WO2023005392A1 - 电池保护板及其制造方法、电池及电子设备 - Google Patents

电池保护板及其制造方法、电池及电子设备 Download PDF

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Publication number
WO2023005392A1
WO2023005392A1 PCT/CN2022/095273 CN2022095273W WO2023005392A1 WO 2023005392 A1 WO2023005392 A1 WO 2023005392A1 CN 2022095273 W CN2022095273 W CN 2022095273W WO 2023005392 A1 WO2023005392 A1 WO 2023005392A1
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WIPO (PCT)
Prior art keywords
circuit board
substrate
electronic components
board
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/095273
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English (en)
French (fr)
Inventor
曹轶芳
赵亚彬
张燕婷
梁玉梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Nvt Technology Co Ltd
Original Assignee
Dongguan Nvt Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Nvt Technology Co Ltd filed Critical Dongguan Nvt Technology Co Ltd
Priority to EP22848002.6A priority Critical patent/EP4207457A4/en
Publication of WO2023005392A1 publication Critical patent/WO2023005392A1/zh
Priority to US18/193,140 priority patent/US20230238590A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/298—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the wiring of battery packs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/533—Electrode connections inside a battery casing characterised by the shape of the leads or tabs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/547—Terminals characterised by the disposition of the terminals on the cells
    • H01M50/55—Terminals characterised by the disposition of the terminals on the cells on the same side of the cell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/552—Terminals characterised by their shape
    • H01M50/553—Terminals adapted for prismatic, pouch or rectangular cells
    • H01M50/557—Plate-shaped terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/572—Means for preventing undesired use or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the embodiments of the present application relate to the field of battery technology, and in particular, to a battery protection plate, a manufacturing method thereof, a battery, and an electronic device.
  • the battery protection board 1 is an integrated circuit board used to prevent problems such as overcharge, overdischarge, and short circuit in the battery. It includes a hard board 2 and a soft board 3, and the opposite sides of the hard board 2 are respectively Electronic components and connecting pieces 4 are attached. In the production process of the battery protection board 1, it is necessary to weld the soft board 3 to the side of the hard board 2 on which the connecting piece 4 is mounted. However, since the connecting piece 4 occupies a certain welding position on the hard board 2, the There is not enough space to be welded to the hard board 2.
  • the connecting piece 4 on the hard board 1 often needs to be set correspondingly according to the position of the tab of the battery cell.
  • the connecting piece 4 on the hard board 2 is changed.
  • the hard board 1 also needs to be redesigned. Therefore, the versatility of the battery protection board 1 is poor.
  • a commonly used technical means is to combine the hard board 2 and the soft board 3 by lamination, so that the end of the soft board 3 is embedded in the hard board 2, so that A soft-rigid combination board is formed, and then the electronic device 5 and the connecting sheet 4 are attached to the opposite sides of the hard board 2, so as to avoid the problem of poor reliability in the welding method.
  • the connecting piece 4 is set on the hard board 1, it still has the problem of poor versatility;
  • the soft board 3 needs to be redesigned to adapt to the buckle. Since the hard board 2 and the soft board 3 are laminated to make a rigid-flex board, it is often necessary to redesign the hard board 2 to adapt to the connection between the lamination and the soft board 3. Therefore, Its versatility is worse, and the production cost is higher.
  • the main technical problem to be solved by the embodiments of the present application is to provide a battery protection board and its manufacturing method, battery and electronic equipment, so as to solve the problems of insufficient soldering space and poor versatility of the circuit board.
  • a battery protection board in a first aspect, includes a first circuit board, a second circuit board, and a tab connection part.
  • the first circuit board includes a first substrate, electronic components and an insulating layer, the first substrate includes a first surface and a second surface oppositely arranged, a number of electronic components are arranged on the first surface, and the insulating layer covers the first surface on the first surface.
  • the second circuit board includes a second substrate, and the second substrate includes a third surface and a fourth surface opposite to each other. The third surface is connected to the second surface, and the tab connection part is arranged on the fourth surface.
  • the tab connection part occupies the second surface of the first substrate for welding with the second substrate, so that the first substrate of the first substrate.
  • the fastening position of the device is sufficient, which ensures the versatility of the first circuit board, thereby improving the versatility of the battery protection board to a certain extent.
  • the electronic components are electronic components with independent packaging, so as to isolate the internal devices of each electronic component from the outside world, prevent external impurities from corroding its internal circuit and cause electrical performance degradation, and protect its surface And connecting leads, etc., to avoid damage from external forces and the influence of the external environment.
  • the electronic components are electronic components without independent packaging, which reduces the thickness of the electronic components, thereby reducing the thickness of the first circuit board and reducing the space occupied by the battery protection board.
  • the independent After packaging the material cost of electronic components can be reduced.
  • first circuit boards there are multiple first circuit boards, and the multiple first circuit boards are respectively connected to the second circuit board.
  • multiple first circuit boards are allowed to be combined in a variety of ways, and can be customized or flexibly produced according to the needs of customers or products, which improves the versatility of the battery protection board and shortens the length of the first circuit board.
  • the development cycle reduce production costs, improve integration.
  • the second surface and the third surface are provided with multiple sets of pads correspondingly, and the first substrate and the second substrate are soldered and connected by multiple sets of pads.
  • pad welding on the one hand, it can stably The first substrate is fixedly connected to the second substrate.
  • the electrical connection between the first substrate and the second substrate can be realized by pad welding.
  • each group of pads is arranged along the length direction of the second surface, and multiple groups of pads are arranged along the width direction of the second surface, so that the multiple groups of pads cover the second surface according to the shape and size of the second surface, The temperature of the welding area of the first substrate is effectively uniformed, thereby reducing the temperature rise of the first substrate.
  • the second circuit board further includes connectors, at least two connectors are provided, and the at least two connectors are respectively provided at two ends of the second substrate.
  • the second circuit board has a shunt function, allowing current to flow from the first substrate to the connectors on both ends of the second substrate, or from the connectors on both ends of the second substrate to the The first substrate prevents the second circuit board from overheating due to overcurrent, and realizes the heat dissipation effect on the second circuit board, thereby allowing the second circuit board to be connected to high-power equipment to be powered; on the other hand, it is convenient for the second circuit board The assembly connection of the board and the equipment to be powered.
  • the first substrate is a rigid printed board
  • the second substrate is a flexible printed board.
  • the battery includes a battery cell and a protection plate connected to the battery cell, and the protection plate is the above-mentioned battery protection plate.
  • the battery cell includes a first tab and a second tab with the same polarity, and a third tab with an opposite polarity to the first tab.
  • Three tab connection parts are arranged on the protective plate, and the three tab connection parts are respectively connected with the first tab, the second tab and the third tab. Among them, when the number of tabs is more than three, the problem of insufficient soldering space on the circuit board is more prominent.
  • the tab connection part is arranged on the second circuit board, avoiding the problem of the tab connection part Occupying the welding position of the first circuit board increases the weldable area of the first circuit board and the second circuit board, so that the first circuit board reserves enough welding space for the second circuit board to be welded on the first
  • the circuit board improves the reliability of the connection between the first circuit board and the second circuit board, and optimizes the space layout of the protection board.
  • an electronic device is further provided, and the electronic device includes the above-mentioned battery.
  • a method for manufacturing a battery protection plate including the following steps: mounting electronic components on the first surface of the first substrate, and forming a cover on the first surface of the first substrate by injection molding
  • the insulating layer of the electronic components is made into a first circuit board; the first circuit board is pasted on the third surface of the second circuit board; and the tab connection part is pasted on the fourth surface of the second circuit board.
  • the tab connection part occupies the welding position of the first circuit board, so that the first circuit board reserves enough welding space , for the second circuit board to be welded to the first circuit board, which improves the reliability of the connection between the first circuit board and the second circuit board, and optimizes the space layout of the battery protection board;
  • the first circuit board Separate the incoming material from the second circuit board, and after the first circuit board is made separately, the first circuit board is attached to the second circuit board, which allows the first circuit board to adapt to the second circuit board of different sizes, That is to say, the first circuit board can be configured on the second circuit board of different sizes as required, so that the battery protection board can be matched with different battery products or equipment to be powered, and can avoid pressure when the electronic components are packaged by injection molding. damage the second circuit board.
  • electronic components are mounted on the first surface of the first substrate, and an insulating layer covering the electronic components is formed on the first surface of the first substrate by injection molding to form a first circuit board, further Including: providing a panel, wherein the panel includes a plurality of first substrates connected to each other; mounting a group of electronic components on the first surface of each first substrate; injection molding on the first surface of the first substrate to form an insulating layer; divide the jigsaw board to make a plurality of independent first circuit boards.
  • the efficiency of manufacturing the first circuit board is greatly improved, and the consistency of the size of the first circuit board is ensured .
  • Fig. 1 is a structural perspective view of a prior art battery protection board
  • Fig. 2 is a structural perspective view of another battery protection board in the prior art
  • Fig. 3 is a structural perspective view of a battery protection board shown in one embodiment of the present application.
  • Fig. 4 is another structural perspective view of the battery protection board in Fig. 1;
  • Fig. 5 is an exploded view of the structure of the battery protection board in Fig. 1;
  • Fig. 6 is a schematic structural view of a battery protection plate shown in one embodiment of the present application, wherein a partial enlarged view of part A is shown;
  • Fig. 7 is a schematic structural view of a battery protection plate shown in another embodiment of the present application, wherein a partial enlarged view of part B is shown;
  • Fig. 8 is a schematic structural view of a battery protection board shown in another embodiment of the present application.
  • Fig. 9 is another perspective structural view of the first substrate of the battery protection plate in Fig. 5;
  • Fig. 10 is a schematic structural diagram of a battery provided by still another embodiment of the present application.
  • Fig. 3 is a structural perspective view of the battery protection board 100 shown in one embodiment of the present application
  • Fig. 4 is a structural perspective view of another angle of the battery protection board 100 in Fig. 3
  • Fig. 5 is a structural perspective view of the battery protection board 100 in Fig. 3
  • the embodiment of the present application provides a battery protection board 100 for protection against overcharge, overdischarge, overcurrent, short circuit, etc. in the battery.
  • the battery protection board 100 includes a first circuit board 10, and The second circuit board 20 connected to the first circuit board 10 and the tab connection part 30, the first circuit board 10 is connected to the second circuit board 20 and the tab connection part 30, the first circuit board 10 is used as the battery protection board 100 with The circuit board with protection function, the second circuit board 20 is used for connecting with the external equipment to be powered, and the tab connection part 30 is used for connecting with the tab of the electric core.
  • the first circuit board 10 includes a first substrate 11 , electronic components 12 and an insulating layer 13 .
  • the first substrate 11 includes a first surface 101 and a second surface 102 opposite to each other, a plurality of electronic components 12 are disposed on the first surface 101 , and an insulating layer 13 covers the electronic components 12 on the first surface 101 .
  • the second circuit board 20 includes a second substrate 21, the second substrate 21 includes a third surface 201 and a fourth surface 202 arranged opposite to each other, the third surface 201 of the second substrate 21 is connected to the second surface 102 of the first substrate 11 , the tab connection portion 30 is disposed on the fourth surface 202 .
  • the tab connection portion 30 is provided on the fourth surface 202 of the second substrate 21 , preventing the tab connection portion 30 from occupying the first substrate 11
  • the tab connection part 30 is set On the second circuit board 20, by changing the position of the tab connection portion 30 on the second circuit board 20, it is easier to adapt to different tab positions, and the first circuit board 10 can be used as an integrated module to adapt to different tab positions.
  • the structural size of the first circuit board 10 ensures the versatility of the first circuit board 10 , thereby improving the versatility of the battery protection board 100 to a certain extent.
  • the entire rigid-flex board needs to be redesigned compared with the structure shown in Figure 5.
  • only the structural size of the second circuit board 20 needs to be changed accordingly , to adapt to the fastening positions of different devices to be powered, which ensures the versatility of the first circuit board 10 , thereby improving the versatility of the battery protection board 100 to a certain extent, and its production cost is low.
  • the electronic device 5 on the hard board 1 of the soft-rigid board is injection-molded, there is a risk of the soft board 3 being crushed, and in the embodiment of the present application, the first The circuit board 10 is independent of the second circuit board 20 , therefore, the second circuit board 20 can be avoided from being crushed when the electronic components 12 are packaged by injection molding.
  • the electronic components 12 on the first surface 101 are covered by the insulating layer 13, which can evenly dissipate heat from all the electronic components 12 on the first surface 101, and the heat generated by the electronic components 12 during operation Distributed through the insulating layer 13, compared with air heat dissipation, the heat dissipation effect of the insulating layer 13 is better, and the insulating layer 13 can also play waterproof and dustproof functions for the electronic components 12, improving the mechanical reliability of the second circuit board 20 The safety performance of the battery protection board 100 is ensured.
  • the insulating layer 13 is directly injection-molded on the first substrate 11 through a low-pressure injection molding process, so that the gaps between the electronic components 12 are also filled with insulation, further improving the insulation layer 13 on the electronic components 12. protective effect.
  • insulating layer 13 adopts insulating material, such as epoxy resin, hot-melt adhesive etc.; ability. Materials can choose phase change materials, of course, you can also choose heat dissipation plastics.
  • the first substrate 11 is in the shape of a long plate
  • the second substrate 21 includes a first segment 211 and a second segment formed by bending from both ends of the first segment 211 . 212.
  • the second surface 102 of the first substrate 11 is attached to the third surface 201 of the first section 211 along the length direction of the first section 211 to maximize the contact area between the first substrate 11 and the second substrate 21 .
  • all of the second surface 102 is connected to the third surface 201 , so as to ensure the reliability of the connection between the first circuit board 10 and the second circuit board 20 .
  • a plurality of electronic components 12 are disposed on the first surface 101 of the first substrate 11 facing away from the second substrate 21 , and are electrically connected to the first substrate 11 .
  • the insulating layer 13 covers the electronic components 12 on the first surface 101 and cooperates with the first surface 101 to encapsulate all the electronic components 12 .
  • the tab connection portion 30 is disposed on the fourth surface 202 of the second substrate 21 facing away from the first substrate 11 , and is electrically connected to the second substrate 21 .
  • the tab connection portion 30 is located in the first segment 211 .
  • the electronic components 12 include at least one of control integrated chips, MOS transistors, resistors, capacitors and inductors.
  • the integrated chip is used to receive the signal and feed back the signal to the MOS tube so that the MOS tube can respond accordingly.
  • the integrated chip detects a voltage overcharge signal, it will feed back the overcharge signal to the MOS tube, and the MOS tube will respond accordingly. Then close according to the overcharge signal, so as to stop charging.
  • the first substrate 11 is a rigid printed board, which has the characteristics of high density, high reliability, designability, manufacturability and testability, and the rigid printed board is relatively
  • the flexible printed board has good heat dissipation and high strength, and is suitable for disposing electronic components 12 in the battery protection board 100 .
  • the rigid printing plate includes at least one of phenolic paper laminated board, epoxy paper laminated board, polyester glass mat laminated board and epoxy glass cloth laminated board.
  • the second substrate 21 is a flexible printed board.
  • the flexible printed board has the characteristics of being bendable, winding, and folding.
  • the flexible circuit board By using a flexible circuit board, the overall volume of the battery protection board 100 can be greatly reduced, and the Products are developing in the direction of high density, miniaturization and high reliability.
  • the flexible printing plate includes polyimide or polyester film.
  • the shapes and structures of the first substrate 11 and the second substrate 21 can be set according to actual needs, and the present application does not limit the shapes and structures of the first substrate 11 and the second substrate 21 .
  • the second circuit board 20 also includes a connector 22, at least two connectors 22 are provided, and at least two connectors 22 are respectively provided at both ends of the second substrate 21, and the connector 22 is used for For connecting with external power supply equipment.
  • the second circuit board 20 has a shunt function, allowing the current to flow from the first substrate 11 to the connectors 22 on the two ends of the second substrate 21 respectively, or from the two ends of the second substrate 21
  • the connectors 22 respectively flow to the first substrate 11, preventing the second circuit board 20 from being overheated due to overcurrent, and realizing the heat dissipation effect on the second circuit board 20, thereby allowing the second circuit board 20 to be connected to high-power equipment to be powered ;
  • it can facilitate the assembly and connection of the second circuit board 20 and the equipment to be powered.
  • the battery protection board 100 further includes a reinforcing sheet 23, at least two reinforcing sheets 23 are provided, at least two reinforcing sheets 23 are respectively provided at both ends of the second substrate 21, and one reinforcing sheet
  • the reinforcing piece 23 corresponds to a connector 22, and the reinforcing piece 23 is used to strengthen the connection between the connector 22 and the second substrate 21, so that the connector 22 is firmly connected to the second substrate 21, preventing the connector 22 from the second substrate 21.
  • the second substrate 21 falls off.
  • the two connectors 22 are respectively disposed on the third surface 203 of the two second sections 212 and electrically connected to the second substrate 21 respectively.
  • the two reinforcing pieces 23 are respectively disposed on the fourth surfaces 204 of the two second sections 212 and respectively strengthen the connection between the two connectors 22 and the second substrate 21 .
  • FIG. 6 is a schematic structural diagram of a battery protection board 100 shown in one embodiment of the present application.
  • the electronic components 12 are electronic components 12 with independent packaging, that is, Each electronic component 12 is separately provided with an encapsulation layer to isolate the internal devices of each electronic component 12 from the outside world, prevent external impurities from corroding its internal circuit and cause electrical performance degradation, and protect its surface and connecting leads, etc. To avoid being damaged by external forces and the influence of the external environment, combined with the above-mentioned insulating layer 13 , each electronic component 12 can be better protected.
  • the electronic components 12 with independent packaging have a certain self-protection capability, which is convenient for storage, installation and transportation.
  • the encapsulation layer adopts insulating materials, such as epoxy resin, hot melt adhesive, and the like.
  • FIG. 7 is a schematic structural diagram of a battery protection board 100 shown in another embodiment of the present application.
  • the electronic components 12 are electronic components 12 without independent packaging, that is, , each electronic component 12 is not separately provided with an independent encapsulation layer.
  • the thickness of the electronic components 12 is reduced, thereby reducing the thickness of the first circuit board 10, and reducing the occupied space of the battery protection board 100.
  • the electronic components 12 can be reduced. cost of material.
  • the insulating layer 13 covers the electronic components 12 on the first surface 101 that are not individually packaged.
  • FIG. 8 is a schematic structural view of a battery protection board 100 shown in another embodiment of the present application.
  • the first circuit board 10 is provided with multiple, multiple first circuit boards 10 are connected to the second circuit board 20 respectively.
  • each first circuit board 10 includes a first substrate 11 and a number of electronic components 12 disposed on the first surface 101 of the first substrate 11, and different first substrates 11 can be configured with different electronic components as required. 12, to form a plurality of first circuit boards 10 with different functions, for example, the first substrate 11 of one first circuit board 10 is provided with integrated chips, and the first substrate 11 of the other first circuit board 10 is provided with MOS transistors .
  • multiple first circuit boards 10 are allowed to be combined in a variety of ways, and can be customized or flexibly produced according to the needs of customers or products, which improves the versatility of the battery protection board 100 and can shorten the first circuit board 100.
  • the development cycle of the circuit board 10 is shortened, the production cost is reduced, and the degree of integration is improved.
  • each first circuit board 10 also includes an insulating layer 13 covering the electronic components 12, so that each first circuit board 10 forms a SIP (System In a Package) module independently, and several SIP modules can be used as an integrated
  • SIP System In a Package
  • the device is installed on the second circuit board 20, and different devices to be powered can adapt to different buckling positions by making different second circuit boards 20, and then select SIP modules with different protection functions to achieve the multi-purpose effect of the module .
  • the electronic components 12 can be selected as electronic components 12 with independent packaging or electronic components 12 without independent packaging as required.
  • FIG. 9 is another perspective structural view of the first substrate 11 of the battery protection plate 100 in FIG.
  • the third surface 201 of the substrate 21 is correspondingly provided with multiple sets of pads 40 , and the first substrate 11 and the second substrate 21 are soldered and connected by multiple sets of pads 40 . Through the welding of the pad 40, on the one hand, the first substrate 11 and the second substrate 21 can be stably fixedly connected; electrical connection.
  • each group of pads 40 is arranged along the length direction of the second surface 102, multiple groups of pads 40 are arranged along the width direction of the second surface 102, and the pads 40 on the third surface 201 are connected to the solder pads on the second surface 102. There is a one-to-one correspondence between the discs 40 .
  • multiple sets of solder pads 40 are spread across the second surface 102 according to the shape and size of the second surface 102 , effectively uniforming the temperature of the welding area of the first substrate 11 , thereby reducing the temperature rise of the first substrate 11 .
  • each group of pads 40 is provided with a plurality of independent pads 40, on the second surface 102, a plurality of independent pads 40 are arranged at intervals along the length direction of the second surface 102, and multiple groups of pads 40 are arranged along the second surface 102.
  • the width direction of the surface 102 is arranged at intervals.
  • the shape and size of the pads 40 can be set according to actual needs, and different pads 40 can be set to have the same or different shapes and sizes according to needs.
  • the width direction of the second surface 102 is perpendicular to the paper where the structure shown in FIG. 6 is located, the length direction of the second surface 102 is perpendicular to its width direction, and the angle shown in FIG. It can be seen that the direction of the straight line segment is the length direction of the second surface 102 .
  • the second surface 102 there are at least two pads 40 of different shapes and sizes, and all the pads 40 are distributed on the second surface 102 in an asymmetrical manner, so as to prevent fooling and manual operation At this time, the second surface 102 is pasted against the third surface 201 .
  • some pads 40 are used to realize the electrical connection between the first circuit board 10 and the second circuit board 20, so that the electronic components 12 on the first substrate 11 and the electronic components in the first substrate 11
  • the circuit and the electronic circuit on the second substrate 21 together constitute a battery protection circuit.
  • FIG. 10 is a schematic structural diagram of a battery provided in another embodiment of the present application. Based on the same inventive concept, the present application also provides a battery 1000.
  • the battery 1000 includes a battery cell 200 and a battery cell 200
  • the connected protection board is the battery protection board 100 in any of the above-mentioned embodiments.
  • the battery protection plate 100 By using the battery protection plate 100 in the above embodiments, the space at the connection between the battery cell 200 and the battery protection plate 100 is optimized, and the versatility of the battery 1000 is improved to a certain extent.
  • the battery cell 200 includes a first tab 210 and a second tab 220 with the same polarity, and a third tab 230 with an opposite polarity to the first tab 210, and the protective plate is provided with three above-mentioned tab connection parts 30 , the three tab connection portions 30 are respectively connected to the first tab 210 , the second tab 220 and the third tab 230 .
  • the lug connecting portion 30 is provided on the second circuit board 20, which prevents the lug connecting portion 30 from occupying the welding position of the first circuit board 10, and increases the size of the first circuit. board 10 and the second circuit board 20 weldable area, so that the first circuit board 10 reserves enough welding space for the second circuit board 20 to be welded on the first circuit board 10, improving the first circuit board 10 The reliability of the connection with the second circuit board 20 optimizes the spatial layout of the protection board.
  • the battery cell 200 further includes an electrode assembly 240, one end of the first tab 210, the second tab 220, and the third tab 230 are respectively connected to the electrode assembly 240, the first tab 210, the second tab The other ends of the second tab 220 and the third tab 230 are respectively connected to the three tab connection portions 30 .
  • an embodiment of the present application further provides an electronic device, and the electronic device includes the battery 200 in any one of the foregoing embodiments.
  • the electronic device in this application is not particularly limited, and it may be used in any electronic device known in the prior art.
  • the electronic device may be, for example, a mobile phone, a notebook computer, a tablet computer, a wearable device, a game console, and the like.
  • the embodiment of the present application also provides a method for manufacturing the battery protection board 100, which is applied to the battery protection board 100 in any of the above-mentioned embodiments, and the manufacturing method will be described below.
  • the manufacturing method includes The following steps:
  • S1 mount electronic components 12 on the first surface 101 of the first substrate 11, and form an insulating layer 13 covering the electronic components 12 on the first surface 101 of the first substrate 11 by injection molding to make a first circuit plate 10.
  • the first substrate 11 includes a first surface 101 and a second surface 102 disposed opposite to each other.
  • a number of electronic components 12 are mounted on the first surface 101 of the first substrate 11 by a chip mounter; afterward, injection molding is performed on the first surface 101 of the first substrate 11 by an injection mold to cover the first surface 101.
  • the insulating layer 13 of the electronic components 12 on the first surface 101 cooperates with the insulating layer 13 to realize the packaging of the electronic components 12 on the first surface 101 .
  • the second circuit board 20 includes a second substrate 21, the second substrate 21 includes a third surface 201 and a fourth surface 202 disposed opposite to each other, the second substrate 21 also includes a first section 211 and a section from the first section 211 respectively. The two ends of the second section 212 are formed by bending.
  • the second surface 102 of the first substrate 11 of the first circuit board 10 is attached to the third surface 201 of the second substrate 21 of the second circuit board 20 .
  • the second surface 102 and the third surface 201 are fixedly connected by welding.
  • the tab connection portion 30 is attached to the fourth surface 202 of the second substrate 21 of the second circuit board 20 .
  • the tab connecting portion 30 can be fixed on the fourth surface 202 by welding.
  • S3 can be executed first, and then S1 and S2 can be executed in sequence, or S1 can be executed first, and then S3 can be executed in sequence. , S2.
  • the lug connecting portion 30 occupies the welding position of the first circuit board 10, so that the first circuit board 10 is reserved There is enough welding space for the second circuit board 20 to be welded to the first circuit board 10, which improves the reliability of the connection between the first circuit board 10 and the second circuit board 20, and optimizes the spatial layout of the battery protection board 100;
  • the first circuit board 10 can be configured on the second circuit board 20 of different sizes as required, so that the battery protection board 100 can be matched with different
  • the battery product or the equipment to be powered can avoid crushing the second circuit board 20 when the electronic components 12 are injected and packaged.
  • step S1 further includes:
  • the panel comprises a plurality of first substrates 11 connected to each other;
  • the first surfaces 101 of all the first substrates 11 are connected to each other to form the first side of the panel, and the second surfaces 102 of all the first substrates 11 are connected to each other to form the second side of the panel.
  • the first side and the second side Opposite setting.
  • the jigsaw puzzle can be a rigid printing board.
  • a group of electronic components 12 are respectively mounted on each first surface 101 of the first side of the panel by a placement machine.
  • an insulating layer 13 covering all electronic components 12 on the first side is formed by injection molding on the first side of the panel through an injection mold, and the insulating layer 13 cooperates with the first side to realize all electronic components on the first side Packaging of components 12.
  • cutting is performed according to the area where each first substrate 11 is located, so as to manufacture a plurality of independent first circuit boards 10 .
  • the efficiency of manufacturing the first circuit board 10 is greatly improved, and the size of the first circuit board 10 is guaranteed. consistency.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Battery Mounting, Suspending (AREA)
  • Protection Of Static Devices (AREA)

Abstract

本申请实施方式涉及电池技术领域，公开了一种电池保护板及其制造方法、电池及电子设备。电池保护板包括第一电路板、第二电路板以及极耳连接部。第一电路板包括第一基板、电子元器件和绝缘层，第一基板包括相背设置的第一表面和第二表面，若干电子元器件设于第一表面，绝缘层覆盖第一表面上的电子元器件。第二电路板包括第二基板，第二基板包括相背设置的第三表面和第四表面。第三表面与第二表面连接，极耳连接部设于第四表面。通过以上设置，使得第一基板预留有足够的焊接位置以供第二基板焊接，提高了第一电路板和第二电路板连接的可靠性，优化了电池保护板的空间布局，保证了第一电路板的通用性，从而一定程度上提高了电池保护板的通用性。

Description

电池保护板及其制造方法、电池及电子设备
相关申请的交叉引用
本申请要求享有于2021年07月30日提交的名称为“电池保护板及其制造方法、电池及电子设备”的中国专利申请号2021108737497的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请实施方式涉及电池技术领域，特别是涉及一种电池保护板及其制造方法、电池及电子设备。
背景技术
目前,锂离子电池已经成为消费类便携式电子产品的首选电源。如图1所示，电池保护板1作为电池中用于防止出现过充、过放、短路等问题的一个集成电路板，其包括硬板2和软板3，硬板2的相背两面分别贴装有电子元器件和的连接片4。在电池保护板1的生产过程中，需要将软板3焊接于硬板2贴装有连接片4的一面，但是由于连接4片在硬板2上占据一定的焊接位置大小，导致软板3无法拥有足够的空间焊接到硬板2上，此外，硬板1上的连接片4往往需要根据电芯的极耳的位置而对应设置，当电芯的极耳的位置发生改变时，需要对应改变硬板2上的连接片4的位置，同时，由于连接片4的位置发生改变，硬板1也需重新设计，因此，电池保护板1的通用性较差。
如图2所示，为解决焊接空间不足的问题，常用的一个技术手段是，硬板2和软板3之间通过层压的方式结合，使得软板3的端部嵌入硬板2，从而形成软硬结合板，再在硬板2的相背两面分别贴设电子器件5和连接片4，以避免采用焊接方式所存在的可靠性差的问题。一方面，由于连接片4设于硬板1上，其仍然存在通用性较差的问题；另一方面，当待供电设备的待扣合位置发生改变时，需要重新设计软板3以 适应扣合位置的改变，而由于硬板2和软板3是经层压后制成软硬结合板的，故也往往需要重新设计硬板2以适应层压处与软板3的连接，因此，其通用性更差，且生产成本较高。
申请内容
本申请实施方式主要解决的技术问题是提供一种电池保护板及其制造方法、电池及电子设备，以解决电路板焊接空间不足、通用性差的问题。
为解决上述技术问题，本申请实施方式采用的一个技术方案是：
第一方面，提供一种电池保护板，电池保护板包括第一电路板、第二电路板以及极耳连接部。第一电路板包括第一基板、电子元器件和绝缘层，第一基板包括相背设置的第一表面和第二表面，若干电子元器件设于第一表面，绝缘层覆盖第一表面上的电子元器件。第二电路板包括第二基板，第二基板包括相背设置的第三表面和第四表面。第三表面与第二表面连接，极耳连接部设于第四表面。其中，通过将极耳连接部设于第二基板的第四表面，避免了极耳连接部占据第一基板的第二表面上用于与第二基板的焊接位置，从而使得第一基板的第二表面预留有足够的焊接空间，以供第二基板的第三表面连接于第一基板的第二表面，提高了第一电路板和第二电路板连接的可靠性，优化了电池保护板的空间布局，且通过改变第二电路板上的极耳连接部的位置更容易实现适配不同的极耳位置，以及只需相应更改第二电路板的结构尺寸，则可适配不同待供电设备的扣合位置即可，保证了第一电路板的通用性，从而一定程度上提高了电池保护板的通用性。
在一些实施例中，电子元器件为具有独立封装的电子元器件，以将各电子元器件的内部器件与外界隔离，防止外界杂质对其内部电路的腐蚀而造成电气性能下降，且保护其表面以及连接引线等，避免受外力损害及外部环境的影响。
在一些实施例中，电子元器件为无独立封装的电子元器件，降低了电子元器件的厚度，从而降低了第一电路板的厚度，以及减少电池 保护板的占用空间，此外，省去独立的封装后，可降低电子元器件的物料成本。
在一些实施例中，第一电路板设有多个，多个第一电路板分别连接于第二电路板。通过以上设置，允许了多个第一电路板进行多样化的组合，并可依照客户或产品的需求加以客制化或弹性生产，提高了电池保护板的通用性，且可缩短第一电路板的开发周期、降低生产成本、提高集成度。
在一些实施例中，第二表面和第三表面对应设置有多组焊盘，第一基板与第二基板通过多组焊盘焊接连接，通过焊盘焊接的方式，一方面，能够稳定的将第一基板与第二基板进行固定连接，另一方面,可以通过焊盘焊接实现第一基板与第二基板之间的电连接。
在一些实施例中，每组焊盘沿第二表面的长度方向设置，多组焊盘沿第二表面的宽度方向设置，使得多组焊盘根据第二表面的形状大小铺满第二表面，有效均匀第一基板的焊接区域温度，从而降低第一基板的温升。
在一些实施例中，第二电路板还包括连接器，连接器至少设有两个，至少两个连接器分别设于第二基板的两端。通过以上设置，一方面，使得第二电路板具有分流作用，允许了电流自第一基板分别流向第二基板的两端上的连接器，或者自第二基板的两端上的连接器分别流向第一基板，防止第二电路板过流而出现过热，实现了对第二电路板的散热作用，从而允许了第二电路板连接大功率的待供电设备；另一方面，可方便第二电路板与待供电设备的装配连接。
在一些实施例中，第一基板为刚性印刷板，第二基板为柔性印刷板，通过在刚性印刷板上面布置电子元器件，然后刚性印刷板整体通过焊盘焊接的形式与柔性印刷板电连接，可以实现规模化生产刚性印刷板，然后结合不同形状、尺寸的柔性印刷板进行使用，大大拓宽了印刷板的使用范围及灵活度。
第二方面，还提供一种电池，电池包括电芯和与电芯连接的保护板，保护板为上述的电池保护板。其中，通过使用以上实施例中的电池保护板，优化了电芯与电池保护板连接处的空间，且一定程度上提高了电池的通用性。
在一些实施例中，电芯包括极性相同的第一极耳和第二极耳，以及与第一极耳极性相反的第三极耳。保护板上设有三个极耳连接部，三个极耳连接部分别与第一极耳、第二极耳以及第三极耳相连接。其中，当极耳的数量为三个以上时，电路板焊接空间不足的问题更为突出，在本实施例中，极耳连接部是设于第二电路板上的，避免了极耳连接部占据第一电路板的焊接位置，增大了第一电路板与第二电路板的可焊接面积，从而使得第一电路板预留有足够的焊接空间，以供第二电路板焊接于第一电路板，提高了第一电路板和第二电路板连接的可靠性，优化了保护板的空间布局。
第三方面，还提供一种电子设备，电子设备包括上述的电池。
第四方面，还提供一种电池保护板的制造方法，该方法包括以下步骤：在第一基板的第一表面上贴装电子元器件，并且在第一基板的第一表面上通过注塑形成覆盖电子元器件的绝缘层，制成第一电路板；将第一电路板贴设于第二电路板的第三表面；在第二电路板的第四表面上贴设极耳连接部。
在本实施例中，一方面，通过将极耳连接部设于第二电路板，避免了极耳连接部占据第一电路板的焊接位置，从而使得第一电路板预留有足够的焊接空间，以供第二电路板焊接于第一电路板，提高了第一电路板和第二电路板连接的可靠性，且优化了电池保护板的空间布局；另一方面，通过将第一电路板与第二电路板分开来料，在单独制成第一电路板后，再将第一电路板贴设于第二电路板，即可允许第一电路板适配不用尺寸的第二电路板，也即，第一电路板可以根据需要地配置于不同尺寸的第二电路板，从而使得电池保护板可搭配不同的 电池产品或待供电设备，又能够避免在对电子元器件进行注塑封装时压伤第二电路板。
在一些实施例中，在第一基板的第一表面上贴装电子元器件，并且在第一基板的第一表面上通过注塑形成覆盖电子元器件的绝缘层，制成第一电路板，进一步包括：提供拼板，其中，拼板包括相互连接的多个第一基板；在每一第一基板的第一表面分别贴装一组电子元器件；在第一基板的第一表面注塑形成绝缘层；将拼板进行分板，制成多个独立的第一电路板。
在本实施例中，通过提供拼板，并在拼板上按序完成电子元器件的贴装、封装，大大提高了制造第一电路板的效率，且保证了第一电路板尺寸的一致性。
附图说明
一个或多个实施例通过与之对应的附图中的图片进行示例性说明，这些示例性说明且不构成对实施例的限定，附图中具有相同参考数字标号的元件表示为类似的元件，除非有特别申明，附图中的图不构成比例限制。
图1是一现有技术的电池保护板的结构立体图；
图2是另一现有技术的电池保护板的结构立体图；
图3是本申请其中一实施例示出的电池保护板的结构立体图；
图4是图1的电池保护板的另一角度结构立体图；
图5是图1的电池保护板的结构分解图；
图6是本申请其中一实施例示出的电池保护板的结构示意图，其中，展示了A部分的局部放大图；
图7是本申请其中另一实施例示出的电池保护板的结构示意图，其中，展示了B部分的局部放大图；
图8是本申请其中又一实施例示出的电池保护板的结构示意图；
图9是图5的电池保护板的第一基板的另一角度结构立体图；
图10是本申请实施例再一实施例提供的电池的结构示意图。
具体实施方式
为了便于理解本申请，下面结合附图和具体实施例，对本申请进行更详细的说明。需要说明的是，当元件被表述“固定于”/“安装于”另一个元件，它可以直接在另一个元件上、或者其间可以存在一个或多个居中的元件。当一个元件被表述“连接”另一个元件，它可以是直接连接到另一个元件、或者其间可以存在一个或多个居中的元件。本说明书所使用的术语“上”、“下”、“内”、“外”、“垂直的”、“水平的”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性。
除非另有定义，本说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是用于限制本申请。本说明书所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
此外，下面所描述的本申请不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
请参阅图3-图5，图3是本申请其中一实施例示出的电池保护板100的结构立体图，图4是图3的电池保护板100的另一角度结构立体图，图5是图3的电池保护板100的结构分解图，本申请实施例提供一种电池保护板100，用于电池中过充、过放、过流、短路等保护，电池保护板100包括第一电路板10，以及与第一电路板10连接的第二电路板20和极耳连接部30，第一电路板10连接第二电路板20和极耳连接部30，第一电路板10作为电池保护板100中具有保护功能的电路板， 第二电路板20用于与外部待供电设备连接，极耳连接部30用于与电芯的极耳连接。
在本申请实施例中所提供的电池保护板100，第一电路板10包括第一基板11、电子元器件12和绝缘层13。第一基板11包括相背设置的第一表面101和第二表面102，若干电子元器件12设于第一表面101，绝缘层13覆盖第一表面101上的电子元器件12。第二电路板20包括第二基板21，第二基板21包括相背设置的第三表面201和第四表面202，第二基板21的第三表面201与第一基板11的第二表面102连接，极耳连接部30设于第四表面202。
相较图1所示的电池保护板1的结构，在本申请实施例中，极耳连接部30设于第二基板21的第四表面202，避免了极耳连接部30占据第一基板11的第二表面102上的焊接位置，从而使得第一基板11的第二表面102预留有足够的焊接空间，以供第二基板21的第三表面201焊接于第一基板11的第二表面102，提高了第一电路板10和第二电路板20连接的可靠性，且优化了电池保护板100的空间布局。
当电芯的极耳的位置发生改变时，相较图1和图2所示结构需要对硬板1上的连接片4位置进行相应改变，在本申请实施例中，极耳连接部30设于第二电路板20，通过改变第二电路板20上的极耳连接部30的位置更容易实现适配不同的极耳位置，而第一电路板10可作为一集成模块可适配于不同结构尺寸的第一电路板10，保证了第一电路板10的通用性，从而一定程度上提高了电池保护板100的通用性。
当待供电设备的待扣合位置发生改变时，相较图5所示结构需要对整个软硬结合板进行重新设计，在本申请实施例中，只需相应更改第二电路板20的结构尺寸，以适配不同待供电设备的扣合位置即可，保证了第一电路板10的通用性，从而一定程度上提高了电池保护板100的通用性，且其生产成本较低。
此外，相较图5所示结构，若对软硬结合板的硬板1上的电子器件5进行注塑封装，则存在软板3被压伤的风险，而在本申请实施例 中，第一电路板10是独立于第二电路板20的，因此，能够避免在对电子元器件12进行注塑封装时压伤第二电路板20。
在本申请实施例中，通过绝缘层13覆盖第一表面101上的电子元器件12，可对第一表面101上的所有电子元器件12起均匀散热作用，电子元器件12工作时产生的热量通过绝缘层13散发，相较于空气散热，绝缘层13的散热效果更佳，且绝缘层13还可对电子元器件12起防水、防尘等作用，提高了第二电路板20的机械可靠性，保证了电池保护板100的安全性能。
在一些实施例中，绝缘层13通过低压注塑工艺直接在第一基板11上注塑成型，使得各电子元器件12之间的间隙内也填充有绝缘，进一步提升绝缘层13对电子元器件12的防护作用。其中，绝缘层13采用绝缘材料，如环氧树脂、热熔胶等；在一些实施例中，绝缘层13的材料兼顾绝缘性和良好的导热性、散热性，从而提高电子元器件12的散热能力。材料可以选择相变材料，当然也可以选择散热塑料。
请继续参阅图3-图5，在本实施例中，第一基板11呈长板状，第二基板21包括第一段211以及分别自第一段211的两端弯折形成的第二段212。第一基板11的第二表面102沿第一段211的长度方向贴设于第一段211上的第三表面201，以最大化地实现第一基板11与第二基板21的接触面积。
在一些实施例中，第二表面102全部与第三表面201相连接，从而保证第一电路板10与第二电路板20之间连接的可靠性。
若干电子元器件12设于第一基板11背向第二基板21的第一表面101，并与第一基板11电性连接。绝缘层13覆盖第一表面101上的电子元器件12，并与第一表面101配合而封装所有电子元器件12。极耳连接部30设于第二基板21背向第一基板11的第四表面202，并与第二基板21电性连接，极耳连接部30位于第一段211。
电子元器件12包括控制集成芯片、MOS管、电阻、电容和电感中的至少一种。其中，集成芯片用于接收信号，并将信号反馈给MOS 管，以使MOS管作出相应反应，具体地，当集成芯片检测到电压过充信号时，会向MOS管反馈过充信号，MOS管则根据过充信号关闭，以此停止充电。
在本申请的一些实施例中，第一基板11为刚性印刷板，刚性印刷板具有可高密度化、高可靠性、可设计性、可生产性和可测试性等特点，且刚性印刷板相对柔性印刷板的散热性较好且强度较高，适用于电池保护板100中设置电子元器件12。其中，刚性印刷板包括酚醛纸质层压板、环氧纸质层压板、聚酯玻璃毡层压板和环氧玻璃布层压板中的至少一种。
在本申请的一些实施例中，第二基板21为柔性印刷板，柔性印刷板具有可弯曲、卷绕、折叠等特点，通过使用柔性电路板可大大缩小电池保护板100的整体体积，可实现产品向高密度、小型化、高可靠方向发展。其中，柔性印刷板包括聚酰亚胺或聚酯薄膜。
其中，通过在刚性印刷板上面布置电子元器件12，然后刚性印刷板整体通过焊盘焊接的形式与柔性印刷板电连接，可以实现规模化生产刚性印刷板，然后结合不同形状、尺寸的柔性印刷板进行使用，大大拓宽了印刷板的使用范围及灵活度。
在本申请的一些其他实施例中，第一基板11和第二基板21的形状结构可以根据实际需要设置，本申请并不对第一基板11和第二基板21的形状结构进行限定。
在本申请的一些实施例中，第二电路板20还包括连接器22，连接器22至少设有两个，至少两个连接器22分别设于第二基板21的两端，连接器22用于与外部待供电设备连接。通过以上设置，一方面，使得第二电路板20具有分流作用，允许了电流自第一基板11分别流向第二基板21的两端上的连接器22，或者自第二基板21的两端上的连接器22分别流向第一基板11，防止第二电路板20过流而出现过热，实现了对第二电路板20的散热作用，从而允许了第二电路板20连接大 功率的待供电设备；另一方面，可方便第二电路板20与待供电设备的装配连接。
在本申请的一些实施例中，电池保护板100还包括补强片23，补强片23设有至少两个，至少两个补强片23分别设于第二基板21的两端，一个补强片23对应一个连接器22，补强片23用于加强连接器22与第二基板21之间的连接，以使得连接器22紧固地连接于第二基板21，防止连接器22从第二基板21上脱落。
其中，两个连接器22分别设于两个第二段212上与的第三表面203，并分别与第二基板21电性连接。两个补强片23分别设于两个第二段212上的第四表面204，并分别加强两个连接器22与第二基板21之间的连接。
请参阅图6，图6是本申请其中一实施例示出的电池保护板100的结构示意图，在本申请的一些实施例中，电子元器件12为具有独立封装的电子元器件12，也即，各电子元器件12分别单独设有封装层，以将各电子元器件12的内部器件与外界隔离，防止外界杂质对其内部电路的腐蚀而造成电气性能下降，且保护其表面以及连接引线等，避免受外力损害及外部环境的影响，结合上述的绝缘层13，可对各电子元器件12起到更好的保护作用。
其中，在绝缘层13覆盖第一表面101上的所有电子元器件12之前，具有独立封装的电子元器件12即具备一定的自我保护能力，便于保存、安装和运输。其中，封装层采用绝缘材料，如环氧树脂、热熔胶等。
请参阅图7，图7是本申请其中另一实施例示出的电池保护板100的结构示意图，在本申请的一些实施例中，电子元器件12为无独立封装的电子元器件12，也即，各电子元器件12不分别单独设有独立的封装层。通过以上结构，降低了电子元器件12的厚度，从而降低了第一电路板10的厚度，以及减少电池保护板100的占用空间，此外，省去独立的封装后，可降低电子元器件12的物料成本。
其中，绝缘层13覆盖第一表面101上的各无独立封装的电子元器件12。
请参阅图8，图8是本申请其中又一实施例示出的电池保护板100的结构示意图，在本申请的一些实施例中，第一电路板10设有多个，多个第一电路板10分别连接于第二电路板20。
具体地，每个第一电路板10均包括第一基板11以及设于第一基板11的第一表面101的若干电子元器件12，不同的第一基板11可以根据需要配置不同的电子元器件12，以形成具有不同功能的多个第一电路板10，例如，一个第一电路板10的第一基板11设有集成芯片，另一个第一电路板10的第一基板11设有MOS管。通过以上设置，允许了多个第一电路板10进行多样化的组合，并可依照客户或产品的需求加以客制化或弹性生产，提高了电池保护板100的通用性，且可缩短第一电路板10的开发周期、降低生产成本、提高集成度。
其中，每一第一电路板10还包括覆盖电子元器件12的绝缘层13，从而使得每一第一电路板10单独形成SIP(System In a Package)模组，若干个SIP模组可作为集成器件设于第二电路板20，不同的待供电设备通过制作不同的第二电路板20以适配不同的扣合位置，再选择搭配不同保护功能的SIP模组，以实现模组多用的效果。
其中，电子元器件12可以根据需要地选用为具有独立封装的电子元器件12或无独立封装的电子元器件12。
请参阅图6和图9，图9是图5的电池保护板100的第一基板11的另一角度结构立体图，在本申请实施例中，第一基板11的第二表面102和第二基板21的第三表面201对应设置有多组焊盘40，第一基板11与第二基板21通过多组焊盘40焊接连接。通过焊盘40焊接的方式，一方面，能够稳定的将第一基板11与第二基板21进行固定连接，另一方面，可以通过焊盘40焊接实现第一基板11与第二基板21之间的电连接。
进一步地，每组焊盘40沿第二表面102的长度方向设置，多组焊盘40沿第二表面102的宽度方向设置，第三表面201上的焊盘40与第二表面102上的焊盘40一一对应。通过以上设置，使得多组焊盘40根据第二表面102的形状大小铺满第二表面102，有效均匀第一基板11的焊接区域温度，从而降低第一基板11的温升。
其中，每组焊盘40设有多个独立的焊盘40，于第二表面102上，多个独立的焊盘40沿第二表面102的长度方向间隔设置，多组焊盘40沿第二表面102的宽度方向间隔设置。
其中，焊盘40的形状大小可以根据实际需要设置，不同的焊盘40可以根据需要设置为相同或不同的形状大小。
其中，第二表面102的宽度方向垂直于图6所示结构所在的纸面，第二表面102的长度方向与其宽度方向垂直，且第二表面102于图5中的示出角度以一直线段示出，该直线段的方向即为第二表面102的长度方向。
进一步地，于第二表面102上，至少设有两种不同形状大小的焊盘40，并使得所有焊盘40以非对称的方式分布于第二表面102，以起防呆作用，防止人工操作时将第二表面102贴反于第三表面201。
在一些实施例中，部分焊盘40用于实现第一电路板10和第二电路板20之间的电连接，以使第一基板11上的电子元器件12、第一基板11内的电子线路以及第二基板21上的电子线路共同构成电池保护电路。
请参阅图10，图10是本申请实施例再一实施例提供的电池的结构示意图，基于同一发明构思，本申请实施例还提供一种电池1000，电池1000包括电芯200和与电芯200连接的保护板，保护板为上述任一实施例中的电池保护板100。通过使用以上实施例中的电池保护板100，优化了电芯200与电池保护板100连接处的空间，且一定程度上提高了电池1000的通用性。
电芯200包括极性相同的第一极耳210和第二极耳220，以及与第一极耳210极性相反的第三极耳230，保护板上设有三个上述的极耳连接部30，三个极耳连接部30分别与第一极耳210、第二极耳220以及第三极耳230相连接。
需要说明的是，在现有技术中，当极耳的数量为三个以上时，则需要于硬板设与极耳相同数量的连接片，以分别与各个极耳连接，从而导致电路板焊接空间不足的问题更为突出。
而在本申请实施例的保护板中，极耳连接部30是设于第二电路板20上的，避免了极耳连接部30占据第一电路板10的焊接位置，增大了第一电路板10与第二电路板20的可焊接面积，从而使得第一电路板10预留有足够的焊接空间，以供第二电路板20焊接于第一电路板10，提高了第一电路板10和第二电路板20连接的可靠性，优化了保护板的空间布局。
在本申请实施例中，电芯200还包括电极组件240，第一极耳210、第二极耳220以及第三极耳230的一端分别与电极组件240相连接，第一极耳210、第二极耳220以及第三极耳230的另一端分别与三个极耳连接部30相连接。
基于同一发明构思，本申请实施例还提供一种电子设备，电子设备包括上述任一实施例中的电池200。
本申请的电子设备没有特别限定，其可以是用于现有技术中已知的任何电子设备。
在本申请的一些实施例中，电子设备可以例如是，手机，笔记本电脑，平板电脑，可穿戴设备，游戏机等。
基于同一发明构思，本申请实施例还提供了一种电池保护板100的制造方法，该方法应用于上述任一实施例中的电池保护板100，以下对该制造方法进行说明，该制造方法包括以下步骤：
S1：在第一基板11的第一表面101上贴装电子元器件12，并且在第一基板11的第一表面101上通过注塑形成覆盖电子元器件12的绝缘层13，制成第一电路板10。
具体地，第一基板11包括相背设置的第一表面101和第二表面102。首先，通过贴片机在第一基板11的第一表面101上，贴装若干电子元器件12；之后，通过注塑模具在第一基板11的第一表面101上，注塑形成覆盖第一表面101上的电子元器件12的绝缘层13，绝缘层13与第一表面101配合实现对第一表面101上的电子元器件12的封装。
S2：将第一电路板10贴设于第二电路板20的第三表面201；
具体地，第二电路板20包括第二基板21，第二基板21包括相背设置的第三表面201和第四表面202，第二基板21还包括第一段211以及分别自第一段211的两端弯折形成的第二段212。将第一电路板10的第一基板11的第二表面102贴设于第二电路板20的第二基板21的第三表面201。
其中，第二表面102与第三表面201之间通过焊接的方式实现固定连接。
S3：在第二电路板20的第四表面202上贴设极耳连接部30。
具体地，将极耳连接部30贴设于第二电路板20的第二基板21的第四表面202。其中，极耳连接部30可通过焊接的方式固定于第四表面202。
需要说明的是，上述步骤的顺序也可以根据实际情况而定，只需S2位于S1之前即可，例如，可以先执行S3，再依次执行S1、S2，也可以先执行S1，再依次执行S3、S2。
在本实施例中，一方面，通过将极耳连接部30设于第二电路板20，避免了极耳连接部30占据第一电路板10的焊接位置，从而使得第一电路板10预留有足够的焊接空间，以供第二电路板20焊接于第一电路板10，提高了第一电路板10和第二电路板20连接的可靠性，且优 化了电池保护板100的空间布局；另一方面，通过将第一电路板10与第二电路板20分开来料，在单独制成第一电路板10后，再将第一电路板10贴设于第二电路板20，即可允许第一电路板10适配不用尺寸的第二电路板20，也即，第一电路板10可以根据需要地配置于不同尺寸的第二电路板20，从而使得电池保护板100可搭配不同的电池产品或待供电设备，又能够避免在对电子元器件12进行注塑封装时压伤第二电路板20。
对于上述的步骤S1，步骤S1进一步包括：
提供拼板，其中，拼板包括相互连接的多个第一基板11；
具体地，所有第一基板11的第一表面101相互连接形成拼板的第一侧面，所有第一基板11的第二表面102相互连接形成拼板的第二侧面，第一侧面与第二侧面相背设置。其中，拼板可以是刚性印刷板。
S101：在每一第一基板11的第一表面101分别贴装一组电子元器件12；
具体地，通过贴片机在拼板上的第一侧面的每一第一表面101上，分别贴装一组电子元器件12。
S102：在第一基板11的第一表面101注塑形成绝缘层13；
具体地，通过注塑模具在拼板的第一侧面上，注塑形成覆盖第一侧面上的所有电子元器件12的绝缘层13，绝缘层13与第一侧面配合实现对第一侧面上的所有电子元器件12的封装。
S103：将拼板进行分板，制成多个独立的第一电路板10。
具体地，根据每一第一基板11所在区域进行裁切，以制成多个独立的第一电路板10。
在本实施例中，通过提供拼板，并在拼板上按序完成电子元器件12的贴装、封装，大大提高了制造第一电路板10的效率，且保证了第一电路板10尺寸的一致性。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围。

Claims (13)

  1. 一种电池保护板，包括第一电路板、第二电路板以及极耳连接部，其特征在于，所述第一电路板包括：
    第一基板，所述第一基板包括相背设置的第一表面和第二表面；
    电子元器件，若干所述电子元器件设于所述第一表面；
    绝缘层，所述绝缘层覆盖所述第一表面上的所述电子元器件；
    所述第二电路板包括：
    第二基板，所述第二基板包括相背设置的第三表面和第四表面；
    所述第三表面与所述第二表面连接，所述极耳连接部设于所述第四表面。
  2. 根据权利要求1所述的电池保护板，其特征在于，所述电子元器件为具有独立封装的电子元器件。
  3. 根据权利要求1所述的电池保护板，其特征在于，所述电子元器件为无独立封装的电子元器件。
  4. 根据权利要求2或3任一项所述的电池保护板，其特征在于，所述第一电路板设有多个，多个所述第一电路板分别连接于所述第二电路板。
  5. 根据权利要求1所述的电池保护板，其特征在于，所述第二表面和所述第三表面对应设置有多组焊盘，所述第一基板与所述第二基板通过所 述多组焊盘焊接连接。
  6. 根据权利要求5所述的电池保护板，其特征在于，每组所述焊盘沿所述第二表面的长度方向设置，所述多组焊盘沿所述第二表面的宽度方向设置。
  7. 根据权利要求1所述的电池保护板，其特征在于，所述第二电路板还包括连接器，所述连接器至少设有两个，至少两个所述连接器分别设于所述第二基板的两端。
  8. 根据权利要求1所述的电池保护板，其特征在于，所述第一基板为刚性印刷板，所述第二基板为柔性印刷板。
  9. 一种电池，包括电芯和与所述电芯连接的保护板，其特征在于，所述保护板为权利要求1-8任意一项所述的电池保护板。
  10. 根据权利要求9所述的电池，其特征在于，所述电芯包括极性相同的第一极耳和第二极耳，以及与所述第一极耳极性相反的第三极耳；
    所述保护板上设有三个所述极耳连接部，三个所述极耳连接部分别与所述第一极耳、所述第二极耳以及所述第三极耳相连接。
  11. 一种电子设备，其特征在于，包括：
    如权利要求9或10任意一项所述的电池。
  12. 一种电池保护板的制造方法，其特征在于，包括以下步骤：
    在第一基板的第一表面上贴装电子元器件，并且在所述第一基板的第一表面上通过注塑形成覆盖所述电子元器件的绝缘层，制成第一电路板；
    将所述第一电路板贴设于所述第二电路板的第三表面；在所述第二电路板的第四表面上贴设极耳连接部。
  13. 根据权利要求12所述的制造方法，其特征在于，所述在第一基板的第一表面上贴装电子元器件，并且在所述第一基板的第一表面上通过注塑形成覆盖所述电子元器件的绝缘层，制成第一电路板，进一步包括：
    提供拼板，其中，所述拼板包括相互连接的多个所述第一基板；
    在每一所述第一基板的第一表面分别贴装一组所述电子元器件；
    在所述第一基板的第一表面注塑形成绝缘层；
    将所述拼板进行分板，制成多个独立的所述第一电路板。
PCT/CN2022/095273 2021-07-30 2022-05-26 电池保护板及其制造方法、电池及电子设备 Ceased WO2023005392A1 (zh)

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