WO2022152183A1 - 印刷电路板及其制作方法，以及一种电子通讯设备 - Google Patents

印刷电路板及其制作方法，以及一种电子通讯设备 Download PDF

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Publication number
WO2022152183A1
WO2022152183A1 PCT/CN2022/071672 CN2022071672W WO2022152183A1 WO 2022152183 A1 WO2022152183 A1 WO 2022152183A1 CN 2022071672 W CN2022071672 W CN 2022071672W WO 2022152183 A1 WO2022152183 A1 WO 2022152183A1
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WO
WIPO (PCT)
Prior art keywords
substrate
printed circuit
circuit board
copper foil
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/071672
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English (en)
French (fr)
Inventor
高峰
陶士超
黄明利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to EP22739061.4A priority Critical patent/EP4262326A4/en
Publication of WO2022152183A1 publication Critical patent/WO2022152183A1/zh
Priority to US18/350,812 priority patent/US20230354506A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Definitions

  • the invention relates to the field of veneer engineering, in particular to a printed circuit board and a manufacturing method thereof, and an electronic communication device.
  • Printed circuit board also known as printed circuit board, printed circuit board, commonly used in English abbreviations PCB (Printed Circuit Board) or PWB (Printed Wire Board), is a supporting device for electronic components, in which there are metal conductors as connecting electronic components 's line.
  • the present invention provides a printed circuit board and a manufacturing method thereof, as well as electronic communication equipment, which can further reduce the dielectric loss of the printed circuit board while ensuring cost control.
  • a printed circuit board in a first aspect, includes: a substrate, an adhesive layer, a copper foil and a filler, wherein:
  • the substrate is provided with a cavity, and the cavity penetrates the substrate;
  • Both surfaces of the substrate are covered with the copper foil;
  • the copper foil and the substrate are bonded by the adhesive layer;
  • the outer surface of the copper foil is plated with a conductive metal layer
  • the filler is located in the cavity
  • the substrate is provided with a via hole, and the via hole penetrates the substrate and the adhesive layer;
  • a conductive metal layer is plated on the hole wall of the via hole.
  • the base plate is provided with a cavity, and the cavity can be pressed into the filling body, or the cavity state can be maintained.
  • the dielectric constant Dk and the dielectric loss Df of the printed circuit board made of the substrate can be effectively reduced, thereby improving the radio frequency performance and radio frequency efficiency.
  • the filler can be any material that can reduce the dielectric constant Dk and the dielectric loss Df, Dk ⁇ 2.0, Df ⁇ 0.001. This also improves RF performance and RF efficiency.
  • the size of the cavity or filling body can be adjusted according to the thickness of the substrate. There is a correlation between the dielectric size, the dielectric constant Dk and the dielectric loss Df. Therefore, the substrate can adjust the dielectric constant Dk. And the dielectric loss Df can be adjusted autonomously, which allows a higher degree of design freedom.
  • a lamination process is performed to obtain a copper clad laminate (English: copper-clad laminate, abbreviation: CCL).
  • CCL copper-clad laminate
  • Various printed circuit boards with different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for the printed circuit board, which has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance, quality, manufacture of the printed circuit board The processability, manufacturing level, manufacturing cost, and long-term reliability and stability of the copper clad laminate largely depend on it.
  • the via hole is also called a via hole (English: vertical interconnect access, abbreviation: VIA).
  • VIA vertical interconnect access
  • the hole wall of the via hole is plated with a conductive metal layer, which is used to conduct or connect the conduction in different layers of the circuit board.
  • the copper foil circuit between the patterns, in one example, the via hole can realize the copper foil interconnection of the double-sided copper clad laminate, and the printed circuit board finally formed by using this substrate can integrate more devices, which greatly improves the printed circuit board.
  • the function expandability also effectively improves the high density of device layout and saves more space.
  • the via is not in the area of the cavity.
  • the area without cavities is used to support the entire substrate and meet the mechanical requirements of the printed circuit board.
  • the via holes are opened in the designated area without cavities to ensure that the filling body or the cavity is in a closed environment.
  • the purpose is: to avoid the poor hole shape of the metallized hole or even the broken copper, and to prevent the potion from being poured into the cavity or stomata. At the same time, excessive moisture absorption of the filling body or the cavity is avoided, thereby ensuring the electrical performance stability of the filling body or the cavity.
  • the filler is a material with a plurality of foamed pores.
  • the material with foam pores may be a foam material, or may be other materials capable of reducing the dielectric constant Dk and the dielectric loss Df.
  • the printed circuit board formed by this embodiment can make the dielectric constant Dk and dielectric loss Df lower;
  • the printed circuit board, because of the substrate support, has stronger hardness and mechanical performance, and is less prone to bending and deformation.
  • the filling body is in a closed environment, taking the foam material as the filling body as an example, it can prevent the foam material from absorbing water. Compared with the foam board exposed to the outside, the closed filling body helps to reduce the water absorption rate and the dielectric constant. The influence of Dk and dielectric loss Df ensures stable electrical performance.
  • the volume of the filling body should not be greater than the volume of the cavity into which it is pressed.
  • the tolerance fit between the filler body and the cavity dimensions can take many forms to meet its functional and mechanical requirements as a guideline.
  • the material of the substrate is epoxy resin.
  • the substrate material provided in this embodiment is not limited to this, and may be a common material for making printed circuit boards in the art.
  • the substrate may be epoxy resin material, injection molding material, CEM-3, or may be Hydrocarbon materials, PPO materials, etc.
  • the cost of epoxy resin materials, injection molding materials, and CEM-3 is lower, which is conducive to cost control.
  • the material of the adhesive layer is a prepreg.
  • the adhesive layer can be made of various materials, for example, a prepreg (English: Prepreg, abbreviation: PP) or pure glue (English: bondsheet, abbreviation: BS) and the like.
  • a prepreg English: Prepreg, abbreviation: PP
  • pure glue English: bondsheet, abbreviation: BS
  • the number of the via holes is M, and M is an integer greater than or equal to 1.
  • the number of the via holes may be one, or may be multiple, which can be determined according to actual needs. It is constrained by the via hole standard of the board and will not be repeated here.
  • the number of the cavities is N, and N is an integer greater than or equal to 1.
  • the number of the cavities may be one, or may be multiple, and all the cavities may have various forms, for example, including but not limited to: all of the cavities can be pressed into the filling body, or part of the cavities can be pressed into the filling body , can also be pressed into the filling body of different materials.
  • a method for manufacturing a printed circuit board according to the first aspect including:
  • the grooving process may be punching or milling.
  • the step of adhering the copper foil to the substrate is the plate arrangement, and the matching plate body after the plate arrangement is completed is sandwiched between the steel plates, and sent to a press furnace, heated and pressurized, and then After cooling, the steel plate is dismantled to obtain a composite copper clad laminate (CCL).
  • the process flow is pressing.
  • Drilling is performed on the bonded substrate to form via holes, and the via holes penetrate through the bonded substrate;
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL) or a composite copper clad laminate.
  • CCL copper clad laminate
  • VIA via hole
  • a conductive metal layer is plated on the outer surface of the bonded substrate and the inner wall of the via hole.
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL). Electroplating is performed on the composite copper clad laminate after the via hole is opened. Specifically, copper plating on the outer surface of the copper clad laminate is called surface copper. The purpose is to provide additional shielding protection and noise control for the underlying equipment and signals. , and also helps to improve the heat dissipation capacity of the printed circuit board.
  • the copper plating on the hole wall of the via hole of the CCL is called hole copper, that is, metallized hole (PTH). The purpose is that this kind of metallized hole can realize the interconnection of double-sided printed circuits.
  • PTH metallized hole
  • the double-sided printed circuit board can integrate more electronic devices, which greatly improves the functional expansion of the printed circuit board, effectively improves the high density of device layout, and saves more space.
  • the composite copper clad laminate can be subjected to the next process, that is, the manufacturing process of the printed circuit board.
  • the manufacturing process of the printed circuit board includes: dry film, etching, solder mask, text, molding, testing and other processes, and finally a double-sided printed circuit board is formed. All the processes are in the prior art and will not be repeated here. .
  • the via hole is opened in a designated area of the substrate without a cavity.
  • the area without cavities is used to support the entire substrate to meet the mechanical requirements of the printed circuit board.
  • the via holes are opened in the designated area without cavities to ensure that the filling body or the cavity is in a closed environment.
  • the purpose is: to avoid the poor hole shape of the metallized hole or even the broken copper, and to prevent the potion from being poured into the cavity or stomata. At the same time, excessive moisture absorption of the filling body or the cavity is avoided, thereby ensuring the electrical performance stability of the filling body or the cavity.
  • the filler is a material with a plurality of foamed pores.
  • the material with foam pores may be a foam material, or may be other materials capable of reducing the dielectric constant Dk and the dielectric loss Df.
  • the printed circuit board formed in this embodiment can make the dielectric constant Dk and the dielectric loss Df lower; Dk ⁇ 2.0, Df ⁇ 0.001.
  • the printed circuit board formed by this embodiment has stronger hardness and mechanical performance due to the support of the substrate, and is less prone to bending and deformation.
  • the filling body is in a closed environment, taking the so-called filling body of foam materials as an example, the water absorption of the foam material can be avoided. Compared with the foam board exposed to the outside world, the closed filling body helps to reduce the effect of water absorption. The influence of dielectric constant Dk and dielectric loss Df ensures stable electrical performance.
  • the volume of the filling body should not be greater than the volume of the cavity into which it is pressed.
  • the tolerance fit between the filler body and the cavity dimensions can take many forms to meet its functional and mechanical requirements as a guideline.
  • the material of the substrate is epoxy resin.
  • the substrate material provided in this embodiment is not limited to this, and may be a common material for making printed circuit boards in the art.
  • the substrate may be epoxy resin material, injection molding material, CEM-3, or may be Hydrocarbon materials, PPO materials, etc.
  • the cost of epoxy resin materials, injection molding materials, and CEM-3 is lower, which is conducive to cost control.
  • the material of the adhesive layer is a prepreg.
  • the adhesive layer can be made of various materials, for example, a prepreg (English: Prepreg, abbreviation: PP) or pure glue (English: bondsheet, abbreviation: BS) and the like.
  • a prepreg English: Prepreg, abbreviation: PP
  • pure glue English: bondsheet, abbreviation: BS
  • the number of the via holes is M, and M is an integer greater than or equal to 1.
  • the number of the via holes may be one, or may be multiple, which can be determined according to actual needs. It is constrained by the via hole standard of the board and will not be repeated here.
  • the number of the cavities is N, and N is an integer greater than or equal to 1.
  • the number of the cavities may be one, or may be multiple, and all the cavities may have various forms, for example, including but not limited to: all of the cavities can be pressed into the filling body, or part of the cavities can be pressed into the filling body , can also be pressed into the filling body of different materials.
  • a third aspect provides a printed circuit board, the printed circuit board comprising:
  • Substrates, bonding layers, copper foils including:
  • the base plate is provided with a plug hole, and the plug hole passes through the base plate;
  • the plug hole includes a curable material
  • Both surfaces of the substrate are covered with the copper foil;
  • the copper foil and the substrate are bonded by the adhesive layer;
  • the outer surface of the copper foil is plated with a conductive metal layer
  • the position of the plug hole is provided with a via hole, and the via hole penetrates the substrate and the adhesive layer;
  • the hole wall of the via hole is crossed with a conductive metal layer.
  • the via hole is also called a via hole (English: vertical interconnect access, abbreviation: VIA).
  • VIA vertical interconnect access
  • the hole wall of the via hole is plated with a conductive metal layer, which is used for conducting or connecting different circuit boards.
  • the copper foil circuit between the conductive patterns in the layer, in one example, the via hole can realize the copper foil interconnection of the double-sided copper clad laminate, and the printed circuit board finally formed by using this substrate can integrate more devices, which greatly improves the printing efficiency.
  • the functional expansion of the circuit board also effectively improves the high density of device layout and saves more space.
  • a lamination process is performed to obtain a copper clad laminate (English: copper-clad laminate, abbreviation: CCL).
  • CCL copper-clad laminate
  • Various printed circuit boards with different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for the printed circuit board, which has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance, quality, manufacture of the printed circuit board The processability, manufacturing level, manufacturing cost, and long-term reliability and stability of the copper clad laminate largely depend on it.
  • the substrate is a material with a plurality of foamed pores.
  • the material with foam pores may be a foam material, or may be other materials capable of reducing the dielectric constant Dk and the dielectric loss Df.
  • the printed circuit board formed in this embodiment can make the dielectric constant Dk and the dielectric loss Df lower; Dk ⁇ 2.0, Df ⁇ 0.001.
  • the printed circuit board formed by this embodiment has stronger hardness and mechanical performance due to the support of the curable material, and is less prone to bending and deformation.
  • the curable material is resin ink.
  • the curable material may be a liquid substance, for example, resin ink, etc., or a solid substance, such as epoxy, hydrocarbon, PPO, and the like.
  • the curable material is used to support the entire substrate and meet the mechanical requirements of the printed circuit board.
  • the plug hole penetrates the substrate to ensure that the filling body or cavity is in a closed environment. The purpose of this is to avoid metallized holes.
  • the hole type is poor or even the copper is broken, so as to avoid pouring the potion into the cavity or stomata. At the same time, it also avoids excessive moisture absorption of the filling body or cavity, thereby ensuring the electrical performance stability of the filling body or cavity.
  • the water absorption of foam materials can be avoided.
  • the closed filler helps to reduce the influence of water absorption on the dielectric constant Dk and dielectric loss Df, ensuring stable electrical properties.
  • the material of the adhesive layer is a prepreg.
  • the adhesive layer can be made of various materials, for example, a prepreg (English: Prepreg, abbreviation: PP) or pure glue (English: bondsheet, abbreviation: BS) and the like.
  • a prepreg English: Prepreg, abbreviation: PP
  • pure glue English: bondsheet, abbreviation: BS
  • the number of the plug holes is K, and K is any integer greater than or equal to 1.
  • the number of the plug holes may be one, or may be multiple, which can be determined according to actual needs.
  • the spacing between the plug holes may have various forms, and is based on the standard of the via holes of traditional printed circuit boards. constraints, and will not be repeated here.
  • the number of the via holes is M, where M is any integer greater than or equal to 1, and the number of the via holes is less than or equal to the number of the plug holes.
  • the radius of the plug hole is less than or equal to 0.6 mm; the radius of the plug hole is larger than the radius of the via hole. In one example, the difference between the radius of the plug hole and the radius of the via hole should be greater than or equal to 0.15 mm.
  • the axis of the plug hole and the axis of the via hole are the same straight line. The purpose is to ensure the mechanical stability of the plug hole as a support.
  • a method for manufacturing a printed circuit board based on the third aspect including:
  • Drilling is performed on the substrate to form plug holes, the plug holes penetrate through the substrate;
  • the step of adhering the copper foil to the substrate is the plate arrangement, and the matching plate body after the plate arrangement is completed is sandwiched between the steel plates, and sent to a press furnace, heated and pressurized, and then After cooling, the steel plate is dismantled to obtain a composite copper clad laminate (CCL).
  • the process flow is pressing.
  • Drilling is performed on the plug hole positions of the bonded substrate to form via holes, and the via holes penetrate through the bonded substrate;
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL) or a composite copper clad laminate.
  • CCL copper clad laminate
  • VIA via hole
  • a conductive metal layer is plated on the outer surface of the bonded substrate and the inner wall of the via hole.
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL).
  • Electroplating is performed on the composite copper clad laminate after the via hole is opened.
  • copper plating on the outer surface of the copper clad laminate is called surface copper.
  • the purpose is to provide additional shielding protection and noise control for the underlying equipment and signals. , and also helps to improve the heat dissipation capacity of the printed circuit board.
  • the copper plating on the hole wall of the via hole of the copper clad laminate is called hole copper, that is, metallized hole (PTH).
  • the double-sided printed circuit board can integrate more electronic devices, which greatly improves the functional expansion of the printed circuit board, effectively improves the high density of device layout, and saves more space.
  • the composite copper clad laminate can be subjected to the next process, that is, the manufacturing process of the printed circuit board.
  • the manufacturing process of the printed circuit board includes: dry film, etching, solder mask, text, molding, testing and other processes, and finally a double-sided printed circuit board is formed. All the processes are in the prior art and will not be repeated here. .
  • the substrate is a material with a plurality of foamed pores.
  • the material with foam pores may be a foam material, or may be other materials capable of reducing the dielectric constant Dk and the dielectric loss Df.
  • the printed circuit board formed in this embodiment can make the dielectric constant Dk and the dielectric loss Df lower; Dk ⁇ 2.0, Df ⁇ 0.001.
  • the printed circuit board formed by this embodiment has stronger hardness and mechanical performance due to the support of the curable material, and is less prone to bending and deformation.
  • the curable material is resin ink.
  • the curable material may be a liquid substance, for example, resin ink, etc., or a solid substance, such as epoxy, hydrocarbon, PPO, and the like.
  • the curable material is used to support the entire substrate and meet the mechanical requirements of the printed circuit board.
  • the plug hole penetrates the substrate to ensure that the filling body or cavity is in a closed environment. The purpose of this is to avoid metallized holes. The hole type is poor or even the copper is broken, so as to avoid pouring the potion into the cavity or stomata. At the same time, excessive moisture absorption of the filling body or the cavity is avoided, thereby ensuring the electrical performance stability of the filling body or the cavity.
  • the water absorption of foam materials can be avoided.
  • the closed filler helps to reduce the water absorption rate to the dielectric constant Dk and dielectric loss Df influence, to ensure stable electrical performance.
  • the material of the adhesive layer is a prepreg.
  • the adhesive layer can be made of various materials, for example, a prepreg (English: Prepreg, abbreviation: PP) or pure glue (English: bondsheet, abbreviation: BS) and the like.
  • a prepreg English: Prepreg, abbreviation: PP
  • pure glue English: bondsheet, abbreviation: BS
  • the number of the plug holes is K, and K is any integer greater than or equal to 1.
  • the number of the plug holes may be one, or may be multiple, which can be determined according to actual needs.
  • the spacing between the plug holes may have various forms, and is based on the standard of the via holes of traditional printed circuit boards. constraints, and will not be repeated here.
  • the number of the via holes is M, where M is any integer greater than or equal to 1, and the number of the via holes is less than or equal to the number of the plug holes.
  • the radius of the plug hole is less than or equal to 0.6 mm; the radius of the plug hole is greater than the radius of the via hole.
  • the difference between the radius of the plug hole and the radius of the via hole should be greater than or equal to 0.15mm.
  • the axis of the plug hole and the axis of the via hole are the same straight line. The purpose is to ensure the mechanical stability of the plug hole as a support.
  • a fifth aspect provides a method for manufacturing a printed circuit board based on the third aspect, comprising:
  • the bonded substrate is subjected to a pressing process to obtain a pressed substrate;
  • Drilling is performed at the position of the plug hole of the laminated substrate to form a via hole, and the via hole penetrates the bonded substrate;
  • a conductive metal layer is plated on the outer surface of the bonded substrate and the inner wall of the via hole.
  • a double-sided printed circuit board is obtained by passing the metallized board body through a printed circuit board manufacturing process.
  • the difference between the fifth aspect and the manufacturing method provided in the fourth aspect is that the manufacturing method of the fifth aspect adopts a process of pressing first and then drilling, and this method needs to be performed after the substrate is filled with the curable material.
  • the purpose of the one-time grinding process is to make the surface of the plate body smoother during the drilling process, which is more conducive to the subsequent copper plating process.
  • the manufacturing method of the fifth aspect has the same characteristics as the manufacturing method provided by the fourth aspect, and details are not repeated here.
  • FIG. 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present application
  • FIG. 2 is a schematic flowchart of a method for manufacturing a printed circuit board based on FIG. 1 according to an embodiment of the present application
  • FIG. 3 is a schematic flowchart of another method for manufacturing a printed circuit board based on FIG. 1 according to an embodiment of the present application
  • FIG. 4 is a schematic structural diagram of another printed circuit board provided by an embodiment of the present application.
  • FIG. 5 is a schematic flowchart of a method for manufacturing a printed circuit board based on FIG. 4 according to an embodiment of the present application
  • FIG. 6 is a schematic flowchart of another manufacturing method based on the printed circuit board of FIG. 4 provided by the embodiment of the present application.
  • devices can be divided into devices that provide wireless network services and devices that use wireless network services.
  • the devices that provide wireless network services refer to those devices that make up a wireless communication network, which can be referred to as network equipment or network elements for short.
  • Network equipment is usually owned by operators or infrastructure providers, who are responsible for operation or maintenance.
  • Network devices can be further classified into radio access network (RAN) devices and core network (core network, CN) devices.
  • RAN radio access network
  • core network core network
  • a typical RAN device includes a base station (BS).
  • the dielectric constant Dk and dielectric loss Df of the medium required by the antenna printed circuit board are smaller, and at the same time, it is cost-competitive and has better processability.
  • the antenna printed circuit board uses a special sheet for RF antennas.
  • the dielectric constant Dk and dielectric loss Df are determined by the thickness of the sheet. There are few specifications for the thickness of the dielectric material. For example, the optional specifications are: 0.005 inches, 0.020 inches, 0.030 inches, 0.060 inches, so the dielectric constant Dk and the dielectric loss Df are difficult to reach the desired range, and difficult to further adjust.
  • PTFE resin is currently the resin with the lowest dielectric constant Dk (Dk is about 2.1); materials with a dielectric constant Dk lower than 2.0 need to use foamed dielectrics or cavities to achieve , Dk/Df of air is the smallest among all media, and increasing the ratio of air can effectively reduce Dk/Df. Therefore, foaming with matrix resin with low dielectric constant Dk is an effective way to obtain ultra-low dielectric constant Dk medium. The higher the foaming rate, the higher the air ratio and the lower the Dk/Df.
  • the present invention provides a printed circuit board and a manufacturing method thereof, and an electronic communication device, which can further reduce the dielectric loss of the printed circuit board while ensuring cost control.
  • Some embodiments of the present invention provide a printed circuit board, as shown in Figure 1, the printed circuit board comprising:
  • a printed circuit board is characterized by comprising a substrate 102, an adhesive layer 104, a copper foil 106 and a filler, wherein:
  • the substrate 102 is provided with a cavity (not shown in the figure), and the cavity passes through the substrate 102;
  • Both surfaces of the substrate 102 are covered with the copper foil 106;
  • the copper foil 106 and the substrate 102 are bonded by the adhesive layer 104 to form a bonded substrate, which is a copper clad laminate in one example;
  • the outer surface of the copper clad laminate is plated with a conductive metal layer 103a;
  • the filling body 101 is located in the cavity
  • the substrate 102 is provided with a via hole 105, and the via hole 105 penetrates the substrate 102 and the adhesive layer 104 for connecting the copper foils 106 on both sides of the printed circuit board;
  • a conductive metal layer is plated on the hole wall of the via hole 105 .
  • the substrate 102 in this embodiment may be a material commonly used in the field of manufacturing printed circuit boards, for example, the substrate 102 may be epoxy resin material, injection molding material, or may be a composite board, such as CEM-3, FR-4, etc., or can be hydrocarbon materials, PPO materials, and the like.
  • a groove body may be formed on the base plate 102 through a groove, and the groove body penetrates the base plate 102 . Since the adhesive layer 104 , the copper foil 106 and the copper plating layer are provided above and below the groove body, the groove body forms a closed cavity in the printed circuit board. The portion of the substrate 102 that is not slotted serves as the base structure of the printed circuit board for supporting the printed circuit board.
  • the substrate 102 may have a plurality of cavities, and the size and spacing of the cavities are selected based on requirements and traditional process requirements. , the area of the substrate 102 without the slot is the supporting part of the printed circuit board.
  • the cavity can be pressed into the filling body, or it can remain hollow.
  • the dielectric constant Dk and the dielectric loss Df of the printed circuit board made of the substrate can be effectively reduced, Dk ⁇ 2.0, Df ⁇ 0.001. This improves RF performance and RF efficiency.
  • the filler can be a material capable of reducing the dielectric constant Dk and the dielectric loss Df, thereby also improving the radio frequency performance and radio frequency efficiency.
  • the filling body 101 in this embodiment can be made of various materials, for example, the material can be a material with a plurality of foamed pores, such as a foam material, or other materials capable of reducing dielectric loss.
  • the adhesive layer 104 may be made of various materials, for example, the material of the adhesive layer 104 may be a prepreg (English: Prepreg, abbreviation: PP) or a pure glue (English: bondsheet) , abbreviation: BS) and so on.
  • the function of the adhesive layer 104 is to bond the substrate 102 and the copper foil 106 .
  • the copper foil 106 is used to realize the circuit diagram on the printed circuit board. Through a series of processing processes such as pressing, the finally formed substrate 102 and the copper foil 106 bonded to the substrate 102 together form a copper clad laminate (English: Copper Clad Laminate, abbreviation: CCL).
  • the composite copper clad laminate has stronger hardness and better supporting effect, and is not easy to bend and deform.
  • the dielectric constant (Dk) and the dielectric loss (Df) of the composite copper clad laminate are lower, and the radio frequency performance and radio frequency efficiency are more excellent.
  • active adjustment of Dk and Df can be achieved to allow a higher degree of freedom in design.
  • the cost of the printed circuit board processed by using the composite copper clad laminate is lower.
  • the copper foil 106 on the copper clad plate can be etched with required circuit diagrams on the copper foil 106 .
  • both sides of the substrate 102 are covered with copper foils 106 , and the substrate 102 is provided with vias 105 penetrating the entire substrate 102 and the adhesive layer 104 .
  • the via hole 105 plated with the conductive metal layer is a metallized hole (English: plated through hole, abbreviation: PTH).
  • PTH plated through hole
  • the purpose is to ensure that the filling body 101 is in a closed environment, and the non-cavity area can withstand the mechanical influence brought by the drilling process, so as to ensure the progress of the subsequent process.
  • the material of the filling body 101 has a relatively high water absorption rate, such as a foam material. With the influence of the environment, the water absorption degree will greatly affect the change of the dielectric constant Dk and the dielectric loss Df, which is likely to cause electrical performance failure. In this embodiment, As shown in FIG.
  • the filling body 101 can be closed, which avoids the increase of the water absorption rate caused by the exposure of the filling body 101 to the outside, and greatly improves the Reliability of electrical properties, and stability of dielectric constant Dk and dielectric loss Df.
  • An embodiment of the present invention provides a method for manufacturing a printed circuit board according to FIG. 1 .
  • a substrate, a filling body and an adhesive layer are provided to complete the material preparation; it also includes the following steps:
  • the grooving process may be punching or milling.
  • the step of adhering the copper foil to the substrate is the plate arrangement, and the matching plate body after the plate arrangement is completed is sandwiched between the steel plates, and sent to a press furnace, heated and pressurized, and then After cooling, the steel plate is dismantled to obtain a composite copper clad laminate (CCL).
  • the process flow is pressing.
  • Drilling is performed on the bonded substrate to form via holes, and the via holes penetrate through the bonded substrate;
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL) or a composite copper clad laminate.
  • CCL copper clad laminate
  • VIA via hole
  • a conductive metal layer is plated on the outer surface of the bonded substrate and the inner wall of the via hole.
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL). Electroplating is performed on the composite copper clad laminate after the via hole is opened. Specifically, copper plating on the outer surface of the copper clad laminate is called surface copper. The purpose is to provide additional shielding protection and noise control for the underlying equipment and signals. , and also helps to improve the heat dissipation capacity of the printed circuit board.
  • the copper plating on the hole wall of the via hole of the CCL is called hole copper, that is, metallized hole (PTH). The purpose is that this kind of metallized hole can realize the interconnection of double-sided printed circuits.
  • PTH metallized hole
  • the double-sided printed circuit board can integrate more electronic devices, which greatly improves the functional expansion of the printed circuit board, effectively improves the high density of device layout, and saves more space.
  • the composite copper clad laminate can be subjected to the next process, that is, the manufacturing process of the printed circuit board.
  • the embodiment shown in FIG. 2 also includes a traditional printed circuit board manufacturing process, which includes: dry film, etching, solder mask, text, molding, testing and other processes, and finally forms a double-sided printed circuit board, so The above-mentioned processes are all in the prior art and will not be repeated here.
  • a traditional printed circuit board manufacturing process which includes: dry film, etching, solder mask, text, molding, testing and other processes, and finally forms a double-sided printed circuit board, so The above-mentioned processes are all in the prior art and will not be repeated here.
  • FIG. 3 Another embodiment of the present application provides a manufacturing method.
  • the manufacturing method is based on the printed circuit board structure of the embodiment shown in FIG. 1 .
  • this embodiment is directed to a manufacturing method in which the base is an injection molding material. .
  • the substrate 102 with the cavity is processed by an injection molding process instead of being obtained by grooving.
  • step 1a of FIG. 3 after the substrate 102 is injection-molded, the injection molding material substrate 102 having a cavity is obtained by demolding.
  • step 2 shown in FIG. 2 will be omitted, because the injection molding process has already formed the cavity in the mold, and no grooving process is required, so step 1 shown in the original FIG. 2 is correspondingly shown in FIG. 3 Step 2, the subsequent steps 3-7 are the same as the steps provided in the embodiment shown in FIG. 2, and are not repeated here.
  • Some embodiments of the present invention provide a printed circuit board, as shown in FIG. 4 ,
  • It includes a substrate 201, an adhesive layer 204, and a copper foil 206, wherein:
  • a plug hole (a region with a diameter of D in the figure) is provided at a designated position of the substrate 201, the plug hole penetrates the substrate 201, and the plug hole is used for pouring curable material 202, and the curable material 202 for supporting the printed circuit board;
  • the two opposite surfaces of the substrate 201 are covered with the copper foil 206;
  • the copper foil 206 and the substrate 201 are bonded through the adhesive layer 204 to form a copper clad laminate;
  • the outer surface of the copper foil 206 is plated with a conductive metal layer
  • a via hole 205 is provided at the position of the plug hole, and the via hole 205 penetrates the substrate 201 and the adhesive layer 104 for connecting the copper foils 206 on both sides of the printed circuit board;
  • a conductive metal layer is formed on the hole wall of the via hole 205 .
  • the substrate 201 in this embodiment is a material with a plurality of foamed pores.
  • the material with foamed pores may be a foamed material, or may be any other material capable of reducing the dielectric constant Dk and the dielectric Material that loses Df.
  • the printed circuit board formed in this embodiment can make the dielectric constant Dk and the dielectric loss Df lower, Dk ⁇ 2.0, Df ⁇ 0.001.
  • the curable material 202 may be a liquid substance, such as resin ink, etc., or a solid substance, such as epoxy, hydrocarbon, PPO, and the like.
  • the curable material 202 is used to support the entire substrate to meet the mechanical requirements of the printed circuit board.
  • the plug hole penetrates the substrate 201 to ensure that the filling body or cavity is in a closed environment. The purpose of this is to avoid metal The hole type of the chemical hole is poor or even the copper is broken, so as to avoid pouring the potion into the cavity or stomata. At the same time, excessive moisture absorption of the filling body or the cavity is avoided, thereby ensuring the electrical performance stability of the filling body or the cavity.
  • the water absorption of foam materials can be avoided.
  • the closed filler helps to reduce the water absorption rate to the dielectric constant Dk and dielectric loss Df influence, to ensure stable electrical performance.
  • the number of the plug holes may be one, or may be multiple, which can be determined according to actual needs, and the spacing between the plug holes may be various form, and is constrained according to the standard of the via hole 205 of the traditional printed circuit board, and will not be repeated here.
  • the number of the via holes 205 may be one, or may be multiple, but the number of the via holes 205 is less than or equal to the number of the plug holes, because in the solution provided by this embodiment, the via holes 205 are opened In the support structure, it is not opened on the substrate.
  • the radius of the plug hole is less than or equal to 0.6 mm; the radius of the plug hole is larger than the radius of the via hole 205 .
  • the difference between the radius of the plug hole and the radius of the via hole 205 should be greater than or equal to 0.15 mm.
  • the axis of the plug hole and the axis of the via hole 205 are the same straight line. The purpose is to ensure the mechanical stability of the plug hole as a support.
  • the hole wall of the via hole 205 is plated with a conductive metal layer, the purpose of which is that the copper foils on both sides can realize double-sided interconnection through the via hole 205, and the printed circuit board finally formed by using the substrate can integrate more Multiple devices greatly improve the functional expansion of the printed circuit board, effectively improve the high density of device layout, and save more space.
  • An embodiment of the present invention provides a method for manufacturing a printed circuit board according to FIG. 4 .
  • a substrate, an adhesive layer and a copper foil are provided to complete the material preparation; the following steps are also included:
  • Drilling is performed on the substrate to form plug holes, the plug holes penetrate through the substrate;
  • the step of adhering the copper foil to the substrate is the plate arrangement, and the matching plate body after the plate arrangement is completed is sandwiched between the steel plates, and sent to a press furnace, heated and pressurized, and then After cooling, the steel plate is dismantled to obtain a composite copper clad laminate (CCL).
  • the process flow is pressing.
  • Drilling is performed on the plug hole positions of the bonded substrate to form via holes, and the via holes pass through the bonded substrate.
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL) or a composite copper clad laminate.
  • CCL copper clad laminate
  • VIA via hole
  • a conductive metal layer is plated on the outer surface of the bonded substrate and the inner wall of the via hole.
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL).
  • CCL copper clad laminate
  • the composite copper clad laminate after opening the via hole is electroplated.
  • copper plating on the outer surface of the copper clad laminate is called surface copper.
  • the purpose is to provide additional shielding protection and noise control for the underlying equipment and signals. , and also helps to improve the heat dissipation capacity of the printed circuit board.
  • the copper plating on the hole wall of the via hole of the CCL is called hole copper, that is, metallized hole (PTH).
  • PTH metallized hole
  • the double-sided printed circuit board can integrate more electronic devices, which greatly improves the functional expansion of the printed circuit board, effectively improves the high density of device layout, and saves more space.
  • the composite copper clad laminate can be subjected to the next process, that is, the manufacturing process of the printed circuit board.
  • the manufacturing process of the printed circuit board includes: dry film, etching, solder mask, text, molding, testing and other processes, and finally a double-sided printed circuit board is formed. All the processes are in the prior art and will not be repeated here. .
  • the substrate is a material with a plurality of foamed pores.
  • the material with foam pores may be a foam material, or may be other materials capable of reducing the dielectric constant Dk and the dielectric loss Df.
  • the printed circuit board formed in this embodiment can make the dielectric constant Dk and the dielectric loss Df lower, Dk ⁇ 2.0, Df ⁇ 0.001.
  • the printed circuit board formed by this embodiment has stronger hardness and mechanical performance due to the support of the curable material, and is less prone to bending and deformation.
  • the manufacturing process of the printed circuit board shown in FIG. 5 includes: dry film, etching, solder mask, text, molding, testing and other processes, and finally a double-sided printed circuit board is formed. All the processes are in the prior art, and are not described here. Repeat.
  • the substrate is a material having a plurality of foamed pores.
  • the material with foam pores may be a foam material, or may be other materials capable of reducing the dielectric constant Dk and the dielectric loss Df.
  • the printed circuit board formed in this embodiment can make the dielectric constant Dk and the dielectric loss Df lower, Dk ⁇ 2.0, Df ⁇ 0.001.
  • the curable material is a resin ink.
  • the curable material may be a liquid substance, for example, resin ink, etc., or a solid substance, such as epoxy, hydrocarbon, PPO, and the like.
  • the curable material is used to support the entire substrate and meet the mechanical requirements of the printed circuit board.
  • the plug hole penetrates the substrate to ensure that the filling body or cavity is in a closed environment. The purpose of this is to avoid metallized holes.
  • the hole type is poor or even the copper is broken, so as to avoid pouring the potion into the cavity or stomata. At the same time, it also avoids excessive moisture absorption of the filling body or cavity, thereby ensuring the electrical performance stability of the filling body or cavity.
  • the water absorption of foam materials can be avoided.
  • the closed filler helps to reduce the influence of water absorption on the dielectric constant Dk and dielectric loss Df, ensuring stable electrical properties.
  • the number of the plug holes may be one, or may be multiple, which may be determined according to actual needs. It is constrained by the hole standard and will not be repeated here.
  • the number of the via holes may be one, or may be multiple, and the number of the via holes is less than or equal to the number of the plug holes.
  • the radius of the plug hole is less than or equal to 0.6 mm; the radius of the plug hole is larger than the radius of the via hole.
  • the difference between the radius of the plug hole and the radius of the via hole should be greater than or equal to 0.15mm.
  • the axis of the plug hole and the axis of the via hole are the same straight line. The purpose is to ensure the mechanical stability of the plug hole as a support.
  • the embodiment of the present invention provides another method for manufacturing a printed circuit board according to FIG. 4 .
  • a substrate, an adhesive layer and a copper foil are provided to complete the material preparation; it also includes the following steps:
  • the step of adhering the copper foil to the substrate is the plate arrangement, and the matching plate body after the plate arrangement is completed is sandwiched between the steel plates, and sent to a press furnace, heated and pressurized, and then After cooling, the steel plate is dismantled to obtain a composite copper clad laminate (CCL).
  • the process flow is pressing.
  • Drilling is performed on the copper clad laminate to form plug holes, and the plug holes pass through the bonded substrate;
  • the bonded substrate described herein also includes a bonded and pressed substrate.
  • the bonded substrate may be a copper clad laminate (CCL) or a composite copper clad laminate.
  • Drilling is performed at the position of the plug hole of the copper clad laminate to form a via hole, and the via hole penetrates the copper clad laminate;
  • a conductive metal layer is plated on the outer surface of the copper clad laminate and the inner wall of the via hole;
  • a double-sided printed circuit board is obtained by passing the metallized board body through a printed circuit board manufacturing process.
  • the method provided in this embodiment requires a grinding process after the substrate is plugged with the curable material, in order to make the surface of the plate body smoother during the drilling process, which is more conducive to the subsequent copper plating process .
  • the manufacturing method shown in FIG. 6 has the same characteristics as the manufacturing method shown in FIG. 5 , and details are not described herein again.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明提供一种印刷电路板及其制作方法，以及一种电子通讯设备。该印刷电路板包括基板、粘结层、铜箔以及填充体，其中：所述基板设有空腔，所述空腔贯通所述基板；所述基板的两个表面覆有所述铜箔；所述铜箔与所述基板之间通过所述粘结层粘合；所述铜箔的外表面镀有导电金属层；所述填充体位于所述空腔内；所述基板设有过孔，所述过孔贯通所述基板以及所述粘结层；所述过孔的孔壁上镀有导电金属层。本发明可以有效地降低印刷电路板的介电常数Dk以及介电损耗Df，并同时保证了成本控制。

Description

印刷电路板及其制作方法，以及一种电子通讯设备
本申请要求于2021年01月13日提交中国专利局、申请号为202110045155.7、申请名称为“印刷电路板及其制作方法，以及一种电子通讯设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及单板工程领域，尤其涉及印刷电路板及其制作方法，以及一种电子通讯设备。
背景技术
印刷电路板，又称印制电路板、印刷线路板，常用英文缩写PCB(Printed Circuit Board)或PWB(Printed Wire Board)，是电子元件的支撑器件，在这其中有金属导体作为连接电子元器件的线路。
随着云计算、物联网等技术的高速发展，通信行业对信号传输速率的要求也随之提高，传统PCB板在通信天线领域主要起到电气连接的作用，在高速信号传输下，由PCB板传输线引起的介质损耗会影响信号的传输速率和传输质量，因此，如何进一步降低天线PCB板材引起的介质损耗，提升信号传输质量和传输速率是给当前天线PCB板的设计带来的巨大挑战。
发明内容
针对上述背景技术中提到的技术问题，本发明提供一种印刷电路板及其制作方法，以及电子通讯设备，能够在进一步降低印刷电路板的介电损耗的同时保证成本控制。
第一方面，提供了一种印刷电路板，所述印刷电路板包括：基板、粘结层、铜箔以及填充体，其中：
所述基板设有空腔，所述空腔贯通所述基板；
所述基板的两个表面覆有所述铜箔；
所述铜箔与所述基板之间通过所述粘结层粘合；
所述铜箔的外表面镀有导电金属层；
所述填充体位于所述空腔内；
所述基板设有过孔，所述过孔贯通所述基板以及所述粘结层；
所述过孔的孔壁上镀有导电金属层。
具体地，所述基板设有空腔，所述空腔可以压入填充体，或者保持空腔状态。其中，在空腔状态下，利用该基板制作的印刷电路板，其介电常数Dk和介 电损耗Df可以得到有效降低，从而提高射频性能和射频效率。同样的，所述填充体可以为能够降低介电常数Dk和介电损耗Df的任意材料，Dk<2.0，Df<0.001。从而同样提高射频性能和射频效率。另外，所述空腔或者填充体的尺寸，可以根据该种基板的厚度进行调整，介质尺寸和介电常数Dk以及介电损耗Df之间具有相关性，因此，该基板可以对介电常数Dk和介电损耗Df进行自主调节，从而使得设计自由度更高。
在一个示例中，所述铜箔与所述基板通过粘结层粘合后，再经过压合工艺，即得到覆铜板(英文：copper-clad laminate，缩写：CCL)。各种不同形式、不同功能的印制电路板，都是在覆铜板上有选择地进行加工、蚀刻、钻孔及镀铜等工序，制成不同的印制电路。对印制电路板主要起互连导通、绝缘和支撑的作用，对电路中信号的传输速度、能量损失和特性阻抗等有很大的影响，因此，印制电路板的性能、品质、制造中的加工性、制造水平、制造成本以及长期的可靠性及稳定性在很大程度上取决于覆铜板。
所述过孔也称为导通孔(英文：vertical interconnect access，缩写：VIA)，在一个示例中，过孔的孔壁镀有导电金属层，用于导通或者连接电路板不同层中导电图形之间的铜箔线路，在一个示例中，过孔可以实现双面覆铜板的铜箔互连，利用该基板最终形成的印刷电路板可以集成更多器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。
结合第一方面，在一种可能的实现方式中，
所述过孔不在所述空腔的区域。
具体地，没有空腔的区域用于支撑整块基板，满足印刷电路板的力学要求，另外，将过孔开设在没有空腔的指定区域，保证填充体或空腔处于封闭的环境，这么做的目的在于：避免金属化孔的孔型较差甚至断铜，避免药水灌入空腔或气孔。同时也避免了填充体或空腔过多吸湿，进而保证了填充体或空腔的电性能稳定性。
结合第一方面，在另一种可能的实现方式中，
所述填充体为具有多个发泡气孔的材料。
具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板，该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低；相较于常规泡沫板材，由该实施例形成的印刷电路板，由于有基板支撑，具备更强的硬度和力学表现，更不易弯折变形。
另外，由于填充体处于封闭环境中，以泡沫材料所为填充体为例，可以避免泡沫材料吸水，相较于暴露于外界的泡沫板件，封闭填充体有助于降低吸水 率对介电常数Dk和介电损耗Df的影响，保证了电性能稳定。
所述填充体的体积不应大于其所压入的空腔体积。填充体与空腔尺寸之间的公差配合可以有多种形式，以满足其功能和力学要求为准则。
结合第一方面，在另一种可能的实现方式中，
所述基板的材料为环氧树脂。
具体地，该实施例中提供的基板材料并不限于此，可以为本领域制作印刷电路板的常用材料，例如，所述基板可以为环氧树脂材料、注塑材料、CEM-3，或者可以为碳氢材料、PPO材料等。环氧树脂材料、注塑材料、CEM-3的成本较低，有利于成本控制。
结合第一方面，在另一种可能的实现方式中，
所述粘结层的材料为半固化片。
所述粘结层的材料可以有多种，例如，可以为半固化片(英文:Prepreg，缩写：PP)或者纯胶(英文：bondsheet，缩写：BS)等。
结合第一方面，在另一种可能的实现方式中，
所述过孔的数量为M个，M为大于等于1的整数。
具体地，所述过孔的数量可以为1个，或者可以为多个，可以根据实际需求决定，所述过孔的尺寸和过孔之间的间距可以有多种形式，并依据传统印刷电路板的过孔标准来约束，在此不再赘述。
结合第一方面，在另一种可能的实现方式中，
所述空腔的数量为N个，N为大于等于1的整数。
具体地，所述空腔的数量可以为1个，或者可以为多个，所有空腔的形式可以多种，例如，包括但不限于：可以全部压入填充体，也可以部分压入填充体，也可以压入不同材料的填充体。
第二方面，提供了一种根据第一方面的印刷电路板的制作方法，包括：
首先提供基板、填充体以及粘结层，完成物料准备；
在基板上进行开槽处理，形成空腔，所述空腔贯通所述基板；
在一个示例中，开槽处理可以采用冲加工或者铣加工。
将填充体压入所述空腔内；将铜箔覆于所述基板的两面；将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
在一个示例中，该种将铜箔与基板粘合的步骤即为排板，将排板完成之后的配套板体夹在钢板之间，并送入压炉，通过加温和加压，再冷却后，拆除所述钢板得到复合覆铜板(CCL)该工艺流程即为压合。
在所述粘合后的基板上进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)或者复合覆铜板。按照程式，在复合覆铜板的指定位置钻孔，形成贯通复合覆铜板的过孔(VIA)。
在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)。将开设完过孔之后的复合覆铜板进行电镀处理，具体地，在所述覆铜板的外表面镀铜称为面铜，其目的在于：为底层设备和信号提供了额外的屏蔽保护和噪声控制，另外也有助于提高印刷电路板的散热能力。在所述覆铜板的过孔的孔壁镀铜称为孔铜，即金属化孔(PTH)，其目的在于该种金属化孔可以实现双面印刷电路的互连，相较于单面电路板，双面印刷路板可以集成更多的电子器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。经过电镀处理之后的复合覆铜板可以进行下一步工艺，即印刷电路板制作工艺流程。
所述印刷电路板制作工艺流程包括：干膜、蚀刻、阻焊、文字、成型、测试等流程，最终形成双面印刷电路板，所述各项流程均为现有技术，在此不再赘述。
结合第二方面，在一种可能的实现方式中，
所述过孔开设在所述基板没有空腔的指定区域。
具体地，没有空腔的区域用于支撑整块基板，满足印刷电路板的力学要求，另外，将过孔开设于没有空腔的指定区域，保证填充体或空腔处于封闭的环境，这么做的目的在于：避免金属化孔的孔型较差甚至断铜，避免药水灌入空腔或气孔。同时也避免了填充体或空腔过多吸湿，进而保证了填充体或空腔的电性能稳定性。
结合第二方面，在另一种可能的实现方式中，
所述填充体为具有多个发泡气孔的材料。
具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板，该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低；Dk<2.0，Df<0.001。相较于常规泡沫板材，由该实施例形成的印刷电路板，由于有基板支撑，具备更强的硬度和力学表现，更不易弯折变形。
另外，由于填充体处于封闭环境中，以泡沫材料所谓填充体为例，可以避免泡沫材料的吸水性，相较于暴露与外界的泡沫板件，因此，封闭填充体有助于降低吸水率对介电常数Dk和介电损耗Df的影响，保证了电性能稳定。
所述填充体的体积不应大于其所压入的空腔体积。填充体与空腔尺寸之间 的公差配合可以有多种形式，以满足其功能和力学要求为准则。
结合第二方面，在另一种可能的实现方式中，
所述基板的材料为环氧树脂。
具体地，该实施例中提供的基板材料并不限于此，可以为本领域制作印刷电路板的常用材料，例如，所述基板可以为环氧树脂材料、注塑材料、CEM-3，或者可以为碳氢材料、PPO材料等。环氧树脂材料、注塑材料、CEM-3的成本较低，有利于成本控制。
结合第二方面，在另一种可能的实现方式中，
所述粘结层的材料为半固化片。
所述粘结层的材料可以有多种，例如，可以为半固化片(英文:Prepreg，缩写：PP)或者纯胶(英文：bondsheet，缩写：BS)等。
结合第二方面，在另一种可能的实现方式中，
所述过孔的数量为M个，M为大于等于1的整数。
具体地，所述过孔的数量可以为1个，或者可以为多个，可以根据实际需求决定，所述过孔的尺寸和过孔之间的间距可以有多种形式，并依据传统印刷电路板的过孔标准来约束，在此不再赘述。
结合第二方面，在另一种可能的实现方式中，
所述空腔的数量为N个，N为大于等于1的整数。
具体地，所述空腔的数量可以为1个，或者可以为多个，所有空腔的形式可以多种，例如，包括但不限于：可以全部压入填充体，也可以部分压入填充体，也可以压入不同材料的填充体。
第三方面提供了一种印刷电路板，所述印刷电路板包括：
基板、粘结层、铜箔，其中：
所述基板设有塞孔，所述塞孔贯通所述基板；
所述塞孔包括可固化材料；
所述基板的两个表面覆有所述铜箔；
所述铜箔与所述基板之间通过所述粘结层粘合；
所述铜箔的外表面镀有导电金属层；
所述塞孔的位置设有过孔，所述过孔贯通所述基板以及所述粘结层；
所述过孔的孔壁上渡有导电金属层。
具体地，所述过孔也称为导通孔(英文：vertical interconnect access，缩写：VIA)，在一个示例中，过孔的孔壁镀有导电金属层，用于导通或者连接电路板不同层中导电图形之间的铜箔线路，在一个示例中，过孔可以实现双面覆铜板的铜箔互连，利用该基板最终形成的印刷电路板可以集成更多器件，极大提高 了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。
在一个示例中，所述铜箔与所述基板通过粘结层粘合后，再经过压合工艺，即得到覆铜板(英文：copper-clad laminate，缩写：CCL)。各种不同形式、不同功能的印制电路板，都是在覆铜板上有选择地进行加工、蚀刻、钻孔及镀铜等工序，制成不同的印制电路。对印制电路板主要起互连导通、绝缘和支撑的作用，对电路中信号的传输速度、能量损失和特性阻抗等有很大的影响，因此，印制电路板的性能、品质、制造中的加工性、制造水平、制造成本以及长期的可靠性及稳定性在很大程度上取决于覆铜板。
结合第三方面，在一种可能的实现方式中，
所述基板为具有多个发泡气孔的材料。
具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板，该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低；Dk<2.0，Df<0.001。相较于常规泡沫板材，由该实施例形成的印刷电路板，由于有可固化材料支撑，具备更强的硬度和力学表现，更不易弯折变形。
结合第三方面，在另一种可能的实现方式中，
所述可固化材料为树脂油墨。
具体的，所述可固化材料可以为液体物质，例如，可以为树脂油墨等，也可以为固体物质，例如环氧、碳氢、PPO等。所述可固化材料用于支撑整块基板，满足印刷电路板的力学要求，另外，塞孔贯通所述基板，保证填充体或空腔处于封闭的环境，这么做的目的在于：避免金属化孔的孔型较差甚至断铜，避免药水灌入空腔或气孔。同时也避免了填充体或空腔过多吸湿，进而保证了填充体或空腔的电性能稳定性，以泡沫材料所谓填充体为例，可以避免泡沫材料的吸水性，相较于暴露与外界的泡沫板件，因此，封闭填充体有助于降低吸水率对介电常数Dk和介电损耗Df的影响，保证了电性能稳定。
结合第三方面，在另一种可能的实现方式中，
所述粘结层的材料为半固化片。
所述粘结层的材料可以有多种，例如，可以为半固化片(英文:Prepreg，缩写：PP)或者纯胶(英文：bondsheet，缩写：BS)等。
结合第三方面，在另一种可能的实现方式中，
所述塞孔的数量为K个，K为大于等于1的任意整数。
具体地，所述塞孔的数量可以为1个，或者可以为多个，可以根据实际需求决定，所述塞孔之间的间距可以有多种形式，并依据传统印刷电路板的过孔标 准来约束，在此不再赘述。
结合第三方面，在另一种可能的实现方式中，
所述过孔的数量为M个，M为大于等于1的任意整数，所述过孔的数量小于等于所述塞孔的数量。
结合第三方面，在另一种可能的实现方式中，
所述塞孔的半径小于等于0.6mm；所述塞孔的半径大于所述过孔的半径。在一个示例中，所述塞孔的半径与所述过孔的半径的差值应大于等于0.15mm。
结合第三方面，在另一种可能的实现方式中，
所述塞孔的轴线和所述过孔的轴线是同一条直线。其目的在于保证所述塞孔作为支撑体的力学稳定性。
第四方面，提供了一种基于第三方面的印刷电路板的制作方法，包括：
提供基板、粘结层以及铜箔，完成物料准备；
在基板进行钻孔处理，形成塞孔，所述塞孔贯通所述基板；
向所述塞孔中加入可固化材料；
将所述铜箔覆于所述基板的两面；
将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
在一个示例中，该种将铜箔与基板粘合的步骤即为排板，将排板完成之后的配套板体夹在钢板之间，并送入压炉，通过加温和加压，再冷却后，拆除所述钢板得到复合覆铜板(CCL)该工艺流程即为压合。
在所述粘合后的基板的所述塞孔位置进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)或者复合覆铜板。按照程式，在复合覆铜板的指定位置钻孔，形成贯通复合覆铜板的过孔(VIA)。
在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)。将开设完过孔之后的复合覆铜板进行电镀处理，具体地，在所述覆铜板的外表面镀铜称为面铜，其目的在于：为底层设备和信号提供了额外的屏蔽保护和噪声控制，另外也有助于提高印刷电路板的散热能力。在所述覆铜板的过孔的孔壁镀铜称为孔铜，即金属化孔(PTH)，其目的在于该种金属化孔可以实现双面印刷电路的互连，相较于单面电路板，双面印刷路板可以集成更多的电子器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。经过电镀处理之后的复合覆铜板可以进行下一步工艺，即印刷电路板制作工艺流程。
所述印刷电路板制作工艺流程包括：干膜、蚀刻、阻焊、文字、成型、测试等流程，最终形成双面印刷电路板，所述各项流程均为现有技术，在此不再赘述。
结合第四方面，在一种可能的实现方式中，
所述基板为具有多个发泡气孔的材料。
具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板，该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低；Dk<2.0，Df<0.001。相较于常规泡沫板材，由该实施例形成的印刷电路板，由于有可固化材料支撑，具备更强的硬度和力学表现，更不易弯折变形。
结合第四方面，在另一种可能的实现方式中，
所述可固化材料为树脂油墨。
具体的，所述可固化材料可以为液体物质，例如，可以为树脂油墨等，也可以为固体物质，例如环氧、碳氢、PPO等。所述可固化材料用于支撑整块基板，满足印刷电路板的力学要求，另外，塞孔贯通所述基板，保证填充体或空腔处于封闭的环境，这么做的目的在于：避免金属化孔的孔型较差甚至断铜，避免药水灌入空腔或气孔。同时也避免了填充体或空腔过多吸湿，进而保证了填充体或空腔的电性能稳定性。，以泡沫材料所谓填充体为例，可以避免泡沫材料的吸水性，相较于暴露与外界的泡沫板件，因此，封闭填充体有助于降低吸水率对介电常数Dk和介电损耗Df的影响，保证了电性能稳定。
结合第四方面，在另一种可能的实现方式中，
所述粘结层的材料为半固化片。
所述粘结层的材料可以有多种，例如，可以为半固化片(英文:Prepreg，缩写：PP)或者纯胶(英文：bondsheet，缩写：BS)等。
结合第四方面，在另一种可能的实现方式中，
所述塞孔的数量为K个，K为大于等于1的任意整数。
具体地，所述塞孔的数量可以为1个，或者可以为多个，可以根据实际需求决定，所述塞孔之间的间距可以有多种形式，并依据传统印刷电路板的过孔标准来约束，在此不再赘述。
结合第四方面，在另一种可能的实现方式中，
所述过孔的数量为M个，M为大于等于1的任意整数，所述过孔的数量小于等于所述塞孔的数量。
结合第四方面，在另一种可能的实现方式中，所述塞孔的半径小于等于0.6mm；所述塞孔的半径大于所述过孔的半径。
所述塞孔的半径与所述过孔的半径的差值应大于等于0.15mm。
结合第四方面，在另一种可能的实现方式中，
所述塞孔的轴线和所述过孔的轴线是同一条直线。其目的在于保证所述塞孔作为支撑体的力学稳定性。
第五方面，提供一种基于第三方面的印刷电路板的制作方法，包括：
提供基板、粘结层以及铜箔，完成物料准备；
将所述铜箔覆于所述基板的两面；
将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
将粘合后的基板进行压合处理，得到压合后的基板；
将压合后的基板进行钻孔处理，形成塞孔，所述塞孔贯通所述压合后的基板；
向所述塞孔中加入可固化材料；
在所述压合后的基板的所述塞孔位置进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
将所述金属化处理后的板体通过印刷电路板制造工艺得到双面印刷电路板。
具体地，第五方面与第四方面提供的制作方法的区别在于，第五方面的制作方法采用先压合后钻孔的工艺，该种方法需要在所述基板完成可固化材料塞孔之后进行一次研磨处理，目的是为了让所述板体在钻孔流程时的表面更加平整，更有利于后续镀铜处理的进行。除顺序和上述研磨处理流程之外，第五方面的制作方法与第四方面提供的制作方法特征一致，在此不再赘述。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种印刷电路板的结构示意图
图2为本申请实施例提供的一种基于图1的印刷电路板的制造方法的流程示意图
图3为本申请实施例提供的另一种基于图1的印刷电路板的制造方法的流程示意图
图4为本申请实施例提供的另一种印刷电路板的结构示意图
图5为本申请实施例提供的一种基于图4的印刷电路板的制造方法的流程示意图
图6为本申请实施例提供的另一种基于图4的印刷电路板的制造方法的流 程示意图
具体实施方式
下面结合附图并举实施例，对本申请提供的技术方案作进一步说明。应理解，本申请实施例中提供的系统结构和业务场景主要是为了解释本申请的技术方案的一些可能的实施方式，不应被解读为对本申请的技术方案的唯一性限定。本领域普通技术人员可以知晓，随着系统的演进，以及更新的业务场景的出现，本申请提供的技术方案对于相同或类似的技术问题仍然可以适用。
应理解，本申请实施例提供的技术方案，在以下具体实施例的介绍中，某些重复之处可能不再赘述，但应视为这些具体实施例之间已有相互引用，可以相互结合。
无线通信系统中，设备可分为提供无线网络服务的设备和使用无线网络服务的设备。提供无线网络服务的设备是指那些组成无线通信网络的设备，可简称为网络设备(network equipment)，或网络单元(network element)。网络设备通常归属于运营商或基础设施提供商，并由这些厂商负责运营或维护。网络设备还可进一步分为无线接入网(radio access network，RAN)设备以及核心网(core network，CN)设备。典型的RAN设备包括基站(base station，BS)。
天线印刷电路板所要求介质的介电常数Dk和介电损耗Df更小、且同时具备成本竞争力、以及具有较佳的可加工性。目前天线印刷电路板采用射频类天线专用板材，介电常数Dk和介电损耗Df由板材的厚度决定，介质材料厚度规格可选择的规格较少，例如可选规格为：0.005英寸、0.010英寸、0.020英寸、0.030英寸、0.060英寸，因此介电常数Dk和介电损耗Df难以达到期望的范围，并且难以进一步调整。
天线印刷电路板可用的板材中，聚四氟乙烯PTFE树脂是目前介电常数Dk最低的树脂(Dk约2.1)；低于2.0的介电常数Dk材料，需要采用发泡介质或空腔来实现，所有介质中以空气的Dk/Df最小，提升空气的比例可有效降低Dk/Df。因此，采用低介电常数Dk的基体树脂进行发泡是获取超低介电常数Dk介质的有效途径，发泡率越高则空气占比越高，Dk/Df越低。
针对上述原理，本发明提供了印刷电路板及其制作方法，以及一种电子通讯设备，能够在进一步降低印刷电路板的介电损耗的同时保证成本控制。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的一些实施例提供了一种印刷电路板，如图1所示，该印刷电路板 包括：
一种印刷电路板，其特征在于，包括基板102、粘结层104、铜箔106以及填充体，其中：
所述基板102设有空腔(图中未示出)，所述空腔贯通所述基板102；
所述基板102的两个表面覆有所述铜箔106；
所述铜箔106与所述基板102之间通过所述粘结层104粘合，形成粘合后的基板，在一个示例中为覆铜板；
所述覆铜板的外表面镀有导电金属层103a；
所述填充体101位于所述空腔内；
所述基板102设有过孔105，所述过孔105贯通所述基板102以及所述粘结层104，用于连接所述印刷电路板两面的铜箔106；
所述过孔105的孔壁上镀有导电金属层。
具体地，该实施例中的基板102可以为本领域制作印刷电路板的常用材料，例如，所述基板102可以为环氧树脂材料、注塑材料，或者可以为复合板，例如：CEM-3、FR-4等，或者可以为碳氢材料、PPO材料等。
在一个示例中，所述基板102上可以通过开槽形成槽体，该槽体贯通所述基板102。由于在该槽体的上方和下方均具有所述粘结层104、铜箔106以及镀铜层，所以该槽体在印刷电路板内形成了封闭的空腔。没有开槽的基板102部分作为印刷电路板的基础结构，用于支撑所述印刷电路板。
在图1所示的实施例中示出了五个空腔，应理解的是，所述基板102可以开设多个空腔，所述空腔的尺寸和间距基于需求和传统工艺的要求进行选择，基板102没有开槽的区域即为该印刷电路板的支撑部分。
所述空腔可以压入填充体，或者保持空腔状态。其中，在空腔状态下，利用该基板制作的印刷电路板，其介电常数Dk和介电损耗Df可以得到有效降低，Dk<2.0，Df<0.001。从而提高射频性能和射频效率。同样的，所述填充体可以为能够降低介电常数Dk和介电损耗Df的材料，从而同样提高射频性能和射频效率。
该实施例中的填充体101可以为多种材料，例如，该材料可以是具有多个发泡气孔材料，例如泡沫材料等，或者其他能够降低介电损耗的材料。
在如图1所示的实施例中，该粘结层104可以为多种材料，例如，该粘结层104的材料可以为半固化片(英文:Prepreg，缩写：PP)或者纯胶(英文：bondsheet，缩写：BS)等。粘结层104的作用是用于粘合所述基板102和所述铜箔106。所述铜箔106用于实现印刷电路板上的电路步图。通过压合等一系列加工工艺，最终形成的基板102与粘结于该基板102的铜箔106共同组成覆铜板(英文： Copper Clad Laminate，缩写：CCL)。该种复合覆铜板具备更强的硬度和更优的支撑效果，不易于弯折变形。另外，由于所述填充材料的存在，该复合覆铜板的介电常数(Dk)以及介电损耗(Df)更低，射频性能和射频效率更加优异。而且，可以实现Dk和Df的主动调整，以使得在设计上自由度更高。另外，利用该复合覆铜板加工而成的印刷电路板的成本更加低廉。
所述覆铜板上的铜箔106通过蚀刻技术，可以在铜箔106上刻画出需要的电路步图。在如图1所示的实施例中，该基板102的两面均覆有铜箔106，并在基板102上设有贯通整个基板102以及粘结层104的过孔105。
该种镀有导电金属层的过孔105即为金属化孔(英文：plated through hole，缩写：PTH)。该种金属化孔可以实现双面印刷电路的互连，相较于单面电路板，双面印刷路板可以集成更多的电子器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。
其目的在于保证填充体101处于封闭环境，并且非空腔区域能够承受钻孔工艺带来的力学影响，保证后续工艺的进行。填充体101材料的吸水率较大，例如泡沫材料，随着环境的影响，吸水程度会极大影响介电常数Dk以及介电损耗Df的改变，容易造成电性能失效，在该实施例中，如图1所示，由于过孔105开设于没有开槽的基板102指定区域，因此填充体101可实现封闭，这样避免了填充体101因为暴露在外而造成的吸水率增大，极大提高了电学性能的可靠性，以及介电常数Dk和介电损耗Df的稳定性。
本发明实施例提供一种根据图1所示的印刷电路板的制作方法，如图2所示，首先提供基板、填充体以及粘结层，完成物料准备；还包括以下步骤：
在基板上进行开槽处理，形成空腔，所述空腔贯通所述基板；
在一个示例中，开槽处理可以采用冲加工或者铣加工。
将填充体压入所述空腔内；将铜箔覆于所述基板的两面；将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
在一个示例中，该种将铜箔与基板粘合的步骤即为排板，将排板完成之后的配套板体夹在钢板之间，并送入压炉，通过加温和加压，再冷却后，拆除所述钢板得到复合覆铜板(CCL)该工艺流程即为压合。
在所述粘合后的基板上进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)或者复合覆铜板。按照程式，在复合覆铜板的指定位置钻孔，形成贯通复合覆铜板的过孔(VIA)。
在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)。将开设完过孔之后的复合覆铜板进行电镀处理，具体地，在所述覆铜板的外表面镀铜称为面铜，其目的在于：为底层设备和信号提供了额外的屏蔽保护和噪声控制，另外也有助于提高印刷电路板的散热能力。在所述覆铜板的过孔的孔壁镀铜称为孔铜，即金属化孔(PTH)，其目的在于该种金属化孔可以实现双面印刷电路的互连，相较于单面电路板，双面印刷路板可以集成更多的电子器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。经过电镀处理之后的复合覆铜板可以进行下一步工艺，即印刷电路板制作工艺流程。
在如图2所示的实施例中还包括即传统印刷电路板制作工艺流程，该流程包括：干膜、蚀刻、阻焊、文字、成型、测试等流程，最终形成双面印刷电路板，所述各项流程均为现有技术，在此不再赘述。
本申请另一实施例提供了一种制作方法，该种制作方法基于如图1所示的实施例的印刷电路板结构，如图3所示，该实施例是针对基体为注塑材料的制作方法。与如图2所示的实施例的区别之处在于，所述具有空腔的基板102由注塑工艺加工而成，而非通过开槽得到。具体地，如图3的步骤1a所示，所述基板102通过注塑成型之后，脱模得到具有空腔的注塑材料基板102。另外，图2所示的步骤2将省略，原因是注塑流程已经将所述空腔在模具内成型，无需经过开槽处理，因此原图2所示的步骤1相应的变为图3所示的步骤2，后续的步骤3-7与上述图2所示的实施例提供的步骤一致，在此不再赘述。
本发明的一些实施例提供了一种印刷电路板，如图4所示，
包括基板201、粘结层204、铜箔206，其中：
所述基板201的指定位置设有塞孔(图中直径为D的区域)，所述塞孔贯通所述基板201，所述塞孔用于灌入可固化材料202，所述可固化材料202用于支撑所述印刷电路板；
所述基板201的相对的两个表面覆有所述铜箔206；
所述铜箔206与所述基板201之间通过所述粘结层204粘合，形成覆铜板；
所述铜箔206的外表面镀有导电金属层；
在所述塞孔的位置设有过孔205，所述过孔205贯通所述基板201以及所述粘结层104，用于连接所述印刷电路板两面的所述铜箔206；
所述过孔205的孔壁上渡有导电金属层。
在一个示例中，基板201在该实施例中为具有多个发泡气孔的材料，具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板， 该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低，Dk<2.0，Df<0.001。
在一个示例中，可固化材料202可以为液体物质，例如，可以为树脂油墨等，也可以为固体物质，例如环氧、碳氢、PPO等。所述可固化材料202用于支撑整块基板，满足印刷电路板的力学要求，另外，塞孔贯通所述基板201，保证填充体或空腔处于封闭的环境，这么做的目的在于：避免金属化孔的孔型较差甚至断铜，避免药水灌入空腔或气孔。同时也避免了填充体或空腔过多吸湿，进而保证了填充体或空腔的电性能稳定性。，以泡沫材料所谓填充体为例，可以避免泡沫材料的吸水性，相较于暴露与外界的泡沫板件，因此，封闭填充体有助于降低吸水率对介电常数Dk和介电损耗Df的影响，保证了电性能稳定。
图4中，所述塞孔有六个，应理解，所述塞孔的数量可以为1个，或者可以为多个，可以根据实际需求决定，所述塞孔之间的间距可以有多种形式，并依据传统印刷电路板的过孔205标准来约束，在此不再赘述。所述过孔205的数量可以为1个，或者可以为多个，但过孔205的数量小于等于所述塞孔的数量，原因是因为，在该实施例提供的方案中，过孔205开设于支撑结构中，不开设于基板上。
在一个示例中，所述塞孔的半径小于等于0.6mm；所述塞孔的半径大于所述过孔205的半径。所述塞孔的半径与所述过孔205的半径的差值应大于等于0.15mm。
在一个示例中，所述塞孔的轴线和所述过孔205的轴线是同一条直线。其目的在于保证所述塞孔作为支撑体的力学稳定性。
在一个示例中，所述过孔205的孔壁镀有导电金属层，其目的在于：两面的铜箔可以通过过孔205实现双面互连，利用该基板最终形成的印刷电路板可以集成更多器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。
本发明实施例提供了一种根据图4所示的印刷电路板的制作方法，如图5所示，首先提供基板、粘结层以及铜箔，完成物料准备；还包括以下步骤：
在基板进行钻孔处理，形成塞孔，所述塞孔贯通所述基板；
向所述塞孔中加入可固化材料；
将所述铜箔覆于所述基板的两面；
将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
在一个示例中，该种将铜箔与基板粘合的步骤即为排板，将排板完成之后的配套板体夹在钢板之间，并送入压炉，通过加温和加压，再冷却后，拆除所述钢板得到复合覆铜板(CCL)该工艺流程即为压合。
在所述粘合后的基板的所述塞孔位置进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板。
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)或者复合覆铜板。按照程式，在复合覆铜板的指定位置钻孔，形成贯通复合覆铜板的过孔(VIA)。
在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)。将开设完过孔之后的复合覆铜板进行电镀处理，具体地，在所述覆铜板的外表面镀铜称为面铜，其目的在于：为底层设备和信号提供了额外的屏蔽保护和噪声控制，另外也有助于提高印刷电路板的散热能力。在所述覆铜板的过孔的孔壁镀铜称为孔铜，即金属化孔(PTH)，其目的在于该种金属化孔可以实现双面印刷电路的互连，相较于单面电路板，双面印刷路板可以集成更多的电子器件，极大提高了印刷电路板的功能拓展性，也有效提高了器件排布的高密程度，节省更多空间。经过电镀处理之后的复合覆铜板可以进行下一步工艺，即印刷电路板制作工艺流程。
所述印刷电路板制作工艺流程包括：干膜、蚀刻、阻焊、文字、成型、测试等流程，最终形成双面印刷电路板，所述各项流程均为现有技术，在此不再赘述。
结合第四方面，在一种可能的实现方式中，
所述基板为具有多个发泡气孔的材料。
具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板，该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低，Dk<2.0，Df<0.001。相较于常规泡沫板材，由该实施例形成的印刷电路板，由于有可固化材料支撑，具备更强的硬度和力学表现，更不易弯折变形。
图5所述印刷电路板制作工艺流程包括：干膜、蚀刻、阻焊、文字、成型、测试等流程，最终形成双面印刷电路板，所述各项流程均为现有技术，在此不再赘述。
在一个示例中，所述基板为具有多个发泡气孔的材料。
具体地，所述具有发泡气孔材料可以为泡沫材料，也可以是其他能够降低介电常数Dk和介电损耗Df的材料。相较于常规聚四氟乙烯PTFE或者常规射频类基板，该实施例形成的印刷电路板可以使得介电常数Dk和介电损耗Df更低，Dk<2.0，Df<0.001。
在一个示例中，所述可固化材料为树脂油墨。
具体的，所述可固化材料可以为液体物质，例如，可以为树脂油墨等，也可以为固体物质，例如环氧、碳氢、PPO等。所述可固化材料用于支撑整块基板，满足印刷电路板的力学要求，另外，塞孔贯通所述基板，保证填充体或空腔处于封闭的环境，这么做的目的在于：避免金属化孔的孔型较差甚至断铜，避免药水灌入空腔或气孔。同时也避免了填充体或空腔过多吸湿，进而保证了填充体或空腔的电性能稳定性，以泡沫材料所谓填充体为例，可以避免泡沫材料的吸水性，相较于暴露与外界的泡沫板件，因此，封闭填充体有助于降低吸水率对介电常数Dk和介电损耗Df的影响，保证了电性能稳定。
在一个示例中，所述塞孔的数量可以为1个，或者可以为多个，可以根据实际需求决定，所述塞孔之间的间距可以有多种形式，并依据传统印刷电路板的过孔标准来约束，在此不再赘述。
在一个示例中，所述过孔的数量可以为1个，或者可以为多个，所述过孔的数量小于等于所述塞孔的数量。
在一个示例中，所述塞孔的半径小于等于0.6mm；所述塞孔的半径大于所述过孔的半径。所述塞孔的半径与所述过孔的半径的差值应大于等于0.15mm。
在一个示例中，所述塞孔的轴线和所述过孔的轴线是同一条直线。其目的在于保证所述塞孔作为支撑体的力学稳定性。
本发明实施例提供了另一种根据图4所示的印刷电路板的制作方法，如图6所示，首先提供基板、粘结层以及铜箔，完成物料准备；还包括以下步骤：
将所述铜箔覆于所述基板的两面；
将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
在一个示例中，该种将铜箔与基板粘合的步骤即为排板，将排板完成之后的配套板体夹在钢板之间，并送入压炉，通过加温和加压，再冷却后，拆除所述钢板得到复合覆铜板(CCL)该工艺流程即为压合。
将排板处理之后的板体进行压合，得到覆铜板；
在所述覆铜板进行钻孔处理，形成塞孔，所述塞孔贯通所述所述粘合后的基板；
应理解，这里所述的粘合后的基板还包括经过粘合并压合处理后的基板，在一个示例中，所述粘合后的基板可以为覆铜板(CCL)或者复合覆铜板。
向所述塞孔中加入可固化材料，待材料固化后完成可固化材料塞孔处理；
将完成可固化材料塞孔处理的覆铜板进行研磨处理；
在所述覆铜板的所述塞孔位置进行钻孔处理，形成过孔，所述过孔贯通所述覆铜板；
在所述覆铜板的外表面，以及所述过孔的内壁镀导电金属层；
将所述金属化处理后的板体通过印刷电路板制造工艺得到双面印刷电路板。
该实施例提供的方法需要在所述基板完成可固化材料塞孔之后进行一次研磨处理，目的是为了让所述板体在钻孔流程时的表面更加平整，更有利于后续镀铜处理的进行。除顺序和上述研磨处理流程之外，图6所示的制作方法与图5所示的制作方法特征一致，在此不再赘述。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (15)

  1. 一种印刷电路板，其特征在于，包括基板、粘结层、铜箔以及填充体，其中：
    所述基板设有空腔，所述空腔贯通所述基板；
    所述基板的两个表面覆有所述铜箔；
    所述铜箔与所述基板之间通过所述粘结层粘合；
    所述铜箔的外表面镀有导电金属层；
    所述填充体位于所述空腔内；
    所述基板设有过孔，所述过孔贯通所述基板以及所述粘结层；
    所述过孔的孔壁上镀有导电金属层。
  2. 根据权利要求1所述的印刷电路板，其特征在于，
    所述过孔不在所述空腔的区域。
  3. 根据权利要求1或2所述的印刷电路板，其特征在于，
    所述填充体为具有多个发泡气孔的材料。
  4. 根据权利要求1-3任意之一所述的印刷电路板，其特征在于，
    所述基板的材料为环氧树脂。
  5. 根据权利要求1-4任意之一所述的印刷电路板，其特征在于，
    所述粘结层的材料为半固化片。
  6. 一种印刷电路板的制作方法，其特征在于，包括：
    在基板上进行开槽处理，形成空腔，所述空腔贯通所述基板；
    将填充体压入所述空腔内；
    将铜箔覆于所述基板的两面；
    将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
    在所述粘合后的基板上进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
    在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
  7. 根据权利要求6所述的制作方法，其特征在于，所述钻孔处理包括，
    在所述粘合后的基板上的非空腔区域进行钻孔处理。
  8. 一种印刷电路板，其特征在于，包括基板、粘结层、铜箔，其中：
    所述基板设有塞孔，所述塞孔贯通所述基板；
    所述塞孔包括可固化材料；
    所述基板的两个表面覆有所述铜箔；
    所述铜箔与所述基板之间通过所述粘结层粘合；
    所述铜箔的外表面镀有导电金属层；
    所述塞孔的位置设有过孔，所述过孔贯通所述基板以及所述粘结层；
    所述过孔的孔壁上渡有导电金属层。
  9. 根据权利要求8所述的印刷电路板，其特征在于，
    所述基板为具有多个发泡气孔的材料。
  10. 根据权利要求8或9所述的印刷电路板，其特征在于，
    所述可固化材料为树脂油墨。
  11. 根据权利要求8-10任意之一所述的印刷电路板，其特征在于，
    所述塞孔的数量为K个，K为大于等于1的任意整数；
    所述过孔的数量为M个，M为大于等于1的任意整数，M小于等于K。
  12. 根据权利要求8-11任意之一所述的印刷电路板，其特征在于，
    所述塞孔的半径小于等于0.6mm；所述塞孔的半径大于所述过孔的半径。
  13. 一种印刷电路板的制作方法，其特征在于，包括：
    在基板进行钻孔处理，形成塞孔，所述塞孔贯通所述基板；
    向所述塞孔中加入可固化材料；
    将所述铜箔覆于所述基板的两面；
    将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
    在所述粘合后的基板的所述塞孔位置进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
    在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
  14. 一种印刷电路板的制作方法，其特征在于，包括：
    将所述铜箔覆于所述基板的两面；
    将所述铜箔与所述基板通过粘结层粘合，得到粘合后的基板；
    将粘合后的基板进行压合处理，得到压合后的基板；
    将压合后的基板进行钻孔处理，形成塞孔，所述塞孔贯通所述压合后的基板；
    向所述塞孔中加入可固化材料；
    在所述压合后的基板的所述塞孔位置进行钻孔处理，形成过孔，所述过孔贯通所述粘合后的基板；
    在所述粘合后的基板的外表面，以及所述过孔的内壁镀导电金属层。
  15. 一种电子通讯设备，所述电子通讯设备包括天线以及如权利要求1-5任意之一或权利要求8-12任意之一的印刷电路板。
PCT/CN2022/071672 2021-01-13 2022-01-12 印刷电路板及其制作方法，以及一种电子通讯设备 Ceased WO2022152183A1 (zh)

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