WO2022095279A1 - 一种自熔断单元及其应用的保护元件 - Google Patents

一种自熔断单元及其应用的保护元件 Download PDF

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Publication number
WO2022095279A1
WO2022095279A1 PCT/CN2021/072155 CN2021072155W WO2022095279A1 WO 2022095279 A1 WO2022095279 A1 WO 2022095279A1 CN 2021072155 W CN2021072155 W CN 2021072155W WO 2022095279 A1 WO2022095279 A1 WO 2022095279A1
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WIPO (PCT)
Prior art keywords
self
fuse unit
electrode
silver
inner core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2021/072155
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English (en)
French (fr)
Inventor
夏心俊
韩乔磊
钱朝勇
李峰
王开成
程逸飞
沈十林
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Shanghai Wayon Electronics Co Ltd
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Shanghai Wayon Electronics Co Ltd
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Priority to US18/034,463 priority Critical patent/US20240021393A1/en
Priority to EP21887985.6A priority patent/EP4224510A4/en
Publication of WO2022095279A1 publication Critical patent/WO2022095279A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/165—Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/14—Arrangements or processes for adjusting or protecting hybrid or EDL capacitors
    • H01G11/16—Arrangements or processes for adjusting or protecting hybrid or EDL capacitors against electric overloads, e.g. including fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit

Definitions

  • the invention belongs to the technical field of circuit protection, and in particular relates to a self-fuse unit and a protection element used therefor.
  • Lithium-ion rechargeable batteries have been widely used in portable mobile devices such as mobile phones, notebooks, tablet computers, digital cameras, etc., and are increasingly being applied to energy storage batteries, two-wheeler batteries, drones, sweepers, etc. in many new fields. While it has many superior performances, it still has shortcomings such as fire, combustion and explosion if the charge and discharge management is improper, especially when it is used in electric vehicles, because the number or volume of lithium-ion batteries used is very large. Fire or explosion occurs, and there is even a danger to life.
  • protection circuits are widely applied to lithium-ion batteries, which have the function of cutting off the output of the battery pack in a given situation.
  • Protection methods include PTC, Breaker, SMD Fuse, thermal fuse, IC plus MOSFET, self-control protection components, etc.
  • fuse units composed of low melting point metal bodies such as lead, tin, silver, copper, tin, bismuth, indium, gold, aluminum, nickel, zinc, etc. are widely used, such as: traditional disposable
  • the overcurrent fuse is mainly formed by placing a metal body fuse unit in a glass or ceramic tube; the later developed self-control protection element also includes a metal body fuse unit.
  • the self-control protection element developed in recent years, when overcurrent occurs, a large amount of current flows through the fuse unit, which will cause the fuse unit to heat up and fuse, thereby achieving overcurrent protection; in addition, when overvoltage occurs, the current flows through the self-control
  • the heating element in the type protection element makes the heating element generate heat to fuse the fuse unit, thereby making the circuit of the battery in an open state to achieve overvoltage protection; it integrates overcurrent protection, overvoltage protection, overtemperature protection, etc. Protection function in one, but also has the characteristics of small size, reflow process chip mounting and so on.
  • fuse units used in the protection methods on the market are used in the field of low current protection, which is characterized by large internal resistance and low melting point of the fuse unit, but mostly in the form of wave soldering and plug-in; some are used in the field of high current. , which is characterized by low internal resistance of the fuse unit, mostly in the form of SMD reflow soldering, but with a high melting point.
  • the fuse unit is suitable for mounting.
  • the power supply of Tesla electric vehicle is composed of multiple 18650 batteries in series to form a battery pack, multiple battery packs in parallel to form a battery pack, and battery packs in series to form a battery board.
  • Each single-cell battery is connected to a fuse for protection, and each battery pack, battery pack and assembly battery board are protected by independent fuses. Because the series-parallel mode leads to the output of large voltage and large current of battery packs, battery packs and battery boards, self-control protection components that can withstand high voltage and large current are required.
  • the self-control protection components mostly use lead-containing and its alloy solders with a melting point of about 300°C as the fusing unit, because it can prevent high temperature fusing in the subsequent reflow soldering process of the protection components, and also has the advantages of nickel, gold or nickel, platinum or silver. , platinum and other metal layers with strong adhesion to the surface of the fuse and wetting properties.
  • lead-containing and its alloy solders with a melting point of about 300°C as the fusing unit, because it can prevent high temperature fusing in the subsequent reflow soldering process of the protection components, and also has the advantages of nickel, gold or nickel, platinum or silver. , platinum and other metal layers with strong adhesion to the surface of the fuse and wetting properties.
  • the miniaturization of electronic devices in order to be able to increase the rated current in a limited size, the high resistivity of conventional lead-containing and its alloy solders is difficult to meet the demand.
  • the purpose of the present invention is to provide a self-fuse unit that meets the requirement of small size.
  • Another object of the present invention is to provide a method for preparing the self-fuse unit.
  • Another object of the present invention is to provide a protection element using the above-mentioned self-fuse unit, which has high electrical conductivity characteristics, can reduce the on-resistance and contact resistance of the line at the same time, and satisfies the flow of large current; in addition, its melting point is Can safely withstand reflow soldering while being as low as possible.
  • a self-fuse unit for protecting devices has a conductive sheath core structure with a resistivity of 1.5-40 ⁇ .cm, wherein the sheath core structure includes an inner core and an outer sheath, and the outer sheath material and the inner core are The surface of the material is in contact with and fully covers the periphery of the inner core material. The surface of the inner core material is in contact with the outer sheath material. The melting point and electrical conductivity of the outer sheath material are higher than those of the outer periphery of the inner core material, which is used to inhibit the swelling of the inner core material. and molten outflow.
  • the present invention provides a self-fuse unit that can be used for protecting devices, and can be used as a fuse unit for the self-fuse protection element and the self-control protection element described later. Open the circuit, or be blown by heat due to absorbing a certain amount of power and heat, and disconnect the circuit.
  • the outer sheath with high electrical conductivity is fully covered on the periphery of the fusible inner core material, and the melting point of the outer sheath material is higher than that of the inner core material, so that the self-fuse unit can meet the requirements of the reflow resistance process. Its shape is maintained, and no non-maintaining shape phenomena such as shrinkage, wrinkling, fusing, melting and outflow of the inner core material occur.
  • the self-fuse unit is completely covered with the outer sheath material with high electrical conductivity on the periphery of the fusible inner core material.
  • the structure is simple, the production process is convenient, the cost is low, the use and operation are convenient, and the alloy unit can be used in various protection elements. .
  • the thickness of the inner core is between 0.02-0.2mm
  • the thickness of the outer sheath is between 0.006-0.03mm
  • the self-fuse unit maintains its original appearance in the reflow soldering process, but at high At 280°C or placed on a heating element with a power of more than 2W, it can quickly self-fuse.
  • the self-fuse unit can be quickly fused after being heated or absorbed a certain power heat, and the heating temperature is higher than 280 ° C, that is, the self-fuse unit needs to maintain its shape and quickly fuse at the overcurrent welding temperature.
  • the inner core is made of metal material or polymer material with high melting and wettability.
  • the preferred inner core metal material is at least one or an alloy of two or more of tin, lead, silver, bismuth, and indium.
  • the preferred inner core polymer material is at least one of polyethylene, polypropylene, polyurethane, polyester, polyamide, polyether, polyvinyl alcohol, polyvinyl chloride, polystyrene, and ethylene-vinyl acetate copolymer one or two or more compositions.
  • the surface roughness of the inner core is less than 0.001 mm.
  • the outer sheath is at least one or an alloy of two or more of silver, copper, gold, aluminum, nickel, and zinc.
  • the outer sheath includes a metal cladding layer on the periphery of the inner core by one or more process methods of chemical plating, electroplating, rack plating, barrel plating, evaporation, sputtering, ion plating or calendering.
  • the sheath core structure composed of the inner core and the outer sheath of the self-fuse unit of the present invention is realized by one or more processes such as chemical plating, evaporation, sputtering, electroplating, rack plating, barrel plating, ion plating, and rolling compounding. ,in:
  • the electroless plating also known as electroless plating or auto-catalytic plating, is a process in which metal ions in the plating solution are reduced to metal and deposited on the surface of the part with the help of a suitable reducing agent without an applied current.
  • a plating method Common solutions for electroless plating are: electroless silver plating, nickel plating, copper plating, cobalt plating, nickel-phosphorus plating, nickel-phosphorus boron plating, etc.
  • the vapor deposition refers to a method of heating the material in a vacuum environment, vaporizing it and depositing it on a substrate to obtain a thin film material.
  • the vacuum vapor deposition process generally includes the following steps: (1) The surface of the substrate is cleaned. Oil stains, rust stains, residual plating materials, etc. on the surface of the vacuum chamber wall and substrate frame are easy to evaporate in vacuum, which directly affects the purity and bonding force of the film layer; (2) Preparation before plating.
  • the coating chamber is evacuated to a suitable degree of vacuum, and the substrate and coating materials are pretreated.
  • the substrate is heated, the purpose of which is to remove moisture and enhance the bond between the film and the substrate. Heating the substrate under high vacuum can desorb the gas adsorbed on the surface of the substrate.
  • the vacuum pump is evacuated and discharged from the vacuum chamber, which is beneficial to improve the vacuum degree of the coating chamber, the purity of the film layer and the bonding force of the film base.
  • first power the evaporation source with low-power electricity to preheat or pre-melt the film material.
  • cover the evaporation source and source material with a baffle, and then input
  • the high-power electricity quickly heats the coating material to the evaporation temperature, and then removes the baffle during evaporation.
  • Vapor deposition In addition to the selection of suitable substrate temperature and plating material evaporation temperature in the evaporation stage, deposition pressure is a very important parameter.
  • the deposition pressure that is, the vacuum degree of the coating chamber, determines the mean free path of the gas molecules in the evaporation space and the number of collisions between the vapor and the residual gas atoms and vapor atoms at a certain evaporation distance.
  • the sputtering plating refers to the phenomenon of bombarding the target with energetic particles (usually gas ions), so that some atoms on the surface of the target escape.
  • the ion plating refers to a method of using gas discharge to partially ionize the gas or the evaporated material under vacuum conditions, and to deposit the evaporated material or its reactant on the substrate under the bombardment of the gas ions or the evaporated material ions. .
  • the present invention provides a preparation method of the above-mentioned self-fuse unit, comprising the following steps in sequence:
  • the inner core is cut or punched into a 2.0*2.0*0.6mm chip-shaped substrate, then placed in contact with an 80v% sulfuric acid aqueous solution at 40°C for 30 seconds, washed with deionized water, and dried;
  • the catalyst In the third step, put the catalyst into the PdCl solution of 0.1 g /L for catalysis for 360 minutes, take it out and wash it with deionized water, and dry it to obtain the product to be plated;
  • the product to be plated is put into the chemical silver plating solution, and the silver plating temperature is controlled at 30° C.
  • the present invention provides yet another preparation method of the above-mentioned self-fuse unit, comprising the following steps in sequence:
  • the inner core 101 is cut or punched into a 2.0*2.0*0.6mm chip-shaped substrate, then placed in a 80v% sulfuric acid aqueous solution at 40° C. for 30 seconds, washed with deionized water, and dried. ;
  • the 3rd step put into the PdCl solution of catalyst 0.1g/L to catalyze for 360 minutes, take out and wash with deionized water, and dry to obtain the product to be plated;
  • the fourth step is to place the product to be plated in the barrel plating, immerse it in the electroplating solution, control the temperature of the silver plating solution at 30°C, and set the constant current 15A current mode at the same time to detect the thickness of the silver-plated layer in real time, so that the inner core surface is fully covered.
  • the silver-plated outer sheath material is clad to form a 2-20 ⁇ m thick clad silver-plated outer sheath.
  • the present invention provides another preparation method of the above-mentioned self-fuse unit, comprising the following steps in sequence:
  • a 10 ⁇ m silver thin film is attached to the upper and lower surfaces of the 0.6mm inner core 101, combined by calendering and compounding, using shearing or die stamping to make a 2.0*2.0 piece shape, and then place it at 40 °C 80v% sulfuric acid aqueous solution for 30 seconds, washed with deionized water, and dried;
  • the 3rd step put into the PdCl solution of catalyst 0.1g/L to catalyze for 360 minutes, take out and wash with deionized water, and dry to obtain the product to be plated;
  • the fourth step is to place the product to be plated in the barrel plating, immerse it in the electroplating solution, control the temperature of the silver plating solution at 30°C, and set the constant current 15A current mode at the same time.
  • the side of the small piece is covered with a silver film, so that the surface of the inner core material is fully covered with the silver-plated sheath material, the thickness of the silver-plated layer is detected in real time, and the silver-plated sheath material with a thickness of 2-20 ⁇ m is formed.
  • the present invention provides a self-fuse protection element, using the above-mentioned self-fuse unit, when the rated current is exceeded, it can be disconnected autonomously, including:
  • the ceramic substrate is provided with a front conductor electrode on the surface, which is divided into a first electrode and a second electrode;
  • the self-fuse unit is placed on the surface of the ceramic substrate, soldered with solder, and the self-fuse unit connects the first electrode and the second electrode;
  • the barrier wire which is an insulating medium, is located on the outside of the first electrode and the second electrode connection end connected by the self-fuse unit through the solder. causes the risk of self-fuse protection components being blown by over-reflow soldering.
  • the present invention also provides a self-control protection element, using the above-mentioned self-fuse unit, comprising:
  • the ceramic substrate is provided with a front conductor electrode on the surface, which is divided into a first electrode and a second electrode;
  • a heating element is formed on the above-mentioned ceramic substrate or inside the above-mentioned ceramic substrate, and electrodes are drawn out from the heating element;
  • the self-fuse unit is located above the heating element, welded with solder, and cross-connects the first electrode, the heating element lead-out electrode and the second electrode;
  • the barrier wire which is an insulating medium, is located on the outside of the first electrode and the second electrode. It blocks the excess solder when the self-control protection component is mounted, and prevents the solder from contacting the self-fuse unit inside the component, causing the risk of over-reflow soldering of the self-control protection component. .
  • the self-fuse unit When the heating power of the above-mentioned self-control protection element exceeds 2W, the self-fuse unit will be fused by heat and disconnected autonomously.
  • the protection element of the present invention has the characteristics of high electrical conductivity, can reduce the on-resistance and contact resistance of the line at the same time, and satisfies the flow of large current; in addition, its melting point is as low as possible while being able to withstand reflow soldering safely.
  • the protection element of the present invention can also safely cut off the current path and protect the circuit in the event of overheating by adopting a non-fuse mode. When the heating element in the self-control protection element of the present invention works, the self-fuse unit can be quickly blown, the current path can be cut off safely, and the circuit can be protected.
  • the self-fuse unit of the conductive sheath core structure the outer sheath is made of high-conductivity, high-melting-point material, and the inner core is a low-melting point material
  • the self-fuse unit can meet the needs of large current flow in the element, and in addition
  • the high melting point sheath material can lock the inner core material to ensure that the self-fuse unit is in good condition after reflow soldering, and there is no fusing, shrinkage, and inner core material melting and outflow.
  • the self-fuse protection element involved in the present invention has high electrical conductivity because it adopts a self-fuse unit, which can reduce the on-resistance and contact resistance of the line at the same time. Compared with the protection element of the same size, its The rated current load significantly mentions that the lower melting point characteristic enables rapid melting.
  • a self-control protection element involved in the present invention adopts a self-fuse unit. Because the heating unit works under a certain power, after the self-fuse unit absorbs heat, it quickly melts and gathers, erodes the outer sheath, and wets and accumulates in the nickel, The surface of the metal layer such as gold or nickel, platinum or silver, platinum, etc., is quickly disconnected.
  • Fig. 1 is the sectional structure schematic diagram of the self-fuse unit of the present invention
  • FIG. 2 is a schematic plan view of a self-fuse unit of the present invention.
  • FIG. 3 is a schematic plan view of the self-fuse protection element of the present invention that omits the cover member;
  • FIG. 4 is a schematic cross-sectional structure diagram of the self-fuse protection element of the present invention, including two application modes of FIG. 4(a) and FIG. 4(b);
  • Fig. 5 is the principle schematic diagram of the self-fuse protection element
  • FIG. 6 is a schematic plan view of the control type protection element with the cover body part omitted in the present invention.
  • FIG. 7 is a schematic cross-sectional structure diagram of the self-control protection element of the present invention, including two application modes of FIG. 7(a) and FIG. 7(b);
  • Fig. 8 is the principle schematic diagram of the self-control protection element
  • 100 - self-fuse unit 101 - inner core; 102 - outer sheath;
  • 303 front conductor electrode
  • 303a first electrode
  • 303b second electrode
  • 601 the lead-in electrode
  • 601a the first lead-in electrode
  • 601b the second lead-in electrode
  • FIG. 1 is a schematic cross-sectional structure diagram of the self-fuse unit of the present invention
  • FIG. 2 is a schematic plan view of the self-fuse unit of the present invention.
  • a self-fuse unit 100 for protecting a device is a conductive sheath core structure with a resistivity of 1.5-40 ⁇ .cm
  • the sheath core structure includes an inner core 101 and an outer sheath 102, wherein the outer sheath 102 is in contact with the surface of the inner core 101 and fully cover the periphery of the inner core 101, the surface of the inner core 101 is in contact with the outer sheath 102, the melting point and electrical conductivity of the outer sheath 102 are higher than those of the inner core 101, and the inner core 101 is made of a metal material or a polymer material
  • the outer sheath 102 is a silver-plated layer, which is used to inhibit the swelling deformation or melting outflow of the inner core material.
  • the outer sheath 102 adopts the preparation method of chemical silver plating, which includes the following steps in sequence.
  • the inner core 101 is made into a 2.0*2.0*0.6mm chip-shaped substrate by shearing or die punching, and then it is placed in contact with an 80v% sulfuric acid aqueous solution at 40°C for 30 seconds, and deionized water washing, drying;
  • the substrate is placed in a sensitizer (SnCl 2 solution 15g/L) for sensitization for 200 minutes, taken out, washed with deionized water, and dried;
  • a sensitizer SnCl 2 solution 15g/L
  • the 3rd step put into catalyst (PdCl 2 solution 0.1g/L) in catalysis for 360 minutes, take out and wash with deionized water, dry to obtain the product to be plated;
  • a self-fuse unit as shown in Figures 1 and 2, has a core-sheath structure composed of an inner core 101 and an outer sheath 102, the inner core 101 is a metal material or a polymer material, and the outer sheath 102 is a silver-plated layer,
  • the outer sheath 102 adopts the preparation method of electroplating and barrel silver plating, which comprises the following steps in sequence:
  • the material of the inner core 101 is made into a 2.0*2.0*0.6mm chip-shaped substrate by shearing or die punching, and then placed in contact with an 80v% sulfuric acid aqueous solution at 40° C. for 30 seconds. Ionized water cleaning, drying;
  • the 3rd step put into the PdCl solution of catalyst 0.1g/L to catalyze for 360 minutes, take out and wash with deionized water, and dry to obtain the product to be plated;
  • the fourth step is to place the product to be plated in the barrel plating, immerse it in the electroplating solution, control the temperature of the silver plating solution at 30°C, set the constant current 15A current mode at the same time, and use the coating thickness tester to detect the thickness of the silver-plated layer in real time to achieve internal
  • the surface of the core 101 is fully coated with the silver-plated sheath 102 material, and the silver-plated sheath 102 with a thickness of 2-20 ⁇ m is optimally coated.
  • a self-fuse unit as shown in Figures 1 and 2, has a core-sheath structure composed of an inner core 101 and an outer sheath 102, the inner core 101 is a metal material or a polymer material, and the outer sheath 102 is rolled composite and electroplating.
  • the preparation method of the combination of barrel plating and silver plating comprises the following steps in sequence:
  • a 10 ⁇ m silver thin film is attached to the upper and lower surfaces of the 0.6mm inner core 101, combined by calendering and compounding, using shearing or die stamping to make a 2.0*2.0 piece shape, and then place it at 40 °C 80v% sulfuric acid aqueous solution for 30 seconds, washed with deionized water, and dried;
  • the 3rd step put into the PdCl solution of catalyst 0.1g/L to catalyze for 360 minutes, take out and wash with deionized water, and dry to obtain the product to be plated;
  • the product to be plated is placed in the barrel plating, immersed in the plating solution, the temperature of the silver plating solution is controlled at 30°C, and the constant current 15A current mode is set at the same time.
  • the temperature of the silver plating solution is controlled at 30°C
  • the constant current 15A current mode is set at the same time.
  • the self-fusing protection element is prepared by using a self-fusing unit. When the power exceeds the rated circuit, it will fuse due to self-heating and disconnect the circuit.
  • the advantage is that the protection device can withstand reflow soldering and mounting, and at the same time, the internal resistance of the fuse unit (fuse) is low, and can be used as an overcurrent protection device with a larger current.
  • FIG. 3 is a schematic plan view of the self-fuse protection element omitting the cover part of the present invention
  • FIG. 4 (a) is a schematic cross-sectional structure diagram of the self-fuse protection element of the present embodiment.
  • a self-fuse protection element 300 includes a self-fuse unit 100. , the upper cover 307, the ceramic substrate 301 and the conductor electrodes, when the current exceeds the rated current, they are automatically disconnected, including:
  • the ceramic substrate 301 is provided with a front conductor electrode 303 on the surface, which is divided into a first electrode 303a and a second electrode 303b; and a back conductor electrode 302;
  • the self-fuse unit 100 is placed on the surface of the ceramic substrate 301, and the self-fuse unit 100 is connected to the first electrode 303a and the second electrode 303b by soldering 305;
  • the barrier line 304 which is an insulating medium, is located outside the connection end of the first electrode 303a and the second electrode 303b connected by the solder of the self-fuse unit 100, and includes the first and second barrier lines 3041 and 3042, which are used to block the self-fuse protection element sticker Excessive solder during use is installed to prevent the solder from contacting the self-fuse unit 100 inside the component, resulting in the risk of self-fuse protection components being blown by over-reflow soldering. Prepare as follows:
  • the ceramic substrate 301 is rectangular, with left and right semicircular through holes 3091 and 3092 on its two sides and plugs for circuit conduction as shown in FIG. 4( a ).
  • the hole 308 is formed on the back of the ceramic substrate 301 by printing a corresponding pattern of silver as the main component of the back conductor electrode 302, and then by sintering, it is closely connected with the ceramic substrate 301;
  • a corresponding pattern of front conductor electrodes 303 with silver as the main component is also formed by printing, wherein the front conductor electrodes 303 are divided into a first electrode 303a and a second electrode 303b. , and is closely connected with the ceramic substrate 301, forming the back and front of the ceramic substrate to be connected through the conductor electrodes;
  • the third step is to form a barrier line 304 mainly composed of an insulating medium by printing at a specific position of the front conductor electrode 303 on the front side of the ceramic substrate 301, that is, the inner side of the left and right semicircular holes 3091 and 3902, including the left and right barrier lines 3041 and 3042, and then pass through Sintering and molding, the barrier line 304 mainly plays the role of limiting the installation of the self-fuse protection unit of the present invention; at the same time, it isolates the solder paste from contacting the self-fuse unit 100 when the product is mounted to form a lower melting point alloy, which overcomes the occurrence of over-reflow soldering of the product. Self-fuse unit 100 fuse risk;
  • the 4th step on the front conductor electrode 303, by printing solder 305 and installing and placing the self-fuse unit 100 of the present invention, then through the high temperature welding mode, the self-fuse unit 100 is welded above the front conductor electrode 303;
  • the fifth step is to coat the adhesive 306 near the four top corners of the ceramic substrate 301, and place the upper cover 307 of the injection molded part on the adhesive 306, apply a certain pressure and place it at a certain temperature to make the adhesive Curing agent 306;
  • the upper cover 307 is bonded to the periphery of the upper surface of the ceramic substrate 301 through the adhesive 306;
  • the self-fuse protection element 300 of the present invention can be obtained.
  • the principle diagram of the self-fuse protection element 300 is similar to the principle of a conventional fuse.
  • the terminal current is too large, the self-heating of the protection element is difficult to maintain thermal balance, and the heat is rapidly accumulated. Under the impact of a large current, the self-fuse unit 100 is disconnected to protect the circuit.
  • FIG. 3 is a schematic plan view of the self-fuse protection element omitting the cover part of the present invention
  • FIG. 4(b) is a schematic cross-sectional structure diagram of the self-fuse protection element of the present embodiment, a self-fuse protection element 300, and the structure of application example 1
  • the ceramic substrate 301 is not provided with plugging holes, including the self-fuse unit 100, the upper cover 307, the ceramic substrate 301 and the conductor electrodes. When the current exceeds the rated current, it is automatically disconnected, including:
  • the ceramic substrate 301 is rectangular, and there are left and right semicircular holes 3091 and 3902 on the sides of the ceramic substrate 301 , and a back conductor electrode with a corresponding pattern of silver as the main component is formed on the back of the ceramic substrate 301 by printing. 302, and then tightly connected with the ceramic substrate 301 by sintering;
  • a front conductor electrode 303 with a corresponding pattern of silver as the main component is also formed by printing, wherein the front conductor electrode 303 is divided into a first electrode 303a and a second electrode 303b, and then by sintering, It is closely connected with the ceramic substrate 301, so that the back and front of the ceramic substrate are connected through conductor electrodes;
  • the third step is to form barrier lines 304 with insulating medium as the main component, including left and right barrier lines 3041 and 3042, by printing at specific positions of the front conductor electrodes 303 on the front side of the ceramic substrate 301, that is, inside the left and right semicircular holes 3091 and 3902.
  • the barrier line 304 mainly plays the role of limiting the installation of the self-fuse protection unit of the present invention, and at the same time isolates the solder paste from contacting the self-fuse unit 100 during product placement, forming a lower melting point alloy, preventing the product from over-reflow soldering The risk of fusing the rear self-fuse unit.
  • the fourth step on the front conductor electrode 303, by printing solder 305 and installing and placing the self-fusing unit 100 of the present invention, and then soldering the self-fusing unit above the front conductor electrode 303 by high temperature welding.
  • the fifth step is to coat the adhesive 306 near the four top corners of the ceramic substrate 301, and place the upper cover 307 of the injection molded part on the adhesive 306, apply a certain pressure and place it at a certain temperature to make the adhesive
  • the binder 306 cures.
  • the self-fuse protection element 300 of the present invention can be obtained.
  • the self-fuse unit can also be used to prepare a self-control protection element.
  • the self-fuse unit inside the element absorbs a certain amount of power and heat and reaches the melting point of the self-fuse unit, it fuses and disconnects the circuit.
  • the advantage is that the protection device has a low internal resistance, which can not only withstand reflow soldering and mounting, at the same time, after a certain voltage is input, the internal heating body of the device can stably output a certain power and heat, and the internal fuse unit can quickly fuse after absorbing a certain power and heat. , gather, disconnect the circuit, play the role of protecting the circuit.
  • FIG. 6 is a schematic plan view of the self-control protection element of the present invention that omits the cover part;
  • FIG. 7(a) is a schematic cross-sectional structure diagram of the self-control protection element of the present invention, a self-fuse unit prepared by using the above embodiment.
  • Self-regulating protection element 600 including,
  • the ceramic substrate 301 is provided with a front conductor electrode 303 on the surface, which is divided into a first electrode 303a and a second electrode 303b;
  • the heating element 603 is formed on the above-mentioned ceramic substrate 301 or inside the above-mentioned ceramic substrate 301, and the electrode 604 is drawn out from the heating element 603;
  • the self-fuse unit 100 is located above the heating element 603, welded with solder 305, and cross-connects the first electrode 303a, the heating element 603 lead-out electrode 604 and the second electrode 303b;
  • the barrier wire 304 which is an insulating medium, is located outside the first electrode 303a and the second electrode 303b to block the excess solder when the self-control protection element 600 is mounted, and prevent the solder from contacting the self-fuse unit 100 inside the element, causing the self-control protection element to overheat.
  • the risk of reflow soldering fusing is prepared as follows:
  • the ceramic substrate 301 is rectangular, with left and right semicircular through holes 3091 and 3092 on its sides and left and right plug holes 3081 on which are convenient for circuit conduction as shown in FIG. 7( a ). , 3082; the back conductor electrode 302 with silver as the main component of the corresponding pattern is formed on the back of the substrate by printing, and then tightly connected with the ceramic substrate by sintering;
  • a corresponding pattern of front conductor electrodes 303 with silver as the main component is also formed by printing, wherein the front conductor electrodes 303 are divided into a first electrode 303a and a second electrode 303b. , which is closely connected with the ceramic substrate; the back and front of the ceramic substrate 301 are formed into conduction through the conductor electrodes; the lead-in electrode 601 is divided into a first lead-in electrode 601a and a second lead-in electrode 601b, by printing a certain resistance value between the two electrodes.
  • the slurry (the main component of which contains palladium or ruthenium) is sintered at high temperature to form a heating element 603 between the first introduction electrode 601a and the second introduction electrode 601b;
  • a layer of insulating layer 602 is formed over the heating element 603 by printing insulating medium paste and sintering at high temperature on the heating element 603;
  • the fourth step on the insulating layer 602, by printing electrode paste and sintering at high temperature, a layer of lead-out electrode 604 is formed on the top of the insulating layer 602, and one end is connected to the lead-in electrode 601;
  • the fifth step is to form a barrier line 304 with an insulating medium as the main component by printing at a specific position of the front conductor electrode 303 on the front side of the ceramic substrate 301, that is, outside the front conductor electrode 303, and inside the left and right semicircular holes 3091 and 3902, including the left and right
  • the barrier lines 3041 and 3042 are formed by high temperature sintering.
  • the barrier line 304 mainly plays the role of limiting the installation of the self-fuse unit 100 of the present invention, and at the same time isolates the customer's solder paste from contact with the self-fuse unit 100 during product placement, forming a lower melting point. Alloy, there is a risk of self-fuse unit 100 fusing after the product has been reflowed;
  • the self-fuse unit 100 of the present invention is installed and placed by printing the solder 305, and then the self-fuse unit 100 is welded to the front-side conductor electrode 303 and the lead-out electrode 604 by welding. above; at the same time, place a flux 605 above the self-fuse unit 100;
  • the adhesive 306 is applied near the four top corners of the ceramic substrate 301, and the upper cover 307 of the injection molded part is placed above the adhesive 306, and a certain pressure is applied and placed at a certain temperature to make the adhesive The binder 306 cures.
  • the self-control protection element 600 of the present invention can be obtained.
  • the principle of the self-control protection element 600 is shown in FIG. 8 .
  • the heating element 603 works, and after the emitted heat is absorbed by the self-fuse unit 100, the self-fuse unit 100 is blown, and plays the role of a protection circuit.
  • a self-control protection element 600 as shown in FIG. 6 is a schematic plan view of the self-control protection element of the present invention without cover parts
  • FIG. 7(b) is a schematic cross-sectional structure diagram of the self-control protection element of the present invention, which is similar to application example 3. , but there is no plugging hole 308 on the ceramic substrate 301, which is prepared according to the following steps:
  • the ceramic substrate 301 is rectangular, and there are semi-circular holes 309 on the side of the substrate or one of the plugging holes 308 shown in FIG. 7(a) on which is convenient for circuit conduction.
  • the backside conductor electrode 302 with silver as the main component is formed on the backside by printing a corresponding pattern, and then sintered to closely connect with the ceramic substrate;
  • a front conductor electrode 303 with a corresponding pattern of silver as the main component is also formed by printing, wherein the front conductor electrode 303 is divided into a first electrode 303a and a second electrode 303b, and then by sintering, It is tightly connected with the ceramic substrate.
  • the back and front sides of the ceramic substrate are connected through conductor electrodes;
  • the lead-in electrode 601 is divided into a first lead-in electrode 601a and a second lead-in electrode 601b, and a paste with a certain resistance value (the main component of which contains palladium or palladium) is printed between the two electrodes. containing ruthenium), and then through high temperature sintering, a heating element 603 is formed between the first introduction electrode 601a and the second introduction electrode 601b;
  • a layer of insulating layer 602 is formed over the heating element 603 by printing insulating medium paste and sintering at high temperature on the heating element 603;
  • the fourth step on the insulating layer 602, by printing electrode paste and sintering at high temperature, a layer of lead-out electrode 604 is formed on the top of the insulating layer 602, and one end is connected to the lead-in electrode 601;
  • a barrier line 304 with an insulating medium as the main component is formed by printing, and then formed by high temperature sintering.
  • the barrier line 304 is mainly used to install the self-fuse of the present invention.
  • the unit 100 acts as a limiter, and at the same time isolates the customer's solder paste from contacting the self-fuse unit 100 when the product is mounted, forming an alloy with a lower melting point, and there is a risk of the self-fuse unit 100 melting after the product is reflowed;
  • the sixth step on the front conductor electrode 303 and the lead-out electrode 604, by printing the solder 305 and installing and placing the self-fuse unit 100 of the present invention, and then by high-temperature welding, the self-fuse unit 100 is welded to the front conductor electrode 303 and the lead-out electrode. 604 above. At the same time, a flux 605 is placed above the self-fuse unit 100;
  • the adhesive 306 is applied near the four top corners of the ceramic substrate 301, and the upper cover 307 of the injection molded part is placed above the adhesive 306, and a certain pressure is applied and placed at a certain temperature to make the adhesive Curing agent 306;
  • the self-control protection element 600 of the present invention can be obtained.

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Abstract

一种用于保护器件的自熔断单元(100)，为导电鞘芯结构，电阻率为1.5-40μΩ.cm，其中，鞘芯结构包括内芯(101)和外鞘(102)，外鞘材料与内芯材料表面接触并全面包覆内芯材料，外鞘材料的熔点和电导率高于内芯材料的外围。

Description

一种自熔断单元及其应用的保护元件 技术领域
本发明属于电路保护技术领域，具体涉及一种自熔断单元及其应用的保护元件。
背景技术
锂离子充电电池在手机、笔记本、平板电脑、数码相机等便携式移动设备中已得到大量地应用，并且正在越来越多地应用到储能电池、两轮车电池、无人机、扫地机等诸多新的领域中。其具有诸多优越性能的同时，却依然有着一旦充放电管理不当，就可能会起火燃烧、爆炸等缺点，特别是在电动车上应用时，因为其使用锂离子电池的数量或体积非常巨大，一旦发生燃烧或爆炸，甚至会有危及到生命的危险。
为确保用户及电子设备的安全，目前广泛对锂离子电池应用保护电路，具有在既定的情况下将电池组的输出截断的功能。保护方式有PTC、Breaker、SMD Fuse、温度保险丝、IC加MOSFET、自控型保护元件等多种。在诸多保护方式中，广泛使用由铅、锡、银、铜、锡、铋、铟、金、铝、镍、锌等低熔点金属体所构成的熔断单元(fuse)，比如：传统的一次性过流熔断器主要是在玻璃或陶瓷管内放置金属体熔断单元而形成；之后发展出的自控型保护元件中也包括有金属体熔断单元。
近年发展的自控型保护元件，当过流发生时，大量的电流流经熔断单元会使得熔断单元发热而熔断，进而达到过流保护作用；除此之外，当过压发生时，电流通过自控型保护元件中的发热元件，使得发热元件产生热量以熔断该熔断单元，进而使电池的电路呈断路的状态而达到过压保护；其集过流保护、过压保护、过温保护等多种保护功能于一身，同时还具有体积小、回流焊工艺片式贴装等特点。
目前市场上的保护方式采用的熔断单元(fuse)，一部分应用在小电流保护领域，其特点是熔断单元的内阻大、熔点低，但多采用波峰焊、插件形式；一部分应用在大电流领域，其特点是熔断单元的内阻低，多采用贴片回流焊形式，但熔点高。
然而，大电流、高电压、高串数锂电池组广泛使用，所以市场对自控型保护元件提出更高需求，其核心在于急需一种内阻小，但熔点低通过能够耐受回流焊工艺的熔断单元，满足贴装使用。
新能源汽车近几年来越来越受到世界各国的重点关注，为了鼓励新能源汽车产业的发展，美国、法国、德国、日本等各国政府纷纷出台优惠政策刺激民众购买新能源汽车。同时基于燃油汽车污染的考虑，各国已经陆陆续续出台限制燃油车生产的政策，特别是像特斯拉这种完全使用锂离子电池作为动力来源的电动汽车受到市场追捧。基于锂离子电池在汽车、电动车、电动工具、无人机等的大量使用，需要开发能承受高电压、大电流的专用保护元件。
例如像特斯拉电动汽车动力电源构成为多个18650电池串联形成电池包，多个电池包并联形成电池组，电池组串联形成电池板。其每个单节电池都连接保险丝进行保护，另外，每个电池包与电池组以及总成电池板都有独立的保险丝保护。因为其串并联方式导致电池包、电池组、电池板的输出大电压与大电流，所以需要能承受高电压、大电流的自控制保护元件。
目前自控制保护元件，多采用熔点300℃左右的含铅及其合金焊料作为熔断单元，因其具有防止保护元件后续回流焊工艺中发生高温熔断，同时具有在镍、金或镍、铂或银、铂等金属层表面较强附着的熔断润湿性能。然而，伴随着电子设备的小型化，为了能够在有限尺寸下提高额定电流，常规的含铅及其合金焊料的高电阻率难以满足需求。
发明内容
针对上述缺陷，本发明的目的在于，提供一种自熔断单元，满足小尺寸要求。
本发明再一目的在于，提供所述自熔断单元的制备方法。
本发明又一目的在于，提供一种利用上述自熔断单元的保护元件，其具有高电导率特性，能够在同时降低线路的导通电阻与接触电阻，满足大电流通流；此外，其熔点在能够安全耐受过回流焊同时尽可能的低。
为了解决上述技术难题，一种用于保护器件的自熔断单元，为导电鞘芯结构，电阻率为1.5-40μΩ.cm，其中，鞘芯结构包括内芯和外鞘，外鞘材料与内芯材料表面接触并全面包覆于内芯材料的外围，内芯材料的表面与外鞘材料相接触，外鞘材料的熔点和电导率高于内芯材料的外围，用于抑制内芯材料熔胀和熔融流出。
本发明提供的一种可用于保护器件的自熔断单元，可作为后述的自熔断保护元件、自控型保护元件的熔断单元(fuse)使用，当通电超过额定的电流时因自发热熔断，断开电路，或因吸收一定功率热量而受热熔断，断开电路。
本发明通过在易熔的内芯材料的外围全面包覆电导率较高的外鞘，外鞘材料的熔点高于内芯材料的熔点，使其满足耐受回流焊工艺下，自熔断单元能够保持其形貌，不发生收缩、起皱、熔断、内芯材料熔融流出等非保持形貌现象。
该自熔断单元在易熔的内芯材料的外围全面包覆有电导率较高的外鞘材料结构简单，生产工艺便捷，成本低廉，使用操作方便，能够在多种保护元件中使用的合金单元。
在上述方案基础上，所述内芯的厚度为0.02-0.2mm之间，所述外鞘的厚度为0.006-0.03mm之间，所述自熔断单元在回流焊工艺中保持原貌，但在高于280℃或放置于超过2W功率发热元件上，能迅速自熔。
该自熔断单元在被加热或吸收到一定功率热量后能够迅速熔断，加热温度高于280℃，即需自熔断单元过流焊温度下保持其形貌并迅速熔断。
所述内芯采用具有高熔融润湿性金属材料或高分子材料。
优选的内芯金属材料为锡、铅、银、铋、铟中的至少一种或二种以上的合金。
优选的内芯高分子材料为聚乙烯、聚丙烯、聚氨酯、聚酯类、聚酰胺、聚醚类、聚乙烯醇、聚氯乙烯、聚苯乙烯、乙烯-乙酸乙烯酯共聚物中的至少一种或二种以上的组合物。
优选的，所述的内芯的表面粗糙度小于0.001mm。
在上述方案基础上，所述外鞘为银、铜、金、铝、镍、锌中的至少一种或二种以上的合金。
所述的外鞘通过化学镀、电镀、挂镀、滚镀、蒸镀、溅射镀、离子镀或压延复合中的一种或多种工艺方式包括在内芯外围的金属包覆层。
本发明的自熔断单元内芯和外鞘组成的鞘芯结构，通过化学镀、蒸镀、溅射镀、电镀、挂镀、滚镀、离子镀、压延复合等一种或多种工艺方式实现，其中：
所述化学镀也称无电解镀或者自催化镀(Auto-catalytic plating)，是在无外加电流的情况下借助合适的还原剂，使镀液中金属离子还原成金属，并沉积到零件表面的一种镀覆方法。化学镀常用溶液为：化学镀银、镀镍、镀铜、镀钴、镀镍磷液、镀镍磷硼液等。
所述蒸镀是指是将材料在真空环境中加热，使之气化并沉积到基片而获得薄膜材料的方法，真空蒸镀工艺一般包括以下步骤：(1)基片表面清洁。真空室内 壁、基片架等表面的油污、锈迹、残余镀料等在真空中易蒸发，直接影响膜层的纯度和结合力；(2)镀前准备。镀膜室抽真空到合适的真空度，对基片和镀膜材料进行预处理。加热基片，其目的是去除水分和增强膜基结合力。在高真空下加热基片，能够使基片的表面吸附的气体脱附。然后经真空泵抽气排出真空室，有利于提高镀膜室真空度、膜层纯度和膜基结合力。然后，达到一定真空度后.先对蒸发源通以较低功率的电，进行膜料的预热或者预熔，为防止蒸发到基板上，用挡板遮盖住蒸发源及源物质，然后输入较大功率的电，将镀膜材料迅速加热到蒸发温度，蒸镀时再移开挡板。(3)蒸镀。在蒸镀阶段要选择合适的基片温度、镀料蒸发温度外，沉积气压是一个很重要的参数。沉积气压即镀膜室的真空度高低，决定了蒸镀空间气体分子运动的平均自由程和一定蒸发距离下的蒸气与残余气体原子及蒸气原子之间的碰撞次数。(4)取件。膜层厚度达到要求以后，用挡板盖住蒸发源并停止加热，但不要马上导入空气。
所述的溅射镀是指用荷能粒子(通常为气体止离子)轰击靶材，使靶材表面部分原子逸出的现象。
所述的离子镀是指在真空条件下，利用气体放电使气体或被蒸发物质部分电离，并在气体离子或被蒸发物质离子的轰击下，将蒸发物质或其反应物沉积在基片上的方法。
本发明提供一种上述自熔断单元的制备方法，依序包括下述步骤：
第一步，将内芯剪切或冲压成2.0*2.0*0.6mm的小片形状基片，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
第二步，将基片放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干得待镀品；
第四步，将待镀品放入化学镀银液中，镀银温度控制在30℃，其中，镀银液为AgNO 3 0.025g/ml、氨水15ml，调pH＝9；还原液为0.045g/ml的C 6H 12O 6溶液；检测镀银层厚度，实现内芯101材料被表面全方面包覆镀银外鞘，形成2-20μm厚度的包覆镀银外鞘。
或者，本发明提供再一种上述自熔断单元的制备方法，依序包括下述步骤：
第一步，将内芯101剪切或冲压成2.0*2.0*0.6mm的小片形状基片，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
第二步，放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干，得待镀品；
第四步，将待镀品放置于滚镀中，浸没于电镀液，控制镀银液温度在30℃，同时设置恒流15A电流模式，实时检测镀银层厚度，实现内芯表面被全方面包覆镀银外鞘材料，形成2-20μm厚度的包覆镀银外鞘。
或者，本发明提供又一种上述自熔断单元的制备方法，依序包括下述步骤：
第一步，在0.6mm的内芯101的上下表面贴合10μm的银薄，通过压延复合方式结合，采用剪切或模具冲压方式，制成2.0*2.0的小片形状，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
第二步，放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干，得待镀品；
第四步，将待镀品放置于滚镀中，浸没于电镀液，控制镀银液温度在30℃，同时设置恒流15A电流模式，通过上下面贴合银薄后，再滚镀方式，使小片的侧边形成银膜包覆，实现内芯材料表面被全方面包覆镀银外鞘材料，实时检测镀银层厚度，形成2-20μm厚度的包覆镀银外鞘材料。
本发明提供了一种自熔断保护元件，利用上述所述的自熔断单元，在超过额定的电流时，自主断开，包含：
陶瓷基板，表面设有正面导体电极，分为第一电极和第二电极；
自熔断单元，置于陶瓷基板表面，使用焊料焊接，自熔断单元连接第一电极和第二电极；
阻挡线，为绝缘介质，位于自熔断单元通过焊料连接的第一电极和第二电极连接端的外侧，阻隔自熔断保护元件贴装使用时过量的焊料，防止焊料与元件内部的自熔断单元接触，造成自熔断保护元件过回流焊熔断风险。
本发明还提供了一种自控型保护元件，利用上述的自熔断单元，包含：
陶瓷基板，表面设有正面导体电极，分为第一电极和第二电极；
发热元件，形成在上述陶瓷基板上或上述陶瓷基板的内部，并从发热元件引出电极；
自熔断单元，位于发热元件上方，使用焊料焊接，横跨连接第一电极、发热元件引出电极和第二电极；
阻挡线，为绝缘介质，位于第一电极和第二电极外侧，阻隔贴装自控型保护元件时过量的焊料，防止焊料与元件内部的自熔断单元接触，造成自控型保护元件过回流焊熔断风险。
上述自控型保护元件在发热元件发热功率超过2W时，自熔断单元受热熔断，自主断开。
本发明保护元件具有高电导率特性，能够在同时降低线路的导通电阻与接触电阻，满足大电流通流；此外，其熔点在能够安全耐受过回流焊的同时尽可能的低。本发明保护元件采用非熔断方式也能够在过热时安全切断电流路径，保护线路。本发明自控制保护元件中发热元件工作时能够迅速熔断该自熔断单元，安全切断电流路径，保护线路。
发明效果显著
依据本发明，导电鞘芯结构的自熔断单元，其外鞘为高电导率、高熔点的材料，内芯为低熔点材料，该自熔断单元即能够满足元件中大电流通流需求，此外在回流焊贴装时，高熔点外鞘材料能够锁定内芯材料，确保自熔断单元过回流焊完好，无熔断、收缩、内芯材料熔融外流等现象。
此外，本发明所涉及的一种自熔断保护元件，因其采用自熔断单元，其具有高电导率特性，能够在同时降低线路的导通电阻与接触电阻，与同尺寸的保护元件比较，其额定电流载荷大幅提到，较低熔点特性能够迅速熔断。
此外，本发明所涉及的一种自控制保护元件，采用自熔断单元，因一定功率下发热单元工作，自熔断单元吸收热量后，迅速熔融收聚，熔蚀外鞘，润湿聚集于镍、金或镍、铂或银、铂等金属层表面，迅速断开。
附图说明
图1是本发明的自熔断单元的剖面结构示意图；
图2是本发明的自熔断单元的平面示意图；
图3是本发明的省略盖体部件自熔断保护元件的平面示意图；
图4是本发明的自熔断保护元件的剖面结构示意图，包括图4(a)和图4(b)二种应用方式；
图5为自熔断保护元件的原理示意图；
图6是本发明的省略盖体部件控型保护元件的平面示意图；
图7是本发明的自控型保护元件的剖面结构示意图，包括图7(a)和图7(b)二种应用方式；
图8是自控型保护元件的原理示意图；
图中标记说明如下：
100——为自熔断单元；101——内芯；102——外鞘；
300——自熔断保护元件；
301——陶瓷基板；
302——背部导体电极；
303——正面导体电极；303a——第一电极；303b——第二电极；
304——阻挡线；3041、3042——左、右阻挡线；
305——焊料；
306——粘结剂；
307——上盖；
308——堵孔导体；
309——半圆形通孔；3091、3902——左、右半圆形通孔；
600——自控型保护元件；
601——引入电极，601a——第一引入电极；601b——第二引入电极；
602——绝缘层；
603——发热元件；
604——引出电极；
605——助熔断剂。
具体实施方式
以下，参照附图，对本发明中自熔断单元、自熔断保护元件、自控型保护元 件进行详细描述并说明。
此外，本发明并不仅限于以下的实施方式，显然在不脱离本发明的主旨范围内可进行各种变形形式。另外，附图中零件的位置、尺寸、比例等存在与实物不同的情况，具体是实物位置，文中附图只是示意性描述。另外，显然即便附图相互之间也存在彼此间位置、尺寸、比例或关系不同的情况。
本发明自熔断单元100的全面包覆实现方式存在多种，实施例如下
实施例1
图1是本发明的自熔断单元的剖面结构示意图；图2是本发明的自熔断单元的平面示意图。
一种用于保护器件的自熔断单元100，为导电鞘芯结构，电阻率为1.5-40μΩ.cm，鞘芯结构包括内芯101和外鞘102，其中，外鞘102与内芯101表面接触并全面包覆于内芯101的外围，内芯101的表面与外鞘102相接触，外鞘102的熔点和电导率高于内芯101，所述内芯101为金属材料或高分子材料，外鞘102为镀银层，用于抑制内芯材料熔胀变形或熔融流出，本实施例外鞘102采用化学镀银的制备方法，依序包括下述步骤
第一步，将内芯101通过剪切或模具冲压方式，制成2.0*2.0*0.6mm的小片形状基片，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
第二步，将基片放入敏化剂(SnCl 2溶液15g/L)中敏化200分钟，取出用去离子水洗净，烘干；
第三步，放入催化剂(PdCl 2溶液0.1g/L)中催化360分钟，取出用去离子水洗净，烘干得待镀品；
第四步，将待镀品放入化学镀银液中，镀银温度控制在30℃，其中，镀银液为AgNO 3 0.025g/ml、氨水15ml，调pH＝9，还原液为C 6H 12O 6 0.045g/ml；使用镀层厚度测试仪实时检测镀银层厚度，实现内芯101材料表面全方面包覆镀银外鞘102，最优包覆形成2-20μm厚度的包覆镀银外鞘102。
实施例2
一种自熔断单元，如图1和图2所示，由内芯101和外鞘102构成的芯鞘结构，所述内芯101为金属材料或高分子材料，外鞘102为镀银层，本实施例外鞘 102采用电镀滚镀镀银的制备方法，依序包括下述步骤：
第一步，将内芯101材料通过剪切或模具冲压方式，制成2.0*2.0*0.6mm的小片形状基片，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
第二步，放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干，得待镀品；
第四步，将待镀品放置于滚镀中，浸没于电镀液，控制镀银液温度在30℃，同时设置恒流15A电流模式，使用镀层厚度测试仪实时检测镀银层厚度，实现内芯101表面全方面包覆镀银外鞘102材料，最优包覆形成2-20μm厚度的包覆镀银外鞘102。
实施例3
一种自熔断单元，如图1和图2所示，由内芯101和外鞘102构成的芯鞘结构，所述内芯101为金属材料或高分子材料，外鞘102为压延复合与电镀滚镀镀银相结合的制备方法，依序包括下述步骤：
第一步，在0.6mm的内芯101的上下表面贴合10μm的银薄，通过压延复合方式结合，采用剪切或模具冲压方式，制成2.0*2.0的小片形状，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
第二步，放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干，得待镀品；
第四步，将待镀品放置于滚镀中，浸没于电镀液，控制镀银液温度在30℃，同时设置恒流15A电流模式。通过上下面贴合银薄后，再滚镀方式，使小片的侧边形成银膜包覆，实现内芯101材料表面全方面包覆镀银外鞘102材料，使用镀层厚度测试仪实时检测镀银层厚度，最优包覆形成2-20μm厚度的包覆镀银外鞘材料。
应用自熔断单元制备自熔断保护元件，当通电超过额定的电路时因自发热熔 断，断开电路。其优点是该保护器件，既能耐受回流焊贴装，同时熔断单元(fuse)内阻较低，可作为较大电流的过流保护器件。
应用例1
如图3本发明的省略盖体部件自熔断保护元件的平面示意图、图4(a)本实施例自熔断保护元件的剖面结构示意图所示，一种自熔断保护元件300，包括自熔断单元100、上盖307、陶瓷基板301和导体电极，在电流超过额定的电流时，自主断开，包含：
陶瓷基板301，表面设有正面导体电极303，分为第一电极303a和第二电极303b；以及，背面导体电极302；
自熔断单元100，置于陶瓷基板301表面，自熔断单元100通过焊料305焊接连接第一电极303a和第二电极303b；
阻挡线304，为绝缘介质，位于自熔断单元100通过焊料连接的第一电极303a和第二电极303b连接端的外侧，包括第一、第二阻挡线3041、3042，用于阻隔自熔断保护元件贴装使用时过量的焊料，防止焊料与元件内部的自熔断单元100接触，造成自熔断保护元件过回流焊熔断风险。按如下步骤制备：
第一步，如图3所示，陶瓷基板301为矩形，其二侧边有左、右半圆形通孔3091、3092和图4(a)所示的其上有便于电路导通的堵孔308，在陶瓷基板301的背面通过印刷方式形成相应图案的银为主要成份的背面导体电极302，再通过烧结，与陶瓷基板301紧密连接；
第二步，在陶瓷基板301的正面，也通过印刷方式形成相应图案的银为主要成份的正面导体电极303，其中，正面导体电极303分为第一电极303a和第二电极303b，再通过烧结，与陶瓷基板301紧密连接，形成陶瓷基板的背面与正面通过导体电极导通；
第三步，在陶瓷基板301正面的正面导体电极303特定位置，即左右半圆孔3091、3902内侧，通过印刷方式形成以绝缘介质为主要成分的阻挡线304，包括左右阻挡线3041、3042再通过烧结成型，该阻挡线304主要起到安装本发明自熔断保护单元限位作用；同时，隔绝产品贴装时焊锡膏与自熔断单元100接触，形成更低熔点合金，克服出现产品过回流焊后自熔断单元100熔断风险；
第四步，在正面导体电极303上，通过印刷焊料305并安装放置本发明的自 熔断单元100，再经过高温焊接方式，把自熔断单元100焊接在正面导体电极303上方；
第五步，在陶瓷基板301四个顶角附近，涂覆粘结剂306，并把注塑件上盖307置于粘结剂306上方，施加一定的压力并置于一定的温度下，使粘结剂306固化；
第六步，上盖307通过粘结剂306粘接在陶瓷基板301上表面的四周；
完成上述步骤后，即可得到本发明的自熔断保护元件300，该自熔断保护元件300的原理图，与常规保险丝原理类似，过流保护，如图5所示，图中，当1-2端电流过大时，保护元件自身发热量已难以维持热平衡，并在迅速累计热量，在大电流冲击下，自熔断单元100发生断开，起保护电路作用。
应用例2
图3是本发明的省略盖体部件自熔断保护元件的平面示意图；图4(b)是本实施例的自熔断保护元件的剖面结构示意图，一种自熔断保护元件300，与应用例1结构近似，只是陶瓷基板301没设堵孔，包括自熔断单元100、上盖307、陶瓷基板301和导体电极，在电流超过额定的电流时，自主断开，包含：
按如下步骤制备：
第一步，如图3所示，陶瓷基板301为矩形，陶瓷基板301侧边有左右半圆孔3091、3902，在陶瓷基板301的背面通过印刷方式形成相应图案的银为主要成份的背面导体电极302，再通过烧结，与陶瓷基板301紧密连接；
第二步，在陶瓷基板301的正面，也通过印刷方式形成相应图案的银为主要成份的正面导体电极303，其中正面导体电极303分为第一电极303a和第二电极303b，再通过烧结，与陶瓷基板301紧密连接，形成陶瓷基板的背面与正面通过导体电极导通；
第三步，在陶瓷基板301正面的正面导体电极303特定位置，即左右半圆孔3091、3902内侧，通过印刷方式形成以绝缘介质为主要成分的阻挡线304，包括左、右阻挡线3041、3042再通过烧结成型，该阻挡线304主要起到安装本发明自熔断保护单元限位作用，同时隔绝产品贴装时焊锡膏与自熔断单元100接触，形成更低熔点合金，防止出现产品过回流焊后自熔断单元熔断风险。
第四步，在正面导体电极303上，通过印刷焊料305并安装放置本发明的自 熔断单元100，再经过高温焊接方式，把自熔断单元焊接在正面导体电极303上方。
第五步，在陶瓷基板301四个顶角附近，涂覆粘结剂306，并把注塑件上盖307置于粘结剂306上方，施加一定的压力并置于一定的温度下，使粘结剂306固化。
完成上述步骤后，即可得到本发明的自熔断保护元件300。
本实施例只是为了便于理解而作的一个示例，本行业相关科研人员或工程设计人员通过更改单个或几个步骤，进行微小调整，但原理示意图等同于如图5结构的，均被视为在本专利申请的权利要求书覆盖范围之内。
应用上述自熔断单元也可制备自控型保护元件，当元件内部的自熔断单元吸收一定功率热量后，达到该自熔断单元的熔点后，其发生熔断，断开电路。其优点是该保护器件具有较低内阻，既能耐受回流焊贴装，同时在输入一定电压后，器件内部发热体能稳定输出一定功率热量，内部熔断单元吸收一定功率热量后能够迅速发生熔断、聚集，断开电路，起到保护电路作用。
应用例3
图6是本发明的省略盖体部件自控型保护元件的平面示意图；图7(a)是本发明的自控型保护元件的剖面结构示意图所示，一种利用上述实施例制备的自熔断单元的自控型保护元件600，包含，
陶瓷基板301，表面设有正面导体电极303，分为第一电极303a和第二电极303b；
发热元件603，形成在上述陶瓷基板301上或上述陶瓷基板301的内部，并从发热元件603引出电极604；
自熔断单元100，位于发热元件603上方，使用焊料305焊接，横跨连接第一电极303a、发热元件603引出电极604和第二电极303b；
阻挡线304，为绝缘介质，位于一电极303a和第二电极303b外侧，阻隔贴装自控型保护元件600时过量的焊料，防止焊料与元件内部的自熔断单元100接触，造成自控型保护元件过回流焊熔断风险，按如下步骤制备：
第一步，如图6所示，陶瓷基板301为矩形，其侧边有左右半圆形通孔3091、3092和图7(a)所示的其上有便于电路导通的左右堵孔3081、3082；在基板的背 面通过印刷方式形成相应图案的银为主要成份的背面导体电极302，再通过烧结，与陶瓷基板紧密连接；
第二步，在陶瓷基板301的正面，也通过印刷方式形成相应图案的银为主要成份的正面导体电极303，其中，正面导体电极303分为第一电极303a和第二电极303b，再通过烧结，与陶瓷基板紧密连接；形成陶瓷基板301的背面与正面通过导体电极导通；引入电极601分为第一引入电极601a和第二引入电极601b，通过在该两电极间印刷有一定电阻值的浆料(其主要成分含钯或含钌)，再通过高温烧结，在第一引入电极601a和第二引入电极601b间形成一个发热元件603；
第三步，在发热元件603的上方，通过印刷绝缘介质浆料，并通过高温烧结，形成在发热元件603上方覆盖一层绝缘层602；
第四步，在绝缘层602上方，通过印刷电极浆料，并通过高温烧结，形成在绝缘层602上方覆盖一层引出电极604，并且一端与引入电极601相连接；
第五步，在陶瓷基板301正面的正面导体电极303特定位置，，即正面导体电极303外侧，左右半圆孔3091、3902内侧，通过印刷方式形成以绝缘介质为主要成分的阻挡线304，包括左右阻挡线3041、3042，再通过高温烧结成型，该阻挡线304主要起到安装本发明自熔断单元100限位作用，同时隔绝产品贴装时客户焊锡膏与自熔断单元100接触，形成更低熔点合金，出现产品过回流焊后自熔断单元100熔断风险；
第六步，在正面导体电极303和引出电极604上，通过印刷焊料305并安装放置本发明的自熔断单元100，再经过焊接方式，把自熔断单元100焊接在正面导体电极303和引出电极604上方；同时，再在自熔断单元100上方放置助熔断剂605；
第七步，在陶瓷基板301四个顶角附近，涂覆粘结剂306，并把注塑件上盖307置于粘结剂306上方，施加一定的压力并置于一定的温度下，使粘结剂306固化。
完成上述步骤后，即可得到本发明的自控型保护元件600，该自控型保护元件600的原理如图8所示，具有常规保险丝过流保护功能外，还具有过压保护功能，当1-3端或2-3端通入一定电压后，发热元件603工作，发出热量被自熔断 单元100所吸收后，该自熔断单元100发生熔断，起保护电路作用。
应用例4
一种自控型保护元件600，如图6本发明的省略盖体部件自控型保护元件的平面示意图，图7(b)本发明的自控型保护元件的剖面结构示意图所示，与应用例3近似，只是陶瓷基板301上未设堵孔308，按如下步骤制备：
第一步，如图6所示，陶瓷基板301为矩形，基板侧边有半圆孔309或图7(a)所示的其上有便于电路导通的堵孔308中其一，在基板的背面通过印刷方式形成相应图案的银为主要成份的背面导体电极302，再通过烧结，与陶瓷基板紧密连接；
第二步，在陶瓷基板301的正面，也通过印刷方式形成相应图案的银为主要成份的正面导体电极303，其中正面导体电极303分为第一电极303a和第二电极303b，再通过烧结，与陶瓷基板紧密连接。形成陶瓷基板的背面与正面通过导体电极导通；引入电极601分为第一引入电极601a和第二引入电极601b，通过在两电极间印刷有一定电阻值的浆料(其主要成分含钯或含钌)，再通过高温烧结，在第一引入电极601a和第二引入电极601b间形成一个发热元件603；
第三步，在发热元件603的上方，通过印刷绝缘介质浆料，并通过高温烧结，形成在发热元件603上方覆盖一层绝缘层602；
第四步，在绝缘层602上方，通过印刷电极浆料，并通过高温烧结，形成在绝缘层602上方覆盖一层引出电极604，并且一端与引入电极601相连接；
第五步，在陶瓷基板301正面的正面导体电极303特定位置，通过印刷方式形成以绝缘介质为主要成分的阻挡线304，再通过高温烧结成型，该阻挡线304主要起到安装本发明自熔断单元100限位作用，同时隔绝产品贴装时客户焊锡膏与自熔断单元100接触，形成更低熔点合金，出现产品过回流焊后自熔断单元100熔断风险；
第六步，在正面导体电极303和引出电极604上，通过印刷焊料305并安装放置本发明的自熔断单元100，再经过高温焊接方式，把自熔断单元100焊接在正面导体电极303和引出电极604上方。同时再在自熔断单元100上方放置助熔断剂605；
第七步，在陶瓷基板301四个顶角附近，涂覆粘结剂306，并把注塑件上盖 307置于粘结剂306上方，施加一定的压力并置于一定的温度下，使粘结剂306固化；
完成上述步骤后，即可得到本发明的自控制保护元件600。
本应用例只是为了便于理解而作的一个示例，本行业相关科研人员或工程设计人员通过更改单个或几个步骤，进行微小调整，但原理示意图等同于如图8结构的，均被视为在本专利申请的权利要求书覆盖范围之内。

Claims (15)

  1. 一种用于保护器件的自熔断单元，其特征在于，为导电鞘芯结构，电阻率为1.5-40μΩ.cm，其中，鞘芯结构包括内芯和外鞘，外鞘材料与内芯材料表面接触并全面包覆于内芯材料，内芯材料的表面与外鞘材料相接触，外鞘材料的熔点和电导率高于内芯材料的外围，用于抑制内芯材料熔胀和熔融流出。
  2. 如权利要求1所述的自熔断单元，其特征在于，所述内芯的厚度为0.06-0.3mm之间，所述外鞘的厚度为0.002-0.02mm之间，所述自熔断单元在回流焊工艺中保持原貌，但在高于280℃或放置于超过2W功率发热元件上，能迅速自熔。
  3. 如权利要求1或2所述的自熔断单元，其特征在于，所述的外鞘通过化学镀、电镀、挂镀、滚镀、蒸镀、溅射镀、离子镀或压延复合中的一种或多种工艺方式包括在内芯外的金属包覆层。
  4. 如权利要求1或2所述的自熔断单元，其特征在于，所述内芯材料采用具有高熔融润湿性金属材料。
  5. 如权利要求4所述的自熔断单元，其特征在于，所述金属材料为锡、铅、银、铋、铟中的至少一种或二种以上的合金。
  6. 如权利要求1或2所述的自熔断单元，其特征在于，所述内芯采用高分子材料。
  7. 如权利要求6所述的自熔断单元，其特征在于，所述的高分子材料为聚乙烯、聚丙烯、聚氨酯、聚酯类、聚酰胺、聚醚类、聚乙烯醇、聚氯乙烯、聚苯乙烯、乙烯-乙酸乙烯酯共聚物中的至少一种或二种以上的组合物。
  8. 如权利要求3所述的自熔断单元，其特征在于，所述外鞘为银、铜、金、铝、镍、锌中的至少一种或二种以上的合金。
  9. 如权利要求1或2所述的自熔断单元，其特征在于，所述的内芯的表面粗糙度小于0.001mm。
  10. 一种根据权利要求1至9任一项所述自熔断单元的制备方法，依序包括下述步骤：
    第一步，将内芯剪切或冲压成2.0*2.0*0.6mm的小片形状基片，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
    第二步，将基片放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去 离子水洗净，烘干；
    第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干得待镀品；
    第四步，将待镀品放入化学镀银液中，镀银温度控制在30℃，其中，镀银液为AgNO 3 0.025g/ml、氨水15ml，调pH＝9；还原液为0.045g/ml的C 6H 12O 6溶液；检测镀银层厚度，实现内芯101材料被表面全方面包覆镀银外鞘，形成2-20μm厚度的包覆镀银外鞘。
  11. 一种根据权利要求1至9任一项所述自熔断单元的制备方法，依序包括下述步骤：
    第一步，将内芯101剪切或冲压成2.0*2.0*0.6mm的小片形状基片，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
    第二步，放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
    第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干，得待镀品；
    第四步，将待镀品放置于滚镀中，浸没于电镀液，控制镀银液温度在30℃，同时设置恒流15A电流模式，实时检测镀银层厚度，实现内芯表面被全方面包覆镀银外鞘材料，形成2-20μm厚度的包覆镀银外鞘。
  12. 一种根据权利要求1至9任一项所述自熔断单元的制备方法，依序包括下述步骤：
    第一步，在0.6mm的内芯101的上下表面贴合10μm的银薄，通过压延复合方式结合，采用剪切或模具冲压方式，制成2.0*2.0的小片形状，再将其置于40℃的80v％的硫酸水溶液接触30秒，用去离子水清洗，烘干；
    第二步，放入敏化剂15g/L的SnCl 2溶液中敏化200分钟，取出用去离子水洗净，烘干；
    第三步，放入催化剂0.1g/L的PdCl 2溶液中催化360分钟，取出用去离子水洗净，烘干，得待镀品；
    第四步，将待镀品放置于滚镀中，浸没于电镀液，控制镀银液温度在30℃，同时设置恒流15A电流模式，通过上下面贴合银薄后，再滚镀方式，使小片的侧 边形成银膜包覆，实现内芯材料表面被全方面包覆镀银外鞘材料，实时检测镀银层厚度，形成2-20μm厚度的包覆镀银外鞘材料。
  13. 一种利用权利要求1至9任一项所述自熔断单元的自熔断保护元件，包括自熔断单元，在电流超过额定的电流时，自主断开，包含：
    陶瓷基板，表面设有正面导体电极，分为第一电极和第二电极；
    自熔断单元，置于陶瓷基板表面，自熔断单元通过焊料焊接连接第一电极和第二电极；
    阻挡线，为绝缘介质，位于自熔断单元通过焊料连接的第一电极和第二电极连接端的外侧，阻隔自熔断保护元件贴装使用时过量的焊料，防止焊料与元件内部的自熔断单元接触，造成自熔断保护元件过回流焊熔断风险。
  14. 一种利用权利要求1至9任一项所述自熔断单元的自控型保护元件，包含，
    陶瓷基板，表面设有正面导体电极，分为第一电极和第二电极；
    发热元件，形成在上述陶瓷基板上或上述陶瓷基板的内部，并从发热元件引出电极；
    自熔断单元，位于发热元件上方，使用焊料焊接，横跨连接第一电极、发热元件引出电极和第二电极；
    阻挡线，为绝缘介质，位于第一电极和第二电极外侧，阻隔贴装自控型保护元件时过量的焊料，防止焊料与元件内部的自熔断单元接触，造成自控型保护元件过回流焊熔断风险。
  15. 根据权利要求14自控型保护元件，其特征所述，在发热元件发热功率超过2W时，自熔断单元受热熔断，自主断开。
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