述导电柱与所述屏蔽罩的内壁相接触。实现隔离墙与屏蔽罩之间的连接。
在一个具体的可实施方案中，所述导电柱与所述屏蔽罩之间间隔有间隙，所述导电胶填充在所述屏蔽罩与所述导电柱之间的间隙。可采用不同的方式实现隔离墙与屏蔽罩的电连接。
在一个具体的可实施方案中，在所述导电柱与所述屏蔽罩之间间隔有间隙时，所述间隙小于等于300μm。导电柱具有一定的高度，可改善隔离墙的隔离效果。
在一个具体的可实施方案中，导电柱之间间距大于等于50μm，且小于等于100μm。提高了导电柱的密度，提升了隔离墙的屏蔽效果。
在一个具体的可实施方案中，导电柱可为矩形柱、椭圆柱、圆柱等不同形状的柱体。可通过不同形状的导电柱达到改善隔离墙的屏蔽效果。
在一个具体的可实施方案中，在导电柱为圆柱时，导电柱的直径大于等于20μm，且小于等于50μm。保证了导电柱具有一定的体积，改善隔离墙的屏蔽效果。
在一个具体的可实施方案中，所述多个导电柱排布成多排，所述排的方向为所述隔离墙的长度方向；所述封装模组还包括塑封体，所述至少两个器件组均被塑封在所述塑封体内，且每个导电柱的部分侧壁被所述塑封体所包裹；相邻两排导电柱之间具有一个开槽，每个导电柱的部分侧壁外露在所述槽内；所述导电胶填充在所述槽内，且包裹所述每个导电柱外露在所述槽内的部分侧壁。通过将导电胶填充到槽体内，实现导电柱与导电胶的电连接。
在一个具体的可实施方案中，所述多个导电柱排列成两排，且所述两排导电柱中的导电柱一一对齐；或，所述多个导电柱排列成两排，且所述两排导电柱中的导电柱错位设置。导电柱可采用不同方式排列。
在一个具体的可实施方案中，所述多个导电柱排布成多排，所述排的方向为所述隔离墙的长度方向；
所述封装模组还包括塑封体，所述至少两个器件组均被塑封在所述塑封体内，且每个导电柱的部分侧壁被所述塑封体所包裹；每相邻的四个导电柱之间具有一个填充孔，且每个导电柱的部分侧壁外露在对应的填充孔；所述导电胶填充在每个填充孔，且所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。通过设置填充孔，并将导电胶填充到填充孔内实现导电柱与导电胶的电连接。
在一个具体的可实施方案中，所述多个导电柱排列成一排；所述封装模组还包括塑封体，所述至少两个器件组被塑封在所述塑封体内，且每个导电柱的部分侧壁被所述塑封体所包裹；每相邻的两个导电柱之间具有一个填充孔，且每个导电柱的部分侧壁外露在对应 的填充孔；所述导电胶填充在每个填充孔，且所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。通过设置填充孔，并将导电胶填充到填充孔内实现导电柱与导电胶的电连接。
在一个具体的可实施方案中，所述多个导电柱的体积与所述隔离墙的体积之比大于或等于10％且小于或等于30％。保证了隔离墙中导电柱的占比，提升了隔离墙的导电率，进而改善了隔离墙的屏蔽效果。
第二方面，提供了一种电子设备，该电子设备可为手机、平板电脑、智能手表等移动终端，该电子设备包括电路板，以及上述任一项所述的封装模组，所述封装模组固定在所述电路板上。在上述技术方案中，通过导电柱与导电胶组成隔离墙，一方面采用导电柱作为隔离墙的一部分时，由于导电柱的导电率大于导电胶的导电率，因此提升了隔离墙的导电率；另一方面采用导电柱作为隔离墙的一部分，可减少导电胶的使用量，降低了整个屏蔽结构的成本，进而降低整个封装模组的成本。
在一个具体的可实施方案中，电子设备的电路板为所述封装模组的基板。简化了电子设备中的结构。
第三方面，提供了一种封装模组的制备方法，该方法包括以下步骤：
在基板上设置至少两个器件组；
在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；
在所述多个导电柱之间的间隙内填充导电胶，并将相邻的导电柱电连接；
所述导电柱与所述导电胶电磁隔离每相邻的两个器件组。
在上述技术方案中，通过导电柱与导电胶组成隔离墙，一方面采用导电柱作为隔离墙的一部分时，由于导电柱的导电率大于导电胶的导电率，因此提升了隔离墙的导电率；另一方面采用导电柱作为隔离墙的一部分，可减少导电胶的使用量，降低了整个屏蔽结构的成本，进而降低整个封装模组的成本。
在一个具体的可实施方案中，所述在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；具体为：
所述多个导电柱排布成多排；
设置塑封体包裹所述至少两个器件组及所述多个导电柱；
在相邻两排导电柱之间具有一个开槽，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在所述槽内；
在所述槽内填充导电胶，所述导电胶包裹所述每个导电柱外露在所述槽内的部分侧壁。通过采用在槽体内填充导电胶，实现导电柱与导电胶的电连接，并组成隔离墙。
在一个具体的可实施方案中，所述在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；具体为：
所述多个导电柱排布成多排；
设置塑封体包裹所述至少两个器件组及所述多个导电柱；
在每相邻的四个导电柱之间开设一填充孔，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在对应的填充孔；
在所述填充孔内填充导电胶，所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。通过采用在填充孔内填充导电胶，实现导电柱与导电胶的电连接，并组成隔离墙。
在一个具体的可实施方案中，所述在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；具体为：
所述多个导电柱排布成一排；
设置塑封体包裹所述至少两个器件组及所述多个导电柱；
在每相邻的两个导电柱之间开设一个填充孔，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在对应的填充孔；
在所述填充孔内填充导电胶，所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。通过采用在填充孔内填充导电胶，实现导电柱与导电胶的电连接，并组成隔离墙。
附图说明
图1为现有技术中的封装模组的结构示意图；
图2a为本申请实施例提供的一种封装模组的剖视图；
图2b为本申请实施例提供的封装模组的隔离墙的俯视图；
图3为本申请实施例提供的材料的导电率与屏蔽效果的对应关系图；
图4a～图4g为本申请实施例提供的封装模组的制备流程；
图5a为本申请实施例提供的一种封装模组的剖视图；
图5b为本申请实施例提供的封装模组的隔离墙的俯视图；
图6a为本申请实施例提供的一种封装模组的剖视图；
图6b为本申请实施例提供的封装模组的隔离墙的俯视图；
图7a为本申请实施例提供的一种封装模组的剖视图；
图7b为本申请实施例提供的封装模组的隔离墙的俯视图；
图8a为本申请实施例提供的一种封装模组的剖视图；
图8b为本申请实施例提供的封装模组的隔离墙的俯视图；
图9a为本申请实施例提供的一种封装模组的剖视图；
图9b为本申请实施例提供的封装模组的隔离墙的俯视图；
图10为本申请实施例提供的智能手表的结构示意图。
具体实施方式
下面将结合附图对本申请实施例作进一步描述。
首先说明封装模组，封装模组应用于具备通信功能的电子设备中，如紧凑便携式的电子设备(如智能手机，智能手表，无线路由器等)。这些电子设备内部包括易受射频干扰影响的器件，如Wifi、蓝牙、蜂窝信号相关的射频收发器电路，以及其他需使用时钟信号的器件，如处理器、储存器等。上述这些器件会在正常工作可能彼此产生电磁干扰。为了保护设备不受电磁干扰的影响，可将一些电路(如射频收发器)用金属屏蔽罩包裹，集成 为封装模组，以达到阻挡信号，屏蔽电磁干扰。在集成封装模组时，封装模组中一般会存在至少两个会产生电磁干扰的器件，因此在封装模组中会对器件之间进行隔离。现有技术中采用银胶形成封装模组内部的器件之间的隔离，但是银胶一方面成本比较贵，另一方面隔离效果比较低，已经无法适应当前隔离要求。为此本申请实施例提供了一种改善隔离效果的封装模组，下面结合附图以及具体的实施例对本申请实施例提供的封装模组进行说明。
图2a示出了本申请实施例提供的封装模组的剖视图。封装模组包括基板10，以及承载基板10上的器件，还包括用于屏蔽器件的屏蔽结构(图中未标示)。屏蔽结构用以将器件电磁隔离，以将器件之间或者器件与外界环境进行屏蔽。上述器件可为Wifi、蓝牙、窝信号相关的射频收发器电路，或者使用时钟信号的器件，如处理器、储存器等。
基板10可采用不同类型的基板，如印刷电路板或者铺设有电路的板层。基板10具有承载面，该承载面可为基板10上相对的两个表面，或者其中的一个表面。在设置器件时，器件可设置在承载面上，并与基板10的电路层电连接。电路层包括设置在基板10上或基板10内的金属层，以及用于与器件及屏蔽结构电连接的焊盘。在设置屏蔽结构时，屏蔽结构可通过与基板10的地层(电路层中的一部分电路)电连接，实现对器件的电磁隔离。
基板10的同一承载面可承载多个器件。为方便描述，按照器件的设置位置以及器件之间的电磁干扰将器件进行划分为至少两个器件组，且每个器件组中不包含会相互电磁干扰的器件。
图2a中示出了封装模组包含两个器件组的情况。封装模组包括第一器件组20和第二器件组30。第一器件组20和第二器件组30均为包含至少一个器件的组合。第一器件组20可仅包含一个器件，也可包含两个或两个以上的器件。应理解，在第一器件组20包含两个或两个以上的器件时，两个或两个器件应不会产生电磁干扰。第二器件组30可参考第一器件组20描述，在此不再赘述。在具体划分第一器件组20和第二器件组30时，第一器件组20和第二器件组30中的器件个数可以相同，也可以不相同。如第一器件组20包含有N个器件，第二器件组30包含有N个器件，N为自然数；或者，第一器件组20包含有N个器件，第二器件组30包含有M个器件，N、M为不相等的自然数。
作为一个可选的方案，封装模组还包括塑封体40，塑封体40用以包裹至少两个器件组，以保证每个器件组中的器件。塑封体40可采用不同的材质制备而成，如塑封体40可采用环氧树脂、丙烯酸树脂材料、电介质材料、热固材料、热塑材料、橡胶或其他绝缘材料制备而成。在制备时，可采用注入工艺在模制工具内形成塑封体40，塑封体40包裹每个器件组中的器件，以保护每个器件并将器件之间隔离。
屏蔽结构用于屏蔽至少两个器件组，以避免电磁干扰。屏蔽结构包括屏蔽罩60以及隔离墙50。屏蔽罩60朝向基板10的至少部分表面并与基板10的地层电连接，以实现接地。屏蔽罩60与基板10围成容纳空间，第一器件组20和第二器件组30容纳在屏蔽罩60与基板10围成的空间内。屏蔽罩60可采用不同的结构，示例性的，屏蔽罩60可为覆盖在塑封体40的金属层，或者还可为一个壳体结构。
隔离墙50设置在屏蔽罩60内并与屏蔽罩60电连接。另外，隔离墙50将屏蔽罩60内的空间划分成多个子空间。每个子空间对应容纳一个器件组，每个子空间为屏蔽罩60与隔离墙50形成的一个被屏蔽空间。
以第一器件组20和第二器件组30为例，在电磁隔离第一器件组20和第二器件组30时，隔离墙50用于将第一器件组20和第二器件组30电磁隔离。应理解，在器件组为至 少两个时，如三个、四个等不同个数时，隔离墙50应可电磁隔离至少两个器件组中每相邻的两个器件组进行电磁隔离。在封装模组具有塑封体40时，隔离墙50可镶嵌在塑封体40中，以方便隔离墙50的设置。
每相邻的两个器件组之间的隔离墙50结构类似，因此以第一器件组20和第二器件组30之间的隔离墙50为例进行说明。
一并参考图2a及图2b，图2b示出了隔离墙的局部俯视图。为方便描述定义了方向a和方向b，方向a为第一器件组20和第二器件组30的排列方向；方向b为第一器件组20和第二器件组30需要信号隔离的方向。其中，方向b与方向a所在的平面平行于基板10的承载面。方向b可垂直于方向a或者与方向a之间具有夹角，该夹角可为任意大于0°且小于90°的锐角，如夹角可为5°、10°、30°、50°、60°、89°等不同的角度。
隔离墙50位于第一器件组20和第二器件组30之间，且隔离墙50的长度方向沿需要信号隔断第一器件组20和第二器件组30的方向设置，即隔离墙50的长度方向沿方向b。
隔离墙50为导电柱51及导电胶52混合的结构。隔离墙50包括多个导电柱51，且多个导电柱51排列成两排。每排导电柱中的导电柱51沿方向b排列，两排导电柱沿方向a排列。两排导电柱51中，沿方向a相邻的两个导电柱51之间间隔有间隙，沿方向b相邻的两个导电柱51之间也间隔有间隙。作为一个可选的方案，两排导电柱中的导电柱51一一对齐，即两个导电柱51沿方向a呈行排列，多个导电柱51呈矩阵排布。
导电柱51设置在基板10上时，导电柱51与基板10的地层电连接。在封装模组具有塑封体40时，塑封体40包裹上述的第一器件组20、第二器件组30和多个导电柱51。另外，塑封体40上开槽(图中未示出，槽体的形状可参考导电胶52的形状)，该槽体用于容纳导电胶52。在导电胶52填充到槽体内时，与导电柱51电连接，并形成隔离墙50。
在形成槽体时，在相邻两排导电柱51之间开槽，槽体的长度方向沿方向b。在图2b中示例出槽体为长方形槽体，但本申请实施例提供的槽体还可采用其他形状，如椭圆形、长腰型等不同的形状。无论采用任何形状的槽体，应保证每个导电柱51仅部分侧壁外露在槽体内，部分被塑封体40包裹。以图2b中所示的长方形的槽体为例，槽体的底壁为基板10的承载面，每个导电柱51的部分侧壁外露在槽体中，即每个导电柱51的部分结构外凸到槽体内。
槽体可采用不同的工艺制备而成，示例性的，可采用激光刻蚀成槽体或者采用其他刻蚀方式形成槽体。上述的激光切割是利用经聚焦的高功率密度激光束照射工件，使被照射的材料迅速熔化、汽化、烧蚀或达到燃点，同时借助与光束同轴的高速气流吹除熔融物质，从而实现将工件割开。在采用激光切割的方式时，可保证开槽的精度，从而保证导电柱51的部分侧壁外露在槽体内。
导电胶52填充在槽体内时，填充满整个槽体。填充的导电胶52包裹每个导电柱51外露在槽体内的部分侧壁，并与导电柱51导电连接。由图2a及图2b可看出，在设置导电胶52时，导电胶52填充在任意相邻的导电柱51之间的间隙内，并可通过导电胶52将任意相邻的导电柱51电连接，从而使得导电柱51与导电胶52组成一个类似墙体的结构。结合导电柱51及导电胶52的设置方式，隔离墙50可看做将导电柱51作为主体结构，导电胶52作为连接结构将多个导电柱51串联起来组成一个墙体结构。在选择导电柱51和导电胶52时，导电柱51的导电率大于导电胶52的导电率，从而通过导电柱51增大隔离墙50的导电率。另外，在采用导电柱51和导电胶52混合组成隔离墙50时，导电柱51 的侧面(被塑封体40包裹的部分侧壁的表面)可作为电磁信号反射面，提高了隔离墙50对电磁信号的反射，提升隔离墙50的隔离度。
作为一个可选的方案，导电柱51外露在槽体内的部分侧壁的面积占导电柱51侧壁面积的1/4～1/2之间，如导电柱51外露在槽体内的部分侧壁的面积占导电柱51侧壁总面积的1/2、1/3、1/4等不同的比例。在采用上述布置方式时，既保证了导电柱51与导电胶52的接触面积，降低了隔离墙50的电阻，同时，还可降低导电胶52的使用量。
作为一个可选的方案，多个导电柱51的总体积V1与隔离墙50的体积V2之比大于或等于10％且小于或等于30％。其中，多个导电柱51的总体积V1为多个导电柱51的体积v之和；隔离墙50的体积V2为多个导电柱51的总体积V1与导电胶52的体积V3之和。示例性的，V1:V2的比值可以为10％、15％、20％、25％、30％等任意介于10％～30％的值。在采用上述比例时，可保证设置的导电柱51可改善整个隔离墙50的导电率。另外，在采用上述比例的导电柱51时，当隔离墙50的总体积V2不变时，相对于现有技术中采用导电胶制备而成的等体积隔离墙时，可减少10％～30％量的导电胶52的使用量。
作为一个可选的方案，导电柱51之间间距介于大于或等于50μm且小于或等于100μm，以满足现有技术的开槽工艺，降低开槽的尺寸，进而降低导电胶52的使用量。示例性的，导电柱51之间的间距可介于50μm、80μm、120μm、200μm、240μm、280μm、100μm等任意介于50μm～100μm之间的距离。应理解上述导电柱51之间的间距既包括沿方向a相邻的两个导电柱51之间的间距，也包括沿方向b相邻的两个导电柱51之间的间距。
导电柱51可采用不同材料制备而成的导电柱，如导电柱51可采用铜、铝、铁、银、金等常见的导电材料。较佳的，导电柱51采用铜柱，铜柱具有良好的导电率以及较低的成本。在导电胶52采用银胶、导电柱51采用铜柱时，可降低隔离墙50的成本。另外，在采用上述的导电柱51及导电胶52的排布方式，还可减少导电胶52的用量，进一步的降低了隔离墙50的成本。
导电柱51的形状可采用不同的形状，如导电柱51可为矩形柱、椭圆柱、圆柱等不同形状的柱体。在本申请实施例中，导电柱51优选为圆柱，一方面方便制备，另一方面也方便与导电胶52连接。另外，导电柱51可采用直径不变的直圆柱，也可采用直径变化的阶梯柱或者锥形柱体，在具体应用时可根据实际的需要而定。
作为一个可选的方案，在导电柱51为圆柱时，导电柱51的直径介于大于或等于20μm且小于或等于50μm，保证了导电柱51具有一定的体积。示例性的，导电柱51的直径可为20μm、25μm、30μm、35μm、40μm、45μm、5μm等任意介于20μm～50μm之间的尺寸。
导电柱51在与基板10的地层电连接时，每个导电柱51通过基板10上的焊盘与地层电连接。导电柱51与焊盘连接时，可采用不同的方式。示例性的，导电柱51可通过引线键合工艺在基板10上植入两排导电柱51。引线键合(Wire Bonding)是一种使用细金属线，利用热、压力、超声波能量将金属引线与基板10焊盘紧密焊合。或者，导电柱51还可通过氩弧焊、激光焊等不同的焊接方式实现导电连接。
作为一个可选的方案，基板10上的焊盘的直径大于导电柱51的直径。示例性的，焊盘的直径可为60μm、70μm、80μm等大于导电柱51直径的不同尺寸。采用较大尺寸的焊盘时，既方便了导电柱51与焊盘之间的焊接，同时也可通过较大的焊盘提升导电柱51与地层的电连接效果。
作为一个可选的方案，基板10的部分焊盘外露在槽体内，在导电胶52填充到槽体内 时，导电胶52可与外露在槽体内的焊盘电连接。提升了隔离墙50与地层电连接的效果，进而提高隔离墙50的电磁隔离效果。
隔离墙50与屏蔽罩60电连接时，包括但不限定隔离墙50的顶端及侧壁分别与屏蔽罩的顶壁及侧壁电连接、隔离墙50的顶端与屏蔽罩60的顶壁电连接或隔离墙50的侧端与屏蔽罩60的侧壁电连接。为方便描述，在图2a中引入了方向c，方向c垂直于基板10的承载面，方向c分别与方向a和方向b垂直。如图2a所示，隔离墙50的高度沿方向c，隔离墙50的顶端指隔离墙50背离基板10的端面。在设置隔离墙50时，隔离墙50的顶端与屏蔽罩60的顶面(屏蔽罩60朝向基板10设置第一器件组20的设置面的表面)电连接。在屏蔽罩60采用金属层时，隔离墙50外露在塑封体40外，金属层形成在塑封体40时，覆盖隔离墙50的顶端并与隔离墙50电连接。
隔离墙50的顶端与屏蔽罩60的顶面电连接时，可采用不同的方式。示例性的，屏蔽罩60仅通过导电胶52与隔离墙50电连接，导电柱51未与屏蔽罩60直接电连接。如图2a中所示，屏蔽罩60覆盖导电胶52，且与导电胶52电连接。导电柱51与屏蔽罩60之间间隔有间隙，导电柱51通过导电胶52与屏蔽罩60电连接。如导电柱51与屏蔽罩60之间间隔有间隙小于等于300μm。具体的，导电柱51与屏蔽罩60之间的间隙沿方向c方向的尺寸可为10μm、20μm、50μm、100μm、120μm、150μm、200μm、250μm、290μm、300μm等任意小于等于300μm的间隙。在采用上述结构时，导电柱51的长度满足距离屏蔽罩60的内壁最小距离小于等于300μm，保证导电柱51具有足够的高度，以提升第一器件组20和第二器件组30之间的隔离效果。隔离墙50与屏蔽罩60连接时，还可采用导电柱51与屏蔽罩60连接，即导电柱51的顶端与屏蔽罩60的内壁相接触，两者之间直接连接。在导电柱51与屏蔽罩60直接连接时，多个导电柱51将第一器件组20和第二器件组30隔离，可提升第一器件组20和第二器件组30之间的隔离效果。
为方便理解本申请实施例提供的隔离墙50的效果，下面结合图3对其进行说明。图3示例出了如下表不同电导率材料对于不同频率信号的仿真示意图。由图3可看出，电导率低的结构的电磁屏蔽效能低于电导率高的结构的电磁屏蔽效能。如针对低频信号屏蔽效能会少15db，高频信号屏蔽效能会少2～8db。而现有技术中的金属胶材料是多孔结构，其电导性约为5e 5S/m，低于纯铜材料的导电率(5.7e 7)约2个数量级，因为其电磁效能也不佳。而本实施案例提供的隔离墙50采用铜柱与银胶混合的结构，可提升整体结构的导电性，因而将带来更好电磁屏蔽效果。
为方便理解本申请实施例提供的封装模组的制备过程，下面详细说明其制备流程。
本申请实施例提供的封装模组的制备方法包括以下步骤：
步骤001：在基板上设置至少两个器件组；
如图4a所示，上述步骤包括准备基板10，基板10可为印刷电路板或者其他类型的基板。但无论采用哪种类型的基板，基板10中均包含至少一层的金属线路层。金属线路层包括用于与至少两个器件组电连接的电路层以及地层。另外基板10上还设置有多个焊盘，如用于与至少两个器件组电连接的焊盘，以及用于与屏蔽结构电连接的焊盘。如图4b所示，在设置至少两个器件组时，在基板10的承载面贴装器件，如图4b中所示的第一器件组20和第二器件组30。器件组中的器件可包括各种有源无源器件、芯片、孤立的元器件或者元器件封装(封装的芯片)。
步骤002：在基板10上设置与基板的地层电连接的多个导电柱；其中，多个导电柱间 隔排列，多个导电柱将每相邻的两个器件组隔离；
如图4c所示，在两个器件组之间设计信号隔断区域，在信号隔断区域中采用引线键合工艺植入两排导电柱51。引线键合(Wire Bonding)是一种使用细金属线，利用热、压力、超声波能量为使金属引线与基板10上的焊盘紧密焊合。其中的导电柱51可采用铜柱，铜柱的直径可为30μm，铜柱连接的焊盘的直径可为60μm。相邻的两个铜柱中心的距离大于或等于150且小于或等于300μm。另外设置的铜柱的高度不高于整个系统级封装的塑封体高度,可能的高度范围为0.1mm～1.5mm。
步骤003：在多个导电柱之间的间隙内填充导电胶，并与相邻的导电柱电连接；
如图4d所示，设置塑封体40包裹第一器件组20、第二器件组30及多个导电柱51，以将第一器件组20、第二器件组30及多个导电柱51封装。示例性的，塑封体40的材料可采用环氧树脂、丙烯酸树脂材料、电介质材料、热固材料、热塑材料、橡胶或其他绝缘材料制备而成。制备工艺可采用注入工艺在模制工具内形成绝缘层。在器件组为至少两个时，塑封体40将至少两个器件组包裹。
如图4e所示，在相邻两排导电柱之间具有一个开槽，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在所述槽内。具体的，在铜柱区域(相邻的两排铜柱之间)使用激光刻蚀槽体41。示例性的，可采用激光切割的工艺。激光切割是利用经聚焦的高功率密度激光束照射工件，使被照射的材料迅速熔化、汽化、烧蚀或达到燃点，同时借助与光束同轴的高速气流吹除熔融物质，从而实现将工件割开。基于塑封体40采用的材料对于不同波长激光能量吸收敏感性，可实现选择性开槽。在开槽时，可选择性只把塑封体40的绝缘材料去除，而保留导电柱51不被去除。从而使得每个导电柱51的部分侧壁外露在槽体41内。可选的，开槽的宽度大于或等于100μm且小于或等于300μm，如开槽的宽度为100μm、150μm、200μm、250μm、300μm等任意介于100μm～300μm的宽度。上述开槽的宽度为槽体41在沿第一器件组20和第二器件组30排列方向上的宽度。可选的，在开槽时，铜柱的顶端可裸露出来也可不裸露出来。
如图4f所示，在所述槽内填充导电胶，所述导电胶包裹每个导电柱外露在槽内的部分侧壁。通过采用在槽体内填充导电胶52，实现导电柱51与导电胶52的电连接，并组成隔离墙50。具体的，在刻蚀出来的槽体中填充导电胶52材料。实现导电柱51部分外露表面和导电胶52材料电连通。本申请实施案例的导电胶52可采用银胶材料，银胶具备一定流动性，在一定压力和温度条件下，可填充满开槽结构，且保证能够与导电柱51良好的接触。在填充银胶材料后，对银胶材料做热固化处理。示例性的，固化工艺可采用在100～175摄氏度环境烘烤0.5～2个小时。
步骤004：制备屏蔽罩60。
如图4g所示，在整个封装模组的上表面和侧壁附着屏蔽罩60。实现导电胶52和屏蔽罩60电导通。在制备屏蔽罩60时，可采用工艺为物理溅射沉积。屏蔽罩60可采用不锈钢层、铜层的单层或者多层相结合的方式。屏蔽罩60的材料可采用除不锈钢外，还可采用其他可沉积的金属材料，如铜、镍和铝。另外，屏蔽罩60还可采用化学气相沉积金属、电镀等方法制备而成。制备的屏蔽罩60与隔离墙50及基板10的地层电连接。屏蔽罩60与隔离墙50的电连接方式可参考上述实施例中的相关结构描述，在此不再赘述。
通过上述描述可看出，在采用上述制备方法制备的封装模组，通过导电柱51与导电胶52组成隔离墙50，一方面采用的导电柱51的导电率大于导电胶52，从而提升了隔离 墙50的导电率；另一方面，采用导电柱51作为隔离墙50的一部分，可减少导电胶52的使用量，可降低整个屏蔽结构的成本，进而降低整个封装模组的成本。
图5a及图5b，图5a示出了本申请实施例提供的系统级封装的一种变形结构，图5b示出了隔离墙50的俯视图。图5a及图5b中的部分标号可参考图2a及图2b中的相同标号。在图5a及图5b所示的隔离墙50中，多个导电柱51排列成两排，每排导电柱中的导电柱51沿方向b排列，两排导电柱沿方向a排列。在两排导电柱51中，沿方向a相邻的两个导电柱51之间间隔有间隙，沿方向b相邻的两个导电柱51之间也间隔有间隙。作为一个可选的方案，两排导电柱51中的导电柱51错位设置。即沿方向b，两排导电柱51的设置位置相错。在填充导电胶52时，导电胶52包裹每个导电柱51外露在槽体内的部分侧壁。在采用如图5b所示的导电柱51排列方式时，两排错位排列的导电柱51会在b方向上外露更多的导电柱51侧壁，从而可有更多的电磁信号反射面，带来了更好的电磁屏蔽效果。
图6a及图6b，图6a示出了本申请实施例提供的系统级封装的一种变形结构，图6b示出了隔离墙50的俯视图。图6a及图6b中的部分标号可参考图2a及图2b中的相同标号。在图6a及图6b所示的隔离墙50中，多个导电柱51阵列排列成两排。为填充导电胶52，每相邻的四个导电柱51之间具有一个填充孔，且每个导电柱51的部分侧壁外露在对应的填充孔。以图6b所示的结构为例。任意相邻的四个导电柱51之间开设有一个填充孔，多个填充孔沿方向b排列。且填充孔与一行导电柱51(沿方向a排列成行的导电柱51)交替排列。每个导电柱51均对应有至少一个填充孔，且每个导电柱51的部分侧壁外露在对应的填充孔中。导电胶52填充在每个填充孔，且导电胶52包裹每个导电柱51外露在对应的填充孔中的部分侧壁。以图6b所示的结构为例，每个填充孔填充的导电胶52与该填充孔中外露的每个导电柱51的部分侧壁均电连接。通过填充孔与一行导电柱51交替排列的方式，将多个导电柱51导电连接在一起。在采用上述结构时，相比图2a及图2b所示的开槽方式，可进一步的降低银胶的使用量，降低屏蔽结构的成本，同时也降低封装模组的成本。
作为一个可选的方案，填充孔的直径可大于或等于100μm且小于或等于300μm。如填充孔的直径可为100μm、150μm、200μm、250μm、300μm等任意介于100μm～300μm的尺寸。在采用上述孔径时，即可保证导电柱51之间的电连接效果，降低形成的隔离墙50的电阻，同时也可尽量降低导电胶52的使用量。
在采用上述结构时，对应的制备方法与图2a及图2b对应的制备方法相近似。唯一的区别在于在导电柱51之间的间隙内填充导电胶52，并与导电柱51电连接的步骤。在采用填充孔结构时，该步骤可采用：设置塑封体40包裹第一器件组20、第二器件组30及多个导电柱51，具体方案可参考图4d的相关描述。在每相邻的四个导电柱51之间开设一填充孔，每个导电柱51的部分侧壁被所述塑封体所包裹，部分侧壁外露在对应的填充孔，开孔的工艺可参考开槽体的工艺，在此不再赘述。在填充孔内填充导电胶52，导电胶52包裹导电胶52包裹每个导电柱51外露在对应的填充孔中的部分侧壁。导电胶52的材质以及填充工艺可参考图4e中的相关描述，在此不再赘述。
图7a及图7b，图7a示出了本申请实施例提供的系统级封装的一种变形结构，图7b示出了隔离墙50的俯视图。图7a及图7b中的部分标号可参考图2a及图2b中的相同标号。在图7a及图7b所示的隔离墙50中，多个导电柱51排列成三排，每排导电柱51沿方向b排列，三排导电柱51沿方向a排列。在三排导电柱51中，沿方向a相邻的两个导电柱51 之间间隔有间隙，沿方向b相邻的两个导电柱51之间也间隔有间隙。作为一个可选的方案，三排导电柱51中的导电柱51一一对齐，即三个导电柱51沿方向a呈行排列，多个导电柱51呈矩阵排列。塑封体40设置的槽体为两个，两个槽体沿方向b排列，一排导电柱51位于两个槽体之间。每个导电柱51部分侧壁外露在对应的槽体中，在填充导电胶52时，导电胶52与导电柱51外露在槽体内的部分侧壁电连接。由图7a及图7b可看出，在本申请实施例提供的隔离墙50中，也可采用多排导电柱51，同样也可达到隔离第一器件组20和第二器件组30的效果。
图8a及图8b，图8a示出了本申请实施例提供的系统级封装的一种变形结构，图8b示出了隔离墙50的俯视图。图8a及图8b中的部分标号可参考图2a及图2b中的相同标号。在图9a及图9b所示的隔离墙50中，多个导电柱51排列成三排，每排导电柱51沿方向b排列，三排导电柱51沿方向a排列。在三排导电柱51中，沿方向a相邻的两个导电柱51之间间隔有间隙，沿方向b相邻的两个导电柱51之间也间隔有间隙。作为一个可选的方案，三排导电柱51中的导电柱51一一对齐，即三个导电柱51沿方向a呈行排列，多个导电柱51呈矩阵排列。槽体在开设时，位于最外层的多个导电柱51部分侧壁外露在槽体内；位于中间的导电柱51的侧壁外露在槽体中。填充导电胶52时，导电胶52包裹位于最外层的导电柱51外露在槽体内的部分侧壁。由图8a及图8b可看出，在本申请实施例提供的隔离墙50中，也可采用多排导电柱51，同样也可达到隔离第一器件组20和第二器件组30的效果。
图9a及图9b，图9a示出了本申请实施例提供的系统级封装的一种变形结构，图9b示出了隔离墙50的俯视图。图9a及图9b中的部分标号可参考图2a及图2b中的相同标号。在图9a及图9b所示的隔离墙50中，多个导电柱51呈单排排列。如图9b中所示，多个导电柱51沿方向b排列，且呈单排排列的方式。沿方向b，相邻的导电柱51之间具有间隙。导电胶52填充在该间隙内，且导电胶52与多个导电柱51交替设置，将多个导电柱51电连接成一体。在具体设置导电胶52时，塑封体40设置有多个填充孔，每个填充孔设置在任意相邻的两个导电柱51之间。如图9b所示，多个填充孔沿方向b排列，填充孔与导电柱51交替排列。每个导电柱51至少对应一个填充孔，且每个导电柱51的部分侧壁外露在对应的填充孔。在填充导电胶52时，导电胶52填充在每个填充孔，且导电胶52包裹每个导电柱51外露在对应的填充孔中的部分侧壁。即每个填充孔内的导电胶52包裹导电柱51外露在该填充孔内的部分侧壁。由图9b所示的结构可看出，在采用导电柱51与导电胶52交替排列的方式，也可形成长度方向沿方向b的隔离墙50，将第一器件组20和第二器件组30隔离。
作为一个可选的方案，填充孔的直径可大于或等于100μm且小于或等于300μm。如填充孔的直径可为100μm、150μm、200μm、250μm、300μm等任意介于100μm～300μm的尺寸。在采用上述孔径时，即可保证导电柱51之间的电连接效果，降低形成的隔离墙50的电阻，同时也可尽量降低导电胶52的使用量。
在采用上述结构时，对应的制备方法与图2a及图2b对应的制备方法相近似。唯一的区别在于在导电柱51之间的间隙内填充导电胶52，并与导电柱51电连接的步骤。在采用填充孔结构时，该步骤可采用：设置塑封体40包裹第一器件组20、第二器件组30及多个导电柱51，具体方案可参考图4d的相关描述。在每相邻的两个导电柱51之间开设一个填充孔，每个导电柱51的部分侧壁被所述塑封体所包裹，部分侧壁外露在对应的填充孔。 开孔的工艺可参考开槽体的工艺，在此不再赘述。在填充孔内填充导电胶52，导电胶52包裹导电胶52包裹每个导电柱51外露在对应的填充孔中的部分侧壁。导电胶52的材质以及填充工艺可参考图4e中的相关描述，在此不再赘述。
由上述图2b、图5b、图6b、图7b、图8b可看出，在本申请实施例提供的多个导电柱51可排列成多排，每排的方向为隔离墙的长度方向。在相邻两排导电柱51之间填充导电胶52，通过导电胶52包裹导电柱51的部分侧壁，即可实现将多个导电柱51电连接成一体，组成隔离墙50。当然导电柱51也可采用单排的方式，如图9b中所示，也可实现将多个导电柱51电连接成一体，组成隔离墙50。应理解，在上述示例的几种隔离墙50中，隔离墙50均沿直线排列。但本申请实施例体用的隔离墙50不仅限于上述列举的直线型，还可采用其他的方式，只需要隔离墙50通过导电柱51与导电胶52混合组成的方式，即可应用在本申请实施例中。如隔离墙50还可采用其他的方式如S形、弧线形、波浪形等不同的形状。在隔离墙50采用不同的形状时，对应的导电柱51的排布方式与导电胶52的填充方式与隔离墙50的形状适配即可。
在器件组的个数为多个时，隔离墙50也可为多个，且隔离墙50的排布方式与器件组的排布方式相对应。如在多个器件组呈阵列排列时，隔离墙50也可形成网格状，且每个网格对应可容纳一个器件组。每个网格可采用三个、四个、五个等不同个数的隔离墙50围成。在多个器件组呈单排排列时，隔离墙50也可为多个，多个隔离墙50平行设置，相邻的两个隔离墙50之间隔离出容纳器件组的空间。
本申请实施例还提供了一种电子设备，该电子设备为具备通信功能的电子设备，如紧凑便携式的电子设备，如智能手机，智能手表，无线路由器等。这些电子设备内部包括易受射频干扰影响的器件，如Wifi，蓝牙，蜂窝信号相关的射频收发器电路；以及其他需使用时钟信号的器件，如处理器、储存器等。
本申请实施例提供的电子设备包括电路板，以及上述任一项的封装模组，封装模组固定在所述电路板上，电路板与基板电连接。以图10所示的智能手表为例，智能手表包括壳体100，以及设置在壳体100内的电路板200，还包括设置在电路板200上的封装模组300。电路板200与封装模组300的基板电连接，以实现基板内的器件的功能。作为一个可选的，电路板200还可作为封装模组300的基板，从而可简化电子设备中的结构。在采用上述结构时，通过导电柱与导电胶组成隔离墙，一方面采用导电柱作为隔离墙的一部分，且采用的导电柱的导电率大于导电胶，从而提升了隔离墙的导电率；另一方面，采用导电柱作为隔离墙的一部分，可减少导电胶的使用量，可降低整个屏蔽结构的成本，进而降低整个电子设备的成本。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (14)

  1. 一种封装模组，其特征在于，包括基板，设置在所述基板上的至少两个器件组，以及用于屏蔽所述至少两个器件组的屏蔽结构；
    所述屏蔽结构包括隔离墙，所述隔离墙用于电磁隔离所述至少两个器件组中每相邻的两个器件组；
    所述隔离墙包括多个导电柱及导电胶，其中，所述多个导电柱与所述基板的地层电连接；所述多个导电柱间隔排列，所述导电胶填充在每相邻的导电柱之间的间隙内，且所述导电胶将相邻的导电柱电连接；
    所述导电柱的导电率大于所述导电胶的导电率。
  2. 如权利要求1所述的封装模组，其特征在于，所述屏蔽结构还包括屏蔽罩，所述屏蔽罩朝向所述基板的至少部分表面并与所述基板的地层电连接，所述至少两个器件组位于所述屏蔽罩与所述基板围成的空间内；
    所述导电胶与所述屏蔽罩电连接。
  3. 如权利要求2所述的封装模组，其特征在于，所述导电柱与所述屏蔽罩的内壁相接触。
  4. 如权利要求2所述的封装模组，其特征在于，所述导电柱与所述屏蔽罩之间间隔有间隙，所述导电胶填充在所述屏蔽罩与所述导电柱之间的间隙。
  5. 如权利要求3所述的封装模组，其特征在于，在所述导电柱与所述屏蔽罩之间间隔有间隙时，所述间隙小于或等于300μm。
  6. 如权利要求1～5任一项所述的封装模组，其特征在于，所述多个导电柱排布成多排，所述排的方向为所述隔离墙的长度方向；
    所述封装模组还包括塑封体，所述至少两个器件组均被塑封在所述塑封体内，且每个导电柱的部分侧壁被所述塑封体所包裹；
    相邻两排导电柱之间具有一个开槽，每个导电柱的部分侧壁外露在所述槽内；
    所述导电胶填充在所述槽内，且包裹所述每个导电柱外露在所述槽内的部分侧壁。
  7. 如权利要求1～5任一项所述的封装模组，其特征在于，所述多个导电柱排布成多排，所述排的方向为所述隔离墙的长度方向；
    所述封装模组还包括塑封体，所述至少两个器件组均被塑封在所述塑封体内，且每个导电柱的部分侧壁被所述塑封体所包裹；
    每相邻的四个导电柱之间具有一个填充孔，且每个导电柱的部分侧壁外露在对应的填充孔；
    所述导电胶填充在每个填充孔，且所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。
  8. 如权利要求1～5任一项所述的封装模组，其特征在于，所述多个导电柱排列成一排；
    所述封装模组还包括塑封体，所述至少两个器件组被塑封在所述塑封体内，且每个导电柱的部分侧壁被所述塑封体所包裹；
    每相邻的两个导电柱之间具有一个填充孔，且每个导电柱的部分侧壁外露在对应的填充孔；
    所述导电胶填充在每个填充孔，且所述导电胶包裹所述每个导电柱外露在对应的填充 孔中的部分侧壁。
  9. 如权利要求1～8任一项所述的封装模组，其特征在于，所述多个导电柱的总体积与所述隔离墙的体积之比大于或等于10％且小于或等于30％。
  10. 一种电子设备，其特征在于，包括电路板，以及如权利要求1～9任一项所述的封装模组，所述封装模组固定在所述电路板上。
  11. 一种封装模组的制备方法，其特征在于，包括以下步骤：
    在基板上设置至少两个器件组；
    在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；
    在所述多个导电柱之间的间隙内填充导电胶，并将相邻的导电柱电连接；
    所述导电柱与所述导电胶电磁隔离每相邻的两个器件组。
  12. 如权利要求11所述的封装模组的制备方法，其特征在于，所述在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；具体为：
    所述多个导电柱排布成多排；
    设置塑封体包裹所述至少两个器件组及所述多个导电柱；
    在相邻两排导电柱之间具有一个开槽，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在所述槽内；
    在所述槽内填充导电胶，所述导电胶包裹所述每个导电柱外露在所述槽内的部分侧壁。
  13. 如权利要求11所述的封装模组的制备方法，其特征在于，所述在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；具体为：
    所述多个导电柱排布成多排；
    设置塑封体包裹所述至少两个器件组及所述多个导电柱；
    在每相邻的四个导电柱之间开设一填充孔，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在对应的填充孔；
    在所述填充孔内填充导电胶，所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。
  14. 如权利要求11所述的封装模组的制备方法，其特征在于，所述在所述基板上设置与所述基板的地层电连接的多个导电柱；其中，所述多个导电柱间隔排列，所述多个导电柱将每相邻的两个器件组隔离；具体为：
    所述多个导电柱排布成一排；
    设置塑封体包裹所述至少两个器件组及所述多个导电柱；
    在每相邻的两个导电柱之间开设一个填充孔，每个导电柱的部分侧壁被所述塑封体所包裹，部分侧壁外露在对应的填充孔；
    在所述填充孔内填充导电胶，所述导电胶包裹所述每个导电柱外露在对应的填充孔中的部分侧壁。
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