WO2022135148A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022135148A1
WO2022135148A1 PCT/CN2021/136349 CN2021136349W WO2022135148A1 WO 2022135148 A1 WO2022135148 A1 WO 2022135148A1 CN 2021136349 W CN2021136349 W CN 2021136349W WO 2022135148 A1 WO2022135148 A1 WO 2022135148A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
electronic device
conductive layer
antenna unit
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/136349
Other languages
English (en)
French (fr)
Inventor
吴鹏飞
王汉阳
侯猛
李建铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to US18/259,190 priority Critical patent/US12438254B2/en
Priority to EP21909145.1A priority patent/EP4254660A4/en
Publication of WO2022135148A1 publication Critical patent/WO2022135148A1/zh
Anticipated expiration legal-status Critical
Priority to US19/317,982 priority patent/US20260005427A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
    • H01Q5/364—Creating multiple current paths
    • H01Q5/371—Branching current paths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/378—Combination of fed elements with parasitic elements

Definitions

  • the embodiments of the present application relate to the field of antenna technologies, and in particular, to an electronic device.
  • MIMO multi-input multi-output
  • ID electronic equipment of metal industrial design
  • the recent trends in electronic device design are higher screen-to-body ratios, more multimedia devices, and larger battery capacity, which drastically compress the antenna space.
  • the slot antenna is an antenna formed by slits on the conductor surface, and electromagnetic waves are radiated to the external space through the slits.
  • the slot antenna has the characteristics of low profile and can be integrated, and has received extensive attention and research.
  • the slot antenna can be used in the terminal equipment to realize the miniaturization of the terminal equipment.
  • the embodiment of the present application provides an electronic device, which solves the problem that the space occupied by the antenna unit is too large.
  • the present application provides an electronic device, comprising a conductive frame and a first antenna unit, the conductive frame is arranged around the periphery of the electronic device, wherein the first antenna unit includes: a first conductive layer and a second conductive layer, the The first conductive layer and the second conductive layer are arranged at intervals in the thickness direction of the electronic device; a conductive connection part is used to connect the first conductive layer and the second conductive layer; and a first conductive frame, The first conductive frame is a part of the conductive frame, wherein a first gap exists between the first conductive layer and the first conductive frame, the conductive connection portion, the first conductive frame, the first conductive layer and the first conductive frame The second conductive layer surrounds the first cavity.
  • the conductive connection portion, the first conductive frame, the first conductive layer and the second conductive layer form a first cavity, and the first conductive layer and the first conductive frame
  • the first slits of the first cavity are arranged and formed at intervals, so that the first antenna unit can radiate or receive electromagnetic waves through the first slits, so that there is no need to make grooves on the surface of the metal plate, and the integrity of the metal plate is improved.
  • the electronic device further includes a first feeding unit, and the first feeding unit feeds the first antenna unit through the first conductive layer, wherein the first feeding unit and the The first conductive layer is electrically connected or coupled.
  • the feeding method is more flexible.
  • the electronic device further includes a ground plate, the second conductive layer is electrically connected or coupled to the ground plate, and the first antenna unit is grounded through the second conductive layer. Therefore, the first antenna unit has a simple structure and is easy to assemble.
  • the electronic device further includes a grounding plate, and the grounding plate forms the second conductive layer.
  • the ground plate of the electronic device can be reused for the first antenna unit, and there is no need to provide other metal components, thereby reducing the manufacturing cost of the antenna and saving space.
  • the electronic device further includes a middle frame, and the grounding plate is arranged on the middle frame and is arranged on the side of the middle frame facing the first conductive layer.
  • the conductive frame may be part of the middle frame.
  • the electronic device further includes a metal back cover, and the metal back cover forms the first conductive layer.
  • the metal back cover can be used for the first antenna unit, and as a part of the first antenna unit, there is no need to dispose other metal components, which can reduce the manufacturing cost of the antenna and save space.
  • the electronic device further includes a display module, and a side of the display module facing the ground plate is provided with the first conductive layer. Therefore, a metal layer can be provided on the side of the display module facing the ground plate as the first conductive layer of the first antenna unit, the structure is simple, the manufacturing cost of the antenna can be reduced, and the space can be saved. Metal can also be coated on at least a part of the surface of the display module facing the ground plate as the first conductive layer, for example, metal is coated on the backing plate of the display module.
  • the conductive connecting portion adopts a conductive wall structure, and two sides of the conductive wall are respectively connected to the first conductive layer and the second conductive layer. Therefore, the connection of the conductive wall structure is more stable, and the sealing performance is better to avoid energy leakage.
  • the conductive connection portion includes a plurality of point connection structures, and the distance between adjacent point connection structures is less than or equal to one-half of the wavelength corresponding to the center frequency of the first antenna operating frequency band. . Therefore, the point connection structure saves the internal space of the electronic device.
  • the point connection structure is a metal dome, and two ends of the metal dome are respectively connected to the first conductive layer and the second conductive layer.
  • the projection of the conductive connection portion on the second conductive layer is located within the projection range of the first conductive layer on the second conductive layer.
  • the projection of the conductive connection portion on the carrier board is one or a combination of a curve, a broken line, or a straight line. Therefore, the shape of the conductive connection portion is more flexible, which facilitates installation.
  • the first gap is filled with insulating material.
  • the insulating material is polycarbonate and acrylonitrile-butadiene-styrene copolymer and mixed PC/ABS material.
  • the first antenna unit radiates or receives electromagnetic waves through the first slot.
  • the electronic device further includes: the electronic device further includes: a second antenna unit and a second feeding unit, and the second feeding unit feeds the second antenna unit, wherein the The second antenna unit includes: a first ground point, the first ground point is set on the conductive frame; a first radiator, wherein the conductive frame is provided with a second slot, the first ground point and the second slot The conductive frame between them forms the first radiator, and the first ground point is used for grounding the second antenna unit. Therefore, multiple antennas can be set on the electronic device, and the first antenna unit and the second antenna unit can work simultaneously, thereby enhancing the reliability of signal processing, signal transmission range and throughput, and improving communication quality.
  • At least a part of the first radiator is formed by the first conductive frame. Therefore, the second antenna unit can be reused for the first antenna unit, and the bandwidth of the first antenna unit can be widened.
  • the first filter element and the second feed unit are electrically connected or coupled to the first radiator through the first filter element. Therefore, the first filter element can filter out the signal of the first antenna unit, thereby improving the isolation degree between the first antenna unit and the second antenna unit.
  • the second antenna unit further includes: a second radiator, a second slot is provided on the conductive frame, and the conductive frame between the second slot and the first slot forms the second radiator. a radiator; a second ground point, the second ground point is set on the second radiator and used for grounding the second antenna unit.
  • the second feeding unit is electrically connected to the second radiator. Therefore, the first radiator and the second radiator adopt distributed feeding, and the structure is simpler.
  • the second radiator is coupled to the first radiator through a first slot. Therefore, the second radiator can be used as a parasitic radiator of the first radiator, and the manufacturing cost of the antenna can be reduced.
  • the electronic device further includes: a second filter element, and the second feed unit is electrically connected or coupled to the second radiator through the second filter element. Therefore, the second filter element can filter the signal of the first antenna unit, prevent the first antenna unit and the second antenna unit from co-frequency, and improve the isolation between the first antenna unit and the second antenna unit.
  • FIG. 1 is a schematic diagram of a disassembled structure of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a first antenna unit according to an embodiment of the present application.
  • 3 is a rear view of an electronic device
  • FIG. 4 is a schematic structural diagram of a conductive layer of an electronic device according to an embodiment of the present application.
  • Fig. 4a is the bottom view of the first antenna unit in Fig. 4;
  • FIG. 4b is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 4c is a partial enlarged view of the electronic device in Fig. 4b;
  • Figure 4d is a top view of the electronic device in Figure 4b;
  • FIG. 4e is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • 4f is a projection view of a conductive connection part provided by an embodiment of the application.
  • 4g is a projection view of another conductive connection portion provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Fig. 6 is the S11 parameter distribution diagram of the first antenna unit in Fig. 5;
  • FIG. 7 is a schematic diagram of the antenna radiation efficiency of the first antenna unit in FIG. 5;
  • FIG. 8 is a schematic diagram of the current and electric field distribution of the first antenna unit in FIG. 5;
  • Fig. 9 is the radiation direction simulation diagram of the first antenna unit in Fig. 5;
  • FIG. 10 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • FIG. 11 is an S11 parameter distribution diagram of another first antenna unit provided by an embodiment of the application.
  • FIG. 12 is a schematic diagram of the antenna radiation efficiency of another first antenna unit according to an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • Fig. 14 is the S11 parameter distribution diagram of the first antenna unit in Fig. 13;
  • FIG. 15 is a schematic diagram of the antenna radiation efficiency of the first antenna unit in FIG. 13;
  • 16 is a schematic structural diagram of another electronic device provided by an embodiment of the application.
  • Fig. 17 is the S11 parameter distribution diagram of the first antenna unit in Fig. 16;
  • FIG. 18 is a schematic diagram of the antenna radiation efficiency of the first antenna unit in FIG. 16;
  • FIG. 19 is a schematic diagram of the current and electric field distribution of the first antenna unit in FIG. 16;
  • Fig. 20 is the radiation direction simulation diagram of the first antenna unit in Fig. 16;
  • FIG. 21 is a schematic structural diagram of another electronic device provided by an embodiment of the application.
  • Figure 21a is a circuit diagram of the second antenna unit in Figure 21;
  • 21b is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • Figure 21c is a circuit diagram of the second antenna unit in Figure 21b;
  • 21d is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • Fig. 22 is the S11, S22 and S12 parameter distribution diagram of the antenna unit in Fig. 21d;
  • FIG. 23 is a schematic diagram of the radiation efficiency of the antenna unit in FIG. 21d;
  • FIG. 24 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • Fig. 25 is the S11, S22 and S12 parameter distribution diagram of the antenna unit in Fig. 24;
  • FIG. 26 is a schematic diagram of the antenna radiation efficiency of the antenna unit in FIG. 24;
  • Figure 27 is a schematic diagram of the current and electric field distribution of the antenna unit in Figure 24;
  • Fig. 28 is the radiation direction simulation diagram of the antenna unit in Fig. 24;
  • FIG. 29 is a frame diagram of an electronic device provided by an embodiment of the present application.
  • orientation terms such as “upper” and “lower” are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative In the description and clarification of the drawings, it may change correspondingly according to the change of the orientation in which the components are placed in the drawings.
  • connection It can be understood as the physical contact and electrical conduction of components, and it can also be understood as the form of connection between different components in the circuit structure through a physical circuit such as PCB copper foil or wire that can transmit electrical signals. Among them, “connection” refers to the connection of mechanical structure and physical structure.
  • Coupling refers to the phenomenon that there is close cooperation and mutual influence between the input and output of two or more circuit elements or electrical networks, and energy is transmitted from one side to the other through interaction.
  • the signal/energy transmission is carried out by making two or more components conduct or communicate through the above “electrical connection” or “coupling connection”, which can be referred to as connecting.
  • Antenna Pattern also known as Radiation Pattern. It refers to the graph of the relative field strength (normalized modulus value) of the antenna radiation field changing with the direction at a certain distance from the antenna. It is usually represented by two mutually perpendicular plane patterns in the maximum radiation direction of the antenna.
  • Antenna patterns usually have multiple radiating beams.
  • the radiation beam with the highest radiation intensity is called the main lobe, and the remaining radiation beams are called side lobes or side lobes.
  • the side lobes In the side lobes, the side lobes in the opposite direction to the main lobe are also called back lobes.
  • Antenna return loss It can be understood as the ratio of the signal power reflected back to the antenna port through the antenna circuit to the transmit power of the antenna port. The smaller the reflected signal, the greater the signal radiated to the space through the antenna, and the greater the radiation efficiency of the antenna. The larger the reflected signal, the smaller the signal radiated to the space through the antenna, and the smaller the radiation efficiency of the antenna.
  • the antenna return loss can be represented by the S11 parameter, which is usually a negative number.
  • S11 the smaller the return loss of the antenna and the greater the radiation efficiency of the antenna; the larger the parameter S11, the greater the return loss of the antenna and the smaller the radiation efficiency of the antenna.
  • Antenna isolation refers to the ratio of the signal power transmitted by one antenna to the signal power received by another antenna.
  • Antenna system efficiency refers to the ratio of the power radiated by the antenna to the space (that is, the power that effectively converts the electromagnetic wave part) to the input power of the antenna.
  • Antenna radiation efficiency refers to the ratio of the power radiated by the antenna to the space (that is, the power that effectively converts the electromagnetic wave part) to the active power input to the antenna.
  • the active power input to the antenna the input power of the antenna-antenna loss; the antenna loss mainly includes metal ohmic loss and/or dielectric loss.
  • Embodiments of the present application provide an electronic device, which includes, for example, a mobile phone, a tablet computer, a vehicle-mounted computer, a smart wearable product, the Internet of Things (IOT), and the like.
  • the embodiments of the present application do not specifically limit the specific form of the above electronic device.
  • the following description takes the electronic device as a mobile phone as an example.
  • the electronic device 01 mainly includes a display module 10 , a middle frame 11 and a metal back cover 12 .
  • the middle frame 11 is located between the display module 10 and the metal back cover 12 .
  • the display module 10 is used for displaying images.
  • the display module 10 includes a liquid crystal display (LCD) module and a backlight unit (BLU).
  • the display module 10 may be an organic light emitting diode (organic light emitting diode, OLED) display screen.
  • the middle frame 11 includes a carrier board 110 and a conductive frame 112 surrounding the carrier board 110 .
  • the conductive frame 112 may be a conductive frame integrally formed on the carrier board 110 . It should be understood that in other embodiments, the conductive frame 112 and the middle frame 11 may also be independent.
  • the conductive frame 112 and the middle frame 11 may be formed of different materials, for example, the middle frame 11 is formed of a conductive material.
  • the conductive frame 112 is formed of a non-conductive material.
  • Electronic devices such as a printed circuit board (PCB), a camera, a battery, etc. may be disposed on the surface of the carrier board 110 facing the metal back cover 12 .
  • the camera and battery are not shown in the figure.
  • the metal back cover 12 is connected with the middle frame 11 to form an accommodating cavity for accommodating the above-mentioned electronic devices such as the PCB, the camera, and the battery. Therefore, it is possible to prevent water vapor and dust from outside from invading into the accommodating cavity, thereby affecting the performance of the above-mentioned electronic device.
  • the display module 10 may pass through the carrier board 110 through a flexible printed circuit (FPC) as shown in FIG. 1 , and then be electrically connected to the PCB disposed on the carrier board 110 . Therefore, the PCB can transmit the display data to the display module 10 to control the display module 10 to perform image display.
  • FPC flexible printed circuit
  • the display module 10, the middle frame 11 and the metal back cover 12 can be respectively arranged on different layers in the thickness direction of the electronic device, these layers can be parallel to each other, the plane where each layer is located can be called the X-Y plane, and the plane perpendicular to the X-Y plane.
  • the direction may be referred to as the Z direction. That is to say, the display module 10 , the middle frame 11 and the metal back cover 12 can be distributed in layers in the Z direction.
  • the above electronic device further includes the first feeding system 14 as shown in FIG. 2 and the first antenna unit 001 for communication.
  • the first feeding system 14 feeds the first antenna unit 001, and the first antenna unit 001 is used for transmitting and receiving electromagnetic waves.
  • the first antenna unit 001 includes: a first conductive layer 101 and a second conductive layer 102 that are spaced apart in the thickness direction of the electronic device.
  • the first conductive layer 101 and the second conductive layer 102 are arranged in parallel, for example, in the thickness direction of the electronic device.
  • the first conductive layer 101 may be formed by a conductive back cover (such as a metal back cover) of the electronic device shown in FIG. 1 or a conductive layer on a display module
  • the second conductive layer 102 may be formed by a conductive layer of the electronic device.
  • Ground plate is formed.
  • the first conductive layer is disposed on the side of the display module facing the ground plate, or at least a part of the surface of the display module facing the ground plate is coated with metal as the first conductive layer (for example, on the backing plate of the display module) coated metal).
  • the conductive layer of the display module may be a metal layer formed on the side of the display module 10 facing the carrier board.
  • the first antenna unit 001 further includes: a conductive connection part 113 for connecting the first conductive layer 101 and the second conductive layer 102 .
  • the conductive connection portion 113 is formed by a metal wall, a metal dome, or a metal via.
  • the first antenna unit 001 further includes: a first conductive frame 111 , and the first conductive frame 111 may be formed by at least a part of the conductive frame 112 of the electronic device shown in FIG. 1 , wherein the conductive frame 112 may be, for example, a A conductive frame arranged around the periphery of the electronic device.
  • the first conductive frame 111 may be, for example, a segment of a straight bar-shaped frame on a side frame, or a segment of an L-shaped frame at the connection between the top frame and the side frame.
  • the first antenna unit 001 can be disposed in the electronic device 01 shown in FIG. 1 , wherein the first conductive layer 101 , the second conductive layer 102 and the conductive connection portion 113 of the first antenna unit 001 are all located in the area surrounded by the conductive frame For example, the first conductive layer 101 , the second conductive layer 102 and the conductive connection portion 113 are disposed relative to the first conductive frame 111 .
  • the conductive frame (for example, the first conductive frame 111 ) may be a conductive frame formed of a conductive material such as metal, or a non-conductive material such as plastic or resin, and a conductive radiator disposed inside the non-conductive material. , or a conductive frame formed by a conductive radiator embedded in a non-conductive material.
  • the antenna in the electronic device 01 may utilize a frame formed of a conductive material to transmit or receive signals.
  • Signal transmission or reception can also be achieved by using a conductive radiator disposed inside the frame formed of non-conductive material or a conductive radiator embedded inside the frame of non-conductive material.
  • the first conductive layer 101 , the second conductive layer 102 and the conductive connection portion 113 are located in the area surrounded by the conductive frame 112 , and the first conductive layer 101 , the second conductive layer 102 , the conductive connection portion 113 and the conductive frame
  • the first part of 112 ie, the first conductive frame 111
  • the first cavity 100 is surrounded by a first cavity 100 , wherein the first conductive layer 101 and the first conductive frame 111 are spaced apart to form the first cavity 100 .
  • the first slit 104 is surrounded by a first cavity 100 , wherein the first conductive layer 101 and the first conductive frame 111 are spaced apart to form the first cavity 100 .
  • first conductive layer 101 and the second conductive layer 102 may be metal layers arranged at any interval inside the electronic device, and the first conductive layer 101 is not limited to the above-mentioned conductive back cover (eg, metal back cover) or display module
  • the metal layer of the display module, the second conductive layer 102 is not limited to the ground plane of the electronic device.
  • the first gap 104 may be a gap formed between the first conductive layer 101 and the first conductive frame 111, or may be formed by opening a gap on the first conductive layer 101 or the first conductive frame 111, thereby forming a gap with a gap.
  • the first cavity of 104 all of which belong to the protection scope of the present application.
  • the embodiment of the present application does not limit the structure of the first cavity, wherein the first conductive layer 101 and the second conductive layer 102 surrounding the first cavity have at least one opposite portion connected through the conductive connection portion 113 . .
  • the first cavity may be a hollow structure.
  • the first cavity is further filled with a medium, and the medium adopts an insulating material, such as resin and polychlorinated biphenyls (Polychlorinated biphenyls, PCBs).
  • an insulating material such as resin and polychlorinated biphenyls (Polychlorinated biphenyls, PCBs).
  • the first antenna unit 001 further includes: a radiator, and a feeding point or a feeding branch, a grounding point or a grounding branch, etc., or may further include a matching circuit, and the feeding point or the feeding branch or the matching circuit is connected to the first feeding A system 14 feeds the radiator.
  • the above-mentioned first antenna unit 001 is disposed in the electronic device 01 and can be combined with the electronic device 01 .
  • the metal back cover 12 can be used as the first conductive layer 101 of the first antenna unit 001 , the metal back cover 12 and the first conductive frame 111
  • a first slot 104 is opened on the surface of the antenna, and this structure can obtain better antenna space and excite rich antenna modes.
  • this slotting method divides the conductive frame and the metal back cover 12 of the electronic device 01 , which affects the integrity of the metal back cover 12 and the conductive frame.
  • FIG. 4 shows a conductive layer structure inside the electronic device
  • FIG. 4b shows a schematic diagram of the combination of the first antenna unit 001 with the electronic device
  • the metal back cover 12 of the electronic device shown in FIG. 4b is made of metal.
  • at least a part of the metal back cover 12 can be used as the first conductive layer 101 shown in FIG. 4 , or the first conductive layer 101 includes at least a part of the metal back cover 12.
  • the first conductive layer 101 can also Include other metal layers.
  • the metal back cover can be used for the first antenna unit 001, and there is no need to provide other metal components, which can reduce the manufacturing cost of the antenna and save space.
  • the display module 10 is provided with a metal layer on the side facing the carrier board, and at least a part of the metal layer on the display module 10 shown in FIG.
  • the first conductive layer 101 shown in 4, or the first conductive layer 101 includes at least a part of the metal layer on the display module 10, it should be understood that the first conductive layer 101 may also include other metal layers.
  • the conductive layer of the display module can be reused for the first antenna unit 001 without additionally disposing other metal components, thereby reducing the manufacturing cost of the antenna and saving space.
  • the electronic device 01 further includes: a ground plate 13 .
  • the second conductive layer 102 is electrically connected or coupled to the ground plate 13 , and the first antenna unit 001 is grounded through the second conductive layer 102 .
  • the ground plate 13 forms the second conductive layer 102 . Wherein, at least a part of the ground plate 13 may serve as the second conductive layer 102 of the first antenna unit 001 .
  • the grounding plate 13 may be a metal structure disposed on the carrier plate 110 of the electronic device 01 as shown in FIG. 1 , and in other embodiments of the present application, the grounding plate 13 may be disposed The PCB on the carrier board 110 as shown in FIG. 1 , such as a PCB ground plane.
  • the PCB ground plane may specifically be a copper clad layer on the PCB.
  • the copper clad layer on the PCB forms the second conductive layer 102, or the second conductive layer 102 includes a part of the copper clad layer of the PCB. It should be understood that the second conductive layer 102 may also include other metal layers or ground layers.
  • the grounding plate 13 is located directly under the metal back cover 12, and in the thickness direction of the electronic device, the grounding plate 13 and the metal back cover 12 are spaced apart.
  • the grounding plate 13 is parallel to the XY plane. It is arranged on the metal back cover 12 .
  • the grounding plate 13 is located directly above the display module 10, and in the thickness direction of the electronic device, the grounding plate 13 and the display module 10 are spaced apart, for example, the grounding plate 13 is parallel to the XY plane Set in the display module 10 .
  • the ground plate 13 can be reused for the first antenna unit 001, and no additional metal components are required, thereby reducing the manufacturing cost of the antenna and saving space.
  • the first feeding system 14 includes: a first feeding unit 141 and a first grounding unit 142 .
  • the first feeding unit 141 is electrically connected to the first conductive layer 101
  • the first grounding unit 142 is electrically connected to the grounding plate 13 and feeds power to the first conductive layer 101 through the first feeding unit 141 .
  • the first feeding unit 141 is coupled to the first conductive layer 101 , and the first feeding unit 141 is coupled to feed the first conductive layer 101 .
  • the electronic device 01 further includes: a conductive frame 112 (for example, including a first conductive frame 111).
  • the conductive frame 112 is disposed around the carrier board 110 , and the projection of the conductive frame 112 on the carrier board 110 is located at the edge of the carrier board 110 .
  • the conductive connection portion 113 is located in the area surrounded by the conductive frame 112 .
  • the conductive connection portion 113 is disposed relative to the first conductive frame 111 , and for example, the conductive connection portion 113 is located inside the first conductive frame 111 .
  • the conductive connection portion 113 is used to connect the metal back cover 12 and the ground plate 13 .
  • the conductive connection portion 113 , the first conductive frame 111 , the metal back cover 12 and the The ground plate 13 surrounds the first cavity.
  • the metal back cover 12 and the first conductive frame 111 are spaced apart and surrounded by a first gap 104 of the first cavity. Or as shown in FIG.
  • the conductive connecting portion 113 is used to connect the display module 10 (for example, the conductive layer provided on the display module 10 ) and the grounding plate 13 .
  • the first conductive frame 111 , the display module 10 and the ground plate 13 are enclosed to form the first cavity. Wherein, the display module 10 and the first conductive frame 111 are spaced apart and surrounded by a first gap 104 .
  • the projection of the conductive connection portion 113 on the XY plane is, for example, within the projection range of the metal back cover 12 on the XY plane.
  • the projection of the conductive connection portion 113 on the grounding plate 13 is located within the projection range of the metal back cover 12 on the grounding plate 13 .
  • the conductive connection portion 113 is flush with the edge of the metal back cover 12 .
  • the projection of the conductive connection portion 113 on the XY plane is, for example, within the projection range of the display module 10 on the XY plane.
  • the projection of the conductive connection portion 113 on the ground plate 13 is within the projection range of the display module 10 on the ground plate 13 .
  • the conductive connection portion 113 is flush with the edge of the display module 10 .
  • the conductive connection portion 113 is located in the area surrounded by the conductive frame 112 , and at least one side of the conductive connection portion 113 has an opening.
  • a part of the conductive frame 112 such as the first conductive frame 111 , is located at the opening of the conductive connection portion 113 .
  • the thin solid line shown in FIG. 4f is the projection of the conductive connecting portion 113 on the XY plane, and the opening of the conductive connecting portion 113 is the thick solid line, and the thick solid line is the first conductive frame 111 located at the opening at the Projection of the XY plane.
  • the conductive connection portion 113 is flush with the edge of the metal back cover 12 or the display module 10 , and the metal back cover 12 or the display module 10 and the first conductive frame 111 are on the XY plane.
  • the projection of the first conductive frame 111 and the conductive connecting portion 113 on the XY plane intersects, and at this time, the thin solid line intersects the thick solid line.
  • the conductive connection portion 113 when there is a gap between the projection of the metal back cover 12 or the display module 10 and the first conductive frame 111 on the XY plane, or the conductive connection portion 113 is not connected to the edge of the metal back cover 12 or the display module 10
  • the conductive connection portion 113 when the conductive connection portion 113 is disposed within the edge of the metal back cover 12 or the display module 10, there is a gap between the projection of the first conductive frame 111 and the conductive connection portion 113 on the XY plane.
  • the thick solid lines do not intersect.
  • the ground plate 13, the first conductive frame 111, the metal back cover 12, and the conductive connection portion 113 in FIG. 4b together form the first cavity.
  • the first gap 104 is provided between the first conductive frame 111 and the metal back cover 12 .
  • the first conductive frame 111 and the metal back cover 12 are arranged opposite to each other with a certain interval to form the first gap 104 , and the first gap 104 is filled with insulating material to connect the first conductive frame 111 and the metal back cover 12 .
  • the grounding plate 13, the first conductive frame 111, the display module 10 and the conductive connecting portion 113 in FIG. 4e together form the first cavity.
  • the first gap 104 is disposed between the first conductive frame 111 and the display module.
  • the first conductive frame 111 and the display module 10 are opposite to each other with a certain interval to form the first gap 104
  • the first gap 104 is filled with insulating material to connect the first conductive frame 111 and the display module 10 .
  • the first slit 104 may extend in the length direction of the electronic device, eg, in the Y-axis direction shown in FIGS. 4b and 4e.
  • the grounding plate 13 and the metal plate are stacked and arranged, and the grounding plate and the metal plate, and the metal plate and the conductive frame are connected through the conductive connecting portion 113 .
  • a first gap is formed, so that the ground plate, the metal plate, the conductive connection portion 113 and the conductive frame together form a first cavity with a first gap, and the first cavity can be a closed cavity except for the first gap 104
  • the body can also be a non-closed cavity, which will be described in more detail below.
  • the first antenna unit can radiate or receive electromagnetic waves through the first gap, so that there is no need to make a groove on the surface of the metal back cover 12, and the electronic equipment is improved. surface integrity.
  • the present application does not limit the length of the first slit 104, and the length of the slit can be adjusted according to the appearance design (Industrial Design, ID) of the electronic device.
  • the first gap 104 is filled with an insulating material; in other embodiments, a part of the first gap 104 is filled with an insulating material, and a part is connected by a metal part, wherein the first gap 104 is filled with a part of the insulating material Can be used to radiate or receive signals.
  • the embodiment of the present application does not limit the conductive connection portion.
  • the conductive connection portion 113 adopts a conductive wall structure.
  • the conductive wall structure may be a continuous metal sheet, such as a bent metal sheet, or a discontinuous metal sheet, such as an angled combination of several metal sheets.
  • the sheet-shaped conductive wall structure is disposed between the metal back cover 12 and the grounding plate 13 , one end is connected to the metal back cover 12 , and the other end is connected to the grounding plate 13 .
  • the sheet-like conductive wall structure is disposed between the ground plate 13 and the display module 10 , one end is connected to the display module 10 , and the other end is connected to the ground plate 13 .
  • the conductive connection portion 113 includes a plurality of segments of the conductive connection portion 203 , or a plurality of point connection structures 203 .
  • the multi-segment connection structure 203 or the multiple point connection structures 203 may be metal sheets or metal dome pieces arranged at different positions, for example, metal pieces arranged separately or metal dome pieces arranged separately.
  • Each section of the conductive connection portion or each point connection structure in the conductive connection portion 203 is used to connect the ground plate 13 and the metal plate (not shown).
  • One of the one or more point connecting structures 203 in the multi-segment connecting structure 203 may be a metal sheet or a metal dome.
  • the grounding plate 13 and the first conductive layer are stacked and arranged, and the grounding plate and the first conductive layer are connected through a multi-segment connection structure , and together with the conductive frame, a first cavity with a first slit 104 is formed, and the first cavity may be a non-closed cavity except for the first slit 104 .
  • the first antenna unit can radiate or receive electromagnetic waves through the first gap, so that there is no need to make a groove on the surface of the metal back cover 12, thereby improving the surface integrity of the electronic device .
  • the embodiment of the present application does not limit the shape of the conductive connection portion.
  • the conductive connection portion 113 and the first conductive frame 111 are projected on the grounding plate to form a regular or irregular pattern, wherein the rough and solid The line portion is the projection of the first conductive frame 111, and the thin solid line portion is the projection of the conductive connection portion 113.
  • the thin solid line portion representing the conductive connection portion 113 and the thick solid line portion representing the first conductive frame 111 can be The intersection or gap as described above will not be repeated here.
  • the thin solid line portion representing the conductive connection portion 113 can also be replaced with a thin dotted line, as shown in FIG.
  • the conductive connection part 113 may be arranged substantially perpendicular to the ground plate, and the conductive connection
  • the projection of the portion 113 on the carrier board may be one of a curve, a straight line or a polyline, or any combination of any of them.
  • the included angle between the conductive connection portion 113 and the carrier board may also be greater or less than 90°, and the projection of the conductive connection portion 113 on the carrier board may have a certain width.
  • This embodiment of the present application does not limit the positional relationship between the multi-segment connection structure 203 and the plurality of point connection structures 203, wherein, as shown in FIG. 4g (a), (b), (c), (d), ( As shown in e), (f), (g), FIG. 10 , and FIG. 24 , the projection of the multi-segment connection structure 203 on the carrier board may be a dotted line. Can be set into regular or irregular graphics.
  • the distance between adjacent multi-segment connection structures or adjacent point connection structures is less than or equal to half of the wavelength corresponding to the center frequency of the first antenna 001 .
  • the distance between adjacent multi-segment connection structures or the distance between adjacent point connection structures may be the distance between them and the first conductive layer or the second conductive layer (for example, the ground plate 13, the metal back cover 12, or the display module, respectively).
  • the first antenna unit 001 formed by the metal back cover 12 , the ground plate 13 , the first conductive frame 111 and the C-type conductive connection portion 113 is disposed on the electronic device (back At the middle position on the right side, for example, the first conductive frame 111 as the first antenna unit 001 does not include upper and lower frames, the C-type conductive connection portion 113 realizes the connection between the metal back cover 12 and the ground plate 13, and the straight conductive There is an insulating first gap between the frame and the metal back cover 12 .
  • the first antenna unit 001 formed by the metal back cover 12 , the ground plate 13 , the first conductive frame 111 and the L-shaped conductive connection portion 113 is disposed on the electronic device.
  • the L-shaped conductive connection part 113 realizes the connection between the metal back cover 12 and the ground plate 13 , and there is a first gap between the L-shaped conductive frame in the upper right corner and the metal back cover 12 .
  • the embodiment of the present application does not limit the structure of the first gap between the first conductive layer (for example, the metal back cover 12 or the display module 10) and the conductive frame.
  • the height of the metal frame (in the thickness direction of the electronic device) is smaller than the height difference between the first conductive layer and the ground plate; wherein, the first conductive layer and the conductive layer
  • the first gap is provided between the frames, including:
  • the first gap between the first conductive layer and the ground plate on the plane where the metal frame is located serves as the first gap.
  • the first slit is, for example, located on the X-Z plane shown in FIG. 4a.
  • the second gap between the first conductive layer and the conductive frame on the plane where the ground plane is located is used as the first gap.
  • the first slit is, for example, located on the X-Y plane shown in FIG. 4a.
  • the first gap and the second gap together form the first gap.
  • the first gap between the metal plate and the conductive frame is filled with insulating material.
  • the specific material of the insulating material is not limited in the embodiments of the present application.
  • the insulating material is, for example, polycarbonate, acrylonitrile-butadiene-styrene copolymer and mixed PC/ABS material. .
  • the size of the first antenna unit and related parameter settings are as follows:
  • the size of the ground plate 13 is L1*L2, wherein L1 is 78mm and L2 is 158mm.
  • the thickness L3 of the metal back cover 12 is 1 mm, and the gap width between the metal back cover 12 and the first conductive frame 111 (the distance between the metal back cover 12 and the first conductive frame 111 on the XY plane)
  • the gap width) L4 between the projections is 2 mm, and the gap is filled with insulating material, for example.
  • the height difference L5 between the inner surface of the metal back cover 12 and the first conductive frame 111 in the thickness direction of the electronic device 01 is 1.3 mm
  • the height L6 of the first conductive frame 111 is 2 mm
  • the width L7 is 1 mm
  • the first conductive frame 111 is XY plane
  • the projection on the display module 10 is located within the projection range of the display module 10 on the XY plane.
  • the height difference L8 between the lower edge of the first conductive frame 111 and the display module 10 is 2.5 mm
  • the thickness L9 of the display module 10 is 1 mm.
  • the first antenna unit 001 is arranged at the middle position on the right side of the electronic device 01 (back view), and the upper, left and lower sides of the first antenna unit 001 are realized by the conductive connection part 113 of the metal plate (not shown) and the The ground plate 13 is connected, and a first gap is provided between the first conductive frame 111 on the right side of the electronic device and the metal plate.
  • the conductive connecting portion 113 adopts a conductive wall structure.
  • the feed point and ground point of the first antenna element can be located in the middle of the first antenna element (eg, the feed point is located in the middle of the first conductive layer; the ground point is located in the middle of the second conductive layer) or any other location.
  • the first feeding system 14 is connected between the feeding point and the grounding point of the first antenna element.
  • the first feeding system 14 includes, for example, a first feeding unit and a first grounding unit.
  • the first feeding unit and the first conductive layer eg, the metal back cover 12 or the display module 10
  • the first grounding unit is electrically connected to the grounding point of the second conductive layer (for example, the grounding plate 13), and the first conductive layer can be fed with electricity through the first feeding unit.
  • the first feeding unit may adopt coupled feeding. At this time, the conductive frame 112 around the electronic device is completely grounded and does not participate in radiation.
  • FIG. 6 is an S11 parameter distribution diagram of the first antenna unit in FIG. 5 .
  • FIG. 7 is a schematic diagram of the antenna radiation efficiency of the first antenna unit in FIG. 5 .
  • FIG. 8 is a schematic diagram of the current and electric field distribution of the first antenna unit in FIG. 5 .
  • FIG. 9 is a simulation diagram of the radiation direction of the first antenna unit in FIG. 5 .
  • the first antenna unit resonates at two frequency points 1 and 2.
  • resonance 1 may be generated by a half wavelength mode of the first antenna unit
  • resonance 2 may be generated by a double wavelength mode of the first antenna unit.
  • the resonant mode is a half wavelength mode means that the first antenna unit resonates at one-half wavelength
  • the resonance mode is a double wavelength mode means that the first antenna unit resonates at one wavelength.
  • the S11 parameter distribution diagram of the first antenna unit is shown as curve a in FIG. 6 .
  • curve a in FIG. 6 the S11 parameter of the first antenna unit when resonance occurs is small, and the antenna return loss is small.
  • Curve 2 in FIG. 7 For the antenna radiation efficiency of the first antenna unit, reference may be made to Curve 2 in FIG. 7 . As shown by curve 2 in FIG. 7 , when the first antenna unit resonates, the radiation efficiency of the antenna is relatively high.
  • the antenna system efficiency can refer to curve 1 in FIG. 7 .
  • FIG. 8 shows the current distribution when the first antenna element resonates 1 at 3.87 GHz
  • (c) in FIG. 8 shows the electric field when the first antenna element resonates at 3.87 GHz 1 distributed.
  • the current of the first antenna unit flows from the middle position of the first slot to both ends of the first slot, and the current at both ends of the first slot is the strongest, and the current of the first slot is the strongest.
  • the electric field is strongest in the middle position.
  • the signal of resonance 1 may be radiated by the half wavelength mode of the first antenna element.
  • FIG. 8 shows the current distribution when the first antenna unit resonates 2 at 7 GHz
  • (d) in FIG. 8 shows the electric field distribution when the first antenna unit resonates at 7 GHz 2.
  • the signal of resonance 2 may be radiated by the one-wavelength mode of the first antenna element.
  • the resonance 1 of the first antenna unit at 3.87 GHz is a half wavelength mode of the first antenna unit
  • the resonance 2 of the first antenna unit at 7 GHz is a double wavelength mode of the first antenna unit.
  • the simulation diagrams of the radiation direction of the first antenna unit are shown in (a) and (b) of FIG. 9 .
  • D in FIG. 9 is the directivity coefficient of the direction indicated by the arrow, wherein the directivity coefficient of the direction indicated by the arrow maximum, as the main radiation direction of the first antenna element.
  • the main radiation direction points to the left.
  • the conductive wall structure is often not fully realized, and multiple point connection structures are generally used instead.
  • the distance between adjacent point connection structures cannot exceed the first One-half of the wavelength corresponding to the center frequency of the antenna 001, wherein the distance between the adjacent point connection structures can be the distance between them and the first conductive layer or the second conductive layer (for example, the ground plate 13, the metal back cover 12, the Or the minimum straight-line distance between the connections of the display module 10), or the minimum path.
  • the conductive connection portion includes a plurality of point connection structures. One end of the point connection structures is connected to the ground plate 13 and the other end is connected to the metal back cover 12 .
  • the point connection structures are, for example, metal dome sheets.
  • the first antenna unit is the same as the first antenna unit in Example 1, and the conductive connection part adopts a conductive wall structure; as shown in (b) of FIG. 10 , five conductive connection parts are used Point connection structure; as shown in (c) of FIG. 10 , the conductive connection part adopts three point connection structures.
  • FIG. 11 and FIG. 12 show the performance comparison when the first antenna unit adopts the conductive wall structure, the 5-point connection structure, and the 3-point connection structure.
  • FIG. 11 is an S11 parameter distribution diagram of another first antenna unit provided by an embodiment of the present application.
  • FIG. 12 is a schematic diagram of antenna radiation efficiency of another first antenna unit according to an embodiment of the present application.
  • the S11 parameter distribution diagram of the first antenna unit shown in (a) in FIG. 10 is shown as the curve a in FIG. 11 .
  • the S11 parameter distribution diagram of the first antenna unit shown in (b) in FIG. 10 is shown as curve b in FIG. 11 .
  • the S11 parameter distribution diagram of the first antenna unit shown in (c) in FIG. 10 is shown as the curve c in FIG. 11 .
  • the radiation efficiency of the first antenna element shown in (a) in FIG. 10 is shown as a curve 1-1 in FIG. 11 .
  • the radiation efficiency of the first antenna element shown in (b) of FIG. 10 is shown as a curve 2-1 in FIG. 11 .
  • the radiation efficiency of the first antenna element shown in (c) of FIG. 10 is shown as a curve 3-1 in FIG. 11 .
  • the system efficiency of the first antenna unit shown in (a) of FIG. 10 is shown as curve 1 in FIG. 11 .
  • the system efficiency of the first antenna unit shown in (b) in FIG. 10 is shown as curve 2 in FIG. 11 .
  • the system efficiency of the first antenna unit shown in (c) in FIG. 10 is shown as curve 3 in FIG. 11 .
  • the resonant frequency of the antenna can be changed.
  • the size of the first antenna element in the X direction is d1
  • the size of the first antenna element in the X direction is d2.
  • d1 is, for example, 16 mm
  • d2 is, for example, 10 mm.
  • Figures 14 and 15 show the performance comparison of the first antenna element when the dimensions in the X direction are d1 and d2.
  • FIG. 14 is the S11 parameter distribution diagram of the first antenna unit in FIG. 13 .
  • FIG. 15 is a schematic diagram of the antenna radiation efficiency of the first antenna unit in FIG. 13 .
  • the S11 parameter distribution diagram of the first antenna unit shown in (a) in FIG. 13 is shown as the curve a in FIG. 14 .
  • the S11 parameter distribution diagram of the first antenna element shown in (b) of FIG. 13 is shown as the curve b in FIG. 14 .
  • the radiation efficiency of the first antenna element shown in (a) of FIG. 13 is shown as a curve 1-1 in FIG. 15 .
  • the radiation efficiency of the first antenna element shown in (b) in FIG. 10 is shown by the curve 2-1 in FIG. 15 .
  • system efficiency of the first antenna unit shown in (a) of FIG. 13 is shown as curve 1 in FIG. 15 .
  • the system efficiency of the first antenna unit shown in (b) in FIG. 13 is shown as curve 2 in FIG. 15 .
  • the conductive wall structure of the first antenna unit can be connected by the upper, left and lower sides, and connected by two sides, for example, the left and lower sides are connected, and the upper and right sides are connected. Both sides are open, as shown in Figure 16.
  • FIG. 17 is the S11 parameter distribution diagram of the first antenna unit in FIG. 16 .
  • FIG. 18 is a schematic diagram of the antenna radiation efficiency of the first antenna unit in FIG. 16 .
  • Fig. 19 is a schematic diagram of the current and electric field distribution of the first antenna element in Fig. 16 .
  • FIG. 20 is a simulation diagram of the radiation direction of the first antenna unit in FIG. 16 .
  • the first antenna unit resonates at two frequency points 1 and 2. According to the frequency points from small to large, the resonance modes are one-half wavelength mode and three-quarter wavelength mode respectively. .
  • the resonant mode is a half wavelength mode means that the first antenna unit resonates at one-half wavelength
  • the resonance mode is a three-quarter wavelength mode means that the first antenna unit resonates at three-quarter wavelengths. resonance occurs at the wavelength.
  • the S11 parameter distribution diagram of the first antenna unit is shown as curve a in FIG. 17 .
  • the S11 parameter of the first antenna unit when resonance occurs is small, the return loss of the antenna is small, and the radiation efficiency of the antenna is large.
  • the antenna system efficiency can refer to Curve 1 in FIG. 18 .
  • FIG. 19 shows the current distribution when the first antenna element resonates 1 at 3.87 GHz
  • (c) in FIG. 19 shows the electric field when the first antenna element resonates at 3.87 GHz 1 distributed.
  • the current of the first antenna element flows from the middle of the first slot to both ends of the first slot, and the electric field is the strongest at the middle position of the first slot.
  • the signal of resonance 1 may be radiated by the half wavelength mode of the first antenna element.
  • FIG. 19 shows the current distribution when the first antenna element resonates 2 at 4.89 GHz
  • (d) in FIG. 19 shows the electric field when the first antenna element resonates at 4.89 GHz 2 distributed.
  • the current of the first antenna element flows from the middle of the first slot to both ends of the first slot, and one end of the first slot is the electric field strength point.
  • the signal of resonance 2 may be radiated by the three-quarter wavelength mode of the first antenna element.
  • the resonance 1 of the first antenna unit at 3.87GHz is the half wavelength mode of the first antenna unit
  • the resonance 2 of the first antenna unit at 4.89GHz is three-quarter wavelength of the first antenna unit model.
  • Fig. 20(a) shows the radiation pattern when the first antenna element resonates 1 at 3.87 GHz
  • Fig. 20 (b) shows the radiation pattern when the first antenna element resonates at 4.89 GHz 2
  • the main radiation direction of the first antenna unit is left at 3.87GHz
  • the main radiation direction of the first antenna unit is downward at 4.89GHz.
  • the electronic device 01 further includes: a second antenna unit 002 .
  • the second antenna unit 002 may be composed of a part of the conductive frame 112 .
  • the second antenna unit 002 may utilize the conductive frame 112 to transmit or receive signals. Signal transmission or reception can also be achieved by using a conductive radiator disposed inside the non-conductive conductive frame 112 or a conductive radiator embedded in the non-conductive conductive frame 112 .
  • the first antenna unit 001 and the second antenna unit 002 can work in different frequency bands and are used as dual antennas.
  • filter elements can be respectively set at the feed ends of the first antenna unit 001 and the second antenna unit 002 to filter signals in non-operating frequency bands, so as to prevent the first antenna unit 001 and the second antenna unit 002 from sharing the same frequency, and improve the Isolation between the first antenna unit 001 and the second antenna unit 002.
  • the first antenna unit 001 and the second antenna unit 002 may work in the same frequency band, the first antenna unit 001 may be coupled with the second antenna unit 002, and the second antenna unit 002 may serve as the first antenna unit 002.
  • the parasitic radiator of the antenna unit, at this time, the first antenna unit 001 and the second antenna unit 002 can be used as one antenna.
  • the case where the first antenna unit 001 and the second antenna unit 002 work in different frequency bands is used as an example for description.
  • the second antenna unit includes: a second ground unit 152 , a first radiator 21 and a second feed unit 151 .
  • the second ground unit 152 is electrically connected to the conductive frame 112 .
  • the conductive frame 112 is further provided with a second slot 121 , the conductive frame between the second ground unit 152 and the second slot 121 forms the first radiator 21 , the second feed unit 151 and the first radiator
  • the feeding terminal 1511 of the body 21 is electrically connected.
  • multiple antennas can be set on the electronic device, and the first antenna unit and the second antenna unit can work simultaneously, thereby enhancing the reliability of signal processing, signal transmission range and throughput, and improving communication quality.
  • the first radiator 21 is located at the opening of the conductive connection portion 113 , for example, the first radiator 21 is located at the thick solid line shown in FIG. 4 c .
  • the second antenna unit can be reused for the first antenna unit, and the bandwidth of the first antenna unit can be widened.
  • the electronic device 01 includes: a first antenna unit 001 as shown in Example 1, and a second antenna unit 002 .
  • FIG. 21b is a back view of the electronic device, the first antenna unit 001 is the first antenna unit in Example 1, and its feeding and grounding methods will not be described again.
  • the second antenna unit 002 includes: a first radiator 21 and a second radiator 22, and the first radiator 21 and the second radiator 22 adopt distributed feeding.
  • a part of at least one of the first radiator 21 and the second radiator 22 is used as a parasitic radiator of the first antenna unit 001 or multiplexed as a part thereof, for example, the first radiator 21 and the second radiator
  • a portion of at least one radiator in 22 is located at the thick solid line shown in Figure 4f or Figure 4g.
  • the second antenna unit 002 is disposed at the first slot on the right side of the first antenna unit 001, and the two antennas may share a radiator, for example, the first radiator 21 and the second radiator of the second antenna unit 002
  • the body 22 can reuse the conductive frame portion of the first antenna unit 001 .
  • the electronic device further includes: a second feeding system 15 .
  • the second feeding system 15 is used for feeding the first radiator 21 and the second radiator 22 .
  • the second power feeding system 15 includes, for example, a second power feeding unit 151 , a second grounding unit 152 and a third grounding unit 153 .
  • the conductive frame 112 is provided with a second slot 121 , and the conductive frame 112 between the second ground unit 152 and the second slot 121 forms the first radiator 21 .
  • the conductive frame 112 is further provided with a third slot 122 , and the conductive frame 112 between the second slot 121 and the third slot 122 forms the second radiator 22 .
  • the second feeding unit 151 is coupled to the feeding end 1512 of the second radiator 22 to couple and feed the second radiator 22 .
  • the third ground unit 153 is electrically connected to the second radiator 22 .
  • the second radiator is coupled with the first radiator. Therefore, the second radiator can be used as a parasitic radiator of the first radiator, and the manufacturing cost of the antenna can be reduced.
  • At least one of the first radiator 21 and the second radiator 22 is located at the thick solid line shown in FIG. 4f or 4g. Therefore, the first antenna unit can be coupled to the second antenna unit, and the bandwidth of the first antenna unit can be widened.
  • the second antenna unit further includes: a first capacitive component C and a first inductive component L, the second feeding unit 151 is electrically connected to the first radiator 21 through the first capacitive component C, and the second feeding unit 151 is connected to the first radiator 21 through the first capacitive component C.
  • An inductive element L is electrically connected to the second radiator 22 .
  • the first capacitive element C and the first inductive element L are used to perform impedance matching on the first antenna unit 001 .
  • the second antenna unit further includes: a first filter element and a second filter element (not shown in the figure), the second feeding unit 151 is electrically connected to the first radiator 21 through the first filter element, and is The second filter element is electrically connected to the second radiator 22 , and the first filter element and the second filter element are used to filter out the signal of the working frequency band of the first antenna unit.
  • the first filter element and the second filter element can filter signals in non-operating frequency bands, thereby improving the isolation between the first antenna unit 001 and the second antenna unit 002 .
  • the second grounding unit 152 and the third grounding unit 153 of the second feeding system 15 are, for example, connected to a PCB, and the feeding unit 151 is, for example, a transmission line, which connects the first radiator 21 (for example, an IFA antenna) above and the first The two radiators 22 (for example, CRLH antennas) are connected, which is a distributed feeding structure.
  • Fig. 22 is a distribution diagram of S11, S22 and S12 parameters of the antenna unit in Fig. 21d.
  • FIG. 23 is a schematic diagram of the radiation efficiency of the antenna unit in FIG. 21d.
  • the reflection coefficient of the second antenna element in FIG. 21d is shown by the S11 curve in FIG. 22 .
  • the reflection coefficient of the first antenna element in FIG. 21d is shown by the curve S22 in FIG. 22 .
  • the isolation between the first antenna element and the second antenna element in FIG. 21d is shown by the curve S21 in FIG. 22 .
  • the radiation efficiency of the second antenna element in FIG. 21d is shown as curve 1-1 in FIG. 23 .
  • the radiation efficiency of the first antenna element in FIG. 21d is shown as curve 2-1 in FIG. 23 .
  • the system efficiency of the second antenna element in FIG. 21d is shown as curve 1 in FIG. 23 .
  • the system efficiency of the first antenna element in FIG. 21 is shown as curve 2 in FIG. 23 .
  • the resonance of the first antenna unit occurs in the B3 frequency band (upstream 1710-1785MHz, downlink 1805-1880MHz), and the resonance of the second antenna unit occurs in the N79 frequency band.
  • the conductive connection portion of the conductive wall of the first antenna unit is replaced by a plurality of point connection structures, and other structures remain unchanged.
  • FIG. 25 is a distribution diagram of S11, S22 and S12 parameters of the antenna unit in Fig. 24 .
  • FIG. 26 is a schematic diagram of the antenna radiation efficiency of the antenna unit in FIG. 24 .
  • FIG. 27 is a schematic diagram of the current and electric field distribution of the antenna unit in FIG. 24 .
  • FIG. 28 is a simulation diagram of the radiation direction of the antenna unit in FIG. 24 .
  • the reflection coefficient of the second antenna element in FIG. 24 is shown as the S11 curve in FIG. 25 .
  • the reflection coefficient of the first antenna element in FIG. 24 is shown by the curve S22 in FIG. 25 .
  • the isolation between the first antenna element and the second antenna element in FIG. 24 is shown by the curve S21 in FIG. 25 .
  • the radiation efficiency of the second antenna element in FIG. 24 is shown as curve 1-1 in FIG. 26 .
  • the radiation efficiency of the first antenna element in Fig. 24 is shown as curve 2-1 in Fig. 26 .
  • system efficiency of the second antenna element in FIG. 24 is shown as curve 1 in FIG. 26 .
  • system efficiency of the first antenna element in FIG. 24 is shown as curve 2 in FIG. 26 .
  • the first antenna unit resonates in the bandwidths corresponding to the four frequency points 1, 2, 3, and 4.
  • the resonance frequency of resonance 1 is 3.85 GHz
  • the resonance frequency of resonance 2 is 4.35 GHz
  • the resonance frequency of resonance 3 is 4.8 GHz
  • the resonance frequency of resonance 4 is 5.5 GHz.
  • the first antenna unit 001 adds multiple modes in the high frequency band, and the bandwidth coverage increases.
  • Fig. 27 shows the current and electric field distributions at four resonance frequencies of 1, 2, 3, and 4.
  • the positions circled in (b), (c), and (d) in Figure 27 are the current intensity points
  • the positions circled in (e), (f), (g), and (h) in Figure 27 The location is the electric field strength point.
  • FIG. 27 shows the current distribution at the time of resonance 1 at 3.85 GHz
  • (e) of FIG. 27 shows the electric field distribution at the time of resonance at at 3.85 GHz.
  • the current of the first antenna element flows from the middle of the first slot to both ends of the first slot, and the electric field is the strongest at the middle position of the first slot.
  • FIG. 27 shows the current distribution at the time of resonance 2 at 4.35 GHz
  • (f) of FIG. 27 shows the electric field distribution at the time of resonance 2 at 4.35 GHz.
  • the electric field strength point is on the second antenna element 002 .
  • FIG. 27 shows the current distribution at the time of resonance 3 at 4.8 GHz
  • (g) of FIG. 27 shows the electric field distribution at the time of resonance at 4.8 GHz 2.
  • FIG. 27 shows the current distribution at the time of resonance 4 at 5.5 GHz
  • (h) of FIG. 27 shows the electric field distribution at the time of resonance at 5.5 GHz.
  • the antenna unit provided in the embodiment of the present application is not limited to the combination of the second antenna unit 002 provided on the frame 11 and the first antenna unit 001 provided on the metal plate.
  • the first antenna unit 001 may also be disposed at the position of the middle frame, and formed on the grounding structure of the bracket by using laser direct structuring (LDS). Therefore, the antenna unit provided in the present application may also be a combination of a bracket antenna and the first antenna unit 001 disposed on the metal plate, or a combination of the bracket antenna and the second antenna unit 002 disposed on the frame 11 .
  • the electronic device 01 may further include a communication module 010 .
  • the communication module 010 includes: the first antenna unit 001, the second antenna unit 002 in the above embodiment, a mobile communication module, a wireless communication module, a modem processor, a baseband processor, and the like.
  • the first antenna unit 001 and the second antenna unit 002 can be used for transmitting and receiving electromagnetic wave signals.
  • Each antenna in a smart appliance can be used to cover a single or multiple communication frequency bands.
  • the mobile communication module can provide the second-generation mobile communication technical specifications (2-Generation wireless telephone technology, 2G), the third-generation mobile communication technology (3rd-Generation, 3G), and the fourth-generation mobile communication technology applied to smart appliances. (4th generation mobile communication technology, 4G), fifth generation mobile communication technology (5th generation wireless systems, 5G) and other wireless communication solutions.
  • the mobile communication module may include at least one filter, switch, power amplifier, low noise amplifier (LNA), and the like.
  • the mobile communication module can receive electromagnetic waves from the antenna, filter and amplify the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation.
  • the mobile communication module can also amplify the signal modulated by the modem processor, and convert the amplified signal into electromagnetic waves through the antenna and then radiate it out.
  • at least part of the functional modules of the mobile communication module may be provided in the processor 001 .
  • at least part of the functional modules of the mobile communication module may be provided in the same device as at least part of the modules of the processor 001 .
  • the modem processor may include a modulator and a demodulator.
  • the modulator is used to modulate the low frequency baseband signal to be sent into a medium and high frequency signal.
  • the demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal. Then the demodulator transmits the demodulated low-frequency baseband signal to the baseband processor for processing.
  • the low frequency baseband signal is processed by the baseband processor and passed to the application processor.
  • the application processor outputs sound signals through audio devices (not limited to speakers, microphones, etc.), or displays images or videos through the display screen 009 .
  • the modem processor may be a stand-alone device.
  • the modulation and demodulation processor may be independent of the processor 001, and may be provided in the same device as the mobile communication module or other functional modules.
  • the wireless communication module can provide applications on smart appliances including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (bluetooth, BT), global navigation satellite systems ( global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR) and other wireless communication solutions.
  • WLAN wireless local area networks
  • Bluetooth blue, BT
  • global navigation satellite systems global navigation satellite system, GNSS
  • frequency modulation frequency modulation, FM
  • NFC near field communication technology
  • infrared technology infrared, IR
  • the wireless communication module may integrate at least one communication processing module 014 .
  • the wireless communication module receives the electromagnetic wave via the antenna, performs frequency modulation and filtering processing on the electromagnetic wave signal, and sends the processed signal to the processor 001 .
  • the wireless communication module can also receive the signal to be sent from the processor 001, perform frequency modulation on it, amplify it,
  • one antenna of the smart appliance is coupled with the mobile communication module, and the other antenna is coupled with the wireless communication module, so that the smart appliance can communicate with the network and other devices through wireless communication technology.
  • the wireless communication technology may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and/or IR technology, etc.
  • the GNSS may include a global positioning system (GPS), a global navigation satellite system (GLONASS), a Beidou navigation satellite system (BDS), a quasi-zenith satellite system (quasi- zenith satellite system, QZSS) and/or satellite based augmentation systems (SBAS).
  • GPS global positioning system
  • GLONASS global navigation satellite system
  • BDS Beidou navigation satellite system
  • QZSS quasi-zenith satellite system
  • SBAS satellite based augmentation systems

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Abstract

本申请实施例公开了一种电子设备，包括导电边框和第一天线单元，该导电边框围绕该电子设备的外围设置，其特征在于，该第一天线单元包括：第一导电层和第二导电层，该第一导电层和该第二导电层在该电子设备的厚度方向上间隔设置；导电连接部，该导电连接部用于连接该第一导电层和该第二导电层；以及第一导电边框，该第一导电边框为该导电边框的一部分，其中，该第一导电层和该第一导电边框之间存在第一缝隙，该导电连接部、该第一导电边框、该第一导电层和该第二导电层围设成第一腔体。由此，可以通过该第一导电层和该第一导电边框之间的第一缝隙辐射或接收电磁波，从而无需在金属板表面开槽，提高了金属板的完整性。

Description

电子设备
本申请要求于2020年12月25日提交国家知识产权局、申请号为202011564230.2、申请名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及天线技术领域，尤其涉及一种电子设备。
背景技术
随着通信技术的发展，多输入多输出(multi input multi output，MIMO)天线技术在电子设备上的应用愈加广泛，天线数量成倍增加，覆盖频段越来越多。电子设备产品尤其是金属工业设计(industry design，ID)的电子设备依然要求很高的结构紧凑性。而最近的电子设备设计趋势是更高的屏占比、更多的多媒体器件以及更大的电池容量，这些设计使得天线空间被急剧压缩。
缝隙天线是在导体面上开缝形成的天线，电磁波通过缝隙向外部空间辐射。缝隙天线具有低剖面，可集成化等特点，受到了人们广泛关注与研究。
其中，可以将缝隙天线用于终端设备，以实现终端设备的小型化。
发明内容
本申请实施例提供一种电子设备，解决了天线单元占用空间过大的问题。
为达到上述目的，本申请采用如下技术方案：
本申请提供一种电子设备，包括导电边框和第一天线单元，该导电边框围绕该电子设备的外围设置，其特征在于，该第一天线单元包括：第一导电层和第二导电层，该第一导电层和该第二导电层在该电子设备的厚度方向上间隔设置；导电连接部，该导电连接部用于连接该第一导电层和该第二导电层；以及第一导电边框，该第一导电边框为该导电边框的一部分，其中，该第一导电层和该第一导电边框之间存在第一缝隙，该导电连接部、该第一导电边框、该第一导电层和该第二导电层围设成第一腔体。由此，所述导电连接部、所述第一导电边框、所述第一导电层和所述第二导电层围设成第一腔体，所述第一导电层和所述第一导电边框间隔设置并形成所述第一腔体的第一缝隙，使得第一天线单元可以通过该第一缝隙辐射或接收电磁波，从而无需在金属板表面开槽，提高了金属板的完整性。
一种可选的实现方式中，该电子设备还包括第一馈电单元，该第一馈电单元通过该第一导电层为该第一天线单元馈电，其中，该第一馈电单元与该第一导电层电连接或耦合连接。由此，馈电方式更加灵活。
一种可选的实现方式中，该电子设备还包括接地板，该第二导电层与该接地板电连接或耦合连接，该第一天线单元通过该第二导电层接地。由此，第一天线单元结构简单，便于组装。
一种可选的实现方式中，该电子设备还包括接地板，该接地板形成该第二导电层。由此，可以将电子设备的接地板复用于第一天线单元，无需另外设置其他的金属部件，可降低天线的制造成本，更节省空间。该电子设备还包括中框，该接地板设置在该中 框上，且设置于中框朝向第一导电层的一侧。导电边框可以是该中框的一部分。
一种可选的实现方式中，该电子设备还包括金属后盖，该金属后盖形成该第一导电层。由此，可以将金属后盖复用于第一天线单元，作为第一天线单元的一部分，无需另外设置其他的金属部件，可降低天线的制造成本，更节省空间。
一种可选的实现方式中，该电子设备还包括显示模组，该显示模组朝向该接地板的一侧设有该第一导电层。由此，可以在显示模组朝向接地板的一侧设置金属层作为第一天线单元的该第一导电层，结构简单，可降低天线的制造成本，更节省空间。还可以在显示模组朝向接地板的至少一部分表面上涂覆金属作为该第一导电层，例如在显示模组的衬板上涂覆金属。
一种可选的实现方式中，该导电连接部采用导电墙结构，该导电墙的两侧分别连接该第一导电层和该第二导电层。由此，导电墙结构连接更加稳定，且密封性能较好，避免能量泄露。
一种可选的实现方式中，该导电连接部包括多个点连接结构，相邻的点连接结构之间的距离小于或等于该第一天线工作频段的中心频率对应的波长的二分之一。由此，点连接结构更节省电子设备的内部空间。
一种可选的实现方式中，该点连接结构为金属弹片，该金属弹片的两端分别连接该第一导电层和该第二导电层。
一种可选的实现方式中，该导电连接部在该第二导电层上的投影位于该第一导电层在该第二导电层上的投影范围内。
一种可选的实现方式中，该导电连接部在该承载板上的投影为曲线、折线或直线中的一种或几种的组合。由此，导电连接部的形状更灵活，便于安装。
一种可选的实现方式中，该第一缝隙中填充有绝缘材料。该绝缘材料为聚碳酸酯和丙烯腈-丁二烯-苯乙烯共聚物和混合物PC/ABS材料。由此，进一步提高了电子设备外观的完整性。
一种可选的实现方式中，该第一天线单元通过该第一缝隙辐射或接收电磁波。
一种可选的实现方式中，该电子设备还包括：该电子设备还包括：第二天线单元和第二馈电单元，该第二馈电单元为该第二天线单元馈电，其中，该第二天线单元包括：第一接地点，该第一接地点设于该导电边框上；第一辐射体，其中，该导电边框上设有第二缝隙，该第一接地点与该第二缝隙之间的导电边框形成该第一辐射体，该第一接地点用于为该第二天线单元接地。由此，在电子设备上可以设置多个天线，第一天线单元和第二天线单元可以同时工作，增强信号处理的可靠性、信号传输范围和吞吐量，改善通信质量。
一种可选的实现方式中，该第一辐射体的至少一部分由该第一导电边框形成。由此，使得第二天线单元可以复用于第一天线单元，可以展宽该第一天线单元的带宽。
一种可选的实现方式中，第一滤波器件，该第二馈电单元通过该第一滤波器件与该第一辐射体电连接或耦合连接。由此，第一滤波器件可以滤除第一天线单元的信号，提高第一天线单元和第二天线单元之间的隔离度。
一种可选的实现方式中，该第二天线单元还包括：第二辐射体，该导电边框上设有第二缝隙，该第二缝隙与该第一缝隙之间的导电边框形成该第二辐射体；第二接地 点，该第二接地点设于该第二辐射体上，用于为该第二天线单元接地。由此，设置第二辐射体，可以进一步改善通信质量。
一种可选的实现方式中，该第二馈电单元与该第二辐射体电连接。由此，第一辐射体和第二辐射体采用分布式馈电，结构更简单。
一种可选的实现方式中，该第二辐射体通过第一缝隙与该第一辐射体耦合。由此，第二辐射体可以作为第一辐射体的寄生辐射体，可降低天线的制造成本。
一种可选的实现方式中，该电子设备还包括：第二滤波器件，该第二馈电单元通过该第二滤波器件与该第二辐射体电连接或耦合连接。由此，第二滤波器件可以过滤第一天线单元的信号，避免第一天线单元和第二天线单元同频，提高第一天线单元和第二天线单元之间的隔离度。
附图说明
图1为本申请实施例提供的一种电子设备的拆解结构示意图；
图2为本申请实施例提供的第一天线单元的结构示意图；
图3为一种电子设备的背面视图；
图4为本申请实施例提供的一种电子设备的导电层结构示意图；
图4a为图4中第一天线单元的仰视图；
图4b为本申请实施例提供的一种电子设备的结构示意图；
图4c为图4b中电子设备的局部放大图；
图4d为图4b中电子设备的俯视图；
图4e为本申请实施例提供的另一种电子设备的结构示意图；
图4f为本申请实施例提供的一种导电连接部的投影视图；
图4g为本申请实施例提供的另一种导电连接部的投影视图；
图5为本申请实施例提供的一种电子设备的结构示意图；
图6为图5中第一天线单元的S11参数分布图；
图7为图5中第一天线单元的天线辐射效率示意图；
图8为图5中第一天线单元的电流和电场分布情况示意图；
图9为图5中第一天线单元的辐射方向仿真图；
图10为本申请实施例提供的另一种电子设备的结构示意图；
图11为本申请实施例提供的另一种第一天线单元的S11参数分布图；
图12为本申请实施例提供的另一种第一天线单元的天线辐射效率示意图；
图13为本申请实施例提供的另一种电子设备的结构示意图；
图14为图13中第一天线单元的S11参数分布图；
图15为图13中第一天线单元的天线辐射效率示意图；
图16为本申请实施例提供的另一种电子设备的结构示意图；
图17为图16中第一天线单元的S11参数分布图；
图18为图16中第一天线单元的天线辐射效率示意图；
图19为图16中第一天线单元的电流和电场分布情况示意图；
图20为图16中第一天线单元的辐射方向仿真图；
图21为本申请实施例提供的另一种电子设备的结构示意图；
图21a为图21中第二天线单元的电路图；
图21b为本申请实施例提供的另一种电子设备的结构示意图；
图21c为图21b中第二天线单元的电路图；
图21d为本申请实施例提供的另一种电子设备的结构示意图；
图22为图21d中天线单元的S11、S22以及S12参数分布图；
图23为图21d中天线单元辐射效率示意图；
图24为本申请实施例提供的另一种电子设备的结构示意图；
图25为图24中天线单元的S11、S22以及S12参数分布图；
图26为图24中天线单元的天线辐射效率示意图；
图27为图24中天线单元的电流和电场分布情况示意图；
图28为图24中天线单元的辐射方向仿真图；
图29本申请实施例提供的电子设备的框架图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
此外，本申请中，“上”、“下”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
以下，对本申请实施例可能出现的术语进行解释。
电连接：可理解为元器件物理接触并电导通，也可理解为线路构造中不同元器件之间通过PCB铜箔或导线等可传输电信号的实体线路进行连接的形式。其中，“连接”则是指的机械构造，物理构造的连接。
耦合：指两个或两个以上的电路元件或电网络的输入与输出之间存在紧密配合与相互影响，并通过相互作用从一侧向另一侧传输能量的现象。
接通：通过以上“电连接”或“耦合连接”的方式使得两个或两个以上的元器件之间导通或连通来进行信号/能量传输，都可称为接通。
天线方向图：也称辐射方向图。是指在离天线一定距离处，天线辐射场的相对场强(归一化模值)随方向变化的图形，通常采用通过天线最大辐射方向上的两个相互垂直的平面方向图来表示。
天线方向图通常都有多个辐射波束。其中辐射强度最大的辐射波束称为主瓣，其余的辐射波束称为副瓣或旁瓣。在副瓣中，与主瓣相反方向上的副瓣也叫后瓣。
天线回波损耗：可以理解为经过天线电路反射回天线端口的信号功率与天线端口发射功率的比值。反射回来的信号越小，说明通过天线向空间辐射出去的信号越大，天线的辐射效率越大。反射回来的信号越大，说明通过天线向空间辐射出去的信号越小，天线的辐射效率越小。
天线回波损耗可以用S11参数来表示，S11参数通常为负数。S11参数越小，表示天线回波损耗越小，天线的辐射效率越大；S11参数越大，表示天线回波损耗越大，天线的辐射效率越小。
天线隔离度：指一个天线发射的信号与另一个天线所接收的信号功率的比值。
天线系统效率：指天线向空间辐射出去的功率(即有效地转换电磁波部分的功率)和天线的输入功率之比。
天线辐射效率：指天线向空间辐射出去的功率(即有效地转换电磁波部分的功率)和输入到天线的有功功率之比。其中，输入到天线的有功功率＝天线的输入功率-天线损耗；天线损耗主要包括金属的欧姆损耗和/或介质损耗。
本申请实施例提供一种电子设备，该电子设备包括例如手机、平板电脑、车载电脑、智能穿戴产品、物联网(internet of things，IOT)等。本申请实施例对上述电子设备的具体形式不做特殊限制。以下为了方便说明，是以电子设备为手机为例进行的说明。如图1所示，电子设备01主要包括显示模组10、中框11以及金属后盖12。中框11位于显示模组10和金属后盖12之间。
显示模组10用于显示图像。在本申请的一些实施例中，显示模组10包括液晶显示(liquid crystal display，LCD)模组和背光模组(back light unit，BLU)。或者，在本申请的另一些实施例中，显示模组10可以为有机发光二极管(organic light emitting diode，OLED)显示屏。
中框11包括承载板110和绕承载板110一周的导电边框112。在一些实施例中，导电边框112可以是在承载板110上一体形成的导电边框。应可理解，在另一些实施例中，导电边框112和中框11也可以是独立的，例如，导电边框112和中框11可以采用不同材料分别成型，例如，中框11由导电材料成型，导电边框112由非导电材料成型。
承载板110朝向金属后盖12的表面上可以设置印刷电路板(printed circuit board，PCB)、摄像头、电池等电子器件。其中，摄像头和电池图中未示出。金属后盖12与中框11相连接形成用于容纳上述PCB、摄像头以及电池等电子器件的容纳腔。从而可以防止外界的水汽和尘土侵入该容纳腔内，对上述电子器件的性能造成影响。
显示模组10可以通过如图1所示的柔性电路板(flexible printed circuit，FPC)穿过承载板110后，与设置于承载板110上的PCB电连接。从而可以使得PCB将显示数据传输至显示模组10，以控制显示模组10进行图像显示。
显示模组10、中框11以及金属后盖12可以在电子设备的厚度方向上分别设置于不同的层，这些层可以相互平行，各层所在的平面可以称为X-Y平面，垂直于X-Y平面的方向可以称为Z方向。也即是说，显示模组10、中框11以及金属后盖12可以在Z方向上分层分布。
上述电子设备还包括如图2所示的第一馈电系统14和用于通信的第一天线单元001。第一馈电系统14为所述第一天线单元001馈电，第一天线单元001用于发射电磁波和接收电磁波。
如图2所示，第一天线单元001包括：在电子设备的厚度方向上间隔设置的第一导电层101和第二导电层102。
第一导电层101和第二导电层102例如在电子设备的厚度方向上平行设置。
其中，在一些实施例中，第一导电层101可以由图1所示电子设备的导电后盖(例如金属后盖)或显示模组上的导电层形成，第二导电层102由电子设备的接地板形成。例如，在显示模组朝向接地板的一侧设置该第一导电层，或者在显示模组朝向接地板的至少一部分表面上涂覆金属作为该第一导电层(例如在显示模组的衬板上涂覆金属)。
显示模组的导电层层可以是在显示模组10朝向承载板的一侧形成的金属层。
第一天线单元001还包括：用于连接第一导电层101和第二导电层102的导电连接部113。
导电连接部113由金属墙或金属弹片或金属过孔形成。
在一些实施例中，第一天线单元001还包括：第一导电边框111，第一导电边框111可以由图1所示电子设备的导电边框112的至少一部分形成，其中，导电边框112可以例如是围绕所述电子设备的外围设置的导电边框。在一些实施例中，第一导电边框111例如可以是侧边框上的一段直条形边框，或顶边框和侧边框连接处的一段L形边框。
第一天线单元001可以设置于图1所示的电子设备01，其中，第一天线单元001的第一导电层101，第二导电层102以及导电连接部113都位于导电边框围设的区域中，例如第一导电层101，第二导电层102以及导电连接部113相对于第一导电边框111设置。
需要说明的是，导电边框(例如第一导电边框111)可以是由金属等导电材料形成的导电边框，也可以是由塑胶、树脂等非导电材料、以及设置于非导电材料内侧的导电辐射体，或者嵌设于非导电材料内部的导电辐射体而形成的导电边框。
此外，电子设备01内的天线可以利用由导电材料形成的边框来实现信号的发射或接收。也可以利用设置于由非导电材料形成的边框的内侧的导电辐射体或者嵌设于非导电材料边框内部的导电辐射体来实现信号的发射或接收。
其中，第一导电层101、第二导电层102和导电连接部113位于导电边框112围设的区域中，且第一导电层101、第二导电层102、导电连接部113和所述导电边框112的第一部分(也即第一导电边框111)围设成第一腔体100，其中，所述第一导电层101和所述第一导电边框111间隔设置，以形成第一腔体100的第一缝隙104。
需要说明的是，第一导电层101和第二导电层102，可以是电子设备内部的任意间隔设置的金属层，第一导电层101不限于上述导电后盖(例如金属后盖)或显示模组(例如显示模组的金属层)，第二导电层102也不限于电子设备的接地板。
第一缝隙104可以是由第一导电层101和所述第一导电边框111之间形成的缝隙，也可以是在第一导电层101或第一导电边框111上开设缝隙形成，从而形成具有缝隙104的第一腔体，这些均属于本申请的保护范围。
本申请实施例对第一腔体的结构不做限制，其中，围设成该第一腔体的第一导电层101和第二导电层102分别有至少一个相对的部分通过导电连接部113连接。
在本申请一些实施例中，第一腔体可以是中空结构。
在本申请的另一些实施例中，第一腔体中还填充有介质，该介质采用绝缘材料，例如树脂、多氯联苯(Polychlorinated biphenyls，PCBs)。
第一天线单元001例如还包括：辐射体，以及馈电点或馈电枝节，接地点或接地枝节等，或者还可以包括匹配电路，馈电点或馈电枝节或匹配电路连接第一馈电系统14，为该辐射体馈电。
上述第一天线单元001设置于电子设备01中，可以和电子设备01结合。
在一些实施例中，如图3中的(a)、(b)所示，可以将金属后盖12作为第一天线单元001的第一导电层101，金属后盖12和第一导电边框111的表面上例如开设有第一缝隙104，该结构可以获得较好的天线空间并激励出丰富的天线模式。
然而，这种开槽方式对电子设备01的导电边框和金属后盖12产生分割，影响金属后盖12和导电边框的完整性。
在本申请另一些实施例中，如图4、图4b所示，其中，图4示出了电子设备内部的导电层结构，图4b示出了第一天线单元001与电子设备结合的示意图，其中，图4b所示电子设备的金属后盖12采用金属材质。其中，可以将金属后盖12的至少一部分作为图4所示的第一导电层101，或者说第一导电层101包括金属后盖12的至少一部分，应可理解，第一导电层101还可以包括其他的金属层。
由此，可以将金属后盖复用于第一天线单元001，无需另外设置其他的金属部件，可降低天线的制造成本，更节省空间。
在本申请另一些实施例中，如图4e所示，显示模组10朝向承载板的一侧设有金属层，可以将图4e所示的显示模组10上的金属层的至少一部分作为图4所示的第一导电层101，或者说第一导电层101包括显示模组10上的金属层的至少一部分，应可理解，第一导电层101还可以包括其他的金属层。
由此，可以将显示模组的导电层复用于第一天线单元001，无需另外设置其他的金属部件，可降低天线的制造成本，更节省空间。
电子设备01还包括：接地板13。在一些实施例中，所述第二导电层102与所述接地板13电连接或耦合连接，所述第一天线单元001通过所述第二导电层102接地。
在另一些实施例中，所述接地板13形成所述第二导电层102。其中，接地板13的至少一部分可以作为第一天线单元001的第二导电层102。其中，在本申请一些实施例中，接地板13可以是设置在如图1所示的电子设备01的承载板110上的金属结构，在本申请另一些实施例中，接地板13可以是设置在如图1所示的承载板110上的PCB，例如PCB接地板。PCB接地板具体地可以是PCB上的覆铜层。
PCB上的覆铜层形成第二导电层102，或者说第二导电层102包括PCB的覆铜层的一部分，应可理解，第二导电层102还可以包括其他的金属层或接地层。
如图4b所示的立体示意图，接地板13位于金属后盖12的正下方，并且在电子设备的厚度方向上，接地板13与金属后盖12间隔设置，例如，接地板13在XY面平行于金属后盖12设置。
如图4e所示的立体示意图，接地板13位于显示模组10的正上方，并且在电子设备的厚度方向上，接地板13与显示模组10间隔设置，例如，接地板13在XY面平行于显示模组10设置。
由此，可以将接地板13复用于第一天线单元001，无需另外设置其他的金属部件，可降低天线的制造成本，更节省空间。
如图4所示，第一馈电系统14包括：第一馈电单元141和第一接地单元142，在本申请一些实施例中，第一馈电单元141与第一导电层101电连接，第一接地单元142与接地板13电连接，通过第一馈电单元141向第一导电层101馈电。
在本申请另一些实施例中，第一馈电单元141与第一导电层101耦合，第一馈电单元141向第一导电层101耦合馈电。
如图4b、图4e所示，电子设备01还包括：导电边框112(例如包括第一导电边框111)。
其中，如图1所示，导电边框112绕所述承载板110一周设置，且所述导电边框112在所述承载板110上的投影位于所述承载板110边沿。
导电连接部113位于导电边框112围设的区域中，例如导电连接部113相对于第一导电边框111设置，又例如，导电连接部113位于第一导电边框111内部。如图4b所示，所述导电连接部113用于连接所述金属后盖12和所述接地板13，所述导电连接部113、所述第一导电边框111、所述金属后盖12和所述接地板13围设成所述第一腔体。其中，所述金属后盖12和所述第一导电边框111间隔设置并围设成第一腔体的第一缝隙104。或者如图4e所示，所述导电连接部113用于连接所述显示模组10(例如，显示模组10上设置的导电层)和所述接地板13，所述导电连接部113、所述第一导电边框111、所述显示模组10和所述接地板13围设成所述第一腔体。其中，所述显示模组10和所述第一导电边框111间隔设置并围设成第一缝隙104。
由此，可以将导电边框112的一部分复用于第一天线单元001，无需另外设置其他的金属部件，可降低天线的制造成本，更节省空间。
在图4b所示实施例中，所述导电连接部113在XY平面上的投影例如位于所述金属后盖12在XY面上的投影范围内。在一些实施例中，所述导电连接部113在接地板13上的投影位于所述金属后盖12在所述接地板13上的投影范围内。在一些具体的实施例中，导电连接部113与金属后盖12的边缘平齐。
在图4e所示实施例中，所述导电连接部113在XY平面上的投影例如位于所述显示模组10在XY面上的投影范围内。在一些实施例中，所述导电连接部113在接地板13上的投影位于所述显示模组10在所述接地板13上的投影范围内。在一些具体的实施例中，导电连接部113与显示模组10的边缘平齐。
导电连接部113位于导电边框112围设的区域内，且导电连接部113的至少一个侧面上有开口，导电边框112的一部分，例如第一导电边框111，位于该导电连接部113的开口处。例如，图4f示出的细实线为导电连接部113在XY面的投影，而该导电连接部113的开口为粗实线处，该粗实线为位于该开口的第一导电边框111在XY面的投影。
需要说明的是，在一些实施例中，导电连接部113与金属后盖12或显示模组10的边缘平齐，金属后盖12或显示模组10与第一导电边框111在XY平面上的投影没有间隙时，第一导电边框111与导电连接部113在XY面的投影相交，此时，该细实线与该粗实线相交。
在另一些实施例中，金属后盖12或显示模组10与第一导电边框111在XY平面上的投影有间隙时，或者导电连接部113不与金属后盖12或显示模组10的边缘平齐， 例如导电连接部113设置于金属后盖12或显示模组10的边缘以内时，第一导电边框111与导电连接部113在XY面的投影有间隙，此时，该细实线与该粗实线不相交。这些均属于本申请的保护范围。
其中，图4b中的接地板13、所述第一导电边框111、金属后盖12和所述导电连接部113共同围设成所述第一腔体。且所述第一导电边框111和金属后盖12之间设有该第一缝隙104，例如，第一导电边框111和金属后盖12之间具有一定间隔而相对设置，以形成该第一缝隙104，并通过在第一缝隙104中填充绝缘材料以连接第一导电边框111和金属后盖12。
同样的，图4e中的接地板13、所述第一导电边框111、显示模组10和所述导电连接部113共同围设成所述第一腔体。且所述第一导电边框111和显示模组之间设有该第一缝隙104，例如，第一导电边框111和显示模组10之间具有一定间隔而相对设置，以形成该第一缝隙104，并通过在第一缝隙104中填充绝缘材料以连接第一导电边框111和显示模组10。
在一些实施例中，第一缝隙104可以在电子设备的长度方向延伸，例如在图4b和图4e中所示的Y轴方向延伸。
本申请实施例提供的电子设备，将接地板13与金属板(例如，金属后盖12或显示模组10)层叠设置，并通过导电连接部113连接接地板和金属板，金属板和导电边框形成第一缝隙，从而使得接地板、金属板、导电连接部113以及导电边框共同形成具有第一缝隙的第一腔体，该第一腔体除了第一缝隙104处之外可以为封闭的腔体，也可以为非封闭的腔体，下文将对此进行更详细的介绍。通过在导电边框和金属后盖或显示模组之间设置第一缝隙，使得第一天线单元可以通过该第一缝隙辐射或接收电磁波，从而无需在金属后盖12表面开槽，提高了电子设备表面的完整性。
需要说明的是，本申请对第一缝隙104的长度不做限制，可以根据电子设备的外观设计(Industrlal Design，ID)调整缝隙的长度。
在一些实施例中，第一缝隙104由绝缘材料填充；在另一些实施例中，第一缝隙104一部分由绝缘材料填充，一部分由金属部分连接，其中，第一缝隙104由绝缘材料填充的部分可以用于辐射或接收信号。
本申请实施例对该导电连接部不做限制，在本申请一些实施中，如图4b、图4e、图4f所示，导电连接部113采用导电墙(Conductive wall)结构。
其中，该导电墙结构可以是连续的金属片，例如弯折的金属片，或者非连续的金属片，例如几个金属片成角度组合。如图4b所示，片状的导电墙结构设置在金属后盖12与接地板13之间，一端与金属后盖12连接，另一端与接地板13连接。或者如图4e所示，片状的导电墙结构设置在接地板13与显示模组10之间，一端与显示模组10连接，另一端与接地板13连接。
在本申请另一些实施例中，如图4g、图10所示，导电连接部113包括多段导电连接部203，或多个点连接结构203。该多段连接结构203或该多个点连接结构203可以是设置在不同位置处的金属片或金属弹片，例如分开设置的金属片或分开设置的金属弹片。
导电连接部203中的每一段导电连接部或每个点连接结构用来连接接地板13与金 属板(未示出)。多段连接结构203中的一段或多个点连接结构203中的一个可以为金属片或金属弹片。
本申请中图10所提供的实施例中，将接地板13与第一导电层(例如，金属后盖12或显示模组10)层叠设置，并通过多段连接结构连接接地板和第一导电层，再与导电边框共同形成具有第一缝隙104的第一腔体，该第一腔体除了第一缝隙104处之外还可以是非封闭的腔体。通过在导电边框和金属后盖之间设置第一缝隙，使得第一天线单元可以通过该第一缝隙辐射或接收电磁波，从而无需在金属后盖12表面开槽，提高了电子设备表面的完整性。
本申请实施例对该导电连接部的形状不做限制，如图4f所示，该导电连接部113和第一导电边框111在接地板上投影组成一个规则或不规则的图形，其中，粗实线部分为第一导电边框111的投影，细实线部分为导电连接部113的投影，应可理解，表示导电连接部113的细实线部分与表示第一导电边框111的粗实线部分可以如前所述的相交或具有间隙，此处不再赘述。表示导电连接部113的细实线部分也可以替换为细虚线，如图4g所示，表示导电连接部113具有多段非连续的连接结构113。
其中，参见图4f中的(a)、(b)、(c)、(d)、(e)、(f)、(g)，导电连接部113可以基本垂直于接地板设置，该导电连接部113在所述承载板上的投影可以是曲线、直线或折线中的一种或任意几种的组合。当然，在其他的实施例中，导电连接部113和承载板之间的夹角也可以大于或小于90°，该导电连接部113在所述承载板上的投影可以具有一定宽度。
需要说明的是，这里的曲线、直线或折线等各种线，表示具有一定厚度的立体结构的投影延伸方向，而不应理解为其投影的厚度为线的厚度。
本申请实施例对该多段连接结构203和多个点连接结构203之间的位置关系不做限制，其中，如图4g中的(a)、(b)、(c)、(d)、(e)、(f)、(g)、图10、图24所示，该多段连接结构203在所述承载板上的投影可以是虚线。可以围设成规则或不规则的图形。
其中，相邻多段连接结构或相邻点连接结构之间的距离小于或等于所述第一天线001中心频率对应波长的二分之一。其中，相邻多段连接结构之间的距离或相邻点连接结构之间的距离，可以是其分别与第一导电层或第二导电层(例如接地板13、金属后盖12、或显示模组10)的连接处之间的最小直线距离，或最小路径距离。
在本申请一些实施例中，如图5所示，通过金属后盖12、接地板13、第一导电边框111以及C型导电连接部113共同形成的第一天线单元001设置在电子设备(背视)右侧中间位置处，例如，作为第一天线单元001的第一导电边框111不包括上下边框，C型导电连接部113实现金属后盖12和接地板13的连接，直条形的导电边框和金属后盖12之间具有绝缘的第一缝隙。
在本申请的另一些实施例中，如图16所示，通过金属后盖12、接地板13、第一导电边框111以及L型导电连接部113共同形成的第一天线单元001设置在电子设备(背视)的右上区域，L型导电连接部113实现金属后盖12和接地板13的连接，右上角的L型导电边框和金属后盖12之间具有第一缝隙。
本申请实施例对所述第一导电层(例如，金属后盖12或显示模组10)与所述导 电边框之间的第一缝隙结构不做限制。
在本申请一些实施例中，所述金属边框的高度(电子设备的厚度方向上)小于所述第一导电层和所述接地板的高度差；其中，所述第一导电层和所述导电边框之间设有所述第一缝隙，包括：
所述第一导电层和所述接地板在所述金属边框所在平面上的第一间隙作为所述第一缝隙。该第一缝隙例如位于图4a所示的X-Z平面。
或，所述第一导电层与导电边框在接地板所在平面上的第二间隙作为所述第一缝隙。该第一缝隙例如位于图4a所示的X-Y平面。
或，上述第一间隙和第二间隙共同组成所述第一缝隙。
为了保证电子设备外观设计(Industrlal Design，ID)的完整性，所述金属板与所述导电边框之间的第一缝隙中例如填充有绝缘材料。
本申请实施例对该绝缘材料的具体材质不做限制，在本申请一些实施例中，所述绝缘材料例如为聚碳酸酯和丙烯腈-丁二烯-苯乙烯共聚物和混合物PC/ABS材料。
在本申请一些实施例中，该第一天线单元的尺寸及相关参数设置如下所示：
其中，如图4a所示，接地板13的尺寸为L1*L2，其中L1为78mm，L2为158mm。
如图4b、图4c、图4d所示，金属后盖12的厚度L3为1mm，金属后盖12距离第一导电边框111间隙宽度(金属后盖12和第一导电边框111在XY面上的投影之间的间隙宽度)L4为2mm，间隙中例如填充有绝缘材料。金属后盖12内表面距离第一导电边框111的在电子设备01厚度方向上的高度差L5为1.3mm，第一导电边框111的高度L6为2mm，宽度L7为1mm，第一导电边框111XY平面上的投影例如位于所述显示模组10在XY面上的投影范围内。第一导电边框111下边沿距离显示模组10高度差L8为2.5mm，显示模组10厚度L9为1mm。
示例一：
第一天线单元001设置在电子设备01(背视)右侧中间位置处，且第一天线单元001的上侧、左侧和下侧三面通过导电连接部113实现金属板(未示出)和接地板13的连接，并在电子设备的右侧第一导电边框111和金属板之间具备第一缝隙。
其中，该导电连接部113采用导电墙结构。
如图5所示，第一天线单元的馈电点和接地点可以位于第一天线单元的中部(例如，馈电点位于第一导电层的中部；接地点位于第二导电层的中部)或其他任何位置。第一馈电系统14连接于第一天线单元的馈电点和接地点之间。第一馈电系统14例如包括：第一馈电单元和第一接地单元，在本申请一些实施例中，第一馈电单元与第一导电层(例如，金属后盖12或显示模组10)的馈电点电连接，第一接地单元与第二导电层(例如，接地板13)的接地点电连接，可以通过第一馈电单元向第一导电层馈电。
第一馈电单元可采用耦合馈电。此时电子设备四周导电边框112完全接地不参与辐射。
图6为图5中第一天线单元的S11参数分布图。图7为图5中第一天线单元的天线辐射效率示意图。图8为图5中第一天线单元的电流和电场分布情况示意图。图9为图5中第一天线单元的辐射方向仿真图。
如图6中的曲线a所示，第一天线单元在①、②两个频点发生谐振。
其中，谐振①可以由第一天线单元的二分之一波长模式产生，谐振②可以由第一天线单元的一倍波长模式产生。
需要说明的是，谐振模式是二分之一波长模式是指第一天线单元在二分之一波长处发生谐振，谐振模式是一倍波长模式是指第一天线单元在一倍波长处发生谐振。
第一天线单元的S11参数分布图如图6中的曲线a所示。如图6中的曲线a所示，第一天线单元在发生谐振时的S11参数较小，天线回波损耗较小。其中，第一天线单元的天线辐射效率可以参考图7中的曲线2。如图7中的曲线2所示，第一天线单元在发生谐振时，天线的辐射效率较大。
另外，天线系统效率可以参考图7中的曲线1。
图8中的(a)示出了该第一天线单元在3.87GHz发生谐振①时的电流分布，图8中的(c)示出了该第一天线单元在3.87GHz发生谐振①时的电场分布。
如图8中的(a)和(c)所示，第一天线单元的电流从第一缝隙的中间位置流向第一缝隙的两端，第一缝隙的两端电流最强，第一缝隙的中间位置电场最强。谐振①的信号可以由第一天线单元的二分之一波长模式辐射。
图8中的(b)示出了该第一天线单元在7GHz发生谐振②时的电流分布，图8中的(d)示出了该第一天线单元在7GHz发生谐振②时的电场分布。
如图8中的(b)和(d)所示，第一天线单元的第一缝隙上有2个电流强点，且第一缝隙的两端和中间位置是电场强点。谐振②的信号可以由第一天线单元的一倍波长模式辐射。
由此，该第一天线单元在3.87GHz发生的谐振①是第一天线单元的二分之一波长模式，第一天线单元在7GHz发生的谐振②是第一天线单元的一倍波长模式。
其中，第一天线单元的辐射方向仿真图如图9中的(a)和图9中的(b)所示。如图9中的(a)所示和图9中的(b)所示，其中，图9中的D为箭头所指的方向的方向性系数，其中，箭头所指的方向的方向性系数最大，作为第一天线单元的主辐射方向。第一天线单元在发生谐振时，主辐射方向指向左侧。
示例二：
在本申请其他的实施例中，导电墙结构往往不能完全实现，一般采用多个点连接结构代替，为保证上述第一天线单元模式的激励，相邻点连接结构之间的距离不能超过第一天线001的中心频率对应的波长的二分之一，其中，相邻点连接结构之间的距离可以是其分别与第一导电层或第二导电层(例如接地板13、金属后盖12、或显示模组10)的连接处之间的最小直线距离，或最小路径。导电连接部包括多个点连接结构，点连接结构一端与接地板13连接，另一端与金属后盖12连接，点连接结构例如为金属弹片。
如图10中的(a)所示，第一天线单元和示例一中第一天线单元相同，导电连接部采用导电墙结构；如图10中的(b)所示，导电连接部采用5个点连接结构；如图10中的(c)所示，导电连接部采用3个点连接结构。
图11和图12示出了第一天线单元采用导电墙结构、5个点连接结构、3个点连接结构下的性能对比。
其中，图11为本申请实施例提供的另一种第一天线单元的S11参数分布图。图12为本申请实施例提供的另一种第一天线单元的天线辐射效率示意图。
图10中的(a)所示的第一天线单元的S11参数分布图如图11中的曲线a所示。图10中的(b)所示的第一天线单元的S11参数分布图如图11中的曲线b所示。图10中的(c)所示的第一天线单元的S11参数分布图如图11中的曲线c所示。
对比图11中的曲线a、曲线b和曲线c可知，将导电连接部由导电墙变为点连接结构后，由于腔体的泄露，S11曲线上出现一些波纹，但谐振频点基本不变，天线辐射模式基本得到了保持，另外相比导电墙结构，点连接结构的谐振频率降低。
图10中的(a)所示的第一天线单元的辐射效率如图11中的曲线1-1所示。图10中的(b)所示的第一天线单元的辐射效率如图11中的曲线2-1所示。图10中的(c)所示的第一天线单元的辐射效率如图11中的曲线3-1所示。
另外图10中的(a)所示的第一天线单元的系统效率如图11中的曲线1所示。图10中的(b)所示的第一天线单元的系统效率如图11中的曲线2所示。图10中的(c)所示的第一天线单元的系统效率如图11中的曲线3所示。
对比图11中的曲线1、曲线2和曲线3可知，以及对比图11中的曲线1-1、曲线2-1和曲线3-1可知，采用点连接后，由于腔体的泄露，第一天线单元的辐射效率和系统效率曲线上出现一些波纹，但天线辐射模式基本得到了保持。
示例三：
调整第一天线单元腔体的尺寸时，可以改变天线谐振频率。
如图13中的(a)所示，第一天线单元在X方向的尺寸为d1，如图13中的(b)所示，第一天线单元在X方向的尺寸为d2。其中，d1例如为16mm，d2例如为10mm。
图14和图15示出了第一天线单元在X方向的尺寸为d1和d2时的性能对比。
其中，图14为图13中第一天线单元的S11参数分布图。图15为图13中第一天线单元的天线辐射效率示意图。
图13中的(a)所示的第一天线单元的S11参数分布图如图14中的曲线a所示。图13中的(b)所示的第一天线单元的S11参数分布图如图14中的曲线b所示。
对比图13中的曲线a、曲线b可知，当X方向导电墙宽度缩小时，第一天线单元的谐振频率升高。
图13中的(a)所示的第一天线单元的辐射效率如图15中的曲线1-1所示。图10中的(b)所示的第一天线单元的辐射效率如图15中的曲线2-1所示。
另外图13中的(a)所示的第一天线单元的系统效率如图15中的曲线1所示。图13中的(b)所示的第一天线单元的系统效率如图15中的曲线2所示。
对比图15中的曲线1、曲线2可知，以及对比图15中的曲线1-1、曲线2-15可知，当X方向导电墙宽度缩小时，第一天线单元的效率变化不大。
示例四：
在示例一的基础上，可以将第一天线单元的导电墙结构由上、左、下三个侧边连接，改两个侧边连接，例如为左、下两个侧边连接，上方和右侧均开放，如图16所示。
其中，图17为图16中第一天线单元的S11参数分布图。图18为图16中第一天线单元的天线辐射效率示意图。图19为图16中第一天线单元的电流和电场分布情况 示意图。图20为图16中第一天线单元的辐射方向仿真图。
如图17中的曲线a所示，第一天线单元在①、②两个频点发生谐振，根据频点由小到大，谐振模式分别为二分之一波长模式和四分之三波长模式。
需要说明的是，谐振模式是二分之一波长模式是指第一天线单元在二分之一波长处发生谐振，谐振模式是四分之三波长模式是指第一天线单元在四分之三波长处发生谐振。
第一天线单元的S11参数分布图如图17中的曲线a所示。参考图17中的曲线a，第一天线单元在发生谐振时的S11参数较小，天线回波损耗较小，则天线的辐射效率较大。
其中，第一天线单元的天线辐射效率可以参考图18中的曲线2。如图18中的曲线2所示，第一天线单元在发生谐振时，天线的辐射效率较大。
另外，天线系统效率可以参考图18中的曲线1。
图19中的(a)示出了该第一天线单元在3.87GHz发生谐振①时的电流分布，图19中的(c)示出了该第一天线单元在3.87GHz发生谐振①时的电场分布。
如图19中的(a)和(c)所示，第一天线单元的电流从第一缝隙中间流向第一缝隙的两端，第一缝隙的中间位置电场最强。谐振①的信号可以由第一天线单元的二分之一波长模式辐射。
图19中的(b)示出了该第一天线单元在4.89GHz发生谐振②时的电流分布，图19中的(d)示出了该第一天线单元在4.89GHz发生谐振②时的电场分布。
如图19中的(b)和(d)所示，第一天线单元的电流从第一缝隙中间流向第一缝隙的两端，第一缝隙一端是电场强点。谐振②的信号可以由第一天线单元的四分之三波长模式辐射。
由此，该第一天线单元在3.87GHz发生的谐振①是第一天线单元的二分之一波长模式，第一天线单元在4.89GHz发生的谐振②是第一天线单元的四分之三波长模式。
图20中的(a)示出了第一天线单元在3.87GHz发生谐振①时的辐射方向图，图20中的(b)示出了第一天线单元在在4.89GHz发生谐振②时的辐射方向图，如图20所示，第一天线单元在3.87GHz时主辐射方向向左，第一天线单元在4.89GHz时主辐射方向向下。
在本申请另一些实施例中，电子设备01还包括：第二天线单元002。其中，第二天线单元002可以是由导电边框112的一部分组成。
其中，第二天线单元002可以利用导电的导电边框112来实现信号的发射或接收。也可以利用设置于非导电的导电边框112的内侧的导电辐射体或者嵌设于非导电的导电边框112内部的导电辐射体来实现信号的发射或接收。
在一些实施例中，第一天线单元001和第二天线单元002可以工作在不同频段，作为双天线使用。
此时，可以分别在第一天线单元001和第二天线单元002的馈电端分别设置滤波器件，以滤除非工作频段的信号，避免第一天线单元001和第二天线单元002同频，提高第一天线单元001和第二天线单元002之间的隔离度。
在本申请另一些实施例中，第一天线单元001和第二天线单元002可以工作在相 同的频段，第一天线单元001可以和第二天线单元002耦合，第二天线单元002可以作为第一天线单元的寄生辐射体，此时，第一天线单元001和第二天线单元002可以作为一个天线。
本示例以第一天线单元001和第二天线单元002工作在不同频段的情况为例进行说明。
本申请一些实施例中，如图21、图21a所示，该第二天线单元包括：第二接地单元152、第一辐射体21和第二馈电单元151。
其中，该第二接地单元152与该导电边框112电连接。
该导电边框112上还设有第二缝隙121，该第二接地单元152与该第二缝隙121之间的导电边框形成该第一辐射体21，该第二馈电单元151与该第一辐射体21的馈电端1511电连接。
由此，在电子设备上可以设置多个天线，第一天线单元和第二天线单元可以同时工作，增强信号处理的可靠性、信号传输范围和吞吐量，改善通信质量。
接着参考图21，该第一辐射体21位于该导电连接部113的开口处，例如，第一辐射体21位于图4c所示的粗实线处。
由此，使得第二天线单元可以复用于第一天线单元，可以展宽该第一天线单元的带宽。
示例五：
如图21b、图21c、图21d，电子设备01包括：如示例一所示的第一天线单元001，以及第二天线单元002。图21b为电子设备的背视图，第一天线单元001为示例一中的第一天线单元，其馈电和接地方式不再赘述。
如图21b、图21c、图21d所示，第二天线单元002包括：第一辐射体21，以及第二辐射体22，第一辐射体21和第二辐射体22采用分布式馈电。其中，第一辐射体21和第二辐射体22中的至少一个辐射体的一部分作为第一天线单元001的寄生辐射体或作为其一部分复用，例如，第一辐射体21和第二辐射体22中的至少一个辐射体的一部分位于图4f或图4g所示的粗实线处。
在一个实施例中，第二天线单元002设置在第一天线单元001右侧第一缝隙处，这两种天线可以共用辐射体，例如第二天线单元002的第一辐射体21和第二辐射体22，可以复用第一天线单元001的导电边框部分。
所述电子设备还包括：第二馈电系统15。所述第二馈电系统15用于向第一辐射体21和第二辐射体22馈电。
第二馈电系统15例如包括：第二馈电单元151、第二接地单元152和第三接地单元153。
参见图21和图21a，所述导电边框112上设有第二缝隙121，所述第二接地单元152与所述第二缝隙121之间的导电边框112形成第一辐射体21。
所述导电边框112上还设有第三缝隙122，所述第二缝隙121与所述第三缝隙122之间的导电边框112形成第二辐射体22。
所述第二馈电单元151与所述第二辐射体22的馈电端1512耦合，向第二辐射体22耦合馈电。且所述第三接地单元153与所述第二辐射体22电连接。
本申请的另一些实施例中，该第二辐射体与该第一辐射体耦合。由此，第二辐射体可以作为第一辐射体的寄生辐射体，可降低天线的制造成本。
所述第一辐射体21和所述第二辐射体22中的至少一个位于图4f或图4g所示的粗实线处。由此，使得第一天线单元可以耦合第二天线单元，可以展宽第一天线单元的带宽。
第二天线单元还包括：第一容性件C和第一感性件L，第二馈电单元151通过第一容性件C与第一辐射体21电连接，第二馈电单元151通过第一感性件L与第二辐射体22电连接。该第一容性件C和第一感性件L用于对第一天线单元001进行阻抗匹配。
此外，第二天线单元还包括：第一滤波器件和第二滤波器件(图中未示出)，第二馈电单元151例如通过第一滤波器件与第一辐射体21电连接，并通过第二滤波器件与第二辐射体22电连接，该第一滤波器件和第二滤波器件用于滤除第一天线单元工作频段的信号。
由此，第一滤波器件和第二滤波器件可以滤除非工作频段的信号，提高第一天线单元001和第二天线单元002的隔离度。
第二馈电系统15的第二接地单元152和第三接地单元153例如连接在PCB上，馈电单元151例如为传输线，传输线将上方的第一辐射体21(例如可以是IFA天线)和第二辐射体22(例如可以是CRLH天线)连接，是一种分布式馈电结构。
图22为图21d中天线单元的S11、S22以及S12参数分布图。图23为图21d中天线单元辐射效率示意图。
图21d中的第二天线单元的反射系数如图22中的S11曲线所示。图21d中的第一天线单元的反射系数如图22中的S22曲线所示。图21d中的第一天线单元和第二天线单元的隔离度如图22中的S21曲线所示。
图21d中的第二天线单元的辐射效率如图23中的曲线1-1所示。图21d中的第一天线单元的辐射效率如图23中的曲线2-1所示。
另外，图21d中的第二天线单元的系统效率如图23中的曲线1所示。图21中的第一天线单元的系统效率如图23中的曲线2所示。
其中，第一天线单元的谐振发生在B3频段(上行1710-1785MHz,下行1805-1880MHz)，第二天线单元的谐振发生在N79频段。
示例六：
如图24所示，与示例四相比，将第一天线单元的导电墙导电连接部用多个点连接结构代替，其他结构不变。
其中，图25为图24中天线单元的S11、S22以及S12参数分布图。图26为图24中天线单元的天线辐射效率示意图。图27为图24中天线单元的电流和电场分布情况示意图。图28为图24中天线单元的辐射方向仿真图。
图24中的第二天线单元的反射系数如图25中的S11曲线所示。图24中的第一天线单元的反射系数如图25中的S22曲线所示。图24中的第一天线单元和第二天线单元的隔离度如图25中的S21曲线所示。
图24中的第二天线单元的辐射效率如图26中的曲线1-1所示。图24中的第一天 线单元的辐射效率如图26中的曲线2-1所示。
另外，图24中的第二天线单元的系统效率如图26中的曲线1所示。图24中的第一天线单元的系统效率如图26中的曲线2所示。
如图25所示，第一天线单元在①、②、③、④四个频点对应的带宽内均发生谐振。其中，谐振①的谐振频率为3.85GHz，谐振②的谐振频率为4.35GHz、谐振③的谐振频率为4.8GHz，谐振④的谐振频率为5.5Ghz。其中，与示例一、示例二相比，第一天线单元001在高频段增加了多个模式，带宽覆盖增加。
图27示出了①、②、③、④四个谐振频率下的电流和电场分布。其中，图27中的(b)、(c)、(d)中圈出的位置为电流强点，图27中的(e)、(f)、(g)、(h)中圈出的位置为电场强点。
图27中的(a)示出了3.85GHz发生谐振①时的电流分布，图27中的(e)示出了3.85GHz发生谐振①时的电场分布。
如图27中的(a)和(e)所示，第一天线单元的电流从第一缝隙中间流向第一缝隙的两端，第一缝隙的中间位置电场最强。
图27中的(b)示出了4.35GHz发生谐振②时的电流分布，图27中的(f)示出了4.35GHz发生谐振②时的电场分布。
如图27中的(b)和(f)所示，电场强点在第二天线单元002上。
图27中的(c)示出了4.8GHz发生谐振③时的电流分布，图27中的(g)示出了4.8GHz发生谐振②时的电场分布。
如图27中的(c)和(g)所示，第一天线单元和第二天线单元处均有电场强点。
图27中的(d)示出了5.5GHz发谐振④时的电流分布，图27中的(h)示出了5.5GHz发生谐振④时的电场分布。
如图27中的(d)和(h)所示，第一天线单元和第二天线单元处均有电场强点。
如图27中的(a)和(e)、图28中的(a)所示，从谐振①的电流分布和电场分布可以看出，第一天线单元的第一缝隙处是电场强点，低谐振主要由第一天线单元辐射。
如图27中的(b)和(f)、(c)和(g)、(d)和(h)，以及图28中的(b)、(c)、(d)所示，从谐振②、③、④的电流分布和电场分布可以看出，第二天线单元处也有电场强点，说明较高的几个谐振，均耦合了边框辐射体，第二天线单元参与了辐射，且方向图相比图28中的(a)变化较大，由于第一天线单元和第二天线单元没有同频，第二天线单元复用于两个天线设计是可行的。
需要说明的是，本申请实施例提供的天线单元，不限于上述设置在边框11上的第二天线单元002和设置在金属板上的第一天线单元001的结合。第一天线单元001还可以是设置在中框位置，并采用激光直接成型技术(Laser Direct structuring，LDS)成型在支架接地结构上。因此，本申请提供的天线单元，也可以是支架天线与设置在金属板上的第一天线单元001的结合，还可以是支架天线和设置在边框11上的第二天线单元002的结合。
如图29所示，该电子设备01还可以包括通讯模块010。
示例性的，通讯模块010包括：上述实施例中的第一天线单元001、第二天线单 元002，移动通信模块，无线通信模块、调制解调处理器以及基带处理器等。
第一天线单元001、第二天线单元002可以用于发射和接收电磁波信号。智能电器中的每个天线可用于覆盖单个或多个通信频带。
移动通信模块可以提供应用在智能电器上的包括第二代手机通信技术规格(2-Generation wireless telephone technology，2G)、第三代移动通信技术(3rd-Generation，3G)、第四代移动通信技术(4th generation mobile communication technology，4G)、第五代移动通信技术(5th generation wireless systems，5G)等无线通信的解决方案。移动通信模块可以包括至少一个滤波器，开关，功率放大器和低噪声放大器(low noise amplifier，LNA)等。移动通信模块可以由天线接收电磁波，并对接收的电磁波进行滤波，放大等处理，传送至调制解调处理器进行解调。移动通信模块还可以对经调制解调处理器调制后的信号放大，并将该放大的信号经天线转为电磁波后辐射出去。在一些实施例中，移动通信模块的至少部分功能模块可以被设置于处理器001中。在一些实施例中，移动通信模块的至少部分功能模块可以与处理器001的至少部分模块被设置在同一个器件中。
调制解调处理器可以包括调制器和解调器。其中，调制器用于将待发送的低频基带信号调制成中高频信号。解调器用于将接收的电磁波信号解调为低频基带信号。随后解调器将解调得到的低频基带信号传送至基带处理器处理。低频基带信号经基带处理器处理后，被传递给应用处理器。应用处理器通过音频设备(不限于扬声器，麦克风等)输出声音信号，或通过显示屏009显示图像或视频。在一些实施例中，调制解调处理器可以是独立的器件。在另一些实施例中，调制解调处理器可以独立于处理器001，与移动通信模块或其他功能模块设置在同一个器件中。
无线通信模块可以提供应用在智能电器上的包括无线局域网(wireless local area networks，WLAN)(如无线保真(wireless fidelity，Wi-Fi)网络)，蓝牙(bluetooth，BT)，全球导航卫星系统(global navigation satellite system，GNSS)，调频(frequency modulation，FM)，近距离无线通信技术(near field communication，NFC)，红外技术(infrared，IR)等无线通信的解决方案。无线通信模块可以集成至少一个通信处理模块014。无线通信模块经由天线接收电磁波，对电磁波信号进行调频以及滤波处理，将处理后的信号发送到处理器001。无线通信模块还可以从处理器001接收待发送的信号，对其进行调频，放大，经天线转为电磁波辐射出去。
在一些实施例中，智能电器的一个天线和移动通信模块耦合，另一个天线和无线通信模块耦合，使得智能电器可以通过无线通信技术与网络以及其他设备通信。该无线通信技术可以包括全球移动通讯系统(global system for mobile communications，GSM)，通用分组无线服务(general packet radio service，GPRS)，码分多址接入(code division multiple access，CDMA)，宽带码分多址(wideband code division multiple access，WCDMA)，时分码分多址(time-division code division multiple access，TD-SCDMA)，长期演进(long term evolution，LTE)，BT，GNSS，WLAN，NFC，FM，和/或IR技术等。该GNSS可以包括全球卫星定位系统(global positioning system，GPS)，全球导航卫星系统(global navigation satellite system，GLONASS)，北斗卫星导航系统(beidou navigation satellite system，BDS)，准天顶卫星系统(quasi-zenith satellite system，QZSS) 和/或星基增强系统(satellite based augmentation systems，SBAS)。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何在本申请揭露的技术范围内的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种电子设备，包括导电边框和第一天线单元，所述导电边框围绕所述电子设备的外围设置，其特征在于，所述第一天线单元包括：
    第一导电层和第二导电层，所述第一导电层和所述第二导电层在所述电子设备的厚度方向上间隔设置；
    导电连接部，所述导电连接部用于连接所述第一导电层和所述第二导电层；以及
    第一导电边框，所述第一导电边框为所述导电边框的一部分，
    其中，所述导电连接部、所述第一导电边框、所述第一导电层和所述第二导电层围设成第一腔体，所述第一导电层和所述第一导电边框间隔设置并形成所述第一腔体的第一缝隙。
  2. 根据权利要求1所述的电子设备，其特征在于，所述电子设备还包括第一馈电单元，所述第一馈电单元通过所述第一导电层为所述第一天线单元馈电，其中，所述第一馈电单元与所述第一导电层电连接或耦合连接。
  3. 根据权利要求1-2任一项所述的电子设备，其特征在于，所述电子设备还包括接地板，所述第二导电层与所述接地板电连接或耦合连接，所述第一天线单元通过所述第二导电层接地。
  4. 根据权利要求1-2任一项所述的电子设备，其特征在于，所述电子设备还包括接地板，所述接地板形成所述第二导电层。
  5. 根据权利要求4所述的电子设备，其特征在于，所述电子设备还包括金属后盖，所述金属后盖形成所述第一导电层。
  6. 根据权利要求4所述的电子设备，其特征在于，所述电子设备还包括显示模组，所述显示模组朝向所述接地板的一侧设有所述第一导电层。
  7. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述导电连接部采用导电墙结构，所述导电墙的两侧分别连接所述第一导电层和所述第二导电层。
  8. 根据权利要求1-6任一项所述的电子设备，其特征在于，所述导电连接部包括多个点连接结构，相邻的点连接结构之间的距离小于或等于所述第一天线工作频段的中心频率对应的波长的二分之一。
  9. 根据权利要求8所述的电子设备，其特征在于，所述点连接结构为金属弹片，所述金属弹片的两端分别连接所述第一导电层和所述第二导电层。
  10. 根据权利要求1-9任一项所述的电子设备，其特征在于，所述导电连接部在所述第二导电层上的投影位于所述第一导电层在所述第二导电层上的投影范围内。
  11. 根据权利要求10所述的电子设备，其特征在于，所述导电连接部在所述第二导电层上的投影为曲线、折线或直线中的一种或几种的组合。
  12. 根据权利要求1-11任一项所述的电子设备，其特征在于，所述第一缝隙中填充有绝缘材料。
  13. 根据权利要求1-12任一项所述的电子设备，其特征在于，所述第一天线单元通过所述第一缝隙辐射或接收电磁波。
  14. 根据权利要求1-13任一项所述的电子设备，其特征在于，所述电子设备还包括：第二天线单元和第二馈电单元，所述第二馈电单元为所述第二天线单元馈电，其中， 所述第二天线单元包括：
    第一接地点，所述第一接地点设于所述导电边框上；
    第一辐射体，其中，所述导电边框上设有第二缝隙，所述第一接地点与所述第二缝隙之间的导电边框形成所述第一辐射体，所述第一接地点用于为所述第二天线单元接地。
  15. 根据权利要求14所述的电子设备，其特征在于，所述第一辐射体的至少一部分由所述第一导电边框形成。
  16. 根据权利要求14或15所述的电子设备，其特征在于，所述电子设备还包括：第一滤波器件，所述第二馈电单元通过所述第一滤波器件与所述第一辐射体电连接或耦合连接。
  17. 根据权利要求14-16任一项所述的电子设备，其特征在于，所述第二天线单元还包括：
    第二辐射体，所述导电边框上设有第二缝隙，所述第二缝隙与所述第一缝隙之间的导电边框形成所述第二辐射体；
    第二接地点，所述第二接地点设于所述第二辐射体上，用于为所述第二天线单元接地。
  18. 根据权利要求17所述的电子设备，其特征在于，所述第一辐射体通过所述第二缝隙与所述第二辐射体耦合。
  19. 根据权利要求17所述的电子设备，其特征在于，所述电子设备还包括：第二滤波器件，所述第二馈电单元通过所述第二滤波器件与所述第二辐射体电连接或耦合连接。
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