WO2022083271A1 - 显示屏、电子装置和制造方法 - Google Patents

显示屏、电子装置和制造方法 Download PDF

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Publication number
WO2022083271A1
WO2022083271A1 PCT/CN2021/114257 CN2021114257W WO2022083271A1 WO 2022083271 A1 WO2022083271 A1 WO 2022083271A1 CN 2021114257 W CN2021114257 W CN 2021114257W WO 2022083271 A1 WO2022083271 A1 WO 2022083271A1
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WIPO (PCT)
Prior art keywords
light
emitting unit
display screen
area
driving circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/114257
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English (en)
French (fr)
Inventor
张健民
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to EP21881690.8A priority Critical patent/EP4231356A4/en
Publication of WO2022083271A1 publication Critical patent/WO2022083271A1/zh
Priority to US18/304,823 priority patent/US12604635B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/70—OLEDs integrated with inorganic light-emitting elements, e.g. with inorganic electroluminescent elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the present application relates to the field of mobile phone equipment, and more particularly, to a display screen, an electronic device, a method for manufacturing a display screen, and a method for manufacturing a pixel unit.
  • full-screen mobile phones have become mainstream mobile phones.
  • light-sensitive devices such as a fingerprint sensor and a camera can be arranged below the display screen, so that the mobile phone can achieve a full-screen effect.
  • the method of reducing the pixel density of the part is generally adopted.
  • the overall display effect of the display screen is affected.
  • Embodiments of the present application provide a display screen, an electronic device, and a method for manufacturing the display screen.
  • a display screen includes a substrate, a plurality of first pixel units and a plurality of second pixel units.
  • the substrate includes a first region and a second region.
  • Each of the first pixel units includes a first light-emitting unit and a first driving circuit for driving the first light-emitting unit to emit light.
  • the first light-emitting unit is disposed on the first driving circuit and is connected with the first light-emitting unit.
  • the first driving circuit is also disposed in the first region.
  • Each of the second pixel units includes a second light-emitting unit, and the second light-emitting unit is disposed in the second region.
  • the second driving circuit is used for driving the second light emitting unit to emit light, and the second light emitting unit includes an organic light emitting diode.
  • the projected area of the first light-emitting unit on the substrate is smaller than the projected area of the second light-emitting unit on the substrate.
  • An electronic device includes the display screen of the above embodiment and a photosensitive element, and the photosensitive element is disposed below the first display area.
  • a method for manufacturing a display screen includes: providing a substrate, where the substrate includes a first region and a second region.
  • the first pixel units include a first light-emitting unit and a first driving circuit for driving the first light-emitting unit to emit light, the first light-emitting unit is arranged in the first driving circuit superior.
  • the first light-emitting unit and the first driving circuit are transferred and mounted in the first region together.
  • a plurality of second pixel units are arranged on the second area, each of the second pixel units includes a second light-emitting unit, a second driving circuit is used to drive the second light-emitting unit to emit light, and the first light-emitting unit
  • the projected area on the substrate is smaller than the projected area of the second light emitting unit on the substrate.
  • the plurality of second pixel units are encapsulated such that the plurality of second pixel units are encapsulated within an encapsulation layer.
  • a method for manufacturing a display screen includes: providing a substrate, where the substrate includes a first region and a second region.
  • a first drive circuit is provided.
  • a first light-emitting unit is formed by growing on the first driving circuit.
  • the first light-emitting unit and the first driving circuit are transferred and mounted in the first region together.
  • a plurality of second pixel units are arranged on the second area, each of the second pixel units includes a second light-emitting unit, a second driving circuit is used to drive the second light-emitting unit to emit light, and the first light-emitting unit
  • the projected area on the substrate is smaller than the projected area of the second light emitting unit on the substrate.
  • a method for manufacturing a pixel unit according to an embodiment of the present application includes: providing a first wafer.
  • the first driver circuit is formed on the first wafer.
  • a plurality of first light-emitting units arranged at intervals are formed on the first driving circuit.
  • the first wafer is diced to obtain first pixel unit monomers.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Fig. 2 is the partial structure schematic diagram of II part in the electronic device of Fig. 1;
  • FIG. 3 is a schematic diagram of a stacked structure of a display screen according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of the cooperation of a display screen and a photosensitive element according to an embodiment of the present application
  • FIG. 5 is a schematic diagram of an array of micro light-emitting diodes according to an embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional view of an electrical connection line and a light absorbing layer according to an embodiment of the present application
  • FIG. 7 is a partial circuit schematic diagram of a first driving circuit according to an embodiment of the present application.
  • FIG. 8 is a schematic flowchart of a method for manufacturing a display screen according to an embodiment of the present application.
  • FIG. 9 is a schematic process diagram of a method for manufacturing a display screen according to an embodiment of the present application.
  • FIG. 10 is another schematic flow chart of the manufacturing method of the display screen according to the embodiment of the present application.
  • FIG. 11 is another schematic flowchart of a method for manufacturing a display screen according to an embodiment of the present application.
  • FIG. 12 is another schematic flowchart of a method for manufacturing a display screen according to an embodiment of the present application.
  • FIG. 13 is another schematic flowchart of the manufacturing method of the display screen according to the embodiment of the present application.
  • a first feature "on” or “under” a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
  • an embodiment of the present application provides a display screen 100 including a substrate 200 , a plurality of first pixel units 300 and a plurality of second pixel units 400 .
  • the substrate 200 includes a first region 210 and a second region 220 .
  • Each first pixel unit 300 includes a first light-emitting unit 330 and a first driving circuit 320, the first driving circuit 320 is configured to drive the first light-emitting unit 330 to emit light, the first light-emitting unit 330 is disposed on the first driving circuit 320, and It is provided in the first region 210 together with the first driving circuit 320 .
  • the pixel density of the first display area 310 is the same as the pixel density of the second display area 410 .
  • the lifetime of the first light-emitting unit 330 is longer than the lifetime of the second light-emitting unit 401 .
  • each first light-emitting unit 330 includes micro-LEDs of three colors, namely red micro-LEDs 331 , green micro-LEDs 332 and blue micro-LEDs 333 . In this way, the display screen 100 can generate various color lights.
  • the projection of the first light emitting unit 330 on the substrate 200 covers the projection of the first driving circuit 320 on the substrate 200 .
  • the display screen 100 includes electrical connection lines 211 disposed on the first region 210 and a light absorption layer 212 , and the light absorption layer 212 is covered on the electrical connection lines 211 .
  • a plurality of first pixel units 300 are arranged in an array, and a vertical void area 340 is formed between the first pixel units 300 in adjacent columns, and the display screen 100 further includes electrical The connecting line 211, the electrical connecting line 211 is arranged on the first area 210 and extends longitudinally along the column direction of the first pixel unit 300, the vertical electrical connecting line 211 is connected to the first driving circuit 320, and the vertical electrical connecting line 211 is arranged in any adjacent within one of the two longitudinal void regions 340 .
  • a plurality of first pixel units 300 are arranged in an array, and a horizontal void area 340 is formed between the first pixel units 300 in adjacent rows, and the display screen 100 It also includes a lateral electrical connection line 211 arranged on the first region 210 and extending along the row direction of the first pixel unit 300, the lateral electrical connection line 211 is connected to the first driving circuit 320, and any two adjacent lateral void regions A lateral electrical connection line 211 is disposed in one of the 340 , and the lateral electrical connection 211 is disposed at the edge of the lateral void area 340 .
  • the first driving circuit 320 includes a 2T1C driving circuit.
  • an electronic device 1000 includes the display screen 100 of any of the above-mentioned embodiments and a photosensitive element 500 , and the photosensitive element 500 is disposed below the first display area 310 .
  • a method for manufacturing a display screen 100 includes:
  • the substrate 200 includes a first area 210 and a second area 220;
  • the first pixel unit 300 includes a first light-emitting unit 330 and a first driving circuit 320 for driving the first light-emitting unit 330 to emit light.
  • the first light-emitting unit 330 is disposed on the first driving circuit 320 ;
  • a plurality of second pixel units 400 are arranged on the second area 220, each second pixel unit 400 includes a second light-emitting unit 401, the second driving circuit 420 is used to drive the second light-emitting unit 401 to emit light, and the first light-emitting unit 330 is in The projected area on the substrate 200 is smaller than the projected area of the second light-emitting unit 401 on the substrate 200;
  • the plurality of second pixel units 400 are encapsulated such that the plurality of second pixel units 400 are encapsulated in the encapsulation layer.
  • a method for manufacturing a display screen 100 according to an embodiment of the present application further includes:
  • a polarizer is attached to the encapsulation layer.
  • the first pixel unit 300 is fabricated through the following steps:
  • first light-emitting units 330 arranged at intervals on the first driving circuit 320;
  • the first wafer 301 is cut to obtain a single first pixel unit 300 .
  • a plurality of first light-emitting units 330 arranged at intervals are formed on the first driving circuit 320, including:
  • a plurality of first light emitting units 330 are formed on the second wafer 302 .
  • a plurality of first light-emitting units 330 are formed on the second wafer 302, including:
  • a plurality of intermediate bodies 303 are formed on the second wafer 302, and each intermediate body 303 includes a plurality of miniature light-emitting diodes of the same color;
  • the first light emitting unit 330 is obtained by performing color conversion on a plurality of micro light emitting diodes of the same color, wherein the first light emitting unit 330 includes red micro light emitting diodes 331 , green micro light emitting diodes 332 and blue micro light emitting diodes 333 .
  • a method for manufacturing a display screen 100 includes:
  • the substrate 200 includes a first area 210 and a second area 220;
  • a first light-emitting unit 330 is formed by growing on the first driving circuit 320;
  • a plurality of second pixel units 400 are arranged on the second area 220, each second pixel unit 400 includes a second light-emitting unit 401, the second driving circuit 420 is used to drive the second light-emitting unit 401 to emit light, and the first light-emitting unit 330 is in The projected area on the substrate 200 is smaller than the projected area of the second light emitting unit 401 on the substrate 200 .
  • an embodiment of the present application provides a display screen 100 including a substrate 200 , a plurality of first pixel units 300 and a plurality of second pixel units 400 .
  • the substrate 200 includes a first region 210 and a second region 220 .
  • Each first pixel unit 300 includes a first light-emitting unit 330 and a first driving circuit 320, the first driving circuit 320 is configured to drive the first light-emitting unit 330 to emit light, the first light-emitting unit 330 is disposed on the first driving circuit 320, and It is provided in the first region 210 together with the first driving circuit 320 .
  • Each of the second pixel units 400 includes a second light-emitting unit 401 , and the second light-emitting unit 402 is disposed in the second region 220 .
  • the second driving circuit 420 is used for driving the second light-emitting unit 401 to emit light.
  • the projected area of the first light-emitting unit 330 on the substrate 200 is smaller than the projected area of the second light-emitting unit 401 on the substrate 200 .
  • the first light-emitting unit 330 is disposed on the first driving circuit 320 and is disposed in the first area 210 together with the first driving circuit 320 , so as to avoid the entire first area 210
  • the driving circuit is laid to prevent the overall laid driving circuit from blocking the light; in addition, the projected area of the first light-emitting unit 330 on the substrate 200 is smaller than the projected area of the second light-emitting unit 401 on the substrate 200, so that the first light-emitting unit 330 The occupied area is small, and the light transmittance of the area of the display screen 100 corresponding to the first area 210 is improved on the basis of ensuring the display effect of the display screen 100 .
  • the first light-emitting unit 330 includes a micro light-emitting diode (MicroLight-Emitting Diode, MicroLED), and the second light-emitting unit 401 includes an organic light-emitting diode (OrganicLight-Emitting Diode, OLED) 430 .
  • MicroLED MicroLight-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • the display screen adopts a low pixel density (PPI) design in the camera area under the screen to improve transmittance and appropriately reduce diffraction.
  • PPI pixel density
  • the display screen 100 can be divided into a first display area 310 and a second display area 410 , and the first display area 310 includes a first area 210 and a first pixel unit 300 .
  • the second display area 310 includes the second area 220 , the second pixel unit 400 and the second driving circuit 420 .
  • the first display area 310 is arranged corresponding to the first area 210
  • the second display area 410 is arranged corresponding to the second area 220 .
  • the first light emitting unit 330 in the first display area 310 uses a micro light emitting diode display
  • the second light emitting unit 401 in the second display area 410 uses an organic light emitting diode 430 display technology.
  • the first display area 310 takes advantage of the inorganic ultra-high display life of micro light-emitting diodes to overcome the risks of low life and screen burn-in caused by low PPI highlighting in the camera area under the screen.
  • the miniature light-emitting diode has a small area, low PPI, and high light transmittance, which significantly increases the amount of light entering the camera area under the screen, thereby improving the imaging quality of the camera.
  • the first display area 310 and the second display area 410 can be displayed in cooperation, so that the display screen 100 can display the complete content.
  • the light transmittance of the first display area 310 is greater than the light transmittance of the second display area 410
  • the first display area 310 can be used for optical sensors to transmit signals
  • the first display area 310 displays images through micro light-emitting diodes
  • the second display area 310 The display area 410 displays images through the organic light emitting diodes 430 , because the luminous intensity of the micro light emitting diodes is much greater than that of the organic light emitting diodes 430
  • the maximum brightness of the first display area 310 is not significantly lower than the maximum brightness of the second display area 410
  • the maximum brightness of the first display area 310 and the second display area 410 are similar, and the uniformity of the first display area 310 and the second display area 410 is good.
  • the first display area 310 and the second display area 410 in the embodiment of the present application may be connected closely adjacent to each other. Both the first display area 310 and the second display area 410 may be used to display text or images. For example, the first display area 310 and the second display area 410 may jointly display the same photo.
  • the second display area 410 displays a part of the preset image, and the first display area 310 displays the remaining part of the preset image.
  • the first display area 310 and the second display area 410 may also display different images.
  • the second display area 410 displays a preset image, and the first display area 310 displays a taskbar image. Both the first display area 310 and the second display area 410 can display content, the display area is complete, and the display screen 100 occupies a high proportion.
  • the second display area 410 may be disposed around the first display area 310 , and the periphery of the first display area 310 may be adjacent to the second display area 410 , that is, the first display area 310 is located in the middle of the second display area 310 .
  • the second display area 410 may also partially surround the first display area 310, and a part of the edge of the first display area 310 is adjacent to the second display area 410.
  • the first display area 310 is located on the display screen 100. The corner position or the middle of the top of the display screen 100 .
  • the combination and specific positions of the first display area 310 and the second display area 410 are not limited, and different requirements have been met.
  • the light transmittance of the first display area 310 should be larger than the light transmittance of the second display area 410 as much as possible.
  • the maximum brightness of the two cannot be too different.
  • the distribution density of the micro light-emitting diodes can be set as required.
  • the distribution density of the micro-LEDs in the first display area 310 is not greater than the distribution density of the organic light-emitting diodes 430 in the second display area 410 , and the maximum brightness per unit area of the first display area 310 may also be not less than the second display area 410 unit The maximum brightness of the area.
  • the distribution density of the micro-LEDs is equal to or smaller than the distribution density of the organic light-emitting diodes 430, so as to improve the light transmittance of the first display area 310, but the distribution density of the micro-LEDs is not very small, the first display area 310
  • the maximum brightness per unit area may also be slightly larger than or equal to or slightly smaller than the maximum brightness per unit area of the second display area 410 .
  • the first display area 310 further includes a first area 210 of the substrate 200 on which the micro light emitting diodes are disposed.
  • the first display area 310 further includes a first driving circuit 320 for driving the micro light emitting diodes, and the first driving circuit 320 is disposed Between the first region 210 and the micro LED, the micro LED and the first driving circuit 320 are at least partially opposite to each other. In this way, the light transmittance of the first display area 310 is improved to the greatest extent.
  • the first driving circuit 320 and the micro light emitting diode are simultaneously manufactured by using a wafer production process, which improves the production yield.
  • the display screen 100 may be a full screen, that is, basically the entire display surface of the display screen 100 is a display area.
  • a cover plate may also be provided on the display screen 100 .
  • the cover plate covers the display screen 100 to protect the display screen 100 and prevent the display screen 100 from being scratched or damaged.
  • the cover plate may be a transparent glass cover plate, so that the user can observe the information displayed on the display screen 100 through the cover plate.
  • the cover plate may be a cover plate made of sapphire.
  • the display screen 100 may have a regular shape, such as a rectangle, a rectangle with rounded corners, or a circle. Certainly, in some other possible embodiments, the display screen 100 may also have an irregular shape, which is not limited in this embodiment of the present application.
  • the pixel density of the first display area 310 is the same as the pixel density of the second display area 410 .
  • the first display area 310 and the second display area 410 have similar display effects.
  • the maximum brightness of the first display area 310 and the second display area 410 are similar. Because the luminous intensity of the micro light emitting diode is much higher than that of the organic light emitting diode 430 , and the size of the micro light emitting diode is very small, much smaller than that of the organic light emitting diode 430 . Therefore, when the distribution density of the micro light-emitting diodes in the first display area 310 is equal to the distribution density of the organic light-emitting diodes 430, the gap area 340 (which can be understood as a window opening) is formed between the adjacent micro-LEDs in the first display area 310. ) is very large, that is, the proportion of high light transmittance areas without pixels in the first display area 310 is very high, so the transmittance of the first display area 310 is also much larger than that of the second display area 410 .
  • the maximum brightness of the first display area 310 may not be less than the maximum brightness of the second display area 410, or only higher than that of the second display area 410.
  • the maximum brightness of the second display area 410 is slightly smaller.
  • the pixel density of the first pixel unit 300 is smaller than the pixel density of the second pixel unit 400 .
  • the light transmittance of the first display screen 310 is improved on the premise of ensuring stable brightness.
  • the maximum brightness of the first display area 310 may not be less than the maximum brightness of the second display area 410, or only slightly smaller than the maximum brightness of the second display area 410, the maximum brightness of the first display area 310 should be improved as much as possible. Transmittance. Therefore, the distribution density of the micro light-emitting diodes can be set as required.
  • the distribution density of the micro-LEDs in the first display area 310 is smaller than the distribution density of the organic light-emitting diodes 430 in the second display area 410 , so as to improve the light transmittance of the first display area 310 .
  • the maximum brightness per unit area of the first display area 310 may also be slightly greater than or equal to or less than the maximum brightness per unit area of the second display area 410 .
  • the lifetime of the first light-emitting unit 330 is longer than the lifetime of the second light-emitting unit 401 .
  • the first light emitting unit 330 maintains a long life expectancy even under high-intensity working conditions, ensuring that the first display area 310 and the second display area 410 have similar life expectancy.
  • the distribution density of micro light emitting diodes can be set as required.
  • the distribution density of the micro-LEDs in the first display area 310 may not be greater than the distribution density of the organic light-emitting diodes 430 in the second display area 410 , and the maximum brightness per unit area of the first display area 310 may not be less than that of the second display area 410 Maximum brightness per unit area.
  • the first display area 310 can be used as the display area of the under-screen camera. This enables the under-screen camera to have sufficient light transmittance under the first display area 310, and ensures that the display brightness of the first display area 310 and the second display area 410 are similar.
  • each first light-emitting unit 330 includes micro-LEDs of three colors, namely red micro-LEDs 331 , green micro-LEDs 332 and blue micro-LEDs 333 . In this way, the display screen 100 can generate various color lights.
  • red micro-LED 331, the green micro-LED 332 and the blue micro-LED 333 are combined to form an R/G/B MicroLED additive color model. It can be understood that, in optics, red, green and blue are the three primary colors of optics, as long as the color lights of red, green and blue are controlled to be added in different proportions to generate a variety of color lights.
  • the first driving circuit 320 is used to control the luminous intensity of the red micro LED 331 , the green micro LED 332 and the blue micro LED 333 respectively.
  • the first driving circuit 320 controls the red micro-LED 331 to have a weaker luminous intensity, and controls the green micro-LED 332 to have a stronger luminous intensity to emit yellow light.
  • the first driving circuit 320 controls the red micro-LED 331 to have a stronger luminous intensity, and controls the green micro-LED 332 to have a weaker luminous intensity to emit orange light.
  • the first driving circuit 320 can control the micro light emitting diodes to switch among red, yellow, orange and green.
  • the projection of the first light emitting unit 330 on the substrate 200 covers the projection of the first driving circuit 320 on the substrate 200 . In this way, the light transmittance of the first display area 310 is improved.
  • the substrate 200 includes the first driving circuit 320 and the first light-emitting unit 330. Because the first driving circuit 320 includes a light-tight part, the light transmittance of the first light-emitting unit 330 is not high.
  • the first driving circuit 320 and the first light-emitting unit 330 with low light rate are at least partially disposed opposite to each other, and the opaque parts are overlapped to expose more parts with high light transmittance, which improves the overall light transmittance of the first display area 310 Rate.
  • the first light emitting unit 330 has a first orthographic projection in the first region 210
  • the first driving circuit 320 has a second orthographic projection in the first region 210
  • one of the first orthographic projection and the second orthographic projection is located within the other , it can also be understood that the first light-emitting unit 330 and the first driving circuit 320 are arranged overlappingly.
  • the second orthographic projection is within the first orthographic projection, that is, the first light emitting unit 330 covers the first driving circuit 320 .
  • the first orthographic projection is located within the second orthographic projection.
  • the opening of the first display area can occupy 97% of the total area, and the light-emitting area only occupies 3%, which greatly enhances the light transmittance.
  • the first display area 310 can achieve a transmittance of 75%.
  • the organic light-emitting diode 430 has a light-emitting area accounting for 30% and a transmittance of 45%, which is far less than that of a micro light-emitting diode.
  • a 2T1C driving circuit without compensation function can be used. Compared with the 7T1C driving circuit with compensation function, it can Improve the transmittance of the backplane to a greater extent.
  • the first driving circuit 320 includes a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) driving circuit.
  • CMOS complementary Metal Oxide Semiconductor
  • Complementary metal-oxide-semiconductor driver circuit refers to a technology used in the manufacture of large-scale integrated circuit chips.
  • the first driving circuit 320 and the Micro LED are simultaneously fabricated using a wafer production process. In this way, there is no need to additionally prepare pixel drive circuits on the substrate driving layer of the Micro LED display 100, that is, only necessary signal lines need to be fabricated on the substrate layer.
  • the adopted combined structure of the MicroLED+CMOS driving circuit not only improves the production yield, but also maximizes the transmittance of the first display area 310 .
  • the combined structure of the MicroLED+CMOS driving circuit used is small in size and low in reflectivity, in order to further reduce the reflectivity in this area.
  • the display screen 100 includes electrical connection lines 211 disposed on the first region 210 and a light absorption layer 212 , and the light absorption layer 212 is covered on the electrical connection lines 211 . In this way, the generation of stray light is reduced, and the quality of the optical signal is improved.
  • the combined structure of the MicroLED+CMOS driving circuit is adopted, and only the necessary input (in) and output (Out) electrical connecting lines 211 of the first driving circuit 320 are made.
  • the electrical connecting lines 211 are greatly simplified, and the electrical connecting lines 211 may be a metal wire.
  • the electrical connection line 211 is covered with a light absorbing layer 212 .
  • the light absorbing layer 212 is at least partially opposite to the first driving circuit 320 .
  • the first driving circuit 320 includes an opaque part, when the external light signal is irradiated on the first driving circuit 320, refraction and reflection will occur, thereby generating a lot of stray light, which affects the imaging quality of the image.
  • the light absorbing layer 212 can be made of a black light absorbing material, so as to block and absorb the light signal irradiated to the first driving circuit 320 and reduce the generation of stray light. Further, the light transmittance is increased. In one example, the light transmittance is about 50%, so that the first display area 310 does not need to be provided with a polarizer.
  • a plurality of first pixel units 300 are arranged in an array, and a vertical void area 340 is formed between the first pixel units 300 in adjacent columns, and the display screen 100 further includes electrical The connecting line 211, the electrical connecting line 211 is arranged on the first area 210 and extends longitudinally along the column direction of the first pixel unit 300, the vertical electrical connecting line 211 is connected to the first driving circuit 320, and the vertical electrical connecting line 211 is arranged in any adjacent within one of the two longitudinal void regions 340 .
  • the array arrangement of the plurality of first pixel units 300 can better control the first pixel units 300, so that the first display area 310 can generate various color lights.
  • the red miniature light-emitting diodes 331 , the green miniature light-emitting diodes 332 and the blue miniature light-emitting diodes 333 are respectively arranged in a column direction, and the three columns of miniature light-emitting diodes are placed in parallel and vertically.
  • Each column of miniature light-emitting diodes has an electrical connection line 211 electrically connected to it.
  • the electrical connecting lines 211 are processed by edge winding, that is, two column-oriented electrical connecting lines 211 are arranged side by side, and the miniature light-emitting diodes are placed on both sides of the two electrical connecting lines 211 respectively, so that the pixel design is more concentrated, And one of the two adjacent gap regions 340 between adjacent micro light-emitting diodes has a larger light transmittance. The influence of diffraction caused by the electrical connection line 211 of the first display area 310 on the imaging quality of the photosensitive element 500 is minimized.
  • a plurality of first pixel units 300 are arranged in an array, and along the row direction of the first pixel units 300, red miniature light-emitting diodes 331, two vertical electrical connection lines 211, green
  • the color miniature light-emitting diodes 333 and the two vertical electrical connection lines 211 form a cycle.
  • This arrangement makes the gap area 340 as large as possible, avoiding the problem that the gap area 340 is too small due to the uniform arrangement of a row of micro LEDs and a row of electrical connection lines 211 in sequence.
  • the two electrical connection lines 211 are closely arranged, and the miniature light emitting diodes on both sides of the two electrical connection lines 211 are arranged close to the two electrical connection lines 211 , which ensures a larger light-transmitting space in the gap area 340 .
  • a plurality of first pixel units 300 are arranged in an array, and a horizontal void area 340 is formed between the first pixel units 300 in adjacent rows, and the display screen 100 It also includes a lateral electrical connection line 211 arranged on the first region 210 and extending along the row direction of the first pixel unit 300, the lateral electrical connection line 211 is connected to the first driving circuit 320, and any two adjacent lateral void regions A lateral electrical connection line 211 is disposed in one of the 340 , and the lateral electrical connection 211 is disposed at the edge of the lateral void area 340 .
  • the first pixel unit 300 can be controlled, so that the first display area 310 can generate various colored lights, and the light transmittance can be further improved.
  • the micro LEDs are arranged at equal intervals in the column direction, and there may be void regions 340 between the intervals.
  • two horizontal electrical connecting lines 211 can be set as a group, and a group of horizontal electrical connecting lines 211 are arranged close to the edge of the micro light-emitting diode, that is, the previous horizontal electrical connecting line 211 is arranged on the lower edge of the micro light-emitting diode, and the next horizontal electrical connecting line 211 is arranged on the lower edge of the micro light-emitting diode.
  • the connection line 211 is arranged on the upper edge of the miniature light-emitting diode. In this way, the gap area 340 between the horizontal electrical connection lines 211 of different groups is larger, and the gap area 340 between the horizontal electrical connection lines 211 of the same group is smaller. Thus, the transparent area is concentrated and maximized.
  • the first driving circuit 320 includes a 2T1C driving circuit.
  • the first area 210 needs to have a larger light transmittance.
  • the second area 220 uses organic light emitting diodes, so the second driving circuit 420 includes a 7T1C pixel driving circuit, which is an organic light emitting diode. Commonly used driver circuits for diodes.
  • the first region 210 uses micro light emitting diodes, which can improve the light transmittance and compensate for the uniformity of brightness.
  • the 2T1C driving circuit refers to that the circuit mainly includes two thin film transistors (Thin Film Transistor, TFT) and one capacitor C.
  • One of the thin film transistors T2 is a switching TFT, which can be controlled by the scanning signal Gate, used to control the entry of the data signal Data, and is a charging switch for controlling the capacitor C.
  • the other thin film transistor T1 is a driving TFT for driving the micro light emitting diode and controlling the current passing through the micro light emitting diode.
  • the capacitor C is mainly used to store the data signal Data, and then control the driving current of T1 to the miniature light-emitting diode.
  • the scan signal Gate may come from a gate driver and correspond to a certain row of scan lines.
  • the data signal Data may come from the source driver and correspond to a certain column of data lines.
  • an electronic device 1000 includes the display screen 100 of any of the above-mentioned embodiments and a photosensitive element 500 , and the photosensitive element 500 is disposed below the first display area 310 .
  • the first display area 310 adopts micro light emitting diodes, and the independent first driving circuit 320 is used to drive the micro light emitting diodes.
  • the first driving circuit 320 and the micro light emitting diodes are used simultaneously It is made by the wafer production process, so that it is possible to avoid laying the driving circuit on the first area 210 as a whole.
  • the production yield of the micro LEDs is improved, and on the other hand, the light transmittance of the first display area 310 is improved, and the brightness of the micro LEDs is higher, so that the display of the first display area 310 and the second display area 410 is improved.
  • the effects are basically the same, so that the display uniformity of the display screen 100 is better.
  • the photosensitive element 500 in the embodiment of the present application may be an optical sensor (such as a camera, etc.), and the optical sensor transmits a light signal to the light-transmitting display screen 100 .
  • the display screen 100 of the embodiment of the present application is arranged in sections, and the light transmittance of the first display area 310 is greater than that of the second display area 410 . Therefore, placing the photosensitive element 500 under the first display area 310 can improve the photosensitive element 500 The effect of transmitting optical signals.
  • one camera or multiple cameras may be arranged below the first display area 310 .
  • the multiple cameras can be cameras that cooperate with each other, such as two identical cameras, an ordinary camera and a virtual camera or a black-and-white camera, etc.
  • other functional devices can also be arranged below the first display area 310, such as proximity optics. Sensors, light optical sensors, ranging optical sensors, fingerprint recognition optical sensors, etc.
  • the electronic device 1000 in the embodiment of the present application may be a mobile terminal device such as a mobile phone and a tablet computer, or may be a game device, an augmented reality (AR) device, a virtual reality (Virtual Reality, VR) device, a car computer, a notebook Computers, data storage devices, audio playback devices, video playback devices, wearable devices, and other devices with display devices, where the wearable devices can be smart bracelets, smart glasses, and the like.
  • the specific type of the electronic device 1000 is not limited, as long as the display screen 100 and the photosensitive element 500 of the embodiment of the present application are included to meet different requirements.
  • the electronic device 1000 further includes a casing 600 .
  • the housing 600 may include a back cover (not shown in the figure) and a frame 610, and the frame 610 is disposed around the periphery of the back cover.
  • the display screen 100 may be disposed in the frame 610 , and the display screen 100 and the back cover may serve as two opposite sides of the electronic device 1000 .
  • the camera is arranged between the back cover of the casing 600 and the display screen 100 .
  • the electronic device 1000 may also include a circuit board, a battery, and a midplane (not shown in the figure).
  • the frame 610 is disposed around the middle board, wherein the frame 610 and the middle board may form a middle frame of the electronic device 1000 .
  • the middle board and the frame 610 each form a receiving cavity on both sides of the middle board, one of which is used to house the display screen 100 , and the other is used to house the circuit board, the battery, and other electronic components or functions of the electronic device 1000 . components.
  • the middle plate may be a thin plate or a flake structure, and may also be a hollow frame structure.
  • the middle frame is used to provide support for the electronic components or functional components in the electronic device 1000 so as to mount the electronic components and functional components in the electronic device 1000 together.
  • the camera, receiver, battery and other functional components of the electronic device 1000 can be mounted on the middle frame or the circuit board for fixing. It can be understood that the material of the middle frame may include metal or plastic.
  • the circuit board can be mounted on the midframe.
  • the circuit board may be the main board of the electronic device 1000 .
  • one or more functional components such as a microphone, a speaker, a receiver, an earphone interface, an acceleration optical sensor, a gyroscope, and a processor may be integrated on the circuit board.
  • the display screen 100 may be electrically connected to the circuit board to control the display of the display screen 100 through a processor on the circuit board.
  • the display screen 100 and the camera can both be electrically connected to the processor; when the processor receives the shooting instruction, the processor controls the first display area 310 to turn off the display, and controls the camera to capture images through the first display area 310; when the processor When no photographing instruction is received, and an image displaying instruction is received, the processor may control the first display area 310 and the second display area 410 to jointly display an image.
  • the battery can be mounted on the midframe. Meanwhile, the battery is electrically connected to the circuit board, so that the battery can supply power to the electronic device 1000 .
  • a power management circuit may be provided on the circuit board. The power management circuit is used to distribute the voltage provided by the battery to the various electronic components in the electronic device 1000 .
  • a method for manufacturing a display screen 100 includes:
  • the first pixel unit 300 includes a first light-emitting unit 330 and a first driving circuit 320 for driving the first light-emitting unit 330 to emit light, and the first light-emitting unit 330 is disposed in the first driving circuit 320;
  • each second pixel unit 400 includes a second light-emitting unit 401
  • the second driving circuit 420 is used to drive the second light-emitting unit 401 to emit light
  • the first light-emitting unit The projected area of 330 on the substrate 200 is smaller than the projected area of the second light-emitting unit 401 on the substrate 200;
  • the first display area 310 uses micro-LEDs, and the independent first driving circuit 320 is used to drive the micro-LEDs.
  • the first driving circuit 320 and the micro-LEDs can be simultaneously It is made by using a wafer production process, which can avoid laying the driving circuit on the first area 210 as a whole.
  • the production yield of the micro LEDs is improved, and on the other hand, the light transmittance of the first display area 310 is improved, and the brightness of the micro LEDs is higher, so that the display of the first display area 310 and the second display area 410 is improved.
  • the effects are basically the same, so that the display uniformity of the display screen 100 is better.
  • the substrate 200 is provided as the bearing structure of the pixel unit, and the driving circuit and the light emitting diode are first fabricated on the substrate.
  • the substrate 200 is divided into two parts, the first area 210 carries the first pixel unit 300 , and the second area 220 carries the second pixel unit 400 .
  • the second pixel unit 400 needs to be packaged by evaporation, and the first pixel unit 300 needs to place the first driving circuit 320 directly under the micro light emitting diode.
  • the first pixel unit 300 and the second pixel unit 400 are combined, and a polarizer, a touch layer and a glass cover are added to form a complete display screen 100 .
  • step S130 does not limit the execution order of step S130 and step S140, it may be that S130 is executed first and S140 is executed later; or S140 is executed first, and S130 is executed later.
  • a method for manufacturing a display screen 100 according to an embodiment of the present application further includes:
  • a polarizer is attached to the encapsulation layer.
  • a polarizer can be passed through to dissipate surface reflections and to scatter the light to increase the viewing angle of the display screen 100 .
  • the first pixel unit 300 is fabricated through the following steps:
  • a wafer is set on the substrate 350 , and the first driving circuit 320 and the blue micro light emitting diode 333 are fabricated on the wafer, so that the blue micro light emitting diode 333 is epitaxially grown.
  • the substrate 350 is removed, and then the color is converted to realize R/G/B color, and finally the three primary colors of the red micro-LED 331, the green micro-LED 332 and the blue micro-LED 333 are formed by cutting. combination of.
  • forming a plurality of first light-emitting units 330 at intervals on the first driving circuit 320 includes:
  • forming a plurality of first light-emitting units 330 on the second wafer 302 includes:
  • each intermediate body 303 includes a plurality of miniature light-emitting diodes of the same color
  • a method for manufacturing a display screen 100 includes:
  • each second pixel unit 400 includes a second light-emitting unit 401
  • the second driving circuit 420 is used to drive the second light-emitting unit 401 to emit light
  • the first light-emitting unit The projected area of 330 on the substrate 200 is smaller than the projected area of the second light emitting unit 401 on the substrate 200 .
  • first and second are only used for description purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as “first”, “second” may expressly or implicitly include one or more of said features.
  • “plurality” means two or more, unless otherwise expressly and specifically defined.

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Abstract

一种显示屏(100)、电子装置(1000)及显示屏(100)的制造方法。显示屏(100)包括基板(200)、多个第一像素单元(300)、多个第二像素单元(400)及第二驱动电路(420)。第一像素单元(300)中的第一发光单元(330)在基板(200)上的投影面积小于第二像素单元(400)中的第二发光单元(401)在基板(200)上的投影面积。

Description

显示屏、电子装置和制造方法
优先权信息
本申请请求2020年10月22日向中国国家知识产权局提交的、专利申请号为202011139129.2的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本申请涉及手机设备领域，更具体而言，涉及一种显示屏、电子装置、显示屏的制造方法和像素单元的制造方法。
背景技术
目前，全面屏手机已经成为主流手机。在相关技术中，可以将指纹传感器、摄像头等光感器件设置在显示屏下方，以使手机实现全面屏的效果。为了提高显示屏与光感器件对应的部分的透光率，一般采用降低该部分的像素密度的方式。然而，影响了显示屏的整体显示效果。
发明内容
本申请实施方式提供了一种显示屏、电子装置和显示屏的制造方法。
本申请实施方式的一种显示屏包括基板、多个第一像素单元和多个第二像素单元。所述基板包括第一区域和第二区域。每个所述第一像素单元包括第一发光单元以及用于驱动所述第一发光单元发光的第一驱动电路，所述第一发光单元设置于所述第一驱动电路上，并且与所述第一驱动电路一同被设置于所述第一区域。每个所述第二像素单元包括第二发光单元，所述第二发光单元设置在所述第二区域。所述第二驱动电路用于驱动所述第二发光单元发光，所述第二发光单元包括有机发光二极管。所述第一发光单元在所述基板上的投影面积小于所述第二发光单元在所述基板上的投影面积。
本申请实施方式的一种电子装置包括上述实施方式的显示屏和感光元件，所述感光元件设置在所述第一显示区下方。
本申请实施方式的一种显示屏的制造方法包括：提供基板，所述基板包括第一区域和第二区域。提供多个第一像素单元，所述第一像素单元包括第一发光单元以及用于驱动所述第一发光单元发光的第一驱动电路，所述第一发光单元设置于所述第一驱动电路上。将所述第一发光单元和所述第一驱动电路一同转移安装在所述第一区域。在所述第二区域上设置多个第二像素单元，每个所述第二像素单元包括第二发光单元，第二驱动电路用于驱动所述第二发光单元发光，所述第一发光单元在所述基板上的投影面积小于所述第二发光单元在所述基板上的投影面积。封装所述多个第二像素单元以使所述多个第二像素单元封装在封装层内。
本申请实施方式的一种显示屏的制造方法包括：提供基板，所述基板包括第一区域和第二区域。提供第一驱动电路。在所述第一驱动电路生长形成第一发光单元。将所述第一发光单元和所述第一驱动电路一同转移安装在所述第一区域。在所述第二区域上设置多个第二像素单元，每个所述第二像素单元包括第二发光单元，第二驱动电路用于驱动所述第二发光单元发光，所述第一发光单元在所述基板上的投影面积小于所述第二发光单元在所述基板上的投影面积。
本申请实施方式的一种像素单元的制造方法包括：提供第一晶圆。在所述第一晶圆上形成所述第一驱动电路。在所述第一驱动电路上形成间隔设置的多个第一发光单元。切割所述第一晶圆以得到第一像素单元单体。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本申请实施方式的电子装置的结构示意图；
图2是图1电子装置中II部分的部分结构示意图；
图3是本申请实施方式的显示屏的层叠结构示意图；
图4是本申请实施方式的显示屏和感光元件的配合示意图；
图5是本申请实施方式的微型发光二极管的阵列示意图；
图6是本申请实施方式的电连接线与吸光层的剖面示意图；
图7是本申请实施方式的第一驱动电路的部分电路示意图；
图8是本申请实施方式的显示屏的制造方法的流程示意图；
图9是本申请实施方式的显示屏的制造方法的过程示意图；
图10是本申请实施方式的显示屏的制造方法的另一流程示意图；
图11是本申请实施方式的显示屏的制造方法的再一流程示意图；
图12是本申请实施方式的显示屏的制造方法的又一流程示意图；
图13是本申请实施方式的显示屏的制造方法的另一流程示意图。
具体实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设定进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设定之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1至图4，本申请实施方式提供了一种显示屏100包括基板200、多个第一像素单元300和多个第二像素单元400。基板200包括第一区域210和第二区域220。每个第一像素单元300包括第一发光单元330以及第一驱动电路320，第一驱动电路320用于驱动第一发光单元330发光，第一发光单元330设置于第一驱动电路320上，并且与第一驱动电路320一同被设置于第一区域210。
请参阅图2，在某些实施方式中，第一显示区310的像素密度与第二显示区410的像素密度相同。
请参阅图3和图4，在某些实施方式中，第一发光单元330的寿命高于第二发光单元401的寿命。
请参阅图5，在某些实施方式中，每个第一发光单元330包括三种颜色的微型发光二极管，分别为红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333。如此，可以实现显示屏100产生多种多样的色光。
请参阅图3和图4，在某些实施方式中，第一发光单元330在基板200上的投影覆盖第一驱动电路320在基板200上的投影。
请参阅图5和图6，在某些实施方式中，显示屏100包括设在第一区域210上的电连接线211，以及吸光层212，电连接线211上覆盖有吸光层212。
请参阅图2和图5，在某些实施方式中，多个第一像素单元300阵列排布，相邻列的第一像素单元300之间形成有纵向空隙区域340，显示屏100还包括电连接线211，电连接线211设在第一区域210上并沿第一像素单元300的列方向纵向延伸，纵向电连接线211连接第一驱动电路320，纵向电连接线211设置在任意相邻的两个纵向空隙区域340中的其中一个内。
请参阅图2、图5和图6，在某些实施方式中，多个第一像素单元300阵列排布，相邻行的第一像素单元300之间形成有横向空隙区域340，显示屏100还包括设在第一区域210上并沿第一像素单元300的行方向延伸的横向电连接线211，横向电连接线211连接所述第一驱动电路320，任意相邻的两个横向空隙区域340中的其中一个内设置有横向电连接线211，横向电连接211设置在横向空隙区域340的边缘。
请参阅图6和图7，在某些实施方式中，第一驱动电路320包括2T1C驱动电路。
请参阅图1和图4，本申请实施方式的一种电子装置1000包括上述任一实施方式的显示屏100和感光元件500，感光元件500设置在第一显示区310下方。
请参阅图8和图9，本申请实施方式的一种显示屏100的制造方法包括：
提供基板200，基板200包括第一区域210和第二区域220；
提供多个第一像素单元300，第一像素单元300包括第一发光单元330以及用于驱动第一发光单元330发光的第一驱动电路320，第一发光单元330设置于第一驱动电路320上；
将第一发光单元330和第一驱动电路320一同转移安装在第一区域210；
在第二区域220上设置多个第二像素单元400，每个第二像素单元400包括第二发光单元401，第二驱动电路420用于驱动第二发光单元401发光，第一发光单元330在基板200上的投影面积小于第二发光单元401在基板200上的投影面积；
封装多个第二像素单元400以使多个第二像素单元400封装在封装层内。
请参阅图9，本申请实施方式的一种显示屏100的制造方法还包括：
在封装层上贴设偏光片。
请参阅图9和图10，在某些实施方式中，第一像素单元300通过以下步骤制造：
提供第一晶圆301；
在第一晶圆301上形成第一驱动电路320；
在第一驱动电路320上形成间隔设置的多个第一发光单元330；
切割第一晶圆301以得到第一像素单元300单体。
请参阅图9和图11，在某些实施方式中，在第一驱动电路320上形成间隔设置的多个第一发光单元330，包括：
将带有衬底350的第二晶圆302设置在第一驱动电路320上；
去除衬底350；
在第二晶圆302上形成多个第一发光单元330。
请参阅图9和图12，在某些实施方式中，在第二晶圆302上形成多个第一发光单元330，包括：
在第二晶圆302上形成多个中间体303，每个中间体303包括多个同种颜色的微型发光二极管；
将多个同颜色的微型发光二极管进行颜色转化以得到第一发光单元330，其中，第一发光单元330包括红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333。
请参阅图9和图13，本申请实施方式的一种显示屏100的制造方法，包括：
提供基板200，基板200包括第一区域210和第二区域220；
提供第一驱动电路320；
在第一驱动电路320生长形成第一发光单元330；
将所述第一发光单元330和第一驱动电路320一同转移安装在第一区域210；
在第二区域220上设置多个第二像素单元400，每个第二像素单元400包括第二发光单元401，第二驱动电路420用于驱动第二发光单元401发光，第一发光单元330在基板200上的投影面积小于第二发光单元401在基板200上的投影面积。
下面结合附图对本申请实施方式全景图像拍摄方法作详细说明。
请参阅图1至图4，本申请实施方式提供了一种显示屏100包括基板200、多个第一像素单元300和多个第二像素单元400。基板200包括第一区域210和第二区域220。每个第一像素单元300包括第一发光单元330以及第一驱动电路320，第一驱动电路320用于驱动第一发光单元330发光，第一发光单元330设置于第一驱动电路320上，并且与第一驱动电路320一同被设置于第一区域210。
每个第二像素单元400包括第二发光单元401，第二发光单元402设置在第二区域220。第二驱动电路420用于驱动第二发光单元401发光。第一发光单元330在基板200上的投影面积小于第二发光单元401在基板200上的投影面积。
本申请实施方式的显示屏100中，第一发光单元330设置于第一驱动电路320上，并且与第一驱动电路320一同被设置于第一区域210，这样可以避免在第一区域210上整体铺设驱动电路，防止整体铺设的驱动电路遮挡光线；另外，第一发光单元330在基板200上的投影面积小于第二发光单元401在基板200上的投影面积，这样也可以使得第一发光单元330所占面积较小，在保证显示屏100的显示效果的基础上提高了显示屏100与第一区域 210对应的区域的透光率。
在某些实施方式中，第一发光单元330包括微型发光二极管(MicroLight-Emitting Diode，MicroLED)，第二发光单元401包括有机发光二极管(OrganicLight-Emitting Diode，OLED)430。
在相关的OLED显示屏的实施方式中，显示屏采用的是屏下摄像头区域采用低像素密度(PPI)的设计，来提升透过率，同时适当的降低衍射。而屏下摄像头区域为保证和正常区域亮度整体亮度一致，则需要把低PPI单个像素亮度提高，这使得低PPI寿命衰减更快，长时间衰减则可以看出低PPI与高PPI的差距越来越明显。另外，屏下摄像头显示区域低PPI，还会导致像素的不完整性，会出现内锯齿、颗粒感或者彩边问题。进而使得这一区域出现亮度不均匀，出现各种痕迹。
而在本申请实施方式中，显示屏100可以分为第一显示区310与第二显示区410，第一显示区310包括第一区域210和第一像素单元300。第二显示区310包括第二区域220和第二像素单元400和第二驱动电路420。或者说，第一显示区310与第一区域210对应设置，第二显示区410与第二区域220对应设置。
第一显示区310中的第一发光单元330使用了微型发光二极管显示，第二显示区410中的第二发光单元401采用了有机发光二极管430显示技术。第一显示区310以微型发光二极管无机超高显示寿命的优点，来克服屏下摄像头区域因为低PPI高亮导致的寿命低、烧屏的风险。一方面，微型发光二极管面积小、低PPI，对光透过率高，显著提升屏下摄像头区域的进光量，进而提升摄像头的成像质量；另一方面，微型发光二极管单个像素亮度高，使得第一显示区310与第二显示区410可以配合显示，使得显示屏100显示完整的内容。
具体地，第一显示区310的透光率大于第二显示区410的透光率，第一显示区310可以用于光学传感器传输信号，第一显示区310通过微型发光二极管显示图像，第二显示区410通过有机发光二极管430显示图像，因为微型发光二极管的发光强度远大于有机发光二极管430的发光强度，所以第一显示区310的最大亮度不会明显低于第二显示区410的最大亮度，第一显示区310和第二显示区410的最大亮度相近，第一显示区310和第二显示区410的均匀性好。
本申请实施方式的第一显示区310与第二显示区410可以紧密相邻连接。第一显示区310和第二显示区410都可以用于显示文字或图像，例如，第一显示区310和第二显示区410可以共同显示同一相片。
在一个实施例中，第二显示区410显示预设图像的一部分，第一显示区310显示预设图像剩下的部分。第一显示区310和第二显示区410也可以显示不同的图像，在另一个实施例中，第二显示区410显示预设图像，第一显示区310显示任务栏图像。第一显示区310和第二显示区410都可以显示内容，显示区域完整，显示屏100占比高。
在某些实施方式中，第二显示区410可以围绕第一显示区310设置，第一显示区310周缘可以都与第二显示区410邻接，即第一显示区310位于第二显示区310中间。
在某些实施方式中，第二显示区410也可以部分围绕透第一显示区310，第一显示区310的部分边缘与第二显示区410邻接，例如，第一显示区310位于显示屏100的边角位置或位于显示屏100的顶端中间。
在本申请实施方式中，对第一显示区310与第二显示区410的组合方式和具体位置不做限定，已满足不同需求。
为了更好的透过第一显示区310传输光信号，第一显示区310的透光率要尽可能的大于第二显示区410的透光率。但是为了使第一显示区310和第二显示区410的亮度均匀性，两者的最大亮度不能相差太大。
需要说明的是，上述最大亮度指的是单位面积的最大亮度。因此，可以根据需要设置微型发光二极管的分布密度。例如，第一显示区310的微型发光二极管的分布密度不大于第二显示区410的有机发光二极管430的分布密度，第一显示区310单位面积的最大亮度还可以不小于第二显示区410单位面积的最大亮度。
或者说，微型发光二极管的分布密度等于或小于有机发光二极管430的分布密度，用以提高第一显示区310的透光率，但是微型发光二极管的分布密度也不是非常小，第一显示区310单位面积的最大亮度还可以略大于或等于或略小于第二显示区410单位面积的最大亮度。
请结合图3，图3为本申请实施例提供的显示屏100的一种层叠结构示意图。第一显示区310还包括基板200的第一区域210，微型发光二极管设置于第一区域210上，第一显示区310还包括驱动微型发光二极管的第一驱动电路320，第一驱动电路320设置于第一区域210和微型发光二极管之间，微型发光二极管与第一驱动电路320至少部分相对设置。如此，最大程度上提高了第一显示区310的透光量。另外，在实际制作第一发光单元330的时候第一驱动电路320和微型发光二极管同时使用晶圆生产工艺制成，提高了生产良率。
显示屏100可以为全面屏，即显示屏100的显示面基本全部都是显示区域。显示屏100上还可以设置有盖板。 盖板覆盖显示屏100，以对显示屏100进行保护，防止显示屏100被刮伤或者被损坏。其中，盖板可以为透明玻璃盖板，从而用户可以透过盖板观察到显示屏100显示的信息。例如，盖板可以为蓝宝石材质的盖板。在本申请实施方式中，显示屏100可以呈规则形状，如矩形、圆角矩形或圆形。当然，在一些其它可能的实施例中，显示屏100也可以呈非规则形状，本申请实施例对此不作限定。
请参阅图2，在某些实施方式中，第一显示区310的像素密度与第二显示区410的像素密度相同。
如此，在保证一定透光量的基础上，使得第一显示区310和第二显示区410具有相似的显示效果。
具体地，在像素密度相同的情况下，第一显示区310和第二显示区410的最大亮度相似。由于微型发光二极管发光强度远远高于有机发光二极管430，并且微型发光二极管的尺寸非常小，远小于有机发光二极管430的尺寸。因此，在第一显示区310中微型发光二极管的分布密度等于有机发光二极管430的分布密度时，第一显示区310中相邻的微型发光二极管之间形成的空隙区域340(可以理解为开窗)很大，即第一显示区310中没有设置像素的高透光区域的比例很高，所以第一显示区310的透光率也远大于第二显示区410的透光率。
另外，因为微型发光二极管发光强度远远高于有机发光二极管430，所以尽管微型发光二极管的尺寸小，但第一显示区310的最大亮度可以不小于第二显示区410的最大亮度，或仅比第二显示区410的最大亮度略小。
在某些实施方式中，第一像素单元300的像素密度小于第二像素单元400的像素密度。如此，在保证了亮度稳定的前提下，提高了第一显示屏310的透光率。具体地，在第一显示区310的最大亮度可以不小于第二显示区410的最大亮度，或仅比第二显示区410的最大亮度略小的前提下，尽可能提高第一显示区310的透光率。因此，可以根据需要设置微型发光二极管的分布密度。
例如，第一显示区310的微型发光二极管的分布密度小于第二显示区410的有机发光二极管430的分布密度，用以提高第一显示区310的透光率。在微型发光二极管的分布密度小于第二像素单元400的像素密度时，第一显示区310单位面积的最大亮度还可以略大于或等于或略小于第二显示区410单位面积的最大亮度。
请参阅图3和图4，在某些实施方式中，第一发光单元330的寿命高于第二发光单元401的寿命。
如此，第一发光单元330即使在高强度的工作条件下保持较长的预期寿命，保证了第一显示区310和第二显示区410具有相近的预期寿命。
具体地，由于微型发光二极管无机超高显示寿命和低能耗的优点，因此，可以根据需要设置微型发光二极管的分布密度。例如，第一显示区310的微型发光二极管的分布密度可以不大于第二显示区410的有机发光二极管430的分布密度，第一显示区310单位面积的最大亮度还可以不小于第二显示区410单位面积的最大亮度。如此，第一显示区310可以作为屏下摄像头的显示区域。使得屏下摄像头在第一显示区310下有足够的透光量，又保证了第一显示区310和第二显示区410显示亮度相似。
请参阅图5，在某些实施方式中，每个第一发光单元330包括三种颜色的微型发光二极管，分别为红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333。如此，可以实现显示屏100产生多种多样的色光。
具体地，红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333组合形成R/G/B MicroLED加色模型。可以理解的是，在光学中，红色、绿色和蓝色为光学三原色，只要控制红色、绿色和蓝色的色光以不同的比例相加，以产生多种多样的色光。
第一驱动电路320用来分别控制红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333的发光强度。例如，第一驱动电路320控制红色微型发光二极管331发光强度较弱，控制绿色微型发光二极管332发光强度较强，发出黄色光。第一驱动电路320控制红色微型发光二极管331发光强度较强，控制绿色微型发光二极管332发光强度较弱，发出橙色光。第一驱动电路320可以控制微型发光二极管在红色、黄色、橙色和绿色中切换。
请参阅图3和图4，在某些实施方式中，第一发光单元330在基板200上的投影覆盖第一驱动电路320在基板200上的投影。如此，提高了第一显示区310的透光率。
具体地，基板200上包括有第一驱动电路320和第一发光单元330，因为第一驱动电路320包括不透光的部分，第一发光单元330的透光率也不高，因此，将透光率都不高的第一驱动电路320和第一发光单元330至少部分相对设置，不透光部分重叠设置，露出更多高透光率的部分，提高了第一显示区310的整体透光率。
其中，第一发光单元330在第一区域210具有第一正投影，第一驱动电路320在第一区域210具有第二正投影，第一正投影和第二正投影中的一个位于另一个内，也可以理解为第一发光单元330和第一驱动电路320重叠设置。
当第一发光单元330的尺寸大于第一驱动电路320的尺寸时，第二正投影在第一正投影内，即第一发光单元330覆盖第一驱动电路320。当第一发光单元330的尺寸小于第一驱动电路320时，第一正投影位于第二正投影内。
示例性地，因为微型发光二极管的尺寸小，第一显示区的开窗可以占到总区域的97％，发光区仅占3％，极大的增强了透光率。同时第一显示区310可以达到75％的穿透率。
而有机发光二极管430，发光区占比30％，穿透率为45％，远远不及微型发光二极管。在本申请实施方式中，因为第一显示区310区域小(例如5*5mm区域)，发光要求较低，可以采用无补偿功能的2T1C驱动电路，相较于有补偿功能的7T1C驱动电路，能够更大程度提升背板的透过率。
在某些实施方式中，第一驱动电路320包括互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，CMOS)驱动电路。如此，进一步的降低第一驱动电路320的面积，提高透光率。
本申请实施方式中，采用的MicroLED+CMOS驱动电路的组合结构中。互补金属氧化物半导体驱动电路是指制造大规模集成电路芯片用的一种技术。Micro LED生长时将第一驱动电路320和MicroLED同时使用晶圆生产工艺制成。如此，在Micro LED显示屏100的基板驱动层无需在额外制备像素驱动电路，即在基板层上仅需制作必要的信号线即可。
采用的MicroLED+CMOS驱动电路的组合结构不仅提升了生产良率，而且最大程度上的提高了第一显示区310的透光率。另外，采用的MicroLED+CMOS驱动电路的组合结构体积小，反射率低，为了进一步降低此区域的反射率。
请参阅图5和图6，在某些实施方式中，显示屏100包括设在第一区域210上的电连接线211，以及吸光层212，电连接线211上覆盖有吸光层212。如此，减少了杂光的产生，提高了光信号的质量。
具体地，采用的MicroLED+CMOS驱动电路的组合结构，仅制作必要的第一驱动电路320的输入(in)和输出(Out)电连接线211，电连接线211极大的简化，电连接线211可以是金属导线。电连接线211上覆盖有吸光层212，吸光层212与第一驱动电路320至少部分相对设置，吸光层212用于遮挡照射至第一驱动电路320的光信号。
因为，第一驱动电路320包括不透光的部分，当外部光信号照射到第一驱动电路320上会发生折射、反射，进而产生很多杂光，影响图像的成像质量。吸光层212可以选用黑色的吸光材料，从而可以遮挡吸收照射至第一驱动电路320的光信号，减少杂光的产生。进而增加透光率，在一个例子中，透光率在50％左右，也使得第一显示区310不需要设置偏光片。
请参阅图2和图5，在某些实施方式中，多个第一像素单元300阵列排布，相邻列的第一像素单元300之间形成有纵向空隙区域340，显示屏100还包括电连接线211，电连接线211设在第一区域210上并沿第一像素单元300的列方向纵向延伸，纵向电连接线211连接第一驱动电路320，纵向电连接线211设置在任意相邻的两个纵向空隙区域340中的其中一个内。
如此，多个第一像素单元300阵列排布更好控制第一像素单元300，实现第一显示区310产生多种多样的色光。
具体地，红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333分别呈列向依次排列，三列微型发光二极管平行竖直放置。每列微型发光二极管都有与之电连接的电连接线211。在本申请实施方式中，电连接线211使用边缘绕线处理，即两条列向电连接线211并列设置，微型发光二极管分别置于两条电连接线211两侧，使得像素设计更加集中，而相邻的微型发光二极管之间相邻的两个空隙区域340中的其中一个有更大的透光率。最大限度的降低第一显示区310电连接线211造成的衍射对感光元件500成像质量的影响。
示例性地，多个第一像素单元300阵列排布，沿第一像素单元300的行方向，红色微型发光二极管331、两条纵向电连接线211、绿色微型发光二极管332、空隙区域340、蓝色微型发光二极管333、两条纵向电连接线211形成一个循环。这样的排列方式尽可能的使得空隙区域340更大，避免了一列微型发光二极管和一列电连接线211依次均匀排列造成空隙区域340太小的问题。其中两条电连接线211紧密设置，两条电连接线211两侧的微型发光二极管紧贴两条电连接线211设置，保证了空隙区域340又更大的透光空间。
请参阅图2、图5和图6，在某些实施方式中，多个第一像素单元300阵列排布，相邻行的第一像素单元300之间形成有横向空隙区域340，显示屏100还包括设在第一区域210上并沿第一像素单元300的行方向延伸的横向电连接线211，横向电连接线211连接所述第一驱动电路320，任意相邻的两个横向空隙区域340中的其中一个内设置有横向电连接线211，横向电连接211设置在横向空隙区域340的边缘。
如此，可以控制第一像素单元300，实现第一显示区310产生多种多样的色光，并且进一步提升了透光率。
示例性地，微型发光二极管在列方向上等间距设置，间隔之间可以存在空隙区域340。而可以设置两条横向电连接线211为一组，一组横向电连接线211彼此靠近微型发光二极管的边缘设置，即上一条横向电连接线211设 置在微型发光二极管下边缘，下一条横向电连接线211设置在微型发光二极管上边缘。如此，不同组别的横向电连接线211之间的空隙区域340更大，同组横向电连接线211之间的空隙区域340更小。从而使得透明区域集中、最大化。
请参阅图6和图7，在某些实施方式中，第一驱动电路320包括2T1C驱动电路。
如此，使用2T1C驱动电路可以更大限度的提高透光率。
具体地，与第二区域220相比，第一区域210需要有更大的透光率，第二区域220使用有机发光二极管，故第二驱动电路420包括7T1C的像素驱动电路，这是有机发光二极管常用的驱动电路。第一区域210使用微型发光二极管，可以提高透光率，并且补偿了亮度均匀性。
示例性地，2T1C驱动电路指电路主要包括两个薄膜晶体管(Thin Film Transistor，TFT)和一个电容C。其中一个薄膜晶体管T2为开关TFT，可以由扫描信号Gate控制，用于控制数据信号Data的进入，是控制电容C的充电开关。另一个薄膜晶体管T1为驱动TFT，用于驱动微型发光二极管，控制通过微型发光二极管的电流。电容C主要是用来存储数据信号Data，进而控制T1对微型发光二极管的驱动电流。扫描信号Gate可以来自于栅极驱动器，对应于某一行扫描线。数据信号Data可以来自于源极驱动器，对应于某一列数据线。
请参阅图1和图4，本申请实施方式的一种电子装置1000包括上述任一实施方式的显示屏100和感光元件500，感光元件500设置在第一显示区310下方。
本申请实施方式的显示屏100中，第一显示区310采用微型发光二极管，并且采用独立的第一驱动电路320驱动微型发光二极管，在制作过程中将第一驱动电路320和微型发光二极管同时使用晶圆生产工艺制成，这样可以避免在第一区域210上整体铺设驱动电路。一方面提高了微型发光二极管的生产良率，另一方面提高了第一显示区310的透光率，并且微型发光二极管的亮度较高，使得第一显示区310与第二显示区410的显示效果基本相同，使得显示屏100的显示的均匀性较佳。
本申请实施方式的感光元件500可以是一种光学传感器(如摄像头等)，光学传感器透光显示屏100传输光信号。本申请实施方式的显示屏100分区设置，第一显示区310的透光率大于第二显示区410的透光率，因而将感光元件500置于第一显示区310下方，可以改善感光元件500传输光信号的效果。
具体地，第一显示区310下方可以设置一个摄像头也可以设置多个摄像头。多个摄像头可以为相互配合的摄像头，如两个相同的摄像头、一个普通摄像头和一个虚化摄像头或黑白摄像头等，第一显示区310下方除了设置摄像头以外还可以设置其他功能器件，如接近光学传感器、光线光学传感器、测距光学传感器、指纹识别光学传感器等。
本申请实施方式中的电子装置1000可以是手机、平板电脑等移动终端设备，还可以是游戏设备、增强现实(Augmented Reality，AR)设备、虚拟现实(Virtual Reality，VR)设备、车载电脑、笔记本电脑、数据存储装置、音频播放装置、视频播放装置、可穿戴设备等具有显示装置的设备，其中可穿戴设备可以是智能手环、智能眼镜等。在本申请实施方式中，对电子装置1000具体的类型不做限定，只要包括本申请实施方式的显示屏100和感光元件500，以满足不同需求。
为了更加全面的理解本申请实施例的电子装置1000。下面对电子装置1000的结构作进一步说明。请继续参阅图1，电子装置1000还包括壳体600。壳体600可以包括后盖(图中未示出)和边框610，边框610围绕后盖的周缘设置。显示屏100可以设置于边框610内，显示屏100和后盖可以作为电子装置1000的相对的两面。摄像头设置在壳体600的后盖和显示屏100之间。
电子装置1000还可以包括电路板、电池和中板(图中未示出)。边框610围绕中板设置，其中，边框610可以与中板形成电子装置1000的中框。中板和边框610在中板两侧各形成一个容纳腔，其中一个容纳腔用于容置显示屏100，另一个容纳腔用于容置电路板、电池和电子装置1000的其他电子元件或功能组件。
其中，中板可以为薄板状或薄片状的结构，也可以为中空的框体结构。中框用于为电子装置1000中的电子元件或功能组件提供支撑作用，以将电子装置1000中的电子元件、功能组件安装到一起。电子装置1000的摄像头、受话器、电池等功能组件都可以安装到中框或电路板上以进行固定。可以理解的，中框的材质可以包括金属或塑胶等。
电路板可以安装在中框上。电路板可以为电子装置1000的主板。其中，电路板上可以集成有麦克风、扬声器、受话器、耳机接口、加速度光学传感器、陀螺仪以及处理器等功能组件中的一个或多个。同时，显示屏100可以电连接至电路板，以通过电路板上的处理器对显示屏100的显示进行控制。显示屏100和摄像头可以均与处理器电性连接；当处理器接收到拍摄指令时，处理器控制第一显示区310关闭显示，并控制摄像头透过第一显示区310 采集图像；当处理器未接收到拍摄指令，且接收到显示图像指令时，处理器可以控制第一显示区310和第二显示区410共同显示图像。
电池可以安装在中框上。同时，电池电连接至电路板，以实现电池为电子装置1000供电。其中，电路板上可以设置有电源管理电路。电源管理电路用于将电池提供的电压分配到电子装置1000中的各个电子元件。
请参阅图8和图9，本申请实施方式的一种显示屏100的制造方法包括：
S110，提供基板200，基板200包括第一区域210和第二区域220；
S120，提供多个第一像素单元300，第一像素单元300包括第一发光单元330以及用于驱动第一发光单元330发光的第一驱动电路320，第一发光单元330设置于第一驱动电路320上；
S130，将第一发光单元330和第一驱动电路320一同转移安装在第一区域210；
S140，在第二区域220上设置多个第二像素单元400，每个第二像素单元400包括第二发光单元401，第二驱动电路420用于驱动第二发光单元401发光，第一发光单元330在基板200上的投影面积小于第二发光单元401在基板200上的投影面积；
S150，封装多个第二像素单元400以使多个第二像素单元400封装在封装层内。
本申请实施方式的显示屏100中，第一显示区310采用微型发光二极管，并且采用独立的第一驱动电路320驱动微型发光二极管，在制作过程中可以将第一驱动电路320和微型发光二极管同时使用晶圆生产工艺制成，这样可以避免在第一区域210上整体铺设驱动电路。一方面提高了微型发光二极管的生产良率，另一方面提高了第一显示区310的透光率，并且微型发光二极管的亮度较高，使得第一显示区310与第二显示区410的显示效果基本相同，使得显示屏100的显示的均匀性较佳。
具体地，提供基板200作为像素单元的承载结构，首先在基板上制作驱动电路和发光二极管。基板200分为两部分，第一区域210承载第一像素单元300，第二区域220承载第二像素单元400。另外，第二像素单元400需要蒸镀封装，而第一像素单元300需要将第一驱动电路320置于微型发光二极管正下方。最后第一像素单元300和第二像素单元400组合，并加装偏光片、触控层和玻璃盖板，形成一块完整的显示屏100。
需要指出的是，本申请不对步骤S130和步骤S140的执行顺序做限制，可以是S130先执行、S140后执行；也可以是S140先执行，S130后执行。
请参阅图9，本申请实施方式的一种显示屏100的制造方法还包括：
在封装层上贴设偏光片。
如此，可以通过偏光片以消散表面反光，并且把光散射以增加显示屏100的视角。
请参阅图9和图10，在某些实施方式中，第一像素单元300通过以下步骤制造：
S210，提供第一晶圆301；
S220，在第一晶圆301上形成第一驱动电路320；
S230，在第一驱动电路320上形成间隔设置的多个第一发光单元330；
S240，切割第一晶圆301以得到第一像素单元300单体。
具体地，将晶圆设置在衬底350上，晶圆上制作第一驱动电路320和蓝色微型发光二极管333，使得蓝色微型发光二极管333外延生长。在蓝色微型发光二极管333生长完成时将衬底350取下，然后色转换实现R/G/B彩色，最后切割形成红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333三原色的组合体。
请参阅图9和图11，在某些实施方式中，在第一驱动电路320上形成间隔设置的多个第一发光单元330(步骤230)，包括：
S231，将带有衬底350的第二晶圆302设置在第一驱动电路320上；
S232，去除衬底350；
S233，在第二晶圆302上形成多个第一发光单元330。
请参阅图9和图12，在某些实施方式中，在第二晶圆302上形成多个第一发光单元330(步骤S233)，包括：
S2331，在第二晶圆302上形成多个中间体303，每个中间体303包括多个同种颜色的微型发光二极管；
S2332，将多个同颜色的微型发光二极管进行颜色转化以得到第一发光单元330，其中，第一发光单元330包括红色微型发光二极管331、绿色微型发光二极管332和蓝色微型发光二极管333。
请参阅图9和图13，本申请实施方式的一种显示屏100的制造方法，包括：
S310，提供基板200，基板200包括第一区域210和第二区域220；
S320，提供第一驱动电路320；
S330，在第一驱动电路320生长形成第一发光单元330；
S340，将所述第一发光单元330和第一驱动电路320一同转移安装在第一区域210；
S350，在第二区域220上设置多个第二像素单元400，每个第二像素单元400包括第二发光单元401，第二驱动电路420用于驱动第二发光单元401发光，第一发光单元330在基板200上的投影面积小于第二发光单元401在基板200上的投影面积。
在本发明的实施方式的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的实施方式的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管上面已经示出和描述了本申请的实施方式，可以理解的是，上述实施方式是示例性的，不能理解为对本申请的限制，本领域的普通技术人员在本申请的范围内可以对上述实施方式进行变化、修改、替换和变型。

Claims (20)

  1. 一种显示屏，其特征在于，包括：
    基板，所述基板包括第一区域和第二区域；
    多个第一像素单元，每个所述第一像素单元包括第一发光单元以及用于驱动所述第一发光单元发光的第一驱动电路，所述第一发光单元设置于所述第一驱动电路上，并且与所述第一驱动电路一同被设置于所述第一区域；
    多个第二像素单元，每个所述第二像素单元包括第二发光单元，所述第二发光单元设置在所述第二区域上；
    第二驱动电路，所述第二驱动电路用于驱动所述第二发光单元发光；
    所述第一发光单元在所述基板上的投影面积小于所述第二发光单元在所述基板上的投影面积。
  2. 根据权利要求1所述的显示屏，其特征在于，所述显示屏还包括第一显示区和第二显示区，所述第一显示区的像素密度与所述第二显示区的像素密度相同。
  3. 根据权利要求1所述的显示屏，其特征在于，所述第一发光单元的寿命高于所述第二发光单元的寿命。
  4. 根据权利要求1所述的显示屏，其特征在于，所述第一发光单元包括微型发光二极管，所述第二发光单元包括有机发光二极管。
  5. 根据权利要求1所述的显示屏，其特征在于，所述第一发光单元包括三种颜色的微型发光二极管，分别为红色微型发光二极管、绿色微型发光二极管和蓝色微型发光二极管。
  6. 根据权利要求1所述的显示屏，其特征在于，所述第一发光单元在所述基板上的投影覆盖所述第一驱动电路在所述基板上的投影。
  7. 根据权利要求1所述的显示屏，其特征在于，所述显示屏包括设在所述第一区域上的电连接线，以及覆盖所述电连接线的吸光层，所述电连接线连接所述第一驱动电路。
  8. 根据权利要求1所述的显示屏，其特征在于，所述多个第一像素单元阵列排布，相邻列的所述第一像素单元之间形成有纵向空隙区域，所述显示屏还包括设在所述第一区域上并沿所述第一像素单元的列方向延伸的纵向电连接线，所述纵向电连接线连接所述第一驱动电路，所述纵向电连接线设置在任意相邻的两个所述纵向空隙区域中的其中一个内。
  9. 根据权利要求1所述的显示屏，其特征在于，所述多个第一像素单元阵列排布，相邻行的所述第一像素单元之间形成有横向空隙区域，所述显示屏还包括设在所述第一区域上并沿所述第一像素单元的行方向延伸的横向电连接线，所述横向电连接线连接所述第一驱动电路，任意相邻的两个所述横向空隙区域中的其中一个内设置有横向电连接线，所述横向电连接设置在所述横向空隙区域的边缘。
  10. 根据权利要求1所述的显示屏，其特征在于，所述第一驱动电路包括2T1C驱动电路。
  11. 一种电子装置，其特征在于，包括：
    权利要求1-10任一项所述的显示屏；和
    感光元件，所述感光元件设置在所述显示屏的第一显示区下方。
  12. 一种显示屏的制造方法，其特征在于，包括：
    提供基板，所述基板包括第一区域和第二区域；
    提供多个第一像素单元，所述第一像素单元包括第一发光单元以及用于驱动所述第一发光单元发光的第一驱动电路，所述第一发光单元设置于所述第一驱动电路上；
    将所述第一发光单元和所述第一驱动电路一同转移安装在所述第一区域；
    在所述第二区域上设置多个第二像素单元，每个所述第二像素单元包括第二发光单元，第二驱动电路用于驱动所述第二发光单元发光，所述第一发光单元在所述基板上的投影面积小于所述第二发光单元在所述基板上的投影面积；
    封装所述多个第二像素单元以使所述多个第二像素单元封装在封装层内。
  13. 根据权利要求12所述的显示屏的制造方法，其特征在于，所述显示屏还包括第一显示区和第二显示区，所述第一显示区的像素密度与所述第二显示区的像素密度相同。
  14. 根据权利要求12所述的显示屏的制造方法，其特征在于，所述第一发光单元的寿命高于所述第二发光单元的寿命。
  15. 根据权利要求12所述显示屏的制造方法，其特征在于，所述制造方法还包括：
    在所述封装层上贴设偏光片。
  16. 根据权利要求12所述的显示屏的制造方法，其特征在于，所述第一像素单元通过以下步骤制造：
    提供第一晶圆；
    在所述第一晶圆上形成所述第一驱动电路；
    在所述第一驱动电路上形成间隔设置的多个第一发光单元；
    切割所述第一晶圆以得到第一像素单元单体。
  17. 根据权利要求16所述的显示屏的制造方法，其特征在于，所述在所述第一驱动电路上形成间隔设置的多个第一发光单元，包括：
    将带有衬底的第二晶圆设置在所述第一驱动电路上；
    去除所述衬底；
    在所述第二晶圆上形成多个所述第一发光单元。
  18. 根据权利要求16所述的显示屏的制造方法，其特征在于，所述在所述第二晶圆上形成多个所述第一发光单元，包括：
    在所述第二晶圆上形成多个中间体，每个中间体包括多个同种颜色的微型发光二极管；
    将所述多个同颜色的微型发光二极管进行颜色转化以得到所述第一发光单元，其中，所述第一发光单元包括红色微型发光二极管、绿色微型发光二极管和蓝色微型发光二极管。
  19. 一种显示屏的制造方法，其特征在于，包括：
    提供基板，所述基板包括第一区域和第二区域；
    提供第一驱动电路；
    在所述第一驱动电路生长形成第一发光单元；
    将所述第一发光单元和所述第一驱动电路一同转移安装在所述第一区域；
    在所述第二区域上设置多个第二像素单元，每个所述第二像素单元包括第二发光单元，第二驱动电路用于驱动所述第二发光单元发光，所述第一发光单元在所述基板上的投影面积小于所述第二发光单元在所述基板上的投影面积。
  20. 一种像素单元的制造方法，其特征在于，包括：
    提供第一晶圆；
    在所述第一晶圆上形成所述第一驱动电路；
    在所述第一驱动电路上形成间隔设置的多个第一发光单元；
    切割所述第一晶圆以得到第一像素单元单体。
PCT/CN2021/114257 2020-10-22 2021-08-24 显示屏、电子装置和制造方法 Ceased WO2022083271A1 (zh)

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