WO2022116055A1 - 显示面板和显示装置 - Google Patents

显示面板和显示装置 Download PDF

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Publication number
WO2022116055A1
WO2022116055A1 PCT/CN2020/133432 CN2020133432W WO2022116055A1 WO 2022116055 A1 WO2022116055 A1 WO 2022116055A1 CN 2020133432 W CN2020133432 W CN 2020133432W WO 2022116055 A1 WO2022116055 A1 WO 2022116055A1
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WO
WIPO (PCT)
Prior art keywords
concave
layer
display panel
convex structure
base substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/133432
Other languages
English (en)
French (fr)
Inventor
邓雷
魏悦
唐霞
邓伟
王倩
代俊秀
周洋
张鑫
屈忆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2023524649A priority Critical patent/JP2023551768A/ja
Priority to US18/252,315 priority patent/US20230422588A1/en
Priority to CN202310317829.3A priority patent/CN116249406A/zh
Priority to KR1020237013659A priority patent/KR20230110493A/ko
Priority to PCT/CN2020/133432 priority patent/WO2022116055A1/zh
Priority to EP20963903.8A priority patent/EP4213214B1/en
Priority to CN202080003174.7A priority patent/CN114846617B/zh
Priority to EP25226366.0A priority patent/EP4701379A3/en
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202111086347.9A priority patent/CN113889517B/zh
Priority to US18/022,435 priority patent/US12382820B2/en
Priority to PCT/CN2022/096679 priority patent/WO2023040360A1/zh
Priority to EP22868737.2A priority patent/EP4273904A4/en
Priority to CN202280001609.3A priority patent/CN116137904A/zh
Publication of WO2022116055A1 publication Critical patent/WO2022116055A1/zh
Anticipated expiration legal-status Critical
Priority to US18/944,716 priority patent/US20250072269A1/en
Priority to US19/250,219 priority patent/US20250324897A1/en
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of semiconductor technology, and in particular, to a display panel and a display device.
  • Embodiments of the present disclosure provide a display panel, including:
  • Cutting the remaining area is located at the periphery of the via hole, and includes: a base substrate, and an encapsulation layer located on one side of the base substrate;
  • At least one circle of concave-convex structures the concave-convex structures are located between the encapsulation layer and the base substrate in the remaining cutting area, at least one circle of the concave-convex structures is distributed around the via holes in sequence, the first concave-convex structure
  • the minimum distance from the outer edge of the via hole is 0 micrometers to 30 micrometers
  • at least one of the concave-convex structures has a surface facing away from the base substrate, and a side surface connected to the surface, wherein the surface, the At least one of the side surfaces is in a concave-convex shape, and the first concave-convex structure is the concave-convex structure with the smallest distance from the center of the via hole.
  • the side surface is in a concave-convex shape; the cross-sectional shape of the concave-convex structure in a direction perpendicular to the base substrate and passing through the center of the via hole includes a T-shape.
  • the side surface is in a concave-convex shape; the cross-sectional shape of the concave-convex structure in a direction perpendicular to the base substrate and passing through the center of the via hole includes a stepped shape.
  • the surface is in a concave-convex shape; the cross-sectional shape of the concave-convex structure in a direction perpendicular to the base substrate and passing through the center of the via hole includes a concave shape.
  • the concave-convex structure includes at least one repeating structure in a direction perpendicular to the base substrate, and the at least one repeating structure is stacked in sequence.
  • the concave-convex structure includes a plurality of the repeating structures, and a flat layer is further provided between two adjacent repeating structures.
  • different repeating structures have the same cross-sectional shape in a direction perpendicular to the base substrate and passing through the center of the via hole.
  • the display panel further includes a display area located on a side of the cut remaining area away from the via hole, and the display area includes a barrier layer sequentially located on one side of the base substrate , buffer layer, active layer, first gate insulating layer, first gate metal layer, second gate insulating layer, second gate metal layer, interlayer dielectric layer, first source and drain layer, first a flat layer, a second source and drain layer, a second flat layer, and a pixel defining layer;
  • the concave-convex structure is composed of the barrier layer, the buffer layer, the first gate insulating layer, the second gate insulating layer, the interlayer dielectric layer, the first flat layer, the One or a combination of the second flat layer and the pixel defining layer is formed.
  • a side of the concave-convex structure facing away from the via hole is further provided with a plurality of circles of first anti-cracking dams, and the first anti-cracking dams are located between the base substrate and the package. Between the layers, multiple circles of the first anti-cracking dams are arranged in sequence around the concave-convex structure.
  • a first anti-crack metal layer is further disposed between each of the first anti-crack dam and the base substrate, and the first anti-crack metal layer is connected to the first anti-crack metal layer.
  • a second anti-cracking metal layer is also arranged between the crack dams.
  • the first anti-crack metal layer is the same layer as the first gate metal layer
  • the second anti-crack metal layer is the same layer as the second gate metal layer.
  • a third anti-crack metal layer is further provided between at least one of the concave-convex structures and the base substrate, and a third crack-prevention metal layer is further provided between the third anti-crack metal layer and the concave-convex structure There is a fourth anti-cracking metal layer;
  • the third anti-crack metal layer is the same layer as the first anti-crack metal layer, and the fourth anti-crack metal layer is the same layer as the second anti-crack metal layer.
  • the distance between the concave-convex structures in two adjacent circles is greater than the distance between the first crack prevention dams in two adjacent circles.
  • the distance between the concave-convex structures in two adjacent circles is twice the distance between the first crack prevention dams in the adjacent two circles.
  • the grooves extend from the encapsulation layer to the buffer layer, and part of the buffer layer is exposed.
  • a side of the first crack prevention dam away from the concave-convex structure is further provided with a plurality of circles of flow stop dams surrounding the first crack prevention dam in turn, and the flow stop dam In the direction of the via hole, the height of each circle of the stop dam in the direction perpendicular to the substrate substrate increases sequentially.
  • a side of the flow stop dam away from the first crack prevention dam is further provided with a plurality of second crack prevention dams that surround the flow stop dam in turn;
  • the structure of the crack dam is the same as that of the first crack prevention dam.
  • the display panel includes three concave-convex structures, five of the first anti-cracking dams, two of the flow-prevention dams, and four of the second anti-cracking dams.
  • the display panel further includes a semi-concave-convex structure, and the semi-concave-convex structure is located between the concave-convex structure and the via hole.
  • different positions of the first concave-convex structure have different maximum widths of cross-sections in a direction perpendicular to the base substrate and passing through the center of the via hole.
  • the minimum distance between the semi-concave-convex structure and the outer edge of the via hole is zero.
  • the cross-sectional shape of the semi-concave-convex structure in a direction perpendicular to the base substrate and passing through the center of the via hole is the cross-sectional shape of the semi-concave-convex structure in a direction perpendicular to the base substrate and passing through the center of the via hole.
  • the minimum distance between the first concave-convex structure and the outer edge of the via hole and the minimum distance k1 between two adjacent concave-convex structures satisfy the following relationship:
  • the concave-convex structure includes a repeating structure in a direction perpendicular to the base substrate;
  • the repeating structure and the first source and drain are in the same layer, or the repeating structure and the second source and drain are in the same layer.
  • the concave-convex structure includes two repeating structures in a direction perpendicular to the base substrate, and the two repeating structures are respectively a first repeating structure, and the two repeating structures are located in the first repeating structure. a second repeating structure on the side facing away from the base substrate;
  • the first repeating structure and the first source and drain are in the same layer, and the second repeating structure and the second source and drain are in the same layer.
  • the concave-convex structure includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer that are sequentially stacked in a direction perpendicular to the base substrate, and the aluminum metal layer
  • the line width of the layer is smaller than the line width of the second titanium metal layer.
  • each of the concave-convex structures is an integral structure.
  • each of the concave-convex structures includes a plurality of solid parts and a plurality of cut-out parts, and the solid parts and the cut-out parts are alternately arranged; all the concave-convex structures in the same concave-convex structure The solid parts have the same center.
  • the encapsulation layer in the cut remaining area includes a first inorganic encapsulation layer, and a second inorganic encapsulation layer on a side of the first inorganic encapsulation layer away from the base substrate .
  • Embodiments of the present disclosure further provide a display device, which includes the display panel provided by the embodiments of the present disclosure.
  • FIG. 1 is a schematic top view of a display panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view along the dotted line EF of FIG. 1;
  • Fig. 3 is the enlarged structure schematic diagram of Fig. 2 in cutting the remaining area
  • 4A is one of the schematic structural diagrams in which the distance between two adjacent concave-convex structures is greater than the distance between two adjacent first crack prevention dams according to an embodiment of the present invention
  • 4B is the second schematic diagram of the structure provided by an embodiment of the present invention in which the distance between two adjacent concave-convex structures is greater than the distance between two adjacent first anti-cracking dams;
  • 4C is a schematic cross-sectional view of the first concave-convex structure T11 on both sides of the center of the via hole K according to an embodiment of the present invention
  • 5A is a schematic cross-sectional structural diagram of another display panel according to an embodiment of the present invention.
  • 5B is a schematic cross-sectional structural diagram of another specific display panel provided by an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a stepped structure provided by an embodiment of the present invention.
  • Fig. 7 is the enlarged structure schematic diagram of Fig. 6 in cutting the remaining area
  • FIG. 8 is a schematic structural diagram of a concave-shaped structure provided by an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a concave-convex structure including a stepped shape and a concave shape provided by an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of a concave-convex structure provided by an embodiment of the present invention including two repeating structures;
  • FIG. 11 is an enlarged schematic view of FIG. 10 in the remaining area of cutting
  • FIG. 12 is a schematic cross-sectional view of a display area of a display panel according to an embodiment of the present invention.
  • FIG. 13 is a schematic top view of a concave-convex structure according to an embodiment of the present invention.
  • FIG. 14 is a schematic top view of another concave-convex structure provided by an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view along the dotted line EF in FIG. 1
  • FIG. 3 is an enlarged schematic view of the remaining area S1 cut in FIG. 2
  • a display panel which includes:
  • the via hole K, the via hole K runs through the display panel; the area where the via hole K is located can specifically be used to place the camera; specifically, the shape of the via hole K can be a circle, an ellipse or a rectangle;
  • the remaining area S1 is cut, and the remaining area S1 is located at the periphery of the via hole K, including: the base substrate 11 and the encapsulation layer 9 located on one side of the base substrate 11;
  • the display panel usually needs to set a cutting area (not shown in the figure) around the via hole K. After cutting, the area that is not cut out in the cutting area can be used as the remaining area of the cutting that is finally left in the display panel;
  • At least one circle of concave-convex structures T, the concave-convex structure T is located between the encapsulation layer 9 and the base substrate 11 in the cutting remaining area S1, at least one circle of concave-convex structures T is distributed in sequence around the vias K, and the first concave-convex structures T11 to the vias K
  • the minimum distance between the outer edges that is, the distance from the first concave-convex structure T11 at the position closest to the first concave-convex structure T11 in the outer edge of the via K, for example, see k3 in FIG.
  • At least one concave-convex structure T has a surface T1 facing away from the base substrate 11, and a side surface T2 connected to the surface T1, wherein at least one of the surface T1 and the side surface T2 is concave-convex, and the first concave-convex structure T11 is a The concave-convex structure T with the smallest distance from the center of the hole K. Specifically, when the cutting position is just at the position where the concave-convex structure T is located, the remaining half of the concave-convex structure T after cutting is also the first concave-convex structure T11. At this time, the first concave-convex structure T11 is closest to the outer edge of the via K. The pitch at the proximity is 0 microns.
  • the cutting remaining area S1 is provided with at least one concave-convex structure T distributed around the via hole K, and at least one of the surface T1 of the concave-convex structure T facing away from the base substrate 11 and the side surface T2 is in a concave-convex shape, It can increase the contact area of the concave-convex structure T with the encapsulation layer 9, enhance the bonding strength of the encapsulation layer, and improve the stress imbalance of the encapsulation layer at the cutting area during the manufacturing process of the hole-drilling screen, and the thermal effect of laser cutting Amplified stress can easily cause the encapsulation layer to peel off, resulting in poor encapsulation, which in turn reduces the production yield of the product.
  • the display panel further includes a display area AA located on the side of the remaining cut area S1 away from the via hole, and a cutting area may be sequentially provided between the via hole K and the display area AA.
  • the first crack prevention area S2 may be provided with a plurality of first crack prevention dams CD1 (Crack Dam1) surrounding the via hole K in turn, to prevent cracks generated during the cutting process from extending to the display area, and to prevent the formation of organic
  • the organic encapsulation material used in the encapsulation layer 92 flows to the remaining area S1 for cutting;
  • the stop area S3 can be provided with multiple dams ID that surround the first anti-cracking dam CD1 in turn to block the formation of the organic encapsulation layer 92
  • the second anti-cracking area S4 can be provided with multiple second anti-cracking dams CD2 (Crack Dam2) surrounding the stop dam ID (IJP Dam) in turn to prevent
  • the cracks generated during the cutting process extend to the display area, and are used to prevent the organic packaging material used in forming the organic packaging layer 92 from flowing over to the remaining area S1 for cutting;
  • the ring line area S5 can be provided with
  • the display area AA may include a first inorganic layer 12 (specifically, may include a barrier layer Barrier and a buffer layer Buffer sequentially located on one side of the base substrate 11 ), a second inorganic layer 13 ( Specifically, it may include a first gate insulating layer GI1 and a second gate insulating layer GI2 located on the first inorganic layer 12 in sequence), and the third inorganic layer 14 (specifically, it may include an interlayer located on the second inorganic layer 13 ).
  • a first inorganic layer 12 specifically, may include a barrier layer Barrier and a buffer layer Buffer sequentially located on one side of the base substrate 11
  • a second inorganic layer 13 Specifically, it may include a first gate insulating layer GI1 and a second gate insulating layer GI2 located on the first inorganic layer 12 in sequence
  • the third inorganic layer 14 specifically, it may include an interlayer located on the second inorganic layer 13 ).
  • the cutting remaining area S1, the first crack prevention area S2, the flow stop area S3, the second crack prevention area S4, and the ring line area S5 can be provided with a first inorganic layer 12, a second inorganic layer 13, a third inorganic layer 14, and a flat layer 3.
  • a light-emitting layer (not shown in the figure) may also be disposed between the encapsulation layer 9 and the pixel-defining layer 4, and the light-emitting layer may cover the remaining cutting area S1, the first crack prevention area S2, the flow stop area S3, the second The crack prevention area S4 and the ring line area S5 are broken at the positions of the concave-convex structure T, the first crack prevention dam CD1 and the second crack prevention dam CD2.
  • the side of the concave-convex structure T away from the via hole K is further provided with a plurality of circles of first anti-cracking dams CD1 , and the first anti-cracking dams CD1 are located on the base substrate 11 and the packaging layer 9 .
  • a plurality of first anti-cracking dams CD1 are arranged in sequence around the concave-convex structure T; a first anti-cracking metal layer 81 is also provided between each first anti-cracking dam CD1 and the base substrate 11, and the first anti-cracking metal
  • a second crack prevention metal layer 82 is further provided between the layer 81 and the first crack prevention dam CD1.
  • the side of the remaining cutting area S1 away from K is further provided with multiple circles of the first crack prevention dam CD1, and the multiple circles of the first crack prevention dam CD1 can prevent the cracks generated during the cutting process from extending to the display area, and , a first anti-cracking metal layer 81 is also provided between each first anti-cracking dam CD1 and the base substrate 11, and a second anti-cracking metal layer 81 is also set between the first anti-cracking metal layer 81 and the first anti-cracking dam CD1
  • the metal layer 82 , the first anti-crack metal layer 81 and the second anti-crack metal layer 82 have better ductility and can better prevent the extension of cracks.
  • the display panel may further have a first gate metal layer, and a second gate metal layer located on the side of the first gate metal layer away from the base substrate 11 .
  • a gate metal layer of the same layer and the same material, and the second anti-crack metal layer 82 may be of the same material as the second gate metal layer; specifically, the first anti-crack metal layer 81 and the second anti-crack metal layer 82
  • the material can be molybdenum. Because molybdenum has better ductility, it is not easy to break during the cutting process, which can better prevent the extension of cracks.
  • the projected pattern of 82 on the base substrate 11 may be consistent with the projected pattern of the first crack prevention dam CD1 on the base substrate 11 , and may specifically be a ring shape.
  • the composition of the first crack prevention dam CD1 may be the same as that of the concave-convex structure T.
  • the first crack prevention dam CD1 and the concave-convex structure T are both composed of signal lines (such as data lines) Contained film layers.
  • a third crack-proof metal layer 83 is further provided between at least one concave-convex structure T and the base substrate 11 , and a third crack-prevention metal layer 83 and the concave-convex structure T are further provided with The fourth anti-crack metal layer 84 ; the third anti-crack metal layer 83 is the same layer as the first anti-crack metal layer 81 , and the fourth anti-crack metal layer 84 is the same layer as the second anti-crack metal layer 82 .
  • the third anti-crack metal layer 83 and the fourth anti-crack metal layer 84 have better ductility, which can further prevent the extension of cracks.
  • the plurality of concave-convex structures T in the cutting remaining region S1 are distributed at equal intervals.
  • the minimum distance from the first concave-convex structure T11 in the remaining region S1 to the outer edge of the via hole is 0 ⁇ m to 30 ⁇ m.
  • the minimum distance between the first concave-convex structure T11 and the outer edge of the via hole is 15 micrometers to 28 micrometers.
  • the minimum distance between the first concave-convex structure T11 and the outer edge of the via hole is 18 micrometers.
  • the distance between two adjacent protruding structures for example, two adjacent first crack prevention dams CD1 in FIG.
  • the distance between two adjacent first crack prevention dams CD1 (for example, in the first crack prevention area S2 in FIG. 4A , the right side of the first first crack prevention dam CD1 from the left and the second from the left
  • the distance between the left sides of the first crack prevention dam CD1 is 14 microns
  • the distance between adjacent two concave-convex structures T (for example, in the cutting residual area S1 in FIG. 4A, the first concave-convex structure T from the left
  • the distance between the right side of the T and the left side of the second concave-convex structure T from the left) is 28 microns.
  • the minimum distance between the first concave-convex structure T11 and the outer edge of the via hole is 0 ⁇ m-30 ⁇ m, that is, the cutting position is in the area where the concave-convex structure T with a larger distance is located, and in the remaining area for cutting S1 (corresponding to the cutting area before cutting) is provided with a concave-convex structure T, and the concave-convex structure T is different from the convex structure in the non-cut remaining area.
  • the distance between the two concave-convex structures T adjacent to the cutting residual region S1 is larger than the convex structures in the non-cutting residual region, and a smaller number of concave-convex structures T can be used to cover the cutting region.
  • the distance k1 between the two adjacent concave-convex structures T is greater than the distance k2 between the two adjacent circles of the first crack prevention dams CD1 .
  • the distance k1 between the concave-convex structures T in two adjacent circles is twice the distance k2 between the first crack prevention dams CD1 in the adjacent two circles.
  • the distance k1 between the two adjacent concave-convex structures T is greater than the distance k2 between the two adjacent first crack prevention dams CD1, which can prevent the pixel defining layer 3 in the display panel from being glued
  • the concave-convex structures T in the remaining cutting region S1 are denser, bubbles are likely to be generated in the remaining cutting region S1 , which is not conducive to the patterning of the pixel defining layer 4 .
  • the groove X extends from the encapsulation layer 9 to the buffer layer (the buffer layer may specifically be a film layer in the first inorganic layer 12 ) ) and expose part of the buffer layer.
  • the display panel includes 3 concave-convex structures, 5 first anti-cracking dams, 2 flow-stopping dams, and 4 second anti-cracking dams.
  • the number of the first crack prevention dam CD1, the flow stop dam ID, and the second crack prevention dam CD2 can also be other, and the adjustment of the number of these structures and their own deformation, etc.
  • the present invention is not limited to this.
  • the display panel further includes a semi-concave-convex structure T11 , and the semi-concave-convex structure T11 is located between the concave-convex structure T and the via hole K.
  • the cutting position is just at the position where the concave-convex structure T is located, and after cutting, the semi-concave-convex structure T11 remaining on the display panel is formed.
  • the distance between the semi-concave-convex structure T11 and the via hole K is zero.
  • the cross-sectional shape of the semi-concave-convex structure T11 in the direction perpendicular to the base substrate 11 and the center of the via hole K is half of the cross-sectional shape of the concave-convex structure T in the direction perpendicular to the base substrate 11 and the center of the via hole K .
  • the cutting position when the cutting position is just at the position where the concave-convex structure T is located, the remaining half of the concave-convex structure T after cutting is also the first concave-convex structure T11 , as shown in FIG. 4A .
  • the minimum distance k3 between the first concave-convex structure T11 and the outer K edge of the via hole is the same as the distance between the two adjacent concave-convex structures T.
  • the minimum distance k1 satisfies the following relation: 0 ⁇ k3 ⁇ k1, as shown in FIG. 4B .
  • the maximum widths of the cross-sections in the direction perpendicular to the base substrate 11 and at the center of the via hole K are different at different positions of the first concave-convex structure T11 .
  • FIG. 4C is a schematic cross-sectional view of the first concave-convex structure T11 on both sides of the center of the via hole K, and the cross-section may be a cross-section parallel to the EF direction and the center of the via hole K in FIG. 1 .
  • the width K6 on the right side of the first concave-convex structure T11 in FIG. 4C is greater than the width K6 on the right side of the first concave-convex structure T11 in FIG. 4C . That is, during the cutting process, due to the error of the cutting process, the remaining parts of the first concave-convex structure T11 at different positions may be different, resulting in the first concave-convex structure T11 being asymmetrical with respect to the center of the via K.
  • the side of the first crack prevention dam CD1 away from the concave-convex structure is also provided with a plurality of circles of flow stop dams ID surrounding the first crack prevention dam CD1 in turn.
  • the ID points to the direction of the via hole K (as indicated by the arrow AB in FIG. 2 ), and the heights of each circle of stop dams ID in the direction perpendicular to the substrate 11 increase successively to form the effect of successively increasing blocking effects.
  • the stop dam ID may include a flat layer 3, a pixel-defining layer 4, and a spacer 5 that are stacked in sequence.
  • the stop dam ID may also be composed of other membrane layers, and the number of membrane layers constituting the stop dam ID may also be different, and the embodiment of the present disclosure is not limited to this.
  • the side of the stop dam ID away from the first crack prevention dam CD1 is also provided with a plurality of circles of second crack prevention dams CD2 surrounding the stop dam ID in sequence;
  • the structures of the dam CD2 and the first anti-crack dam CD1 may be the same, so as to reduce the complexity of the manufacturing process.
  • the structures of the second anti-crack dam CD2 and the first anti-crack dam CD1 may also be the same.
  • the second crack prevention dam CD2 may include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer that are stacked in sequence.
  • the third inorganic layer 14 has a gap in the corresponding region between the two adjacent second crack prevention dams CD2, that is, the third inorganic layer 14 in the region between the adjacent two second crack prevention dams CD2 can be excavated.
  • the inorganic layer 13 has grooves in the corresponding regions between the two adjacent second crack prevention dams CD2, that is, part of the second inorganic layer 13 in the region between the adjacent two second crack prevention dams CD2 can be excavated.
  • the encapsulation layer 9 of the cutting remaining area S1 includes a first inorganic encapsulation layer 91 and a second inorganic encapsulation located on the side of the first inorganic encapsulation layer 91 away from the base substrate Layer 93, the remaining area S1 may not be provided with the organic encapsulation layer 92 after cutting.
  • the side surface T2 of the concave-convex structure T is concave-convex; the cross-sectional shape of the concave-convex structure T in the direction perpendicular to the base substrate 11 and the center of the via hole includes a T-shape.
  • the cross-sectional shape of the concave-convex structure T in a direction perpendicular to the base substrate 11 and at the center of the via hole is an I-shape.
  • the display panel includes a signal line; the concave-convex structure T and the signal line (specifically, the data line SD) are of the same layer and the same material, and the cross-section of the signal line can be the same as the cross-sectional shape of the concave-convex structure T, so as to form the signal line at the same time , the concave-convex structure T is also formed.
  • the concave-convex structure T includes a first titanium metal layer 71 , an aluminum metal layer 72 , and a second titanium metal layer 73 that are stacked in sequence in a direction perpendicular to and away from the base substrate 11 , and the line width of the aluminum metal layer 72 is smaller than the line width of the second titanium metal layer 73 .
  • the line width of the aluminum metal layer 72 can be understood as the width of the concave-convex structure T in the direction perpendicular to the base substrate 11 and directed from the concave-convex structure T to the via hole K (as indicated by arrow AB in FIG. 2 ). Specifically, as shown in FIG.
  • the cross-sectional shape of the aluminum metal layer 72 in the concave-convex structure T is vertical to the base substrate 11 and the center of the via hole K is a trapezoid, and the trapezoid is away from the surface of the base substrate 11 (that is, a trapezoid).
  • the upper end face of the aluminum metal layer 72 is in contact with the second titanium metal layer 73.
  • the line width of the aluminum metal layer 72 is smaller than that of the second titanium metal layer 73. It can be understood that the area of the aluminum metal layer 72 away from the surface of the base substrate 11 is smaller than that of the first titanium metal layer 72.
  • the cross-sectional shape of the concave-convex structure T in the direction perpendicular to the base substrate 11 and the center of the via hole includes a T-shape, forming a design similar to a metal button.
  • the deposition of the first inorganic encapsulation layer 91 and the second inorganic encapsulation 93 at the position of the metal buckle is completed, and they are attached to the surface of the concave-convex structure T to form a concave structure, so that the first inorganic encapsulation layer 91 and the second inorganic encapsulation layer 93 are deposited.
  • the encapsulation layer 91 and the second inorganic encapsulation 93 are buckled by the second titanium metal layer (ie Top Ti) of the metal buckle.
  • the first inorganic encapsulation layer 91 and the second inorganic encapsulation 93 are not easily connected with the base substrate.
  • the inorganic film layer on 11 is separated, thereby improving the problem that the encapsulation layer is prone to peeling (Peeling).
  • the cutting remaining area S1 may only include part of the inorganic layer, for example, only the first inorganic layer 12 , the second inorganic layer 13 and the third inorganic layer 14 are removed, In order to avoid that when cutting the remaining area S1 with many inorganic layers, particles are likely to be generated during cutting, which is not conducive to the patterning of the pixel defining layer 4 .
  • the cutting remaining area S1 may only include part of the inorganic layer, for example, only the first inorganic layer 12 , the second inorganic layer 13 and the third inorganic layer 14 are removed.
  • the cutting residual area S1 may also include both the first inorganic layer 12 , the second inorganic layer 13 , and the third inorganic layer 14 , which are formed in the first crack prevention area S2 and the cutting residual area S1 Encapsulation rings with the same height are beneficial to the uniformity of the encapsulation layer 9 .
  • each concave-convex structure T may be composed of a second inorganic layer 13 and a third inorganic layer 14 , and the line width of the second inorganic layer 13 is larger than that of the third inorganic layer 14 .
  • the cross-section of the concave-convex structure T shown in FIG. 7 is a two-level step, which is composed of two layers of inorganic layers, but the embodiment of the present disclosure is not limited to this. constitute).
  • the surface T1 of the concave-convex structure T is in a concave-convex shape; the cross-sectional shape of the concave-convex structure T in the direction perpendicular to the base substrate 11 and the center of the via hole includes a concave shape, and the concave-convex structure T may specifically be It consists of the flat layer 3 .
  • the cross-sectional shape of the concave-convex structure T in the direction perpendicular to the base substrate 11 and the center of the via hole may only include a concave shape, as shown in FIG. 8 ; it may also include only an I shape, as shown in FIG. 2 ; It can also include only a stepped shape, as shown in FIG. 6 ; it can also include a stepped shape and a concave shape, as shown in FIG. 9 , wherein the stepped structure can be composed of the second inorganic layer 13 and the third inorganic layer 14 .
  • the concave-shaped structure can be composed of a flat layer 3; it can also include I-shaped and concave-shaped; it can also include I-shaped and stepped; when the concave-convex structure T includes multiple shape structures, the multiple shape structures can be They are stacked one after another in the direction perpendicular to the base substrate 11 .
  • the concave-convex structure T includes at least one repeating structure Q in the direction perpendicular to the base substrate 11 , at least One repeating structure Q is stacked in sequence, and different repeating structures Q have the same cross-sectional shape in the direction perpendicular to the base substrate 11 and at the center of the via hole.
  • the concave-convex structure T includes a plurality of repeating structures Q, and a flat layer 3 is further disposed between two adjacent repeating structures Q.
  • each repeating structure Q shown in FIG. 11 is I-shaped. In order to have more contact area with the encapsulation layer 9 .
  • each repeating structure Q may include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer stacked in sequence.
  • the display area AA may include a barrier layer Barrier, a buffer layer Buffer (the barrier layer Barrier and the buffer layer Buffer are used as the first inorganic layer 12 ), and an active layer 111 located on one side of the base substrate 11 in sequence.
  • the first gate insulating layer 131, the first gate metal layer 112, the second gate insulating layer 132 (the first gate insulating layer 131 and the second gate insulating layer 132 can be used as the second inorganic layer 13), the The second gate metal layer 115, the interlayer dielectric layer ILD (the interlayer dielectric layer ILD can be used as the third inorganic layer 14), the first source and drain layers 113, the passivation layer 31, the first flat layer 32, the second source and drain layers Polar layer 114 , second flat layer 33 (passivation layer 31 , first flat layer 32 and second flat layer 33 can be used as flat layer 3 ), pixel electrode 116 , pixel defining layer 4 , spacer 5 , light-emitting layer 117 , the cathode 118 , the first inorganic encapsulation layer 91 , the organic encapsulation layer 92 , and the second inorganic encapsulation layer 93 .
  • the first crack prevention dam CD1 may be provided with the same layer and the same material as the concave-convex structure T.
  • the first anti-cracking dam CD1 and the concave-convex structure T may be provided in the same layer and the same material as the first source and drain layers 113 or the second source and drain layers 114 , and may include first titanium metal layers stacked in sequence. , an aluminum metal layer, and a second titanium metal layer.
  • the second crack prevention dam CD2 may be provided with the same layer and the same material as the concave-convex structure T.
  • the second anti-cracking dam CD2 and the concave-convex structure T may be provided in the same layer and the same material as the first source-drain layer 113 or the second source-drain layer 114 , and may include the first titanium metal layers stacked in sequence , an aluminum metal layer, and a second titanium metal layer.
  • the "same layer arrangement" referred to in the present disclosure refers to two (or more than two) structures formed by the same deposition process and patterned by the same patterning process. Can be the same or different.
  • the materials for forming the precursors of various structures arranged in the same layer are the same, and the materials finally formed may be the same or different.
  • the "integrated structure" in the present disclosure refers to two (or more than two) structures formed by the same deposition process and patterned by the same patterning process to form structures connected to each other, and their materials may be the same or different .
  • each concave-convex structure T may include two repeating structures Q in a direction perpendicular to the base substrate 11 , the two repeating structures Q may be the first repeating structure Q1 , and the first repeating structure Q is located away from the base substrate
  • the second repeating structure Q2 on the side of 11, the first repeating structure Q1 may be in the same layer as the first source and drain layers, and the first repeating structure Q1 and the second repeating structure Q2 are simultaneously formed when the first source and drain layers are fabricated.
  • the second source-drain layer 113 may be the same layer, and the second repeating structure Q2 may be simultaneously formed when the second source-drain layer is fabricated.
  • the concave-convex structure T includes only one repeating structure Q in the direction perpendicular to the base substrate 11 (the concave-convex structure T shown in FIG. 5A ), and the one repeating structure Q may be the same layer as the first source and drain layers, Alternatively, it may be the same layer as the second source and drain layers.
  • the concave-convex structure T may be composed of a barrier layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, an interlayer dielectric layer, a first flattening layer, a second flattening layer, and a pixel defining layer. one or a combination.
  • the first crack prevention dam CD1 is composed of one of a barrier layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, an interlayer dielectric layer, a first planarization layer, a second planarization layer, and a pixel defining layer. or combination.
  • the structure of the first crack prevention dam CD1 may be the same as that of the concave-convex structure T to reduce the complexity of the manufacturing process of the display panel; the structure of the first crack prevention dam CD1 and the structure of the concave-convex structure T may also be different.
  • each concave-convex structure T is an integral structure, that is, the projection of each concave-convex structure T on the base substrate 11 is a complete ring.
  • each concave-convex structure T includes a plurality of solid parts T11 and a plurality of cut-out parts T12 , and the solid parts T11 and the cut-out parts T12 are alternately arranged; all solid parts in the same concave-convex structure T T11 has the same center.
  • the bonding strength between the encapsulation layer 9 and the concave-convex structure T can be further increased by the division design of the concave-convex structure T. The larger the number of divisions of the concave-convex structure T, the larger the contact area with the encapsulation layer 9 , but the specific number of divisions is determined by the process level. As shown by the dotted line in FIG. 13 , the extension line of the solid portion T11 in the concave-convex structure T intersects the center of the ring.
  • Embodiments of the present disclosure further provide a display device, which includes the display panel provided by the embodiments of the present disclosure.
  • the remaining cutting area S1 is provided with at least one concave-convex structure T distributed around the via hole K.
  • At least one of the surface T1 of the concave-convex structure T facing away from the base substrate 11 and the side surface T3 is concave-convex. It can increase the contact area of the concave-convex structure T with the encapsulation layer 9, enhance the bonding strength of the encapsulation layer, and improve the stress imbalance of the encapsulation layer at the cutting area during the manufacturing process of the hole-drilling screen, and the thermal effect of laser cutting Amplified stress can easily cause the encapsulation layer to peel off, resulting in poor encapsulation, which in turn reduces the production yield of the product.
  • the display panel provided by the embodiments of the present disclosure may be an organic electroluminescent display panel (OLED) or a quantum dot light-emitting display panel (QLED).
  • OLED organic electroluminescent display panel
  • QLED quantum dot light-emitting display panel
  • Other essential components of the display panel should be understood by those of ordinary skill in the art, and will not be repeated here, nor should it be used as a limitation of the present disclosure. Since the principle of solving the problem of the display panel is similar to the principle of solving the problem of the above-mentioned display substrate, the implementation of the display panel provided by the embodiment of the present disclosure may refer to the implementation of the above-mentioned display substrate provided by the embodiment of the present disclosure, and the repetition will not be repeated. Repeat.
  • Embodiments of the present disclosure further provide a display device, which includes the display panel provided by the embodiments of the present disclosure.
  • the display device can be: mobile phone, tablet computer, TV, monitor, notebook computer, digital photo frame, navigator, smart watch, fitness wristband, personal digital assistant, and any other product or component with display function.
  • Other essential components of the display device should be understood by those of ordinary skill in the art, and will not be repeated here, nor should it be used as a limitation to the present disclosure.
  • the implementation of the display device may refer to the above-mentioned embodiment of the display panel, and the repetition will not be repeated.

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Abstract

本公开实施例提供一种显示面板和显示装置。所述显示面板包括：过孔，所述过孔贯穿所述显示面板；切割剩余区，所述切割剩余区位于所述过孔的周边，包括：衬底基板，位于所述衬底基板一侧的封装层；至少一圈凹凸结构，所述凹凸结构位于所述切割剩余区的所述封装层和所述衬底基板之间，至少一圈所述凹凸结构呈依次环绕所述过孔分布，第一凹凸结构到所述过孔外边缘的最小间距为0微米-30微米，至少一个所述凹凸结构具有背离所述衬底基板的表面，以及与所述表面连接的侧面，其中，所述表面、所述侧面中的至少一者呈凹凸状，所述第一凹凸结构为距离所述过孔中心距离最小的所述凹凸结构。

Description

显示面板和显示装置 技术领域
本公开涉及半导体技术领域，尤其涉及一种显示面板和显示装置。
背景技术
自全面屏概念出现后，为了提高屏幕的屏占比，各式设计的异形屏幕竞相出现，从刘海屏到水滴屏，再到目前主流的挖孔屏。使用挖孔孔径较小的屏幕，能够改善用户的使用体验，带来更好的沉浸感。
发明内容
本公开实施例提供一种显示面板，其中，包括：
过孔，所述过孔贯穿所述显示面板；
切割剩余区，所述切割剩余区位于所述过孔的周边，包括：衬底基板，位于所述衬底基板一侧的封装层；
至少一圈凹凸结构，所述凹凸结构位于所述切割剩余区的所述封装层和所述衬底基板之间，至少一圈所述凹凸结构呈依次环绕所述过孔分布，第一凹凸结构到所述过孔外边缘的最小间距为0微米-30微米，至少一个所述凹凸结构具有背离所述衬底基板的表面，以及与所述表面连接的侧面，其中，所述表面、所述侧面中的至少一者呈凹凸状，所述第一凹凸结构为距离所述过孔中心距离最小的所述凹凸结构。
在一种可能的实施方式中，所述侧面呈凹凸状；所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状包括T字形。
在一种可能的实施方式中，所述侧面呈凹凸状；所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状包括阶梯状。
在一种可能的实施方式中，所述表面呈凹凸状；所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状包括凹字状。
在一种可能的实施方式中，所述凹凸结构在垂直于所述衬底基板方向上包括至少一个重复结构，至少一个重复结构依次叠层设置。
在一种可能的实施方式中，所述凹凸结构包括多个所述重复结构，相邻两个所述重复结构之间还设置有平坦层。
在一种可能的实施方式中，不同所述重复结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状相同。
在一种可能的实施方式中，所述显示面板还包括位于所述切割剩余区的背离所述过孔一侧的显示区，所述显示区包括依次位于所述衬底基板一侧的阻挡层、缓冲层、有源层、第一栅极绝缘层、第一栅极金属层、第二栅极绝缘层、第二栅极金属层、层间介质层、第一源漏极层、第一平坦层、第二源漏极层、第二平坦层、像素限定层；
其中，所述凹凸结构由所述阻挡层、所述缓冲层、所述第一栅极绝缘层、所述第二栅极绝缘层、所述层间介质层、所述第一平坦层、所述第二平坦层、所述像素限定层中的之一或组合构成。
在一种可能的实施方式中，所述凹凸结构的背离所述过孔的一侧还设置有多圈第一防裂坝，所述第一防裂坝位于所述衬底基板与所述封装层之间，多圈所述第一防裂坝呈依次环绕所述凹凸结构设置。
在一种可能的实施方式中，每一所述第一防裂坝与所述衬底基板之间还设置有第一防裂金属层，所述第一防裂金属层与所述第一防裂坝之间还设置有第二防裂金属层。
在一种可能的实施方式中，所述第一防裂金属层与所述第一栅极金属层同层，所述第二防裂金属层与所述第二栅极金属层同层。
在一种可能的实施方式中，至少一个所述凹凸结构与所述衬底基板之间还设置有第三防裂金属层，所述第三防裂金属层与所述凹凸结构之间还设置有第四防裂金属层；
所述第三防裂金属层与所述第一防裂金属层同层，所述第四防裂金属层与所述第二防裂金属层同层。
在一种可能的实施方式中，相邻两圈所述凹凸结构之间的间距大于相邻两圈所述第一防裂坝之间的间距。
在一种可能的实施方式中，相邻两圈所述凹凸结构之间间距为相邻两圈所述第一防裂坝之间间距的二倍。
在一种可能的实施方式中，相邻两圈所述凹凸结构之间具有凹槽，所述凹槽由所述封装层延伸到所述缓冲层，并暴露部分所述缓冲层。
在一种可能的实施方式中，所述第一防裂坝的背离所述凹凸结构的一侧还设置有多圈依次环绕所述第一防裂坝的止流坝，由所述止流坝指向所述过孔的方向，各圈所述止流坝在垂直于所述衬底基板方向上的高度依次增高。
在一种可能的实施方式中，所述止流坝的背离所述第一防裂坝的一侧还设置有多圈依次环绕所述止流坝的第二防裂坝；所述第二防裂坝与所述第一防裂坝的构成相同。
在一种可能的实施方式中，所述显示面板包括3个凹凸结构，5个所述第一防裂坝，2个所述止流坝，4个所述第二防裂坝。
在一种可能的实施方式中，所述显示面板还包括半凹凸结构，所述半凹凸结构位于所述凹凸结构与所述过孔之间。
在一种可能的实施方式中，所述第一凹凸结构的不同位置，在垂直于所述衬底基板方向且过所述过孔中心的截面最大宽度不同。
在一种可能的实施方式中，所述半凹凸结构与所述过孔外边缘的最小间距为零。
在一种可能的实施方式中，所述半凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状，为所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状的二分之一。
在一种可能的实施方式中，所述第一凹凸结构与所述过孔外边缘之间的最小间距，与相邻两个所述凹凸结构之间的最小间距k1满足如下关系式：
0＜k3≤k1。
在一种可能的实施方式中，所述凹凸结构在垂直于所述衬底基板方向上 包括一个重复结构；
所述重复结构与所述第一源漏极同层，或者，所述重复结构与所述第二源漏极同层。
在一种可能的实施方式中，所述凹凸结构在垂直于所述衬底基板方向上包括两个重复结构，两个所述重复结构分别为第一重复结构，以及位于所述第一重复结构背离所述衬底基板一侧的第二重复结构；
所述第一重复结构与所述第一源漏极同层，所述第二重复结构与所述第二源漏极同层。
在一种可能的实施方式中，所述凹凸结构在垂直于所述衬底基板方向上包括依次叠层设置的第一钛金属层、铝金属层、第二钛金属层，且所述铝金属层的线宽小于所述第二钛金属层的线宽。
在一种可能的实施方式中，每一所述凹凸结构为一体结构。
在一种可能的实施方式中，每一所述凹凸结构包括多个实体部和多个挖除部，所述实体部和所述挖除部交替排列；同一所述凹凸结构中的所有所述实体部具有同一圆心。
在一种可能的实施方式中，所述切割剩余区的所述封装层包括第一无机封装层，以及位于所述第一无机封装层的背离所述衬底基板一侧的第二无机封装层。
本公开实施例还提供一种显示装置，其中，包括如本公开实施例提供的所述显示面板。
附图说明
图1为本发明实施例提供的一种显示面板的俯视示意图；
图2为图1沿虚线EF的截面示意图；
图3为图2在切割剩余区的放大结构示意图；
图4A为本发明实施例提供的相邻两个凹凸结构间距大于相邻两个第一防裂坝间距的结构示意图之一；
图4B为本发明实施例提供的相邻两个凹凸结构间距大于相邻两个第一防裂坝间距的结构示意图之二；
图4C为本发明实施例提供的过孔K中心两侧的第一凹凸结构T11截面示意图；
图5A为本发明实施例提供的另一种显示面板的剖视结构示意图；
图5B为本发明实施例提供的另一种具体的显示面板的剖视结构示意图；
图6为本发明实施例提供的凹凸结构为阶梯状的结构示意图；
图7为图6在切割剩余区的放大结构示意图；
图8为本发明实施例提供的凹凸结构为凹字形的结构示意图；
图9为本发明实施例提供的凹凸结构包括阶梯状和凹字状的结构示意图；
图10为本发明实施例提供的凹凸结构包括两个重复结构的结构示意图；
图11为图10在切割剩余区的放大结构示意图；
图12为本发明实施例提供的一种显示面板显示区的剖视示意图；
图13为本发明实施例提供的一种凹凸结构的俯视示意图；
图14为本发明实施例提供的另一种凹凸结构的俯视示意图。
具体实施方式
为了使得本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其 他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
为了保持本公开实施例的以下说明清楚且简明，本公开省略了已知功能和已知部件的详细说明。
参见图1、图2和图3所示，其中，图2为图1中沿虚线EF的截面示意图，图3为图2中切割剩余区S1的放大示意图，本公开实施例提供一种显示面板，其中，包括：
过孔K，过孔K贯穿显示面板；过孔K所在区域具体可以用于放置摄像头；具体的，过孔K的形状可以为圆形、椭圆形或矩形；
切割剩余区S1，切割剩余区S1位于过孔K的周边，包括：衬底基板11，位于衬底基板11一侧的封装层9；在具体对过孔K进行切割时，由于切割精度限制，显示面板通常需要在过孔K周围设置切割区(图中未示出)，在切割后，切割区中没有被切除的区域可以作为最终留在显示面板的切割剩余区；
至少一圈凹凸结构T，凹凸结构T位于切割剩余区S1的封装层9和衬底基板11之间，至少一圈凹凸结构T呈依次环绕过孔K分布，第一凹凸结构T11到过孔K外边缘的最小间距(也即过孔K外边缘中与第一凹凸结构T11最接近的位置处，与第一凹凸结构T11的距离，例如，可以参见图4B中的k3)为0微米-30微米，至少一个凹凸结构T具有背离衬底基板11的表面T1，以及与表面T1连接的侧面T2，其中，表面T1、侧面T2中的至少一者呈凹凸状,第一凹凸结构T11为距离过孔K中心距离最小的凹凸结构T。具体的，当切割的位置刚好位于凹凸结构T所在的位置时，切割后剩余的半个凹凸结构T也即为第一凹凸结构T11，此时，第一凹凸结构T11与过孔K外边缘最接近处的间距为0微米。
本公开实施例中，切割剩余区S1设置有至少一圈环绕过孔K分布的凹凸结构T，凹凸结构T的背离衬底基板11的表面T1，与侧面T2中的至少一者 呈凹凸状，可以使凹凸结构T增大与封装层9的接触面积，增强封装层的贴合强度，改善在挖孔屏制造过程中，封装层在切割区处的应力失衡，且激光切割产生的热影响使应力放大，易造成封装层剥离，引起封装不良，进而降低产品生产良率的问题。
在具体实施时，结合图1和图2所示，显示面板还包括位于切割剩余区S1的背离过孔一侧的显示区AA，在由过孔K到显示区AA之间可以依次设置有切割剩余区S1、第一防裂区S2、止流区S3、第二防裂区S4、环线区S5。其中，第一防裂区S2可以设置有多圈依次环绕过孔K的第一防裂坝CD1(Crack Dam1)，用于防止切割过程中产生的裂纹延伸至显示区，以及用于阻挡形成有机封装层92时所使用的有机封装材料过流到切割剩余区S1；止流区S3可以设置有多圈依次环绕第一防裂坝CD1的止流坝ID，用于阻挡形成有机封装层92时所使用的有机封装材料过流到切割剩余区S1；第二防裂区S4可以设置有多圈依次环绕止流坝ID(IJP Dam)的第二防裂坝CD2(Crack Dam2)，用于防止切割过程中产生的裂纹延伸至显示区，以及用于阻挡形成有机封装层92时所使用的有机封装材料过流到切割剩余区S1；环线区S5可以设置有多条避让过孔K的信号线D(例如，具体可以为数据线)，用于对显示区像素电路的驱动以及Data信号的写入。具体的，显示区AA可以包括依次位于衬底基板11一侧的第一无机层12(具体可以包括依次位于衬底基板11之上的阻挡层Barrier和缓冲层Buffer)、第二无机层13(具体可以包括依次位于第一无机层12之上的第一栅极绝缘层GI1和第二栅极绝缘层GI2)、第三无机层14(具体可以包括位于第二无机层13之上的层间介质层ILD)、平坦层3、像素限定层4、隔垫物5、第一无机封装层91、有机封装层92、第二无机封装层93。切割剩余区S1、第一防裂区S2、止流区S3、第二防裂区S4、环线区S5可以设置第一无机层12、第二无机层13、第三无机层14、平坦层3、像素限定层4、隔垫物5、第一无机封装层91、有机封装层93、第二无机封装层93中的部分膜层。具体的，封装层9与像素限定层4之间还可以设置有发光层(图中未示出)，发光层可以覆盖切割剩余区S1、第一防裂区S2、 止流区S3、第二防裂区S4、环线区S5，并在凹凸结构T、第一防裂坝CD1、第二防裂坝CD2的位置处断开。
具体的，结合图1和图2所示，凹凸结构T的背离过孔K的一侧还设置有多圈第一防裂坝CD1，第一防裂坝CD1位于衬底基板11与封装层9之间，多圈第一防裂坝CD1呈依次环绕凹凸结构T设置；每一第一防裂坝CD1与衬底基板11之间还设置有第一防裂金属层81，第一防裂金属层81与第一防裂坝CD1之间还设置有第二防裂金属层82。本公开实施例中，切割剩余区S1的背离K的一侧还设置有多圈第一防裂坝CD1，多圈第一防裂坝CD1可以防止切割过程中产生的裂纹延伸到显示区，而且，每一第一防裂坝CD1与衬底基板11之间还设置有第一防裂金属层81，第一防裂金属层81与第一防裂坝CD1之间还设置有第二防裂金属层82，第一防裂金属层81、第二防裂金属层82具有较佳的延展性，可以较佳地防止裂纹的延伸。具体的，显示面板还可以具有第一栅极金属层，以及位于第一栅极金属层的背离衬底基板11一侧的第二栅极金属层，第一防裂金属层81具体可以与第一栅极金属层同层同材质、第二防裂金属层82具体可以与第二栅极金属层同层同材质；具体的，第一防裂金属层81、第二防裂金属层82的材质可以为钼，由于钼具有较佳的延展性，在切割过程中不容易发生断裂，进而可以较佳地防止裂缝的延伸；具体的，第一防裂金属层81、第二防裂金属层82在衬底基板11的投影图案，可以与第一防裂坝CD1在衬底基板11的投影图案一致，具体可以为环形。具体的，第一防裂坝CD1的构成可以与凹凸结构T的构成相同，例如，结合图2或图4A所示，第一防裂坝CD1和凹凸结构T均由信号线(如数据线)包含的膜层构成。
在具体实施时，结合图5B所示，至少一个凹凸结构T与衬底基板11之间还设置有第三防裂金属层83，第三防裂金属层83与凹凸结构T之间还设置有第四防裂金属层84；第三防裂金属层83与第一防裂金属层81同层，第四防裂金属层84与所述第二防裂金属层82同层。第三防裂金属层83、第四防裂金属层84具有较佳的延展性，可以进一步防止裂纹的延伸。
在具体实施时，切割剩余区S1的多个凹凸结构T之间等间距分布。需要说明的是，本公开实施例中，切割剩余区S1的第一凹凸结构T11到过孔外边缘的最小间距为0微米-30微米。例如，第一凹凸结构T11到过孔外边缘的最小间距为15微米-28微米，具体的，例如，第一凹凸结构T11到过孔外边缘的最小间距为18微米，而非切割剩余区域的相邻两个凸起结构(例如图2中的相邻两个第一防裂坝CD1)之间的间距通常要小于凹凸结构T到过孔外边缘的最小间距。例如，相邻两个第一防裂坝CD1之间的间距(例如，图4A中第一防裂区S2中，左起第一个第一防裂坝CD1的右侧面与左起第二个第一防裂坝CD1的左侧面之间的距离)为14微米，邻两个凹凸结构T之间的间距(例如，图4A中切割剩余区S1中，左起第一个凹凸结构T的右侧面与左起第二个凹凸结构T的左侧面之间的距离)为28微米。本公开实施例中，使第一凹凸结构T11到过孔外边缘的最小间距为0微米-30微米，也即，切割的位置是在间距较大的凹凸结构T所在区域，是在切割剩余区S1(对应切割前的切割区域)设置有凹凸结构T，该凹凸结构T与非切割剩余区域的凸起结构并不相同。具体的，切割剩余区S1邻两个凹凸结构T之间的间距，大于非切割剩余区域的凸起结构，可以用较少的凹凸结构T数量铺满切割区域。
在具体实施时，参见图4A所示，相邻两圈凹凸结构T之间的间距k1大于相邻两圈第一防裂坝CD1之间的间距k2。具体的，相邻两圈凹凸结构T之间间距k1为相邻两圈第一防裂坝CD1之间间距k2的二倍。本公开实施例中，相邻两圈凹凸结构T之间的间距k1大于相邻两圈第一防裂坝CD1之间的间距k2，可以防止在对显示面板中的像素限定层3进行涂胶时，因切割剩余区S1的凹凸结构T较密集，容易使切割剩余区S1产生气泡，不利于对像素限定层4的图案化。
具体的，结合图4A所示，相邻两圈凹凸结构T之间具有凹槽X，凹槽X由封装层9延伸到缓冲层(缓冲层具体可以为第一无机层12中的一膜层)，并暴露部分缓冲层。
具体的，结合图4A所示，显示面板包括3个凹凸结构，5个第一防裂坝， 2个止流坝，4个第二防裂坝。当然，在具体实施时，第一防裂坝CD1，止流坝ID，第二防裂坝CD2的数量还可以是其它，这些结构个数的调整及本身的变形等，都包含在本方案的设计思想内，本发明不以此为限。
具体的，结合图4A所示，显示面板还包括半凹凸结构T11，半凹凸结构T11位于凹凸结构T与过孔K之间。即，在具体对过孔K进行切割时，切割位置刚好位于凹凸结构T所在位置，在切割后，形成留在显示面板的半凹凸结构T11。具体的，半凹凸结构T11与过孔K的间距为零。具体的，半凹凸结构T11在垂直于衬底基板11方向且过过孔K中心的截面形状，为凹凸结构T在垂直于衬底基板方向11且过过孔中心的截面形状的二分之一。
具体的，当切割的位置刚好位于凹凸结构T所在的位置时，切割后剩余的半个凹凸结构T也即为第一凹凸结构T11，如图4A所示。具体的，当切割的位置位于相邻两个凹凸结构T之间的区域时，第一凹凸结构T11与过孔外K边缘之间的最小间距k3，与相邻两个凹凸结构T之间的最小间距k1，满足如下关系式：0＜k3≤k1，如图4B所示。
在具体实施时，第一凹凸结构T11的不同位置，在垂直于衬底基板11方向且过过孔K中心的截面最大宽度不同。例如，结合图4C所示为例，其中，图4C为过孔K中心两侧的第一凹凸结构T11截面示意图，该截面可以是图1中沿平行于EF方向且过过孔K中心的截面，第一凹凸结构T11在图4C中左侧的宽度K5大于第一凹凸结构T11在图4C中右侧的宽度K6。即，在实施切割工艺中，因切割工艺的误差存在，可能使第一凹凸结构T11的不同位置的剩余部分不同，导致第一凹凸结构T11为关于过孔K圆心是不对称的结构。
在具体实施时，结合图1、图2所示，第一防裂坝CD1的背离凹凸结构的一侧还设置有多圈依次环绕第一防裂坝CD1的止流坝ID，由止流坝ID指向过孔K的方向(如图2中箭头AB所示)，各圈止流坝ID在垂直于衬底基板11方向上的高度依次增高，以形成阻挡作用依次递增的效果。具体的，止流坝ID可以包括依次叠层设置的平坦层3、像素限定层4、隔垫物5组成，即，在形成平坦层3、像素限定层4、隔垫物5时，复用平坦层3、像素限定 层4、隔垫物5来形成止流坝ID，以降低显示面板的制作工序的复杂性。当然，在具体实施时，止流坝ID也可以由其它膜层构成，构成止流坝ID的膜层数量也可以不同，本公开实施例不以此为限。
具体的，结合图1和图2所示，止流坝ID的背离第一防裂坝CD1的一侧还设置有多圈依次环绕止流坝ID的第二防裂坝CD2；第二防裂坝CD2与第一防裂坝CD1的构成具体可以相同，以降低工艺制作复杂性。具体的，第二防裂坝CD2与第一防裂坝CD1的构成具体也可以相同。第二防裂坝CD2具体可以包括依次叠置的第一钛金属层、铝金属层、第二钛金属层构成。第三无机层14在相邻两个第二防裂坝CD2之间对应的区域具有间隙，即可以挖除相邻两个第二防裂坝CD2之间区域的第三无机层14，第二无机层13在相邻两个第二防裂坝CD2之间对应的区域具有凹槽，即可以挖除相邻两个第二防裂坝CD2之间区域的部分第二无机层13。
在具体实施时，结合图1和图2所示，切割剩余区S1的封装层9包括第一无机封装层91，以及位于第一无机封装层91的背离衬底基板一侧的第二无机封装层93，切割剩余区S1可以不设置有机封装层92。
在具体实施时，结合图3所示，凹凸结构T的侧面T2呈凹凸状；凹凸结构T在垂直于衬底基板11方向且过过孔中心的截面形状包括T字形。具体的，凹凸结构T在垂直于衬底基板11方向且过过孔中心的截面形状为I形。具体的，显示面板包括信号线；凹凸结构T与信号线(具体可以为数据线SD)同层同材质，信号线的截面具体可以与凹凸结构T的截面形状相同，以在形成信号线的同时，也形成凹凸结构T。具体的，凹凸结构T在垂直且远离于衬底基板11方向上包括依次叠层设置的第一钛金属层71、铝金属层72、第二钛金属层73，且铝金属层72的线宽小于第二钛金属层73的线宽。具体的，铝金属层72的线宽可以理解为凹凸结构T在垂直于衬底基板11，且由凹凸结构T指向过孔K的方向(如图2中箭头AB所示)上的宽度。具体的，结合图3所示，凹凸结构T中铝金属层72的在垂直于衬底基板11且过过孔K中心的截面形状为梯形，梯形的背离衬底基板11的表面(也即梯形的上端面) 与第二钛金属层73接触，铝金属层72的线宽小于第二钛金属层73的线宽，可以理解为，铝金属层72背离衬底基板11表面的面积，小于第二钛金属层73面向衬底基板11表面的面积。本公开实施例中，凹凸结构T在垂直于衬底基板11方向且过过孔中心的截面形状包括T字形，形成一种类似金属扣设计，在切割剩余区S1中引入金属扣，在撕膜(去除衬底基板11下方的保护膜)过程中，金属扣位置处第一无机封装层91和第二无机封装93沉积完成，贴覆在凹凸结构T表面，形成内凹结构，从而第一无机封装层91和第二无机封装93被金属扣的第二钛金属层(也即Top Ti)扣住，在撕膜过程中，第一无机封装层91和第二无机封装93不易与衬底基板11上的无机膜层分离，从而改善封装层容易发生剥离(Peeling)的问题。
在具体实施时，结合图2或图4A所示，切割剩余区S1可以仅包括部分无机层，例如，仅包括第一无机层12，去除了第二无机层13，以及第三无机层14，以避免切割剩余区S1具有较多层的无机层时，在切割时，容易产生颗粒，不利于像素限定层4的图案化。当然，参见图5A所示，切割剩余区S1也可以既包括第一无机层12，也包括第二无机层13，和第三无机层14，在第一防裂区S2与切割剩余区S1形成高度相同的封装环，有利于封装层9的均一性。
在具体实施时，参见图6所示和图7所示，其中，图7为图6在切割剩余区S1处的放大示意图，凹凸结构T的侧面T2呈凹凸状；凹凸结构T在垂直于衬底基板11方向且过过孔中心的截面形状包括阶梯状。具体的，每一凹凸结构T可以由第二无机层13和第三无机层14构成，第二无机层13的线宽大于第三无机层14的线宽。图7所示的凹凸结构T的截面为二级阶梯，由两层无机层组成，但本公开实施例不限于此，阶梯状具体可以包括单级阶梯与多级阶梯(可以由更多无机层构成)。
在具体实施时，如图8所示，凹凸结构T的表面T1呈凹凸状；凹凸结构T在垂直于衬底基板11方向且过过孔中心的截面形状包括凹字状，凹凸结构T具体可以由平坦层3构成。
具体的，凹凸结构T在垂直于衬底基板11方向且过过孔中心的截面形状可以是仅包括凹字状，如图8所示；也可以是仅包括I形，如图2所示；也可以是仅包括阶梯状，如图6所示；也可以是同时包括阶梯状和凹字状，如图9所示，其中阶梯状结构可以由第二无机层13和第三无机层14构成，凹字状结构可以由平坦层3构成；也可以是同时包括I形和凹字状；也可以是同时包括I形和阶梯形；凹凸结构T包括多个形状结构时，多个形状结构可以在垂直于衬底基板11的方向上依次叠置。
在具体实施时，结合图10和图11所示，其中，图11为图10在切割剩余区S1的放大示意图，凹凸结构T在垂直于衬底基板11方向上包括至少一个重复结构Q，至少一个重复结构Q依次叠层设置,不同重复结构Q在垂直于衬底基板11方向且过过孔中心的截面形状相同。具体的，结合图11所示，凹凸结构T包括多个重复结构Q，相邻两个重复结构Q之间还设置有平坦层3。具体的，图11所示的每一重复结构Q为I形。以与封装层9具有更多的接触面积。具体的，每一重复结构Q可以包括依次叠置的第一钛金属层、铝金属层、第二钛金属层。
具体的，参见图12所示，显示区AA可以包括依次位于衬底基板11一侧的阻挡层Barrier、缓冲层Buffer(阻挡层Barrier和缓冲层Buffer作为第一无机层12)、有源层111、第一栅极绝缘层131、第一栅极金属层112、第二栅极绝缘层132(第一栅极绝缘层131和第二栅极绝缘层132可以作为第二无机层13)、第二栅极金属层115、层间介质层ILD(层间介质层ILD可以作为第三无机层14)、第一源漏极层113、钝化层31、第一平坦层32、第二源漏极层114、第二平坦层33(钝化层31、第一平坦层32和第二平坦层33可以作为平坦层3)、像素电极116、像素限定层4、隔垫物5、发光层117、阴极118、第一无机封装层91、有机封装层92、第二无机封装层93。
具体的，结合图2、图4A、图4B所示，第一防裂坝CD1可以与凹凸结构T同层同材料设置。具体的，第一防裂坝CD1、凹凸结构T可以均与第一源漏极层113或第二源漏极层114同层同材料设置，均可以包括依次叠层设 置的第一钛金属层、铝金属层、第二钛金属层构成。同样，第二防裂坝CD2可以与凹凸结构T同层同材料设置。具体的，第二防裂坝CD2、凹凸结构T可以均与第一源漏极层113或第二源漏极层114同层同材料设置，均可以包括依次叠层设置的第一钛金属层、铝金属层、第二钛金属层构成。需要说明的是，本公开中所称的“同层设置”是指两种(或两种以上)结构通过同一道沉积工艺形成并通过同一道构图工艺得以图案化而形成的结构，它们的材料可以相同或不同。例如，形成同层设置的多种结构的前驱体的材料是相同的，最终形成的材料可以相同或不同。本公开中的“一体的结构”是指两种(或两种以上)结构通过同一道沉积工艺形成并通过同一道构图工艺得以图案化而形成的彼此连接的结构，它们的材料可以相同或不同。
具体的，每一凹凸结构T在垂直于衬底基板11方向上可以包括两个重复结构Q，两个重复结构Q可以为第一重复结构Q1，以及位于第一重复结构Q的背离衬底基板11一侧的第二重复结构Q2，第一重复结构Q1具体可以与第一源漏极层同层，在制作第一源漏极层时，同时形成第一重复结构Q1，第二重复结构Q2具体可以与第二源漏极层113同层，在制作第二源漏极层时，同时形成第二重复结构Q2。具体的，凹凸结构T在垂直于衬底基板11方向上仅包括一个重复结构Q(如图5A所示的凹凸结构T)，该一个重复结构Q可以是与第一源漏极层同层，或者，也可以是与第二源漏极层同层。
在具体实施时，凹凸结构T可以由阻挡层、缓冲层、第一栅极绝缘层、第二栅极绝缘层、层间介质层、第一平坦层、第二平坦层、像素限定层中的之一或组合构成。第一防裂坝CD1以由阻挡层、缓冲层、第一栅极绝缘层、第二栅极绝缘层、层间介质层、第一平坦层、第二平坦层、像素限定层中的之一或组合构成。第一防裂坝CD1的构成可以与凹凸结构T的构成相同，以降低显示面板的制作工序复杂性；第一防裂坝CD1的构成与凹凸结构T的构成也可以不同。
在具体实施时，参见图13所示，每一凹凸结构T为一体结构，即，每一凹凸结构T在衬底基板11的投影为一完整的圆环。
在具体实施时，参见图14所示，每一凹凸结构T包括多个实体部T11和多个挖除部T12，实体部T11和挖除部T12交替排列；同一凹凸结构T中的所有实体部T11具有同一圆心。本公开实施例中，通过对凹凸结构T进行的分割设计，可以进一步增大封装层9与凹凸结构T的贴合强度，凹凸结构T的分割数越大，与封装层9的接触面积越大，但具体分割份数由工艺水平决定，如图13中虚线所示，凹凸结构T中实体部T11的延长线交于圆环的中心。
本公开实施例还提供一种显示装置，其中，包括如本公开实施例提供的显示面板。
本公开实施例中，切割剩余区S1设置有至少一圈环绕过孔K分布的凹凸结构T，凹凸结构T的背离衬底基板11的表面T1，与侧面T3中的至少一者呈凹凸状，可以使凹凸结构T增大与封装层9的接触面积，增强封装层的贴合强度，改善在挖孔屏制造过程中，封装层在切割区处的应力失衡，且激光切割产生的热影响使应力放大，易造成封装层剥离，引起封装不良，进而降低产品生产良率的问题。
本公开实施例提供的显示面板，可以为有机电致发光显示面板(OLED)、量子点发光显示面板(QLED)。对于显示面板的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的限制。由于该显示面板解决问题的原理与上述显示基板解决问题的原理相似，因此，本公开实施例提供的该显示面板的实施可以参见本公开实施例提供的上述显示基板的实施，重复之处不再赘述。
本公开实施例还提供一种显示装置，其中，包括如本公开实施例提供的显示面板。该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、智能手表、健身腕带、个人数字助理等任何具有显示功能的产品或部件。对于显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本公开的 限制。另外，由于该显示装置解决问题的原理与上述显示面板解决问题的原理相似，因此，该显示装置的实施可以参见上述显示面板的实施例，重复之处不再赘述。
尽管已描述了本发明的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明实施例的精神和范围。这样，倘若本发明实施例的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (31)

  1. 一种显示面板，其中，包括：
    过孔，所述过孔贯穿所述显示面板；
    切割剩余区，所述切割剩余区位于所述过孔的周边，包括：衬底基板，位于所述衬底基板一侧的封装层；
    至少一圈凹凸结构，所述凹凸结构位于所述切割剩余区的所述封装层和所述衬底基板之间，至少一圈所述凹凸结构呈依次环绕所述过孔分布，第一凹凸结构到所述过孔外边缘的最小间距为0微米-30微米，至少一个所述凹凸结构具有背离所述衬底基板的表面，以及与所述表面连接的侧面，其中，所述表面、所述侧面中的至少一者呈凹凸状，所述第一凹凸结构为距离所述过孔中心距离最小的所述凹凸结构。
  2. 如权利要求1所述的显示面板，其中，所述侧面呈凹凸状；所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状包括T字形。
  3. 如权利要求1所述的显示面板，其中，所述侧面呈凹凸状；所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状包括阶梯状。
  4. 如权利要求1或3所述的显示面板，其中，所述表面呈凹凸状；所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状包括凹字状。
  5. 如权利要求1所述的显示面板，其中，所述凹凸结构在垂直于所述衬底基板方向上包括至少一个重复结构，至少一个重复结构依次叠层设置。
  6. 如权利要求5所述的显示面板，其中，所述凹凸结构包括多个所述重复结构，相邻两个所述重复结构之间还设置有平坦层。
  7. 如权利要求6所述的显示面板，其中，不同所述重复结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状相同。
  8. 如权利要求1-5任一项所述的显示面板，其中，所述显示面板还包括位于所述切割剩余区的背离所述过孔一侧的显示区，所述显示区包括依次位 于所述衬底基板一侧的阻挡层、缓冲层、有源层、第一栅极绝缘层、第一栅极金属层、第二栅极绝缘层、第二栅极金属层、层间介质层、第一源漏极层、第一平坦层、第二源漏极层、第二平坦层、像素限定层。
  9. 如权利要求8所述的显示面板，其中，所述凹凸结构由所述阻挡层、所述缓冲层、所述第一栅极绝缘层、所述第二栅极绝缘层、所述层间介质层、所述第一平坦层、所述第二平坦层、所述像素限定层中的之一或组合构成。
  10. 如权利要求8所述的显示面板，其中，所述凹凸结构的背离所述过孔的一侧还设置有多圈第一防裂坝，所述第一防裂坝位于所述衬底基板与所述封装层之间，多圈所述第一防裂坝呈依次环绕所述凹凸结构设置。
  11. 如权利要求10所述的显示面板，其中，至少一个所述第一防裂坝与所述衬底基板之间还设置有第一防裂金属层，所述第一防裂金属层与所述第一防裂坝之间还设置有第二防裂金属层。
  12. 如权利要求11所述的显示面板，其中，所述第一防裂金属层与所述第一栅极金属层同层，所述第二防裂金属层与所述第二栅极金属层同层。
  13. 如权利要求12所述的显示面板，其中，至少一个所述凹凸结构与所述衬底基板之间还设置有第三防裂金属层，所述第三防裂金属层与所述凹凸结构之间还设置有第四防裂金属层；
    所述第三防裂金属层与所述第一防裂金属层同层，所述第四防裂金属层与所述第二防裂金属层同层。
  14. 如权利要求10所述的显示面板，其中，相邻两圈所述凹凸结构之间的间距大于相邻两圈所述第一防裂坝之间的间距。
  15. 如权利要求14所述的显示面板，其中，相邻两圈所述凹凸结构之间间距为相邻两圈所述第一防裂坝之间间距的二倍。
  16. 如权利要求1-5任一项所述的显示面板，其中，相邻两圈所述凹凸结构之间具有凹槽，所述凹槽由所述封装层延伸到所述缓冲层，并暴露部分所述缓冲层。
  17. 如权利要求10所述的显示面板，其中，所述第一防裂坝的背离所述 凹凸结构的一侧还设置有多圈依次环绕所述第一防裂坝的止流坝，由所述止流坝指向所述过孔的方向，各圈所述止流坝在垂直于所述衬底基板方向上的高度依次增高。
  18. 如权利要求17所述的显示面板，其中，所述止流坝的背离所述第一防裂坝的一侧还设置有多圈依次环绕所述止流坝的第二防裂坝；所述第二防裂坝与所述第一防裂坝的构成相同。
  19. 如权利要求18所述的显示面板，其中，所述显示面板包括3个凹凸结构，5个所述第一防裂坝，2个所述止流坝，4个所述第二防裂坝。
  20. 如权利要求18所述的显示面板，其中，所述显示面板还包括半凹凸结构，所述半凹凸结构位于所述凹凸结构与所述过孔之间。
  21. 如权利要求20所述的显示面板，其中，所述第一凹凸结构的不同位置，在垂直于所述衬底基板方向且过所述过孔中心的截面最大宽度不同。
  22. 如权利要求20所述的显示面板，其中，所述半凹凸结构与所述过孔外边缘的最小间距为零。
  23. 如权利要求20所述的显示面板，其中，所述半凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状，为所述凹凸结构在垂直于所述衬底基板方向且过所述过孔中心的截面形状的二分之一。
  24. 如权利要求16所述的显示面板，其中，所述第一凹凸结构与所述过孔外边缘之间的最小间距k3，与相邻两个所述凹凸结构之间的最小间距k1满足如下关系式：
    0＜k3≤k1。
  25. 如权利要求8所述的显示面板，其中，所述凹凸结构在垂直于所述衬底基板方向上包括一个重复结构；
    所述重复结构与所述第一源漏极同层，或者，所述重复结构与所述第二源漏极同层。
  26. 如权利要求8所述的显示面板，其中，所述凹凸结构在垂直于所述衬底基板方向上包括两个重复结构，两个所述重复结构分别为第一重复结构， 以及位于所述第一重复结构背离所述衬底基板一侧的第二重复结构；
    所述第一重复结构与所述第一源漏极同层，所述第二重复结构与所述第二源漏极同层。
  27. 如权利要求25或26所述的显示面板，其中，所述凹凸结构在垂直于所述衬底基板方向上包括依次叠层设置的第一钛金属层、铝金属层、第二钛金属层，且所述铝金属层的线宽小于所述第二钛金属层的线宽。
  28. 如权利要求1所述的显示面板，其中，每一所述凹凸结构为一体结构。
  29. 如权利要求1所述的显示面板，其中，每一所述凹凸结构包括多个实体部和多个挖除部，所述实体部和所述挖除部交替排列；同一所述凹凸结构中的所有所述实体部具有同一圆心。
  30. 如权利要求1所述的显示面板，其中，所述切割剩余区的所述封装层包括第一无机封装层，以及位于所述第一无机封装层的背离所述衬底基板一侧的第二无机封装层。
  31. 一种显示装置，其中，包括如权利要求1-30任一项所述的显示面板。
PCT/CN2020/133432 2020-12-02 2020-12-02 显示面板和显示装置 Ceased WO2022116055A1 (zh)

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