WO2022083548A1 - 摄像模组和电子设备 - Google Patents

摄像模组和电子设备 Download PDF

Info

Publication number
WO2022083548A1
WO2022083548A1 PCT/CN2021/124444 CN2021124444W WO2022083548A1 WO 2022083548 A1 WO2022083548 A1 WO 2022083548A1 CN 2021124444 W CN2021124444 W CN 2021124444W WO 2022083548 A1 WO2022083548 A1 WO 2022083548A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
image sensor
circuit board
camera module
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/124444
Other languages
English (en)
French (fr)
Inventor
郑鸿
曾磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP21881964.7A priority Critical patent/EP4216535B1/en
Publication of WO2022083548A1 publication Critical patent/WO2022083548A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Definitions

  • the present application relates to the field of imaging technologies, and in particular, to a camera module and an electronic device.
  • the image sensor and the circuit board are often electrically connected through wires.
  • the wires are prone to collapse or cycloid problems, resulting in a short circuit between adjacent wires, which affects the reliability of the camera module.
  • the present application provides a camera module and an electronic device, which can avoid the collapse or cycloid of the wire, which leads to the problem of short circuit caused by contact between adjacent wires, and improve the reliability of the camera module.
  • the present application provides a camera module, which can be used in electronic equipment.
  • the camera module includes an image sensor, a circuit board, a first wire, a second wire and an insulating glue part.
  • the image sensor is mounted on the circuit board, the first wire is connected between the circuit board and the image sensor, and the second wire is connected between the circuit board and the image sensor. between the image sensors and spaced from the first wire, the length of the second wire is greater than the length of the first wire, the insulating glue part is in contact with the top surface of the circuit board, and at least covers the first wire and the second wire close to the circuit board. part.
  • the insulating glue part can be formed by first curing through a dispensing process, and then curing through natural curing, ultraviolet curing, or thermal curing.
  • the insulating glue part covers at least the part of the first wire and the second wire close to the circuit board, so as to protect and fix the first wire and the second wire, which is helpful to improve the first wire and the second wire.
  • the arc stability prevents the first wire and the second wire from being cycloid or collapsing due to human touch during the assembly process of the camera module, or due to overstress caused by external pressure during the use of the camera module.
  • the cycloid or collapse avoids the problem of short circuit caused by the mutual contact between the first wire and the second wire due to the cycloid or the collapse.
  • first wires and second wires there are a plurality of first wires and a plurality of second wires, and along a direction parallel to the top surface of the circuit board, the plurality of first wires and the plurality of second wires are alternately arranged.
  • the plurality of first wires and the plurality of second wires are alternately arranged.
  • the Y-axis direction refers to the width direction of the camera module.
  • staggered distribution of the plurality of first wires and the plurality of second wires means that the plurality of first wires and the plurality of second wires are not singlely arranged, and there are one or more wires between the two first wires.
  • the second wire or alternatively, there is one or more first wires between two second wires.
  • the insulating glue part is also in contact with the top surface of the image sensor, and covers the part of the first wire and the second wire close to the image sensor, so as to assist in fixing the first wire and the second wire, and improve the first wire and the second wire. Arc stability of two conductors.
  • the top surface of the image sensor includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the insulating glue portion is located outside the photosensitive area to prevent the insulating glue portion from affecting the photosensitive area to receive light imaging and improve the imaging quality of the camera module.
  • a simple glue dispensing and curing equipment can be used, and an insulating glue part can be formed through the glue dispensing and curing process to protect the first wire and the second wire.
  • One lead and the second lead are plastic-encapsulated, which avoids the problem of micro-cracks or even damage caused by the image sensor being squeezed by the plastic-encapsulation mold due to excessive stress, which helps to reduce the production cost of the camera module and improve the yield. .
  • the insulating glue portion covers the highest positions of the first wire and the second wire, so as to improve the arc stability of the first wire and the second wire.
  • the highest position of the first wire and the second wire refers to the position where the first wire and the second wire are farthest from the top surface of the circuit board.
  • the insulating glue part completely covers the first wire and the second wire, so as to completely protect and fix the first wire and the second wire, and ensure the arc stability of the first wire and the second wire.
  • the image sensor is mounted on the top surface of the circuit board, or the circuit board is provided with a mounting slot, the opening of the mounting slot is located on the top surface of the circuit board, the image sensor is mounted on the mounting slot, and the insulating glue part is also connected to the image sensor. surface contact.
  • the top surface of the image sensor is provided with a first pad and a second pad spaced from each other
  • the top surface of the circuit board is provided with a first gold finger and a second gold finger spaced from each other, and the first gold finger And the second gold finger is exposed relative to the image sensor
  • the second gold finger is located on the side of the first gold finger away from the image sensor
  • the first wire is connected between the first gold finger and the first pad
  • the second wire is connected to the first gold finger.
  • the insulating glue portion covers the first gold finger and the second gold finger.
  • the length of the first wire is between 200 ⁇ m and 1000 ⁇ m, and the length of the second wire is between 600 ⁇ m and 1400 ⁇ m.
  • the length of the first wire ranges from 200 ⁇ m to 1000 ⁇ m, which means that the length of the first wire can be not only any value between 200 ⁇ m and 1000 ⁇ m, but also an endpoint value of 200 ⁇ m or 1000 ⁇ m.
  • the length of the second wire ranges from 600 ⁇ m to 1400 ⁇ m, which means that the length of the second wire can be not only any value between 600 ⁇ m and 1400 ⁇ m, but also an endpoint value of 600 ⁇ m or 1400 ⁇ m.
  • the distance between the first wire and the second wire is equal to or greater than 40 ⁇ m.
  • the camera module further includes a bracket, a filter, a lens base and a lens
  • the bracket is mounted on the top side of the circuit board
  • the bracket has a light-through hole corresponding to the image sensor
  • the filter is mounted on the bracket and Covering the light hole
  • the lens base is installed on the top side of the bracket
  • the lens is installed on the inner side of the lens base to condense the light outside the camera module.
  • the lens can condense the external light, and transmit the condensed external light from the filter to the image sensor to form a corresponding image on the image sensor.
  • the present application provides an electronic device including a casing and any one of the above-mentioned camera modules, wherein the camera module is installed inside the casing.
  • the insulating glue part is used to cover at least the part of the first wire and the second wire close to the circuit board to protect and fix the first wire and the second wire, it is helpful to improve the arc of the first wire and the second wire Stability, to prevent the first wire and the second wire from being cycloid or collapsing due to human touch during the assembly process of the camera module, or cycloid or cycloid or collapsed due to overstress under external pressure during the use of the camera module.
  • the collapse avoids the problem of short circuit caused by the mutual contact between the first wire and the second wire due to cycloid or collapse, which can reduce the product failure feedback ratio of the camera module and help prolong the service life of the electronic equipment.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is the structural representation of the camera module in the electronic equipment shown in Fig. 1;
  • FIG. 3 is a schematic diagram of a partially exploded structure of the camera module shown in FIG. 2 under an embodiment
  • FIG. 4 is a schematic cross-sectional structure diagram of the camera module shown in FIG. 2 cut along the I-I direction;
  • FIG. 5 is a schematic diagram of a partial assembly structure of a circuit board and an image sensor in the camera module shown in FIG. 3;
  • FIG. 6 is a schematic cross-sectional structural diagram of the structure shown in FIG. 5 cut along the II-II direction;
  • FIG. 7 is a schematic diagram of a partial assembly structure of a circuit board and an image sensor of a camera module in a second electronic device provided by an embodiment of the present application;
  • FIG. 8 is a schematic cross-sectional structure diagram of the structure shown in FIG. 7 cut along the III-III direction;
  • FIG. 9 is a schematic diagram of a partial assembly structure of a circuit board and an image sensor of a camera module in a third electronic device provided by an embodiment of the present application.
  • Fig. 10 is the cross-sectional structure schematic diagram of the structure shown in Fig. 9 cut along the IV-IV direction;
  • FIG. 11 is a schematic diagram of a partial assembly structure of a circuit board and an image sensor of a camera module in a fourth electronic device provided by an embodiment of the present application;
  • FIG. 12 is a schematic cross-sectional structure diagram of the structure shown in FIG. 11 taken along the V-V direction.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 may be an electronic product with a camera function, such as a mobile phone, a tablet computer, a notebook computer, a car machine, a point of sales terminal (point of sales terminal, POS machine for short), or a wearable device.
  • the wearable device may be a smart bracelet, a smart watch, augmented reality (AR) glasses, virtual reality (virtual reality, VR) glasses, and the like.
  • AR augmented reality
  • VR virtual reality
  • the width direction of the electronic device 100 is defined as the X-axis direction
  • the length direction of the electronic device 100 is defined as the Y-axis direction
  • the thickness direction of the electronic device 100 is defined as the Z-axis direction
  • the X-axis direction is defined as the Y-axis direction
  • the Z-axis direction is defined as the Z-axis direction
  • the X-axis direction is defined as the Y-axis direction
  • the directions are perpendicular to each other.
  • the electronic device 100 includes a casing 10 , a display module 20 , a camera module 30 and an image processor 40 .
  • the casing 10 includes a frame 11 and a back cover 12 , and the back cover 12 is fixed to one side of the frame 11 .
  • the frame 11 and the back cover 12 may be fixed to each other by assembling, or may be integrally formed structural components.
  • the display module 20 is mounted on the casing 10 and is enclosed with the casing 10 to form the interior of the electronic device 100 . Specifically, the display module 20 is fixed on the side of the frame 11 away from the back cover 12 . That is, the display module 20 and the back cover 12 are respectively fixed on opposite sides of the frame 11 .
  • the display module 20 is provided with a light-transmitting area 201 , and light from outside the electronic device 100 can enter the interior of the electronic device 100 through the light-transmitting area 201 .
  • the camera module 30 and the image processor 40 are installed inside the casing 10 .
  • the inside of the casing 10 is the inside of the electronic device 100 .
  • the camera module 30 can collect light outside the electronic device 100 through the light-transmitting area 201 and form corresponding image data.
  • the image processor 40 is electrically connected to the camera module 30 , and the image processor 40 is used for acquiring image data from the camera module 30 and processing the image data.
  • the image data processed by the image processor 40 can be displayed on the display module 20 , can also be stored in the memory of the electronic device 100 , or can also be stored in the cloud through the electronic device 100 .
  • the camera module 30 is located on the side of the electronic device 100 close to the display module 20 , and is used as a front camera module of the electronic device 100 . It should be noted that, in other embodiments, the camera module 30 may also be located on the side of the electronic device 100 away from the display module 20 and used as a rear camera module of the electronic device 100 . At this time, the rear cover 12 is provided with a camera hole, and the camera module 30 collects the light outside the electronic device 100 through the camera hole of the rear cover 12 . In other words, the camera module 30 can be used as both a front camera module of the electronic device 100 and a rear camera module of the electronic device 100 . Alternatively, the electronic device 100 may include multiple (two or more) camera modules 30, at least one camera module 30 is used as a front camera module of the electronic device 100, and at least one camera module 30 is used as an electronic device 100 rear camera module.
  • FIG. 2 is a schematic structural diagram of the camera module 30 in the electronic device 100 shown in FIG. 1 .
  • FIG. 3 is a schematic diagram of a partially exploded structure of the camera module 30 shown in FIG. 2 under an embodiment.
  • the width direction of the camera module 30 is the X-axis direction
  • the length direction of the camera module 30 is the Y-axis direction
  • the height direction of the camera module 30 is the Z-axis direction.
  • the camera module 30 includes a circuit board 31 , an image sensor 32 , a bracket 33 , a filter 34 , a lens base 35 and a lens 36 .
  • the circuit board 31 is electrically connected to the image processor 40 , so that the camera module 30 is electrically connected to the image processor 40 .
  • the circuit board 31 includes a top surface 311 and a bottom surface 312 disposed opposite to each other. Both the top surface 311 and the bottom surface 312 of the circuit board 31 are parallel to the X-Y plane (may also be substantially parallel to the X-Y plane, that is, a slight deviation is allowed).
  • both the top surface 311 and the bottom surface 312 of the circuit board 31 are perpendicular to the Z-axis direction (may also be substantially perpendicular to the Z-axis direction, that is, a slight deviation is allowed).
  • the circuit board 31 is provided with an installation groove 313 , and the opening of the installation groove 313 is located on the top surface 311 of the circuit board 1 .
  • the opening of the mounting groove 313 is located in the middle area of the top surface 311 , and the mounting groove 313 is recessed from the top surface 311 to the bottom surface 312 of the circuit board 1 .
  • orientation terms such as “top” and “bottom” involved in this application are described with reference to the orientation of FIG. 2, and do not indicate or imply that the referred device or element must have a specific orientation , are constructed and operated in a specific orientation, and therefore should not be construed as limiting the application.
  • FIG. 4 is a schematic cross-sectional structure diagram of the camera module 30 shown in FIG. 2 cut along the I-I direction.
  • cut along the I-I direction refers to the cut along the I-I line and the plane where the arrows at both ends of the I-I line are located, and the description of the accompanying drawings will be hereinafter understood in the same way.
  • the circuit board 31 includes a board body 31a and a substrate 31b.
  • the top surface of the substrate 31b is fixed to the bottom surface of the connection plate body 31a.
  • the top surface of the circuit board 31 is formed on the top surface of the board body 31a, and the bottom surface of the circuit board 31 is formed on the bottom surface of the substrate 31b.
  • the substrate 31b is used to reinforce the board body 31a, so that the circuit board 31 has sufficient structural strength to better support other devices and structures.
  • the substrate 31b may be made of stainless steel, copper, steel, or ceramic materials, or the like.
  • the substrate 31b can also be used for heat conduction, so that the heat of the circuit board 31 and the devices fixed on the circuit board 31 can be quickly dissipated, so as to improve the reliability of the camera module.
  • the circuit board 31 may further include an adhesive layer 31c.
  • the adhesive layer 31c is located between the substrate 31b and the plate body 31a, the top surface of the substrate 31b is adhered to the adhesive layer 31c, the adhesive layer 31c is adhered to the bottom surface of the plate body 31a, and the substrate 31b and the plate body 31a pass through.
  • the adhesive means are fixed to each other.
  • the adhesive layer 31c may be a conductive adhesive or a non-conductive adhesive.
  • the substrate 31b can also be fixed to the board body 31a by welding.
  • the circuit board 31 may further include a solder layer, and the solder layer is located between the substrate 31b and the board body 31a, and is used for fixedly connecting the substrate 31b and the board body 31a.
  • the circuit board 31 may be a flexible and rigid circuit board.
  • the board body 31a includes a first hard board part 311a, a soft board part 312a and a second hard board part 313a arranged in sequence, and the board surface area of the first hard board part 311a is larger than that of the second hard board part 313a
  • the first hard board part 311a and the second hard board part 313a are rigid board parts
  • the soft board part 312a is a flexible board part
  • the flexible board part is easier to bend than the rigid board part.
  • the substrate 31b is fixed to the first hard board portion 311a, and the top surface of the first hard board portion 311a away from the substrate 31b is the top surface 311 of the circuit board 31 described above.
  • the circuit board 31 may further include a reinforcing plate fixed to the second hard plate portion 313a.
  • the board body 31a is a flexible board member, the board body 31a includes a first area, a second area and a third area arranged in sequence, and the area of the first area is larger than that of the third area.
  • the substrate 31b is fixed on the first region, and the top surface of the first region away from the substrate 31b is the top surface 311 of the circuit board 31 above.
  • the circuit board 31 may further include a reinforcing plate fixed to the second area.
  • the plate body 31a has a through hole (not shown in the figure), and the installation slot 313 (as shown in FIG. 3 ) includes the through hole of the plate body 31a.
  • the adhesive layer 31c (or the solder layer) has through holes (not shown), and the through holes of the adhesive layer 31c communicate with the through holes of the board body 31a. In the embodiments of the present application, two spaces are "connected", which means that the two spaces are connected and communicated.
  • the mounting groove 313 also includes a through hole for the adhesive layer 31c (or solder layer). The region where the top surface of the substrate 31b faces the through hole of the board body 31a forms the groove bottom wall of the mounting groove 313 .
  • the processing difficulty of the installation groove 313 is relatively small, which is beneficial to improve the processing accuracy.
  • the installation groove 313 may further include a groove formed on the plate body 31a.
  • the mounting groove includes a through hole formed in the board body 31a, a through hole formed in the adhesive layer 31c, and a groove formed in the substrate 31b.
  • the image sensor 32 is mounted on the circuit board 31 and is electrically connected to the circuit board 31 .
  • the image sensor 32 is installed in the installation groove 313 . That is, the image sensor 32 can be fixed to the circuit board 31 from the top side of the circuit board 31 .
  • the image sensor 32 is installed on the bottom wall of the installation groove 313 .
  • the image sensor 32 is installed in the middle area of the bottom wall of the installation groove 313 , and is spaced apart from the side wall of the installation groove 313 .
  • the image sensor 32 may be mounted on the bottom wall of the mounting slot 313 by means of adhesive bonding.
  • the camera module 30 may include a first adhesive layer 50 , and the first adhesive layer 50 is adhered between the image sensor 32 and the bottom wall of the installation groove 313 .
  • the image sensor 32 may be a chip.
  • the height of the image sensor 32 is smaller than the groove depth of the mounting groove 313 of the circuit board 31 .
  • the height of the image sensor 32 refers to the size of the image sensor 32 in the height direction of the camera module 30 (ie, the Z-axis direction in the figure).
  • the image sensor 32 is completely embedded in the circuit board 31 , and the image sensor 32 and the circuit board 31 can reuse the thickness space of the camera module 30 , which is beneficial to reduce the height of the camera module 30 .
  • the bracket 33 is mounted on the top side of the circuit board 31 .
  • the bracket 33 is mounted on the top surface 311 of the circuit board 31 .
  • the bracket 33 is installed on the edge area of the top surface 311 and covers the top of the image sensor 32 .
  • the bracket 33 may be mounted on the top surface 311 of the circuit board 31 by means of bonding.
  • the camera module 30 may include the second adhesive layer 60 , and the second adhesive layer 60 is adhered between the bracket 33 and the top surface 311 of the circuit board 31 .
  • brackets 33 are installed on the top side of the circuit board 31 , which means that at least most of the brackets 33 are located on the top side of the circuit board 31 .
  • the bracket 33 is fixed with the top surface 311 of the circuit board 31 .
  • the bracket 33 can also be fixed with the peripheral surface (not marked) of the circuit board 31 , or the bracket 33 can be fixed with the top surface 311 and the peripheral surface of the circuit board 31 .
  • the bracket 33 includes a top surface 331 facing away from the circuit board 31 .
  • the bracket 33 has a light-passing hole 332 , and the opening of the light-passing hole 332 is located on the top surface 331 of the bracket 33 .
  • the opening of the light-passing hole 332 is located in the middle area of the top surface 331 .
  • the light-passing hole 332 is recessed from the top surface 331 of the bracket 33 toward the circuit board 31 and penetrates the bracket 33 along the Z-axis direction.
  • the light-transmitting hole 332 corresponds to the image sensor 32 .
  • the light-passing hole 332 corresponding to the image sensor 32 means that part or all of the projection of the light-passing hole 332 on the circuit board 31 overlaps with the image sensor 32 to ensure that the image sensor 32 can receive the light from the light-passing hole 332 Light entering the interior of the bracket 33 .
  • the light-transmitting hole 332 is a closed hole (ie, the light-transmitting hole 332 has a complete hole wall).
  • the hole wall of the light-passing hole 332 may be relatively vertical or relatively inclined to the top surface 331 of the bracket 33 .
  • the hole wall of the light-passing hole 332 partially protrudes to form the supporting portion 333 .
  • the supporting portion 333 is in the form of a continuous closed ring. In other embodiments, the supporting portion 333 may also be in a discontinuous annular shape. It should be understood that the shape of the supporting portion 333 is not limited to the square ring shown in FIG. 3 , but may also be a circular ring, which is not specifically limited in this application.
  • the bracket 33 may also have positioning marks (not shown). Specifically, the positioning mark is located on the top surface 331 of the bracket 33 to facilitate the rapid positioning of the lens base 35 and the bracket 33 during the assembly process of the camera module 30 and to improve the assembly between the lens base 35 and the bracket 33 Accuracy and assembly efficiency. Exemplarily, there may be four positioning marks, and the four positioning marks are spaced apart and arranged around the light-transmitting hole 332 . It should be noted that, in some other embodiments, the bracket 33 may also not have a positioning mark, and the lens base 35 may be positioned with the bracket 33 in other ways, which is not specifically limited in this application.
  • the filter 34 is mounted on the bracket 33 and covers the light-transmitting hole 332 .
  • the filter 34 is accommodated in the light-transmitting hole 332 and corresponds to the image sensor 32 . After being filtered by the filter 34, the external light is received by the image sensor 32, and the image sensor 32 converts the light to form an image.
  • the filter 34 is mounted on the top surface of the support portion 333 in the light-passing hole 332 (not marked in the figure).
  • the filter 34 may be fixed on the top surface of the supporting portion 333 by means of adhesive bonding.
  • the camera module 30 may include a third adhesive layer 70 , and the third adhesive layer 70 is adhered between the filter 34 and the bracket 33 .
  • the filter 34 includes but is not limited to an infrared cut filter or a fully transparent spectral filter.
  • the filter 34 covering the light-through hole 332 means that the filter 34 covers the narrowest position of the light-through hole 332 , and external light can only enter the inside of the bracket 33 through the filter 34 .
  • the filter 34 may also be partially accommodated in the light-through hole 332 , or the filter 34 covers the opening of the light-through hole 332 .
  • the lens base 35 is mounted on the top side of the bracket 33 . Specifically, the lens base 35 is fixed on the top surface 331 of the bracket 33 . The lens base 35 is fixed on the edge area of the top surface 331 . Exemplarily, the lens base 35 may be fixed to the bracket 33 by means of bonding.
  • the camera module 30 may include a fourth adhesive layer 80 , and the fourth adhesive layer 80 is adhered between the lens base 35 and the bracket 33 .
  • the lens base 35 can be fixed to the bracket 33 by welding.
  • the camera module 30 may include a solder layer, and the solder layer is fixedly connected between the lens base 35 and the bracket 33 .
  • the lens base 35 includes a top surface 351 facing away from the bracket 33 and a bottom surface 352 disposed opposite to the top surface 351 .
  • the lens base 35 includes a mounting slot 353 , and the opening of the mounting slot 353 is located in the middle area of the top surface 351 .
  • the mounting groove 353 extends from the top surface 351 of the lens base 35 toward the bottom surface 352 , and penetrates through the bottom surface 352 of the lens base 35 . That is, the mounting groove 353 penetrates the lens base 35 from the height direction of the lens base 35 .
  • the installation slot 353 is opposite to the light through hole 332 . That is, the mounting groove 353 is facing the image sensor 32 .
  • the light from the outside of the camera module 30 can enter the interior of the bracket 33 from the installation slot 353 and the light-passing hole 332 and be received by the image sensor 32 .
  • the lens 36 is attached to the inner side of the lens base 35 .
  • the lens 36 is installed in the installation groove 353 of the lens base 35 .
  • the lens 36 may be fixed to the lens base 35 by means of bonding.
  • the camera module 30 may include a fifth adhesive layer 90 , and the fifth adhesive layer 90 is adhered between the lens 36 and the lens base 35 .
  • the lens 36 is used for condensing the light outside the camera module 30 . That is, the lens 36 can condense the external light, and project the condensed external light from the filter 34 to the image sensor 32 to form a corresponding image on the image sensor 32 .
  • the lens 36 may include a lens barrel and a lens group fixed inside the lens barrel. Exemplarily, the number of lenses in the lens group may be multiple, such as 5, or 6, or 7, or 8, and so on.
  • the lens base 35 is a motor.
  • the motor can be an auto-focus motor, and the auto-focus motor can drive the lens group to move in a direction parallel to the optical axis of the lens 36 .
  • the motor may be an optical anti-shake motor, which can drive the lens group to move on a plane perpendicular to the optical axis of the lens 36 , or drive the lens group to flip to tilt relative to the optical axis of the lens 36 .
  • the motors may be autofocus and optical image stabilization motors.
  • the motor may be a voice coil motor (VCM), or a memory alloy motor or the like. This application does not strictly limit the specific function and type of the motor.
  • the lens base 35 can also be a bracket structure. At this time, the camera module 30 is a fixed-focus module.
  • FIG. 5 is a schematic diagram of a partial assembly structure of the circuit board 31 and the image sensor 32 in the camera module 30 shown in FIG. 3
  • FIG. 6 is a section of the structure shown in FIG. 5 cut along the direction II-II Schematic.
  • the top surface 311 of the circuit board 31 is provided with a first gold finger 314 and a second gold finger 315 spaced apart from each other. Specifically, the first gold finger 314 and the second gold finger 315 are electrically connected to the circuit board 31 and both are exposed relative to the image sensor 32 .
  • the second gold finger 315 is located on the side of the first gold finger 314 away from the image sensor 32 . That is, the second gold finger 315 and the image sensor 32 are located on both sides of the first gold finger 314, respectively.
  • the positions of the first gold finger 314 and the second gold finger 315 are not limited to the ones protruding from the top surface 311 of the circuit board 31 as shown in FIG.
  • the top surface 311 of the circuit board 31 is flush, or embedded in the circuit board 31 and recessed relative to the top surface 311 of the circuit board 31 , that is, embedded in the circuit board 31 and located on the top surface 311 and the bottom surface 311 of the circuit board 311 In between, this application does not specifically limit it.
  • first golden fingers 314 and second golden fingers 315 there are multiple first golden fingers 314 and second golden fingers 315 , and the multiple first golden fingers 314 and the multiple second golden fingers 315 are all arranged near the opening of the installation groove 313 .
  • some of the first gold fingers 314 are spaced from each other along the Y-axis direction to form a first gold finger group, and some of the first gold fingers 314 are spaced from each other along the Y-axis direction to form a second gold finger group.
  • the first gold finger group and the second gold finger group are respectively arranged on opposite sides of the opening of the installation slot 313 with an interval along the X-axis direction.
  • Parts of the second gold fingers 315 are spaced apart from each other along the Y-axis direction to form a third gold finger group, and some of the second gold fingers 315 are spaced apart from each other along the Y-axis direction to form a fourth gold finger group, the third gold finger group and the fourth gold finger group.
  • the gold fingers are respectively arranged on opposite sides of the opening of the mounting slot 313 at intervals along the X-axis direction.
  • the third gold finger group and the first gold finger group are located on the same side of the opening of the installation groove 313 , and are located on the side of the first gold finger group away from the opening of the installation groove 313 .
  • the openings of the third gold finger group and the mounting slot 313 are located on opposite sides of the first gold finger 314 respectively.
  • the fourth gold finger set and the second gold finger set are located on the same side of the opening of the installation slot 313 , and on the side of the second gold finger set away from the opening of the installation slot 313 . That is, the openings of the fourth gold finger group and the installation slot 313 are located on opposite sides of the second gold finger group, respectively.
  • the image sensor 32 includes a top surface 321 facing the same as the top surface 311 of the circuit board 31 .
  • the top surface 321 of the image sensor 32 includes a photosensitive area 322 and a non-photosensitive area 323 surrounding the photosensitive area 322 .
  • the photosensitive area 322 is located in the middle area of the top surface 321 of the image sensor 32 for receiving the light filtered by the filter 34 .
  • the non-photosensitive area 323 is located at the edge area of the top surface 321 of the image sensor 32 , and is used to realize the electrical connection between the image sensor 32 and the circuit board 31 .
  • the top surface 321 of the image sensor 32 is provided with first pads 324 and second pads 325 spaced apart from each other. Specifically, the first pad 324 and the second pad 325 are electrically connected to the image sensor 32 , and are both disposed on the non-photosensitive area 323 of the top surface 321 . Wherein, there are multiple first pads 324 and second pads 325 .
  • first pads 324 and some of the second pads 325 are staggered along the Y-axis direction to form a first pad group, and some of the first pads 324 and some of the second pads 325 are staggered along the Y-axis direction to form The second pad group, the first pad group and the second pad group are arranged in the non-photosensitive area 323 of the top surface 321 at intervals along the X-axis direction.
  • the positions of the first pads 324 and the second pads 325 are not limited to being protruded from the top surface 321 of the image sensor 32 as shown in FIG.
  • the top surface 321 of the image sensor 32 is flush, or, embedded in the image sensor 32 and recessed relative to the top surface 321 of the image sensor 32, that is, embedded in the image sensor 32 and located on the top surface 321 and the bottom surface of the image sensor 32 ( Not marked in the figure), this application does not make any specific limitation.
  • the number of the first pads 324 matches the number of the first gold fingers 314
  • the number of the second pads 325 matches the number of the second gold fingers 315
  • the number of the first pads 324 is the same as the number of the first gold fingers 314
  • the number of the second pads 325 is the same as the number of the second gold fingers 315
  • the number of the first pads 324 may be more or less than the number of the first gold fingers 314
  • the number of the second pads 325 may also be more or less than the number of the second gold fingers 314 . Number of fingers 315.
  • the camera module 30 further includes a first wire 37 and a second wire 38.
  • the first wire 37 is connected between the circuit board 31 and the image sensor 32
  • the second wire 38 is connected between the circuit board 31 and the image sensor 32, and is connected with the circuit board 31 and the image sensor 32.
  • the first wires 31 are spaced apart from each other.
  • the first wire 37 and the second wire 38 may be made of materials such as gold, copper, and aluminum.
  • the image sensor 32 is connected to the board body 31 a of the circuit board 31 through the first wire 37 and the second wire 38 to electrically connect the circuit board 31 .
  • both the first wire 37 and the second wire 38 can be formed by a wire bonding (WB) process, and the wire bonding process can also be referred to as a pressure bonding process, a bonding process, a bonding process or a wire bonding process.
  • WB wire bonding
  • first wires 37 and second wires 38 there are multiple first wires 37 and second wires 38 .
  • the number of the first wires 37 is the same as that of the first pads 324 and the first gold fingers 314 , and each of the first wires 37 is connected between a first gold finger 314 and a first pad 324 .
  • each of the first wires 37 includes a first end portion 371 , a second end portion 372 and a connecting portion 373 , and the connecting portion 373 is connected between the first end portion 371 and the second end portion 372 .
  • the first end 371 of the first wire 37 is fixed to a first gold finger 314
  • the second end 372 is fixed to a second pad 325 .
  • the length of the first wire 37 is between 200 ⁇ m and 1000 ⁇ m, and the height of the first wire 37 (ie, the dimension along the Z-axis direction) is between 80 ⁇ m and 120 ⁇ m.
  • the length of the first wire 37 ranges from 200 ⁇ m to 1000 ⁇ m, which means that the length of the first wire 37 can be not only any value between 200 ⁇ m and 1000 ⁇ m, but also an endpoint value of 200 ⁇ m or 1000 ⁇ m.
  • the height of the first wire 37 is between 80 ⁇ m and 120 ⁇ m, which means that the height of the first wire 37 can be not only any resin between 80 ⁇ m and 120 ⁇ m, but also the endpoint value of 80 ⁇ m or 120 ⁇ m.
  • the number of the second wires 38 is the same as the number of the second pads 325 and the second gold fingers 315 .
  • Each of the second wires 38 is connected between a second gold finger 315 and a second pad 325 and is spaced apart from the adjacent first wires 37 .
  • the plurality of second wires 38 and the plurality of first wires 37 are alternately arranged along a direction parallel to the top surface 311 of the circuit board 31 .
  • the plurality of second wires 38 and the plurality of first wires 37 are alternately arranged.
  • the distance w between the second wire 38 and the adjacent first wire 37 is greater than or equal to 40 ⁇ m, so as to avoid the problem of short circuit caused by the contact of the second wire 38 with the first wire 37 .
  • the staggered distribution of the plurality of first wires 37 and the plurality of second wires 38 means that the plurality of first wires 37 and the plurality of second wires 37 are not singly arranged, but between the two first wires 37 There are one or more second wires 38 , or one or more first wires 37 between two second wires 38 .
  • each second wire 38 includes a first end portion 381 , a second end portion 382 and a connecting portion 383 , and the connecting portion 383 is connected between the first end portion 381 and the second end portion 382 .
  • the first end portion 381 of each second wire 38 is connected to a second gold finger 315
  • the second end portion 382 is connected to a second pad 325 .
  • the length of the second wire 38 is greater than the length of the first wire 37 , and the length of the second wire 38 is between 600 ⁇ m and 1400 ⁇ m.
  • the height of the second wire 38 is the same as the height of the first wire 37 .
  • the height of the second wire 38 may also be different from the height of the first wire 37, that is, the height of the second wire 38 may be smaller than the height of the first wire 37, or the height of the second wire 38 may be greater than the height of the first wire 37.
  • the height of a wire 37 may also be different from the height of the first wire 37, that is, the height of the second wire 38 may be smaller than the height of the first wire 37, or the height of the second wire 38 may be greater than the height of the first wire 37.
  • the length of the second wire 38 ranges from 600 ⁇ m to 1400 ⁇ m, which means that the length of the second wire 38 can be not only any value between 600 ⁇ m and 1400 ⁇ m, but also an endpoint value of 600 ⁇ m or 1400 ⁇ m.
  • the camera module 30 further includes an insulating glue portion 39 , and the insulating glue portion 39 is in contact with the top surface 311 of the circuit board 31 .
  • the insulating glue portion 39 may be formed by firstly passing through a glue dispensing process, and then curing through natural curing, ultraviolet curing, or thermal curing.
  • the insulating glue portion 39 covers at least part of the first wire 37 and part of the second wire 38 .
  • the insulating glue portion 39 covers at least the portion of the first wire 37 and the second wire 38 close to the circuit board 31 .
  • the insulating glue portion 39 covers the first end portion 371 of the first wire 37 and the portion of the connecting portion 373 close to the first end 371 to assist in fixing the first wire 37, improve the arc stability of the first wire 37, and avoid
  • the first wire 37 is cycloid due to human touch, or is deformed due to overstress under external force during use. , resulting in the problem that the first wire 37 and the second wire 38 contact each other and cause a short circuit.
  • the maximum distance H between the insulating glue portion 39 and the top surface 311 of the circuit board 31 is greater than the maximum distance h between the first wire 37 and the top surface 311 of the circuit board 31 . That is, the insulating glue portion 39 covers the highest position of the first wire 37 , which can effectively prevent the first wire 37 from collapsing and improve the arc stability of the first wire 37 .
  • the highest position of the first wire 37 refers to the position where the first wire 37 is farthest from the top surface 311 of the circuit board 31 .
  • the insulating glue portion 39 covers the first end portion 381 of the second wire 38 and the portion of the connecting portion 383 close to the first end 381 to assist in fixing the second wire 38 and prevent the second wire 38 from being damaged during the assembly process of the camera module 30 .
  • the short circuit problem caused by human touch or overstress caused by the cycloid and the contact with the first wire 37 during use reduces the product fault feedback ratio (FFR) of the camera module 30 .
  • FFR product fault feedback ratio
  • the insulating glue part 39 also covers the highest position of the second wire 38 to prevent the second wire 38 from being assembled in the camera module 30 . During the process, it collapses due to human touch or overstress during use, and the contact with the first gold finger 314 causes a short circuit.
  • the insulating glue portion 39 may not cover the highest position of the first wire 37 and/or the second wire 38 .
  • the second wire 38 collapses, the second wire 38 will not contact the first gold finger 314 to cause a short circuit due to the blocking by the insulating glue portion 39 .
  • the insulating glue part 39 does not cover the highest point of the first wire 37 and/or the second wire 38, it helps to reduce the inner height of the bracket 33 fixed above the circuit board 31, and further helps to reduce the camera The height of the module 30 realizes the miniaturization design of the camera module 30 .
  • the insulating glue portion 39 is in contact with the peripheral surface of the image sensor 32 and covers the first gold finger 314 and the second gold finger 315, so as to increase the connection stability between the insulating glue portion 39 and the circuit board 31, and further improve the connection stability of the insulating glue portion 39 to the first gold finger 314 and the second gold finger 315.
  • the insulating glue part 39 also covers a part of the top surface 311 of the circuit board 31 to increase the connection stability between the insulating glue part 39 and the circuit board 31 .
  • part of the insulating glue part 39 is located inside the installation groove 313 and is connected between the side surface of the image sensor 32 and the groove side wall of the installation groove 313 to further increase the connection stability between the insulating glue part 39 and the circuit board 31 .
  • the coverage area of the insulating glue portion 39 on the top surface 311 of the circuit board 31 can be controlled by processes such as selection of glue viscosity, control of the glue dispensing path, and curing parameters.
  • the top surface 311 of the circuit board 31 may further be provided with a third gold finger
  • the top surface 321 of the image sensor 32 may further be provided with a third pad
  • the camera module 30 may also be provided
  • a third wire is included, the third wire is connected between the third gold finger and the third pad, and the insulating glue portion 39 may cover part or all of the third wire, which is not specifically limited in this application.
  • FIG. 7 is a schematic diagram of a partial assembly structure of the circuit board 31 and the image sensor 32 of the camera module in the second electronic device provided by the embodiment of the present application
  • FIG. 8 is the structure shown in FIG. 7 along III - Schematic diagram of the cross-sectional structure cut in the III direction.
  • the insulating glue part 39 is also in contact with the top surface 321 of the image sensor 32 and covers the first wire 37 and the second wire 38 and is close to the image sensor Section 32. Specifically, the insulating glue portion 38 completely covers the first wire 37 and the second wire 38 .
  • the insulating glue portion 39 covers the first end portion 371 , the connecting portion 373 and the second end portion 372 of the first wire 37 , and the first end portion 381 , the connecting portion 383 and the second portion 382 of the second wire 38 , so as to The first wire 37 and the second wire 38 are fixed to prevent the two cycloids from touching each other and causing a short circuit.
  • the insulating glue part 39 also covers the first pad 324 and the second pad 325, so as to increase the connection stability of the insulating glue part 39 and the image sensor 32, and improve the connection between the insulating glue part 39 and the first wire 37 and the second wire. 38 fixed action. It should be understood that during the glue dispensing process, the fluid-like glue will flow within a certain range, therefore, the insulating glue portion 39 will also cover part of the area near the first pad 324 and the second pad 325, as shown in FIG. 8 As shown, the insulating glue part 39 also covers a partial area of the top surface 321 of the image sensor 32 to increase the connection stability between the insulating glue part 39 and the image sensor 32 .
  • the insulating glue portion 39 covers a part of the non-photosensitive area 323 of the image sensor 32 . That is, the insulating glue portion 39 is located outside the photosensitive region 322 of the image sensor 32 , that is, the insulating glue portion 39 does not cover the photosensitive region 322 of the image sensor 32 to prevent the insulating glue portion 39 from affecting the photosensitive region 322 to receive light for imaging.
  • a simple glue dispensing and curing device can be used, and the insulating glue portion 39 can be formed through the glue dispensing and curing process to protect the first wire 37 and the second wire 38 , and high-precision plastic packaging is not required.
  • the mold encapsulates the first lead 37 and the second lead 38, which avoids the problem of micro-cracks or even damage caused by the image sensor 32 being overstressed by the plastic encapsulation mold, which is helpful for reducing camera modules. 30 production cost, improve yield.
  • FIG. 9 is a schematic diagram of a partial assembly structure of the circuit board 31 and the image sensor 32 of the camera module in the third electronic device provided by the embodiment of the present application
  • FIG. 10 is the structure shown in FIG. 9 along IV - Schematic diagram of the cross-sectional structure cut in the IV direction.
  • the image sensor 32 is mounted on the top surface 311 of the circuit board 31 .
  • the image sensor 32 is installed in the middle area of the top surface 311 of the circuit board 31 .
  • the image sensor 32 may be mounted on the top surface of the circuit board 31 by means of bonding.
  • the camera module 30 may include a first adhesive layer 50 , and is bonded between the image sensor 32 and the circuit board 31 through the first adhesive layer 50 .
  • the insulating glue portion 39 covers part of the first wire 37 and part of the second wire 38 . Specifically, the insulating glue portion 39 covers the first end portion 371 of the first wire 37 and the portion of the connecting portion 373 close to the first end portion 371 .
  • the distance H of the insulating glue portion 39 in the positive direction of the Z axis is smaller than the distance h of the first wire 37 in the positive direction of the Z axis. That is, the insulating glue portion 39 does not cover the highest point of the first wire 37 .
  • the insulating glue portion 39 covers the first end portion 381 of the second wire 38 and the portion of the connecting portion 373 close to the first end portion 371 . Wherein, the insulating glue portion 39 does not cover the highest point of the second wire 38 . When the second wire 38 collapses, the second wire 38 will not contact the first gold finger 314 to cause a short circuit due to the blocking by the insulating glue portion 39 .
  • FIG. 11 is a schematic diagram of a partial assembly structure of the circuit board 31 and the image sensor 32 of the camera module in the fourth electronic device provided by the embodiment of the present application
  • FIG. 12 is the structure shown in FIG. 11 along V-V Schematic diagram of the cross-sectional structure cut in the direction.
  • the insulating glue portion 39 covers the first wire 37 and the second wire 38 .
  • the insulating glue portion 39 covers the first end portion 371 , the connection portion 373 and the second end portion 372 of the first wire 37 , and the first end portion 381 , the connection portion 373 and the second portion of the second wire 38 . That is, the insulating glue portion 39 covers the entire first wire 37 and the second wire 38 to fix the first wire 37 and the second wire 38 to prevent the two cycloids from touching each other and causing a short circuit.
  • the insulating glue part 39 also covers the first pad 324 and the second pad 325 to increase the connection stability between the insulating glue part 39 and the image sensor 32 and improve the connection between the insulating glue part 39 and the first wire 37 and the second wire 38 fixed effect. It should be understood that during the glue dispensing process, the fluid-like glue will flow within a certain range. Therefore, the insulating glue portion 39 will also cover part of the area near the first pad 324 and the second pad 325, as shown in FIG. 12 . As shown, the insulating glue part 39 also covers a partial area of the top surface 321 of the image sensor 32 to increase the connection stability between the insulating glue part 39 and the image sensor 32 .
  • the insulating glue part 39 covers part of the non-photosensitive area of the image sensor 32 . That is, the insulating glue portion 39 does not cover the photosensitive region of the image sensor 32, so as to prevent the insulating glue portion 39 from affecting the photosensitive region to receive light for imaging.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

本申请实施例提供一种摄像模组和电子设备。摄像模组包括图像传感器、电路板、第一导线、第二导线和绝缘胶部，图像传感器安装于电路板，第一导线连接于电路板与图像传感器之间，第二导线连接于电路板与图像传感器之间，且与第一导线彼此间隔，第二导线的长度大于第一导线的长度，绝缘胶部与电路板的顶面接触，且至少覆盖第一导线和第二导线靠近电路板的部分，以防止第一导线和第二导线发生摆线或塌陷，避免第一导线和第二导线相互接触产生的短路问题，提高摄像模组的可靠性。

Description

摄像模组和电子设备
本申请要求于2020年10月21日提交中国专利局、申请号为202022366181.3、申请名称为“摄像模组和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及成像技术领域，尤其涉及一种摄像模组和电子设备。
背景技术
传统摄像模组中，图像传感器与电路板之间往往通过导线实现电连接。然而，由于导线的稳定性较差，导线极易产生塌陷或摆线等问题，导致相邻导线之间接触发生短路，影响了摄像模组的使用可靠性。
发明内容
本申请提供一种摄像模组和电子设备，避免导线产生塌陷或摆线，导致相邻导线之间接触而短路问题，提高摄像模组的可靠性。
第一方面，本申请提供一种摄像模组，可以用于电子设备中。摄像模组包括图像传感器、电路板、第一导线、第二导线和绝缘胶部，图像传感器安装于电路板，第一导线连接于电路板与图像传感器之间，第二导线连接于电路板与图像传感器之间，且与第一导线彼此间隔，第二导线的长度大于第一导线的长度，绝缘胶部与电路板的顶面接触，且至少覆盖第一导线和第二导线靠近电路板的部分。
其中，绝缘胶部可先通过点胶工艺后，再经自然固化、紫外固化或热固化等方式固化后形成。
本申请所示摄像模组中，绝缘胶部至少覆盖第一导线和第二导线靠近电路板的部分，以保护和固定第一导线和第二导线，有助于提高第一导线和第二导线的线弧稳定性，防止第一导线和第二导线在摄像模组的组装过程中因人为触碰发生摆线或塌陷，或者在摄像模组的使用过程中在外力挤压下因过应力而摆线或塌陷，避免了第一导线和第二导线因摆线或塌陷发生相互接触而造成短路的问题。
一种实施方式中，第一导线和第二导线有多根，沿平行于电路板的顶面的方向，多根第一导线与多根第二导线交错排布。
一种实施方式中，沿Y轴方向上，多根第一导线与多根第二导线交错排布。其中，Y轴方向是指摄像模组的宽度方向。
应当理解的是，多根第一导线和多个第二导线交错分布是指多根第一导线和多根第二导线并不是单一地排布，两根第一导线之间有一根或多根第二导线，或者，两根第二导线之间有一根或多根第一导线。
一种实施方式中，绝缘胶部还与图像传感器的顶面接触，且覆盖第一导线和第二导线靠近图像传感器的部分，以辅助固定第一导线和第二导线，提高第一导线和第二导线的线弧稳定性。
一种实施方式中，图像传感器的顶面包括感光区和环绕感光区的非感光区，绝缘胶部位于感光区外，避免绝缘胶部影响感光区接收光线成像，提高摄像模组的成像质量。
本实施方式所示摄像模组中，可采用简单的点胶固化设备，通过点胶固化工艺即可形成绝缘胶部以保护第一导线和第二导线，不需要采用高精度的塑封模具对第一导线和第二导线进行塑封，避免了塑封模具对图像传感器进行挤压而使图像传感器受应力过大形成的微裂纹甚至损坏的问题，有助于降低摄像模组的生产成本，提高良率。
一种实施方式中，绝缘胶部覆盖第一导线和第二导线的最高位置，以提高第一导线和第二导线的线弧稳定性。
其中，第一导线和第二导线的最高位置是指第一导线和第二导线离电路板的顶面最远的位置。
一种实施方式中，绝缘胶部完整覆盖第一导线和第二导线，以完整保护和固定第一导线和第二导线，保证第一导线和第二导线的线弧稳定性。
一种实施方式中，图像传感器安装于电路板的顶面，或者，电路板设有安装槽，安装槽的开口位于电路板的顶面，图像传感器安装于安装槽，绝缘胶部还与图像传感器的周面接触。
一种实施方式中，图像传感器的顶面设有彼此间隔的第一焊盘和第二焊盘，电路板的顶面设有彼此间隔的第一金手指和第二金手指，第一金手指和第二金手指相对于图像传感器露出，第二金手指位于第一金手指背离图像传感器的一侧，第一导线连接于第一金手指和第一焊盘之间，第二导线连接于第二金手指和第二焊盘之间，绝缘胶部覆盖第一金手指和第二金手指。
一种实施方式中，第一导线的长度在200μm～1000μm之间，第二导线的长度在600μm～1400μm之间。
其中，第一导线的长度范围为200μm～1000μm，是指第一导线的长度不仅可以为200μm至1000μm之间的任意数值，还可以为端点值200μm或1000μm。
同样的，第二导线的长度范围为600μm～1400μm，是指第二导线的长度不仅可以为600μm至1400μm之间的任意数值，还可以为端点值600μm或1400μm。
一种实施方式中，第一导线和第二导线之间的距离等于或大于40μm。
一种实施方式中，摄像模组还包括支架、滤光片、镜头基座和镜头，支架安装于电路板的顶侧，支架具有对应于图像传感器的通光孔，滤光片安装于支架且覆盖通光孔，镜头基座安装于支架的顶侧，镜头安装于镜头基座的内侧，用以会聚摄像模组外部的光线。此时，镜头能够会聚外部的光线，并将会聚的外部光线自滤光片透射至图像传感器，以在图像传感器上形成相应的图像。
第二方面，本申请提供一种电子设备，包括壳体和上述任一种摄像模组，摄像模组安装于壳体的内部。
本申请中，由于采用绝缘胶部至少覆盖第一导线和第二导线靠近电路板的部分，以保护和固定第一导线和第二导线，有助于提高第一导线和第二导线的线弧稳定性，防止第一导线和第二导线在摄像模组的组装过程中因人为触碰发生摆线或塌陷，或者在摄像模组的使用过程中在外力挤压下因过应力而摆线或塌陷，避免了第一导线和第二导线因摆线或塌陷发生相互接触而造成短路的问题，能降低摄像模组的产品故障反馈比例，有助于延长电子设备的使用寿命。
附图说明
为了更清楚地说明本申请实施例或背景技术中的技术方案，下面将对本申请实施例或背景技术中所需要使用的附图进行说明。
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示电子设备中摄像模组的结构示意图；
图3是图2所示摄像模组在一种实施例下的部分分解结构示意图；
图4是图2所示摄像模组沿I-I方向剖开的剖面结构示意图；
图5是图3所示摄像模组中电路板与图像传感器的部分组装结构示意图；
图6是图5所示结构沿II-II方向剖开的剖面结构示意图；
图7是本申请实施例提供的第二种电子设备中摄像模组的电路板与图像传感器的部分组装结构示意图；
图8是图7所示结构沿III-III方向剖开的剖面结构示意图；
图9是本申请实施例提供的第三种电子设备中摄像模组的电路板与图像传感器的部分组装结构示意图；
图10是图9所示结构沿IV-IV方向剖开的剖面结构示意图；
图11是本申请实施例提供的第四种电子设备中摄像模组的电路板与图像传感器的部分组装结构示意图；
图12是图11所示结构沿V-V方向剖开的剖面结构示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
请参阅图1，图1是本申请实施例提供的一种电子设备100的结构示意图。
电子设备100可以是手机、平板电脑、笔记本电脑、车机、销售点终端(point of sales terminal，简称为POS机)或可穿戴设备等具有摄像功能的电子产品。其中，可穿戴设备可以是智能手环、智能手表、增强现实(augmented reality，AR)眼镜、虚拟现实技术(virtual reality，VR)眼镜等。本申请实施例以电子设备100是手机为例进行说明。
其中，为了便于描述，定义电子设备100的宽度方向为X轴方向，电子设备100的长度方向为Y轴方向，电子设备100的厚度方向为Z轴方向，X轴方向、Y轴方向和Z轴方向两两相互垂直。
本实施例中，电子设备100包括壳体10、显示模组20、摄像模组30以及图像处理器40。壳体10包括边框11和后盖12，后盖12固定于边框11的一侧。其中，边框11与后盖12可以通过组装方式彼此固定，也可以是一体成型的结构件。
显示模组20安装于壳体10，且与壳体10围合形成电子设备100的内部。具体的，显示模组20固定于边框11背离后盖12的一侧。即，显示模组20和后盖12分别固定于边框11的相对两侧。其中，显示模组20设有透光区域201，电子设备100外部的光线可通过透光区域201进入电子设备100的内部。
摄像模组30和图像处理器40安装于壳体10的内部。其中，壳体10的内部即为电子设备100的内部。摄像模组30能够通过透光区域201采集电子设备100外部的光线，并形成对应的图像数据。图像处理器40与摄像模组30电连接，图像处理器40用于从摄像模组30获取图像数据，并处理图像数据。被图像处理器40处理过的图像数据可在显示模组20上显示， 也可被存储于电子设备100的存储器中，或者也可以通过电子设备100被存储于云端。
本实施例所示电子设备100中，摄像模组30位于电子设备100靠近显示模组20的一侧，用作电子设备100的前置摄像模组。需要说明的是，在其他实施例中，摄像模组30也可以位于电子设备100背离显示模组20的一侧，用作电子设备100的后置摄像模组。此时，后盖12设有摄像孔，摄像模组30通过后盖12的摄像孔采集电子设备100外部的光线。换言之，摄像模组30即可以用作电子设备100的前置摄像模组，又可以用作电子设备100的后置摄像模组。或者，电子设备100可以包括多个(两个或两个以上)摄像模组30，至少一个摄像模组30用作电子设备100的前置摄像模组，至少一个摄像模组30用作电子设备100的后置摄像模组。
请参阅图2和图3。图2是图1所示电子设备100中摄像模组30的结构示意图。图3是图2所示摄像模组30在一种实施例下的部分分解结构示意图。其中，摄像模组30的宽度方向为X轴方向，摄像模组30的长度方向为Y轴方向，摄像模组30的高度方向为Z轴方向。
一种实施例中，摄像模组30包括电路板31、图像传感器32、支架33、滤光片34、镜头基座35以及镜头36。电路板31与图像处理器40电连接，以使摄像模组30与图像处理器40电连接。电路板31包括相背设置的顶面311和底面312。电路板31的顶面311和底面312均平行于X-Y平面(也可以大致平行于X-Y平面，即允许存在少许偏差)。即，电路板31的顶面311和底面312均垂直于Z轴方向(也可以大致垂直于Z轴方向，即允许存在少许偏差)。电路板31设有安装槽313，安装槽313的开口位于电路板1的顶面311。具体的，安装槽313的开口位于顶面311的中间区域，且安装槽313自电路板1的顶面311向底面312的方向凹陷。
需要说明的是，本申请中涉及的“顶”、“底”等方位用词，是参考附图2的方位进行的描述，并不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
请一并参阅图4，图4是图2所示摄像模组30沿I-I方向剖开的剖面结构示意图。其中，沿“I-I方向剖开”是指沿I-I线及I-I线两端箭头所在的平面剖开，后文中对附图的说明做相同理解。
本实施例中，电路板31包括板体31a和衬底31b。衬底31b的顶面固定连接板体31a的底面。电路板31的顶面形成于板体31a的顶面，电路板31的底面形成于衬底31b的底面。衬底31b用于补强板体31a，使得电路板31具有足够的结构强度，以更好地承载其他器件和结构。例如，衬底31b可以采用不锈钢、铜、钢或者陶瓷材料等。此外，衬底31b还可以用于导热，使得电路板31及固定于电路板31的器件的热量能够快速散出，以提高摄像头模组的可靠性。
示例性的，电路板31还可以包括粘接层31c。粘接层31c位于衬底31b与板体31a之间，衬底31b的顶面粘接粘接层31c，粘接层31c粘接板体31a的底面，衬底31b与板体31a之间通过粘接方式彼此固定。其中，粘接层31c可以为导电胶或非导电胶。在其他一些实施方式中，衬底31b也可以通过焊接方式与板体31a相固定。例如，电路板31还可以包括焊料层，焊料层位于衬底31b与板体31a之间，用于固定连接衬底31b与板体31a。
其中，电路板31可以为软硬结合电路板。如图3所示，板体31a包括依次排布的第一硬板部311a、软板部312a及第二硬板部313a，第一硬板部311a的板面面积大于第二硬板部313a的板面面积，第一硬板部311a和第二硬板部313a为刚性板件，软板部312a为柔性板件，柔性板件相较刚性板件更易弯折。衬底31b固定于第一硬板部311a，第一硬板部311a远离衬底 31b的顶面为上文中电路板31的顶面311。电路板31还可以包括固定于第二硬板部313a的补强板。或者，板体31a为柔性板件，板体31a包括依次排布的第一区域、第二区域以及第三区域，第一区域的面积大于第三区域的面积。衬底31b固定于第一区域，第一区域远离衬底31b的顶面为上文中电路板31的顶面311。电路板31还可以包括固定于第二区域的补强板。
如图4所示，板体31a具有通孔(图未标)，安装槽313(如图3所示)包括板体31a的通孔。粘接层31c(或焊料层)具有通孔(图未标)，粘接层31c的通孔连通板体31a的通孔。在本申请实施例中，两个空间“连通”，是指两个空间连接且相通。安装槽313还包括粘接层31c(或焊料层)的通孔。衬底31b的顶面面向板体31a的通孔的区域形成安装槽313的槽底壁。本实施例中，安装槽313的加工难度较小，有利于提高加工精度。在其他一些实施例中，安装槽313还可以包括形成于板体31a的凹槽。此时，安装槽包括形成于板体31a的通孔、形成于粘接层31c的通孔及形成于衬底31b的凹槽。
图像传感器32安装于电路板31，且与电路板31电连接。本实施例中，图像传感器32安装于安装槽313。即，图像传感器32能够从电路板31的顶侧固定至电路板31。具体的，图像传感器32安装于安装槽313的槽底壁。其中，图像传感器32安装于安装槽313的槽底壁的中间区域，且与安装槽313的槽侧壁彼此间隔。示例性的，图像传感器32可通过粘接的方式安装于安装槽313的槽底壁。比如，摄像模组30可包括第一粘接层50，第一粘接层50粘接于图像传感器32与安装槽313的槽底壁之间。其中，图像传感器32可为芯片。
本实施例中，图像传感器32的高度小于电路板31的安装槽313的槽深。图像传感器32的高度是指图像传感器32在摄像模组30的高度方向(即图示Z轴方向)上的尺寸。此时，图像传感器32完全嵌入电路板31，图像传感器32和电路板31能够复用摄像模组30的厚度空间，有利于降低摄头模组30的高度。
支架33安装于电路板31的顶侧。本实施例中，支架33安装于电路板31的顶面311。具体的，支架33安装于顶面311的边缘区域，且罩设于图像传感器32顶部。示例性的，支架33可通过粘接的方式安装于电路板31的顶面311。比如，摄像模组30可包括第二粘接层60，第二粘接层60粘接于支架33与电路板31的顶面311之间。
需要说明的是，支架33安装于电路板31的顶侧，是指至少大部分支架33位于电路板31的顶侧。本实施例中，支架33与电路板31的顶面311配合固定。在其他实施例中，支架33也可与电路板31的周面(图未标)配合固定，或者，支架33可与电路板31的顶面311和周面配合固定。
支架33包括背离电路板31的顶面331。支架33具有通光孔332，通光孔332的开口位于支架33的顶面331。具体的，通光孔332的开口位于顶面331的中间区域，通光孔332自支架33的顶面331向电路板31的方向凹陷，且沿Z轴方向贯穿支架33。其中，通光孔332对应于图像传感器32。需要说明的是，通光孔332对应于图像传感器32是指，通光孔332在电路板31的投影的部分或全部与图像传感器32重叠，以保证图像传感器32能接收到自通光孔332进入支架33内部的光线。后文中关于“对应于”的描述做相同理解。
此外，通光孔332为封闭孔(即通光孔332具有完整的孔壁)。通光孔332的孔壁可与支架33的顶面331相对垂直或相对倾斜。具体的，通光孔332的孔壁局部凸出形成承托部333。其中，承托部333呈连续的封闭环状。在其他实施例中，承托部333也可以呈非连续的环状。应当理解的是，承托部333形状并不仅限于图3所示的方环形，也可以为圆环形，本申请对此不作具体限定。
一些实施例中，支架33还可以具有定位标识(图未示)。具体的，定位标识位于支架33的顶面331，以在摄像模组30的组装过程中，便于镜头基座35可实现与支架33的快速定位，提高镜头基座35与支架33之间的组装精准度与组装效率。示例性的，定位标识可有四个，四个定位标识间隔且环绕通光孔332设置。需要说明的是，在其他一些实施例中，支架33也可以不具有定位标识，镜头基座35可通过其他方式实现与支架33的定位，本申请对此不作具体限定。
滤光片34安装于支架33且覆盖通光孔332。其中，滤光片34收容于通光孔332，且对应于图像传感器32。外部的光线经滤光片34过滤后，被图像传感器32接收，图像传感器32对光线进行转化而成像。具体的，滤光片34安装于通光孔332中承托部333的顶面(图未标)。示例性的，滤光片34可通过粘接的方式固定于承托部333的顶面。比如，摄像模组30可包括第三粘接层70，第三粘接层70粘接于滤光片34与支架33之间。其中，滤光片34包括且不限于红外截止滤光片或全透光谱滤光片。
需要说明的是，滤光片34覆盖通光孔332是指滤光片34覆盖通光孔332最窄的位置，外部的光线只能经滤光片34进入支架33内部。在其他实施例中，滤光片34也可以部分收容于通光孔332，或者，滤光片34覆盖通光孔332的开口。
镜头基座35安装于支架33的顶侧。具体的，镜头基座35固定于支架33的顶面331。其中，镜头基座35固定于顶面331的边缘区域。示例性的，镜头基座35可通过粘接的方式与支架33相互固定。比如，摄像模组30可包括第四粘接层80，第四粘接层80粘接于镜头基座35与支架33之间。当然，在其他实施例中，镜头基座35可以通过焊接的方式与支架33相互固定。比如，摄像模组30可包括焊料层，焊料层固定连接于镜头基座35与支架33之间。
镜头基座35包括背离支架33的顶面351和与顶面351相背设置的底面352。镜头基座35包括安装槽353，安装槽353的开口位于顶面351的中间区域。安装槽353自镜头基座35的顶面351向底面352的方向延伸，且贯穿镜头基座35的底面352。即，安装槽353自镜头基座35的高度方向贯穿镜头基座35。具体的，安装槽353正对于通光孔332。即，安装槽353正对于图像传感器32。摄像模组30外部的光线可自安装槽353和通光孔332进入支架33的内部，被图像传感器32接收。
镜头36安装于镜头基座35的内侧。具体的，镜头36安装于镜头基座35的安装槽353。示例性的，镜头36可通过粘接的方式与镜头基座35相互固定。比如，摄像模组30可包括第五粘接层90，第五粘接层90粘接于镜头36与镜头基座35之间。
镜头36用以会聚摄像模组30外部的光线。也即，镜头36能够会聚外部的光线，并将会聚后的外部光线自滤光片34投射至图像传感器32，以在图像传感器32上形成相应的图像。其中，镜头36可以包括镜筒和固定在镜筒内侧的透镜组。示例性的，透镜组的透镜数量可以是多片，比如5片、或6片、或7片、或8片等。
其中，镜头基座35为马达。示例性的，马达可以为自动对焦马达，自动对焦马达能够驱动透镜组在平行于镜头36光轴的方向上移动。或者，马达可以为光学防抖马达，光学防抖马达能够驱动透镜组在垂直于镜头36光轴的平面上移动，或者驱动透镜组翻转以相对镜头36光轴倾斜。或者，马达可以为自动对焦和光学防抖马达。示例性的，马达可以采用音圈马达(voice coil motor，VCM)，也可以采用记忆合金马达等。本申请不对马达的具体功能和类型进行严格限定。在其他一些实施例中，镜头基座35也可以为支架结构。此时，摄像模组30为定焦模组。
请参阅图5和图6，图5是图3所示摄像模组30中电路板31与图像传感器32的部分组装结构示意图，图6是图5所示结构沿II-II方向剖开的剖面结构示意图。
电路板31的顶面311设有彼此间隔的第一金手指314和第二金手指315。具体的，第一金手指314和第二金手指315与电路板31电连接，且均相对于图像传感器32露出。第二金手指315位于第一金手指314背离图像传感器32的一侧。即，第二金手指315和图像传感器32分别位于第一金手指314的两侧。
应当理解的是，第一金手指314和第二金手指315的位置并不仅限于图6所示的凸出于电路板31的顶面311，也可以嵌设于电路板31内且与电路板31的顶面311平齐，或者，嵌设于电路板31内且相对于电路板31的顶面311凹陷，即，嵌设于电路板31内且位于电路板311的顶面311与底面311之间，本申请对此不作具体限定。
本实施例中，第一金手指314和第二金手指315均有多个，多个第一金手指314和多个第二金手指315均排布于安装槽313的开口的附近。具体的，部分第一金手指314沿Y轴方向彼此间隔排布形成第一金手指组，部分第一金手指314沿Y轴方向彼此间隔排布形成第二金手指组。第一金手指组和第二金手指组沿X轴方向彼此间隔地分别排布于安装槽313的开口的相对两侧。
部分第二金手指315沿Y轴方向彼此间隔排布形成第三金手指组，部分第二金手指315沿Y轴方向彼此间隔排布形成第四金手指组，第三金手指组和第四金手指沿X轴方向彼此间隔地分别排布于安装槽313的开口的相对两侧。具体的，第三金手指组与第一金手指组位于安装槽313的开口的同一侧，且位于第一金手指组背离安装槽313的开口的一侧。即，第三金手指组和安装槽313的开口分别位于第一金手指314的相对两侧。第四金手指组与第二金手指组位于安装槽313的开口的同一侧，且位于第二金手指组背离安装槽313的开口的一侧。即，第四金手指组和安装槽313的开口分别位于第二金手指组的相对两侧。
图像传感器32包括与电路板31的顶面311朝向相同的顶面321。图像传感器32的顶面321包括感光区域322和环绕感光区域322的非感光区域323。具体的，感光区域322位于图像传感器32的顶面321的中间区域，用于接收经滤光片34过滤后的光线。非感光区域323位于图像传感器32的顶面321的边缘区域，用于实现图像传感器32与电路板31之间的电连接。
图像传感器32的顶面321设有彼此间隔的第一焊盘324和第二焊盘325。具体的，第一焊盘324和第二焊盘325与图像传感器32电连接，且均设于顶面321的非感光区域323。其中，第一焊盘324和第二焊盘325均有多个。部分第一焊盘324和部分第二焊盘325沿Y轴方向相互交错排布形成第一焊盘组，部分第一焊盘324和部分第二焊盘325沿Y轴方向相互交错排布形成第二焊盘组，第一焊盘组和第二焊盘组沿X轴方向彼此间隔地排布于顶面321的非感光区域323。
应当理解的是，第一焊盘324和第二焊盘325的位置并不仅限于图6所示的凸出于图像传感器32的顶面321，也可以嵌设于图像传感器32内且与图像传感器32的顶面321平齐，或者，嵌设于图像传感器32内且相对于图像传感器32的顶面321凹陷，即，嵌设于图像传感器32内且位于图像传感器32的顶面321与底面(图未标)之间，本申请对此不作具体限定。
此外，第一焊盘324的数量与第一金手指314的数量相匹配，第二焊盘325的数量与第二金手指315的数量相匹配。本实施例中，第一焊盘324的数量与第一金手指314的数量相同，第二焊盘325的数量与第二金手指315的数量相同。在其他一些实施例中，第一焊盘324 的数量也可以多于或少于第一金手指314的数量，和/或，第二焊盘325的数量也可以多于或少于第二金手指315的数量。
摄像模组30还包括第一导线37和第二导线38，第一导线37连接于电路板31与图像传感器32之间，第二导线38连接于电路板31与图像传感器32之间，且与第一导线31彼此间隔。示例性的，第一导线37和第二导线38可以采用金、铜、铝等材料制成。图像传感器32通过第一导线37和第二导线38连接电路板31的板体31a，以电连接电路板31。其中，第一导线37和第二导线38均可通过打线(wire bonding，WB)工艺形成，打线工艺也可以称为压焊工艺、绑定工艺、键合工艺或丝焊工艺。
本实施例中，第一导线37和第二导线38均有多根。第一导线37的数量与第一焊盘324和第一金手指314的数量相同，每一第一导线37连接于一个第一金手指314与一个第一焊盘324之间。具体的，每一第一导线37均包括第一端部371、第二端部372和连接部373，连接部373连接于第一端部371和第二端部372之间。第一导线37的第一端部371固接于一个第一金手指314，第二端部372固接于一个第二焊盘325。其中，第一导线37的长度在200μm～1000μm之间，第一导线37的高度(即沿Z轴方向上的尺寸)在80μm～120μm之间。
需要说明的是，第一导线37的长度范围为200μm～1000μm，是指第一导线37的长度不仅可以为200μm至1000μm之间的任意数值，还可以为端点值200μm或1000μm。同理的，第一导线37的高度在80μm～120μm之间，是指第一导线37的高度不仅可以为80μm至120μm之间的任意树脂，也可以为端点值80μm或120μm。
第二导线38的数量与第二焊盘325和第二金手指315的数量相同。每一第二导线38连接于一个第二金手指315和一个第二焊盘325之间，且与相邻第一导线37彼此间隔。具体的，沿平行于电路板31的顶面311的方向上，多根第二导线38与多个第一导线37交错排布。其中，沿Y轴方向上，多根第二导线38与多个第一导线37交错排布。此时，第二导线38与相邻第一导线37之间的距离w≥40μm，以避免第二导线38与第一导线37相接触而发生短路的问题。
需要说明的是，多根第一导线37和多个第二导线38交错分布是指多根第一导线37和多根第二导线37并不是单一地排布，两根第一导线37之间有一根或多根第二导线38，或者，两根第二导线38之间有一根或多根第一导线37。
具体的，每一第二导线38均包括第一端部381、第二端部382和连接部383，连接部383连接于第一端部381和第二端部382之间。每一第二导线38的第一端部381连接于一个第二金手指315，第二端部382连接于一个第二焊盘325。其中，第二导线38的长度大于第一导线37的长度，第二导线38的长度在600μm～1400μm之间。第二导线38的高度与第一导线37的高度相同。在其他一些实施例中，第二导线38的高度也可以与第一导线37的高度不同，即第二导线38的高度可以小于第一导线37的高度，或者第二导线38的高度可以大于第一导线37的高度。
需要说明的是，第二导线38的长度范围为600μm～1400μm，是指第二导线38的长度不仅可以为600μm至1400μm之间的任意数值，还可以为端点值600μm或1400μm。
此外，摄像模组30还包括绝缘胶部39，绝缘胶部39与电路板31的顶面311接触。其中，绝缘胶部39有两个，两个绝缘胶部39沿X轴方向间隔排布于图像传感器32的相对两侧。示例性的，绝缘胶部39可先通过点胶工艺后，再经自然固化、紫外固化或热固化等方式固化后形成。
具体的，绝缘胶部39至少覆盖部分第一导线37和部分第二导线38。本实施例中，绝缘 胶部39至少覆盖第一导线37和第二导线38靠近电路板31的部分。其中，绝缘胶部39覆盖第一导线37的第一端部371和连接部373靠近第一端部371的部分，以辅助固定第一导线37，提高第一导线37的线弧稳定性，避免第一导线37在摄像模组30的组装过程(如运转、检验或返工等工序中)因人为触碰而发生摆线，或在使用过程中在外力挤压下因过应力发生变形而摆线，导致第一导线37与第二导线38彼此接触造成短路的问题。
此外，绝缘胶部39与电路板31的顶面311之间的最大距离H大于第一导线37与电路板31的顶面311之间的最大距离h。即，绝缘胶部39覆盖第一导线37的最高位置，可有效避免第一导线37发生塌陷，提高第一导线37的线弧稳定性。其中，第一导线37的最高位置是指第一导线37距离电路板31的顶面311最远的位置。
绝缘胶部39覆盖第二导线38的第一端部381和连接部383靠近第一端部381的部分，以辅助固定第二导线38，防止第二导线38在摄像模组30的组装过程因人为触碰或在使用过程中因过应力而发生摆线，与第一导线37彼此接触造成的短路问题，降低摄像模组30的产品故障反馈比例(fault feedback ratio，FFR)。可以理解的是，由于第二导线38的高度与第一导线37的高度相同，因此，绝缘胶部39也覆盖第二导线38的最高位置，以防止第二导线38在摄像模组30的组装过程中因人为触碰或在使用过程中因过应力而发生塌陷，与第一金手指314接触造成短路的问题。
需要说明的是，在其他一些实施例中，绝缘胶部39也可以不覆盖第一导线37和/或第二导线38的最高位置。当第二导线38发生塌陷时，由于绝缘胶部39的阻隔，第二导线38也不会与第一金手指314接触造成短路。此时，由于绝缘胶部39未覆盖第一导线37和/或第二导线38的最高点，有助于减小固定于电路板31上方的支架33的内部高度，进而有助于减小摄像模组30的高度，实现摄像模组30的小型化设计。
绝缘胶部39与图像传感器32的周面接触，且覆盖第一金手指314和第二金手指315，以增加绝缘胶部39与电路板31的连接稳定性，进而提高绝缘胶部39对第一导线37和第二导线38的固定作用。应当理解的是，在点胶过程中，流体状的胶体会在一定范围内流动，因此，绝缘胶部39会覆盖第一金手指314和第二金手指315附近的部分区域，如图6所示，绝缘胶部39还会覆盖电路板31的顶面311的部分区域，以增加绝缘胶部39与电路板31的连接稳定性。此外，部分绝缘胶部39位于安装槽313的内部，且连接于图像传感器32的侧面与安装槽313的槽侧壁之间，以进一步增加绝缘胶部39与电路板31之间的连接稳定性。可以理解的是，可以通过胶水粘度的选择、点胶路径的管控和固化参数等工艺控制以绝缘胶部39在电路板31的顶面311的覆盖面积。
需要说明的是，在其他一些实施例中，电路板31的顶面311还可以设有第三金手指，图像传感器32的顶面321还可以设有第三焊盘，摄像模组30还可以包括第三导线，第三导线连接于第三金手指和第三焊盘之间，绝缘胶部39可以覆盖部分或全部第三导线，本申请对此不作具体限定。
请参阅图7和图8，图7是本申请实施例提供的第二种电子设备中摄像模组的电路板31与图像传感器32的部分组装结构示意图，图8是图7所示结构沿III-III方向剖开的剖面结构示意图。
本实施例所示电子设备与上述实施例所示电子设备的不同之处在于，绝缘胶部39还与图像传感器32的顶面321接触，且覆盖第一导线37和第二导线38靠近图像传感器32的部分。具体的，绝缘胶部38完全覆盖第一导线37和第二导线38。其中，绝缘胶部39覆盖第一导线37的第一端部371、连接部373和第二端部372，以及第二导线38的第一端部381、连接 部383和第二部分382，以固定第一导线37和第二导线38，防止两者发生摆线相互触碰而发生短路。
此时，绝缘胶部39还覆盖第一焊盘324和第二焊盘325，以增加绝缘胶部39和图像传感器32的连接稳定性，提高绝缘胶部39对第一导线37和第二导线38的固定作用。应当理解的是，在点胶过程中，流体状的胶体会在一定范围内流动，因此，绝缘胶部39也会覆盖第一焊盘324和第二焊盘325附近的部分区域，如图8所示，绝缘胶部39还会覆盖图像传感器32的顶面321的部分区域，以增加绝缘胶部39和图像传感器32的连接稳定性。此时，绝缘胶部39覆盖图像传感器32的非感光区323的部分区域。即，绝缘胶部39位于图像传感器32的感光区322外，也即，绝缘胶部39不覆盖图像传感器32的感光区322，以避免绝缘胶部39影响感光区322接收光线进行成像。
本实施例所示电子设备100中，可采用简单的点胶固化设备，通过点胶固化工艺即可形成绝缘胶部39以保护第一导线37和第二导线38，不需要采用高精度的塑封模具对第一导线37和第二导线38进行塑封，避免了塑封模具对图像传感器32进行挤压而使图像传感器32受应力过大形成的微裂纹甚至损坏的问题，有助于降低摄像模组30的生产成本，提高良率。
请参阅图9和图10，图9是本申请实施例提供的第三种电子设备中摄像模组的电路板31与图像传感器32的部分组装结构示意图，图10是图9所示结构沿IV-IV方向剖开的剖面结构示意图。
本实施例所示电子设备与上述第一种实施例所示电子设备的不同之处在于，图像传感器32安装于电路板31的顶面311。具体的，图像传感器32安装于电路板31的顶面311的中间区域。示例性的，图像传感器32可通过粘接的方式安装于电路板31的顶面。比如，摄像模组30可包括第一粘接层50，通过第一粘接层50粘接于图像传感器32与电路板31之间。
本实施例中，绝缘胶部39覆盖部分第一导线37和部分第二导线38。具体的，绝缘胶部39覆盖第一导线37的第一端部371和连接部373靠近第一端部371的部分。其中，绝缘胶部39在Z轴正方向的距离H小于第一导线37在Z轴正方向的距离h。即，绝缘胶部39不覆盖第一导线37的最高点。
绝缘胶部39覆盖第二导线38的第一端部381和连接部373靠近第一端部371的部分。其中，绝缘胶部39不覆盖第二导线38的最高点。当第二导线38发生塌陷时，由于绝缘胶部39的阻隔，第二导线38也不会与第一金手指314接触造成短路。
请参阅图11和图12，图11是本申请实施例提供的第四种电子设备中摄像模组的电路板31与图像传感器32的部分组装结构示意图，图12是图11所示结构沿V-V方向剖开的剖面结构示意图。
本实施例所示电子设备与上述第三实施例所示电子设备的不同之处在于，绝缘胶部39覆盖第一导线37和第二导线38。具体的，绝缘胶部39覆盖第一导线37的第一端部371、连接部373和第二端部372，及第二导线38的第一端部381、连接部373和第二部分。即，绝缘胶部39覆盖整个第一导线37和第二导线38，以固定第一导线37和第二导线38，防止两者发生摆线相互触碰而发生短路。
此外，绝缘胶部39还覆盖第一焊盘324和第二焊盘325，以增加绝缘胶部39和图像传感器32的连接稳定性，提高绝缘胶部39对第一导线37和第二导线38的固定作用。应当理解的是，在点胶过程中，流体状的胶体会在一定范围内流动，因此，绝缘胶部39也会覆盖第一焊盘324和第二焊盘325附近的部分区域，如图12所示，绝缘胶部39还会覆盖图像传感器32的顶面321的部分区域，以增加绝缘胶部39和图像传感器32的连接稳定性。此时，绝 缘胶部39覆盖图像传感器32的非感光区的部分区域。即，绝缘胶部39不覆盖图像传感器32的感光区，以避免绝缘胶部39影响感光区接收光线进行成像。
以上描述，仅为本申请的部分实施例和实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (12)

  1. 一种摄像模组，其特征在于，包括图像传感器、电路板、第一导线、第二导线和绝缘胶部，所述图像传感器安装于所述电路板，所述第一导线连接于所述电路板与所述图像传感器之间，所述第二导线连接于所述电路板与所述图像传感器之间，且与所述第一导线彼此间隔，所述第二导线的长度大于所述第一导线的长度，所述绝缘胶部与所述电路板的顶面接触，且至少覆盖所述第一导线和所述第二导线靠近所述电路板的部分。
  2. 根据权利要求1所述的摄像模组，其特征在于，所述第一导线和所述第二导线有多根，沿平行于所述电路板的顶面的方向，多根所述第一导线与多根所述第二导线交错排布。
  3. 根据权利要求1或2所述的摄像模组，其特征在于，所述绝缘胶部还与所述图像传感器的顶面接触，且覆盖所述第一导线和所述第二导线靠近所述图像传感器的部分。
  4. 根据权利要求3所述的摄像模组，其特征在于，所述图像传感器的顶面包括感光区，所述绝缘胶部位于所述感光区外。
  5. 根据权利要求1所述的摄像模组，其特征在于，所述绝缘胶部覆盖所述第一导线和所述第二导线的最高位置。
  6. 根据权利要求1所述的摄像模组，其特征在于，所述绝缘胶部完整覆盖所述第一导线和所述第二导线。
  7. 根据权利要求1所述的摄像模组，其特征在于，所述图像传感器安装于所述电路板的顶面，或者，所述电路板设有安装槽，所述安装槽的开口位于所述电路板的顶面，所述图像传感器安装于所述安装槽，所述绝缘胶部还与所述图像传感器的周面接触。
  8. 根据权利要求1所述的摄像模组，其特征在于，所述图像传感器的顶面设有彼此间隔的第一焊盘和第二焊盘，所述电路板的顶面设有彼此间隔的第一金手指和第二金手指，所述第一金手指和所述第二金手指相对于所述图像传感器露出，所述第二金手指位于所述第一金手指背离所述图像传感器的一侧，所述第一导线连接于所述第一金手指和所述第一焊盘之间，所述第二导线连接于所述第二金手指和所述第二焊盘之间，所述绝缘胶部覆盖所述第一金手指和所述第二金手指。
  9. 根据权利要求1所述的摄像模组，其特征在于，所述第一导线的长度在200μm～1000μm之间，所述第二导线的长度在600μm～1400μm之间。
  10. 根据权利要求1所述的摄像模组，其特征在于，所述第一导线和所述第二导线之间的距离等于或大于40μm。
  11. 根据权利要求1所述的摄像模组，其特征在于，所述摄像模组还包括支架、滤光片、镜头基座和镜头，所述支架安装于所述电路板的顶侧，所述支架具有对应于所述图像传感器 的通光孔，所述滤光片安装于所述支架且覆盖所述通光孔，所述镜头基座安装于所述支架的顶侧，所述镜头安装于所述镜头基座的内侧。
  12. 一种电子设备，其特征在于，包括壳体和如权利要求1-11中任一项所述的摄像模组，所述摄像模组安装于所述壳体的内部。
PCT/CN2021/124444 2020-10-21 2021-10-18 摄像模组和电子设备 Ceased WO2022083548A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP21881964.7A EP4216535B1 (en) 2020-10-21 2021-10-18 Camera module and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202022366181.3U CN213718044U (zh) 2020-10-21 2020-10-21 摄像模组和电子设备
CN202022366181.3 2020-10-21

Publications (1)

Publication Number Publication Date
WO2022083548A1 true WO2022083548A1 (zh) 2022-04-28

Family

ID=76801071

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/124444 Ceased WO2022083548A1 (zh) 2020-10-21 2021-10-18 摄像模组和电子设备

Country Status (3)

Country Link
EP (1) EP4216535B1 (zh)
CN (1) CN213718044U (zh)
WO (1) WO2022083548A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116050347A (zh) * 2023-01-16 2023-05-02 沛顿科技（深圳）有限公司 一种判定键合线与相邻金手指短路风险的方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213718044U (zh) * 2020-10-21 2021-07-16 华为技术有限公司 摄像模组和电子设备
TWI794101B (zh) * 2022-04-21 2023-02-21 大根光學工業股份有限公司 成像鏡頭模組與電子裝置
CN118678178B (zh) * 2023-03-14 2025-11-11 华为技术有限公司 摄像模组以及电子设备
TWI853702B (zh) * 2023-09-07 2024-08-21 群光電子股份有限公司 攝像裝置
CN119967074A (zh) * 2023-11-07 2025-05-09 华为技术有限公司 电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200962342Y (zh) * 2006-09-22 2007-10-17 宏亿国际股份有限公司 一种导电橡胶的改良
US20140036218A1 (en) * 2012-08-06 2014-02-06 Yun-Kai Yu Camera module and method for making same
CN108336038A (zh) * 2018-03-13 2018-07-27 昆山丘钛微电子科技有限公司 封装结构、封装方法和摄像头模组
CN210491015U (zh) * 2019-10-28 2020-05-08 Oppo广东移动通信有限公司 电子设备、摄像头模组及其电路板组件
CN111666783A (zh) * 2019-03-05 2020-09-15 印象认知（北京）科技有限公司 基材结构、传感器模组、电子设备及安装方法
CN211505870U (zh) * 2019-11-04 2020-09-15 南昌欧菲生物识别技术有限公司 一种接收器、深度摄像模组和电子设备
CN213718044U (zh) * 2020-10-21 2021-07-16 华为技术有限公司 摄像模组和电子设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601467B1 (en) * 2015-09-03 2017-03-21 Invensas Corporation Microelectronic package with horizontal and vertical interconnections
US11942495B2 (en) * 2018-08-03 2024-03-26 Sony Semiconductor Solutions Corporation Semiconductor device, imaging apparatus, and method for manufacturing semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200962342Y (zh) * 2006-09-22 2007-10-17 宏亿国际股份有限公司 一种导电橡胶的改良
US20140036218A1 (en) * 2012-08-06 2014-02-06 Yun-Kai Yu Camera module and method for making same
CN108336038A (zh) * 2018-03-13 2018-07-27 昆山丘钛微电子科技有限公司 封装结构、封装方法和摄像头模组
CN111666783A (zh) * 2019-03-05 2020-09-15 印象认知（北京）科技有限公司 基材结构、传感器模组、电子设备及安装方法
CN210491015U (zh) * 2019-10-28 2020-05-08 Oppo广东移动通信有限公司 电子设备、摄像头模组及其电路板组件
CN211505870U (zh) * 2019-11-04 2020-09-15 南昌欧菲生物识别技术有限公司 一种接收器、深度摄像模组和电子设备
CN213718044U (zh) * 2020-10-21 2021-07-16 华为技术有限公司 摄像模组和电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4216535A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116050347A (zh) * 2023-01-16 2023-05-02 沛顿科技（深圳）有限公司 一种判定键合线与相邻金手指短路风险的方法

Also Published As

Publication number Publication date
EP4216535A1 (en) 2023-07-26
CN213718044U (zh) 2021-07-16
EP4216535B1 (en) 2025-08-27
EP4216535A4 (en) 2024-03-20

Similar Documents

Publication Publication Date Title
WO2022083548A1 (zh) 摄像模组和电子设备
CN212211129U (zh) 摄像头模组及电子设备
CN105847645B (zh) 基于一体封装工艺的摄像模组及其一体基座组件及制造方法
JP2001292354A (ja) 撮像装置
TW200426422A (en) Module for optical device, and manufacturing method therefor
KR20210016640A (ko) 촬상 유닛 및 촬상 장치
JPWO2008032404A1 (ja) 半導体装置およびその製造方法
US12119361B2 (en) Circuit board assembly with photosensitive element mounted to back side of circuit board
CN108322632A (zh) 摄像头模组、电子装置及摄像头模组制作方法
WO2016180378A2 (zh) 摄像模组及其组装方法
CN114845014A (zh) 感光组件和摄像模组及其制造方法
JP2008263550A (ja) 固体撮像装置およびその製造方法
TW202243464A (zh) 相機模組
JP2008108861A (ja) 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ
WO2025016278A1 (zh) 潜望式摄像模组
CN114666466B (zh) 摄像模组和电子设备
WO2017134972A1 (ja) 撮像素子パッケージ及び撮像装置
WO2022241741A1 (zh) 一种电路板组件、摄像模组及电子设备
CN108933151A (zh) 一种影像传感芯片的封装结构以及封装方法
JP2005295050A (ja) カメラモジュール
TWI691779B (zh) 鏡頭模組
JP4824461B2 (ja) カメラモジュール
JP3839019B2 (ja) 撮像装置
JP2006269841A (ja) 固体撮像装置
JP2008263551A (ja) 固体撮像装置およびその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21881964

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021881964

Country of ref document: EP

Effective date: 20230417

NENP Non-entry into the national phase

Ref country code: DE

WWG Wipo information: grant in national office

Ref document number: 2021881964

Country of ref document: EP