WO2022032718A1 - 一种显示面板及显示装置 - Google Patents

一种显示面板及显示装置 Download PDF

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Publication number
WO2022032718A1
WO2022032718A1 PCT/CN2020/110767 CN2020110767W WO2022032718A1 WO 2022032718 A1 WO2022032718 A1 WO 2022032718A1 CN 2020110767 W CN2020110767 W CN 2020110767W WO 2022032718 A1 WO2022032718 A1 WO 2022032718A1
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WO
WIPO (PCT)
Prior art keywords
virtual
bonding pads
chip
bonding pad
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/110767
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English (en)
French (fr)
Inventor
卢延涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to KR1020217030900A priority Critical patent/KR102554227B1/ko
Priority to US17/051,980 priority patent/US12446415B2/en
Priority to EP20885393.7A priority patent/EP4198952A4/en
Priority to JP2021520592A priority patent/JP2022547752A/ja
Publication of WO2022032718A1 publication Critical patent/WO2022032718A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/331—Bonding techniques, e.g. hybrid bonding characterised by the application of energy for connecting
    • H10W80/333—Compression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present application relates to the field of display panels, and in particular, to a display panel and a display device.
  • FIG. 1 is a schematic structural diagram of a display panel provided in the prior art.
  • the display panel 100 includes a display substrate 10 , a display area 20 , a fan-out area 30 , a chip 40 , a bonding pad 50 , and gold fingers 70.
  • the flexible circuit board 60, the chip 40 is arranged on the display substrate 10 on one side of the display area 20, the bonding pads 50 are arranged on the display substrate 10 and are located on the left and right sides of the chip 40, and the gold finger 70 is arranged on the flexible circuit board 60 on the surface of the bonding pad 50 . Since the number of bonding pads on both sides of the chip is small, the contact area between the entire flexible circuit board and the display substrate is small, which may cause the flexible circuit board to be pulled out when the flexible circuit board is pulled.
  • An object of the present invention is to provide a display panel, which can solve the problem of the small contact area between the flexible circuit board and the display substrate in the prior art.
  • the present invention provides a display panel, including a display substrate, a flexible circuit board, and a chip, which are arranged on the display substrate on one side of the display area; a bonding pad is arranged on the display substrate and are located on at least one side of the left and right sides of the chip; virtual bonding pads are arranged on the display substrate on one side of the bonding pads; gold fingers are arranged on the flexible circuit board, and are corresponding to the The surfaces of the bonding pads are connected to each other; the virtual gold fingers are arranged on the flexible circuit board on one side of the gold fingers, and are correspondingly connected to the surfaces of the virtual bonding pads.
  • a virtual bonding pad is added to one side of the bonding pad, and some virtual gold fingers are also added to the corresponding position of the flexible circuit board.
  • the contact area between the flexible circuit board and the display panel is increased, thereby increasing the pulling force of the flexible circuit board.
  • a wire is provided between the bonding pad and the chip, and the bonding pad is connected to the chip through the wire.
  • no leads are provided between the dummy bonding pad and the chip. Because the purpose of setting the dummy bonding pads is to increase the contact area between the flexible circuit board and the display panel, the dummy bonding pads do not need to play an electrical role.
  • a fan-out area is also included, and the fan-out area includes a cathode lead, which connects the chip and each column of pixels in the display area; an anode lead, which connects the chip and the Lines of pixels in the display area.
  • the positions of the cathode lead and the anode lead can also be interchanged, that is, one end of the anode lead is connected to the chip, and the other end is connected to each column of pixels in the display area respectively; One end of the cathode lead is connected to the chip, and the other end is respectively connected to each row of pixels in the display area.
  • a conductive adhesive film is also included, and the bonding pad and the gold finger are press-bonded and connected through the conductive adhesive film.
  • the conductive adhesive film further includes conductive gold balls, and the bonding pads and the gold fingers are electrically connected through the conductive gold balls.
  • a conductive adhesive film is also provided between the virtual bonding pad and the virtual gold finger, but the conductive gold ball is not provided, and the virtual bonding pad is connected to the virtual gold finger.
  • the virtual golden fingers do not need to be electrically connected, and only need to be pasted correspondingly to increase the contact area between the flexible circuit board and the display panel.
  • the number of the gold fingers is the same as the number of the binding pads, the number of the binding pads is two or more, and the number of the binding pads is more than two. Isolated from each other, the plurality of gold fingers are isolated from each other.
  • the bonding pads are rectangular.
  • the arrangement direction of the bonding pads is perpendicular to the length direction of the bonding pads.
  • the shape of the bonding pad may be an ellipse or a polygon, which is not limited herein.
  • the size of the bonding pad and the virtual bonding pad is the same, the width is preferably 4mm, and the length is preferably 9mm.
  • the number of the virtual gold fingers is the same as the number of the virtual bonding pads, the number of the virtual bonding pads is two or more, and a plurality of the virtual bonding pads The pads are isolated from each other, and the plurality of virtual gold fingers are isolated from each other.
  • the flexible circuit board is Y-shaped.
  • the flexible circuit board includes a main body and a connecting end, and both the gold finger and the virtual gold finger are disposed on the connecting end.
  • the present invention also provides a display device, including the display panel involved in the present invention.
  • the present invention provides a display panel and a display device, in which a virtual bonding pad is added to one side of the bonding pad, and some virtual bonding pads are also added to the corresponding position of the flexible circuit board.
  • the gold finger, the surface of the virtual bonding pad and the surface of the virtual gold finger are in one-to-one contact, which can increase the contact area between the flexible circuit board and the display panel, thereby increasing the pulling force of the flexible circuit board.
  • FIG. 1 is a schematic structural diagram of a display panel provided in the prior art
  • FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a display substrate according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present invention.
  • Display panel-100 Display substrate-10;
  • Display panel-100 Display substrate-10;
  • a first feature "on” or “under” a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
  • FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the present invention.
  • the display panel 100 includes a display substrate 10 and a flexible circuit board 60.
  • the display substrate 10 includes a display area 20, a fan-out area 30, a chip 40, Bonding pad 50 , dummy bonding pad 51 .
  • FIG. 3 is a schematic structural diagram of a display substrate according to an embodiment of the present invention.
  • the chip 40 is disposed on the display substrate 10 on one side of the display area 20
  • the bonding pads 50 are disposed on the display substrate 10 and are located on the left and right sides of the chip 40 . Both sides; the dummy bonding pads 51 are provided on the display substrate 10 on one side of the bonding pads 50 .
  • the bonding pads 50 are rectangular, and the arrangement direction of the bonding pads 50 is vertical to the length direction of the bonding pads; the virtual bonding pads 51 are rectangular, and the arrangement direction of the virtual bonding pads 51 is vertical The length direction of the bond pad.
  • the shapes of the bonding pads 50 and the virtual bonding pads 51 may be elliptical or polygonal, which are not limited herein.
  • the size of the bonding pad 50 and the dummy bonding pad 51 are the same, the width is preferably 4 mm, and the length is preferably 9 mm, so compared with the bonding pad in the prior art with a width and a length of 6 mm pad, the width of the bond pad 50 is reduced and the current carrying area is unchanged.
  • the size of the golden finger 70 and the virtual virtual golden finger 71 are the same, the width is preferably 4 mm, and the length is preferably 9 mm.
  • the fan-out area 50 includes a cathode lead and an anode lead.
  • One end of the cathode lead is connected to the chip 40 , and the other end is connected to each column of pixels in the display area 20 ;
  • one end of the anode lead is connected to the chip 40 , and the other end is connected to each row in the display area 20 respectively. pixel.
  • the positions of the cathode lead and the anode lead can also be interchanged, that is, one end of the anode lead is connected to the chip 40, and the other end is connected to each column of pixels in the display area 20; one end of the cathode lead is connected to the chip 40, and the other end is connected to the chip 40. One end is respectively connected to each row of pixels in the display area 20 .
  • FIG. 4 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention.
  • the flexible circuit board 60 is Y-shaped, the flexible circuit board 60 includes a main body 61 and a connecting end 62 , and the gold finger 70 and the virtual gold finger 71 are both disposed on the connecting end 62 .
  • the gold finger 70 is correspondingly connected to the surface of the bonding pad; the virtual gold finger 71 is provided on the flexible circuit board 60 on one side of the gold finger 70 and is correspondingly connected to the surface of the virtual bonding pad 51 .
  • a virtual bonding pad 51 is added to one side of the bonding pad 50, and some virtual gold fingers 71 are also added to the corresponding position of the flexible circuit board 60.
  • the surface of the virtual bonding pad 51 and the surface of the virtual gold finger 71 are one by one.
  • the contact area between the flexible circuit board 60 and the display panel 100 can be increased, thereby increasing the pulling force of the flexible circuit board 60 .
  • a lead 80 is provided between the bonding pad and the chip 40 , and the bonding pad is connected to the chip 40 through the lead 80 .
  • No lead is set between the dummy bonding pad 51 and the chip 40 , because the purpose of setting the dummy bonding pad 51 is to increase the contact area between the flexible circuit board 60 and the display panel 100 , so the dummy bonding pad 51 does not need to play electricity. sexual effect.
  • a conductive adhesive film is further disposed between the bonding pad 50 and the gold finger 70 , and the bonding pad 50 and the gold finger 70 are press-bonded and connected by the conductive adhesive film.
  • the conductive adhesive film further includes conductive gold balls, and the bonding pads 50 and the gold fingers 70 are electrically connected through the conductive gold balls.
  • a conductive adhesive film is also provided between the virtual bonding pad 51 and the virtual gold finger 71, but no conductive gold ball is provided. There is no need for electrical connection between the virtual bonding pad 51 and the virtual gold finger 71, and only the corresponding The sticking can increase the contact area between the flexible circuit board 60 and the display panel 100 .
  • the number of the gold fingers 70 is the same as the number of the bonding pads 50 , the number of the bonding pads 50 is more than two, the plurality of bonding pads 50 are isolated from each other, and the plurality of gold fingers 70 are isolated from each other.
  • the distance between two adjacent bonding pads 50 is preferably 0.4 mm, and the distance between two adjacent gold fingers 70 is preferably 0.4 mm.
  • the number of virtual gold fingers 71 is the same as the number of virtual bonding pads 51 , the number of virtual bonding pads 51 is two or more, the plurality of virtual bonding pads 51 are isolated from each other, and the plurality of virtual gold fingers 71 are separated from each other. isolated from each other.
  • the distance between two adjacent dummy bonding pads 51 is preferably 0.4mm, and the distance between two adjacent dummy gold fingers 71 is preferably 0.4mm.
  • the present invention further provides a display device including the display panel 100 involved in the present invention.
  • the present invention provides a display panel and a display device, wherein a virtual bonding pad 51 is added to one side of the bonding pad 50, and some virtual gold fingers 71 are also added to the corresponding position of the flexible circuit board 60. , the surfaces of the virtual bonding pads 51 and the surfaces of the virtual gold fingers 71 are in one-to-one contact, which can increase the contact area between the flexible circuit board 60 and the display panel 100 , thereby increasing the pulling force of the flexible circuit board 60 .
  • a display panel and a screen display device provided by the embodiments of the present application have been introduced in detail above.
  • the principles and implementations of the present application are described with specific examples in this article.
  • the technical solution of the application and its core idea; those of ordinary skill in the art should understand that: it can still make modifications to the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some of the technical features; and these modifications or replacements,
  • the essence of the corresponding technical solutions does not deviate from the scope of the technical solutions of the embodiments of the present application.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本申请公开了一种显示面板及显示装置，显示面板包括显示基板和柔性电路板，以及芯片，设于显示区一侧的所述显示基板上；绑定焊盘，设于所述显示基板上且位于所述芯片左右至少一侧；虚拟绑定焊盘，设于所述绑定焊盘一侧的所述显示基板上。

Description

一种显示面板及显示装置 技术领域
本申请涉及显示面板领域，尤其地涉及一种显示面板及显示装置。
 背景技术
由于目前显示屏屏占比不断提高，所以需要显示器的下边框越来越小。请参阅图1，图1所示为现有技术中提供的显示面板的结构示意图，显示面板100包括显示基板10、显示区20、扇出区30、芯片40、绑定焊盘50、金手指70、柔性电路板60，芯片40设于显示区20一侧的显示基板10上，绑定焊盘50设于显示基板10上且位于芯片40左右两侧，金手指70设于柔性电路板60上，且对应地与绑定焊盘50的表面相接。由于绑定焊盘在芯片两侧的数量较少，导致柔性电路板整体与显示基板的接触面积小，可能导致在拉拔柔性电路板时可能将柔性电路板拉拔掉。
因此，确有必要来开发一种新型的显示面板，以克服现有技术的缺陷。
 技术问题
本发明的一个目的是提供一种显示面板，其能够解决现有技术中柔性电路板与显示基板的接触面积小的问题。
 技术解决方案
为实现上述目的，本发明提供一种显示面板，包括显示基板和柔性电路板，以及芯片，设于显示区一侧的所述显示基板上；绑定焊盘，设于所述显示基板上且位于所述芯片左右至少一侧；虚拟绑定焊盘，设于所述绑定焊盘一侧的所述显示基板上；金手指，设于所述柔性电路板上，且对应地与所述绑定焊盘的表面相接；虚拟金手指，设于所述金手指一侧的所述柔性电路板上，且对应地与所述虚拟绑定焊盘的表面相接。
在绑定焊盘的一侧增加虚拟绑定焊盘，柔性电路板与其对应的位置也增加一些虚拟金手指，虚拟绑定焊盘的表面和虚拟金手指的表面一一对应地相接触，能够提高所述柔性电路板与显示面板的接触面积，从而增加柔性电路板的拉拔力。
进一步的，在其他实施方式中，其中所述绑定焊盘与所述芯片之间设置有引线，所述绑定焊盘通过所述引线连接于所述芯片。
进一步的，在其他实施方式中，其中所述虚拟绑定焊盘与所述芯片之间不设置引线。因为设置所述虚拟绑定焊盘是为了增加所述柔性电路板与显示面板的接触面积，所以所述虚拟绑定焊盘并不需要发挥电性作用。
进一步的，在其他实施方式中，其中还包括扇出区，所述扇出区包括阴极引线，连接所述芯片和所述显示区内的各列像素；阳极引线，连接所述芯片与所述显示区内的各行像素。在其他实施方式中，所述阴极引线和所述阳极引线的位置也可以互换，即所述阳极引线一端连接到所述芯片，另一端分别连接到所述显示区内的各列像素；所述阴极引线一端连接到所述芯片，另一端分别连接到所述显示区内的各行像素。
进一步的，在其他实施方式中，其中还包括导电胶膜，所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。在其他实施方式中，所述导电胶膜中还包括导电金球，所述绑定焊盘与所述金手指通过所述导电金球电性连接。
进一步的，在其他实施方式中，其中所述虚拟绑定焊盘与所述虚拟金手指之间也设置有导电胶膜，但不设置所述导电金球，所述虚拟绑定焊盘与所述虚拟金手指之间不需要电性连接，只需对应地黏贴增加所述柔性电路板与显示面板的接触面积即可。
进一步的，在其他实施方式中，其中所述金手指的数量与所述绑定焊盘的数量相同，所述绑定焊盘的数量为两个以上，多个所述绑定焊盘之间相互隔绝，多个所述金手指之间相互隔绝。
两个相邻所述绑定焊盘之间的距离优选为0.4mm，两个相邻所述金手指之间的距离优选为0.4mm。
进一步的，在其他实施方式中，其中所述绑定焊盘为矩形。
进一步的，在其他实施方式中，其中所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
进一步的，在其他实施方式中，其中所述绑定焊盘的形状可以为椭圆型、多边形，在此不做限定。
所述绑定焊盘和所述虚拟绑定焊盘的大小相同，宽度优选为4mm，长度优选为9mm。
进一步的，在其他实施方式中，其中所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同，所述虚拟绑定焊盘的数量为两个以上，多个所述虚拟绑定焊盘之间相互隔绝，多个所述虚拟金手指之间相互隔绝。
进一步的，在其他实施方式中，其中所述柔性电路板呈Y型。
进一步的，在其他实施方式中，其中所述柔性电路板包括主体和连接端，所述金手指和所述虚拟金手指均设于所述连接端。
为了实现上述目的，本发明还提供一种显示装置，包括本发明涉及的所述显示面板。
 有益效果
相对于现有技术，本发明的有益效果在于：本发明提供一种显示面板及显示装置，在绑定焊盘的一侧增加虚拟绑定焊盘，柔性电路板与其对应的位置也增加一些虚拟金手指，虚拟绑定焊盘的表面和虚拟金手指的表面一一对应相接触，能够提高柔性电路板与显示面板的接触面积，从而增加柔性电路板的拉拔力。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为现有技术中提供的显示面板的结构示意图；
图2为本发明实施例提供的显示面板的结构示意图；
图3为本发明实施例提供的显示基板结构示意图；
图4为本发明实施例提供的柔性电路板结构示意图。
背景技术中的附图说明：
显示面板-100；显示基板-10；
显示区-20；扇出区-30；
芯片-40；绑定焊盘-50；
柔性电路板-60；金手指-70。
具体实施方式中的附图说明：
显示面板-100；显示基板-10；
显示区-20；扇出区-30；
芯片-40；绑定焊盘-50；
柔性电路板-60；金手指-70；
虚拟焊盘-51；虚拟金手指-71；
引线-80；柔性电路板主体-61；
连接端-62。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图2，图2为本发明实施例提供的显示面板的结构示意图，显示面板100，包括显示基板10和柔性电路板60，显示基板10包括显示区20、扇出区30、芯片40、绑定焊盘50、虚拟绑定焊盘51。
请参阅图3，图3为本发明实施例提供的显示基板结构示意图，芯片40设于显示区20一侧的显示基板10上，绑定焊盘50设于显示基板10上且位于芯片40左右两侧；虚拟绑定焊盘51设于绑定焊盘50一侧的显示基板10上。
在本实施例中，绑定焊盘50为矩形，绑定焊盘50的排列方向垂直绑定焊盘的长度方向；虚拟绑定焊盘51为矩形，虚拟绑定焊盘51的排列方向垂直绑定焊盘的长度方向。
在其他实施方式中，绑定焊盘50和虚拟绑定焊盘51的形状可以为椭圆型、多边形，在此不做限定。
在本实施例中，绑定焊盘50和虚拟绑定焊盘51的大小相同，宽度优选为4mm，长度优选为9mm，从而相较于现有技术中宽度和长度均为6mm的绑定焊盘，绑定焊盘50的宽度减小并且载流面积不变。
在本实施例中，金手指70和虚拟虚拟金手指71的大小相同，宽度优选为4mm，长度优选为9mm。
扇出区50包括阴极引线和阳极引线，其中阴极引线的一端连接芯片40，另一端分别连接显示区20内的各列像素；阳极引线一端连接芯片40，另一端分别连接显示区20内的各行像素。
在其他实施方式中，阴极引线和阳极引线的位置也可以互换，即阳极引线一端连接到芯片40，另一端分别连接到显示区20内的各列像素；阴极引线一端连接到芯片40，另一端分别连接到显示区20内的各行像素。
请参阅图4，图4为本发明实施例提供的柔性电路板结构示意图。柔性电路板60呈Y型，柔性电路板60包括主体61和连接端62，金手指70和虚拟金手指71均设于连接端62。
金手指70对应地与绑定焊盘的表面相接；虚拟金手指71设于金手指70一侧的柔性电路板60上，且对应地与虚拟绑定焊盘51的表面相接。
在绑定焊盘50的一侧增加虚拟绑定焊盘51，柔性电路板60与其对应的位置也增加一些虚拟金手指71，虚拟绑定焊盘51的表面和虚拟金手指71的表面一一对应地相接触，能够提高柔性电路板60与显示面板100的接触面积，从而增加柔性电路板60的拉拔力。
其中，绑定焊盘与芯片40之间设置有引线80，绑定焊盘通过引线80连接于芯片40。
虚拟绑定焊盘51与芯片40之间不设置引线，因为设置虚拟绑定焊盘51是为了增加柔性电路板60与显示面板100的接触面积，所以虚拟绑定焊盘51并不需要发挥电性作用。
绑定焊盘50与金手指70之间还设置有导电胶膜，绑定焊盘50与金手指70通过导电胶膜压合连接。在其他实施方式中，导电胶膜中还包括导电金球，绑定焊盘50与金手指70通过导电金球电性连接。
虚拟绑定焊盘51与虚拟金手指71之间也设置有导电胶膜，但不设置导电金球，虚拟绑定焊盘51与虚拟金手指71之间不需要电性连接，只需对应地黏贴，能够增加柔性电路板60与显示面板100的接触面积即可。
金手指70的数量与绑定焊盘50的数量相同，绑定焊盘50的数量为两个以上，多个绑定焊盘50之间相互隔绝，多个金手指70之间相互隔绝。两个相邻绑定焊盘50之间的距离优选为0.4mm，两个相邻金手指70之间的距离优选为0.4mm。
虚拟金手指71的数量与虚拟绑定焊盘51的数量相同，虚拟绑定焊盘51的数量为两个以上，多个虚拟绑定焊盘51之间相互隔绝，多个虚拟金手指71之间相互隔绝。两个相邻虚拟绑定焊盘51之间的距离优选为0.4mm，两个相邻虚拟金手指71之间的距离优选为0.4mm。
为了实现上述目的，本发明还提供一种显示装置，包括本发明涉及的显示面板100。
本发明的有益效果在于：本发明提供一种显示面板及显示装置，在绑定焊盘50的一侧增加虚拟绑定焊盘51，柔性电路板60与其对应的位置也增加一些虚拟金手指71，虚拟绑定焊盘51的表面和虚拟金手指71的表面一一对应相接触，能够提高柔性电路板60与显示面板100的接触面积，从而增加柔性电路板60的拉拔力。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板及屏显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (18)

  1. 一种显示面板，其中，包括显示基板和柔性电路板，以及
    芯片，设于显示区一侧的所述显示基板上；
    绑定焊盘，设于所述显示基板上且位于所述芯片左右至少一侧；
    虚拟绑定焊盘，设于所述绑定焊盘一侧的所述显示基板上；
    金手指，设于所述柔性电路板上，且对应地与所述绑定焊盘的表面相接；
    虚拟金手指，设于所述金手指一侧的所述柔性电路板上，且对应地与所述虚拟绑定焊盘的表面相接。
  2. 根据权利要求1所述的显示面板，其中，所述绑定焊盘与所述芯片之间设置有引线，所述绑定焊盘通过所述引线连接于所述芯片。
  3. 根据权利要求1所述的显示面板，其中，所述虚拟绑定焊盘与所述芯片之间不设置引线。
  4. 根据权利要求1所述的显示面板，其中，还包括
    阴极引线，连接所述芯片和所述显示区内的各列像素；
    阳极引线，连接所述芯片与所述显示区内的各行像素。
  5. 根据权利要求1所述的显示面板，其特征在于，还包括
    导电胶膜，所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。
  6. 根据权利要求1所述的显示面板，其中，所述金手指的数量与所述绑定焊盘的数量相同，所述绑定焊盘的数量为两个以上，多个所述绑定焊盘之间相互隔绝，多个所述金手指之间相互隔绝。
  7. 根据权利要求1所述的显示面板，其中，所述绑定焊盘为矩形。
  8. 根据权利要求1所述的显示面板，其中，所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
  9. 根据权利要求1所述的显示面板，其中，所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同，所述虚拟绑定焊盘的数量为两个以上，多个所述虚拟绑定焊盘之间相互隔绝，多个所述虚拟金手指之间相互隔绝。
  10. 一种显示装置，其中，包括权利要求1所述的显示面板。
  11. 根据权利要求10所述的显示装置，其中，所述绑定焊盘与所述芯片之间设置有引线，所述绑定焊盘通过所述引线连接于所述芯片。
  12. 根据权利要求10所述的显示装置，其中，所述虚拟绑定焊盘与所述芯片之间不设置引线。
  13. 根据权利要求10所述的显示装置，其中，还包括
    阴极引线，连接所述芯片和所述显示区内的各列像素；
    阳极引线，连接所述芯片与所述显示区内的各行像素。
  14. 根据权利要求10所述的显示装置，其特征在于，还包括
    导电胶膜，所述绑定焊盘与所述金手指通过所述导电胶膜压合连接。
  15. 根据权利要求10所述的显示装置，其中，所述金手指的数量与所述绑定焊盘的数量相同，所述绑定焊盘的数量为两个以上，多个所述绑定焊盘之间相互隔绝，多个所述金手指之间相互隔绝。
  16. 根据权利要求10所述的显示装置，其中，所述绑定焊盘为矩形。
  17. 根据权利要求10所述的显示装置，其中，所述绑定焊盘的排列方向垂直所述绑定焊盘的长度方向。
  18. 根据权利要求10所述的显示装置，其中，所述虚拟金手指的数量与所述虚拟绑定焊盘的数量相同，所述虚拟绑定焊盘的数量为两个以上，多个所述虚拟绑定焊盘之间相互隔绝，多个所述虚拟金手指之间相互隔绝。
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