WO2022267268A1 - 微通道热沉及其制造方法 - Google Patents

微通道热沉及其制造方法 Download PDF

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Publication number
WO2022267268A1
WO2022267268A1 PCT/CN2021/124091 CN2021124091W WO2022267268A1 WO 2022267268 A1 WO2022267268 A1 WO 2022267268A1 CN 2021124091 W CN2021124091 W CN 2021124091W WO 2022267268 A1 WO2022267268 A1 WO 2022267268A1
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WIPO (PCT)
Prior art keywords
cover plate
heat sink
microchannel
upper cover
lower cover
Prior art date
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Ceased
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PCT/CN2021/124091
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English (en)
French (fr)
Inventor
王郑
马文珍
李志恒
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Foshan Huazhi Advanced Materials Co Ltd
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Foshan Huazhi Advanced Materials Co Ltd
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Publication date
Application filed by Foshan Huazhi Advanced Materials Co Ltd filed Critical Foshan Huazhi Advanced Materials Co Ltd
Priority to KR1020227020269A priority Critical patent/KR102624495B1/ko
Priority to US17/788,917 priority patent/US12151279B2/en
Priority to EP21890364.9A priority patent/EP4135134B1/en
Priority to JP2022527757A priority patent/JP7352735B2/ja
Priority to IL293947A priority patent/IL293947A/en
Publication of WO2022267268A1 publication Critical patent/WO2022267268A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • F28F2275/061—Fastening; Joining by welding by diffusion bonding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/04—Means for preventing wrong assembling of parts

Definitions

  • the invention relates to the field of chip heat dissipation, in particular to a microchannel heat sink and a manufacturing method thereof.
  • the ordinary plate heat sinks and macro-channel heat sinks that are common in the market can no longer meet the heat dissipation requirements of high-power chips.
  • the micro-channel heat sinks that have emerged in recent years have become a research hotspot due to their efficient heat dissipation.
  • Microchannel heat sinks usually refer to liquid-cooled heat sinks with an internal channel width of less than 500 ⁇ m. When the fluid flows in the microchannel heat sink, it is in a strong turbulent state. At the same time, the thermal boundary layer is thin and the thermal resistance is low. It has fast heat transfer speed, With the advantages of high heat dissipation efficiency, it can better meet the heat dissipation requirements of high-power chips with high heat flux density.
  • Microchannel heat sinks are usually made of materials such as silicon, ceramics, and metals. Among them, metals are ideal materials for manufacturing microchannel heat sinks due to their high thermal conductivity.
  • the traditional micro-channel heat sink processing technology usually processes each layer of the plate into the required pattern structure, and then welds the multi-layer plates together through brazing, diffusion welding and other processes to form various complex micro-channels inside. heat sink of the structure.
  • the solder melts during the welding process and easily flows into the channel to cause blockage, and will lead to unstable connections in some areas; Electrochemical corrosion is prone to occur between the plates, which will reduce the reliability of micro-channel heat sink products.
  • the diffusion welding process is used, a high pressure is required to achieve a good bonding effect. Since the metal material such as copper or aluminum is soft, the channel part will be deformed under high pressure, but if the applied pressure is small, the interlayer The binding force will be deteriorated, and the microchannel heat sink is prone to leakage when working with liquid.
  • the invention provides a method for manufacturing a microchannel heat sink, comprising the steps of:
  • the heat preservation and pressure application are stopped, and the upper cover and the lower cover are removed.
  • it also includes the step of processing positioning holes at the corresponding positions of the upper cover plate, the layers of plates and the lower cover plate, and when aligning and stacking, the upper cover plate, The layers of plates and the lower cover are aligned through the positioning holes.
  • the positioning holes are distributed in the parts near the corners of each of the plates and in the area outside the preset liquid inlet and outlet channels and microchannel structures on each plate.
  • the inlet and outlet liquid channels and microchannel structures on the various layers of plates are made by chemical etching, laser cutting, plasma cutting, flame cutting, grinding wheel cutting, water jet cutting, wire cutting, CNC machine tools It can be processed by any method of processing and stamping.
  • the material of the upper cover plate and the lower cover plate is metal or alloy.
  • the material thickness of the upper cover plate and the lower cover plate is not less than the depression depth of the corresponding cover plate when pressed.
  • it also includes an easy-to-separate device between the upper cover plate and the plate material close to the upper cover plate and/or between the lower cover plate and the plate material close to the lower cover plate. Steps to isolate layers.
  • the easily separable isolation layer is graphite paper or graphite liquid.
  • an upper pressing block and a lower pressing block are respectively placed on the sides of the upper cover plate and the lower cover plate away from the stacked layers of plates, and the upper pressing The block and the lower pressing block respectively press the cover plate to apply pressure to the stacked layers of plates, or directly press the upper cover plate and the lower cover plate to apply pressure to the stacked layers of plates.
  • the applied pressure is 1-20 MPa.
  • the heating method is to raise the temperature to 300°C-950°C at a rate of 30°C/min-8000°C/min, and the holding time of the heat preservation is 120s-3600s.
  • the present invention also provides a microchannel heat sink, which is manufactured by the manufacturing method of the microchannel heat sink described in any one of the above embodiments.
  • the manufacturing method of the above-mentioned micro-channel heat sink adopts a thermal bonding process to process the micro-channel heat sink.
  • direct pressure is applied without adding other adhesives. Avoid problems such as channel internal blockage and electrochemical corrosion caused by the brazing process, and improve the reliability of micro-channel heat sink products.
  • the upper cover and the lower cover are processed according to the micro-channel structure to form a hollow structure, then aligned and stacked with the micro-channel heat sink, and then pressure-welded, which not only achieves accurate and effective micro-channel walls Pressure can also greatly relieve the pressure on the microchannel heat sink structure during the pressure welding process, and reduce the deformation of the microchannel heat sink coolant channel. Compared with the conventional diffusion welding process, it can be used under the same conditions.
  • the micro-channel heat sink exerts greater pressure to improve the interlayer bonding force of the micro-channel heat sink and improve product stability.
  • Fig. 1 is the schematic flow sheet of the manufacturing method of the microchannel heat sink of one embodiment of the present invention
  • Fig. 2 is the schematic structural view of each layer of plates laminated by five layers of reentrant microchannel heat sinks to be produced in Example 1;
  • Fig. 3 is the structural representation of upper cover plate, lower cover plate in embodiment 1;
  • Example 4 is a schematic diagram of the press-fit assembly sequence of the five-layer reentrant microchannel heat sink to be produced in Example 1;
  • FIG. 5 is a schematic diagram of the finished product of the five-layer reentrant microchannel heat sink in Example 1.
  • FIG. 5 is a schematic diagram of the finished product of the five-layer reentrant microchannel heat sink in Example 1.
  • 100 stacked plates of each layer; 101-105: first-layer plate to fifth-layer plate; 106: first positioning hole; 107: liquid inlet and outlet channels; 108: first microchannel structure; 200: upper cover plate; 201: second positioning hole; 202: second microchannel structure; 300: lower cover plate; 301: third positioning hole; 302: third microchannel structure; 400: finished microchannel heat sink.
  • an embodiment of the present invention provides a method for manufacturing a microchannel heat sink, which includes the following steps S110 - S150 .
  • Step S110 Prefabricated liquid inlet and outlet channels and microchannel structures are processed on each layer of plates constituting the microchannel heat sink.
  • the design of the microchannel structure has a great influence on the heat transfer capacity of the microchannel heat sink.
  • the design of the microchannel structure takes thermal resistance as the main parameter. The smaller the thermal resistance is, the better the heat dissipation performance of the microchannel heat sink is.
  • the biggest factor in the thermal resistance of the microchannel heat sink is the nature of the coolant.
  • the temperature of the fluid rises to generate thermal resistance. The greater the fluid flow rate, the greater the heat capacity of the fluid and the smaller the thermal resistance value.
  • the convective thermal resistance generated by heat convection at the interface between the microchannel and the fluid is also the main part of the thermal resistance of the microchannel. Therefore, microchannel structures with different patterns can be processed according to the thermal resistance requirements of the heat exchanger.
  • multi-layer sheets can also be stacked to further enhance the heat dissipation effect.
  • the microchannel junction pattern of each layer of sheets can be designed according to requirements, and can be the same or different. For example, it can be designed but not limited to Five-layer switchback structure.
  • Step S120 Take the upper cover plate and the lower cover plate, and process corresponding patterns on the upper cover plate and the lower cover plate according to the microchannel structure of the uppermost plate and the lowermost plate of the microchannel heat sink to be fabricated.
  • the upper cover and the lower cover are processed into corresponding patterns according to the microchannel structure of the uppermost and lowermost sheets of the heat sink to be made.
  • the pressure is applied, because the structural patterns of the upper cover and the lower cover Consistent, the upper cover plate and the lower cover plate at the channel structure will not produce pressure on the micro-channel heat sink plate to be produced, which can reduce the damage to the micro-channel structure of the plate by pressure, and each layer of the micro-channel heat sink can withstand greater The pressure makes the pressing effect more tightly.
  • Step S130 Aligning and stacking the upper cover, each layer of plates and the lower cover in sequence.
  • each layer of plates needs to be aligned and stacked according to the design of the micro-channel heat sink structure.
  • the micro-channel structure of each layer of plates needs to correspond to the preset structure to achieve the preset heat dissipation effect. If the stack is not neat, it will not be conducive to sufficient heat dissipation when the heat sink is working. .
  • the upper cover plate and each layer of plates, as well as each layer of plates and the lower cover plate need to be aligned and stacked in order to ensure that the hollow structure of the upper cover plate and the lower cover plate is consistent with the microchannels of the uppermost plate and the bottom plate during pressing.
  • the corresponding structure can effectively disperse the pressure of the cover plate on each layer of boards, and avoid damage to each layer of boards due to excessive pressure when applying pressure.
  • Step S140 Place the aligned and stacked upper cover plate, each layer of plates and the lower cover plate in a reducing atmosphere for heating and heat preservation, and apply pressure on the upper cover plate and/or the lower cover plate.
  • Hydrogen gas can be used as the reducing atmosphere, but not limited to, to ensure that the sheets of each layer will not be oxidized during the pressing process.
  • the atomic diffusion rate between the layers of plates is different. The higher the temperature and the greater the pressure, the faster the atomic diffusion rate between each layer of plates, and the tighter the plates are pressed. Ensure that all layers of boards are fully pressed together.
  • Step S150 After the pressure application reaches the preset time, stop the heat preservation and pressure application, and remove the upper cover and the lower cover.
  • the pressing is completed, and the pressed upper cover, each layer of plates and the lower cover can be taken out after cooling, but not limited to.
  • the upper cover plate and the lower cover plate are used as isolation plates to assist the safe pressing of each layer of plates, and are removed after the pressing is completed, and the laminated layers of plates are processed to become the finished microchannel heat sink.
  • the manufacturing method of the micro-channel heat sink provided by the present invention adopts a thermal bonding processing technology, that is, the micro-channel heat sink to be produced after surface treatment is closely bonded together, without other adhesives, directly placed at high temperature Heating and pressure welding in the furnace, after pressing, each layer of the micro-channel heat sink is firmly bonded together.
  • the manufacturing method of the above-mentioned microchannel heat sink also includes the step of processing positioning holes at the corresponding positions of the upper cover plate, each layer of plates and the lower cover plate, and when aligning and stacking, the upper cover plate, Each layer of boards and the lower cover are aligned through the positioning holes.
  • the method of positioning holes is used to ensure that the upper cover plate, each layer of plates, and the lower cover plate are neatly stacked, and the positions are corresponding, which is convenient for accurate welding.
  • the positioning holes are distributed on the parts near the corners of each plate and outside the preset liquid inlet and outlet channels and microchannel structures on each plate. Because these positioning holes are not part of the liquid inlet and outlet channels and the microchannel heat sink structure, the positioning holes are located near the corners of the plates. After welding, the redundant parts such as the positioning holes can be cut off by cutting. .
  • the positions of the positioning holes can be designed according to the structure of the microchannel heat sink to be fabricated, and are not limited to the positions near the corners of each layer of plates. It can be understood that in other specific examples, specific holes on the microchannel structure can also be used as positioning holes to play a positioning role. In this way, it is not necessary to process additional positioning holes, and it is not necessary to additionally cut the positioning holes.
  • the number, size and shape of positioning holes can be designed according to specific product manufacturing needs.
  • the number of positioning holes can be but not limited to 2 to 4
  • the inner diameter of the holes can be but not limited to 2 to 4mm.
  • the shape can be but not limited to a round hole, as long as the structure of the microchannel heat sink itself is not affected, there is no limit to the number, size and position of the positioning holes.
  • the inlet and outlet liquid channels and microchannel structures on each layer of sheet materials can be processed by, but not limited to, chemical etching, laser cutting, plasma cutting, flame cutting, grinding wheel cutting, water jet cutting, wire cutting, and CNC machine tools. And it can be processed by any method in stamping.
  • the plates of each layer are metals or alloys with good thermal conductivity.
  • any of the above-mentioned processing methods can be used to quickly process the inlet and outlet liquid channels and the microchannel structure.
  • chemical etching can be used for processing. Chemical etching is suitable for processing most metals and alloys. It has high processing precision, no stress during processing, no burrs, low processing cost, and flexible technology. There is no effect on the structural performance of the microchannel heat sink.
  • each layer of plates needs to be cleaned before and after processing.
  • the metal plate is exposed to the air for a long time, and there will be foreign matter, dirt and oxides on the surface.
  • the grease and oxide film on the surface of the metal plate can be removed by pickling, and then the plate can be thoroughly cleaned by washing with water.
  • the cleaning method Not limited to this.
  • the material of the upper cover plate and the lower cover plate is metal or alloy.
  • the materials of the upper cover and the lower cover are high temperature resistant and have Higher strength, to ensure that the upper cover and the lower cover will not be deformed and cracked during the high temperature and high pressure thermal bonding process, and ensure that it will not have a destructive effect on the various layers of the microchannel heat sink, for example, the upper cover
  • the material of the plate and the lower cover plate can be, but not limited to, any one of metals such as iron, cobalt, chromium, nickel, tungsten, molybdenum, aluminum, titanium and their alloys, and further, for example, it can be but not limited to GH4169 nickel Any one of Ti-18 (Ti-6Al-4Mo-4Zr-2Sn-1W-0.2Si) titanium-based alloy, Inconel718, but not limited to Al 2 O
  • the material thickness of the upper cover plate and the lower cover plate is not less than the depression depth of the corresponding cover plate when pressed.
  • the thickness of the upper cover and the lower cover is also one of the important factors to ensure the safety of the thermal bonding process.
  • the thickness is not less than the depression depth of the corresponding cover under pressure, which can further ensure that the cover will not be deformed or damaged during the pressing process. It will affect the structure of the plate, specifically, the thickness is not less than 0.08mm.
  • it further includes the step of providing an easily separable isolation layer between the upper cover plate and the plate material close to the upper cover plate and/or between the lower cover plate and the plate material close to the lower cover plate.
  • the easily separable isolation layer may be, but not limited to, graphite paper or graphite liquid.
  • the upper pressing block and the lower pressing block are respectively placed on the side of the upper cover plate and the lower cover plate away from the laminated sheets, and the upper pressing block and the lower pressing block respectively Press the cover plate to apply pressure to the laminated plates, or directly press the upper cover plate and the lower cover plate to apply pressure to the laminated plates.
  • direct pressure the material of the upper cover plate and the lower cover plate is the same as that of the upper briquetting block and the lower briquetting block. At this moment, the upper cover plate and the lower cover plate have both the functions of the cover plate and the briquetting block.
  • the applied pressure is 1-20 MPa.
  • the pressure applied is related to the material of each layer of the plate and the design of the microchannel structure. For example, it can be 3MPa, 5MPa, 10MPa, 15MPa. The same pressure can be used in the whole process of applying pressure, or it can be applied at different times.
  • the time zone adjusts the pressure in the range of 1-20 MPa according to the degree of thermal bonding.
  • the heating method is to rapidly raise the temperature to 300° C. to 950° C. at a rate of 30° C./min to 8000° C./min, and the heat preservation time is 120 s to 3600 s. Rapidly heat up to the pressing temperature for pressure welding, and keep warm for a period of time to ensure sufficient pressing.
  • the temperature is rapidly raised to 500°C-900°C at a rate of 2000°C/min-6000°C/min, and the holding time for heat preservation is 600s ⁇ 1800s.
  • the present invention also provides a micro-channel heat sink, which is manufactured by the method for manufacturing a micro-channel heat sink in any specific example above.
  • microchannel heat sink and its manufacturing method of the present invention will be further described in detail below by taking the manufacture of a five-layer turn-back microchannel heat sink as an example. Understandably, the manufacturing method of the micro-channel heat sink of the present invention is not limited to manufacturing the micro-channel heat sink with five-layer turn-back structure described below.
  • the manufacturing method of the five-layer turn-back structure microchannel heat sink of the following embodiment 1 includes the following steps 1 to 5.
  • Step 1 As shown in FIG. 2 , on the first layer of plates 101 to the fifth layer of plates 105 constituting the microchannel heat sink, the preset inlet and outlet liquid channels 107 and the first microchannel structure 108 are processed;
  • Step 2 As shown in Figure 3, take the upper cover plate 200 and the lower cover plate 300, and press the uppermost plate and the bottom plate of the microchannel heat sink to be made respectively on the upper cover plate 200 and the lower cover plate 300
  • the first microchannel structure 108 processes the corresponding pattern
  • Step 3 As shown in FIG. 4 , align and stack the upper cover plate 200 , the first layer of plates 101 to the fifth layer of plates 105 and the lower cover plate 300 in sequence;
  • the upper cover 200 and the lower cover 300 are surface-treated by pickling and water washing, the upper cover 200, the first Layers of plates 101 to fifth layer of plates 105 and lower cover plates 300 are stacked in sequence, and a layer of graphite paper, and then position and align the upper cover plate 200, the stacked plates 100, and the lower cover plate 300 according to the second positioning hole 201, the first positioning hole 101 and the third positioning hole 301 in sequence.
  • Step 4 Place the aligned and stacked upper cover plate 200, the first layer of plates 101 to the fifth layer of plates 105, and the lower cover plate 300 in a reducing atmosphere for heating and heat preservation, and apply pressure;
  • the stacked layers of plates 100 and the lower cover plate 300 into the heating furnace, and place them on the side of the upper cover plate 200 and the lower cover plate 300 away from the stacked layers of plates 100
  • vacuumize the heating furnace and supply hydrogen to provide a reducing atmosphere apply a pressure of 10 MPa to the upper briquetting block and the lower briquetting block, press the upper cover plate 200 and the lower cover plate 300 to stack
  • Each layer of plates 100 is pressed, and the heating furnace is rapidly heated to 850°C at a rate of 200°C/min during the pressure, and then kept for 2400s.
  • Step 5 After the pressure reaches the preset time, stop the heat preservation and pressure application, and remove the upper cover 200 and the lower cover 300 .
  • the manufacturing method of the above-mentioned micro-channel heat sink adopts thermal bonding process to process the micro-channel heat sink, by placing the upper cover plate and the lower cover plate on each layer of the micro-channel heat sink, and directly applying pressure without adding other bonding It can avoid problems such as channel internal blockage and electrochemical corrosion caused by brazing process, and improve the reliability of micro-channel heat sink products.
  • the upper cover and the lower cover are processed according to the micro-channel structure to form a hollow structure, then aligned and stacked with the micro-channel heat sink, and then pressure-welded, which not only achieves accurate and effective micro-channel walls Pressure can also greatly relieve the pressure on the microchannel heat sink structure during the pressure welding process, and reduce the deformation of the microchannel heat sink coolant channel. Compared with the conventional diffusion welding process, it can be used under the same conditions.
  • the micro-channel heat sink exerts greater pressure to improve the interlayer bonding force of the micro-channel heat sink and improve product stability.

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Abstract

本发明采用热键合工艺对微通道热沉进行加工，通过在微通道热沉的各层盖板上放置上下盖板，直接施压，无需添加其他粘结剂，可避免采用钎焊工艺造成通道内部阻塞、电化学腐蚀等问题，提高微通道热沉产品的可靠性。且在焊接前，先将上盖板和下盖板按照微通道结构进行加工，形成镂空结构，然后与微通道热沉对齐堆叠，再施压焊接，不仅实现了对微通道壁的精准、有效施压，还可大大缓解在施压焊接的过程中对微通道热沉结构的压力，减轻微通道热沉冷却液通道部的形变，相比于常规的扩散焊工艺，在同等条件下可对微通道热沉施加更大的压力，提高微通道热沉层间结合力，提高产品稳固性。

Description

微通道热沉及其制造方法 技术领域
本发明涉及芯片散热领域，特别涉及一种微通道热沉及其制造方法。
背景技术
随着电子元器件向着高集成、高密度、高功率的方向发展，射频芯片、激光芯片等大功率芯片上的热流密度也越来越高，通常需要通过具有强散热效果的热沉进行散热，才能保障芯片功能平稳高效的运作。
目前市面上常见的普通平板热沉和宏通道热沉已无法满足大功率芯片的散热需求，近年来兴起的微通道热沉由于其具有高效的散热效果成为研究热点。
微通道热沉通常是指内部流道宽度小于500μm的液冷热沉，流体在微通道热沉内流动时呈强烈的湍流态，同时热边界层薄，热阻低，具有传热速度快、散热效率高等优势，更能满足当前高热流密度的大功率芯片的散热需求。微通道热沉通常由硅、陶瓷、金属等材料制造而成，其中，金属由于热导率高，是制造微通道热沉的理想材料。
传统的微通道热沉加工技术通常是先将每层板材加工成所需要的图案结构，再通过钎焊、扩散焊等工艺，将多层板材焊接在一起，制成内部含各种复杂微通道结构的热沉。
然而，若采用钎焊工艺，钎料在焊接过程中熔化极易流入到通道内部造成堵塞，并且会导致部分区域连接不稳固；其次，由于热沉工作需要长时间通冷却液，内部钎料和板材之间容易发生电化学腐蚀，会降低微通道热沉产品的可靠性。若采用扩散焊工艺，为达到良好的结合效果需施加要很高的压力，由于 铜或铝等金属材质较软，在高压力下通道部位会发生变形，但若施加的压力较小，层间结合力会变差，微通道热沉在通液工作时容易发生泄漏。
发明内容
基于此，有必要提供一种层间连接可靠性高、不易变形、不易漏液的微通道热沉制造方法。
本发明提供了一种微通道热沉的制造方法，包括如下步骤：
在构成微通道热沉的各层板材上加工出预设的进出液流道和微通道结构；
取上盖板和下盖板，并在所述上盖板和所述下盖板上分别按待制作的微通道热沉的最上层板材和最底层板材的微通道结构加工出对应的图案；
将所述上盖板、所述各层板材以及所述下盖板依次对齐堆叠；
将对齐堆叠的所述上盖板、所述各层板材以及所述下盖板置于还原性气氛中加热保温，并在所述上盖板和/或所述下盖板上施压；
施压达到预设时间后，停止保温和施压，除去所述上盖板和所述下盖板。
在其中一个实施例中，还包括在所述上盖板、所述各层板材以及所述下盖板的对应位置分别加工出定位孔的步骤，在对齐堆叠时，将所述上盖板、所述各层板材以及所述下盖板通过所述定位孔对齐。
在其中一个实施例中，所述定位孔分布在各所述板材靠近边角的部位且位于各板材上预设的进出液流道和微通道结构之外的区域。
在其中一个实施例中，所述各层板材上的所述进出液流道和微通道结构是通过化学蚀刻、激光切割、等离子切割、火焰切割、砂轮切割、水刀切割、线切割、数控机床加工以及冲压中任意一种方法加工得到。
在其中一个实施例中，所述上盖板和所述下盖板的材料为金属或合金。
在其中一个实施例中，所述上盖板和所述下盖板的材料厚度不小于受压时对应盖板的凹陷深度。
在其中一个实施例中，还包括在所述上盖板与靠近所述上盖板的板材之间和/或在所述下盖板与靠近所述下盖板的板材之间设有易分离隔离层的步骤。
在其中一个实施例中，所述易分离隔离层为石墨纸或石墨液。
在其中一个实施例中，在施压时，是通过在所述上盖板和所述下盖板的背离层叠的各层板材一侧分别放置上压块和下压块，通过所述上压块和所述下压块分别按压盖板对层叠的各层板材进行施压，或，直接按压所述上盖板和所述下盖板对所述层叠的各层板材进行施压。
在其中一个实施例中，所述施压的压力为1～20MPa。
在其中一个实施例中，所述加热的方法为按30℃/min～8000℃/min的速率升温至300℃～950℃，所述保温的保温时间为120s～3600s。
本发明还提供了一种微通道热沉，是由上述任一实施例所述的微通道热沉的制造方法制造得到。
上述微通道热沉的制造方法采用热键合工艺对微通道热沉进行加工，通过在微通道热沉的各层盖板上放置上下盖板，直接施压，无需添加其他粘结剂，可避免采用钎焊工艺造成通道内部阻塞、电化学腐蚀等问题，提高微通道热沉产品的可靠性。且在焊接前，先将上盖板和下盖板按照微通道结构进行加工，形成镂空结构，然后与微通道热沉对齐堆叠，再施压焊接，不仅实现了对微通道壁的精准、有效施压，还可大大缓解在施压焊接的过程中对微通道热沉结构的压力，减轻微通道热沉冷却液通道部的形变，相比于常规的扩散焊工艺，在同等条件下可对微通道热沉施加更大的压力，提高微通道热沉层间结合力，提高产品稳固性。
附图说明
图1为本发明一实施方式的微通道热沉的制造方法的流程示意图；
图2为实施例1中待制作的五层折返式微通道热沉层叠的各层板材的结构示意图；
图3为实施例1中上盖板、下盖板的结构示意图；
图4为实施例1中待制作的五层折返式微通道热沉的压合装配顺序示意图；
图5为实施例1中五层折返式微通道热沉成品示意图。
附图标记说明如下：
100：层叠的各层板材；101～105：第一层板材～第五层板材；106：第一定位孔；107：进出液流道；108：第一微通道结构；200：上盖板；201：第二定位孔；202：第二微通道结构；300：下盖板；301：第三定位孔；302：第三微通道结构；400：微通道热沉成品。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。
需要说明的是，当元件被称为“设于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1所示，本发明一实施方式提供了一种微通道热沉的制造方法，其包括如下步骤S110～S150。
步骤S110：在构成微通道热沉的各层板材上加工出预设的进出液流道和微通道结构。
微通道结构的设计对微通道热沉的换热能力有很大的影响，微通道结构的设计以热阻为主要衡量参数，热阻越小，微通道热沉的散热性能越好，而影响微通道热沉热阻的最大因素是冷却剂的性质，当芯片开始工作时，流体温度升高而产生热阻，流体流率越大，则流体热容越大，热阻值越小。此外，微通道与流体的界面上热对流产生的对流热阻也是微通道热阻的主要部分，因此，根据换热器热阻的需求可以加工出不同图案的微通道结构。具体地，还可以采用多层板材堆叠，进一步的加强散热效果，每层板材的微通道结图案可以根据需求设计，可以是相同的，也可以是不同的，例如，可以是但不限于设计成五层折返式结构。
步骤S120：取上盖板和下盖板，并在上盖板和下盖板上分别按待制作的微通道热沉的最上层板材和最底层板材的微通道结构加工出对应的图案。
将上盖板和下盖板按照待制作热沉的最上层和最底层板材的微通道结构加工出对应图案，在施压时，由于上盖板和下盖板的结构图案相贴合的板材一致，在通道结构处上盖板和下盖板不会对待制作的微通道热沉板材产生压力，可以减小压力对板材微通道结构的破坏，微通道热沉的各层板材可以承受更大的压 力，使之压合效果更加紧密。
步骤S130：将上盖板、各层板材以及下盖板依次对齐堆叠。
各层板材需要按照微通道热沉结构的设计对齐堆叠，各层板材的微通道结构需要与预设结构相对应才能实现预设的散热效果，若堆叠不整齐将不利于热沉工作时充分散热。进一步，上盖板和各层板材以及各层板材和下盖板之间需要依次对齐堆叠，确保在压合时上盖板和下盖板的镂空结构与最上层板材和最底层板材的微通道结构对应，可以有效分散盖板对各层板材的压力，避免施压时压力过大对各层板材造成破坏。
步骤S140：将对齐堆叠的上盖板、各层板材以及下盖板置于还原性气氛中加热保温，并在上盖板和/或下盖板上施压。
可以采用但不限于通入氢气作为还原性气氛确保在压合过程中各层板材不会被氧化。在不同的温度和压力下，各层板材之间的原子扩散速度不同，温度越高、压力越大，各层板材之间原子扩散的速度越快，板材压合更紧密，通过保温一段时间可以保证各层板材充分压合。
步骤S150：施压达到预设时间后，停止保温和施压，除去上盖板和下盖板。
微通道热沉设定好的施压时间达到后，完成压合，可以但不限于在冷却后，取出压合后的上盖板、各层板材和下盖板。上盖板和下盖板作为辅助各层板材安全压合的隔离板，在压合结束后移除，压合后的各层板材通过加工后即为微通道热沉成品。
本发明提供的微通道热沉的制造方法，采用的是热键合的加工工艺，即将表面处理后待制作的微通道热沉紧密地贴合在一起，无需其他粘结剂，直接放到高温炉中加热施压焊接，压合后，微通道热沉的每层板材都牢固地键合在一起。
在一个具体的示例中，上述微通道热沉的制造方法还包括在上盖板、各层板材以及下盖板的对应位置分别加工出定位孔的步骤，在对齐堆叠时，将上盖板、各层板材以及下盖板通过定位孔对齐。采用定位孔的方式确保上盖板、各层板材、下盖板都整齐的堆叠，位置对应，便于实现精准焊接。
可选地，定位孔分布在各板材靠近边角的部位且位于各板材上预设的进出液流道和微通道结构之外的区域。这些定位孔因为不属于进出液流道和微通道热沉结构的一部分，将定位孔设于各板材靠近边角的部位，焊接完成后，可以通过裁减的方式将定位孔等多余的部位裁减掉。定位孔的位置可以根据待制作的微通道热沉的结构进行设计，不限于在各层板材靠近边角的部位。可理解，在其他具体示例中，也可以将微通道结构上的特定孔位作为定位孔起到定位作用，如此，可以不必另外加工出定位孔，也无需对定位孔作额外进行裁减。
定位孔的孔数量、孔尺寸和孔形状可以根据具体的产品制造需要进行设计，例如定位孔的孔数量可以是但不限于2～4个，孔内径可以是但不限于为2～4mm，孔形状可以是但不限于圆孔，只要不影响微通道热沉本身的结构，对定位孔的数量、尺寸、位置并无限制。
在一个具体的示例中，各层板材上的进出液流道和微通道结构可以通过但不限于化学蚀刻、激光切割、等离子切割、火焰切割、砂轮切割、水刀切割、线切割、数控机床加工以及冲压中任意一种方法加工得到。各层板材为具有良好导热性能的金属或合金，微通道结构设计好后，通过采用上述任意一种加工方法，可以快速地将进出液流道和微通道结构加工出来。可选地，可采用化学蚀刻的方式进行加工，化学蚀刻适用于加工绝大部分的金属及合金，加工精度高，加工过程中无应力产生，不会产生毛刺，加工成本较低廉，工艺灵活，对微通道热沉的结构性能无影响。
可选地，在一个具体的示例中，各层板材在加工前后需要进行表面清洁处理。金属板材长期暴露在空气中放置，表面会存在异物、脏污以及氧化物，例如采用酸洗的方式可以除去金属板材表面的油脂以及氧化膜，再通过清水清洗可以将板材彻底清洗干净，清洁方式不限于此。
在一个具体的示例中，上盖板和下盖板的材料为金属或合金。为了保证微通道热沉的各层板材能够通过热键合的方式实现紧密牢固的压合，在压合时需要采用高温高压的方式，因此上盖板和下盖板的材料是耐高温且具有较高强度的，保证在高温高压的热键合过程中上盖板和下盖板不会产生形变和开裂，确保不会对微通道热沉的各层板材产生破坏性影响，例如，上盖板和下盖板的材料可以但不限于是铁、钴、铬、镍、钨、钼、铝、钛等金属及其合金中的任意一种，更进一步的，例如可以但不限于是GH4169镍基合金、Ti-18(Ti-6Al-4Mo-4Zr-2Sn-1W-0.2Si)钛基合金、Inconel718中的任意一种，还可以但不限于是Al 2O 3、AlN陶瓷、石墨板以及SiC中的任意一种。
在一个具体的示例中，上盖板和下盖板的材料厚度不小于受压时对应盖板的凹陷深度。上盖板和下盖板的板材厚度也是保证热键合过程安全性的重要因素之一，厚度不小于受压时对应盖板的凹陷深度可以进一步确保压合过程中盖板不会变形也不会对影响板材的结构，具体地，厚度不小于0.08mm。
在一个具体的示例中，还包括在上盖板与靠近上盖板的板材之间和/或在下盖板与靠近下盖板的板材之间设有易分离隔离层的步骤。压合结束后，各层板材要与上盖板和下盖板分离，为确保上盖板和下盖板不会在压合过程中与各层板材连接过于紧密难以移除，设置易分离隔离层有助于上盖板和下盖板与各层板材的分离。
在一个具体的示例中，易分离隔离层可以是但不限于为石墨纸或石墨液。
在一个具体的示例中，在施压时，是通过在上盖板和下盖板的背离层叠的各层板材一侧分别放置上压块和下压块，通过上压块和下压块分别按压盖板对层叠的各层板材进行施压，或，直接按压上盖板和下盖板对层叠的各层板材进行施压。直接施压时，上盖板和下盖板的材质与上压块和下压块的材质相同，此时上盖板和下盖板同时兼具了盖板和压块二者的作用。
在一个具体示例中，施压的压力为1～20MPa。施压的压力大小与各层板材的材质、微通道结构设计相关，例如可以为3MPa、5MPa、10MPa、15MPa，可以在施压的全过程都采用相同的压力进行施压，也可以在不同的时间段根据热键合的压合程度对压力在1～20MPa范围内进行调整。
在一个具体的示例中，加热的方法为按30℃/min～8000℃/min的速率快速升温至300℃～950℃，保温的保温时间为120s～3600s。快速加热至压合温度施压焊接，再保温一段时间可以确保压合充分，优选地，按2000℃/min～6000℃/min的速率快速升温至500℃～900℃，保温的保温时间为600s～1800s。
施压完成后，将压合好的上盖板、各层板材以及下盖板取出，可选地，等到上盖板、各层板材以及下盖板冷却至室温后再将其从加热炉中取出，除去上盖板和下盖板，并将压合后的层叠的各层板材裁减成微通道热沉成品。
进一步地，本发明还提供了一种微通道热沉，是由上述任一具体示例的微通道热沉的制造方法制造得到。
实施例1
以下以一五层折返式结构微通道热沉的制造为例，对本发明的微通道热沉及其制造方法做进一步详细的说明。可理解地，本发明的微通道热沉的制造方法不限于制造下述的五层折返式结构微通道热沉。
以下实施例1的五层折返式结构微通道热沉的制造方法包括如下步骤一～步 骤五。
步骤一：如图2所示，在构成微通道热沉的第一层板材101～第五层板材105上加工出预设的进出液流道107和第一微通道结构108；
首先设计出每层板材的微通道图案，然后通过化学蚀刻的方法将进出液流道107和第一微通道结构108按图案设计加工出来，并五层板材靠近边角的部位且位于各板材上预设的进出液流道107和第一微通道结构108之外的区域加工出4个内径为3mm的圆孔作为第一定位孔106。
步骤二：如图3所示，取上盖板200和下盖板300，并在上盖板200和下盖板300上分别按待制作的微通道热沉的最上层板材和最底层板材的第一微通道结构108加工出对应的图案；
取厚度为0.1mm的钼材作为上盖板200和下盖板300的材料，根据待制作的微通道热沉的最上层和最底层的第一微通道结构108，分别在上盖板200和下盖板300上加工出对应的第二微通道结构202和第三微通道结构302，在靠近边角的部位且与第一层板材101～第五层板材105相对应的位置加工出4个内径为3mm的圆孔作为第二定位孔201和第三定位孔301。
步骤三：如图4所示，将上盖板200、第一层板材101～第五层板材105以及下盖板300依次对齐堆叠；
将步骤一和步骤二加工好的第一层板材101～第五层板材105、上盖板200和下盖板300通过酸洗和水洗的方式进行表面处理后，按照上盖板200、第一层板材101～第五层板材105、下盖板300的顺序依次堆叠，在上盖板200与层叠的各层板材100之间和在下盖板300与层叠的各层板材100之间分别添加一层石墨纸，然后将上盖板200、层叠的各层板材100、下盖板300按照第二定位孔201、第一定位孔101以及第三定位孔301依次定位对齐。
步骤四：将对齐堆叠的上盖板200、第一层板材101～第五层板材105以及下盖板300置于还原性气氛中加热保温，并在上盖板200和下盖板300上施压；
将对齐堆叠好的上盖板200、层叠的各层板材100以及下盖板300放入加热炉中，并在上盖板200和下盖板300的背离层叠的各层板材100一侧分别放置上压块和下压块，对加热炉抽真空，并通入氢气提供还原性气氛，对上压块和下压块施加10MPa的压力通过压块按压上盖板200和下盖板300对层叠的各层板材100进行施压，施压时将加热炉按200℃/min的速率快速升温至850℃，然后保温2400s。
步骤五：施压达到预设时间后，停止保温和施压，除去上盖板200和下盖板300。
如图5所示，达到预设时间后，停止保温和施压，待加热炉自然冷却至室温，打开加热炉，取出压合后的上盖板200、层叠的各层板材100以及下盖板300，移去上盖板200和下盖板300，再对压合后的层叠的各层板材100进行裁剪加工成微通道热沉成品400。
上述微通道热沉的制造方法采用热键合工艺对微通道热沉进行加工，通过在微通道热沉的各层板材上放置上盖板和下盖板，直接施压，无需添加其他粘结剂，可避免采用钎焊工艺造成通道内部阻塞、电化学腐蚀等问题，提高微通道热沉产品的可靠性。且在焊接前，先将上盖板和下盖板按照微通道结构进行加工，形成镂空结构，然后与微通道热沉对齐堆叠，再施压焊接，不仅实现了对微通道壁的精准、有效施压，还可大大缓解在施压焊接的过程中对微通道热沉结构的压力，减轻微通道热沉冷却液通道部的形变，相比于常规的扩散焊工艺，在同等条件下可对微通道热沉施加更大的压力，提高微通道热沉层间结合力，提高产品稳固性。
以上实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准，说明书及附图可以用于解释权利要求的内容。

Claims (12)

  1. 一种微通道热沉的制造方法，其特征在于，包括如下步骤：
    在构成微通道热沉的各层板材上加工出预设的进出液流道和微通道结构；
    取上盖板和下盖板，并在所述上盖板和所述下盖板上分别按待制作的微通道热沉的最上层板材和最底层板材的微通道结构加工出对应的图案；
    将所述上盖板、所述各层板材以及所述下盖板依次对齐堆叠；
    将对齐堆叠的所述上盖板、所述各层板材以及所述下盖板置于还原性气氛中加热保温，并在所述上盖板和/或所述下盖板上施压；
    施压达到预设时间后，停止保温和施压，除去所述上盖板和所述下盖板。
  2. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，还包括在所述上盖板、所述各层板材以及所述下盖板的对应位置分别加工出定位孔的步骤，在对齐堆叠时，将所述上盖板、所述各层板材以及所述下盖板通过所述定位孔对齐。
  3. 根据权利要求2所述的微通道热沉的制造方法，其特征在于，所述定位孔分布在各所述板材靠近边角的部位且位于各板材上预设的进出液流道和微通道结构之外的区域。
  4. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，所述各层板材上的所述进出液流道和微通道结构是通过化学蚀刻、激光切割、等离子切割、火焰切割、砂轮切割、水刀切割、线切割、数控机床加工以及冲压中任意一种方法加工得到。
  5. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，所述上盖板和所述下盖板的材料为金属或合金。
  6. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，所述上盖板和所述下盖板的厚度不小于受压时对应盖板的凹陷深度。
  7. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，还包括在所述上盖板与靠近所述上盖板的板材之间和/或在所述下盖板与靠近所述下盖板的板材之间设置易分离隔离层的步骤。
  8. 根据权利要求7所述的微通道热沉的制造方法，其特征在于，所述易分离隔离层为石墨纸或石墨液。
  9. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，在施压时，是通过在所述上盖板和所述下盖板的背离层叠的各层板材的一侧分别放置上压块和下压块，通过所述上压块和所述下压块分别按压盖板对层叠的各层板材进行施压，或，直接按压所述上盖板和所述下盖板对层叠的各层板材进行施压。
  10. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，所述施压的压力为1～20MPa。
  11. 根据权利要求1所述的微通道热沉的制造方法，其特征在于，所述加热的方法为按30℃/min～8000℃/min的速率升温至300℃～950℃，所述保温的保温时间为120s～3600s。
  12. 一种微通道热沉，其特征在于，是由权利要求1～11任一项权利要求所述的微通道热沉的制造方法制造得到。
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