WO2022068497A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

Info

Publication number
WO2022068497A1
WO2022068497A1 PCT/CN2021/115288 CN2021115288W WO2022068497A1 WO 2022068497 A1 WO2022068497 A1 WO 2022068497A1 CN 2021115288 W CN2021115288 W CN 2021115288W WO 2022068497 A1 WO2022068497 A1 WO 2022068497A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpc
middle frame
electronic device
battery
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/115288
Other languages
English (en)
French (fr)
Inventor
严斌
薛康乐
刘秀兰
高久亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202180013932.8A priority Critical patent/CN116076068A/zh
Priority to EP21874158.5A priority patent/EP4075768B1/en
Priority to US17/794,218 priority patent/US12401735B2/en
Publication of WO2022068497A1 publication Critical patent/WO2022068497A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present application relates to the technical field of electronic products, and in particular, to an electronic device.
  • a three-stage design structure is mostly used, a main board is arranged at the upper end of the battery, a small plate is arranged at the lower end of the battery, and a main flexible printed circuit (FPC) is used. Connect the main board and the small board.
  • the display screen as a standard component of the mobile phone, is generally connected to the motherboard through the built-in screen FPC.
  • the main FPC is usually arranged between the battery and the middle frame, and the screen FPC is usually arranged between the display screen and the middle frame.
  • the middle frame refers to the structural member between the screen and the battery, and may also be the front case in some solutions in the industry.
  • both the main FPC and the screen FPC are arranged in the thickness direction of the mobile phone, which inevitably increases the overall thickness of the mobile phone.
  • the two FPCs and the middle frame overlap between the battery and the screen, which becomes the thickness bottleneck of the whole machine, and the overlapping position is close to the edge of the battery.
  • the middle frame is not allowed to open holes at the edge of the battery, and due to the thickness of the middle frame
  • the technical problem to be solved by the embodiments of the present application is to provide an electronic device with a thinner overall thickness.
  • an electronic device including a middle frame, a first flexible circuit board FPC, a second FPC, and a battery; the projections of the first FPC and the second FPC on the middle frame have a first overlap area, the first overlapping area is located inside the projection of the battery on the middle frame and away from the edge of the battery; the middle frame is provided with a first through hole, and the first overlapping area is located in the middle frame inside the first through hole.
  • the position of the first through hole corresponds to the overlapping area of the first FPC and the second FPC, and the projection of the overlapping area is completely located in In the first through hole, the thickness of the overlapping area is only the first FPC and the second FPC (for example, the FPC can be deformed flexibly, and the two can move closer to the first through hole). That is, the hole design is performed by the middle frame at the overlapping area of the two FPCs, so that only two elements overlap in the overlapping area.
  • the electronic device provided in the embodiment of the present application has one less component in the thickness direction, which is beneficial to reduce the overall thickness of the electronic device (it can be reduced by 0.1-0.2 mm, or even more), so that it can The thickness of the whole machine is reduced, so that the electronic device has a better sense of user experience.
  • the overlapping area of the two FPCs of the electronic device provided in the embodiment of the present application is constructed inside the projection of the battery on the middle frame, and is away from the edge of the battery, so that the position of the first through hole can be away from the edge of the battery, thereby
  • the middle frame can better support and protect the battery, and the burrs that may be generated due to the opening design of the middle frame will not damage the edge position of the relatively fragile battery, which can ensure the safe use performance of the battery, which is conducive to improving the Overall performance of electronic equipment.
  • the first through hole is larger than the overlapping area, so that the projection of the overlapping area can be completely located in the first through hole.
  • the first through hole should not be set too large to avoid The support performance of the middle frame is affected, and the first through hole should be as far away as possible from the edge of the battery, so as to ensure the safe use performance of the battery.
  • the overlapping area ie, the aforementioned first overlapping area
  • the overlapping area is inside the projection of the battery on the middle frame, and is away from the edge of the battery, wherein the distance may be not close to the edge of the battery, and the first overlapping area determined according to the overlapping area
  • the opening position of the through hole is also not close to the edge of the battery, so that the edge of the battery (for example, the inner electrode) will not be adversely affected.
  • the first through hole and the first overlapping area have the same shape and the same size.
  • the contours of the first through hole and the first overlapping area completely overlap.
  • both the first through hole and the first overlapping area are rectangular.
  • the first through hole is larger than the first overlapping area, and the first overlapping area is completely located in the first through hole.
  • the shape of the first through hole and the shape of the first overlapping region may be the same or different, which is not limited in the present application.
  • the shapes of the first through hole and the first overlapping area are both rectangular, and the first through hole is larger than the first overlapping area.
  • the shapes of the first overlapping regions are all rectangles
  • the shapes of the first through holes are any one of a circle, an ellipse, a trapezoid, a diamond or an irregular shape
  • the area of the first through holes is larger than that of the first overlapping area. area, and the first overlapping area is completely within the first through hole.
  • the first FPC and the second FPC may be located on opposite sides of the middle frame.
  • the first FPC and the second FPC may also be located on the same side of the middle frame, for example, between the middle frame and the display screen, or between the middle frame and the battery, which is not limited in this application.
  • an avoidance hole is formed on the first FPC, and the first FPC avoids the second FPC through the avoidance hole, so that the first overlapping area is away from the edge of the battery .
  • the main purpose of the avoidance hole is to avoid the second FPC within a certain range from the edge of the battery.
  • the projection of the avoidance hole on the middle frame should completely cover the projection of the second FPC on the opposite side.
  • the width of the avoidance hole Should be greater than or equal to the width of the second FPC.
  • the first FPC may have any shape, such as a rectangle, a diamond, a trapezoid, a circle, or any irregular shape, which is not limited in this application.
  • the middle frame includes a protruding portion, a front end of the protruding portion extends into the escape hole, and a rear end of the protruding portion forms an escape space for accommodating the second FPC.
  • the front end of the protrusion may be embedded in the escape hole.
  • the front end of the protruding portion is provided adjacent to (closer to) the escape hole.
  • the area in the avoidance hole can also only have the thickness of two components (the middle frame and the second FPC), which is beneficial to reduce the overall thickness of the electronic device, so as to realize The reduction of the thickness of the whole machine makes the electronic device have a better sense of user experience.
  • the projection of the first FPC and the second FPC on the middle frame has a second overlapping area
  • the first FPC further includes a thinning area
  • the thickness of the thinning area is The thickness of the thinned region on the middle frame is smaller than the thickness of other regions of the first FPC, and the projection of the thinned region covers the second overlapping region.
  • the first overlapping area and the second overlapping area are connected.
  • the first FPC includes a stacked FPC body and a functional film layer, and a thinning process is performed on the FPC body and/or the functional film layer to form the thinned region.
  • the functional film layer includes a protective film layer and a shielding film layer.
  • two sides of the middle frame are respectively provided with a first groove and a second groove, the first FPC is provided in the first groove, and the second FPC is provided in the in the second groove.
  • the first FPC is the screen FPC of the electronic device
  • the second FPC is the main FPC of the electronic device.
  • the first FPC is electrically connected to the display screen and the main board by welding
  • the second FPC is electrically connected to the main board and the small board by welding.
  • the first FPC is electrically connected to the display screen and the main board through the connector
  • the second FPC is electrically connected to the main board and the small board through the connector
  • the connector may be a zero insertion force connector or a board-to-board connector.
  • the first FPC (through the first adhesive layer is fixedly attached to the inner surface of the display screen of the electronic device, and the second FPC is fixedly attached through the second adhesive layer) on the middle frame.
  • the middle frame further defines a third groove in the second groove, and the second adhesive layer is disposed in the third groove.
  • the first FPC is electrically connected to the main board of the electronic device through a second through hole opened on the middle frame.
  • FIG. 1 is a schematic diagram of the overall structure of a prior art smartphone from one perspective.
  • FIG. 2 is a schematic diagram of the overall structure of a prior art smartphone from another perspective.
  • FIG. 3 is a schematic diagram of an overall structure of an electronic device provided by an embodiment of the present application.
  • FIG. 4 is a schematic connection diagram of a part of the internal structure of the electronic device provided by the embodiment of the present application.
  • FIG. 5 is an exploded view of an electronic device provided by an embodiment of the present application from a perspective.
  • FIG. 6 is an exploded view from another perspective of the electronic device provided by the embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a mainboard provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a viewing angle of a display screen provided by an embodiment of the present application.
  • FIG. 9 is a perspective view of a part of the internal structure of an electronic device provided by an embodiment of the present application.
  • FIG. 10 is a cross-sectional view taken along the direction A-A in FIG. 9 .
  • FIG. 11 is a cross-sectional view taken along the direction B-B in FIG. 9 .
  • FIG. 12 is a cross-sectional view taken along the C-C direction in FIG. 9 .
  • FIG. 13 is a schematic connection diagram of a part of the internal structure of another example of the electronic device provided by the embodiment of the present application.
  • FIG. 14 is a cross-sectional view in the direction D-D in FIG. 13 .
  • FIG. 15 is a schematic structural diagram of an example of the first FPC in FIG. 13 .
  • FIG. 16 is a schematic structural diagram of another example of the first FPC in FIG. 13 .
  • FIG. 17 is an exploded view from a perspective of another example of the electronic device provided by the embodiment of the present application.
  • FIG. 18 is an exploded view from another perspective of another example of the electronic device provided by the embodiment of the present application.
  • the terms “installation” and “connection” should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection, an electrical connection or can communicate with each other; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements.
  • installation and “connection” should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection, an electrical connection or can communicate with each other; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements.
  • Flexible printed circuit is a printed circuit board made of flexible insulating substrates, which has many advantages that rigid printed circuit boards (printed circuit board, PCB) do not have, such as FPC can be freely bent, rolled Winding and folding can be arbitrarily arranged according to the space layout requirements, so as to achieve the integration of component assembly and wire connection. Due to the above advantages, the use of FPC can effectively reduce the volume or thickness of electronic products, increase the flexibility of circuit layout, and meet the needs of electronic products to develop in the direction of high density, miniaturization, and high reliability.
  • PCB printed circuit board
  • FIG. 1 is a schematic diagram of the overall structure of a prior art smartphone from one perspective.
  • FIG. 2 is a schematic diagram of the overall structure of a prior art smartphone from another perspective.
  • a middle frame 3 and a battery 4 are sequentially arranged between the display screen 8 and the back cover (not shown in the figure) of the smartphone.
  • the main board 1, the small board 2 and the battery 4 are arranged side by side, and the main board 1 is arranged on the upper end of the battery 4, the small board 2 is arranged on the lower end of the battery 4, and the main board 1 and the small board 2 are electrically connected through the main FPC 3.
  • the display screen is electrically connected to the main board 1 through the built-in screen FPC 6 .
  • the main FPC 5 is arranged between the battery 4 and the middle frame 3
  • the screen FPC 6 is arranged between the display screen 8 and the middle frame 3 . That is to say, the main FPC 5 and the screen FPC 6 are respectively arranged on opposite sides of the middle frame 3 .
  • the screen FPC 6 is located on the upper side of the middle frame 3, the main board 1, the small board 2, the battery 4, and the main FPC 5 are located on the lower side of the middle frame 3, and the main FPC 5 is located in the middle frame 3 and the battery. 4 to connect the main board 1 and the small board 2. Since the screen FPC 6 and the main board 1 are located on opposite sides of the middle frame 3, in order to realize the connection between the two, a through hole 7 can be opened on the middle frame 3, one end of the screen FPC 6 is electrically connected to the display screen 8, and the other end passes through the After the perforation 7 is made, it is electrically connected to the main board 1 on the lower side of the middle frame 3 .
  • the two FPCs and the middle frame 3 have an overlapping area S between the battery 4 and the display screen 8 , and the thickness of the overlapping area S is the sum of the thicknesses of the two FPCs and the middle frame 3 . And, the existence of the overlapping area S becomes the design bottleneck of the thickness of the whole machine.
  • the overlapping area S is close to the edge of the battery 4, and a plurality of electrodes are arranged inside the edge of the battery 4. If a punching design is performed on the middle frame 3, burrs are easily generated on the middle frame 3, and the burrs are easy to pierce the battery 4, causing the battery A short circuit occurs between the electrodes inside 4 , which affects the safety performance of the battery 4 .
  • the middle frame 3 is generally not allowed to be punched at the edge of the battery 4 .
  • the thickness of the middle frame 3 also has a processing limit (for example, under the current processing technology, the limit thickness of the middle frame is 0.35 mm), further thinning cannot be achieved, thus hindering the slim design of smartphones , which is not conducive to the development of thin and light smartphones.
  • the embodiments of the present application provide an electronic device with a thinner overall thickness by improving the internal structure of the electronic device, thereby improving the user experience.
  • An embodiment of the present application provides an electronic device, which may be a mobile phone (for example, a common mobile phone or a foldable mobile phone), a tablet computer, a notebook computer, a wearable device, etc., but is not limited thereto.
  • a mobile phone for example, a common mobile phone or a foldable mobile phone
  • a tablet computer for example, a tablet computer
  • a notebook computer for example, a notebook computer
  • a wearable device etc., but is not limited thereto.
  • FIG. 3 is a schematic diagram of an overall structure of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 is a mobile phone, and includes a casing 10 and a display screen 20 , and the display screen 20 is mounted on the casing 10 .
  • the electronic device 100 further includes electronic components (not shown in the figure) disposed inside the housing 10 , and the electronic components include, but are not limited to, a circuit board, a processor, a camera, a flash, a microphone, and a battery.
  • the casing 10 may be a metal casing, such as magnesium alloy, stainless steel and other metals. In addition, it can also be a plastic casing, a glass casing, a ceramic casing, etc., but is not limited thereto.
  • the casing 10 includes structures such as a frame, a back cover, and the like.
  • the display screen 20 forms an accommodation space with the housing 10, and is used for accommodating electronic components or functional components of the electronic device 100.
  • the display screen 20 forms a display surface of the electronic device 100 and is used to display information such as images and texts.
  • the display screen 20 may be a light emitting diode (LED) display screen, a liquid crystal display (LCD) display screen or an organic light-emitting diode (organic light-emitting diode, OLED) display screen, etc., but is not limited thereto.
  • the display screen 20 may also be a folding screen (flexible screen).
  • FIG. 4 is a schematic connection diagram of a part of the internal structure of the electronic device 100 provided by the embodiment of the present application.
  • FIG. 5 is an exploded view from a perspective of the electronic device 100 provided by the embodiment of the present application.
  • FIG. 6 is an exploded view from another perspective of the electronic device 100 provided by the embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a mainboard 30 provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a viewing angle of the display screen 20 provided by the embodiment of the present application.
  • the electronic device 100 provided in the embodiment of the present application includes: a middle frame 30 , a first flexible circuit board FPC 40 , a second FPC 50 , and a battery 60 .
  • the first FPC 40 and the second FPC 50 are respectively disposed on opposite sides of the middle frame 30.
  • the projections of the first FPC 40 and the second FPC 50 on the middle frame 30 have a first overlapping area s1 , the first overlapping area s1 is located inside the projection of the battery 60 on the middle frame 30 and away from the edge of the battery 60 .
  • the middle frame 30 is provided with a first through hole 31 , and the first overlapping area s1 is located in the first through hole 31 .
  • Flexible printed circuit is abbreviated as FPC, also known as “flexible circuit board” or “flexible circuit board, flexible circuit board, flexible circuit board, flexible circuit board”.
  • the flexible circuit board is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film.
  • the flexible circuit board also includes a hard and soft structure board, and in this case, the local area may be a rigid circuit board.
  • a middle frame 30 is disposed inside the electronic device 100, and the middle frame 30 divides the internal accommodation space of the electronic device 100 into two parts, that is, the accommodation space between the display screen 20 and the middle frame 30, and The accommodation space between the middle frame 30 and the back cover, the first FPC 40 is arranged in the accommodation space between the display screen 20 and the middle frame 30, and the second FPC 50 is arranged in the accommodation space between the middle frame 30 and the back cover That is, the first FPC 40 and the second FPC 50 are respectively disposed on opposite sides of the middle frame 30.
  • the electronic device 100 further includes a battery 60 , the battery 60 is disposed in the accommodating space between the middle frame 30 and the back cover, and the second FPC 50 is located between the middle frame 30 and the battery 60 .
  • the first FPC 40 and the second FPC 50 have overlapping (or intersecting) regions, and more specifically, the projections of the first FPC 40 and the second FPC 50 on the middle frame 30 have a first overlapping region s1, And the first overlapping area s1 is located inside the projection of the battery 60 on the middle frame 30 and is far away from the edge of the battery 60 .
  • the middle frame 30 is provided with a first through hole 31 , the first through hole 31 penetrates both sides of the middle frame 30 , and the first overlapping area s1 is located in the first through hole 31 . inside the through hole 31 . That is to say, the shapes and sizes of the first through holes 31 and the first overlapping region s1 are adapted to each other.
  • the first through hole 31 and the first overlapping region s1 have the same shape and size, and at this time, the contours of the first through hole 31 and the first overlapping region s1 completely overlap.
  • the first through hole 31 and the first overlapping area s1 are both rectangular.
  • the first through hole 31 is larger than the first overlapping area s1 , and the first overlapping area s1 is completely located in the first through hole 31 .
  • the shape of the first through hole 31 and the shape of the first overlapping region s1 may be the same or different, which are not limited in this application.
  • the shapes of the first through hole 31 and the first overlapping area s1 are both rectangular, and the first through hole 31 is larger than the first overlapping area s1.
  • the shapes of the first overlapping regions s1 are all rectangles
  • the shapes of the first through holes 31 are any one of a circle, an ellipse, a trapezoid, a diamond shape or an irregular shape
  • the area of the first through holes 31 is larger than The first overlapping area s1 is completely located within the first through hole 31 .
  • the position of the first through hole 31 corresponds to the overlapping area of the first FPC 40 and the second FPC 50, and the The projection of the overlapping area is completely located in the first through hole 31, so that the thickness of the overlapping area is only the first FPC 40 and the second FPC 50 (for example, the FPC can be flexibly deformed, and the two can be carried out into the first through hole 31). move closer). That is, the hole design is performed by the middle frame 30 at the overlapping area of the two FPCs, so that only two elements overlap in the overlapping area.
  • the electronic device 100 provided in the embodiment of the present application has one less component in the thickness direction, which is beneficial to reduce the overall thickness of the electronic device 100 (can be reduced by 0.1-0.2 mm, or even more), so that the thickness of the whole machine can be reduced, so that the electronic device 100 has a better sense of user experience.
  • the overlapping area of the two FPCs of the electronic device 100 provided in the embodiment of the present application is constructed inside the projection of the battery 60 on the middle frame 30 and is far away from the edge of the battery 60 , so that the position of the first through hole 31 can be far away from the edge of the battery 60 .
  • the first through hole 31 is larger than the overlapping area, so that the projection of the overlapping area can be completely located in the first through hole, but the first through hole 31 should not be set too large , to avoid affecting the support performance of the middle frame 30 , and the first through hole 31 should be as far away from the edge of the battery 60 as possible, so as to ensure the safe use performance of the battery 60 .
  • the electronic device 100 provided by the embodiments of the present application is not limited to the aforementioned three-stage architecture design, and other architecture designs are also applicable.
  • first FPC 40 and the second FPC 50 are respectively disposed on opposite sides of the middle frame 30.
  • first FPC 40 and the second FPC 50 may also be located on the same side of the middle frame 30, for example, between the middle frame 30 and the display screen 20, or between the middle frame 30 and the battery 60 at the same time, This application does not limit this.
  • the overlapping area (ie, the aforementioned first overlapping area s1 ) is inside the projection of the battery 60 on the middle frame 30 , and is away from the edge of the battery 60 , wherein the distance may be not close to the edge of the battery 60 , and according to the overlap
  • the opening positions of the first through holes 31 determined by the area are also not close to the edge of the battery 60 , so that the edge of the battery 60 (eg, internal electrodes) will not be adversely affected.
  • the embodiment of the present application does not limit how to construct the overlapping area of the first FPC and the second FPC inside the battery 60 and away from the edge of the battery 60 , and the setting positions of the first FPC and the second FPC can be arbitrarily set according to specific requirements (for example, direction) to achieve the above purpose, which is not limited in this application.
  • the overlapping of the two FPCs at the edge of the battery 60 is avoided, and the overlapping position (ie the aforementioned first overlapping area s1 ) is transferred to the interior of the projection of the battery 60 , and away from the edge of the battery 60 .
  • the first FPC 40 is provided with an avoidance hole 41 , the avoidance hole 41 is a through hole, and the first FPC 40 avoids the second FPC through the avoidance hole 41 50 , so that the first overlapping area s1 is far away from the edge of the battery 60 .
  • the projection of the avoidance hole 41 on the middle frame 30 is connected to the projection of the first overlapping area s1, and after the second FPC 50 passes through the avoidance hole 41, it overlaps with the first FPC 40 to form the first overlapping area s1.
  • the main purpose of the avoidance hole 41 is to avoid the second FPC 50 within a certain range from the edge of the battery 60.
  • the projection of the avoidance hole 41 on the middle frame 30 should completely cover the projection of the second FPC 50 on the opposite side.
  • the width of the avoidance hole 41 should be greater than or equal to the width of the second FPC 50.
  • the first FPC 40 may be any shape, such as a rectangle, a rhombus, a trapezoid, a circle, or any irregular shape, etc., which is not limited in this application.
  • the first FPC 40 is the screen FPC of the electronic device 100
  • the second FPC 50 is the main FPC of the electronic device 100.
  • the electronic device 100 further includes a main board 70 and a small board 80, and the first FPC 40 may be a screen FPC.
  • the first FPC 40 may be a screen FPC.
  • one end of the first FPC 40 is electrically connected to the display screen 20 (No.
  • An FPC 40 can be regarded as a part of the display module), and the other end of the first FPC 40 is electrically connected to the main board 70 after passing through the second through hole 32 opened on the middle frame 30.
  • the second FPC 50 may be the main FPC of the electronic device 100. At this time, one end of the second FPC 50 is electrically connected to the main board 70, and the other end is electrically connected to the small board 80. At this time, the second FPC 50 may be located between the middle frame 30 and the battery 60 .
  • the first FPC 40 is electrically connected to the display screen 20 and the main board 70 by welding
  • the second FPC 50 is electrically connected to the main board 70 and the small board 80 by welding.
  • the first FPC 40 is electrically connected to the display screen 20 and the main board 70 through the connector
  • the second FPC 50 is electrically connected to the main board 70 and the small board 80 through the connector.
  • the connector may be a zero insertion force (ZIF) connector or a board to board (BTB) connector.
  • ZIF zero insertion force
  • BTB board to board
  • the first FPC 40 may be a conventional FPC, or may be a special soft board such as chip on flex or chip on film (COF) or chip on plastic (COP). This is not limited.
  • COF chip on flex or chip on film
  • COP chip on plastic
  • main circuits, chips, sensors, interfaces and plug-ins of the electronic device 100 can be set on the main board 70
  • USB interfaces, antenna contacts and radio frequency interfaces of the electronic device 100 can be set on the small board 80 .
  • the first FPC 40 may be an FPC other than the aforementioned screen FPC and the main FPC that implements electrical connection of other components
  • the second FPC 50 may also be an FPC that implements other components other than the aforementioned screen FPC and the main FPC.
  • the FPC that is electrically connected is not limited in this application.
  • the battery 60 may be a lithium battery or a nickel-cadmium battery, which is not limited in this application.
  • the electronic device 100 further includes a frame 90 .
  • the frame 90 is disposed around the outer periphery of the middle frame 30 and is fixedly connected to the middle frame 30 .
  • the frame 90 and the middle frame 30 may be fabricated through an integral molding process.
  • the two sides of the middle frame 30 are respectively provided with a first groove 33 and a second groove 34, the first FPC 40 is provided in the first groove 33, and the second FPC 50 is provided in the first groove 33. inside the two grooves 34 .
  • a first groove 33 and a second groove 34 may be provided on both sides of the middle frame 30, respectively.
  • the shape of the first groove 33 is consistent with the shape of the first FPC 40, and the first FPC 40 is correspondingly embedded in the first groove 33. in the groove 33.
  • the depth of the first groove 33 is adapted to the height of the first FPC 40, for example, the depth of the first groove 33 may be greater than, less than or equal to the height of the first FPC 40.
  • the aforementioned second through hole 32 is disposed at the end of the first groove 33, and the end of the first FPC 40 is electrically connected to the main board 70 on the other side of the middle frame 30 through the second through hole 32.
  • the shape of the second groove 34 is consistent with the shape of the second FPC 50 , and the second FPC 50 is correspondingly embedded in the second groove 34 .
  • the depth of the second groove 34 is adapted to the height of the second FPC 50, for example, the depth of the second groove 34 may be greater than, less than or equal to the height of the second FPC 50.
  • a groove is formed on the middle frame 30 to accommodate the FPC.
  • better positioning and fixing of the FPC can be achieved, and on the other hand, the thickness of the electronic device 100 can be further reduced.
  • FIG. 9 is a perspective view of a part of the internal structure of the electronic device 100 provided by the embodiment of the present application.
  • FIG. 10 is a cross-sectional view taken along the A-A direction in FIG. 9 .
  • FIG. 11 is a cross-sectional view taken along the B-B direction in FIG. 9 .
  • FIG. 12 is a cross-sectional view taken along the C-C direction in FIG. 9 .
  • the middle frame 30 includes a protruding portion 37 , the front end of the protruding portion 37 is inserted into the avoidance hole 41 , and the rear end of the protruding portion 37 forms an accommodating part 37 . 2. Avoidance space 38 of FPC 50.
  • the shape of the protrusion 37 is adapted to the shape and size of the avoidance hole 41, the protrusion 37 is embedded in the avoidance hole 41, and the front end surface of the protrusion 37 can be flush with the surface of the first FPC 40 away from the middle frame 30. .
  • the second FPC 50 is accommodated in the avoidance space 38 on the opposite side.
  • the area within the avoidance hole 41 can also only have the thickness of two components (the middle frame 30 and the second FPC 50 ), which is beneficial to reduce the overall size of the electronic device 100 .
  • the thickness of the machine can be reduced, so that the thickness of the whole machine can be reduced, so that the electronic device 100 has a better user experience.
  • the front end of the protruding portion 37 may extend into the avoidance hole 41 without being embedded in the avoidance hole 41 , for example, the front end of the protrusion portion 37 may also be disposed adjacent to (close to) the avoidance hole. At this time, the thinning effect can also be achieved.
  • the middle frame 30 includes a protruding portion 37 that protrudes outward relative to the bottom wall of the first groove 33 , and may or may not protrude relative to other parts of the middle frame 30 , that is, protrude
  • the height of the top of the portion 37 may be higher than, equal to, or lower than the height of other parts of the middle frame 30 , which is not limited in this application.
  • the first FPC 40 is fixedly attached to the inner surface of the display screen 20 of the electronic device 100 through the first adhesive layer 42 , and the second FPC 50 passes through the second back
  • the adhesive layer 51 is fixedly attached to the middle frame 30 .
  • the battery 60 can be fixedly attached to the middle frame 30 through the third adhesive layer 61 .
  • middle frame 30 is also provided with a third groove 35 in the second groove 34 , and the second adhesive layer 42 is disposed in the third groove 35 .
  • a plurality of second adhesive layers 51 may be provided, and correspondingly, a plurality of third grooves 35 may be provided, which is not limited in this application.
  • three second adhesive layers 51 and three third grooves 35 can be provided correspondingly and spaced apart from each other, so that the first FPC 40 can be reliably fixed.
  • FIG. 13 is a schematic connection diagram of a part of the internal structure of another example of the electronic device 100 provided by the embodiment of the present application.
  • FIG. 14 is a cross-sectional view in the direction D-D in FIG. 13 .
  • the projection of the first FPC 40 and the second FPC 50 on the middle frame 30 has a second overlapping area s2, and the first FPC 40 further includes a thinned area 43, and the thickness of the thinned area 43 is less than The thickness of other regions of the first FPC 40, the projection of the thinned region 43 on the middle frame 30 covers the second overlapping region s2.
  • the first FPC 40 is provided with an escape hole 41, and in this embodiment, the first FPC 40 further includes a thinning area 43, and the thinning area 43 corresponds to the foregoing escape hole 41, and the foregoing
  • the avoidance hole 41 in the embodiment is a through hole, and the avoidance hole 41 can also be a blind hole (ie, the first FPC 40 is not penetrated), so as to form the thinning area 43 in this embodiment. That is to say, the first FPC 40 only digs out part of the thickness, and does not dig through, so as to achieve the purpose of reducing a certain thickness.
  • the shape and size of the thinned area 43 are similar to the aforementioned avoidance hole 41.
  • the projection of the thinned area 43 on the middle frame 30 covers the second overlapping area s2, that is, covers the second FPC 50 at the corresponding position.
  • the second overlapping area s2 is connected with the first overlapping area s1, that is, at this time, by setting the second overlapping area s2, the first overlapping area s1 is transferred to the inside of the projection of the battery 60, and is far from the battery 60. edge.
  • FIG. 15 is a schematic structural diagram of an example of the first FPC 40 in FIG. 13 .
  • the first FPC 40 includes a stacked FPC body 40a and a functional film layer 40b, and the FPC body 40a and/or the functional film layer 40b may be thinned to form a thinning region 43.
  • the functional film layer 40 b can be thinned to form the thinned region 43 .
  • part or all of the at least one functional film layer 40b covered by the FPC main body 40a may be excavated to form the thinned region 43 .
  • the functional film layer 40b may include a protective film layer (insulating mylar).
  • the protective film layer may be a polyimide film (PI).
  • only one protective film layer may be covered on the FPC body 40a.
  • the functional film layer 40b may further include a shielding film layer, and the shielding film layer may be a metal (eg, copper) layer.
  • the shielding film layer may be a metal (eg, copper) layer.
  • a protective film layer, a shielding film layer and a protective film layer may be sequentially covered on the FPC body 40a.
  • the FPC body 40a may include at least one conductive layer.
  • the FPC main body 40a may be a single-layer board, a double-layer board, or a multi-layer board (eg, 3, 4, 5 layers, etc.), which is not limited in this application.
  • FIG. 16 is a schematic structural diagram of another example of the first FPC 40 in FIG. 13 .
  • the thinning region 43 is formed by thinning the FPC body 40 a.
  • the FPC main body 40a may be thinned first, and then the functional film layer 40b may be covered.
  • part or all of the at least one conductive layer of the FPC body 40a may be excavated, and then the functional film layer 40b may be covered to form the thinned region 43 .
  • the FPC body 40a may be a multi-layer board, and part or all of it may be excavated (eg, a layer of the FPC body 40a), and then the functional film layer 40b may be covered to form the thinned area 43 .
  • FIG. 17 is an exploded view from a perspective of another example of the electronic device 100 provided by the embodiment of the present application.
  • FIG. 18 is an exploded view from another perspective of another example of the electronic device 100 provided by the embodiment of the present application.
  • the first FPC 40 and the second FPC 50 are located on the same side of the middle frame 30 , that is, as shown in FIGS. 17 and 18 , in this embodiment
  • the first FPC 40 and the second FPC 50 are both located between the middle frame 30 and the display screen 20 .
  • the first FPC 40 and the second FPC 50 may also be located between the middle frame 30 and the battery 60, which is not limited in this application.
  • the second FPC 50 is located between the middle frame 30 and the first FPC 40, and a bent portion 52 can be provided on the second FPC 50, and the rear side of the bent portion 52 is concave to form an accommodating space, the accommodating space
  • the front side of the bent portion 52 protrudes into the first through hole 31, for example, can be inserted into/embedded into the first through hole 31, so as to achieve the purpose of thinning.
  • a first groove 33 and a second groove 34 may be provided on the same side of the middle frame 30, the first FPC 40 is provided in the first groove 33, and the second FPC 50 is provided in the second groove 34 .
  • the first through hole 31 is opened at the intersection of the first groove 33 and the second groove 34 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请提供了一种电子设备，包括：中框(30)、第一柔性电路板FPC(40)、第二FPC(50)以及电池(60)；所述第一FPC(40)和所述第二FPC(50)在所述中框(30)的投影具有第一重叠区域(s1)，所述第一重叠区域(s1)位于所述电池(60)在所述中框(30)的投影的内部，并且远离所述电池(60)的边缘；所述中框(30)上开设有第一通孔(31)，所述第一重叠区域(s1)位于所述第一通孔(31)内。本申请提供的电子设备能够实现整机厚度的减薄，使得电子设备具有较佳的用户体验感。

Description

一种电子设备
本申请要求于2020年09月30日提交国家知识产权局、申请号为202022217809.3、申请名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子产品技术领域，特别涉及一种电子设备。
背景技术
随着科技的发展，智能手机、平板电脑等消费型电子产品迅速普及，极大地促进了社会的发展、方便了人们的生活。精美的外观质感，完美的用户体验，对手机的设计提出越来越高的要求，怎样把手机越做越轻薄，也成为结构设计的一大挑战。
在目前的设计方案中，为使手机整机厚度做薄，多采用三段式的设计架构，在电池上端设置主板，在电池下端设置小板，采用主柔性电路板(flexible printed circuit，FPC)连接主板和小板。此外，显示屏作为手机的标准组件，一般通过自带的屏幕FPC连接至主板。为了充分利用手机内部空间，主FPC通常设置于电池和中框之间，屏幕FPC通常设置于显示屏和中框之间。此处，中框代指屏幕和电池之间的结构件，在业内一些方案中也可以为前壳。
如此一来，主FPC和屏幕FPC均设置在手机的厚度方向，不可避免地增加了手机的整体厚度。两个FPC和中框在电池和屏幕之间重叠，成为整机的厚度瓶颈，并且重叠位置靠近电池边缘，为了电池安全考虑，中框在电池边缘处不允许开孔设计，且由于中框厚度也存在加工极限，无法进一步减薄，不利于手机的轻薄化发展。
发明内容
本申请实施例所要解决的技术问题在于提供一种整机厚度较薄的电子设备。
第一方面，提供了一种电子设备，包括中框、第一柔性电路板FPC、第二FPC以及电池；所述第一FPC和所述第二FPC在所述中框的投影具有第一重叠区域，所述第一重叠区域位于所述电池在所述中框的投影的内部，并且远离所述电池的边缘；所述中框上开设有第一通孔，所述第一重叠区域位于所述第一通孔内。
根据本申请实施例提供的电子设备，通过在中框上开设第一通孔，该第一通孔的位置与第一FPC和第二FPC的重叠区域相对应，并且该重叠区域的投影完全位于第一通孔内，进而使得在该重叠区域的厚度只有第一FPC和第二FPC(例如，FPC能够柔性变形，二者可以向第一通孔内进行靠拢)。也就是说，通过在两个FPC的重叠区域处的中框进行开孔设计，使得在该重叠区域仅有两个元件重叠。此外，电池投影内的其他任意位置处也都只有两个元件(第一FPC和中框，或者第二FPC和中框)重叠，相比于常规方案(两个FPC加上中框三者的厚度之和构成整机厚度瓶颈)，本申请实施例提供的电子设备在厚度方向上少一个元件，有利于降低电子设备的整机厚度(可降低0.1～0.2毫米，甚至更多)，从而能够实现整机厚度的减薄，使得电子设备具有较佳的用户体验感。
进一步地，本申请实施例提供的电子设备的两个FPC的重叠区域被构造在电池在中 框的投影的内部，并且远离电池的边缘，使得第一通孔的位置能够远离电池的边缘，从而使得中框能够对电池进行更好的支撑保护，因对中框进行开孔设计可能产生的毛刺不会对相对脆弱的电池的边缘位置进行损坏，能够保障电池的安全使用性能，进而有利于提高电子设备的整机性能。
应理解，在本申请实施例中，第一通孔大于该重叠区域，进而能够使得该重叠区域的投影能够完全位于第一通孔内，但是，该第一通孔不应设置过大，避免对中框的支撑性能造成影响，而且该第一通孔应当尽量远离电池的边缘，从而能够保障电池的安全使用性能。
在这里，重叠区域(即前述的第一重叠区域)在电池在中框的投影的内部，并且远离电池的边缘，其中，远离可以是不靠近电池的边缘，并且根据该重叠区域确定的第一通孔的开设位置也不靠近电池的边缘，从而不会对电池的边缘(例如，内部的电极)造成不良影响。
可选地，第一通孔和第一重叠区域的形状相同，并且大小也相同，此时，第一通孔和第一重叠区域的轮廓完全重合。
例如，第一通孔和第一重叠区域均为矩形。
可选地，第一通孔大于第一重叠区域，第一重叠区域完全位于第一通孔内。此时，第一通孔的形状和第一重叠区域的形状可以相同，也可以不同，本申请对此不做限定。
例如，第一通孔和第一重叠区域的形状均为矩形，并且第一通孔大于第一重叠区域。
再例如，第一重叠区域的形状均为矩形，第一通孔的形状为圆形、椭圆形、梯形、菱形或者不规则形状等中的任意一种，第一通孔的面积大于第一重叠区域，并且第一重叠区域完全位于第一通孔内。
可选地，第一FPC和第二FPC可以位于中框的相对的两侧。
可选地，第一FPC和第二FPC也可以位于中框的同一侧，例如同时位于中框与显示屏之间，或者同时位于中框与电池之间，本申请对此不作限定。在一种可能的设计中，所述第一FPC上开设有避让孔，所述第一FPC通过所述避让孔避让所述第二FPC，进而使得所述第一重叠区域远离所述电池的边缘。
避让孔的主要目的为在距离电池边缘一定范围内避让第二FPC，为了实现避让作用，避让孔在中框的投影应当完全覆盖相对一侧的第二FPC的投影，此时，避让孔的宽度应当大于或者等于第二FPC的宽度。
可选地，第一FPC可以为任意形状，例如矩形、菱形、梯形、圆形或者任意不规则形状等，本申请对此不做限定。
在一种可能的设计中，所述中框包括突出部，所述突出部的前端向所述避让孔内进行延伸，所述突出部的后端形成容纳所述第二FPC的避让空间。
可选地，突出部的前端可以嵌入避让孔内。或者，突出部的前端临近(靠近)避让孔进行设置。
本申请实施例通过设置突出部和避让空间，可以使得在避让孔内的区域同样仅有两个元件(中框和第二FPC)的厚度，有利于降低电子设备的整机厚度，从而能够实现整机厚度的减薄，使得电子设备具有较佳的用户体验感。
在一种可能的设计中，所述第一FPC和所述第二FPC在所述中框的投影具有第二重叠区域，所述第一FPC还包括减薄区，所述减薄区的厚度小于所述第一FPC其他区域的 厚度，所述减薄区在所述中框的投影覆盖所述第二重叠区域。
在一种可能的设计中，所述第一重叠区域和所述第二重叠区域相连接。
在一种可能的设计中，所述第一FPC包括层叠设置的FPC主体和功能膜层，对所述FPC主体和/或功能膜层进行减薄处理以形成所述减薄区。
在一种可能的设计中，所述功能膜层包括防护膜层和屏蔽膜层。
在一种可能的设计中，所述中框的两侧面分别设置有第一凹槽和第二凹槽，所述第一FPC设置于所述第一凹槽内，所述第二FPC设置于所述第二凹槽内。
在一种可能的设计中，所述第一FPC为所述电子设备的屏幕FPC，所述第二FPC为所述电子设备的主FPC。
可选地，第一FPC通过焊接与显示屏以及主板电连接，第二FPC通过焊接与主板以及小板电连接。
可选地，第一FPC通过连接器与显示屏以及主板电连接，第二FPC通过连接器与主板以及小板电连接。
例如，该连接器可以是零插入力连接器或者板对板连接器。
在一种可能的设计中，所述第一FPC(通过第一背胶层固定贴合于所述电子设备的显示屏的内表面上，所述第二FPC通过第二背胶层固定贴合于所述中框上。
在一种可能的设计中，所述中框位于所述第二凹槽内还开设有第三凹槽，所述第二背胶层设置于所述第三凹槽内。
在一种可能的设计中，所述第一FPC穿过所述中框上开设的第二通孔与所述电子设备的主板电连接。
附图说明
图1是现有技术智能手机的一个视角的整体结构的示意图。
图2是现有技术智能手机的另一个视角的整体结构的示意图。
图3为本申请实施例提供的电子设备的整体结构示意图。
图4是本申请实施例提供的电子设备的部分内部结构的连接示意图。
图5是本申请实施例提供的电子设备的一个视角的爆炸图。
图6是本申请实施例提供的电子设备的另一个视角的爆炸图。
图7是本申请实施例提供的主板的结构示意图。
图8是本申请实施例提供的显示屏的一个视角的结构示意图。
图9是本申请实施例提供的电子设备的部分内部结构的透视图。
图10是图9中A-A方向的剖视图。
图11是图9中B-B方向的剖视图。
图12是图9中C-C方向的剖视图。
图13是本申请实施例提供的电子设备的另一例的部分内部结构的连接示意图。
图14是图13中D-D方向的剖视图。
图15是图13中第一FPC的一个示例的结构示意图。
图16是图13中第一FPC的另一个示例的结构示意图。
图17是本申请实施例提供的电子设备的另一例的一个视角的爆炸图。
图18是本申请实施例提供的电子设备的另一例的另一个视角的爆炸图。
附图标记：1、主板；2、小板；3、中框；4、电池；5、主板FPC；6、屏幕FPC；7、穿孔；8、显示屏；S、重叠区域；10、壳体；20、显示屏；30、中框；31、第一通孔；32、第二通孔；33、第一凹槽；34、第二凹槽；35、第三凹槽；36、中框电池仓；37、突出部；38、避让空间；40、第一FPC；40a、FPC主体；40b、功能膜层；41、避让孔；42、第一背胶层；43、减薄区；50、第二FPC；51、第二背胶层；52、弯折部；60、电池；61、第三背胶层；70、主板；80、小板；90、边框；100、电子设备；s1、第一重叠区域；s2、第二重叠区域。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请的描述中，需要理解的是，术语“上”、“下”、“侧”、“前”、“后”等指示的方位或位置关系为基于安装的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。
还需说明的是，本申请实施例中以同一附图标记表示同一组成部分或同一零部件，对于本申请实施例中相同的零部件，图中可能仅以其中一个零件或部件为例标注了附图标记，应理解的是，对于其他相同的零件或部件，附图标记同样适用。
随着科技的发展，智能手机、平板电脑等消费型电子产品迅速普及，极大地促进了社会的发展、方便了人们的生活。精美的外观质感，完美的用户体验，对手机的设计提出越来越高的要求，怎样把手机越做越轻薄，也成为结构设计的一大挑战。
柔性电路板(flexible printed circuit，FPC)是用柔性的绝缘基材制成的印刷电路板，其具有许多硬性印刷电路板(printed circuit board，PCB)不具备的优点，例如FPC可以自由弯曲、卷绕、折叠，可依照空间布局要求任意安排，从而达到元器件装配和导线连接 的一体化。由于存在上述优点，使得采用FPC可以有效缩小电子产品的体积或者厚度，增加电路布局的灵活性，符合电子产品向高密度、小型化、高可靠方向发展的需要。
在目前的设计方案中，为使手机整机厚度做薄，多采用三段式的设计架构，即主板+电池+小板的机构设计。其中，主板和小板通过FPC实现电连接。图1是现有技术智能手机的一个视角的整体结构的示意图。图2是现有技术智能手机的另一个视角的整体结构的示意图。
如图1、图2所示，智能手机的显示屏8和后盖(图中未示出)之间依次设置有中框3和电池4。主板1、小板2和电池4并列设置，并且主板1设置于电池4的上端，小板2设置于电池4的下端，主板1和小板2通过主FPC 3电连接。显示屏通过自带的屏幕FPC 6与主板1电连接。为了充分利用智能手机内部空间，主FPC 5设置于电池4和中框3之间，屏幕FPC 6设置于显示屏8和中框3之间。也就是说，主FPC 5和屏幕FPC 6分别设置于中框3相对的两侧。
进一步地，如图1所示，屏幕FPC 6位于中框3的上侧，主板1、小板2、电池4、主FPC 5位于中框3的下侧，并且主FPC 5从中框3和电池4之间穿过，以连接主板1和小板2。由于屏幕FPC 6和主板1位于中框3相对的两侧，为了实现二者的连接，可以在中框3上开设穿孔7，屏幕FPC 6的一端与显示屏8电连接，另一端穿过该穿孔7之后，与中框3下侧的主板1电连接。
由于主FPC 5和屏幕FPC 6均设置在智能手机的厚度方向，不可避免地增加了手机的整体厚度。如图1、图2所示，两个FPC和中框3在电池4和显示屏8之间存在重叠区域S，该重叠区域S的厚度为两个FPC加上中框3三者的厚度之和，该重叠区域S的存在成为整机的厚度的设计瓶颈。
重叠区域S靠近电池4的边缘，电池4的边缘内部设置有多个电极，如果在中框3上进行打孔设计，容易在中框3上产生毛刺，该毛刺容易刺破电池4，导致电池4内部的电极之间发生短路，影响电池4的安全性能。
也就是说，为了电池4的安全考虑，中框3在电池4的边缘处通常不允许进行打孔设计。此外，由于中框3的厚度也存在加工极限(例如，在当前的加工工艺下，中框的极限厚度为0.35毫米)，无法做到进一步减薄，由此对智能手机的轻薄化设计造成阻碍，不利于智能手机的轻薄化发展。
综上所述，本申请实施例通过对电子设备的内部结构进行改进，提供一种整机厚度较薄的电子设备，进而能够提高用户的使用体验。
本申请实施例提供一种电子设备，该电子设备可以是手机(例如是普通手机或者可折叠手机)、平板电脑、笔记本电脑、可穿戴设备等设备，但不限于此。
请参阅图3，图3为本申请实施例提供的电子设备100的整体结构示意图。作为示例而非限定，在本申请实施例中，电子设备100为手机，并且包括壳体10和显示屏20，显示屏20安装在壳体10上。电子设备100还包括设置于壳体10内部的电子元件(图中未示出)，电子元件包括电路板、处理器、摄像头、闪光灯、麦克风、电池等，但不限于此。
壳体10可以是为金属壳体，比如镁合金、不锈钢等金属。此外，还可以是塑胶壳体、玻璃壳体、陶瓷壳体等，但不限于此。壳体10包含边框、后盖等结构。
显示屏20作为电子设备100的前面板，与壳体10形成收容空间，用于容纳电子设备 100的电子元件或功能组件。显示屏20形成电子设备100的显示面，用于显示图像、文本等信息。显示屏20可以是发光二极管(light emitting diode,LED)显示屏、液晶(liquid crystal display,LCD)显示屏或者有机发光二极管(organic light-emitting diode,OLED)显示屏等，但不限于此。此外，显示屏20还可以是折叠屏(柔性屏)。
图4是本申请实施例提供的电子设备100的部分内部结构的连接示意图。图5是本申请实施例提供的电子设备100的一个视角的爆炸图。图6是本申请实施例提供的电子设备100的另一个视角的爆炸图。图7是本申请实施例提供的主板30的结构示意图。图8是本申请实施例提供的显示屏20的一个视角的结构示意图。
如图4-图8所示，本申请实施例提供的电子设备100包括：中框30、第一柔性电路板FPC 40、第二FPC 50以及电池60。第一FPC 40和第二FPC 50分别设置于中框30相对的两侧。
第一FPC 40和第二FPC 50在中框30的投影具有第一重叠区域s1，第一重叠区域s1位于电池60在中框30的投影的内部，并且远离电池60的边缘。
中框30上开设有第一通孔31，第一重叠区域s1位于第一通孔31内。
柔性电路板(flexible printed circuit，FPC)简称软板，又称“柔性线路板”或“软性线路板、挠性线路板、软性电路板、挠性电路板”。柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。
在本申请中，柔性电路板也包括软硬结构板，此时局部区域可以为硬性电路板。
在本申请实施例中，电子设备100的内部设置有中框30，中框30将电子设备100的内部容纳空间分隔成两个部分，即显示屏20和中框30之间的容纳空间，以及中框30和后盖之间的容纳空间，第一FPC 40设置于显示屏20和中框30之间的容纳空间内，第二FPC 50设置于中框30和后盖之间的容纳空间内，即第一FPC 40和第二FPC 50分别设置于中框30相对的两侧。
进一步地，电子设备100还包括电池60，电池60设置于中框30和后盖之间的容纳空间内，第二FPC 50位于中框30和电池60之间。
如图4所示，第一FPC 40和第二FPC 50具有重叠(或者交汇)的区域，更具体地，第一FPC 40和第二FPC 50在中框30的投影具有第一重叠区域s1，并且该第一重叠区域s1位于电池60在中框30的投影的内部，并且远离电池60的边缘。
如图4-图7所示，在本申请实施例中，中框30上开设有第一通孔31，该第一通孔31贯穿中框30的两侧，第一重叠区域s1位于第一通孔31内。也就是说，第一通孔31和第一重叠区域s1的形状、大小相互适配。
可选地，第一通孔31和第一重叠区域s1的形状相同，并且大小也相同，此时，第一通孔31和第一重叠区域s1的轮廓完全重合。
如图4-图7所示，在本申请实施例中，第一通孔31和第一重叠区域s1均为矩形。
可选地，第一通孔31大于第一重叠区域s1，第一重叠区域s1完全位于第一通孔31内。此时，第一通孔31的形状和第一重叠区域s1的形状可以相同，也可以不同，本申请对此不做限定。
例如，第一通孔31和第一重叠区域s1的形状均为矩形，并且第一通孔31大于第一重叠区域s1。
再例如，第一重叠区域s1的形状均为矩形，第一通孔31的形状为圆形、椭圆形、梯形、菱形或者不规则形状等中的任意一种，第一通孔31的面积大于第一重叠区域s1，并且第一重叠区域s1完全位于第一通孔31内。
根据本申请实施例提供的电子设备100，通过在中框30上开设第一通孔31，该第一通孔31的位置与第一FPC 40和第二FPC 50的重叠区域相对应，并且该重叠区域的投影完全位于第一通孔31内，进而使得在该重叠区域的厚度只有第一FPC 40和第二FPC 50(例如，FPC能够柔性变形，二者可以向第一通孔31内进行靠拢)。也就是说，通过在两个FPC的重叠区域处的中框30进行开孔设计，使得在该重叠区域仅有两个元件重叠。此外，电池60投影内的其他任意位置处也都只有两个元件(第一FPC 40和中框30，或者第二FPC 50和中框30)重叠，相比于常规方案(两个FPC加上中框三者的厚度之和构成整机厚度瓶颈)，本申请实施例提供的电子设备100在厚度方向上少一个元件，有利于降低电子设备100的整机厚度(可降低0.1～0.2毫米，甚至更多)，从而能够实现整机厚度的减薄，使得电子设备100具有较佳的用户体验感。
进一步地，本申请实施例提供的电子设备100的两个FPC的重叠区域被构造在电池60在中框30的投影的内部，并且远离电池60的边缘，使得第一通孔31的位置能够远离电池60的边缘，从而使得中框30能够对电池60进行更好的支撑保护，因对中框30进行开孔设计可能产生的毛刺不会对相对脆弱的电池60的边缘位置进行损坏，能够保障电池60的安全使用性能，进而有利于提高电子设备100的整机性能。
应理解，在本申请实施例中，第一通孔31大于该重叠区域，进而能够使得该重叠区域的投影能够完全位于第一通孔内，但是，该第一通孔31不应设置过大，避免对中框30的支撑性能造成影响，而且该第一通孔31应当尽量远离电池60的边缘，从而能够保障电池60的安全使用性能。
值得一提的是，本申请实施例提供的电子设备100不限于前述三段式架构设计，其他架构设计也可适用。
在本申请实施例中，第一FPC 40和第二FPC 50分别设置于中框30相对的两侧。在其他实施方式中，第一FPC 40和第二FPC 50也可以位于中框30的同侧，例如同时位于中框30与显示屏20之间，或者同时位于中框30与电池60之间，本申请对此不作限定。
在这里，重叠区域(即前述的第一重叠区域s1)在电池60在中框30的投影的内部，并且远离电池60的边缘，其中，远离可以是不靠近电池60的边缘，并且根据该重叠区域确定的第一通孔31的开设位置也不靠近电池60的边缘，从而不会对电池60的边缘(例如，内部的电极)造成不良影响。
本申请实施例对如何将第一FPC和第二FPC的重叠区域构造在电池60的内部并且远离电池60的边缘不作限定，可以根据具体需求任意对第一FPC和第二FPC的设置位置(例如走向)进行布置，以达到上述目的，本申请对此不做限定。
在本申请实施例中，通过在第一FPC上增加开孔来避免两个FPC在电池60的边缘重叠，并且将重叠的位置(即前述的第一重叠区域s1)转移到电池60投影的内部，并且远离电池60的边缘。
具体地，如图4-图8所示，在本申请实施例中，第一FPC 40上开设有避让孔41，该避让孔41为通孔，第一FPC 40通过避让孔41避让第二FPC 50，进而使得第一重叠区域 s1远离电池60的边缘。
此时，避让孔41在中框30的投影与第一重叠区域s1的投影相连接，第二FPC 50通过该避让孔41以后，与第一FPC 40相互重叠，以形成所述第一重叠区域s1。
避让孔41的主要目的为在距离电池60边缘一定范围内避让第二FPC 50，为了实现避让作用，避让孔41在中框30的投影应当完全覆盖相对一侧的第二FPC 50的投影，此时，避让孔41的宽度应当大于或者等于第二FPC 50的宽度。
可选地，第一FPC 40可以为任意形状，例如矩形、菱形、梯形、圆形或者任意不规则形状等，本申请对此不做限定。
在本申请实施例中，第一FPC 40为电子设备100的屏幕FPC，第二FPC 50为电子设备100的主FPC。
具体地，如图4-图8所示，电子设备100还包括主板70和小板80，第一FPC 40可以是屏幕FPC，此时，第一FPC 40的一端与显示屏20电连接(第一FPC 40可以看作显示模组的一部分)，第一FPC 40的另一端穿过中框30上开设的第二通孔32之后与主板70电连接。
第二FPC 50可以为电子设备100的主FPC，此时，第二FPC 50的一端与主板70电连接，另一端与小板80电连接。此时，第二FPC 50可以位于中框30和电池60之间。
可选地，第一FPC 40通过焊接与显示屏20以及主板70电连接，第二FPC 50通过焊接与主板70以及小板80电连接。
可选地，第一FPC 40通过连接器与显示屏20以及主板70电连接，第二FPC 50通过连接器与主板70以及小板80电连接。
例如，该连接器可以是零插入力(zero insertion force，ZIF)连接器或者板对板(board to board，BTB)连接器。
可选地，第一FPC 40可以为常规的FPC，也可以为覆晶薄膜(chip on flex或chip on film，COF)或者覆晶塑料(chip on plastic，COP)等特殊软板，本申请对此不做限定。
可选地，主板70上可以设置电子设备100的主要电路、芯片、传感器、以及接口和插件等，小板80上可以设置电子设备100的USB接口、天线触点和射频接口等。
可选地，在其他实施方式中，第一FPC 40可以是前述屏幕FPC和主FPC以外的实现其他部件电连接的FPC，第二FPC 50也可以是前述屏幕FPC和主FPC以外的实现其他部件电连接的FPC，本申请对此不做限定。
可选地，电池60可以为锂电池或者镍镉电池，本申请对此不做限定。
如图5-图7所示，电子设备100还包括边框90，边框90环绕设置于中框30的外周，并且与中框30固定连接。边框90和中框30可以通过一体成型工艺制成。
如图5-图7所示，中框30的两侧面分别设置有第一凹槽33和第二凹槽34，第一FPC 40设置于第一凹槽33内，第二FPC 50设置于第二凹槽34内。
具体地，可以在中框30的两侧面上分别设置第一凹槽33和第二凹槽34，第一凹槽33的形状与第一FPC 40的形状一致，第一FPC 40对应嵌入第一凹槽33内。
可选地，第一凹槽33的深度与第一FPC 40的高度相互适配，例如，第一凹槽33的深度可以大于、小于或者等于第一FPC 40的高度。
进一步地，前述的第二通孔32设置于第一凹槽33的末端，第一FPC 40的末端穿过 该第二通孔32与中框30另一侧的主板70电连接。
第二凹槽34的形状与第二FPC 50的形状一致，第二FPC 50对应嵌入第二凹槽34内。
可选地，第二凹槽34的深度与第二FPC 50的高度相互适配，例如，第二凹槽34的深度可以大于、小于或者等于第二FPC 50的高度。
本申请实施例通过在中框30上开设凹槽来容纳FPC，一方面能够实现对FPC更好的定位以及固定作用，另一方面也有利于进一步减薄电子设备100的厚度。
图9是本申请实施例提供的电子设备100的部分内部结构的透视图。图10是图9中A-A方向的剖视图。图11是图9中B-B方向的剖视图。图12是图9中C-C方向的剖视图。
如图5-图7、图9、图12所示，在本申请实施例中，中框30包括突出部37，突出部37的前端嵌入避让孔41内，突出部37的后端形成容纳第二FPC 50的避让空间38。
具体地，突出部37的形状与避让孔41的形状、大小相互适配，突出部37嵌入避让孔41内，突出部37的前端表面可以和第一FPC 40远离中框30的表面相互平齐。第二FPC 50被容纳于相对侧的避让空间38内。
本申请实施例通过设置突出部37和避让空间38，可以使得在避让孔41内的区域同样仅有两个元件(中框30和第二FPC 50)的厚度，有利于降低电子设备100的整机厚度，从而能够实现整机厚度的减薄，使得电子设备100具有较佳的用户体验感。
可选地，突出部37的前端可以向避让孔41内进行延伸，而不嵌入避让孔41内，例如突出部37的前端也可以临近(靠近)避让孔进行设置。此时同样能够起到减薄效果。
在本申请实施例中，中框30包括突出部37，该突出部37相对于第一凹槽33的底壁向外突出，相对于中框30的其他部分可以突出也可以不突出，即突出部37的顶端高度可以高于、等于、低于中框30的其他部分的高度，本申请对此不做限定。
如图5-图7，图10-图12所示，第一FPC 40通过第一背胶层42固定贴合于电子设备100的显示屏20的内表面上，第二FPC 50通过第二背胶层51固定贴合于中框30上。电池60可以通过第三背胶层61固定贴合于中框30之上。
进一步地，中框30位于第二凹槽34内还开设有第三凹槽35，第二背胶层42设置于所述第三凹槽35内。
可选地，第二背胶层51可以设置多个，相对应的将第三凹槽35也设置多个，本申请对此不做限定。例如，如图5所示，可以将第二背胶层51和第三凹槽35均对应设置三个，并且相互之间间隔开，进而能够对第一FPC 40进行可靠固定。
图13是本申请实施例提供的电子设备100的另一例的部分内部结构的连接示意图。图14是图13中D-D方向的剖视图。
如图13，图14所示，第一FPC 40和第二FPC 50在中框30的投影具有第二重叠区域s2，第一FPC 40还包括减薄区43，该减薄区43的厚度小于第一FPC 40其他区域的厚度，减薄区43在中框30的投影覆盖第二重叠区域s2。
在前述实施例中，第一FPC 40上开设有避让孔41，而在本实施例中，第一FPC 40还包括减薄区43，该减薄区43与前述的避让孔41相对应，前述实施例的避让孔41为通孔，该避让孔41也可以为盲孔(即第一FPC 40不打穿)，以此形成在本实施例中的减薄区43。也就是说，第一FPC 40只挖除部分厚度，不挖穿，实现减薄一定厚度的目的。
该减薄区43的形状、大小与前述的避让孔41相类似，减薄区43在中框30的投影覆盖第二重叠区域s2，也即覆盖对应位置处的第二FPC 50。
进一步地，该第二重叠区域s2与第一重叠区域s1相连接，也就是说，此时通过设置第二重叠区域s2将第一重叠区域s1转移到电池60投影的内部，并且远离电池60的边缘。
图15是图13中第一FPC 40的一个示例的结构示意图。
如图15所示，第一FPC 40包括层叠设置的FPC主体40a和功能膜层40b，可以对FPC主体40a和/或功能膜层40b进行减薄处理以形成减薄区43。
本申请对如何形成该减薄区43不做限定，在本实施例中，可以对功能膜层40b进行减薄处理以形成减薄区43。此时，可以将FPC主体40a层叠覆盖的至少一层功能膜层40b的部分或者全部挖除，以形成该减薄区43。
可选地，该功能膜层40b可以包括防护膜层(绝缘麦拉)。例如，该防护膜层可以为聚酰亚胺薄膜(polyimide film，PI)。
可选地，可以在FPC主体40a上仅覆盖一层防护膜层。
可选地，该功能膜层40b还可以包括屏蔽膜层，该屏蔽膜层可以为金属(例如铜)层。
可选地，可以在FPC主体40a上依次覆盖防护膜层、屏蔽膜层和防护膜层。
可选地，FPC主体40a可以包括至少一个导电层。
例如，FPC主体40a可以为单层板、双层板或者多层板(例如3、4、5层等)，本申请对此不作限定。
图16是图13中第一FPC 40的另一个示例的结构示意图。
如图16所示，相对于前述图15所示的实施例，在本实施例中，通过对FPC主体40a进行减薄处理以形成减薄区43。此时，可以先对FPC主体40a进行减薄处理之后，在覆盖功能膜层40b。
可选地，可以挖除FPC主体40a的至少一个导电层中的部分或者全部，之后在覆盖功能膜层40b，以形成减薄区43。
例如，FPC主体40a可以为多层板，可以挖除其中的部分或者全部(比如去除其中的一层)，之后在覆盖功能膜层40b，以形成减薄区43。
图17是本申请实施例提供的电子设备100的另一例的一个视角的爆炸图。图18是本申请实施例提供的电子设备100的另一例的另一个视角的爆炸图。
相对于前述图3-图16所示的电子设备100，在实施例中，第一FPC 40和第二FPC 50位于中框30的同一侧，即如图17、图18所示，在本实施例中，第一FPC 40和第二FPC 50均位于中框30和显示屏20之间。
可选地，在其他实施方式中，第一FPC 40和第二FPC 50也可以位于中框30与电池60之间，本申请对此不作限定。
此时，第二FPC 50位于中框30和第一FPC 40之间，可以在第二FPC 50上设置弯折部52，该弯折部52的后侧内凹以形成容纳空间，该容纳空间容纳第一FPC 40，该弯折部52的前侧向第一通孔31内突出，例如可以伸入/嵌入第一通孔31内，从而能够实现减薄目的。
对应地，可以在中框30的同一侧设置有第一凹槽33和第二凹槽34，第一FPC 40设置于第一凹槽33内，第二FPC 50设置于第二凹槽34内。在第一凹槽33和第二凹槽34 的交汇处开设该第一通孔31。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种电子设备，其特征在于，包括：中框(30)、第一FPC(40)、第二FPC(50)以及电池(60)；所述第一FPC(40)和所述第二FPC(50)在所述中框(30)的投影具有第一重叠区域(s1)，所述第一重叠区域(s1)位于所述电池(60)在所述中框(30)的投影的内部，并且远离所述电池(60)的边缘；所述中框(30)上开设有第一通孔(31)，所述第一重叠区域(s1)位于所述第一通孔(31)内。
  2. 根据权利要求1所述的电子设备，其特征在于，所述第一FPC(40)上开设有避让孔(41)，所述第一FPC(40)通过所述避让孔(41)避让所述第二FPC(50)，进而使得所述第一重叠区域(s1)远离所述电池(60)的边缘。
  3. 根据权利要求2所述的电子设备，其特征在于，所述第一FPC(40)和所述第二FPC(50)分别设置于所述中框(30)相对的两侧。
  4. 根据权利要求3所述的电子设备，其特征在于，所述中框(30)包括突出部(37)，所述突出部(37)的前端向所述避让孔(41)内进行延伸，所述突出部(37)的后端形成容纳所述第二FPC(50)的避让空间(38)。
  5. 根据权利要求1所述的电子设备，其特征在于，所述第一FPC(40)和所述第二FPC(50)在所述中框(30)的投影具有第二重叠区域(s2)，所述第一FPC(40)还包括减薄区(43)，所述减薄区(43)的厚度小于所述第一FPC(40)其他区域的厚度，所述减薄区(43)在所述中框(30)的投影覆盖所述第二重叠区域(s2)。
  6. 根据权利要求5所述的电子设备，其特征在于，所述第一重叠区域(s1)和所述第二重叠区域(s2)相连接。
  7. 根据权利要求5或6所述的电子设备，其特征在于，所述第一FPC(40)包括层叠设置的FPC主体(40a)和功能膜层(40b)，对所述FPC主体(40a)和/或功能膜层(40b)进行减薄处理以形成所述减薄区(43)。
  8. 根据权利要求7所述的电子设备，其特征在于，所述功能膜层(40b)包括防护膜层和屏蔽膜层。
  9. 根据权利要求3所述的电子设备，其特征在于，所述中框(30)的两侧面分别设置有第一凹槽(33)和第二凹槽(34)，所述第一FPC(40)设置于所述第一凹槽(33)内，所述第二FPC(50)设置于所述第二凹槽(34)内。
  10. 根据权利要求9所述的电子设备，其特征在于，所述第一FPC(40)为所述电子设备的屏幕FPC，所述第二FPC(50)为所述电子设备的主FPC。
  11. 根据权利要求10所述的电子设备，其特征在于，所述第一FPC(40)通过第一背胶层(42)固定贴合于所述电子设备的显示屏的内表面上，所述第二FPC(50)通过第二背胶层(51)固定贴合于所述中框(30)上。
  12. 根据权利要求11所述的电子设备，其特征在于，所述中框(30)位于所述第二凹槽(34)内还开设有第三凹槽(35)，所述第二背胶层(51)设置于所述第三凹槽(35)内。
  13. 根据权利要求10-12中任一项所述的电子设备，其特征在于，所述第一FPC(40)穿过所述中框(30)上开设的第二通孔(32)与所述电子设备的主板电连接。
PCT/CN2021/115288 2020-09-30 2021-08-30 一种电子设备 Ceased WO2022068497A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202180013932.8A CN116076068A (zh) 2020-09-30 2021-08-30 一种电子设备
EP21874158.5A EP4075768B1 (en) 2020-09-30 2021-08-30 Electronic device
US17/794,218 US12401735B2 (en) 2020-09-30 2021-08-30 Electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202022217809.3 2020-09-30
CN202022217809.3U CN214045690U (zh) 2020-09-30 2020-09-30 一种电子设备

Publications (1)

Publication Number Publication Date
WO2022068497A1 true WO2022068497A1 (zh) 2022-04-07

Family

ID=77351862

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/115288 Ceased WO2022068497A1 (zh) 2020-09-30 2021-08-30 一种电子设备

Country Status (4)

Country Link
US (1) US12401735B2 (zh)
EP (1) EP4075768B1 (zh)
CN (2) CN214045690U (zh)
WO (1) WO2022068497A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114827325A (zh) * 2022-06-23 2022-07-29 荣耀终端有限公司 电子设备
CN115175454A (zh) * 2022-09-08 2022-10-11 荣耀终端有限公司 一种电子设备
CN117641806A (zh) * 2022-08-11 2024-03-01 北京小米移动软件有限公司 可折叠的终端设备

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020103644A1 (zh) * 2018-11-22 2020-05-28 宁波舜宇光电信息有限公司 线路板、线路板拼版、潜望式摄像模组及其应用
CN214045690U (zh) 2020-09-30 2021-08-24 荣耀终端有限公司 一种电子设备
KR102501292B1 (ko) * 2021-08-04 2023-02-17 (주)유티아이 플렉시블 커버 윈도우
US12335422B2 (en) * 2022-01-10 2025-06-17 Apple Inc. Handheld electronic device
EP4554194A4 (en) * 2022-08-05 2025-07-02 Samsung Electronics Co Ltd MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE CONTAINING SAME
CN219164596U (zh) * 2022-12-28 2023-06-09 荣耀终端有限公司 电子设备
CN118283149A (zh) * 2022-12-29 2024-07-02 荣耀终端有限公司 终端设备
CN119363859A (zh) * 2023-05-26 2025-01-24 荣耀终端有限公司 电子设备
CN120980160A (zh) * 2024-05-16 2025-11-18 华为技术有限公司 一种电池后盖、终端壳体以及终端

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2293528A1 (en) * 2009-09-02 2011-03-09 HTC Corporation Electronic device and connecting mechanism thereof
EP2876868A1 (en) * 2013-11-25 2015-05-27 BlackBerry Limited Handheld device and method of manufacture thereof
CN108600425A (zh) * 2018-03-27 2018-09-28 广东欧珀移动通信有限公司 显示屏组件及电子设备
CN109618030A (zh) * 2018-12-20 2019-04-12 维沃移动通信有限公司 一种终端设备
CN214045690U (zh) * 2020-09-30 2021-08-24 荣耀终端有限公司 一种电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101412755B1 (ko) * 2008-01-21 2014-07-01 삼성디스플레이 주식회사 표시 장치
KR102550324B1 (ko) * 2018-08-01 2023-07-03 삼성디스플레이 주식회사 표시 장치
KR102690272B1 (ko) * 2019-02-19 2024-08-01 삼성전자 주식회사 듀얼 디스플레이를 포함하는 전자 장치
KR102870716B1 (ko) * 2020-09-15 2025-10-15 삼성전자주식회사 복수의 fpcb를 갖는 디스플레이 모듈을 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2293528A1 (en) * 2009-09-02 2011-03-09 HTC Corporation Electronic device and connecting mechanism thereof
EP2876868A1 (en) * 2013-11-25 2015-05-27 BlackBerry Limited Handheld device and method of manufacture thereof
CN108600425A (zh) * 2018-03-27 2018-09-28 广东欧珀移动通信有限公司 显示屏组件及电子设备
CN109618030A (zh) * 2018-12-20 2019-04-12 维沃移动通信有限公司 一种终端设备
CN214045690U (zh) * 2020-09-30 2021-08-24 荣耀终端有限公司 一种电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4075768A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114827325A (zh) * 2022-06-23 2022-07-29 荣耀终端有限公司 电子设备
CN117641806A (zh) * 2022-08-11 2024-03-01 北京小米移动软件有限公司 可折叠的终端设备
CN115175454A (zh) * 2022-09-08 2022-10-11 荣耀终端有限公司 一种电子设备
CN115175454B (zh) * 2022-09-08 2023-01-20 荣耀终端有限公司 一种电子设备

Also Published As

Publication number Publication date
CN214045690U (zh) 2021-08-24
EP4075768A1 (en) 2022-10-19
EP4075768A4 (en) 2023-08-16
EP4075768B1 (en) 2024-05-15
CN116076068A (zh) 2023-05-05
US12401735B2 (en) 2025-08-26
US20230224394A1 (en) 2023-07-13

Similar Documents

Publication Publication Date Title
WO2022068497A1 (zh) 一种电子设备
US9746882B2 (en) Electronic device with curved display module
US11871541B2 (en) Electronic device including vapor chamber
CN108539369B (zh) 天线组件、天线组件的制作方法及电子设备
US12063826B2 (en) Display device and electronic apparatus
CN108600425B (zh) 显示屏组件及电子设备
CN107046588B (zh) 显示组件及移动终端
CN116075045B (zh) 电子设备
US7813138B2 (en) Electronic device
CN108735115A (zh) 显示屏组件及电子设备
CN218163139U (zh) 电子设备
JP5296562B2 (ja) 携帯電子機器
CN108666739A (zh) 天线组件、壳体组件及电子设备
CN107623984A (zh) 柔性电路板及其制造方法、电子设备
CN108539373B (zh) 壳体组件、天线组件、天线组件的制作方法及电子设备
US20230246395A1 (en) Electronic device including shielding connector structure
CN108541156B (zh) 壳体组件、天线组件、电子设备及加工方法
CN219514141U (zh) 一种电子设备
CN107257514A (zh) 麦克风组件和电子设备
CN107148208B (zh) 屏蔽盖、基板组件和电子设备
CN108511875A (zh) 壳体组件、天线组件、天线组件的制作方法以及电子设备
CN108039573B (zh) 天线组件以及电子设备
CN106982524A (zh) 显示组件及移动终端
CN112153185A (zh) 一种摄像头组件及电子设备
EP4525417A1 (en) Folding electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21874158

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021874158

Country of ref document: EP

Effective date: 20220714

NENP Non-entry into the national phase

Ref country code: DE

WWG Wipo information: grant in national office

Ref document number: 17794218

Country of ref document: US