WO2022037733A1 - Power controller - Google Patents

Power controller Download PDF

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Publication number
WO2022037733A1
WO2022037733A1 PCT/CZ2021/050088 CZ2021050088W WO2022037733A1 WO 2022037733 A1 WO2022037733 A1 WO 2022037733A1 CZ 2021050088 W CZ2021050088 W CZ 2021050088W WO 2022037733 A1 WO2022037733 A1 WO 2022037733A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
power
openings
power controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CZ2021/050088
Other languages
French (fr)
Inventor
Grigorij Dvorský
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mgm Compro SRO
Original Assignee
Mgm Compro SRO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mgm Compro SRO filed Critical Mgm Compro SRO
Priority to EP21857815.1A priority Critical patent/EP4197295A4/en
Priority to US18/021,589 priority patent/US20230300971A1/en
Publication of WO2022037733A1 publication Critical patent/WO2022037733A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Definitions

  • the present invention relates to an electric power flow controller, which serves in particular for controlling the operation of an AC or DC electric motor.
  • the electric motor When connected to the power supply, the electric motor starts up at some speed.
  • many applications of electric motors require that the electric motors have variable speed.
  • power controllers have begun to be used, which can change the power supply parameters of the electric motor in a controlled manner, thus essentially controlling the operation of the electric motor.
  • Known types of electric motors according to the design include, for example, BLDC electric motors or PMSM electric motors, etc.
  • Controllers fall into the category of so-called power electronics, which is nowadays a very intensively developing technical field, which is focused on the effective control of the flow of electric power, which is used to supply a wide range of appliances.
  • the task of power applications falling into this technical field is the conversion, control and modification of electric power, the conversion being a change of at least one characteristic quantity of the power system by means of electronic switching components without significantly higher power loss.
  • Power controllers can be generally described by technical features, including a printed circuit board that provides support for electronic components, as well as electronic components designed to meet the goal of power application, and last but not least, electrically conductive printed circuit boards, which serve as electric power interconnections between electronic components.
  • An example of a power controller can be, for example, the invention in invention application PV 2003-333 A.
  • a known shortcoming of controllers operating with large flows of electric power involves the problem of waste heat. As the flow of electric power passes through the printed circuit boards and electronic components across the printed circuit board, it must overcome their ohmic electric resistance.
  • Another known disadvantage is the presence of parasitic inductance between adjacent electric elements on the printed circuit board (so-called inductance of PCB conductive paths).
  • the task of the invention is to provide a power controller, the construction of which would enable efficient removal of waste heat of power components and at the same time supply /discharge high flows to/from power components.
  • the set task is solved by means of an electric power flow controller created according to the invention below.
  • the power controller for electric power flow control consists of at least one printed circuit board for supporting and electrically interconnecting the components of the power controller. Another component of the power controller is at least one power switching element arranged on one of the sides of the printed circuit board. Furthermore, the power controller consists of at least one heat sink arranged on the remaining side of the printed circuit board.
  • the summary of the invention is based on the fact that the printed circuit board is provided with a network of openings under the power component(s) passing through the printed circuit board, with the openings being plated or completely filled with metal, and at the same time, there is at least one layer of thermally conductive and electrically insulating material between the heat sink and the printed circuit board.
  • Plated or metal-filled openings act as thermal bridges, through which heat is conducted to the heat sink more easily than if it had to radiate through the material of the printed circuit board.
  • the diameter of openings is preferably of the order of 0.2 to 0.25 mm and the spacing of adjacent openings is of the order of 0.1 mm to 0.5 mm. Thanks to the appropriately selected size of openings and their spacing it is possible to create a dense network of openings. In addition, it is advantageous if the thickness of plating of the opening is in the range from 20 pm to 60 pm, or if they are completely filled with metal.
  • the plate electrode of the housing of the power switching element is in contact with plating, or with a metal filling of at least one of the openings.
  • the openings also fulfil the second function, which is the distribution of electric current.
  • the advantages of the controller include better removal of waste heat to the heat sink and the resulting ability to process higher electric power. Another advantage is that the openings can serve to distribute electric current, thus making it possible to supply the components on the printed circuit board from below.
  • Fig. 1 schematically shows a section of a controller through its power switching element, a printed circuit board and a heat sink,
  • Fig. 2 schematically shows a network of openings through a printed circuit board.
  • FIG. 1 shows an SMD power switching element 21 (MOSFET, SiC, etc.), which has on the one hand conventional outlets 23 (electrodes as S or G) connected to the chip 22, and on the other hand D electrode 24 oriented below the element 21 with the largest surface area.
  • SMD stands for Surface Mount Device.
  • the element 21 is firstly most cooled (i.e. removes heat generated by the passage of current through the element 21 and also generated by the switching of current (switching losses)), and secondly the current is thus supplied (removed) to the element 21.
  • the element 21 is soldered with the electrode 24 (mounting surface of the element 21) to the upper Cu layer 25 of the printed circuit board.
  • the printed circuit board is formed by several layers 25 of copper (Cu), which are insulated from each other by means of insulating layers 26.
  • a network of micro openings 29 with a diameter of the order from 0.2 mm to 0.25 mm with small spacings (of the order of 0.5 mm) is placed under the electrode 24 so that up to 400 such openings 29 can be placed on an area of about 10 x 10 mm.
  • An example of the grid of these openings 29 is shown in Fig. 2.
  • the actual size and spacing of the openings 29 depend on the printed circuit board manufacturing technology used, as well as the magnitude of current flowing through the openings 29, as well as the amount of heat to be removed by the openings 29 to the heat sink 28.
  • the openings 29 are optimally plated in a layer 20 to 60 pm thick, or optionally in a thicker layer, or are completely filled with Cu, thanks to which they efficiently transfer the heat generated by operation of the power element 21 to the heat sink 28 through the thermally conductive and electrically insulating layer 27. At the same time, electric current is supplied through these openings 29 or their surface or the entire volume of the opening 29, depending on the technology used, to the electrode 24 of the SMD power element 21. It is irrelevant whether the heat sink 28 is air, liquid, etc.
  • SMD power elements 21 and their connection to the printed circuit board by means of a network of micro openings 29 is advantageous both from the point of view of minimizing the resistance of copper paths of the printed circuit board and from the point of view of minimizing parasitic inductances of the circuit.
  • the electric power flow controller according to the invention finds its application in the field of regulation of electrical appliances, in particular electric motors.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Power controller for electric power flow control, consisting of at least one printed circuit board for supporting and electrically interconnecting power controller components. Power controller further consists of at least one power switching element (21) arranged on one the side of the printed circuit board, and at least one heat sink (28) arranged on the remaining side of the printed circuit board. The printed circuit board is provided with a network of openings (29) passing through the printed circuit board, with the openings (29) being plated or completely filled with metal. At the same time, there is at least one layer (27) of thermally conductive and electrically insulating material between the heat sink (28) and the printed circuit board.

Description

Power controller
Field of the Invention
The present invention relates to an electric power flow controller, which serves in particular for controlling the operation of an AC or DC electric motor.
Background of the Invention
When connected to the power supply, the electric motor starts up at some speed. However, many applications of electric motors require that the electric motors have variable speed. For this purpose, power controllers have begun to be used, which can change the power supply parameters of the electric motor in a controlled manner, thus essentially controlling the operation of the electric motor. Known types of electric motors according to the design include, for example, BLDC electric motors or PMSM electric motors, etc.
Controllers fall into the category of so-called power electronics, which is nowadays a very intensively developing technical field, which is focused on the effective control of the flow of electric power, which is used to supply a wide range of appliances. The task of power applications falling into this technical field is the conversion, control and modification of electric power, the conversion being a change of at least one characteristic quantity of the power system by means of electronic switching components without significantly higher power loss.
Power controllers can be generally described by technical features, including a printed circuit board that provides support for electronic components, as well as electronic components designed to meet the goal of power application, and last but not least, electrically conductive printed circuit boards, which serve as electric power interconnections between electronic components. An example of a power controller can be, for example, the invention in invention application PV 2003-333 A. A known shortcoming of controllers operating with large flows of electric power involves the problem of waste heat. As the flow of electric power passes through the printed circuit boards and electronic components across the printed circuit board, it must overcome their ohmic electric resistance. Another known disadvantage is the presence of parasitic inductance between adjacent electric elements on the printed circuit board (so-called inductance of PCB conductive paths).
The task of the invention is to provide a power controller, the construction of which would enable efficient removal of waste heat of power components and at the same time supply /discharge high flows to/from power components.
Summary of the Invention
The set task is solved by means of an electric power flow controller created according to the invention below.
The power controller for electric power flow control consists of at least one printed circuit board for supporting and electrically interconnecting the components of the power controller. Another component of the power controller is at least one power switching element arranged on one of the sides of the printed circuit board. Furthermore, the power controller consists of at least one heat sink arranged on the remaining side of the printed circuit board.
The summary of the invention is based on the fact that the printed circuit board is provided with a network of openings under the power component(s) passing through the printed circuit board, with the openings being plated or completely filled with metal, and at the same time, there is at least one layer of thermally conductive and electrically insulating material between the heat sink and the printed circuit board.
This is advantageous from the point of view of the efficiency of heat removal from the power element. Plated or metal-filled openings act as thermal bridges, through which heat is conducted to the heat sink more easily than if it had to radiate through the material of the printed circuit board.
The diameter of openings is preferably of the order of 0.2 to 0.25 mm and the spacing of adjacent openings is of the order of 0.1 mm to 0.5 mm. Thanks to the appropriately selected size of openings and their spacing it is possible to create a dense network of openings. In addition, it is advantageous if the thickness of plating of the opening is in the range from 20 pm to 60 pm, or if they are completely filled with metal.
In another preferred embodiment of the power controller according to the invention, the plate electrode of the housing of the power switching element is in contact with plating, or with a metal filling of at least one of the openings. In this way, the openings also fulfil the second function, which is the distribution of electric current.
The advantages of the controller include better removal of waste heat to the heat sink and the resulting ability to process higher electric power. Another advantage is that the openings can serve to distribute electric current, thus making it possible to supply the components on the printed circuit board from below.
Explanation of drawings
The present invention will be explained in detail by means of the following figures where:
Fig. 1 schematically shows a section of a controller through its power switching element, a printed circuit board and a heat sink,
Fig. 2 schematically shows a network of openings through a printed circuit board.
Example of the invention embodiments
It shall be understood that the specific cases of the invention embodiments described and depicted below are provided for illustration only and do not limit the invention to the examples provided here. Those skilled in the art will find or, based on routine experiment, will be able to provide a greater or lesser number of equivalents to the specific embodiments of the invention which are described here.
The schematic section of Fig. 1 shows an SMD power switching element 21 (MOSFET, SiC, etc.), which has on the one hand conventional outlets 23 (electrodes as S or G) connected to the chip 22, and on the other hand D electrode 24 oriented below the element 21 with the largest surface area. SMD stands for Surface Mount Device.
Through this electrode 24, the element 21 is firstly most cooled (i.e. removes heat generated by the passage of current through the element 21 and also generated by the switching of current (switching losses)), and secondly the current is thus supplied (removed) to the element 21. The element 21 is soldered with the electrode 24 (mounting surface of the element 21) to the upper Cu layer 25 of the printed circuit board.
The printed circuit board is formed by several layers 25 of copper (Cu), which are insulated from each other by means of insulating layers 26. On the printed circuit board, a network of micro openings 29 with a diameter of the order from 0.2 mm to 0.25 mm with small spacings (of the order of 0.5 mm) is placed under the electrode 24 so that up to 400 such openings 29 can be placed on an area of about 10x 10 mm. An example of the grid of these openings 29 is shown in Fig. 2.
The actual size and spacing of the openings 29 depend on the printed circuit board manufacturing technology used, as well as the magnitude of current flowing through the openings 29, as well as the amount of heat to be removed by the openings 29 to the heat sink 28.
The openings 29 are optimally plated in a layer 20 to 60 pm thick, or optionally in a thicker layer, or are completely filled with Cu, thanks to which they efficiently transfer the heat generated by operation of the power element 21 to the heat sink 28 through the thermally conductive and electrically insulating layer 27. At the same time, electric current is supplied through these openings 29 or their surface or the entire volume of the opening 29, depending on the technology used, to the electrode 24 of the SMD power element 21. It is irrelevant whether the heat sink 28 is air, liquid, etc. The use of SMD power elements 21 and their connection to the printed circuit board by means of a network of micro openings 29 is advantageous both from the point of view of minimizing the resistance of copper paths of the printed circuit board and from the point of view of minimizing parasitic inductances of the circuit.
Industrial applicability
The electric power flow controller according to the invention finds its application in the field of regulation of electrical appliances, in particular electric motors.
List of reference numerals
21 power switching element
22 chip
23 conventional outlet
24 power element housing electrode
25 printed circuit layer
26 insulating layer of printed circuit board
27 thermally conductive and electrically insulating layer
28 heat sink
29 opening

Claims

7
CLAIMS Power controller for electric power flow control consisting of at least one printed circuit board for supporting and electrically interconnecting power controller components, further comprising at least one power switching element (21) arranged on one of the sides of the printed circuit board, and at least one heat sink (28) arranged on the remaining side of the printed circuit board, characterized in that the printed circuit board is provided with a network of openings (29) passing through the printed circuit board, with the openings (29) being plated or completely filled with metal and at the same time, there is at least one layer (27) of thermally conductive and electrically insulating material between the heat sink (28) and the printed circuit board. Power controller according to claim 1, characterized in that the diameter of the openings (29) is of the order of 0.2 mm to 0.25 mm, and the spacing of adjacent openings (29) is of the order of 0.1 mm to 0.5 mm. Power controller according to claim 1 or 2, characterized in that the thickness of plating of the opening (29) is in the range from 20 to 60 pm. Power controller according to any of claims 1 to 3, characterized in that a plate electrode (24) of the housing of the power element (21) is arranged between the power switching element (21) and the printed circuit board, with the plate electrode (24) being in contact with plating, or with a metal filling of at least one of the openings (29).
PCT/CZ2021/050088 2020-08-17 2021-08-17 Power controller Ceased WO2022037733A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21857815.1A EP4197295A4 (en) 2020-08-17 2021-08-17 Power controller
US18/021,589 US20230300971A1 (en) 2020-08-17 2021-08-17 Power controller

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CZ2020-37886U CZ34499U1 (en) 2020-08-17 2020-08-17 Power regulator
CZPUV2020-37886 2020-08-17

Publications (1)

Publication Number Publication Date
WO2022037733A1 true WO2022037733A1 (en) 2022-02-24

Family

ID=73045612

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CZ2021/050088 Ceased WO2022037733A1 (en) 2020-08-17 2021-08-17 Power controller

Country Status (4)

Country Link
US (1) US20230300971A1 (en)
EP (1) EP4197295A4 (en)
CZ (1) CZ34499U1 (en)
WO (1) WO2022037733A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CZ34499U1 (en) * 2020-08-17 2020-11-03 MGM COMPRO s.r.o. Power regulator

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DE19909505A1 (en) * 1999-03-04 2000-09-21 Daimler Chrysler Ag Process for the production of circuit arrangements
WO2003019997A1 (en) * 2001-08-22 2003-03-06 Vanner, Inc. Improved heat sink for surface mounted power devices
WO2010044374A1 (en) * 2008-10-16 2010-04-22 有限会社アイレックス Heat dissipation structure
US20160088720A1 (en) * 2014-09-24 2016-03-24 Hiq Solar, Inc. Transistor thermal and emi management solution for fast edge rate environment
WO2019117107A1 (en) * 2017-12-14 2019-06-20 三菱電機株式会社 Semiconductor device
CZ34499U1 (en) * 2020-08-17 2020-11-03 MGM COMPRO s.r.o. Power regulator

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CN100381027C (en) * 1999-09-02 2008-04-09 伊比登株式会社 Printed wiring board and method for manufacturing the same
WO2002007312A2 (en) * 2000-07-13 2002-01-24 Isothermal Systems Research, Inc. Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
US9686854B2 (en) * 2012-09-25 2017-06-20 Denso Corporation Electronic device
AT516724B1 (en) * 2014-12-22 2016-08-15 Zizala Lichtsysteme Gmbh MAKING A CIRCUIT ARRANGEMENT WITH THERMAL CONTACT
JP7004749B2 (en) * 2018-01-25 2022-01-21 三菱電機株式会社 Circuit equipment and power conversion equipment
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Publication number Priority date Publication date Assignee Title
DE19909505A1 (en) * 1999-03-04 2000-09-21 Daimler Chrysler Ag Process for the production of circuit arrangements
WO2003019997A1 (en) * 2001-08-22 2003-03-06 Vanner, Inc. Improved heat sink for surface mounted power devices
WO2010044374A1 (en) * 2008-10-16 2010-04-22 有限会社アイレックス Heat dissipation structure
US20160088720A1 (en) * 2014-09-24 2016-03-24 Hiq Solar, Inc. Transistor thermal and emi management solution for fast edge rate environment
WO2019117107A1 (en) * 2017-12-14 2019-06-20 三菱電機株式会社 Semiconductor device
CZ34499U1 (en) * 2020-08-17 2020-11-03 MGM COMPRO s.r.o. Power regulator

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Optimize heat sink design - connect cooling pad on PCB backside by vias", ELECTRICAL ENGINEERING STACK EXCHANGE, A QUESTION AND ANSWER SITE, pages 1 - 33, XP093032471, Retrieved from the Internet <URL:https://electronics.stackexchange.com/questions/243989/optimize-heat-sink-design-connect-cooling-pad-on-pcb-backside-by-vias> [retrieved on 20230317] *
See also references of EP4197295A4 *

Also Published As

Publication number Publication date
EP4197295A1 (en) 2023-06-21
EP4197295A4 (en) 2024-08-21
CZ34499U1 (en) 2020-11-03
US20230300971A1 (en) 2023-09-21

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