WO2022160920A1 - 天线组件及电子设备 - Google Patents

天线组件及电子设备 Download PDF

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Publication number
WO2022160920A1
WO2022160920A1 PCT/CN2021/134511 CN2021134511W WO2022160920A1 WO 2022160920 A1 WO2022160920 A1 WO 2022160920A1 CN 2021134511 W CN2021134511 W CN 2021134511W WO 2022160920 A1 WO2022160920 A1 WO 2022160920A1
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WO
WIPO (PCT)
Prior art keywords
radiator
sub
mode
resonance
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/134511
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English (en)
French (fr)
Inventor
吴小浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to EP21922510.9A priority Critical patent/EP4266496A4/en
Publication of WO2022160920A1 publication Critical patent/WO2022160920A1/zh
Priority to US18/354,475 priority patent/US12388181B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
    • H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
    • H01Q25/04—Multimode antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/35—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/378—Combination of fed elements with parasitic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an antenna assembly and an electronic device.
  • the present application provides an antenna assembly and an electronic device that improve communication quality and facilitate the miniaturization of the whole machine.
  • an antenna assembly provided by an embodiment of the present application includes:
  • the first antenna including a first radiator and a first signal source electrically connected to the first radiator;
  • the second antenna includes a second radiator and a third radiator, a first coupling slot is formed between one end of the second radiator and one end of the first radiator, and the second radiator There is a second coupling slot between the other end of the body and one end of the third radiator;
  • the first radiator is used to generate at least one resonant mode under the excitation of the first signal source, and the second radiator is excited to be close to the second radiator through the first coupling slot under the excitation of the first signal source The portion of the second coupling slot produces at least one resonant mode.
  • the present application provides an electronic device, the electronic device includes a frame and the antenna assembly, the first radiator, the second radiator, the third radiator and the frame integrated into one body; alternatively, the first radiator, the second radiator, and the third radiator are formed on the surface of the frame; alternatively, the first radiator, the second radiator, The third radiator is arranged on a flexible circuit board, and the flexible circuit board is attached to the surface of the frame; and/or,
  • the frame includes a plurality of side edges that are connected end to end in sequence, and two adjacent side edges intersect; the first coupling slot and the second coupling slot are respectively arranged on the two intersecting sides of the frame. side; or, both the first coupling slit and the second coupling slit are arranged on the same side of the frame.
  • the radiator of the first antenna and the radiator of the second antenna by designing the radiator of the first antenna and the radiator of the second antenna to be capacitively coupled through the first coupling slot, the signal source of the first antenna can be coupled and excited through the first radiator
  • the radiator of the second antenna transmits and receives electromagnetic wave signals in the corresponding frequency band.
  • the radiator of the second antenna is also multiplexed as the radiator of the first antenna.
  • the radiator of the first antenna and the second antenna are saved.
  • the stacking space of the radiator can reduce the overall volume of the antenna assembly, which is beneficial to the overall miniaturization of the electronic device; by opening the second coupling slot in the radiator of the second antenna, the second radiator is located in the signal source of the first antenna.
  • At least one resonance mode can be generated near the second coupling slot under excitation, so as to increase the position where the resonance mode is generated, thereby increasing the number of generated resonance modes, and further increasing the bandwidth of the transmitting and receiving signals of the antenna assembly.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is an exploded schematic view of the electronic device shown in Fig. 1;
  • FIG. 3 is a schematic structural diagram of a first antenna assembly provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a first sub-resonance mode and a second sub-resonance mode provided by an embodiment of the present application;
  • FIG. 5 is a schematic diagram of the distribution of the first first sub-resonance mode, the second sub-resonance mode, the third sub-resonance mode, and the fourth sub-resonance mode provided by an embodiment of the present application;
  • FIG. 6 is a schematic diagram of the distribution of the second first sub-resonance mode, the second sub-resonance mode, the third sub-resonance mode, and the fourth sub-resonance mode provided by an embodiment of the present application;
  • FIG. 7 is a schematic diagram of the distribution of a third first sub-resonance mode, a second sub-resonance mode, a third sub-resonance mode, and a fourth sub-resonance mode provided by an embodiment of the present application;
  • FIG. 8 is a schematic diagram of the distribution of the first sub-resonance mode, the second sub-resonance mode, the third sub-resonance mode, the fourth sub-resonance mode, and the fifth sub-resonance mode provided by an embodiment of the present application;
  • FIG. 9 is a schematic structural diagram of a second antenna assembly provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a sixth sub-resonance mode provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of a seventh sub-resonance mode provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of a third antenna assembly provided by an embodiment of the present application.
  • FIG. 13 is a schematic diagram of a sixth sub-resonance mode moving to different frequency bands provided by an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a radio frequency link from a second signal source to a second radiator provided by an embodiment of the present application;
  • FIG. 15 is a schematic structural diagram of a first first matching circuit provided by an embodiment of the present application.
  • 16 is a schematic structural diagram of a second type of first matching circuit provided by an embodiment of the present application.
  • FIG. 17 is a schematic structural diagram of a third first matching circuit provided by an embodiment of the present application.
  • FIG. 18 is a schematic structural diagram of a fourth first matching circuit provided by an embodiment of the present application.
  • FIG. 19 is a schematic structural diagram of a fifth first matching circuit provided by an embodiment of the present application.
  • FIG. 20 is a schematic structural diagram of a sixth first matching circuit provided by an embodiment of the present application.
  • 21 is a schematic structural diagram of a seventh first matching circuit provided by an embodiment of the present application.
  • FIG. 22 is a schematic structural diagram of an eighth first matching circuit provided by an embodiment of the present application.
  • FIG. 23 is a schematic structural diagram of a fourth antenna assembly provided by an embodiment of the present application.
  • 24 is a schematic structural diagram of a third antenna assembly provided in an embodiment of the present application disposed in an electronic device;
  • 25 is another schematic structural diagram of a third antenna assembly provided in an embodiment of the present application disposed in an electronic device;
  • FIG. 26 is a schematic structural diagram of a fifth antenna assembly provided by an embodiment of the present application.
  • FIG. 27 is a schematic structural diagram of a sixth antenna assembly provided by an embodiment of the present application.
  • FIG. 28 is a schematic structural diagram of a seventh antenna assembly provided by an embodiment of the present application.
  • FIG. 29 is a schematic structural diagram of an eighth antenna assembly provided by an embodiment of the present application.
  • FIG. 30 is a schematic structural diagram of a ninth antenna assembly provided by an embodiment of the present application.
  • FIG. 31 is a schematic structural diagram of a tenth antenna assembly provided by an embodiment of the present application.
  • FIG. 32 is a schematic structural diagram of an eleventh antenna assembly provided by an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 1000 may be a phone, a TV, a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, a vehicle-mounted device, a headset, a watch, a wearable device, a base station, a vehicle-mounted radar, a Customer Premise Equipment (CPE), etc.
  • the electronic device 1000 is defined with reference to the first viewing angle, the width direction of the electronic device 1000 is defined as the X direction, the length direction of the electronic device 1000 is defined as the Y direction, and the electronic device The thickness direction of 1000 is defined as the Z direction.
  • the direction indicated by the arrow is positive.
  • the electronic device 1000 includes the antenna assembly 100 .
  • the antenna assembly 100 is used for transmitting and receiving radio frequency signals, so as to realize the communication function of the electronic device 1000 .
  • At least some components of the antenna assembly 100 are provided on the main board 200 of the electronic device 1000 .
  • the electronic device 1000 also includes a display screen 300, a battery 400, a casing 500, a camera, a microphone, a receiver, a speaker, a face recognition module, a fingerprint recognition module, and other devices that can realize the basic functions of the mobile phone. In this embodiment, details are not repeated.
  • the antenna assembly 100 is a built-in antenna of the electronic device 1000 .
  • the antenna assembly 100 is disposed in the housing of the electronic device 1000, and the specific location will be described later.
  • the antenna assembly 100 includes a first antenna 10 and a second antenna 20 .
  • the first antenna 10 and the second antenna 20 are antennas excited by different signal sources. This application does not limit the specific frequency bands of the first antenna 10 and the second antenna 20.
  • the first antenna 10 and the second antenna 20 can both be low-frequency antennas that support low-frequency signals; or, the first antenna One of the antennas 10 and the second antenna 20 is a medium-high-ultra-high frequency antenna supporting medium-high-ultra-high frequency signals, and the other is a low-frequency antenna supporting low-frequency signals; or, one of the first antenna 10 and the second antenna 20 Both are mid-high-ultra-high frequency antennas that support mid-high-ultra-high frequency signals.
  • the low frequency band (Lower Band, LB) refers to a frequency band with a frequency less than 1000 MHz.
  • the mid-high-ultra-high frequency band refers to the frequency band covered by the mid-high band (MHB) and the ultra-high band (Ultra High Band, UHB).
  • the mid-high frequency band is 1000MHz-3000MHz; the ultra-high frequency band is 3000MHz-10000MHz, which is a division method, but is not limited to this.
  • the low frequency frequency band is at least one of 4G LTE (Long Term Evolution, long term evolution) and 5G NR (New Radio).
  • specific application frequency bands include but are not limited to B28, B20, B5, B8, N28, N20, N5, N8, etc.
  • the low-frequency band can be loaded with 4G LTE signals alone, or 5G NR signals alone, or can also be loaded with 4G LTE signals and 5G NR signals at the same time, that is, to achieve dual connection between 4G wireless access network and 5G-NR (LTE NR Double Connect, EN-DC).
  • the mid-high-ultra-high frequency band is at least one of 4G LTE (Long Term Evolution, Long Term Evolution), 5G NR (New Radio), GPS-L1, GPS-L5, WIFI-2.4G, WIFI-5G, and the like.
  • specific application frequency bands include but are not limited to B32, B3, B39, B1, B40, B41, N78, N79, and so on.
  • the mid-high-ultra-high frequency band can be loaded with 4G LTE signals alone, or with 5G NR signals alone, or can also be loaded with 4G LTE signals and 5G NR signals at the same time, that is, to achieve dual connection between 4G wireless access network and 5G-NR ( LTE NR Double Connect, EN-DC).
  • the low-frequency frequency band, mid-high-ultra-high frequency frequency band transmitted and received by the antenna assembly 100 provided in this embodiment may also be aggregated by multiple carriers (carriers are radio waves of a specific frequency), that is, carrier aggregation (CA) is implemented to increase the The transmission bandwidth increases the signal transmission rate.
  • carrier aggregation CA
  • the first antenna 10 includes a first radiator 11 and a first signal source 12 electrically connected to the first radiator 11 .
  • the second antenna 20 includes a second radiator 21 and a third radiator 23 .
  • the second antenna 20 further includes a second signal source 22 , and the second signal source 22 is used to feed the second radiator 21 .
  • a second coupling slot 42 is provided between the other end of the second radiator 21 and one end of the third radiator 23 .
  • the application does not specifically limit the shapes of the first radiator 11 , the second radiator 21 , and the third radiator 23 , including but not limited to strips, sheets, rods, coatings, films, and the like.
  • the first radiator 11 , the second radiator 21 , and the third radiator 23 are all strip-shaped for illustration, but the extending direction is not limited, so the above-mentioned radiators can all be linear or curved. , multi-segment bending shape, etc.
  • the above-mentioned radiator may be a line with uniform width on the extending track, or may be a line with unequal width, such as a gradual change in width, a widened area, or the like.
  • the first coupling slit 41 is a slit between the first end of the first radiator 11 and the first end of the second radiator 21 , for example, the width of the slit is 0.5-2 mm, but not limited to this size.
  • the first radiator 11 and the second radiator 21 can be capacitively coupled through the first coupling slot 41 .
  • Capacitive coupling means that an electric field is generated between the first radiator 11 and the second radiator 21, the signal of the first radiator 11 can be transmitted to the second radiator 21 through the electric field, and the signal of the second radiator 21 can The electric field is transmitted to the first radiator 11 so that the first radiator 11 and the second radiator 21 can conduct electrical signals even in a disconnected state.
  • the second coupling slit 42 is a slit between the second end of the second radiator 21 and the first end of the third radiator 23 , and the slit has a width of 0.5 ⁇ 2 mm, but is not limited to this size.
  • the second radiator 21 and the third radiator 23 can be capacitively coupled through the second coupling slot 42 .
  • the second end of the first radiator 11 is grounded, and the second end of the third radiator 23 is grounded.
  • the radiator with respect to the antenna assembly 100 is grounded.
  • the antenna assembly 100 itself has a reference ground GND.
  • the specific form of the reference ground GND includes, but is not limited to, a directly exposed metal plate, a metal layer formed inside the flexible circuit board, and the like.
  • the radiator of the antenna assembly 100 is electrically connected to the reference ground GND of the antenna assembly 100 .
  • the reference ground GND of the antenna assembly 100 is electrically connected to the reference ground GND of the electronic device 1000 .
  • the antenna assembly 100 itself does not have the reference ground GND, and the radiator of the antenna assembly 100 is electrically connected to the reference ground GND of the electronic device 1000 or the electronic device in the electronic device 1000 through direct electrical connection or through an intermediate conductive connection.
  • Reference ground GND is electrically connected to the reference ground GND of the electronic device 1000 or the electronic device in the electronic device 1000 through direct electrical connection or through an intermediate conductive connection.
  • the first signal source 12 is a radio frequency transceiver chip for transmitting radio frequency signals or a power feeder electrically connected to the radio frequency transceiver chip for transmitting radio frequency signals.
  • the first radiator 11 is used to generate at least one resonance mode under the excitation of the first signal source 12 .
  • the first radiator 11 is also used to excite a portion of the second radiator 21 close to the second coupling slot 42 through the first coupling slot 41 to generate at least one resonance mode under the excitation of the first signal source 12 .
  • the resonant mode is characterized in that the electromagnetic wave transmission efficiency of the antenna assembly 100 is high at the resonant frequency of the resonant mode. That is to say, the second radiator 21 has high transceiving efficiency at a certain resonant frequency under the excitation of the first signal source 12, and can further support the transceiving of electromagnetic wave signals in a frequency band near the resonant frequency.
  • the radiator of the second antenna 20 can also be used by the first antenna 10 as a radiator of the first antenna 10 to generate a resonance mode, thus widening the frequency band of the antenna assembly 100; for the uncoupled antenna assembly 100, To achieve the above bandwidth, it is necessary to set a longer first radiator 11, or add a section of radiator beside the first radiator 11, which will make the stacking size of the entire antenna assembly 100 larger, and can be used in electronic devices with extremely limited space. Within 1000, the larger size of the antenna assembly 100 is not conducive to the miniaturization of the electronic device 1000.
  • the radiator of the first antenna 10 and the radiator of the second antenna 20 are capacitively coupled through the first coupling slot 41.
  • the first radiator 11 couples and excites the radiator of the second antenna 20 to send and receive electromagnetic wave signals in the corresponding frequency band.
  • the radiator of the second antenna 20 is also used as the radiator of the first antenna 10 to be multiplexed.
  • the stacking space of the radiator of the first antenna 10 and the radiator of the second antenna 20 reduces the overall volume of the antenna assembly 100 and facilitates the overall miniaturization of the electronic device 1000.
  • the slot 42 enables the second radiator 21 to generate at least one resonance mode near the second coupling slot 42 under the excitation of the signal source of the first antenna 10, or at least one resonance mode and At least one resonance mode is generated near the second coupling slot 42 to increase the position where the resonance mode is generated, thereby increasing the number of generated resonance modes, and further increasing the bandwidth of the antenna assembly 100 for transmitting and receiving signals.
  • the resonance frequency of the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 is different from the resonance frequency of the resonance mode generated by the second radiator 21 under the coupling excitation of the first radiator 11 .
  • the first signal source 12 excites the first radiator 11 to generate a resonance mode at a frequency, and at the same time, due to the capacitive coupling between the first radiator 11 and the second radiator 21, energy can be transmitted, and the first signal source 12 can also excite the second radiator 21 to produce a resonant mode at another frequency. Since the frequency at which the first radiator 11 generates the resonance mode is different from the frequency at which the second radiator 21 generates the resonance mode, the frequency band covered by the first radiator 11 under the excitation of the first signal source 12 is different from the frequency at which the second radiator 21 generates the resonance mode. The frequency bands covered by the excitation of a signal source 12 are different, and these frequency bands are combined to increase the frequency band width supported by the antenna assembly 100 and improve the transmission rate.
  • the first signal source 12 is a signal source that excites medium-high-ultra-high frequency, wherein the first signal source 12 excites both the first radiator 11 and the second radiator 21 to generate medium-high-ultra-high frequency electromagnetic wave signals .
  • the first signal source 12 may be a signal source that excites low-frequency signals, so as to excite the first radiator 11 and the second radiator 21 to generate low-frequency electromagnetic wave signals.
  • the frequency separation between the at least two resonance modes is relatively large, and the overlapping range of adjacent resonance modes is reduced, so as to further improve the first radiation.
  • the difference between the resonance frequency of the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 and the resonance frequency of the resonance mode generated by the second radiator 21 under the excitation of the first signal source 12 is a first preset difference
  • the value, for example, the first default value is 500M ⁇ 5000M, but not limited thereto.
  • the present application does not specifically limit the bandwidth of each resonance mode.
  • the resonance modes generated by the first radiator 11 and the second radiator 21 under the excitation of the first signal source 12 are adjacent and mutually continuous resonance modes, or may be separated resonance modes.
  • the resonance modes supported by the first radiator 11 and the second radiator 21 under the excitation of the first signal source 12 are adjacent and mutually continuous resonance modes
  • the resonance modes supported by the first radiator 11 and the second radiator 21 The frequency band can be aggregated into a wider frequency band through carrier aggregation to improve the transmission rate.
  • the frequency band supported by the first radiator 11 is 1500MHz to 2000MHz
  • the frequency band supported by the second radiator 21 is 2000MHz to 2500MHz, which can be aggregated to form a frequency band of 1500MHz to 2500MHz through carrier aggregation to achieve a bandwidth of 1000M.
  • the first radiator 11 is used to excite the part of the second radiator 21 close to the first coupling slot 41 and the second radiator through the first coupling slot 41 under the excitation of the first signal source 12 .
  • the portion of 21 close to the second coupling slot 42 generates at least one resonance mode.
  • the at least one resonance mode includes a first sub-resonance mode a and a second sub-resonance mode b.
  • the resonance mode generated by the second radiator 21 under the coupling excitation of the first radiator 11 includes at least the first sub-resonance mode a and the second sub-resonance mode b. in.
  • the resonant frequency of the first sub-resonant mode a is lower than the resonant frequency of the second sub-resonant mode b.
  • the second radiator 21 generates at least two resonance modes under the excitation of the first signal source 12, and the at least two resonance modes may all be generated by the second radiator 21 close to the first coupling slot 41, or may be completely generated by the second radiator 21 near the first coupling slot 41.
  • the two radiators 21 are generated near the second coupling slot 42 , and a part can be generated by the second radiator 21 near the first coupling slot 41 , and the other part is generated by the second radiator 21 near the second coupling slot 42 .
  • one of the first sub-resonance mode a and the second sub-resonance mode b is generated by the portion of the second radiator 21 close to the first coupling slot 41 , and the first sub-resonance mode a and the second sub-resonance mode b The other is generated by the part of the second radiator 21 close to the second coupling slot 42; or, the first sub-resonance mode a and the second sub-resonance mode b are both generated by the part of the second radiator 21 close to the second coupling slot 42 or, the first sub-resonance mode a and the second sub-resonance mode b are both generated by the part of the second radiator 21 close to the first coupling slot 41 .
  • the frequency band width covered by the excitation of the first signal source 12 is larger, and on the other hand, the utilization rate of the first antenna 10 for the second radiator 21 is higher, Therefore, while achieving higher bandwidth, the utilization rate of the first antenna 10 for the second radiator 21 is improved, the stacking size of the antenna assembly 100 is further reduced, and the miniaturized design of the electronic device 1000 to ensure high bandwidth is promoted.
  • the first sub-resonant mode a is generated by the part of the second radiator 21 close to the first coupling slot 41
  • the second sub-resonant mode b is generated by the part of the second radiator 21 close to the second coupling slot 42 . In this way, the first sub-resonance mode a and the second sub-resonance mode b are not affected by each other.
  • the length of the part of the second radiator 21 that generates the first sub-resonance mode a is set to be different from the length of the part of the second radiator 21 that generates the second sub-resonance mode b, so that the first sub-resonance mode a is
  • the frequencies of the resonant modes of the second sub-resonant mode b are different to cover a wider bandwidth.
  • the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 includes at least a third sub-resonance mode c and a fourth sub-resonance mode d.
  • the resonance frequency of the third sub-resonance mode c is lower than the resonance frequency of the fourth sub-resonance mode d.
  • the first radiator 11 can realize at least two resonance modes under the action of the first signal source 12, and the resonance frequency bands of the at least two resonance modes are different, so as to increase the frequency band width supported by the first radiator 11; further By designing the length of the first radiator 11 or the matching circuit, the frequency separation between the at least two resonant modes is relatively large, and the overlapping range of adjacent resonant modes is reduced, so as to further improve the frequency of the first radiator 11 . Supported band width.
  • the resonant frequency of the sub-resonant modes can be adjusted by adjusting the lengths or matching circuits of the first radiator 11 and the second radiator 21 where each sub-resonant mode is generated.
  • the present application does not specifically limit the order of the resonance frequencies of the first sub-resonance mode a, the second sub-resonance mode b, the third sub-resonance mode c, and the fourth sub-resonance mode d. It is exemplified by the following embodiments.
  • the resonant frequency of the second sub-resonant mode b is lower than the resonant frequency of the third sub-resonant mode c. That is, the resonance frequencies of the first sub-resonance mode a, the second sub-resonance mode b, the third sub-resonance mode c, and the fourth sub-resonance mode d increase sequentially.
  • the first signal source 12 transmits high-frequency signals
  • the second signal source 22 transmits low-frequency signals
  • the length of the first radiator 11 is relatively short
  • the length of the second radiator 21 is relatively long. Due to the above-mentioned size difference, when designing the excitation of the first signal source 12 to cover a high frequency band, the relatively long second radiator 21 can support a relatively low frequency band, so that it is convenient to design the resonant mode generated by the first radiator 11
  • the resonant frequency is greater than the resonant frequency of the resonant mode generated by the second radiator 21 , so as to increase the multiplexing length of the second antenna 20 for the second radiator 21 and increase the utilization rate of the second radiator 21 .
  • the magnitude of the resonant frequency may be inversely proportional to the length of the radiator that generates the resonant mode.
  • the resonant frequency of the second sub-resonant mode b is greater than the resonant frequency of the third sub-resonant mode c and less than the resonant frequency of the fourth sub-resonant mode d, and the first sub-resonant mode
  • the resonant frequency of a is smaller or larger than the resonant frequency of the third sub-resonant mode c.
  • the length of the radiation section of the first radiator 11 to generate the third sub-resonance mode c and the fourth sub-resonance mode d is designed.
  • the frequency band covered by the third sub-resonance mode c and the fourth sub-resonance mode d are When the covered frequency bands are discontinuous, but in actual use, when the frequency band between the frequency band covered by the third sub-resonance mode c and the frequency band covered by the fourth sub-resonance mode d needs to be used, the second radiator 21 can generate different frequency bands.
  • the length of the part of the sub-resonant mode or the matching circuit is designed so that the resonant frequency of the second sub-resonant mode b lies between the resonant frequency of the third sub-resonant mode c and the resonant frequency of the fourth sub-resonant mode d, so that the The two sub-resonance modes b cover the frequency band between the frequency band covered by the third sub-resonance mode c and the frequency band covered by the fourth sub-resonance mode d.
  • the first sub-resonance mode The resonant frequency of the resonant mode a is also located between the resonant frequency of the third sub-resonance mode c and the resonant frequency of the fourth sub-resonance mode d, so that the frequency band covered by the third sub-resonance mode c and the frequency band covered by the first sub-resonant mode a
  • the frequency band, the frequency band covered by the second sub-resonance mode b, and the frequency band covered by the fourth sub-resonance mode d form a continuous or nearly continuous frequency band, or cover the required frequency band, which improves the range of the frequency band supported by the electronic device 1000 and that of the operator.
  • the correspondence of the provided frequency band ranges improves the communication quality of the electronic device 1000 .
  • the resonant frequency of the second sub-resonant mode b is greater than the resonant frequency of the fourth sub-resonant mode d, and the resonant frequency of the first sub-resonant mode a is less than the third sub-resonant mode c the resonant frequency.
  • the resonant frequency of the second sub-resonant mode b is greater than the resonant frequency of the fourth sub-resonant mode d
  • the resonant frequency of the first sub-resonant mode a is greater than the resonant frequency of the third sub-resonant mode c and less than the fourth sub-resonant mode c
  • the resonant frequency of the sub-resonance mode d is greater than the resonant frequency of the fourth sub-resonant mode d.
  • the first antenna 10 needs to support higher frequency signals while the second radiator 21
  • the length of the part of the second radiator 21 that generates the sub-resonance mode or the matching circuit can be adjusted, so that the second radiator 21 can generate the second sub-resonance mode b of a higher frequency band to meet the requirements of the first antenna. 10 Support for higher frequency band signals.
  • the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 further includes a fifth sub-resonance mode e.
  • the resonance frequency of the fifth sub-resonance mode e, the resonance frequency of the first sub-resonance mode a, the resonance frequency of the second sub-resonance mode b, the resonance frequency of the third sub-resonance mode c, and the resonance frequency of the fourth sub-resonance mode d are in order Increase.
  • the fifth sub-resonance mode e is a resonance mode in which the first radiator 11 operates at high-order resonance.
  • the third sub-resonance mode c is the resonance mode in which the first radiator 11 operates in the ground state.
  • the resonant frequency of the fifth sub-resonant mode e is relatively low among the resonant frequencies of the resonant modes excited and generated by the first signal source 12 to achieve coverage of a relatively low frequency band in the frequency band covered by the first antenna 10 .
  • the length of the first radiator 11 is relatively short, the resonant mode in the ground state cannot support the relatively low frequency band, so the signal transmitted by the first signal source 12 is fed into the first radiator by capacitive coupling. 11, in order to excite the first radiator 11 to generate high-order resonance, thereby realizing the excitation of a relatively low frequency band on the relatively short first radiator 11, improving the utilization rate of the first radiator 11 and increasing the first antenna 10 supported bandwidth.
  • the first sub-resonance mode a, the second sub-resonance mode b, the third sub-resonance mode c, the fourth sub-resonance mode d, and the fifth sub-resonance mode e can all pass through.
  • the carrier aggregation method is used for aggregation to form a relatively wide bandwidth of the frequency band and improve the signal transmission rate.
  • the first signal source 12 is a signal source for sending mid-high-ultra-high frequency signals.
  • the bandwidth of the frequency band formed by the combination of the frequency band covered by the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 and the frequency band covered by the resonance mode generated by the second radiator 21 under the excitation of the first signal source 12 is: 500M ⁇ 5000M; that is, the frequency bands covered by the fifth sub-resonance mode e, the first sub-resonance mode a, the second sub-resonance mode b, the third sub-resonance mode c, and the fourth sub-resonance mode d are synthesized larger after carrier aggregation.
  • the bandwidth of the frequency band for example, 500M ⁇ 5000M, but not limited to this.
  • the frequency band covered by the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 and the frequency band covered by the resonance mode generated by the second radiator 21 under the excitation of the first signal source 12 are both greater than 1000MHz .
  • the frequency band formed by the combination of the frequency band covered by the resonance mode generated by the first radiator 11 under the excitation of the first signal source 12 and the frequency band covered by the resonance mode generated by the second radiator 21 under the excitation of the first signal source 12 Covering 1000MHz ⁇ 6000MHz.
  • the first antenna 10 can be used to support at least one of 4G LTE mid-high-ultra-high frequency band, 5G NR mid-high-ultra-high frequency band, GPS-L1, GPS-L5, WIFI-2.4G, WIFI-5G, and the like.
  • the present application does not specifically limit the specific structures of the first antenna 10 and the second antenna 20 , and the specific structures of the first antenna 10 and the second antenna 20 are exemplified in the following embodiments.
  • the first radiator 11 is in the shape of a long strip.
  • the first radiator 11 includes a first ground terminal A, a first coupling terminal 111 and a first feeding point B disposed between the first ground terminal A and the first coupling terminal 111 .
  • the first ground terminal A and the first coupling terminal 111 are opposite ends of the first radiator 11 .
  • the first ground terminal A is grounded.
  • the first ground terminal A is electrically connected to the reference ground GND of the antenna assembly 100 or electrically connected to the reference ground GND of the electronic device 1000 .
  • the first feeding point B is the position where the signal is fed into the first radiator 11 .
  • the first coupling end 111 is the end of the first radiator 11 that forms the first coupling slot 41 .
  • the first antenna 10 further includes a first matching circuit M1.
  • One end of the first matching circuit M1 is electrically connected to the first signal source 12 .
  • the other end of the first matching circuit M1 is electrically connected to the first feeding point B.
  • the first signal source 12 is used to generate or transmit the excitation signal
  • the first matching circuit M1 is used to filter the clutter in the excitation signal transmitted by the first signal source 12, and transmit the excitation signal to the first signal source 12.
  • a radiator 11 makes the first radiator 11 generate a third sub-resonance mode c, a fourth sub-resonance mode d, and a fifth sub-resonance mode e under the excitation of the excitation signal.
  • the first radiator 11 When the first radiator 11 generates a resonant mode, it indicates that the first radiator 11 has better transmission and reception efficiency at a certain resonant frequency, and further indicates that the first radiator 11 has a certain frequency band range where the resonant frequency is the center frequency. Better transceiver efficiency, in other words, the first signal source 12 acting on the first radiator 11 can support this frequency range.
  • the first radiator 11 between the first ground terminal A and the first coupling terminal 111 generates a third sub-resonance mode c under the action of the first signal source 12 .
  • the impedance of the first matching circuit M1 is low impedance relative to the resonant frequency of the third sub-resonance mode c, and the first matching circuit M1 feeds the space between the first ground terminal A and the first coupling terminal 111 with low impedance.
  • the first radiator 11 generates a 1/4 wavelength resonance mode, and the 1/4 wavelength resonance mode is also a ground state resonance mode, and this mode corresponds to a higher transmission and reception efficiency.
  • the effective electrical length of the first radiator 11 between the first ground terminal A and the first coupling terminal 111 is 1/4 of the wavelength corresponding to the resonant frequency of the third sub-resonance mode c, or, in the matching circuit Under tuning, the equivalent effective electrical length of the first radiator 11 between the first ground terminal A and the first coupling terminal 111 is 1/4 of the wavelength corresponding to the resonance frequency of the third sub-resonance mode c.
  • the third sub-resonant mode c generated by the first radiator 11 has high transceiving efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonance frequency of the third sub-resonant mode c as the center frequency.
  • the first radiator 11 between the first feeding point B and the first coupling end 111 generates a fourth sub-resonance mode d under the action of the first signal source 12 .
  • the impedance of the first matching circuit M1 is low impedance relative to the resonant frequency of the fourth sub-resonance mode d.
  • the first matching circuit M1 feeds the first radiator 11 between the first feeding point B and the first coupling end 111 with a low impedance to generate a 1/4 wavelength resonance mode.
  • the 1/4 wavelength resonant mode is also a ground state resonant mode, which corresponds to a relatively high transmission and reception efficiency.
  • the effective electrical length of the first radiator 11 between the first feeding point B and the first coupling end 111 is 1/4 of the wavelength corresponding to the resonant frequency of the fourth sub-resonance mode d, or, in the matching circuit Under the tuning of , the equivalent effective electrical length of the first radiator 11 between the first feeding point B and the first coupling end 111 is 1/4 of the wavelength corresponding to the resonant frequency of the fourth sub-resonant mode d.
  • the fourth sub-resonance mode d generated by the first radiator 11 has higher transmission and reception efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonance frequency of the fourth sub-resonance mode d as the center frequency.
  • the first radiator 11 between the first ground terminal A and the first coupling terminal 111 generates a fifth sub-resonance mode e under the capacitive coupling feed of the first signal source 12 .
  • the impedance of the first matching circuit M1 is high impedance relative to the resonant frequency of the fifth sub-resonance mode e, and the first matching circuit M1 feeds the space between the first ground terminal A and the first coupling terminal 111 with high impedance.
  • the first radiator 11 of the 1/8 wavelength resonance mode is generated.
  • the effective electrical length of the first radiator 11 between the first ground terminal A and the first coupling terminal 111 is 1/8 of the wavelength corresponding to the resonant frequency of the fifth sub-resonance mode e, or, in the matching circuit Under tuning, the equivalent effective electrical length of the first radiator 11 between the first ground terminal A and the first coupling terminal 111 is 1/8 of the wavelength corresponding to the resonance frequency of the fifth sub-resonance mode e.
  • the fifth sub-resonant mode e generated by the first radiator 11 has high transceiving efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonance frequency of the fifth sub-resonant mode e as the center frequency.
  • the above first radiator 11 generates the third sub-resonance mode c, the fourth sub-resonance mode d, and the fifth sub-resonance mode e under the excitation of the first signal source 12, so that one radiator can generate multiple resonance modes, and these The frequencies of the resonant modes are different, and these resonant modes can be aggregated by carriers to form a frequency band with a wider bandwidth on a small-sized antenna, thereby realizing that the first antenna 10 can be applied to support various types of network communication signals.
  • the second radiator 21 includes a second coupling end 211 , a third coupling end 212 , a first resonant point C and a second feeding that are sequentially disposed between the second coupling end 211 and the third coupling end 212 .
  • Point E second resonance point F.
  • the third radiator 23 includes a fourth coupling end 213 and a second ground end G.
  • the second ground terminal G is grounded.
  • the second coupling end 211 is the end of the second radiator 21 where the first coupling slot 41 is formed.
  • the second radiator 21 has an elongated shape.
  • the second coupling end 211 and the third coupling end 212 are opposite ends of the second radiator 21 .
  • the first coupling end 111 is opposite to the second coupling end 211 and the interval therebetween is the first coupling slot 41 .
  • the third coupling end 212 is the end that forms the second coupling slot 42 .
  • a second coupling slot 42 is formed between the third coupling end 212 and the fourth coupling end 213 .
  • the second feeding point E is the position where the signal is fed into the second radiator 21 .
  • the second antenna 20 further includes a second matching circuit M2, a third matching circuit M3, and a fourth matching circuit M4.
  • One end of the second matching circuit M2 is grounded, and the other end of the second matching circuit M2 is electrically connected to the first resonance point C.
  • One end of the third matching circuit M3 is grounded, and the other end of the third matching circuit M3 is electrically connected to the second resonance point F.
  • One end of the fourth matching circuit M4 is electrically connected to the second signal source 22 , and the other end of the fourth matching circuit M4 is electrically connected to the second feeding point E.
  • the excitation energy of the first signal source 12 is radiated by the first The body 11 is transmitted to the second radiator 21 , and the second radiator 21 between the first resonance point C and the second coupling end 211 generates the first sub-resonance mode a under the coupling excitation of the first radiator 11 .
  • the impedance of the first matching circuit M1 is low impedance relative to the resonant frequency of the first sub-resonance mode a
  • the second radiator between the first resonant point C and the second coupling end 211 is fed with low impedance to excite the second radiator 21 generates a 1/4 wavelength resonance mode
  • the 1/4 wavelength resonance mode is also a ground-state resonance mode, and this mode corresponds to a higher transmission and reception efficiency.
  • the impedance of the second matching circuit M2 is in a low impedance state relative to the frequency of the first sub-resonance mode a, so that the signal of the first sub-resonance mode a passes through the second matching circuit M2 and goes to the ground through low impedance.
  • the effective electrical length of the second radiator 21 between the first resonance point C and the second coupling end 211 is 1/4 of the wavelength corresponding to the resonance frequency of the first sub-resonance mode a, or, under the tuning of the matching circuit,
  • the equivalent effective electrical length of the second radiator 21 between the first resonance point C and the second coupling end 211 is set to be 1/4 of the wavelength corresponding to the resonance frequency of the first sub-resonance mode a.
  • the first sub-resonant mode a generated by the second radiator 21 has high transmission and reception efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonance frequency of the first sub-resonant mode a as the center frequency.
  • the excitation energy of the first signal source 12 is radiated by the first The body 11 is transmitted to the second radiator 21 , and the second radiator 21 between the second resonance point F and the third coupling end 212 generates a second sub-resonance mode b under the coupling excitation of the first radiator 11 .
  • the impedance of the first matching circuit M1 is low impedance relative to the resonant frequency of the second sub-resonance mode b, and the second radiator between the second resonance point F and the third coupling end 212 is fed with low impedance to excite the second radiator 21 generates a 1/4 wavelength resonance mode, and the 1/4 wavelength resonance mode is also a ground-state resonance mode, and this mode corresponds to a higher transmission and reception efficiency.
  • the impedance of the third matching circuit M3 is in a low impedance state with respect to the frequency of the second sub-resonance mode b, so that the signal of the second sub-resonance mode b passes through the third matching circuit M3 and goes to ground with low impedance.
  • the effective electrical length of the second radiator 21 between the second resonance point F and the third coupling end 212 is 1/4 of the wavelength corresponding to the resonance frequency of the second sub-resonance mode b, or, under the tuning of the matching circuit,
  • the equivalent effective electrical length of the second radiator 21 between the second resonance point F and the third coupling end 212 is set to be 1/4 of the wavelength corresponding to the resonance frequency of the second sub-resonance mode b. In this way, the second sub-resonance mode b generated by the second radiator 21 has higher transmission and reception efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonant frequency of the second sub-resonance mode b as the center frequency.
  • the part between the second coupling end 211 and the first resonance point C, the part between the second resonance point F and the third coupling end 212 in the above second radiator 21 can be transmitted and received by the first antenna 10 for medium-high and ultra-high frequencies Compared with the non-integrated antenna, the antenna assembly 100 greatly reduces the size of its radiator, which is beneficial to the miniaturization of the electronic device 1000. Moreover, the above-mentioned five resonance modes are generated by the first radiator 11 and the second radiator 21, which greatly increases the bandwidth of the first antenna 10 for transmitting and receiving mid-high-ultra-high frequency signals.
  • the second signal source 22 is used to generate or transmit the excitation signal.
  • the fourth matching circuit M4 is used to filter the clutter in the excitation signal transmitted by the second signal source 22, and transmit the excitation signal to the second radiator 21, and the second radiator 21 and the third radiator 23 pass through the second radiator 21.
  • the coupling slot 42 performs capacitive coupling, and the second radiator 21 and the third radiator 23 generate a resonance mode under the excitation of the excitation signal.
  • the second radiator 21 generates at least one resonance mode under the excitation of the second signal source 22 .
  • the frequency band covered by the resonance mode generated by the second radiator 21 under the excitation of the second signal source 22 is less than 1000 MHz. In other words, the second radiator 21 covers the low frequency band under the excitation of the second signal source 22 .
  • the second radiator 21 has dual functions. On the one hand, it can serve as the radiator of the first antenna 10 to send and receive mid-high-ultra-high frequency signals, and on the other hand, it can serve as the radiator of the second antenna 20 to send and receive low-frequency signals.
  • the utilization rate of the second radiator 21 is increased, and the overall size of the antenna assembly 100 is further reduced.
  • the second radiator 21 between the first resonance point C and the third coupling end 212 generates at least one resonance mode under the excitation of the second signal source 22 .
  • the second radiator 21 between the first resonance point C and the third coupling end 212 generates a resonance mode which is a sixth sub-resonance mode f under the excitation of the second signal source 22 .
  • the impedance of the fourth matching circuit M4 is low impedance relative to the resonant frequency of the sixth sub-resonance mode f, and the second radiator between the first resonance point C and the third coupling end 212 is fed with low impedance to excite the second radiator 21 generates a 1/4 wavelength resonance mode, and the 1/4 wavelength resonance mode is also a ground-state resonance mode, and this mode corresponds to a higher transmission and reception efficiency.
  • the impedance of the second matching circuit M2 is in a low impedance state with respect to the frequency of the sixth sub-resonance mode f, so that the signal of the sixth sub-resonance mode f can pass through the second matching circuit M2 and go to ground with low impedance.
  • the effective electrical length of the second radiator 21 between the first resonance point C and the third coupling end 212 is 1/4 of the wavelength corresponding to the resonance frequency of the sixth sub-resonance mode f, or, under the tuning of the matching circuit,
  • the equivalent effective electrical length of the second radiator 21 between the first resonance point C and the third coupling end 212 is set to be 1/4 of the wavelength corresponding to the resonance frequency of the sixth sub-resonance mode f.
  • the sixth sub-resonance mode f generated by the second radiator 21 has higher transmission and reception efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonance frequency of the sixth sub-resonance mode f as the center frequency.
  • the second radiator 21 between the second resonance point F and the second coupling end 211 generates at least one resonance mode under the excitation of the second signal source 22 .
  • the second radiator 21 between the second resonance point F and the second coupling end 211 generates a resonance mode as the seventh sub-resonance mode g under the excitation of the second signal source 22 .
  • the impedance of the fourth matching circuit M4 is low impedance relative to the resonant frequency of the seventh sub-resonance mode g, and the second radiator between the second resonance point F and the second coupling end 211 is fed with low impedance to excite the second radiator 21 generates a 1/4 wavelength resonance mode, and the 1/4 wavelength resonance mode is also a ground-state resonance mode, and this mode corresponds to a higher transmission and reception efficiency.
  • the impedance of the third matching circuit M3 is in a low impedance state with respect to the frequency of the seventh sub-resonance mode g, so that the signal of the seventh sub-resonance mode g goes to ground through the third matching circuit M3 through low impedance.
  • the effective electrical length of the second radiator 21 between the second resonance point F and the second coupling end 211 is 1/4 of the wavelength corresponding to the resonance frequency of the seventh sub-resonance mode g, or, under the tuning of the matching circuit,
  • the equivalent effective electrical length of the second radiator 21 between the second resonance point F and the second coupling end 211 is set to be 1/4 of the wavelength corresponding to the resonance frequency of the seventh sub-resonance mode g. In this way, the seventh sub-resonance mode g generated by the second radiator 21 has high transmission and reception efficiency, and the antenna assembly 100 has better performance in the frequency band with the resonance frequency of the seventh sub-resonance mode g as the center frequency.
  • the antenna assembly 100 may control the second radiator 21 to generate one of the sixth sub-resonance mode f and the seventh sub-resonance mode g to support the low frequency band.
  • the resonance frequency of the sixth sub-resonance mode f may be greater than, less than or equal to the resonance frequency of the seventh sub-resonance mode g.
  • the second radiator 21 further includes a frequency modulation point D. As shown in FIG.
  • the frequency modulation point D is located between the first resonance point C and the second feeding point E.
  • the second antenna 20 also includes a fifth matching circuit M5. One end of the fifth matching circuit M5 is grounded. The other end of the fifth matching circuit M5 is electrically connected to the frequency modulation point D.
  • At least one of the second matching circuit M2 , the third matching circuit M3 , the fifth matching circuit M5 and the fourth matching circuit M4 is used to adjust the resonance of the resonance mode generated by the second radiator 21 under the excitation of the second signal source 22 frequency.
  • any one of the second matching circuit M2 , the third matching circuit M3 , the fifth matching circuit M5 and the fourth matching circuit M4 can be used to adjust the effect of the second radiator 21 on the second signal source 22
  • the resonant frequency of the resonant mode generated under excitation so that the resonant frequency of the resonant mode generated by the second radiator 21 under the excitation of the second signal source 22 is moved toward the low frequency band or toward the high frequency band, so that the second radiator 21
  • the resonant frequency of the resonant mode generated under the excitation of the second signal source 22 can cover the low frequency band of 500MHz to 1000MHz in different time periods, so as to cover the application frequency bands such as B28, B20, B5, B8, N28, N20, N5, N8, etc. .
  • the resonant frequency of the resonant mode generated by the second radiator 21 under the excitation of the second signal source 22 is 780 MHz, which can support the frequency band of 740 MHz ⁇ 820 MHz.
  • the sub-resonance mode f supports the frequency band of 500MHz to 580MHz, the frequency band of 580MHz to 660MHz, the frequency band of 660MHz to 740MHz, the frequency band of 820MHz to 900MHz, and the frequency band of 900MHz to 980MHz.
  • the tuning method for the high frequency signal generated by the first antenna 10 includes but is not limited to the following embodiments, the first sub-resonance mode a can be tuned by the second matching circuit M2, and the second sub-resonant mode b can be tuned by the third The matching circuit M3 is tuned.
  • the third sub-resonance mode c, the fourth sub-resonance mode d and the fifth sub-resonance mode e can be tuned by the first matching circuit M1.
  • the first matching circuit M1 to the fifth matching circuit M5 all have the function of changing the impedance of the radiator, and the present application does not specifically limit the structures of the first matching circuit M1 to the fifth matching circuit M5.
  • the first matching circuit M1 to the fifth matching circuit M5 include, but are not limited to, capacitors, inductors, resistors, etc., which are arranged in series and/or in parallel.
  • the first matching circuit M1 may include a plurality of branches formed by capacitors, inductors, and resistors connected in series and/or parallel, and a switch for controlling the on-off of the plurality of branches.
  • the frequency selection parameters (including resistance value, inductance value and capacitance value) of the first matching circuit M1 can be adjusted, and then the impedance of the first matching circuit M1 can be adjusted, so that the transmission impedance of the feeding branch can be adjusted. Matching with the impedance of the first radiator 11 improves the transmission and reception efficiency of the first radiator 11 .
  • the first matching circuit M1 can also adjust the effective electrical length of the first radiator 11 by adjusting its impedance, thereby adjusting the resonant frequency of the resonant mode generated by the first radiator 11 to move toward the high frequency direction or the low frequency direction, thereby Adjust the frequency range covered by the first radiator 11 to increase the supportable frequency bandwidth.
  • the first matching circuit M1 further includes an adjustable capacitor, and the adjustable capacitor can adjust its capacitance value, and then adjust the impedance value of the first matching circuit M1, so that the transmission impedance of the feeding branch is consistent with the first radiation.
  • the impedance matching of the first radiator 11 improves the transmission and reception efficiency of the first radiator 11; and the resonant frequency of the resonance mode generated by the first radiator 11 is adjusted to move toward the high frequency direction or the low frequency direction, thereby adjusting the frequency range covered by the first radiator 11. , to increase the supported bandwidth range.
  • the structure of the second matching circuit M2 to the fifth matching circuit M5 can refer to the structure and adjustment method of the first matching circuit M1, so as to achieve impedance matching and improve the transmission and reception efficiency of the antenna assembly 100; Frequency range, increase the supportable bandwidth range. I won't go into details here.
  • the first matching circuit M1 and the fourth matching circuit M4 also have filtering functions to increase the isolation between the first antenna 10 and the second antenna 20 .
  • the first signal source 12 and the second signal source 22 are the same signal source
  • the first matching circuit M1 is provided with a high frequency band pass branch electrically connected between the first signal source 12 and the first radiator 11
  • the fourth matching circuit M4 is electrically connected to the low frequency band pass branch between the second signal source 22 and the second radiator 21 by setting, In order to transmit the low frequency signal in the second signal source 22 to the second radiator 21 .
  • the first matching circuit M1 and the second matching circuit M2 filter out the high-frequency signal and the low-frequency signal respectively, the high-frequency signal and the low-frequency signal have better isolation due to the difference in frequency, thereby realizing the first antenna 10 and the second antenna 20 The mutual interference between them is small and the isolation degree is high.
  • a clutter filtering circuit may be further provided in the fourth matching circuit M4 to reduce the interference of clutter to the second antenna 20 and the first antenna 10 .
  • the second antenna 20 further includes a medium and high frequency band pass branch 214 .
  • One end of the mid-high frequency band pass branch 214 is grounded.
  • the other end of the mid-high frequency band pass branch 214 is electrically connected to the fourth matching circuit M4.
  • the mid-high frequency band pass branch 214 includes an inductor and a capacitor arranged in series, one end of the capacitor is electrically connected to the fourth matching circuit M4, the other end of the capacitor is electrically connected to one end of the inductor, and the other end of the inductor is grounded.
  • the high frequency band pass branch 214 connected in parallel to the ground is added to filter out the high frequency clutter in the second signal source 22, thereby realizing that the second antenna 20 will not be subjected to high frequency clutter.
  • the high-frequency clutter in the second antenna 20 will not interfere with the first signal source 12 , thereby improving the isolation between the first antenna 10 and the second antenna 20 .
  • the first matching circuit M1 may be provided with a grounded low-frequency band pass branch to filter out low-frequency clutter in the first signal source 12, so as to prevent the low-frequency clutter from interfering with the signal transmission and reception of the first antenna 10, while also enabling The low-frequency clutter is prevented from interfering with the signal transmission and reception of the second antenna 20, and the isolation between the first antenna 10 and the second antenna 20 is increased.
  • FIG. 15 to FIG. 22 are schematic diagrams of the first matching circuit M1 provided by various embodiments, respectively.
  • the first matching circuit M1 includes one or more of the following circuits.
  • the first matching circuit M1 includes a bandpass circuit formed by an inductor L0 and a capacitor C0 connected in series.
  • the first matching circuit M1 includes a band-stop circuit formed by an inductor L0 and a capacitor C0 in parallel.
  • the first matching circuit M1 includes an inductor L0, a first capacitor C1, and a second capacitor C2.
  • the inductor L0 is connected in parallel with the first capacitor C1, and the second capacitor C2 is electrically connected to a node where the inductor L0 and the first capacitor C1 are electrically connected.
  • the first matching circuit M1 includes a capacitor C0, a first inductor L1, and a second inductor L2.
  • the capacitor C0 is connected in parallel with the first inductor L1, and the second inductor L2 is electrically connected to a node where the capacitor C0 and the first inductor L1 are electrically connected.
  • the first matching circuit M1 includes an inductor L0, a first capacitor C1, and a second capacitor C2.
  • the inductor L0 is connected in series with the first capacitor C1, and one end of the second capacitor C2 is electrically connected to the first end of the inductor L0 that is not connected to the first capacitor C1, and the other end of the second capacitor C2 is electrically connected to one end of the first capacitor C1 that is not connected to the inductor L0.
  • the first matching circuit M1 includes a capacitor C0, a first inductor L1, and a second inductor L2.
  • the capacitor C0 is connected in series with the first inductor L1, one end of the second inductor L2 is electrically connected to the end of the capacitor C0 not connected to the first inductor L1, and the other end of the second inductor L2 is electrically connected to the end of the first inductor L1 not connected to the capacitor C0.
  • the first matching circuit M1 includes a first capacitor C1, a second capacitor C2, a first inductor L1, and a second inductor L2.
  • the first capacitor C1 is connected in parallel with the first inductor L1
  • the second capacitor C2 is connected in parallel with the second inductor L2, and one end of the whole formed by the second capacitor C2 and the second inductor L2 in parallel is electrically connected to the first capacitor C1 and the first inductor L1 in parallel. form one end of the whole.
  • the first matching circuit M1 includes a first capacitor C1, a second capacitor C2, a first inductor L1, and a second inductor L2.
  • the first capacitor C1 and the first inductor L1 are connected in series to form the first unit 101, and the second The capacitor C2 and the second inductor L2 are connected in series to form the second unit 102 , and the first unit 101 and the second unit 102 are connected in parallel.
  • the first matching circuit M1 exhibits different band-pass and band-stop characteristics in different frequency bands.
  • the antenna assembly 100 also includes a first controller (not shown).
  • the first controller is configured to determine the radiation mode of the second radiator 21 according to whether the first coupling slot 41 and the second coupling slot 42 are in a free radiation scenario or a radiation blocking scenario.
  • the free radiation scenario means that the first coupling slot 41 and the second coupling slot 42 are not blocked by electrical conductors or objects with static electricity or the like.
  • the radiation blocking scenario is that the first coupling slot 41 and the second coupling slot 42 are blocked by conductors or objects with static electricity. For example, the operator's hand covers the first coupling slot 41 and the second coupling slot 42 .
  • the first controller is configured to determine that the second radiator 21 is the first radiation mode according to the first coupling slot 41 in the free radiation scenario and the second coupling slot 42 in the radiation blocking scenario, wherein the first radiation mode is the first signal source 12 Excites the second radiator 21 between the second resonance point F and the second coupling end 211 to generate at least one resonance mode.
  • the first controller is further configured to determine that the second radiator 21 is in the second radiation mode according to the radiation blocking scenario of the first coupling slot 41 and the free radiation scenario of the second coupling slot 42 , wherein the second radiation mode is the first radiation mode.
  • the signal source 12 excites the second radiator 21 between the first resonance point C and the third coupling end 212 to generate at least one resonance mode under the excitation of the second signal source 22 .
  • the first controller is further configured to determine whether the second radiator 21 is the first radiation mode or the second radiation mode according to when both the first coupling slot 41 and the second coupling slot 42 are in a free radiation scene.
  • the present application does not limit the specific structure of the first controller to control the second radiator 21 to switch the radiation mode. It is exemplified by the following embodiments.
  • the second matching circuit M2 includes at least one first selection switch 311 , a first high-impedance branch 312 and a first low-impedance branch 313 .
  • the first selection switch 311 is used to select one of the first high-impedance branch 312 and the first low-impedance branch 313 to be electrically connected to the first resonance point C.
  • the first selection switch 311 is a "single pole double throw" switch, the first end of the first selection switch 311 is electrically connected to the first resonance point C of the second radiator 21, and the second end of the first selection switch 311 is electrically connected to the first high One end of the impedance branch 312, the other end of the first high impedance branch 312 is grounded, and the third end of the first selection switch 311 is electrically connected to one end of the first low impedance branch 313. The other end is grounded.
  • the first controller is electrically connected to the control terminal of the first selection switch 311 to control the first selection switch 311 to select the first high impedance branch 312 or the first low impedance branch 313 to be electrically connected to the first resonance point C.
  • the first selection switch 311 may also include two sub-switches, which are respectively connected from the first resonance point C to the first high-impedance branch 312 and the first resonance point C to the first low-impedance branch 313 .
  • the second matching circuit M2 may also include other impedance branches.
  • the first high-impedance branch 312 has a high impedance relative to the resonant frequency of the resonant mode generated by the second radiator 21 under the excitation of the second signal source 22
  • the first low-impedance branch 313 has a high impedance relative to the second radiator 21
  • the body 21 has a low impedance with respect to the resonant frequency of the resonant mode generated by the excitation of the second signal source 22 .
  • the first high-impedance branch 312 includes, but is not limited to, a large capacitor and the like.
  • the first low-impedance branch 313 includes, but is not limited to, direct grounding, small inductance, and the like.
  • the third matching circuit M3 includes at least one second selection switch 314 , a second high-impedance branch 315 and a second low-impedance branch 316 .
  • the second selection switch 314 is used to select one of the second high-impedance branch 315 and the second low-impedance branch 316 to be electrically connected to the second resonance point F.
  • the second selection switch 314 is a "single pole double throw" switch, the first end of the second selection switch 314 is electrically connected to the second resonance point F of the second radiator 21, and the second end of the second selection switch 314 is electrically connected to the second high One end of the impedance branch 315, the other end of the second high impedance branch 315 is grounded, the third end of the second selection switch 314 is electrically connected to one end of the second low impedance branch 316, and the second low impedance branch 316 The other end is grounded.
  • the first controller is electrically connected to the control terminal of the second selection switch 314 to control the second selection switch 314 to select the second high impedance branch 315 or the second low impedance branch 316 to be electrically connected to the second resonance point F.
  • the second selection switch 314 may also include two sub-switches, which are respectively connected from the second resonance point F to the second high-impedance branch 315 and the second resonance point F to the second low-impedance branch 316 .
  • the second matching circuit M2 may also include other impedance branches.
  • the second high-impedance branch 315 has a high impedance relative to the resonant frequency of the resonant mode generated by the second radiator 21 under the excitation of the second signal source 22
  • the second low-impedance branch 316 has a high impedance relative to the second radiation
  • the body 21 has a low impedance with respect to the resonant frequency of the resonant mode generated by the excitation of the second signal source 22 .
  • the first high-impedance branch 312 includes, but is not limited to, a large capacitor and the like.
  • the first low-impedance branch 313 includes, but is not limited to, direct grounding, small inductance, and the like.
  • the first controller electrically connects the first selection switch 311 and the second selection switch 314 .
  • the first controller is configured to control the first selection switch 311 to conduct the first high-impedance branch 312 and the first resonance point C according to the fact that the first coupling slot 41 is in a free radiation scenario and the second coupling slot 42 is in a radiation blocking scenario, and
  • the second selection switch 314 is controlled to turn on the second low-impedance branch 316 and the second resonance point F.
  • the first controller is further configured to control the first selection switch 311 to conduct the first low-impedance branch 313 and the first resonance point C according to the radiation blocking scenario of the first coupling slot 41 and the free radiation scenario of the second coupling slot 42 . . and controlling the second selection switch 314 to turn on the second high impedance branch 315 and the second resonance point F.
  • the second antenna 20 there are two paths for the second antenna 20 to generate the low-frequency resonance mode: one is that the second signal source 22 excites the second radiator 21 between the first resonance point C and the third coupling end 212 , and this path does not need to be involved
  • the first coupling slot 41 and the other is that the second signal source 22 excites the second resonant point F to the second radiator 21 between the second coupling end 211 , and this path does not need to involve the second coupling slot 42 .
  • a controller controls the second signal source 22 to excite the second radiator 21 between the first resonance point C and the third coupling end 212 to generate a sixth sub-resonance mode f when the first coupling slot 41 is blocked, so that the second The antenna 20 can still excite the second radiator 21 to generate low-frequency signals; for high-frequency signals, since the first coupling slot 41 is blocked and the second coupling slot 42 can still work normally, the second sub-resonance mode can still be generated b, the second sub-resonance mode b is tuned by the third matching circuit M3, so that the antenna assembly 100 can still be effectively applied in low frequency, medium-high-ultra-high frequency when the first coupling slot 41 of the antenna assembly 100 is blocked.
  • the first controller also controls the second signal source 22 to excite the second radiator 21 between the second resonance point F and the second coupling end 211 to generate the seventh sub-resonance mode g when the second coupling slot 42 is blocked.
  • the second antenna 20 can still excite the second radiator 21 to generate low-frequency signals; for high-frequency signals, since the second coupling slot 42 is blocked, and the first coupling slot 41 can still work normally, it can still generate
  • the first sub-resonance mode a, the third sub-resonance mode c, the fourth sub-resonance mode d, and the fifth sub-resonance mode e are tuned by the first and second matching circuits M1 and M2 to make the antenna When the second coupling slot 42 of the assembly 100 is blocked, it can still be effectively used in low frequency, mid-high-ultra-high frequency.
  • the antenna assembly 100 is provided in the electronic device 1000 .
  • the implementation of the antenna assembly 100 provided in the electronic device 1000 will be described by way of example.
  • the antenna assembly 100 is at least partially integrated on the casing 500 or fully disposed in the casing 500 .
  • the casing 500 includes a frame 51 and a rear cover 52 .
  • one side of the frame 51 surrounds the periphery of the back cover 52 .
  • the other side of the frame 51 surrounds the periphery of the display screen.
  • the frame 51 includes a plurality of side edges connected end to end in sequence.
  • the surface where the display screen is located is the front surface of the electronic device 1000 .
  • the frame 51 forms four sides of the electronic device 1000 .
  • the top, bottom, left, and right sides of the electronic device 1000 are the back side of the electronic device 1000 .
  • the radiator of the antenna assembly 100 is at least partially integrated with the frame 51 .
  • the material of the frame 51 is a metal material.
  • the first radiator 11 , the second radiator 21 , the third radiator 23 and the frame 51 are all integrated into one body.
  • the above-mentioned radiator can also be integrated with the back cover 52 .
  • the first radiator 11 , the second radiator 21 and the third radiator 23 are integrated into a part of the housing 500 .
  • the frame 51 includes a plurality of metal segments 511 and an insulating segment 512 filled between two adjacent metal segments 511 .
  • the insulating segment 512 is used to insulate two adjacent metal segments 511 and to connect two adjacent metal segments 511 .
  • the third radiator 23 , the second radiator 21 and the third radiator 23 are respectively formed by the multi-segment metal segments 511 or a part thereof, and the insulating segment 512 between the first radiator 11 and the second radiator 21 is filled in the first radiator 23 .
  • the coupling slot 41 and the insulating segment 512 between the second radiator 21 and the third radiator 23 are filled in the second coupling slot 42 .
  • the surface of the frame 51 can be provided with a layer of insulating and high transmittance to electromagnetic waves.
  • a capacitance is formed when the antenna assembly 100 is close to each other and does not affect the transmission and reception signals of the antenna assembly 100 .
  • the reference ground GND of the antenna assembly 100 , the first signal source 12 , the second signal source 22 , the first to fifth matching circuits M1 ⁇ M5 , etc. are all disposed on the circuit board.
  • the first radiator 11 , the second radiator 21 and the third radiator 23 are formed on the surface of the frame 51 .
  • the first radiator 11 , the second radiator 21 , and the third radiator 23 are formed inside the frame 51 by processes such as Laser Direct Structuring (LDS), Print Direct Structuring (PDS), etc.
  • LDS Laser Direct Structuring
  • PDS Print Direct Structuring
  • the material of the frame 51 may be a non-conductive material.
  • the above-mentioned radiator can also be provided on the back cover 52 .
  • the first radiator 11 , the second radiator 21 and the third radiator 23 are provided on the flexible circuit board.
  • the flexible circuit board is attached to the surface of the frame 51 .
  • the first radiator 11 , the second radiator 21 , and the third radiator 23 can be integrated on the flexible circuit board, and the flexible circuit board can be attached to the inner surface of the middle frame by adhesive or the like.
  • the frame 51 The material can be a non-conductive material.
  • the above-mentioned radiator can also be provided on the inner surface of the back cover 52 .
  • the present application does not specifically limit the specific position of the antenna assembly 100 on the frame 51, and the following embodiments are used for illustration.
  • the first coupling slot 41 and the second coupling slot 42 are respectively arranged on two intersecting sides of the frame 51 , or both the first coupling slot 41 and the second coupling slot 42 are arranged at the same side of the frame 51 .
  • the plurality of side edges include a top edge 513 and a bottom edge 514 disposed opposite to each other, and a first side edge 515 and a second side edge 516 connected between the top edge 513 and the bottom edge 514 .
  • the top edge 513 is the edge away from the ground when the operator holds the electronic device 1000 facing the front of the electronic device 1000 for use, and the bottom edge 514 is the edge facing the ground.
  • the top edge 513 and the bottom edge 514 are parallel and equal.
  • the first side 515 and the second side 516 are parallel and equal.
  • the length of the first side edge 515 is greater than the length of the top edge 513 .
  • the first coupling slot 41 and the second coupling slot 42 can be respectively disposed at the top edge 513-first side edge 515 combination, the top edge 513-second side edge 516 combination, the first side edge 515-bottom edge 514 combination, and the bottom edge 514 - Any of the second side 516 combinations.
  • the first coupling slot 41 and the second coupling slot 42 may also be located on the same side, for example, any one of the top side 513 , the bottom side 514 , the first side side 515 and the second side side 516 .
  • the first coupling slot 41 and the second coupling slot 42 are respectively disposed on the adjacent two sides of the frame 51, so that the operator can ensure that the antenna assembly 100 has a higher height when holding the electronic device 1000 in different ways. transmission and reception performance.
  • the first side 515 is blocked by the hand, and the first coupling slit 41 (or the second coupling slit 42 ) provided on the first side 515 may be blocked, Since the second coupling slot 42 (or the first coupling slot 41 ) is disposed on the top edge 513 or the bottom edge 514 , the second coupling slot 42 (or the first coupling slot 41 ) is not blocked at this time.
  • the control method when the first coupling slot 41 (or the second coupling slot 42 ) is blocked can make the low-frequency radiation of the antenna assembly 100 switch from the first resonance point C to the second coupling slot 42 (or the first coupling slot 41 ), In this way, the vertical holding of the left hand will not affect the low frequency transmission and reception, and the second sub-resonance mode b in the high frequency transmission and reception can still work normally, which can ensure that the antenna assembly 100 also has good performance in high frequency transmission and reception.
  • the second side 516 is blocked by the hand, and the first coupling slit 41 (or the second coupling slit 42 ) provided on the first side 515 may be blocked. Due to the second coupling The slot 42 (or the first coupling slot 41 ) is set on the top edge 513 or the bottom edge 514 , so the second coupling slot 42 (or the first coupling slot 41 ) is not blocked at this time.
  • the control method when 41 (or the second coupling slot 42 ) is blocked can make the low-frequency radiation of the antenna assembly 100 switch from the first resonance point C to the second coupling slot 42 (or the first coupling slot 41 ), so that the left hand holds the longitudinal direction
  • the high frequency transmission and reception will not affect the low frequency transmission and reception, and the second sub-resonance mode b in the high frequency transmission and reception can still work normally, which can ensure that the antenna assembly 100 also has good performance in the high frequency transmission and reception.
  • both the top edge 513 and the bottom edge 514 are blocked by the hands, and the first coupling slot 41 (or the second coupling slot 42 ) disposed on the top edge 513 or the bottom edge 514 is blocked , the second coupling slot 42 (or the first coupling slot 41 ) disposed on the first side 515 or the second side 516 is not blocked.
  • the low-frequency radiation of the antenna assembly 100 can be switched from the first resonance point C to the second coupling slot 42 (or the second coupling slot 42 ) A coupling slot 41), so that the vertical holding of the left hand will not affect the low frequency transmission and reception, and the second sub-resonance mode b in the high frequency transmission and reception can still work normally, which can ensure that the antenna assembly 100 also has better performance in high frequency transmission and reception .
  • the first coupling slot 41 and the second coupling slot 42 on the adjacent two sides of the frame 51, it is convenient for the operator to ensure that the antenna assembly 100 has the Higher transceiver performance.
  • the material of the frame 51 is a metal material.
  • the first coupling slot 41 is disposed on the bottom edge 514 and close to the first side edge 515 .
  • the second coupling slot 42 is disposed on the second side 516 . Both the first coupling slot 41 and the second coupling slot 42 are filled with insulating medium.
  • At least part of the first radiator 11 is disposed on the bottom edge 514 .
  • a part of the second radiator 21 is disposed on the bottom edge 514
  • another part of the second radiator 21 is disposed on the second side edge 516 .
  • the third radiator 23 is disposed on the second side 516 .
  • the position of the first side edge 515 close to the bottom edge 514 is grounded to form the first ground terminal A of the first radiator 11 .
  • the metal frame 51 between the first ground terminal A and the first coupling slot 41 forms the first radiator 11 .
  • the metal frame 51 between the first coupling slot 41 and the second coupling slot 42 forms the second radiator 21 .
  • the position of the second side edge 516 close to the second coupling slot 42 is grounded to form the second ground terminal G.
  • the metal frame 51 between the second ground terminal G and the second coupling slot 42 forms the third radiator 23 .
  • the electronic device 1000 further includes a circuit board 600 and an electronic component 700 disposed in the frame 51 and disposed close to the bottom edge 514 .
  • the circuit board 600 includes, but is not limited to, a rigid circuit board 600, a flexible circuit board 600, a rigid-flex board, and the like.
  • the circuit board 600 is disposed close to the bottom edge 514 , the bottom of the first side edge 515 (near the bottom edge 514 ), and the bottom of the second side edge 516 (near the bottom edge 514 ).
  • the reference ground GND, the first to fifth matching circuits M5 , the first signal source 12 , and the second signal source 22 may all be disposed on the circuit board 600 .
  • the electronic assembly 700 includes at least one of a speaker 711 , a USB interface device 712 , an earphone holder 713 , and a SIM card slot assembly 714 .
  • the second antenna 20 further includes a feeding branch and a plurality of grounding branches which are provided on the circuit board 600 and are electrically connected to the second radiator 21 .
  • the feeding branch includes a fourth matching circuit M4 and a second signal source 22 .
  • the ground branch includes a grounded second matching circuit M2, a grounded fifth matching circuit M5, a grounded third matching circuit M3, and the like.
  • the electronic component 700 is located between the feeding branch and the grounding branch or between two adjacent grounding branches.
  • a first vacancy 716 is formed between the first signal source 12, the connecting branch of the first matching circuit M1 and the grounded second matching circuit M2, the grounded second matching circuit M2 and the grounded fifth matching circuit M5
  • a second space 717 is formed between the second signal source 22 and the connection branch of the fourth matching circuit M4
  • a third space 718 is formed between the connecting branch of the second signal source 22 and the fourth matching circuit M4 and the grounded fifth matching circuit M5.
  • the second signal source 22 and the fourth matching circuit M4 A fourth vacancy 719 is formed between the connecting branch of , and the grounded third matching circuit M3 .
  • a plurality of electronic components 700 can be arbitrarily disposed in the first to fourth vacancies 716 - 719 .
  • the feeding branch and the grounding branch on the antenna assembly 100 can be disposed away from the electronic assembly 700 , so that the electronic assembly 700 and the antenna assembly 100 are arranged in a staggered manner, further reducing the distance between the electronic assembly 700 and the antenna assembly 100 .
  • the speaker 711 is located in the first space 716 corresponding to the first coupling slot 41 .
  • the first coupling slot 41 may be multiplexed with the speaker 711 hole (for transmitting the sound from the speaker 711 ), for example, at least one speaker 711 hole is opened on the insulating segment 512 filling the first coupling slot 41 to reduce the noise in the speaker 711 .
  • the second radiator 21 is provided with a speaker 711 hole.
  • the second vacancy 717 is set at the middle position of the bottom edge 514 .
  • the USB interface device 712 is located in the second space 717 .
  • a USB hole is opened on the second radiator 21, and the metal bottom edge 514 is insulated from the USB interface device 712 by an insulating member, and the conductive joint of the charging cable is insulated from the metal bottom edge 514 by the insulating member, so as to improve the USB interface device.
  • 712 Performance compatibility with antenna assembly 100 can also be used as a sealing member sealed to the USB hole, so as to improve the waterproof sealing performance of the USB hole.
  • the earphone holder 713 and/or the SIM card slot assembly 714 are arranged in the third space 718 .
  • the second radiator 21 is provided with an earphone hole corresponding to the earphone holder 713, and the conductive connector of the earphone is insulated from the metal bottom edge 514 by the insulating member, so as to improve the connection between the earphone holder 713 and the metal bottom edge 514.
  • Performance compatibility of the antenna assembly 100 can also be used as a sealing member sealed to the earphone hole, so as to improve the waterproof sealing performance of the earphone hole.
  • the second radiator 21 is provided with a SIM hole corresponding to the SIM card slot assembly 714, and the conductive joint of the SIM card slot assembly 714 is connected to the metal bottom edge 514 through an insulating member. Insulation to improve the performance compatibility of the SIM card slot assembly 714 and the antenna assembly 100 . Further, the insulating member can also be used as a sealing member sealed to the SIM hole, so as to improve the waterproof sealing performance of the SIM hole.
  • the antenna assembly 100 provided by the embodiment of the present application can also detect the approach of a human body effectively and accurately.
  • the detection function can be applied to reduce the transmit and receive power of the antenna assembly 100 when the human body approaches, thereby reducing the specific absorption rate of the electromagnetic wave by the human body, reducing the radiation effect of the electronic device 1000 on the human body, and further improving the application reliability of the electronic device 1000 .
  • the second antenna 20 includes a first radio frequency front-end unit that is electrically connected to the second radiator 21 .
  • the first radio frequency front-end unit includes a grounded second matching circuit M2, a grounded fifth matching circuit M5, a second signal source 22 and a fourth matching circuit M4, and a grounded third matching circuit M3.
  • the antenna assembly 100 further includes a first isolation device 811 , a second isolation device 812 , a first proximity sensing device 813 and a second controller (not shown).
  • the first isolation device 811 is disposed between the first RF front-end unit and the second radiator 21 .
  • the first isolation device 811 is used to isolate the first induction signal generated when the subject to be detected (eg, human head, etc.) approaches the second radiator 21 and the electromagnetic wave signal transmitted and received by the second radiator 21 .
  • the number of the first isolation devices 811 is multiple.
  • a plurality of first isolation devices 811 are respectively disposed between the second radiator 21 and the second matching circuit M2, between the second radiator 21 and the fifth matching circuit M5, and between the second radiator 21 and the fourth matching circuit M4. between the second radiator 21 and the third matching circuit M3.
  • the first isolation device 811 is used to isolate the first induction signal generated when the subject to be detected approaches the second radiator 21 and the electromagnetic wave signal sent and received by the second radiator 21 .
  • the first isolation device 811 at least includes a DC blocking capacitor.
  • the subject to be detected includes, but is not limited to, the head of a human body.
  • the plurality of first isolation devices 811 are arranged so that the second radiator 21 is in a "suspended" state with respect to the DC signal, so as to sense changes in electrical signals brought about by the approach of the head of the human body.
  • the capacitor can be reused as the first isolation device 811 , and no additional DC blocking capacitors need to be provided.
  • the same is true for the third matching circuit M3, the fourth matching circuit M4 and the fifth matching circuit M5, which will not be described in detail.
  • one end of the second isolation device 812 is electrically connected between the second radiator 21 and the first isolation device 811 .
  • the second isolation device 812 is used for isolating the electromagnetic wave signal sent and received by the second radiator 21 and conducting the first induction signal.
  • the second isolation device 812 includes at least an isolation inductance to isolate a higher frequency electrical signal, such as an AC signal.
  • the first induction signal generated by the second radiator 21 is a DC signal.
  • the electromagnetic wave signal transmitted and received by the second radiator 21 is an AC signal.
  • the first isolation device 811 between the second radiator 21 and the first RF front-end unit the first inductive signal will not flow to the first RF front-end unit through the second radiator 21 to affect the second antenna 20 Signal sending and receiving.
  • the second isolation device 812 between the first proximity sensing device 813 and the second radiator 21 the electromagnetic wave signal will not flow to the first proximity sensing device 813 through the second radiator 21 , thereby improving the first proximity sensing device.
  • the sensing efficiency of the sensing device 813 for the proximity sensing signal is a DC signal.
  • the electromagnetic wave signal transmitted and received by the second radiator 21 is an AC signal.
  • the first proximity sensing device 813 is electrically connected to the other end of the second isolation device 812 for sensing the magnitude of the first sensing signal.
  • the first proximity sensing device 813 includes, but is not limited to, a sensor for sensing changes in capacitance or inductance, for detecting the first proximity sensing device 813 connected to it.
  • the capacitance change amount of the isolation device 811 or the inductance change amount of the second isolation device 812 is not limited to, a sensor for sensing changes in capacitance or inductance, for detecting the first proximity sensing device 813 connected to it.
  • the second controller is electrically connected to one end of the first proximity sensing device 813 away from the second isolation device 812, and is used to determine whether the subject to be detected is close to the second radiator 21 according to the magnitude of the first sensing signal, and when the subject to be detected is close to the first When there are two radiators 21, the power of the second antenna 20 is reduced. Specifically, when the second controller detects that the first induction signal is greater than or equal to the preset threshold, it is determined that the subject to be detected is close to the second radiator 21 , and the power of the second antenna 20 is controlled to decrease. When the power of the antenna decreases, the radiation performance of the antenna also decreases accordingly, and the specific absorption rate of the human body for electromagnetic waves radiated by the antenna also decreases accordingly, thereby further improving the reliability of the electronic device 1000 .
  • the specific scenario is as follows: the surface of the human skin is charged, when the human body is close to the second radiator 21 , the second radiator 21 and the skin on the surface of the human body form an electric field, and the first isolation device 811 senses the gap between the surface of the human body and the second radiator 21
  • the electric signal flowing through the second isolation device 812 changes due to the change in capacitance caused by the superposition of the electric field of the first proximity sensing device 813 , so that the first proximity sensing device 813 senses the first sensing signal greater than the preset threshold.
  • the transmit power of the second antenna 20 can be reduced, thereby reducing the specific absorption rate of the human body for the electromagnetic wave signal emitted by the second antenna 20;
  • the transmit power of the second antenna 20 can be increased to improve the antenna performance of the antenna assembly 100 without increasing the electromagnetic wave signal emitted by the human body to the second antenna 20 In this way, the radiation performance of the electronic device 1000 can be intelligently adjusted; because the radiator of the antenna assembly 100 can be used as a carrier for sending and receiving electromagnetic waves, and also as a carrier for sensing the proximity of the electric field of the human body, thus realizing dual functions, in the future
  • the volume of the radiator is increased, the effect of the antenna assembly 100 is increased, which is beneficial to realize the electronic device 1000 with multiple functions, high integration and small volume.
  • the radiator of the antenna assembly 100 can also multiplex the radiator on the antenna assembly 100 as an inductive electrode for the human body to wait for the detection of the approach of the subject, while serving as a receiving and transmitting electromagnetic wave signal, and the first isolation device 811 and the second isolation device 812 are used to sense the inductive electrodes respectively. Signals and electromagnetic wave signals are isolated, the communication performance of the antenna assembly 100 and the role of sensing the subject to be detected are realized, the radiation performance of the electronic device 1000 is intelligently adjustable, the safety performance of the electronic device 1000 is improved, and the safety performance of the electronic device 1000 is improved. The device utilization rate is reduced, and the overall volume of the electronic device 1000 is reduced.
  • other detectors or functions in the electronic device 1000 can be combined to reduce the specific absorption rate of the human body to the electromagnetic waves radiated by the electronic device 1000 in a more necessary scenario.
  • the power of the electronic device 1000 is reduced, thereby reducing the specific absorption rate of the human head for electromagnetic waves radiated by the electronic device 1000 .
  • the scenario of detecting whether the electronic device 1000 is in a call state can be combined.
  • the power of the antenna assembly 100 can be reduced at this time. , so as to reduce the radiation of the electromagnetic wave radiated by the electronic device 1000 to the human head, and reduce the specific absorption rate of the human head to the electromagnetic wave radiated by the electronic device 1000 .
  • the detection that the electronic device 1000 is in a call state it can be detected whether the receiver and the receiver are in a working state.
  • the antenna assemblies 100 may be arranged on multiple sides of the electronic device 1000 , and the radiators of these antenna assemblies 100 may be used as carriers for detecting the proximity of the electric field of the human body to the electronic device 1000 .
  • the electronic device 1000 can control the power reduction of all the antenna assemblies 100 , on the one hand, the specific absorption rate of the electromagnetic wave radiated by the antenna assembly 100 to the human body is reduced, and on the other hand, the power can be saved.
  • the second radiator 21 covers or is disposed at least at one corner of the frame 51 (the corner refers to the junction of two adjacent sides).
  • the second radiator 21 covers the bottom edge 514, the second side edge 516, and the corner between the bottom edge 514 and the second side edge 516, so that the second radiator 21 can detect the front, back, bottom, second The face of the side 516 is approached by the human body.
  • the second radiator 21 is multiplexed as a carrier for human body electric field induction. Since the second antenna 20 is an antenna for transmitting and receiving low-frequency signals, the length of the second radiator 21 is relatively long, and the second radiator 21 is set as The carrier that senses the proximity of the electric field of the human body can detect the proximity of the human body in a relatively large range on the electronic device 1000, thereby improving the accuracy of the proximity detection of the human body.
  • the first radiator 11 and the third radiator 23 can also be individually multiplexed as carriers for human body electric field induction, or multiplexed together with the second radiator 21 as carriers for human body electric field induction. For details, please refer to the following embodiments.
  • the second antenna 20 further includes a third isolation device 814 , one end of the third isolation device 814 is electrically connected to the second ground terminal G, and the other end is grounded.
  • the third isolation device 814 is a DC blocking capacitor, so that the third radiator 23 is in a floating state relative to the DC signal.
  • the principle of the third radiator 23 for detecting the approach of the electric field of the human body is the same as the principle of the second radiator 21 for detecting the approach of the electric field of the human body, which will not be repeated here.
  • the third radiator 23 when the electric field of the human body is close to the third radiator 23, the third radiator 23 generates a second induction signal, and transmits the second induction signal to the second radiator through the second coupling slot 42 21 , so that the second radiator 21 generates a sub-induction signal, and the first proximity sensing device 813 detects the sub-induction signal and reduces the power of the second antenna 20 .
  • the second radiator 21 and the third radiator 23 are both used as sensing electrodes for sensing the proximity of the subject to be detected, and the proximity sensing path of the third radiator 23 is the third radiator 23 , the second radiator 21 to the The first proximity sensing device 813 .
  • the third radiator 23 when the subject to be detected is close to the third radiator 23, the third radiator 23 generates a second induction signal, and the second induction signal causes the second radiator 21 to generate a sub-induction signal through the first coupling slot 41, so that the first The proximity sensing device 813 can also sense the subject to be detected at the third radiator 23 .
  • the third radiator 23 is disposed on the second side 516 .
  • An insulating segment 512 is provided between the second ground terminal G and the metal second side 516 of the non-third radiator 23 to disconnect the third radiator 23 from other metal second sides 516 .
  • the second antenna 20 also includes a fourth isolation device 815 .
  • One end of the fourth isolation device 815 is electrically connected between the third radiator 23 and the third isolation device 814 or is electrically connected to the third radiator 23 for isolating the electromagnetic wave signals sent and received by the third radiator 23 and conducting the second induction signal .
  • the fourth isolation device 815 includes an isolation inductor.
  • the antenna assembly 100 further includes a second proximity sensing device 816 , and the second proximity sensing device 816 is electrically connected to the other end of the fourth isolation device 815 for sensing the magnitude of the second sensing signal .
  • both the second radiator 21 and the third radiator 23 are sensing electrodes that sense the proximity of the subject to be detected, and the proximity sensing path of the second radiator 21 and the proximity sensing path of the third radiator 23 are independent of each other, which can accurately It is detected that the subject to be detected approaches the second radiator 21 or the third radiator 23 in a timely manner, thereby responding to the above approaching behavior in a timely manner.
  • the second induction signal generated by the third radiator 23 is a DC signal.
  • the electromagnetic wave signal is an AC signal.
  • the fourth isolation device 815 is arranged between the third radiator 23 and the reference ground GND, so that the second inductive signal does not flow to the reference ground GND through the third radiator 23 , so as to affect the signal transceiving of the second antenna 20 .
  • the electromagnetic wave signal will not flow to the second proximity sensing device 816 through the third radiator 23 , thereby improving the second proximity sensing device.
  • the sensing efficiency of the measuring device 816 for the second sensing signal is measured.
  • the present application does not limit the specific structure of the second proximity sensing device 816, and the second proximity sensing device 816 includes, but is not limited to, a sensor for sensing capacitance changes or inductance changes.
  • the coupling of the second radiator 21 and the third radiator 23 is used to sense the sensitivity of the second radiator 21 .
  • the signal is transmitted to the second proximity sensing device 816 via the third radiator 23 .
  • the difference between this implementation manner and the second implementation manner is that the second proximity sensing device 816 is not provided in this implementation manner.
  • the other end of the fourth isolation device 815 is electrically connected to the first proximity sensing device 813 .
  • a coupling induction signal is generated when the second radiator 21 and the third radiator 23 are capacitively coupled.
  • the first proximity sensing device 813 is also used for inductively coupling the variation of the sensing signal when the subject to be detected approaches the second radiator 21 and/or the third radiator 23 .
  • a constant electric field is generated when the second radiator 21 and the third radiator 23 are coupled, which is manifested as generating a stable coupled induction signal.
  • the constant electric field will change, which is manifested as the change of the coupled induction signal, and the approach of the human body is detected according to the change of the coupled induction signal.
  • the second radiator 21 and the third radiator 23 serve as sensing electrodes at the same time. Accurate detection when there is a human body in the area. There is no need to use two proximity sensing devices, and the coupling effect between the second radiator 21 and the third radiator 23 and the first proximity sensing device 813 are also fully utilized, so that the second radiator 21 and the third radiator 23 It can also be reused during proximity detection, which increases the utilization rate of devices, reduces the number of devices, and further promotes the integration and miniaturization of the electronic device 1000 .
  • the first antenna 10 further includes a fifth isolation device 817 , wherein the number of the fifth isolation device 817 is multiple.
  • the fifth isolation device 817 is electrically connected between the first ground terminal A of the first radiator 11 and the reference ground GND, and between the first feeding point B and the first matching circuit M1.
  • the first ground terminal A may be insulated from other metal frames except the first radiator 11 .
  • the fifth isolation device 817 is a DC blocking capacitor, so that the first radiator 11 is in a floating state relative to the DC signal.
  • the principle of the first radiator 11 for detecting the approach of the electric field of the human body is the same as the principle of the second radiator 21 for detecting the approach of the electric field of the human body, which will not be repeated here.
  • the first radiator 11 when the electric field of the human body is close to the first radiator 11 , the first radiator 11 generates a third induction signal, and transmits the third induction signal to the second radiator 21 through the first coupling slot 41 , so that the second radiator 21 generates a sub-induction signal, and the first proximity sensing device 813 detects the sub-induction signal and reduces the power of the first antenna 10 .
  • the sensing paths in this embodiment are the first radiator 11 , the second radiator 21 , and the first proximity sensing device 813 .
  • the first radiator 11 is disposed on the first side 515 .
  • An insulating segment 512 is provided between the first ground terminal A and the metal first side 515 of the non-first radiator 11 to disconnect the first radiator 11 from other metal first sides 515 .
  • the first antenna 10 also includes a sixth isolation device 818 .
  • One end of the sixth isolation device 818 is electrically connected between the first radiator 11 and the fifth isolation device 817 or is electrically connected to the first radiator 11 for isolating the electromagnetic wave signals sent and received by the first radiator 11 and conducting the third induction signal .
  • the sixth isolation device 818 includes an isolation inductor.
  • the other end of the sixth isolation device 818 is electrically connected to the first proximity sensing device 813 .
  • the first proximity sensing device 813 is also used for inductively coupling the variation of the sensing signal when the subject to be detected approaches the second radiator 21 and/or the first radiator 11 .
  • a constant electric field is generated when the second radiator 21 and the first radiator 11 are coupled, which is manifested as generating a stable coupled induction signal.
  • the constant electric field will change, which is manifested as the change of the coupled induction signal, and the approach of the human body is detected according to the change of the coupled induction signal.
  • the difference between this implementation manner and the above-mentioned second implementation manner is that the sixth isolation device 818 is not electrically connected to the first proximity sensing device 813 .
  • the antenna assembly 100 further includes a third proximity sensing device 819, and the third proximity sensing device 819 is electrically connected to the other end of the sixth isolation device 818 for sensing the magnitude of the third sensing signal.
  • both the second radiator 21 and the first radiator 11 are sensing electrodes that sense the proximity of the subject to be detected, and the proximity sensing path of the second radiator 21 and the proximity sensing path of the first radiator 11 are independent of each other, which can accurately It is detected that the subject to be detected is approaching the second radiator 21 or the first radiator 11 in a timely manner, thereby responding to the above approaching behavior in a timely manner.
  • the third induction signal generated by the first radiator 11 is a DC signal.
  • the electromagnetic wave signal is an AC signal.
  • the sixth isolation device 818 is arranged between the first radiator 11 and the reference ground GND, so that the third inductive signal does not flow to the reference ground GND through the first radiator 11 , so as to affect the signal transceiving of the second antenna 20 .
  • the electromagnetic wave signal will not flow to the third proximity sensing device 819 through the first radiator 11 , thereby improving the third proximity sensing device.
  • the sensing efficiency of the measuring device 819 for the third sensing signal is measured.
  • the present application does not limit the specific structure of the third proximity sensing device 819, and the third proximity sensing device 819 includes, but is not limited to, a sensor for sensing capacitance changes or inductance changes.
  • the induction path of the first radiator 11 may be independent of the induction path of the second radiator 21 .
  • the area of the detection electrodes can be increased, so that the approach of the subject to be detected can be detected in a larger range, and the electronic device 1000 can be further improved.
  • the adjustment accuracy of the radiation performance can be formed.

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Abstract

本申请公开了一种天线组件及电子设备，天线组件包括：第一天线包括第一辐射体及电连接第一辐射体的第一信号源；第二天线包括第二辐射体及第三辐射体，第二辐射体的一端与第一辐射体的一端之间具有第一耦合缝隙，第二辐射体的另一端与第三辐射体的一端之间具有第二耦合缝隙；第一辐射体用于在所述第一信号源的激励下产生至少一个谐振模式，并在第一信号源的激励下通过第一耦合缝隙激励第二辐射体靠近第二耦合缝隙的部分产生至少一个谐振模式。本申请提供的天线组件及电子设备能够提高通信质量及利于整机小型化。

Description

天线组件及电子设备 技术领域
本申请涉及通信技术领域，尤其涉及一种天线组件和电子设备。
背景技术
随着技术的发展，手机等具有通信功能电子设备的普及度越来越高，且功能越来越强大。电子设备中通常包括天线组件以实现电子设备的通信功能。如何在提高电子设备的通信质量的同时还能够促进电子设备的小型化，成为需要解决的技术问题。
发明内容
本申请提供了一种提高通信质量及利于整机小型化的天线组件及电子设备。
第一方面，本申请实施例提供的一种天线组件，包括：
第一天线，所述第一天线包括第一辐射体及电连接所述第一辐射体的第一信号源；及
第二天线，所述第二天线包括第二辐射体及第三辐射体，所述第二辐射体的一端与所述第一辐射体的一端之间具有第一耦合缝隙，所述第二辐射体的另一端与所述第三辐射体的一端之间具有第二耦合缝隙；
所述第一辐射体用于在所述第一信号源的激励下产生至少一个谐振模式，并在所述第一信号源的激励下通过所述第一耦合缝隙激励所述第二辐射体靠近所述第二耦合缝隙的部分产生至少一个谐振模式。
第二方面，本申请提供的一种电子设备，所述电子设备包括边框及所述的天线组件，所述第一辐射体、所述第二辐射体、所述第三辐射体与所述边框集成为一体；或者，所述第一辐射体、所述第二辐射体、所述第三辐射体成型于所述边框的表面；或者，所述第一辐射体、所述第二辐射体、所述第三辐射体设于柔性电路板，所述柔性电路板贴设于所述边框的表面；和/或，
所述边框包括依次首尾相连的多个侧边，相邻的两个所述侧边相交；所述第一耦合缝隙和所述第二耦合缝隙分别设于所述边框的两个相交的所述侧边；或者，所述第一耦合缝隙和所述第二耦合缝隙皆设于所述边框的同一个侧边。
本申请实施例提供的天线组件及电子设备，通过设计第一天线的辐射体与第二天线的辐射体通过第一耦合缝隙容性耦合，第一天线的信号源能够通过第一辐射体耦合激励第二天线的辐射体收发相应频段的电磁波信号，如此，实现第二天线的辐射体还作为第一天线的辐射体的复用，相对而言，节省了第一天线的辐射体和第二天线的辐射体的堆叠空间，减小天线组件的整体体积，利于电子设备的整体小型化；通过在第二天线的辐射体内开设第二耦合缝隙，使得第二辐射体在第一天线的信号源的激励下能够在靠近第二耦合缝隙处产生至少一个谐振模式，以增加其产生谐振模式的位置，进而增加产生谐振模式的数量，进一步地增加天线组件的收发信号的带宽。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示的电子设备的分解示意图；
图3是本申请实施例提供的第一种天线组件的结构示意图；
图4是本申请实施例提供的第一子谐振模式和第二子谐振模式的示意图；
图5是本申请实施例提供的第一种第一子谐振模式、第二子谐振模式、第三子谐振模式和第四子谐振模式的分布示意图；
图6是本申请实施例提供的第二种第一子谐振模式、第二子谐振模式、第三子谐振模式和第四子谐振模式的分布示意图；
图7是本申请实施例提供的第三种第一子谐振模式、第二子谐振模式、第三子谐振模式和第四子谐振模式的分布示意图；
图8是本申请实施例提供的第一子谐振模式、第二子谐振模式、第三子谐振模式、第四子谐振模式及第五子谐振模式的分布示意图；
图9是本申请实施例提供的第二种天线组件的结构示意图；
图10是本申请实施例提供的第六子谐振模式的示意图；
图11是本申请实施例提供的第七子谐振模式的示意图；
图12是本申请实施例提供的第三种天线组件的结构示意图；
图13是本申请实施例提供的第六子谐振模式移动至不同频段的示意图；
图14是本申请实施例提供的第二信号源至第二辐射体的射频链路的结构示意图；
图15是本申请实施例提供的第一种第一匹配电路的结构示意图；
图16是本申请实施例提供的第二种第一匹配电路的结构示意图；
图17是本申请实施例提供的第三种第一匹配电路的结构示意图；
图18是本申请实施例提供的第四种第一匹配电路的结构示意图；
图19是本申请实施例提供的第五种第一匹配电路的结构示意图；
图20是本申请实施例提供的第六种第一匹配电路的结构示意图；
图21是本申请实施例提供的第七种第一匹配电路的结构示意图；
图22是本申请实施例提供的第八种第一匹配电路的结构示意图；
图23是本申请实施例提供的第四种天线组件的结构示意图；
图24是本申请实施例提供的第三种天线组件设于电子设备内的一种结构示意图；
图25是本申请实施例提供的第三种天线组件设于电子设备内的另一种结构示意图；
图26是本申请实施例提供的第五种天线组件的结构示意图；
图27是本申请实施例提供的第六种天线组件的结构示意图；
图28是本申请实施例提供的第七种天线组件的结构示意图；
图29是本申请实施例提供的第八种天线组件的结构示意图；
图30是本申请实施例提供的第九种天线组件的结构示意图；
图31是本申请实施例提供的第十种天线组件的结构示意图；
图32是本申请实施例提供的第十一种天线组件的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。本申请所列举的实施例之间可以适当的相互结合。
请参照图1，图1为本申请实施例提供的一种电子设备的结构示意图。电子设备1000可以为电话、电视、平板电脑、手机、照相机、个人计算机、笔记本电脑、车载设备、耳机、手表、可穿戴设备、基站、车载雷达、客户前置设备(Customer Premise Equipment，CPE)等能够收发电磁波信号的设备。以电子设备1000为手机为例，为了便于描述，以电子设备1000处于第一视角为参照进行定义，电子设备1000的宽度方向定义为X向，电子设备1000的长度方向定义为Y向，电子设备1000的厚度方向定义为Z向。箭头所指示的方向为正向。
请参阅图2，电子设备1000包括天线组件100。天线组件100用于收发射频信号，以实现电子设备1000的通讯功能。天线组件100的至少部分器件设于电子设备1000的主板200上。可以理解的，电子设备1000还包括显示屏300、电池400、壳体500、摄像头、麦克风、受话器、扬声器、人脸识别模组、指纹识别模组等等能够实现手机的基本功能的器件，在本实施例中不再赘述。
天线组件100为电子设备1000的内置天线。天线组件100设于电子设备1000的壳体内，具体的位置在后续进行说明。
请参照图3，天线组件100包括第一天线10及第二天线20。其中，第一天线10和第二天线20为通过不同的信号源激励的天线。本申请对于第一天线10和第二天线20的具体频段不做限定，例如，按照收发频段划分，第一天线10和第二天线20可皆为支持低频信号的低频天线；或者，第一天线10和第二天线20中的一者为支持中高-超高频信号的中高-超高频天线，另一者为支持低频信号的低频天线；或者，第一天线10和第二天线20中的两者皆为支持中高-超高频信号的中高-超高频天线。其中，低频频段(Lower Band，LB)是指频率小于1000MHz的频段。中高-超高频段是指频段为中高频段(Middle High Band，MHB)及超高频(Ultra High Band，UHB)所覆盖的频段内。其中，中高频段为1000MHz-3000MHz；超高频段为3000MHz-10000MHz，这是一种划分方法，但不限于此。
其中，低频频段为4G LTE(Long Term Evolution，长期演进)、5G NR(New Radio) 中的至少一者。举例而言，具体的应用频段包括但不限于B28、B20、B5、B8、N28、N20、N5、N8等。当然，低频频段可单独加载4G LTE信号，或单独加载5G NR信号，或还可以为同时加载4G LTE信号与5G NR信号，即实现4G无线接入网与5G-NR的双连接(LTE NR Double Connect，EN-DC)。
其中，中高-超高频段为4G LTE(Long Term Evolution，长期演进)、5G NR(New Radio)、GPS-L1、GPS-L5、WIFI-2.4G、WIFI-5G等中的至少一者。举例而言，具体的应用频段包括但不限于B32、B3、B39、B1、B40、B41、N78、N79、等。当然，中高-超高频段可单独加载4G LTE信号，或单独加载5G NR信号，或还可以为同时加载4G LTE信号与5G NR信号，即实现4G无线接入网与5G-NR的双连接(LTE NR Double Connect，EN-DC)。
本实施提供的天线组件100所收发的低频频段、中高-超高频段还可以为多个载波(载波即特定频率的无线电波)聚合而成，即实现载波聚合(Carrier Agregation，CA)，以增加传输带宽，提升信号传输速率。
请参照图3，第一天线10包括第一辐射体11及电连接第一辐射体11的第一信号源12。
请参照图3，第二天线20包括第二辐射体21及第三辐射体23。可选的，第二天线20还包括第二信号源22，第二信号源22用于对第二辐射体21进行馈电。第二辐射体21的一端与第一辐射体11的一端之间具有第一耦合缝隙41。第二辐射体21的另一端与第三辐射体23的一端之间具有第二耦合缝隙42。本申请对于第一辐射体11、第二辐射体21、第三辐射体23的形状不做具体的限定，包括但不限于条状、片状、杆状、涂层、薄膜等。本实施例以第一辐射体11、第二辐射体21、第三辐射体23皆为条形为例进行说明，但不限定其延伸方向，故上述的辐射体皆可呈直线形、曲线形、多段弯折形等。上述的辐射体在延伸轨迹上可以为宽度均匀的线条，也可以为宽度渐变、设有加宽区域等宽度不等的线条。
第一耦合缝隙41为第一辐射体11的第一端部与第二辐射体21的第一端部之间的断缝，例如，断缝的宽度为0.5～2mm，但不限于此尺寸。第一辐射体11与第二辐射体21能够通过第一耦合缝隙41产生容性耦合。“容性耦合”是指，第一辐射体11与第二辐射体21之间产生电场，第一辐射体11的信号能够通过电场传递至第二辐射体21，第二辐射体21的信号能够通过电场传递至第一辐射体11，以使第一辐射体11与第二辐射体21即使在断开的状态下也能够实现电信号导通。第二耦合缝隙42为第二辐射体21的第二端部与第三辐射体23的第一端部之间的断缝，断缝的宽度为0.5～2mm，但不限于此尺寸。第二辐射体21与第三辐射体23能够通过第二耦合缝隙42产生容性耦合。此外，第一辐射体11的第二端部接地，第三辐射体23的第二端部接地。
关于天线组件100的辐射体接地。可选的，天线组件100自身具有参考地GND。该参考地GND的具体形式包括但不限于直接裸露在外的金属板、成型于柔性电路板内部的金属层等。天线组件100的辐射体电连接天线组件100的参考地GND。当天线组件100设于电子设备1000内时，天线组件100的参考地GND电连接电子设备1000的参考地GND。再可选的，天线组件100本身不具有参考地GND，天线组件100的辐射体通过直接电连接或通过中间的导电连接件电连接电子设备1000的参考地GND或电子设备1000内的电子器件的参考地GND。
第一信号源12为用于发送射频信号的射频收发芯片或电连接用于发送射频信号的射频收发芯片的馈电部。
第一辐射体11用于在第一信号源12的激励下产生至少一个谐振模式。第一辐射体11还用于在第一信号源12的激励下通过第一耦合缝隙41激励第二辐射体21靠近第二耦合缝隙42的部分产生至少一个谐振模式。谐振模式表征为天线组件100在谐振模式的谐振频率处的电磁波传输效率较高。也就是说，第二辐射体21在第一信号源12的激励下在某一谐振频率处具有较高的收发效率，进而能够支持该谐振频率附近的一段频段的电磁波信号的收发。
换言之，第二天线20的辐射体还能够为第一天线10所用，作为第一天线10的辐射体，以产生谐振模式，如此，扩宽天线组件100的频段；对于未耦合的天线组件100，要实现上述的带宽，需设置更长的第一辐射体11，或在第一辐射体11旁增加一段辐射体，如此会使得整个天线组件100的叠加尺寸更大，在空间极其有限的电子设备1000内，尺寸较大的天线组件100不利于电子设备1000的小型化。
本申请实施例提供的天线组件100及电子设备1000，通过设计第一天线10的辐射体与第二天线20的辐射体通过第一耦合缝隙41容性耦合，第一天线10的信号源能够通过第一辐射体11耦合激励第二天线20的辐射体收发相应频段的电磁波信号，如此，实现第二 天线20的辐射体还作为第一天线10的辐射体的复用，相对而言，节省了第一天线10的辐射体和第二天线20的辐射体的堆叠空间，减小天线组件100的整体体积，利于电子设备1000的整体小型化，通过在第二天线20的辐射体内开设第二耦合缝隙42，使得第二辐射体21在第一天线10的信号源的激励下能够在靠近第二耦合缝隙42处产生至少一个谐振模式，或者在靠近第一耦合缝隙41处产生至少一个谐振模式和在靠近第二耦合缝隙42处产生至少一个谐振模式，以增加其产生谐振模式的位置，进而增加产生谐振模式的数量，进一步地增加天线组件100的收发信号的带宽。
第一辐射体11在第一信号源12的激励下产生的谐振模式的谐振频率与第二辐射体21在第一辐射体11的耦合激励下产生的谐振模式的谐振频率不同。
换言之，天线组件100中，第一信号源12激励第一辐射体11产生在一频率处谐振模式，同时由于第一辐射体11与第二辐射体21容性耦合能够传递能量，第一信号源12还能够激励第二辐射体21在另一频率处产生谐振模式。由于第一辐射体11产生谐振模式的频率与第二辐射体21产生谐振模式的频率不同，所以第一辐射体11在第一信号源12的激励下覆盖的频段与第二辐射体21在第一信号源12的激励下覆盖的频段不同，这些频段组合在一起，以使天线组件100支持的频段宽度增加，提升传输速率。
本实施例中，第一信号源12为激励中高-超高频的信号源，其中，第一信号源12激励第一辐射体11和第二辐射体21皆产生中高-超高频的电磁波信号。在其他实施方式中，第一信号源12可为激励低频信号的信号源，以激励第一辐射体11和第二辐射体21产生低频的电磁波信号。
进一步地，通过设计第一辐射体11的长度或匹配电路，以使该至少两个谐振模式之间的频率相隔相对较大，减小相邻的谐振模式的重叠范围，以进一步提高第一辐射体11所支持的频段宽度。第一辐射体11在第一信号源12的激励下产生的谐振模式的谐振频率与第二辐射体21在第一信号源12的激励下产生的谐振模式的谐振频率之间相差第一预设值，举例而言，第一预设值为500M～5000M，但不不限于此。本申请对于每个谐振模式的带宽不做具体的限定。第一辐射体11和第二辐射体21在第一信号源12的激励下产生的谐振模式为相邻且相互连续的谐振模式，也可以为相隔断的谐振模式。当第一辐射体11和第二辐射体21在第一信号源12的激励下产生的谐振模式为相邻且相互连续的谐振模式时，第一辐射体11和第二辐射体21所支持的频段可通过载波聚合的方式聚合成较宽的频段，提升传输速率。例如，第一辐射体11所支持的频段为1500MHz～2000MHz，第二辐射体21所支持的频段为2000MHz～2500MHz，通过载波聚合的方式可聚合形成1500MHz～2500MHz的频段，实现1000M的带宽。
可选的，请参照图4，第一辐射体11用于在第一信号源12的激励下通过第一耦合缝隙41激励第二辐射体21靠近第一耦合缝隙41的部分和第二辐射体21靠近第二耦合缝隙42的部分产生至少一个谐振模式。至少一个谐振模式包括第一子谐振模式a和第二子谐振模式b。换言之，第二辐射体21在第一辐射体11的耦合激励下(即第一信号源12的激励下)产生谐振模式至少包括第一子谐振模式a及第二子谐振模式b。其中。第一子谐振模式a的谐振频率小于第二子谐振模式b的谐振频率。换言之，第二辐射体21在第一信号源12的激励下产生至少两个谐振模式，至少两个谐振模式可全部由第二辐射体21靠近第一耦合缝隙41处产生，也可全部由第二辐射体21靠近第二耦合缝隙42处产生，还可一部分由第二辐射体21靠近第一耦合缝隙41处产生，另一部分由第二辐射体21靠近第二耦合缝隙42处产生。
换言之，第一子谐振模式a、第二子谐振模式b中的一者由第二辐射体21靠近第一耦合缝隙41的部分产生，及第一子谐振模式a、第二子谐振模式b中的另一者由第二辐射体21靠近第二耦合缝隙42的部分产生；或者，第一子谐振模式a、第二子谐振模式b皆由第二辐射体21靠近第二耦合缝隙42的部分产生；或者，第一子谐振模式a、第二子谐振模式b皆由第二辐射体21靠近第一耦合缝隙41的部分产生。
通过设置第二辐射体21上产生至少两个谐振模式，一方面使得第一信号源12激励覆盖的频段宽度更大，另一方面第一天线10对于第二辐射体21的利用率更高，所以在实现较高带宽的同时，提高第一天线10对于第二辐射体21的利用率，进一步地减小天线组件100的堆叠尺寸，促进电子设备1000在确保高带宽的小型化设计。
本申请实施例中，第一子谐振模式a由第二辐射体21靠近第一耦合缝隙41的部分产生，第二子谐振模式b由第二辐射体21靠近第二耦合缝隙42的部分产生，如此，第一子谐振模式a与第二子谐振模式b相互之间不受影响。
可选的，设置产生第一子谐振模式a的第二辐射体21的部分的长度与产生第二子谐振模式b的第二辐射体21的部分的长度不同，以使第一子谐振模式a、第二子谐振模式b的谐振模式的频率不同，以覆盖较宽的带宽。
请参照图5，第一辐射体11在第一信号源12的激励下产生的谐振模式至少包括第三子谐振模式c及第四子谐振模式d。其中，第三子谐振模式c的谐振频率小于第四子谐振模式d的谐振频率。换言之，第一辐射体11在第一信号源12的作用下能实现至少两个谐振模式，且该至少两个谐振模式的谐振频段不同，以提高第一辐射体11所支持的频段宽度；进一步通过设计第一辐射体11的长度或匹配电路，以使该至少两个谐振模式之间的频率相隔相对较大，减小相邻的谐振模式的重叠范围，以进一步提高第一辐射体11所支持的频段宽度。
通过调节第一辐射体11、第二辐射体21产生各子谐振模式的部分的长度或匹配电路，可调节子谐振模式的谐振频率。本申请对于第一子谐振模式a、第二子谐振模式b、第三子谐振模式c、第四子谐振模式d的谐振频率的大小顺序不做具体的限定。通过以下实施方式进行举例说明。
在一些可能的实施方式中，请参照图5，第二子谐振模式b的谐振频率小于第三子谐振模式c的谐振频率。即第一子谐振模式a、第二子谐振模式b、第三子谐振模式c、第四子谐振模式d的谐振频率依次增加。
本实施方式中，第一信号源12发送高频信号，第二信号源22发送低频信号，故第一辐射体11的长度相对较短，第二辐射体21的长度相对较长。由于上述的尺寸差异，在设计第一信号源12激励覆盖高频段时，相对较长的第二辐射体21可支持相对较低的频段，如此，便于设计第一辐射体11产生的谐振模式的谐振频率大于第二辐射体21产生的谐振模式的谐振频率，以增加第二天线20对于第二辐射体21的复用长度，增加对于第二辐射体21的利用率。
可选的，谐振频率的大小可与产生该谐振模式的辐射体长度呈反比。
在一些可能的实施方式中，请参照图6，第二子谐振模式b的谐振频率大于第三子谐振模式c的谐振频率且小于第四子谐振模式d的谐振频率，及第一子谐振模式a的谐振频率小于或大于第三子谐振模式c的谐振频率。
本实施方式中，对于第一辐射体11产生第三子谐振模式c和第四子谐振模式d的辐射段的长度进行设计，当第三子谐振模式c覆盖的频段和第四子谐振模式d覆盖的频段不连续时，而在实际使用中，需要使用到第三子谐振模式c覆盖的频段和第四子谐振模式d覆盖的频段之间的频段时，可对于第二辐射体21产生各子谐振模式的部分的长度或匹配电路进行设计，以使第二子谐振模式b的谐振频率位于第三子谐振模式c的谐振频率与第四子谐振模式d的谐振频率之间，以使第二子谐振模式b覆盖第三子谐振模式c覆盖的频段和第四子谐振模式d覆盖的频段之间的频段。当第三子谐振模式c覆盖的频段和第四子谐振模式d覆盖的频段之间的频段带宽较大，第二子谐振模式b的覆盖的频段不足以覆盖该带宽时，可将第一子谐振模式a的谐振频率也位于第三子谐振模式c的谐振频率与第四子谐振模式d的谐振频率之间，以使第三子谐振模式c覆盖的频段、第一子谐振模式a覆盖的频段、第二子谐振模式b覆盖的频段、第四子谐振模式d覆盖的频段形成连续或接近连续的频段，或覆盖到所需要的频段，提高电子设备1000所支持的频段范围与运营商所提供的频段范围的对应性，提高电子设备1000的通信质量。
在一些可能的实施方式中，请参照图7，第二子谐振模式b的谐振频率大于第四子谐振模式d的谐振频率，及第一子谐振模式a的谐振频率小于第三子谐振模式c的谐振频率。在其他实施方式中，第二子谐振模式b的谐振频率大于第四子谐振模式d的谐振频率，及第一子谐振模式a的谐振频率大于第三子谐振模式c的谐振频率且小于第四子谐振模式d的谐振频率、或大于第四子谐振模式d的谐振频率。
本实施方式中，通过调节第一辐射体11、第二辐射体21产生各子谐振模式的部分的长度或匹配电路，在第一天线10需支持更高频段的信号而第二辐射体21的尺寸无法进一步减小时，可通过调节第二辐射体21产生子谐振模式的部分的长度或匹配电路，以使第二辐射体21产生更高频段的第二子谐振模式b，以满足第一天线10对于更高频段信号的支持。
可选的，请参照图8，第一辐射体11在第一信号源12的激励下产生的谐振模式还包括第五子谐振模式e。第五子谐振模式e的谐振频率、第一子谐振模式a的谐振频率、第二子谐振模式b的谐振频率、第三子谐振模式c的谐振频率、第四子谐振模式d的谐振频率依次增加。第五子谐振模式e为第一辐射体11为工作在高阶谐振的谐振模式。第三子谐振模式c为第一辐射体11工作在基态的谐振模式。
具体的，第五子谐振模式e的谐振频率在第一信号源12所激励产生的谐振模式的谐振频率中相对较低，以实现第一天线10所覆盖频段中相对较低频段的覆盖。由于第一辐射体11的长度相对较短，基态下的谐振模式无法支持到该相对较低的频段，故将第一信号源12传送的信号采用容性耦合馈的方式馈入第一辐射体11，以激发第一辐射体11产生高阶谐振，进而实现在相对较短的第一辐射体11上激发相对较低的频段，提高对于第一辐射体11的利用率及增加第一天线10的支持带宽。
可以理解的，上述的任意一种实施方式中，第一子谐振模式a、第二子谐振模式b、第三子谐振模式c、第四子谐振模式d、第五子谐振模式e皆可通过载波聚合的方式进行聚合，以形成频段相对较宽的带宽，提升信号传输速率。
可选的，第一信号源12为发送中高-超高频信号的信号源。第一辐射体11在第一信号源12的激励下产生的谐振模式覆盖的频段与第二辐射体21在第一信号源12的激励下产生的谐振模式覆盖的频段组合形成的频段的带宽为500M～5000M；即第五子谐振模式e、第一子谐振模式a、第二子谐振模式b、第三子谐振模式c、第四子谐振模式d所覆盖的频段在载波聚合后合成较大的频段带宽，例如，500M～5000M，但不限于此。
和/或，第一辐射体11在第一信号源12的激励下产生的谐振模式覆盖的频段与第二辐射体21在第一信号源12的激励下产生的谐振模式覆盖的频段皆大于1000MHz。
进一步地，第一辐射体11在第一信号源12的激励下产生的谐振模式覆盖的频段与第二辐射体21在第一信号源12的激励下产生的谐振模式覆盖的频段组合形成的频段覆盖1000MHz～6000MHz。如此，第一天线10可用于支持4G LTE中高-超高频段、5G NR中高-超高频段、GPS-L1、GPS-L5、WIFI-2.4G、WIFI-5G等中的至少一者。
本申请对于第一天线10及第二天线20的具体结构不做具体的限定，以下通过以下的实施方式对第一天线10及第二天线20的具体结构进行举例说明。
可选的，请参阅图9，第一辐射体11呈长条状。第一辐射体11包括第一接地端A、第一耦合端111及设于第一接地端A与第一耦合端111之间的第一馈电点B。其中，第一接地端A和第一耦合端111为第一辐射体11的相背两端。第一接地端A接地，具体的，第一接地端A电连接天线组件100的参考地GND或电连接电子设备1000的参考地GND。第一馈电点B为信号馈入第一辐射体11的位置。
第一耦合端111为第一辐射体11形成第一耦合缝隙41的端部。
请参阅图9，第一天线10还包括第一匹配电路M1。第一匹配电路M1的一端电连接第一信号源12。第一匹配电路M1的另一端电连接第一馈电点B。
具体的，结合参考图8，第一信号源12用于产生或传输激励信号，第一匹配电路M1用于过滤第一信号源12传送的激励信号中的杂波，并将激励信号传送至第一辐射体11，使第一辐射体11在激励信号的激励下产生第三子谐振模式c、第四子谐振模式d、第五子谐振模式e。当第一辐射体11产生谐振模式时，表明第一辐射体11在某一谐振频率下具有较好收发效率，进而表明第一辐射体11在该谐振频率为中心频率的某一频段范围内具有较好的收发效率，换言之，第一信号源12作用于第一辐射体11能够支持该频段范围。
请一并参考图8及图9，第一接地端A与第一耦合端111之间的第一辐射体11在第一信号源12作用下产生第三子谐振模式c。具体的，第一匹配电路M1的阻抗相对于所述第三子谐振模式c的谐振频率为低阻抗，第一匹配电路M1以低阻抗馈激励第一接地端A与第一耦合端111之间的第一辐射体11产生1/4波长谐振模式，该1/4波长谐振模式也是基态谐振模式，此模式下对应具有较高的收发效率。此时，第一接地端A与第一耦合端111之间的第一辐射体11的有效电长度为第三子谐振模式c的谐振频率对应的波长的1/4，或者，在匹配电路的调谐下，使得第一接地端A与第一耦合端111之间的第一辐射体11的等效有效电长度为第三子谐振模式c的谐振频率对应的波长的1/4。如此，实现第一辐射体11产生的第三子谐振模式c具有较高的收发效率，天线组件100在以第三子谐振模式c的谐振频率为中心频率的频段具有较好的性能。
请一并参考图8及图9，第一馈电点B与第一耦合端111之间的第一辐射体11在第一信号源12的作用下产生第四子谐振模式d。具体的，第一匹配电路M1的阻抗相对于所述第四子谐振模式d的谐振频率为低阻抗。第一匹配电路M1以低阻抗馈激励第一馈电点B与第一耦合端111之间的第一辐射体11产生1/4波长谐振模式。该1/4波长谐振模式也是基态谐振模式，此模式下对应具有较高的收发效率。此时，第一馈电点B与第一耦合端111之间的第一辐射体11的有效电长度为第四子谐振模式d的谐振频率对应的波长的1/4，或者，在匹配电路的调谐下，使得第一馈电点B与第一耦合端111之间的第一辐射体11的等 效有效电长度为第四子谐振模式d的谐振频率对应的波长的1/4。如此，实现第一辐射体11产生的第四子谐振模式d具有较高的收发效率，天线组件100在以第四子谐振模式d的谐振频率为中心频率的频段具有较好的性能。
请一并参考图8及图9，第一接地端A与第一耦合端111之间的第一辐射体11在第一信号源12的容性耦合馈作用下产生第五子谐振模式e。具体的，第一匹配电路M1的阻抗相对于所述第五子谐振模式e的谐振频率为高阻抗，第一匹配电路M1以高阻抗馈激励第一接地端A与第一耦合端111之间的第一辐射体11产生1/8波长谐振模式。此时，第一接地端A与第一耦合端111之间的第一辐射体11的有效电长度为第五子谐振模式e的谐振频率对应的波长的1/8，或者，在匹配电路的调谐下，使得第一接地端A与第一耦合端111之间的第一辐射体11的等效有效电长度为第五子谐振模式e的谐振频率对应的波长的1/8。如此，实现第一辐射体11产生的第五子谐振模式e具有较高的收发效率，天线组件100在以第五子谐振模式e的谐振频率为中心频率的频段具有较好的性能。通过在第一接地端A与第一耦合端111之间的第一辐射体11上激励出1/8波长谐振模式，以在小尺寸的第一辐射体11上激励出相对较小频段，进一步扩宽带宽。
以上第一辐射体11在第一信号源12的激励下产生第三子谐振模式c、第四子谐振模式d、第五子谐振模式e，实现了一个辐射体产生多种谐振模式，且这些谐振模式的频率不同，将这些谐振模式通过载波聚合，可在小体积天线上形成带宽较宽的频段，进而实现第一天线10可应用于支持多种不同种类的网络通信信号。
请参考图9，第二辐射体21包括第二耦合端211、第三耦合端212及依次设于第二耦合端211与第三耦合端212之间的第一谐振点C、第二馈电点E、第二谐振点F。
请参考图9，第三辐射体23包括第四耦合端213及第二接地端G。第二接地端G接地。
第二耦合端211为第二辐射体21上形成第一耦合缝隙41的端部。第二辐射体21呈长条状。第二耦合端211和第三耦合端212为第二辐射体21的相背两端。第一耦合端111与第二耦合端211相对且之间的间隔为第一耦合缝隙41。第三耦合端212为形成第二耦合缝隙42的端部。第三耦合端212与第四耦合端213之间形成第二耦合缝隙42。第二馈电点E为信号馈入第二辐射体21的位置。
请参考图9，第二天线20还包括第二匹配电路M2、第三匹配电路M3、第四匹配电路M4。第二匹配电路M2的一端接地，第二匹配电路M2的另一端电连接第一谐振点C。第三匹配电路M3的一端接地，第三匹配电路M3的另一端电连接第二谐振点F。第四匹配电路M4的一端电连接第二信号源22，第四匹配电路M4的另一端电连接第二馈电点E。
本实施例中，请一并参考图8及图9，由于第一辐射体11与第二辐射体21通过第一耦合缝隙41容性耦合，所以第一信号源12的激励能量经第一辐射体11传递至第二辐射体21，第一谐振点C与第二耦合端211之间的第二辐射体21在第一辐射体11的耦合激励下产生第一子谐振模式a。具体的，第一匹配电路M1的阻抗相对于所述第一子谐振模式a的谐振频率为低阻抗，以低阻抗馈激励第一谐振点C与第二耦合端211之间的第二辐射体21产生1/4波长谐振模式，该1/4波长谐振模式也是基态谐振模式，此模式下对应具有较高的收发效率。此时，第二匹配电路M2的阻抗相对于第一子谐振模式a的频率为低阻抗态，以便于第一子谐振模式a的信号通过第二匹配电路M2通过低阻抗下地。第一谐振点C与第二耦合端211之间的第二辐射体21的有效电长度为第一子谐振模式a的谐振频率对应的波长的1/4，或者，在匹配电路的调谐下，使得第一谐振点C与第二耦合端211之间的第二辐射体21的等效有效电长度为第一子谐振模式a的谐振频率对应的波长的1/4。如此，实现第二辐射体21产生的第一子谐振模式a具有较高的收发效率，天线组件100在以第一子谐振模式a的谐振频率为中心频率的频段具有较好的性能。
本实施例中，请一并参考图8及图9，由于第一辐射体11与第二辐射体21通过第一耦合缝隙41容性耦合，所以第一信号源12的激励能量经第一辐射体11传递至第二辐射体21，第二谐振点F与第三耦合端212之间的第二辐射体21在第一辐射体11的耦合激励下产生第二子谐振模式b。具体的，第一匹配电路M1的阻抗相对于所述第二子谐振模式b的谐振频率为低阻抗，以低阻抗馈激励第二谐振点F与第三耦合端212之间的第二辐射体21产生1/4波长谐振模式，该1/4波长谐振模式也是基态谐振模式，此模式下对应具有较高的收发效率。此时，第三匹配电路M3的阻抗相对于第二子谐振模式b的频率为低阻抗态，以便于第二子谐振模式b的信号通过第三匹配电路M3通过低阻抗下地。第二谐振点F与第三耦合端212之间的第二辐射体21的有效电长度为第二子谐振模式b的谐振频率对应的波长的1/4，或者，在匹配电路的调谐下，使得第二谐振点F与第三耦合端212之间的第二辐射 体21的等效有效电长度为第二子谐振模式b的谐振频率对应的波长的1/4。如此，实现第二辐射体21产生的第二子谐振模式b具有较高的收发效率，天线组件100在以第二子谐振模式b的谐振频率为中心频率的频段具有较好的性能。
以上的第二辐射体21中的第二耦合端211至第一谐振点C之间的部分、第二谐振点F与第三耦合端212的部分可被第一天线10收发中高、超高频频段时所复用，实现了第一天线10与第二天线20的共体，相较于未共体天线，本天线组件100极大地减小了其辐射体的尺寸，利于电子设备1000的小型化，而且，通过第一辐射体11、第二辐射体21产生上述的五种谐振模式，极大地增大了第一天线10收发中高-超高频信号的带宽。
具体的，第二信号源22用于产生或传输激励信号。第四匹配电路M4用于过滤第二信号源22传送的激励信号中的杂波，并将激励信号传送至第二辐射体21，第二辐射体21与第三辐射体23之间通过第二耦合缝隙42进行容性耦合，第二辐射体21及第三辐射体23在激励信号的激励下产生谐振模式。
第二辐射体21在第二信号源22的激励下产生至少一个谐振模式。第二辐射体21在第二信号源22的激励下产生的谐振模式覆盖的频段小于1000MHz。换言之，第二辐射体21在第二信号源22的激励下覆盖低频频段。
本实施例中，第二辐射体21具有双重作用，一方面能够作为第一天线10的辐射体收发中高-超高频的信号，另一方面能够作为第二天线20的辐射体收发低频信号，增加第二辐射体21的利用率，进一步减小天线组件100的整体尺寸。
可选的，请参阅图10，第一谐振点C与第三耦合端212之间的第二辐射体21在第二信号源22的激励下产生至少一个谐振模式。为了便于描述，定义第一谐振点C与第三耦合端212之间的第二辐射体21在第二信号源22的激励下产生谐振模式为第六子谐振模式f。
具体的，第四匹配电路M4的阻抗相对于所述第六子谐振模式f的谐振频率为低阻抗，以低阻抗馈激励第一谐振点C与第三耦合端212之间的第二辐射体21产生1/4波长谐振模式，该1/4波长谐振模式也是基态谐振模式，此模式下对应具有较高的收发效率。此时，第二匹配电路M2的阻抗相对于第六子谐振模式f的频率为低阻抗态，以便于第六子谐振模式f的信号通过第二匹配电路M2通过低阻抗下地。第一谐振点C与第三耦合端212之间的第二辐射体21的有效电长度为第六子谐振模式f的谐振频率对应的波长的1/4，或者，在匹配电路的调谐下，使得第一谐振点C与第三耦合端212之间的第二辐射体21的等效有效电长度为第六子谐振模式f的谐振频率对应的波长的1/4。如此，实现第二辐射体21产生的第六子谐振模式f具有较高的收发效率，天线组件100在以第六子谐振模式f的谐振频率为中心频率的频段具有较好的性能。
可选的，请参阅图11，第二谐振点F与第二耦合端211之间的第二辐射体21在第二信号源22的激励下产生至少一个谐振模式。为了便于描述，定义第二谐振点F与第二耦合端211之间的第二辐射体21在第二信号源22的激励下产生谐振模式为第七子谐振模式g。
具体的，第四匹配电路M4的阻抗相对于所述第七子谐振模式g的谐振频率为低阻抗，以低阻抗馈激励第二谐振点F与第二耦合端211之间的第二辐射体21产生1/4波长谐振模式，该1/4波长谐振模式也是基态谐振模式，此模式下对应具有较高的收发效率。此时，第三匹配电路M3的阻抗相对于第七子谐振模式g的频率为低阻抗态，以便于第七子谐振模式g的信号通过第三匹配电路M3通过低阻抗下地。第二谐振点F与第二耦合端211之间的第二辐射体21的有效电长度为第七子谐振模式g的谐振频率对应的波长的1/4，或者，在匹配电路的调谐下，使得第二谐振点F与第二耦合端211之间的第二辐射体21的等效有效电长度为第七子谐振模式g的谐振频率对应的波长的1/4。如此，实现第二辐射体21产生的第七子谐振模式g具有较高的收发效率，天线组件100在以第七子谐振模式g的谐振频率为中心频率的频段具有较好的性能。
可选的，天线组件100可控制第二辐射体21产生第六子谐振模式f和第七子谐振模式g中的一者，以支持低频段。其中，第六子谐振模式f的谐振频率可大于、小于或等于第七子谐振模式g的谐振频率。
请参阅图12，第二辐射体21还包括调频点D。调频点D位于第一谐振点C与第二馈电点E之间。第二天线20还包括第五匹配电路M5。第五匹配电路M5的一端接地。第五匹配电路M5的另一端电连接调频点D。第二匹配电路M2、第三匹配电路M3、第五匹配电路M5及第四匹配电路M4中至少一者用于调节第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率。本实施例中，第二匹配电路M2、第三匹配电路M3、第五匹配电路M5及第四匹配电路M4中的任意一者皆可以用于调节第二辐射体21在第二信号 源22的激励下产生的谐振模式的谐振频率，以使第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率朝向低频段移动或朝向高频段移动，以使第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率能够在不同的时间段覆盖500MHz～1000MHz的低频段，以覆盖B28、B20、B5、B8、N28、N20、N5、N8等应用频段。
举例而言，请参阅图13，第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率为780MHz，其可支持740MHz～820MHz的频段。通过调节第二匹配电路M2、第三匹配电路M3、第五匹配电路M5及第四匹配电路M4中任意一者，可将第二辐射体21在第二信号源22的激励下产生的第六子谐振模式f支持500MHz～580MHz的频段、580MHz～660MHz的频段、660MHz～740MHz的频段、820MHz～900MHz的频段、900MHz～980MHz的频段等。
此外，对于第一天线10产生的高频信号的调谐方式包括但不限于以下的实施方式，第一子谐振模式a可通过第二匹配电路M2进行调谐，第二子谐振模式b可通过第三匹配电路M3进行调谐。第三子谐振模式c、第四子谐振模式d及第五子谐振模式e可通过第一匹配电路M1进行调谐。
第一匹配电路M1至第五匹配电路M5皆具有改变辐射体的阻抗的作用，本申请对于第一匹配电路M1至第五匹配电路M5的结构不做具体的限定。可选的，第一匹配电路M1至第五匹配电路M5皆包括但不限于串联和/或并联设置的电容、电感、电阻等。具体的，第一匹配电路M1可包括多个串联和/或并联的电容、电感、电阻形成的支路，及控制多个支路的通断的开关。通过控制不同开关的通断，可以调节第一匹配电路M1的选频参数(包括电阻值、电感值及电容值)，进而调节第一匹配电路M1的阻抗，以使馈电支路的传输阻抗与第一辐射体11的阻抗匹配，提高第一辐射体11的收发效率。同时，第一匹配电路M1还能通过调节其阻抗，以调节第一辐射体11的有效电长度，进而调节第一辐射体11产生的谐振模式的谐振频率朝向高频方向或低频方向移动，从而调节第一辐射体11覆盖的频段范围，增加可支持的频宽范围。
再可选的，第一匹配电路M1还包括可调电容，该可调电容可调节其电容值，进而调节第一匹配电路M1的阻抗值，以使馈电支路的传输阻抗与第一辐射体11的阻抗匹配，提高第一辐射体11的收发效率；及调节第一辐射体11产生的谐振模式的谐振频率朝向高频方向或低频方向移动，从而调节第一辐射体11覆盖的频段范围，增加可支持的频宽范围。
相类似地，第二匹配电路M2至第五匹配电路M5的结构可参考上述第一匹配电路M1的结构和调节方式，以实现阻抗匹配及提高天线组件100的收发效率；及调节辐射体覆盖的频段范围，增加可支持的频宽范围。在此不再一一赘述。
对于第一匹配电路M1和第四匹配电路M4而言，第一匹配电路M1、第四匹配电路M4还具有滤波作用，以增加第一天线10与第二天线20之间的隔离度。例如，第一信号源12和第二信号源22为同一信号源，而第一匹配电路M1通过设置电连接于第一信号源12与第一辐射体11之间的高频带通支路，以将第一信号源12中的高频信号传输至第一辐射体11，第四匹配电路M4通过设置电连接于第二信号源22与第二辐射体21之间的低频带通支路，以将第二信号源22中的低频信号传输至第二辐射体21。由于第一匹配电路M1和第二匹配电路M2分别过滤出高频信号和低频信号，高频信号与低频信号由于频率差异，具有较好的隔离度，进而实现第一天线10和第二天线20之间的相互干扰小，隔离度高。
进一步地，第四匹配电路M4中还可设有杂波滤除电路，以减少杂波对于第二天线20和第一天线10的干扰。
具体的，请参阅图14，第二天线20还包括中高频带通支路214。中高频带通支路214的一端接地。中高频带通支路214的另一端电连接第四匹配电路M4。中高频带通支路214包括串联设置的电感和电容，电容的一端电连接第四匹配电路M4，电容的另一端电连接电感的一端，电感的另一端接地。通过在第四匹配电路M4中加入并联到地中高频带通支路214，以过滤掉第二信号源22中的高频杂波，进而实现第二天线20中不会受到高频杂波的干扰，同时也使得第二天线20中的高频杂波不会干扰到第一信号源12，提高第一天线10和第二天线20的隔离度。
相应地，第一匹配电路M1可以设有接地的低频带通支路，以滤除第一信号源12中的低频杂波，以防止低频杂波干扰第一天线10的信号收发，同时还能够防止低频杂波干扰第二天线20的信号收发，增加第一天线10和第二天线20的隔离度。
请一并参阅图15至图22，图15-图22分别为各个实施方式提供的第一匹配电路M1 的示意图。第一匹配电路M1包括以下一种或多种电路。
请参阅图15，第一匹配电路M1包括电感L0与电容C0串联形成的带通电路。
请参阅图16，第一匹配电路M1包括电感L0与电容C0并联形成的带阻电路。
请参阅图17，第一匹配电路M1包括电感L0、第一电容C1、及第二电容C2。电感L0与第一电容C1并联，且第二电容C2电连接电感L0与第一电容C1电连接的节点。
请参阅图18，第一匹配电路M1包括电容C0、第一电感L1、及第二电感L2。电容C0与第一电感L1并联，且第二电感L2电连接电容C0与第一电感L1电连接的节点。
请参阅图19，第一匹配电路M1包括电感L0、第一电容C1、及第二电容C2。电感L0与第一电容C1串联，且第二电容C2的一端电连接电感L0未连接第一电容C1的第一端，第二电容C2的另一端电连接第一电容C1未连接电感L0的一端。
请参阅图20，第一匹配电路M1包括电容C0、第一电感L1、及第二电感L2。电容C0与第一电感L1串联，第二电感L2的一端电连接电容C0未连接第一电感L1的一端，第二电感L2的另一端电连接第一电感L1未连接电容C0的一端。
请参阅图21，第一匹配电路M1包括第一电容C1、第二电容C2、第一电感L1、及第二电感L2。第一电容C1与第一电感L1并联，第二电容C2与第二电感L2并联，且第二电容C2与第二电感L2并联形成的整体的一端电连接第一电容C1与第一电感L1并联形成的整体的一端。
请参阅图22，第一匹配电路M1包括第一电容C1、第二电容C2、第一电感L1、及第二电感L2，第一电容C1与第一电感L1串联形成第一单元101，第二电容C2与第二电感L2串联形成第二单元102，且第一单元101与第二单元102并联。
第一匹配电路M1在不同的频段呈现不同的带通带阻特性。
天线组件100还包括第一控制器(未图示)。第一控制器用于根据第一耦合缝隙41和第二耦合缝隙42处于自由辐射场景或辐射封堵场景确定第二辐射体21的辐射模式。自由辐射场景是指第一耦合缝隙41、第二耦合缝隙42未被导电体或带有静电等物体封堵。辐射封堵场景为第一耦合缝隙41、第二耦合缝隙42被导电体或带有静电等物体封堵，例如，操作者手部覆盖第一耦合缝隙41和第二耦合缝隙42。
具体如下：
第一控制器用于根据第一耦合缝隙41处于自由辐射场景及第二耦合缝隙42所处于辐射封堵场景确定第二辐射体21为第一辐射模式，其中，第一辐射模式为第一信号源12激励第二谐振点F与第二耦合端211之间的第二辐射体21产生至少一个谐振模式。
第一控制器还用于根据第一耦合缝隙41处于辐射封堵场景及第二耦合缝隙42所处于自由辐射场景确定第二辐射体21为第二辐射模式，其中，第二辐射模式为第一信号源12激励第一谐振点C与第三耦合端212之间的第二辐射体21在第二信号源22的激励下产生至少一个谐振模式。
第一控制器还用于根据第一耦合缝隙41及第二耦合缝隙42皆所处于自由辐射场景时确定第二辐射体21为第一辐射模式或第二辐射模式。
本申请对于第一控制器控制第二辐射体21切换辐射模式的具体结构不做限定。通过以下实施方式进行举例说明。
请参阅图23，第二匹配电路M2包括至少一个第一选择开关311、第一高阻抗支路312和第一低阻抗支路313。第一选择开关311用于在第一高阻抗支路312和第一低阻抗支路313中选择一者电连接第一谐振点C。第一选择开关311为“单刀双掷”开关，第一选择开关311的第一端电连接第二辐射体21的第一谐振点C，第一选择开关311的第二端电连接第一高阻抗支路312的一端，所述第一高阻抗支路312的另一端接地，第一选择开关311的第三端电连接第一低阻抗支路313的一端，第一低阻抗支路313的另一端接地。第一控制器电连接第一选择开关311的控制端，以控制第一选择开关311选择第一高阻抗支路312或第一低阻抗支路313电连接第一谐振点C。当然，第一选择开关311还可以包括两个子开关，这两个子开关分别连接第一谐振点C至第一高阻抗支路312、第一谐振点C至第一低阻抗支路313。当然，第二匹配电路M2还可以包括其他阻抗支路。
其中，第一高阻抗支路312相对于第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率而言呈高阻抗，第一低阻抗支路313相对于第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率而言呈低阻抗。
举例而言，第一高阻抗支路312包括但不限于大电容等。第一低阻抗支路313包括但不限于直接接地、小电感等。
请参阅图23，第三匹配电路M3包括至少一个第二选择开关314、第二高阻抗支路315和第二低阻抗支路316。第二选择开关314用于在第二高阻抗支路315和第二低阻抗支路316中选择一者电连接第二谐振点F。第二选择开关314为“单刀双掷”开关，第二选择开关314的第一端电连接第二辐射体21的第二谐振点F，第二选择开关314的第二端电连接第二高阻抗支路315的一端，所述第二高阻抗支路315的另一端接地，第二选择开关314的第三端电连接第二低阻抗支路316的一端，第二低阻抗支路316的另一端接地。第一控制器电连接第二选择开关314的控制端，以控制第二选择开关314选择第二高阻抗支路315或第二低阻抗支路316电连接第二谐振点F。当然，第二选择开关314还可以包括两个子开关，这两个子开关分别连接第二谐振点F至第二高阻抗支路315、第二谐振点F至第二低阻抗支路316。当然，第二匹配电路M2还可以包括其他阻抗支路。
其中，第二高阻抗支路315相对于第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率而言呈高阻抗，第二低阻抗支路316相对于第二辐射体21在第二信号源22的激励下产生的谐振模式的谐振频率而言呈低阻抗。
举例而言，第一高阻抗支路312包括但不限于大电容等。第一低阻抗支路313包括但不限于直接接地、小电感等。
第一控制器电连接第一选择开关311和第二选择开关314。第一控制器用于根据第一耦合缝隙41处于自由辐射场景及第二耦合缝隙42所处于辐射封堵场景控制第一选择开关311导通第一高阻抗支路312与第一谐振点C，及控制第二选择开关314导通第二低阻抗支路316与第二谐振点F。
第一控制器还用于根据第一耦合缝隙41处于辐射封堵场景及第二耦合缝隙42所处于自由辐射场景控制第一选择开关311导通第一低阻抗支路313与第一谐振点C。及控制第二选择开关314导通第二高阻抗支路315与第二谐振点F。
本实施例中，第二天线20产生低频谐振模式具有两条路径：一条是第二信号源22激励第一谐振点C至第三耦合端212之间的第二辐射体21，此路径无需涉及第一耦合缝隙41，另一条是第二信号源22激励第二谐振点F至第二耦合端211之间的第二辐射体21，此路径无需涉及第二耦合缝隙42。
当天线组件100应用于电子设备1000，辐射体设于电子设备1000的壳体上时，操作者在手持电子设备1000时极可能遮挡第一耦合缝隙41或第二耦合缝隙42，本申请通过第一控制器在第一耦合缝隙41被遮挡时控制第二信号源22激励第一谐振点C至第三耦合端212之间的第二辐射体21产生第六子谐振模式f，以使第二天线20仍然能够激励第二辐射体21产生低频信号；对于高频信号而言，由于第一耦合缝隙41被遮挡，而第二耦合缝隙42仍能够正常工作，故仍可以产生第二子谐振模式b，通过第三匹配电路M3对第二子谐振模式b进行调谐，以使天线组件100的第一耦合缝隙41被遮挡时在低频、中高-超高频方面仍能够有效的应用。本申请还通过第一控制器在第二耦合缝隙42被遮挡时控制第二信号源22激励第二谐振点F至第二耦合端211之间的第二辐射体21产生第七子谐振模式g，以使第二天线20仍然能够激励第二辐射体21产生低频信号；对于高频信号而言，由于第二耦合缝隙42被遮挡，而第一耦合缝隙41仍能够正常工作，故仍可以产生第一子谐振模式a、第三子谐振模式c、第四子谐振模式d、第五子谐振模式e，通过第一、第二匹配电路M1、M2对上述的谐振模式进行调谐，以使天线组件100的第二耦合缝隙42被遮挡时在低频、中高-超高频方面仍能够有效的应用。
以上为天线组件100的具体结构的举例说明。在一些实施方式中，天线组件100设于电子设备1000中。以下通过实施方式对于天线组件100设于电子设备1000的实施方式进行举例说明。对于电子设备1000而言，天线组件100至少部分集成于壳体500上或全部设于壳体500内。
请参阅图2，壳体500包括边框51和后盖52。其中，边框51的一侧围接于后盖52的周沿。边框51的另一侧围接于显示屏的周沿。边框51包括依次首尾相连的多个侧边。
当电子设备1000为手机时，显示屏所在面为电子设备1000的正面。边框51形成电子设备1000的四个侧面。当用户面朝电子设备1000的正面时，电子设备1000的上、下、左、右面。后盖52所在面为电子设备1000的背面。
可选的，天线组件100的辐射体至少部分与边框51集成为一体。例如，边框51的材质为金属材质。第一辐射体11、第二辐射体21、第三辐射体23与边框51皆集成为一体。当然，上述的辐射体还可与后盖52集成为一体。换言之，第一辐射体11、第二辐射体21及第三辐射体23集成为壳体500的一部分。
具体的，请参阅图24，边框51包括多段金属段511及填充于相邻两个金属段511之间的绝缘段512。其中，绝缘段512用于使得相邻的两个金属段511绝缘和连接相邻两个金属段511的作用。
多段金属段511或其上的一部分分别形成第三辐射体23、第二辐射体21及第三辐射体23，第一辐射体11与第二辐射体21之间的绝缘段512填充于第一耦合缝隙41，第二辐射体21与第三辐射体23之间的绝缘段512填充于第二耦合缝隙42。
可选的，当辐射体作为感应人体电场靠近的载体时，边框51的表面可以设有一层绝缘且对于电磁波的透过率较高的膜层，该膜层用于使得金属边框51与人体皮肤靠近时之间形成电容且不会对于天线组件100的收发信号产生影响。
具体的，天线组件100的参考地GND、第一信号源12、第二信号源22、第一至第五匹配电路M1～M5等皆设于电路板上。
可选的，第一辐射体11、第二辐射体21、第三辐射体23通过成型于边框51的表面。具体的，第一辐射体11、第二辐射体21、第三辐射体23通过激光直接成型(Laser Direct Structuring，LDS)、印刷直接成型(Print Direct Structuring，PDS)等工艺成型在边框51的内表面上，此实施方式中，边框51的材质可为非导电材质。当然，上述的辐射体还可以设于后盖52上。
可选的，第一辐射体11、第二辐射体21、第三辐射体23设于柔性电路板。柔性电路板贴设于边框51的表面。第一辐射体11、第二辐射体21、第三辐射体23可集成于柔性电路板上，并将柔性电路板通过粘胶等贴设于中框的内表面，此实施方式中，边框51的材质可为非导电材质。当然，上述的辐射体还可设于后盖52的内表面。
本申请对于天线组件100在边框51上的具体位置不做具体的限定，通过以下实施方式进行举例说明。
请参阅图24，边框51的多个侧边中，相邻的两个侧边相交，例如相邻的两个侧边垂直。第一耦合缝隙41和第二耦合缝隙42分别设于边框51的两个相交的侧边，或者，第一耦合缝隙41和第二耦合缝隙42皆设于边框51的同一个侧边。多个侧边包括相对设置的顶边513和底边514，及连接于顶边513与底边514之间的第一侧边515和第二侧边516。其中，顶边513为操作者手持电子设备1000朝向电子设备1000的正面使用时远离地面的边，底边514为朝向地面的边。其中，顶边513和底边514平行且相等。第一侧边515和第二侧边516平行且相等。第一侧边515的长度大于顶边513的长度。第一耦合缝隙41和第二耦合缝隙42可分别设于顶边513-第一侧边515组合、顶边513-第二侧边516组合、第一侧边515-底边514组合、底边514-第二侧边516组合中的任意一者。当然，第一耦合缝隙41和第二耦合缝隙42还可位于同一边，例如，顶边513、底边514、第一侧边515和第二侧边516中的任意一者。
以上通过将第一耦合缝隙41和第二耦合缝隙42分别设于边框51的相邻的两边，以便于操作者在采用不同的握持方式握持电子设备1000时皆确保天线组件100具有较高的收发性能。
具体而言，当电子设备1000处于左手纵向握持时，第一侧边515被手部遮挡，设于第一侧边515的第一耦合缝隙41(或第二耦合缝隙42)可能被遮挡，由于第二耦合缝隙42(或第一耦合缝隙41)设于顶边513或底边514，所以此时第二耦合缝隙42(或第一耦合缝隙41)未被遮挡，结合上述天线组件100在第一耦合缝隙41(或第二耦合缝隙42)被遮挡时的控制方式，可使得天线组件100的低频辐射切换至第一谐振点C至第二耦合缝隙42(或第一耦合缝隙41)，如此左手纵向握持不会影响低频收发，而高频收发中的第二子谐振模式b仍可以正常工作，可确保天线组件100在高频收发方面也具有较好的性能。
当电子设备1000处于右手纵向握持时，第二侧边516被手部遮挡，设于第一侧边515的第一耦合缝隙41(或第二耦合缝隙42)可能被遮挡，由于第二耦合缝隙42(或第一耦合缝隙41)设于顶边513或底边514，所以此时第二耦合缝隙42(或第一耦合缝隙41)未被遮挡，结合上述天线组件100在第一耦合缝隙41(或第二耦合缝隙42)被遮挡时的控制方式，可使得天线组件100的低频辐射切换至第一谐振点C至第二耦合缝隙42(或第一耦合缝隙41)，如此左手纵向握持不会影响低频收发，而高频收发中的第二子谐振模式b仍可以正常工作，可确保天线组件100在高频收发方面也具有较好的性能。
当电子设备1000设于双手横向握持时，顶边513和底边514皆被手部遮挡，设于顶边513或底边514的第一耦合缝隙41(或第二耦合缝隙42)被遮挡，设于第一侧边515或第二侧边516的第二耦合缝隙42(或第一耦合缝隙41)未被遮挡。结合上述天线组件100在 第一耦合缝隙41(或第二耦合缝隙42)被遮挡时的控制方式，可使得天线组件100的低频辐射切换至第一谐振点C至第二耦合缝隙42(或第一耦合缝隙41)，如此左手纵向握持不会影响低频收发，而高频收发中的第二子谐振模式b仍可以正常工作，可确保天线组件100在高频收发方面也具有较好的性能。以上可知，通过将第一耦合缝隙41和第二耦合缝隙42分别设于边框51的相邻的两边，以便于操作者在采用不同的握持方式握持电子设备1000时皆确保天线组件100具有较高的收发性能。
在一实施方式中，边框51的材质为金属材质。第一耦合缝隙41设于底边514且靠近第一侧边515的位置。第二耦合缝隙42设于第二侧边516。第一耦合缝隙41和第二耦合缝隙42中皆填充绝缘介质。第一辐射体11的至少部分设于底边514。第二辐射体21的一部分设于底边514，第二辐射体21的另一部分设于第二侧边516。第三辐射体23设于第二侧边516。
第一侧边515靠近底边514的位置接地，以形成第一辐射体11的第一接地端A。第一接地端A与第一耦合缝隙41之间的金属边框51形成第一辐射体11，换言之，第一辐射体11的一部分设于第一侧边515，另一部分设于底边514。第一耦合缝隙41与第二耦合缝隙42之间的金属边框51形成第二辐射体21。第二侧边516靠近第二耦合缝隙42的位置接地，以形成第二接地端G。第二接地端G与第二耦合缝隙42之间的金属边框51形成第三辐射体23。
请参阅图25，电子设备1000还包括设于边框51内且靠近底边514设置的电路板600及电子组件700。电路板600包括但不限于为硬质电路板600、柔性电路板600及软硬结合板等。电路板600靠近底边514、第一侧边515的底部(靠近底边514的位置)及第二侧边516的底部(靠近底边514的位置)设置。参考地GND、第一至第五匹配电路M5、第一信号源12、第二信号源22可皆设于电路板600上。
请参阅图25，电子组件700包括扬声器711、USB接口器件712、耳机座713、SIM卡槽组件714中的至少一种。第二天线20还包括设于电路板600上且电连接第二辐射体21的馈电支路和多个接地支路。馈电支路包括第四匹配电路M4及第二信号源22。接地支路包括接地的第二匹配电路M2、接地的第五匹配电路M5、接地的第三匹配电路M3等。
请参阅图25，电子组件700位于馈电支路与接地支路之间或位于相邻的两个接地支路之间。举例而言，第一信号源12、第一匹配电路M1的连接支路与接地的第二匹配电路M2之间形成第一空位716，接地的第二匹配电路M2与接地的第五匹配电路M5之间形成第二空位717，第二信号源22、第四匹配电路M4的连接支路与接地的第五匹配电路M5之间形成第三空位718，第二信号源22、第四匹配电路M4的连接支路与接地的第三匹配电路M3之间形成第四空位719。多个电子组件700可任意设于第一至第四空位716～719中。换言之，天线组件100上的馈电支路与接地支路可避开电子组件700设置，以使电子组件700与天线组件100相互交错设置，进一步地减小电子组件700与天线组件100之间的排布空间，减小器件布局的干扰，提高结构紧凑性，减小整机体积。
在一实施方式中，请参阅图25，扬声器711位于第一空位716，对应于第一耦合缝隙41。其中，第一耦合缝隙41可以与扬声器711孔(用于传出扬声器711发出的声音)相复用，例如在填充第一耦合缝隙41的绝缘段512上开设至少一个扬声器711孔，以减少在第二辐射体21上开设扬声器711孔。
在一实施方式中，请参阅图25，第二空位717设于底边514的中间位置。USB接口器件712位于第二空位717。在第二辐射体21上开设USB孔，并通过绝缘件使金属底边514与USB接口器件712绝缘设置，并通过绝缘件使得充电线的导电接头与金属底边514绝缘，以提高USB接口器件712与天线组件100的性能兼容性。进一步地，绝缘件还可作为密封于USB孔的密封件，以提高USB孔的防水密封性能。
在一实施方式中，请参阅图25，耳机座713和/或SIM卡槽组件714设于第三空位718。当耳机座713设于第三空位718时，第二辐射体21上设有对应于耳机座713的耳机孔，通过绝缘件使得耳机的导电接头与金属底边514绝缘，以提高耳机座713与天线组件100的性能兼容性。进一步地，绝缘件还可作为密封于耳机孔的密封件，以提高耳机孔的防水密封性能。当SIM卡槽组件714设于第三空位718时，第二辐射体21上设有对应于SIM卡槽组件714的SIM孔，通过绝缘件使得SIM卡槽组件714的导电接头与金属底边514绝缘，以提高SIM卡槽组件714与天线组件100的性能兼容性。进一步地，绝缘件还可作为密封于SIM孔的密封件，以提高SIM孔的防水密封性能。
本申请实施例提供的天线组件100还能够对于人体的靠近进行有效且精准地检测。该 检测功能能够应用于在人体靠近时减小天线组件100的收发功率，进而降低人体对于电磁波的比吸收率，减小电子设备1000对于人体的辐射影响，进一步地提高电子设备1000的应用可靠性。
第二天线20包括与第二辐射体21电性导通的第一射频前端单元。第一射频前端单元包括接地的第二匹配电路M2、接地的第五匹配电路M5、第二信号源22和第四匹配电路M4、接地的第三匹配电路M3。
请参阅图26，天线组件100还包括第一隔离器件811、第二隔离器件812、第一接近感测器件813及第二控制器(未图示)。
请参阅图26，第一隔离器件811设于第一射频前端单元与第二辐射体21之间。第一隔离器件811用于隔离待检测主体(例如人体头部等)靠近第二辐射体21时产生的第一感应信号及导通第二辐射体21收发的电磁波信号。具体的，第一隔离器件811的数量为多个。多个第一隔离器件811分别设于第二辐射体21与第二匹配电路M2之间、第二辐射体21与第五匹配电路M5之间、第二辐射体21与第四匹配电路M4之间、第二辐射体21与第三匹配电路M3之间。第一隔离器件811用于隔离待检测主体靠近第二辐射体21时产生的第一感应信号及导通第二辐射体21收发的电磁波信号。具体的，第一隔离器件811至少包括隔直电容。待检测主体包括但不限于人体的头部等。多个第一隔离器件811的设置，以使第二辐射体21相对于直流信号呈“悬置”状态，以感应人体的头部靠近带来的电信号变化。
可以理解的，当第二匹配电路M2连接第二辐射体21的器件为电容时，则可将该电容复用为第一隔离器件811，无需再额外设置隔直电容。相应地，第三匹配电路M3、第四匹配电路M4及第五匹配电路M5也是如此，不再一一赘述。
请参阅图26，第二隔离器件812的一端电连接第二辐射体21与第一隔离器件811之间。第二隔离器件812用于隔离第二辐射体21收发的电磁波信号及导通第一感应信号。具体的，第二隔离器件812至少包括隔离电感，以隔离较高频率的电信号，例如交流信号。
可以理解的，第二辐射体21产生的第一感应信号为直流信号。第二辐射体21收发的电磁波信号为交流信号。通过在第二辐射体21与第一射频前端单元之间设置第一隔离器件811，以使第一感应信号不会经第二辐射体21流向第一射频前端单元，以影响第二天线20的信号收发。通过在第一接近感测器件813与第二辐射体21之间设置第二隔离器件812，以使电磁波信号不会经第二辐射体21流向第一接近感测器件813，提高第一接近感测器件813对于接近感测信号的感测效率。
请参阅图26，第一接近感测器件813电连接于第二隔离器件812的另一端，用于感测第一感应信号的大小。本申请对于第一接近感测器件813的具体结构不做限定，第一接近感测器件813包括但不限于为用于感测电容变化或电感变化的传感器，用于检测其所连接的第一隔离器件811的电容变化量或第二隔离器件812的电感变化量。
第二控制器电连接第一接近感测器件813远离第二隔离器件812的一端，用于根据第一感应信号的大小判断待检测主体是否靠近第二辐射体21，并在待检测主体靠近第二辐射体21时降低第二天线20的功率。具体的，当第二控制器检测到第一感应信号大于或等于预设阈值时确定待检测主体靠近第二辐射体21，并控制第二天线20的功率减小。当天线的功率减小时，天线的辐射性能也相应地降低，人体对于天线辐射的电磁波的比吸收率也相应地降低，从而进一步提高电子设备1000的可靠性。
具体场景如下：人体皮肤表面带有电荷，当人体靠近第二辐射体21时，第二辐射体21与人体表面皮肤形成电场，第一隔离器件811感应到人体表面与第二辐射体21之间的电场叠加而带来的电容变化，而导致流经第二隔离器件812的电信号变化，进而使得第一接近感测器件813感应到大于预设阈值的第一感应信号。当第一接近感测器件813检测到人体靠近第二天线20时，可减小第二天线20的发射功率，进而减小人体对于第二天线20发射的电磁波信号的比吸收率；当第一接近感测器件813检测到人体远离第二天线20时，可增加第二天线20的发射功率，以提高天线组件100的天线性能，同时又不会增大人体对于第二天线20发射的电磁波信号的比吸收率，如此，进而实现电子设备1000的辐射性能智能可调；由于天线组件100的辐射体既能够作为收发电磁波的载体还能够作为感应人体电场靠近的载体，如此实现双重功能，在未增加辐射体体积的情况下增加了天线组件100的作用，利于实现功能多、集成度高且体积小的电子设备1000。
天线组件100的辐射体在作为收发电磁波信号的同时还能够复用天线组件100上的辐射体为人体等待检测主体靠近的感应电极，并通过第一隔离器件811、第二隔离器件812 分别对感应信号和电磁波信号进行隔离，实现了天线组件100的通信性能和感应待检测主体的作用，实现电子设备1000的辐射性能智能可调，且提高了电子设备1000的安全性能，还提高电子设备1000的器件利用率，减小电子设备1000的整体体积。
进一步地，在降低人体对于电子设备1000辐射的电磁波的比吸收率方面，可结合电子设备1000内的其他检测器或功能在更加必要的场景下降低人体对于电子设备1000辐射的电磁波的比吸收率。例如，在人体头部靠近电子设备1000时，降低电子设备1000的功率，进而降低人体头部对于电子设备1000辐射的电磁波的比吸收率。在检测人体头部靠近电子设备1000的场景中，可结合检测电子设备1000是否处于通话状态的场景。具体的，当检测到电子设备1000处于通话状态，且人体靠近电子设备1000的辐射体时，极可能是人体的头部靠近电子设备1000，以准备接听电话，此时可减少天线组件100的功率，以减少电子设备1000辐射的电磁波对于人体头部的辐射，减小人体头部对于电子设备1000辐射的电磁波的比吸收率。对于电子设备1000处于通话状态的检测，可检测受话器、听筒是否处于工作状态。
进一步地，可以在电子设备1000的多边皆设置天线组件100，并将这些天线组件100的辐射体皆作为检测人体电场接近电子设备1000的载体。当电子设备1000的多边皆检测到人体电场，且显示屏300处于熄屏状态时，说明电子设备1000极可能处于被随身携带的状态，此时，电子设备1000可控制所有天线组件100的功率降低，一方面是减小对于人体对于天线组件100的辐射电磁波的比吸收率，另一方面还可以节省电量。
请参阅图26，第二辐射体21至少覆盖或设于边框51的一个拐角(拐角是指两个相邻的边的交接处)。例如，第二辐射体21覆盖底边514、第二侧边516、底边514与第二侧边516之间的拐角，如此，第二辐射体21能够检测到正面、背面、底面、第二侧边516的朝向面的人体接近。
以上为第二辐射体21复用为人体电场感应的载体的实施方式，由于第二天线20为收发低频信号的天线，故第二辐射体21的长度相对较长，设置第二辐射体21为感应人体电场靠近的载体，可在电子设备1000上较大的范围内检测到人体靠近，进而提高人体靠近检测的准确性。当然，第一辐射体11和第三辐射体23也能够单独地复用为人体电场感应的载体，或者与第二辐射体21一起复用为人体电场感应的载体。具体详见以下的实施方式。
请参阅图27，第二天线20还包括第三隔离器件814，第三隔离器件814的一端电连接第二接地端G，另一端接地。第三隔离器件814为隔直电容，以使第三辐射体23相对于直流信号呈悬浮状态。第三辐射体23检测人体电场靠近的原理与上述第二辐射体21检测人体电场靠近的原理相同，在此不再赘述。
在第一种可能的实施方式中，在人体电场靠近第三辐射体23时，第三辐射体23产生第二感应信号，并将第二感应信号通过第二耦合缝隙42传递至第二辐射体21，以使第二辐射体21产生子感应信号，第一接近感测器件813检测到子感应信号并降低第二天线20的功率。
本实施方式中，第二辐射体21与第三辐射体23皆作为感应待检测主体靠近的感应电极，且第三辐射体23的接近感应路径为第三辐射体23、第二辐射体21至第一接近感测器件813。换言之，当待检测主体靠近第三辐射体23时，第三辐射体23产生第二感应信号，该第二感应信号通过第一耦合缝隙41使第二辐射体21产生子感应信号，这样第一接近感测器件813也能够感应到第三辐射体23处的待检测主体。无需使用两个接近感测器件，还充分利用了第二辐射体21与第三辐射体23之间的耦合作用及第一接近感测器件813，使第二辐射体21与第三辐射体23在接近检测时也能够复用，增加了器件的利用率，减小器件数量，进一步地促进电子设备1000集成化和小型化。
在第二种可能的实施方式中，请参阅图28，第三辐射体23设于第二侧边516。第二接地端G与非第三辐射体23的金属第二侧边516之间设置绝缘段512，以使第三辐射体23与其他的金属第二侧边516断开。第二天线20还包括第四隔离器件815。第四隔离器件815的一端电连接于第三辐射体23与第三隔离器件814之间或电连接第三辐射体23，用于隔离第三辐射体23收发的电磁波信号及导通第二感应信号。具体的，第四隔离器件815包括隔离电感。
进一步地，请参阅图28，天线组件100还包括第二接近感测器件816，第二接近感测器件816电连接于第四隔离器件815的另一端，用于感测第二感应信号的大小。具体的，第二辐射体21和第三辐射体23皆为感应待检测主体靠近的感应电极，且第二辐射体21的接近感应路径与第三辐射体23的接近感应路径相互独立，可以准确地检测到待检测主体靠 近第二辐射体21或第三辐射体23，进而及时地响应上述的靠近行为。具体的，待检测主体靠近第三辐射体23时，第三辐射体23产生的第二感应信号为直流信号。电磁波信号为交流信号。通过在第三辐射体23与参考地GND之间设置第四隔离器件815，以使第二感应信号不会经第三辐射体23流向参考地GND，以影响第二天线20的信号收发。通过在第二接近感测器件816与第三辐射体23之间设置第四隔离器件815，以使电磁波信号不会经第三辐射体23流向第二接近感测器件816，提高第二接近感测器件816对于第二感应信号的感测效率。本申请对于第二接近感测器件816的具体结构不做限定，第二接近感测器件816包括但不限于为用于感测电容变化或电感变化的传感器。
在其他实施方式中，在仅仅设置第二接近感测器件816，而不设置第一接近感测器件813，利用第二辐射体21与第三辐射体23的耦合将第二辐射体21的感应信号经过第三辐射体23传输至第二接近感测器件816。
在第三种可能的实施方式中，请参阅图29，本实施方式与第二种实施方式不同的是，本实施方式中未设置第二接近感测器件816。第四隔离器件815的另一端电连接第一接近感测器件813。第二辐射体21与第三辐射体23容性耦合时产生耦合感应信号。第一接近感测器件813还用于在待检测主体靠近第二辐射体21和/或第三辐射体23时感应耦合感应信号的变化量。
具体的，第二辐射体21与第三辐射体23之间耦合时产生恒定电场，表现为产生稳定的耦合感应信号。当人体靠近该恒定电场时，该恒定电场会发生变化，表现为耦合感应信号的变化，根据耦合感应信号的变化量来检测人体的靠近。
本实施方式，第二辐射体21与第三辐射体23同时作为感应电极，可对于第二辐射体21所对应的区域、第三辐射体23所对应的区域及第二耦合缝隙42所对应的区域内具有人体靠近时进行准确检测。无需使用两个接近感测器件，还充分利用了第二辐射体21与第三辐射体23之间的耦合作用及第一接近感测器件813，使第二辐射体21与第三辐射体23在接近检测时也能够复用，增加了器件的利用率，减小器件数量，进一步地促进电子设备1000集成化和小型化。
请参阅图30，第一天线10还包括第五隔离器件817，其中，第五隔离器件817的数量为多个。第五隔离器件817电连接于第一辐射体11的第一接地端A与参考地GND之间、第一馈电点B与第一匹配电路M1之间。可选的，第一接地端A可与除第一辐射体11之外的其他金属边框绝缘。第五隔离器件817为隔直电容，以使第一辐射体11相对于直流信号呈悬浮状态。第一辐射体11检测人体电场靠近的原理与上述第二辐射体21检测人体电场靠近的原理相同，在此不再赘述。
在一种可能的实施方式中，在人体电场靠近第一辐射体11时，第一辐射体11产生第三感应信号，并将第三感应信号通过第一耦合缝隙41传递至第二辐射体21，以使第二辐射体21产生子感应信号，第一接近感测器件813检测到子感应信号并降低第一天线10的功率。本实施方式中的感应路径为第一辐射体11、第二辐射体21、第一接近感测器件813。
在第二种可能的实施方式中，请参阅图31，第一辐射体11设于第一侧边515。第一接地端A与非第一辐射体11的金属第一侧边515之间设置绝缘段512，以使第一辐射体11与其他的金属第一侧边515断开。第一天线10还包括第六隔离器件818。第六隔离器件818的一端电连接于第一辐射体11与第五隔离器件817之间或电连接第一辐射体11，用于隔离第一辐射体11收发的电磁波信号及导通第三感应信号。具体的，第六隔离器件818包括隔离电感。
第六隔离器件818的另一端电连接第一接近感测器件813。第二辐射体21与第一辐射体11容性耦合时产生耦合感应信号。第一接近感测器件813还用于在待检测主体靠近第二辐射体21和/或第一辐射体11时感应耦合感应信号的变化量。
具体的，第二辐射体21与第一辐射体11之间耦合时产生恒定电场，表现为产生稳定的耦合感应信号。当人体靠近该恒定电场时，该恒定电场会发生变化，表现为耦合感应信号的变化，根据耦合感应信号的变化量来检测人体的靠近。
第三种可能的实施方式中，请参阅图32，本实施方式与上述的第二种实施方式不同的是，第六隔离器件818未电连接第一接近感测器件813。天线组件100还包括第三接近感测器件819，第三接近感测器件819电连接于第六隔离器件818的另一端，用于感测第三感应信号的大小。具体的，第二辐射体21和第一辐射体11皆为感应待检测主体靠近的感应电极，且第二辐射体21的接近感应路径与第一辐射体11的接近感应路径相互独立，可以准确地检测到待检测主体靠近第二辐射体21或第一辐射体11，进而及时地响应上述的靠 近行为。具体的，待检测主体靠近第一辐射体11时，第一辐射体11产生的第三感应信号为直流信号。电磁波信号为交流信号。通过在第一辐射体11与参考地GND之间设置第六隔离器件818，以使第三感应信号不会经第一辐射体11流向参考地GND，以影响第二天线20的信号收发。通过在第二接近感测器件816与第一辐射体11之间设置第六隔离器件818，以使电磁波信号不会经第一辐射体11流向第三接近感测器件819，提高第三接近感测器件819对于第三感应信号的感测效率。本申请对于第三接近感测器件819的具体结构不做限定，第三接近感测器件819包括但不限于为用于感测电容变化或电感变化的传感器。本实施方式中，第一辐射体11的感应路径可以与第二辐射体21的感应路径相互独立。
将第一辐射体11、第二辐射体21及第三辐射体23皆形成检测电极，可增加检测电极的面积，进而在更大的范围内对待检测主体的靠近进行检测，进一步提高电子设备1000的辐射性能的调节准确性。
以上所述是本申请的部分实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (20)

  1. 一种天线组件，其特征在于，包括：
    第一天线，所述第一天线包括第一辐射体及电连接所述第一辐射体的第一信号源；及
    第二天线，所述第二天线包括第二辐射体及第三辐射体，所述第二辐射体的一端与所述第一辐射体的一端之间具有第一耦合缝隙，所述第二辐射体的另一端与所述第三辐射体的一端之间具有第二耦合缝隙；
    所述第一辐射体用于在所述第一信号源的激励下产生至少一个谐振模式，并在所述第一信号源的激励下通过所述第一耦合缝隙激励所述第二辐射体靠近所述第二耦合缝隙的部分产生至少一个谐振模式。
  2. 如权利要求1所述的天线组件，其特征在于，所述第一辐射体在所述第一信号源的激励下产生的谐振模式的谐振频率与所述第二辐射体在所述第一辐射体的耦合激励下产生的谐振模式的谐振频率不同。
  3. 如权利要求2所述的天线组件，其特征在于，所述第一辐射体用于在所述第一信号源的激励下通过所述第一耦合缝隙激励所述第二辐射体靠近所述第一耦合缝隙的部分和所述第二辐射体靠近所述第二耦合缝隙的部分产生至少一个谐振模式，所述至少一个谐振模式包括第一子谐振模式和第二子谐振模式，其中，所述第一子谐振模式的谐振频率小于所述第二子谐振模式的谐振频率。
  4. 如权利要求3所述的天线组件，其特征在于，所述第一子谐振模式、所述第二子谐振模式中的一者由所述第二辐射体靠近所述第一耦合缝隙的部分产生，及所述第一子谐振模式、所述第二子谐振模式中的另一者由所述第二辐射体靠近所述第二耦合缝隙的部分产生；或者，
    所述第一子谐振模式、所述第二子谐振模式皆由所述第二辐射体靠近所述第二耦合缝隙的部分产生；或者，所述第一子谐振模式、所述第二子谐振模式皆由所述第二辐射体靠近所述第一耦合缝隙的部分产生。
  5. 如权利要求3所述的天线组件，其特征在于，所述第一辐射体在所述第一信号源的激励下产生的谐振模式包括第三子谐振模式及第四子谐振模式，其中，所述第三子谐振模式的谐振频率小于所述第四子谐振模式的谐振频率。
  6. 如权利要求5所述的天线组件，其特征在于，所述第二子谐振模式的谐振频率小于所述第三子谐振模式的谐振频率；或者，
    所述第二子谐振模式的谐振频率大于所述第三子谐振模式的谐振频率且小于所述第四子谐振模式的谐振频率，及所述第一子谐振模式的谐振频率小于或大于所述第三子谐振模式的谐振频率；或者，
    所述第二子谐振模式的谐振频率大于所述第四子谐振模式的谐振频率，及所述第一子谐振模式的谐振频率小于所述第三子谐振模式的谐振频率、或大于所述第三子谐振模式的谐振频率且小于所述第四子谐振模式的谐振频率、或大于所述第四子谐振模式的谐振频率。
  7. 如权利要求5所述的天线组件，其特征在于，所述第一辐射体在所述第一信号源的激励下产生的谐振模式还包括第五子谐振模式，所述第五子谐振模式的谐振频率、所述第一子谐振模式的谐振频率、所述第二子谐振模式的谐振频率、所述第三子谐振模式的谐振频率、所述第四子谐振模式的谐振频率依次增加；所述第五子谐振模式为所述第一辐射体为工作在高阶谐振的谐振模式，所述第三子谐振模式为所述第一辐射体工作在基态的谐振模式。
  8. 如权利要求2～7任意一项所述的天线组件，其特征在于，所述第一辐射体在所述第一信号源的激励下产生的谐振模式覆盖的频段与所述第二辐射体在所述第一信号源的激励下产生的谐振模式覆盖的频段组合形成的频段的带宽为500M～5000M，和/或，所述第一辐射体在所述第一信号源的激励下产生的谐振模式覆盖的频段与所述第二辐射体在所述第一信号源的激励下产生的谐振模式覆盖的频段皆大于1000MHz。
  9. 如权利要求2～7任意一项所述的天线组件，其特征在于，所述第一辐射体在所述第一信号源的激励下产生的谐振模式覆盖的频段与所述第二辐射体在所述第一信号源的激励下产生的谐振模式覆盖的频段组合形成的频段覆盖1000MHz～6000MHz。
  10. 如权利要求7所述的天线组件，其特征在于，所述第一辐射体包括第一接地端、第一耦合端及设于所述第一接地端与所述第一耦合端之间的第一馈电点；所述第一接地端接地，所述第一耦合端为形成所述第一耦合缝隙的一端；所述第一天线还包括第一匹配电路；所述第一匹配电路的一端电连接所述第一信号源，所述第一匹配电路的另一端电连接所述 第一馈电点；
    所述第一接地端与所述第一耦合端之间的第一辐射体在所述第一信号源作用下产生所述第三子谐振模式；所述第一馈电点与所述第一耦合端之间的第一辐射体在所述第一信号源的作用下产生所述第四子谐振模式；所述第一接地端与所述第一耦合端之间的第一辐射体在所述第一信号源的容性耦合馈作用下产生所述第五子谐振模式。
  11. 如权利要求7所述的天线组件，其特征在于，所述第二辐射体包括第二耦合端、第三耦合端及设于所述第二耦合端与所述第三耦合端之间的第一谐振点、第二谐振点，所述第二耦合端为所述第二辐射体上形成所述第一耦合缝隙的端部，所述第三耦合端为形成所述第二耦合缝隙的端部；
    所述第二天线还包括第二匹配电路及第三匹配电路，所述第二匹配电路的一端接地，所述第二匹配电路的另一端电连接所述第一谐振点，所述第三匹配电路的一端接地，所述第三匹配电路的另一端电连接所述第二谐振点，所述第一谐振点与所述第二耦合端之间的第二辐射体在所述第一辐射体的耦合激励下产生所述第一子谐振模式；所述第二谐振点与所述第三耦合端之间的第二辐射体在所述第一辐射体的耦合激励下产生所述第二子谐振模式。
  12. 如权利要求1～7任意一项所述的天线组件，其特征在于，所述第二天线还包括电连接所述第二辐射体的第二信号源，所述第二辐射体在所述第二信号源的激励下产生至少一个谐振模式，所述第二辐射体在所述第二信号源的激励下产生的谐振模式覆盖的频段小于1000MHz。
  13. 如权利要求12所述的天线组件，其特征在于，所述第二天线还包括第四匹配电路、第二匹配电路及第三匹配电路；所述第二辐射体包括第二耦合端、第三耦合端及依次设于所述第二耦合端与所述第三耦合端之间的第一谐振点、第二馈电点及第二谐振点；
    所述第三辐射体包括第四耦合端及第二接地端，所述第二接地端接地；
    所述第二耦合端为所述第二辐射体形成所述第一耦合缝隙的一端，所述第三耦合端与所述第四耦合端之间形成所述第二耦合缝隙，所述第四匹配电路的一端电连接所述第二信号源，所述第四匹配电路的另一端电连接所述第二馈电点；所述第二匹配电路的一端接地，所述第二匹配电路的另一端电连接所述第一谐振点，所述第三匹配电路的一端接地，所述第三匹配电路的另一端电连接所述第二谐振点，所述第一谐振点与所述第三耦合端之间的第二辐射体在所述第二信号源的激励下产生至少一个谐振模式；或者，所述第二谐振点与所述第二耦合端之间的第二辐射体在所述第二信号源的激励下产生至少一个谐振模式。
  14. 如权利要求13所述的天线组件，其特征在于，所述第二辐射体还包括调频点，所述调频点位于所述第一谐振点与所述第二馈电点之间；所述第二天线还包括第五匹配电路，所述第五匹配电路的一端接地，所述第五匹配电路的另一端电连接所述调频点；所述第二匹配电路、所述第三匹配电路、所述第五匹配电路及所述第四匹配电路中至少一者用于调节所述第二辐射体在所述第二信号源的激励下产生的谐振模式的谐振频率。
  15. 如权利要求14所述的天线组件，其特征在于，所述天线组件包括第一控制器，所述第一控制器用于根据所述第一耦合缝隙处于自由辐射场景及所述第二耦合缝隙所处于辐射封堵场景确定所述第二辐射体为第一辐射模式；还用于根据所述第一耦合缝隙处于辐射封堵场景及所述第二耦合缝隙所处于自由辐射场景确定所述第二辐射体为第二辐射模式；还用于根据所述第一耦合缝隙及所述第二耦合缝隙皆所处于自由辐射场景时确定所述第二辐射体为第一辐射模式或第二辐射模式；其中，所述第一辐射模式为所述第一信号源激励所述第二谐振点与所述第二耦合端之间的第二辐射体产生至少一个谐振模式；所述第二辐射模式为所述第一信号源激励所述第一谐振点与所述第三耦合端之间的第二辐射体在所述第二信号源的激励下产生至少一个谐振模式。
  16. 如权利要求15所述的天线组件，其特征在于，所述第二匹配电路包括至少一个第一选择开关、第一高阻抗支路和第一低阻抗支路，所述第一选择开关用于在所述第一高阻抗支路和所述第一低阻抗支路中选择一者电连接所述第一谐振点；
    所述第三匹配电路包括至少一个第二选择开关、第二高阻抗支路和第二低阻抗支路，所述第二选择开关用于在所述第二高阻抗支路和所述第二低阻抗支路中选择一者电连接所述第二谐振点；
    所述第一控制器电连接所述第一选择开关和所述第二选择开关，所述第一控制器用于根据所述第一耦合缝隙处于自由辐射场景及所述第二耦合缝隙所处于辐射封堵场景控制所述第一选择开关导通所述第一高阻抗支路与所述第一谐振点，及控制所述第二选择开关导 通所述第二低阻抗支路与所述第二谐振点；所述第一控制器用于根据所述第一耦合缝隙处于辐射封堵场景及所述第二耦合缝隙所处于自由辐射场景控制所述第一选择开关导通所述第一低阻抗支路与所述第一谐振点，及控制所述第二选择开关导通所述第二高阻抗支路与所述第二谐振点。
  17. 如权利要求13所述的天线组件，其特征在于，所述第二天线还包括中高频带通支路，所述中高频带通支路的一端接地，所述中高频带通支路的另一端电连接所述第四匹配电路。
  18. 如权利要求1～7任意一项所述的天线组件，其特征在于，所述第二天线还包括与所述第二辐射体电性导通的射频前端单元；
    所述天线组件还包括第一隔离器件、第二隔离器件、接近感测器件及第二控制器，所述第一隔离器件设于所述射频前端单元与所述第二辐射体之间，所述第一隔离器件用于隔离待检测主体靠近所述第二辐射体时产生的感应信号及导通所述第二辐射体收发的电磁波信号；所述第二隔离器件的一端电连接所述第二辐射体与所述第一隔离器件之间或电连接所述第二辐射体，所述第二隔离器件用于隔离所述第二辐射体收发的电磁波信号及导通所述感应信号；所述接近感测器件电连接于所述第二隔离器件的另一端，用于感测所述感应信号的大小；所述第二控制器用于根据所述感应信号的大小判断所述待检测主体是否靠近所述第二辐射体，并在所述待检测主体靠近所述第二辐射体时降低所述第二天线的功率。
  19. 一种电子设备，其特征在于，所述电子设备包括边框及如权利要求1～18任意一项所述的天线组件，所述第一辐射体、所述第二辐射体、所述第三辐射体与所述边框集成为一体；或者，所述第一辐射体、所述第二辐射体、所述第三辐射体成型于所述边框的表面；或者，所述第一辐射体、所述第二辐射体、所述第三辐射体设于柔性电路板，所述柔性电路板贴设于所述边框的表面；和/或，
    所述边框包括依次首尾相连的多个侧边，相邻的两个所述侧边相交；所述第一耦合缝隙和所述第二耦合缝隙分别设于所述边框的两个相交的所述侧边；或者，所述第一耦合缝隙和所述第二耦合缝隙皆设于所述边框的同一个侧边。
  20. 如权利要求19所述的电子设备，其特征在于，多个所述侧边包括相对设置的顶边和底边，及连接于所述顶边与所述底边之间的第一侧边和第二侧边，所述第一辐射体的至少部分设于所述底边，所述第一耦合缝隙设于所述底边，所述第二辐射体的一部分设于所述底边，所述第二辐射体的另一部分设于所述第二侧边，所述第三辐射体设于所述第二侧边，所述第二耦合缝隙设于所述第二侧边；
    所述电子设备还包括设于所述边框内且靠近所述底边设置的电路板及电子组件，所述电子组件包括扬声器、USB接口器件、耳机座、SIM卡槽组件中的至少一种；所述第二天线还包括设于所述电路板上且电连接所述第二辐射体的馈电支路和多个接地支路，所述电子组件位于所述馈电支路与所述接地支路之间或位于相邻的两个所述接地支路之间。
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