WO2023090964A1 - 은도금액 - Google Patents
은도금액 Download PDFInfo
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- WO2023090964A1 WO2023090964A1 PCT/KR2022/018390 KR2022018390W WO2023090964A1 WO 2023090964 A1 WO2023090964 A1 WO 2023090964A1 KR 2022018390 W KR2022018390 W KR 2022018390W WO 2023090964 A1 WO2023090964 A1 WO 2023090964A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Definitions
- the present invention relates to a silver plating solution capable of producing a high-quality silver-plated product simply and environmentally friendly, and silver plating using the same.
- Silver which belongs to precious metals, has been used for high-end ornaments, tableware, and money since ancient times. It is widely used in various batteries including batteries, electrodes for various electronic products such as automobiles and semiconductors, electromagnetic wave shielding and heat dissipation products, and mechanical parts.
- metals with high reflectivity such as silver, aluminum, chrome, nickel, titanium, and copper are painted, plated, or deposited to make products.
- painting, coating, and printing methods are used for products that do not have high conductivity or reflectivity.
- Plating methods can obtain a reflective film with high conductivity, high-quality surface gloss, and high reflectivity even in thin films, but the defect rate is high during manufacturing.
- the cost of plating treatment is excessive, and there are problems of air pollution and wastewater generation due to the emission of harmful substances during the plating process. It is possible to manufacture a thin film electrode or a reflective film with high reflectivity by deposition or sputtering under vacuum, which is a dry method. However, in the case of deposition, there are restrictions on the use of expensive vacuum equipment and the shape or size of the base material, and there are problems in mass production of small quantity and various products. there is In this way, in manufacturing desired industrial electrical and electronic products or household items using silver, the plating method has many environmental problems to be solved, such as a process that cannot but be used or a wastewater treatment problem.
- Silver plating is largely divided into electrolytic silver plating and electroless silver plating. It is common to use a silver precursor or silver complex, but electroless silver plating uses electricity to deposit silver. The difference is that reducing agents are used instead, and that it can be easily plated on plastics, textiles, and ceramic products that do not conduct electricity.
- electrolytic silver plating has been carried out in alkali cyan solutions such as potassium cyanide and sodium cyanide using highly toxic silver cyanide for a long time.
- alkali cyan solutions such as potassium cyanide and sodium cyanide using highly toxic silver cyanide for a long time.
- a lot of research and development has been conducted over the past decades to replace silver compounds such as silver nitrate with cyan-free silver plating using various complexing agents and other additives, but silver plating using cyan compounds is still the mainstream in commercial product production.
- cyan-free silver plating has disadvantages such as poor adhesion, difficulty in manufacturing a bright silver-plated product, and easy contamination of the plating solution.
- U.S. Patent No. 5,322,553 discloses that a more stable plating solution can be provided by using silver thiosulfate or silver sulfite
- U.S. Patent No. 6,620,304 It mentions the possibility of producing high-quality products with a plating solution that does not use harmful substances by using amino acids such as cysteine in silver methanesulfonate.
- 8,608,932 discloses a differentiated electrolytic silver plating method using a silver complex of 5,5-dimethyl hydantoin.
- a plating solution of excellent products has not yet been developed.
- the development of a silver plating solution that does not use a cyanide compound remains an ongoing task.
- a silver ammonium complex called Tollens' reagent meets a compound having an aldehyde group such as glucose, it is reduced to form a silver mirroring.
- This is a kind of electroless silver plating that shows the oxidation-reduction reaction well, and is used in the manufacture of vacuum flasks or dewar bottles.
- this silver plating solution is prepared in a strong base aqueous solution using silver nitrate and ammonia water as a complexing agent, there is an explosion risk due to the generation of silver nitride in the storage process. There is a problem that needs to be treated and disposed of.
- a plating solution using silver nitrate and ammonia water as a complexing agent shows excellent properties in stability and quality of the plating solution in electrolytic silver plating or electroless silver plating, but is used extremely limitedly due to these problems. Therefore, when electroless silver plating is performed, selection of a type of complexing agent and a suitable reducing agent accordingly has become a very important matter.
- An object of the present invention is to provide a silver plating solution that is environmentally friendly and has excellent stability and a high-quality silver-plated product using the same.
- the silver plating complex solution is a solution containing a carboxylic acid silver salt of the following general formula 1, wherein the silver plating A silver plating solution capable of performing electroless silver plating by a silver mirror reaction between a complex solution and the reducing agent solution is provided.
- R 1 is hydrogen, a substituted or unsubstituted C 1 -C 22 alkyl group, a substituted or unsubstituted C 3 -C 30 cycloalkyl group, a substituted or unsubstituted C 6 -C 30 aralkyl group, A substituted or unsubstituted C 1 -C 30 heteroalkyl group, a substituted or unsubstituted C 2 -C 30 heterocycloalkyl group, or a substituted or unsubstituted C 5 -C 30 heteroaralkyl group.
- a silver-plated product obtained by reacting the above-described silver plating solution at 5 to 50° C. is provided.
- the present invention not only is an environmentally friendly silver plating solution excellent in storage stability and performance, but also various high-quality silver-plated products are provided using the silver plating solution.
- Example 2 is a photograph of a silver mirror product of a glass bottle prepared in Example 3.
- Example 3 is a product photograph of a silver mirror of a PET bottle prepared in Example 8.
- Example 4 is a product and conductivity photograph of the silver-plated coated nylon fabric prepared in Example 41.
- Example 5 is a product and conductivity photograph of the silver-coated nylon fiber prepared in Example 42.
- Example 6 is an electron microscope (SEM) photograph of the surface of silver-plated coated nylon fibers prepared in Example 42.
- Example 7 is a photograph of a mirror-image polyimide film coated with silver plating prepared in Example 43.
- Example 8 is a photograph of the silver-plated coated polyurethane foam prepared in Example 45.
- Example 10 is a photograph of silver-plated copper foil prepared in Example 50.
- Example 11 is a photograph of a silver-containing cotton fabric having antibacterial properties prepared in Example 51.
- Figure 13 shows the solution state after storage for 6 months at room temperature as a reducing agent solution prepared in Preparation Example 8.
- alkyl includes a straight-chain, branched-chain, or cyclic hydrocarbon radical or a combination thereof, and in some cases may include one or more double bonds, triple bonds, or combinations thereof in the chain. That is, “alkyl” includes alkene or alkyne.
- heteroalkyl refers to one or more carbon atoms and one or more heteroatoms selected from the group consisting of O, N, P, Si, and S. means a stable straight or branched chain or cyclic hydrocarbon radical consisting of, or combinations thereof, wherein the nitrogen, phosphorus and sulfur atoms may optionally be oxidized and the nitrogen heteroatoms may optionally be quaternized.
- cycloalkyl and “heterocycloalkyl” by themselves or in combination with other terms, unless otherwise specified, refer to cyclic versions of “alkyl” and “heteroalkyl”, respectively.
- aryl refers to a polyunsaturated, aromatic, hydrocarbon substituent which may be a single ring or multiple rings (1 to 3 rings) fused or covalently bonded together.
- heteroaryl means an aryl group (or ring) comprising (in each separate ring in the case of multiple rings) 1 to 4 heteroatoms selected from N, O and S, the nitrogen and sulfur atoms being optionally oxidized, and the nitrogen atom(s) are optionally quaternized.
- a heteroaryl group can be attached to the rest of the molecule through a carbon or heteroatom.
- aralkyl refers to aryl and aryl substituted alkyl groups, wherein the alkyl and aryl portions independently are optionally substituted.
- heteroarylkyl refers to an alkyl group substituted with an aryl and heteroaryl, respectively, wherein the alkyl and heteroaryl portions independently are optionally substituted.
- substitution in the expression “substituted or unsubstituted” means that one or more hydrogen atoms in a hydrocarbon are each, independently of one another, replaced with the same or different substituents.
- Useful substituents include but are not limited to the following.
- G1 and G2 are each independently hydrogen; C 1 -C 10 alkyl group; Alternatively, it may be a C 6 -C 30 aryl group unsubstituted or substituted with a C 1 -C 10 alkyl group.
- a “derivative” of a substance described in this specification means a substance in which some of the hydrogen atoms of the substance are substituted with the substituents described above.
- the present invention is a silver plating solution for electroless silver plating comprising a silver plating complex solution and a reducing agent solution, wherein the silver plating complex solution is a solution containing a carboxylic acid silver salt of the following general formula 1, the silver plating complex solution and the reducing agent
- a silver plating solution capable of performing electroless silver plating by a silver mirror reaction between solutions is provided.
- R 1 is hydrogen, a substituted or unsubstituted C 1 -C 22 alkyl group, a substituted or unsubstituted C 3 -C 30 cycloalkyl group, a substituted or unsubstituted C 6 -C 30 aralkyl group, A substituted or unsubstituted C 1 -C 30 heteroalkyl group, a substituted or unsubstituted C 2 -C 30 heterocycloalkyl group, or a substituted or unsubstituted C 5 -C 30 heteroaralkyl group.
- the present invention provides a silver plating solution containing a silver carboxylate compound represented by [General Formula 1] and a complexing agent in the form of a nitrogen-containing compound as main components, and various conductive products and silver mirror products using the same.
- R 1 is hydrogen, a substituted or unsubstituted C 1 -C 22 alkyl group, a substituted or unsubstituted C 3 -C 30 cycloalkyl group, or a substituted or unsubstituted C 6 -C 30 aralkyl ( aralkyl), a substituted or unsubstituted C 1 -C 30 heteroalkyl group, a substituted or unsubstituted C 2 -C 30 heterocycloalkyl group, or a substituted or unsubstituted C 5 -C 30 heteroaralkyl group.
- R 1 is hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, t-butyl, n-pentyl, iso-amyl, t-amyl, n-hexyl, 2- Ethylhexyl, n-heptyl, octyl, iso-octyl, nonyl, decyl, neodecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, docosanyl, oleyl, linoleyl, cyclopropyl, cyclopentyl, cyclohexyl, etc. can be heard
- a silver precursor of [General Formula 1] for example, silver acetate, silver propionate, silver trifluoroacetate, silver lactate, silver malonate ( silver malonate, silver maleate, silver fumarate, silver pyruvate, silver succinate, silver picrate, silver citrate citrate), silver 2-ethylhexanoate, silver neodecanoate, silver stearate, silver docosanoate, silver oleate, silver linoleate ( silver linoleate) and silver cyclohexane carboxylate.
- silver malonate silver malonate, silver maleate, silver fumarate, silver pyruvate, silver succinate, silver picrate, silver citrate citrate
- silver 2-ethylhexanoate silver neodecanoate
- silver stearate silver docosanoate
- silver oleate silver linoleate ( silver linoleate) and silver cyclohexane
- silver alkanoates such as silver acetate, silver propionate, and silver neodecanoate, among the various carboxylic acid silver salts of [General Formula 1] are the most advantageous in the present invention in terms of economic efficiency, stability, and dissolution characteristics. It matches.
- the content of silver used does not need to be particularly limited if it conforms to the present invention, but may generally be 0.05 to 5.0% by weight relative to the final plating solution, preferably 0.1 to 3.0%, and more preferably 0.2 to 2.0%. do. If the amount used is less or more than this, there is a problem in that the economical efficiency and stability of the plating solution decrease or the quality of the product deteriorates.
- the complexing agent combines with silver ions in the silver plating solution to form stable complex ions so that they can be easily dissolved in a solvent at a high concentration.
- the complexing agent is mainly an electron donor, and is preferably a compound containing a nitrogen atom, a phosphorus atom, or a sulfur atom, but a compound containing a nitrogen atom is more preferable in terms of stability and economy.
- the nitrogen atom-containing compound is, for example, selected from the group consisting of ammonia, amines (primary, secondary, or tertiary amines), quaternary ammonium salts, and polyamines. It may be one or more.
- a substituted or unsubstituted alkyl, aryl, aralkyl group or the like having 1 to 20 (C 1 -C 20 ) carbon atoms may be bonded to the nitrogen atom of the nitrogen atom-containing compound.
- the alkyl group may have any form such as a linear type, a branched type, a comb type, a star-shaped or dendritic type, and a cyclic type.
- the nitrogen atom-containing compound may have a functional group such as hydroxy, alkoxy, ester, amide, or urethane.
- ammonia or amine compound among the nitrogen atom-containing compounds may be represented by the following [General Formula 2]
- the quaternary ammonium salt compound may be represented by the following [General Formula 3].
- R 2 to R 8 may be the same as or different from each other, and are each hydrogen or a substituted or unsubstituted C 1 -C 20 alkyl group, a substituted or unsubstituted C 6 -C 30 aryl group, or a substituted or unsubstituted C 3 -C 30 Cycloalkyl group, substituted or unsubstituted C 6 -C 30 aralkyl group, substituted or unsubstituted C 1 -C 30 heteroalkyl group, substituted or unsubstituted C 2 -C 30 heterocycloalkyl group, substituted or unsubstituted a C 5 -C 30 heteroaryl group, or a substituted or unsubstituted C 5 -C 30 heteroaralkyl group.
- X is F - , Cl - , Br - , I - , OH - , hydrogen sulfate, bicarbonate, carbamate or perchlorate.
- the nitrogen atom-containing compound is ammonia, methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, tertiary-butylamine, n-pentylamine, iso -pentylamine, tert-amylamine, n-hexylamine, diethylamine, triethylamine, 2-ethylhexylamine, cyclohexylamine, allylamine, propargylamine, ethylenediamine, 1,3-propylenediamine, Hexamethylenediamine, triethylenediamine, 1,2-diaminopropane, monoethanolamine, diethanolamine, 1-amino-2-propanol, 3-amino-1-propanol, 1,4-butanediamine, spermine ), spermidine, diethylenetriamine, triethylenetetramine, tris(
- the plating solution in an alkaline aqueous solution may contain ethylenediaminetetraacetic acid (EDTA) or nitrilotriacetic acid (NTA) compounds, such as disodium EDTA, trisodium EDTA, and tetrasodium.
- EDTA Tetrasodium EDTA
- Sodium NTA Trisodium NTA
- Succinimide Maleimide, Phthalimide, Ethylenediamine, Hexamethylenetetraamine, Saccharin, Imidazole, Oxazoline
- At least one selected from the group consisting of hydantoin and 5,5-dimethyl hydantoin may be selected and used.
- alkylamines such as ammonia, methylamine, and ethylamine are most suitable for the present invention in terms of economic feasibility and characteristics.
- the content of the complexing agent used does not need to be particularly limited if it conforms to the present invention, but in general, it may be 0.1 to 10.0, preferably 0.3 to 7.0, more preferably 0.5 in terms of molar ratio relative to the silver carboxylic acid salt used. ⁇ 5.0 is appropriate. If the amount used is less or more than this, there is a problem in that the stability of the plating solution or the reaction is not completed and the quality is deteriorated.
- the silver plating solution of the present invention may use water, ethanol, ethylene glycol, glycerin, or a mixture thereof as a solvent. That is, as an alcohol or glycol-containing aqueous solution, wetting is very excellent. Therefore, metals and metal alloys such as copper, nickel, zinc, tin, antimony, molybdenum, platinum, bronze, and brass, as well as oxides and sulfides of these metals, silica, alumina, titanium oxide, mica, and clay , ceramics such as glass, plastics such as polyester, nylon, polyimide, polyurethane, acrylic, various carbon compounds such as carbon, carbon nanotubes, graphite, graphene, rubber, and non-woven fabrics , any kind of substrates such as paper, their particles, flakes, beads, sheets, foils, films, fibers, etc. It has the advantage that it can be easily plated by using it regardless of the shape or shape.
- the silver plating solution of the present invention can prepare and store the silver solution in advance and use it whenever necessary. characteristic.
- the hydrogen ion concentration (pH) of the present invention does not need to be particularly limited, but the present invention is different from general silver plating (including electroless silver plating) in a relatively strong acid (pH 3.0 or less) or strong alkali (pH 10.0 or more). Except for cases, most of them are characterized in that they proceed well in the neutral to slightly alkaline range of pH 7.0 ⁇ 9.0.
- the silver solution of the present invention is environmentally friendly and has excellent ink storage stability, it has the advantage of being able to conveniently use the stored plating solution for a silver mirror whenever an experiment is desired.
- it since it is simple and safe, it is characterized by being very useful for anyone to experiment with as an example of oxidation-reduction reaction at school or to manufacture silver mirror souvenirs or ornaments.
- tin chloride since tin chloride is not used, it is possible to manufacture a mirror with excellent surface roughness, and above all, it can be used very usefully when manufacturing a high-quality optical mirror such as a telephoto lens.
- a silver plating solution is prepared using the above-described silver carboxylate precursor compound and various complexing agents, and a stabilizer, a solvent, and an additive, and in particular, a reducing agent must be selected and used in the case of electroless silver plating or silver mirror reaction.
- a stabilizer, a solvent, and an additive and in particular, a reducing agent must be selected and used in the case of electroless silver plating or silver mirror reaction.
- the reducing agent serves to deposit silver on the surface of an object by transferring electrons emitted during oxidation to silver ions.
- the reducing agent include acetol, acetoin, hydroxyacetone, hydroxyamine, diethylhydroxylamine, methylethylketoxime, and Alkyl aminoborane compounds such as Rochelle salt, erythobate, ammonia borane and methylamine borane, diethylamine borane, hydrazine, hydrated hydrazine (Hydrazine hydrate), Hydrazine sulfate, sodium hypophosphite, sodium sulfite, sodium thiosulfate, sodium borohydride, lithium aluminum hydride (Lithium aluminum hydride), sodium citrate, and alkylamine compounds such as butylamine, ethanolamine, ethylenediamine, and dodecylamine, ethylene glycol, thiodiglycol, and diethylene glycol , formalde
- the reduction reaction can proceed more quickly through a process of proceeding alone or mixing with the above reducing agent.
- the content of the reducing agent used does not need to be particularly limited in accordance with the present invention, but in general, it may be 0.1 to 5.0, preferably 0.3 to 3.0, more preferably 0.5 to 5.0 in terms of molar ratio relative to the silver carboxylic acid salt used. 2.0 is suitable. If the amount used is smaller or larger than this, the stability of the plating solution becomes a problem or the reaction proceeds too late or too fast, making it difficult to control the reaction and deteriorating product quality.
- the reaction temperature during silver plating is not particularly limited in accordance with the present invention, but may be generally 5 to 50 ° C, preferably 10 to 40 ° C, and more preferably 15 to 30 ° C. If it is lower or higher than this, the reaction proceeds too late or too fast along with the stability of the plating solution, so that it is difficult to control the reaction and product quality deteriorates.
- Stabilizers include long-chain mecaptan compounds such as dodecane thiol, fatty acid compounds such as oleic acid, amine compounds such as oleyl amine, polyvinylpyrrolidone, poly(2-ethyl-2-oxazoline), and polyvinyl alcohol.
- Polymers such as polyethylene glycol and polystyrene sulfonic acid and their copolymers, synthetic or natural polymer compounds such as carboxymethyl cellulose, alginic acid, chitosan, dopamine, starch, polysaccharides, and various gums Using the same stabilizer can be expected to prevent change over time or to improve adhesion.
- the surfactant is preferably a nonionic surfactant such as polyoxyethylene alkyl ether or ester, fatty acid sorbitan ester, or alkyl monoglyceryl ether
- the discoloration inhibitor is selected from the group consisting of benzotriazole and derivatives. You can select and use one or more of them.
- at least one selected from the group consisting of metal compounds such as ammonium molybdate, bismuth nitrate, selenic acid, and thallium nitrate can be selected and used. there is.
- ammonium salts such as ammonium formate, ammonium acetate, ammonium nitrate, ammonium sulfate, sulfurous acid
- ammonium salt additives such as ammonium sulfite, ammonium carbonate, ammonium bicarbonate, ammonium carbamate, and ammonium phosphate
- the reaction rate is controlled and uniform. There are cases in which it is plated more carefully and the mirror characteristics or conductivity are increased.
- the amount used does not need to be particularly limited in accordance with the present invention, but may generally be 0.01 to 10.0% by weight compared to the final plating solution, preferably 0.05 to 5.0%, and more preferably 0.1 to 3.0%. If the amount used is less or more than this, there is a problem that the stability of the plating solution is lowered or the quality of the product is lowered.
- the solvent does not need to be particularly limited as long as it conforms to the present invention, but polar solvents such as water (deionized water), methanol, ethanol, n-propanol, iso-propanol, n-butanol, iso-butanol, 1-methoxy Alcohols such as 2-propanol (1-methoxy-2-propanol), diacetone alcohol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, ethylene glycol, diethylene glycol, propylene glycol, Glycols and glycol ethers such as glycerin, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monoethyl ether, and ethylammonium nitrate, 1-ethyl-3-methyl imidazolium dicyanamide ( 1-Ethyl-3-methyl imidazolium dicyanamide) and at least one selected from the group consisting of ionic liquids.
- the solvent most suitable for the present invention may include water, ethanol, ethylene glycol, glycerin, or a mixture thereof.
- a mixed solvent of water and ethanol is most suitable.
- silver electrolytic plating when the water content is minimized, the plating quality is excellent.
- electroless plating including silver mirror reaction the higher the water content, the faster the reaction speed but the shorter the life of the plating solution. If there is a lot, the stability of the plating solution is low and the quality is not uniform, so it may be 1 to 80% by weight compared to the total solvent, more preferably 20 to 50%.
- non-conductors such as glass, ceramics, and plastics are cleaned with nitric acid, surfactants, alcohol, etc., and mechanical polishing methods such as steam blasting or grinding using silicon carbide or chromic acid or sulfuric acid are used to increase adhesion.
- mechanical polishing methods such as steam blasting or grinding using silicon carbide or chromic acid or sulfuric acid are used to increase adhesion.
- an etching method using hydrofluoric acid, and a method of sensitization and activation with tin chloride (SnCl 2 ) and palladium chloride (PdCl 2 ) can be selected and utilized.
- the silver plating solution of the present invention is mainly alcohol Since the solution is used and the silver ions themselves perform autocatalytic plating on their own, it is characterized in that the electroless plating, including the silver mirror reaction, proceeds well with some degree of adhesion even without the pretreatment process as described above. On the other hand, after electroless plating, electrolytic plating can be continuously performed using the electroless plated material as a cathode, which can increase the plating thickness or improve the appearance and physical properties.
- the silver plating complex solution of the present invention may be used as an electrolyte to perform silver plating using electricity instead of a reducing agent.
- compounds such as water-based polyurethane, water-based acrylic polymer, polyester polymer, silicone polymer, and fluorine-based polymer are applied by dipping, spray coating, or spin ( It can be used by wet coating in methods such as spin coating, bar coating, slit-die coating, and gravure coating, or by vacuum deposition or sputtering of inorganic compounds such as silica or titanium dioxide. there is.
- An acid silver ammonia complex solution was prepared.
- a silver complex solution was prepared by adding 2.0 g of ammonia aqueous solution to 100 g of the 0.5% colorless and transparent ammonia complex solution of silver neodecanoate prepared in Preparation Example 2.
- a reducing agent solution was prepared by adding 1.5 g of hydroquinone to a mixed solution of 100 g of ethanol and 400 g of water.
- a reducing agent solution was prepared by adding 1.5 g of hydroquinone to a mixture of 100 g of glycerin and 400 g of water.
- a reducing agent solution was prepared by adding 1.5 g of hydroquinone to a mixture of 400 g of ethanol and 100 g of water.
- a reducing agent solution was prepared by adding 3.0 g of 2,5-di-tert-butyl hydroquinone to a mixed solution of 250 g of ethanol and 250 g of water.
- a reducing agent solution was prepared by adding 0.5 g of ammonium formate to 100 g of the reducing agent solution prepared in Preparation Example 5.
- a reducing agent solution was prepared by adding 0.5 g of 80% hydrazine hydrate (80%) to 100 g of water.
- a reducing agent solution was prepared by adding 5.0 g of glucose to 100 g of water.
- a reducing agent solution was prepared by adding 0.5 g of 80% hydrazine hydrate (80%) to 50 g of water and 50 g of ethanol and adding 0.5 g of ammonium nitrate thereto.
- a reducing agent solution was prepared by adding 0.5 g of 80% hydrazine hydrate to 100 g of water and adding 0.5 g of ammonium formate thereto.
- a silver mirror manufacturing experiment was performed in the same manner as in Example 6, except that the silver complex solution prepared in Preparation Example 4 was used instead of the silver complex solution of Preparation Example 2, and as a result, a bright golden silver mirror was obtained on the inside and clean on the outside The silver mirror was well formed.
- a photograph of the prepared sample is shown in FIG. 1 .
- Example 2 As a result of the experiment in the same manner as in Example 1 using a transparent polyester container (PET bottle) instead of a transparent glass container with a cleanly prepared lid, a light gold mirror was formed on the inside and a clean silver mirror on the outside. A photograph of the prepared sample is shown in FIG. 3 .
- PET bottle transparent polyester container
- FIG. 3 A photograph of the prepared sample is shown in FIG. 3 .
- Preparation Example 1 silver neodecanoate was dissolved using ammonia ethanol solution (Alcoholic ammonia) instead of aqueous ammonia solution, and then absolute ethanol was used as a diluent to finally obtain colorless alcoholic ammonia having a silver content of 0.5%.
- a complex solution was prepared.
- the prepared alcoholic ammonia complex solution was placed in a cleanly prepared transparent glass container with a lid and shaken well to sensitize and activate the inside of the container. Thereafter, the same amount of reducing agent solution in which 0.3% hydroquinone was dissolved in anhydrous ethanol prepared in advance was filled in the same amount by weight and reacted for 30 minutes. As a result, a dark silver mirror lower in quality than when using 95% ethanol was formed. .
- the complex solution was placed in a cleanly prepared transparent glass container with a lid and shaken well to sensitize and activate the inside of the container. Thereafter, the reducing agent solution prepared in Preparation Example 5 was filled in the same amount by weight ratio, shaken well, left for 10 minutes, and then the contents were discarded and washed sequentially with water and ethanol to confirm whether the silver mirror reacted according to the final silver content.
- Example 16 As a result of the experiment, it was confirmed that the most stable silver mirror reaction was performed in Example 16 and clean plating was performed, and it was confirmed that silver mirrors were formed even in Examples 14 and 15 having a low silver content. However, even in the case of Example 13 in which the silver content was 0.01%, the silver mirror reaction was performed, but it was confirmed that a semi-transparent silver mirror having weak mirror characteristics was formed.
- Example 21 silver carboxylate Silver mirror response
- Example 22 Silver 2-ethylhexanoate
- Example 23 silver malonate
- Example 24 Lactic acid is ⁇
- Example 25 silver oleic acid
- Example 26 silver nitrate ⁇
- Silver Carboxylate (g) Ammonia aqueous solution (g) weight ratio Example 27 100 One 0.01 Example 28 100 4 0.04 Example 29 100 20 0.20 Example 30 100 40 0.40 Example 31 100 80 0.80 Example 32 100 120 1.20 Example 33 100 200 2.00
- a silver mirror reaction was performed using the silver carboxylic acid salt and the complexing agent mixed in the same ratio as in Example 1.
- Examples 27 and 28 having a low content of the complexing agent it was confirmed that there was a solubility problem and the silver mirror reaction was hardly performed.
- Examples 29 to 32 it was confirmed that the silver mirror reaction was normally performed. However, it was confirmed that the best silver mirror was formed in Example 30.
- Example 33 using an excessive amount of the complexing agent, the storage stability of the complex solution of the complexing agent and silver carboxylate was poor, and it was difficult to obtain a clean silver mirror.
- Silver binding agent (g) reducing agent (g) weight ratio Example 34 100 5 0.05 Example 35 100 10 0.10 Example 36 50 20 0.40 Example 37 50 50 1.00 Example 38 40 80 2.00 Example 39 20 100 5.00 Example 40 20 120 6.00
- a silver mirror reaction was performed by injecting the silver complex solution and the reducing agent solution mixed in the above ratio into a container.
- the desired silver mirror reaction was normally performed, but it was confirmed that the silver mirror reaction was rapidly performed as the content of the reducing agent increased.
- the time for performing the silver mirror reaction was long (about 50 to 80 minutes), making it difficult to use industrially, and in Example 40 using an excessive reducing agent, silver precipitation occurred At the same time, the silver content was relatively reduced, resulting in the formation of a semi-transparent silver mirror with weak mirror characteristics.
- the silver ammonia complex solution of neodecanoate prepared in Preparation Example 1 was diluted with a mixed solution having a weight ratio of 4:1 of ethanol and water to obtain a final silver content of 1.0%.
- An electroless silver plating solution was prepared by dissolving 0.5% ammonium formate therein.
- the reducing agent solution was prepared by adding 3.0 grams of hydroquinone to a solution of 100 grams of glycerin and 400 grams of water.
- a nylon fabric was first put into the silver plating solution and sufficiently wetted for 1 hour, and then a reducing agent solution was added thereto in a weight ratio of 1:1 to the silver plating solution and reacted while stirring for 3 hours. After the reaction was completed, it was filtered, washed sequentially with water and ethanol, and dried at 120° C. for 12 hours to prepare a silver-coated nylon fabric having excellent conductivity (see FIG. 4).
- Example 41 As a result of the experiment in the same manner as in Example 41, except that nylon fibers were used instead of nylon fabrics, silver-coated nylon fibers having excellent conductivity were prepared. A photograph of the prepared sample and a drawing showing the conductivity are shown in FIG. 5, and an electron microscope (SEM) photograph of the fiber surface is shown in FIG. 6.
- SEM electron microscope
- Example 41 As a result of the experiment in the same manner as in Example 41, except that a 25 micron polyimide film was used instead of the nylon fabric, a silver-coated mirror-image polyimide film was prepared. A photograph of the prepared sample is shown in FIG. 7, the measured reflectance was 97.5% @ 550 nm, and the sheet resistance value was 120 m ⁇ / ⁇ .
- Example 43 As a result of the experiment in the same manner as in Example 43, except that a 12 micron nylon film was used instead of the 25 micron polyimide film, a mirror image nylon film coated with silver was prepared. The measured sheet resistance value was 130 m ⁇ / ⁇ .
- the silver ammonia neodecanoate solution prepared in Preparation Example 1 was diluted with a mixed solution of ethanol and water in a weight ratio of 1:1 to prepare an electroless silver plating solution so that the final silver content was 0.5%.
- the solution of Preparation Example 12 was used as the reducing agent solution.
- Polyurethane foam was first put into the silver plating solution and sufficiently wetted for 1 hour, and then a reducing agent solution was added thereto in a weight ratio of 1:1 to the silver plating solution and reacted with stirring for 2 hours. After the reaction was completed, it was taken out, washed sequentially with water and ethanol, and dried at 120 ° C for 30 minutes, resulting in silver-coated polyurethane foam.
- As a result of measuring the surface resistance it was 0.3 ⁇ /cm, and pictures of the silver-coated sample and surface electron microscope (SEM) pictures are shown in FIGS. 8 and 9, respectively.
- Silica beads having an average particle diameter of 12 ⁇ m surface-treated with 3-aminotriethoxysilane were added to the silver complex solution prepared in Preparation Example 3, sufficiently moistened with stirring, filtered, washed with ethanol, and dried.
- the pretreated silica beads were added to a silver electroless plating solution in which the silver complex solution prepared in Preparation Example 4 and the reducing agent solution prepared in Preparation Example 9 were prepared in a weight ratio of 1:1, and reacted with stirring for 1 hour. After the reaction was completed, the mixture was filtered, washed sequentially with water and ethanol, and dried at 100° C. for 24 hours to obtain silver-coated silica beads.
- Silver-coated copper particles were prepared as a result of the experiment in the same manner as in Example 46, except that copper particles having an average particle diameter of 4 ⁇ m were used instead of silica beads having an average particle diameter of 12 ⁇ m.
- a silver complex solution having a concentration of 0.5% silver prepared in Preparation Example 3 was put into a polypropylene plating bath, and a silver plate was used as an anode and a copper foil having a smooth surface was used as a cathode.
- electricity was applied by connecting 4.5 volts to which three 1.5 volt batteries were connected, and electroplating was performed for 1 minute and 30 seconds. After completion of the plating, it was washed well with water and ethanol and sufficiently dried at 80°C to obtain a copper product plated with bright mirror-like silver on the copper surface.
- Example 48 Experiments were conducted in the same manner as in Example 48, except that a silver-coated PET film having a resistance of 1,5 ⁇ /cm was used instead of using a copper foil as the cathode. As a result of measuring the surface resistance after electroplating, a sample with improved conductivity of 0.4 ⁇ /cm was obtained.
- the silver complex solution prepared in Preparation Example 3 having a concentration of 0.5% was diluted with ethanol to finally prepare a solution having a silver concentration of 50 ppm.
- polyester microfiber cotton which is used as a heat-retaining material for blankets and pillows, was put into the silver solution to the extent that it was submerged, and it was sufficiently stirred and soaked.
- the reducing agent solution prepared in Preparation Example 6 was diluted with ethanol, and the polyester microfiber cotton was added to the hydroquinone solution having a final silver concentration of 60 ppm and reacted with stirring for 1 hour. After the reaction was finished, it was filtered, washed sequentially with water and ethanol, and dried at 80° C. for 6 hours to obtain silver-treated polyester microfibers. As a result of testing the antibacterial properties of this microfiber, it showed 99.9% of antibacterial activity against E. coli.
- Example 50 of the present invention Silver plating was performed on the surface of the copper-plated substrate using Example 50 of the present invention and Comparative Example 3 and Comparative Example 4.
- the copper-plated substrate was put into a container, and then the same silver complex solution as in Example 50 was supplied, and after the plating reaction was completed, the surface was etched to remove the silver plating formed in a region other than the copper plating did
- Example 1 of the present invention the same silver plating as the commercially available and used comparative example could be performed, and silver plating on the copper plating could be performed only by performing etching to remove excess silver. .
- the thickness of silver on copper is thicker than the thickness of silver on insulator, although it is etched with the same thickness by applying the increase in the amount of silver deposited on the copper surface in the same way as the conventional plating method.
- Comparative Examples 3 and 4 it was confirmed that the same silver plating was performed. That is, in the case of the present invention, it was confirmed that it can be used in the existing product production process only by slightly modifying the process.
- Example 1 Comparative Example 3, and Comparative Example 4 were used in the same manner as in Experimental Example 1, and it was confirmed whether or not the surface of the polymer resin was plated.
- a square bar having a size of 1 cm X 1 cm X 3 cm was installed inside the plating vessel. At this time, the material of the square bar was prepared as shown in Table 4 below.
- Example 1 The plating solutions of Example 1, Comparative Example 3, and Comparative Example 4 were added to each container, and then the plating container was shaken and stirred. After 20 minutes, the square bar was taken out to check plating.
- Example 1 polycarbonate O polyethylene O polypropylene O copper O aluminum O Comparative Example 3 polycarbonate X polyethylene X polypropylene X copper O aluminum O Comparative Example 4 polycarbonate X polyethylene X polypropylene X copper O aluminum O
- Example 1 of the present invention it was confirmed that not only the metal material but also the metal surface of the polymer resin material was uniformly plated. However, in Comparative Examples 3 and 4, it was confirmed that silver was plated only on the surface of the metal, and it was confirmed that silver plating was not performed on the surface of the polymer resin.
- FIG. 11 shows a solution state after storage for 6 months at room temperature as a silver complex solution prepared in Preparation Example 2.
- Figure 12 shows the solution state after storage for 6 months at room temperature as a reducing agent solution prepared in Preparation Example 8.
- Example 1 Silver nitrate concentration (M) Example 1 ⁇ 0.001 Example 2 ⁇ 0.001 Example 3 ⁇ 0.001 Example 4 ⁇ 0.001 Example 5 ⁇ 0.001 Comparative Example 3 0.7 Comparative Example 4 0.9 Comparative Example 5 4.5
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Abstract
Description
| 착체용액(g) | 에탄올(g) | 최종 은 함량(%) | |
| 실시예 13 | 2 | 3528 | 0.01 |
| 실시예 14 | 10 | 3520 | 0.05 |
| 실시예 15 | 20 | 3510 | 0.1 |
| 실시예 16 | 10 | 280 | 0.5 |
| 실시예 17 | 20 | 270 | 1 |
| 실시예 18 | 10 | 28 | 5 |
| 실시예 19 | 75 | 35 | 7.5 |
| 카르복실산 은 | 은거울 반응 여부 | |
| 실시예 21 | 프로피온산 은 | O |
| 실시예 22 | 2-에틸헥사논산 은 | O |
| 실시예 23 | 말론산 은 | △ |
| 실시예 24 | 락트산은 | △ |
| 실시예 25 | 올레산 은 | △ |
| 실시예 26 | 질산 은 | △ |
| 카르복실산 은(g) | 암모니아 수용액(g) | 중량비 | |
| 실시예 27 | 100 | 1 | 0.01 |
| 실시예 28 | 100 | 4 | 0.04 |
| 실시예 29 | 100 | 20 | 0.20 |
| 실시예 30 | 100 | 40 | 0.40 |
| 실시예 31 | 100 | 80 | 0.80 |
| 실시예 32 | 100 | 120 | 1.20 |
| 실시예 33 | 100 | 200 | 2.00 |
| 은착제(g) | 환원제(g) | 중량비 | |
| 실시예 34 | 100 | 5 | 0.05 |
| 실시예 35 | 100 | 10 | 0.10 |
| 실시예 36 | 50 | 20 | 0.40 |
| 실시예 37 | 50 | 50 | 1.00 |
| 실시예 38 | 40 | 80 | 2.00 |
| 실시예 39 | 20 | 100 | 5.00 |
| 실시예 40 | 20 | 120 | 6.00 |
| 사각바 재질 | 도금여부 | |
| 실시예 1 | 폴리카보네이트 | O |
| 폴리에틸렌 | O | |
| 폴리프로필렌 | O | |
| 구리 | O | |
| 알루미늄 | O | |
| 비교실시예 3 | 폴리카보네이트 | X |
| 폴리에틸렌 | X | |
| 폴리프로필렌 | X | |
| 구리 | O | |
| 알루미늄 | O | |
| 비교실시예 4 | 폴리카보네이트 | X |
| 폴리에틸렌 | X | |
| 폴리프로필렌 | X | |
| 구리 | O | |
| 알루미늄 | O |
| 질산은 농도(M) | |
| 실시예 1 | <0.001 |
| 실시예 2 | <0.001 |
| 실시예 3 | <0.001 |
| 실시예 4 | <0.001 |
| 실시예 5 | <0.001 |
| 비교실시예 3 | 0.7 |
| 비교실시예 4 | 0.9 |
| 비교실시예 5 | 4.5 |
Claims (17)
- 은도금 착체 용액 및 환원제 용액을 포함하는 무전해 은도금을 위한 은도금액에 있어서,상기 은도금 착체 용액은, 하기 일반식 1의 카르복실산 은염을 포함하는 용액이고,상기 은도금 착체 용액 및 상기 환원제 용액 간의 은거울 반응에 의한 무전해 은도금이 가능한 은도금액:[일반식 1]R1-COOAg상기 식에서, R1은 수소, 치환 또는 비치환된 C1-C22의 알킬기, 치환 또는 비치환된 C3-C30 시클로알킬기, 치환 또는 비치환된 C6-C30 아르알킬(aralkyl), 치환 또는 비치환된 C1-C30 헤테로알킬기, 치환 또는 비치환된 C2-C30 헤테로시클로알킬기, 또는 치환 또는 비치환된 C5-C30 헤테로아르알킬기이다.
- 청구항 1에 있어서,상기 은도금 착체 용액은 질소원자 함유 화합물 형태의 착화제; 및 용매를 더 포함하는 은도금액
- 청구항 2에 있어서,상기 질소원자 함유 화합물은 암모니아, 아민, 4차 암모늄 염(quaternary ammomium salts) 및 폴리아민으로 이루어진 군 중에서 선택된 1종 이상인 것인 은도금액.
- 청구항 3에 있어서,상기 아민 또는 4차 암모늄 염은 각각 하기 [일반식 2] 및 [일반식 3]으로 표현되는 것인 은도금액:[일반식 2](R2R3R4)N[일반식 3](R5R6R7R8)N+X상기 식에서, R2 내지 R8은 서로 동일하거나 상이할 수 있으며, 각각 수소 또는 치환 또는 비치환된 C1-C20의 알킬기, 치환 또는 비치환된 C6-C30 아릴기, 치환 또는 비치환된 C3-C30 시클로알킬기, 치환 또는 비치환된 C6-C30 아르알킬(aralkyl), 치환 또는 비치환된 C1-C30 헤테로알킬기, 치환 또는 비치환된 C2-C30 헤테로시클로알킬기, 치환 또는 비치환된 C5-C30 헤테로아릴기, 치환 또는 비치환된 C5-C30 헤테로아르알킬기이고,X는 F-, Cl-, Br-, I-, OH-, 하이드로전 설페이트, 바이카르보네이트, 카바메이트 또는 퍼클로레이트이다.
- 청구항 2에 있어서,상기 질소원자 함유 화합물은 암모니아 또는 알킬아민인 것인 은도금액.
- 청구항 2에 있어서,상기 용매는 물, 에탄올, 에틸렌글리콜, 글리세린 또는 이들의 혼합용매인 은도금액.
- 청구항 2에 있어서,상기 착화제의 함량이 상기 카르복실산 은염 대비 몰비로 0.1~10.0인 것인 은도금액.
- 청구항 2에 있어서,상기 질소원자 함유 화합물 형태의 착화제는 상기 카르복실산 은염의 은이온과 결합하여 착이온을 형성하는 것인 은도금액.
- 청구항 1에 있어서,상기 환원제 용액은,글루코스, 하이드라진, 하이드로퀴논 및 그 유도체로 이루어진 군으로부터 선택되는 1종 이상의 환원제; 및 용매를 포함하는 용액인 은도금액.
- 청구항 9에 있어서,상기 용매는 물, 에탄올, 에틸렌글리콜, 글리세린 또는 이들의 혼합용매인 은도금액.
- 청구항 10에 있어서,상기 용매 중 물의 함량이 중량비로 1~80%인 것인 은도금액.
- 청구항 9에 있어서,상기 환원제 용액은 암모늄 염을 포함하는 첨가제가 더 포함된 것인 은도금액.
- 청구항 12에 있어서,상기 암모늄 염이 최종 도금액 대비 중량비로 0.01~10.0% 포함된 것인 은도금액.
- 청구항 1에 있어서,상기 카르복실산 은염은 알칸산 은인 것인 은도금액.
- 청구항 1에 있어서,은의 함량이 최종 도금액 대비 중량비로 0.05~5.0%인 것인 은도금액.
- 청구항 1에 있어서,상기 환원제의 함량이 상기 카르복실산 은염 대비 몰비로 0.1~5.0인 것인 은도금액.
- 청구항 1 내지 16 중 어느 한 항에 따른 은도금액을 5~50℃에서 반응시켜 얻은 은도금 제품.
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| JP2024547398A JP7769429B2 (ja) | 2021-11-19 | 2022-11-21 | 銀めっき液 |
| US18/693,141 US20250043429A1 (en) | 2021-11-19 | 2022-11-21 | Silver plating solution |
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| WO2017057188A1 (ja) * | 2015-09-29 | 2017-04-06 | トッパン・フォームズ株式会社 | 銀インク組成物、その製造方法及び積層体 |
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- 2022-11-21 CN CN202280071886.1A patent/CN118159687A/zh active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117802484A (zh) * | 2023-10-26 | 2024-04-02 | 深圳创智芯联科技股份有限公司 | 一种无氰化学还原加厚金的工艺配方及化学镀方法 |
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| US20250043429A1 (en) | 2025-02-06 |
| CN118159687A (zh) | 2024-06-07 |
| JP2024538434A (ja) | 2024-10-18 |
| EP4379092A4 (en) | 2025-10-22 |
| KR102476608B1 (ko) | 2022-12-13 |
| JP7769429B2 (ja) | 2025-11-13 |
| EP4379092A1 (en) | 2024-06-05 |
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