WO2023065323A1 - 一种降漏音装置及声学输出装置 - Google Patents

一种降漏音装置及声学输出装置 Download PDF

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Publication number
WO2023065323A1
WO2023065323A1 PCT/CN2021/125794 CN2021125794W WO2023065323A1 WO 2023065323 A1 WO2023065323 A1 WO 2023065323A1 CN 2021125794 W CN2021125794 W CN 2021125794W WO 2023065323 A1 WO2023065323 A1 WO 2023065323A1
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WIPO (PCT)
Prior art keywords
cavity
sound leakage
vibration
sound
resonant cavity
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Ceased
Application number
PCT/CN2021/125794
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English (en)
French (fr)
Inventor
张磊
付峻江
廖风云
齐心
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shokz Co Ltd
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Shenzhen Shokz Co Ltd
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Filing date
Publication date
Application filed by Shenzhen Shokz Co Ltd filed Critical Shenzhen Shokz Co Ltd
Priority to KR1020227039412A priority Critical patent/KR102645927B1/ko
Priority to EP21930602.4A priority patent/EP4195701A4/en
Priority to BR112022020041-2A priority patent/BR112022020041B1/pt
Priority to CN202180027705.0A priority patent/CN116349248B/zh
Priority to JP2022566697A priority patent/JP7434606B2/ja
Priority to PCT/CN2021/125794 priority patent/WO2023065323A1/zh
Priority to US17/932,304 priority patent/US12266334B2/en
Publication of WO2023065323A1 publication Critical patent/WO2023065323A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/172—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using resonance effects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
    • G10K9/22—Mountings; Casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/50—Customised settings for obtaining desired overall acoustical characteristics
    • H04R25/505—Customised settings for obtaining desired overall acoustical characteristics using digital signal processing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/066—Loudspeakers using the principle of inertia
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/345—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13—Hearing devices using bone conduction transducers

Definitions

  • the present application relates to the technical field of sound conduction, in particular to a sound leakage reducing device and a sound output device.
  • a speaker that uses bone conduction as one of the main modes of sound transmission its sound transmission (sound conduction) vibrating parts can perform mechanical vibrations according to electrical signals (for example, control signals from signal processing circuits), and generate conductive sound waves based on mechanical vibrations, and finally transmitted to the human body.
  • electrical signals for example, control signals from signal processing circuits
  • the sound-transmitting vibration parts of the traditional speaker will transmit the mechanical vibration to the shell structure of the speaker, causing the shell structure to vibrate.
  • the vibration of the shell structure will push the surrounding air to vibrate, resulting in sound leakage. Affect the sound transmission performance of the speaker.
  • a sound leakage reducing device including a transducing structure, a vibrating structure and a casing; the casing has a vibrating cavity and at least one resonant cavity; the transducing structure is located in the vibrating cavity, and connected with the vibrating structure; the at least one resonant cavity communicates with the vibrating cavity through at least one communication hole, and the volume of each resonant cavity is smaller than that of the vibrating cavity.
  • One of the embodiments of the present application provides an acoustic output device, including the sound leakage reducing device described in any solution of the embodiments of the present application.
  • Fig. 1 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application
  • Fig. 2 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 3 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 4 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 5 is a sound leakage curve diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 6 is a curve diagram of sound leakage of the sound leakage reducing device according to some embodiments of the present application.
  • Fig. 7 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 8 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 9 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 10 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • Fig. 11 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 12 is a curve diagram of sound leakage of the sound leakage reducing device according to some embodiments of the present application.
  • Fig. 13 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • Fig. 14 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 15 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 16 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • Fig. 17 is a graph of the sound leakage curve of the sound leakage reducing device according to some embodiments of the present application.
  • Fig. 18 is a schematic structural diagram of an acoustic output device according to some embodiments of the present application.
  • system means for distinguishing different components, elements, parts, parts or assemblies of different levels.
  • the words may be replaced by other expressions if other words can achieve the same purpose.
  • the flow chart is used in this application to illustrate the operations performed by the system according to the embodiment of this application. It should be understood that the preceding or following operations are not necessarily performed in the exact order. Instead, various steps may be processed in reverse order or simultaneously. At the same time, other operations can be added to these procedures, or a certain step or steps can be removed from these procedures.
  • Fig. 1 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • the sound leakage reducing device 100 may include a transducing structure 110, a vibrating structure 120 and a housing 130, the housing 130 has a vibrating cavity 140 and at least one resonant cavity 150, the transducing structure 110 is located in the vibrating cavity 140 and is connected to the vibrating structure 120 , the resonance cavity 150 communicates with the vibration cavity 140 through at least one communication hole 160 , wherein the volume of the resonance cavity 150 is smaller than the volume of the vibration cavity 140 .
  • the transducing structure 110 can drive the vibrating structure 120 to vibrate to generate sound transmitted to the human ear.
  • the resonant cavity 150 is used to absorb the sound of a specific frequency generated by the transducing structure 110 in the vibrating cavity 140, thereby suppressing the sound leakage reduction device 100 from Leakage at specific frequencies.
  • the sound leakage reducing device 100 may be a device for reducing sound leakage of a speaker.
  • the sound leakage reducing device 100 may be a speaker with bone conduction as one of the main modes of sound transmission.
  • the vibrating structure 120 can be in contact with the skin of the user's face in a large area and transmit its mechanical vibration to the skin so that the user can hear the sound.
  • the speaker may be a bone conduction speaker, an air conduction speaker, or a combined bone and air conduction speaker.
  • the speaker may be any other feasible speaker, which is not particularly limited in this embodiment of the present application.
  • the resonant cavity 150 in the sound leakage reducing device 100 can absorb the sound of a specific frequency generated by the transduction structure 110 in the vibration cavity (that is, the vibration cavity in the form of bone conduction), thereby suppressing the sound generated at a specific frequency. leaking sound.
  • the transducer structure 110 is a component that converts electrical signals into mechanical vibrations.
  • the transducer structure 110 may adopt a structure of a magnetic component and a voice coil, that is, the audio electric signal is input into the voice coil through electromagnetic action, and the voice coil is placed in a magnetic field to drive the vibration of the voice coil.
  • the transducer structure 110 may adopt a piezoelectric ceramic structure, which converts electrical signals into shape changes of ceramic components to generate vibrations.
  • the transducer structure 110 may adopt any other feasible structural form, which is not particularly limited in this embodiment of the present application.
  • the transducer structure 110 can use specific magnetic circuit components and vibration components to convert signals containing sound information into mechanical vibrations.
  • the aforementioned conversion process may include the coexistence and conversion of multiple different types of energy.
  • electrical signals can be directly converted into mechanical vibrations through the transducer structure 110 to generate sound.
  • the sound information may be included in the light signal, and the process of converting the light signal into a vibration signal can be realized through the specific transduction structure 110 .
  • the types of energy that coexist and convert during the working process of the transducer structure 110 may also include other types, such as heat energy, magnetic field energy, and the like.
  • the energy conversion methods of the transducing structure 110 may include moving coil, electrostatic, piezoelectric, moving iron, pneumatic, electromagnetic, and the like.
  • the vibrating body of the vibrating component in the transducing structure 110 may be a mirror-symmetrical structure, a centrally-symmetrical structure or an asymmetrical structure.
  • the vibrating body may be a torus structure, and a plurality of struts converging toward the center are arranged in the torus, and the number of the struts may be two or more.
  • the vibrating body may be provided with discontinuous hole-like structures, so that the vibrating body can generate greater displacement, thereby increasing the output power of vibration and sound, and achieving higher sensitivity.
  • the casing 130 is an outer shell structure for accommodating the energy-transforming structure 110 and forming the vibration cavity 140 .
  • the housing 130 may be a single-cavity structure for accommodating the transducing structure 110 .
  • the housing 130 may be a multi-cavity structure (that is, more than one vibration cavity is formed) for accommodating the transducer structure 110 .
  • the structural shape of the housing 130 may be cylindrical, square or any other feasible structural shape.
  • the casing 130 may adopt other feasible structural forms or structural shapes, which are not particularly limited in this embodiment of the present application.
  • the vibration chamber 140 is a vibration chamber formed by the casing 130 and the transducing structure 110 inside the casing 130 .
  • the mechanical vibration generated by the transducing structure 110 is transmitted to the vibrating structure 120, and the vibrating structure 120 vibrates synchronously driven by the transducing structure 110, and at the same time, the vibration of the transducing structure 110 relative to the casing 130 will also be Sound waves are generated in the vibrating cavity 140 .
  • the transducing structure 110 can form a magnetic field in the vibration cavity, and the magnetic field can be used to convert a signal containing sound information into a vibration signal.
  • the aforementioned sound information may include video and audio files in a specific data format, or data or files that can be converted into sound through a specific method.
  • the aforementioned signal containing sound information may come from a storage component of the sound leakage reduction device 100 itself, or from an information generation, storage or transmission system outside the sound leakage reduction device 100 .
  • the aforementioned signal containing sound information may include a combination of one or more of electrical signals, optical signals, magnetic signals, and mechanical signals.
  • the aforementioned signal containing sound information may come from one signal source or multiple signal sources. In some embodiments, the aforementioned multiple signal sources may or may not be correlated.
  • the sound leakage reducing device 100 can acquire the aforementioned signal containing sound information in a variety of different ways, and the acquisition of the signal can be wired or wireless, and can be real-time or delayed.
  • the sound leakage reducing device 100 may receive an electrical signal containing sound information in a wired or wireless manner, or may directly obtain data from a storage medium (eg, a storage component) to generate a sound signal.
  • the sound leakage reducing device 100 may include components with a sound collection function. By picking up the sound in the environment, the mechanical vibration of the sound is converted into an electrical signal, and the electrical signal that meets specific requirements is obtained after being processed by an amplifier.
  • the aforementioned storage medium may store a signal containing sound information.
  • the foregoing storage medium may adopt any feasible storage form, for example, may include one or more storage devices and the like.
  • the vibrating structure 120 may be a component that transmits mechanical vibrations to human ears, specifically, transmits mechanical vibrations through human skin (eg, facial skin).
  • the vibration structure 120 may include a vibration panel 121 and a vibration conductor 122 .
  • the end of the vibration conducting member 122 away from the transducing structure 110 may be located outside the housing 130 and connected to the vibration panel 121 also located outside the housing 130 .
  • the other end of the vibration conductor 122 (the end away from the vibration panel 121 ) can extend through the housing 130 into the vibration cavity 140 , so that a part of the vibration conductor 122 is located in the cavity 140 and connected to the transducer structure 110 .
  • the mechanical vibration generated by the transducer structure 110 can be transmitted to the vibration panel 121 through the vibration conductor 122, and the vibration panel 121 is in contact with human skin (for example, facial skin), and then the mechanical vibration (that is, bone conduction sound wave) is transmitted to the user's body. Ear.
  • the structural shape of the vibrating panel 121 may be cylindrical, square or any other feasible structural shape. In other embodiments, the vibrating panel 121 may adopt other feasible structural forms or structural shapes, which are not particularly limited in this embodiment of the present application.
  • connection manner between the vibrating structure 120 and the transducing structure 110 is not limited to the above-mentioned direct connection, and may also be an indirect connection.
  • the sound leakage reducing device 100 may also include a connecting piece (not shown), the connecting piece may be located in the vibration chamber 140, one end of the connecting piece may be connected with the inner wall of the housing 130, and the other end of the connecting piece may be connected with the vibrating structure 120 ( For example, a vibration conductor (122) is connected.
  • the mechanical vibration generated by the transducer structure 110 can be transmitted to the casing 130 , the vibration of the casing 130 can be transmitted to the vibration conductor 122 of the vibration structure 120 through the connecting piece, and the bone conduction sound wave can be transmitted to the user through the vibration panel 121 .
  • the component on the casing 130 used to close the upper surface of the casing can be used as a connecting piece to connect the vibration panel 121 and the vibration conducting piece 122, without requiring an additional component as a connecting piece to improve the vibration transmission efficiency. At the same time, it has the advantage of compact structure.
  • the housing 130 may be integrally formed. In some embodiments, the housing 130 may also be assembled by inserting, clamping and the like.
  • the housing 130 can be made of metal materials (for example, copper, aluminum, titanium, gold, etc.), alloy materials (for example, aluminum alloy, titanium alloy, etc.), plastic materials (for example, polyethylene, polypropylene, Epoxy resin, nylon, etc.), fiber materials (for example, acetate fiber, propionate fiber, carbon fiber, etc.) and the like.
  • a sheath can be provided on the outside of the housing 130, and the sheath can be made of a soft material with certain elasticity, such as soft silicone, rubber, etc., to provide a better tactile feeling for the user to wear.
  • the resonant cavity 150 is used to absorb the sound of a specific frequency generated by the transducer structure 110 in the vibrating cavity 140 , thereby suppressing the sound leakage generated by the sound leakage reducing device 110 at a specific frequency.
  • the resonant cavity 150 can be equivalent to a Helmholtz resonant cavity.
  • the frequency of the leakage sound wave in the vibration cavity 140 is consistent with the natural frequency of the resonant cavity 150, resonance occurs, and the leakage sound wave It rubs against the inner wall of the resonant cavity 150 so as to consume sound energy and achieve the purpose of sound absorption.
  • the center frequency of the Helmholtz resonant cavity can be calculated by formula (1):
  • f 0 represents the center frequency of the Helmholtz resonant cavity
  • r represents the pipe radius of the Helmholtz resonant cavity
  • l 0 represents the pipe length of the Helmholtz resonant cavity
  • S represents the Helmholtz resonance
  • V 0 represents the volume of the Helmholtz resonance cavity
  • c represents the speed of sound propagation in the air.
  • a sound leakage hole may be provided on the shell of the housing 130 , so that the sound wave in the vibration chamber 140 is exported to the housing 130 and interferes and cancels the leakage sound wave generated by the vibration of the housing 130 to reduce the leakage sound.
  • this method of reducing sound leakage reduces sound leakage to a certain extent, the effect of reducing sound leakage for specific frequency sound waves is not ideal in a wide frequency range.
  • By further adding a resonant cavity 150 outside the vibrating cavity 140, and adjusting the structure and arrangement of the vibrating cavity 140 and the resonating cavity 150 it is possible to absorb sound waves in a specific frequency range in the vibrating cavity 140 in a targeted manner, and further reduce the noise from the sound leakage hole.
  • no sound leakage holes may be provided on the shell of the housing 130.
  • the vibration formed when the resonance cavity 150 absorbs part of the sound waves in the vibration cavity 140 can adjust the vibration of the housing 130, and can also The effect of reducing the sound leakage of the casing 130 is achieved.
  • the resonant cavity 150 may be a resonant cavity added on the basis of the vibratory cavity 140 .
  • the resonant cavity 150 and the vibrating cavity 140 may share a side wall, and the acoustic communication is realized through one or more communication holes 160 on the side wall.
  • the resonant cavity 150 may be a resonant cavity independent of the vibrating cavity 140 .
  • the resonant cavity 150 and the vibrating cavity 140 respectively have independent side walls, and are acoustically communicated with each other through one or more sound guide tubes.
  • the resonant cavity 150 may include one resonant cavity or multiple resonant cavities.
  • At least one hole capable of realizing air conduction communication is provided between the vibrating cavity 140 and the resonating cavity 150 , or between multiple resonating cavities of the resonating cavity 150 .
  • at least one communication hole 160 (which can be regarded as a pipe part of the Helmholtz resonance cavity) may be provided on the side wall 170 for separating the resonance cavity 150 and the vibration cavity 140, at least A communication hole 160 is used to realize air conduction communication between the vibrating cavity 140 and the resonance cavity 150 .
  • the resonant cavity 150 may also be any other feasible resonant cavity, which is not particularly limited in this embodiment of the present application.
  • the cavity wall (such as the side wall 170 ) of the resonance cavity 150 can be made of the same material as that of the casing 130 .
  • the resonant cavity 150 can be made of metal materials (for example, copper, aluminum, titanium, gold, etc.), alloy materials (for example, aluminum alloy, titanium alloy, etc.), plastic materials (for example, polyethylene, polypropylene, Epoxy resin, nylon, etc.), fiber materials (for example, acetate fiber, propionate fiber, carbon fiber, etc.) and the like.
  • a resonant cavity is added in addition to the traditional vibrating cavity, and the specific structure of the resonating cavity can absorb or offset the sound wave of a specific frequency in the vibrating cavity, thereby satisfying the effect of reducing the sound leakage of the housing.
  • this structural arrangement has the advantages of simple structure and easy processing.
  • the resonant cavity 150 can reduce sound leakage of a specific frequency, that is, absorb sound waves of a specific frequency range.
  • the sound waves in the specific frequency range may be in the frequency range of 20Hz ⁇ 10000Hz (10kHz).
  • the sound waves in the specific frequency range may be located in a frequency range to which the human ear is more sensitive, for example, a frequency range of 1 kHz to 3 kHz, so as to improve the effect of reducing sound leakage in this frequency range.
  • At least one resonant cavity 150 may include multiple resonant cavities 150, and the multiple resonant cavities 150 are arranged on the same side wall (as shown in FIG. 8 ) or different side walls (as shown in FIG. 9 ) of the vibration cavity 140. ), each resonant cavity 150 can communicate with the vibrating cavity 140 through at least one communication hole 160 or a sound guide tube for air conduction.
  • the number of resonant cavities 150 can be changed and set, and the number of resonant cavities 150 can be set to one or multiple;
  • the position is changed and set, the resonant cavity 150 can be set on any side wall of the housing 130, and different resonant cavities 150 can be set on the same side wall or on different side walls.
  • the number of communicating holes 160 may be one or more.
  • different settings can be made on the number of cavities, the size of the cavities, the specific location of the cavities, the positional relationship between the cavities, and the structural shape of the cavities according to different requirements for reducing sound leakage.
  • the embodiments of this application are not particularly limited.
  • the distance between one (or each) resonating cavity 150 and the vibrating cavity 140 is not less than 0.1, so that the resonant cavity and the vibrating cavity can achieve the sound leakage reduction effect of a specific frequency within the widest possible volume range.
  • the volume ratio between each resonance cavity 150 and the vibration cavity 140 is 0.1 to 1, so that the resonance cavity and the vibration cavity can also be realized within a wide range of volume values. Leakage reduction effect for specific frequencies.
  • the volume ratio between a resonant cavity 150 and the vibrating cavity 140 can be set to 1/10 ⁇ 1/1, or the volume of a single resonant cavity or the total volume of multiple resonant cavities (such as the first resonant cavity 210 or the second resonant cavity Cavity 220, another example, the volume ratio between the third resonant cavity 310, the fourth resonant cavity 320 and the fifth resonant cavity 340) and the vibrating cavity 140 volume can be set to 1/10 ⁇ 1/1, so that the resonant cavity is performing When absorbing sound waves, it covers the possible frequency range of leakage sound and improves the efficiency of sound leakage reduction.
  • the volume ratio between one resonant cavity 150 and the vibrating cavity 140 can be set to 1/8-2/3, or the volume of a single resonant cavity or the total volume of multiple resonant cavities
  • the volume ratio between the volume (such as the first resonant cavity 210 or the second resonant cavity 220, for example, the third resonant cavity 310, the fourth resonant cavity 320 and the fifth resonant cavity 340) and the volume of the vibrating cavity 140 can be set to 1 /8 ⁇ 2/3.
  • the volume ratio between one resonant cavity 150 and the vibrating cavity 140 can be set to 1/5 to 1/2, or a single resonant cavity
  • the volume of the cavity or the total volume of multiple resonant cavities (such as the first resonant cavity 210 or the second resonant cavity 220, for example, the third resonant cavity 310, the fourth resonant cavity 320 and the fifth resonant cavity 340) and the vibrating cavity 140 The volume ratio between them can be set to 1/5 ⁇ 1/2.
  • a single resonant cavity or multiple resonant cavities (such as the resonant cavity 150, the first resonant cavity 210 or the second resonant cavity 220, another example, the third resonant cavity 310, the fourth resonant cavity 320 and the fifth resonant cavity
  • the frequency range of the leakage reduction sound of the cavity 340 can be calculated according to the formula (1).
  • a sound leakage hole 180 may be provided on the outer wall of the vibrating cavity and/or the resonating cavity, so that on the basis of reducing sound leakage in the resonating cavity 150, part of the sound waves in the vibrating cavity can be extracted to the outside of the housing 130 and The vibration of the shell 130 pushes the air outside the shell to form a sound leakage sound wave that interferes to reduce the amplitude of the leakage sound, thereby further reducing the leakage sound.
  • the sound leakage reduction effect can be further optimized without increasing the structural volume and weight.
  • the number of holes, the size of the holes and the size ratio between the holes, the location of the holes and/or the shape of the hole structure (for example, The shape of the hole structure is a round hole or a square hole, and for example, the shape of the hole structure is a connected hole or a non-connected hole, etc.).
  • the ratio of the diameter D 1 of the communication hole 160 to the diameter D 2 of the sound leakage hole 180 can be set to 1/2 to 2
  • the ratio of the pipe length L 1 of the communication hole 160 to the pipe length L 2 of the sound leakage hole 180 The ratio is set to 1/2 ⁇ 2.
  • the communication hole 160 or the sound leakage hole 180 may be an air conduction (ie, air conduction) communication hole.
  • the communication hole 160 may be a communication hole for realizing communication between the vibration cavity 140 and the resonant cavity 150 .
  • the sound leakage hole 180 may be a sound introduction hole provided on any outer wall of the casing 130 (including any outer wall of the vibration cavity 140 or the resonant cavity 150 ).
  • the communication hole 160 and/or the sound leakage hole 180 may be an unobstructed through hole, so as to ensure the effect of absorbing the leakage sound wave.
  • a damping layer is provided at the upper opening of the communication hole 160 and/or the sound leakage hole 180 to adjust the phase and amplitude of the sound wave and correct the effect of sound wave export.
  • the area of a communication hole 160 or a plurality of communication holes (such as a plurality of communication holes 160, a plurality of first communication holes 231, a plurality of second communication holes 241, or the first communication hole 231 and the second communication hole 241)
  • the total area can be set to not less than 0.05mm 2 , so that within the widest possible range of the connecting hole area, the resonant cavity covers the possible frequency range of leakage sound when absorbing sound waves, improving the efficiency of sound leakage reduction.
  • the volume of one resonant cavity 150 or the total volume of multiple resonant cavities can be set to be no greater than 6500 mm 3 , so that Within the widest possible resonant cavity volume range, the resonant cavity covers the possible frequency range of leakage sound when absorbing sound waves, improving the efficiency of reducing sound leakage.
  • the volume of one resonant cavity 150 or the total volume of multiple resonant cavities can be set to be no greater than 2100 mm 3 , so that Within a wide value range of the volume of the resonant cavity, the resonant cavity covers a wide frequency range of sound leakage when absorbing sound waves, thereby improving the efficiency of reducing sound leakage.
  • the diameter of a communication hole 160 or a plurality of communication holes can be set to 0.1mm-10mm, the volume of one resonant cavity 150 or the total volume of multiple resonant cavities (for example, the third resonant cavity 310, the fourth resonant cavity 320 and the fifth resonant cavity 340) It can be set to 65mm 3 -6500mm 3 , so that the resonant cavity can cover a wide frequency range of sound leakage when absorbing sound waves, and improve the efficiency of reducing sound leakage.
  • the diameter of at least one communication hole 160 or a plurality of communication holes can be set to 0.2mm-5mm, the volume of one resonant cavity 150 or a plurality of resonant cavities (for example, the third resonant cavity 310, the fourth resonant cavity 320 and the second resonant cavity
  • the total volume of the five resonant cavities 340 can be set to 80mm 3 -3000mm 3 .
  • the diameter of at least one communication hole 160 or a plurality of communication holes can be set to 0.5mm-3mm
  • the volume of a resonant cavity 150 or a plurality of resonant cavities can be set as 100mm 3 -1000mm 3 .
  • the vibrating structure 120 can be set in various ways to achieve different sound leakage reduction requirements, such as the changing setting of the distance between the vibrating structure 120 and the housing 130, and for example, the structural shape of the vibrating structure 120 or For the conversion setting of the size and area, etc., the specific setting method can refer to the corresponding content description in Figure 14, and will not be repeated here.
  • the sound leakage reducing device provided by the embodiment of the present application is further described below by way of some examples.
  • Fig. 2-Fig. 4 are structural schematic diagrams of sound leakage reducing devices according to some embodiments of the present application.
  • a vibrating cavity 140 and a resonant cavity 150 are provided in the housing 130 of the sound leakage reducing device 200, and a communication hole 160 is provided on the side wall 170 between the vibrating cavity 140 and the resonant cavity 150 to To realize the air conduction communication between the two, a sound leakage hole 180 is also provided on the outer wall of the casing 130 .
  • the sound leakage hole 180 can be provided on any outer wall of the housing 130 , that is, the outer wall 131 , the outer wall 132 or the outer wall 133 .
  • the sound leakage hole 180 may be located at any position on any outer wall of the casing, such as a middle position or an edge position of the outer wall.
  • the sound leakage hole 180 and The communication holes 160 can be arranged in a staggered manner as shown in FIG. 2 , and the sound leakage holes 180 and the communication holes 160 can also be arranged opposite to each other (that is, not staggered).
  • the size of the communication hole 160, the size of the sound leakage hole 180 or the proportional relationship between the two sizes can be set differently. It can be set that the diameter of the sound leakage hole 180 is larger than that of the communication hole 180
  • the diameter of the hole 160, for example, the diameter ratio of the sound leakage hole 180 to the communication hole 160 is set to 3:2, so that on the basis of the resonance cavity 150 absorbing a specific frequency sound wave through the communication hole 160, it is more effective to guide a part of the expected sound wave to the outside of the housing 130.
  • a vibrating cavity 140 and a resonating cavity 150 are provided in the housing 130 of the sound leakage reducing device 300, and a communication hole 160 is provided on the side wall 170 between the vibrating cavity 140 and the resonating cavity 150 to realize the air conduction communication between the two, two sound leakage holes 180 and 181 are provided on the outer wall of the casing 130 .
  • the specific positions of the sound leakage hole 180 and the sound leakage hole 181 are similar to the sound leakage hole 180 described in the first embodiment. For details, please refer to the relevant description of the first embodiment above, and will not repeat them here.
  • different transformation settings can be performed on the size of the communication hole 160, the size of the sound leakage hole 180, the size of the sound leakage hole 181 or the size ratio of the three, for example, the sound leakage can be set
  • the size of the hole 180 and the size of the sound leakage hole 181 are the same as the size of the single sound leakage hole 180 in Embodiment 1 to realize the absorption of sound waves of the same target frequency or sound waves of different target frequencies.
  • a vibrating cavity 140 and a resonant cavity 150 are provided in the housing 130 of the sound leakage reducing device 400, and a communication hole 160 is provided on the side wall 170 between the vibrating cavity 140 and the resonant cavity 150 to realize the air conduction communication between the two, three sound leakage holes 180 , 181 , 182 are provided on the outer wall of the casing 130 .
  • the specific positions of the sound leakage hole 180, the sound leakage hole 181, and the sound leakage hole 182 they are similar to the sound leakage hole 180 described in the first embodiment. For details, please refer to the relevant description of the first embodiment above, and will not repeat them here. .
  • different transformation settings can be performed on the size of the communication hole 160, the size of the sound leakage hole 180, the size of the sound leakage hole 181, the size of the sound leakage hole 182, or the relationship between the four sizes,
  • the size of the sound leakage hole 180 and the size of the sound leakage hole 181 can be set, and the size of the single sound leakage hole 180 in the first embodiment or the size of the sound leakage hole 180 and the size of the sound leakage hole 181 in the second embodiment can realize the same target frequency range. Equivalent settings or differential settings for different target frequency ranges.
  • Fig. 5 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • the abscissa indicates the leakage frequency, and the unit is Hz;
  • the vertical axis indicates the sound pressure level of the leakage, and the unit is dB.
  • the test condition may be that the earphone core sample is in a suspended state and the sound-receiving microphone is placed behind the ear, and the measurement position is 35 mm from the front panel of the vibrating structure when suspended in the air.
  • FIG. 5 and all the leakage curves and test conditions mentioned in this application are only for illustrative purposes and should not be construed as limiting this application.
  • the leakage sound reduction device 100 shown in FIG. 1 according to the leakage sound reduction curve 511 obtained after the test, it can be known that a valley region is formed in a specific frequency range (such as 2kHz to 2.5kHz, 5kHz to 6kHz), It shows that there is a better leakage reduction effect in this specific frequency range;
  • the leakage reduction device 200 as shown in Figure 2 according to the leakage reduction curve 512 obtained by the test, it can be seen that in a specific frequency range (such as 2.5kHz to 3.5kHz ) forms a trough area, indicating that there is a better sound leakage reduction effect in this specific frequency range;
  • the leakage sound reduction device 300 as shown in Figure 3 according to the leakage sound reduction curve 513 obtained by the test, it can be seen that in the specific frequency range ( Such as 3.5kHz to 4.5kHz) forms a trough area, indicating that there is a better sound leakage reduction effect in this specific frequency range;
  • the structural parameters of the vibrating cavity and/or resonant cavity (cavity structure shape, cavity size, volume ratio between cavities, specific position of the cavity, positional relationship between the cavities, etc.) and
  • the structure parameters (hole shape, number of holes, hole size, etc.) of the connecting holes and/or sound leakage holes are set differently for noise reduction, so that the sound leakage reduction devices under different structural parameter settings can realize different frequency ranges. Sound leakage reduction effect, or enhance the sound leakage reduction effect in the same frequency range, for example, by enlarging the size of one communication hole on the side wall instead of setting two or more communication holes of smaller size, and vice versa.
  • Fig. 6 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • the example structure 61 of the leakage sound reduction device, its corresponding leakage sound reduction curve 611 shows that it forms a trough region at 5.5kHz to 6.5kHz, indicating that at this time The resonant cavity can absorb sound waves in this frequency range, and achieve the corresponding sound leakage reduction effect;
  • the example structure 62 of the sound leakage reduction device, and its corresponding leakage sound reduction curve 621 shows that it forms a trough region at 5kHz to 6kHz, indicating that At this time, the resonant cavity can absorb sound waves in this frequency range, and achieve the corresponding sound leakage reduction effect;
  • the example structure 63 of the sound leakage reduction device, and its corresponding leakage sound reduction curve 631 shows that it forms a sound leakage at 3.7kHz to 4.2kHz
  • the trough area indicates that
  • the volume of the resonance cavity in addition to directly increasing or decreasing the volume of the vibration cavity to change the volume ratio (the volume of the resonance cavity can also be adjusted, or the volume of the vibration cavity and the resonance cavity can be adjusted together), it can also be punched through the outer wall
  • the equivalent volume of the vibrating cavity and the resonant cavity is set by means of the method.
  • the other structural parameters are the same, and the volume of the vibration cavity is reduced, which is the same as that achieved by the example structure 63 at 3.7kHz to 4.2kHz.
  • the frequency range absorbs sound waves (thus realizing the reduction of sound leakage in this frequency range).
  • the sound leakage reduction device Compared with the sound absorption frequency realized by the example structure 62, that is, the frequency band in the frequency range of 5kHz to 6kHz becomes higher; further, the sound leakage reduction device Compared with example structure 62, other structure parameters are the same in example structure 61, and sound leakage holes are added, and the sound absorption in the frequency range of 5kHz to 6kHz realized by example structure 62, and the sound absorption frequency realized by example structure 61, that is, 5.5kHz to 6.5 The frequency band in the kHz frequency range is also further increased. It can be seen that, in a specific frequency band (such as 3.5kHz to 6.5kHz), the larger the volume of the vibration cavity, the higher the frequency range for achieving the corresponding leakage sound reduction effect.
  • a specific frequency band such as 3.5kHz to 6.5kHz
  • the sound frequency range (such as less than 5kHz) to obtain a better leakage reduction effect, because the frequency range (such as 2.5kHz to 3.5kHz) realized by the leakage reduction device 200 described in Embodiment 1, and the frequency achieved by the leakage reduction device 300 described in Embodiment 2 range (such as 3.5kHz to 4.5kHz), all can satisfy the frequency range that the human ear is sensitive to, therefore can select the structural pattern (comprising other feasible equivalent structures) of the sound leakage reducing device shown in embodiment one, embodiment two, thereby realizes Relatively good sound leakage reduction effect.
  • 7-9 are structural schematic diagrams of sound leakage reducing devices according to some embodiments of the present application.
  • Fig. 10 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • the sound leakage reducing device 700 is provided with a first resonant cavity 210 and a second resonant cavity 220, the first resonant cavity 210 is arranged on the first side wall 230 of the vibrating cavity 140, the first resonant cavity 210 and the vibration
  • the cavity 140 is in air conduction communication through the first communication hole 231 on the first side wall 230
  • the second resonant cavity 220 is in air conduction communication with the first resonant cavity 210 through the second communication hole 241 on the second side wall 240 .
  • the respective volumes or volume ratios of the two resonant cavities, the volume ratio of the total volume of the two resonant cavities to the vibrating cavity, the number of communicating holes, and a single resonance can be selected.
  • Structural parameters such as the cavity diameter or total diameter, the length of a single communicating hole or the total effective length of the pipeline, and the ratio of various size parameters between communicating holes are set accordingly.
  • the frequency band in which the specific frequency range of leakage sound can be reduced can be realized.
  • any possible transformation setting structure may be specifically adopted, which will not be listed here.
  • the sound leakage reducing device 800 is provided with a first resonant cavity 210 and a second resonant cavity 220 , and the first resonant cavity 210 and the second resonant cavity 220 are both arranged on the first side wall 230 of the vibrating cavity 140 ,
  • the first resonance cavity 210 communicates with the vibration cavity 140 through the first communication hole 231 on the first side wall 230 through the first communication hole 231, and the second resonance cavity 220 and the vibration cavity 140 pass through the third communication hole 232 on the first side wall 230 Air connection.
  • the respective volumes or volume ratios of the two resonant cavities, the volume ratio of the total volume of the two resonant cavities to the volume of the vibrating cavity, the number, diameter or total Corresponding transformation settings are made on structural parameters such as the diameter, the length of the connecting hole pipe or the total effective length of the pipe, and the ratio of various size parameters between the connecting holes.
  • the reduction of sound leakage in a specific frequency band can be achieved by reducing the volume of a certain resonant cavity or the ratio of the total volume of two resonant cavities to the volume of the vibrating cavity.
  • any possible transformation setting structure may be specifically adopted, which will not be listed here.
  • the sound leakage reducing device 900 is provided with a third resonant cavity 310 and a fourth resonant cavity 320, the third resonant cavity 310 is arranged on the first side wall 230 of the vibrating cavity 140, the third resonant cavity 310 is connected to the vibration cavity
  • the cavity 140 communicates with the air through the first communication hole 231 on the first side wall 230, the fourth resonant cavity 320 is arranged on the third side wall 330 of the vibrating cavity 140, and the fourth resonant cavity 320 and the vibrating cavity 140 pass through the third side
  • the fourth communication hole 331 on the wall 330 communicates with air conduction.
  • the leakage reduction curve 1011 is obtained by testing the initial structure with only a vibrating cavity and no resonant cavity
  • the leakage reduction curve 1012 is obtained by testing the leakage reduction device shown in Figure 9 . According to the comparison of the sound leakage reduction curves 1012 and 1011 obtained by the test, it can be seen that the two resonant cavities of the sound leakage reduction device 900 are arranged in parallel on different side walls of the vibration cavity.
  • kHz, 4.5kHz to 5kHz form a trough region, wherein the trough region of the leakage sound in a specific frequency range (such as 1.9kHz to 2.4kHz) is generated by the setting of the fourth resonant cavity 320, in a specific frequency range (such as 2.7kHz to 3.5kHz), the sound leakage area is produced by the setting of the third resonant cavity 310.
  • a specific frequency range such as 1.9kHz to 2.4kHz
  • a specific frequency range such as 2.7kHz to 3.5kHz
  • a specific frequency range such as 4.5kHz to 5kHz
  • the depth of the trough area of the vibration chamber 140 and the depth of the trough area of the sound leakage reduction and the specific frequency range have all changed compared with those before the communication hole is not provided, indicating that in multiple specific Significant sound leakage reduction effect has been achieved in the frequency range.
  • the vibration cavity and/or resonance cavity can be configured by corresponding structural settings of volume size or communication hole size, so that the vibration cavity and And/or the sound leakage reduction trough area of the resonant cavity all falls in the frequency band of this small specific frequency range, that is, the frequency difference of the leakage sound reduction between the vibration cavity and/or the resonant cavity is in a small difference range, for example, the difference between each other
  • the values are all distributed in the interval of 0.1kHz to 0.3kHz; for another example, in order to obtain a wider specific frequency range (such as 1kHz to 5kHz), the corresponding structure of the volume size or the size of the communication hole can be set for the vibration cavity and/or resonant cavity , so that the trough areas of the vibration
  • the positions of the two resonant cavities on different side walls can be changed, the respective volumes or volume ratios of the two resonant cavities, the total volume of the two resonant cavities
  • the volume ratio of the volume to the vibrating chamber, the number of communicating holes, the diameter or the total equivalent diameter, the length of the connecting hole pipeline or the total effective length of the pipeline, and the ratio of various size parameters between the communicating holes and other structural parameters are set accordingly.
  • the volume of the resonant cavity (the fourth resonant cavity 320 shown in FIG.
  • any possible transformation setting structure may be adopted, which will not be listed here.
  • the structural parameters of the vibrating cavity and/or resonating cavity (the number of cavities, the structural shape of the cavity, the size of the cavity, the volume ratio between the vibrating cavity and the resonating cavity, the specific position of the cavity, The positional relationship between the cavities, etc.) and/or the structural parameters of the connecting holes and/or sound leakage holes (hole shape, number of holes, size of holes, etc.) to adjust the sound leakage reduction effect.
  • the leakage reduction device further provides an implementable solution that can meet the leakage reduction requirements of various frequency ranges, and can be equivalent or transformed according to the more detailed specific leakage reduction requirements.
  • the structural setting optimizes the sound leakage reduction performance to a greater extent to meet the diverse needs of users.
  • Fig. 11 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • Fig. 12 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • the sound leakage reducing device 1100 is provided with a third resonant cavity 310, a fourth resonant cavity 320, and a fifth resonant cavity 340, the third resonant cavity 310 is arranged on the first side wall 230 of the vibrating cavity 140, the second The three resonant cavities 310 communicate with the vibrating cavity 140 through the first communication hole 231 on the first side wall 230, the fourth resonant cavity 320 is arranged on the third side wall 330 of the vibrating cavity 140, the fourth resonant cavity 320 is connected to the vibrating cavity
  • the cavity 140 communicates with air conduction through the fourth communication hole 331 on the third side wall 330, the fifth resonance cavity 340 is arranged on the fourth side wall 350 of the vibration cavity 140, and the fifth resonance cavity 340 and the vibration cavity 140 pass through the fourth side wall
  • the fifth communication hole 351 on the 350 is in air conduction communication.
  • the sound leakage reduction curve 1201 is obtained by testing the initial structure with only a vibrating cavity and no resonant cavity
  • the sound leakage reduction curve 1202 is obtained by testing the sound leakage reduction device shown in Figure 9 .
  • the sound leakage test effect shown in Figure 12 it can be seen that according to the sound leakage reduction curves 1201 and 1202 obtained by the test, it can be seen that in multiple specific frequency ranges (such as 1.4kHz to 1.6kHz, 2.3kHz to 2.7kHz, 3.4kHz to 3.8kHz, 4.3kHz to 4.7kHz) to produce a plurality of trough regions, wherein, in a specific frequency range (such as 1.4kHz to 1.6kHz) the trough region of the leakage sound is generated by the setting of the third resonant cavity 310, The trough region of sound leakage reduction in a specific frequency range (such as 2.3kHz to 2.7kHz) is generated by the setting of the fourth resonant cavity 320,
  • the depth of the sound leakage reduction trough area and the specific frequency range have all changed, indicating that a significant leakage reduction effect has been achieved in multiple specific frequency ranges, which is different from the leakage reduction device 900 described in the fifth embodiment.
  • a specific frequency band such as the frequency range of 1kHz to 5kHz
  • it has the characteristics of lower frequency band trend and more comprehensive frequency band distribution, and the low frequency band leakage reduction effect is more significant.
  • Respectively or overall structural combination setting to realize the corresponding frequency range of leakage reduction in order to focus on a specific frequency range (such as 1kHz to 3kHz) to strengthen its sound leakage reduction effect, the vibration cavity and/or resonant cavity can be configured by corresponding structural settings of volume size or communication hole size, so that the vibration cavity and/or resonant cavity Or the trough areas of the resonant cavity’s leakage reduction sound fall in the frequency band of this small specific frequency range, that is, the frequency difference of the leakage reduction sound between the vibration cavity and/or the resonant cavity is in a small difference range, such as the mutual difference are evenly distributed in the interval of 0kHz to 0.2kHz; for another example, in order to obtain a wider specific frequency range (such as 1kHz to 6kHz), the vibration cavity and/or resonant cavity can be configured by corresponding structural settings of volume size or communication hole size, so that The
  • the frequency range of the trough area generated by the third resonant cavity 310 is located in the 1kHz to 2kHz frequency band
  • the fourth The frequency range of the trough area generated by the resonant cavity 320 is located in the frequency range of 2kHz to 3.5kHz
  • the frequency range of the trough area generated by the fifth resonant cavity 340 is located in the frequency range of 3.5kHz to 5kHz
  • the frequency range of the trough area generated by the vibration cavity 140 is located in the frequency range of 5kHz to 6kHz band.
  • the positions of the three resonant cavities on different side walls can be changed, the respective volumes or volume ratios of the three resonant cavities, the total volume of the two resonant cavities
  • the ratio of volume or equivalent volume to the volume of the vibration cavity, the number of communicating holes, diameter or total equivalent diameter, the length of communicating holes or the total effective length of the pipeline, and the ratio of various dimensional parameters between communicating holes and other structural parameters make corresponding transformation settings. Exemplarily, as shown in FIG.
  • the structural parameters of the vibrating cavity and/or resonating cavity (the number of cavities, the structural shape of the cavity, the size of the cavity, the volume ratio between the vibrating cavity and the resonating cavity, the specific position of the cavity, The positional relationship between the cavities, etc.) and/or the structural parameters of the connecting holes and/or sound leakage holes (hole shape, number of holes, size of holes, etc.) to adjust the sound leakage reduction effect.
  • Fig. 13 is a sound leakage curve diagram of a sound leakage reduction device according to some embodiments of the present application, showing a variety of conversion structure settings with resonant cavities, specifically including an example structure of a cavity in series (as shown in Figure 1, Two cavities in series (as shown in Figure 9) and three cavities in series (as shown in Figure 11), by comparing the sound leakage reduction effect with the structure without resonant cavity, whether it is a series of one cavity structure, Whether it is a series-parallel two-cavity structure or a series-parallel three-cavity structure, the trough areas formed are distributed between 1.5kHz and 5kHz in the frequency range. It can reach 30dB, and each corresponding structural setting with a resonant cavity can realize the corresponding frequency range of leakage reduction as required, so as to meet the leakage reduction requirements of various working scenarios.
  • the resonant cavities described in the embodiments of the present application may be a cavity structure disposed inside the vibrating cavity 140 and formed by at least one baffle and the inner wall of the housing 130 .
  • the aforementioned resonant cavity may be a cavity structure formed by one (or one) baffle and three inner walls of the casing 130 .
  • the aforementioned resonant cavity may be a cavity structure formed by two (or two) baffles and inner walls on both sides of the casing 130 .
  • the aforementioned resonant cavity may be a cavity structure formed by an integrally formed baffle and an inner wall of one side of the housing 130 , for example, the integrally formed baffle may be a hollow cuboid, a hollow cube, or the like.
  • the aforementioned resonant cavity may be a non-closed cavity with an opening.
  • Fig. 14 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • the resonant cavities described in the embodiments of the present application can perform structural transformation of the resonant cavity as shown in FIG. 14 .
  • one or more resonant cavities can be formed by a plurality of baffles 190 structures or columns arranged on the inner wall of the vibrating cavity 140 (or the inner wall of the housing 130).
  • the structure and the inner wall of the vibration cavity 140 form a non-closed cavity (such as the resonance cavity 191 ).
  • the number, height h, and width s of the resonant cavity of the baffles 190 can be selected within a corresponding range of values.
  • the height h of the baffle 190 and the width s of the resonant cavity of different resonant cavities may be the same or different.
  • the specific frequency of leakage reduction achieved by different resonant cavities may be the same or different.
  • the baffle 190 may be disposed on any inner wall of the vibration chamber 140 (or any inner wall of the housing 130 ), such as other inner walls of the vibration chamber 140 not shown in FIG. 14 . It should be noted that the deformed structure of the resonant cavity here is only exemplary. Within the scope of the inventive concept of the present application, other transformations or deformed structures that can achieve the effect of reducing sound leakage at a corresponding specific frequency can also be made. The embodiments of the present application do not make special limit.
  • Fig. 15 is a schematic structural diagram of a sound leakage reducing device according to some embodiments of the present application.
  • the predetermined distance d refers to the distance between the upper surface of the vibrating panel 121 and the outer surface of the side wall 123 of the casing 130 .
  • the size of the predetermined distance d can be adjusted by adjusting the height of the vibration conducting member 122 outside the casing 130 .
  • the height of the vibration conducting element 122 refers to the height of the vibration conducting element 122 in the Y-axis direction, that is, the vibration direction of the transducer structure 110 .
  • the predetermined distance d between the vibrating panel 120 and the casing 130 may affect the size of the opening (or gap) between the vibrating structure 120 and the casing 130 .
  • the size of the predetermined distance d between the vibrating panel 121 and the casing 130 may be positively correlated with the size of the opening between the vibrating structure 120 and the casing 130 . Specifically, the larger the predetermined distance d between the vibrating panel 121 and the casing 130, the larger the opening size between the vibrating structure 120 and the casing 130, and the smaller the predetermined distance d between the vibrating panel 121 and the casing 130, The size of the opening between the vibration structure 120 and the housing 130 is smaller.
  • the additional noise reduction for the leakage reduction device 1500 can be adjusted. Influence. Specifically, it can be shown that the larger the predetermined distance d between the vibrating panel 121 and the housing 130 , the larger the size of the hole between the vibrating structure 120 and the housing 130 , and the stronger the noise leakage reducing capability of the noise leakage reducing device 100 .
  • the predetermined distance d between the vibrating panel 121 and the housing 130 can be relatively set in a larger range.
  • the range of the predetermined distance d may be between 0.5mm-4mm. In some embodiments, in order to obtain a more appropriate sound leakage reduction effect, the range of the predetermined distance d may be between 1mm-3mm.
  • Fig. 16 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • Leakage curve 1601 represents the sound leakage curve of the sound leakage reducing device with the first predetermined distance
  • sound leakage curve 1602 represents the sound leakage curve of the sound leakage reducing device with the second predetermined distance
  • sound leakage curve 1603 represents the sound leakage curve with the third predetermined distance
  • the sound leakage curve of the sound leakage reduction device wherein, the first predetermined distance is smaller than the second predetermined distance, and the second predetermined distance is smaller than the third predetermined distance.
  • the frequency range of the sound leakage reduction curve 1601 is the widest, followed by the sound leakage curve 1602.
  • the sound leakage curve 1603 shows that the sound leakage reduction effect is hardly improved. It can also be understood that the sound leakage reducing effect of the sound leakage reducing devices 1500 arranged with different first pitches, second pitches, and third pitches varies from strong to weak.
  • the area and shape of the vibrating panel 121 can affect the size of the sound leakage of the sound leakage reducing device 1500 , thereby affecting the sound leakage reducing effect of the sound leakage reducing device 1500 . Specifically, it can be expressed that the larger the area of the vibrating panel 121 is, the weaker the sound leakage reducing effect of the sound leakage reducing device is.
  • the vibrating panel 121 is in contact with a human body part (for example, a face), and sound can be transmitted to the user through the vibrating panel 121 .
  • the area of the vibrating panel 131 may be smaller.
  • the area of the vibration panel 121 in order to meet the product requirements of a wide range of vibration panels and qualified sound leakage, the area of the vibration panel 121 may be 9 mm 2 -700 mm 2 . In some embodiments, in order to obtain a more appropriate sound leakage reduction effect, the area of the vibrating panel 121 may be 25mm 2 -330mm 2 .
  • the shape of the vibrating panel 121 may be a regular and/or irregular shape such as a circle, a rectangle, an ellipse, and a pentagon. It should be noted that the sound leakage reducing device 1500 may not include the vibration panel 121, the vibration conducting member 122 is in contact with the body parts, and the vibration generated by the transducing structure 110 is directly transmitted to the user through the vibration conducting member 122, so as to reduce the vibration of the structure. 120 and the user's contact area, thereby reducing the sound leakage of the sound leakage reducing device 1500.
  • Fig. 17 is a graph of sound leakage curves of the sound leakage reducing device according to some embodiments of the present application.
  • Leakage curve 1701 represents the sound leakage curve of the sound leakage reducing device of the first vibration panel area
  • sound leakage curve 1702 represents the sound leakage curve of the sound leakage reducing device of the second vibration panel area
  • sound leakage curve 1703 represents the third vibration panel area
  • the sound leakage curve 1704 represents the sound leakage curve of the sound leakage reducing device of the fourth vibrating panel area.
  • the area of the vibrating panel in descending order is the area of the first vibrating panel, the area of the second vibrating panel, the area of the third vibrating panel, and the area of the fourth vibrating panel. Comparing the sound leakage curve 1701, the sound leakage curve 1702, the sound leakage curve 1703, and the sound leakage curve 1704, it can be seen that within a specific frequency range (for example, 3kHz-5kHz), the sound leakage reduction effect of the sound leakage curve 1701 is the worst, and the leakage The second is the sound leakage curve 1702, the third is the sound leakage curve 1703, and the sound leakage reduction effect of the sound leakage curve 1704 is the best.
  • a specific frequency range for example, 3kHz-5kHz
  • the sound leakage reduction effect of the sound leakage reducing device 1500 is the sound leakage curve 1704 , the sound leakage curve 1703 , the sound leakage curve 1702 , and the sound leakage curve 1701 in descending order.
  • Fig. 18 is a schematic structural diagram of an acoustic output device according to some embodiments of the present application.
  • an acoustic output device 1800 may include a transducing structure 110 , a vibrating structure 120 and a housing 130 .
  • the acoustic output device shown in FIG. 18 may include any of the aforementioned sound leakage reducing devices (such as the sound leakage reducing device 100 , the sound leakage reducing device 200 , the sound leakage reducing device 300 , etc.).
  • One or more components in the acoustic output device 1800 may be the same or similar to one or more components in the aforementioned sound leakage reducing device, for example, the housing 130 , the vibrating cavity 140 , the resonating cavity 150 , the communication hole 160 and so on.
  • the acoustic output device 1800 may be a speaker.
  • the speaker may be a bone conduction speaker, an air conduction speaker, or a combined bone and air conduction speaker.
  • the speaker may be any other feasible speaker, which is not particularly limited in this embodiment of the present application.
  • the acoustic output device 1800 may be a device that converts sound signals into mechanical vibrations of different frequencies.
  • the acoustic output device 1800 may be an earphone (such as a bone conduction earphone, etc.), a hearing aid (such as a bone conduction hearing aid, etc.), and the like.
  • the transducer structure 110 of the acoustic output device 1800 can convert sound signals into mechanical vibrations.
  • One end of the vibration structure 120 is directly or indirectly connected to the transducer structure 110 and generates vibration based on the mechanical vibration of the transducer structure 110 .
  • the earphones may be headphones, earphones, behind-the-ear earphones, in-ear earphones, open earphones, split earphones, around-ear earphones, neck-hung earphones, neckband earphones Or glasses-type earphones, etc., the embodiment of the present application does not specifically limit the specific structural style of the foregoing earphones.
  • the vibration structure 120 may include a vibration panel 121 and a vibration conductor 122 .
  • the vibrating panel 121 can be located at the end of the vibrating structure 120 away from the transducing structure 110 , the vibrating conductor 122 is located at the end of the vibrating structure 120 close to the transducing structure 110 , and the vibrating panel 121 is connected to the vibrating conducting component 122 .
  • An opening can be provided on the side wall 123 of the housing 130 , and the vibration conducting member 122 runs through the opening, so that one end of the vibration conducting member 122 (the end away from the vibrating panel 121 ) can extend into the vibration cavity 140 and be connected to the housing bracket 410 .
  • the shell bracket 410 may be a part of the shell 130 or a separate component, which is directly or indirectly connected to the inside of the shell 130 .
  • the housing bracket 410 may be fixed on the inner surface of the housing 130 .
  • the shell bracket 410 can be pasted on the shell 130 by glue, for example, elastically connected to the shell 130 by the elastic connector 430, or can be connected by stamping, injection molding, clamping, riveting, screwing or welding. It is fixed on the casing 130, which is not particularly limited in this embodiment of the present application.
  • the housing bracket 410 may be provided with at least one bracket hole 411 .
  • the bracket hole 411 can lead the vibration sound wave in the vibration chamber 140 out of the housing 130 , and interfere with the sound leakage sound wave generated by the vibration of the housing 130 to reduce the amplitude of the sound leakage sound wave, thereby reducing the sound leakage of the acoustic output device 1800 .
  • the bracket hole 411 may be in a regular and/or irregular shape such as a circle, an ellipse, a rectangle, which is not particularly limited in this embodiment of the present application.
  • the number of bracket holes 411 can be adjusted adaptively according to the application scenario of the acoustic output device 1800 , which is not particularly limited in this embodiment of the present application.
  • the transducing structure 110 may include a magnetic circuit device 111 , a coil 112 and a vibration transmitting sheet 113 .
  • the transducing structure 110 may be located inside the housing 130 and disposed on the housing bracket 1510 .
  • One end of the vibration transmission piece 113 is connected to the magnetic circuit device 111
  • the other end of the vibration transmission piece 113 is connected to the housing bracket 410
  • the vibration structure 120 eg, the vibration conductor 122
  • the coil 112 may be fixed on the housing support 410 and drive the vibrating structure 120 to vibrate through the housing support 410 .
  • the magnetic circuit device 111 can be used to form a magnetic field, and the coil 112 can mechanically vibrate in the magnetic field.
  • the coil 112 can be fed with a signal current, and the coil 112 is placed in the magnetic field formed by the magnetic circuit device 111 , and is subjected to the action of the Ampere force in the magnetic field to receive the drive to generate mechanical vibration.
  • the mechanical vibration of the coil 112 may be transmitted to the housing support 410 , which in turn transmits the mechanical vibration to the vibrating structure 120 .
  • the mechanical vibration is transmitted to the user through the vibration conductor 122 and the vibration panel 121 in the vibration structure 120 .
  • the magnetic circuit device 111 may include one or more magnetic elements (not shown in the figure), and the magnetic elements may be in any feasible structural form, such as ring magnetic elements and the like.
  • a plurality of magnetic elements can increase the total magnetic flux, and different magnetic elements interact to suppress leakage of magnetic induction lines, increase magnetic induction at the magnetic gap, and improve the sensitivity of the speaker (such as a bone conduction speaker).
  • the magnetic circuit device 111 may include a magnetically permeable element (not shown in the figure), and the magnetically permeable element may take any feasible structural form, such as a magnetically permeable plate or a magnetically permeable cover.
  • the magnetic permeable cover can close the magnetic circuit generated by the magnetic circuit device 111, so that more magnetic induction lines are concentrated in the magnetic gap in the magnetic circuit device 111, so as to suppress magnetic flux leakage and increase the magnetic field at the magnetic gap. Magnetic induction and the effect of improving the sensitivity of speakers (such as bone conduction speakers).
  • the housing 130 of the acoustic output device 1800 may be provided with an earhook element 420 .
  • the earhook element 420 may be used to assist a user in wearing the acoustic output device 200 .
  • the earhook element may be a connector of a headphone to a headband. Taking the acoustic output device 200 as an example of a rear-mounted bone conduction device, the end of the ear-hook element 420 can be connected to the side wall of the housing 130 of the acoustic output device 1800.
  • the ear-hook element 420 When the user wears the acoustic output device 1800, the ear-hook element 420 The end of may be located near the pinna of the user, so that the acoustic output device 1800 is located near the pinna of the user. Further, by changing the position of the housing 130 relative to the earhook element 420 and/or the shape and structure of the earhook element 420 , the position and distance of the acoustic output device 1800 relative to the pinna of the user can be adjusted.
  • connection manner between the housing 130 of the acoustic output device 1800 and the ear hook element 420 may be a fixed connection.
  • the fixed connection here may refer to connection methods such as bonding, riveting, and integral formation.
  • connection manner between the acoustic output device 1800 and the ear hook element 420 may also be a detachable connection.
  • the detachable connection here may refer to connection methods such as buckle connection and screw connection.
  • the structural shape of the ear-hook element 420 can be any shape suitable for the auricle such as arc, semicircle, or broken line, and the structural shape of the ear-hook element 420 can be adaptively adjusted according to the user's needs. , the embodiment of the present application is not particularly limited.
  • the vibrating structure 120 and the housing 130 may be elastically connected, that is, fixedly connected in an elastically connected manner.
  • acoustic output device 1800 may include elastic connector 430 .
  • the elastic connecting member 430 may be located in the vibrating cavity 140 for connecting the vibrating structure 120 and the casing 130 .
  • one end of the elastic connecting member 430 may be connected to the vibration conducting member 122 of the vibrating structure 120
  • the other end of the elastic connecting member 430 may be connected to the inner wall of the casing 130 .
  • the vibration conductor 122 vibrates in response to the mechanical vibration generated by the transducer structure 110, and transmits the vibration signal to the housing 130 through the elastic connector 430, so that The housing 130 generates mechanical vibrations.
  • the elastic connecting member 430 may be in the shape of a round tube, a square tube, a special-shaped tube, a ring, a flat plate, etc., which are not specifically limited in this embodiment of the present application.
  • the elastic connector 430 may be an elastic element.
  • the material of the elastic element may be a material capable of elastic deformation, such as silica gel, metal, rubber, etc., which is not particularly limited in this embodiment of the present application.
  • the elastic element is more likely to be elastically deformed than the casing 130 , so that the casing 130 can move relative to the transducer structure 110 .
  • references to "an embodiment” or “an embodiment” or “an alternative embodiment” two or more times in different places in this application do not necessarily refer to the same embodiment .
  • certain features, structures or characteristics of one or more embodiments of the present application may be properly combined.
  • numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of the embodiments use the modifiers "about”, “approximately” or “substantially” in some examples. grooming. Unless otherwise stated, “about”, “approximately” or “substantially” indicates that the stated figure allows for a variation of ⁇ 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that can vary depending upon the desired characteristics of individual embodiments. In some embodiments, numerical parameters should take into account the specified significant digits and adopt the general digit reservation method. Although the numerical ranges and parameters used in some embodiments of the present application to confirm the breadth of the scope are approximate values, in specific embodiments, such numerical values are set as precisely as practicable.

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  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • General Health & Medical Sciences (AREA)
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Abstract

本申请实施例公开了一种降漏音装置，包括换能结构、振动结构和壳体；所述壳体具有振动腔和至少一个谐振腔；所述换能结构位于所述振动腔内，并与所述振动结构连接；所述至少一个谐振腔与所述振动腔通过至少一个连通孔连通，所述每个谐振腔的容积小于所述振动腔的容积。

Description

一种降漏音装置及声学输出装置 技术领域
本申请涉及声音传导技术领域，特别涉及一种降漏音装置及声音输出装置。
背景技术
以骨传导为声音主要传播方式之一的扬声器，其传声(声音传导)振动部件可以根据电信号(例如，来自信号处理电路的控制信号)进行机械振动，并基于机械振动产生传导声波，最终传递至人体。传统的扬声器的传声振动部件在机械振动过程中，会将机械振动传递至扬声器的壳体结构，致使壳体结构发生振动，壳体结构振动会推动周围的空气产生振动，从而产生漏音，影响扬声器的传声性能。
发明内容
本申请实施例之一提供一种降漏音装置，包括换能结构、振动结构和壳体；所述壳体具有振动腔和至少一个谐振腔；所述换能结构位于所述振动腔内，并与所述振动结构连接；所述至少一个谐振腔与所述振动腔通过至少一个连通孔连通，所述每个谐振腔的容积小于所述振动腔的容积。
本申请实施例之一提供一种声学输出装置，包括本申请实施例任一方案所述的降漏音装置。
附图说明
本申请将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1是根据本申请一些实施例所示的降漏音装置的结构示意图；
图2是根据本申请一些实施例所示的降漏音装置的结构示意图；
图3是根据本申请一些实施例所示的降漏音装置的结构示意图；
图4是根据本申请一些实施例所示的降漏音装置的结构示意图；
图5是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图6是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图7是根据本申请一些实施例所示的降漏音装置的结构示意图；
图8是根据本申请一些实施例所示的降漏音装置的结构示意图；
图9是根据本申请一些实施例所示的降漏音装置的结构示意图；
图10是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图11是根据本申请一些实施例所示的降漏音装置的结构示意图；
图12是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图13是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图14是根据本申请一些实施例所示的降漏音装置的结构示意图；
图15是根据本申请一些实施例所示的降漏音装置的结构示意图；
图16是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图17是根据本申请一些实施例所示的降漏音装置的漏音曲线图；
图18是根据本申请一些实施例所示的声学输出装置的结构示意图。
附图标记说明
110-换能结构、120-振动结构、121-振动面板、122-振动传导件、130-壳体、131、132、133-外壁、140-振动腔、150-谐振腔、160-连通孔、170、123-侧壁、180、181、182-泄声孔、210-第一谐振腔、220-第二谐振腔、230-第一侧壁、231-第一连通孔、240-第二侧壁、241-第二连 通孔、232-第三连通孔、310-第三谐振腔、320-第四谐振腔、330-第三侧壁、331-第四连通孔、340-第五谐振腔、350-第四侧壁、351-第五连通孔、190-挡板，191、192、196-谐振腔体，1800-声学输出装置、111-磁路器件、112-线圈、113-传振片、410-壳体支架、411-支架孔、420-耳挂元件、430-弹性连接件。
具体实施方式
为了更清楚地说明本申请实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本申请应用于其它类似情景。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
应当理解，本文使用的“系统”、“装置”、“单元”和/或“模块”是用于区分不同级别的不同组件、元件、部件、部分或装配的一种方法。然而，如果其他词语可实现相同的目的，则可通过其他表达来替换所述词语。
如本申请和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其它的步骤或元素。
本申请中使用了流程图用来说明根据本申请的实施例的系统所执行的操作。应当理解的是，前面或后面操作不一定按照顺序来精确地执行。相反，可以按照倒序或同时处理各个步骤。同时，也可以将其他操作添加到这些过程中，或从这些过程移除某一步或数步操作。
图1是根据本申请一些实施例所示的降漏音装置的结构示意图。
降漏音装置100可以包括换能结构110、振动结构120和壳体130，壳体130具有振动腔140和至少一个谐振腔150，换能结构110位于振动腔140内，并与振动结构120连接，谐振腔150与振动腔140通过至少一个连通孔160连通，其中谐振腔150的容积小于振动腔140的容积。换能结构110可以带动振动结构120振动而产生传递至人耳的声音，谐振腔150用于吸收由换能结构110在振动腔140内产生的特定频率的声音，从而抑制降漏音装置100在特定频率产生的漏音。
降漏音装置100可以是用于降低扬声器漏音的装置。在一些实施例中，降漏音装置100可以是以骨传导为声音主要传播方式之一的扬声器。例如，振动结构120可以与用户脸部皮肤大面积接触并将其机械振动传递给皮肤而使用户听到声音。在一些实施例中，扬声器可以是骨传导扬声器、气传导扬声器或骨气导结合的扬声器。在另一些实施例中，扬声器可以是其他任何可行的扬声器，本申请实施例不对此作特别限定。以骨传导扬声器为例，降漏音装置100中的谐振腔150可以吸收由换能结构110在振动腔体内(即骨传导形式的振动腔)产生的特定频率的声音，从而抑制在特定频率产生的漏音。
换能结构110是实现电信号转向机械振动转换的部件。在一些实施例中，换能结构110可以采用磁性组件和音圈的结构方式，即通过电磁作用将音频电信号输入音圈，音圈置入磁场中以驱动音圈的振动。在一些实施例中，换能结构110可以采用压电陶瓷的结构方式，将电信号转换为陶瓷部件的形状变化而产生振动。在另一些实施例中，换能结构110可以采用其他任何可行的结构形式，本申请实施例不对此作特别限定。
在一些实施例中，换能结构110可以使用特定的磁路组件与振动组件实现含有声音信息的信号向机械振动转换。在一些实施例中，前述转换的过程中可能包含多种不同类型能量的共存和转换。例如，电信号通过换能结构110可以直接转换成机械振动，产生声音。再例如，声音信息可以包含在光信号中，通过特定的换能结构110可以实现由光信号转换为振动信号的过程。再例如，在换能结构110工作过程中共存和转换的能量类型还可以包括其他类型， 如热能、磁场能等。在一些实施例中，换能结构110的能量转换方式可以包括动圈式、静电式、压电式、动铁式、气动式、电磁式等。在一些实施例中，换能结构110中振动组件的振动体可以是镜面对称的结构、中心对称的结构或者非对称的结构。在一些实施例中，前述振动体可以是圆环体结构，在圆环体内设置向中心辐辏的多个支杆，支杆的个数可以是两个或者更多。在一些实施例中，前述振动体上可以设置有间断的孔状结构，使振动体产生更大的位移，从而提高振动与声音的输出功率，实现更高的灵敏度。
壳体130是用于容置换能结构110并形成振动腔140的外壳结构。在一些实施例中，壳体130可以是容置换能结构110的单腔体结构。在一些实施例中，壳体130可以是容置换能结构110的多腔体(即形成的振动腔不止一个)结构。在一些实施例中，壳体130的结构形状可以是圆柱形、方形或其他任何可行的结构形状。在另一些实施例中，壳体130可以采用其他可行的结构形式或结构形状，本申请实施例不对其作特别限制。
振动腔140是由壳体130与壳体130内的换能结构110形成的振动腔体。在一些实施例中，换能结构110产生的机械振动传递至振动结构120，振动结构120在换能结构110的带动下同步振动，同时，换能结构110相对于壳体130的振动也会在振动腔140内产生声波。
在一些实施例中，换能结构110可以在振动腔内形成磁场，磁场可以用于将含有声音信息的信号转化为振动信号。在一些实施例中，前述声音信息可以包括具有特定数据格式的视频、音频文件或可以通过特定途径转化为声音的数据或文件。在一些实施例中，前述含有声音信息的信号可以来自于降漏音装置100本身的存储组件，也可以来自于降漏音装置100以外的信息产生、存储或者传递系统。在一些实施例中，前述含有声音信息的信号可以包括电信号、光信号、磁信号、机械信号等一种或多种的组合。在一些实施例中，前述含有声音信息的信号可以来自一个信号源或多个信号源。在一些实施例中，前述多个信号源可以相关也可以不相关。
在一些实施例中，降漏音装置100可以通过多种不同的方式获取前述含有声音信息的信号，信号的获取可以是有线的或无线的，可以是实时或延时的。例如，降漏音装置100可以通过有线或者无线的方式接收含有声音信息的电信号，也可以直接从存储介质上(例如，存储组件)获取数据，产生声音信号。又例如，降漏音装置100中可以包括具有声音采集功能的组件，通过拾取环境中的声音，将声音的机械振动转换成电信号，通过放大器处理后获得满足特定要求的电信号。在一些实施例中，前述存储介质可以存储含有声音信息的信号。在一些实施例中，前述存储介质可以采用任何可行的存储形式，例如，可以包括一个或多个存储设备等等。
振动结构120可以是实现将机械振动传递至人耳，具体地可以将机械振动通过人体皮肤(例如，脸部皮肤)传递的部件。在一些实施例中，振动结构120可以包括振动面板121和振动传导件122。振动传导件122远离换能结构110的一端可以位于壳体130的外部，并与同样位于壳体130外部的振动面板121连接。振动传导件122的另一端(远离振动面板121的一端)可以贯穿壳体130伸入到振动腔140内，使得振动传导件122一部分位于发生腔140内并与换能结构110连接。换能结构110产生的机械振动可以通过振动传导件122传递至振动面板121，振动面板121与人体皮肤(例如，脸部皮肤)接触，进而将机械振动(即，骨传导声波)传递至用户人耳。
在一些实施例中，振动面板121的结构形状可以是圆柱形、方形或其他任何可行的结构形状。在另一些实施例中，振动面板121可以采用其他可行的结构形式或结构形状，本申请实施例不对其作特别限制。
在一些实施例中，振动结构120与换能结构110的连接方式不限于上述的直接连接，还可以是间接连接。例如，降漏音装置100还可以包括连接件(未示出)，连接件可以位于振动腔140中，连接件的一端可以与壳体130的内壁连接，连接件的另一端与振动结构120(例如，振动传导件122)连接。换能结构110产生的机械振动可以传递至壳体130，壳体130的 振动可以通过连接件传递至振动结构120的振动传导件122，骨传导声波进而通过振动面板121传递给用户。在一些实施例中，可以将壳体130上用于封闭壳体上表面的组件作为连接件，连接振动面板121与振动传导件122，无需再额外设置一部件作为连接件，提高振动传导效率，同时具备结构紧凑性的优点。
在一些实施例中，壳体130可以是一体成型的。在一些实施例中，壳体130也可以是通过插接、卡接等方式装配而成的。在一些实施例中，壳体130可以由金属材料(例如，铜、铝、钛、金等)，合金材料(例如，铝合金、钛合金等)，塑料材料(例如，聚乙烯、聚丙烯、环氧树脂、尼龙等)、纤维材料(例如，醋酸纤维、丙酸纤维、碳纤维等)等制成。在一些实施例中，壳体130外部可以设置有护套，护套可由具有一定弹性的软质材料制成，例如软质的硅胶、橡胶等等，为用户佩戴提供较好的触感。
谐振腔150是用于吸收由换能结构110在振动腔140内产生的特定频率的声音，从而抑制降漏音装置110在特定频率产生的漏音。
示例性地，为了便于理解，可以将谐振腔150等效为亥姆霍兹共振腔体，当振动腔140内漏音声波的频率与谐振腔150的自振频率一致时发生共振，漏音声波与谐振腔150的内壁相互摩擦从而消耗声能，达到吸声的目的。其中，亥姆霍兹共振腔体的中心频率可以通过公式(1)计算得到：
Figure PCTCN2021125794-appb-000001
其中，f 0表示亥姆霍兹共振腔体的中心频率，r表示亥姆霍兹共振腔体的管道半径，l 0表示亥姆霍兹共振腔体的管道长度，S表示亥姆霍兹共振腔体的管道截面面积，V 0表示亥姆霍兹共振腔体的容积，c表示空气中的声音传播的速度。
在一些实施例中，壳体130的外壳上可以设置泄声孔，从而将振动腔140内的声波导出壳体130并与壳体130振动而产生的漏音声波干涉相消以降漏音。这种降漏音方式虽然在一定程度上减少了漏音，但在较广频率范围内，对特定频率声波的降漏音效果并不理想。通过进一步在振动腔140外增设谐振腔150，并调整振动腔140和谐振腔150的结构以及设置方式，可以做到针对性地吸收振动腔140内特定频率范围的声波，进而对从泄声孔处导出的声波进行调整，从而改善设置泄声孔的降漏音效果。在一些实施例中，壳体130的外壳上可以不设置泄声孔，此时，谐振腔150在吸收振动腔140中部分声波时形成的振动，可以对壳体130的振动进行调节，同样可以达到降低壳体130漏音的效果。
在一些实施例中，谐振腔150可以是在振动腔140基础上增设的谐振腔体。例如，谐振腔150和振动腔140可以共用一个侧壁，通过侧壁上一个或多个连通孔160实现声学连通。在一些实施例中，谐振腔150可以是独立于振动腔140之外的谐振腔体。例如，谐振腔150和振动腔140分别具有独立的侧壁，相互之间通过一个或多个导声管实现声学连通。在一些实施例中，谐振腔150可以包括一个谐振腔体或多个谐振腔体。在一些实施例中，振动腔140与谐振腔150之间，或者，谐振腔150的多个谐振腔体彼此之间，设有能够实现气导连通的至少一个孔。示例性地，如图1所示，用于分隔谐振腔150与振动腔140的侧壁170上可以设置至少一个连通孔160(可以看作是亥姆霍兹共振腔体的管道部分)，至少一个连通孔160用于实现振动腔140与谐振腔150之间的气导连通。在另一些实施例中，谐振腔150还可以是其他任何可行的谐振腔体，本申请实施例不对其特别限定。
在一些实施例中，谐振腔150的腔体壁(如侧壁170)可以采用与壳体130同样的材质。在一些实施例中，谐振腔150可以由金属材料(例如，铜、铝、钛、金等)，合金材料(例如，铝合金、钛合金等)，塑料材料(例如，聚乙烯、聚丙烯、环氧树脂、尼龙等)、纤维材料(例如，醋酸纤维、丙酸纤维、碳纤维等)等制成。
本申请实施例在传统振动腔之外增设谐振腔，通过具体结构设置的谐振腔，吸收或抵消振动腔内特定频率的声波，从而满足降低壳体漏音的效果。另外，该种结构设置具有结构简单、易于加工等优点。
在一些实施例中，谐振腔150可以降低特定频率的漏音，即吸收特定频率范围的声波。所述特定频率范围的声波可以在20Hz～10000Hz(10kHz)的频率范围内。在一些实施例中，该特定频率范围的声波可以位于人耳比较敏感的频率区间，例如,1kHz～3kHz等频率范围，以便能够提高在此频率区间的降漏音效果。
在一些实施例中，为了实现降漏音装置100满足多种声音传导场景的多种降漏音需求(例如，降低特定频率范围的漏音等)，可以对降漏音装置100进行多种结构变换设置。在一些实施例中，至少一个谐振腔150可以包括多个谐振腔150，多个谐振腔150设于振动腔140的同一侧壁(如图8所示)或不同侧壁(如图9所示)上，每个谐振腔150与振动腔140之间可以通过至少一个连通孔160或者导声管气导连通。例如，如图1、图7、图11所示，可以对谐振腔150的数量进行变化设置，谐振腔150的数量既可以设置一个，也可以设置多个；也可以对谐振腔150的具体设置位置进行变换设置，谐振腔150可以设置于壳体130的任一侧壁上，不同谐振腔150既可以设置在同一侧壁上，也可以设置在不同侧壁上。再例如，连通孔160的数量既可以设置一个，也可以设置多个。在一些实施例中，可以根据不同降漏音需求，可以在谐振腔150的腔体数量上、腔体大小、腔体具体设置位置、腔体间位置关系、腔体结构形状进行相应不同设置，本申请实施例不作特别限定。
在一些实施例中，为了使得谐振腔150能够吸收目标频率范围内的声波，根据公式(1)以及结合振动腔140的实际尺寸，一个(或每个)谐振腔150与振动腔140之间的容积比不小于0.1，使得谐振腔、振动腔在尽可能宽的容积取值范围内，也可实现特定频率的降漏音效果。在一些实施例中，在一些实施例中，每个谐振腔150与振动腔140之间的容积比为0.1～1，使得谐振腔、振动腔在较宽的容积取值范围内，也可实现特定频率的降漏音效果。一个谐振腔150与振动腔140之间的容积比可以设置为1/10～1/1，或者，单个谐振腔的容积或多个谐振腔的总容积(如第一谐振腔210或第二谐振腔220，再例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)与振动腔140容积之间的容积比可以设置为1/10～1/1，以便谐振腔在进行声波吸收时覆盖可能的漏音频率范围，提高降漏音效率。在一些实施例中，根据目标频率范围的选取，一个谐振腔150与振动腔140之间的容积比可以设置为1/8～2/3，或者单个谐振腔的容积或多个谐振腔的总容积(如第一谐振腔210或第二谐振腔220，再例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)与振动腔140容积之间的容积比可以设置为1/8～2/3。在一些实施例中，为了同时保证谐振腔的容积能够在合适的尺寸范围之内，一个谐振腔150与振动腔140之间的容积比可以设置为1/5～1/2，或者，单个谐振腔的容积或多个谐振腔的总容积(如第一谐振腔210或第二谐振腔220，再例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)与振动腔140之间的容积比可以设置为1/5～1/2。在一些实施例中，单个谐振腔或多个谐振腔(如谐振腔150、第一谐振腔210或第二谐振腔220，再例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)的降漏音频率范围可以根据公式(1)计算得到。
在一些实施例中，振动腔和/或谐振腔的外壁上可以设有泄声孔180，使得在谐振腔150降漏音基础上，进一步通过将振动腔内部分声波引出至壳体130外部与壳体130振动推动壳外空气所形成的漏音声波发生干涉以消减漏音振幅，从而进一步降低了漏音。通过在外壳上进一步开设孔的便捷改进，能够更进一步地优化降漏音效果，且不增加结构容积和重量。
在一些实施例中，可以根据不同降漏音需求，在连通孔160、泄声孔180的孔数量、孔尺寸大小及孔之间尺寸大小比例、孔开设位置和/或孔结构形状(例如，孔结构形状为圆孔或方孔，再例如，孔结构形状为连通孔或非连通孔，等等)上进行相应不同设置。例如，可以将连通孔160的直径D 1与泄声孔180的直径D 2的比设置为1/2～2，将连通孔160的管道长度L 1与泄声孔180的管道长度L 2的比设置为1/2～2。在一些实施例中，连通孔160或泄声孔180可以是气导(即空气传导)连通孔。在一些实施例中，连通孔160可以是用于实现振动腔140与谐振腔150之间连通的连通孔。在一些实施例中，泄声孔180可以是设于壳体130任一外 壁(包括振动腔140或谐振腔150的任一外壁)上的引声孔。在一些实施例中，连通孔160和/或泄声孔180可以是无遮挡的贯通的孔，以便保障吸收漏音声波的效果。在一些实施中，连通孔160和/或泄声孔180上位开口处设有阻尼层，以调节声波的相位和振幅，修正导出声波的效果。
在一些实施例中，为了达到特定频率(例如，1.5kHz)的漏音吸收效果，使得谐振腔能够吸收目标频率范围内的声波，根据公式(1)以及结合振动腔140、谐振腔的实际尺寸，一个连通孔160的面积或多个连通孔(如多个连通孔160，多个第一连通孔231，多个第二连通孔241，或者第一连通孔231与第二连通孔241)的总面积可以设于不小于0.05mm 2，使得尽可能宽的连通孔面积取值范围内，谐振腔在进行声波吸收时覆盖可能的漏音频率范围，提高降漏音效率。在一些实施例中，一个谐振腔150的容积或者多个谐振腔(例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)的总容积可以设为不大于6500mm 3，使得在尽可能宽的谐振腔容积取值范围内，谐振腔在进行声波吸收时覆盖可能的漏音频率范围，提高降漏音效率。在一些实施例中，一个谐振腔150的容积或者多个谐振腔(例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)的总容积可以设为不大于2100mm 3，使得在较宽的谐振腔容积取值范围内，谐振腔在进行声波吸收时覆盖较广的漏音频率范围，提高降漏音效率。
在一些实施例中，一个连通孔160的直径或多个连通孔(如多个连通孔160，多个第一连通孔231，多个第二连通孔241，或者第一连通孔231与第二连通孔241)的总直径可以设为0.1mm-10mm，一个谐振腔150的容积或者多个谐振腔(例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)的总容积可以设为65mm 3-6500mm 3，以便谐振腔在进行声波吸收时覆盖较广的漏音频率范围，提高降漏音效率。在一些实施例中，根据目标频率范围的选取，至少一个连通孔160的直径或多个连通孔(如多个连通孔160，多个第一连通孔231，多个第二连通孔241，或者第一连通孔231与第二连通孔241)的总直径可以设为0.2mm-5mm，一个谐振腔150的容积或者多个谐振腔(例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)的总容积可以设为80mm 3-3000mm 3。在一些实施例中，为了同时保证连通孔和谐振腔的尺寸能够在合适的尺寸范围之内，至少一个连通孔160的直径或多个连通孔(如多个连通孔160，多个第一连通孔231，多个第二连通孔241，或者第一连通孔231与第二连通孔241)的总直径可以设为0.5mm-3mm，一个谐振腔150的容积或多个谐振腔(例如，第三谐振腔310、第四谐振腔320及第五谐振腔340)的总容积可以设为100mm 3-1000mm 3。
在一些实施例中，可以对振动结构120进行多种变换设置，以实现不同降漏音需求，如振动结构120与壳体130之间间距的变换设置，再例如，振动结构120的结构形状或大小面积的变换设置，等等，具体设置方式可参见图14相应内容描述，在此不再赘述。
下面以部分示例的方式进一步说明本申请实施例提供的降漏音装置。
图2-图4是根据本申请一些实施例所示的降漏音装置的结构示意图。
实施例一
如图2所示，降漏音装置200的壳体130内设有一个振动腔140和一个谐振腔150，在振动腔140与谐振腔150之间的侧壁170上设有一个连通孔160以实现两者气导连通，在壳体130的外壁上还设有一个泄声孔180。在一些实施例中，根据相应目标频率范围的选取，泄声孔180可以设于壳体130的任一外壁上，即可以设置在外壁131上，也可以设置在外壁132或外壁133上。在一些实施例中，根据相应目标频率范围的选取，泄声孔180可以位于壳体任一外壁上的任一位置，如外壁的中间位置或边缘位置。在一些实施例中，当泄声孔180设于谐振腔150上、与侧壁170相对的外壁(即图2所示的外壁131)时，根据相应目标频率范围的选取，泄声孔180与连通孔160既可以如图2所示的错开设置，泄声孔180与连通孔160也可以相对设置(即不错开设置)。在一些实施例中，为了满足相应目标频率范围，可以对连通孔160的尺寸、泄声孔180尺寸或者两者的尺寸比例关系进行不同种变换设置，可以设置为泄声孔180的直径大于连通孔160的直径，例如将泄声孔180与连通孔160的直径比 设置为3:2，使得在谐振腔150通过连通孔160吸收特定频率声波的基础上，更有效地将预期的一部分声波引导至壳体130外。
实施例二
如图3所示，降漏音装置300的壳体130内设有一个振动腔140和一个谐振腔150，在振动腔140与谐振腔150之间的侧壁170上设有一个连通孔160以实现两者气导连通，在壳体130的外壁上还设有两个泄声孔180、181。至于泄声孔180、泄声孔181的各自具体位置设置与实施例一所述的泄声孔180类似，具体可详见前述实施例一的相关描述，在此不再赘述。在一些实施例中，为了满足相应目标频率范围，可以对连通孔160的尺寸、泄声孔180尺寸、泄声孔181尺寸或者三者的尺寸比例关系进行不同种变换设置，例如可以设置泄声孔180尺寸、泄声孔181尺寸与实施例一的单个泄声孔180尺寸，来实现对同一目标频率声波的吸收或不同目标频率声波的吸收。
实施例三
如图4所示，降漏音装置400的壳体130内设有一个振动腔140和一个谐振腔150，在振动腔140与谐振腔150之间的侧壁170上设有一个连通孔160以实现两者气导连通，在壳体130的外壁上还设有三个泄声孔180、181、182。至于泄声孔180、泄声孔181、泄声孔182的各自具体位置设置与实施例一所述的泄声孔180类似，具体可详见前述实施例一的相关描述，在此不再赘述。在一些实施例中，为了满足相应目标频率范围，可以对连通孔160的尺寸、泄声孔180尺寸、泄声孔181、泄声孔182尺寸或者四者的尺寸比例关系进行不同种变换设置，例如可以设置泄声孔180尺寸、泄声孔181尺寸，与实施例一的单个泄声孔180尺寸或实施例二的泄声孔180尺寸、泄声孔181尺寸，来实现同一目标频率范围的等效设置或不同目标频率范围的区别设置。
图5是根据本申请一些实施例所示的降漏音装置的漏音曲线图。其中，横坐标表示漏音频率，单位为Hz；纵轴表示漏音的声压级，单位为dB。示例性地，测试条件可以是耳机芯样品处于悬空状态且收音麦克风至于耳后，测量位置为悬空时距振动结构的面板前方35mm。需要说明的是，这里的图5以及本申请提及的所有漏音曲线图及其测试条件，仅仅为了以示例性的方式进行说明，不应理解为是对本申请的限定。
如图5所示，如图1所示的降漏音装置100，根据测试后获得的降漏音曲线511，可知在特定频率范围(如2kHz至2.5kHz、5kHz至6kHz)形成了波谷区域，表明在该特定频率范围内具有较好的降漏音效果；如图2所示的降漏音装置200，根据测试获得的降漏音曲线512，可知在特定频率范围(如2.5kHz至3.5kHz)形成了波谷区域，表明在该特定频率范围内具有较好的降漏音效果；如图3所示的降漏音装置300，根据测试获得的降漏音曲线513，可知在特定频率范围(如3.5kHz至4.5kHz)形成了波谷区域，表明在该特定频率范围内具有较好的降漏音效果；如图4所示的降漏音装置400，根据测试获得的降漏音曲线514，可知在特定频率范围(5.5kHz至6kHz)形成了波谷区域，表明在该特定频率范围内具有较好的降漏音效果。
由此可以得出结论，如图2至图4所示的降漏音装置均取得了特定频率范围的降漏音效果；再者，根据其振动腔、谐振腔、连通孔及泄声孔的相应结构设置的不同，实现的声波吸收的特定频率范围也不同；另外，也可以根据如图2至图4所示的结构变换设置，示例性地可以得出以下结论：在特定频段(如2kHz至6kHz)，其他结构设置保持不变，壳体130的外壁上设置泄声孔的数量越多，实现降漏音的目标频率越高。
在另一些实施例中，也可以通过改变振动腔和/或谐振腔的结构参数(腔体结构形状、腔体大小、腔体间容积比、腔体具体位置、腔体间位置关系等)和/或连通孔和/或泄声孔结构参数(孔形状、孔数量、孔大小等)进行降漏音区别设置，使得不同结构参数设置方式下的降漏音装置，能够实现各自不同频率范围的降漏音效果，或者增强同一频率范围的降漏音效果，例如可以通过加大侧壁上一个连通孔的尺寸，来替代设置小尺寸的两个连通孔或更多连通孔，反之亦然。
图6是根据本申请一些实施例所示的降漏音装置的漏音曲线图。如图6所示，根据测试得到的降漏音曲线可知，降漏音装置的示例结构61，其对应降漏音曲线611显示出其在5.5kHz至6.5kHz形成了波谷区域，表明此时的谐振腔能够在吸收该频率范围内的声波，达到了相应的降漏音效果；降漏音装置的示例结构62，其对应降漏音曲线621显示出其在5kHz至6kHz形成了波谷区域，表明此时的谐振腔能够在吸收该频率范围内的声波，达到了相应降漏音效果；降漏音装置的示例结构63，其对应降漏音曲线631显示出其在3.7kHz至4.2kHz形成了波谷区域，表明此时的谐振腔能够在吸收该频率范围内的声波，达到了相应降漏音效果。由此可知，通过对示例结构61、62、63的特定结构参数调整(增加泄声孔的打孔数量、变化腔体容积或容积比)，能够实现不同特定频率范围的降漏音效果。
在另一些实施例中，除了通过直接增加或减小振动腔容积以改变容积比(还可以调节谐振腔容积，或者，振动腔、谐振腔的容积一起调整)外，还可以通过外壁打孔的方式来进行振动腔与谐振腔的等效容积设置。示例性地，再回到图6，降漏音装置的示例结构62与示例结构63相比，其他结构参数相同，减小了振动腔的容积，与示例结构63实现的在3.7kHz至4.2kHz频率范围对声波进行吸收(从而实现该频率范围内漏音的降低)相比，示例结构62实现的吸声频率，即5kHz至6kHz频率范围所处频段变高；进一步地，降漏音装置的示例结构61与示例结构62相比，其他结构参数相同，增设了泄声孔，与示例结构62实现的5kHz至6kHz频率范围内吸声，示例结构61实现的吸声频率，即5.5kHz至6.5kHz频率范围所处频段也进一步变高。由此可知，在特定频段(如3.5kHz至6.5kHz)，振动腔的容积越大，实现相应降漏音效果的频率范围越高。
通过设置不同降漏音装置的结构，能够实现多种不同频率范围的降漏音需求，例如，在一种特定扬声器或耳机的结构设置中，希望在一般人耳比较敏感的声音频率范围(例如小于5kHz)获取较好降漏音效果，由于实施例一所述的降漏音装置200实现的频率范围(如2.5kHz至3.5kHz)，以及实施例二所述的降漏音装置300实现的频率范围(如3.5kHz至4.5kHz)，均可以满足人耳敏感的频率范围，因此可以选用实施例一、实施例二所示的降漏音装置结构样式(包括其他可行等效结构)，从而实现较为良好的降漏音效果。
图7-图9是根据本申请一些实施例所示的降漏音装置的结构示意图。图10是根据本申请一些实施例所示的降漏音装置的漏音曲线图。
实施例四
如图7所示，降漏音装置700设有第一谐振腔210和第二谐振腔220，第一谐振腔210设于振动腔140的第一侧壁230上，第一谐振腔210与振动腔140通过第一侧壁230上的第一连通孔231气导连通，第二谐振腔220与第一谐振腔210之间通过第二侧壁240上的第二连通孔241气导连通。
在一些实施例中，为了获得期望降漏音特定频率范围所处频段，可以在两谐振腔的各自容积或容积比、两谐振腔总容积与振动腔的容积比、连通孔的数量、单个谐振腔直径或总直径、单个连通孔管道长度或总的管道有效长度以及连通孔之间各种尺寸参数之比等结构参数上进行相应变换设置。示例性地，可以通过增大其中一个谐振腔容积或两个谐振腔总容积与振动腔的容积比，来实现降漏音特定频率范围所处频段。另外，在其他实施例中，具体地可以采用任何可能的变换设置结构，在此不一一列举。
实施例五
如图8所示，降漏音装置800设有第一谐振腔210和第二谐振腔220，第一谐振腔210和第二谐振腔220均设于振动腔140的第一侧壁230上，第一谐振腔210与振动腔140通过第一侧壁230上的第一连通孔231气导连通，第二谐振腔220与振动腔140之间通过第一侧壁230上的第三连通孔232气导连通。
在一些实施例中为了获得期望降漏音特定频率范围所处频段，可以在两谐振腔的各自容积或容积比、两谐振腔总容积与振动腔的容积比、连通孔的数量、直径或总直径、连通孔管 道长度或总的管道有效长度以及连通孔之间各种尺寸参数之比等结构参数上进行相应变换设置。示例性地，可以通过减小某一谐振腔容积或两谐振腔总容积与振动腔的容积比，来实现对特定频段漏音的降低。另外，在其他实施例中，具体地可以采用任何可能的变换设置结构，在此不一一列举。
实施例六
如图9所示，降漏音装置900设有第三谐振腔310和第四谐振腔320，第三谐振腔310设于振动腔140的第一侧壁230上，第三谐振腔310与振动腔140通过第一侧壁230上的第一连通孔231气导连通，第四谐振腔320设于振动腔140的第三侧壁330上，第四谐振腔320与振动腔140通过第三侧壁330上的第四连通孔331气导连通。
如图10所示，降漏音曲线1011是由只设置有振动腔、未设置谐振腔腔体的初始结构测试得到的，降漏音曲线1012是图9所示降漏音装置进行测试得到的。根据测试获得的降漏音曲线1012、1011对比可知，降漏音装置900的两谐振腔在振动腔的不同侧壁并联设置结构，在特定频率范围(如1.9kHz至2.4kHz，2.7kHz至3.2kHz、4.5kHz至5kHz)形成了波谷区域，其中，在特定频率范围(如1.9kHz至2.4kHz)的降漏音波谷区域是由第四谐振腔320的设置而产生的，在特定频率范围(如2.7kHz至3.5kHz)的降漏音波谷区域是由第三谐振腔310的设置而产生的，在特定频率范围(如4.5kHz至5kHz)，由于振动腔140与第三谐振腔310之间第一侧壁230上的第一连通孔231的增设，振动腔140的波谷区域与未设置连通孔之前相比，降漏音波谷区域深度与特定频率范围都发生了变化，表明在多个特定频率范围内均取得了较显著的降漏音效果。
在另一些实施例中，根据图10所示的降漏音效果可知，可以通过振动腔(如振动腔140)或谐振腔(如第三谐振腔310、第四谐振腔320)各自或总体结构组合设置实现相应降漏音频率范围。例如，为了集中在某一特定频率范围(例如1.5kHz至3kHz)加强其降漏音效果，可以通过对振动腔和/或谐振腔进行容积大小或连通孔尺寸的相应结构设置，使振动腔和/或谐振腔的降漏音波谷区域都落在这较小特定频率范围所在频段，即振动腔和/或谐振腔相互之间的降漏音频率差值处于较小差值范围，例如相互差值均分布在0.1kHz至0.3kHz区间；再例如，为了获得较宽的特定频率范围(例如1kHz至5kHz)，可以通过对振动腔和/或谐振腔进行容积大小或连通孔尺寸的相应结构设置，使振动腔和/或谐振腔的降漏音波谷区域相对分散或均布地落在这一较宽频率范围所在频段，比如第四谐振腔320产生的波谷区域所在频率范围位于1kHz至2.5kHz频段，第三谐振腔310产生的波谷区域所在频率范围位于2.5kHz至4kHz频段，振动腔140产生的波谷区域所在频率范围位于4kHz至5kHz频段。
在另一些实施例中，如果期望提高或降低降漏音特定频率范围所处频段，可以在两谐振腔在不同侧壁的位置变换、两谐振腔的各自容积或容积比、两谐振腔总的容积与振动腔的容积比、连通孔的数量、直径或总的等效直径、连通孔管道长度或总的管道有效长度以及连通孔之间各种尺寸参数之比等结构参数上进行相应变换设置。示例性地，可以通过增大设于靠近降漏音装置振动面板121的侧壁上的谐振腔(如图9所示的第四谐振腔320)容积，来降低降漏音频率范围所处频段。另外，在其他一些实施例中，具体地可以采用任何可能的变换设置结构，在此不一一列举。
在另一些实施例中，也可以通过改变振动腔和/或谐振腔的结构参数(腔体数量、腔体结构形状、腔体大小、振动腔与谐振腔之间容积比、腔体具体位置、腔体间位置关系等)和/或连通孔和/或泄声孔结构参数(孔形状、孔数量、孔大小等)来调整降漏音效果。
通过降漏音装置的此种不同结构变换设置，进一步提供了能够实现多种不同频率范围降漏音要求的可实施方案，并且可以根据更细化的具体降漏音需求进行相应等效或变换结构设置，较大程度了优化了降漏音性能，满足用户多元化需求。
图11是根据本申请一些实施例所示的降漏音装置的结构示意图。图12是根据本申请一些实施例所示的降漏音装置的漏音曲线图。
实施例七
如图11所示，降漏音装置1100设有第三谐振腔310、第四谐振腔320、第五谐振腔340，第三谐振腔310设于振动腔140的第一侧壁230上，第三谐振腔310与振动腔140通过第一侧壁230上的第一连通孔231气导连通，第四谐振腔320设于振动腔140的第三侧壁330上，第四谐振腔320与振动腔140通过第三侧壁330上的第四连通孔331气导连通，第五谐振腔340设于振动腔140第四侧壁350上，第五谐振腔340与振动腔140通过第四侧壁350上的第五连通孔351气导连通。如图12所示，降漏音曲线1201是由只设置有振动腔、未设置谐振腔腔体的初始结构测试得到的，降漏音曲线1202是图9所示降漏音装置进行测试得到的。根据图12所示的漏音测试效果可以看出，根据测试获得的的降漏音曲线1201、1202，可知在多个特定频率范围(如1.4kHz至1.6kHz、2.3kHz至2.7kHz、3.4kHz至3.8kHz、4.3kHz至4.7kHz)产生了多个波谷区域，其中，在特定频率范围(如1.4kHz至1.6kHz)的降漏音波谷区域是由第三谐振腔310的设置而产生的，在特定频率范围(如2.3kHz至2.7kHz)的降漏音波谷区域是由第四谐振腔320的设置而产生的，在特定频率范围(如3.4kHz至3.8kHz)的降漏音波谷区域是由第五谐振腔340的设置而产生的，由于振动腔140与第三谐振腔310之间第一侧壁230上的第一连通孔231的增设，振动腔140的波谷区域与未设置连通孔之前相比，降漏音波谷区域深度与特定频率范围都发生了变化，表明多个特定频率范围内均取得了显著的降漏音效果，这与前述实施例五所述的降漏音装置900相比，在特定频段内(如1kHz至5kHz的频率范围)，具有降漏音频率范围更低频段走势且频段分布更全面、低频段降漏音效果更显著的特点。
在另一些实施例中，根据图12所示的降漏音效果可知，可以通过振动腔(如振动腔140)或谐振腔(如第三谐振腔310、第四谐振腔320、第五谐振腔340)各自或总体结构组合设置实现相应降漏音频率范围。例如，为了集中在某一特定频率范围(例如1kHz至3kHz)加强其降漏音效果，可以通过对振动腔和/或谐振腔进行容积大小或连通孔尺寸的相应结构设置，使振动腔和/或谐振腔的降漏音波谷区域都落在这较小特定频率范围所在频段，即振动腔和/或谐振腔相互之间的降漏音频率差值处于较小差值范围，例如相互差值均分布在0kHz至0.2kHz区间；再例如，为了获得较宽的特定频率范围(例如1kHz至6kHz)，可以通过对振动腔和/或谐振腔进行容积大小或连通孔尺寸的相应结构设置，使振动腔和/或谐振腔的降漏音波谷区域相对分散或均布地落在这一较宽频率范围所在频段，比如第三谐振腔310产生的波谷区域所在频率范围位于1kHz至2kHz频段，第四谐振腔320产生的波谷区域所在频率范围位于2kHz至3.5kHz频段，第五谐振腔340产生的波谷区域所在频率范围位于3.5kHz至5kHz频段，振动腔140产生的波谷区域所在频率范围位于5kHz至6kHz频段。
在另一些实施例中，如果期望提高或降低降漏音特定频率范围所处频段，可以在三谐振腔在不同侧壁的位置变换、三谐振腔的各自容积或容积比、两谐振腔总的容积或等效容积与振动腔的容积比、连通孔的数量、直径或总的等效直径、连通孔管道长度或总的管道有效长度以及连通孔之间各种尺寸参数之比等结构参数上进行相应变换设置。示例性地，如图11所示，在第四谐振腔320容积相比第五谐振腔340容积更大时，其他结构参数不变，通过增大振动腔容积使得体现降漏音频率范围的波谷所处频段往低频段走。另外，在其他一些实施例中，具体地可以采用任何可能的变换设置结构，在此不一一列举。
在另一些实施例中，也可以通过改变振动腔和/或谐振腔的结构参数(腔体数量、腔体结构形状、腔体大小、振动腔与谐振腔之间容积比、腔体具体位置、腔体间位置关系等)和/或连通孔和/或泄声孔结构参数(孔形状、孔数量、孔大小等)来调整降漏音效果。
图13是根据本申请一些实施例所示的降漏音装置的漏音曲线图，示出了具有谐振腔的多种变换结构设置，具体地包括串联一腔示例结构(如图1所示、串并两腔(如图9所示)以及串并三腔(如图11所示)，通过与无谐振腔设置结构进行降漏音效果对比，增设了谐振腔的无论是串联一腔结构、串并两腔结构还是串并三腔结构，形成的波谷区域均分布在频率范 围1.5kHz至5kHz之间，相较于未设置谐振腔结构，漏音降低声压级别均达到了25dB以上，多则可达到30dB，且每一种具有谐振腔的相应结构设置均可以根据需要实现对应相应降漏音频率范围区间，以满足多种工作场景的降漏音需求。
在一些实施例中，本申请实施例所述的谐振腔(如图1至图4的谐振腔150、图7至图9、图11的第一谐振腔210、第二谐振腔220、第三谐振腔310、第四谐振腔320、第五谐振腔340等等)可以是设于振动腔140内部、由至少一个挡板与壳体130内壁共同形成的腔体结构。在一些实施例中，前述谐振腔可以是由一个(或一块)挡板与壳体130三侧内壁共同形成的腔体结构。在一些实施例中，前述谐振腔可以是由两个(或两块)挡板与壳体130两侧内壁共同形成的腔体结构。在一些实施例中，前述谐振腔可以是一个一体成型的挡板与壳体130一侧内壁共同形成的腔体结构，例如一体成型的挡板可以是空心长方体、空心正方体等。在一些实施例中，前述谐振腔可以是具有开口的非封闭腔体。
图14是根据本申请一些实施例所示的降漏音装置的结构示意图。在一些实施例中，本申请实施例所述的谐振腔(如图1至图4的谐振腔150、图7至图9、图11的第一谐振腔210、第二谐振腔220、第三谐振腔310、第四谐振腔320、第五谐振腔340)，可以进行如图14所示的谐振腔结构变换。降漏音装置1400中，一个或多个谐振腔体(如谐振腔体191、192、196)可以是由设于振动腔140内壁(或壳体130内壁)的多个挡板190结构或立柱结构与振动腔140内壁构成(如谐振腔体191)的非封闭腔体。根据特定频率降漏音的需要，挡板190的数量、高度h、谐振腔体宽度s可以在相应数值范围内取值。在一些实施例中，不同谐振腔体(如谐振腔体191、192、196)的挡板190的高度h、谐振腔体宽度s可以相同或不同。在一些实施例中，不同谐振腔体(如谐振腔体191、192、196)实现的降漏音特定频率可以相同或不同。在一些实施例中，挡板190可以设于振动腔140任一内壁(或壳体130任一内壁)，如非图14所示的振动腔140其他内壁上。需要说明的是，这里的谐振腔变形结构仅仅是示例性的，在本申请发明构思范围内，还可以作出能够达到相应特定频率降漏音效果的其他变换或变形结构，本申请实施例不作特别限制。
图15是根据本申请一些实施例所示的降漏音装置的结构示意图。如图15所示，振动结构120的振动面板121与壳体130之间可以具有预定间距d。在一些实施例中，预定间距d是指振动面板121的上表面与壳体130的侧壁123的外表面之间的距离。预定间距d的大小可以通过调整振动传导件122位于壳体130外部的高度来调节。振动传导件122的高度是指振动传导件122在Y轴方向，即换能结构110振动方向上的高度。在一些实施例中，振动面板120与壳体130之间的预定间距d可以影响振动结构120与壳体130之间的开口(或间隙)大小。在一些实施例中，振动面板121与壳体130之间的预定间距d的大小与振动结构120和壳体130之间的开口的大小可以呈正相关。具体地，振动面板121与壳体130之间的预定间距d越大，振动结构120与壳体130之间的开口尺寸越大，振动面板121与壳体130之间的预定间距d越小，振动结构120与壳体130之间开口尺寸越小。
在一些实施例中，可以通过变换设置振动面板121与壳体130之间的预定间距d，以及振动结构120与壳体130之间开口尺寸，可以调整对降漏音装置1500的附加降漏音影响。具体可以表现为，振动面板121与壳体130之间的预定间距d越大，振动结构120与壳体130之间的孔的尺寸越大，降漏音装置100的降漏音能力越强。基于此，为了调节对降漏音装置1500的附加降漏音影响，以便不同程度地提高降漏音装置1500的降漏音效果，振动面板121与壳体130之间的预定间距d可以相对设置在较大范围区间。在一些实施例中，根据漏音合格的产品需求，预定间距d的范围可以在0.5mm-4mm之间。在一些实施例中，为了获得更适当的降漏音效果，预定间距d的范围可以在1mm-3mm之间。
图16是根据本申请一些实施例所示的降漏音装置的漏音曲线图。漏音曲线1601表示具有第一预定间距的降漏音装置的漏音曲线、漏音曲线1602表示具有第二预定间距的降漏音装置的漏音曲线、漏音曲线1603表示具有第三预定间距的降漏音装置的漏音曲线。其中，第一 预定间距小于第二预定间距，第二预定间距小于第三预定间距。对比漏音曲线1601、漏音曲线1602和漏音曲线1603可知，在特定频率范围(例如，4kHz-6kHz)内，漏音曲线1601的降漏音频率范围最宽，漏音曲线1602次之，漏音曲线1603则显示几乎没有提升降漏音效果。也可以理解为，以第一间距、第二间距、第三间距不同设置的降漏音装置1500的降漏音效果由强至弱。通过上述分析可知，在特定频率范围以及满足产品要求的特定间距大小范围内，振动面板121与壳体130之间的预定间距越大，降漏音装置1500的降漏音效果越强。
参照图15，在一些实施例中，振动面板121的面积、形状可以影响降漏音装置1500的漏音的大小，从而影响降漏音装置1500的降漏音效果。具体可以表现为，振动面板121的面积越大，降漏音装置的降漏音效果越弱。在一些实施例中，振动面板121与人体部位(例如，面部)相接触，声音可以通过振动面板121传递给用户。振动面板121的面积越大，振动面板121与用户身体部位的接触面积越大，接收的振动声音越大，通过振动面板121产生的漏音也就越大。基于此，为了提高降漏音装置1500的降漏音能力，振动面板131的面积可以较小。在一些实施例中，为了满足较宽范围振动面板且漏音合格的产品需求，振动面板121的面积可以位于9mm 2-700mm 2。在一些实施例中，为了获得更适当的降漏音效果，振动面板121的面积可以位于25mm 2-330mm 2。
在一些实施例中，振动面板121的形状可以是圆形、长方形、椭圆形、五边形等规则和/或不规则形状。需要说明的是，降漏音装置1500也可以不包括振动面板121，振动传导件122与人体部位相接触，换能结构110产生的振动通过振动传导件122直接传递给用户，以减小振动结构120与用户的接触面积，进而减小降漏音装置1500的漏音。
图17是根据本申请一些实施例所示的降漏音装置的漏音曲线图。漏音曲线1701表示第一振动面板面积的降漏音装置的漏音曲线；漏音曲线1702表示第二振动面板面积的降漏音装置的漏音曲线；漏音曲线1703表示第三振动面板面积的降漏音装置的漏音曲线；漏音曲线1704表示第四振动面板面积的降漏音装置的漏音曲线。其中，振动面板面积由大到小依次为第一振动面板面积、第二振动面板面积、第三振动面板面积、第四振动面板面积。对比漏音曲线1701、漏音曲线1702、漏音曲线1703、漏音曲线1704可知，在特定频率范围(例如，3kHz-5kHz)内，漏音曲线1701的降漏音漏音效果最差，漏音曲线1702的次之，漏音曲线1703的再次之，漏音曲线1704的降漏音效果最好。也可以理解为，降漏音装置1500的降漏音效果由强至弱依次为漏音曲线1704、漏音曲线1703、漏音曲线1702、漏音曲线1701。通过上述分析可知，在特定频率范围以及满足产品要求的特定振动面板面积大小范围内，振动面板121的面积越小，振动面板121与用户身体部位的接触面积越小，降漏音装置1500的降漏音效果越好。
图18是根据本申请一些实施例所示的声学输出装置的结构示意图。如图18所示，声学输出装置1800可以包括换能结构110、振动结构120和壳体130。图18所示的声学输出装置可以包括前述任一降漏音装置(如降漏音装置100、降漏音装置200、降漏音装置300等等)。声学输出装置1800中的一个或多个组件与前述降漏音装置中的一个或多个组件可以相同或相似，例如，壳体130、振动腔140、谐振腔150、连通孔160等等。
在一些实施例中，声学输出装置1800可以是扬声器。在一些实施例中，扬声器可以是骨传导扬声器、气传导扬声器或骨气导结合的扬声器。在另一些实施例中，扬声器可以是其他任何可行的扬声器，本申请实施例不对此作特别限定。
在一些实施例中，以骨传导扬声器作为示例，声学输出装置1800可以是将声音信号转换为不同频率的机械振动的装置。例如，声学输出装置1800可以是耳机(如骨传导耳机等)、助听器(如骨传导助听器等)等。声学输出装置1800的换能结构110可以将声音信号转换为机械振动，振动结构120的一端与换能结构110直接或间接连接，并基于换能结构110的机械振动产生振动。振动结构120的另一端与用户身体部位直接或间接接触，进而将机械振动通过用户身体部位(例如，颅骨、骨迷路等)传递至用户的听觉中枢，用户接收到骨传 导声波。在一些实施例中，耳机可以是头戴式耳机、挂耳式耳机、后挂式耳机、入耳式耳机、开放式耳机、分体式耳机、耳罩式耳机、颈挂式耳机、颈带式耳机或眼镜式耳机等等，本申请实施例对前述耳机的具体结构样式不作特别限定。
在一些实施例中，振动结构120可以包括振动面板121和振动传导件122。振动面板121可以位于振动结构120远离换能结构110的一端，振动传导件122位于振动结构120靠近换能结构110的一端，振动面板121与振动传导件122连接。壳体130的侧壁123上可以设置开口，振动传导件122贯穿开口，使得振动传导件122的一端(远离振动面板121的一端)可以伸入振动腔140，并连接于壳体支架410上。
在一些实施例中，壳体支架410可以是壳体130的一部分，也可以是单独的组件，直接或者间接连接于壳体130的内部。在一些实施例中，壳体支架410可以固定在壳体130的内表面上。在一些实施例中，壳体支架410可以通过胶水粘贴在壳体130上，例如通过弹性连接件430弹性连接在壳体130上，也可以通过冲压、注塑、卡接、铆接、螺纹连接或焊接固定在壳体130上，本申请实施例不作特别限定。
在一些实施例中，壳体支架410可以设有至少一个支架孔411。支架孔411可以将振动腔140内的振动声波引出壳体130外，与壳体130振动产生的漏音声波发生干涉，以消减漏音声波的振幅，从而减小声学输出装置1800的漏音。在一些实施例中，支架孔411可以为圆形、椭圆形、长方形等股则和/或不规则形状，本申请实施例不作特别限定。支架孔411的数量可以根据声学输出装置1800的应用场景做适应性调整，本申请实施例不做特别限定。
在一些实施例中，换能结构110可以包括磁路器件111、线圈112和传振片113。换能结构110可以位于壳体130的内部，并设置于壳体支架1510上。传振片113的一端与磁路器件111连接，传振片113的另一端与壳体支架410连接，并通过壳体支架410与振动结构120(例如，振动传导件122)连接。在一些实施例中，线圈112可以固定在壳体支架410上，并通过壳体支架410带动振动结构120振动。
在一些实施例中，磁路器件111可以用于形成磁场，线圈112可以在磁场中发生机械振动。具体地，线圈112可以通入信号电流，线圈112处于磁路器件111形成的磁场中，受到磁场中安培力的作用，接收驱动产生机械在振动。线圈112的机械振动可以传递至壳体支架410，壳体支架410进而将机械振动传递至振动结构120。机械振动通过振动结构120中的振动传导件122和振动面板121，进而传递至用户。
在一些实施例中，磁路器件111可以包括一个或多个磁性元件(图中未示出)，磁性元件可以选取任何可行的结构形式，如环形磁性元件等等。在一些实施例中，多个磁性元件可以提高总的磁通量，不同磁性元件相互作用，可以抑制磁感线泄漏，提高磁间隙处的磁感应强度，提高扬声器(如骨传导扬声器)的灵敏度。在一些实施例中，磁路器件111可以包括导磁元件(图中未示出)，导磁元件可以选取任何可行的结构形式，如导磁板或导磁罩等等。在一些实施例中，导磁罩可以将磁路器件111产生的磁路封闭，使得较多的磁感线集中于磁路器件111中的磁间隙内，达到抑制漏磁、增加磁间隙处的磁感应强度及提高扬声器(如骨传导扬声器)灵敏度的功效。
在一些实施例中，声学输出装置1800的壳体130上可以设有耳挂元件420。耳挂元件420可以用于辅助用户佩戴声学输出装置200。在一些实施例中，耳挂元件可以是头戴式耳机连接头梁的连接件。以声学输出装置200为后挂式骨传导装置为例，耳挂元件420的端部可以与声学输出装置1800的壳体130的侧壁连接，当用户佩戴声学输出装置1800时，耳挂元件420的端部可以位于用户耳廓的附近，使得声学输出装置1800位于用户耳廓的附近。进一步地，通过改变壳体130相对于耳挂元件420的位置和/或耳挂元件420的形状结构，可以调节声学输出装置1800相对于用户耳廓的位置、距离等。
在一些实施例中，声学输出装置1800的壳体130与耳挂元件420的连接方式可以是固定连接。这里的固定连接可以是指粘接、铆接、整体形成等连接方式。在一些实施例中， 声学输出装置1800与耳挂元件420的连接方式也可以是可拆卸连接。这里的可拆卸连接可以是指卡扣连接、螺纹连接等连接方式。
在一些实施例中，耳挂元件420的结构形状可以是弧形、半圆形、折线形等任何与耳廓适配的形状，耳挂元件420的结构形状可以根据用户的需求做适应性调整，本申请实施例不作特别限定。
在一些实施例中，振动结构120与壳体130之间可以弹性连接，即以弹性连接的方式进行固定连接。例如，在一些实施例中，声学输出装置1800可以包括弹性连接件430。弹性连接件430可以位于振动腔140中，用于连接振动结构120和壳体130。具体地，弹性连接件430的一端可以与振动结构120的振动传导件122连接，弹性连接件430的另一端可以与壳体130的内壁连接。换能结构110产生的机械振动传递至振动传导件122时，振动传导件122响应于换能结构110产生的机械振动产生振动，并将该振动信号通过弹性连接件430传递至壳体130，使得壳体130产生机械振动。
在一些实施例中，弹性连接件430可以为圆管状、方管状、异形管状、环状、平板状等，本申请实施例不作特别限定。在一些实施例中，弹性连接件430可以是弹性元件。弹性元件的材质可以为具有发生弹性形变能力的材料，例如，硅胶、金属、橡胶等，本申请实施例不作特别限定。在本申请的实施例中，弹性元件相比于壳体130更容易发生弹性形变，使得壳体130可以相对换能结构110发生相对运动。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述详细披露仅仅作为示例，而并不构成对本申请的限定。虽然此处并没有明确说明，本领域技术人员可能会对本申请进行各种修改、改进和修正。该类修改、改进和修正在本申请中被建议，所以该类修改、改进、修正仍属于本申请示范实施例的精神和范围。同时，本申请使用了特定词语来描述本申请的实施例。如“一个实施例”、“一实施例”、和/或“一些实施例”意指与本申请至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本申请中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一个替代性实施例”并不一定是指同一实施例。此外，本申请的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
此外，除非权利要求中明确说明，本申请所述处理元素和序列的顺序、数字字母的使用、或其他名称的使用，并非用于限定本申请流程和方法的顺序。尽管上述披露中通过各种示例讨论了一些目前认为有用的发明实施例，但应当理解的是，该类细节仅起到说明的目的，附加的权利要求并不仅限于披露的实施例，相反，权利要求旨在覆盖所有符合本申请实施例实质和范围的修正和等价组合。例如，虽然以上所描述的系统组件可以通过硬件设备实现，但是也可以只通过软件的解决方案得以实现，如在现有的服务器或移动设备上安装所描述的系统。
同理，应当注意的是，为了简化本申请披露的表述，从而帮助对一个或多个发明实施例的理解，前文对本申请实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本申请对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。
一些实施例中使用了描述成分、属性数量的数字，应当理解的是，此类用于实施例描述的数字，在一些示例中使用了修饰词“大约”、“近似”或“大体上”来修饰。除非另外说明，“大约”、“近似”或“大体上”表明所述数字允许有±20％的变化。相应地，在一些实施例中，说明书和权利要求中使用的数值参数均为近似值，该近似值根据个别实施例所需特点可以发生改变。在一些实施例中，数值参数应考虑规定的有效数位并采用一般位数保留的方法。尽管本申请一些实施例中用于确认其范围广度的数值域和参数为近似值，在具体实施例中，此类数值的设定在可行范围内尽可能精确。
最后，应当理解的是，本申请中所述实施例仅用以说明本申请实施例的原则。其他的变形也可能属于本申请的范围。因此，作为示例而非限制，本申请实施例的替代配置可视为 与本申请的教导一致。相应地，本申请的实施例不仅限于本申请明确介绍和描述的实施例。

Claims (20)

  1. 一种降漏音装置，其特征在于，包括换能结构、振动结构和壳体；所述壳体具有振动腔和至少一个谐振腔；所述换能结构位于所述振动腔内，并与所述振动结构连接；所述至少一个谐振腔与所述振动腔通过至少一个连通孔连通，所述每个谐振腔的容积小于所述振动腔的容积。
  2. 根据权利要求1所述的降漏音装置，其特征在于，所述至少一个谐振腔包括多个谐振腔，所述多个谐振腔设于所述振动腔的同一侧壁或不同侧壁上，且与所述振动腔之间通过至少一个所述连通孔气导连通。
  3. 根据权利要求2所述的降漏音装置，其特征在于，所述至少一个谐振腔包括第一谐振腔和第二谐振腔，所述第一谐振腔设于所述振动腔的第一侧壁上，所述第一谐振腔与所述振动腔通过所述第一侧壁上的第一连通孔气导连通，所述第一谐振腔与所述第二谐振腔之间通过所述第一谐振腔的第二侧壁上的第二连通孔气导连通。
  4. 根据权利要求2所述的降漏音装置，其特征在于，所述至少一个谐振腔包括第一谐振腔和第二谐振腔，所述第一谐振腔和所述第二谐振腔均设于所述振动腔的第一侧壁上，所述第一谐振腔与所述振动腔通过所述第一侧壁上的第一连通孔气导连通，所述第二谐振腔与所述振动腔之间通过所述第一侧壁上的第三连通孔气导连通。
  5. 根据权利要求2所述的降漏音装置，其特征在于，所述至少一个谐振腔包括第三谐振腔和第四谐振腔，所述第三谐振腔设于所述振动腔的第一侧壁上，所述第三谐振腔与所述振动腔通过所述第一侧壁上的第一连通孔气导连通，所述第四谐振腔设于所述振动腔的第三侧壁上，所述第四谐振腔与所述振动腔通过所述第三侧壁上的第四连通孔气导连通。
  6. 根据权利要求1所述的降漏音装置，其特征在于，所述振动腔和/或所述谐振腔的外壁上具有泄声孔。
  7. 根据权利要求6所述的降漏音装置，其特征在于，所述连通和/或泄声孔为贯通的孔，和/或，所述连通孔和/或所述泄声孔的开口处设有阻尼层。
  8. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述谐振腔是设于所述振动腔内部、由至少一个挡板与所述壳体内壁共同形成的腔体结构。
  9. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述谐振腔降低特定频率的漏音，所述特定频率在20Hz～10000Hz的范围内。
  10. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述每个谐振腔与所述振动腔之间的容积比不小于0.1。
  11. 根据权利要求10所述的降漏音装置，其特征在于，所述每个谐振腔与所述振动腔之间的容积比为0.1～1。
  12. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述每个谐振腔的容积不大于6500mm 3。
  13. 根据权利要求12所述的降漏音装置，其特征在于，所述每个谐振腔的容积不大于2100mm 3。
  14. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述每个连通孔的面积不小于0.05mm 2。
  15. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述振动结构与所述壳体之间的间距范围为1mm～3mm。
  16. 根据权利要求1至6任一项所述的降漏音装置，其特征在于，所述振动结构的振动表面积范围为9mm 2～700mm 2。
  17. 一种声学输出装置，其特征在于，包括根据权要求1至16任一项所述的降漏音装置。
  18. 根据权利要求17所述的声学输出装置，其特征在于，所述振动结构包括振动面板和振动传导件，所述振动传导件通过所述壳体开口伸入所述振动腔并连接于壳体支架上，所述换能结构设于所述壳体支架上。
  19. 根据权利要求18所述的声学输出装置，其特征在于，所述壳体支架设有支架孔。
  20. 根据权利要求17至19任一项所述的声学输出装置，其特征在于，所述振动结构与所述壳体之间弹性连接。
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