WO2023050090A1 - A headband for a headset - Google Patents
A headband for a headset Download PDFInfo
- Publication number
- WO2023050090A1 WO2023050090A1 PCT/CN2021/121456 CN2021121456W WO2023050090A1 WO 2023050090 A1 WO2023050090 A1 WO 2023050090A1 CN 2021121456 W CN2021121456 W CN 2021121456W WO 2023050090 A1 WO2023050090 A1 WO 2023050090A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- foam
- headband
- region
- carrier
- padding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/033—Headphones for stereophonic communication
- H04R5/0335—Earpiece support, e.g. headbands or neckrests
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/105—Earpiece supports, e.g. ear hooks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1008—Earpieces of the supra-aural or circum-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
Definitions
- Headsets may be used in various settings and users may be wearing the headsets during long time spans. Due to many different types of head shapes and head sizes, it is difficult to have uniform pressure distribution on all head types. Normally, the top points of a user’s head share more pressure than other areas and therefore the user could feel more pressure at the top points. Additionally, the human head is most pain sensitive in the top point due to connection between skull bones. Therefore, users typically have pain points on the head top after wearing a headset for shorter or longer time spans.
- the headband of the present invention may be used for an audio headset, i.e. a headset used for audio purposes, and/or it may be used for a noise-attenuating headset which provides a passive noise attenuation capability.
- the carrier may be made of a metal material, such as sheet metal, a plastic material, or even wood.
- the carrier may be machined by a machine, cast in a mold, made by stamping and bending, or even hand made. Regardless of the material selection, the carrier may have a thickness and a width which provide good mechanical stability and flexibility at the same time.
- the carrier may be configured to provide a basic clamping force exerted to the head of the user. The basic clamping force is manipulated by controlling the thickness and cross section of the carrier.
- the provided carrier may be produced such that it has a very small variance and deviation from a modelled carrier.
- the carrier may have a width anywhere between 1 cm and 3 cm.
- the first end and the second end may be attached to the at least one earcup, and/or to the microphone, and/or to the stabilization element abutting the side of the user’s head to ensure proper positioning of the headband.
- the headband is formed by coupling the foam padding to the carrier.
- the foam padding may be disposed along a length of an inner surface of the carrier.
- the foam padding may be disposed along the entire length of the carrier, i.e. from the first carrier end to the second carrier end, or it may extend over a portion of the side segments and over the central carrier region.
- the carrier and the foam padding may be permanently joined together to make a single piece.
- leather, leatherette, fabric, such as woven fabric, silicone rubber, or elastomers like TPU or TPE may be used to contain the foam padding and to connect it to the carrier.
- the carrier provides a desired rigidity to the headband while the foam padding provides comfort for the user as it is configured to abut the wearer’s head when the headband is worn by the wearer.
- the foam padding in the central foam region has a lower hardness than the foam padding in the peripheral foam region.
- the foam padding in the central foam region is softer than in the rest of the foam padding.
- the softer foam padding is prone to larger deformation and compression and thereby helps in eliminating pain points which typically occur in the top of the user’s head. Compression of the softer padding in the central region is partly controlled by the harder padding region to achieve optimal padding deformation and thereby result in optimal comfort for the user.
- a difference in hardness of the foam padding can be achieved in a number of different ways which will be described in details further below.
- the central region may have a first foam hardness and the peripheral foam region may have a second foam hardness, wherein the first foam hardness being lower than the second foam hardness.
- the foam padding in the central foam region having lower hardness than the padding outside of this central region is softer and therefore has an improved foam deformation resulting in a larger touch area compared to a solution where the padding has a constant hardness. Improved deformation of the padding also ensures that the padding better accommodates a head curve. The larger the touch area is, the better the pressure distribution is and the better distribution of a load on the user’s head is. If the foam padding is formed from a foam of a uniform hardness, the headband will cause pain points on the head top no matter how soft the foam is due to largest deformation of foam in the top point. Also, too soft foams may compress too much so that the head is touching the carrier what can create even bigger discomfort.
- the headband according to the present invention is easy to manufacture as it utilizes commercially available foam which are arranged on the carrier. Such a simple manufacturing saves manufacturing time and expenses as there is no need for further assembling steps in a product line.
- the present invention provides a lightweight headband with a soft padding which thereby provides a great comfort to potential users. Simultaneously, a sleek design, normally desired by a majority of users, can be achieved.
- the headband according to the present invention provides a uniform clamping force uniformly distributed over the user’s ears and the top of the head achieved by the carrier. The headband is therefore easy to use as the user does not have to adjust the tightness of the headband all the time.
- having the foam pad as a part of the headband provides a headband in which a pressure to the user’s head is uniformly distributed along the contact between the user’s head and the headband, and in particular in which there are no prominent pain points around the top of the head.
- the foam padding hardness changes gradually from the midpoint of the central foam region towards the peripheral foam region.
- the gradual change is typically a gradual increase of the hardness. It is an advantage of the present invention to have the foam padding which is softest in the midpoint which would typically abut the user’s head and to then have a gradual transition to a harder foam padding as the harder foam padding would not allow the soft padding to completely compress so that the user can feel the carrier which is normally hard.
- the cross-section of the central foam region perpendicular to the length of the headband has a substantially trapezoid-like shape.
- the central foam region may have a substantially annulus cross-section.
- the central foam region may be a curved trapezoid in the cross-section.
- the trapezoidal cross-section provides a smooth transition in hardness from the top of the headband and results in improved wearing comfort due to equalized pressure distribution along the foam padding, and in particular along the central foam region.
- the cross-section of the central foam region perpendicular to the length of the headband has a substantially triangular shape.
- An angle of the trapezoid or triangle may be below 90° and above 15°, such as 75°, such as 65°, such as 60°, such as 50°, such as 45°, such as 30°.
- the length of the central foam region closer to the carrier is shorter than the length of the central foam region abutting the wearer’s head when the headband is worn by the wearer.
- the foam padding has a tapered hardness profile. Such formation may result in a trapezoid-like or annulus like cross-section of the central foam region.
- the length of the central foam region abutting the wearer’s head may be between 30 and 80 mm and the length of the central foam region closer to the carrier may be between 0 and 40 mm.
- Such formation of the soft foam allows the central padding portion to bend inwardly and towards the user’s head resulting in an improved pressure distribution along the top of the head.
- the foam padding in the central foam region comprises at least one hole formed in the foam padding.
- a hole formed in the foam padding is to be understood as absence of a portion of material forming the foam padding.
- a hole can be created by removing a portion of the foam padding material. By removing the portion of the foam padding material, the density of the padding is changed thereby resulting in decreased hardness of the central region. Lower hardness results in an improved pressure distribution at the touch area of the head compared to a number of other headbands in the art having a uniform hardness along the headband.
- the at least one hole formed in the foam padding is a cut-out of the foam padding.
- the cut-outs may appear like air bubbles in the padding material. the cut-outs and through-going holes may be combined together to thereby change the density and thus hardness of the foam padding in the central foam region.
- the carrier may be a metal carrier. Any metal can be used as a carrier, such as aluminium, copper, iron, tin, gold, lead, silver, titanium, zinc, etc. Additionally, metal alloys, such as steel, can also be used.
- the carrier may be a cold rolled stainless steel strip.
- the metal carrier may be formed in a bended shape, such as U-like shaped.
- the metal U-shaped carrier may be flexible. Having a metal carrier provides sufficient rigidity and robustness to the headband, and since the metal machining is well established, the carrier can be properly designed and shaped to exhibit a desired clamping force.
- the carrier may be provided in a form of a bended strip.
- the carrier may have a thickness in the range between 0.5 mm and 5 mm.
- the carrier may have a width in the range between 1 cm and 5 cm.
- the carrier may have a total length in the range between 10 cm and 30 cm.
- the carrier may have a yield strength in the range between 500 Mpa and 1000 Mpa.
- the carrier may have a tensile strength in the range between 1000 Mpa and 1500 Mpa.
- the carrier is made of a hard plastic material and the foam padding is made of L3015 foam forming the central foam region and ADAR foam forming peripheral foam regions.
- the carrier may be made of a plastic, such as LDPE, or Polypropylene (PP) .
- the carrier may be made of stainless steel arranged on top of PP.
- the foam padding may be made of ADAR foam with a plurality of holes in the central foam region.
- a headphone comprising a headband as described above.
- a headset comprising a headband as described above in connection with the first aspect of the present invention.
- the present invention relates to different aspects including a headband, as well as a headphone, each yielding one or more of the benefits and advantages described in connection with the first mentioned aspect, and each having one or more embodiments corresponding to the embodiments described in connection with the first mentioned aspect and/or disclosed in the appended claims.
- Fig. 1 illustrates a cross section of an exemplary embodiment of a headband for a headset according to one embodiment of the present invention
- Fig. 2 compares prior art with embodiments of the present invention
- FIG. 3 schematically illustrates an exemplary embodiment of a headband for a headset according to the present invention
- Fig. 4 schematically illustrates an exemplary embodiment of the foam padding for the headband according to the present invention
- Fig. 5 schematically illustrates yet one exemplary embodiment of the foam padding for the headband according to the present invention
- Fig. 6 schematically illustrates yet one exemplary embodiment of the foam padding for the headband according to the present invention.
- Fig. 7 schematically illustrates a headphone according to a second aspect of the present invention.
- the headband 100 comprises the foam padding in the central foam region 112 having a first hardness and the foam padding in the peripheral foam regions 114 having a second hardness, the second hardness being higher than the first hardness. It can be seen from the pressure distribution 202 that the touch area is increased and that the pressure on the head top is more evenly distributed. Such equalized pressure distribution results in improved comfort for the user and absence of prominent pain points. Fig.
- the headband 100 also comprises the foam padding in the central foam region 112 having a first hardness and the foam padding in the peripheral foam regions 114 having a second hardness, the second hardness being higher than the first hardness and wherein the hardness profile has a trapezoidal shape. Namely, the sides of the region with the first hardness are angled inwardly. It can be seen from the pressure distribution 202 that the pressure on the head top is more evenly distributed and exhibits absence of any pain points resulting from increased pressure on the head top.
- Fig. 3 schematically illustrates an exemplary embodiment of a headband 100 for a headset according to the present invention arranged on a user’s head 200.
- the cross-section of the central foam region 112 perpendicular to the length of the headband 100 is of a curved trapezoid shape.
- the central foam region 112 has a first hardness and the peripheral foam regions 114 have a second hardness larger than the first hardness.
- the curved trapezoid, or more precisely its sides, provides a smooth transition in hardness from the top of the headband and results in improved wearing comfort due to equalized pressure distribution along the foam padding, and in particular along the central foam region 112.
- the angle ⁇ of the trapezoid may be below 90° and above 15°, such as 75°, such as 65°, such as 60°, such as 50°, such as 45°, such as 30°.
- the length of the central foam region closer to the carrier, L c is shorter than the length of the central foam region abutting the wearer’s head, , L t .
- the foam padding has a tapered hardness profile.
- the length of the central foam region abutting the wearer’s head, L t may be between 30 and 80 mm and the length of the central foam region closer to the carrier, L c , may be between 0 and 40 mm.
- Fig. 6 illustrates yet one exemplary embodiment of the foam padding 104 for the headband according to the present invention.
- the foam padding 104 in the central foam region 112 comprises a foam with a first hardness and a cut hole 600 formed therein.
- the foam padding 104 may comprise foam with a first hardness in the peripheral regions 114, or it may comprise foam with a second hardness in the peripheral regions 114.
- the hole 600 is formed by removing a portion of the foam with the first hardness.
- Fig. 6a) shows a first longitudinal section of the foam padding 104 where it can be seen that the hole 600 is created by removing a portion of the padding material to create the hole 600.
- the hole 600 has an ellipsoidal shape.
- Fig. 6b) shows a second longitudinal section of the foam padding 104 with the hole 600 formed in the central region112. Inserts AA’ and BB’ illustrate cross cuts along AA’ and BB’ lines.
- Fig. 7 schematically illustrates a headphone 700 according to a second aspect of the present invention.
- the headphone comprises the headband 100 according to any of the embodiments described in figures 1-6.
- the headphone comprises two earcups 702.
- One of the earcups 702 comprises a microphone 704.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Manufacturing & Machinery (AREA)
- Headphones And Earphones (AREA)
Abstract
Description
Claims (16)
- A headband for a headset, the headband being configured to carry at least one earcup of the headset, the headband comprising:a carrier being curved to conform to a wearer’s head and having a first carrier end, a second carrier end and a central carrier region between and elevated relative to the first and second carrier ends,a foam padding being coupled to the carrier and configured to abut the wearer’s head when the headband is worn by the wearer,wherein the foam padding is configured to have a uniform shape, andwherein the foam padding is defining a central foam region arranged at the central carrier region and a peripheral foam region arranged outside of the central carrier region,wherein the foam padding in the central foam region has a lower hardness than the foam padding in the peripheral foam region.
- The headband for a headset according to claim 1, wherein the foam padding hardness changes gradually from a midpoint of the central foam region towards the peripheral foam region.
- The headband for a headset according to claim 1 or 2, wherein the foam padding comprises a first foam arranged in the central foam region and a second foam arranged in the peripheral foam region.
- The headband for a headset according to any of the preceding claims, wherein a transition in the foam padding in the peripheral foam region to the foam padding in the central foam region is angled.
- The headband for a headset according to any of the preceding claims, wherein a cross-section of the central foam region perpendicular to the length of the headband has a substantially trapezoid-like shape.
- The headband for a headset according to any of the preceding claims, wherein the length of the central foam region closer to the carrier is shorter than the length of the central foam region abutting the wearer’s head when the headband is worn by the wearer.
- The headband for a headset according to any of the preceding claims, wherein the foam padding in the central foam region comprises at least one hole formed in the foam padding.
- The headband for a headset according to claim 7, wherein the at least one hole formed in the foam padding is a through-going hole.
- The headband for a headset according to claim 7 or 8, wherein the at least one hole formed in the foam padding is a cut-out of the foam padding.
- The headband for a headset according to any of the preceding claims, wherein the foam padding in the central foam region comprises a plurality of holes formed in the foam padding and wherein the plurality of holes are arranged such that a number of holes gradually decreases from a midpoint of the central foam region towards the peripheral foam region.
- The headband for a headset according to claim 10, wherein a cross-section of the central foam region perpendicular to the length of the headband comprises the plurality of holes arranged in a substantially rhomboid-like arrangement.
- The headband for a headset according to any of the preceding claims 7-11, wherein at least two holes have different sizes.
- The headband for a headset according to any of the preceding claims, wherein the headband further comprises an electrical cable, the electrical cable being configured for electrically connecting the at least one earcup of the headset.
- The headband for a headset according to any of the preceding claims, wherein the carrier and the foam padding contribute to a clamping force of the headband.
- The headband for a headset according to any of the preceding claims, wherein the carrier is formed from a rigid material into a U-shape.
- A headphone comprising a headband according to any of claims 1 to 15 and at least one earcup arranged at an end of the headband.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202180099519.8A CN117678242A (en) | 2021-09-28 | 2021-09-28 | Headband for headphones |
| US18/681,642 US12689853B2 (en) | 2021-09-28 | 2021-09-28 | Headband for a headset |
| PCT/CN2021/121456 WO2023050090A1 (en) | 2021-09-28 | 2021-09-28 | A headband for a headset |
| EP21958685.6A EP4409930A4 (en) | 2021-09-28 | 2021-09-28 | HEADBAND FOR HEADPHONES |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/121456 WO2023050090A1 (en) | 2021-09-28 | 2021-09-28 | A headband for a headset |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023050090A1 true WO2023050090A1 (en) | 2023-04-06 |
Family
ID=85780985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2021/121456 Ceased WO2023050090A1 (en) | 2021-09-28 | 2021-09-28 | A headband for a headset |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12689853B2 (en) |
| EP (1) | EP4409930A4 (en) |
| CN (1) | CN117678242A (en) |
| WO (1) | WO2023050090A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD981374S1 (en) * | 2018-03-09 | 2023-03-21 | Gn Audio A/S | Base station for wireless telephone |
| CN217985344U (en) * | 2022-05-25 | 2022-12-06 | 东莞北欧智能科技有限公司 | Headset capable of randomly replacing multiple parts without professional tools |
| EP4513889A4 (en) * | 2022-10-11 | 2025-11-26 | Shenzhen Shokz Co Ltd | HEADPHONES |
| USD1113084S1 (en) * | 2023-10-06 | 2026-02-17 | Vuzix Corporation | Headband support |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150272292A1 (en) * | 2014-03-26 | 2015-10-01 | Bose Corporation | Headband |
| US20160050486A1 (en) * | 2014-08-15 | 2016-02-18 | Zound Industries International Ab | Headband cover for a headband of a headphone |
| CN209390270U (en) * | 2019-03-04 | 2019-09-13 | 东莞市全康电子科技有限公司 | A headset microphone speaker |
| US20200053448A1 (en) * | 2018-08-08 | 2020-02-13 | Bose Corporation | Headband Assembly |
| CN210298009U (en) | 2019-07-24 | 2020-04-10 | Tcl通力电子(惠州)有限公司 | Head pad, head-wearing earphone structure and head-wearing earphone |
| US20210029435A1 (en) | 2018-04-02 | 2021-01-28 | Apple Inc. | Headphones |
| US20210037317A1 (en) * | 2018-03-13 | 2021-02-04 | Zound Industries International Ab | A headband cover for detachable attachment to a headband of a headphone |
-
2021
- 2021-09-28 EP EP21958685.6A patent/EP4409930A4/en active Pending
- 2021-09-28 WO PCT/CN2021/121456 patent/WO2023050090A1/en not_active Ceased
- 2021-09-28 CN CN202180099519.8A patent/CN117678242A/en active Pending
- 2021-09-28 US US18/681,642 patent/US12689853B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150272292A1 (en) * | 2014-03-26 | 2015-10-01 | Bose Corporation | Headband |
| US20160050486A1 (en) * | 2014-08-15 | 2016-02-18 | Zound Industries International Ab | Headband cover for a headband of a headphone |
| US20210037317A1 (en) * | 2018-03-13 | 2021-02-04 | Zound Industries International Ab | A headband cover for detachable attachment to a headband of a headphone |
| US20210029435A1 (en) | 2018-04-02 | 2021-01-28 | Apple Inc. | Headphones |
| US20200053448A1 (en) * | 2018-08-08 | 2020-02-13 | Bose Corporation | Headband Assembly |
| CN209390270U (en) * | 2019-03-04 | 2019-09-13 | 东莞市全康电子科技有限公司 | A headset microphone speaker |
| CN210298009U (en) | 2019-07-24 | 2020-04-10 | Tcl通力电子(惠州)有限公司 | Head pad, head-wearing earphone structure and head-wearing earphone |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP4409930A4 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117678242A (en) | 2024-03-08 |
| EP4409930A1 (en) | 2024-08-07 |
| US12689853B2 (en) | 2026-07-21 |
| EP4409930A4 (en) | 2025-07-23 |
| US20240348966A1 (en) | 2024-10-17 |
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