WO2023045642A1 - 电路板组件以及电子设备 - Google Patents

电路板组件以及电子设备 Download PDF

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Publication number
WO2023045642A1
WO2023045642A1 PCT/CN2022/113353 CN2022113353W WO2023045642A1 WO 2023045642 A1 WO2023045642 A1 WO 2023045642A1 CN 2022113353 W CN2022113353 W CN 2022113353W WO 2023045642 A1 WO2023045642 A1 WO 2023045642A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
concave surface
wall
board assembly
frame plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/113353
Other languages
English (en)
French (fr)
Inventor
郭健强
王利颖
王晓岩
杨帆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to US18/005,461 priority Critical patent/US12538426B2/en
Priority to EP22826802.5A priority patent/EP4178325B1/en
Publication of WO2023045642A1 publication Critical patent/WO2023045642A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the embodiments of the present application relate to the technical field of terminals, and in particular to a circuit board assembly and electronic equipment.
  • circuit boards are usually arranged in a stacked manner.
  • the electronic devices can be dispersedly arranged on each circuit board, so that it is not necessary to increase the area of the circuit board carrying the electronic devices to arrange all the electronic devices.
  • circuit board assembly The manner in which multiple circuit boards are stacked is that two adjacent circuit boards are connected through a frame plate.
  • the frame plate and the circuit board are welded and assembled to form a circuit board assembly.
  • Different circuit boards can be electrically connected through the frame board to realize data information exchange. Since the circuit board and the frame board are two structural parts designed separately, when the electronic device encounters a scene of uneven force such as drop or collision, the circuit board and the frame board are easy to separate at the joint, causing the circuit board assembly to appear. Communication failure or failure to use normally.
  • Embodiments of the present application provide a circuit board assembly and an electronic device, which can improve the connection force between the circuit board and the frame board, and effectively reduce the possibility of separation between the circuit board and the frame board.
  • the first aspect of the present application provides a circuit board assembly.
  • Circuit board assemblies are used in electronic devices.
  • the circuit board assembly includes at least a frame board and a circuit board.
  • the frame plate includes a frame body, a first weld and a second weld.
  • the frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole.
  • a first welding portion is provided on the middle area between the inner wall and the outer wall on the frame body.
  • At least one of the inner wall and the outer wall is provided with a receiving groove.
  • the receiving groove extends along the thickness direction of the frame plate itself.
  • the second welding part is arranged in the receiving groove and connected with the frame body.
  • the circuit board includes pads. The first welding portion and the second welding portion are respectively welded to corresponding pads.
  • the circuit board assembly of the embodiment of the present application includes a frame board and a circuit board.
  • the frame plate includes a frame body, a first weld on the middle region, and a second weld on at least one of the outer wall and the inner wall.
  • the width of the frame body can be kept constant, the density of connection points formed by the first welding portion and the second welding portion on the frame body is greater.
  • the circuit board is connected to the frame board through the first welding part and the second welding part, so that the edge area of the circuit board and the frame board is in a connected state, and since the number of connection points between the circuit board and the frame board increases, the circuit board and the frame
  • the connection force between the plates is improved.
  • the first welding part and the second welding part between the circuit board and the frame board can buffer the force at the same time, thereby effectively reducing the separation of the circuit board and the frame board possibility.
  • the receiving groove includes a bottom surface and side surfaces. Bottom and side intersection settings.
  • the surface shape of the second welding portion facing the bottom surface matches the shape of the bottom surface.
  • the shape of the surface of the second welding portion facing the side matches the shape of the side.
  • the surface of the second welding part facing the receiving groove can be in close contact with the surface of the receiving groove, which is conducive to improving the bonding force between the second welding part and the surface of the receiving groove, and reducing the pressure on the surface of the second welding part and the receiving groove. There is a possibility that separation occurs so that the circuit board cannot be connected to the frame board through the second soldering portion.
  • the angle range between the bottom surface and the side surface of the receiving tank may be 90° to 110°.
  • the accommodating groove runs through two opposite surfaces of the frame body along the thickness direction.
  • the first welding portion and the second welding portion are respectively welded to corresponding pads on the circuit board through solder joints.
  • the surface of the second welding portion facing away from the middle receiving hole includes a connected first concave surface, a second concave surface and a third concave surface.
  • the first concave surface, the second concave surface and the third concave surface are concave toward the middle region.
  • the second concave surface and the third concave surface are respectively located on both sides of the first concave surface. Both the intersection area of the first concave surface and the second concave surface and the intersection area of the first concave surface and the third concave surface exceed the opening of the receiving groove.
  • the depression depth of the second concave surface and the depression depth of the third concave surface are both smaller than the depression depth of the first concave surface.
  • the first concave surface, the second concave surface and the third concave surface are all arc surfaces.
  • the central angle corresponding to the first concave surface is 60° to 120°.
  • respective radii of the first concave surface, the second concave surface and the third concave surface are the same.
  • first concave surface, the second concave surface and the third concave surface are manufactured by drilling or milling, it is convenient to use a tool of one diameter for cutting, reducing the complexity of the processing procedure and low processing efficiency due to the need to replace tools of different diameters possibility.
  • more than two receiving grooves are evenly distributed, and more than two second welding parts are evenly distributed.
  • the distance between every two adjacent receiving grooves is equal.
  • the number and positions of the second welding parts are set in one-to-one correspondence with the number and positions of the receiving grooves.
  • more than two second welding parts are evenly distributed. Therefore, after all the second welding parts are welded to the corresponding pads on the circuit board, it can help to improve the force balance of the circuit board at various positions, and reduce the unbalanced connection force between the circuit board and the frame board at different positions. Possibility of causing localized warping of the board.
  • both the inner wall and the outer wall are provided with accommodating grooves, so that a second welding part is provided in each accommodating groove, which is conducive to further improving the connection point formed by the first welding part and the second welding part on the frame plate. Density.
  • the number and positions of the receiving grooves on the outer wall are set in one-to-one correspondence with the number and positions of the receiving grooves on the inner wall.
  • more than two rows of through holes are provided in the middle area.
  • Each through hole is correspondingly provided with a first welding portion.
  • More than two rows of through holes are arranged at intervals along the width direction of the frame plate. In a row of through holes close to the outer wall, one receiving groove on the outer wall corresponds to two through holes. In a row of through holes near the inner wall, one receiving groove on the inner wall corresponds to two through holes.
  • the second aspect of the embodiment of the present application provides an electronic device, which includes the above-mentioned circuit board assembly.
  • the circuit board assembly includes at least a frame board and a circuit board.
  • the frame plate includes a frame body, a first weld and a second weld.
  • the frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole.
  • a first welding portion is provided on the middle area between the inner wall and the outer wall on the frame body.
  • At least one of the inner wall and the outer wall is provided with a receiving groove.
  • the receiving groove extends along the thickness direction of the frame plate itself.
  • the second welding part is arranged in the receiving groove and connected with the frame body.
  • the circuit board includes pads. The first welding portion and the second welding portion are respectively welded to corresponding pads.
  • the receiving groove includes a bottom surface and side surfaces. Bottom and side intersection settings.
  • the surface shape of the second welding portion facing the bottom surface matches the shape of the bottom surface.
  • the shape of the surface of the second welding portion facing the side matches the shape of the side.
  • the surface of the second welding part facing the receiving groove can be in close contact with the surface of the receiving groove, which is conducive to improving the bonding force between the second welding part and the surface of the receiving groove, and reducing the pressure on the surface of the second welding part and the receiving groove. There is a possibility that separation occurs so that the circuit board cannot be connected to the frame board through the second soldering portion.
  • the angle range between the bottom surface and the side surface of the receiving tank may be 90° to 110°.
  • the accommodating groove runs through two opposite surfaces of the frame body along the thickness direction.
  • the first welding portion and the second welding portion are respectively welded to corresponding pads on the circuit board through solder joints.
  • the surface of the second welding portion facing away from the middle receiving hole includes a connected first concave surface, a second concave surface and a third concave surface.
  • the first concave surface, the second concave surface and the third concave surface are concave toward the middle region.
  • the second concave surface and the third concave surface are respectively located on both sides of the first concave surface. Both the intersection area of the first concave surface and the second concave surface and the intersection area of the first concave surface and the third concave surface exceed the opening of the receiving groove.
  • the depression depth of the second concave surface and the depression depth of the third concave surface are both smaller than the depression depth of the first concave surface.
  • the first concave surface, the second concave surface and the third concave surface are all arc surfaces.
  • the central angle corresponding to the first concave surface is 60° to 120°.
  • respective radii of the first concave surface, the second concave surface and the third concave surface are the same.
  • first concave surface, the second concave surface and the third concave surface are manufactured by drilling or milling, it is convenient to use a tool of one diameter for cutting, reducing the complexity of the processing procedure and low processing efficiency due to the need to replace tools of different diameters possibility.
  • more than two receiving grooves are evenly distributed, and more than two second welding parts are evenly distributed.
  • the distance between every two adjacent receiving grooves is equal.
  • the number and positions of the second welding parts are set in one-to-one correspondence with the number and positions of the receiving grooves.
  • more than two second welding parts are evenly distributed. Therefore, after all the second welding parts are welded to the corresponding pads on the circuit board, it can help to improve the force balance of the circuit board at various positions, and reduce the unbalanced connection force between the circuit board and the frame board at different positions. Possibility of causing localized warping of the board.
  • both the inner wall and the outer wall are provided with accommodating grooves, so that a second welding part is provided in each accommodating groove, which is conducive to further improving the connection point formed by the first welding part and the second welding part on the frame plate. Density.
  • the number and positions of the receiving grooves on the outer wall are set in one-to-one correspondence with the number and positions of the receiving grooves on the inner wall.
  • more than two rows of through holes are provided in the middle area.
  • Each through hole is correspondingly provided with a first welding portion.
  • More than two rows of through holes are arranged at intervals along the width direction of the frame plate. In a row of through holes close to the outer wall, one receiving groove on the outer wall corresponds to two through holes. In a row of through holes near the inner wall, one receiving groove on the inner wall corresponds to two through holes.
  • the third aspect of the embodiment of the present application provides a method for manufacturing a frame plate, the method includes the following steps:
  • a copper-clad substrate is provided, and the copper-clad substrate includes a dielectric layer and copper-clad layers on both sides.
  • Drilling holes on the copper clad substrate to form a first through hole Drilling holes on the copper clad substrate to form a first through hole.
  • a first copper layer is formed on the inner wall of the first through hole, and the first copper layer is electrically connected to the copper clad layers on both sides.
  • Drilling holes on the copper-clad substrate to form second through holes the first through holes and the second through holes are arranged at intervals.
  • An anti-electroplating film is provided on the surface of the copper clad layer.
  • the second copper layer is formed on the inner wall of the second through hole and on the surface of the copper clad layer by adopting the process of first electroless plating and then electroplating.
  • the copper clad layer and the second copper layer on the surface of the copper clad layer are patterned by an etching process.
  • a layer of solder resist material is provided on the etched area.
  • the copper-clad substrate is cut to form a frame plate of a predetermined shape by a machining process. After finishing the processing, the second through hole and a part of the second copper layer are cut and removed.
  • the first through hole forms a through hole
  • the copper clad layer, the first copper layer and the second copper layer corresponding to the first through hole form a first soldering portion.
  • the remaining part of the second through hole forms the receiving groove, and the copper clad layer and the second copper layer corresponding to the remaining part of the second through hole form the second welding part.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of an exploded structure of a circuit board assembly provided by the related art
  • Fig. 4 is a top structural schematic view of the frame plate in the embodiment shown in Fig. 3;
  • FIG. 5 is a schematic cross-sectional structural view of the circuit board assembly of the embodiment shown in FIG. 3;
  • FIG. 6 is a schematic diagram of an exploded structure of a circuit board assembly according to an embodiment of the present application.
  • Fig. 7 is a schematic structural diagram of a frame plate provided by an embodiment of the present application.
  • Fig. 8 is a schematic top view of the frame body provided by an embodiment of the present application.
  • Figure 9 is an enlarged view of A in Figure 8.
  • FIG. 10 is a schematic cross-sectional structure diagram of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 11 is a schematic top view structure diagram of a frame plate provided by an embodiment of the present application.
  • Figure 12 is an enlarged view of B in Figure 11;
  • Fig. 13 is a schematic top view of a frame plate provided by another embodiment of the present application.
  • Figure 14 is an enlarged view at C in Figure 13;
  • FIG. 15 is a schematic cross-sectional structural view of a circuit board assembly provided in another embodiment of the present application.
  • Fig. 16 is a schematic top view of a frame plate provided by another embodiment of the present application.
  • Figure 17 is an enlarged view at D in Figure 16;
  • Fig. 18 is a partial structural schematic diagram of a frame plate provided by another embodiment of the present application.
  • FIG. 19 is a schematic cross-sectional structure diagram of a circuit board assembly provided in yet another embodiment of the present application.
  • Fig. 20 is a schematic diagram of a method for manufacturing a frame plate provided by an embodiment of the present application.
  • FIG. 1 schematically shows the structure of an electronic device 10 according to an embodiment.
  • an embodiment of the present application provides an electronic device 10, which can be a monitor, a handheld wireless communication device, a desktop computer, a notebook computer (laptop), a tablet computer (Table), a super mobile personal Computer (ultra-mobile personal computer, UMPC), handheld computer, walkie-talkie, netbook, POS machine, personal digital assistant (personal digital assistant, PDA) and other mobile terminals, fixed terminals or foldable devices.
  • an electronic device 10 can be a monitor, a handheld wireless communication device, a desktop computer, a notebook computer (laptop), a tablet computer (Table), a super mobile personal Computer (ultra-mobile personal computer, UMPC), handheld computer, walkie-talkie, netbook, POS machine, personal digital assistant (personal digital assistant, PDA) and other mobile terminals, fixed terminals or foldable devices.
  • PDA personal digital assistant
  • the handheld wireless communication device 10 may be a cell phone.
  • FIG. 2 schematically shows an exploded structure of an electronic device 10 according to an embodiment.
  • the electronic device 10 includes a display assembly 20 , a middle frame 30 , a circuit board assembly 40 and a rear case 50 .
  • the display unit 20 has a display area for displaying image information.
  • the display area faces away from the middle frame 30 . In the power-on state, the display area can display corresponding image information.
  • the middle frame 30 is disposed between the display assembly 20 and the rear case 50. It should be noted that the thickness direction of the electronic device 10 refers to the arrangement direction of the display assembly 20 and the rear case 50 .
  • the circuit board assembly 40 is disposed in a space formed between the middle frame 30 and the rear case 50 .
  • the circuit board assembly 40 may be disposed on a surface of the middle frame 30 facing the rear case 50 .
  • FIG. 3 schematically shows an exploded structure of a circuit board assembly 40 in the related art.
  • the circuit board assembly 40 may include a circuit board 41 and a plurality of electronic devices 43 electrically connected to the circuit board 41 .
  • the circuit board 41 in this application may be a printed circuit board (Printed Circuit Board, PCB), a flexible circuit board (Flexible Printed Circuit, FPC) or an integrated circuit (or called a chip).
  • the circuit board 41 may be single-sided or double-sided. Single-sided board means that one side of the circuit board 41 is provided with electronic devices 43 . Double-sided board means that both sides of the circuit board 41 are provided with electronic devices 43 .
  • the circuit board 41 may be a radio frequency (radio frequency, RF) board or an application processor (application processor, AP) board.
  • the radio frequency board can be used to carry radio frequency integrated circuit (RFIC), radio frequency power amplifier (radio frequency power amplifier, RFPA) and wireless fidelity (wireless fidelity, WIFI) chips, etc., but is not limited to.
  • An application processor board can be used, for example but not limited to, to host system on chip (SOC) components, double data rate (double data rate, DDR) memory, main power management unit (PMU) and auxiliary power supply Management chips, etc.
  • SOC system on chip
  • DDR double data rate
  • PMU main power management unit
  • auxiliary power supply Management chips etc.
  • the circuit board 41 can have a large lateral dimension, so that one circuit board 41 can be selected and a fixed number of electronic devices 43 are arranged on the circuit board. plate 41.
  • the lateral dimension refers to a dimension measured in a direction perpendicular to the thickness direction of the electronic device 10 . If the number of electronic devices 43 is large and the volume is large, and it is impossible to accommodate all electronic devices 43 with one circuit board 41, it is necessary to optimize the structure of the circuit board assembly 40, for example, a plurality of circuit boards 41 are placed along the thickness direction of the electronic device 10.
  • the electronic devices 43 are stacked and arranged on different circuit boards 41 , so that the internal space of the electronic device 10 can be fully utilized in the thickness direction of the electronic device 10 to accommodate more and larger electronic devices 43 .
  • FIG. 4 schematically shows the top view structure of the frame plate shown in FIG. 3 .
  • FIG. 5 schematically shows a partial cross-sectional structure of the circuit board assembly 40 shown in FIG. 3 .
  • a circuit board assembly 40 includes a circuit board 41 and a frame board 42 .
  • a frame board 42 is arranged between the two circuit boards 41 .
  • the two circuit boards 41 are respectively connected to the frame board 42 , so that a predetermined distance is maintained between the two circuit boards 41 , and no positional interference occurs between the two circuit boards 41 .
  • the two circuit boards 41 can also be electrically connected through the frame board 42 , so that the two circuit boards 41 can transmit data information to each other.
  • the frame plate 42 has a ring structure as a whole, so the frame plate 42 includes a middle receiving hole 421a.
  • the frame plate 42 may have a polygonal structure, such as a rectangular structure.
  • the frame plate 42 includes a frame body 421 and a first welding portion 422 .
  • the frame body 421 has a central receiving hole 421 a and opposite outer walls 4211 and inner walls 4212 .
  • the outer wall 4211 of the frame body 421 refers to the area of the frame body 421 facing away from the middle receiving hole 421a.
  • the inner wall 4212 of the frame body 421 refers to the area on the frame body 421 facing the middle receiving hole 421a.
  • the width direction of the frame plate 42 refers to the direction from the outer wall 4211 to the inner wall 4212 .
  • the frame body 421 also has an intermediate region 4213 between the outer wall 4211 and the inner wall 4212 .
  • the frame body 421 is made of insulating material, such as phenolic resin, epoxy resin or polytetrafluoroethylene.
  • the first welding portion 422 is disposed on the middle area 4213 of the frame body 421 .
  • a predetermined distance is maintained between the first welding portion 422 and the outer wall 4211 .
  • a predetermined distance is also maintained between the first welding portion 422 and the inner wall 4212 .
  • the first welding portion 422 is exposed on two opposite surfaces of the frame body 421 .
  • the circuit board 41 can be welded to the first welding portion 422 through welding spots.
  • the shape of the solder joint can be, but not limited to, spherical, ellipsoidal, cylindrical or truncated cone.
  • the first soldering portion 422 includes functional pads and non-functional pads. Functional pads can play the role of electrical connection and mechanical fixation. After the two circuit boards 41 are connected to the frame board 42 , the two circuit boards 41 can transmit electrical signals to each other through the functional pads.
  • the non-functional pads can play a role of mechanical fixing, but the two circuit boards 41 cannot transmit electric signals to each other through the non-functional pads.
  • the frame body 421 is provided with non-functional pads near the outer wall 4211 or the inner wall 4212 .
  • the frame body 421 is a ring structure.
  • a circle of non-functional pads near the outer wall 4211 and a circle of non-functional pads near the inner wall 4212 can be set on the middle area 4213 of the frame body 421, and a circle of functional pads can be set between the two circles of non-functional pads. pad.
  • connection stability between the frame board 42 and the circuit board 41 in the circuit board assembly 40 affects the performance and service life of the circuit board assembly 40 .
  • the connection between the frame board 42 and the circuit board 41 in the circuit board assembly 40 cannot be broken and separated. If the connection between the frame board 42 and the circuit board 41 is broken and separated, the circuit board assembly 40 will fail or cannot be used normally.
  • the circuit board 41 is connected to the frame plate 42 through the first welding portion 422 provided on the middle area 4213 of the frame plate 42, and the circuit board 41 is not connected to the outer edge or inner edge of the frame plate 42.
  • the circuit board 41 and the frame plate 42 will jointly apply a shear force or tensile force to the first welding portion 422, so that the first welding portion 422 and the solder joint or the pad and The joints of the solder joints need to bear a large external force, which may easily lead to separation of the circuit board 41 and the first welding portion 422 or separation of the frame plate 42 and the first welding portion 422 .
  • the width of the frame body 421 is appropriately increased, so that a larger number of first welding parts 422 can be arranged on the frame body 421, thereby increasing the The connection force between the circuit board 41 and the frame board 42.
  • connection force refers to the force that needs to be overcome when the circuit board 41 and the frame board 42 are separated.
  • the force required to separate the circuit board 41 from the frame board 42 refers to the force applied to the circuit board 41 along the thickness direction X of the frame board 42 away from the frame board 42 and separate the circuit board 41 from the frame board 42. required tensile stress.
  • the area connected to the frame plate 42 on the circuit board 41 cannot be provided with the electronic device 43, when the width of the frame body 421 itself is designed larger, it will result in an area where the electronic device 43 can be installed on the circuit board 41 of the same size. The smaller the area, the lower the overall utilization of the circuit board 41 .
  • the circuit board assembly 40 of the embodiment of the present application can increase the connection force between the frame board 42 and the circuit board 41 without increasing the width of the frame body 421 by providing the second welding portion 423 on the frame body 421, thereby Improve the stability and reliability of the connection between the frame board 42 and the circuit board 41 , and reduce the possibility of separation between the frame board 42 and the circuit board 41 when the electronic device 10 is dropped or bumped and subjected to uneven force.
  • circuit board assembly 40 provided in the embodiment of the present application will be further described below.
  • FIG. 6 schematically shows the exploded structure of the circuit board assembly 40 of the embodiment of the present application.
  • Fig. 7 schematically shows the structure of the frame plate 42 of the embodiment of the present application.
  • the circuit board assembly 40 of the embodiment of the present application is used in the electronic device 10 .
  • the circuit board assembly 40 includes a frame board 42 and a circuit board 41 .
  • the frame plate 42 is a plate-like structure having a predetermined thickness. Along the thickness direction X of the frame plate 42 , two circuit boards 41 are respectively disposed on both sides of the frame plate 42 , and the two circuit boards 41 are respectively connected to the frame plate 42 .
  • the frame board 42 is located between the two circuit boards 41 .
  • the frame plate 42 includes a frame body 421 , a first welding portion 422 and a second welding portion 423 .
  • the frame body 421 has two opposite surfaces along the thickness direction X. As shown in FIG.
  • the frame body 421 includes a middle receiving hole 421a penetrating through both surfaces along the thickness direction X.
  • the frame body 421 includes an outer wall 4211 and an inner wall 4212 oppositely disposed along the width direction. On the frame body 421, the inner wall 4212 faces the middle receiving hole 421a, while the outer wall 4211 faces away from the middle receiving hole 421a.
  • the area between the inner wall 4212 and the outer wall 4211 of the frame body 421 is a middle area 4213 .
  • the first welding portion 422 is disposed on the middle area 4213 of the frame body 421 .
  • At least one of the inner wall 4212 and the outer wall 4211 of the frame body 421 is provided with a receiving groove 4211a.
  • at least one of the inner wall 4212 and the outer wall 4211 of the frame body 421 is provided with a receiving groove 4211a, including only the inner wall 4212 is provided with the receiving groove 4211a, only the outer wall 4211 is provided with the receiving groove 4211a, and the inner wall 4212 and the outer wall 4211 are provided with the receiving groove 4211a.
  • FIG. 8 schematically shows a top view structure of a frame body 421 according to an embodiment of the present application.
  • the receiving groove 4211a has an opening facing away from the middle receiving hole 421a.
  • the receiving groove 4211a is provided on the inner wall 4212 of the frame body 421, the receiving groove 4211a has an opening facing the middle receiving hole 421a.
  • the receiving groove 4211a extends along the thickness direction X.
  • the accommodating groove 4211a may pass through two opposite surfaces of the frame body 421 along the thickness direction X. As shown in FIG.
  • the second welding portion 423 is disposed in the receiving groove 4211 a and connected to the frame body 421 .
  • the receiving groove 4211 a on the outer wall 4211 is provided with the second welding portion 423 correspondingly, the second welding portion 423 can be observed from the outside of the frame plate 42 .
  • the receiving groove 4211 a on the inner wall 4212 is provided with the second welding portion 423 correspondingly, the second welding portion 423 can be observed from the inner side of the frame plate 42 .
  • the circuit board 41 includes pads 411 .
  • the first welding portion 422 and the second welding portion 423 are respectively welded to corresponding pads 411 on the circuit board 41 .
  • the circuit board assembly 40 of the embodiment of the present application includes a frame board 42 and a circuit board 41 .
  • the frame plate 42 includes a frame body 421 , a first welding portion 422 located in the middle region 4213 , and a second welding portion 423 located on at least one of the outer wall 4211 and the inner wall 4212 .
  • the width of the frame body 421 can remain unchanged, the density of connection points formed by the first welding portion 422 and the second welding portion 423 on the frame body 421 is greater.
  • the circuit board 41 is connected to the frame plate 42 through the first welding portion 422 and the second welding portion 423, so that the edge area of the circuit board 41 and the frame plate 42 is in a connected state, and due to the connection between the circuit board 41 and the frame plate 42 The number of points increases, so that the connection force between the circuit board 41 and the frame board 42 is improved.
  • the first welding portion 422 and the second welding portion 423 between the circuit board 41 and the frame plate 42 can buffer the force at the same time, thereby effectively lowering the circuit board. 41 and the possibility of separation of the frame plate 42.
  • FIG. 10 schematically shows a partial cross-sectional structure of a circuit board assembly 40 according to an embodiment of the present application.
  • the first welding portion 422 and the second welding portion 423 of the frame plate 42 are respectively welded to the corresponding pads 411 on the circuit board 41 through the welding spots 60 .
  • the material of the first welding part 422 and the second welding part 423 may be copper or copper alloy.
  • the material of the pad 411 of the circuit board 41 may be copper or copper alloy.
  • solder paste is pre-printed on the first soldering portion 422 and the second soldering portion 423 .
  • Solder paste may include metallic tin and flux.
  • the circuit board 41 is then placed on one side of the frame board 42 and in contact with the solder paste.
  • the solder paste is heated and melted so that the first soldering portion 422 , the second soldering portion 423 and the pad 411 are all connected to the melted soldering paste.
  • the melted solder paste solidifies to form solder joints 60 , so that the circuit board 41 is connected to the frame board 42 through the solder joints 60 . Since the circuit board 41 is supported by the solder joints 60, a gap is formed between the surface of the circuit board 41 facing the frame plate 42 and the surface of the frame plate 42 facing the circuit board 41.
  • a welding point 60 is provided between the first welding portion 422 and the pad 411 , and a welding point 60 is provided between the second welding portion 423 and the pad 411 .
  • FIG. 11 schematically shows the top view structure of the frame body 421 of the embodiment of the present application.
  • the frame plate 42 is a ring structure, such as a rectangular structure.
  • more than two receiving grooves 4211a are provided on the outer wall 4211 of the frame body 421, and the more than two receiving grooves 4211a are evenly distributed, so that the distance between every two adjacent receiving grooves 4211a is equal.
  • the accommodating groove 4211a may be formed on the frame body 421 by machining, for example, the accommodating groove 4211a is formed on the frame body 421 by using a drill or a milling cutter.
  • the circumferential direction of the frame plate 42 refers to the direction surrounding the middle receiving hole 421a.
  • the number and positions of the second welding portions 423 are set in one-to-one correspondence with the number and positions of the receiving grooves 4211a.
  • more than two second welding portions 423 are evenly distributed. Therefore, after all the second welding portions 423 are welded to the corresponding pads 411 on the circuit board 41, it can help to improve the force balance of the circuit board 41 at various positions, and reduce the contact between the circuit board 41 and the frame plate 42 at different positions.
  • the unbalanced connection force may cause local warping of the circuit board 41 .
  • FIG. 13 schematically shows the top view structure of the frame plate 42 of the embodiment of the present application. 13 and 14, along the circumferential direction of the frame plate 42, more than two receiving grooves 4211a are provided on the inner wall 4212 of the frame body 421, and more than two receiving grooves 4211a are evenly distributed, so that every two adjacent The spacing between the receiving grooves 4211a is equal.
  • the accommodating groove 4211a may be formed on the frame body 421 by machining, for example, the accommodating groove 4211a is formed on the frame body 421 by using a drill or a milling cutter.
  • the number and positions of the second welding portions 423 are set in one-to-one correspondence with the number and positions of the receiving grooves 4211a.
  • FIG. 15 schematically shows a partial cross-sectional structure of a circuit board assembly 40 according to an embodiment of the present application.
  • the second welding portion 423 provided on the inner wall 4212 is connected to the corresponding pad 411 on the circuit board 41 through the solder joint 60 , so that the inner edge of the frame board 42 is connected to the circuit board 41 .
  • the first welding part 422 provided on the middle area 4213 and the second welding part 423 provided on the inner wall 4212 are both connected to the circuit board 41, thereby improving the connection strength between the circuit board 41 and the frame board 42, which is conducive to improving the strength of the circuit board. 41 and frame plate 42 connection stability and reliability.
  • Fig. 16 schematically shows the top view structure of the frame plate 42 of the embodiment of the present application.
  • the inner wall 4212 and the outer wall 4211 of the frame body 421 are provided with receiving grooves 4211a, so that the second welding part 423 is provided in each receiving groove 4211a, which is conducive to further improving the first welding part on the frame plate 42. 422 and the density of the connection points formed by the second welding portion 423.
  • the second welding portion 423 at the receiving groove 4211 a on the inner wall 4212 of the frame body 421 can be welded to the corresponding pad 411 on the circuit board 41 , so that the inner edge of the frame board 42 is connected to the circuit board 41 .
  • the second welding portion 423 at the receiving groove 4211 a on the outer wall 4211 of the frame body 421 can be welded to the corresponding pad 411 on the circuit board 41 , so that the outer edge of the frame board 42 is connected to the circuit board 41 . Therefore, both the inner edge and the outer edge of the frame plate 42 can be connected with the circuit board 41, which is conducive to further improving the connection force between the circuit board 41 and the frame plate 42, and improving the connection stability and stability of the circuit board 41 and the frame plate 42. reliability.
  • the number and position of the receiving grooves 4211a on the outer wall 4211 and the number and positions of the receiving grooves 4211a on the inner wall 4212 are set in a one-to-one correspondence, so that along the width direction of the frame plate 42, the receiving grooves 4211a on the outer wall 4211 and the receiving grooves 4211a on the outer wall 4211 The receiving groove 4211a on the inner wall 4212 is correspondingly provided.
  • the receiving groove 4211a on the outer wall 4211 and the receiving groove 4211a on the inner wall 4212 can be staggered mutually, so that along the width direction of the frame plate 42, one receiving groove 4211a on the outer wall 4211 and two receiving grooves 4211a on the inner wall 4212 The areas between the receiving grooves 4211a are arranged correspondingly.
  • the middle area 4213 of the frame body 421 is provided with a through hole 4211b.
  • the through hole 4211 b penetrates two opposite surfaces of the frame body 421 .
  • the first welding portion 422 is correspondingly disposed on the through hole 4211b.
  • the through hole 4211b is a circular hole.
  • the through hole 4211b may be formed on the frame body 421 by machining, for example, by drilling.
  • the middle region 4213 of the frame body 421 is provided with more than two rows of through holes 4211b.
  • Each through hole 4211b is correspondingly provided with a first welding portion 422 , so that more than two rows of first welding portions 422 are correspondingly formed.
  • More than two rows of through holes 4211b are arranged at intervals along the width direction of the frame plate 42 .
  • the outer wall 4211 of the frame body 421 is provided with a receiving groove 4211a
  • one receiving groove 4211a on the outer wall 4211 is provided corresponding to two through holes 4211b, so that One second welding portion 423 is provided corresponding to two first welding portions 422 .
  • one receiving groove 4211a on the inner wall 4212 corresponds to two through holes 4211b, so that a second welding part 423 is provided corresponding to the two first welding parts 422 .
  • connection point formed by the second soldering portion 423 and the pad 411 and the connection point formed by the first soldering portion 422 and the pad 411 The formed connection points form a triangular layout, which is beneficial to improve the connection stability between the circuit board 41 and the frame board 42 .
  • each of the two first welded portions 422 does not exceed the edge of the corresponding second welded portion 423 .
  • the number and position of the receiving grooves 4211 a on the outer wall 4211 correspond to the number and positions of the receiving grooves 4211 a on the inner wall 4212 .
  • the middle area 4213 of the frame plate 42 is provided with three rows of through holes 4211b.
  • the center of a row of through holes 4211 b near the outer wall 4211 is aligned with the center of a row of through holes 4211 b near the inner wall 4212 .
  • the centers of the row of through holes 4211b near the outer wall 4211 and the centers of the row of through holes 4211b in the middle are staggered from each other.
  • the centers of the row of through holes 4211b near the inner wall 4212 are also staggered from the centers of the row of through holes 4211b in the middle.
  • the first soldering portion 422 provided at a row of through holes 4211b near the outer wall 4211 and a row of through holes 4211b near the inner wall 4212 can be used as a non-functional pad, while the first soldering portion 422 provided at the row of through holes 4211b in the middle
  • the first soldering portion 422 may serve as a functional pad.
  • the number and position of the receiving grooves 4211 a on the outer wall 4211 correspond to the number and positions of the receiving grooves 4211 a on the inner wall 4212 .
  • the middle area 4213 of the frame plate 42 is provided with two rows of through holes 4211b.
  • the center of one row of through holes 4211 b is aligned with the center of the other row of through holes 4211 b.
  • the first soldering portion 422 disposed at one row of through holes 4211b may serve as a non-functional pad, and the first soldering portion 422 disposed at another row of through holes 4211b may serve as a functional soldering pad.
  • the accommodating groove 4211a includes a bottom surface 4211aa and a side surface 4211ab.
  • the bottom surface 4211aa of the receiving groove 4211a intersects with the side surface 4211ab.
  • the angle range between the bottom surface 4211aa and the side surface 4211ab of the receiving groove 4211a may be 90° to 110°.
  • the depth of the receiving groove 4211a may be, but not limited to, 0.2 mm.
  • the depth of the receiving groove 4211a refers to the vertical distance from the bottom surface 4211aa to the opening of the receiving groove 4211a.
  • the shape of the surface of the second welding portion 423 facing the bottom surface 4211aa matches the shape of the bottom surface 4211aa.
  • the shape of the surface of the second welding portion 423 facing the side 4211ab matches the shape of the side 4211ab. Therefore, the surface of the second welding part 423 facing the receiving groove 4211a can closely fit with the surface of the receiving groove 4211a, thereby improving the bonding force between the second welding part 423 and the surface of the receiving groove 4211a, reducing the second The separation between the welding portion 423 and the surface of the receiving groove 4211 a results in the possibility that the circuit board 41 cannot be connected to the frame plate 42 through the second welding portion 423 .
  • the surface of the second welding portion 423 facing away from the middle receiving hole 421 a includes a first concave surface 423 a , a second concave surface 423 b and a third concave surface 423 c connected together.
  • the regions corresponding to the first concave surface 423 a , the second concave surface 423 b and the third concave surface 423 c can be used to avoid the electronic device 43 .
  • the first concave surface 423 a , the second concave surface 423 b and the third concave surface 423 c are concave toward the middle region 4213 .
  • the second concave surface 423 b and the third concave surface 423 c are respectively located on two sides of the first concave surface 423 a.
  • the intersection area of the first concave surface 423a and the second concave surface 423b and the intersection area of the first concave surface 423a and the third concave surface 423c both exceed the opening of the receiving groove 4211a.
  • the area between the first concave surface 423a and the second concave surface 423b and the area between the first concave surface 423a and the third concave surface 423c is thinner, forming a sharper structure, which is easy to break when subjected to external impact.
  • the depth of depression of the second concave surface 423b and the depth of depression of the third concave surface 423c are both smaller than the depth of depression of the first concave surface 423a, thereby helping to increase the area between the first concave surface 423a and the second concave surface 423b and the area between the first concave surface 423a and the second concave surface 423a.
  • the size of the area between the three concave surfaces 423c reduces the possibility of breaking easily when subjected to external impact.
  • the first concave surface 423a, the second concave surface 423b and the third concave surface 423c are all arc surfaces.
  • the central angle corresponding to the first concave surface 423a is 60° to 120°.
  • Each of the first concave surface 423a, the second concave surface 423b and the third concave surface 423c has the same radius. Therefore, for example, when using drilling or milling to manufacture the first concave surface 423a, the second concave surface 423b and the third concave surface 423c, it is convenient to use a tool with a diameter for cutting, reducing the need to replace tools with different diameters. Possibility of complex process and low processing efficiency.
  • FIG. 19 schematically shows a partial cross-sectional structure of a circuit board assembly 40 according to an embodiment of the present application.
  • the outer wall 4211 and the second welding portion 423 on the inner wall 4212 are respectively connected to the corresponding pads 411 on the circuit board 41 through the solder joints 60, so that the outer edge of the frame plate 42 and the circuit board 41 and the inner edge Both realize connection with the circuit board 41.
  • the first welding part 422 provided on the middle area 4213 and the second welding part 423 provided on the outer wall 4211 and the inner wall 4212 are all connected to the circuit board 41, thereby improving the connection strength between the circuit board 41 and the frame board 42, which is beneficial to The connection stability and reliability of the circuit board 41 and the frame board 42 are improved.
  • Fig. 20 schematically shows the process of the manufacturing method of the frame plate 42 according to the embodiment of the present application.
  • the embodiment of the present application also provides a manufacturing method of the frame plate 42, the manufacturing method includes the following steps:
  • the copper-clad substrate 100 includes a copper-clad layer 101 and a dielectric layer 102, and the two sides of the dielectric layer 102 are respectively provided with a copper-clad layer 101;
  • a first copper layer 300 is formed on the inner wall of the first through hole 200, and the first copper layer 300 is electrically connected to the copper clad layer 101 on both sides;
  • An anti-electroplating film 600 is provided on the surface of the copper clad layer 101;
  • a second copper layer is formed on the inner wall of the second through hole 500 and the surface of the copper clad layer 101 by adopting a process of first electroless plating and then electroplating;
  • the copper-clad substrate 100 is cut to form a frame plate 42 of a predetermined shape by using a machining process, and after the processing is completed, the second through hole 500 and a part of the second copper layer 700 are cut and removed, and the first through hole 200 forms a through hole. 4211b, and the copper clad layer 101, the first copper layer 300 and the second copper layer 700 corresponding to the first through hole 200 form the first soldering portion 422, the rest of the second through hole 500 forms the receiving groove 4211a, and the second The copper clad layer 101 and the second copper layer 700 corresponding to the remaining part of the through hole 500 form the second soldering portion 423 .
  • an alkaline etching solution is used in the etching process to pattern the copper clad layer 101 and the second copper layer 700 on the surface of the copper clad layer 101 to form corresponding traces.
  • the contouring process for machining can be drilling or milling.
  • the predetermined shape of the frame plate 42 may be rectangular or square.
  • the method for manufacturing the frame plate 42 of the embodiment of the present application is used to manufacture the frame plate 42 of the above embodiment.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements.
  • plural herein means two or more.
  • the term “and/or” in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations.
  • the character "/" in this paper generally indicates that the contextual objects are an “or” relationship; in the formula, the character "/" indicates that the contextual objects are a "division" relationship.
  • sequence numbers of the above-mentioned processes do not mean the order of execution, and the order of execution of the processes should be determined by their functions and internal logic, and should not be used in the implementation of this application.
  • the implementation of the examples constitutes no limitation.

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Abstract

本申请实施例提供一种电路板组件以及电子设备。电路板组件用于电子设备。电路板组件至少包括框架板和电路板。框架板包括框架本体、第一焊接部和第二焊接部。框架本体具有中间容纳孔、面向中间容纳孔的内壁、背向中间容纳孔的外壁。框架本体上位于内壁和外壁之间的中间区域设置有第一焊接部。内壁和外壁中的至少一者上设置有容纳槽。容纳槽沿框架板自身的厚度方向延伸。第二焊接部设置于容纳槽并且与框架本体相连。沿厚度方向，两个电路板分别设置于框架板相对的两侧。电路板包括焊盘。第一焊接部和第二焊接部分别与对应的焊盘焊接。本申请实施例提供的电路板组件能够提高电路板和框架板之间的连接力，有效降低电路板和框架板发生分离的可能性。

Description

电路板组件以及电子设备
本申请要求于2021年09月23日提交中国国家知识产权局、申请号为202111117615.9、申请名称为“电路板组件以及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端技术领域，特别涉及一种电路板组件以及电子设备。
背景技术
随着电子产品向高密度封装方向发展，为了给电子设备中的电池和其它功能模块提供更大的设置空间，目前通常是将多个电路板叠置的方式进行设置。多个电路板堆叠的方式，可以将电子器件分散设置到各个电路板上，从而不需要增大承载电子器件的电路板的面积来设置所有的电子器件。
多个电路板叠置的方式是，通过框架板将相邻两个电路板相连。框架板和电路板焊接组装后形成电路板组件。不同的电路板之间可以通过框架板实现电连接，以实现数据信息交互。由于电路板和框架板为分体设计的两个结构件，在电子设备遇到跌落或碰撞等受力不均的场景时，电路板和框架板容易在连接处发生分离，造成电路板组件出现通信故障或无法正常使用的情况。
发明内容
本申请实施例提供一种电路板组件以及电子设备，能够提高电路板和框架板之间的连接力，有效降低电路板和框架板发生分离的可能性。
本申请第一方面提供一种电路板组件。电路板组件用于电子设备。电路板组件至少包括框架板和电路板。框架板包括框架本体、第一焊接部和第二焊接部。框架本体具有中间容纳孔、面向中间容纳孔的内壁、背向中间容纳孔的外壁。框架本体上位于内壁和外壁之间的中间区域设置有第一焊接部。内壁和外壁中的至少一者上设置有容纳槽。容纳槽沿框架板自身的厚度方向延伸。第二焊接部设置于容纳槽并且与框架本体相连。沿厚度方向，两个电路板分别设置于框架板相对的两侧。电路板包括焊盘。第一焊接部和第二焊接部分别与对应的焊盘焊接。
本申请实施例的电路板组件包括框架板和电路板。框架板包括框架本体、位于中间区域的第一焊接部以及位于外壁和内壁至少一者上的第二焊接部。在框架本体的宽度可以保持不变的情况下，设置于框架本体上的第一焊接部和第二焊接部所形成的连接点密度更大。电路板通过第一焊接部和第二焊接部与框架板实现连接，从而电路板与框架板的边缘区域处于连接状态，并且由于电路板和框架板之间的连接点增多，使得电路板和框架板之间的连接力得以提高。在电路板组件发生跌落或碰撞等受力不均的情况时，电路板和框架板之间的第一焊接部和第二焊接部可以同时缓冲作用力，从而有效降低电路板和框架板发生分离的可能性。
在一种可能的实施方式中，容纳槽包括底面和侧面。底面和侧面相交设置。第二焊接部面向底面的表面形状与底面的形状相匹配。第二焊接部面向侧面的表面形状与侧面的形状相匹配。第二焊接部面向容纳槽的表面可以与容纳槽的表面之间紧密贴合，从而有利于提高第二焊接部和容纳槽的表面之间的结合力，降低第二焊接部与容纳槽的表面发生分离而导致电路板不能通过第二焊接部与框架板相连的可能性。
在一种可能的实施方式中，容纳槽的底面和侧面之间的夹角范围可以是90°至110°。
在一种可能的实施方式中，容纳槽贯穿框架本体上沿厚度方向相对的两个表面。
在一种可能的实施方式中，第一焊接部和第二焊接部分别与电路板上对应的焊盘通过焊点焊接。
在一种可能的实施方式中，第二焊接部背向中间容纳孔的表面包括相连的第一凹面、第二凹面和第三凹面。第一凹面、第二凹面和第三凹面朝向中间区域凹陷。沿框架板的周向，第二凹面和第三凹面分别位于第一凹面的两侧。第一凹面和第二凹面相交区域以及第一凹面和第三凹面相交区域均超出容纳槽的开口。
在一种可能的实施方式中，第二凹面的凹陷深度和第三凹面的凹陷深度均小于第一凹面的凹陷深度。
在一种可能的实施方式中，第一凹面、第二凹面和第三凹面均为圆弧面。
在一种可能的实施方式中，第一凹面对应的圆心角为60°至120°。
在一种可能的实施方式中，第一凹面、第二凹面和第三凹面各自的半径相同。在使用钻削或铣削的方式加工制造第一凹面、第二凹面和第三凹面时，便于使用一种直径的刀具进行切削，降低因需要更换不同直径的刀具而导致加工工序复杂、加工效率低的可能性。
在一种可能的实施方式中，沿框架板的周向，两个以上的容纳槽均匀分布，并且两个以上的第二焊接部均匀分布。每相邻两个容纳槽之间的间距相等。第二焊接部的数量和位置与容纳槽的数量和位置一一对应设置。沿框架板的周向，两个以上的第二焊接部也均匀分布。因此，所有的第二焊接部与电路板上对应的焊盘焊接后，可以有利于提高电路板在各个位置的受力均衡性，降低电路板在不同的位置与框架板的连接力不均衡而导致电路板出现局部翘曲的可能性。
在一种可能的实施方式中，内壁和外壁均设置有容纳槽，从而在各个容纳槽设置第二焊接部，有利于进一步提高框架板上第一焊接部和第二焊接部所形成的连接点的密度。
在一种可能的实施方式中，外壁上的容纳槽的数量和位置与内壁上的容纳槽的数量和位置一一对应设置。
在一种可能的实施方式中，中间区域设置两排以上的贯通孔。每个贯通孔对应设置有第一焊接部。两排以上的贯通孔沿框架板的宽度方向间隔设置。靠近外壁的一排贯通孔中，外壁上的一个容纳槽对应两个贯通孔设置。靠近内壁的一排贯通孔中，内壁上的一个容纳槽对应两个贯通孔设置。
本申请实施例第二方面提供一种电子设备，其包括如上述的电路板组件。
电路板组件至少包括框架板和电路板。框架板包括框架本体、第一焊接部和第二 焊接部。框架本体具有中间容纳孔、面向中间容纳孔的内壁、背向中间容纳孔的外壁。框架本体上位于内壁和外壁之间的中间区域设置有第一焊接部。内壁和外壁中的至少一者上设置有容纳槽。容纳槽沿框架板自身的厚度方向延伸。第二焊接部设置于容纳槽并且与框架本体相连。沿厚度方向，两个电路板分别设置于框架板相对的两侧。电路板包括焊盘。第一焊接部和第二焊接部分别与对应的焊盘焊接。
在一种可能的实施方式中，容纳槽包括底面和侧面。底面和侧面相交设置。第二焊接部面向底面的表面形状与底面的形状相匹配。第二焊接部面向侧面的表面形状与侧面的形状相匹配。第二焊接部面向容纳槽的表面可以与容纳槽的表面之间紧密贴合，从而有利于提高第二焊接部和容纳槽的表面之间的结合力，降低第二焊接部与容纳槽的表面发生分离而导致电路板不能通过第二焊接部与框架板相连的可能性。
在一种可能的实施方式中，容纳槽的底面和侧面之间的夹角范围可以是90°至110°。
在一种可能的实施方式中，容纳槽贯穿框架本体上沿厚度方向相对的两个表面。
在一种可能的实施方式中，第一焊接部和第二焊接部分别与电路板上对应的焊盘通过焊点焊接。
在一种可能的实施方式中，第二焊接部背向中间容纳孔的表面包括相连的第一凹面、第二凹面和第三凹面。第一凹面、第二凹面和第三凹面朝向中间区域凹陷。沿框架板的周向，第二凹面和第三凹面分别位于第一凹面的两侧。第一凹面和第二凹面相交区域以及第一凹面和第三凹面相交区域均超出容纳槽的开口。
在一种可能的实施方式中，第二凹面的凹陷深度和第三凹面的凹陷深度均小于第一凹面的凹陷深度。
在一种可能的实施方式中，第一凹面、第二凹面和第三凹面均为圆弧面。
在一种可能的实施方式中，第一凹面对应的圆心角为60°至120°。
在一种可能的实施方式中，第一凹面、第二凹面和第三凹面各自的半径相同。在使用钻削或铣削的方式加工制造第一凹面、第二凹面和第三凹面时，便于使用一种直径的刀具进行切削，降低因需要更换不同直径的刀具而导致加工工序复杂、加工效率低的可能性。
在一种可能的实施方式中，沿框架板的周向，两个以上的容纳槽均匀分布，并且两个以上的第二焊接部均匀分布。每相邻两个容纳槽之间的间距相等。第二焊接部的数量和位置与容纳槽的数量和位置一一对应设置。沿框架板的周向，两个以上的第二焊接部也均匀分布。因此，所有的第二焊接部与电路板上对应的焊盘焊接后，可以有利于提高电路板在各个位置的受力均衡性，降低电路板在不同的位置与框架板的连接力不均衡而导致电路板出现局部翘曲的可能性。
在一种可能的实施方式中，内壁和外壁均设置有容纳槽，从而在各个容纳槽设置第二焊接部，有利于进一步提高框架板上第一焊接部和第二焊接部所形成的连接点的密度。
在一种可能的实施方式中，外壁上的容纳槽的数量和位置与内壁上的容纳槽的数量和位置一一对应设置。
在一种可能的实施方式中，中间区域设置两排以上的贯通孔。每个贯通孔对应设 置有第一焊接部。两排以上的贯通孔沿框架板的宽度方向间隔设置。靠近外壁的一排贯通孔中，外壁上的一个容纳槽对应两个贯通孔设置。靠近内壁的一排贯通孔中，内壁上的一个容纳槽对应两个贯通孔设置。
本申请实施例第三方面提供一种框架板的制造方法，该制造方法包括如下步骤：
提供覆铜基板，覆铜基板包括介电层和两侧的覆铜层。
在覆铜基板上钻孔形成第一通孔。
在第一通孔的内壁形成第一铜层，第一铜层电连接两侧的覆铜层。
使用树脂块填充第一铜层的中心孔。
在覆铜基板上钻孔形成第二通孔，第一通孔和第二通孔间隔设置。
在覆铜层的表面设置抗电镀膜。
采用先化学镀再电镀的工艺在第二通孔的内壁上以及覆铜层的表面上形成第二铜层。
去除抗电镀膜。
采用蚀刻工艺图案化覆铜层以及覆铜层表面上的第二铜层。
在蚀刻区域设置阻焊材料层。
采用机加工的外形加工工艺将覆铜基板切割形成预定形状的框架板。完成加工后，第二通孔和第二铜层的一部分被切割去除。第一通孔形成贯通孔，而第一通孔所对应的覆铜层、第一铜层和第二铜层形成第一焊接部。第二通孔剩余的部分形成容纳槽，而第二通孔剩余的部分所对应的覆铜层和第二铜层形成第二焊接部。
附图说明
图1为本申请一实施例提供的电子设备的结构示意图；
图2为本申请一实施例提供的电子设备的分解结构示意图；
图3为相关技术提供的电路板组件的分解结构示意图；
图4为图3所示实施例中的框架板的俯视结构示意图；
图5为图3所示实施例的电路板组件的剖视结构示意图；
图6为本申请一实施例的电路板组件的分解结构示意图；
图7为本申请一实施例提供的框架板的结构示意图；
图8为本申请一实施例提供的框架本体的俯视结构示意图；
图9为图8中A处放大图；
图10为本申请一实施例提供的电路板组件的剖视结构示意图；
图11为本申请一实施例提供的框架板的俯视结构示意图；
图12为图11中B处放大图；
图13为本申请又一实施例提供的框架板的俯视结构示意图；
图14为图13中C处放大图；
图15为本申请又一实施例提供的电路板组件的剖视结构示意图；
图16为本申请再一实施例提供的框架板的俯视结构示意图；
图17为图16中D处放大图；
图18为本申请另一实施例提供的框架板的局部结构示意图；
图19为本申请再一实施例提供的电路板组件的剖视结构示意图；
图20为本申请一实施例提供的框架板的制造方法的示意图。
附图标记说明：
10、电子设备；
20、显示组件；
30、中框；
40、电路板组件；
41、电路板；411、焊盘；
42、框架板；
421、框形本体；421a、中间容纳孔；4211、外壁；4211a、容纳槽；4211aa、底面；4211ab、侧面；4211b、贯通孔；4212、内壁；4213、中间区域；422、第一焊接部；
423、第二焊接部；423a、第一凹面；423b、第二凹面；423c、第三凹面；
43、电子器件；
50、后壳；
60、焊点；
100、覆铜基板；101、覆铜层；102、介电层；
200、第一通孔；
300、第一铜层；
400、树脂块；
500、第二通孔；
600、抗电镀膜；
700、第二铜层；
800、阻焊材料层；
X、厚度方向。
具体实施方式
图1示意性地显示了一实施例的电子设备10的结构。参见图1所示，本申请实施例提供一种电子设备10，该电子设备10可以为监控器、手持式无线通信设备、台式计算机、笔记本电脑(laptop)、平板电脑(Table)、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)等移动终端、固定终端或可折叠设备。
以下实施例为了方便说明，均是以电子设备10为手持式无线通信设备为例进行举例说明。手持式无线通信设备可以为手机。
图2示意性地显示了一实施例的电子设备10的分解结构。参见图2所示，电子设备10包括显示组件20、中框30、电路板组件40和后壳50。显示组件20具有用于显示图像信息的显示区域。显示区域背向中框30。在通电状态下，显示区域可以显示相应的图像信息。沿电子设备10的厚度方向，中框30设置于显示组件20和后壳50之 间。需要说明的是，电子设备10的厚度方向指的是显示组件20和后壳50的排列方向。电路板组件40设置于中框30和后壳50之间形成的空间内。电路板组件40可以设置于中框30面向后壳50的表面上。
图3示意性地显示了相关技术中的电路板组件40的分解结构。参见图3所示，电路板组件40可以包括电路板41以及电连接于电路板41上的多个电子器件43。
本申请中的电路板41可以是印制电路板(Printed Circuit Board，PCB)、柔性电路板(Flexible Printed Circuit，FPC)或集成电路(或称为芯片)。电路板41可以是单面板或双面板。单面板指的是电路板41的一侧设置有电子器件43。双面板指的是电路板41的两侧均设置有电子器件43。电路板41可以是射频(radio frequency，RF)板、应用处理器(application processor，AP)板。射频板可以但不限于用于承载射频芯片(radio frequencyintegrated circuit，RFIC)、射频功率放大器(radio frequency power amplifier，RFPA)和无线保真(wireless fidelity，WIFI)芯片等。应用处理器板例如可以但不限于用于承载片上系统(system on chip，SOC)元件、双倍数据率(double data rate，DDR)存储器、主电源管理芯片(power management unit，PMU)和辅电源管理芯片等。
在例如电子设备10厚度较小，但显示组件20较大的情况下，电路板41可以具有较大的横向尺寸，从而可以选择使用一个电路板41，并且将固定数量的电子器件43设置于电路板41上。横向尺寸指的是与电子设备10的厚度方向相垂直的方向上测量的尺寸。如果电子器件43的数量较多、体积较大，使用一个电路板41也无法容纳所有电子器件43时，需要优化电路板组件40的结构，例如将多个电路板41沿电子设备10的厚度方向堆叠设置，并且将电子器件43设置于不同的电路板41上，从而可以在电子设备10的厚度方向充分利用电子设备10的内部空间，以容纳更多、更大的电子器件43。
图4示意性地显示了图3所示的框架板的俯视结构。图5示意性地显示了图3所示的电路板组件40的局部剖视结构。参见图4和图5所示，相关技术中，电路板组件40包括电路板41和框架板42。沿框架板42的厚度方向X，两个电路板41和框架板42堆叠设置。两个电路板41之间设置框架板42。两个电路板41分别连接于框架板42，从而使得两个电路板41之间保持预定距离，彼此不发生位置干涉。两个电路板41之间也可以通过框架板42实现电连接，以使得两个电路板41之间可以相互传输数据信息。框架板42整体呈环形结构，从而框架板42包括中间容纳孔421a。示例性地，框架板42可以呈多边形结构，例如矩形结构。两个电路板41与框架板42相连后，两个电路板41上的电子器件43可以位于中间容纳孔421a内，避免框架板42和电子器件43发生位置干涉。框架板42的厚度需要保证两个电路板41上位于中间容纳孔421a中的电子器件43彼此不发生接触。
在一些可实现的方式中，框架板42包括框架本体421和第一焊接部422。沿框架板42的宽度方向，框架本体421具有中间容纳孔421a以及相对的外壁4211和内壁4212。需要说明的是，框架本体421的外壁4211指的是框架本体421上背向中间容纳孔421a的区域。框架本体421的内壁4212指的是框架本体421上面向中间容纳孔421a的区域。框架板42的宽度方向指的是从外壁4211到内壁4212的方向。框架本体421还具有位于外壁4211和内壁4212之间的中间区域4213。框架本体421的材料为绝缘 材料，例如酚醛树脂、环氧树脂或聚四氟乙烯。第一焊接部422设置于框架本体421的中间区域4213。第一焊接部422与外壁4211之间保持预定距离。第一焊接部422与内壁4212之间也保持预定距离。沿框架板42的厚度方向X，第一焊接部422显露于框架本体421相对的两个表面。
电路板41可以通过焊点与第一焊接部422焊接。焊点的形状可以但不限于是球形、椭球形、柱形或圆台形。第一焊接部422包括功能性焊盘和非功能性焊盘。功能性焊盘可以起到电连接作用和机械固定作用。两个电路板41与框架板42连接后，两个电路板41可以通过功能性焊盘相互传输电信号。非功能性焊盘可以起到机械固定作用，但两个电路板41不能通过非功能性焊盘相互传输电信号。
在一些可实现的方式中，框架本体421靠近外壁4211或者内壁4212的区域设置非功能性焊盘。示例性地，框架本体421为环形结构。框架本体421的中间区域4213上可以设置一圈靠近外壁4211的非功能性焊盘和一圈靠近内壁4212的非功能性焊盘，而在两圈非功能性焊盘之间设置一圈功能性焊盘。
电路板组件40中的框架板42和电路板41的连接稳定性，影响着电路板组件40的性能和使用寿命。例如，在电子设备10发生跌落或碰撞等受力不均的情况时，电路板组件40中的框架板42和电路板41的连接处不能出现断裂分离的情况。如果框架板42和电路板41的连接处发生断裂分离的情况，将导致电路板组件40发生故障或无法正常使用。然而，由于相关技术中，电路板41通过框架板42的中间区域4213上设置的第一焊接部422与框架板42实现连接，而电路板41与框架板42的外侧边缘或内侧边缘处于无连接状态，因此在电子设备10发生跌落或碰撞时，电路板41和框架板42会共同对第一焊接部422施加剪切力或拉伸力，使得第一焊接部422和焊点或者焊盘和焊点的连接处需要承载较大的外部作用力，从而容易导致电路板41和第一焊接部422发生分离的情况或者框架板42和第一焊接部422发生分离的情况。在一些相关技术中，为了提高框架板42和电路板41的连接强度，适当增大框架本体421的宽度，以此可以在框架本体421上设置更多数量的第一焊接部422，从而增大电路板41和框架板42之间的连接力。需要说明的是，连接力指的是使电路板41和框架板42分离时所需要克服的作用力。使电路板41和框架板42分离时所需要的作用力指的是沿框架板42的厚度方向X，对电路板41施加远离框架板42方向并使得电路板41和框架板42发生分离时所需要的的拉应力。然而，由于电路板41上与框架板42相连接的区域不能设置电子器件43，因此框架本体421自身的宽度设计的较大时，会导致同样尺寸的电路板41上可以安装电子器件43的区域面积变小，造成电路板41整体利用率下降。
本申请实施例的电路板组件40通过在框架本体421上设置第二焊接部423，可以在不增加框架本体421的宽度情况下，增大框架板42和电路板41之间的连接力，从而提高框架板42和电路板41的连接稳定性和可靠性，降低在电子设备10发生跌落或碰撞等受力不均的情况时，框架板42和电路板41发生分离的可能性。
下面进一步对本申请实施例提供的电路板组件40的实现方式进行阐述。
图6示意性地显示了本申请实施例的电路板组件40的分解结构。图7示意性地显示了本申请实施例的框架板42的结构。参见图6和图7所示，本申请实施例的电路板组件40用于电子设备10。电路板组件40包括框架板42和电路板41。框架板42为具 有预定厚度的板状结构。沿框架板42的厚度方向X，两个电路板41分别设置于框架板42的两侧，并且两个电路板41分别连接于框架板42。框架板42位于两个电路板41之间。框架板42包括框架本体421、第一焊接部422和第二焊接部423。框架本体421具有沿厚度方向X相对的两个表面。框架本体421包括沿厚度方向X贯穿两个表面的中间容纳孔421a。框架本体421包括沿宽度方向相对设置的外壁4211和内壁4212。框架本体421上，内壁4212面向中间容纳孔421a，而外壁4211背向中间容纳孔421a。框架本体421的内壁4212和外壁4211之间的区域为中间区域4213。第一焊接部422设置于框架本体421的中间区域4213。框架本体421的内壁4212和外壁4211中的至少一者上设置有容纳槽4211a。需要说明的是，框架本体421的内壁4212和外壁4211中的至少一者上设置有容纳槽4211a包括仅内壁4212上设置容纳槽4211a、仅外壁4211上设置容纳槽4211a以及内壁4212和外壁4211上同时设置容纳槽4211a的可实施方式。图8示意性地显示了本申请一实施例的框架本体421的俯视结构。参见图8和图9所示，框架本体421的外壁4211上设置容纳槽4211a时，容纳槽4211a具有背向中间容纳孔421a的开口。框架本体421的内壁4212上设置容纳槽4211a时，容纳槽4211a具有面向中间容纳孔421a的开口。容纳槽4211a沿厚度方向X延伸。示例性地，容纳槽4211a可以贯穿框架本体421上沿厚度方向X相对的两个表面。
第二焊接部423设置于容纳槽4211a并且与框架本体421相连。在外壁4211上的容纳槽4211a对应设置第二焊接部423时，从框架板42的外侧可以观察到第二焊接部423。在内壁4212上的容纳槽4211a对应设置第二焊接部423时，从框架板42的内侧可以观察到第二焊接部423。电路板41包括焊盘411。第一焊接部422和第二焊接部423分别与电路板41上对应的焊盘411焊接。
本申请实施例的电路板组件40包括框架板42和电路板41。框架板42包括框架本体421、位于中间区域4213的第一焊接部422以及位于外壁4211和内壁4212至少一者上的第二焊接部423。在框架本体421的宽度可以保持不变的情况下，设置于框架本体421上的第一焊接部422和第二焊接部423所形成的连接点密度更大。电路板41通过第一焊接部422和第二焊接部423与框架板42实现连接，从而电路板41与框架板42的边缘区域处于连接状态，并且由于电路板41和框架板42之间的连接点增多，使得电路板41和框架板42之间的连接力得以提高。在电路板组件40发生跌落或碰撞等受力不均的情况时，电路板41和框架板42之间的第一焊接部422和第二焊接部423可以同时缓冲作用力，从而有效降低电路板41和框架板42发生分离的可能性。
图10示意性地显示了本申请一实施例的电路板组件40的局部剖视结构。参见图10所示，框架板42的第一焊接部422和第二焊接部423分别与电路板41上对应的焊盘411通过焊点60焊接。示例性地，第一焊接部422和第二焊接部423的材料可以是铜或铜合金。电路板41的焊盘411的材料可以是铜或铜合金。需要将电路板41和框架板42连接时，预先在第一焊接部422和第二焊接部423上预先印刷焊膏。焊膏可以包括金属锡和助焊剂。然后将电路板41设置于框架板42的一侧并且与焊膏接触。加热熔化焊膏，以使第一焊接部422、第二焊接部423和焊盘411均与熔化后的焊膏相连。熔化后的焊膏固化后形成焊点60，从而电路板41通过焊点60与框架板42实现连接。由于电路板41受到焊点60支撑，因此电路板41面向框架板42的表面和框架 板42面向电路板41的表面之间形成有间隙。示例性地，沿厚度方向X，第一焊接部422和焊盘411之间设置焊点60，而第二焊接部423和焊盘411之间设置焊点60。
图11示意性地显示了本申请实施例的框架本体421的俯视结构。参见图11和图12所示，框架板42为环形结构，例如矩形结构。沿框架板42的周向，框架本体421的外壁4211上设置两个以上的容纳槽4211a，并且两个以上的容纳槽4211a均匀分布，使得每相邻两个容纳槽4211a之间的间距相等。示例性地，可以采用机加工的方式在框架本体421上加工形成容纳槽4211a，例如采用钻具或铣刀在框架本体421上加工形成容纳槽4211a。需要说明的是，框架板42的周向指的是环绕中间容纳孔421a的方向。第二焊接部423的数量和位置与容纳槽4211a的数量和位置一一对应设置。沿框架板42的周向，两个以上的第二焊接部423也均匀分布。因此，所有的第二焊接部423与电路板41上对应的焊盘411焊接后，可以有利于提高电路板41在各个位置的受力均衡性，降低电路板41在不同的位置与框架板42的连接力不均衡而导致电路板41出现局部翘曲的可能性。
图13示意性地显示了本申请实施例的框架板42的俯视结构。参见图13和图14所示，沿框架板42的周向，框架本体421的内壁4212上设置两个以上的容纳槽4211a，并且两个以上的容纳槽4211a均匀分布，使得每相邻两个容纳槽4211a之间的间距相等。示例性地，可以采用机加工的方式在框架本体421上加工形成容纳槽4211a，例如采用钻具或铣刀在框架本体421上加工形成容纳槽4211a。第二焊接部423的数量和位置与容纳槽4211a的数量和位置一一对应设置。沿框架板42的周向，两个以上的第二焊接部423也均匀分布。因此，所有的第二焊接部423与电路板41上对应的焊盘411焊接后，可以有利于提高电路板41在各个位置的受力均衡性，降低电路板41在不同的位置与框架板42的连接力不均衡而导致电路板41出现局部翘曲的可能性。
图15示意性地显示了本申请一实施例的电路板组件40的局部剖视结构。参见图15所示，内壁4212上设置的第二焊接部423通过焊点60与电路板41上对应的的焊盘411相连，从而框架板42的内侧边缘和电路板41实现连接。中间区域4213上设置的第一焊接部422和内壁4212上设置的第二焊接部423均与电路板41相连，从而提高了电路板41和框架板42之间的连接强度，有利于提高电路板41和框架板42的连接稳定性和可靠性。
图16示意性地显示了本申请实施例的框架板42的俯视结构。参见图16和图17所示，框架本体421的内壁4212和外壁4211上均设置容纳槽4211a，从而在各个容纳槽4211a设置第二焊接部423，有利于进一步提高框架板42上第一焊接部422和第二焊接部423所形成的连接点的密度。框架本体421的内壁4212上容纳槽4211a处的第二焊接部423可以与电路板41上对应的焊盘411焊接，从而使得框架板42的内侧边缘与电路板41实现连接。框架本体421的外壁4211上容纳槽4211a处的第二焊接部423可以与电路板41上对应的焊盘411焊接，从而使得框架板42的外侧边缘与电路板41实现连接。因此，框架板42的内侧边缘和外侧边缘均可以与电路板41实现连接，有利于进一步提高电路板41和框架板42之间的连接力，提高电路板41和框架板42的连接稳定性和可靠性。
在一些示例中，外壁4211上的容纳槽4211a的数量和位置与内壁4212上的容纳 槽4211a的数量和位置一一对应设置，使得沿框架板42的宽度方向，外壁4211上的容纳槽4211a与内壁4212上的容纳槽4211a对应设置。在另一些示例中，外壁4211上的容纳槽4211a和内壁4212上的容纳槽4211a可以相互错开设置，使得沿框架板42的宽度方向，外壁4211上的一个容纳槽4211a与内壁4212上的两个容纳槽4211a之间的区域对应设置。
参见图17所示，框架本体421的中间区域4213设置贯通孔4211b。沿框架板42的厚度方向X，贯通孔4211b贯穿框架本体421上相对的两个表面。第一焊接部422对应设置于贯通孔4211b。示例性地，贯通孔4211b为圆形孔。示例性地，可以采用机加工方式在框架本体421上加工形成贯通孔4211b，例如采用钻削方式进行加工。
在一些示例中，框架本体421的中间区域4213设置两排以上的贯通孔4211b。每个贯通孔4211b对应设置有第一焊接部422，从而对应地形成两排以上的第一焊接部422。两排以上的贯通孔4211b沿框架板42的宽度方向间隔设置。示例性地，框架本体421的外壁4211上设置有容纳槽4211a的实施例中，靠近外壁4211的一排贯通孔4211b中，外壁4211上的一个容纳槽4211a对应两个贯通孔4211b设置，从而使得一个第二焊接部423对应两个第一焊接部422设置。框架本体421的内壁4212上设置有容纳槽4211a的实施例中，靠近内壁4212的一排贯通孔4211b中，内壁4212上的一个容纳槽4211a对应两个贯通孔4211b设置，从而一个第二焊接部423对应两个第一焊接部422设置。一个第二焊接部423对应两个第一焊接部422分别与电路板41对应的焊盘411连接后，第二焊接部423与焊盘411形成的连接点以及第一焊接部422与焊盘411形成的连接点形成三角形布局，从而有利于提高电路板41和框架板42的连接稳定性。在框架板42的周向上，两个第一焊接部422各自不超出对应的第二焊接部423的边缘。
在一些示例中，参见图17所示，外壁4211上的容纳槽4211a的数量和位置与内壁4212上的容纳槽4211a的数量和位置一一对应设置。框架板42的中间区域4213设置三排贯通孔4211b。沿框架板42的宽度方向，靠近外壁4211的一排贯通孔4211b的中心与靠近内壁4212的一排贯通孔4211b的中心对齐设置。靠近外壁4211的一排贯通孔4211b的中心与位于中间的一排贯通孔4211b的中心彼此错开设置。同样地，靠近内壁4212的一排贯通孔4211b的中心也与位于中间的一排贯通孔4211b的中心彼此错开设置。示例性地，靠近外壁4211的一排贯通孔4211b以及靠近内壁4212的一排贯通孔4211b处设置的第一焊接部422可以作为非功能焊盘，而位于中间的一排贯通孔4211b处设置的第一焊接部422可以作为功能焊盘。
在另一些示例中，参见图18所示，外壁4211上的容纳槽4211a的数量和位置与内壁4212上的容纳槽4211a的数量和位置一一对应设置。框架板42的中间区域4213设置两排贯通孔4211b。沿框架板42的宽度方向，一排贯通孔4211b的中心与另一排贯通孔4211b的中心对齐设置。示例性地，一排贯通孔4211b处设置的第一焊接部422可以作为非功能焊盘，另一排贯通孔4211b处设置的第一焊接部422可以作为功能焊盘。
参见图9和图17所示，容纳槽4211a包括底面4211aa和侧面4211ab。容纳槽4211a的底面4211aa和侧面4211ab相交设置。示例性地，容纳槽4211a的底面4211aa和侧 面4211ab之间的夹角范围可以是90°至110°。容纳槽4211a的深度可以但不限于为0.2毫米。容纳槽4211a的深度指的是底面4211aa至容纳槽4211a的开口的垂直距离。第二焊接部423面向底面4211aa的表面形状与底面4211aa的形状相匹配。第二焊接部423面向侧面4211ab的表面形状与侧面4211ab的形状相匹配。因此，第二焊接部423面向容纳槽4211a的表面可以与容纳槽4211a的表面之间紧密贴合，从而有利于提高第二焊接部423和容纳槽4211a的表面之间的结合力，降低第二焊接部423与容纳槽4211a的表面发生分离而导致电路板41不能通过第二焊接部423与框架板42相连的可能性。
参见图17所示，第二焊接部423背向中间容纳孔421a的表面包括相连的第一凹面423a、第二凹面423b和第三凹面423c。第一凹面423a、第二凹面423b和第三凹面423c所对应的区域可以用于避让电子器件43。第一凹面423a、第二凹面423b和第三凹面423c朝向中间区域4213凹陷。沿框架板42的周向，第二凹面423b和第三凹面423c分别位于第一凹面423a的两侧。第一凹面423a和第二凹面423b相交区域以及第一凹面423a和第三凹面423c相交区域均超出容纳槽4211a的开口。在一些示例中，第一凹面423a、第二凹面423b和第三凹面423c的凹陷深度相同时，第一凹面423a和第二凹面423b之间的区域以及第一凹面423a和第三凹面423c之间的区域的尺寸较薄，形成比较尖锐的结构，从而受到外力冲击时容易发生折断。第二凹面423b的凹陷深度和第三凹面423c的凹陷深度均小于第一凹面423a的凹陷深度，从而有利于增大第一凹面423a和第二凹面423b之间的区域以及第一凹面423a和第三凹面423c之间的区域的尺寸，降低受到外力冲击时容易发生折断的可能性。在一些示例中，第一凹面423a、第二凹面423b和第三凹面423c均为圆弧面。示例性地，第一凹面423a对应的圆心角为60°至120°。第一凹面423a、第二凹面423b和第三凹面423c各自的半径相同。因此，例如在使用钻削或铣削的方式加工制造第一凹面423a、第二凹面423b和第三凹面423c时，便于使用一种直径的刀具进行切削，降低因需要更换不同直径的刀具而导致加工工序复杂、加工效率低的可能性。
图19示意性地显示了本申请实施例的电路板组件40的局部剖视结构。参见图19所示，外壁4211以及内壁4212上的第二焊接部423各自通过焊点60与电路板41上对应的的焊盘411相连，从而框架板42的外侧边缘和电路板41以及内侧边缘和电路板41之间均实现连接。中间区域4213上设置的第一焊接部422以及外壁4211和内壁4212上设置的第二焊接部423均与电路板41相连，从而提高了电路板41和框架板42之间的连接强度，有利于提高电路板41和框架板42的连接稳定性和可靠性。
图20示意性地显示了本申请实施例的框架板42的制造方法的过程。参见图20所示，本申请实施例还提供一种框架板42的制造方法，该制造方法包括如下步骤：
提供覆铜基板100，覆铜基板100包括覆铜层101和介电层102，介电层102的两侧分别设置有覆铜层101；
在覆铜基板100上钻孔形成第一通孔200；
在第一通孔200的内壁形成第一铜层300，第一铜层300电连接两侧的覆铜层101；
使用树脂块400填充第一铜层300的中心孔；
在覆铜基板100上钻孔形成第二通孔500，第一通孔200和第二通孔500间隔设 置；
在覆铜层101的表面设置抗电镀膜600；
采用先化学镀再电镀的工艺在第二通孔500的内壁上以及覆铜层101的表面上形成第二铜层；
去除抗电镀膜600；
采用蚀刻工艺图案化覆铜层101以及覆铜层101表面上的第二铜层700；
在蚀刻区域设置阻焊材料层800；
采用机加工的外形加工工艺将覆铜基板100切割形成预定形状的框架板42，完成加工后，第二通孔500和第二铜层700的一部分被切割去除，第一通孔200形成贯通孔4211b，而第一通孔200所对应的覆铜层101、第一铜层300和第二铜层700形成第一焊接部422，第二通孔500剩余的部分形成容纳槽4211a，而第二通孔500剩余的部分所对应的覆铜层101和第二铜层700形成第二焊接部423。
在一些可实现的方式中，蚀刻工艺中使用碱性蚀刻液图案化覆铜层101以及覆铜层101表面上的第二铜层700，以形成相应的走线。机加工的外形加工工艺可以是钻削或铣削。预定形状的框架板42可以是长方形或正方形。
在一些可实现的方式中，本申请实施例的框架板42的制造方法用于制造上述实施例的框架板42。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
在本申请实施例或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。在本申请实施例的描述中，“多个”的含义是两个或两个以上，除非是另有精确具体地规定。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请实施例的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本文中的术语“多个”是指两个或两个以上。本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系；在公式中，字符“/”，表示前后关联对象是一种“相除”的关系。
可以理解的是，在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区 分，并不用来限制本申请的实施例的范围。
可以理解的是，在本申请的实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请的实施例的实施过程构成任何限定。

Claims (15)

  1. 一种电路板组件，用于电子设备，其特征在于，至少包括：
    框架板，包括框架本体、第一焊接部和第二焊接部，所述框架本体具有中间容纳孔、面向所述中间容纳孔的内壁、背向所述中间容纳孔的外壁，所述框架本体上位于所述内壁和所述外壁之间的中间区域设置有所述第一焊接部，所述内壁和所述外壁中的至少一者上设置有容纳槽，所述容纳槽沿所述框架板自身的厚度方向延伸，所述第二焊接部设置于所述容纳槽并且与所述框架本体相连；
    电路板，沿所述厚度方向，两个所述电路板分别设置于所述框架板相对的两侧，所述电路板包括焊盘，所述第一焊接部和所述第二焊接部分别与对应的所述焊盘焊接。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述容纳槽包括底面和侧面，所述底面和所述侧面相交设置，所述第二焊接部面向所述底面的表面形状与所述底面的形状相匹配，所述第二焊接部面向所述侧面的表面形状与所述侧面的形状相匹配。
  3. 根据权利要求2所述的电路板组件，其特征在于，所述容纳槽的所述底面和所述侧面之间的夹角范围可以是90°至110°。
  4. 根据权利要求1至3任一项所述的电路板组件，其特征在于，所述容纳槽贯穿所述框架本体上沿所述厚度方向相对的两个表面。
  5. 根据权利要求1至4任一项所述的电路板组件，其特征在于，所述第一焊接部和所述第二焊接部分别与所述电路板上对应的所述焊盘通过焊点焊接。
  6. 根据权利要求1至5任一项所述的电路板组件，其特征在于，所述第二焊接部背向所述中间容纳孔的表面包括相连的第一凹面、第二凹面和第三凹面，所述第一凹面、所述第二凹面和所述第三凹面朝向所述中间区域凹陷，沿所述框架板的周向，所述第二凹面和所述第三凹面分别位于所述第一凹面的两侧，所述第一凹面和所述第二凹面相交区域以及所述第一凹面和所述第三凹面相交区域均超出所述容纳槽的开口。
  7. 根据权利要求6所述的电路板组件，其特征在于，所述第二凹面的凹陷深度和第三凹面的凹陷深度均小于所述第一凹面的凹陷深度。
  8. 根据权利要求6或7所述的电路板组件，其特征在于，所述第一凹面、所述第二凹面和所述第三凹面均为圆弧面。
  9. 根据权利要求8所述的电路板组件，其特征在于，所述第一凹面对应的圆心角为60°至120°。
  10. 根据权利要求8或9所述的电路板组件，其特征在于，所述第一凹面、所述第二凹面和所述第三凹面各自的半径相同。
  11. 根据权利要求1至10任一项所述的电路板组件，其特征在于，沿所述框架板的周向，两个以上的所述容纳槽均匀分布，并且两个以上的所述第二焊接部均匀分布。
  12. 根据权利要求1至11任一项所述的电路板组件，其特征在于，所述内壁和所述外壁均设置有所述容纳槽。
  13. 根据权利要求12所述的电路板组件，其特征在于，所述外壁上的所述容纳槽的数量和位置与所述内壁上的所述容纳槽的数量和位置一一对应设置。
  14. 根据权利要求12或13所述的电路板组件，其特征在于，所述中间区域设置两 排以上的贯通孔，每个所述贯通孔对应设置有所述第一焊接部，两排以上的所述贯通孔沿所述框架板的宽度方向间隔设置，靠近所述外壁的一排所述贯通孔中，所述外壁上的一个所述容纳槽对应两个所述贯通孔设置，靠近所述内壁的一排所述贯通孔中，所述内壁上的一个所述容纳槽对应两个所述贯通孔设置。
  15. 一种电子设备，其特征在于，包括如权利要求1至14任一项所述的电路板组件。
PCT/CN2022/113353 2021-09-23 2022-08-18 电路板组件以及电子设备 Ceased WO2023045642A1 (zh)

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