WO2022052827A1 - 机械手 - Google Patents

机械手 Download PDF

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Publication number
WO2022052827A1
WO2022052827A1 PCT/CN2021/115292 CN2021115292W WO2022052827A1 WO 2022052827 A1 WO2022052827 A1 WO 2022052827A1 CN 2021115292 W CN2021115292 W CN 2021115292W WO 2022052827 A1 WO2022052827 A1 WO 2022052827A1
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WO
WIPO (PCT)
Prior art keywords
wafer
supporting
support
finger structure
manipulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/115292
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English (en)
French (fr)
Inventor
郭浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Priority to KR1020227046287A priority Critical patent/KR102691498B1/ko
Priority to EP21865883.9A priority patent/EP4213192B1/en
Priority to JP2023514745A priority patent/JP7469561B2/ja
Priority to US18/044,866 priority patent/US12263574B2/en
Publication of WO2022052827A1 publication Critical patent/WO2022052827A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the embodiments of the present invention relate to the technical field of semiconductor processing, and in particular, the embodiments of the present invention relate to a manipulator.
  • the wafer needs to be gradually transferred from the atmospheric environment to the processing chamber for processing.
  • the transfer of wafers needs to be realized with the help of a transfer module consisting of a series of atmospheric equipment and vacuum equipment.
  • the transfer module is usually provided with a manipulator, which is used to transfer the wafers through movements such as telescoping, lifting, and the like.
  • the back gold process which is to deposit aluminum (Al), titanium (Ti), nickel (Ni), silver (Ag) and other metals on the back of the wafer
  • this process The wafer needs to be introduced into the process chamber for processing in a back-up, front-down state.
  • the existing manipulator will contact the surface of the wafer during the process of transferring the wafer.
  • the face-down wafer it is easy to cause scratches or contact marks on the front of the wafer, and the back gold is carried out.
  • Processed wafers tend to be warped to a large extent, which also increases the contact area between the wafer and the robot, resulting in increased scratches on the front of the wafer, which adversely affects subsequent processes and greatly reduces product yield.
  • the embodiments of the present invention provide a manipulator, which can avoid the contact between the wafer surface and the finger structure, thereby avoiding scratches and contact marks on the wafer surface.
  • An embodiment of the present invention provides a robot for transferring wafers, comprising a finger structure and a plurality of support members, wherein a plurality of the support members are arranged on the finger structure and are distributed at intervals on the same circumference, each Each of the support members is used for contacting the edge of the wafer to support the wafer and to prevent the wafer from contacting the finger structure.
  • each of the support components includes a support surface for supporting the wafer, the support surface is an inclined surface inclined relative to a horizontal plane, and the height of the inclined surface relative to the horizontal surface is The circumference of the circumference gradually increases in the direction away from the center of the circumference.
  • the inclined plane is a plane, and the angle between the inclined plane and the horizontal plane is 1°-60°.
  • the included angle is 5.75°.
  • each of the support components includes a support body and an anti-skid flexible member disposed on the support body, wherein the support surface is formed on the anti-skid flexible member.
  • the anti-skid flexible member is annular, and the cross-sectional shape of the anti-skid flexible member satisfies the point contact between the support surface and the wafer.
  • an installation groove is formed on the support body, a part of the anti-skid flexible member is disposed inside the installation groove, and the other part is disposed outside the installation groove.
  • At least one marking line is provided on the supporting surface of each of the supporting components, and each marking line is used to identify the position of the wafer edge of one size on the supporting surface.
  • the finger structure includes two fingers spaced apart in a direction parallel to the horizontal plane, and the space between the two fingers is set so that the wafer avoids contact with the fingers.
  • the manipulator further includes a positioning member and a fastener, wherein the positioning member is provided on the finger structure to limit the position of the support member on the finger structure; the fastener The part is used for fixedly connecting the support part with the finger structure.
  • the finger structure is provided with a plurality of supporting parts distributed on the same circumference at intervals, and each supporting part is used for contacting the edge of the wafer to support the wafer, and to avoid the wafer In contact with finger structure. Since the multiple support members only contact the edge of the wafer, this can prevent the support members from contacting the wafer surface on the premise of ensuring the support of the wafer, so as to avoid the occurrence of the wafer surface caused by the contact between the robot and the wafer surface. Scratches and contact marks.
  • the above-mentioned plurality of supporting components can also prevent the wafer from contacting the finger structure, thereby reducing to a certain extent scratches caused by contact and friction with the finger structure caused by the warping of the wafer. Therefore, the manipulator provided by the embodiment of the present invention can reduce the impact on subsequent processes caused by scratches on the surface of the wafer, and improve the product yield, so that it can be applied to processes such as the back gold process that need to protect the surface of the wafer. Semiconductor process equipment.
  • FIG. 1A is a top view of a robot arm supporting a wafer according to an embodiment of the present invention
  • FIG. 1B is a top view of a robot provided by an embodiment of the present invention and showing a wafer position
  • FIG. 1C is a top view of a manipulator provided by an embodiment of the present invention.
  • FIG. 2A is a partial cross-sectional view of a manipulator provided by an embodiment of the present invention.
  • 2B is another partial cross-sectional view of the manipulator provided by the embodiment of the present invention.
  • 3A is a partial enlarged view of a finger structure adopted in an embodiment of the present invention.
  • FIG. 3B is a partial enlarged view of the supporting member and the edge of the wafer used in the embodiment of the present invention.
  • the manipulator includes a finger structure 2 .
  • the finger structure 2 can perform movements such as telescoping and lifting under the driving of the manipulator arm 1 , so as to realize the transfer of the wafer 100 .
  • Both the manipulator arm 1 and the finger structure 2 can be made of metal material, or can also be made of ceramic or quartz material.
  • the finger structure 2 and the manipulator body 1 may adopt an integrated structure, or may also adopt a separate structure.
  • the finger structure 2 can have various structures.
  • the finger structure 2 includes two fingers 22 that are spaced apart in a direction parallel to the horizontal plane, and the space between the two fingers 22 constitutes a hollow portion 21.
  • the hollow portion 21 can further prevent the fingers 22 from contacting the wafer 100 , especially for warped wafers, the central area of the hollow portion 21 is generally bent toward the side close to the finger 22 relative to the edge area, that is, the center of the wafer
  • the hollow portion 21 is formed between the two fingers 22 to avoid the central portion of the wafer dented downward, so that the fingers 22 and the surface of the wafer 100 can be avoided.
  • the contact and friction between the wafer 100 and the fingers 22 can reduce scratches to a certain extent.
  • the interval between the two fingers 22 ranges from 100 mm to 290 mm, and specifically may be 120 mm, 150 mm, 180 mm, 182 mm, 200 mm, 240 mm or 280 mm etc.
  • corresponding values can be selected according to different specifications of the wafer 100 . Specifically, the larger the diameter of the wafer 100 is, the larger the value of the interval is; otherwise, the smaller the value is.
  • the finger structure 2 can also adopt any other structure, for example, the ring structure that can form the above-mentioned hollow portion 21, or the finger structure 2 is provided with a central portion that can avoid the wafer sinking downward. This also prevents the fingers 22 from coming into contact with the surface of the wafer 100 .
  • the above-mentioned manipulator further includes a plurality of supporting parts 31, for example, four supporting parts 31 are shown in FIG. 1A to FIG. 1C.
  • the number of supporting parts 31 can also be three or five or more, as long as It is sufficient to keep the wafer 100 supported evenly and stably.
  • a plurality of support members 31 are disposed on the finger structure 2 and are distributed at intervals along the same circumferential direction, and the plane on which the circumference is located is parallel to, for example, a horizontal plane. And, each support member 31 is used to contact the edge of the wafer 100 to support the wafer 100 . Since the plurality of support members 31 only contact the edge of the wafer 100, this can avoid contact with the wafer surface on the premise of ensuring stable support of the wafer, so as to avoid the occurrence of the wafer surface caused by the contact between the robot and the wafer surface. Scratches and contact marks. At the same time, the above-mentioned plurality of supporting members 31 can also prevent the wafer from contacting the finger structure 2 , thereby reducing to a certain extent scratches caused by contact and friction with the finger structure 2 caused by the warping of the wafer.
  • the manipulator provided by the embodiment of the present invention can reduce the impact on subsequent processes caused by scratches on the surface of the wafer, and improve the product yield, so that it can be applied to processes such as the back gold process that need to protect the surface of the wafer.
  • the finger structure 2 can also adopt a flat plate structure, that is, the above-mentioned hollow portion 21 is not provided, and only the plurality of supporting members 31 are used to avoid the finger structure 2 and the crystal.
  • the surfaces of the circles 100 are in contact.
  • each support member 31 includes a support surface 32 for supporting the wafer 100
  • the support surface 32 is an inclined surface inclined relative to the horizontal plane, and the The height of the inclined surface relative to the horizontal surface gradually increases in the direction away from the center of the circumference in the radial direction of the circumference where the support member 31 is located.
  • the plurality of supporting parts 31 form a concave part on the inner side thereof, and the supporting surfaces 32 of the plurality of supporting parts 31 together form the side surface of the concave part.
  • the edge of the circle 100 is in contact with the conical torus to support the wafer 100 .
  • the size of the opening of the conical annular surface gradually increases along the direction away from the bottom of the concave portion. This arrangement ensures that each support surface 32 only contacts the edge of the wafer 100 and does not contact the surface of the wafer 100.
  • the wafer position can be automatically corrected under the action of the wafer 100's own gravity, and the contact positions between the edge of the wafer 100 and each support surface 32 are at the same height, thereby ensuring that the wafer 100 can be placed horizontally.
  • the two support surfaces 32 located on one side of the X axis are symmetrically arranged with the two support surfaces 32 located on the other side of the X axis, and the two support surfaces 32 located on one side of the Y axis
  • the two support surfaces 32 are arranged symmetrically with the two support surfaces 32 on the other side of the Y axis, so that the contact positions of the four support members 31 and the wafer 100 can be distributed more evenly, thereby improving the stability of the support.
  • each support member 31 includes a support body 311 and an anti-skid flexible member 312 disposed on the support body 311 , wherein the support body 311 can be a It is made of metal or non-metal material to ensure the rigidity required for supporting the wafer.
  • the support body 311 may be made of stainless steel, aluminum, quartz or ceramics, but the embodiment of the present invention is not limited to this.
  • the above arrangement of the supporting body 311 can increase the distance between the wafer 100 and the finger structure 2 , thereby further avoiding the contact between the wafer 100 and the finger structure 2 , especially for warped wafers, the increased distance is easier to achieve.
  • the circle 100 is not in contact with the finger structure 2 .
  • the shape and size of the support body 311 can be freely set according to specific needs, as long as the wafer is not in contact with the finger structure 2 .
  • the above-mentioned support surface 32 is formed on the anti-skid flexible member 312, that is, the anti-skid flexible member 312 is in contact with the edge of the wafer 100 to support the wafer 100, and at the same time, the anti-skid flexible member 312 also acts to increase the contact with the edge of the wafer. friction to avoid wafer slippage.
  • the non-slip flexible member 312 may be made of a non-slip material with a large friction coefficient, such as silicone or rubber, but the embodiment of the present invention is not limited thereto.
  • the structure of the anti-skid flexible member 312 can be various.
  • the anti-skid flexible member 312 is annular, and the cross-sectional shape of the anti-skid flexible member 312 satisfies the point contact between the support surface 32 and the wafer. oval, etc. Since the anti-skid flexible member 312 is annular, the number of contact points between the wafer edge and the anti-skid flexible member 312 (ie, the intersection of the wafer edge and the annular anti-skid flexible member 312 ) is at most two, which greatly reduces the anti-skid flexibility. The contact area between the component 312 and the wafer can be reduced, so that the possibility of scratches on the wafer can be further reduced.
  • the above-mentioned non-slip flexible member 312 is, for example, a sealing rubber ring, which is not only convenient to obtain materials, but also can effectively reduce application and maintenance costs.
  • the embodiment of the present invention is not limited to the use of the annular anti-skid flexible member 312.
  • the anti-skid flexible member 312 can also adopt any other shape, as long as it can support the wafer and prevent the generation of the wafer at the same time. The effect of sliding.
  • an installation groove 313 is formed on the support body 311 , a part of the anti-skid flexible member 312 is disposed inside the installation groove 313 , and the other part is disposed in the installation groove 313 to fix the anti-skid flexible member 312 on the support body 311 .
  • the installation groove 313 is correspondingly set as an annular groove.
  • the shape of the installation groove 313 can be adaptively adjusted.
  • the installation groove 313 is a "dovetail groove" or other groove structure with a smaller size at the opening.
  • the embodiment of the present invention does not limit the installation method of the anti-skid flexible member 312.
  • the anti-skid flexible member 312 can also be directly pasted on the support body 311.
  • the embodiment of the present invention is not limited to this, and those skilled in the art You can adjust the settings according to the actual situation.
  • the supporting surface 32 can be formed in various ways.
  • an inclined surface 311 a is formed on the supporting body 311
  • the inclined surface 311 a is formed on the inclined surface 311 a.
  • the installation groove 313 is also inclined so that the anti-skid flexible member 312 is also inclined when the anti-skid flexible member 312 is installed in the installation groove 313 to realize that the supporting surface 32 on the anti-skid flexible member 312 forms a slope.
  • the lower surface of the support body 311 and the horizontal plane are parallel to each other, and the support surface 32 and the inclined surface 311 a on the support body 311 are parallel to each other.
  • the included angle A is equal to the included angle between the support surface 32 and the horizontal plane, and the included angle A can be 1°-60°, for example, 5.75°. This setting can ensure that the wafer can be stably supported and avoid wafer generation. By sliding, the processing difficulty and processing cost of the support body 311 can be reduced. In practical applications, the specific value of the above angle A can be 1°, 15°, 28°, 35°, 45°, 50° or 55°, etc.
  • the angle A can be freely selected according to wafers of different specifications the size of.
  • the inclined surface 311a is a plane, but the present invention is not limited to this. It is not limited to this, and those skilled in the art can adjust the settings according to the actual situation.
  • At least one marking line 314 is provided on the supporting surface 32 of each supporting member 31 , and each marking line 314 is used to identify one size of The position of the wafer edge on the support surface 32 .
  • the marking line 314 coincides with the edge of the wafer.
  • the above marking line 314 may be a two-dimensional mark drawn on the support surface 32 , or may be formed of a three-dimensional structure provided on the support surface 32 , for example, a circular arc groove or a boss is provided on the support surface 32 .
  • the manipulator further includes a positioning member 4 and a fastener 5 , wherein the positioning member 4 is arranged on the finger structure 2 to limit the support member 31 to the finger.
  • the position on the structure 2, the positioning member 4 is, for example, a positioning pin, and the two ends of the positioning pin are respectively located in the two positioning holes coaxial on the support member 31 and the finger structure 2; the fastener 5 is used to connect the support member 31 Fixedly connected with the finger structure 2, the fastener 5 is, for example, a fastening screw.
  • the finger structure is provided with a plurality of supporting parts distributed on the same circumference at intervals, and each supporting part is used for contacting the edge of the wafer to support the wafer, and to avoid the wafer In contact with finger structure. Since the multiple support members only contact the edge of the wafer, this can prevent the support members from contacting the wafer surface on the premise of ensuring the support of the wafer, so as to avoid the occurrence of the wafer surface caused by the contact between the robot and the wafer surface. Scratches and contact marks.
  • the above-mentioned plurality of supporting components can also prevent the wafer from contacting the finger structure, thereby reducing to a certain extent scratches caused by contact and friction with the finger structure caused by the warping of the wafer. Therefore, the manipulator provided by the embodiment of the present invention can reduce the impact on subsequent processes caused by scratches on the surface of the wafer, and improve the product yield, so that it can be applied to processes such as the back gold process that need to protect the surface of the wafer. Semiconductor process equipment.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

本发明实施例提供的机械手，用于传输晶圆，其包括手指结构和多个支撑部件，其中，多个支撑部件设置于手指结构上，且在同一圆周上间隔分布，每个支撑部件用于与晶圆的边缘接触以支撑晶圆，且使晶圆避免与手指结构相接触。本发明实施例提供的机械手，可以避免晶圆与手指结构相接触，从而避免晶圆表面产生划痕及接触痕迹。

Description

机械手 技术领域
本发明实施例涉及半导体加工技术领域，具体而言，本发明实施例涉及一种机械手。
背景技术
目前，在进行半导体工艺的过程中，需要把晶圆从大气环境中逐步传送到工艺腔室中进行工艺处理。在此过程中，晶圆的传输需要借助由一系列的大气设备和真空设备等组成的传输模块来实现。传输模块中通常设置有机械手，用以通过伸缩、升降等运动来实现将晶圆的传输。
对于某些需要对晶圆背面进行处理的工艺，例如背金工艺，其是在晶圆背面沉积铝(Al)、钛(Ti)、镍(Ni)、银(Ag)等金属，这种工艺需要将晶圆以背面朝上、正面朝下的状态传入工艺腔室进行工艺。但是，现有的机械手在传输晶圆的过程中，会与晶圆表面相接触，这对于正面朝下的晶圆来说，很容易造成晶圆正面产生划痕或者接触痕迹，而且进行背金工艺的晶圆往往会产生很大程度地翘曲，这也会增加晶圆与机械手的接触面积，导致晶圆正面划伤程度加剧，从而对后续工艺产生不良影响，大幅降低了产品良率。
发明内容
本发明实施例针对现有方式的缺点，提出一种机械手，其可以避免晶圆表面与手指结构相接触，从而避免晶圆表面产生划痕及接触痕迹。
本发明实施例提供了一种机械手，用于传输晶圆，包括手指结构和多个支撑部件，其中，多个所述支撑部件设置于所述手指结构上，且在同一圆周上间隔分布，每个所述支撑部件用于与所述晶圆的边缘接触以支撑所述晶圆， 且使所述晶圆避免与所述手指结构相接触。
可选的，每个所述支撑部件均包括用于支撑所述晶圆的支撑面，所述支撑面为相对于水平面倾斜的斜面，且所述斜面相对于所述水平面的高度，在所述圆周的径向上沿远离所述圆周的中心的方向逐渐增大。
可选的，所述斜面为平面，且与所述水平面之间的夹角为1°-60°。
可选的，所述夹角为5.75°。
可选的，每个所述支撑部件均包括支撑本体和设置在所述支撑本体上的防滑柔性件，其中，所述防滑柔性件上形成有所述支撑面。
可选的，所述防滑柔性件呈环状，且所述防滑柔性件的横截面形状满足使所述支撑面与所述晶圆为点接触。
可选的，在所述支撑本体上形成有安装槽，所述防滑柔性件的一部分设置于所述安装槽的内部，另一部分设置于所述安装槽的外部。
可选的，在每个所述支撑部件的所述支撑面上设置有至少一个标记线，每个所述标记线用于标识其中一种尺寸的晶圆边缘在所述支撑面上的位置。
可选的，所述手指结构包括在平行于水平面的方向上间隔设置的两个手指,两个所述手指之间的间隔被设置为使所述晶圆避免与所述手指相接触。
可选的，所述机械手还包括定位件和紧固件，其中，所述定位件设置于所述手指结构上，用于限定所述支撑部件在所述手指结构上的位置；所述紧固件用于将所述支撑部件与所述手指结构固定连接。
本发明实施例的有益效果：
本发明实施例提供的机械手，其在手指结构上设置有在同一圆周上间隔分布的多个支撑部件，每个支撑部件用于与晶圆的边缘接触以支撑晶圆，且使该晶圆避免与手指结构相接触。由于多个支撑部件仅接触晶圆的边缘，这可以在保证对晶圆支撑的前提下，避免支撑部件与晶圆表面接触，从而可以避免因机械手与晶圆表面接触而造成的晶圆表面产生划痕及接触痕迹。同时， 上述多个支撑部件还可以使晶圆避免与手指结构相接触，从而可以在一定程度上减少因晶圆发生翘曲而造成的与手指结构接触摩擦产生划痕。由此，本发明实施例提供的机械手可以减少因晶圆表面产生划痕而对后续工艺造成的影响，提高产品良率，从而可以应用于诸如背金工艺等的需要保护晶圆表面的工艺的半导体工艺设备。
附图说明
本发明上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：
图1A为本发明实施例提供的机械手在支撑晶圆时的俯视图；
图1B为本发明实施例提供的机械手并示出晶圆位置的俯视图；
图1C为本发明实施例提供的机械手的俯视图；
图2A为本发明实施例提供的机械手的一种局部剖视图；
图2B为本发明实施例提供的机械手的另一种局部剖视图；
图3A为本发明实施例采用的手指结构的局部放大图；
图3B为本发明实施例采用的支撑部件与晶圆边缘配合的局部放大图。
具体实施方式
下面详细描述本发明实施例，本发明实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的部件或具有相同或类似功能的部件。此外，如果已知技术的详细描述对于示出的本发明实施例的特征是不必要的，则将其省略。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。
本技术领域技术人员可以理解，除非另外定义，这里使用的所有术语(包括技术术语和科学术语)，具有与本发明所属领域中的普通技术人员的一般理解相同的意义。还应该理解的是，诸如通用字典中定义的那些术语，应该被 理解为具有与现有技术的上下文中的意义一致的意义，并且除非像这里一样被特定定义，否则不会用理想化或过于正式的含义来解释。
下面以具体地实施例对本发明的技术方案以及本发明的技术方案如何解决上述技术问题进行详细说明。
本发明实施例提供一种机械手，用于传输晶圆，如图1A至图1C所示，机械手包括手指结构2，该手指结构2与机械手手臂1连接，且位于机械手手臂1的一侧，构成悬臂结构，该手指结构2能够在机械手手臂1的带动下进行伸缩、升降等的运动，以实现晶圆100的传输。机械手手臂1及手指结构2均可以采用金属材质制成，或者也可以采用陶瓷或石英材质制成。此外，手指结构2与机械手本体1可以采用一体式结构，或者也可以采用分体式结构。
手指结构2的结构可以有多种，例如，在本实施例中，手指结构2包括在平行于水平面的方向上间隔设置的两个手指22，两个手指22之间的间隔构成镂空部21，该镂空部21可以进一步避免手指22与晶圆100相接触，尤其针对发生翘曲的晶圆，通常其中心区域会相对于边缘区域朝向靠近手指22的一侧弯曲，即，晶圆的中心朝下凹陷，而边缘朝上翘曲，针对这种情况，通过在两个手指22之间形成镂空部21，可以避让晶圆朝下凹陷的中心部分，从而可以避免手指22与晶圆100的表面相接触，进而可以在一定程度上减少晶圆100与手指22接触摩擦产生划痕。
在一些可选的实施例中，两个手指22之间的间隔的数值范围为100毫米～290毫米，具体可以为120毫米、150毫米、180毫米、182毫米、200毫米、240毫米或280毫米等等。在实际应用中，可以根据晶圆100的不同规格选择相应的数值，具体来说，晶圆100的直径越大，该间隔的数值越大；反之，则数值越小。
需要说明的是，在实际应用中，手指结构2也可以采用其他任意结构， 例如能够构成上述镂空部21的环形结构，或者在手指结构2上设置有能够避让晶圆朝下凹陷的中心部分的凹部，这也能够避免手指22与晶圆100的表面相接触。
上述机械手还包括多个支撑部件31，例如图1A至图1C中示出了四个支撑部件31，当然，在实际应用中，支撑部件31的数量还可以为三个或者五个以上，只要能够保持对晶圆100均匀、稳定地支撑即可。
多个支撑部件31设置于手指结构2上，且沿同一圆周方向间隔分布，该圆周所在平面例如与水平面相互平行。并且，每个支撑部件31用于与晶圆100的边缘接触以支撑晶圆100。由于多个支撑部件31仅接触晶圆100的边缘，这可以在保证稳定支撑晶圆的前提下，避免与晶圆表面接触，从而可以避免因机械手与晶圆表面接触而造成的晶圆表面产生划痕及接触痕迹。同时，上述多个支撑部件31还可以避免晶圆与手指结构2相接触，从而可以在一定程度上减少因晶圆发生翘曲而造成的与手指结构2接触摩擦产生划痕。
由此，本发明实施例提供的机械手可以减少因晶圆表面产生划痕而对后续工艺造成的影响，提高产品良率，从而可以应用于诸如背金工艺等的需要保护晶圆表面的工艺的半导体工艺设备。
需要说明的是，在采用上述多个支撑部件31的基础上，手指结构2还可以采用平板结构，即，不设置上述镂空部21，而仅借助多个支撑部件31来避免手指结构2与晶圆100的表面相接触。
在一些可选的实施例中，如图2A至图2B所示，每个支撑部件31均包括用于支撑晶圆100的支撑面32，该支撑面32为相对于水平面倾斜的斜面，且该斜面相对于水平面的高度，在支撑部件31所在圆周的径向上沿远离该圆周的中心的方向逐渐增大。换句话说，多个支撑部件31在其内侧构成一凹部，且多个支撑部件31的支撑面32共同构成该凹部的侧面，该侧面为在圆周方向上呈非连续的锥形环面，晶圆100的边缘与该锥形环面相接触，以实现对 晶圆100的支撑。并且，该锥形环面的开口尺寸沿远离凹部底部的方向逐渐增大，这样设置，既可以保证各个支撑面32仅与晶圆100的边缘接触，而不会接触晶圆100的表面，又可以在晶圆100自身重力的作用下自动校正晶圆位置，且保证晶圆100的边缘与各个支撑面32的接触位置在同一高度，从而可以保证晶圆100能够水平放置。
在一些可选的实施例中，如图1B所示，位于X轴一侧的两个支撑面32与位于X轴另一侧的两个支撑面32对称设置，并且，位于Y轴一侧的两个支撑面32与位于Y轴另一侧的两个支撑面32对称设置，这样，可以使四个支撑部件31与晶圆100的接触位置分布地更均匀，从而可以提高支撑的稳定性。
在一些可选的实施例中，如图2A及图2B所示，每个支撑部件31均包括支撑本体311和设置在该支撑本体311上的防滑柔性件312，其中，上述支撑本体311可以采用金属或者非金属材质制成，以保证支撑晶圆所需的刚度，例如支撑本体311可以采用不锈钢、铝、石英或者陶瓷等材质制成，但是本发明实施例并不以此为限。上述支撑本体311的设置，可以增加晶圆100与手指结构2之间的间距，从而进一步避免晶圆100与手指结构2相接触，尤其针对发生翘曲的晶圆，增加的间距更容易实现晶圆100与手指结构2的不接触。在实际应用中，可以根据具体需要自由设定支撑本体311的形状和尺寸，只要保证晶圆不与手指结构2相接触即可。
防滑柔性件312上形成有上述支撑面32，即，该防滑柔性件312与晶圆100的边缘相接触以支持晶圆100，同时，防滑柔性件312还起到增大与晶圆边缘接触的摩擦力，以避免晶圆产生滑动的作用。防滑柔性件312可以采用诸如硅胶或者橡胶等的摩擦系数较大的防滑材质制成，但是本发明实施例并不以此为限。
防滑柔性件312的结构可以有多种，例如防滑柔性件312呈环状，且防 滑柔性件312的横截面形状满足使支撑面32与晶圆为点接触，该横截面形状例如为圆形、椭圆形等等。由于防滑柔性件312呈环状，晶圆边缘与防滑柔性件312相接触的接触点(即，晶圆边缘与环状防滑柔性件312的交点)最多为2个，这大大减小了防滑柔性件312与晶圆的接触面积，从而可以进一步减少晶圆产生划痕的可能性。上述防滑柔性件312例如为密封胶圈，其不仅取材方便，而且能有效降低应用及维护成本。
需要说明的是，本发明实施例不局限于采用环状的防滑柔性件312，除此之外，防滑柔性件312还可以采用其他任意形状，只要能够起到支撑晶圆，同时防止晶圆产生滑动的作用即可。
在一些可选的实施例中，如图2A至图2B所示，在支撑本体311上形成有安装槽313，防滑柔性件312的一部分设置于该安装槽313的内部，另一部分设置于安装槽313的外部，以实现将防滑柔性件312固定在支撑本体311上。具体地，对于环状的防滑柔性件312，该安装槽313对应设置为环形凹槽，当然，根据不同形状的防滑柔性件312，可以适应性调整安装槽313的形状。并且可选的，为了避免防滑柔性件312从安装槽313中脱出，安装槽313为“燕尾槽”或者其他开口处尺寸较小的凹槽结构。
需要说明的是，本发明实施例并不限定防滑柔性件312的安装方式，例如防滑柔性件312也可以直接粘贴在支撑本体311上，本发明实施例并不以此为限，本领域技术人员可以根据实际情况自行调整设置。
在一些可选的实施例中，使支撑面32形成斜面的方式可以有多种，例如，如图2A至图2B所示，在支撑本体311上形成一斜面311a，在该斜面311a上形成的安装槽313同样倾斜，以使得在将防滑柔性件312安装在该安装槽313中时也是倾斜的，以实现防滑柔性件312上的支撑面32形成斜面。如图2B所示，以支撑本体311的下表面与水平面相互平行，支撑面32与支撑本体311上的斜面311a相互平行为例，斜面311a为平面，且与支撑本体 311的下表面之间的夹角A，即等于支撑面32与水平面之间的夹角，该夹角A可以为1°-60°，例如为5.75°，这样设置既可以保证能够稳定地支撑晶圆，避免晶圆产生滑动，又可以降低支撑本体311的加工难度和加工成本。在实际应用中，上述夹角A的具体数值可以为1°、15°、28°、35°、45°、50°或55°等等，可以根据不同规格的晶圆，自由选择夹角A的大小。
需要说明的是，在本实施例中，斜面311a为平面，但是，本发明并不局限于此，在实际应用中，上述斜面311a还可以圆弧凸面或者其他任意形状的斜面，本发明实施例并不以此为限，本领域技术人员可以根据实际情况自行调整设置。
在一些可选的实施例中，如图3A及图3B所示，在每个支撑部件31的支撑面32上设置有至少一个标记线314，每个标记线314用于标识其中一种尺寸的晶圆边缘在支撑面32上的位置。当对应尺寸的晶圆正确地放置在支撑部件31上时，该标记线314与晶圆边缘重合。上述标记线314可以为在支撑面32上绘制的二维标记，或者也可以由在支撑面32上设置的三维结构构成，例如，在支撑面32上设置圆弧形的沟槽或者凸台。
在一些可选的实施例中，如图2A及图2B所示，机械手还包括定位件4和紧固件5，其中，定位件4设置于手指结构2上，用于限定支撑部件31在手指结构2上的位置，该定位件4例如为定位销，该定位销的两端分别位于支撑部件31与手指结构2上同轴的两个定位孔中；紧固件5用于将支撑部件31与手指结构2固定连接，该紧固件5例如为紧固螺钉。
本发明实施例提供的机械手，其在手指结构上设置有在同一圆周上间隔分布的多个支撑部件，每个支撑部件用于与晶圆的边缘接触以支撑晶圆，且使该晶圆避免与手指结构相接触。由于多个支撑部件仅接触晶圆的边缘，这可以在保证对晶圆支撑的前提下，避免支撑部件与晶圆表面接触，从而可以避免因机械手与晶圆表面接触而造成的晶圆表面产生划痕及接触痕迹。同时， 上述多个支撑部件还可以使晶圆避免与手指结构相接触，从而可以在一定程度上减少因晶圆发生翘曲而造成的与手指结构接触摩擦产生划痕。由此，本发明实施例提供的机械手可以减少因晶圆表面产生划痕而对后续工艺造成的影响，提高产品良率，从而可以应用于诸如背金工艺等的需要保护晶圆表面的工艺的半导体工艺设备。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。
在本发明的描述中，需要理解的是，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述仅是本发明的部分实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种机械手，用于传输晶圆，其特征在于，包括手指结构和多个支撑部件，其中，多个所述支撑部件设置于所述手指结构上，且在同一圆周上间隔分布，每个所述支撑部件用于与所述晶圆的边缘接触以支撑所述晶圆，且使所述晶圆避免与所述手指结构相接触。
  2. 如权利要求1所述的机械手，其特征在于，每个所述支撑部件均包括用于支撑所述晶圆的支撑面，所述支撑面为相对于水平面倾斜的斜面，且所述斜面相对于所述水平面的高度，在所述圆周的径向上沿远离所述圆周的中心的方向逐渐增大。
  3. 如权利要求2所述的机械手，其特征在于，所述斜面为平面，且与所述水平面之间的夹角为1°-60°。
  4. 如权利要求3所述的机械手，其特征在于，所述夹角为5.75°。
  5. 如权利要求2-4任意一项所述的机械手，其特征在于，每个所述支撑部件均包括支撑本体和设置在所述支撑本体上的防滑柔性件，其中，所述防滑柔性件上形成有所述支撑面。
  6. 如权利要求5所述的机械手，其特征在于，所述防滑柔性件呈环状，且所述防滑柔性件的横截面形状满足使所述支撑面与所述晶圆为点接触。
  7. 如权利要求5所述的机械手，其特征在于，在所述支撑本体上形成有安装槽，所述防滑柔性件的一部分设置于所述安装槽的内部，另一部分设置于所述安装槽的外部。
  8. 如权利要求2-4任意一项所述的机械手，其特征在于，在每个所述支撑部件的所述支撑面上设置有至少一个标记线，每个所述标记线用于标识其中一种尺寸的晶圆边缘在所述支撑面上的位置。
  9. 如权利要求1所述的机械手，其特征在于，所述手指结构包括在平行于水平面的方向上间隔设置的两个手指,两个所述手指之间的间隔被设置为使所述晶圆避免与所述手指相接触。
  10. 如权利要求1所述的机械手，其特征在于，所述机械手还包括定位件和紧固件，其中，所述定位件设置于所述手指结构上，用于限定所述支撑部件在所述手指结构上的位置；所述紧固件用于将所述支撑部件与所述手指结构固定连接。
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